TWI684836B - Pattern drawing device - Google Patents

Abstract

The substrate processing apparatus is to arrange the plurality of drawing units in a manner that the patterns drawn on the substrate by each drawing line of the plurality of drawing units can be joined in the width direction of the substrate as the substrate moves in the longitudinal direction, The width direction of the substrate. The control unit pre-stores calibration information about the positional relationship of the drawing lines formed on the substrate by the plurality of drawing units, and adjusts the drawing by the plural according to the calibration information and the movement information output from the mobile measuring device The drawing position of the pattern formed on the substrate by each drawing beam of the unit.

Description

Pattern drawing device

The present invention relates to a substrate processing apparatus, a device manufacturing method, and a substrate processing method for forming a structure of fine electronic components on a substrate.

As a conventional substrate processing apparatus, there is a manufacturing apparatus that draws at a predetermined position on a sheet medium (substrate) and is widely known (for example, refer to Patent Document 1). The manufacturing apparatus described in Patent Document 1 is to measure the expansion and contraction of a sheet-shaped substrate by detecting an alignment mark with respect to a flexible long sheet substrate that is easily stretchable in the width direction, and corrects the drawing position (processing position) according to the expansion and contraction.

Patent Document 1: Japanese Patent Application Publication No. 2010-91990

In the manufacturing apparatus of Patent Document 1, a space modulation element (DMD: Digital Micro Mirror Device) is switched while carrying a substrate in a conveying direction to perform exposure, and a pattern is drawn on the substrate by a plurality of drawing units. In the manufacturing apparatus of Patent Document 1, although the patterns adjacent to each other in the width direction of the substrate are bonded and exposed by a plurality of drawing units, in order to suppress the error of the bonding exposure, the test is performed by feedback. Develop the measurement result of the position error of the pattern at the joint. However, the feedback steps including such operations as test exposure, development, and measurement, depending on the frequency, have to temporarily stop the manufacturing line, which not only reduces the productivity of the product, but also may cause substrate waste.

The aspect of the present invention was developed in view of the above-mentioned problems, and its purpose is to provide a case where a plurality of drawing units are used to join patterns in the width direction of the substrate for exposure (drawing), which can reduce the joining error of the patterns. In addition, a substrate processing device, a device manufacturing method, and a substrate processing method capable of drawing a large-area pattern with high accuracy and stability on a substrate.

The substrate processing apparatus according to the first aspect of the present invention includes: a conveying device that moves a part of the long sheet-shaped substrate in the elongated direction while being supported by a support member having a support surface curved in the elongated direction; The drawing device includes scanning the modulated beam on the substrate supported by the supporting surface while scanning in a narrower range than the width of the substrate in the width direction of the substrate crossing the strip direction and along The scanning lines obtained by the scanning draw a plurality of drawing units of a given pattern, and the patterns drawn on the substrate by the drawing lines of the plurality of drawing units are in the width direction of the substrate as the substrate moves in the longitudinal direction In the joining method, the plurality of drawing units are arranged in the width direction of the substrate; the movement measuring device outputs the movement information of the movement amount or the movement position of the substrate corresponding to the conveying device; and the control section stores in advance about Calibration information of the positional relationship of the drawing lines formed on the substrate of each of the plurality of drawing units, and adjusting each of the plurality of drawing units according to the calibration information and the movement information output from the mobile measuring device The drawing position of the pattern formed on the substrate by the drawing beam.

The device manufacturing method of the second aspect of the present invention uses the substrate processing apparatus of the first aspect of the present invention to form the pattern on the substrate.

A substrate processing method according to a third aspect of the present invention draws a pattern of electronic components on a long sheet-shaped substrate, which is characterized by including: an operation of transporting the sheet-shaped substrate in a long direction at a predetermined speed; The light beam of the ultraviolet wavelength region of the light source device oscillated by the frequency Fz pulse Spot light is condensed on the surface of the sheet substrate, and the light beam is oscillated by an optical scanner, so that the spot light is scanned along the drawing line of the length LBL extending in the width direction crossing the strip direction ; And during the scanning of the spot light, the action of modulating the intensity of the spot light according to the description data of the corresponding pattern; set the spot light formed by the spotlight of one pulse and the spot formed by the spotlight of the next pulse When the interval of light along the drawing line is CXs, the effective size of the spot light along the drawing line is Xs, and the scanning time of the spot light scanning the length LBL is Ts, set to satisfy Xs>CXs and Fz>LBL/ (Ts‧Xs) relationship.

The substrate processing method of the fourth aspect of the present invention is to draw the pattern of the electronic component on the long sheet-shaped substrate, which is characterized by comprising: the step of conveying the sheet-shaped substrate in the longitudinal direction at a predetermined speed; The light source device condenses light beams in the ultraviolet wavelength range with a frequency Fz pulse on the surface of the sheet substrate to form spot light, and makes the spot light extend along the width direction crossing the longitudinal direction of the sheet substrate The step of line scanning; and the step of modulating the intensity of the light beam by the light switching element during the scanning of the spot, dividing the pattern into pixel units according to the pattern; the response frequency when the light switching element is modulated Fss and the frequency Fz of the pulse oscillation of the light beam are set to a relationship of Fz>Fss.

According to the aspect of the present invention, it is possible to provide a substrate processing apparatus capable of appropriately drawing a plurality of drawing units on a substrate by reducing a bonding error when performing exposure using a plurality of drawing units on a bonding pattern in a width direction of the substrate, Component manufacturing method. Furthermore, it is possible to provide a substrate processing method that improves the drawing accuracy (uniformity of exposure amount, etc.) or faithfulness when one drawing unit draws a pattern along a drawing line.

1‧‧‧Component manufacturing system

11‧‧‧Drawing device

12‧‧‧Substrate transfer mechanism

13‧‧‧ Installation frame

14‧‧‧ Rotation position detection mechanism

16‧‧‧Control Department

23‧‧‧First optical platform

24‧‧‧Movement mechanism

25‧‧‧ 2nd optical platform

31‧‧‧ Calibration and Inspection Department

31Cs‧‧‧Photoelectric sensor

31f‧‧‧Shading member

73‧‧‧ 4th beam splitter

81‧‧‧Optical deflector

83‧‧‧ Scanner

96‧‧‧Reflecting mirror

97‧‧‧rotating polygon mirror

97a‧‧‧rotation axis

97b‧‧‧Reflecting surface

98‧‧‧Origin detector

AM1, AM2 ‧‧‧ alignment microscope

DR‧‧‧rotating cylinder

EN1, EN2, EN3, EN4 ‧‧‧ Encoder read head

EX‧‧‧Exposure device

I‧‧‧rotation axis

LL1~LL5‧‧‧Drawing line

PBS‧‧‧Beam splitter

UW1~UW5‧‧‧Drawing unit

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1.

FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate.

4 is a diagram showing the configuration of the rotating cylinder and the drawing device of the exposure device of FIG. 1.

FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1.

6 is a perspective view showing the configuration of the divergent optical system of the exposure apparatus of FIG. 1.

7 is a diagram showing the arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. 1.

FIG. 8 is a diagram illustrating the optical configuration for eliminating the shift of the drawing line caused by the inclination of the scanner reflective surface.

FIG. 9 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the drawing line and the encoder read head.

10 is a perspective view showing the surface structure of the rotating cylinder of the exposure apparatus of FIG. 1.

FIG. 11 is an explanatory diagram showing the positional relationship between drawing lines and drawing patterns on a substrate.

12 is an explanatory diagram showing the relationship between the beam spot and the drawn line.

FIG. 13 is a graph simulating the change in intensity distribution caused by the overlapping amount of beam points of two pulses obtained on a substrate.

FIG. 14 is a flowchart of the adjustment method of the exposure apparatus according to the first embodiment.

15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating cylinder and the drawn line.

16 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a bright field of view.

FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a dark field.

18 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a dark field.

FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder.

FIG. 20 is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawing lines.

21 is an explanatory diagram schematically showing the relationship between the moving distance of the substrate per unit time and the number of drawing lines included in the moving distance.

FIG. 22 is an explanatory diagram schematically showing pulsed light synchronized with the system clock of the pulsed light source.

23 is a block diagram illustrating an example of the circuit configuration of a system clock that generates a pulsed light source.

FIG. 24 is a timing diagram showing the signal migration of each part in the circuit configuration of FIG. 23.

FIG. 25 is a flowchart showing the manufacturing method of each element.

The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. Of course, the present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those that are easy for the operator to imagine and those that are substantially the same. In addition, the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]

FIG. 1 shows the overall structure of an exposure apparatus (substrate processing apparatus) according to the first embodiment Figure. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs exposure processing on a substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various processes on a substrate P after exposure to manufacture devices. First, the component manufacturing system 1 will be described.

<Component Manufacturing System>

The component manufacturing system 1 is a production line for manufacturing flexible displays as components (flexible display manufacturing lines). Flexible displays, such as organic EL displays. In this device manufacturing system 1, a flexible elongated substrate P is wound into a cylindrical supply roll (not shown) to supply the substrate P, and after the substrate P is continuously subjected to various treatments, The so-called roll-to-roll method in which the processed substrate P is wound as a flexible element on a recovery reel (not shown). In the component manufacturing system 1 of the first embodiment, the film-shaped sheet substrate P is sent out from the supply roll, and the substrate P sent out from the supply roll is sequentially passed through the processing device U1, the exposure device EX, and the processing device U2 Afterwards, it is wound on a reel for recycling. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of a metal or alloy such as a resin film or stainless steel. The material of the resin film may include, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate One or more of ester resin, polystyrene resin, polyvinyl alcohol resin and other materials.

For the substrate P, for example, it is preferable to select, for example, a coefficient of thermal expansion that is not significantly large, and the amount of deformation caused by heat in various treatments performed on the substrate P can be substantially ignored. The thermal expansion coefficient can be set to be lower than the threshold value corresponding to the processing temperature by, for example, mixing an inorganic filler in the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. also, The substrate P may be a single layer body of extremely thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminate in which the above-mentioned resin film, foil, or the like is bonded to the extremely thin glass.

The substrate P configured in this way is wound into a roll shape to become a supply roll, and this supply roll is mounted on the component manufacturing system 1. The component manufacturing system 1 equipped with a supply reel repeatedly executes various processes for manufacturing components on the substrate P sent out from the supply reel in the longitudinal direction. Therefore, on the processed substrate P, a plurality of patterns for electronic components (display panel, printed circuit board, etc.) are formed in a state of being connected at regular intervals in the longitudinal direction. In other words, the substrate P sent from the supply reel is a substrate for multiple surfaces. In addition, the substrate P may be modified in advance by a predetermined pretreatment to activate its surface, or a fine partition wall structure (imprint) formed on the surface for precise patterning may be formed Constructor).

The processed substrate P is wound into a roll and collected as a roll for collection. The reel for recovery is installed on a cutting device (not shown). A cutting device equipped with a reel for recycling divides (cuts) the processed substrate P into individual components, thereby forming a plurality of components. The size of the substrate P is, for example, the size in the width direction (the direction of the short side) is about 10 cm to 2 m, and the size in the length direction (the direction of the long direction) is more than 10 m. Of course, the size of the substrate P is not limited to the above size

Next, the component manufacturing system 1 will be described with reference to FIG. 1. The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. In addition, FIG. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is the direction from the processing device U1 through the exposure device EX toward the processing device U2 in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is the direction (vertical direction) where the X direction and the Y direction are orthogonal, and the XY plane is parallel to the installation surface E of the manufacturing line where the exposure device EX is installed.

The processing device U1 performs a pre-process (pre-processing) process on the substrate P that is exposed by the exposure device EX. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure device EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

Here, the photosensitive functional layer is applied on the substrate P as a solution, and dried to form a layer (film). A typical photosensitive functional layer, with a photoresist as an unnecessary material after development, is exposed to the liquid-modified photosensitive silane coupling agent (SAM) in the portion irradiated with ultraviolet rays or the portion irradiated with ultraviolet rays Plating to restore the base of the photosensitive material, etc. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is changed from liquid-repellent to lyophilic, so the conductive ink is selectively coated on the portion that becomes lyophilic ( Ink containing conductive nano particles such as silver or copper) to form a pattern layer. When a photosensitive reduction material is used as the photosensitive functional layer, the patterned portion exposed to ultraviolet light on the substrate P exposes the plating reduction element. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions or the like A certain period of time to form (precipitate) a palladium pattern layer.

The exposure device EX draws patterns such as various circuits or various wiring for display panels on the substrate P supplied from the processing device U1. Details will be described later. This exposure device EX is a plurality of beams LB (hereinafter, also referred to as drawing beams LB) projected from each of the plurality of drawing units UW1 to UW5 onto the substrate P in a predetermined scanning direction Draw lines LL1~LL5 to expose a predetermined pattern on the substrate P.

The processing device U2 receives the substrate P after the exposure processing by the exposure device EX, and performs a post-process processing (post-processing) on the substrate P. The processing device U2, when the photosensitive functional layer of the substrate P is a photoresist, performs a baking process after the glass transition temperature of the substrate P or less, Development treatment, washing treatment, drying treatment, etc. In addition, when the photosensitive functional layer of the substrate P is a photosensitive plating return material, the processing device U2 performs electroless plating processing, cleaning processing, drying processing, and the like. In addition, when the photosensitive functional layer of the substrate P is a photosensitive silane coupling agent, the processing device U2 performs selective coating processing, drying processing, and the like of the liquid ink on the substrate P that becomes lyophilic. Through such a processing device U2, a pattern layer of elements is formed on the substrate P.

<Exposure device (substrate processing device)>

Next, the exposure apparatus EX will be described with reference to FIGS. 1 to 10. FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. 4 is a diagram showing the configuration of a rotating cylinder and a drawing device (drawing unit) of the exposure device of FIG. 1. FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1. 6 is a perspective view showing the configuration of the divergent optical system of the exposure apparatus of FIG. 1. 7 is a diagram showing the arrangement relationship of scanners in a plurality of drawing units of the exposure apparatus of FIG. 1. FIG. 8 is a diagram illustrating the optical configuration for eliminating the shift of the drawing line caused by the inclination of the scanner reflective surface. FIG. 9 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the encoder read head drawing the line. 10 is a perspective view showing an example of the surface structure of a rotating cylinder of the exposure apparatus of FIG.

As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called maskless exposure apparatus. In this embodiment, the substrate P side is continuously moved in the transport direction at a constant speed ( Long direction), while scanning the spot light of the drawing beam LB in a predetermined scanning direction (the width direction of the substrate P) at a high speed, according to the drawing on the surface of the substrate P, a predetermined pattern is formed on the substrate P Line (raster scan) direct drawing exposure device.

As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11 and a substrate conveyor Configuration 12, alignment microscopes AM1, AM2, and control unit 16. The drawing device 11 includes a plurality of drawing units UW1 to UW5. The drawing device 11 draws a predetermined pattern by a plurality of drawing units UW1 to UW5 in a part of the substrate P conveyed while being closely supported above the outer peripheral surface of the cylindrical rotating cylinder DR as a part of the substrate conveying mechanism 12. The substrate transfer mechanism 12 transfers the substrate P transferred from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are used to align the positions of the patterns to be drawn on the substrate P and the substrate P, and detect alignment marks and the like formed on the substrate P in advance. The control unit 16 including a computer, a microcomputer, a CPU, an FPGA, etc. controls each part of the exposure device EX, and causes each part to perform processing. The control unit 16 may be a part or all of the upper control device of the control element manufacturing system 1. In addition, the control unit 16 is controlled by a higher-level control device. The higher-level control device may be other devices such as a host computer that manages the production line.

Further, as shown in FIG. 2, the exposure apparatus EX includes an apparatus frame 13 that supports at least a part of the drawing apparatus 11 and the substrate transport mechanism 12 (rotating cylinder DR, etc.). Rotation angle position and rotation speed, rotation axis direction displacement and other rotating beam spot light SP position detection mechanism (encoder read head shown in FIGS. 4 and 9 etc.), and FIG. 1 (or FIGS. 3 and 9) Align the microscope AM1, AM2, etc. as shown. In addition, in the exposure device EX, as shown in FIGS. 4 and 5, a light source device CNT that emits ultraviolet laser light (pulse light) as a drawing light beam LB is provided. This exposure device EX distributes the drawing light beam LB emitted from the light source device CNT to each of the plurality of drawing units UW1 to UW5 constituting the drawing device 11 at a substantially equal amount of light (illuminance).

As shown in FIG. 1, the exposure device EX is housed in the greenhouse EVC. Adjust the greenhouse EVC and install it on the installation surface of the manufacturing workshop through the passive or active anti-vibration units SU1 and SU2 (Ground) E. Anti-vibration units SU1 and SU2 are provided on the installation surface E to reduce the vibration from the installation surface E. The greenhouse EVC is adjusted to keep the inside at a predetermined temperature, thereby suppressing the shape change of the substrate P transported inside due to temperature.

The substrate conveying mechanism 12 of the exposure apparatus EX has an edge position controller EPC, a driving roller DR4, a tension adjusting roller RT1, a rotating cylinder (cylindrical cylinder) DR, and a tension adjusting roller in order from the upstream side of the substrate P in the conveying direction RT2, driving roller DR6, and driving roller DR7.

The edge position controller EPC adjusts the position of the substrate P transferred from the processing device U1 in the width direction (Y direction). The edge position controller EPC can position the substrate P within the width of the end position (edge) of the substrate P sent from the processing device U1 in the range of ± tens μm to tens μm relative to the target position The direction is slightly moved to correct the position of the substrate P in the width direction.

The driving roller DR4 of the clamping method rotates while clamping the front and back sides of the substrate P conveyed from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction to move the substrate P to the rotating cylinder DR Transport. Rotate the cylinder DR, around the center of rotation while holding the part of the pattern on the substrate P to be exposed to the cylindrical outer surface with a certain radius from the rotation center line (rotation axis) AX2 extending in the Y direction When the line AX2 rotates, the substrate P is transported in the longitudinal direction.

In order to rotate such a rotating cylinder DR around the rotation center line AX2, shaft portions Sf2 coaxial with the rotation center line AX2 and shaft portions Sf2 are provided on both sides of the rotating cylinder DR, as shown in FIG. 2, through The bearing is supported by the device frame 13 by a shaft. The shaft portion Sf2 is provided with a rotational torque from a drive source (motor, reduction gear mechanism, etc.) not shown. Again, will contain the center of rotation The plane where the line AX2 is parallel to the YZ plane is set as the center plane p3.

The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported by the rotating cylinder DR. The two sets of nip drive rollers DR6 and DR7 are arranged at a predetermined interval in the conveying direction of the substrate P, and a predetermined slack DL is given to the substrate P after exposure. The substrate P is transferred to the processing device U2 by rotating the upstream side of the transported substrate P by the driving roller DR6 and rotating the downstream side of the transported substrate P by the driving roller DR7. At this time, since the substrate P is given the slack DL, it can absorb the change in the transfer speed of the substrate P that is generated downstream of the driving roller DR6 in the transfer direction, and isolates the influence of the exposure process caused by the change in the transfer speed on the substrate P.

Therefore, the substrate transfer mechanism 12 can adjust the position of the substrate P transferred from the processing device U1 in the width direction by the edge position controller EPC. The substrate conveying mechanism 12 conveys the substrate P whose position in the width direction is adjusted to the tension adjusting roller RT1 by driving the roller DR4, and conveys the substrate P passing through the tension adjusting roller RT1 to the rotating cylinder DR. By rotating the rotating cylinder DR, the substrate transport mechanism 12 transports the substrate P supported by the rotating cylinder DR to the tension adjusting roller RT2. The substrate conveying mechanism 12 conveys the substrate P conveyed to the tension adjusting roller RT2 to the driving roller DR6, and conveys the substrate P conveyed to the driving roller DR6 to the driving roller DR7. Next, the substrate transport mechanism 12 transports the substrate P to the processing device U2 while applying the slack DL to the substrate P by the driving roller DR6 and the driving roller DR7.

2 again, the device frame 13 of the exposure device EX will be described. In FIG. 2, the X direction, the Y direction and the Z direction are orthogonal orthogonal coordinate systems, which are the same orthogonal coordinate systems as FIG. 1.

As shown in FIG. 2, the device frame 13 has the The body frame 21, the three-point seat 22 of the support mechanism, the first optical table 23, the moving mechanism 24, and the second optical table 25. The body frame 21 is a portion provided on the installation surface E through the anti-vibration units SU1 and SU2. The body frame 21 rotatably supports (supports) the rotating cylinder DR and the tension adjusting rollers RT1 (not shown) and RT2. The first optical table 23 is provided on the upper side in the vertical direction of the rotating cylinder DR, and is provided on the main body frame 21 through the three-point mount 22. The three-point mount 22 supports the first optical table 23 with three support points, and the position in the Z direction (height position) of each support point can be adjusted. Therefore, the three-point mount 22 can adjust the tilt of the platform surface of the first optical platform 23 relative to the horizontal plane to a predetermined tilt. In addition, when the device frame 13 is assembled, the position between the main body frame 21 and the three-point seat 22 can be adjusted in the X and Y directions within the XY plane. On the other hand, after the device frame 13 is assembled, the body frame 21 and the three-point seat 22 are fixed in the XY plane (rigid state).

The second optical table 25 is provided on the vertically upper side of the first optical table 23, and is provided on the first optical table 23 through the moving mechanism 24. The second optical platform 25 has a platform surface parallel to the platform surface of the first optical platform 23. On the second optical table 25, a plurality of drawing units UW1 to UW5 of the drawing device 11 are provided. The moving mechanism 24 can make the first optical table 23 and the second optical table 25 parallel to each other, with the predetermined rotation axis I extending in the vertical direction as the center, with respect to the first optical table 23 to make the first 2 Optical platform 25 precision micro-rotation. The rotation range is, for example, a structure within ± hundreds of milliradians relative to the reference position, and the angle can be set with a resolution of 1 to several milliradians. In addition, the moving mechanism 24 is also provided with the second optical table 25 in the X direction and Y relative to the first optical table 23 in a state where the table surfaces of the first optical table 23 and the second optical table 25 are kept parallel. At least one direction of precise micro-movement mechanism can make the rotation axis I from the reference position to the X direction or Y direction in the order of μm The decomposition ability slightly changed. This rotation axis I, at the reference position, is a predetermined point (the substrate P of the substrate P) which extends in the vertical direction in the center plane p3 and is wound around the surface of the substrate P (drawing surface curved along the circumferential surface) of the rotating cylinder DR Midpoint in the width direction) (see Figure 3). By such a moving mechanism 24, the second optical table 25 is rotated or moved relative to the first optical table 23, that is, the plurality of drawing units UW1 to UW5 can be adjusted integrally with respect to the rotating cylinder DR or wound around the rotating cylinder The position of the substrate P of DR.

Next, the light source device CNT will be described with reference to FIG. 5. The light source device CNT is provided on the body frame 21 of the device frame 13. The light source device CNT emits laser light as a drawing light beam LB projected on the substrate P. The light source device CNT has a light source that emits light in a predetermined wavelength band suitable for the exposure of the photosensitive functional layer on the substrate P and in the ultraviolet band with strong photoactivity. As the light source, for example, a laser light source that continuously oscillates or pulses the YAG's third harmonic laser light (wavelength 355 nm) at a frequency of several KHz to several hundred MHz can be used.

The light source device CNT includes a laser light generation unit CU1 and a wavelength conversion unit CU2. The laser light generating unit CU1 includes a laser light source OSC and optical fiber amplifiers FB1 and FB2. The laser light generating unit CU1 emits the basic wave laser light Ls. The optical fiber amplifiers FB1 and FB2 amplify the basic wave laser light Ls with an optical fiber. The laser light generating unit CU1 causes the amplified basic wave laser light Lr to enter the wavelength conversion unit CU2. The wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a beam splitter, a polarizing beam splitter, and so on. By using such light (wavelength) selection components, the laser beam of the third higher harmonic laser wavelength 355 nm is taken out (Drawing light beam LB). At this time, the laser light source OSC that emits seed light is pulsed in synchronization with the system clock, etc., and the light source device CNT emits a drawing light beam LB with a wavelength of 355 nm as pulse light in the range of several KHz to hundreds of MHz. In addition, when using this type of optical fiber amplifier, the final output can be output according to the pulse driving state of the laser light source OSC One pulse light emission time of laser light (Lr and LB) is controlled to picosecond level.

Also, as a light source, a lamp light source such as a mercury lamp with a glow line (g-line, h-line, i-line, etc.) in the ultraviolet band, a laser diode with an oscillation peak in the ultraviolet band below 450 nm, and light emission can also be used Solid light sources such as LEDs, or KrF excimer laser light (wavelength 248nm), ArF excimer laser light (wavelength 193nm), XeCl excimer laser light (wavelength 308nm) that emits far ultraviolet light (DUV light) Etc. gas laser light source.

Here, the drawing light beam LB emitted from the light source device CNT is projected on the substrate P through the polarizing beam splitter PBS provided in each drawing unit UW1 to UW5 as described later. Generally speaking, the polarizing beam splitter PBS reflects the linearly polarized light beam of S-polarized light, and penetrates the linearly polarized light beam of P-polarized light. Therefore, in the light source device CNT, it is preferable to use the drawing beam LB incident on the polarizing beam splitter PBS as the laser beam that emits a linearly polarized (S-polarized) beam. In addition, since the energy density of the laser light is high, the illuminance of the light beam projected on the substrate P can be appropriately ensured.

Next, the drawing device 11 of the exposure device EX will also be described with reference to FIG. 3. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing units UW1 to UW5. This drawing device 11 divides the drawing light beam LB emitted from the light source device CNT into a plurality of plural pieces, and diverges the plural drawing light beams LB along the plural pieces on the substrate P as shown in FIG. 3 (for example, 5 in the first embodiment) Bar) The drawing lines LL1 to LL5 are condensed into tiny spot lights (several μm diameter) and scanned. The drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a description will be given of a plurality of drawing lines LL1 to LL5 (scanning locus of spot light) formed on the substrate P by the scanning device 11 scanning a plurality of drawing beams LB.

As shown in FIG. 3, a plurality of drawing lines LL1~LL5, sandwiching the central plane p3 at The circumferential direction of the rotating cylinder DR is arranged in two rows. On the substrate P on the upstream side in the rotation direction, an odd numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged parallel to the Y axis on the substrate P on the downstream side in the rotation direction, parallel to the Y axis The even numbered second drawing line LL2 and fourth drawing line LL4 are arranged.

The drawing lines LL1 to LL5 are formed substantially parallel to the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating cylinder DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is the minimum joint error of the pattern obtained by drawing a plurality of drawing lines LL1 to LL5 when the substrate P is transferred by the substrate transport mechanism 12 at the reference speed, and the cylinder DR can be rotated relatively The direction in which the rotation center line AX2 extends (axis direction or width direction) is inclined at a predetermined angle.

The odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. In addition, even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the direction of the center line AX2. In addition, the first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width in the width direction (axial direction) of the exposure area A7 drawn on the substrate P.

The scanning direction of the spot light of the drawing light beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction and the same direction. Also, the drawing beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 The scanning direction of the spot light is a one-dimensional direction and the same direction. At this time, the scanning direction of the spot light of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the spot light of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 ( -Y direction), as shown by the arrow in Figure 3, the opposite direction. This is because the drawing units UW1 to UW5 have the same structure, and the odd-numbered drawing units and the even-numbered drawing units are rotated 180° in the XY plane to face each other, and the beams provided in each drawing unit UW1 to UW5 are used as light beams. The polygon mirror of the scanner rotates in the same direction. Therefore, in view of the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 and the drawing start positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the Y direction with an error of the diameter of the spot light Connection (or coincidence). Similarly, the drawing end positions of odd-numbered drawing lines LL1, LL3 and the drawing end positions of even-numbered drawing lines LL2, LL4 are adjacent to each other in the Y direction with an error of the diameter of the spot light ( Or consistent).

As described above, the odd-numbered drawing lines LL1, LL3, and LL5 are arranged on the substrate P in a row in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotating cylinder DR. The even-numbered drawing lines LL2 and LL4 are arranged on the substrate P in a row in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotating cylinder DR.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 includes the plurality of drawing units UW1 to UW5, a divergent optical system SL that diverts the drawing light beam LB from the light source device CNT to the drawing units UW1 to UW5, and a calibration detection system 31 for performing calibration.

The divergent optical system SL diverges the drawing beam LB emitted from the light source device CNT It is plural, and the divergent plural drawing beams LB are respectively directed to plural drawing units UW1~UW5. The divergent optical system SL includes a first optical system 41 diverging the drawing light beam LB emitted from the light source device CNT into two, a second optical system 42 entering the drawing light beam LB with one of the first optical system 41 diverging, and The third optical system 43 in which another drawing light beam LB that diverges from the first optical system 41 enters. In addition, the first optical system 41 of the branching optical system SL is provided with a beam displacement mechanism 44 for transversely shifting the drawing light beam LB in a plane orthogonal to the proceeding axis of the drawing optical beam LB, and the third The optical system 43 is provided with a beam displacement mechanism 45 that laterally shifts the drawing beam LB two-dimensionally. In the divergent optical system SL, part of the light source device CNT side is provided on the main body frame 21, and on the other hand, the other part on the drawing unit UW1~UW5 side is provided on the second optical table 25.

The first optical system 41 includes a 1/2 wavelength plate 51, a polarizer (polarization beam splitter) 52, a beam diffuser (beam diffuser) 53, a first mirror 54, a first relay lens 55, and a second relay lens 56. Beam displacement mechanism 44, second mirror 57, third mirror 58, fourth mirror 59, and first beam splitter 60. In addition, it is not easy to understand the arrangement relationship of the components from FIGS. 4 and 5. Therefore, the explanation will also be made with reference to the perspective view of FIG. 6.

As shown in FIG. 6, the drawing light beam LB emitted from the light source device CNT in the +X direction enters the half-wave plate 51. The half-wave plate 51 is rotatable in the incident plane of the drawing light beam LB. The drawing light beam LB incident on the half-wave plate 51 has a polarization direction corresponding to the predetermined polarization direction corresponding to the rotation position (angle) of the half-wave plate 51. The drawing beam LB passing through the 1/2 wavelength plate 51 enters the polarizer 52. The polarizer 52 transmits the light component in the predetermined polarization direction contained in the drawing light beam LB, and on the other hand, reflects the light component in the other polarization direction in the +Y direction. Therefore, the intensity of the drawing beam LB reflected by the polarizer 52 can be adjusted according to the rotation position of the 1/2-wavelength plate 51 by the cooperative action of the 1/2-wavelength plate 51 and the polarizer 52.

A portion of the drawing light beam LB (unwanted light component) that has passed through the polarizer 52 is irradiated to the diffuser (light-harvesting) 53. The diffuser 53 absorbs part of the light component of the incident drawing light beam LB to suppress the light component from leaking to the outside. Further, it is also used in the adjustment operation of various optical systems through which the drawing beam LB passes, because the laser power is too strong at the maximum state and is dangerous, so that the diffuser 53 can absorb more light components of the drawing beam LB , And change the rotation position (angle) of the 1/2 wavelength plate 51 so that the power of the drawing beam LB toward the drawing units UW1 to UW5 is greatly attenuated.

The drawing beam LB reflected by the polarizer 52 in the +Y direction is reflected by the first mirror 54 in the +X direction, passes through the first relay lens 55 and the second relay lens 56 and enters the beam displacement mechanism 44 to reach the second 2 reflective mirror 57.

The first relay lens 55 converges the drawing light beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 causes the drawing light beam LB divergent after convergence to become a parallel light beam again.

The beam displacement mechanism 44, as shown in FIG. 6, includes two parallel plane plates (quartz) arranged along the traveling direction (+X direction) of the depicted beam LB, and one of the parallel plane plates is arranged to be parallel to the Y axis The axis is tilted, and another parallel plane plate is arranged so that the edge is tilted about an axis parallel to the Z axis. According to the inclination angle of each parallel plane plate, the drawing beam LB is traversed in the ZY plane and emitted from the beam displacement mechanism 44.

After that, the drawing light beam LB is reflected by the second mirror 57 in the −Y direction, reaches the third mirror 58, and is reflected by the third mirror 58 in the −Z direction, and reaches the fourth mirror 59. With the fourth mirror 59, the drawing light beam LB is reflected in the +Y direction and enters the first beam splitter 60. The first beam splitter 60 reflects part of the light quantity component of the drawing beam LB in the -X direction to guide the second The optical system 42 directs the remaining light quantity components of the drawing light beam LB to the third optical system 43. In the present embodiment, the drawing beam LB directed to the second optical system 42 is distributed to the three drawing units UW1, UW3, UW5 afterwards, and the drawing beam LB directed to the third optical system 43 is distributed to the two drawing thereafter. Units UW2, UW4. Therefore, the ratio of the reflectance to the transmittance of the first beam splitter 60 at the light splitting surface is preferably 3:2 (reflectivity 60%, transmittance 40%), but it is not necessarily so, it can also be 1:1.

Here, the third mirror 58 and the fourth mirror 59 are provided at a predetermined interval on the rotation axis I of the moving mechanism 24. That is, the center line of the drawing beam LB (parallel beam) reflected by the third mirror 58 and directed toward the fourth mirror 59 is set to coincide with the rotation axis I (to be coaxial).

In addition, the structure including the third reflector 58 to the light source device CNT (the part surrounded by the two-dot chain line on the upper side in the Z direction in FIG. 4) is provided on the body frame 21 side, and on the other hand, includes the fourth reflection The structure of the mirror 59 to the plurality of drawing units UW1 to UW5 (the part surrounded by the two-dot chain line on the lower side in the Z direction in FIG. 4) is provided on the second optical table 25 side. Since the third reflecting mirror 58 and the fourth reflecting mirror 59 are arranged such that even if the first optical table 23 and the second optical table 25 are relatively rotated by the moving mechanism 24, the drawing light beam LB will pass coaxially with the rotation axis I. 4 The optical path of the drawing beam LB from the mirror 59 to the first beam splitter 60 does not change. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the moving mechanism 24, the drawing light beam LB emitted from the light source device CNT provided on the side of the body frame 21 can be appropriately and stably guided to the first 2 A plurality of drawing units UW1~UW5 on the 25 side of the optical table.

The second optical system 42 directs the drawing beam LB of one side of the first beam splitter 60 of the first optical system 41 to the odd numbered drawing units UW1, UW3, UW5. The second optical system 42 includes a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth mirror 64.

The first beam splitter 60 in the first optical system 41 is reflected by the drawing beam LB in the -X direction, is reflected by the fifth mirror 61 in the -Y direction, and then enters the second beam splitter 62. A portion of the drawing beam LB incident on the second beam splitter 62 is reflected in the -Z direction, and is directed to one odd-numbered drawing unit UW5 (see FIG. 5). The drawing beam LB passing through the second beam splitter 62 enters the third beam splitter 63. A part of the drawing beam LB incident on the third beam splitter 63 is reflected in the -Z direction, and is directed to one odd-numbered drawing unit UW3 (see FIG. 5). On the other hand, a part of the drawing beam LB passing through the third beam splitter 63 is reflected by the sixth mirror 64 in the -Z direction, and is directed to one odd-numbered drawing unit UW1 (see FIG. 5). In the second optical system 42, the drawing light beam LB irradiated to the odd-numbered drawing units UW1, UW3, and UW5 is slightly inclined with respect to the -Z direction.

In addition, in order to effectively use the power of the drawing beam LB, the ratio of the reflectance of the second beam splitter 62 to the transmittance is close to 1:2, and the ratio of the reflectance of the third beam splitter 63 to the transmittance is close to 1: 1 is better.

On the other hand, the third optical system 43 diverts the other drawing beam LB of the first beam splitter 60 of the first optical system 41 to the even-numbered drawing units UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71, a beam displacement mechanism 45, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing beam LB penetrating in the +Y direction by the first beam splitter 60 of the first optical system 41 is reflected by the seventh mirror 71 in the +X direction, penetrates the beam displacement mechanism 45, and enters the eighth mirror 72 . The beam displacement mechanism 45 is composed of two parallel plane plates (quartz) that can be tilted in the same way as the beam displacement mechanism 44, and is drawn in the +X direction toward the eighth mirror 72 The light beam LB traverses in the ZY plane.

The drawing light beam LB reflected in the −Y direction by the eighth mirror 72 enters the fourth beam splitter 73. A part of the drawing beam LB irradiated on the fourth beam splitter 73 is reflected in the -Z direction, and is directed to one drawing unit UW4 of an even number (see FIG. 5). The drawing light beam LB passing through the fourth beam splitter 73 is reflected by the ninth mirror 74 in the -Z direction, and is directed to one drawing unit UW2 of an even number. In the third optical system 43, the drawing light beam LB irradiated to the even-numbered drawing units UW2 and UW4 is also slightly inclined with respect to the -Z direction.

As described above, in the divergent optical system SL, toward the plural drawing units UW1 to UW5, the drawing light beam LB from the light source device CNT is diverged into plural pieces. At this time, the reflectance (transmittance) of the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 is adjusted appropriately according to the divergence of the drawing beam LB The reflectivity of the light beam is such that the beam intensity of the drawing beam LB irradiated to the drawing units UW1 to UW5 is the same intensity.

The beam displacement mechanism 44 is arranged between the second relay lens 56 and the second mirror 57. The beam displacement mechanism 44 can finely adjust all positions of the drawing lines LL1 to LL5 formed on the substrate P in the drawing plane of the substrate P on the order of μm.

In addition, the beam displacement mechanism 45 can fine-tune the second drawing line LL2 and the fourth drawing line LL4 of the even number among the drawing lines LL1 to LL5 formed on the substrate P in the drawing plane of the substrate P on the order of μm.

Further referring to FIGS. 4, 5 and 7, a plurality of drawing units UW1 to UW5 will be described. As shown in FIG. 4 (and FIG. 1 ), a plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 in between. A plurality of drawing units UW1 to UW5 are arranged on the side sandwiching the center plane p3 between the first, third, and fifth drawing lines LL1, LL3, and LL5 (Figure 5 -X direction side), the first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged. The first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at a predetermined interval in the Y direction. In addition, a plurality of drawing units UW1 to UW5 are arranged on the side sandwiching the center plane p3 between the second and fourth drawing lines LL2 and LL4 (the +X direction side in FIG. 5), and the second drawing units UW2 and the fourth drawing unit are arranged UW4. The second drawing unit UW2 and the fourth drawing unit UW4 are arranged at a predetermined interval in the Y direction. At this time, as shown in the previous FIG. 2 or FIG. 5, the second drawing unit UW2 is arranged between the first drawing unit UW1 and the third drawing unit UW3 in the Y direction. Similarly, the third drawing unit UW3 is arranged between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction. The fourth drawing unit UW4 is arranged between the third drawing unit UW3 and the fifth drawing unit UW5 in the Y direction. Further, as shown in FIG. 4, the first drawing unit UW1, the third drawing unit UW3 and the fifth drawing unit UW5, and the second drawing unit UW2 and the fourth drawing unit UW4 are viewed from the Y direction and centered on the center plane p3 Symmetrical configuration.

Next, the configuration of the optical system in each drawing unit UW1 to UW5 will be described with reference to FIG. 4. In addition, since the drawing units UW1 to UW5 have the same configuration, the first drawing unit UW1 (hereinafter, simply referred to as the drawing unit UW1) will be described as an example.

The drawing unit UW1 shown in FIG. 4 scans the spot light of the drawing light beam LB along the drawing line LL1 (first drawing line LL1), and includes an optical deflector 81, a polarizing beam splitter PBS, a 1/4 wavelength plate 82, and a scanner 83. Bending mirror 84, f-θ lens system 85, and Y-magnification correction optical member (lens group) 86B including a cylindrical lens 86. In addition, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The optical deflector 81 uses, for example, an acousto-optic element (AOM: AcoustIic Optic) Modulator). The AOM is based on whether a diffraction grating is generated by ultrasonic (high-frequency signal) internally, so that the first diffracted light of the incident drawing beam is generated in the ON state of the predetermined diffraction angle direction, and the first diffracted light is not generated The optical switching element is switched in the OFF state.

The control unit 16 shown in FIG. 1 performs switching of the projection/non-projection of the drawing light beam LB on the substrate P at high speed by performing ON/OFF switching of the optical deflector 81. Specifically, one of the drawing light beams LB distributed by the bifurcated optical system SL is irradiated to the light deflector 81 through the relay lens 91 slightly inclined with respect to the -Z direction. When the light deflector 81 is switched off, the drawing light beam LB goes straight in an inclined state, and is blocked by the light blocking plate 92 provided after passing through the light deflector 81. On the other hand, when the optical deflector 81 is turned ON, the drawing beam LB (first-order diffracted light) is deflected in the -Z direction, and the light deflector 81 is irradiated to the Z direction provided in the optical deflector 81 Polarizing beam splitter PBS. Therefore, when the light deflector 81 is turned on, the spot light of the drawing beam LB is projected on the substrate P, and when the light deflector 81 is turned off, the spot light of the drawing beam LB is not projected on the substrate P.

In addition, since the AOM is disposed at the position of the waist of the drawing light beam LB converged by the relay lens 91, the drawing light beam LB (primary diffracted light) emitted from the optical deflector 81 diverges. For this reason, a relay lens 93 is provided after the optical deflector 81 to return the divergent drawing light beam LB to a parallel light beam.

The polarizing beam splitter PBS reflects the drawing light beam LB irradiated from the optical deflector 81 through the relay lens 93. The drawing beam LB emitted from the polarizing beam splitter PBS depends on the 1/4 wavelength plate 82, scanner 83 (rotating polygon mirror), bending mirror 84, f-θ lens system 85, Y-magnification correction optical member 86B and cylindrical surface The lenses 86 advance in order, condensing on the substrate P into scanning spot light.

On the other hand, the polarizing beam splitter PBS and the polarizing beam splitter PBS and scanning The 1/4 wavelength plate 82 between the devices 83 cooperates to reflect the reflected light of the drawing beam LB projected on the outer peripheral surface of the substrate P or the rotating cylinder DR below it, the optical member 86B for correcting Y magnification, the cylindrical lens 86, The order of the f-θ lens system 85, the bending mirror 84, and the scanner 83 advances in the reverse order, so that the reflected light can pass through. In other words, the linearly polarized laser light of the drawing beam LB of the S polarized light irradiated from the polarizer 81 to the polarizing beam splitter PBS is reflected by the polarizing beam splitter PBS. The drawing beam LB reflected by the polarizing beam splitter PBS passes through the quarter-wave plate 82, the scanner 83, the folding mirror 84, the f-θ lens system 85, the Y-magnification correction optical member 86B, and the cylindrical lens 86 Irradiated on the substrate P, the spot light of the drawing beam LB condensed on the substrate P becomes circularly polarized light. The reflected light from the substrate P (or the outer surface of the rotating cylinder DR) travels in the reverse direction on the transmission path of the drawing beam LB, and passes through the 1/4 wavelength plate 82 again to become linearly polarized laser light of P polarization. Therefore, the reflected light reaching the polarizing beam splitter PBS from the substrate P (or the rotating cylinder DR) penetrates the polarizing beam splitter PBS, and is irradiated to the photoelectric sensor 31Cs of the calibration detection system 31 through the relay lens 94.

As described above, the polarization beam splitter PBS is an optical splitter disposed between the scanning optical system including the scanner 83 and the calibration detection system 31. Since the calibration detection system 31 shares most of the light-transmitting optical system that sends the drawing beam LB to the substrate P, it is a simple and compact optical system.

As shown in FIGS. 4 and 7, the scanner 83 includes a mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing beam LB (parallel beam) passing through the quarter-wave plate 82 passes through the cylindrical lens 95 and is reflected by the mirror 96 in the XY plane, and is irradiated to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction with the rotation axis 97a as the center, so that the drawing light beam LB (after passing through the reflecting surface 97b) The reflection angle of the light beam whose intensity is modulated by the light deflector 81 continuously changes in the XY plane. According to this, the reflected drawing beam LB is caused by the bending mirror 84, the f-θ lens system 85, and the second cylindrical lens 86 (and Y-magnification correction optical member 86B) condenses into spot light and scans along the drawing line LL1 on the substrate P (similarly, along LL2 to LL5). The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 of the substrate P (similarly, along LL2 to LL5). The origin detector 98 is disposed on the opposite side of the reflecting mirror 96 with the drawing light beam LB reflected by each reflecting surface 97b sandwiched therebetween.

In FIG. 7, for the sake of simplicity, although the origin detector 98 only shows a photodetector, actually, an LED and a semiconductor laser that project a detection beam toward the reflection surface 97b of the rotating polygon mirror 97 projecting the drawing beam LB are provided. For a light source for detection such as radiation, the origin detector 98 performs photoelectric detection of the reflected light of the detection light beam on the reflection surface 97b through a thin slit.

Accordingly, the origin detector 98 is set to output a pulse signal indicating the origin at a certain time early relative to the time when the spot light irradiates the drawing start position of the drawing line LL1 (LL2 to LL5) on the substrate P.

The drawing beam LB irradiated from the scanner 83 to the folding mirror 84 is reflected by the folding mirror 84 in the -Z direction, and enters the f-θ lens system 85 and the cylindrical lens 86 (and the Y-magnification correction optical member 86B).

When each reflection surface 97b of the rotating polygonal mirror 97 is not strictly parallel with respect to the center line of the rotation axis 97a, but is slightly inclined (surface inclination), the trace lines (LL1 to LL5) formed by the spot light projected on the substrate P, Each reflection surface 97b is shifted in the X direction on the substrate P. Therefore, using FIG. 8, the arrangement of the two cylindrical lenses 95 and 86 will be described to reduce or eliminate the deviation of the drawing lines LL1 to LL5 in the X direction with respect to the tilting of the reflection surface 97b of the rotating polygon mirror 97.

The left side of FIG. 8 shows the state in which the optical paths of the cylindrical lens 95, scanner 83, f-θ lens system 85, and cylindrical lens 86 are expanded in the XY plane, and the right side in FIG. 8 shows the expansion of the optical path in the XZ plane. status. As a basic optical configuration, the reflective surface 97b irradiated by the drawing light beam LB of the rotating polygon mirror 97 is arranged at the entrance pupil position (front focus position) of the f-θ lens system 85. Accordingly, with respect to the rotation angle θp/2 of the rotating polygon mirror 97, the incident angle of the drawing beam LB incident on the f-θ lens system 85 becomes θp, which is proportional to the incident angle θp and determines the projection on the substrate P (irradiated surface) The high position of the light image on the spot. In addition, by arranging the reflective surface 97b at the focal position on the front side of the f-θ lens system 85, the drawing beam LB projected on the substrate P becomes a telecentric state at any position on the drawing line (the chief ray of the drawing beam of spot light) Constantly parallel to the optical axis AXf of the f-θ lens system 85).

As shown in FIG. 8, the two cylindrical lenses 95 and 86 function as parallel flat glass with zero power in a plane (XY plane) perpendicular to the rotation axis 97a of the rotating polygon mirror 97 In the Z direction (in the XZ plane) where the rotation axis 97a extends, it functions as a convex lens having a certain positive refractive power. Although the cross-sectional shape of the drawing beam LB (substantially parallel beam) incident on the first cylindrical lens 95 is a circle of about several millimeters, when the focal position of the cylindrical lens 95 in the XZ plane passes through the mirror 96, it is set to a multi-faceted rotation When the reflecting surface 97b of the mirror 97 has a beam width of several mm in the XY plane, the slit-shaped spot light that converges in the Z direction extends on the reflecting surface 97b to converge in the rotation direction.

The drawing beam LB reflected on the reflecting surface 97b of the rotating polygon mirror 97 is a parallel beam in the XY plane, but in the XZ plane (the direction in which the rotation axis 97a extends), it becomes a divergent beam and enters the f-θ lens system 85. . Therefore, the drawing beam LB emitted from the f-θ lens system 85 is substantially a parallel beam in the XZ plane (the direction in which the rotation axis 97a extends), but the second cylindrical surface penetrates The function of the mirror 86 also condenses light into spot light in the XZ plane, that is, on the substrate P in the transport direction of the substrate P orthogonal to the direction in which the drawing lines LL1 to LL5 extend. As a result, a small circular spot light is projected on each drawing line on the substrate P.

By the arrangement of the cylindrical lens 86, as shown in the right side of FIG. 8, in the XZ plane, the reflective surface 97b of the rotating polygon mirror 97 and the substrate P (irradiated surface) can be set in an optical image conjugate relationship. Therefore, even if each reflection surface 97b of the rotating polygon mirror 97 has a tilt error with respect to the non-scanning direction (the direction in which the rotation axis 97a extends) orthogonal to the scanning direction of the drawing light beam LB, the drawing lines (LL1 to LL5) on the substrate P The position does not deviate from the non-scanning direction of the spot light (the transport direction of the substrate P). As described above, by providing the cylindrical lenses 95 and 86 before and after rotating the polygon mirror 97, it is possible to constitute a plane tilt correction optical system for the polygonal reflecting surface in the non-scanning direction.

Here, as shown in FIG. 7, each scanner 83 of the plurality of drawing units UW1 to UW5 is configured symmetrically with respect to the central plane p3. A plurality of scanners 83, the three scanners 83 corresponding to the drawing units UW1, UW3, UW5 are arranged on the upstream side of the rotating cylinder DR in the rotation direction (the side in the -X direction in FIG. 7), and are connected to the drawing units UW2, UW4 The corresponding two scanners 83 are arranged on the downstream side of the rotating cylinder DR in the rotation direction (the +X direction side in FIG. 7). On the other hand, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 in between. In this way, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to rotate 180° about the rotation axis I (Z axis). Therefore, when the three rotating polygon mirrors 97 on the upstream side, for example, rotate to the left and irradiate the rotating polygon mirror 97 with the drawing beam LB, the drawing beam LB reflected by the rotating polygon mirror 97 is from the drawing start position to the drawing end position Scan in a predetermined scanning direction (for example, +Y direction in FIG. 7). On the other hand, when the two rotating polygon mirrors 97 on the downstream side rotate to the left and irradiate the rotating polygon mirror 97 with the drawing beam LB, the rotated polygon mirror The drawing light beam LB reflected by 97 is scanned from the drawing start position to the drawing end position in a scanning direction (for example, -Y direction in FIG. 7) opposite to the three rotating polygon mirrors 97' on the upstream side.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB that reaches the substrate P from the odd-numbered drawing units UW1, UW3, and UW5 is the same direction as the installation direction line Le1. That is to say, the azimuth line Le1 is set, and in the XZ plane, the lines connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 are connected. Similarly, when viewed in the XZ plane in FIG. 4, the axis of the drawing light beam LB that reaches the substrate P from the even-numbered drawing units UW2 and UW4 is in a direction consistent with the installation azimuth line Le2. That is, the azimuth line Le2 is set, and in the XZ plane, a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 is connected. Therefore, each traveling direction (primary ray) of the drawing light beam LB projected as spot light on the substrate P is set toward the rotation center line AX2 of the rotating cylinder DR.

The optical member 86B for Y magnification correction is disposed between the f-θ lens system 85 and the substrate P. The optical member 86B for Y magnification correction enables the drawing lines LL1 to LL5 formed by the drawing units UW1 to UW5 to be slightly enlarged or reduced in the Y direction by an equal amount.

Specifically, a transparent parallel plane plate (quartz) of a certain thickness covering each of the drawing lines LL1 to LL5 can be mechanically bent in the direction in which the drawing line extends to make the drawing line Y-direction magnification (Scanning length) variable mechanism, or a mechanism that moves a part of the three-group lens system of the convex lens, the concave lens, and the convex lens in the optical axis direction to change the magnification (scanning length) in the Y direction of the drawing line.

In the drawing device 11 configured in this manner, the control unit 16 controls each unit to draw a predetermined pattern on the substrate P. That is to say, the control unit 16 scans the drawing beam LB projected on the substrate P in the scanning direction, based on the CAD information of the pattern to be drawn on the substrate P, by The ON/OFF modulation data of the light deflector 81 is used to deflect the drawing light beam LB to draw a pattern on the photosensitive layer of the substrate P. Furthermore, the control unit 16 synchronizes the scanning direction of the drawing beam LB scanned along the drawing line LL1 with the movement of the substrate P in the conveying direction by the rotation of the rotating cylinder DR, and accordingly corresponds to the portion of the exposure area A7 corresponding to the drawing line LL1 Draw the established pattern.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 9 together. The alignment microscopes AM1 and AM2 detect alignment marks formed on the substrate P in advance, or fiducial marks and fiducial patterns formed on the rotating cylinder DR. Hereinafter, the alignment mark of the substrate P and the reference mark and the reference pattern of the rotating cylinder DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used to align the position of the substrate P with a predetermined pattern drawn on the substrate P, or to calibrate the rotating cylinder DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are provided upstream of the rotation direction of the rotating cylinder DR (the transport direction of the substrate P) of the drawing lines LL1 to LL5 formed by the drawing device 11. In addition, the alignment microscope AM1 is arranged upstream of the rotation cylinder DR in the rotation direction of the alignment microscope AM2.

Alignment microscopes AM1 and AM2 are object lenses that are used as detection probes by projecting illumination light onto the substrate P or rotating cylinder DR and incident on the light generated by the mark (only a representative display pair in FIG. 9) Quasi-microscope AM2 (objective lens system GA4), and a photographic system that takes images of the marks (bright-field image, dark-field image, fluorescent image, etc.) received through the object-lens system GA (bright field image, dark field image, fluorescent image, etc.) GD (only representatively shown in FIG. 9 shows the shooting GD4 aligned with the microscope AM2) isotonic. In addition, the illumination light for alignment is light in a wavelength band having little sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

Align the microscope AM1 in a line in the Y direction (the width direction of the substrate P) There are plural (for example 3). Similarly, a plurality of alignment microscopes AM2 (for example, three) are arranged in a row in the Y direction (the width direction of the substrate P). In other words, there are six alignment microscopes AM1 and AM2 in total.

In FIG. 3, for easy understanding, the arrangement of the three pairs of objective lens systems GA1 to GA3 of the alignment microscope AM1 in the six alignment microscopes AM1 and AM2 is shown. The three pairs of objective lenses of the alignment microscope AM1 are the observation areas (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating cylinder DR) of GA1 to GA3, as shown in FIG. The center line AX2 is parallel to the Y direction and arranged at predetermined intervals. As shown in FIG. 9, the optical axes La1 to La3 of each pair of object lenses GA1 to GA3 passing through the centers of the observation areas Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the observation lenses Vw4 to Vw6 on the substrate P (or outer peripheral surface of the rotating cylinder DR) of the three pairs of objective lenses of the alignment microscope AM2 are parallel to the rotation center line AX2 as shown in FIG. 3 The Y direction is arranged at predetermined intervals. As shown in FIG. 9, the optical axes La4 to La6 of each pair of objective lens systems GA passing through the centers of the observation areas Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating cylinder DR.

The observation areas Vw1 to Vw6 of the alignment microscope AM1 and AM2 pair marks are attached to the substrate P and the rotating cylinder DR, for example, set in a range of about 500 to 200 μm diagonally. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set to the azimuth line extending from the rotation center line AX2 to the radial direction of the rotating cylinder DR Le3 is in the same direction. In this way, when the azimuth line Le3 is set and observed in the XZ plane in FIG. 9, it is a line connecting the observation area Vw1 to Vw3 aligned with the microscope AM1 and the rotation center line AX2. Similarly, aim at the optical axis La4~La6 of the microscope AM2, that is, the optical axis of the objective lens system GA La4~La6 are set in the same direction as the installation azimuth line Le4 extending from the rotation center line AX2 to the radial direction of the rotating cylinder DR. In this way, when the azimuth line Le4 is set and observed in the XZ plane of FIG. 9, the line connecting the observation area Vw4 to Vw6 aligned with the microscope AM2 and the rotation center line AX2 is connected. At this time, since the alignment microscope AM1 is arranged upstream of the rotation direction of the rotating cylinder DR compared to the alignment microscope AM2, the angle formed by the center plane p3 and the azimuth line Le3 is smaller than the center plane p3 and the azimuth line The angle formed by Le4 is large.

On the substrate P, as shown in FIG. 3, the exposure areas A7 drawn with each of the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter, referred to as marks) for positioning are formed, for example, in a cross shape.

In FIG. 3, the mark Ks1 is provided at a certain interval in the X direction on the -Y side peripheral area of the exposure area A7, and the mark Ks3 is provided at a certain interval in the X direction in the +Y side peripheral area of the exposure area A7. Further, the mark Ks2 is provided in the center of the Y direction in the blank area between the two exposure areas A7 adjacent in the X direction.

The mark Ks1 is in the observation area Vw1 of the objective lens system GA1 aligned with the microscope AM1 and the observation area Vw4 of the objective lens system GA aligned with the microscope AM2, and can be captured in sequence during the transfer of the substrate P Way to form. In addition, the mark Ks3 is within the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and within the observation area Vw6 of the objective lens system GA of the alignment microscope AM2, and can be Formed in order to capture. Further, the mark Ks2 is respectively in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA of the alignment microscope AM2 during the conveyance period of the substrate P Formed in order to capture.

Therefore, the alignment microscopes AM1 and AM2 on the two sides in the Y direction of the rotating cylinder DR in the alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P at any time. In addition, the three alignment microscopes AM1 and AM2 in the Y direction center of the rotating cylinder DR in the alignment microscopes AM1 and AM2 can observe or detect the gaps formed between the exposure areas A7 formed on the substrate P at any time.部等的Mark Ks2.

Here, the exposure device EX is a so-called multi-beam type drawing device. Therefore, in order to appropriately join the plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the drawing units UW1 to UW5 in the Y direction, It is necessary to calibrate the joint accuracy of the multiple drawing units UW1~UW5 within the allowable range. In addition, the relative positions of the observation areas Vw1 to Vw6 of the drawing lines LL1 to LL5 of the drawing lines UW1 to UW5 of the plurality of drawing units UW1 to UW5 must be accurately determined by the reference line management. For this baseline management, calibration is also required.

At least a part of the outer peripheral surface of the rotating cylinder DR of the supporting substrate P must be used in the calibration for confirming the joint accuracy of the plurality of drawing units UW1 to UW5, and the calibration for managing the reference lines of the alignment microscopes AM1 and AM2. Set fiducial marks or fiducial patterns. Therefore, as shown in FIG. 10, in the exposure device EX, a rotating cylinder DR provided with a reference mark or a reference pattern on the outer peripheral surface is used.

As shown in FIGS. 3 and 9, scale parts GPa and GPb constituting a part of the rotation position detection mechanism 14 described later are formed on both ends of the outer periphery of the rotary cylinder DR. In addition, the rotating cylinder DR is provided on the inner side of the scale portions GPa and GPb with narrow-width restricting bands CLa and CLb composed of concave grooves or convex edges. The width of the substrate P in the Y direction is set so that the distance between the two restriction bands CLa and CLb in the Y direction is small, and the substrate P is located between the rotating cylinder DR In the outer peripheral surface, the inner region sandwiched by the restricting tapes CLa and CLb is closely supported and supported.

The rotating cylinder DR is provided with a plurality of line patterns RL1 (line pattern) inclined at a relative rotation center line AX2 at +45 degrees on the outer peripheral surface sandwiched by the restriction bands CLa and CLb, and the relative rotation center line AX2 to- A plurality of line patterns RL2 (line patterns) inclined at 45 degrees are grid-shaped reference patterns (which can also be used as reference marks) RMP repeatedly engraved at regular intervals (periods) Pf1 and Pf2. In addition, the width of the line pattern RL1 and the line pattern RL2 is LW.

The reference pattern RMP is a diagonal pattern (inclined grid pattern) that is uniform throughout the body in order to avoid changes in frictional force or tension in the substrate P at the contact portion between the substrate P and the outer peripheral surface of the rotating cylinder DR. In addition, the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be formed in a horizontal and vertical grid pattern parallel to the Y axis and the line pattern RL2 may be formed parallel to the X axis. In addition, it is not necessary for the line patterns RL1 and RL2 to cross at 90 degrees, and the rectangular area enclosed by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 can also be a square (or rectangle) The angle of the other rhombus makes the line patterns RL1 and RL2 intersect.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4 and 9. As shown in FIG. 9, the rotation position detection mechanism 14 optically detects the rotation position of the rotation cylinder DR, and can be applied to an encoder system using, for example, a rotary encoder. The rotation position detection mechanism 14 is provided with a scale part GPa, GPb provided at both ends of the rotary cylinder DR, and a plurality of encoder read heads EN1, EN2, EN3, EN4 facing each of the scale parts GPa, GPb Mobile measuring device. In FIGS. 4 and 9, although only the four encoder read heads EN1, EN2, EN3, and EN4 facing the scale part GPa are shown, the encoder read heads EN1, which are oppositely arranged, are also in the scale part GPb. EN2, EN3, EN4. The rotation position detecting mechanism 14 can detect the displacement of the two ends of the rotating cylinder DR (the slight displacement in the Y direction extending from the rotation center line AX2). YN2, YN3, YN4.

The scales of the scale parts GPa and GPb are respectively formed in a ring shape on the entire outer circumferential surface of the rotating cylinder DR in the circumferential direction. The scale parts GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) on the outer circumferential surface of the rotating cylinder DR, and constitute an incremental scale. Therefore, the scale parts GPa and GPb rotate integrally with the rotating cylinder DR around the rotation center line AX2.

The substrate P is wound inside the scale portions GPa and GPb avoiding both ends of the rotating cylinder DR, that is, inside the restriction tapes CLa and CLb. If a strict arrangement relationship is required, the outer peripheral surface of the scale parts GPa and GPb is set to be the same surface (the same radius from the center line AX2) as the outer peripheral surface of the portion of the substrate P wound around the rotating cylinder DR. In order to achieve this, the outer peripheral surfaces of the scale portions GPa and GPb, and the outer peripheral surface of the substrate winding relative to the rotating cylinder DR, may be made higher in the radial direction than the thickness of the substrate P. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotating cylinder DR can be set to substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial direction position as the drawing surface wound on the substrate P of the rotating cylinder DR, reducing the measurement position and processing position due to rotation Abbe error caused by different radial directions.

The encoder read heads EN1, EN2, EN3, and EN4 are arranged around the scale parts GPa and GPb as viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotating cylinder DR. The encoder heads EN1, EN2, EN3, and EN4 are connected to the control unit 16. The encoder read heads EN1, EN2, EN3, and EN4 project measurement beams toward the scale parts GPa and GPb, and photoelectrically inspect their reflected beams (diffracted light), based on which the circumferential position changes of the corresponding scale parts GPa and GPb are detected A signal (for example, a 2-phase signal with a phase difference of 90 degrees) is output to the control section 16. The control unit 16 performs digital processing by interpolating the detection signal with a counting circuit (not shown), that is, it can measure the angular change of the rotating cylinder DR with a resolution of submicron, that is, measure the circumference of its outer peripheral surface The direction position changes. The control unit 16 may also measure the transfer speed of the substrate P from the angle change of the rotating cylinder DR.

In addition, as shown in FIGS. 4 and 9, the encoder head EN1 is arranged on the set azimuth line Le1. The azimuth line Le1 is set in the XZ plane, and connects the line of the projection area (reading position) on the scale part GPa (GPb) of the measuring beam EN1 of the encoder read head EN1 and the rotation center line AX2. In addition, as described above, the azimuth line Le1 is provided in the XZ plane, and connects the drawing lines LL1, LL3, LL5 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth lines.

Similarly, as shown in FIGS. 4 and 9, the encoder read head EN2 is arranged on the set azimuth line Le2. The azimuth line Le2 is set in the XZ plane, and connects the line of the projection area (reading position) on the scale part GPa (GPb) of the measuring beam EN2 of the encoder read head EN2 and the rotation center line AX2. In addition, as described above, the azimuth line Le2 is provided in the XZ plane, and connects the drawing lines LL2, LL4 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN2 and the rotation center line AX2, and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 are the same azimuth lines.

In addition, as shown in FIGS. 4 and 9, the encoder read head EN3 is arranged on the set azimuth line Le3. The azimuth line Le3 is set in the XZ plane, and connects the measurement light beam pair of the encoder reading head EN3 with the projection area (reading position) on the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le3 is set, tied in the XZ plane, and connected to the alignment microscope. The line between the observation area Vw1 to Vw3 of the substrate AM1 and the rotation center line AX2 of the mirror AM1. It can be seen from the above that the line connecting the reading position of the encoder read head EN3 and the rotation center line AX2 and the line connecting the observation area Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same when viewed in the XZ plane Bearing line.

Similarly, as shown in FIGS. 4 and 9, the encoder read head EN4 is arranged on the set azimuth line Le4. The azimuth line Le4 is set in the XZ plane, and connects the line of the projection area (reading position) on the scale part GPa (GPb) of the measuring beam EN4 of the encoder read head EN4 and the rotation center line AX2. In addition, as described above, the azimuth line Le4 is provided in the XZ plane, and connects the line aligning the observation area Vw4 to Vw6 of the microscope AM2 to the substrate P and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder read head EN4 and the rotation center line AX2 and the line connecting the observation area Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same when viewed in the XZ plane Bearing line.

When the encoder heads EN1, EN2, EN3, and EN4 are set to the orientation (the angular direction in the XZ plane centered on the rotation center line AX2) to the situation indicated by setting the orientation lines Le1, Le2, Le3, and Le4, such as As shown in FIG. 4, a plurality of drawing units UW1 to UW5 and encoder read heads EN1 and EN2 are arranged to set the azimuth lines Le1 and Le2 at an angle ±θ° with respect to the central plane p3. The azimuth line Le1 and the azimuth line Le2 are set so that the encoder read head EN1 and the encoder read head EN2 are in a state of non-interference in space around the scale of the scale part GPa (GPb).

The displacement gauges YN1, YN2, YN3, and YN4 are respectively arranged around the scale part GPa or GPb when viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotating cylinder DR. The displacement meters YN1, YN2, YN3, and YN4 are connected to the control unit 16.

Displacement gauges YN1, YN2, YN3, YN4 can be wound by The drawing surface on the substrate P of the barrel DR performs displacement detection as close to the radial direction as possible to reduce the Abbe error. The displacement meters YN1, YN2, YN3, and YN4 project the measuring beam toward one of the two ends of the rotating cylinder DR, and photoelectrically detect the reflected beam (or diffracted light), according to which the corresponding rotating cylinder DR The detection signal of the position change in the Y direction (the width direction of the substrate P) of both ends is output to the control unit 16. The control unit 16 can digitally process the detection signal with a measuring circuit (counter circuit or interpolation circuit, etc.) not shown, and can measure the Y direction of the rotating cylinder DR (and the substrate P) with submicron resolution The displacement changes. The control unit 16 may also measure the offset rotation of the rotating cylinder DR from the change of one of the two ends of the rotating cylinder DR.

The displacement meters YN1, YN2, YN3, YN4, although only one of the four is sufficient, but in order to measure the offset rotation of the rotating cylinder DR, etc., as long as there are more than three of the four, you can grasp the rotation circle One of the two ends of the barrel DR moves (dynamic tilt change, etc.). Furthermore, if the mark or pattern on the measurement substrate P (or the mark on the rotating cylinder DR, etc.) fixed by the control unit 16 to the alignment microscopes AM1, AM2 can be omitted, the displacement meters YN1, YN2, YN3, YN4 can also be omitted .

Here, the control unit 16 detects the rotation angle positions of the scale parts (rotating cylinder DR) GPa and GPb with the encoder heads EN1 and EN2, and performs drawing units using odd and even numbers according to the detected rotation angle positions Description of UW1~UW5. In other words, the control unit 16 performs the ON/OFF modulation of the optical deflector 81 according to the CAD information of the pattern to be drawn on the substrate P during the scanning of the drawing beam LB projected on the substrate P in the scanning direction, but also The timing of the ON/OFF modulation using the optical deflector 81 can be performed according to the detected rotation angle position, that is, the pattern can be drawn with good accuracy on the photosensitive layer of the substrate P.

In addition, the control unit 16 can detect the microscopes AM1 and AM2 by storing When the alignment marks Ks1~Ks3 on the substrate P are used, the alignment angles Ks1~ on the substrate P can be obtained by the rotational angle positions of the scale parts GPa and GPb (rotating cylinder DR) detected by the encoder heads EN3 and EN4. Correspondence between the position of Ks3 and the rotation angle position of the rotating cylinder DR. Similarly, the control unit 16 stores the scale parts GPa and GPb (rotating cylinder DR) detected by the encoder heads EN3 and EN4 by storing the reference patterns RMP on the rotating cylinder DR with the alignment microscopes AM1 and AM2. For the rotation angle position, the correspondence between the position of the reference pattern RMP on the rotation cylinder DR and the rotation angle position of the rotation cylinder DR can be obtained. As described above, by aligning the microscopes AM1 and AM2, the rotation angle position (or circumferential position) of the rotating cylinder DR at the moment when the mark is sampled in the observation area Vw1 to Vw6 can be accurately measured. In the exposure device EX, that is, based on this measurement result, the alignment (alignment) of the substrate P and the predetermined pattern drawn on the substrate P, or the calibration of the rotating cylinder DR and the drawing device 11 is performed.

In addition, the actual sampling is at the rotation angle position of the rotary cylinder DR measured with the encoder heads EN3 and EN4, and becomes the position roughly the mark on the substrate P or the reference pattern RMP on the rotary cylinder DR that is roughly known in advance. At the corresponding angular position, the image information output from each of the photographing systems GD of the alignment microscopes AM1 and AM2 is written into the image memory at high speed. That is, the image angle information output from each photography system GD is sampled using the rotation angle position of the rotating cylinder DR measured by the encoder read heads EN3 and EN4 as a trigger. In addition, unlike this, there are also pulses in response to clock signals of a certain frequency. The rotational angle position (counted measured value) of the rotating cylinder DR measured with the encoder read heads EN3 and EN4 and the GD from each photography department The method of sampling the output image information at the same time.

In addition, the mark on the substrate P and the reference pattern RMP on the rotating cylinder DR are moved in one direction relative to the observation areas Vw1 to Vw6, and are output from each imaging system GD When sampling image information, it is better to use a CCD or CMOS photography element with a faster shutter speed. Following this, the brightness of the illumination light in the illumination observation areas Vw1~Vw6 must also be improved. As the illumination light source for the microscopes AM1 and AM2, flash lamps or high-brightness LEDs can also be considered.

FIG. 11 is an explanatory diagram showing the positional relationship between drawing lines and drawing patterns on a substrate. The drawing units UW1 to UW5 scan the spot light of the drawing light beam LB along the drawing lines LL1 to LL5, thereby drawing the patterns PT1 to PT5. The drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start ends PTa of the patterns PT1 to PT5. The drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 are drawing terminals PTb of the patterns PT1 to PT5.

The drawing start point PTa of the pattern PT1, the drawing terminal PTb of the drawing terminal PTb, and the drawing terminal PTb of the pattern PT2 are joined. Similarly, the drawing start point PTa of the pattern PT2 is joined to the drawing start point PTa of the pattern PT3, the drawing end PTb of the pattern PT3 is joined to the drawing end PTb of the pattern PT4, and the drawing start PTA of the pattern PT4 is joined to the drawing start PTA of the pattern PT5. In this way, the patterns PT1 to PT5 drawn on the substrate P are bonded to each other in the width direction of the substrate P as the substrate P moves in the longitudinal direction, and an element pattern is drawn on the entire exposure area A7.

FIG. 12 is an explanatory diagram showing the relationship between the spot light of the drawing beam and the drawing line. Among the drawing units UW1 to UW5, the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 are representatively described. Since the drawing lines LL3 to LL5 of the drawing units UW3 to UW5 are also the same, their description is omitted. By rotating the polygon mirror 97 at a constant speed, the spot light SP of the drawing beam LB follows the drawing lines LL1 and LL2 on the substrate P, scanning the drawing from the drawing start position OC1, OC2 to the drawing end position EC1, EC2 The length of the line LBL.

In general, in the direct drawing exposure method, even when the device is drawing the smallest size pattern that can be exposed, multiple exposures (multiple writing) of multiple spot lights SP are used to achieve High precision and stable pattern depiction. As shown in FIG. 12, on the drawing lines LL1 and LL2, when the effective diameter of the spot light SP is Xs, since the drawing beam LB is pulsed light, a point generated by one pulsed light (picosecond luminescence time) The light SP and the spot light SP generated by the next pulse light are scanned in such a manner that the distance CXs of the diameter Xs overlaps in the Y direction (main scanning direction) by about 1/2.

At the same time as the main scanning of the spot light SP along the drawing lines LL1 and LL2, the substrate P is transported in the +X direction at a certain speed, so the drawing lines LL1 and LL2 move on the substrate P in the X direction at a certain pitch ( Subscanning). The distance here is also set to about 1/2 the distance CXs of the diameter Xs of the spot light SP, but it is not limited thereto. According to this, in the sub-scanning direction (X direction), the spot lights SP adjacent in the X direction with a distance CXs of 1/2 of the diameter Xs (or an overlapping distance other than that is also possible) are overlapped and exposed to each other. Further, the beam spot light SP emitted at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP emitted at the drawing end position EC2 of the drawing line LL2 move with the substrate P in the long direction (ie (Sub-scanning) Set the drawing start position OC1 and the drawing end position EC1 of the drawing line LL1 and the drawing start position OC2 and the drawing end position EC2 of the drawing line LL1 in the width direction (Y direction) of the substrate P with the overlapping distance CXs .

For example, when the effective diameter Xs of the beam spot light SP is 4 μm, a total of 4 spot lights arranged in two columns × 2 rows of spot light SP (overlaid in two directions of main scanning and sub-scanning) can be well exposed ) The area occupied, or the pattern with the smallest area of 3 columns × 3 rows (a total of 9 spot lights arranged overlapping in both directions of the main scan and the sub-scan), that is, the minimum size is about 6μm~8μm Line width pattern. In addition, when the reflecting surface 97b of the rotating polygonal mirror 97 is 10, and the rotation speed of the rotating polygonal mirror 97 around the rotation axis 97a is 10,000 rpm or more, The number of scans of the spot light SP (drawing light beam LB) on the drawing lines (LL1 to LL5) by rotating the polygon mirror 97 (assuming the scanning frequency Fms) can be 1666.66...Hz or more. This represents a pattern that can draw more than 1666 drawing lines on the substrate P in the transport direction (X direction) every 1 second. Therefore, if the transport distance (transport speed) of the substrate P per second becomes slower, the overlapping distance CXs of the spot lights in the sub-scanning direction (X direction) can be set to a value of 1/2 or less of the diameter Xs of the spot light, For example, 1/3, 1/4, 1/5, ..., in this case, the same drawing pattern is exposed by multiple scanning of the spot light along the drawing line, which can increase the exposure amount of the photosensitive layer given to the substrate P .

In addition, when the transport speed of the substrate P driven by the rotation of the rotating cylinder DR is about 5 mm/s, the X direction (the transport direction of the substrate P) of the drawing line LL1 (the same is true for LL2 to LL5) shown in FIG. 12 ) The distance (distance CXs) is about 3 μm.

In the case of this embodiment, the resolution R of the pattern drawing in the main scanning direction (Y direction) is composed of the effective diameter Xs of the spot light SP and the scanning frequency Fms, and the acousto-optical element (AOM) constituting the optical deflector 81 ON/OFF minimum switching time is determined. As an acousto-optic device (AOM), when the highest response frequency Fss=50MHz is used, the time between the ON state and the OFF state can be set to about 20nS. Furthermore, since the effective scanning period of the drawing light beam LB by rotating one reflecting surface 97b of the polygon mirror 97 (point light scanning divided by the length of the drawing line LBL) is 1/1/rotation angle of one reflecting surface 97b 3 degree, so when the length of the drawing line LBL is set to 30mm, the resolution R determined by the switching time of the optical deflector 81 is R=LBL/(1/3)/(1/Fms)× (1/Fss)≒3μm.

From this relationship, in order to improve the resolution ability R of pattern drawing, for example, as the acousto-optic element (AOM) of the optical deflector 81, the highest response frequency Fss is 100 MHz, and the ON/OFF switching time is set to 10 nsec. According to this, the decomposition ability R becomes half 1.5μm. In this case, the transfer speed of the substrate P by the rotation of the rotating cylinder DR is half. As another method of improving the resolution capability R, for example, the rotation speed of the rotating polygon mirror 97 can also be increased.

In general, the photoresist used in the lithography process uses a photoresist sensitivity Sr of about 30mj/cm ² . Let the transmittance △Ts of the optical system be 0.5 (50%), the effective scanning period in one reflective surface 97b of the rotating polygon mirror 97 is about 1/3, the length of the drawing line LBL is 30 mm, and the drawing unit UW1~ If the number NuW of UW5 is 5, and the transfer speed Vp of the substrate P of the rotating cylinder DR is 5 mm/s (300 mm/min), the laser power Pw required by the light source device CNT can be estimated by the sub-form.

Pw=30/60×3×30×5/0.5/(1/3)=1350mW

It is assumed that when there are seven drawing units, the laser power Pw required by the light source device CNT is as follows.

Pw=30/60×3×30×7/0.5/(1/3)=1890mW

For example, if the photoresist sensitivity is about 80 mj/cm ² , in order to perform exposure at the same speed, a light source device CNT of about 3 to 5 W is required as the beam output. Instead of using such a high-power light source, if the transport speed Vp of the substrate P by the rotation of the rotating cylinder DR is reduced to 30/80 relative to the initial value of 5 mm/s, it can also be used as a beam output of 1.4~1.9W The light source device for exposure.

Furthermore, if the length LBL of the drawing line is 30 mm, and it is assumed that the spot diameter SP of the beam spot light Xs and the resolution capability determined by the light switching of the acousto-optic element (AOM) of the optical deflector 81 (the minimum grid for specifying the beam position) (grid), equivalent to 1 pixel) Xg is equal, when both are 3 μm, the rotation speed of the rotating polygon mirror 97 when the rotation speed of the 10 rotating polygon mirror 97 is 10,000 rpm is 3/500 seconds. Effective scanning period of mirror 97-1 one reflecting surface 97b When the time is one-third of the rotation angle of one reflecting surface 97b, the effective scanning time Ts (second) of one reflecting surface 97b can be obtained by (3/500)×(1/10)×(1/3) Out, about Ts = 1/5000 (seconds). According to this, the light source device CNT is the pulse emission frequency Fz during pulse laser, that is, Fz=LBL/(Ts‧Xs) can be obtained, and Fz=50MHz is the lowest frequency. Therefore, in the embodiment, the light source device CNT that needs to output a pulsed laser with a frequency of 50 MHz or more is required. In view of this, the light emission frequency Fz of the light source device CNT is preferably more than twice (for example, 100 MHz) the highest response frequency Fss (for example, 50 MHz) of the acousto-optic element (AOM) of the optical deflector 81.

Further, the driving signal for switching the acousto-optic element (AOM) of the optical deflector 81 to the ON state/OFF state is to avoid the transition of the acousto-optic element (AOM) from the ON state to the OFF state, or from the OFF state to the Pulse light emission is generated during the ON state, and it is preferable to perform control to synchronize the light source device CNT with the clock signal oscillating at the pulse light emission frequency Fz.

Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse emission frequency Fz of the light source device CNT will be described using the graph of FIG. 13 from the viewpoint of the beam shape (intensity distribution of two overlapping spot lights SP). The horizontal axis of FIG. 13 represents the drawing position of the spot light SP in the Y direction along the drawing line, or the X direction along the transport direction of the substrate P, or the size of the spot light SP, and the vertical axis represents the peak value of the individual spot light SP The intensity is normalized to a relative intensity value of 1.0. In addition, here, it is assumed that the intensity distribution of the individual spot light SP is J1, and the Gaussian distribution is assumed.

In FIG. 13, the intensity distribution J1 of the single spot light SP is assumed to have a diameter of 3 μm relative to the peak intensity at an intensity of 1/e ² . The intensity distributions J2~J6 show the simulation results of the integrated intensity distribution (contour) obtained on the substrate P when the two pulses of this spot light SP are irradiated at different positions in the main scanning direction or the sub-scanning direction. The difference in position (separation distance) is different.

In the graph of FIG. 13, the intensity distribution J5 shows the case where the two-pulse point light SP is staggered by the same spacing distance as the diameter of 3 μm, and the intensity distribution J4 is the case where the two-pulse point light SP has a spacing distance of 2.25 μm. The distribution J3 is a case where the separation distance of the spot light SP of 2 pulses is 1.5 μm. From the change of the intensity distribution J3~J5, it can be clearly seen that when the intensity distribution J5, the spot light SP with a diameter of 3 μm is irradiated at an interval of 3 μm, the accumulated contour is the highest tumor shape at the center of each of the two spot lights At the midpoint of the two spot lights, the normalized intensity can only be obtained at about 0.3. On the other hand, the contour accumulated when spot light SP with a diameter of 3 μm is irradiated at an interval of 1.5 μm is clearly distributed in the contour, and the position of the point between the two spot lights is substantially flat.

In addition, in FIG. 13, the intensity distribution J2 shows the integrated profile when the separation distance of the two-pulse point light SP is set to 0.75 μm, and the intensity distribution J6 sets the separation distance to half of the intensity distribution J1 of the single point light SP The value of full width (FWHM) is 1.78 μm.

As described above, when the pulse oscillation of two spot lights is irradiated at a shorter interval distance CXs than the diameter Xs of the spot light SP, the two nodules are likely to appear prominently, so it is best to set it to The optimal separation distance without uneven intensity (deterioration of drawing accuracy) during exposure. As shown in the intensity distribution J3 or J6 of FIG. 13, it is better to overlap the separation distance CXs at a half degree (for example, 40 to 60%) of the diameter Xs of the single spot light SP. This optimal separation distance CXs can be adjusted in the main scanning direction by adjusting the pulse emission frequency Fz of the light source device CNT and the scanning speed or scanning time Ts (rotation speed of the rotating polygon mirror 97) of the spot light SP along the drawing line It can be set by at least one. In the sub-scanning direction, it can be adjusted by at least one of the scanning frequency Fms (rotation speed of the rotating polygon mirror 97) of the drawing line and the moving speed of the substrate P in the X direction Be set.

For example, when the absolute value of the rotation speed of the rotating polygonal mirror 97 (scanning time Ts of the spot light) cannot be adjusted with high accuracy, the spot light in the main scanning direction can be adjusted by finely adjusting the pulse emission frequency Fz of the light source device CNT The ratio of the spacing distance CXs of SP to the diameter Xs (size) of spot light is adjusted to the optimal range.

As described above, when two spot lights SP are superimposed in the scanning direction, that is, when Xs>CXs, the light source device CNT sets the pulse emission frequency Fz to the relationship of Fz>LBL/(Ts‧Xs), which satisfies Fz=LBL/(Ts‧CXs) relationship. For example, when the pulsed light emission frequency Fz of the light source device CNT is 100 MHz, when the rotating polygon mirror 97 is set to 10 and rotates at 10,000 rpm, the effect of spot light specified by 1/e ² or full width at half maximum (FWHM) The diameter Xs is 3 μm, and the pulsed laser beam (spot light) from each drawing unit UW1 to UW5 can be irradiated on each drawing line LL1 to LL5 at an interval of 1.5 μm (CXs) about half of the diameter Xs. According to this, the uniformity of the exposure amount during pattern drawing is improved, and even a fine pattern can obtain a faithful exposure image (photoresist image) based on drawing data to achieve high-precision drawing.

Furthermore, the resolution (the highest response frequency Fss) determined by the light switching speed of the acousto-optic device (AOM) and the pulse oscillation frequency Fz of the light source device CNT, if h is set to any integer, it must be converted to position or time The integer multiple relationship must be Fz=h‧Fss relationship. This is because in order to avoid the timing of the light switching of the acousto-optic element (AOM), ON/OFF is performed while the pulsed light beam is emitted from the light source device CNT.

The exposure apparatus EX of the first embodiment is a light source device CNT using a pulsed laser light source that combines the optical fiber amplifiers FB1, FB2 and the wavelength conversion element of the wavelength conversion unit CU2, so it is in the ultraviolet wavelength band (400-300 nm) , Easily get this kind of Pulsed light with high oscillation frequency.

In addition, the light switching of the acousto-optical element (AOM) is based on dividing the pattern to be drawn into pixel units of, for example, 3 μm×3 μm, with “0” and “1” indicating whether each pixel unit is irradiated with the spot light of the pulse beam Meta-row (depicting data). When the length of the drawn line LBL is 30mm, the number of pixels in one scan of spot light becomes 10,000 pixels, and the acousto-optical element (AOM) has the responsiveness of switching the bit row of 10,000 pixels during the scanning time Ts ( Response frequency Fss). On the other hand, the adjacent spot lights in the main scanning direction set the pulse oscillation frequency Fz so as to overlap about 1/2 of the diameter Xs, for example. Therefore, in the above relational formula Fz=h‧Fss, the relationship between the pulse oscillation frequency Fz and the response frequency Fss of the optical switching of the acousto-optic device (AOM) is preferably set with the integer h being 2 or more, that is, Fz>Fss.

Next, the adjustment method of the drawing device 11 of the exposure device EX will be described. FIG. 14 is a flowchart of the adjustment method of the exposure apparatus according to the first embodiment. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating cylinder and the drawn line. 16 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a bright field of view. The control unit 16 rotates the rotating cylinder DR as shown in FIG. 15 in order to perform calibration for grasping the positional relationship of the plurality of drawing units UW1 to UW5. By rotating the cylinder DR, the light-transmissive substrate P depicting the penetration degree of the light beam LB can be transported.

As described above, the reference pattern RMP is integrated with the outer peripheral surface of the rotating cylinder DR. As shown in FIG. 15, among the reference patterns RMP, an arbitrary reference pattern RMP1 moves as the outer peripheral surface of the rotating cylinder DR moves. Therefore, the reference pattern RMP1 passes through the drawing lines LL2, LL4 after passing through the drawing lines LL1, LL3, LL5. For example, when the same reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5, the control unit 16 draws the drawing units UW1, UW3, and UW5. Beam LB scanning. The control unit 16 scans the drawing beam LB of the drawing units UW2 and UW4 when the same reference pattern RMP1 passes through the drawing lines LL2 and LL4 (step S1). Therefore, the reference pattern RMP1 becomes a reference for grasping the positional relationship of the drawing units UW1 to UW5.

The photoelectric sensor 31Cs (FIG. 4) of the calibration detection system 31 described above detects the reflected light from the reference pattern RMP1 through the scanning optical system including the f-θ lens system 85 and the scanner 83. The photoelectric sensor 31Cs is connected to the control unit 16, and the control unit 16 detects the detection signal of the photoelectric sensor 31Cs (step S2). For example, each of the drawing units UW1 to UW5 draws one line LL1 to LL5, and scans each of the plurality of drawing beams LB in a predetermined scanning direction in a plurality of lines.

For example, as shown in FIG. 16, the drawing units UW1 to UW5 perform the drawing line length LBL from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR (see The first line of Fig. 12) scans SC1. Next, the drawing units UW1 to UW5 perform the second drawing of the drawing line length LBL (see FIG. 12) from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR. Line scan SC2. Next, the drawing units UW1 to UW5 perform the third step of the drawing line length LBL (see FIG. 12) from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR. Line scan SC3.

The rotating cylinder DR rotates around the rotation center line AX2, so the first row scan SC1, the second row scan SC2, and the third row scan SC3 have a difference of △P1 and △P2 in the X direction on the reference pattern RMP1 . In addition, the control unit 16 may perform scanning of the drawing beam LB along the first line scan SC1 while the rotating cylinder DR is stationary, and then, after rotating the rotating cylinder DR by ΔP1 minutes, stand still and perform Scan the drawing beam LB of SC2 along the second line, and then rotate the rotating cylinder DR again by △P2 and then stand still to perform the scan along the third line SC3 is a program for scanning the drawing beam LB and operating each part in this order.

As described above, the reference pattern RMP is set such that the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 formed on the outer circumferential surface of the rotating cylinder DR intersect each other, which is smaller than the length LBL of the drawing line. Therefore, when the drawing beam LB of the first line scan SC1, the second line scan SC2, and the third line scan SC3 is projected, the drawing beam LB is irradiated to at least the intersections Cr1 and Cr2. The line patterns RL1 and RL2 are formed on the surface of the rotating cylinder DR with irregularities. When the amount of unevenness on the surface of the rotating cylinder DR is set as a specific condition, the reflected light generated when the drawing light beam LB is projected on the line patterns RL1 and RL2 may partially cause a difference in reflection intensity. For example, as shown in FIG. 16, when the line patterns RL1 and RL2 rotate the concave portion on the surface of the cylinder DR, when the drawing beam LB is projected on the line patterns RL1 and RL2, the reflected light reflected on the line patterns RL1 and RL2 is affected by the photoinductor The detector 31Cs receives light in a bright field.

The control unit 16 detects the edge position psc1 of the reference pattern RMP based on the output signal from the photoelectric sensor 31Cs. For example, the control unit 16 stores the intermediate value mpsc1 of the scanning position data Dsc1 of the first line and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs when scanning the SC1 of the first line.

Next, the control unit 16 stores the intermediate value mpsc1 of the scanning position data Dsc2 of the second line and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs when scanning the SC2 of the second line. In addition, the control unit 16 stores the intermediate value mpsc1 of the scanning position data Dsc3 of the third line and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs when scanning the SC3 of the third line.

The control unit 16 scans the position data Dsc1 of the first line, the scan position data Dsc2 of the second line, the scan position data Dsc3 of the third line, and the edge positions of the plurality of reference patterns RMP The intermediate value mpsc1 of psc1 is calculated by calculation to obtain the coordinate position of the intersection point Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other. As a result, the control unit 16 may also calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other and the drawing start position OC1. The same is true for the other drawing units UW2 to 5, and the control unit 16 can calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other and the drawing start positions OC2 to OC5 (see FIG. 11). In addition, the intermediate value mpsc1 can also be obtained from the peak value of the signal output from the photoelectric sensor 31Cs.

In the above, the case where the reflected light reflected by the line patterns RL1 and RL2 is received by the photoelectric sensor 31Cs in a bright field of view has been described, but the photoelectric sensor 31Cs may also reflect the reflected light reflected by the line patterns RL1 and RL2 in the dark The field of vision is exposed to light. FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a dark field. 18 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating cylinder in a dark field. As shown in FIG. 17, in the calibration and detection system 31, a light shielding member 31 f having a ring-shaped light transmitting portion is arranged between the relay lens 94 and the photoelectric sensor 31Cs. Therefore, the photoelectric sensor 31Cs receives edge scattered light or diffracted light among the reflected lights reflected by the line patterns RL1 and RL2. For example, as shown in FIG. 18, when the line patterns RL1 and RL2 rotate the concave portion on the surface of the cylinder DR, when the drawing beam LB is projected on the line patterns RL1 and RL2, the photoelectric sensor 31Cs is about to reflect on the line patterns RL1 and RL2 Reflected light is received in the dark field.

The control unit 16 detects the edge position pscd1 of the reference pattern RMP based on the signal output from the photoelectric sensor 31Cs. For example, the control unit 16 stores the intermediate value mpscd1 of the scan position data Dsc1 of the first line and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the scan of the first line SC1. Secondly, the control unit 16 according to the second The output signal obtained from the photoelectric sensor 31Cs during the horizontal scan SC2 stores the intermediate value mpscd1 of the scan position data Dsc2 of the second line and the edge position pscd1 of the reference pattern RMP. The control unit 16 stores the intermediate value mpscd1 of the scanning position data Dsc3 of the third line and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs when scanning the SC3 of the third line.

The control unit 16 calculates the intersection between the scan position data Dsc1 of the first line, the scan position data Dsc2 of the second line and the scan position data Dsc3 of the third line, and the intermediate value mpscd1 of the edge positions pscd1 of the plurality of reference patterns RMP through calculation The intersections Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 calculates the relationship between the coordinate positions of the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other and the drawing start position OC1 through calculation.

The same is true for the other drawing units UW2 to 5, the control unit 16 can calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other and the drawing start positions OC2 to OC5. As described above, when the reflected light reflected by the line patterns RL1 and RL2 is received by the photoelectric sensor 31Cs in the dark field, the accuracy of the edge positions pscd1 of the plurality of reference patterns RMP can be improved.

As shown in FIG. 14, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other from the detection signal detected in step S2 (step S3). FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder. FIG. 20 is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawing lines. As described above, the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged. As shown in FIG. 19, the first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 Each, the reference distance PL between the detected intersection points Cr1 is stored in the control in advance 制部16。 16. Department 16. Similarly, for each of the second drawing line LL2 and the fourth drawing line LL4, the reference distance PL between the detected intersection points Cr1 is also stored in the control unit 16 in advance. In addition, for each of the second drawing line LL2 and the third drawing line LL3, the reference distance ΔPL between the detected intersection points Cr1 is also stored in the control unit 16 in advance. Further, for each of the fourth drawing line LL4 and the fifth drawing line LL5, the detected reference distance ΔPL between the intersection points Cr1 is also stored in the control unit 16 in advance.

For example, as shown in FIG. 20, the control unit 16 has grasped the positional relationship of the drawing start position OC1 of the first drawing line LL1 based on the signal from the origin detector 98 (refer to FIG. 7), so the intersection point Cr1 can be obtained The distance BL1 from the drawing start position OC1. Furthermore, the control unit 16 has detected the position of the drawing start position OC3 of the third drawing line LL3 by the origin detector 98, and therefore can obtain the distance BL3 between the intersection point Cr1 and the drawing start position OC3. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3, and the reference distance PL, and store the origin between the origins of the drawing beams LB scanned along the drawing lines LL1, LL3 The distance △OC13. Similarly, since the control unit 16 has detected the position of the drawing start position OC5 of the fifth drawing line LL5 by the origin detector 98, the distance BL5 between the intersection point Cr1 and the drawing start position OC5 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5, and the reference distance PL, and store the origin between the origins of the drawing beams LB scanned along the drawing lines LL3, LL5 The distance △OC35.

Since the control unit 16 has detected the position of the drawing start position OC2 of the second drawing line LL2 by the origin detector 98, the distance BL2 between the intersection point Cr1 and the drawing start position OC2 can be obtained. In addition, the control unit 16 has detected the position of the drawing start position OC4 of the fourth drawing line LL4 by the origin detector 98, so the distance between the intersection point Cr1 and the drawing start position OC4 can be obtained BL4. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and store the origin between the origins of the drawing beams LB scanned along the drawing lines LL2, LL4 The distance △OC24.

In addition, the control unit 16 can easily store the origin between the origins of the drawing beams LB scanned along the drawing lines LL1 and LL2 because the drawing start position OC1 and the drawing start position OC2 are positions obtained through the same reference pattern RMP1 as described above. The distance between points is △OC12. As described above, the exposure device EX can obtain the positional relationship between the origins (drawing start points) of each of the plurality of drawing units UW1 to UW5.

Furthermore, the control unit 16 can detect the joint error between the drawing start position OC2 and the drawing start position OC3 from the reference distance ΔPL between the intersection point Cr1 detected between the second drawing line LL2 and the third drawing line LL3. Furthermore, the joint error between the drawing start position OC4 and the drawing start position OC5 can be detected from the reference distance ΔPL between the intersection point Cr1 detected at the fourth drawing line LL4 and the fifth drawing line LL5.

Two intersections Cr1 and Cr2 are detected during the period from the drawing start position OC1 to OC5 of each drawing line LL1 to LL5 to the drawing end position EC1 to EC5. According to this, it is possible to detect the scanning direction from the drawing start position OC1 to OC5 to the drawing end position EC1 to EC5. As a result, the control unit 16 can detect the angle error of each drawing line LL1 to LL5 with respect to the direction (Y direction) along the center line AX2.

The control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other for the reference pattern RMP1. The reference pattern RMP including the reference pattern RMP1 is a grid-shaped reference pattern repeatedly engraved at certain intervals (periods) Pf1 and Pf2. Therefore, the control unit 16 is based on the basis repeated at each pitch Pf1, Pf2 The quasi-pattern RMP obtains the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1~LL5 or the configuration error of each other, and calculates the information related to the deviation of the relative positional relationship of the plurality of drawing lines LL1~LL5. As a result, the control unit 16 can further improve the accuracy of the adjustment information (calibration information) corresponding to the arrangement states of the plurality of drawing lines LL1 to LL5 or the arrangement errors of each other.

Next, as shown in FIG. 14, the control unit 16 performs a process of adjusting the drawing state (step S4). The control unit 16, according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1~LL5 or the arrangement error of each other and the scale part (rotating cylinder DR) GPa, GPb detected by the encoder read heads EN1, EN2 Adjust the drawing position of the odd-numbered and even-numbered drawing units UW1~UW5. The encoder heads EN1 and EN2 can detect the transport amount of the substrate P based on the scale part (rotating cylinder DR) GPa and GPb.

FIG. 21 is an explanatory diagram schematically showing the relationship between the moving distance per unit time of the substrate and the number of drawing lines included in the moving distance, as in the previous FIG. 12. As shown in FIG. 21, the encoder read heads EN1 and EN2 can detect and store the moving distance ΔX of the substrate P per unit time. In addition, a plurality of alignment marks Ks1 to Ks3 may be sequentially detected by the alignment microscopes AM1 and AM2 to obtain and store the moving distance ΔX.

The moving distance ΔX per unit time of the substrate P is drawn by the drawing unit UW1. The drawing lines LL1 are drawn by the beam lines SPL1, SPL2, and SPL3 of the beam spot light SP, and the spot diameter Xs of each beam spot light SP Scan about 1/2 of the X direction (and Y direction) overlapping. Similarly, the beam spot light SP on the drawing terminal PTb side of the drawing line LL1 and the beam spot light SP on the drawing terminal PTb side of the drawing line LL2 are superimposed in the width direction of the substrate P as the substrate P moves in the longitudinal direction to overlap Distance CXs are engaged.

For example, when the rotating cylinder DR moves up and down, the X-direction drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are shifted, which may cause a magnification difference in the X direction, for example. The control unit 16 reduces the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 when the transfer speed (moving speed) of the substrate P transferred by the rotating cylinder DR is slow, and the adjustable drawing magnification in the X direction becomes small. Conversely, when the transfer speed (moving speed) of the substrate P transferred by the rotating cylinder DR is increased, the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 becomes larger, and the adjustable drawing magnification in the X direction becomes larger. The drawing line LL1 has been described above with reference to FIG. 21, and the other drawing lines LL2 to LL5 are the same. The control unit 16, according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1~LL5 or the arrangement error of each other and the scale part (rotating cylinder DR) GPa, GPb detected by the encoder read heads EN1, EN2 The position of the rotation angle changes the relationship between the movement distance ΔX of the substrate P in the longitudinal direction of the substrate P per unit time and the number of beam lines SPL1, SPL2, and SPL3 contained in the movement distance. Therefore, the control unit 16 can adjust the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 in the X direction.

FIG. 22 is an explanatory diagram schematically illustrating pulse light that emits light in synchronization with the system clock of the pulse light source. Hereinafter, the drawing line LL2 will also be described with reference to FIG. 21, and the same applies to the drawing lines LL1, LL3 to LL5. The light source device CNT can strike the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval △wp (=1/Fz) of the pulse signal wp also changes. This temporal pulse interval Δwp corresponds to the interval CXs in the main scanning direction of the spot light SP of each pulse on the drawing line LL2. The control unit 16 causes the beam spot light SP of the drawing light beam LB to scan the length LBL of the drawing line along the drawing line LL2 on the substrate P.

The control unit 16 has a function of partially changing the period of the system clock SQ during the scanning of the drawing light beam LB along the drawing line LL2 so that the pulse interval Δwp decreases at any position in the drawing line LL2. For example, when the original system clock SQ is 100 MHz, the control unit 16 changes the system clock SQ to, for example, 101 MHz (or 99 MHz) at a fixed time interval (period) during the scanning of the length LBL of the drawing line. As a result, the number of beam spot lights SP in the length LBL of the drawn line decreases. In other words, the control unit 16 reduces the operating ratio of the system clock SQ at a predetermined number (one or more) of the period interval during the scanning of the drawing line length LBL. According to this, the interval of the beam spot light SP generated by the light source CNT, that is, the variation point of the change pulse interval Δwp, the overlapping distance CXs of the beam spot lights SP varies. The distance between the drawing start point PTa and the drawing end PTb in the Y direction seems to expand and contract.

As an example, when the length LBL of the drawing line is 30 mm, it is divided into 11 equal parts, and the drawing interval (cycle interval) of about 3 mm each decreases the pulse interval Δwp of the system clock SQ at only one location. The amount of decrease in the pulse interval △wp, as illustrated in FIG. 13, if it will not incur a large range of the cumulative profile (intensity distribution) with the change of the distance CXs between the two adjacent spot lights SP, for example, the reference When the separation distance CSx is set to 50% of the diameter Xs (3 μm) of the spot light, it is about ±15% relative to it. If the increase of the pulse interval △wp is reduced to +10% (the separation distance CSx is 60% of the diameter Xs of the spot light), at each of the 10 discrete points in the trace line of the length LBL, 1 pulse of spot light A position shift of 10% of the diameter Xs extending in the main scanning direction will occur. As a result, the length LBL of the drawn line after drawing becomes 3 μm longer than 30 mm. This means that the pattern drawn on the substrate P expands by 0.01% (100 ppm) in the Y direction. According to this, even when the substrate P expands and contracts in the Y direction, exposure can be performed in response to the drawing pattern being expanded and contracted in the Y direction.

Set the position of the increasing and decreasing pulse interval △wp, for example, to be able to scan once in the drawing line LL1~LL5, for example, preset to any value of every 100 pulses, every 200 pulses, ‧‧‧ of the system clock SQ constitute. In this way, the amount of expansion and contraction in the main scanning direction (Y direction) of the drawn pattern can be changed within a relatively large range, and the magnification correction can be dynamically performed in response to the expansion and contraction of the substrate P. Therefore, the control unit 16 of the exposure apparatus EX of this embodiment includes a generation circuit of the system clock SQ, and the generation circuit has a clock oscillation part generated by the system clock SQ with a pulse interval Δwp of a certain original clock signal And a time shifting section that reduces the time until the next clock pulse of the system clock SQ is generated relative to the pulse interval △wp after inputting the preset pulse number of the original clock signal count (minute). In addition, the number of parts of the drawing line (length LBL) that decreases the pulse interval Δwp of the system clock SQ is roughly determined by the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn. It is at least one of the scanning time Ts of the spot light SP corresponding to the length LBL.

FIG. 23 shows an example of a clock generation circuit that partially changes the pulse interval Δwp of the system clock SQ. In FIG. 23, a basic clock signal CKL having the same frequency as the system clock SQ is output from the clock oscillation unit 200. The basic clock signal CKL is applied to a delay circuit 202 that generates a system clock SQ by adding a predetermined delay time Td to each pulse of the basic clock signal CKL, and the output increases the frequency of the basic clock signal CKL by, for example, a 20-fold increase The multiplier circuit 204 of the clock multiplier signal CKs.

The delay circuit 202 has a counter inside which counts the number of pulses of the doubled clock signal CKs to a predetermined value ΔNs. The period during which the counter counts the predetermined value ΔNs corresponds to the delay time Td. The predetermined value ΔNs is set by the preset circuit 206. The preset circuit 206 internally has a standard value Ns ₀ as an initial value of a predetermined value ΔNs, and transmits the preset value Dsb (value corresponding to the change amount ΔTd of the delay time Td) from the outside (main CPU, etc.) , Overwrite the new set value △Ns to the previous set value △Ns+Dsb.

This overwriting is performed in response to the completion pulse signal b from the counter circuit 208 that counts the pulses of the system clock SQ output from the delay circuit 202. The counter circuit 208 has a structure that counts the number of pulses of the system clock SQ to a preset value Dsa and outputs the completed pulse signal b, resets the count value to zero and repeats the pulses of the system clock SQ again Count. Although the preset value Dsa is the number Nck of pulses of spot light corresponding to a length LBL/N corresponding to the length LBL of the drawn line divided by N, it does not necessarily need to correspond to the length LBL/N, and may be any value. The delay circuit 202, the preset circuit 206, and the counter circuit 208 constitute a time offset unit.

FIG. 24 is a timing diagram showing the time transition of the signals of each part in the circuit configuration of FIG. In the preset circuit 206, a standard value Ns ₀ as an initial value is set, and the predetermined value ΔNs added to the delay circuit 202 by the facility is the standard value Ns ₀ . Before the counter circuit 208 counts to the set pulse number Nck, that is, the state before the completion of the pulse signal b generation, the predetermined value ΔNs from the preset circuit 206 is Ns0, and the delay circuit 202, as shown in FIG. 24, from the basic The rise of each pulse of the clock signal CKL counts the number of pulses of the multiplied clock signal CKs to a predetermined value △Ns, and outputs a pulse wp as the system clock SQ at the same time as the count is completed. Therefore, the delay time Td _{1 from} the rise of the pulse of the basic clock signal CKL to the rise of the corresponding pulse wp of the system clock SQ is equivalent to the time to count the pulse of the multiplied clock signal CKs to the predetermined value △Ns .

In FIG. 24, by the pulse wp of the system clock SQ generated after the pulse CKn corresponding to the basic clock signal CKL after the delay time Td ₁ , the counter circuit 208 counts to the preset value Dsa (number of pulses Nck), the counter The circuit 208 outputs the completion pulse signal b. In response, the preset circuit 206 overwrites the new predetermined value ΔNs to the previous predetermined value ΔNs+Dsb. The preset value Dsb is a value corresponding to the amount of change (ΔTd) of the pulse interval Δwp shown in FIG. 22. Although set to a negative value in FIG. 24, the positive value is also the same. Therefore, before the next pulse CKn+1 is generated under the pulse CKn of the basic clock signal CKL, the delay circuit 202 sets a predetermined delay time Td ₂ corresponding to a delay time Td ₁ shorter than the delay time Td ₁ set with the standard value Ns ₀ Value △Ns.

Thereby, the pulse interval wp' of the system clock SQ generated in response to the pulse CKn+1 of the basic clock signal CKL and the pulse interval wp' of the previous pulse wp are shorter than the previous pulse interval ?wp. After the pulse wp' is generated, the counter circuit 208 counts up to the system clock SQ of the number of pulses Nck, and the completion pulse signal b is not generated. Therefore, the predetermined value ΔNs set in the delay circuit 202 is maintained at the corresponding delay time Td ₂ The value of the system clock SQ is output with the delay time Td ₂ uniformly delayed with respect to the basic clock signal CKL until the completion of the generation of the pulse signal b. Therefore, the ratio β between the pulse interval △wp determined by the frequency Fz of the basic clock signal CKL and the pulse interval △wp' corrected by the time offset β becomes β=△wp'/△wp=1±(△Td/△ wp) (where, △Td<△wp)

The dimension of the width of the pattern drawn along the drawing line is larger than the design value specified by the drawing data when β>1, and smaller than the design value when β<1 (in the case of FIG. 24).

In the circuit configuration of FIG. 23 described above, the counting of the number of pulses of the system clock SQ Nck times is repeatedly performed so that the pulse interval △wp change time △wp of one pulse wp of the system clock SQ made immediately after the completion of the generation of the pulse signal b Td action. In addition, in the case of the circuit configuration in FIG. 23, if the standard value Ns ₀ stored internally by the preset circuit 206 is 20 and the preset value Dsb set from the outside is zero, then whether or not the completion pulse signal b is generated or not, the predetermined value △Ns maintains 20 (the drawing magnification in the Y direction is not corrected). In addition, since the frequency of the multiplied clock signal CKs is set to be 20 times the frequency of the basic clock signal CKL, the predetermined value △Ns is set to 20, and the preset value Dsb is set to +1 (or -1) , Then the predetermined value △Ns is overwritten (or decreased) as 20,21,22,‧‧‧ (or 20,19,18‧‧‧) whenever the completion pulse signal b is generated Furthermore, one pulse of the doubled clock signal CKs is equivalent to 1/20 (5%) of the standard pulse interval △wp (pulse interval distance CXs), so if the preset value Dsb is changed by ±1, two consecutive The ratio of overlapping points of light changes in 5% units.

As described above, the pulse beam output from the light source device CNT of the pulsed laser in response to the system clock SQ with a partial decrease in the pulse interval Δwp is a common supply to each of the drawing units UW1 to UW5. Therefore, the drawing line LL1 The patterns drawn in ~LL5 will expand and contract at the same rate in the Y direction. Therefore, as explained in FIG. 12 (or FIG. 11), in order to maintain the joining accuracy between adjacent drawing lines in the Y direction, the drawing timing is corrected so that the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 ( Or drawing end positions EC1~EC5) move in Y direction.

An example of a circuit configuration in which the pulse interval △wp of the system clock SQ is partially variable, in addition to the way in which the delay times Td ₁ and Td _{2 are} digitally variable as shown in FIGS. 23 and 24, can also be analog ground Variable composition. In addition, the pulse interval △wp′ at one of the corrections may be increased relative to the standard pulse interval △wp each time the counter circuit 208 counts the system clock SQ to a preset value Dsb (number of pulses Nck) Reduce the composition of micro values such as 1%. In this case, in one scan of the spot light along the length LBL of the scan line, it is only necessary to change the number of parts where the standard pulse interval Δwp is corrected to the pulse interval Δwp' according to the necessary magnification correction amount. For example, if the number of corrected parts is set to 100, the size of the pattern drawn in one scan of spot light in the Y direction increases or decreases by an amount equivalent to the pulse interval Δwp.

Furthermore, the ON/OFF switching of the optical deflector (AOM) 81 shown in FIG. 4 is performed in response to the serial bit row (arrangement of bit values "0" or "1") sent as drawing data The sending of this bit value can be synchronized with the pulse signal wp of the system clock SQ (Fig. 22) where the pulse interval △wp partly decreases. Specifically, during the period until one pulse signal wp is generated until the next pulse signal wp is generated, one bit value is sent to the drive circuit of the optical deflector (AOM) 81, and the sweet element value is "1", When the value of the first bit is "0", it is sufficient to switch the optical deflector (AOM) 81 from the OFF state to the ON state.

The control unit 16 can adjust the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1~LL5 or the arrangement errors of each other and the displacement meters YN1, YN2, which can detect the deviation of the two ends of the rotating cylinder DR, The information detected by YN3 and YN4 adjusts the drawing position in the Y direction performed by the odd-numbered and even-numbered drawing units UW1 to UW5 to offset the Y-direction error caused by the rotational offset of the rotating cylinder DR. Also, the control unit 16 can adjust the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement errors of each other and the displacement gauge YN1 that can detect the deviation of the two ends of the rotating cylinder DR The information detected by YN2, YN3, YN4 changes the length in the Y direction (the length of the drawing line LBL) performed by the odd-numbered and even-numbered drawing units UW1~UW5 to offset the rotation deviation caused by the rotating cylinder DR Error in the Y direction.

In addition, the control unit 16 can adjust the odd and even numbers according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other and the information detected by the alignment microscopes AM1 and AM2 The drawing positions of the drawing units UW1 to UW5 in the X direction or the Y direction are used to offset the errors in the X direction or the Y direction of the substrate P.

The exposure device EX of the first embodiment includes a plurality of Each of the drawing beams LB of the drawing units UW1 to UW5 is centered on a predetermined point rotation axis I in a drawing plane including a plurality of drawing lines LL1 to LL5 formed on the substrate P, and faces the first optical table 23 in the drawing plane The displacement mechanism 24 that serves as a displacement correction mechanism that displaces the second optical table 25. According to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the configuration error of each other, when all of the plurality of drawing lines LL1 to LL5 have an error in at least one of the X direction and the Y direction, The control unit 16 can drive and control the driving unit of the moving mechanism 24 to displace the second optical table 25 in at least one of the X direction and the Y direction to offset the displacement amount of the error.

When the second optical table 25 is displaced in at least one of the X direction and the Y direction, the fourth mirror 59 shown in FIG. 6 is displaced by the amount of displacement in the X direction or the Y direction. In particular, the fourth mirror 59 is displaced in the Y direction, and when the drawing light beam LB from the third mirror 58 is reflected in the +Y direction, it is displaced in the Z direction. Therefore, the beam displacement mechanism 44 in the first optical system 41 corrects the displacement in the Z direction. According to this, the second optical system 42 and the third optical system 43 after the fourth mirror 59 can maintain the light beam LB passing through the correct optical path.

In addition, in the exposure apparatus EX of the first embodiment, due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the configuration errors of each other, the plurality of drawing lines LL1 to LL5 are oriented in the X direction When there is an error in at least one of the Y directions, the control unit 16 can drive and control the driving unit of the moving mechanism 24 to make the trace lines LL1 to LL5 formed on the substrate P move slightly in the X direction or Y direction to cancel the error The amount of displacement.

Furthermore, in the exposure apparatus EX of the first embodiment, the odd number of the plurality of drawing lines LL1 to LL5 is adjusted due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the configuration error of each other Or even number to draw the line to the X direction and Y direction to When there is at least one error, the control unit 16 can control the beam displacement mechanism 45 in such a manner that the displacement amount of the error is offset, so that the even-numbered drawing lines LL2 and LL4 formed on the substrate P are directed in the X direction or the Y direction Move slightly to fine-tune the relative positional relationship between the odd-numbered drawing lines LL1, LL3, and LL5 formed on the substrate P.

In addition, the control unit 16 may also adjust the information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement errors of each other and the displacement meters YN1, YN2, YN3, YN4 or the alignment microscope AM1 AM2 detection information, adjust the Y magnification of the drawing unit UW1~UW5. For example, the image height of the telecentric f-θ lens included in the f-θ lens system 85 is proportional to the angle of incidence. Therefore, when only the Y magnification of the drawing unit UW1 is adjusted, the control unit 16 can individually adjust f based on the adjustment information (calibration information) and the information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscope AM1, AM2 -The focal length f of the θ lens system 85 is adjusted according to Y magnification. This adjustment mechanism can be combined with any of, for example, a bending plate for magnification correction, a magnification correction mechanism for a telecentric f-θ lens, and a halving (tiltable parallel flat glass) for displacement adjustment. More than one. In addition, the rotation speed of the rotating polygonal mirror 97 rotating at a certain rotation speed can be slightly changed, that is, the separation distance CXs of each point light SP (pulse light) synchronously drawn with the system clock SQ can be slightly changed (the adjacent The amount of overlap between the spot lights is slightly offset), and as a result, the Y magnification can also be adjusted.

The exposure apparatus EX of the first embodiment includes the drawing beam LB from each of the plurality of drawing units UW1 to UW5 as described above, and includes a predetermined point in the drawing plane of the plurality of drawing lines LL1 to LL5 formed on the substrate P A rotation mechanism 24 serving as a displacement correction mechanism that rotates the axis I as a center and displaces the second optical table 25 with respect to the first optical table 23 in the drawing plane. Due to the configuration state of the corresponding multiple drawing lines LL1~LL5 or the configuration error of each other Adjust the information (calibration information) so that the plurality of drawing lines LL1 to LL5 have an angular error with respect to the Y direction. The control unit 16 can control the drive of the moving mechanism 24 to rotate the second optical table 25 to offset the angular error The amount of rotation.

In addition, when it is necessary to perform rotation correction on each of the drawing units UW1 to UW5 individually, the f-θ lens system 85 and the second cylindrical lens 86 shown in FIG. 8 may be slightly rotated around the optical axis AXf. The drawing lines LL1 to LL5 are individually rotated (inclined) slightly on the substrate P. The light beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the generatrix of the cylindrical lens 86 in the non-scanning direction. Therefore, by rotating the cylindrical lens 86 around the optical axis AXf, each drawing line LL1 to LL5 can be made Rotate (tilt).

The exposure apparatus EX of the first embodiment only needs to process at least one kind of processing for adjusting the drawing position by the control device in step S4. In addition, the exposure apparatus EX of the first embodiment may be combined with the processing of the drawing position adjustment performed by the control device of step S4 described above.

By the adjustment method of the substrate processing apparatus described above, in the exposure apparatus EX of the first embodiment, the pattern PT1 to PT5 adjacent to each other in the width direction (Y direction) of the substrate P can be omitted (not necessary) Test exposure of joint error, or significantly reduce its frequency. Therefore, the exposure apparatus EX of the first embodiment can shorten the time-consuming calibration operations such as test exposure, drying and development processes, and confirmation of exposure results. In addition, the exposure apparatus EX of the first embodiment can suppress the waste of the substrate P by the number of times of feedback due to the test exposure. The exposure device EX of the first embodiment can obtain adjustment information (calibration information) corresponding to the arrangement state of a plurality of drawing lines LL1 to LL5 or the arrangement errors of each other earlier. The exposure apparatus EX of the first embodiment can be adjusted according to the arrangement state of the corresponding plural drawing lines LL1 to LL5 or the arrangement error of each other The information (calibration information) is corrected in advance, and the components of displacement, rotation, magnification, etc. in the X direction or Y direction are easily corrected accordingly. In addition, the exposure apparatus EX of the first embodiment can improve the accuracy of superimposed exposure on the substrate P.

In addition, although the exposure apparatus EX of the first embodiment is described by taking the case where the optical deflector 81 includes the acousto-optic element and the point scan of the drawing beam LB by rotating the polygon mirror 97 is taken as an example, other than the point scan, it may be It is a way to draw a pattern using DMD (Digital Micro Mirror Device) or SLM (Spatial light modulator: spatial light modulator).

[Second Embodiment]

Next, the exposure apparatus EX of the second embodiment will be described. In addition, in the second embodiment, in order to avoid duplication of the description of the first embodiment, only the parts that are different from the first embodiment will be described, and the same constituent elements as the first embodiment are given to the first embodiment. The same symbols are used for explanation.

In the exposure apparatus EX of the second embodiment, the photodetector 31Cs of the calibration detection system 31 does not detect the reference pattern (which can also be used as a reference mark) RMP but detects the reflected light of the alignment marks Ks1 to Ks3 on the substrate P (Scattered light). The alignment marks Ks1 to Ks3 are arranged on the substrate P in the Y direction passing through any one of the drawing lines LL1 to LL5 of the drawing units UW1 to UW5. When the spot light SP depicting the light beam LB scans to the alignment marks Ks1 to Ks3, the scattered light reflected by the alignment marks Ks1 to Ks3 is received by the photoelectric sensor 31Cs in a bright field or a dark field.

The control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on the signal output from the photoelectric sensor 31Cs. In the same way as in the first embodiment, the control unit 16 can obtain the configuration corresponding to the plurality of drawing lines LL1 to LL5 from the detection signal detected by the photoelectric sensor 31Cs Adjustment information (calibration information) of the setting state or the configuration error of each other.

In addition, the control unit 16 can adjust the odd-numbered and even-numbered drawing according to the adjustment information (calibration information) corresponding to the configuration state of the plurality of drawing lines LL1~LL5 or the configuration error of each other and the information detected by the alignment microscopes AM1 and AM2 The drawing positions of the units UW1 to UW5 in the X direction or Y direction are used to offset the errors in the X direction or Y direction of the substrate P. When the spot light SP depicting the light beam LB is projected on the alignment marks Ks1~Ks3, the photosensitive layers on the alignment marks Ks1~Ks3 are photosensitive, and the alignment marks Ks1~Ks3 may collapse in the subsequent process. Therefore, it is better to provide a plurality of alignment marks Ks1 to Ks3, and to align the microscopes AM1 and AM2 to read the alignment marks Ks1 to Ks3 that have not collapsed due to exposure.

Therefore, the exposure device EX of the second embodiment can be included in the data for pattern drawing, and the spot light SP of the drawing beam LB can be scanned near the alignment marks Ks1 to Ks3 of the exposure collapse, which is undesirable due to exposure collapse Near the alignment marks Ks1 to Ks3, the ON/OFF data of the optical deflector (AOM) 81 is performed in such a way that the spot light SP will not be irradiated. According to this, the calibration information can be obtained in real time while being exposed by the drawing beam LB, and the alignment marks Ks1 to Ks3 (the position of the substrate P) can also be read.

The exposure apparatus EX of the second embodiment is the same as the exposure apparatus EX of the first embodiment, and the test exposure for suppressing the joining error can be omitted or the number of times can be greatly reduced. In addition, in the exposure apparatus EX of the second embodiment, the exposure information of the substrate P can be measured at the same time as the error information corresponding to the arrangement status of the plurality of drawing lines LL1~LL5 or the arrangement relationship between each other, as early as ) Obtain corresponding adjustment information (calibration information). Therefore, according to the exposure device EX of the second embodiment, based on the error information measured earlier or the adjustment information (calibration information), while performing the exposure of the device pattern, the correction and the predetermined accuracy can be sequentially performed while maintaining Adjustment can easily suppress the decrease in the joining accuracy between the drawing units of each error component such as displacement error, rotation error, magnification error, etc. in the X-direction or Y-direction, which is a problem in the multi-drawer system. According to this, the exposure apparatus EX of the second embodiment can maintain the overlay accuracy at a high state during the overlay exposure on the substrate P.

<Component manufacturing method>

Next, referring to Fig. 25, a method of manufacturing a device will be described. FIG. 25 is a flowchart showing the device manufacturing method of each embodiment.

The device manufacturing method shown in FIG. 25 first performs function and performance design of a display panel formed using self-luminous elements such as organic EL, and designs circuit patterns and wiring patterns required by CAD or the like (step S201). And prepare a roll for supplying the flexible substrate P (resin film, metal foil film, plastic, etc.) as the base material of the display panel (step S202). In addition, the roll-shaped substrate P prepared in this step S202 may be one whose surface has been modified as necessary, or an underlayer has been formed in advance (for example, micro unevenness by imprint), or light has been deposited in advance Inductive functional film or transparent film (insulating material)

Next, a substrate layer composed of electrodes or wiring, an insulating film, a TFT (thin film semiconductor), etc. constituting a display panel element is formed on the substrate P, and a light-emitting layer composed of a self-luminous element such as an organic EL is formed by being laminated on the substrate (Display pixel section) (step S203). In this step S203, the conventional photolithography process for exposing and developing the photoresist layer using the exposure device EX described in the previous embodiments is also included, and a photosensitive silane coupling agent is applied to replace the photoresist The substrate P is subjected to pattern exposure to modify the surface to hydrophilizing water to form a pattern exposure process, and the pattern exposure is applied to the photo-sensitive catalyst layer to impart selective plating reduction and formed by electroless plating Wet process of metal film patterns (wiring, electrodes, etc.), or containing The printing process of drawing patterns such as conductive ink of silver nanoparticles, etc.

Next, for each display panel element that is continuously manufactured on the long substrate P in a roll, the substrate P is cut, or a protective film (environmental barrier layer) or color filter film is attached to the surface of each display panel element. Assemble the component (step S204). Next, a check step is performed whether the display panel element can operate normally, or whether it satisfies the desired performance and characteristics (step S205). Through the above method, a display panel (flexible display) can be manufactured. In addition, the electronic components made into a flexible long sheet substrate are not limited to display panels, but may also be used as flexible wiring networks for connecting wires (wiring tape) between various electronic components mounted in automobiles, trams, etc. .

31‧‧‧ Calibration and Inspection Department

31Cs‧‧‧Photoelectric sensor

41‧‧‧First Optical Department

42‧‧‧Second Optical Department

43‧‧‧ Third Optical Department

44‧‧‧beam displacement mechanism

45‧‧‧beam displacement mechanism

51‧‧‧1/2 wave plate

52‧‧‧ Polarizer (polarizing beam splitter)

53‧‧‧ Diffuser

54‧‧‧First reflector

55‧‧‧First relay lens

56‧‧‧2nd relay lens

57‧‧‧ 2nd reflector

58‧‧‧ Third reflector

59‧‧‧4th reflector

60‧‧‧First beam splitter

61‧‧‧ 5th reflector

62‧‧‧Second beam splitter

63‧‧‧3rd beam splitter

64‧‧‧The 6th reflector

71‧‧‧7th reflector

72‧‧‧The 8th reflector

73‧‧‧ 4th beam splitter

74‧‧‧9th reflector

81‧‧‧Optical deflector

82‧‧‧1/4 wavelength plate

84‧‧‧Bending mirror

85‧‧‧f-θ lens system

86‧‧‧Cylinder lens

86B‧‧‧Y magnification correction optical component (lens group)

91‧‧‧Relay lens

92‧‧‧ Shading board

93‧‧‧Relay lens

94‧‧‧Relay lens

95‧‧‧Cylinder lens

97‧‧‧rotating polygon mirror

97a‧‧‧rotation axis

97b‧‧‧Reflecting surface

AX2‧‧‧Rotation centerline

CNT‧‧‧Light source device

DR‧‧‧rotating cylinder

EN1, EN2, EN3, EN4 ‧‧‧ Encoder read head

GPa, GPb‧‧‧ Ruler Department

I‧‧‧rotation axis

LB‧‧‧beam

Le1~Le4‧‧‧Set bearing line

P‧‧‧Substrate

PBS‧‧‧Beam splitter

Sf2‧‧‧Shaft

SL‧‧‧Divisional optics

UW1~UW5‧‧‧Drawing unit

Claims (6)

A pattern drawing device that draws the pattern on the surface of a long sheet substrate according to the drawing data of the pattern for electronic components, is provided with: a rotating cylinder, which rotates around a predetermined center line, and has a shape formed from the center line A reference pattern of a part of the outer peripheral surface of a cylindrical shape of a certain radius, supporting a part of the sheet-shaped substrate in the longitudinal direction on the outer peripheral surface; a mobile measuring device, including: a scale portion, which rotates around the center line with the rotating cylinder Rotate and set along the circumference of a predetermined radius from the center line; and the encoder read head, read the scale part to output movement information corresponding to the movement amount or movement position of the sheet substrate; the drawing unit, at On the sheet substrate supported by the rotating cylinder, draw the pattern on the drawing line when the light beam modulated corresponding to the drawing data is scanned in a direction parallel to the center line; the detection probe is placed on the rotating cylinder The direction of rotation is set in the observation area on the upstream side of the drawing line to detect the mark previously formed on the sheet substrate or the reference pattern of the rotating cylinder; the photoelectric sensor detects the current from the drawing unit The intensity change of the reflected light generated when the light beam scans the outer peripheral surface of the rotating cylinder; and the control unit according to each of the detection probe and the photoelectric sensor according to the reference pattern by the rotation of the rotating cylinder Each movement information of the movement measuring device at the time of detection, after obtaining calibration information about the relative positional relationship of the drawing line and the observation area, according to the movement when the mark of the sheet substrate is detected by the detection probe The movement information of the measuring device and the calibration information adjust the drawing position of the pattern by the light beam from the drawing unit. The pattern drawing device according to claim 1, wherein the encoder read head of the mobile measurement device includes: The first encoder read head is arranged opposite to the scale part in the same direction as the drawing line in the circumferential direction of the rotating cylinder; and the second encoder read head is placed in the circumferential direction of the rotating cylinder in the The observation area has the same orientation and is arranged opposite to the scale part. The pattern drawing device according to claim 2, wherein the adjustment of the drawing position of the control section includes a control of changing the rotation speed of the rotating cylinder to change the moving speed of the sheet substrate. The pattern drawing device according to any one of claims 1 to 3, wherein the adjustment of the drawing position by the control section includes changing the unit time of the sheet substrate by the rotation of the rotating cylinder Control of the relationship between the moving distance in the circumferential direction and the number of the drawing lines contained in the moving distance. The pattern drawing device according to any one of claims 1 to 3, wherein the adjustment of the drawing position by the control section includes a change in the length of the drawing line formed by the scanning of the light beam. The pattern drawing device according to any one of claims 1 to 3, further comprising: a pulse light source that generates pulse light of a wavelength in the ultraviolet band in synchronization with the system clock as the light beam projected from the drawing unit; by The adjustment of the drawing position of the control unit includes a process of partially changing the period of the system clock while the light beam is scanned along the drawing line.

Images