JP6252697B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus that exposes a pattern on a flexible substrate supported by an outer peripheral surface of a cylindrical member.

  In an exposure apparatus used in a photolithography process, an exposure apparatus that exposes a substrate using a cylindrical or columnar mask as disclosed in the following patent document is known (for example, see Patent Document 1). . In addition, a cylindrical photomask with a light source arranged inside is placed close to a flexible object to be exposed (film tape) wound around a rotatable feed roller, and the photomask and feed roller are rotated. An exposure apparatus for manufacturing a liquid crystal display element that continuously exposes an object to be exposed is also known (see, for example, Patent Document 2).

  Not only when using a plate-shaped mask, but also when exposing a substrate using a cylindrical or columnar mask, the position of the mask pattern can be used to satisfactorily project and expose an image of the mask pattern onto the substrate. Information needs to be obtained accurately. Therefore, it is desired to devise a technique that can accurately acquire positional information of a cylindrical or columnar mask and can accurately adjust the positional relationship between the mask and the substrate.

  Therefore, in Patent Document 1, a mark (scale, grid, etc.) for obtaining position information is formed in a predetermined area of the pattern forming surface of the cylindrical mask in a predetermined positional relationship with the pattern, and the mark is recorded by the encoder system. A configuration is disclosed in which the positional information of the pattern in the circumferential direction or the rotation axis direction of the pattern forming surface is acquired by detecting.

International Publication No. WO2008 / 029917 Japanese Utility Model Publication No. 60-019037

  In the above-mentioned Patent Document 1, the substrate to which the pattern of the cylindrical rotary mask is transferred is a highly rigid substrate such as a semiconductor wafer, and the substrate is held flat on a movable stage, and the surface of the substrate is Moved in parallel direction. In addition, when transferring a mask pattern repeatedly to a flexible long substrate, a rotating feed roller as in Patent Document 2, that is, a substrate which is an object to be processed on the outer peripheral surface of a cylindrical member. By partially wrapping and performing exposure in a state where the surface of the substrate is stably held following the curved surface of the cylindrical member, mass productivity can be improved.

  As described above, in a processing apparatus that performs processing on a flexible object to be processed that is supported along the outer peripheral surface of a rotating cylindrical member (substrate feed roller), the position of the cylindrical member is suppressed while suppressing the calculation load. There is a demand for improving processing accuracy, for example, pattern transfer position accuracy, overlay accuracy, etc., by precisely processing (peripheral position on the outer peripheral surface, position in the rotation axis direction, etc.). Yes.

  An aspect of the present invention has been made in view of the above circumstances, and is a flexible substrate that is supported on the outer peripheral surface of a cylindrical member by accurately grasping the position of the cylindrical member while suppressing a calculation load. An object of the present invention is to provide a substrate processing apparatus capable of accurately positioning and exposing a pattern thereon.

  According to the first aspect of the present invention, a flexible long substrate is wound around a part of the outer peripheral surface of the rotating drum that can rotate around the first central axis and fed in the longitudinal direction. A substrate processing apparatus for performing a predetermined process on the substrate supported by the rotary drum, comprising a scale formed in an annular shape at a predetermined radius from the first central axis, and the rotary drum And a scale portion that rotates around the first central axis, and an entrance region where the substrate starts to contact and an detachment region where the substrate comes off the outer peripheral surface of the outer peripheral surface of the rotary drum. A first processing unit that performs a predetermined process on the substrate at a first specific position, and a second set between the first specific position of the outer peripheral surface of the rotating drum and the separation region. A second processing unit that performs predetermined processing on the substrate at a specific position of A specific pattern formed discretely or continuously on the substrate, or a reference mark formed on the outer peripheral surface of the rotary drum, the entry region and the first specific position on the outer peripheral surface of the rotary drum. A pattern detecting device for detecting at a third specific position set in between, and being arranged so as to face the scale portion, and the first specific position and the second specific point as viewed from the first central axis A first reading device, a second reading device, and a third reading device that are arranged in substantially the same orientation as each of the specific position and the third specific position, and individually measure the scale of the scale unit; A substrate processing apparatus is provided.

  According to the second aspect of the present invention, a flexible long substrate is wound around a part of the outer peripheral surface of the rotary drum that can rotate around the first central axis and fed in the longitudinal direction. A substrate processing apparatus for performing a predetermined process on the substrate supported by the rotary drum, comprising a scale formed in an annular shape at a predetermined radius from the first central axis, and the rotary drum And a scale portion that rotates about the first central axis, and an entrance region where the substrate starts to contact and a separation region that deviates from the outer peripheral surface in the circumferential direction of the outer peripheral surface of the rotary drum. The first specific position is set between the first specific portion that performs a predetermined process on the substrate and the first specific position and the separation region in the circumferential direction of the outer peripheral surface of the rotating drum. At the second specific position, the substrate is subjected to a predetermined process. In a third specific position, the second processing unit and a specific pattern formed discretely or continuously on the substrate are set between the entry region and the first specific position with respect to the circumferential direction. The pattern detection device to be detected is disposed so as to face the scale portion, and is disposed in substantially the same orientation as the center position of the first specific position and the second specific position with respect to the circumferential direction, A first reading device that measures the scale of the scale unit, and is arranged so as to face the scale unit, and is arranged in substantially the same orientation as the third specific position as viewed from the first central axis, There is provided a substrate processing apparatus comprising: a second reading device that measures a scale of the scale unit.

  According to the aspect of the present invention, in the processing apparatus and the device manufacturing method, it is possible to accurately process the object to be processed on the curved surface of the cylindrical member while accurately suppressing the calculation load and capturing the position of the cylindrical member.

FIG. 1 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the first embodiment. FIG. 2 is a schematic diagram showing the arrangement of illumination areas and projection areas in FIG. FIG. 3 is a schematic diagram showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. 4 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 7 is an explanatory diagram for explaining the positional deviation of the rotating drum when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 8 is an explanatory diagram illustrating an example of calculating the positional deviation of the rotating drum when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 9 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 10 is a flowchart showing another example of the procedure for correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 11 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the modification of the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 12 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the second embodiment is viewed in the direction of the rotation center line AX2. FIG. 13 is an explanatory diagram for explaining a roundness adjusting device for adjusting the roundness of the scale member. FIG. 14 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 15 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the modification of the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 16 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 17 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the fourth embodiment is viewed in the direction of the rotation center line AX1. FIG. 18 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. FIG. 19 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. FIG. 20 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the seventh embodiment. FIG. 21 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this. In the following embodiment, an exposure apparatus used in a so-called roll-to-roll method in which various processes for manufacturing one device are continuously performed on a substrate will be described.

  Further, in the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. As an example, the predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. And

(First embodiment)
First, the configuration of the exposure apparatus of this embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the first embodiment. FIG. 2 is a schematic diagram showing the arrangement of illumination areas and projection areas in FIG. FIG. 3 is a schematic diagram showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. As shown in FIG. 1, the processing apparatus 11 includes an exposure apparatus (processing mechanism) EX and a transport apparatus 9. The exposure apparatus EX is supplied with a substrate P (sheet, film, etc.) by the transport device 9. For example, the flexible substrate P drawn out from a supply roll (not shown) is sequentially processed by the processing device 11 through n processing devices, sent out to another processing device by the transport device 9, and the substrate P is transferred. There is a device manufacturing system that is wound up on a collection roll. Thus, the processing apparatus 11 may be configured as a part of a device manufacturing system (flexible display manufacturing line).

  The exposure apparatus EX is a so-called scanning exposure apparatus, in which the rotation of the cylindrical mask DM and the feeding of the flexible substrate P are synchronously driven, and the pattern magnification formed on the cylindrical mask DM is equal to the projection magnification. Projection is performed on the substrate P through the double (× 1) projection optical system PL (PL1 to PL6). In the exposure apparatus EX shown in FIG. 1, the Y axis of the XYZ orthogonal coordinate system is set parallel to the rotation center line AX1 of the first drum member 21. Similarly, the exposure apparatus EX sets the Y axis of the XYZ orthogonal coordinate system in parallel with the rotation center line AX2 of the second drum member 22 that is a rotating drum.

  As shown in FIG. 1, the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure apparatus EX rotates and moves the cylindrical mask DM held by the mask holding apparatus 12 and transfers the substrate P by the transfer apparatus 9. The illumination mechanism IU illuminates a part of the cylindrical mask DM (illumination region IR) held by the mask holding device 12 with a uniform brightness by the illumination light beam EL1. The projection optical system PL projects the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) being transported by the transport device 9. As the cylindrical mask DM moves, the part on the cylindrical mask DM arranged in the illumination area IR changes, and as the substrate P moves, the part on the substrate P arranged in the projection area PA changes. . Thereby, an image of a predetermined pattern (mask pattern) on the cylindrical mask DM is projected onto the substrate P. The control device 14 controls each part of the exposure apparatus EX and causes each part to execute processing. In the present embodiment, the control device 14 controls the transport device 9.

  Note that the control device 14 may be a part or all of a host control device that collectively controls a plurality of processing devices of the device manufacturing system described above. The control device 14 may be a device that is controlled by the host control device and is different from the host control device. The control device 14 includes, for example, a computer system. The computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices. The operation process of each unit of the processing device 11 is stored in a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing the program. When the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment). The computer-readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, and a CD-ROM, and a storage device such as a hard disk built in the computer system. A computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients. In addition, the program may be for realizing a part of the function of the processing device 11, or may be a function that can realize the function of the processing device 11 in combination with a program already recorded in the computer system. The host control device can be realized using a computer system in the same manner as the control device 14.

  As shown in FIG. 1, the mask holding device 12 includes a first drum member 21 that holds a cylindrical mask DM, a guide roller 23 that supports the first drum member 21, and a first drive unit 26 that receives a control command from the control device 14. A driving roller 24 that drives the first drum member 21 and a first detector 25 that detects the position of the first drum member 21 are provided.

  The first drum member 21 is a cylindrical member having a curved surface curved with a certain radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) serving as a predetermined axis, and rotates around the predetermined axis. . The first drum member 21 forms a first surface P1 on which the illumination area IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (first central axis AX1) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like. The first drum member 21 is made of, for example, glass or quartz and has a cylindrical shape with a certain thickness, and an outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. As described above, the first drum member 21 has a curved surface that is curved with a constant radius from the rotation center line AX1 that is a predetermined axis. The first drum member 21 is driven by the driving roller 24 and can rotate around the rotation center line AX1 that is a predetermined axis.

  The cylindrical mask DM is prepared as a transmission type planar sheet mask in which a pattern is formed with a light-shielding layer of chromium or the like on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 μm to 500 μm). The The mask holding device 12 is used in a state in which the cylindrical mask DM is curved following the curved surface of the outer peripheral surface of the first drum member 21 and is wound (attached) to the curved surface. The cylindrical mask DM has a pattern non-formation region where no pattern is formed, and is attached to the first drum member 21 in the pattern non-formation region. The cylindrical mask DM can be released with respect to the first drum member 21.

  The cylindrical mask DM is made of an ultrathin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of the transparent cylindrical base material. Alternatively, a mask pattern formed by a light shielding layer may be drawn and integrated. Also in this case, the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.

  The first detector 25 optically detects the rotational position of the first drum member 21 and is composed of, for example, a rotary encoder. The first detector 25 outputs information indicating the detected rotational position of the first drum member 21, for example, a two-phase signal from an encoder head described later, to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts the torque and rotation speed for rotating the drive roller 24 in accordance with a control signal input from the control device 14. The control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result by the first detector 25. Then, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.

  The transport device 9 includes a driving roller DR4, a first guide member 31, a second drum member 22 that forms a second surface P2 on which the projection area PA on the substrate P is disposed, a second guide member 33, and driving rollers DR4 and DR5. The second detector 35 and the second driving unit 36 are provided.

  In the present embodiment, the substrate P that has been transported from the upstream of the transport path to the drive roller DR4 is transported to the first guide member 31 via the drive roller DR4. The substrate P that has passed through the first guide member 31 is supported on the surface of the cylindrical or columnar second drum member 22 having a radius r <b> 2 and conveyed to the second guide member 33. The substrate P that has passed through the second guide member 33 is transported downstream of the transport path. The rotation center line AX2 of the second drum member 22 and the rotation center lines of the drive rollers DR4 and DR5 are both set to be parallel to the Y axis.

  The first guide member 31 and the second guide member 33 adjust, for example, the tension acting on the substrate P in the transport path by moving in the transport direction of the substrate P. In addition, the first guide member 31 (and the drive roller DR4) and the second guide member 33 (and the drive roller DR5) are configured to be movable in the width direction (Y direction) of the substrate P, for example. The position in the Y direction of the substrate P wound around the outer periphery of the drum member 22 can be adjusted. The transfer device 9 only needs to be able to transfer the substrate P along the projection area PA of the projection optical system PL, and the configuration of the transfer device 9 can be changed as appropriate.

  The second drum member 22 is a cylindrical member having a curved surface curved with a predetermined radius from a rotation center line AX2 (hereinafter also referred to as a second center axis AX2) serving as a predetermined axis, and rotates around the predetermined axis. It is a rotating drum. The second drum member 22 forms a second surface (support surface) p2 that supports a part including the projection area PA on the substrate P on which the imaging light beam from the projection optical system PL is projected in an arc shape (cylindrical shape). To do. In the present embodiment, the second drum member 22 is a part of the transport device 9 and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the second drum member 22 may be a part of the exposure apparatus EX. Thus, the second drum member 22 can rotate around its rotation center line AX2 (second center axis AX2), and the substrate P follows the outer peripheral surface (cylindrical surface) on the second drum member 22. The projection area PA is arranged in a part of the curved portion.

  In this embodiment, the 2nd drum member 22 rotates with the torque supplied from the 2nd drive part 36 containing actuators, such as an electric motor. The second detector 35 is also composed of a rotary encoder, for example, and optically detects the rotational position of the second drum member 22. The second detector 35 outputs information indicating the detected rotational position of the second drum member 22 (for example, a two-phase signal from encoder heads EN1, EN2, EN3, EN4, and EN5 described later) to the control device 14. . The second drive unit 36 adjusts the torque for rotating the second drum member 22 in accordance with the control signal supplied from the control device 14. The control device 14 controls the rotational position of the second drum member 22 by controlling the second drive unit 36 based on the detection result by the second detector 35, and the first drum member 21 (cylindrical mask DM). The second drum member 22 is moved synchronously (synchronized rotation). The detailed configuration of the second detector 35 will be described later.

  The exposure apparatus EX of the present embodiment is an exposure apparatus that is assumed to be equipped with a so-called multi-lens projection optical system PL. The projection optical system PL includes a plurality of projection modules that project some images in the pattern of the cylindrical mask DM. For example, in FIG. 1, three projection modules (projection optical systems) PL1, PL3, and PL5 are arranged at regular intervals in the Y direction on the left side of the center plane P3, and three projection modules (projection optics) are also arranged on the right side of the center plane P3. System) PL2, PL4, and PL6 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the end portions in the Y direction of the areas exposed by the plurality of projection modules PL1 to PL6 (projection areas PA1 to PA6) are overlapped with each other by scanning, thereby forming a desired pattern. Project the whole picture. Such an exposure apparatus EX has a projection module PA and a projection module even when the Y-direction size of the pattern on the cylindrical mask DM becomes large and it becomes necessary to handle the substrate P having a large width in the Y-direction. Since it is only necessary to add modules on the illumination mechanism IU side corresponding to PA in the Y direction, there is an advantage that the panel size (the width of the substrate P) can be easily increased.

  The exposure apparatus EX may not be a multi-lens system. For example, when the dimension in the width direction of the substrate P is small to some extent, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. Further, each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project a plurality of device patterns in parallel by a plurality of projection modules.

  The illumination mechanism IU of this embodiment includes a light source device 13 and an illumination optical system. The illumination optical system includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far-ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light. (Wavelength 193 nm). The illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL via a light guide member such as an optical fiber.

  Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses. In the present embodiment, light emitted from the light source device and passing through any one of the plurality of illumination modules IL is referred to as illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL are arranged inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination region IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

  FIG. 2 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. 2 is a plan view of the illumination area IR on the cylindrical mask DM disposed on the first drum member 21 as viewed from the −Z side (left side view in FIG. 2), and the second drum member 22 includes A plan view of the projection area PA on the arranged substrate P as viewed from the + Z side (the figure on the right side in FIG. 2) is shown. A symbol Xs in FIG. 2 indicates the rotation direction (movement direction) of the first drum member 21 or the second drum member 22.

  Each of the plurality of illumination modules IL illuminates the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1, and the second illumination module IL illuminates the second illumination region IR2.

  The first illumination region IR1 will be described as a trapezoidal region elongated in the Y direction. However, in the case of a projection optical system configured to form an intermediate image plane, such as the projection optical system (projection module) PL, the intermediate image Since a field stop plate having a trapezoidal aperture can be arranged at the position of, a rectangular region including the trapezoidal aperture may be used. The third illumination region IR3 and the fifth illumination region IR5 are regions having the same shape as the first illumination region IR1, respectively, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR2 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1 with respect to the center plane P3. The fourth illumination region IR4 and the sixth illumination region IR6 are regions having the same shape as the second illumination region IR2, respectively, and are arranged at regular intervals in the Y-axis direction.

  As shown in FIG. 2, each of the first to sixth illumination regions IR1 to IR6 has a triangular portion of a hypotenuse portion of an adjacent trapezoidal illumination region when viewed along the circumferential direction of the first surface P1. They are arranged so that they overlap (overlapping). Therefore, for example, the first region A1 on the cylindrical mask DM that passes through the first illumination region IR1 by the rotation of the first drum member 21 is the cylindrical mask DM that passes through the second illumination region IR2 by the rotation of the first drum member 21. Partly overlaps with the second region A2 above.

  In the present embodiment, the cylindrical mask DM includes a pattern formation region A3 where a pattern is formed and a pattern non-formation region A4 where a pattern is not formed. The pattern non-formation region A4 is arranged so as to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation area A3 of the cylindrical mask DM moves in the movement direction Xs with the rotation of the first drum member 21, and each partial area in the Y-axis direction of the pattern formation area A3 includes first to sixth illumination areas. Passes any one of IR1 to IR6. In other words, the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A3.

  As shown in FIG. 1, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction has a one-to-one correspondence with each of the first to sixth illumination modules IL, and is illuminated by the corresponding illumination module. An image of a partial pattern of the cylindrical mask DM that appears in the illumination area IR is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1 corresponds to the first illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 2) illuminated by the first illumination module IL on the substrate P. Is projected onto the first projection area PA1. The third projection module PL3 and the fifth projection module PL5 correspond to the third to fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are arranged at a position overlapping the first projection module PL1 when viewed from the Y-axis direction.

  The second projection module PL2 corresponds to the second illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 2) illuminated by the second illumination module IL on the substrate P. Is projected onto the second projection area PA2. When viewed from the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the center plane P3.

  The fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arranged at a position overlapping the second projection module PL2.

  In the present embodiment, light reaching each illumination region IR1 to IR6 on the cylindrical mask DM from each illumination module IL of the illumination mechanism IU is defined as an illumination light beam EL1. Further, the light reaching the projection areas PA1 to PA6 after receiving the intensity distribution modulation corresponding to the partial pattern of the cylindrical mask DM appearing in the illumination areas IR1 to IR6 and entering the projection modules PL1 to PL6 Let it be EL2. Of the imaging light beam EL2 reaching the projection areas PA1 to PA6, the principal ray passing through the center points of the projection areas PA1 to PA6 is, as shown in FIG. 1, the second central axis AX2 of the second drum member 22. When viewed from the center, the central plane P3 is disposed at a position (specific position) at an angle θ in the circumferential direction.

  As shown in FIG. 2, the pattern image in the first illumination area IR1 is projected onto the first projection area PA1, the pattern image in the third illumination area IR3 is projected onto the third projection area PA3, and the fifth illumination area The pattern image in IR5 is projected onto the fifth projection area PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

  The pattern image in the second illumination area IR2 is projected onto the second projection area PA2. In the present embodiment, the second projection area PA2 is arranged symmetrically with the first projection area PA1 with respect to the center plane P3 when viewed from the Y-axis direction. The pattern image in the fourth illumination area IR4 is projected on the fourth projection area PA4, and the pattern image in the sixth illumination area IR6 is projected on the sixth projection area PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

  Each of the first to sixth projection areas PA1 to PA6 is adjacent to each other in the direction parallel to the second central axis AX2 (odd number and even number) when viewed along the circumferential direction of the second surface p2. It arrange | positions so that the edge part (trapezoid triangular part) of each other may overlap. Therefore, for example, the third area A5 on the substrate P passing through the first projection area PA1 due to the rotation of the second drum member 22 is on the substrate P passing through the second projection area PA2 due to the rotation of the second drum member 22. Partly overlaps with the fourth area A6. The first projection area PA1 and the second projection area PA2 are set so that the exposure amount in the region where the third region A5 and the fourth region A6 overlap is substantially the same as the exposure amount in the non-overlapping region. The shape etc. are set. Thus, the first to sixth projection areas PA1 to PA6 are arranged so as to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

  Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second projection module PL2 to the fifth projection module PL5 has the same configuration as the first projection module PL1. Therefore, the configuration of the first projection module PL1 will be described on behalf of the projection optical system PL, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.

  The first projection module PL1 shown in FIG. 3 includes a first optical system 41 that forms an image of the pattern of the cylindrical mask DM arranged in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41. A second optical system 42 that re-images at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on the intermediate image plane P7 on which the intermediate image is formed. .

  Further, the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P. The correction optical member 45 is a shift adjustment device that slightly shifts the projected image laterally within the image plane. The magnification correcting optical member 47 is a shift adjusting device that slightly corrects the magnification of the projected image. The rotation correction mechanism 46 is a shift adjustment device that slightly rotates the projected image within the image plane.

  The imaging light beam EL2 from the pattern of the cylindrical mask DM exits from the first illumination region IR1 in the normal direction (D1), and enters the image shift correction optical member 45 through the focus correction optical member 44. The imaging light beam EL <b> 2 that has passed through the image shift correction optical member 45 is reflected by the first reflecting surface (plane mirror) p <b> 4 of the first deflecting member 50 that is an element of the first optical system 41, and passes through the first lens group 51. The light is reflected by the first concave mirror 52, passes through the first lens group 51 again, is reflected by the second reflecting surface (plane mirror) p5 of the first deflecting member 50, and enters the first field stop 43. The imaging light beam EL2 that has passed through the first field stop 43 is reflected by the third reflecting surface (plane mirror) p8 of the second deflecting member 57, which is an element of the second optical system 42, and passes through the second lens group 58 for the second. The light is reflected by the two concave mirrors 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflecting member 57, and enters the optical member 47 for magnification correction. The imaging light beam EL2 emitted from the magnification correcting optical member 47 enters the first projection area PA1 on the substrate P, and an image of the pattern appearing in the first illumination area IR1 is equal to the first projection area PA1 (× Projected in 1).

  When the radius of the cylindrical mask DM shown in FIG. 1 is set as the radius r1, the radius of the cylindrical surface of the substrate P wound around the second drum member 22 is set as the radius r2, and the radius r1 and the radius r2 are equal, each projection module The principal ray of the imaging light beam EL2 on the mask side of PL1 to PL6 is tilted so as to pass through the central axis AX1 of the cylindrical mask DM. The inclination angle of the principal ray of the imaging light beam EL2 on the substrate side is θ. (± θ with respect to the center plane P3).

  The angle θ3 formed by the third reflecting surface p8 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ2 formed by the second reflecting surface p5 of the first deflecting member 50 and the first optical axis AX3. is there. The angle θ4 formed by the fourth reflecting surface p9 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ1 formed by the first reflecting surface p4 of the first deflecting member 50 and the first optical axis AX3. The same. In order to give the inclination angle θ described above, the angle θ1 with respect to the optical axis AX3 of the first reflecting surface p4 of the first deflecting member 50 shown in FIG. The angle θ4 of the reflecting surface p9 with respect to the optical axis AX4 is made smaller than 45 ° by Δθ4. Δθ1 and Δθ4 are set to have a relationship of Δθ1 = Δθ4 = θ / 2 with respect to the angle θ shown in FIG.

  4 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. In FIG. 4, for convenience, only the second to fourth projection areas PA2 to PA4 are shown, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not shown.

  The second detector 35 shown in FIG. 1 optically detects the rotational position of the second drum member 22, and has a highly circular scale disk (scale member) SD and an encoder head as a reading device. Includes EN1, EN2, EN3, EN4, EN5.

  The scale disk SD is fixed to the end of the second drum member 22 so as to be orthogonal to the rotation axis ST. For this reason, the scale disk SD rotates integrally with the rotation axis ST around the rotation center line AX2. A scale portion GP is engraved on the outer peripheral surface of the scale disk SD. The scale portion GP has a grid-like scale arranged in a ring shape at a pitch of, for example, 20 μm along the circumferential direction in which the second drum member 22 rotates, and the rotation axis ST (second central axis AX2) together with the second drum member 22 Rotate around. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP when viewed from the rotation axis ST (second central axis AX2). The encoder heads EN1, EN2, EN3, EN4, and EN5 are arranged to face the scale part GP, project a laser beam (diameter of about 1 mm) onto the scale part GP, and photoelectrically detect reflected diffracted light from the grid-like scale. Thus, for example, the change in the circumferential position of the scale part GP can be read in a non-contact manner with a resolution of about 0.1 μm. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second drum member 22.

  The encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. As shown in FIG. 4, the installation directions (angle directions in the XZ plane with the rotation center line AX2 as the center) of the encoder heads EN1, EN2, EN3, EN4, EN5 are set as the installation direction lines Le1, Le2, Le3, Le4, When represented by Le5, as shown in FIG. 6, the encoder heads EN1 and EN2 are arranged so that the installation orientation lines Le1 and Le2 are at an angle ± θ ° with respect to the center plane P3. In the present embodiment, the angle θ is 15 °. Further, the installation azimuth lines Le1 to Le5 pass through the projection positions on the scale part GP of the laser beams (diameter of about 1 mm) projected from the encoder heads EN1 to EN5.

  Projection modules PL <b> 1 to PL <b> 6 shown in FIG. 3 are processing units of an exposure apparatus EX that performs irradiation processing for irradiating the substrate P with light, using the substrate P as a processing object. In the exposure apparatus EX, the principal rays of the two imaging light beams EL2 enter the substrate P with respect to the substrate P. The projection modules PL1, PL3, and PL5 serve as the first processing unit, and the projection modules PL2, PL4, and PL6 serve as the second processing unit, and the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P. The position is a specific position where the irradiation process for irradiating the substrate P with light is performed. The specific position is a position at an angle ± θ in the circumferential direction with respect to the center plane P3 on the curved substrate P on the second drum member 22 when viewed from the second center axis AX2 of the second drum member 22. The installation heading line Le1 of the encoder head EN1 is equal to the inclination angle θ of the principal ray passing through the center point of each projection area (projection field of view) PA1, PA3, PA5 of the odd-numbered projection modules PL1, PL3, PL5 with respect to the central plane P3. The installation direction line Le2 of the head EN2 has an inclination angle θ with respect to the center plane P3 of the principal ray passing through the center points of the projection areas (projection fields) PA2, PA4, PA6 of the even-numbered projection modules PL2, PL4, PL6. Match. Therefore, the encoder heads EN1 and EN2 serve as a reading device that reads the scale portion GP located in the direction connecting the specific position and the second central axis AX2.

  As shown in FIG. 6, the encoder head EN4 is arranged upstream in the feed direction of the substrate P, that is, in front of the exposure position (projection region), and the encoder head EN1 is directed upstream in the feed direction of the substrate P. The installation azimuth line Le1 is set on the installation azimuth line Le4 rotated about 90 ° around the rotation center line AX2. The encoder head EN5 is set on an installation direction line Le5 obtained by rotating the installation direction line Le2 of the encoder head EN2 approximately 90 ° around the axis of the rotation center line AX2 toward the upstream side in the feed direction of the substrate P.

  From the above, for example, the measurement direction of the scale portion GP by the encoder head EN4 is parallel to the installation orientation line Le1, that is, the direction of the imaging light beam EL2 principal ray from the odd numbered projection modules PL1, PL3, PL5. It is also the fluctuation of the focus direction of the substrate P with respect to the best imaging plane of the projection modules PL1, PL3, PL5. Accordingly, the measurement reading of the encoder head EN4 is finely moved in the direction parallel to the installation orientation line Le1 as a whole due to shaft rotation, eccentricity, backlash and the like of the rotation center axis AX2 (second drum member 22). Ingredients are included. The amount of the fine movement component is mainly caused by mechanical processing accuracy and assembly accuracy, and is estimated to be about ± several μm to several tens μm. Accordingly, assuming that the fine movement component of the scale disk SD (second drum member 22) in the direction parallel to the installation direction line Le1 is measured by the encoder head EN4 within an error range of ± 10%, the installation direction line Le4 of the encoder head EN4. And the installation azimuth line Le1 may be set to a range of 90 ° ± γ, with the range of angle γ being 0 ° ≦ γ ≦ 5.8 °. That is, in this embodiment, approximately 90 ° means a range of 84.2 ° to 95.8 °. By setting within this range, when the directions of the installation azimuth lines Le4 and Le5 in which the encoder heads EN4 and EN5 for reading the scale part GP are arranged are in the XZ plane and viewed from the rotation center line AX2, with respect to the substrate P The principal ray of the imaging light beam EL2 is in a range substantially orthogonal to the direction in which the principal ray enters the specific position of the substrate P.

  For this reason, even if the second drum member 22 is shifted in the Z direction due to a slight backlash (about 2 μm to 3 μm) of the bearing (bearing) that supports the rotating shaft ST, this shift occurs in the projection areas PA1 to PA6. The position error (focus fluctuation) in the direction along the obtained imaging light beam EL2 can be measured with high accuracy by the encoder heads EN1 and EN2.

  Further, the encoder head EN3 rotates the installation azimuth line Le2 of the encoder head EN2 about 120 ° around the axis of the rotation center line AX2, and the installation azimuth line Le4 of the encoder head EN4 about 120 around the axis of the rotation center line AX2. It is set on the installation orientation line Le3 rotated. Here, approximately 120 ° means 120 ° ± γ with the angle γ in the range of 0 ° ≦ γ ≦ 5.8 °.

  The scale disk SD, which is a scale member, is made so as to have a diameter as large as possible (for example, a diameter of 20 cm or more) in order to increase measurement resolution, using a low thermal expansion metal, glass, ceramics or the like as a base material. In FIG. 4, the diameter of the scale disk SD is smaller than the diameter of the second drum member 22, but of the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface around which the substrate P is wound, and the scale The so-called measurement Abbe error can be further reduced by aligning (substantially matching) the diameter of the scale part GP of the disk SD. More strictly speaking, the sum of the radius of the outer peripheral surface of the second drum member 22 and the thickness of the substrate P (for example, 100 μm) is set to match the radius of the scale portion GP of the scale disk SD. good.

  The minimum pitch of the scale (lattice) engraved in the circumferential direction of the scale part GP is limited by the performance of a scale engraving device that processes the scale disk SD. For this reason, if the diameter of the scale disk SD is increased, the angle measurement resolution corresponding to the minimum pitch can be increased accordingly.

  When the direction of the installation azimuth lines Le1 and Le2 where the encoder heads EN1 and EN2 for reading the scale part GP are arranged is viewed from the rotation center line AX2, the principal ray of the imaging light beam EL2 is incident on the substrate P with respect to the substrate P. For example, even when the second drum member 22 is shifted in the X direction due to a slight backlash (about 2 μm to 3 μm) of a bearing (bearing) that supports the rotating shaft ST, the projection is performed by this shift. The position error relating to the feeding direction (Xs) of the substrate P that may occur in the areas PA1 to PA6 can be measured with high accuracy by the encoder heads EN1 and EN2.

  As shown in FIG. 5, an image of a portion of the mask pattern projected by the projection optical system PL shown in FIG. 1 and the substrate P are relatively placed on a portion of the substrate P supported by the curved surface of the second drum member 22. In order to perform alignment (alignment), alignment microscopes AMG1 and AMG2 for detecting alignment marks or the like formed in advance on the substrate P are provided. The alignment microscopes AMG1 and AMG2 have a detection probe for detecting a specific pattern formed discretely or continuously on the substrate P, and a detection region by the detection probe is more in the feed direction of the substrate P than the specific position described above. The pattern detection device is arranged around the second drum member 22 so as to be set on the rear side (upstream side).

  As shown in FIG. 5, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 are detection probes on both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks formed near both ends of the substrate P. The alignment microscopes AMG1 and AMG2 are detection probes other than both side ends of the second drum member 22 in the Y-axis direction (the width direction of the substrate P), and are formed on the substrate P along the longitudinal direction, for example. It is possible to observe or detect an alignment mark formed in a blank space between the pattern formation regions of the display panel.

  As shown in FIGS. 5 and 6, when viewed in the XZ plane and from the rotation center line AX2, it is in the same direction as the detection center of the observation direction AM1 (toward the second central axis AX2) of the substrate P by the alignment microscope AMG1. Thus, the encoder head EN4 is arranged on the installation direction line Le4 set in the radial direction of the scale part GP. In addition, the radial direction of the scale portion GP is in the same direction as the detection center AM2 of the substrate P observed by the alignment microscope AMG2 (toward the rotation center line AX2) when viewed from the rotation center line AX2 in the XZ plane. An encoder head EN5 is arranged on each of the installation azimuth lines Le5. As described above, the detection probes of the alignment microscopes AMG1 and AMG2 are arranged around the second drum member 22 when viewed from the second central axis AX2, and the position where the encoder heads EN4 and EN5 are arranged is connected to the second central axis AX2. The direction (installation azimuth lines Le4 and Le5) is arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. Note that the positions around the rotation center line AX2 where the alignment microscopes AMG1, AMG2 and encoder heads EN4, EN5 are arranged are the sheet entry area IA where the substrate P starts to contact the second drum member 22, and the second drum member 22. To the sheet separation area OA where the substrate P is detached from the sheet.

  Alignment microscopes AMG1 and AMG2 are arranged in front of the exposure position (projection area PA), and are formed in alignment areas (in the range of several tens of μm to several hundreds of μm square) formed near the end in the Y direction of substrate P. In the state where the substrate P is fed at a predetermined speed, the image is detected at high speed by an imaging device or the like, and the mark image is sampled at high speed in the microscope field of view (imaging range). By storing the rotation angle position of the scale disk SD sequentially measured by the encoder head EN4 (or EN5) at the moment when the sampling is performed, the mark position on the substrate P and the rotation angle position of the second drum member 22 are stored. Is required.

  When the mark detected by the alignment microscope AMG1 is detected by the alignment microscope AMG2, the difference value between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is calculated in advance. Comparison is made with a reference value corresponding to the opening angle of the installation orientation lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2 that are precisely calibrated. As a result, when there is a difference between the difference value and the reference value, the substrate P is slightly slipped on the second drum member 22 between the sheet entry area IA and the sheet separation area OA, or the feeding direction. There is a possibility of expansion and contraction in the (circumferential direction).

  Generally, the positional error during patterning is determined according to the fineness and overlay accuracy of the device pattern formed on the substrate P. For example, a 10 μm-wide line pattern is accurately superimposed on the underlying pattern layer. In order to perform the alignment exposure, only an error of a fraction of that, that is, a positional error of about ± 2 μm is allowed in terms of the dimension on the substrate P.

  In order to realize such high-accuracy measurement, the measurement direction of the mark image by each alignment microscope AMG1, AMG2 (peripheral tangential direction of the second drum member 22 in the XZ plane) and the encoder heads EN4, EN5 It is necessary to align the measurement direction (peripheral tangent direction of the scale part GP in the XZ plane) within an allowable angle error.

  As described above, the encoder heads EN4 and EN5 are arranged so as to coincide with the measurement direction of the alignment mark on the substrate P by the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second drum member 22). . For this reason, when the position of the substrate P (mark) is detected by the alignment microscopes AMG1 and AMG2 (image sampling), the second drum member 22 (scale disk SD) is orthogonal to the installation orientation lines Le4 and Le5 in the XZ plane. Even when shifting in the circumferential direction (tangential direction), it is possible to perform highly accurate position measurement in consideration of the shift of the second drum member 22.

  Since encoder heads EN1 to EN5 are arranged at five locations around the scale portion GP of the scale disk SD as viewed from the second central axis AX2, output of measurement values by appropriate two or three encoder heads among them is output. It is also possible to obtain the roundness (shape distortion), eccentricity error, etc. of the scale part GP of the scale disk SD by performing the arithmetic processing in combination. FIG. 7 and FIG. 7 show the case where the positional deviation in the specific direction in the XZ plane of the rotating drum (second drum member 22) is obtained by arithmetic processing by combining the output of measured values by two or three encoder heads. 8 and FIG.

<First calculation processing example>
FIG. 7 is an explanatory diagram for explaining the positional deviation of the rotating drum (second drum member 22) when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 8 is an explanatory diagram illustrating an example of calculating the positional deviation of the rotating drum when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 9 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment.

  As shown in FIG. 7, for example, the second drum member 22 is shifted together with the scale disk SD by a slight backlash of a bearing (bearing) that supports the rotating shaft ST, and the solid line of FIG. 7 from the position indicated by the dotted line of the scale disk SD. The position is shifted to the position indicated by. The position AX2 'of the rotation axis ST of the second drum member 22 is moved from the rotation center line AX2 (second center axis AX2). For example, the encoder head EN1 reads the position PX1 of the scale part GP located in the direction connecting the specific position and the second central axis AX2 before the scale disk SD is shifted. When the scale disk SD is shifted from the position indicated by the dotted line to the position indicated by the solid line in FIG. 7, the position PX1 of the scale part GP moves to the position TX1 of the scale part GP as shown in FIG.

  Then, after the scale disk SD is shifted, the encoder head EN1 reads the position QX1 of the scale part GP located in the direction connecting the specific position and the second central axis AX2. For this reason, in the XZ plane, a displacement component Δqx1 is generated that is displaced in a direction connecting the rotation center line AX2 of the second drum member 22 and the position QX1 of the scale part GP. The displacement when moving from the rotation center line AX2 (second center axis AX2) to the position AX2 ′ of the rotation axis ST of the second drum member 22 is the position of the rotation center line AX2 of the second drum member 22 and the scale part GP. When the angle formed by the direction connecting QX1 is the displacement angle α, the displacement component Δqx1 moves from the rotation center line AX2 (second center axis AX2) to the position AX2 ′ of the rotation axis ST of the second drum member 22. This displacement is obtained by multiplying the displacement at the time of cosα by the cos α.

  For example, when the first reading device is the encoder head EN4 and the second reading device is the encoder head EN1, the control device 14 of the exposure apparatus EX includes the encoder head EN4 and the encoder head EN1 as shown in FIG. Measurement is performed (step S11), and the output of the measured values of the encoder head EN4 and encoder head EN1 (read output of the scale part GP) is stored.

  The encoder head EN4 and the encoder head EN1 can measure a variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. In the encoder head EN4 shown in FIG. 7, since the scale disk SD is shifted from the position shown by the dotted line to the position shown by the solid line in FIG. 7, the encoder head EN4 is not the position PX4 of the scale part GP but the scale part GP. Read position QX4. For this reason, the angle formed by the tangential direction veq4 at the position PX4 of the scale portion GP and the tangential direction veq4 at the position QX4 of the scale portion GP also generates the displacement angle of the angle α described above. As a result, a change occurs in the peripheral speed read by the encoder head EN4 as the first reading device.

  For example, when there is no difference between the circumferential speed read by the encoder head EN1 and the circumferential speed read by the encoder head EN4, the control device 14 rotates with no circumferential speed change (No in step S12) as shown in FIG. The position measurement step S11 is continued. If there is a difference between the circumferential speed read by the encoder head EN1 and the circumferential speed read by the encoder head EN4, the circumferential speed is changed (Yes in step S12), and the process proceeds to step S13.

  In the control device 14 of the exposure apparatus EX, the encoder head EN4, which is the first reading device, calculates a correction value based on the read output (step S13). The direction in which the principal ray of the imaging light beam EL2 is incident on a specific position of the substrate P with respect to the substrate P when the direction of the installation orientation line Le4 in which the encoder head EN4 is disposed is viewed in the XZ plane and the rotation center line AX2. And almost orthogonal. Therefore, the change in the read output of the encoder head EN4 has a certain relationship with the change in the direction along the principal ray of the imaging light beam EL2 projected from each of the odd-numbered projection modules PL1, PL3, and PL5. become.

  For example, the control device 14 stores a database in which the change in the read output of the encoder head EN4 is associated with the displacement angle α described above in the storage unit. And the control apparatus 14 gives the input of the read output of encoder head EN4 which is a 1st reading apparatus to the said database memorize | stored in the memory | storage part of the control apparatus 14, and calculates the displacement angle (alpha). The control device 14 calculates a displacement component Δqx1 from the calculated displacement angle α, and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  In accordance with the correction value calculated in step S13, the control device 14 of the exposure apparatus EX performs a correction process (step S14). For example, the control device 14 of the exposure apparatus EX operates the focus correction optical member 44 shown in FIG. 3 as a focus adjustment device, and the projection image formed on the substrate P by the odd-numbered projection modules PL1, PL3, PL5. Fine-tune the focus state. For this reason, the exposure apparatus EX can perform highly accurate exposure processing on the substrate P.

  Similarly, when the first reading device is the encoder head EN5 and the second reading device is the encoder head EN2, as shown in FIG. 9, the controller 14 of the exposure apparatus EX includes the encoder head EN5 and the encoder head EN2. Then, the rotational position is measured (step S11), and the output of the measurement values of the encoder head EN5 and encoder head EN2 (read output of the scale part GP) is stored.

  For example, the encoder head EN2 reads the position PX2 of the scale part GP located in the direction connecting the specific position and the second central axis AX2 before the scale disk SD is shifted. Then, after the scale disk SD is shifted, the encoder head EN2 reads the position QX2 of the scale part GP located in the direction connecting the specific position and the second central axis AX2. The position PX2 of the scale part GP and the position QX2 of the kale part GP are parallel to the installation azimuth line Le2, and are in the direction along the imaging light beam EL2 projected from each of the even-numbered projection modules PL2, PL4, PL6. The positions are almost the same as shown in FIG.

  As shown in FIG. 7, since the scale disk SD is shifted from the position indicated by the dotted line to the position indicated by the solid line in FIG. 7, the encoder head EN5 is not positioned at the scale portion GP but at the position of the scale portion GP. Read QX5. However, the tangential direction veq5 at the position PX5 of the scale part GP and the tangential direction veq5 'at the position PX5 of the scale part GP are substantially parallel. As a result, the peripheral speed read by the encoder head EN4 as the first reading device does not change. The control device 14 continues step S11 of rotational position measurement with no change in peripheral speed (step S12, No).

  As described above, when the two encoder heads are arranged around the scale portion GP at an interval of about 90 °, the two-dimensional fine movement of the scale disk SD (scale portion GP) in the XZ plane can be measured. In the case of FIG. 7, the two-dimensional fine movement includes, for example, a direction in which the installation direction line Le2 of the encoder head EN2 extends (generally in the Z direction) and a direction in which the installation direction line Le5 of the encoder head EN5 extends (generally in the X direction). The two directions. Therefore, when the rotating drum (second drum member 22) is decentered in the direction in which the installation direction line Le5 extends, the fine movement component of the scale disk SD (scale portion GP) due to the decentering can be measured by the encoder head EN2.

  However, since the encoder head EN2 also measures the displacement in the circumferential direction of the scale part GP due to the rotation of the scale disk SD at the position of the installation azimuth line Le2, from the measurement reading of the encoder head EN2 alone, There are cases where fine movement components due to eccentricity and position displacement components due to rotation cannot be distinguished well. In such a case, there is a method in which the encoder head is further increased and the fine movement component due to the eccentricity of the scale part GP and the position displacement component due to the rotation are strictly discriminated and measured. The method will be described later.

  As described above, the exposure apparatus EX includes the second drum member 22 that is a cylindrical member, the scale unit GP, the projection modules PL1 to PL6 that are processing units of the exposure apparatus EX, and the first reading that reads the scale unit GP. Encoder heads EN4 and EN5 that are devices, and encoder heads EN1 and EN2 that are second reading devices that read the scale part GP.

  The second drum member 22 has a curved surface curved with a predetermined radius from the second central axis AX2 which is a predetermined axis, and rotates around the second central axis AX2. The scale part GP is annularly arranged along the circumferential direction in which the second drum member 22 rotates, and rotates around the second central axis AX2 together with the second drum member 22. Projection modules PL1 to PL6 that are processing units of the exposure apparatus EX are disposed around the second drum member 22 as viewed from the second central axis AX2, and are on a curved surface at a specific position in the circumferential direction of the second drum member 22. An irradiation process for irradiating principal rays of two imaging light beams EL2 is performed on P (object to be processed). The encoder heads EN4 and EN5 are arranged around the scale portion GP as viewed from the second central axis AX2, and the specific position described above about the second central axis AX2 is approximately 90 degrees around the second central axis AX2. It is arranged at the rotated position and reads the scale part GP. The encoder heads EN1 and EN2 read the scale part GP at the specific position described above. Then, the exposure apparatus EX uses the first displacement of the projection modules PL1 to PL6, which are processing units, when moving in the direction perpendicular to the second central axis AX2 along which the second central axis AX2 of the second drum member 22 moves. Processing corrected by the reading output of the encoder heads EN4 and EN5 as reading devices is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

<Second calculation processing example>
FIG. 10 is a flowchart showing another example of the procedure for correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. For example, when the first reading device is the encoder head EN4, the second reading device is the encoder head EN1, and the third reading device is the encoder head EN3, the control device 14 of the exposure apparatus EX, as shown in FIG. The rotational position is measured by EN4, encoder head EN1, and encoder head EN3 (step S21), and the measurement value output (read output of scale portion GP) of encoder head EN4, encoder head EN1, and encoder head EN3 is output for an appropriate time. It memorize | stores simultaneously for every space | interval (for example, several milliseconds).

  The encoder head EN4, the encoder head EN1, and the encoder head EN3 can measure a variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. The control device 14 moves the rotation axis ST of the second drum member 22 from the rotation center line AX2 (second center axis AX2) based on the read output (stored value) of the encoder head EN4, encoder head EN1, and encoder head EN3. For example, the position AX2 ′ of the rotation axis ST of the second drum member 22 shown in FIG. 7 is calculated (step S22). When there is no axial shift of a distance exceeding a predetermined threshold, for example, between the rotation center line AX2 and the position AX2 ′ of the rotation axis ST of the second drum member 22 (Step S23, No), the control device 14 determines the rotation position. The measurement step S21 is continued. For example, when there is an axis shift of a distance exceeding a predetermined threshold between the rotation center line AX2 and the position AX2 ′ of the rotation axis ST of the second drum member 22 (step S23, Yes), the control device 14 performs processing. Proceed to step S24. The threshold value is determined in advance based on the accuracy required in the exposure processing of the exposure apparatus EX and stored in the storage unit of the control apparatus 14.

  Next, the control device 14 of the exposure apparatus EX calculates a correction value based on the read output of the encoder head EN4 (step S24). The direction of the installation azimuth line Le4 in which the encoder head EN4 for reading the scale part GP is arranged is projected onto the substrate P from each of the odd-numbered projection modules PL1, PL3, PL5 when viewed from the rotation center line AX2 in the XZ plane. It becomes almost orthogonal to the direction of the chief ray of the imaging light beam EL2. Therefore, the change in the read output of the encoder head EN4 has a certain relationship with the change in the direction along the principal ray of the imaging light beam EL2 projected from each of the odd-numbered projection modules PL1, PL3, and PL5. become.

  For example, the control device 14 stores a database in which the change in the read output of the encoder head EN4 is associated with the displacement angle α described above in the storage unit. And the control apparatus 14 gives the input of the read output of encoder head EN4 which is a 1st reading apparatus to the said database memorize | stored in the memory | storage part of the control apparatus 14, and calculates the displacement angle (alpha). The control device 14 can calculate the displacement component Δqx1 shown in FIG. 8 from the angle α, the position AX2 ′ calculated in step S22, and the rotation center line AX2 (second center axis AX2). The control device 14 calculates the displacement component Δqx1, and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  Further, the control device 14 can calculate the displacement component Δqx4 shown in FIG. 8 from the angle α, the position AX2 ′ calculated in step S22, and the rotation center line AX2. The displacement component Δqx4 is a component that is displaced in a direction orthogonal to the direction connecting the rotation center line AX2 of the second drum member 22 and the position QX1 of the scale part GP in the XZ plane. Therefore, the displacement component Δqx4 is a displacement obtained by multiplying the displacement when moving from the rotation center line AX2 (second center axis AX2) to the position AX2 ′ of the rotation axis ST of the second drum member 22 by sin α. . Then, the control device 14 calculates the displacement component Δqx1, and calculates a correction value for correcting the projection image shift according to the displacement component Δqx4. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  In accordance with the correction value calculated in step S24, the control device 14 of the exposure apparatus EX performs a correction process (step S25). For example, the control device 14 of the exposure apparatus EX operates the focus correction optical member 44 shown in FIG. 3, which is a focus adjustment device, to focus the projected image formed on the substrate P so as to cancel the displacement component Δqx1. Fine-tune the condition. For this reason, the exposure apparatus EX can perform highly accurate exposure processing on the substrate P.

  For example, the control device 14 of the exposure apparatus EX is a shift adjustment device, and the image shift correction optical member 45 for slightly shifting the projected image shown in FIG. 3 in the image plane, and slightly correcting the magnification of the projected image. The projection image formed on the substrate P so as to cancel the displacement component Δqx4 by operating at least one of the magnification correction optical member 47 and the rotation correction mechanism 46 for slightly rotating the projection image in the image plane. Shift. For this reason, the exposure apparatus EX can perform highly accurate exposure processing on the substrate P. Alternatively, the control device 14 adjusts the driving of the cylindrical mask DM, the driving of the second drum member 22, or the application of tension to the substrate P as a shift adjusting device, and performs precise feedback control and feedforward control. The projected image formed on the substrate P may be shifted so as to cancel the component Δqx4.

  As described above, in this embodiment, when the installation orientation lines Le1 and Le2 of the encoder heads EN1 and EN2 arranged around the scale part GP of the scale disk SD are viewed from the rotation center line AX2, they are on the substrate P. When the second drum member 22 is slightly shifted in the scanning exposure direction (feeding direction) of the substrate P because it is the same as (or matched with) the inclination direction of the principal ray of the imaging light beam EL2 toward the projection area PA. However, the shift amount can be measured in real time by the encoder heads EN1 and EN2, and the exposure position variation due to the shift can be measured with high accuracy by, for example, the image shift correction optical member 45 in the projection optical system PL. And it becomes possible to correct at high speed. As a result, the exposure process can be performed with high positional accuracy with respect to the substrate P.

  As described above, the exposure apparatus EX includes the second drum member 22 that is a cylindrical member, the scale unit GP, the projection modules PL1 to PL6 that are processing units of the exposure apparatus EX, and the first reading that reads the scale unit GP. Encoder heads EN4 and EN5 that are devices, and encoder heads EN1 and EN2 that are second reading devices that read the scale part GP, and the first reading device and the second reading device are arranged at different positions in the circumferential direction, and the scale unit A third reading device for reading GP, for example, an encoder head EN3 is provided.

  The encoder heads EN4 and EN5 are arranged around the scale portion GP as viewed from the second central axis AX2, and have rotated the specific position described above about the second central axis AX2 by approximately 90 degrees around the second central axis AX2. The scale portion GP is read at the position. The encoder heads EN1 and EN2 read the scale part GP at the specific position described above. The exposure apparatus EX uses the read outputs of the scale unit GP measured by the encoder heads EN4 and EN5 as the first reading apparatus, the encoder heads EN1 and EN2 as the second reading apparatus, and the encoder head EN3 as the third reading apparatus. The second central axis AX2 of the two-drum member 22 is obtained. The projection modules PL1 to PL6, which are processing units, are displacements when the second central axis AX2 of the second drum member 22 moves in a direction perpendicular to the second central axis AX2 that moves. Processing corrected by the read output of the encoder heads EN4 and EN5 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  Further, by comparing the output of the measured values from the encoder heads EN4, EN1, and EN3 with the output of the measured values from the encoder heads EN5, EN2, and EN3, the influence of the eccentric error of the scale disk SD with respect to the rotating shaft ST can be suppressed. Highly accurate measurement is possible.

  The third reading device is not limited to the encoder head EN3. When the first reading device is the encoder head EN4 and the second reading device is the encoder head EN1, the third reading device is the encoder head EN5 or the encoder head EN2. It may be. As described above, in the exposure apparatus EX, the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P. The odd-numbered projection modules PL1, PL3, and PL5 serve as the first processing unit, and the even-numbered projection modules PL2, PL4, and PL6 serve as the second processing unit. Specific positions (first specific positions) at which the first processing unit performs irradiation processing for irradiating the substrate P with light at two positions where the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P. The second processing unit sets the second specific position to which the irradiation process of irradiating light is performed. The encoder head EN1, which is the second reading device, reads the scale part GP at the specific position (first specific position), and the encoder head EN2 reads the scale part GP at the second specific position. The encoder head EN5 as the third reading device is arranged at a position rotated about 90 degrees in the direction connecting the second specific position and the second central axis AX2 with the second central axis AX2 as the center. Read part GP.

  The exposure apparatus EX includes the second drum member 22 based on the read output of the scale part GP measured by the encoder head EN4 as the first reading apparatus, the encoder head EN1 as the second reading apparatus, and the encoder head EX5 as the third reading apparatus. The second central axis AX2 is obtained. Then, the projection modules PL2, PL4, and PL6 that are the second processing unit perform the first displacement when moving in the direction orthogonal to the second central axis AX2 on which the second central axis AX2 of the second drum member 22 moves. Processing corrected by the reading output of the encoder heads EN4 and EN5 as reading devices can be performed. As described above, even when there are a plurality of processing units such as the first processing unit and the second processing unit, the first processing unit and the second processing unit can process each processing with high accuracy.

  When measuring the position and rotational speed of the second drum member 22 in the rotational direction, for example, an average (simple average or weighted average) value of measurement signal outputs from the encoder heads EN1, EN2, EN3, EN4, and EN5. If this is taken, the error is reduced and stable detection is possible. For this reason, when controlling the 2nd drive part 36 by servo mode by the control apparatus 14, the rotation position of the 2nd drum member 22 can be controlled more precisely. Further, the rotational position of the first drum member 21 via the first drive unit 26 based on the measurement signal corresponding to the rotational position and rotational speed of the first drum member 21 (cylindrical mask DM) detected by the first detector 25. Even when the speed is servo controlled, the first drum member 21 and the second drum member 22 can be synchronously moved (synchronously rotated) with high accuracy.

<Modification of First Embodiment>
FIG. 11 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the modification of the first embodiment is viewed in the direction of the rotation center line AX2. The observation direction AM2 of the alignment microscope AMG2 described above is arranged on the rear side in the feeding direction of the substrate P, that is, on the front side (upstream side) of the exposure position (projection region), and is formed near the end in the Y direction of the substrate P. The alignment mark (formed in an area within several tens of μm to several hundreds of μm square) is image-detected at high speed by an imaging device or the like while the substrate P is being sent at a predetermined speed, The image of the mark is sampled at high speed in the (imaging range). The relationship between the mark position on the substrate P and the rotation angle position of the second drum member 22 is stored by storing the rotation angle position of the scale disk SD sequentially measured by the encoder head EN5 at the moment when the sampling is performed. Is required.

  On the other hand, the observation direction AM1 of the alignment microscope AMG1 described above is arranged on the front side in the feeding direction of the substrate P, that is, on the rear side (downstream side) of the exposure position (projection region), and near the end portion of the substrate P in the Y direction. Similarly to the alignment microscope AMG2, the image of the alignment mark formed in (10) to several hundred μm square is sampled at high speed by an imaging device or the like, and at the moment of sampling, the encoder head EN4 By storing the rotation angle position of the scale disk SD sequentially measured by the above, the correspondence between the mark position on the substrate P and the rotation angle position of the second drum member 22 is obtained.

  The encoder head EN4 is set on an installation direction line Le4 obtained by rotating the installation direction line Le1 of the encoder head EN1 about the rotation center line AX2 by approximately 90 ° toward the front side in the feed direction of the substrate P. The encoder head EN5 is set on the installation direction line Le5 obtained by rotating the installation direction line Le2 of the encoder head EN2 about 90 ° around the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P.

  The encoder head EN3 is arranged on the opposite side of the encoder heads EN1 and EN2 with the rotation center line AX2 interposed therebetween, and the installation orientation line Le3 is set on the center plane P3.

  As shown in FIG. 11, when viewed in the XZ plane and from the rotation center line AX2, the observation direction AM1 passing through the detection center on the substrate P by the alignment microscope AMG1 (towards the rotation center line AX2) is the same direction. The encoder head EN4 is arranged on the installation direction line Le4 set in the radial direction of the scale part GP. Further, when viewed from the rotation center line AX2 in the XZ plane, the scale portion GP is arranged in the same direction as the observation direction AM2 (toward the rotation center line AX2) passing through the detection center on the substrate P by the alignment microscope AMG2. An encoder head EN5 is disposed on each of the installation orientation lines Le5 set in the radial direction. As described above, the detection probes of the alignment microscopes AMG1 and AMG2 are arranged around the second drum member 22 when viewed from the second central axis AX2, and the position where the encoder heads EN4 and EN5 are arranged is connected to the second central axis AX2. The direction (installation azimuth lines Le4 and Le5) is arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. Note that the positions around the rotation center line AX2 where the alignment microscopes AMG1, AMG2 and encoder heads EN4, EN5 are arranged are the sheet entry area IA where the substrate P starts to contact the second drum member 22, and the second drum member 22. To the sheet separation area OA where the substrate P is detached from the sheet.

(Second Embodiment)
Next, a second embodiment of the processing apparatus according to the present invention will be described with reference to FIGS. In this figure, the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted.

  The second drum member 22 includes a reference mark forming portion Rfp formed on a curved surface of a cylindrical surface. The reference mark forming portion Rfp is formed continuously or discretely at the same pitch as the alignment mark (formed in an area within several tens μm to several hundred μm square) formed near the end in the Y-axis direction of the substrate P. It is preferable to keep it. It is preferable that the curved surface detection probes GS1 and GS2 for detecting the reference mark forming portion Rfp have the same configuration as the microscopes AMG1 and AMG2. The curved surface detection probes GS1 and GS2 are for detecting an image at high speed using an imaging device or the like, and sample the mark image of the reference mark forming unit Rfp at high speed in a microscope field of view (imaging range). At the moment when the sampling is performed, the correspondence relationship between the rotation angle position of the second drum member 22 and the reference mark forming portion Rfp is obtained, and the rotation angle position of the second drum member 22 that is sequentially measured is stored.

  The detection center AS1 of the curved surface detection probe GS1 is in the same direction as the detection center of the observation direction AM1 of the substrate P (toward the rotation center line AX2) by the alignment microscope AMG1 when viewed in the XZ plane and from the rotation center line AX2. Further, the detection center AS1 of the curved surface detection probe GS1 is in the same direction as the installation direction line Le4 set in the radial direction of the scale part GP when viewed in the XZ plane and from the rotation center line AX2. The detection center AS2 of the curved surface detection probe GS2 is the same direction as the detection center of the observation direction AM2 of the substrate P (toward the rotation center line AX2) by the alignment microscope AMG2 when viewed from the rotation center line AX2 in the XZ plane. Become. Further, the detection center AS2 of the curved surface detection probe GS2 is in the same direction as the installation direction line Le5 set in the radial direction of the scale part GP when viewed in the XZ plane and from the rotation center line AX2.

  In this way, the curved surface detection probe GS1 is placed on the installation direction line Le4 obtained by rotating the installation direction line Le1 of the encoder head EN1 about the rotation center line AX2 by approximately 90 ° toward the rear side in the feed direction of the substrate P. Is set. Further, the curved surface detection probe GS2 is set on an installation direction line Le5 obtained by rotating the installation direction line Le2 of the encoder head EN2 by approximately 90 ° around the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P. .

  Since the plurality of marks formed in the reference mark forming portion Rfp are arranged on the cylindrical outer peripheral surface of the second drum member 22 as reference marks at regular intervals in the circumferential direction, these reference marks are arranged on the curved surface detection probe GS1, Based on the measured reading values of the encoder heads EN4 and EN5 when the image is sampled by the GS2 and the deviation amount from the detection center of the reference mark image in the sampled image, for example, an arrangement error of the detection probes GS1 and GS2 Can be verified.

  Further, when a reference line pattern extending in the Y-axis direction is engraved on the outer peripheral surface of the second drum member 22, the reference line pattern is detected by each of the detection probes GS1 and GS2 and each of the alignment microscopes AMG1 and AMG2. Accordingly, the arrangement error of each alignment microscope AMG1, AMG2 can be calibrated with reference to the coordinate system of the outer peripheral surface of the second drum member 22 specified based on the measurement readings of the encoder heads EN4, EN5.

  In FIG. 12, the diameter of the scale disk SD is smaller than the diameter of the second drum member 22, but of the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface around which the substrate P is wound, and the scale The so-called measurement Abbe error can be further reduced by aligning (substantially matching) the diameter of the scale part GP of the disk SD. In this case, the exposure apparatus EX preferably includes a roundness adjusting device that adjusts the roundness of the scale disk SD. FIG. 13 is an explanatory diagram for explaining a roundness adjusting device for adjusting the roundness of the scale member.

  The scale disk SD, which is a scale member, is an annular member, and the scale portion GP is fixed to the end portion of the second drum member 22 orthogonal to the second central axis AX2 of the second drum member 22. The scale disk SD has a groove Sc provided in the scale disk SD along the circumferential direction of the second central axis AX2, and has the same radius as the groove Sc and along the circumferential direction of the second central axis AX2. It is made to oppose the groove | channel Dc provided in this. The scale disk SD has a bearing member SB such as a ball bearing interposed between the groove Sc and the groove Dc.

  The roundness adjusting device CS is provided on the inner peripheral side of the scale disk SD, and includes an adjusting unit 60 and a pressing member PP. The roundness adjusting device CS includes a pressing mechanism (60, PP, etc.) that can vary the pressing force in the radial direction from the second central axis AX2, for example, in the direction parallel to the installation orientation line Le4. A plurality (for example, 8 to 16 places) are provided at a predetermined pitch in the circumferential direction around the rotation center line AX2.

  The adjusting unit 60 has a male screw part 61 that passes through the hole part of the pressing member PP and the through hole FP3 of the scale disk SD and is screwed into the female screw part FP4 of the second drum member 22, and a screw head part that contacts the pressing member PP. 62. The pressing member PP is an annular fixed plate having a smaller radius than the scale disk SD along the circumferential direction at the end of the scale disk SD.

  An inclined surface FP2 is formed in the cross section including the second central axis AX2 on the inner peripheral side of the scale disk SD and parallel to the second central axis AX2 at the tip of the installation orientation line Le4 extending to the inner peripheral side of the scale disk SD. Has been. The inclined surface FP2 is a truncated cone-shaped surface whose thickness decreases in a direction parallel to the second central axis AX2 as it approaches the second central axis AX2. In the cross section including the second central axis AX2 on the inner peripheral side of the scale disk SD and parallel to the second central axis AX2, the pressing member PP is in a direction parallel to the second central axis AX2 as it approaches the second central axis AX2. It has a frustoconical portion with increased thickness. The inclined surface FP1 is a side surface of the frustoconical portion. The pressing member PP is fixed by the adjustment unit 60 so that the inclined surface FP2 and the inclined surface FP1 face the scale disk SD.

  In the roundness adjusting device CS, the male screw portion 61 of the adjusting portion 60 is screwed into the female screw portion FP3 of the scale disk SD, and the screw head portion 62 is tightened, whereby the pressing force of the inclined surface FP1 of the pressing member PP is changed to the inclined surface. It is transmitted to FP2, and the outer peripheral surface of the scale disk SD is elastically deformed by a small amount toward the outside. Conversely, by rotating the screw head portion 62 to the opposite side and loosening the male screw portion 61, the pressing force applied from the inclined surface FP1 of the pressing member PP to the inclined surface FP2 is reduced, and the outer peripheral surface of the scale disk SD is directed inward. Slightly elastic deformation.

  The roundness adjusting device CS operates the screw head portion 62 (male screw portion 61) in the adjustment portion 60 that is provided in a plurality with a predetermined pitch in the circumferential direction centered on the rotation center line AX2, and thereby the outer peripheral surface of the scale portion GP. The diameter can be adjusted in a small amount. In addition, the inclined surfaces FP1 and FP2 of the roundness adjusting device CS are provided inside the scale portion GP so that the above-described installation orientation lines Le1 to Le5 pass, and therefore the outer periphery of the scale portion GP with respect to the rotation center line AX2. The surface can be evenly elastically deformed in the radial direction. Accordingly, by operating the adjusting unit 60 at an appropriate position according to the roundness of the scale disk SD, the roundness of the scale part GP of the scale disk SD is increased, and a slight eccentricity error with respect to the rotation center line AX2 is reduced. The position detection accuracy in the rotational direction with respect to the second drum member 22 can be improved. Note that the amount of adjustment of the radius adjusted by the roundness adjusting device CS varies depending on the diameter and material of the scale disk SD or the radial position of the adjusting unit 60, but is about a dozen μm at the maximum.

  Further, the effect of suppressing the minute eccentricity error obtained by the adjustment by the roundness adjusting device CS can be verified by comparing the difference between the measurement readings of a plurality of encoder heads.

(Third embodiment)
Next, a third embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 14 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. In FIG. 14, the diameter of the outer peripheral surface of the second drum member 22 and the diameter of the scale portion GP of the scale disk SD are aligned (substantially match). In this figure, the same reference numerals are given to the same elements as those of the first embodiment and the second embodiment, and the description thereof is omitted.

  Further, as described above, in the exposure apparatus EX, the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P. Two positions where the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P are defined as a first specific position PX1 and a second specific position PX2. The encoder head EN6 detects the position PX6 of the scale portion GP at a specific position, for example, corresponding to the center plane P3, between the first specific position PX1 and the second specific position PX2. The encoder head EN6 is disposed on an installation orientation line Le6 that coincides with the central plane P3 when viewed from the second central axis AX2. In the present embodiment, the diameter of the outer peripheral surface around which the substrate P is wound out of the outer peripheral surface (cylindrical curved surface) of the second drum member 22 and the diameter of the scale portion GP of the scale disk SD are aligned. Corresponds to the above-described specific position (hereinafter referred to as the specific position PX) as viewed from the second central axis AX2. The specific position PX6 is located at the center in the X-axis direction of the areas (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6. The encoder head EN4 is set on an installation direction line Le4 obtained by rotating the installation direction line Le6 of the encoder head EN6 about the rotation center line AX2 by approximately 90 ° toward the rear side in the feed direction of the substrate P. .

  In the present embodiment, the angular interval between the installation orientation line Le4 of the encoder head EN4 corresponding to the alignment microscope AMG1 and the installation orientation line Le5 of the encoder head EN5 corresponding to the alignment microscope AMG2 is an angle θ (for example, 15 °). Set to

  For example, when the first reading device is the encoder head EN4 and the second reading device is the encoder head EN1, the control device 14 can perform the correction process in the same manner as the procedure shown in FIG. For example, the control device 14 gives the input of the read output of the encoder head EN4 that is the first reading device to the database stored in the storage unit of the control device 14, and calculates the displacement angle α. The control device 14 calculates a displacement component Δqx1 from the calculated displacement angle α, and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. In the exposure apparatus EX of the present embodiment, the specific position PX6 is the center in the X-axis direction of the average exposed area of the substrate P on the curved surface of the second drum member 22. The exposure apparatus EX can reduce correction processing such as fine adjustment of the focus state by performing irradiation processing for irradiating optimal exposure light at the specific position PX6. Then, the exposure apparatus EX captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and processes the object to be processed on the curved surface of the second drum member 2, that is, the substrate P. Can be applied. For this reason, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

  As described above, the exposure apparatus EX includes the second drum member 22 that is a cylindrical member, the scale unit GP, the projection modules PL1 to PL6 that are processing units of the exposure apparatus EX, and the first reading that reads the scale unit GP. The encoder head EN4, which is a device, the encoder head EN6, which is a second reading device that reads the scale portion GP, and the first reading device and the second reading device are arranged at different positions in the circumferential direction and read the scale portion GP. 3 reading device, for example, an encoder head EN3.

  The exposure apparatus EX includes the second drum member 22 based on the read output of the scale portion GP measured by the encoder head EN4 as the first reading device, the encoder head EN6 as the second reading device, and the encoder head EN3 as the third reading device. The second central axis AX2 is obtained. The projection modules PL1 to PL6, which are processing units, are displacements when the second central axis AX2 of the second drum member 22 moves in a direction perpendicular to the second central axis AX2 that moves. Processing corrected by the read output of the encoder head EN4 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  By the way, in the arrangement of the encoder head of FIG. 7, the fine movement component due to the eccentricity of the scale part GP and the position displacement component due to the rotation may not be distinguished well, but if the arrangement of the encoder head as shown in FIG. The discrimination can be easily performed. Therefore, the encoder head EN6 in FIG. 14, the encoder head EN4 arranged with a deviation of about 90 ° from the encoder head EN4, and the encoder head EN3 arranged with a further 90 ° deviation (arranged at 180 ° with respect to the encoder head EN6). Focus on one encoder head.

  In this case, if the measurement reading of the encoder head EN6 is Me6 and the measurement reading of the encoder head EN3 is Me3, the fine movement component ΔXd in the X direction due to the eccentricity of the scale disk SD (scale part GP) is expressed by the following equation (1). The position displacement component ΔRp obtained by the rotation of the scale part GP is obtained by the following formula (2) as an average value.

  ΔXd = (Me6-Me3) / 2 (1)

  ΔRp = (Me6 + Me3) / 2 (2)

  Therefore, when the measurement reading value of the encoder head EN4 is Me4 and the reading value Me4 and the position displacement component ΔRp are sequentially compared (sequential difference is obtained), in the case of FIG. 14, the scale disk SD (second drum member) due to eccentricity is obtained. 22) The fine movement component ΔZd in the Z-axis direction can be obtained in real time.

<Modification of Third Embodiment>
FIG. 15 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the modification of the third embodiment is viewed in the direction of the rotation center line AX2. As shown in FIG. 15, the encoder head EN6 described above can be omitted. The encoder head EN4 has an installation orientation obtained by rotating a line in the XZ plane connecting the specific position and the rotation center line AX2 approximately 90 ° around the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P. Set on line Le4.
Here, only the alignment microscope AMG1 is arranged in the same orientation as the installation orientation line Le4 of the encoder head EN4.

  The encoder head EN5 rotates a line in the XZ plane connecting the specific position and the rotation center line AX2 approximately 90 ° about the axis of the rotation center line AX2 toward the front side (downstream side) in the feed direction of the substrate P. Is set on the installation orientation line Le5. In this case, in the exposure apparatus EX, the control device 14 sets the first reading device as the encoder head EN4 or the encoder head EN5, and the second reading device and the third reading device are any of the encoder head EN1, the encoder head EN2, and the encoder head EN3. Or two.

  The exposure apparatus EX performs an irradiation process of irradiating an optimal exposure light to the center in the X-axis direction of the average exposed area of the substrate P on the curved surface of the second drum member 22, thereby bringing the focus state into the focus state. It is possible to reduce correction processing such as fine-tuning. For this reason, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

  In the arrangement of the encoder head shown in FIG. 15, the fine movement component due to the eccentricity of the scale part GP and the position displacement component due to the rotation can be easily discriminated. In the arrangement of FIG. 15, the measured readings Me4 and Me5 of the two encoder heads EN4 and EN5 that read the scale of the scale part GP in the Z-axis direction are used, and the Z-axis of the scale disk SD (second drum member 22) due to eccentricity is used. The fine movement component ΔZd in the direction is obtained by the following formula (3).

  ΔZd = (Me4-Me5) / 2 (3)

  Furthermore, the measurement reading of the encoder head EN3 that reads the position displacement component ΔRp due to the rotation of the scale part GP obtained by the average value of the measurement reading values Me4 and Me5 of the encoder heads EN4 and EN5 and the scale of the scale part GP in the X-axis direction. If the difference from the value Me3 is sequentially obtained, the fine movement component ΔXd in the X-axis direction of the scale disk SD (second drum member 22) due to eccentricity is obtained in real time. The position displacement component ΔRp is obtained by the following formula (4).

  ΔRp = (Me4 + Me5) / 2 (4)

  As described above, the exposure apparatus EX includes the second drum member 22 that is a cylindrical member, the scale unit GP, the projection modules PL1 to PL6 that are processing units of the exposure apparatus EX, and the first reading that reads the scale unit GP. Encoder heads EN4 and EN5 that are devices, encoder heads EN1 and EN2 that are second reading devices that read the scale part GP, and the first reading device and the second reading device are arranged at different positions in the circumferential direction, and the scale unit A third reading device for reading GP, for example, an encoder head EN3 is provided.

  In the case of the configuration as shown in FIG. 15, the fine movement component of the second drum member 22 in the Z-axis direction is based on the measured reading values of the two encoder heads EN4 and EN5 that are 180 ° apart from each other. Since ΔZd can be obtained sequentially, the focus fluctuation ΔZf of the substrate P can be easily calculated as the following equation (5).

  ΔZf = ΔZd × cos θ (5)

  For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed. For this reason, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

(Fourth embodiment)
Next, a fourth embodiment of the processing apparatus according to the present invention will be described with reference to FIGS. FIG. 16 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 17 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the fourth embodiment is viewed in the direction of the rotation center line AX1. In this figure, the same elements as those of the first embodiment, the second embodiment, and the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The scale disk SD is fixed to both ends of the first drum member 21 and the second drum member 22 so as to be orthogonal to the rotation axis ST. The scale parts GP are at both ends of the second drum member 22, and the encoder heads EN <b> 1 to EN <b> 5 that measure the respective scale parts GP are arranged at both ends of the second drum member 22.

  The first detector 25 shown in FIG. 1 optically detects the rotational position of the first drum member 21, and has a highly circular scale disk (scale member) SD and an encoder head as a reading device. Includes EH1, EH2, EH3, EH4, EH5.

  The scale disk SD is fixed to at least one end (both ends in FIG. 16) of the first drum member 21 orthogonal to the rotation axis of the first drum member 21. For this reason, the scale disk SD rotates integrally with the rotation axis ST around the rotation center line AX1. A scale portion GPM is engraved on the outer peripheral surface of the scale disk SD. The encoder heads EH1, EH2, EH3, EH4, and EH5 are arranged around the scale portion GP as viewed from the rotation axis STM. The encoder heads EH1, EH2, EH3, EH4, and EH5 are arranged to face the scale part GPM and can read the scale part GPM in a non-contact manner. The encoder heads EH1, EH2, EH3, EH4, and EH5 are arranged at different positions in the circumferential direction of the first drum member 21.

  The encoder heads EH1, EH2, EH3, EH4, and EH5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement in the tangential direction (in the XZ plane) of the scale portion GPM. As shown in FIG. 17, when the installation directions of the encoder heads EH1 and EH2 (angle directions in the XZ plane with the rotation center line AX1 as the center) are represented by the installation direction lines Le11 and Le12, the installation direction lines Le11 and Le12 are shown. However, the encoder heads EH1 and EH2 are arranged so that the angle becomes ± θ ° with respect to the center plane P3. The installation azimuth lines Le11 and Le12 coincide with the angular directions in the XZ plane centered on the rotation center line AX1 of the illumination light beam EL1 shown in FIG. Here, the illumination mechanism IU, which is a processing unit, irradiates a predetermined pattern (mask pattern) on the cylindrical mask DM with the illumination light beam EL1. Thereby, the projection optical system PL can project the image of the pattern in the illumination region IR on the cylindrical mask DM onto a part of the substrate P (projection region PA) being transported by the transport device 9.

  The encoder head EH4 is an installation direction obtained by rotating the installation direction line Le11 of the encoder head EH1 about the axis of the rotation center line AX1 by about 90 ° toward the rear side in the rotation direction with respect to the center plane P3 of the first drum member 21. Set on line Le14. Further, the encoder head EH5 is installed by rotating the installation azimuth line Le12 of the encoder head EH2 about 90 ° around the axis of the rotation center line AX1 toward the rear side in the rotation direction with respect to the center plane P3 of the first drum member 21. It is set on the azimuth line Le15. Here, in the case of 90 ° ± γ, the range of γ is 0 ° ≦ γ ≦ 5.8 ° as in the first embodiment.

  The encoder head EH3 rotates the installation orientation line Le12 of the encoder head EH2 by approximately 120 ° around the axis of the rotation center line AX1, and the installation orientation by rotating the encoder head EH4 by approximately 120 ° about the axis of the rotation center line AX1. Set on line Le13.

  The encoder heads EH1, EH2, EH3, EH4, and EH5 arranged around the first drum member 21 in the present embodiment are arranged in the same manner as the encoder head EN1 arranged around the second drum member 22 in the first embodiment. , EN2, EN3, EN4, and EN5 are mirror image inverted.

  As described above, the exposure apparatus EX is the first drum member 21 that is a cylindrical member, the scale unit GPM, the illumination mechanism IU that is a processing unit of the exposure apparatus EX, and the first reading device that reads the scale unit GPM. There are encoder heads EH4 and EH5, and encoder heads EH1 and EH2 which are second reading devices that read the scale part GPM.

  The first drum member 21 has a curved surface curved with a predetermined radius from the first central axis AX1, which is a predetermined axis, and rotates around the first central axis AX1. The scale part GPM is annularly arranged along the circumferential direction in which the first drum member 21 rotates, and rotates around the first central axis AX1 together with the first drum member 21. The illumination mechanism IU, which is a processing unit of the exposure apparatus EX, is arranged inside the first drum member 21 as viewed from the second central axis AX2, and forms a mask pattern on a curved surface at a specific position in the circumferential direction of the first drum member 21. On the other hand, two illumination light beams EL1 are irradiated. The encoder heads EH4 and EH5 are arranged around the scale portion GPM as viewed from the first central axis AX1, and the specific position described above about the first central axis AX1 is approximately 90 degrees around the first central axis AX1. It is arranged at the rotated position and reads the scale part GPM. The encoder heads EH1 and EH2 read the scale portion GPM at the specific position described above. The exposure apparatus EX uses the first reading device to determine the displacement when the illumination mechanism IU as the processing unit moves in a direction perpendicular to the first central axis AX1 along which the rotation axis STM of the first drum member 21 moves. Processing corrected by the read output of a certain encoder head EH4, EH5 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the first drum member 21 (cylindrical member) with high accuracy while suppressing the calculation load, that is, the object to be processed on the curved surface of the first drum member 21, that is, Processing (irradiation of illumination light) can be performed on the cylindrical mask DM.

  The exposure apparatus EX reads each of the scale parts GPM measured by the encoder heads EH4 and EH5 as the first reading device, the encoder heads EH1 and EH2 as the second reading device, and the encoder head EH3 as the third reading device. The fine movement component in the XZ plane of the rotation axis STM of the first drum member 21 may be obtained from the output.

(Fifth embodiment)
Next, a fifth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 18 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. In the exposure apparatus EX2, the light source device 13 emits an illumination light beam EL1 that illuminates the cylindrical mask DM.

  When the illumination light beam EL1 emitted from the light source of the light source device 13 is guided to the illumination module IL and a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is separated into a plurality of light beams, and the plurality of illumination light beam EL1s are Guide to the illumination module IL.

  Here, the illumination light beam EL1 emitted from the light source device 13 enters the polarization beam splitters SP1 and SP2. In the polarization beam splitters SP1 and SP2, it is preferable that the incident illumination light beam EL1 is totally reflected so as to suppress energy loss due to separation of the illumination light beam EL1. Here, the polarization beam splitters SP1 and SP2 reflect a light beam that becomes S-polarized linearly polarized light and transmit a light beam that becomes P-polarized linearly polarized light. For this reason, the light source device 13 emits to the first drum member 21 an illumination light beam EL1 in which the illumination light beam EL1 incident on the polarization beam splitters SP1 and SP2 becomes a linearly polarized light (S-polarized light). Thereby, the light source device 13 emits the illumination light beam EL1 having the same wavelength and phase.

  The polarization beam splitters SP1 and SP2 reflect the illumination light beam EL1 from the light source, while transmitting the projection light beam EL2 reflected by the cylindrical mask DM. In other words, the illumination light beam EL1 from the illumination optical module ILM enters the polarization beam splitters SP1 and SP2 as a reflected light beam, and the projection light beam EL2 from the cylindrical mask DM enters the polarization beam splitters SP1 and SP2 as a transmitted light beam. .

  As described above, the illumination module IL as a processing unit performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM that is an object to be processed. Thereby, the projection optical system PL can project the image of the pattern in the illumination region IR on the cylindrical mask DM onto a part of the substrate P (projection region PA) being transported by the transport device 9.

  When a predetermined pattern (mask pattern) for reflecting the illumination light beam EL1 is provided on the curved surface of the cylindrical mask DM, the reference mark forming member Rfp described above can be provided on the curved surface together with the mask pattern. When this reference mark forming portion Rfp is formed simultaneously with the mask pattern, the reference mark forming portion Rfp is formed with the same accuracy as the mask pattern. For this reason, the curved surface detection probes GS1 and GS2 that detect the reference mark forming portion Rfp described above can sample the mark image of the reference mark forming portion Rfp at high speed and with high accuracy. At the moment when this sampling is performed, the rotation angle position of the first drum member 21 is measured by the encoder head, whereby the correspondence between the reference mark forming portion Rfp and the rotation angle position of the first drum member 21 that is sequentially measured. A relationship is required.

(Sixth embodiment)
Next, a sixth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 19 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. In the exposure apparatus EX3, the light source device 13 includes polygon scanning units PO1 and PO2, and the polygon scanning unit PO performs one-dimensional scanning with the drawing laser beam EL2. The spot light of the laser beam is collected on the substrate P, and during the one-dimensional scanning of the spot light, the laser beam is modulated on the substrate P at high speed based on the pattern data (CAD data), and thus on the substrate P. An electronic circuit pattern or the like is drawn (exposed).

  As described above, the exposure apparatus EX3 in FIG. 19 can perform the patterning process by irradiating the substrate P at a specific position with the exposure light (spot light) without the cylindrical mask DM. Furthermore, pattern exposure is performed on the substrate P wound around the second drum member (rotating drum) 22 by using an apparatus for projecting and exposing a variable mask pattern, for example, a maskless exposure apparatus disclosed in Japanese Patent No. 4223036. Also in this case, each embodiment can be applied similarly.

(Seventh embodiment)
Next, a seventh embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 20 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the seventh embodiment. The exposure apparatus EX4 is a processing apparatus that performs so-called proximity exposure on the substrate P. In the exposure apparatus EX4, the gap between the cylindrical mask DM and the second drum member 22 is set to be minute, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL to perform non-contact exposure. In this embodiment, the 2nd drum member 22 rotates with the torque supplied from the 2nd drive part 36 containing actuators, such as an electric motor. A drive roller MGG connected by, for example, a magnetic gear drives the first drum member 21 so as to be in a direction opposite to the rotation direction of the second drive unit 36. The second drive unit 36 rotates the second drum member 22 and rotates the drive roller MGG and the first drum member 21 to synchronize the first drum member 21 (cylindrical mask DM) and the second drum member 22. Move (synchronized rotation).

  The exposure apparatus EX4 also includes an encoder head EN6 that detects the position PX6 of the scale portion GP at a specific position where the principal ray of the imaging light beam EL is incident on the substrate P with respect to the substrate P. Here, since the diameter of the outer peripheral surface around which the substrate P is wound and the diameter of the scale portion GP of the scale disk SD are aligned among the outer peripheral surfaces of the second drum member 22, the position PX6 is located from the second central axis AX2. This coincides with the specific position described above. The encoder head EN7 is installed by rotating the installation direction line Le6 of the encoder head EN6 about the axis of the rotation center line AX2 by about 90 ° (in the range of 90 ° ± γ) toward the rear side in the feed direction of the substrate P. It is set on the azimuth line Le7.

  In the exposure apparatus EX4 of the present embodiment, the encoder head EN7 is the first reading device, the encoder head EN6 is the second reading device, and the position and identification of the axis of the second drum member 22 obtained from the reading output of the scale part GP are specified. It is possible to perform processing in which a displacement component in a direction that is connected to a position and is orthogonal to the axis is corrected by a reading output of the first reading device.

  In the first to fourth embodiments described above, an exposure apparatus is exemplified as the processing apparatus. The processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, using an inkjet ink dropping apparatus. Alternatively, the processing unit may be an inspection device.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 21 is a flowchart showing the device manufacturing method according to the first embodiment. FIG. 21 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  In the device manufacturing method shown in FIG. 21, first, for example, a function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and a necessary circuit pattern or wiring pattern is designed by CAD or the like (step S201). Next, a cylindrical mask DM for a necessary layer is manufactured based on the pattern for each layer designed by CAD or the like (step S202). In addition, a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, or the like) serving as a display panel base material is wound is prepared (step S203). The roll-shaped substrate P prepared in step S203 has a surface modified as necessary, a pre-formed base layer (for example, micro unevenness by an imprint method), and light sensitivity. The functional film or transparent film (insulating material) previously laminated may be used.

  Next, a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self light emitting element (step S204). This step S204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatuses EX, EX2, EX3, and EX4 described in the previous embodiments. An exposure process in which a substrate P coated with a silane coupling material is subjected to pattern exposure to form a pattern based on hydrophilicity and water repellency on the surface, a light sensitive catalyst layer is subjected to pattern exposure, and a metal film pattern (wiring, electrode) Etc.) or a printing step of drawing a pattern with a conductive ink containing silver nanoparticles or the like.

  Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A device is assembled by pasting sheets or the like (step S205). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

  Note that the requirements of the above-described embodiments and modifications can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications, patent publications, and US patents relating to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

9 transport device 11 processing device 12 mask holding device 13 light source device 14 control device 21 first drum member 22 second drum member 23 guide roller 24 drive roller 25 first detector 26 first drive unit 31 guide member 31 solid light source 33 first 2 guide member 35 detector 44 focus correction optical member 45 image shift correction optical member 46 rotation correction mechanism 47 magnification correction optical member 62 head portion AM1, AM2 observation direction AMG1, AMG2 alignment microscope GS1, GS2 curved surface detection probe CS roundness Adjustment device DM Cylindrical mask EN1, EN2, EN3, EN4, EN5, EN6, EN7, EH1, EH2, EH3, EH4, EH5 Encoder head EX, EX2, EX3, EX4 Exposure device (processing device)
PO Polygon scanning unit PP Press member

Claims (20)

A flexible long substrate is wound around a part of the outer peripheral surface of a rotating drum rotatable around the first central axis and fed in the longitudinal direction to the substrate supported by the rotating drum. A substrate processing apparatus for performing predetermined processing on a substrate,
A scale having a scale formed in an annular shape at a predetermined radius from the first central axis, and rotating around the first central axis together with the rotary drum;
A first treatment is performed on the substrate at a first specific position set between an entry region where the substrate starts to come into contact with a separation region where the substrate comes off the outer peripheral surface, of the outer peripheral surface of the rotating drum. 1 processing unit;
A second processing unit that performs a predetermined process on the substrate at a second specific position that is set between the first specific position and the separation region on the outer peripheral surface of the rotating drum;
A specific pattern formed discretely or continuously on the substrate, or a reference mark formed on the outer peripheral surface of the rotary drum, the entry region and the first specific position on the outer peripheral surface of the rotary drum. A pattern detection device for detecting at a third specific position set in between;
The first specific position, the second specific position, and the third specific position are arranged in substantially the same direction as viewed from the first central axis. A first reading device, a second reading device, and a third reading device that individually measure the scale of the scale unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The first processing unit and the second processing unit are arranged at different positions along the direction of the first central axis,
The first processing unit forms a first portion of a device pattern on the substrate at the first specific position, and the second processing unit forms the device pattern at the second specific position. Forming a second portion different from the first portion on the substrate;
Substrate processing equipment. The substrate processing apparatus according to claim 2,
Each of the first processing unit and the second processing unit has a mask pattern for the device along a cylindrical surface having a constant radius from a second central axis arranged in parallel with the first central axis. A projection optical system that projects light for exposure from the formed cylindrical mask onto the substrate supported by the rotating drum;
Substrate processing equipment. The substrate processing apparatus according to claim 3, wherein
A first projection area by the projection optical system of the first processing unit is set at the first specific position;
A second projection region by the projection optical system of the second processing unit is set at the second specific position;
Substrate processing equipment. The substrate processing apparatus according to claim 2,
Each of the first processing unit and the second processing unit includes an optical drawing apparatus that draws a CAD pattern by scanning spot light, and a mask that projects pattern light having a contrast distribution by modulation of a large number of micromirrors. It is composed of any one of a less exposure apparatus and a printing apparatus that draws a pattern with droplets from an inkjet head.
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 5,
The scale portion is formed in an annular shape on the outer peripheral surface of a disk-like or annular scale member fixed to the side of the rotary drum so as to be coaxial with the first central axis.
Substrate processing equipment. The substrate processing apparatus according to claim 6,
The diameter of the outer peripheral surface of the scale member and the diameter of the outer peripheral surface of the rotating drum were substantially matched.
Substrate processing equipment. The substrate processing apparatus according to claim 7,
The diameter of the outer peripheral surface of the scale member was 20 cm or more,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 8,
A reference line pattern extending in the direction of the first central axis is formed on the outer peripheral surface of the rotating drum so as to be detected by the pattern detection device.
Substrate processing equipment. The substrate processing apparatus according to claim 9, comprising:
The pattern detection apparatus has a plurality of alignment microscopes arranged in the direction of the first central axis,
Calibrating arrangement errors of the plurality of alignment microscopes that have detected the reference line pattern with reference to a coordinate system specified based on a measurement reading value of the scale unit measured by the third reading device;
Substrate processing equipment. A flexible long substrate is wound around a part of the outer peripheral surface of a rotating drum rotatable around the first central axis and fed in the longitudinal direction to the substrate supported by the rotating drum. A substrate processing apparatus for performing predetermined processing on a substrate,
A scale having a scale formed in an annular shape at a predetermined radius from the first central axis, and rotating around the first central axis together with the rotary drum;
A first treatment is performed on the substrate at a first specific position that is set between an entry region where the substrate starts to contact and a separation region outside the outer circumferential surface in the circumferential direction of the outer circumferential surface of the rotating drum. 1 processing unit;
A second processing unit that performs a predetermined process on the substrate at a second specific position that is set between the first specific position and the separation region in the circumferential direction of the outer peripheral surface of the rotating drum;
A pattern detection device for detecting a specific pattern formed discretely or continuously on the substrate at a third specific position set between the approach region and the first specific position in the circumferential direction;
The scale portion is disposed so as to face the scale portion, and is disposed in substantially the same orientation as the center position of the first specific position and the second specific position in the circumferential direction, and measures the scale of the scale portion. A first reading device,
A second reading device that is disposed so as to face the scale portion and is disposed in substantially the same orientation as the third specific position as viewed from the first central axis, and measures the scale of the scale portion;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 11,
The first processing unit and the second processing unit are arranged at different positions along the direction of the first central axis,
The first processing unit forms a first portion of a device pattern on the substrate at the first specific position, and the second processing unit forms the device pattern at the second specific position. Forming a second portion different from the first portion on the substrate;
Substrate processing equipment. The substrate processing apparatus according to claim 12,
Each of the first processing unit and the second processing unit has a mask pattern for the device along a cylindrical surface having a constant radius from a second central axis arranged in parallel with the first central axis. A projection optical system that projects light for exposure from the formed cylindrical mask onto the substrate supported by the rotating drum;
Substrate processing equipment. The substrate processing apparatus according to claim 13,
A first projection area by the projection optical system of the first processing unit is set at the first specific position;
A second projection region by the projection optical system of the second processing unit is set at the second specific position;
Substrate processing equipment. The substrate processing apparatus according to claim 12,
Each of the first processing unit and the second processing unit includes an optical drawing apparatus that draws a CAD pattern by scanning spot light, and a mask that projects pattern light having a contrast distribution by modulation of a large number of micromirrors. It is composed of any one of a less exposure apparatus and a printing apparatus that draws a pattern with droplets from an inkjet head.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 11 to 15,
The scale portion is formed in an annular shape on the outer peripheral surface of a disk-like or annular scale member fixed to the side of the rotary drum so as to be coaxial with the first central axis.
Substrate processing equipment. The substrate processing apparatus according to claim 16, comprising:
The diameter of the outer peripheral surface of the scale member and the diameter of the outer peripheral surface of the rotating drum were substantially matched.
Substrate processing equipment. The substrate processing apparatus according to claim 17,
The diameter of the outer peripheral surface of the scale member was 20 cm or more,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 11 to 18, wherein
A reference line pattern extending in the direction of the first central axis is formed on the outer peripheral surface of the rotating drum so as to be detected by the pattern detection device.
Substrate processing equipment. The substrate processing apparatus according to claim 19,
The pattern detection apparatus has a plurality of alignment microscopes arranged in the direction of the first central axis,
Calibrating arrangement errors of the plurality of alignment microscopes that have detected the reference line pattern with reference to a coordinate system specified based on the measurement reading value of the scale unit measured by the second reading device;
Substrate processing equipment.

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