JP2020021079A - Pattern drawing apparatus - Google Patents

Abstract

To provide a pattern drawing apparatus for drawing a prescribed pattern on a substrate.SOLUTION: A pattern drawing apparatus EX includes: a rotating drum 22 having a cylindrical outer peripheral surface having a center axis extending in a width direction of a substrate for conveying the substrate in a longitudinal direction following the outer peripheral surface while supporting a part of the substrate; a plurality of drawing units U1-6 for drawing patterns on respective plural regions by linearly scanning the substrate supported by the rotating drum along a main scanning direction the same as a center axis-extending direction; a surface plate 208 for rotatably or translatably supporting the plurality of the drawing units; driving parts 212A, B for rotating the surface plate around an axis line orthogonal to the center axis, and translating it in a center axis-extending direction; and a detecting part 204 for detecting that the substrate supported by the outer peripheral surface of the rotating drum is subjected to change of position in the center axis-extending direction, in which the driving parts are controlled so as to rotate or translate the surface plate corresponding to a position error detected by the detecting part.SELECTED DRAWING: Figure 16

Description

  The present invention relates to a pattern drawing device that draws a predetermined pattern on a substrate.

  In recent years, a printing method such as an intaglio method, a letterpress method, a silk method, or an ink-jet method, or a flexible method is called on a flexible (flexible) substrate made of resin or ultra-thin glass, called printable electronic. Attempts have been made to form electronic devices such as display displays by a photo-patterning method of projecting an ultraviolet light pattern onto a photosensitive layer applied on a substrate. As an electronic device, particularly for forming a circuit pattern including a thin film transistor (TFT), a pattern drawing resolution is high and a high positioning accuracy is required. Therefore, it is considered to use an optical patterning method instead of a printing method. ing. A typical manufacturing apparatus for the optical patterning method is an exposure apparatus that exposes a circuit pattern or the like. However, in order to perform pattern exposure on a flexible substrate, the exposure of the substrate is performed based on pattern data (CAD data). An apparatus for directly drawing a pattern on a layer, that is, a so-called maskless exposure apparatus is also used.

  Patent Literature 1 below discloses an image forming apparatus (laser beam printer) for photographic printing, which is a type of maskless exposure machine. In Patent Literature 1, a laser exposure unit that performs one-dimensional scanning by projecting a spot light of a beam deflected and scanned by a polygon mirror onto a long photosensitive material wound in a roll shape is mainly configured by a scanning line of the spot light. A plurality (for example, three) are provided so as to be arranged in the scanning direction, and the drawing range is expanded so as to correspond to a large photosensitive material in the scanning line direction. Further, in the image forming apparatus disclosed in Patent Document 1, the photosensitive material is transported by a conveyor including a plurality of pairs of transport rollers and guide rails. Therefore, when drawing an electronic circuit pattern, there is a concern that the accuracy of conveying the photosensitive material is insufficient. When a plurality of laser exposure units (drawing units) as described in Japanese Patent Application Laid-Open No. H10-163873 are provided for a sheet-like photosensitive material (flexible sheet substrate) so as to face the photosensitive material, a drawing line (scanning line) by each drawing unit is provided. ) Are tilted independently of each other, or when there is a relative inclination error between the exposed portion (drawing portion) on the sheet substrate and each drawing line due to distortion of the sheet substrate, drawing is performed by each drawing unit. The pattern is distorted, and the exposure accuracy (positioning accuracy, overlay accuracy, etc.) is reduced.

JP 2008-207524 A

  One embodiment of the present invention is a pattern drawing that exposes a predetermined pattern to each of a plurality of regions divided in a width direction orthogonal to the long direction of the sheet substrate while conveying the long sheet substrate in the long direction. An apparatus having a cylindrical outer peripheral surface having a constant radius from a central axis of the sheet substrate extending in the width direction, while supporting a part of the sheet substrate following the outer peripheral surface, A rotary drum that is supported by the main body frame so as to rotate around and conveys the sheet substrate in the longitudinal direction, and is intensity-modulated based on drawing data according to a pattern to be drawn for each of the plurality of regions. Each of the spot lights is linearly scanned on the sheet substrate supported on the outer peripheral surface of the rotary drum along the same main scanning direction as the direction in which the central axis extends, thereby each of the plurality of regions. The above A plurality of drawing units arranged to draw a pattern, a surface plate fixed to each of the plurality of drawing units, and supported on the main body frame so as to be rotatable or translatable; and Including a plurality of drawing lines defined by each scan, and in a plane parallel to the central axis, while rotating the surface plate around an axis perpendicular to the central axis, in the direction in which the central axis extends A detecting unit that detects that the position of the sheet substrate supported by the outer peripheral surface of the rotary drum changes in the direction in which the central axis extends due to the driving unit that performs the translation and the meandering of the sheet substrate that is transported to the rotary drum. And a control unit that controls the drive unit to translate or rotate the surface plate in accordance with a position error detected by the detection unit.

FIG. 1 is a diagram illustrating a schematic configuration of a device manufacturing system including an exposure apparatus that performs an exposure process on a substrate according to a first embodiment. FIG. 2 is a view showing drawing lines of spot light scanned on a substrate by the exposure head of FIG. 1 and alignment marks formed on the substrate. FIG. 2 is a diagram illustrating a configuration of a drawing unit illustrated in FIG. 1. FIG. 4 is a perspective view illustrating an arrangement relationship among a rotating drum, a scale unit, and an encoder head. FIG. 2 is a diagram illustrating a configuration of a support frame that supports the exposure head and the rotating drum in FIG. 1. FIG. 2 is a diagram illustrating an electrical configuration of the control device in FIG. 1. FIG. 9 is a diagram illustrating a tilt of a drawing line with respect to a central axis caused by eccentric rotation of a rotary drum. FIG. 9 is a diagram illustrating a difference value of the rotational position of both ends of the rotary drum on the same installation azimuth line when the rotary drum is eccentrically rotated. FIG. 4 is a diagram illustrating a line pattern formed on a surface of a rotating drum. FIG. 9 is an explanatory diagram for describing calculation of an inclination angle of a drawing line with respect to a center axis of a rotating drum. FIG. 9 is an explanatory diagram for describing calculation of an inclination angle of a drawing line with respect to a center axis of a rotating drum. FIG. 12A is a conceptual diagram of the pattern data stored in the pattern data storage unit, and FIG. 12B uses the pattern data shown in FIG. 12A when the drawing line is inclined with respect to the center axis of the rotating drum. FIG. 6 is a diagram showing a region of a pattern drawn by drawing. FIG. 13A is a conceptual diagram of pattern data corrected according to the inclination angle of the drawing line with respect to the center axis of the rotating drum, and FIG. 13B is a diagram showing a region of the pattern drawn using the pattern data shown in FIG. It is. FIG. 3 is a diagram illustrating a substrate on which a line pattern is formed. FIG. 3 is a diagram illustrating an alignment microscope that captures a position of a joint portion of a drawing line, and an image captured by the alignment microscope. FIG. 9 is a diagram illustrating an exposure apparatus according to a second embodiment. FIG. 7 is a diagram illustrating an arrangement configuration of a second optical surface plate and a fine movement driving unit on an XY plane. FIG. 4 is an exaggerated view of a substrate conveyed in a meandering manner in a first pattern drawing step on the substrate. In the second pattern drawing step on the substrate, when the substrate on which the pattern was exposed was transported straight under the meandering transport of the substrate shown in FIG. 18, the arrangement of the exposure area where the pattern was exposed in the first exposure step It is a figure which shows the error of a deformation | transformation. In the first pattern drawing process for the substrate, when the substrate is transported in the meandering state shown in FIG. 18, the second optical surface plate is exposed on the substrate by the fine movement and minute rotation in the Y direction. FIG. 7 is a diagram showing an exposure area of a pattern that has been applied.

  Preferred embodiments of a pattern drawing apparatus and a pattern drawing method according to aspects of the present invention will be described below in detail with reference to the accompanying drawings. Note that aspects of the present invention are not limited to these embodiments, and include various modifications or improvements. That is, the components described below include those that can be easily assumed by those skilled in the art and substantially the same components, and the components described below can be appropriately combined. Further, various omissions, substitutions, or changes of the constituent elements can be made without departing from the spirit of the present invention.

[First Embodiment]
FIG. 1 is a diagram illustrating a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (subject) to be exposed according to the first embodiment. In the following description, an XYZ orthogonal coordinate system is set, and the X, Y, and Z directions will be described according to the arrows shown in the drawing.

  The device manufacturing system 10 is a manufacturing system in which a manufacturing line for manufacturing an electronic device is constructed. Examples of the electronic device include a flexible display, a film-shaped touch panel, a film-shaped color filter for a liquid crystal display panel, a flexible wiring, and a flexible sensor. In the present embodiment, a description will be given on the assumption that a flexible display is used as an electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out the substrate P from a supply roll (not shown) in which a flexible sheet-like substrate (sheet substrate) P is wound into a roll, and continuously performs various processes on the sent-out substrate P. After that, the substrate P after various kinds of processing is wound up by a collecting roll (not shown), that is, a so-called roll-to-roll type structure is provided. Therefore, the substrate P after the various processes is a state in which a plurality of electronic devices are connected, and is a substrate for multi-panning. The substrate P sent from the supply roll is sequentially subjected to various processes in a process device PR1, an exposure device (drawing device) EX, and a process device PR2, and is wound up by the collection roll. The substrate P has a band shape in which the moving direction of the substrate P is a longitudinal direction (long) and the width direction is a short direction (short).

  The X direction is a direction (transport direction) from the process device PR1 to the process device PR2 via the exposure device EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction.

  As the substrate P, for example, a resin film, a foil (foil) made of metal or alloy such as stainless steel, or the like is used. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin Among them, one containing at least one or more may be used. Further, the thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling of the substrate P when passing through the transport path of the exposure apparatus EX. As a base material of the substrate P, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is a typical example of a suitable sheet substrate.

  Since the substrate P may receive heat in each processing performed in the process apparatus PR1, the exposure apparatus EX, and the process apparatus PR2, it is preferable to select a substrate P of a material whose coefficient of thermal expansion is not significantly large. For example, a thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Further, the substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above-described resin film, foil, and the like are bonded to this ultra-thin glass. It may be.

  By the way, the flexibility of the substrate P means a property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. In addition, the property of being bent by the force of its own weight is also included in the flexibility. Further, the degree of flexibility changes according to the material, size and thickness of the substrate P, the layer structure formed on the substrate P, environment such as temperature and humidity, and the like. In any case, when the substrate P is correctly wound around various transporting rollers, rotating drums, and other transporting direction changing members provided in the transporting path in the device manufacturing system 10 according to the present embodiment, the substrate P buckles and folds. If the substrate P can be smoothly transported without any damage or breakage (breakage or cracking), it can be said that the substrate P is in the range of flexibility.

  The process apparatus PR1 performs a pre-process on the substrate P to be exposed by the exposure apparatus EX. The process apparatus PR1 performs a pre-process on the substrate P while transporting the substrate P sent from the supply roll toward the exposure apparatus EX at a predetermined speed. The process device PR1 sends the substrate P that has been processed in the preceding process to the exposure device EX at a predetermined speed. The substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on the surface of which a photosensitive functional layer (photosensitive layer) is formed by the processing in the preceding step.

  The photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film). A typical example of the photosensitive functional layer is a photoresist, but a photosensitive silane coupling agent (SAM) is used as a material that does not require a developing process, in which the lyophilicity of a portion exposed to ultraviolet light is modified. Alternatively, there is a photosensitive reducing agent or the like in which a plating reducing group is exposed in a portion irradiated with ultraviolet rays. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet light on the substrate P is modified from lyophobic to lyophilic. Therefore, a pattern layer is formed by selectively applying a conductive ink (an ink containing conductive nanoparticles such as silver or copper) or a liquid containing a semiconductor material on the lyophilic portion. be able to. When a photosensitive reducing agent is used as the photosensitive functional layer, a plating reducing group is exposed on a pattern portion of the substrate P exposed to ultraviolet light. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time, whereby a pattern layer of palladium is formed (deposited). Although such a plating process is an additive process, the substrate P sent to the exposure apparatus EX may be made of PET or the like when the etching process as a subtractive process is premised. PEN may be used in which a metallic thin film such as aluminum (Al) or copper (Cu) is entirely or selectively deposited on the surface, and a photoresist layer is further laminated thereon.

  In the present embodiment, the exposure apparatus EX as a drawing apparatus is a direct-drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus. A light pattern corresponding to a predetermined pattern such as a display circuit or a wiring is applied. As will be described in detail later, the exposure apparatus EX scans the spot light SP of the exposure laser light (exposure beam) LB on the substrate P by a predetermined scanning while transporting the substrate P in the + X direction (sub-scanning direction). By scanning (main scanning) in a one-dimensional direction (main scanning direction, Y direction) in the direction (main scanning direction, Y direction), the intensity of the spot light SP is modulated (on / off) at high speed in accordance with pattern data (drawing data). A light pattern corresponding to a predetermined pattern such as a display circuit or a wiring is drawn and exposed on the surface (photosensitive surface) of the substrate P. That is, the spot light SP is relatively two-dimensionally scanned on the substrate P by the transport (sub-scan) of the substrate P in the + X direction and the scanning of the spot light SP in the main scanning direction (Y direction). A light pattern is drawn and exposed on the substrate P. In addition, since the electronic device is configured by overlapping a plurality of pattern layers (layers on which patterns are formed), a pattern corresponding to each layer is exposed by the exposure apparatus EX.

  The process device PR2 performs a post-process (for example, a plating process, a developing / etching process, and the like) on the substrate P exposed by the exposure device EX. The process apparatus PR2 performs a post-process on the substrate P while transporting the substrate P sent from the exposure apparatus EX toward the collection roll at a predetermined speed. A pattern layer of the electronic device is formed on the substrate P by the processing in the subsequent process. Since the electronic device is configured by overlapping a plurality of pattern layers (layers on which patterns are formed), after a pattern is formed on the first layer by each process of the device manufacturing system 10, the electronic device is again Through the respective processes of the device manufacturing system 10, a pattern is formed on the second layer.

  Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in a temperature control chamber ECV. The temperature control chamber ECV suppresses a change in shape due to the temperature of the substrate P transferred inside by keeping the inside at a predetermined temperature. The temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be a surface on the installation base or a floor. The exposure apparatus EX includes a substrate transport mechanism (transport device) 12, a light source device (pulse light source device) 14, a light introduction optical system 16, an exposure head 18, a control device 20, an alignment microscope AM (AM1 to AM3), and an encoder. And a head EN (EN1 to EN3).

  The substrate transport mechanism 12 transports the substrate P transported from the process device PR1 to the process device PR2 at a predetermined speed. The transport path of the substrate P transported in the exposure apparatus EX is defined by the substrate transport mechanism 12. The substrate transport mechanism 12 includes an edge position controller EPC, a drive roller R1, a tension adjustment roller RT1, a rotary drum (cylindrical drum) 22, a tension adjustment roller RT2, It has a driving roller R2 and a driving roller R3.

  The edge position controller EPC adjusts the position of the substrate P conveyed from the process device PR1 in the width direction (Y direction and the shorter direction of the substrate P). In other words, the edge position controller EPC sets the position at the edge (edge) in the width direction of the substrate P, which is being conveyed under a predetermined tension, to ± 10 to several tens μm with respect to the target position. The substrate P is moved in the width direction so as to fall within the range (allowable range), and the position of the substrate P in the width direction is adjusted. The edge position controller EPC has an edge sensor (edge detection unit) (not shown) that detects the position of the edge (edge) in the width direction of the substrate P. The drive roller R <b> 1 rotates while holding both the front and back surfaces of the substrate P transported from the edge position controller EPC, and transports the substrate P toward the rotating drum 22. The edge position controller EPC adjusts the position of the substrate P in the width direction such that the long direction of the substrate P is orthogonal to the center axis AX of the rotating drum 22.

  The rotary drum 22 has a central axis AX extending in the Y direction and a cylindrical outer peripheral surface having a constant radius from the central axis AX, and moves a part of the substrate P along the outer peripheral surface (circumferential surface) in the longitudinal direction. And transports the substrate P in the + X direction while rotating about the central axis AX. The rotating drum 22 supports, on its circumferential surface, a region (part) on the substrate P imaged by the alignment microscope AM (AM1 to AM3) and a region (part) on the substrate P where a light pattern is exposed. . The central axis AX is rotated by a rotation torque from a rotation drive source (for example, a motor or a reduction mechanism) controlled by the control device 20. For convenience, a plane passing through the central axis AX and parallel to the Y plane is referred to as a central plane C.

  The drive rollers R2 and R3 are arranged at predetermined intervals along the transport direction (+ X direction) of the substrate P, and give the substrate P after exposure a predetermined slack (play). The drive rollers R2 and R3 rotate while holding both the front and back surfaces of the substrate P similarly to the drive roller R1, and transport the substrate P toward the process device PR2. The drive rollers R2 and R3 are provided on the downstream side (+ X direction side) in the transport direction with respect to the rotary drum 22, and this drive roller R2 is located on the upstream side (−X side) in the transport direction with respect to the drive roller R3. Direction side). The tension adjusting rollers RT1 and RT2 are urged in the −Z direction, and apply a predetermined tension in the longitudinal direction to the substrate P wound and supported on the rotating drum 22. This stabilizes the longitudinal tension applied to the substrate P before being applied to the rotating drum 22 within a predetermined range. Note that the control device 20 rotates the drive rollers R1 to R3 by controlling a rotation drive source (not shown) (for example, a motor or a reduction mechanism).

  The light source device 14 has a light source (pulse light source) 14a and emits a pulsed laser light (pulse light) LB. The laser light LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the laser light LB is Fe. The laser light LB emitted from the light source device 14 is guided to the light introduction optical system 16 and enters the exposure head 18.

  The exposure head 18 includes a plurality of drawing units U (U1 to U6) on which the laser beams LB are respectively incident. The laser beam LB from the light source device 14 is guided to a light introducing optical system 16 having a reflection mirror, a beam splitter, and the like, and is incident on a plurality of drawing units U (U1 to U6) of the exposure head 18. The exposure head 18 draws a predetermined pattern on a part of the substrate P supported on the circumferential surface of the rotating drum 22 by using a plurality of drawing units U1 to U6. The exposure head 18 is a so-called multi-beam exposure head by having a plurality of drawing units U1 to U6 having the same configuration. The drawing units U1, U3, and U5 are arranged in a line in the Y direction on the upstream side (−X direction side) of the substrate P in the forward transport direction with respect to the center plane C. The drawing units U2, U4, and U6 are arranged in a line in the Y direction on the downstream side (+ X direction side) of the substrate P in the forward transport direction with respect to the center plane C.

  The drawing unit U converges the incident laser light LB on the substrate P to form the spot light SP, and causes the spot light SP to perform main scanning in the main scanning direction (Y direction). By the scanning of the spot light SP in the main scanning direction, a drawing line L indicating the scanning locus of the spot light SP is defined on the substrate P. As shown in FIG. 2, the drawing lines (scanning lines) L of the respective drawing units U are set so as to be joined without being separated from each other in the Y direction (the width direction of the substrate P, the scanning direction). In FIG. 2, the drawing line L of the drawing unit U1 is denoted by L1, and the drawing line L of the drawing unit U2 is denoted by L2. Similarly, the drawing lines L of the drawing units U3, U4, U5, and U6 are represented by L3, L4, L5, and L6. As described above, each drawing unit U shares a scanning area so that all of the drawing units U1 to U6 cover the entire width of the exposure area W in the width direction. Thus, each of the drawing units U1 to U6 can draw a pattern for each of a plurality of regions divided in the width direction of the substrate P. If the scanning width (length of the drawing line L) of one drawing unit U in the Y direction is about 20 to 50 mm, three odd numbered drawing units U1, U3, and U5 and even numbered drawing units By arranging a total of six drawing units U including three units U2, U4, and U6 in the Y direction, the width in the Y direction that can be drawn is increased to about 120 to 300 mm. The lengths of the drawing lines L1 to L6 are basically the same. That is, the scanning distance of the spot light SP of the laser light LB scanned along each of the drawing lines L1 to L6 is the same.

  More specifically, the drawing lines L1 to L6 are arranged in two rows in the circumferential direction of the rotary drum 22 with the center plane C interposed therebetween. The drawing lines L1, L3, L5 are located on the substrate P on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane C, and the drawing lines L2, L4, L6 are On the other hand, it is located on the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P. The drawing lines L1 to L6 are substantially parallel in the width direction of the substrate P, that is, along the center axis AX of the rotating drum 22.

  The drawing lines L1, L3, and L5 are arranged on a straight line at predetermined intervals along the width direction (scanning direction) of the substrate P, and the drawing lines L2, L4, and L6 are similarly arranged in the width direction of the substrate P ( Are arranged on a straight line at predetermined intervals along the scanning direction). At this time, the drawing line L2 is arranged between the drawing line L1 and the drawing line L3 in the width direction of the substrate P. Similarly, the drawing line L3 is arranged between the drawing line L2 and the drawing line L4 in the width direction of the substrate P. The drawing line L4 is arranged between the drawing line L3 and the drawing line L5 in the width direction of the substrate P, and the drawing line L5 is arranged between the drawing line L4 and the drawing line L6 in the width direction of the substrate P. Is done.

  The scanning direction of the spot light SP of the laser light LB scanned along each of the odd-numbered drawing lines L1, L3, L5 is a one-dimensional direction, which is the same direction. The scanning direction of the spot light SP of the laser light LB scanned along each of the even-numbered drawing lines L2, L4, L6 is a one-dimensional direction, which is the same direction. The scanning direction of the spot light SP of the laser light LB scanned along the drawing lines L1, L3, L5, and the scanning direction of the spot light SP of the laser light LB scanned along the drawing lines L2, L4, L6. Are in opposite directions. More specifically, the scanning direction of the spot light SP of the laser light LB scanned along the drawing lines L1, L3, L5 is the + Y direction, and the laser light LB scanned along the drawing lines L2, L4, L6. The scanning direction of the spot light SP is the −Y direction. Thus, the drawing start positions of the drawing lines L3 and L5 and the drawing start positions of the drawing lines L2 and L4 are adjacent to each other in the Y direction. The drawing end positions of the drawing lines L1, L3, L5 and the drawing end positions of the drawing lines L2, L4, L6 are adjacent in the Y direction.

  The width (dimension in the X direction) of the drawing line L in the sub-scanning direction is a thickness corresponding to the size of the spot light SP. For example, when the size (diameter) of the spot light SP is 3 μm, the width of the drawing line L in the sub-scanning direction is also 3 μm. The spot light SP is irradiated along the drawing line L so as to overlap by a predetermined length (for example, half the size of the spot light SP).

  Next, the configuration of the drawing unit U will be described with reference to FIG. Since the drawing units U (U1 to U6) have the same configuration, only the drawing unit U2 will be described, and the description of the other drawing units U will be omitted.

  As shown in FIG. 3, the drawing unit U2 includes, for example, a condenser lens 30, a drawing optical element (light modulation element) 32, an absorber 34, a collimator lens 36, a reflection mirror 38, a cylindrical lens 40, a focus lens 42, It has a beam splitter 44, a polygon mirror (optical scanning member) 46, a reflection mirror 48, an f-θ lens 50, and a cylindrical lens 52.

  The laser beam LB that enters the drawing unit U <b> 2 proceeds downward from above in the vertical direction (−Z direction), and enters the drawing optical element 32 via the condenser lens 30. The condenser lens 30 condenses (converges) the laser light LB incident on the drawing optical element 32 so as to have a beam waist in the drawing optical element 32. The drawing optical element (modulator) 32 has transparency to the laser light LB, and for example, an acousto-optic modulator (AOM) is used.

  The drawing optical element (AOM) 32 transmits the incident laser beam LB to the absorber 34 when a driving signal (high-frequency signal) from an AOM driving unit 96 (see FIG. 6) described later is in an off state. When the drive signal (high-frequency signal) from the AOM drive unit 96 is on, the incident laser light LB is diffracted and directed to the reflection mirror 38. The absorber 34 is an optical trap that absorbs the laser light LB to suppress the leakage of the laser light LB to the outside. The AOM drive unit 96 reflects the laser light LB by turning on / off a drawing drive signal (ultrasonic frequency) to be applied to the drawing optical element 32 at high speed in accordance with the pattern data (drawing data). Switching is performed between the mirror 38 (the drawing optical element 32 is turned on) and the absorber 34 (the drawing optical element 32 is turned off). That is, the drawing optical element 32 can be switched on / off. This means that, when viewed on the substrate P, the intensity of the laser light LB (spot light SP) reaching the photosensitive surface is rapidly modulated to either a high level or a low level (for example, zero level) according to the pattern data. Means to be done.

  The collimator lens 36 converts the laser light LB traveling from the drawing optical element 32 to the reflection mirror 38 into parallel light. The reflection mirror 38 reflects the incident laser beam LB in the −X direction and irradiates the beam splitter 44 via the cylindrical lens 40 and the focus lens 42. The beam splitter 44 irradiates the incident laser beam LB to the polygon mirror 46. The polygon mirror (rotating polygon mirror) 46 has a rotating shaft 46a extending in the Z direction, and a plurality of reflecting surfaces 46b (eight reflecting surfaces 46b in the present embodiment) formed around the rotating shaft 46a. By rotating the polygon mirror 46 in a predetermined rotation direction about the rotation axis 46a, the reflection angle of the pulsed laser light LB applied to the reflection surface 46b can be continuously changed. Thus, the spot light SP of the laser light LB applied to the substrate P can be scanned in the scanning direction (the width direction of the substrate P, the Y direction) by one reflection surface 46b. That is, the spot light SP of the laser light LB can be scanned along the drawing line L2 by one reflection surface 46b. Thus, the number of drawing lines L2 on which the spot light SP is scanned on the substrate P by one rotation of the polygon mirror 46 is eight at the maximum. The polygon mirror 46 is rotated at a constant speed by a polygon driving unit 92 (see FIG. 6) including a motor and the like. The length of the drawing line L2 is set to be shorter than the maximum scanning length in which the spot light SP can be scanned by the polygon mirror 46, and the drawing line L2 can be set substantially near the center of the maximum scanning length. preferable.

  When the length of the drawing line L2 is 30 mm and the spot light SP is irradiated onto the substrate P along the drawing line L2 while the spot light SP of 3 μm is overlapped by 1.5 μm at a time, the irradiation is performed in one scan. The number of spot lights SP is 20,000 (30 mm / 1.5 μm). Further, assuming that the scanning time of the spot light SP along the drawing line L2 is 200 μsec, the pulsed spot light SP must be irradiated 20,000 times during this time. Therefore, the emission frequency Fe is Fe ≧ 20,000 / 200 μsec = 10 MHz. Becomes

  A cylindrical lens 40 provided between the reflection mirror 38 and the beam splitter 44 and having a generatrix in the Y direction cooperates with the focus lens 42 to emit laser light in a non-scanning direction (Z direction) orthogonal to the scanning direction. The LB is condensed (converged) on the reflection surface 46b of the polygon mirror 46. Due to the cylindrical lens 40, even if the reflecting surface 46b of the polygon mirror 46 is inclined with respect to the Z direction (inclination from the parallel state between the normal line of the XY plane and the reflecting surface 46b), the influence is not affected. It is possible to suppress the irradiation position of the laser beam LB irradiated on the substrate P from shifting in the X direction.

The laser beam LB reflected by the polygon mirror 46 is reflected in the −Z direction by the reflection mirror 48 and enters the f-θ lens 50 having the optical axis AXu extending in the Z axis direction. The f-θ lens 50 is a telecentric optical system in which the principal ray of the laser beam LB projected on the substrate P always becomes a normal to the surface of the substrate P during scanning. the incident angle theta ₁ to the f-theta lens 50 will vary in accordance with the rotation angle of the polygon mirror 46 (θ _1/2). The f-θ lens 50 condenses the spot light SP of the laser light LB at an image height position proportional to the incident angle θ ₁ . Assuming that the focal length is f and the image height position is y, the f-θ lens 50 has a relationship of y = f × θ ₁ . Therefore, the f-θ lens 50 makes it possible to scan the laser beam LB accurately and at a constant speed in the Y direction. The laser beam LB emitted from the f-θ lens 50 is applied to the substrate P via the cylindrical lens 52 as a small spot light SP having a diameter of about several μm and having a substantially circular shape. The cylindrical lens 52 turns the spot light SP of the laser light LB condensed on the substrate P into a minute circle having a diameter of about several μm, and its generating line is parallel to the Y direction. As a result, spot light SP is formed on the substrate P, and the spot light (scanning spot light) SP is one-dimensionally scanned in one direction by the polygon mirror 46 along the drawing line L2 extending in the Y direction.

  As described above, the spot light SP of the laser light LB is one-dimensionally scanned in the scanning direction (Y direction) by each of the drawing units U1 to U6 in a state where the substrate P is transported in the X direction. The SP is relatively two-dimensionally scanned on the substrate P, so that a predetermined pattern can be drawn and exposed on the exposure region W of the substrate P. Note that reference numeral 54 shown in FIG. The origin sensor 54 has an irradiating unit 54a that irradiates light to the reflecting surface 46b of the polygon mirror 46, and a photoelectric detector (start signal output unit) 54b that receives the reflected light. Upon receiving the reflected light from the irradiation unit 54a, the photoelectric detector 54b outputs a pulse-shaped start signal st2 indicating the start of scanning of the spot light SP in the scanning direction.

  Each time the rotation position of the polygon mirror 46 reaches a predetermined position immediately before the spot light SP is applied to the drawing start position of the drawing line L2, the light from the irradiation unit 54a is output to the photoelectric detector 54b. , An origin sensor 54 is provided. Accordingly, the photoelectric detector 54b outputs a pulse-like start signal st2 every time the rotational position of the polygon mirror 46 reaches a predetermined position. That is, when each reflection surface 46b of the polygon mirror 46 reaches a predetermined position, the photoelectric detector 54b receives the reflected light and outputs a start signal st2. Therefore, the scanning of the spot light SP is performed eight times during the period in which the polygon mirror 46 makes one rotation, and the photoelectric detector 54b also outputs the start signal st2 eight times in the period in which the polygon mirror 46 makes one rotation. The start signal st2 detected by the origin sensor 54 (photoelectric detector 54b) is sent to the control device 20. A predetermined time after the photoelectric detector 54b outputs the start signal st2, the scanning of the spot light SP along the drawing line L2 starts. Needless to say, this origin sensor 54 is provided in each drawing unit U, and the start signal st output from the origin sensor 54 of the drawing unit U1 is st1. Similarly, the drawing units U3, U4, U5, and U6 The start signal st output from the origin sensor 54 is st3, st4, st5, st6.

  As shown in FIG. 2, the alignment microscopes AM (AM1 to AM3) are for detecting alignment marks Ks (Ks1 to Ks3) formed on the substrate P, and are provided along the Y direction. ing. The area on the substrate P detected by the alignment microscope AM (AM1 to AM3) is supported by the circumferential surface of the rotating drum 22. The alignment mark Ks is a reference mark for relatively aligning (aligning) the pattern drawn on the exposure region W on the substrate P with the substrate P. That is, the position of the substrate P can be detected by detecting the alignment mark Ks. As shown in FIG. 2, the alignment marks Ks are formed at both ends in the width direction of the substrate P at regular intervals along the length direction of the substrate P, and are formed along the length direction of the substrate P. It is formed between the exposure regions W arranged side by side and also at the center in the width direction of the substrate P. Since the exposure head 18 repeatedly performs pattern exposure for an electronic device on the substrate P, a plurality of exposure regions W are provided at predetermined intervals along the longitudinal direction of the substrate P. Since the alignment mark Ks is formed together with the formation of the pattern on the first layer of the substrate P, the alignment mark Ks is not formed when the pattern is exposed on the first layer. Note that the alignment marks Ks (Ks1 to Ks3) may be formed on the substrate P before the pattern is formed on the first layer of the substrate P.

  The alignment microscopes AM (AM1 to AM3) project the illumination light for alignment onto the substrate P, and image the reflected light with an image sensor such as a CCD or a CMOS. The alignment microscope AM (AM1 to AM3) is provided on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the spot light SP emitted from the exposure head 18. The alignment microscope AM1 captures an image of the alignment mark Ks1 formed at the + Y direction end of the substrate P existing in the observation region (detection visual field) Vw1, and the alignment microscope AM2 captures the substrate P existing in the observation region Vw2. An image of the alignment mark Ks2 formed at the end on the −Y direction side is taken. The alignment microscope AM3 captures an image of the alignment mark Ks3 formed at the center in the width direction of the substrate P existing in the observation region Vw3. An image signal (image data) captured by the alignment microscope AM (AM1 to AM3) is sent to the control device 20. Note that the illumination light for alignment is light in a wavelength range having little sensitivity to the photosensitive functional layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm. The size of the observation region Vw (Vw1 to Vw3) on the substrate P is set according to the size of the alignment mark Ks (Ks1 to Ks3) and the alignment accuracy (position measurement accuracy), and is about 100 to 500 μm square. Is the size of

  The encoder heads EN (EN1a to EN3a, EN1b to EN3b) optically detect the rotational position of the rotary drum 22. The encoder heads EN (EN1a to EN3a, EN1b to EN3b) face scale units GPa and GPb provided at both ends of the rotary drum 22, as shown in FIG. The encoder heads EN1a to EN3a are opposed to the scale portion GPa provided at the end of the rotary drum 22 in the + Y direction, and the encoder heads EN1b to EN3b are provided at the end of the rotary drum 22 in the -Y direction. It faces scale part GPb. The scales of the scale portions GPa and GPb are each formed in an annular shape over the entire outer circumferential surface of the rotary drum 22 in the circumferential direction. The scale portions GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum 22 and are configured as an incremental scale. The scale portions GPa and GPb rotate integrally with the rotary drum 22 around the central axis AX.

  The substrate P is configured to be wound inside the scale portions GPa and GPb at both ends of the rotary drum 22. The outer peripheral surfaces of the scale portions GPa and GPb and the outer peripheral surface of the substrate P wound around the rotating drum 22 are set to be the same surface (the same radius from the central axis AX). Accordingly, the encoder heads EN (EN1a to EN3a, EN1b to EN3b) can detect the scale portions GPa and GPb at the same radial position as the drawing surface on the substrate P wound around the rotary drum 22, and can determine the measurement positions. Abbe errors caused by the processing position (scanning position of spot light SP, detection position of alignment mark Ks) differing in the radial direction of rotating drum 22 can be reduced.

  The encoder heads EN (EN1a to EN3a, EN1b to EN3b) irradiate a light beam for measurement toward the scale portions GPa and GPb, and photoelectrically detect the reflected light speed (diffraction light), thereby obtaining the scale portions GPa and GPb. And outputs a detection signal corresponding to the position in the circumferential direction to the control device 20. Thereby, the rotation angle (rotation position) of the rotating drum 22 can be detected. The detection signal Sd detected by the encoder head EN (EN1a to EN3a, EN1b to EN3b) is sent to the control device 20. The detection signals Sd detected by the encoder heads EN1a and EN1b are Sd1a and Sd1b, the detection signals Sd detected by the encoder heads EN2a and EN2b are Sd2a and Sd2b, and the detection signals Sd detected by EN3a and EN3b are Sd3a and Sd3b. I do. These detection signals Sd1a, Sd1b, Sd2a, Sd2b, Sd3a, and Sd3b are all two-phase signals having a phase difference of 90 degrees, and each of the detection signals Sd1a, Sd1b, Sd2a, Sd2b, Sd3a, and Sd3b is interpolated. By performing the processing by the circuit and the digital counter circuit, the amount of movement of the scale portions GPa and GPb in the circumferential direction is measured with submicron resolution.

  The encoder heads EN1a and EN1b are arranged on the installation azimuth line Le1. The installation azimuth line Le1 is a line connecting, on the XZ plane, a projection area (reading position) of the measurement light beam of the encoder heads EN1a and EN1b onto the scale portions GPa and GPb and the central axis AX. The installation azimuth line Le1 is a line connecting the observation areas Vw1 to Vw3 of the alignment microscopes AM1 to AM3 and the central axis AX on the XZ plane. That is, in the XZ plane, a line connecting the reading positions of the encoder heads EN1a and EN1b and the central axis AX and a line connecting the observation areas Vw1 to Vw3 of the alignment microscopes AM1 to AM3 and the central axis AX are the same azimuth line. Has become.

  The encoder heads EN2a and EN2b are arranged on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting, on the XZ plane, a projection area (reading position) of the measuring light beam of the encoder heads EN2a and EN2b onto the scale portions GPa and GPb and the central axis AX. The installation azimuth line Le2 is a line connecting the drawing lines L1, L3, L5 and the central axis AX on the XZ plane. That is, in the XZ plane, the line connecting the reading position of the encoder heads EN2a and EN2b and the central axis AX and the line connecting the drawing lines L1, L3 and L5 and the central axis AX are the same azimuth line.

  The encoder heads EN3a and EN3b are arranged on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting, on the XZ plane, a projection area (reading position) of the measuring light beam of the encoder heads EN3a and EN3b onto the scale portions GPa and GPb and the central axis AX. The installation direction line Le3 is a line connecting the drawing lines L2, L4, L6 and the central axis AX on the XZ plane. That is, in the XZ plane, the line connecting the reading position of the encoder heads EN3a and EN3b and the central axis AX and the line connecting the drawing lines L2, L4 and L6 and the central axis AX are the same azimuth line. The plurality of drawing units U1 to U6 and the encoder heads EN2 and EN3 are arranged such that the installation azimuth lines Le2 and Le3 are at an angle ± θ (see FIG. 1) with respect to the center plane C.

  Next, a support frame 60 that supports the exposure head 18 and the rotating drum 22 will be described with reference to FIG. FIG. 5 is a diagram illustrating a configuration of the support frame 60. The support frame 60 includes a main body frame 62, a three-point support portion 64, a first optical surface plate 66, a moving mechanism 68, and a second optical surface plate 70. The support frame 60 is stored in the temperature control chamber ECV. The main body frame 62 rotatably supports the rotating drum 22, the tension adjusting rollers RT1 (not shown), and RT2. The central axis AX of the rotary drum 22 is rotatably supported by the main body frame 62 via a bearing (bearing) 62a and the like, and the central axes of the tension adjusting rollers RT1 and RT2 are also via a bearing (bearing) not shown. The main body frame 62 is rotatably supported. The three-point support portion 64 is provided at the upper end of the main body frame 62 and supports the first optical surface plate 66 provided above the rotary drum 22 (in the + Z direction) at three points.

  The second optical surface plate 70 is provided above the first optical surface plate 66 (in the + Z direction), and is mounted on the first optical surface plate 66 via a moving mechanism 68. The surface of the second optical surface plate 70 is parallel to the surface of the first optical surface plate 66. The second optical surface plate 70 supports the exposure head 18. The second optical surface plate 70 holds the drawing units U1, U3, and U5 of the exposure head 18 on the upstream side (−X direction side) in the transport direction with respect to the center axis AX of the rotating drum 22 and in the width direction of the substrate P. (Y direction) to support in parallel. The second optical surface plate 70 is provided on the drawing units U2, U4, and U6 of the exposure head 18 on the downstream side (+ X direction side) in the transport direction with respect to the center axis AX, and in the width direction of the substrate P (Y direction). ).

  The moving mechanism 68 holds the first optical surface plate 66 and the second optical surface plate 70 in parallel with the respective surfaces of the first optical surface plate 66 and the first optical surface plate 70 centered on a rotation axis I extending in the vertical direction (Z direction). The second optical surface plate 70 can be rotated on the XY plane with respect to 66. Further, the moving mechanism 68 holds the first optical surface plate 66 and the second optical surface plate 70 in parallel with each other, and keeps the second optical surface plate 66 parallel to the first optical surface plate 66 around the rotation axis I. The optical surface plate 70 can be shifted in the Y direction. The rotation axis I extends in the vertical direction (Z direction) on the center plane C and at the center of gravity of the geometric position of the plurality of drawing lines L1 to L6 (for example, the center position in the width direction of the exposure region W). ) (See FIG. 2). Then, the moving mechanism 68 rotates or shifts the second optical surface plate 70 with respect to the first optical surface plate 66 so that the plurality of drawing units U <b> 1 to U <b> 6 for the substrate P wound around the rotating drum 22. The position can be adjusted. The plane including the drawing lines L1, L3, L5, the drawing lines L2, L4, L6 is parallel to the XY plane.

  FIG. 6 is a diagram showing an electrical configuration of the control device 20. The control device 20 has a computer and a storage medium in which a program is stored, and functions as the control device 20 of the present embodiment when the computer executes the program. The control device 20 includes a clock generation unit 80, counter circuits CT1a to CT3a, CT1b to CT3b, a control unit 82, and drawing unit drive control units CU1 to CU6. Although illustration of the even-numbered drawing unit drive control units CU2, CU4, and CU6 is omitted in FIG. 6, the operation is the same as that of the odd-numbered drawing unit drive control units CU1, CU3, and CU5. .

  The clock generation unit 80 generates a clock signal CLK, and outputs the generated clock signal CLK to the control unit 82 and the drawing unit drive control units CU1 to CU6. Note that the light emission frequency Fe of the light source device 14 is synchronized with the frequency of the clock signal CLK. The control unit 82 and the drawing unit drive control units CU1 to CU6 operate based on the clock signal CLK. The counter circuits CT1a to CT3a and CT1b to CT3b convert the rotation position information of the rotary drum 22 into digital signals by counting the detection signals Sd detected by the encoder heads EN1a to EN3a and EN1b to EN3b. The counter circuit CT1a counts the detection signal Sd1a from the encoder head EN1a, and the counter circuit CT1b counts the detection signal Sd1b from the encoder head EN1b. The counter circuit CT2a counts the detection signal Sd2a from the encoder head EN2a, and the counter circuit CT2b counts the detection signal Sd2b from the encoder head EN2b. The counter circuit CT3a counts the detection signal Sd3a from the encoder head EN3a, and the counter circuit CT3b counts the detection signal Sd3b from the encoder head EN3b. The counter circuits CT1a to CT3a and CT1b to CT3b reset their count values to 0 when the origin positions ZP (see FIG. 4) of the scale portions GPa and GPb are detected by the encoder heads EN1a to EN3a and EN1b to EN3b. That is, the counter circuits CT1a to CT3a and CT1b to CT3b count the rotational position of the rotary drum 22 from the origin position ZP with reference to the origin position ZP.

  The rotational position calculator 84 of the controller 82 calculates the rotational position Ac1 of the rotary drum 22 on the installation azimuth line Le1 by averaging the count values of the counter circuits CT1a and CT1b. Similarly, the rotational position calculator 84 calculates the rotational positions Ac2 and Ac3 of the rotary drum 22 at the installation azimuth lines Le2 and Le3 by taking the average value of the count values of the counter circuits CT2a and CT2b and the average value of the counter circuits CT3a and CT3b. Is calculated. When the rotation of the rotating drum 22 is not eccentric, the count values of the counter circuits CT1a and CT1b are the same. Similarly, the count values of the counter circuits CT2a and CT3a and the counter circuits CT2b and CT3b are the same.

  The alignment position information generation unit 86 of the control unit 82 determines the exposure area where the pattern is exposed based on the position of the alignment mark Ks (Ks1 to Ks3) on the substrate P detected using the alignment microscope AM (AM1 to AM3). Alignment position information indicating the position of W on the substrate P is generated. The position of the exposure area W on which the pattern is exposed on the substrate P is calculated by the rotation position calculation unit 84 using the encoder heads EN1a and EN1b provided on the same installation azimuth line Le1 as the alignment microscope AM (AM1 to AM3). The rotation position Ac1 of the rotating drum 22 at the installation azimuth line Le1 described above. The alignment position information generation unit 86 detects the position of the alignment mark Ks (Ks1 to Ks3) on the substrate P by analyzing the image data captured by the alignment microscope AM (AM1 to AM3).

  The drawing unit drive control units CU1 to CU6 drive control the drawing units U1 to U6 based on the rotation positions Ac2 and Ac3 calculated by the rotation position calculation unit 84 and the alignment position information generated by the alignment position information generation unit 86. I do. In principle, only the drawing unit drive control units CU1, CU3, and CU5 will be described, and only the drawing unit drive control units CU2, CU4, and CU6 that are different from the drawing unit drive control units CU1, CU3, and CU5 will be described. The drawing unit drive control units CU1 to CU6 have the same configuration unless otherwise specified.

  Each of the drawing unit drive control units CU1, CU3, and CU5 includes a control unit 90, a polygon drive unit 92, a memory unit 94, and an AOM drive unit 96. The control unit 90 of the drawing unit drive control units CU1, CU3, CU5 controls each unit of the drawing unit drive control units CU1, CU3, CU5. The polygon drive units 92 of the drawing unit drive control units CU1, CU3, and CU5 include a rotation drive source such as a motor, and rotate the polygon mirror 46 of the drawing units U1, U3, and U5 under the control of the control unit 90. The control unit 90 performs feedback control of the polygon driving unit 92 so that the rotation speed of the polygon mirror 46 becomes a rotation command value. The polygon driving unit 92 has an encoder that detects a rotation speed signal corresponding to the rotation speed of the polygon mirror 46, and outputs the rotation speed signal to the control unit 90. Therefore, the control unit 90 performs feedback control of the polygon driving unit 92 based on the rotation command value and a rotation speed signal corresponding to the rotation speed of the polygon mirror 46. As the polygon mirrors 46 of the drawing units U1, U3, U5 rotate, start signals st1, st3, st5 indicating the start of scanning of the spot light SP along the drawing lines L1, L3, L5 by the polygon mirror 46 are drawn. Output to the unit drive control units CU1, CU3, CU5. The rotation speed (rotation speed) of the polygon mirror 46 of the drawing units U1 to U6 is the same.

  Since the position intervals of the spot light SP irradiated onto the substrate P along the scanning direction are determined according to the rotation speed of the polygon mirror 46 and the light emission frequency Fe (frequency of the clock signal CLK), the drawing lines L1, L3 , L5 so that the spot light SP scanned along the length L5 is irradiated while overlapping by a predetermined length (for example, １ ／ of the size of the spot light SP). Command value) and a light emission frequency Fe (frequency of the clock signal CLK). Further, the position interval (scanning interval in the sub-scanning direction) of the spot light SP irradiated along the longitudinal direction of the substrate P is determined according to the transport speed of the substrate P and the number of rotations of the polygon mirror 46. The rotation speed of the rotating drum 22 and the polygon are set such that the spot light SP irradiated along the longitudinal direction of the substrate P overlaps by a predetermined length (for example, の of the size of the spot light SP). The number of rotations (rotation command value) of the mirror 46 is determined.

  The memory unit 94 of the drawing unit drive control unit CU1 stores pattern data BM1 corresponding to the pattern drawn by the drawing unit U1. Similarly, in the memory unit 94 of the drawing unit drive control units CU3 and CU5, pattern data BM3 and BM5 corresponding to patterns drawn by the drawing units U3 and U5 are stored. The memory unit 94 of the drawing unit drive control units CU2, CU4, and CU6 (not shown) stores pattern data BM2, BM4, and BM6 corresponding to patterns drawn by the drawing units U2, U4, and U6.

  The memory unit 94 has a plurality of two-dimensionally decomposed two-dimensionally arranged such that a direction along the main scanning direction (Y direction) of the spot light SP is a row and a direction along the transport direction (+ X direction) of the substrate P is a column. The pattern data BM1, BM3, and BM5 are stored as bitmap data composed of the pixel data of. This pixel data is 1-bit data of “0” or “1”. That is, the pattern data BM1 to BM6 are obtained by decomposing a pattern to be drawn by the drawing units U1 to U6 into a plurality of pixels arranged in a matrix, and converting each pixel to logical information (pixel data) of “0” or “1”. This is bitmap data represented by. The pixel data of “0” means that the intensity of the spot light SP irradiated on the substrate P is set to a low level (for example, 0 level), and the pixel data of “1” is the spot irradiated on the substrate P. This means that the intensity of the light SP is set to a high level. In the present embodiment, a description will be given assuming that one pixel is irradiated with one spot light SP. Therefore, the number of pixel data in the row direction (vertical direction) is the same as the number of pulses of the spot light SP irradiated along the drawing line L. In addition, when the size of the spot light SP is 3 μm and the size of the pixel is also 3 μm, and when the spot light SP is projected onto the substrate P while overlapping by 1.5 μm, the two spot light SPs become 1 It may correspond to a pixel. In this case, the number of pixel data in the row direction (vertical direction) is の of the number of pulses of the spot light SP irradiated along the drawing line L.

  The control unit 90 of the drawing unit drive control units CU1, CU3, and CU5 reads the pixel data of the pattern data BM1, BM3, and BM5 stored in the memory unit 94 for each column, and reads the read pixel data of one column (pixel data ) To the AOM driving unit 96. This pixel data string represents pattern data for one drawing line L. The AOM driving section 96 outputs an on / off drive signal (high-frequency signal) for one drawing line L to the drawing optical element 32 of the drawing unit U to be controlled according to the pixel data string. For example, when the pixel data is “1”, the AOM driving unit 96 controls the AOM driving unit 96 to output a driving signal (high-frequency signal) that is turned on. When the pixel data is “0”, the AOM driving unit 96 controls the AOM driving unit 96. Control is performed so that the drive unit 96 outputs a drive signal (high-frequency signal) that is off. As described above, when the ON drive signal is sent, the drawing optical element 32 diffracts the incident laser light LB and directs it toward the reflection mirror 38 so that the spot light SP irradiated onto the substrate P is The intensity is set to a high level, and when an OFF drive signal is sent, the incident laser light LB is transmitted to the absorber 34 side to lower the intensity of the spot light SP radiated on the substrate P to a low level (for example, zero level). ).

  More specifically, first, the control unit 90 starts pattern exposure on the installation azimuth line Le2 (drawing lines L1, L3, L5) by transporting the substrate P by rotation of the rotary drum 22, based on the alignment position information. It is determined whether or not the position on the substrate P has arrived. Here, based on the alignment position information, the rotational position of the rotating drum 22 (average of CT1a and CT1b) on the installation azimuth line Le1 when the position on the substrate P where exposure of the pattern is started on the installation azimuth line Le1 is conveyed. Value) Ac1 can be grasped. The rotation position Ac1 of the rotating drum 22 at this time is called an exposure start position SAc1. Therefore, if the rotation position Ac2 (the average value of CT2a and CT2b) Ac2 of the installation azimuth line Le2 calculated by the rotation position calculation unit 84 becomes the exposure start position SAc1, the installation azimuth line It is determined that the position on the substrate P at which pattern exposure is to be started has reached Le2. The control unit 90 of the drawing unit drive control units CU2, CU4, and CU6 determines that the rotation position (the average value of CT3a and CT3b) Ac3 of the rotary drum 22 at the installation azimuth line Le3 calculated by the rotation position calculation unit 84 is equal to the exposure start time. If the position SAc1 has been reached, it is determined that the position on the substrate P at which pattern exposure is to be started has reached the installation azimuth line Le3 (drawing lines L2, L4, L6).

  Then, the control unit 90 of the drawing unit drive control units CU1, CU3, and CU5 becomes a control target after determining that the position on the substrate P at which pattern exposure is started has been conveyed onto the drawing lines L1, L3, and L5. When start signals st1, st3, and st5 are sent from the drawing units U1, U3, and U5, the pixel data of the pixel data column in the 0th column of the pattern data BM1, BM3, and BM5 is synchronized with the clock signal CLK by 0 rows. The images are output to the AOM driving unit 96 in order from the eyes. Thus, the intensity of the spot light SP scanned along the drawing lines L1, L3, L5 can be modulated according to the 0th pixel data column.

  When the start signals st1, st3, and st5 are sent again from the drawing units U1, U3, and U5, the control unit 90 of the drawing unit drive control units CU1, CU3, and CU5 transmits the pattern data BM1, BM3, and BM5. The pixel data of the next pixel data column is output to the AOM driving unit 96 in order from the 0th row in synchronization with the clock signal CLK. Thus, the intensity of the spot light SP scanned along the drawing lines L1, L3, L5 can be modulated according to the first pixel data column. As described above, when the position on the substrate P at which pattern exposure is started arrives at the drawing lines L1, L3, L5 of the drawing units U1, U3, U5, the spot light SP is generated according to the pattern data BM1, BM3, BM5. Since the spot light SP is scanned along the drawing lines L1, L3, L5 while the intensity is modulated, the substrate P can be irradiated with a light pattern corresponding to the pattern data BM1, BM3, BM5.

  Here, when the rotating drum 22 is slightly eccentrically rotated due to a manufacturing error of the bearing 62a or the like (when a rotating error occurs), the center axis AX is shifted with respect to the Y direction according to the rotating position of the rotating drum 22. Tilt by Δθ. Since the substrate P is transported while being wound around the rotary drum 22, when the center axis AX is inclined with respect to the Y direction (when a rotation error occurs), the drawing lines L1 to L6 are formed in the width direction of the substrate P. I will tilt. Therefore, the drawing lines L1, L3, and L5 are separated from the drawing lines L2, L4, and L6 due to the rotation error as shown in FIG. FIG. 7 exaggerates the drawing lines L1 to L6 with respect to the width direction of the substrate P. However, the actual inclination is at most about ± 2 °, and in practice, ± 2 °. Within 1 °. In the example shown in FIG. 7, the drawing lines L3 and L5 and the drawing lines L2 and L4 overlap near the drawing start position in the width direction of the substrate P. Conversely, the drawing end positions of the drawing lines L1, L3, L5 and the drawing lines L2, L4, L6 are separated from each other in the width direction of the substrate P. As described above, when the rotating drum 22 rotates eccentrically, the exposure area W of the substrate P cannot be covered with all the drawing lines L1 to L6. Further, since the drawing lines L1 to L6 are inclined with respect to the width direction of the substrate P, the exposure region W also has a shape (parallelogram) distorted according to the rotation error. Since the inclination of the central axis AX in the Y direction, that is, Δθ, changes in accordance with the eccentric rotation of the rotary drum 22, the central axis AX (Δθ) has a periodic change characteristic. In FIG. 7, the central axis AX of the rotary drum 22 is exaggeratedly inclined with respect to the Y direction for easy understanding.

  Therefore, in the first embodiment, the eccentricity of the rotary drum 22 is adjusted by rotating the exposure head 18 on the XY plane according to the periodic change characteristic of the central axis AX that changes with the rotation of the rotary drum 22. The inclination of the drawing lines L1 to L6 with respect to the center axis AX due to the rotation is corrected. Specifically, the second inclination measuring unit 100 of the control unit 82 calculates the difference value (count value of CT2a−count value of CT2b) Dc2 of the count values of the counter circuits CT2a and CT2b, and counts the count values of the counter circuits CT3a and CT3b. A difference value (count value of CT3a−count value of CT3b) Dc3 is calculated. The difference value Dc2 indicates a rotation error (difference value of the rotational position) at both ends of the rotating drum 22 in the installation azimuth line Le2, and the difference value Dc3 indicates a rotation error (rotation error at both ends of the rotating drum 22 in the installation azimuth line Le3. (Difference value of rotational position). When the difference values Dc2 and Dc3 fluctuate due to the eccentric rotation of the rotating drum 22, as shown in FIG. 8, the difference values Dc2 and Dc3 fluctuate periodically. When the rotary drum 22 does not rotate eccentrically, the difference values Dc2 and Dc3 become zero.

  The second inclination measuring unit 100 calculates the periodic change of the central axis AX of the rotary drum 22 on the XY plane caused by the eccentric rotation of the rotary drum 22 from the fluctuation of the difference values Dc2 and Dc3 calculated by rotating the rotary drum 22 once. The second information related to the characteristic is measured. The periodic change characteristic of the central axis AX is, specifically, a change characteristic of the inclination of the central axis AX with respect to the Y direction. The second information may be measured by rotating the rotating drum 22 a plurality of times and calculating an average value of the difference values Dc2 and Dc3 at each rotation position of the rotating drum 22 on the installation azimuth lines Le2 and Le3. . The second information is measured in advance, and is recorded on a recording medium (not shown) of the second inclination measuring unit 100.

  The movement control unit 102 of the control unit 82 controls the movement mechanism 68 based on the second information measured by the second inclination measurement unit 100, so that the movement mechanism 68 rotates the exposure head 18 on the XY plane. Thereby, even when the rotary drum 22 rotates eccentrically, the influence of the eccentric rotation can be eliminated, and the distortion of the area where the pattern is drawn by the drawing units U1 to U6 can be suppressed. That is, the central axis AX of the rotating drum 22 (the width direction of the substrate P) and the scanning direction of the drawing lines L1 to L6 can be made parallel. Since the second information is information that periodically changes due to the rotation of the rotary drum 22, the movement control unit 102 rotates the exposure head 18 so that the rotation position of the exposure head 18 also periodically changes accordingly.

  Further, due to an installation error or a manufacturing error of the polygon mirror 46, each of the drawing lines L1 to L6 where the spot light SP is scanned may be independently inclined with respect to the center axis AX of the rotating drum 22. Therefore, even if the exposure head 18 is rotated according to the eccentric rotation of the rotary drum 22, it is not possible to correct up to the individual inclination of the drawing lines L (L1 to L6) of the respective drawing units U1 to U6. Therefore, each of the regions where the pattern is drawn by each of the drawing units U1 to U6 is distorted instead of a rectangle (a parallelogram), and as a result, the entire exposure region W is distorted. Therefore, in the first embodiment, by correcting the pattern data, the area in which the pattern generated by the inclination of each of the drawing lines L (L1 to L6) of the drawing units U1 to U6 with respect to the central axis AX is drawn. Correct the distortion.

  First, a line pattern LP as shown in FIG. 9 is formed on the surface of the rotating drum 22 in order to measure the inclination of each of the drawing lines L1 to L6. This line pattern LP is formed so that the reflectance is higher than the other surface of the rotating drum 22. The line pattern LP is inclined at a predetermined inclination angle α with respect to the central axis AX, and is formed for each of the divided regions in the width direction of the substrate P on which the spot light SP is scanned by each of the drawing units U1 to U6. It has one line LP1 and a second line LP2 that extends along the longitudinal direction of the substrate P and is formed for each region divided in the width direction of the substrate P. The second line LP2 is formed so as to pass through a predetermined position (for example, a center position) in the width direction of each region divided in the width direction of the substrate P. The area divided in the width direction of the substrate P on which the spot light SP is scanned by each of the drawing units U1 to U6 is an area where a pattern is drawn by each of the drawing lines L1 to L6. Note that the first line LP1 is preferably longer in the width direction of the substrate P than the region where the pattern is drawn by the drawing lines L1 to L6.

  Then, the test substrate P is wound around the rotating drum 22, and the drawing units U1 to U6 scan the spot light SP at least twice along the drawing lines L1 to L6. The test substrate P is formed of a transparent material that is less likely to be deformed by tension. When each of the drawing units U1 to U6 scans the spot light SP along the drawing lines L1 to L6, the drawing lines L1 to L6 and the line pattern LP are formed. (Here, for example, formed of a metal film of aluminum, chromium, copper, or the like having a high reflectance), the irradiated spot light SP is reflected. The reflected spot light SP enters the beam splitter 44 via the cylindrical lens 52, the f-θ lens 50, the reflection mirror 48, and the polygon mirror 46. The spot light SP incident on the beam splitter 44 passes through the beam splitter 44 and is incident on a photodetector 104 (see FIGS. 3 and 6) provided in each of the drawing units U1 to U6. The light detector 104 detects a luminance value of the incident light. The brightness values sr1 to sr6 detected by the photodetectors 104 of the drawing units U1 to U6 are sent to the drawing unit drive control units CU1 to CU6, and the control units 90 of the drawing unit drive control units CU1 to CU6 send The obtained brightness values sr1 to sr6 are output to the control unit 82.

  The first tilt measuring unit 106 of the control unit 82 determines the tilt of the drawing lines L1 to L6 with respect to the central axis AX of the rotating drum 22 based on the luminance values sr1 to sr6 sent from the drawing unit drive control units CU1 to CU6. Is measured (the inclination angle β of the drawing line L). Hereinafter, measurement of the inclination angle β of the drawing lines L1 to L6 with respect to the center axis AX of the rotating drum 22 will be described with reference to FIGS. Since the method of measuring the inclination angle β of the drawing lines L1 to L6 with respect to the center axis AX is the same, the measurement of the inclination angle β of the drawing line L1 with respect to the center axis AX will be described. When measuring the inclination angle β, the AOM drive unit 96 continues to output an ON drive signal to the drawing optical element 32 based on the test pattern data BM, and the movement control unit 102 It is assumed that the moving mechanism 68 is controlled based on the second information measured by the second inclination measuring unit 100. This makes it possible to eliminate the influence of the eccentric rotation of the rotating drum 22 when measuring the first information.

  As shown in FIG. 10, when the spot light SP emitted from the drawing unit U1 is scanned along the drawing line L1, if the drawing line L1 intersects the line pattern LP, the photodetector is located at the intersection. The luminance value sr1 detected by 104 increases. Specifically, when the spot light SP scans along the drawing line L1, a photodetector is detected at an intersection a between the second line LP2 and the drawing line L1 and an intersection b between the first line LP1 and the drawing line L1. The luminance value detected by 104 increases. Since the spot light SP scans along the drawing line L1 from the −Y direction side to the + Y direction side, in the example shown in FIG. 10, the photodetector 104 detects the spot light SP first reflected at the intersection a. The luminance value is detected, and then the luminance value of the spot light SP reflected at the intersection b is detected.

  Thereafter, when the scanning of the spot light SP is started again after a certain time has elapsed, the spot light SP is scanned by the drawing line L1. By the time the scanning of the next spot light SP is started, the substrate P has been transported by ΔXu. Therefore, as shown in FIG. The position is a position where the spot light SP is shifted in the −X direction by ΔXu from the position of the drawing line L <b> 1 on the substrate P scanned last time. In FIG. 11, the previous drawing line L1 is indicated by a broken line, and the luminance value of the intersection b detected by the photodetector 104 by the previous scanning of the spot light SP is indicated by a broken line.

As shown in FIG. 11, when the spot light SP newly scans along the drawing line L1, an intersection c between the first line LP1 and the drawing line L1, and an intersection a 'between the second line LP2 and the drawing line L1 are set. Thus, the luminance value detected by the photodetector 104 increases. Since the spot light SP scans along the drawing line L1 from the −Y direction side to the + Y direction side, in the example shown in FIG. 11, the photodetector 104 detects the spot light SP reflected at the intersection c first. The luminance value is detected, and then the luminance value of the spot light SP reflected at the intersection point a 'is detected. Here, since the second line LP2 extends along the longitudinal direction of the substrate P, the intersection a and the intersection a 'are at the same position in the width direction of the substrate P (the axial direction of the central axis AX). The inclination angle β of the drawing line L1 can be expressed by Expression (1) from FIG.
β = arctan (ΔX2 / ΔYu) (1)

  This ΔYu indicates a distance according to a difference in timing at which the spot light SP is reflected on the first line LP1 when the spot light SP is scanned twice. That is, the timing at which the photodetector 104 detects the spot light SP reflected on the first line LP1 from the start of the first scan, and the spot light reflected on the first line LP1 from the start of the second scan. The distance according to the difference from the timing at which the photodetector 104 detects SP is shown. Specifically, ΔYu indicates a distance between the intersection point b and the intersection point c in the central axis AX direction. This ΔYu is determined by the number of rotations of the polygon mirror 46 (scanning speed of the spot light SP) and the number of spot light SPs irradiated until the spot light SP is scanned from the intersection c to the intersection b (the count value of the clock signal CLK). ). In the example shown in FIG. 11, ΔYu is the sum of the distance between the intersection point a and the intersection point b in the central axis AX direction and the distance between the intersection point c and the intersection point a ′ in the central axis AX direction. Therefore, the number of spot light SPs emitted before the spot light SP is scanned from the intersection c to the intersection b is the number of spot light SPs emitted until the spot light SP is scanned from the intersection a to the intersection b. And the number of spot light SPs irradiated until the spot light SP is scanned from the intersection c to the intersection a '.

Further, ΔX2 can be represented by Expression (2).
ΔX2 = ΔXu−ΔX1
⇔ΔX2 = ΔXu−ΔYu × tanα (2)

Therefore, by substituting Equation (2) into Equation (1), the inclination angle β can be expressed by Equation (3).
β = arctan (ΔXu / ΔYu-tanα) (3)

  As described above, the first inclination measuring unit 106 can obtain the inclination angle β of the drawing line L1 from ΔYu, ΔXu, and the known inclination angle α using Expression (3). Note that ΔXu can be obtained from the rotation speed of the rotary drum 22 and the time from the start of the first scan to the start of the second scan.

  The pattern data correction unit 108 of the control unit 82 measures the pattern data (reference pattern data) BMs1 to BMs6 serving as references for the respective drawing units U1 to U6 stored in the pattern data storage unit 110 by the first inclination measurement unit 106. The correction is performed based on the inclination angles β of the drawn lines L1 to L6. The corrected pattern data becomes the reference pattern data BMs1 to BMs6. Then, the pattern data correction unit 108 stores the corrected pattern data BMs1 to BMs6 in the memory unit 94 of the drawing unit drive control units CU1 to CU6 as pattern data BM1 to BM6. When the inclination angle β is 0 degree, the pattern data correction unit 108 stores the pattern data BMs1 to BMs6 in the memory unit 94 as pattern data BM1 to BM6 without correcting the pattern data BMs1 to BMs6.

  If the drawing lines L1 to L6 are inclined at an inclination angle β with respect to the central axis AX, that is, if the drawing lines L1 to L6 are not parallel to the central axis AX, a pattern is drawn by each of the drawing units U1 to U6. The region to be formed becomes a parallelogram. FIG. 12A is a conceptual diagram of the pattern data BMs1 stored in the pattern data storage unit 110. As shown in FIG. 12A, the pattern data BMs1 has a pattern in which the direction along the scanning direction (vertical direction) of the spot light SP is set as a row, and the direction along the transport direction (horizontal direction) of the substrate P is set as a column. It is matrix-like data composed of a plurality of pixel data decomposed into dimensions. When the drawing line L1 is inclined at an inclination angle β with respect to the central axis AX, even if a pattern is drawn based on this pattern data BMs1, the area of the pattern to be drawn (exposure area W) is as shown in FIG. As shown, the shape becomes a parallelogram.

  Therefore, even when the drawing lines L1 to L6 are inclined with respect to the central axis AX, the drawing area of each drawing line L1 to L6 is formed in order to make the area where the pattern is drawn by each of the drawing units U1 to U6 square. The pattern data BMs1 to BMs6 are corrected according to the inclination angle β. FIG. 13A is a conceptual diagram of the corrected pattern data BMs1. By shifting the pixel data of the pattern data BMs1 in the column direction (horizontal direction) in units of rows in accordance with the inclination angle β of the drawing line L1, the pixels arranged in the row direction of the pattern data BMs1 as shown in FIG. As shown in FIG. 13A, the direction of the data is inclined at an angle of -β with respect to the row direction (vertical direction). Accordingly, as shown in FIG. 13B, even when the drawing line L1 is inclined at an inclination angle β with respect to the central axis AX, the area of the pattern to be drawn (exposure area W) is made substantially rectangular. be able to. The drawing optical elements 32 of the drawing units U1 to U6 are supplied with ON / OFF drive signals in accordance with the pattern data BMs1 to BMs6 (BM1 to BM6). , There is a portion without pixel data in a part of the row direction (vertical direction). For the portion where no pixel data exists, an off drive signal is input to the drawing optical element 32. That is, when the pixel data of the pattern data BMs1 is “1”, an on drive signal is input to the drawing optical element 32;

  As described above, the first inclination measuring unit 106 determines the pattern data in accordance with the first information (inclination angle β) on the individual inclination of each of the drawing lines L1 to L6 caused by an installation error of the polygon mirror 46 and the like, a manufacturing error, and the like. BMs1 to BMs6 are corrected, and the corrected pattern data BMs1 to BMs6 are stored in the memory unit 94 as pattern data BM1 to BM6. it can.

  As described above, in the first embodiment, first, the exposure head 18 is rotated based on the second information on the periodic change characteristic of the central axis AX caused by the eccentric rotation of the rotary drum 22. In addition, the influence of the eccentric rotation of the rotary drum 22 can be eliminated, and the distortion of the area where the pattern is drawn by the drawing units U1 to U6 can be suppressed. Further, while the exposure head 18 is rotated based on the second information, the first information regarding the inclination of each of the drawing lines L1 to L6 is measured, and the pattern data BMs1 to BMs6 are corrected based on the measured first information. Then, pattern data BM1 to BM6 are generated. Thus, by modulating the intensity of the spot light SP scanned along the drawing lines L1 to L6 using the generated pattern data BM1 to BM6, each of the drawing lines L1 to L6 is moved with respect to the central axis AX. Therefore, even if they are tilted independently, distortion of a region where a pattern is drawn by the drawing units U1 to U6 can be suppressed, and a decrease in exposure accuracy can be suppressed.

  When each of the drawing lines L1 to L6 is inclined with respect to the width direction of the substrate P, as shown in FIG. 7, the joints of the drawing lines L1 to L6 overlap or separate. The drawing unit drive controllers CU1 to CU6 move the positions of the drawing lines L1 to L6 in the scanning direction in accordance with the relative inclinations of the drawing lines L1 to L6 so that the drawing lines L1 to L6 are joined in the Y direction. shift. That is, the drawing start timing of the spot light SP is changed according to the drawing data sequence. The relative inclinations of the drawing lines L1 to L6 can be obtained based on the inclination angle β of each drawing line L1 measured by the first inclination measuring unit 106.

  As an example of a method of shifting the drawing line L in the scanning direction, for example, the control unit 90 of each of the drawing unit drive control units CU1 to CU6 receives the start signals st1 to st6 and then converts the pixel data of the drawing data string. The timing of outputting to the AOM driving unit 96 is changed. That is, the position of the drawing lines L1 to L6 is shifted in the scanning direction by delaying or increasing the timing of outputting the pixel data of the drawing data string to the AOM driving unit 96. By delaying the timing (drawing start timing) of outputting the pixel data of the drawing data string to the AOM driving unit 96 after receiving the start signals st1 to st6, the drawing line L1 can be shifted to the + Y direction side, Conversely, by advancing the drawing start timing, the drawing line L1 can be shifted to the −Y direction side.

  Another example of a method of shifting the drawing line L in the scanning direction is a method of correcting the pattern data BMs1 to BMs6 so as to obtain the same result as shifting the drawing line L in the scanning direction. There is. That is, the pattern data correction unit 108 corrects the pattern data BMs1 to BMs6 according to the inclination of the drawing lines L1 to L6 measured by the first inclination measurement unit 106. The corrected pattern data BM1 to BM6 are stored in the memory unit 94. With the corrected pattern data BMs1 to BMs6, the area where the pattern is drawn by the drawing units U1 to U6 can be made substantially rectangular, and the drawing lines L1 to L6 can be joined in the width direction of the substrate P ( The areas where the patterns are drawn by the drawing units U1 to U6 can be joined together). In the example shown in FIG. 13A, the pixel data of the pattern data BMs is shifted in the column direction (horizontal direction) on a row basis. Although not shown, the correction of the data BMs is performed by shifting the pixel data of the pattern data BMs in the row direction (vertical direction) on a column basis. Thereby, the drawing lines L1 to L6 can be joined in the width direction of the substrate P.

[Modification]
The first embodiment may be modified as follows.

  (Modification 1) In the first embodiment, the influence of the eccentric rotation of the rotary drum 22 is eliminated while rotating the exposure head 18 based on the second information measured by the second inclination measuring unit 100. While the inclination angle β (first information) of the drawing lines L1 to L6 with respect to the center axis AX was measured, in the first modification, the first information was directly input without eliminating the influence of the eccentric rotation of the rotary drum 22. It may be measured. In this case, the second inclination measuring unit 100 measures the second information using the first information measured by the first inclination measuring unit 106 without using the encoder heads EN2a, EN2b, EN3a, and EN3b.

  Therefore, in the first modification, when the rotating drum 22 is eccentrically rotating, the inclination angle β of the drawing lines L1 to L6 measured by the first inclination measuring unit 106 with respect to the center axis AX is determined by the rotation position of the rotating drum 22. Fluctuates periodically in accordance with. Accordingly, the second inclination measuring unit 100 calculates the periodically changing inclination angles of the drawing lines L1 to L6 based on the inclination angles β (first information) of the drawing lines L1 to L6 at each rotation position of the rotary drum 22. By calculating the change characteristic of β, the second information on the periodic change characteristic of the central axis AX that changes with the rotation of the rotary drum 22 is measured. In the first modification, the second information on the periodic change characteristic of the central axis AX that changes due to the rotation of the rotary drum 22 is measured from the change characteristic of the periodically changing inclination angle β of each of the drawing lines L1 to L6. Therefore, the second information can be measured more accurately than in the first embodiment in which the second information is measured from the rotational positions on both ends of the rotary drum 22.

  The movement control unit 102 controls the movement mechanism 68 based on the second information measured by the second inclination measurement unit 100, so that the rotation position of the exposure head 18 changes periodically. To rotate. Further, the pattern data correction unit 108 calculates the inclination angle β that changes periodically from the inclination angle β with respect to the central axis AX of the drawing lines L1 to L6 at each rotation position of the rotary drum 22 measured by the first inclination measurement unit 106. The inclination angle β ′ from which the change characteristic has been removed is calculated, and the pattern data BMs1 to BMs6 are corrected based on the inclination angle β ′. The inclination angle β ′ is an inclination angle of the drawing lines L1 to L6 of the individual drawing units U1 to U6 which is not affected by the eccentric rotation of the rotary drum 22 and is caused by an installation error of the polygon mirror 46 and the like, a manufacturing error, and the like.

  The second information is obtained from the first information, and the exposure head 18 is rotated so that the rotation position of the exposure head 18 periodically changes based on the second information. Is also good. In this case, by correcting the pattern data BMs1 to BMs6 based on the inclination angle β, the effects of the eccentric rotation of the rotary drum 22 and the individual inclination angles β ′ of the drawing lines L1 to L6 may be eliminated. . In this case, the pattern data BMs1 to BMs6 at each rotation position of the rotary drum 22 are generated, and the pattern data BMs1 to BMs6 at each rotation position of the rotary drum 22 are generated by the pattern data at each rotation position of the rotary drum 22. It is stored in the memory unit 94 as BM1 to BM6.

  (Modification 2) In the first embodiment, the exposure head 18 (based on the second information about the periodic change characteristic of the central axis AX of the rotary drum 22 on the XY plane caused by the eccentric rotation of the rotary drum 22). The second optical surface plate 70) is rotated to correct the pattern data BMs1 to BMs6 based on the individual inclination angles β of the drawing lines L1 to L6 to generate the pattern data BM1 to BM6. The rotary drum 22 may be rotated in consideration of the information. For example, the exposure head 18 may be rotated based on the average value of the inclination angles β of the drawing lines L1 to L6 and the second information. This makes it possible to reduce the correction amount of the pattern data BMs1 to BMs6 as compared with the case where the pattern data BMs1 to BMs6 are corrected based on the inclination angles β of the drawing lines L1 to L6. In addition, based on the inclination information β and the second information, the inclinations of the plurality of drawing lines L1 to L6 are corrected so that the inclinations of some of the drawing lines L having the same inclination angle β are corrected. The exposure head 18 may be rotated. As a result, some drawing lines L having the same inclination angle β are parallel to the central axis AX, so that it is not necessary to correct the pattern data BMs of the drawing unit U corresponding thereto.

  (Modification 3) In the first embodiment, the line pattern LP is formed on the surface of the rotary drum 22. However, as shown in FIG. 14, the line pattern LP is formed on the surface of the test substrate P. Is also good. In this case, the first line LP1 is inclined at an inclination angle α with respect to the width direction of the substrate P. In this case, the width of the test substrate P may be inclined with respect to the center axis AX of the rotary drum 22 and the test substrate P may be wound around the rotary drum 22. Is tilted with respect to the center axis AX of the rotating drum 22, the tilt angle α of each of the drawing lines L1 to L6 with respect to the center axis AX cannot be obtained. However, even in such a case, the relative inclination of each of the drawing lines L1 to L6 can be obtained. Therefore, by correcting the pattern data BMs1 to BMs6 based on the relative inclination, the shapes of the regions where the patterns are exposed by the drawing units U1 to U6 can be made uniform.

  (Modification 4) In the first embodiment, the inclination angle β of each of the drawing lines L1 to L6 is calculated using the line pattern LP. However, plating processing by the process device PR2 or development / etching Based on the pattern formed by the processing, the first information on the relative inclination of the drawing lines L1 to L6 may be measured.

  More specifically, as shown in FIG. 15, the device manufacturing system 10 includes an alignment microscope AMa (AMa1 to AMa7) that captures an image of a position of a joint portion (end portion) of the drawing lines L1 to L6. The alignment microscope AMa (AMa1 to AMa7) is provided at a position where an image of the test substrate P that has been subjected to plating or development / etching by the process apparatus PR2 can be taken. In FIG. 15, the drawing lines L1 to L6 are indicated by broken lines for the sake of simplicity in order to make it easy to see the joint between the drawing lines L1 to L6.

  Each of the drawing units U1 to U6 scans the spot light SP whose intensity is modulated based on the pattern data BMt1 to BMt6 corresponding to the test pattern along the drawing lines L1 to L6, so that the surface of the test substrate P is scanned. Draw a test pattern. Thereafter, a test pattern is formed by a plating process or a development / etching process by the process device PR2. The pattern data BMt1 to BMt6 corresponding to the test pattern are set so that the pattern to be drawn has a cross shape at least in the vicinity of the connection of the drawing lines L1 to L6, and the pattern is written by the drawing units U1 to U6. The position on the substrate P where the drawing is performed is set to be the same position.

  Reference numeral 250 in FIG. 15 is an enlarged observation region of the alignment microscope AMa7, reference numeral 252 is an enlarged observation region of the alignment microscope AMa6, and reference numeral 254 is an observation region of the alignment microscope AMa5. It is an expansion of. The pattern 256 in the observation region 250 indicates a pattern formed at the end of the drawing line L6 on the + Y direction side. A pattern 258 in the observation region 252 indicates a pattern formed at an end (joint portion) on the −Y direction side of the drawing line L6, and a pattern 260 is an end (joint portion) on the + Y direction side of the drawing line L5. 2 shows the pattern formed. The pattern 262 in the observation region 254 indicates a pattern formed at the end (joint portion) of the drawing line L5 on the −Y direction side, and the pattern 264 is the end (joint) of the drawing line L4 on the + Y direction side. (Part) is shown. Each of the patterns 256 to 264 has a cross shape.

  Then, the first inclination measuring unit 106 recognizes the shape of the test pattern at the joint between the drawing lines L1 to L6 based on the image data of the observation region captured by the alignment microscope AMa (AMa1 to AMa7). First information regarding the relative inclination of the drawing lines L1 to L6 is measured. Specifically, the intersection of the cross portion of the pattern 256 recognized at the end of the drawing line L6 on the + Y direction side and the intersection of the cross portion of the pattern 258 recognized at the end of the drawing line L6 on the −Y direction side. Based on this, the inclination of the drawing line L6 can be obtained. Further, based on the intersection of the cross part of the pattern 260 recognized at the end of the drawing line L5 on the + Y direction side and the intersection of the cross part of the pattern 262 recognized at the end of the drawing line L5 on the −Y direction side, The inclination of the drawing line L5 can be obtained. The inclinations of the other drawing lines L can be similarly obtained. Since the obtained inclinations of the drawing lines L1 to L6 are not absolute inclinations (for example, inclinations with respect to the center axis AX), the inclinations of the drawing lines L1 to L6 are determined based on the obtained inclinations of the drawing lines L1 to L6. Find the relative inclination of each other. By correcting the pattern data BMs1 to BMs6 based on the relative inclination, the shapes of the areas where the patterns are exposed by the drawing units U1 to U6 can be made uniform.

  When a photochromic layer is applied to the surface of the test substrate P, the alignment microscope AMa (AMa1 to AMa7) is moved downstream of the exposure head 18 in the transport direction of the substrate P (+ X direction side). And may be arranged near the exposure head 18. When the photochromic layer is irradiated with the laser light LB (spot light SP), the contrast thereof changes. Therefore, by imaging the pattern drawn by each of the drawing units U1 to U6 of the exposure head 18 with the alignment microscope AMa (AMa1 to AMa7), the drawn pattern can be recognized by image recognition.

  (Modification 5) In the first embodiment, the line pattern LP is composed of the plurality of first lines LP1 and the second lines LP2. However, the line pattern LP is composed of the plurality of first lines LP1. You may comprise. That is, the second line LP2 may not be provided. Even if the second line LP2 is not provided, ΔYu can be obtained. However, since there is no reference position for obtaining ΔYu, ΔYu is determined in the transport state of the test substrate P (in the X direction of the test substrate ΔYu changes due to the inclination of the drawing lines, but the relative inclination of each of the drawing lines L1 to L6 can be obtained.

  (Modification 6) In the first embodiment, one spot light SP is irradiated to one pixel. However, two spot lights SP are applied along the main scanning direction and the sub-scanning direction. It may be set so that irradiation is performed on one pixel. In this case, the number of pixel data in the row direction is の of the number of spot lights SP irradiated along the drawing line L. Therefore, the control unit 90 of the drawing unit drive control units CU1 to CU6 converts the pixel data of one column (pixel data column) to the 0th row in synchronization with the clock signal CP obtained by dividing the clock signal CLK by １ ／. , To the AOM drive unit 96 in order. In addition, since the number of pixel data in the column direction is の of the number of spot lights SP radiated in the sub-scanning direction, the control units 90 of the drawing unit drive control units CU1 to CU6 transmit a start signal ( Each time the origin signals (st1 to st6) are generated twice, the pixel data sequence of the pattern data BM1 to BM6 to be output is shifted in the column direction.

  Specifically, when the start signals st1 to st6 are transmitted from the drawing units U1 to U6, the control units 90 of the drawing unit drive control units CU1 to CU6, for example, change the pixel data of the pixel data column of the 0th column. The data is output to the AOM driving unit 96 in order from the 0th row in synchronization with the clock signal CP. Then, when the start signals st1 to st6 are transmitted again from the drawing units U1 to U6, the pixel data of the pixel data column of the 0th column is again synchronized with the clock signal CP and sequentially from the 0th row to the AOM driving section 96. Output to After that, when the start signals st1 to st6 are sent from the drawing units U1 to U6, the output columns are shifted and the pixel data of the first pixel data column is sequentially synchronized with the clock signal CP from the 0th row. Output to the AOM drive unit 96. In this manner, the columns of the pixel data columns output in response to the generation of the start signals st1 to st6 are 0th column → 0th column → first column → first column → second column → second column → 3 Each time a pixel data sequence of the same column is output twice, for example, in the column, the output pixel data sequence is shifted in the column direction.

  (Modification 7) It is also possible to combine the above Modifications 1 to 6 with each other as long as no contradiction occurs.

[Second embodiment]
Next, a second embodiment will be described. FIG. 16 is a diagram illustrating an exposure apparatus EX according to the second embodiment. The same components as those in the first embodiment (including the modifications) are denoted by the same reference numerals, and description thereof will be omitted. In addition, components that are not necessary for describing the second embodiment are not shown.

  The substrate P supplied from the supply roll FR is transported while being wound and transported in the longitudinal direction in the order of the rollers R11, R12, R13, and R14, and then wound around about half of the outer peripheral surface of the rotary drum 22. Is sent to the process device PR2 via the roller R15. The rotation axis of the supply roll FR is parallel to the Y direction, and is provided in the drive unit 200 that is movable in the Y direction. The drive unit 200 is positioned in the Y direction with a precision of the order of millimeters or less, for example, a precision of about ± 0.5 mm by a drive control unit 202 including a servomotor or the like.

  The drive control unit 202 is based on a signal from an edge sensor (edge detection unit) 204 that measures the position in the Y direction of an edge (edge) in the width direction of the substrate P provided between the rollers R11 and R12. By controlling the driving unit 200, the substrate P is positioned in the width direction immediately before the substrate P is supported by the rotating drum 22. The supply roll FR, the drive unit 200, the drive control unit 202, the edge sensor 204, and the rollers R11 and R12 form an EPC (edge position controller) mechanism integrated with the supply roll FR. In the second embodiment, the supply roll FR and the EPC mechanism are integrated. However, as in the first embodiment, the supply roll FR and the EPC mechanism are separated. You may. In this case, the drive unit 200 is provided with an adjustment roller instead of the supply roll FR. The substrate P supplied from the supply roll FR is applied to the adjusting roller in a state where a predetermined tension is applied, and the driving unit 200 moves the adjusting roller in the Y direction. The positioning accuracy (± 0.5 mm) by the EPC mechanism is not so high in the exposure apparatus (drawing apparatus) EX that performs patterning on the order of microns, and when the winding unevenness of the substrate P on the supply roll FR is large, the rotation is not performed. This means that the substrate P wound around the drum 22 shifts at most about ± 500 μm in the Y direction. The roller R13 is a roller for adjusting tension, and stabilizes the longitudinal tension applied to the substrate P before the substrate P is applied to the rotary drum 22 within a predetermined range. This roller R13 is urged in the + Z direction.

  A first optical surface plate 206 supported by a main body frame (not shown) is provided above the rotating drum 22, and the second optical surface plate 208 is placed on the first optical surface plate 206 via a bearing structure 210. Is provided. The surfaces of the first optical surface plate 206 and the second optical surface plate 208 are parallel to each other. The second optical surface plate 208 is capable of minute movement with respect to the first optical surface plate 206 on the XY plane. The second optical surface plate 208 arranges the drawing units U1, U3, and U5 on the upstream side (−X direction side) in the transport direction with respect to the center axis AX of the rotary drum 22 and in parallel along the Y direction of the substrate P. To support. The second optical surface plate 208 places the drawing units U2, U4, and U6 on the downstream side (+ X direction side) in the transport direction with respect to the center axis AX of the rotary drum 22 and in parallel along the Y direction of the substrate P. To support. A rectangular opening 208a is provided at the center of the second optical surface plate 208, and the beam emitting portions Ua of the plurality of drawing units U1 to U6 are supported by the rotating drum 22 through the opening 208a. To the substrate P. The first optical surface plate 206 below the opening 208a is provided with an opening 206a provided to avoid interference with the rotating drum 22.

  At both ends in the X direction of the second optical surface plate 208, the second optical surface plate 208 is rotated around the rotation axis I, or the second optical surface plate Fine movement drive units 212A and 212B for finely moving the optical surface plate 208 in the Y direction are provided.

  FIG. 17 is a diagram illustrating an arrangement configuration of the second optical surface plate 208 and the fine movement driving units 212A and 212B on the XY plane. The rotary drum 22 is located immediately below the central opening 208a of the second optical surface plate 208. The plurality of drawing units U1 to U6 are provided on the second optical surface plate 208 such that the beam emitting portions Ua of the plurality of drawing units U1 to U6 are arranged in a staggered manner in the opening 208a. Thereby, a plurality of drawing lines L1 to L6 are formed on the outer peripheral surface of the rotating drum 22. The rotation axis I is set so as to intersect with the central axis AX, and is set at the center of gravity of the geometric position of the plurality of drawing lines L1 to L6.

  Arm portions 214A and 214B protruding in the X direction are fixed to the end portions of the second optical surface plate 208 on the −X direction side and the + X direction side. A line connecting the center positions of the arm portions 214A and 214B in the Y direction is set to pass through the rotation axis I (intersect with the rotation axis I). By finely moving the arms 214A and 214B in the Y direction by the fine movement driving units 212A and 212B, respectively, the second optical surface plate 208 is finely translated in the Y direction or finely rotated about the rotation axis I. be able to.

  The fine movement drive unit 212 </ b> A is located near the end in the −X direction of the second optical surface plate 208, between both sides of the end in the Y direction, and the fixed portions 216 a and 216 b coupled to the first optical surface plate 206. Have L-shaped fractures (elastic members) 218a and 218b. Similarly, the fine-movement drive unit 212B also includes, near the end in the + X direction of the second optical surface plate 208, both sides of the end in the Y direction, and fixed portions 216a and 216b coupled to the first optical surface plate 206. L-shaped flexures 218a, 218b provided between them. The L-shaped flexures 218a and 218b are made of a metal having high rigidity, and at least a part of a portion extending in each of the X direction and the Y direction has a thickness in the XY plane which is smaller than a thickness in the Z direction. thin. Therefore, the L-shaped flexures 218a and 218b have the highest rigidity in the Z direction and relatively low rigidity in the XY plane. Further, since the arms of the L-shaped flexures 218a and 218b extending in the Y direction are set shorter than the arms extending in the X direction, the rigidity in the X direction is higher in the Y direction. Is higher than.

  When the four corners of the second optical surface plate 208 are supported by the fixing portions 216a and 216b coupled to the first optical surface plate 206 via two pairs of such L-shaped fractures 218a and 218b, the second optical surface Both sides of the board 208 in the X direction are supported by a link mechanism by a parallel leaf spring that can bend in the Y direction, so that a precise translational movement in the Y direction and a precise minute rotation about the rotation axis I are performed. Becomes possible. The L-shaped flexures 218a and 218b may have a structure in which a plurality of cuts are provided without changing the thickness, other than partially reducing the thickness of the arm.

  The fine-movement driving unit 212A includes an actuator 220A for finely moving the distal end of the arm 214A of the second optical surface plate 208 in the Y direction, and a spring 222A for urging the distal end of the arm 214A toward the actuator 220A. Having. The stator portion of the actuator 220A and the other end of the spring 222A are fixed to the first optical platen 206 side. The actuator 220A is of a type that converts the rotational force of an electromagnetically driven voice coil motor or linear motor, or a normal rotary motor into a linear drive force via a worm gear or a rack and pinion gear, or expands or contracts a piezo element. It is composed of a piezo motor used.

  The fine movement drive section 212B also has an actuator 220B and a spring 222B having the same configuration as the actuator 220A and the spring 222A, and the actuator 220B slightly moves the distal end portion of the arm section 214B of the second optical base 208 in the Y direction. However, the actuator 220B and the spring 222B are arranged point-symmetrically with the actuator 220A and the spring 222A with respect to the position of the rotation axis I.

  When both of the arm portions 214A and 214B are moved by the same amount in the + Y direction (or -Y direction) by driving the actuators 220A and 220B, the second optical surface plate 208 moves in the + Y direction (or -Y direction). Translate in parallel. When the actuators 220A and 220B are driven to move the arms 214A and 214B in different Y-directions to move the arms 214A and 214B, the second optical surface plate 208 is rotated about the rotation axis I. Can be rotated.

  For example, the second optical surface plate 208 is rotationally corrected so that the average inclination of the drawing lines L1 to L6 by the drawing units U1 to U6 in the XY plane (in the outer peripheral surface of the rotating drum 22) is corrected. You can keep. In this case, there is a possibility that the inclination error of each of the drawing lines L1 to L6 with respect to the central axis AX may be reduced as a whole, and it is necessary to reduce the inclination correction amount for the pattern data BMs1 to BMs6 handled by the individual drawing units U1 to U6. it can. Alternatively, the second optical surface plate 208 may be rotated and corrected so that the inclinations of some of the drawing lines L having the same inclination tendency among the drawing lines L1 to L6 are corrected. In this case, some of the drawing lines L1 to L6 are corrected so as to be parallel to the central axis AX by the correction by the minute rotation of the second optical surface plate 208. Therefore, the pattern data BMs of the drawing unit U corresponding thereto are corrected. It is not necessary to correct the inclination of the drawing line L.

  As will be described later, the meandering (± 500 μm) of the substrate P at an exposure position (position of the drawing lines L1 to L6) generated due to a response delay when correcting the position of the substrate P in the Y direction by the EPC mechanism. With respect to the following, the second optical surface plate 208 can be slightly shifted in the Y direction while the second optical surface plate 208 is maintained at a predetermined rotation angle position, so that pattern drawing following the meandering of the substrate P can be performed. Becomes possible. The moving mechanism 68 according to the first embodiment may be configured by the bearing structure 210 and the fine movement driving units 212A and 212B.

  FIG. 18 is an exaggerated view of the substrate P conveyed in a meandering manner in the first pattern drawing process for the substrate P. As shown in FIG. 16, the positioning of the substrate P in the Y direction is performed by the driving unit 200 based on the detection result of the edge sensor 204. Therefore, for example, if there is no large unevenness in the substrate P wound around the supply roll FR, the driving unit 200 hardly moves, and the substrate P is always wound at the same position on the outer peripheral surface of the rotary drum 22 in the Y direction.

  However, when a portion of the substrate P where large unevenness occurs in the supply roll FR is transported to the position of the edge sensor 204, a large error signal corresponding to a large displacement of the substrate P in the Y direction is output from the edge sensor 204. Is done. In response to the error signal, the drive unit 200 moves the supply roll FR in the Y direction so that the error signal from the edge sensor 204 becomes smaller. At this time, if the driving unit 200 is moved steeply, a stress in the width direction of the substrate P is generated between the supply roller FR and the roller R11 that is in frictional contact with the substrate P, and wrinkles are generated on the substrate P. . Therefore, the movement of the driving unit 200 in the Y direction restricts the responsiveness corresponding to the change in the error signal from the edge sensor 204, and makes the movement gentle. Therefore, even if a large displacement of the substrate P in the Y direction is detected at the position of the edge sensor 204, the driving unit 200 does not immediately correct the displacement and extends over a predetermined transport amount in the longitudinal direction of the substrate P. And gradually correct it. That is, the position of the substrate P in the Y direction is corrected with a response delay.

  In FIG. 18, the substrate P moves at a constant speed along a feed direction indicated by an arrow, during which time, the exposure head 18 (each of the drawing units U1 to U6) moves the substrate P into a rectangular shape along the long direction. The exposure areas W (W1, W2, W3, W4, W5,...) Are sequentially drawn on the substrate P. In the meantime, it is assumed that the edge sensor 204 that detects a change in the position of the edges Ea and Eb at both ends in the Y direction from the position Ha of the substrate P starts to generate a large error signal. In that case, the driving unit 200 works to correct the above, but due to the response delay, the substrate P is moved in the + Y direction on the rotating drum 22 in the vicinity of between the exposure area W2 and the exposure area W3 behind the position Ha. The substrate P is displaced (meandering) by ΔYss and wound around the substrate P, and thereafter, the meandering is gently corrected, and the substrate P is wound on the rotating drum 22 at the initial position in the Y direction at the position Hb. As described above, even when a large meandering occurs due to uneven winding of the supply roll FR or the like, the maximum displacement ΔYss is suppressed to 0.5 mm or less by the EPC mechanism.

  Then, in the first pattern drawing step (1st exposure step) on the substrate P, a pattern (electrode, wiring, etc.) for the first layer is drawn on each exposure region W on the substrate P. In the first exposure step, alignment marks Ks1 and Ks2 are arranged on both sides in the width direction of each exposure region W between the exposure regions W arranged along the longitudinal direction of the substrate P and between the exposure regions W. An alignment mark Ks3 is drawn at the center in the width direction of P.

  In the first exposure step, the pattern exposure and the alignment mark Ks () are performed by relying on the rotation accuracy (eccentricity, axial blur) of the rotary drum 22 and the drawing accuracy (joint accuracy, tilt correction accuracy, etc.) of each of the drawing units U1 to U6. Ks1 to Ks3) are performed. Therefore, the exposure area W where the pattern is exposed and the alignment marks Ks (Ks1 to Ks3) are exposed on the substrate P so as to be linearly aligned in the X direction. In the first exposure step, the influence of the eccentric rotation of the rotating drum 22 and the individual inclinations of the drawing lines L1 to L6 are eliminated by the method described in the first embodiment (including the modifications). ing. If the rotary drum 22 is not eccentrically rotating and the drawing lines L1 to L6 are not tilted or relatively tilted with respect to the central axis AX, the rotation of the exposure head 18 and the rotation of the pattern data BMs1 to BMs6 are performed. No correction has been made.

  When the substrate P is conveyed while meandering as shown in FIG. 18, the exposure area W and the alignment marks Ks (Ks1 to Ks3) are shifted in the Y direction with respect to the center line CA in the width direction of the substrate P. It will be. In particular, in the exposure regions W2, W3, and W4 located in the portion where the meandering of the substrate P is large, the Y-direction positions of the center points Sc2, Sc3, and Sc4 of the exposure region W vary with respect to the center line CA, and Exposure is performed with the outer shapes of W2, W3, and W4 slightly inclined with respect to the center line CA.

  FIG. 19 shows a first exposure step when a substrate P on which a pattern has been exposed is transported straight (without meandering) under the meandering transport of the substrate P shown in FIG. 5 is a diagram showing an error in the arrangement and deformation of an exposure region W where a pattern is exposed. In the second pattern drawing step (2nd exposure step) for the substrate P, the alignment microscopes AM (AM1 to AM3) sequentially detect the alignment marks Ks (Ks1 to Ks3) on the substrate P and write the drawing position (drawing line L1). To L6), the position errors ΔXp, ΔYp and the residual rotation error Δθp of the sheet substrate P in the X direction (long direction) and the Y direction (with respect to a line segment in the Y direction orthogonal to the center line CA in the width direction of the substrate P). The inclination error of each of the drawing lines L1 to L6) is measured on the order of microns and is generated as alignment position information. Therefore, as shown in FIG. 19, even when the positions and shapes of the exposure regions W2 to W4 are relatively largely deformed by the influence of meandering, each of the drawing units U1 to U6 is determined based on the errors ΔXp, ΔYp, and Δθp. By correcting the pattern data of the pattern drawn by the drawing lines L1 to L6 and the drawing start timing, a new pattern for the second layer is formed on the pattern for the first layer already formed on the substrate P. Exposure can be performed with high overlay accuracy.

  However, if the positions and shapes of the exposure regions W2 to W4 are greatly deformed, it may take a long time to perform a correction process, particularly a correction process of the pattern data by software, and the transport speed (feed speed) of the substrate P may be reduced. Limited and need to be slow. Further, if the shape of the exposure regions W2 to W4 is large, uniform overlay accuracy cannot be ensured in the entire range within one exposure region W, and the overlay accuracy is partially out of the allowable range. In some cases, the pattern data or the drawing start timing may exceed the correctable range.

  Therefore, in the second embodiment, the change of the error signal from the edge sensor 204 or the like is measured by using the clock signal CLK or a measurement signal (substrate P) from an encoder system that measures the rotational position of the rotary drum 22 with high accuracy. , And sequentially monitors the meandering state (see FIG. 18) generated by the correction by the EPC mechanism in the first exposure step. Then, the substrate P is sent from the position of the edge sensor 204 to the position of the drawing lines L1 to L6 (drawing position) on the rotating drum 22 or the position of the observation region Vw on the rotating drum 22 by the alignment microscope AM. A predetermined delay time determined by the length (transport length) and the feed speed of the substrate P is set. Then, in accordance with the meandering state monitored after the delay time, the actuators 220A and 220B of the fine movement drive units 212A and 212B are controlled to displace the second optical surface plate 208 in the Y direction and rotate the second optical surface plate 208 in the Y direction. A slight rotation is made about the axis I. The transport length is known, and the feed speed of the substrate P can be obtained from the rotational positions of the rotary drum 22 on the installation azimuth lines Le1 to Le3 calculated by the rotational position calculator 84.

  FIG. 20 shows a case where the substrate P is conveyed in the meandering state shown in FIG. 18 in the first pattern drawing step on the substrate P, and the second optical surface plate 208 is slightly moved and slightly rotated in the Y direction. FIG. 4 is a view showing an exposure area W ′ (W ′ 1 to W ′ 5) of a pattern exposed on the substrate P. As shown in FIG. 20, when the second optical surface plate 208 is finely moved in accordance with the meandering of the substrate P to correct the positions and rotation states of the exposure regions W′1 to W′5, the exposure located in the meandering portion The center points Sc2, Sc3, Sc4 of the regions W′2, W′3, W′4 can be corrected so as not to be largely shifted from the center line CA of the substrate P. Further, the exposure regions W'2, W'3, and W'4 can be arranged in a slightly rotated state corresponding to a partial tilt error of the substrate P in the X direction due to the meandering traveling. In response to the change in the error signal detected by the edge sensor 204, the movement control unit 102 controls the fine movement driving units 212A and 212B, and the pattern data correction unit 108 stores the memory units of the drawing unit drive control units CU1 to CU6. The pattern data BM1 to BM6 stored in the memory 94 are generated.

  The pattern data of the alignment marks Ks (Ks1 to Ks3) drawn at the time of the first exposure step is incorporated as a part of the pattern data of the pattern for the first layer in each of the exposure regions W′1 to W′5. . Therefore, the alignment marks Ks arranged at predetermined intervals in the longitudinal direction meander in accordance with the meandering of the substrate P.

  As described above, the second optical surface plate 208 on which the exposure head 18 is mounted is finely moved or slightly rotated in the Y direction in accordance with the meandering of the substrate P generated during the first exposure step, thereby exposing the substrate P to light. The exposure regions W′1 to W′5 are arranged without large variations in the Y direction (the width direction of the substrate P) with respect to the center line CA of the substrate P. Further, an exposure region W ′ (W′2 to W′4) arranged in a portion where the meandering occurs and an exposure region W ′ (W′1 and W′5) arranged in a portion where the meandering does not exist. In the meantime, a relative rotation error of the substrate P with respect to the center line CA is also reduced. Therefore, the correction amount and the correction range of the pattern data and the drawing start timing in the second exposure process are reduced, and it is possible to suppress a decrease in the transport speed of the substrate P and a deterioration in the overlay accuracy. Further, the alignment marks Ks (Ks1 to Ks3) arranged along the longitudinal direction are also accurately arranged at a position separated from the center line CA of the substrate P by a certain distance in the Y direction. When the alignment marks Ks (Ks1 to Ks3) are detected by the microscopes AM1 to AM3, it is possible to prevent the alignment marks Ks (Ks1 to Ks3) from deviating from the observation areas Vw1 to Vw3. As a result, a decrease in exposure accuracy can be suppressed.

  Similarly, at the time of the second exposure step, the actuators 220A and 220B of the fine movement driving units 212A and 212B are controlled to displace the second optical surface plate 208 in the Y direction, It may be rotated. At the time of the second exposure process, since the alignment marks Ks (Ks1 to Ks3) are formed, the alignment position information generated by detecting the alignment marks Ks (Ks1 to Ks3) instead of the error signal detected by the edge sensor 204. , The actuators 220A and 220B of the fine movement drive units 212A and 212B may be controlled.

DESCRIPTION OF SYMBOLS 10 ... Device manufacturing system 12 ... Substrate conveying mechanism 14 ... Light source device 14a ... Light source 16 ... Light introduction optical system 18 ... Exposure head 20 ... Control device 22 ... Rotating drum 32 ... Drawing optical element 46 ... Polygon mirror 54 ... Origin sensor 54a ... Irradiation unit 54b Photoelectric detectors 66, 206 First optical surface plate 68 Moving mechanism 70, 208 Second optical surface plate 80 Clock generation units 82, 90 Control unit 84 Rotational position calculation unit 86 Alignment Position information generating unit 92 Polygon driving unit 94 Memory unit 96 AOM driving unit 100 Second tilt measuring unit 102 Movement control unit 104 Photodetector 106 First tilt measuring unit 108 Pattern data correcting unit 110 Pattern data storage unit 200 Drive unit 202 Drive control unit 204 Edge sensor 210 Bearing structure 212A, 212 ... Fine movement drive units 220A and 220B. Actuators AM, AM1 to AM3... Alignment microscope AX... Central axis CLK... Clock signals EN1a to EN3a and EN1b to EN3b. Encoder head EX. I ... Rotation axis Ks, Ks1 to Ks3 ... Alignment mark L, L1 to L6 ... Drawing line LB ... Laser light Le1, Le2, Le3 ... Installation azimuth line P ... Substrate PR1, PR2 ... Process device SP ... Spot light st, st1 to st1 st6 start signal U drawing unit Vw1 to Vw3 observation region

Claims (5)

A pattern drawing apparatus that exposes a predetermined pattern to each of a plurality of regions divided in a width direction orthogonal to the long direction of the sheet substrate while transporting the long sheet substrate in the long direction,
The sheet substrate has a cylindrical outer peripheral surface having a constant radius from the central axis extending in the width direction, and rotates around the central axis while supporting a part of the sheet substrate along the outer peripheral surface. A rotating drum that is supported by the body frame so as to convey the sheet substrate in the longitudinal direction,
Each of the spot lights, the intensity of which is modulated based on the drawing data corresponding to the pattern to be drawn for each of the plurality of areas, along the same main scanning direction as the direction in which the central axis extends, on the outer peripheral surface of the rotating drum. A plurality of drawing units arranged so as to draw the pattern in each of the plurality of regions by linearly scanning on the supported sheet substrate,
A surface plate fixed to each of the plurality of drawing units, and supported on the main body frame so as to be capable of rotating or translating;
The platen includes a plurality of drawing lines defined by each scan of the spot light, and rotates the surface plate around an axis perpendicular to the central axis in a plane parallel to the central axis, and A drive unit that translates in the direction in which
A detection unit that detects that the sheet substrate supported on the outer peripheral surface of the rotary drum changes its position in a direction in which the central axis extends, by meandering of the sheet substrate conveyed to the rotary drum;
With
A pattern drawing apparatus that controls the drive unit to translate or rotate the surface plate in accordance with a position error detected by the detection unit. The pattern drawing apparatus according to claim 1,
The pattern drawing device, wherein the detection unit is an edge sensor that is arranged on an upstream side of the rotating drum in a conveying direction of the sheet substrate and detects a change in a position of an edge of the sheet substrate in the width direction. The pattern drawing apparatus according to claim 1,
On the sheet substrate, alignment marks are formed at specific positions in the width direction and at predetermined intervals in the long direction,
The detection unit is a portion of the sheet substrate supported on the outer peripheral surface of the rotating drum, and on the upstream side in the transport direction of the sheet substrate with respect to the drawing line by each of the plurality of drawing units, A pattern drawing device that is an alignment microscope that detects the position of an alignment mark. It is a pattern drawing apparatus as described in any one of Claims 1-3, Comprising:
A first inclination measuring unit that measures inclination of the drawing line defined by each of the plurality of drawing units with respect to the central axis, or first information on a relative inclination of each of the drawing lines;
The drive unit controls the drive unit to rotate the surface plate based on the first information, and performs the drawing according to the predetermined pattern to be drawn by at least one of the plurality of drawing units. A control device for correcting the data,
A pattern drawing apparatus, further comprising: It is a pattern drawing apparatus of Claim 4, Comprising:
The control device, based on the position error in the width direction of the sheet substrate detected by the detection unit, based on the first information, the drive unit so that the surface plate rotates and the translation. A pattern drawing device to control.

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