JP3892766B2 - Substrate processing system and substrate processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention includes a substrate processing system including a plurality of substrate processing apparatuses that perform predetermined processing on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk (hereinafter referred to as “substrate”), The present invention relates to a substrate processing method, and more particularly to an improvement for making the substrate processing environments of a plurality of substrate processing apparatuses substantially the same.
[0002]
[Prior art]
In the substrate processing apparatus, surface treatment such as chemical treatment or cleaning treatment with various chemical solutions or pure water (hereinafter also referred to as “treatment solution”) is sequentially performed. As one of the processes, a polymer removal process after dry etching is known. For example, in a so-called single-wafer type substrate processing apparatus that performs substrate processing for each substrate, in the polymer removal processing, (1) the polymer residue is attached to the bottom or side wall of the wiring pattern. The polymer residue is modified by supplying a chemical solution to the substrate while rotating the substrate, and then (2) the modified polymer residue is washed away by supplying pure water to the substrate while rotating the substrate. To remove the polymer residue from the substrate. As described above, since the single-wafer type polymer removal processing is performed for each substrate, in order to further improve the production amount of the substrate, a new substrate processing apparatus is purchased and the substrate processing is performed. This will be handled by increasing the number of devices.
[0003]
In this case, when purchasing a device (hereinafter also referred to as a “new purchase device”) having the same hardware configuration as a substrate processing device (hereinafter also referred to as a “conventional operation device”) that has been operated in the semiconductor factory, It is possible to use parameters of a conventional operating apparatus as parameters necessary for setting the substrate processing environment (for example, setting of a filter fan unit that forms a downflow in the substrate processing apparatus).
[0004]
However, even though the conventional operation apparatus and the newly purchased apparatus have basically the same configuration of each substrate processing apparatus, the installation environment of each substrate processing apparatus is not completely the same, Their specific configurations and functions are not necessarily the same, and therefore, the processing result of each substrate may vary. For example, paying attention to the pipes that supply chemical liquids from a common chemical liquid supply source installed in a semiconductor factory to each of the conventional operation apparatus and the newly purchased apparatus, the pipe length from the chemical liquid supply source to each substrate processing apparatus is not necessarily the same. Not. Therefore, the pressure value in the piping of the chemical liquid supplied from the chemical liquid supply source may be different between the conventional operating apparatus and the newly purchased apparatus, and as a result, the substrate processing conditions in each substrate processing apparatus are different. The processing results will vary.
[0005]
For this reason, conventionally, an operator of a substrate processing apparatus (hereinafter simply referred to as an “operator”) makes the substrate processing environment of the conventional operating apparatus and the newly purchased apparatus substantially the same based on the parameters of the conventional operating apparatus. Is calculated by experiments, etc., so that the substrate processing environment of the conventional operation apparatus and the newly purchased apparatus is made substantially the same, and variation in the substrate processing results is suppressed.
[0006]
[Problems to be solved by the invention]
However, due to further miniaturization of wiring patterns and multilayered wiring in recent years, more precise control of processing conditions is required in substrate processing than before, and an operator can calculate a more accurate correction amount. Therefore, the number of operator man-hours increases, and as a result, the substrate manufacturing cost increases.
[0007]
The above problems caused by the difference in the substrate processing environment in each substrate processing apparatus are not limited to the polymer removal processing, but are generally caused by substrate processing.
[0008]
Accordingly, an object of the present invention is to provide a technique capable of making the substrate processing environments of a plurality of substrate processing apparatuses substantially the same in a substrate system that performs the same substrate processing by a plurality of substrate processing apparatuses. To do.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention described in claim 1 is a substrate processing system, which is connected to a first substrate processing apparatus and the first substrate processing apparatus via a network. And has the same internal configuration as the first substrate processing apparatus. The second substrate processing apparatus is connected to the first substrate processing apparatus and the second substrate processing apparatus via a network, and controls the substrate processing environment of the first substrate processing apparatus. Of the first environmental control equipment A first database that stores reference values as control command values and a substrate processing environment of the second substrate processing apparatus are controlled. Second environmental control equipment A first transmission unit that transmits a reference value stored in the first database as a control command value, and the second substrate processing apparatus according to the reference value transmitted by the first transmission unit The second environmental control device When the control is performed, the measured value representing the substrate processing environment in the second substrate processing apparatus is received from the second substrate processing apparatus, and the first transmission means transmits the measured value. A calculation means for calculating a correction amount that makes the substrate processing environments of the first substrate processing apparatus and the second substrate processing apparatus substantially the same from a reference value and the actual measurement value, and transmitted by the first transmission means An information processing apparatus having a second database that stores the correction amount in association with the reference value, and the second substrate processing apparatus transmits the control transmitted from the information processing apparatus Based on the command value, the second substrate processing apparatus Second environmental control equipment Control means for controlling the measurement, measurement means for obtaining the actual measurement value, and second transmission means for transmitting the actual measurement value to the information processing apparatus.
[0010]
A second aspect of the present invention is the substrate processing system according to the first aspect, wherein the information processing apparatus has the correction amount corresponding to a selection reference value selected from the first database as the reference value. Extracting means as a corresponding correction value from the second database, wherein the first transmitting means uses the value obtained by correcting the selection reference value by the corresponding correction amount as the control command value. 2 to the substrate processing apparatus.
[0012]
Claim 3 The invention described in claim 1 Or Claim 2 The substrate processing system according to claim 1, wherein the first substrate processing apparatus and the second substrate processing apparatus are: As first and second environmental control devices, respectively A downflow forming section for forming a downflow of clean air, wherein the correction means obtains a correction amount from the reference value and the actual measurement value in the downflow forming section of the first substrate processing apparatus, To do.
[0013]
Claim 4 The invention as described in claim 1 to claim 1 3 The substrate processing system according to any one of the above, wherein the first substrate processing apparatus and the second substrate processing apparatus are: As first and second environmental control devices, respectively It includes an exhaust unit that exhausts the atmosphere in the apparatus itself, and the correction means obtains the correction amount from the reference value and the measured value in the exhaust unit of the first substrate processing apparatus.
[0014]
Claim 5 The invention described in claim Any one of claims 1 to 4 The first substrate processing apparatus according to claim 1, wherein the first substrate processing apparatus includes a first pipe for introducing a fluid supplied from a fluid supply source into the first substrate processing apparatus, Communicated with the first environmental control device, Pressure measuring means for measuring a pressure value of the fluid in the first pipe is provided as a substrate processing environment in the first pipe, while the second substrate processing apparatus includes Second environment Control equipment And a second pipe that introduces the fluid supplied from the fluid supply source into the second substrate processing apparatus, and the first transmission means transmits the control command value as the control command value. The pressure value of the fluid is transmitted, the measurement means measures the pressure value of the fluid in the second pipe, and the correction means calculates the correction amount from the pressure value and the measured value of the fluid. It is characterized by calculating | requiring.
[0015]
Claim 6 The invention described in claim 5 The substrate processing system according to claim 1, wherein the fluid is a base processing solution.
[0016]
Claim 7 The invention described in claim 5 The substrate processing system according to claim 1, wherein the fluid is a gas used during substrate processing.
[0017]
Claim 8 The invention described in claim 5 Or claims 7 The substrate processing system according to any one of the above, First and second environmental control devices Is a pump for controlling the pressure of the fluid.
[0018]
Claim 9 The substrate processing method is a first substrate processing apparatus. First environmental control equipment A reference value transmitted as a control command value to the second substrate processing apparatus Second environmental control equipment And a first processing environment setting step for setting a substrate processing environment in the second substrate processing apparatus, and using the reference value The second environmental control device From the actual measurement value acquisition step of acquiring the actual measurement value expressing the substrate processing environment of the second substrate processing apparatus when the control is performed, the reference value and the actual measurement value, the first substrate processing apparatus and the A calculation step of calculating a correction amount of the reference value for making the substrate processing environment of the second substrate processing apparatus substantially the same. The first substrate processing apparatus and the second substrate processing apparatus have the same internal configuration. It is characterized by that.
[0019]
Claim 1 0 The invention described in claim 9 The substrate processing method according to claim 2, wherein after the calculation step, a value obtained by correcting the reference value by the correction amount is calculated by the second substrate processing apparatus. The second environmental control device And a second processing environment setting step for setting the substrate processing environment of the second substrate processing apparatus.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0021]
<1. Schematic configuration of substrate processing system>
FIG. 1 is a block diagram showing a configuration of a substrate processing system 800 according to an embodiment of the present invention. As shown in FIG. 1, a substrate processing system 800 mainly includes a plurality of substrate processing apparatuses 100 and 200 that perform polymer removal processing, and the processing status of each substrate processed by the substrate processing apparatuses 100 and 200 and the substrate processing apparatus. A maintenance server 400 that stores and analyzes the usage statuses of 100 and 200, an apparatus server 300 that calculates a correction amount for making the substrate processing environments of the substrate processing apparatuses 100 and 200 substantially the same, and substrate processing The network 100 includes the devices 100 and 200, the device server 300, and the maintenance server 400, and these are installed in the same semiconductor manufacturing factory (hereinafter simply referred to as “factory”) 650.
[0022]
Here, the substrate processing environment refers to the atmosphere state in the substrate processing apparatus (for example, the cleanliness of the atmosphere by the filter fan unit FFU described later, the downflow state formed by the filter fan unit FFU, the forced atmosphere by the exhaust unit VC) Exhaust) or a common fluid supply source (for example, a nitrogen gas common supply source 612 or a pure water common supply source 622 described later) installed in the factory 650 and supplied to individual piping included in the substrate processing apparatus via the common piping. Is the pressure state of the fluid in the individual pipe of the fluid (for example, nitrogen gas or pure water), and the substrate processing result performed in the substrate processing apparatus due to the fluctuation of the atmospheric state or the fluid pressure In other words, it becomes impossible to obtain a satisfactory substrate processing result. Therefore, the value indicating the atmospheric state, the pressure value of the fluid, and the like are important parameters that affect the substrate processing result.
[0023]
The configuration of the maintenance server 400 as hardware is the same as that of a general computer, and data (hereinafter referred to as “processing status data”) indicating the processing status of a substrate subjected to various processes by the substrate processing apparatuses 100 and 200. Is stored in the maintenance database 410, and the processing status and processing result of the substrate are analyzed based on the data. The processing status data of the substrates processed by the substrate processing apparatuses 100 and 200 (for example, the discharge pressure history of the chemical solution supplied to the substrates) is stored in the maintenance database 410 of the maintenance server 400 via the network 600 and the apparatus server 300. Is done.
[0024]
In the maintenance database 410, the processing status data is stored with a substrate identifier set to uniquely identify each substrate processed by the substrate processing apparatuses 100 and 200. Then, by using the substrate processing status analysis software incorporated in the maintenance server 400, the operator extracts the processing status data of the specific substrate specified by the substrate identifier from the maintenance database 410, and performs the current processing of the specific substrate. The situation can be confirmed, and when a processing failure occurs in the substrate, the process status data extracted from the maintenance database 410 can be used to analyze which process caused the processing failure.
[0025]
The remote diagnosis apparatus 500 is installed at a different location from the factory 650, and the substrate processing apparatuses 100 and 200 of the factory 650 are connected via the local network 700, the wide area network 750, and the factory network 600. Are connected to the apparatus server 300 and the maintenance server 400. In addition, the remote diagnosis apparatus 500 incorporates substrate processing status analysis software similar to the maintenance server 400. Therefore, the remote diagnosis apparatus 500 can confirm the processing status of the substrates processed by the substrate processing apparatuses 100 and 200 in the factory 650 and analyze the processing results.
[0026]
<2. Configuration of substrate processing apparatus and apparatus server>
FIG. 2 is a diagram showing the configuration of the substrate processing apparatuses 100 and 200 and the apparatus server 300. Here, the configuration of the substrate processing apparatuses 100 and 200 that perform the polymer removal processing will be described first, and then the correction amount that makes the substrate processing environments of the substrate processing apparatus 100 and the substrate processing apparatus 200 substantially the same is calculated and stored, etc. The apparatus server 300 to be performed will be described.
[0027]
(1) Configuration of substrate processing equipment
Here, the configuration of the substrate processing apparatuses 100 and 200 will be described. Since the substrate processing apparatus 100 has the same internal configuration as the substrate processing apparatus 200, only the substrate processing apparatus 100 will be described here, but from a nitrogen gas common supply source 612, a pure water common supply source 622, and the like which will be described later. The lengths of supply pipes such as nitrogen gas and pure water supplied to each of the substrate processing apparatuses 100 and 200 are different, and there is a numerical difference in function due to this (this will be described in detail later). ).
[0028]
The substrate processing apparatus 100 performs a polymer removal process in a dry etching process using a resist film as a mask to remove a polymer residue in which a part of the resist film is scattered and adheres to the bottom or side wall of the wiring pattern and is cured. It is. As shown in FIG. 2, the substrate processing apparatus 100 mainly includes a plurality of rotation processing units SR1 to SR4, an indexer ID, and a transfer robot TR.
[0029]
The indexer ID is equipped with a carrier (not shown) that can store a plurality of substrates and includes a mobile robot. The indexer ID pays out an unprocessed substrate from the carrier to the transport robot TR and receives a processed substrate from the transport robot TR. And store it in the carrier.
[0030]
FIG. 3 is a diagram illustrating a configuration of the rotation processing unit SR1 of the substrate processing apparatus 100. Since rotation processing unit SR1 has the same internal configuration as rotation processing units SR2 to SR4, only rotation processing unit SR1 will be described here.
[0031]
The rotation processing unit SR1 is a unit that removes polymer residues by supplying a processing liquid while rotating the substrate. The holding unit 131 sucks and holds the substrate W in a substantially horizontal posture. Further, the lower surface of the holding portion 131 is fixed to the upper end portion of the rotation shaft 132 of the motor 133, and is configured to be able to rotate the substrate W around an axis in the vertical direction.
[0032]
A circular cup 141 is provided around the holding portion 131 so as to surround the substrate W so as to prevent the processing liquid supplied to the substrate W from scattering outside the rotation processing unit SR1. .
[0033]
The removal liquid discharge nozzle 114 is connected to a removal liquid supply source (not shown) through a pipe (not shown), and the removal liquid is supplied to the substrate W from the discharge port 115 while rotating the holding unit 131. Here, the removal liquid is a polymer removal liquid, and selectively removes only the polymer residue adhering to the bottom and side walls of the wiring pattern formed on the substrate.
[0034]
Further, the removal liquid discharge nozzle 114 is connected to a nitrogen gas common supply source 612 through a pipe 113 (113a, 113c), a pump 151, and a common pipe 613 (see FIG. 2). Nitrogen gas is supplied upward. The nitrogen gas common supply source 612 is installed at a predetermined location in the factory 650, and is connected to each substrate processing apparatus disposed in the factory 650 via a common pipe 613 disposed in the factory 650. Supply nitrogen gas.
[0035]
As shown in FIG. 2, the pump 151 is connected to the pipes 613c and 113a, and is transmitted from a detection unit that detects the pressure value of nitrogen gas flowing through the pipe 113 by the sensor 151a and a control unit 160 described later. And a control unit that controls the pressure value of the nitrogen gas flowing through the pipe 113b based on the command value. Therefore, the nitrogen gas flowing through the pipe 113a can be adjusted to a predetermined pressure value based on the pressure value measured by the detection unit of the pump 151.
[0036]
As shown in FIG. 3, the pure water discharge nozzle 124 is connected to a pure water common supply source 622 through a pipe 123, a pump 152, and a common pipe 623, and is connected to the discharge port 125 while rotating the holding unit 131. Pure water is supplied to the substrate W. This pure water common supply source 622 is installed at a predetermined location in the factory 650 in the same manner as the nitrogen gas common supply source 612, and is connected to the factory 650 via a common pipe 623 provided in the factory 650. Pure water is supplied to each of the substrate processing apparatuses arranged in (1).
[0037]
The pump 152 is connected in communication with the pipes 623c and 123a. The pump 152 is based on a detection unit that detects a pressure value of pure water flowing through the pipe 123 by the sensor 152a and a command value transmitted from the control unit 160 described later. And a control unit for controlling the pressure value of pure water flowing through 123a. Therefore, the pure water flowing through the pipe 123a can be adjusted to a predetermined pressure value based on the pressure value measured by the detection unit of the pump 152.
[0038]
The pure water discharge nozzle 124 is connected to a nitrogen gas common supply source 612 through a pipe 113 (113a, 113b), a pump 151, and a common pipe 613, and nitrogen is discharged from the discharge port 125 toward the substrate W. Gas is supplied.
[0039]
As shown in FIG. 4, the filter fan unit FFU is arranged at the upper part of each of the indexer ID and the rotation processing units SR1 to SR4 (the filter fan unit FFU above the rotation processing units SR3 and SR4 is not shown), and mainly the fan unit 171. , And a filter unit 172 and a sensor 173.
[0040]
The air taken in from the clean room in which the substrate processing apparatus 100 is arranged becomes a downward air flow by rotating a fan (not shown) of the fan unit 171, and then a filter arranged at the lower part of the fan unit 171. By removing particles contained in the air flow in the portion 172, a clean air flow is obtained. Therefore, in the indexer ID and the rotation processing units SR1 to SR4, a clean air downflow is formed by the filter fan unit FFU. The filter fan unit FFU is provided with a sensor 173 that detects the operating state of the fan unit 171. Therefore, the state of the downflow of the clean air formed in the indexer ID and the rotation processing units SR1 to SR4 transmits a command value set based on the detection value measured by the sensor 173 to the fan unit 171. Adjustment can be made by controlling the portion 171 to a predetermined state.
[0041]
The exhaust unit VC is disposed below the indexer ID and the rotation processing units SR1 to SR4 in the substrate processing apparatus 100, and clean air supplied to the indexer ID and the rotation processing units SR1 to SR4 by the filter fan unit FFU as a substrate. It is a unit that exhausts to the outside of the processing apparatus 100. The exhaust unit VC includes a detection unit that detects exhaust pressure for exhausting clean air to the outside of the substrate processing apparatus 100 by the sensor 183, and a control unit that controls the exhaust pressure based on a command value transmitted from the control unit 160. Has been. Therefore, the exhaust pressure of clean air exhausted outside the substrate processing apparatus 100 can be adjusted to a predetermined value based on the exhaust pressure measured by the sensor 183.
[0042]
As shown in FIG. 3, the control unit 160 includes a memory 161 that stores programs, variables, and the like, and a CPU 162 that executes control according to the programs stored in the memory 161. The CPU 162 is connected via the program stored in the memory 161 via the rotation speed control of the motor 133, the pressure control of each pump, the fan unit control of the filter fan unit FFU, the exhaust pressure control of the exhaust unit VC, and the network 600. The communication control with the device / server is performed at a predetermined timing.
[0043]
(2) Device server configuration
The hardware configuration of the apparatus server 300 is the same as that of a general computer. As shown in FIG. 2, the correction amount for making the substrate processing environments of the substrate processing apparatus 100 and the substrate processing apparatus 200 substantially the same. A control unit 360 that performs calculations, a reference command value database 310 that stores reference command values used as control command values for controlling the substrate processing environment of the substrate processing apparatus 100, and a substrate processing environment of the substrate processing apparatus 200 as a substrate. It mainly includes a correction amount database 320 that stores correction amounts substantially the same as those of the processing apparatus 100.
[0044]
The reference command value database 310 is a database that stores data related to the substrate processing environment that affects the processing result when the substrate processing is performed in the substrate processing apparatus 100. FIG. 5 shows an example of the configuration of the reference command value database 310. As shown in FIG. 5, the reference command value database 310 has a plurality of fields (“item ID”, “device No.”, “item name”, “reference command value”).
[0045]
“Item ID” is a value used to uniquely identify a predetermined record from a plurality of records (row direction data set) stored in the reference command value database 310, and a new record has been added. Automatically allocated. The “item name” stores a description of the substrate processing environment for the record specified by the “item ID”.
[0046]
The “reference command value” is a parameter (hereinafter also referred to as “environment parameter”) for setting the substrate processing environment specified by each “item ID”. Specifically, it controls the substrate processing environment described later. It is an operating parameter of equipment (for example, pumps 251 and 252, filter fan unit FFU, exhaust unit VC, etc .: see FIGS. 3 and 4) (hereinafter also referred to as “environment control equipment”). For example, when “item ID” = 3, it means that the downflow state by the filter fan unit FFU is set to “30”.
[0047]
“Apparatus No.” is a value for identifying a substrate processing apparatus to which the substrate processing environment specified by the “item ID” is applied. In the present embodiment, since the data stored in the reference command value database 310 is used only for the substrate processing environment of the substrate processing apparatus 100, “100” indicating the substrate processing apparatus 100 is displayed in “apparatus No.”. "(Constant) is stored.
[0048]
The correction amount database 320 is a database that stores the “reference command value” shown in FIG. 5 in association with a correction amount that makes the substrate processing environment of the substrate processing apparatus 200 substantially the same as the substrate processing environment of the substrate processing apparatus 100. . FIG. 6 shows an example of the configuration of the correction amount database stored in the apparatus server. As shown in FIG. 6, the correction amount database 320 has a plurality of fields (“correction amount ID”, “apparatus No.”, “item ID”, and “correction amount”). “Correction amount ID” is a value used to uniquely identify a predetermined record from a plurality of records (data set in the row direction) stored in the correction amount database 320, and a new record has been added. Automatically allocated.
[0049]
The “item ID” is the same as that included in the reference command value database 310, and the “item ID” stores a value for identifying each substrate processing environment. Therefore, when the “item ID” stored in the reference command value database 310 and the “item ID” stored in the correction amount database 320 are the same, the same substrate processing environment is indicated. For example, in the correction amount database 320, when “correction amount ID” = “10104”, since “item ID” = “4” (see FIG. 6), the “correction amount” includes the pure water pressure in the pump 152. The amount of correction is stored.
[0050]
“Apparatus No.” is a value for identifying the substrate processing apparatus to which the correction amount of the substrate processing environment specified by the “item ID” and “correction amount” is applied. In this embodiment, since the data stored in the correction amount database 320 is used only for the substrate processing apparatus 200, “200” (constant) indicating the substrate processing apparatus 200 is displayed in “apparatus No.”. Is stored. Further, when the “apparatus No.” stored in the reference command value database 310 is equal to the “apparatus No.” stored in the correction amount database 320, the same substrate processing apparatus is specified.
[0051]
The “correction amount” stores a correction amount for making the substrate processing environment of the substrate processing apparatus 200 substantially the same as the substrate processing environment of the substrate processing apparatus 100. By the way, when processing the substrate W in each of the plurality of substrate processing apparatuses, the substrate processing environment is different because the installation environment of each substrate processing apparatus is different. As a result, the processing result of the substrate W in each substrate processing apparatus is different. Variations may occur. For example, as shown in FIG. 2, the pure water supplied from the pure water common supply source 622 reaches the substrate processing apparatuses 100 and 200 via the common pipe 623. However, the pipe length of the common pipe 623 (623a, 623c) from the pure water common supply source 622 to the pump 152 of the substrate processing apparatus 100, and the common pipe 623 from the pure water common supply source 622 to the pump 252 of the substrate processing apparatus 200. It is different from the pipe length of (623a, 623b). Therefore, the pressure value of pure water in the pipe 123a detected by the sensor 152a is different from the pressure value of pure water in the pipe 223a detected by the sensor 252a. As a result, the pure water pressure value is processed by the substrate processing apparatus 100. Variations in processing results between the substrate W and the substrate W processed by the substrate processing apparatus 200 occur.
[0052]
Therefore, for the record specified by the “correction amount ID” in the correction amount database 320, the value set in the “item ID” column (hereinafter referred to as the specific “item ID”) and “device No.” A value set in the column (hereinafter referred to as a specific “apparatus No.”) and a “correction amount” (hereinafter referred to as a specific “correction amount”) obtained in advance by experiments or the like are extracted from the correction amount database 320. To do. Subsequently, a record that matches the specific “item ID” value is selected from the reference command value database 310, and the value set in the “reference command value” field (hereinafter referred to as a specific “reference command value”) is corrected. Extract from the quantity database 320. The control command value is obtained by adding the specific “correction amount” to the specific “reference command value”, and the control command is sent to the substrate processing apparatus (here, the substrate processing apparatus 200) specified by the specific “apparatus No.”. The substrate processing environment specified by the specific “item ID” in the substrate processing apparatus 200 is substantially the same as the substrate processing environment of the substrate processing apparatus 100 (that is, within the allowable range centered on the specific “reference command value”). ).
[0053]
For example, when “correction amount ID” = “10103”, it is made to correspond to “reference command value” = “20” indicating the pressure value of nitrogen gas supplied from the nitrogen gas common supply source 612 and reaching the substrate processing apparatus 100. Therefore, “20.5” is transmitted to the substrate processing apparatus 200 as the control command value. Here, the control command value is a value transmitted to the substrate processing apparatuses 100 and 200 as a parameter value for setting the substrate processing environment when the substrate processing environment specified by the “item ID” is set. The case where only the reference command value is transmitted as the control command value is also included.
[0054]
The control unit 360 includes a memory 361 that stores programs, variables, and the like, and a CPU 362 that executes control according to the programs stored in the memory 361. The CPU 362 performs communication control with devices / servers connected via the network 600, access control to the reference command value database 310 and the correction amount database 320, and the like at predetermined timings in accordance with a program stored in the memory 361. .
[0055]
In addition, a display 351, a keyboard 352, and a mouse 353 are connected to the control unit 360. The operator can input necessary information to the control unit 160 from the keyboard 352 or the mouse 353 according to the contents displayed on the display 151.
[0056]
<3. Calculation of correction amount>
Here, a procedure for calculating a correction amount for suppressing variation in the processing results of the substrates W in each substrate processing apparatus by making the substrate processing environment of the substrate processing apparatus 200 substantially the same as the substrate processing environment of the substrate processing apparatus 100. explain. FIG. 7 and FIG. 8 are flowcharts showing a correction amount calculation procedure for making the substrate processing environment substantially the same.
[0057]
In the correction amount calculation procedure, when the operator gives an instruction to start the correction amount calculation process using the keyboard 352 or the mouse 353 according to the content displayed on the display 351, the control unit 360 first sets the variable n and the correction amount to the memory 361. A region of ΔR is secured and initialized to n = 1 and ΔR = 0, respectively (S101). Here, the variable n is a value corresponding to the “item ID” in the reference command value database 310 and is used to select a record specified by the “item ID” that matches the value of the variable n from the reference command value database 310. used. The correction amount ΔR is a variable for temporarily storing a calculated value when performing a correction amount calculation in steps S103 to S107 described later. Subsequently, the record having the “item ID” that matches the variable n is selected from the reference command value database 310, and the value of the “reference command value” included in the record is stored in the memory 361 (S102).
[0058]
Subsequently, the control unit 360 corrects the former by adding the correction amount ΔR to the reference command value stored in the memory 361 as a control command value (S103), and the control command value and the memory 361 store the control command value. By transmitting the “item ID” to the substrate processing apparatus 200 via the networks 600d and 600f, the environmental control device specified by the “item ID” is operated with the parameter specified by the control command value (S104). .
[0059]
Subsequently, while the environmental control device specified by the “item ID” is in operation, sensors provided in the environmental control device (for example, the sensor 251a of the pump 251, the sensor 252a of the pump 252, and the sensor 173 of the filter fan unit FFU). The actual value indicating the actual operating state of the environmental control device is detected by the sensor 183 of the exhaust unit VC, and the actual value is transmitted to the apparatus server 300 (S105). Then, the control unit 360 checks whether or not the actual measurement value detected by the sensor falls within a predetermined allowable range centered on the “reference command value” stored in the memory 361 (S106). If the measured value is outside the predetermined allowable range, it is determined that the measured value is not substantially the same as the reference command value, the correction amount ΔR is calculated (S107), and the process returns to step S103. Here, various calculation methods of the correction amount ΔR are conceivable. For example, when “reference command value” stored in the memory 361 is S and the actual measurement value is P, a value calculated by (S−P + ΔR) is newly set. It may be obtained by storing the correction amount ΔR in the correction amount ΔR.
[0060]
On the other hand, if the actual measurement value detected in step S106 is within the predetermined allowable range, the process moves to a new record in the correction amount database 320, and subsequently, the “item ID” of the new record is a variable stored in the memory 361. n indicates that the correction amount ΔR stored in the memory 361 is stored in the “correction amount” of the new record, and the correction amount of the substrate processing apparatus 200 is stored in the “correction amount” of the new record. For this purpose, “200” is stored in “device No.” (S108). In the present embodiment, since the calculation of the correction amount ΔR is performed only for the substrate processing apparatus 200, only “200” (constant) is stored in “apparatus No.”. In addition, since a numerical value that does not automatically overlap when a record is added is input to the “correction amount ID”, no new numerical value is generated or stored in this calculation process.
[0061]
If the calculation of the correction amount is not completed for all the substrate processing environments included in the reference command value database 310 (S109), 1 is added to the variable n (S110), and the process returns to step S102 to return to other “items”. The calculation processing of the correction amount of the substrate processing specified by “ID” is executed. On the other hand, when the calculation is completed for all the substrate processing environments, the correction amount calculation process is terminated.
[0062]
<4. Correction of substrate processing environment>
For example, when power is supplied to the substrate processing apparatus 200 in the stopped state and the activated state is entered, the control unit 360 sets the rotation processing units SR1 to SR4, the transfer robot TR, and the like to the initial state, and controls the environment control device, The substrate processing environments of the substrate processing apparatus 200 and the substrate processing apparatus 100 are set to be substantially the same. Here, a procedure for making the substrate processing environment of the substrate processing apparatus 200 substantially the same as the substrate processing environment of the substrate processing apparatus 100 using the correction amount stored in the correction amount database 320 will be described. FIG. 9 shows an example of setting the substrate processing environment based on the correction amount stored in the correction amount database 320.
[0063]
In the setting procedure of the substrate processing environment, when power supply to the substrate processing apparatus 200 is started and an activation state is set, first, areas of the variable n and the correction amount ΔR1 are secured in the memory 261, and n = 1 and ΔR1 = 0, respectively. (S201). Here, similarly to the calculation of the correction amount, the variable n corresponds to the “item ID” of the reference command value database 310, and the “item ID” that matches the value of the variable n from the reference command value database 310 is changed. Used to select records that have. The correction amount ΔR1 is a variable that is stored in the correction amount database 320 and temporarily stores the value of “correction amount” acquired in step S203 described later. Then, the record having the “item ID” that matches the variable n is selected from the reference command value database 310, and the value of the “reference command value” included in the record is stored in the memory 261 (S202).
[0064]
Subsequently, the control unit 260 connects to the apparatus server 300 via the networks 600d and 600f, searches for each record stored in the correction amount database 320 (see FIG. 6), and stores “item ID” in the correction amount database 320. ”And the value of the variable n stored in the memory 261 match, and the record in which the value of“ device No. ”in the correction amount database 320 matches“ 200 ”indicating the substrate processing apparatus 200 is selected. To do. Then, the value of “correction amount” is acquired from the selected record and stored in the correction amount ΔR1 (S203). In this way, the “correction amount” corresponding to the “reference command value” stored in the memory 261 is corrected by searching the correction amount database 320 based on the variable n and “device No.” (= 200). It can be extracted from the quantity database 320.
[0065]
Subsequently, the control unit 260 corrects the former by adding the correction amount ΔR1 acquired in step S203 to the “reference command value” stored in the memory 261 in step S202 as a control command value (S204). By transmitting the control command value to the environment control device specified by the “item ID” that matches the variable n, the environment control device is operated with a predetermined value specified by the control command value (S205).
[0066]
By repeating the above steps S202 to S205, the operation setting of each environmental control device is performed, and the setting of the substrate processing environment is sequentially advanced. If all the substrate processing environment settings included in the reference command value database 310 have not been completed (S206), 1 is added to the variable n (S207), and the process returns to step S202 to be designated by another “item ID”. A substrate processing environment setting process is executed. On the other hand, when all the settings of the substrate processing environment are completed, the correction process is terminated.
[0067]
<5. Advantages of substrate processing apparatus of this embodiment>
As described above, in the present embodiment, (1) the “reference command value” included in the record specified by the “item ID” of the reference command value database 310 corresponds to the “item ID” of the substrate processing apparatus 200, It is transmitted to the environmental control device that controls the substrate processing environment, and then (2) the environmental control device is operated to measure the actual measurement value indicating the operation status of the environmental control device. Based on the “command value” and the actual measurement value, a correction amount calculation is performed to make the operation state of the environmental control device substantially the same as that of the environmental control device specified by the “item ID” of the substrate processing apparatus 100. By executing this correction amount calculation for all “item IDs”, the substrate processing environment of the substrate processing apparatus 200 can be made substantially the same as the substrate processing environment of the substrate processing apparatus 100. The work for obtaining the correction amount that has been obtained can be reduced, and the time required for starting up the substrate processing apparatus when a substrate processing apparatus having the same hardware configuration as that of the substrate processing apparatus 100 is purchased can be reduced. be able to.
[0068]
In the present embodiment, since the reference command value database 310 and the correction amount database 320 are separate and independent databases, the “reference command value” and the “correction amount” can be managed separately. The management efficiency of the control command value that controls the substrate processing environment can be improved.
[0069]
The substrate processing environment of the substrate processing apparatus 100 is controlled by using a “reference command value” stored in the reference command value database 310 as a control command value. On the other hand, the substrate processing environment of the substrate processing apparatus 200 stores the “reference command value” stored in the reference command value database 310 in the correction amount database 320 and uses the “correction amount” corresponding to the “reference command value”. Control is performed by using the corrected value as a control command value. As described above, since the “reference command value” is shared as the control command value for controlling the substrate processing environment of the substrate processing apparatus 100 and the substrate processing apparatus 200, the substrate processing apparatus 100 is used by one “reference command value”. In addition, the environment control device corresponding to the substrate processing apparatus 200 can be controlled.
[0070]
<6. Modification>
Although the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made.
[0071]
“Apparatus No.” in the correction amount database 320 shown in FIG. 6 has “apparatus No.” = 200 (constant), and stores “correction amount” of only one substrate processing environment of the substrate processing apparatus 200. However, the present invention is not limited to this, and is another substrate processing apparatus having a hardware configuration similar to that of the substrate processing apparatuses 100 and 200, and is connected to the apparatus server 300 via the network 600. The server 300 can calculate the correction amount of the other substrate processing apparatus and store the correction amount in the correction amount database 320.
[0072]
“Apparatus No.” in the reference command value database 310 shown in FIG. 5 has “apparatus No.” = 100 (constant), and stores the “reference instruction value” of only one substrate processing environment of the substrate processing apparatus 100. However, the present invention is not limited to this, and when another substrate processing apparatus having the same hardware configuration as the substrate processing apparatuses 100 and 200 is connected to the apparatus server 300 via the network 600, The “reference command value” of another substrate processing apparatus may be stored in the reference command value database 310, and “apparatus number” indicating the other substrate processing apparatus may be stored in “apparatus number”.
[0073]
Further, as shown in FIG. 5, the values of “device No.” included in each record of the reference command value database 310 are all equal. However, the present invention is not limited to this, and the “reference command value” of the substrate processing apparatus specified by a different “apparatus No.” may be stored for each “item ID”. .
[0074]
【The invention's effect】
Claims 1 to 1 0 According to the invention, the reference value for controlling the substrate processing environment of the first substrate processing apparatus is transmitted from the information processing apparatus to the second substrate processing apparatus, and the substrate processing environment of the second substrate processing apparatus is expressed. By calculating a correction amount that makes the substrate processing environments of the first substrate processing apparatus and the second substrate processing apparatus substantially the same from the actually measured value and the reference value, an operator can obtain the correction amount. Since the time required for starting up the second substrate processing apparatus can be reduced, the substrate processing environments of the first substrate processing apparatus and the second substrate processing apparatus can be made substantially the same. .
[0075]
In particular, claims 1 to 8 According to the invention described in (2), the correction amount that makes the substrate processing environment of the second substrate processing apparatus substantially the same as the substrate processing environment of the first substrate processing apparatus is the second database, and the reference value is the first database. Since the reference value and the correction amount can be managed separately, the management efficiency of the control command value for controlling the substrate processing environment can be improved.
[0076]
In particular, according to the second aspect of the present invention, the corresponding correction amount corresponding to the selection reference value is extracted from the second database, and the value obtained by correcting the selection reference value with the corresponding correction amount is stored in the second substrate processing apparatus. By transmitting, the substrate processing environment of the second substrate processing apparatus can be made substantially the same as the substrate processing environment of the first substrate processing apparatus that transmitted the selection reference value. The substrate processing environment of the second substrate processing apparatus and the second substrate processing apparatus can be controlled.
[0077]
Also , Claims 1 to 10 According to the invention described in, according to the reference value and the correction amount Second environmental control device By controlling the above, the substrate processing environment of the second substrate processing apparatus can be made substantially the same as the substrate processing environment of the first substrate processing apparatus.
[0078]
In particular, the claims 3 According to the invention described in (1), the reference value in the downflow forming unit is transmitted to the second substrate processing apparatus, and the correction amount is obtained from the actual measurement value measured by the measuring means and the reference value, thereby obtaining the first value. The substrate processing environment in the downflow forming part of the substrate processing apparatus and the second substrate processing apparatus can be made substantially the same.
[0079]
In particular, the claims 4 According to the invention, the reference value in the exhaust unit is transmitted to the second substrate processing apparatus, and the correction amount is obtained from the actually measured value measured by the measuring means and the reference value, thereby obtaining the first substrate processing. The substrate processing environment in the exhaust unit of the apparatus and the second substrate processing apparatus can be made substantially the same.
[0080]
In particular, the claims 5 According to the invention, the pressure value of the fluid in the first pipe of the first substrate processing apparatus is transmitted as a control command value from the information processing apparatus to the second substrate processing apparatus, and the second pipe By calculating the correction amount from the pressure value of the fluid in the first pipe and the pressure of the fluid in the first pipe transmitted as the control command value, the pressure of the fluid in the first pipe of the first substrate processing apparatus and the second pressure The pressure of the fluid in the second pipe of the substrate processing apparatus can be made substantially the same.
[0081]
In particular, the claims 6 According to the invention described in (1), the pressure value of the processing liquid in the first pipe and the pressure value of the processing liquid in the second pipe can be made substantially the same.
[0082]
In particular, the claims 7 According to the invention described in (1), the pressure value of the gas in the first pipe and the pressure value of the gas in the second pipe can be made substantially the same.
[0083]
In particular, the claims 8 According to the invention described in the above, the pressure value of the fluid in the first pipe is controlled by controlling the pump of the second substrate processing apparatus with the value obtained by correcting the pressure value of the gas in the first pipe by the correction amount. And the pressure value of the fluid in the second pipe can be made substantially the same.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a substrate processing system in an embodiment of the present invention.
FIG. 2 is a diagram illustrating a configuration of a substrate processing apparatus and an apparatus server.
FIG. 3 is a diagram showing a configuration of a rotation processing unit SR.
FIG. 4 is a diagram showing a configuration of a substrate processing apparatus.
FIG. 5 is a diagram showing an example of a configuration of a reference command value database stored in the apparatus server.
FIG. 6 is a diagram illustrating an example of a configuration of a correction amount database stored in the substrate processing apparatus.
FIG. 7 is a flowchart illustrating an example of a correction amount calculation procedure.
FIG. 8 is a flowchart illustrating an example of a correction amount calculation procedure;
FIG. 9 is a flowchart illustrating an example of a procedure for setting a substrate processing environment based on a correction amount.
[Explanation of symbols]
100, 200 substrate processing apparatus
300 Device server
310 Reference command value database
320 Correction amount database
600 network 600
800 Substrate processing system
W substrate

Claims (10)

A substrate processing system,
(a) a first substrate processing apparatus;
(b) a second substrate processing apparatus connected to the first substrate processing apparatus via a network and having an internal configuration similar to that of the first substrate processing apparatus;
(c) connected to the first substrate processing apparatus and the second substrate processing apparatus via a network;
(c-1) a first database that stores a reference value as a control command value of a first environmental control device that controls a substrate processing environment of the first substrate processing apparatus;
(c-2) First transmission means for transmitting a reference value stored in the first database as a control command value of a second environment control device that controls the substrate processing environment of the second substrate processing apparatus When,
(c-3) A substrate in the second substrate processing apparatus when the second environmental control device of the second substrate processing apparatus is controlled in accordance with the reference value transmitted by the first transmission means. Receiving means for receiving an actual measurement value representing the processing environment from the second substrate processing apparatus;
(c-4) Correction that makes the substrate processing environments of the first substrate processing apparatus and the second substrate processing apparatus substantially the same from the reference value and the actual measurement value transmitted by the first transmission unit Computing means for computing the quantity;
(c-5) a second database that stores the correction amount in association with the reference value transmitted by the first transmission unit;
An information processing apparatus having
With
The second substrate processing apparatus includes:
(b-1) Control means for controlling the second environmental control device of the second substrate processing apparatus based on the control command value transmitted from the information processing apparatus;
(b-2) measuring means for obtaining the actual measurement value;
(b-3) second transmission means for transmitting the actual measurement value to the information processing apparatus;
A substrate processing system comprising: The substrate processing system according to claim 1,
The information processing apparatus includes:
(c-6) extraction means for extracting the correction amount corresponding to the selected reference value selected from the first database as the reference value from the second database as a corresponding correction value;
Further comprising
The first transmission unit transmits a value obtained by correcting the selection reference value by the corresponding correction amount to the second substrate processing apparatus as the control command value. The substrate processing system according to claim 1 or 2,
The first substrate processing apparatus and the second substrate processing apparatus include a downflow forming unit that forms a downflow of clean air as the first and second environmental control devices, respectively, and the correction unit includes the first correction unit the substrate processing system according to claim Rukoto obtain a correction amount from said measured value with the reference value in the downflow forming part of the substrate processing apparatus. A substrate processing system according to any one of claims 1 to 3,
The first substrate processing apparatus and the second substrate processing apparatus each include an exhaust unit that exhausts the atmosphere in the apparatus as a first and a second environment control device , respectively, and the correction unit includes the first substrate processing apparatus. The substrate processing system characterized in that the correction amount is obtained from the reference value and the measured value in the exhaust unit of the substrate processing apparatus. A substrate processing system according to any one of claims 1 to 4,
In the first substrate processing apparatus,
A first pipe for introducing a fluid supplied from a fluid supply source into the first substrate processing apparatus;
Pressure measuring means connected to the first environmental control device and measuring a pressure value of a fluid in the first pipe as a substrate processing environment in the first pipe;
While
In the second substrate processing apparatus,
A second pipe connected to the second environmental control device and introducing the fluid supplied from the fluid supply source into the second substrate processing apparatus;
Is provided,
The first transmission means transmits the pressure value of the fluid as the control command value, the measurement means measures the pressure value of the fluid in the second pipe, and the correction means The substrate processing system characterized in that the correction amount is obtained from the pressure value of the fluid and the actually measured value. The substrate processing system according to claim 5 ,
The substrate processing system wherein the fluid is characterized by the treatment liquid der Rukoto substrate. The substrate processing system according to claim 5 ,
The substrate processing system, wherein the fluid is a gas used during substrate processing. A substrate processing system according to any one of claims 5 to 7 ,
The substrate processing system, wherein the first and second environmental control devices are pumps that control the pressure of the fluid . A substrate processing method comprising:
(a) A reference value transmitted as a control command value to the first environment control device of the first substrate processing apparatus is also transmitted to the second environment control device of the second substrate processing apparatus, and the second A first processing environment setting step for setting a substrate processing environment in the substrate processing apparatus;
(b) an actual value acquisition step of acquiring an actual value representing the substrate processing environment of the second substrate processing apparatus when the second environmental control device is controlled using the reference value;
(c) A calculation step of calculating a correction amount of the reference value for making the substrate processing environments of the first substrate processing apparatus and the second substrate processing apparatus substantially the same from the reference value and the actually measured value. When,
With
The substrate processing method, wherein the first substrate processing apparatus and the second substrate processing apparatus have the same internal configuration . The substrate processing method according to claim 9 , comprising:
(d) After the calculation step, a value obtained by correcting the reference value by the correction amount is transmitted to the second environment control device of the second substrate processing apparatus, and the substrate processing of the second substrate processing apparatus is performed. A second processing environment setting step for setting the environment;
A substrate processing method , further comprising :

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