JP6337486B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a device manufacturing method for processing a flexible substrate supported by a substrate support member with a predetermined tension.

  In the exposure apparatus used in the photolithography process, the outer periphery of the cylindrical mask is moved continuously over a length of several shots on the substrate (semiconductor wafer) while rotating the cylindrical or columnar mask. An exposure apparatus that scans and exposes a pattern of several shots formed on a substrate is known (for example, Patent Document 1).

  In recent years, flexible long films wound in rolls to produce liquid crystal and organic EL display panels and color filters on flexible thin substrates made of polymer resin films and plastics. A roll-to-roll system has also been proposed in which a pattern of a cylindrical mask is continuously exposed to the pattern (see, for example, Patent Document 2).

  The exposure target is not limited to the exposure apparatus using the cylindrical mask as in Patent Documents 1 and 2, but is a substrate that is an exposure target even in an exposure apparatus using a general flat mask or a maskless direct exposure apparatus. Is a thin substrate such as resin, plastic, or metal foil, the expansion and contraction of the substrate becomes a problem due to its physical properties. Therefore, when a pattern for an electronic device such as a display panel or a pattern for a color filter is exposed on a flexible thin substrate, the pattern to be exposed (a projection image or a drawing image of a mask pattern) and the substrate It is desirable to precisely adjust the relative positional relationship.

JP 2008-0776650 A JP 2011-221536 A

In the substrate processing apparatus (exposure apparatus) that performs processing while feeding the flexible substrate along the support surface (curved surface) of the substrate support member as in the above-mentioned Patent Document 2, If the substrate supported by the support surface of the member is loose, that is, if a predetermined tension is not applied, wrinkles may occur in the substrate.
For this reason, the substrate processing apparatus is controlled so that a certain tension is applied to the substrate when the substrate is transported. However, when tension is applied to the substrate, deformation (expansion / contraction) in the width direction or the longitudinal direction of the substrate due to the influence of the tension (tension) occurs before and after the processing position on the support surface (curved surface) of the substrate support member. May occur. Therefore, in a substrate processing apparatus for processing a thin flexible substrate, processing accuracy (pattern transfer accuracy, overlay accuracy) is considered in consideration of deformation in the width direction or long direction of the substrate, that is, two-dimensional deformation. Etc.) is desired to be improved.

  An aspect of the present invention has been made in view of the above circumstances, and suppresses a decrease in processing accuracy due to deformation in the width direction or the long direction of a substrate due to the influence of tension, and a highly accurate substrate processing apparatus and device An object is to provide a manufacturing method.

According to the first aspect of the present invention , there is provided a substrate processing apparatus for processing a flexible long substrate on which a specific pattern is formed discretely or continuously in a longitudinal direction, wherein the substrate is the long substrate. has a transfer device for transferring the longitudinal direction, a curved surface which is curved at a constant radius from the predetermined axis, said length is wound longitudinal direction of a portion of the substrate, the length of the longitudinal direction in which the substrate starts to contact with the curved surface a substrate support member on which the substrate from the entry position to support the substrate to the disengaged position of the elongated direction to start away from the curved surface, is disposed around the substrate support member as viewed from said axis of said curved surface circumferential direction the substrate between the processing section which processes said substrate in said curved surface at a specific position among comprises a first detection probe for detecting the specific pattern, and the specific position with respect to the circumferential direction as the entry position side Support member It includes a first pattern detecting apparatus wherein the first detection probe is placed around the second detection probe for detecting the specific pattern at a position different from the first detection probe with respect to the circumferential direction, the said specific position first At a position around the substrate support member rotated to the side of the separation position from the specific position with respect to the circumferential direction by substantially the same angle as the rotation angle around the axis between the position of one detection probe and the second detection probe. A second pattern detection device in which a detection probe is arranged; an amount of deformation of the substrate in the axial direction required by detection of the specific pattern by the first detection probe; and detection of the specific pattern by the second detection probe. The conveyance device passes through the entry position and the separation position that are set so that the required amount of deformation of the substrate in the axial direction matches. A guide member provided by guiding the substrate as a part, a substrate processing apparatus including a is provided.

  According to the aspect of the present invention, it is possible to suppress deterioration in processing accuracy due to deformation of the flexible substrate due to the influence of tension applied during processing, in particular, deterioration in positioning accuracy of a processing (exposure) region on the substrate, and high positioning accuracy. A substrate processing apparatus and a device manufacturing method can be obtained. Therefore, even a fine pattern can be faithfully formed on a flexible substrate.

FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment. FIG. 2 is a schematic diagram showing the overall configuration of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 3 is a schematic diagram showing the arrangement of illumination areas and projection areas in FIG. FIG. 4 is a schematic diagram showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) in FIG. FIG. 7 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 8 is an explanatory diagram illustrating deformation of the substrate according to the first embodiment. FIG. 9 is an explanatory diagram illustrating an example of an alignment mark. FIG. 9 is an explanatory diagram illustrating an example of an alignment mark. FIG. 10 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to deformation of the substrate. FIG. 11 is an explanatory view for schematically explaining the positional deviation between the projected image and the alignment mark. FIG. 12 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 13 is a flowchart illustrating an example of an alignment mark detection procedure of the processing apparatus (exposure apparatus) according to the second embodiment. FIG. 14 is an explanatory diagram showing an example of the detection position of the alignment mark. FIG. 15 is an explanatory diagram illustrating another example of the detection position of the alignment mark. FIG. 16 is a perspective view of a rotating drum applied to a processing apparatus (exposure apparatus) according to the third embodiment. FIG. 17 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 18 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to the deformation of the substrate. FIG. 19 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the third embodiment. FIG. 20 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 21 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. FIG. 22 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. FIG. 23 is a perspective view showing a model example for obtaining the deformation amount of each point on the substrate when the substrate is wound with tension applied to the cylindrical drum member. FIG. 24 is a graph showing a simulation result of the amount of displacement at each point associated with expansion and contraction in the longitudinal direction (MD direction) of the substrate according to the model example of FIG. 23 with a friction coefficient of 0.45. FIG. 25 is a graph showing a result of simulating the displacement amount of each point with the expansion and contraction in the longitudinal direction (MD direction) of the substrate according to the model example of FIG. FIG. 26 is a graph showing a result of simulating the displacement amount of each point with expansion and contraction in the short direction (TD direction) of the substrate according to the model example of FIG. 23 with a friction coefficient of 0.45. FIG. 27 is a graph showing a result of simulating the displacement amount of each point with the expansion and contraction in the short direction (TD direction) of the substrate according to the model example of FIG. FIG. 28 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the scope of the present invention. For example, in the following embodiments, a case where a flexible display panel using an active matrix type liquid crystal or OLED (organic EL) is manufactured as an electronic device will be described, but the present invention is not limited thereto. As an electronic device, a flexible solar cell panel in which a large number of cells of a wiring board (flexible printed circuit board) and photoelectric elements are arranged can be manufactured.

(First embodiment)
The substrate processing apparatus according to the first embodiment is an exposure apparatus that performs an exposure process on a display panel pattern (including patterns such as a large number of pixel portions, pixel electrodes, TFTs, and bus lines) on a flexible substrate. The exposure apparatus is used by being incorporated in a device manufacturing system (manufacturing line) that manufactures devices by performing various processes on the substrate after exposure. First, a device manufacturing system will be described.

<Device manufacturing system>
FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment. A device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. Examples of the flexible display include an organic EL display. This device manufacturing system 1 sends out the substrate P from the supply roll FR1 in which the flexible substrate P is wound in a roll shape, and continuously performs various processes on the delivered substrate P. A so-called roll-to-roll system is adopted in which the processed substrate P is wound around the collection roll FR2 as a flexible device. In the device manufacturing system 1 of the first embodiment, the substrate P, which is a film-like sheet, is sent out from the supply roll FR1, and the substrates P sent out from the supply roll FR1 are sequentially supplied to n processing apparatuses U1, U2. , U3, U4, U5,... Un, and the example until being wound around the collecting roll FR2. First, the board | substrate P used as the process target of the device manufacturing system 1 is demonstrated.

  As the material of the substrate P, for example, a foil (foil) made of a metal or alloy such as plastic, resin film, stainless steel, or the like is used. Examples of the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more.

  As the substrate P, for example, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that deformation amounts due to heat received in various processes applied to the substrate P can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.

  The substrate P thus configured becomes a supply roll FR1 by being wound in a roll shape, and this supply roll FR1 is mounted on the device manufacturing system 1. The device manufacturing system 1 to which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing one device on the substrate P sent out from the supply roll FR1. For this reason, the processed substrate P is in a state where a plurality of devices are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate. In addition, the substrate P is obtained by modifying and activating the surface by a predetermined pretreatment in advance, or by forming a fine partition structure (uneven structure) for precise patterning on the surface by an imprint method. But it ’s okay.

  The processed substrate P is recovered as a recovery roll FR2 by being wound into a roll. The collection roll FR2 is attached to a dicing device (not shown). The dicing apparatus to which the collection roll FR2 is mounted divides the processed substrate P for each device (dicing) to form a plurality of devices. Regarding the dimensions of the substrate P, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  Next, the device manufacturing system 1 will be described with reference to FIG. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is shown. The X direction is a direction connecting the supply roll FR1 and the recovery roll FR2 in the horizontal plane, and is the left-right direction in FIG. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the front-rear direction in FIG. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is the vertical direction, and is the vertical direction in FIG.

  The device manufacturing system 1 includes a substrate supply device 2 that supplies a substrate P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and processing is performed by the processing devices U1 to Un. The substrate recovery apparatus 4 that recovers the processed substrate P and the host controller 5 that controls each device of the device manufacturing system 1 are provided.

  A supply roll FR1 is rotatably mounted on the substrate supply apparatus 2. The substrate supply apparatus 2 includes a driving roller DR1 that sends out the substrate P from the mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller DR1 rotates while pinching both front and back surfaces of the substrate P, and feeds the substrate P in the transport direction from the supply roll FR1 to the collection roll FR2, thereby supplying the substrate P to the processing apparatuses U1 to Un. At this time, the edge position controller EPC1 sets the substrate P so that the position at the end (edge) in the width direction of the substrate P is within the range of about ± 10 μm to about ± 10 μm with respect to the target position. The position of the substrate P in the width direction is corrected by moving P in the width direction.

  A recovery roll FR2 is rotatably mounted on the substrate recovery apparatus 4. The substrate recovery apparatus 4 includes a driving roller DR2 that draws the processed substrate P toward the recovery roll FR2, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate collection device 4 rotates while sandwiching the front and back surfaces of the substrate P by the driving roller DR2, pulls the substrate P in the transport direction, and rotates the collection roll FR2, thereby winding the substrate P. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. .

  The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling material, a UV curable resin liquid, or the like is used. The processing apparatus U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the transport direction of the substrate P. The coating mechanism Gp1 includes a pressure drum roller R1 around which the substrate P is wound, and a coating roller R2 facing the pressure drum roller R1. The coating mechanism Gp1 sandwiches the substrate P between the impression cylinder roller R1 and the application roller R2 in a state where the supplied substrate P is wound around the impression cylinder roller R1. Then, the application mechanism Gp1 applies the photosensitive functional liquid by the application roller R2 while rotating the impression cylinder roller R1 and the application roller R2 to move the substrate P in the transport direction. The drying mechanism Gp2 blows drying air such as hot air or dry air, removes the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P.

  The processing device U2 heats the substrate P transported from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. It is. The processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air turn bars constitute a transport path for the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in a non-contact state on the surface side of the substrate P. The plurality of rollers and the plurality of air turn bars are arranged to form a meandering transport path so as to lengthen the transport path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path. The cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the environmental temperature of the subsequent process (processing apparatus U3). The cooling chamber HA2 is provided with a plurality of rollers, and the plurality of rollers are arranged in a meandering manner in order to lengthen the conveyance path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being transferred along a meandering transfer path. A driving roller DR3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the driving roller DR3 rotates while sandwiching the substrate P that has passed through the cooling chamber HA2, thereby moving the substrate P toward the processing apparatus U3. Supply.

The processing apparatus (substrate processing apparatus) U3 projects a pattern such as a display panel circuit or wiring on the substrate (photosensitive substrate) P having a photosensitive functional layer formed on the surface supplied from the processing apparatus U2. An exposure apparatus that performs exposure. Although details will be described later, the processing device U3 illuminates the illumination light beam on the outer peripheral surface of the transmissive or reflective cylindrical mask (mask) DM, and the pattern appears in the illumination region on the cylindrical mask (mask) DM. Then, the transmitted light or the reflected light is projected and exposed to the substrate P through the projection optical system PL.
The processing device U3 includes a driving roller DR4 that sends the substrate P supplied from the processing device U2 downstream in the transport direction, an edge position controller EPC that adjusts the position in the width direction (Y direction) of the substrate P, and the substrate P. A back buffer BDL is provided that retains a certain amount of slack in the substrate P when it is moved in the direction opposite to the normal transfer direction (in reverse transfer).

  The back buffer unit BDL has two sets of nip type driving rollers BDR1 and BDR2 that send the substrate P to the upstream side or the downstream side in the transport direction in a state in which the substrate P is slackened. The driving roller DR4 rotates while sandwiching both front and back surfaces of the substrate P, and sends the substrate P downstream in the transport direction. Thereafter, the substrate P is supported in a cylindrical shape on a part of the outer peripheral surface of the rotary drum DR5, and is conveyed so as to pass through the projection region (exposure position) of the projection optical system PL. The edge position controller EPC is configured in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position.

  Further, the processing device U3 includes a buffer unit DL having two sets of nip-type driving rollers DR6 and DR7 that send the substrate P to the downstream side in the transport direction in a state where sagging is applied to the exposed substrate P. . The two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P. The drive roller DR6 rotates while sandwiching the upstream side of the substrate P to be transported, and the drive roller DR7 rotates while sandwiching the downstream side of the substrate P to be transported to direct the substrate P toward the processing apparatus U4. Supply. At this time, since the substrate P is stored in the buffer portion DL for a certain length, it is possible to absorb fluctuations in the conveyance speed occurring downstream of the drive roller DR6 in the conveyance direction and to reversely convey the substrate P. Further, in the processing apparatus U3, an alignment microscope that detects an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) the partial image of the mask DM with the substrate P. AMG1 and AMG2 are provided.

  The processing apparatus U4 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the exposed substrate P conveyed from the processing apparatus U3. The processing apparatus U4 has three processing tanks BT1, BT2, BT3 hierarchized in the vertical direction (Z direction) and a plurality of rollers for transporting the substrate P therein. The plurality of rollers are arranged so as to serve as a conveyance path through which the substrate P sequentially passes through the three processing tanks BT1, BT2, and BT3. A driving roller DR8 is provided on the downstream side in the transport direction of the processing tank BT3, and the driving roller DR8 rotates while sandwiching the substrate P that has passed through the processing tank BT3, so that the substrate P is directed toward the processing apparatus U5. Supply.

  Although illustration is omitted, the processing apparatus U5 is a drying apparatus that dries the substrate P transported from the processing apparatus U4. The processing apparatus U5 removes the liquid adhering to the substrate P wet-processed in the processing apparatus U4, and adjusts the moisture content of the substrate P to a predetermined value. The substrate P dried by the processing apparatus U5 is transferred to the processing apparatus Un through several processing apparatuses. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 4.

  The host control device 5 performs overall control of the substrate supply device 2, the substrate collection device 4, and the plurality of processing devices U1 to Un. The host control device 5 controls the substrate supply device 2 and the substrate recovery device 4 to transport the substrate P from the substrate supply device 2 toward the substrate recovery device 4. Further, the host control device 5 controls the plurality of processing devices U <b> 1 to Un to perform various processes on the substrate P while synchronizing with the transport of the substrate P.

<Exposure device (substrate processing device)>
Next, the configuration of an exposure apparatus (substrate processing apparatus) as the processing apparatus U3 of the first embodiment will be described with reference to FIGS. FIG. 2 is a view showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. FIG. 3 is a view showing the arrangement of illumination areas and projection areas of the exposure apparatus shown in FIG. FIG. 4 is a diagram showing the configuration of the illumination optical system and the projection optical system of the exposure apparatus shown in FIG.

  As shown in FIG. 2, the processing device U <b> 3 includes an exposure device (processing mechanism) EX and a transport device 9. The exposure apparatus EX is supplied with a substrate P (sheet, film, etc.) by the transport device 9. The exposure apparatus EX is a so-called scanning exposure apparatus. The cylindrical mask DM is rotated while the rotation of the cylindrical mask DM and the feeding of the flexible substrate P, that is, the rotation of the rotary drum DR5 shown in FIG. An image of the formed pattern is projected onto the substrate P via a multi-lens projection optical system PL (PL1 to PL6) having a projection magnification of equal magnification (× 1). In the exposure apparatus EX shown in FIG. 2, the Y axis of the XYZ orthogonal coordinate system is set parallel to the rotation center line AX1 of the first drum member 21 constituting the cylindrical mask DM. Similarly, the exposure apparatus EX sets the Y axis of the XYZ orthogonal coordinate system in parallel with the rotation center line AX2 of the rotary drum DR5 (hereinafter also referred to as the second drum member 22).

  As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure apparatus EX rotates and moves the cylindrical mask DM held by the mask holding apparatus 12 and transfers the substrate P by the transfer apparatus 9. The illumination mechanism IU illuminates a part (illumination region IR) of the pattern surface (outer peripheral surface) of the cylindrical mask DM from the inside of the cylindrical mask DM with uniform brightness by the illumination light beam EL1. The projection optical system PL projects an image of the pattern in the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) being transported by the transport device 9 and the rotary drum DR5. Thus, an image of a predetermined pattern (mask pattern) arranged along the outer peripheral surface of the cylindrical mask DM is scanned and exposed on the substrate P. The control device 14 controls each part of the exposure apparatus EX and the transport apparatus 9 so as to cause each part and the transport apparatus 9 to execute a predetermined operation.

  The control device 14 may be part or all of the host control device 5 that controls the plurality of processing devices U1 to Un of the device manufacturing system described above. The control device 14 may be a device that is controlled by the host control device 5 and is different from the host control device 5. The control device 14 includes, for example, a computer system. The computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices. The process of operation of each unit of the processing device U3 is stored in a storage unit of a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing this program. When the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment). The computer-readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, and a CD-ROM, and a storage device such as a hard disk built in the computer system. A computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients. Further, the program may be a program for realizing a part of the function of the processing device U3, or may be a program capable of realizing the function of the processing device U3 in combination with a program already recorded in the computer system. The host control device 5 can be realized using a computer system in the same manner as the control device 14.

  As shown in FIG. 2, the mask holding device 12 includes a first drum member 21 that holds the cylindrical mask DM, a guide roller 23 that supports the first drum member 21, and a first drive unit 26 that receives a control command from the control device 14. A driving roller 24 that drives the first drum member 21 and a first detector 25 that detects the position of the first drum member 21 are provided.

  The first drum member 21 is a cylindrical member having a curved surface curved with a certain radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) serving as a predetermined axis, and rotates around the predetermined axis. . The first drum member 21 forms a first surface P1 on which the illumination area IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (first central axis AX1) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like. The first drum member 21 is made of, for example, glass or quartz and has a cylindrical shape with a certain thickness, and an outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. As described above, the first drum member 21 has a curved surface that is curved with a constant radius from the rotation center line AX1 that is a predetermined axis. The first drum member 21 is driven by the drive roller 24 and can rotate around the rotation center line AX1 that is a predetermined axis.

  The cylindrical mask DM is prepared as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer of chromium or the like on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 μm to 500 μm). The The mask holding device 12 is used in a state in which the cylindrical mask DM is curved following the curved surface of the outer peripheral surface of the first drum member 21 and is wound (attached) to the curved surface. The cylindrical mask DM has a pattern non-formation region where no pattern is formed, and is attached to the first drum member 21 in the pattern non-formation region. The cylindrical mask DM can be released with respect to the first drum member 21.

  The cylindrical mask DM is made of an ultrathin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of the transparent cylindrical base material. Alternatively, a mask pattern formed by a light shielding layer may be drawn and integrated. Also in this case, the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.

  The first detector 25 optically detects the rotational position of the first drum member 21 and is composed of, for example, a rotary encoder. The first detector 25 outputs information indicating the detected rotational position of the first drum member 21, for example, a two-phase signal from an encoder head described later, to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts the torque and rotation speed for rotating the drive roller 24 in accordance with a control signal input from the control device 14. The control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result by the first detector 25. Then, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.

  The second drum member 22 is a cylindrical member having a curved surface (first curved surface) curved at a certain radius from a rotation center line AX2 (hereinafter also referred to as a second central axis AX2) serving as a predetermined axis. It is a rotating drum that rotates around. The second drum member 22 forms a second surface (support surface) P2 that supports a part including the projection area PA on the substrate P onto which the imaging light beam from the projection optical system PL is projected in an arc shape (cylindrical shape). To do. The second drum member 22 is a drive roller DR5 that rotates by torque supplied from a second drive unit 36 including an actuator such as an electric motor.

  As described above, the second drum member 22 is the drive roller DR5 and also serves as a substrate support member (substrate stage) that supports the substrate P to be exposed (processed). That is, the second drum member 22 may be a part of the exposure apparatus EX. The second drum member 22 is rotatable around a rotation center line AX2 (second center axis AX2) of the second drum member 22, and the substrate P is an outer peripheral surface (cylindrical surface) on the second drum member 22. ), The projection area PA is arranged in a part of the curved portion.

  In the present embodiment, out of the imaging light beam EL2 reaching the projection area PA, the principal ray passing through each center point of the projection area PA is viewed from the second central axis AX2 of the second drum member 22, as shown in FIG. The first specific position PX1 and the second specific position PX2 are respectively arranged at positions of the angle θ in the circumferential direction across the center plane P3. The specific position PX, which is between the first specific position PX1 and the second specific position PX2 when viewed from the rotation center line AX2, is exposed to the substrate P on the curved surface of the second drum member 22 on average. It is the center of the area.

  The transport device 9 includes a drive roller DR4, a second drum member 22 (drive roller DR5), and a drive roller DR6. The transport device 9 moves the substrate P in the transport direction in which the substrate P is transported so that the substrate P passes through the first specific position PX1, the specific position PX, and the second specific position PX2. The second drive unit 36 adjusts the torque for rotating the second drum member 22 in accordance with the control signal output from the control device 14.

  In the present embodiment, the substrate P that has been transported from the upstream of the transport path to the drive roller DR4 is guided to the first guide member 33 via the drive roller DR4 and transported to the second drum member 22. The substrate P is supported on the surface of the second drum member 22 and conveyed to the second guide member 33. The substrate P that has passed through the second guide member 33 is transported downstream of the transport path. The rotation center line AX2 of the second drum member 22 (drive roller DR5) and the rotation center lines of the drive rollers DR4 and DR6 are both set to be parallel to the Y axis.

  Around the second drum member 22, a first guide member 32 and a second guide member 32 that restrict the transport direction in which the substrate P is transported and guide the substrate P are disposed. A part of the substrate P is wound around the second drum member 22, and the substrate P starts to move away from the curved surface of the second surface P2 from the entrance position IA in the transport direction where the substrate P starts to contact the curved surface of the second surface P2. The substrate P up to the separation position OA is supported. For example, the first guide member 32 and the second guide member 32 adjust the tension acting on the substrate P in the transport path by moving in the transport direction of the substrate P, for example. In addition, the first guide member 32 and the second guide member 33, for example, move around the outer periphery of the second drum member 22 by moving in the transport direction of the substrate P, and the above-described entry position IA, separation position OA, and the like. Can be adjusted. The transport device 9, the first guide member 32, and the second guide member 33 are only required to transport the substrate P along the projection area PA of the projection optical system PL, and the transport device 9, the first guide member 32, and the like. The configuration of the second guide member 33 can be changed as appropriate.

  The second detector 35 is composed of, for example, a rotary encoder or the like, and optically detects the rotational position of the second drum member 22. The second detector 35 outputs information indicating the detected rotational position of the second drum member 22 (for example, a two-phase signal from encoder heads EN1, EN2, EN3, EN4, and EN5 described later) to the control device 14. . The control device 14 controls the rotational position of the second drum member 22 by controlling the second drive unit 36 based on the detection result by the second detector 35, and the first drum member 21 (cylindrical mask DM). The second drum member 22 is moved synchronously (synchronized rotation). The detailed configuration of the second detector 35 will be described later.

  The exposure apparatus EX of the present embodiment is an exposure apparatus that is assumed to be equipped with a so-called multi-lens projection optical system PL. The projection optical system PL includes a plurality of projection modules that project some images in the pattern of the cylindrical mask DM. For example, in FIG. 2, three projection modules (projection optical systems) PL1, PL3, PL5 are arranged at regular intervals in the Y direction on the left side of the central plane P3, and three projection modules (projection optics) are also arranged on the right side of the central plane P3. System) PL2, PL4, and PL6 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the end portions in the Y direction of the areas exposed by the plurality of projection modules PL1 to PL6 (projection areas PA1 to PA6) are overlapped with each other by scanning, thereby forming a desired pattern. Project the whole picture. In such an exposure apparatus EX, even when the Y-direction size of the pattern on the cylindrical mask DM becomes large, and it becomes inevitably necessary to handle the substrate P having a large width in the Y-direction, the projection module PL and the projection module Since it is only necessary to add the module on the illumination mechanism IU side corresponding to the PL in the Y direction, there is an advantage that the panel size (the width of the substrate P) can be easily increased.

  The exposure apparatus EX may not be a multi-lens system. For example, when the dimension in the width direction of the substrate P is small to some extent, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. Further, each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project a plurality of device patterns in parallel by a plurality of projection modules.

  The illumination mechanism IU of this embodiment includes a light source device 13 and an illumination optical system. The illumination optical system includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device 13 includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm). The illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL via a light guide member such as an optical fiber.

  Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses. In the present embodiment, light emitted from the light source device and passing through any one of the plurality of illumination modules IL is referred to as illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL are arranged inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination region IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

  FIG. 3 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. 3 is a plan view (on the left side in FIG. 3) of the illumination area IR on the cylindrical mask DM disposed on the first drum member 21 as viewed from the −Z side, and the second drum member 22 includes A plan view of the projection area PA on the arranged substrate P as viewed from the + Z side (the figure on the right side in FIG. 3) is shown. A symbol Xs in FIG. 3 indicates the rotation direction (movement direction) of the first drum member 21 or the second drum member 22.

  Each of the plurality of illumination modules IL illuminates the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1, and the second illumination module IL illuminates the second illumination region IR2.

  The first illumination region IR1 will be described as a trapezoidal region elongated in the Y direction. However, in the case of a projection optical system configured to form an intermediate image plane, such as the projection optical system (projection module) PL, the intermediate image Since a field stop plate having a trapezoidal opening can be arranged at the position of, a rectangular region including the trapezoidal opening may be used. The third illumination region IR3 and the fifth illumination region IR5 are regions having the same shape as the first illumination region IR1, respectively, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR2 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1 with respect to the center plane P3. The fourth illumination region IR4 and the sixth illumination region IR6 are regions having the same shape as the second illumination region IR2, respectively, and are arranged at regular intervals in the Y-axis direction.

  As shown in FIG. 3, each of the first to sixth illumination regions IR1 to IR6 has a triangular portion of a hypotenuse portion of an adjacent trapezoidal illumination region when viewed along the circumferential direction of the first surface P1. They are arranged so that they overlap (overlapping). Therefore, for example, the first region A1 on the cylindrical mask DM that passes through the first illumination region IR1 by the rotation of the first drum member 21 is the cylindrical mask DM that passes through the second illumination region IR2 by the rotation of the first drum member 21. Partly overlaps with the second region A2 above.

  In the present embodiment, the cylindrical mask DM includes a pattern formation region A3 where a pattern is formed and a pattern non-formation region A4 where a pattern is not formed. The pattern non-formation region A4 is arranged so as to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation area A3 of the cylindrical mask DM moves in the movement direction Xs with the rotation of the first drum member 21, and each partial area in the Y-axis direction of the pattern formation area A3 includes first to sixth illumination areas. Passes any one of IR1 to IR6. In other words, the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A3.

  As shown in FIG. 2, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction has a one-to-one correspondence with each of the first to sixth illumination modules IL, and is illuminated by the corresponding illumination module. An image of a partial pattern of the cylindrical mask DM that appears in the illumination area IR is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1 corresponds to the first illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 3) illuminated by the first illumination module IL on the substrate P. Is projected onto the first projection area PA1. The third projection module PL3 and the fifth projection module PL5 correspond to the third and fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are arranged at a position overlapping the first projection module PL1 when viewed from the Y-axis direction.

  The second projection module PL2 corresponds to the second illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 3) illuminated by the second illumination module IL on the substrate P. Is projected onto the second projection area PA2. When viewed from the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the center plane P3.

  The fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arranged at a position overlapping the second projection module PL2.

  In the present embodiment, light reaching each illumination region IR1 to IR6 on the cylindrical mask DM from each illumination module IL of the illumination mechanism IU is defined as an illumination light beam EL1. Further, the light reaching the projection areas PA1 to PA6 after receiving the intensity distribution modulation corresponding to the partial pattern of the cylindrical mask DM appearing in the illumination areas IR1 to IR6 and entering the projection modules PL1 to PL6 Let it be EL2. Of the imaging light beam EL2 reaching the projection areas PA1 to PA6, the principal ray passing through the center points of the projection areas PA1 to PA6 is, as shown in FIG. 2, the second central axis AX2 of the second drum member 22. When viewed from the center, the central plane P3 is disposed at a position (specific position) at an angle θ in the circumferential direction.

  As shown in FIG. 3, the pattern image in the first illumination area IR1 is projected onto the first projection area PA1, the pattern image in the third illumination area IR3 is projected onto the third projection area PA3, and the fifth illumination area The pattern image in IR5 is projected onto the fifth projection area PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

  The pattern image in the second illumination area IR2 is projected onto the second projection area PA2. In the present embodiment, the second projection area PA2 is arranged symmetrically with the first projection area PA1 with respect to the center plane P3 when viewed from the Y-axis direction. The pattern image in the fourth illumination area IR4 is projected on the fourth projection area PA4, and the pattern image in the sixth illumination area IR6 is projected on the sixth projection area PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

  Each of the first to sixth projection areas PA1 to PA6 is adjacent to each other in the direction parallel to the second central axis AX2 (odd number and even number) when viewed along the circumferential direction of the second surface P2. It arrange | positions so that the edge part (trapezoid triangular part) of each other may overlap. Therefore, for example, the third area A5 on the substrate P passing through the first projection area PA1 due to the rotation of the second drum member 22 is on the substrate P passing through the second projection area PA2 due to the rotation of the second drum member 22. Partly overlaps with the fourth area A6. The first projection area PA1 and the second projection area PA2 are set so that the exposure amount in the region where the third region A5 and the fourth region A6 overlap is substantially the same as the exposure amount in the non-overlapping region. The shape etc. are set. The first to sixth projection areas PA1 to PA6 are arranged so as to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

  Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second projection module PL2 to the fifth projection module PL5 has the same configuration as the first projection module PL1. Therefore, the configuration of the first projection module PL1 will be described on behalf of the projection optical system PL, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.

  The first projection module PL1 shown in FIG. 4 includes a first optical system 41 that forms an image of the pattern of the cylindrical mask DM arranged in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41. A second optical system 42 that re-images at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on the intermediate image plane P7 on which the intermediate image is formed. .

  Further, the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P. The image shift correction optical member 45 is a shift adjustment device that slightly shifts the projected image laterally within the image plane. The magnification correcting optical member 47 is a magnification adjusting device that finely corrects the magnification of the projected image. The rotation correction mechanism 46 is a shift adjustment device that slightly rotates the projected image within the image plane.

  The imaging light beam EL2 from the pattern of the cylindrical mask DM exits from the first illumination region IR1 in the normal direction (D1), and enters the image shift correction optical member 45 through the focus correction optical member 44. The imaging light beam EL <b> 2 that has passed through the image shift correction optical member 45 is reflected by the first reflecting surface (plane mirror) p <b> 4 of the first deflecting member 50 that is an element of the first optical system 41, and passes through the first lens group 51. The light is reflected by the first concave mirror 52 (reflecting surface p6), passes through the first lens group 51 again, is reflected by the second reflecting surface (planar mirror) p5 of the first deflecting member 50, and enters the first field stop 43. The imaging light beam EL2 that has passed through the first field stop 43 is reflected by the third reflecting surface (plane mirror) p8 of the second deflecting member 57, which is an element of the second optical system 42, and passes through the second lens group 58 for the second. The light is reflected by the two concave mirrors 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflecting member 57, and enters the optical member 47 for magnification correction. The imaging light beam EL2 emitted from the magnification correcting optical member 47 enters the first projection area PA1 on the substrate P, and an image of the pattern appearing in the first illumination area IR1 is equal to the first projection area PA1 (× Projected in 1).

  When the radius of the cylindrical mask DM shown in FIG. 2 is the radius r1, the radius of the cylindrical surface of the substrate P wound around the second drum member 22 is the radius r2, and the radius r1 and the radius r2 are equal, each projection module The principal ray of the imaging light beam EL2 on the mask side of PL1 to PL6 is tilted so as to pass through the central axis AX1 of the cylindrical mask DM, and the inclination angle thereof is the inclination angle of the principal ray of the imaging light beam EL2 on the substrate P side. This is the same as θ (± θ with respect to the center plane P3).

  The angle θ3 formed by the third reflecting surface p8 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ2 formed by the second reflecting surface p5 of the first deflecting member 50 and the first optical axis AX3. is there. The angle θ4 formed by the fourth reflecting surface p9 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ1 formed by the first reflecting surface p4 of the first deflecting member 50 and the first optical axis AX3. The same. In order to give the inclination angle θ described above, the angle θ1 of the first reflecting surface p4 of the first deflecting member 50 shown in FIG. 4 with respect to the first optical axis AX3 is made smaller than 45 ° by Δθ1, and the second deflecting member 57 The angle θ4 of the fourth reflecting surface p9 with respect to the second optical axis AX4 is made smaller by Δθ4 than 45 °. Δθ1 and Δθ4 are set to have a relationship of Δθ1 = Δθ4 = θ / 2 with respect to the angle θ shown in FIG.

  FIG. 5 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) in FIG. FIG. 7 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. In FIG. 5, for convenience, only the second to fourth projection areas PA2 to PA4 are shown, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not shown.

  The second detector 35 shown in FIG. 2 optically detects the rotational position of the second drum member 22, and has a highly circular scale disk (scale member) SD and an encoder head as a reading device. Includes EN1, EN2, EN3, EN4, EN5.

  The scale disk SD is fixed to the end of the second drum member 22 orthogonal to the rotation axis ST of the second drum member 22. For this reason, the scale disk SD rotates integrally with the rotation axis ST around the rotation center line AX2. For example, a scale (lattice) is engraved on the outer peripheral surface of the scale disk SD as the scale portion GP. The scale part GP is annularly arranged along the circumferential direction in which the second drum member 22 rotates, and rotates around the rotation axis ST (second central axis AX2) together with the second drum member 22. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP when viewed from the rotation axis ST (second central axis AX2). The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed to face the scale part GP, and can read the scale part GP in a non-contact manner. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second drum member 22.

  The encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. As shown in FIG. 5, the installation directions (angle directions in the XZ plane with the rotation center line AX2 as the center) of the encoder heads EN1, EN2, EN3, EN4, EN5 are set as the installation direction lines Le1, Le2, Le3, Le4, When represented by Le5, as shown in FIG. 7, the encoder heads EN1 and EN2 are arranged such that the installation orientation lines Le1 and Le2 are at an angle ± θ ° with respect to the center plane P3. In the present embodiment, for example, the angle θ is 15 °.

  Projection modules PL <b> 1 to PL <b> 6 shown in FIG. 4 are processing units of the exposure apparatus EX that performs irradiation processing for irradiating the substrate P with light, using the substrate P as an object to be processed. In the exposure apparatus EX, the principal rays of the two imaging light beams EL2 enter the substrate P with respect to the substrate P. The projection modules PL1, PL3, and PL5 serve as the first processing unit, and the projection modules PL2, PL4, and PL6 serve as the second processing unit, and the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P. The position is a specific position where the irradiation process for irradiating the substrate P with light is performed. The specific position is a position at an angle ± θ in the circumferential direction with respect to the center plane P3 on the curved substrate P on the second drum member 22 when viewed from the second center axis AX2 of the second drum member 22. The installation heading line Le1 of the encoder head EN1 is equal to the inclination angle θ of the principal ray passing through the center point of each projection area (projection field of view) PA1, PA3, PA5 of the odd-numbered projection modules PL1, PL3, PL5 with respect to the central plane P3. The installation direction line Le2 of the head EN2 has an inclination angle θ with respect to the center plane P3 of the principal ray passing through the center points of the projection areas (projection fields) PA2, PA4, PA6 of the even-numbered projection modules PL2, PL4, PL6. Match. For this reason, the encoder head EN1 serves as a reading device that reads the scale portion GP located in the direction connecting the first specific position PX1 and the second central axis AX2. The encoder head EN2 serves as a reading device that reads the scale portion GP located in the direction connecting the second specific position PX2 and the second central axis AX2.

  The encoder head EN4 is arranged on the rear side in the transport direction of the substrate P, that is, before the exposure position (projection area), and rotates the installation direction line Le1 of the encoder head EN1 toward the rear side in the transport direction of the substrate P. It is set on the installation direction line Le4 rotated around the axis of the center line AX2. Further, the encoder head EN5 is set on the installation direction line Le5 obtained by rotating the installation direction line Le1 of the encoder head EN1 around the axis of the rotation center line AX2 toward the rear side in the transport direction of the substrate P.

  The encoder head EN3 is arranged on the opposite side of the encoder heads EN1 and EN2 with the rotation center line AX2 interposed therebetween, and the installation orientation line Le3 is set on the center plane P3.

  The scale disk SD, which is a scale member, is made so as to have a diameter as large as possible (for example, a diameter of 20 cm or more) in order to increase measurement resolution, using a low thermal expansion metal, glass, ceramics or the like as a base material. In FIG. 5, the diameter of the scale disk SD is smaller than the diameter of the second drum member 22, but of the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface around which the substrate P is wound, and the scale The so-called measurement Abbe error can be further reduced by aligning (substantially matching) the diameter of the scale part GP of the disk SD.

  The minimum pitch of the scale (lattice) engraved in the circumferential direction of the scale part GP is limited by the performance of a scale engraving device that processes the scale disk SD. For this reason, if the diameter of the scale disk SD is increased, the angle measurement resolution corresponding to the minimum pitch can be increased accordingly.

  When the direction of the installation azimuth lines Le1 and Le2 where the encoder heads EN1 and EN2 for reading the scale part GP are arranged is viewed from the rotation center line AX2, the principal ray of the imaging light beam EL2 is incident on the substrate P with respect to the substrate P. For example, even when the second drum member 22 is shifted in the X direction due to a slight backlash (about 2 μm to 3 μm) of a bearing (bearing) that supports the rotating shaft ST, the projection is performed by this shift. The position error relating to the transport direction (Xs) of the substrate P that may occur in the areas PA1 to PA6 can be measured with high accuracy by the encoder heads EN1 and EN2.

  As shown in FIG. 6, an image of a portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 and the substrate P are relatively placed on a portion of the substrate P supported by the curved surface of the second drum member 22. In order to perform alignment (alignment), alignment microscopes AMG1 and AMG2 for detecting alignment marks or the like formed in advance on the substrate P are provided. The alignment microscopes AMG1 and AMG2 have a detection probe for detecting a specific pattern formed discretely or continuously on the substrate P, and a detection region by the detection probe is closer to the transport direction of the substrate P than the specific position described above. The pattern detection device is arranged around the second drum member 22 so as to be set on the rear side.

  As shown in FIG. 6, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 are detection probes on both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks formed near both ends of the substrate P. The alignment microscopes AMG1 and AMG2 are detection probes other than both side ends of the second drum member 22 in the Y-axis direction (the width direction of the substrate P), and are formed on the substrate P along the longitudinal direction, for example. It is possible to observe or detect an alignment mark formed in a blank space between the pattern formation regions of the display panel.

  As shown in FIGS. 6 and 7, when viewed in the XZ plane and from the rotation center line AX2, it is the same direction as the detection center of the observation direction AM1 (toward the second central axis AX2) of the substrate P by the alignment microscope AMG1. Thus, the encoder head EN4 is arranged on the installation direction line Le4 set in the radial direction of the scale part GP. In addition, the radial direction of the scale portion GP is in the same direction as the detection center AM2 of the substrate P observed by the alignment microscope AMG2 (toward the rotation center line AX2) when viewed from the rotation center line AX2 in the XZ plane. The encoder head EN5 is arranged on the installation azimuth line Le5. As described above, the detection probes of the alignment microscopes AMG1 and AMG2 are arranged around the second drum member 22 when viewed from the second central axis AX2, and the position where the encoder heads EN4 and EN5 are arranged is connected to the second central axis AX2. The direction (installation azimuth lines Le4 and Le5) is arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. The positions around the rotation center line AX2 where the alignment microscopes AMG1 and AMG2 and encoder heads EN4 and EN5 are arranged are from the entrance position IA where the substrate P starts to contact the second drum member 22 and the second drum member 22. It is set between the separation position OA from which the substrate P comes off. The specific position PX shown in FIG. 2 is on the extension line of the center plane P3 viewed from the second central axis AX2 shown in FIG. 7, and the specific position PX is a position where the alignment microscope AMG1 as the first detection probe is arranged. At a position around the second drum member 22 that is rotated to the separation position OA side from the specific position PX as viewed from the second central axis AX by an angle substantially the same as the angle β rotated about the second central axis AX2. An alignment microscope AMG2 which is a second detection probe is arranged.

  The entrance position IA and the separation position OA vary depending on the transport speed at which the transport device 9 transports the substrate P. For example, when the conveyance speed is increased, the distance that the substrate P is wound around the outer periphery of the second drum member 22 is increased, and the line connecting the entry position IA and the second center axis AX2, the separation position OA, and the second center axis AX2. The angle between the line connecting and is increased. When the transport speed is reduced, the distance that the substrate P is wound around the outer periphery of the second drum member 22 is shortened, and the line connecting the entry position IA and the second center axis AX2, the separation position OA, and the second center axis AX2 are defined. The angle formed by the connecting line is reduced.

  The above-described observation direction AM2 of the alignment microscope AMG2 is arranged on the front side in the transport direction of the substrate P, that is, behind the exposure position (projection region), and is formed near the end of the substrate P in the Y direction. (Formed in an area within several tens of μm to several hundreds of μm square) is detected at high speed by an imaging device or the like while the substrate P is being sent at a predetermined speed, and in a microscope field of view (imaging range) Sampling the mark image at high speed. By storing the rotational angle position of the scale disk SD sequentially measured by the encoder head EN5 at the moment when the sampling is performed, the mark position of the alignment mark on the substrate P and the rotational angle position of the second drum member 22 are stored. Is required.

  On the other hand, the observation direction AM1 of the alignment microscope AMG1 described above is arranged on the rear side in the transport direction of the substrate P, that is, in front of the exposure position (projection region), and is formed in the vicinity of the end portion in the Y direction of the substrate P. An image of an alignment mark (formed in an area within several tens of μm to several hundred μm square) is sampled at high speed by an imaging device or the like, similarly to the alignment microscope AMG2, and is sequentially measured by the encoder head EN4 at the instant of sampling. By storing the rotation angle position of the scale disk SD, the correspondence between the mark position of the alignment mark on the substrate P and the rotation angle position of the second drum member 22 is obtained.

  When the mark detected by the alignment microscope AMG1 is detected by the alignment microscope AMG2, the difference between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is precisely determined in advance. Are compared with the opening angles of the installation orientation lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2. If the opening angle has an error, there is a possibility that the substrate P is slightly slipped on the second drum member 22 between the entry position IA and the separation position OA, or the conveyance direction (circumferential direction). ) Or in a direction parallel to the second central axis AX2 (Y-axis direction).

  Generally, the positional error during patterning is determined according to the fineness and overlay accuracy of the device pattern formed on the substrate P. For example, a 10 μm-wide line pattern is accurately superimposed on the underlying pattern layer. In order to perform the alignment exposure, only an error of a fraction of that, that is, a positional error of about ± 2 μm is allowed in terms of the dimension on the substrate P.

  In order to realize such high-accuracy measurement, the measurement direction of the mark image by each alignment microscope AMG1, AMG2 (peripheral tangent direction of the second drum member 22 in the XZ plane) and the encoder heads EN4, EN5 It is necessary to align the measurement direction (peripheral tangent direction of the scale part GP in the XZ plane) within an allowable angle error.

  As described above, the encoder heads EN4 and EN5 are arranged so as to coincide with the measurement direction of the alignment mark on the substrate P by the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second drum member 22). . For this reason, when the position of the substrate P (mark) is detected by the alignment microscopes AMG1 and AMG2 (image sampling), the second drum member 22 (scale disk SD) is orthogonal to the installation orientation lines Le4 and Le5 in the XZ plane. Even when shifting in the circumferential direction (tangential direction), it is possible to perform highly accurate position measurement in consideration of the shift of the second drum member 22.

  Since encoder heads EN1 to EN5 are arranged at five locations around the scale portion GP of the scale disk SD as viewed from the second central axis AX2, output of measurement values by appropriate two or three encoder heads among them is output. It is also possible to obtain the roundness (shape distortion), eccentricity error, etc. of the scale part GP of the scale disk SD by performing the arithmetic processing in combination.

  FIG. 8 is an explanatory diagram illustrating deformation of the substrate according to the first embodiment. In the exposure apparatus EX, if there is a looseness in the substrate P that is in contact with the second drum member 22, the substrate P may be wrinkled. Therefore, in the exposure apparatus EX, a tension is applied to the substrate when the substrate P is transported. As shown in FIG. 8, when tension is applied to the substrate P, the end of the substrate P in the Y direction is bent in an arc before entering the curved surface of the second drum member 22, and tension (tension) is applied. There is a possibility that deformation Pw in the width direction of the substrate P occurs due to the influence of the above. FIG. 9 is an explanatory diagram of an example of alignment marks. An alignment microscope AMG1 shown in FIG. 8 is a detection probe on both ends in the Y direction of the second drum member 22, and always observes alignment marks ma formed near both ends of the substrate P shown in FIG. 9 along the transport direction α. Or can be detected. As shown in FIG. 9, the substrate P is often a long sheet having the same width direction.

  As shown in FIG. 8, when tension is applied to the substrate P, from the entry position (position where the contact starts) IA entering the curved surface of the second drum member 22 to the microscope field of view (imaging range) of the alignment microscope AMG1. If the predetermined distance QL is, for example, about several centimeters, the original width PP of the substrate P can be approached. As described above, at the entry position IA, there is a possibility that the substrate P is deformed due to the tension applied to the substrate P and the friction coefficient of the outer peripheral surface of the second drum member 22, but the entry position IA If the position is a predetermined distance QL from the substrate P, the substrate P and the second drum member 22 are in close contact with each other, the tension applied to the substrate P is evenly applied, and the deformation of the substrate P is kept in a stable state. .

  FIG. 10 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to deformation of the substrate. FIG. 11 is an explanatory view for schematically explaining the positional deviation between the projected image and the alignment mark. FIG. 12 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment. As shown in FIG. 10, the alignment microscope AMG1 detects the alignment mark ma as a first detection probe within the range of the microscope visual field (imaging range) mam1 in the detection direction AM1. Similarly, the alignment microscope AMG2 detects the alignment mark ma as a second detection probe within the range of the microscope visual field (imaging range) mam2 in the detection direction AM2. Thus, alignment microscope AMG1 and alignment microscope AMG2 detect alignment mark ma which is a specific pattern on substrate P shown in FIG. 10 (step S11). The alignment microscope AMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 store the alignment mark ma as image data in the storage unit of the control device 14 as the first pattern detection device. . The alignment microscope AMG2 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG2 store the alignment mark ma as image data in the storage unit of the control device 14 as the second pattern detection device. .

  Next, the alignment mark ma which is the same as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam, stored in the storage unit in association with the position information of the encoder head EN4, is obtained from the position information of the encoder head EN5. Imaging range) Detected as alignment mark ma detected at mam2, and the imaging data are compared with each other. For example, the control device 14 calculates the interval WY1 of the alignment mark ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment mark ma in the microscope visual field (imaging range) mam1. Then, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma in the microscope visual field (imaging range) mam1 from the positional information of the encoder head EN5 in the microscope visual field (imaging range) mam2, and from the imaging data, The interval WY2 between the alignment marks ma in the width direction (Y direction) of the substrate P is calculated. When the difference between the interval WY2 and the interval WY1 is within an allowable value stored in advance in the storage unit and there is no change in the imaging data of the alignment mark ma due to the deformation of the substrate P (No in step S12), the control device 14 performs step The process of S11 is executed. When the difference between the interval WY2 and the interval WY1 exceeds the allowable value stored in the storage unit in advance, and there is a change in the imaging data of the alignment mark ma due to the deformation of the substrate P (Yes in step S12), the control device 14 The process proceeds to step S13.

  Alternatively, the same alignment mark ma as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam 1 stored in the storage unit in association with the position information of the encoder head EN4 is obtained from the position information of the encoder head EN5. Range) Detected as an alignment mark ma detected at mam2, and the imaged data are compared with each other. Here, the alignment microscope AMG1 can detect the exposed projection image mas. For this purpose, the alignment microscope AMG1 is, for example, a phase contrast microscope or a polarization microscope. For example, when the resist material receives light and changes the refractive index of the material, the phase contrast microscope or the polarization microscope can detect a change in the refractive index as a difference in contrast and detect an exposure state as a latent image before development. In this case, when a projection image having the same shape as that of the alignment mark mam shown in FIG. 11 is exposed, the projection image mas having a latent image shape is also similar to the alignment mark mam. When there is no change in the imaging data of the projection image mas having the latent image shape and the alignment mark ma (step S12, No), the control device 14 executes the process of step S11. When there is a change Δms in the imaging data of the projection image mas and the alignment mark ma shown in FIG. 11 (step S12, Yes), the control device 14 may advance the process to step S13.

  Next, the exposure apparatus EX adjusts the positions of the first guide member 32 and the second guide member 33, and obtains the second center obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 that is the first detection probe. The deformation amount of the substrate P in the axial direction parallel to the axis AX2 and the deformation amount of the substrate P in the axial direction obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 as the second detection probe coincide with each other. Thus, the entrance position IA and the withdrawal position OA are set around the second drum member 22, and the substrate P is guided. The exposure apparatus EX may adjust the transport direction in which the EPC and transport apparatus 9 shown in FIG.

  The specific position PX shown in FIG. 2 is specified as viewed from the second central axis AX2 by the same angle as the angle rotated about the second central axis AX2 at the position where the alignment microscope AMG1 as the first detection probe is arranged. Since the alignment microscope AMG2 as the second detection probe is arranged at a position around the substrate support member rotated to the separation position OA side from the position PX, the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 The amount of deformation of the substrate P in the axial direction parallel to the second central axis AX2 obtained by the above-mentioned is coincident with the amount of deformation of the substrate P in the axial direction obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. In this case, it can be estimated that the substrate P wound around the second drum member 22 is stable. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

  In the exposure apparatus EX, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma in the microscope visual field (imaging range) mam1 from the positional information of the encoder head EN5 in the microscope visual field (imaging range) mam2, and the imaging data Therefore, the deformation amount in the width direction (Y direction) of the substrate P can be calculated. The above-described image shift adjustment device corrects the projected image by shifting the position of the projected image according to the deformation amount in the width direction (Y direction) of the substrate P (step S13). Alternatively, the exposure apparatus EX may perform projection image correction in which the magnification adjustment device described above corrects the magnification of the projection image in accordance with the deformation amount in the width direction (Y direction) of the substrate P. Alternatively, the exposure apparatus EX corrects the projection image in which the magnification adjustment apparatus and the image shift adjustment apparatus described above correct the shift and magnification of the projection image according to the deformation amount in the width direction (Y direction) of the substrate P. You may go.

(Second Embodiment)
Next, a second embodiment of the processing apparatus according to the present invention will be described with reference to FIG. 13, FIG. 14, and FIG. FIG. 13 is a flowchart illustrating an example of an alignment mark detection procedure of the processing apparatus (exposure apparatus) according to the second embodiment. FIG. 14 is an explanatory diagram showing an example of the detection position of the alignment mark. FIG. 15 is an explanatory diagram illustrating another example of the detection position of the alignment mark. In this figure, the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted. It is desirable that the exposure apparatus EX detects as many alignment marks ma on the substrate P as described above as much as possible in order to perform exposure with high accuracy, and corrects the projected image using a large amount of detection data. However, the calculation device 14 is subjected to a calculation load that is calculated using a large amount of detection data. As described above, for example, until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is transported and reaches the first specific position PX1 shown in FIG. It is necessary to control at least one of the image shift adjustment device and the magnification adjustment device after calculating the correction data for correcting the projection image that corrects at least one of the image shift correction device. For this reason, when the transport device 9 increases the transport speed at which the substrate P can be transported, the control device 14 may not finish calculating correction data for correcting at least one of the shift and magnification of the projection image. is there. Therefore, when the transport speed of the substrate P by the transport apparatus 9 is decreased (at the same time, the rotational speed of the cylindrical mask DM is also decreased), the throughput of the exposure apparatus EX or the throughput of the device manufacturing system 1 may be decreased.

  As shown in FIG. 13, the control device 14 stops the irradiation process of irradiating the substrate P of the processing unit described above with light (step S21). Next, the transfer device 9 moves the substrate P in a state where the processing unit stops processing, and transfers the substrate P to the buffer unit DL (step S22). The transport device 9 sets the transport speed to a low speed and gives the first pattern detection device or the second pattern detection device time to enable detection of many alignment marks ma. Next, at least the first pattern detection device described above detects an alignment mark ma that is a specific pattern. Alternatively, the processing unit may perform exposure only on the alignment mark ma, and the second pattern detection apparatus may detect a deviation in exposure on the alignment mark ma. And the control apparatus 14 memorize | stores the alignment mark ma which is a specific pattern in the memory | storage part of the control apparatus 14 as imaging data (step S23). At this time, when capturing a part of alignment marks ma to be described later, the control device 14 calculates correction data that complements the alignment marks ma that have not been captured, and stores the correction data in the storage unit.

  Next, the transfer device 9 moves the substrate P from the buffer unit DL to the back buffer unit BDL in a state where the processing unit stops processing, and reversely moves the substrate P (step S24). When the substrate does not return to the initial position, which is the start position of Step S22 described above (No at Step S25), the transfer device 9 continues the process of moving the substrate back to the initial position (Step S24). When the substrate P returns to the initial position (step S25, Yes), the transfer device 9 moves the substrate P so as to supply the substrate P toward the processing device U4 (step S26).

  The first pattern detection device and the second pattern detection device described above detect a part of the alignment mark ma of the substrate P moved by the transport device 9 (step S27). The control device 14 starts an irradiation process for irradiating the substrate P of the processing unit described above with light (step S28). For example, as shown in FIG. 14, when the detected alignment mark ma is ma1 and the undetected alignment mark ma is ma2, the detected alignment mark ma1 is sandwiched by the undetected alignment mark ma2 and skipped by one. Thus, the alignment microscopes AMG1 and AMG2 are detecting.

  The number of alignment marks ma2 that are not detected may be a predetermined number, and for example, four alignment marks ma2 may be arranged in the transport direction α as shown in FIG. Thereby, since the first pattern detection device and the second pattern detection device capture only a part of the alignment mark ma, the data processing load can be thinned out, and the calculation load on the control device 14 can be suppressed. The control device 14 causes the processing unit to perform processing using the correction data described above. For this reason, even if the transport device 9 increases the transport speed, the control device 14 is required until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is transported and reaches the first specific position PX1 shown in FIG. Can finish calculating correction data for correcting the projected image, which corrects at least one of shift and magnification of the projected image. It is possible to shorten and process the time for the control device 14 to calculate the above-described correction of the projected image. As a result, the substrate transport apparatus 9 increases the transport speed of the substrate P, and the exposure apparatus EX can improve the throughput.

  Alternatively, the first pattern detection device and the second pattern detection device detect all the alignment marks ma of the substrate P moved by the transport device 9. When the control device 14 performs image processing for recognizing the alignment mark ma, a calculation load is applied. Therefore, for example, as shown in FIG. 14, when the control device 14 sets the detection data of the alignment mark ma processed by the control device 14 to ma1 and the alignment mark ma not processed by the control device 14 is ma2, control is performed. The alignment marks ma1 subjected to image processing by the device 14 are detected by the alignment microscopes AMG1 and AMG2 by skipping one alignment mark ma2 not subjected to image processing by the control device 14. The alignment mark ma2 that has not been subjected to image processing by the control device 14 may be a predetermined number, and may be arranged in four in the transport direction α as shown in FIG. 15, for example. Thereby, the first pattern detection device and the second pattern detection device detect the alignment mark ma, but thin out the data processing to be taken in by image processing. As a result, the exposure apparatus EX can suppress the load on the control apparatus 14. For this reason, even if the transport device 9 increases the transport speed, the control device 14 is required until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is transported and reaches the first specific position PX1 shown in FIG. Can finish calculating correction data for correcting the projected image, which corrects at least one of shift and magnification of the projected image. It is possible to shorten and process the time for the control device 14 to calculate the above-described correction of the projected image. As a result, the transport apparatus 9 increases the transport speed of the substrate P, and the exposure apparatus EX can improve the throughput.

  In steps S25 and S26 in FIG. 13, it is necessary to accelerate the substrate P to a predetermined transport speed, and it is necessary to set the initial position including the running distance for that purpose. Further, the alignment mark ma to be detected by the alignment microscope AMG1 or AMG2 during the conveyance of the substrate P in the forward direction (+ α direction) is, for example, every other alignment mark ma1 as shown in FIG. While P is conveyed in the reverse direction (−α direction), alignment marks ma2 that have not been detected may be sequentially detected. In that case, at least one alignment mark ma2 is first detected during the forward transfer (+ α direction) of the substrate P, or at least one alignment mark is transferred during the reverse transfer (−α direction) of the substrate P. By detecting ma1 in a doubled manner, it is possible to correct an influence such as a slip error between the substrate P and the second drum member 22 that may occur when the transport of the substrate P is switched from the forward direction to the reverse direction.

(Third embodiment)
Next, a third embodiment of the processing apparatus according to the present invention will be described with reference to FIGS. FIG. 16 is a perspective view of a rotating drum applied to a processing apparatus (exposure apparatus) according to the third embodiment. FIG. 17 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 18 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to the deformation of the substrate. FIG. 19 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the third embodiment. In this figure, the same reference numerals are given to the same elements as those of the first embodiment and the second embodiment, and the description thereof is omitted.

  Similar to the first embodiment, also in this embodiment, the exposure apparatus EX uses a part of the mask pattern projected onto the part of the substrate P supported by the curved surface of the second drum member 22 by the projection optical system PL shown in FIG. Alignment microscopes AMG1 and AMG2 for detecting an alignment mark ma formed in advance on the substrate P are provided in order to relatively align (align) the image and the substrate P with each other. The exposure apparatus EX of the third embodiment further includes alignment microscopes AMG3 and AMG4 described later.

  As in the first embodiment, the control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and uses the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 that is the first detection probe. Deformation of the substrate P in the axial direction obtained from the obtained deformation amount of the substrate P in the axial direction parallel to the second central axis AX2 and the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 as the second detection probe. The entrance position IA and the withdrawal position OA are set around the second drum member 22 so that the amounts coincide with each other, and the substrate P is guided.

  As shown in FIG. 16, the alignment microscope AMG3 includes an image of a part of the mask pattern projected on the part of the substrate P supported by the curved surface of the second drum member 22 by the projection optical system PL shown in FIG. Is an alignment microscope similar to the alignment microscope AMG1 that detects an alignment mark ma formed in advance on the substrate P. The alignment microscope AMG3 has a plurality (for example, four) of detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscope AMG3 is a detection probe on both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks ma formed near both ends of the substrate P.

  The encoder head EN6 is arranged on the rear side in the transport direction of the substrate P, that is, before the exposure position (projection area), and rotates the installation direction line Le4 of the encoder head EN4 toward the rear side in the transport direction of the substrate P. It is set on the installation direction line Le6 rotated around the axis of the center line AX2. In addition, the radial direction of the scale portion GP is in the same direction as the center of detection of the observation direction AM3 of the substrate P by the alignment microscope AMG3 (toward the rotation center line AX2) when viewed from the rotation center line AX2 in the XZ plane. The encoder head EN6 is arranged on the installation azimuth line Le6.

  As shown in FIG. 17, the detection probe of the alignment microscope AMG3 is disposed around the second drum member 22 as viewed from the second central axis AX2, and the direction connecting the position where the encoder head EN6 is disposed and the second central axis AX2 (Installation orientation line Le6) is arranged so as to coincide with the direction connecting the second central axis AX2 and the detection region of the alignment microscope AMG3. For this reason, when viewed in the XZ plane and from the rotation center line AX2, the alignment microscope AM3 is disposed between the entry position IA and the alignment microscope AMG1 shown in FIG. 2 and around the second drum member 22.

  The first specific position PX1 shown in FIG. 2 is on an extension line of the installation azimuth line Le1 (azimuth line of the principal ray of the imaging light beam EL2) viewed from the second central axis AX2 shown in FIG. 17, and the first specific position PX1 is Only the same angle as the angle γ1 rotated about the second central axis AX2 at the position where the alignment microscope AMG3 as the third detection probe is disposed is separated from the first specific position PX1 as viewed from the second central axis AX2. An alignment microscope AMG2, which is a second detection probe, is disposed at a position around the second drum member 22 rotated to the position OA side. The control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and the second central axis AX2 obtained from the alignment mark ma (specific pattern) detected by the alignment microscope AMG3 which is the third detection probe. The amount of deformation of the substrate P in the parallel axial direction and the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 which is the second detection probe coincide with each other. The position IA and the separation position OA may be set around the second drum member 22 to guide the substrate P.

  The encoder head EN7 shown in FIG. 16 is arranged on the front side in the transport direction of the substrate P, that is, on the rear side of the exposure position (projection region), and the installation direction of the encoder head EN5 toward the front side in the transport direction of the substrate P. The line Le5 is set on the installation direction line Le7 that is rotated around the axis of the rotation center line AX2. Further, the exposure apparatus EX includes an alignment microscope AMG4 (not shown) having the same configuration as the alignment microscope AMG3 described above. As shown in FIG. 17, when viewed from the rotation center line AX2 in the XZ plane, the scale is set to be in the same direction as the detection center AM4 of the substrate P observed by the alignment microscope AMG4 (toward the rotation center line AX2). An encoder head EN7 is disposed on an installation orientation line Le7 set in the radial direction of the part GP.

  The second specific position PX2 shown in FIG. 2 is on an extension line of the installation azimuth line Le2 (the azimuth line of the principal ray of the imaging light beam EL2) viewed from the second central axis AX2 shown in FIG. 17, and the second specific position PX2 is At a position where the alignment microscope AMG1 which is the first detection probe is disposed, it is separated from the second specific position PX2 as viewed from the second central axis AX2 by an angle substantially the same as the angle γ2 rotated around the second central axis AX2. An alignment microscope AMG4, which is a fourth detection probe, is disposed at a position around the second drum member 22 rotated to the position OA side. The control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and the second central axis AX2 obtained from the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 that is the first detection probe. The amount of deformation of the substrate P in the parallel axial direction and the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG4, which is the fourth detection probe, are entered. The position IA and the separation position OA may be set around the second drum member 22 to guide the substrate P.

  For example, the alignment microscope AMG3 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG3 serve as the third pattern detection device and the alignment mark ma as image data in the storage unit of the control device 14. Remember. The alignment microscope AMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 store the alignment mark ma as image data in the storage unit of the control device 14 as the first pattern detection device. . For this reason, the distance from the entry position IA entering the curved surface of the second drum member 22 shown in FIG. 17 to the microscope visual field (imaging range) mam1 of the alignment microscope AMG1 is defined as a predetermined distance QL1, and the alignment microscope AMG1 to the alignment microscope AMG3 When the distance to the microscope field of view (imaging range) mam3 is a predetermined distance QL2, the predetermined distance QL from the entry position IA to the microscope field of view (imaging range) mam1 of the alignment microscope AMG1 is QL1 + QL2. Then, alignment microscope AMG1 and alignment microscope AMG3 detect alignment mark ma that is a specific pattern on substrate P shown in FIG. 17 (step S31 in FIG. 19).

  Next, the same alignment mark ma as the imaging data of the alignment mark ma in the microscope field of view (imaging range) mam3 stored in the storage unit is compared with the alignment mark ma detected in the microscope field of view (imaging range) mam1, and the imaging data are compared. Compare. For example, the control device 14 calculates the interval WY3 of the alignment marks ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment marks ma in the microscope visual field (imaging range) mam3. In addition, the same alignment mark ma as the imaging data of the alignment mark ma of the microscope visual field (imaging range) mam 4 stored in the storage unit is compared with the alignment mark ma detected in the microscope visual field (imaging range) mam2, and the imaging data are compared. To do. For example, the control device 14 may calculate the interval WY4 between the alignment marks ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment mark ma in the microscope visual field (imaging range) mam4. Then, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma of the microscope visual field (imaging range) mam3 from the positional information of the encoder head EN4 in the microscope visual field (imaging range) maml, and from the imaging data, The interval WY1 between the alignment marks ma in the width direction (Y direction) of the substrate P is calculated. Control is performed when the difference Δm between the interval WY3 and the interval WY1 is within an allowable value stored in the storage unit in advance, and there is no change in the imaging data of the alignment mark ma due to deformation of the substrate P (step S32 in FIG. 19 is No). The apparatus 14 repeatedly executes the process of step S31 of FIG. When the difference Δm between the interval WY3 and the interval WY1 exceeds the allowable value stored in advance in the storage unit, and there is a change in the imaging data of the alignment mark ma due to deformation of the substrate P (Yes in step S32 in FIG. 19). The control device 14 advances the processing to step S33 in FIG.

  Next, the exposure apparatus EX adjusts the positions of the first guide member 32 and the second guide member 33, and obtains the second center obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 that is the first detection probe. The deformation amount of the substrate P in the axial direction parallel to the axis AX2 and the deformation amount of the substrate P in the axial direction obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 as the second detection probe coincide with each other. Thus, the entrance position IA and the withdrawal position OA are set around the second drum member 22, and the substrate P is guided. For example, the control device 14 controls the transport device 9 so as to achieve the target width PP in the width direction of the substrate P, and slows the speed in the transport direction of the substrate P.

In order to change the dimension in the width direction of the substrate P minutely, a tension in the width direction is applied to the substrate P before the substrate P enters (contacts) the outer peripheral surface of the second drum member 22. A roller, for example, a roller having a large (or small) diameter at the center in the rotation axis direction and a small (or large) diameter at both ends may be provided as the rotation roller DR4 in FIG.
In addition, each of both ends in the width direction of the substrate P is sandwiched between nip rollers driven by a motor, and the feeding direction of the substrate P by the nip rollers is inclined with respect to the original feeding direction (the substrate long direction), The substrate P may be widened by applying a pulling force to both ends in the width direction of the substrate P.

  The specific position PX shown in FIG. 2 is specified as viewed from the second central axis AX2 by the same angle as the angle rotated about the second central axis AX2 at the position where the alignment microscope AMG1 as the first detection probe is arranged. Since the alignment microscope AMG2 as the second detection probe is arranged at a position around the substrate support member rotated to the separation position OA side from the position PX, the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 The amount of deformation of the substrate P in the axial direction parallel to the second central axis AX2 obtained by the above-mentioned is coincident with the amount of deformation of the substrate P in the axial direction obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. In this case, it can be estimated that the substrate P wound around the second drum member 22 is stable. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

  In the exposure apparatus EX, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma in the microscope visual field (imaging range) mam1 from the positional information of the encoder head EN5 in the microscope visual field (imaging range) mam2, and the imaging data Therefore, the deformation amount in the width direction (Y direction) of the substrate P can be calculated. The above-described image shift adjustment device corrects the projected image by shifting the position of the projected image according to the deformation amount in the width direction (Y direction) of the substrate P (step S13). Alternatively, the exposure apparatus EX may perform projection image correction in which the magnification adjustment device described above corrects the magnification of the projection image in accordance with the deformation amount in the width direction (Y direction) of the substrate P. Alternatively, the exposure apparatus EX corrects the projection image in which the magnification adjustment apparatus and the image shift adjustment apparatus described above correct the shift and magnification of the projection image according to the deformation amount in the width direction (Y direction) of the substrate P. You may go.

(Fourth embodiment)
Next, a fourth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 20 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. In this figure, the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted. The exposure apparatus EX2 emits an illumination light beam EL1 that illuminates the cylindrical mask DM from a light source.

  When the illumination light beam EL1 emitted from the light source of the light source device 13 is guided to the illumination module IL and a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is separated into a plurality of light beams, and the plurality of illumination light beam EL1s are Guide to the illumination module IL.

  Here, the illumination light beam EL1 emitted from the light source device 13 enters the polarization beam splitters SP1 and SP2. In the polarization beam splitters SP1 and SP2, it is preferable that the incident illumination light beam EL1 is totally reflected so as to suppress energy loss due to separation of the illumination light beam EL1. Here, the polarization beam splitters SP1 and SP2 reflect a light beam that becomes S-polarized linearly polarized light and transmit a light beam that becomes P-polarized linearly polarized light. For this reason, the light source device 13 emits to the first drum member 21 an illumination light beam EL1 in which the illumination light beam EL1 incident on the polarization beam splitters SP1 and SP2 becomes a linearly polarized light (S-polarized light). Thereby, the light source device 13 emits the illumination light beam EL1 having the same wavelength and phase.

  The polarization beam splitters SP1 and SP2 reflect the illumination light beam EL1 from the light source and transmit the imaging light beam (projection light beam) EL2 reflected by the cylindrical mask DM. In other words, the illumination light beam EL1 from the illumination module IL enters the polarization beam splitters SP1 and SP2 as a reflected light beam, and the imaging light beam EL2 from the cylindrical mask DM enters the polarization beam splitters SP1 and SP2 as a transmitted light beam. .

  As described above, the illumination module IL as a processing unit performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM that is an object to be processed. Thereby, the projection optical system PL can project the image of the pattern in the illumination region IR on the cylindrical mask DM onto a part of the substrate P (projection region PA) being transported by the transport device 9. The exposure apparatus EX2 can perform a process of irradiating the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light by the projected light beam reflected by the cylindrical mask DM.

(Fifth embodiment)
Next, a fifth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 21 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. In this figure, the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted. The exposure apparatus EX3 includes polygon scanning units PO1 and PO2, and the beam scanning spot is obtained by the polygon scanning unit PO, for example, intensity-modulating a beam emitted from an ultraviolet laser beam source with a modulator such as an AOM according to pattern data. It may be a spot scanning drawing apparatus that emits light toward the substrate P and performs one-dimensional scanning of the spot light in the Y direction parallel to the rotation center axis AX2.

  As described above, the exposure apparatus EX3 in FIG. 21 can perform the process of irradiating the exposure light (spot light) onto the substrate P at the first specific position PX1 and the second specific position PX2 without the cylindrical mask DM.

(Sixth embodiment)
Next, a sixth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 22 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. In this figure, the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted.

  The exposure apparatus EX4 is a processing apparatus that performs so-called proximity exposure on the substrate P. In the exposure apparatus EX4, the gap between the cylindrical mask DM and the second drum member 22 is set to be minute, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL to perform non-contact exposure. In this embodiment, the 2nd drum member 22 rotates with the torque supplied from the 2nd drive part 36 containing actuators, such as an electric motor. A driving roller MGG connected by, for example, a magnetic gear drives the first drum member 21 so as to be in a direction opposite to the rotation direction of the second driving unit 36. The second drive unit 36 rotates the second drum member 22 and rotates the drive roller MGG and the first drum member 21 to synchronize the first drum member 21 (cylindrical mask DM) and the second drum member 22. Move (synchronized rotation).

  In addition, the exposure apparatus EX4 includes an encoder head EN8 that detects the position PX6 of the scale portion at a specific position where the principal ray of the illumination light beam IL applied to the cylindrical mask DM or the substrate P is incident on the substrate P. Here, since the diameter of the outer peripheral surface around which the substrate P is wound out of the outer peripheral surfaces of the second drum member 22 and the diameter of the scale portion of the scale disk are aligned, the position PX8 is the above-mentioned when viewed from the second central axis AX2. Matches the specified position. The encoder head EN4 is set on an installation direction line Le4 obtained by rotating the installation direction line Le5 of the encoder head EN5 about the rotation center line AX2 by approximately 90 ° toward the rear side in the transport direction of the substrate P. .

  The exposure apparatus EX4 of the present embodiment uses the encoder head EN5 as a first reading device, the encoder head EN4 as a second reading device, and the position and specific position of the axis of the second drum member 22 obtained from the reading output of the scale unit. And a component in which the displacement component in the direction perpendicular to the axis is corrected by the reading output of the first reading device can be applied.

  In the first to sixth embodiments described above, the exposure apparatus is exemplified as the processing apparatus. The processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, using an inkjet ink dropping apparatus. Alternatively, the processing unit may be an inspection device.

(Evaluation example)
Here, when the substrate P is wound around the outer peripheral surface of the cylindrical second drum member 22 at a constant angle, the degree of deformation at the portion where the substrate P is in close contact with the second drum member 22 is shown in FIG. Let's simulate using an example model. In FIG. 23, it is assumed that the rotation center axis AX2 of the second drum member 22 is parallel to the Y axis, and the substrate P is wound over approximately 180 ° of the upper half of the outer peripheral surface of the second drum member 22.

In the simulation, when one end side of the substrate P is a fixed end and the other end side is a load end, and a load (tension) in the −Z direction is uniformly applied to the load end, the substrate P can rotate around the rotation center axis AX2. It is determined how many points set every 22.5 degrees are displaced on the outer peripheral surface of the second drum member 22. Here, five line segments ψ ₀ , ψ ₋₁ , ψ ₋₂ , ψ ₊₁ , ψ ₊₂ are set in a plane orthogonal to the rotation center axis AX2 and parallel to the XZ plane. The line segment ψ ₀ is parallel to the Z axis, the line segment ψ _-1 is rotated by -22.5 ° around the rotation center axis AX2 with respect to the line segment ψ ₀ , and the line segment ψ ₊₁ is a line min ψ is ₀ that is about to + 22.5 ° rotation of the rotational axis AX2 against. Further, the line segment _{[psi -2} are those obtained by -45 ° rotation around the rotational axis AX2 with respect to the segment [psi _0, segment [psi ₊₂ is about the rotational center axis AX2 with respect to the segment [psi ₀ And rotated by + 45 °.

Further, a large number of target points on the substrate P are on the circumferential region QA on one end side in the width direction (short direction and Y-axis direction) of the substrate P, on the circumferential region QB on the other end side, and A total of 15 points corresponding to each of the five line segments ψ ₀ , ψ ₋₁ , ψ ₋₂ , ψ ₊₁ , ψ ₊₂ are set for each of the central circumferential region QC. For example, the target point located in the direction of the line segment ψ ₀ on the central circumferential region QC is represented by QC (ψ ₀ ), and the line segment ψ ₊₁ on the circumferential region QA on one end side. The target point located in the direction of is represented by QA (ψ ₊₁ ).
Further, the long direction of the substrate P is the MD direction, the short direction is the TD direction, and the positive / negative of the TD direction is aligned with the positive / negative direction of the Y axis.

  In the model example of FIG. 23, the substrate P is PET having a thickness of 100 μm and a width of 30 cm, the fixed end is uniformly clamped in the TD direction, and the load end at the other end is uniformly tensioned in the MD direction ( Tension). The substrate P extends in the MD direction according to the magnitude of the tension. Regarding the expansion and contraction of the substrate P in the MD direction, since the second drum member 22 is rotatably supported, the friction coefficient between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P is not significantly affected. Stretch freely.

FIG. 24 shows five target points QA (ψ ₋₂ ), QA (ψ ₋₁ ), QA (ψ ₀ ), QA (ψ) on the region QA of the substrate P when the friction coefficient μ is 0.45. ₊₁ ), QA (ψ ₊₂ ), five target points QB (ψ _-2 ), QB (ψ _-1 ), QB (ψ ₀ ), QB (ψ ₊₁ ), QB (ψ ₊₂ ), and QB (ψ ₊₂ ), and , Each of the five target points QC (ψ ₋₂ ), QC (ψ ₋₁ ), QC (ψ ₀ ), QC (ψ ₊₁ ), and QC (ψ ₊₂ ) on the region QC changes in tension (N) It is the graph which calculated | required by how much it displaced to MD direction with respect to MD.

FIG. 25 shows five target points QA (ψ ₋₂ ) to QA (ψ ₊₂ ) on the region QA of the substrate P and five target points QB on the region QB (when the friction coefficient μ is 200). _{ψ -2) ~QB (ψ +2)} , and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, with respect to a change in tension (N) [horizontal axis] It is the graph which calculated | required how much it displaced in MD direction [vertical axis] by simulation.

Each target point was a value within the linear range indicated by the shaded portion in the graph without being greatly affected by the magnitude of the friction coefficient. The linear change showing the greatest inclination in the shaded area is the target point QA (ψ ₊₂ ) located in the direction of the line segment ψ ₊₂ (+ 45 °) in any of the three regions QA, QB, and QC. QB (ψ ₊₂ ) and QC (ψ ₊₂ ). Further, the linear change indicating the smallest inclination in the shaded area is the target point QA (in the direction of the line segment ψ ₋₂ (−45 °) in any of the three regions QA, QB, and QC. ψ _-2 ), QB (ψ _-2 ), and QC (ψ _-2 ).

On the other hand, the expansion and contraction of the substrate P in the TD direction is changed by being influenced by the magnitude of the friction coefficient between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P. FIG. 26 shows five target points QA (ψ ₋₂ ) to QA (ψ ₊₂ ) on the region QA and five target points QB (ψ ₋₂ ) on the region QB when the friction coefficient μ is 0.45. ) ~QB (ψ _+2), and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, how much displacement in the TD direction with respect to the change in the tension (N) This is a graph obtained by simulation.

FIG. 27 shows five target points QA (ψ ₋₂ ) to QA (ψ ₊₂ ) on the region QA of the substrate P and five target points QB ( _{ψ -2) ~QB (ψ +2)} , and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, with respect to a change in tension (N) [horizontal axis] It is the graph which calculated | required how much it displaced in the TD direction [vertical axis] by simulation.

  As can be seen from the graphs of FIGS. 26 and 27, the regions QA and QB on both sides of the substrate P in the TD direction are displaced toward the center region QC of the substrate P as the tension increases. That is, the substrate P is deformed in a direction in which the width in the TD direction is reduced. The amount of deformation varies depending on the friction coefficient in the TD direction between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P. When the friction coefficient is 0.45, the substrate P can slightly slide in the TD direction on the outer peripheral surface of the second drum member 22, and the contraction in the TD direction becomes relatively large. On the other hand, when the friction coefficient is 200, the substrate P hardly slides in the TD direction on the outer peripheral surface of the second drum member 22, and the contraction in the TD direction becomes relatively small.

  From the above, the outer peripheral surface of the second drum member 22 of the substrate P is determined by the magnitude of friction between the back surface of the substrate P and the outer peripheral surface of the second drum member 22 and the magnitude of tension in the MD direction. It is also possible to predict in advance the general deformation tendency and deformation amount of the portion in close contact with the head. Of course, since the rigidity and coefficient of friction of the substrate P change depending on the material of the substrate P and whether or not it has undergone the process, more practical deformation prediction is possible by taking them into account.

  Accordingly, the deformation amount of the substrate P in the direction parallel to the rotation center axis AX2 obtained from the specific pattern detected by the first detection probe and the direction parallel to the rotation center axis AX obtained from the specific pattern detected by the second detection probe. When a guide member for guiding the substrate P is provided at a position where the entry position and the separation position are set so that the deformation amount of the substrate P matches, the guide member is a tension in the MD direction of the substrate P. It is also possible to use a conveyance mechanism (including a rotation control of a nip type driving roller and a rotation roller for tension adjustment).

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 28 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  In the device manufacturing method shown in FIG. 28, first, the function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Next, a cylindrical mask DM for a necessary layer is manufactured based on the pattern for each layer designed by CAD or the like (step S202). Further, the substrate P is manufactured by preparing a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, etc.) serving as a display panel base material is wound (step S203). . The roll-shaped substrate P prepared in step S203 has a surface modified as necessary, a pre-formed base layer (for example, micro unevenness by an imprint method), and light sensitivity. The functional film or transparent film (insulating material) previously laminated may be used.

  Next, a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self light emitting element (step S204). This step S204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatuses EX, EX2, EX3, and EX4 described in the previous embodiments. The substrate P coated with the silane coupling material is subjected to pattern exposure to form a pattern based on hydrophilicity and water repellency on the surface, the photosensitive catalyst layer is subjected to pattern exposure, and nickel, copper, gold, etc. are formed by electroless plating. Processing by a wet process for forming a metal film pattern (wiring, electrode, etc.) or a printing process for drawing a pattern with a conductive ink containing silver nanoparticles is also included.

  Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A device is assembled by pasting sheets or the like (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

DESCRIPTION OF SYMBOLS 1 Device manufacturing system 2 Substrate supply apparatus 4 Substrate collection | recovery apparatus 5 Host control apparatus 9 Transfer apparatus 12 Mask holding apparatus 13 Light source apparatus 14 Control apparatus 22 2nd drum member DR1-DR8 Drive roller 32 1st guide member 33 2nd guide member 35 Second detector 44 Focus correction optical member 45 Image shift correction optical member 46 Rotation correction mechanism 47 Magnification correction optical member AMG1, AMG2, AMG3 Alignment microscope DM Cylindrical mask EN1, EN2, EN3, EN4, EN5 Encoder head EX, EX2, EX3, EX4 exposure equipment (substrate processing equipment)
PO1, PO2 Polygon scanning unit

Claims (12)

A substrate processing apparatus for processing a long substrate having flexibility in which a specific pattern is formed discretely or continuously in a long direction,
A transfer device for transferring the substrate to the elongated direction,
Has a curved surface which is curved at a constant radius from the predetermined axis, said length is wound longitudinal direction of a portion of the substrate, the substrate from the long direction of the entry position to start contacting the substrate to the curved surface from the curved surface a substrate support member supporting the substrate to the disengaged position of the elongated direction to start away,
Viewed from said axis is arranged around the substrate support member, and a processing unit which processes the substrate in said curved surface at a specific position of the circumferential direction of the curved surface,
A first pattern detection apparatus including a first detection probe for detecting the specific pattern, wherein the first detection probe is arranged around the substrate support member between the specific position and the entry position side in the circumferential direction. When,
It includes a second detection probe for detecting the specific pattern at a position different from the first detection probe with respect to the circumferential direction, about the same as the axis of the rotation angle between the position of the said specific position first detection probe A second pattern detection device in which the second detection probe is arranged at a position around the substrate support member rotated by an angle from the specific position with respect to the circumferential direction toward the separation position;
An amount of deformation of the substrate in the axial direction obtained by detection of the specific pattern by the first detection probe and an amount of deformation of the substrate in the axial direction obtained by detection of the specific pattern by the second detection probe. A guide member that is provided as a part of the transfer device and guides the substrate so as to pass through the entry position and the separation position that are set to coincide with each other ;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The guide member is
Including a first guide member that applies tension to the substrate on the upstream side of the entry position of the substrate transport path and moves to adjust the entry position in the circumferential direction of the curved surface;
Substrate processing equipment. The substrate processing apparatus according to claim 1 or 2, wherein
The guide member is
Including a second guide member that applies tension to the substrate on the downstream side of the separation position of the transport path of the substrate and moves to adjust the separation position in the circumferential direction of the curved surface,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 3,
The first detection probe of the first pattern detection device is disposed at each of a plurality of positions along the axial direction,
The second detection probes of the second pattern detection device are arranged at each of a plurality of positions along the axial direction at substantially the same intervals as the axial arrangement intervals of the plurality of first detection probes. ,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 4, wherein
The processing unit is an exposure apparatus that irradiates exposure light for forming a pattern on the substrate at the specific position.
Substrate processing equipment. The substrate processing apparatus according to claim 5,
The exposure apparatus includes an image shift adjustment device that shifts a position of a pattern image formed on the substrate by the exposure light,
The image shift adjustment device shifts the position of the pattern image in the longitudinal direction or the axial direction according to a change in the specific pattern detected by the first pattern detection device and the second pattern detection device. ,
Substrate processing equipment. The substrate processing apparatus according to claim 5 or 6, wherein
The exposure apparatus includes a magnification adjustment device that adjusts a magnification of a pattern image formed on the substrate by the exposure light,
The magnification adjusting device adjusts the magnification of the pattern image according to a change in the specific pattern detected by the first pattern detecting device and the second pattern detecting device;
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 7,
The substrate support member is
A rotating drum having a cylindrical outer peripheral surface having a constant radius from the shaft as the curved surface and rotating around the axis, and a readable scale rotating around the axis together with the rotating drum along the circumferential direction. Including the engraved scale part,
Furthermore, a first encoder head that is arranged around the scale portion as viewed from the axis and is arranged in the same orientation as the orientation in which the first detection probe is installed, and reads the scale of the scale portion;
A second encoder head arranged around the scale portion as viewed from the axis and arranged in the same orientation as the orientation in which the second detection probe is installed, and reads the scale of the scale portion;
Comprising
Substrate processing equipment. The substrate processing apparatus according to claim 8, comprising:
The first pattern detection device and the second pattern detection device are:
While the processing unit stops processing, the specific pattern of the substrate is detected while the substrate is moved at a predetermined speed in the longitudinal direction by rotation of the transfer device and the rotary drum .
Substrate processing equipment. The substrate processing apparatus according to claim 8, comprising:
The first pattern detection device and the second pattern detection device are:
While the substrate is moved at a predetermined speed in the longitudinal direction by the rotation of the transfer device and the rotating drum, the processing unit is performing the processing by the processing unit , and the longitudinal direction along the longitudinal direction on the substrate. Detect part of a specific pattern,
Substrate processing equipment. The substrate processing apparatus according to claim 8, comprising:
The processor is
A first processing unit that is disposed around the rotating drum and that processes the substrate on the curved surface at the specific position in the circumferential direction of the curved surface;
A second specific position which is arranged around the rotating drum and which is different from the specific position in the circumferential direction of the curved surface and which is set between the position of the first detection probe and the position of the second detection probe. position, and a second processing unit which processes the substrate in the curved surface,
Substrate processing equipment. The substrate processing apparatus according to claim 8, comprising:
The processor is
The first specific position, which is arranged around the rotating drum and is set between the position of the first detection probe and the position of the second detection probe in the circumferential direction of the curved surface, is on the curved surface. A first processing unit for processing a substrate;
A second identification that is arranged around the rotating drum and is different from the first identification position between the position of the first detection probe and the position of the second detection probe in the circumferential direction of the curved surface. A second processing unit for processing the substrate on the curved surface at a position;
The specific position is set between the first specific position and the second specific position with respect to a circumferential direction of the curved surface.
Substrate processing equipment.

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