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Exposure system being adjustable in exposure intensity

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Publication number
CN105319856A
CN105319856A CN 201410298957 CN201410298957A CN105319856A CN 105319856 A CN105319856 A CN 105319856A CN 201410298957 CN201410298957 CN 201410298957 CN 201410298957 A CN201410298957 A CN 201410298957A CN 105319856 A CN105319856 A CN 105319856A
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device
control
light
reflective
distribution
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CN 201410298957
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Chinese (zh)
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陈赞仁
田中智树
施誌华
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东捷科技股份有限公司
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Abstract

The invention provides an exposure system which includes a light source device, a control device, a light distribution device, a first optical device, a second optical device and a lens array device. The control device generates a control signal. The light distribution device receives a light generated from the light source device and is provided with a plurality of reflective units, each of which has a plurality of reflective lens. The control signal from the control device controls the reflective lens in each reflective unit to move to adjust the light into a plurality of corresponding distribution lights and regulate the intensity of the distribution lights. The lens array device includes a plurality of lenses which are corresponding to the reflective units in the light distribution device in a one-to-one manner. The exposure system can control the reflective lens in the reflective units to regulate the intensity of the distribution lights by means of the control signal.

Description

可调整曝光强度的曝光系统 Adjust the exposure intensity of the exposure system

技术领域 FIELD

[0001] 本发明是与曝光系统有关,特别是指一种可调整曝光强度的曝光系统。 [0001] The present invention is related to an exposure system, and particularly to an adjustable exposure intensity of the exposure system.

背景技术 Background technique

[0002] 如美国第6876494号专利案,其揭露一种成像装置(imaging formingapparatus)。 [0002] The text of U.S. Pat. No. 6,876,494, which discloses an image forming apparatus (imaging formingapparatus). 该专利的一光线调配元件的多个像素单元是一对一地对应微型透镜阵列的微型透镜,如此,藉由光线调配元件反射的光线,在通过微型透镜阵列后,光线的强度都是相同的,而不能控制光线的强度,也就是说,曝光作业时只能控制是否对工作面进行曝光,而无法控制曝光面的每一点的曝光强度。 A plurality of pixel units light element formulation of this patent is one correspondence microlens array of microlenses, so, by the deployment of the light beam reflected by the element, after passing through the micro lens array, the intensity of light is the same , but can not control the intensity of the light, that is, the exposure operation can control whether the face is exposed, and can not control the exposure intensity of each point in the exposure plane.

[0003] 此外,若要加强工作面的曝光强度,传统只能藉由改变光源的光线强度或者改变曝光时间。 [0003] In addition, to strengthen the face exposure intensity, only by changing the light intensity of a conventional light source or changing the exposure time. 选择改变光源的光线强度必须提高光源的功率,这样不仅会增加成本,也会造成控制上不方便。 Changing intensity of the light source selection is necessary to increase the power of the light source, this will not only increase costs, it can also cause inconvenience control. 选择改变曝光时间,则会增加曝光作业的时间。 The option to change the exposure time, exposure time jobs will increase.

发明内容 SUMMARY

[0004] 有鉴于上述的缺失,本发明提供一种曝光系统,其可控制工作面的曝光强度,且不需要改变光源的功率及增加曝光时间,而可有效提高曝光作业效率。 [0004] In view of the above deletion, the present invention provides an exposure system which can control the exposure intensity face, and without changing the power of the light source and increase the exposure time, the exposure can improve the working efficiency. 再者,本发明的曝光系统还可针对工作面的每一点提供不同曝光强度的曝光量。 Furthermore, the exposure system of the present invention may also be a different exposure intensity of the exposure amount for each point of the face provided.

[0005] 本发明的曝光系统包括一光源装置、一控制装置、一光线调配装置、一第一光学装置、一第二光学装置及一透镜阵列装置。 Exposure System [0005] The present invention includes a light source means, a control means, deployment means a light, a first optical device, an optical device and a second lens array means. 光源装置产生一光线。 Light source means generating a light. 控制装置产生一控制讯号。 Control means generates a control signal. 光线调配装置接收光线,且具有多个反射单元。 Receiving light rays deployment device, and having a plurality of reflecting units. 每一反射单元具有多个反射镜,且依据控制讯号控制每一反射单元的反射镜运作。 Each unit has a plurality of reflecting mirrors, and configured to operate according to the control signal to control each unit of the reflection mirror. 该数个反射单元分别将光线调配成对应的多个调配光线,并调整该数个调配光线的强度。 The plurality of the light reflecting unit are formulated into a corresponding plurality of light rays formulation, and adjusting the light intensity of several formulations. 透镜阵列装置位于第一及第二光学装置之间,且有多个透镜。 The lens array means located between the first and second optical means, and a plurality of lenses. 该数个透镜一对一地对应光线调配装置的反射单元。 The plurality of unit lenses one correspondence reflected light of the deployment device. 其中,该数个反射单元调配的该数个调配光线依序通过第一光学装置、透镜阵列装置的透镜及第二光学装置。 Wherein the plurality of the reflecting unit formulation several formulations light sequentially first optical means, the lens of the lens array and the second optical means by means.

[0006] 如此,本发明的曝光系统可藉由控制讯号来控制每一反射单元的反射镜摆动运作,进而达到调整调配光线的强度,且控制讯号可个别控制每一反射单元反射的调配光线的强度,因此,本发明的曝光系统不仅可控制工作面的曝光强度,还可针对工作面的每一点提供不同曝光强度的曝光量。 [0006] Thus, the exposure system of the present invention may be controlled by a control signal of each mirror reflecting the swing operating unit, and then to adjust the light intensity of the deployment, and the control signals for each individually controllable light reflecting unit formulations reflected strength, therefore, the exposure system of the present invention can control not only the face exposure intensity, exposure may be different exposure intensity at each point provides a face.

[0007] 有关本发明所提供的曝光系统的详细构造、特点、或使用方式,将于后续的实施方式详细说明中予以描述。 [0007] Details about the configuration of the exposure system of the present invention provides, characteristics, or use, follow-up will be described in detail in the embodiment described. 然而,在本发明领域中具有通常知识者应能了解,该详细说明以及实施本发明所列举的特定实施例,仅用于说明本发明,并非用以限制本发明的专利申请范围。 However, ordinary skills should understand that the detailed description and specific embodiments exemplified embodiment of the present invention, merely to illustrate the present invention and are not intended to limit the scope of the present invention patent application in the field of the present invention.

附图说明 BRIEF DESCRIPTION

[0008] 图1是本发明的曝光系统的示意图。 [0008] FIG. 1 is a schematic view of an exposure system according to the present invention.

[0009] 图2是图1中曝光系统省略光源装置及控制装置的局部放大示意图。 [0009] FIG. 2 is an enlarged partial schematic view of an exposure system of FIG. 1 are omitted in the light source apparatus and control apparatus.

[0010] 图3是图1中光线调配装置的示意图。 [0010] FIG. 3 is a schematic diagram of a light deployment device of FIG.

[0011] 图4是图3中的局部放大示意图。 [0011] FIG. 4 is a partially enlarged view of FIG. 3.

[0012] 图5A是图3中其中一反射单元的一个反射镜作动的示意图。 [0012] FIG 5A is a schematic view of a mirror in which a reflecting unit 3 actuating FIG.

[0013] 图5B图是图5A中反射镜反射光线对基材的工作面曝光的示意图。 [0013] FIG 5B is a schematic diagram of FIG. 5A, the light reflected by the mirror face of the substrate exposed.

[0014] 图6A是图3中其中一反射单元的五个反射镜作动的示意图。 [0014] FIG 6A is a schematic diagram in FIG. 3 wherein five mirrors of a reflection unit actuated.

[0015] 图6B是图6A中反射镜反射光线对基材的工作面曝光的示意图。 [0015] FIG. 6A 6B is a schematic view of light rays reflected by the mirror face of the substrate exposed.

[0016] 图7A是图3中其中一反射单元的全部反射镜作动的示意图。 [0016] FIG. 7A is a schematic diagram of a reflecting mirror wherein all actuating unit 3 of FIG.

[0017] 图7B是图7A中反射镜反射光线对基材的工作面曝光的示意图。 [0017] FIG 7B is a schematic diagram of FIG. 7A of the light reflected by the mirror face of the substrate exposed.

具体实施方式 detailed description

[0018] 以下,兹配合各图式列举对应的较佳实施例来对本发明的曝光系统的组成构件及达成功效来作说明。 [0018] Hereinafter, constituent members cooperate to hereby exposure system according to the present preferred embodiment of the invention each include the corresponding figures for illustration and to achieve efficacy. 然各图式中曝光系统的构件、尺寸及外观仅用来说明本发明的技术特征,而非对本发明构成限制。 However, each of the drawings of the exposure system member, the size and appearance merely for describing features of the present invention, not to limit the present invention.

[0019] 如图1及2所不,本发明的曝光系统10包括一光源装置11、一控制装置12、一光线调配装置13、一第一光学装置14、一第二光学装置15及一透镜阵列装置16。 [0019] FIGS. 1 and 2 do not, the exposure system 10 of the present invention comprises a light source device 11, a control unit 12, a light deployment device 13, a first optical device 14, an optical unit 15 and a second lens array device 16.

[0020] 光源装置11是用以产生一光线L,且包括一发光元件111、一光线瞄准器112及一反射器113。 [0020] The light source 11 is means for generating a light beam L, and includes a light emitting element 111, a collimator 112, and a light reflector 113. 发光元件111产生光线L,光线瞄准器112接收光线L,且将光线调配成一平行光线LP,也就是说,光线瞄准器112可控制光线L的投射方向,光线瞄准器112可以是光学透镜、光纤总成等。 L 111 generates light emitting element, the light collimator 112 receives light L, and the formulated into a parallel light beam the LP, that is, light collimator 112 may control the direction of projection light L, the light 112 may be an optical sight lens, an optical fiber assembly and so on. 反射器113接收平行光线LP,并将平行光线LP反射,于此实施例中,反射器113是反射镜。 The reflector 113 receives the parallel light rays LP, and the parallel light rays LP reflector, in this embodiment, the reflector 113 is a mirror.

[0021] 控制装置12产生一控制讯号,于此实施例中,控制装置可以是计算机或其他专用设备。 [0021] The control means 12 generates a control signal, in this embodiment, the control means may be a computer or other equipment thereto.

[0022] 光线调配装置13为一数位微型反射镜元件(digital micromirror device, DMD),且用以接收光线LR,并具有多个反射单元131。 [0022] The deployment device 13 to light a digital micromirror device (digital micromirror device, DMD), and for receiving light LR, and 131 having a plurality of reflecting units. 该数个反射单元131藉由控制装置12的控制讯号来控制光线Lr投射方向,进而分别将光线Lr调配成对应的多个调配光线LM,及调整该数个调配光线Lm的光强度,详细的光强度控制方式请容后在述。 The plurality of reflecting units 131 by the control means 12 control signals to control the light Lr projection direction, respectively, and further deployment of the plurality of light beam Lr formulations LM, and adjusting the plurality of light beam Lm formulation corresponding to the intensity of detailed light intensity control after the requested capacity later.

[0023] 第一光学装置14用以调配反射单元131反射的调配光线Lm,且调配光线LM可通过第一光学装置14,于此实施例中,第一光学装置14藉由一第一光学透镜141及一第二光学透镜142组成。 [0023] The formulations for formulation reflected light 14 reflected by the first optical unit 131 means Lm, LM and deployment of the light through the first optical device 14, in this embodiment, the first optical means 14 by a first optical lens a second optical lens 141 and 142 components. 其中,第一光学透镜141可将反射单元131反射的调配光线LM聚焦后投射至第二光学透镜142,最后,调配光线LM会再次被第二光学透镜142聚焦后才向外投射。 Wherein the first optical lens 141 may be reflected by the reflecting unit 131 after deployment of the light projected onto second optical LM focusing lens 142, and finally, the light LM formulation will again after the second optical lens 142 focusing projected outwardly.

[0024] 第二光学装置15具有一第三光学透镜151及一第四光学透镜152。 [0024] The second optical device 15 having a third optical lens 151 and a fourth optical lens 152.

[0025] 透镜阵列装置16是一微型透镜阵列(micro-lens array, MLA),且位于第一光学装置14及第二光学装置15之间,并具有多个透镜161。 [0025] The lens array 16 is a micro lens array (micro-lens array, MLA), and located between the first and the second optical device 14 between the optical means 15, and 161 having a plurality of lenses. 该数个透镜161是一对一地对应该光线调配装置13的反射单元131。 The plurality of lenses 161 is a one for one to be light reflecting unit 131 of the deployment device 13. 其中,反射单元131反射的调配光线LM依序通过第一光学装置14、透镜阵列装置16及第二光学装置15,最终,通过第二光学装置15的第三及第四光学透镜151、152将调配光线投射在一工作面20上,以对工作面20上需要被曝光的部分进行曝光作业。 Wherein the reflection unit 131 reflecting light LM formulations sequentially through the first optical device 14, the lens array 16 and a second optical means 15, finally, the second third and fourth optical means 15 of the optical lens 151 and 152 would formulations light projected on a working surface 20 to the upper face portion 20 to be exposed exposure operation.

[0026] 于此实施例中,工作面20可以是印刷电路板或一导电基板等的基材的表面,而印刷电路板或导电基板的导电路径可藉由本发明的曝光系统来制作,并控制导电路径的线宽,且导电路径可以是二维或三维的结构。 [0026] Examples of the surface of the substrate, a printed circuit board 20 may be a conductive substrate, face or the like thereto, and the conductive path printed circuit board or the conductive substrate by the exposure system of the present invention may be fabricated, and control the line width of the conductive path, and the conductive path may be two or three dimensional structures.

[0027] 如图3及4所示,光线调配装置13具有多个反射镜132,且每一反射镜132都可以藉由控制讯号来控制其摆动角度,每一反射镜132的摆动角度约在正负12度的范围内,来控制调配光线是否进入第一光学装置。 [0027] FIGS. 3 and 4, the deployment device 13 having a plurality of light reflecting mirror 132, and each mirror 132 can be controlled by controlling a swing angle signal, each mirror swinging angle of about 132 within plus or minus 12 degrees, to control whether light enters the first deployment of the optical device. 但随着技术发展,光线调配装置13的反射镜132的摆动角度可以更大,故摆动角度不以此为限。 However, as the technology advances, the swing angle of the mirror 132 of the light deployment device 13 may be larger, so that the swing angle is not limited thereto.

[0028] 此外,反射镜132的摆动角度与第一光学装置14、第二光学装置15及透镜阵列模块16的设置位置有关,所以,本发明没对反射镜132摆动角度多作限制。 [0028] Further, the swing angle of the mirror 132 and the first optical device 14, the installation position of the second optical means and the lens array 15 of modules 16 are, therefore, of the present invention is not a multi-mirror swinging angle limitation 132.

[0029] 特别地,本发明预先将光线调配装置13的反射镜132区分成多个反射单元131 (如图中粗实线的划分范围),也就表示每一反射单元131具有多个反射镜132,于此实施例中,每一反射单元131以9(3*3)个反射镜131为例来说明。 [0029] In particular, the present invention is previously mirror region 132 light deployment device 13 into a plurality of reflecting units 131 (thick solid line dividing the range in FIG.), Each also represents the reflection unit 131 has a plurality of mirrors 132, in this embodiment, each of the reflection unit 131 9 (3 * 3) reflecting mirror 131 will be explained as an example. 其中,粗实线为了说明本发明的特征而特别绘示,实际上光线调配装置13是没有粗实线。 Wherein the bold solid line to illustrate features of the present invention is particularly shown, in fact, light deployment device 13 is not thick solid line.

[0030] 控制装置的控制讯号同时控制每一反射单元131的9个反射镜132的摆动角度,来达到控制调配光线的光强度的目的。 [0030] The control signals control means simultaneously controls each of the reflection unit 131 reflecting mirror 9 swinging angle of 132, to achieve the purpose of the light intensity of the light control formulation.

[0031] 请再参照图2,若每一反射镜132的尺寸是13.6微米(um) *13.6微米(um)时,表示,每一反射单元131的尺寸为40.8微米(um)*40.8微米(um),因此,若第一光学装置14是采1:1的比例,也就是调配光线LM通过第一光学装置14的入光面及出光面的比例都是相同时,此时,可选用透镜阵列装置16的透镜161尺寸是40.8微米(um)*40.8微米(um)。 When [0031] Referring again to FIG 2, if the size of each mirror 132 is 13.6 micrometers (um) * 13.6 micrometer (UM), it said reflecting unit 131 of each size was 40.8 microns (um) * 40.8 microns ( UM), and therefore, if the first optical device 14 is taken 1: 1 ratio, i.e. the ratio of the formulation by light LM surface and the first surface of the optical device 14 are the same, in this case, the choice of the lens lens array apparatus 161 is the size of 16 microns 40.8 (um) * 40.8 micrometers (um). 相同地,若第一光学装置14是采用1:2的比例,也就是调配光线LM通过第一光学装置14的出光面后比例会被放大2倍,此时应选用透镜阵列装置16的透镜161尺寸是81.6微米(um) *81.6微米(um)。 Similarly, if the first optical device 14 is a 1: 2 ratio, which is formulated by the LM light exiting surface of the first optical device 14 is the ratio of a factor of 2, the lens array 161 should be used in this case means the lens 16 size is 81.6 microns (um) * 81.6 micrometers (um). 如此,第一光学装置14的选择是会直接影响到后端透镜阵列装置16的透镜161尺寸选择。 Thus, the first selection of the optical device 14 will directly affect the size of the lens 161 selected the rear end 16 of the lens array apparatus. 再者,这里仅以两种比例来作说明,实际上,第一光学装置14也可以是其它比例,故不以上述为限。 Furthermore, this ratio of two for illustration only, in fact, the first optical device 14 may be other ratios, it is not limited to the above.

[0032] 通过每一透镜161的调配光线LM藉由第二光学装置15来控制对工作面20的每一点的曝光面积及导电路径线宽,于此实施例中,第二光学装置15放大曝光面积。 [0032] to control the exposure of each point of the face area and the line width of the conductive path 20, this embodiment by light by each lens formulations LM 161 of the second optical device 15, the second exposure optical amplifying means 15 area. 需要注意的是,当要对导电路径进行高精度加工时,可选择缩小曝光面积,但要对导电路径进行较低精度的加工时,则可选择放大曝光面积。 Note that, when a conductive path for high-precision machining, selectively reduced exposure area of ​​the conductive path but less precise machining, may be selected to enlarge the area of ​​exposure.

[0033] 由于控制讯号控制该数个反射单元的反射镜的方式是相同的,因此,随后仅以其中一反射单元为例来说明。 [0033] Because of the way the mirror reflection of the number of the control signal of the control unit are the same, therefore, only followed by a reflection unit which will be described as an example. 其中,图5A至图7A中反射镜上有圆圈的表示将光线反射至第一光学装置,相反的,没有圆圈的则表示将光线反射至第一光学装置外,但实际上,圆圈不存在于反射镜上。 Wherein the representation of a circle in FIG. 5A to FIG. 7A mirrors reflect light to the first optical means, the opposite, outer said circle not reflect light to the first optical means, but in fact, does not exist in the circle on the mirror.

[0034] 如图5A及图5B所示,当控制讯号控制反射单元131的其中一个反射镜132a将光线反射进入第一光学装置,而其他反射镜132b则将光线反射至第一光学装置外后,进入第一光学装置的调配光线就可对基材的工作面20进行曝光(如图中虚线范围),此时的调配光线的曝光量(即曝光强度)是最弱的。 [0034], when the control signal wherein the control unit after a reflection mirror 132a reflects the light into the first optical means, and an outer 132b will reflect light to the first optical device according to another mirror 131 of FIG. 5A and 5B , enters the first optical device can be formulated for light exposure face of the substrate 20 (shown in dashed line), in this case light exposure amount of formulation (i.e., exposure strength) is weakest.

[0035] 如图6A及图6B所示,当控制讯号控制反射单元131的其中五个反射镜132a将光线反射进入第一光学装置,而其他反射镜132b则将光线反射至第一光学装置外后,进入第一光学装置的调配光线就可对基材的工作面20进行曝光(如图中虚线范围),此时的基材受到的调配光线的曝光量(即曝光强度)是比图5B中的强。 [0035] FIGS. 6A and 6B, when the control signal control unit 131 where five reflecting mirror 132a reflects the light into the first optical means, while the other mirror 132b will reflect light to the first optical device external after deployment of the light entering the first face of the optical device can be exposed substrate 20 (shown in dashed line), the light exposure amount at this time is the base formulation of the subject (i.e., exposure intensity) than in FIG. 5B the strong.

[0036] 如图7A及图7B所示,当控制讯号控制反射单元131的全部反射镜132a将光线反射进入第一光学装置后,进入第二光学装置的调配光线就可对基材的工作面20进行曝光(如图中虚线范围),此时的调配光线的曝光量(即曝光强度)是最强的。 [0036] Figure 7A and, when the control signal controls all the reflection unit 132a of mirror 131 reflects the light into the first optical device enters the second optical means formulations can face the light to the substrate shown in FIG. 7B 20 is exposed (as shown in dashed line), the exposure amount at this time (i.e., exposure intensity) is the strongest rays formulation.

[0037] 如此,本发明的曝光系统就可以藉由控制讯号控制每一反射单元的反射镜的运作,而轻意地调整曝光强度,且无需增加额外的光源成本及不会增加曝光时间。 [0037] Thus, the exposure system of the present invention can be controlled by the operating control signal for each mirror reflecting unit, and lightly adjusted exposure intensity, and a light source without additional costs and without increasing the exposure time. 此外,虽然较佳实施例中仅以一反射单元为例来说明,但实际上,控制讯号也可以控制该数个反射单元分别反射出不同强度的调配光线,例如部分反射单元被控制成如图7B中的最强曝光量,部分反射单元则没有被曝光量(即反射单元没有反射产生调配光线),又部分反射单元产生如图5B中的曝光量,因此,本发明的曝光系统是可对工作面的每一点提供不同的曝光量。 Further, while the preferred embodiment only a reflection unit will be explained as an example, but in practice, the control signals may also control the number of reflection units respectively different intensity of light reflected formulations, e.g. partially reflective means is controlled to FIG. 7B, the strongest exposure amount, there is no partial reflection unit is the amount of exposure (i.e. no reflection unit formulations to reflection light), and generates a partially reflective unit of FIG. 5B exposure amount, therefore, the exposure system of the present invention is each point provides a different amount of exposure face.

[0038] 虽然,本实施例中每一反射单元是以9个反射镜为例来作说明,但实务中,每一反射单元的反射镜数量是可以被调整,例如最少两个反射镜、或者16(即4*4)个反射镜等,因此,每一反射单元的反射镜数量不以此所述为限,且最少只要两个反射镜。 [0038] Although the present embodiment, each of the reflecting mirror unit 9 is an example for illustration, but in practice, the number of the reflection mirror of each unit is may be adjusted, for example, a minimum of two mirrors, or 16 (i.e., 4 * 4) mirrors and the like, and therefore, the number of mirrors in each of the reflective unit is not limited to this, and as long as a minimum of two mirrors.

[0039] 此外,第一光学装置的组成不以前述两个光学透镜为限,且第二光学装置的组成也不以前述的两个光学透镜为限,因为,第一及第二光学装置的主要目的是作曝光面积的放大及缩小,并使该数个反射单元调配的调配光线能顺利进入对应的透镜阵列装置的透镜,而对工作面的每一点提供对应的曝光量及曝光面积,因此,第一及第二光学装置的组成及数量不以本较佳实施例所绘为限。 [0039] In addition, the composition of the first optical means to the two optical lenses are not limited, and the composition of the second optical means not to the two optical lenses is limited, because the first and second optical means the main purpose is for zoom in and out of the exposure area, and the plurality of light reflecting unit formulations formulations can successfully enter the corresponding lens of the lens array apparatus, and each point corresponding to provide an exposure amount and the exposure area of ​​the face, so , composition and quantity of the first and second optical means in the present preferred embodiment is not limited to the depicted embodiments.

[0040] 综合上述,本发明的曝光系统可有效的藉由控制讯号控制光线调配装置的反射单元,而使调配光线能利用不同的光强度来对基材的导电线路进行曝光作业,并提高导电线路的分辨率。 [0040] In summary, the exposure system of the present invention may be effectively controlled by the control signal of the light reflecting unit deployment means, the deployment of the exposure to light can be conductive lines of the substrate with different light intensities, and to improve the conductivity resolution line.

[0041] 最后,再次强调,本发明于前揭实施例中所揭露的构成元件,仅为举例说明,并非用来限制本案的保护范围,其他等效元件的替代或变化,亦应为本案申请专利范围所涵盖。 [0041] Finally, once again emphasized that constituent elements disclosed in the embodiments above-mentioned technical embodiment of the present invention are merely illustrative and not intended to limit the scope of the case, alternative or equivalent elements of other variations should also apply for the case the patentable scope encompassed.

Claims (5)

1.一种曝光系统,其特征在于,包括: 一光源装置,产生一光线; 一控制装置,产生一控制讯号; 一光线调配装置,接收该光线,且具有多个反射单元,每一反射单元具有多个反射镜,且依据该控制讯号控制每一反射单元的反射镜运作,该数个反射单元分别将该光线调配成对应的多个调配光线,并调整该数个调配光线的光强度; 一第一光学装置; 一第二光学装置;及一透镜阵列装置,位于该第一光学装置与该第二光学装置之间,且具有多个透镜,是一对一地对应该光线调配装置的反射单元;其中,该数个反射单元调配的该数个调配光线系依序通过该第一光学装置、该透镜阵列装置的透镜及该第二光学装置。 1. An exposure system comprising: a light source means generating a light; a control means for generating a control signal; a light allocation means receiving the light, and having a plurality of reflecting means, each reflecting means having a plurality of mirrors, and according to the control signal to control each unit of the reflection mirror operation, the plurality of reflecting units are formulated into the light rays corresponding to a plurality of formulations, and adjusting the light intensity of a plurality of light deployment; a first optical means; a second optical means; and a lens array means located between the first optical means and second optical means, and having a plurality of lenses, the light should be one to one of the deployment device reflecting means; wherein the plurality of light-based formulations of the plurality of reflecting units formulations sequentially through the first optical means, the lens of the lens array and the second optical device means.
2.根据权利要求1所述的曝光系统,其特征在于,该光线调配装置为一数位微型反射镜兀件。 2. The exposure system according to claim 1, characterized in that the deployment device is a light digital micromirror Wu member.
3.根据权利要求1所述的曝光系统,其特征在于,该透镜阵列装置为一微型透镜阵列。 3. The exposure system according to claim 1, wherein the lens array means is a micro lens array.
4.根据权利要求1所述的曝光系统,其特征在于,该光源装置包括一发光元件、一光线瞄准器及一反射器,该发光元件产生该光线,该光线瞄准器接收该光线,且将该光线调配成一平行光线,该反射器接收该平行光线,并反射至该光线调配装置。 4. The exposure system of claim 1, wherein the light source means comprises a light emitting element, a light collimator and a reflector, the light emitting element is generated, the sight receiving the light beam, and the the formulated into a parallel light beam, the reflector receives the parallel rays, and the light reflected to the deployment device.
5.根据权利要求1所述的曝光系统,其特征在于,该控制装置的控制讯号控制每一反射单元的反射镜的摆动角度。 The exposure system according to claim 1, characterized in that the control signal the control means controls the pivot angle of the mirror reflection of each unit.
CN 201410298957 2014-06-27 2014-06-27 Exposure system being adjustable in exposure intensity CN105319856A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658072A (en) * 2004-02-18 2005-08-24 Asml荷兰有限公司 Lithographic apparatus and device manufacturing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658072A (en) * 2004-02-18 2005-08-24 Asml荷兰有限公司 Lithographic apparatus and device manufacturing method

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