KR20220038545A - Pattern drawing device and pattern drawing method - Google Patents

Abstract

The pattern writing apparatus comprises: a writing unit including a scanner for scanning a beam modulated in accordance with writing data in a main scanning direction on a substrate; A conveying mechanism having a reference pattern formed on at least a part of a supporting surface and moving the substrate in a sub-scan direction orthogonal to the main scanning direction, and receiving reflected light generated when the beam scans the surface of the conveying mechanism or the surface of the substrate Thus, a calibration detection system that outputs a detection signal whose intensity changes according to a reference pattern or a mark formed on the substrate, a beam scan start position determined based on the origin signal from the origin detector, and detection from the calibration detection system and a control unit that adjusts the drawing position of the pattern by the drawing unit based on the relationship with the scanning position of the beam determined based on the signal.

Description

A pattern drawing apparatus and a pattern drawing method

The present invention relates to a pattern writing apparatus and a pattern writing method for forming a structure of a fine electronic device on a substrate.

DESCRIPTION OF RELATED ART Conventionally, as a substrate processing apparatus (pattern drawing apparatus), the manufacturing apparatus which draws at a predetermined position on a sheet-like medium (substrate) is known (for example, refer patent document 1). The manufacturing apparatus of patent document 1 measures the expansion and contraction of a sheet board|substrate by detecting an alignment mark with respect to a flexible long sheet board|substrate which is easy to expand/contract in the width direction, and according to expansion and contraction The drawing position (processing position) is corrected.

Patent Document 1: Japanese Patent Laid-Open No. 2010-91990

In the manufacturing apparatus of patent document 1, exposure is performed by switching a spatial modulation device (DMD:Digital micromirror device) while conveying a board|substrate in a conveyance direction, and a several writing unit draws a pattern on a board|substrate. In the manufacturing apparatus of Patent Document 1, patterns adjacent to each other in the width direction of the substrate are joint-exposed by a plurality of drawing units, but in order to suppress an error in joint exposure, test exposure and development are performed to generate The measurement result of the position error of the pattern in the joint is fed back. However, the feedback process including operations such as test exposure, development, and measurement, although related to the frequency, temporarily stops the manufacturing line, reduces product productivity, and there is a possibility that the substrate is wasted. .

The aspect of this invention is made|formed in view of the said subject, The objective is to reduce the joint error between patterns even when the pattern is exposed (drawing) successively in the width direction of a board|substrate using a plurality of drawing units. and to provide a pattern writing apparatus and a pattern writing method for writing a large area pattern on a substrate stably with high precision.

According to a first aspect of the present invention, there is provided a pattern writing apparatus for writing a pattern on the basis of writing data on a flexible substrate, comprising: a syringe for scanning a beam modulated according to the writing data in a main scanning direction on the substrate ( a writing unit comprising: a reference pattern formed on at least a part of a surface supporting the substrate; a conveying mechanism for moving in a sub-scan direction perpendicular to the main scanning direction, and receiving reflected light generated when the beam scans the surface of the conveying mechanism or the surface of the substrate to receive the reference pattern or onto the substrate a calibration detection system for outputting a detection signal whose intensity changes according to a mark formed on The pattern writing apparatus provided with the control part which adjusts the writing position of the said pattern by the said writing unit based on the relationship with the scanning position of the said beam which is determined is provided.

According to a second aspect of the present invention, there is provided a pattern drawing method for drawing a pattern on a flexible substrate based on drawing data, wherein the rotation of the rotary polygonal mirror of a drawing unit including a rotary polygonal mirror and an f-θ lens system is performed. By this, a step of scanning a beam intensity-modulated according to the writing data in a main scanning direction on the substrate, and a conveying mechanism in which a reference pattern is formed on at least a part of a surface supporting the substrate, the substrate is moved orthogonally to the main scanning direction a step of moving in the sub-scan direction to A step of obtaining a detection signal according to a change in intensity of the reflected light by a calibration detection system that receives reflected light generated when the surface of or the surface of the substrate is received through the f-θ lens system and the rotating polygonal mirror; , adjusting a writing position of the pattern by the writing unit based on a relationship between a scanning start position of the beam determined based on the origin signal and a scanning position of the beam determined based on the detection signal A pattern writing method comprising a process is provided.

ADVANTAGE OF THE INVENTION According to the aspect of this invention, the joint error at the time of joint exposure of a pattern in the width direction of a board|substrate using a some drawing unit is reduced, and pattern drawing which can perform drawing by a some drawing unit preferably with respect to a board|substrate. An apparatus and a pattern writing method can be provided. Furthermore, it is possible to provide a pattern writing method in which writing precision (uniformity of exposure dose, etc.) and fidelity when one writing unit draws a pattern along a writing line can be provided.

1 : is a figure which shows the whole structure of the exposure apparatus (substrate processing apparatus) of 1st Embodiment.
FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1 .
3 : is a figure which shows the arrangement|positioning relationship of the alignment microscope on a board|substrate, and a drawing line.
4 : is a figure which shows the structure of the rotating drum of the exposure apparatus of FIG. 1, and a drawing apparatus.
FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1 .
FIG. 6 is a perspective view showing the configuration of a branching optical system of the exposure apparatus of FIG. 1 .
FIG. 7 is a diagram showing an arrangement relationship of a plurality of injectors in the exposure apparatus of FIG. 1 .
Fig. 8 is a view for explaining an optical configuration for resolving the deviation of the drawing line due to the tilt of the reflective surface of the syringe.
It is a perspective view which shows the arrangement|positioning relationship of the alignment microscope on a board|substrate, a drawing line, and an encoder head.
FIG. 10 is a perspective view showing a surface structure of a rotary drum of the exposure apparatus of FIG. 1 .
It is explanatory drawing which shows the positional relationship between a drawing line and a drawing pattern on a board|substrate.
12 is an explanatory diagram showing the relationship between a beam spot and a drawing line.
Fig. 13 is a graph simulating a change in intensity distribution due to an overlap amount of beam spots for two pulses obtained on a substrate.
14 is a flowchart regarding a method of adjusting the exposure apparatus according to the first embodiment.
15 : is explanatory drawing which shows typically the relationship between the reference pattern of a rotating drum, and a drawing line.
Fig. 16 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a bright field.
Fig. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field.
18 is an explanatory diagram schematically illustrating a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field.
19 : is explanatory drawing which shows typically the positional relationship between reference patterns of a rotating drum.
20 is an explanatory diagram schematically illustrating a relative positional relationship between a plurality of drawing lines.
21 is an explanatory diagram schematically illustrating the relationship between the movement distance per unit time of the substrate and the number of drawing lines included in the movement distance.
22 is an explanatory diagram schematically illustrating pulsed light synchronized with a system clock of a pulsed light source.
23 is a block diagram for explaining an example of a circuit configuration for generating a system clock of a pulsed light source.
Fig. 24 is a timing chart showing transitions of signals of respective parts in the circuit configuration of Fig. 23;
25 is a flowchart showing each device manufacturing method.

EMBODIMENT OF THE INVENTION The form (embodiment) for implementing this invention is demonstrated in detail, referring drawings. This invention is not limited by the content described in the following embodiment. In addition, the components described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. In addition, the components described below can be appropriately combined. In addition, various omissions, substitutions, or changes of components can be made without departing from the gist of the present invention.

[First embodiment]

1 : is a figure which shows the whole structure of the exposure apparatus (substrate processing apparatus) of 1st Embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs an exposure treatment on a substrate P, and the exposure apparatus EX performs various processes on the substrate P after exposure to manufacture a device. It is assembled in the device manufacturing system 1 . First, the device manufacturing system 1 is demonstrated.

<Device manufacturing system>

The device manufacturing system 1 is a line (flexible display manufacturing line) which manufactures the flexible display as a device. As a flexible display, there exist an organic electroluminescent display etc., for example. This device manufacturing system 1 is a flexible (flexible) elongate board|substrate P wound in roll shape from the supply roll (not shown) which wound the said board|substrate. (P) is sent out, after continuously performing various processes with respect to the sent board|substrate P, the so-called roll-to-roll which winds up the board|substrate P after a process to the roll for collection|recovery (not shown) as a flexible device as a flexible device. (Roll　to　Roll) method. In the device manufacturing system 1 of 1st Embodiment, the board|substrate P which is a film-like sheet|seat is sent out from the roll for supply, The board|substrate P sent out from the roll for supply, process apparatus U1, Through the exposure apparatus EX and the process apparatus U2, the example until it winds up to the roll for collection|recovery is shown. Here, the board|substrate P used as the process target of the device manufacturing system 1 is demonstrated.

As the board|substrate P, the foil (foil) etc. which consist of metals, such as a resin film and stainless steel, or an alloy, etc. are used, for example. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, It contains one or two or more of vinyl acetate resins.

For the substrate P, for example, it is preferable to select a material having a remarkably large coefficient of thermal expansion so that the amount of deformation due to heat received in various processes performed on the substrate P is substantially negligible. The thermal expansion coefficient may be set smaller than the threshold value according to process temperature etc. by mixing an inorganic filler with a resin film, for example. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. Further, the substrate P may be a single layer of very thin glass with a thickness of about 100 μm manufactured by a float method or the like, or may be a laminate in which the resin film, foil, or the like is bonded to this very thin glass. good night.

The board|substrate P comprised in this way becomes a roll for supply by being wound in roll shape, and this roll for supply is attached to the device manufacturing system 1 . The device manufacturing system 1 with which the roll for supply was attached repeatedly performs various processes for manufacturing a device with respect to the board|substrate P sent out in the elongate direction from the roll for supply. For this reason, on the board|substrate P after a process, the pattern for several electronic devices (display panel, a printed circuit board, etc.) is formed in the state connected at regular intervals in the elongate direction. That is, the board|substrate P sent out from the roll for supply becomes a board|substrate for multi-sided printing. In addition, the substrate P is activated by modifying its surface by a predetermined pretreatment in advance, or a fine barrier rib structure (imprint method) for precise patterning on the surface. (a concave-convex structure formed by the imprint method) may be formed.

The board|substrate P after a process is collect|recovered as a roll for collection|recovery by winding up in roll shape. The recovery roll is mounted on a dicing device (not shown). The dicing apparatus with the roll for collection|recovery sets it as a some device by dividing|segmenting the board|substrate P after a process for every device (dicing). As for the dimension of the board|substrate P, the dimension of the width direction (the direction becoming short) is about 10 cm - 2 m, and the dimension of the longitudinal direction (the direction becoming long) is 10 m or more, for example. In addition, the dimension of the board|substrate P is not limited to said dimension.

Next, with reference to FIG. 1, the device manufacturing system 1 is demonstrated. The device manufacturing system 1 includes a process apparatus U1 , an exposure apparatus EX , and a process apparatus U2 . Moreover, in FIG. 1, it is a Cartesian coordinate system in which an X direction, a Y direction, and a Z direction orthogonally cross. The X direction is a direction from the process apparatus U1 to the process apparatus U2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in a horizontal plane, and has become the width direction of the board|substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction, and the XY plane is made parallel to the installation surface E of the manufacturing line in which the exposure apparatus EX is installed.

The process apparatus U1 performs the process of a pre-process (pre-process) with respect to the board|substrate P exposed by the exposure apparatus EX. The process apparatus U1 sends the board|substrate P which performed the preprocessing toward the exposure apparatus EX. At this time, the board|substrate P sent to the exposure apparatus EX becomes the board|substrate (photosensitive board|substrate) P in which the photosensitive functional layer (photosensitive layer) was formed in the surface.

Here, the photosensitive functional layer is apply|coated on the board|substrate P as a solution, and becomes a layer (film|membrane) by drying. Although a photoresist is typical of a photosensitive functional layer, it is a material unnecessary for image development, and a photosensitive silane coupling material (SAM) in which the lyophilic property of the portion exposed to ultraviolet rays is modified. ), or a photosensitive reducing material in which the plating reducing group is exposed on the portion that is irradiated with ultraviolet rays. When a photosensitive silane coupling material is used as the photosensitive functional layer, since the pattern portion exposed by ultraviolet rays on the substrate P is modified from lyophilic to lyophilic, conductive ink (silver) on the lyophilic portion. Ink containing conductive nanoparticles such as copper or copper) is selectively applied to form a patterned layer. When a photosensitive reducing material is used as the photosensitive functional layer, since the plating reducing group is exposed on the pattern portion exposed by ultraviolet light on the substrate, the substrate P is immediately placed in a plating solution containing palladium ions or the like after exposure. By time immersion, a pattern layer by palladium is formed (precipitated).

The exposure apparatus EX draws patterns, such as various circuits for display panels, or various wirings, on the board|substrate P supplied from the process apparatus U1, for example. Although the detail is mentioned later, this exposure apparatus EX scans each of the writing beam LB projected toward the board|substrate P from each of some writing unit UW1-UW5 in a predetermined scanning direction. A predetermined pattern is exposed to the board|substrate P with some drawing line LL1-LL5 obtained by doing it.

The process apparatus U2 receives the board|substrate P exposed by the exposure apparatus EX, and performs the process (post-process) of a post process with respect to the board|substrate P. Process apparatus U2, when the photosensitive functional layer of the board|substrate P is a photoresist, the postbake process below the glass transition temperature of the board|substrate P, a developing process, a washing|cleaning process, drying processing, etc. Moreover, when the photosensitive functional layer of the board|substrate P is a photosensitive plating reducing material, the process apparatus U2 performs an electroless plating process, a washing process, a drying process, etc. In addition, when the photosensitive functional layer of the substrate P is a photosensitive silane coupling material, the process apparatus U2 selectively applies the liquid ink to the lyophilic portion on the substrate P, and a drying treatment do etc. By passing through such a process apparatus U2, the pattern layer of a device is formed on the board|substrate P.

<Exposure apparatus (substrate processing apparatus)>

Next, the exposure apparatus EX will be described with reference to FIGS. 1 to 10 . FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1 . It is a figure which shows the arrangement|positioning relationship of the alignment microscope on a board|substrate, and a drawing line. 4 : is a figure which shows the structure of the rotating drum of the exposure apparatus of FIG. 1, and a drawing apparatus (drawing unit). FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1 . FIG. 6 is a perspective view showing the configuration of a branching optical system of the exposure apparatus of FIG. 1 . FIG. 7 is a diagram showing an arrangement relationship of injectors in a plurality of drawing units of the exposure apparatus of FIG. 1 . Fig. 8 is a view for explaining an optical configuration for resolving the deviation of the drawing line due to the tilt of the reflective surface of the syringe. It is a perspective view which shows the arrangement|positioning relationship of the alignment microscope on a board|substrate, a drawing line, and an encoder head. FIG. 10 is a perspective view showing an example of the surface structure of the rotary drum of the exposure apparatus of FIG. 1 .

As shown in FIG. 1, the exposure apparatus EX is the exposure apparatus which does not use a mask, a so-called maskless type drawing exposure apparatus, and in this embodiment, the board|substrate P is conveyed in the conveyance direction (long direction). ) while continuously conveying at a constant speed, by high-speed scanning the spot light of the writing beam LB in a predetermined scanning direction (the width direction of the substrate P), writing is performed on the surface of the substrate P, and the substrate P ) is a direct drawing exposure apparatus of a raster scan method that forms a predetermined pattern on the image.

As shown in FIG. 1, exposure apparatus EX is equipped with the drawing apparatus 11, the board|substrate conveyance mechanism 12, alignment microscope AM1, AM2, and the control part 16. As shown in FIG. The drawing apparatus 11 is equipped with several drawing unit UW1-UW5. And the drawing apparatus 11 draws some drawing in a part of the board|substrate P conveyed in the state closely_contact|adhered to the upper part of the outer peripheral surface of cylindrical rotary drum DR which exists also in a part of the board|substrate conveyance mechanism 12. A predetermined pattern is drawn by the units UW1 to UW5. The substrate conveyance mechanism 12 conveys the substrate P conveyed from the process apparatus U1 of the pre-process to the process apparatus U2 of the post-process at a predetermined speed. Alignment microscope AM1, AM2 detects the alignment mark etc. which were previously formed in the board|substrate P in order to position the pattern which should be drawn on the board|substrate P, and the board|substrate P relatively (alignment). The control unit 16 including a computer, a microcomputer, CPU, FPGA, etc. controls each unit of the exposure apparatus EX and causes each unit to execute a process. The control part 16 may be a part or all of the upper level control apparatus which controls the device manufacturing system 1 . Moreover, the control part 16 is controlled by a higher level control device. The upper level control device may be, for example, another device such as a host computer that manages the manufacturing line.

Moreover, as shown in FIG. 2, the exposure apparatus EX is equipped with the apparatus frame 13 which supports the drawing apparatus 11 and at least one part (rotating drum DR, etc.) of the board|substrate conveyance mechanism 12, , The apparatus frame 13 includes a rotational position detection mechanism (such as an encoder head illustrated in FIGS. 4 and 9) for detecting the rotational angular position, rotational speed, and displacement in the rotational axis direction of the rotational drum DR, and FIG. Alignment microscope AM1, AM2 etc. shown to (or FIG. 3, FIG. 9) are mounted|worn. Furthermore, in the exposure apparatus EX, the light source device CNT which emits the ultraviolet laser beam (pulse light) as the writing beam LB is provided, as shown in FIG.4, FIG.5. . This exposure apparatus EX uses the writing beam LB emitted from the light source device CNT to be substantially equal to each of the plurality of writing units UW1 to UW5 constituting the writing apparatus 11 . It is distributed by (illuminance (照度)).

As shown in FIG. 1, exposure apparatus EX is stored in temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface (floor surface) E of the manufacturing plant via passive or active vibration-proof units SU1 and SU2 as a medium. The vibration isolating units SU1 and SU2 are provided on the installation surface E, and reduce the vibration from the installation surface E. The temperature control chamber EVC is suppressing the shape change by the temperature of the board|substrate P conveyed inside by maintaining the inside at a predetermined temperature.

The board|substrate conveyance mechanism 12 of the exposure apparatus EX is edge position controller EPC, drive roller DR4, tension adjustment roller RT1, rotary drum sequentially from the upstream of the conveyance direction of the board|substrate P. It has (cylindrical drum) DR, tension adjustment roller RT2, drive roller DR6, and drive roller DR7.

Edge position controller EPC adjusts the position in the width direction (Y direction) of the board|substrate P conveyed from the process apparatus U1. The edge position controller EPC is configured such that the position of the end (edge) in the width direction of the substrate P sent from the process device U1 falls within the range of ± tens of μm to about tens of μm with respect to the target position. P) is finely moved in the width direction, and the position in the width direction of the board|substrate P is corrected.

The drive roller DR4 of a nip system rotates while holding the front and back both surfaces of the board|substrate P conveyed from the edge position controller EPC, and the downstream of the conveyance direction of the board|substrate P By sending out to the side, the board|substrate P is conveyed toward rotary drum DR. The rotary drum DR adheres and supports the portion to be pattern exposed on the substrate P to the cylindrical outer circumferential surface of a certain radius from the rotation center line (rotation axis) AX2 extending in the Y direction, while supporting the rotation center line AX2. By rotating to the circumference of the board|substrate P, the board|substrate P is conveyed in a long direction.

In order to rotate the rotary drum DR around the rotational center line AX2, a shaft portion Sf2 coaxial with the rotational centerline AX2 is provided on both sides of the rotary drum DR, and the shaft portion ( Sf2) is axially supported by the apparatus frame 13 via a bearing as shown in FIG. Rotational torque from a drive source (a motor, a reduction gear mechanism, etc.) not shown is provided to this shaft part Sf2. In addition, a plane parallel to the YZ plane including the rotational center line AX2 is defined as the central plane p3 .

Two sets of tension adjustment rollers RT1 and RT2 are providing predetermined tension to the board|substrate P wound and supported by rotary drum DR. Two sets of nip-type drive rollers DR6 and DR7 are arranged at predetermined intervals in the conveyance direction of the substrate P, and a predetermined slack (surplus) DL is provided to the substrate P after exposure. . The drive roller DR6 rotates while holding the upstream side of the board|substrate P conveyed between them, and the drive roller DR7 rotates by pinching|interposing the downstream side of the board|substrate P conveyed, The board|substrate P is conveyed toward the process apparatus U2. At this time, since the sagging DL is provided, the board|substrate P can absorb the fluctuation|variation of the conveyance speed of the board|substrate P which generate|occur|produces on the downstream side of a conveyance direction rather than drive roller DR6, and a conveyance speed It is possible to insulate the influence of the exposure treatment on the substrate P due to the fluctuation of .

Therefore, the board|substrate conveyance mechanism 12 adjusts the position in the width direction of the board|substrate P conveyed from the process apparatus U1 with the edge position roller EPC. The board|substrate conveyance mechanism 12 conveys the board|substrate P whose position of the width direction was adjusted to tension adjustment roller RT1 with drive roller DR4, The board|substrate P which passed tension adjustment roller RT1. ) is conveyed to the rotary drum DR. The board|substrate conveyance mechanism 12 conveys the board|substrate P supported by rotary drum DR toward tension adjustment roller RT2 by rotating rotary drum DR. The board|substrate conveyance mechanism 12 conveys the board|substrate P conveyed by tension adjustment roller RT2 by drive roller DR6, The board|substrate P conveyed by drive roller DR6 is drive roller DR7 ) to return And the board|substrate conveyance mechanism 12 conveys the board|substrate P toward the process apparatus U2, providing sagging DL to the board|substrate P with drive roller DR6 and drive roller DR7. do.

With reference again to FIG. 2, the apparatus frame 13 of the exposure apparatus EX is demonstrated. In FIG. 2, it is a Cartesian coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal, and it is the same Cartesian coordinate system as FIG.

As shown in FIG. 2 , the device frame 13 includes, in order from the lower side in the Z direction, a main body frame 21 , a three-point sheet 22 serving as a support mechanism, and a first optical platen ( 23 ), a moving mechanism 24 , and a second optical surface plate 25 . The main body frame 21 is a part provided on the installation surface E via vibration-proof units SU1 and SU2 as a medium. The main body frame 21 is rotatably supporting (supporting) the rotating drum DR and tension-adjusting roller RT1 (not shown), RT2. The 1st optical surface plate 23 is provided in the upper side of the vertical direction of the rotating drum DR, and is provided in the main body frame 21 via the three-point sheet|seat 22 as a medium. The three-point sheet 22 supports the first optical surface plate 23 at three fulcrum points, and the Z-direction position (height position) at each fulcrum is adjustable. For this reason, the three-point sheet 22 can adjust the inclination of the other side of the 1st optical surface plate 23 with respect to a horizontal plane to a predetermined inclination. Moreover, at the time of assembling the apparatus frame 13, between the main body frame 21 and the three-point seat|sheet 22, the position adjustment is possible in the X direction and the Y direction in the XY plane. On the other hand, after assembly of the device frame 13, the space between the body frame 21 and the three-point sheet 22 is in a fixed state (rigid state) in the XY plane.

The 2nd optical surface plate 25 is provided in the upper side of the vertical direction of the 1st optical surface plate 23, and is provided in the 1st optical surface plate 23 via the moving mechanism 24 as a medium. As for the 2nd optical surface plate 25, the half is parallel to the other half of the 1st optical surface plate 23. As shown in FIG. A plurality of drawing units UW1 to UW5 of the drawing apparatus 11 are provided in the second optical surface plate 25 . The moving mechanism 24 is a center of a predetermined rotational axis I extending in the vertical direction in a state in which the respective opposite sides of the first optical surface plate 23 and the second optical surface plate 25 are kept in parallel. As a result, the second optical platen 25 can be precisely rotated with respect to the first optical platen 23 . The rotation range is, for example, about ± several hundred milliradians with respect to the reference position, and has a structure in which angles can be set with a resolution of 1 to several milliradians. Moreover, the movement mechanism 24 is a 2nd with respect to the 1st optical surface plate 23 in the state which maintained each half of the 1st optical surface plate 23 and the 2nd optical surface plate 25 in parallel. It also includes a mechanism for precisely and minutely shifting the optical platen 25 in at least one of the X and Y directions, and moves the rotation axis I from the reference position in the X direction or the Y direction with a resolution of the order of μm. can be displaced. While extending in the vertical direction within the central plane p3 at a reference position, this rotating shaft I is the surface (drawing surface curved along the circumferential surface) of the board|substrate P wound around the rotating drum DR. It is passing through a predetermined point (the midpoint in the width direction of the substrate P) within the (see Fig. 3). By rotating or shift-moving the 2nd optical surface plate 25 with respect to the 1st optical surface plate 23 by such a movement mechanism 24, the board|substrate P wound around the rotating drum DR or the rotating drum DR. The positions of the plurality of drawing units UW1 to UW5 with respect to ) can be integrally adjusted.

Next, with reference to FIG. 5, the light source device CNT is demonstrated. The light source device CNT is provided on the main body frame 21 of the device frame 13 . The light source device CNT emits the laser beam as the writing beam LB projected on the board|substrate P. The light source device CNT has a light source that emits light of a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P and light in the ultraviolet range having a strong photoactive action. As a light source, it is YAG 3rd harmonic laser beam (wavelength 355 nm), and can use the laser light source which continuous oscillation or pulse oscillation about several KHz - several hundred MHz, for example.

The light source device CNT is equipped with the laser-beam generation|occurrence|production part CU1 and the wavelength conversion part CU2. Laser-beam generation part CU1 is equipped with laser light source OSC and fiber amplifier FB1, FB2. Laser-beam generating part CU1 radiates|emits the fundamental-wave laser beam Ls. The fiber amplifiers FB1 and FB2 amplify the fundamental wave laser light Ls with an optical fiber. The laser light generation unit CU1 makes the amplified fundamental wave laser light Lr enter the wavelength conversion unit CU2 . The wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a dichroic mirror, a polarizing beam splitter, a prism, and the like, and by using these light (wavelength) selection components, a third harmonic laser having a wavelength of 355 nm ( The writing beam LB) is taken out. In that case, by making the laser light source OSC which generate|occur|produces a seed light pulse-light in synchronization with a system clock etc., the light source device CNT emits the writing beam LB with a wavelength of 355 nm several KHz - It is generated as pulsed light of about several hundred MHz. In addition, when this type of fiber amplifier is used, the emission time of one pulse of the finally output laser light (Lr or LB) is in the order of picoseconds according to the pulse driving mode of the laser light source (OSC). can do.

As the light source, for example, a lamp light source such as a mercury lamp having a bright line (g-line, h-line, i-line, etc.) in the ultraviolet region, a laser diode having an oscillation peak in the ultraviolet region with a wavelength of 450 nm or less, a light emitting diode ( LED), or gas laser light sources such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), and XeCl excimer laser (wavelength 308 nm) oscillating deep ultraviolet light (DUV light) can be used. there is.

Here, the writing beam LB emitted from the light source device CNT is projected onto the substrate P via a polarization beam splitter PBS provided in each writing unit UW1 to UW5 as a medium, as will be described later. . In general, the polarization beam splitter PBS reflects a light beam that becomes linearly polarized light of S-polarized light, and transmits a light beam that becomes linearly polarized light of P-polarized light. For this reason, in light source device CNT, it is preferable that writing beam LB which injects into polarization beam splitter PBS emits the laser beam used as the light beam of linearly polarized light (S polarization). Moreover, since a laser beam has high energy density, the illuminance of the light beam projected on the board|substrate P can be ensured suitably.

Next, the drawing apparatus 11 of the exposure apparatus EX is demonstrated also with reference to FIG. The writing device 11 is a so-called multi-beam type writing device 11 using a plurality of writing units UW1 to UW5 . This writing apparatus 11 branches into a plurality of writing beams LB emitted from the light source device CNT, and divides a plurality of the branched writing beams LB on the substrate P as in FIG. 3 (the second). In the first embodiment, for example, along five) drawing lines LL1 to LL5, each small spot light (several micrometer diameter) is condensed and scanned. And the drawing apparatus 11 has mutually connected the patterns drawn on the board|substrate P by each of some drawing line LL1-LL5 in the width direction of the board|substrate P. As shown in FIG. First, with reference to FIG. 3, about the some writing line LL1-LL5 (scan locus of spot light) formed on the board|substrate P by scanning the some writing beam LB with the writing apparatus 11. Explain.

As shown in FIG. 3, some drawing line LL1-LL5 is arrange|positioned by 2 rows in the circumferential direction (circumference direction) of rotary drum DR across the center plane p3. On the board|substrate P of the upstream of the rotation direction, odd-numbered 1st writing line LL1, 3rd writing line LL3, and 5th writing line LL5 are arrange|positioned parallel to a Y-axis. On the substrate P on the downstream side of the rotational direction, the even-numbered second writing line LL2 and the fourth writing line LL4 are arranged parallel to the Y-axis.

Each drawing line LL1-LL5 is formed substantially parallel along the width direction (Y direction) of the board|substrate P, ie, rotation center line AX2 of rotary drum DR, and board|substrate P in the width direction ) is shorter than the length of More precisely, when each drawing line LL1-LL5 conveys the board|substrate P with the reference speed by the board|substrate conveyance mechanism 12, the joint error of the pattern obtained by some drawing line LL1-LL5. You may incline only for predetermined angle with respect to the direction (axial direction or the width direction) in which rotation center line AX2 of rotary drum DR extends so that it may become the minimum.

Odd-numbered 1st writing line LL1, 3rd writing line LL3, and 5th writing line LL5 are arrange|positioned at the center line AX2 direction of rotary drum DR at predetermined intervals. Moreover, the even-numbered 2nd writing line LL2 and 4th writing line LL4 are arrange|positioned at the center line AX2 direction of the rotary drum DR at predetermined intervals. At this time, the second writing line LL2 is disposed between the first writing line LL1 and the third writing line LL3 in the center line AX2 direction. Similarly, the third writing line LL3 is disposed between the second writing line LL2 and the fourth writing line LL4 in the center line AX2 direction. The fourth writing line LL4 is disposed between the third writing line LL3 and the fifth writing line LL5 in the center line AX2 direction. And the 1st - 5th drawing lines LL1-LL5 are arrange|positioned so that the full width of the width direction (axial direction) of the exposure area|region A7 drawn on the board|substrate P may be covered.

The scanning direction of the spot light of the writing beam LB scanned along the odd-numbered 1st writing line LL1, the 3rd writing line LL3, and the 5th writing line LL5 is a one-dimensional direction, are in the same direction. Moreover, the scanning direction of the spot light of the writing beam LB scanned along the even-numbered 2nd writing line LL2 and 4th writing line LL4 is a one-dimensional direction, and it is the same direction. At this time, the scanning direction (+Y direction) of the spot light of the writing beam LB scanned along odd-numbered writing lines LL1, LL3, LL5, and writing scanned along even-numbered writing lines LL2, LL4 The scanning direction (-Y direction) of the spot light of the beam LB is opposite as indicated by the arrow in FIG. In this case, each of the drawing units UW1 to UW5 has the same configuration, the odd-numbered drawing unit and the even-numbered drawing unit are rotated 180° in the XY plane to face each other, and each drawing unit UW1 to UW5 This is because the rotating polygon mirror as a beam injector provided in ) is rotated in the same direction. For this reason, as seen from the conveyance direction of the board|substrate P, the writing start position of odd-numbered writing line LL3, LL5, and the writing start position of even-numbered writing line LL2, LL4 are spots with respect to the Y direction. They are adjacent (or coincident) with an error equal to or less than the diameter of the light, and similarly, the writing end positions of the odd-numbered writing lines LL1 and LL3 and the writing ending positions of the even-numbered writing lines LL2, LL4 are in the Y direction. , adjacent (or coincident) with an error equal to or less than the diameter dimension of the spot light.

As explained above, each of odd-numbered drawing line LL1, LL3, LL5 may become substantially parallel to the rotation center line AX2 of the rotary drum DR on the board|substrate P, The width direction of the board|substrate P are arranged in a row. And each of even-numbered drawing line LL2, LL4 is arrange|positioned in a line in the width direction of the board|substrate P so that it may become substantially parallel to the rotation center line AX2 of the rotating drum DR on the board|substrate P. .

Next, with reference to FIGS. 4-7, the drawing apparatus 11 is demonstrated. The writing device 11 branches the writing beam LB from the above-described plurality of writing units UW1 to UW5 and the light source device CNT, and a branch optical system SL for guiding them to the writing units UW1 to UW5. and a calibration detection system 31 for performing calibration.

The branch optical system SL branches a plurality of writing beams LB emitted from the light source device CNT, and guides the plurality of branched writing beams LB to the plurality of writing units UW1 to UW5, respectively. there is. The branched optical system SL is a first optical system 41 that splits the writing beam LB emitted from the light source device CNT into two, and one writing beam LB branched by the first optical system 41 . It has this incident 2nd optical system 42 and the 3rd optical system 43 which the other writing beam LB branched by the 1st optical system 41 injects. In addition, in the first optical system 41 of the branch optical system SL, a beam shifter mechanism 44 for two-dimensionally shifting the writing beam LB laterally in a plane orthogonal to the traveling axis of the writing beam LB is provided. It is provided and the 3rd optical system 43 of the branch optical system SL is provided with the beam shifter mechanism 45 which shifts the writing beam LB laterally two-dimensionally. A part of the branch optical system SL on the side of the light source device CNT is provided in the body frame 21 , while the other part on the side of the drawing units UW1 to UW5 is provided on the second optical surface plate 25 . .

The first optical system 41 includes a 1/2 wave plate 51 , a polarization mirror (polarization beam splitter) 52 , a beam diffuser 53 , a first reflection mirror 54 , and a first optical system 41 . 1 relay lens 55 , a second relay lens 56 , a beam shifter mechanism 44 , a second reflection mirror 57 , a third reflection mirror 58 , and a fourth reflection mirror 59 . and a first beam splitter (60). In addition, in FIG. 4, FIG. 5, since it is difficult to understand the arrangement|positioning relationship of each member, it demonstrates also with reference to the perspective view of FIG.

As shown in FIG. 6 , the writing beam LB emitted from the light source device CNT in the +X direction is incident on the 1/2 wave plate 51 . The 1/2 wave plate 51 is rotatable within the incident plane of the writing beam LB. The polarization direction of the writing beam LB incident on the 1/2 wave plate 51 becomes a predetermined polarization direction according to the rotation position (angle) of the 1/2 wave plate 51 . The writing beam LB passing through the 1/2 wave plate 51 is incident on the polarization mirror 52 . The polarization mirror 52 transmits the light component in the predetermined polarization direction included in the writing beam LB and reflects the light component in the polarization direction other than that in the +Y direction. For this reason, the intensity of the writing beam LB reflected by the polarizing mirror 52 is determined by the cooperation of the half-wave plate 51 and the polarizing mirror 52 to the rotational position of the half-wave plate 51 . can be adjusted according to

A part (unnecessary light component) of the writing beam LB transmitted through the polarization mirror 52 is irradiated to the beam diffuser (light trap) 53 . The beam diffuser 53 absorbs the light component of a part of the writing beam LB which has entered, and suppresses that the light component leaks to the outside. In addition, during the adjustment operation of various optical systems through which the writing beam LB passes, the power is too strong and dangerous in a state where the laser power is maximum, so that the beam diffuser 53 absorbs many light components of the writing beam LB. It is also used in order to change the rotation position (angle) of the 1/2 wave plate 51 so that the power of the writing beam LB which goes to the writing units UW1-UW5 is largely attenuated|damped.

The writing beam LB reflected in the +Y direction by the polarization mirror 52 is reflected in the +X direction by the first reflection mirror 54 and passes through the first relay lens 55 and the second relay lens 56 . It enters the beam shifter mechanism 44 and reaches the second reflection mirror 57 .

The first relay lens 55 converges the writing beam LB (almost parallel beam) from the light source device CNT to form a beam waist, and the second relay lens 56 diverges after convergence. The writing beam LB to be used is again a parallel beam of light.

As shown in FIG. 6 , the beam shifter mechanism 44 includes two parallel flat plates (quartz) arranged along the advancing direction (+X direction) of the writing beam LB, one of the parallel flat plates is provided to be inclined around an axis parallel to the Y-axis, and the other parallel flat plate is provided to be inclined around an axis parallel to the Z-axis. In accordance with the inclination angle of each parallel flat plate, the writing beam LB is emitted from the beam shifter mechanism 44 by shifting laterally in the ZY plane.

Thereafter, the writing beam LB is reflected in the -Y direction by the second reflection mirror 57 , reaches the third reflection mirror 58 , and is reflected in the -Z direction by the third reflection mirror 58 . and reaches the fourth reflection mirror 59 . The writing beam LB is reflected in the +Y direction by the fourth reflection mirror 59 , and is incident on the first beam splitter 60 . The first beam splitter 60 reflects a part of the light quantity component of the writing beam LB in the -X direction and guides it to the second optical system 42, and removes the remaining light quantity component of the writing beam LB. 3 Guide to the optical system (43). In the case of the present embodiment, the writing beam LB guided to the second optical system 42 is distributed there to three writing units UW1 , UW3 , UW5 , and writing guided to the third optical system 43 . The beam LB is distributed there to two writing units UW2 and UW4. For this reason, in the first beam splitter 60, it is preferable that the ratio of reflectance and transmittance on the light splitting surface be 3:2 (reflectance 60%, transmittance 40%), but it is not necessary. It doesn't matter if it's 1:1.

Here, the third reflection mirror 58 and the fourth reflection mirror 59 are provided with a predetermined interval on the rotation axis I of the moving mechanism 24 . That is, the center line of the writing beam LB (parallel beam) reflected by the third reflection mirror 58 and directed toward the fourth reflection mirror 59 is set to coincide with (coaxially) the rotation axis I.

In addition, the configuration up to the light source device CNT including the third reflection mirror 58 (the portion surrounded by the dashed-dotted line on the upper side in the Z direction in Fig. 4) is provided on the body frame 21 side, while , the configuration up to the plurality of writing units UW1 to UW5 including the fourth reflection mirror 59 (the portion surrounded by the dashed-dotted line on the lower side of the Z direction in FIG. 4 ) is the second optical surface 25 ) is installed on the side. For this reason, even when the first optical surface plate 23 and the second optical surface plate 25 are relatively rotated by the moving mechanism 24, the third reflection mirror ( 58) and the fourth reflection mirror 59 are provided, the optical path of the writing beam LB from the fourth reflection mirror 59 to the first beam splitter 60 is not changed. Therefore, even if the 2nd optical surface plate 25 rotates with respect to the 1st optical surface plate 23 by the movement mechanism 24, the writing beam LB emitted from the light source device CNT provided in the main body frame 21 side. It becomes possible to guide stably preferably to the some drawing unit UW1-UW5 provided in the 2nd optical surface plate 25 side.

The second optical system 42 directs one writing beam LB branched from the first beam splitter 60 of the first optical system 41 to odd-numbered writing units UW1, UW3, UW5 to be described later. Branching and guiding. The second optical system 42 includes a fifth reflection mirror 61 , a second beam splitter 62 , a third beam splitter 63 , and a sixth reflection mirror 64 .

The writing beam LB reflected in the -X direction by the first beam splitter 60 of the first optical system 41 is reflected in the -Y direction by the fifth reflection mirror 61, and the second beam splitter 62 ) to enter A part of the writing beam LB incident on the second beam splitter 62 is reflected in the -Z direction, and is guided to one of the odd-numbered writing units UW5 (refer to Fig. 5). The writing beam LB transmitted through the second beam splitter 62 is incident on the third beam splitter 63 . A part of the writing beam LB incident on the third beam splitter 63 is reflected in the -Z direction, and is guided to one of the odd-numbered writing units UW3 (refer to FIG. 5 ). And a part of the writing beam LB that has passed through the third beam splitter 63 is reflected in the -Z direction by the sixth reflection mirror 64, and is guided to one writing unit UW1 among odd numbers ( see Fig. 5). Moreover, in the 2nd optical system 42, the writing beam LB irradiated to odd-numbered writing units UW1, UW3, UW5 is inclined slightly with respect to the -Z direction.

Moreover, in order to effectively use the power of the writing beam LB, the ratio of the reflectance and transmittance of the 2nd beam splitter 62 is 1:2, and the ratio of the reflectance and transmittance of the 3rd beam splitter 63 is 1:1. It is better to be close to

On the other hand, the third optical system 43 directs the other writing beam LB branched from the first beam splitter 60 of the first optical system 41 toward even-numbered writing units UW2 and UW4 to be described later. Branching and guiding. The third optical system 43 includes a seventh reflection mirror 71 , a beam shifter mechanism 45 , an eighth reflection mirror 72 , a fourth beam splitter 73 , and a ninth reflection mirror 74 . have

The writing beam LB transmitted in the +Y direction by the first beam splitter 60 of the first optical system 41 is reflected in the +X direction by the seventh reflection mirror 71 and passes through the beam shifter mechanism 45 . Thus, it is incident on the eighth reflection mirror 72 . The beam shifter mechanism 45 is constituted by two parallel flat plates (quartz) that can be tilted the same as the beam shifter mechanism 44 , and a writing beam LB that advances in the +X direction toward the eighth reflection mirror 72 . is shifted laterally in the ZY plane.

The writing beam LB reflected in the -Y direction by the eighth reflection mirror 72 is incident on the fourth beam splitter 73 . A part of the writing beam LB irradiated to the 4th beam splitter 73 is reflected in the -Z direction, and is guided to one writing unit UW4 among even numbers (refer FIG. 5). The writing beam LB transmitted through the fourth beam splitter 73 is reflected by the ninth reflection mirror 74 in the -Z direction, and is guided to one of the even-numbered writing units UW2. Also in the third optical system 43 , the writing beam LB irradiated to the even-numbered writing units UW2 and UW4 is slightly inclined with respect to the -Z direction.

In this way, in the branch optical system SL, the writing beam LB from the light source device CNT is branched toward some writing unit UW1 - UW5 into a plurality. At this time, the 1st beam splitter 60, the 2nd beam splitter 62, the 3rd beam splitter 63, and the 4th beam splitter 73 are the writing beams irradiated to the some writing unit UW1 - UW5. The reflectance (transmittance) is made into an appropriate reflectance according to the branch number of the writing beam LB so that the beam intensity|strength of LB may become the same intensity|strength.

Incidentally, the beam shifter mechanism 44 is disposed between the second relay lens 56 and the second reflection mirror 57 . The beam shifter mechanism 44 can fine-tune all the positions of the drawing lines LL1-LL5 formed on the board|substrate P in the drawing surface of the board|substrate P in micrometer order.

Moreover, the beam shifter mechanism 45 connects the even-numbered 2nd writing line LL2 and the 4th writing line LL4 among the writing lines LL1-LL5 formed on the board|substrate P to the board|substrate P ) can be finely adjusted in the order of μm within the drawing screen.

Furthermore, with reference to FIG.4, FIG.5, and FIG.7, the some drawing unit UW1 - UW5 is demonstrated. As shown in FIG. 4 (and FIG. 1), some drawing unit UW1-UW5 is arrange|positioned by two rows in the circumferential direction of rotary drum DR with center plane p3 interposed therebetween. The plurality of writing units UW1 to UW5 are arranged on the side (the -X direction side in FIG. 5 ) on which the first, third, and fifth writing lines LL1 , LL3 and LL5 are arranged with the center plane p3 interposed therebetween. ), the first drawing unit UW1 , the third drawing unit UW3 , and the fifth drawing unit UW5 are arranged. 1st drawing unit UW1, 3rd drawing unit UW3, and 5th drawing unit UW5 are arrange|positioned at predetermined intervals in the Y direction. In addition, the plurality of writing units UW1 to UW5 are disposed on the side (+X direction side in FIG. 5 ) on which the second and fourth writing lines LL2 and LL4 are arranged with the center plane p3 interposed therebetween. A second writing unit UW2 and a fourth writing unit UW4 are arranged. The 2nd writing unit UW2 and the 4th writing unit UW4 are arrange|positioned at predetermined intervals in the Y direction. At this time, as shown in previous FIG. 2 or FIG. 5 , the second writing unit UW2 is located between the first writing unit UW1 and the third writing unit UW3 in the Y direction. . Similarly, the 3rd drawing unit UW3 is located between the 2nd drawing unit UW2 and the 4th drawing unit UW4 in the Y direction. 4th drawing unit UW4 is located between 3rd drawing unit UW3 and 5th drawing unit UW5 in the Y direction. Moreover, as shown in FIG. 4, 1st drawing unit UW1, 3rd drawing unit UW3, and 5th drawing unit UW5, 2nd drawing unit UW2, and 4th drawing unit UW4 are , are arranged symmetrically about the central plane p3 as viewed from the Y direction.

Next, with reference to FIG. 4, the structure of the optical system in each drawing unit UW1 - UW5 is demonstrated. In addition, since each drawing unit UW1 - UW5 has the same structure, 1st drawing unit UW1 (hereafter simply referred to as "drawing unit UW1") is demonstrated as an example.

The writing unit UW1 shown in FIG. 4 includes a light deflector 81 and a polarization beam splitter so as to scan the spot light of the writing beam LB along the writing line LL1 (the first writing line LL1). (PBS), a quarter wave plate 82 , a syringe 83 , a bending mirror 84 , an f-θ lens system 85 , and a cylindrical lens 86 . and an optical member (lens group) 86B for Y magnification correction. Moreover, the calibration detection system 31 is provided adjacent to the polarization beam splitter PBS.

As the optical deflector 81, for example, an acousto-optical device (AOM: Acousto Optic Modulator) is used. The AOM generates an ON state in which the first-order diffracted light of the incident writing beam is generated in a predetermined diffraction angular direction depending on whether a diffraction grating is generated by an ultrasonic wave (high-frequency signal) inside, and the first-order diffracted light is not generated. It is an optical switching device that switches to the non-OFF state.

The control part 16 shown in FIG. 1 switches the projection/non-projection to the board|substrate P of the writing beam LB to the board|substrate P at high speed by switching the optical deflector 81 ON/OFF. Specifically, one of the writing beams LB distributed from the branch optical system SL is irradiated to the optical deflector 81 at a slight inclination with respect to the -Z direction via the relay lens 91 . When the light deflector 81 is switched to OFF, the writing beam LB goes straight in an inclined state, and is shielded from light by the light blocking plate 92 provided where it has passed through the light deflector 81 . On the other hand, when the optical deflector 81 is switched ON, the writing beam LB (first-order diffracted light) is deflected in the -Z direction, passes through the optical deflector 81, and the optical deflector 81 ) is irradiated to a polarization beam splitter (PBS) provided on the Z direction. For this reason, when the light deflector 81 is switched ON, the spot light of the writing beam LB is projected on the substrate P, and when the light deflector 81 is switched OFF, the writing beam LB The spot light is not projected onto the substrate P.

In addition, since the AOM is disposed at the position of the beam waist of the writing beam LB converged by the relay lens 91 , the writing beam LB (primary diffracted light) emitted from the optical deflector 81 is diverged. do. Therefore, a relay lens 93 for returning the diverging writing beam LB to a parallel beam is provided behind the optical deflector 81 .

The polarization beam splitter PBS reflects the writing beam LB irradiated from the optical deflector 81 via the relay lens 93 . The writing beam LB emitted from the polarizing beam splitter PBS is a quarter wave plate 82, a syringe 83 (rotating polygon mirror), a bending mirror 84, an f-θ lens system 85, and Y The optical member 86B for magnification correction and the cylindrical lens 86 advance in this order, and are condensed as scanning spot light on the board|substrate P.

On the other hand, the polarization beam splitter PBS cooperates with the quarter wave plate 82 provided between the polarization beam splitter PBS and the syringe 83, and the substrate P or the rotating drum ( The reflected light of the writing beam LB projected on the outer peripheral surface of the DR is the Y magnification correction optical member 86B, the cylindrical lens 86, the f-θ lens system 85, the bending mirror 84, and the syringe 83 ), the reflected light can be transmitted. That is, the writing beam LB irradiated from the optical deflector 81 to the polarization beam splitter PBS is a laser beam used as linearly polarized light of the S-polarized light, and is reflected by the polarization beam splitter PBS. In addition, the writing beam LB reflected by the polarization beam splitter PBS is for the 1/4 wave plate 82, the scanner 83, the bending mirror 84, the f-θ lens system 85, and the Y magnification correction. The spot light of the writing beam LB which is irradiated to the board|substrate P through the optical member 86B and the cylindrical lens 86, and is condensed on the board|substrate P becomes circularly polarized light . The reflected light from the board|substrate P (or the outer peripheral surface of the rotating drum DR) regresses the light transmission path of the writing beam LB, P-polarization|polarized_light by passing through the quarter wave plate 82 again. It becomes a laser beam which becomes linearly polarized light of For this reason, the reflected light from the substrate P (or the rotating drum DR) to the polarization beam splitter PBS passes through the polarization beam splitter PBS and passes through the relay lens 94 to the calibration detection system ( 31) is irradiated to the photoelectric sensor 31Cs.

As described above, the polarization beam splitter PBS is an optical splitter disposed between the scanning optical system including the scanner 83 and the calibration detection system 31 . Since the calibration detection system 31 shares many parts of the optical system for transmitting the writing beam LB to the substrate P, it becomes an easy and compact optical system.

4 and 7 , the scanner 83 includes a reflection mirror 96 , a rotating polygon mirror (rotating polygon mirror) 97 , and an origin detector 98 . The writing beam LB (parallel beam) passing through the quarter wave plate 82 is reflected in the XY plane by the reflection mirror 96 via the cylindrical lens 95, and the rotation polygon mirror ( 97) are investigated. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction, and a plurality of reflective surfaces 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction about the rotation axis 97a, so that the writing beam LB (intensity-modulated beam by the light deflector 81) irradiated to the reflective surface 97b. The reflection angle is continuously changed in the XY plane, whereby the reflected writing beam LB is generated by the bending mirror 84, the f-θ lens system 85, the second cylindrical lens 86 (and the Y magnification). It is condensed by the spot light by the optical member 86B for correction|amendment, and it scans along the drawing line LL1 (similarly LL2 - LL5) on the board|substrate P. The origin detector 98 is detecting the origin of the writing beam LB scanned along the writing line LL1 of the board|substrate P (similarly LL2-LL5). The origin detector 98 is disposed on the opposite side of the reflection mirror 96 with the writing beam LB reflected by each reflection surface 97b interposed therebetween.

In Fig. 7, for simplicity of explanation, only the photoelectric detector is shown as the origin detector 98, but in reality, the drawing beam LB is projected toward the reflective surface 97b of the rotating polygon mirror 97 for detection. A light source for detection, such as an LED or semiconductor laser that projects a beam, is provided, and the origin detector 98 photoelectrically detects the light reflected from the reflective surface 97b of the detection beam through a thin slit.

Thereby, the origin detector 98 is always immediately ahead of the timing at which the spot light is irradiated to the writing start position of the writing lines LL1 ( LL2 to LL5 ) on the substrate P, and a pulse indicating the origin It is set to output a signal.

The writing beam LB irradiated from the syringe 83 to the bending mirror 84 is reflected by the bending mirror 84 in the -Z direction, and the f-θ lens system 85 and the cylindrical lens 86 ( and the optical member 86B for Y magnification correction).

By the way, when each reflection surface 97b of the rotation polygon mirror 97 is not strictly parallel to the center line of the rotation axis 97a and is slightly inclined (if the surface is tilted), the spot projected on the substrate P The writing lines LL1-LL5 by light are shaken in the X direction on the board|substrate P for every reflective surface 97b. Here, by providing the two cylindrical lenses 95 and 86 using FIG. 8 , the drawing line LL1 is related to the tilt of each reflective surface 97b of the rotating polygon mirror 97 . - LL5), which can reduce or eliminate the shake in the X direction will be described.

The left side of Fig. 8 shows a state in which the optical paths of the cylindrical lens 95, the syringe 83, the f-θ lens system 85, and the cylindrical lens 86 are expanded in the XY plane, The right side of Fig. 8 shows a state in which the optical path is developed in the XZ plane. As a basic optical arrangement, the reflection surface 97b to which the writing beam LB of the rotating polygon mirror 97 is irradiated is arranged so that it becomes the incident pupil position (front focus position) of the f-θ lens system 85 . do. Accordingly, with respect to the rotation angle θp/2 of the rotating polygon mirror 97, the incidence angle of the writing beam LB incident on the f-θ lens system 85 becomes θp, and the substrate P is proportional to the incidence angle θp. The image height position of the spot light projected on ) (surface to be irradiated) is determined. In addition, by making the reflective surface 97b the front focal position of the f-θ lens system 85, the writing beam LB projected on the substrate P is telecentric at any position on the writing line ( The principal ray of the writing beam, which becomes the spot light, is always parallel to the optical axis AXf of the f-θ lens system 85).

As shown in Fig. 8, both of the two cylindrical lenses 95 and 86 have refractive power (power) in a plane (XY plane) perpendicular to the rotation axis 97a of the rotation polygon mirror 97. ) functions as a parallel plate glass of zero, and functions as a convex lens having a constant positive refractive power in the Z direction (in the XZ plane) in which the rotation axis 97a extends. Although the cross-sectional shape of the writing beam LB (almost parallel beam) incident on the first cylindrical lens 95 is a circular shape of about several millimeters, the focal position in the XZ plane of the cylindrical lens 95 is reflected When it is set on the reflective surface 97b of the rotating polygon mirror 97 via the mirror 96, it has a beam width of several mm in the XY plane, and the slit-shaped spot light converging in the Z direction is half It extends in the rotational direction on the slope 97b and is condensed.

The writing beam LB reflected by the reflective surface 97b of the rotating polygon mirror 97 is a parallel beam in the XY plane, but becomes a divergent beam in the XZ plane (the direction in which the rotation axis 97a extends), and is f-θ. It enters the lens system 85 . Therefore, the writing beam LB immediately after the f-θ lens system 85 is emitted is a substantially parallel beam in the XZ plane (the direction in which the rotation axis 97a extends), but the second cylindrical lens ( 86), in the XZ plane, that is, on the substrate P, also in the conveyance direction of the substrate P orthogonal to the direction in which the drawing lines LL1 to LL5 extend, is condensed as spot light. As a result, on each drawing line on the board|substrate P, circular small spot light is projected.

By providing the cylindrical lens 86, as shown on the right side of Fig. 8, in the XZ plane, the reflection surface 97b of the rotating polygon mirror 97 and the substrate P (surface to be irradiated) are optically connected. It can be set in an airspace relationship. Therefore, each reflective surface 97b of the rotating polygon mirror 97 has a tilt error with respect to the non-scanning direction (the direction in which the rotating shaft 97a extends) orthogonal to the scanning direction of the writing beam LB. Even if it has, the positions of drawing lines LL1-LL5 on the board|substrate P do not shake in the non-scan direction (conveyance direction of the board|substrate P) of spot light. In this way, by providing the cylindrical lenses 95 and 86 before and after the rotating polygon mirror 97, it is possible to constitute an optical system for correcting the plane tilt of the polygon reflection surface in the non-scan direction.

Here, as shown in FIG. 7, each injector 83 of some drawing unit UW1-UW5 has a symmetrical structure with respect to the central plane p3. In the plurality of syringes 83, three syringes 83 corresponding to the drawing units UW1, UW3, and UW5 are arranged on the upstream side of the rotational direction of the rotary drum DR (the -X direction side in FIG. 7). and two syringes 83 corresponding to the drawing units UW2 and UW4 are arranged on the downstream side (+X direction side in FIG. 7 ) of the rotational direction of the rotary drum DR. Then, the three syringes 83 on the upstream side and the two syringes 83 on the downstream side are disposed to face each other with the central plane p3 interposed therebetween. In this way, the three injectors 83 on the upstream side and the two injectors 83 on the downstream side are in an arrangement relationship in which they are rotated by 180 degrees about the rotation axis I (Z axis). For this reason, when the drawing beam LB is irradiated to the rotating polygon mirror 97 while the three rotating polygon mirrors 97 on the upstream side rotate counterclockwise, for example, by the rotating polygon mirror 97 The reflected writing beam LB is scanned in a predetermined scanning direction (for example, +Y direction in FIG. 7) from a writing start position to a writing end position. On the other hand, when the writing beam LB is irradiated to the rotating polygon mirror 97 while the two rotating polygon mirrors 97 on the downstream side rotate counterclockwise, the writing beam reflected by the rotating polygon mirror 97 is LB is scanned from the writing start position to the writing end position in the scanning direction (for example, -Y direction in FIG. 7) opposite to the three rotation polygon mirrors 97 on the upstream side.

Here, the axis of the writing beam LB from the odd-numbered writing units UW1, UW3, UW5 to the substrate P when viewed in the XZ plane in Fig. 4 is in the direction coincident with the installation azimuth Le1, there is. That is, the installation azimuth line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4 , the axis of the writing beam LB from the even-numbered writing units UW2 and UW4 to the substrate P is in the same direction as the installation azimuth Le2. That is, the installation azimuth line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. For this reason, each advancing direction (principal ray) of the writing beam LB which becomes spot light and is projected to the board|substrate P is set so that all may face the rotation center line AX2 of the rotating drum DR.

The optical member 86B for Y magnification correction is arrange|positioned between the f-θ lens system 85 and the substrate P. The optical member 86B for Y magnification correction|amendment can enlarge or reduce drawing line LL1-LL5 formed by each drawing unit UW1-UW5 isotropically only a small amount in a Y direction.

Specifically, a transmissive parallel flat plate (quartz) of a certain thickness that covers each of the drawing lines LL1 to LL5 is mechanically curved (bent) with respect to the direction in which the drawing line extends, so that the drawing line is magnified in the Y direction. The magnification (scan length) in the Y direction of the drawing line by moving a mechanism for making the (scan length) variable or a lens system of three groups of convex, concave and convex lenses in the optical axis direction It is possible to use an instrument or the like that makes it variable.

As for the drawing apparatus 11 comprised in this way, each part is controlled by the control part 16, and a predetermined|prescribed pattern is drawn on the board|substrate P. As shown in FIG. That is, during the period in which the writing beam LB projected onto the substrate P is scanned in the scanning direction, the control unit 16 controls the optical deflector ( 81), the writing beam LB is deflected by ON/OFF modulation, and a pattern is drawn on the photosensitive layer of the board|substrate P. Moreover, by synchronizing the movement of the conveyance direction of the board|substrate P by the scanning direction of the writing beam LB scanned along writing line LL1, and the rotation of rotary drum DR, the control part 16 exposes, A predetermined pattern is drawn in a portion corresponding to the drawing line LL1 in the area A7.

Next, with reference to FIG. 9 together with FIG. 3, alignment microscope AM1, AM2 is demonstrated. Alignment microscope AM1, AM2 detects the alignment mark previously formed on the board|substrate P, or the reference mark, reference|standard pattern, etc. formed on the rotating drum DR. Hereinafter, the alignment mark of the board|substrate P and the reference mark and reference pattern of the rotating drum DR are simply called a mark. Alignment microscope AM1, AM2 is used in order to align (align) the board|substrate P and the predetermined|prescribed pattern drawn on the board|substrate P, or to calibrate the rotating drum DR and the drawing apparatus 11 do.

Alignment microscope AM1, AM2 is provided in the upstream of the rotation direction (conveyance direction of the board|substrate P) of the rotary drum DR rather than drawing line LL1-LL5 formed with the drawing apparatus 11. Moreover, compared with alignment microscope AM2, alignment microscope AM1 is arrange|positioned at the upstream of the rotation direction of rotary drum DR.

Alignment microscopes AM1 and AM2 project illumination light onto a substrate P or a rotating drum DR, and an objective lens system GA as a detection probe that injects light generated from the mark (representative in Fig. 9, alignment microscopes) (represented as the objective lens system GA4 of (AM2)), the image of the mark received via the objective lens system GA as a medium (bright field image, dark field image, fluorescent image ( The imaging system GD (representatively shown as the imaging system GD4 of the alignment microscope AM2 in FIG. 9) etc. is comprised by the two-dimensional CCD, CMOS, etc. for imaging. Moreover, the illumination light for alignment is the light of the wavelength range which has little sensitivity with respect to the photosensitive layer on the board|substrate P, for example, light with a wavelength of about 500-800 nm.

Alignment microscope AM1 is arranged in a line in a Y direction (the width direction of the board|substrate P), and multiple (for example, three pieces) are provided. Similarly, alignment microscope AM2 is arranged in a line in a Y direction (width direction of the board|substrate P), and multiple (for example, three pieces) are provided. That is, six alignment microscopes AM1 and AM2 are provided in total.

In Fig. 3, the arrangement of each of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 is shown for clarity. The observation areas (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are shown in FIG. 3 . As shown, they are arranged at predetermined intervals in the Y direction parallel to the rotation center line AX2. As shown in Fig. 9, the optical axes La1 to La3 of each objective lens system GA1 to GA3 passing through the center of each observation region Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the observation areas Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotary drum DR) by each objective lens system GA of the three alignment microscopes AM2 are rotated as shown in FIG. 3 . They are arranged at predetermined intervals in the Y direction parallel to the center line AX2. 9, the optical axes La4 to La6 of each objective lens system GA passing through the center of each observation area Vw4 to Vw6 are also parallel to the XZ plane. And observation area|region Vw1-Vw3 and observation area|region Vw4-Vw6 are arrange|positioned at predetermined intervals in the rotation direction of rotary drum DR.

The observation areas Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set, for example, in the range of about 500 to 200 µm square on the substrate P or the rotary drum DR. do. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA, are installation azimuth lines extending from the rotation center line AX2 in the radial direction of the rotary drum DR. set in the same direction as (Le3). In this way, the installation azimuth line Le3 is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed within the XZ plane of FIG. 9 . Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA, are the installation azimuth lines extending from the rotation center line AX2 in the radial direction of the rotary drum DR. set in the same direction as (Le4). In this way, the installation azimuth line Le4 is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed within the XZ plane of FIG. 9 . At this time, since the alignment microscope AM1 is disposed on the upstream side of the rotational direction of the rotary drum DR compared to the alignment microscope AM2, the angle between the central plane p3 and the installation direction line Le3 is, It is larger than the angle between the central plane p3 and the installation azimuth Le4.

On the board|substrate P, as shown in FIG. 3, exposure area|region A7 drawn by each of five writing lines LL1-LL5 is arrange|positioned at a predetermined space|interval in the X direction. A plurality of alignment marks Ks1 to Ks3 (hereinafter, simply referred to as “marks”) for alignment are formed, for example, in a cross shape around the exposure area A7 on the substrate P.

In FIG. 3 , marks Ks1 are provided at regular intervals in the X direction in the peripheral region on the -Y side of the exposure area A7, and the marks Ks3 are the peripheral regions on the +Y side of the exposure area A7. In, it is provided at regular intervals in the X direction. In addition, the mark Ks2 is provided in the center of the Y direction in a blank area between two exposure areas A7 adjacent to each other in the X direction.

And, the mark Ks1 is in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1, and in the observation area Vw4 of the objective lens system GA of the alignment microscope AM2, the substrate ( While P) is being sent, it is formed to be captured in turn. In addition, the mark Ks3 is in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation area Vw6 of the objective lens system GA of the alignment microscope AM2, the substrate ( While P) is being sent, it is formed to be captured in turn. In addition, the marks Ks2 are, respectively, within the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and within the observation area Vw5 of the objective lens system GA of the alignment microscope AM2, While the substrates P are being sent, they are formed so as to be captured one after the other.

For this reason, alignment microscope AM1, AM2 of both sides of the Y direction of rotation drum DR among three alignment microscope AM1, AM2 marks Ks1, Ks3 formed in the both sides of the width direction of the board|substrate P. ) can be observed or detected at all times. Moreover, alignment microscope AM1, AM2 of the center of the Y direction of rotation drum DR among three alignment microscope AM1, AM2 is between exposure area|region A7 comrades drawn on the board|substrate P. The mark Ks2 formed in the blank area or the like can be observed or detected at all times.

Here, since the exposure apparatus EX is a so-called multi-beam type writing apparatus, the some pattern drawn on the board|substrate P by each writing line LL1-LL5 of some writing unit UW1-UW5 here. Calibration for suppressing the joint precision by a plurality of drawing units UW1 to UW5 within an allowable range is necessary so that each other may be preferably connected to each other in the Y direction. In addition, the relative positional relationship of the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the respective drawing lines LL1 to LL5 of the plurality of writing units UW1 to UW5 is precisely determined by baseline management. need to be saved Calibration is also required for the baseline management.

In the calibration for confirming the joint precision by the plurality of drawing units UW1 to UW5, and the calibration for baseline management of the alignment microscopes AM1 and AM2, the outer peripheral surface of the rotating drum DR supporting the substrate P is It is necessary to provide a reference mark or a reference pattern at least in part. Then, as shown in FIG. 10, in the exposure apparatus EX, the rotating drum DR which provided the reference mark and the reference|standard pattern in the outer peripheral surface is used.

As for the rotary drum DR, the scale parts GPa, GPb which comprise a part of the rotational position detection mechanism 14 mentioned later are formed in both ends of the outer peripheral surface similarly to FIG. 3, FIG. Moreover, in the rotary drum DR, the narrow-width restriction bands CLa, CLb by a concave groove or a convex rim are provided inside the scale parts GPa, GPb. It is engraved all over the perimeter. The width of the Y-direction of the substrate P is set smaller than the interval in the Y-direction of the two regulating bands CLa, CLb, and the substrate P is a regulating band CLa, CLb) is supported in close contact with the inner region sandwiched between the CLb).

Rotary drum DR has a plurality of line patterns RL1 (line patterns) inclined at +45 degrees with respect to rotation center line AX2 on an outer peripheral surface sandwiched between control tables CLa and CLb, and rotation center line AX2. A mesh-shaped reference pattern (which can also be used as a reference mark) prepared by repeating a plurality of line patterns RL2 (line patterns) inclined at -45 degrees with a constant pitch (period) Pf1, Pf2 (Pf1, Pf2) ( RMP) is provided. In addition, the width|variety of the line pattern RL1 and the line pattern RL2 is LW.

The reference pattern RMP is a uniform, inclined pattern ( inclined lattice pattern). Note that the line patterns RL1 and RL2 do not necessarily have an inclination of 45 degrees, and a vertical and horizontal mesh pattern in which the line pattern RL1 is parallel to the Y-axis and the line pattern RL2 is parallel to the X-axis. it's ok to do In addition, it is not necessary to intersect the line patterns RL1 and RL2 by 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is a square (or a rectangle). The line patterns RL1 and RL2 may intersect at an angle other than the ridge shape.

Next, with reference to FIG. 3, FIG. 4, and FIG. 9, the rotation position detection mechanism 14 is demonstrated. As shown in FIG. 9, the rotation position detection mechanism 14 optically detects the rotation position of the rotating drum DR, for example, the encoder system using a rotary encoder etc. is applied. The rotational position detection mechanism 14 is a plurality of encoder heads EN1, EN2, EN3 which face each of the scale parts GPa, GPb provided in the both ends of the rotating drum DR, and the scale parts GPa, GPb. , EN4) for movement measuring devices. 4 and 9, only the four encoder heads EN1, EN2, EN3, EN4 facing the scale part GPa are shown, but the same encoder heads EN1, EN2, EN3, EN4 also for the scale part GPb. ) are arranged opposite to each other. The rotational position detection mechanism 14 is a displacement gauge (YN1, YN2, YN3) which can detect the shake (small displacement in the Y direction in which the rotational center line AX2 extends) of the both ends of the rotary drum DR. , YN4).

The scales of the scale portions GPa and GPb are formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR. The scale parts GPa, GPb are diffraction gratings prepared by engraving concave or convex grating lines at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and incremental (incremental) ) type scale. For this reason, scale part GPa, GPb rotates integrally with rotary drum DR around rotation center line AX2.

The board|substrate P is comprised so that the inside which avoided the scale parts GPa, GPb of the both ends of the rotary drum DR, ie, the inside of the regulation bases CLa, CLb, may be wound. When a strict arrangement relationship is required, the outer peripheral surfaces of the scale portions GPa and GPb and the outer peripheral surfaces of the portion of the substrate P wound around the rotary drum DR are set to be the same plane (the same radius from the center line AX2). do. For that purpose, what is necessary is just to make the outer peripheral surface of scale part GPa, GPb high only by the thickness of the board|substrate P in a radial direction with respect to the outer peripheral surface for board|substrate winding of rotary drum DR. For this reason, the outer peripheral surface of scale part GPa, GPb formed in rotating drum DR can be set to the substantially same radius as the outer peripheral surface of the board|substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial position as the drawing surface on the board|substrate P wound on the rotating drum DR, The Abbe error caused by the difference between the measurement position and the processing position in the radial direction of the rotation system can be reduced.

Encoder heads EN1, EN2, EN3, EN4 are respectively arrange|positioned around the scale parts GPa, GPb as viewed from the rotation center line AX2, and are located at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN1 , EN2 , EN3 , EN4 are connected to the control unit 16 . Encoder heads EN1, EN2, EN3, EN4 project light beams for measurement toward the scale parts GPa, GPb, and photoelectrically detect the reflected beam (diffracted light), and the scale parts GPa, GPb ) according to the position change in the circumferential direction (for example, a two-phase signal having a phase difference of 90 degrees) is output to the control unit 16 . The control unit 16 interpolates and interpolates the detection signal by a counter circuit (not shown) and performs digital processing, thereby changing the angle of the rotary drum DR, that is, the circumferential direction of the outer peripheral surface. Position changes can be measured with sub-micron resolution. The control part 16 can also measure the conveyance speed of the board|substrate P from the angular change of rotary drum DR.

Moreover, as shown in FIG.4 and FIG.9, encoder head EN1 is arrange|positioned on the installation direction line Le1. The installation azimuth Le1 is a line connecting the projection area (reading position) on the scale part GPa (GPb) of the measurement light beam by the encoder head EN1 and the rotation center line AX2 in the XZ plane. has been Moreover, as described above, the installation azimuth Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the read position of the encoder head EN1 and the rotation center line AX2, the drawing lines LL1, LL3, LL5, and the line connecting the rotation center line AX2 are the same azimuth lines.

Similarly, as shown in FIG.4 and FIG.9, encoder head EN2 is arrange|positioned on the installation direction line Le2. The installation azimuth Le2 is a line connecting the projection area (reading position) on the scale part GPa (GPb) of the measurement light beam by the encoder head EN2 and the rotation center line AX2 in the XZ plane. has been Moreover, as described above, the installation direction line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the read position of the encoder head EN2 and the rotation center line AX2, the drawing lines LL2, LL4, and the line connecting the rotation center line AX2 are the same azimuth lines.

Moreover, as shown in FIG.4 and FIG.9, encoder head EN3 is arrange|positioned on the installation direction line Le3. The installation azimuth Le3 is a line connecting the projection area (reading position) on the scale part GPa(GPb) of the measurement light beam by the encoder head EN3 and the rotation center line AX2 in the XZ plane. has been Moreover, as described above, the installation direction line Le3 is a line connecting the observation areas Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center line AX2 within the XZ plane. . From the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are, when viewed in the XZ plane, are of the same direction.

Similarly, as shown in FIG.4 and FIG.9, encoder head EN4 is arrange|positioned on the installation direction line Le4. The installation azimuth Le4 is a line connecting the projection area (reading position) on the scale part GPa (GPb) of the measurement light beam by the encoder head EN4 and the rotation center line AX2 in the XZ plane. has been Moreover, as described above, the installation direction line Le4 is a line connecting the observation areas Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2 in the XZ plane. . From the above, the line connecting the reading position of the encoder head EN4 and the rotation center line AX2, and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2, when viewed in the XZ plane, are of the same direction.

When the mounting orientation of the encoder head (EN1, EN2, EN3, EN4) (the angular direction in the XZ plane centered on the rotational center line (AX2)) is expressed by the mounting orientation lines (Le1, Le2, Le3, Le4), Fig. As shown in 4 , a plurality of writing units UW1 to UW5 and encoder heads EN1 and EN2 are arranged so that the installation azimuth lines Le1 and Le2 are at an angle ±θ° with respect to the central plane p3 . The mounting azimuth Le1 and the mounting azimuth Le2 are spatially non-interfering with the encoder head EN1 and the encoder head EN2 around the scale of the scale portion GPa (GPb).

The displacement gauges YN1, YN2, YN3, and YN4 are respectively arranged around the scale portion GPa or GPb as viewed from the rotation center line AX2, and are positioned at different positions in the circumferential direction of the rotary drum DR. The displacement meters YN1, YN2, YN3, and YN4 are connected to the control unit 16 .

The displacement gauges YN1, YN2, YN3, and YN4 detect the displacement at a position as close as possible to the drawing surface on the substrate P wound on the rotating drum DR in the radial direction, thereby reducing the Abbe error. there is. The displacement meters YN1, YN2, YN3, and YN4 project a light beam for measurement toward one of both ends of the rotary drum DR, and photoelectrically detect the reflected light beam (or diffracted light). ), a detection signal according to a change in the position of both ends in the Y direction (the width direction of the substrate P) is output to the control unit 16 . The control unit 16 digitally processes the detection signal by a measurement circuit (counter circuit, interpolation circuit, etc.) not shown, so as to detect a change in displacement of the rotating drum DR (and the substrate P) in the Y direction in the Y direction. It can measure with sub-micron resolution The control part 16 can also measure the rotational deviation of the rotating drum DR from the change of one of the both ends of the rotating drum DR.

Displacement gauge YN1, YN2, YN3, YN4 may be one out of four, but for measurement of rotational deviation of rotary drum DR, etc., if there are three or more out of four, both ends of rotary drum DR Movement in one direction (dynamic inclination change, etc.) can be grasped. Moreover, when the control part 16 can measure normally the mark and pattern (or the mark on the rotating drum DR, etc.) on the board|substrate P with alignment microscope AM1, AM2, displacement meter YN1, YN2, YN3 , YN4) may be omitted.

Here, the control part 16 detects the rotation angle position of scale part (rotating drum DR) GPa, GPb by encoder head EN1, EN2, and based on the detected rotation angle position, odd-numbered and even-numbered drawing units UW1 to UW5 are drawing. That is, during the period during which the writing beam LB projected onto the substrate P is scanned in the scanning direction, the control unit 16 controls the optical deflector ( 81) is modulated ON/OFF, but the timing of ON/OFF modulation by the optical deflector 81 is performed based on the detected rotation angle position, whereby a pattern is accurately formed on the photosensitive layer of the substrate P. can draw

Moreover, the control part 16 is scale part GPa detected by encoder heads EN3, EN4 when alignment marks Ks1-Ks3 on the board|substrate P are detected by alignment microscope AM1, AM2. , by memorizing the rotation angle position of GPb (rotating drum DR), the correspondence relationship between the position of alignment mark Ks1-Ks3 on the board|substrate P, and the rotation angle position of rotating drum DR is calculated|required can Similarly, the control unit 16 is a scale unit GPa detected by the encoder heads EN3, EN4 when the reference pattern RMP on the rotating drum DR is detected by the alignment microscopes AM1 and AM2, By memorizing the rotation angular position of GPb) (rotating drum DR), the correspondence relationship between the position of the reference|standard pattern RMP on the rotating drum DR, and the rotation angular position of the rotating drum DR can be calculated|required . In this way, alignment microscopes AM1 and AM2 can precisely measure the rotational angle position (or circumferential position) of the rotary drum DR at the moment when the mark is sampled within the observation areas Vw1 to Vw6. . And in exposure apparatus EX, based on this measurement result, the board|substrate P and the predetermined|prescribed pattern drawn on board|substrate P are aligned (aligned), or rotating drum DR and drawing apparatus 11 ) is calibrated.

In addition, in actual sampling, the reference pattern on the mark on the board|substrate P or rotary drum DR from which the rotation angle position of the rotary drum DR measured by encoder heads EN3, EN4 has been identified approximately beforehand. It is performed by writing the image information output from each imaging system GD of alignment microscope AM1, AM2 to an image memory etc. at high speed when it becomes the angular position corresponding to the position of . That is, the image information output from each imaging system GD is sampled using the rotation angle position of the rotating drum DR measured by encoder heads EN3, EN4 as a trigger. Separately, in response to each pulse of a clock signal of a constant frequency, the rotation angle position (counter measurement value) of the rotary drum DR measured by the encoder heads EN3, EN4 and output from each imaging system GD There is also a method of simultaneously sampling the image information to be used.

Moreover, since the mark on the board|substrate P and the reference|standard pattern RMP on the rotating drum DR move in one direction with respect to observation area|regions Vw1 - Vw6, the image information output from each imaging system GD is In sampling, it is preferable to use a CCD or CMOS image pickup device with a fast shutter speed. Accordingly, it is necessary to increase the luminance of the illumination light that illuminates the observation regions Vw1 to Vw6. it is thought

It is explanatory drawing which shows the positional relationship between a drawing line and a drawing pattern on a board|substrate. The writing units UW1 to UW5 draw the patterns PT1 to PT5 by scanning the spot light of the writing beam LB along the writing lines LL1 to LL5. The writing start positions OC1 to OC5 of the writing lines LL1 to LL5 become the writing start ends PTa of the patterns PT1 to PT5. The writing end positions EC1 to EC5 of the writing lines LL1 to LL5 become the writing end positions PTb of the patterns PT1 to PT5.

Among the drawing start end PTa and the drawing end PTb of the pattern PT1 , the drawing end PTb is connected to the drawing end PTb of the pattern PT2 . Similarly, the writing start end PTa of the pattern PT2 is connected with the writing start end PTa of the pattern PT3, and the writing end PTb of the pattern PT3 is connected with the writing end PTb of the pattern PT4. Then, the writing start end PTa of the pattern PT4 is connected to the writing start end PTa of the pattern PT5. In this way, the patterns PT1-PT5 comrades drawn on the board|substrate P connect with each other in the width direction of the board|substrate P according to the movement to the elongate direction of the board|substrate P, and the whole large exposure area A7 A device pattern is drawn on the

12 is an explanatory diagram showing the relationship between a spot light of a writing beam and a writing line. Among the drawing units UW1 to UW5, the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 will be described representatively. Since it is the same also about the drawing lines LL3 - LL5 of the drawing units UW3 - UW5, description is abbreviate|omitted. By constant velocity rotation of the rotating polygon mirror 97, the beam spot light SP of the writing beam LB follows the writing lines LL1 and LL2 on the substrate P, and the writing start position OC1, The length LBL of the drawing line from OC2) to the drawing end positions EC1 and EC2 is scanned.

Normally, in the direct drawing exposure method, even when drawing a pattern of the smallest size that can be exposed as an apparatus, multiple exposure (multi-write) with a plurality of spot lights SP realizes stable pattern drawing with high precision. are doing As shown in Fig. 12, when the effective diameter of the spot light SP on the writing lines LL1 and LL2 is Xs, since the writing beam LB is a pulsed light, one pulsed light (of the picosecond order) The spot light SP generated by the light emission time) and the spot light SP generated by the next pulsed light are separated in the Y direction (main scanning) at a distance CXs of about 1/2 of the diameter Xs. direction) are scanned to overlap.

Moreover, simultaneously with the main scanning of the spot light SP along each writing line LL1, LL2, since the board|substrate P is conveyed in the +X direction at a constant speed, each writing line LL1, LL2 moves (sub-scan) on the substrate P at a constant pitch in the X direction. The pitch is also set to a distance CXs of about 1/2 of the diameter Xs of the spot light SP here, but is not limited thereto. Thereby, also in the sub-scan direction (X direction), spot lights SP adjacent to each other in the X direction at a distance CXs of 1/2 of the diameter Xs (or an overlapping distance other than that) are overlapped and exposed. In addition, the beam spot light SP generated at the writing end position EC1 of the writing line LL1 and the beam spot light SP generated at the writing end position EC2 of the writing line LL2 are the substrate ( The writing start position OC1 of the writing line LL1 so as to be connected to each other at an overlapping distance CXs in the width direction (Y direction) of the substrate P according to the movement (ie, sub-scanning) in the long direction of P). and a writing end position EC1, and a writing start position OC2 and a writing end position EC2 of the writing line LL2 are set.

As an example, if the effective diameter Xs of the beam spot light SP is 4 µm, 2 rows x 2 columns of the spot light SP (main scanning and sub scanning are arranged overlapping in both directions) The area occupied by a total of 4 spot lights) or the area occupied by 3 rows x 3 columns (a total of 9 spot lights arranged overlapping in both directions of the main and sub scans) is the minimum dimension. The pattern to be used, that is, a pattern having a line width having a minimum dimension of about 6 µm to 8 µm can be exposed favorably. Further, if the reflection surface 97b of the rotation polygon mirror 97 is 10 surfaces, and the rotation speed of the rotation polygon mirror 97 around the rotation shaft 97a is 10,000 rpm or more, the rotation polygon mirror ( 97) of the spot light SP (writing beam LB) on the writing lines LL1 to LL5 is 1666.66... more than possible This means that the pattern of 1666 or more drawing lines can be drawn in the conveyance direction (X direction) per second on the board|substrate P. From this, if the conveyance distance (conveyance speed) per second of the substrate P is reduced, the overlapping distance CXs of the spot lights in the sub-scan direction (X direction) becomes 1/2 or less of the diameter Xs of the spot lights The value of, for example, 1/3, 1/4, 1/5, … can be set, and in that case, the exposure amount given to the photosensitive layer of the substrate P can be increased by exposing the same drawing pattern over a plurality of scans along the drawing line of the spot light.

Moreover, when the conveyance speed of the board|substrate P by the rotational drive of the rotary drum DR is about 5 mm/s, the X direction (substrate ( board|substrate) It is possible to make the pitch (distance CXs) of the conveyance direction of P) about 3 micrometers.

In the case of this embodiment, the resolution R of pattern writing in the main scanning direction (Y direction) constitutes the optical deflector 81 together with the effective diameter Xs and scanning frequency Fms of the spot light SP. It is determined by the minimum switching time of ON/OFF of the acousto-optical device (AOM). As the acousto-optical element (AOM), when the thing of the highest response frequency Fss=50 mHz is used, each time of an ON state and an OFF state can be made into about 20 nS. In addition, the effective scanning period of the writing beam LB by the one reflective surface 97b of the rotating polygon mirror 97 (scan of the spot light equal to the length LBL of the writing line) is equal to the one reflective surface 97b ), the resolution R determined depending on the switching time of the optical deflector 81 is R=LBL/(1/3) when the length LBL of the drawing line is 30 mm. )/(1/Fms)×(1/Fss)≈3 μm.

From this relational expression, in order to improve the resolution R of pattern writing, for example, as an acousto-optical element (AOM) of the optical deflector 81, one having the highest response frequency Fss of 100 mHz is used, and the ON/OFF switching time is Set it to 10 nsec. Thereby, the resolution R becomes 1.5 micrometers, which is half. In this case, the conveyance speed of the board|substrate P by rotation of rotary drum DR is made into half. As another method of improving the resolution R, for example, the rotation speed of the rotation polygon mirror 97 may be increased.

In general, resists used in photolithography have a resist sensitivity Sr of about 30 mj/cm ² . The transmittance ΔTs of the optical system is 0.5 (50%), the effective scanning period in one reflective surface 97b of the rotating polygon mirror 97 is about 1/3, the length of the drawing line LBL is 30 mm, the drawing units UW1 to UW5 ) is 5, and the transfer speed Vp of the substrate P by the rotary drum DR is 5 mm/s (300 mm/min), the required laser power Pw of the light source device CNT is approximated by the following formula it becomes

Pw=30/60×3×30×5/0.5/(1/3)=1350mW

If seven drawing units are used, the required laser power Pw of the light source device CNT is approximated by the following equation.

Pw=30/60×3×30×7/0.5/(1/3)=1890mW

For example, if the resist sensitivity is about 80 mj/cm ² , a light source device (CNT) with a beam output of about 3 to 5 W is required for exposure at the same speed. If, instead of preparing such a high-power light source, the transfer speed Vp of the substrate P by rotation of the rotary drum DR is reduced to 30/80 with respect to the initial value of 5 mm/s, the beam output is 1.4 to 1.9 W It also becomes possible to expose with a light source device of a certain degree.

In addition, if the length LBL of the drawing line is 30 mm, the resolution (beam position) determined by the spot diameter Xs of the beam spot light SP and the optical switching by the acoustooptical element AOM of the optical deflector 81 is the minimum grid that specifies , and is equivalent to one pixel) Xg is the same and is 3 μm At this time, the time for one rotation of the rotating polygon mirror 97 is 3/500 seconds, and the effective scanning period by one reflective surface 97b of the rotating polygon mirror 97 is the rotation angle of one reflective surface 97b. If it is 1/3, the effective scanning time Ts (seconds) by one reflective surface 97b is obtained by (3/500) × (1/10) × (1/3), and Ts = 1 /5000 (seconds). From this, the pulse emission frequency Fz in case the light source device CNT is a pulse laser is calculated|required by Fz=LBL/(Ts*Xs), and Fz=50 MHz becomes the lowest frequency. Therefore, in the embodiment, a light source device (CNT) that outputs a pulse laser having a frequency of 50 MHz or higher is required. From this, the pulse emission frequency Fz of the light source device CNT is preferably twice or more (for example, 50 MHz) of the highest response frequency Fss (for example, 50 MHz) of the acousto-optical element AOM of the optical deflector 81 . 100 MHz) is good.

In addition, the driving signal for switching the acousto-optical element AOM of the optical deflector 81 to the ON state/OFF state is OFF or OFF while the acousto-optical element AOM transitions from the ON state to the OFF state. It is preferable to control the light source device CNT to synchronize with a clock signal oscillating at the pulse emission frequency Fz so that no pulse emission occurs during the transition from the state to the ON state.

Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse emission frequency Fz of the light source device CNT from the viewpoint of the beam shape (intensity distribution of the two overlapping spot lights SP), Fig. 13 It is explained using the graph of The horizontal axis of FIG. 13 represents the writing position of the spot light SP in the Y direction along the writing line or the X direction along the conveyance direction of the substrate P, or the dimension of the spot light SP, the vertical axis is, The relative intensity value obtained by normalizing the peak intensity of the single spot light SP to 1.0 is shown. In addition, here, the intensity distribution of the single spot light SP is set to J1, and description is made assuming a Gaussian distribution.

In Fig. 13, it is assumed that the intensity distribution J1 of the single spot light SP has a diameter of 3 µm with an intensity equal to 1/e ² of the peak intensity. Intensity distributions J2 to J6 are the integration values obtained on the substrate P when two pulses of such spot light SP are irradiated in a shifted position in the main or sub-scanning direction. The simulation result of the intensity distribution (profile) is shown, and the deviation amount (interval distance) of each position is varied.

In the graph of Fig. 13, intensity distribution J5 shows a case where spot light SP for 2 pulses is shifted by an interval distance equal to 3 μm in diameter, and intensity distribution J4 is for spot light SP for 2 pulses. When the interval distance is 2.25 mu m, the intensity distribution J3 shows the case where the interval distance of the spot light SP for 2 pulses is 1.5 mu m. As is clear from the change in the intensity distributions J3 to J5, in the intensity distribution J5, under the condition that spot lights SP having a diameter of 3 µm are irradiated at intervals of 3 µm, the integrated profile is the center of each of the two spot lights. It becomes the highest hump at the position, and at the position of the midpoint of the two spot lights, only about 0.3 normalized intensity is obtained. On the other hand, in the case of a condition in which spot light SP with a diameter of 3 µm is irradiated at 1.5 µm intervals, the integrated profile is not a conspicuous lump-shaped distribution in the profile, but between the positions of the midpoints of the two spot lights. It is set to be almost flat.

13, the intensity distribution J2 shows the integration profile when the interval distance of the spot light SP for 2 pulses is 0.75 µm, and the intensity distribution J6 indicates the interval distance of the single spot light SP ) shows the integration profile when the intensity distribution J1 is set to 1.78 µm, which is the full width at half maximum (FWHM).

As described above, in the case of the pulse oscillation condition in which two spot lights are irradiated with an interval distance CXs shorter than the diameter Xs of the spot light SP and the same interval, the distribution of two lumps tends to appear remarkably during exposure. It is preferable to set it to the optimal space|interval distance in which intensity|strength nonuniformity (deterioration of drawing precision) does not occur. Like the intensity distribution J3 or J6 of FIG. 13, it is preferable to overlap with the interval distance CXs of about half (for example, 40 to 60%) of the diameter Xs of the single spot light SP. Such an optimal interval distance CXs is, with respect to the main scanning direction, the pulse emission frequency Fz of the light source device CNT, and the scanning speed or scanning time Ts (rotating polygon mirror) of the spot light SP along the drawing line. It can be set by adjusting at least one of (rotation speed of 97), and with respect to the sub-scan direction, the scan frequency Fms (rotation speed of the rotating polygon mirror 97) of the drawing line and the substrate P It can set by adjusting at least one of the movement speeds of the X direction.

For example, when the absolute value of the rotation speed of the rotating polygon mirror 97 (spot light scanning time Ts) cannot be adjusted with high precision, the main The ratio between the interval distance CXs of the spot light SP in the scanning direction and the diameter Xs (dimension) of the spot light can be adjusted to an optimal range.

In this way, when the two spot lights SP are superimposed in the scanning direction, that is, when Xs>CXs, the light source device CNT sets the pulse emission frequency Fz, Fz>LBL/(Ts·Xs) As a relationship, it is set so that the relationship of Fz=LBL/(Ts*CXs) may be satisfied. For example, when the pulse emission frequency Fz of the light source device CNT is 100 MHz, if the rotating polygon mirror 97 is rotated at 10,000 rpm with 10 surfaces, 1/e ² , or half full width ( FWHM), the effective diameter Xs of the spot light is 3 µm, and the pulsed laser beam (spot light) from each writing unit UW1 to UW5 is about half the diameter Xs on each writing line LL1 to LL5. It can be irradiated with CXs spacing of 1.5 μm. Thereby, the uniformity of the exposure amount at the time of pattern drawing improves, and a faithful exposure image (resist image) according to drawing data is obtained even in a fine pattern, and high-definition drawing can be achieved.

In addition, the resolution (response frequency Fss) determined by the optical switching speed of the acousto-optical element (AOM) and the pulse oscillation frequency Fz of the light source device (CNT) which is a pulse laser light source, if h is an arbitrary integer, In terms of position or time, it is necessary to have a relationship of integer multiples, that is, a relationship of Fz=h·Fss. This is in order not to perform ON/OFF by the timing of the optical switching of acousto-optical element AOM while the pulse beam is emitting light from the pulsed light source device CNT in full.

In the exposure apparatus EX of the first embodiment, since a pulsed light source device CNT in which the fiber amplifiers FB1 and FB2 and the wavelength conversion element of the wavelength conversion unit CU2 are combined is used, the ultraviolet wavelength range 400 to 300 nm), pulsed light having such a high oscillation frequency is easily obtained.

In addition, optical switching by an acousto-optical device (AOM) divides the pattern to be drawn into pixel units of, for example, 3 μm × 3 μm, and determines whether or not to irradiate a spot light of a pulsed beam for each pixel unit. It is performed based on the bit string (writing data) indicated by "0" and "1". When the length LBL of the drawing line is 30 mm, the number of pixels in one scan of the spot light becomes 10,000 pixels, and the acoustooptical element AOM switches the bit string corresponding to 10,000 pixels during the scanning time Ts. (response frequency Fss) is provided. On the other hand, the pulse oscillation frequency Fz is set so that the spot lights adjacent to each other in the main scanning direction overlap each other by, for example, about 1/2 of the diameter Xs. From this, in the previous relational expression, Fz=h·Fss, the pulse oscillation frequency Fz and the optical switching response frequency Fss of the acoustooptical element AOM are defined so that the integer h is 2 or more, that is, Fz>Fss. It is good to establish a relationship.

Next, the adjustment method of the drawing apparatus 11 of the exposure apparatus EX is demonstrated. 14 is a flowchart regarding a method of adjusting the exposure apparatus according to the first embodiment. 15 : is explanatory drawing which shows typically the relationship between the reference pattern of a rotating drum, and a drawing line. Fig. 16 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a bright field; The control part 16 rotates the rotating drum DR, as shown in FIG. 15 for the calibration which grasps|ascertains the positional relationship of some drawing unit UW1-UW5. Rotary drum DR may convey the board|substrate P with translucency to such an extent that the writing beam LB can permeate|transmit.

As described above, the reference pattern RMP is integral with the outer peripheral surface of the rotary drum DR. As shown in FIG. 15, among reference|standard patterns RMP, arbitrary reference|standard pattern RMP1 moves according to the movement of the outer peripheral surface of rotary drum DR. For this reason, the reference pattern RMP1 passes through the writing lines LL1, LL3, and LL5, and then passes through the writing lines LL2 and LL4. For example, when the same reference pattern RMP1 passes through the writing lines LL1, LL3, and LL5, the control unit 16 scans the writing beams LB of the writing units UW1, UW3, UW5. And when the same reference pattern RMP1 passes through the writing lines LL2, LL4, the control part 16 scans the writing beam LB of the writing units UW2, UW4 (step S1). For this reason, the reference pattern RMP1 becomes a reference|standard for grasping|ascertaining the positional relationship of the drawing units UW1-UW5.

The photoelectric sensor 31Cs (FIG. 4) of the calibration detection system 31 described above uses the scanning optical system including the f-θ lens system 85 and the syringe 83 as a medium, Detect reflected light. The photoelectric sensor 31Cs is connected to the control part 16, and the control part 16 detects the detection signal of the photoelectric sensor 31Cs (step S2). For example, the writing units UW1 to UW5 scan each of the plurality of writing beams LB in a predetermined scanning direction in a plurality of rows for every writing line LL1 to LL5 .

For example, as shown in FIG. 16, the drawing units UW1 - UW5 direct the drawing beam LB from the drawing start position OC1 to the direction along the rotational center line AX2 of the rotary drum DR described above. In the (Y direction), the first column scan SC1 is performed by the length LBL of the writing line (refer to FIG. 12 ). Next, the writing units UW1 to UW5 direct the writing beam LB from the writing start position OC1 to the direction along the rotation center line AX2 of the rotary drum DR described above (the Y direction) of the writing line. The second column scan SC2 is performed by the length LBL (refer to Fig. 12). Next, the writing units UW1 to UW5 direct the writing beam LB from the writing start position OC1 to the direction along the rotation center line AX2 of the rotary drum DR described above (the Y direction) of the writing line. The third column scan SC3 is performed by the length LBL (refer to Fig. 12).

Since the rotating drum DR rotates around the rotational center line AX2, X on the reference pattern RMP1 of the first column scan SC1, the second column scan SC2, and the third column scan SC3 The position of the direction differs by ΔP1 and ΔP2. Moreover, the control part 16 scans the writing beam LB along 1st-column scanning SC1 in the state which made the rotating drum DR stopped, After that, only ΔP1 minute is the rotating drum DR. ) is rotated and stopped, the scanning of the writing beam LB along the second column scan SC2, the rotating drum DR is rotated again by ΔP2 and stopped, and the writing beam LB along the third column scanning SC3 is stopped. LB) may be a sequence in which each unit is operated in the order of scanning.

As described above, in the reference pattern RMP, the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other formed on the outer peripheral surface of the rotating drum DR are the lengths of the drawing lines described above. It is set smaller than LBL. For this reason, when the writing beam LB of the first column scanning SC1, the second column scanning SC2, and the third column scanning SC3 is projected, the writing beam LB is at least the intersection portion Cr1, Cr2. is investigated in The line patterns RL1 and RL2 are formed as irregularities on the surface of the rotary drum DR. When the amount of steps of the unevenness on the surface of the rotary drum DR is set as a specific condition, the reflected light generated by projecting the writing beam LB onto the line patterns RL1 and RL2 partially causes a difference in the reflection intensity. For example, as shown in Fig. 16 , when the line patterns RL1 and RL2 are concave portions on the surface of the rotary drum DR, the drawing beam LB is projected onto the line patterns RL1 and RL2, the line pattern The reflected light reflected by (RL1, RL2) is received by the photoelectric sensor 31Cs in a bright field.

The control unit 16 detects the edge position pscl of the reference pattern RMP based on the output signal from the photoelectric sensor 31Cs. For example, on the basis of the output signal obtained from the photoelectric sensor 31Cs at the time of the first column scanning SC1, the control unit 16 controls the first column scanning position data Dsc1 and the edge of the reference pattern RMP. The center value (mpscl) of the position (pscl) is stored.

Next, the control unit 16 controls the second column scanning position data Dsc2 and the edge position of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second column scanning SC2. The center value (mpscl) of (pscl) is stored. Then, the control unit 16, based on the output signal obtained from the photoelectric sensor 31Cs during the third column scanning SC3, includes the third column scanning position data Dsc3 and the edge position pscl of the reference pattern RMP. ) of the center value (mpscl).

The control unit 16 includes the scan position data Dsc1 in the first column, the scan position data in the second column Dsc2 and the scan position data in the third column Dsc3, and the edge positions pscl of the plurality of reference patterns RMP. From the center value mpscl of , the coordinate positions of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other are calculated by calculation. As a result, the control unit 16 can also calculate the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1 . Similarly for the other drawing units UW2 to 5, the control unit 16 controls the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5 (FIG. 11). ) can also be calculated. In addition, the center value mpscl demonstrated above may be calculated|required from the peak value of the signal output from the photoelectric sensor 31Cs.

The case where the photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2 in the bright field has been described above. However, the photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2. It is okay to receive light in the dark field. Fig. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. 18 is an explanatory diagram schematically illustrating a signal output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. As shown in FIG. 17 , in the calibration detection system 31 , a light blocking member 31f having an annular light transmitting portion is disposed between the relay lens 94 and the photoelectric sensor 31Cs. For this reason, the photoelectric sensor 31Cs receives edge-scattered light or diffracted light among the reflected light reflected by the line patterns RL1 and RL2. For example, as shown in Fig. 18 , when the line patterns RL1 and RL2 are concave portions on the surface of the rotary drum DR, when the writing beam LB is projected onto the line patterns RL1 and RL2, the photoelectric sensor 31Cs receives the reflected light reflected from the line patterns RL1 and RL2 in the dark field.

The control unit 16 detects the edge position pscdl of the reference pattern RMP based on the signal output from the photoelectric sensor 31Cs. For example, on the basis of the output signal obtained from the photoelectric sensor 31Cs at the time of the first column scanning SC1, the control unit 16 controls the first column scanning position data Dsc1 and the edge of the reference pattern RMP. The center value (mpscdl) of the position (pscdl) is stored. Next, the control unit 16 controls the second column scanning position data Dsc2 and the edge position of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second column scanning SC2. The center value (mpscdl) of (pscdl) is stored. Based on the output signal obtained from the photoelectric sensor 31Cs at the time of the third column scanning SC3, the control unit 16 includes the third column scanning position data Dsc3 and the edge position pscdl of the reference pattern RMP. Memorize the center value (mpscdl) of

The control unit 16 includes the scan position data Dsc1 in the first column, the scan position data in the second column Dsc2 and the scan position data in the third column Dsc3, and the edge positions pscdl of the plurality of reference patterns RMP. From the center value mpscdl of , the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other are obtained by calculation. As a result, the control unit 16 calculates the relationship between the coordinate positions of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1 by calculation.

Similarly for the other drawing units UW2 to 5, the control unit 16 also shows the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5 can be calculated. As described above, when the photoelectric sensor 31Cs receives the reflected light reflected from the line patterns RL1 and RL2 in the dark field, the precision of the edge positions pscdl of the plurality of reference patterns RMP can be increased.

As shown in FIG. 14, the control part 16 calculates|requires the adjustment information (calibration information) corresponding to the arrangement|positioning state of some drawing line LL1-LL5 or a mutual arrangement|positioning error from the detection signal detected in step S2. (Step S3). 19 : is explanatory drawing which shows typically the positional relationship between reference patterns of a rotating drum. 20 is an explanatory diagram schematically illustrating a relative positional relationship between a plurality of drawing lines. As described above, the odd-numbered first writing line LL1, the third writing line LL3, and the fifth writing line LL5 are arranged, and as shown in FIG. 19, the first writing line LL1; The reference distance PL between the intersections Cr1 detected for every 3rd writing line LL3 and 5th writing line LL5 is memorize|stored in advance by the control part 16. As shown in FIG. Similarly, for each of the second writing line LL2 and the fourth writing line LL4 , the control unit 16 also stores the reference distance PL between the detected intersections Cr1 in advance. Moreover, the reference distance ΔPL between the intersections Cr1 detected for each of the second writing line LL2 and the third writing line LL3 is also previously stored by the control unit 16 . Moreover, the control part 16 also previously memorize|stores the reference distance ΔPL between the intersections Cr1 detected for each of the fourth writing line LL4 and the fifth writing line LL5 .

For example, as shown in FIG. 20, the control part 16 sets the writing start position OC1 of the 1st writing line LL1 based on the signal from the origin detector 98 (refer FIG. 7), a position Since the relationship can be grasped|ascertained, the distance BL1 of the intersection part Cr1 and the writing start position OC1 can be calculated|required. Moreover, since the writing start position OC3 of the 3rd writing line LL3 can detect the position with the origin detector 98, the control part 16 is the intersection part Cr1 and the writing start position OC3. The distance BL3 can be found. For this reason, based on the distance BL1, the distance BL3, and the reference distance PL, the control part 16 calculates|requires the positional relationship between the writing start position OC1 and the writing start position OC3, and selects the writing lines LL1 and LL3. Therefore, the distance ΔOC13 between the origins of the scanning writing beams LB can be stored. Similarly, since the control part 16 can detect the position of the writing start position OC5 of the 5th writing line LL5 by the origin detector 98, the intersection part Cr1 and the writing start position OC5 are The distance BL5 can be found. For this reason, based on the distance BL3, the distance BL5, and the reference distance PL, the control part 16 calculates|requires the positional relationship between the writing start position OC3 and the writing start position OC5, and selects the writing lines LL3 and LL5. Therefore, the distance ΔOC35 between the origins of the scanning writing beams LB can be stored.

Since the control part 16 can detect the position of the writing start position OC2 of the 2nd writing line LL2 by the origin detector 98, the distance BL2 of the intersection part Cr1 and the writing start position OC2. can be obtained Moreover, since the writing start position OC4 of the 4th writing line LL4 can detect the position with the origin detector 98, the control part 16 is the intersection part Cr1 and the writing start position OC4. The distance BL4 can be found. For this reason, based on the distance BL2, the distance BL4, and the reference distance PL, the control part 16 calculates|requires the positional relationship between the writing start position OC2 and the writing start position OC4, and selects the writing lines LL2 and LL4. Accordingly, the distance ΔOC24 between the origins of the scanning writing beams LB can be stored.

In addition, since the writing start position OC1 and the writing start position OC2 are positions obtained through the same reference pattern RMP1 as described above, the control unit 16 easily connects the writing lines LL1 and LL2. Therefore, the distance ΔOC12 between the origins between the origins of the scanning writing beams LB can be stored. As explained above, exposure apparatus EX can calculate|require the mutual positional relationship of each origin (drawing start point) of some drawing unit UW1-UW5.

In addition, the control unit 16 determines the writing start position OC2 and the writing start position ( OC3) can detect an error that follows each other. Furthermore, from the reference distance ΔPL between the intersection portion Cr1 detected by the fourth writing line LL4 and the fifth writing line LL5, the writing start position OC4 and the writing start position OC5 are connected to each other. error can be detected.

The two intersections Cr1 and Cr2 are detected between the writing start positions OC1 to OC5 and the writing end positions EC1 to EC5 of each of the writing lines LL1 to LL5. Thereby, the scanning direction from the drawing start positions OC1 to OC5 to the drawing end positions EC1 to EC5 can be detected. As a result, the control unit 16 can detect an angular error with respect to the direction (Y direction) in which each of the drawing lines LL1 to LL5 follow the center line AX2 .

The control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other with respect to the reference pattern RMP1 described above. The reference pattern RMP including the reference pattern RMP1 is a mesh-shaped reference pattern prepared by repeating engraving at a constant pitch (period) Pf1 and Pf2. For this reason, with respect to the reference pattern RMP which the control part 16 repeats at each pitch Pf1, Pf2, adjustment information (calibration information) corresponding to the arrangement|positioning state of the some writing line LL1-LL5 or a mutual arrangement|positioning error. , and information about the deviation of the relative positional relationship of the plurality of writing lines LL1 to LL5 is calculated. As a result, the control unit 16 can further increase the precision of the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error.

Next, as shown in FIG. 14, the control part 16 performs the process of adjusting a drawing state (step S4). The control unit 16 includes adjustment information (calibration information) corresponding to the arrangement state of a plurality of drawing lines LL1 to LL5 or a mutual arrangement error, and a scale unit (rotating drum (rotating drum) DR)) (GPa, GPb) adjusts the drawing positions by the odd-numbered and even-numbered drawing units UW1 to UW5 on the basis of the rotational angle positions. Encoder heads EN1, EN2 can detect the conveyance amount of the board|substrate P based on scale part (rotating drum DR) GPa, GPb demonstrated above.

Fig. 21 is an explanatory diagram schematically showing the relationship between the moving distance per unit time of the substrate and the number of drawing lines included in the moving distance, similarly to Fig. 12 above. As shown in FIG. 21 , the encoder heads EN1 and EN2 can detect and store the movement distance ΔX of the substrate P per unit time. Moreover, you may make it memorize|store after detecting several alignment mark Ks1 - Ks3 sequentially by alignment microscope AM1, AM2 demonstrated above, and calculating|requiring movement distance (DELTA)X.

At the movement distance ΔX per unit time of the substrate P, the plurality of writing lines LL1 by the writing unit UW1 are drawn by the beam lines SPL1, SPL2 and SPL3 of the beam spot light SP, respectively, The beam of the spot light SP is scanned so as to overlap in the X-direction (and the Y-direction) at about 1/2 of the spot diameter Xs. Similarly, the beam spot light SP on the writing terminal PTb side of the writing line LL1 and the beam spot light SP on the writing end PTb side of the writing line LL2 are long of the substrate P. According to the movement in the direction, they are connected to each other by an overlapping distance CXs in the width direction of the substrate P.

For example, when the rotary drum DR moves up and down, a shift occurs in the writing positions in the X direction by the odd-numbered and even-numbered writing units UW1 to UW5, for example, the possibility that the magnification in the X direction will shift. There is this. When the control part 16 slows down the conveyance speed (moving speed) of the board|substrate P conveyed by the rotating drum DR, the space|interval distance CXs of the X direction of beam line SPL1, SPL2, and SPL3 becomes small, X It can adjust so that the drawing magnification of a direction may be made small. Conversely, if the conveyance speed (moving speed) of the board|substrate P conveyed by the rotary drum DR is made fast, the space|interval distance CXs of the X direction of beamline SPL1, SPL2, and SPL3 will become large, and the writing magnification of X direction will become large. can be adjusted to make it larger. As mentioned above, although the drawing line LL1 was demonstrated with reference to FIG. 21, it is the same also about other drawing line LL2 - LL5. The control part 16 is a scale part (rotating drum DR) by adjustment information (calibration information) corresponding to the arrangement state of a plurality of drawing lines LL1 to LL5 or a mutual arrangement error and encoder heads EN1 and EN2. ) (GPa, GPb) based on the detected rotational angle position, the movement distance ΔX per unit time of the substrate P in the long direction of the substrate P, and the beam lines SPL1, SPL2 included within the movement distance and the number of SPL3) can be changed. For this reason, the control part 16 can adjust the drawing position of the X direction by odd-numbered and even-numbered drawing units UW1-UW5.

22 is an explanatory diagram schematically illustrating pulsed light emitted in synchronization with the system clock of the pulsed light source. Hereinafter, although the drawing line LL2 is demonstrated also with reference to FIG. 21, the same applies to the drawing lines LL1 and LL3 to LL5. The light source device CNT may generate the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval ?wp (=1/Fz) of the pulse signal wp is changed. The temporal pulse interval ?wp corresponds to the interval distance CXs in the main scanning direction of the spot light SP for each pulse on the writing line LL2. The control unit 16 scans the beam spot light SP of the writing beam LB along the writing line LL2 on the substrate P by the length LBL of the writing line.

While the writing beam LB is scanning along the writing line LL2, the control unit 16 partially changes the period of the system clock SQ to set the pulse interval ?wp to any of the writing lines LL2. It has a function to increase or decrease the position. For example, when the original system clock SQ is 100 mHz, the control unit 16 partially adjusts the system clock SQ at regular time intervals (periods) while scanning by the length LBL of the drawing line, for example, 101mHz (or 99mHz). As a result, the number of beam spot lights SP in the length LBL of the writing line increases or decreases. In other words, the control unit 16 partially increases/decreases the duty of the system clock SQ at periodic intervals of a predetermined number of times (one or more) while scanning by the length LBL of the drawing line. Accordingly, the interval between the beam spot lights SP generated by the light source CNT is changed by the change in the pulse interval Δwp, and the overlapping distance CXs between the beam spot lights SP changes. And the distance between the writing start end PTa and the writing end PTb in the Y direction expands and contracts outwardly.

As an example, when the length LBL of the writing line is 30 mm, it is divided into 11 equal parts, and the pulse interval Δwp of the system clock SQ is increased or decreased by one place for every writing length (period interval) of about 3 mm. The increase/decrease amount of the pulse interval Δwp is a range that does not cause significant deterioration of the integration profile (intensity distribution) according to the change in the interval distance CXs of two spot lights SP adjacent to each other, as described in FIG. 13, for example. For example, if the standard interval distance CSx is 50% of the spot light diameter Xs (3 mu m), it is set to about ±15%. If the increase/decrease in the pulse interval Δwp is +10% (the interval distance CSx is 60% of the diameter Xs of the spot light), at each of 10 discrete points in the drawing line of length LBL, the spot light for 1 pulse is 10% of the diameter Xs The position is shifted so as to extend in the main scanning direction by minutes. As a result, the length LBL of the writing line after writing is extended by 3 micrometers with respect to 30 mm. This means that the pattern drawn on the substrate P is expanded by 0.01% (100 ppm) in the Y direction. Thereby, even when the board|substrate P expands and contracts in the Y direction, a drawing pattern can be expanded and contracted in a Y direction corresponding to it, and exposure can be carried out.

The position at which the pulse interval Δwp is increased or decreased is set for, for example, every scan of the drawing lines LL1 to LL5, for example, every 100 pulses of the system clock SQ, every 200 pulses, ... It has a configuration that can be pre-set to any value as shown. In this way, the amount of expansion and contraction in the main scanning direction (Y direction) of the drawing pattern can be changed within a relatively large range, and magnification correction can be attempted dynamically in response to the expansion and contraction or deformation of the substrate P. there is. Accordingly, the control unit 16 of the exposure apparatus EX of the present embodiment includes a system clock SQ generating circuit, which generates a raw clock signal with a constant pulse interval Δwp to the system clock ( When the clock oscillator generated as SQ) and the number of clock pulses of the system clock SQ are counted as much as a preset value, the time until the next one clock pulse of the system clock SQ occurs is equal to the previous pulse It has a time shift part which increases or decreases with respect to the interval ?wp. In addition, the number of parts for increasing/decreasing the pulse interval Δwp of the system clock SQ among the writing lines (length LBL) is largely determined by the Y-direction magnification correction ratio (ppm) of the pattern to be drawn, but the most In a small case, at least one location during the scanning time Ts of the spot light SP corresponding to the length LBL may be sufficient.

Fig. 23 shows an example of a clock generation circuit that partially makes the pulse interval ?wp of the system clock SQ variable. In FIG. 23 , the basic clock signal CKL having the same frequency as the system clock SQ is output from the clock oscillator 200 . The basic clock signal CKL includes a delay circuit 202 that generates the system clock SQ by adding a predetermined delay time Td to each pulse of the basic clock signal CKL, and the basic clock signal CKL ) is applied to the multiplier circuit 204 that outputs the multiplied clock signal CKs multiplied by, for example, 20 times.

The delay circuit 202 has therein a counter for counting the number of pulses of the multiplied clock signal CKs up to a predetermined value ?Ns. The time during which the counter counts the predetermined value ?Ns corresponds to the delay time Td. The predetermined value ΔNs is set by a preset circuit 206 . The preset circuit 206 has internally a standard value Ns ₀ serving as an initial value of the predetermined value ΔNs, and a change in the preset value Dsb (delay time Td) from the outside (main CPU, etc.) When the value corresponding to ?Td) is sent, the new predetermined value ?Ns is updated with the previous predetermined value (?Ns+Dsb).

The update is performed in response to the completion pulse signal b from the counter circuit 208 which counts the pulses of the system clock SQ output from the delay circuit 202 . When the counter circuit 208 counts the number of pulses of the system clock SQ up to the preset value Dsa and outputs the completion pulse signal b, the counter circuit 208 resets the counting value to zero and again pulses the system clock SQ. A configuration for repeating counting the number is provided. The preset value Dsa is the number of spot light pulses Nck corresponding to one length (LBL/N) when the length (LBL) of the drawing line is divided into N equal parts, but it always corresponds to the length (LBL/N) It doesn't have to be, and any value is fine. Moreover, the time shift part is comprised by the delay circuit 202, the preset circuit 206, and the counter circuit 208 mentioned above.

Fig. 24 is a timing chart showing time transitions of signals of respective parts in the circuit configuration of Fig. 23; It is assumed that a standard value Ns ₀ serving as an initial value is set in the preset circuit 206 , and a predetermined value ΔNs applied to the delay circuit 202 is set as the standard value Ns ₀ . In the state before the counter circuit 208 counts up to the set number of pulses Nck, that is, before the completion pulse signal b is generated, the predetermined value ΔNs from the preset circuit 206 is Ns ₀ , and the delay circuit 24, 202 counts the number of pulses of the multiplication clock signal CKs from the start of each pulse of the basic clock signal CKL up to a predetermined value ΔNs, and upon completion of the counting, the system clock SQ ) as one pulse wp. Therefore, the delay time Td ₁ from the start of the pulse of the basic clock signal CKL to the start of the corresponding pulse wp of the system clock SQ is equal to the predetermined value ( It corresponds to the counting time by ΔNs) minutes.

In FIG. 24 , the counter circuit 208 sets the preset value Dsa by the pulse wp of the system clock SQ generated after the delay time Td ₁ in response to the pulse CK _n of the basic clock signal CKL. ) (the number of pulses Nck) is counted up, the counter circuit 208 outputs a completion pulse signal b, and in response thereto, the preset circuit 206 sets a new predetermined value ( ΔNs) is updated to [previous predetermined value (ΔNs+Dsb)]. The preset value Dsb is a numerical value corresponding to the change amount ΔTd of the pulse interval Δwp shown in FIG. 22, and is set as a negative value in FIG. 24, but is the same even if it is a positive value. Therefore, before the pulse CK _n+1 of the pulse CK _n of the basic clock signal CKL is generated, the delay circuit 202 has a delay time Td ₁ set to the standard value Ns ₀ , ΔTd A predetermined value ΔNs corresponding to the short delay time Td ₂ is set.

Accordingly, the pulse interval Δwp' between the pulse wp' of the system clock SQ generated in response to the pulse CK _n+1 of the basic clock signal CKL and the pulse wp immediately preceding it is It becomes shorter than the pulse interval ?wp. After the pulse wp' is generated, the completion pulse signal b is not generated until the counter circuit 208 counts the system clock SQ equal to the number of pulses Nck, so the delay circuit The predetermined value ΔNs set at 202 is the same as the value corresponding to the delay time Td ₂ , and until the next completion pulse signal b occurs, the system clock SQ is the basic clock signal CKL It is output in a state delayed by a uniform delay time (Td ₂ ) with respect to . Therefore, the ratio β between the pulse interval Δwp determined by the frequency Fz of the basic clock signal CKL and the pulse interval Δwp′ corrected by the time shift is,

β=Δwp'/Δwp=1±(ΔTd/wp) [However, ΔTd<Δwp]

, and the dimension in the width direction of the pattern drawn along the drawing line is larger than the design value specified in the drawing data when β > 1, and smaller than the design value when β < 1 (in the case of FIG. 24).

In the circuit configuration of Fig. 23 described above, changing the pulse interval Δwp of one pulse wp of the system clock SQ generated immediately after the generation of the completion pulse signal b is changed by the time ΔTd of the system clock SQ It is repeatedly executed for every count equal to the number of pulses (Nck). In addition, in the case of the circuit configuration of Fig. 23, when the standard value Ns ₀ stored inside the preset circuit 206 is 20 and the preset value Dsb set from the outside is zero, the completion pulse signal b ), the predetermined value ?Ns remains at 20 (a state in which the writing magnification correction in the Y direction is not performed). Also, since the frequency of the multiplication clock signal CKs is 20 times the frequency of the basic clock signal CKL, when the predetermined value ΔNs is set to 20, the preset value Dsb is set to +1 (or -1). When set, the predetermined value ?Ns is 20, 21, 22, ... every time the completion pulse signal b is generated. (or 20, 19, 18, ...) is updated to increase (or decrease). Furthermore, since one pulse of the multiplication clock signal CKs is equivalent to 1/20 (5%) of the standard pulse interval Δwp (pulse interval distance CXs), if the preset value Dsb is changed by ±1, 2 The degree of overlap of consecutive spot lights can be changed in increments of 5%.

As described above, the pulse beam output from the light source device CNT of the pulse laser in response to the system clock SQ of which the pulse interval Δwp is partially increased or decreased in this way is common to each of the writing units UW1 to UW5. Therefore, the pattern drawn on each of the drawing lines LL1 to LL5 is expanded and contracted at the same rate in the Y direction. Therefore, as described with reference to Fig. 12 (or Fig. 11), in order to maintain the splicing precision between the drawing lines adjacent to each other in the Y direction, the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 respectively. The writing timing is corrected so that (or the writing end positions EC1 to EC5) shift in the Y direction.

An example of a circuit configuration for partially varying the pulse interval Δwp of the system clock SQ is analogously variable in addition to the method of digitally varying the delay times Td ₁ , Td ₂ as shown in FIGS. 23 and 24 . Any configuration is fine. In addition, each time the counter circuit 208 counts the system clock SQ up to the preset value Dsb (the number of pulses Nck), one pulse interval Δwp' corrected for the standard pulse interval Δwp, For example, it is good also as a structure which increases and decreases only by the slight value of 1%. In that case, during one scan of the spot light along the length LBL of the drawing line, the number of points where the standard pulse interval ?wp is corrected by the pulse interval ?wp' may be changed according to the required magnification correction amount. For example, if the number of correction points is 100, the dimension in the Y direction of the pattern drawn by one scan of the spot light increases or decreases by the pulse interval ?wp.

In addition, the ON/OFF switching of the optical deflector (AOM) 81 shown in Fig. 4 is performed in response to a serial bit string (a string of bit values "0" or "1") transmitted as writing data. , the bit value may be transmitted in synchronization with the pulse signal wp (FIG. 24) of the system clock SQ whose pulse interval ?wp is partially increased or decreased. Specifically, between the generation of one pulse signal wp and the generation of the next pulse signal wp, one bit value is transmitted to the drive circuit of the optical deflector (AOM) 81, and the bit When the value is "1", for example, and the previous bit value was "0", the optical deflector (AOM) 81 may be switched from the OFF state to the ON state.

By the way, the control part 16 is the displacement meter which can detect the shake of the both ends of the adjustment information (calibration information) and rotary drum DR corresponding to the arrangement|positioning state of some drawing line LL1-LL5 or mutual arrangement error. Based on the detected information of (YN1, YN2, YN3, YN4), odd-numbered and even-numbered writing units UW1 to UW5 The writing position in the Y direction can be adjusted. Moreover, the control part 16 is the displacement meter which can detect the shake of the both ends of the adjustment information (calibration information) and rotary drum DR corresponding to the arrangement|positioning state of some drawing line LL1-LL5 or mutual arrangement error. Based on the detected information of (YN1, YN2, YN3, YN4), odd-numbered and even-numbered writing units UW1 to UW5 The length in the Y direction (length LBL of the drawing line) can be changed by

Moreover, the control part 16 is based on the adjustment information (calibration information) corresponding to the arrangement|positioning state of several drawing lines LL1-LL5 or mutual arrangement|positioning error, and the information detected by alignment microscope AM1, AM2. , the writing position in the X direction or the Y direction by the odd-numbered and even-numbered writing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction of the substrate P.

As described above, the exposure apparatus EX of the first embodiment includes a plurality of writing lines LB formed on the substrate P by the writing beams LB from each of the plurality of writing units UW1 to UW5. A shift correction mechanism for shifting and moving the second optical platen 25 with respect to the first optical platen 23 in the writing plane, centering on the rotation axis I, which is a predetermined point in the writing screen including LL1 to LL5 and a moving mechanism 24 as a According to the arrangement state of the plurality of drawing lines LL1 to LL5 or adjustment information (calibration information) corresponding to the mutual arrangement error, the entirety of the plurality of drawing lines LL1 to LL5 is at least one of the X direction and the Y direction. When there is an error with respect to , the control unit 16 controls the driving unit of the moving mechanism 24 so as to be a shift amount to cancel the error, and moves the second optical platen 25 in the X direction and the Y direction. It can be shifted in at least one direction.

When the second optical surface plate 25 is shifted in at least one of the X-direction and the Y-direction, the fourth reflection mirror 59 shown in Fig. 6 is displaced in the X-direction or the Y-direction by the shift amount. In particular, the displacement of the fourth reflection mirror 59 in the Y direction shifts it in the Z direction when the writing beam LB coming from the third reflection mirror 58 is reflected in the +Y direction. Therefore, the shift movement in the Z direction is corrected by the beam shifter mechanism 44 in the first optical system 41 . Thereby, with respect to the 2nd optical system 42 and the 3rd optical system 43 after the 4th reflection mirror 59, the beam LB is maintained so that it may pass through the correct optical path.

Moreover, in the exposure apparatus EX of 1st Embodiment, by the adjustment information (calibration information) corresponding to the arrangement|positioning state of several drawing line LL1-LL5 or mutual arrangement error, some drawing line LL1-LL1- When LL5 has an error in at least one of the X direction and the Y direction, the control unit 16 performs drive control on the beam shifter mechanism 44 so as to be a shift amount that cancels the error, so that the substrate P ), the drawing lines LL1 to LL5 formed on it can be slightly shifted in the X direction or the Y direction.

Moreover, in the exposure apparatus EX of 1st Embodiment, by the adjustment information (calibration information) corresponding to the arrangement|positioning state of several drawing line LL1-LL5 or mutual arrangement|positioning error, some drawing line LL1-LL1 - When the odd-numbered or even-numbered drawing line among LL5) has an error in at least one of the X-direction and the Y-direction, the control unit 16 controls the beam shifter mechanism 45 so that a shift amount to cancel the error becomes a shift amount. driving control is performed, the even-numbered writing lines LL2 and LL4 formed on the substrate P are slightly shifted in the X-direction or the Y-direction, and the odd-numbered writing lines formed on the substrate P are The relative positional relationship with LL1, LL3, LL5) can be finely adjusted.

Moreover, adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or a mutual arrangement error and displacement meters YN1, YN2, YN3, YN4 or alignment microscopes AM1 and AM2 are detected. Based on the obtained information, the control unit 16 may adjust the Y magnification of the drawing units UW1 to UW5. For example, the image height of the telecentric f-θ lens included in the f-θ lens system 85 is proportional to the incident angle. For this reason, when adjusting only the Y magnification of the drawing unit UW1, the control part 16 uses adjustment information (calibration information) and displacement meters YN1, YN2, YN3, YN4 or alignment microscope AM1, AM2. Based on the detected information, the Y magnification can be adjusted by individually adjusting the focal length f of the f-θ lens system 85 . Such an adjustment mechanism includes, for example, any one of a bending plate for magnification correction, a magnification correction mechanism for a telecentric f-θ lens, and a halving (slanted parallel plate glass) for shift adjustment. You may combine the above. In addition, by slightly varying the rotation speed of the rotation polygon mirror 97 rotating at a constant rotation speed, the interval distance CXs of each spot light SP (pulse light) drawn in synchronization with the system clock SQ is slightly changed ( It is possible to slightly shift the overlapping amount of neighboring spot lights), and as a result, it is also possible to adjust the Y magnification.

As described above, the exposure apparatus EX of the first embodiment includes a plurality of writing lines LB formed on the substrate P by the writing beams LB from each of the plurality of writing units UW1 to UW5. Movement as a rotation mechanism for rotating the second optical platen 25 with respect to the first optical platen 23 in the writing plane, centering on the rotation axis I, which is a predetermined point in the writing screen including LL1 to LL5 instrument 24 . When the plurality of drawing lines LL1 to LL5 have an angular error with respect to the Y direction due to the arrangement state of the plurality of drawing lines LL1 to LL5 or adjustment information (calibration information) corresponding to the mutual arrangement error, The control part 16 can perform drive control with respect to the drive part of the movement mechanism 24, and can rotate the 2nd optical surface plate 25 so that it may become the rotation amount which cancels out an angle error.

In addition, when it is necessary to individually perform rotation correction of each of the drawing units UW1 to UW5, the f-θ lens system 85 and the second cylindrical lens 86 shown in Fig. 8 are arranged around the optical axis AXf. It is possible to slightly rotate (incline) each drawing line LL1 - LL5 individually on the board|substrate P by making small amount rotation. Since the beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the bus line of the cylindrical lens 86 in the non-scan direction, the cylindrical lens 86 It becomes possible to rotate (incline) each of the writing lines LL1 to LL5 by rotation about the two optical axes AXf.

The exposure apparatus EX of 1st Embodiment should just process at least 1 of the process of adjustment of the drawing position by the control apparatus of step S4 demonstrated above. Moreover, the exposure apparatus EX of 1st Embodiment may combine processing of the adjustment of the drawing position by the control apparatus of step S4 demonstrated above, and may process it.

By the method of adjusting the substrate processing apparatus described above, in the exposure apparatus EX of the first embodiment, the joint error between the patterns PT1 to PT5 adjacent to the width direction (Y direction) of the substrate P is suppressed. Trial exposures are unnecessary, or the number of exposures is drastically reduced. For this reason, the exposure apparatus EX of 1st Embodiment can shorten the calibration work which took time, such as a trial exposure, drying and developing process, and confirmation work of an exposure result. And exposure apparatus EX of 1st Embodiment can suppress waste of the board|substrate P for the number of times fed back by trial exposure. Exposure apparatus EX of 1st Embodiment can acquire the adjustment information (calibration information) corresponding to the arrangement|positioning state of some drawing line LL1 - LL5, or a mutual arrangement error early. Exposure apparatus EX of 1st Embodiment correct|amends in advance based on the arrangement|positioning state of some drawing line LL1-LL5, or adjustment information (calibration information) corresponding to a mutual arrangement error, X, It is possible to easily correct each component such as shift, rotation, and magnification in the direction or the Y direction. And the exposure apparatus EX of 1st Embodiment can raise the precision which overlaps and exposes on the board|substrate P.

In the exposure apparatus EX of the first embodiment, an example has been described in which the light deflector 81 includes an acoustooptical element and spot-scans the drawing beam LB by the rotating polygon mirror 97, In addition to spot scanning, a method in which a pattern is drawn using a DMD (Digital 　 Micro mirror Device) or SLM (Spatial 　 light modulator: spatial light modulator) may be used.

[Second embodiment]

Next, the exposure apparatus EX of 2nd Embodiment is demonstrated. In addition, in 2nd Embodiment, in order to avoid description overlapping with 1st Embodiment, only the part different from 1st Embodiment is demonstrated, and about the same component as 1st Embodiment, it is the same as 1st Embodiment. It will be explained with reference numerals.

In the exposure apparatus EX of the second embodiment, the photoelectric sensor 31Cs of the calibration detection system 31 is not the reference pattern (which can also be used as a reference mark) RMP, but an alignment mark on the substrate P The reflected light (scattered light) of (Ks1 to Ks3) is detected. Alignment mark Ks1-Ks3 is arrange|positioned at the position on the board|substrate P of the Y direction which passes any one of each drawing line LL1-LL5 of some drawing unit UW1-UW5. When the spot light SP of the writing beam LB scans the alignment marks Ks1 to Ks3, the scattered light reflected by the alignment marks Ks1 to Ks3 is received by the photoelectric sensor 31Cs in a bright field or a dark field.

The control part 16 detects the edge position of alignment mark Ks1 - Ks3 based on the signal output from the photoelectric sensor 31Cs. And similarly to the first embodiment, the control unit 16 receives, from the detection signal detected by the photoelectric sensor 31Cs, adjustment information ( calibration information).

Moreover, based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other, and the information detected by the alignment microscopes AM1 and AM2, the control unit 16 , the writing position in the X direction or the Y direction by the odd-numbered and even-numbered writing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction of the substrate P. When the spot light SP of the writing beam LB is projected on the alignment marks Ks1 to Ks3, the photosensitive layer on the alignment marks Ks1 to Ks3 is photosensitive, and the alignment marks Ks1 to Ks3 are distorted in a subsequent process there is a possibility that It is preferable that the alignment marks Ks1 - Ks3 are provided in multiple rows, and the alignment microscopes AM1 and AM2 read the alignment marks Ks1 - Ks3 which were not deformed by exposure.

For this reason, the exposure apparatus EX of 2nd Embodiment scans the vicinity of alignment marks Ks1 - Ks3 which may be distorted by exposure with the spot light SP of the writing beam LB, Data for turning on/off the optical deflector (AOM) 81 is included in the data for pattern writing so that spot light SP is not irradiated near the alignment marks Ks1 to Ks3 that do not want to be distorted by it is possible Thereby, while exposing with the writing beam LB, calibration information can be acquired substantially in real time, and alignment marks Ks1 - Ks3 (position of the board|substrate P) can also be read.

The exposure apparatus EX of 2nd Embodiment is similar to the exposure apparatus EX of 1st Embodiment, the trial exposure for suppressing a noise error is unnecessary, or the frequency|count is reduced drastically. In addition to this, in the exposure apparatus EX of the second embodiment, error information such as the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement relationship is measured and corresponding to the pattern exposure to the substrate P adjustment information (calibration information) to be performed can be acquired early (almost real-time). Therefore, in the exposure apparatus EX of the second embodiment, on the basis of the error information or adjustment information (calibration information) measured at an early stage, while exposing the device pattern, correction and adjustment for maintaining a predetermined precision are sequentially performed. It is possible to easily suppress a decrease in the joint accuracy between the drawing units in consideration of each error component such as a shift error in the X or Y direction, a rotation error, and a magnification error, which was a problem in the multi-drawing head method. . Thereby, the exposure apparatus EX of 2nd Embodiment can maintain the overlapping precision at the time of mutually overlapping and exposing on the board|substrate P in a high state.

<Device manufacturing method>

Next, with reference to FIG. 25, the device manufacturing method is demonstrated. 25 is a flowchart showing a device manufacturing method according to each embodiment.

In the device manufacturing method shown in Fig. 25, first, for example, a function/performance design of a display panel using a self-luminous element such as organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Moreover, the supply roll on which the flexible board|substrate P (resin film, metal thin film, plastic, etc.) used as a base material of a display panel was wound is prepared (step S202). In addition, the roll-shaped board|substrate P prepared in this step S202 has the surface modified as needed, the thing which preformed the base layer (for example, micro unevenness|corrugation by imprint method), A photosensitive functional film or a transparent film (insulating material) laminated in advance may be used.

Next, to form a back plane layer composed of electrodes or wiring, an insulating film, TFT (thin film semiconductor), etc. constituting the display panel device on the substrate P, and to be laminated on the back plane, A light-emitting layer (display pixel portion) of a self-luminous element such as organic EL is formed (step S203). In this step S203, the exposure apparatus EX described in each of the previous embodiments is used, and a conventional photolithography process of exposing and developing a photoresist layer, a substrate coated with a photosensitive silane coupling material instead of the photoresist (P) is pattern-exposed to modify the surface to be hydrophilic to form a pattern, the photosensitive catalyst layer is pattern-exposed to give selective plating reducibility, and the metal film is patterned ( Wiring, electrodes, etc.) or a process by a printing process diagram of drawing a pattern with a conductive ink containing silver nanoparticles or the like is also included.

Next, for each display panel device continuously manufactured on a long substrate P by a roll method, the substrate P is diced, or a protective film (environment resistant barrier layer) is applied to the surface of each display panel device. )) or a color filter sheet, or the like, to assemble the device (step S204). Next, an inspection step is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S205). As described above, a display panel (flexible display) can be manufactured. In addition, the electronic device created on a flexible long sheet board is not limited to a display panel, A flexible ship as a harness (wire bundle) for connection between various electronic components mounted on automobiles, electric trains, etc. Envy is good

DESCRIPTION OF SYMBOLS 1: Device manufacturing system 11: Drawing apparatus
12: board|substrate conveyance mechanism 13: apparatus frame
14: rotation position detection mechanism 16: control unit
23: first optical platen 24: moving mechanism
25: second optical plate 31: calibration detection system
31Cs: photoelectric sensor 31f: light blocking member
73: fourth beam splitter 81: optical deflector
83 syringe 96 reflective mirror
97: rotation polygon mirror 97a: rotation axis
97b: reflective surface 98: origin detector
AM1, AM2: alignment microscope DR: rotating drum
EN1, EN2, EN3, EN4: Encoder head EX: Exposure device
I: rotation shaft LL1 to LL5: drawing line
PBS: Polarizing beam splitter UW1 to UW5: Writing unit

Claims (13)

A pattern drawing apparatus for drawing a pattern on a flexible substrate based on drawing data, comprising:
A writing unit comprising a scanner for scanning a beam modulated according to the writing data in a main scanning direction on the substrate, and an origin detector for generating an origin signal indicating a timing at which the scanner starts scanning the beam; ,
a conveying mechanism having a reference pattern formed on at least a portion of a surface supporting the substrate and moving the substrate in a sub-scan direction orthogonal to the main scanning direction;
a calibration detection system that receives reflected light generated when the beam scans the surface of the conveying mechanism or the surface of the substrate, and outputs a detection signal whose intensity changes according to the reference pattern or a mark formed on the substrate; ,
the drawing unit, based on a relationship between a scanning start position of the beam determined based on the origin signal from the origin detector and a scanning position of the beam determined based on the detection signal from the calibration detection system; A pattern writing apparatus provided with a control unit for adjusting a writing position of the pattern by The method according to claim 1,
a beam shifter mechanism provided in an optical path before the beam is incident on the scanner and shifting a drawing line by the beam scanned on the substrate in the main scanning direction or the sub-scan direction;
The said control part drives and controls the said beam shifter mechanism, The pattern writing apparatus which adjusts the said writing position. 3. The method according to claim 2,
and the beam shifter mechanism is a pattern writing apparatus comprising a parallel flat plate that can be inclined around an axis perpendicular to the traveling axis of the beam. 4. The method according to claim 3,
The conveying mechanism is
and a rotating drum having a cylindrical outer peripheral surface having a predetermined radius from a center line set parallel to the main scanning direction, and supporting the substrate by the outer peripheral surface. 5. The method according to any one of claims 1 to 4,
The syringe is
a rotating polygonal mirror to deflect the beam;
and an f-θ lens system that scans the beam in the main scanning direction by projecting the beam deflected from the rotating polygonal mirror in a telecentric state on the substrate,
and the calibration detection system is arranged to receive the reflected light through the f-θ lens system and the rotating polygonal mirror. 6. The method of claim 5,
The drawing unit is
a first cylindrical lens provided in an optical path of the beam toward the rotating polygon mirror, and a second cylindrical lens provided in an optical path of the beam between the f-θ lens system and the substrate;
and the calibration detection system is arranged to receive the reflected light through the second cylindrical lens, the f-θ lens system, the rotating polygonal mirror, and the first cylindrical lens in this order. 7. The method of claim 6,
The calibration detection system,
a polarization beam splitter that separates the beam directed to the first cylindrical lens and the reflected light returning through the first cylindrical lens by polarization;
and a photoelectric sensor for photoelectrically detecting the reflected light returned through the polarization beam splitter in a bright field or a dark field. A pattern writing method for writing a pattern on a flexible substrate based on writing data, comprising:
scanning a beam intensity-modulated according to the writing data in a main scanning direction on the substrate by rotation of the rotating polyhedron of a writing unit including a rotating polyhedron and an f-θ lens system;
moving the substrate in a sub-scan direction orthogonal to the main-scan direction by a transfer mechanism in which a reference pattern is formed on at least a part of a surface supporting the substrate;
obtaining, from an origin detector that detects the angular position of each reflective surface of the rotating polygonal mirror, an origin signal indicating a timing for starting scanning of the beam;
By a calibration detection system that receives reflected light generated when the beam scans the surface of the conveying mechanism or the surface of the substrate through the f-θ lens system and the rotating polygonal mirror, obtaining a detection signal;
A step of adjusting a drawing position of the pattern by the drawing unit based on a relationship between a scanning start position of the beam determined based on the origin signal and a scanning position of the beam determined based on the detection signal A pattern writing method comprising a. 9. The method of claim 8,
A beam shifter mechanism is provided in the optical path before the beam is incident on the rotating polygon mirror and finely shifts a drawing line by the beam scanned on the substrate in the main scanning direction or the sub-scan direction;
In the step of adjusting, the pattern writing method of controlling the driving of the beam shifter mechanism to adjust the writing position. 10. The method of claim 9,
The beam shifter mechanism is composed of a parallel flat plate that can be inclined around an axis perpendicular to the traveling axis of the beam,
In the step of adjusting, the inclination angle of the parallel flat plate is adjusted. 10. The method of claim 9,
The conveying mechanism is
and a rotating drum having a cylindrical outer circumferential surface having a predetermined radius from a center line set parallel to the main scanning direction, and supporting the substrate by the outer circumferential surface. 12. The method according to any one of claims 8 to 11,
The drawing unit is
a first cylindrical lens provided in an optical path of the beam toward the rotating polygon mirror, and a second cylindrical lens provided in an optical path of the beam between the f-θ lens system and the substrate;
wherein the calibration detection system receives the reflected light through the second cylindrical lens, the f-θ lens system, the rotating polygonal mirror, and the first cylindrical lens in this order. 13. The method of claim 12,
The calibration detection system,
A polarization beam splitter that separates the beam directed to the first cylindrical lens and the reflected light returning through the first cylindrical lens by polarization, and the reflected light returning through the polarizing beam splitter A pattern writing method comprising a photoelectric sensor for photoelectrically detecting a field of view or a dark field.

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