TWI639064B - Substrate processing device and element manufacturing method - Google Patents

Abstract

The substrate processing device arranges a plurality of drawing units on the substrate in such a manner that the patterns drawn on the substrate by the drawing lines of the plurality of drawing units can be joined to each other in the width direction of the substrate as the substrate moves in a long direction. The width direction of the substrate. The control section stores in advance calibration information on the positional relationship of the drawing lines formed on the substrate by each of the plurality of drawing units, and adjusts the drawing by the plurality of drawing based on the calibration information and the movement information output from the mobile measurement device. Each of the drawing beams of the unit is a drawing position of a pattern formed on the substrate.

Description

Substrate processing device and element manufacturing method

The present invention relates to a substrate processing apparatus, a component manufacturing method, and a substrate processing method for forming a structure of a microelectronic element on a substrate.

As a conventional substrate processing apparatus, there is a well-known manufacturing apparatus for drawing on a predetermined position on a sheet-like medium (substrate) (for example, refer to Patent Document 1). The manufacturing device described in Patent Document 1 is a flexible long sheet substrate that can be expanded and contracted in the width direction, and detects the alignment mark to measure the expansion and contraction of the sheet substrate, and corrects the drawing position (processing position) based on the expansion and contraction.

Patent Document 1: Japanese Patent Application Laid-Open No. 2010-91990

In the manufacturing apparatus of Patent Document 1, a substrate is moved by a space modulation element (DMD: Digital Micro Mirror Device) while the substrate is being moved in the conveying direction, and the pattern is drawn on the substrate by a plurality of drawing units. In the manufacturing device of Patent Document 1, although the patterns adjacent to each other in the width direction of the substrate are bonded and exposed by a plurality of drawing units, in order to suppress the error of the bonded exposure, feedback is performed to test the exposure and The measurement results of the position error of the pattern at the joint produced by the development. However, including the feedback steps of such tests as exposure, development, and measurement, although depending on its frequency, it is necessary to temporarily stop the production line, which not only reduces the productivity of the product, but also wastes the substrate.

The aspect of the present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a method of reducing the joining error between patterns even when a plurality of drawing units are used to join the patterns in the width direction of the substrate for exposure (drawing). , And a substrate processing device capable of drawing a large-area pattern on a substrate with high accuracy and stability, a device manufacturing method, and a substrate processing method.

A substrate processing apparatus according to a first aspect of the present invention includes a conveying device that moves a portion of the long sheet-shaped substrate while supporting a portion of the long sheet-shaped substrate with a support member bent in the long direction while moving the long piece-like substrate in the long direction; The drawing device includes, while projecting a modulated drawing beam on the substrate supported by the support surface, scanning in a width direction of the substrate crossing the strip direction in a narrower range than the width of the substrate, and scanning along the The drawing lines obtained by the scanning draw a plurality of drawing units of a predetermined pattern, and the patterns drawn on the substrate by each drawing line of the plurality of drawing units are in the width direction of the substrate as the substrate moves in the strip direction In the joining method, the plurality of drawing units are arranged in the width direction of the substrate; the moving measuring device outputs the movement information of the movement amount or position of the substrate corresponding to the carrying device; and the control section stores in advance Each of the plurality of drawing units forms calibration information on the positional relationship of the drawing lines on the substrate, and according to the calibration information And the mobile information output from the mobile measurement device, adjusting a drawing position of a pattern formed on the substrate by the drawing beam of each of the plurality of drawing units.

According to the second aspect of the present invention, the element manufacturing method uses the substrate processing apparatus of the first aspect of the present invention to form the pattern on the substrate.

The substrate processing method according to the third aspect of the present invention is a method for drawing a pattern of an electronic component on a long sheet substrate, and includes the following operations: conveying the sheet substrate in a long direction at a predetermined speed; Light source device oscillating light beam in ultraviolet wavelength range with frequency Fz pulse Condensing spot light on the surface of the sheet substrate, and oscillating the light beam by a light scanner to scan the spot light along a drawing line of a length LBL extending in a width direction crossing the strip direction ; And during the scanning of the spot light, the action of modulating the intensity of the spot light according to the drawing data corresponding to the pattern; set the spot light formed by the condensed light of one pulse of the beam and the spot formed by the condensed light of the next pulse When the interval between the light along the drawing line is CXs, the effective size of the point light along the drawing line is Xs, and the scanning time of the point light scanning the length LBL is Ts, it is set to satisfy Xs> CXs and Fz> LBL / (Ts‧Xs).

According to a fourth aspect of the present invention, a substrate processing method includes drawing a pattern of an electronic component on a long sheet-shaped substrate, which is characterized in that it includes the steps of transporting the sheet-shaped substrate in a long direction at a predetermined speed; The light source device converges a light beam in the ultraviolet wavelength range oscillated with a frequency Fz into a spot light on the surface of the sheet substrate, and draws the point light along a width direction that intersects the strip direction of the sheet substrate. The step of line scanning; and the step of modulating the intensity of the light beam by a light switching element during the point light scanning according to the drawing data divided into pixel units according to the pattern; the response frequency when the light switching element is modulated The relationship between Fss and the frequency Fz of the pulse oscillation of the beam is set to Fz> Fss.

According to the aspect of the present invention, it is possible to provide a substrate processing apparatus capable of reducing a bonding error when a plurality of drawing units are used to expose a bonding pattern in a width direction of a substrate and appropriately performing drawing using a plurality of drawing units on a substrate. Element manufacturing method. Furthermore, a substrate processing method capable of improving the drawing accuracy (uniformity of exposure amount, etc.) or the fidelity when a drawing unit draws a pattern along a drawing line can be provided.

1‧‧‧component manufacturing system

11‧‧‧ depicting device

12‧‧‧ substrate transfer mechanism

13‧‧‧device frame

14‧‧‧rotation position detection mechanism

16‧‧‧Control Department

23‧‧‧The first optical platform

24‧‧‧ Mobile agency

25‧‧‧The second optical platform

31‧‧‧ Calibration and Inspection Department

31Cs‧‧‧Photoelectric sensor

31f‧‧‧Shading member

73‧‧‧ 4th beam splitter

81‧‧‧light deflector

83‧‧‧Scanner

96‧‧‧Reflector

97‧‧‧ rotating polygon mirror

97a‧‧‧rotation shaft

97b‧‧‧Reflective surface

98‧‧‧ origin detector

AM1, AM2‧‧‧ aiming microscope

DR‧‧‧rotating cylinder

EN1, EN2, EN3, EN4‧‧‧ encoder read head

EX‧‧‧Exposure device

I‧‧‧rotation axis

LL1 ~ LL5‧‧‧Drawing line

PBS‧‧‧biased beam splitter

UW1 ~ UW5‧‧‧Drawing unit

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 2 is a perspective view showing a configuration of a main part of the exposure apparatus of FIG. 1. FIG.

FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate.

FIG. 4 is a diagram showing the configuration of a rotating cylinder and a drawing device of the exposure apparatus of FIG. 1. FIG.

FIG. 5 is a plan view showing a configuration of a main part of the exposure apparatus of FIG. 1. FIG.

FIG. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of FIG. 1.

FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. 1. FIG.

FIG. 8 is a diagram illustrating an optical configuration for eliminating a shift in a drawing line caused by a tilt of a reflecting surface of a scanner.

FIG. 9 is a perspective view showing an arrangement relationship between an alignment microscope, a drawing line, and an encoder read head on a substrate.

FIG. 10 is a perspective view showing a surface structure of a rotating cylinder of the exposure apparatus of FIG. 1. FIG.

11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on a substrate.

FIG. 12 is an explanatory diagram showing a relationship between a beam spot and a drawing line.

FIG. 13 is a graph simulating a change in the intensity distribution caused by the overlapping amount of the beam points of two pulses obtained on the substrate.

FIG. 14 is a flowchart of a method of adjusting the exposure apparatus according to the first embodiment.

15 is an explanatory diagram schematically showing a relationship between a reference pattern of a rotating cylinder and a drawing line.

FIG. 16 is an explanatory diagram schematically showing a signal output from a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a bright field of light.

FIG. 17 is an explanatory diagram schematically showing a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a dark field.

FIG. 18 is an explanatory diagram schematically showing a signal output from a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a dark field.

FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder.

FIG. 20 is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawn lines.

FIG. 21 is an explanatory diagram schematically showing the relationship between the moving distance per unit time of the substrate and the number of drawn lines included in the moving distance.

FIG. 22 is an explanatory diagram showing a pulsed light synchronized with the clock of the system of the pulsed light source in a schematic manner.

FIG. 23 is a block diagram illustrating an example of a circuit configuration of a system clock generating a pulse light source.

FIG. 24 is a timing chart showing the signal migration of each part in the circuit configuration of FIG. 23.

FIG. 25 is a flowchart showing a method of manufacturing each element.

The aspect (embodiment) for implementing the present invention will be described in detail with reference to the drawings. The invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those that are easy to be imagined by the industry and those that are substantially the same. In addition, the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. Illustration. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that applies an exposure process to the substrate P, and the exposure apparatus EX is incorporated in the element manufacturing system 1 that applies various processes to the exposed substrate P to produce elements. First, the component manufacturing system 1 will be described.

<Component manufacturing system>

The component manufacturing system 1 is a production line (flexible display manufacturing line) that manufactures flexible displays as components. Flexible displays, such as organic EL displays. This component manufacturing system 1 is to roll out a flexible long substrate P into a cylinder (not shown) for supply rolls, and after the substrate P is continuously subjected to various processes, The so-called roll-to-roll (Ro11 to Ro11) method in which the processed substrate P is wound as a flexible element on a recycling roll (not shown). In the element manufacturing system 1 of the first embodiment, a film-like sheet substrate P is sent out from a supply roll, and the substrate P sent out from the supply roll is sequentially processed through a processing device U1, an exposure device EX, and a processing device U2. After that, it is wound around a reel for recycling. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of a metal or an alloy such as a resin film and stainless steel. For the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polycarbonate can be used. One or two or more kinds of materials such as ester resin, polystyrene resin, and polyvinyl alcohol resin.

The substrate P is preferably selected such that, for example, the coefficient of thermal expansion is significantly small, and the amount of deformation caused by heat in various processes performed on the substrate P can be substantially ignored. The thermal expansion coefficient can be set to be smaller than a threshold value corresponding to a processing temperature or the like by, for example, mixing an inorganic filler with a resin film. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. also, The substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm produced by a float method or the like, or a laminated body in which the above-mentioned resin film, foil, or the like is bonded to the extremely thin glass.

The substrate P configured in this manner is wound into a roll shape to become a supply roll, and this supply roll is mounted on the component manufacturing system 1. The component manufacturing system 1 equipped with the supply rolls repeatedly executes various processes for manufacturing the components on the substrate P sent out from the supply rolls in a long direction. Therefore, a pattern for a plurality of electronic components (display panel, printed substrate, etc.) is formed on the processed substrate P in a state of being connected at a certain interval in the longitudinal direction. That is, the substrate P sent out from the supply roll is a multi-sided substrate. In addition, the substrate P may be a surface modified and activated by a predetermined pretreatment in advance, or a fine partition wall structure (an unevenness formed by an imprint method) for precise patterning may be formed on the surface. Constructor).

The processed substrate P is wound into a roll shape and recovered as a roll for collection. The recovery roll is mounted on a cutting device (not shown). A cutting device equipped with a reel for roll-up is used to divide (cut) the processed substrate P into individual components, thereby becoming a plurality of components. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short side), and more than 10 m in the length direction (length direction). Of course, the size of the substrate P is not limited to the above-mentioned size

Next, a component manufacturing system 1 will be described with reference to FIG. 1. The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. FIG. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is a direction from the processing device U1 to the processing device U2 through the exposure device EX in a horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction, and the XY plane is parallel to the installation surface E of the manufacturing line on which the exposure device EX is installed.

The processing device U1 is a process (pre-processing) for performing a pre-process on the substrate P subjected to the exposure processing by the exposure apparatus EX. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure device EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

Here, the photosensitive functional layer is applied as a solution on the substrate P, and dried to form a layer (film). A typical photosensitive functional layer has a photoresist as a material that is not required after the development process, and the lyophilized modified silane coupling agent (SAM) in the part exposed to ultraviolet light or the part exposed to ultraviolet light is exposed Photosensitive material for plating reduction. When a photosensitive silane coupling agent is used as the photosensitive functional layer, since the portion of the pattern exposed to ultraviolet light on the substrate P is changed from liquid-repellent to lyophilic, a conductive ink is selectively applied to the portion that becomes lyophilic ( Ink containing conductive nano particles such as silver or copper) to form a pattern layer. When a photosensitive material is used as the photosensitive functional layer, the plating portion is exposed on the pattern portion exposed to the ultraviolet rays on the substrate P. Therefore, the substrate P is immediately immersed in a plating solution containing palladium ions or the like after exposure. For a certain period of time, a pattern layer of palladium is formed (precipitated).

The exposure apparatus EX draws patterns of various circuits or various wirings for a display panel, for example, on the substrate P supplied from the processing apparatus U1. Details are left to be described later. This exposure device EX is a plurality of light beams LB (hereinafter, also referred to as drawing beams LB) that are projected from each of the plurality of drawing units UW1 to UW5 toward the substrate P in a predetermined scanning direction. The lines LL1 to LL5 are drawn, and a predetermined pattern is exposed on the substrate P.

The processing device U2 receives the substrate P exposed by the exposure device EX, and performs post-processing (post-processing) on the substrate P. The processing device U2, when the photosensitive functional layer of the substrate P is a photoresist, performs a baking process after the glass transition temperature of the substrate P is below, Development processing, washing processing, drying processing, and the like. When the photosensitive functional layer of the substrate P is a photosensitive plating material, the processing device U2 performs an electroless plating process, a cleaning process, a drying process, and the like. In addition, when the photosensitive functional layer of the substrate P is a photosensitive silane coupling agent, the processing device U2 performs a selective coating process, a drying process, and the like of the liquid ink on the substrate P that becomes a lyophilic part. Through such a processing device U2, a pattern layer of an element is formed on the substrate P.

<Exposure device (substrate processing device)>

Next, an exposure apparatus EX will be described with reference to FIGS. 1 to 10. FIG. 2 is a perspective view showing a configuration of a main part of the exposure apparatus of FIG. 1. FIG. FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate. FIG. 4 is a diagram showing the configuration of a rotating cylinder and a drawing device (drawing unit) of the exposure device of FIG. 1. FIG. FIG. 5 is a plan view showing a configuration of a main part of the exposure apparatus of FIG. 1. FIG. FIG. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of FIG. 1. FIG. 7 is a diagram showing the arrangement relationship of the scanners in the plurality of drawing units of the exposure apparatus of FIG. 1. FIG. FIG. 8 is a diagram illustrating an optical configuration for eliminating a shift in a drawing line caused by a tilt of a reflecting surface of a scanner. FIG. 9 is a perspective view showing an arrangement relationship between an alignment microscope on a substrate and an encoder reading head that draws a line. FIG. 10 is a perspective view showing an example of a surface structure of a rotating cylinder of the exposure apparatus of FIG. 1. FIG.

As shown in FIG. 1, the exposure device EX is an exposure device that does not use a mask, a so-called maskless drawing exposure device. In this embodiment, the substrate P is continuously moved to the conveying direction at a constant speed ( (Strip direction), while scanning the spot of the drawing beam LB at a high speed in a predetermined scanning direction (width direction of the substrate P), and performing drawing on the surface of the substrate P to form a predetermined pattern on the substrate P. Line (raster scan) direct drawing exposure device.

As shown in FIG. 1, the exposure device EX includes a drawing device 11 and a substrate transfer mechanism. 12. Align the microscopes AM1, AM2, and control unit 16. The drawing device 11 includes a plurality of drawing units UW1 to UW5. The drawing device 11 draws a predetermined pattern by a plurality of drawing units UW1 to UW5 while a part of the substrate P is conveyed while being supported closely above the outer peripheral surface of the cylindrical rotating cylinder DR as a part of the substrate conveying mechanism 12. The substrate transfer mechanism 12 transfers the substrate P transferred from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are used for aligning the relative positions of the pattern to be drawn on the substrate P and the substrate P, and detecting alignment marks and the like formed on the substrate P in advance. A control unit 16 including a computer, a microcomputer, a CPU, an FPGA, and the like controls each unit of the exposure apparatus EX so that each unit performs processing. The control unit 16 may be a part or the whole of a higher-level control device of the control element manufacturing system 1. The control unit 16 is controlled by a higher-level control device. The higher-level control device may be another device such as a host computer that manages the production line.

As shown in FIG. 2, the exposure device EX includes an apparatus frame 13 that supports at least a part of the drawing device 11 and the substrate transfer mechanism 12 (rotating cylinder DR, etc.). Rotary beam spot light SP position detection mechanism (such as the encoder reading head shown in Fig. 4 and Fig. 9) such as the rotation angle position, rotation speed, and displacement of the rotation axis direction, and Fig. 1 (or Fig. 3 and Fig. 9) The alignment microscopes AM1, AM2, etc. are shown. Furthermore, as shown in FIGS. 4 and 5, an exposure device EX is provided with a light source device CNT that emits ultraviolet laser light (pulse light) as a drawing light beam LB. This exposure device EX distributes the drawing light beam LB emitted from the light source device CNT to each of a plurality of drawing units UW1 to UW5 constituting the drawing device 11 at substantially equal light amounts (illumination).

As shown in FIG. 1, the exposure device EX is housed in a greenhouse EVC. Adjust the greenhouse EVC and install it on the installation surface of the manufacturing plant through passive or active vibration isolation units SU1 and SU2 (Ground) E. The anti-vibration units SU1 and SU2 are provided on the installation surface E to reduce vibration from the installation surface E. The greenhouse EVC is adjusted to keep the interior at a predetermined temperature, thereby suppressing a change in the shape of the substrate P that is transported in the interior due to temperature.

The substrate conveying mechanism 12 of the exposure device EX has an edge position controller EPC, a driving roller DR4, a tension adjusting roller RT1, a rotating cylinder (cylindrical cylinder) DR, and a tension adjusting roller in order from the upstream side of the substrate P in the conveying direction. RT2, driving roller DR6, and driving roller DR7.

The edge position controller EPC adjusts the position of the substrate P transferred from the processing device U1 in the width direction (Y direction). The edge position controller EPC can position the substrate P in the width direction at the end (edge) of the substrate P sent from the processing device U1 within a range of ± ten μm to several tens μm relative to the target position. The direction moves slightly to correct the position of the substrate P in the width direction.

The driving roller DR4 of the clamping method rotates the front and back sides of the substrate P transferred from the edge position controller EPC while holding the substrate P to the downstream side of the conveying direction to move the substrate P to the rotating cylinder DR. Transport. Rotate the cylinder DR while supporting the portion of the pattern on the substrate P that is to be exposed on the cylindrical outer peripheral surface with a certain radius from the rotation centerline (rotation axis) AX2 extending in the Y direction, while supporting the circle. The wire AX2 is rotated to carry the substrate P in a long direction.

In order to rotate such a rotating cylinder DR around the rotation centerline AX2, shaft portions Sf2 and shaft portions Sf2 coaxial with the rotation centerline AX2 are provided on both sides of the rotation cylinder DR, as shown in FIG. The bearing is supported by the device frame 13 by a shaft. A rotational torque is applied to a shaft portion Sf2 from a driving source (motor, reduction gear mechanism, etc.) (not shown). Also, will include the center of rotation A plane where the line AX2 is parallel to the YZ plane is referred to as a center plane p3.

The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P that is wound and supported on the rotating cylinder DR. The two sets of grip driving rollers DR6 and DR7 are arranged at a predetermined interval in the conveying direction of the substrate P, and the substrate P after exposure is given a predetermined slack DL. The upstream side of the substrate P conveyed by the driving roller DR6 is rotated and the downstream side of the substrate P conveyed by the driving roller DR7 is rotated, so that the substrate P is conveyed to the processing device U2. At this time, since the substrate P is provided with the slack DL, it can absorb the variation in the conveyance speed of the substrate P that is generated downstream of the driving roller DR6 in the conveying direction, and isolates the influence of the exposure processing caused by the change in the conveyance speed on the substrate P.

Therefore, the substrate transfer mechanism 12 can adjust the position of the substrate P transferred from the processing apparatus U1 in the width direction by the edge position controller EPC. The substrate transfer mechanism 12 transfers the substrate P whose width position is adjusted to the tension adjusting roller RT1 by the driving roller DR4, and transfers the substrate P passing the tension adjusting roller RT1 to the rotating cylinder DR. The substrate transfer mechanism 12 transfers the substrate P supported by the rotation cylinder DR to the tension adjustment roller RT2 by rotating the rotation cylinder DR. The substrate transfer mechanism 12 transfers the substrate P transferred to the tension adjusting roller RT2 to the driving roller DR6, and transfers the substrate P transferred to the driving roller DR6 to the driving roller DR7. Next, the substrate transfer mechanism 12 transfers the substrate P to the processing device U2 while applying the slack DL to the substrate P by the driving roller DR6 and the driving roller DR7.

Referring again to FIG. 2, the device frame 13 of the exposure device EX will be described. In FIG. 2, the X direction, the Y direction, and the Z direction are orthogonal orthogonal coordinate systems, which are the same orthogonal coordinate systems as those in FIG. 1.

As shown in FIG. 2, the device frame 13 has The body frame 21, the support mechanism three-point mount 22, the first optical platform 23, the moving mechanism 24, and the second optical platform 25. The main body frame 21 is a portion provided on the installation surface E through the vibration isolation units SU1 and SU2. The main body frame 21 is rotatably supported (supported) by a rotating cylinder DR, a tension adjusting roller RT1 (not shown), and an RT2. The first optical stage 23 is provided on the vertical upper side of the rotating cylinder DR, and is provided on the main body frame 21 through the three-point mount 22. The three-point mount 22 supports the first optical platform 23 at three support points, and the Z-direction position (height position) of each support point can be adjusted. Therefore, the three-point mount 22 can adjust the tilt of the platform surface of the first optical platform 23 with respect to the horizontal plane to a predetermined tilt. When assembling the device frame 13, the position between the main body frame 21 and the three-point seat 22 can be adjusted in the X direction and the Y direction in the XY plane. On the other hand, after the device frame 13 is assembled, the body frame 21 and the three-point seat 22 are fixed in the XY plane (rigid state).

The second optical stage 25 is provided on the upper side in the vertical direction of the first optical stage 23, and is provided on the first optical stage 23 through the moving mechanism 24. The platform surface of the second optical platform 25 is parallel to the platform surface of the first optical platform 23. On the second optical stage 25, a plurality of drawing units UW1 to UW5 of the drawing device 11 are provided. The moving mechanism 24 can maintain the platform surfaces of each of the first optical platform 23 and the second optical platform 25 in parallel, and center the predetermined rotation axis I extending in the vertical direction as the center, and position the first optical platform 23 relative to the first optical platform 23. 2Optical stage 25 precision micro-rotation. The rotation range is, for example, a structure that can set the angle with a resolution of 1 to several milliradians relative to the reference position within a range of ± hundreds of milliradians. In addition, the moving mechanism 24 is also capable of maintaining the second optical table 25 in the X direction and the Y direction with respect to the first optical table 23 while maintaining the flat surfaces of each of the first optical table 23 and the second optical table 25 in parallel. At least one of the directions can move the rotation axis I from the reference position to the X direction or the Y direction with a resolution of μm. Ability to slightly shift. This rotation axis I, at the reference position, is a predetermined point (the surface of the substrate P) that extends in the vertical direction in the center plane p3 and is wound around the surface of the substrate P (the drawing surface curved along the circumferential surface) of the rotating cylinder DR. Midpoint in the width direction) (see Fig. 3). By such a moving mechanism 24, the second optical table 25 can be rotated or moved relative to the first optical table 23, that is, the plurality of drawing units UW1 to UW5 can be adjusted integrally with respect to the rotating cylinder DR or wound around the rotating cylinder. Position of substrate P of DR.

Next, the light source device CNT will be described with reference to FIG. 5. The light source device CNT is provided on the main body frame 21 of the device frame 13. The light source device CNT emits laser light that is projected on the substrate P as a drawing light beam LB. The light source device CNT has a light source that emits light in a predetermined wavelength band suitable for the exposure of the photosensitive functional layer on the substrate P and in the ultraviolet band with strong photoactivity. As the light source, for example, a laser light source that continuously oscillates or oscillates the third-order harmonic laser light (wavelength 355 nm) of YAG with pulses of several KHz to hundreds of MHz can be used.

The light source device CNT includes a laser light generation unit CU1 and a wavelength conversion unit CU2. The laser light generating unit CU1 includes a laser light source OSC and fiber amplifiers FB1 and FB2. The laser light generating unit CU1 emits a fundamental wave laser light Ls. The fiber amplifiers FB1 and FB2 amplify the fundamental wave laser light Ls with an optical fiber. The laser light generating unit CU1 causes the fundamental laser light Lr of a large amplitude to enter the wavelength conversion unit CU2. The wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a beam splitter, a polarizing beam splitter, a chirp, and the like, and by using the light (wavelength) selection part, the third high-harmonic laser wavelength 355 nm laser light is taken out. (Draw beam LB). At this time, the laser light source OSC that emits various kinds of light is pulsed in synchronization with the system clock and the like, and the light source device CNT emits a drawing beam LB with a wavelength of 355 nm as pulse light having a frequency of several KHz to hundreds of MHz. In addition, in the case of using such an optical fiber amplifier, according to the pulse driving state of the laser light source OSC, the final output laser light (Lr And LB), one pulse emission time is controlled to picosecond order.

In addition, as the light source, for example, a lamp light source such as a mercury lamp having a glow line (g-line, h-line, i-line, etc.) in the ultraviolet band, a laser diode having an oscillation peak in the ultraviolet band below 450 nm, and light emission can also be used. Solid-state light source such as a diode (LED), or KrF excimer laser (wavelength 248nm), ArF excimer laser (wavelength 193nm), XeC1 excimer laser (wavelength 308nm) that emits far ultraviolet light (DUV light) And other gas laser light sources.

Here, the drawing light beam LB emitted from the light source device CNT is projected onto the substrate P through a polarizing beam splitter PBS provided in each of the drawing units UW1 to UW5 as described later. Generally speaking, the polarizing beam splitter PBS reflects a linearly polarized light beam that is S polarized light, and transmits a linearly polarized light beam that is P polarized light. Therefore, in the light source device CNT, it is preferable that the drawing light beam LB that enters the polarizing beam splitter PBS is a laser light that emits linearly polarized light (S-polarized light). In addition, since the laser light has a high energy density, the illuminance of the light beam projected onto the substrate P can be appropriately ensured.

Next, the drawing device 11 of the exposure device EX will also be described with reference to FIG. 3. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing units UW1 to UW5. This drawing device 11 divides the drawing light beams LB emitted from the light source device CNT into plural pieces, and divides the plural drawing light beams LB along the plural pieces on the substrate P shown in FIG. 3 (for example, 5 in the first embodiment). Bars) LL1 to LL5 are collected and scanned as small spot lights (diameters of several μm). The drawing device 11 joins the patterns drawn on the substrate P by a plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a description will be given of a plurality of drawing lines LL1 to LL5 (scanning traces of point light) formed on the substrate P by scanning the drawing device LB with the drawing device 11.

As shown in FIG. 3, a plurality of lines LL1 to LL5 are drawn, sandwiching the center plane p3 in the rotation The rotating cylinder DR is arranged in two rows in the circumferential direction. An odd-numbered first drawing line LL1, a third drawing line LL3, and a fifth drawing line LL5 are arranged on the substrate P on the upstream side of the rotation direction in parallel to the Y axis, and are parallel to the Y axis on the substrate P on the downstream side of the rotation direction. The second drawing line LL2 and the fourth drawing line LL4 are arranged in even numbers.

Each of the drawing lines LL1 to LL5 is formed in the width direction (Y direction) of the substrate P, that is, substantially parallel to the rotation center line AX2 of the rotation cylinder DR, and is shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is to minimize the joining error of the pattern obtained by drawing the lines LL1 to LL5 with a plurality of drawing lines LL1 to LL5 when the substrate P is conveyed by the substrate conveying mechanism 12 at a reference speed. The extending direction (axis direction or width direction) of the rotation center line AX2 is inclined by a predetermined angle.

The odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. The even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the direction of the center line AX2. The first to fifth drawing lines LL1 to LL5 are arranged so as to cover the full width in the width direction (axis direction) of the exposure area A7 drawn on the substrate P.

The scanning direction of the spot light of the drawing light beam LB scanned along the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 is a one-dimensional direction and the same direction. In addition, the point light of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 The scanning direction is a one-dimensional direction and the same direction. At this time, the scanning direction (+ Y direction) of the point light of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, and LL5 and the scanning direction of the point light of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 ( -Y direction), as shown by the arrow in FIG. 3, is the opposite direction. This is because each of the drawing units UW1 to UW5 has the same configuration. The odd-numbered drawing units and the even-numbered drawing units are rotated 180 ° in the XY plane to face each other, and the light beams provided in each of the drawing units UW1 to UW5 are used as light beams. The scanner's rotating polygon mirror rotates in the same direction. Therefore, from the conveying direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 and the drawing start positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the Y direction with an error below the diameter of the spot light. In the same way, the drawing end positions of the odd-numbered drawing lines LL1 and LL3 and the drawing end positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the Y direction with an error below the diameter of the point light Or consistent).

As described above, each of the odd-numbered drawing lines LL1, LL3, and LL5 is arranged on the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotating cylinder DR, and is arranged in a line in the width direction of the substrate P. Each of the even-numbered drawing lines LL2 and LL4 is arranged on the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotating cylinder DR, and is arranged in a line in the width direction of the substrate P.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 includes the plurality of drawing units UW1 to UW5 described above, a branching optical system SL that diverges the drawing light beam LB from the light source device CNT to the drawing units UW1 to UW5, and a calibration detection system 31 for performing calibration.

The divergent optical system SL diverges the plural drawing beams LB emitted from the light source device CNT into a plurality of pieces, and directs the plural plural drawing beams LB to the plural drawing units UW1. ~ UW5. The divergent optical system SL includes a first optical system 41 that splits the drawing light beam LB emitted from the light source device CNT into two, a second optical system 42 that draws the light beam LB into one of the divergences of the first optical system 41, and The third optical system 43 into which the first optical system 41 diverges and another drawing beam LB enters. Further, the first optical system 41 of the branched optical system SL is provided with a beam displacement mechanism 44 for horizontally moving the drawing beam LB in a plane orthogonal to the progress axis of the drawing optical beam LB, and the third optical system SL of the branched optical system SL is provided. The optical system 43 is provided with a beam displacement mechanism 45 for horizontally moving the drawing beam LB2 in two dimensions. In the branch optical system SL, one part of the light source device CNT side is provided on the main body frame 21, and the other part of the drawing unit UW1 to UW5 side is provided on the second optical platform 25.

The first optical system 41 includes a 1/2 wavelength plate 51, a polarizer (polarizing beam splitter) 52, a beam diffuser 53, a first reflecting mirror 54, a first relay lens 55, and a second relay lens. 56. A beam displacement mechanism 44, a second reflecting mirror 57, a third reflecting mirror 58, a fourth reflecting mirror 59, and a first beam splitter 60. In addition, since it is difficult to understand the arrangement relationship of each component from FIG. 4 and FIG. 5, the description is also made with reference to the perspective view of FIG. 6.

As shown in FIG. 6, the drawing light beam LB emitted from the light source device CNT in the + X direction enters the 1/2 wavelength plate 51. The 1/2 wavelength plate 51 is rotatable within the incident surface of the drawing light beam LB. The polarization direction of the depicted light beam LB incident on the 1/2 wavelength plate 51 is a predetermined polarization direction corresponding to the rotation position (angle) of the 1/2 wavelength plate 51. The light beam LB passing through the 1/2 wavelength plate 51 is incident on the polarizer 52. The polarizing mirror 52 transmits light components of a predetermined polarization direction contained in the drawing light beam LB, and reflects light components in other polarization directions to the + Y direction. Therefore, the intensity of the depicted light beam LB reflected by the polarizer 52 can be adjusted by the rotation of the 1/2 wavelength plate 51 through the cooperative action of the 1/2 wavelength plate 51 and the polarizer 52.

Part of the drawing beam LB passing through the polarizer 52 (unwanted light component) The light is irradiated to a diffuser (light capture) 53. The diffuser 53 absorbs a part of the light component of the incident light beam LB to suppress the light component from leaking to the outside. Further, it is also used in the adjustment of various optical systems through which the drawing beam LB passes. Because the laser power is too strong at the maximum state, it is dangerous. In order to make the diffuser 53 absorb more light components of the drawing beam LB, While changing the rotation position (angle) of the 1/2 wavelength plate 51 so that the power of the drawing beam LB toward the drawing units UW1 to UW5 is greatly attenuated.

The drawing beam LB reflected in the + Y direction by the polarizer 52 is reflected in the + X direction by the first mirror 54 and passes through the first relay lens 55 and the second relay lens 56 and enters the beam displacement mechanism 44 to reach the first 2Mirror 57.

The first relay lens 55 converges the drawing light beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 causes the converged drawing light beam LB to become a parallel light beam again.

The beam displacement mechanism 44 includes, as shown in FIG. 6, two parallel plane plates (quartz) arranged along the traveling direction (+ X direction) of the beam LB. One of the parallel plane plates is arranged to be able to run parallel to the Y axis. The axis is inclined, and the other parallel plane plate is arranged so that the edge is inclined about an axis parallel to the Z axis. According to the inclination angle of each parallel plane plate, the light beam LB is laterally moved in the ZY plane and is emitted from the beam displacement mechanism 44.

Thereafter, the drawing beam LB is reflected by the second mirror 57 in the -Y direction, reaches the third mirror 58, and is reflected by the third mirror 58 in the -Z direction, and reaches the fourth mirror 59. The fourth reflecting mirror 59 reflects the drawing light beam LB in the + Y direction and enters the first beam splitter 60. The first beam splitter 60 reflects a part of the light amount components of the drawing light beam LB in the -X direction to guide the second optical system 42, and guides the remaining light amount components of the drawing light beam LB to the third optical system 43. This implementation In the form, the drawing light beam LB guided to the second optical system 42 is then distributed to three drawing units UW1, UW3, UW5, and the drawing light beam LB guided to the third optical system 43 is then allocated to two drawing units UW2 , UW4. Therefore, the ratio of the reflectance to the transmittance of the first beam splitter 60 on the light splitting surface is preferably 3: 2 (reflection 60%, transmittance 40%), but it is not necessarily necessary, and it may be 1: 1.

Here, the third reflecting mirror 58 and the fourth reflecting mirror 59 are provided at a predetermined interval on the rotation axis I of the moving mechanism 24. That is, the center line of the drawing light beam LB (parallel light beam) reflected by the third mirror 58 and directed toward the fourth mirror 59 is set to coincide with (coaxially) with the rotation axis I.

In addition, the structure including the third reflecting mirror 58 to the light source device CNT (the portion surrounded by the two-point chain line on the upper side in the Z direction in FIG. 4) is provided on the main body frame 21 side, and on the other hand, it includes the fourth reflection The configuration of the mirror 59 to the plurality of drawing units UW1 to UW5 (the part surrounded by a two-point chain line on the lower side in the Z direction in FIG. 4) is provided on the second optical table 25 side. Since the third reflecting mirror 58 and the fourth reflecting mirror 59 are provided so that the first optical stage 23 and the second optical stage 25 are relatively rotated by the moving mechanism 24, the drawing light beam LB will pass coaxially with the rotation axis I. The optical paths of the drawing beams LB of the four mirrors 59 to the first beam splitter 60 are not changed. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the moving mechanism 24, the drawing light beam LB emitted from the light source device CNT provided on the main body frame 21 side can be guided appropriately and stably to the first optical table 23. 2 A plurality of drawing units UW1 to UW5 on the optical platform 25 side.

The second optical system 42 divides the first drawing beam LB of the first optical beam splitter 60 of the first optical system 41 into the drawing light beam LB, and guides the divided light beams LB to the odd-numbered drawing units UW1, UW3, and UW5 described later. The second optical system 42 includes a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and The sixth reflector 64.

The first beam splitter 60 of the first optical system 41 is reflected by the drawing beam LB in the -X direction, is reflected by the fifth mirror 61 in the -Y direction, and enters the second beam splitter 62. A part of the drawing light beam LB that has entered the second beam splitter 62 is reflected in the -Z direction, and is guided to one of the odd-numbered drawing units UW5 (see Fig. 5). The drawn light beam LB transmitted through the second beam splitter 62 is incident on the third beam splitter 63. A part of the drawing light beam LB that has entered the third beam splitter 63 is reflected in the -Z direction, and is guided to one of the odd-numbered drawing units UW3 (see Fig. 5). A part of the drawing beam LB passing through the third beam splitter 63 is reflected by the sixth mirror 64 in the -Z direction, and is guided to one of the odd-numbered drawing units UW1 (see FIG. 5). Further, in the second optical system 42, the drawing light beams LB irradiated to the odd-numbered drawing units UW1, UW3, and UW5 are slightly inclined with respect to the -Z direction.

In addition, in order to effectively use the power of the drawing beam LB, the ratio of the reflectance and transmittance of the second beam splitter 62 is close to 1: 2, and the ratio of the reflectance and transmittance of the third beam splitter 63 is close to 1: 1 is better.

On the other hand, the third optical system 43 diverges the drawing beam LB on the other side of the first beam splitter 60 of the first optical system 41 and diverges to the even-numbered drawing units UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71, a beam displacement mechanism 45, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing beam LB transmitted through the first beam splitter 60 of the first optical system 41 in the + Y direction is reflected by the seventh mirror 71 in the + X direction, passes through the beam displacement mechanism 45, and enters the eighth mirror 72 . The beam shifting mechanism 45 is composed of two parallel flat plates (quartz) that can be tilted in the same way as the beam shifting mechanism 44 and moves the drawing beam LB advancing toward the eighth mirror 72 in the + X direction in the ZY plane.

The drawing beam LB reflected in the -Y direction by the eighth mirror 72 enters the fourth beam splitter 73. A part of the drawing light beam LB irradiated to the fourth beam splitter 73 is reflected in the -Z direction, and is guided to one even drawing unit UW4 (see FIG. 5). The drawing light beam LB transmitted through the fourth beam splitter 73 is reflected by the ninth reflector 74 in the -Z direction, and is guided to one even drawing unit UW2. In addition, in the third optical system 43, the drawing light beams LB radiated to the even-numbered drawing units UW2 and UW4 are also slightly inclined with respect to the -Z direction.

As described above, in the branching optical system SL, the plurality of rendering light beams LB from the light source device CNT are branched into a plurality of rendering units UW1 to UW5. At this time, the reflectance (transmittance) of the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 is appropriately adjusted depending on the number of divergences of the drawing beam LB. So that the light beam intensity of the drawing light beams LB irradiated to the plurality of drawing units UW1 to UW5 is the same.

The beam displacement mechanism 44 is disposed between the second relay lens 56 and the second reflector 57. The beam displacement mechanism 44 can fine-tune all positions of the drawing lines LL1 to LL5 formed on the substrate P in the μm order within the drawing surface of the substrate P.

In addition, the beam displacement mechanism 45 can fine-tune the second drawing line LL2 and the fourth drawing line LL4 of the even number among the drawing lines LL1 to LL5 formed on the substrate P in the μm order on the drawing surface of the substrate P.

Further referring to FIGS. 4, 5 and 7, a plurality of drawing units UW1 to UW5 will be described. As shown in FIG. 4 (and FIG. 1), the plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. The plurality of drawing units UW1 to UW5 are provided with the first, third, and fifth drawing lines LL1, LL3, and LL5 on the center plane p3 (the -X direction side in FIG. 5), and the first drawing unit UW1 and 3 drawing unit UW3 and 5th drawing sheet Yuan UW5. The first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at predetermined intervals in the Y direction. In addition, the plurality of drawing units UW1 to UW5 are arranged on the side (the + X direction side in FIG. 5) of the second and fourth drawing lines LL2 and LL4 with the center plane p3 interposed therebetween, and the second drawing unit UW2 and the fourth drawing unit are arranged. UW4. The second drawing unit UW2 and the fourth drawing unit UW4 are arranged at predetermined intervals in the Y direction. At this time, as shown in FIG. 2 or FIG. 5 described above, the second drawing unit UW2 is arranged between the first drawing unit UW1 and the third drawing unit UW3 in the Y direction. Similarly, the third drawing unit UW3 is arranged between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction. The fourth drawing unit UW4 is arranged between the third drawing unit UW3 and the fifth drawing unit UW5 in the Y direction. As shown in FIG. 4, the first drawing unit UW1, the third drawing unit UW3, the fifth drawing unit UW5, the second drawing unit UW2, and the fourth drawing unit UW4 are centered on the center plane p3 when viewed from the Y direction Symmetric configuration.

Next, the configuration of the optical system in each of the drawing units UW1 to UW5 will be described with reference to FIG. 4. Since the drawing units UW1 to UW5 have the same configuration, the first drawing unit UW1 (hereinafter, simply referred to as the drawing unit UW1) will be described as an example.

The drawing unit UW1 shown in FIG. 4 is for scanning the spot light of the drawing beam LB along the drawing line LL1 (the first drawing line LL1), and includes a light deflector 81, a polarizing beam splitter PBS, a 1/4 wavelength plate 82, and a scanner. 83. A bending mirror 84, an f-θ lens system 85, and a Y-power correction optical member (lens group) 86B including a cylindrical lens 86. A calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The light deflector 81 is, for example, an acoustooptic device (AOM: AcoustIic Optic Modulator). AOM is based on whether the diffraction grating is generated internally by ultrasonic waves (high frequency signals). According to this, a light switching element that switches the primary diffraction light incident to the ON state in a predetermined diffraction angle direction and the OFF state that does not generate primary diffraction light is generated.

The control unit 16 shown in FIG. 1 switches the projection / non-projection of the drawing beam LB to the substrate P at high speed by performing ON / OFF switching of the light deflector 81. Specifically, one of the drawing light beams LB allocated by the branch optical system SL passes through the relay lens 91 and is irradiated to the light deflector 81 with a slight inclination with respect to the -Z direction. When the light deflector 81 is switched OFF, the drawing light beam LB goes straight in an inclined state, and the light shielding plate 92 provided after passing through the light deflector 81 blocks light. On the other hand, when the light deflector 81 is turned ON, the drawing light beam LB (first-order diffraction light) is deflected in the -Z direction, and the light deflector 81 is irradiated onto the Z direction provided in the light deflector 81. Polarized beam splitter PBS. Therefore, when the light deflector 81 is switched on, the point light of the drawing beam LB is projected on the substrate P, and when the light deflector 81 is switched off, the point light of the drawing beam LB is not projected on the substrate P.

In addition, since the AOM is disposed at the position of the optical waist of the drawing light beam LB converged by the relay lens 91, the drawing light beam LB (primary diffraction light) emitted from the light deflector 81 diverges. To this end, a relay lens 93 is provided behind the light deflector 81 to change the divergent drawing light beam LB back to a parallel light beam.

The polarizing beam splitter PBS reflects the drawing beam LB radiated from the light deflector 81 through the relay lens 93. The drawing light beam LB emitted from the polarizing beam splitter PBS is based on a 1/4 wavelength plate 82, a scanner 83 (rotating polygon mirror), a bending mirror 84, an f-θ lens system 85, a Y-magnification correction optical member 86B, and a cylindrical surface. The order of the lens 86 advances, and the light is collected on the substrate P into scanning spot light.

On the other hand, the polarizing beam splitter PBS and the 1/4 wavelength plate 82 provided between the polarizing beam splitter PBS and the scanner 83 work in concert to project on the substrate P or a rotating cylinder DR below it. The reflected light of the drawing beam LB on the outer peripheral surface is reversely advanced in the order of the Y-magnification correction optical member 86B, the cylindrical lens 86, the f-θ lens system 85, the bending mirror 84, and the scanner 83. Light penetrates. That is, the linearly polarized laser light depicting the light beam LB series S-polarized light irradiated from the light deflector 81 to the polarization beam splitter PBS is reflected by the polarization beam splitter PBS. The drawing beam LB reflected by the polarizing beam splitter PBS passes through the 1/4 wavelength plate 82, the scanner 83, the bending mirror 84, the f-θ lens system 85, the Y-magnification correction optical member 86B, and the cylindrical lens 86. The spot light of the drawing light beam LB that is irradiated on the substrate P and condensed on the substrate P becomes circularly polarized light. The reflected light from the substrate P (or the outer peripheral surface of the rotating cylinder DR) advances in a reverse direction to the light transmission path of the drawing beam LB, and passes through the quarter-wave plate 82 again, and becomes a laser light of linearly polarized light of P polarization. Therefore, the reflected light reaching the polarizing beam splitter PBS from the substrate P (or the rotating cylinder DR) passes through the polarizing beam splitter PBS, and is irradiated to the photodetector 31Cs of the calibration detection system 31 through the relay lens 94.

As described above, the polarizing beam splitter PBS is a light splitter arranged between the scanning optical system including the scanner 83 and the calibration detection system 31. Since the calibration detection system 31 shares a part of the light-transmitting optical system that mostly sends the drawing beam LB to the substrate P, it is a simple and compact optical system.

As shown in FIGS. 4 and 7, the scanner 83 includes a reflecting mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing light beam LB (parallel light beam) passing through the 1/4 wavelength plate 82 passes through the cylindrical lens 95 and is reflected by the mirror 96 in the XY plane, and irradiates the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction with the rotation axis 97a as a center, so that the reflection angle of the drawing light beam LB (light beam modulated by the light deflector 81) on the reflecting surface 97b is within the XY plane. Continuous change, and accordingly, reflection The drawing light beam LB is condensed into point light by the bending mirror 84, the f-θ lens system 85, and the second cylindrical lens 86 (and the Y-magnification correction optical member 86B), and is drawn along the drawing line LL1 ( Similarly, scan along LL2 ~ LL5). The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 (similarly, along LL2 to LL5) of the substrate P. The origin detector 98 is arranged on the opposite side of the reflecting mirror 96 with the drawing light beam LB reflected by each reflecting surface 97b.

In FIG. 7, to simplify the description, although the origin detector 98 only shows a photodetector, in fact, an LED and a semiconductor mine are provided which project a detection beam toward a reflecting surface 97 b of a rotating polygon mirror 97 that projects the drawing beam LB. The light source for detection, such as radiation, is detected by the origin detector 98 through the fine slit through the reflection light of the detection light beam on the reflecting surface 97b.

Based on this, the origin detector 98 is set to output a pulse signal representing the origin at a certain time in the beginning of the drawing starting position of the drawing line LL1 (LL2 to LL5) on the substrate P relative to the point light.

The drawing beam LB radiated from the scanner 83 to the bending mirror 84 is reflected by the bending mirror 84 in the -Z direction, and enters the f-θ lens system 85 and the cylindrical lens 86 (and the Y-magnification correction optical member 86B).

When each reflection surface 97b of the rotating polygon mirror 97 is not strictly parallel to the center line of the rotation axis 97a, but is slightly inclined (plane inclined), the drawing lines (LL1 ~ LL5) formed by the point light projected on the substrate P, Each reflecting surface 97b is shifted in the X direction on the substrate P. Therefore, with reference to FIG. 8, with the arrangement of the two cylindrical lenses 95 and 86, the tilt of the reflecting surfaces 97 b of the rotating polygon mirror 97 is reduced and the shift of the drawing lines LL1 to LL5 in the X direction is reduced or eliminated.

The left side of FIG. 8 shows a cylindrical lens 95, a scanner 83, an f-θ lens system 85, The optical path of the cylindrical lens 86 is developed in the XY plane, and the right side of FIG. 8 shows the optical path in the XZ plane. As a basic optical configuration, the reflecting surface 97 b of the rotating polygon mirror 97 irradiated by the depicted light beam LB is arranged so as to be located at the entrance pupil position (front focus position) of the f-θ lens system 85. Based on this, the relative rotation angle θp / 2 of the relative rotating polygon mirror 97, and the incident angle of the drawing beam LB entering the f-θ lens system 85 becomes θp, which is proportional to the incident angle θp, and is determined to be projected on the substrate P (irradiated surface) The point of light is the height of the image. In addition, by arranging the reflecting surface 97b at the focal position in front of the f-θ lens system 85, the drawing beam LB projected on the substrate P becomes telecentric at any position on the drawing line (the main ray of the drawing beam of point light) Constant to the optical axis AXf of the f-θ lens system 85).

As shown in FIG. 8, the two cylindrical lenses 95 and 86 perform their functions as parallel flat glasses with zero power in the plane (XY plane) perpendicular to the rotation axis 97 a of the rotating polygon mirror 97. The Z direction (in the XZ plane) extending in the rotation axis 97a functions as a convex lens with a certain positive refractive power. Although the cross-sectional shape of the drawing beam LB (substantially parallel light beam) incident on the first cylindrical lens 95 is a circle of several mm, when the focal position of the cylindrical lens 95 in the XZ plane is set to the multi-rotation surface through the mirror 96 When the reflecting surface 97b of the mirror 97 is on the XY plane, it has a beam width of several mm, and in the Z direction, the converging slit-shaped spot light extends on the reflecting surface 97b and converges in the rotation direction.

The drawing light beam LB reflected on the reflecting surface 97b of the rotating polygon mirror 97 is a parallel light beam in the XY plane, but in the XZ plane (the direction in which the rotation axis 97a extends) becomes a divergent light beam and enters the f-θ lens system 85. . Therefore, although the drawing light beam LB emitted from the f-θ lens system 85 is approximately a parallel light beam in the XZ plane (the direction in which the rotation axis 97a extends), the second cylindrical lens 86 acts in the XZ plane. That is, on the substrate P, it extends from the drawing lines LL1 to LL5. The conveying direction of the substrate P whose direction is orthogonal is also the point light. As a result, a circular small spot light is projected on each drawing line on the substrate P.

With the arrangement of the cylindrical lens 86, as shown in the right side of FIG. 8, in the XZ plane, the reflection surface 97b of the rotating polygon mirror 97 and the substrate P (irradiated surface) can be set in an optical image conjugate relationship. Therefore, even if each reflection surface 97b of the rotating polygon mirror 97 has a tilt error with respect to a non-scanning direction (a direction in which the rotation axis 97a extends) orthogonal to the scanning direction of the drawing beam LB, the drawing lines (LL1 ~ LL5) on the substrate P The position is not shifted in the non-scanning direction of the spot light (the transport direction of the substrate P). As described above, by providing the cylindrical lenses 95 and 86 before and after rotating the polygon mirror 97, it is possible to constitute a surface tilt correction optical system for a polygonal reflecting surface in a non-scanning direction.

Here, as shown in FIG. 7, the scanners 83 of the plurality of drawing units UW1 to UW5 are symmetrically formed with respect to the center plane p3. A plurality of scanners 83. The three scanners 83 corresponding to the drawing units UW1, UW3, and UW5 are arranged on the upstream side (direction -X side in FIG. 7) of the rotation direction of the rotating cylinder DR, and are connected to the drawing units UW2 and UW4. The corresponding two scanners 83 are arranged on the downstream side (+ X direction side in FIG. 7) in the rotation direction of the rotating cylinder DR. The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 interposed therebetween. In this way, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to rotate 180 ° around the rotation axis I (Z axis). Therefore, when the three rotating polygon mirrors 97 on the upstream side rotate, for example, to the left and illuminate the drawing beam LB on the rotating polygon mirror 97, the drawing beam LB reflected by the rotating polygon mirror 97 goes from the drawing start position to the drawing end position. Scan in a predetermined scanning direction (for example, + Y direction in FIG. 7). On the other hand, when the two rotating polygon mirrors 97 on the downstream side rotate to the left and illuminate the drawing beam LB on the rotating polygon mirror 97, the drawing beam LB reflected by the rotating polygon mirror 97 goes from the drawing start position to the drawing end. Location, 3 to the upstream side The rotating polygon mirrors 97 'scan in opposite scanning directions (e.g., the -Y direction of Fig. 7).

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the odd-numbered drawing units UW1, UW3, and UW5 is in a direction consistent with the set azimuth line Le1. That is, the azimuth line Le1 is set, and in the XZ plane, it is a line connecting the odd-numbered drawing lines LL1, LL3, and LL5 and the rotation center line AX2. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing units UW2 and UW4 is the same direction as the azimuth line Le2. In other words, the azimuth line Le2 is set, and in the XZ plane, it is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2. Therefore, each traveling direction (principal light) of the drawing light beam LB projected as a point light on the substrate P is set to face the rotation center line AX2 of the rotation cylinder DR.

The Y-magnification correction optical member 86B is disposed between the f-θ lens system 85 and the substrate P. The optical component 86B for Y magnification correction enables the drawing lines LL1 to LL5 formed by the respective drawing units UW1 to UW5 to be enlarged or reduced slightly in the Y direction in equal directions.

Specifically, a penetrating parallel plane plate (quartz) covering a certain thickness of each of the drawing lines LL1 to LL5 can be mechanically bent in the direction in which the drawing line extends to make the drawing line Y-direction magnification. (Scan length) a variable mechanism, or a mechanism in which a part of the three lens systems of a convex lens, a concave lens, and a convex lens is moved in the optical axis direction so that the Y-direction magnification (scan length) of the drawn line is variable.

In the drawing device 11 configured in this manner, the control unit 16 controls each unit to draw a predetermined pattern on the substrate P. That is, the control unit 16 performs ON / OFF adjustment of the light deflector 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. According to this, the drawing light beam LB is deflected, so that the substrate P A pattern is drawn on the light-sensing layer. In addition, the control unit 16 synchronizes the scanning direction of the drawing beam LB scanned along the drawing line LL1 with the movement of the substrate P to the conveying direction by the rotation of the rotating cylinder DR, and accordingly corresponds to the portion of the drawing line LL1 in the exposure area A7. Draw a predetermined pattern.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 9. The alignment microscopes AM1 and AM2 detect alignment marks formed on the substrate P in advance, or reference marks and reference patterns formed on the rotating cylinder DR. Hereinafter, the alignment marks of the substrate P and the reference marks and reference patterns of the rotating cylinder DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used for aligning the positions of the substrate P and a predetermined pattern drawn on the substrate P, or the calibration of the rotating cylinder DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are positioned more upstream than the drawing lines LL1 to LL5 formed by the drawing device 11 in the rotation direction (the conveying direction of the substrate P) of the rotating cylinder DR. The alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotating cylinder DR than the alignment microscope AM2.

The aiming microscopes AM1 and AM2 are object lens systems GA (see FIG. 9 which are representative lenses only) as detection probes that project illumination light onto the substrate P or the rotating cylinder DR and emit the light generated by the mark. Quasi-microscope AM2 (objective lens system GA4), and a photography system that captures images (bright field image, dark field image, fluorescent image, etc.) of the mark received by the objective lens system GA (bright field image, dark field image, fluorescent image, etc.) GD (only representative display GD4 of the alignment microscope AM2 in FIG. 9). In addition, the illumination light for alignment is light in a wavelength band that has almost no sensitivity to the light-sensing layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

A plurality of alignment microscopes AM1 (for example, three) are arranged in a row in the Y direction (the width direction of the substrate P). Similarly, align the microscope AM2 in the Y direction (the substrate P A plurality of (for example, three) are arranged in a row in a width direction. That is, a total of six alignment microscopes AM1 and AM2 are provided.

In FIG. 3, for ease of understanding, the configuration of each pair of objective lens systems GA1 to GA3 of the three alignment microscopes AM1 is shown in the pair of objective lens systems GA of the six alignment microscopes AM1 and AM2. Each pair of objective lenses of the three alignment microscopes AM1 are GA1 ~ GA3 on the observation area (detection position) Vw1 ~ Vw3 on the substrate P (or the outer peripheral surface of the rotating cylinder DR), as shown in FIG. The center line AX2 is parallel to the Y direction and is arranged at a predetermined interval. As shown in FIG. 9, the optical axes La1 to La3 of the object lens systems GA1 to GA3 passing through the centers of the respective observation areas Vw1 to Vw3 are parallel to the XZ plane. Similarly, the observation areas Vw4 to Vw6 on the pair of objective lenses of the three alignment microscopes AM2, GA, and the substrate P (or the outer peripheral surface of the rotating cylinder DR) are parallel to the rotation center line AX2, as shown in FIG. The Y direction is arranged at predetermined intervals. As shown in FIG. 9, the optical axes La4 to La6 of the object lens systems GA passing through the centers of the respective observation areas Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating cylinder DR.

The observation areas Vw1 to Vw6 of the alignment marks AM1 and AM2 on the marks are on the substrate P and the rotating cylinder DR, and are set, for example, in a range of 500 to 200 μm diagonally. Here, the optical axes La1 to La3 of the microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA, are set so as to correspond to the installation azimuth lines extending from the rotation center line AX2 in the radial direction of the rotating cylinder DR. Le3 is in the same direction. In this way, the azimuth line Le3 is set, and when viewed in the XZ plane of FIG. 9, it is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA, are set so as to extend from the rotation center line AX2 to the radial direction of the rotating cylinder DR. The bearing line Le4 is in the same direction. In this way, the azimuth line Le4 is set, and when viewed in the XZ plane of FIG. 9, it is a line connecting the observation area Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2. At this time, since the alignment microscope AM1 is disposed on the upstream side of the rotation direction of the rotating cylinder DR compared with the alignment microscope AM2, the angle formed by the center plane p3 and the installation azimuth line Le3 is more than the center plane p3 and the installation azimuth line. Le4 makes a big angle.

On the substrate P, as shown in FIG. 3, the exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at predetermined intervals in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter, referred to as marks) for position alignment are formed in a cross shape, for example.

In FIG. 3, the marks Ks1 are arranged at a certain interval in the X direction in the peripheral area on the -Y side of the exposure area A7, and the marks Ks3 are arranged at a certain interval in the X direction in the peripheral area on the + Y side of the exposure area A7. Further, the mark Ks2 is set in the center of the Y direction in a blank area between two adjacent exposure areas A7 in the X direction.

The mark Ks1 is within the observation area Vw1 of the objective lens GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens GA of the alignment microscope AM2, and can be sequentially captured during the transfer of the substrate P Way of forming. The mark Ks3 is within the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and the observation area Vw6 of the objective lens system GA of the alignment microscope AM2. The order capture method is formed. Further, Ks2 is marked within the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA2 of the alignment microscope AM2, respectively, during the transfer of the substrate P. Formed in order to capture.

Therefore, the Y of the rotating cylinder DR in the three alignment microscopes AM1 and AM2 The alignment microscopes AM1 and AM2 on both sides of the direction can observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P at any time. In addition, the three alignment microscopes AM1 and AM2 of the alignment microscopes AM1 and AM2 in the Y-direction center of the rotating cylinder DR among the alignment microscopes AM1 and AM2 can observe or detect the gaps between the exposure areas A7 formed on the substrate P at any time. The mark of the Ministry is Ks2.

Here, since the exposure device EX is a so-called multi-beam type drawing device, a plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 are appropriately joined to each other in the Y direction. It is necessary to calibrate the joint accuracy of the plurality of drawing units UW1 ~ UW5 within the allowable range. In addition, the relative positional relationship of the alignment microscopes AM1 and AM2 to the observation areas Vw1 to Vw6 of the respective drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 must be accurately calculated with reference line management. For this baseline management, calibration is also required.

In the calibration for confirming the joint accuracy of the plurality of drawing units UW1 to UW5 and the calibration for the reference line management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotating cylinder DR supporting the substrate P must be Set a reference mark or reference pattern. Therefore, as shown in FIG. 10, the exposure device EX uses a rotating cylinder DR provided with a reference mark or a reference pattern on the outer peripheral surface.

As shown in FIGS. 3 and 9, the rotating cylinder DR is formed with scale portions GPa and GPb constituting a part of a rotation position detecting mechanism 14 described later, as shown in FIGS. 3 and 9. In addition, the rotating cylinder DR is provided inside the scale portions GPa and GPb, and is provided with narrow-shaped restriction bands CLa and CLb composed of concave grooves or convex edges on the entire circumference. The width in the Y direction of the substrate P is set so that the Y-direction interval between the two restriction bands CLa and CLb is small. The substrate P is in the outer peripheral surface of the rotating cylinder DR and is closely attached to the inner region sandwiched by the restriction bands CLa and CLb. While being supported.

The rotating cylinder DR is provided with a plurality of line patterns RL1 (line patterns) inclined to the rotation center line AX2 by +45 degrees on the outer peripheral surface sandwiched by the restriction bands CLa and CLb, and- A plurality of line patterns RL2 (line patterns) inclined at 45 degrees are repeatedly engraved into a grid-like reference pattern (also used as a reference mark) RMP at a certain pitch (period) Pf1, Pf2. The width of the line patterns RL1 and RL2 is LW.

The reference pattern RMP is a uniform uniform oblique pattern (oblique grid pattern) in order to avoid changes in friction between the substrate P and the outer peripheral surface of the rotating cylinder DR or the tension of the substrate P. In addition, the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be formed in a grid-like pattern in parallel with the Y axis and the line pattern RL2 in parallel with the X axis. In addition, it is not necessary to cross the line patterns RL1 and RL2 at 90 degrees, and a rectangular area surrounded by two adjacent line patterns RL1 and two adjacent line patterns RL2 may be made into a square (or rectangle). Lines RL1 and RL2 intersect at an angle other than the rhombus.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4 and 9. As shown in FIG. 9, the rotational position detection mechanism 14 is an object that optically detects the rotational position of the rotary cylinder DR, and an encoder system using, for example, a rotary encoder can be applied. The rotation position detecting mechanism 14 is provided with a scale portion GPa and GPb provided at both ends of the rotating cylinder DR, and a plurality of encoder read heads EN1, EN2, EN3, and EN4 opposite to the scale portions GPa and GPb. Mobile measuring device. In Figs. 4 and 9, only the four encoder read heads EN1, EN2, EN3, and EN4 facing the scale portion GPa are shown, but the encoder read heads EN1, which are arranged in the same direction, are also provided in the scale portion GPb. EN2, EN3, EN4. The rotation position detecting mechanism 14 is a displacement meter YN1, YN2, YN3, and YN4 that can detect displacement (small displacement in the Y direction extending from the rotation center line AX2) of both ends of the rotation cylinder DR.

The scales of the scale portions GPa and GPb are formed in a ring shape on the entire outer circumferential surface of the rotating cylinder DR. The scale portions GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating cylinder DR, and are configured as incremental scales. Therefore, the scale portions GPa and GPb rotate integrally with the rotation cylinder DR around the rotation center line AX2.

The substrate P is inside the scale portions GPa and GPb avoiding both ends of the rotating cylinder DR, that is, it is wound inside the restriction bands CLa and CLb. If a strict arrangement relationship is required, the outer peripheral surface of the scale portion GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotating cylinder DR are set to be the same surface (the same radius from the center line AX2). In order to achieve this, the outer peripheral surface of the scale portion GPa and GPb may be made thicker in the radial direction with respect to the outer peripheral surface for substrate winding of the rotating cylinder DR to the substrate P. Therefore, the outer peripheral surface of the scale portions GPa and GPb formed in the rotating cylinder DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder read heads EN1, EN2, EN3, and EN4 can detect the scale portions GPa and GPb in the same radial position as the drawing surface wound on the substrate P of the rotary cylinder DR, reducing the measurement position and processing position due to rotation. Abbe error caused by the different radial directions of the system.

The encoder read heads EN1, EN2, EN3, and EN4 are respectively arranged around the scale portions GPa and GPb as viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotating cylinder DR. The encoder read heads EN1, EN2, EN3, and EN4 are connected to the control unit 16. The encoder read heads EN1, EN2, EN3, and EN4 project measuring beams toward the GPa and GPb of the scale, and perform photoelectric detection on their reflected beams (diffracted light), thereby detecting changes in the circumferential position of the corresponding GPa and GPb of the scale. A signal (for example, a two-phase signal having a 90-degree phase difference) is output to the control section 16. The control unit 16 performs digital processing by interpolating the detection signal with a counting circuit (not shown). That is, the angular change of the rotating cylinder DR, that is, the circumferential position change of the outer peripheral surface thereof can be measured with the resolution of the sub-micron. The control unit 16 may also measure the transfer speed of the substrate P from the angle of the rotating cylinder DR.

As shown in FIGS. 4 and 9, the encoder read head EN1 is disposed on the installation azimuth line Le1. The azimuth line Le1 is set in the XZ plane and is a line connecting the measurement beam of the encoder read head EN1 to the projection area (reading position) on the scale portion GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le1 is provided and is located in the XZ plane and connects the drawing lines LL1, LL3, and LL5 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN1 and the rotation center line AX2, and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth line.

Similarly, as shown in FIG. 4 and FIG. 9, the encoder read head EN2 is arranged on the set azimuth line Le2. The azimuth line Le2 is set in the XZ plane and connects the measurement beam of the encoder read head EN2 to the projection area (reading position) on the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le2 is provided, which is located in the XZ plane, and connects the drawing line LL2, LL4 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 are the same azimuth line.

As shown in FIGS. 4 and 9, the encoder read head EN3 is arranged on the installation azimuth line Le3. The azimuth line Le3 is set in the XZ plane and connects the measurement beam of the encoder read head EN3 to the projection area (reading position) on the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le3 is provided in the XZ plane, and connects the alignment microscope AM1 with the observation area Vw1 to Vw3 of the substrate P and the line of the rotation center line AX2. From the above, even The reading position of the encoder read head EN3 and the line of the rotation center line AX2, and the line connecting the observation area Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same azimuth line when viewed in the XZ plane.

Similarly, as shown in FIG. 4 and FIG. 9, the encoder read head EN4 is arranged on the set azimuth line Le4. The azimuth line Le4 is set in the XZ plane and connects the measurement beam of the encoder read head EN4 to the projection area (reading position) on the scale portion GPa (GPb) and the rotation center line AX2. As described above, the azimuth line Le4 is provided in the XZ plane, and connects the alignment microscope AM2 with the observation area Vw4 to Vw6 of the substrate P to the line of the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN4 and the rotation centerline AX2, and the line connecting the observation area Vw4 ~ Vw6 of the alignment microscope AM2 and the rotation centerline AX2 are the same when viewed in the XZ plane. Bearing line.

When setting the orientation of the encoder read heads EN1, EN2, EN3, EN4 (the angle direction in the XZ plane with the rotation center line AX2 as the center), set the orientation indicated by the orientation lines Le1, Le2, Le3, Le4, such as As shown in FIG. 4, the plurality of drawing units UW1 to UW5 and the encoder read heads EN1 and EN2 are arranged to set the azimuth lines Le1 and Le2 at an angle ± θ ° with respect to the center plane p3. The set azimuth line Le1 and the set azimuth line Le2 are set in a state where the encoder read head EN1 and the encoder read head EN2 are spatially non-interfering around the scale of the scale portion GPa (GPb).

The displacement gauges YN1, YN2, YN3, and YN4 are respectively arranged around the scale portion GPa or GPb when viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotating cylinder DR. The displacement gauges YN1, YN2, YN3, and YN4 are connected to the control unit 16.

The displacement gauges YN1, YN2, YN3, and YN4 can be reduced in size by performing displacement detection at positions as close to the drawing surface as possible on the drawing surface of the substrate P wound around the rotating cylinder DR. Abbe error. The displacement gauges YN1, YN2, YN3, and YN4 project the measurement beam toward one of the two ends of the rotating cylinder DR, and perform a photoelectric detection on the reflected beam (or the diffracted light) to thereby correspond to the corresponding rotating cylinder DR. The detection signals of the position change in the Y direction (the width direction of the substrate P) of the both end portions are output to the control portion 16. The control unit 16 can digitally process the detection signal with a measurement circuit (counter circuit or interpolation circuit, etc.) (not shown) to measure the Y direction of the rotating cylinder DR (and the substrate P) with a resolution of submicron. The change of position. The control unit 16 may also measure the offset rotation of the rotary cylinder DR from a change in one of both ends of the rotary cylinder DR.

The displacement gauges YN1, YN2, YN3, and YN4, although only one of the four is sufficient, in order to measure the offset rotation of the rotating cylinder DR, etc., as long as there are three or more of the four, the rotation circle can be grasped One surface of both ends of the barrel DR moves (dynamic tilt change, etc.). In addition, if the marks or patterns on the measurement substrate P (or the marks on the rotating cylinder DR, etc.) fixed by the control unit 16 can be aligned with the microscopes AM1 and AM2, the displacement gauges YN1, YN2, YN3, and YN4 may be omitted. .

Here, the control unit 16 uses the encoder read heads EN1 and EN2 to detect the rotation angle positions of the scale unit (rotary cylinder DR) GPa and GPb, and performs drawing units using odd and even numbers based on the detected rotation angle positions. Drawing of UW1 ~ UW5. That is, the control unit 16 performs ON / OFF adjustment of the light deflector 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction, but also The timing of ON / OFF modulation using the light deflector 81 can be performed according to the detected rotation angle position, that is, a pattern can be drawn on the light sensing layer of the substrate P with good accuracy.

In addition, the control unit 16 can store the alignment marks Ks1 to Ks3 on the inspection substrate P by aligning the microscopes AM1 and AM2, and measure the encoders EN3 and EN4 to measure the scales. The rotation angle positions of GPa and GPb (rotating cylinder DR) can determine the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotation angle positions of the rotating cylinder DR. Similarly, the control unit 16 stores the reference patterns RMP on the rotating cylinder DR by aligning the microscopes AM1 and AM2, and the scale portions GPa and GPb (rotating cylinder DR) detected by the encoder read heads EN3 and EN4. For the rotation angle position, the correspondence relationship between the position of the reference pattern RMP on the rotation cylinder DR and the rotation angle position of the rotation cylinder DR can be obtained. As described above, the alignment microscopes AM1 and AM2 can accurately measure the rotation angle position (or the circumferential position) of the rotating cylinder DR at the moment of sampling the mark in the observation areas Vw1 to Vw6. In the exposure device EX, the alignment (alignment) of the substrate P with a predetermined pattern drawn on the substrate P, or the calibration of the rotating cylinder DR and the drawing device 11 is performed based on the measurement result.

In addition, the actual sampling is at the position of the rotation angle of the rotating cylinder DR measured by the encoder read heads EN3 and EN4, and becomes the position of the mark on the substrate P or the reference pattern RMP on the rotating cylinder DR, which is roughly known in advance. At the corresponding angular position, the image information output from the GD of each of the photography systems G1 and AM2 of the alignment microscope is written into the image memory at a high speed. That is, the rotation angle position of the rotating cylinder DR measured by the encoder read heads EN3 and EN4 is used as a trigger to sample the image information output from each photography system GD. In addition, different from this, there are pulses that respond to clock signals of a certain frequency. The rotation angle position (counting measurement value) of the rotating cylinder DR measured by the encoder read heads EN3 and EN4 and the GD from each photography department. The method of sampling the output image information at the same time.

In addition, the mark on the substrate P and the reference pattern RMP on the rotating cylinder DR are moved in one direction relative to the observation areas Vw1 to Vw6, and are used as the CCD or CMOS when sampling the image information output from each photography system GD. The photographic element uses the faster shutter speed. good. With this, the brightness of the illumination light in the illumination observation areas Vw1 ~ Vw6 must also be increased. As an illumination light source for the alignment microscopes AM1 and AM2, a flash or high-brightness LED can also be considered.

11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on a substrate. The drawing units UW1 to UW5 scan the spot light of the drawing beam LB along the drawing lines LL1 to LL5, and thereby draw the patterns PT1 to PT5. The drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start points PTa of the patterns PT1 to PT5. The drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 are the drawing terminals PTb of the patterns PT1 to PT5.

The drawing start point PTa of the pattern PT1 and the drawing terminal PTb of the drawing terminal PTb are joined to the drawing terminal PTb of the pattern PT2. Similarly, the drawing start point PTa of the pattern PT2 is joined to the drawing start point PTa of the pattern PT3, the drawing terminal PTb of the pattern PT3 is connected to the drawing terminal PTb of the pattern PT4, and the drawing start point PTa of the pattern PT4 is connected to the drawing start point PTa of the pattern PT5. In this way, the patterns PT1 to PT5 drawn on the substrate P are bonded to each other in the width direction of the substrate P as the substrate P moves in the long direction, and an element pattern is drawn in the entire large exposure area A7.

FIG. 12 is an explanatory diagram showing a relationship between a point light for drawing a light beam and a drawing line. Among the drawing units UW1 to UW5, the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 are representatively explained. Since the drawing lines LL3 to LL5 of the drawing units UW3 to UW5 are also the same, the description thereof is omitted. By rotating the polygon mirror 97 at a constant speed, the beam spot light SP of the drawing beam LB is drawn along the drawing lines LL1 and LL2 on the substrate P, and the drawing from the drawing start position OC1, OC2 to the drawing end position EC1, EC2 is scanned. The length of the line LBL.

Generally, in the direct-exposure exposure method, even when the device draws a pattern of the smallest size that can be exposed, it uses a multiple exposure (multiple writing) of a plurality of spot lights SP to achieve high-precision and stable pattern drawing. As shown in FIG. 12, light is set on the drawing lines LL1 and LL2 When the effective diameter of SP is Xs, since the drawing light beam LB is pulsed light, the point light SP generated by one pulse light (emission time of picosecond order) and the point light SP generated by the next pulse light are based on diameter. The Xs is scanned at a distance of about 1/2 of the CXs in the Y direction (main scanning direction).

In addition, at the same time as the main scanning of the spot light SP along the respective drawing lines LL1 and LL2, the substrate P is transported at a constant speed in the + X direction. Therefore, each of the drawing lines LL1 and LL2 moves on the substrate P at a certain distance in the X direction ( Secondary scan). This distance is also set here as about 1/2 distance CXs of the diameter Xs of the spot light SP, but is not limited thereto. Accordingly, in the sub-scanning direction (X direction), the spot lights SP adjacent to each other in the X direction at a distance of 1/2 of the diameter Xs (or other overlapping distances may be used) are overlapped and exposed. Further, the beam spot light SP emitted at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP emitted at the drawing end position EC2 of the drawing line LL2 are moved along the substrate P in a long direction (that is, (Sub-scan) Set the drawing start position OC1 and the drawing end position EC1 of the drawing line LL1 and the drawing start position OC2 and the drawing end position EC2 of the drawing line LL1 in such a manner that the width direction (Y direction) of the substrate P is joined with the overlapping distance CXs. .

For example, when the effective diameter Xs of the beam spot light SP is set to 4 μm, a total of 4 spot lights with 2 columns × 2 rows of the spot light SP (overlapping in the two directions of the main scanning and the sub-scanning) can be well exposed. ) Occupied area, or a pattern with a minimum size of 3 columns × 3 rows (a total of 9 spot lights arranged in the two directions of the main scan and the sub scan), that is, a minimum size of about 6 μm to 8 μm Line width pattern. When the reflecting surface 97b of the rotating polygon mirror 97 is 10 planes, and the rotation speed of the rotating polygon mirror 97 around the rotation axis 97a is 10,000 rpm or more, the drawing line (LL1 ~ LL5) by the rotating polygon mirror 97 can be made. The number of scanning times of the spot light SP (drawing beam LB) (set the scanning frequency Fms) is 1666.66 ... Hz or more. This department represents On P, a pattern of 1666 or more drawing lines is drawn in the conveying direction (X direction) every 1 second. Therefore, if the conveying distance (conveying speed) of the substrate P per second becomes slow, the overlapping distance CXs of the spot lights in the sub-scanning direction (X direction) can be set to a value less than 1/2 of the spot light's diameter Xs. For example, 1/3, 1/4, 1/5, .... In this case, the same drawing pattern is exposed by multiple scanning of the point light along the drawing line, which can increase the exposure of the photosensitive layer provided to the substrate P.

In addition, when the transfer speed of the substrate P driven by the rotation of the rotary cylinder DR is about 5 mm / s, the X direction of the drawing line LL1 (the same is true for LL2 to LL5) shown in FIG. 12 (the transfer direction of the substrate P) The distance (distance CXs) is about 3 μm.

In the case of this embodiment, the resolution R of the pattern drawing in the main scanning direction (Y direction) is determined by the effective diameter Xs of the spot light SP and the scanning frequency Fms, and the acousto-optic element (AOM) constituting the light deflector 81. Determine the minimum ON / OFF switching time. As an acousto-optic element (AOM), when the highest response frequency Fss = 50MHz is used, the time between the ON state and the OFF state can be approximately 20nS. Furthermore, since the effective scanning period of the drawing beam LB by rotating the reflective surface 97b of the polygon mirror 97 (point light scanning by the length of the drawing line LBL), it is 1/1/1 of the rotation angle of the reflecting surface 97b. 3 degree, so when the length LBL of the drawing line is set to 30mm, the resolution R depends on the switching time of the light deflector 81, which is R = LBL / (1/3) / (1 / Fms) × (1 / Fss) ≒ 3 μm.

From this relationship, in order to improve the resolution R of the pattern drawing, for example, the acousto-optic element (AOM) of the light deflector 81 uses the highest response frequency Fss of 100 MHz, and the ON / OFF switching time is set to 10 nsec. According to this, the resolution R becomes half of 1.5 μm. In this case, the transfer speed of the substrate P by the rotation of the rotary cylinder DR is set to half. As another method for improving the resolution R, for example, the rotation speed of the rotary polygon mirror 97 may be increased.

Generally, the photoresist used in the lithography process is a photoresist having a sensitivity Sr of about 30 mj / cm ² . Let the transmittance ΔTs of the optical system be 0.5 (50%), the effective scanning period in one reflective surface 97b of the rotating polygon mirror 97 is 1/3 degree, the length of the drawing line LBL is 30mm, and the drawing units UW1 to UW5 If the number Nuw is 5, and the transfer speed Vp of the substrate P of the rotating cylinder DR is 5 mm / s (300 mm / min), the laser power Pw required by the light source device CNT can be estimated by the following formula.

Pw = 30/60 × 3 × 30 × 5 / 0.5 / (1/3) = 1350mW

It is assumed that when there are seven drawing units, the laser power Pw required by the light source device CNT is as follows.

Pw = 30/60 × 3 × 30 × 7 / 0.5 / (1/3) = 1890mW

For example, if the photoresistance is about 80 mj / cm ² , in order to perform exposure at the same speed, a light source device CNT of about 3 to 5 W is required as the beam output. Instead of using such a high-power light source, if the conveying speed Vp of the substrate P by the rotation of the rotating cylinder DR is reduced from 5mm / s to 30/80 from the initial value, the beam output can also be used from 1.4 to 1.9W. Light source device for exposure.

In addition, if the length LBL of the drawn line is 30 mm, and the point diameter Xs of the beam spot light SP and the light switching between the acousto-optic element (AOM) of the light deflector 81 and the light-decomposing capacity are determined (the minimum grid for specifying the beam position) (grid), equivalent to 1 pixel. When Xg is equal to 3 μm, set the rotation speed of the 10-face rotating polygon mirror 97 to 10,000 rpm. The time of 1 rotation of the rotating polygon mirror 97 is 3/500 seconds. When the effective scanning period of one reflecting surface 97b of the mirror 97 is 1/3 of the rotation angle of one reflecting surface 97b, the effective scanning time Ts (second) of one reflecting surface 97b is (3/500) × ( 1/10) × (1/3), it is about Ts = 1/5000 (second). According to this, the pulse emission frequency Fz when the light source device CNT is a pulsed laser can be obtained by Fz = LBL / (Ts‧Xs), and Fz = 50MHz is the lowest frequency. Therefore, in the embodiment, a light source device CNT that outputs a pulse laser with a frequency of 50 MHz or more is required. In view of this, the light emission frequency Fz of the light source device CNT is preferably more than twice (for example, 100 MHz) the highest response frequency Fss (for example, 50 MHz) of the acousto-optic element (AOM) of the light deflector 81.

Further, the driving signal for switching the acousto-optic element (AOM) of the light deflector 81 to the ON state / OFF state is to prevent the acousto-optic element (AOM) from transitioning from the ON state to the OFF state, or from the OFF state to the It is preferable to perform control to synchronize the light source device CNT with the clock signal oscillating at the pulse light emission frequency Fz during the ON state.

Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse light emission frequency Fz of the light source device CNT will be described from the viewpoint of the beam shape (the intensity distribution of the two spot lights SP overlapping) using the graph in FIG. 13. The horizontal axis of FIG. 13 represents the position of the spot light SP in the Y direction along the drawing line, or the X direction of the substrate P in the transport direction, or the size of the spot light SP. The vertical axis represents the peak value of the spot light SP. The intensity is normalized to a relative intensity value of 1.0. Here, it is assumed that the intensity distribution of the individual spot light SP is J1, and a Gaussian distribution is used for explanation.

In FIG. 13, the intensity distribution J1 of the individual spot light SP is set to have a diameter of 3 μm at a relative peak intensity of 1 / e ² . The intensity distributions J2 to J6 are simulation results showing the integrated intensity distribution (contour) obtained on the substrate P when the two pulses of the spot light SP are irradiated at staggered positions in the main scanning direction or the sub-scanning direction, respectively. Make the position shift amount (distance distance) different.

In the graph of FIG. 13, the intensity distribution J5 shows a point SP error of 2 pulses In the case of opening the same separation distance as the diameter of 3 μm, the case where the intensity distribution J4 is 2 points of 2 pulses of light SP is 2.25 μm, the case of the intensity distribution J3 is 2 points of 2 pulses of light SP is 1.5 μm . From the changes in the intensity distribution J3 to J5, it can be clearly seen that in the case of the intensity distribution J5 and the point light SP with a diameter of 3 μm is irradiated at 3 μm intervals, the accumulated outline is the highest tumor shape at the center of each of the two point lights. At the mid-point position of the 2 spot lights, the normalized intensity can only obtain 0.3 degrees. On the other hand, when the spot light SP with a diameter of 3 μm is irradiated at an interval of 1.5 μm, the outline calculated when the spot light SP is radiated has a clear nodular distribution in the outline, and the positions of the dots between the two spot lights are substantially flat.

In addition, in FIG. 13, the intensity distribution J2 is an integrated profile when the interval distance of the two-pulse point light SP is set to 0.75 μm, and the intensity distribution J6 is the interval distance set to half of the intensity distribution J1 of the individual point light SP. The integrated profile at the full width (FWHM) of 1.78 μm.

As described above, under the condition that the pulse oscillation of two spot lights is irradiated at the same distance as the diameter Xs of the spot light SP and the short distance CXs, two tumor-like distributions tend to appear significantly, so it is best to set it as Optimal separation distance without causing uneven intensity (deterioration of drawing accuracy) during exposure. As shown in the intensity distribution J3 or J6 of FIG. 13, it is better to overlap the distance CXs at a half degree (for example, 40 to 60%) of the diameter Xs of the single spot light SP. This optimal separation distance CXs can be adjusted in the main scanning direction by the pulse light emission frequency Fz of the light source device CNT and the scanning speed or scanning time Ts of the point light SP along the drawing line (the rotational speed of the rotating polygon mirror 97) At least one is set, and in the sub-scanning direction, it can be set by adjusting at least one of the scanning frequency Fms (the rotation speed of the rotary polygon mirror 97) and the X-direction moving speed of the substrate P in the drawing line.

For example, the absolute value of the rotation speed of the rotating polygon mirror 97 cannot be adjusted with high accuracy. (Scanning time Ts of the point light), by finely adjusting the pulse light emission frequency Fz of the light source device CNT, the ratio of the distance CXs between the point light SP in the main scanning direction and the diameter Xs (size) of the point light can be adjusted. And adjust to the best range.

As described above, when the two spot lights SP are overlapped in the scanning direction, that is, when Xs> CXs, the light source device CNT sets the relationship between the pulse light emission frequency Fz and Fz> LBL / (Ts‧Xs) to satisfy Fz = LBL / (Ts‧CXs). For example, when the pulsed light emission frequency Fz of the light source device CNT is 100 MHz, when the rotating polygon mirror 97 is set to 10 surfaces and rotated at 10,000 rpm, the effect of the point light specified by 1 / e ² or full width at half maximum (FWHM) The diameter Xs is 3 μm, and a pulsed laser beam (spot light) from each of the drawing units UW1 to UW5 can be irradiated on each of the drawing lines LL1 to LL5 at intervals of about 1.5 μm (CXs), which is about half the diameter Xs. According to this, the uniformity of the exposure amount during pattern drawing is improved, and even a fine pattern can obtain a faithful exposure image (photoresist image) based on drawing data, thereby achieving high-precision drawing.

Further, the decomposition capability (the highest response frequency Fss) determined by the light switching speed of the acousto-optic element (AOM) and the pulse oscillation frequency Fz of the light source device CNT, if h is an arbitrary integer, it must be converted into position or time The integer multiple relationship must be the relationship of Fz = h‧Fss. This is to prevent the light switching timing of the acousto-optic element (AOM) from being turned on / off during the pulsed beam emitted from the light source device CNT.

The exposure device EX of the first embodiment is a light source device CNT using a pulsed laser light source combining a fiber amplifier FB1, FB2 and a wavelength conversion element of the wavelength conversion unit CU2, so it is in the ultraviolet wavelength band (400 to 300 nm). It is easy to obtain such pulsed light with high oscillation frequency.

In addition, the light switching of the acousto-optic element (AOM) is based on the pattern to be drawn. Dividing is performed, for example, in a pixel unit of 3 μm × 3 μm, and “0” and “1” are used to indicate whether or not each pixel unit is irradiated with a bit string (drawing data) of a pulse beam. When the length LBL of the drawing line is 30mm, the number of pixels in one scan of the point light becomes 10,000 pixels, and the acousto-optical element (AOM) has the responsiveness to switch the bit array of 10,000 pixels during the scanning time Ts ( Response frequency Fss). On the other hand, the adjacent point lights in the main scanning direction set the pulse oscillation frequency Fz to each other, for example, so as to overlap the diameter Xs by about 1/2. Therefore, in the above-mentioned relational expression Fz = h‧Fss, the relationship between setting the pulse oscillation frequency Fz and the response frequency Fss of the light switching of the acousto-optic element (AOM) is better with the integer h being 2 or more, that is, Fz> Fss.

Next, a method of adjusting the drawing device 11 of the exposure device EX will be described. FIG. 14 is a flowchart of a method of adjusting the exposure apparatus according to the first embodiment. 15 is an explanatory diagram schematically showing a relationship between a reference pattern of a rotating cylinder and a drawing line. FIG. 16 is an explanatory diagram schematically showing a signal output from a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a bright field of light. The control unit 16 rotates the rotating cylinder DR as shown in FIG. 15 in order to perform calibration for grasping the positional relationship of the plurality of drawing units UW1 to UW5. By rotating the cylinder DR, a light-transmitting substrate P that depicts the degree of light beam LB penetration can be carried.

As described above, the reference pattern RMP is integrated with the outer peripheral surface of the rotating cylinder DR. As shown in FIG. 15, among the reference patterns RMP, an arbitrary reference pattern RMP1 moves as the outer peripheral surface of the rotating cylinder DR moves. Therefore, after the reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5, it passes through the drawing lines LL2 and LL4. For example, the control unit 16 scans the drawing beams LB of the drawing units UW1, UW3, and UW5 after the same reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5. The control unit 16 scans the drawing beams LB of the drawing units UW2 and UW4 after the same reference pattern RMP1 passes through the drawing lines LL2 and LL4 (step S1). Therefore, the reference pattern RMP1 That is, it becomes a reference for grasping the positional relationship of the drawing units UW1 to UW5.

The photodetector 31Cs (FIG. 4) of the calibration detection system 31 described above detects the reflected light from the reference pattern RMP1 through the scanning optical system including the f-θ lens system 85 and the scanner 83. The photo sensor 31Cs is connected to the control unit 16, and the control unit 16 detects a detection signal of the photo sensor 31Cs (step S2). For example, the drawing units UW1 to UW5 draw one line LL1 to LL5, and scan each of the plurality of drawing beams LB in a plurality of rows in a predetermined scanning direction.

For example, as shown in FIG. 16, the drawing units UW1 to UW5 draw the drawing beam length LB from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR (see FIG. Figure 1) Scans SC1 on the first line. Next, the drawing units UW1 to UW5 perform the second drawing line length LBL (see FIG. 12) along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR from the drawing start position OC1. Line scan SC2. Next, the drawing units UW1 to UW5 perform the third drawing line length LBL (see FIG. 12) of the drawing light beam LB along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR from the drawing start position OC1. Line scan SC3.

Since the rotating cylinder DR rotates around the rotation center line AX2, the X-direction position of the first line scan SC1, the second line scan SC2, and the third line scan SC3 on the reference pattern RMP1 is different from ΔP1 and ΔP2. In addition, the control unit 16 may perform scanning of the drawing beam LB along the first line SC1 while the rotating cylinder DR is stationary, and then, after rotating the rotating cylinder DR by ΔP1 minutes, stand still, and perform Scanning of the drawing beam LB of the second line scan SC2, and then rotating the rotating cylinder DR again by ΔP2, and then stopping, scanning the drawing beam LB along the third line of scanning SC3, and a program for moving each part in this order.

As described above, the reference pattern RMP is set to be formed on the rotating cylinder DR The intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other on the outer peripheral surface are shorter than the length LBL of the drawing line. Therefore, when the drawing light beam LB of the first line scan SC1, the second line scan SC2, and the third line scan SC3 is projected, the drawing light beam LB is irradiated at least to the intersections Cr1 and Cr2. The line patterns RL1 and RL2 are formed as irregularities on the surface of the rotating cylinder DR. When the unevenness of the unevenness on the surface of the rotating cylinder DR is set to a specific condition, the reflected light generated when the drawing light beam LB is projected on the line patterns RL1 and RL2 may partially cause a difference in reflection intensity. For example, as shown in FIG. 16, when the line patterns RL1 and RL2 are concave portions on the surface of the rotating cylinder DR, when the drawing light beam LB is projected on the line patterns RL1 and RL2, the reflected light reflected by the line patterns RL1 and RL2 is photoinductive. The detector 31Cs receives light in a bright field.

The control unit 16 detects the edge position psc1 of the reference pattern RMP based on the output signal from the photo sensor 31Cs. For example, the control unit 16 stores the scan position data Dsc1 in the first line and the intermediate value mpsc1 of the edge position psc1 of the reference pattern RMP according to the output signal obtained from the photo sensor 31Cs when scanning SC1 in the first line.

Next, the control unit 16 stores the second position scan position data Dsc2 and the intermediate value mpsc1 of the edge position psc1 of the reference pattern RMP according to the output signal obtained from the photo sensor 31Cs when scanning SC2 in the second line. In addition, the control unit 16 stores an intermediate value mpsc1 of the scanning position data Dsc3 of the third line and the edge position psc1 of the reference pattern RMP according to the output signal obtained from the photo sensor 31Cs when scanning SC3 of the third line.

The control unit 16 calculates the intersections between the first line scan position data Dsc1, the second line scan position data Dsc2 and the third line scan position data Dsc3, and the intermediate position mpsc1 of the edge positions psc1 of the plurality of reference patterns RMP through calculation. The coordinate positions of the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 can also calculate two lines that cross each other. The relationship between the intersections Cr1 and Cr2 of the line patterns RL1 and RL2 and the drawing start position OC1. The same applies to the other drawing units UW2 to 5. The control unit 16 can calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start positions OC2 to OC5 (see FIG. 11). The above-mentioned intermediate value mpsc1 can also be obtained from the peak value of the signal output from the photo sensor 31Cs.

Above, the case where the reflected light reflected by the line patterns RL1, RL2 is received by the photo sensor 31Cs in a bright field of view has been described, but the photo sensor 31Cs may also reflect the reflected light reflected by the line patterns RL1, RL2 in the dark. Field of view is affected by light. FIG. 17 is an explanatory diagram schematically showing a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a dark field. FIG. 18 is an explanatory diagram schematically showing a signal output from a photo sensor that reflects light reflected from a reference pattern of a rotating cylinder in a dark field. As shown in FIG. 17, in the calibration detection system 31, a light shielding member 31 f having an endless belt-shaped light transmitting portion is disposed between the relay lens 94 and the photo sensor 31Cs. Therefore, the photodetector 31Cs is the edge scattered light or diffracted light among the reflected light reflected by the line patterns RL1 and RL2. For example, as shown in FIG. 18, when the line patterns RL1 and RL2 are concave portions on the surface of the rotating cylinder DR, when the drawing beam LB is projected on the line patterns RL1 and RL2, the photo sensor 31Cs is about to be reflected by the line patterns RL1 and RL2. The reflected light is received in a dark field.

The control unit 16 detects the edge position pscd1 of the reference pattern RMP based on a signal output from the photo sensor 31Cs. For example, the control unit 16 stores an intermediate value mpscd1 of the scanning position data Dsc1 of the first line and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photo sensor 31Cs when scanning SC1 in the first line. Next, the control unit 16 stores the middle position mpscd1 of the scan position data Dsc2 of the second line and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photo sensor 31Cs when scanning SC2 in the second line. The control unit 16 The output signal obtained from the photo sensor 31Cs during line scan SC3 stores the middle position mpscd1 of the scan position data Dsc3 of the third line and the edge position pscd1 of the reference pattern RMP.

The control unit 16 calculates an intersection between the scan position data Dsc1 of the first row, the scan position data Dsc2 of the second row, the scan position data Dsc3 of the third row, and the intermediate value mpscd1 of the edge positions pscd1 of the plurality of reference patterns RMP through calculation. The intersections Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 calculates the relationship between the coordinate positions of the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 crossing each other and the drawing start position OC1 through calculation.

The same applies to the other drawing units UW2 to 5, and the control unit 16 can calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start positions OC2 to OC5. As described above, when the reflected light reflected by the line patterns RL1 and RL2 is received by the photo sensor 31Cs in a dark field, the accuracy of the edge position pscd1 of the plurality of reference patterns RMP can be improved.

As shown in FIG. 14, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement states of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors from the detection signals detected in step S2 (step S3). FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder. FIG. 20 is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawn lines. As described above, the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged. As shown in FIG. 19, the first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged. In each case, the reference distance PL between the detected intersection points Cr1 is stored in the control unit 16 in advance. Similarly, for each of the second drawing line LL2 and the fourth drawing line LL4, the reference distance PL between the detected intersection points Cr1 is also stored in the control unit 16 in advance. For each of the second drawing line LL2 and the third drawing line LL3, the reference distance ΔPL between the detected intersections Cr1 is also Stored in the control unit 16 in advance. Further, for each of the fourth drawing line LL4 and the fifth drawing line LL5, the reference distance ΔPL between the detected intersection points Cr1 is also stored in the control unit 16 in advance.

For example, as shown in FIG. 20, since the control unit 16 has grasped the positional relationship with respect to the drawing start position OC1 of the first drawing line LL1 based on a signal from the origin detector 98 (see FIG. 7), the intersection point Cr1 can be obtained The distance BL1 from the drawing start position OC1. In addition, since the control unit 16 has detected the position of the drawing start position OC3 of the third drawing line LL3 by the origin detector 98, the distance BL3 between the intersection point Cr1 and the drawing start position OC3 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3, and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL1 and LL3. Interval distance ΔOC13. Similarly, since the control unit 16 has detected the position of the drawing start position OC5 of the fifth drawing line LL5 by the origin detector 98, the distance BL5 between the intersection point Cr1 and the drawing start position OC5 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5, and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL3 and LL5. The distance ΔOC35.

Since the control unit 16 has detected the position of the drawing start position OC2 of the second drawing line LL2 by the origin detector 98, the distance BL2 between the intersection point Cr1 and the drawing start position OC2 can be obtained. In addition, since the control unit 16 has detected the position of the drawing start position OC4 of the fourth drawing line LL4 by the origin detector 98, the distance BL4 between the intersection point Cr1 and the drawing start position OC4 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL2 and LL4. The distance ΔOC24.

In addition, the control unit 16 can easily store the origin between the origins of the drawing beams LB scanned along the drawing lines LL1 and LL2 because the drawing start position OC1 and the drawing start position OC2 are positions obtained through the same reference pattern RMP1 described above. Distance between points ΔOC12. As described above, the exposure device EX can obtain the positional relationship between the origins (drawing start points) of each of the plurality of drawing units UW1 to UW5.

The control unit 16 can detect a joining error between the drawing start position OC2 and the drawing start position OC3 from the reference distance ΔPL between the intersection points Cr1 detected at the second drawing line LL2 and the third drawing line LL3. Further, from the reference distance ΔPL between the intersection points Cr1 detected at the fourth drawing line LL4 and the fifth drawing line LL5, a joint error between the drawing start position OC4 and the drawing start position OC5 can be detected.

During the period from the drawing start positions OC1 to OC5 of each drawing line LL1 to LL5 to the drawing end positions EC1 to EC5, two intersection portions Cr1 and Cr2 are detected. Accordingly, the scanning directions from the drawing start positions OC1 to OC5 to the drawing end positions EC1 to EC5 can be detected. As a result, the control unit 16 can detect an angular error of each of the drawing lines LL1 to LL5 with respect to the direction (Y direction) along the center line AX2.

For the reference pattern RMP1, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors. The reference pattern RMP including the reference pattern RMP1 is a grid-like reference pattern repeatedly engraved at a certain pitch (period) Pf1, Pf2. Therefore, the control unit 16 obtains the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other with respect to the reference pattern RMP repeated at each pitch Pf1, Pf2, and calculates and plural drawing lines. Information about the deviation of the relative positional relationship between LL1 ~ LL5. As a result, the control unit 16 can further improve the correspondence to a plurality of renderings. The accuracy of the adjustment information (calibration information) of the arrangement state of the lines LL1 ~ LL5 or the mutual arrangement error.

Next, as shown in FIG. 14, the control part 16 performs the process of adjusting a drawing state (step S4). The control unit 16 adjusts information (calibration information) corresponding to the arrangement state of a plurality of drawing lines LL1 to LL5 or the mutual arrangement errors, and the scale units (rotating cylinder DR) GPa, GPb detected by the encoder read heads EN1 and EN2. For the rotation angle position, adjust the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5. The encoder read heads EN1 and EN2 can detect the conveyance amount of the substrate P based on the above-mentioned scale section (rotating cylinder DR) GPa and GPb.

FIG. 21 is an explanatory diagram schematically showing the relationship between the moving distance per unit time of the substrate and the number of drawing lines included in the moving distance, similarly to the previous FIG. 12. As shown in FIG. 21, the encoder read heads EN1 and EN2 can detect and store the moving distance ΔX per unit time of the substrate P. In addition, the alignment microscopes AM1 and AM2 may be used to sequentially detect the plurality of alignment marks Ks1 to Ks3 to obtain and store the moving distance ΔX.

The moving distance ΔX per unit time on the substrate P, the plurality of drawing lines LL1 drawn by the drawing unit UW1 are drawn by the beam lines SPL1, SPL2, and SPL3 of the beam spot light SP, and by the point diameter Xs of each beam spot light SP Scan about 1/2 of the X direction (and Y direction). Similarly, the beam spot light SP on the drawing terminal PTb side of the drawing line LL1 and the beam spot light SP on the drawing terminal PTb side of the drawing line LL2 overlap with the width direction of the substrate P as the substrate P moves in the longitudinal direction. Distance CXs engage.

For example, when the rotating cylinder DR moves up and down, the X-direction drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are shifted, and for example, a magnification difference in the X-direction may occur. The control unit 16 reduces the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 when the substrate P conveyed by the rotating cylinder DR is slow (moving speed), and the X direction can be adjusted. The drawing magnification becomes smaller. Conversely, when the transfer speed (moving speed) of the substrate P transferred by the rotary cylinder DR is increased, the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 becomes larger, and the drawing magnification that can be adjusted in the X direction becomes larger. The drawing line LL1 has been described above with reference to FIG. 21, and the same applies to the other drawing lines LL2 to LL5. The control unit 16 adjusts information (calibration information) corresponding to the arrangement state of a plurality of drawing lines LL1 to LL5 or the mutual arrangement errors, and the scale units (rotating cylinder DR) GPa, GPb detected by the encoder read heads EN1 and EN2 The rotation angle position changes the relationship between the moving distance ΔX per unit time of the substrate P in the strip direction of the substrate P and the number of beam lines SPL1, SPL2, and SPL3 included in the moving distance. Therefore, the control unit 16 can adjust the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 in the X direction.

FIG. 22 is an explanatory diagram schematically illustrating pulsed light emitted synchronously with the clock of a pulsed light source system. Hereinafter, the drawing line LL2 will also be described with reference to FIG. 21, and the same will be applied to the drawing lines LL1, LL3 to LL5. The light source device CNT can strike the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval Δwp (= 1 / Fz) of the pulse signal wp also changes. The temporal pulse interval Δwp is the distance CXs in the main scanning direction of the point light SP corresponding to each pulse on the drawing line LL2. The control unit 16 causes the beam spot light SP of the drawing light beam LB to scan the length LBL of the drawing line along the drawing line LL2 on the substrate P.

The control unit 16 has a function of partially changing the period of the system clock SQ while the drawing beam LB is being scanned along the drawing line LL2 so that the pulse interval Δwp is decreased at any position in the drawing line LL2. For example, when the original system clock SQ is 100 MHz, the control unit 16 changes the system clock SQ to, for example, 101 MHz (or 99 MHz) at a certain time interval (period) while scanning the length LBL of the drawing line. As a result, the beam spot light SP The number of drawn lines LBL decreases. In other words, the control unit 16 decrements the operating ratio of the system clock SQ at a predetermined interval (1 or more) while scanning the length LBL of the drawing line. According to this, the interval between the beam spot lights SP generated by the light source CNT, that is, the variation of the change pulse interval Δwp, and the overlapping distance CXs of the beam spot lights SP between each other. The distance between the drawing start point PTa and the drawing terminal PTb in the Y direction appears to expand and contract.

For example, when the length LBL of the drawing line is 30 mm, the drawing line is divided into 11 equal parts and the drawing interval (period interval) of about 3 mm reduces the pulse interval Δwp of the system clock SQ at only one place. The decrease in the pulse interval Δwp is as shown in FIG. 13. If the cumulative profile (intensity distribution) that does not cause a change with the distance CXs between the two adjacent point light SPs will be significantly reduced, for example, the reference When the separation distance CSx is set to 50% of the diameter Xs (3 μm) of the spot light, it is set to about ± 15%. If the reduction of the pulse interval Δwp is set to + 10% (the separation distance CSx is 60% of the diameter Xs of the point light), the point light of 1 pulse per minute will be scattered at 10 discrete points in the drawing line of the length LBL. A position shift of 10% of the diameter Xs in the main scanning direction occurs. As a result, the length LBL of the drawn line after drawing becomes 3 μm longer than 30 mm. This means that the pattern drawn on the substrate P is enlarged by 0.01% (100 ppm) in the Y direction. Accordingly, even when the substrate P expands and contracts in the Y direction, it is possible to expose the drawing pattern in accordance with the expansion and contraction in the Y direction.

For example, the position of the increase / decrease pulse interval Δwp is set to be able to perform one scan on the drawing lines LL1 to LL5, for example, a value preset to every 100 pulses, 200 pulses, etc. of the system clock SQ. In this way, the amount of expansion and contraction in the main scanning direction (Y direction) of the drawing pattern can be changed within a relatively large range, and the magnification can be dynamically adjusted in accordance with the expansion and contraction of the substrate P. Therefore, when the control unit 16 of the exposure apparatus EX of this embodiment includes a system The pulse SQ generating circuit has a pulse interval Δwp, a clock oscillation portion generated by a system clock SQ with a certain original clock signal, and a preset number of pulses after inputting the original clock signal count (count). A time shift unit that decrements the time from the next clock pulse of the system clock SQ to the pulse interval Δwp. In addition, the number of parts of the drawing line (length LBL) that reduces the pulse interval Δwp of the system clock SQ is approximately determined by the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn. At least one of the scanning times Ts of the spot light SP corresponding to the length LBL.

FIG. 23 shows an example of a clock generation circuit that partially changes the pulse interval Δwp of the system clock SQ. In FIG. 23, a basic clock signal CKL having the same frequency as the system clock SQ is output from the clock oscillation section 200. The basic clock signal CKL is applied to a delay circuit 202 that generates a system clock SQ by adding a predetermined delay time Td to each pulse of the basic clock signal CKL, and outputs a 20-fold increase in the frequency of the basic clock signal CKL, for example. Multiplier circuit 204 for the double clock signal CKs.

The delay circuit 202 internally has a counter that counts the number of pulses of the multiplied clock signal CKs to a predetermined value ΔNs. The period during which the counter counts the predetermined value ΔNs corresponds to the delay time Td. The predetermined value ΔNs is set by the preset circuit 206. The preset circuit 206 internally has a standard value Ns ₀ as an initial value of the predetermined value ΔNs, and transmits a preset value Dsb (a value corresponding to the change amount ΔTd of the delay time Td) from the outside (main CPU, etc.), and then The new default value ΔNs is overwritten with the previous value ΔNs + Dsb.

The overwriting is performed in response to the completion pulse signal b from the counter circuit 208 that counts the pulses of the system clock SQ output from the delay circuit 202. The counter circuit 208 has a structure that counts the number of pulses of the system clock SQ to a preset value Dsa and outputs After the pulse signal b is completed, reset the count value to zero and count the pulse number of the system clock SQ again and again. Although the preset value Dsa is the number of pulses of the point light Nck corresponding to a length LBL / N when the length LBL of the drawn line is divided equally by N, it does not necessarily correspond to the length LBL / N, and may be an arbitrary value. The delay circuit 202, the preset circuit 206, and the counter circuit 208 constitute a time shift unit.

FIG. 24 is a timing chart showing the time transition of the signals of each part in the circuit configuration of FIG. 23. In the pre-setting circuit 206 to set an initial value as a standard value Ns _0, add facilities to the delay circuit 202, a predetermined value ΔNs standard value Ns _0. Before the counter circuit 208 counts to the set pulse number Nck, that is, before the completion of the generation of the pulse signal b, the predetermined value ΔNs from the preset circuit 206 is Ns0, and the delay circuit 202 is shown in FIG. 24. From the basic time, The rise of each pulse of the pulse signal CKL counts the pulse number of the doubled pulse signal CKs to a predetermined value ΔNs, and outputs a pulse wp as the system clock SQ at the same time as the counting is completed. Therefore, the delay time Td _{1 from} the rise of the pulse of the basic clock signal CKL to the rise of the corresponding pulse wp of the system clock SQ is equivalent to the time of counting the pulses of the doubled clock signal CKs to a predetermined value ΔNs.

In FIG. 24, the counter circuit 208 counts to the preset value Dsa (the number of pulses Nck) by the pulse wp of the system clock SQ generated after the delay time Td ₁ corresponding to the pulse CKn of the basic clock signal CKL. The circuit 208 outputs the completion pulse signal b. In response to this, the preset circuit 206 overwrites the new predetermined value ΔNs with the predetermined value ΔNs + Dsb at the previous moment. The preset value Dsb is a value corresponding to the change amount (ΔTd) of the pulse interval Δwp shown in FIG. 22. Although it is set to a negative value in FIG. 24, the positive value is also the same. Therefore, before the next pulse CKn + 1 of the pulse CKn of the basic clock signal CKL is generated, the delay circuit 202 is set to a predetermined value of the delay time Td _{2 which} is shorter than the delay time Td ₁ set by the standard value Ns ₀ by ΔTd. ΔNs.

Thereby, the pulse interval Δwp 'of the system clock SQ generated from the pulse CKn + 1 of the basic clock signal CKL + 1 and the pulse wp of the previous moment is shorter than the previous pulse interval Δwp. After the pulse wp 'is generated, the counter circuit 208 counts up to the system clock SQ of the number of pulses Nck, and the completion pulse signal b is not generated. Therefore, the predetermined value ΔNs set in the delay circuit 202 is maintained at the corresponding delay time Td ₂ Value, the system clock SQ is output in a state where the delay time Td ₂ is uniformly delayed relative to the basic clock signal CKL until the pulse signal b is generated next. Therefore, the ratio β of the pulse interval Δwp determined by the frequency Fz of the basic clock signal CKL to the pulse interval Δwp 'corrected by the time offset becomes β = Δwp' / Δwp = 1 ± (ΔTd / Δwp) (where, ΔTd <Δwp)

The dimension of the width direction of the pattern drawn along the drawing line is larger than the design value specified by the drawing data when β> 1, and smaller than the design value when β <1 (in the case of FIG. 24).

In the circuit configuration of FIG. 23 described above, the number of pulses Nck of the system clock SQ is repeatedly executed so that the pulse interval Δwp change time ΔTd of one pulse wp of the system clock SQ made immediately after the completion of the pulse signal b is generated. . In addition, in the case of the circuit configuration of FIG. 23, if the standard value Ns ₀ stored internally by the preset circuit 206 is 20 and the preset value Dsb set from the outside is zero, the preset value b is set regardless of the completion pulse signal b. ΔNs is maintained at 20 (the drawing magnification in the Y direction is not corrected). In addition, since the frequency of the doubled clock signal CKs is set to 20 times the frequency of the basic clock signal CKL, the preset value ΔNs is set to 20, and the preset value Dsb is set to +1 (or -1). Then, the predetermined value ΔNs is overwritten (or decreased) as 20,21,22, ‧‧‧ (or 20,19,18‧‧‧) when the completion pulse signal b is generated. Furthermore, one pulse of the doubled clock signal CKs is equivalent to 1/20 (5%) of the standard pulse interval Δwp (pulse interval distance CXs). Therefore, if the preset value Dsb is changed by ± 1, two consecutive The proportion of overlapping points of light changes by 5%.

As described above, the pulsed beam output from the pulsed laser light source device CNT in response to the system clock SQ that is partially decremented in the pulse interval Δwp is a common supply to each of the drawing units UW1 to UW5. Therefore, the drawing lines LL1 to Each of the drawn patterns of LL5 will expand and contract at the same rate in the Y direction. Therefore, as illustrated in FIG. 12 (or FIG. 11), in order to maintain the joining accuracy between adjacent drawing lines in the Y direction, the drawing timing is modified so that the drawing start positions OC1 to OC5 of each of the drawing lines LL1 to LL5 ( Or the drawing end positions EC1 to EC5) are moved in the Y direction.

An example of a circuit configuration in which the pulse interval Δwp of the system clock SQ is partially variable is not limited to digitally changing the delay times Td ₁ and Td ₂ as shown in FIGS. 23 and 24. Makeup change. In addition, the pulse interval Δwp 'at one of the corrections every time the counter circuit 208 counts the system clock SQ to the preset value Dsb (the number of pulses Nck) may be increased or decreased from the standard pulse interval Δwp, for example. The composition of a slight value of 1%. In this case, in one scan of the spot light along the length LBL of the scanning line, the number of locations where the standard pulse interval Δwp is corrected to the pulse interval Δwp 'may be changed according to the necessary magnification correction amount. For example, if the number of corrected parts is set to 100, the size of the pattern drawn in one scan of the spot light in the Y direction increases or decreases by an amount equivalent to the pulse interval Δwp.

Furthermore, the ON / OFF switching of the light deflector (AOM) 81 shown in FIG. 4 is performed in response to a serial bit string (an array of bit values "0" or "1") sent as drawing data. The sending of this bit value can be synchronized with the pulse signal wp (Fig. 22) of the system clock SQ which is partially reduced by the pulse interval Δwp. Specifically, during the period from the generation of one pulse signal wp to the generation of the next pulse signal wp, a bit value is sent to the drive circuit of the optical deflector (AOM) 81, and the sweetness value is "1", When the first bit value is "0", the light deflector (AOM) 81 can be switched from OFF to ON.

The control unit 16 can adjust the adjustment information (calibration information) according to the arrangement state corresponding to the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors and the displacement gauges YN1, YN2, which can detect the offset of the two ends of the rotating cylinder DR. The information detected by YN3 and YN4 adjusts the drawing position in the Y direction by the drawing units UW1 to UW5 with odd and even numbers to offset the Y direction error caused by the rotation offset of the rotating cylinder DR. In addition, the control unit 16 can adjust the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors and the displacement meter YN1 that can detect the offset of the two ends of the rotating cylinder DR. The information detected by YN2, YN3, and YN4 changes the length in the Y direction (length of the drawing line LBL) performed by drawing units UW1 to UW5 with odd and even numbers to offset the rotation offset caused by the rotation of the DR of the rotating cylinder. Y-direction error.

In addition, the control unit 16 can adjust the odd and even numbers according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors and the information detected by the alignment microscopes AM1 and AM2. The drawing positions in the X direction or the Y direction by the drawing units UW1 to UW5 are used to offset the errors in the X direction or the Y direction of the substrate P.

The exposure apparatus EX of the first embodiment includes the drawing light beam LB from each of the plurality of drawing units UW1 to UW5 as described above, and includes a predetermined point in the drawing plane including a plurality of drawing lines LL1 to LL5 formed on the substrate P. The rotation mechanism I is a movement mechanism 24 serving as a displacement correction mechanism for displacing the second optical stage 25 with respect to the first optical stage 23 in the drawing plane as a center. When adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors is made, when the whole of the plurality of drawing lines LL1 to LL5 has an error in at least one of the X and Y directions, The control section 16 can drive and control the driving section of the moving mechanism 24 Control so that the displacement of the second optical stage 25 in at least one of the X direction and the Y direction cancels the displacement amount of the error.

When the second optical stage 25 is displaced in at least one of the X direction and the Y direction, the fourth mirror 59 shown in FIG. 6 is displaced by the displacement amount in the X direction or the Y direction. In particular, the fourth mirror 59 is displaced in the Y direction, and when the drawing light beam LB from the third mirror 58 is reflected in the + Y direction, it is displaced in the Z direction. Therefore, the beam displacement mechanism 44 in the first optical system 41 corrects the displacement in the Z direction. As a result, the second optical system 42 and the third optical system 43 after the fourth mirror 59 can maintain the light beam LB through the correct optical path.

In addition, in the exposure apparatus EX of the first embodiment, the plurality of drawing lines LL1 to LL5 are aligned with the X direction due to adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors. When there is an error in at least one of the Y direction, the control unit 16 can drive and control the driving unit of the moving mechanism 24 so that the drawing lines LL1 to LL5 formed on the substrate P move slightly in the X direction or the Y direction to offset the error. Of displacement.

Furthermore, in the exposure apparatus EX of the first embodiment, the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors makes the odd numbers in the plurality of drawing lines LL1 to LL5. When there is an error in at least one of the X- and Y-directions of the even-numbered drawing line pair, the control unit 16 can drive and control the beam displacement mechanism 45 in such a manner as to offset the displacement amount of the error so that the even number formed on the substrate P The numbered drawing lines LL2 and LL4 move slightly in the X direction or the Y direction to fine-tune the relative positional relationship with the odd numbered drawing lines LL1, LL3, and LL5 formed on the substrate P.

In addition, the control unit 16 may also adjust the adjustment information (calibration information) corresponding to the arrangement states of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors, and the displacement indicators YN1, YN2, Adjust the Y magnification of the drawing units UW1 ~ UW5 with the information detected by YN3, YN4 or alignment microscope AM1 and AM2. For example, the image height of the telecentric f-θ lens included in the f-θ lens system 85 is proportional to the angle of incidence. Therefore, when adjusting only the Y magnification of the drawing unit UW1, the control unit 16 can individually adjust f according to the adjustment information (calibration information) and the displacement measurement YN1, YN2, YN3, YN4 or the information detected by the alignment microscope AM1, AM2. The -theta lens system has a focal length f of 85 to adjust the Y magnification. In this whole adjustment mechanism, for example, any of a bending plate for magnification correction, a magnification correction mechanism for a telecentric f-θ lens, and a halving (tiltable parallel plate glass) for displacement adjustment can be combined. More than one. In addition, the rotation speed of the rotating polygon mirror 97 rotating at a certain rotation speed can be slightly changed, so that the interval distance CXs of each point light SP (pulse light) synchronized with the system clock SQ can be slightly changed (the adjacent The overlapping amount of the point lights is slightly staggered), and the Y magnification can also be adjusted as a result.

The exposure apparatus EX of the first embodiment includes the drawing light beam LB from each of the plurality of drawing units UW1 to UW5 as described above, and includes a predetermined point in the drawing plane including a plurality of drawing lines LL1 to LL5 formed on the substrate P. The rotation mechanism I is a movement mechanism 24 serving as a displacement correction mechanism for displacing the second optical stage 25 with respect to the first optical stage 23 in the drawing plane as a center. Due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, the plurality of drawing lines LL1 to LL5 have an angular error with respect to the Y direction. The control unit 16 can The driving unit performs drive control so that the second optical table 25 is rotated to offset the rotation amount of the angular error.

In addition, when it is necessary to perform rotation correction on each of the drawing units UW1 to UW5, the f-θ lens system 85 and the second cylindrical lens 86 shown in FIG. 8 can be rotated slightly around the optical axis AXf. Each of the drawing lines LL1 to LL5 is individually rotated (inclined) on the substrate P slightly. The light beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the generatrix of the cylindrical lens 86 in the non-scanning direction. Therefore, by rotating the cylindrical lens 86 about the optical axis AXf, each drawing line LL1 ~ LL5 can be made. Rotate (tilt).

The exposure apparatus EX of the first embodiment only needs to process at least one of the processes of the adjustment of the drawing position performed by the control device in step S4. In addition, the exposure apparatus EX of the first embodiment may be combined with the processing of the drawing position adjustment performed by the control device of step S4 described above.

With the method for adjusting the substrate processing apparatus described above, in the exposure apparatus EX of the first embodiment, it is possible to eliminate (not necessary) the pattern PT1 to PT5 adjacent to each other in the width direction (Y direction) of the substrate P. Test exposure for joint error, or significantly reduce it. Therefore, the exposure device EX of the first embodiment can shorten the time-consuming calibration operations such as test exposure, drying and development processes, and confirmation of exposure results. In addition, the exposure device EX of the first embodiment can suppress the waste of the substrate P in the number of times of feedback due to the test exposure. The exposure device EX of the first embodiment can obtain adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors earlier. The exposure device EX of the first embodiment can be corrected in advance according to the arrangement information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors, and the correction can be easily performed in the X direction or the Y direction. The components of displacement, rotation, magnification, etc. In addition, the exposure apparatus EX of the first embodiment can improve the accuracy of overlapping exposure on the substrate P.

The exposure device EX of the first embodiment is described by taking the light deflector 81 including an acousto-optic element and the point scan of the drawing beam LB as an example by rotating the polygon mirror 97 as an example. Use DMD (Digital Micro mirror Device) or SLM (Spatial light modulator) The way of drawing patterns.

[Second Embodiment]

Next, an exposure apparatus EX according to a second embodiment will be described. In addition, in the second embodiment, in order to avoid the duplicated description of the first embodiment, only the parts that are different from the first embodiment will be described, and the same constituent elements as the first embodiment will be given to the first embodiment. The same symbols are used for explanation.

In the exposure apparatus EX of the second embodiment, the photo sensor 31Cs of the calibration detection system 31 does not detect the reference pattern (also can be used as a reference mark) RMP, but detects the reflected light of the alignment marks Ks1 to Ks3 on the substrate P. (Scattered light). The alignment marks Ks1 to Ks3 are arranged on the substrate P in the Y direction passing any one of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5. When the spot light SP depicting the light beam LB scans the alignment marks Ks1 ~ Ks3, the scattered light reflected by the alignment marks Ks1 ~ Ks3 is received by the photo sensor 31Cs in a bright field or a dark field.

The control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on a signal output from the photo sensor 31Cs. In the same manner as in the first embodiment, the control unit 16 can obtain the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 from the detection signals detected by the optical sensor 31Cs. .

In addition, the control unit 16 can adjust the drawing of the odd and even numbers according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement errors and the information detected by the alignment microscopes AM1 and AM2. The drawing position of the X direction or the Y direction of the units UW1 to UW5 is to offset the error of the X direction or the Y direction of the substrate P. When the spot light SP depicting the light beam LB is projected on the alignment marks Ks1 ~ Ks3, the photosensitive layer on the alignment marks Ks1 ~ Ks3 is Photosensitive, it is possible that the alignment marks Ks1 ~ Ks3 will collapse in the subsequent process. Therefore, it is best to set a plurality of rows of alignment marks Ks1 to Ks3, and the alignment microscopes AM1 and AM2 read the alignment marks Ks1 to Ks3 that have not been scattered by exposure.

Therefore, the exposure device EX of the second embodiment may be included in the pattern drawing data, and the spot light SP scanning for drawing the light beam LB may be performed near the alignment marks Ks1 to Ks3 which are scattered due to exposure. Near the alignment marks Ks1 ~ Ks3, the ON / OFF data of the light deflector (AOM) 81 is performed in a way that the spot light SP will not be irradiated. According to this, it is possible to obtain the calibration information at substantially the same time as the exposure with the drawing beam LB, and it is also possible to read the alignment marks Ks1 to Ks3 (the position of the substrate P).

The exposure apparatus EX of the second embodiment is the same as the exposure apparatus EX of the first embodiment, and it is possible to omit the test exposure for suppressing the joint error or to reduce the number of times significantly. In addition, in the exposure device EX of the second embodiment, it is possible to measure the error information corresponding to the arrangement status of the plurality of drawing lines LL1 to LL5 or the arrangement relationship among each other while exposing the pattern on the substrate P. ) Obtain the corresponding adjustment information (calibration information). Therefore, according to the exposure device EX of the second embodiment, it is possible to easily perform corrections and adjustments in order to maintain a predetermined accuracy while exposing the element pattern based on the error information or adjustment information (calibration information) measured early. In the multi-drawing head method, it is possible to suppress the decrease in the joint accuracy between the drawing elements such as displacement errors, rotation errors, and magnification errors in the X direction or the Y direction, which is a problem. According to this, the exposure apparatus EX of the second embodiment can maintain the superimposition accuracy at the time of superimposed exposure on the substrate P.

<Element Manufacturing Method>

Next, a device manufacturing method will be described with reference to FIG. 25. Fig. 25 shows elements of each embodiment Flow chart of manufacturing method.

The element manufacturing method shown in FIG. 25 is to first perform a function and performance design of a display panel formed using a self-luminous element such as an organic EL, and design a circuit pattern and a wiring pattern required by CAD or the like (step S201). A roll for supply of a flexible substrate P (resin film, metal foil film, plastic, etc.) as a base material of the display panel is wound up (step S202). In addition, the roll-shaped substrate P prepared in this step S202 may be one whose surface has been modified as required, or which has been previously formed with a bottom layer (for example, through minute irregularities of an imprint method), or has been laminated with light in advance. Inductive functional film or transparent film (insulating material)

Next, a substrate layer including electrodes or wiring, an insulating film, and a TFT (thin-film semiconductor) is formed on the substrate P, and a light-emitting layer composed of a self-light-emitting element such as an organic EL is formed on the substrate. (Display pixel portion) (Step S203). In this step S203, the conventional lithography process for exposing and developing the photoresist layer using the exposure device EX described in the previous embodiments is also included, and a photosensitive silane coupling agent is applied instead of the photoresist. The substrate P is subjected to pattern exposure to modify the surface to be water-repellent to form a pattern exposure process, pattern exposure to a light-sensitive catalyst layer to impart selective plating restitution and is formed by an electroless plating method. Wet processes of metal film patterns (wiring, electrodes, etc.), or printing processes that draw patterns with conductive ink containing silver nano particles, etc.

Next, for each display panel element that is continuously manufactured on the long substrate P by a roll method, the substrate P is cut, or a protective film (environmental barrier layer) or a color filter film is laminated on the surface of each display panel element. The components are assembled (step S204). Next, a step of checking whether the display panel element can operate normally or whether the desired performance and characteristics are satisfied is performed (step S205). Through the above method, a display panel (flexible display) can be manufactured. Also, a flexible long sheet-like base is made The electronic components of the board are not limited to the display panel, and may also be a flexible wiring network for connecting wires (wiring tapes) between various electronic components mounted on automobiles or trams.

Claims (14)

A substrate processing apparatus includes a conveying device that supports a portion of a long sheet-like substrate by a rotating cylinder having a cylindrical outer peripheral surface bent at a certain radius from a center line while supporting the rotating circle around the center line. The rotation of the cylinder causes the substrate to move in the strip direction; the drawing device includes projecting the modulated drawing beam on the substrate supported by the outer peripheral surface, and in the width direction of the substrate crossing the strip direction in Scan a narrower range than the width of the substrate and draw a plurality of drawing units along a predetermined pattern along the drawing lines obtained by the scanning. The patterns drawn on the substrate by the drawing lines of the plurality of drawing units follow each other along the substrate. In a manner of moving in the long direction and joining in the width direction of the substrate, the plurality of drawing units are arranged in the width direction of the substrate; the moving measuring device includes a circle having a predetermined radius from the center line of the rotating cylinder. The scale formed in the direction is set to rotate along with the rotating cylinder, and the scale is arranged opposite to the scale of the scale and is used for output correspondence. The encoder read head of the movement amount of the substrate or the movement information of the movement position performed by the transfer device; and a control unit that stores in advance the positional relationship of the drawing lines formed on the substrate by each of the plurality of drawing units. Calibration information, and adjusting a drawing position of a pattern formed on the substrate by the drawing beam of each of the plurality of drawing units according to the calibration information and the movement information output from the mobile measurement device. For example, the substrate processing apparatus of the first patent application range, wherein the plurality of drawing units are arranged such that one of adjacent drawing units that draw a pattern joining each other on the substrate is set to an odd number, and the other is set to an even number. At the time of numbering, the odd-numbered drawing lines of each of the odd-numbered drawing units and the even-numbered drawing lines of each of the even-numbered drawing units are located at a certain angular interval in the circumferential direction of the outer peripheral surface of the rotating cylinder. For example, the substrate processing apparatus of the second patent application range, wherein each of the odd-numbered drawing lines is arranged in a line on the substrate in a direction substantially parallel to the center line of the rotating cylinder. Each of the even-numbered drawing lines is arranged in a line in the width direction of the substrate in such a manner that the center line of the rotating cylinder is substantially parallel to the substrate. For example, the substrate processing device of the third scope of the patent application, wherein the encoder reading head of the mobile measuring device includes the first encoder reading head, which is arranged in a row when viewed from the centerline of the rotating cylinder. The odd-numbered line is drawn in the same direction as the first azimuth and is opposite to the scale of the scale; and the second encoder read head is arranged in the same row as the one viewed from the centerline of the rotating cylinder. The second direction when the even number draws the line is the same direction as the scale of the scale. For example, the substrate processing device of the fourth scope of the patent application, wherein the first position and the second position are set so that the first encoder read head and the second encoder read head are disposed in the space in a non-interfering state. The angular range around the scale of the ruler. For example, the substrate processing apparatus according to any one of claims 1 to 5 further includes a substrate pattern detection apparatus, which includes a substrate pattern detection apparatus for detecting discretely or continuously formed on the substrate in the strip direction. A detection probe with a specific pattern is arranged on the rotating cylinder in such a manner that the detection area on the substrate of the detection probe is set on the upstream side of the substrate in the conveying direction compared to the drawing line of each of the plurality of drawing units. Surrounding; the control section, in addition to the calibration information and the mobile information output from the mobile measurement device, also performs pattern drawing of the drawing beam based on the position information of the specific pattern detected in the detection area of the detection probe Position adjustment. For example, the substrate processing apparatus according to any one of claims 1 to 5, wherein the adjustment of the drawing position by the control unit includes a process of changing a moving speed of the substrate by the transporting apparatus. For example, the substrate processing device according to any one of claims 1 to 5, wherein the adjustment of the drawing position by the control unit includes changing the moving distance per unit time of the substrate in the long direction and Processing of the relationship between the number of the drawn lines included in the moving distance. For example, the substrate processing device according to any one of claims 1 to 5, wherein the drawing device is further provided with pulse light of a wavelength in an ultraviolet region synchronized with the system clock as the pulse light source of the drawing beam; the control The adjustment of the drawing position by the Ministry includes a process of partially changing the cycle of the system clock while the drawing beam is scanned along the drawing line. For example, the substrate processing apparatus according to any one of claims 1 to 5, wherein the adjustment of the drawing position by the control unit includes a process of changing the length of the drawing line formed by scanning the drawing beam. For example, the substrate processing apparatus according to any one of claims 1 to 5, wherein each of the traveling directions of the drawing beam projected from each of the plurality of drawing units onto the substrate is set to face the rotating cylinder. Centerline. For example, the substrate processing apparatus according to any one of claims 1 to 5 includes: a platform that holds the plurality of drawing units in a predetermined positional relationship; and a rotation mechanism that includes the data from each of the plurality of drawing units. The drawing beam formed on the substrate is centered on a predetermined point in the drawing plane of the plurality of drawing lines, so that the platform rotates in the drawing plane; the adjustment of the drawing position by the control unit includes rotating the platform. deal with. For example, the substrate processing device according to any one of claims 1 to 5, wherein each of the plurality of drawing units further includes: rotating a polygon mirror to scan the drawing beam toward the substrate in a direction; f a -θ lens, which directs the drawing beam scanned by the rotating polygon mirror toward the drawing line on the substrate; and a cylindrical lens, which is provided between the f-θ lens and the substrate and has a direction substantially extending from the drawing line The parallel buses converge the drawing beam in a direction orthogonal to the buses. A method for manufacturing a component, comprising: using the rotating cylinder of the substrate processing apparatus according to any one of claims 1 to 13 to apply a part of a flexible long substrate having a photosensitive functional layer formed thereon; The method of winding around the rotating cylinder supports a part of the long substrate, and the substrate is moved at a predetermined speed in the long direction by the rotation of the rotating cylinder; Each of the plurality of drawing units adjusted by the control unit draws a pattern of an electronic component on the photosensitive functional layer of the substrate.