TWI691799B - Beam scanning device and drawing device - Google Patents

Abstract

The beam scanning device (MD) of the present invention is to perform the spot light (SP) on the irradiated surface while projecting the spot light (SP) of the light beam (LB) on the irradiated surface of the object (P) One-dimensional scanning of the scanning line (SLn), which includes: an incident optical member (M10) that enters the light beam (LB), and a scanning deflection that deflects the light beam (LB) from the incident optical member (M10) for scanning The component (PM), the projection optical system (FT) projected on the irradiated surface after entering the deflected light beam (LB), and supports the incident optical component (M10), the scanning deflection member (PM) and the projection optical system (FT ). A support frame (40) that can rotate around a first rotation center axis (Mrp) that is coaxial with the irradiation center axis (Le) within a predetermined allowable range. The irradiation center axis passes through the point perpendicular to the illuminated surface. The scanning of light (SP) is at the midpoint of the scanning line (SLn) formed on the illuminated surface.

Description

Beam scanning device and drawing device

The present invention relates to a beam scanning device, a beam scanning method, and a drawing device which scan with spot light of a light beam irradiated on an irradiated surface of an object to draw and expose a predetermined pattern.

Conventionally, as a high-speed printer for business use, it is widely known that the spot light of a laser beam is projected onto an irradiated object (object) such as a photosensitive tube, and the spot light is scanned along the main scanning line by a rotating polygon mirror One-dimensional main scanning and moving the irradiated body in the sub-scanning direction orthogonal to the main scanning line direction to draw the desired pattern and image (text, graphics, photos, etc.) on the irradiated body.

Japanese Patent Laid-Open No. 8-11348 discloses a beam scanning device for adjusting the tilt of the main scanning line of a beam. The beam scanning device described in Japanese Patent Laid-Open No. 8-11348 includes a plate tilted in the irradiation direction of the light beam, and an optical unit placed on the plate. The plate is placed on the body. By rotating the plate relative to the main body in the main scanning direction, the optical unit is rotated to adjust the tilt of the main scanning line. Due to this adjustment, the length of both sides of the midpoint of the main scanning line will be different, so by rotating the optical unit relative to the plate in the main scanning direction, the length of both sides of the midpoint of the main scanning line is adjusted to equal. The two-dimensional position deviation of the scanning line itself or the magnification error in the direction of the main scanning line is corrected by adjusting the distance from the photoreceptor of the optical unit or electrically controlling the timing of writing along the main scanning line. Also, the optical unit, inside The unit is integrally provided with a light source that emits a light beam modulated for drawing, a collimator lens that converts the light beam into parallel light, a rotating polygon mirror, and an fθ lens.

However, in Japanese Patent Laid-Open No. 8-11348, the optical unit is rotated at a position away from the main scanning line. Therefore, in order to adjust the tilt of the main scanning line, it is necessary to perform multiple stages of adjustment (rotation adjustment of the plate relative to the body, (The adjustment of the rotation of the optical unit relative to the plate, the adjustment of the distance of the optical unit from the photoreceptor, and the correction of the writing timing of the drawing, etc.). In particular, beam spot scanning devices for electronic components that use spot light of an ultraviolet light beam with a wavelength of 400 nm or less to accurately draw a pattern with a minimum line width of several μm to several tens of μm, because of the fine adjustment of the scan line tilt during pattern drawing (main In the case where the direction of the scanning line is inclined with respect to the direction orthogonal to the sub-scanning direction), it is desirable to easily adjust the inclination of the scanning line. This embodiment of the invention can solve this problem.

The beam scanning device of the first aspect of the present invention is to perform one-dimensional scanning of the spot light on the illuminated surface while projecting the spot light of the beam from the light source device on the illuminated surface of the object: incident optical member For the light beam from the light source device to enter; the deflection member for scanning to deflect the light beam from the incident optical member for the one-dimensional scanning; the projection optics, so that the deflected beam is incident upon the projected The irradiation surface; and a support frame supporting the incident optical member, the scanning deflection member and the projection optical system, which can rotate around a first rotation central axis coaxial with the irradiation central axis within a predetermined allowable range, the irradiation central axis system A specific point on the scanning line formed on the irradiated surface by the scanning of the spot light is passed perpendicular to the irradiated surface.

A beam scanning device of the second aspect of the present invention is to The spot light of the placed light beam is irradiated on the irradiated surface of the object, and one-dimensional scanning of the spot light on the irradiated surface is performed, which includes: an incident optical member for the light beam from the light source device to enter; scan A deflection member is used to deflect the light beam from the incident optical member for the one-dimensional scanning; a projection optical system is used to project the deflected light beam onto the irradiated surface; and an image rotation optical system is provided at the Between the irradiated surface and the projection optical system, the scanning line formed on the irradiated surface due to the scanning of the spot light is rotated around the central axis of rotation, and the central axis of rotation is perpendicular to the irradiated surface passing through the scanning line The center axis of the irradiation at a specific point is coaxial within a predetermined allowable range.

The beam scanning method of the third aspect of the present invention uses a beam scanning device to perform one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object Which includes: an incident step of causing the light beam from the light source device to enter the beam scanning device; a deflecting step of deflecting the incident light beam for the one-dimensional scanning; projecting the deflected light beam onto the illuminated The step of projecting the surface; and the step of rotating the scanning line formed on the illuminated surface due to the scanning of the spot light around the central axis of rotation, the central axis of rotation passing through a specific point on the scanning line perpendicular to the illuminated surface The central axis of the irradiation is coaxial within a predetermined allowable range.

The drawing device of the fourth aspect of the present invention is to perform one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object, which includes: An optical member for the light beam from the light source device to enter; a deflection member for scanning to deflect the light beam from the incident optical member for the one-dimensional scanning; a projection optical system to project the deflected beam after being incident on The irradiated surface; a support frame that supports the incident optical member, the scanning deflection member, and the projection optical system; The support frame is supported on the device body in a state of being rotatable about a first rotation center axis parallel to the normal of the illuminated surface; and a light introducing optical system, so that the incident axis of the light beam incident on the incident optical member and the first 1 The center axis of rotation is coaxial within a predetermined allowable range, and the light beam from the light source device is directed to the incident optical member.

The drawing device of the fifth aspect of the present invention performs one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object, which includes: A deflecting member is used to deflect the light beam from the light source device for the one-dimensional scanning; a projection optical system is used to project the deflected light beam onto the irradiated surface after being incident; a supporting frame that supports the scanning deflecting member, And the projection optics; and the coupling member, when the normal of the illuminated surface passing through a specific point on the scanning line formed on the illuminated surface due to the scanning of the spot light is set as the central axis of illumination, the The support portion of the support body to the device body is limited to an area within a predetermined radius from the irradiation central axis, and the support frame is combined with the device body.

The beam scanning device of the sixth aspect of the present invention performs one-dimensional scanning of the spot light while condensing the beam projected on the irradiated surface of the object on the irradiated surface, and includes: a deflection member, Reflect the incident light beam and deflect the reflected light beam within a predetermined angle to scan the spot light; send optical system to direct the incident light beam toward the deflecting member; and project optical system to direct light from the transmitted light In the optical system, the incident light beam is incident upon the deflecting member, and after the reflected light beam is incident, the spot light of the reflected light beam is projected on the illuminated surface.

The drawing device of the seventh aspect of the present invention performs one-dimensional scanning of the light beam projected on the irradiated surface of the object to draw a predetermined pattern, and includes: a deflection member to make the light beam perform One-dimensional scanning and deflection; light-transmitting optical system, which makes the light beam from the light source device incident and directed toward the deflecting member; and projection optical system, which makes the light beam from the light-transmitting optical system incident on the deflecting member And project the light beam reflected by the deflecting member onto the illuminated surface.

The drawing device of the eighth aspect of the present invention scans the drawing beam projected on the irradiated body repeatedly by the rotation of the rotating polygon mirror to draw a predetermined pattern on the irradiated body, which includes: an origin detection unit , When a plurality of reflection surfaces of the rotating polygonal mirror are detected, and a second reflection surface different from the first reflection surface reflecting the drawing beam becomes a predetermined angular position, an origin signal is generated; and the control device uses the The predetermined time determined by the rotation speed of the rotating polygon mirror after the origin signal is generated until the second reflecting surface becomes the first reflecting surface is based on the predetermined delay timing after the origin signal is generated. The drawing with the light beam starts.

10‧‧‧Component manufacturing system

12‧‧‧Substrate transfer mechanism

14‧‧‧Light source device

16‧‧‧Exposure head

18‧‧‧Control device

20‧‧‧Origin sensor

20a‧‧‧beam transmission system

20b‧‧‧Beam receiving system

22‧‧‧Light Source Department

24、26‧‧‧Reflecting mirror

28‧‧‧Receiving Department

30、32‧‧‧Reflecting mirror

34‧‧‧Lens

ALG1~ALG 4‧‧‧Align microscope

AOM(AOM1~AOM6)‧‧‧Drawing optical element

AXf‧‧‧Optical axis

AXo‧‧‧Central axis of rotating cylinder

BDU1~BDU6‧‧‧‧Light introduction optics

BE‧‧‧beam expander

BS1‧‧‧ Polarized beam splitter

BS2‧‧‧beam splitter

BS3‧‧‧ Polarized beam splitter

CYa, CYb ‧‧‧ cylindrical lens

Dh‧‧‧Interval

DP‧‧‧Deviation adjustment optical component

DR‧‧‧Rotating cylinder

DT1‧‧‧Photodetector

DT2‧‧‧Position detector

EC (EC1a, EC1b, EC2a, EC2b) ‧‧‧ Encoder

ECV‧‧‧Adjust Greenhouse

EPC‧‧‧Edge position controller

EX‧‧‧Exposure device

FA‧‧‧Field aperture

FS‧‧‧Substrate

FT‧‧‧fθ lens

G10‧‧‧lens system

Hs1~Hs6‧‧‧Opening

LB‧‧‧beam

Le1~Le6‧‧‧irradiation central axis

M1~M5, M10~M15, M20~M24‧‧‧‧Reflector

MD1~MD6‧‧‧‧beam scanning device

MK1~MK4‧‧‧Alignment mark

PM‧‧‧polygonal mirror

Poc‧‧‧Center

PR1, PR2‧‧‧‧processing device

QW‧‧‧λ/4 wavelength plate

R1, R2, R3 ‧‧‧ drive roller

RP‧‧‧Reflective surface

RT1, RT2‧‧‧Tension adjustment roller

Sft‧‧‧axis

SL(SL1~SL6)‧‧‧scan line

SP‧‧‧light

SR‧‧‧Image shift optical component

SU1, SU2‧‧‧Anti-vibration unit

UB‧‧‧Body frame

Vw1~Vw4 ‧‧‧ observation area

W‧‧‧Exposure area

FIG. 1 is a schematic configuration diagram of an element manufacturing system including an exposure apparatus that performs exposure processing on a substrate of an embodiment.

FIG. 2 is a view showing in detail the rotating drum of FIG. 1 wound with a substrate.

FIG. 3 is a diagram showing trace lines of spot light and alignment marks formed on a substrate.

4 is an enlarged view of a main part of the exposure apparatus of FIG. 1.

FIG. 5 is a diagram showing in detail the optical configuration of the light introduction optical system of FIG. 4. FIG. 6 is a schematic diagram for explaining optical path switching by the optical element for drawing in FIG. 5.

7 is a diagram of the optical configuration of the beam scanning device of FIG.

FIG. 8 is a diagram showing the structure of an origin sensor provided around the polygon mirror of FIG. 7.

FIG. 9 is a diagram showing the relationship between the timing of origin signal generation and the timing of drawing start.

10 is a cross-sectional view showing a holding structure of a beam scanning device constituted by the second frame part of FIG. 4.

FIG. 11 is a cross-sectional view taken along line XI-XI of FIG. 10.

FIG. 12 is a perspective view showing a structure for holding a plurality of beam scanning devices shown in FIGS. 4 and 10 and 11. FIG.

13 is a perspective view showing the mounting structure of the structure shown in FIG. 12 and the main body of the exposure apparatus.

FIG. 14 is a diagram showing a deformed state of an exposure area exposed with a predetermined pattern by the exposure head of FIG. 4.

15 is a diagram showing the optical configuration of a beam scanning device according to Modification 1. FIG.

16 is a diagram showing the optical configuration of a beam scanning device according to Modification 2. FIG.

17A is a view of the optical configuration of the beam scanning device of Modification 4 seen in a plane parallel to the XtZt plane, and FIG. 17B is a view of the optical configuration of the beam scanning device of Modification 4 seen in a plane parallel to the YtZt plane.

18A is a view of the optical configuration of the beam scanning device of Modification 5 seen in a plane parallel to the XtYt plane, and FIG. 18B is a view of the optical configuration of the beam scanning device of Modification 5 seen in a plane parallel to the YtZt plane.

FIG. 19 is a diagram showing the optical configuration of a beam scanning device according to Modification 6. FIG.

FIG. 20 is a diagram showing the configuration when a plurality of beam scanning devices of FIG. 19 are arranged.

21 is a diagram illustrating a drawing position error when a drawing line formed by a beam scanning device is inclined.

22 is a diagram illustrating the drawing position error when the drawing line is inclined when the rotation center of the beam scanning device is shifted.

Fig. 23 is a diagram showing the configuration of a beam scanning device according to a second embodiment.

The beam scanning device, beam scanning method, and drawing device according to the aspect of the present invention will be described in detail as follows with reference to the accompanying drawings. In addition, the aspect of the present invention is of course not limited to these embodiments, and includes various changes or improvements. That is to say, the constituent elements described below include those that are easily conceivable by those having ordinary knowledge in the technical field to which the invention belongs and those that are substantially the same, and the constituent elements described below may be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the gist of the present invention.

FIG. 1 is a schematic configuration diagram of an element manufacturing system 10 including an exposure apparatus EX that performs exposure processing on a substrate (object to be irradiated) FS of an embodiment. In the following description, unless otherwise specified, an XYZ orthogonal coordinate system with the gravity direction as the Z direction is set, and the X direction, the Y direction, and the Z direction are explained according to the arrows shown in the figure.

The component manufacturing system 10 is, for example, a manufacturing system constructed with manufacturing lines for manufacturing flexible displays, flexible wiring, and flexible sensors as electronic components. Hereinafter, as a premise, a flexible display as an electronic component will be described. Examples of flexible displays include organic EL displays and liquid crystal displays. The component manufacturing system 10 includes a flexible sheet substrate (sheet substrate) FS wound into a roll and a supply roll (not shown) to feed the substrate FS, and after continuously applying various treatments to the sent substrate FS The so-called roll-to-roll (Roll To Roll) structure in which the substrate FS after various treatments is wound in a recovery roll (not shown). The substrate FS has a strip shape in which the moving direction of the substrate FS is the long-side direction (long bar) and the width direction is the short-side direction (short bar). The substrate FS after various treatments is in a state where a plurality of electronic components are connected in the longitudinal direction, and is a substrate that can be used for multiple surfaces. The substrate FS fed from the supply roll is sequentially processed by the processing device PR1, the exposure device EX, the processing device PR2, and the like, and then wound by the recovery roll.

In addition, the X direction is a direction (transport direction) from the processing device PR1 toward the processing device PR2 via the exposure device EX in the horizontal plane. The Y direction is the direction orthogonal to the X direction within the horizontal plane, and is the width direction (short side direction) of the substrate FS. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction of gravity.

For the substrate FS, for example, a foil made of a metal or alloy such as a resin film or stainless steel is used. As the material of the resin film, for example, at least polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, At least one of polycarbonate resin, polystyrene resin, polyvinyl alcohol resin and other materials. In addition, the thickness and rigidity (Young's coefficient) of the substrate FS need only be within a range that does not cause creases and irreversible wrinkles caused by bending when passing through the conveyance path of the exposure device EX. As the base material of the substrate FS, films such as PET (polyethylene terephthalate fiber) or PEN (polyethylene naphthalate) with a thickness of about 25 μm to 200 μm are typical of very suitable sheet substrates .

Since the substrate FS may be heated in each process performed by the processing device PR1, the exposure device EX, and the processing device PR2, it is preferable to select a substrate FS whose material does not significantly increase the thermal expansion coefficient. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate FS may be a single-layer body of extremely thin glass with a thickness of about 100 μm manufactured by a float method or the like, or a laminate in which the above-mentioned resin film, foil, or the like is bonded to the extremely thin glass.

In addition, the flexibility of the substrate FS refers to the property of applying a force of its own weight to the substrate FS so as not to cause shearing or breaking, but to flex the substrate FS. Flexibility also includes the property of bending due to the force of self-weight. In addition, the degree of flexibility will vary depending on the material, size, thickness of the substrate FS, the layer structure of the film formed on the substrate FS, temperature, humidity, and environment. In any case, as long as the substrate FS is correctly wound around the conveying direction conversion members such as various conveying reels and rotating drums provided in the conveying path of the component manufacturing system 10 of the present embodiment, it does not bend. If creases or breakages (holes or cracks occur) and the substrate FS can be smoothly transported, they are all within the range of flexibility.

The processing device PR1 is a process that performs a pre-process on the substrate FS that is exposed by the exposure device EX. The processing device PR1 sends the processed substrate FS to the exposure device EX. Through the processing in this previous process, the substrate FS sent to the exposure device EX becomes the substrate (photosensitive substrate) FS on which the photosensitive functional layer (photosensitive layer) is formed.

This photosensitive functional layer is applied on the substrate FS in the form of a solution, and becomes a layer (film) by drying. The typical photosensitive functional layer has a photoresist (liquid or dry film) as a material that is not required after development, and a liquid-modified photosensitive silane coupling agent (SAM) in the part exposed to ultraviolet rays Or, the part exposed to ultraviolet rays exposes the photosensitive reversion material, which is plated to restitution. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate FS is changed from liquid repellency to lyophilic. Therefore, conductive ink (ink containing conductive nanoparticles such as silver or copper) or liquid containing semiconductor materials can be selectively coated on the lyophilic part to form thin film transistors (TFTs), etc. Electrode, half Conductor, insulation, or as a pattern layer for connecting wiring or electrodes. When a photosensitive reduction material is used as the photosensitive functional layer, the patterned portion exposed on the substrate FS by the ultraviolet light is exposed to the plating reduction element. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions or the like for a certain period of time to form (precipitate) a palladium pattern layer. In the case where such plating processing is premised on an additive processing and an etching processing as a subtractive processing, the substrate FS sent to the exposure apparatus EX may be PET or PEN is a base material, and a metal film such as aluminum (Al) or copper (Cu) is vapor-deposited on the entire surface or selectively, and a photoresist layer is deposited thereon.

In the present embodiment, the exposure device EX is an exposure device of a direct drawing method that does not use a reticle, an exposure device of a so-called raster scan method, and exposes the irradiated surface of the substrate FS supplied from the processing device PR1 (photosensitive (Surface) corresponds to a light pattern used to form a predetermined pattern of electronic components, circuits, wiring, etc. for a display. The exposure device EX carries out one-dimensional scanning in a predetermined scanning direction (Y direction) on the irradiated surface of the substrate FS with the spot light SP of the exposure light beam LB while carrying the substrate FS in the +X direction (sub-scanning direction) (Main Scan), according to the pattern data (drawing data) high-speed modulation (ON/OFF) the intensity of the spot light SP, details will be described later. According to this, a light pattern corresponding to a predetermined pattern of electronic components, circuits, or wiring is drawn and exposed on the illuminated surface of the substrate FS. In other words, through the sub-scanning of the substrate FS and the main scanning of the spot light SP, the spot light SP performs a two-dimensional scan relative to the illuminated surface of the substrate FS, and a predetermined pattern is drawn and exposed on the substrate FS. In addition, since the electronic device is formed by overlapping a plurality of pattern layers (layers with patterns formed), the pattern corresponding to each layer is exposed by the exposure device EX.

The processing device PR2 performs post-process processing (for example, plating processing, development, etching processing, etc.) on the substrate FS subjected to exposure processing by the exposure device EX. Through this process In the process, a pattern layer of electronic components is formed on the substrate FS. In addition, since the electronic device is formed by overlapping a plurality of pattern layers, after forming a pattern on the first layer by each process of the device manufacturing system 10, a pattern is formed on the second layer again through each process of the device manufacturing system 10.

Next, the exposure device EX will be described in detail. The exposure device EX is housed in the greenhouse ECV. In this greenhouse ECV, by keeping the inside at a predetermined temperature, the shape change of the substrate FS transported inside due to temperature is suppressed. The greenhouse ECV is installed on the installation surface E of the manufacturing plant through passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 reduce the vibration from the installation surface E. The setting surface E may be the ground of the factory itself, or a surface on a pedestal set on the ground to make a horizontal plane. The exposure device EX includes at least a substrate transport mechanism 12, a light source device (pulse light source device) 14, an exposure head 16, a control device 18, and a plurality of alignment microscopes ALG (ALG1 to ALG4).

The substrate transfer mechanism 12 transfers the substrate FS transferred from the processing device PR1 in the exposure device EX at a predetermined speed, and then sends it to the processing device PR2 at a predetermined speed. With this substrate transfer mechanism 12, the transfer path of the substrate FS transferred in the exposure device EX is defined. The substrate conveying mechanism 12 has an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylinder) DR, and a tension adjusting roller RT2 in order from the upstream side (-X direction side) of the substrate FS in the conveying direction , Drive roller R2, and drive roller R3.

The edge position controller EPC is used to adjust the position of the substrate FS transferred from the processing device PR1 in the width direction (Y direction, short side direction of the substrate FS). That is, the edge position controller EPC moves the substrate FS in the width direction to adjust the position of the substrate FS in the width direction, so that the width direction end (edge) of the substrate FS that is transported with a predetermined tension The position relative to the target position can be controlled within ± tens of μm ~ tens of μm Range (allowable range). The edge position controller EPC has an unillustrated edge sensor (end detection unit) that stretches the substrate FS roller and detects the position of the widthwise end (edge) of the substrate FS, based on the detection by the edge sensor The signal moves the roller of the edge position controller EPC in the Y direction to adjust the position of the substrate FS in the width direction. The driving roller R1 rotates while holding the front and back surfaces of the substrate FS transported from the edge position controller EPC, and transports the substrate FS to the rotating drum DR. In addition, the edge position controller EPC can appropriately adjust the parallelism of the rotation axis of the roller of the edge position controller EPC and the Y axis to correct the tilt error of the position of the substrate FS in the width direction and the direction of travel of the substrate FS to make the roll The longitudinal direction of the substrate FS around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR.

The rotating drum DR has a central axis AXo extending in the Y direction and a direction intersecting with the Z direction of gravity, and a cylindrical outer peripheral surface with a certain radius from the central axis AXo, while extending along the outer peripheral surface (circumferential surface) A part of the substrate FS is supported in the longitudinal direction, and is rotated around the central axis AXo to convey the substrate FS in the +X direction. The rotating drum DR supports the exposure area (part) on the substrate FS on which the light beam LB (spot light SP) from the exposure head 16 is projected on the circumferential surface. On both sides in the Y direction of the rotating drum DR, there is an axis Sft supported by an annular bearing so as to rotate around a central axis AXo. This axis Sft is given a rotational torque from a not-shown rotational drive source (for example, a motor, a speed reduction mechanism, etc.) controlled by the control device 18 to rotate around the central axis AXo. In addition, for convenience, a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane PR1.

The driving rollers R2 and R3 are arranged at a predetermined interval along the conveyance direction (+X direction) of the substrate FS, and a predetermined slack is given to the substrate FS after exposure. The driving rollers R2 and R3 are the same as the driving roller R1, and rotate while holding the front and back surfaces of the substrate FS to transport the substrate FS To the processing device PR2. The driving rollers R2 and R3 are provided on the downstream side (+X direction side) relative to the rotating drum DR, and the driving roller R2 is provided on the upstream side (-X direction side) relative to the driving roller R3. The tension adjusting rollers RT1 and RT2 are urged in the -Z direction to apply a predetermined tension in the longitudinal direction to the substrate FS wound and supported by the rotating drum DR. Accordingly, the tension applied to the substrate FS in the longitudinal direction of the rotating drum DR is stabilized within a predetermined range. In addition, the control device 18 rotates the drive rollers R1 to R3 by controlling a rotation driving source (for example, a motor or a speed reducer, etc.) not shown.

The light source device 14 has a light source (pulse light source) and emits a pulsed light beam (pulse light, laser) LB. The light beam LB is ultraviolet light having a peak wavelength in a wavelength band below 370 nm, and the light emitting frequency of the light beam LB is Fe. The light beam LB emitted by the light source device 14 enters the exposure head 16. The light source device 14 oscillates the light beam LB at the luminous frequency Fe according to the control of the control device 18 and emits it. Also, as the light source device 14, a semiconductor laser element that emits pulsed light in the infrared wavelength band, an optical fiber amplifier, and a wavelength conversion element that converts the amplified pulsed light in the infrared wavelength band into a pulsed light in the ultraviolet wavelength band ( High harmonic generation components) and other optical fiber amplification laser light sources. In this case, it is possible to obtain high-intensity ultraviolet pulsed light having a luminous frequency (oscillation frequency) Fe of several hundred MHz and a luminous time of one pulse of light of about picoseconds.

The exposure head 16 is provided with a plurality of beam scanning devices MD (MD1 to MD6) in which the light beam LB is incident respectively. The exposure head 16 draws a predetermined pattern by a plurality of beam scanning devices MD1 to MD6 on a part of the substrate FS supported by the circumferential surface of the rotating drum DR. The exposure head 16 is a so-called multi-beam type exposure head in which a plurality of beam scanning devices MD1 to MD6 of the same configuration are arranged. Since the exposure head 16 repeats the pattern exposure for the electronic component on the substrate FS, the exposure area W (the formation area of one electronic component) that exposes the pattern is along the long side of the substrate FS Plural numbers are set at predetermined intervals (see FIG. 3).

As also shown in FIG. 2, the odd-numbered beam scanning devices (beam scanning units) MD1, MD3, and MD5 are arranged on the upstream side (-X direction side) of the substrate FS in the transport direction relative to the central plane Poc, and are arranged side by side in the Y direction . Even-numbered beam scanning devices (beam scanning units) MD2, MD4, and MD6 are arranged on the downstream side (+X direction side) of the substrate FS in the transport direction with respect to the central plane Poc, and are arranged in parallel in the Y direction. The odd-numbered beam scanning devices MD1, MD3, MD5 and the even-numbered beam scanning devices MD2, MD4, MD6 are arranged symmetrically with respect to the central plane Poc.

The beam scanning device MD, while projecting the light beam LB from the light source device 14 on the irradiated surface of the substrate FS into a spot light SP, while using the spot light SP on the irradiated surface of the substrate FS along a predetermined straight line The line SLn is drawn for one-dimensional scanning. The drawing lines (scanning lines) SLn of the plurality of beam scanning devices MD1 to MD6, as shown in FIGS. 2 and 3, are set to be in the Y direction (the width direction of the substrate FS and the scanning direction) without being separated from each other Join. In the following, the light beam LB incident on each beam scanning device MD (MD1 to MD6) is also referred to as LB1 to LB6. The light beam LB (LB1~LB6) incident on each beam scanning device MD (MD1~MD6) is a linearly polarized light beam (P polarized light or S polarized light) polarized in a predetermined direction. In this embodiment, the P polarized light is incident Light beam. In addition, the drawing line SLn of the beam scanning device MD1 may be referred to as SL1, and the drawing line SLn of the beam scanning devices MD2 to MD6 may be referred to as SL2 to SL6.

As shown in FIG. 3, each beam scanning device MD (MD1~MD6) shares the scanning area in such a manner that all the beam scanning devices MD1~MD6 cover all the width direction of the exposure area W. According to this, each beam scanning device MD (MD1~MD6) can be divided again A pattern is drawn on each of the plurality of areas in the width direction of the substrate FS. For example, if the Y-direction scanning width (length of the drawing line SLn) of one beam scanning device MD is about 30 to 60 mm, by combining three odd-numbered beam scanning devices MD1, MD3, and MD5 with an even number Three of the beam scanning devices MD2, MD4, and MD6, a total of six beam scanning devices MD are arranged in the Y direction, and the width of the Y direction that can be drawn is expanded to 180~360mm. The length of each drawing line SL1~SL6 is in principle the same. That is to say, the scanning distances of the spot lights SP of the light beams LB scanned along the drawing lines SL1 to SL6 are the same.

In addition, the actual drawing lines SLn (SL1 to SL6) are set to be slightly shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. For example, when the drawing magnification in the main scanning direction (Y direction) is set to the initial value (without magnification correction), the maximum length of the drawing line SLn that can be drawn by the pattern is 50 mm, the maximum scanning length of the spot light SP on the illuminated surface, The scanning start point side and the scanning end point side of the drawing line SLn have a margin of about 0.5 mm, and are set to about 51 mm. With this setting, within the range of the maximum scanning length of the spot light SP of 51 mm, the position of the drawing line SLn of 50 mm can be finely adjusted in the main scanning direction, or the drawing magnification can be finely adjusted.

The drawing lines SL1 to SL6 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane Poc interposed therebetween. The odd-numbered drawing lines SL1, SL3, and SL5 are located on the illuminated surface of the substrate FS upstream (-X direction side) of the substrate FS in the transport direction with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, and SL6 are located on the irradiated surface of the substrate FS on the downstream side (+X direction side) of the substrate FS in the transport direction with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel in the width direction of the substrate FS, that is, along the central axis AXo of the rotating drum DR.

The drawing lines SL1, SL3, SL5 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. The drawing lines SL2, SL4, SL6 are the same, along the substrate FS The width direction (scanning direction) is arranged on a straight line at a predetermined interval. At this time, the drawing line SL2 is arranged in the width direction of the substrate FS and is arranged between the drawing line SL1 and the drawing line SL3. Similarly, the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS. The drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS, and the drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate FS.

The scanning direction of the spot light SP of the light beam LB scanned along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and the same direction. The scanning direction of the spot light SP of the light beam LB scanned along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction and the same direction. The scanning direction of the spot light SP of the light beam LB scanned along the drawing lines SL1, SL3, SL5 and the scanning direction of the spot light SP of the light beam LB scanned along the drawing lines SL2, SL4, SL6 are opposite directions. In detail, the scanning direction of the spot light SP of the light beam LB scanned along the drawing lines SL1, SL3, SL5 is the -Y direction, and the scanning direction of the spot light SP of the light beam LB scanned along the drawing lines SL2, SL4, SL6 is + Y direction. Accordingly, the drawing start position of the drawing lines SL1, SL3, SL5 (the position of the drawing start point) and the drawing start position of the drawing lines SL2, SL4, SL6 are adjacent (or partially repeated) in the Y direction. In addition, the drawing end positions of the drawing lines SL3 and SL5 (the positions of drawing end points) and the drawing end positions of the drawing lines SL2 and SL4 are adjacent (or partially repeated) in the Y direction. When the ends of the drawing lines SLn adjacent in the Y direction are partially overlapped with each other, for example, relative to the length of each drawing line SLn, the drawing start position or the drawing end position may be repeated within a range of several% or less in the Y direction .

In addition, the width of the drawing line SLn in the sub-scanning direction corresponds to the thickness (diameter) φ of the spot light SP. For example, when the size φ of the spot light SP is 3 μm, the width of each drawing line SLn is also 3 μm. The spot light SP may only have a predetermined length (for example, the size φ of the spot light SP One and a half) irradiated along the drawing line SLn in an overlapping manner. In addition, in the case where the drawing lines SLn (for example, the drawing line SL1 and the drawing line SL2) adjacent in the Y direction are adjacent to each other (in the case of joining), the predetermined length (for example, the size φ of the spot light SP) Half) better overlap.

In the case of this embodiment, since the light beam LB from the light source device 14 is pulsed light, the spot light SP projected on the drawing line SLn between the main scans will be discrete in response to the oscillation frequency Fe of the light beam LB. Therefore, it is necessary to overlap the spot light SP projected with one pulse of light beam LB and the next spot light SP projected with one pulse of light in the main scanning direction. The amount of this overlap is set according to the size φ of the spot light SP, the scanning speed of the spot light SP, and the oscillation frequency Fe of the light beam LB. When the intensity distribution of the spot light SP is Gaussian and approximate, The effective diameter size φ determined by 1/e ² (or 1/2) of the peak intensity of the light SP is preferably overlapped by φ/2. Therefore, in the sub-scanning direction (the direction orthogonal to the drawing line SLn), it is preferable to set the effective size of the spot light SP by the substrate FS moving between one scan and the next scan of the spot light SP along the drawing line SLn The distance of φ is roughly 1/2 or less. In addition, the exposure amount of the photosensitive functional layer on the substrate FS can be set by adjusting the peak value of the light beam LB (pulse light), but when the exposure amount is to be increased without increasing the intensity of the light beam LB , By reducing the scanning speed of the spot light SP in the main scanning direction, increasing the oscillation frequency Fe of the light beam LB, or reducing the transfer speed of the substrate FS in the sub-scanning direction, the spot light SP can be scanned in the main scanning direction The amount of overlap in the direction or sub-scanning direction can be increased to more than 1/2 of the effective size φ.

Each beam scanning device MD (MD1~MD6) irradiates the light beam LB (LB1~LB6) to the substrate FS in such a way that the light beam LB (LB1~LB6) is perpendicular to the irradiated surface of the substrate FS at least in the XZ plane . In other words, each beam scanning device MD (MD1~MD6) travels in the XZ plane toward the central axis AXo of the rotating drum DR, that is, The light beam LB (LB1~LB6) is irradiated (projected) on the substrate FS in a manner coaxial (parallel) with the normal of the illuminated surface. In addition, each beam scanning device MD (MD1~MD6) is such that the beam LB (LB1~LB6) irradiated on the drawing line SLn (SL1~SL6) is perpendicular to the irradiated surface of the substrate FS in a plane parallel to the YZ plane In this way, the substrate FS is irradiated with the light beam LB (LB1 to LB6). That is, in the main scanning direction of the spot light SP on the illuminated surface, the light beam LB (LB1~LB6) projected on the substrate FS is scanned in a telecentric state. Here, the middle point (center point) of the drawing line SLn (SL1 to SL6) defined by each beam scanning device MD (MD1 to MD6) will be a line perpendicular to the illuminated surface of the substrate FS (also called optical axis) This is called the irradiation central axis Le (Le1~Le6).

Each of the irradiation central axes Le1 to Le6 is in the XZ plane, and connects the drawing lines SL1 to SL6 and the central axis AXo. The irradiation central axes Le1, Le3, and Le5 of the odd-numbered beam scanning devices MD1, MD3, and MD5 are in the same direction on the XZ plane, and the irradiation central axes Le2, Le4, and Le6 of the odd-numbered beam scanning devices MD2, MD4, and MD6 are The XZ plane is in the same direction. In addition, in the XZ plane, the irradiation central axes Le1, Le3, Le5 and the irradiation central axes Le2, Le4, Le6 are set at an angle of ±θ relative to the central plane Poc (see FIG. 4).

As shown in FIG. 2, at both ends of the rotating drum DR, scale portions SD (SDa, SDb) having scales formed in a ring shape on the entire outer circumferential surface of the rotating drum DR are provided in the circumferential direction. The scale portion SD (SDa, SDb) is a diffraction grating in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) on the outer circumferential surface of the rotating drum DR, and constitutes an incremental scale. The scale part SD (SDa, SDb) rotates integrally with the rotating drum DR about the central axis AXo. In addition, a plurality of encoders (scale reading heads) EC are provided so as to face the scale parts SD (SDa, SDb). This encoder EC detects the rotation position of the rotary drum DR optically. Two encoders EC (EC1a, EC1a, EC1a, EC2a), two encoders EC (EC1b, EC2b) are provided opposite to the scale part SDb provided on the +Y direction side end of the rotating drum DR.

The encoder EC (EC1a, EC1b, EC2a, EC2b), by projecting the measuring beam onto the scale part SD (SDa, SDb), and photoelectrically inspecting the reflected beam (diffraction light), according to which the corresponding scale part SD The detection signals of the circumferential position changes of (SDa, SDb) are output to the control device 18. The control device 18 can perform digital processing by interpolating the detection signal with a counting circuit (not shown) to measure the angular change of the rotating drum DR, that is, the circumferential position of the outer circumferential surface thereof with submicron resolution Variety. The control device 18 may also measure the transfer speed of the substrate FS from the angle change of the rotating drum DR.

The encoders EC1a and EC1b are provided on the upstream side (-X direction side) of the substrate FS in the transport direction with respect to the center plane Poc, and are arranged on the same line as the irradiation center axes Le1, Le3, and Le5 in the XZ plane. In other words, in the XZ plane, a line connecting the projection position (reading position) of the measuring beams projected from the encoders EC1a and EC1b on the scale parts SDa and SDb and the central axis AXo is arranged on the irradiation central axis Le1 , Le3, Le5 are on the same line. Similarly, the encoders EC2a and EC2b are provided on the downstream side (+X direction side) of the substrate FS in the transport direction with respect to the center plane Poc, and are arranged on the same line as the irradiation center axes Le2, Le4, and Le6 in the XZ plane. In other words, in the XZ plane, a line connecting the projection position (reading position) of the measuring beam projected from the encoders EC2a and EC2b on the scale parts SDa and SDb and the central axis AXo is arranged on the irradiation central axis Le2 , Le4, Le6 are on the same line.

Furthermore, the substrate FS is wound inside the scale portions SDa and SDb at both ends of the rotary drum DR. The outer peripheral surface of the scale portion SD (SDa, SDb) is set to be the same as the outer peripheral surface of the substrate FS wound around the rotating drum DR. That is, the scale part SD (SDa, SDb) to the outer peripheral surface The radius (distance) of the central axis AXo is set to be the same as the radius (distance) of the substrate FS wound around the rotating drum DR to the central axis AXo of the outer peripheral surface. According to this, the encoder EC (EC1a, EC1b, EC2a, EC2b) can detect the scale part SD (SDa, SDb) at a position in the same radial direction as the irradiated surface of the substrate FS wound around the rotating drum DR, and reduce the measurement position Abbe error due to the difference in processing direction (scanning position of spot light SP, etc.) in the radial direction of the rotating drum DR.

However, since the thickness of the substrate FS as the object to be irradiated is quite different from tens of μm to hundreds of μm, the radius of the outer peripheral surface of the scale part SD (SDa, SDb) is to be wound around the rotating drum DR It is not easy to keep the radius of the outer peripheral surface of the substrate FS constant. Therefore, in the case of the scale portion SD (SDa, SDb) shown in FIG. 2, the radius of the outer circumferential surface (scale surface) is set to coincide with the radius of the outer circumferential surface of the rotary drum DR. Furthermore, the scale part SD may be constituted by individual discs, and this disc (scale disc) may be coaxially attached to the axis Sft of the rotating drum DR. At this time, it is better to make the radius of the outer circumferential surface (scale surface) of the scale disc coincide with the radius of the outer circumferential surface of the rotating drum DR in order to control the Abbe error within the allowable value.

The alignment microscope ALG (ALG1~ALG4) shown in FIG. 1, as shown in FIG. 3, is used to detect the alignment marks MK (MK1~MK4) formed on the substrate FS, and a plurality of them are provided along the Y direction (this implementation 4 in the form). The alignment marks MK (MK1 to MK4) are reference marks used to align the predetermined pattern of the exposure area W drawn on the illuminated surface of the substrate FS with the relative position of the substrate FS. Align the microscope ALG (ALG1~ALG4), and detect the alignment mark MK (MK1~MK4) on the substrate FS supported by the circumferential surface of the rotating drum DR. Aimed at the microscope ALG (ALG1~ALG4), the spot light SP from the light beam LB (LB1~LB6) from the exposure head 16 is placed on the upstream side of the substrate FS in the transport direction (-X direction side) ).

The alignment microscope ALG (ALG1~ALG4) has a light source for projecting the illumination light for alignment on the substrate FS, and an observation optical system for obtaining an enlarged image of the local area on the surface of the substrate FS including the alignment marks MK (MK1~MK4) ( (Including objective lens), and imaging elements such as CCD, CMOS, etc., which are photographed with a high-speed shutter while the substrate FS is moving in the transport direction. The photographic signals captured by the microscope ALG (ALG1~ALG4) are sent to the control device 18. The control device 18 detects the alignment mark MK (MK1~) based on the image analysis of the photographic signal and the information on the rotational position of the rotary drum DR at the moment of shooting (measured by reading the encoder EC of the scale part SD shown in FIG. 2) MK4) to detect the position of the substrate FS. In addition, the illumination light for alignment is light in a wavelength band that hardly has sensitivity to the photosensitive functional layer on the substrate FS, for example, light having a wavelength of about 500 to 800 nm.

The alignment marks MK1 to MK4 are provided around each exposure area W. A plurality of alignment marks MK1 and MK4 are formed on both sides in the width direction of the substrate FS of the exposure area W at a certain interval Dh along the long side direction of the substrate FS. The alignment mark MK1 is formed on the -Y direction side of the width direction of the substrate FS, and the alignment mark MK4 is formed on the +Y direction side of the width direction of the substrate FS. Such alignment marks MK1 and MK4 are arranged at the same position in the longitudinal direction (X direction) of the substrate FS in a state where the substrate FS receives a large tension and is not deformed by heat treatment. Furthermore, the alignment marks MK2 and MK3 are between the alignment mark MK1 and the alignment mark MK4, and the remaining white portion on the +X direction side and -X direction side of the exposure area W is along the width direction of the substrate FS (short Direction) formation. The alignment mark MK2 is formed on the −Y direction side of the width direction of the substrate FS, and the alignment mark MK3 is formed on the +Y direction side of the substrate FS. In addition, the distance between the alignment mark MK1 and the alignment mark MK2 of the white part in the Y direction, and the alignment mark MK2 and the alignment mark MK3 of the white part in the Y direction Space and arrangement in +Y direction of substrate FS The distance between the alignment mark MK4 of the side end and the alignment mark MK3 of the remaining white part in the Y direction are set to the same distance. These alignment marks MK (MK1~MK4) can be formed together when the pattern layer of the first layer is formed. For example, when exposing the pattern of the first layer, the pattern for alignment marks may be exposed together around the exposure area W where the pattern is exposed. Also, the alignment mark MK may be formed in the exposure area W. For example, it may be formed within the exposure area W along the outline of the exposure area W.

The alignment microscope ALG1 is configured to photograph the alignment mark MK1 existing in the observation area (detection area) Vw1 of the objective lens. Similarly, the alignment microscopes ALG2~ALG4 are also configured to capture the alignment marks MK2~MK4 existing in the observation area Vw2~Vw4 of the objective lens. Therefore, the plurality of alignment microscopes ALG1~ALG4 correspond to the positions of the plurality of alignment marks MK1~MK4, and are arranged in the order of alignment microscopes ALG1~ALG4 from the -Y direction side of the substrate FS. The alignment microscope ALG (ALG1~ALG4) is set in the X direction, the distance between the exposure position (drawing line SL1~SL6) and the observation area Vw (Vw1~Vw4) of the alignment microscope ALG, compared to the X direction of the exposure area W The length is short. Moreover, the number of alignment microscopes ALG provided in the Y direction can be changed according to the number of alignment marks MK formed in the width direction of the substrate FS. In addition, although the size of the observation areas Vw1 to Vw4 on the illuminated surface of the substrate FS is set in response to the size and alignment accuracy (position measurement accuracy) of the alignment marks MK1 to MK4, it is about 100 to 500 μm square.

FIG. 4 is an enlarged view of main parts of the exposure apparatus EX. The exposure device EX further includes a plurality of light introduction optical systems BDU (BDU1 to BDU6) and a main body frame UB. The light introducing optical system BDU (BDU1~BDU6) guides the light beam LB (LB1~LB6) from the light source device 14 to the light beam scanning device MD (MD1~MD6). The light introducing optical system BDU1 directs the light beam LB1 to the beam scanning device MD1, and the light introducing optical system BDU2 directs the light beam LB2 to the beam scanning device MD2. Similarly, the light introduction optical systems BDU3~BDU6 direct the light beams LB3~LB6 to the light beam scanning devices MD3~MD6. The light beam LB from the light source device 14 passes through an optical member such as a beam splitter (not shown), a light deflector for switching, or the like, and diverts or selectively enters each light into the optical systems BDU1 to BDU6. The light-introducing optical system BDU (BDU1~BDU6) has the intensity of the spot light SP projected on the irradiated surface of the substrate FS by the beam scanning device MD (MD1~MD6) according to the pattern data to be modulated at high speed (ON/OFF ) For drawing optical elements AOM (AOM1~AOM6). The optical element for drawing is the AOM Acousto-Optic Modulator. This pattern data is stored in a memory area (not shown) of the control device 18.

The main body frame UB is used to hold a plurality of light introduction optical systems BDU1~BDU6 and a plurality of beam scanning devices MD1~MD6. The main body frame UB has a first frame portion Ub1 that holds a plurality of light introduction optical systems BDU1 to BDU6, and a second frame portion Ub2 that holds a plurality of beam scanning devices MD1 to MD6. The first frame portion Ub1 holds a plurality of light introduction optical systems BDU1 to BDU6 above the plurality of beam scanning devices MD1 to MD6 (+Z direction side) held by the second frame portion Ub2. The odd-numbered light introduction optical systems BDU1, BDU3, and BDU5 correspond to the positions of the odd-numbered beam scanning devices MD1, MD3, and MD5, and are arranged on the upstream side (-X direction side) of the substrate FS in the transport direction with respect to the central plane Poc. The mode is held by the first frame portion Ub1. The even-numbered light is introduced into the optical systems BDU2, BDU4, and BDU6. Similarly, it corresponds to the positions of the even-numbered beam scanning devices MD2, MD4, and MD6, and is arranged on the downstream side of the substrate FS in the transport direction (+X) with respect to the central plane Poc The direction side) is held by the first frame portion Ub1. The configuration of this light introduction optical system BDU will be described in detail later.

The first frame portion Ub1 supports a plurality of light introduction optical systems BDU1 to BDU6 from below (the side in the -Z direction). In the first frame part Ub1, corresponding to a plurality of light introduction optical system BDU1 ~BDU6 is provided with a plurality of openings Hs (Hs1~Hs6). Through the plurality of openings Hs1 to Hs6, the light beams LB1 to LB6 emitted from the plurality of light introduction optical systems BDU1 to BDU6 enter the corresponding beam scanning device without being blocked by the first frame portion Ub1 MD1~MD6. In other words, the light beam LB (LB1~LB6) emitted from the light introduction optical system BDU (BDU1~BDU6) enters the beam scanning device MD (MD1~MD6) through the opening Hs (Hs1~Hs6).

The second frame portion Ub2 holds each of the beam scanning devices MD (MD1 to MD6) so as to be rotatable about the irradiation center axis Le (Le1 to Le6). That is, with the second frame portion Ub2, each beam scanning device MD (MD1 to MD6) can rotate around the irradiation central axis Le (Le1 to Le6). The holding structure of the second frame portion Ub2 to the beam scanning device MD will be described in detail later.

FIG. 5 is a detailed diagram showing the optical configuration of the light introducing optical system BDU, and FIG. 6 is a schematic explanatory diagram for describing the optical path switching (ON/OFF of the light beam LB) by the optical element AOM. The odd-numbered light-introducing optical systems BDU1, BDU3, BDU5 and the even-numbered light-introducing optical systems BDU2, BDU4, BDU6 are arranged symmetrically with respect to the central plane Poc. In addition, since the light introduction optical systems BDU (BDU1 to BDU6) have the same configuration, only the light introduction optical system BDU1 will be described, and the description of other light introduction optical systems BDU will be omitted.

The light introduction optical system BDU1 has optical lens systems G1 and G2 and mirrors M1 to M5 in addition to the optical element AOM1 for drawing. In the optical element for drawing AOM1, the light beam LB1 enters in such a way as to form a waist in the optical element for drawing AOM1. The optical element for drawing AOM1, as shown in FIG. 6, when the drive signal (high-frequency signal) from the control device 18 is in the OFF (Low) state, causes the incident light beam LB1 to pass through the absorber AB. When the drive signal (high frequency signal) is ON (High), the incident light beam LB1 is diffracted once The diffracted light is directed toward the mirror M1. The absorber AB is a light catcher for suppressing leakage of the light beam LB1 to the outside and absorbing the light beam LB1. The control device 18 turns ON/OFF (High/Low) the drive signal (high-frequency signal) to be applied to the optical element for drawing AOM1 at high speed based on the pattern data, thereby switching the beam LB1 toward the mirror M1 (optical for drawing) The element AOM1 is ON) or toward the absorber AB (the optical element AOM1 for drawing is OFF). This matter, when viewed on the irradiated surface of the substrate FS, represents the intensity of the spot light SP of the light beam LB1 that reaches the irradiated surface (substrate FS) from the beam scanning device MD1, and is adjusted to a high level at high speed according to the pattern data Either of the low level (such as the zero level).

The pattern data is composed of a plurality of pixel data decomposed into two dimensions, with the direction along the scanning direction (Y direction) of the spot light SP as the column direction and the direction along the transport direction (X direction) of the substrate FS as the row direction Bit map data. This pixel data is 1-bit data of "0" or "1". The pixel data of "0" represents that the intensity of the spot light SP irradiated on the substrate FS is set to a low level, and the pixel data of "1" represents that the intensity of the spot light SP irradiated on the substrate FS is set to a high level meaning. Therefore, when the pixel data is "0", the control device 18 outputs an OFF drive signal (high-frequency signal) to the optical element AOM1 for drawing of the light introducing optical system BDU1, and turns ON when the pixel data is "1" The driving signal (high frequency signal) is output to the optical element AOM1 for drawing. The number of pixel data in one line of the pattern data is determined by the size of the pixel on the illuminated surface and the length of the drawing line SLn. The size of one pixel is determined by the size φ of the spot light SP. As described previously, when the spot light SP continuously irradiated on the illuminated surface is superimposed only by about 1/2 of the size φ, the size of one pixel is set to the degree of the size φ of the spot light SP or higher. For example, when the effective size φ of the spot light SP is 3 μm (the amount of overlap is 1.5 μm), the size of one pixel is set to be 3 μm square or higher. Therefore, in order to make changes For the drawing of fine patterns, the effective size φ of the spot light SP needs to be set smaller to set the size of 1 pixel smaller. Therefore, when the spot light SP overlaps only about 1/2 of the size φ, the number of spot lights SP (the number of pulses) projected along the drawing line SL1 is twice the number of pixel data for one line of pattern data. This pattern data is stored in memory (not shown). In addition, there is a case where one line of pixel data is called a pixel data line Dw. The pattern data is a bitmap data in which a plurality of pixel data lines Dw (Dw1, Dw2, ‧‧‧, Dwn) are arranged in the row direction

In detail, the control device 18 reads out the pixel data row (one row of pixel data) Dw (for example, Dw1) of the pattern data, which is synchronized with the scanning of the spot light SP by the beam scanning device MD1, and will be based on the read out The driving signal of the pixel data of the pixel data row Dw1 is sequentially output to the drawing optical element AOM1 of the light introduction optical system BDU1. Specifically, at the timing of 2 pulses of each projected spot light SP along the drawing line SL1, the data of 1 pixel selected in the read pixel data row Dw1 is shifted along the column direction, and will be shifted according to the selected 1 The driving signals of the data of the pixels are sequentially output to the optical element AOM1 for drawing. According to this, for every two pulses of the spot light SP irradiated on the irradiation surface of the substrate FS, the intensity is adjusted according to the pixel data. The control device 18 reads out the pixel data row Dw2 of the next row at the end of the scanning of the spot light SP. And as the scanning of the spot light SP of the beam scanning device MD1 starts, the driving signal according to the read pixel data of the pixel data row Dw2 is output to the drawing optical element AOM1 of the light introduction optical system BDU1 according to the output. In this way, each time the scanning of the spot light SP is started, the driving signal according to the pixel data of the pixel data row Dw of the next row is output to the optical element for drawing AOM1 in accordance with it. According to this, the pattern according to the pattern data can be drawn and exposed. Also, the pattern data is set for each beam scanning device MD.

The light beam LB1 from the optical element AOM1 for drawing passes through the optical lens system G1 for beam shaping and enters the absorber AB or the mirror M1. That is to say, The optical element AOM1 is ON or OFF, and the light beam LB1 passing through the optical element AOM1 for drawing also penetrates the optical lens system G1. When the drawing optical element AOM1 is switched on and the light beam LB1 enters the mirror M1, the light beam LB1 bends its optical path due to the mirrors M1 to M5 in FIG. 5 and exits from the mirror M5 to the beam scanning device MD1 . At this time, the mirror M5 emits the light beam LB1 coaxially with the irradiation center axis Le1. In other words, the mirrors M1 to M5 of the light-introducing optical system BDU1 are used to bend the optical path into the axis of the light beam LB1 from the light-introducing optical system BDU1 to be coaxial with the irradiation central axis Le1 set in the beam scanning device MD1. Beam scanning device MD1. In addition, an optical lens system G2 for beam shaping is provided between the mirror M4 and the mirror M5. In addition, the exposure head 16 composed of at least a plurality of beam scanning devices MD (MD1 to MD6) and the light introduction optical system BDU (BDU1 to BDU6) constitute a drawing device of this embodiment. In addition, the body frame UB may also be configured as a part of the drawing device.

Next, the optical configuration of the beam scanning device MD will be described with reference to FIG. 7 (and FIG. 5). Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description will be omitted for other beam scanning devices MD. In FIG. 7 (and FIG. 5), the direction parallel to the irradiation center axis Le (Le1) is the Zt direction, and the substrate FS is oriented from the processing device PR1 through the exposure device EX on a plane orthogonal to the Zt direction The direction of the processing device PR2 is the Xt direction, and the direction orthogonal to the Xt direction on the plane orthogonal to the Zt direction is the Yt direction. That is to say, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 7 (and FIG. 5) rotate the three-dimensional coordinates of X, Y, and Z in FIG. 1 about the Y axis, and rotate them into the Z axis direction and the irradiation center axis Le (Le1) Parallel three-dimensional coordinates.

As shown in FIG. 7, in the beam scanning device MD1, a mirror M10 is provided along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the illuminated surface (substrate FS). Beam expander BE, mirror M11, polarizing beam splitter BS1, mirror M12, image shift optical member (parallel flat plate) SR, deflection adjustment optical member (稜鏡) DP, field aperture FA, mirror M13, λ/ 4 wavelength plate QW, cylindrical lens CYa, reflecting mirror M14, polygon mirror (polygon mirror) PM, fθ lens FT, reflecting mirror M15, cylindrical lens CYb. Further, in the beam scanning device MD1, an optical lens system G10 and a photodetector DT1 are provided through the polarizing beam splitter BS1 to detect the reflected light from the illuminated surface (substrate FS).

The light beam LB1 incident on the beam scanning device MD1 travels in the -Zt direction, and enters the mirror M10 inclined 45° relative to the XtYt plane. The axis of the light beam LB1 incident on the beam scanning device MD1 is incident on the mirror M10 in a coaxial manner with the irradiation central axis Le1. The mirror M10 functions as an incident optical member that causes the light beam LB1 to enter the beam scanning device MD1, and reflects the incident light beam LB1 along the optical axis AXa set parallel to the Xt axis toward the mirror M11 in the -Xt direction. Therefore, the optical axis AXa is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The light beam LB1 reflected by the mirror M10 passes through the beam expander BE arranged along the optical axis AXa and enters the mirror M11. Beam expander BE is used to enlarge the diameter of the transmitted light beam LB1. The beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that collimates the light beam LB1 emitted by the condensing lens Be1 into parallel light.

The reflecting mirror M11 is arranged inclined at 45° with respect to the YtZt plane, and reflects the incident light beam LB1 (optical axis AXa) toward the polarizing beam splitter BS1 in the -Yt direction. The polarization separation surface of the polarizing beam splitter BS1 is arranged at an angle of 45° with respect to the YtZt plane, and is used to reflect the beam of P-polarized light and penetrate the beam of linearly polarized light (S-polarized light) in the direction orthogonal to the P-polarized light. The light beam LB1 incident on the beam scanning device MD1 is a P-polarized light beam, so the polarizing beam splitter BS1 reflects the light beam LB1 from the mirror M11 toward the -Xt direction to guide the mirror M12 side.

The reflecting mirror M12 is arranged inclined at 45° with respect to the XtYt plane, and reflects the incident light beam LB1 toward the reflecting mirror M13 separated from the reflecting mirror M12 in the -Zt direction toward the -Zt direction. The light beam LB1 reflected by the mirror M12 passes through the image shift optical member SR, the deflection adjusting optical member DP, and the field aperture (field stop) FA along the optical axis AXc parallel to the Zt axis, and enters the mirror M13. The image shift optical member SR performs two-dimensional adjustment of the center position in the cross section of the light beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction (optical axis AXc) of the light beam LB1. The image shift optical member SR is composed of two quartz parallel flat plates Sr1 and Sr2 arranged along the optical axis AXc. The parallel flat plate Sr1 can be tilted about the Xt axis and the parallel flat plate Sr2 can be tilted about the Yt axis. The parallel flat plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, and the center position of the light beam LB1 is slightly shifted two-dimensionally on the XtYt plane orthogonal to the traveling direction of the light beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (driving unit) not shown under the control of the control device 18.

The deflection adjusting optical member DP is used to finely adjust the inclination of the light beam LB1 from the image shifting optical member SR after being reflected by the mirror M12 with respect to the optical axis AXc. The deflection adjusting optical member DP is composed of two wedge-shaped prisms Dp1 and Dp2 arranged along the optical axis AXc, and the prisms Dp1 and Dp2 are provided so as to independently rotate 360° around the optical axis AXc. By adjusting the rotation angle positions of the two dimples Dp1 and Dp2, the axis of the light beam LB1 reaching the mirror M12 is parallel to the optical axis AXc, or the axis of the light beam LB1 reaching the illuminated surface (substrate FS) and the irradiation center The axis Le1 is parallel. In addition, the beam LB1 after being deflected and adjusted by the two beams Dp1 and Dp2 may traverse in a plane parallel to the cross-section of the beam LB. This traverse can be caused by the optical member SR being shifted back by the previous image. To the original state. The 珜鏡Dp1, Dp2 is driven by an actuator (driving unit) not shown under the control of the control device 18.

As mentioned before, the optical member SR and the deflection adjustment optical member The light beam LB1 of DP passes through the circular opening of the field aperture FA and reaches the mirror M13. The circular opening of the field aperture FA is a diaphragm for removing the gentle portion of the intensity distribution in the cross section of the beam LB1 amplified by the beam expander BE. If the circular opening of the field aperture FA is replaced with a variable aperture diaphragm with adjustable aperture, the intensity (brightness) of the spot light SP can be adjusted.

The mirror M13 is arranged at an angle of 45° with respect to the XtYt plane, and reflects the incident light beam LB1 toward the mirror M14 in the +Xt direction. The light beam LB1 reflected by the mirror M13 passes through the λ/4 wavelength plate QW and the cylindrical lens CYa and enters the mirror M14. The reflecting mirror M14 reflects the incident light beam LB1 toward the polygon mirror (rotating polygon mirror, scanning deflection member) PM. The polygon mirror PM reflects the incident light beam LB1 toward the +Xt direction side toward the fθ lens FT having an optical axis AXf parallel to the Xt axis. In the polygon mirror PM, in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS, the incident light beam LB1 is deflected (reflected) in a plane parallel to the XtYt plane. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt axis direction, and a plurality of reflection surfaces RP (in this embodiment, eight reflection surfaces RP) formed around the rotation axis AXp. By rotating the polygon mirror PM about the rotation axis AXp in a predetermined rotation direction, the reflection angle of the pulse beam LB1 irradiated on the reflection surface RP can be continuously changed. Accordingly, the reflection direction of the light beam LB1 can be deflected by one reflection surface RP, so that the spot light SP of the light beam LB1 irradiated on the irradiated surface of the substrate FS can be scanned in the scanning direction (the width direction of the substrate FS, the Yt direction) .

In other words, the spot light SP of the light beam LB1 can be scanned along the drawing line SL1 by one reflection surface RP. Therefore, with one rotation of the polygon mirror PM, the number of drawing lines SL1 scanned by the spot light SP on the illuminated surface of the substrate FS is the same as the number of reflection surfaces RP. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive part RM including a motor or the like. The rotation of the polygon mirror PM by the polygon mirror drive unit RM is controlled by the control device 18. As before Note that the effective length (for example, 50 mm) of the drawing line SL1 is set to a length that can scan the spot light SP of the polygon mirror PM under the maximum scan length (for example, 51 mm). Under the initial setting (on design), the maximum scan length The center point of the drawing line SL1 is set in the center (the irradiation center axis Le1 passes).

For example, when the effective length of the drawing line SL1 is 50 mm, the point light SP is irradiated on the irradiated surface of the substrate FS along the drawing line SL1 while overlapping the spot light SP with the effective size φ of 4 μm every 2.0 μm. The number of spot light SP (pulse light) scanned and irradiated is 25000 (=50mm/2.0μm). In addition, if the travel speed (transport speed) Vt of the substrate FS in the sub-scanning direction is 8 mm/sec, and the scanning of the spot light SP in the sub-scanning direction is also performed at intervals of 2.0 μm, one scan along the drawing line SL1 starts The time difference Tpx between the time point and the start point of the next scan is 250 μsec (=2.0 μm/(8 mm/sec)). This time difference Tpx is the time when the polygon mirror PM of the 8 reflection surface RP rotates by 1 angle 45° (=360°/8). At this time, since the rotation time of 1 rotation of the polygon mirror PM is set to 2.0m seconds (=8×250μsec), the rotation speed Vp of the polygon mirror PM is set to 500 rotations per second (=1/2.0m seconds). That is 30,000 rpm.

On the other hand, the light beam LB1 reflected on the 1 reflection surface RP of the polygon mirror PM effectively enters the maximum incident angle of view of the fθ lens FT (corresponding to the maximum scan length of the spot light SP), which is roughly determined by the focal length of the fθ lens FT and the maximum scan The long decision. For example, in the case of a polygon mirror PM with 8 reflection surfaces RP, the ratio of the rotation angle (scanning efficiency αp) that contributes to the actual scanning at a rotation angle of 45° of 1 reflection surface RP is about 1/3, corresponding to fθ The maximum incident angle of view of the lens FT (±15° range, that is, 30° range). Therefore, the effective time Tss of 1 scan of the spot light SP along the drawing line SL1 is Tss≒Tpx/3. In the case of the previous numerical example, the time Tss is 83.33‧‧‧μs Therefore, since it is necessary to irradiate 25,000 points of light SP (pulse light) during this time Tss, the luminous frequency Fe of the pulsed light beam LB from the light source device 14 is Fe=25000 times/83.333‧‧‧μs=300MHz.

As described above, in addition to the size φ (μm) of the spot light SP and the luminous frequency Fe (Hz) of the light source device 14, the length of the drawing line SLn is LBL (μm), and the overlap rate of the spot light SP is Uo( 0<Uo<1), the transfer speed of the substrate FS is Vt (μm/sec), the number of reflection surfaces RP of the polygon mirror PM is Np, and the scanning efficiency of each reflection surface RP of the polygon mirror PM is αp (0<αp<1 ), and φ‧(1-Uo)=YP(μm), the rotational speed Vp(rps) of the polygon mirror PM is expressed as Vp=Vt/(Np‧YP), and the luminous frequency Fe(Hz) is Fe=LBL ‧Vt/(αp‧YP ² ) means. When these two relational expressions are integrated at the conveying speed Vt, it becomes the following expression.

Vt=(Vp‧Np‧YP)=(Fe‧αp‧YP ² /LBL)

Therefore, in order to satisfy this relationship, the transfer speed Vt (μm/sec) of the substrate FS, the rotation speed Vp (rps) of the polygon mirror PM, and the light emission frequency Fe (Hz) of the light source device 14 are adjusted.

Returning to the description about FIG. 7 again, the cylindrical lens CYa makes the incident light beam LB1 on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) formed by the polygon mirror PM The upper part will converge into a slit shape. Even if the cylindrical lens CYa whose generatrix is parallel to the Yt direction causes the reflection surface RP to be inclined with respect to the Zt direction (the inclination of the reflection surface RP with respect to the normal of the XtYt plane), its influence can be suppressed to suppress irradiation on the substrate The case where the irradiation position of the light beam LB1 on the irradiated surface of FS deviates from the Xt direction.

The fθ lens FT having an optical axis AXf extending in the Xt axis direction is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM to the mirror M15 in the XtYt plane parallel to the optical axis AXf. The incident angle θ of the light beam LB1 to the fθ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT, through the mirror M15 and the cylindrical lens CYb, projects the light beam LB1 on the illuminated surface of the substrate FS proportional to the incident angle θ Like high position. When the focal distance is fo and the image height position is y, the fθ lens FT is designed to satisfy the relationship of y=fo‧θ. Therefore, by the fθ lens FT, the light beam LB1 can be accurately scanned at a constant speed in the Yt direction (Y direction). When the incident angle θ incident on the fθ lens FT is 0 degrees, the light beam LB1 incident on the fθ lens FT advances along the optical axis AXf.

The mirror M15 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction. With the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction, the light beam LB1 projected onto the substrate FS converges on the illuminated surface of the substrate FS into minute spot light SP having a diameter of several μm (for example, 3 μm). The spot light SP projected onto the illuminated surface of the substrate FS is scanned one-dimensionally by the polygon mirror PM with the drawing line SL1 extending in the Yt direction. In addition, the optical axis AXf of the fθ lens FT is on the same plane as the irradiation center axis Le1, and this plane is parallel to the XtZt plane. Therefore, the light beam LB1 traveling on the optical axis AXf is reflected by the mirror M15 in the -Zt direction, and is projected onto the substrate FS coaxially with the irradiation center axis Le1. In this embodiment, at least the fθ lens FT system functions as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM on the illuminated surface of the substrate FS. Furthermore, at least the reflecting member (mirrors M11 to M15) and the polarizing beam splitter BS1 function as a light path deflecting member that bends the optical path of the light beam LB1 from the mirror M10 to the substrate FS. By this optical path deflecting member, the incident axis of the light beam LB1 incident on the mirror M10 and the irradiation center axis Le1 can be made substantially coaxial. In the XtZt plane, the light beam LB1 passing through the beam scanning device MD1 passes through a substantially U-shaped or zigzag-shaped optical path, and then advances toward the -Zt direction and is projected on the substrate FS.

As described above, in a state where the substrate FS is transported in the X direction, the spot light SP of the light beam LB (LB1 to LB6) can be performed in the scanning direction (Y direction) by each beam scanning device MD (MD1 to MD6) Dimensional scanning, according to which the spot light SP enters the illuminated surface of the substrate FS Line-by-line two-dimensional scanning. Therefore, a predetermined pattern can be drawn and exposed on the exposure area W of the substrate FS. In addition, although the optical elements for drawing AOM (AOM1 to AOM6) are provided in the light introduction optical system BDU (BDU1 to BDU6), they may be provided in the beam scanning device MD. In this case, it is preferable to provide the optical element AOM for drawing between the mirror M10 and the mirror M14.

The photodetector DT1 has a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotating drum DR. The part on the rotating drum DR formed with this reference pattern is made of a material with a low reflectivity (10 to 50%) to the wavelength band of the light beam LB, and the other part on the rotating drum DR without forming the reference pattern, then It is composed of materials with a reflectivity of less than 10% or materials that absorb light. Therefore, in a state where the substrate FS is not wound (or a state where the transparent portion of the substrate FS passes through), when the spot light SP of the light beam LB1 from the beam scanning device MD1 is irradiated to the area where the reference pattern is formed of the rotary drum DR, The reflected light passes through the cylindrical lens CYb, reflector M15, fθ lens FT, polygon mirror PM, reflector M14, cylindrical lens CYa, λ/4 wavelength plate QW, reflector M13, field aperture FA, deflection adjustment optical member DP, the image shift optical member SR, and the mirror M12 enter the polarizing beam splitter BS1. Here, a λ/4 wavelength plate QW is provided between the polarizing beam splitter BS1 and the substrate FS, specifically between the mirror M13 and the cylindrical lens CYa. In this way, the light beam LB1 irradiated on the substrate FS is converted from the P-polarized light into the circularly polarized light beam LB1 by the λ/4 wavelength plate QW, and the reflected light that enters the polarized beam splitter BS1 from the substrate FS is the λ/4 wavelength The plate QW is converted from circular polarized light to S polarized light. Therefore, the reflected light from the substrate FS passes through the polarizing beam splitter BS1, passes through the optical lens system G10, and enters the photodetector DT1.

At this time, when the optical element AOM1 for drawing light into the optical system BDU1 is turned on, that is, the pulsed light beam LB1 continuously enters the beam scanning device In the state of MD1, the spot light SP is scanned by the beam scanning device MD1 by rotating the rotating drum DR, and the spot light SP is two-dimensionally irradiated on the outer peripheral surface of the rotating drum DR. Therefore, the image of the reference pattern formed on the rotating drum DR can be acquired by the photodetector DT1.

Specifically, it changes the intensity of the photoelectric signal output from the photodetector DT1 in response to the clock pulse signal (made in the light source device 14) for performing the pulse light emission of the spot light SP, and digitally samples each scanning time, It is obtained as one-dimensional image data in the Yt direction. Further, in response to the measurement value of the encoder EC that measures the rotation angle position of the rotating drum DR, the one-dimensional image data in the Yt direction is arranged at a certain distance in the sub-scanning direction (for example, 1/2 of the size φ of the spot light SP) In the Xt direction, two-dimensional image information on the surface of the rotating drum DR is obtained accordingly. The control device 18 measures the inclination of the drawing line SL1 of the beam scanning device MD based on the two-dimensional image information of the reference pattern of the rotating drum DR thus obtained. The inclination of the drawing line SL1 may be a relative inclination between the beam scanning devices MD (MD1 to MD6), or an inclination (absolute inclination) with respect to the central axis AXo of the rotary drum DR. Of course, the inclination of each drawing line SL2-SL6 can also be measured in the same way.

An origin sensor 20 is provided around the polygon mirror PM of the beam scanning device MD1 as shown in FIG. 8. The origin sensor 20 outputs a pulse-shaped origin signal SH indicating that the scanning of the spot light SP by each reflection surface RP starts. The origin sensor 20 outputs the origin signal SH when the rotation position of the polygon mirror PM comes to a predetermined position before the scanning of the spot light SP by the reflection surface RP starts. The polygon mirror PM can deflect the light beam LB1 projected on the substrate FS within the effective scanning angle range θs. That is, when the reflection direction (deflection direction) of the light beam LB1 reflected by the polygon mirror PM enters the effective scanning angle range θs, the reflected light beam LB1 enters the fθ lens FT. Therefore, the origin sensor 20 comes to the light reflected by the reflection surface RP at the rotation position of the polygon mirror PM When the reflection direction of the beam LB1 enters a predetermined position before the effective scanning angle range θs, the origin signal SH is output. Since the polygon mirror PM performs 1 rotation, the scanning of the spot light SP is performed 8 times, so the origin sensor 20 also outputs the origin signal SH 8 times during this 1 rotation. The origin signal SH detected by the origin sensor 20 is sent to the control device 18. After the origin sensor 20 outputs the origin signal SH, scanning of the spot light SP along the drawing line SL1 is started.

The origin sensor 20 uses the adjacent reflection surface RP (in this embodiment, the reflection surface RP immediately before the rotation direction of the polygon mirror PM) of the reflection surface RP that is about to start scanning of the spot light SP (deflection of the light beam LB) ), output the origin signal SH. In order to distinguish the reflection surfaces RP, in FIG. 8, the reflection surface RP that is undergoing the deflection of the light beam LB1 is represented by RPa, and the other reflection surfaces RP follow the counterclockwise direction (the direction opposite to the rotation direction of the polygon mirror PM) ) Expressed as RPb~RPh.

The origin sensor 20 includes a light beam transmitting system 20a having a light source section 22 that emits a laser beam Bga of a non-photosensitive wavelength band such as a semiconductor laser, and a laser that emits light from the light source section 22 The light beam Bga is reflected and projected onto the reflecting mirrors 24 and 26 of the reflecting surface RPb of the polygon mirror PM. In addition, the origin sensor 20 includes a light beam receiving system 20b having a light receiving unit 28 and a reflecting mirror that guides the reflected light of the laser beam Bga (reflected light beam Bgb) reflected on the reflecting surface RPb to the light receiving unit 28 30, 32, and a lens system 34 that condenses the reflected light beam Bgb reflected by the mirror 32 into minute spot light. The light receiving unit 28 has a photoelectric conversion element that receives the spot light of the reflected light beam Bgb condensed by the lens system 34. Here, the position where the laser beam Bga is projected on each reflection surface RP of the polygon mirror PM is set to become the pupil plane (focus position) of the lens system 34.

The beam sending system 20a and the beam receiving system 20b are set at a predetermined position immediately before the rotation position of the polygon mirror PM reaches the scanning of the spot light SP with the reflection surface RP At this time, the position of the reflected beam Bgb of the laser beam Bga emitted from the beam transmitting system 20a can be received. That is to say, the light beam transmitting system 20a and the light beam receiving system 20b are provided when the reflection surface RP that scans the spot light SP reaches a predetermined angular position, and can receive the reflection of the laser beam Bga emitted from the light beam transmitting system 20a The position of the light beam Bgb. In addition, the symbol Msf in FIG. 8 is the axis of the rotation motor of the polygon mirror drive part RM arranged coaxially with the rotation axis AXp.

Before the light-receiving surface of the photoelectric conversion element in the light-receiving portion 28, a light-shielding body (not shown) with a small slit opening is provided. While the angular position of the reflecting surface RPb is within a predetermined angle range, the reflected light beam Bgb enters the lens system 34, and the spot light of the reflected light beam Bgb scans in a certain direction on the light-shielding body in the light receiving portion 28. In this scan, the spot light of the reflected light beam Bgb passing through the slit opening of the light-shielding body is received by the aforementioned photoelectric conversion element, and its received light signal is amplified by an amplifier and output as a pulse-shaped origin signal SH.

The origin sensor 20, as described above, detects the origin signal SH by deflecting the light beam LB to the reflective surface RPa of the (scanning spot light SP) using the one reflective surface RPb before the rotation direction. Therefore, when the angles ηj between adjacent reflection surfaces RP (for example, reflection surface RPa and reflection surface RPb) have an error with respect to the design value (135 degrees when there are 8 reflection surfaces RP), this is due to The distribution of the error is shown in FIG. 9, and there are cases where the generation timing of the origin signal SH is different on each reflection surface RP.

In FIG. 9, the origin signal SH generated using the reflective surface RPb is set to SH1. Similarly, the origin signal SH generated using the reflective surfaces RPc, RPd, RPe, ‧‧‧ is set to SH2, SH3, SH4, ‧‧‧ When the angle ηj between the adjacent reflection surfaces RP of the polygon mirror PM is the design value, the interval of the generation timing of each origin signal SH (SH1, SH2, SH3, ‧‧‧) is the time Tpx This time Tpx is the time required for the polygon mirror PM to rotate a part of the reflection surface RP. however, In FIG. 9, due to the error of the angle ηj between the reflective surfaces RP of the polygon mirror PM, the timing of the origin signal SH generated using the reflective surfaces RPc and RPd is deviated from the regular timing. In addition, the time intervals Tp1, Tp2, Tp3, and ‧‧‧ that generate the origin signals SH1, SH2, SH3, SH4, and ‧‧‧ are not constant at the μsec level due to manufacturing errors of the polygon mirror PM The timing chart shown in FIG. 9 is Tp1<Tpx, Tp2>Tpx, Tp3<Tpx. When the number of reflecting surfaces RP is Np and the rotation speed of the polygon mirror PM is Vp, the time Tpx becomes Tpx=1/(Np×Vp). For example, when the rotation speed Vp is 30,000 rpm (=500 rps) and the number Np of reflection surfaces RP of the polygon mirror PM is 8, the time Tpx is 250 μsec. In addition, in FIG. 9, in order to make the explanation easy to understand, the timing deviation of each origin signal SH1, SH2, SH3, ‧‧‧ is exaggerated

Therefore, due to the error of each angle ηj between the adjacent reflection surfaces RP of the polygon mirror PM, the drawing of the spot light SP drawn by each reflection surface RP (RPa~RPh) on the illuminated surface of the substrate FS starts The position of the point (scanning start point) deviates from the main scanning direction. As a result, the position of the drawing end point will also deviate in the main scanning direction. In other words, the positions of the drawing start point and the drawing end point of the spot light SP drawn on the respective reflection surfaces RP are not aligned in the X direction. The reason why the position of the starting point and ending point of the spot light SP deviates from the main scanning direction is that it will not be the cause of Tp1, Tp2, Tp3, ‧‧‧=Tpx

Therefore, in this embodiment, as shown in the timing chart of FIG. 9, a pulse-shaped origin signal SH is generated, and after a time Tpx is used as a drawing start point, the drawing of the spot light SP is started. In other words, after the origin signal SH is generated for a time Tpx, the control device 18 introduces the light incident on the light beam LB1 of the beam scanning device MD1 into the optical element AOM1 for drawing of the optical system BDU1, and sequentially outputs the pixels reflecting the pixel data row Dw Data drive signal (ON/OFF). In this way, the reflective surface RPb used for the detection of the origin signal SH and the actual scanning spot light SP The reflective surface RP becomes the same reflective surface.

Specifically, after generating the origin signal SH1 and the time Tpx, the control device 18 introduces light into the optical element AOM1 of the drawing optical system BDU1, and sequentially outputs a driving signal reflecting the pixel data of the pixel data row Dw1. In this way, the spot light SP can be scanned with the reflection surface RPb used for the detection of the origin signal SH1. Next, after the origin signal SH2 generates the elapsed time Tpx, the control device 18 outputs the driving signal reflecting the pixel data of the pixel data row Dw2 in sequence to the optical element AOM1 for drawing light into the optical system BDU1. In this way, the spot light SP can be scanned with the reflection surface RPc used for the detection of the origin signal SH2. In this way, by using the reflection surface RP for the detection of the origin signal SH to scan the spot light SP, even when the angles ηj between adjacent reflection surfaces RP of the polygon mirror PM are in error, they can Suppression of the deviation of the position of the drawing start point and the drawing end point of the spot light SP drawn on the reflective surface RP (RPa to RPh) on the illuminated surface of the substrate FS in the main scanning direction.

In order to achieve the above goal, the time Tpx of the polygon mirror PM to rotate 45 degrees must be correct to the μ second level, that is, the speed of the polygon mirror PM must be rotated at an equal speed without deviation and precision. When the polygon mirror PM is rotated accurately at a constant speed, the reflection surface RP used to generate the origin signal SH is always rotated 45 degrees accurately after the time Tpx, and becomes the angle that reflects the light beam LB1 toward the fθ lens FT. Therefore, by improving the rotational isokinetics of the polygon mirror PM, and also reducing the unevenness of the speed during one rotation, that is, the position of the reflective surface RP that can be used for the origin signal SH and the deflection of the light beam LB1 The position of the reflection surface RP scanned by the spot light SP is different. In this way, the freedom of arrangement of the origin sensor 20 can be improved, and an origin sensor with a high rigidity and a stable structure can be provided. Moreover, the reflection surface RP as the detection target of the origin sensor 20 is set to be the previous one in the rotation direction of the reflection surface RP that deflects the light beam LB1, but as long as it is the rotation of the polygon mirror PM Just turn the direction, not limited to the previous one. In this case, when the reflection surface RP that is the detection target of the origin sensor 20 is set to n (an integer of 1 or more) before the rotation direction of the reflection surface RP that deflects the light beam LB1, as long as the drawing start point It can be set after the origin signal SH is generated after n×time Tpx.

Further, by setting the drawing start point to n×time Tpx for each of the origin signals SH1, SH2, SH3, ‧‧‧ generated from the origin sensor 20, each corresponding drawing line SL1 The processing time of the read operation of the pixel data line, the data retransmission (communication) operation, or the correction calculation, etc., can have a margin. Therefore, transmission errors of pixel data lines, errors of pixel data lines, and partial disappearance can be surely avoided.

Furthermore, the number Np of the reflection surface RP of the polygon mirror PM is 8, the rotation number (rotation speed) Vp is 36,000 rpm, the scanning efficiency is αp≦1/3, and the effective diameter φ of the spot light SP on the substrate FS is 3 μm, the length LBL of the drawing line SL1 is 50 mm, and the overlap ratio Uo (0<Uo<1) of the distance (interval) YP between the drawing lines SL1 in the sub-scanning direction (Xt direction) from the diameter φ of the relative spot light SP When YP=φ‧(1-Uo), the scanning time Tss of the spot light SP on the drawing line SL1 is Tss=αp×Tpx=αp×1/(Np×Vp)=1/1.44( m seconds). The scanning speed Vss of the spot light SP on the drawing line SL1 is Vss=LBL/Tss=720 (m/sec). When the overlap ratio Uo is 1/2, that is, when the spot light SP is overlapped by 1/2 of the size φ, the sub-scanning speed (transport speed) Vt of the substrate FS becomes Vt=YP/Tpx=φ×Np ×Vp×(1-Uo)=7200 μm/sec, when the overlap ratio Uo is 2/3, that is, when the spot light SP is overlapped by 2/3 of the size φ, Vt=4800 μm/sec. In addition, although not described in detail, the origin sensors 20 are also provided in the beam scanning devices MD2 to MD6.

FIG. 10 shows the protection of the beam scanning device MD held by the second frame portion Ub2 A cross-sectional view of the structure. Since the retaining structure of the beam scanning device MD is the same for each beam scanning device MD, only the retaining structure of the beam scanning device MD1 will be described, and the description of the retaining structure of other beam scanning devices MD will be omitted. In FIG. 10, as in FIG. 7, the three-dimensional coordinates of Xt, Yt, and Zt are used for description.

The beam scanning device MD1 has optical components (mirrors M10 to M15, beam expander BE, polarizing beam splitter BS1, image shift optical member SR, deflection adjusting optical member DP, field aperture FA, λ/4 wavelength plate The QW, the cylindrical lenses CYa, CYb, the polygon mirror PM, the fθ lens FT, the optical lens system G10, and the photodetector DT1) are supported as shown in FIG. 7 and are supported by a support frame 40 that can rotate around the irradiation center axis Le1. The supporting frame 40 corresponds to the optical path of the light beam LB1 passing through the beam scanning device MD1, and has a substantially U-shaped or zigzag shape. The support frame 40 has two parallel support portions 42 and 44 which are parallel to the XtYt plane, are separated in the Zt direction, and are arranged substantially in parallel, and a blocking support portion 46 which blocks one end of the two parallel support portions 42 and 44. The blocking support portion 46 is provided on the -Xt direction side of the parallel support portions 42 and 44. The optical components of the beam scanning device MD (mirror M10, polygon mirror PM, fθ lens FT, mirror M15, cylindrical lens CYb, etc.) are arranged along the outer peripheral surface of the support frame 40.

Although not shown, the mirrors M10, M11, the beam expander BE, the polarizing beam splitter BS1, the optical lens system G10, and the photodetector DT1 are supported on the surface of the parallel support 42 on the +Zt direction side . Similarly, although not shown, the image shifting optical member SR, the deflection adjusting optical member DP, and the field aperture FA are supported on the surface of the blocking support portion 46 on the -Xt direction side. Further, although not shown, the λ/4 wavelength plate QW, the cylindrical lenses CYa, CYb, the mirrors M14, M15, the polygon mirror PM, the fθ lens FT, and the origin sensor 20, at the parallel support 44- The surface on the Zt direction side is supported. The surface of the mirror M12 on the +Zt direction side of the parallel support 42 or closed The surface of the plug support portion 46 on the -Xt direction side is supported, and the mirror M13 is supported on the surface of the blocking support portion 46 on the -Xt direction side or the surface of the parallel support portion 44 on the -Zt direction side. The support frame 40 (particularly the parallel support portion 44) supports the polygon mirror PM by supporting the polygon mirror drive portion RM (rotating motor).

On the other end side of the two parallel support portions 42 and 44 where the blocking support portion 46 is not provided, a cylindrical (round tube)-shaped pillar member BX1 constituting a part of the drawing device is provided in an inserted state. An annular bearing 48 is installed between each of the parallel support portions 42 and 44 and the pillar member BX1. The pillar member BX1 is supported while being fixed to the second frame portion Ub2. Therefore, the support frame 40 can rotate about the pillar member BX1 relative to the second frame portion Ub2 of the main body frame UB. In addition, the central axis of the pillar member BX1 is coaxial with the irradiation central axis Le1, and the ring bearing 48 of a part of the drawing device is fixed to each of the parallel support portions 42 and 44 with the outer wheel portion inside the ring bearing 48 The wheel portion is fixed to the outer peripheral surface of the pillar member BX1. Among the two ring bearings 48, the ring bearing 48 between the parallel support portion 42 on the +Zt direction side and the pillar member BX1 is, for example, a ball bearing with a combination of back angles, and the parallel support on the -Zt direction side The annular bearing 48 between the portion 44 and the pillar member BX1 is constituted by a deep groove ball bearing. The beam scanning device MD1 (including the support frame 40) is in a state where it is inclined by the support member BX1 with respect to the center plane Poc by θ at a position shifted from the center of gravity of the entire body in the +X (+Xt) direction (FIG. 1, FIG. 4) Support. As described above, the beam scanning device MD1 is cantilevered and supported on the pillar member BX1 (second frame portion Ub2) provided at the position of the irradiation center axis Le1.

The beam scanning device MD1 has a driving mechanism 50 that rotates the support frame 40 to the second frame portion Ub2. The drive mechanism 50 is provided in the space between the two parallel support portions 42 and 44. In this way, the beam scanning device MD1 can be made more compact. Refer to Figure 11 for further details on this drive Motion mechanism 50. The drive mechanism 50 has a linear actuator 52, a movable member 54, a driven member 56, and springs 58 and 60. The linear actuator 52, the movable member 54 and the spring 58 are supported on a plate-shaped drive support member 62 parallel to the XtYt plane. The +Xt direction end of the drive support member 62 is integrally provided with a vertical portion 62a parallel to the YzZt plane and extending in a plate shape in the +Zt direction. The vertical portion 62a is fixed to the side surface Ub2a parallel to the YtZt plane of the second frame portion Ub2. Further, on the side surface Ub2a of the second frame portion Ub2, a U-shaped concave portion Ubx that fits and holds the U-shaped pillar member BX1 is formed so that the center line of the circular tubular pillar member BX1 is coaxial with the irradiation center axis Le1. The pillar member BX1 fitted in the recess Ubx is fixed by being sandwiched between the vertical portion 62a of the drive support member 62 and the recess Ubx.

The driven member 56 is supported in a state of being fixed to the inner surface side (side surface in the +Xt direction) of the blocking support portion 46 of the support frame 40. The driven member 56 comes into contact with a part of the movable member 54 that rotates under the linear thrust of the linear actuator 52 and receives the force in the -Yt direction. Accordingly, the entire beam scanning device MD1 rotates around the pillar member BX1 (irradiation center axis Le1).

The structure and operation will be described in further detail. The linear actuator 52 has a lever 52a that can advance and retreat in the Xt direction, and is controlled by the control device 18 to advance and retract the lever 52a in the Xt direction. The movement position of the rod 52a in the Xt direction is measured with a high-precision linear encoder, etc., and the measured value is sent to the control device 18. The movable member 54 can rotate around the rotation shaft 54a provided in the drive support member 62. The movable member 54 has a first contact portion 54b that contacts the roller 52b at the front end of the lever 52a, that is, a roller (second contact portion) 54c that contacts the end surface parallel to the XtZt plane of the driven member 56. The tension spring 58 urges the first contact portion 54b in the +Xt direction so that the roller 52b at the front end of the rod 52a abuts against the first contact portion 54b of the movable member 54 at any time. therefore, One end of the tension spring 58 is fixed to the drive support member 62, and the other end is fixed to the vicinity of the first contact portion 54b of the movable member 54. The extension spring 60 is supported by the roller (second contact portion) 54c of the movable member 54 and the end surface parallel to the XtZt plane of the driven member 56 at any time, which causes the movable member The roller 54c of 54 pulls the spring pressure on the driven member 56 side. Therefore, one end of the tension spring 60 is fixed to the shaft portion of the roller 54c of the movable member 54 and the other end is fixed to the driven member 56.

When the rod 52a of the linear actuator 52 is positioned at the midpoint of the travel stroke in the Xt direction, the contact surface of the first contact portion 54b of the movable member 54 that is in contact with the roller 52b and the contact surface that is in contact with the roller 54c The contact surface of the aforementioned end face portion of the driven member 56 is set to be orthogonal in the XtYt plane. Also, as shown in FIG. 11, when the rod 52a of the linear actuator 52 is in the neutral position, when setting a line segment Pmc passing through the irradiation central axis Le1 and the Xt axis, the center of gravity of the beam scanning device MD1 in the XtYt plane That is, it is roughly set on the line segment Pmc. Further, the rotation axis 54a of the movable member 54 and the axis of the roller 54c are also arranged on the line segment Pmc.

When the linear actuator 52 moves the lever 52a from the neutral position in FIG. 11 to the -Xt direction, the first contact portion 54b of the movable member 54 is pressed against the spring 52 by the roller 52b at the front end of the lever 52a, so the movable member 54 rotates counterclockwise in the paper surface of FIG. 11 with the rotation axis 54a as the center. In this way, the roller 54c of the movable member 54 is about to be pressed by the driven member 56 in the -Yt direction. Therefore, the beam scanning device MD1 (support frame 40) rotates toward the -Yt direction side (also referred to as -θzt rotation) on the blocking support portion 46 side, that is, around the irradiation center axis Le1. In addition, when the linear actuator 52 moves the rod 52a in the +Xt direction from the neutral position in FIG. 11, the first contact portion 54b of the movable member 54 maintains the contact state with the roller 52b due to the urging force of the spring 58. Xt side movement. Accordingly, the movable member 54 is centered on the paper surface of FIG. 11 with the rotation axis 54a as the center When the inside rotates clockwise, the roller 54c of the movable member 54 moves in the +Yt direction. At this time, due to the urging force of the spring 60, the driven member 56 keeps the contact state with the roller 54c and moves in the +Yt direction. Therefore, the blocking support portion 46 side of the beam scanning device MD1 rotates toward the +Yt direction side (also referred to as +θzt rotation) around the irradiation center axis Le1.

In this embodiment, since the distance from the rotating shaft 54a of the movable member 54 to the first contact portion 54b is set to be longer than the distance from the rotating shaft 54a of the movable member 54 to the axis of the roller 54c, the linear actuator 52 The movement amount of the lever 52a in the Xt direction is reduced, and becomes the movement amount of the driven member 56 in the Yt direction. Furthermore, the distance from the center line of the mechanical rotation center circular tubular pillar member BX1 (illumination center axis Le1) of the beam scanning device MD1 to the driven member 56 to which the rotational driving force is given can be made longer Therefore, the rotation angle of the beam scanning device MD1 relative to the unit movement amount of the rod 52a of the linear actuator 52 can be sufficiently small, and the rotation angle setting of the beam scanning device MD1 can be controlled with high resolution (μrad).

As shown in the configuration shown in FIG. 10 (or FIG. 4) above, each beam scanning device MD1 to MD6 is opposed to the device body (second frame portion Ub2), and is supported by a circular tubular pillar member BX1 and a ring bearing 48 shaft It can rotate coaxially with each irradiation central axis Le1~Le6. Therefore, the beam scanning devices MD1 to MD6 are held in the device body near the upper side of the drawing lines SL1 to SL6 formed on the substrate FS, and the blocking support portion 46 side of the beam scanning devices MD1 to MD6 becomes a mechanical Constrained structure (not firmly connected to the device body or body frame UB, etc.).

Therefore, even when the support frame 40 (especially the two parallel support portions 42 and 44), which is the structure of each beam scanning device MD1 to MD6, thermally expands due to temperature changes, etc., each beam scanning device MD1 to MD6 10 and FIG. 11 is mainly thermal expansion in the direction of -Xt (occlusion support portion 46 side), so it is possible to suppress each drawing line SL1 ~ SL6 to rotate along The direction of the outer peripheral surface of the drum DR varies. That is to say, there is also an interval between the odd-numbered drawing lines SL1, SL3, SL5 shown in FIG. 3 and the even-numbered drawing lines SL2, SL4, SL6 in the X direction without thermal deformation of the structure caused by temperature changes In this case, the advantage of maintaining a certain distance in the micron level. Furthermore, the second frame portion Ub2 and the pillar member BX1 that support the beam scanning devices MD1 to MD6 are made of a metal material with low thermal expansion coefficient (indium carbide, etc.) or glass ceramic material (trade name: Zerodur, etc.) , That can be further made into a thermally stable structure.

As described above, in this embodiment, the circular tubular pillar member BX1 and the ring bearing 48 shown in FIG. 10 (or FIG. 4) are equivalent to placing the support frame 40 (that is, the entire beam scanning device MD) against the device body. That is, the second frame portion Ub2 is supported as a rotation support mechanism that can rotate around the irradiation center axis Le (Le1 to Le6). In addition, in this embodiment, the annular bearings 48 at the upper and lower positions shown in FIG. 10 are equivalent to placing the support frame 40 (that is, the entire beam scanning device MD) against the device body (the second frame portion Ub2 ) Is limited to an area within a predetermined radius from the irradiation center axis Le (Le1 to Le6) (here, the radius of the outer circumference of the annular bearing 48), and is used to couple the support frame 40 to the coupling member of the device body. In addition, in the structure as shown in FIG. 10, the support frame 40 (the entire beam scanning device MD) does not need to be rotated by θzt relative to the device body (second frame portion Ub2), and the support frame 40 can be firmly coupled to the second machine In the case of the frame portion Ub2, it is only necessary to omit the ring bearing 48 and join the upper end of the circular tubular pillar member BX1 to the parallel support 42 and join the lower end of the pillar member BX1 to the parallel support 44. In this case, the circular tubular pillar member BX1 having a predetermined radius from the irradiation center axis Le (Le1 to Le6) also functions as a coupling member.

FIG. 12 is a perspective view showing a state where the pillar member BX1 and the drive support member 62 are attached to the second frame portion Ub2 shown in FIG. 4 (or FIGS. 10 and 11). 2nd rack Ub2 is an angular columnar member extending in the Y direction, and the side surface Ub2a in the -X direction and the side surface Ub2b in the +X direction are formed to be inclined at an angle ±θ relative to the YZ plane (see FIG. 4). On the side surface Ub2a of the second frame portion Ub2, a U-shaped concave portion Ubx embedded in the circular tubular pillar member BX1 is formed so as to penetrate the side surface Ub2a, and the irradiation center axes Le1, Le3 of the odd number extending in the Zt direction , Le5 each coaxial. Similarly, on the side surface Ub2b of the second frame portion Ub2, a U-shaped concave portion Ubx embedded in the tubular pillar member BX1 is formed so as to penetrate above and below the side surface Ub2b, and an even number irradiation center extending in the Zt direction The axes Le2, Le4, Le6 are coaxial. In addition, the vertical portion 62a (refer to FIGS. 10 and 11) integrated with the drive support member 62 is fixed to the side surface Ub2a so as to block each of the concave portions Ubx formed on the side surfaces Ub2a and Ub2b of the second frame portion Ub2 , Ub2b. The second frame part Ub2 of this structure is combined with the third frame part Ub3, and the third frame part Ub3 is used to be installed on the main body frame of the exposure device EX that supports the rotating drum DR, the alignment microscopes ALG1 to ALG4, etc. (Body frame BFa, BFb).

FIG. 13 is a perspective view showing a structure in which the third frame portion Ub3 shown in FIG. 12 is attached to the main body frames BFA and BFb of the exposure apparatus EX. In the previous FIG. 4, although the second frame portion Ub2 is suspended under the first frame portion Ub1 of the body frame UB, here, the second frame portion Ub2 is provided on the body frame UB A part of the main frame BFA, BFb for supporting the rotating drum DR. The third frame portion Ub3 has an angular columnar horizontal portion extending in the Y direction to fix the second frame portion Ub2 of the body frame UB in FIG. 4 at the center, and both ends in the Y direction extend in the Z direction The door-shaped structure formed by the columnar legs. The legs on both sides of the third frame portion Ub3 are supported on the main body frames BFA and BFb (also combined with the main body frame UB) of the exposure device EX that are arranged at a distance in the Y direction. Although the main frame BFA and BFb are not shown in FIG. 12, the shafts Sft projecting from the ends of the rotating drum DR shown in FIG. 2 or FIG. 4 are shown in FIG. The frame portion Ub2 is supported by bearings through bearings at positions separated by a certain distance in the -Z direction. In addition, the upper end surfaces of the main body frames BBa and BFb are formed to have a certain width in the Y direction (for example, 5 cm or more).

One leg part of the third frame part Ub3, here is the leg part on the +Y direction side, although it is fixedly installed on the main body frame BFA through the base 500, it can also be a third frame part elongated in the Z direction The foot on the +Y direction side of Ub3 is directly fixed on the body frame BFA. On the lower end surface of the leg portion on the -Y direction side of the third frame portion Ub3, a V-shaped groove 501 as a ridge parallel to the Y axis is fixedly formed, and above the body frame BFb, it can roll at this position The steel ball 502 fitted into the V-shaped groove of the gyro member 501 is supported by the method. Therefore, the gyro member 501 and the steel ball 502 have a degree of freedom of relative movement only in the Y direction of the V-shaped groove. Furthermore, between the protruding portion Ub4 on the side of the leg portion on the -Y direction side of the third frame portion Ub3 and the body frame BFb, there is provided a spring for giving the V-shaped groove of the gyro member 501 to constantly abut the steel ball 502 The compressive tension spring 503 urges the third frame portion Ub3 (and the second frame portion Ub2) in the -Z direction.

In the case of this embodiment, in the second frame portion Ub2, there are 6 beam scanning devices MD1 to MD6 with a total of 6 beam scanning devices MD1 to MD6 that are symmetrical about the center plane Poc (refer to FIGS. 4 and 5). The center of gravity of the entire exposure head 16 formed by the beam scanning devices MD1 to MD6 is located close to the center plane Poc in the X direction. Therefore, the leg portion of the third frame portion Ub3 supporting the load of the entire exposure head 16 is less likely to generate stress in the direction inclined in the X direction, and deformation of the third frame portion Ub3 and the second frame portion Ub2 can be suppressed Therefore, it is possible to stably maintain the entire exposure head 1 at a predetermined position.

Furthermore, when the main frame BFA and BFb are not made of expensive metal with low thermal expansion coefficient, but are made of general iron casting materials, light metals (aluminum), etc., the upper ends of the main frame BFA and BFb are in the Y direction. Distance, there may be zero due to changes in ambient temperature and heat generation The influence of components (motor, AOM, electrical substrate, etc.) varies in the range of a few microns. Or, it may be due to the slight eccentricity of the shaft Sft of the rotating drum DR, the shaft offset of the motor or reducer connected to the shaft Sft, the installation state of the bearings of the shaft support shaft Sft, etc., in conjunction with the rotation period of the rotating drum DR, The Y-direction stress is generated on the main frame BFA and BFb, and the Y-direction interval of the main frame BFA and BFb varies within a range of several micrometers. Even when there is such a variation of the main body frames BFA and BFb, as shown in FIG. 13, the gyro member 501 and the steel ball 502 having freedom in the Y direction support the third frame portion Ub3 and the second The frame portion Ub2 can prevent the third frame portion Ub3 and the second frame portion Ub2 from being deformed even if there is such a change.

As previously explained, the beam scanning devices MD1 to MD6 can use the photodetector DT1 shown in FIG. 7 and the reference pattern formed on the surface of the rotating drum DR to self-measure the tilt angle (tilt error) of the drawing lines SL1 to SL6. Therefore, the control device 18 can drive the linear actuator 52 of each beam scanning device MD (MD1~MD6) according to the measured tilt angle of each drawing line SLn (SL1~SL6). In this way, it is possible to make each drawing line SLn (SL1 to SL6) relatively parallel, or to make each drawing line SLn" (SL1 to SL6) parallel to the central axis AXo of the rotary drum DR. In addition, the control device 18 can also detect the deformation of the substrate FS wound around the rotating drum DR according to the position of the alignment mark MK (MK1 to MK4) on the substrate FS detected using the alignment microscope ALG (ALG1 to ALG4). Or the deformation of the exposure area W, and drive the linear actuator 52 of each beam scanning device MD (MD1~MD4) according to the deformation. In this way, the overlapping accuracy of the pattern formed in the lower layer and the predetermined pattern newly exposed can be improved.

FIG. 14 is a diagram showing the deformed state of the exposure area W in which a predetermined pattern is exposed by the exposure head 16. The deformation of the exposure area W is caused by the twisting of the substrate FS that is wound around the rotating drum DR and transported. In addition, even if the substrate FS is not twisted, there may be a substrate FS when the lower pattern layer is formed A situation in which the exposed area W of the substrate FS is distorted and deformed by being twisted and transported.

As shown in FIG. 14, due to the distortion of the exposure area W, the alignment of the formed alignment marks MK (MK1~MK4) is not a straight line, but is in a twisted state. In addition, the exposure area W'shown by the broken line shows an ideal exposure area with little distortion. The control device 18 estimates the deformation of the exposure area W based on the position of the alignment mark MK (MK1~MK4) on the substrate FS detected using the alignment microscope ALG (ALG1~ALG4), and drives each of the Linear actuator 52 of the beam scanning device MD (MD1~MD6). In addition, immediately after the start of drawing exposure using the drawing lines SL1 to SL6 to the exposure area W, although each observation area Vw1 to Vw4 on the +X direction side of the alignment microscopes ALG1 to ALG4 shown in FIG. 3 can be detected The positions of the alignment marks MK2 and MK3, but the positions of the alignment marks MK2 and MK3 on the upstream side (-X direction side) of each observation area Vw1 to Vw4 are not detected when the substrate FS is sent for drawing exposure of. Therefore, for example, the control device 18 can also obtain the amount of deformation and the deformation tendency from the detection results of the positions of the alignment marks MK1 to MK4 attached around the one exposure area W before the substrate FS is aligned in the longitudinal direction, The deformation of the exposed area W of the current pattern to be exposed is estimated.

As described above, in this embodiment, the beam scanning device MD can be rotated with high accuracy around the irradiation center axis Le that vertically passes through the midpoint (specific point) of the drawing line SLn with respect to the irradiated surface of the substrate FS. Precisely adjust the slope of the line SLn. In this way, the drawing line SLn rotates on the irradiated surface of the substrate FS centering on the midpoint of the drawing line SLn, so that the position variation control of the drawing line SLn in the X (Xt) direction and Y (Yt) direction can be controlled At the same time, simply adjust the tilt of the line SLn. For example, when the drawing line SLn is rotated around the position away from the drawing line SLn, the position of the drawing line SLn will take the center point as The center moves greatly by drawing a circular arc, but in this embodiment, each positional change of both ends (scanning start point and scanning end point) of the drawing line SLn can be controlled to a minimum. In other words, by changing the position of the two ends after the tilt adjustment of the drawing line SLn, the midpoint of the drawing line SLn becomes symmetrical.

In addition, since it is not necessary to perform complicated tilt adjustment as disclosed in Japanese Patent Laid-Open No. 8-11348, there is no positional deviation between the main scanning direction and the sub-scanning direction due to the tilt adjustment. Even if the tilt of the drawing line SLn is adjusted, since the distance between the cylindrical lens CYb of the beam scanning device MD and the irradiated surface of the substrate FS is fixed, there is no need to perform complicated tilt adjustment as disclosed in Japanese Patent Laid-Open No. 8-11348. A magnification deviation in the main scanning direction caused by tilt adjustment occurs.

In addition, the irradiation center axis Le may be an axis that passes an arbitrary point (specific point) on the drawing line SLn perpendicular to the irradiated surface of the substrate FS. In this case, although the drawing line SLn rotates about any point on the drawing line SLn, the positional variation of the drawing line SLn (horizontal) can be reduced compared to the case where the center point is set at a position separated from the drawing line SLn (horizontal shift).

Furthermore, in this embodiment, the light beam LB is incident on the reflecting mirror M10 of the beam scanning device MD in such a manner that it is substantially coaxial with the irradiation center axis Le passing vertically through the midpoint of the drawing line SLn, so even during the beam scanning When the device MD rotates θzt around the irradiation center axis Le, the position of the light beam LB incident on the mirror M10 will not change. Therefore, even when the light beam scanning device MD rotates θzt, the optical path of the light beam LB passing through the light beam scanning device MD does not change, and the light beam LB can correctly pass through the light beam scanning device MD as prescribed. In this way, even if the beam scanning device MD is rotated by θzt, the spot light SP cannot be projected onto the illuminated surface or spot of the substrate FS due to the halo of the beam LB1 or the like The light SP is projected out of the position of the drawn line SLn after tilt adjustment.

By the support frame 40 of the beam scanning device MD, the optical components (reflecting mirrors M10 to M15, cylindrical lenses CYa, CYb, polygon mirror PM, and fθ lens FT, etc.) are supported, and the support frame 40 is supported to 2 The rack Ub2 rotates. In addition, since the linear actuator 52 supported by the second frame portion Ub2 can be electrically controlled, the position of the alignment mark MK detected visually and the inherent tilt of the measured drawing line SLn, The tilt of the drawing line SLn is automatically adjusted electrically.

In addition, in the optical configuration of the beam scanning device MD (MD1 to MD6) shown in FIG. 7, although the rotation center of the drawing line SLn (SL1 to SL6) is set at the midpoint of the drawing line SLn, it is not limited to this, as long as If it is on the drawing line SLn, it may be deviated from the midpoint. Specifically, in the configuration of FIG. 7 (and FIGS. 10 and 11), for example, a mirror M10, a beam expander BE, a mirror M11, and a circular tubular pillar member BX1 (and ring) arranged along the optical axis AXa can be used. The bearing 48) can be moved parallel to the +Yt direction from the position in FIG. 7 (FIG. 11).

[Variation]

The above-mentioned embodiment may be modified as follows.

(Modification 1) FIG. 15 is a diagram showing the optical configuration of the beam scanning device MD in Modification 1. FIG. The same reference numerals are given to the same configurations as in FIG. 7 and their description is omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of other beam scanning devices MD will be omitted.

Beam scanning device MD1, with mirror M10, beam expander BE, mirror M20, beam splitter BS2, mirror M21, polarizing beam splitter BS3, λ/4 wavelength plate QW, mirrors M22~M24, cylindrical lens CYa, polygon mirror PM, fθ lens FT, mirror M15, Cylindrical lens CYb, photodetector DT1, and position detector DT2. In addition, in FIG. 15, the image deviation optical member SR and the deviation adjustment optical member DP are omitted.

The light beam LB1 incident on the beam scanning device MD1 travels in the -Zt direction and enters the mirror M10. The light beam LB1 incident on the beam scanning device MD1 is incident on the mirror M10 in a manner coaxial with the irradiation central axis Le1. Its function is as a mirror M10 as an incident optical member, and reflects the incident light beam LB1 toward the mirror M20 in the -Xt direction. The light beam LB1 reflected by the mirror M10 penetrates the beam expander BE and enters the mirror M20.

The mirror M20 reflects the incident light beam LB1 toward the mirror M21 in the -Zt direction. The light beam LB1 reflected by the mirror M20 enters the beam splitter BS2. The beam splitter BS2 transmits a part of the incident light beam LB1 toward the reflecting mirror M21 and reflects the remaining part of the incident light beam LB1 toward the position detector DT2. The beam splitter BS2 allows more light than the reflected light beam LB1 to pass toward the mirror M21. For example, the ratio of the amount of transmitted light to the amount of reflected light is 9 to 1.

The reflecting mirror M21 reflects the incident light beam LB1 toward the reflecting mirror M22 in the +Xt direction. The light beam LB1 reflected by the mirror M21 passes through the polarizing beam splitter BS3 and the λ/4 wavelength plate QW and enters the mirror M22. The polarization beam splitter BS3 penetrates the P-polarized light beam and reflects the S-polarized light beam LB1. The light beam LB1 entering the beam scanning device MD1 is a P-polarized light beam, so the polarizing beam splitter BS3 transmits the light beam LB1 from the mirror M21 toward the mirror M22.

The light beam LB1 whose optical path is bent by the mirrors M22~M24 enters the polygon mirror PM through the cylindrical lens CYa. The generatrix of the cylindrical lens CYa is set to be parallel to the XtYt plane, and the light beam LB1 is on the reflection surface RP of the polygon mirror PM having a rotation axis parallel to the Zt axis. The direction parallel to the XtYt plane converges to extend like a slit. The polygon mirror PM deflects the incident light beam LB1 back toward the fθ lens FT toward the +Xt direction side. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive part (motor) RM. The fθ lens FT having an optical axis AXf extending in the Xt axis direction, through the mirror M15 and the cylindrical lens CYb, projects the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS proportional to its incident angle position. The mirror M15 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction.

With the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction, the light beam LB1 projected on the substrate FS converges on the illuminated surface of the substrate FS into minute spot light SP with a diameter of several μm (for example, 3 μm). Here, at least the function of the fθ lens FT also serves as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, at least the reflecting member (reflecting mirrors M15, M20 to M24) functions as an optical path deflecting member that bends the optical path of the light beam LB1 from the reflecting mirror M10 to the substrate FS. By the optical path deflecting member, the incident axis of the light beam LB1 incident on the mirror M10 and the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in the Zt direction can be made substantially coaxial.

The reflected light from the rotating cylinder DR (or substrate FS) passes through the cylindrical lens CYb, mirror M15, fθ lens FT, polygon mirror PM, cylindrical lens CYa, mirror M24~M22, and λ/4 wavelength plate QW Into the polarizing beam splitter BS3. Here, the λ/4 wavelength plate QW provided between the polarizing beam splitter BS3 and the substrate FS, specifically, the polarizing beam splitter BS3 and the mirror M22 is irradiated to the substrate FS The light beam LB1 is converted from the P-polarized light to the circularly polarized light beam LB1, and returns to the circularly polarized light reflected from the substrate FS back to the polarizing beam splitter BS3, whereby the λ/4 wavelength plate QW converts the circularly polarized light into S-polarized light LB1. Therefore, the reflected light from the substrate FS is reflected by the polarizing beam splitter BS3 and enters the photodetector DT1. In this way, you can achieve harmony In the same manner as in the above embodiment, the inherent tilt of the drawing line SL1 of the beam scanning device MD1 is detected.

In addition, the position detector DT2 is used to detect the center position of the incident light beam LB1, for example, a 4-division sensor is used. This 4-split sensor has 4 photodiodes (photoelectric conversion elements), and the difference in received light amount (difference in signal level) received by each of the 4 photodiodes is orthogonal to the traveling direction of the light beam LB1 The XtZt plane detects the center position of the light beam LB1. That is, it can be judged whether the light beam LB1 deviates from the desired position. The image shift optical member SR or the deflection adjusting optical member DP described in the above embodiment may be provided between the mirror M10 and the beam splitter BS2. In this way, the control device 18 can adjust the center position and tilt of the light beam LB1 according to the detection result of the position detector DT2.

(Modification 2) FIG. 16 is a diagram showing the optical configuration of the beam scanning device MD in Modification 2. FIG. In FIG. 16, only the parts that are different from FIG. 7 or FIG. 15 are shown, and the optical system in which many mirrors PM are closer to the mirror M10 side is omitted. The same reference numerals are given to the same configurations as those in FIG. 7 or FIG. 15, and their explanations are omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.

The beam scanning device MD1 has an image rotation optical system IR that rotates the drawing line SL1 about the irradiation center axis Le1 (centering on the point in the drawing line SL1). The image rotation optical system IR rotates around the irradiation center axis Le1, thereby rotating the drawing line SL1. The image rotation optical system IR is provided between the cylindrical lens CYb and the illuminated surface of the substrate FS. As this image rotation optical system IR, for example, an image rotator can be used. The image rotation optical system IR system is set to pass the incident axis of the light beam LB1 at the midpoint of the scanning trajectory of the light beam LB1 incident on the image rotation optical system IR from the cylindrical lens CYb. The shooting center axis Le1 is substantially coaxial. In this way, like the rotating optical system IR, the drawing line SL1 can be rotated around the irradiation center axis Le1. This image rotation optical system IR is rotated around the irradiation center axis Le1 by an actuator (driving unit) not shown controlled by the control device 18.

This image rotating optical system IR, although not shown, can be rotatably supported on a part of the parallel support portion 44 of the support frame 40 shown in FIG. 10, for example. Therefore, even if the support frame 40 (beam scanning device MD1) is not a structure that can rotate about the irradiation center axis Le1, the tilt of the drawing line SL1 can be adjusted by rotating the image rotation optical system IR about the irradiation center axis Le1. Alternatively, the support frame 40 (beam scanning device MD1) can be rotated around the irradiation center axis Le1, and the image rotation optical system IR can also independently rotate around the irradiation center axis Le1 relative to the support frame 40 (beam scanning device MD1). Perform θzt rotation.

As described above, in addition to the rotation of the beam scanning device MD1 around the irradiation center axis Le1, since the image rotation optical system IR can be individually rotated around the irradiation center axis Le1, the line SL1 can be drawn in, for example, the image rotation optical system IR After the coarse adjustment of the tilt, the tilt of the drawing line SL1 is finely adjusted by the entire rotation of the beam scanning device MD1. Therefore, the accuracy of tilt adjustment of the drawing line SL1 can be improved. In addition, when the irradiation center axis Le1 is perpendicular to the axis of an arbitrary point on the drawing line SL1 with respect to the illuminated surface of the substrate FS, corresponding to this, the irradiation center axis Le1 can be incident on the image from the cylindrical lens CYb Any point of the scanning trajectory of the light beam LB1 of the rotating optical system IR.

(Modification 3) In the above modification 2, the beam scanning device MD (MD1~MD6) is rotated around the irradiation center axis Le (Le1~Le6), but the beam scanning device MD (MD1~MD6) may not be around the irradiation center axis Le(Le1~Le6) rotates. In this case, the second frame portion Ub2 can fix the support frame 40 of the beam scanning device MD (MD1 to MD6) in a non-rotatable manner The state is maintained. This is because the beam scanning device MD (MD1~MD6) does not rotate around the irradiation central axis Le (Le1~Le6), and can also rotate the optical system IR by the image shown in FIG. 16 to make the drawing line SLn (SL1~SL6) The irradiation center axis Le (Le1~Le6) rotates for the center.

(Modification 4) FIGS. 17A and 17B are diagrams showing the optical configuration of the beam scanning device MD in Modification 4. FIG. In FIGS. 17A and 17B, the same reference numerals are given to the same configurations as those in FIG. 7, and their descriptions are omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of other beam scanning devices MD will be omitted. In addition, FIG. 17A shows the beam scanning device MD1 of this modification 4 in a plane parallel to the XtZt plane, and FIG. 17B shows the beam scanning device MD1 of this modification 4 in a plane parallel to the YtZt plane. Be an observer.

The beam scanning device MD1 includes a cylindrical lens CYa, a reflection member RF, an fθ lens FT, a polygon mirror PM, and a cylindrical lens CYb. The light beam LB1 traveling in the -Zt direction and entering the light beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1 parallel to the Zt axis and passing through the midpoint of the drawing line SL1. In the fourth modification, a lens system GLa is provided before the beam scanning device MD1 in the optical path of the light beam LB1, and the light beam LB1 is condensed into spot light on a surface Cjp optically conjugated to the surface of the substrate FS. The light beam LB1 condensed on the conjugate plane Cjp is incident on the cylindrical lens CYa along the irradiation central axis Le1 while being isotropically radiated. The cylindrical lens CYa is set such that the generatrix is parallel to the Yt axis so as to have refractive power in the Xt direction. In addition, the light beam LB1 that has just passed through the cylindrical lens CYa converges into a substantially parallel light beam in the Xt direction, and proceeds in the -Zt direction while maintaining the radiation state in the Yt direction.

The reflecting surface Rf1 (inclined 45° relative to the XtYt plane) on the upper side of the reflecting member RF is incident on the fθ lens FT by the light beam LB1 incident through the cylindrical lens CYa and parallel to the optical axis AXf The light beam LB1 is reflected in the -X direction with respect to the field of view above the optical axis AXf. The light beam LB1 that has passed through the field of view on the upper side (+Zt direction side) of the fθ lens FT enters the reflecting surface RP of the polygon mirror PM (parallel to the Zt axis). The reflecting surface RP of the polygon mirror PM is set at the same height position as the optical axis AXf in the Zt direction, and is set at the position of the pupil plane epf of the fθ lens FT or its vicinity. Therefore, the rotation axis AXp of the polygon mirror PM and the optical axis AXf of the fθ lens FT are set to be orthogonal in a plane parallel to the XtZt plane. By the cylindrical lens CYa and the fθ lens FT, the light beam LB1 incident on the polygon mirror PM converges on the reflection surface RP in a non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) formed by the polygon mirror PM, The projection on the reflection surface RP becomes a slit-like distribution extending in a direction parallel to the Yt axis.

Since the reflection surface RP of the polygon mirror PM is parallel to the Zt axis (which is perpendicular to the optical axis AXf in the XtZt plane), the field of view through the fθ lens FT above the optical axis AXf (+Zt direction side) reaches the polygon mirror PM The reflection surface RP, the light beam LB1 reflected there to the +Xt direction side, passes through the field of view of the fθ lens FT below the optical axis AXf (-Zt direction side), and faces the reflection surface Rf2 below the reflection member RF (Tilt 45° relative to the XtYt plane). Therefore, the optical path of the light beam LB1 incident on the polygon mirror PM and the optical path of the light beam LB reflected on the polygon mirror PM are symmetrical about the optical axis AXf in the XtZt plane. The light beam LB1 reflected on the reflecting surface Rf2 under the reflecting member RF and traveling in the -Zt direction passes through the cylindrical lens CYb whose generating line is parallel to the Yt direction and has refractive power in the Xt direction, and condenses into spot light SP on the substrate FS .

In the configuration of the beam scanning device MD1 in Modification 4 shown in FIGS. 17A and 17B, the optical path of the light beam LB1 from the conjugate plane Cjp to the substrate FS (irradiated surface) is due to the reflection surface RP of the polygon mirror PM (The pupil plane epf) has a symmetrical structure, so the spot light SP projected on the substrate FS is imaged as a spot light image of the light beam LB1 condensed on the conjugate plane Cjp. therefore, When a reflection surface RP of the polygon mirror PM is at an angle that is exactly orthogonal to the optical axis AXf, the light beam LB1 incident on the reflection surface RP of the polygon mirror PM from the fθ lens FT is reflected by the light beam LB1 on the reflection surface RP. The light beam LB1 incident on the fθ lens FT passes through the same optical path in the XtYt plane. At this time, the light beam LB1 irradiated to the reflection surface Rf2 below the reflection member RF becomes the central portion of the reflection surface Rf2 in the Yt direction, and the spot light SP of the light beam LB1 projected on the substrate FS is positioned on the drawing line SL1 Point (the point where the irradiation center axis Le1 passes).

Due to the rotation about the rotation axis AXp of the polygon mirror PM, when the reflection surface RP of the polygon mirror PM is slightly inclined from the state perpendicular to the optical axis AXf in the XtYt plane, the reflection surface RP of the polygon mirror PM reflects and passes fθ The light beam LB1 of the lens FT reaching the reflecting surface Rf2 on the lower side of the reflecting member RF will reflect the rotation of the polygon mirror PM and deviate in the Yt direction on the reflecting surface Rf2. In this way, even the beam scanning device MD1 of Modification 4 shown in FIGS. 17A and 17B can perform one-dimensional scanning of the spot light SP along the drawing line SL1. 17A and 17B, although the reflecting surface Rf1 on the upper side and the reflecting surface Rf2 on the lower side of the reflecting member RF cover the scanning range of the light beam LB1 along the drawing line SL1, and are formed in the Yt direction, they are elongated in the Yt direction. When different plane mirrors constitute the reflecting surface Rf1 and the reflecting surface Rf2, the planar mirror forming the upper reflecting surface Rf1 can reduce the size in the Yt direction to the extent that it can cover the diameter of the light beam LB1 incident from the lens system GLa.

The function of the cylindrical lens CYa is to act as an incident optical member that makes the light beam LB1 enter the light beam scanning device MD1. The function of the fθ lens FT is to function as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM on the illuminated surface of the substrate FS. Moreover, at least, the reflection surface Rf1 and the reflection surface Rf2 of the reflection member RF function as an optical path deflecting member that bends the optical path of the light beam LB1 from the cylindrical lens CYa to the substrate FS. By this optical path deflecting member, the The incident axis of the light beam LB1 entering the cylindrical lens CYa is substantially coaxial with the irradiation center axis Le1.

In addition, the optical components (cylindrical lenses CYa, CYb, reflecting member RF, polygon mirror PM, fθ lens FT, etc.) of the beam scanning device MD1 shown in FIGS. 17A and 17B are supported by the support shown in FIGS. 10 and 11 The rack 40 is similarly supported by a support rack that can rotate around the center axis Le1. In the configuration of Modification 4, similarly, even if the beam scanning device MD1 rotates θzt around the irradiation center axis Le1, the position of the beam LB incident on the cylindrical lens CYa will not change. Therefore, even when the light beam scanning device MD1 is rotated by θzt, the optical path of the light beam LB passing through the light beam scanning device MD1 does not change, and the light beam LB can correctly pass through the light beam scanning device MD1 as specified. In this way, even if the beam scanning device MD1 is rotated by θzt, the spot light SP cannot be projected onto the surface (irradiated surface) of the substrate FS due to the halo of the beam LB1 or the spot light SP is projected out of the tilt adjustment The location of the drawing line SLn and other issues.

(Modification 5) FIGS. 18A and 18B are diagrams showing the optical configuration of the beam scanning device MD in Modification 5. FIG. In FIGS. 18A and 18B, the same reference numerals are given to the same configurations as those in FIGS. 17A and 17B, and their descriptions are omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of other beam scanning devices MD will be omitted. 18A shows the beam scanning device MD1 of the present modification 5 in a plane parallel to the XtYt plane, and FIG. 18B shows the beam scanning device MD1 of the present modification 5 in a plane parallel to the YtZt plane.

The beam scanning device MD1 of Modification 5 differs from the beam scanning device MD1 of Modification 4 shown in FIGS. 17A and 17B in that the irradiation center axis Le1 is moved from the position of the midpoint of the drawing line SL1 toward the +Yt direction parallel movement. Therefore, the incident beam scanning device The lens system GLa and the cylindrical lens CYa that converge the light beam LB1 in front of MD1 on the conjugate plane Cjp are integrally arranged to move parallel to the +Yt direction. In the case of Modification 5, when the polygon mirror PM rotates clockwise, the light beam LB1 reflected on the reflection surface RP of the polygon mirror PM and irradiated through the fθ lens FT on the reflection surface Rf2 on the lower side of the reflection member RF is scanned at − Yt direction.

As described above, even if the configuration of the modification 4 shown in FIGS. 17A and 17B is changed to the modification 5 shown in FIGS. 18A and 18B, it is possible to change the irradiation center axis Le1 by The extension line is set to draw an arbitrary point (specific point) on the drawing line SL1, rotate the beam scanning device MD1 around the irradiation central axis Le1 by θzt, and set the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) to Being coaxial with the irradiation center axis Le1, even if the beam scanning device MD1 is rotated by θzt, the spot light SP can be accurately scanned along the drawing line SL1. 18A and 18B, the position of the light beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane, as long as it is along the drawing line SL1, It can be anywhere in the Yt direction. Therefore, as long as the dimension of the generatrix direction of the cylindrical lens CYa is extended in advance, the position of the light beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be freely changed, and there is a light guide path that can enhance the light beam LB1 The advantage of freedom of setting. Furthermore, since the position of the light beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be set freely in the Yt direction, the mechanical rotation center axis of the beam scanning device MD1 (illumination center axis Le1 ) The coaxiality with the axis of the incident beam LB1 can be accurately aligned in the Yt direction.

(Modification 6) FIGS. 19 and 20 are diagrams showing the optical configuration of the beam scanning device MD in Modification 6. FIG. In FIGS. 19 and 20, the same components as those in FIG. 7 are given the same reference numerals, and their descriptions are omitted. Also, due to each beam scanning device MD (MD1~MD6) Since they have the same configuration, only the beam scanning device MD1 will be described, and the description will be omitted for the other beam scanning devices MD. In FIG. 7, the direction parallel to the optical axis AXf of the fθ lens FT is set to the Xt direction. Therefore, in FIGS. 19 and 20, the direction parallel to the optical axis AXf of the fθ lens FT is also set to Xt. The direction will be described with the scanning direction of the spot light SP being the Yt (Y) direction and the direction orthogonal to the Xt direction and the Yt direction being the Zt direction.

FIG. 19 is a view of the beam scanning device MD1 of the modification 6 in a plane parallel to the XtYt plane. In the modification 6, the axis of the light beam LB1 (the irradiation center axis Le1) incident on the beam scanning device MD1 is set to The optical axis AXf of the fθ lens FT is coaxial. That is, in this modification, a mirror (reflecting surface) that bends the light beam LB1 is not provided after the fθ lens FT, but a scanning beam that is emitted from the fθ lens FT and passes through the cylindrical lens CYb is directly projected on the substrate FS.

In FIG. 19, the light beam LB1 emitted from the light source device 14 and subjected to intensity modulation (ON/OFF) by the optical element AOM1 for drawing is transmitted to the cylindrical lens CYa through the lens system G30, the mirrors M30, M31, and the lens system G31. The light beam LB1 incident on the beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1. The light beam LB1 incident on the cylindrical lens CYa is shaped as a parallel light beam having a predetermined cross-sectional diameter. The light beam LB1 reflected from the cylindrical lens CYa on the reflecting mirror M14 and reaching the reflecting surface RP of the polygon mirror PM is in the XtYt plane in the state of parallel light beams, and becomes the light beam condensed by the cylindrical lens CYa in the Zt direction. The light beam LB1 reflected (polarized) by the polygon mirror PM passes through the fθ lens FT and the cylindrical lens CYb, and the spot light SP is condensed on the surface (irradiated surface) of the substrate FS. In FIG. 19, the optical axis AXf of the fθ lens FT coincides with the irradiation center axis Le1 and is set to be parallel to the Xt axis, and these extension lines are orthogonal to the center axis (rotation center axis) AXo of the rotary cylinder DR.

The main body frame 300 supporting the beam scanning device MD1 of the sixth modification has an opening 300A through which the light beam LB1 scanned along the drawing line SL1 passes. The beam scanning device MD1 includes a radius from the optical axis AXf (radiation center axis Le1) including The ring bearing 301 of the size of the opening 300A is rotatably supported by the body frame 300. Since the center line of the ring bearing 301 is set to be coaxial with the optical axis AXf (radiation center axis Le1), the beam scanning device MD1 rotates about the Xt axis about the optical axis AXf (radiation center axis Le1). This rotation is called θxt rotation.

FIG. 20 is a state in which a plurality of beam scanning devices MD of the modification 6 shown in FIG. 19 are arranged, and observed in a plane parallel to the XZ plane. The openings 300A through which the scanning beams of the odd-numbered beam scanning devices MD1, MD3, and MD5 pass are provided at regular intervals in the Y direction through the openings 300B through which the scanning beams from the even-numbered beam scanning devices MD2, MD4, and MD6 pass. Furthermore, in Modification 6 of FIG. 20, the substrate FS wound around the rotating drum DR is horizontally transported in the -X direction to be wound from the upper portion of the rotating drum DR for about half a circle, and then is detached from the lower portion of the rotating drum DR. Move to +X direction. Therefore, here, the central plane Poc including the central axis AXo of the rotating drum DR is parallel to the XY plane.

In the configuration of the sixth modification, similarly, the mechanical rotation center of each beam scanning device MD formed by the ring bearing 301 is set as the irradiation central axis Le1 to Le6, and the light beam LB1 incident on each beam scanning device MD ~LB6 is guided so as to be coaxial with each of the irradiation central axes Le1 to Le6. Therefore, as in the previous embodiment and each modification, even if each beam scanning device MD rotates θxt around each of the irradiation central axes Le1 to Le6, The posture position of the light beams LB1~LB6 entering the lens system G30 will not change. Therefore, even when each beam scanning device MD rotates θxt, the light beam LB passing through each beam scanning device MD The optical path will not change, and the light beam LB can correctly pass through the beam scanning device MD according to regulations. In this way, even if the beam scanning devices MD are rotated by θxt, the spot light SP cannot be projected on the surface of the substrate FS (irradiated surface) or the spot light SP is projected due to the halo of the beams LB1 to LB6. The position of the drawing lines SL1~SL6 after tilt adjustment is out of question.

The lens G30 functions as an incident optical member that makes the light beam LB (LB1~LB6) enter the light beam scanning device MD (MD1~MD6). The function of the fθ lens FT is a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM on the illuminated surface of the substrate FS. In addition, the function of the reflecting member (mirrors M14, M30, M31) functions as an optical path deflecting member for bending the optical path of the light beam LB (LB1~LB6) from the lens system G30 to the substrate FS.

[Connection error with rotation adjustment of the drawing line]

In the above embodiments and various modifications, when the tilt of the drawing line SLn is adjusted by the θzt rotation (or θxt rotation) of the beam scanning device MD, the position of the drawing start point and the drawing end point on the drawing line may be deviated relative to the position before adjustment shift. FIG. 21 shows, for example, a state in which the drawing line SL1 of the beam scanning device MD1 whose initial state is parallel to the Yt axis is rotated by an angle θss in the counterclockwise direction in the XtYt plane (irradiated surface). In FIG. 21, the angle θss is exaggerated for convenience of explanation, but the maximum value of the actual rotatable angle θss is only about ±2°, which is extremely small. In FIG. 21, when the midpoint of the drawing line SL1 before adjustment is set to CC, the irradiation center axis Le1 extending in the Zt direction is set to pass through the midpoint CC, and the drawing line SL1 is set to coincide with the irradiation center axis Le1 The mechanical rotation center axis of the beam scanning device MD1 rotates (tilts) θzt around the center. Further, when the drawing start point of the drawing line SL1 is ST and the drawing end point is SE, the length LBL from the drawing start point ST to the drawing end point SE is the actual pattern drawing width in the Yt direction. Therefore, the length LBh from the drawing start point ST to the midpoint CC and from the midpoint CC to the drawing end The length LBh of the point SE is equal, LBh=LBL/2.

When the drawing line SL1 is rotated by the angle θss from the initial state, it becomes the drawing line SL1a inclined with respect to the Yt axis. The drawing start point STa of the adjusted drawing line SL1a deviates from the initial drawing start point ST (△XSa, △YSa), and the drawing end point Sea of the adjusted drawing line SL1a deviates from the initial drawing end point SE ( △XEa, △YEa). This position deviation is the continuation error with the pattern drawn by the drawing line SL2 of the adjacent beam scanning device MD2. For example, if the drawing line SL2 of the adjacent beam scanning device MD2 is located on the +Yt direction side relative to the drawing line SL1a, and it is necessary to perform continuous exposure at the initial drawing start point ST, the drawing of the adjusted drawing line SL1a needs to be started The point STa is slightly shifted in the direction of the arrow Ar. The offset shown by the arrow Ar can be realized by slightly starting the timing of drawing the data after the time Tpx when the origin signal SH is generated from the origin signal SH described in FIG. 9.

Here, the amount of positional deviation ΔYSa is LBh‧(1-cos(θss)). When the amount of displacement (length) along the arrow Ar is ΔAr, the amount of positional deviation ΔYSa and the amount of deviation ΔAr become △YSa=△Ar‧cos(θss), therefore, the offset △Ar can be expressed as follows.

△Ar=〔LBh‧(1-cos(θss))〕/cos(θss)‧‧‧‧(1)

For example, when the length LBL is 50 mm (LBh=25 mm), the offset ΔAr when the angle θss is ±0.5° is about 0.95 μm, and the offset ΔAr when the angle θss is ±1.0° is about 3.8 μm, the angle The deviation ΔAr when θss is ±2.0° is about 15.2 μm, and the change of the angle θss and the deviation ΔAr have a quadratic function relationship. Therefore, the offset ΔAr is calculated based on the adjusted angle θss, and the time Tpx illustrated in FIG. 9 is shortened by the time corresponding to the offset ΔAr ΔTpx (=ΔAr/scanning speed Vss of the spot light SP) to start Describe the beginning of the data.

Also, the drawing line SL2 of the adjacent beam scanning device MD2 is opposite to the drawing line SL1a When it is located on the side of the -Yt direction and it is necessary to perform continuous exposure at the initial drawing end point SE, it is necessary to slightly shift the drawing end point Sea of the adjusted drawing line SL1a in the direction of the arrow Af. In this case, the amount of deviation ΔAf in the direction of arrow Af is also the same as the previous formula (1), which is the following formula ΔAf=[LBh‧(1-cos(θss))]/cos(θss)‧‧‧ (2)

Find out. As shown in FIG. 21, when the midpoint CC (Le1) is precisely set at the rotation center of the beam scanning device MD1, the absolute value of the offset amount ΔAr and the offset amount ΔAf are equal. The direction of the offset amount ΔAf is the same as the scanning direction of the spot light SP on the drawing line SL1a. Therefore, in this case, as long as the time Tpx described in FIG. 9 is lengthened, it corresponds to the offset amount ΔAf according to the adjusted angle θss The time △Tpx (=△Ar/scanning speed Vss of spot light SP) can start to draw the beginning of the data.

Further, the drawing start point STa of the drawing line SL1a after adjusting the angle θss deviates from the initial drawing start point ST in the -Xt direction by ΔXSa, and the drawing end point Sea deviates from the initial drawing end point SE in the +Xt direction △XEa. Such position deviation error XX direction (sub-scanning direction) △XSa, △XEa can be added to the error △ by measuring the value of the encoder EC (output value of the counter) that measures the rotational angle position of the rotating drum DR The offset value of XSa or ΔXEa is corrected by starting the drawing of each drawing line SLn. In order to carry out such fine correction, the measurement and analysis capability of the encoder EC (and the scale part SD) on the rotational angle position of the rotary drum DR (the amount of movement of the substrate FS per count of the counter circuit) is set at the spot light SP The size φ is 1/2 or less, preferably 1/10 or less.

In the description of FIG. 21 above, when the drawing line SL1 of the beam scanning device MD1 whose initial state is parallel to the Yt axis is rotated counterclockwise by an angle θss in the XtYt plane (irradiated surface), the irradiation center axis Le1 is set to pass the midpoint CC, drawing line SL1 (that is, the beam scanning device MD1) is set to rotate (tilt) θzt around the irradiation center axis Le1. However, if the installation error of the circular tubular pillar member BX1, the ring bearing 48, etc. that determines the mechanical rotation center axis (hereinafter referred to as Mrp) of the beam scanning device MD1, and the incident position of the light beam LB1 entering the beam scanning device MD1 Errors, etc., there is a two-dimensional position difference error △A (set as △Ax, △Ay) in the XtYt plane between the point CC (irradiation center axis Le1) in the drawing line SL1 and the mechanical rotation center axis Mrp of the beam scanning device MD1 ), the influence caused by the position deviation error ΔA will be added to the error (△XSa, △YSa) and error (△XEa, △YEa) in FIG. 21.

This state will be explained using FIG. 22. Fig. 22 shows an exaggerated state relative to Fig. 21, the mechanical rotation center axis (first rotation center axis) Mrp of the beam scanning device MD1 and the midpoint CC (irradiation center axis Le1) of the drawing line SL1 have a relative position deviation error △ A (△Ax, △Ay) state of the situation diagram. In this case, the incident axis of the light beam LB1 incident on the light beam scanning device MD1 is coaxial with the rotation center axis Mrp. In FIG. 22, the symbols and symbols explained in FIG. 21 are omitted. As shown in FIG. 22, in the initial state before adjustment, the drawing line SL1 parallel to the Yt axis becomes the rotation center axis shifted by the error (△Ax, △Ay) from the position of the midpoint CC (Le1) Mrp is the drawing line SL1b of the center inclination angle θss. The drawing line SL1b is caused to move parallel to the XtYt plane by the drawing line SL1a shown in FIG. 21 due to the influence of errors (ΔAx, ΔAy). Therefore, the drawing start point STb of the adjusted drawing line SL1b deviates from the drawing start point STa in the state of FIG. 21 by an error ΔXcc in the −Xt direction and an error ΔYcc in the +Yt direction. Similarly, the drawing end point SEb of the adjusted drawing line SL1b deviates from the drawing end point Sea in the state of FIG. 21 by an error ΔXcc in the -Xt direction and an error ΔYcc in the +Yt direction, and the adjusted drawing line SL1b The middle point CC'(Le1') is also deviated from the error point △Xcc in the -Xt direction with respect to the middle point CC(Le1) of the drawing line SL1 in the state of FIG. 21 in the -Xt direction, at +Yt Direction deviation error △Ycc.

Therefore, the drawing start point STb of the adjusted drawing line SL1b deviates from the initial drawing start point ST in the Xt direction (△XSa+△Xcc), and deviates in the Yt direction (△YSa-△Ycc). The drawing end point SEb of the drawing line SL1b deviates from the initial drawing end point SE in the Xt direction (ΔXEa-ΔXcc) and in the Yt direction (ΔYEa+ΔYcc). The rotation center axis Mrp and the initial drawing line SL1 have an error (△Xcc, △Ycc) caused by the deviation of the position (ΔXx, △Ay) of the midpoint CC (Le1) of the initial drawing line SL1. When the midpoint CC is the origin (0, 0), it is expressed as follows.

△Xcc=-△Ay‧sin(θss)+△Ax‧(1-cos(θss))‧‧‧(3)

△Ycc=△Ay‧(1-cos(θss))+△Ax‧sin(θss)‧‧‧‧(4)

As shown in FIG. 22, the incident axis of the light beam LB1 coincides with the rotation center axis Mrp, and the rotation center axis Mrp and the midpoint CC (Le1) of the drawing line SL1 shift error (△Ax, △Ay) in the XtYt plane In this case, as described previously in FIG. 21, the offset amounts ΔAr and ΔAf of the drawing line SL1b are calculated, so that the time Tpx described in FIG. 9 is shortened, or the time ΔTpx corresponding to it is corrected to correct the pattern. The starting sequence of the data (descriptive data) is sufficient. However, the length LBL (for example, 50 mm) of the drawing start point STb to the drawing end point SEb of the adjusted drawing line SL1b must be within the range of the maximum scanning length of the spot light SP (for example, 51 mm). In addition, for the sub-scanning direction (Xt direction), an error (△XSa+△Xcc) or (△ can be added in response to the measured value (output value of the count) of the encoder EC that measures the rotational angle position of the rotating drum DR The value of XEa-ΔXcc) is corrected by starting the drawing of each drawing line SLn. In addition, in FIGS. 21 and 22, although the case where the irradiation center axis Le1 passes through the point CC in the drawing line SLn has been described as an example, the irradiation center axis Le1 may be drawn as in the previous modification 5. line Any point on SLn. In this case, the calculation principle of the deviation amounts ΔAr and ΔAf of the drawing line SLn is also the same.

Also, for example, as in the previous modification 5 (FIG. 18A, FIG. 18B), when the position of the beam LB1 incident on the beam scanning device MD1 in the XtYz plane is shifted in the Yt direction, when the mechanism of the beam scanning device MD1 When the rotational center axis Mrp and the irradiation center axis Le1 are set at positions that coincide with or close to the drawing start point ST of the drawing line SL1, even if the drawing line SL1 is inclined at an angle θss, the adjusted drawing start point STb will hardly change The position of the point ST changes from the initial drawing start. Therefore, when the adjusted drawing start point STb is connected to the adjacent drawing line, the position of the spot light SP of the drawing line SL1b in the scanning direction may not be adjusted (adjustment of the time Tpx described in FIG. 9).

In addition, the mechanical rotation center axis Mrp and the irradiation center axis Le1 of the beam scanning device MD1 are preferably coaxial within the predetermined allowable range ΔQ (ΔBx, ΔBy) in the XtYt plane. The allowable range ΔQ, for example, when the beam scanning device MD1 is mechanically tilted by a predetermined angle θsm, the actual position (real position Apo) of the drawing start point STb (or drawing end point SEb) of the adjusted drawing line SL1b, and Assuming that the allowable range △Q is 0, the difference in the design position (design position Dpo) of the drawing start point STb (or drawing end point SEb) of the drawing line SL1b when the beam scanning device MD1 is inclined at an angle θsm is at the point The scanning direction of the light SP (arrows Ar and Af in FIG. 21) or the Yt direction is set within, for example, the size φ of the spot light SP. Here, the predetermined angle θsm can be set as an upper limit angle (for example, ±2°) in which the beam scanning device MD1 can be mechanically rotated. In order to make the irradiation center axis Le (Le1~Le6) of each beam scanning device MD (MD1~MD6) and the rotation center axis Mrp coaxial within a predetermined allowable range △Q, each light shown in FIG. 5 can be introduced into the optical system BDU ( BDU1~BDU6) between the mirrors M1~M5, set the image shown in Figure 7 At least one of the offset optical member SR and the deflection adjustment optical member DP. The center axis of the pillar member BX1 is set to be coaxial with the rotation center axis Mrp, or to be coaxial with the rotation center axis Mrp and the irradiation center axis Le within a predetermined allowable range ΔQ.

In addition, although the incident axis of the light beam LB incident on the beam scanning device MD coincides with the rotation center axis Mrp, the light beam LB is incident on the beam scanning device MD, but it may be the light beam LB incident on the beam scanning device MD The incidence axis and the rotation center axis Mrp are coaxial within a predetermined allowable range ΔQ. For example, the incident axis of the light beam LB incident on the beam scanning device MD coincides with the irradiation center axis Le and is coaxial with the rotation center axis Mrp within a predetermined allowable range ΔQ.

In addition, the image rotation optical system IR in Modifications 2 and 3 is also the same, as long as the mechanical rotation center axis (second rotation center axis) and the irradiation center axis Le of the image rotation optical system IR are within a predetermined allowable range ΔQ It can be coaxial. In this case, the incident axis of the light beam LB at the midpoint of the scanning trajectory of the light beam LB incident on the image rotation optical system IR from the fθ lens FT and the mechanical rotation center axis of the image rotation optical system IR are set within a predetermined allowable range △ Q is coaxial.

In the configuration of the above-described embodiment and each modified example, the light source device 14 is not mounted on the beam scanning device MD that can rotate relative to the exposure device body, but it can be used as a conventional device (Japanese Patent Laid-Open No. 08-011348). Small solid-state light sources such as semiconductor laser diodes, LEDs, etc. are installed in the beam scanning device MD (for example, the support frame 40), and the solid-state light source is controlled to emit pulse light according to the drawing data. In this case, the drawing optical element AOM shown in FIGS. 5 and 6 is unnecessary.

Furthermore, in the above embodiments and modifications, the intensity modulation (ON/OFF) of the spot light SP according to the drawing data is, for example, the light introduction optical system BDU (BDU1~BDU6) provided in FIG. 5 ) The optical element AOM for drawing (AOM1~AOM6) If the light source device 14 is an optical fiber amplifier laser light source, the intensity of the seed light (pulse light) in the infrared wavelength band before entering the optical fiber amplifier can also be adjusted to a rupture wave shape according to the description data. The pulse beam of ultraviolet light output from the light source device 14 is modulated into a burst wave shape according to the description data. In this case, the drawing optical element AOM provided in the light introduction optical system BDU is used as a selection optical element (referred to as a switching element AOM) for guiding the light beam LB from the light source device 14 to the beam scanning device MD. For this reason, it is necessary to make the rotation speeds of the polygon mirrors PM of the beam scanning device MD uniform, and perform synchronous control so that the phases of the rotation angles also maintain a predetermined relationship. Furthermore, the light beam LB from the light source device 14 is sequentially transmitted through the beam transmitting system (reflecting mirror, etc.) of each switching element AOM of the beam scanning device MD, in response to the origin signal SH of the polygon mirror PM, in the drawing line SLn During one scan of the spot light SP in the above, it is better to perform synchronous control in which any one of the switching elements AOM is turned ON sequentially.

In addition, the exposure apparatus EX of the above-mentioned embodiment and each modified example performs the drawing exposure of the spot light SP by the beam scanning device MD to the curved substrate FS of the rotating drum DR, but it may also be supported by The planar substrate FS performs the exposure of the spot light SP. In other words, the beam scanning device MD can also perform the exposure of the spot light SP on the substrate FS supported in a planar shape. For this mechanism that supports the substrate FS in a planar shape, the one disclosed in International Publication No. 2013/150677 pamphlet can be used. In short, the area where the endless belt supports the substrate FS is defined as a planar shape by a plurality of rollers around which the endless belt is wound. And in the planar area of the endless belt, the substrate FS that has been transported is closely attached to the endless belt to support it. Since the endless belt is transported in an endless manner in a predetermined direction, the endless belt can transport the supported substrate FS in the transport direction of the substrate FS.

(Second embodiment)

Fig. 23 shows the configuration of the beam scanning device MD' of the second embodiment. The beam scanning device MD' of Fig. 23 is similar to the previous beam scanning device MDn (MD1~MD6) shown in Figs. 5, 7 and 10, etc. ) Of each replacement. Regarding the components constituting the beam scanning device MD' of FIG. 23, the same components as those of the previous beam scanning device MDn are given the same symbols, and detailed descriptions thereof are omitted. The beam scanning device MD' of the second embodiment is configured to introduce the incident light into the drawing optical element AOMn (AOM1 to AOM6) in the optical system (also called the beam distribution optical system) BDUn (BDU1 to BDU6) The light beam LBn (LB1~LB6) transmitted by the single mode optical fiber SMF of the focused light beam LBn (LB1~LB6) is introduced.

The output end Pbo of the optical fiber SMF is fixed in the +Zt direction of the mirror M10 of the beam scanning device MDn, and the light beam LB1 converged at the output end Pbo is radiated at a predetermined numerical aperture (NA) while being reflected by the mirror M10 and then enters the structure The condenser lens Be1 and the collimator lens Be2 of the beam expander BE. The light beam LB1 is condensed at the condensing position Pb1 between the condensing lens Be1 and the collimating lens Be2, and the radiated light beam LB1 enters the collimating lens Be2 again and is converted into a parallel beam. The light beam LB1 emitted from the collimator lens Be2 passes through the mirror M12, the image shift optical member SR, the deflection adjusting optical member DP, the field aperture FA, the mirror M13, and the λ/4 wavelength plate QW as in the previous FIG. 7 The cylindrical lens CYa, the reflecting mirror M14, the polygon mirror PM, the fθ lens FT, the reflecting mirror M15, and the cylindrical lens CYb converge to form spot light SP on the substrate FS. The surface where the spot light SP is formed (the surface of the substrate FS) has an optically conjugate relationship with the condensing position Pb1 and the emitting end PBo. In FIG. 23, the mirror M11, the polarizing beam splitter BS1, the lens system G10, and the photodetector DT1 shown in FIG. 7 are omitted.

In the second embodiment, the beam scanning device MD’ is also supported by the pillar member BX1 axis as a whole and can irradiate the center axis Le1 as the center to rotate in a predetermined angle range, but the optical fiber The injection end Pbo of the SMF can be fixed at any position staggered from the irradiation central axis Le1. When scanning a beam of ultraviolet wavelength band at high speed for pattern drawing, depending on the sensitivity of the photosensitive functional layer on the substrate FS, sometimes the energy of the beam (illuminance per unit area of spot light) must be set quite high. Therefore, as shown in FIG. 23, the optical transmission using a single-mode optical fiber SMF may not ensure the resistance of the optical fiber to ultraviolet rays. However, when the photosensitive functional layer has sensitivity to light longer than the ultraviolet wavelength band, for example, light with a wavelength of 500 nm to 700 nm, as shown in FIG. 23, the single mode optical fiber SMF can be used for optical transmission .

The incident end of the optical fiber SMF of FIG. 23, not shown, is arranged after the diverging mirror M1 after the light shown in FIG. 5 is introduced into the optical element AONn for drawing in the optical system BDUn. Specifically, the drawing light beam LBn reflected by the mirror M1 is converted into a light beam condensed with a predetermined NA (numerical aperture) by a condenser lens, and the incident end of the optical fiber SMF is fixed at its condensing point (beam waist position) That's it.

10: Component manufacturing system

12: substrate transfer mechanism

14: Light source device

16: Exposure head

18: Control device

M1~ALG4: aiming at the microscope

AXo: the central axis of the rotating cylinder

DR: rotating drum

ECV: adjust the greenhouse

EPC: edge position controller

EX: Exposure device

FS; substrate

LB: beam

Le1~Le6: irradiation central axis

MD1~MD6: beam scanning device

Poc: center plane

PR1, PR2: processing device

R1, R2, R3: drive roller

RT1, RT2: Tension adjustment roller

Sft: axis

SU1, SU2‧‧‧Anti-vibration unit

Claims (14)

A beam scanning device is to perform one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object, which includes: an incident optical member for The light beam of the light source device is incident; the deflection member for scanning deflects the light beam from the incident optical member for the one-dimensional scanning; the projection optical system makes the deflected beam incident upon the illuminated surface after being incident; And a supporting frame that supports the incident optical member, the scanning deflection member, and the projection optical system, and can rotate about a first rotation central axis coaxial with the irradiation central axis within a predetermined allowable range, and the irradiation central axis is relative to the subject The irradiated surface passes vertically through a specific point on the scanning line formed on the irradiated surface by the scanning of the spot light. A beam scanning device as claimed in item 1 of the patent scope, wherein the incident axis of the beam incident on the incident optical member is coaxial with the center axis of the irradiation; provided with the beam from the incident optical member to the object An optical path deflecting member whose optical path is bent so that the irradiation central axis and the first rotation central axis are coaxial within the predetermined allowable range; the support frame further supports the optical path deflecting member. A beam scanning device as claimed in item 2 of the patent scope, wherein the optical path deflecting member is provided to reflect the light beam transmitted from the incident optical member through the projection optics toward the scanning deflection member side, and the projection optics will pass through the The beam deflected by the scanning deflection member is reflected toward the reflection member of the illuminated surface. For example, the beam scanning device according to item 2 or 3 of the patent application includes a second device provided between the irradiated surface and the projection optical system so as to be coaxial with the irradiation center axis within the predetermined allowable range An image rotation optical system that rotates the scan line with the rotation center axis as the center; the support frame further supports the image rotation optical system to be rotatable. A beam scanning device as claimed in item 4 of the patent application, wherein the image rotation optical system is arranged such that the second rotation center axis and the midpoint of the scanning trajectory of the light beam entering the image rotation optical system from the projection optical system The incident axis of the light beam is coaxial within the predetermined allowable range. For example, the beam scanning device according to any one of items 1 to 3 of the patent application scope further includes a body frame, and the support frame is held to be rotatable about the first rotation center axis; the body frame is provided with the support The actuator that rotates around the first rotation center axis. A beam scanning device as claimed in item 6 of the patent scope, wherein the support frame has two parallel support portions arranged substantially in parallel, and an occlusion support portion blocking one end of the two parallel support portions; the incident optical member, the scanning The deflection member and the projection optics are arranged along the parallel support portion and the blocking support portion of the support frame; the actuator is provided between the two parallel support portions. A drawing device is to perform one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object, which includes: an incident optical member for The light beam of the light source device is incident; the deflection member for scanning deflects the light beam from the incident optical member for the one-dimensional scanning; the projection optical system makes the deflected beam incident on the irradiated surface after being incident; support Frame, which supports the incident optical member, the deflection member for scanning, and the projection optical system; a rotation support mechanism, which rotates the support frame around a first rotation parallel to the normal of the illuminated surface The state of rotation of the central axis of rotation is supported by the device body; and the light-introducing optical system is such that the incident axis of the light beam incident on the incident optical member and the first axis of rotation are coaxial within a predetermined allowable range. The light beam of the light source device is directed to the incident optical member. A drawing device according to item 8 of the patent application scope, wherein the normal line of a specific point on the scanning line formed on the illuminated surface due to the scanning of the spot light among the normal lines passing through the illuminated surface is taken as the irradiation center The axis, the support frame supports the optical path of the beam from the incident optical member to the object in a manner that the first rotation center axis and the irradiation center axis are set to be coaxial within a predetermined allowable range The optical path is deflected. A drawing device as described in item 9 of the patent application scope includes a second rotation center provided between the irradiated surface and the projection optical system so that the scanning line is coaxial with the irradiation center axis within the predetermined allowable range The image rotation optical system that rotates around the axis; the support frame further supports the image rotation optical system to be rotatable. A drawing device that performs one-dimensional scanning of the spot light on the irradiated surface while projecting the spot light of the light beam from the light source device on the irradiated surface of the object, and includes: a deflection member for scanning The light beam of the light source device is deflected in order to perform the one-dimensional scanning; the projection optical system makes the deflected beam incident on the irradiated surface; the support frame supports the scanning deflection member and the projection optical system; And the coupling member, when the normal line of the irradiated surface passing through a specific point on the scanning line formed on the irradiated surface due to the scanning of the spot light is set as the center axis of irradiation, the support frame The support portion is limited to the area within a predetermined radius from the center axis of the irradiation, and the The support frame is combined with the device body. A drawing device as described in item 11 of the patent application scope, wherein the coupling member is capable of rotating around a first rotation center axis coaxial with the irradiation center axis within a predetermined allowable range relative to a pillar member provided on the device body Way, the support frame is coupled to the pillar member. A drawing device as claimed in item 12 of the patent scope includes: an incident optical member that receives the light beam from the light source device; and an optical path deflecting member that uses the irradiation center axis and the first rotation center axis at the predetermined tolerance In a coaxial manner within the range, the optical path of the light beam from the incident optical member to the object is bent; the support frame further supports the incident optical member and the optical path deflecting member; the light beam incident on the incident optical member The incident axis is coaxial with the irradiation central axis. The drawing device according to any one of patent application ranges 11 to 13 includes a second rotation provided between the illuminated surface and the projection optical system to be coaxial with the illumination center axis within the predetermined allowable range The image rotation optical system that rotates the scanning line with the center axis as the center; the support frame further supports the image rotation optical system to be rotatable.

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