KR20200024956A - Pattern rendering device and pattern rendering method - Google Patents

Abstract

A pattern drawing apparatus which repeatedly scans a drawing beam projected onto an object to be projected by rotation of a rotating polyhedron, and reflects the drawing beam among a plurality of reflecting surfaces of the rotating polyhedron. An origin detecting unit for generating an origin signal when the second reflecting surface different from the first reflecting surface is set to a predetermined angle position, and the second reflecting surface is the first reflecting surface after the origin signal is generated. And a control device for instructing the drawing start by the drawing beam at a predetermined delayed timing from the generation of the origin signal based on a predetermined time determined by the rotational speed of the rotating polygon mirror until such time as a reference.

Description

Pattern Writing Device and Pattern Writing Method {PATTERN RENDERING DEVICE AND PATTERN RENDERING METHOD}

This invention relates to the pattern drawing apparatus and pattern drawing method which scan the spot light of the beam irradiated on the to-be-irradiated surface, and draw and expose a predetermined pattern.

BACKGROUND ART Conventionally, as a high-speed printer for office use, a main scanning line is rotated by a multifaceted mirror while the spot light is projected while projecting the spot light of the laser beam onto an object (object) such as a photosensitive drum. While scanning in the one-dimensional direction along the direction, the subject is moved in the sub-scanning direction perpendicular to the main scanning line direction, and the desired pattern or image (character, figure, photograph, etc.) on the subject is Drawing is known.

Japanese Patent Laid-Open No. 8-11348 discloses a beam scanning device for adjusting the inclination of the main scan line of a beam. The beam scanning apparatus described in JP 8-11348 A includes a plate inclined in the beam irradiation direction, and an optical unit mounted on the plate, and the plate is placed on a main body ( Viii) Then, by rotating the plate relative to the main body in the main scanning direction, the optical unit is rotated to adjust the inclination of the main scanning line. By this adjustment, since the lengths of both sides of the midpoint of the main scan line are different, the optical unit is rotated in the main scanning direction with respect to the plate so that the lengths of both sides of the midpoint of the main scan line are the same. The two-dimensional positional shift and the magnification shift in the main scan line direction of the scanning line itself are corrected by adjusting the distance from the photoconductor of the optical unit and electrical control of the writing timing of the drawing along the main scan line. Moreover, the optical unit is provided with the light source which emits the modulated beam for drawing, the collimator lens which makes the beam into parallel light, the rotating polyhedron, and f (theta) lens integrally inside.

However, in Japanese Patent Laid-Open No. 8-11348, in order to rotate the optical unit about a position far from the main scanning line, a plurality of stages of adjustment (adjustment of rotation of the plate relative to the main body) are used to adjust the inclination of the main scanning line. Adjustment of rotation of the optical unit relative to the plate, adjustment of the distance from the photosensitive member of the optical unit, correction of the writing timing of the drawing, and the like must be performed. Especially in the beam scanning apparatus for electronic devices which draws the pattern of the minimum line width of about several micrometers-several tens of micrometers precisely using the spot light of the ultraviolet-beam of wavelength 400nm or less, in the middle of drawing a pattern. Since the inclination of the scanning line (the inclination of the main scanning line direction with respect to the direction orthogonal to the sub-scanning direction) may be finely adjusted, there is a desire to simply adjust the inclination of the scanning line. Then, in embodiment of this invention, such a subject is solved.

A first aspect of the present invention is a beam scanning device for scanning the spot light in one dimension on the irradiated surface while projecting the spot light of the beam from the light source device onto an object to be irradiated, wherein the beam from the light source device An incidence optical member for injecting light, a scanning deflection member for deflecting the beam from the incidence optical member for the one-dimensional scanning, a projection optical system for injecting the deflected beam into the irradiated surface, and the incidence An irradiation center axis and a predetermined irradiation center axis for supporting an optical member, the scanning deflection member, and the projection optical system and passing a specific point on a scan line formed on the irradiated surface perpendicularly to the irradiated surface by scanning the spot light. And a support frame rotatable around a first rotational center axis that is coaxial within the permissible range.

A second aspect of the present invention is a beam scanning device for scanning the spot light in one dimension on the irradiated surface while irradiating the spot light of the beam from the light source device on the target surface, wherein the beam from the light source device An incidence optical member for injecting light, a scanning deflection member for deflecting the beam from the incidence optical member for the one-dimensional scanning, a projection optical system for injecting the deflected beam into the irradiated surface, and the creation It is provided between the slope and the projection optical system, and coaxially within a predetermined allowable range with the irradiation central axis passing a specific point on the scanning line formed on the irradiation surface perpendicularly to the irradiation surface by scanning the spot light. The image rotation optical system which rotates the said scanning line around the rotation center axis | shaft used as this is provided.

A third aspect of the present invention is a beam scanning method for scanning the spot light in one dimension on the irradiated surface while projecting the spot light of the beam from the light source device onto the irradiated surface of the object by using a beam scanning device. An incidence step of injecting the beam from the light source device into the beam scanning apparatus, a deflection step of deflecting the incident beam for the one-dimensional scanning, and a projection step of injecting the deflected beam into the irradiated surface And the scanning line around a rotational central axis which is coaxial within a predetermined allowable range with the irradiation central axis passing through a specific point on the scanning line formed vertically with respect to the irradiation surface by scanning the spot light. It includes a rotating step to rotate.

A fourth aspect of the present invention is a pattern drawing apparatus for scanning the spot light in one dimension on the irradiated surface while projecting the spot light of the beam from the light source device onto the target surface, wherein the beam from the light source device An incident optical member for receiving a light, a scanning deflection member for deflecting the beam from the incident optical member for the one-dimensional scanning, a projection optical system for incident and deflecting the deflected beam onto the irradiated surface, and the incident optical member Rotating support for supporting the member, the scanning deflection member, the support frame for supporting the projection optical system, and the support frame to the apparatus body in a state rotatable about a first rotational central axis parallel to the normal of the irradiated surface. A mechanism, the incident axis of the beam incident on the incident optical member, and the first rotational center axis are coaxial within a predetermined allowable range. And a light introduction optical system for guiding the beam from the light source device to the incident optical member.

A fifth aspect of the present invention is a pattern drawing apparatus for scanning the spot light in one dimension on the irradiated surface while projecting the spot light of the beam from the light source device onto the target surface, wherein the beam from the light source device A scanning deflection member for deflecting the beam for the one-dimensional scanning, a projection optical system for injecting the deflected beam and projecting it onto the irradiated surface, a support frame for supporting the scanning deflection member, and the projection optical system, When the normal of the irradiated surface passing through a specific point on the scan line formed on the irradiated surface by scanning the spot light is the irradiation central axis, a supporting portion of the support frame to the apparatus main body is predetermined from the irradiation central axis. And a coupling member for engaging the support frame and the apparatus body so as to be limited to an area within a radius.

A sixth aspect of the present invention is a beam scanning device for scanning the spot light in one dimension while converging the beam projected on the irradiated surface of the object onto the spot light on the irradiated surface, reflecting the incident beam, and reflecting it. By deflecting the beam within a range of a predetermined angle, a deflection member for scanning the spot light, a transmission optical system for transmitting the incident beam toward the deflection member, and the incident beam from the transmission optical system And a projection optical system which projects the spot beam of the reflected beam by injecting the light into the deflection member while projecting the reflected beam.

A seventh aspect of the present invention is a pattern drawing apparatus for drawing a predetermined pattern by scanning a beam projected onto an object to be irradiated in one dimension, comprising: a biasing member for deflecting the beam for one-dimensional scanning, and a light source device A light transmission optical system that transmits the beam from the light transmission optical system so as to be incident to the deflection member, and transmits the beam from the light transmission optical system to the deflection member and reflects the beam reflected from the deflection member; A projection optical system for projecting onto a slope is provided.

An eighth aspect of the present invention is a pattern drawing apparatus which repeatedly scans a drawing beam projected on an irradiated object by the rotation of a rotating polyhedron to draw a predetermined pattern on the irradiated object, wherein a plurality of half of the rotating polyhedron An origin detector for generating an origin signal when the second reflecting surface different from the first reflecting surface reflecting the drawing beam in the slope is at a predetermined angle position, and the second signal after the origin signal is generated Instructs drawing start by the drawing beam at a predetermined delayed time from the generation of the origin signal, based on a predetermined time determined by the rotation speed of the rotating polygon mirror until the reflecting surface becomes the first reflecting surface. It is provided with a control device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the device manufacturing system containing the exposure apparatus which performs an exposure process to the board | substrate of embodiment.
FIG. 2 is a detailed view of the rotating drum of FIG. 1 with the substrate wound up.
FIG. 3 is a diagram showing a drawing line of spot light and an alignment mark formed on a substrate.
4 is an enlarged view illustrating main parts of the exposure apparatus of FIG. 1.
FIG. 5 is a detailed view showing an optical configuration of the light introducing optical system of FIG. 4.
It is a schematic explanatory drawing explaining switching of an optical path by the drawing optical element of FIG.
7 is an optical configuration diagram of the beam scanning apparatus of FIG. 4.
FIG. 8 is a diagram illustrating a configuration of an origin sensor provided around the polygon mirror of FIG. 7.
9 is a diagram illustrating a relationship between the generation timing of the origin signal and the drawing start timing.
10 is a cross-sectional view illustrating a holding structure of the beam scanning apparatus by the second frame portion of FIG. 4.
FIG. 11 is a cross-sectional view taken from the arrow XI-XI of FIG. 10.
FIG. 12 is a perspective view showing a structure for holding a plurality of beam scanning apparatuses shown in FIGS. 4, 10, and 11.
It is a perspective view which shows the attachment structure with the exposure apparatus main body part of the structure shown in FIG.
FIG. 14 is a diagram illustrating a deformation state of an exposure area where a predetermined pattern is exposed by the exposure head of FIG. 4.
FIG. 15 is a diagram showing an optical configuration of a beam scanning device in Modification Example 1. FIG.
FIG. 16 is a diagram showing an optical configuration of a beam scanning apparatus in modified example 2. FIG.
FIG. 17A is a view of an optical configuration of the beam scanning apparatus in modified example 4 in a plane parallel to the XtZt plane, and FIG. 17B is a view of an optical configuration of a beam scanning apparatus in modified example 4 in parallel with the YtZt plane. It is a figure seen from the inside.
FIG. 18A is a view showing the optical configuration of the beam scanning apparatus in the modification 5 in a plane parallel to the XtYt plane, and FIG. 18B is a view showing the optical configuration of the beam scanning apparatus in the modification 5 in parallel with the YtZt plane. It is a figure seen from the inside.
19 is a diagram illustrating an optical configuration of a beam scanning apparatus in modified example 6. FIG.
20 is a diagram illustrating a configuration in a case where a plurality of beam scanning apparatuses of FIG. 19 are arranged.
It is a figure explaining the error of the drawing position at the time of tilting the drawing line by a beam scanning apparatus.
It is a figure explaining the error of the drawing position when the drawing line is inclined when the rotation center of a beam scanning apparatus shifts.
It is a figure which shows the structure of the beam scanning apparatus which concerns on 2nd Embodiment.

EMBODIMENT OF THE INVENTION The pattern drawing apparatus and the pattern drawing method which concern on the aspect of this invention are mentioned in detail below, referring preferred embodiment, and referring an accompanying drawing. Moreover, the form of this invention is not limited to these embodiment, The thing which added various changes or improvement is also included. That is, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same, and the components described below can be appropriately combined. Moreover, various omission, substitution, or a change of a component can be made in the range which does not deviate from the summary of this invention.

FIG. 1: is a schematic block diagram of the device manufacturing system 10 containing the exposure apparatus EX which performs exposure processing to the board | substrate (object to be irradiated) FS of embodiment. In addition, in the following description, unless otherwise indicated, the XYZ rectangular coordinate system which makes a gravity direction Z direction is set, and an X direction, a Y direction, and a Z direction are demonstrated according to the arrow shown in a figure.

The device manufacturing system 10 is a manufacturing system in which the manufacturing line which manufactures a flexible display, a flexible wiring, a flexible sensor, etc. as an electronic device is established, for example. Hereinafter, a description will be given on the premise that the flexible display is an electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out the board | substrate FS from the supply roll not shown which wound the flexible sheet-like board | substrate (sheet board | substrate) FS in roll shape, and various processes with respect to the board | substrate FS sent out. After successively carrying out, it has a structure of what is called a roll-to-roll system which winds up the board | substrate FS after various processes in the collection roll which is not shown in figure. The board | substrate FS has a strip-shaped shape in which the moving direction of the board | substrate FS becomes a long longitudinal direction (long length), and a width direction becomes a short longitudinal direction (short length). The board | substrate FS after various processes is in the state in which several electronic devices were lined up along the elongate direction, and it is a board | substrate for multifaceting. The substrate FS sent from the supply roll is sequentially subjected to various processes by the process apparatus PR1, the exposure apparatus EX, the process apparatus PR2, and the like, and wound up on the recovery roll.

Moreover, X direction is a direction (transfer direction) which goes to the process apparatus PR2 from the process apparatus PR1 through the exposure apparatus EX in a horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction (short direction) of the substrate FS. The Z direction is a direction orthogonal to the X direction and the Y direction (upward direction), and is parallel to the direction in which gravity acts.

As the board | substrate FS, foil (foil) etc. which consist of a metal film or alloys, such as stainless steel or the like, are used, for example. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, And vinyl acetate resin, at least one of which may be used. In addition, when the thickness and rigidity (Young's modulus) of the substrate FS pass through the conveyance path of the exposure apparatus EX, folds due to buckling and irreversible wrinkles on the substrate FS It may be a range that does not occur. As a base material of the board | substrate FS, films, such as PET (polyethylene terephthalate) and PEN (polyethylene naphtharate), whose thickness is about 25 micrometers-200 micrometers, are typical of a preferable sheet substrate.

Since the board | substrate FS may receive heat in each process performed by the process apparatus PR1, the exposure apparatus EX, and the process apparatus PR2, the board | substrate FS of the material with which a thermal expansion coefficient is not remarkably large. ) Is preferable. For example, a thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Moreover, the board | substrate FS may be the monolayer of the very thin glass about 100 micrometers thickness manufactured by the float method, etc., and the laminated body which bonded the said resin film, foil, etc. to this very thin glass may be sufficient.

By the way, the flexibility of the substrate FS does not shear or break even when a force of about the weight is applied to the substrate FS, and it is to bend the substrate FS. Say possible properties. Moreover, the property to bend by the force of self-weight is also included in flexibility. The degree of flexibility varies depending on the material, size, thickness of the substrate FS, the layer structure formed on the substrate FS, the environment such as temperature, humidity, and the like. As a result, when the substrate FS is properly wound on the conveyance direction switching members such as various conveyance rollers, rotary drums and the like provided in the conveyance path in the device manufacturing system 10 according to the present embodiment, the buckling and folding cracks If the substrate FS can be smoothly conveyed without being generated or broken (breaking or cracking), it can be said to be a flexible range.

The process apparatus PR1 performs a process of a previous process with respect to the board | substrate FS exposed by exposure apparatus EX. The process apparatus PR1 sends the board | substrate FS which processed the previous process toward the exposure apparatus EX. The board | substrate FS sent to the exposure apparatus EX by the process of this front process becomes the board | substrate (photosensitive board | substrate) FS in which the photosensitive functional layer (photosensitive layer) was formed in the surface.

This photosensitive functional layer is apply | coated on the board | substrate FS as a solution, and turns into a layer (film) by drying. Typical of the photosensitive functional layer is a photoresist (liquid or dry film), but it is a material that does not require development treatment, and has a hydrophilic liquid property of a portion subjected to ultraviolet irradiation. The modified photosensitive silane coupling agent (SAM), or the photosensitive reducing agent in which the plating reduction group is revealed in the part which irradiated with the ultraviolet-ray. When using the photosensitive silane coupling agent as a photosensitive functional layer, the pattern part exposed by the ultraviolet-ray on the board | substrate FS is modified from liquid repellency to lyophilic. Therefore, by selectively applying a conductive ink (an ink containing conductive nanoparticles such as silver or copper), a liquid containing a semiconductor material, or the like onto the lyophilic portion, an electrode constituting a thin film transistor (TFT) or the like, a semiconductor The insulating layer can be provided with a pattern layer serving as an insulation or connection wiring or an electrode. When a photosensitive reducing agent is used as the photosensitive functional layer, the plating reducing group is exposed on the pattern portion exposed by the ultraviolet rays on the substrate FS. Therefore, after exposure, the board | substrate FS is immediately immersed in plating liquid containing palladium ion etc. for a fixed time, and the pattern layer by palladium is formed (precipitates). Such a plating process is an additive process, but in addition, when the etching process as a subtractive process is premised, the substrate FS sent to the exposure apparatus EX has a base metal PET. Or PEN, a metal thin film such as aluminum (Al), copper (Cu), or the like may be deposited on the entire surface or selectively, and a photoresist layer may be laminated thereon.

In the present embodiment, the exposure apparatus EX is an exposure apparatus of a straight drawing method that does not use a mask, or an exposure apparatus of a so-called raster scanning method, and the substrate FS supplied from the process device PR1. The light pattern according to the predetermined pattern for an electronic device for display, a circuit, wiring, etc. is irradiated to the to-be-exposed surface (photosensitive surface) of (). Although it demonstrates in detail later, exposure apparatus EX conveys the spot light SP of the exposure beam LB on the to-be-exposed surface of the board | substrate FS, conveying board | substrate FS to + X direction (direction of sub scanning). While scanning (scanning) in one dimension in a predetermined scanning direction (Y direction), the intensity of the spot light SP is modulated (on / off) at high speed in accordance with pattern data (drawing data). Thereby, the light pattern according to the predetermined | prescribed pattern, such as an electronic device, a circuit, or a wiring, is drawn to the to-be-exposed surface of the board | substrate FS. That is, in the sub-scan of the substrate FS and the main scan of the spot light SP, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate FS so that a predetermined pattern is drawn on the substrate FS. Exposed. Moreover, since an electronic device is comprised by the some pattern layer (layer in which a pattern was formed) overlapping each other, the pattern corresponding to each layer is exposed by exposure apparatus EX.

The process apparatus PR2 performs the post-process process (for example, plating process, image development, etching process, etc.) with respect to the board | substrate FS exposed by exposure apparatus EX. By the process of this post process, the pattern layer of an electronic device is formed on the board | substrate FS. Moreover, since an electronic device is comprised by the some pattern layer overlapping each other, after a pattern is formed in the 1st layer by each process of the device manufacturing system 10, each process of the device manufacturing system 10 is again performed. By roughness, a pattern is formed in a 2nd layer.

Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in a temperature chamber chamber ECV. The temperature chamber ECV suppresses the shape change by the temperature of the board | substrate FS conveyed inside by maintaining the inside at predetermined temperature. The temperature chamber ECV is arrange | positioned in the installation surface E of a manufacturing plant via the passive or active dustproof units SU1 and SU2. The dustproof units SU1 and SU2 reduce vibrations from the mounting surface E. FIG. This mounting surface E may be a floor surface of a factory itself, or may be a surface on a mounting base (pedestal) provided on the floor surface to produce a horizontal surface. The exposure apparatus EX includes a substrate transfer mechanism 12, a light source device (pulse light source device) 14, an exposure head 16, a control device 18, and a plurality of alignment microscopes (ALG (ALG1 to ...). ALG4)) at least.

The board | substrate conveyance mechanism 12 conveys the board | substrate FS conveyed from process apparatus PR1 at predetermined speed in exposure apparatus EX, and then sends out to process apparatus PR2 at predetermined speed. By this board | substrate conveyance mechanism 12, the conveyance path of the board | substrate FS conveyed in the exposure apparatus EX is prescribed | regulated. The board | substrate conveyance mechanism 12 is an edge position controller EPC, the drive roller R1, the tension adjustment roller RT1, and a rotating drum in order from the upstream (-X direction side) of the conveyance direction of the board | substrate FS. (Cylindrical drum) DR, tension adjustment roller RT2, drive roller R2, and drive roller R3.

The edge position controller EPC adjusts the position in the width direction (short-cut direction of the board | substrate FS as a Y direction) of the board | substrate FS conveyed from process apparatus PR1. That is, in the edge position controller EPC, the position at the edge part (edge) of the width direction of the board | substrate FS conveyed in the state which applied the predetermined tension has the range of +/- 10 micrometers-about several ten micrometers with respect to a target position. The substrate FS is moved in the width direction so as to fall within the allowable range, and the position in the width direction of the substrate FS is adjusted. The edge position controller EPC has an roller which the board | substrate FS hangs over, and the edge sensor (end detection part) which is not shown in figure which detects the position of the edge part (edge) of the width direction of the board | substrate FS, and is an edge sensor. Based on the detected detection signal, the roller of the edge position controller EPC is moved in the Y direction to adjust the position in the width direction of the substrate FS. The drive roller R1 rotates, maintaining both the front and back sides of the board | substrate FS conveyed from the edge position controller EPC, and conveys the board | substrate FS toward the rotating drum DR. In addition, the edge position controller EPC has a width of the substrate FS such that the long direction of the substrate FS wound on the rotary drum DR is always perpendicular to the central axis AXo of the rotary drum DR. The parallelism between the rotational axis of the roller of the edge position controller EPC and the Y axis may be appropriately adjusted so as to correct an inclination error in the advancing direction of the substrate FS along with the position in the direction.

The rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction crossing the Z direction in which gravity acts, and a cylindrical outer circumferential surface having a constant radius from the center axis AXo. The substrate FS is transported in the + X direction while being rotated about the central axis AXo while supporting a part of the substrate FS in the long direction along the (circumferential surface). The rotating drum DR supports the exposure area (part) on the substrate FS on which the beam LB (spot light SP) from the exposure head 16 is projected, on its circumferential surface. On both sides of the rotating drum DR in the Y direction, the shaft Sft is supported by an annular bearing so as to rotate around the center axis AXo. This shaft Sft rotates around the central axis AXo by applying rotational torque from a rotation drive source (for example, a motor, a deceleration mechanism, etc.) not shown controlled by the control device 18. For convenience, the plane including the center axis AXo and parallel to the YZ plane is referred to as the center plane Poc.

The driving rollers R2 and R3 are arranged at predetermined intervals along the conveyance direction (+ X direction) of the substrate FS, and a predetermined slack is applied to the substrate FS after exposure. The drive rollers R2 and R3 rotate while maintaining both front and back sides of the substrate FS, similarly to the drive roller R1, and transport the substrate FS toward the process device PR2. The drive rollers R2 and R3 are provided on the downstream side (+ X direction side) of the conveyance direction with respect to the rotating drum DR, and this drive roller R2 is upstream of the conveyance direction with respect to the drive roller R3. It is provided in the side (-X direction side). The tension adjusting rollers RT1 and RT2 are pressed in the -Z direction and impart a predetermined tension in the long direction to the substrate FS wound and supported by the rotary drum DR. As a result, the tension in the long direction applied to the substrate FS applied to the rotating drum DR is stabilized within a predetermined range. Moreover, the control apparatus 18 rotates drive rollers R1-R3 by controlling the rotation drive source (for example, a motor, a speed reducer, etc.) which are not shown in figure.

The light source device 14 has a light source (pulse light source) and emits a pulse beam (pulse light, laser) LB. The beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the beam LB is Fe. The beam LB emitted from the light source device 14 enters the exposure head 16. The light source device 14 emits light and emits the beam LB at the emission frequency Fe under the control of the control device 18. Moreover, as a light source device 14, a semiconductor laser element which generates pulsed light of an infrared wavelength range, a fiber amplifier, and a wavelength conversion element which converts the pulsed light of the amplified infrared wavelength range into pulsed light of an ultraviolet wavelength range (harmonic wave) A fiber amplifier laser light source composed of a wave generating element) or the like may be used. In this case, the light emission frequency (oscillation frequency) Fe is several hundred MHz, and the pulsed light of the ultraviolet-ray which has the high light emission time of about one picosecond of light emission of 1 pulse light can be obtained.

The exposure head 16 is equipped with the some beam scanning apparatus MD (MD1-MD6) which the beam LB enters, respectively. The exposure head 16 draws a predetermined pattern on a part of the substrate FS supported by the circumferential surface of the rotating drum DR by the plurality of beam scanning devices MD1 to MD6. The exposure head 16 is a so-called multibeam type exposure head in which a plurality of beam scanning devices MD1 to MD6 having the same configuration are arranged. Since the exposure head 16 repeatedly performs pattern exposure for electronic devices with respect to the board | substrate FS, the exposure area | region W (the formation area | region of one electronic device) to which a pattern is exposed is made of the board | substrate FS. A plurality is provided at predetermined intervals along the long direction (see FIG. 3).

As also shown in FIG. 2, the odd-numbered beam scanning apparatus (beam scanning unit) MD1, MD3, MD5 is the upstream (-X direction side) of the conveyance direction of the board | substrate FS with respect to the center plane Poc. It is arrange | positioned to and is arrange | positioned in parallel to a Y direction. The even-numbered beam scanning devices (beam scanning units) MD2, MD4, MD6 are disposed on the downstream side (+ X direction side) of the transport direction of the substrate FS with respect to the center plane Poc, and further in the Y direction. Are arranged in parallel. The odd-numbered beam scanning devices MD1, MD3, MD5 and the even-numbered beam scanning devices MD2, MD4, MD6 are provided symmetrically with respect to the center plane Poc.

The beam scanning device MD projects the beam LB from the light source device 14 to converge to the spot light SP on the irradiated surface of the substrate FS, while projecting the spot light SP to the substrate FS. Scan in one dimension along a predetermined linear drawing line SLn on the irradiated surface. The drawing lines (scan lines) SLn of the plurality of beam scanning devices MD1 to MD6 are not separated from each other with respect to the Y direction (width direction of the substrate FS, scanning direction) as shown in FIGS. 2 and 3. Rather, they are set to be connected to each other. Hereinafter, the beam LB which injects into each beam scanning apparatus MD (MD1-MD6) may be represented by LB1-LB6. The beams LB (LB1 to LB6) incident on the beam scanning devices MD (MD1 to MD6) are beams of linearly polarized light (P polarized light or S polarized light) polarized in a predetermined direction. It is assumed that P-polarized beam is incident. Moreover, the drawing line SLn of the beam scanning apparatus MD1 may be represented by SL1, and the drawing line SLn of the beam scanning apparatus MD2-MD6 may be represented by SL2-SL6.

As shown in FIG. 3, each beam scanning apparatus MD (MD1-MD6) is a scanning area so that all the width direction of the exposure area | region W may be covered by all of the some beam scanning apparatus MD1-MD6. Is sharing. Thereby, each beam scanning apparatus MD (MD1-MD6) can draw a pattern for every some area divided | segmented in the width direction of the board | substrate FS. For example, when the scanning width (length of the drawing line SLn) in the Y direction by one beam scanning device MD is about 30 to 60 mm, 3 of the odd beam scanning devices MD1, MD3, MD5 are set. By arranging six beam scanning devices MD in total in the Y direction with the dog and three of the even-numbered beam scanning devices MD2, MD4, MD6, the width in the Y direction that can be drawn is expanded to about 180 to 360 mm. . As a general rule, the length of each drawing line SL1-SL6 is made the same. That is, the scanning distance of the spot light SP of the beam LB scanned along each of the drawing lines SL1 to SL6 is the same.

In addition, the actual drawing lines (SLn (SL1 to SL6)) are set to be slightly shorter than the maximum length that the spot light SP can actually scan on the irradiated surface, for example, in the main scanning direction (Y direction). When the drawing magnification is the initial value (no magnification correction), when the maximum length of the drawing line SLn capable of drawing a pattern is 50 mm, the maximum scanning length on the irradiated surface of the spot light SP is the scan of the drawing line SLn. Each of the starting point side and the scanning end point side has a margin of about 0.5 mm and is set to about 51 mm By setting in this way, drawing of 50 mm within the range of 51 mm of the maximum scanning length of the spot light SP is performed. The position of the line SLn can be finely adjusted in the main scanning direction or the drawing magnification can be finely adjusted.

The drawing lines SL1 to SL6 are arranged in two rows in the circumferential direction of the rotating drum DR with the center surface Poc interposed therebetween. The odd drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate FS on the upstream side (-X direction side) of the transport direction of the substrate FS with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate FS on the downstream side (+ X direction side) of the transport direction of the substrate FS with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel along the width direction of the substrate FS, that is, along the central axis AXo of the rotary drum DR.

The drawing lines SL1, SL3, SL5 are arranged on a straight line at predetermined intervals along the width direction (scanning direction) of the substrate FS. The drawing lines SL2, SL4, SL6 are similarly arranged on a straight line at predetermined intervals along the width direction (scanning direction) of the substrate FS. At this time, drawing line SL2 is arrange | positioned between drawing line SL1 and drawing line SL3 in the width direction of board | substrate FS. Similarly, drawing line SL3 is arrange | positioned between drawing line SL2 and drawing line SL4 in the width direction of board | substrate FS. The drawing line SL4 is disposed between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS, and the drawing line SL5 is in the width direction of the substrate FS, It is arrange | positioned between drawing line SL4 and drawing line SL6.

The scanning direction of the spot light SP of the beam LB scanned along each of the odd-numbered drawing lines SL1, SL3, SL5 is one-dimensional and is in the same direction. The scanning direction of the spot light SP of the beam LB scanned along each of the even-numbered drawing lines SL2, SL4, SL6 is one-dimensional and is in the same direction. The scanning direction of the spot light SP of the beam LB scanned along the drawing lines SL1, SL3, SL5 and the spot light of the beam LB scanned along the drawing lines SL2, SL4, SL6. The scanning directions of SP) are opposite to each other. Specifically, the scanning direction of the spot light SP of the beam LB scanned along the drawing lines SL1, SL3, SL5 is in the -Y direction, and is scanned along the drawing lines SL2, SL4, SL6. The scanning direction of the spot light SP of the beam LB is + Y direction. As a result, the drawing start positions (positions of the drawing start points) of the drawing lines SL1, SL3, SL5 and the drawing start positions of the drawing lines SL2, SL4, SL6 are adjacent (or partially overlapped) in the Y direction. )do. The drawing end positions (positions of the drawing end points) of the drawing lines SL3 and SL5 and the drawing end positions of the drawing lines SL2 and SL4 are adjacent (or partially overlapped) in the Y direction. When partially overlapping the ends of the drawing lines SLn adjacent to each other in the Y direction, for example, with respect to the length of each drawing line SLn in the Y direction including the drawing start position or the drawing end position. It is good to overlap in the range of several% or less.

Moreover, the width | variety of the sub scanning direction of this drawing line SLn is the thickness according to the size (diameter) (phi) of the spot light SP. For example, when the size phi of the spot light SP is 3 m, the width of each drawing line SLn is also 3 m. The spot light SP may be irradiated along the drawing line SLn so as to overlap by a predetermined length (for example, half of the size? Of the spot light SP). Moreover, even when the drawing lines SLn (for example, the drawing line SL1 and the drawing line SL2) which adjoin each other in the Y direction are adjacent to each other (when connecting), a predetermined length (for example, It is preferable to overlap by half the size? Of the spot light SP).

In the case of this embodiment, since the beam LB from the light source device 14 is pulsed light, the spot light SP projected onto the drawing line SLn during the main scanning is the oscillation frequency Fe of the beam LB. Depending on it, it becomes discrete. Therefore, it is necessary to overlap the spot light SP projected by one pulsed light of the beam LB and the spot light SP projected by the next one pulsed light in the main scanning direction. The amount of overlap is set by the size? Of the spot light SP, the scanning speed of the spot light SP, and the oscillation frequency Fe of the beam LB, but the intensity distribution of the spot light SP is determined by the Gaussian distribution. When approximated by, it is preferable to overlap about φ / 2 of the effective diameter size φ determined by 1 / e ² (or 1/2) of the peak intensity of the spot light SP. Therefore, also in the sub-scanning direction (direction perpendicular to the drawing line SLn), the substrate FS is moved between one scan of the spot light SP along the drawing line SLn and the next scan. It is preferable to set so as to move by a distance of almost 1/2 or less of the effective size? Of the spot light SP. In addition, although the setting of the exposure amount to the photosensitive functional layer on the board | substrate FS is possible by adjustment of the peak value of the beam LB (pulse light), it raises an exposure amount in the situation where the intensity of the beam LB cannot be raised. If desired, one of a decrease in the scanning speed in the main scanning direction of the spot light SP, an increase in the oscillation frequency Fe of the beam LB, or a decrease in the conveying speed in the sub scanning direction of the substrate FS, etc. What is necessary is just to increase the overlap amount regarding the main scanning direction or the sub scanning direction of the spot light SP to 1/2 or more of the effective size (phi).

Each beam scanning device MD (MD1 to MD6) is a beam LB (LB1 to LB6) so that the beams LB1 to LB6 are perpendicular to the irradiation surface of the substrate FS on at least the XZ plane. ) Is irradiated toward the substrate FS. That is, each of the beam scanning devices MD (MD1 to MD6) moves from the XZ plane toward the center axis AXo of the rotating drum DR, that is, to be coaxial with the normal of the irradiated surface (parallel), The beams LB1 to LB6 are irradiated (projected) onto the substrate FS. Moreover, each beam scanning apparatus MD (MD1-MD6) is a board | substrate (in the plane where the beam LB (LB1-LB6) irradiated to the drawing line (SLn (SL1-SL6)) is parallel to a YZ plane. The beams LB1 to LB6 are irradiated toward the substrate FS so as to be perpendicular to the irradiated surface of the FS, that is, the substrate FS with respect to the main scanning direction of the spot light SP on the irradiated surface. The beams LB1 to LB6 projected onto the PB are scanned in a telecentric state, where the drawing lines defined by the respective beam scanning devices MD (MD1 to MD6) (SLn (SL1 to SL6)) are scanned. The line perpendicular to the irradiated surface of the board | substrate FS (or also called an "optical axis") passing through the midpoint (center point) of () is called irradiation center axis Le (Le1-Le6).

Each of the irradiation center axes Le1 to Le6 is a line connecting the drawing lines SL1 to SL6 and the center axis AXo on the XZ plane. The irradiation center axes Le1, Le3, Le5 of the odd-numbered beam scanning devices MD1, MD3, MD5 are in the same direction in the XZ plane, and the odd-numbered beam scanning devices MD2, MD4, MD6. Each irradiation center axis Le2, Le4, Le6 is the same direction in an XZ plane. In the XZ plane, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set so that the angle with respect to the center plane Poc becomes ± θ (see Fig. 4). .

As shown in FIG. 2, the scale part SD (SDa, SDb) which has the scale formed in the annular shape over the whole circumferential direction of the outer peripheral surface of the rotating drum DR is provided in the both ends of the rotating drum DR. . This scale part SD (SDa, SDb) is a diffraction grating which carved in concave or convex grating | lattice line by fixed pitch (for example, 20 micrometers) in the circumferential direction of the outer peripheral surface of the rotating drum DR, It is configured as an incremental scale. These scale parts SD (SDa, SDb) rotate integrally with the rotating drum DR around the center axis AXo. In addition, a plurality of encoders (scale read heads) EC are provided so as to face the scales SD (SDa, SDb). This encoder EC optically detects the rotation position of the rotating drum DR. Two encoders EC (EC1a, EC2a) are provided so as to face the scale portion SDa provided at the end portion on the −Y direction side of the rotating drum DR, and at the end portion on the + Y direction side of the rotating drum DR. Two encoders EC (EC1b, EC2b) are provided opposite to the provided scale part SDb.

The encoders EC (EC1a, EC1b, EC2a, EC2b) project light beams for measurement toward the scale units SD (SDa, SDb), and photoelectric detection of the reflected light beam (diffraction light). By doing so, the detection signal according to the positional change in the circumferential direction of the scales SD (SDa, SDb) is output to the control device 18. The control device 18 interpolates the detection signal in a counter circuit (not shown) and digitally processes it, thereby changing the angle of the rotary drum DR, that is, in the circumferential direction of the outer circumferential surface thereof. The change in position can be measured with a resolution of submicron. The control apparatus 18 can also measure the conveyance speed of the board | substrate FS from the angle change of the rotating drum DR.

Encoder EC1a, EC1b is provided in the upstream (-X direction side) of the conveyance direction of board | substrate FS with respect to center plane Poc, and with irradiation center axis Le1, Le3, Le5 in XZ plane. It is arranged on the same line. That is, in the XZ plane, the line connecting the projection position (read position) and the central axis AXo on the scale portions SDa and SDb of the measurement light beam projected from the encoders EC1a and EC1b is the irradiation center axis ( It is arrange | positioned on the same line as Le1, Le3, Le5). Similarly, encoder EC2a, EC2b is provided in the downstream side (+ X direction side) of the conveyance direction of board | substrate FS with respect to center plane Poc, and irradiation center axis Le2, Le4, Le6 in an XZ plane. Is arranged on the same line as. That is, in the XZ plane, the line connecting the projection position (read position) and the central axis AXo on the scale portions SDa and SDb of the measurement light beam projected from the encoders EC2a and EC2b is the irradiation center axis ( It is arrange | positioned on the same line as Le2, Le4, Le6).

Moreover, the board | substrate FS is wound inside rather than the scale parts SDa and SDb of both ends of the rotating drum DR. The outer peripheral surface of the scale part SD (SDa, SDb) is set so that it may become the same surface as the outer peripheral surface of the board | substrate FS wound by the rotating drum DR. That is, from the radius (distance) from the center axis AXo of the outer peripheral surface of the scale part SD (SDa, SDb), and from the center axis AXo of the outer peripheral surface of the board | substrate FS wound by the rotating drum DR. The radius (distance) is set to be the same. Thereby, the encoder EC (EC1a, EC1b, EC2a, EC2b) is scale part SD (SDa, SDb) at the position of the same radial direction as the irradiated surface of the board | substrate FS wound by the rotating drum DR. Can be detected and the Abbe error which arises because a measurement position and a processing position (scan position of the spot light SP etc.) differ in the radial direction of the rotating drum DR can be made small.

However, since the thickness of the substrate FS as the irradiated object varies greatly from several tens of micrometers to several hundreds of micrometers, the radius of the outer circumferential surface of the scales SD (SDa, SDb) and the substrate FS wound on the rotating drum DR It is difficult to always keep the radius of the outer circumferential surface of the same. Therefore, in the case of scale part SD (SDa, SDb) shown in FIG. 2, the radius of the outer peripheral surface (scale surface) is set so that it may correspond with the radius of the outer peripheral surface of rotating drum DR. Moreover, it is also possible to comprise the scale part SD by an individual disk, and to mount | attach the disk (scale disk) coaxially to the shaft Sft of the rotating drum DR. Also in this case, it is good to match the radius of the outer peripheral surface (scale surface) of the scale disk with the radius of the outer peripheral surface of the rotating drum DR so that an Abbe error may fall in tolerance.

The alignment microscopes ALG (ALG1-ALG4) shown in FIG. 1 are for detecting alignment marks MK (MK1-MK4) formed in the board | substrate FS, as shown in FIG. (In this embodiment, four) is provided. Alignment marks MK (MK1 to MK4) are predetermined marks drawn in the exposure area W on the irradiated surface of the substrate FS, and reference marks for relatively aligning (aligning) the substrate FS. to be. Alignment microscope (ALG (ALG1-ALG4)) detects alignment mark MK (MK1-MK4) on the board | substrate FS supported by the circumferential surface of rotating drum DR. The alignment microscopes ALG (ALG1 to Alg4) are used for the substrate FS rather than the irradiated region on the substrate FS by the spot light SP of the beams LB1 to LB6 from the exposure head 16. It is provided in the upstream (-X direction side) of a conveyance direction.

Alignment microscope (ALG (ALG1-ALG4)) is the enlargement of the local area | region including the light source which projects the illumination light for alignment to the board | substrate FS, and the alignment mark (MK (MK1-MK4)) of the surface of the board | substrate FS. Observation optical system (including an objective lens) which acquires an image, and imaging elements, such as CCD and CMOS, which image | photograph an enlarged image with a high speed shutter while the board | substrate FS is moving to a conveyance direction. The imaging signal picked up by the alignment microscopes ALG (ALG1-ALG4) is sent to the control apparatus 18. The control device 18 is adapted to the image analysis of the imaging signal and the information (measured by the encoder EC which reads the scale part SD shown in FIG. 2) of the rotation position of the rotating drum DR at the time of imaging. Based on this, the position of the alignment marks MK (MK1 to MK4) is detected, and the position of the substrate FS is detected. Moreover, the illumination light for alignment is light of the wavelength range which hardly has a sensitivity with respect to the photosensitive functional layer on the board | substrate FS, for example, light of wavelength about 500-800 nm.

Alignment marks MK1-MK4 are provided in the circumference | surroundings of each exposure area | region W. As shown in FIG. The alignment marks MK1 and MK4 are formed in plural on both sides in the width direction of the substrate FS of the exposure area W at regular intervals Dh along the long direction of the substrate FS. Alignment mark MK1 is formed in the -Y direction side of the width direction of the board | substrate FS, and alignment mark MK4 is formed in the + Y direction side of the width direction of the board | substrate FS, respectively. Such alignment marks MK1 and MK4 are arranged so that the alignment marks MK1 and MK4 are in the same position with respect to the long direction (X direction) of the substrate FS in a state where the substrate FS is not deformed due to a large tension or a thermal process. do. In addition, alignment marks MK2 and MK3 are between alignment marks MK1 and alignment marks MK4, and the substrate FS is disposed in the margin of the + X direction side and the -X direction side of the exposure area W. FIG. It is formed along the width direction (short direction). Alignment mark MK2 is formed in the -Y direction side of the width direction of the board | substrate FS, and alignment mark MK3 is formed in the + Y direction side of the board | substrate FS. Further, the gap in the Y direction between the alignment mark MK1 and the margin mark alignment mark MK2 arranged at the side end portion in the −Y direction of the substrate FS, and the Y of the alignment mark MK2 portion and the alignment mark MK3 portion of the margin portion The interval in the direction and the interval in the Y direction between the alignment mark MK4 and the alignment mark MK3 in the margin part arranged at the side end portions in the + Y direction of the substrate FS are all set at the same distance. These alignment marks MK (MK1 to MK4) may be formed together at the time of forming the pattern layer of the first layer. For example, when exposing the pattern of a 1st layer, you may expose together the pattern for alignment marks around the exposure area | region W to which a pattern is exposed. In addition, alignment mark MK may be formed in exposure area W. FIG. For example, in the exposure area W, it may be formed along the outline of the exposure area W. FIG.

Alignment microscope ALG1 is arrange | positioned so that the imaging mark MK1 which exists in observation area | region (detection area | region) Vw1 by an objective lens may be imaged. Similarly, alignment microscopes ALG2-ALG4 are arrange | positioned so that the imaging marks MK2-MK4 existing in observation area | regions Vw2-Vw4 by an objective lens may be imaged. Therefore, the some alignment microscope ALC1-ALG4 is provided in the order of the alignment microscope ALG1-ALG4 from the -Y direction side of the board | substrate FS corresponding to the position of the some alignment mark MK1-MK4. . The alignment microscopes ALG (ALG1-ALG4) have a distance between the exposure position (drawing lines SL1-SL6) and the observation region Vw (Vw1-Vw4) of the alignment microscope ALG with respect to the X direction. It is provided so that it may become shorter than the length of the exposure direction W of the X direction. Moreover, the number of alignment microscopes ALG provided in the Y direction can be changed according to the number of alignment marks MK formed in the width direction of the board | substrate FS. Moreover, although the magnitude | size on the irradiation surface of the board | substrate FS of observation area | regions Vw1-Vw4 is set according to the magnitude | size of alignment mark MK1-MK4, and alignment precision (position measurement precision), it is 100-500 micrometers angle (角) ) Is about the size.

4 is an enlarged view of a main portion of the exposure apparatus EX. The exposure apparatus EX further includes a plurality of light introduction optical systems BDU (BDU1 to BDU6) and a main body frame UB. The light introduction optical system BDU BDU1 to BDU6 guides the beams LB1 to LB6 from the light source device 14 to the beam scanning devices MD to MD6. The light introduction optical system BDU1 guides the beam LB1 to the beam scanning device MD1, and the light introduction optical system BDU2 guides the beam LB2 to the beam scanning device MD2. Similarly, the light introduction optical systems BDU3 to BDU6 guide the beams LB3 to LB6 to the beam scanning devices MD3 to MD6. The beam LB from the light source device 14 branches into each light introducing optical system BDU1 to BDU6 by an optical member such as a beam splitter (not shown) or a switching optical deflector, or is incident or Selectively incident. The light introduction optical system BDU (BDU1 to BDU6) has a high speed in accordance with the pattern data of the intensity of the spot light SP projected onto the irradiated surface of the substrate FS by the beam scanning devices MD (MD1 to MD6). It has the optical element for drawing (AOM (AOM1-AOM6)) which modulates (on / off). Drawing optical element (AOM) is an acoustic-optic modulator. This pattern data is stored in the storage area | region which is not shown in the control apparatus 18. As shown in FIG.

The main body frame UB holds a plurality of light introducing optical systems BDU1 to BDU6 and a plurality of beam scanning devices MD1 to MD6. The main body frame UB includes the first frame portion Ub1 holding the plurality of light introducing optical systems BDU1 to BDU6 and the second frame portion Ub2 holding the plurality of beam scanning devices MD1 to MD6. Have The first frame part Ub1 uses the plurality of light introduction optical systems BDU1 to BDU6 in the upper portion (+ Z direction side) of the plurality of beam scanning devices MD1 to MD6 held by the second frame part Ub2. Keep it. The odd-numbered light introducing optical systems BDU1, BDU3, and BDU5 correspond to the positions of the odd-numbered beam scanning devices MD1, MD3, MD5, and upstream of the transport direction of the substrate FS with respect to the center plane Poc. It is hold | maintained in the 1st frame part Ub1 so that it may be arrange | positioned at the side (-X direction side). The even-numbered light introducing optical systems BDU2, BDU4, and BDU6 similarly correspond to the positions of the even-numbered beam scanning devices MD2, MD4, MD6, and the conveying direction of the substrate FS with respect to the center plane Poc. It is hold | maintained in the 1st frame part Ub1 so that it may be arrange | positioned downstream of the (+ X direction side). The structure of this light introduction optical system (BDU) is demonstrated in detail later.

The first frame part Ub1 supports the plurality of light introduction optical systems BDU1 to BDU6 from the lower side (-Z direction side). The first frame portion Ub1 is provided with a plurality of openings Hs (Hs1 to Hs6) corresponding to the plurality of light introduction optical systems BDU1 to BDU6. The beams LB1 to LB6 emitted from the plurality of light introduction optical systems BDU1 to BDU6 are not blocked by the first frame part Ub1 by the plurality of openings Hs1 to Hs6, and corresponding beam scanning apparatuses are provided. Incident on (MD1 to MD6). That is, the beams LB (LB1 to LB6) emitted from the light introduction optical system BDU (BDU1 to BDU6) pass through the openings Hs (Hs1 to Hs6) and the beam scanning devices MD (MD1 to MD6). ).

The second frame portion Ub2 rotatably holds each of the beam scanning devices MD (MD1 to MD6) about the irradiation center axis Le (Le1 to Le6). In other words, each of the beam scanning devices MD (MD1 to MD6) can rotate around the irradiation center axis Le (Le1 to Le6) by the second frame portion Ub2. The holding structure of the beam scanning apparatus MD by this 2nd frame part Ub2 is demonstrated in detail later.

FIG. 5 is a detailed view showing the optical configuration of the light introduction optical system BDU, and FIG. 6 is a schematic illustration for explaining the change of the optical path (on / off of the beam LB) by the optical element AOM for drawing. It is also. The odd-numbered light introduction optical systems BDU1, BDU3, and BDU5 and the even-numbered light introduction optical systems BDU2, BDU4, and BDU6 are provided symmetrically with respect to the center plane Poc. In addition, since each light introduction optical system BDU (BDU1-BDU6) has the same structure, it demonstrates only the light introduction optical system BDU1, and abbreviate | omits description about the other light introduction optical system BDU.

The light introduction optical system BDU1 includes the optical lens systems G1 and G2 and the reflection mirrors M1 to M5 in addition to the drawing optical element AOM1. The beam LB1 is incident on the drawing optical element AOM1 so as to be a beam waist in the drawing optical element AOM1. As illustrated in FIG. 6, the drawing optical element AOM1 receives the incident beam LB1 when the driving signal (high frequency signal) from the control device 18 is off (low). When the driving signal (high frequency signal) from the control device 18 is turned on (high) while passing through the absorber AB, the first order diffracted light diffracted by the incident beam LB1 is reflected mirror M1. To the side. The absorber AB is an optical trap that absorbs the beam LB1 in order to suppress leakage to the outside of the beam LB1. The control device 18 turns on / off (high / low) the driving signal (high frequency signal) to be applied to the drawing optical element AOM1 at high speed according to the pattern data, so that the beam LB1 reflects. Whether to face the mirror M1 (the drawing optical element AOM1 is on) or the absorber AB (the drawing optical element AOM1 is off) is switched. This is because the intensity of the spot light SP of the beam LB1 reaching the irradiated surface (substrate FS) from the beam scanning device MD1 when viewed from the irradiated surface of the substrate FS has a high level in accordance with the pattern data. It means that the modulation is performed at one of the low levels (for example, zero level) at high speed.

The pattern data is arranged so that the direction along the scanning direction (Y direction) of the spot light SP is the row direction, and the direction along the conveyance direction (X direction) of the substrate FS is the column direction. Bitmap data composed of a plurality of pixel data decomposed in two dimensions. This pixel data is 1-bit data of "0" or "1". Pixel data of "0" means setting the intensity of the spot light SP irradiated onto the substrate FS at a low level, and pixel data of "1" means spot light irradiating onto the substrate FS ( It means that the strength of SP) is made high. Therefore, when pixel data is "0", the control apparatus 18 outputs the off drive signal (high frequency signal) to the drawing optical element AOM1 of the light introduction optical system BDU1, and pixel data When it is "1", the drive signal (high frequency signal) of ON is output to the drawing optical element AOM1. The number of pixel data for one column of the pattern data is determined according to the size of the pixel on the irradiated surface and the length of the drawing line SLn, and the size of one pixel is determined by the size? Of the spot light SP. Determined by As described above, when the spot light SP continuously irradiated on the irradiated surface is overlapped by about 1/2 of the size φ, the size of one pixel is set to about φ or more of the size of the spot light SP. do. For example, when the effective size phi of the spot light SP is 3 m (overlap amount is 1.5 m), the size of one pixel is set to about 3 m or more. Therefore, in order to draw a finer pattern, the effective size phi of the spot light SP is made smaller, and the dimension of one pixel is set small. Therefore, when the spot light SP is overlapped by about 1/2 of the size?, The number (pulse numbers) of the spot light SP projected along the drawing line SL1 is equal to the pixel data of one column of the pattern data. Double the number This pattern data is stored in a memory (not shown). The pixel data for one column may be referred to as the pixel data string Dw, and the pattern data is bit map data in which the plurality of pixel data strings Dw (Dw1, Dw2, ..., Dwn) are arranged in the column direction. .

In detail, the control apparatus 18 reads the pixel data string (pixel data for one column) Dw (for example, Dw1) of the pattern data, and the spot light (the beam) by the beam scanning apparatus MD1 ( In synchronism with the scanning of the SP, the driving signal corresponding to the pixel data of the read pixel data string Dw1 is sequentially output to the drawing optical element AOM1 of the light introducing optical system BDU1. Specifically, for each timing at which two pulses of the spot light SP are projected along the drawing line SL1, one pixel data selected from the read pixel data strings Dw1 is delayed along the row direction and selected. The driving signal corresponding to one pixel of data is sequentially output to the drawing optical element AOM1. As a result, the intensity is modulated in accordance with the pixel data every two pulses of the spot light SP irradiated onto the irradiation surface of the substrate FS. When the scanning of the spot light SP is completed, the control device 18 reads out the pixel data string Dw2 in the next column. Then, in accordance with the start of scanning the spot light SP of the beam scanning device MD1, the driving signal corresponding to the pixel data of the read pixel data string Dw2 is transferred to the optical element AOM1 for drawing the light introducing optical system BDU1. In order). In this manner, each time the scanning of the spot light SP is started, the drive signal corresponding to the pixel data of the pixel data string Dw in the next column is sequentially output to the drawing optical element AOM1. Thereby, the pattern according to the pattern data can be drawn and exposed. In addition, pattern data is provided for every beam scanning apparatus MD.

The beam LB1 from the drawing optical element AOM1 is incident on the absorber AB or the reflection mirror M1 via the optical lens system G1 for beam shaping. That is, even if the drawing optical element AOM1 is turned on or off, the beam LB1 passing through the drawing optical element AOM1 passes through the optical lens system G1. When the drawing optical element AOM1 is turned on and the beam LB1 enters the reflection mirror M1, the optical path of the beam LB1 is bent by the reflection mirrors M1 to M5 in FIG. 5, It ejects from the reflection mirror M5 toward the beam scanning apparatus MD1. At this time, the reflection mirror M5 emits the beam LB1 to be coaxial with the irradiation center axis Le1. That is, the light introduction optical system BDU1 is arranged such that the axis of the beam LB1 from the light introduction optical system BDU1 is coaxial with the irradiation center axis Le1 set in the beam scanning device MD1 and enters the beam scanning device MD1. The optical path is bent by the reflection mirrors M1 to M5. Moreover, the optical lens system G2 for beam shaping is provided between the reflection mirror M4 and the reflection mirror M5. Moreover, the exposure head 16 comprised from the some beam scanning apparatus MD (MD1-MD6) and the light introduction optical system (BDU (BDU1-BDU6)) comprise the pattern drawing apparatus of this embodiment. Moreover, the main body frame UB may also comprise a part of the pattern drawing apparatus.

Next, with reference to FIG. 7 (and FIG. 5), the optical structure of the beam scanning apparatus MD is demonstrated. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD. In addition, in FIG. 7 (and FIG. 5), the direction parallel to irradiation center axis Le (Le1) is made into Zt direction, and the board | substrate FS is a process plane PR1 from the plane orthogonal to a Zt direction. The direction toward the process apparatus PR2 via the exposure apparatus EX is made into the Xt direction, and on the plane orthogonal to the Zt direction, the direction orthogonal to the Xt direction is made into the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 7 (and FIG. 5) are the three-dimensional coordinates of X, Y, and Z in FIG. 3D coordinates rotated to be parallel to)).

As shown in FIG. 7, in the beam scanning apparatus MD1, the reflection mirror M10 along the advancing direction of the beam LB1 from the incidence position of the beam LB1 to the irradiation surface (substrate FS), Beam expander BE, reflective mirror M11, polarizing beam splitter BS1, reflective mirror M12, image shift optical member (parallel plate) SR, deflection adjustment optical member (Prism) (DP), field aperture (FA), reflection mirror (M13), λ / 4 wave plate (QW), cylindrical lens (CYa), reflection mirror (M14), polygon mirror (PM) ), fθ lens FT, reflection mirror M15, and cylindrical lens CYb. In the beam scanning device MD1, an optical lens system G10 and a photodetector DT1 are provided for detecting the reflected light from the irradiated surface (substrate FS) via the polarizing beam splitter BS1.

The beam LB1 incident on the beam scanning device MD1 travels in the -Zt direction and enters the reflective mirror M10 tilted at 45 ° with respect to the XtYt plane. The axis of the beam LB1 incident on the beam scanning device MD1 is incident on the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1. The reflection mirror M10 functions as an incident optical member for injecting the beam LB1 into the beam scanning device MD1, and reflects the incident beam LB1 along the optical axis AXa set in parallel with the Xt axis. It is reflected in the -Xt direction toward the mirror M11. Therefore, the optical axis AXa is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE disposed along the optical axis AXa and enters the reflection mirror M11. The beam expander BE enlarges the diameter of the beam LB1 passing therethrough. The beam expander BE has a condensing lens Be1 and a collimating lens Be2 which makes the beam LB1 diverged after being converged by the condensing lens Be1 as parallel light.

The reflection mirror M11 is disposed at an angle of 45 ° with respect to the YtZt plane, and reflects the incident beam LB1 (optical axis AXa) in the -Yt direction toward the polarization beam splitter BS1. The polarization splitting surface of the polarizing beam splitter BS1 is disposed at an angle of 45 ° with respect to the YtZt plane, reflects the beam of P polarization, and transmits the beam of linearly polarized light (S polarization) polarized in a direction orthogonal to the P polarization. It is. Since the beam LB1 incident on the beam scanning device MD1 is a P-polarized beam, the polarizing beam splitter BS1 reflects the beam LB1 from the reflecting mirror M11 in the -Xt direction and reflects the reflection mirror ( To M12).

The reflection mirror M12 is disposed at an angle of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the -Zt direction toward the reflection mirror M13 away from the reflection mirror M12 in the -Zt direction. . The beam LB1 reflected by the reflecting mirror M12 includes the image shift optical member SR, the deflection adjustment optical member DP, and the field aperture (field of view) along the optical axis AXc parallel to the Zt axis. Passes through the aperture FA and enters the reflection mirror M13. The image shift optical member SR adjusts two-dimensionally the center position in the cross section of the beam LB1 in the plane (XtYt plane) orthogonal to the traveling direction (the optical axis AXc) of the beam LB1. The image shift optical member SR is constituted by two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc, and the parallel plate Sr1 can be inclined around the Xt axis and parallel to each other. The flat plate Sr2 may be inclined around the Yt axis. The parallel plates Sr1 and Sr2 are inclined around the Xt axis and the Yt axis, respectively, so that in the XtYt plane orthogonal to the traveling direction of the beam LB1, the position of the center of the beam LB1 in a two-dimensional amount is very small. It shifts. The parallel flat plates Sr1 and Sr2 are driven by an actuator (drive section) not shown, under the control of the control device 18.

The deflection adjustment optical member DP finely adjusts the inclination of the on-beam LB1 with respect to the optical axis AXc after being reflected by the reflection mirror M12 and passing through the image shift optical member SR. The deflection adjustment optical member DP is composed of two wedge-shaped prisms Dp1 and Dp2 arranged along the optical axis AXc, and each of the prisms Dp1 and Dp2 is independently centered on the optical axis AXc. It can be rotated 360 degrees. By adjusting the rotation angle positions of the two prisms Dp1 and Dp2, parallelization of the axis of the beam LB1 reaching the reflection mirror M12 and the optical axis AXc, or the irradiated surface (substrate FS) Parallelization of the axis of the beam LB1 reaching to the irradiation center axis Le1 is performed. Moreover, the beam LB1 after deflecting adjustment by the two prisms Dp1 and Dp2 may be transversely shifted in the plane parallel to the cross section of the beam LB, and the transverse shift is the front image shift optical. The member SR can be restored to its original state. The prisms Dp1 and Dp2 are driven by an actuator (drive section) not shown, under the control of the control device 18.

In this way, the beam LB1 passing through the image shift optical member SR and the deflection adjustment optical member DP passes through the circular opening of the field aperture FA and reaches the reflection mirror M13. The circular opening of the field aperture FA is an aperture for cutting the base portion of the intensity distribution in the cross section of the beam LB1 enlarged in the beam expander BE. When the circular aperture of the field aperture FA is a variable brilliance aperture capable of adjusting the aperture, the intensity (luminance) of the spot light SP can be adjusted.

The reflection mirror M13 is disposed at an angle of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the + Xt direction toward the reflection mirror M14. The beam LB1 reflected by the reflection mirror M13 is incident on the reflection mirror M14 via the? / 4 wave plate QW and the cylindrical lens CYa. The reflection mirror M14 reflects the incident beam LB1 toward the polygon mirror (rotating polygon mirror, scanning deflection member) PM. The polygon mirror PM reflects the incident beam LB1 toward the + Xt direction toward the fθ lens FT having the optical axis AXf parallel to the Xt axis. The polygon mirror PM deflects (reflects) the incident beam LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate FS. Specifically, the polygon mirror PM includes a rotation axis AXp extending in the Zt axis direction and a plurality of reflection surfaces RP formed around the rotation axis AXp (eight reflection surfaces RP in this embodiment). ) By rotating this polygon mirror PM around a rotation axis AXp in a predetermined rotation direction, the reflection angle of the pulse beam LB1 irradiated to the reflection surface RP can be continuously changed. Thereby, the reflection direction of the beam LB1 is deflected by one reflection surface RP, and the spot light SP of the beam LB1 irradiated onto the irradiated surface of the substrate FS is scanned in the scanning direction (substrate). (FS), the width direction and the Yt direction) can be scanned.

That is, the spot light SP of the beam LB1 can be scanned along the drawing line SL1 by one reflection surface RP. For this reason, the number of drawing lines SL1 to which the spot light SP is scanned on the irradiated surface of the substrate FS in one rotation of the polygon mirror PM is equal to eight of the number of the reflecting surfaces RP. do. The polygon mirror PM rotates at a constant speed by the polygon drive part RM containing a motor etc. The rotation of the polygon mirror PM by the polygon drive part RM is controlled by the control apparatus 18. FIG. As described above, the effective length (for example, 50 mm) of the drawing line SL1 is equal to or less than the maximum scanning length (for example, 51 mm) capable of scanning the spot light SP by the polygon mirror PM. The center point of the drawing line SL1 (the irradiation center axis Le1 passes) is set at the center of the maximum scanning length by the initial setting (by design).

For example, the effective length of the drawing line SL1 is 50 mm, and the spot light SP is along the writing line SL1 while overlapping the spot light SP having an effective size φ of 4 µm by 2.0 µm. When irradiating on the irradiation surface of the board | substrate FS, the number of spot light SP (pulse light) irradiated by one scan becomes 25000 (= 50mm / 2.0micrometer). If the transfer speed (transfer speed) Vt in the sub-scan direction of the substrate FS is 8 mm / sec, and the scanning of the spot light SP is also performed at an interval of 2.0 m in the sub-scan direction, the drawing line ( The time difference Tpx between one scan start time point following the SL1) and the next scan start time point is 250 μsec (= 2.0 μm / (8 mm / sec)). This time difference Tpx is the time when the polygon mirror PM of the 8 reflection surface RP rotates by 45 degrees (= 360 degrees / 8) of one side parts. In this case, since the time of one rotation of the polygon mirror PM is set to 2.0 m seconds (= 8 x 250 µ seconds), the rotational speed Vp of the polygon mirror PM is 500 rotations (= 1 / 2.0 m seconds) every second. That is, it is set to 30,000 rpm.

On the other hand, the beam LB1 reflected from the first reflection surface RP of the polygon mirror PM effectively enters the maximum incident angle of light incident on the fθ lens FT (at the maximum scan length of the spot light SP). Correspondence) is almost determined by the focal length and the maximum scanning length of the fθ lens FT. As an example, in the case of the polygon mirror PM of the 8th reflection surface RP, the ratio of the rotational angle (scanning efficiency αp) which contributes to real scanning among the rotation angles 45 ° for one reflection surface RP is about 1/3 This corresponds to the maximum incident angle of view of the fθ lens FT (range of ± 15 °, that is, range of 30 °). Therefore, the effective time Tss of one scan of the spot light SP along the drawing line SL1 is Tss ≒ Tpx / 3, and in the previous numerical example, the time Tss is 83.33... μ sec. Therefore, during this time Tss, it is necessary to irradiate 25000 spot light SP (pulse light), so that the emission frequency Fe of the pulse beam LB from the light source device 14 is Fe = 25000 times. /83.333... μsec = 300 MHz.

From the above, in addition to the size phi (µm) of the spot light SP and the emission frequency Fe (Hz) of the light source device 14, the length of the drawing line SLn is overlapped with the LBL (µm) and the spot light SP. The rate is Uo (0 <Uo <1), the conveyance speed of the substrate FS is Vt (µm / sec), the number of reflection surfaces RP of the polygon mirror PM is Np, and one reflection surface of the polygon mirror PM If the scanning efficiency per (RP) is αp (0 <αp <1), and φ · (1-Uo) = YP (μm), the rotational speed Vp (rps) of the polygon mirror PM is Vp = Vt / It is represented by (Np YP), and the emission frequency Fe (Hz) is represented by Fe = LBL Vt / (? P YP ² ). Putting these two relations together at the conveyance speed Vt,

Vt = (Vp, Np, YP) = (Fe, αp, YP ² / LBL)

Becomes Therefore, the conveyance speed Vt (micrometer / sec) of the board | substrate FS, the rotational speed Vp (rps) of the polygon mirror PM, and the light emission frequency Fe (Hz) of the light source device 14 are adjusted so that this relationship is satisfied. .

Returning to the description of FIG. 7 again, the cylindrical lens CYa is incident on the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM (LB1). ) Is converged in a slit shape on the reflection surface RP of the polygon mirror PM. Even when the reflection surface RP is inclined with respect to the Zt direction by the cylindrical lens CYa whose mother line is parallel to the Yt direction (the inclination of the reflection surface RP with respect to the normal of the XtYt plane) The influence can be suppressed and the shift of the irradiation position of the beam LB1 irradiated onto the irradiated surface of the substrate FS in the Xt direction is suppressed.

The fθ lens FT having the optical axis AXf extending in the Xt axis direction has the reflection mirror M15 so that the beam LB1 reflected by the polygon mirror PM is parallel to the optical axis AXf in the XtYt plane. It is a telecentric scanning lens projecting to). The incident angle θ of the beam LB1 to the fθ lens FT changes depending on the rotation angle φ / 2 of the polygon mirror PM. The fθ lens FT is a beam (at a high position on the irradiated surface of the substrate FS proportional to the incident angle θ through the reflection mirror M15 and the cylindrical lens CYb). LB1). If the focal length is fo and the image height is y, the fθ lens FT is designed to satisfy the relationship of y = fo · θ. Therefore, the fθ lens FT makes it possible to accurately scan the beam LB1 at constant velocity in the Yt direction (Y direction). When the incident angle θ to the fθ lens FT is 0 degrees, the beam LB1 incident on the fθ lens FT travels along the optical axis AXf.

The reflection mirror M15 reflects the incident beam LB1 in the -Zt direction toward the substrate FS via the cylindrical lens CYb. By the cylindrical lens CYb in which the fθ lens FT and the bus bar are parallel to the Yt direction, the beam LB1 projected onto the substrate FS is about several micrometers in diameter on the irradiated surface of the substrate FS ( For example, it converges to the minute spot light SP of 3 micrometers). In addition, the spot light SP projected onto the irradiated surface of the substrate FS is scanned one-dimensionally by the polygon mirror PM by the drawing line SL1 extending in the Yt direction. The optical axis AXf and the irradiation center axis Le1 of the fθ lens FT are on the same plane, and the plane is parallel to the XtZt plane. Therefore, the beam LB1 advanced on the optical axis AXf is reflected by the reflection mirror M15 in the -Zt direction and is coaxial with the irradiation center axis Le1 and projected onto the substrate FS. In the present embodiment, at least the fθ lens FT functions as a projection optical system for projecting the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS. At least the reflective members (reflective mirrors M11 to M15) and the polarizing beam splitter BS1 function as optical path deflection members that bend the optical path of the beam LB1 from the reflective mirror M10 to the substrate FS. . By this optical path deflection member, the incident axis of the beam LB1 incident on the reflection mirror M10 and the irradiation center axis Le1 can be made substantially coaxial. Regarding the XtZt plane, the beam LB1 passing through the beam scanning device MD1 passes through the substantially U-shaped or U-shaped optical path, and then projects in the -Zt direction to be projected onto the substrate FS.

Thus, in the state where the board | substrate FS is conveyed in the X direction, the spot light SP of the beams LB1-LB6 is scanned by the beam scanning apparatus MD (MD1-MD6). By scanning in one dimension in the (Y direction), the spot light SP can be scanned two-dimensionally relative to the irradiated surface of the substrate FS. Therefore, a predetermined pattern can be drawn and exposed to the exposure area W of the board | substrate FS. Moreover, although drawing optical elements AOM (AOM1-AOM6) were provided in the light introduction optical system BDU (BDU1-BDU6), you may provide in the beam scanning apparatus MD. In this case, you may provide the drawing optical element AOM between the reflection mirror M10 and the reflection mirror M14.

The photodetector DT1 has a photoelectric conversion element which photoelectrically converts incident light. The predetermined reference pattern is formed on the surface of the rotating drum DR. The part on the rotating drum DR in which this reference pattern was formed is comprised from the material of low reflectance (10-50%) with respect to the wavelength range of the beam LB, and is on the rotating drum DR in which the reference pattern is not formed. The other part is composed of a material having a reflectance of 10% or less or a material that absorbs light. Therefore, in the state in which the board | substrate FS is not wound (or the state which passed the transparent part of the board | substrate FS), the beam LB1 from the beam scanning apparatus MD1 in the area | region in which the reference pattern of the rotating drum DR was formed. When the spot light SP is irradiated, the reflected light is the cylindrical lens CYb, the reflective mirror M15, the fθ lens FT, the polygon mirror PM, the reflective mirror M14, and the cylindrical lens. (CYa),? / 4 wavelength plate QW, reflective mirror M13, field aperture FA, deflection adjustment optical member DP, image shift optical member SR, and reflection mirror M12 Incident on the polarizing beam splitter BS1. Here, the λ / 4 wave plate QW is provided between the polarization beam splitter BS1 and the substrate FS, specifically, between the reflection mirror M13 and the cylindrical lens CYa. As a result, the beam LB1 irradiated onto the substrate FS is converted from the P-polarized light to the beam LB1 of the circularly polarized light by the λ / 4 wave plate QW, and the polarizing beam splitter from the substrate FS. The reflected light incident on (BS1) is converted from circularly polarized light to S-polarized light by this λ / 4 wave plate QW. Therefore, the reflected light from the substrate FS passes through the polarization beam splitter BS1 and enters the photodetector DT1 via the optical lens system G10.

At this time, in the state where the drawing optical element AOM1 of the light introducing optical system BDU1 is turned on, that is, in a state where the pulse beam LB1 is continuously incident on the beam scanning device MD1. By rotating the rotating drum DR and the beam scanning device MD1 scans the spot light SP, the spot light SP is irradiated two-dimensionally to the outer peripheral surface of the rotating drum DR. Therefore, the image of the reference pattern formed in the rotating drum DR can be acquired by the photodetector DT1.

Specifically, in response to the clock pulse signal (produced in the light source device 14) for pulse emission of the spot light SP, the change in intensity of the photoelectric signal output from the photodetector DT1 is measured for each scan time. By digital sampling every time, it acquires as one-dimensional image data of a Yt direction. Moreover, in response to the measured value of the encoder EC which measures the rotation angle position of the rotating drum DR, it is Yt-direction every fixed distance (for example, 1/2 of the size phi of the spot light SP) of a sub scanning direction. By arranging one-dimensional image data in the Xt direction, two-dimensional image information of the surface of the rotating drum DR is obtained. The control device 18 measures the inclination of the drawing line SL1 of the beam scanning device MD based on the two-dimensional image information of the obtained reference pattern of the rotating drum DR. The inclination of the drawing line SL1 may be a relative inclination between the beam scanning devices MD (MD1 to MD6), or may be an inclination (absolute inclination) with respect to the center axis AXo of the rotating drum DR. . In addition, it goes without saying that the inclination of each drawing line SL2-SL6 can also be measured similarly.

As shown in FIG. 8, the origin sensor 20 is provided around the polygon mirror PM of the beam scanning device MD1. The origin sensor 20 outputs a pulsed origin signal SH indicating the start of scanning of the spot light SP by each reflection surface RP. The origin sensor 20 outputs the origin signal SH when the rotation position of the polygon mirror PM comes to a predetermined position just before the scanning of the spot light SP by the reflection surface RP starts. The polygon mirror PM can deflect the beam LB1 projected onto the substrate FS in the effective scanning angle range θs. That is, when the reflection direction (deflection direction) of the beam LB1 reflected by the polygon mirror PM falls within the effective scanning angle range θs, the reflected beam LB1 enters the fθ lens FT. Therefore, the origin sensor 20 has the origin when the rotation position of the polygon mirror PM comes to a predetermined position just before the reflection direction of the beam LB1 reflected by the reflection surface RP falls within the effective scanning angle range θs. Output the signal SH. Since the scanning of the spot light SP is performed eight times in the period in which the polygon mirror PM is rotated once, the origin sensor 20 also outputs the origin signal SH eight times in this one rotation period. The home signal SH detected by the home sensor 20 is sent to the control device 18. After the origin sensor 20 outputs the origin signal SH, scanning along the drawing line SL1 of the spot light SP is started.

The origin sensor 20 is the reflection surface RP adjacent to the reflection surface RP which scans the spot light SP (deflection of the beam LB) from this (in this embodiment, polygon mirror PM) The origin signal SH is outputted using the reflection surface RP immediately before one of the rotational directions of. In order to distinguish each reflecting surface RP, the reflecting surface RP which deflects the beam LB1 is shown by RPa for convenience in FIG. RPb-RPh are shown in the periphery of the direction opposite to the rotation direction of polygon mirror PM).

The origin sensor 20 reflects the laser beam Bga from the light source unit 22 and the light source unit 22 that emits a laser beam Bga in a non-photosensitive wavelength range, such as a semiconductor laser, to form a polygon mirror PM. It has a beam transmission system 20a provided with the mirrors 24 and 26 projecting on the reflecting surface RPb of this. Further, the origin sensor 20 includes mirrors 30 and 32 for guiding the light receiving portion 28 and the reflected light (reflected beam Bgb) of the laser beam Bga reflected from the reflecting surface RPb to the light receiving portion 28. And a beam light receiving system 20b including a lens system 34 for condensing the reflected beam Bgb reflected by the mirror 32 into minute spot light. The light receiving unit 28 has a photoelectric conversion element that receives the spot light of the reflected beam Bgb collected by the lens system 34. Here, the position where the laser beam Bga is projected to each reflection surface RP of the polygon mirror PM is set so that it may become the same surface (focal position) of the lens system 34.

When the rotation position of the polygon mirror PM becomes the predetermined position just before the scanning of the spot light SP by the reflection surface RP becomes the beam transmitter 20a and the beam receiver 20b, It is provided in the position which can receive the reflection beam Bgb of the laser beam Bga which the beam transmission system 20a emitted. That is, the beam transmitter 20a and the beam receiver 20b are lasers emitted by the beam transmitter 20a when the reflection surface RP for scanning the spot light SP is at a predetermined angle position. It is provided in the position which can receive the reflected beam Bgb of the beam Bga. In addition, the code | symbol Msf of FIG. 8 is a shaft of the rotating motor of the polygon drive part RM arrange | positioned coaxially with the rotating shaft AXp.

Immediately before the light receiving surface of the photoelectric conversion element in the light receiving portion 28, a light shielding body having a small width slit opening is provided (not shown). While the angular position of the reflection surface RPb is within a predetermined angle range, the reflection beam Bgb enters the lens system 34 so that the spot light of the reflection beam Bgb is on the light shielding body in the light receiving portion 28. Scan in a certain direction. During the scanning, the spot light of the reflected beam Bgb transmitted through the slit opening of the light shielding body is received by the photoelectric conversion element, and the received signal is amplified by the amplifier and output as a pulsed origin signal SH.

As described above, the origin sensor 20 uses the reflection surface RPb immediately before one of the rotation directions, rather than the reflection surface RPa which deflects the beam LB (scans the spot light SP). To detect the home signal (SH). Therefore, the angle ηj which forms an angle between the reflection surfaces RP (for example, the reflection surface RPa and the reflection surface RPb) adjacent to each other is a design value (the reflection surface RP is 8). If there is an error in the case of a dog, 135, the generation timing of the origin signal SH may vary for each reflection surface RP, as shown in Fig. 9 due to the deviation of the error.

In FIG. 9, the origin signal SH generated using the reflection surface RPb is set to SH1. Similarly, the origin signal SH generated by using the reflecting surfaces RPc, RPd, RPe,..., SH2, SH3, SH4,. Shall be. When the angles ηj formed between the mutually adjacent reflection surfaces RP of the polygon mirror PM are designed values, the interval between the generation timings of the respective origin signals SH (SH1, SH2, SH3, ...) is equal to the time Tpx. do. This time Tpx is the time required for the polygon mirror PM to rotate by one side of the reflection surface RP. However, in FIG. 9, the timing of the origin signal SH generated using the reflection surfaces RPc and RPd is a normal generation timing due to the error of each ηj of the reflection surface RP of the polygon mirror PM. There is a difference. Further, the time intervals Tp1, Tp2, Tp3, ... at which the origin signals SH1, SH2, SH3, SH4, ... occur are not constant in the µ second order due to the manufacturing error of the polygon mirror PM. In the time chart shown in FIG. 9, Tp1 <Tpx, Tp2> Tpx, and Tp3 <Tpx. Moreover, when the number of reflecting surfaces RP is Np and the rotation speed of polygon mirror PM is Vp, time Tpx is represented by Tpx = 1 / (NpxVp). For example, if the rotational speed Vp is 30,000 rpm (= 500 rpm) and the number Np of reflecting surfaces RP of the polygon mirror PM is 8, time Tpx will be 250 microseconds. In addition, in FIG. 9, the shift | offset | difference of the timing of generation | occurrence | production of each origin signal SH1, SH2, SH3, ... is exaggerated for clarity of explanation.

Therefore, the spot light SP drawn by each reflection surface RP (RPa-RPh) by the error of the angle (eta) j which forms the angle | corners of mutually adjacent reflection surfaces RP of the polygon mirror PM. The position of the drawing start point (scan start point) on the irradiated surface of the substrate FS is irregular in the main scanning direction. As a result, the position of the drawing end point is also irregular in the main scanning direction. That is, the position of the drawing start point and the drawing end point of the spot light SP drawn by each reflection surface RP does not become linear along the X direction. The factors where the positions of the drawing start point and the drawing end point of the spot light SP are irregular in the main scanning direction are Tp1, Tp2, Tp3,... = Tpx doesn't work.

Therefore, in the present embodiment, as shown in the time chart shown in FIG. 9, the drawing of the spot light SP is started by setting the time Tpx after as the drawing start point after the generation of one pulse-shaped origin signal SH. . That is, after the time Tpx after the origin signal SH is generated, the control device 18 writes the optical element AOM1 for drawing the light introduction optical system BDU1 which causes the beam LB1 to enter the beam scanning device MD1. Then, driving signals (on / off) corresponding to the pixel data of the pixel data string Dw are sequentially output. Thereby, the reflection surface RPb used for the detection of the origin signal SH and the reflection surface RP which actually scans the spot light SP can be made the same reflection surface.

Specifically, the control device 18, after the time Tpx after the origin signal SH1 occurs, the pixel data of the pixel data string Dw1 to the optical element AOM1 for drawing the light introduction optical system BDU1. Drive signals according to the output are sequentially. Thereby, the spot light SP can be scanned by the reflecting surface RPb used for the detection of the origin signal SH1. Next, the control device 18 responds to the drawing optical element AOM1 of the light introduction optical system BDU1 in accordance with the pixel data of the pixel data string Dw2 after a time Tpx after the origin signal SH2 is generated. Outputs drive signals sequentially. Thereby, the spot light SP can be scanned by the reflection surface RPc used for the detection of the origin signal SH2. In this way, by scanning the spot light SP using the reflection surface RP used for the detection of the origin signal SH, the angles between the reflection surfaces RP adjacent to each other of the polygon mirror PM are separated. ) Even if there is an error in the angle ηj to be formed, the drawing start point and the drawing end point on the irradiated surface of the substrate FS of the spot light SP drawn by the respective reflection surfaces RP (RPa to RPh) It is possible to suppress that the position is irregular in the main scanning direction.

For this purpose, it is necessary that the time Tpx at which the polygon mirror PM is rotated by 45 degrees is accurate in μsec order, that is, the speed of the polygon mirror PM is not non-uniform and is precisely rotated at constant speed. In such a case, when the polygon mirror PM is precisely rotated at the same speed, the reflection surface RP used for generating the origin signal SH always rotates by exactly 45 degrees after the time Tpx so that the beam LB1 is rotated. ) Is an angle reflecting toward the fθ lens FT. Therefore, by increasing the rotational uniformity of the polygon mirror PM and reducing the speed unevenness during one rotation as much as possible, the spot of the reflection surface RP used for generating the origin signal SH and the beam LB1 are deflected and spotted. The position of the reflective surface RP used for scanning the light SP can be changed. Thereby, the freedom degree of arrangement | positioning of the origin sensor 20 improves, and the origin sensor of a high rigidity and stable structure can be provided. Moreover, although the reflection surface RP made into the detection object of the origin sensor 20 was just in front of the rotation direction of the reflection surface RP which deflects the beam LB1, it is just before the rotation direction of the polygon mirror PM. It may be good and is not limited to just one. In this case, when the origin sensor 20 makes the reflection surface RP which is a detection object immediately forward by n (an integer of 1 or more) in the rotation direction of the reflection surface RP which deflects the beam LB1, the origin The drawing start point may be set after n x time Tpx after the signal SH is generated.

In addition, for each of the origin signals SH1, SH2, SH3, ... generated from the origin sensor 20, the drawing start point is set after n x time Tpx, thereby reading the corresponding pixel data string for each drawing line SL1. There is a margin in the processing time for the operation such as the operation, data transmission (communication) operation, or correction calculation. Therefore, transfer errors of the pixel data strings, errors and partial loss of the pixel data strings can be reliably avoided.

Further, the number Np of the reflection surfaces RP of the polygon mirror PM is 8, the rotation speed (rotational speed) Vp is 3.60,000 rpm, the scanning efficiency is αp ≤ 1/3, and spot light on the substrate FS. The effective diameter φ of SP is 3 μm, the length LBL of the drawing line SL1 is 50 mm, and the pitch (spacing) YP of the drawing line SL1 in the sub-scanning direction (Xt direction). Is set to YP = φ · (1-Uo) from the overlap ratio Uo (0 <Uo <1) with respect to the diameter φ of the spot light SP, then the spot light SP on the drawing line SL1 One scanning time Tss becomes Tss = (alpha) p * Tpx = (alpha) p * 1 / (Np * Vp) = 1 / 1.44 (msec). The scanning speed Vss on the drawing line SL1 of the spot light SP becomes Vss = LBL / Tss = 720 (m / sec). In addition, when the overlap ratio Uo is 1/2, that is, when the spot light SP is overlapped by 1/2 of the size φ, the sub scanning speed (transfer speed) Vt of the substrate FS is Vt = YP. / Tpx = φ × Np × Vp × (1-Uo) = 7200 μm / sec, and when the overlap ratio Uo is 2/3, that is, when the spot light SP overlaps by 2/3 of the size φ , Vt = 4800 µm / sec. In addition, although not demonstrated in detail, the origin sensor 20 is similarly provided also in beam scanning apparatus MD2-MD6.

FIG. 10: is sectional drawing which shows the holding structure of the beam scanning apparatus MD by the 2nd frame part Ub2. In addition, since the holding structure of the beam scanning device MD is the same in each beam scanning device MD, only the holding structure of the beam scanning device MD1 will be described, and the holding structure of the other beam scanning device MD will be described. The description is omitted. Also in FIG. 10, it demonstrates using three-dimensional coordinates of Xt, Yt, Zt similarly to FIG.

The beam scanning device MD1 includes optical constituent members (reflection mirrors M10 to M15, beam expander BE, polarizing beam splitter BS1, image shift optical member SR, deflection adjustment optical member DP, Field aperture (FA), λ / 4 wave plate (QW), cylindrical lenses (CYa, CYb), polygon mirrors (PM), fθ lenses (FT), optical lens system (G10), and photodetector (DT1) ) As shown in FIG. 7, and has a support frame 40 rotatable around the irradiation center axis Le1. The support frame 40 has a substantially U-shaped or U-shaped shape corresponding to the optical path of the beam LB1 passing through the beam scanning device MD1. The support frame 40 is parallel to the XtYt plane and is disposed in parallel with each other in the Zt direction, and the parallel support parts 42 and 44 and the closed support part which blocks one end of the two parallel support parts 42 and 44. Has 46. The closing support part 46 is provided in the -Xt direction side of the parallel support parts 42 and 44. As shown in FIG. The optical constituent members of the beam scanning device MD (the reflecting mirror M10, the polygon mirror PM, the fθ lens FT, the reflecting mirror M15, the cylindrical lens CYb, etc.) are supported frames. It is arrange | positioned along the outer peripheral surface of 40. As shown in FIG.

Although not shown, the reflection mirrors M10 and M11, the beam expander BE, the polarizing beam splitter BS1, the optical lens system G10, and the photodetector DT1 are located on the + Zt direction side of the parallel support 42. It is supported by cotton. Similarly, although illustration is abbreviate | omitted, image shift optical member SR, deflection adjustment optical member DP, and field aperture FA are supported by the surface of the blocking support part 46 at the side of -Xt direction. Although not shown, lambda / 4 wave plate (QW), cylindrical lenses (CYa, CYb), reflection mirrors (M14, M15), polygon mirror (PM), fθ lens (FT), and the origin sensor ( 20 is supported by the surface on the side of the -Zt direction of the parallel support portion 44. The reflective mirror M12 is supported by the surface on the + Zt direction side of the parallel support portion 42 or the surface on the -Xt direction side of the occlusion support portion 46, and the reflection mirror M13 is the occlusion support portion 46. Is supported by the surface on the -Xt direction side or the surface on the -Zt direction side of the parallel support portion 44. The support frame 40 (especially the parallel support part 44) supports the polygon mirror PM by supporting the polygon drive part RM (rotary motor).

On the other end side where the closing support part 46 of the two parallel support parts 42 and 44 is not provided, the cylindrical post member BX1 which comprises a part of a pattern drawing apparatus is It is provided in an inserted state. An annular bearing 48 is interposed between each of the parallel support portions 42 and 44 and the support member BX1. The strut member BX1 is supported in the state fixed to the 2nd frame part Ub2. Therefore, the support frame 40 is rotatable about the support member BX1 with respect to the 2nd frame part Ub2 of the main body frame UB. Moreover, the outer ring part of the annular bearing 48 which is a part of the pattern drawing apparatus is the parallel axis | shaft 42 and 44 so that the center axis | shaft of the support member BX1 may be coaxial with irradiation center axis Le1. The inner ring portion of the annular bearing 48 is fixed to the outer circumferential surface of the strut member BX1. Of the two annular bearings 48, the annular bearing 48 between the parallel support portion 42 on the + Zt direction side and the support member BX1 is, for example, an angular of a back combination. ) Ball bearing, and the annular bearing 48 between the parallel support 44 on the -Zt direction side and the support member BX1 is constituted by a deep groove ball bearing. The beam scanning device MD1 (including the supporting frame 40) is inclined by θ with respect to the center plane Poc by the support member BX1 at a position deviated in the + X (+ Xt) direction from the entire center position. It is supported in a true state (Figs. 1 and 4). In this way, the beam scanning device MD1 is supported by the supporting member BX1 (second frame portion Ub2) provided in a piece supporting manner provided at the position of the irradiation center axis Le1.

The beam scanning apparatus MD1 has the drive mechanism 50 which rotates the support frame 40 with respect to the 2nd frame part Ub2. The drive mechanism 50 is provided in the space between two parallel support parts 42 and 44. As shown in FIG. Thereby, the beam scanning apparatus MD1 can be made compact. This drive mechanism 50 is demonstrated in detail with reference also to FIG. The drive mechanism 50 has a linear actuator 52, a movable member 54, a driven member 56, and springs 58, 60. The linear actuator 52, the movable member 54, and the spring 58 are supported on the plate-shaped drive support member 62 parallel to the XtYt plane. The vertical portion 62a extended in a plate shape in the + Zt direction in parallel with the YzZt plane is integrally provided at the end portion of the drive supporting member 62 in the + Xt direction. The vertical portion 62a is fixed to the side surface Ub2a parallel to the YtZt plane of the second frame portion Ub2. In addition, on the side surface Ub2a of the second frame portion Ub2, the holding member BX1 is held so that the center line of the cylindrical holding member BX1 is coaxial with the irradiation center axis Le1. U-shaped recess Ubx is formed. The strut member BX1 fitted into the recess Ubx is fixed by being sandwiched between the vertical portion 62a of the drive support member 62 and the recess Ubx.

The driven member 56 is supported in the state fixed to the inner surface side (side surface of + Xt direction) of the blocking support part 46 of the support frame 40. FIG. The driven member 56 is configured to abut against a portion of the movable member 54 that rotates in response to the linear thrust of the linear actuator 52 and is subjected to a force in the -Yt direction. Thereby, the whole beam scanning apparatus MD1 rotates around the support member BX1 (irradiation center axis Le1).

The configuration and operation will be described in more detail. The linear actuator 52 has the rod 52a which can move back and forth in the Xt direction, and the rod 52a is advanced in the Xt direction by the control of the control device 18. The moving position of the rod 52a in the Xt direction is measured by a high precision linear encoder or the like, and the measured value is sent to the control device 18. The movable member 54 is rotatable about the rotating shaft 54a provided in the drive support member 62. The movable member 54 has a first contact portion 54b which abuts against the roller 52b at the tip of the rod 52a, and a roller (second contact portion) which abuts with a cross section parallel to the XtZt plane of the driven member 56. Has 54c. The tension spring 58 presses the first contact portion 54b in the + Xt direction so that the roller 52b at the tip of the rod 52a and the first contact portion 54b of the movable member 54 always abut. Therefore, one end of the tension spring 58 is fixed to the drive support member 62, and the other end is fixed to the vicinity of the first contact portion 54b of the movable member 54. The tension spring 60 is a movable member such that the roller (second contact portion) 54c rotatably supported by the movable member 54 and the cross section parallel to the XtZt plane of the driven member 56 are always in contact with each other. A pressing force for pulling the roller 54c of 54 to the driven member 56 side is generated. Therefore, one end of the tension spring 60 is fixed to the shaft portion of the roller 54c of the movable member 54 and the other end is fixed to the driven member 56.

When the rod 52a of the linear actuator 52 is in the mid-point position of the movement stroke in the Xt direction, the contact surface of the first contact portion 54b of the movable member 54 that abuts with the roller 52b and the roller 54c The contact surface of the cross section of the driven member 56 in contact with) is set to be orthogonal in the XtYt plane. Moreover, as shown in FIG. 11, when the rod 52a of the linear actuator 52 is in a neutral position, when the line segment Pmc parallel to the Xt axis is set through the irradiation center axis Le1, the XtYt plane is The center point of the beam scanning device MD1 is set to almost come on the line segment Pmc. In addition, the axis of rotation 54a of the movable member 54 and the axis of the roller 54c are also arrange | positioned so that it may be located on the line segment Pmc.

When the linear actuator 52 moves the rod 52a in the -Xt direction from the neutral position in FIG. 11, the first contact portion 54b of the movable member 54 resists the pressing force of the spring 58 to load the rod 52a. Since it is pressurized by the roller 52b of the front end, the movable member 54 rotates counterclockwise from the surface of FIG. 11 about the rotating shaft 54a. As a result, the roller 54c of the movable member 54 presses the driven member 56 in the -Yt direction. Therefore, the blockage support part 46 side of the beam scanning apparatus MD1 (support frame 40) rotates about a irradiation center axis Le1 to the -Yt direction side (also called "-(theta) zt rotation"). Moreover, when the linear actuator 52 moves the rod 52a to + Xt direction from the neutral position of FIG. 11, the 1st contact part 54b of the movable member 54 will move the roller 52b by the pressing force of the spring 58. Moreover, as shown in FIG. ), And moves toward the + Xt direction while maintaining contact with As a result, the movable member 54 is rotated clockwise in the plane of FIG. 11 around the rotating shaft 54a, and the roller 54c of the movable member 54 moves in the + Yt direction. At this time, the driven member 56 maintains contact with the roller 54c by the pressing force of the spring 60 and moves in the + Yt direction. Therefore, the blockage support part 46 side of the beam scanning apparatus MD1 rotates (also called "+ (theta) zt rotation") about the irradiation center axis Le1 to + Yt direction side.

In this embodiment, the distance from the rotating shaft 54a of the movable member 54 to the 1st contact part 54b is set longer than the distance from the rotating shaft 54a of the movable member 54 to the axis of the roller 54c. Therefore, the amount of movement in the Xt direction of the rod 52a of the linear actuator 52 is reduced, so that the amount of movement in the Yt direction of the driven member 56 is obtained. In addition, the distance from the centerline (irradiation center axis Le1) of the cylindrical columnar strut member BX1, which is the mechanical rotation center of the beam scanning device MD1, to the driven member 56 to which rotational driving force is applied is lengthened. Therefore, the rotation angle amount of the beam scanning device MD1 with respect to the unit movement amount of the rod 52a of the linear actuator 52 can be made sufficiently small, and the rotation angle setting of the beam scanning device MD1 can be set at high resolution (μrad). ) Can be controlled.

As shown in the configuration shown in Fig. 10 (or Fig. 4), each of the beam scanning devices MD1 to MD6 has a cylindrical post member BX1 and an annular shape with respect to the apparatus main body (second frame portion Ub2). The bearing 48 is axially rotatably supported by the irradiation center axes Le1 to Le6 coaxially. Therefore, each beam scanning apparatus MD1-MD6 is hold | maintained in the apparatus main body in the immediate vicinity of each drawing line SL1-SL6 formed on the board | substrate FS, and of each beam scanning apparatus MD1-MD6 is carried out. The obstruction support part 46 side is a structure which is not mechanically restrained (state not firmly fastened to the apparatus main body, main-frame UB, etc.).

Therefore, even if the support frame 40 (especially two parallel support parts 42 and 44) used as the structure of each beam scanning apparatus MD1-MD6 thermally expands by a temperature change etc., each beam scanning apparatus ( Since MD1-MD6 thermally expands mainly in -Xt direction (closed support part 46 side) in FIG.10, 11, each drawing line SL1-SL6 is the direction along the outer peripheral surface of the rotating drum DR. Fluctuation is suppressed. That is, the distance in the X direction between the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 shown in FIG. 3 is independent of thermal deformation of the structure due to temperature change. It also has the advantage that it can be kept at a certain distance in micron order. Moreover, the 2nd frame part Ub2 and the support member BX1 which support each beam scanning apparatus MD1-MD6 are made into the metal material (Invar etc.) of low thermal expansion coefficient, and glass ceramic material (brand name: zero). By setting it as Duror etc., it can be set as a more thermally stable structure.

Therefore, in the present embodiment, the cylindrical post member BX1 and the annular bearing 48 shown in FIG. 10 (or FIG. 4) support the support frame 40 (that is, the entire beam scanning device MD). It corresponds to the rotation support mechanism which rotatably supports the irradiation center axis Le (Le1-Le6) with respect to the 2nd frame part Ub2 which is an apparatus main body. In addition, in this embodiment, the two upper and lower annular bearings 48 shown in FIG. 10 are the apparatus main body (2nd frame part Ub2) of the support frame 40 (namely, the whole beam scanning apparatus MD). ) To the region of the device from the irradiation center axis Le (Le1 to Le6) to a region within a predetermined radius (here, the radius of the outer circumference of the annular bearing 48), to couple the support frame 40 to the apparatus main body. It corresponds to the coupling member for doing so. Moreover, in the structure like FIG. 10, it is not necessary to rotate (theta) zt the support frame 40 (the whole beam scanning apparatus MD) with respect to the apparatus main body (2nd frame part Ub2), and the support frame 40 is rotated. When it is good to couple firmly to the 2nd frame part Ub2, the annular bearing 48 is abbreviate | omitted, and the upper end part of the cylindrical columnar strut member BX1 is joined to the parallel support part 42, and the strut member BX1. What is necessary is just to couple the lower end of this to the parallel support part 44. Also in this case, the cylindrical columnar strut member BX1 which has a predetermined radius from the irradiation center axis Le (Le1-Le6) functions as a coupling member.

FIG. 12: is a perspective view which shows the state in which the support member BX1 and the drive support member 62 are attached to the 2nd frame part Ub2 shown in FIG. 4 (or FIG. 10, FIG. 11). The second frame portion Ub2 is a prismatic member which extends in the Y direction, and the side surface Ub2a in the -X direction and the side surface Ub2b in the + X direction are each an angle ± φ (Fig. 4) with respect to the YZ plane. It is formed so as to incline by). To the side surface Ub2a of the second frame portion Ub2, a cylindrical post member BX1 is fitted in coaxial with each of the odd irradiation center axes Le1, Le3, Le5 extending in the Zt direction ( U-shaped recesses Ubx to be inserted are formed so as to penetrate the upper and lower sides of the side surfaces Ub2a. Similarly, also in the side surface Ub2b of the 2nd frame part Ub2, the cylindrical post member BX1 is coaxial with each of the even irradiation center axis Le2, Le4, Le6 extending in a Zt direction. The U-shaped recess Ubx to be penetrated is formed to penetrate the upper and lower sides of the side surface Ub2b. And the vertical part 62a (refer FIG. 10, FIG. 11) integrated with the drive support member 62 has each recessed part Ubx formed in the side surface Ub2a, Ub2b of the 2nd frame part Ub2. It is fixed to the side surfaces Ub2a and Ub2b so as to prevent it. The second frame portion Ub2 having such a structure is provided on the main body frame (main body columns BFa and BFb) of the exposure apparatus EX that supports the rotating drum DR, the alignment microscopes ALG1 to ARG4, and the like. It is coupled to the third frame portion (Ub3) for.

FIG. 13: is a perspective view which shows the structure which mounts the 3rd frame part Ub3 shown in FIG. 12 to main body columns BFa and BFb of exposure apparatus EX. In the previous FIG. 4, the second frame portion Ub2 is provided at the lower portion of the first frame portion Ub1 of the main body frame UB in a suspended state, but here, the second frame portion Ub2 is the main body. As a part of the frame UB, the rotary drum DR was mounted on the main body columns BFa and BFb for supporting the shaft. The third frame portion Ub3 is formed in a horizontal portion having a prism shape extending in the Y direction to fix and provide the second frame portion Ub2 of the main body frame UB in FIG. 4 at the center, and at each of both ends in the Y direction. It has a door-like structure composed of a prismatic leg portion provided extending in the Z direction. Leg portions on both sides of the third frame portion Ub3 are supported on the body columns BFa and BFb (also coupled to the body frame UB) of the exposure apparatus EX provided at intervals in the Y direction. Although the illustration of the main body columns BFa and BFb is omitted in FIG. 12, the second frame portion Ub2 includes the shafts Sft protruding from both ends in the Y direction of the rotary drum DR shown in FIG. 2 or 4. Support the shaft through the bearing at the position away from-) in the -Z direction by a certain distance. In addition, the upper end surfaces of the body columns BFa and BFb are formed to have a constant width (for example, 5 cm or more) in the Y direction.

One leg part of the 3rd frame part Ub3 and the leg part of the + Y direction side are provided in the main body column BFa via the base 500, but are formed elongate in the Z direction. You may directly fix the leg part of the frame part Ub3 on the + Y direction side on the main body column BFa. On the lower end surface of the leg portion in the -Y direction side of the third frame portion Ub3, a V-shaped groove formed with a V-shaped groove forming a ridgeline parallel to the Y axis is fixed, and the upper surface of the main body column BFb. The steel ball 502 which fits into the V-shaped groove of the fin member 501 is supported by the position so that rotation is possible. Accordingly, the fin member 501 and the steel ball 502 have a degree of freedom for relative movement only in the Y direction along the V-shaped groove. In addition, between the protrusion Ub4 on the side of the leg of the third frame portion Ub3 on the side of the leg portion in the -Y direction and the body column BFb, the V-shaped groove of the fin member 501 always comes into contact with the steel ball 502. A tension spring 503 for applying a pressing force is provided to press the third frame portion Ub3 (and the second frame portion Ub2) in the -Z direction.

In the present embodiment, six beam scanning devices MD1 to MD6 having the same structure are arranged in the second frame portion Ub2 in symmetrical manner with respect to the center plane Poc (see FIGS. 4 and 5). Since it is provided, the center point of the whole exposure head 16 comprised from six beam scanning apparatuses MD1-MD6 is located in the position near the center plane Poc with respect to an X direction. Therefore, in the leg part of the 3rd frame part Ub3 which supports the load of the whole exposure head 16, the stress of the direction inclined to the X direction hardly arises, and the 3rd frame part Ub3 and the 2nd frame part Since deformation | transformation generation | occurrence | production of (Ub2) can be suppressed, the whole exposure head 16 can be kept stable at a predetermined position.

In addition, when the main body columns BFa and BFb are composed of ordinary iron casting materials, light metals (aluminum), etc., rather than expensive low thermal expansion coefficient metals, the upper end portions of the main body columns BFa and BFb, respectively. It is considered that the distance in the Y direction fluctuates in the range of several microns under the influence of changes in environmental temperature and heat generating parts (motor, AOM, electrical substrate, etc.). Alternatively, the rotary drum DR may be caused by a slight eccentricity of the shaft Sft of the rotating drum DR, a shaft shake of a motor or a reducer connected to the shaft Sft, and a bearing for supporting the shaft Sft axially. In accordance with the rotation cycle of), a stress in the Y direction occurs in the body columns BFa and BFb, and the intervals in the Y direction of the body columns BFa and BFb may fluctuate within a range of several microns. Even when such main body columns BFa and BFb are varied, the third frame portion Ub3 and the second frame are formed by the fin member 501 and the steel ball 502 which have a degree of freedom in the Y direction as shown in FIG. Since the part Ub2 is supported, even if it is such a fluctuation, the possibility of changing the 3rd frame part Ub3 and the 2nd frame part Ub2 is avoided.

As described above, the beam scanning devices MD1 to MD6 respectively incline the drawing lines SL1 to SL6 using reference patterns formed on the surfaces of the photodetector DT1 and the rotating drum DR shown in FIG. 7. The angle (inclination error) can be measured by itself. Therefore, the control apparatus 18 drives the linear actuator 52 of each beam scanning apparatus MD (MD1-MD6) based on the inclination angle of each measured drawing line (SLn (SL1-SL6)). Thereby, each drawing line (SLn (SL1-SL6)) is made to be relatively parallel, or each drawing line SLn (SL1 -SL6) is made into the center axis | shaft (of the rotating drum DR). Parallel to AXo. Moreover, the control apparatus 18 is a position of the alignment mark (MK (MK1-MK4)) on the board | substrate FS detected using the alignment microscope (ALG (ALG1-ALG4)). Based on this, the deformation of the substrate FS wound on the rotating drum DR or the deformation of the exposure area W is detected, and accordingly the linear actuators of the respective beam scanning devices MD (MD1 to MD4) ( 52. The overlapping accuracy of the pattern formed in the lower layer and the predetermined pattern to be newly exposed is improved by this.

FIG. 14: is a figure which shows the deformation state of the exposure area | region W by which the predetermined | prescribed pattern is exposed by the exposure head 16. FIG. The deformation | transformation of the exposure area | region W arises by the deformation | transformation of the board | substrate FS wound and conveyed by the rotating drum DR. Moreover, even if the board | substrate FS is not deform | transformed, the exposure area W itself of the board | substrate FS may deform | transform by the board | substrate FS being deformed and conveyed at the time of formation of the lower pattern layer.

As shown in FIG. 14, since the exposure area | region W is deformed, the arrangement | positioning of the position of the formed alignment mark MK (MK1-MK4) is also not linear, but is in the deformed state. Moreover, the exposure area W 'shown by the dotted line has shown the exposure area of the abnormality in which there is little deformation. The control apparatus 18 deform | transforms the exposure area | region W based on the position of the alignment mark MK (MK1-MK4) on the board | substrate FS detected using the alignment microscope ALG (ALG1-ALG4). The linear actuator 52 of each beam scanning device MD (MD1 to MD6) is driven in accordance with the deformation state of the exposure area W. Moreover, immediately after the drawing exposure by the writing lines SL1 to SL6 is started with respect to the exposure area W, the + X direction is closer to each observation area Vw1 to Vw4 of the alignment microscopes ALG1 to ALG4 shown in FIG. 3. Although the position of alignment mark MK2, MK3 which exists is detectable, the position of alignment mark MK2, MK3 located in the upstream (-X direction side) rather than each observation area | region Vw1-Vw4 is the board | substrate FS. ) Is sent and drawing exposure is not advancing. Therefore, the control apparatus 18 is each position of the alignment marks MK1-MK4 which accompany the exposure area W just before one lined in the long direction of the board | substrate FS, for example. You may estimate the deformation | transformation of the exposure area | region W which exposes a current pattern from the deformation | transformation quantity and the deformation | transformation tendency calculated | required from the detection result of the.

As described above, in the present embodiment, the beam scanning device MD is moved around the irradiation center axis Le that vertically passes the midpoint (specific point) of the drawing line SLn with respect to the irradiated surface of the substrate FS. Since it can rotate with high precision, the inclination of the drawing line SLn can be adjusted simply and precisely. Thus, the drawing line SLn rotates on the irradiated surface of the board | substrate FS centering on the midpoint of the drawing line SLn, Therefore, the X (Xt) direction and the Y (Yt) direction of the drawing line SLn. It is possible to easily adjust the inclination of the drawing line SLn while minimizing the positional variation of. For example, if the drawing line SLn is rotated about the center point away from the drawing line SLn, the position of the drawing line SLn moves greatly so as to draw an arc around the center point. In the embodiment, the positional variation of both ends (scanning start point and scan end point) of the drawing line SLn can be minimized. That is, the position variation of both ends by the inclination adjustment of the drawing line SLn becomes symmetric with respect to the midpoint of the drawing line SLn.

Moreover, since it is not necessary to perform complicated inclination adjustment like Japanese Unexamined Patent Publication No. Hei 8-11348, position shift of the main scanning direction and the sub scanning direction does not occur due to the inclination adjustment. Even if the inclination of the drawing line SLn is adjusted, the distance between the cylindrical lens CYb of the beam scanning device MD and the irradiated surface of the substrate FS is constant, so as in Japanese Patent Laid-Open No. 8-11348. No complicated inclination adjustment is necessary, and the magnification shift in the main scanning direction does not occur due to the inclination adjustment.

Moreover, the irradiation center axis Le may be an axis | shaft which passes arbitrary points (specific point) on the drawing line SLn perpendicular | vertical to the irradiation surface of the board | substrate FS. In this case, the drawing line SLn rotates about an arbitrary point on the drawing line SLn, but the drawing line SLn is compared with the case where the center point is set at a position away from the drawing line SLn. The positional variation (lateral shift) of can be made small.

Furthermore, in the present embodiment, the beam LB is incident on the reflection mirror M10 of the beam scanning device MD so as to be substantially coaxial with the irradiation center axis Le passing vertically through the midpoint of the drawing line SLn. Even when the beam scanning device MD is rotated θzt around the irradiation center axis Le, the position of the beam LB incident on the reflection mirror M10 does not change. Therefore, even when the beam scanning device MD is rotated θzt, the optical path of the beam LB passing through the beam scanning device MD does not change, and the beam LB defines the inside of the beam scanning device MD. Pass right one way. Thus, even if the beam scanning device MD is rotated θzt, the spot light SP is not projected onto the substrate FS by the vignetting or the like of the beam LB1, or the drawing line after the tilt adjustment ( The problem that the spot light SP is projected at the position away from SLn does not occur.

By the support frame 40 of the beam scanning device MD, optical components (reflective mirrors M10 to M15, cylindrical lenses CYa and CYb, polygon mirrors PM, and fθ lenses FT) ) Is supported, and the support frame 40 is rotatably supported with respect to the second frame portion Ub2. And since the linear actuator 52 supported by the 2nd frame part Ub2 can be electrically controlled, according to the position of the detected alignment mark MK and the inclination intrinsic of the measured drawing line SLn, The inclination of the drawing line SLn can be electrically and automatically adjusted.

By the way, in the optical structure of the beam scanning apparatus MD (MD1-MD6) shown in FIG. 7, the rotation center of the drawing line (SLn (SL1-SL6)) was set to the midpoint of the drawing line SLn, but it is limited to it. It may be shifted from the middle point as long as it is on the drawing line SLn, specifically, in the configuration of Fig. 7 (and Figs. 10 and 11), for example, a reflection mirror disposed along the optical axis AXa ( M10), the beam expander BE, the reflecting mirror M11, and the cylindrical strut member BX1 (and the annular bearing 48) are moved in parallel in the + Yt direction from the position of FIG. 7 (FIG. 11). do.

[Modification]

The said embodiment can also be modified as follows.

(Modification 1)

FIG. 15: is a figure which shows the optical structure of the beam scanning apparatus MD in the modification 1. As shown in FIG. The same reference numerals are given to the same configuration as that in FIG. 7, and description thereof is omitted. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD.

The beam scanning device MD1 includes a reflection mirror M10, a beam expander BE, a reflection mirror M20, a beam splitter BS2, a reflection mirror M21, a polarization beam splitter BS3, and a λ / 4 wave plate. (QW), reflection mirrors (M22 to M24), cylindrical lenses (CYa), polygon mirrors (PM), fθ lenses (FT), reflective mirrors (M15), cylindrical lenses (CYb), photodetectors (DT1) ) And a position detector DT2. In addition, in FIG. 15, image shift optical member SR and deflection adjustment optical member DP are abbreviate | omitted.

The beam LB1 incident on the beam scanning device MD1 proceeds toward the -Zt direction and enters the reflection mirror M10. The beam LB1 incident on the beam scanning device MD1 enters the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1. The reflection mirror M10 functioning as the incident optical member reflects the incident beam LB1 in the -Xt direction toward the reflection mirror M20. The beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE and enters the reflection mirror M20.

The reflection mirror M20 reflects the incident beam LB1 in the -Zt direction toward the reflection mirror M21. The beam LB1 reflected by the reflection mirror M20 enters the beam splitter BS2. The beam splitter BS2 transmits a part of the incident beam LB1 toward the reflection mirror M21, and reflects the remainder of the incident beam LB1 toward the position detector DT2. The beam splitter BS2 transmits the light amount larger than the light amount of the beam LB1 to reflect toward the reflection mirror M21. For example, the ratio of the amount of light to transmit and the amount of light to reflect is 9 to 1.

The reflection mirror M21 reflects the incident beam LB1 in the + Xt direction toward the reflection mirror M22. The beam LB1 reflected by the reflection mirror M21 passes through the polarization beam splitter BS3 and the λ / 4 wave plate QW and enters the reflection mirror M22. The polarizing beam splitter BS3 transmits the P-polarized beam and reflects it to the beam LB1 of the S-polarized light. Since the beam LB1 incident on the beam scanning device MD1 is a P-polarized beam, the polarization beam splitter BS3 transmits the beam LB1 from the reflection mirror M21 toward the reflection mirror M22. .

The beam LB1 whose optical path is bent by the reflection mirrors M22 to M24 passes through the cylindrical lens CYa and enters the polygon mirror PM. The busbar of the cylindrical lens CYa is set parallel to the XtYt plane, and the beam LB1 is parallel to the XtYt plane on the reflective surface RP of the polygon mirror PM having a rotation axis parallel to the Zt axis. Extends in a slit-like direction and is focused. The polygon mirror PM reflects the incident beam LB1 toward the + Xt direction toward the deflection fθ lens FT. The polygon mirror PM rotates at a constant speed by the polygon drive part (motor) RM. The fθ lens FT having the optical axis AXf extending in the Xt-axis direction is formed on the irradiated surface of the substrate FS proportional to the incident angle via the reflection mirror M15 and the cylindrical lens CYb. The spot light SP of the beam LB1 is projected at the image position. The reflection mirror M15 reflects the incident beam LB1 in the -Zt direction toward the substrate FS via the cylindrical lens CYb.

By the cylindrical lens CYb in which the fθ lens FT and the bus bar are parallel to the Yt direction, the beam LB1 projected onto the substrate FS is about several micrometers in diameter on the irradiated surface of the substrate FS ( For example, it converges to the minute spot light SP of 3 micrometers). Here, at least the fθ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS. Moreover, at least the reflective members (reflective mirrors M15 and M20 to M24) function as optical path deflection members that bend the optical path of the beam LB1 from the reflective mirror M10 to the substrate FS. By this optical path deflection member, the incident axis of the beam LB1 incident on the reflection mirror M10 and the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in the Zt direction can be made substantially coaxial. .

The reflected light from the rotating drum DR (or the substrate FS) includes the cylindrical lens CYb, the reflective mirror M15, the fθ lens FT, the polygon mirror PM, and the cylindrical lens CYa. And enters the polarizing beam splitter BS3 through the reflective mirrors M24 to M22 and the λ / 4 wave plate QW. Here, the substrate (B) is formed by the λ / 4 wave plate QW provided between the polarizing beam splitter BS3 and the substrate FS, specifically, between the polarizing beam splitter BS3 and the reflective mirror M22. The beam LB1 irradiated to the FS is converted from the P-polarized light to the beam LB1 of the circularly polarized light, and the reflected light of the circularly polarized light returned from the substrate FS to the polarizing beam splitter BS3 is this lambda / 4 wavelength plate. QW converts the circularly polarized light into the beam LB1 of the S-polarized light. Therefore, the reflected light from the substrate FS is reflected by the polarization beam splitter BS3 and is incident on the photodetector DT1. Thereby, inclination intrinsic to the drawing line SL1 of the beam scanning apparatus MD1 can be detected by the method similar to the said embodiment.

In addition, the position detector DT2 detects the center position of the incident beam LB1, for example, a four-segment sensor is used. The four-segment sensor has four photodiodes (photoelectric conversion elements), which are orthogonal to the traveling direction of the beam LB1 by using the difference in the received amount of light received by each of the four photodiodes (difference in signal level). In the XtZt plane, the center position of the beam LB1 is detected. By this, it can be determined whether the beam LB1 is shifted with respect to a desired position. Between the reflection mirror M10 and the beam splitter BS2, the image shift optical member SR and the deflection adjustment optical member DP described in the above embodiments may be provided. Thereby, the control apparatus 18 can adjust the center position and inclination of the beam LB1 based on the detection result of the position detector DT2.

(Modification 2)

FIG. 16: is a figure which shows the optical structure of the beam scanning apparatus MD in the modification 2. As shown in FIG. In FIG. 16, only the part different from FIG. 7 or FIG. 15 is shown, and illustration is abbreviate | omitted about the optical system from the polygon mirror PM to the reflection mirror M10 side. The same configuration as that in FIG. 7 or FIG. 15 is given the same reference numeral, and description thereof is omitted. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD.

The beam scanning apparatus MD1 has the phase rotation optical system IR which rotates the drawing line SL1 centering on the irradiation center axis Le1 (center of the midpoint of the drawing line SL1). The phase rotation optical system IR rotates the drawing line SL1 by rotating the circumference | surroundings of irradiation center axis Le1. The phase rotation optical system IR is provided between the cylindrical lens CYb and the irradiated surface of the board | substrate FS. As this phase rotation optical system IR, an image rotator can be used, for example. The incident axis of the beam LB1 passing through the midpoint of the scanning trajectory of the beam LB1 incident on the image rotation optical system IR from the cylindrical lens CYb is rotated upward so as to be substantially coaxial with the irradiation center axis Le1. An optical system IR is provided. Thereby, the image rotation optical system IR can rotate the drawing line SL1 about the irradiation center axis Le1. This phase rotation optical system IR rotates around the irradiation center axis Le1 by the actuator (drive part) which is not shown in figure controlled by the control apparatus 18. As shown in FIG.

Although not shown, this phase rotation optical system IR can be rotatably supported by a part of parallel support part 44 of the support frame 40 shown in FIG. Therefore, even if the support frame 40 (beam scanning device MD1) is not structured to be rotatable around the irradiation center axis Le1, the image rotation optical system IR is rotated around the irradiation center axis Le1. In this way, the inclination of the drawing line SL1 can be adjusted. Moreover, while making the support frame 40 (beam scanning apparatus MD1) rotatable about the irradiation center axis Le1, the image rotation optical system IR also supports the support frame 40 (beam scanning apparatus ( MD1)) may be rotated θzt around the irradiation center axis Le1 independently.

In this manner, in addition to the rotation around the irradiation center axis Le1 of the beam scanning device MD1, the image rotation optical system IR can be rotated around the irradiation center axis Le1 alone, and thus, for example, the image rotation optical system After coarse adjustment of the inclination of the drawing line SL1 is performed by IR, fine adjustment of the inclination of the drawing line SL1 can be performed by rotation of the whole beam scanning apparatus MD1. Therefore, the precision of the inclination adjustment of drawing line SL1 can be improved. In addition, when the irradiation center axis Le1 is an axis | shaft which passes arbitrary points on the drawing line SL1 perpendicular to the to-be-projected surface of the board | substrate FS, the irradiation center axis Le1 corresponds to the cylinder You may make it pass arbitrary points of the scanning trajectory of the beam LB1 which injects into the image rotation optical system IR from the knife lens CYb.

(Modification 3)

In the second modification, the beam scanning devices MD (MD1 to MD6) are rotated around the irradiation center axis Le (Le1 to Le6), but the beam scanning devices MD (MD1 to MD6) are irradiated. It is not necessary to rotate the circumference of the central axis Le (Le1 to Le6). In this case, the second frame portion Ub2 may hold the support frame 40 of the beam scanning devices MD (MD1 to MD6) in a state in which it is not rotatably fixed. Although the beam scanning devices MD (MD1 to MD6) do not rotate around the irradiation center axis Le (Le1 to Le6), the drawing line ((SLn (SL1 (SL1)) is performed by the phase rotation optical system IR shown in FIG. This is because it is possible to rotate ˜SL6)) about the irradiation center axis Le (Le1 to Le6).

(Modification 4)

17A and 17B are diagrams showing an optical configuration of the beam scanning device MD in the fourth modified example. In FIGS. 17A and 17B, the same reference numerals are assigned to the same components as those in FIG. 7, and description thereof will be omitted. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD. 17A shows the beam scanning device MD1 of the fourth modified example in the plane parallel to the XtZt plane, and FIG. 17B shows the beam scanning device MD1 of the fourth modified example in the plane parallel to the YtZt plane. Seen from

The beam scanning device MD1 has a cylindrical lens CYa, a reflective member RF, an fθ lens FT, a polygon mirror PM, and a cylindrical lens CYb. The beam LB1 that enters and enters the -Zt direction to the beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in parallel with the Zt axis. In the fourth modified example, the lens system GLa is provided immediately before the beam scanning device MD1 in the optical path of the beam LB1, and the beam is provided on the surface Cjp that is optically conjugate with the surface of the substrate FS. LB1 is collected by spot light. The beam LB1 condensed at the conjugate surface Cjp is incident on the cylindrical lens CYa along the irradiation center axis Le1 while isotropically diverging. The cylindrical lens CYa is set such that the bus bar is parallel to the Yt axis so as to have refractive power in the Xt direction. In addition, the beam LB1 immediately after passing through the cylindrical lens CYa converges in a substantially parallel light beam in the Xt direction and travels in the -Zt direction while diverging in the Yt direction.

The reflection surface Rf1 (45 ° inclination with respect to the XtYt plane) on the image side of the reflection member RF has the optical axis of the fθ lens FT for the beam LB1 incident through the cylindrical lens CYa. The beam LB1 is reflected in the -X direction so as to be incident in parallel to the optical axis AXf in the viewing area above (AXf). The beam LB1 transmitted through the field of view on the image side (+ Zt direction side) of the fθ lens FT is incident on the reflecting surface RP (parallel to the Zt axis) of the polygon mirror PM. The reflection surface RP of the polygon mirror PM is provided at the same height position as the optical axis AXf with respect to the Zt direction, and is set at the position of the pupil plane epf of the fθ lens FT or a position near it. do. Therefore, the rotation axis AXp of the polygon mirror PM and the optical axis AXf of the fθ lens FT are set to be orthogonal in the plane parallel to the XtZt plane. The beam LB1 incident on the polygon mirror PM by the cylindrical lens CYa and the fθ lens FT is a non-scan direction (orthogonal to the scanning direction (rotation direction) by the polygon mirror PM). Zt direction) converges on the reflection surface RP, and becomes the slit-shaped distribution extended in the direction parallel to a Yt axis on the reflection surface RP, and is projected.

Since the reflecting surface RP of the polygon mirror PM is parallel to the Zt axis (perpendicular to the optical axis AXf in the XtZt plane), the field of view of the image side (+ Zt direction side) is higher than the optical axis AXf of the fθ lens FT. The beam LB1, which passes through the region and reaches the reflective surface RP of the polygon mirror PM, and is thus reflected in the + Xt direction side, has a field of view lower than the optical axis AXf of the fθ lens FT (-Zt direction side). Passing through the area, the reflection surface Rf2 (45 ° inclination with respect to the XtYt plane) below the reflection member RF is directed. Therefore, the optical path of the beam LB1 incident on the polygon mirror PM and the optical path of the beam LB reflected by the polygon mirror PM become symmetrical with respect to the optical axis AXf in the XtZt plane. The beam LB1 reflected from the reflecting surface Rf2 on the lower side of the reflecting member RF and traveling in the -Zt direction passes through the cylindrical lens CYb having a busbar parallel to the Yt direction and having refractive power in the Xt direction. Thus, the light converges to become the spot light SP on the substrate FS.

In the structure of the beam scanning apparatus MD1 in the modification 4 shown to FIG. 17A and FIG. 17B, the optical path of the beam LB1 from the conjugate plane Cjp to the board | substrate FS (irradiated surface) is a polygon mirror PM Since it is a symmetrical system with respect to the reflecting surface RP (orbital surface epf) of the (), the spot light SP projected onto the substrate FS is the beam focused on the conjugate plane Cjp. It forms as an image of the spot light of (LB1). Therefore, when one reflective surface RP of the polygon mirror PM is at an angle that is exactly orthogonal to the optical axis AXf, the beam is incident on the reflective surface RP of the polygon mirror PM from the fθ lens FT. LB1 and the beam LB1 reflected by the reflection surface RP and incident on the fθ lens FT pass through the same optical path in the XtYt plane. In this case, the beam LB1 irradiated to the reflecting surface Rf2 below the reflecting member RF becomes the central portion in the Yt direction of the reflecting surface Rf2 and the beam LB1 projected onto the substrate FS. Spot light SP is located in the middle point (point through which irradiation center axis Le1 passes) on drawing line SL1.

When the reflection surface RP of the polygon mirror PM is slightly inclined from the state perpendicular to the optical axis AXf in the XtYt plane by the rotation about the rotation axis AXp of the polygon mirror PM, the polygon mirror ( The beam LB1 reflected from the reflecting surface RP of PM) and passing through the fθ lens FT and reaching the reflecting surface Rf2 below the reflecting member RF is rotated by the polygon mirror PM. Shift in the Yt direction on the reflection surface Rf2. Thereby, even in the beam scanning apparatus MD1 of the modification 4 shown to FIG. 17A and FIG. 17B, the spot light SP can be scanned one-dimensionally along the drawing line SL1. 17A and 17B, the upper reflection surface Rf1 and the lower reflection surface Rf2 of the reflection member RF cover the scanning range of the beam LB1 along the drawing line SL1. Is formed to be long and thin in the Yt direction, but when the reflecting surface Rf1 and the reflecting surface Rf2 are constituted by separate planar mirrors, the planar mirror which forms the upper reflecting surface Rf1 has a dimension in the Yt direction. May be made small enough to cover the diameter of the beam LB1 incident from the lens system GLa.

The cylindrical lens CYa functions as an incident optical member for causing the beam LB1 to enter the beam scanning device MD1. The fθ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS. At least, the reflection surface Rf1 and the reflection surface Rf2 of the reflection member RF are optical path deflection members that bend the optical path of the beam LB1 from the cylindrical lens CYa to the substrate FS. Function. By this optical path deflection member, the incident axis of the beam LB1 incident on the cylindrical lens CYa and the irradiation center axis Le1 can be made substantially coaxial.

Moreover, optical structural members (cylindrical lenses CYa and CYb, reflecting members RF, polygon mirrors PM, fθ lenses, etc.) of the beam scanning apparatus MD1 shown to FIG. 17A, 17B. 10 is supported by the support frame which can be rotated centering on the irradiation center axis Le1 similarly to the support frame 40 shown in FIG. Even in the configuration of the modification 4, even if the beam scanning device MD1 rotates θzt around the irradiation center axis Le1, the position of the beam LB incident on the cylindrical lens CYa does not change. Therefore, even when the beam scanning device MD1 is rotated θzt, the optical path of the beam LB passing through the beam scanning device MD1 does not change, and the beam LB defines the inside of the beam scanning device MD1. Pass right one way. Thereby, even if the beam scanning apparatus MD1 is rotated (theta) zt, the spot light SP is not projected on the surface (irradiation surface) of the board | substrate FS by vignetting etc. of the beam LB1, or the drawing line after tilt adjustment ( The problem that the spot light SP is projected at the position away from SLn does not occur.

(Modification 5)

18A and 18B are diagrams showing an optical configuration of the beam scanning device MD in the fifth modification. In FIGS. 18A and 18B, the same reference numerals are assigned to the same components as those in FIGS. 17A and 17B, and descriptions thereof are omitted. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD. 18A shows the beam scanning device MD1 of the modification 5 in the plane parallel to the XtYt plane, and FIG. 18B shows the beam scanning device MD1 of the modification 5 in the plane parallel to the YtZt plane. Seen from

In the beam scanning apparatus MD1 according to the modification 5, the irradiation center axis Le1 is positioned at the midpoint of the drawing line SL1 with respect to the beam scanning apparatus MD1 according to the modification 4 shown in FIGS. 17A and 17B. The points moved in parallel to the + Yt direction are different. Therefore, the lens system GLa for condensing the beam LB1 before entering the beam scanning device MD1 on the conjugate plane Cjp, and the cylindrical lens CYa are arranged in parallel in the + Yt direction. . In the modification 5, when the polygon mirror PM is rotated in the clockwise direction, it is reflected by the reflection surface RP of the polygon mirror PM, passes through the fθ lens FT, and is half of the lower side of the reflection member RF. The beam LB1 irradiated to the slope Rf2 is scanned in the -Yt direction.

Thus, even if the structure of the modified example 4 shown in FIG. 17A, FIG. 17B is changed like the modified example 5 shown in FIG. 18A, FIG. 18B, the extension line of irradiation center axis Le1 is arbitrary on drawing line SL1. A point (specific point) is set to pass, and the beam scanning device MD1 is rotated θzt around the irradiation center axis Le1, and the beam scanning device MD1 enters the beam scanning device MD1 (cylindrical lens CYa). By setting the beam LB1 to be coaxial with the irradiation center axis Le1, even if the beam scanning device MD1 is rotated θzt, the spot light SP can be accurately scanned along the drawing line SL1. . Moreover, although it is clear from the structure shown to FIG. 18A, FIG. 18B, the position in the XtYz plane of the beam LB1 which injects into the beam scanning apparatus MD1 (cylindrical lens CYa) is drawing line SL1. Any position in the Yt direction may be used as long as it is a position along. Therefore, when the dimension in the bus bar direction of the cylindrical lens CYa is increased, the position in the XtYz plane of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) can be freely changed. This has the advantage that the degree of freedom in setting the light guide path of the beam LB1 can be improved. In addition, since the position in the XtYz plane of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) can be set freely with respect to the Yt direction, the beam scanning device MD1 Coaxiality between the mechanical rotation center axis (irradiation center axis Le1) and the axis of the incident beam LB1 can be matched with high accuracy in the Yt direction.

(Modification 6)

19 and 20 are diagrams showing an optical configuration of the beam scanning device MD in the sixth modified example. In FIG. 19, FIG. 20, the same code | symbol is attached | subjected about the structure same as FIG. 7, and the description is abbreviate | omitted. In addition, since each beam scanning apparatus MD (MD1-MD6) has the same structure, it demonstrates only beam scanning apparatus MD1, and abbreviate | omits description about other beam scanning apparatus MD. In Fig. 7, the direction parallel to the optical axis AXf of the fθ lens FT is set as the Xt direction, so in Fig. 19 and Fig. 20, the direction parallel to the optical axis AXf of the fθ lens FT is shown as Xt direction. Direction, the scanning direction of the spot light SP is referred to as the Yt (Y) direction, and the directions orthogonal to these Xt directions and the Yt direction are described as the Zt direction.

Fig. 19 shows the beam scanning device MD1 of the present modified example 6 in a plane parallel to the XtYt plane. In the present modified example 6, the axis (irradiation center) of the beam LB1 incident on the beam scanning device MD1 is shown. Axis Le1) is set to be coaxial with the optical axis AXf of the fθ lens FT. That is, in this modification, after f (theta) lens FT, the scan which exited from f (theta) lens FT and passed through cylindrical lens CYb without providing the mirror (reflection surface) which bends the beam LB1 is provided. The beam is configured to project onto the substrate FS as it is.

In FIG. 19, the beam LB1 emitted from the light source device 14 and subjected to intensity modulation (on / off) in the imaging optical element AOM1 includes the lens system G30, the mirrors M30 and M31, and the lens system G31. Is guided to the cylindrical lens CYa. The beam LB1 incident on the beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1. The beam LB1 incident on the cylindrical lens CYa is shaped into a parallel light beam having a predetermined cross-sectional diameter. The beam LB1 reflected from the cylindrical lens CYa by the reflecting mirror M14 and reaching the reflecting surface RP of the polygon mirror PM is a parallel beam in the XtYt plane, and is a cylinder in the Zt direction. The light beam converged by the knife lens CYa. The beam LB1 reflected (polarized) by the polygon mirror PM passes through the fθ lens FT and the cylindrical lens CYb, and is spot light SP on the surface (irradiated surface) of the substrate FS. As condensed. In Fig. 19, the optical axis AXf of the fθ lens FT and the irradiation center axis Le1 are set to be parallel to the Xt axis, and these extension lines are the central axis (rotational center axis) of the rotating drum DR. Orthogonal to (AXo).

As for the main body frame 300 which supports the beam scanning apparatus MD1 of this modification 6, the opening part 300A through which the beam LB1 scanned along the drawing line SL1 passes is formed, and the beam scanning apparatus MD1 ) Is rotatably supported by the main body frame 300 via an annular bearing 301 having a radius from the optical axis AXf (irradiation central axis Le1) including the opening 300A. . Since the center line of the annular bearing 301 is set to be coaxial with the optical axis AXf (irradiation center axis Le1), the beam scanning device MD1 is centered on the optical axis AXf (irradiation center axis Le1). To rotate around the Xt axis. This rotation is called 'θxt rotation'.

FIG. 20: has shown the state which arrange | positioned multiple beam scanning apparatus MD of the modification 6 shown in FIG. 19 in the surface parallel to XZ plane, and the odd-numbered beam scanning apparatus MD1 is included in the main body frame 300. In FIG. The openings 300A passing through the scanning beams from each of the MD3 and MD5 are provided at regular intervals in the Y direction, and the scanning beams from each of the even-numbered beam scanning devices MD2, MD4, MD6 are provided. The opening part 300B which passes is provided at regular intervals in the Y direction. In addition, in the modification 6 of FIG. 20, the board | substrate FS wound by the rotating drum DR was conveyed horizontally in the -X direction, and wound about half a week from the top of the rotating drum DR. Thereafter, it is separated from the lower part of the rotating drum DR and conveyed in the + X direction. Therefore, here, the center plane Poc including the center axis AXo of the rotating drum DR becomes parallel to the XY plane.

Also in the structure of this modified example 6, each mechanical rotation center of the beam scanning apparatus MD by the annular bearing 301 is set to become irradiation center axis Le1-Le6, and each beam scanning apparatus MD Since the beams LB1 to LB6 incident on the beam are guided to be coaxial with each of the irradiation center axes Le1 to Le6, each beam scanning device MD is applied to the irradiation center axis in the same manner as in the above-described embodiments and modified examples. Even if θxt is rotated around each of Le1 to Le6, the posture position of the beams LB1 to LB6 incident on the lens system G30 does not change. Therefore, even when each beam scanning device MD is rotated θxt, the optical path of the beam LB passing through each beam scanning device MD does not change, and the beam LB does not pass through the beam scanning device MD. Pass correctly as prescribed. Thereby, even if each beam scanning apparatus MD is rotated (theta) xt, the spot light SP will not be projected on the surface (irradiation surface) of the board | substrate FS by vignetting etc. of the beams LB1-LB6, or after adjusting the inclination, The problem that the spot light SP is projected at a position deviating from the drawing lines SL1 to SL6 does not occur.

The lens system G30 functions as an incident optical member which causes the beams LB1 to LB6 to enter the beam scanning devices MD to MD6. The fθ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS. The reflective members (reflective mirrors M14, M30, M31) function as optical path deflection members that bend the optical paths of the beams LB1 to LB6 from the lens system G30 to the substrate FS.

[Joint error due to rotation of drawing line]

By the way, in the said embodiment and each modified example, when the inclination of the drawing line SLn is adjusted by (theta) zt rotation (or (theta) xt rotation) of the beam scanning apparatus MD, the drawing start point and the drawing end point on a drawing line are adjusted. The position before the adjustment is shifted. FIG. 21 shows an example in which the drawing line SL1 of the beam scanning device MD1 parallel to the Yt axis in the initial state is rotated counterclockwise in the XtYt plane (irradiated surface) by an angle θss. FIG. 21 shows the angle θ ss exaggerated for explanation, and the maximum value of the angle θ ss that can actually rotate is very small, about ± 2 °. In FIG. 21, when the middle point of the drawing line SL1 before adjustment is CC, the irradiation center axis Le1 extending in the Zt direction is set to pass through the middle point CC, and the drawing line SL1 is the irradiation center axis ( It is assumed that θzt is rotated (tilted) about the mechanical rotation center axis of the beam scanning device MD1 coinciding with Le1). In addition, if the drawing start point of the drawing line SL1 is ST and the drawing end point is SE, the length LBL from the drawing start point ST to the drawing end point SE is the actual pattern drawing width in the Yt direction. do. Therefore, it is assumed that the length LBh from the drawing start point ST to the midpoint CC and the length LBh from the midpoint CC to the drawing end point SE are the same and LBh = LBL / 2.

When the drawing line SL1 is rotated by the angle θ ss from the initial state, the drawing line SL1a is inclined with respect to the Yt axis. The drawing start point STa of the drawing line SL1a after the adjustment is shifted from the initial drawing start point ST by (ΔXSa, ΔYSa), and the drawing end point SEa of the drawing line SL1a after the adjustment is The position shifts from the initial drawing end point SE by (ΔXEa, ΔYEa). This position shift becomes a joint error with the pattern drawn by the drawing line SL2 of the neighboring beam scanning apparatus MD2. For example, when the drawing line SL2 of the neighboring beam scanning apparatus MD2 is located in the + Yt direction side with respect to the drawing line SL1a, and it is necessary to perform joint exposure at the initial drawing start point ST, It is necessary to slightly shift the drawing start point STa of the drawing line SL1a after the adjustment in the direction of the arrow Ar. Such a shift as the arrow Ar can be realized by slightly speeding up the timing of writing the writing data after the time Tpx from the generation of the origin signal SH described in FIG. 9.

Here, the positional shift amount ΔYSa is LBh · (1-cos (θss)), and when the shift amount (length) along the arrow Ar is ΔAr, the positional shift amount ΔYSa and the shift amount ΔAr are ΔYSa = ΔAr · cos (θss), the shift amount ΔAr is expressed as follows.

ΔAr = [LBh · (1-cos (θss))] / cos (θss) … (One)

For example, when the length LBL is 50 mm (LBh = 25 mm), the shift amount ΔAr when the angle θ ss is ± 0.5 ° is about 0.95 μm, and the shift amount ΔAr when the angle θ ss is ± 1.0 ° The shift amount? Ar when the angle? Accordingly, the shift amount ΔAr is calculated according to the adjusted angle θ ss, and the time Tpx described in FIG. 9 is shortened and drawn by the time ΔT px (= ΔAr / scanning speed Vss of the spot light SP) corresponding to the shift amount ΔAr. The writing of data may be started.

In addition, when the drawing line SL2 of the neighboring beam scanning apparatus MD2 is located in the -Yt direction side with respect to the drawing line SL1a, and it is necessary to perform a negative exposure at the initial drawing end point SE after adjustment, It is necessary to slightly shift the drawing end point SEa of the drawing line SL1a in the direction of the arrow Af. Also in this case, the shift amount ΔAf in the direction of the arrow Af is the same as in the previous equation (1).

ΔAf = [LBh · (1-cos (θss))] / cos (θss) … (2)

Obtained by As shown in FIG. 21, when the midpoint CC (Le1) is precisely set at the rotation center of the beam scanning device MD1, the absolute values of the shift amount ΔAr and the shift amount ΔAf are the same. Since the direction of the shift amount ΔAf is the same as the scanning direction of the spot light SP on the drawing line SL1a, in this case, the time ΔTpx (= ΔAr / spot light () corresponding to the shift amount ΔAf according to the adjusted angle θ ss is used. The writing of writing data may be started by lengthening the time Tpx described in FIG. 9 by the scanning speed Vss) of SP).

In addition, the drawing start point STa of the drawing line SL1a after being adjusted by the angle θss is displaced by ΔXSa in the -Xt direction with respect to the initial drawing start point ST, and the drawing end point SEa is the initial position. The position shifts in the + Xt direction with respect to the drawing end point SE by ΔXEa. This position shift error ΔXSa, ΔXEa in the Xt direction (sub-scan direction) is offset of the error ΔXSa or ΔXEa with respect to the measured value (output value of the counter) of the encoder EC for measuring the rotation angle position of the rotating drum DR. It can correct | amend by starting drawing of each drawing line SLn in response to the value which added up. For such fine correction, the measurement resolution (the amount of movement of the substrate FS per count of the counter circuit) of the rotation angle position of the rotary drum DR by the encoder EC (and the scale part SD) is a spot light. It is set to 1/2 or less, preferably 1/10 or less of the size phi of (SP).

In the explanation by FIG. 21 above, the irradiation center when the drawing line SL1 of the beam scanning device MD1 parallel to the Yt axis in the initial state is rotated counterclockwise in the XtYt plane (irradiated surface) by an angle θss. The axis Le1 is set to pass through the midpoint CC, and the drawing line SL1 (that is, the beam scanning device MD1) is set to rotate (tilt) θzt about the irradiation center axis Le1. I did it. However, the mounting error of the cylindrical post member BX1, the annular bearing 48, etc. which determine the mechanical rotation center axis of the beam scanning apparatus MD1 (henceforth "Mrp"), or the beam LB1 ), The center of gravity CC (irradiation center axis Le1) of the drawing line SL1 and the mechanical rotation center axis Mrp of the beam scanning device MD1 due to an error in the incident position of the beam scanning device MD1. If there is a two-dimensional misalignment error ΔA in the XtYt plane with (Ax, ΔAy), the influence of the misalignment error ΔA causes the error (ΔXSa, ΔYSa) and error (ΔXEa, ΔYEa) in FIG. Is added.

The state will be described with reference to FIG. 22. FIG. 22 shows the mechanical rotation center axis (first rotation center axis) Mrp of the beam scanning device MD1 and the center point CC of the drawing line SL1 (irradiation center axis It is a figure which exaggerates the state in the case where Le1)) has comparatively the position shift error (DELTA) A ((DELTA) Ax, (DELTA) Ay). In this case, the incident axis of the beam LB1 incident on the beam scanning device MD1 is coaxial with the rotational center axis Mrp. In FIG. 22, the description of symbols and symbols described in FIG. 21 will be omitted. As illustrated in FIG. 22, the drawing line SL1 parallel to the Yt axis in the initial state before adjustment is centered on the rotation center axis Mrp shifted by the error ΔAx and ΔAy from the position of the midpoint CC (Le1). , The writing line SL1b is inclined by the angle θ ss. The drawing line SL1b causes the drawing line SL1a shown in FIG. 21 to be moved in parallel in the XtYt plane under the influence of the errors ΔAx and ΔAy. Therefore, the drawing start point STb of the drawing line SL1b after adjustment shifts with respect to the drawing start point STa in the state of FIG. 21 by the error ΔXcc in the -Xt direction and the error ΔYcc in the + Yt direction. Similarly, the drawing end point SEb of the drawing line SL1b after adjustment shifts by the error ΔXcc in the -Xt direction and the error ΔYcc in the + Yt direction with respect to the drawing end point SEa in the state of FIG. 21, and the drawing line after the adjustment ( The midpoint CC '(Le1') of SL1b is also shifted by the error ΔXcc in the -Xt direction and the error ΔYcc in the + Yt direction with respect to the midpoint CC (Le1) of the drawing line SL1 in the state shown in FIG.

Therefore, the drawing start point STb of the drawing line SL1b after adjustment shifts | deviates by (ΔXSa + ΔXcc) in the Xt direction and (ΔYSa-ΔYcc) in the Yt direction with respect to the initial drawing start point ST, and is adjusted. The drawing end point SEb of the following drawing line SL1b is displaced with respect to the initial drawing end point SE by (ΔXEa-ΔXcc) in the Xt direction and (ΔYEa + ΔYcc) in the Yt direction. The error components ΔXcc and ΔYcc due to the position shift of the errors ΔAx and ΔAy between the center of rotation axis Mrp and the initial drawing line SL1 of the initial drawing line SL1 are the initial drawing lines ( When the midpoint CC of SL1) is set to the origin (0, 0), it is expressed as follows.

ΔXcc = -ΔAysin (θss) + ΔAx (1-cos (θss)) … (3)

ΔYcc = ΔAy (1-cos (θss)) + ΔAxsin (θss) … (4)

As shown in FIG. 22, the incident axis of the beam LB1 and the rotational center axis Mrp coincide with each other, and the center point CC (Le1) of the rotational center axis Mrp and the drawing line SL1 is in the XtYt plane. In the case of shifting by the error ΔAx and ΔAy, as described above with reference to FIG. 21, the shift amounts ΔAr and ΔAf of the drawing line SL1b are calculated and the time described in FIG. 9 by the corresponding time ΔTpx. The timing of writing out the pattern data (drawing data) may be corrected by shortening or extending Tpx. However, the length LBL (for example, 50 mm) from the drawing start point STb of the drawing line SL1b after adjustment to the drawing end point SEb is the maximum scanning length (for example, 51 mm) of the spot light SP. It is necessary to be in the range of). Also in the sub-scan direction (Xt direction), the error (ΔXSa + ΔXcc) or (ΔXEa-ΔXcc) of the measured value (output value of the counter) of the encoder EC that measures the rotation angle position of the rotary drum DR. It can correct | amend by starting drawing of each drawing line SLn in response to the value which added the offset. In addition, although the form in which the irradiation center axis Le1 passes the midpoint CC of the drawing line SLn was demonstrated as an example in FIG. 21, FIG. 22, the irradiation center axis Le1 like the previous modified example 5 was demonstrated. It may pass through arbitrary points on this drawing line SLn. Even in this case, the calculation principles of the shift amounts ΔAr and ΔAf of the drawing line SLn are the same.

By the way, for example, when the position in the XtYz plane of the beam LB1 incident on the beam scanning device MD1 is delayed in the Yt direction as in the modification 5 (FIGS. 18A and 18B), the beam scanning is performed. When the mechanical rotational center axis Mrp and the irradiation center axis Le1 of the device MD1 are set at a position coinciding with or at a position very close to the drawing start point ST of the drawing line SL1, the drawing line ( Even when SL1) is tilted at an angle θ ss, the drawing start point STb after adjustment is hardly changed from the position of the initial drawing start point ST. Therefore, when the drawing start point STb after adjustment is connected with the neighboring drawing line, the position adjustment (adjustment of the time Tpx demonstrated in FIG. 9) regarding the scanning direction of the spot light SP of the drawing line SL1b is unnecessary. You can also

In addition, the mechanical rotation center axis Mrp and the irradiation center axis Le1 of the beam scanning device MD1 are preferably coaxial within a predetermined allowable range ΔQ (ΔBx, ΔBy) in the XtYt plane. The allowable range ΔQ is, for example, when the beam scanning device MD1 is tilted mechanically by a predetermined angle θsm, the drawing start point STb (or the drawing end point SEb) of the drawing line SL1b after adjustment. Drawing start point STb of drawing line SL1b when tilting beam scanning device MD1 by the angle θsm when the actual position (actual position Apo) and the allowable range ΔQ are assumed to be zero. The difference amount with the design position (design position Dpo) of (or drawing end point SEb) is a spot regarding the scanning direction (arrow Ar or Af in FIG. 21) or Yt direction of spot light SP, for example, It is set to be within the size phi of the light SP. Here, the predetermined angle θsm can be set to an upper limit angle (eg, ± 2 °) in which the beam scanning device MD1 can be mechanically rotated. Each light shown in FIG. 5 in order to make the irradiation center axis Le (Le1-Le6) and the rotation center axis Mrp of each beam scanning apparatus MD (MD1-MD6) coaxially within predetermined | prescribed permissible range (DELTA) Q. It may be provided in at least one of the image shift optical member SR and the deflection adjustment optical member DP shown in FIG. 7 between the reflection mirrors M1 to M5 of the introduction optical systems BDU (BDU1 to BDU6). In addition, the central axis of the support member BX1 is set to be coaxial with the rotation center axis Mrp or coaxial with the rotation center axis Mrp and the irradiation center axis Le in a predetermined allowable range ΔQ.

The beam LB is incident on the beam scanning device MD so that the incident axis of the beam LB incident on the beam scanning device MD coincides with the rotation center axis Mrp. The incident axis and the rotation center axis Mrp of the beam LB incident on the beam may be coaxial within a predetermined allowable range ΔQ. For example, even if the incident axis of the beam LB incident on the beam scanning device MD coincides with the irradiation center axis Le, it is coaxial with the rotation center axis Mrp within a predetermined allowable range ΔQ. good.

In addition, also in the phase rotation optical system IR in the modifications 2 and 3, the mechanical rotation center axis (second rotation center axis) of the phase rotation optical system IR is similar to the irradiation center axis Le and the predetermined allowable range ΔQ. It should be coaxial within. In this case, the incident axis of the beam LB passing through the midpoint of the scanning trajectory of the beam LB incident on the image rotation optical system IR from the fθ lens FT, and the mechanical rotation center axis of the image rotation optical system IR It is set to be coaxial within a predetermined allowable range ΔQ.

Although the light source device 14 is not mounted in the beam scanning apparatus MD which can be rotated with respect to the exposure apparatus main body in the structure of embodiment and each modified example demonstrated above, it is a conventional apparatus (Japanese Patent Laid-Open No. 08-011348). As shown in the publication, small solid light sources such as semiconductor laser diodes and LEDs are provided in the beam scanning device MD (for example, the support frame 40), and the solid state light sources are pulsed based on the drawing data. You can control it. In that case, the drawing optical element AOM shown in FIG. 5, FIG. 6 becomes unnecessary.

In addition, in each said embodiment and each modified example, intensity modulation (on / off) of the spot light SP based on drawing data is carried out in the light introduction optical system (BDU (BDU1-BDU6) in FIG. 5), for example. Although it is performed with the drawing optical element AOM (AOM1-AOM6) provided, when using the light source device 14 as a fiber amplifier laser light source, the seed light (pulse) of the infrared wavelength range before entering a fiber amplifier (pulse) Modulating the intensity of light into a burst wave shape based on the drawing data, thereby modulating the pulse beam of ultraviolet light output from the light source device 14 into a burst wave shape according to the drawing data. It's okay to let it go. In that case, the drawing optical element AOM provided in the light introduction optical system BDU is an optical element for selecting whether or not to guide the beam LB from the light source device 14 to the beam scanning device MD (switching element). (AOM)). For this purpose, it is necessary to synchronize the rotation speed of each polygon mirror PM of the beam scanning apparatus MD, and to synchronize the phase of the rotation angle so that a predetermined relationship may be maintained. In addition, the beam LB from the light source device 14 provides a beam transmission system (mirror, etc.) that sequentially passes through each switching element AOM of the beam scanning device MD, In response to the origin signal SH of the polygon mirror PM, one of the respective switching elements AOM is sequentially turned on for one scanning period of the spot light SP on the drawing line SLn. It is good to set it as synchronous control.

Moreover, in the exposure apparatus EX of the said embodiment and each modified example, the drawing exposure of the spot light SP by the beam scanning apparatus MD with respect to the board | substrate FS curvedly supported by the rotating drum DR. Although the surface of the substrate FS is supported in a planar shape, the writing exposure of the spot light SP may be performed. That is, the beam scanning apparatus MD may perform drawing exposure of the spot light SP with respect to the board | substrate FS supported by planar shape. The mechanism which supports this board | substrate FS in planar shape can use what is disclosed by the international publication 2013/150677 pamphlet. In brief, by the plurality of rollers on which the annular belt is wound, the annular belt is defined to have a planar shape in the region supporting the substrate FS. And in the area | region which becomes the planar shape of an annular belt, the board | substrate FS conveyed is closely attached to and supported by an annular belt. Since the annular belt is conveyed in a ring in a predetermined direction, the annular belt can convey the substrate FS supported in the conveying direction of the substrate FS.

(2nd embodiment)

FIG. 23: shows the structure of the beam scanning apparatus MD 'which concerns on 2nd Embodiment, and the beam scanning apparatus MD' of FIG. 23 is the beam scanning apparatus shown in FIG. 5, FIG. It is a structure which can be substituted by each of MDn (MD1-MD6). About the member which comprises the beam scanning apparatus MD 'of FIG. 23, the same code | symbol is attached | subjected to the same thing as the member of the previous beam scanning apparatus MDn, and the detailed description is abbreviate | omitted. The beam scanning device MD 'according to the second embodiment of the present invention is an optical element for drawing AOMn (AOM1 to AOM6) in a light introduction optical system (also referred to as a' beam distribution optical system ') (BDUn (BDU1 to BDU6)). Next, the light beams LBn (LB1 to LB6) transmitted to the single-mode optical fiber SMF that enters the beams LBn (LB1 to LB6) to be collected are configured to be introduced.

The exit end Pbo of the optical fiber SMF is fixed in the + Zt direction of the reflection mirror M10 of the beam scanning device MDn, and the beam LB1 converged at the exit end Pbo has a predetermined numerical aperture ( The light is reflected by the reflection mirror M10 and diverges to the condensing lens Be1 and the collimating lens Be2 constituting the beam expander BE. The beam LB1 is focused at the condensing position Pb1 between the condensing lens Be1 and the collimating lens Be2, and then becomes a beam LB1 that diverges again, and enters and collides with the collimating lens Be2. Converted to the speed of light. The beam LB1 emitted from the collimated lens Be2 has the reflection mirror M12, the image shift optical member SR, the deflection adjustment optical member DP, and the field aperture FA, similarly to FIG. 7. , Reflective mirror M13, λ / 4 wave plate QW, cylindrical lens CYa, reflective mirror M14, polygon mirror PM, fθ lens FT, reflective mirror M15, and cylinder The light is collected as spot light SP on the substrate FS via the radical lens CYb. The surface (surface of the board | substrate FS) in which the spot light SP is formed has an optically conjugate relationship with the condensing position Pb1 and the exit end Pbo. In addition, in FIG. 23, the mirror M11, polarizing beam splitter BS1, lens system G10, and photodetector DT1 which were shown in FIG. 7 are abbreviate | omitted.

Also in the second embodiment, the beam scanning device MD 'is axially supported by the support member BX1 so as to be rotatable in a predetermined angle range about the irradiation center axis Le1 as a whole, but the optical fiber SMF Can be fixed to any position deviated from the irradiation central axis Le1. When pattern drawing by scanning a beam in the ultraviolet wavelength range at high speed, it is necessary to considerably increase the energy (illuminance per unit area of the spot light) of the beam, depending on the sensitivity of the photosensitive functional layer on the substrate FS. Therefore, in the optical transmission using the single mode optical fiber SMF as shown in Fig. 23, the optical fiber may not be resistant to ultraviolet rays. However, when the photosensitive functional layer has sensitivity to light having a wavelength longer than the ultraviolet wavelength range, for example, a wavelength in the range of 500 nm to 700 nm, as shown in FIG. Light transmission becomes possible.

The incidence end, not shown, of the optical fiber SMF of FIG. 23 is disposed after the branching mirror M1 after the optical element AOMn for drawing in the light introducing optical system BDUn shown in FIG. 5 above. Specifically, the drawing beam LBn reflected by the mirror M1 is converted into a beam condensed by a condenser lens at a predetermined NA (the number of openings), and at the condensing point (beam waist position). The incident end of the optical fiber SMF may be fixed.

Claims (21)

A pattern drawing apparatus which repeatedly scans a drawing beam projected onto an object to be irradiated by rotation of a rotating polyhedron to draw a predetermined pattern on the object to be irradiated.
An origin detecting unit for generating an origin signal when detecting that a second reflecting surface different from the first reflecting surface reflecting the drawing beam among the plurality of reflecting surfaces of the rotating polygon mirror is at a predetermined angle position;
On the basis of a predetermined time determined by the rotational speed of the rotating polygon mirror until the second reflecting surface becomes the first reflecting surface after the origin signal is generated, at a predetermined delayed timing from the generation of the origin signal. A pattern drawing device, comprising a control device for instructing drawing start by the drawing beam. The method according to claim 1,
The origin detection unit,
A beam transmission system for projecting a beam different from the drawing beam toward the second reflection surface;
And a beam light receiving system that receives the reflected beam at the second reflecting surface at a predetermined position and generates the origin signal when the second reflecting surface is at a predetermined angle position. The method according to claim 2,
The said 2nd reflective surface is a pattern drawing apparatus set in the neighborhood of the said 1st reflective surface with respect to the rotation direction of the said rotating polygon mirror. The method according to claim 2,
And the second reflecting surface is set in front of the first reflecting surface by n planes (n is an integer of 1 or more) with respect to the rotational direction of the rotating polygon mirror. The method according to any one of claims 1 to 3,
The control device,
And the second reflecting surface detected by the origin detecting unit serves as the first reflecting surface to rotate the rotating multifaceted mirror in a direction reflecting the drawing beam. The method according to claim 5,
When the reflection surface number of the rotating polygon mirror is Np and the rotational speed per minute of the rotating polygon mirror is Vp [rpm], the predetermined time is set based on 60 / (Np × Vp) [sec]. . The method according to any one of claims 2 to 4,
The wavelength of the drawing beam is set to an ultraviolet wavelength range in which the photosensitive layer formed on the irradiated object is exposed to light,
The beam transmission system includes a light source unit for emitting a beam of a non-photosensitive wavelength range to the light sensitive layer,
The beam receiving system includes a lens system for collecting the reflected beam reflected from the second reflecting surface as spot light, and a photoelectric conversion element for receiving the focused spot light and outputting the origin signal. . The method according to any one of claims 1 to 4,
The spot light is incident on the irradiated object over a predetermined range in the main scanning direction by the rotation of the rotating polygonal mirror while injecting the drawing beam reflected by the rotating polygon mirror and condensing it as spot light on the irradiated object. Telecentric scanning lens for scanning at speed,
And a light source device for pulse oscillating the drawing beam at a frequency at which the spot light overlaps in the main scanning direction at intervals smaller than the effective dimension of the spot light on the irradiated object. The method according to claim 8,
The light source device is a pattern drawing device which is a fiber amplifier laser light source that emits pulsed light of high intensity ultraviolet light at a frequency of several hundred MHz. In the pattern drawing method which repeats scanning of the drawing beam projected on a to-be-tested object by rotation of a rotating polyhedron, and drawing a predetermined pattern on the said to-be-tested object,
Projects a beam different from the drawing beam toward the second reflecting surface which is different from the first reflecting surface reflecting the drawing beam among the plurality of reflecting surfaces of the rotating multifaceted mirror, and reflects from the second reflecting surface Receiving a beam at a light receiving portion arranged at a predetermined position, thereby generating an origin signal indicating that the second reflective surface is at a predetermined angle position;
On the basis of a predetermined time determined by the rotational speed of the rotating polygon mirror after the origin signal is generated until the second reflection surface becomes the first reflection surface, at a predetermined delayed timing from the generation of the origin signal. A pattern drawing method comprising instructing drawing start by the drawing beam. The method according to claim 10,
The said 2nd reflective surface is a pattern drawing method set as the neighborhood of the said 1st reflective surface regarding the rotation direction of the said rotating polygon mirror. The method according to claim 10,
And the second reflecting surface is set in front of the first reflecting surface by n planes (n is an integer of 1 or more) with respect to the rotational direction of the rotating polygon mirror. The method according to claim 10,
And the second reflecting surface used to generate the origin signal becomes the first reflecting surface, and rotates the rotating polygon mirror in a direction reflecting the drawing beam. The method according to any one of claims 10 to 13,
The pattern is set based on the value of 60 / (Np × Vp) [sec] when the number of reflection surfaces of the rotating polygon mirror is Np and the number of revolutions per minute of the rotating polygon mirror is Vp [rpm]. Drawing method. The method according to any one of claims 10 to 13,
The drawing beam is set to ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less in order to expose the photosensitive layer formed on the irradiated object,
And a beam projected onto the second reflecting surface of the rotating polygon mirror is set to a beam of a non-photosensitive wavelength range with respect to the light sensitive layer. The method according to any one of claims 10 to 13,
The drawing beam reflected by the rotating polygon mirror is condensed as spot light on the projected object by a telecentric scanning lens, and over a predetermined range in the main scanning direction on the projected object by the rotation of the rotating polygon mirror. Is injected at a predetermined rate,
And the drawing beam is emitted from a pulse laser light source which pulses at a frequency overlapping the spot light in the main scanning direction at intervals smaller than the effective dimension of the spot light. A pattern drawing apparatus which repeatedly scans a drawing beam projected onto an object to be irradiated by rotation of a rotating polyhedron to draw a predetermined pattern on the object to be irradiated.
A light source device for intensity-modulating the laser light in the ultraviolet wavelength range based on the drawing data corresponding to the pattern, and emitting the same as the drawing beam;
A plurality of mirrors for reflecting the drawing beam from the light source device toward a first reflecting surface that becomes a predetermined angle range among a plurality of reflecting surfaces of the rotating polygon mirror;
The spot beam is incident on the drawing beam reflected from the first reflecting surface of the rotating polygon mirror, and the drawing beam is focused on the irradiated object as spot light, and the spot light is rotated according to the rotation of the rotating polygon mirror. A telecentric scan lens for scanning at a predetermined speed over a predetermined range in the main scanning direction on the image,
The second reflecting surface which differs from the said 1st reflecting surface among the some reflection surfaces of the said rotating polygon mirror, and is located in front of the said 1st reflective surface by n planes (n is an integer of 1 or more) with respect to the rotation direction of the said rotating polygon mirror. A home position detector which generates a home position signal in a pulse state when it reaches this specific angle position,
With respect to the light source device, the drawing of the laser light based on the drawing data is performed so that the drawing of the pattern starts at a timing when a predetermined delay time set according to the rotational speed of the rotating polygon mirror has elapsed from the time of the origin signal generation. A pattern drawing device comprising a control device for instructing the start of intensity modulation. The method according to claim 17,
The origin detection unit,
A beam transmission system that projects a beam different from the drawing beam toward the second reflection surface, and a reflection beam at the second reflection surface is received at a predetermined position, and the second reflection surface is the specific angle; And a beam receiving system which generates the origin signal when it is in position. The method according to claim 18,
The light source device,
A pulsed laser light source that is set to a wavelength range of ultraviolet light that exposes the photosensitive layer formed on the irradiated object and emits pulsed light that emits light at a frequency of several hundred MHz as an intensity modulated based on the drawing data and emits it as the drawing beam. ,
And a wavelength of the beam projected from the beam transmitting system onto the second reflecting surface of the rotating polygon mirror is set to a non-photosensitive wavelength range with respect to the light sensitive layer. The method according to any one of claims 17 to 19,
And the second reflecting surface is set to a neighborhood of the first reflecting surface with respect to the rotational direction of the rotating polygon mirror. The method according to claim 18 or 19,
The beam receiver is,
A photoelectric conversion that receives the reflected beam reflected from the second reflecting surface of the rotating polygon mirror and collects spot light and spot light of the reflected beam collected by the lens system to output the origin signal Take the device,
And the lens system is set so that the second reflective surface of the rotating polygon mirror becomes the position of the focal point of the lens system.

Images