JP2019124965A - Auxiliary exposure device - Google Patents

Abstract

To provide an auxiliary exposure device capable of heightening exposure resolution.SOLUTION: The auxiliary exposure device is disposed at a front stage side or a rear stage side of an exposure device performing exposure processing on a substrate to be processed, and performs exposure processing locally on the substrate to be processed, and is provided with a light source unit. The light source unit irradiates the substrate to be processed with line-shape light. The light source unit comprises: a spatial light modulator having a plurality of movable micro-mirrors; and a projection lens disposed on a light path between the spatial light modulator having a plurality of the movable micro-mirrors and the substrate to be processed, and projecting light reflected by the spatial light modulator having a plurality of the movable micro-mirrors on the substrate to be processed by enlarging the light in a line shape.SELECTED DRAWING: Figure 4

Description

  The disclosed embodiments relate to an auxiliary exposure apparatus.

  2. Description of the Related Art Conventionally, there is known an auxiliary exposure apparatus that performs a local exposure process separately from a normal exposure apparatus that transfers, for example, a mask pattern to a resist film coated on a substrate to be processed. According to such an auxiliary exposure apparatus, it is possible to improve the uniformity of the film thickness and line width of the resist pattern after the development processing in photolithography.

  For example, Patent Document 1 discloses an auxiliary exposure apparatus provided with a light source unit in which a plurality of LED (Light Emitting Diode) elements are arranged in a line.

JP, 2013-186191, A

  However, the exposure resolution when using the LED element is limited by the size of the LED element body (for example, about 5 mm). Therefore, there is room for further improvement in the prior art described above in terms of enhancing the exposure resolution.

  An aspect of the embodiment aims to provide an auxiliary exposure apparatus capable of enhancing the exposure resolution.

  The auxiliary exposure apparatus according to one aspect of the embodiment is disposed upstream or downstream of the exposure apparatus that performs exposure processing on the substrate to be processed, and performs exposure processing locally on the substrate to be processed. And a light source unit. The light source unit emits line-shaped light to the processing substrate. The light source unit is disposed on the optical path between the spatial light modulator having the plurality of movable micro mirrors, the spatial light modulator having the plurality of movable micro mirrors, and the processing substrate, and the plurality of movable micro mirrors And a projection lens configured to project the light reflected by the spatial light modulator having a linear shape onto the substrate to be processed in a line.

  According to an aspect of the embodiment, the exposure resolution can be enhanced.

FIG. 1 is a diagram showing the configuration of a substrate processing system according to an embodiment. FIG. 2 is a flowchart showing the processing procedure of the entire process for one glass substrate in the substrate processing system. FIG. 3A is a diagram showing a format for partitioning product areas on a glass substrate in a matrix in an embodiment. FIG. 3B is a view showing a mechanism for calculating and mapping measured values of a film thickness and a line width of a resist pattern for each unit region of a matrix section on a glass substrate. FIG. 3C is a view showing a mechanism for calculating and mapping the correction exposure amount for each unit area of the matrix section on the glass substrate. FIG. 3D is a diagram showing a mechanism for computing and mapping a target value of illuminance for each unit area of matrix sections on a glass substrate. FIG. 4 is a view showing the arrangement of an auxiliary exposure apparatus according to the embodiment. FIG. 5 is a view showing an irradiation region of ultraviolet light emitted from the light source unit. FIG. 6 is a diagram showing the configuration of the light source unit.

  Hereinafter, embodiments of the auxiliary exposure apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited by the embodiments described below.

[Configuration of substrate processing system]
The substrate processing system 100 shown in FIG. 1 is installed in a clean room, for example, using a glass substrate G for LCD (Liquid Crystal Display) as a substrate to be processed, and cleaning, resist application, pre-baking in a photolithography process in an LCD manufacturing process. Perform a series of processing such as development and post bake. The exposure processing is performed by an external exposure apparatus 20 (EXP) installed adjacent to the substrate processing system 100.

  The substrate processing system 100 includes a cassette station 1, a loading unit 2 (IN PASS), a cleaning device 3 (SCR), a first drying unit 4 (DR), a first cooling unit 5 (COL), and a coating device. 6 (COT), a second drying unit 7 (DR), a pre-baking unit 8 (PRE BAKE), a second cooling unit 9 (COL), and an interface station 10. The substrate processing system 100 also includes the auxiliary exposure device 11 (AE), the developing device 12 (DEV), the post bake unit 13 (POST BAKE), the third cooling unit 14 (COL), and the inspection unit 15 (IP). , An unloading unit 16 (OUT PASS), and a control unit 17.

  Between the cassette station 1 and the interface station 10, a transport forward path for transporting the glass substrate G from the cassette station 1 to the interface station 10 is provided. On the transport forward path, the loading unit 2, the cleaning device 3, the third A first drying unit 4, a first cooling unit 5, a coating device 6, a second drying unit 7, a pre-baking unit 8 and a second cooling unit 9 are provided in this order from the cassette station 1 to the interface station 10.

  Further, a transport return path for transporting the glass substrate G from the interface station 10 to the cassette station 1 is provided between the cassette station 1 and the interface station 10, and the auxiliary exposure device 11 is provided on the transport return path. The developing device 12, the post-baking unit 13, the third cooling unit 14, the inspection unit 15, and the unloading unit 16 are disposed in this order from the interface station 10 toward the cassette station 1. The forward and reverse transport paths are constituted by, for example, loco transport paths and the like.

  The cassette station 1 is a port for loading and unloading a plurality of cassettes C containing a plurality of glass substrates G stacked in multiple stages. The cassette station 1 comprises, for example, a cassette stage 1a which can be mounted four side by side in one horizontal direction (Y-axis direction), and a transport apparatus 1b for taking in and out the glass substrate G to the cassette C on the cassette stage 1a. Prepare. The transfer apparatus 1b has a transfer arm for holding the glass substrate G, and can operate along four axes of X, Y, Z, and θ, and between the adjacent cassette stage 1a, the carry-in unit 2 and the carry-out unit 16 Delivery of the glass substrate G can be performed.

  The interface station 10 comprises a transport device 10a. The transfer apparatus 10a has a transfer arm for holding the glass substrate G, is operable along four axes of X, Y, Z, and θ, and the adjacent second cooling unit 9, the auxiliary exposure apparatus 11, and the exposure apparatus 20 The glass substrate G can be delivered between the two. In the interface station 10, in addition to the transport device 10a, for example, a device such as a peripheral exposure device or a titler may be disposed. The peripheral exposure device performs an exposure process for removing the resist adhering to the peripheral portion of the glass substrate G at the time of development. The titler records predetermined information on a predetermined portion on the glass substrate G.

  Control unit 17 is, for example, a CPU (Central Processing Unit), and reads out and executes a program (not shown) stored in a storage unit (not shown) to control the entire substrate processing system 100. The control unit 17 may be configured only by hardware without using a program.

  FIG. 2 is a flowchart showing the processing procedure of the entire process for one glass substrate G in the substrate processing system 100. First, at the cassette station 1, the transfer device 1b takes out the glass substrate G from any one of the cassettes C on the cassette stage 1a, and carries the taken-out glass substrate G into the loading unit 2 (step S101).

  The glass substrate G carried into the carry-in unit 2 is transported along the transport forward path, carried into the cleaning device 3 and subjected to the cleaning process (step S102). Here, the cleaning device 3 removes particulate dirt from the surface of the glass substrate G moving horizontally along the transport path by brushing cleaning or blow cleaning, and then performs a rinsing process. When a series of cleaning processes in the cleaning device 3 is finished, the glass substrate G is carried into the first drying unit 4.

  Subsequently, the glass substrate G is subjected to a predetermined drying process in the first drying unit 4 (step S103), and then carried into the first cooling unit 5 and cooled to a predetermined temperature (step S104). Thereafter, the glass substrate G is carried into the coating device 6.

  In the coating device 6, a resist solution is applied to the upper surface (surface to be processed) of the glass substrate G by, for example, a spinless method using a slit nozzle (step S105). Thereafter, the glass substrate G is carried into the second drying unit 7, and subjected to, for example, a normal temperature drying process by reduced pressure (step S106).

  The glass substrate G carried out of the second drying unit 7 is carried into the pre-baking unit 8 and heated to a predetermined temperature in the pre-baking unit 8 (step S107). By this treatment, the solvent remaining in the resist film on the glass substrate G is evaporated and removed, and the adhesion of the resist film to the glass substrate G is enhanced.

  Subsequently, the glass substrate G is carried into the second cooling unit 9 and cooled to a predetermined temperature in the second cooling unit 9 (step S108). Thereafter, the glass substrate G is carried into the exposure device 20 by the transfer device 10 a of the interface station 10. The glass substrate G may be carried into the peripheral exposure device (not shown) before being carried into the exposure device 20.

  In the exposure apparatus 20, a predetermined circuit pattern is exposed on the resist on the glass substrate G (step S109). Then, the glass substrate G which has finished the pattern exposure is carried out of the exposure device 20 by the transfer device 10 a of the interface station 10 and carried into the auxiliary exposure device 11. The glass substrate G may be carried into a non-illustrated tighter before being carried into the auxiliary exposure device 11.

  In the auxiliary exposure device 11, a special auxiliary exposure process, which will be described later, is performed on the glass substrate G after the exposure process to improve the uniformity of the film thickness and line width of the resist pattern obtained after the development process Step S110). The glass substrate G which has completed the auxiliary exposure process is carried into the developing device 12 and subjected to a series of developing processes of developing, rinsing and drying in the developing device 12 (step S111).

  The glass substrate G which has been subjected to the development processing is carried into the post bake section 13 and subjected to heat treatment after the development processing in the post bake section 13 (step S112). As a result, the developer and the cleaning solution remaining on the resist film of the glass substrate G are evaporated and removed, and the adhesion of the resist pattern to the substrate is enhanced. Thereafter, the glass substrate G is carried into the third cooling unit 14 and cooled to a predetermined temperature in the third cooling unit 14 (step S113).

  Subsequently, the glass substrate G is carried into the inspection unit 15. In the inspection unit 15, a noncontact line width inspection, a film quality / film thickness inspection, and the like are performed on the resist pattern on the glass substrate G (step S114). The inspection result in the inspection unit 15 is output to the control unit 17 and stored by the control unit 17 in a storage unit (not shown).

  The unloading unit 16 receives the glass substrate G after the inspection from the inspection unit 15 and delivers the glass substrate G to the transfer device 1 b of the cassette station 1. The transport device 1b stores the processed glass substrate G received from the unloading unit 16 in the cassette C (step S115). By the above, the whole process of the substrate processing to one glass substrate G is completed.

  The auxiliary exposure device 11 is obtained after development processing by performing local exposure processing on a portion where the film thickness and line width deviate from the desired film thickness and line width on the glass substrate G after the exposure processing. The uniformity of the film thickness and line width of the resist pattern is improved. The operation of the auxiliary exposure device 11 is controlled by the control unit 17.

  The control unit 17 controls the operation of the auxiliary exposure device 11 based on the inspection result acquired from the inspection unit 15. Here, an example of a method of generating control data of the auxiliary exposure apparatus 11 from the inspection result of the inspection unit 15 will be described with reference to FIGS. 3A to 3D.

  FIG. 3A is a diagram showing a format for partitioning product areas on a glass substrate G in a matrix in the embodiment. FIG. 3B is a view showing a mechanism for calculating and mapping measured values of a film thickness and a line width of a resist pattern for each unit region of a matrix section on a glass substrate G. FIG. 3C is a view showing a mechanism for computing and mapping the correction exposure amount for each unit area of the matrix section on the glass substrate G. FIG. 3D is a view showing a mechanism for calculating and mapping a target value of illuminance for each unit region of matrix sections on the glass substrate G.

  The inspection unit 15 measures the film thickness and the line width of the resist pattern obtained on the post-baked glass substrate G at, for example, several (eg, several tens of) representative points on the glass substrate G. Further, the control unit 17 performs predetermined interpolation processing based on the measurement values at representative points on the glass substrate G acquired by the inspection unit 15 with respect to the film thickness and the line width of the resist pattern. Calculate the measured values (precisely estimated values) at the position or area.

  For example, as shown in FIG. 3A, the control unit 17 divides the product area PA on the glass substrate G into a matrix, and sets the film thickness and the line width of the resist pattern for each unit area (i, j) of the matrix section. Measured values (or estimated values obtained by interpolation processing) Ai, j are calculated and mapped as shown in FIG. 3B on a table constructed in the memory. In the drawing, matrix partitions are shown in nine columns (j = 1 to 9) in order to facilitate understanding. In practice, both the number of rows and the number of columns of matrix sections are at least several tens or more, and one hundred or more for large substrates for FPD.

  Subsequently, the control unit 17 calculates the correction exposure amount Bi, j for each unit area (i, j) of the matrix section on the glass substrate G, for example, as shown in FIG. Map as shown. Here, the correction exposure amount Bi, j is an exposure amount for bringing the difference (error) between the measured value and the setting value for the film thickness or line width of the resist pattern in each unit region (i, j) closer to zero. is there.

  Subsequently, the control unit 17 calculates the target value Ci, j of the illuminance for each unit area (i, j) of the matrix section on the glass substrate G, for example, as shown in FIG. Map as shown in. Here, assuming that the ultraviolet irradiation time per unit area (i, j) of the matrix section in the auxiliary exposure device 11 is tS, then Ci, j = Bi, j / tS.

[Configuration of Auxiliary Exposure Device]
Next, the configuration of the auxiliary exposure apparatus 11 according to the embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a view showing the configuration of the auxiliary exposure apparatus 11 according to the embodiment. Moreover, FIG. 5 is a figure which shows the irradiation area | region of the ultraviolet-ray irradiated from the light source unit 32. As shown in FIG.

  As shown in FIG. 4, the auxiliary exposure device 11 has a flat-flow transfer unit 30 that transfers the glass substrate G in the scanning direction (X-axis negative direction), and the glass substrate G transferred by the flat-flow transfer unit 30. The resist is provided with a light source unit 32 for irradiating light, specifically, ultraviolet light (UV) of a predetermined wavelength. In addition, the auxiliary exposure device 11 includes an illuminance measurement unit 38 that measures the illuminance of light emitted by the light source unit 32, a control unit 17 that controls each unit in the device, and various programs and data used by the control unit 17. And a memory 42 for storing or storing the

  The flat-flow transport unit 30 includes, for example, a roller transport path 46 formed by laying a large number of rollers 44 in the transport direction, and belts, gears, and the like for transporting the glass substrate G on the roller transport path 46. And a scan drive unit 50 that is rotationally driven via a transmission mechanism 48. The roller transport path 46 constitutes a part of the transport return path from the interface station 10 to the cassette station 1 in the substrate processing system 100 shown in FIG.

  The flat-flow transport unit 30 flat-flows the glass substrate G after the exposure processing into the auxiliary exposure device 11, and transports the glass substrate G in parallel flow for scanning of the auxiliary exposure processing in the auxiliary exposure device 11. Then, the glass substrate G on which the auxiliary exposure process has been completed is unloaded to the developing device 12 in a plane flow. The control unit 17 can detect or grasp the current position of the glass substrate G through position sensors (not shown) arranged at places of the roller conveyance path 46.

  The light source unit 32 is disposed above the roller conveyance path 46 and supported by a support member (not shown). As shown in FIG. 5, in the light source unit 32, the width in the direction (Y-axis direction) intersecting the scanning direction is shorter than the glass substrate G, and in this direction (Y-axis direction) Located in the middle of the road 46). The light source unit 32 emits, to the glass substrate G transported in the scanning direction (X-axis negative direction), linear light whose longitudinal direction is the direction (Y-axis direction) intersecting the scanning direction.

  As shown in FIG. 4, the light source unit 32 according to the present embodiment is configured to include a digital micro mirror device (hereinafter, described as DMD) 325.

  The DMD 325 is a spatial light modulator having a large number of movable micro mirrors (hereinafter referred to as mirrors). The mirror surface size of one mirror is, for example, ten and several μm, and in the DMD 325, several tens to several millions of such mirrors are arranged in a matrix.

  Each mirror is displaceable between an on angle that reflects light toward the glass substrate G and an off angle that reflects light toward a location other than the glass substrate G.

  The control unit 17 controls the operation of each mirror of the DMD 325, and adjusts the time ratio of the on angle and the off angle for each mirror, to thereby obtain the unit area for each unit area on the glass substrate G corresponding to each mirror. Adjust the illuminance of the light emitted to the

  Specifically, with respect to the unit area (i, j) on the glass substrate G passing the light source unit 32, the control unit 17 causes the illuminance of each unit area (i, j) to become the target value Ci, j. Adjust the time ratio of the on angle and the off angle for each mirror. The control unit 17 synchronizes the movement of the glass substrate G in the scanning direction by the roller conveyance path 46, and performs the above-described processing for each row of unit areas aligned in the direction intersecting the scanning direction, thereby forming one glass An auxiliary exposure process is performed on the entire unit area of the substrate G.

  In the DMD 325, each of the tiny mirrors can be made to correspond to a unit area on the glass substrate G. In other words, by using the DMD 325, the size of the unit area set on the glass substrate G can be reduced according to the size of the mirror. Therefore, according to the auxiliary exposure apparatus 11 according to the present embodiment, the exposure resolution can be enhanced as compared with the conventional auxiliary exposure apparatus which is restricted by the size (about 5 mm) of the LED element main body.

[Configuration of light source unit]
Next, an example of the configuration of the light source unit 32 including the above-described DMD 325 will be described with reference to FIG. FIG. 6 is a diagram showing the configuration of the light source unit 32. As shown in FIG. The configuration of the light source unit 32 is not limited to the configuration shown in FIG.

  As shown in FIG. 6, the light source unit 32 includes a light source 321, a first lens 322, a reflecting mirror 323, a second lens 324, a DMD 325, a projection lens 326, and a light trap 327.

  The light source 321 emits ultraviolet (UV) light. As the light source 321, for example, an LED or a laser beam generator can be used. The first lens 322 is disposed on the light path between the light source 321 and the DMD 325 and magnifies the light emitted from the light source 321. The reflecting mirror 323 is disposed on the optical path between the first lens 322 and the DMD 325, and reflects the light expanded by the first lens 322 toward the DMD 325. The angle of the reflecting mirror 323 is fixed.

  The second lens 324 is disposed on the optical path between the reflecting mirror 323 and the DMD 325 to make the distribution of the light reflected by the reflecting mirror 323 uniform. The DMD 325 has a large number of rectangular mirrors M, and drives each mirror M according to the control of the control unit 17 to adjust the illuminance of light irradiated onto the glass substrate G for each unit area.

  The projection lens 326 is disposed on the light path between the DMD 325 and the glass substrate G, and projects the light reflected by the DMD 325 toward the glass substrate G in a linear form on the glass substrate G. A light trap 327 is placed on the light path of the light reflected by the off-angle mirror M to absorb such light.

  Thus, the auxiliary exposure apparatus 11 according to the embodiment includes the single light source unit 32 having the single light source 321. Therefore, compared with the conventional auxiliary exposure apparatus using a plurality of LED elements as light sources, for example, adjusting the illuminance of each light source in consideration of the overlap of lights emitted from different light sources eliminates the need for complicated processing. Become.

  The auxiliary exposure device 11 may include a plurality of light source units 32. Even in such a case, since the DMD 325 included in the light source unit 32 can reflect light in a rectangular shape by the rectangular mirror M, for example, a conventional auxiliary exposure device having an LED element for emitting light circularly In comparison, lights emitted from different light source units 32 do not easily overlap with each other. Therefore, the complicated process of adjusting the illuminance of each light source in consideration of the overlap of the lights is unnecessary.

  Further, as shown in FIG. 1, the auxiliary exposure device 11 according to the present embodiment is disposed on the rear side of the exposure device 20 and on the front side of the developing device 12. That is, even if the accuracy of the exposure processing is high, if the accuracy of the development processing to be performed thereafter is low, there is a possibility that the film thickness and the line width may be deviated. Therefore, in order to properly correct the film thickness and the line width deviation, as in the auxiliary exposure device 11 according to the present embodiment, after all the steps before the development processing are completed, that is, immediately before the development device 12 Preferably, the auxiliary exposure device 11 is disposed at According to the substrate processing system 100 according to the present embodiment, the film thickness and the line width of the glass substrate G after the development processing are inspected by the inspection unit 15, and the inspection result is fed back to the auxiliary exposure processing just before the development processing. Film thickness and line width can be properly corrected.

  The arrangement of the auxiliary exposure device 11 is not limited to the above-described example, and can be arranged at any position as long as it is on the downstream side of the coating device 6 and on the upstream side of the developing device 12.

[Illumination distribution adjustment processing]
By the way, when the reflected light of the DMD 325 is expanded to the width of the glass substrate G, there is a concern that the illuminance distribution may become uneven. Specifically, of the linear light emitted from the light source unit 32, the illuminance on the end side far from the DMD 325 may be lower than the illuminance on the central portion closer to the DMD 325. In particular, in the case of using a single light source unit 32 as in the auxiliary exposure apparatus 11 according to the present embodiment, the uneven distribution of the illuminance distribution as described above is likely to occur.

  Therefore, the auxiliary exposure device 11 includes the illuminance measurement unit 38 and performs in advance a process of measuring the irradiation distribution of the linear light emitted from the light source unit 32 using the illuminance measurement unit 38, and the result is shown in FIG. The command value to the light source unit 32 in the auxiliary exposure process may be determined in consideration.

  The illuminance measurement unit 38 includes, for example, an illuminance meter for measuring the illuminance of ultraviolet light, and a moving mechanism for moving the illuminance meter in the irradiation line direction (Y-axis direction) directly below the light source unit 32. . The illuminance meter has a photoelectric conversion element such as a photodiode near its top, and generates an electrical signal (illuminance measurement signal) corresponding to the light intensity of the ultraviolet light incident on the light receiving surface. The illuminance measurement signal output from the illuminance meter is sent to the control unit 17 via, for example, an analog-digital converter.

  The movement mechanism mounts the luminometer on the carriage so that the light receiving part of the luminometer is at the same height as the surface of the glass substrate G when moving on the roller conveyance path 46, parallel to the light source unit 32 (Y-axis direction The carriage and the luminometer can be arbitrarily moved bi-directionally by, for example, a linear motor on the rail extending to the), so that the luminometer can be stopped or stopped at any position on the rail.

  The control unit 17 controls the DMD 325 to drive each mirror M at the same time ratio (for example, on-angle: off-angle = 1: 1), and controls the illuminance measuring unit 38 to irradiate the illuminance meter with the illumination line. The illuminance at each position is measured while moving in the direction (Y-axis direction). Thereby, the illuminance distribution of the linear light irradiated by the light source unit 32 is acquired. The control unit 17 stores the acquired illuminance distribution in the memory 42.

  The control unit 17 refers to the irradiation map as shown in FIG. 3D and the illuminance distribution stored in the table of the memory 42 prior to the auxiliary exposure processing, to form each unit area (i, j of the matrix section on the glass substrate G). The command value Vi, j is calculated for each) and mapped on a table constructed in the memory 42, for example.

  Then, the control unit 17 controls the light source unit 32 and the roller conveyance path 46 to perform scanning between the glass substrate G and the light source unit 32 for the auxiliary exposure process. In this scanning, when the unit regions (i, 1) to (i, 9) of the i-th row of the matrix section on the glass substrate G pass directly below the light source unit 32, the i-th row Each command value Vi, 1 to Vi, 9 of the minute is given. Thus, line-shaped light is emitted from the light source unit 32 to the unit regions (i, 1) to (i, 9) of the i-th row for a certain period of time with independent illuminance per unit region.

  Thus, when the glass substrate G passes directly below the light source unit 32, auxiliary exposure of the illuminance or exposure amount independent for each unit area (i, j) is performed on the irradiation line (each row of the matrix section).

  As described above, the control unit 17 of the auxiliary exposure device 11 measures the film thickness and the line width of the glass substrate G after the development processing at least one from the light source unit 32 when uniformly controlling the plurality of mirrors M and the plurality of mirrors M. The operation of each mirror M may be controlled based on the illumination distribution of linear light to be irradiated. By doing this, it is possible to suppress the decrease in accuracy of the auxiliary exposure process caused by the non-uniformity of the illuminance distribution.

  In the embodiment described above, an example in which one mirror M is made to correspond to one unit area has been described, but the number of mirrors M to be made to correspond may be different for each unit area.

  For example, when the auxiliary exposure device 11 includes a single light source unit 32, depending on the configuration of the optical system, the irradiation range of light irradiated to the end of the glass substrate G in one line direction from one mirror M is one It may be larger than the irradiation range of light irradiated from the mirror M to the center of the glass substrate G in the line direction (that is, immediately below the light source unit 32).

  Therefore, the auxiliary exposure device 11 associates the one or more mirrors M with the unit area at the end in the line direction and the unit area at the end in the line direction with respect to the unit area at the center in the line direction. Many mirrors M may be associated. That is, temporarily, the irradiation range of light irradiated from one mirror M to the end in the line direction is twice as large as the irradiation range of light irradiated from the one mirror M to the center in the line direction. In this case, one mirror M may be associated with the unit area at the end in the line direction, and two mirrors M may be associated with the unit area at the center in the line direction. By doing this, it is possible to suppress the decrease in accuracy of the auxiliary exposure process due to the difference in the irradiation range.

  Also, the DMD 325 may change its reflection characteristics due to heat. Therefore, the auxiliary exposure device 11 may be provided with a temperature adjustment unit that adjusts the temperature of the DMD 325. As a temperature control part, a heat sink, a Bertier module, etc. can be used, for example.

  Further, in the embodiment described above, the flat-flow transport unit 30 that transports the glass substrate G flat-flow is provided, and the light source unit 32 is fixed at a fixed position in the scanning direction. However, a scanning method in which the glass substrate G is fixed to, for example, a stage and the light source unit 32 is moved in the scanning direction on the stage, or a scanning method in which both the glass substrate G and the light source unit 32 are moved is also possible.

  In the embodiment described above, although the substrate to be treated is a glass substrate for FPD, the present invention is not limited to this, and other substrates for flat panel displays, semiconductor wafers, organic EL, various substrates for solar cells, It may be a CD substrate, a photomask, a printed circuit board or the like.

  As described above, the auxiliary exposure apparatus according to the embodiment is disposed upstream or downstream of the exposure apparatus that performs the exposure process on the processing target substrate, and performs the exposure process locally on the processing target substrate The auxiliary exposure device includes a transport unit and a light source unit. The transport unit transports the target substrate in the scanning direction. The light source unit emits line-shaped light whose longitudinal direction is a direction intersecting with the scanning direction to the processing target substrate transported in the scanning direction. Also, the light source unit is configured to include a digital micro mirror device in which a plurality of movable micro mirrors are arranged. Therefore, the auxiliary exposure apparatus according to the embodiment can increase the exposure resolution.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the invention are not limited to the specific details and representative embodiments represented and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 11 Auxiliary exposure apparatus 12 Development apparatus 17 Control part 20 Exposure apparatus 30 Flat-flow conveyance part 32 Light source unit 38 Illuminance measurement part 46 Roller conveyance path 100 Substrate processing system 325 DMD

Claims (3)

An auxiliary exposure apparatus which is disposed upstream or downstream of an exposure apparatus that performs exposure processing on a substrate to be processed, and performs exposure processing locally on the substrate to be processed,
A light source unit configured to emit linear light to the processing target substrate;
The light source unit is
A spatial light modulator having a plurality of movable micro mirrors;
A spatial light modulator having the plurality of movable micro mirrors and light reflected by the spatial light modulator disposed on the light path between the plurality of movable micro mirrors and disposed on the light path between the plurality of movable micro mirrors are transmitted to the substrate. An auxiliary exposure device comprising: a projection lens for enlarging and projecting in the form of a line; The auxiliary exposure apparatus according to claim 1, further comprising: a scanning unit configured to change a relative position between the substrate to be processed and the light source unit along a scanning direction. The auxiliary exposure apparatus according to claim 1, comprising a plurality of the light source units.

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