JP6074898B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus.

  In an exposure apparatus used in a photolithography process, an exposure apparatus that exposes a substrate using a cylindrical or columnar mask as disclosed in the following patent document is known (for example, Patent Document 1, Patent). Reference 2).

In order not only to use a plate-shaped mask but also to expose a substrate using a cylindrical or columnar mask, positional information of the mask pattern is used to satisfactorily expose the substrate with an image of the mask pattern. Need to get accurate. Therefore, it is desired to devise a technique that can accurately acquire positional information of a cylindrical or columnar mask and can accurately adjust the positional relationship between the mask and the substrate.
Therefore, in Patent Document 3, a position information acquisition mark (scale, lattice, etc.) is formed in a predetermined area of the pattern formation surface of the mask with a predetermined positional relationship with respect to the pattern, and the mark is detected by the encoder system. Thus, a configuration for acquiring pattern position information in the circumferential direction of the pattern forming surface is disclosed.

JP-A-7-153672 JP-A-8-213305 JP 2008-76650 A

However, the following problems exist in the conventional technology as described above.
In general, in an encoder system that measures the position of a rotating body (such as a cylindrical mask) in the rotational direction, an optical read head faces a graduation line (grid) of a scale disk that is coaxially mounted on the rotating shaft of the rotating body. Is placed. If the scale line on the scale plate and the read head are relatively displaced in the direction where there is no measurement sensitivity (detection sensitivity), for example, the direction in which the distance between the scale plate and the read head is changed, the cylindrical mask and the substrate are relatively In spite of the misalignment, the encoder system cannot measure. For this reason, an error may occur in the exposed pattern.
Such a problem is not limited to the problem at the time of pattern exposure, but also occurs in mark measurement at the time of alignment, and further, it is necessary to provide an encoder system for rotation measurement and to precisely convey the substrate. It can occur in all processing and inspection equipment.

  The present invention has been made in consideration of the above points. By measuring the position of a mask or a substrate with high accuracy, high-definition processing (including inspection) can be performed on the substrate. An object of the present invention is to provide a possible substrate processing apparatus.

  According to the first aspect of the present invention, a cylindrical support surface curved from a predetermined center line with a constant radius is provided, and a part of a long substrate is wound around the support surface and rotated around the center line. A rotating cylindrical member that feeds the substrate in the longitudinal direction, and a processing mechanism that performs predetermined processing on the substrate at a specific position in the circumferential direction of the supporting surface among a portion of the substrate wound around the supporting surface of the rotating cylindrical member And a scale member that rotates around the center line together with the rotating cylindrical member to measure a change in position in the circumferential direction of the support surface of the rotating cylindrical member, or a position change in the direction of the center line of the rotating cylindrical member, There is provided a substrate processing apparatus provided with a reading mechanism that reads a scale portion that is opposed to a scale portion that is engraved in a ring shape and that is disposed in substantially the same direction as a specific position as viewed from the center line.

  According to the second aspect of the present invention, a mask holding member that holds a mask pattern along a cylindrical surface having a constant radius from a predetermined center line and is rotatable about the center line, and a cylindrical surface of the mask holding member And an illumination system that irradiates a part of the mask pattern with illumination light for exposure and a substrate support member that supports the sensitive substrate at a specific position in the circumferential direction of the mask pattern. Measures the exposure mechanism that projects the light flux generated from the surface onto the exposed surface of the substrate in a predetermined exposure format and the change in the circumferential position of the cylindrical surface of the mask holding member or the change in the position of the center line of the mask holding member In order to do so, the scale member that rotates around the center line together with the mask holding member, and the scale portion that is engraved in an annular shape on the scale member, are arranged in the same direction as the specific position as viewed from the center line, The substrate processing apparatus and a reading mechanism for reading the scale portion is provided.

  According to the third aspect of the present invention, there is provided a cylindrical support surface that is curved with a constant radius from a predetermined center line, and is rotatable around the center line. Among them, in a specific range in the circumferential direction, a substrate transport mechanism that transports the substrate in the long direction while supporting a long flexible substrate, and a specific formed discretely or continuously on the substrate in the long direction A pattern detection device including a detection probe for detecting a pattern, and arranged around the rotating cylindrical member so that a detection region by the detection probe is set within a specific range, and a circumferential direction of the support surface of the rotating cylindrical member In order to measure the change in position of the rotating cylinder member or the changing position in the direction of the center line of the rotating cylindrical member, the scale member that rotates around the center line together with the rotating cylindrical member, and the scale portion that is engraved in an annular shape on the scale member And the center line Is disposed substantially in the same direction as the detection area viewed, the substrate processing apparatus and a reading mechanism for reading the scale portion is provided.

  In the present invention, highly accurate substrate processing can be performed by detecting the position of the detection target with high accuracy.

The figure which shows the structure of a device manufacturing system. The figure which shows the whole structure of the processing apparatus (exposure apparatus) by 1st Embodiment. The figure which shows arrangement | positioning of the illumination area | region and projection area | region in the same exposure apparatus. 2 is a diagram showing a configuration of a projection optical system applied to the exposure apparatus. FIG. The external appearance perspective view of rotating drum DR5. The figure which looked at the scale disk SD which concerns on 2nd Embodiment in rotation center line AX2. The figure which shows the rotating drum DR which concerns on 3rd Embodiment. The external appearance perspective view of rotary drum DR which concerns on 4th Embodiment. The front view of the rotation drum DR. The figure which shows the whole structure of the processing apparatus which concerns on 5th Embodiment. The partial detail drawing of the 1st drum member which has scale part GPMR and GPMT. The schematic block diagram of speed measuring device SA. It is a flowchart which shows the device manufacturing method of embodiment. The figure which shows the reading mechanism of another form. The figure which shows the reading mechanism of another form. The figure which shows the reading mechanism of another form.

(First embodiment)
Hereinafter, a first embodiment of a substrate processing apparatus of the present invention will be described with reference to FIGS.
FIG. 1 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS of the present embodiment. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 is sequentially passed through n processing devices U1, U2, U3, U4, U5,... Un to the collection roll FR2. An example of winding up is shown. The host control device CONT performs overall control of the processing devices U1 to Un constituting the production line.

  In FIG. 1, the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set to the Y direction. Shall be. The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may have a fine partition structure (uneven structure) for precise patterning formed on the surface.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and conveyed to the processing device U1, and the center of the substrate P in the Y direction (width direction) is set by the edge position controller EPC1. Servo control is performed so as to be within a range of about ± 10 μm to several tens μm with respect to the position.

  The processing device U1 continuously applies a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) to the surface of the substrate P by a printing method with respect to the transport direction (long direction) of the substrate P or This is a coating apparatus for selectively coating. In the processing apparatus U1, a coating mechanism including a pressure drum DR2 around which the substrate P is wound, and a coating roller for uniformly coating the photosensitive functional liquid on the surface of the substrate P on the pressure drum DR2. Gp1, a drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided.

  The processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) to stably adhere the photosensitive functional layer applied to the surface. It is a heating device. In the processing apparatus U2, a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows: A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the ambient temperature of the post-process (processing device U3).

  The processing apparatus U3 as the substrate processing apparatus is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2 with ultraviolet patterning light corresponding to a circuit pattern or a wiring pattern for display. is there. In the processing apparatus U3, an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension, and the substrate A rotary drum DR5 that supports a pattern exposed portion on P in a uniform cylindrical surface, and two sets of drive rollers DR6 and DR7 for providing a predetermined slack (play) DL to the substrate P are provided. ing.

Further, in the processing apparatus U3, a transmissive cylindrical mask DM, an illumination mechanism IU provided in the cylindrical mask DM and illuminating a mask pattern formed on the outer peripheral surface of the cylindrical mask DM, and a cylinder by a rotating drum DR5 are provided. A projection optical system PL that projects an image of a portion of the mask pattern of the cylindrical mask DM onto a portion of the substrate P that is supported in a planar shape, and the image of the portion of the projected mask pattern and the substrate P are relatively aligned. In order to (align), alignment microscopes AM1 and AM2 for detecting an alignment mark or the like formed in advance on the substrate P are provided.
A more detailed configuration of the processing device U3 will be described later.

  The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, and the like on the photosensitive functional layer of the substrate P conveyed from the processing device U3. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nip driving roller DR8, and the like.

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un in the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1. Also during the winding, the edge position controller EPC2 controls the Y of the drive roller DR1 and the recovery roll FR2 so that the center in the Y direction (width direction) of the substrate P or the substrate end in the Y direction does not vary in the Y direction. The relative position in the direction is successively corrected and controlled.

The board | substrate P used by this embodiment is foil (foil) etc. which consist of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.
As the substrate P, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that the amount of deformation caused by heat in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.

  The device manufacturing system SYS of this embodiment is a so-called roll-to-roll system in which various processes for manufacturing one device are continuously performed on the substrate P. The substrate P that has been subjected to various processes is divided (diced) into devices (for example, a display panel of an organic EL display) to form a plurality of devices. As for the dimension of the substrate P, for example, the dimension in the width direction (short Y direction) is about 10 cm to 2 m, and the length direction (long X direction) is 10 m or more.

  Next, the configuration of the processing apparatus U3 of the present embodiment will be described with reference to FIGS. FIG. 2 is a diagram illustrating an overall configuration of the processing device U3 according to the present embodiment. The processing apparatus U3 shown in FIG. 2 includes an exposure apparatus (processing mechanism) EX that performs an exposure process and at least a part of the transport apparatus 9.

  The exposure apparatus EX of the present embodiment is a so-called scanning exposure apparatus, and synchronously drives the rotation of the cylindrical mask DM and the feeding of the flexible substrate P, and images the pattern formed on the cylindrical mask DM. The projection magnification is projected onto the substrate P through the projection optical system PL (PL1 to PL6) having the same magnification (× 1). 2 to 5, the Y axis of the orthogonal coordinate system XYZ is set in parallel with the rotation center line AX1 of the cylindrical mask DM, and the X axis is the direction of scanning exposure, that is, the transport direction of the substrate P at the exposure position. Set to.

  As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The processing device U3 rotates and moves the cylindrical mask DM held by the mask holding device 12, and transfers the substrate P by the transfer device 9. The illumination mechanism IU illuminates a part of the cylindrical mask DM (illumination region IR) held by the mask holding device 12 with a uniform brightness by the illumination light beam EL1. The projection optical system PL projects the image of the pattern in the illumination area IR on the mask M onto a part of the substrate P (projection area PA) being transported by the transport device 9. As the mask M moves, the part on the cylindrical mask DM arranged in the illumination area IR changes, and as the substrate P moves, the part on the substrate P arranged in the projection area PA changes. Thus, an image of a predetermined pattern (mask pattern) on the cylindrical mask DM is projected onto the substrate P. The control device 14 controls each part of the exposure apparatus EX and causes each part to execute processing. In the present embodiment, the control device 14 controls at least a part of the transport device 9.

  The control device 14 may be a part or all of the host control device CONT of the device manufacturing system SYS. Further, the control device 14 may be controlled by the host control device CONT and may be a device different from the host control device CONT. The control device 14 includes, for example, a computer system. The computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices. The operation process of each unit of the processing device U3 is stored in a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing the program. When the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment). The computer-readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, and a CD-ROM, and a storage device such as a hard disk built in the computer system. A computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients. Further, the program may be a program for realizing a part of the function of the processing device U3, or may be a program capable of realizing the function of the processing device U3 in combination with a program already recorded in the computer system. The host control device CONT can be realized using a computer system in the same manner as the control device 14.

  As shown in FIG. 2, the mask holding device 12 includes a first drum member 21 that holds a cylindrical mask DM, a guide roller 23 that supports the first drum member 21, a drive roller 24 that drives the first drum member 21, a first roller 24. The 1st detector 25 which detects the position of 1 drum member 21, and the 1st drive part 26 are provided.

  The first drum member 21 forms a first surface P1 on which the illumination area IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (first central axis AX1) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like. The first drum member 21 is made of, for example, glass or quartz and has a cylindrical shape with a certain thickness, and an outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1.

  The cylindrical mask DM is produced as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer such as chrome on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 to 500 μm). It is used in a state where it is curved along the outer peripheral surface of the first drum member 21 and wound (attached) around the outer peripheral surface. The cylindrical mask DM has a pattern non-formation region where no pattern is formed, and is attached to the first drum member 21 in the pattern non-formation region. The cylindrical mask DM can be released with respect to the first drum member 21.

  The cylindrical mask DM is made of an ultrathin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of the transparent cylindrical base material. Alternatively, a mask pattern formed by a light shielding layer may be drawn and integrated. Also in this case, the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.

  The first detector 25 optically detects the rotational position of the first drum member 21 and is composed of, for example, a rotary encoder. The first detector 25 supplies information (such as a two-phase signal from the encoder head) indicating the detected rotational position of the first drum member 21 to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts the torque for rotating the drive roller 24 in accordance with a control signal supplied from the control device 14. The control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result by the first detector 25. In other words, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.

  The transport device 9 includes a driving roller DR4, a first guide member 31, a rotating drum DR5 that forms a second surface p2 on which a projection area PA on the substrate P is disposed, a second guide member 33, driving rollers DR6 and DR7 (FIG. 1), a second detector 35, and a second drive unit 36.

  In the present embodiment, the substrate P that has been transported from the upstream of the transport path to the drive roller DR4 is transported to the first guide member 31 via the drive roller DR4. The substrate P that has passed through the first guide member 31 is supported on the surface of a cylindrical or columnar rotary drum DR5 having a radius r2, and is transported to the second guide member 33. The substrate P that has passed through the second guide member 33 is transported downstream of the transport path via the drive rollers DR6 and DR7. The rotation center line AX2 of the rotary drum DR5 and the rotation center lines of the drive rollers DR4, DR6, DR7 are all set to be parallel to the Y axis.

  For example, the first guide member 31 and the second guide member 33 are moved in the direction intersecting the width direction of the substrate P (moved in the XZ plane in FIG. 2), so that the tension or the like acting on the substrate P in the transport path, etc. Adjust. Further, the first guide member 31 (and the drive roller DR4) and the second guide member 33 (and the drive rollers DR6 and DR7) can be moved in the width direction (Y direction) of the substrate P, for example. The position in the Y direction of the substrate P wound around the outer periphery of the rotary drum DR5 can be adjusted. The transfer device 9 only needs to be able to transfer the substrate P along the projection area PA of the projection optical system PL, and the configuration thereof can be changed as appropriate.

  The rotating drum (rotating cylindrical member) DR5 is a second surface (supporting surface) that supports a part including the projection area PA on the substrate P onto which the imaging light beam from the projection optical system PL is projected in an arc shape (cylindrical shape). p2 is formed. In the present embodiment, the rotary drum DR5 is a part of the transport device 9 and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the rotary drum DR5 may be a part of the exposure apparatus EX. The rotating drum DR5 is rotatable around a rotation center line AX2 (hereinafter also referred to as a second center axis AX2), and the substrate P has a cylindrical surface shape following the outer peripheral surface (cylindrical surface) on the rotating drum DR5. The projection area PA is arranged in a part of the curved portion.

  In the present embodiment, the rotating drum DR5 is rotated by torque supplied from the second drive unit 36 including an actuator such as an electric motor. The second detector 35 is also composed of a rotary encoder, for example, and optically detects the rotational position of the rotary drum DR5. The second detector 35 supplies the control device 14 with information (for example, a two-phase signal from the encoder head) indicating the detected rotational position of the rotary drum DR5. The second drive unit 36 adjusts the torque for rotating the rotary drum DR5 according to the control signal supplied from the control device 14. The control device 14 controls the rotation position of the rotary drum DR5 by controlling the second drive unit 36 based on the detection result by the second detector 35, and the first drum member 21 (cylindrical mask DM) and the rotary drum are controlled. DR5 is moved synchronously (synchronized rotation). The detailed configuration of the second detector 35 will be described later.

  The exposure apparatus EX of the present embodiment is an exposure apparatus that is assumed to be equipped with a so-called multi-lens projection optical system. The projection optical system PL includes a plurality of projection modules that project some images in the pattern of the cylindrical mask DM. For example, in FIG. 2, three projection modules (projection optical systems) PL1, PL3, and PL5 are arranged at regular intervals in the Y direction on the left side of the center plane P3, and three projection modules (projection optics) are also arranged on the right side of the center plane P3. System) PL2, PL4, and PL6 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the end portions in the Y direction of the areas exposed by the plurality of projection modules PL1 to PL6 (projection areas PA1 to PA6) are overlapped with each other by scanning, thereby forming a desired pattern. Project the whole picture. In such an exposure apparatus EX, even when the size in the Y direction of the pattern on the cylindrical mask DM becomes large, and it becomes necessary to handle the substrate P having a large width in the Y direction, it is necessary to deal with the projection module. Since it is only necessary to add modules on the illumination mechanism IU side in the Y direction, there is an advantage that the panel size (the width of the substrate P) can be easily increased.

  The exposure apparatus EX may not be a multi-lens system. For example, when the dimension in the width direction of the substrate P is small to some extent, for example, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. Further, each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project a plurality of device patterns in parallel by a plurality of projection modules.

  The illumination mechanism IU of this embodiment includes a light source device (not shown) and an illumination optical system IL. The illumination optical system IL includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm). The illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL via a light guide member such as an optical fiber.

  Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses. In the present embodiment, light emitted from the light source device and passing through any one of the plurality of illumination modules IL is referred to as illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL are arranged inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination region IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

  FIG. 3 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. 3 is a plan view of the illumination area IR on the cylindrical mask DM arranged on the first drum member 21 as viewed from the −Z side (left figure in FIG. 3), and arranged on the second drum member 22. A plan view (right view in FIG. 3) of the projected area PA on the substrate P viewed from the + Z side is shown. A symbol Xs in FIG. 3 indicates a moving direction (rotating direction) of the first drum member 21 or the second drum member 22.

  Each of the plurality of illumination modules IL illuminates the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1, and the second illumination module IL illuminates the second illumination region IR2.

  The first illumination area IR1 in the present embodiment will be described as a trapezoidal area elongated in the Y direction. However, like the projection optical system (projection module) PL described later, the projection optical system is configured to form an intermediate image plane. In the case of the system, since a field stop plate having a trapezoidal aperture can be disposed at the position of the intermediate image, a rectangular region including the trapezoidal aperture may be used. The third illumination region IR3 and the fifth illumination region IR5 are regions having the same shape as the first illumination region IR1, respectively, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR2 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1 with respect to the center plane P3. The fourth illumination region IR4 and the sixth illumination region IR6 are regions having the same shape as the second illumination region IR2, respectively, and are arranged at regular intervals in the Y-axis direction.

  As shown in FIG. 3, each of the first to sixth illumination regions IR1 to IR6 has a triangular portion of a hypotenuse portion of an adjacent trapezoidal illumination region when viewed along the circumferential direction of the first surface P1. They are arranged so that they overlap (overlapping). Therefore, for example, the first region A1 on the cylindrical mask DM that passes through the first illumination region IR1 by the rotation of the first drum member 21 is the cylindrical mask DM that passes through the second illumination region IR2 by the rotation of the first drum member 21. Partly overlaps with the second region A2 above.

  In the present embodiment, the cylindrical mask DM has a pattern formation area A3 where a pattern is formed and a pattern non-formation area A4 where a pattern is not formed. The pattern non-formation region A4 is arranged so as to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation region A3 of the cylindrical mask DM moves in the direction Xs with the rotation of the first drum member 21, and each partial region in the Y-axis direction of the pattern formation region A3 is the first to sixth illumination regions IR1. Pass through any of IR6. In other words, the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A3.

  As shown in FIG. 2, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction has a one-to-one correspondence with each of the first to sixth illumination modules IL, and is illuminated by the corresponding illumination module. An image of a partial pattern of the cylindrical mask DM that appears in the illumination area IR is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1 corresponds to the first illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 3) illuminated by the first illumination module IL on the substrate P. Is projected onto the first projection area PA1. The third projection module PL3 and the fifth projection module PL5 correspond to the third to fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are arranged at a position overlapping the first projection module PL1 when viewed from the Y-axis direction.

  The second projection module PL2 corresponds to the second illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 3) illuminated by the second illumination module IL on the substrate P. Is projected onto the second projection area PA2. When viewed from the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the center plane P3.

  The fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arranged at a position overlapping the second projection module PL2.

  In the present embodiment, light reaching each illumination region IR1 to IR6 on the cylindrical mask DM from each illumination module IL of the illumination mechanism IU is an illumination light beam EL1, and the portion of the cylindrical mask DM that appears in each illumination region IR1 to IR6 The light that has undergone intensity distribution modulation according to the pattern, enters the projection modules PL1 to PL6, and reaches the projection areas PA1 to PA6 is defined as an imaging light beam EL2. In the present embodiment, out of the imaging light beam EL2 reaching the projection areas PA1 to PA6, the chief rays passing through the center points of the projection areas PA1 to PA6 are, as shown in FIG. 2, the rotation center line AX2 of the rotary drum DR5. When viewed from the center, the central plane P3 is disposed at a position (specific position) at an angle θ in the circumferential direction.

  As shown in the right diagram in FIG. 3, the pattern image in the first illumination area IR1 is projected on the first projection area PA1, and the pattern image in the third illumination area IR3 is projected on the third projection area PA3. The pattern image in the fifth illumination region IR5 is projected onto the fifth projection region PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

  The pattern image in the second illumination area IR2 is projected onto the second projection area PA2. In the present embodiment, the second projection area PA2 is arranged symmetrically with the first projection area PA1 with respect to the center plane P3 when viewed from the Y-axis direction. The pattern image in the fourth illumination area IR4 is projected on the fourth projection area PA4, and the pattern image in the sixth illumination area IR6 is projected on the sixth projection area PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

  Each of the first to sixth projection areas PA1 to PA6 is adjacent to each other in the direction parallel to the second central axis AX2 (odd and even) when viewed along the circumferential direction of the second surface p2. It arrange | positions so that the edge part (trapezoid triangular part) of each other may overlap. Therefore, for example, the third area A5 on the substrate P that passes through the first projection area PA1 by the rotation of the rotating drum DR5 is the fourth area A6 on the substrate P that passes through the second projection area PA2 by the rotation of the rotating drum DR5. And some overlap. The first projection area PA1 and the second projection area PA2 are set so that the exposure amount in the region where the third region A5 and the fourth region A6 overlap is substantially the same as the exposure amount in the non-overlapping region. The shape etc. are set.

  Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second to fifth projection modules PL5 has the same configuration as the first projection module PL1. Therefore, the configuration of the first projection module PL1 will be described on behalf of the projection optical system PL.

  The first projection module PL1 shown in FIG. 4 includes a first optical system 41 that forms an image of the pattern of the cylindrical mask DM arranged in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41. A second optical system 42 that re-images at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on the intermediate image plane P7 on which the intermediate image is formed. .

  Further, the first projection module PL1 has a focus correction optical member 44 for finely adjusting the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P, and the projection image is slightly reduced in the image plane. An image shift correcting optical member 45 for laterally shifting the image, a magnification correcting optical member 47 for slightly correcting the magnification of the projected image, and a rotation correcting mechanism 46 for slightly rotating the projected image within the image plane.

  The imaging light beam EL2 from the pattern of the cylindrical mask DM exits from the first illumination region IR1 in the normal direction (D1), and enters the image shift correction optical member 45 through the focus correction optical member 44. The imaging light beam EL <b> 2 that has passed through the image shift correction optical member 45 is reflected by the first reflecting surface (plane mirror) p <b> 4 of the first deflecting member 50 that is an element of the first optical system 41, and passes through the first lens group 51. The light is reflected by the first concave mirror 52, passes through the first lens group 51 again, is reflected by the second reflecting surface (plane mirror) p5 of the first deflecting member 50, and enters the first field stop 43. The imaging light beam EL2 that has passed through the first field stop 43 is reflected by the third reflecting surface (plane mirror) p8 of the second deflecting member 57, which is an element of the second optical system 42, and passes through the second lens group 58 for the second. The light is reflected by the two concave mirrors 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflecting member 57, and enters the optical member 47 for magnification correction. The imaging light beam EL2 emitted from the magnification correcting optical member 47 enters the first projection area PA1 on the substrate P, and an image of the pattern appearing in the first illumination area IR1 is equal to the first projection area PA1 (× Projected in 1).

  As shown in FIG. 2, when the radius r1 of the cylindrical mask DM and the radius r2 of the cylindrical surface of the substrate P wound around the rotary drum DR5 are equal, the connection on the mask side of each projection module PL1 to PL6 is performed. The principal ray of the image light beam is inclined so as to pass through the central axis AX1 of the cylindrical mask DM, and the inclination angle thereof is the inclination angle θ of the principal ray of the imaging light beam on the substrate side (± θ with respect to the center plane p3). Will be the same.

  In order to give such an inclination angle θ, the angle θ1 with respect to the optical axis AX3 of the first reflecting surface p4 of the first deflecting member 50 shown in FIG. 4 is made smaller than 45 ° by Δθ1, and the second deflecting member 57 The angle θ4 of the fourth reflecting surface p9 with respect to the optical axis AX4 is made smaller than 45 ° by Δθ4. Δθ1 and Δθ4 are set to have a relationship of Δθ1 = Δθ4 = θ / 2 with respect to the angle θ shown in FIG.

FIG. 5 is an external perspective view of the rotary drum DR5.
In FIG. 5, for convenience, only the second to fourth projection areas PA2 to PA4 are shown, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not shown.
The second detector 35 optically detects the rotational position of the rotary drum DR5, and includes a highly circular scale disk (scale member) SD and encoder heads (reading mechanisms) EN1 to EN3. Is done.

  The scale disk SD is fixed to the rotation axis ST of the rotary drum DR5, and rotates together with the rotation axis ST around the rotation center line AX2, and a scale portion GP is engraved on the outer peripheral surface. The encoder heads EN1 to EN3 are arranged to face the scale part GP and read the scale part GP in a non-contact manner. The encoder heads EN1 and EN2 have measurement sensitivity (detection sensitivity) with respect to displacement in the tangential direction (in the XZ plane) of the scale part GP, and the installation direction (in the XZ plane with the rotation center line AX2 as the center). The head directions EN1 and EN2 are arranged so that the installation direction lines Le1 and Le2 are ± θ ° with respect to the center plane p3.

That is, the installation orientation line Le1 of the head EN1 coincides with the inclination angle θ with respect to the center plane p3 of the principal ray passing through the center points of the projection fields PA1, PA3, and PA5 of the odd-numbered projection modules PL1, PL3, and PL5. The installation azimuth line Le2 of EN2 coincides with the inclination angle θ of the principal ray passing through the center point of each projection field PA2, PA4, PA6 of the even-numbered projection modules PL2, PL4, PL6 with respect to the center plane p3.
The third encoder head (third reading mechanism) EN3 is disposed on the opposite side of the rotation center line AX2 with respect to the encoder heads EN1 and EN2, and the installation orientation line Le3 is on the center plane P3. Is set.

The scale disk SD of the present embodiment is made to have as large a diameter as possible (for example, a diameter of 20 cm or more) in order to increase measurement resolution, using a low thermal expansion metal, glass, ceramics or the like as a base material. In FIG. 5, the diameter of the scale disk SD is shown smaller than the diameter of the rotating drum DR5. However, the diameter of the outer peripheral surface of the rotating drum DR5 around which the substrate P is wound and the scale of the scale disk SD are shown. The so-called measurement Abbe error can be further reduced by aligning (substantially matching) the diameter of the part GP.
Since the minimum pitch of the scale (lattice) engraved in the circumferential direction of the scale part GP is limited by the performance of the scale engraving device, etc., if the diameter of the scale disk SD is increased, the minimum pitch is correspondingly increased. Corresponding angle measurement resolution can also be increased.

As in the configuration described above, when the direction of the installation azimuth lines Le1 and Le2 in which the encoder heads EN1 and EN2 for reading the scale part GP are arranged is viewed from the rotation center line AX2, the main component of the imaging light beam EL2 with respect to the substrate P Even if the rotating drum DR5 is shifted in the X direction by a slight backlash (about 2 to 3 μm) of a bearing (rotating bearing) that supports the rotating shaft ST, for example, even if the rotating drum DR5 is shifted in the X direction. Position errors relating to the feed direction (Xs) of the substrate P that can occur in the projection areas PA1 to PA6 due to this shift can be measured with high accuracy by the encoder heads EN1 and EN2.
Further, by comparing the measurement values obtained by the encoder heads EN1 and EN2 and the measurement values obtained by the encoder head EN3, it is possible to suppress the influence of the eccentric error of the scale disk SD with respect to the rotation axis ST and to perform highly accurate measurement.

When the rotational position and rotational speed of the rotary drum DR5 are stably detected based on the measurement signals from the encoder heads EN1, EN2, and EN3, the control device 14 controls the second drive unit 36 in the servo mode. . Thus, the rotational position of the rotary drum DR5 is controlled more precisely, and based on the measurement signal corresponding to the rotational position and rotational speed of the first drum member 21 (cylindrical mask DM) detected by the first detector 25. The first drum member 21 and the rotary drum DR5 are synchronously moved (synchronously rotated) by servo-controlling the rotational position and speed of the first drum member 21 via the first drive unit 26.
Thus, the circumferential speed of the pattern on the cylindrical mask DM and the feed speed of the substrate P by the rotary drum DR5 are precisely set to the ratio of the projection magnification of the projection optical system PL, here 1: 1. .
Then, the image of the pattern positioned in the illumination area IR of the cylindrical mask DM illuminated by the plurality of illumination modules IL is projected onto the projection area PA on the substrate P corresponding to each illumination module.

As described above, in this embodiment, when the installation orientation lines Le1 and Le2 of the encoder heads EN1 and EN2 arranged around the scale part GP of the scale disk SD are viewed from the rotation center line AX2, they are on the substrate P. Even if the rotating drum DR is slightly shifted in the scanning exposure direction (feeding direction) of the substrate P because it is the same (or matched) with the tilt direction of the principal ray of the imaging light beam EL2 toward the projection area PA, The shift amount can be measured in real time by the encoder heads EN1 and EN2, and the exposure position variation due to the shift can be measured with high accuracy and high speed by, for example, the image shift correction optical member 45 in the projection optical system PL. It becomes possible to correct to.
Therefore, the exposure process can be performed with high positional accuracy with respect to the substrate P.

(Second Embodiment)
Next, a second embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIG. In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted.

FIG. 6 is a view of the scale disk SD provided on the rotary drum DR5 as viewed from the direction of the rotation center line AX2 (Y direction). As shown in FIG. 6, in the present embodiment as well, the same as the direction in which the imaging light beam EL2 (chief ray) directed to the rotation center line AX2 is incident on the substrate P in the XZ plane, as in FIG. Encoder heads EN1 and EN2 arranged on installation azimuth lines Le1 and Le2 inclined in the direction, and encoder head EN3 arranged on installation azimuth line Le3 (center plane P3) so as to face the heads EN1 and EN2. Is provided. In addition to these heads EN1, EN2, EN3, in this embodiment, the same direction as the observation directions AMD1, AMD2 (toward the rotation center line AX2) of the substrate P by the alignment microscopes AM1, AM2 shown in FIG. The encoder heads EN4 and EN5 are arranged on the installation orientation lines Le4 and Le5 set in the radial direction of the scale part GP, respectively.
The positions around the rotation center line AX2 where the alignment microscopes AM1 and AM2 and the encoder heads EN4 and EN5 are disposed are the entrance region IA where the substrate P starts to contact the rotating drum DR5 and the substrate P is separated from the rotating drum DR5. It is set between the separation area OA.

The alignment microscope AM1 of the present embodiment is arranged in front of the exposure position (projection region), and is formed in an alignment mark (an area within several tens to several hundreds μm square) formed near the end of the substrate P in the Y direction. In the state where the substrate P is fed at a predetermined speed, the image is detected at high speed by an imaging device or the like, and the mark image is sampled at high speed in the microscope field of view (imaging range). By storing the rotation angle position of the scale disk SD sequentially measured by the encoder head EN4 at the moment when the sampling is performed, the correspondence between the mark position on the substrate P and the rotation angle position of the rotation drum DR5 is obtained. It is done.
On the other hand, the alignment microscope AM2 is arranged behind the exposure position (projection area), and is formed in the vicinity of the end in the Y direction of the substrate P (formed in an area within several tens to several hundreds μm square). As with the alignment microscope AM1, the image is sampled at high speed by an imaging device or the like, and at the instant of sampling, the rotational angle position of the scale disk SD sequentially measured by the encoder head EN5 is stored, thereby obtaining the image on the substrate P. The corresponding relationship between the mark position and the rotation angle position of the rotary drum DR5 is obtained.

  When the mark detected by the alignment microscope AM1 is detected by the alignment microscope AM2, the difference between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is precisely determined in advance. If there is an error compared with the opening angles of the installation orientation lines Le4 and Le5 of the two alignment microscopes AM1 and AM2 that are calibrated, the substrate P rotates between the entry area IA and the separation area OA. There is a possibility that the drum DR5 is slightly slipped on the drum DR5 or is stretched in the feed direction (circumferential direction).

Generally, the positional error during patterning is determined according to the fineness and overlay accuracy of the device pattern formed on the substrate P. For example, a 10 μm-wide line pattern is accurately superimposed on the underlying pattern layer. In order to perform the alignment exposure, only an error of a fraction of that, that is, a positional error of about ± 2 μm is allowed in terms of the dimension on the substrate P.
In order to realize such highly accurate measurement, the measurement direction of the mark image (alignment tangent direction of the rotating drum DR5 in the XZ plane) by each alignment microscope AM1, AM2 and the measurement direction of each encoder head EN4, EN5 (The tangential direction of the outer periphery of the scale part GP in the XZ plane) must be aligned within an allowable angle error.

As described above, in this embodiment, in addition to obtaining the same operation and effect as in the first embodiment, the measurement direction of the alignment mark on the substrate P by the alignment microscopes AM1 and AM2 (of the rotating drum DR5) Since the encoder heads EN4 and EN5 are arranged so as to coincide with the tangential direction of the circumferential surface), the rotation drum DR5 is detected when the position of the substrate P (mark) is detected (image sampling) by the alignment microscopes AM1 and AM2. Even when the (scale disk SD) is shifted in the circumferential direction (tangential direction) orthogonal to the installation azimuth lines Le4 and Le5 in the XZ plane, high-accuracy position measurement can be performed in consideration of the shift.
As a result, precise feedback control and feedforward control can be performed regarding the driving of the cylindrical mask DM, the driving of the rotary drum DR5 by the control device 14, and the application of tension to the substrate P, and the substrate P is exposed with high accuracy. Processing becomes possible.

Further, in the present embodiment, the encoder head EN4 can be disposed in the vicinity of the encoder head EN1 that is aligned with the circumferential position of the odd-numbered projection areas PA1, PA3, and PA5. In the vicinity of the encoder head EN2 aligned with the circumferential positions of the even-numbered projection areas PA2, PA4, PA6, the encoder head EN5 aligned with the circumferential position of the imaging field of the alignment microscope AM2 can be arranged.
Therefore, the pitch unevenness in the circumferential direction of the scale (scale, grid) engraved in the scale part GP can be measured by the set of two encoder heads close to each other (EN1 and EN4 or EN2 and EN5). By measuring such pitch unevenness over the entire circumference of the scale disk SD, a correction map corresponding to the rotation angle position of the scale disk SD can be created, and more accurate measurement is possible.

  Furthermore, in this embodiment, the encoder heads EN1 to EN5 are arranged at five locations around the scale disk SD, so that the measurement values from appropriate two or three of these heads are combined for arithmetic processing. Thus, the roundness (shape distortion), eccentricity error, etc. of the scale part GP of the scale disk SD can be obtained.

(Third embodiment)
Next, a third embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIGS. 7 (a) and 7 (b). In this figure, the same reference numerals are given to the same elements as those of the first and second embodiments shown in FIGS. 1 to 6, and the description thereof is omitted.

  In the present embodiment, a roundness adjusting device for adjusting the roundness of the scale disk SD is provided. As shown in FIG. 7B, the roundness adjusting device CS includes a protrusion SD1 projecting in a ring shape along the circumferential direction on the surface of the scale disk SD on the + Y side, and the + Y side of the scale disk SD. And a disk-shaped fixed plate FP inserted through the rotation shaft ST and fixed thereto.

  On the surface of the fixed plate FP that faces the scale disk SD, a protrusion FP1 that protrudes in a ring shape along the circumferential direction is provided. On the inner peripheral side of the protrusion SD1, an inclined surface SD2 that gradually increases in diameter toward the fixed plate FP is formed. On the outer peripheral side of the protrusion FP1, there is formed an inclined surface FP2 that gradually decreases in diameter toward the scale disk SD and fits with the inclined surface SD2. The diameter of the tip portion of the inclined surface FP2 is set to be larger than the diameter of the base portion of the inclined surface SD2. The diameter of the tip portion of the inclined surface SD2 is set to be smaller than the diameter of the base portion of the inclined surface FP2.

  The scale disk SD is formed with a through hole SD3 and a step SD4 opening on the −Y side along the rotation center line AX2 at a distance from the rotation center line AX2 where the protrusion SD1 is located. The fixing plate FP is formed with a female screw part FP3 coaxially with the through hole SD3 and the step part SD4. The plurality of through-holes SD3, stepped portion SD4, and female screw portion FP3 are formed at a predetermined pitch in the circumferential direction around the rotation center line AX2 (here, eight locations), and each location serves as an adjustment portion.

  In each adjustment portion, an adjustment screw 60 having a male screw portion 61 inserted through the through hole SD3 and screwed into the female screw portion FP3 and a head portion 62 engaged with the step portion SD4 is mounted.

  In the roundness adjusting device CS having the above-described configuration, when the adjusting screw 60 is screwed, the scale disk SD moves in the direction approaching the fixed plate FP, so that the inclined surface SD2 is removed along the inclined surface FP2. Slightly elastically deforms on the radial side. Conversely, by rotating the adjusting screw 60 in the opposite direction, the scale disk SD moves in a direction away from the fixed plate FP, so that the inclined surface SD2 is elastically deformed by a small amount toward the inner diameter side along the inclined surface FP2. .

  As described above, by operating the adjustment screw 60 in each adjustment portion, in the scale disk SD, the diameter of the protrusion SD1 in the adjustment portion in the circumferential direction, and thus the scale portion GP formed on the outer peripheral surface is slightly adjusted. can do. Accordingly, by operating the adjustment unit (adjustment screw 60) at an appropriate position according to the roundness of the scale disk SD, the roundness of the scale part GP of the scale disk SD can be increased or the rotation center line AX2 can be increased. It is possible to improve the position detection accuracy in the rotational direction with respect to the rotating drum DR5 by reducing a minute eccentric error. The amount of adjustment varies depending on the diameter of the scale disk SD and the radial position of the adjusting portion, but is about several microns at the maximum.

(Fourth embodiment)
Next, a fourth embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIGS. In this figure, the same reference numerals are given to the same elements as those of the first to third embodiments shown in FIGS. 1 to 7, and the description thereof is omitted.

  FIG. 8 is an external perspective view of the rotary drum DR around which the substrate P is wound. In FIG. 8, the illustration of the encoder heads EN1 and EN2 having the same installation orientation in the circumferential direction as the imaging light beam EL2 is omitted.

  As shown in FIG. 8, in this embodiment, a total of 12 alignment microscopes (also referred to as non-contact detection probes) AM are arranged around the substrate P wound around the rotary drum DR. These twelve alignment microscopes have three groups AMG4, AMG5, and AMG6 including four microscopes AM arranged at predetermined intervals in the extending direction (Y direction) of the rotation center line AX2 in the circumferential direction of the rotary drum DR. They are arranged at angular intervals.

Each of the four microscopes AM constituting the microscope group AMG4 has an observation (detection) centerline AMD4 that is directed to the rotation center line AX2 and tilted in the same direction in the XZ plane, and constitutes the microscope group AMG5. Each of the microscopes AM has an observation (detection) center line AMD5 that is directed to the rotation center line AX2 and inclined in the same direction in the XZ plane, and each of the four microscopes AM constituting the microscope group AMG6 is also a rotation center. The observation (detection) center line AMD6 is directed to the line AX2 and is inclined in the same direction in the XZ plane.
Each of the microscope groups AMG4 to AMG6 is arranged on the entrance area IA side (−X side) from the exposure position (projection areas PA1 to PA6) on the substrate P in the circumferential direction of the rotary drum DR.

In the present embodiment, as shown in FIG. 8, when viewed in the XZ plane, the installation azimuth lines Le4 and Le5 are oriented in the same direction as the respective observation (detection) centerlines AMD4 to AMD5 of the three groups AMG4 to AMG6. , Le6, encoder heads EN4 to EN6 are arranged.
FIG. 9 shows the arrangement of the three encoder heads EN4 to EN6 as viewed on the XZ plane. These three heads EN4 to EN6 are arranged in accordance with the exposure positions (projection areas PA1 to PA6). Arranged on the front side of the encoder heads EN1 and EN2 and after the entry area IA of the substrate P.

  In the processing apparatus U3 configured as described above, an alignment mark having a predetermined correlation with a pattern (pattern formation region) is provided at a position corresponding to the alignment microscope AM of each of the alignment microscope groups AMG4 to AMG6 on the substrate P. It is formed discretely or continuously in the scale direction, and the alignment marks are sequentially detected by the alignment microscope groups G4 to AMG6, so that the position, size, rotation, deformation, etc. of the pattern can be detected in advance before the exposure processing for the substrate P. Error information can be measured, and a highly accurate pattern can be formed by correcting projection conditions during exposure processing based on the error information.

Each of the microscope groups AMG4 to AMG6 has four alignment microscopes AM arranged in a line in the Y direction (width direction of the substrate P), and two microscopes AM on both sides in the Y direction are located near both ends of the substrate P. It is possible to always detect the formed mark. Of the four alignment microscopes AM aligned in the Y direction (the width direction of the substrate P), the inner two microscopes AM are, for example, a pattern of a display panel formed on the substrate P along the longitudinal direction. It is possible to observe and detect alignment marks formed in a blank portion between the formation regions.
Alternatively, in the long direction on the substrate P, a specific area where a display panel is not formed is set in some places, and the 12 alignment microscopes AM constituting the three microscope groups AMG4 to AMG6 can be simultaneously detected in the specific area. Twelve alignment marks may be provided in such an arrangement. In this way, based on the relative positional relationship between the marks simultaneously detected by the twelve alignment microscopes AM, how the portion immediately before the exposure position (projection areas PA1 to PA6) of the substrate P is a surface. It is possible to measure the deformation at high speed and finely.

Therefore, in this embodiment, in this embodiment, in addition to obtaining the same operation and effect as the previous embodiments, encoder heads EN4 to EN6 corresponding to each of the three rows of alignment microscope groups AG4 to AMG6. Can be arranged adjacent to each other around the scale disk SD and in front of the exposure position, and by analyzing the measurement results of each of these encoder heads EN4 to EN6, A measurement error caused by pitch irregularity in the circumferential direction of the grating is grasped in advance, and each measurement result of the encoder heads EN1 and EN2 arranged corresponding to the exposure position is corrected with an expected measurement error due to the known pitch irregularity. It is also possible.
As a result, patterning (exposure processing) with high positioning accuracy with respect to the substrate P becomes possible.

(Fifth embodiment)
Next, a fifth embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIG. In this figure, the same reference numerals are given to the same elements as those of the first to fourth embodiments shown in FIGS. 1 to 9, and the description thereof is omitted.

  In the first to fourth embodiments, the configuration in which the encoder scale disk SD is fixed to the rotating shaft ST of the rotating drum DR5 (DR) has been described. However, in the present embodiment, the rotating drum DR or cylinder that feeds the substrate P is used. A configuration in which the scale part GP is directly provided on the mask DM will be described.

FIG. 10 is a diagram showing an overall configuration of the processing device U3 shown in FIG.
As shown in FIG. 10, on the outer peripheral surface of the rotary drum DR that also functions as the second scale member, the scale portion (second scale portion) GP extends over the entire circumferential direction at both ends in the direction of the rotation center line AX2. Are provided in a ring shape.
The substrate P is configured to be wound inside avoiding the scale portions GP formed at both ends of the rotary drum DR. When a strict arrangement relationship is required, the outer peripheral surface of the scale part GP and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are set to be the same surface (same radius from the center line AX2). . For this purpose, the outer peripheral surface of the scale part GP should be made higher by the thickness of the substrate P in the radial direction than the outer peripheral surface of the rotating drum DR.
Furthermore, also in this embodiment, while facing each of the scale parts GP at both ends of the rotary drum DR, and corresponding to the imaging light beam EL2 (chief ray) from each projection area PA1 to PA6 of the projection optical system PL, The encoder heads EN1 and EN2 are arranged at the positions of the installation azimuth lines Le1 and Le2 as described with reference to FIG.

  The encoder heads EN1 and EN2 are fixed to a part of a holding column PLa for holding the multi-lens projection optical system PL in the apparatus in a mechanically stable state. The holding column PLa is made of a metal such as Invar having a small coefficient of thermal expansion with respect to a temperature change, the positional variation between the projection modules PL1 to PL6 due to the temperature change, and the projection optical system PL and the encoder heads EN1 and EN2. Relative arrangement fluctuation can be suppressed small.

On the other hand, at both ends of the first drum member 21 holding the cylindrical mask DM in the direction of the rotation center line AX1, the scale portion GPM as the first scale member extends over the entire circumferential direction around the rotation center line AX1. Are each provided in an annular shape.
The cylindrical mask DM is configured such that the mask pattern is located inside the first drum member 21 while avoiding the scale portions GPM formed at both ends. When a strict arrangement relationship is required, the outer peripheral surface of the scale portion GPM and the outer peripheral surface of the pattern surface (cylindrical surface) of the cylindrical mask DM are set to be the same surface (same radius from the center line AX1). .
Further, the illumination light beam EL1 (illuminating the illumination area IR of the cylindrical mask DM, as viewed from the rotation center line AX1, at positions facing the scale portions GPM at both ends of the first drum member 21 (cylindrical mask DM). Encoder heads EN11 and EN12 are arranged at positions of installation azimuth lines Le11 and Le12 that are the same as the illumination direction in FIG. The encoder heads EN11 and EN12 are also fixed to a holding column PLa that holds the projection optical system PL.

  In the case of the cylindrical mask DM, the scale and the lattice pattern engraved on the scale part GPM can be formed on the outer peripheral surface of the first drum member 21 together with the device pattern to be transferred to the substrate P. The relative positional relationship with the scale part GPM can be set strictly. In particular, an origin pattern representing the origin for one round is precisely engraved at a specific position in the circumferential direction of the device pattern in a part of the scale part GPM. be able to.

  In the present embodiment, the cylindrical mask DM is exemplified as a transmission type. However, in the reflection type cylindrical mask, the scale portion GPM (scale, grid, origin pattern, etc.) can be formed together with the device pattern. is there. In general, when a reflective cylindrical mask is manufactured, a metal column with a shaft as the first drum member 21 is processed by a high-precision lathe and polishing machine. (Eccentricity) can be kept extremely small. For this reason, if the scale part GPM is also formed on the outer peripheral surface by the same process as that for forming the device pattern, highly accurate encoder measurement can be performed.

  In the processing apparatus U3 configured as described above, the position of the first drum member 21 (cylindrical mask MD) in the rotational direction is arranged on the same installation orientation lines Le11 and Le12 as the illumination direction of the illumination light beam EL1 toward the mask pattern. Measurement is performed by the encoder heads EN11 and EN12. For this reason, the visual field region (or principal ray) on the object side of the projection optical system PL corresponding to the illumination regions IR1 to IR6 on the cylindrical mask MD due to mechanical errors (eccentricity error, blurring) of the rotation axis of the cylindrical mask MD. ) Even if the image projected onto the substrate P shifts in the feed direction (longitudinal direction) of the substrate P, the shift amount can be set to the encoder head EN11. , Can be easily estimated from the measurement result of EN12.

Although not shown in FIG. 10, in this embodiment as well, a plurality of alignment microscopes AM for detecting alignment marks and alignment patterns on the substrate P are provided. The mark detection positions by these alignment microscopes AM are determined, for example, in the same manner as in FIGS. 6 and 9, and encoder heads EN4, EN5, EN6 are also provided correspondingly.
In that case, the plurality of alignment microscopes AM and encoder heads EN4, EN5, and EN6 are all fixed to the holding column PLa.

Further, since a plurality of alignment marks (mask side marks) for alignment with the substrate P are formed on the outer peripheral surface of the cylindrical mask DM, a mask side alignment microscope for detecting the mask side marks is held. At the same time, an encoder head for reading the scale part GPM is fixed to the holding column PLa in the direction in the XZ plane corresponding to the detection position of the mask side alignment microscope.
Furthermore, in this type of scanning type exposure apparatus, the surface of the substrate P must always be set within the depth of focus (DOF) on the image plane side of the projection optical system PL, so the substrate P by the projection modules PL1 to PL6. A plurality of measuring the changes in the principal ray direction position (position in the radial direction from the rotation center line AX2) on the surface of the substrate P precisely in the μ order in the projection areas PA1 to PA6 above or in the vicinity thereof. A focus sensor is also provided.

  There are various types of focus sensors (such as non-contact type height sensors). When a μ-order resolution is required, a light beam is projected obliquely onto the surface to be measured (substrate P), An oblique incident light focus sensor that photoelectrically detects a change in the light receiving position of the reflected beam from the inspection surface is used. In the case of this sensor, a light projecting unit for projecting a light beam onto the substrate P and a light receiving unit for receiving the reflected beam from the substrate P are necessary. These units are also mounted on the holding column PLa shown in FIG. It is fixed.

  Therefore, in this embodiment, the same operations and effects as those of the previous embodiments can be obtained, and the encoder heads EN1, EN2, EN11, EN12 corresponding to the projection region, or the encoder heads EN4, EN5 corresponding to the alignment microscope can be obtained. Since EN6 and the like are fixed to the holding column PLa that stably holds the projection optical system PL, the relative position fluctuation between each encoder head (measurement position) and the projection optical system PL (processing position), so-called It becomes possible to suppress the baseline fluctuation.

  Furthermore, in the present embodiment, the outer peripheral surface of the scale part GPM formed on the cylindrical mask DM can be set to substantially the same radius as the mask pattern forming surface, and the outer peripheral surface of the scale part GP formed on the rotary drum DR is The radius can be set substantially the same as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN11 and EN12 detect the scale part GPM at the same radial position as the illumination areas IR1 to IR6 on the cylindrical mask DM, and the encoder heads EN1 and EN2 project on the substrate P wound around the rotary drum DR. The scale part GP can be detected at the same radial position as the areas PA1 to PA6, and Abbe error caused by the difference between the measurement position and the processing position in the radial direction of the rotating system can be reduced.

  In addition, since the scale parts GP and GPM are provided on the rotary drum DR and the first drum member 21 (cylindrical mask DM), the circumference can be increased as compared with the case where the scale disk SD is used. Even in the scale portion, the angular resolution is improved and position detection with higher accuracy becomes possible.

(Modification)
In the fifth embodiment and the first to fourth embodiments, the position measurement in the rotational direction is performed on the cylindrical outer peripheral surface of the first drum member 21 constituting the cylindrical mask DM or the outer peripheral end surface of the scale disk SD. In the above description, the scale and the grid for performing the above are engraved and measured by the encoder head. However, the present invention is not limited to this.
For example, as shown in FIG. 11, a scale portion GPMR for measuring a positional change in the rotational direction is provided annularly along the circumferential direction at the peripheral edge of the end surface of the first drum member 21 (cylindrical mask DM), and a mask pattern is formed. A scale portion GPMT for measuring a change in position in the direction of the rotation center line AX1 (Y direction) may be provided annularly along the circumferential direction at the edge of the circumferential surface.

In this case, encoder heads EN11 and EN12 are provided on installation orientation lines Le11 and Le12 that face the scale part GPMR and face the same direction as the irradiation direction of the illumination light beam EL1, and the scale part faces the scale part GPMT. What is necessary is just to set it as the structure which provides encoder head EN21 (a measurement direction is a Y direction) which reads GPMT by non-contact. Each encoder EN11, EN12, EN21 is fixed to a holding column PLa that holds the projection optical system PL.
By adopting this configuration, in addition to the positional change in the rotational direction of the cylindrical mask DM, it is possible to measure the positional change in the rotational center line AX1 direction with high accuracy.

The scale portions GPMR and GPMT and the encoders EN11, EN12, and EN21 shown in FIG. 11 are similarly provided on the opposite end side of the first drum member 21.
As described above, when the scale portions GPMR and GPMT are formed on both end sides of the first drum member 21 constituting the cylindrical mask DM, slight twisting around the center line AX1 of the cylindrical mask DM, or in the direction of the center line AX1. It is also possible to accurately measure slight expansion and contraction in real time, and it is possible to accurately capture distortions of the mask pattern image projected onto the substrate P (projection magnification error in the Y direction, etc.) and minute rotation errors. It becomes.

  Further, the end face of the rotary drum DR5 (DR) around which the substrate P is wound is provided in the same manner as the scale portion GPMR for position measurement in the rotational direction is provided on the end face side of the first drum member 21 constituting the cylindrical mask DM. A scale portion for position measurement in the rotational direction may be provided on the side (surface side parallel to the XY plane). Of course, on the outer peripheral surface in the vicinity of both ends in the direction of the center line AX2 of the rotary drum DR5 (DR), a scale portion for position measurement in the direction in which the rotation center line AX2 extends is formed as in the scale portion GPMT shown in FIG. May be.

(Sixth embodiment)
Next, a sixth embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIG. In this figure, the same components as those of the fifth embodiment shown in FIGS. 10 to 11 are denoted by the same reference numerals, and the description thereof is omitted.

  In the present embodiment, in addition to the rotational position measurement by the encoder heads EN1, EN2, EN11, and EN12, information on the relative rotational speed between the first drum member 21 (cylindrical mask DM) and the rotary drum DR (substrate P). A speed measuring device is provided for measuring.

  FIG. 12 is a schematic configuration diagram of the speed measuring device SA disposed between the first drum member 21 and the rotary drum DR. The speed measuring device SA includes an optical member (light splitter) having a reflecting portion 71A at the center in the X direction (scale portion GPM, GP arrangement direction) and a transmitting portion 71B on both sides of the reflecting portion 71A. 71 is provided to face the laser irradiation system 70, and the laser light emitted from the laser irradiation system 70 is reflected by the reflecting surface of the optical member 71, and the scale portion of the first drum member 21 via the lens GK1. Projected to GPM.

  When the laser light is incident on the rotating scale portion GPM, a Doppler shifted diffracted beam (± first-order reflected diffracted light) and zero-order reflected light are formed and incident on the lens GK1. The 0th-order reflected light is reflected by the reflecting portion 71A of the optical member 71 toward the laser irradiation system 70, but the ± 1st-order reflected diffracted beam is transmitted through the transmitting portion 71B of the optical member 71, and the lens GK2, the field stop APM. To reach.

  Here, the optical member 71 is disposed in the pupil space of the imaging system formed by the lenses GK1 and GK2, and the field stop APM is positioned at an optically conjugate position (image plane) with the scale unit GPM with respect to the imaging system formed by the lenses GK1 and GK2. Position). Therefore, an image of the scale portion GPM (a diffraction image that moves in accordance with the graduation line or a flowing interference fringe) is formed at the position of the field stop APM.

Now, the ± first-order reflected diffraction beam that has passed through the field stop APM and entered the lens GK3 is transmitted through the beam splitter (or polarization beam splitter) 72, and is passed through the lens GK4 to the scale portion GP on the rotary drum DR side. Projected on. When ± 1st-order reflected diffraction beams are projected onto the scale part GP, ± 1st-order re-diffracted beams having the respective diffraction beams as 0th-order light are generated in the same direction and become interference beams that interfere with each other, and the lens Returning to GK 4 and beam splitter 72, the re-diffracted beam (interference beam) reflected by beam splitter 72 is received by light receiving system 72.
In the above configuration, the imaging system using the lenses GK3 and GK4 re-images the diffraction image formed at the position of the field stop APM on the scale part GP on the rotary drum DR side. They are arranged in the pupil space of the imaging system by the lenses GK3 and GK4.

  In the above configuration, for example, if the scale pitch of the scale part GPM and the scale pitch of the scale part GP are the same, the peripheral speed of the scale part GPM (first drum member 21) and the scale part GP (rotating drum) When there is no difference in the peripheral speed of (DR), the photoelectric signal received by the light receiving system 72 is a signal having a constant intensity. However, if there is a difference between the peripheral speed of the scale part GPM and the peripheral speed of the scale part GP. A photoelectric signal that is amplitude-modulated at a frequency corresponding to the difference in peripheral speed is output. Therefore, by analyzing the change in the waveform of the photoelectric signal output from the light receiving system 72, the speed difference between the scale part GPM and the scale part GP, that is, the mask pattern of the cylindrical mask DM and the substrate P wound around the rotary drum DR. It becomes possible to measure a relative speed difference.

(Device manufacturing method)
Next, a device manufacturing method will be described. FIG. 13 is a flowchart showing the device manufacturing method of this embodiment.

  In the device manufacturing method shown in FIG. 13, the function / performance design of a device such as an organic EL display panel is first performed (step 201). Next, a cylindrical mask DM is manufactured based on the design of the device (step 202). In addition, a substrate such as a transparent film or sheet, which is a base material of the device, or an extremely thin metal foil is prepared by purchase or manufacture (step 203).

  Next, the prepared substrate is put into a roll type or patch type production line, and TFT backplane layers such as electrodes, wiring, insulating film, semiconductor film, etc. constituting the device on the substrate, and organic EL light emission that becomes a pixel portion A layer is formed (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask. For the formation of the resist pattern, a step of uniformly forming a resist film on the substrate surface, a step of exposing the resist film of the substrate with exposure light patterned through the cylindrical mask DM according to each of the above embodiments, A step of developing the resist film on which the latent image of the mask pattern is formed by the exposure is performed.

  In the case of flexible device manufacturing using printing technology, etc., a process of forming a functional photosensitive layer (photosensitive silane coupling material, etc.) on the substrate surface by a coating method using the manufacturing line as shown in FIG. In accordance with each of the above embodiments, the functional photosensitive layer is irradiated with exposure light patterned through the cylindrical mask DM, and the functional photosensitive layer is made hydrophilic according to the pattern shape and the water repellent part. A step of forming a metal pattern (TFT electrode layer, wiring layer, etc.) by electroless plating, etc. Is implemented.

  Then, depending on the device to be manufactured, for example, the substrate is diced or cut, or another substrate manufactured in a separate process, for example, a sheet-like color filter having a sealing function or a thin glass substrate is pasted. The combining process is performed to assemble the device (step 205). Next, post-processing such as inspection is performed on the device (step 206). A device can be manufactured as described above.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  In the above embodiment, for example, as shown in FIGS. 5, 6, 9, and the like, the incident direction of the imaging light beam EL <b> 2 is the same as the specific position where the projection process (exposure process) or the like is performed on the substrate P. The configuration in which the encoder heads EN1 and EN2 are arranged at positions such as the installation azimuth lines Le1 and Le2 that are inclined in the direction has been described.

  However, as shown in FIG. 14, the tilt angle of the imaging light beam EL2 with the odd-numbered projection modules PL1, PL3, PL5 with respect to the center plane P3 and the center of the imaging light beam EL2 with the even-numbered projection modules PL2, PL4, PL6. When both the tilt angles with respect to the surface P3 are small, one encoder head EN31 may be arranged at the position of the center plane P3 (on the installation direction line Le6) between the two imaging light beams EL2.

Further, when the single encoder head EN31 is arranged at a position intermediate between the two projection areas (imaging light beam EL2) when viewed in the XZ plane as described above, for example, as shown in FIG. Encoder heads EN32 and EN33 are arranged at two symmetrical positions on the opposite side of the encoder head EN31 across the center line AX2 and across the center plane P3, and measured by each of the three encoder heads EN31 to EN33. By using information on the rotational position of the scale part GP to be performed, it is possible to detect a change in the position of the rotating drum DR in the circumferential direction with higher accuracy.
In particular, if the three encoder heads EN31, EN32, EN33 are arranged around the scale part GP at intervals of 120 °, the eccentricity error of the scale part GP (rotary drum DR, etc.) can be obtained by simple calculation.

  Further, when this configuration is adopted, as shown in the second embodiment, the installation azimuth lines Le4 and Le5 are directed to the same orientation as the observation center lines AMD1 and AMD2 where the alignment microscopes AM1 and AM2 are arranged. Since the encoder heads EN4 and EN5 are disposed, the encoder heads EN32 and EN33 are preferably disposed on an extension line of the installation orientation lines Le4 and Le5. That is, the encoder head EN33 may be installed at a position that is point-symmetric with the encoder head EN4 with respect to the rotation center line AX2, and the encoder head EN32 may be installed at a position that is point-symmetric with the encoder head EN5 with respect to the rotation center line AX2. .

If a total of five encoder heads are provided around the scale disk SD under the conditions as shown in FIG. 14, the eccentricity error and axis of the scale disk SD are determined based on the measurement signals from the encoder heads EN4, EN5, EN31 to 33. Advanced correction is possible by detecting blurring, scale deformation, pitch error, and the like.
Such an advantage can be obtained similarly when the scale portion GPM is directly formed on the first drum member 21 constituting the cylindrical mask DM as shown in FIG. 10 and when the scale portion GP is directly formed on the rotary drum DR. .

Further, for example, as shown in FIG. 15, when the encoder head EN31 can be arranged at the position of the installation direction line Le6 as in FIG. 14, the imaging light beam EL2 from the odd-numbered projection modules PL1, PL3, PL5. The encoder head EN32 is arranged at the position of the installation azimuth line Le32 inclined at an angle symmetrical to the installation azimuth line Le6 with respect to the line toward the center line AX2, and the imaging light beam EL2 from the even-numbered projection modules PL2, PL4, PL6. The encoder head EN33 may be disposed at the position of the installation azimuth line Le33 inclined at an angle symmetrical to the installation azimuth line Le6 with respect to the line toward the center line AX2.
In such an arrangement, the average angular position between the reading result by the encoder head EN31 and the reading result by the encoder head EN32 corresponds to the projection area PA of the odd-numbered projection modules PL1, PL3, PL5, and the encoder head EN31. The average angular position of the reading result by the encoder head EN33 and the reading result by the encoder head EN33 may correspond to the projection area PA of the even-numbered projection modules PL2, PL4, PL6.

Further, when the encoder heads EN1 and EN2 whose reading direction is the same as the incident direction of the imaging light beam EL2 are arranged, for example, as shown in FIG. 16, an encoder head EN1c is provided diagonally to the encoder head EN1. The encoder head EN2c may be provided on the diagonal side of the encoder head EN2.
In this case, from the reading result of the scale part GP by the encoder head EN1, it is difficult to determine whether the rotating drum DR (scale disk SD) has rotated around the rotation center line AX2 or shifted in the X-axis direction. The above separation can be performed accurately by comparing with the reading result of the scale part GP by the encoder head EN1c at the diagonal position (180 °). Similarly, the amount of shift in the X-axis direction and the amount of rotation (change in angular position) can be accurately determined by comparing the reading results of the encoder head EN2 and the diagonal encoder head EN2c. I can do it.
14 to 16 are arranged on the outer peripheral surface of the rotary drum DR or the cylindrical mask DM for transporting the substrate P as shown in FIGS. The present invention can be similarly applied to an encoder system provided with GP and GPM.

In each of the embodiments described above, the exposure apparatus that projects the pattern light from the cylindrical mask DM onto the substrate P that is cylindrically supported by the rotating drum DR is exemplified. However, either the mask pattern or the substrate P is used. The encoder system described in each embodiment can be similarly applied to the rotating system as long as the apparatus has a configuration that is sent by the rotating system.
As such an apparatus, while the substrate P supported by the rotating drum is fed in the longitudinal direction, the laser spot light is scanned on the rotating drum in the width (short) direction of the substrate P at a high speed, and is produced by CAD or the like. A mask that gives contrast distribution (pattern light) to a light beam projected in a predetermined area on the substrate P by modulating a large number of micromirrors such as DMD and SLM, which draws the pattern of the wiring and circuit provided While a substrate P supported by a rotary exposure drum and a rotary drum is fed in the longitudinal direction, a desired pattern is drawn by droplets from an ink jet head arranged in the width (short) direction of the substrate P on the rotary drum. The substrate P supported by the printing device and the rotating drum is irradiated with an energy beam (electron beam, laser beam, etc.), and a specific area of the surface of the substrate P The pattern on the substrate P supported by a processing device for processing (baking, annealing, modification, drilling, etc.) or the substrate P supported by a rotating drum is observed with an observation system (detection probe) such as a fluorescence microscope or a phase contrast microscope. There are inspection devices that detect defects and the like.
Also in these apparatuses, the spot light of the optical drawing apparatus, the projected light beam of the maskless exposure apparatus, the liquid discharged from the head of the printing apparatus, the energy beam of the processing apparatus, or the observation area of the inspection apparatus is set on the substrate. The encoder head installation orientation lines Le1 and Le2 may be set in accordance with the circumferential position of the rotating drum.

    AX2 ... Rotation center line (center line), DR5 ... Rotation drum (rotation cylindrical member), EN1-EN2 ... Encoder head (reading mechanism), EN3 ... Encoder head (third reading mechanism), EX ... Exposure apparatus (processing mechanism) , GP ... scale portion, P ... substrate, p2 ... second surface (support surface), SA ... speed measuring device, SD ... scale disk (scale member, disk-like member), U3 ... processing device (substrate processing device)

Claims (15)

A substrate processing apparatus for performing a predetermined process on a long sheet substrate,
It has an outer peripheral surface curved in a cylindrical shape with a constant radius from a predetermined center line, and a part of the sheet substrate is rotated around the center line in a state of being supported in the longitudinal direction along the outer peripheral surface, A rotating cylindrical member for feeding the sheet substrate in the longitudinal direction;
Among the part of the sheet substrate supported along the outer peripheral surface of the rotating cylindrical member, the sheet substrate is predetermined on each of the first specific position and the second specific position that are different from each other in the circumferential direction of the outer peripheral surface. A processing mechanism for performing the processing of
A scale portion that has an annular shape at a predetermined radius from the center line and rotates around the center line together with the rotating cylindrical member;
The scale portion is disposed so as to face the scale portion, and is disposed in substantially the same orientation as each of the first specific position and the second specific position as viewed from the center line, and the position of the scale portion in the circumferential direction A first reading mechanism and a second reading mechanism that individually measure changes;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
  The first specific position and the second specific position are an entry region where the sheet substrate starts to contact the outer peripheral surface of the rotating cylindrical member, and a separation region where the sheet substrate is removed from the outer peripheral surface of the rotating cylindrical member. The sheet substrate is sent so as to pass through the first specific position and then through the second specific position.
Substrate processing equipment. The substrate processing apparatus according to claim 2,
A specific position formed on the sheet substrate at a detection position set between the first specific position and the entry area at a predetermined angle from the first specific position in the circumferential direction of the outer peripheral surface. A pattern detection device arranged around the rotating cylindrical member so as to detect a pattern;
  The scale portion is disposed so as to face the outer peripheral surface on which the scale is formed, and is disposed in substantially the same direction as the detection position as viewed from the center line, on the outer peripheral surface of the scale portion of the scale. A third reading mechanism for reading a change in position along the direction,
Substrate processing equipment. The substrate processing apparatus according to claim 3 , wherein
Each of the first reading mechanism, the second reading mechanism, and the third reading mechanism has a circumferential position change of a graduation line engraved in the scale portion at a constant pitch along the circumferential direction. Including encoder head to measure
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 4 , wherein
The dimension of the outer peripheral surface of the rotating cylindrical member with respect to the direction of the center line is set larger than the width in the short direction perpendicular to the long direction of the sheet substrate,
The scale portion is formed near an end portion in the direction of the center line on the outer peripheral surface of the rotating cylindrical member.
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 4 , wherein
The rotating cylindrical member has a rotating shaft extending in the direction of the center line;
The scale portion is formed on an outer peripheral surface parallel to the center line of a scale disk attached so as to rotate with the rotation shaft.
Substrate processing equipment. The substrate processing apparatus according to claim 6,
  The diameter of the outer peripheral surface of the scale disk and the diameter of the outer peripheral surface of the rotating cylindrical member substantially matched,
Substrate processing equipment. The substrate processing apparatus according to claim 7 ,
The scale disk is fixed to the rotating shaft via a roundness adjusting mechanism capable of finely adjusting the diameter of the outer peripheral surface on which the scale portion is formed.
Substrate processing equipment. A substrate processing apparatus for forming a device pattern on a long sheet substrate,
It has a cylindrical outer peripheral surface curved with a constant radius from a predetermined center line, and a part of the sheet substrate is rotated around the center line in a state of being supported in the longitudinal direction along the outer peripheral surface, A rotating cylindrical member for feeding the sheet substrate in the longitudinal direction;
A pattern detection unit that detects a specific pattern formed on the sheet substrate at a first specific position in the circumferential direction of the outer peripheral surface among a part of the sheet substrate supported along the outer peripheral surface of the rotating cylindrical member. When,
Of the part of the sheet substrate supported along the outer peripheral surface of the rotating cylindrical member, the sheet at a second specific position away from the first specific position by a predetermined angle with respect to the circumferential direction of the outer peripheral surface. A pattern forming portion for forming the device pattern on a substrate;
A scale portion that has an annular shape at a predetermined radius from the center line and rotates around the center line together with the rotating cylindrical member;
The scale portion is disposed so as to face the scale portion, and is disposed in substantially the same orientation as each of the first specific position and the second specific position as viewed from the center line, and the position of the scale portion in the circumferential direction A first reading mechanism and a second reading mechanism that individually measure changes;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 9, comprising:
  The first specific position and the second specific position are an entry region where the sheet substrate starts to contact the outer peripheral surface of the rotating cylindrical member, and a separation region where the sheet substrate is removed from the outer peripheral surface of the rotating cylindrical member. The sheet substrate is sent so as to pass through the first specific position and then through the second specific position.
Substrate processing equipment. The substrate processing apparatus according to claim 9 or 10 , wherein
The dimension of the outer peripheral surface of the rotating cylindrical member with respect to the direction of the center line is set larger than the width in the short direction perpendicular to the long direction of the sheet substrate,
The scale portion is formed near an end portion in the direction of the center line on the outer peripheral surface of the rotating cylindrical member.
Substrate processing equipment. The substrate processing apparatus according to claim 9 or 10 , wherein
The rotating cylindrical member has a rotating shaft extending in the direction of the center line;
The scale portion is formed on an outer peripheral surface parallel to the center line of a scale disk attached so as to rotate with the rotation shaft.
Substrate processing equipment.   The substrate processing apparatus according to claim 12,
  The diameter of the outer peripheral surface of the scale disk and the diameter of the outer peripheral surface of the rotating cylindrical member substantially matched,
Substrate processing equipment. The substrate processing apparatus according to claim 13,
The scale disk is fixed to the rotating shaft via a roundness adjusting mechanism capable of finely adjusting the diameter of the outer peripheral surface on which the scale portion is formed.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 9 to 14 ,
Each of the first reading mechanism and the second reading mechanism includes an encoder head that measures a change in position in the circumferential direction of graduation lines engraved in the scale portion at a constant pitch along the circumferential direction. ,
Substrate processing equipment.

Images