JP2012008243A - Exposure device and exposure method, display panel board manufacturing apparatus, and display panel board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device and an exposure method that can correct in a simple way and in a short period of time deformation of a drawing pattern of an object of drawing that may occur in a light beam system, or to provide a display panel board manufacturing apparatus or a display panel board manufacturing method that can achieve a high throughput by using the exposure device or the exposure method.SOLUTION: By an exposure method, a light beam radiating device irradiates a substrate with a light beam to prepare drawing data to be drawn on the substrate; in drawing a pattern on the substrate, a plurality of alignment marks provided on the substrate are photographed; and the preparation of the drawing data is accomplished by positioning drawing points on the basis of predetermined coordinate ratios of the drawing points for line segments linking the plurality of alignment marks corresponding to the drawn drawing points.

Description

The present invention relates to an exposure apparatus, an exposure method, a display panel substrate manufacturing apparatus, and a display panel substrate manufacturing method, and more particularly to an exposure apparatus, an exposure method, and a display panel substrate that correct deformation of a drawing pattern generated in an upstream process. The present invention relates to a manufacturing apparatus and a display panel substrate manufacturing method.

  Manufacture of TFT (Thin Film Transistor) drawing objects, color filter drawing objects, plasma display panel drawing objects, organic EL (Electro Luminescence) display panel drawing objects, etc. for liquid crystal display devices used as display panels Then, the exposure apparatus is used to form a pattern on the object to be drawn by photolithography. As an exposure apparatus, conventionally, a projection method in which a mask pattern is projected onto a drawing object using a lens or a mirror, and a fine gap (proximity gap) is provided between the mask and the drawing object. There was a proximity method to transfer the pattern to the drawing object.

  2. Description of the Related Art In recent years, an apparatus has been developed that draws a pattern on a drawing object by irradiating the drawing object to which a photoresist is applied with the light beam, scanning the drawing object with the light beam. Since an object to be drawn is scanned by a light beam and a pattern is directly drawn on the object to be drawn, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel drawing objects can be handled.

Proximity type exposure equipment that transfers the mask pattern to the object to be drawn is difficult to correct in the downstream process for deformation of the drawing pattern such as translation, enlargement, reduction, rotation, etc. that occurred in the upstream process. is there. However, in the light beam method, the downstream process can be corrected by changing the irradiation position and angle of the light beam.
As such a correction method, there is a method disclosed in Patent Document 1. Patent Document 1 discloses a method of forming a quadrangle based on two adjacent sides obtained by detecting an alignment mark, and correcting a light beam irradiation position using a parallelogram or the like close to the quadrangle.

JP 2006-301155 A

  However, the correction method disclosed in Patent Document 1 is complicated and requires a lot of processing time.

  A first object of the present invention is to provide an exposure apparatus and an exposure method that can correct in a short time a deformation of a drawing pattern of an object to be drawn that occurs in a light beam method.

  A second object of the present invention is to provide a display panel substrate manufacturing apparatus or a display panel substrate manufacturing method having a high throughput by using the exposure apparatus or exposure method of the present invention.

  In order to achieve the first object, the present invention chucks a substrate coated with a photoresist, irradiates a light beam with a light beam irradiation device, and relatively moves the substrate and the light beam irradiation device. Creating drawing data to be drawn on the substrate, imaging a plurality of alignment marks provided on the substrate upon exposure by drawing a pattern on the substrate, and creating the drawing data includes drawing to draw A first feature is that the drawing data is generated by determining the position of the drawing point based on a coordinate ratio of the drawing point defined in advance with respect to a side connected by the plurality of alignment marks corresponding to the point. To do.

  According to the present invention, in order to achieve the first object, in addition to the first feature, the alignment mark is provided in the vicinity of four corners of the substrate, and the side is a quadrangle formed by the alignment mark. The second feature is that the coordinate ratio is determined for the four sides.

  Furthermore, in order to achieve the first object, according to the present invention, in addition to the second feature, the creation of the drawing data is performed by obtaining, for each side, a linear expression that defines one set of opposite sides of the four sides. The positions of the two points corresponding to the drawing points on the opposite side are obtained based on the linear equations and the coordinate ratio of the opposite sides, respectively, and the second linear equation obtained from the positions of the two points and the opposite side A third feature is that the position of the drawing point is determined based on the coordinate ratio of the drawing points of adjacent sides.

  According to the present invention, in order to achieve the first object, in addition to the second feature, the creation of the drawing data is performed by obtaining linear expressions that define the four sides, and configuring the four sides. For each pair of opposite sides, the positions of two points corresponding to the drawing points on the opposite side are obtained based on the linear equation and the coordinate ratio of the opposite sides, and obtained from the positions of the two sets of the two points. The fourth feature is that the position of the drawing point is determined as an intersection of two third linear expressions.

  Furthermore, in order to achieve the first object, the present invention, in addition to the second feature, the creation of the drawing data obtains a position corresponding to the drawing point on the four sides from the coordinate ratio, A fifth feature is that the position of the drawing point is determined from the position of the corresponding four points.

In addition to the second feature, the sixth feature of the present invention is that, in addition to the second feature, the drawing point is a feature point that defines the pattern.
Furthermore, in order to achieve the first object, the present invention has a plurality of spatial light modulators in which the light beam irradiation device has a plurality of mirrors arranged in two orthogonal directions in addition to the first feature. This is the seventh feature.

  In order to achieve the second object, the present invention has any one of the first to sixth characteristics, and an eighth characteristic is to manufacture a display panel substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the exposure apparatus and exposure method which can correct | amend the deformation | transformation of the drawing pattern of the to-be-drawn body which generate | occur | produces in a light beam system with a simple method can be provided.

  Further, according to the present invention, a display panel substrate manufacturing apparatus or a display panel substrate manufacturing method with high throughput can be provided by using the exposure apparatus or exposure method of the present invention.

1 is a schematic block diagram of an exposure apparatus according to an embodiment of the present invention. It is a side view of the exposure apparatus by embodiment of this invention. It is a front view of the exposure apparatus by embodiment of this invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a top view of the light beam irradiation apparatus mounted in the gate. It is a figure which shows a part of board | substrate drawn by the exposure apparatus by embodiment of this invention. It is a figure which shows the structure relevant to drawing and the schematic structure of embodiment of the drawing control part which is the characteristics of this invention. FIG. 8A shows a drawing pattern as design data in which the drawing pattern is not deformed. FIG. 8B is a diagram showing a drawing pattern deformed by drawing in the upstream process. It is a figure which shows the processing flow of the 1st Example of the production method of the correction coordinate data by embodiment of this invention. It is a figure which shows the typical pattern of the coordinate of four detected alignment marks. FIG. 11A is an explanatory diagram of a method for obtaining the position coordinates of the positions ABP and CDP corresponding to the feature points on the two sides A′B ′ and C′D ′. FIG. 11B is an explanatory diagram of a method for obtaining the correction coordinates of feature points. It is a figure which shows the simulation result of the exposure pattern correction method. It is a figure which shows the processing flow of the 2nd Example of the production method of the correction coordinate data by embodiment of this invention. It is a figure which shows the flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a figure which shows the flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, a plurality of laser light source units, and linear scales 31, 33. , Encoders 32 and 34, laser length measurement system, laser length measurement system control device 40, stage drive circuit 60, and main control device 70. In FIG. 1, the laser light source unit is omitted. 2 and 3, the laser light source unit, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.
Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.
In the mirror part 25a of the DMD 25, for example, 1024 square mirrors having a side of 10 to 15 μm are arranged in the long side direction of the DMD 25 and 256 in the short side direction of the DMD 25. As an example, when the dimension of the mirror is 10 μm and the gap between adjacent mirrors is 1 μm, the pitch of the mirror (the distance between the centers of the mirrors) is 11 μm.

FIG. 5 is a top view of the light beam irradiation apparatus mounted on the gate. In this embodiment, one light beam irradiation device 20 is provided in the scanning direction (X direction) of the substrate 1 by the light beam from the light beam irradiation device 20, but two or more light beams are provided in the scanning direction. An irradiation device 20 may be provided. In this embodiment, eight sets of light beam irradiation devices 20 are provided in the direction orthogonal to the scanning direction (Y direction), but seven sets or less or nine sets or more of light are set in the direction orthogonal to the scanning direction. A beam irradiation device may be provided.
In FIG. 5, two pairs of Y guides 16 extending in the Y direction are provided on the upper surface of the gate 11. A Y stage 17 is mounted on each Y guide 16, and each Y stage 17 moves in the Y direction along each Y guide 16. Each Y stage 17 is provided with a drive mechanism (not shown) such as a ball screw and a motor or a linear motor, and each drive mechanism is driven by a stage drive circuit 60 of FIG. Accordingly, the eight sets of light beam irradiation devices 20 can move together in the Y direction.

  FIG. 6 is a view showing a part of the substrate 1 drawn by the exposure apparatus having the above-described configuration. Each point represents the center position of the DMD 25, and an exposure pattern is formed by controlling whether or not exposure is performed in units of DMD as the substrate 1 moves in the X direction. In FIG. 6, as an example, a triangular exposure pattern composed of vertices PQR is formed, black points indicate DMDs that are not exposed, and white points indicate DMDs that are exposed. In FIG. 6, when the Sth scan is scanned from left to right, the next S + 1th scan is scanned from right to left. The entire surface of the substrate 1 is scanned by being shared by a plurality of light beam irradiation devices 20 provided on the gate 11.

In the present embodiment, the deformation of the drawing pattern generated in the upstream process is corrected from the deformation of the alignment mark positions provided in the vicinity of the four corners of the substrate 1, for example, the position of the drawing pattern feature point, for example, the triangle vertex PQR in FIG. Based on the corrected position of the vertex PQR, the XY coordinates of the drawing data in the drawing pattern are created.
In the following description, the triangle PQR shown in FIG. 6 will be described as the only drawing pattern for easy understanding.

FIG. 7 is a diagram illustrating a schematic configuration of an embodiment of a drawing control unit, which is a feature of the present invention, and a mechanism related to drawing. FIG. 8A shows a drawing pattern as design data with no deformation of the drawing pattern, and FIG. 8B shows a drawing pattern deformed by drawing in the upstream process.
The drawing control unit 71 includes, in addition to the memory 78 that stores the design value data, a memory 72 that stores drawing data, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a coordinate correction calculation unit 77. It is configured to include.

The memory 78 for storing the design value data indicates the position AB of the triangle vertex PQR that is the feature point by the side AB (side CD) defined by the alignment marks A, B, C, and D shown in FIG. And the coordinate ratio (U, V) on the side BC (side DA). As an example, the coordinate ratio (Up, Vp) of the point P is shown in Equation (1) and Equation (2).
Up = j / (i + j) (1)
Vp = m / (m + n) (2)
Note that i, j, m, and n refer to FIG. 8. The reason why i, j, m, and n are not directly stored as design data is that, by obtaining the coordinate ratio in advance, time-consuming division is unnecessary and the processing time is reduced. This is because the tact time can be shortened and the tact time can be shortened, and the memory capacity can be reduced.

  However, unlike this embodiment, i, j, m, and n are directly stored and it is not denied if it is convenient to obtain the coordinate ratio when necessary.

The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.
The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72. That is, the scanning width shown in FIG. 6 is defined.

The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started.
The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning region of the substrate 1, the main controller 70 controls the stage driving circuit 60 to move the chuck 10 in the Y direction by the Y stage 7 (see FIG. 2). In FIG. 7, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The alignment mark detection unit 76 (see FIGS. 1 and 2) is attached to the gate 11 by a support member (not shown), and is deformed by drawing in the upstream process shown in FIG. 8B using four CCD cameras. The alignment marks A ′, B ′, C ′, and D ′ of the drawing object having the drawn pattern are imaged, and the coordinate value of the alignment mark (not shown) of the drawing object fixed to the chuck 10 is detected. . The detected coordinate value of the alignment mark is sent to the coordinate correction calculation unit 77.

  The coordinate correction calculation unit 77 performs a drawing pattern correction process as described later based on the coordinate value of the alignment mark detected by the alignment mark detection unit 76.

  Based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74 and the correction coordinate data of the coordinate correction calculation unit 77 described later, the coordinate determination unit 75 supplies the DMD drive circuit 27 of each light beam irradiation device 20 to the DMD drive circuit 27. The XY coordinates of the drawing data to be supplied are determined and stored in the memory 72.

  Therefore, the drawing controller 71 outputs the drawing data stored in the memory 72 to the DMD drive circuit 27 of each light beam irradiation apparatus 20 and draws it as the X stage 5 and the Y stage 7 scan.

Next, a method for creating correction coordinate data by the coordinate correction calculation unit 77 will be described. FIG. 9 is a diagram showing a processing flow of a first example of a method of creating correction coordinate data according to the embodiment of the present invention.
First, as described above, the alignment marks A ′, B ′, C ′, and D ′ are imaged by the alignment mark detector 76 (see FIGS. 1 and 2) attached to the gate 11 of FIG. Coordinate values A ′ (Xa, Ya), B ′ (Xb, Yb), C ′ (Xc, Yc) and D ′ (Xd, Yd) of (not shown) are detected (Step 1, FIG. 8B). ). Next, the flag F of the two sides A′B ′ and C′D ′ connecting the alignment marks A ′, B ′, C ′, and D ′ is obtained from the equation (3), and when the flag is 0, the equation (4) Then, the slope K and the intercept S are obtained from the equation (5), and when the flag is 1, it is assumed that it is perpendicular to the X axis (Step 2). An example of side A′B ′ is shown below.
Flag: Fab = 1: | Xa−Xb | <ΔF (3)
0: | Xa−Xb | ≧ ΔF
Inclination: Kab = (Ya−Yb) / (Xa−Xb) (4)
Section: Sab = Ya−Kab × Xa (5)
The flag F avoids unnecessary processing and shortens the processing time. ΔF represents an allowable error range.

  FIG. 10 is a diagram showing a typical pattern of the coordinates of the four detected alignment marks. 10A is parallel to each other, FIG. 10B is parallel to the horizontal direction, FIG. 10C is parallel to the vertical side, and FIG. 10D is horizontal and vertical. The opposite side is not parallel in both directions. Equation (3) is an example of FIG. 10C, but the flag is similarly obtained in the other cases shown in FIG.

  Next, the correction coordinates of the feature point P are obtained. For this purpose, first, based on the coordinate ratio Up obtained by Expression (1), the positions of the positions ABP and CDP on the two sides A′B ′ and C′D ′ corresponding to the feature point P shown in FIG. The coordinates are obtained (Step 3, FIG. 11 (a)). Expressions (6) and (7) show examples of position coordinates ABP (XPab, YPab) on the side A′B ′.

YPab = Up × (Ya−Yb) + Yb (6)
XPab = Xa: Fab = 1 (7)
= (YPab-Sab) / Kab: Fab = 0
When XPab is obtained, the time-consuming division is avoided by the flag Fab obtained by the equation (3), thereby speeding up the processing time.

  Next, the slope KPad, the intercept Sad, and the flag Fad of the straight line connecting the two positions ABP and CDP are obtained in the same manner as in Step 2 (Step 4). Next, correction coordinates P ′ (Xp, Yp) of the feature point P shown in FIG. 11B are obtained in the same manner as in Step 3 based on the coordinate ratio Vp obtained in Expression (2) (Step 5).

  Next, Step 3 to Step 5 are also performed on the feature points Q and R (Step 6). Thereafter, based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74 by the coordinate determination unit 75 and the correction coordinate data of the coordinate correction calculation unit 77 described above, the XY coordinates of the drawing data are created in the memory 72. Save (Step 7). Finally, drawing is performed based on the drawing data (Step 8).

  FIG. 12 shows the result of the simulation of the exposure pattern correction method described above. Choose triangles and circles (56-sided) as typical drawing patterns, typical deformations: enlargement in FIG. 12 (a), reduction in FIG. 12 (b), rotation in FIG. 12 (c), and FIG. 12D shows trapezoidal distortion. As a result, it was able to be corrected with an accuracy less than the drawing resolution.

In the above description, the corrected coordinate P ′ is obtained based on the two sides A′B ′ and C′D ′. Similarly, the corrected coordinate P ′ is obtained based on the two sides B′C ′ and D′ A ′. Also good.
In the above description, the corrected coordinates P ′ are obtained based on the two sides A′B ′ and C′D ′. However, the four sides A′B ′, B′C ′, C′D ′ and D′ A ′ are obtained. The corresponding point of the upper feature point may be obtained, and the correction coordinate P ′ may be obtained from the intersection of two straight lines obtained from the two corresponding points on the opposite side.

  As described above, according to the first example of the present embodiment, since the feature points can be corrected by a simple process based on the coordinate ratio, a simple method for deforming the drawing pattern of the drawing object that occurs in the light beam method Thus, it is possible to provide an exposure apparatus and an exposure method that can be corrected in a short time.

  Next, a second embodiment of a method for creating correction coordinate data will be described. FIG. 13 shows the processing flow. The second embodiment is a method of directly obtaining the correction coordinates of the feature points from the coordinate ratios (U, V) represented by the expressions (1) and (2). In the following description, Steps different from those in the first embodiment will be mainly described.

After acquiring the position coordinate data of the images of the alignment marks A ′, B ′, C ′ and D ′ at Step 1, Step 2 corresponds to the feature points on the two sides A′B ′ and C′D ′ based on the coordinate ratio U. The X position coordinates XPab, XPcd of the positions ABP, CDP (see FIG. 11B) are converted into positions BCP, DAP (corresponding to feature points on the two sides B′C ′, D′ A ′ based on the coordinate ratio V. Y position coordinates YPbc and YPda in FIG. 11 (b) are obtained from equations (8) to (11).
ABP: XPab = Xb + Up × (Xa−Xb) (8)
CDP: XPcd = Xc + Up × (Xd−Xc) (9)
BCP: YPbc = Yb + Vp × (Yc−Yb) (10)
DAP: YPda = Ya + Vp × (Yd−Ya) (11)
Next, in Step 3, the correction coordinates P ′ (Xp, Yp) of the feature point P are obtained from the coordinate ratios V and V and the coordinates from the equations (8) to (11).
Xp = XPab + Vp × (XPcd−XPab) (12)
Yp = YPbc + Vp × (YPda−YPbc) (13)
The processing after Step 4 is the same as FIG. 9 although the Step number is different.

  In this embodiment, no time-consuming division is required, and processing can be performed in a shorter time.

  By using the exposure apparatus or exposure method according to the above-described embodiment of the present invention, a display panel substrate can be manufactured with a high throughput.

  For example, FIG. 14 is a process flow showing an example of a manufacturing process of a TFT substrate of a liquid crystal display device. In the thin film formation step (Step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating step (Step 102), a photoresist is coated by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming step (Step 101). In the exposure step (Step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (Step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching step (Step 105), the portion of the thin film formed in the thin film formation step (Step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (Step 106), the photoresist film that has finished the role of the mask in the etching step (Step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 15 is a process flow showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (Step 201), a black matrix is formed on the substrate by processes such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (Step 202), a colored pattern is formed on the substrate by a staining method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (Step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (Step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the manufacturing process of the TFT substrate shown in FIG. 14, in the exposure process (Step 103), in the manufacturing process of the color filter substrate shown in FIG. 15, the exposure process in the black matrix forming process (Step 201) and the coloring pattern forming process (Step 202). The exposure apparatus or exposure method of the present invention can be applied.

1: Substrate 3: Base 4: X guide 5: X stage 6: Y guide 7: Y stage 8: θ stage 10: Chuck 11: Gate 20: Light beam irradiation device 25: Spatial light modulator (DMD) 27: DMD drive circuit 40: Laser measurement system control device 60: Stage drive circuit 70: Main control device 71: Drawing control unit 72: Memory (drawing data) 73: Bandwidth setting unit 74: Center point coordinate determination unit 75: Coordinate determination Unit 76: Alignment mark detection unit 77: Coordinate correction calculation unit 78: Memory (design data)
A, B, C, D: Alignment marks on design data of the object to be drawn without deformation A ′, B ′, C ′, D ′: Alignment marks of the object to be drawn P, Q, R: Feature points
P ′, Q ′, R ′: deformed feature points.

Claims (15)

A chuck for supporting a substrate coated with a photoresist; a light beam irradiation device for irradiating the substrate supported by the chuck with a light beam; and a moving means for relatively moving the chuck and the light beam irradiation device. And an exposure apparatus that creates drawing data on the substrate and supplies drawing data to the light beam irradiation apparatus, and draws a pattern on the substrate.
An imaging unit that images a plurality of alignment marks provided on the substrate is provided, and the drawing control unit corresponds to a side connected by the plurality of alignment marks imaged by the imaging unit corresponding to the drawing point to be drawn. An exposure apparatus that determines the position of the drawing point based on a coordinate ratio of the drawing point defined in advance and creates the drawing data.   The alignment mark is provided near four corners of the substrate, the sides are four sides of a quadrangle formed by the alignment marks, and the coordinate ratio is determined with respect to the four sides. 2. The exposure apparatus according to 1.   The drawing control means obtains, for each side, a linear expression that defines a set of opposite sides of the four sides, and determines the position of two points corresponding to the drawing point on the opposite side and the linear expression for each side and the opposite side And determining the position of the drawing point based on the second linear expression obtained from the position of the two points and the coordinate ratio of the drawing point of the side adjacent to the opposite side. The exposure apparatus according to claim 2, characterized in that:   The drawing control means obtains a linear expression that defines the four sides, and for each of two pairs of opposite sides constituting the four sides, positions of two points corresponding to the drawing points on the opposite side are determined by the linear expression. And the position of the drawing point is determined as an intersection of two third linear expressions obtained from the positions of the two sets of the two points. 2. The exposure apparatus according to 2.   3. The drawing control unit obtains a position corresponding to the drawing point on the four sides from the coordinate ratio, and determines the position of the drawing point from the position of the corresponding four points. Exposure equipment.   The exposure apparatus according to claim 1, wherein the drawing point is a feature point that defines the pattern.   The exposure apparatus according to claim 1, wherein the light beam irradiation apparatus includes a plurality of spatial light modulators in which a plurality of mirrors are arranged in two orthogonal directions. Chuck a substrate coated with a photoresist, irradiate a light beam with a light beam irradiation device, relatively move the substrate and the light beam irradiation device, create drawing data to be drawn to draw on the substrate, In an exposure method for drawing a pattern on the substrate,
The plurality of alignment marks provided on the substrate are imaged, and the drawing data is created in advance in relation to the drawing points to be drawn. An exposure method comprising: determining the position of the drawing point based on a coordinate ratio of the image and generating the drawing data.   The alignment mark is provided near four corners of the substrate, the sides are four sides of a quadrangle formed by the alignment marks, and the coordinate ratio is determined with respect to the four sides. 9. The exposure method according to 8.   The drawing data is created by obtaining, for each side, a linear expression that defines a set of opposite sides of the four sides, and determining the positions of two points corresponding to the drawing points on the opposite side as the linear expression for each side. The position of the drawing point is determined based on the second linear expression obtained from the position of the two points and the coordinate ratio of the drawing point of the side adjacent to the opposite side. The exposure method according to claim 9.   The drawing data is created by obtaining a linear expression that defines the four sides, and for each of two pairs of opposite sides constituting the four sides, the positions of the two points corresponding to the drawing points on the opposite side are The position of the drawing point is determined as an intersection of two third linear expressions obtained from the position of the two points of the two sets, obtained based on a straight line expression and the coordinate ratio of the opposite side. The exposure method according to claim 9.   10. The drawing data is created by obtaining a position corresponding to the drawing point on the four sides from the coordinate ratio, and determining the position of the drawing point from the position of the corresponding four points. An exposure method according to 1.   The exposure method according to claim 8, wherein the drawing point is a feature point that defines the pattern.   A display panel substrate manufacturing apparatus comprising the exposure apparatus according to claim 1 and manufacturing a display panel substrate.   14. A display panel substrate manufacturing method, comprising: exposing a substrate using the exposure method according to claim 8 to manufacture a display panel substrate.

Images