JP2014066870A - Pattern formation method and apparatus, exposure apparatus, and method for manufacturing panel for display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure, on an occasion for exposing a new pattern on a base pattern formed on a substrate, the positional deviation magnitude of the base pattern in high precision within a specified period.SOLUTION: The shape of a base pattern on a substrate 1 is detected from the rear surface of the substrate by using large numbers of line sensors configured on the surface of a chuck, and drawing data scheduled to be fed into the drive circuit of an optical beam irradiator 20 are prepared based on the detected shape of the base pattern. After the substrate 1 has been loaded onto a chuck 10, the chuck 10 and an optical beam irradiator 20 equipped with a spatial optical modulator for modulating optical beams, a drive circuit for driving the spatial optical modulator on the basis of the drawing data, and an irradiation optical system for irradiating optical beams modulated by the spatial optical modulator are relatively mobilized so as to scan the substrate 1 with optical beams emitted from the optical beam irradiator 20 and to draw, on the substrate 1, a new pattern corresponding to the base pattern.

Description

  The present invention irradiates a light beam to a substrate coated with a resin material that causes a chemical reaction such as polymerization or curing by light of a specific wavelength, scans the substrate with the light beam, and forms a predetermined pattern on the substrate. A pattern forming method and apparatus, an exposure apparatus, and a display panel manufacturing method for drawing an image, and more particularly, a pattern forming method and apparatus and an exposure apparatus suitable for drawing a new pattern on a base pattern formed on a base material The present invention also relates to a display panel manufacturing method.

An exposure apparatus is used to manufacture TFT (Thin Film Transistor) base materials, color filter base materials, plasma display panel base materials, organic EL (Electroluminescence) display panel base materials and the like used in display panels. Then, a pattern is drawn and formed on a substrate by a photolithography technique. As an exposure apparatus, conventionally, a projection method or a scanning method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a fine gap (proximity gap) is provided between the mask and the substrate. There was a proximity method to transfer the pattern to the substrate.
In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be handled. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A JP 2011-082370 A

  In recent years, in the manufacture of various base materials for display panels, a relatively large base material has been prepared in order to cope with an increase in size and diversification of sizes. Manufactures display panel substrates. In the proximity method, which is mainly used for exposure of large base materials, if one side of the base material is to be exposed all at once, a mask having the same size as the base material is required, which further increases the cost of expensive masks. . Therefore, a method in which a mask that is relatively smaller than the base material is used, the base material is moved stepwise in the XY directions, and one surface of the base material is divided into a plurality of shots for exposure. When exposing one side of a substrate in multiple shots, the relative position and rotation between the mask and the substrate, and the proximity gap between the mask and the substrate should be exactly the same for each shot. It is difficult, and the position, rotation, or size of the pattern transferred to the substrate slightly changes from shot to shot.

  In the method of drawing a pattern directly on the base material, the base material and the light beam are moved relative to each other to scan the base material with the light beam. At that time, a light beam irradiation apparatus including a precise optical system is used. In general, the chuck for mounting the substrate is moved by a stage. A pattern drawn by a light beam from a light beam irradiation device when a movement error such as rolling or yawing occurs on the stage when the chuck is moved by the stage and the movement path of the substrate mounted on the chuck is shifted. Is out of position. The amount of pattern misregistration due to this stage running error varies depending on the location within the substrate.

  In this way, when a new pattern is exposed on the base pattern formed on the base material by exposure using the proximity method or a method of directly drawing the pattern on the base material, the amount of misalignment of the base pattern is within the base material. Therefore, the positional relationship between the base pattern and the newly exposed pattern changes depending on the location within the substrate. Therefore, for example, in the production of a color filter substrate of a liquid crystal display device, when a colored pattern is exposed on a black matrix formed on the substrate, the colored pattern may vary from the position of each pixel depending on the location within the substrate. There was a problem of shifting.

  In order to solve such a problem, the applicant has proposed an exposure apparatus of Patent Document 4. In the exposure apparatus described in Patent Document 1, about four detection devices such as a CCD camera are arranged above the chuck on which the base material is mounted, and these are moved over the base material and drawn on the base material. A ground pattern is detected and distortion of the shape is measured. However, according to this method, a movement error of about several μm occurs due to the movement of the detection device, and it is difficult to overcome the problem of detecting the distortion of the base pattern with high accuracy within a predetermined tact time. It was. On the other hand, if it is intended to measure the distortion of the ground pattern with high accuracy, the detection device must be moved to a large number of locations on the ground pattern, and the tact time is determined by the repeated movement-measurement-movement operation in which measurement is performed after the movement. Tended to increase.

  An object of the present invention is to measure a positional deviation amount of a base pattern with high accuracy within a predetermined time when a new pattern is exposed on a base pattern formed on a substrate. Another object of the present invention is to produce a high-quality display panel substrate.

  The manufacturing method of the display panel base material of the present invention involves exposing the base material using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, a new pattern is exposed in accordance with the base pattern over the entire base material, so that a high-quality display panel base material is manufactured.

  According to the method for manufacturing a display panel base material of the present invention, a new pattern can be exposed to the base pattern over the entire base material, so that a high-quality display panel base material can be manufactured. it can.

It is a figure which shows schematic structure of the exposure apparatus which concerns on one embodiment of this invention. It is a side view of the exposure apparatus shown in FIG. It is a front view of the exposure apparatus shown in FIG. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of the laser length measurement system provided in the exposure apparatus of FIG. It is a figure which shows typically the mode of the position shift of the base pattern of a board | substrate, and a base pattern. It is a figure which shows the example of arrangement | positioning of the line sensor group which comprises the base pattern deviation measurement system embedded in the chuck | zipper. FIG. 8 is a diagram showing a relationship between the line sensor group constituting the background pattern deviation measurement system of FIG. 7 and the background pattern of FIG. 6. It is an enlarged view which shows the relationship between the line sensor in FIG. 8, and a base pattern. It is a figure which shows schematic structure of the drawing control part which comprises the main-control apparatus of FIG.1, FIG4 and FIG.5. It is the 1st figure explaining scanning of a substrate by a light beam. It is a 2nd figure explaining the scanning of the board | substrate by a light beam. It is a 3rd figure explaining the scanning of the board | substrate by a light beam. It is a 4th figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this embodiment, an exposure apparatus will be described as an example of the pattern forming apparatus. FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus shown in FIG. 1, and FIG. 3 is a front view of the exposure apparatus shown in FIG. This embodiment shows an example of an exposure apparatus that exposes a new pattern on a base pattern formed on a substrate by exposure in the previous process. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a base pattern deviation measuring device 9, a chuck 10, a gate 11, a light beam irradiation device 20, a linear scale 31, 33, encoders 32 and 34, laser length measurement system control device 40, stage drive circuit 60, and main control device 70. 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot, a temperature control unit that performs temperature management in the apparatus, and the like. The XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  As shown in FIGS. 1 to 3, the chuck 10 is at a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. An ultraviolet curable resin such as a photoresist is applied to the surface of the substrate 1. A plurality of line sensor groups constituting a base pattern deviation measurement system are embedded in the surface of the chuck 10. In FIG. 1, the points shown in a matrix on the surface of the chuck 10 are line sensors. These line sensors are regularly embedded in a matrix on the surface of the chuck 10, and output a light / dark signal corresponding to the shape of the ground pattern previously drawn on the substrate 1. In FIG. 1, detection signals (brightness / darkness signals) of a number of line sensors embedded in the chuck are taken into the base pattern deviation measuring device 9. The background pattern deviation measuring device 9 differentiates the light and dark based on the detection signal from the line sensor to produce a contrast difference. As a result, the base pattern deviation measuring device 9 can recognize the shape and position of the base pattern, and compares the base pattern position deviation and distortion, etc. calculate. Since the base pattern deviation measuring device 9 has a large number of line sensor groups mounted on the surface of the chuck 10, not only information on simple size expansion and reduction of the base pattern but also the base pattern on the plane of the chuck 10. Can be calculated with high accuracy. The calculated ground pattern distortion information is reported to the main controller 70 by communication. The main controller 70 corrects / corrects drawing data to be supplied to the DMD driving circuit 27 of the light beam irradiation device 20 based on the reported ground pattern distortion information. Details of the base pattern deviation measurement system will be described later.

  A gate 11 is provided above the exposure position where the substrate 1 is exposed so as to straddle the base 3. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although this embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and the present invention is one or two or more. The present invention is applied to an exposure apparatus using a light beam irradiation apparatus.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated on the surface of the substrate 1 by the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  As shown in FIGS. 1 to 3, the chuck 10 is mounted on the upper side of the θ stage 8. An X stage 5 and a Y stage 7 are provided below the θ stage 8. The X stage 5 is mounted on four X guides 4 provided on the upper surface of the base 3, and moves in the X direction along the X guides 4. The Y stage 7 is mounted on two Y guides 6 provided on the upper surface of the X stage 5, and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and controls the rotation of the chuck 10 in the θ direction. The X stage 5, Y stage 7 and θ stage 8 are each provided with a drive mechanism (not shown) such as a ball screw, a motor, and a linear motor, and each drive mechanism is driven and controlled by the stage drive circuit 60 of FIG. Has been.

  When the θ stage 8 rotates the chuck 10 in the θ direction, the substrate 1 mounted on the chuck 10 is controlled to rotate so that two orthogonal sides coincide with each other in the X direction and the Y direction. The X stage 5 moves in the X direction to move the chuck 10 between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the surface of the substrate 1 in the X direction. Further, when the Y stage 7 moves in the Y direction, the operation region in the X direction of the light beam emitted from the head unit 20a of each light beam irradiation apparatus 20 moves in the Y direction. As shown in FIG. 1, the main controller 70 outputs a control signal to the stage drive circuit 60 and controls the stage drive circuit 60, whereby the rotation amount and rotation position of the θ stage 8 in the θ direction, the X stage 5. The movement amount and movement position in the X direction and the movement amount and movement position of the Y stage 7 in the Y direction are controlled.

  In this embodiment, the chuck 10 moves in the X direction together with the X stage 5 to scan the substrate 1 using the light beam from the light beam irradiation device 20, but the light beam irradiation device. By moving 20, the substrate 1 may be scanned using the light beam from the light beam irradiation device 20. Further, both the chuck 10 and the light beam irradiation device 20 may be moved in the X direction. Similarly, the chuck 10 moves in the Y direction together with the Y stage 7 so that the scanning region of the substrate 1 using the light beam from the light beam irradiation device 20 is changed. The scanning region of the substrate 1 may be changed by using the light beam from the light beam irradiation device 20 by moving. In this case as well, both the chuck 10 and the light beam irradiation device 20 may be moved in the Y direction.

  As shown in FIGS. 1 to 3, a linear scale 31 extending in the X direction is installed on the side edge of the base 3. The linear scale 31 includes a scale for the encoder 32 for detecting the amount of movement of the X stage 5 in the X direction. A linear scale 33 extending in the Y direction is installed on the side edge of the X stage 5. The linear scale 33 includes a scale for the encoder 34 for detecting the amount of movement of the Y stage 7 in the Y direction.

  As shown in FIGS. 1 to 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the scale of the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs the detected pulse signal to the main controller 70. An encoder 34 is attached to one side surface of the Y stage 7 so as to face the scale of the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs the detected pulse signal to the main controller 70. The main controller 70 counts the pulse signals from the encoders 32 and 34, detects the movement amounts of the X stage 5 in the X direction and the Y stage 7 in the Y direction, and specifies the positions thereof.

  FIG. 5 is a view for explaining the operation of the laser length measurement system provided in the exposure apparatus of FIG. In FIG. 5, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 5, only devices necessary for explaining the operation of the laser length measurement system are shown, and the gate 11 and the light beam irradiation apparatus 20 in FIG. 1 are omitted. The laser length measurement system is configured by a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 receives the laser light emitted from the laser light source 41 and introduced by the half mirror 46 and the mirror 47. The laser interferometer 42 irradiates the received laser light to the bar mirror 43 and receives the laser light reflected by the bar mirror 43. The laser interferometer 42 measures the interference between the laser light from the laser light source 41 and the laser light reflected by the bar mirror 43 at two locations in the Y direction. The laser interferometer 42 detects the rotation of the chuck 10 by measuring interference at two locations in the Y direction. The laser length measurement system control device 40 takes in the measurement result of the laser interferometer 42 under the control of the main control device 70 and detects the position and rotation of the chuck 10 in the X direction.

  The laser interferometer 44 receives the laser light emitted from the laser light source 41 and introduced by the half mirror 46 and the mirror 48. The laser interferometer 44 irradiates the bar mirror 45 with the received laser light and receives the laser light reflected by the bar mirror 45. The laser interferometer 44 measures the interference between the laser light from the laser light source 41 and the laser light reflected by the bar mirror 45. The laser length measurement system control device 40 receives the measurement result of the laser interferometer 44 under the control of the main control device 70 and detects the position of the chuck 10 in the Y direction. The rotation of the chuck 10 may be detected by measuring interference at two locations in the X direction with the laser interferometer 44. Further, the rotation of the chuck 10 may be detected by both the laser interferometers 42 and 44.

  FIG. 6 is a diagram schematically showing the base pattern of the substrate and how the base pattern is displaced. FIG. 6 shows an example of manufacturing 12 display panel substrates from the substrate 1. Global alignment marks GAM for detecting the position and rotation of the substrate 1 are provided at the four corners of the surface of the substrate 1. In addition, four base patterns 2a to 2d are formed on the surface of the substrate 1 by four shots. Since exposure was performed by dividing into four shots, the positions, rotations, and sizes of the underlying patterns 2a to 2d are each distorted and displaced. In addition, each of the base patterns 2a to 2d includes three display panel base patterns 1a to 1c, respectively, and the size and shape of the display panel base patterns 1a to 1c in each of the base patterns 2a to 2d. However, there are distortions and deviations. In FIG. 6, the positional deviation and distortion of the ground pattern are exaggerated and displayed, but the actual deviation amount is very small.

  FIG. 7 is a diagram showing an arrangement example of the line sensor group constituting the base pattern deviation measurement system embedded in the chuck. 7A is a view of the chuck 10 as viewed from above, and FIG. 7B is a cross-sectional view of the line sensor group of FIG. As shown in FIG. 7A, 120 groups of line sensors 15 are embedded in the chuck 10 in a matrix of 8 rows in the vertical direction (X direction) and 15 columns in the horizontal direction (Y direction). ing. An alternate long and short dash line 16 drawn from the upper end of the line sensor 15 in the first row and the first column (upper left end) toward the right direction (Y direction) is a line parallel to the Y direction. A one-dot chain line 17 drawn downward (−X direction) from the left end of the line sensor 15 in the first row and the first column (the uppermost left end) is a line parallel to the X direction. The positional relationship with the line sensors 15 adjacent to these alternate long and short dash lines 16 and 17 is as follows. A dotted line 18 and an alternate long and short dash line 16 connecting the upper ends of the line sensors 15 arranged in the Y direction on the first row are inclined by a minute angle. The dotted line 19 and the alternate long and short dash line 17 connecting the left ends of the group of line sensors 15 arranged in the X direction of the first column are also inclined by the same minute angle. That is, the row direction and the column direction of the 120 line sensor 15 groups arranged in a matrix of 8 rows and 15 columns are respectively predetermined with respect to the moving direction of the stage means (Y direction) and the X direction orthogonal thereto. It is arranged to incline at an angle of. As a result, even if the position, rotation, and size of the base pattern are deviated, the degree of deviation can be accurately measured. Note that the number of arrays and the array pattern of the group of line sensors 15 shown in the embodiment are merely examples, and the number of arrays may be more or less than this, and the array pattern may be appropriately changed according to the number of arrays. May be. Further, in this embodiment, the case where the line sensor 15 group is inclined by a minute angle is shown, but it may not be inclined.

  FIG. 8 is a diagram showing the relationship between the line sensor group constituting the background pattern deviation measurement system of FIG. 7 and the background pattern of FIG. As shown in FIG. 8, the base patterns 1a to 1c in the base patterns 2a to 2d correspond to twelve display panel substrates. Usually, it is possible to measure a shift or distortion of a base pattern by measuring at least four locations on one display panel substrate. In this embodiment, 8 to 10 positions can be measured for one display panel substrate.

  FIG. 9 is an enlarged view showing the relationship between the line sensor and the base pattern in FIG. As shown in FIG. 9A, each line sensor 15 is composed of a line sensor having a three-row configuration, and detects light and dark corresponding to the shape of the base pattern in one central row. The longitudinal direction of each line sensor 15 is embedded in a circular hole 151 provided on the surface of the chuck 10 serving as a substrate holding means so as to be inclined by about 45 degrees with respect to the Y direction and the X direction. . As shown in FIG. 9A, the length of the line sensor 15 corresponds to the diameter of the circular hole 151. The length of the line sensor 15 is set sufficiently larger than the opening 155 corresponding to the pixel formed by the base pattern. FIG. 9B is a diagram illustrating an example of the configuration when the line sensor 15 is viewed from a diagonally lower left direction inclined about 45 degrees. As shown in FIG. 9B, the length of the line sensor 15 in the longitudinal direction is the same as that of the circular hole 151. Among them, the line sensor 15 can be used as a detection signal in the X direction of the base pattern. It is a length L obtained by multiplying the length by cos (π / 2). FIG. 9C is a diagram illustrating an example of a detection signal corresponding to the effective length L of the line sensor 15. As shown in FIG. 9C, the portion where the base pattern exists (black matrix portion) becomes a dark signal, and the portion where the base pattern does not exist (pixel portion and coloring pattern portion) becomes a bright signal. The longest of the bright signals corresponds to the length e in the X direction of the opening 155 corresponding to the pixel of the base pattern. By detecting the position of the opening 155 corresponding to the pixel corresponding to the length e, it is possible to detect the degree of displacement and distortion of the base pattern with high accuracy. In FIG. 1, the background pattern deviation measuring device 9 outputs a signal indicating the degree of the background pattern deviation and distortion to the main controller 70 based on the detection signals from the group of line sensors 15. As a result, the exposure apparatus according to this embodiment can accurately detect the deviation or distortion of the base pattern over the entire substrate 1. The line sensor 15 preferably has about 4000 pixels and has a detection accuracy of 256 gradations / pixel.

  In this embodiment, the case where the line sensor 15 is inclined by about 45 degrees has been described. However, by appropriately changing the inclination angle according to the shape of the opening 155 corresponding to the pixel, the vertical direction of the opening 155 and It becomes possible to detect the width in the horizontal direction with high accuracy. For example, the width in the vertical direction and the horizontal direction can be detected by inclining the line sensor 15 by an amount corresponding to the diagonal line of the opening 155. Further, by setting a plurality of inclination angles and regularly assigning them to the group of line sensors 15, it becomes possible to cope with any shape of opening. For example, the inclination angle in the X direction of the line sensor 15 group of the first column, the fourth column row, the seventh column, the tenth column, and the thirteenth column is 30 °, the second column, the fifth column, the eighth column, The inclination angle in the X direction of the line sensor 15 group in the 11th row and the 14th row is 45 °, and the inclination in the X direction of the line sensor 15 group in the third row, the sixth row, the ninth row, the twelfth row, and the 15th row. You may arrange an angle like 60 degrees. Further, for example, the longitudinal direction of the line sensor 15 may be arranged in an odd number row so that the longitudinal direction of the line sensor 15 is along the X direction, and the line sensor 15 may be arranged alternately in a checkered pattern so as to be an even number row. .

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 10 is a diagram showing a schematic configuration of a drawing control unit that constitutes the main control device of FIGS. 1, 4, and 5. The drawing control unit 71 includes a drawing data memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, a design value map memory 76, and a drawing data creation unit 77. .

  The design value map is stored in the design value map memory 76. In this design value map, the drawing data is indicated by XY coordinates when the position, rotation, and size of the base pattern in the substrate 1 are the same as the design value. The drawing data creating unit 77 draws design value map drawing data stored in the design value map memory 76 in accordance with the position, rotation, and size of the base pattern in the substrate 1 detected by the base pattern deviation measuring device 9. XY coordinates are converted, and drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 is created. The drawing data memory 72 stores the drawing data created by the drawing data creation unit 77 using the XY coordinates as addresses. The drawing data memory 72 is provided with an area for storing drawing data for the substrate 1 mounted on the chuck 10.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20a of the light beam irradiation apparatus 20 by determining the range of the Y coordinate of the drawing data read from the drawing data memory 72. To do.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the XY direction before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 10, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34 to detect the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction. The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 corrected by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  The degree of deviation or distortion of the underlying pattern on the substrate 1 is detected over the entire substrate 1, and the DMD drive of each light beam irradiation device 20 is performed according to the detected degree of deviation or distortion of the underlying pattern on the substrate 1. Since drawing data to be supplied to the circuit 27 is created, a new pattern is exposed over the entire substrate 1 in accordance with the underlying pattern even if the degree of positional deviation or distortion of the underlying pattern varies depending on the location in the substrate 1. It will be.

  11 to 14 are diagrams for explaining scanning of the substrate by the light beam. FIGS. 11 to 14 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with the eight light beams from the eight light beam irradiation devices 20. In FIG. 11 to FIG. 14, the head portion 20 a of each light beam irradiation device 20 is indicated by a broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 11 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 11 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 12 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 12 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 13 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 13 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 14 shows the fourth scan. With the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 14, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  11 to 14 show an example in which the substrate 1 is scanned four times in the X direction and the entire substrate 1 is scanned. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the degree of displacement and distortion of the base pattern on the substrate 1 is detected over the entire substrate 1 by the line sensor 15 installed in the chuck, and the substrate 1 of the detected base pattern is detected. The degree of pattern deviation and distortion is calculated by the background pattern deviation measuring device 9 according to the position on the upper side, and the drawing data to be supplied to the DMD drive circuit 27 of the light beam irradiation device 20 is created. Even if the degree of displacement or distortion varies depending on the location on the substrate 1, a new pattern can be exposed over the entire substrate 1 in accordance with the underlying pattern.

  In the embodiment described above, an example in which twelve display panel substrates are manufactured from one substrate has been shown. However, the present invention is for display of 11 or less or 13 or more substrates from one substrate. The present invention can also be applied when manufacturing a panel substrate.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, a new pattern can be exposed to match the underlying pattern over the entire substrate, and thus a high-quality display panel substrate is manufactured. be able to.

  For example, FIG. 15 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 16 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 15, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 16, in the exposure process of the colored pattern forming process (step 202), the exposure of the present invention. An apparatus or an exposure method can be applied.

  In the above-described embodiment, the TFT substrate or the color filter substrate is described as an example of the substrate to which the ultraviolet curable resin is applied, but the light beam is spatially modulated on the substrate to which the photocurable resin is applied. It is possible to apply to a device in which a predetermined pattern is drawn on a photo-curing resin by performing modulated irradiation using a container.

  In addition, in this specification, a base material is a concept including a plate shape (what is usually called a board | substrate) and a film-like thing. Resins that cause a chemical reaction such as polymerization and curing by light of a specific wavelength include ultraviolet curable resins such as photoresists, resins used for plate making such as screen printing, resins for holographic recording media, and rapid prototyping. Including the above resin.

  The pattern forming method and apparatus according to the present embodiment can be applied to a substrate (substrate, film, etc.) using a printing technique used in the field of printable electronics for creating a display circuit or an electronic component on a flexible substrate or the like by a printing (printable) technique. The present invention is applicable to the technical field of patterning a printing plate (mask) on a resinous material (including a resinous material). In addition, the light modulated according to the image data is imaged on the photosensitive layer, the photosensitive layer is exposed, and a high-definition permanent pattern (protective film) in the printed wiring substrate field or semiconductor field including the package substrate Further, the present invention can be applied to a pattern forming apparatus that efficiently forms an interlayer insulating film and a solder resist pattern. Examples of circuits created by such a printing technique include electronic paper, electronic signboards, and printable TFTs.

The pattern forming method according to this embodiment can be applied to the field of surface modification of a substrate using a resin that causes a chemical reaction such as polymerization or curing by light of a specific wavelength. Further, the present invention can also be applied to the field of forming a pattern such as a chip-like (repair) wiring of a semiconductor through-silicon via (TSV).
In addition to this, the present invention can also be applied to an apparatus for making a printing plate, a plate making apparatus for a rotary press, a stencil printing such as a lithograph or a preport or a stencil printing apparatus. For plate making equipment such as screen printing, semiconductor device repair methods and equipment, printed wiring board manufacturing equipment including package base materials, fine electrode patterns such as flat panel displays and printed base materials, or pattern making equipment for exposure masks Is also applicable.
Substrates include wafers, printed substrates, flat panel displays, masks, reticles, and the like, as well as plates used for copying magazines, newspapers and books, and those formed into films.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 10 ... Chuck 11 ... Gate 15 ... Line sensor 151 ... Hole 155 ... Opening 1a-1c ... Base pattern 20 ... Light beam irradiation apparatus 20a ... Head part 21 ... Laser light source unit 22 ... Optical fiber 23 ... Lens 24 ... Mirror 25 ... DMD (Digital Micromirror Device)
26 ... Projection lens 27 ... DMD drive circuits 2a to 2d ... Base pattern 3 ... Base 31, 33 ... Linear scale 32, 34 ... Encoder 4 ... X guide 40 ... Laser measuring system controller 41 ... Laser light source 42, 44 ... Laser Interferometers 43, 45 ... Bar mirror 46 ... Half mirror 47 ... Mirror 47 ... Line sensor 48 ... Mirror 5 ... X stage 6 ... Y guide 60 ... Stage drive circuit 7 ... Y stage 70 ... Main controller 71 ... Drawing controller 72 ... Memory 72 ... Drawing data memory 73 ... Bandwidth setting unit 74 ... Center point coordinate determining unit 75 ... Coordinate determining unit 76 ... Design value map memory 77 ... Drawing data creating unit 8 ... Theta stage 9 ... Background pattern deviation measuring device

Claims (10)

A spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data modulates the light beam, and relatively moves the stage means that holds the substrate coated with the resin film. A pattern forming method for forming a pattern based on the drawing data on the resin film of the substrate by irradiating the light beam while
The shape of the first pattern formed on the base material is detected from the back surface of the base material using a large number of line sensor means arranged on the surface of the stage means, and the detected first pattern The pattern formation method characterized by creating the drawing data regarding the 2nd pattern drawn on the said base material based on the shape of this.   2. The pattern forming method according to claim 1, wherein the line sensor unit outputs a signal based on brightness and darkness corresponding to the shape of the first pattern, and processes the signal based on the brightness and darkness on the base material. The shape of the first pattern formed on the substrate is detected, the distortion of the first pattern on the substrate is calculated based on the detection result, and the first pattern is drawn on the substrate based on the calculated distortion. A pattern forming method comprising: creating drawing data relating to a second pattern.   3. The pattern forming method according to claim 1, wherein the line sensor means is arranged so that a longitudinal direction of the line sensor means is inclined at one or a plurality of angles with respect to a moving direction of the stage means. Pattern forming method.   4. The pattern forming method according to claim 1, wherein the line sensor means are arranged in a matrix, and the row direction and the column direction of the line sensor means group arranged in the matrix form move the stage means, respectively. A pattern forming method, wherein the pattern is arranged at a predetermined angle with respect to a direction and a direction orthogonal thereto. A spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data modulates the light beam, and relatively moves the stage means that holds the substrate coated with the resin film. A pattern forming apparatus for forming a pattern based on the drawing data on the resin film of the substrate by irradiating the light beam while
Pattern deviation measuring means for measuring the shape of the first pattern formed on the base material from the back surface of the base material using a group of line sensor means arranged on the surface of the stage means,
Drawing data creating means for creating drawing data related to the second pattern drawn on the base material based on the shape of the first pattern detected by the line sensor means group. Pattern forming device.   6. The pattern forming apparatus according to claim 5, wherein the line sensor means group outputs a signal based on lightness and darkness corresponding to the shape of the first pattern, and the pattern deviation measuring means is supplied from the line sensor means group. A signal based on the output light and dark is processed to detect the shape of the first pattern formed on the base material, and the distortion of the first pattern on the base material based on the detection result And the drawing data creating means creates drawing data related to the second pattern drawn on the substrate based on the distortion measured by the pattern measuring means.   7. The pattern forming apparatus according to claim 5, wherein the line sensor means is arranged such that a longitudinal direction thereof is inclined at one or a plurality of angles with respect to a moving direction of the stage means. A pattern forming apparatus.   8. The pattern forming apparatus according to claim 5, 6 or 7, wherein the line sensor means are arranged in a matrix, and the row direction and the column direction of the group of line sensor means arranged in the matrix form respectively of the stage means. A pattern forming apparatus, which is arranged so as to be inclined at a predetermined angle with respect to a moving direction and a direction perpendicular thereto.   An exposure apparatus that performs exposure of a substrate using the pattern forming method according to any one of claims 1 to 4 or the pattern forming apparatus according to any one of claims 5 to 8.   A display panel is manufactured using the pattern forming method according to any one of claims 1 to 4 or the pattern forming apparatus according to any one of claims 5 to 8. Panel manufacturing method.

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