JP2014071349A - Method and apparatus for forming pattern, exposure apparatus, and method for manufacturing display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily check at high speed the certainty of extraction of drawing data by a DMD (digital micromirror device) with respect to a drawing position and to execute high-quality pattern drawing with a high throughput.SOLUTION: A pattern forming apparatus forms a pattern based on drawing data in a resin film of a substrate by irradiating the substrate with a light beam, while modulating the light beam by use of a spatial optical modulator that drives a plurality of mirror groups arranged in two directions on the basis of the drawing data and relatively moving stage means that holds the substrate coated with the resin film. The drawing data stored in a memory is configured to include discriminable data as a part of the drawing data for discriminating a correction value of the coordinates of the drawing data when the coordinates are corrected by a value corresponding to the resolving power for drawing in a moving direction and/or in a direction orthogonal to the moving direction of the stage means. At the time when the coordinates of the drawing data are corrected, the discriminable data is read out from a part of the drawing data in the memory and a pattern responding to the correction value is drawn.

Description

  The present invention irradiates a light beam to a substrate coated with a resin material that causes a chemical reaction such as polymerization or curing by light of a specific wavelength, scans the substrate with the light beam, and forms a predetermined pattern on the substrate. In particular, the present invention relates to a pattern forming method and apparatus, an exposure apparatus, and a display panel manufacturing method, in particular, by modulating and irradiating a light beam using a spatial light modulator in which a plurality of mirrors are arranged in two axes. The present invention relates to a pattern forming method and apparatus for drawing a predetermined pattern on a resin, an exposure apparatus, and a display panel manufacturing method.

  An exposure apparatus is used to manufacture TFT (Thin Film Transistor) base materials, color filter base materials, plasma display panel base materials, organic EL (Electroluminescence) display panel base materials and the like used in display panels. Then, a pattern is drawn and formed on a substrate by a photolithography technique. As an exposure apparatus, conventionally, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a fine gap (proximity gap) is provided between the mask and the substrate to form the mask pattern. There is a proximity method for transferring to a substrate.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be handled. Examples of such an exposure apparatus include those described in Patent Documents 1 to 3.

JP 2005-353927 A JP 2004-012899 A JP 2010-102084 A

  When a pattern is drawn on a substrate with a light beam, a spatial light modulator such as DMD (Digital Micromirror Device) is used to modulate the light beam. The DMD is configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam applied to the substrate by changing the angle of each mirror. In the DMD currently on the market, each mirror has a dimension of about 10 to 15 [μm], and a gap of about 1 [μm] is provided between adjacent mirrors. When the DMD is arranged in parallel with the scanning direction of the substrate by the light beam, the arrangement direction of each mirror (two directions orthogonal to each other) is parallel and perpendicular to the scanning direction of the substrate. Move relatively in parallel, and a pattern cannot be drawn at a location corresponding to this gap. Therefore, as described in Patent Document 1, the DMD is used by being inclined at a predetermined angle with respect to the scanning direction of the substrate by the light beam. Further, by tilting the DMD with respect to the scanning direction, it is possible to perform drawing with a resolution equal to or less than the DMD mirror size as described in Patent Document 2. Further, the scanning of the base material by the light beam is performed by relatively moving the base material and the light beam. However, in order to prevent a reduction in drawing quality due to a positional deviation of the head portion, as described in Patent Document 3 Further, based on the detection result of the positional deviation of the head portion of each light beam irradiation device, the coordinates of the drawing data supplied to the drive circuit of each light beam irradiation device are corrected, and the drawing data of the corrected coordinates are supplied to each DMD. By supplying to the drive circuit, the accuracy of pattern drawing is improved.

  Conventionally, drawing data generated based on graphic drawing data generated in advance from CAD data is stored in a memory, and is synchronized with the movement of the base material and corresponds to each DMD coordinate corrected by the detection result of the head position deviation. Data needs to be extracted. At this time, in order to confirm the certainty of the extracted data, it has been performed by confirming with the result of actual exposure or by photographing drawing data with a camera and analyzing the photographed image. However, the determination of continuous data has little difference in the drawing data itself, and it has been difficult to determine data having a resolution equal to or less than the DMD cell size.

  The present invention has been made in view of the above-described points, and enables high-speed and easy confirmation of the accuracy of DMD drawing data extraction with respect to the drawing position, and allows high-quality pattern drawing to be executed at high throughput. An object of the present invention is to provide a pattern forming method and apparatus, an exposure apparatus, and a display panel manufacturing method.

  A first feature of the pattern forming method according to the present invention is that a light beam is modulated using a spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data, and a resin film is applied. A pattern forming method of forming a pattern based on the drawing data on the resin film of the base material by irradiating the light beam while relatively moving a stage means for holding the base material, When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, the discriminable data for determining the correction value is set as the drawing data. A pattern corresponding to the correction value by reading the distinguishable data from a part of the drawing data when the coordinates of the drawing data are corrected It is to draw. This is because the discriminable data for discriminating the correction value is stored in advance as a part of the drawing data, so that the discrimination corresponding to the correction value can be made when the coordinates of the drawing data are corrected By reading the data and drawing it as a pattern, it is possible to quickly and easily confirm the certainty of DMD drawing data extraction for the drawing position, and high-quality pattern drawing can be executed with high throughput.

  A second feature of the pattern forming method according to the present invention is the pattern forming method according to the first feature, wherein the drawing data is subdivided into equal intervals based on the drawing resolution of the spatial light modulator. Read out the data corresponding to the drawing center point position of the mirror group from the layer data corresponding to the position of the base material moved by the stage means. A pattern forming method for forming the pattern by irradiating the light beam based on the above, wherein the coordinates of the drawing data correspond to the drawing resolution in the moving direction of the stage means and / or the direction orthogonal to the moving direction. When the correction value is corrected, discriminable data for determining the correction value is configured as a part of the layer data, and the drawing data There from part of the layer data at the time the coordinate is corrected to render a pattern corresponding to the correction value read out the discrimination possible data. This is because if the drawing data is composed of layer data that is subdivided at equal intervals based on the drawing resolution of the spatial light modulator, the discriminable data can be identified as part of the layer data based on the drawing resolution. By storing the configured data, when the coordinates of the drawing data are corrected by the amount corresponding to the drawing resolution, the discriminable data is read from the layer data, and the pattern irradiated and drawn by the light beam is also drawn by the drawing resolution. Therefore, it is possible to easily confirm the change in the correction amount in the moving direction and / or the vertical direction corresponding to the drawing resolution.

  A third feature of the pattern forming method according to the present invention is the pattern forming method according to the first or second feature, wherein the discriminable data is a mirror for at least three horizontal rows and five vertical columns of the mirror group. Is used to draw a character pattern corresponding to the correction value. In this case, a correction value is made visible by drawing a pattern such as numbers “0” to “9” and English letters using a mirror of horizontal 3 rows and vertical 5 columns.

  A fourth feature of the pattern forming method according to the present invention is the pattern forming method according to the first, second, or third feature, wherein the discriminable data includes the moving direction and the orthogonal direction of the stage means. It is to be configured separately corresponding to each. This is because there are two types of coordinate correction, that is, the moving direction of the stage means, that is, the scanning direction and the direction perpendicular thereto, so that distinguishable data is provided separately.

  A first feature of the pattern forming apparatus according to the present invention is that a light beam is modulated using a spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data, and a resin film is applied. A pattern forming apparatus that forms a pattern based on the drawing data on the resin film of the base material by irradiating the light beam while relatively moving a stage unit that holds the base material, When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, the discriminable data for determining the correction value is set as the drawing data. Memory means for storing what is configured as a part, and a part of the drawing data stored in the memory means when the coordinates of the drawing data are corrected Serial identifiable data reads in that a light beam irradiation means for drawing a pattern corresponding to the correction value. This is an invention of a pattern forming apparatus that realizes the first feature of the pattern forming method.

A second feature of the pattern forming apparatus according to the present invention is the pattern forming device according to the first feature, wherein the drawing data is subdivided into equal intervals based on the drawing resolution of the spatial light modulator. Read out the data corresponding to the drawing center point position of the mirror group from the layer data corresponding to the position of the base material moved by the stage means. A pattern forming apparatus for forming the pattern by irradiating the light beam based on
When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, distinguishable data for determining the correction value is used as the layer data. Memory means for storing what is configured as a part of the data, and when the coordinates of the drawing data are corrected, the discriminable data is read from a part of the layer data stored in the memory means and the correction value And a light beam irradiation means for drawing a pattern corresponding to the above. This is an invention of a pattern forming apparatus that realizes the second feature of the pattern forming method.

  According to a third feature of the pattern forming apparatus of the present invention, in the pattern forming apparatus according to the first or second feature, the discriminable data is a mirror for at least three horizontal rows and five vertical columns of the mirror group. Is used to draw a character pattern corresponding to the correction value. This is an invention of a pattern forming apparatus that realizes the third feature of the pattern forming method.

  According to a fourth aspect of the pattern forming apparatus of the present invention, in the pattern forming apparatus according to the first, second, or third feature, the discriminable data includes the moving direction and the orthogonal direction of the stage means. It is to be configured separately corresponding to each. This is an invention of a pattern forming apparatus that realizes the fourth feature of the pattern forming method.

  The exposure apparatus according to the present invention is characterized in that the pattern forming method according to any one of the first to fourth features or the pattern forming apparatus according to any one of the first to fourth features. It is to be used to expose the substrate. In this method, exposure is performed using the one described in the feature of any one of the pattern forming method and the pattern forming apparatus.

  The display panel manufacturing method according to the present invention is characterized in that the pattern forming method according to any one of the first to fourth features or the pattern according to any one of the first to fourth features. It is to manufacture a display panel using a forming apparatus. In this method, a display panel is manufactured using the method described in any one of the features of the pattern forming method or the pattern forming apparatus.

  According to the present invention, it is possible to confirm the reliability of DMD drawing data extraction with respect to a drawing position at high speed and easily, and high-quality pattern drawing can be executed with high throughput.

It is a figure which shows schematic structure of the exposure apparatus which concerns on one embodiment of this invention. It is a side view of the exposure apparatus shown in FIG. It is a front view of the exposure apparatus shown in FIG. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of the laser length measurement system provided in the exposure apparatus of FIG. FIG. 6 is a block diagram showing a schematic configuration of a main control device shown in FIGS. 1, 4 and 5. It is a figure which shows schematic structure of the drawing control part of FIG. It is a figure which shows an example of the operation | movement which the conventional exposure apparatus extracts the drawing data supplied to a DMD drive circuit from the memory for drawing data in a drawing control part at the time of scanning exposure execution. It is a figure which shows an example of the operation | movement in which a drawing data layer control part writes drawing data in the memory for drawing data. FIG. 9 is a diagram schematically illustrating how drawing data of FIG. 8 is extracted and rearranged and stored in each layer of a drawing data memory. It is a figure explaining the operation | movement which correct | amends the coordinate of drawing data in the exposure apparatus which concerns on one embodiment of this invention. It is a figure explaining the method which can discriminate | determine the change by the coordinate correction, when coordinate correction is performed in the drawing data resolution unit. It is the 1st figure explaining scanning of the substrate concerning a light beam. It is a 2nd figure explaining the scanning of the board | substrate which concerns on a light beam. It is a 3rd figure explaining the scanning of the board | substrate which concerns on a light beam. It is a 4th figure explaining the scanning of the board | substrate which concerns on a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this embodiment, an exposure apparatus will be described as an example of a pattern creation apparatus. FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus shown in FIG. 1, and FIG. 3 is a front view of the exposure apparatus shown in FIG. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system control device 40, a stage drive circuit 60, and a main control device 70 are included. 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 as a base material into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like. However, these illustrations are also omitted. In the embodiment in FIGS. 1 to 3, the X direction and the Y direction are examples, and it goes without saying that the X direction and the Y direction may be interchanged.

  As shown in FIGS. 1 to 3, the chuck 10 is at a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A resin film that is an ultraviolet curable resin such as a photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided above the exposure position where the substrate 1 is exposed so as to straddle the base 3. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although this embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of the light beam irradiation apparatuses is not limited to this, and one or two or more light beam irradiations are performed. The present invention is applied to an exposure apparatus using the apparatus.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated on the surface of the substrate 1 by the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  As shown in FIGS. 1 to 3, the chuck 10 is mounted on the upper side of the θ stage 8. An X stage 5 and a Y stage 7 are provided below the θ stage 8. The X stage 5 is mounted on four X guides 4 provided on the upper surface of the base 3, and moves in the X direction along the X guides 4. The Y stage 7 is mounted on two Y guides 6 provided on the upper surface of the X stage 5, and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and controls the rotation of the chuck 10 in the θ direction. The X stage 5, Y stage 7 and θ stage 8 are each provided with a drive mechanism (not shown) such as a ball screw, a motor, and a linear motor, and each drive mechanism is driven and controlled by the stage drive circuit 60 of FIG. Has been.

  When the θ stage 8 rotates the chuck 10 in the θ direction, the substrate 1 mounted on the chuck 10 is controlled to rotate so that two orthogonal sides coincide with each other in the X direction and the Y direction. The X stage 5 moves in the X direction to move the chuck 10 between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the surface of the substrate 1 in the X direction. Further, when the Y stage 7 moves in the Y direction, the operation region in the X direction of the light beam emitted from the head unit 20a of each light beam irradiation apparatus 20 moves in the Y direction. As shown in FIG. 1, the main controller 70 outputs a control signal to the stage drive circuit 60 and controls the stage drive circuit 60, whereby the rotation amount and rotation position of the θ stage 8 in the θ direction, the X stage 5. The movement amount and movement position in the X direction and the movement amount and movement position of the Y stage 7 in the Y direction are controlled.

  In this embodiment, the chuck 10 moves in the X direction together with the X stage 5 to scan the substrate 1 using the light beam from the light beam irradiation device 20, but the light beam irradiation device. By moving 20, the substrate 1 may be scanned using the light beam from the light beam irradiation device 20. Further, both the chuck 10 and the light beam irradiation device 20 may be moved in the X direction. Similarly, the chuck 10 moves in the Y direction together with the Y stage 7 so that the scanning region of the substrate 1 using the light beam from the light beam irradiation device 20 is changed. The scanning region of the substrate 1 may be changed by using the light beam from the light beam irradiation device 20 by moving. In this case as well, both the chuck 10 and the light beam irradiation device 20 may be moved in the Y direction.

  As shown in FIGS. 1 to 3, a linear scale 31 extending in the X direction is installed on the side edge of the base 3. The linear scale 31 includes a scale for the encoder 32 for detecting the amount of movement of the X stage 5 in the X direction. A linear scale 33 extending in the Y direction is installed on the side edge of the X stage 5. The linear scale 33 includes a scale for the encoder 34 for detecting the amount of movement of the Y stage 7 in the Y direction.

  As shown in FIGS. 1 to 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the scale of the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs the detected pulse signal to the main controller 70. An encoder 34 is attached to one side surface of the Y stage 7 so as to face the scale of the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs the detected pulse signal to the main controller 70. The main controller 70 counts the pulse signals from the encoders 32 and 34, detects the movement amounts of the X stage 5 in the X direction and the Y stage 7 in the Y direction, and specifies the positions thereof.

  FIG. 5 is a view for explaining the operation of the laser length measurement system provided in the exposure apparatus of FIG. In FIG. 5, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 5, only devices necessary for explaining the operation of the laser length measurement system are shown, and the gate 11 and the light beam irradiation apparatus 20 in FIG. 1 are omitted. The laser length measurement system is configured by a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 receives the laser light emitted from the laser light source 41 and introduced by the half mirror 46 and the mirror 47. The laser interferometer 42 irradiates the received laser light to the bar mirror 43 and receives the laser light reflected by the bar mirror 43. The laser interferometer 42 measures the interference between the laser light from the laser light source 41 and the laser light reflected by the bar mirror 43 at two locations in the Y direction. The laser interferometer 42 detects the rotation of the chuck 10 by measuring interference at two locations in the Y direction. The laser length measurement system control device 40 takes in the measurement result of the laser interferometer 42 under the control of the main control device 70 and detects the position and rotation of the chuck 10 in the X direction.

  The laser interferometer 44 receives the laser light emitted from the laser light source 41 and introduced by the half mirror 46 and the mirror 48. The laser interferometer 44 irradiates the bar mirror 45 with the received laser light and receives the laser light reflected by the bar mirror 45. The laser interferometer 44 measures the interference between the laser light from the laser light source 41 and the laser light reflected by the bar mirror 45. The laser length measurement system control device 40 receives the measurement result of the laser interferometer 44 under the control of the main control device 70 and detects the position of the chuck 10 in the Y direction. The rotation of the chuck 10 may be detected by measuring interference at two locations in the X direction with the laser interferometer 44. Further, the rotation of the chuck 10 may be detected by both the laser interferometers 42 and 44.

  FIG. 6 is a block diagram showing a schematic configuration of main controller 70 shown in FIGS. 1, 4 and 5. As shown in FIG. 6, the main controller 70 includes a drawing data generation unit 78 and a drawing control unit 71 that supply drawing data to the eight DMD drive circuits 27 of the light beam irradiation device 20. The main controller 70 is configured to include other components, but only the drawing data generator 78 and the drawing controller 71 are shown here. FIG. 7 is a diagram illustrating a schematic configuration of the drawing control unit in FIG. 6. In FIG. 7, the drawing data generation unit 78 and the drawing data layer control unit 82 shown in FIG. 6 are not shown. In FIG. 6, the input system for the center point coordinate determination unit 74 shown in FIG. 7 is not shown.

  As shown in FIG. 6, the drawing data generation unit 78 includes a drawing figure coordinate memory 79, a coordinate correction unit 80, and a drawing data generation unit 81. The drawing figure coordinate memory 79 stores figure coordinate data to be drawn. The coordinate correction unit 80 corrects the figure coordinate data stored in the drawing figure coordinate memory 79 to the actual figure drawing position coordinates. The drawing data generation unit 81 supplies drawing data relating to a figure to be drawn, which is filled based on the corrected figure coordinate data, to the drawing data layer control unit 82 of the drawing control unit 71. The drawing control unit 71 receives drawing data relating to a graphic to be drawn from the drawing data generation unit 78 at the previous stage, and the drawing data layer control unit 82 distributes the drawing data to each of the layers 721 to 72 n in the drawing data memory 72.

  As shown in FIG. 7, the drawing control unit 71 includes a drawing data memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, a DMD inclination calculation unit 84, and a data shift circuit 83. Has been. The drawing data memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as an address. The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20a of the light beam irradiation apparatus 20 by determining the range of the Y coordinate of the drawing data read from the drawing data memory 72. To do.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the XY direction before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 based on the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. As shown in FIG. 1, when scanning the substrate 1 using the light beam emitted from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60, and the chuck 10 is driven by the X stage 5. Is moved in the X direction. When changing the scanning area of the substrate 1, the main controller 70 controls the stage driving circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 7, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34 to detect the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, respectively. Then, the XY coordinates of the center point of the chuck 10 are determined. The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74.

  FIG. 8 is a diagram illustrating an example of an operation in which a conventional exposure apparatus extracts drawing data supplied to a DMD driving circuit from a drawing data memory in the drawing control unit when performing scanning exposure. FIG. 8 schematically shows drawing data corresponding to each exposure region 2a having a predetermined area, and shows a region where the pattern of the cross-shaped portion shown in gray in the drawing is exposed. Further, in FIG. 8, each mirror 25a of the DMD 25 is indicated by a thick frame corresponding to the drawing data, and the center point of each mirror 25a is indicated by a black square. In the actual DMD 25, a gap of about 1 [μm] is provided between the mirrors 25a, but the gaps of the mirrors 25a are omitted in FIG.

  As shown in FIG. 8, conventionally, the drawing data generated by the drawing data generation unit 78 is stored in the drawing data memory 72 in order according to the coordinates. Then, based on XY coordinates determined by a coordinate determination unit 75 described later, XY coordinates of drawing data supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 are obtained, and this is obtained as the center point of each mirror 25a of the DMD 25. Drawing data of coordinates corresponding to the position is extracted from the drawing data memory 72. Therefore, conventionally, drawing data of coordinates corresponding to the position of the center point of each mirror 25a of the DMD 25 is scattered in the drawing data memory 72. Therefore, as shown in FIG. The drawing data of the coordinates corresponding to the position of the center point of the image data must be separately read out from the drawing data memory 72 and aligned with the data corresponding to each row, and then supplied to the DMD driving circuit 27. That is, as shown in FIG. 8, the drawing data of coordinates corresponding to the position of the center point of each mirror of the DMD 25 in the horizontal 4 rows and vertical 4 columns is the DMD horizontal 1 row data, DMD horizontal 2 row data, DMD Drawing data of 4 rows by 4 columns corresponding to the position of the center point of each mirror 25a of the DMD 25 is extracted as the data of the horizontal row 3 and the data of the DMD horizontal row 4. Therefore, these extraction processes take time, and the scanning speed of the substrate 1 by the light beam cannot be increased.

  Hereinafter, an example of a drawing method executed by the pattern forming method according to the embodiment of the present invention will be described. In this embodiment, the function of the drawing data layer control unit 82 will be described. FIG. 9 is a diagram illustrating an example of an operation in which the drawing data layer control unit writes drawing data into the drawing data memory. FIG. 9 schematically shows drawing data corresponding to each exposure area 2a having a predetermined area, as in FIG. 8, and the gray areas in the figure are areas exposed as patterns. Is shown. FIG. 9A shows a pattern corresponding to the drawing data in the second column of the DMD in FIG. In this pattern, the area corresponding to each mirror 25a of the DMD 25 is indicated by a thick frame. In FIG. 9B, the center point of the mirror 25a of each DMD 25 is indicated by a “+” character. As shown in FIG. 9B, the distance between the central coordinates of the mirrors 25a of the DMD 25 arranged two-dimensionally is equal. That is, as shown in FIG. 9B, the mirrors 25a of the DMD 25 are arranged at equal intervals at the same pitch P, and the coordinate intervals of the drawing data corresponding to the position of the center point of each mirror 25a are also equal. .

  Data drawn with a drawing resolution as shown in FIG. 9C is supplied from the drawing data generation unit 81. The drawing data layer control unit 82 classifies the DMD center coordinate interval into layer numbers divided by the drawing resolution based on the data drawn at this drawing resolution so that the data for each DMD interval is the same layer. Sort. For example, as shown in FIG. 9, the drawing data layer control unit 82 uses the drawing data supplied from the drawing data generation unit 81 of the drawing data generation unit 78 as the scanning direction of the substrate 1 by the light beam and the direction orthogonal thereto. , The distance between the center points of the adjacent mirrors 25a of the DMD 25 is divided into a number n (nine in the figure) divided by the drawing resolution, and the coordinates are equally spaced according to the distance between the center points of the adjacent mirrors 25a. The drawing data is rearranged so that the drawing data are classified into the same category. Then, the drawing data layer control unit 82 distributes the rearranged drawing data to the respective layers 721 to 729 of the drawing data memory 72 for each equidistant coordinate, and collectively collects the drawing data memory for each equidistant coordinate. 72 is written in each of the layers 721 to 729. FIG. 9C shows extraction and rearrangement of drawing data stored in the layers 721 to 729 of the drawing data memory 72.

  FIG. 10 is a diagram schematically showing how the drawing data of FIG. 8 is extracted and rearranged and stored in each layer of the drawing data memory. FIG. 10A is a diagram illustrating an example of the drawing data generated by the drawing data generation unit, and corresponds to the drawing data of FIG. In the drawing data in FIG. 10A, the mirror 25a of the DMD 25 corresponds to 5 rows by 5 columns. FIG. 10B is a diagram illustrating an example of drawing data stored in each layer 721 to 729 of the drawing data memory. FIG. 10A schematically shows drawing data corresponding to each exposure region 2a having a predetermined area, as in FIG. 8, and the portion shown in gray in the drawing is exposed by the pattern. Indicates the area to be used. The drawing data generated by the drawing data generation unit 81 shown in FIG. 10A is transferred to the layers 721 to 729 of the drawing data memory 72 by the drawing data layer control unit 82 as shown in FIG. 10B. Stored. Since the drawing data stored in each layer 721 to 729 is collected for each central coordinate of the DMD 25, the drawing data supplied to the DMD driving circuit 27 based on the XY coordinates determined by the coordinate determining unit 75 is DMD. Since it is always continuous data in one layer for each row, it can be easily supplied to the DMD drive circuit 27. In this embodiment, the case where the mirror 25a adjacent to the DMD 25 is 5 rows by 5 columns and the number of the distance between the center points of each mirror 25a divided by the drawing resolution is nine as an example. Therefore, when one side of the mirror 25a of the DMD 25 is composed of a square mirror of 10 to 15 [μm] and 1024 mirrors are arranged in the long side direction of the DMD 25 and 256 in the short side direction of the DMD 25, The drawing data of each layer has a size corresponding to the arrangement of the mirrors.

  As shown in FIG. 10B, the drawing data stored in each of the layers 721 to 72n of the drawing data memory 2 is collected for each coordinate corresponding to the position of the center point of each mirror 25a of the DMD 25. Thus, there is no need to separately read out and rearrange the drawing data of the coordinates corresponding to the position of the center point of each mirror 25a of the DMD 25 from the drawing data memory 72 as in the prior art, and by the XY coordinates determined by the coordinate determining unit 75, The drawing data supplied to the DMD driving circuit 27 is always continuous data in one of the layers 721 to 72n of the drawing data memory 72 for each DMD row. It becomes possible to supply.

  In FIG. 7, the bandwidth setting unit 73 of the drawing control unit 71 determines the Y coordinate range of the drawing data read from the drawing data memory 72, thereby irradiating light from the head unit 20 a of the light beam irradiation device 20. Sets the bandwidth of the beam in the Y direction.

  In FIG. 7, the laser length measurement system control device 40 detects the position in the X and Y directions of the chuck 10 before starting the exposure of the substrate 1 at the exposure position. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 7, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines one of the drawing data coordinates to be read based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74, and reads the drawing data from the determined coordinates. The layers 721 to 72n of the drawing data memory 72 to be performed are selected. As shown in FIG. 10B, the layers 721 to 72n from which the drawing data is read out are simply selected by assigning the coordinates to the respective layers 721 to 72n of the drawing data memory 72 in a lump for each coordinate at equal intervals. Thus, the drawing data can be read collectively for each equally spaced coordinate.

  FIG. 11 is a view for explaining the operation of correcting the coordinates of the drawing data in the exposure apparatus according to one embodiment of the present invention. FIG. 11 schematically shows the drawing data corresponding to each exposure region 2a having a predetermined area, as in FIG. 10, and the cross-shaped portion shown in gray in the drawing is exposed to the pattern. Shows the area. In FIG. 11, the outline of the pattern drawn by the drawing data after correcting the coordinates is indicated by a thick cross. For example, a case where the coordinates of the drawing data supplied to the DMD driving circuit 27 are corrected based on the detection result of the positional deviation of the head unit 20a of the light beam irradiation device 20 will be described. At this time, as shown in FIG. 11, the operation of correcting the coordinates of the drawing data in the direction (Y direction) orthogonal to the scanning direction (X direction) is performed by the layers 721 to 721 of the drawing data memory 72 for reading out the drawing data. It is executed by changing 72n according to the correction amount (correction value). The operation of correcting the coordinates of the drawing data in the scanning direction (X direction) is executed by changing the read start address in each of the layers 721 to 72n of the drawing data memory 72 according to the correction amount.

  For example, in the case of FIG. 11, the coordinate correction is described as being performed immediately after reading the layer 721 of the drawing data memory 72. The drawing data after coordinate correction has its coordinates corrected by -1 in the Y direction and +1 in the X direction with respect to the drawing data before coordinate correction. That is, the cross-shaped portion indicated by a thick frame is shifted to the upper left obliquely as shown in FIG. 11 with respect to the cross-shaped portion indicated by gray. Therefore, before the coordinate correction, the position indicated by the thick square in the middle of each horizontal first row of the layer 721 of the drawing data memory 72 is the read start address. This position is the address in the fifth column. After the coordinate correction, the layer 723 of the drawing data memory 72 is selected as the data in the X direction, and the address in the fourth vertical column is selected as the data in the Y direction. Thereafter, the addresses in the fourth vertical column are selected in order from the layers 724 to 729 of the drawing data memory 72. Note that, in the layers 724 to 729 in FIG. 11B, data corresponding to the address in the fourth vertical column to be selected is shown as a thick frame rectangle. In this way, by selecting each layer of the drawing data memory 72, changing the address and performing reading, it is not necessary to recalculate the coordinates of the drawing data, thereby easily improving the pattern drawing accuracy. be able to. That is, paying attention to the fact that the center coordinate points of the mirrors of the spatial light modulators arranged in two directions are arranged at equal intervals, the drawing data at equal intervals is managed and stored as a layer, and updated by scanning movement. If one coordinate point of the spatial light modulator determined by the coordinates is known, the coordinates of all the modulators that are equally spaced can be determined, and since this is managed as the same layer, it is easy as continuous data. It is possible to extract data.

  In this embodiment, as shown in FIG. 11, based on the detection result of the positional deviation of the light beam emitted from the head portion 20 a of the light beam irradiation device 20, it is supplied to the DMD drive circuit 27 of the light beam irradiation device 20. The coordinates of the drawing data are corrected. The drawing data of the corrected coordinates is supplied to each DMD driving circuit 27, so that the pattern drawing accuracy can be improved more than the resolution of the mirror 25a of the DMD 25. However, even if there is a change in the XY coordinates of the drawing data by drawing with higher accuracy than the resolution of the mirror 25a of the DMD 25, it is difficult to grasp the change from the drawn pattern. For example, when viewing the stored data of the layers 721 to 729 of the drawing data memory 72 shown in FIG. 11B, the stored data of the layers 723 to 728 have the same configuration. Therefore, when coordinate correction is performed between the layers 723 to 728 of the drawing data memory 72, the data structure of the layers 723 to 728 is the same, and the amount of movement is also sufficiently smaller than the resolution of the mirror 25a of the DMD 25. Therefore, even if the drawn pattern is acquired using a normal CCD camera or the like, it is difficult to recognize the difference in the movement amount.

  FIG. 12 is a diagram for explaining a method capable of determining a change due to coordinate correction when coordinate correction is performed in the drawing data resolution unit. In this embodiment, in order to discriminate changes below the DMD mirror resolution, discriminable data is stored in advance in a specific layer (for example, layers 72n-1 and 72n) of the drawing data memory 72, and the data is stored in the data. On the basis of this, a part of the mirror 25a of the DMD 25 is used, and the change state of the drawing resolution unit is configured by the data of 9 rows by 9 columns corresponding to the drawing resolution in the margin of the drawing area. It was made to draw as character patterns, such as the number of "0"-"8". As shown in FIGS. 12 (A) and 12 (B), the number “0” is displayed as distinguishable data in each layer area of the drawing data memory 72 corresponding to the horizontal 3 rows and 5 columns of the mirror 25a of the DMD 25. ”To“ 8 ”are stored. The discriminable data for each layer area is composed of 9 rows by 9 columns data corresponding to the drawing resolution of the mirror 25a. FIG. 12A shows an example of discriminable data for discriminating the correction amount when the coordinates of the drawing data are corrected in the scanning direction (X direction). FIG. 12B shows an example of discriminable data for determining the correction amount when the coordinates of the drawing data are corrected in the direction (Y direction) orthogonal to the scanning direction (X direction). As the discriminable data, row and column data corresponding to the correction amounts in the X direction and the Y direction are read out regardless of the contents of the drawing data. As described above, the data stored between the layers is data that is easy to discriminate such as characters including numbers, so that it is possible to easily discriminate subtle coordinate shifts due to correction. .

  When both the correction amounts (correction values) in the X direction and the Y direction are “0”, one horizontal row of discriminable data for each layer region of 9 rows by 9 columns shown in FIGS. Data at positions indicated by thick squares in the fifth column are read out. Of the data at the position indicated by the thick square in the first row and fifth column of each layer area, the gray portion is exposed by the mirror 25a of three rows and five columns. By exposure with data read from each layer region in FIGS. 12A and 12B, an exposure pattern 120 with a number “0” and an exposure pattern 121 with a number “4” as shown in FIG. Drawn.

  On the other hand, as shown in FIG. 11A, when the coordinates are corrected by −1 in the X direction and −1 in the Y direction, each layer of 9 rows by 9 columns shown in FIGS. 12A and 12B. Data at positions indicated by thick squares in the second horizontal row and the fourth vertical column of the area discriminable data are respectively read. Of the data at the position indicated by the thick square in the 2nd row and 4th column of each layer area, the gray portion is exposed by the mirror 25a of 3 rows and 5 columns. By exposure using data read from each layer region in FIGS. 12A and 12B, an exposure pattern 122 having a number “1” and an exposure pattern 123 having a number “3” are obtained as shown in FIG. Drawn.

  That is, in the discriminable data of each layer region of 9 rows by 9 columns shown in FIG. 12A, data corresponding to the correction amount in the X direction is stored in the row direction (horizontal direction), and the column direction ( The data in the vertical direction) is common. Accordingly, when the correction amount in the X direction is “0”, the data in the first horizontal row corresponding to the number “0” is read, and when the correction amount in the X direction is “+1”, the number “ The data in the second horizontal row corresponding to “1” is read out. Similarly, the data of each row corresponding to the correction amount in the X direction is read out. The data of each row of the discriminable data of 9 rows by 9 columns shown in FIG. 12A constitutes a pattern of numbers “0” to “8” as shown in FIG. . On the other hand, the discriminable data of each layer region of 9 rows by 9 columns shown in FIG. 12B stores data corresponding to the correction amount in the Y direction in the column direction (vertical direction). The data in the horizontal direction are the same. Therefore, when the correction amount in the Y direction is “0”, the data in the fifth column corresponding to the number “4” is read, and when the correction amount in the Y direction is “−1”, the number The data in the fourth column corresponding to “3” is read, and when the correction amount in the Y direction is “+1”, the data in the sixth column corresponding to the number “5” is read. Hereinafter, similarly, data of each column is read according to the correction amount in the Y direction. The data of each column of the discriminable data of 9 rows by 9 columns shown in FIG. 12 (B) is composed of a number pattern of “0” to “8” as shown in FIG. 12 (D) in order. Yes.

  As described above, the discriminable data for determining the correction amount when the coordinates of the drawing data are corrected in the scanning direction (X direction) and the orthogonal direction (Y direction) are specified in the drawing data memory 72. By storing it in a layer, reading it according to the correction amount, drawing it, and reading it with a mechanism that checks the drawing pattern, it is possible to detect changes in the correction amount in the X direction and the Y direction. The accuracy of DMD drawing data extraction can be confirmed quickly and easily, and high-quality pattern drawing can be executed with high throughput. That is, it is possible to easily determine data having a resolution equal to or lower than the cell size of the mirror 25a of the DMD 25, which has been considered difficult conventionally. In this way, the drawing processing of the discriminable data is performed on the test substrate. As a result, it is possible to visually check at which part of the substrate the coordinate correction occurs, and it can be used as an aid for creating data in pattern formation.

  13 to 16 are diagrams for explaining the scanning of the substrate according to the light beam. FIGS. 13 to 16 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with eight light beams from the eight light beam irradiation devices 20. In FIGS. 13 to 16, the head portion 20 a of each light beam irradiation apparatus 20 is indicated by a broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 13 shows the first scan, and a pattern is drawn in the scan area shown in gray in FIG. 13 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 14 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 14 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 15 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 15 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 16 shows the fourth scan. With the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 16, and the scan of the entire substrate 1 is completed.

  By scanning the substrate 1 in parallel with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, the time required for scanning the entire substrate 1 can be shortened, and the tact time can be shortened. Although FIGS. 13 to 16 show an example in which the substrate 1 is scanned four times in the X direction and the entire substrate 1 is scanned, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, drawing data at the same position in the exposure area is supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20 a plurality of times, and a part of the drawing data supplied a plurality of times is supplied to the exposure area. By supplying drawing data at adjacent positions to the DMD driving circuit 27 of the light beam irradiation device 20, the jagged edges of the pattern can be made inconspicuous, and the generation of moire can be suppressed to improve the drawing quality. .

  By performing exposure of the substrate using the exposure apparatus or exposure method of the present invention, the jagged edges of the pattern can be made inconspicuous, and the generation of moire can be suppressed to improve the drawing quality. A display panel substrate can be manufactured.

  For example, FIG. 17 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film forming step (step S191), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step S192), a photoresist is coated by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step S191). In the exposure step (step S193), a pattern is formed on the photoresist film using an exposure apparatus. In the development process (step S194), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step S195), a portion of the thin film formed in the thin film formation process (step S191) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step S196), the photoresist film that has finished the role of the mask in the etching step (step S195) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 18 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step S201), a black matrix is formed on the substrate by processes such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step S202), a colored pattern is formed on the substrate by a staining method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step S203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step S204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 17, in the exposure process (step S193), in the color filter substrate manufacturing process shown in FIG. 18, in the black matrix forming process (step S201) and the colored pattern forming process (step S202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

  In the above-described embodiment, the TFT substrate or the color filter substrate is described as an example of the substrate to which the ultraviolet curable resin is applied, but the light beam is spatially modulated on the substrate to which the photocurable resin is applied. It is possible to apply to a device in which a predetermined pattern is drawn on a photo-curing resin by performing modulated irradiation using a container.

  In addition, in this specification, a base material is a concept including a plate shape (what is usually called a board | substrate) and a film-like thing. Resins that cause a chemical reaction such as polymerization and curing by light of a specific wavelength include ultraviolet curable resins such as photoresists, resins used for plate making such as screen printing, resins for holographic recording media, and rapid prototyping. Including the above resin.

  The pattern forming method and apparatus according to the present embodiment can be applied to a substrate (substrate, film, etc.) using a printing technique used in the field of printable electronics for creating a display circuit or an electronic component on a flexible substrate or the like by a printing (printable) technique. The present invention is applicable to the technical field of patterning a printing plate (mask) on a resinous material (including a resinous material). In addition, the light modulated according to the image data is imaged on the photosensitive layer, the photosensitive layer is exposed, and a high-definition permanent pattern (protective film) in the printed wiring substrate field or semiconductor field including the package substrate Further, the present invention can be applied to a pattern forming apparatus that efficiently forms an interlayer insulating film and a solder resist pattern. Examples of circuits created by such a printing technique include electronic paper, electronic signboards, and printable TFTs.

The pattern forming method according to this embodiment can be applied to the field of surface modification of a substrate using a resin that causes a chemical reaction such as polymerization or curing by light of a specific wavelength. Further, the present invention can be applied to the field of forming a pattern such as a (repair) wiring between chips of a semiconductor Si-through electrode (through-silicon via, TSV).
In addition to this, the present invention can also be applied to an apparatus for making a printing plate, a plate making apparatus for a rotary press, a stencil printing such as a lithograph or a preport or a stencil printing apparatus. For plate making equipment such as screen printing, semiconductor device repair methods and equipment, printed wiring board manufacturing equipment including package base materials, fine electrode patterns such as flat panel displays and printed base materials, or pattern making equipment for exposure masks Is also applicable.
Substrates include wafers, printed substrates, flat panel displays, masks, reticles, and the like, as well as plates used for copying magazines, newspapers and books, and those formed into films.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 10 ... Chuck 11 ... Gate 20 ... Light beam irradiation apparatus 20a ... Head part 21 ... Laser light source unit 22 ... Optical fiber 23 ... Lens 24 ... Mirror 25 ... DMD (Digital Micromirror Device)
25a ... mirror 26 ... projection lens 27 ... DMD drive circuit 2a ... each exposure region 3 ... base 31, 33 ... linear scale 32, 34 ... encoder 4 ... X guide 40 ... laser length measuring system controller 41 ... laser light source 42, 44 ... Laser interferometers 43, 45 ... Bar mirror 46 ... Half mirrors 47,48 ... Mirror 5 ... X stage 6 ... Y guide 60 ... Stage drive circuit 7 ... Y stage 70 ... Main controller 71 ... Drawing controller 72 ... Drawing data Memory 721-72n ... Layer 73 ... Bandwidth setting unit 74 ... Center point coordinate determination unit 75 ... Coordinate determination unit 78 ... Drawing data generation unit 79 ... Drawing figure coordinate memory 8 ... [theta] stage 80 ... Coordinate correction unit 81 ... Drawing data generation Unit 82 ... Drawing data layer control unit 83 ... Data shift circuit 84 ... DMD inclination calculation unit

Claims (10)

A spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data modulates the light beam, and relatively moves the stage means that holds the substrate coated with the resin film. A pattern forming method for forming a pattern based on the drawing data on the resin film of the substrate by irradiating the light beam while
When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, the distinguishable data for determining the correction value is the drawing data. As part of
A pattern forming method comprising: reading out the discriminable data from a part of the drawing data and drawing a pattern corresponding to the correction value when the coordinates of the drawing data are corrected. 2. The pattern forming method according to claim 1, wherein the drawing data is composed of layer data subdivided at equal intervals based on a drawing resolution of the spatial light modulator, and is moved by the stage means. Read the data corresponding to the drawing center point position of the mirror group from the layer data corresponding to the position of the substrate, and form the pattern by irradiating the light beam based on the read data A pattern forming method comprising:
When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, distinguishable data for determining the correction value is used as the layer data. As part of
A pattern forming method comprising: reading out the discriminable data from a part of the layer data and drawing a pattern corresponding to the correction value when the coordinates of the drawing data are corrected.   3. The pattern forming method according to claim 1, wherein the discriminable data is configured such that a character pattern corresponding to the correction value can be drawn using a mirror of at least three horizontal rows and five vertical columns of the mirror group. The pattern formation method characterized by the above-mentioned.   4. The pattern forming method according to claim 1, wherein the discriminable data is configured separately corresponding to the moving direction and the orthogonal direction of the stage means. . A spatial light modulator that drives a plurality of mirror groups arranged in two directions based on drawing data modulates the light beam, and relatively moves the stage means that holds the substrate coated with the resin film. A pattern forming apparatus for forming a pattern based on the drawing data on the resin film of the substrate by irradiating the light beam while
When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, the distinguishable data for determining the correction value is the drawing data. Memory means for storing what is configured as part of
Light beam irradiation means for reading the discriminable data from a part of the drawing data stored in the memory means when the coordinates of the drawing data are corrected and drawing a pattern corresponding to the correction value. A pattern forming apparatus. 6. The pattern forming apparatus according to claim 5, wherein the drawing data is composed of layer data subdivided at equal intervals with reference to the drawing resolution of the spatial light modulator, and is moved by the stage means. Read the data corresponding to the drawing center point position of the mirror group from the layer data corresponding to the position of the substrate, and form the pattern by irradiating the light beam based on the read data A pattern forming device,
When the coordinates of the drawing data are corrected in the moving direction of the stage means and / or the direction orthogonal to the moving direction by a value corresponding to the drawing resolution, distinguishable data for determining the correction value is used as the layer data. Memory means for storing what is configured as part of
Light beam irradiation means for reading the discriminable data from a part of the layer data stored in the memory means when the coordinates of the drawing data are corrected, and drawing a pattern corresponding to the correction value. A pattern forming apparatus.   7. The pattern forming apparatus according to claim 5, wherein the discriminable data is configured such that a character pattern corresponding to the correction value can be drawn using a mirror of at least 3 horizontal rows and 5 vertical columns of the mirror group. A pattern forming apparatus.   8. The pattern forming apparatus according to claim 5, wherein the discriminable data is configured separately corresponding to the moving direction and the orthogonal direction of the stage means. .   An exposure apparatus that performs exposure of a substrate using the pattern forming method according to any one of claims 1 to 4 or the pattern forming apparatus according to any one of claims 5 to 8.   A display panel is manufactured using the pattern forming method according to any one of claims 1 to 4 or the pattern forming apparatus according to any one of claims 5 to 8. Panel manufacturing method.

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