JP2023100449A - Auxiliary exposure device, exposure method, and memory medium - Google Patents

Abstract

To improve exposure resolution of a target substrate in the periphery of each product area.SOLUTION: An auxiliary exposure device is equipped with a conveying unit, a light source unit, and a condenser lens. The conveying unit conveys a target substrate including a plurality of product areas and a peripheral area located in the periphery of each product area in the first direction. The light source unit is formed by arranging a plurality of light sources in the second direction crossing the first direction and irradiates the target substrate conveyed in the first direction with light. The condenser lens is arranged between the light source unit and the target substrate and condenses the light emitted by the light source unit to the peripheral area extending in the second direction of the target substrate along the first direction.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to an auxiliary exposure device, an exposure method and a storage medium.

2. Description of the Related Art Conventionally, an auxiliary exposure apparatus is known that performs local exposure processing on a resist film coated on a substrate to be processed, in addition to a normal exposure apparatus that transfers, for example, a mask pattern.

For example, Patent Document 1 discloses an auxiliary exposure device having a light source unit in which a plurality of LED (Light Emitting Diode) elements are arranged in a line.

JP 2013-186191 A

The present disclosure provides a technique capable of improving exposure resolution around each product area of a substrate to be processed.

An auxiliary exposure device according to one aspect of the present disclosure includes a transport section, a light source unit, and a condenser lens. The transport unit transports a substrate to be processed including a plurality of product areas and a peripheral area located around each product area in a first direction. The light source unit is formed by arranging a plurality of light sources in a second direction that intersects with the first direction, and irradiates the substrate to be processed transported in the first direction with light. The condensing lens is arranged between the light source unit and the substrate to be processed, and converges, along the first direction, the light emitted by the light source unit onto the peripheral area extending in the second direction of the substrate to be processed.

According to the present disclosure, it is possible to improve the exposure resolution around each product area of the substrate to be processed.

FIG. 1 is a schematic plan view showing the configuration of the substrate processing system according to the first embodiment. FIG. 2 is a flow chart showing a processing procedure of all steps for one glass substrate in the substrate processing system. FIG. 3 is a diagram showing the configuration of the glass substrate according to the first embodiment. FIG. 4 is a view of the auxiliary exposure device according to the first embodiment as seen from the left-right direction. FIG. 5 is a front-rear view of the auxiliary exposure device according to the first embodiment. FIG. 6 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device according to the first embodiment. FIG. 7 is a diagram showing the configuration of a glass substrate according to the second embodiment. FIG. 8 is a view of the auxiliary exposure device according to the second embodiment as seen from the left-right direction. FIG. 9 is a front-rear view of the auxiliary exposure device according to the second embodiment. FIG. 10 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device according to the second embodiment. 11A and 11B are diagrams of the auxiliary exposure device according to the third embodiment as seen from the left-right direction. 12A and 12B are front and rear views of the auxiliary exposure device according to the third embodiment. FIG. 13 is an explanatory diagram showing an example of the processing operation by the auxiliary exposure device according to the third embodiment. 14A and 14B are diagrams of the auxiliary exposure device according to the fourth embodiment as seen from the left and right direction. 15A and 15B are front and rear views of the auxiliary exposure device according to the fourth embodiment. FIG. 16 is an explanatory diagram showing an example of the processing operation by the auxiliary exposure device according to the fourth embodiment.

Embodiments for implementing the nozzle, auxiliary exposure device, exposure method, and storage medium according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail below with reference to the drawings. Note that the present disclosure is not limited by this embodiment. Further, each embodiment can be appropriately combined within a range that does not contradict the processing contents. Also, in each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

Further, in the embodiments described below, expressions such as "constant", "perpendicular", "perpendicular" or "parallel" may be used, but these expressions are strictly "constant", "perpendicular", " It does not have to be "perpendicular" or "parallel". That is, each of the expressions described above allows deviations in, for example, manufacturing accuracy and installation accuracy.

In addition, in each drawing referred to below, in order to make the explanation easier to understand, an orthogonal coordinate system is shown in which the X-axis direction, the Y-axis direction and the Z-axis direction that are orthogonal to each other are defined, and the Z-axis positive direction is the vertically upward direction. Sometimes.

Here, the front-rear direction is defined with the positive direction of the X-axis as the front and the negative direction of the X-axis as the rear, and the left-right direction with the positive direction of the Y-axis as the left and the negative direction of the Y-axis as the right. . A vertical direction is defined in which the positive direction of the Z-axis is upward and the negative direction of the Z-axis is downward.

By the way, the exposure resolution in the case of using the LED element may be restricted by the expansion of the light emitted from the LED element. For example, when local exposure processing is performed on the peripheral area located around each product area on the substrate to be processed, the irradiation range of the light emitted from the LED element is expanded from the peripheral area to each product area. Due to the overlap, the exposure resolution is reduced around each product area.

Therefore, it is expected to improve the exposure resolution around each product area of the substrate to be processed.

(First embodiment)
<Configuration of substrate processing system>
A configuration of a substrate processing system 100 according to the first embodiment will be described with reference to FIG. FIG. 1 is a schematic plan view showing the configuration of a substrate processing system 100 according to the first embodiment.

A substrate processing system 100 is installed in a clean room. The substrate processing system 100 uses, for example, a glass substrate G for an LCD (Liquid Crystal Display) as a substrate to be processed, and performs a series of processes such as cleaning during the photolithography process, resist coating, pre-baking, development and post-baking in the LCD manufacturing process. . Exposure processing is performed by an external exposure apparatus 20 (EXP) installed adjacent to the substrate processing system 100 .

The substrate processing system 100 includes a cassette station 1 and a loading section 2 (IN PASS). Further, the substrate processing system 100 includes a cleaning device 3 (SCR), a first drying section 4 (DR), a first cooling section 5 (COL), a coating device 6 (COT), and a second drying section 7 ( DR), a pre-baking section 8 (PRE BAKE), and a second cooling section 9 (COL). The substrate processing system 100 also includes an interface station 10 and an auxiliary exposure apparatus 11 (AE). The substrate processing system 100 also includes a developing device 12 (DEV), a post-baking section 13 (POST BAKE), a third cooling section 14 (COL), an inspection section 15 (IP), and an unloading section 16 (OUT PASS). and a control unit 17 .

Between the cassette station 1 and the interface station 10, a forward transport path is provided for transporting the glass substrate G from the cassette station 1 to the interface station 10. As shown in FIG. On the outward transport path, a loading section 2, a cleaning device 3, a first drying section 4, a first cooling section 5, a coating device 6, a second drying section 7, a pre-baking section 8 and a second cooling section 9 are arranged in a cassette station. 1 toward the interface station 10 in this order.

Between the cassette station 1 and the interface station 10, a transport return path for transporting the glass substrate G from the interface station 10 to the cassette station 1 is provided. An auxiliary exposure device 11, a developing device 12, a post-baking section 13, a third cooling section 14, an inspection section 15, and an unloading section 16 are arranged in this order from the interface station 10 toward the cassette station 1 on the return path. ing. In addition, the forward transportation path and the backward transportation path are configured by, for example, a roller transportation path or the like.

The cassette station 1 is a port for loading and unloading cassettes C containing a plurality of glass substrates G stacked in multiple layers. The cassette station 1 includes a cassette stage 1a on which, for example, four can be placed side by side in one horizontal direction (Y-axis direction), and a transfer device 1b for taking in and out the glass substrates G from/to the cassettes C on the cassette stage 1a. Prepare. The transport device 1b has a transport arm that holds the glass substrate G, is operable along the four axes of X, Y, Z, and θ, and communicates with the adjacent cassette stage 1a, loading unit 2, and unloading unit 16. The glass substrate G can be transferred.

The interface station 10 comprises a transport device 10a. The transport device 10a has a transport arm that holds the glass substrate G, is operable along four axes of X, Y, Z, and .theta. The glass substrate G can be delivered between. In addition to the transport device 10a, the interface station 10 may be provided with devices such as a peripheral exposure device and a titler. The peripheral exposure device performs an exposure process for removing the resist adhering to the peripheral portion of the glass substrate G during development. The titler records predetermined information on a predetermined portion on the glass substrate G. FIG.

The control unit 17 is, for example, a CPU (Central Processing Unit), and controls the entire substrate processing system 100 by reading and executing a program (not shown) stored in a storage unit (not shown). The control unit 17 may be composed only of hardware without using a program.

FIG. 2 is a flow chart showing a processing procedure of all processes for one glass substrate G in the substrate processing system 100. As shown in FIG. First, in the cassette station 1, the transfer device 1b takes out the glass substrates G from any one of the cassettes C on the cassette stage 1a, and carries the taken out glass substrates G into the carry-in section 2 (step S101).

The glass substrate G loaded into the carry-in unit 2 is transported on the outward transport path and loaded into the cleaning device 3 to be subjected to cleaning processing (step S102). Here, the cleaning device 3 removes particulate contaminants from the surface of the substrate by brushing or blowing the glass substrate G, which moves horizontally on the forward transport path, and then rinses the glass substrate. After completing a series of cleaning processes in the cleaning device 3 , the glass substrate G is carried into the first drying section 4 .

Subsequently, the glass substrate G is subjected to a predetermined drying process in the first drying section 4 (step S103), and then carried into the first cooling section 5 and cooled to a predetermined temperature (step S104). After that, the glass substrate G is carried into the coating device 6 .

In the coating device 6, the glass substrate G is coated with a resist liquid on the substrate upper surface (processed surface) by, for example, a spinless method using a slit nozzle (step S105). After that, the glass substrate G is carried into the second drying section 7 and is subjected to a drying process at room temperature by, for example, reduced pressure (step S106).

The glass substrate G carried out from the second drying section 7 is carried into the pre-baking section 8 and heated at a predetermined temperature in the pre-baking section 8 (step S107). By this treatment, the solvent remaining in the resist film on the glass substrate G is evaporated and removed, and the adhesion of the resist film to the glass substrate G is strengthened.

Subsequently, the glass substrate G is carried into the second cooling unit 9 and cooled to a predetermined temperature in the second cooling unit 9 (step S108). After that, the glass substrate G is carried into the exposure device 20 by the transfer device 10 a of the interface station 10 . Note that the glass substrate G may be carried into a peripheral exposure device (not shown) before being carried into the exposure device 20 .

In the exposure device 20, a predetermined circuit pattern is exposed on the resist on the glass substrate G (step S109). After pattern exposure, the glass substrate G is unloaded from the exposure device 20 and loaded into the auxiliary exposure device 11 by the transport device 10 a of the interface station 10 . Note that the glass substrate G may be carried into a titler (not shown) before being carried into the auxiliary exposure device 11 .

In the auxiliary exposure apparatus 11, the glass substrate G after exposure processing is subjected to local exposure processing for improving the uniformity of the film thickness and line width of the resist pattern obtained after development processing (hereinafter referred to as “auxiliary exposure processing” as appropriate). ) is performed (step S110). The glass substrate G that has undergone the auxiliary exposure process is carried into the developing device 12, and undergoes a series of developing processes including development, rinsing and drying in the development device 12 (step S111).

The glass substrate G that has undergone the development processing is carried into the post-baking section 13, and is subjected to heat treatment after the development processing in the post-baking section 13 (step S112). As a result, the developing solution and cleaning solution remaining on the resist film of the glass substrate G are evaporated and removed, and the adhesion of the resist pattern to the substrate is strengthened. After that, the glass substrate G is carried into the third cooling unit 14 and cooled to a predetermined temperature in the third cooling unit 14 (step S113).

Subsequently, the glass substrate G is carried into the inspection section 15 . In the inspection unit 15, non-contact line width inspection, film quality/film thickness inspection, and the like are performed on the resist pattern on the glass substrate G (step S114). The inspection result of the inspection unit 15 is output to the control unit 17 and stored in a storage unit (not shown) by the control unit 17 .

The carry-out section 16 receives the inspected glass substrate G from the inspection section 15 and delivers it to the transport device 1 b of the cassette station 1 . The transport device 1b accommodates the processed glass substrates G received from the unloading unit 16 in the cassette C (step S115). Thus, all steps of substrate processing for one glass substrate G are completed.

<Structure of Glass Substrate>
Next, the configuration of the glass substrate G according to the first embodiment will be described with reference to FIG. FIG. 3 is a diagram showing the configuration of the glass substrate G according to the first embodiment. As shown in FIG. 3, the glass substrate G includes a plurality of (here, eight) product areas A1 and a peripheral area A2 positioned around each product area A1.

The product area A1 is a resist area in which a circuit pattern corresponding to the LCD is formed. A plurality of product areas A1 are arranged on the glass substrate G in a matrix.

The peripheral area A2 is a resist area in which a circuit pattern corresponding to a drive circuit for driving the LCD (hereinafter referred to as "drive circuit pattern" as appropriate) is formed. The peripheral area A2 includes a first peripheral area A2a and a second peripheral area A2b. The first peripheral area A2a extends in the horizontal direction (Y-axis direction) crossing the scanning direction of the glass substrate G in the auxiliary exposure device 11 (X-axis negative direction, see FIG. 4). The second peripheral area A2b extends in the scanning direction of the glass substrate G in the auxiliary exposure device 11 (X-axis negative direction). On the glass substrate G, a drive circuit pattern is formed in the first peripheral area A2a or the second peripheral area A2b. In this embodiment, a drive circuit pattern is formed in each of the three first peripheral areas A2a. In FIG. 3, the drive circuit patterns formed in each of the three first peripheral areas A2a are indicated by oblique lines.

<Structure of Auxiliary Exposure Device>
Next, the configuration of the auxiliary exposure device 11 according to the first embodiment will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a view of the auxiliary exposure device 11 according to the first embodiment viewed from the left and right direction. FIG. 5 is a front-rear view of the auxiliary exposure device according to the first embodiment.

As shown in FIG. 4 , the auxiliary exposure device 11 includes a flat-flow transport section 30 that transports the glass substrate G in the scanning direction (X-axis negative direction), and a resist on the glass substrate G transported by the flat-flow transport section 30 . and a light source unit 32 for irradiating light, specifically ultraviolet rays (UV) of a predetermined wavelength. The auxiliary exposure apparatus 11 also includes a control section 17 for controlling each section within the apparatus, and a memory 42 for storing or storing various programs and data used by the control section 17 .

The flat-flow conveying unit 30 includes, for example, a roller conveying path 46 formed by laying a large number of rollers 44 in the conveying direction, and each roller 44 for conveying the glass substrate G on the roller conveying path 46 by belts, gears, or the like. and a scanning drive unit 50 that is rotationally driven via a transmission mechanism 48 . The roller transport path 46 constitutes part of the return transport path from the interface station 10 to the cassette station 1 in the substrate processing system 100 shown in FIG.

The flat-flow conveying unit 30 carries the glass substrate G after the exposure processing into the auxiliary exposure device 11 in a flat flow, and conveys the glass substrate G in a flat flow for scanning of the auxiliary exposure processing in the auxiliary exposure device 11. , the glass substrate G that has undergone the auxiliary exposure process is carried out to the developing device 12 in a flat flow. The controller 17 can detect or ascertain the current position of the glass substrate G through position sensors (not shown) disposed at various locations along the roller conveying path 46 .

The light source unit 32 is arranged above the roller transport path 46 and supported by a support member (not shown). As shown in FIG. 5, the light source unit 32 is formed by arranging a plurality of light sources 321 in the horizontal direction (Y-axis direction) intersecting the scanning direction. The light source 321 emits ultraviolet rays (UV). The light source 321 is, for example, an LED element. Other light sources such as a laser beam generator may be used as the light source 321 . The light source unit 32 can individually turn on and off the plurality of light sources 321 . The light source unit 32 irradiates the glass substrate G conveyed in the scanning direction (X-axis negative direction) with light.

By the way, in the auxiliary exposure device 11, the exposure resolution when using the light source 321, which is an LED element, may be restricted by the expansion of the light emitted from the light source 321. FIG. For example, when local exposure processing is performed on the first peripheral area A2a (see FIG. 3) of the glass substrate G, the irradiation range of the light emitted from the light source 321 is expanded from the first peripheral area A2a and each Since it overlaps with the product area A1, the exposure resolution around each product area A1 is lowered.

Therefore, as shown in FIGS. 4 and 5, the auxiliary exposure device 11 according to the present embodiment has a condenser lens 34 arranged between the light source unit 32 and the glass substrate G. As shown in FIGS. The condensing lens 34 is, for example, a linear Fresnel lens having condensing properties in the scanning direction (X-axis negative direction). The condensing lens 34 collects the light emitted from the light source unit 32 to the first peripheral area A2a of the glass substrate G along the scanning direction (X-axis negative direction).

Specifically, the condenser lens 34 directs the light emitted from the light source unit 32 along the scanning direction (X-axis negative direction) to the first peripheral area A2a of the glass substrate G passing below the light source unit 32. to reduce and project.

With such a condensing lens 34, the irradiation range of the light emitted from the light source unit 32 can be contained within the range of the first peripheral area A2a of the glass substrate G. As shown in FIG. In other words, by using the condensing lens 34, it is possible to avoid overlap between the irradiation range of the light emitted from the light source unit 32 to the first peripheral area A2a of the glass substrate G and each product area A1. Therefore, according to the auxiliary exposure apparatus 11 according to the present embodiment, the exposure around each product area A1 of the glass substrate G can be performed as compared with the conventional auxiliary exposure apparatus which is restricted by the expansion of the light emitted from the LED element. Resolution can be improved. In particular, according to the auxiliary exposure device 11 according to this embodiment, the exposure resolution in the first peripheral area A2a extending in the horizontal direction (Y-axis direction) of the glass substrate G can be improved.

<Processing operation by auxiliary exposure device>
Next, processing operations by the auxiliary exposure device 11 according to the first embodiment will be described with reference to FIG. FIG. 6 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device 11 according to the first embodiment.

The control unit 17 controls the flat-flow conveying unit 30 to convey the glass substrate G in the scanning direction (X-axis negative direction). When performing auxiliary exposure processing on the first peripheral area A2a extending in the left-right direction (Y-axis direction) of the glass substrate G, the control unit 17 controls the light source unit 32 at a position where the first peripheral area A2a and the condenser lens 34 face each other. irradiates the first peripheral area A2a with light. As a result, the light emitted from the light source unit 32 is reduced along the scanning direction (X-axis negative direction) by the condenser lens 34 each time the first peripheral area A2a of the glass substrate G and the condenser lens 34 face each other. and projected onto the first peripheral area A2a. In the example of FIG. 6, three positions where the first peripheral area A2a and the condenser lens 34 face each other are indicated by dashed lines.

In this manner, when performing auxiliary exposure processing on the first peripheral area A2a of the glass substrate G, the control unit 17 of the auxiliary exposure device 11 controls the light source unit 32 at the position where the first peripheral area A2a and the condenser lens 34 face each other. You may irradiate light to 1st peripheral area A2a by. By doing so, the light emitted from the light source unit 32 is directed by the condenser lens 34 along the scanning direction (X-axis negative direction) at each position where the first peripheral area A2a and the condenser lens 34 face each other. Due to the reduction, the exposure resolution along the scanning direction can be improved.

(Second embodiment)
By the way, in the glass substrate G, the drive circuit pattern may be formed in the second peripheral area A2b instead of the first peripheral area A2a. In this case, the second peripheral area A2b in which the drive circuit pattern is formed is subject to the auxiliary exposure process.

Before describing the configuration of the auxiliary exposure device 11 according to the second embodiment, the configuration of the glass substrate G according to the second embodiment will be described below with reference to FIG. FIG. 7 is a diagram showing the structure of the glass substrate G according to the second embodiment. In the glass substrate G shown in FIG. 7, a drive circuit pattern is formed in the second peripheral area A2b. In this embodiment, a drive circuit pattern is formed in each of the three second peripheral areas A2b. In FIG. 7, the drive circuit patterns formed in each of the three second peripheral areas A2b are indicated by oblique lines.

The configuration of the glass substrate G according to the second embodiment may be the same as the configuration of the glass substrate G according to the first embodiment shown in FIG. That is, in the glass substrate G, the drive circuit pattern may be formed in the first peripheral area A2a. In this case, the first peripheral area A2a in which the drive circuit pattern is formed is subject to the auxiliary exposure process. Data for specifying areas to be subjected to auxiliary exposure processing are stored in advance in the memory 42 .

Next, the configuration of the auxiliary exposure device 11 according to the second embodiment will be described with reference to FIGS. 8 and 9. FIG. FIG. 8 is a view of the auxiliary exposure device 11 according to the second embodiment as seen from the left and right direction. FIG. 9 is a front-rear view of the auxiliary exposure device 11 according to the second embodiment.

The auxiliary exposure device 11 shown in FIGS. 8 and 9 includes a local light source 33 and a local condenser lens 35 in addition to the configuration shown in FIG.

The local light source 33 is arranged at a position corresponding to the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G and supported by a supporting member (not shown). The arrangement position of the local light source 33 can be finely adjusted by a position adjusting mechanism (not shown). A local light source 33 emits ultraviolet (UV) light. The local light source 33 is, for example, an LED element. Other light sources such as a laser beam generator may be used as the local light source 33 . The local light source 33 irradiates the glass substrate G conveyed in the scanning direction (X-axis negative direction) with light.

A local condensing lens 35 is arranged between the local light source 33 and the glass substrate G. FIG. The local condensing lens 35 is, for example, a linear Fresnel lens that condenses light in the horizontal direction (Y-axis direction). The local condensing lens 35 converges the light emitted from the local light source 33 onto the second peripheral area A2b of the glass substrate G along the left-right direction (Y-axis direction).

Specifically, the local condensing lens 35 directs the light emitted from the local light source 33 along the left-right direction (Y-axis direction) to the second peripheral area A2b of the glass substrate G passing below the local light source 33. to reduce and project.

With such a local condensing lens 35, the irradiation range of the light emitted from the local light source 33 can be contained within the range of the second peripheral area A2b of the glass substrate G. As shown in FIG. In other words, by using the local light source 33 and the local condensing lens 35, the irradiation range of the light irradiated to the second peripheral area A2b of the glass substrate G by the local light source 33 and the product areas A1 are prevented from overlapping each other. can be done. Therefore, according to the auxiliary exposure apparatus 11 according to the present embodiment, the exposure around each product area A1 of the glass substrate G can be performed as compared with the conventional auxiliary exposure apparatus which is restricted by the expansion of the light emitted from the LED element. Resolution can be improved. In particular, according to the auxiliary exposure device 11 according to the present embodiment, the exposure resolution in the second peripheral area A2b extending in the scanning direction of the glass substrate G (X-axis negative direction) can be improved.

Next, processing operations by the auxiliary exposure device 11 according to the second embodiment will be described with reference to FIG. FIG. 10 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device 11 according to the second embodiment.

The control unit 17 controls the flat-flow conveying unit 30 to convey the glass substrate G in the scanning direction (X-axis negative direction). The control unit 17 refers to the memory 42 and designates one of the first peripheral area A2a and the second peripheral area A2b as the target of the auxiliary exposure process based on the data for specifying the target area of the auxiliary exposure process. Identify as

When performing auxiliary exposure processing on the first peripheral area A2a extending in the left-right direction (Y-axis direction) of the glass substrate G, the control unit 17 controls the light source unit 32 at a position where the first peripheral area A2a and the condenser lens 34 face each other. irradiates the first peripheral area A2a with light. As a result, at each position where the first peripheral area A2a of the glass substrate G and the condenser lens 34 face each other, the light emitted from the light source unit 32 is directed by the condenser lens 34 along the scanning direction (X-axis negative direction). It is reduced and projected onto the first peripheral area A2a. The controller 17 turns off the local light source 33 while the light source unit 32 irradiates the first peripheral area A2a with light.

On the other hand, when performing auxiliary exposure processing on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the control unit 17 controls the second peripheral area A2b by the local light source 33 as shown in FIG. irradiate the light. As a result, the light emitted from the local light source 33 is reduced in the horizontal direction (Y-axis direction) by the local condenser lens 35 and projected onto the second peripheral area A2b. The controller 17 turns off the light source unit 32 while the local light source 33 irradiates the second peripheral area A2b with light. In the example of FIG. 10, the positions of the local light source 33 and the local condenser lens 35 that irradiate the second peripheral area A2b are indicated by dashed lines.

In this manner, when performing auxiliary exposure processing on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the control unit 17 of the auxiliary exposure device 11 uses the local light source 33 to may be irradiated with light. By doing so, the light emitted from the local light source 33 is reduced in the horizontal direction (Y-axis direction) by the local condenser lens 35, so that the exposure resolution in the horizontal direction can be improved. can.

(Third Embodiment)

Next, the configuration of the auxiliary exposure device 11 according to the third embodiment will be described with reference to FIGS. 11 and 12. FIG. FIG. 11 is a view of the auxiliary exposure device 11 according to the third embodiment as seen from the left-right direction. FIG. 12 is a front-rear view of the auxiliary exposure device 11 according to the third embodiment. The auxiliary exposure apparatus 11 according to the third embodiment performs auxiliary exposure processing on the second peripheral area A2b of the glass substrate G in addition to the configuration for performing the auxiliary exposure processing on the first peripheral area A2a of the glass substrate G. differs from the first embodiment in that it has a configuration of

The auxiliary exposure device 11 shown in FIGS. 11 and 12 includes a mask member 36 and a moving section 37 in addition to the configuration shown in FIG.

The mask member 36 is arranged between the condenser lens 34 and the glass substrate G. As shown in FIG. The mask member 36 shields other areas adjacent to the second peripheral area A2b (see FIG. 7) extending in the scanning direction of the glass substrate G (X-axis negative direction). The mask member 36 has a slit narrower than the second peripheral area A2b at a position corresponding to the second peripheral area A2b of the glass substrate G. As shown in FIG.

The moving part 37 moves the mask member 36 between a processing position between the condenser lens 34 and the glass substrate G and a predetermined retracted position. The examples of FIGS. 11 and 12 show the mask member 36 positioned in the processing position.

As shown in FIG. 12, the light source unit 32 according to this embodiment irradiates the second peripheral area A2b of the glass substrate G with light through the mask member 36 positioned at the processing position. Light emitted by the light source unit 32 passes through the slits of the mask member 36 . With this mask member 36, the irradiation range of the light emitted by the light source unit 32 can be contained within the range of the second peripheral area A2b of the glass substrate G. As shown in FIG. In other words, by using the mask member 36, it is possible to avoid overlapping of the irradiation range of the light emitted from the light source unit 32 to the second peripheral area A2b of the glass substrate G and each product area A1. Therefore, according to the auxiliary exposure apparatus 11 according to the present embodiment, the exposure around each product area A1 of the glass substrate G can be performed as compared with the conventional auxiliary exposure apparatus which is restricted by the expansion of the light emitted from the LED element. Resolution can be improved. In particular, according to the auxiliary exposure device 11 according to the present embodiment, the exposure resolution in the second peripheral area A2b extending in the scanning direction of the glass substrate G (X-axis negative direction) can be improved.

Next, processing operations by the auxiliary exposure device 11 according to the third embodiment will be described with reference to FIG. FIG. 13 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device 11 according to the third embodiment.

The control unit 17 controls the flat-flow conveying unit 30 to convey the glass substrate G in the scanning direction (X-axis negative direction). The control unit 17 refers to the memory 42 and designates one of the first peripheral area A2a and the second peripheral area A2b as the target of the auxiliary exposure process based on the data for specifying the target area of the auxiliary exposure process. Identify as

When performing auxiliary exposure processing on the first peripheral area A2a extending in the left-right direction (Y-axis direction) of the glass substrate G, the control unit 17 causes the moving unit 37 to retract the mask member 36 to the retracted position. In the example of FIG. 13, the mask member 36 located at the retracted position is indicated by broken lines. Then, the control unit 17 causes the light source unit 32 to irradiate the first peripheral area A2a with light at a position where the first peripheral area A2a and the condenser lens 34 face each other. As a result, at each position where the first peripheral area A2a of the glass substrate G and the condenser lens 34 face each other, the light emitted from the light source unit 32 is directed by the condenser lens 34 along the scanning direction (X-axis negative direction). It is reduced and projected onto the first peripheral area A2a.

On the other hand, when performing auxiliary exposure processing on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the control unit 17 moves the moving unit 37 from the retracted position to the processing position as shown in FIG. , the mask member 36 is moved. Then, the control section 17 irradiates the second peripheral area A2b with light from the light source unit 32 through the mask member 36 positioned at the processing position. As a result, the light emitted from the light source unit 32 is narrowed by the mask member 36 along the left-right direction (Y-axis direction) and projected onto the second peripheral area A2b.

In this way, when performing auxiliary exposure processing on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the control unit 17 of the auxiliary exposure device 11 controls the light source unit 32 to expose the light source unit 32 through the mask member 36. light may be applied to the second peripheral area A2b. By doing so, the light emitted from the light source unit 32 is focused along the left-right direction (Y-axis direction) by the mask member 36, so that the exposure resolution along the left-right direction can be improved.

(Fourth embodiment)
Next, the configuration of the auxiliary exposure device 11 according to the fourth embodiment will be described with reference to FIGS. 14 and 15. FIG. 14A and 14B are diagrams of the auxiliary exposure device 11 according to the fourth embodiment as seen from the left-right direction. FIG. 15 is a diagram of the auxiliary exposure device 11 according to the fourth embodiment as seen from the front-rear direction. The auxiliary exposure apparatus 11 according to the fourth embodiment performs auxiliary exposure processing on the second peripheral area A2b of the glass substrate G in addition to the configuration for performing the auxiliary exposure processing on the first peripheral area A2a of the glass substrate G. differs from the first embodiment in that it has a configuration of

The auxiliary exposure device 11 shown in FIGS. 14 and 15 includes a liquid crystal module 38 in addition to the configuration shown in FIG.

The liquid crystal module 38 is arranged between the condensing lens 34 and the glass substrate G. As shown in FIG. The liquid crystal module 38 is a transmissive liquid crystal module formed by arranging a plurality of transmissive liquid crystal elements in a matrix. The liquid crystal module 38 has a transmission mode in which the glass substrate G is not shielded, and a shielding mode in which another area adjacent to the second peripheral area A2b (see FIG. 7) extending in the scanning direction (X-axis negative direction) of the glass substrate G is shielded. It is possible to transition between A transition between the transmission mode and the shield mode in the liquid crystal module 38 is performed according to control by the control section 17 . The shielding mode liquid crystal module 38 forms a slit narrower than the second peripheral area A2b at a position of the glass substrate G corresponding to the second peripheral area A2b. In the example of FIG. 15, a shielded mode liquid crystal module 38 is shown.

As shown in FIG. 15, the light source unit 32 according to this embodiment irradiates the second peripheral area A2b of the glass substrate G with light through the shield mode liquid crystal module 38 . Light emitted by the light source unit 32 passes through the slits of the liquid crystal module 38 . In such a liquid crystal module 38, the irradiation range of the light emitted by the light source unit 32 can be contained within the range of the second peripheral area A2b of the glass substrate G. As shown in FIG. In other words, by using the liquid crystal module 38, it is possible to avoid overlapping of the irradiation range of the light emitted from the light source unit 32 to the second peripheral area A2b of the glass substrate G and each product area A1. Therefore, according to the auxiliary exposure apparatus 11 according to the present embodiment, the exposure around each product area A1 of the glass substrate G can be performed as compared with the conventional auxiliary exposure apparatus which is restricted by the expansion of the light emitted from the LED element. Resolution can be improved. In particular, according to the auxiliary exposure device 11 according to the present embodiment, the exposure resolution in the second peripheral area A2b extending in the scanning direction of the glass substrate G (X-axis negative direction) can be improved.

Next, processing operations by the auxiliary exposure device 11 according to the fourth embodiment will be described with reference to FIG. FIG. 16 is an explanatory diagram showing an example of processing operations by the auxiliary exposure device 11 according to the fourth embodiment.

The control unit 17 controls the flat-flow conveying unit 30 to convey the glass substrate G in the scanning direction (X-axis negative direction). The control unit 17 refers to the memory 42 and designates one of the first peripheral area A2a and the second peripheral area A2b as the target of the auxiliary exposure process based on the data for specifying the target area of the auxiliary exposure process. Identify as

When performing auxiliary exposure processing on the first peripheral area A2a extending in the left-right direction (Y-axis direction) of the glass substrate G, the control unit 17 causes the liquid crystal module 38 to transition to the transmission mode. Then, the control unit 17 irradiates the first peripheral area A2a with light from the light source unit 32 through the transmission mode liquid crystal module 38 at a position where the first peripheral area A2a and the condenser lens 34 face each other. As a result, at each position where the first peripheral area A2a of the glass substrate G and the condenser lens 34 face each other, the light emitted from the light source unit 32 is directed by the condenser lens 34 along the scanning direction (X-axis negative direction). It is reduced and projected onto the first peripheral area A2a.

On the other hand, when performing auxiliary exposure processing on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the control unit 17 causes the liquid crystal module 38 to transition to the shielding mode as shown in FIG. . Then, the control unit 17 causes the light source unit 32 to irradiate the second peripheral area A2b with light through the liquid crystal module 38 in the shielding mode. As a result, the light emitted from the light source unit 32 is focused by the liquid crystal module 38 along the horizontal direction (Y-axis direction) and projected onto the second peripheral area A2b.

In this way, when the control unit 17 of the auxiliary exposure device 11 performs the auxiliary exposure process on the second peripheral area A2b extending in the scanning direction (X-axis negative direction) of the glass substrate G, the light source unit 32 controls the light source unit 32 through the liquid crystal module 38 to perform the auxiliary exposure process. light may be applied to the second peripheral area A2b. By doing so, the light emitted from the light source unit 32 is focused along the horizontal direction (Y-axis direction) by the liquid crystal module 38, so that the exposure resolution along the horizontal direction can be improved.

<Modification>
In the first embodiment described above, an example in which auxiliary exposure processing is performed on the first peripheral area A2a extending in the horizontal direction (Y-axis direction) of the glass substrate G has been described. However, while the glass substrate G is transported in the scanning direction (X-axis negative direction), the auxiliary exposure process may be continuously performed on the first peripheral area A2a and each product area A1. In this case, for example, the control unit 17 of the auxiliary exposure device 11 may perform the following processing while the glass substrate G is transported in the scanning direction (X-axis negative direction). That is, the control unit 17 causes the light source unit 32 to illuminate the first peripheral area A2a at the first illuminance at a position where the first peripheral area A2a extending in the left-right direction (Y-axis direction) of the glass substrate G and the condenser lens 34 face each other. Irradiate with light. Further, the control unit 17 irradiates each product area A1 with a second illuminance different from the first illuminance by the light source unit 32 at a position where each product area A1 of the glass substrate G and the condenser lens 34 face each other. In this way, while the glass substrate G is transported in the scanning direction (X-axis negative direction), the auxiliary exposure process is continuously performed on the first peripheral area A2a and each product area A1. processing efficiency can be improved.

<Other Modifications>
In each of the embodiments described above, the flat-flow conveying unit 30 that conveys the glass substrate G in a flat-flow manner was provided, and the light source unit 32 was fixed at a fixed position in the scanning direction. However, a scanning method in which the glass substrate G is fixed to a stage, for example, and the light source unit 32 is moved in the scanning direction on the stage, or a scanning method in which both the glass substrate G and the light source unit 32 are moved can also be realized.

Further, in each of the above-described embodiments, the substrate to be processed is a glass substrate for FPD, but it is not limited to this, and other substrates for flat panel displays, semiconductor wafers, organic EL, and various substrates for solar cells. , a CD board, a photomask, a printed board, or the like.

As described above, the auxiliary exposure device (for example, auxiliary exposure device 11) according to the embodiment includes a transport section (for example, flat-flow transport section 30), a light source unit (for example, light source unit 32), and a condenser lens. (eg, condenser lens 34). The transport unit moves a substrate to be processed (eg, a glass substrate G) including a plurality of product areas (eg, product area A1) and a peripheral area (eg, peripheral area A2) located around each product area in a first direction ( for example, in the scanning direction). The light source unit is formed by arranging a plurality of light sources (e.g., light sources 321) in a second direction (e.g., left-right direction) that intersects with the first direction, and irradiates the substrate to be processed transported in the first direction with light. do. The condensing lens is arranged between the light source unit and the substrate to be processed, and directs the light emitted by the light source unit to a peripheral area (first peripheral area A2a) extending in the second direction of the substrate to be processed, along the first direction. to focus. Therefore, according to the auxiliary exposure apparatus according to the embodiment, it is possible to improve the exposure resolution around each product area of the substrate to be processed.

In addition, the auxiliary exposure device according to the embodiment may further include a local light source (for example, local light source 33) and a local condenser lens (for example, local condenser lens 35). The local light source may be arranged at a position corresponding to a peripheral area (for example, a second peripheral area A2b) extending in the first direction of the substrate to be processed, and irradiate the substrate to be processed transported in the first direction with light. . The local condensing lens is arranged between the local light source and the substrate to be processed, and condenses the light irradiated by the local light source to the peripheral area extending in the first direction of the substrate to be processed along the second direction. good. Therefore, according to the auxiliary exposure apparatus according to the embodiment, it is possible to improve the exposure resolution in the peripheral area extending in the first direction of the substrate to be processed.

Further, the auxiliary exposure apparatus according to the embodiment may further include a control section (for example, control section 17) that controls each section. When performing exposure processing (for example, local exposure processing) on a peripheral area extending in the second direction of the substrate to be processed, the control unit causes the light source unit to irradiate the peripheral area with light at a position where the peripheral area and the condenser lens face each other. You may Further, when performing the exposure processing on the peripheral area extending in the first direction of the substrate to be processed, the control unit may irradiate the peripheral area with light from the local light source. Therefore, according to the auxiliary exposure apparatus according to the embodiment, since the light emitted from the local light source is reduced along the second direction by the local condenser lens, the exposure resolution along the second direction can be improved. can be done.

Further, the auxiliary exposure apparatus according to the embodiment includes a mask member (for example, a A mask member 36) may also be provided. Further, the light source unit may irradiate the peripheral area extending in the first direction of the substrate to be processed with light through the mask member. Therefore, according to the auxiliary exposure apparatus according to the embodiment, it is possible to improve the exposure resolution in the peripheral area extending in the first direction of the substrate to be processed.

Further, the auxiliary exposure apparatus according to the embodiment includes a moving unit (for example, moving unit 37 ) and a control unit (for example, control unit 17) that controls each unit. When exposure processing is performed on the peripheral area extending in the second direction of the substrate to be processed, the control unit retracts the mask member to the retracted position by the moving unit, and moves the mask member to the retracted position by the light source unit at a position where the condenser lens and the peripheral area face each other. The area may be illuminated. Further, when performing exposure processing on a peripheral area extending in the first direction of the substrate to be processed, the control unit moves the mask member from the retracted position to the processing position by the moving unit, and moves the mask member positioned at the processing position by the light source unit. The surrounding area may be irradiated with light through. Therefore, according to the auxiliary exposure apparatus according to the embodiment, since the light emitted from the light source unit is focused along the second direction by the mask member, the exposure resolution along the second direction can be improved. .

Further, the auxiliary exposure apparatus according to the embodiment is arranged between the condenser lens and the substrate to be processed, and has a first mode (for example, transmission mode) in which the substrate to be processed is not shielded, and an auxiliary exposure device in a first direction of the substrate to be processed. A liquid crystal module (eg, liquid crystal module 38) may also be provided that is transitionable between a second mode (eg, a shielding mode) that shields other areas adjacent to the extended peripheral area. Further, the light source unit may irradiate the peripheral area of the substrate to be processed extending in the first direction through the second mode liquid crystal module. Therefore, according to the auxiliary exposure apparatus according to the embodiment, it is possible to improve the exposure resolution in the peripheral area extending in the first direction of the substrate to be processed.

Further, the auxiliary exposure apparatus according to the embodiment may further include a control section (for example, control section 17) that controls each section. When performing exposure processing on the peripheral area extending in the second direction of the substrate to be processed, the control unit causes the liquid crystal module to transition to the first mode, and the light source unit causes the light source unit to switch to the first mode at a position where the condenser lens and the peripheral area face each other. The surrounding area may be irradiated with light through the liquid crystal module. Further, when performing the exposure processing on the peripheral area extending in the first direction of the substrate to be processed, the control unit causes the liquid crystal module to transition to the second mode, and the light source unit emits light to the peripheral area through the liquid crystal module in the second mode. may be irradiated. Therefore, according to the auxiliary exposure device according to the embodiment, the light emitted from the light source unit is focused along the second direction by the liquid crystal module, so that the exposure resolution along the second direction can be improved. .

Further, the auxiliary exposure apparatus according to the embodiment may further include a control section (for example, control section 17) that controls each section. While the substrate to be processed is transported in the first direction, the control unit causes the light source unit to emit light at a first illuminance to the peripheral area at a position where the peripheral area extending in the second direction of the substrate to be processed and the condenser lens face each other. You can irradiate. Further, the control unit may irradiate each product area with a second illuminance different from the first illuminance by the light source unit at a position where each product area of the substrate to be processed and the condenser lens face each other. Therefore, according to the auxiliary exposure device according to the embodiment, it is possible to improve the processing efficiency of the auxiliary exposure process.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in many different forms. Also, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

11 Auxiliary exposure device 17 Control unit 30 Flat flow conveying unit 32 Light source unit 33 Local light source 34 Condensing lens 35 Local condensing lens 36 Mask member 37 Moving unit 38 Liquid crystal module 100 Substrate processing system 321 Light source A1 Product area A2 Peripheral area A2a 1 peripheral area A2b 2nd peripheral area G glass substrate

Claims (10)

a transport unit that transports a substrate to be processed including a plurality of product areas and a peripheral area located around each of the product areas in a first direction;
a light source unit formed by arranging a plurality of light sources in a second direction intersecting the first direction and irradiating the substrate to be processed transported in the first direction with light;
A concentrator arranged between the light source unit and the substrate to be processed, and condensing the light emitted by the light source unit to the peripheral area extending in the second direction of the substrate to be processed along the first direction. an auxiliary exposure device comprising an optical lens; a local light source arranged at a position corresponding to the peripheral area extending in the first direction of the substrate to be processed and irradiating the substrate to be processed transported in the first direction with light;
a local light source disposed between the local light source and the substrate to be processed, and condensing, along the second direction, light emitted from the local light source to the peripheral area extending in the first direction of the substrate to be processed; 2. The auxiliary exposure apparatus of claim 1, further comprising a condenser lens. further comprising a control unit for controlling each unit,
The control unit
when performing exposure processing on the peripheral area extending in the second direction of the substrate to be processed, irradiating the peripheral area with light from the light source unit at a position where the peripheral area and the condenser lens face each other;
3. The auxiliary exposure apparatus according to claim 2, wherein when performing exposure processing on said peripheral area extending in said first direction of said substrate to be processed, said local light source irradiates said peripheral area with light. further comprising a mask member disposed between the condensing lens and the substrate to be processed and shielding another area adjacent to the peripheral area extending in the first direction of the substrate to be processed;
2. The auxiliary exposure apparatus according to claim 1, wherein said light source unit irradiates said peripheral area extending in said first direction of said substrate to be processed with light through said mask member. a moving unit that moves the mask member between a processing position between the condenser lens and the substrate to be processed and a predetermined retracted position;
and a control unit that controls each unit,
The control unit
When the peripheral area extending in the second direction of the substrate to be processed is subjected to the exposure process, the mask member is retracted to the retracted position by the moving part, and the condenser lens and the peripheral area face each other. irradiating the surrounding area with light by the light source unit;
When exposure processing is performed on the peripheral area extending in the first direction of the substrate to be processed, the moving unit moves the mask member from the retracted position to the processing position, and the light source unit moves the mask member to the processing position. 5. The auxiliary exposure apparatus according to claim 4, wherein the peripheral area is irradiated with light through the mask member. A first mode disposed between the condenser lens and the substrate to be processed, which does not shield the substrate to be processed, and shields another area adjacent to the peripheral area extending in the first direction of the substrate to be processed. further comprising a liquid crystal module capable of transitioning between the second mode,
2. The auxiliary exposure apparatus according to claim 1, wherein said light source unit irradiates said peripheral area extending in said first direction of said substrate to be processed with light through said second mode liquid crystal module. further comprising a control unit for controlling each unit,
The control unit
When performing exposure processing on the peripheral area extending in the second direction of the substrate to be processed, the liquid crystal module is switched to the first mode, and the light source unit is placed at a position where the condenser lens and the peripheral area face each other. irradiating the peripheral area with light through the liquid crystal module in the first mode by
When performing exposure processing on the peripheral area extending in the first direction of the substrate to be processed, the liquid crystal module is switched to the second mode, and the peripheral area is exposed through the liquid crystal module in the second mode by the light source unit. 7. A supplemental exposure device according to claim 6, which illuminates an area. further comprising a control unit for controlling each unit,
The control unit
While the substrate to be processed is transported in the first direction, the peripheral area of the substrate to be processed is illuminated with a first illuminance by the light source unit at a position where the peripheral area extending in the second direction and the condenser lens face each other. illuminate the area and
2. The method according to claim 1, wherein the light source unit irradiates each product area with a second illuminance different from the first illuminance at a position where each product area of the substrate to be processed and the condenser lens face each other. auxiliary exposure device. a transport unit that transports a substrate to be processed including a plurality of product areas and a peripheral area located around each of the product areas in a first direction;
a light source unit formed by arranging a plurality of light sources in a second direction intersecting the first direction and irradiating the substrate to be processed transported in the first direction with light;
A concentrator arranged between the light source unit and the substrate to be processed, and condensing the light emitted from the light source unit to the peripheral area extending in the second direction of the substrate to be processed along the first direction. an optical lens;
a local light source arranged at a position corresponding to the peripheral area extending in the first direction of the substrate to be processed and irradiating the substrate to be processed transported in the first direction with light;
a local light source disposed between the local light source and the substrate to be processed, and condensing the light emitted from the local light source to the peripheral area extending in the first direction of the substrate to be processed along the second direction; An exposure method in an auxiliary exposure device comprising a condenser lens,
when performing exposure processing on the peripheral area extending in the second direction of the substrate to be processed, irradiating the peripheral area with light from the light source unit at a position where the peripheral area and the condenser lens face each other;
A method of exposure, comprising irradiating the peripheral area with light from the local light source when performing the exposure process on the peripheral area extending in the first direction of the substrate to be processed. A storage medium storing a program for causing a computer to execute the exposure method according to claim 9.

Images