CN106133610A - Substrate board treatment, device making method and substrate processing method using same - Google Patents

Abstract

Substrate board treatment is so that describing by the way of the pattern that line depicts on substrate is bonded together to the movement of length direction along with substrate each other on the width of substrate by multiple delineation units each, and the width along substrate is configured with multiple delineation unit.Control portion is previously stored with the calibration information relevant with the mutual position relationship describing line formed on substrate respectively by multiple delineation units, and the mobile message based on this calibration information with from traverse measuring device output adjusts the description position of the pattern by the formation on substrate of multiple delineation units respective description light beam.

Description

Substrate board treatment, device making method and substrate processing method using same

Technical field

The present invention relates to for forming the substrate board treatment of tectosome of fine electronic device, device manufacture on substrate Method and substrate processing method using same.

Background technology

In the past, as substrate board treatment, it is known to the assigned position in sheet medium (substrate) carries out the system described Manufacturing apparatus (for example, referring to patent documentation 1).Manufacture device described in patent documentation 1 is by easily stretching in the direction of the width Flexible strip plate shape substrates detection alignment mark measure the flexible of plate shape substrates, and revise description position according to stretching (Working position).

Prior art literature

Patent documentation

Patent documentation 1: Japanese Unexamined Patent Publication 2010-91990 publication

Summary of the invention

In the manufacture device of patent documentation 1, by an edge conveyance direction conveyance substrate switching spatial modulation element (DMD:Digital Micro mirror Device) is exposed, and utilizes multiple delineation unit depicting pattern on substrate. In the manufacture device of patent documentation 1, utilize multiple delineation unit so that pattern adjacent on the width of substrate connects each other The mode closed is exposed, but in order to suppress to engage the error of exposure, the joint generated carrying out test exposure and development The measurement result of the site error of the pattern at portion is fed back.But, such comprise test exposure, develop, measurement etc. is made Although industry is also different because of its frequency at interior feedback procedure, but production line can be caused to stop temporarily, it is possible to reduce product raw Productivity and cause substrate to waste.

The solution of the present invention completes in view of above-mentioned problem, its object is to, it is provided that a kind of substrate board treatment, device Part manufacture method and substrate processing method using same, even if using multiple delineation unit shape with bond pattern on the width of substrate In the case of formula is exposed (description), it is also possible to reduce pattern bonding error each other, high accuracy and stably on substrate Depict large-area pattern.

The 1st scheme according to the present invention, it is provided that a kind of substrate board treatment, has: carrying device, and it is by having The supporting parts of the bearing-surface of bending, along a part for the described substrate of the length direction supporting strip lamellar of substrate, make institute State substrate to move along described length direction；And drawing apparatus, it has multiple delineation unit, and the plurality of delineation unit is to by described Modulated description light beam is projected, simultaneously at the described substrate intersected with described length direction on the described substrate of bearing-surface supporting Width on be scanned with the scope that the width than this substrate is little, and paint along the description line drawing obtained by this scanning Going out the pattern of regulation, the plurality of delineation unit in described drawing apparatus configures along the width of described substrate, so that By the plurality of delineation unit each describe pattern that line depicts on the substrate each other along with described substrate to length The movement in direction and be bonded together on the width of described substrate；Traverse measuring device, its output is removed with based on described Send the amount of movement of the described substrate of device or the mobile message that shift position is corresponding；And control portion, its be previously stored with The calibration information that the mutual position relationship of described description line is relevant, and fill based on this calibration information with from described traverse measurement Put the mobile message of output and adjust by the respective described description light beam of the plurality of delineation unit shape on the substrate The description position of the pattern become, wherein, described description line is respectively formed on described substrate by the plurality of delineation unit.

The 2nd scheme according to the present invention, it is provided that a kind of device making method, uses at the substrate of the 1st scheme of the present invention Reason device forms described pattern on the substrate.

The 3rd scheme according to the present invention, for a kind of substrate processing method using same, depicts electronics device on the plate shape substrates of strip The pattern of part, including following process: the length direction along described plate shape substrates carries described plate shape substrates with fixing speed；Make from The light beam of the ultraviolet band that light-pulse generator device goes out with the impulse hunting of frequency Fz becomes some light at the surface aggregation of described plate shape substrates, And make described light beam move by photoscanner, thus make described light along on the width intersected with length direction The description line of length LBL extended is scanned；And during the scanning of described light, retouch based on corresponding with described pattern Paint data the intensity of described light is modulated, the some light that the optically focused of 1 pulse of described light beam is formed and next Be set to CXs along the interval of described description line between the some light that the optically focused of pulse is formed, by described light along described description line Virtual size be set to Xs, time the sweep time that described some photoscanning goes out described length LBL is set to Ts, be set to meet with Lower relation: Xs ＞ CXs, and, Fz ＞ LBL/ (Ts Xs).

The 4th scheme according to the present invention, for a kind of substrate processing method using same, depicts electronics device on the plate shape substrates of strip The pattern of part, including following operation: along described plate shape substrates length direction with fixing speed carry described plate shape substrates work Sequence；Make the light beam of ultraviolet band that goes out with the impulse hunting of frequency Fz from light-pulse generator device at the surface aggregation of described plate shape substrates Become some light, and make described light along the description extended on the width that the length direction with described plate shape substrates intersects The operation that line is scanned；And during the scanning of described light, based on what described pattern according to pixels unit was obtained Describing data, the operation being modulated the intensity of described light beam by light switching device, by the modulation of described smooth switching device Time response frequency Fss and frequency Fz of impulse hunting of described light beam be set to the relation of Fz ＞ Fss.

Invention effect

According to the solution of the present invention, using the teaching of the invention it is possible to provide following substrate board treatment, device making method, it is possible to reduce and use Multiple delineation units carry out engaging bonding error during exposure on the width of substrate to pattern, and can close substrate Carry out description based on multiple delineation units suitablely.It can also enough offers make 1 delineation unit along describing line depicting pattern Time description precision (uniformity etc. of light exposure) and the substrate processing method using same that is improved of fidelity.

Accompanying drawing explanation

Fig. 1 is the integrally-built figure of the exposure device (substrate board treatment) representing the 1st embodiment.

Fig. 2 is the axonometric chart of the configuration of the major part of the exposure device representing Fig. 1.

Fig. 3 is the figure of the aligming microscope on substrate and the configuration relation describing line.

Fig. 4 is the figure of the structure of the rotating cylinder of the exposure device representing Fig. 1 and drawing apparatus.

Fig. 5 is the top view of the configuration of the major part of the exposure device representing Fig. 1.

Fig. 6 is the axonometric chart of the structure of branch's optical system of the exposure device representing Fig. 1.

Fig. 7 is the figure of the configuration relation of multiple scanning devices of the exposure device representing Fig. 1.

Fig. 8 is to illustrate for eliminating the optical texture describing line dislocation gone between because of the inclination of the reflecting surface of scanning device Figure.

Fig. 9 is the solid representing the aligming microscope on substrate, the configuration relation between description line and encoder head Figure.

Figure 10 is the axonometric chart of the surface structure of the rotating cylinder of the exposure device representing Fig. 1.

Figure 11 is to represent the explanatory diagram describing line and the position relationship of depicting pattern on substrate.

Figure 12 is the explanatory diagram representing light beam spot with the relation describing line.

Figure 13 is that the intensity distribution variation caused by the lap to the light beam spot by 2 pulsed quantities obtained on substrate is entered The chart that row simulation obtains.

Figure 14 is the flow chart of the method for adjustment of the exposure device about the 1st embodiment.

Figure 15 is the explanatory diagram of the reference pattern schematically showing rotating cylinder and the relation describing line.

Figure 16 is the photoelectric sensing being shown schematically in the reflection light that bright field receives the reference pattern from rotating cylinder The explanatory diagram of the signal of device output.

Figure 17 is the photoelectric sensing being shown schematically in the reflection light that dark ground receives the reference pattern from rotating cylinder The explanatory diagram of device.

Figure 18 is to schematically show the photoelectric transfer from the reflection light receiving the reference pattern from rotating cylinder in dark ground The explanatory diagram of the signal of sensor output.

Figure 19 is the explanatory diagram schematically showing the reference pattern of rotating cylinder position relationship each other.

Figure 20 is the explanatory diagram of the relative position relation schematically showing a plurality of description line.

Figure 21 is the description line that the displacement schematically showing substrate time per unit is contained with in displacement The explanatory diagram of the relation between bar number.

Figure 22 is the explanatory diagram of the schematically pulsed light that explanation is Tong Bu with the system clock of light-pulse generator.

Figure 23 is the block diagram of an example of the circuit structure that the system clock for generating light-pulse generator is described.

Figure 24 is the sequential chart of the signal migration of each several part in the circuit structure representing Figure 23.

Figure 25 is the flow chart representing each device making method.

Detailed description of the invention

About the mode (embodiment) for implementing the present invention, it is explained in detail with reference to the accompanying drawings.Not by following embodiment party The content that formula is recorded limits the present invention.It addition, structural element set forth below comprises those skilled in the art be readily apparent that, And the key element being substantially the same.And, structural element set forth below can be appropriately combined.It addition, without departing from master of the present invention The various omissions that structural element can be carried out in the range of purport, replace or change.

[the 1st embodiment]

Fig. 1 is the integrally-built figure of the exposure device (substrate board treatment) representing the 1st embodiment.1st embodiment party The substrate board treatment of formula is after exposure device EX, exposure device EX to substrate P enforcement exposure-processed are assembled in exposure Substrate P is implemented in the device inspection apparatus 1 that various process manufacture device.First, device inspection apparatus 1 is described.

＜ device inspection apparatus ＞

Device inspection apparatus 1 is the production line (flexible display production line) of the flexible display being manufactured as device.Make For flexible display, such as, there is organic el display etc..This device inspection apparatus 1 is so-called volume to volume (Roll to Roll) Mode, i.e. sends this substrate P from the not shown supply roller that the strip substrate P of flexible (flexible) is wound into roll, And the substrate P sent is implemented continuously various process, the substrate P after then processing is wound up into not shown as flexible devices Recovery roller on.In the device inspection apparatus 1 of the 1st embodiment, it is shown that as the substrate P of film like sheet material by from confession Sent with roller, and the substrate P sent from supply roller to sequentially pass through processing means U1, exposure device EX, processing means U2 straight To the example being wound in recovery roller.Here, the substrate P processing object becoming device inspection apparatus 1 is said Bright.

The paper tinsel (foil) etc. that substrate P such as uses resin film, formed by metal or alloy such as rustless steels.Thin as resin The material of film, such as contain in following resin one or more, i.e. polyvinyl resin, acrylic resin, polyester tree Fat, Ethylene Vinyl Ester Copolymers resin, Corvic, celluosic resin, polyamide, polyimide resin, poly-carbon Acid ester resin, polystyrene resin, vinyl acetate resin.

Preferably, substrate P is selected the substrate that thermal coefficient of expansion is the biggest, so that the most substantially can ignore The deflection produced because being heated in the various process that substrate P is implemented.Thermal coefficient of expansion such as can be by thin at resin Film mixes inorganic filler and is set as that ratio is little with the corresponding threshold value such as technological temperature.Inorganic filler can be such as titanium oxide, Zinc oxide, aluminium oxide, silicon oxide etc..It addition, substrate P can be the thickness utilizing floating preparation method etc. to manufacture is the pole about 100 μm The individual layers of thin glass, it is also possible to be the duplexer of resin film, the paper tinsel etc. of fitting above-mentioned on this very thin glass.

The substrate P so constituted is wound into roll and becomes supply roller, and this supply roller is arranged on device manufacture system In system 1.The substrate P sent along its length from supply roller is repeated by the device inspection apparatus 1 being provided with supply roller For manufacturing the various process of device.Therefore, in the longitudinal direction with fixed interval continuous print state in substrate P after treatment It is formed with the pattern of multiple electronic device (display floater, printed base plate etc.).It is to say, the substrate sent from supply roller P becomes the substrate that more than one piece processes simultaneously.Additionally, substrate P can be that the pre-treatment beforehand through regulation is to its surface modification Make the substrate of its activation, it is also possible to be to be formed with from the teeth outwards (to utilize impressing for the fine next door of precise pattern structure Method formed sag and swell) substrate.

Substrate P after process is wound into roll and reclaims as recovery roller.Recovery roller is arranged on not shown cutting Cut on device.Be provided with recovery roller cutter sweep will process after substrate P become many as each Device singulation (cutting) Individual device.For example, the size on width (becoming the direction of minor face) is 10cm～about 2m to the size of substrate P, length Size on direction (becoming the direction on long limit) is more than 10m.Additionally, the size of substrate P is not limited to above-mentioned size.

It follows that device inspection apparatus 1 is illustrated with reference to Fig. 1.Device inspection apparatus 1 has processing means U1, exposure Electro-optical device EX and processing means U2.Additionally, in FIG, the orthogonal coordinate system that X-direction, Y-direction and Z-direction are orthogonal is used.X side To be in horizontal plane from processing means U1 via exposure device EX towards the direction of processing means U2.Y-direction is at horizontal plane The interior direction orthogonal with X-direction, is the width of substrate P.Z-direction is direction (the vertical side orthogonal with X-direction and Y-direction To), XY face is parallel with the face that the arranges E of the production line arranged for exposure device EX.

Processing means U1 carries out process (the front place of front operation to the substrate P of device EX to be exposed enforcement exposure-processed Reason).The substrate P carrying out pre-treatment is carried by processing means U1 towards exposure device EX.Now, the base of exposure device EX it is sent to Plate P becomes substrate (sensitive substrate) P being formed with photonasty functional layer (photoinduction layer) on its surface.

Herein, photonasty functional layer is coated in substrate P as solution and is dried and becomes layer (film).Photonasty functional layer Exemplary be photoresist, and as need not the material of development treatment, have the close and distant of the part irradiated by ultraviolet Photonasty silane coupling material (SAM) that fluidity is modified or expose plating reduction base in the part irradiated by ultraviolet Photonasty reducing material etc..In the case of using photonasty silane coupling material as photonasty functional layer, due in substrate P It is modified as lyophily by lyophobicity, so being optionally coated with in the part become lyophily through the pattern part of ultraviolet exposure Apply electric conductivity ink (ink of the conductive nanometer particle such as argentiferous or copper), and form patterned layer.As photonasty functional layer Use in the case of photonasty reducing material, owing on substrate, pattern part through ultraviolet exposure exposes plating reduction base, institute Substrate P to be impregnated in the plating solution containing palladium ion etc. immediately after exposure and to impregnate the stipulated time, it is consequently formed (precipitation) The patterned layer formed by palladium.

Exposure device EX to from processing means U1 supply come substrate P depict such as display floater various circuit or The pattern of various wirings etc..This exposure device EX obtains along the scanning direction scanning of regulation by making each description light beam LB respectively A plurality of description line LL1～LL5 in substrate P, expose the pattern of regulation, describing light beam LB is respectively from multiple delineation units The light beam that UW1～UW5 projects to substrate P, detailed content will be described later.

Processing means U2 receives the substrate P of exposed process in exposure device EX, and substrate P carries out the place of rear operation Reason (post processing).In the case of the photonasty functional layer of substrate P is photoresist, processing means U2 carries out the glass of substrate P Baking process below glass transition temperature, development treatment, cleaning treatment, dried etc..It addition, in the photonasty merit of substrate P In the case of ergosphere is photonasty plating reducing material, processing means U2 carries out electroless plating process, cleaning treatment, is dried place Reason etc..And, in the case of the photonasty functional layer of substrate P is photonasty silane coupling material, processing means U2 carry out to The part becoming lyophily in substrate P applies the selectivity coating process of aqueous ink, dried etc. selectively.Pass through The process of such processing means U2, forms the patterned layer of device in substrate P.

＜ exposure device (substrate board treatment) ＞

Then, referring to figs. 1 through Figure 10, exposure device EX is described.Fig. 2 is the major part of the exposure device representing Fig. 1 The axonometric chart of configuration.Fig. 3 is the figure representing the aligming microscope on substrate with the configuration relation describing line.Fig. 4 represents Fig. 1 The figure of the structure of the rotating cylinder of exposure device and drawing apparatus (delineation unit).Fig. 5 is the main portion of the exposure device representing Fig. 1 The top view of the configuration divided.Fig. 6 is the axonometric chart of the structure of branch's optical system of the exposure device representing Fig. 1.Fig. 7 is to represent The figure of the configuration relation of the scanning device in multiple delineation units of the exposure device of Fig. 1.Fig. 8 is to illustrate for eliminating because of scanning device The inclination of reflecting surface and the figure of the optical texture describing line dislocation that causes.Fig. 9 is to represent aligming microscope on substrate, retouch The axonometric chart of the configuration relation between line drawing and encoder head.Figure 10 is the surface of the rotating cylinder of the exposure device representing Fig. 1 The axonometric chart of one example of structure.

As it is shown in figure 1, exposure device EX is the description exposure not using the exposure device of light shield, the most so-called mode without light shield Electro-optical device, be in the present embodiment raster scanning (raster scan) mode directly describe exposure device, i.e. an edge Conveyance direction (length direction) transports substrate P continuously with the speed of regulation, at the scanning direction (width of substrate P of regulation Direction) point (spot) light describing light beam LB is carried out high-velocity scanning, thus, the surface of substrate P is described and in substrate P The upper pattern forming regulation.

As it is shown in figure 1, exposure device EX has: drawing apparatus 11, substrate transport mechanism 12, aligming microscope AM1, AM2 With control portion 16.Drawing apparatus 11 has multiple delineation unit UW1～UW5.It addition, drawing apparatus 11 is by multiple delineation units A part for the substrate P that UW1～UW5 is transported when to be close to and to be bearing in above the rotating cylinder DR outer peripheral face of cylindrical shape On depict the pattern of regulation, cylindric rotating cylinder DR is also as a part for substrate transport mechanism 12.Substrate transport mechanism The processing means U2 conveyance of the 12 substrate P operations backward processing means U1 of the past operation moved with the speed of regulation.Right Quasi-microscope AM1, AM2 are in order to make the pattern in substrate P to be depicted in and substrate P relatively para-position (alignment), and detect in advance The alignment mark etc. being formed in substrate P.Comprise the control portion 16 control exposure of computer, microcomputer, CPU, FPGA etc. The each several part of device EX, makes each several part perform process.Control portion 16 can be the upper control dress controlling device inspection apparatus 1 The part put or this whole upper control device.It addition, control portion 16 is controlled by upper control device.In what is called The control device of position, can be other devices such as master computer such as managing production line.

It addition, as in figure 2 it is shown, exposure device EX has supporting drawing apparatus 11 and at least of substrate transport mechanism 12 Divide the device frame 13 of (rotating cylinder DR etc.), this device frame 13 is provided with: the rotary angle position of detection rotating cylinder DR And/or the position of rotation testing agency (encoder head shown in Fig. 4 and Fig. 9 of the displacement etc. on rotary speed, rotary shaft direction Deng), aligming microscope AM1, the AM2 etc. shown in Fig. 1 (or Fig. 3, Fig. 9).And, as shown in Figure 4, Figure 5, in exposure device EX It is provided with the light supply apparatus CNT penetrated as the Ultra-Violet Laser (pulsed light) describing light beam LB.This exposure device EX will be from light source Multiple descriptions that the description light beam LB of device CNT injection distributes to be constituted drawing apparatus 11 with the light quantity (illumination) of approximate equality are single Each of unit UW1～UW5.

As it is shown in figure 1, exposure device EX is housed in homoiothermic chamber EVC.Homoiothermic chamber EVC is anti-via be passively or actively Shake cell S U1, SU2 is arranged on the face that arranges (floor) E of manufacturer.Anti-vibration unit SU1, SU2 are arranged on and arrange face E On, reduce from the vibration arranging face E.Inside is remained the temperature of regulation by homoiothermic chamber EVC, it is possible to suppression in inside The change of shape that the substrate P of conveyance is caused because of temperature.

The substrate transport mechanism 12 of exposure device EX has from the upstream side of the conveyance direction of substrate P successively: margin location Put controller EPC, drive roller DR4, tension adjustment roller RT1, rotating cylinder (cylinder cylinder) DR, tension adjustment roller RT2, driving roller DR6 and driving roller DR7.

Position the width (Y-direction) of the substrate P that marginal position controller EPC adjustment moves from processing means U1 Put.Marginal position controller EPC so that the substrate P sent here from processing means U1 width end (edge) position phase For target location be converged in ± tens μm～tens μm about in the range of mode, make substrate P fine motion in the direction of the width, To revise the position on the width of substrate P.

The driving roller DR4 of method of clamping is while clamping the table back of the body two sides of the substrate P moved from marginal position controller EPC While rotating, substrate P being sent to the downstream of conveyance direction, thus substrate P being transported towards rotating cylinder DR.Rotating cylinder DR will To be bearing in the way of being close to from the rotation centerline (rotary shaft) extended along Y-direction by the part of pattern exposure in substrate P AX2 has on the cylindric outer peripheral face of predetermined radius, and rotates around rotation centerline AX2, transports base the most along its length Plate P.

In order to make such rotating cylinder DR rotate around rotation centerline AX2, in the both sides of rotating cylinder DR are provided with and rotate Axle portion Sf2 coaxial for heart line AX2, axle portion Sf2 are bearing on device frame 13 by axle via bearing as shown in Figure 2.To this axle Portion Sf2 gives the rotating torques from not shown driving source (motor and/or reduction gear etc.).Additionally, make containing rotation Turn face p3 centered by centrage AX2 the face parallel with YZ face.

The tension force that the substrate P imparting wound and be bearing on rotating cylinder DR is specified by two groups of tension adjustment roller RT1, RT2.Two Organize clipping drive roller DR6, DR7 to configure in the conveyance direction of substrate P, with separating predetermined distance, to the substrate P after exposure Give lax (enough and to spare) DL of regulation.Drive roller DR6 clamp the upstream side of the substrate P moved and rotate, drive roller DR7 clamping The downstream of the substrate P moved also rotates, and thus substrate P is transported to processing means U2.Now, substrate P has been endowed pine Relaxation DL, it is possible to absorb and the change of conveyance speed driven compared with roller DR6 in substrate P produced by conveyance direction downstream Dynamic, it is possible to block the impact exposure-processed of substrate P produced because of the variation of conveyance speed.

Therefore, substrate transport mechanism 12 adjusts the base moved from processing means U1 by marginal position controller EPC Position on the width of plate P.Substrate transport mechanism 12 will be adjusted the substrate of width position by driving roller DR4 P transports to tension adjustment roller RT1, and the substrate P having passed through tension adjustment roller RT1 is transported to rotating cylinder DR.Substrate transporter Structure 12 makes rotating cylinder DR rotate and thus makes the substrate P being supported on rotating cylinder DR transport to tension adjustment roller RT2.Substrate is removed Send mechanism 12 substrate P being transported to tension adjustment roller RT2 to be transported to driving roller DR6, then will be transported to drive the base of roller DR6 Plate P is to driving roller DR7 conveyance.Then, substrate transport mechanism 12 is by driving roller DR6 and driving roller DR7 to give substrate P Lax DL, transports substrate P to processing means U2.

Referring again to Fig. 2, the device frame 13 of exposure device EX is illustrated.In Fig. 2, for X-direction, Y-direction and Z side To orthogonal orthogonal coordinate system, it is the orthogonal coordinate system identical with Fig. 1.

As in figure 2 it is shown, device frame 13 has from the lower side of Z-direction successively: main body frame 21, as supporting device 3 seats the 22, the 1st optical table 23, travel mechanism the 24 and the 2nd optical table 25.Main body frame 21 is via Anti-vibration unit SU1, SU2 are arranged on the part arranged on the E of face.Main body frame 21 in the way of can rotating axle supporting (supporting) rotating cylinder DR and Tension adjustment roller RT1 (not shown), RT2.1st optical table 23 is arranged on the upper side of the vertical of rotating cylinder DR, via 3 seats 22 are arranged on main body frame 21.3 seats 22 support the 1st optical table 23 by 3 supporting-points, it is possible to adjust The position (height and position) of the Z-direction at each supporting-point.Therefore, 3 seats 22 can be by the flat surface phase of the 1st optical table 23 Gradient for horizontal plane is adjusted to the gradient of regulation.Additionally, when assembling device framework 13, main body frame 21 and 3 seats 22 Between can in XY face in X direction and Y-direction carries out position adjustment.On the other hand, after assembled device framework 13, main body The state (rigid state) fixed in XY face is become between framework 21 and 3 seats 22.

2nd optical table 25 is arranged on the upper side of the vertical of the 1st optical table 23, and sets via travel mechanism 24 Put on the 1st optical table 23.The flat surface of the 2nd optical table 25 is parallel with the flat surface of the 1st optical table 23.Drawing apparatus Multiple delineation unit UW1～UW5 of 11 are arranged on the 2nd optical table 25.Travel mechanism 24 can be by the 1st optical table 23 And the 2nd the respective flat surface of optical table 25 remain under parallel state, rotary shaft I of the regulation to extend along vertical Centered by make the 2nd optical table 25 relative to the 1st the most small rotation of optical table 23.Its rotating range is such as relative to base Level is set to ± hundreds of millimeter of radian about, become the structure that can carry out angle initialization with the resolution of 1～several millimeters of radians. It addition, travel mechanism 24 also has, the 1st optical table the 23 and the 2nd respective flat surface of optical table 25 is being remained parallel In X direction and at least one party of Y-direction is accurate and minutely relative to the 1st optical table 23 to make the 2nd optical table 25 under state The mechanism that displacement is moved such that it is able to make rotary shaft I from reference position in X direction or Y-direction is small with the resolution of μm rank Displacement.This rotary shaft I extends along vertical in reference position is in median plane p3, and from being wound on rotating cylinder DR Regulation point (midpoint on the width of substrate P) in the surface (along the description face of periphery bending) of substrate P is by (ginseng According to Fig. 3).Make the 2nd optical table 25 rotate relative to the 1st optical table 23 by such travel mechanism 24 or displacement moves Dynamic, it is possible to adjust multiple delineation unit UW1～UW5 integratedly and relative to rotating cylinder DR or be wrapped on rotating cylinder DR The position of substrate P.

Then, with reference to Fig. 5, light supply apparatus CNT is described.Light supply apparatus CNT is arranged on the main body frame 21 of device frame 13 On.Light supply apparatus CNT injection is to the laser as description light beam LB of substrate P projection.Light supply apparatus CNT has light source, this light Source injection and the exposure of the photonasty functional layer in substrate P suitable specify wave band, the light in photolytic activity effect is strong ultraviolet territory mutually. As light source, it is possible to use the three-hypers such as going out or going out with several KHz～hundreds of about MHz impulse hunting YAG with continuous oscillation The LASER Light Source of subharmonic laser (wavelength 355nm).

Light supply apparatus CNT has laser generating part CU1 and wavelength conversion section CU2.Laser generating part CU1 has LASER Light Source OSC, fiber amplifier FB1, FB2.Laser generating part CU1 injection basic wave laser Ls.Fiber amplifier FB1, FB2 utilize optical fiber Amplify basic wave laser Ls.Laser generating part CU1 makes the basic wave laser Lr of amplification be incident to wavelength conversion section CU2.At wavelength Converter section CU2 is provided with wavelength converting optical element, spectroscope and/or polarising beam splitter, prism etc., by using these Light (wavelength) alternative pack takes out the laser (describing light beam LB) of the 355nm as the 3rd higher hamonic wave laser.Now, product is made The Tong Bu earth pulses such as the LASER Light Source OSC of raw seed light and system clock are lighted, thus light supply apparatus CNT generation wavelength 355nm Description light beam LB be used as a few KHz～the pulsed light of hundreds of about MHz.It addition, in the situation using this fiber amplifier Under, by the way of the pulsed drive of LASER Light Source OSC, it is possible to make sending out of 1 pulse of laser (Lr and/or LB) finally exported The light time is psec rank.

Additionally, as light source, it is possible to use the finsen lamp etc. of the bright line (g line, h line, i line etc.) such as with ultraviolet territory Lamp source, in the ultraviolet territory of below wavelength 450nm, there is consolidating of the laser diode of oscillation peak, light emitting diode (LED) etc. The KrF excimer laser (wavelength 248nm) of body light source or the extreme ultraviolet light that vibrates (DUV light), ArF excimer laser (wavelength 193nm), the gas laser light source of XeCl excimer laser (wavelength 308nm) etc..

Herein, from light supply apparatus CNT injection description light beam LB as described later via be located at each delineation unit UW1～ Polarising beam splitter PBS in UW5 and be incident upon in substrate P.Generally, polarising beam splitter PBS becomes the straight line of S-polarization light The light beam reflection of polarized light, and become the light beam transmission of the rectilinearly polarized light of P polarization light.It is therefore preferable that at light supply apparatus CNT Middle injection makes the description light beam LB being incident to polarising beam splitter PBS become as the light beam of rectilinearly polarized light (S-polarization light) Laser.Further, since the energy density of laser is high, it is possible to suitably guarantee to be projected to the illumination of the light beam of substrate P.

It follows that the drawing apparatus 11 of exposure device EX is described referring also to Fig. 3.Drawing apparatus 11 is for employing multiple description Drawing apparatus 11 unit UW1～UW5, so-called Multibeam.This drawing apparatus 11 makes retouching from light supply apparatus CNT injection Paint light beam LB and branch into multiple, and make multiple description light beam LB that branch obtains along in substrate P as Fig. 3 a plurality of ( In 1st embodiment for example, 5 articles) describe line LL1～LL5 and respectively optically focused be small some light (a few μ m diameter) and scan. Then, drawing apparatus 11 makes each by a plurality of description line LL1～LL5 and the pattern that is depicted in substrate P is each other at base Engage on the width of plate P.First, with reference to Fig. 3, to by drawing apparatus 11 so that multiple description light beam LB are scanned by This plurality of description line LL1～LL5 formed in substrate P (the scanning track of some light) illustrates.

As it is shown on figure 3, a plurality of description line LL1～LL5 arranges at the arranged circumferentially one-tenth 2 of rotating cylinder DR across median plane p3.? It is configured with odd-numbered the 1st description line LL1, the 3rd description line LL3 abreast with Y-axis in the substrate P of the upstream side of direction of rotation And the 5th describe line LL5.The substrate P in the downstream of direction of rotation is configured with abreast the 2nd even-numbered description with Y-axis Line LL2 and the 4th describes line LL4.

Respectively describe line LL1～the LL5 rotation centerline AX2 along the width (Y-direction) of substrate P, i.e. rotating cylinder DR Formed substantially in parallel, and shorter than the size of the substrate P on width.Body more closely saying, each description line LL1～LL5 is permissible The bearing of trend (axial or width) of the rotation centerline AX2 relative to rotating cylinder DR tilts with the angle of regulation, so that The pattern that must be obtained by a plurality of description line LL1～LL5 when utilizing substrate transport mechanism 12 with reference speed conveyance substrate P Bonding error becomes minimum.

Odd-numbered the 1st description line LL1, the 3rd description line LL3 and the 5th describe the line LL5 centrage at rotating cylinder DR The spaced up predetermined distance ground configuration of AX2 side.It addition, even-numbered the 2nd description line LL2 and the 4th describes line LL4 at rotating cylinder The centrage AX2 side spaced up predetermined distance ground configuration of DR.Now, the 2nd description line LL2 configures on centrage AX2 direction Describe line LL1 and the 3rd the 1st to describe between line LL3.Similarly, the 3rd describes line LL3 and is arranged in the on centrage AX2 direction 2 describe line LL2 and the 4th describes between line LL4.4th describes line LL4 is arranged in the 3rd description line LL3 on centrage AX2 direction And the 5th describes between line LL5.Further, the 1st～the 5th description line LL1～LL5 is configured to be depicted in the exposure area in substrate P The whole width of the width (axially) of A7 covers.

The description light beam LB of line LL5 scanning is described along odd-numbered the 1st description line LL1, the 3rd description line LL3 and the 5th Some light scanning direction be one-dimensional direction, become identical direction.It addition, along even-numbered 2nd description line LL2 and The scanning direction of the some light of the 4th description light beam LB describing line LL4 scanning is one-dimensional direction, becomes identical direction.Now, Along odd-numbered description line LL1, LL3, LL5 scanning descriptions light beam LB the scanning direction (+Y direction) putting light and along the Even number bar describes the scanning direction (-Y direction) of the some light of the description light beam LB of line LL2, LL4 scanning as indicated by the arrows in fig. 3 Become rightabout like that.This is because, delineation unit UW1～UW5 is respectively identical structure, and odd number delineation unit with Even number delineation unit rotates 180 ° in XY face and configures face to face, and makes to be located in each delineation unit UW1～UW5 The polygonal rotating mirror as optical beam scanner rotate in the same direction.Therefore, from the point of view of the conveyance direction of substrate P, odd number Bar describe the description starting position describing starting position and even-numbered description line LL2, LL4 of line LL3, LL5 about Y-direction with Error below the diameter dimension of some light is adjacent (or consistent), and similarly, the description of odd-numbered description line LL1, LL3 terminates End position is described about Y-direction with the error below the diameter dimension of a light with even-numbered description line LL2, LL4's in position Adjacent (or consistent).

As described above, odd-numbered description line LL1, LL3, LL5 with respectively in substrate P with the rotation of rotating cylinder DR The mode turning almost parallel for centrage AX2 is configured to string on the width of substrate P.Further, even number bar describe line LL2, LL4 by respectively in substrate P with the rotation centerline AX2 of rotating cylinder DR almost parallel in the way of on the width of substrate P It is configured to string.

It follows that drawing apparatus 11 is illustrated with reference to Fig. 4 to Fig. 7.It is single that drawing apparatus 11 has above-mentioned multiple description Unit UW1～UW5, by describing light beam LB branch and guiding branch's optics of delineation unit UW1～UW5 from light supply apparatus CNT System SL and for carrying out the calibration detecting system 31 calibrated.

The description light beam LB penetrated from light supply apparatus CNT is branched into multiple by branch's optical system SL, and branch is obtained Multiple description light beam LB respectively to multiple delineation unit UW1～UW5 guide.Branch's optical system SL has: will fill from light source The description light beam LB putting CNT injection branches into the 1st optical system 41 of 2, for the side obtained by the 1st optical system 41 branch The 2nd incident for description light beam LB optical system 42 and the description light beam of the opposing party for being obtained by the 1st optical system 41 branch The 3rd optical system 43 that LB is incident.It addition, be provided with in the 1st optical system 41 of branch's optical system SL with describe light beam The pattern displacement mechanism 44 of description light beam LB lateral displacement two-dimensionally is made, in branch's optical system in the face that the axis of travel of LB is orthogonal 3rd optical system 43 of SL is provided with the pattern displacement mechanism 45 making description light beam LB lateral displacement two-dimensionally.Branch's optical system The part being positioned at light supply apparatus CNT side of system SL is arranged on main body frame 21, and it is positioned at delineation unit UW1～UW5 side Another part be arranged on the 2nd optical table 25.

1st optical system 41 has 1/2 wave plate 51, polarizer (polarising beam splitter) 52, diffuser (beam Diffuser) the 53, the 1st reflecting mirror the 54, the 1st relay lens the 55, the 2nd relay lens 56, pattern displacement mechanism the 44, the 2nd reflecting mirror 57, the 3rd reflecting mirror the 58, the 4th reflecting mirror the 59 and the 1st beam splitter 60.Additionally, be difficult to judge these each parts in Fig. 4, Fig. 5 Configuration relation, therefore, the axonometric chart referring also to Fig. 6 illustrates.

As shown in Figure 6, the description light beam LB penetrated along +X direction from light supply apparatus CNT incides 1/2 wave plate 51.1/2 ripple Sheet 51 can rotate in the plane of incidence describing light beam LB.The polarization direction of the description light beam LB inciding 1/2 wave plate 51 becomes Polarization direction with the corresponding regulation of position of rotation (angle) of 1/2 wave plate 51.The description light beam LB having passed through 1/2 wave plate 51 enters It is incident upon polarizer 52.Polarizer 52 makes the light component transmission of the polarization direction of the regulation contained by description light beam LB, on the other hand The light component making the polarization direction beyond it reflects to +Y direction.Therefore, it is possible to by 1/2 wave plate 51 and the association of polarizer 52 Make, adjust the intensity of the description light beam LB of polarizer 52 reflection according to the position of rotation of 1/2 wave plate 51.

A part (unwanted light component) transmitted through the description light beam LB of polarizer 52 is irradiated to diffuser and (catches Light) 53.Diffuser 53 absorbs a part of light component of incident next description light beam LB, thus outside suppressing this light component to leak into Portion.And, it is additionally operable to when carrying out the adjustment operation describing the various optical systems that light beam LB is passed through, if keeping laser power The too strong ratio of maximum then power is relatively hazardous, changes therefore describe the substantial amounts of light component of light beam LB to make diffuser 53 absorb in the way of The position of rotation (angle) of 1/2 wave plate 51, and make the power of the description light beam LB towards delineation unit UW1～UW5 significantly decay.

The description light beam LB reflected to +Y direction by polarizer 52 is reflected to +X direction by the 1st reflecting mirror 54, via 1st relay lens the 55 and the 2nd relay lens 56 is incident to pattern displacement mechanism 44, and to the up to the 2nd reflecting mirror 57.

1st relay lens 55 makes to restrain from the description light beam LB (almost parallel light beam) of light supply apparatus CNT and form light Bundle receives thin (beam waist), and the description light beam LB that the 2nd relay lens 56 dissipates after making convergence becomes collimated light beam again.

As shown in Figure 6, pattern displacement mechanism 44 is containing 2 configured along the direct of travel (+X direction) describing light beam LB Planopaallel plate (quartzy), a side of this planopaallel plate is configured to tilt around the axle parallel with Y-axis, and the opposing party's is flat Parallel planes plate is configured to tilt around the axle parallel with Z axis.According to the angle of inclination of each planopaallel plate, make description light beam LB lateral displacement penetrating from pattern displacement mechanism 44 in ZY face.

Then, describe light beam LB by the 2nd reflecting mirror 57 towards-Y direction reflection to the up to the 3rd reflecting mirror 58, and by the 3rd Reflecting mirror 58 is towards-Z direction reflection to the up to the 4th reflecting mirror 59.Make description light beam LB towards +Y direction by the 4th reflecting mirror 59 Reflect and incide the 1st beam splitter 60.The a part of light quantity composition describing light beam LB is reflected by the 1st beam splitter 60 towards-X direction And guide the 2nd optical system 42, and remaining light quantity composition of description light beam LB is made to guide the 3rd optical system 43.In this reality In the case of executing mode, guide the 2nd optical system 42 description light beam LB after be assigned to 3 delineation unit UW1, UW3, UW5, is assigned to 2 delineation units UW2, UW4 after guiding the description light beam LB of the 3rd optical system 43.Accordingly, it is preferred that It is that the 1st beam splitter 60 is 3:2 (reflectance 60%, absorbance 40%) at the reflectance of light divisional plane and the ratio of absorbance, but not Necessarily must be this manner it is also possible to be 1:1.

Here, the 3rd reflecting mirror the 58 and the 4th reflecting mirror 59 sets in rotary shaft I of travel mechanism 24 with separating predetermined distance Put.That is, the 3rd reflecting mirror 58 reflect and be set towards the centrage of description light beam LB (collimated light beam) of the 4th reflecting mirror 59 Become consistent with rotary shaft I (becoming coaxial).

It addition, structure to the light supply apparatus CNT comprising the 3rd reflecting mirror 58 (Fig. 4 Z-direction upper side by The part that double dot dash line is surrounded) it is arranged on main body frame 21 side, on the other hand, single to the multiple descriptions comprising the 4th reflecting mirror 59 Structure (part that the lower side in the Z-direction of Fig. 4 is surrounded by double dot dash line) till unit UW1～UW5 is arranged on the 2nd optics and puts down Platform 25 side.Therefore, the 3rd reflecting mirror the 58 and the 4th reflecting mirror 59 is configured to: even if making the 1st optical table by travel mechanism 24 23 rotate against with the 2nd optical table 25, describe light beam LB also with rotary shaft I coaxially through, therefore from the 4th reflecting mirror 59 to The light path of the description light beam LB of the 1st beam splitter 60 will not be changed.Thus, even if making the 2nd optical table by travel mechanism 24 25 rotate relative to the 1st optical table 23, it is also possible to the description light that will penetrate from the light supply apparatus CNT being located at main body frame 21 side Bundle LB properly and stably guides to multiple delineation unit UW1～UW5 being located at the 2nd optical table 25 side.

2nd optical system 42 is by the description light beam LB branch of the side by the 1st beam splitter 60 branch of the 1st optical system 41 And guide towards odd number delineation unit UW1, UW3, UW5 described later.2nd optical system 42 have the 5th reflecting mirror 61, the 2nd point Bundle device the 62, the 3rd beam splitter the 63 and the 6th reflecting mirror 64.

The description light beam LB reflected towards-X direction by the 1st beam splitter 60 of the 1st optical system 41 is by the 5th reflecting mirror 61 Reflect towards-Y direction, and incide the 2nd beam splitter 62.Incide the 2nd beam splitter 62 description light beam LB a part by towards- Z-direction reflects, and 1 the delineation unit UW5 being directed in odd number delineation unit (with reference to Fig. 5).Transmitted through the 2nd beam splitting The description light beam LB of device 62 is incident to the 3rd beam splitter 63.Incide the 3rd beam splitter 63 description light beam LB a part by towards- Z-direction reflects, and 1 the delineation unit UW3 being directed in odd number delineation unit (with reference to Fig. 5).Further, transmitted through A part of the description light beam LB of 3 beam splitters 63 is reflected towards-Z direction by the 6th reflecting mirror 64, and is directed to odd number and retouches Paint 1 the delineation unit UW1 (with reference to Fig. 5) in unit.Additionally, in the 2nd optical system 42, to odd number delineation unit The description light beam LB that UW1, UW3, UW5 irradiate is slightly tilted relative to-Z direction.

It addition, in order to effectively utilize the power describing light beam LB, preferably make the reflectance of the 2nd beam splitter 62 and absorbance it Ratio, close to 1:2, makes the reflectance of the 3rd beam splitter 63 and the ratio of absorbance close to 1:1.

On the other hand, the opposing party that the 3rd optical system 43 will be obtained by the 1st beam splitter 60 branch of the 1st optical system 41 Description light beam LB branch and towards even number delineation unit UW2, UW4 described later guide.3rd optical system 43 has the 7th Reflecting mirror 71, pattern displacement mechanism the 45, the 8th reflecting mirror the 72, the 4th beam splitter the 73 and the 9th reflecting mirror 74.

By the 1st beam splitter 60 of the 1st optical system 41 along the description light beam LB of +Y direction transmission by the 7th reflecting mirror 71 court +X direction reflects, and then incides the 8th reflecting mirror 72 from pattern displacement mechanism 45 transmission.Pattern displacement mechanism 45 by with light beam 2 planopaallel plates (quartzy) that displacement mechanism 44 is same, can tilt are constituted, and make along +X direction towards the 8th reflecting mirror 72 row The description light beam LB lateral displacement in ZY face entered.

The description light beam LB reflected towards-Y direction by the 8th reflecting mirror 72 is incident towards the 4th beam splitter 73.It is irradiated to the 4th beam splitting A part of the description light beam LB of device 73 is reflected towards-Z direction, and 1 description being directed in the even delineation unit is single Unit UW4 (with reference to Fig. 5).Description light beam LB transmitted through the 4th beam splitter 73 is reflected towards-Z direction by the 9th reflecting mirror 74, and quilt Guide 1 delineation unit UW2 to the even delineation unit.Additionally, in the 3rd optical system 43, describe to even number The description light beam LB that unit UW2, UW4 irradiate also is to be slightly tilted relative to-Z direction.

Like this, in branch's optical system SL, the description light beam LB from light supply apparatus CNT is described list towards multiple Unit UW1～UW5 and branch into multiple.Now, the 1st beam splitter the 60, the 2nd beam splitter the 62, the 3rd beam splitter the 63 and the 4th beam splitter 73 Make it anti-in the way of making the beam intensity of description light beam LB irradiated to multiple delineation unit UW1～UW5 become same intensity Penetrate rate (absorbance) and become the suitable reflectance of the branch's number corresponding to describing light beam LB.

It addition, pattern displacement mechanism 44 is arranged between the 2nd relay lens the 56 and the 2nd reflecting mirror 57.Pattern displacement mechanism The position of 44 all description line LL1～LL5 can being formed in substrate P with the fine setting of μm rank in the description face of substrate P.

It addition, pattern displacement mechanism 45 can be with retouching that the fine setting of μm rank is formed in substrate P in the description face of substrate P Even-numbered the 2nd description line LL2 and the 4th in line drawing LL1～LL5 describes line LL4.

With further reference to Fig. 4, Fig. 5 and Fig. 7, multiple delineation unit UW1～UW5 is described.As shown in Fig. 4 (and Fig. 1), many Individual delineation unit UW1～UW5 is 2 row across median plane p3 in the arranged circumferentially of rotating cylinder DR.Multiple delineation unit UW1～ In UW5, it is being configured with the 1st, the 3rd, the 5th description this side of line LL1, LL3, LL5 (-X direction of Fig. 5 across median plane p3 Side) it is configured with the 1st delineation unit UW1, the 3rd delineation unit UW3 and the 5th delineation unit UW5.1st delineation unit UW1, the 3rd description Unit UW3 and the 5th delineation unit UW5 configures along Y-direction with separating predetermined distance.It addition, in multiple delineation unit UW1～UW5, It is configured with the 2nd description being configured with the 2nd, the 4th description this side of line LL2, LL4 (the +X direction side of Fig. 5) across median plane p3 Unit UW2 and the 4th delineation unit UW4.2nd delineation unit UW2 and the 4th delineation unit UW4 joins along Y-direction with separating predetermined distance Put.Now, shown in Fig. 2 or Fig. 5 as in the previous, the 2nd delineation unit UW2 is positioned at the 1st delineation unit UW1 and the 3rd in the Y direction and retouches Paint between unit UW3.Similarly, the 3rd delineation unit UW3 is positioned at the 2nd delineation unit UW2 and the 4th delineation unit in the Y direction Between UW4.4th delineation unit UW4 is in the Y direction between the 3rd delineation unit UW3 and the 5th delineation unit UW5.It addition, such as Shown in Fig. 4, the 1st delineation unit UW1, the 3rd delineation unit UW3 and the 5th delineation unit UW5 and the 2nd delineation unit UW2 and the 4th retouch Paint unit UW4 to configure symmetrically centered by median plane p3 when observing from Y-direction.

It follows that the structure of optical system in each delineation unit UW1～UW5 is described with reference to Fig. 4.Additionally, due to respectively retouch Painting unit UW1～UW5 is identical structure, so entering as a example by the 1st delineation unit UW1 (hereinafter simply referred to as delineation unit UW1) Row explanation.

Delineation unit UW1 shown in Fig. 4 has: for along describing line LL1 (the 1st describes line LL1) to describe light beam LB Some photoscanning, light deflector 81, polarising beam splitter PBS, quarter wave plate 82, scanning device 83, bending mirror 84, f-θ lens System 85 and Y multiplying power correction optics (battery of lens) 86B comprising cylindrical lens 86.It addition, with polarising beam splitter PBS It is disposed adjacently calibration detecting system 31.

Light deflector 81 uses such as acousto-optic element (AOM:Acousto Optic Modulator；Acousto-optic modulator). AOM is by whether switch to the description light beam making incidence at inner utilization ultrasound wave (high-frequency signal) generation diffraction grid On-state (ON state) that 1 diffraction light produces with the angle of diffraction direction of regulation and the off-state not producing a diffraction light The light switching device of (OFF state).

Control portion 16 shown in Fig. 1 switches description light beam rapidly by light deflector 81 switches to on/off LB is to the projection of substrate P/non-projection.Specifically, on light deflector 81 via relay lens 91 relative to-Z direction somewhat Irradiate had in the description light beam LB by branch's optical system SL distribution obliquely.Disconnection is switched at light deflector 81 Time, describe light beam LB and advance in a slanted state, and dark slide 92 shading arranged in the front having passed through light deflector 81. On the other hand, when light deflector 81 switches to connection, describe light beam LB (1 diffraction light) and deflected to-Z direction, by light On the polarising beam splitter PBS that deflector 81 and being irradiated to is located in the Z-direction of light deflector 81.Therefore, at light deflector 81 When switching to connection, the some light describing light beam LB is incident upon in substrate P, when light deflector 81 switches to disconnection, describes light beam The point light of LB is not incident upon in substrate P.

Additionally, AOM is arranged in the light beam of the description light beam LB restrained by relay lens 91 receives thin position, therefore from The description light beam LB (1 diffraction light) of light deflector 81 injection dissipates.To this end, after light deflector 81, be provided with and make to send out The description light beam LB dissipated reverts to the relay lens 93 of collimated light beam.

The description light beam LB reflection that polarising beam splitter PBS will irradiate via relay lens 93 from light deflector 81.From The description light beam LB of polarising beam splitter PBS injection sequentially enters quarter wave plate 82, scanning device 83 (polygonal rotating mirror), bending Mirror 84, f-θ lens combination 85, Y multiplying power correction optics 86B and cylindrical lens 86, and exist as scanning element light optically focused In substrate P.

On the other hand, polarising beam splitter PBS and 1/4 ripple that is arranged between polarising beam splitter PBS and scanning device 83 Sheet 82 cooperates so that the reflection light of the description light beam LB being incident upon on the outer peripheral face of substrate P or the rotating cylinder DR under it is the most anti- To entering Y multiplying power correction optics 86B, cylindrical lens 86, f-θ lens combination 85, bending mirror 84, scanning device 83, therefore Reflection light transmission can be made.It is to say, the description light beam LB irradiated to polarising beam splitter PBS from light deflector 81 is to become The laser of the rectilinearly polarized light of S-polarization light, by polarising beam splitter PBS.It addition, by polarising beam splitter PBS Describe light beam LB by quarter wave plate 82, scanning device 83, bending mirror 84, f-θ lens combination 85, Y multiplying power correction optics 86B, cylindrical lens 86 and be radiated in substrate P, and the some light of the description light beam LB that optically focused is in substrate P becomes circularly polarized light. From substrate P (or outer peripheral face of rotating cylinder DR) reflection light be redirected back into describe light beam LB send light light path and again by Quarter wave plate 82, thus becomes the laser of the rectilinearly polarized light becoming P polarization light.Therefore, arrive from substrate P (or rotating cylinder DR) To the reflection light of polarising beam splitter PBS transmitted through polarising beam splitter PBS, it is radiated at calibration detection via relay lens 94 On the photoelectric sensor 31Cs of system 31.

Like this, the scanning optics that polarisation is disposed on comprising scanning device 83 to beam splitter PBS with calibration detection is Light dispenser between system 31.Calibration detecting system 31 share make description light beam LB directive substrate P send the big of light optical system Amount part, therefore becomes easy and compact optical system.

As shown in Fig. 4 and Fig. 7, scanning device 83 has reflecting mirror 96, polygonal rotating mirror (polygon mirror) 97 and former Spot detector 98.Description light beam LB (collimated light beam) having passed through quarter wave plate 82 is existed by reflecting mirror 96 via after cylindrical lens 95 The internal reflection of XY face, and be irradiated on polygonal rotating mirror 97.Polygonal rotating mirror 97 is configured to comprise the rotary shaft extended along Z-direction 97a and the multiple reflecting surface 97b formed around rotary shaft 97a.Polygonal rotating mirror 97 centered by rotary shaft 97a around regulation Direction of rotation rotate, thus make the description light beam LB being radiated on reflecting surface 97b (carried out intensity modulated by light deflector 81 After light beam) angle of reflection continuous print change in XY face, thus, the description light beam LB of reflection is saturating by bending mirror 84, f-θ Mirror system the 85, the 2nd cylindrical lens 86 (and Y multiplying power correction optics 86B) and be concentrated on a light, and along in substrate P Describe line LL1 (similarly along LL2～LL5) scanning.Origin detector 98 detects description line LL1 (the similarly edge along substrate P LL2～LL5) initial point of description light beam LB that scans.Origin detector 98 is across the description light beam LB reflected by each reflecting surface 97b And it is arranged in the contrary survey of reflecting mirror 96.

In Fig. 7 for the purpose of simplifying the description, illustrate only photoelectric detector about origin detector 98, but it practice, also set up LED and/or the quasiconductor of the oriented reflecting surface 97b projection detecting light beam being projected the polygonal rotating mirror 97 describing light beam LB swash The test light source of light etc., origin detector 98 via narrower slit come this detecting light beam of Photoelectric Detection at reflecting surface The reflection light of 97b reflection.

Thus, origin detector 98 is configured to: always relative to the description line LL1 making a light be irradiated in substrate P Certain time ground is done sth. in advance in the timing describing starting position of (LL2～LL5), and output represents the pulse signal of initial point.

It is irradiated to bend the description light beam LB of mirror 84 from scanning device 83 be bent mirror 84 and reflect towards-Z direction, and incides F-θ lens combination 85, cylindrical lens 86 (and Y multiplying power correction optics 86B).

If it addition, each reflecting surface 97b of polygonal rotating mirror 97 does not has the most parallel with the centrage of rotary shaft 97a, But be slightly tilted (face inclination), then make the description line (LL1～LL5) formed based on the some light being incident upon in substrate P press every Individual reflecting surface 97b moves in substrate P in X direction.To this end, use Fig. 8 explanation to subtract by arranging 2 cylindrical lenses 95,86 Less or eliminate the face of each reflecting surface 97b for polygonal rotating mirror 97 and tilt description line LL1～LL5 that taked in X direction Mobile.

The left side of Fig. 8 shows cylindrical lens 95, scanning device 83, f-θ lens combination 85, the light path of cylindrical lens 86 Being deployed in the situation of X/Y plane, the right side of Fig. 8 shows the situation that this light path is deployed in XZ plane.Join as basic optics Putting, the reflecting surface 97b of the illuminated description light beam LB of polygonal rotating mirror 97 is configured in the incident illumination of f-θ lens combination 85 Pupil position (focal position, front side).Thus, relative to the rotation angle θ p/2 of polygonal rotating mirror 97, it is incident to f-θ lens combination 85 The angle of incidence of description light beam LB become θ p, proportionally determine to be incident upon in substrate P (plane of illumination) with this incidence angle θ p The image height position of some light.Further, since make reflecting surface 97b become the focal position, front side of f-θ lens combination 85, thus project No matter description light beam LB in substrate P is telecentricity state in which position described on line (becomes the description light beam of a light Chief ray all the time with parallel for the optical axis AXf state of f-θ lens combination 85).

As shown in Figure 8,2 cylindrical lenses 95,86 are in the face (XY face) vertical with rotary shaft 97a of polygonal rotating mirror 97 All play a role as the parallel plate glass that refracting power (power) is zero, and the Z-direction (XZ extended in rotary shaft 97a In face) all play a role as the convex lens with certain positive refracting power.Incide the description light beam of the 1st cylindrical lens 95 The circle that cross sectional shape is a few about mm of LB (almost parallel light beam), but if by the focus position in the XZ face of cylindrical lens 95 Put and be set on the reflecting surface 97b of polygonal rotating mirror 97 via reflecting mirror 96, then have in XY face a few mm width of light beam, In Z-direction, the some light of the slit-shaped of convergence extends ground optically focused on reflecting surface 97b along direction of rotation.

The description light beam LB reflected by the reflecting surface 97b of polygonal rotating mirror 97 is collimated light beam in XY face, but in XZ face Interior (bearing of trend of rotary shaft 97a), becomes divergent beams and is incident to f-θ lens combination 85.Therefore, just from f-θ lens The description light beam LB (bearing of trend of rotary shaft 97a) in XZ face of system 85 injection becomes almost parallel light beam, but because of the 2nd post The effect of face lens 86, about in XZ face, the removing of i.e. orthogonal with the bearing of trend describing line LL1～LL5 in substrate P substrate P Sending direction, also optically focused is a light.Its result is, each point light describing to be transmitted with circle on line in substrate P.

By arranging cylindrical lens 86, as shown in the right side of Fig. 8, it is possible to anti-by polygonal rotating mirror 97 in XZ face Penetrate face 97b and substrate P (plane of illumination) is set as optically image conjugate relation.Therefore, each reflecting surface 97b of polygonal rotating mirror 97 Even if there is inclination relative to the non-scan direction (bearing of trend of rotary shaft 97a) orthogonal with the scanning direction describing light beam LB Error, the position of the description line (LL1～LL5) in substrate P also will not be in the non-scan direction (conveyance direction of substrate P) of a light Upper offset.Like this, by arranging cylindrical lens 95,86 before and after polygonal rotating mirror 97, it is possible to constitute for The face tilt correction optical system of the multiaspect reflecting surface of non-scan direction.

Here, as it is shown in fig. 7, each scanning device 83 of multiple delineation unit UW1～UW5 becomes symmetrical relative to median plane p3 Structure.3 scanning devices 83 corresponding with delineation unit UW1, UW3, UW5 in multiple scanning devices 83 are arranged in the rotation of rotating cylinder DR Turning the upstream side (the-X direction side of Fig. 7) in direction, 2 scanning devices 83 corresponding with delineation unit UW2, UW4 are arranged in rotating cylinder The downstream (the +X direction side of Fig. 7) of the direction of rotation of DR.And, 3 scanning devices 83 of upstream side and 2 scannings in downstream Device 83 clips median plane p3 and is arranged as opposed to.Like this, 3 scanning devices 83 of upstream side become with 2 scanning devices 83 in downstream For rotating the configuration relation of 180 ° centered by rotary shaft I (Z axis).Therefore, if the 3 of upstream side polygonal rotating mirror 97 examples As to anticlockwise, while making description light beam LB expose on polygonal rotating mirror 97, then the description light reflected by polygonal rotating mirror 97 Bundle LB is from describing starting position to describing end position scanning direction (+Y direction of the such as Fig. 7) scanning along regulation.The opposing party Face, if the 2 of downstream polygonal rotating mirrors 97 are to anticlockwise, while making description light beam LB expose to polygonal rotating mirror 97 On, then the description light beam LB reflected by polygonal rotating mirror 97 from describe starting position to describe end position along with upstream side Scanning direction (-Y direction of the such as Fig. 7) scanning that 3 polygonal rotating mirrors 97 are contrary.

During here, observe in the XZ face of Fig. 4, arrive the description of substrate P from odd number delineation unit UW1, UW3, UW5 The axis of light beam LB becomes the direction consistent with arranging rhumb line Le1.Become in XZ face it is to say, arrange rhumb line Le1 Link odd-numbered description line LL1, LL3, LL5 and the line of rotation centerline AX2.Similarly, observe in the XZ face of Fig. 4 Time, become from the axis of the description light beam LB of even number delineation unit UW2, UW4 arrival substrate P and rhumb line Le2 mono-is set The direction caused.Become in XZ face in link even-numbered description line LL2, LL4 and rotation it is to say, arrange rhumb line Le2 The line of heart line AX2.Therefore, substrate P becomes each direct of travel (chief ray) of the description light beam LB of light projection equal It is set to the rotation centerline AX2 towards rotating cylinder DR.

Y multiplying power correction optics 86B is arranged between f-θ lens combination 85 and substrate P.Y multiplying power correction optics Description line LL1～LL5 that parts 86B can make to utilize each delineation unit UW1～UW5 to be formed the most isotropically with Pettiness amount expands or shrinks.

Specifically, it is possible to use following mechanism, i.e. make to be covered each by describe line LL1～LL5 has certain thickness Radioparent planopaallel plate (quartzy) mechanically bend (bending) about the bearing of trend describing line and make description line The multiplying power of Y-direction (scanning is long) variable mechanism or make the parts of these 3 groups of lens combinations of convex lens, concavees lens, convex lens Move along optical axis direction and make the variable mechanism etc. of the multiplying power (scanning long) of the Y-direction of description line.

The each several part of the drawing apparatus 11 so constituted is controlled by controlling portion 16, thus depicts regulation in substrate P Pattern.It is to say, control portion 16 is being projeced into the description light beam LB of substrate P during scanning direction is scanned, based on should The CAD information of the pattern described in substrate P carries out on/off modulation to light deflector 81, thus makes description light beam LB Deflection, depicts pattern on the photoinduction layer of substrate P.It addition, control portion 16 is by making along the description describing line LL1 scanning The mobile synchronization of the conveyance direction of the substrate P that the scanning direction of light beam LB and rotation based on rotating cylinder DR are carried out comes in exposure The part corresponding with describing line LL1 in the A7 of region depicts the pattern of regulation.

It follows that aligming microscope AM1, AM2 are described with reference to Fig. 3 and Fig. 9.Aligming microscope AM1, AM2 detect in advance The alignment mark that is formed in substrate P or be formed at the reference mark on rotating cylinder DR and/or reference pattern etc..Hereinafter, will The alignment mark of substrate P and the reference mark of rotating cylinder DR and/or reference pattern are referred to as labelling.Aligming microscope AM1, AM2 For making the pattern para-position (alignment) of the regulation in substrate P and substrate P to be depicted in or to rotating cylinder DR and drawing apparatus 11 Calibrate.

Aligming microscope AM1, AM2 are arranged on rotating cylinder compared with description line LL1～LL5 formed by drawing apparatus 11 The upstream side of the direction of rotation (conveyance direction of substrate P) of DR.It addition, aligming microscope AM1 joins compared with aligming microscope AM2 Put the upstream side of direction of rotation at rotating cylinder DR.

Aligming microscope AM1, AM2 are projected to substrate P or rotating cylinder DR by by illumination light, and make the light that mark produces The incident objective system GA as detection probe (is representatively shown as the objective system of aligming microscope AM2 in Fig. 9 GA4) and by the labelling to receiving via objective system GA such as two-dimensional CCD, CMOS as (bright visual field picture, dark ground picture, Fluorescence picture etc.) carry out the camera system GD (being representatively shown as the camera system GD4 of aligming microscope AM2 in Fig. 9) that shoots Deng composition.Additionally, be the wave band for having sensitivity for the photoinduction layer in substrate P hardly to mutatis mutandis illumination light The light of light, such as wavelength 500～about 800nm.

Aligming microscope AM1 (width of substrate P) in the Y direction is provided with multiple (such as 3) along string arrangement.With Sample ground, aligming microscope AM2 (width of substrate P) in the Y direction is provided with multiple (such as 3) along string arrangement.The most just Being to say, aligming microscope AM1, AM2 are provided with 6 altogether.

In Fig. 3, in order to easily determine, it is shown that in each objective system GA of 6 aligming microscopes AM1, AM2,3 right The configuration of each objective system GA1～GA3 of quasi-microscope AM1.Each objective system GA1 based on 3 aligming microscope AM1～ GA3 and viewing area (detection position) Vw1～Vw3 in the substrate P (or outer peripheral face of rotating cylinder DR) that formed as shown in Figure 3 that Sample configures in the Y-direction parallel with rotation centerline AX2 at a prescribed interval.As it is shown in figure 9, by each viewing area Vw1 ～optical axis L a1 of each objective system GA1～GA3 at the center of Vw3～La3 all parallel with XZ face.Similarly, based on 3 alignments Each objective system GA of microscope AM2 and viewing area Vw4～Vw6 in the substrate P (or outer peripheral face of rotating cylinder DR) that formed Configure at a prescribed interval in the Y-direction parallel with rotation centerline AX2 as shown in Figure 3.As it is shown in figure 9, by each Optical axis L a4～the La6 of each objective system GA at the center of viewing area Vw4～Vw6 are all the most parallel with XZ face.And, observation area Territory Vw1～Vw3 and viewing area Vw4～Vw6 configures in the direction of rotation of rotating cylinder DR at a prescribed interval.

Based on this aligming microscope AM1, AM2, viewing area Vw1～Vw6 of labelling is set in substrate P and/rotating cylinder DR It is scheduled in the range of the such as 500～200 square left and right of μm.Here, optical axis L a1 of aligming microscope AM1～La3, i.e. object lens system Optical axis L a1～the La3 of system GA are set as with from rotation centerline AX2 to extended rhumb line Le3 of the radial direction of rotating cylinder DR Identical direction.Like this, arrange and when rhumb line Le3 is observed in the XZ face of Fig. 9, become the observation linking aligming microscope AM1 Region Vw1～Vw3 and the line of rotation centerline AX2.Similarly, optical axis L a4 of aligming microscope AM2～La6, i.e. object lens Optical axis L a4 of system GA～La6 set with from rotation centerline AX2 towards rhumb line Le4 that arranges radially extended of rotating cylinder DR For identical direction.Like this, rhumb line Le4 is set and becomes link aligming microscope AM2's when observing in the XZ face of Fig. 9 The line of viewing area Vw4～Vw6 and rotation centerline AX2.Now, aligming microscope AM1 is compared with aligming microscope AM2 Be arranged in the upstream side of the direction of rotation of rotating cylinder DR, therefore median plane p3 with arrange during rhumb line Le3 angulation is more than Heart face p3 with rhumb line Le4 angulation is set.

Describe line LL1's～LL5 as it is shown on figure 3, be configured with separating predetermined distance in substrate P in X direction by 5 The exposure area A7 that each is depicted.Such as formed useful around exposure area A7 in substrate P in crosswise Multiple alignment mark Ks1～Ks3 (hreinafter referred to as labelling) in para-position.

In Fig. 3, labelling Ks1 is arranged the most at certain intervals in the neighboring area of-Y side of exposure area A7, mark Note Ks3 is arranged the most at certain intervals in the neighboring area of+Y side of exposure area A7.And, labelling Ks2 is along X side The central authorities of Y-direction it are arranged at white space between 2 adjacent exposure area A7.

Further, labelling Ks1 is formed as during conveying substrate P successively in the sight of objective system GA1 of aligming microscope AM1 Examine in the Vw1 of region and aligming microscope AM2 objective system GA viewing area Vw4 in be caught in.It addition, labelling Ks3 shape Become during conveying substrate P successively in the viewing area Vw3 of the objective system GA3 of aligming microscope AM1 and be directed at micro- It is caught in the viewing area Vw6 of the objective system GA of mirror AM2.And, labelling Ks2 is formed as dividing during conveying substrate P The most successively in the viewing area Vw2 of the objective system GA2 of aligming microscope AM1 and the objective system GA of aligming microscope AM2 Viewing area Vw5 in be caught in.

Therefore, in 3 aligming microscopes AM1, AM2, the aligming microscope AM1 of the both sides of the Y-direction of rotating cylinder DR, AM2 can observe or detect both sides labelling Ks1, the Ks3 of the width being formed at substrate P all the time.It addition, 3 alignments are aobvious Aligming microscope AM1, AM2 in micro mirror AM1, AM2, rotating cylinder DR Y-direction central authorities can observe all the time or detect The labelling Ks2 that the places such as the exposure area A7 described in substrate P gutter each other are formed.

Here, exposure device EX is the drawing apparatus of so-called Multibeam, therefore to engage logical the most suitably Cross multiple delineation unit UW1～UW5 each and describe multiple patterns that line LL1～LL5 describe in substrate P each other, need to be used for By joining accuracy based on multiple delineation unit UW1～UW5 suppression calibration in allowed band.In addition, it is necessary to pass through baseline Management critically obtains viewing area Vw1～Vw6 of aligming microscope AM1, AM2 relative to multiple delineation unit UW1s'～UW5 Each relative position relation describing line LL1～LL5.For this baseline management, it is also desirable to calibration.

For confirming the calibration of joining accuracy based on multiple delineation unit UW1～UW5 and for aligming microscope In the calibration of the baseline management of AM1, AM2, need supporting substrates P rotating cylinder DR outer peripheral face base is set at least partially Fiducial mark note and/or reference pattern.To this end, as shown in Figure 10, employ in exposure device EX and be provided with reference mark at outer peripheral face And/or the rotating cylinder DR of reference pattern.

Rotating cylinder DR is identically formed with composition position of rotation described later detection in the both end sides of its outer peripheral face with Fig. 3, Fig. 9 Scale portion GPa, GPb of a part for mechanism 14.It addition, rotating cylinder DR in the inner side of scale portion GPa, GPb in the range of complete cycle Carve and be provided with narrow restriction band CLa, the CLb formed by the rib of concave groove or convex.Width in the Y-direction of substrate P sets Interval in fixed the Y-direction than these 2 restrictions band CLa, CLb is little, and substrate P by the outer peripheral face of rotating cylinder DR, by The region of the inner side limiting band CLa, CLb clamping supports closely.

Rotating cylinder DR (also is being able to by being provided with latticed reference pattern on the outer peripheral face limited clamped by band CLa, CLb As reference mark) RMP, in this reference pattern RMP, repeatedly carves with certain spacing (cycle) Pf1, Pf2 and is provided with relative to rotation Turn centrage AX2 with+45 degree tilt multiple line chart cases RL1 (line pattern) and relative to rotation centerline AX2 with- 45 degree of multiple line chart cases RL2 (line pattern) tilted.Additionally, the width of line chart case RL1 and line chart case RL2 is LW.

Frictional force and/or substrate P at the part that reference pattern RMP contacts with the outer peripheral face in substrate P with rotating cylinder DR The mode that tension force etc. do not change becomes whole uniform skewing scheme case (oblique trellis pattern).Additionally, line chart case RL1, RL2 need not 45 degree must be tilted, it is also possible to be to make that line chart case RL1 is parallel with Y-axis, make line chart case RL2 in length and breadth latticed parallel with X-axis Pattern.And, pattern RL1, RL2 need not be with 90 degree of intersections, it is also possible to so that by 2 adjacent bar chart cases RL1 and adjacent 2 The rectangular area that line chart case RL2 is surrounded becomes angle as the rhombus beyond square (or rectangle), makes line chart case RL1, RL2 Intersect.

It follows that position of rotation testing agency 14 is described with reference to Fig. 3, Fig. 4 and Fig. 9.As it is shown in figure 9, position of rotation detection Mechanism 14 is the mechanism of the position of rotation being detected optically by rotating cylinder DR, such as, be suitable for the encoder employing rotary encoder etc. System.Position of rotation testing agency 14 be have the both ends being arranged on rotating cylinder DR scale portion GPa, GPb and respectively with mark The traverse measuring device of multiple encoder head EN1, EN2, EN3, EN4 that chi portion GPa, GPb are relative.In Fig. 4 and Fig. 9, only Show 4 encoder head EN1, EN2, EN3, EN4s relative with scale portion GPa, but be also oppositely disposed with scale portion GPb There is same encoder head EN1, EN2, EN3, EN4.Position of rotation testing agency 14 has can detect the two of rotating cylinder DR Extensometer YN1, YN2, YN3, YN4 of the movement (the pettiness displacement in the Y-direction that rotation centerline AX2 is extended) of end.

The scale of scale portion GPa, GPb is formed as ring-type respectively in the range of the whole circumference of the outer peripheral face of rotating cylinder DR. Scale portion GPa, GPb are to carve with certain spacing (such as 20 μm) in the circumference of outer peripheral face of rotating cylinder DR to be provided with concavely or convexly The diffraction grid of grid line, be configured to crescendo type scale.Therefore, scale portion GPa, GPb is around rotation centerline AX2 and rotating cylinder DR rotates integratedly.

Substrate P is configured to be wound on the inner side of scale portion GPa, GPb of avoiding two ends of rotating cylinder DR, namely limit Inner side with CLa, CLb.In the case of needing tight configuration relation, be set as the outer peripheral face making scale portion GPa, GPb with The outer peripheral face of the part being wound on the substrate P on rotating cylinder DR becomes the same face (having same radius from centrage AX2).For This, make the outer peripheral face of scale portion GPa, GPb radially only exceed base relative to rotating cylinder DR for winding the outer peripheral face of substrate The amount of thickness of plate P.Therefore, it is possible to the outer peripheral face of scale portion GPa, the GPb that will be formed on rotating cylinder DR is set as and base The radius that the outer peripheral face of plate P is roughly the same.Thus, encoder head EN1, EN2, EN3, EN4 can be wound on rotating cylinder Describe to detect at the identical radial position in face scale portion GPa, GPb in the substrate P of DR, it is possible to reduce because measuring position and process Position is at the radially different produced Abbe error of rotary system.

Encoder head EN1, EN2, EN3, EN4 be arranged respectively at when observing from rotation centerline AX2 scale portion GPa, Around GPb, become in the different position of the circumference of rotating cylinder DR.This encoder head EN1, EN2, EN3, EN4 and control portion 16 connect.Encoder head EN1, EN2, EN3, EN4 to scale portion GPa, GPb project measuring light beam, and Photoelectric Detection its Reflection light beam (diffraction light), thus detects signal (such as, tool by corresponding with the change in location of the circumference of scale portion GPa, GPb Have 2 phase signals of 90 degree of phase contrasts) export to control portion 16.This detection is believed by control portion 16 by not shown counter circuit Number carry out interpolation interpolation row number of going forward side by side to process, it is possible to the resolution measurement rotating cylinder DR with secondary micron angle change, The i.e. change in location of the circumference of its outer peripheral face.Control portion 16 can also go out removing of substrate P from the angle measure of the change of rotating cylinder DR Send speed.

It addition, as shown in Fig. 4 and Fig. 9, encoder head EN1 is arranged in and arranges in rhumb line Le1.Rhumb line Le1 is set Projected area (the reading linking measurement light beam based on encoder head EN1 in scale portion GPa (GPb) is become in XZ face Fetch bit is put) with the line of rotation centerline AX2.It addition, as described above, arranging rhumb line Le1 becomes in XZ face and will retouch The line that line drawing LL1, LL3, LL5 and rotation centerline AX2 link.Based on above content, the reading of link encoder read head EN1 Fetch bit is put the line with rotation centerline AX2 and links the line describing line LL1, LL3, LL5 with rotation centerline AX2 For identical rhumb line.

Similarly, as shown in Fig. 4 and Fig. 9, encoder head EN2 is arranged in and arranges in rhumb line Le2.Rhumb line is set Le2 becomes in XZ face and (is read the measurement light beam based on encoder head EN2 projected area in scale portion GPa (GPb) Fetch bit is put) line that links with rotation centerline AX2.It addition, as described above, arranging rhumb line Le2 becomes in XZ face The line that line LL2, LL4 link will be described with rotation centerline AX2.Based on above content, the reading of link encoder read head EN2 It is phase that fetch bit put the line with rotation centerline AX2 and linking to be described the line of line LL2, LL4 and rotation centerline AX2 Same rhumb line.

It addition, as shown in Fig. 4 and Fig. 9, encoder head EN3 is arranged in and arranges in rhumb line Le3.Rhumb line Le3 is set Become in XZ face and the measurement light beam based on encoder head EN3 projected area in scale portion GPa (GPb) (is read Position) line that links with rotation centerline AX2.It addition, as described above, arrange rhumb line Le3 become in XZ face by Line viewing area Vw1～Vw3 of substrate P linked with rotation centerline AX2 based on aligming microscope AM1.Based on Upper content, link encoder read head EN3 reads position and the line of rotation centerline AX2 and link aligming microscope AM1 Viewing area Vw1～Vw3 become identical rhumb line with the line of rotation centerline AX2 when observing in XZ face.

Similarly, as shown in Fig. 4 and Fig. 9, encoder head EN4 is arranged in and arranges in rhumb line Le4.Rhumb line is set Le4 becomes in XZ face and (is read the measurement light beam based on encoder head EN4 projected area in scale portion GPa (GPb) Fetch bit is put) line that links with rotation centerline AX2.It addition, as described above, arranging rhumb line Le4 becomes in XZ face The line that based on aligming microscope AM2, viewing area Vw4～Vw6 of substrate P will be linked with rotation centerline AX2.Based on Above content, link encoder read head EN4 reads position and the line of rotation centerline AX2 and link aligming microscope Viewing area Vw4～Vw6 of AM2 and the line of rotation centerline AX2 become identical rhumb line when observing in XZ face.

With arrange rhumb line Le1, Le2, Le3, Le4 presentation code device read head EN1, EN2, EN3, EN4 orientation is set In the case of (angle direction in XZ face centered by rotation centerline AX2), as shown in Figure 4, so that arranging rhumb line The mode that Le1, Le2 become angle ± θ ° relative to median plane p3 configures multiple delineation unit UW1～UW5 and encoder head EN1、EN2.Rhumb line Le1 is set and rhumb line Le2 is set so that encoder head EN1 and encoder head EN2 is at scale Become the state that spatially will not interfere around the scale of portion GPa (GPb) to arrange.

Extensometer YN1, YN2, YN3, YN4 are arranged respectively at scale portion GPa or GPb when observing from rotation centerline AX2 Around, become in the different position of the circumference of rotating cylinder DR.This extensometer YN1, YN2, YN3, YN4 are connected with control portion 16.

Extensometer YN1, YN2, YN3, YN4 by with the description face in the substrate P being wound on rotating cylinder DR radially The nearest position detection displacement, it is possible to reduce Abbe error.Extensometer YN1, YN2, YN3, YN4 are towards rotating cylinder DR Both ends one side project measuring light beam, and Photoelectric Detection its reflection light beam (or diffraction light), thus will be with rotating cylinder The change in location of the Y-direction (width of substrate P) at the both ends of DR detects signal accordingly and exports to control portion 16.Control , by not shown measuring circuit (counter circuit and interpolation interpolating circuit etc.) this detection signal of digital processing, thus can in portion 16 Reach the change in displacement of the Y-direction of resolution measurement rotating cylinder DR (and substrate P) with secondary micron.Control portion 16 can also be from rotation The offset rotation of the change-detection rotating cylinder DR of one side at the both ends of cylinder DR.

Extensometer YN1, YN2, YN3, YN4, although as long as there being 1 in 4, but in order to measure rotating cylinder DR's Offset rotation etc., if more than 3 in 4, it becomes possible to grasp the trend in the face of a side at the both ends of rotating cylinder DR (dynamically Changes in pitch etc.).Additionally, can stably measure the labelling in substrate P by aligming microscope AM1, AM2 in control portion 16 And/or in the case of pattern (or the labelling etc. on rotating cylinder DR), it is also possible to omit extensometer YN1, YN2, YN3, YN4.

Here, control portion 16 is by the anglec of rotation of encoder head EN1, EN2 detection scale portion (rotating cylinder DR) GPa, GPb Degree position, and carry out based on odd number and even number delineation unit UW1～UW5 based on the rotary angle position detected Description.It is to say, control portion 16 the description light beam LB projected to substrate P to scanning direction scan during, based on At the CAD information of the pattern that substrate P is described, light deflector 81 should be carried out on/off to modulate, but based on the rotation detected Gyration position carries out the timing of the on/off modulation of light deflector 81, it is possible to precision is well at the photoinduction layer of substrate P On depict pattern.

It addition, control portion 16 is by being stored in the alignment mark detecting in substrate P by aligming microscope AM1, AM2 The anglec of rotation position of scale portion GPa, GPb (rotating cylinder DR) during Ks1～Ks3, that detected by encoder head EN3, EN4 Put, it is possible to that obtains between position and the rotary angle position of rotating cylinder DR of alignment mark Ks1～Ks3 in substrate P is corresponding Relation.Similarly, control portion 16 detects the reference pattern on rotating cylinder DR by being stored in by aligming microscope AM1, AM2 The rotary angle position of scale portion GPa, GPb (rotating cylinder DR) during RMP, that detected by encoder head EN3, EN4, energy Enough obtain the corresponding relation between position and the rotary angle position of rotating cylinder DR of the reference pattern RMP on rotating cylinder DR.Picture So, aligming microscope AM1, AM2 can critically measure the rotation of the moment sampling labelling in viewing area Vw1～Vw6 The rotary angle position (or circumferential position) of rotating cylinder DR.And, in exposure device EX, based on this measurement result make substrate P with The pattern para-position (alignment) of regulation described in substrate P or rotating cylinder DR and drawing apparatus 11 are calibrated.

Additionally, the sampling of reality is by being carried out as follows, i.e. at the rotating cylinder arrived by encoder head EN3, EN4 measurement The rotary angle position of DR becomes and the labelling in the substrate P substantially distinguished in advance and/or the reference pattern on rotating cylinder DR During angle position corresponding to position, the portrait high speed information ground that will export from each camera system GD of aligming microscope AM1, AM2 It is written in image storage etc., thus carries out the sampling of reality.That is, with by encoder head EN3, EN4 measurement to rotation The portrait information exported from each camera system GD, for triggering, is sampled by the rotary angle position of rotating cylinder DR.It addition, except the party Outside method, also there is each pulse of the clock signal in response to certain frequency and sample simultaneously and surveyed by encoder head EN3, EN4 The rotary angle position (counter measures value) of the rotating cylinder DR of amount and the method for the portrait information from each camera system GD output.

Further, since the labelling in substrate P and the reference pattern RMP on rotating cylinder DR are relative to viewing area Vw1～Vw6 Move to a direction, so when the sampling of the portrait information exported from each camera system GD, scooping up as CCD and/or CMOS Element and expect to use the fast element of shutter speed.It is accompanied by this, in addition it is also necessary to improve and viewing area Vw1～Vw6 is shone The brightness of bright illumination light, as the lighting source of aligming microscope AM1, AM2, it may be considered that use flash lamp and high brightness LED etc..

Figure 11 is the explanatory diagram representing the position relationship described between line and depicting pattern on substrate.Delineation unit UW1 ～UW5 is along describing line LL1～the LL5 point photoscanning with description light beam LB, thus depicts pattern P T1～PT5.Describe line Description starting position OC1～OC5 of LL1～LL5 becomes the description initiating terminal PTa of pattern P T1～PT5.Describe line LL1～LL5 Description end position EC1～EC5 become description terminal PTb of pattern P T1～PT5.

The description initiating terminal PTa of pattern P T1, description terminal PTb described in terminal PTb and the description terminal of pattern P T2 PTb engages.Similarly, the description initiating terminal PTa of pattern P T2 engages with the description initiating terminal PTa of pattern P T3, retouching of pattern P T3 Painting terminal PTb to engage with description terminal PTb of pattern P T4, the description initiating terminal PTa of pattern P T4 initiates with the description of pattern P T5 End PTa engages.Like this, pattern P T1 being depicted in substrate P～PT5 each other along with substrate P to the movement of length direction Width in substrate P engages, thus depicts device pattern at the whole region A7 that exposes completely.

Figure 12 is to illustrate the some light describing light beam and the explanatory diagram of the relation described between line.Delineation unit UW1～UW5 In, description line LL1 and LL2 of delineation unit UW1 and UW2 is described typically.Description line due to delineation unit UW3～UW5 LL3～LL5 is also same, so omitting the description.By the constant speed rotation of polygonal rotating mirror 97, describe the light beam spot of light beam LB Light SP along description line LL1 and LL2 in substrate P depict from describe starting position OC1, OC2 to describe end position EC1, Length LBL describing line till EC2.

Generally, directly describing in Exposure mode, even if at the pattern depicting the minimum dimension that can expose as device In the case of, achieve stable pattern accurately retouch also by multiple-exposures (re-writing) based on multiple somes light SP more Paint.As shown in figure 12, describing on line LL1 and LL2, if making an a diameter of Xs of the actual effect of light SP, due to description light beam LB being then Pulsed light, so the some light SP generated by 1 pulsed light (the other fluorescent lifetime of picosecond) and by next pulsed light The point light SP generated is scanned in the way of the upper overlap of distance CXs (main scanning direction) in the Y direction of about 1/2 diameter Xs.

Further, since with the main scanning putting light SP along each description line LL1, LL2 simultaneously, substrate P is with certain speed Transport along +X direction, so respectively describing line LL1, LL2 to move (subscan) with a determining deviation in X direction in substrate P.This spacing Be set to herein a light SP diameter Xs about 1/2 distance CXs, but be not limited to this.Accordingly, with respect to subscan Direction (X-direction) also, the adjacent some light SP distance of (or the overlap distance beyond it can also) with the 1/2 of diameter Xs each other CXs is exposed the most overlappingly.And, so that the light beam spot of percussion at the description end position EC1 describing line LL1 Light SP with describe line LL2 descriptions end position EC2 at fire light beam spot light SP along with substrate P to the shifting of length direction Dynamic (i.e. subscan) and on the width (Y-direction) of substrate P in the way of overlap distance CXs joint, set description line LL1 Description starting position OC1 and describe end position EC1 and describe line LL2 description starting position OC2 and describe stop bits Put EC2.

As an example, when being 4 μm making the actual effect diameter Xs of light beam spot light SP, it is possible to exposure well sends as an envoy to a light SP's The area or 3 that 2 row × 2 row (4 some light of the total arranged overlappingly on two directions of main scanning and subscan) are occupied The area that row × 3 row (9 some light of the total arranged overlappingly on two directions of main scanning and subscan) are occupied is minimum Pattern, i.e. minimum dimension as size are the pattern of the line width about 6 μm～8 μm.It addition, make polygonal rotating mirror 97 Reflecting surface 97b is 10, make the rotary speed of the polygonal rotating mirror 97 around rotary shaft 97a when being 10,000 more than rpm, based on rotation The scanning times of the some light SP (describing light beam LB) on the description line (LL1～LL5) that polygonal mirror 97 is formed (is set to rate of scanning Fms) can be 1666.66 more than Hz.This means to retouch along conveyance direction (X-direction) with per second in substrate P Draw the pattern describing line amount of more than 1666.Accordingly, if making the conveying distance per second (conveyance speed) of substrate P slow down, The point light overlap distance CXs each other relevant with the direction of subscan (X-direction) then can be set as the diameter Xs's of a light 1/2 value below, such as 1/3,1/4,1/5, in this case, by along a light describe line Multiple-Scan Expose identical depicting pattern, it is possible to increase the light exposure that the photosensitive layer to substrate P gives.

It addition, by the situation that conveyance speed is about 5mm/s rotating the substrate P that driving is formed of rotating cylinder DR Under, it is possible to make the spacing in the X-direction (conveyance direction of substrate P) of the description line LL1 (LL2～LL5 is too) shown in Figure 12 (distance CXs) is about about 3 μm.

In this case, resolution R of relevant with main scanning direction (Y-direction) pattern plotter and some light The actual effect diameter Xs of SP and rate of scanning Fms is same, according to the on/off of the acousto-optic element (AOM) constituting light deflector 81 Minimum switching time determine.As acousto-optic element (AOM), if using the manipulator of the highest response frequency Fss=50MHz, Then can make on-state and off-state respective time is about 20ns.It is additionally, since based on polygonal rotating mirror 97 1 (describing the scanning of the some light of the length LBL amount of line) during the actual effect scanning of the description light beam LB that reflecting surface 97b is carried out is 1 About the 1/3 of the anglec of rotation tolerance of reflecting surface 97b, so in the case of length LBL making description line is 30mm, depending on light Resolution R determined by the switching time of deflector 81 is R=LBL/ (1/3)/(1/Fms) × (1/Fss) ≈ 3 μm.

According to this relational expression, in order to improve resolution R of pattern plotter, as the acousto-optic element of such as light deflector 81 (AOM), using the highest response frequency Fss is the manipulator of 100MHz, and the switching time making on/off is 10nsec.Thus, Resolution R becomes half that is 1.5 μm.In this case, the conveyance speed of substrate P formed that rotates based on rotating cylinder DR is made to be Half.As the additive method putting forward high resolution R, it is also possible to such as improve the rotary speed of polygonal rotating mirror 97.

The resist generally used in photoetching uses Resist sensitivity Sr to be general 30mj/cm²The resist of left and right.If If the absorbance Δ Ts of optical system is 0.5 (50%), set 1 reflecting surface 97b of polygonal rotating mirror 97 in actual effect sweep time Between be about 1/3, set length LBL describing line as 30mm, set quantity Nuw of delineation unit UW1～UW5 as 5, set based on rotation The conveyance velocities Vp of substrate P of cylinder DR is 5mm/s (300mm/min), then necessary laser power Pw of light supply apparatus CNT can be as Following formula is estimated like that.

Pw=30/60 × 3 × 30 × 5/0.5/ (1/3)=1350mW

Assuming the situation that delineation unit is 7, necessary laser power Pw of light supply apparatus CNT can be estimated with following formula.

Pw=30/60 × 3 × 30 × 7/0.5/ (1/3)=1890mW

Such as, if Resist sensitivity is 80mj/cm²Left and right, then in order to expose with identical speed, need light beam to export It is the light supply apparatus CNT of 3～about 5W.Replace preparing such high-power light source, as long as making rotation based on rotating cylinder DR The conveyance velocities Vp of the substrate P formed is reduced to 30/80 relative to the 5mm/s of initial value, then also be able to as light beam output The light supply apparatus using 1.4～about 1.9W exposes.

It addition, setting the length LBL spot diameter Xs that as 30mm, assumes light beam spot light SP describing line and based on light deflector Resolution (for specifying the minimum lattice of light-beam position, be equivalent to 1 pixel) Xg determined by the light switching of the acousto-optic element (AOM) of 81 Equal and in the case of being 3 μm, make rotary speed is the polygonal rotating mirror 97 during 10,000 rpm the 1 of the polygonal rotating mirror 97 of 10 The time of individual rotation is 3/500 second, make 1 actual effect that reflecting surface 97b is carried out scanning based on polygonal rotating mirror 97 during be 1 The 1/3 of the anglec of rotation tolerance of individual reflecting surface 97b, then actual effect Ts sweep time (second) carried out based on 1 reflecting surface 97b is passed through (3/500) × (1/10) × (1/3) and obtain, for Ts=1/5000 (second).Thus, light supply apparatus CNT is the feelings of pulse laser Pulsed illumination frequency Fz under condition is obtained by Fz=LBL/ (Ts Xs), and Fz=50MHz becomes low-limit frequency.Therefore, in reality Execute in mode, need the light supply apparatus CNT of the pulse laser of more than output frequency 50MHz.Accordingly, the pulse of light supply apparatus CNT Glow frequency Fz be preferably 2 times of the highest response frequency Fss (such as 50MHz) of the acousto-optic element (AOM) of light deflector 81 with Upper (such as 100MHz).

Furthermore, it is possible to control as following: the acousto-optic element (AOM) of light deflector 81 is switched to connection shape The driving signal of state/off-state is in the period that acousto-optic element (AOM) migrates to off-state from on-state or from disconnection State to the luminous mode of the period that on-state migrates not impulsing, make light supply apparatus CNT with pulsed illumination frequency Fz The clock signal synchronization of vibration.

It follows that from the viewpoint of beam shape (intensity distributions of 2 overlapping some light SP), use the chart of Figure 13 For Mingguang City spot light SP spot diameter Xs and pulsed illumination frequency Fz of light supply apparatus CNT between relation.The transverse axis of Figure 13 Represent along describing the Y-direction of line or along the description position putting light SP in the X-direction of the conveyance direction of substrate P or point The size of light SP, the longitudinal axis represents the relative intensity value that the peak strength of a single point light SP is standardized as 1.0.Additionally, here, set The intensity distributions of a single point light SP is J1, it is assumed that illustrate for Gauss distribution.

In Figure 13, intensity distributions J1 of a single point light SP relative to peak strength with 1/e²Intensity there is the diameter of 3 μm. Intensity distributions J2～J6 represent and are shone along main scanning direction or sub scanning direction staggered positions by 2 pulsed quantities of such some light SP The analog result of the intensity distributions (profile) of the integral operation obtained in substrate P when penetrating, makes the offset (interval of position respectively Distance) different.

In the chart of Figure 13, intensity distributions J5 represents that the some light SP of 2 pulsed quantities is with the spacing distance identical with diameter 3 μm Situation about staggering, intensity distributions J4 represents the situation that spacing distance is 2.25 μm of the some light SP of 2 pulsed quantities, intensity distributions J3 table Show the situation that spacing distance is 1.5 μm of the some light SP of 2 pulsed quantities.Can be clear and definite from the change of this intensity distributions J3～J5, In intensity distributions J5, in the case of the some light SP for diameter 3 μm irradiates such condition with 3 μm intervals, integral operation obtains Profile be the warty the highest 2 respective centers of some light, in the position at the midpoint of 2 some light, only obtain 0.3 left Right standardized intensity.In contrast, in the case of the some light SP for diameter 3 μm irradiates such condition with 1.5 μm intervals, The profile that integral operation obtains is not the distribution of profile obvious warty, but clips the position at the midpoint of 2 some light and the most flat Smooth such distribution.

It addition, in fig. 13, intensity distributions J2 represents the situation that spacing distance is 0.75 μm of the some light SP making 2 pulsed quantities Under integral operation profile, intensity distributions J6 represents that the half value of intensity distributions J1 making spacing distance be set as a single point light SP is complete Integral operation profile in the case of width (FWHM) i.e. 1.78 μm.

Like this, with than and the short spacing distance CXs in the identical interval of the diameter Xs of a light SP to irradiate 2 some light such Impulse hunting condition in the case of, the distribution of 2 wartys occurs with being readily apparent from, it is therefore desirable for be set as exposure time will not go out Optimal spacing distance as existing intensity uneven (describing the deterioration of precision).As intensity distributions J3 of Figure 13 or J6, preferably About the half with the diameter Xs of single point light SP, the spacing distance CXs of (such as 40～60%) is overlapping.Such optimal between Spacing can be by adjusting pulsed illumination frequency Fz of light supply apparatus CNT and along describing line on main scanning direction from CXs The scanning speed of some light SP or at least one party of Ts sweep time (rotary speed of polygonal rotating mirror 97) set, it is possible to pass through Sub scanning direction adjusts the X-direction describing the rate of scanning Fms (rotary speed of polygonal rotating mirror 97) of line and substrate P At least one party in translational speed sets.

Such as, in the absolute value (sweep time of some light of the rotary speed that cannot adjust polygonal rotating mirror 97 accurately Ts) in the case of, by adjusting pulsed illumination frequency Fz of light supply apparatus CNT, it is possible to by the some light SP's on main scanning direction Ratio between the diameter Xs (size) of spacing distance CXs and some light is adjusted to optimum range.

Like this, making 2 some light SP along in the case of the overlap of scanning direction, even if in the case of Xs ＞ CXs, light source fills Put CNT to be set as pulsed illumination frequency Fz meeting the relation of Fz ＞ LBL/ (Ts Xs), the i.e. pass of Fz=LBL/ (Ts CXs) System.Such as, in the case of pulsed illumination frequency Fz of light supply apparatus CNT is 100MHz, if polygonal rotating mirror 97 be 10 and Rotate with 10,000 rpm, then can make to pass through 1/e², or half value full duration (FWHM) specify some light actual effect diameter Xs be 3 μm, Make the pulse laser beam (some light) from each delineation unit UW1～UW5 with about the one of diameter Xs on each description line LL1～LL5 The half i.e. interval (CXs) of 1.5 μm is irradiated.Thereby, it is possible to the uniformity of light exposure when improving pattern plotter, even fine Pattern also is able to obtain the loyal exposure picture (resist picture) in accordance with describing data, it is possible to realize high-precision description.

And, if h is arbitrary integer, then need the resolution making to be determined by the light switch speed of acousto-optic element (AOM) Impulse hunting frequency Fz of the light supply apparatus CNT of rate (response frequency Fss) and pulsed laser light source is converted into position or time It is the relation of integral multiple, the i.e. relation of Fz=h Fss afterwards.This is because, the timing switched by the light of acousto-optic element (AOM) Do not turn on/off during sending pulsed light beam from light-pulse generator device CNT.

In the exposure device EX of the 1st embodiment, owing to employing combination of fiber-optic amplifier FB1, FB2 and wavelength convert The light-pulse generator device CNT of the Wavelength changing element of portion CU2, has so being readily derived at ultraviolet band (400～300nm) The pulsed light of the highest frequency of oscillation.

Additionally, based on the pattern that should describe being divided into the pixel unit of such as 3 μ m 3 μm and representing with " 0 ", " 1 " and be No by each pixel unit radiation pulses light beam some light position (bit) row (description data) carry out based on acousto-optic element (AOM) Light switching.In the case of length LBL describing line is 30mm, the pixel count in 1 scanning of some light is 10,000 pixels, sound Optical element (AOM) has the response (response frequency Fss) ranked switching 10,000 amount of pixels during sweep time Ts.Another Aspect, so that the consecutive points light on main scanning direction the most such as sets pulse in the way of about 1/2 overlap of diameter Xs Frequency of oscillation Fz.Accordingly, to make integer h in previous relational expression Fz=h Fss be more than 2, become Fz ＞ Fss in the way of, Relation between response frequency Fss of the light switching setting impulse hunting frequency Fz and acousto-optic element (AOM) is preferably.

It follows that the method for adjustment of the drawing apparatus 11 of explanation exposure device EX.Figure 14 is the exposure representing the 1st embodiment The flow chart of the method for adjustment of electro-optical device.Figure 15 is the reference pattern schematically showing rotating cylinder and the relation described between line Explanatory diagram.Figure 16 is to schematically show the photoelectric transfer from the reflection light receiving the reference pattern from rotating cylinder in the bright visual field The explanatory diagram of the signal of sensor output.Control portion 16 is in order to carry out the position relationship for grasping multiple delineation unit UW1～UW5 Calibration, as shown in Figure 15, make rotating cylinder DR.Rotating cylinder DR can transport have description light beam LB be transmissive to degree The substrate P of light transmission.

As described above, reference pattern RMP is integrally forming with the outer peripheral face of rotating cylinder DR.As shown in figure 15, reference pattern Arbitrary reference pattern RMP1 in RMP moves along with the movement of the outer peripheral face of rotating cylinder DR.Therefore, reference pattern RMP1 After having passed through description line LL1, LL3, LL5, by describing line LL2, LL4.Such as, control portion 16 is at identical reference pattern In the case of RMP1 has passed through description line LL1, LL3, LL5, the description light beam LB of delineation unit UW1, UW3, UW5 is made to scan.So After, control portion 16 makes delineation unit UW2, UW4 in the case of identical reference pattern RMP1 has passed through to describe line LL2, LL4 Describe light beam LB and scan (step S1).Therefore, reference pattern RMP1 becomes the pass, position for grasping delineation unit UW1～UW5 The benchmark of system.

The photoelectric sensor 31Cs (Fig. 4) of above-mentioned calibration detecting system 31 is via f-θ lens combination 85 and comprises scanning The scanning optics detection of device 83 is from the reflection light of reference pattern RMP1.Photoelectric sensor 31Cs is connected with control portion 16, The detection signal (step S2) of photoelectric sensor 31Cs is detected in control portion 16.Such as, delineation unit UW1～UW5 presses every description The scanning direction of line LL1～LL5 edge regulation is by each scanning multiple row of multiple description light beam LB.

Such as, as shown in figure 16, delineation unit UW1～UW5 utilize describe light beam LB from describe starting position OC1 along The 1st is carried out with length LBL (with reference to Figure 12) of description line on the direction (Y-direction) of the rotation centerline AX2 of above-mentioned rotating cylinder DR Column scan SC1.Then, delineation unit UW1～UW5 utilizes and describes light beam LB from describing starting position OC1 along above-mentioned rotation The 2nd column scan is carried out with length LBL (with reference to Figure 12) of description line on the direction (Y-direction) of the rotation centerline AX2 of cylinder DR SC2.Then, delineation unit UW1～UW5 utilizes and describes light beam LB from describing starting position OC1 along above-mentioned rotating cylinder DR's The 3rd column scan SC3 is carried out with length LBL (with reference to Figure 12) of description line on the direction (Y-direction) of rotation centerline AX2.

Owing to rotating cylinder DR rotates around rotation centerline AX2, so the 1st column scan SC1, the 2nd column scan SC2 and the 3rd row The position of scanning SC3 X-direction on reference pattern RMP1 has Δ P1, the difference of Δ P2.In addition it is also possible to be control portion 16 Make the operation of each several part action in the following order: carry out retouching along the 1st column scan SC1 when making rotating cylinder DR static Paint the scanning of light beam LB, then, static after making rotating cylinder DR rotate Δ P1 amount, carry out the description light beam along the 2nd column scan SC2 The scanning of LB, static after again making rotating cylinder DR rotate Δ P2, carry out the scanning of the description light beam LB along the 3rd column scan SC3.

As described above, in reference pattern RMP, it is formed at the 2 bar chart cases intersected with each other of the outer peripheral face of rotating cylinder DR Intersection point portion Cr1, Cr2 of RL1, RL2 are set less than length LBL of above-mentioned description line.Therefore, in projection the 1st column scan SC1, the 2nd column scan SC2 and the 3rd column scan SC3 description light beam LB time, describe light beam LB be at least radiated at intersection point portion Cr1, On Cr2.Line chart case RL1, RL2 are formed as concavo-convex on the surface of rotating cylinder DR.If making the concavo-convex of the surface of rotating cylinder DR in advance Layer residual quantity is set as specific condition, then the reflection describing the reflection light that light beam LB is incident upon line chart case RL1, the upper generation of RL2 is strong Degree produces difference partly.Such as, as shown in figure 16, online pattern RL1, RL2 are the situation of recess on surface of rotating cylinder DR Under, project on line chart case RL1, RL2 if describing light beam LB, then the reflection light reflected by line chart case RL1, RL2 is by photoelectric sensing Device 31Cs receives in the bright visual field.

The marginal position of reference pattern RMP detects based on the output signal from photoelectric sensor 31Cs in control portion 16 pscl.Such as, control portion 16 is based on output signal storage the 1st row obtained from photoelectric sensor 31Cs when the 1st column scan SC1 Central value mpscl of the marginal position pscl of scan position data Dsc1 and reference pattern RMP.

Then, control portion 16 is based on the output signal storage obtained from photoelectric sensor 31Cs when the 2nd column scan SC2 the Central value mpscl of the marginal position pscl of 2 column scan position data D sc2 and reference pattern RMP.Then, control portion 16 based on Output signal storage the 3rd column scan position data D sc3 and the reference map obtained from photoelectric sensor 31Cs during the 3rd column scan SC3 Central value mpscl of the marginal position pscl of case RMP.

Control portion 16 is according to the 1st column scan position data D sc1, the 2nd column scan position data D sc2 and the 3rd column scan position Central value mpscl of the marginal position pscl putting data Dsc3 and multiple reference pattern RMP is obtained intersected with each other by computing 2 bar chart cases RL1, the coordinate position of intersection point portion Cr1, Cr2 of RL2.Its result is, control portion 16 can also calculate each other Relation between 2 bar chart cases RL1, intersection point portion Cr1, Cr2 of RL2 and the description starting position OC1 that intersect.Describe about other Unit UW2～5 similarly, control portion 16 also be able to calculate 2 bar chart cases RL1 intersected with each other, the intersection point portion Cr1 of RL2, Cr2 and the relation described between starting position OC2～OC5 (with reference to Figure 11).Additionally, above-mentioned central value mpscl can also basis Obtain from the peak value of the signal of photoelectric sensor 31Cs output.

It is explained above the feelings that photoelectric sensor 31Cs receives the reflection light of online pattern RL1, RL2 reflection in the bright visual field Condition, but photoelectric sensor 31Cs can also receive the reflection light of online pattern RL1, RL2 reflection in dark ground.Figure 17 is signal Property ground represent the explanatory diagram of photoelectric sensor of reflection light receiving the reference pattern from rotating cylinder in dark ground.Figure 18 is to show Meaning property it is shown in the signal that the photoelectric sensor of the reflection light that dark ground receives the reference pattern from rotating cylinder exports.Such as figure As shown in the of 17, calibration detecting system 31 is configured with between relay lens 94 and photoelectric sensor 31Cs that to have ring-type light saturating Penetrate the light-blocking member 31f in portion.Therefore, the edge during photoelectric sensor 31Cs receives the reflection light of online pattern RL1, RL2 reflection Light at random or diffraction light.Such as, the situation of the recess on the surface that line chart case RL1 as shown in Figure 18, RL2 are rotating cylinder DR Under, describe light beam LB be projected onto line chart case RL1, RL2 upper after, then photoelectric sensor 31Cs in dark ground reception by line chart case The reflection light of RL1, RL2 reflection.

Control portion 16 marginal position pscdl based on the signal detection reference pattern RMP exported from photoelectric sensor 31Cs. Such as, control portion 16, based on the output signal obtained from photoelectric sensor 31Cs when the 1st column scan SC1, stores the 1st column scan Central value mpscdl of the marginal position pscdl of position data D sc1 and reference pattern RMP.Then, control portion 16 is based on the 2nd Output signal storage the 2nd column scan position data D sc2 and the reference pattern obtained from photoelectric sensor 31Cs during column scan SC2 Central value mpscdl of the marginal position pscdl of RMP.Control portion 16 based on when the 3rd column scan SC3 from photoelectric sensor 31Cs Output signal storage the 3rd column scan position data D sc3 obtained and the central value of the marginal position pscdl of reference pattern RMP mpscdl。

Control portion 16 is according to the 1st column scan position data D sc1, the 2nd column scan position data D sc2 and the 3rd column scan position Central value mpscdl of the marginal position pscdl putting data Dsc3 and multiple reference pattern RMP is obtained by computing and is handed over each other 2 bar chart cases RL1 of fork, intersection point portion Cr1, Cr2 of RL2.Its result is, control portion 16 obtains intersected with each other by computing 2 bar chart cases RL1, the coordinate position of intersection point portion Cr1, Cr2 of RL2 and the relation described between the OC1 of starting position.

About other delineation units UW2～5 too, control portion 16 also is able to calculate 2 bar chart cases intersected with each other Relation between intersection point portion Cr1, Cr2 and description starting position OC2～OC5 of RL1, RL2.Like this, at photoelectric sensor 31Cs is in the case of dark ground receives the reflection light reflected by line chart case RL1, RL2, it is possible to increase multiple reference pattern RMP's The precision of marginal position pscdl.

As shown in figure 14, control portion 16 according to the detection signal detected in step S2 obtain with a plurality of description line LL1～ The configuration status of LL5 or adjustment information (calibration information) (step S3) corresponding to configuration error each other.Figure 19 is schematically The explanatory diagram of the reference pattern of rotating cylinder position relationship each other is shown.Figure 20 is schematically show a plurality of description line relative The explanatory diagram of position relationship.As described above, it is configured with odd-numbered the 1st description line LL1, the 3rd description line LL3 and the 5th to retouch Line drawing LL5, as shown in Figure 19, line LL5's described for the 1st description line LL1, the 3rd description line LL3 and the 5th in control portion 16 Each and prestore the reference range PL between the intersection point portion Cr1 detected.Similarly, control portion 16 is also directed to the 2nd and retouches Line drawing LL2 and the 4th describes each article of line LL4 and prestores the reference range PL between the intersection point portion Cr1 detected.This Outward, control portion 16 is also directed to the 2nd description line LL2 and the 3rd and describes each article of line LL3 and prestore the intersection point portion detected Reference range Δ PL between Cr1.And, it addition, control portion 16 is also directed to the 4th description line LL4 and the 5th describes each of line LL5 Bar and prestore the reference range Δ PL between the intersection point portion Cr1 detected.

Such as, as shown in figure 20, about the 1st description starting position OC1 describing line LL1, control portion 16 is based on from former The signal of spot detector 98 (with reference to Fig. 7) has grasped position relationship, it is possible to obtain intersection point portion Cr1 and describe starting position Distance BL1 between OC1.Open it addition, the 3rd description describing line LL3 can also detect by origin detector 98 in control portion 16 The position of beginning position OC3, it is possible to obtain intersection point portion Cr1 and distance BL3 described between the OC3 of starting position.Therefore, control Portion 16 can based on distance BL1, distance BL3 and reference range PL obtain description starting position OC1 with describe starting position OC3 it Between position relationship, and store along describe line LL1, LL3 scanning description light beam LB initial point between initial point spacing Δ OC13.Similarly, the position of the 5th description starting position OC5 describing line LL5 can be detected by origin detector 98 by control portion 16 Put, it is possible to obtain intersection point portion Cr1 and distance BL5 described between the OC5 of starting position.Therefore, control portion 16 can be based on Distance BL3, distance BL5 and reference range PL obtain the pass, position described starting position OC3 and describe between the OC5 of starting position System, and store along the initial point spacing Δ OC35 between the initial point of the description light beam LB describing line LL3, LL5 scanning.

The position of the description starting position OC2 of the 2nd description line LL2 can be detected by origin detector 98 by control portion 16, Therefore, it is possible to obtain intersection point portion Cr1 and distance BL2 described between the OC2 of starting position.It addition, control portion 16 can pass through initial point Detector 98 detects the position of the description starting position OC4 of the 4th description line LL4, opens it is possible to obtain intersection point portion Cr1 with description Distance BL4 between beginning position OC4.Therefore, control portion 16 can obtain retouch based on distance BL2, distance BL4 and reference range PL Paint starting position OC2 and the position relationship described between the OC4 of starting position, it is possible to store along describing line LL2, LL4 scanning Describe the initial point spacing Δ OC24 between the initial point of light beam LB.

It is positioned at via above-mentioned identical reference pattern RMP1 it addition, describe starting position OC1 with describing starting position OC2 The position obtained, so control portion 16 can easily store the initial point along the description light beam LB describing line LL1, LL2 scanning Between initial point spacing Δ OC12.As described above, can to obtain multiple delineation unit UW1～UW5 each for exposure device EX From initial point (description starting point) position relationship each other.

It addition, control portion 16 can describe between the intersection point portion Cr1 that line LL3 detects according to describing line LL2 and the 3rd the 2nd Reference range Δ PL detection describe starting position OC2 and the description bonding error that engages of starting position OC3.And, it addition, energy Enough detection at the 4th reference range Δ PL described between the intersection point portion Cr1 that line LL4 and the 5th description line LL5 detects describes start bit Put OC4 and describe the bonding error that starting position OC5 engages.

The phase from description starting position OC1～OC5 to description end position EC1～EC5 at each description line LL1～LL5 Between detect 2 intersection point portions Cr1, Cr2.Thereby, it is possible to detection from describe starting position OC1～OC5 to describe end position EC1～ The scanning direction of EC5.Its result is, each description line LL1～LL5 can detect relative to the side along centrage AX2 in control portion 16 Angular error to (Y-direction).

Control portion 16 obtains the configuration status with a plurality of description line LL1～LL5 or mutual for said reference pattern RMP1 Adjustment information (calibration information) corresponding to configuration error.Comprise the reference pattern RMP of reference pattern RMP1 with between certain The latticed reference pattern set repeatedly is carved away from (cycle) Pf1, Pf2.Therefore, control portion 16 is to each spacing Pf1, Pf2 repeatedly Reference pattern RMP obtain the adjustment information corresponding with the configuration status of a plurality of description line LL1～LL5 or mutual configuration error (calibration information), the information that computing is relevant with the deviation of the relative position relation of a plurality of description line LL1～LL5.Its result is, control Portion 16 processed can improve the adjustment corresponding with the configuration status of a plurality of description line LL1～LL5 or mutual configuration error further The precision of information (calibration information).

It follows that as shown in figure 14, control portion 16 is adjusted the process (step S4) of description state.Control portion 16 based on The adjustment information (calibration information) corresponding with the configuration status of a plurality of description line LL1～LL5 or mutual configuration error and by compiling The rotary angle position of scale portion (rotating cylinder DR) GPa, GPb that code device read head EN1, EN2 detect, adjust by odd number and The description position that even number delineation unit UW1～UW5 is formed.Encoder head EN1, EN2 can be based on (the rotations of said scale portion Rotating cylinder DR) GPa, GPb detection substrate P conveying capacity.

Figure 21, in the same manner as Figure 12 before, is displacement and the movement of the time per unit schematically showing substrate The explanatory diagram of the relation between the bar number describing line comprised in Ju Li.As shown in figure 21, encoder head EN1, EN2 can examine Survey the displacement Δ X of the also time per unit of memory substrate P.In addition it is also possible to by above-mentioned aligming microscope AM1, AM2 by Step ground detects multiple alignment mark Ks1～Ks3, obtains displacement Δ X and stores.

In the displacement Δ X of the time per unit of substrate P, delineation unit UW1 a plurality of description line LL1 quilt formed Light beam line SPL1, SPL2 and SPL3 of light beam spot light SP describes, and is scanned into the spot diameter of respective light beam spot light SP About the 1/2 of Xs is overlapping in X-direction (and Y-direction).Similarly, describe the light beam spot light SP of the description terminal PTb side of line LL1 and retouch The light beam spot light SP of the description terminal PTb side of line drawing LL2 along with substrate P to the movement of length direction the width in substrate P Direction engages with overlap distance CXs.

Such as, when rotating cylinder DR moves up and down, formed based on odd number and even number delineation unit UW1～UW5 X-direction description position produce dislocation, it is possible to cause the deviation of the multiplying power of such as X-direction.If rotating cylinder DR is transported The conveyance speed (translational speed) of substrate P is slack-off, then the spacing distance CXs of the X-direction of light beam line SPL1, SPL2 and SPL3 becomes Little, it is possible to the description multiplying power being adjusted to X-direction reduces.On the contrary, if the conveyance speed of the substrate P that transported of rotating cylinder DR is (mobile Speed) accelerate, then the spacing distance CXs of the X-direction of light beam line SPL1, SPL2 and SPL3 becomes big, it is possible to be adjusted to retouching of X-direction Paint multiplying power to increase.Illustrating to describe line LL1 above by reference to Figure 21, it is also same for describing line LL2～LL5 about other.Control Portion 16 can be based on the adjustment information (calibration corresponding with the configuration status or mutual configuration error of a plurality of description line LL1～LL5 Information) and the rotary angle position of scale portion (rotating cylinder DR) GPa, GPb that detects of encoder head EN1, EN2, change base The light beam line comprised in displacement Δ X on the length direction of plate P, substrate P time per unit and this displacement Relation between the bar number of SPL1, SPL2 and SPL3.Therefore, control portion 16 can adjust odd number and even number is described single The description position of the X-direction that unit UW1～UW5 is formed.

Figure 22 is the explanatory diagram of schematically explanation and the system clock synchronously pulsed light of luminescence of light-pulse generator.With Under, illustrate referring also to Figure 21 about describing line LL2, it is also same for describing line LL1, LL3～LL5 for other.Light source Device CNT can synchronously fire light beam spot light SP with the pulse signal wp as system clock SQ.By changing system clock Frequency Fz of SQ changes pulse spacing Δ wp (=1/Fz) of pulse signal wp.This temporal pulse spacing Δ wp is describing On line LL2, the spacing distance CXs of main scanning direction of some light SP with each pulse is corresponding.Control portion 16 makes description light beam LB's Light beam spot light SP scans length LBL describing line along the description line LL2 in substrate P.

Control portion 16 has is describing the period that light beam LB is scanned along description line LL2, when partly changing system The cycle of clock SQ, the function of the arbitrary position increase and decrease pulse spacing Δ wp in describing line LL2.Such as, in original system In the case of clock SQ is 100MHz, control portion 16 with describe line length LBL scanning period at a certain time interval (cycle) makes system clock SQ partly become such as 101MHz (or 99MHz).Its result is, describes in length LBL of line The quantity increase and decrease of light beam spot light SP.In other words, control portion 16 is in the period of the length LBL scanning to describe line, with regulation time (1 More than secondary) period distances make system clock SQ duty cycle portion increase and decrease.Thus, the light beam spot light SP that light source CNT produces Interval by the variable quantity change of pulse interval delta wp, and the overlap distance CXs that light beam spot light SP is each other changes.And And, description initiating terminal PTa and the distance described between terminal PTb of Y-direction seem flexible.

One example is described, in the case of length LBL describing line is 30mm, by its 11 decile, by retouching of the most about 3mm The mode at long (period distances) only 1 of painting makes the pulse spacing Δ wp of system clock SQ increase and decrease.The increase and decrease amount of pulse spacing Δ wp It is set to as Figure 13 illustrates: will not cause amassing along with the change of the spacing distance CXs of 2 adjacent some light SP Partite transport calculates profile (intensity distributions) if the scope significantly deteriorated, such as making diameter Xs (3 μ that spacing distance CSx is a light of benchmark M) 50%, then be set as its ± about 15%.If the increase and decrease of pulse spacing Δ wp is+10%, (spacing distance CSx is straight for some light The 60% of footpath Xs), then at discrete 10 described in line of length LBL, the some light of 1 pulsed quantity is respectively with the 10% of diameter Xs Measure along the mode position skew that main scanning direction extends.Its result is, length LBL describing line after description can be relative to 30mm Extend 3 μm.It means that the pattern being depicted in substrate P expands 0.01% (100ppm) in the Y direction.Thus, though base In the case of plate P stretches along Y-direction, it is also possible to correspondingly make depicting pattern telescopically expose along Y-direction.

Being configured to, the position increasing and decreasing pulse spacing Δ wp can be swept by every 1 time that such as describes line LL1～LL5 Retouch be preset as such as by every 100 pulses of system clock SQ, every 200 pulses, be worth arbitrarily.So, it is possible Change the stroke of the main scanning direction (Y-direction) of depicting pattern in bigger scope, with the flexible of substrate P and/or deform right Should dynamically apply multiplying power correction in ground.Therefore, containing system clock in the control portion 16 of the exposure device EX of present embodiment The generation circuit of SQ, this generation circuit has: produce the fixing original clock signal of pulse spacing Δ wp as system clock SQ Clock oscillation portion and the value preset at the clock pulses counting number to system clock SQ after, will produce system clock SQ's Time before next clock pulse is relative to the time migration portion of tight front pulse spacing Δ wp increase and decrease.Additionally, describing line In (length LBL), make the number Y-direction according to the pattern that should describe of the part that the pulse spacing Δ wp of system clock SQ increases and decreases Multiplying power correction ratio (ppm) and determine roughly, but in the case of minimum, can be the some light SP corresponding with length LBL At least 1 place in sweep time Ts.

Figure 23 is an example of the clock generating circuit the most variable for pulse spacing Δ wp making system clock SQ.Figure 23 In, from the basic clock signal CKL of clock oscillation portion 200 output with system clock SQ same frequency.Basic clock signal CKL quilt Put on each pulse to basic clock signal CKL apply regulation time delay Td and generate the deferred telegram of system clock SQ Road 202 and the multiple circuit that the multiplied clock signal CKs of the frequency multiplication such as 20 times of basic clock signal CKL is exported 204。

Delay circuit 202 is till inside has the umber of pulse of multiplied clock signal CKs is count down to setting Δ Ns Enumerator.The time that setting Δ Ns is counted by this enumerator is equivalent to Td time delay.Setting Δ Ns is by presetting electricity Road 206 is arranged.Preinstalled circuit 206 has standard value Ns of the initial value becoming setting Δ Ns in inside₀, from outside (main CPU etc.) when sending preset value Dsb (value corresponding with variation delta Td of Td time delay) here, by new setting Δ Ns overriding For previous setting Δ Ns+Dsb.

This overriding is in response to from the enumerator counting the pulse of the system clock SQ exported from delay circuit 202 What circuit 208 exported completes pulse signal b and carries out.Counter circuit 208 has the structure that following counting is repeated: inciting somebody to action After the umber of pulse of system clock SQ count down to preset value Dsa and outputed pulse signal b, count value is reset to zero and again The secondary umber of pulse to system clock SQ counts.Preset value Dsa is and 1 that length LBL describing line carries out the timesharing such as N Umber of pulse Nck of the some light that length LBL/N is corresponding, but need not necessarily correspond to length LBL/N, can be arbitrary value.Additionally, by with On delay circuit 202, preinstalled circuit 206, counter circuit 208 constitute time migration portion.

Figure 24 is the sequential chart of the time-shift of the signal of each several part in the circuit structure representing Figure 23.At preinstalled circuit Standard value Ns of initial value it is set in 206₀, the setting Δ Ns being applied in delay circuit 202 becomes standard value Ns₀.Meter Before number device circuit 208 count down to set umber of pulse Nck, i.e. produce under the state before pulse signal b, from advance If the setting Δ Ns of circuit 206 is Ns0, delay circuit 202 is as shown in Figure 24 according to each pulse of basic clock signal CKL The umber of pulse of multiplied clock signal CKs is count down to setting Δ Ns by rising edge, completes simultaneously as system clock with this counting SQ and export 1 pulse wp.Therefore, from the corresponding arteries and veins of the rising edge of the pulse of basic clock signal CKL to system clock SQ Rush Td time delay till the rising edge of wp₁Be equivalent to the step-by-step counting to multiplied clock signal CKs to setting Δ Ns's Time.

In Figure 24, if according to the pulse CK with basic clock signal CKL_nAccordingly at Td time delay₁The system of rear generation The pulse wp of clock SQ, counter circuit 208 counts the amount of preset value Dsa (umber of pulse Nck), then counter circuit 208 is defeated Having gone out pulse signal b, in response to this, new setting Δ Ns overriding is " the setting Δ Ns+ before tight by preinstalled circuit 206 Dsb”.Preset value Dsb is the numerical value corresponding with the variable quantity (Δ Td) of the pulse spacing Δ wp shown in 22, is set to bear in Figure 24 Value, but positive value is also same.Therefore, at the pulse CK of basic clock signal CKL_nNext pulse CK_n+1There is it Before, set with ratio by standard value Ns in delay circuit 202₀Td time delay set₁Td time delay of short Δ Td₂Right The setting Δ Ns answered.

Thus, in response to the pulse CK of basic clock signal CKL_n+1And the pulse wp ' of the system clock SQ produced with tight before Pulse wp between pulse spacing Δ wp ' shorter than the pulse spacing Δ wp before it.After creating pulse wp ', at counting Before device circuit 208 count down to the system clock SQ of umber of pulse Nck amount, do not produce pulse signal b, so at delay circuit The 202 setting Δ Ns set keep and Td time delay₂Corresponding value, before next having produced pulse signal b, be System clock SQ relative to basic clock signal CKL without exception with Td time delay₂The State-output being delayed.Therefore, by substantially The pulse spacing Δ wp that frequency Fz of clock signal CKL determines with by the ratio β of the pulse spacing Δ wp ' of time migration correction For:

β=Δ wp '/Δ wp=1 ± (Δ Td/ Δ wp) (wherein, Δ Td ＜ Δ wp), along describing the pattern painted of line drawing The size of width is extended compared with the design load specified by description data when β ＞ 1, (the feelings of Figure 24 when β ＜ 1 Condition) reduced compared with design load.

In the circuit structure of above Figure 23, make the 1 of the system clock SQ generated after just having produced pulse signal b The pulse spacing Δ wp of individual pulse wp changes with time Δ Td, and the counting every time measured by umber of pulse Nck of system clock SQ comes anti- Multiple execution.Additionally, in the case of the circuit structure of Figure 23, as made preinstalled circuit 206 in standard value Ns of storage inside₀For 20, it is zero from the preset value Dsb of external setting-up, the most no matter completes pulse signal b with or without generation, it is stipulated that value Δ Ns all keeps 20 (not carrying out the state of the description multiplying power correction of Y-direction).Further, since the frequency of multiplied clock signal CKs is fundamental clock letter 20 times of the frequency of number CKL, in the case of making setting Δ Ns be 20, if making preset value Dsb be set to+1 (or-1), then Setting Δ Ns be written when every time having produced pulse signal b imaging 20,21,22, (or 20,19, 18) (or minimizing) is so increased.And, 1 pulsed quantity of multiplied clock signal CKs and the pulse spacing Δ wp of standard The 1/20 (5%) of (pulse spacing distance CXs) is suitable, if so make preset value Dsb with ± 1 change, then 2 continuous print point light Overlapping degree changes in units of 5%.

It is as noted previously, as and swashs from pulse in response to the system clock SQ that pulse spacing Δ wp partly increases and decreases like this The pulsed light beam of the light supply apparatus CNT output of light is supplied to each of delineation unit UW1～UW5 publicly, therefore passes through The pattern that each description line LL1～LL5 is described stretches the most at the same rate.Therefore, as at Figure 12 (or Figure 11) Middle explanation is such, in order to maintain the most adjacent joining accuracy described between line, so that it is respective to describe line LL1～LL5 Timing is described in the mode correction describing starting position OC1～OC5 (or describing end position EC1～EC5) displacement in the Y direction.

Make the example of circuit structure the most variable for pulse spacing Δ wp of system clock SQ except such as Figure 23, Tu24Na Sample makes Td time delay₁、Td₂Beyond the most variable mode, it is also possible to be to simulate variable structure.Alternatively, it is also possible to structure Become, counter circuit 208 count down to system clock SQ to be corrected during preset value Dsb (umber of pulse Nck) every time 1 at pulse Interval delta wp ' increase and decrease with such as 1% this little value relative to the pulse spacing Δ wp of standard.In this case, along description As long as 1 scanning of the some light of length LBL of line changes the pulse spacing Δ of standard according to required multiplying power correction Wp is adapted to the quantity at the position of pulse spacing Δ wp '.Such as, when being 100 making the quantity at position to be revised, pass through The size of the Y-direction of the pattern that the photoscanning of 1 point is described increases and decreases with the amount of pulse spacing Δ wp.

And, the handoff response of the on/off of the light deflector (AOM) 81 shown in Fig. 4 is in as description data That sends ranks (place value " 0 " or the arrangement of " 1 ") continuously and carries out, but sending of this place value can also be with pulse spacing Δ wp portion The pulse signal wp (Figure 24) dividing the system clock SQ of ground increase and decrease synchronizes.Specifically, next is occurred at 1 pulse signal wp The period that subpulse signal wp occurs, 1 place value is passed out to the drive circuit of light deflector (AOM) 81, as long as in this place value When being " 0 " for such as " 1 " and previous place value, light deflector (AOM) 81 is switched to on-state from off-state.

It addition, control portion 16 can be based on the configuration status or mutual configuration error pair with a plurality of description line LL1～LL5 Extensometer YN1, YN2, YN3, YN4 of the displacement at the adjustment information (calibration information) answered and the both ends that rotating cylinder DR can be detected Detected information adjusts the description position of the Y-direction carried out by odd number and even number delineation unit UW1～UW5 Put, so that because the error of Y-direction produced by the offset rotation of rotating cylinder DR is offset.It addition, control portion 16 can base In the adjustment information (calibration information) corresponding with the configuration status or mutual configuration error of a plurality of description line LL1～LL5 and energy The enough information detected by extensometer YN1, YN2, YN3, YN4 of displacement at the both ends of detection rotating cylinder DR changes by the strange The length (describing length LBL of line) of the Y-direction that several and even number delineation unit UW1～UW5 is formed, so that because of rotation Produced by the offset rotation of rotating cylinder DR, the error of Y-direction is offset.

It addition, control portion 16 can be based on the configuration status or mutual configuration error pair with a plurality of description line LL1～LL5 The adjustment information (calibration information) answered and the information detected by aligming microscope AM1, AM2 adjust by odd number and idol X-direction that several delineation unit UW1～UW5 are formed or the description position of Y-direction, so that the X-direction of substrate P or Y-direction Error offset.

The exposure device EX of the 1st embodiment includes the travel mechanism 24 as displacement correction mechanism, and it is as described above The a plurality of description line being formed in substrate P from multiple delineation unit UW1～UW5 respective description light beam LB is utilized to comprise In the description face of LL1～LL5 regulation point rotary shaft I centered by, make the 2nd optical table 25 in described description face relative to 1st optical table 23 displacement is moved.Corresponding by the configuration status or mutual configuration error with a plurality of description line LL1～LL5 Adjustment information (calibration information), at a plurality of description line LL1～LL5 all relative at least one direction of X-direction and Y-direction In the case of having error, control portion can the drive division of 16 pairs of travel mechanisms 24 be driven controlling, so that the 2nd optical table 25 move out the displacement of compensating error at least one party's top offset of X-direction and Y-direction.

When making the 2nd optical table 25 move at least one party's displacement of X-direction and Y-direction, the 4th reflection shown in Fig. 6 Mirror 59 in X-direction or Y-direction with its displacement displacement.Especially, the displacement of the Y-direction of the 4th reflecting mirror 59 make from the 3rd anti- Penetrate the description light beam LB of mirror 58 towards +Y direction reflect time, displacement is moved in z-direction.Then, by the 1st optical system 41 Pattern displacement mechanism 44 revises it and moves to the displacement of Z-direction.Thereby, it is possible to 2nd optical system later to the 4th reflecting mirror 59 System the 42 and the 3rd optical system 43 maintains and makes light beam LB by correct light path.

It addition, in the exposure device EX of the 1st embodiment, by the configuration status with a plurality of description line LL1～LL5 Or the adjustment information (calibration information) that mutual configuration error is corresponding, a plurality of description line LL1～LL5 is relative to X-direction and Y-direction At least one party there is error in the case of, control portion 16 pattern displacement mechanism 44 can be driven control, make to be formed at Description line LL1～LL5 in substrate P is in X direction and/or the displacement of Y-direction somewhat displacement compensating error.

And, in the exposure device EX of the 1st embodiment, by the configuration status with a plurality of description line LL1～LL5 Or the adjustment information (calibration information) that mutual configuration error is corresponding, odd-numbered in a plurality of description line LL1～LL5 or the even In the case of several description lines have error relative at least one party of X-direction and Y-direction, control portion 16 is to pattern displacement mechanism 45 are driven controlling, and make even-numbered description line LL2, LL4 of being formed in substrate P in X direction and/or Y-direction somewhat position Move the displacement of compensating error such that it is able to odd-numbered description line LL1, LL3, the LL5 somewhat adjusting and being formed in substrate P Between relative position relation.

It addition, control portion 16 can be based on the configuration status or mutual configuration error pair with a plurality of description line LL1～LL5 The adjustment information (calibration information) answered and being detected by extensometer YN1, YN2, YN3, YN4 or aligming microscope AM1, AM2 Information, adjusts the Y multiplying power of delineation unit UW1～UW5.Such as, the picture of the telecentricity f-θ lens that f-θ lens combination 85 is comprised High proportional to angle of incidence.Therefore, in the case of only adjusting the Y multiplying power of delineation unit UW1, control portion 16 can be based on adjustment Information (calibration information) and the information difference detected by extensometer YN1, YN2, YN3, YN4 or aligming microscope AM1, AM2 Adjust the focal length f of f-θ lens combination 85, thus adjust Y multiplying power.In such guiding mechanism, for example, it is possible to combination For the bent plate of multiplying power correction, the multiplying power correction mechanism of telecentricity f-θ lens, riffle (halving) for adjustment of displacement More than any one in (parallel plate glass that can tilt).It addition, by making the rotation rotated with certain rotary speed The rotary speed of polygonal mirror 97 is the most variable, it is possible to make and between each point light SP (pulsed light) that system clock SQ synchronously describes Spacing from CXs the most variable (making adjacent some light lap each other somewhat stagger), result is also to be able to adjust Y multiplying power.

The exposure device EX of the 1st embodiment comprises the travel mechanism 24 as rotating mechanism, and it comprises as described above By a plurality of description line LL1～LL5 being formed in substrate P from multiple delineation unit UW1～UW5 respective description light beam LB Description face in regulation point rotary shaft I centered by, make the 2nd optical table 25 relative to the 1st optics in described description face Platform 23 rotates.By the adjustment information corresponding with the configuration status or mutual configuration error of a plurality of description line LL1～LL5 (calibration information), in the case of a plurality of description line LL1～LL5 has angular error relative to Y-direction, control portion 16 can be to shifting The drive division of motivation structure 24 is driven controlling, and makes the 2nd optical table 25 rotate the rotation amount offsetting angular error.

It addition, in the case of each delineation unit UW1～UW5 is carried out rotating and revise by needs respectively, make shown in Fig. 8 F-θ lens combination the 85 and the 2nd cylindrical lens 86 rotates with small quantity around optical axis AXf, thus enables that each description line LL1～LL5 Substrate P rotates (inclination) the most minutely.The light beam LB scanned by polygonal rotating mirror 97 about non-scan direction along The bus imaging (optically focused) of cylindrical lens 86, therefore, by the rotation around optical axis AXf of cylindrical lens 86, it is possible to make each description Line LL1～LL5 rotates (inclination).

If the description position that the control device of exposure device EX place reason above-mentioned steps S4 of the 1st embodiment is carried out Adjustment process at least one.It addition, the exposure device EX of the 1st embodiment can also combine by above-mentioned steps The process controlling the adjustment describing position that device is carried out of S4 processes.

By the method for adjustment of substrate board treatment described above, in the exposure device EX of the 1st embodiment, it is not required to It is used for suppressing in adjacent pattern P T1 of the width (Y-direction) of substrate P～the test exposure of PT5 bonding error each other, Or the number of times of test exposure can be reduced.Therefore, the exposure device EX of the 1st embodiment can shorten test exposure, be dried And developing procedure, exposure results take that industry etc. spends time taking calibrating operation really as.And, the exposure device of the 1st embodiment EX can suppress the waste of the substrate P with the number of times respective amount fed back by test exposure.The exposure device EX of the 1st embodiment Can quickly obtain the adjustment information (calibration corresponding with the configuration status of a plurality of description line LL1～LL5 or mutual configuration error Information).The exposure device EX of the 1st embodiment can be based on the configuration status or mutual joining with a plurality of description line LL1～LL5 Put adjustment information corresponding to error (calibration information) to be modified in advance, it is possible to easily in modified chi direction or Y-direction, Each compositions such as displacement, rotation, multiplying power.And, the exposure device EX of the 1st embodiment can improve and overlaps in substrate P The precision of exposure.

Additionally, the exposure device EX of the 1st embodiment illustrates following example: light deflector 81 comprises acousto-optic element, logical Cross polygonal rotating mirror 97 and carry out spot scan to describe light beam LB, but in addition to spot scan, it is also possible to it is to use DMD (Digital Micro mirror Device: DMD) or SLM (Spatial light modulator: space Photomodulator) carry out the mode of depicting pattern.

[the 2nd embodiment]

It follows that the exposure device EX of the 2nd embodiment is illustrated.Additionally, in the 2nd embodiment, in order to keep away Exempt from and the 1st embodiment repeat record, only the part different from the 1st embodiment is illustrated, for the 1st embodiment party Structural element labelling that formula is identical and the identical reference of the 1st embodiment illustrate.

In the exposure device EX of the 2nd embodiment, the photoelectric sensor 31Cs of calibration detecting system 31 does not detect reference map Case (also serving as reference mark) RMP, but detect the reflection light (light at random) of alignment mark Ks1～Ks3 being positioned in substrate P. Each a certain bar described line LL1～LL5 that alignment mark Ks1～Ks3 is arranged in from multiple delineation unit UW1～UW5 passes through Y-direction substrate P on position.When alignment mark Ks1～Ks3 is scanned by the some light SP describing light beam LB, by right The light at random of fiducial mark note Ks1～Ks3 reflection is received in the bright visual field or dark ground by photoelectric sensor 31Cs.

The margin location of alignment mark Ks1～Ks3 detects based on the signal exported from photoelectric sensor 31Cs in control portion 16 Put.And, in a same manner as in the first embodiment, control portion 16 can be according to the detection signal detected by photoelectric sensor 31Cs Obtain the adjustment information (calibration information) corresponding with the configuration status of a plurality of description line LL1～LL5 or mutual configuration error.

It addition, control portion 16 can be based on the configuration status or mutual configuration error pair with a plurality of description line LL1～LL5 The adjustment information (calibration information) answered and the information detected by aligming microscope AM1, AM2, adjust by odd number and idol X-direction that several delineation unit UW1～UW5 are carried out or the description position of Y-direction, so that the X-direction of substrate P or Y-direction Error is offset.When the some light SP describing light beam LB projects on alignment mark Ks1～Ks3, alignment mark Ks1～Ks3 On photosensitive layer photosensitive, in technique later, alignment mark Ks1～Ks3 likely can deform.Preferably, be previously provided with many Row alignment mark Ks1～Ks3, aligming microscope AM1, AM2 read alignment mark Ks1～Ks3 not deformed because of exposure.

Therefore, in the exposure device EX of the 2nd embodiment, it is possible at pattern plotter packet containing making light deflector (AOM) data of 81 on/off so that by describe the some light SP of light beam LB deform because of exposure the most out of question right Scanning near fiducial mark note Ks1～Ks3, is being not desired near alignment mark Ks1～Ks3 deformed because of exposure not point of irradiation light SP. Thereby, it is possible to utilize description light beam LB to expose while obtaining calibration information in nearly real time, and also read alignment mark Ks1～Ks3 (position of substrate P).

The exposure device EX of the 2nd embodiment and the exposure device EX of the 1st embodiment is similarly, it is no longer necessary to be used for pressing down The test exposure of bonding error processed, or the number of times of test exposure can be reduced.And, at the exposure device of the 2nd embodiment In EX, it is possible to substrate P is carried out pattern exposure while measuring the configuration status or mutual of a plurality of description line LL1～LL5 The control information of configuration relation etc., and quickly (the most real-time) obtains corresponding adjustment information (calibration information).Therefore, exist In the exposure device EX of the 2nd embodiment, it is possible to based on the control information quickly measured or adjustment information (calibration information) Edge exposure goes out device pattern the most gradually to carry out keeping the such correction of specified accuracy and/or adjusting, and can easily press down Make describe head modes become problem, comprise X-direction or displacement error in Y-direction, rotation error, magnification error etc. The reduction of the joining accuracy between the delineation unit of each error percentage.Thus, the exposure device EX of the 2nd embodiment can be by base Registration accuracy when exposing that overlaps on plate P is for being maintained at high-precision state.

＜ device making method ＞

It follows that device making method is carried out with reference to Figure 25.Figure 25 is the device making method representing each embodiment Flow chart.

In the device making method shown in Figure 25, first carry out by showing that the self-emission device of the most organic EL etc. is formed Show function and the performance design of panel, and pass through circuit pattern and the wiring pattern (step S201) of the designs such as CAD.Separately Outward, prepare to be wound with the supply of the flexible substrate P (resin film, metal foil film, plastics etc.) of the base material becoming display floater With roller (step S202).Additionally, the substrate P in the roll of this step S202 preparation can be to carry out its surface as required Modified substrate, it is previously formed the substrate of basal layer (being such as imprinted with the minute asperities that mode is formed), is laminated with in advance The functional membrane of photoinduction and/or the substrate of hyaline membrane (insulant).

It follows that in substrate P formed constitute display floater device by electrode, wiring, dielectric film, TFT, (thin film is partly led Body) etc. the backplane level of composition, and formed in the way of being layered on this backplane level and formed by the self-emission device of organic EL etc. Luminescent layer (display pixel portion) (step S203).Can also be containing being formed by following operation etc. in this step S203 Reason: use the exposure device EX of explanation in each embodiment before photoresist oxidant layer to be exposed and makes it develop Conventional photo-mask process；Replace photoresist that the substrate P being coated with photonasty silane coupling material is carried out pattern exposure The hydrophilic and hydrophobic on surface is modified being formed the exposure process of pattern；The catalyst layer of photoinduction is carried out pattern exposure Light, optionally to give plating reproducibility, forms pattern (wiring, electrode etc.) wet of metal film by electroless plating method Formula operation or the printing process by depicting pattern such as the electric conductivity inks containing Nano silver grain.

It follows that by each display floater device cutting substrate manufactured continuously in the substrate P of strip with roller mode P, fit on the surface of each display floater device protective film (interlayer of resistance to environment) and colored filter etc. carry out assembly device (step Rapid S204).Then, carry out display floater device and the most normally act on, whether meet the inspection work of desired performance and characteristic Sequence (step S205).As described above, it is possible to produce display floater (flexible display).Additionally, by flexible strip lamellar The electronic device that substrate is made is not limited to display floater, it is also possible to be for various by be arranged in automobile and/or electric car etc. The flexible cloth gauze as wire harness (cloth wire harness) connected between electronic unit.

The explanation of reference

1 device inspection apparatus

11 drawing apparatuses

12 substrate transport mechanisms

13 device frames

14 position of rotation testing agencies

16 control portions

23 the 1st optical tables

24 travel mechanisms

25 the 2nd optical tables

31 calibration detecting systems

31Cs photoelectric sensor

31f light-blocking member

73 the 4th beam splitters

81 light deflectors

83 scanning devices

96 reflecting mirrors

97 polygonal rotating mirrors

97a rotary shaft

97b reflecting surface

98 origin detectors

AM1, AM2 aligming microscope

DR rotating cylinder

EN1, EN2, EN3, EN4 encoder head

EX exposure device

I rotary shaft

LL1～LL5 describes line

PBS polarising beam splitter

UW1～UW5 delineation unit

Claims (24)

1. a substrate board treatment, it is characterised in that have:

Carrying device, it is by having the supporting parts length direction supporting strip lamellar along substrate of the bearing-surface of bending The part of described substrate, make described substrate move along described length direction；With

Drawing apparatus, it has multiple delineation unit, and the plurality of delineation unit is on the described substrate supported by described bearing-surface Project modulated description light beam, simultaneously with than this substrate on the width of the described substrate intersected with described length direction The little scope of width be scanned, and draw the pattern of regulation along the line drawing of describing obtained by this scanning, retouch described Paint the width configuration along described substrate of the plurality of delineation unit in device, so that by the plurality of delineation unit Each describe pattern that line depicts on the substrate each other along with described substrate to the movement of length direction at described base It is bonded together on the width of plate；

Traverse measuring device, its output is corresponding with the amount of movement of the described substrate transported by described carrying device or shift position Mobile message；And

Control portion, it is previously stored with the calibration information relevant with the mutual position relationship of described description line, and based on this Calibration information and the mobile message exported from described traverse measuring device adjust by the respective institute of the plurality of delineation unit Stating the description position of the pattern describing light beam and formed on the substrate, wherein, described description line is by the plurality of description Unit is respectively formed on described substrate.

2. substrate board treatment as claimed in claim 1, it is characterised in that

Described supporting parts are rotating cylinders as follows: by the centrage extended relative to the width along described substrate Support described substrate with a part for the cylindric outer peripheral face of certain radius bending, and rotate around described centrage, by This transports described substrate along described length direction.

3. substrate board treatment as claimed in claim 2, it is characterised in that

The plurality of delineation unit is configured to, so that depicting the adjacent description of the pattern being engaged with each other on the substrate In unit one is odd number delineation unit and time another is even number delineation unit, respectively by this odd number Delineation unit formed odd-numbered description line and respectively by described even number delineation unit formation even-numbered description Line is positioned at the position with certain angle interval in the circumference of the outer peripheral face of described rotating cylinder.

4. substrate board treatment as claimed in claim 3, it is characterised in that

Described odd-numbered description line is with the most almost parallel with the centrage of the rotation of described rotating cylinder on the substrate Mode is configured to string along the width of described substrate, and described even-numbered description line is to distinguish on the substrate with described The mode that the centrage of the rotation of rotating cylinder is almost parallel is configured to string at the width of described substrate.

5. the substrate board treatment as according to any one of claim 2 to 4, it is characterised in that

Described traverse measuring device includes that scale portion and encoder head, described scale portion are configured to together with described rotating cylinder Rotate and have at the scale being upwardly formed in week relative to the centrage of described rotating cylinder with predetermined radius, described encoder Read head is arranged as opposed to the scale in this scale portion, and exports described positional information.

6. substrate board treatment as claimed in claim 4, it is characterised in that

Described traverse measuring device includes:

Scale portion, this scale portion is configured to together with described rotating cylinder rotate, and has relative in described rotating cylinder Heart line has the scale being upwardly formed in the week of predetermined radius；

1st encoder head, the 1st encoder head is configured to described in the centrage observation with the rotation from described rotating cylinder The direction that the 1st orientation during the described odd-numbered description line of string is identical, is arranged as opposed to the scale in described scale portion；With

2nd encoder head, the 2nd encoder head is configured to described in the centrage observation with the rotation from described rotating cylinder The direction that the 2nd orientation during the described even-numbered description line of string is identical, is arranged as opposed to the scale in described scale portion.

7. substrate board treatment as claimed in claim 6, it is characterised in that

Described 1st orientation and described 2nd orientation are set so that described 1st encoder head and described 2nd encoder head The such angular range of surrounding of the scale being arranged on described scale portion with the state not interfered.

8. the substrate board treatment as according to any one of claim 2 to 7, it is characterised in that

Described substrate board treatment also has substrate pattern detection device, and this substrate pattern detection device includes for along described The length direction of substrate discretely or is continuously formed at the detection probe that the specific pattern on described substrate carries out detecting, described Substrate pattern detection device is arranged in around described rotating cylinder, so that this detection probe is to the detection region on described substrate The upstream of the conveyance direction of described substrate it is set in compared with the described description line formed by each the plurality of delineation unit Side,

Mobile message that described control portion based on described calibration information, exports from described traverse measuring device and described detection Probe is carried out by described description light beam by the positional information of the described specific pattern detected by described detection region, execution The adjustment describing position of pattern.

9. the substrate board treatment as according to any one of claim 1 to 8, it is characterised in that

The adjustment of the described description position that described control portion performs comprises the shifting to the described substrate transported by described carrying device Dynamic speed carries out the process changed.

10. the substrate board treatment as according to any one of claim 1 to 8, it is characterised in that

The adjustment of the described description position that described control portion performs includes the per unit to the described substrate on described length direction Relation between the bar number of the described description line that the displacement of time and this displacement are contained within carries out the process changed.

11. substrate board treatments as according to any one of claim 1 to 10, it is characterised in that

Described drawing apparatus also has light-pulse generator, and this light-pulse generator sends Tong Bu with system clock as described description light beam The pulsed light of wavelength in ultraviolet territory,

The adjustment describing position that described control portion performs is included in the period that described description light beam is scanned along scan line Partly change the process in the cycle of described system clock.

12. substrate board treatments as according to any one of claim 1 to 11, it is characterised in that

The adjustment describing position that described control portion performs is retouched described in including forming the scanning by described description light beam The length of line drawing carries out the process changed.

13. substrate board treatments as according to any one of claim 2 to 12, it is characterised in that

Each direct of travel of the described description light beam projected to described substrate respectively from the plurality of delineation unit can be set to that Centrage towards the rotation of described rotating cylinder.

14. substrate board treatments as according to any one of claim 1 to 13, it is characterised in that

Substrate board treatment includes:

Position relationship with regulation keeps the platform of the plurality of delineation unit；With

Rotating mechanism, this rotating mechanism makes described platform rotate in described description face centered by the regulation point in description face, Described description face is by described many by formed on the substrate from the plurality of delineation unit respective description light beam Bar describes the face that line is included,

The adjustment describing position that described control portion performs includes the process making described platform rotate.

15. substrate board treatments as according to any one of claim 1 to 14, it is characterised in that

The plurality of delineation unit the most also has:

Make the described description light beam towards described substrate to the polygonal rotating mirror of a direction deflection scanning；

By the f-θ lens describing line described on substrate described in beam direction after described polygonal rotating mirror deflection scanning；With And

Being arranged on the cylindrical lens between described f-θ lens and described substrate, this cylindrical lens has and the prolonging of described description line Stretch the bus that direction is almost parallel, and make described description beam condenser on the direction orthogonal with this bus.

16. 1 kinds of device making methods, it is characterised in that use the processing substrate dress according to any one of claim 1 to 15 Put and form described pattern on the substrate.

17. 1 kinds of substrate processing method using sames, depict the pattern of electronic device on the plate shape substrates of strip, it is characterised in that bag Include following process:

Length direction along described plate shape substrates carries described plate shape substrates with fixing speed；

The light beam making the ultraviolet band gone out from light-pulse generator device with the impulse hunting of frequency Fz is poly-on the surface of described plate shape substrates Integrated light, and make described light beam move by photoscanner, thus make described light along handing over described length direction The description line of length LBL extended on the width of fork is scanned；And

During the scanning of described light, based on the description data corresponding with described pattern, the intensity of described light is adjusted System,

Along institute between the some light that the optically focused of the some light formed by the optically focused of 1 pulse of described light beam and next pulse is formed State and describe the interval of line and be set to CXs, described light is set to Xs, by described some photoscanning along the virtual size of described description line When going out sweep time of described length LBL to be set to Ts, it is set to meet following relation: Xs ＞ CXs, and, Fz ＞ LBL/ (Ts·Xs)。

18. substrate processing method using sames as claimed in claim 17, it is characterised in that

Described light-pulse generator device has the clock pulses in response to frequency Fz from clock generating unit and impulse hunting goes out institute State the mechanism of light beam,

Described photoscanner has the mechanism that can change the speed that makes described light beam move to adjust Ts described sweep time,

Adjust at least one party of frequency Fz of Ts described sweep time and described clock pulses, with by described size Xs and described between It is set as prescribed limit every the ratio CXs/Xs of CXs.

19. substrate processing method using sames as claimed in claim 18, it is characterised in that

When the cycle of the described clock pulses determined by described frequency Fz is set to Δ wp,

Described clock generating unit has the week of the described clock pulses by 1 during described sweep time Ts or discrete many places Phase Δ wp is modified to the mechanism of the period Δ wp ' of increase and decrease ± Δ Td, wherein, Δ Td ＜ Δ wp,

Make in the design that specifies with respect to described description data along the overall size of the depicting pattern of described description line Dimension enlargement or reduce.

20. substrate processing method using sames as claimed in claim 19, it is characterised in that

Described clock generating unit becomes setting whenever the number of the described clock pulses occurred during Ts in described sweep time During Nck, the period Δ wp of described clock pulses is changed to revised period Δ wp '.

21. substrate processing method using sames as claimed in claim 20, it is characterised in that

Described setting Nck is to go out described some photoscanning to split length LBL of described description line equably along scanning direction In the time of 1 obtained length, the number of the described clock pulses being output.

22. substrate processing method using sames as according to any one of claim 17 to 21, it is characterised in that

Described light-pulse generator device has: produce the light source of the light of basic wave；Fiber amplifier；Turn with by the light of described basic wave It is changed to the Wavelength changing element of the light beam of described ultraviolet band.

23. 1 kinds of substrate processing method using sames, depict the pattern of electronic device on the plate shape substrates of strip, it is characterised in that bag Include following operation:

Along described plate shape substrates length direction with fixing speed carry described plate shape substrates operation；

The light beam making the ultraviolet band gone out from light-pulse generator device with the impulse hunting of frequency Fz is poly-on the surface of described plate shape substrates Integrated light, and make described light along retouching of extending on the width that the length direction with described plate shape substrates intersects The operation that line drawing is scanned；And

During the scanning of described light, based on the description data obtained by described pattern according to pixels unit, light is utilized to cut Change the operation that the intensity of described light beam is modulated by element,

Response frequency Fss and frequency Fz of the impulse hunting of described light beam during the modulation of described smooth switching device are set to Fz The relation of ＞ Fss.

24. substrate processing method using sames as claimed in claim 23, it is characterised in that

Frequency Fz of the impulse hunting of described light beam, described smooth switching device modulation time response frequency Fss be set to Fz The relation of=h Fss, wherein h is the integer of more than 2.