JP6547879B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus and a device manufacturing method.

  As a substrate processing apparatus, an apparatus is known which continuously draws a predetermined position on the surface of a substrate while conveying a sheet-like medium (substrate) with a cylindrical drum (see, for example, Patent Document 1).

JP 2007-72171 A

  It is necessary to align, ie, align, the drawing pattern drawn on the surface of the substrate and the substrate P relative to each other. Therefore, a reference pattern present on the surface of the substrate is read by a reader or the like, and alignment is performed using the result. In Patent Document 1, it is unclear at which timing the reference pattern is read and alignment is performed.

  An aspect of the present invention is to provide an exposure apparatus capable of drawing while performing alignment when performing drawing continuously on a sheet-like medium (substrate) during conveyance, and a device manufacturing method. .

  According to a first aspect of the present invention, there is provided a rotating drum which rotates around a predetermined central axis and supports an elongated photosensitive substrate along an outer peripheral surface of a constant radius from the central axis. An exposure apparatus for drawing a pattern on the substrate transported in a long direction by rotation of the rotary drum, wherein the rotary drum has a predetermined length in the direction of the central axis and the circumferential direction of the outer peripheral surface. By scanning the beam for drawing the pattern in the direction of the central axis in the exposure area set on the substrate supported by the outer peripheral surface, the length in the longitudinal direction is longer than the exposure area A drawing apparatus for sequentially drawing the pattern on a processing area on the substrate set to a long length, and a plurality of a plurality of processing apparatuses formed along with the processing area on the substrate at regular intervals along the longitudinal direction Each mark on the substrate is The mark detection unit provided around the rotary drum and the detection regions of the mark detection unit are sequentially detected so as to sequentially detect the detection region set on the upstream side of the exposure region with respect to the feed direction. And a controller configured to control the drawing apparatus based on position information on a mark and a transport distance or transport time of the substrate from the detection area to the exposure area, the control section on the substrate When the first position information regarding the mark attached to the leading part in the longitudinal direction of the processing area among the plurality of marks provided in association with the processing area is detected by the mark detection unit, The drawing position of the leading part of the processing area is specified, and the second position information regarding the mark attached to the trailing part in the longitudinal direction of the processing area is subsequently detected When detected by the section, the specifying by interpolating the drawing position of the subsequent portion of the processing region in the first positional information, the exposure apparatus is provided.

  According to a second aspect of the present invention, there is provided a device manufacturing method for forming a pattern of a device on a long photosensitive substrate, which comprises a photoresist layer for photolithography, a hydrophilic layer on the surface of the substrate. Forming either a photosensitive silane coupling material for forming an aqueous pattern or a photosensitive catalyst layer for forming a metal film pattern by a plating method as a photosensitive layer; Exposing the photosensitive layer of the substrate to the pattern of the device using the exposure apparatus described in the aspect of 1. a device manufacturing method.

  According to an aspect of the present invention, there is provided a substrate processing apparatus, a device manufacturing method, and a substrate processing method capable of drawing while performing alignment when drawing continuously on a sheet-like medium (substrate) being conveyed. can do.

FIG. 1 is a view showing an entire configuration of an exposure apparatus (substrate processing apparatus) of the present embodiment. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a view showing the configuration of the rotary drum and the drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus of FIG. FIG. 7 is a view showing the arrangement of a plurality of scanners of the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement of the alignment microscope, the drawing line and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG. FIG. 10 is a view showing, in an XZ plane, a region to be processed in the longitudinal direction of the substrate and a region in which alignment in the longitudinal direction of the substrate is possible. FIG. 11 is a plan view showing a region to be processed in the longitudinal direction of the substrate and a region where alignment can be performed in the longitudinal direction of the substrate. FIG. 12 is a plan view showing the alignable area and the non-alignment area in the process area of the substrate. FIG. 13 is a view showing the relationship between the ratio of the error of the end on the downstream side in the transport direction to the error of the end on the transport direction side of the processing area, and the alignable area in the longitudinal direction of the substrate. FIG. 14 is a view showing an exposure apparatus according to a first modification. FIG. 15 is a plan view showing a region which can be aligned in the longitudinal direction of the substrate supported by the upstream cylindrical member provided on the upstream side of the transport direction of the substrate shown in FIG. FIG. 16 is a diagram for explaining the continuous alignment according to the second modification. FIG. 17 is a diagram showing an example of linear interpolation. FIG. 18 is a diagram showing an example of linear interpolation. FIG. 19 is a diagram for explaining another example of the continuous alignment according to the second modification. FIG. 20 is a diagram for explaining another example of the continuous alignment according to the second modification. FIG. 21 is a diagram for explaining another example of the continuous alignment according to the second modification. FIG. 22 is a flowchart showing the device manufacturing method of the present embodiment.

  A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a view showing an entire configuration of an exposure apparatus (substrate processing apparatus) of the present embodiment. The substrate processing apparatus of the present embodiment is an exposure apparatus EX that subjects a substrate P to exposure processing. The exposure apparatus EX is incorporated in a device manufacturing system 1 that manufactures devices by performing various types of processing on a substrate P after exposure. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. As a flexible display, there is an organic EL display, for example. In the device manufacturing system 1, a substrate P is fed from a supply roll (not shown) in which a long sheet-like substrate P having flexibility is wound in a roll, and the substrate P is fed. After performing various processes continuously, the so-called roll-to-roll system is used, in which the processed substrate P is wound around a recovery roll (not shown) as a flexible device. In the device manufacturing system 1 shown in FIG. 1, the substrate P which is a film-like sheet is fed from the supply roll, and the substrate P fed from the supply roll is sequentially processed by the process device U1, the exposure device EX, and the process device U2. In the example, the film is taken up by a recovery roll.

  The substrate P to be processed by the device manufacturing system 1 will be described. As the substrate P, for example, a flexible resin film having a thickness of about 20 μm to 200 μm, a foil made of metal or alloy such as plastic or stainless steel, or the like is used. The material of the resin film is, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polycarbonate resin, polystyrene resin and vinyl acetate resin. It contains at least one.

  For example, it is desirable to select a substrate P whose thermal expansion coefficient is not significantly large so that the amount of deformation due to heat received in various processes applied to the substrate P can be substantially ignored. The thermal expansion coefficient may be set smaller than the threshold according to the process temperature or the like, for example, by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass with a thickness of about 100 μm manufactured by the float method or the like, or a laminate obtained by bonding the above-mentioned resin film, foil or the like to this ultrathin glass. It may be

  The substrate P becomes a supply roll by being wound in a roll. The supply roll is attached to the device manufacturing system 1. The device manufacturing system 1 mounted with the supply roll repeatedly executes various processes for manufacturing the device on the substrate P delivered from the supply roll. For this reason, the processed substrate P is in a state in which a plurality of devices are connected. That is, the substrate P delivered from the supply roll is a substrate for multiple chamfering. The substrate P may be one in which the surface has been modified and activated in advance by a predetermined pretreatment, or a substrate in which a fine partition structure (concave and convex structure) for precise patterning is formed on the surface.

  The processed substrate P is wound into a roll and is recovered as a recovery roll. The recovery roll is mounted on a dicing apparatus (not shown). The dicing apparatus on which the recovery roll is mounted divides the processed substrate P into devices by dividing it into devices (dicing). The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (the direction in which the length is short) and 10 m or more in the length direction (the direction in which the length is long). In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process device U1, an exposure device EX, and a process device U2. In FIG. 1, it is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is a direction from the process apparatus U1 to the process apparatus U2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

  The process apparatus U1 performs a process (preprocess) of the previous process on the substrate P to be exposed by the exposure apparatus EX. The process apparatus U1 sends the pre-processed substrate P toward the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is, for example, a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

  The photosensitive functional layer is, for example, applied as a solution on the substrate P and dried to form a layer (film). A typical photosensitive functional layer is a photoresist, but as a material that does not require development processing, a photosensitive silane coupling material (SAM) in which the lyophobic property of the portion irradiated with ultraviolet light is modified Alternatively, there is a photosensitive reducing material or the like in which a plating reducing group (amine) is exposed at a portion irradiated with ultraviolet light. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion of the surface of the substrate P exposed to ultraviolet light is modified from lyophobic to lyophilic, thus becoming lyophilic A conductive ink (ink containing conductive nanoparticles such as silver or copper) is selectively applied to the surface of the portion to form a pattern layer. In the case of using a photosensitive reducing material as the photosensitive functional layer, the plating reduction group is exposed to the pattern portion exposed to ultraviolet light on the surface of the substrate, so that the substrate P is immediately exposed to a plating solution containing palladium ions after exposure. By immersion for a fixed time, a pattern layer of palladium is formed (deposited).

  The exposure apparatus EX draws a pattern such as a circuit or wiring for display as an example on the substrate P supplied from the process apparatus U1. Although the details will be described later, the exposure apparatus EX exposes the substrate P with a plurality of drawing lines obtained by scanning each of the plurality of drawing beams LB in a predetermined scanning direction. The process device U2 performs post-processing (post-processing) on the substrate P exposed by the exposure device EX. The process apparatus U2 sends the substrate P on which the exposure processing has been performed by the exposure apparatus EX. The process apparatus U2 forms a pattern layer of a device on the surface of the substrate P by performing predetermined processing (wet processing such as development, ink application, or plating) on the substrate P on which the exposure processing has been performed. Subsequently, the exposure apparatus EX will be described.

<Exposure system (substrate processing system)>
FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a view showing the configuration of the rotary drum and the drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus of FIG. FIG. 7 is a view showing the arrangement of a plurality of scanners of the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement of the alignment microscope, the drawing line and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG.

  As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a so-called raster scan type drawing exposure apparatus, which scans the spot light of the drawing beam LB in a predetermined direction while transporting the substrate P in the transport direction. By scanning in the direction, a predetermined pattern is formed on the surface of the substrate P. As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11 as a processing unit, a substrate transport mechanism 12, alignment microscopes AM1 and AM2 as a reference pattern detection unit, and a control device 16 as a control unit. ing. The drawing device 11 draws a predetermined pattern on a part of the substrate P transferred by the substrate transfer mechanism 12 by the plurality of drawing modules UW1 to UW5. The substrate transfer mechanism 12 transfers the substrate P transferred from the process apparatus U1 of the previous process to the process apparatus U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect an alignment mark or the like as a reference pattern formed in advance on the substrate P in order to relatively align the drawing pattern drawn on the surface of the substrate P with the substrate P. Do. The control device 16 controls each part of the exposure apparatus EX to cause each part to execute processing. The controller 16 may be part or all of a higher-level controller that controls the device manufacturing system 1. Further, the control device 16 may be a device different from the upper control device controlled by the upper control device. The controller 16 includes, for example, a computer.

  The exposure apparatus EX includes an apparatus frame 13 (see FIG. 2) for supporting the drawing apparatus 11 and the substrate transfer mechanism 12, and a rotational position detection mechanism (see FIGS. 4 and 8). Furthermore, inside the exposure apparatus EX, a light source device CNT that emits a laser beam (pulse light) as the drawing beam LB is provided. The exposure device EX guides the drawing beam LB emitted from the light source device CNT by the drawing device 11 and projects the drawing beam LB onto the substrate P conveyed by the substrate conveyance mechanism 12.

  The exposure apparatus EX shown in FIG. 1 is stored in the temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface E of a manufacturing plant or the like via the passive or active vibration isolation units SU1 and SU2. The vibration isolation units SU1 and SU2 are provided on the installation surface E, and reduce vibration from the installation surface E. By keeping the temperature control chamber EVC at a predetermined temperature, the temperature change of the substrate P transferred inside is suppressed. Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described.

  The substrate transport mechanism 12 sequentially includes an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary drum DR as a cylindrical member, a tension adjustment roller RT2, a drive roller DR6, and a drive roller from the upstream side in the transport direction of the substrate P. I have a DR7. The edge position controller EPC adjusts the position in the width direction (direction parallel to the Y axis) of the substrate P transported from the process device U1. The edge position controller EPC is a substrate such that the position at the end (edge) in the width direction of the substrate P sent from the process device U1 falls within a range of about ± 10s of μm to ± several tens of μm with respect to the target position. P is moved in the width direction to correct the position of the substrate P in the width direction.

  The driving roller DR4 rotates while pinching the front and back sides of the substrate P conveyed from the edge position controller EPC, and rotates the substrate P by feeding the substrate P downstream in the conveyance direction, that is, in the lengthwise direction of the substrate P. Transport toward the drum DR. The rotary drum DR rotates around the rotation center axis AX2 about the rotation center axis AX2 extending in the Y direction while supporting a portion of the surface of the substrate P to be subjected to pattern exposure in a cylindrical surface shape, Is transported in the longitudinal direction. In order to rotate such a rotating drum DR around the rotation center axis AX2, shaft portions Sf2 coaxial with the rotation center axis AX2 are provided on both sides of the rotation drum DR. A rotational torque from a drive source (a motor, a reduction gear mechanism, etc.) (not shown) is applied to the shaft portion Sf2. A plane that includes the rotation center axis AX2 and is parallel to the rotation center axis AX2 and extends in the Z direction is a center plane p3. The two sets of tension adjustment rollers RT1 and RT2 apply predetermined tension to the substrate P supported by being wound around the rotary drum DR. The two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P, and give the substrate P after exposure a predetermined slack (play) DL. The driving roller DR6 holds and rotates the upstream side of the substrate P to be conveyed, and the driving roller DR7 turns and holds the downstream side of the substrate P to be conveyed, thereby directing the substrate P to the process device U2. Transport. At this time, since the substrate P is given a slack DL, it can absorb fluctuations in the transport speed of the substrate P that occur downstream of the drive roller R6 in the transport direction, and pattern exposure on the substrate P due to fluctuations in transport speed. It is possible to suppress the accuracy degradation of

  The substrate transfer mechanism 12 adjusts the position of the substrate P transferred from the process device U1 in the width direction by the edge position controller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction has been adjusted to the tension adjustment roller RT1 by the drive roller DR4, and transports the substrate P which has passed the tension adjustment roller RT1 to the rotating drum DR. The substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjustment roller RT2 by rotating the rotary drum DR. The substrate transport mechanism 12 transports the substrate P transported to the tension adjustment roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process device U2 while applying the slack DL to the substrate P by the drive roller DR6 and the drive roller DR7.

  Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to FIG. FIG. 2 shows an orthogonal coordinate system in which the X, Y and Z directions are orthogonal, which is similar to the orthogonal coordinate system shown in FIG. The exposure apparatus EX includes an apparatus frame 13 for supporting the drawing apparatus 11 shown in FIG. 1 and the rotary drum DR of the substrate transfer mechanism 12. The apparatus frame 13 shown in FIG. 2 includes, in order from the lower side (vertical direction side) in the Z direction, a body frame 21, a three-point seat 22, a first optical surface plate 23, a rotation mechanism 24, and a second optical system. It has the plate 25 and. The main body frame 21 is installed on the installation surface E via the vibration isolation units SU1 and SU2. The main body frame 21 rotatably supports the rotary drum DR and the tension adjustment rollers RT1 (see FIG. 1) and RT2. The first optical surface plate 23 is provided on the upper side in the vertical direction of the rotary drum DR, and is installed on the main body frame 21 via the three-point seat 22. The three-point seat 22 supports the first optical surface plate 23 at three support points. The three-point seat 22 is adjustable in the Z direction at each support point. For this reason, the three-point seat 22 can adjust the inclination of the board surface of the first optical surface plate 23 with respect to the horizontal plane to a predetermined inclination. At the time of assembly of the device frame 13, the positions in the X direction and the Y direction can be adjusted in the XY plane between the main body frame 21 and the three-point seat 22. On the other hand, after the assembly of the device frame 13, the body frame 21 and the three-point seat 22 are in a fixed state, that is, a rigid state.

  The second optical surface plate 25 is provided on the upper side in the vertical direction of the first optical surface plate 23, and is installed on the first optical surface plate 23 via the rotation mechanism 24. The second optical surface plate 25 has its surface parallel to the surface of the first optical surface plate 23. A plurality of drawing modules UW1 to UW5 of the drawing apparatus 11 are installed on the second optical surface plate 25. The rotation mechanism 24 is mounted on the first optical surface plate 23 with a predetermined rotation axis I extending in the vertical direction as a center, with the surface of each of the first optical surface plate 23 and the second optical surface plate 25 kept in parallel. On the other hand, the second optical surface plate 25 is rotated. The rotation axis I extends in the vertical direction in the central plane p3 shown in FIG. 1 and is predetermined in the surface of the substrate P (a drawing surface curved along a circumferential surface) wound around the rotating drum DR. It passes through the position (see Figure 3). The rotating mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23 to adjust the positions of the plurality of drawing modules UW1 to 5 with respect to the substrate P wound around the rotating drum DR. it can.

  Subsequently, the light source device CNT will be described with reference to FIGS. 1 and 5. The light source device CNT is installed on the main body frame 21 of the device frame 13. The light source device CNT emits a laser beam as the drawing beam LB projected onto the substrate P. The light source device CNT is a light of a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P, and has a light source for emitting light in the ultraviolet range having a strong photoactive action. As a light source, for example, a third harmonic laser beam of YAG (wavelength: 355 nm) and a laser light source such as continuous oscillation or pulsed laser beam of about 50 to 100 MHz can be used. Alternatively, after amplifying short pulse light from a DFB (distributed feedback type) semiconductor laser device with an optical fiber amplifier, a laser light source is used which obtains short pulse light in an ultraviolet wavelength range by a wavelength conversion element (harmonic generation crystal etc.) it can.

  Next, the drawing apparatus 11 of the exposure apparatus EX will be described. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing modules UW1 to UW5. As shown in FIG. 1, this drawing apparatus 11 branches spotting beam LB emitted from the light source device CNT into a plurality of spots, and focuses spot beams created by branching the plurality of spotted drawing beams LB, as shown in FIG. As shown, scanning is performed along a plurality of (five in this embodiment, for example,) drawing lines LL1 to LL5 on the substrate P. Then, the drawing device 11 seams the patterns drawn on the substrate P by the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, the plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning the plurality of drawing beams LB by the drawing apparatus 11 will be described.

  As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR across the center plane p3. The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotational direction. On the substrate P on the downstream side in the rotational direction, the second drawing line LL2 and the fourth drawing line LL4 of even-numbered ones are arranged. The drawing lines LL1 to LL5 are formed along the width direction (Y direction) of the substrate P, that is, along the rotation center axis AX2 of the rotary drum DR, and are shorter than the length in the width direction of the substrate P. More strictly speaking, when each substrate P is transported at a reference speed by the substrate transport mechanism 12, each of the rendering lines LL1 to LL5 minimizes the splice error of the pattern obtained by the plurality of rendering lines LL1 to LL5. It is inclined by a predetermined angle with respect to the rotation center axis AX2 (Y axis in FIG. 3) of the rotary drum DR. The angle corresponds to the ratio of the feed velocity (sub-scanning velocity) in the longitudinal direction of the substrate P by the rotation of the rotary drum DR and the scanning velocity (main scanning velocity) of the spot light along the drawing lines LL1 to LL5. Is determined.

  The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the axial direction of the rotary drum DR. Further, the second drawing line LL2 and the fourth drawing line LL4 of even-numbered ones are arranged at predetermined intervals in the axial direction of the rotary drum DR. At this time, the second drawing line LL2 is disposed between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is disposed between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is disposed between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. The first drawing line LL1 to the fifth drawing line LL1 to LL5 are arranged to cover the entire width in the Y direction of the processing area A7 drawn on the substrate P.

  The scanning direction of the spot light of the drawing beam LB scanned along the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 is a one-dimensional direction, and is the same direction. ing. The scanning direction of the spot light of the drawing beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction, which is the same direction. At this time, the scanning direction of the spot light of the drawing beam LB scanned along the odd drawing lines LL1, LL3, and LL5 and the spot light of the drawing beam LB scanned along the even drawing lines LL2 and LL4. The direction of scanning is opposite to each other. Therefore, with respect to the position in the width direction (Y direction) on the substrate P, the drawing end position of the odd-numbered drawing line LL1 and the drawing end position of the even-numbered drawing line LL2 coincide or are adjacent to each other. The drawing start position of LL2 and the drawing start position of odd-numbered drawing line LL3 coincide or are adjacent to each other, and the drawing end position of odd-numbered drawing line LL3 and that of even-numbered drawing line LL4 are equal or adjacent to each other The drawing start position of the even-numbered drawing line LL4 and the drawing start position of the odd-numbered drawing line LL5 are arranged to coincide or be adjacent to each other.

  Next, the drawing apparatus 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 is disposed on the downstream side of the substrate P conveyance direction from the detection region of the reference pattern of the substrate P by the alignment microscopes AM1 and AM2 shown in FIG. 1, and is supported by the rotary drum DR during conveyance of the substrate P It functions as a processing unit that performs predetermined processing (exposure processing in the present embodiment) on a part of the substrate P. The drawing apparatus 11 includes the plurality of drawing modules UW1 to UW5 described above, a branch optical system SL that branches the drawing beam LB from the light source device CNT, and a calibration detection system 31 for performing calibration.

  The branching optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of branches, and guides the branched plurality of drawing beams LB toward the plurality of drawing modules UW1 to UW5. The branching optical system SL includes a first optical system 41 for branching the drawing beam LB emitted from the light source device CNT into two, and a second optical system to which one drawing beam LB branched by the first optical system 41 is irradiated. A system 42 and a third optical system 43 to which the other drawing beam LB branched by the first optical system 41 is irradiated. The branching optical system SL further includes a having adjusting mechanism 44 for shifting the drawing beam LB in a two-dimensional manner in a plane perpendicular to the beam traveling optical axis by a tiltable parallel flat glass (Having plate), and a having adjusting mechanism 45. It contains. A part of the branch optical system SL on the light source device CNT side is installed on the main body frame 21, and another part on the drawing module UW side is installed on the second optical surface plate 25.

  As shown in FIGS. 5 and 6, the first optical system 41 includes a half-wave plate 51, a polarization mirror (polarization beam splitter) 52, a beam diffuser 53, a first reflection mirror 54, and a first relay. A lens 55, a second relay lens 56, a second reflecting mirror 57, a third reflecting mirror 58, a fourth reflecting mirror 59, and a first beam splitter 60 are provided.

  The drawing beam LB emitted from the light source device CNT in the + X direction is irradiated to the half wave plate 51. The half-wave plate 51 is rotatable in the irradiation plane of the drawing beam LB. The polarization direction of the drawing beam LB irradiated to the half-wave plate 51 is a predetermined polarization direction according to the amount of rotation of the half-wave plate 51. The drawing beam LB that has passed through the half-wave plate 51 is irradiated to the polarization mirror 52. The polarizing mirror 52 transmits the drawing beam LB in a predetermined polarization direction, and reflects the drawing beam LB in a direction other than the predetermined polarization direction in the + Y direction. For this reason, since the drawing beam LB reflected by the polarization mirror 52 passes through the half wave plate 51, the beam intensity of the drawing beam LB is obtained by the cooperation of the half wave plate 51 and the polarization mirror 52. Is adjusted. That is, by rotating the half-wave plate 51 and changing the polarization direction of the drawing beam LB, it is possible to adjust the beam intensity of the drawing beam LB reflected by the polarization mirror 52.

  The drawing beam LB transmitted through the polarization mirror 52 is irradiated to the beam diffuser 53. The beam diffuser 53 absorbs the drawing beam LB, and suppresses the leakage of the drawing beam LB irradiated to the beam diffuser 53 to the outside. The drawing beam LB reflected in the + Y direction by the polarization mirror 52 is irradiated to the first reflection mirror 54. The drawing beam LB irradiated to the first reflection mirror 54 is reflected in the + X direction, and is irradiated to the second reflection mirror 57 via the first relay lens 55, the second relay lens 56, and the having adjustment mechanism 44. The drawing beam LB irradiated to the second reflection mirror 57 is reflected in the −Y direction and irradiated to the third reflection mirror 58. The drawing beam LB irradiated to the third reflection mirror 58 is reflected at right angles to the −Z direction and irradiated to the fourth reflection mirror 59. The drawing beam LB irradiated to the fourth reflection mirror 59 is reflected at right angles to the + Y direction and irradiated to the first beam splitter 60. While a part of the drawing beam LB irradiated to the first beam splitter 60 is reflected in the -X direction and irradiated to the second optical system 42, the other part is transmitted to the third optical system. It is irradiated.

  The third reflection mirror 58 and the fourth reflection mirror 59 are provided at predetermined intervals on the rotation axis I of the rotation mechanism 24. Further, the configuration up to the light source device CNT including the third reflection mirror 58 (a portion surrounded by a two-dot chain line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side. The configuration of the plurality of drawing modules UW1 to UW5 including the fourth reflection mirror 59 (a part surrounded by a two-dot chain line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. With such a structure, since the third reflecting mirror 58 and the fourth reflecting mirror 59 are provided on the rotation axis I, the second optical surface plate 25 is fixed to the first optical surface plate 23 by the rotation mechanism 24. Even when it is rotated, the optical path of the drawing beam LB in the second optical system 42 and the third optical system 43 is not changed. Therefore, even if the second optical surface plate 25 is rotated relative to the first optical surface plate 23 by the rotation mechanism 24, the drawing device 11 draws the imaging beam LB emitted from the light source device CNT installed on the main body frame 21 side. Can be suitably guided to the plurality of drawing modules UW1 to UW5 installed on the second optical surface plate 25 side.

  The second optical system 42 guides and guides one drawing beam LB branched by the first optical system 41 toward odd-numbered drawing modules UW1, UW3, and UW5 described later. The second optical system 42 includes a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

  The drawing beam LB reflected by the first beam splitter 60 of the first optical system 41 in the −X direction is irradiated to the fifth reflection mirror 61. The drawing beam LB irradiated to the fifth reflection mirror 61 is reflected in the −Y direction and irradiated to the second beam splitter 62. A part of the drawing beam LB irradiated to the second beam splitter 62 is reflected, and the odd-numbered drawing module UW5 is irradiated (see FIG. 5). The other part of the drawing beam LB irradiated to the second beam splitter 62 is transmitted, and the drawing beam LB is irradiated to the third beam splitter 63. A part of the drawing beam LB irradiated to the third beam splitter 63 is reflected, and the drawing beam LB is irradiated to one odd-numbered drawing module UW 3 (see FIG. 5). The other part of the drawing beam LB irradiated to the third beam splitter 63 is transmitted, and the drawing beam LB is irradiated to the sixth reflection mirror 64. The drawing beam LB irradiated to the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and irradiated to one drawing module UW1 of odd number (see FIG. 5). In the second optical system 42, the drawing beam LB irradiated to the odd-numbered drawing modules UW1, UW3 and UW5 is slightly oblique to the -Z direction.

  The third optical system 43 branches and guides the other drawing beam LB branched by the first optical system 41 toward even-numbered drawing modules UW 2 and UW 4 described later. The third optical system 43 includes a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

  The drawing beam LB transmitted through the first beam splitter 60 of the first optical system 41 in the Y direction is irradiated to the seventh reflection mirror 71. The drawing beam LB irradiated to the seventh reflection mirror 71 is reflected in the X direction and irradiated to the eighth reflection mirror 72. The drawing beam LB irradiated to the eighth reflection mirror 72 is reflected in the −Y direction and irradiated to the fourth beam splitter 73. A part of the drawing beam LB irradiated to the fourth beam splitter 73 is reflected, and the drawing beam LB is irradiated to an even-numbered drawing module UW 4 (see FIG. 5). The other part of the drawing beam LB irradiated to the fourth beam splitter 73 is transmitted, and the drawing beam LB is irradiated to the ninth reflection mirror 74. The drawing beam LB irradiated to the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74, and irradiated to one drawing module UW2 of even number. Also in the third optical system 43, the drawing beam LB irradiated to the even-numbered drawing modules UW2 and UW4 is slightly oblique to the -Z direction.

  As described above, in the branch optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of directions toward the plurality of drawing modules UW1 to UW5. At this time, in the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73, the beam intensities of the drawing beams LB irradiated to the plurality of drawing modules UW1 to UW5 become the same. Thus, the ratio of the reflectance to the transmittance is appropriately set according to the number of branches of the drawing beam LB.

  The having adjustment mechanism 44 finely adjusts the incident position of the drawing beam LB incident on the first beam splitter 60 via the third reflection mirror 58 and the fourth reflection mirror 59, and is in the XZ plane in FIG. In the YZ plane in FIG. 6, the transparent parallel flat glass can be tilted in the YZ plane. By adjusting the tilt amounts of the two parallel flat glass sheets, the incident position of the drawing beam LB incident on each of the drawing modules UW1 to UW5 can be optimally adjusted.

  The having adjustment mechanism 45 is disposed between the seventh reflection mirror 71 and the eighth reflection mirror 72. The having adjustment mechanism 45 is for finely adjusting the incident position of the drawing beam LB incident on the eighth reflection mirror 72, and is transparent parallel flat glass which can be tilted in the XZ plane in FIG. And transparent parallel flat glass which can be tilted in a plane. By adjusting the tilt amounts of the two parallel flat glass sheets, the incident position of the drawing beam LB incident on each of the even-numbered drawing modules UW2 and UW4 can be optimally adjusted.

  The plurality of drawing modules UW1 to UW5 will be described with reference to FIG. 4, FIG. 5 and FIG. The plurality of drawing modules UW1 to UW5 are provided in accordance with the plurality of drawing lines LL1 to LL5. The plurality of drawing beams LB branched by the branching optical system SL are respectively irradiated to the plurality of drawing modules UW1 to UW5. Each of the drawing modules UW1 to UW5 guides a plurality of drawing beams LB to each of the drawing lines LL1 to LL5. That is, the first writing module UW1 guides the writing beam LB to the first writing line LL1, and similarly, the second to fifth writing modules UW2 to UW5 write the writing beam LB to the second to fifth writing lines LL2 to LL5. Lead to

  As shown in FIGS. 4 and 1, the plurality of drawing modules UW1 to UW5 are divided into odd-numbered drawing modules UW1, UW3 and UW5, and even-numbered drawing modules UW2 and UW4, and sandwiching the central plane p3. They are arranged in two rows in the circumferential direction of the rotary drum DR. The plurality of drawing modules UW1 to UW5 are the first drawing on the side where the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged (the -X direction side in FIG. 5) across the central plane p3. A module UW1, a third drawing module UW3 and a fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are disposed at predetermined intervals in the Y direction.

  Next, each drawing module UW1 to UW5 will be described with reference to FIG. Since each of the drawing modules UW1 to UW5 has the same configuration, the first drawing module UW1 (hereinafter, simply referred to as the drawing module UW1) will be described as an example. Since the drawing module UW1 shown in FIG. 4 scans the spot light of the drawing beam LB along the drawing line LL1 (first drawing line LL1), a polarizer (light switching element) 81, a polarization beam splitter PBS, 1 A quarter-wave plate 82, a scanner (beam deflection element) 83, a bending mirror 84, an f-θ lens system 85, and a Y magnification correction optical member 86 are provided. Further, a calibration detection system 31 is provided adjacent to the polarization beam splitter PBS.

  For the polarizer 81, for example, an acousto-optic modulator (AOM: Acousto Optic Modulator) is used. The polarizer 81 switches the projection / non-projection of the drawing beam LB on the substrate P at high speed by switching AOM ON / OFF. Specifically, the drawing beam LB from the branch optical system SL is irradiated to the polarizer 81 at a slight inclination with respect to the −Z direction via the relay lens 91. When the polarizer 81 is switched to the OFF state, the drawing beam LB goes straight in a state where the drawing beam LB is inclined, and is shielded by the light shielding plate 92 provided at the end of passing through the polarizer 81. When the polarizer 81 is switched ON, the drawing beam LB is deflected in the −Z direction, passes through the polarizer 81, and is irradiated to the polarization beam splitter PBS provided on the Z direction of the polarizer 81. Therefore, when the polarizer 81 is switched to ON, the drawing beam LB is projected onto the substrate P. When the polarizer 81 is switched OFF, the drawing beam LB is not projected onto the substrate P, that is, not projected.

  The polarization beam splitter PBS reflects the drawing beam LB emitted from the polarizer 81 through the relay lens 93. The polarization beam splitter PBS cooperates with a 1⁄4 wavelength plate 82 provided between the polarization beam splitter PBS and the scanner 83 to transmit the drawing beam LB reflected by the substrate P. That is, the drawing beam LB irradiated from the polarizer 81 to the polarization beam splitter PBS is a laser beam which becomes a linear polarization of S polarization, and is reflected by the polarization beam splitter PBS. The drawing beam LB reflected by the polarization beam splitter PBS passes through the 1⁄4 wavelength plate 82 and is irradiated to the substrate P as circularly polarized light. Of the drawing beam LB irradiated onto the substrate P, when the light reflected by the substrate P comes back to the 1⁄4 wavelength plate 82, the light passes through the 1⁄4 wavelength plate 82 again, whereby It becomes linearly polarized light. For this reason, the light reflected and returned by the substrate P passes through the polarization beam splitter PBS, and is irradiated to the calibration detection system 31 through the relay lens 94. The drawing beam LB reflected by the polarization beam splitter PBS passes through the 1⁄4 wavelength plate 82 and is irradiated to the scanner 83.

  As shown in FIGS. 4 and 7, the scanner 83 has a reflection mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing beam LB that has passed through the 1⁄4 wavelength plate 82 is irradiated to the reflection mirror 96 via the relay lens 95. The drawing beam LB irradiated to the reflection mirror 96 is irradiated to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction, and a plurality of polygon surfaces (reflection planes) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction about the rotation axis 97a to continuously change the reflection angle of the drawing beam LB irradiated to the polygon surface 97b, thereby reflecting the drawing beam LB reflected. The light is reflected by the bending mirror 84, and then collected as spot light on the drawing line LL1 on the substrate P via the f-.theta. Lens system (including the condensing lens) 85, and the spot light is drawn on the drawing line LL1. Is scanned along the The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 of the substrate P. The origin detector 98 is disposed on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each polygon surface 97 b interposed therebetween. Therefore, the origin detector 98 detects the drawing beam LB before being irradiated to the f-θ lens system 85. That is, the origin detector 98 detects the drawing beam LB before the drawing start position of the drawing line LL1 on the substrate P is irradiated. The origin detector 98 may be configured to project a beam from a light emitting element (LED or LD) other than the drawing beam LB toward the polygon surface 97 b and receive the reflected light.

  The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing beam LB reflected from the rotating polygon mirror 97 via the bending mirror 84 perpendicularly to the drawing surface of the substrate P.

  As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 have the same structure. In the plurality of scanners 83, three scanners 83 corresponding to the drawing modules UW1, UW3 and UW5 are disposed on the upstream side (the -X direction side in FIG. 7) of the rotation direction of the rotary drum DR. Two scanners 83 corresponding to UW 4 are disposed on the downstream side (the + X direction side in FIG. 7) of the rotation direction of the rotary drum DR. The three upstream scanners 83 and the two downstream scanners 83 are disposed to face each other across the central plane p3. Therefore, when the drawing beam LB is irradiated to the rotating polygon mirror 97 while the three rotating polygon mirrors 97 on the upstream side rotate counterclockwise, the drawing beam LB reflected by the rotating polygon mirror 97 is the drawing start position The scanning is performed in a predetermined scanning direction (for example, the + Y direction in FIG. 7) from the image forming position to the drawing end position. On the other hand, when the drawing beam LB is irradiated to the rotating polygon mirror 97 while the two rotating polygon mirrors 97 on the downstream side rotate counterclockwise, the drawing beam LB reflected by the rotating polygon mirror 97 is the drawing start position The three upstream rotating polygon mirrors 97 are scanned in the reverse scanning direction (for example, the -Y direction in FIG. 7) from the image forming end to the drawing end position.

  When viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the odd-numbered drawing modules UW1, UW3, UW5 is an installation orientation extending in the radial direction of the drum DR from the central axis AX2 of the rotating drum DR. The direction is coincident with the line Le1. That is, the installation azimuth line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, and LL5 and the rotation center axis AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axes of the drawing beams LB reaching the substrate P from the even-numbered drawing modules UW2 and UW4 are the installation azimuth line Le2 extending in the radial direction of the drum DR from the central axis AX2. It is in the same direction. That is, the installation azimuth line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center axis AX2 in the XZ plane.

  The Y magnification correction optical member 86 is disposed between the f-θ lens system 85 and the substrate P. The Y-magnification correction optical member 86 isotropically expands or reduces the drawing lines LL1 to LL5 formed by the drawing modules UW1 to UW5 by a very small amount in the Y direction.

  In the drawing apparatus 11 having such a structure, each part is controlled by the control device 16 so that a predetermined pattern is drawn on the substrate P. That is, the controller 16 performs polarization based on CAD (Computer Aided Design) information of a pattern to be drawn on the substrate P while the spot light of the drawing beam LB projected onto the substrate P is scanning in the scanning direction. The drawing beam LB is deflected by high speed on / off modulation of the device 81 to draw a pattern on the photosensitive layer of the substrate P. In addition, the control device 16 synchronizes the scanning direction of the spot light of the drawing beam LB scanned along the drawing line LL1 with the movement of the substrate P in the transport direction by the rotation of the rotary drum DR, to thereby apply the substrate P A predetermined pattern is drawn in a portion corresponding to the drawing line LL1 in the processing area A7.

  When the substrate P passes the drawing lines LL1, LL3, LL5 formed by the drawing modules UW1, UW3, UW5 and the drawing lines LL2, LL4 formed by the drawing modules UW2, UW4, a predetermined continuous pattern is drawn . An area surrounded by a straight line connecting the drawing lines LL1, LL3 and LL5 and a straight line connecting the drawing lines LL2 and LL4 is referred to as an exposure area (processing area) TR. When the substrate P passes through the exposure region TR, a predetermined pattern is drawn on the surface of the substrate P by the exposure processing of the drawing device 11.

  Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 8. The alignment microscopes AM1 and AM2 detect an alignment mark as a reference pattern previously formed on the surface of the substrate P along the longitudinal direction or a reference mark or a reference pattern formed on the rotary drum DR. Hereinafter, the alignment mark of the substrate P and the reference mark and the reference pattern of the rotary drum DR may be simply referred to as a mark. The alignment microscopes AM1 and AM2 align (align) the substrate P and a predetermined pattern drawn on the substrate P, or calibrate the rotating drum DR and the drawing device 11.

  As shown in FIGS. 8 and 3, the alignment microscopes AM1 and AM2 are upstream of the drawing line LL1 to LL5 formed by the drawing apparatus 11 in the rotation direction of the rotary drum DR, ie, in the conveyance direction of the substrate P. It is provided on the side. The alignment microscope AM1 is provided upstream of the alignment microscope AM2 in the rotation direction of the rotary drum DR, that is, on the upstream side of the transport direction of the substrate P. The alignment microscopes AM1 and AM2 include an objective lens system GA and an imaging system GD. The objective lens system GA functions as a detection probe which projects the illumination light onto the substrate P or the rotary drum DR and which receives the reflected light from the mark. The imaging system GD captures an image (bright field image, dark field image, fluorescent image, etc.) of the mark received through the objective lens system GA with a photoelectric conversion element such as a two-dimensional CCD or CMOS. The illumination light for alignment is light in a wavelength range that has little sensitivity to the photosensitive layer on the substrate P, for example, light with a wavelength of about 500 nm to 800 nm.

  A plurality of alignment microscopes AM1 (three in the present embodiment) are provided in a line in the Y direction (the width direction of the substrate P). Similarly, a plurality (three in the present embodiment) of alignment microscopes AM2 are provided in a line in the Y direction (the width direction of the substrate P). That is, in the present embodiment, a total of six alignment microscopes AM1 and AM2 are provided. FIG. 3 shows the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 for the sake of convenience. As shown in FIG. 3 (or FIG. 8), observation regions (detection regions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the respective objective lens systems GA1 to GA3 of the three alignment microscopes AM1 It is arranged at a predetermined interval in the Y direction parallel to the rotation center axis AX2. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation areas Vw1 to Vw3 are all parallel to the XZ plane. Similarly, as shown in FIG. 3, the observation areas (detection areas) Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the respective objective lens systems GA of the three alignment microscopes AM2 have central axes of rotation. It is disposed at a predetermined interval in the Y direction parallel to AX2. As shown in FIG. 8, the optical axes La4 to La6 of the objective lens systems GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are disposed at predetermined intervals in the rotation direction of the rotary drum DR, that is, in the transport direction of the substrate P.

  The observation areas Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set, for example, in a square area of about 200 μm square, that is, about 200 μm on a side, on the surface of the substrate P or the rotary drum DR. As shown in FIG. 8, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are the same as the installation azimuth Le3 extending in the radial direction of the rotating drum DR from the rotation center axis AX2. Set in the direction. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA, are set in the same direction as the installation azimuth Le4 extending in the radial direction of the rotating drum DR from the rotation center axis AX2. Ru. At this time, since the alignment microscope AM1 is disposed on the upstream side of the rotational direction of the rotary drum DR also by the alignment microscope AM2, the angle between the central plane p3 and the installation azimuth Le3 is the installation azimuth and the installation azimuth It is larger than the angle formed by the line Le4.

  On the surface of the substrate P, as shown in FIG. 3, a processing area A7 (for example, the size of one display panel device) drawn by each of five drawing lines LL1 to LL5 has a predetermined interval in the X direction Will be placed in the A plurality of alignment marks KS1 to KS3 formed in advance on the substrate P, that is, on the surface of the substrate P along the lengthwise direction of the substrate P are provided around the processing region A7 on the substrate P for alignment. Be Alignment marks KS1 to KS3 are formed, for example, in a cross shape. Although alignment microscope AM1, AM2 aligns with the alignment mark KS1 to KS2 of the board | substrate P, alignment is not limited to this. For example, the alignment microscopes AM1 and AM2 may perform alignment using a part of a circuit pattern or a part of a wiring pattern formed on the substrate P.

  In FIG. 3, alignment marks KS1 are provided at a constant interval in the X direction (longitudinal direction of substrate P) in the peripheral area on the −Y side of processed area A7, and alignment mark KS3 is formed of processed area A7. The peripheral region on the + Y side is provided at a constant interval in the X direction (longitudinal direction of the substrate P). Furthermore, the alignment mark KS2 is provided at the center in the Y direction in the blank area between two processing areas A7 adjacent in the X direction. While the substrate P is being transported in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens system GA of the alignment microscope AM2, the alignment mark KS1 is an alignment microscope AM1 and an alignment microscope It is formed to be sequentially captured by AM2. In addition, while the substrate P is being transported in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation area Vw6 of the objective lens system GA of the alignment microscope AM2, the alignment mark KS3 is an alignment microscope AM1 and The alignment microscope AM2 is formed to be sequentially captured. Further, the alignment mark KS2 is sequentially captured while the substrate P is being transported in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and in the observation area Vw5 of the objective lens system GA of the alignment microscope AM2, respectively. It is formed to be

  Therefore, among the two sets of alignment microscopes AM1 and AM2 in which three units are arranged in the Y direction, ie, the width direction of the substrate P, two alignment microscopes AM1 and two provided on both sides of the rotating drum DR in the Y direction. The AM 2 can constantly observe or detect the alignment marks KS1 and KS3 formed on both sides in the width direction of the substrate P. The width direction of the substrate P is a direction orthogonal to the longitudinal direction of the substrate P. Further, among the two sets of alignment microscopes AM1 and AM2 in which three units are arranged in the Y direction, the alignment microscopes AM1 and AM2 disposed at the center of the rotating drum DR in the Y direction are processed on the substrate P The alignment mark KS2 formed in the margin between the regions A7 can always be observed or detected.

  Since the exposure apparatus EX applies a so-called multi-beam type drawing apparatus 11, the plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 are Y In order to preferably join in the directions, calibration for suppressing the joint accuracy by the plurality of drawing modules UW1 to UW5 within an allowable range is required. Further, the relative positional relationship between the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the respective drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 needs to be accurately determined by the baseline management. Calibration is also required for baseline management.

  Calibration for confirming the joint accuracy by the plurality of drawing modules UW1 to UW5 and calibration for baseline management of the alignment microscopes AM1 and AM2 are performed on at least a part of the outer peripheral surface of the rotating drum DR supporting the substrate P It is necessary to provide a reference mark or a reference pattern. Therefore, as shown in FIG. 9, in the exposure apparatus EX, a rotary drum DR provided with a mark serving as a reference or a pattern serving as a reference on the outer peripheral surface is used.

  The rotary drum DR has scale portions GPa and GPb for encoder measurement, which constitute a part of a rotational position detection mechanism 14 described later, on both end sides of the outer peripheral surface thereof. In the rotary drum DR, inside the scale portions GPa and GPb, restriction bands CLa and CLb having a narrow width due to concave grooves or convex rims are engraved along the entire circumference. The width of the substrate P in the Y direction is set smaller than the distance between the two restriction bands CLa and CLb in the Y direction, and the substrate P is sandwiched by the restriction bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is closely supported to the inner area.

  The rotary drum DR has a plurality of line patterns RL1 inclined at +45 degrees with respect to the rotation center axis AX2 and -45 degrees with respect to the rotation center axis AX2 on the outer peripheral surface sandwiched by the regulation bands CLa and CLb. A mesh-shaped drum-side reference pattern (also usable as a drum-side reference mark) RMP is provided in which a plurality of line patterns RL2 are repeatedly formed at a constant pitch (period) Pf1 and Pf2.

  The drum-side reference pattern RMP has a uniform oblique pattern (diagonal grid pattern) over the entire surface so that no change in the frictional force or the tension of the substrate P occurs in the portion where the substrate P contacts the outer peripheral surface of the rotary drum DR. And The line patterns RL1 and RL2 do not necessarily have to be 45 degrees diagonally, and may be a mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Furthermore, it is not necessary to cross the line patterns RL1 and RL2 at 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is other than a square (or a rectangle). The line patterns RL1 and RL2 may cross each other at an angle that forms a diamond shape.

  Next, the rotational position detection mechanism 14 will be described with reference to FIGS. 3, 4 and 8. As shown in FIG. 8, the rotational position detection mechanism 14 optically detects the rotational position of the rotary drum DR, and for example, an encoder system using a rotary encoder or the like is applied. In the present embodiment, an incremental encoder system is used for the rotational position detection mechanism 14, but an absolute encoder system may be used. The rotational position detection mechanism 14 has scale portions GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads EN1, EN2, EN3 and EN4 facing each of the scale portions GPa and GPb. Although only four encoder heads EN1, EN2, EN3 and EN4 facing the scale part GPa are shown in FIGS. 4 and 8, similar encoder heads EN1, EN2, EN3 and EN4 also face the scale part GPb. Will be placed.

  The scale portions GPa and GPb are respectively formed annularly over the entire circumferential direction of the outer peripheral surface of the rotary drum DR. The scale portions GPa and GPb are diffraction gratings in which concave or convex grating lines are inscribed at a constant pitch in the circumferential direction of the outer peripheral surface of the rotating drum DR (for example, grating lines of 10 μm width are incised at intervals of 20 μm) Used as an incremental scale. For this reason, the scale parts GPa and GPb rotate integrally with the rotary drum DR around the rotation center axis AX2. Incidentally, even if the pitch of the diffraction gratings of the scale parts GPa and GPb is 20 μm, by using a sinusoidal two-phase signal having a phase difference of 90 ° outputted by each of the encoder heads EN1 to EN4, High resolution measurement of about 1/20 to 1/100 is possible.

  The substrate P is wound inside the scale parts GPa, GPb at both ends of the rotary drum DR, that is, inside the restriction bands CLa, CLb. If a strict positional relationship is required, the outer peripheral surfaces of the scale parts GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are set to be the same surface (the same radius from the central axis AX2) Do. For that purpose, the outer peripheral surfaces of the scale parts GPa and GPb may be increased in the radial direction by the thickness of the substrate P with respect to the outer peripheral surface for winding the substrate of the rotary drum DR. For this reason, the outer peripheral surfaces of the scale parts GPa and GPb formed on the rotary drum DR can be set to the same radius as the outer peripheral surface of the substrate P. As a result, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial position as the drawing surface on the substrate P wound around the rotary drum DR, and the measurement position and the processing position Can reduce the Abbe error caused by the difference in the radial direction of the rotating system.

  The encoder heads EN1, EN2, EN3, EN4 are respectively disposed around the scale parts GPa, GPb when viewed from the rotation center axis AX2, and are disposed at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN1, EN2, EN3, EN4 are connected to the controller 16. The encoder heads EN1, EN2, EN3, EN4 project light beams for measurement toward the scale parts GPa, GPb, and photoelectrically detect reflected light beams (diffracted lights) thereof, thereby circumferential directions of the scale parts GPa, GPb And a detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the position change of The control device 16 interpolates and digitally processes the detection signal with a counter circuit (not shown), thereby changing the angular change of the rotary drum DR, that is, the positional change in the circumferential direction of the outer peripheral surface with submicron resolution. It can be measured. The control device 16 can also measure the transport speed of the substrate P from the change in angle of the rotary drum DR.

  As shown in FIGS. 4 and 8, the encoder head EN1 is disposed on the installation azimuth line Le1. The installation azimuth line Le1 is a line connecting a projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN1 and the rotation center axis AX2 in the XZ plane. Further, as described above, the installation azimuth line Le1 is a line connecting the drawing lines LL1, LL3, and LL5 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN1 and the rotation center axis AX2 and the line connecting the drawing lines LL1, LL3 and LL5 and the rotation center axis AX2 have the same azimuth.

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN2 is disposed on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting a projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN2 and the rotation center axis AX2 in the XZ plane. Further, as described above, the installation azimuth line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center axis AX2 and the line connecting the drawing lines LL2, LL4 and the rotation center axis AX2 are the same azimuthal line.

  Also, as shown in FIGS. 4 and 8, the encoder head EN3 is disposed on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN3 and the rotation center axis AX2 in the XZ plane. Further, as described above, the installation azimuth line Le3 is a line connecting the observation areas Vw1 to Vw3 of the substrate P with the alignment microscope AM1 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center axis AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center axis AX2 have the same azimuth.

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN4 is disposed on the installation azimuth line Le4. The installation azimuth line Le4 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN4 and the rotation center axis AX2 in the XZ plane. Further, as described above, the installation azimuth line Le4 is a line connecting the observation areas Vw4 to Vw6 of the substrate P with the alignment microscope AM2 and the rotation center axis AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center axis AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center axis AX2 have the same azimuth.

  When the installation azimuths (angular directions in the XZ plane about the rotation center axis AX2) of the encoder heads EN1, EN2, EN3, EN4 are represented by installation azimuths Le1, Le2, Le3, Le4, as shown in FIG. The plurality of drawing modules UW1 to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 form an angle of ± θ ° with respect to the central plane p3.

  The control device 16 detects rotational angle positions of the scale units (rotary drums DR) GPa and GPb with the encoder heads EN1 and EN2, and based on the detected rotational angle positions, the odd and even drawing modules UW1 to UW5 are used. I'm drawing. That is, the control device 16 ON / OFF modulates the polarizer 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected onto the substrate P is scanning in the scanning direction. However, the pattern can be accurately drawn on the surface of the photosensitive layer of the substrate P by determining the timing of ON / OFF modulation by the polarizer 81 based on the detected rotational angle position.

  The control device 16 detects rotational angles of the scale portions (rotary drums DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the alignment marks KS1 to KS5 on the substrate P are detected by the alignment microscopes AM1 and AM2. The correspondence relationship between the position of the alignment marks KS1 to KS5 on the substrate P and the rotational angle position of the rotary drum DR can be obtained by storing Similarly, the controller 16 detects scale portions (rotary drums DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the drum side reference pattern RMP on the rotary drum DR is detected by the alignment microscopes AM1 and AM2. The correspondence between the position of the drum-side reference pattern RMP on the rotary drum DR and the rotational angle position of the rotary drum DR can be determined by storing the rotational angle position of the above. As described above, the alignment microscopes AM1 and AM2 can accurately measure the rotational angular position (or circumferential position) of the rotary drum DR at the instant when the mark is sampled in the observation areas Vw1 to Vw6. Then, in the exposure apparatus EX, the substrate P and the predetermined pattern drawn on the surface of the substrate P are aligned (aligned) based on the measurement result, or the rotary drum DR and the drawing apparatus 11 are calibrated. Do. Next, alignment will be described.

  There are several methods for mark detection by the alignment microscopes AM1 and AM2, but while the substrate P is moving at a predetermined speed in the longitudinal direction, marks Ks1 and Ks2 in each of the observation areas Vw1 to Vw6 It is necessary to supplement Ks3 and to image. For this reason, as an imaging element such as a two-dimensional CCD or CMOS of the imaging system GD, one corresponding to a high speed shutter (for example, accumulation of imaging light quantity of 1/3200 seconds or less) is used. In the case of an imaging device in which such a high-speed shutter can not be used, the light source for illuminating the observation regions Vw1 to Vw6 may be a pulse light source (such as a strobe) having a very short light emission time and high peak intensity. For example, when the timing at which the mark Ks1 is positioned in the observation area Vw1 of the alignment microscope AM1 is unknown, the high-speed shutter is opened or the pulse light source is pulsed to emit light for each fixed rotation angle of the rotating drum DR The image in the region Vw1 is repeatedly imaged, the image in which the mark image is captured is found by analysis of the plurality of imaged images, and the rotational angular position (encoder measurement value) of the rotary drum DR when the image is imaged is stored Keep it. If the rotational angle position (encoder measurement value) of the rotary drum DR when one mark Ks1 is captured within the observation area Vw1 is known, then the arrangement interval (design interval) in the longitudinal direction of the mark Ks1 and the encoder measurement value Since the capture position of the mark is determined based on the above, the image in the observation area Vw1 may be sampled by the imaging device when the position is reached.

(About substrate alignment)
In the present embodiment, the exposure apparatus EX has two rows of alignment microscopes AM1 and AM2 in the transport direction of the substrate P, but at least one of the two rows of alignment microscopes AM1 and AM2 , Alignment is possible. The distance between the alignment microscope AM1 and each drawing module UW1 to UW5 (scanning lines LL1 to LL5) and the distance between the alignment microscope AM2 and each drawing module UW1 to UW5 (scanning lines LL1 to LL5) are known in advance. Therefore, in the control device 16 shown in FIG. 1, the substrate P is transported from the position of the alignment marks KS1, KS2, KS3 detected by the alignment microscope AM1 or the alignment microscope AM2, and the same alignment marks KS1, KS2, KS3 move A change in relative positional relationship between the alignment marks KS1, KS2, KS3 and the drawing modules UW1, UW3, UW5 or the drawing modules UW2, UW4 of the drawing apparatus 11 can be obtained from the distance (conveyance distance).

  Similarly, the control device 16 is required to move the same alignment marks KS1, KS2, KS3 by transporting the substrate P from the position of the alignment marks KS1, KS2, KS3 detected by the alignment microscope AM1 or the alignment microscope AM2. The change in relative positional relationship between the alignment marks KS1, KS2, KS3 and the drawing modules UW1, UW3, UW5 or the drawing modules UW2, UW4 of the drawing apparatus 11 can be determined also by the time (conveyance time).

  The control device 16 controls the timing at which the drawing modules UW1, UW3, UW5 and the drawing modules UW2, UW4 of the drawing apparatus 11 draw on the surface of the substrate P based on the relative positional relationship described above. Further, the control device 16 generates alignment data based on the positional information of the alignment marks KS1, KS2, KS3 detected by the alignment microscope AM1, and controls the drawing device 11 while performing alignment of the substrate P based on this. Then, a predetermined pattern is drawn (exposed) on the surface of the substrate P. The alignment data is position information (for example, (X, Y, Z) coordinates) of the processing target area A7 of the substrate P, which is obtained from the alignment marks KS1, KS2, and KS3.

  As described above, the control device 16 shown in the drawing is the position information on the alignment marks KS1, KS2 and KS3 and the substrate P from the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 to the exposure area TR on the substrate P of the drawing apparatus 11. The drawing device 11 is controlled based on the conveyance distance or the conveyance time. By doing this, the exposure apparatus EX can draw a predetermined pattern on the surface of the substrate P by the drawing apparatus 11 while performing alignment while transporting the substrate P. The positional information on the alignment marks KS1, KS2, and KS3 is sequentially detected as the alignment microscope AM1 continues the detection operation. The alignment microscope AM1 sequentially detects positional information on the alignment marks KS1, KS2, and KS3 while transporting the substrate P in the observation regions Vw1, Vw2, and Vw3. The alignment microscope AM2 sequentially detects positional information on the alignment marks KS1, KS2, and KS3 while transporting the substrate P in the observation regions Vw4, Vw5, and Vw6.

  FIG. 10 is a view showing, in an XZ plane, a region to be processed in the longitudinal direction of the substrate and a region in which alignment in the longitudinal direction of the substrate is possible. FIG. 11 is a plan view showing a region to be processed in the longitudinal direction of the substrate and a region where alignment can be performed in the longitudinal direction of the substrate. The rotating drum DR of the exposure apparatus EX supports the substrate P by being wound around a part in the circumferential direction. When at least one of the two rows of alignment microscopes AM1 and AM2 actually detects the alignment marks KS1 to KS3, the maximum distance in the longitudinal direction of the substrate P which enables alignment (mark detection) immediately before exposure is the substrate The distance along the circumferential length of the rotary drum DR from the observation areas Vw1, Vw2, Vw3 of the alignment microscope AM1 arranged on the upstream side in the conveyance direction of P to the exposure area TR of the exposure apparatus EX.

  More specifically, as shown in FIG. 10, drawing lines LL1, LL3 by drawing modules UW1, UW3, UW5 disposed on the upstream side in the transport direction of the substrate P from the observation areas Vw1, Vw2, Vw3 of the alignment microscope AM1. , The distance to LL5 is the largest. Hereinafter, this distance is referred to as an alignment length L (corresponding to the transport distance of the substrate P to the exposure region TR on the rotary drum DR) L as appropriate. An area on the substrate P corresponding to the alignment length L is referred to as an alignable area AA.

  As shown in FIG. 11, the maximum length in the longitudinal direction of the processing area A7 of the substrate P (hereinafter referred to as the maximum exposure length as appropriate) is set to Wmax. If the maximum exposure length Wmax ≦ alignment length L, all the alignment marks KS1 to KS3 provided along with the entire processing area A7 are measured by the alignment microscope AM1 (observation areas Vw1, Vw2, Vw3) be able to. Therefore, the control device 16 shown in FIG. 1 performs arithmetic processing immediately before exposure based on the measurement results to obtain deformation errors, expansion and contraction errors, etc. of the entire processing area A7, performs appropriate correction, and produces a precise pattern. Exposure can be performed.

  However, when the maximum exposure length Wmax> the alignment length L, the alignment microscope AM1 can not detect all the alignment marks KS1 to KS3 provided along with the entire processing area A7 just before the exposure. Therefore, the control device 16 shown in FIG. 1 performs arithmetic processing for alignment based on the detection result of the alignment mark attached only to a part of the processing area A7 detected by the alignment microscope AM1. As described above, in the exposure apparatus EX, the arrangement of the drawing modules UW 1, UW 3, UW 5 of the drawing apparatus 11 and the alignment microscope AM 1 restricts the area that can be aligned with the substrate P. That is, the pattern exposure on the processing area A7 is started based on only the deformation error and the expansion error of the partial area (alignment length L) of the processing area A7, not the whole of the processing area A7.

  As shown in FIG. 11, in the processing area A7, the area NAA (also referred to as a non-alignment area) other than the alignable area AA is based on the positional information of the alignment marks KS1 to KS3 detected in the alignable area AA. , Alignment is performed. For example, the control device 16 obtains positional information of the alignment marks KS1, KS2, and KS3 in the non-alignment area NAA by extrapolation using the positional information of the alignment marks KS1 to KS3 detected in the alignable area AA. . The control device 16 uses the positional information of the alignment marks KS1, KS2, KS3 of the alignable area AA and the non-alignment area NAA to obtain alignment data (position error of the processing area A7, minute rotation error, orthogonality error or A parameter value or correction coefficient value etc. related to the error etc. is generated.

  The positional information of the alignment marks KS1, KS2, and KS3 in the non-alignment area NAA is obtained by extrapolation or the like, and is not based on actual measurement. For this reason, in the non-alignment area NAA, there is a possibility that the alignment error (the decrease in the accuracy of the parameter value or the correction coefficient value) becomes larger than the alignable area AA. And overlay accuracy) tends to decrease. The dimension of the non-alignment area NAA in the longitudinal direction of the substrate P is Wmax-L. When Wmax-L becomes larger than the alignment length L, the alignment error is enlarged, and as a result, the accuracy of drawing (exposure) decreases. In order to suppress such an alignment error, in the present embodiment, L ≧ Wmax / 3.

  FIG. 12 is a plan view showing the alignable area and the non-alignment area in the process area of the substrate. FIG. 13 is a diagram showing the relationship between the ratio of the alignment error of the end on the downstream side in the transport direction to the alignment error of the end on the upstream side in the transport direction of the processing area A7 and the alignable area in the longitudinal direction of the substrate P. It is. As shown in FIG. 12, an end A7L on the transport direction (direction indicated by arrow DD in FIG. 12) side of the processing area A7 of the substrate P is an end on the alignable area AA side. The end A7T on the downstream side of the processing area A7 of the substrate P in the transport direction (the direction opposite to the direction indicated by the arrow DD in FIG. 12) is an end on the non-alignment area NAA side. As shown in FIG. 12, the alignable area AA is on the transfer direction DD side of the processing area A <b> 7 of the substrate P.

  In FIG. 13, the vertical axis ER can occur at the end A7T of the processing area A7 on the downstream side in the transport direction DD with respect to the alignment error ERL that may occur at the end A7L on the transport direction DD side of the processing area A7. The ratio of the alignment error ERT (error ratio) ERT / ERL is shown. The errors ERL and ERT are alignment errors that may occur at the time of exposure. The exposure error is the difference between the position of a predetermined pattern drawn by the drawing modules UW1, UW3, UW5, etc. of the drawing apparatus 11 and the position on the substrate P where the predetermined pattern is to be drawn originally .

  In exposure, the alignment microscope AM1 reads the alignment marks KS1, KS2, and KS3 present in the alignable area AA, and the control device 16 performs alignment based on the read result, and the drawing modules UW1, UW3, and so on of the drawing device 11. A predetermined pattern is exposed (drawn) on the surface of the substrate P using UW 5 or the like. The horizontal axis AAR in FIG. 13 is the ratio of the length L of the alignable area AA in the longitudinal direction of the substrate P to the maximum exposure length Wmax of the processing area A7. Since the length of the alignable area AA in the longitudinal direction of the substrate P is the alignment length L, the ratio AAR is represented by L / Wmax.

  The error ratio ER can be roughly obtained by calculation of a lever ratio (Wmax-L) / L of the dimension Wmax-L and the alignment length L. The error ratio ER is inversely proportional to the alignment length L because it depends on the above-described lever ratio. For this reason, as shown in FIG. 13, when the alignable area AA decreases, that is, the ratio AAR decreases, the error ratio ER rapidly increases. Although it is preferable that the alignment accuracy be uniform throughout the processing area A7, the error ratio ER can be allowed up to about 2 as a rule of thumb. In order to keep the error ratio ER within 2, it is preferable to set the ratio AAR = 1/3, that is, L ≧ Wmax / 3. Although it depends on the alignment accuracy required for the device manufacturing system 1 shown in FIG. 1 and the diameter of the rotating roller AR, L ≧ Wmax / 3 is preferable, and L ≧ Wmax / 2 is more preferable. In this way, alignment accuracy and drawing accuracy can be ensured without making the rotation roller AR unobtrusively large, and the alignment microscope AM1 can be disposed without difficulty. In FIG. 13, L = Wmax / 2 at a ratio AAR = 0.5 (1/2), and an alignment error ERL that can occur at the end A7L on the upstream side of the processing area A7 according to the relationship of the leverage ratio. Since the absolute value) and the alignment error ERT (absolute value) that can occur at the downstream end A7T of the processing area A7 are substantially equal, the error ratio ER is approximately 1.

(First modification)
FIG. 14 is a view showing an exposure apparatus according to a first modification. FIG. 15 is a plan view showing an area which can be aligned in the longitudinal direction of the substrate supported by the upstream cylindrical member (rotary drum DRM) provided on the upstream side of the transport direction of the substrate P shown in FIG. . In the example described above, the alignment microscope AM1 and the drawing modules UW1, UW3, and UW5 are provided at positions where L / 3LWmax. The present modification shows an exposure apparatus EXa in the case where such an arrangement can not be adopted due to the specifications of the apparatus of the exposure apparatus EX.

  The exposure apparatus EXa shown in FIG. 14 includes, in addition to the rotary drum DR, the drawing apparatus 11, and the alignment microscopes AM1 and AM2, an upstream rotary drum DRM as an upstream cylindrical member and an upstream reference pattern detection unit. And upstream alignment microscope AM3. The upstream rotary drum DRM is provided on the upstream side of the transport direction DD of the substrate P with respect to the rotary drum DR as a cylindrical member, and transports the substrate P while supporting the substrate P over a predetermined circumferential range of the cylindrical outer peripheral surface. It is a cylindrical member. The upstream rotary drum DRM has the same structure (the same material and the same diameter) as the upstream rotary drum DRM. The upstream rotary drum DRM is rotated by a drive source such as a motor around the rotation center axis AX3.

  The upstream alignment microscope AM3 has the same structure as the alignment microscopes AM1 and AM2 described above and is provided in three sets in the Y direction, and includes an objective lens system GA and an imaging system GD. The upstream alignment microscope AM3 is disposed to face the outer circumferential surface of the upstream rotary drum DRM. The distance along the substrate P from each observation area (detection area) Vw7, Vw8, Vw9 of the upstream alignment microscope AM3 (3 sets) to the exposure area TR of the drawing apparatus 11 is equal to or larger than the maximum exposure length Wmax. It is set.

  Similar to the alignment microscopes AM1 and AM2, the upstream alignment microscope AM3 has a plurality (three in the present modification) of 1 in the Y direction, ie, in a direction (width direction) parallel to the rotation center axis AX3 of the upstream rotary drum DRM. Are arranged in columns. The upstream alignment microscope AM3 sequentially detects positional information on a plurality of alignment marks KS1, KS2, and KS3 on the substrate P supported and transported by the upstream rotary drum DRM. The plurality of upstream alignment microscopes AM3 sequentially detect the alignment marks KS1, KS2, and KS3 in the observation areas (detection areas) Vw7, Vw8, and Vw9, respectively. Furthermore, the rotational angle position of the upstream rotary drum DRM is precisely measured by the same encoder system (scale part GPa and encoder head EN) as the rotary drum DR. The encoder head is arranged in the same direction as the installation direction line Le5 of the upstream alignment microscope AM3 in the XZ plane.

  The control device 16 of the exposure apparatus EXa detects the position information of the alignment marks KS1, KS2, and KS3 of the processing area A7 of the substrate P detected by the upstream alignment microscope AM3 and the processing area A7 of the substrate P detected by the alignment microscope AM1. The substrate P is aligned at the time of drawing (exposure) based on the positional information of the alignment marks KS1, KS2, and KS3. The upstream alignment microscope AM3 can detect positional information of the alignment marks KS1, KS2, and KS3 over the entire processing area A7 of the substrate P. The control device 16 uses the positional information of the alignment marks KS1, KS2, and KS3 of the entire processing area A7 of the substrate P detected by the upstream alignment microscope AM3 to align the alignment result in the entire processing area A7 and the alignable area. Find the relationship with the alignment result in AA.

  In the drawing (exposure) of the drawing apparatus 11, the control device 16 detects the alignment microscope AM1 disposed on the downstream side in the transfer direction DD of the substrate P, and detects the alignment mark KS1 existing in the processing area A7 of the substrate P Among the positional information of KS2 and KS3, pattern exposure is started using the positional information of alignment marks KS1, KS2 and KS3 of a part of the processing area A7 of the substrate P, ie, the alignable area AA. At that time, the control device 16 uses the relationship between the alignment result in the entire processing area A7 already obtained by the upstream alignment microscope AM3 and the alignment result in the alignable area AA to use the alignment mark KS1 of the alignable area AA. The alignment data of the entire processing area A7 is generated from the position information of KS2 and KS3. The control device 16 controls the drawing device 11 to draw on the surface of the substrate P while performing alignment (position shift correction, minute rotation correction, orthogonality correction, expansion / contraction correction, etc.) using the generated alignment data. ).

  The distances between the observation areas Vw7, Vw8, Vw9 of the upstream alignment microscope AM3 and the observation areas (detection areas) Vw1 to Vw3 of the alignment microscope AM1 are known in advance. Therefore, in the control device 16, the distance by which the substrate P is transported from the position of the alignment marks KS1, KS2, KS3 detected by the upstream alignment microscope AM3 and the same alignment marks KS1, KS2, KS3 are moved (transport distance) Thus, the relative positional relationship between the alignment marks KS1, KS2, and KS3 and the observation areas (detection areas) Vw1 to Vw3 of the alignment microscope AM1 can be obtained. Similarly, the control device 16 takes time for moving the same alignment marks KS1, KS2, KS3 by transporting the substrate P from the position of the alignment marks KS1, KS2, KS3 detected by the upstream alignment microscope AM3. The relative positional relationship between the alignment marks KS1, KS2, and KS3 and the observation areas (detection areas) Vw1 to Vw3 of the alignment microscope AM1 can also be determined by (conveyance time).

  Based on this relative positional relationship, the control device 16 determines that the alignment marks KS1, KS2, KS3 identical to the alignment marks KS1, KS2, KS detected by the upstream alignment microscope AM3 are the observation areas of the alignment microscope AM1 (detection area ) At the timing when Vw1 to Vw3 are reached, the alignment microscope AM1 is made to detect the alignment marks KS1, KS2, and KS3. As described above, the control device 16 controls the position information of the alignment marks KS1, KS2, and KS3 present in the alignable area AA of the substrate P detected by the alignment microscope AM1, and the target of the substrate P detected by the upstream alignment microscope AM3. Based on the positional information of the alignment marks KS1, KS2, and KS3 present in the entire processing area A7, alignment data used when the drawing device 11 performs drawing (exposure) is generated.

  As described above, the control device 16 determines the drawing modules UW1, UW3, and so on of the drawing apparatus 11 based on the position information of the alignment marks KS1, KS2, and KS3 detected by the alignment microscope AM1 on the drawing apparatus 11 side and the conveyance distance or conveyance time. The timing at which the UW 5 and the drawing modules UW 2 and UW 4 draw on the surface of the substrate P is controlled. At this time, the control device 16 controls the drawing device 11 while aligning the substrate P as described above based on the positional information of the alignment marks KS1, KS2, and KS3 detected by the upstream alignment microscope AM3 and the alignment microscope AM1. Then, a predetermined pattern is drawn (exposed) on the surface of the substrate P.

  An example of generation of alignment data used at the time of drawing (exposure) of the drawing apparatus 11 will be described. As described above, the control device 16 uses the positional information of the alignment marks KS1, KS2, and KS3 of the entire processing area A7 of the substrate P detected by the upstream alignment microscope AM3 to obtain alignment data for the entire processing area A7. (1st information) is generated. Further, the control device 16 generates alignment data (second information) in the entire processing area A7 using the positional information of the alignment marks KS1, KS2, and KS3 of the alignable area AA. In the case of obtaining the second information, the position information of the non-alignment area NAA is obtained, for example, by extrapolation using the position information of the alignment marks KS1, KS2, and KS3 of the alignable area AA. The control device 16 uses the position information of the alignment marks KS1, KS2 and KS3 of the alignable area AA and the position information of the non-alignment area NAA obtained by extrapolation etc. (3rd information) is generated. For example, the control device 16 obtains the difference between the first information and the second information, and stores the difference as, for example, a storage unit.

  When the substrate P is transported to the rotary drum DR, the alignment microscope AM1 on the drawing device 11 side detects positional information of the alignment marks KS1, KS2, and KS3 of the substrate P. The control device uses the positional information of the alignment marks KS1, KS2, and KS3 of the alignable area AA detected by the alignment microscope AM1, as described above, the alignment data (third information) for the entire processing area A7. Generate

  Further, the control device 16 corrects the third information using the relationship (difference) between the first information and the second information to generate alignment data (fourth information) in the entire processing area A7. The control device 16 controls the drawing device 11 to perform drawing (exposure) on the surface of the substrate P while performing alignment using the fourth information. By doing this, in the present modification, the alignment accuracy and the drawing accuracy can be secured without making the diameters of the rotary drum DR and the upstream rotary drum DRM indefinitely, and the alignment microscope AM1 can be disposed reasonably. Can. In this modification, the positional information of the alignment mark of the alignable area AA detected by the alignment microscope AM1 on the drawing apparatus 11 side is used by using the positional information of the alignment mark of the entire processing area A7 detected by the upstream alignment microscope AM3. The data for alignment of the whole to-be-processed area A7 based on this may be calculated | required, The method is not limited to what was mentioned above.

  In this modification, the arrangement of the exposure region TR of the drawing apparatus 11 and the outer peripheral surface of the upstream side rotary drum DRM in the predetermined circumferential range in which the outer peripheral surface of the rotary drum DR on the drawing apparatus 11 supports the substrate P The arrangement of the observation areas Vw7, Vw8 and Vw8 of the upstream alignment microscope AM3 within the predetermined circumferential range to be supported is substantially the same. In this modification, the angle between the orientation line Le1 of the drawing modules UW1, UW3, UW5 of the drawing apparatus 11 disposed on the upstream side in the transport direction DD of the substrate P and the central plane p3, and the upstream alignment microscope AM3. The angle between the installation azimuth line Le5 and the central plane p4 is −θ. The center plane p4 is a plane including the rotation center axis AX3 of the upstream rotary drum DRM and parallel to the center plane p3. By doing this, the relationship between the posture of the substrate P at the detection position of the alignment marks KS1, KS2, and KS3 and the posture of the substrate P at the drawing (exposure) position can be made similar.

  The tension of the substrate P wound around the upstream rotary drum DRM is adjusted by the tension adjustment rollers RTU1 and RTU2. The control device 16 controls the tension adjustment rollers RTU1 and RTU2 of the upstream rotary drum DRM and the tension adjustment rollers RT1 and RT2 of the rotary drum DR to control the substrate P between the upstream rotary drum DRM and the rotary drum DR. Make tension constant. In this way, the state of the substrate P can be made similar between the upstream side rotating drum DRM and the rotating drum DR, so that the detection accuracy of the position information of the alignment marks KS1, KS2, KS3 is suppressed from being lowered. it can.

(2nd modification)
The alignment length L is preferably as short as possible. However, when alignment and drawing (exposure) are simultaneously performed, as the length L is shortened, the non-alignment area NAA becomes large, so that the area for obtaining positional information by extrapolation becomes large. As a result, alignment errors may be large. In this modification, drawing (exposure) is performed continuously while continuously aligning without using the condition of L ≧ Wmax / 3.

  FIG. 16 is a diagram for explaining the continuous alignment according to the second modification. 17 and 18 show examples of linear interpolation. The second modification is realized by using the exposure apparatus EX shown in FIG. The exposure apparatus EX includes two rows of alignment microscopes AM1 and AM2, but the alignment microscope may have one row or three or more rows. The alignment microscope AM1 included in the exposure apparatus EX detects positional information of the alignment marks KS1, KS2, and KS3 provided on the surface of the substrate P. As shown in FIG. 16, three alignment marks KS1, KS2, and KS3 are arranged in the width direction (Y direction) of the substrate P, and at predetermined intervals in the longitudinal direction (X direction) of the substrate P. Multiple rows are formed. The alignment marks KS1, KS2, and KS3 are discretely arranged at regular intervals (design values) in the longitudinal direction of the substrate P. The alignment microscope AM1 sequentially detects the alignment marks KS1, KS2, and KS3 one by one while transporting the substrate P.

  The control device 16 is attached to the leading portion in the longitudinal direction of the processing area A7 among the alignment marks KS1, KS2, and KS3 provided in the longitudinal direction of the substrate P accompanying the processing area A7 on the substrate P When the first position information regarding the alignment marks KS1, KS2, and KS3 is detected by the alignment microscope AM1, the processing position of the leading part of the processing area A7 is specified. For example, when the first position information on the alignment marks KS1, KS2, and KS3 attached to the partial area X1 of the processing area A7 as the leading portion is detected by the alignment microscope AM1, the control device 16 Data for alignment of the partial region X1 is generated, and the processing position of the drawing device 11 is specified.

  When continuous writing (exposure) is performed while performing continuous alignment, alignment data for the entire surface of the processing area A7 can not be generated in advance before writing (exposure). For this reason, the control device 16 performs pattern exposure while sequentially interpolating alignment data obtained for each of the partial areas X1, X2, X3, and X4 of the processing area A7. The control device 16 detects the second position information about the alignment mark KS1, KS2, KS3 attached to the subsequent part in the longitudinal direction of the processing area A7, in this example, the partial area X2, by the alignment microscope AM1. The processing position of the partial area X2 of the processing area A7 and the processing position between the partial area X1 and the partial area X2 are specified by interpolation using the first position information.

  The example shown in FIG. 16 uses one-dimensional error components (X) as alignment data for partial areas X1, X2, X3 and X4 using the positional information of three marks KS1, KS2 and KS3 arranged in the Y direction. The directional positional deviation component, the Y direction positional deviation component, the minute inclination component with respect to the Y axis, the expansion and contraction component in the Y direction, etc. are calculated. The alignment data may include non-linear components (such as curvature). FIG. 17 shows an example of alignment data (error component of positional deviation) Sx in the X direction in partial areas X1, X2, X3 and X4. FIG. 18 shows the Y direction in partial areas X1, X2, X3 and X4. An example of alignment data (error component of positional deviation) Sy is shown. Alignment data Sx and Sy of partial regions X1, X2, X3 and X4 are interpolated between partial regions X1, X2, X3 and X4 to obtain alignment data. Interpolation is one-dimensional. The examples shown in FIGS. 17 and 18 are linear interpolations, but the interpolation method is not limited thereto.

  FIGS. 19 to 21 are diagrams for explaining another example of the continuous alignment according to the second modification. In the example shown in FIG. 19, three marks KS1, KS2, and KS3 arranged in a line in the Y direction on the surface of the substrate P, and three marks for one line adjacent to the line and the X direction (transport direction DD) The alignment data is used as a two-dimensional error component using the position information of the six marks for each of the block regions X1, X2, X3 ... surrounded by a total of six marks of KS1, KS2, and KS3. Interpolation between each block area X1, X2, X3... Is one-dimensional.

  The example shown in FIG. 20 corresponds to approximately a half area of the substrate P in the Y direction (width direction) using positional information of two marks KS1 and KS2 or KS2 and KS3 aligned along the Y direction. The alignment data for each of the partial areas X1Y1, X1Y2, X2Y1, X2Y2,... Is calculated as a one-dimensional error component, and interpolation is two-dimensional.

  In the example shown in FIG. 21, a block area X1Y1, X1Y2, X2Y1, which is surrounded by a total of four marks of two marks adjacent in the X direction and two marks adjacent in the Y direction. The data for alignment is calculated as a two-dimensional error component using X2Y2,... And the position information of four marks corresponding to each block area, and the interpolation is also two-dimensional.

  According to the second modification, the alignment accuracy and the drawing accuracy can be secured without making the rotating drum DR unobtrusively. In addition, since drawing (exposure) can be performed continuously while continuously aligning without using the condition of L ≧ Wmax / 3, the freedom degree of the position for arranging the alignment microscope AM1 is also improved.

  The control device 16 is for alignment data obtained by interpolation for every partial region X1, X2, X3, X4... Or for each block region X1Y1, X1Y2, X2Y1, X2Y2. Using the data, the drawing device 11 is controlled while performing alignment continuously, and drawing (exposure) is performed on the surface of the substrate P. Preferably, at least two (two rows) of a plurality of alignment marks KS1, KS2, and KS3 discretely arranged in the longitudinal direction of the substrate P are included in the alignment length L. In this way, the control device 16 can interpolate alignment data generated based on the position information of the mark within the alignment length L, using the alignment data already obtained. As described above, in the present embodiment and the modification, since the drawing (exposure) operation by the drawing device 11 can always be started after performing the interpolation calculation process, it is possible to suppress a decrease in alignment accuracy and a decrease in drawing accuracy. .

  The present embodiment, the first modification, and the second modification described above exemplify the exposure apparatus as the substrate processing apparatus. The substrate processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, by an ink drop apparatus of inkjet. In this case, for example, a head unit that ejects an ink jet is installed at a position corresponding to the exposure region TR (processing region) shown in FIG. Also, the processing unit may be an inspection device. In the embodiment, the first modification, and the second modification described above, a so-called raster scan type drawing exposure apparatus which does not use a mask is an example of a substrate processing apparatus, but DMDs (micro-mirrors other than raster scan type) A device-type maskless exposure apparatus may be used. Furthermore, a projection exposure apparatus for exposing a flat mask or a cylindrical mask pattern onto the substrate P via a projection optical system, a contact exposure apparatus for bringing the flat mask or a cylindrical mask into contact with the substrate P or a mask and the substrate P with a predetermined gap It may be a proximity exposure apparatus to face each other.

(Device manufacturing method)
FIG. 22 is a flowchart showing the procedure of a device manufacturing method for manufacturing a device using the substrate processing apparatus (exposure apparatus) according to the embodiment. In this device manufacturing method, first, function / performance design of a display panel is performed by a self light emitting element such as an organic EL, and a necessary circuit pattern and a wiring pattern are designed by CAD or the like (step S201). In addition, a supply roll on which a flexible substrate P (a resin film, a metal foil film, a plastic or the like) to be a base material of the display panel is wound is prepared (step S202). The roll-like substrate P prepared in this step S202 has its surface modified as necessary, a base layer (for example, minute unevenness by imprint method) formed in advance, photosensitive material It may be a laminate of a functional film or a transparent film (insulating material) in advance.

  Next, on the substrate P, a backplane layer having electrodes, wirings, insulating films, TFTs (thin film semiconductors) and the like constituting the display panel device is formed, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the light emitting element (step S203). Although this step S203 includes the conventional photolithography process of exposing the photoresist layer using the exposure apparatus EX, EXa described in the previous embodiments, a photosensitive silane coupling material is used instead of the photoresist. Pattern exposure of the substrate P coated with the above to form a pattern of hydrophilicity and water repellency on the surface, pattern exposure of the photosensitive catalyst layer and formation of metal film patterns (wirings, electrodes, etc.) by electroless plating Processing by a wet process or a printing process of drawing a pattern with a conductive ink containing silver nanoparticles is also included.

  Then, the substrate P is diced for each display panel device continuously manufactured on a long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A sheet or the like is attached to assemble a device (step S204). Then, an inspection process is performed to determine whether the display panel device functions properly or satisfies the desired performance or characteristics (step S205). Thus, a display panel (flexible display) can be manufactured.

  Further, the exposure apparatus of the embodiment described above assembles various sub-systems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy and optical accuracy. Manufactured. In order to ensure these various accuracies, before and after assembly of the exposure apparatus, adjustments for achieving optical accuracy for various optical systems, adjustments for achieving mechanical accuracy for various mechanical systems, various electric systems The system is tuned to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection between the various subsystems, wiring connection of electric circuits, piping connection of pressure circuits, and the like. It goes without saying that there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to secure various accuracies as the entire exposure apparatus. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature and the degree of cleanliness are controlled.

  Moreover, the components of the embodiment described above can be combined as appropriate. In addition, some components may not be used. Furthermore, component replacements or changes can be made without departing from the scope of the present invention. Further, as far as the laws and regulations permit, the disclosures of all of the published publications and the U.S. Patents related to the exposure apparatus and the like cited in the above embodiments are incorporated herein by reference. Thus, all other embodiments and operation techniques and the like made by those skilled in the art based on the above-described embodiments are included in the scope of the present invention.

  As mentioned above, although this embodiment and its modification were explained, this embodiment and its modification are not limited by the contents mentioned above. Further, constituent elements of the above-described embodiment and the modifications thereof include those which can be easily conceived by those skilled in the art, substantially the same ones, and so-called equivalent ranges. Furthermore, the components described above can be combined as appropriate. In addition, various omissions, substitutions, and changes of the constituent elements can be made without departing from the scope of the present embodiment and the modifications thereof.

11 drawing apparatus 12 substrate conveyance mechanism 13 apparatus frame 14 rotational position detection mechanism 16 control device 31 calibration detection system A7 processed area AA alignment possible area AM1, AM2 alignment microscope AM3 upstream alignment microscope DR rotating drum DRM rotating drum DRM upstream rotating drum EN1 , EN2, EN3, EN4 Encoder head EX, EXa Exposure system GA Objective lens system GA1, GA2, GA3 Objective lens system GD Imaging system GPa, GPb Scale part KS1, KS2, KS3 Alignment mark LB Drawing beam LL1, LL2, LL3, LL4 , LL5 drawing lines NAA non-alignment area P substrate TR processing areas UW, UW1, UW2, UW3, UW4, UW5 drawing modules Vw1, Vw1, Vw2, Vw3, Vw4, Vw5, Vw6, Vw7 each observation area W exposure length

Claims (9)

A rotating drum which rotates around a predetermined central axis and supports a long photosensitive substrate along an outer peripheral surface of a constant radius from the central axis, and is transported in the long direction by the rotation of the rotating drum An exposure apparatus for drawing a pattern on the substrate.
In the exposure area set on the substrate supported by the outer peripheral surface of the rotating drum, the beam for drawing the pattern is formed with a predetermined length in the direction of the central axis and the circumferential direction of the outer peripheral surface. A drawing apparatus for sequentially drawing the pattern on a processing target area on the substrate, wherein the length in the longitudinal direction is set longer than the exposure area by scanning in the direction of the central axis;
Each of a plurality of marks formed incidentally to the processing area on the substrate at regular intervals along the longitudinal direction is set upstream of the exposure area with respect to the transport direction of the substrate A mark detection unit provided around the rotating drum so as to sequentially detect in the area;
A control unit that controls the drawing apparatus based on position information on the marks sequentially detected in the detection area of the mark detection unit, and a transport distance or transport time of the substrate from the detection area to the exposure area. And
The control unit is configured to select first position information regarding the mark attached to the leading part in the longitudinal direction of the processing area among the plurality of marks provided incidentally to the processing area on the substrate. When detected by the mark detection unit, the drawing position of the leading part of the processing area is specified, and subsequently, the second position information on the mark attached to the trailing part of the processing area in the longitudinal direction is the mark When detected by the detection unit, the drawing position of the subsequent portion of the processing area is specified by interpolation using the first position information.
Exposure device. The exposure apparatus according to claim 1,
Assuming that the transport distance of the substrate from the detection region to the exposure region is L, and the length of the processing region on the substrate in the longitudinal direction is Wmax, the transport distance L and the length Wmax The relationship is set to satisfy L ≧ Wmax / 3,
Exposure device. The exposure apparatus according to claim 2,
The relationship between the transport distance L and the length Wmax is set to further satisfy L ≧ Wmax / 2.
Exposure device. An exposure apparatus according to claim 2 or 3, wherein
At least two of the plurality of marks arranged at constant intervals along the longitudinal direction of the substrate are set so as to be included within the transport distance L from the detection area to the exposure area.
Exposure device. The exposure apparatus according to claim 4,
The plurality of marks are formed in a plurality of first marks formed in one peripheral area in the direction in which the central axis of the processing area extends, and a plurality of marks formed in the other peripheral area in the direction in which the central axis extends And the second mark of
The mark detection unit
A first alignment microscope arranged to sequentially detect the first mark in the detection area, and a second alignment microscope arranged to sequentially detect the second mark in the detection area; including,
Exposure device. The exposure apparatus according to claim 5,
The plurality of marks further include a plurality of third marks formed at predetermined intervals in the longitudinal direction substantially at the center of the direction in which the central axis extends on the substrate.
The mark detection unit further includes a third alignment microscope arranged to sequentially detect the third mark in the detection area.
Exposure device. The exposure apparatus according to any one of claims 1 to 6, wherein
The control unit is based on the first position information detected by the mark detection unit or the second position information in order to specify the drawing position of the pattern on the processing area by the drawing apparatus. To generate a parameter value or a correction coefficient value related to the position error, the minute rotation error, the orthogonality error, or the stretching error of the processing region.
Exposure device. The exposure apparatus according to any one of claims 1 to 6, wherein
The drawing apparatus includes a plurality of drawing modules which are disposed separately in the circumferential direction of the outer peripheral surface of the rotary drum and in the direction of the central axis, respectively, and scan the beam for drawing in the direction of the central axis. Equipped
An area surrounded by the drawing line set on the substrate by scanning of the beam from each of the plurality of drawing modules is set as the exposure area.
Exposure device. A device manufacturing method for forming a device pattern on a long photosensitive substrate, comprising:
A photoresist layer for photolithography, a photosensitive silane coupling material for forming a water-repellent pattern, and a photosensitive catalyst for forming a metal film pattern by plating on the surface of the substrate Forming any of the layers as a photosensitive layer;
Exposing the photosensitive layer of the substrate to a device pattern using the exposure apparatus according to any one of claims 1 to 8;
A device manufacturing method including:

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