JP5573054B2 - Substrate processing method, substrate processing apparatus, and device manufacturing method - Google Patents

Description

The present invention relates to a substrate processing method, substrate processing apparatus, a method of manufacturing a 及 beauty device.

  As a technique for manufacturing an electronic device such as a flat panel display, for example, a photolithography method is known. In the photolithography method, an exposure apparatus that exposes a substrate with exposure light through a mask, a developing apparatus that develops the exposed substrate, a sputtering apparatus that forms a wiring layer on the substrate, a CVD apparatus, and the like are used.

  In the exposure apparatus, for example, the substrate is transported in a state of being held by a holding member such as a tray, and is placed on the substrate stage together with the tray (for example, see Patent Document 1). In addition, after the placement, the substrate alignment processing is performed. In the alignment process, the position and orientation of the substrate are adjusted by detecting the alignment mark provided on the substrate and driving the substrate stage based on the detection result (see, for example, Patent Document 2). Thus, in the exposure apparatus, a plurality of processes are performed on the substrate.

  Each processing in the exposure apparatus is performed according to processing procedure information called an exposure recipe that records the processing procedure. The exposure recipe includes, for example, process parameters for the above processes. Conventionally, this processing parameter is associated with each exposure recipe in advance, and the processing parameter is set for each exposure recipe.

JP 2001-100189 A JP 2006-195353 A

  However, in the above-described conventional exposure apparatus, there is a possibility that the result of the exposure process varies depending on the characteristics of the substrate, the characteristics of the tray, and the like. The processing results are not limited to the exposure process, and the processing results may vary in the same manner for other processes on the substrate, such as a process of placing the substrate on a substrate stage or the like, or a process of transporting the substrate.

Aspect of the present invention has an object to provide a substrate processing method capable of improving the processing accuracy of the processing for the substrate, the substrate processing apparatus, a method of manufacturing 及 beauty device.

  According to the first aspect of the present invention, there is provided a substrate processing method for performing a predetermined process on a substrate, and acquiring identification information including at least one of information regarding identification of the substrate and information regarding identification of the predetermined process And setting a processing parameter to be used for the predetermined processing based on the identification information.

  According to the second aspect of the present invention, the predetermined processing is performed based on identification information that includes at least one of a processing apparatus that performs predetermined processing on a substrate, information related to identification of the substrate, and information related to identification of the predetermined processing. There is provided a substrate processing apparatus including a control device that sets processing parameters used for processing.

  According to the third aspect of the present invention, an exposure processing unit that performs an exposure process on a substrate, a measurement processing unit that measures a plurality of marks provided on the substrate, information on identification of the substrate, and the substrate Setting processing parameters used for the exposure processing based on identification information including at least one of information relating to the identification of the predetermined processing performed on, correcting the measurement results of the plurality of marks based on the processing parameters, An exposure apparatus is provided that includes a control unit that adjusts exposure conditions for exposing the substrate based on the corrected measurement result.

  According to a fourth aspect of the present invention, the exposure apparatus of the present invention and the pre-processing of the exposure process by the exposure apparatus as the predetermined process are performed, and information for identifying the pre-process is transmitted to the control apparatus of the exposure apparatus An exposure system is provided that includes one or more pre-processing devices that transmit to the device.

  According to the fifth aspect of the present invention, the exposure apparatus of the present invention, one or more preprocessing apparatuses that perform preprocessing of the exposure processing by the exposure apparatus as the predetermined processing, and information that identifies the preprocessing An exposure system is provided that includes a communication device that transmits the information to the control unit of the exposure apparatus.

  According to the sixth aspect of the present invention, the exposure apparatus of the present invention is used to expose the substrate coated with a photosensitive agent, transfer a pattern to the substrate, and the exposure performed by the exposure. There is provided a device manufacturing method including developing a photosensitive agent to form an exposure pattern layer corresponding to the pattern, and processing the substrate through the exposure pattern layer.

  According to the aspect of the present invention, it is possible to improve the processing accuracy of processing on a substrate.

1 is a schematic block diagram that shows a configuration example of an exposure system according to an embodiment of the present invention. FIG. 2 is a view showing a configuration of a part of an exposure apparatus according to the present embodiment. FIG. 2 is a view showing a configuration of a part of an exposure apparatus according to the present embodiment. The schematic diagram which shows an example of the positional relationship of the projection area | region of this embodiment, a detection area | region, and a board | substrate. FIG. 6 is a process diagram showing the operation of the exposure apparatus according to the present embodiment. The process drawing. The process drawing. The process drawing. The process drawing. 6 is a flowchart showing the operation of the exposure system according to the present embodiment. The flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

FIG. 1 is a schematic block diagram showing an example of an exposure system SYS according to the present embodiment.
As shown in FIG. 1, the exposure system SYS includes an exposure apparatus EX and an external apparatus EA. The exposure apparatus EX and the external apparatus EA are installed, for example, on the floor of a factory or the like, and the substrate P is provided between the exposure apparatus EX and the external apparatus EA so that it can be transported. The exposure system SYS may be configured to include a plurality of at least one of the exposure apparatus EX and the external apparatus EA.

  The exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, an illumination system IS that illuminates the mask M with exposure light EL, and exposure light EL. A projection system PS for projecting the image of the pattern of the mask M illuminated by (1) onto the substrate P, an interferometer system 3 capable of measuring the positions of the mask stage 1 and the substrate stage 2, a transport system 4 for transporting the substrate P, An alignment system 5 that detects alignment marks on the substrate P, a chamber device 8 that houses at least the projection system PS and the substrate stage 2, a control device 9 that controls the overall operation of the exposure apparatus EX, and a control device 9 are connected. And a storage device 10 for storing various types of information relating to exposure.

  The external device EA includes, for example, a device that performs preprocessing of processing in the exposure apparatus EX. Specifically, a coating processing apparatus that performs a coating process for coating a photosensitive agent on a substrate, a development processing apparatus that performs a developing process on the photosensitive agent after the exposure process, and a film processing apparatus that performs a film forming process on the substrate after the development process Etc. The film forming apparatus includes, for example, a vapor deposition apparatus, a sputtering apparatus, a CVD apparatus, and the like. The external device EA has a control device 80, and the control device 80 includes a communication device 91. The external device EA can communicate information with the communication device 90 included in the control device 9 of the exposure apparatus EX via the communication device 91.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The substrate P includes, for example, a base material such as a glass plate and a photosensitive film (coated photosensitizer) formed on the base material. In the present embodiment, the substrate P includes a large glass plate called mother glass, and the size of one side of the substrate P is, for example, 500 mm or more. In the present embodiment, a rectangular glass plate having a side of about 3000 mm is used as the base material of the substrate P. In the present embodiment, for example, a substrate identification mark Pm is formed on the substrate P. The substrate identification mark Pm can be formed, for example, in the external device EA.

  The chamber device 8 includes a chamber member 8A that forms a substantially closed internal space 8H, and an air conditioner 8B that controls the environment (temperature, humidity, cleanliness, pressure, etc.) of the internal space 8H. The substrate stage 2 moves in the internal space 8H. In the present embodiment, at least a part of the illumination system IS, the mask stage 1, the projection system PS, the substrate stage 2, and the transfer system 4 are arranged in the internal space 8H.

  In the present embodiment, the exposure apparatus EX includes a relay unit (port unit) 15 disposed on the + X side of the substrate exchange position CP. The relay unit 15 includes a support mechanism 16 that can support the tray Tr. The tray Tr has a frame structure including a frame member and a plurality of rod members arranged in a lattice shape inside the frame member. In the present embodiment, a plurality of trays Tr are used for each substrate P, for example. Each tray Tr is formed with a tray identification mark Tm for identifying the tray Tr. The relay unit 15 is provided with a tray identification sensor 17 for detecting a tray identification mark Tm formed on the tray Tr. The relay unit 15 is provided with a substrate identification sensor 18 on the + Z side of the support mechanism 16. The substrate identification sensor 18 detects a substrate identification mark Pm formed on the substrate P. The detection result of the tray identification sensor 17 and the detection result of the substrate identification sensor 18 are transmitted to the control device 9, for example. Note that the tray identification sensor 17 and the board identification sensor 18 are not provided separately, and the tray identification mark Tm and the board identification mark Pm may be detected by one type of sensor.

  In the present embodiment, the support mechanism 16 has a plurality of rod members (pin members), and supports the tray Tr at the upper end of the rod members. The transport system 4 can transport the tray Tr supporting the substrate P between the relay unit 15 and the substrate stage 2. The tray Tr is movable between the relay unit 15 and the substrate stage 2 while supporting the substrate P. For example, when the 2nd chamber apparatus connected to the chamber apparatus 8 is provided, the relay part 15 may be arrange | positioned in the internal space formed by the 2nd chamber apparatus.

  The illumination system IS irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR is an irradiation area of the exposure light EL emitted from the illumination system IS. The illumination system IS illuminates at least a part of the mask M arranged in the illumination area IR with the exposure light EL having a uniform illuminance distribution.

  The mask stage 1 has a holding portion 11 that holds at least a part of the lower surface of the mask M, and can move on the guide surface 12G of the first surface plate 12 while holding the mask M. The mask stage 1 holds the mask M so that the lower surface (pattern formation surface) of the mask M and the XY plane are substantially parallel. The mask stage 1 is movable while holding the mask M in the illumination region IR by the operation of a drive mechanism (not shown) including, for example, a linear motor. In the present embodiment, the mask stage is movable in three directions, the X axis, the Y axis, and the θZ direction.

  The projection system PS irradiates a predetermined projection region PR with the exposure light EL. The projection area PR is an irradiation area of the exposure light EL emitted from the projection system PS. The projection system PS projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection system PS projects an image of the pattern of the mask M onto at least a part of the substrate P arranged in the projection region PR.

  The substrate stage 2 has a holding portion 13 that holds at least a part of the back surface of the substrate P, and can move on the guide surface 14G of the second surface plate 14 while holding the substrate P. The substrate stage 2 holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 can move while holding the substrate P in the projection region PR by the operation of the drive mechanism 20 including, for example, a linear motor. In the present embodiment, the substrate stage 2 is movable in six directions including an X axis, a Y axis, a Z axis, a θX, a θY, and a θZ direction. The substrate stage 2 has an exhaust mechanism 21 that exhausts the gas on the substrate stage 2. When the substrate P is placed on the substrate stage 2, the exhaust mechanism 21 exhausts the gas in the space between the substrate stage 2 and the substrate P. The exhaust mechanism 21 has an opening 21a and a suction mechanism 21b (see FIG. 3). The suction operation of the suction mechanism 21b can be controlled by the control device 9, for example.

  The interferometer system 3 optically measures the position of the first interferometer unit 3A capable of optically measuring the position of the mask stage 1 (mask M) in the XY plane and the position of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of measuring. When executing the exposure process of the substrate P or when executing the predetermined measurement process, the control device 9 operates the first and second drive systems based on the measurement result of the interferometer system 3 to thereby perform the mask stage. 1 (mask M) and position control of the substrate stage 2 (substrate P) are executed.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. When the substrate P is exposed, the control device 9 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are in the XY plane intersecting the optical axis of the projection system PS (the optical path of the exposure light EL). Move in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the X-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the X-axis direction. During exposure of the substrate P, the mask stage 1 moves in the X-axis direction on the object plane side of the projection system PS while holding the mask M, and the substrate stage 2 holds the substrate P while holding the substrate P. Move in the X-axis direction on the image plane side. The control device 9 moves the substrate P in the X-axis direction relative to the projection region PR of the projection system PS on the image plane side of the projection system PS, and projects in synchronization with the movement of the substrate P in the X-axis direction. While moving the mask M in the X-axis direction relative to the illumination area IR of the illumination system IS on the object plane side of the system PS, the exposure light EL is irradiated onto the substrate P through the mask M and the projection system PS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL from the mask M and the projection system PS.

  The transport system 4 performs a process of loading (loading) the substrate P onto the substrate stage 2 and a process of unloading the substrate P from the substrate stage 2. The process of loading the substrate P into the substrate stage 2 includes a transfer process of transferring the substrate P from the relay unit 15 to the substrate stage 2 and a mounting process of mounting the substrate P on the substrate stage 2. The process of unloading the substrate P from the substrate stage 2 includes a pickup process for picking up the substrate P placed on the substrate stage 2 and a transfer process for transferring the picked-up substrate P to the relay unit 15.

  In the present embodiment, the transport system 4 includes a first transport member 41 that carries the substrate P into the substrate stage 2 and a second transport member 42 that carries the substrate P out of the substrate stage 2. In the present embodiment, the first transport member 41 is disposed above (the + Z direction) the second transport member 42. The first transport member 41 has a drive mechanism 43. The drive mechanism 43 drives the first transport member 41 in, for example, the X direction and the Z direction. The second transport member 42 has a drive mechanism 44. The drive mechanism 44 drives the second transport member 42 in the X direction and the Z direction.

  The transport system 4 uses the first transport member 41 to transport the unexposed substrate P from the relay unit 15 to the substrate stage 2 and to place the substrate P on the substrate stage 2. Further, the transport system 4 transports the exposed substrate P from the substrate stage 2 to the relay unit 15 using the second transport member 42. In the following description, a process including at least one of a process for loading the substrate P into the substrate stage 2 and a process for unloading the substrate P from the substrate stage 2 will be appropriately referred to as a substrate replacement process.

  The substrate stage 2 is movable between a position EP where the exposure light EL emitted from the projection system PS can be irradiated and a position CP where the substrate replacement process is executed. The position EP includes a position facing the exit surface of the projection system PS from which the exposure light EL is emitted. The position CP is a position different from the position EP, and in the present embodiment, the position CP is arranged on the + X side of the position EP. In the following description, the position EP is appropriately referred to as an exposure position EP, and the position CP is appropriately referred to as a substrate replacement position CP.

  When executing the substrate exchange process, the control device 9 moves the substrate stage 2 to the substrate exchange position CP. The control device 9 causes the first transport member 41 to transport the unexposed substrate P to the substrate stage 2 disposed at the substrate replacement position CP. Further, the control device 9 causes the second transport member 42 to transport the exposed substrate P from the substrate stage 2 disposed at the substrate replacement position CP.

  When executing the substrate exchange process, the control device 9 moves the substrate stage 2 to the substrate exchange position CP. The control device 9 carries in the substrate P before exposure using the first transport member 41 to the substrate stage 2 disposed at the substrate exchange position CP. Further, the control device 9 carries out the exposed substrate P from the substrate stage 2 disposed at the substrate exchange position CP using the second transport member 42.

  In the present embodiment, the substrate P is loaded into the substrate stage 2 and unloaded from the substrate stage 2 while being supported by the tray Tr. In the present embodiment, the first transport member 41 can carry the tray Tr supporting the substrate P into the substrate stage 2. The second transport member 42 can carry out the tray Tr supporting the substrate P from the substrate stage 2. When the tray Tr supporting the substrate P is carried into the substrate stage 2, the substrate P is carried into the substrate stage 2. When the tray Tr supporting the substrate P is unloaded from the substrate stage 2, the substrate P is unloaded from the substrate stage 2.

  The substrate stage 2 (holding unit 13) has a groove in which the frame member and the rod member of the tray Tr can be placed. The present invention relates to a tray having a frame structure capable of supporting a substrate P, a substrate stage (holding unit) having a groove in which at least a part of the tray can be disposed, and a conveyance system (conveying member) capable of conveying the tray while supporting the substrate P. Examples of the technology are disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2001-100169, 2001-176947, 2003-258078, and 2004-273702. These techniques are applied to the tray Tr, the substrate stage 2, and the transfer system 4 according to this embodiment.

  When the tray Tr supporting the substrate P is carried into the substrate stage 2 by the first transport member 41, the tray Tr is disposed in the groove of the substrate stage 2, and the upper surface of the tray Tr is the upper surface (holding surface) of the holding unit 13. While being arranged further downward, the back surface of the substrate P is held by the holding portion 13. When the tray Tr is unloaded from the substrate stage 2 by the second transport member 42, the back surface of the substrate P is supported by the tray Tr, and the substrate P and the tray Tr are unloaded from the substrate stage 2 together.

FIG. 2 is a perspective view showing the vicinity of the illumination system IS, the mask stage 1, the projection system PS, and the substrate stage 2 according to the present embodiment.
As shown in FIG. 2, the projection system PS has a plurality of projection optical systems PL. A plurality of projection optical systems PL are arranged in an XY plane substantially parallel to the surface of the substrate P. The illumination system IS has a plurality of illumination modules IL so as to correspond to the plurality of projection optical systems PL.

  Further, as described above, the exposure apparatus EX of the present embodiment projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously in a predetermined scanning direction (X-axis direction). . That is, the exposure apparatus EX of the present embodiment is a so-called multi-lens scan exposure apparatus.

  The projection system PS has seven projection optical systems PL. The illumination system IS has seven illumination modules IL. The number of projection optical systems PL and illumination modules IL is not limited to seven. For example, the projection system PS has eleven projection optical systems PL, and the illumination system IS has eleven illumination modules IL. Also good.

  The illumination system IS illuminates each of the seven different illumination areas IR with the exposure light EL. The illumination system IS illuminates a portion of the mask M arranged in the illumination area IR with the exposure light EL having a uniform illuminance distribution. In the present embodiment, bright lines (g line, h line, i line) emitted from the mercury lamp LS are used as the exposure light EL emitted from the illumination system IS.

  The projection system PS projects an image of the pattern of the mask M on each of the seven different projection areas PR. The projection system PS projects an image of the pattern of the mask M at a predetermined projection magnification onto a portion of the substrate P arranged in the projection region PR.

FIG. 3 is a diagram showing an example of the projection system PS according to the present embodiment and the substrate stage 2 arranged in the projection region PR.
The projection system PS includes an imaging characteristic adjusting device 30 that adjusts the imaging characteristics (optical characteristics) of the projection system PS. The imaging characteristic adjusting device 30 is provided in each of the plurality of projection optical systems PL.

  Hereinafter, with reference to FIG. 3, one projection optical system PL among the plurality of projection optical systems PL and the imaging characteristic adjusting device 30 provided in the projection optical system PL will be described. Since the configuration of the one projection optical system PL and the configuration of the other projection optical system PL are the same, the description of the other projection optical system PL is omitted.

  The projection optical system PL forms an image of the pattern of the mask M illuminated with the exposure light EL by the illumination module IL on the substrate P at an equal magnification. The imaging characteristic adjusting device 30 includes an image plane adjusting unit 33, a shift adjusting unit 34, two sets of catadioptric optical systems 31 and 32, a field stop 35, a rotation adjusting unit 36, and a scaling adjusting unit 37. It has.

  The exposure light EL irradiated to the illumination area IR and transmitted through the mask M enters the image plane adjustment unit 33. The image plane adjustment unit 33 can adjust the position of the image plane of the projection optical system PL in the Z-axis, θX, and θY directions. The image plane adjustment unit 33 has two wedge-shaped optical members, and adjusts the position of the image plane of the projection optical system PL in the Z axis, θX, and θY directions by moving at least one of the optical members. can do.

  The exposure light EL that has passed through the image plane adjustment unit 33 enters the shift adjustment unit 34. The shift adjustment unit 34 can adjust the position of the projection image (the pattern image of the mask M) of the projection optical system PL in the X-axis and Y-axis directions. The shift adjustment unit 34 has two optical members made of parallel plates, and adjusts the position of the projection image of the projection optical system PL in the X-axis and Y-axis directions by moving at least one of the optical members. be able to.

  The exposure light EL transmitted through the shift adjustment unit 34 enters the first set of catadioptric optical system 31. The catadioptric optical system 31 includes a right-angle prism, a lens, and a concave mirror. The catadioptric optical system 31 forms an intermediate image of the pattern of the mask M. The exposure light EL emitted from the catadioptric optical system 31 is supplied to the field stop 35. The field stop 35 is disposed at the position of the intermediate image of the pattern formed by the catadioptric optical system 31. The field stop 35 defines the projection region PR and the illumination region IR. In the present embodiment, the field stop 35 defines the projection region PR on the substrate P and the illumination region IR on the mask M in a trapezoidal shape. The exposure light EL that has passed through the field stop 35 enters the second set of catadioptric optical system 32. The catadioptric optical system 32 is configured in the same manner as the catadioptric optical system 31.

  The rotation adjusting unit 36 can adjust the position of the projection image (the pattern image of the mask M) of the projection optical system PL in the θZ direction. The rotation adjustment unit 36 includes right-angle prisms of the catadioptric optical systems 31 and 32, and adjusts the position of the projection image of the projection optical system PL in the θZ direction by moving at least one of the right-angle prisms. it can.

  The exposure light EL emitted from the catadioptric optical system 32 enters the scaling adjustment unit 37. The scaling adjustment unit 37 can adjust the magnification (scaling) of the pattern image of the mask M. The scaling adjustment unit 37 has, for example, a concave lens, a convex lens, and a concave lens, and adjusts the magnification (scaling) of the pattern image of the mask M by moving the convex lens located between the two concave lenses in the Z-axis direction. can do.

The alignment system 5 detects an alignment mark provided on the substrate P.
The alignment system 5 is a so-called off-axis alignment system, and includes a plurality of microscopes 5A to 5F arranged to face the surface of the substrate P held on the substrate stage 2, as shown in FIG. Each of the microscopes 5A to 5F includes a projection unit that irradiates detection light to the detection regions AL1 to AL6, and a light receiving unit that can acquire an optical image of the alignment marks arranged in the detection regions AL1 to AL6.

  FIG. 4 is a schematic diagram illustrating an example of a positional relationship between the projection regions PR1 to PR7, the detection regions AL1 to AL6, and the substrate P, and illustrates a positional relationship within a plane including the surface of the substrate P. As shown in FIG. 4, in the present embodiment, each of the projection regions PR1 to PR7 is trapezoidal in the XY plane. Projection regions PR1, PR3, PR5, and PR7 by the projection optical systems PL1, PL3, PL5, and PL7 are arranged at substantially equal intervals in the Y-axis direction, and projection regions PR2, PR4, and PR6 by the projection optical systems PL2, PL4, and PL6 are Are arranged at substantially equal intervals in the Y-axis direction. The projection areas PR1, PR3, PR5, and PR7 are arranged on the −X side with respect to the projection areas PR2, PR4, and PR6. Further, the projection areas PR2, PR4, and PR6 are arranged between the projection areas PR1, PR3, PR5, and PR7 with respect to the Y-axis direction.

  In the present embodiment, the surface of the substrate P has a plurality of exposure areas (processed areas) PA1 to PA6 on which an image of the pattern of the mask M is projected. In the present embodiment, the surface of the substrate P has six exposure areas PA1 to PA6. The exposure areas PA1, PA2, and PA3 are arranged at approximately equal intervals in the Y axis direction, and the exposure areas PA4, PA5, and PA6 are arranged at approximately equal intervals in the Y axis direction. The exposure areas PA1, PA2, and PA3 are arranged on the + X side with respect to the exposure areas PA4, PA5, and PA6.

  The alignment system 5 detects a plurality of alignment marks m1 to m6 provided on the substrate P. In the present embodiment, six alignment marks m1 to m6 are arranged on the substrate P so as to be separated in the Y axis direction, and groups of these alignment marks m1 to m6 are arranged at two places separated in the X axis direction. . Alignment marks m1 and m2 are provided adjacent to one end side of exposure areas PA1 and PA4, alignment marks m3 and m4 are provided adjacent to one end side of exposure areas PA2 and PA5, and alignment marks m5 and m6 are The exposure areas PA3 and PA6 are provided adjacent to one end side.

  In the present embodiment, the microscopes 5A to 5F (detection areas AL1 to AL6) are arranged corresponding to the six alignment marks m1 to m6 arranged on the substrate P so as to be separated in the Y-axis direction. The microscopes 5A to 5F are provided so that the alignment marks m1 to m6 are simultaneously arranged in the detection areas AL1 to AL6. The alignment system 5 can simultaneously detect the six alignment marks m1 to m6 using the microscopes 5A to 5F.

  The control device 9 comprehensively controls the above-described units. The control device 9 controls the operation of each drive mechanism such as the drive mechanism of the mask stage 1, the drive mechanism 20 of the substrate stage 2, the drive mechanism 43 and the drive mechanism 44 of the transport system 4, and also forms an image of the projection system PS. The characteristic adjusting device 30 and the like are controlled. For example, the control device 9 adjusts at least one of the position and the posture of the substrate P, for example, based on the detection result by the alignment system 5.

  In addition, the control device 9 sets predetermined processing parameters by performing calculations based on detection results of the tray identification sensor 17 and the substrate identification sensor 18, for example. As this processing parameter, for example, a processing parameter (correction value parameter) of a correction value for correcting the detection result by the alignment system 5 and a parameter (mounting) for adjusting the mounting speed for mounting the substrate P on the substrate stage 2. Speed parameter), a parameter for adjusting the exhaust speed when the substrate P is placed on the substrate stage 2 (exhaust speed parameter), and the transport speed when the substrate P is transported between the relay unit 15 and the substrate stage 2. For example, a parameter for adjusting (conveyance speed parameter) can be used.

  The set processing parameters are stored in the storage device 10, for example. The storage device 10 can store a plurality of parameters for each unit. The storage device 10 may store not only the processing parameters obtained by calculation or the like in the control device 9 but also processing parameters obtained in advance. In this case, the processing parameter newly obtained in the control device 9 may be updated and stored with respect to the processing parameter obtained in advance, or a plurality of processing parameters may be accumulated and stored. I do not care. When accumulating and storing a plurality of processing parameters, for example, the control device 9 may be configured to select an optimum processing parameter from among the plurality of processing parameters when used for controlling the above-described units.

Next, an example of a method for processing the substrate P using the exposure system SYS having the above-described configuration will be described with reference to the process charts shown in FIGS. 5 to 9 and the flowchart shown in FIG.
First, for example, the pretreatment of the exposure process is performed on the substrate P in the external apparatus EA. An example of the external device EA in this case is a coating processing device that forms a film of a photosensitive agent on the substrate P, and the coating processing is performed as preprocessing (step ST00).

  After the coating process, the substrate P is carried into the exposure apparatus EX from the external apparatus EA. The loaded board | substrate P is conveyed by the relay part 15, as shown in FIG. 5, and is mounted in tray Tr (step ST01). In the relay unit 15, a rough alignment process (pre-alignment process) of the substrate P (tray Tr) with respect to the substrate stage 2 is executed. For example, the position of the substrate P in the θZ direction is detected by a line sensor provided in the relay unit 15, and the pre-alignment process of the substrate P is executed based on the detection result.

  Further, the control device 9 acquires identification information of the tray Tr and the substrate P (ST02). Specifically, the control device 9 causes the tray identification sensor 17 to detect the tray identification mark Tm of the tray Tr and also uses the substrate identification sensor 18 to detect the substrate identification mark Pm of the substrate P. The detection results by the tray identification sensor 17 and the substrate identification sensor 18 are transmitted to the control device 9, for example. In the control device 9, the tray Tr and the substrate P are identified based on the detection results (identification information of the tray Tr and the substrate P) by the tray identification sensor 17 and the substrate identification sensor 18.

  Here, the tray identification sensor 17 is used to detect the identification information of the tray Tr. However, for example, the operator identifies the tray Tr visually, and the identification result is controlled as the identification information of the tray Tr. An input may be made to the device 9. In this case, the movement of the tray corresponding to the input identification information is monitored by a monitoring system or a tracking system (not shown) to reliably identify the tray Tr used for transporting the substrate P being processed. Can do.

  Next, based on the identification information of the tray Tr and the substrate P, the control device 9 performs processing parameters relating to the transfer process, the placement process, and the exposure process, that is, the correction value parameter, the placement speed parameter, and the exhaust speed parameter. The conveyance speed parameter is set (step ST03).

  When setting the processing parameter, the control device 9 selects, for example, an optimum value corresponding to the identified tray Tr and the substrate P from among a plurality of parameters stored in the storage device 10, or A processing parameter can be set by newly calculating each processing parameter based on information. For example, for each processing parameter, some of the processing parameters may be selected from a plurality of parameters, and other processing parameters may be newly obtained by calculation or the like.

  Next, the control device 9 uses the first transport member 41 to carry the tray Tr supporting the substrate P into the substrate stage 2. The control device 9 previously arranges the substrate stage 2 at the substrate exchange position CP. In the carry-in process, first, the substrate P supported by the support mechanism 16 is lifted by the first transport member 41, and the tray Tr and the substrate P supported by the tray Tr are moved at a predetermined speed in the + Z direction of the substrate replacement position CP. It is conveyed to the position (step ST04). The control device 9 adjusts the transport speed of the substrate P based on the transport speed parameter set in step ST03. Since the transport speed parameter is set for each substrate P or each tray Tr, the transport speed is adjusted for each substrate P or each tray Tr.

  After the tray Tr and the substrate P are arranged at a position on the + Z direction with respect to the substrate replacement position CP, the substrate P is placed on the substrate stage 2 by the first transport member 41 as shown in FIG. 7 (step ST05). . In this placement process, the first transport member 41 is moved in the −Z direction by the drive mechanism 43 so that at least a part of the tray Tr is disposed in the groove of the substrate stage 2 and the substrate P is moved to the substrate stage. 2 is held. As shown in FIG. 8, this placement process is performed while exhausting the gas in the space between the substrate stage 2 and the first transport member 41 by the exhaust mechanism 21 provided in the substrate stage 2.

  In the placement process, the control device 9 adjusts the moving speed (placement speed) of the first transport member 41 based on the placement speed parameter set in step ST03, and the exhaust speed set in step ST03. The exhaust speed of the exhaust mechanism 21 is adjusted based on the parameters. Since the placement speed parameter and the exhaust speed parameter are set for each substrate P or each tray Tr, the placement speed and the exhaust speed are adjusted for each substrate P or each tray Tr.

  At least before the exposure of the substrate P is started, the mask M is held on the mask stage 1. Further, at least before the exposure of the substrate P is started, a setup process such as a baseline measurement process is executed. In the baseline measurement processing, the position of the pattern image of the mask M (the position of the projection region PR) by the projection system PS and the detection region AL1 of the microscopes 5A to 5F of the alignment system 5 that detects the alignment marks m1 to m6 on the substrate P. This is a process of measuring the positional relationship (baseline amount) with .about.AL6.

  Further, before the exposure of the substrate P is started, the control device 9 detects the alignment marks m1 to m6 on the substrate P by the mark detection device, and the exposure target region (shot region) of the substrate P with respect to the projection region PR is detected. A position is derived (step ST06). When the detection result deviates from the intended value, the control device 9 corrects the detection result.

  The control device 9 corrects the detection results of the alignment marks m1 to m6 based on the correction value parameter set in step ST03 (step ST07). Since the correction value parameter is set for each substrate P or tray Tr, the detection result is corrected with an optimum correction value for each substrate P or tray Tr.

  Next, the control device 9 adjusts the position and posture of the substrate P on the substrate stage 2 based on the corrected detection results of the alignment marks m1 to m6 (step ST08). Specifically, the drive mechanism 20 provided on the substrate stage 2 is controlled to adjust the position and tilt of the substrate stage 2.

  After adjusting the position and orientation of the substrate P, the control device 9 moves the substrate stage 2 holding the substrate P to the projection region PR and starts a process of exposing the substrate P (step ST09). The control device 9 controls the mask stage 1 and the substrate stage 2 to move the mask M in the X-axis direction with respect to the illumination region IR on the object plane side of the projection system PS (projection optical system PL), while projecting the projection system. Exposure light EL is emitted from the illumination system IS while moving the substrate P in the X-axis direction with respect to the projection region PR on the image plane side of PS (projection optical system PL). Accordingly, the substrate P is exposed with the exposure light EL from the mask M and the projection system PS (projection optical system PL) while moving in the X-axis direction with respect to the projection region PR. At this time, the control device 9 may adjust the imaging characteristic adjusting device 30 based on the corrected detection results of the alignment marks m1 to m6.

  After the exposure processing of the substrate P is completed, the control device 9 moves the substrate stage 2 holding the exposed substrate P from the exposure position EP to the substrate replacement position CP. The control device 9 uses the second transport member 42 to carry out the tray Tr supporting the substrate P from the substrate stage 2 (step ST10). The control device 9 carries out the tray Tr supporting the substrate P from the substrate stage 2 arranged at the substrate exchange position CP. The substrate P is unloaded from the substrate stage 2 together with the tray Tr.

  Through the above steps, the processing for one lot of substrates P in the exposure apparatus EX is completed. In the exposure apparatus EX, the same lot includes a group of a plurality of substrates P to be exposed using the same mask M. Further, at least in the same lot, the carry-in process (including the transfer process and the placement process), the exposure process, and the carry-out process of the substrate P are executed under the same exposure recipe.

  The exposed substrate P is transferred from the exposure apparatus EX to the external apparatus EA, and in the external apparatus EA, for example, a process of developing the substrate P (photosensitive agent) (step ST11) and a process of forming the substrate P (step ST12). ) Is performed. Thereafter, each process described above is repeated in the same lot.

  In the exposure apparatus EX, when the processing of one lot is completed, the mask M is replaced, and the second transfer processing, placement processing, and exposure processing are performed on each substrate P. In the second and subsequent processing, for example, with the replacement of the mask M, the substrate P loading processing, exposure processing, and unloading processing are performed under an exposure recipe different from the exposure recipe used during the previous processing. In the second and subsequent exposure processes, the exposure process is performed so as to overlap the exposure areas PA1 to PA6 subjected to the first exposure process.

  Also in the second and subsequent processes, the control device 9 acquires the identification information of at least one of the substrate P and the tray Tr as in the first process, and sets each processing parameter based on the identification information. Then, the exposure process, the transfer process, and the placement process are performed based on the set process parameters.

  When performing exposure processing and processing by the external apparatus EA on the substrate P, for example, if there is slight unevenness (such as temperature unevenness of the heating mechanism) in the conditions of the external apparatus EA, different deformation may occur for each substrate P. Also in the exposure apparatus EX, for example, there are cases where unique deformation or distortion occurs for each tray Tr used for transporting the substrate P, for example. For this reason, if correction is performed uniformly using the same exposure recipe, it becomes difficult to cope with individual deformations and distortions of the substrate P and the tray Tr, and the processing accuracy for the substrate P is lowered. there is a possibility.

  In contrast, in the present embodiment, at least one of the substrate P and the tray Tr is identified, and the exposure process, the transport process, and the placement process are performed based on the identification result. An exposure process, a transport process, and a placement process according to Tr can be performed. Thereby, even when individual deformations or the like occur in the substrate P or the tray Tr, correction according to the individual deformations can be performed, so that the processing accuracy for the substrate P can be improved.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above embodiment, the identification information of both the substrate P and the tray Tr is acquired. However, the present invention is not limited to this, and only one of the identification information of the substrate P and the identification information of the tray Tr is acquired. You may make it. Alternatively, the identification information may be acquired in the external device EA, and the identification information may be transmitted to the control device 9 via the communication device 90 and the communication device 91.

  In the exposure system SYS of the above embodiment, the exposure apparatus EX is controlled by the control apparatus 9 and the external apparatus EA is controlled by the control apparatus 80. However, the present invention is not limited to this. For example, the exposure apparatus EX In addition, the configuration may include a main control device that controls the external device EA in an integrated manner, and a series of processes may be performed under the control of the main control device. In this case, communication of identification information may be performed in the main controller.

  In the above embodiment, when the identification information is acquired in the second and subsequent processing, the method is the same as the method of acquiring the identification information in the first processing. However, the present invention is not limited to this. . For example, in the second and subsequent processes, the control device 9 can also acquire the identification information of the substrate P based on the detection result by the alignment system 5.

  Specifically, first, the detection results of the alignment marks m1 to m6 of the substrate P to be processed for the second time are compared with the first detection results. When there is a difference between the two detection results, the control device 9 calculates an orthogonality component or a nonlinear component of the deformation of the substrate P based on the detection result. For the orthogonality component and the nonlinear component, a plurality of threshold values are obtained in advance and stored in the storage device 10 or the like. In this case, a plurality of processing parameters corresponding to the respective threshold values are set and stored in the storage device 10 or the like in the same manner. By doing in this way, the control apparatus 9 can select a processing parameter according to a calculation result.

  In the above embodiment, the correction parameter, the mounting speed parameter, the exhaust speed parameter, and the transport speed parameter have been described as processing parameters set by the control device 9, but the present invention is not limited to this. It may be configured to set processing parameters in other operations of the exposure apparatus EX or the external apparatus EA. Examples of such processing parameters include processing parameters relating to the moving speed of the mask stage 1 of the exposure apparatus EX and the moving speed of the substrate stage 2.

  The substrate P in each of the above embodiments is not only a glass substrate for a display device, but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the substrate P with the exposure light EL through the pattern of the mask M by moving the mask M and the substrate P synchronously. In addition, the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and is applied to a step-and-repeat type projection exposure apparatus (stepper) that sequentially moves the substrate P stepwise. Can do.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.

  Further, the present invention relates to a substrate stage for holding a substrate as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, etc., and a reference mark without holding the substrate. The present invention can also be applied to an exposure apparatus that includes a formed reference member and / or a measurement stage on which various photoelectric sensors are mounted. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a liquid crystal display element or a display, but an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on a substrate P, a thin film magnetic head, an image sensor (CCD) In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy.

  The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 11, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment The substrate is manufactured through a substrate processing step 204, a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like. In step 204, the photosensitive agent is developed to form an exposure pattern layer (developed photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.

  Note that the requirements of the above-described embodiments and modifications can be combined as appropriate. Some components may not be used. In addition, as long as it is permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  SYS ... Exposure system EX ... Exposure apparatus M ... Mask P ... Substrate Pm ... Substrate identification mark Tr ... Tray Tm ... Tray identification mark m1-m6 ... Alignment mark PS ... Projection optical system 2 ... Substrate stage 5 ... Alignment system 5A- 5F ... Microscope 9 ... Control device 10 ... Storage device 15 ... Relay unit 17 ... Tray identification sensor 18 ... Substrate identification sensor 20, 43, 44 ... Drive mechanism 21 ... Exhaust mechanism 30 ... Imaging characteristic adjusting device 41 ... First transport member 42 ... 2nd conveyance member EA ... External device 90, 91 ... Communication part

Claims (19)

A substrate processing method for processing a substrate, comprising:
Supporting the back surface of the substrate by a support member;
Transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on a stage;
Obtaining identification information including information relating to identification of the support member;
Based on the identification information, at least one of a transport condition for transporting the substrate supported by the support member and a placement condition for placing the substrate and the support member on the stage is set. To do
Only including,
The transport conditions, conditions including the substrate processing method of the conveying speed at the time of transporting the substrate. A substrate processing method for processing a substrate, comprising:
Supporting the back surface of the substrate by a support member;
Transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on a stage;
Obtaining identification information including information relating to identification of the support member;
Based on the identification information, at least one of a transport condition for transporting the substrate supported by the support member and a placement condition for placing the substrate and the support member on the stage is set. To do
Including
The placing conditions,置速degree conditions including board processing method for mounting at the time of mounting the substrate on the stage. A substrate processing method for processing a substrate, comprising:
Supporting the back surface of the substrate by a support member;
Transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on a stage;
Obtaining identification information including information relating to identification of the support member;
Based on the identification information, at least one of a transport condition for transporting the substrate supported by the support member and a placement condition for placing the substrate and the support member on the stage is set. To do
Including
Exhausting the gas between the substrate and the stage using an exhaust mechanism provided on the stage when the substrate and the support member are placed on the stage;
The placing conditions, conditions including board processing method to an exhaust rate by the exhaust mechanism. A substrate processing method for processing a substrate, comprising:
Supporting the back surface of the substrate by a support member;
Transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on a stage;
Obtaining identification information including information relating to identification of the support member;
Based on the identification information, at least one of a transport condition for transporting the substrate supported by the support member and a placement condition for placing the substrate and the support member on the stage is set. To do
Including
The substrate processing method, wherein the substrate is placed on an upper surface of a holding unit provided on the stage, and the support member is placed on the stage below the upper surface of the holding unit. The substrate processing method according to claim 4, wherein the support member has a frame structure, and the frame structure is placed in a groove formed in the holding portion. The identification information is, the substrate processing method according to any one of claims 1 to 5 including the information regarding the identification of the substrate. The support member has an identification mark including information on identification of the support member;
The identification information is, the substrate processing method according to any one of claims 1 to 6, which is acquired by detecting the identification mark. Exposing the substrate placed on the stage;
Based on the identification information, the substrate processing method according to any one of claims 1 to 7 including the setting the exposure conditions for exposing the substrate. Measuring a mark provided on the substrate;
Correcting the measurement result of the mark based on the identification information,
The substrate processing method according to claim 8 , wherein the exposure condition is set based on the measurement result corrected based on the identification information. A substrate processing apparatus for processing a substrate;
A support member for supporting the back surface of the substrate;
A stage on which the substrate and the support member are placed;
A transport device for transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on the stage;
An information acquisition unit for acquiring identification information including information on identification of the support member;
Based on the identification information acquired by the information acquisition unit, a transport condition for transporting the substrate supported by the support member, and a mounting for mounting the substrate and the support member on the stage. A control device for setting at least one of the setting conditions;
Equipped with a,
The transport condition is a substrate processing apparatus including a condition related to a transport speed when transporting the substrate. A substrate processing apparatus for processing a substrate;
A support member for supporting the back surface of the substrate;
A stage on which the substrate and the support member are placed;
A transport device for transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on the stage;
An information acquisition unit for acquiring identification information including information on identification of the support member;
Based on the identification information acquired by the information acquisition unit, a transport condition for transporting the substrate supported by the support member, and a mounting for mounting the substrate and the support member on the stage. A control device for setting at least one of the setting conditions;
With
The placing conditions, conditions including board processor regarding placing置速degree when mounting the substrate on the stage. A substrate processing apparatus for processing a substrate;
A support member for supporting the back surface of the substrate;
A stage on which the substrate and the support member are placed;
A transport device for transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on the stage;
An information acquisition unit for acquiring identification information including information on identification of the support member;
Based on the identification information acquired by the information acquisition unit, a transport condition for transporting the substrate supported by the support member, and a mounting for mounting the substrate and the support member on the stage. A control device for setting at least one of the setting conditions;
With
An exhaust mechanism provided in the stage for exhausting gas between the substrate and the stage transported above the stage by the transport device;
The placing conditions, the exhaust system by the exhaust speed including board processor conditions on. A substrate processing apparatus for processing a substrate;
A support member for supporting the back surface of the substrate;
A stage on which the substrate and the support member are placed;
A transport device for transporting the substrate supported by the support member together with the support member, and placing the substrate and the support member on the stage;
An information acquisition unit for acquiring identification information including information on identification of the support member;
Based on the identification information acquired by the information acquisition unit, a transport condition for transporting the substrate supported by the support member, and a mounting for mounting the substrate and the support member on the stage. A control device for setting at least one of the setting conditions;
With
The stage has a holding part on which the substrate is placed,
The transport apparatus is a substrate processing apparatus in which the substrate is placed on an upper surface of the holding unit, and the support member is placed on the stage below the upper surface of the holding unit. The support member has a frame structure;
The substrate processing apparatus according to claim 13, wherein the transport device places the front support member on a stage so that the frame structure is disposed in a groove formed in the holding portion. The identification information is, the substrate processing apparatus according to any one of claims 1 0-14 comprising information about the identity of the substrate. The support member has an identification mark including information on identification of the support member;
The information acquisition unit, a substrate processing apparatus according to any one of claims 1 0-15 comprising a sensor for detecting the identification mark. An exposure processing unit for exposing the substrate placed on the stage;
The control device, based on said identification information, a substrate processing apparatus according to any one of claims 1 0-1 6 for setting exposure conditions for exposing the substrate by the exposure processing unit. A measuring unit for measuring a mark provided on the substrate;
The substrate processing according to claim 17 , wherein the control device corrects a measurement result obtained by the measurement unit based on the identification information, and sets the exposure condition based on the measurement result corrected based on the identification information. apparatus. Using the substrate processing apparatus according to claim 17 or 18 , exposing the substrate;
Developing the substrate exposed by the substrate processing apparatus;
Processing the developed substrate;
A device manufacturing method including:

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