JP6528882B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus which exposes a pattern on a flexible substrate supported on the outer peripheral surface of a cylindrical member.

  As an exposure apparatus used in a photolithography process, an exposure apparatus which exposes a substrate using a cylindrical or cylindrical mask as disclosed in the following patent documents is known (see, for example, Patent Document 1) . In addition, a cylindrical photomask with a light source disposed inside is placed in proximity to a flexible light-exposed body (film tape shape) wound around a rotatable feed roller, and the photomask and feed roller are rotated. There is also known an exposure apparatus for manufacturing a liquid crystal display element which continuously exposes an object to be exposed (see, for example, Patent Document 2).

  Not only in the case of using a plate-like mask but also in the case of exposing a substrate using a cylindrical or cylindrical mask, the position of the pattern of the mask in order to well project and expose an image of the pattern of the mask on the substrate. You need to get the information correctly. Therefore, it is desirable to devise a technique capable of accurately acquiring positional information of a cylindrical or cylindrical mask and accurately adjusting the positional relationship between the mask and the substrate.

  Therefore, in Patent Document 1, marks (scales, grids, etc.) for acquiring positional information are formed in a predetermined positional relationship with respect to the pattern in a predetermined area of the pattern forming surface of the cylindrical mask, and the mark is generated by the encoder system. There is disclosed a configuration for acquiring positional information of a pattern in a circumferential direction or a rotation axis direction of a pattern formation surface by detecting.

International Publication WO2008 / 029917 Japanese Utility Model Publication No. 60-019037

  In Patent Document 1 mentioned above, the substrate to which the pattern of the cylindrical rotation mask is transferred is a substrate of high rigidity such as a semiconductor wafer, and the substrate is held flat on the movable stage to Moved in parallel directions. In the case where the mask pattern is continuously and repeatedly transferred to a flexible long substrate, as shown in Patent Document 2, a rotatable feed roller, that is, a substrate to be treated is formed on the outer peripheral surface of a cylindrical member. Mass productivity can be enhanced by performing the exposure in a state in which the substrate is partially wound and the surface of the substrate is stably held along the curved surface of the cylindrical member.

  As described above, in a processing apparatus for processing a flexible object to be processed supported along the outer peripheral surface of a rotating cylindrical member (feed roller of a substrate), the position of the cylindrical member is suppressed while suppressing the calculation load. It is desired to improve the processing accuracy, for example, the transfer position accuracy of the pattern, the overlaying accuracy, etc., by accurately capturing (peripheral position of the outer peripheral surface, position in the rotational axis direction, etc.) There is.

  The aspect of the present invention is made in view of the above-mentioned situation, and it is a flexible substrate supported on the outer peripheral surface of a cylindrical member by accurately capturing the position of the cylindrical member while suppressing the calculation load. An object of the present invention is to provide a substrate processing apparatus capable of accurately positioning and exposing a pattern thereon.

  According to a first aspect of the present invention, there is provided a substrate processing apparatus for forming a pattern for manufacturing a device on a long sheet substrate, which has a cylindrical outer peripheral surface curved at a constant radius from a predetermined center line. A rotating drum for conveying the sheet substrate in the longitudinal direction by rotating around the center line in a state in which a portion of the sheet substrate is supported in the longitudinal direction along the outer peripheral surface; The pattern on the sheet substrate at a first specific position set among the outer peripheral surface of the rotary drum between an entry area where the sheet substrate starts to come in contact with the outer peripheral surface and a separation area where the sheet substrate deviates from the outer peripheral surface. And an outer peripheral surface fixed coaxially with the center line to an end side in a direction of the center line of the rotating drum and forming a pattern forming portion to form an outer peripheral surface having a diameter substantially equal to a diameter of an outer peripheral surface of the rotating drum. In the circumferential direction of And a scale disk formed with an annular scale, and arranged to face the scale formed on the outer peripheral surface of the scale disk and having substantially the same orientation as the first specific position with respect to the center line And a first reading mechanism for sequentially measuring a positional change in the circumferential direction of the scale.

  According to the aspect of the present invention, in the substrate processing apparatus, it is possible to accurately process the object to be processed on the curved surface of the cylindrical member by accurately capturing the position of the cylindrical member while suppressing the calculation load.

FIG. 1 is a schematic view showing an entire configuration of a processing apparatus (exposure apparatus) according to the first embodiment. FIG. 2 is a schematic view showing the arrangement of the illumination area and the projection area in FIG. FIG. 3 is a schematic view showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. FIG. 4 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view for explaining the relationship between a detection probe and a reader applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 7 is an explanatory view for explaining the positional deviation of the rotary drum by viewing the scale disc SD according to the first embodiment in the direction of the rotation center line AX2. FIG. 8 is an explanatory view for explaining an example of calculating the positional deviation of the rotary drum by viewing the scale disc SD according to the first embodiment in the direction of the rotation center line AX2. FIG. 9 is a flowchart showing an example of a procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 10 is a flowchart showing another example of the procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 11 is an explanatory view for explaining the position of the reading device, in which the scale disk SD according to the modification of the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 12 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the second embodiment is viewed in the direction of the rotation center line AX2. FIG. 13 is an explanatory view for explaining the roundness adjusting device for adjusting the roundness of the scale member. FIG. 14 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 15 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the modification of the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 16 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 17 is an explanatory view for explaining the position of the reading device in which the scale disc SD according to the fourth embodiment is viewed in the direction of the rotation center line AX1. FIG. 18 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. FIG. 19 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. FIG. 20 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the seventh embodiment. FIG. 21 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this. In the following embodiments, various processes for manufacturing one device will be described as an exposure apparatus used in a so-called roll-to-roll method in which a substrate is continuously subjected.

  Further, in the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. As an example, a predetermined direction in the horizontal plane is the X axis direction, a direction orthogonal to the X axis direction in the horizontal plane is the Y axis direction, a direction orthogonal to each of the X axis direction and the Y axis direction (ie vertical direction) the Z axis direction I assume.

First Embodiment
First, the configuration of the exposure apparatus of the present embodiment will be described using FIGS. 1 to 3. FIG. 1 is a schematic view showing an entire configuration of a processing apparatus (exposure apparatus) according to the first embodiment. FIG. 2 is a schematic view showing the arrangement of the illumination area and the projection area in FIG. FIG. 3 is a schematic view showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. As shown in FIG. 1, the processing apparatus 11 includes an exposure apparatus (processing mechanism) EX and a transport apparatus 9. The exposure apparatus EX is supplied with a substrate P (sheet, film or the like) by the transport device 9. For example, a flexible substrate P pulled out from a supply roll (not shown) is sequentially processed by the processing apparatus 11 through n processing apparatuses, and is delivered to another processing apparatus by the transport apparatus 9, and the substrate P is There are device manufacturing systems that can be wound up on a recovery roll. As such, the processing apparatus 11 may be configured as part of a device manufacturing system (flexible display manufacturing line).

  The exposure apparatus EX is a so-called scanning exposure apparatus, which synchronously drives the rotation of the cylindrical mask DM and the feeding of the flexible substrate P, and projects the image of the pattern formed on the cylindrical mask DM with the same magnification. The light beam is projected onto the substrate P via a double (× 1) projection optical system PL (PL1 to PL6). The exposure apparatus EX shown in FIG. 1 sets the Y axis of the XYZ orthogonal coordinate system in parallel with the rotation center line AX1 of the first drum member 21. Similarly, the exposure apparatus EX sets the Y axis of the XYZ orthogonal coordinate system parallel to the rotation center line AX2 of the second drum member 22 which is a rotating drum.

  As shown in FIG. 1, the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure apparatus EX rotationally moves the cylindrical mask DM held by the mask holding device 12 and conveys the substrate P by the conveying device 9. The illumination mechanism IU illuminates a part (illumination region IR) of the cylindrical mask DM held by the mask holding device 12 by the illumination light beam EL1 with uniform brightness. The projection optical system PL projects an image of a pattern in the illumination area IR on the cylindrical mask DM onto a portion (projection area PA) of the substrate P being transported by the transport device 9. With the movement of the cylindrical mask DM, the portion on the cylindrical mask DM arranged in the illumination region IR changes, and with the movement of the substrate P, the portion on the substrate P arranged in the projection region PA changes . Thus, an image of a predetermined pattern (mask pattern) on the cylindrical mask DM is projected onto the substrate P. The control device 14 controls each part of the exposure apparatus EX to cause each part to execute processing. Further, in the present embodiment, the control device 14 controls the transport device 9.

  The control device 14 may be part or all of a higher-level control device that collectively controls a plurality of processing devices of the device manufacturing system described above. Further, the control device 14 may be a device that is controlled by the host control device and is separate from the host control device. The controller 14 includes, for example, a computer system. The computer system includes, for example, a CPU and hardware such as various memories, an OS, and peripheral devices. The process of the operation of each part of the processing device 11 is stored in a computer readable recording medium in the form of a program, and the computer system reads and executes this program to perform various processes. The computer system also includes a home page providing environment (or display environment) when it can connect to the Internet or an intranet system. Further, the computer readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, a CD-ROM, and a storage device such as a hard disk built in a computer system. The computer-readable recording medium is one that holds a program dynamically for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line, in that case Such as volatile memory in a computer system that is a server or a client of the above, including one that holds a program for a certain period of time. Also, the program may be for realizing a part of the functions of the processing device 11, or may be one that can realize the functions of the processing device 11 in combination with a program already recorded in the computer system. The host control device can be realized using a computer system, similarly to the control device 14.

  As shown in FIG. 1, the mask holding device 12 includes a first drum member 21 for holding the cylindrical mask DM, a guide roller 23 for supporting the first drum member 21, and a first drive unit 26 according to a control command of the control device 14. A driving roller 24 for driving the first drum member 21 and a first detector 25 for detecting the position of the first drum member 21 are provided.

  The first drum member 21 is a cylindrical member having a curved surface curved at a constant radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) which is a predetermined axis, and rotates around the predetermined axis. . The first drum member 21 forms a first surface P1 on which the illumination region IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (generation line) around an axis (first central axis AX1) parallel to the line segment. The cylindrical surface is, for example, the outer peripheral surface of a cylinder, the outer peripheral surface of a cylinder, or the like. The first drum member 21 is made of, for example, glass, quartz or the like, and is in the shape of a cylinder having a constant thickness, and the outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. As described above, the first drum member 21 has a curved surface which is curved at a constant radius from the rotation center line AX1 which is a predetermined axis. Then, the first drum member 21 can be driven by the drive roller 24 and can rotate around a rotation center line AX1 which is a predetermined axis.

  The cylindrical mask DM is formed, for example, as a transmission-type flat sheet mask in which a pattern is formed by a light shielding layer such as chromium on one surface of a strip-like ultrathin glass plate (for example, 100 μm to 500 μm thick) with good flatness. Ru. The mask holding device 12 is used in a state in which the cylindrical mask DM is curved following the curved surface of the outer peripheral surface of the first drum member 21 and wound (adhered) around the curved surface. The cylindrical mask DM has an unpatterned area where no pattern is formed, and is attached to the first drum member 21 in the unpatterned area. The cylindrical mask DM is releasable with respect to the first drum member 21.

  The cylindrical mask DM is made of an extremely thin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of a transparent cylindrical base material. The mask pattern by the light shielding layer such as may be drawn and integrated. Also in this case, the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.

  The first detector 25 optically detects the rotational position of the first drum member 21 and is constituted of, for example, a rotary encoder or the like. The first detector 25 outputs information indicating the detected rotational position of the first drum member 21, for example, a two-phase signal from an encoder head described later, to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts torque and rotation speed for rotating the drive roller 24 in accordance with a control signal input from the control device 14. The control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result of the first detector 25. Then, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.

  The transport device 9 includes a drive roller DR4, a first guide member 31, and a second drum member 22 forming a second surface P2 on which the projection area PA on the substrate P is disposed, a second guide member 33, and drive rollers DR4 and DR5. , A second detector 35 and a second drive unit 36.

  In the present embodiment, the substrate P transported to the drive roller DR4 from the upstream of the transport path is transported to the first guide member 31 via the drive roller DR4. The substrate P having passed through the first guide member 31 is supported by the surface of a cylindrical or cylindrical second drum member 22 with a radius r 2, and is conveyed to the second guide member 33. The substrate P having passed through the second guide member 33 is transported to the downstream of the transport path. The rotation center line AX2 of the second drum member 22 and the rotation center lines of the drive rollers DR4 and DR5 are both set to be parallel to the Y axis.

  The first guide member 31 and the second guide member 33 adjust the tension or the like acting on the substrate P in the transport path by moving in the transport direction of the substrate P, for example. In addition, the first guide member 31 (and the drive roller DR4) and the second guide member 33 (and the drive roller DR5) are configured to be movable in the width direction (Y direction) of the substrate P, for example. The position or the like of the substrate P wound around the outer periphery of the drum member 22 in the Y direction can be adjusted. In addition, the conveyance apparatus 9 should just be able to convey the board | substrate P along the projection area | region PA of the projection optical system PL, and the structure of the conveyance apparatus 9 can be changed suitably.

  The second drum member 22 is a cylindrical member having a curved surface curved at a constant radius from a rotation center line AX2 (hereinafter, also referred to as a second center axis AX2) which is a predetermined axis, and rotates around the predetermined axis. It is a rotating drum. The second drum member 22 forms a second surface (supporting surface) p2 that supports a portion including the projection area PA on the substrate P on which the imaging light flux from the projection optical system PL is projected in an arc shape (cylindrical shape) Do. In the present embodiment, the second drum member 22 is a part of the transfer device 9 and also serves as a support member (substrate stage) for supporting the substrate P to be exposed. That is, the second drum member 22 may be a part of the exposure apparatus EX. Thus, the second drum member 22 is rotatable around its rotation center line AX2 (second center axis AX2), and the substrate P follows the outer peripheral surface (cylindrical surface) on the second drum member 22. And the projection area PA is disposed in a part of the curved portion.

  In the present embodiment, the second drum member 22 is rotated by the torque supplied from the second drive unit 36 including an actuator such as an electric motor. The second detector 35 is also configured by, for example, a rotary encoder, and optically detects the rotational position of the second drum member 22. The second detector 35 outputs information indicating the detected rotational position of the second drum member 22 (for example, two-phase signals from encoder heads EN1, EN2, EN3, EN4, and EN5 described later) to the control device 14 . The second drive unit 36 adjusts the torque for rotating the second drum member 22 in accordance with the control signal supplied from the control device 14. The control device 14 controls the rotational position of the second drum member 22 by controlling the second drive unit 36 based on the detection result of the second detector 35, and the first drum member 21 (cylindrical mask DM) and the like. The second drum member 22 is synchronously moved (synchronously rotated). The detailed configuration of the second detector 35 will be described later.

  The exposure apparatus EX of the present embodiment is an exposure apparatus on which it is assumed that a so-called multi-lens type projection optical system PL is mounted. The projection optical system PL includes a plurality of projection modules that project an image of a portion of the pattern of the cylindrical mask DM. For example, in FIG. 1, three projection modules (projection optical systems) PL1, PL3, and PL5 are disposed at constant intervals in the Y direction on the left side of the center plane P3, and three projection modules (projection System) PL2, PL4 and PL6 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the Y-direction end portions of the areas (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 are overlapped with each other by scanning to obtain a desired pattern. Project the whole picture. In such an exposure apparatus EX, even if the Y-direction size of the pattern on the cylindrical mask DM increases and the necessity of handling the substrate P having a large Y-direction width inevitably arises, the projection module PA and the projection module Since it is only necessary to add modules in the illumination mechanism IU corresponding to PA in the Y direction, there is an advantage that it can easily cope with the enlargement of the panel size (the width of the substrate P).

  The exposure apparatus EX may not be a multi-lens system. For example, when the size in the width direction of the substrate P is somewhat small, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. In addition, each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project patterns for a plurality of devices in parallel by a plurality of projection modules.

  The illumination mechanism IU of the present embodiment includes the light source device 13 and an illumination optical system. The illumination optical system includes a plurality (for example, six) of illumination modules IL aligned in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device includes, for example, a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). The illumination light emitted from the light source device is, for example, a bright line (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm) or the like. The illumination light emitted from the light source device is equalized in illuminance distribution, and is distributed to the plurality of illumination modules IL via a light guide member such as an optical fiber, for example.

  Each of the plurality of illumination modules IL includes a plurality of optical members such as a lens. In the present embodiment, light emitted from the light source device and passing through any of the plurality of illumination modules IL is referred to as an illumination light flux EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly's eye lens, and the like, and illuminates the illumination region IR with the illumination light beam EL1 of uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL are disposed inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination area IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

  FIG. 2 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. In FIG. 2, a plan view of the illumination area IR on the cylindrical mask DM disposed on the first drum member 21 as viewed from the −Z side (the left side in FIG. 2) and the second drum member 22 The top view (figure on the right side in FIG. 2) which looked at projection area PA on the board | substrate P arrange | positioned from the + Z side is shown in figure. The code | symbol Xs in FIG. 2 shows the rotation direction (movement direction) of the 1st drum member 21 or the 2nd drum member 22. As shown in FIG.

  The plurality of illumination modules IL respectively illuminate the first to sixth illumination areas IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination area IR1, and the second illumination module IL illuminates the second illumination area IR2.

  The first illumination area IR1 will be described as a trapezoidal area elongated in the Y direction, but in the case of a projection optical system having a configuration to form an intermediate image plane like the projection optical system (projection module) PL, the intermediate image Since a field stop plate having a trapezoidal opening can be disposed at the position of (1), it may be a rectangular area including the trapezoidal opening. The third illumination region IR3 and the fifth illumination region IR5 are regions of the same shape as the first illumination region IR1, respectively, and are arranged at constant intervals in the Y-axis direction. Further, the second illumination area IR2 is a trapezoidal (or rectangular) area symmetrical to the first illumination area IR1 with respect to the central plane P3. The fourth illumination region IR4 and the sixth illumination region IR6 are regions of the same shape as the second illumination region IR2, respectively, and are arranged at constant intervals in the Y-axis direction.

  As shown in FIG. 2, when viewed along the circumferential direction of the first surface P1, each of the first to sixth illumination regions IR1 to IR6 has a triangular portion of the oblique side of the trapezoidal illumination region adjacent to each other. It is arranged to overlap (to overlap). Therefore, for example, the first area A1 on the cylindrical mask DM passing the first illumination area IR1 by the rotation of the first drum member 21 passes the second illumination area IR2 by the rotation of the first drum member 21. It partially overlaps with the upper second area A2.

  In the present embodiment, the cylindrical mask DM includes a pattern formation area A3 in which a pattern is formed and a pattern non-formation area A4 in which a pattern is not formed. The non-pattern formation area A4 is disposed to surround the pattern formation area A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation area A3 of the cylindrical mask DM moves in the moving direction Xs as the first drum member 21 rotates, and each partial area in the Y axis direction of the pattern formation area A3 is the first to sixth illumination areas Pass one of IR1 to IR6. In other words, the first to sixth illumination areas IR1 to IR6 are arranged to cover the full width of the pattern formation area A3 in the Y-axis direction.

  As shown in FIG. 1, each of the plurality of projection modules PL1 to PL6 aligned in the Y-axis direction corresponds to each of the first to sixth illumination modules IL on a one-to-one basis, and is illuminated by the corresponding illumination modules An image of a partial pattern of the cylindrical mask DM appearing in the illumination area IR is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1 corresponds to the first illumination module IL, and the image of the pattern of the cylindrical mask DM in the first illumination area IR1 (see FIG. 2) illuminated by the first illumination module IL is displayed on the substrate P On the first projection area PA1 of the The third projection module PL3 and the fifth projection module PL5 correspond to the third to fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are disposed at positions overlapping with the first projection module PL1 when viewed from the Y-axis direction.

  Further, the second projection module PL2 corresponds to the second illumination module IL, and the image of the pattern of the cylindrical mask DM in the second illumination area IR2 (see FIG. 2) illuminated by the second illumination module IL is displayed on the substrate P. To the second projection area PA2 of When viewed in the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the central plane P3.

  The fourth projection module PL4 and the sixth projection module PL6 are respectively disposed in correspondence with the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arrange | positioned in the position which overlaps with 2nd projection module PL2.

  In the present embodiment, light reaching each of the illumination areas IR1 to IR6 on the cylindrical mask DM from the respective illumination modules IL of the illumination mechanism IU is referred to as an illumination luminous flux EL1. In addition, the light beams subjected to intensity distribution modulation according to the partial pattern of the cylindrical mask DM appearing in the respective illumination regions IR1 to IR6 and entering the respective projection modules PL1 to PL6 to reach the respective projection regions PA1 to PA6 It is assumed to be EL2. Then, among the imaging light beams EL2 reaching the projection areas PA1 to PA6, the chief ray passing through the center points of the projection areas PA1 to PA6 is the second central axis AX2 of the second drum member 22, as shown in FIG. As seen from the above, they are respectively disposed at positions (specific positions) at an angle θ in the circumferential direction across the center plane P3.

  As shown in FIG. 2, the image of the pattern in the first illumination area IR1 is projected on the first projection area PA1, the image of the pattern in the third illumination area IR3 is projected on the third projection area PA3, and the fifth illumination area The image of the pattern in IR5 is projected onto the fifth projection area PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

  The image of the pattern in the second illumination area IR2 is projected onto the second projection area PA2. In the present embodiment, the second projection area PA2 is disposed symmetrically to the first projection area PA1 with respect to the central plane P3 when viewed from the Y-axis direction. In addition, the image of the pattern in the fourth illumination region IR4 is projected to the fourth projection region PA4, and the image of the pattern in the sixth illumination region IR6 is projected to the sixth projection region PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

  When viewed along the circumferential direction of the second surface p2, each of the first to sixth projection regions PA1 to PA6 is a projection region (odd-numbered and even-numbered) adjacent in the direction parallel to the second central axis AX2 It arrange | positions so that the edge part (trapezoid triangle part) of each other may overlap. Therefore, for example, the third area A5 on the substrate P passing the first projection area PA1 by the rotation of the second drum member 22 is on the substrate P passing the second projection area PA2 by the rotation of the second drum member 22. It partially overlaps with the fourth area A6. The first projection area PA1 and the second projection area PA2 are arranged such that the exposure amount in the area where the third area A5 and the fourth area A6 overlap is substantially the same as the exposure amount in the non-overlapping area. The shape etc. are set. Thus, the first to sixth projection areas PA1 to PA6 are arranged to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

  Next, the detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second to fifth projection modules PL2 to PL5 has the same configuration as that of the first projection module PL1. Therefore, as a representative of the projection optical system PL, the configuration of the first projection module PL1 will be described, and the description of each of the second to fifth projection modules PL2 to PL5 will be omitted.

  In the first projection module PL1 shown in FIG. 3, the first optical system 41 for forming an image of the pattern of the cylindrical mask DM disposed in the first illumination region IR1 on the intermediate image plane P7 and the first optical system 41 are formed. A second optical system 42 for re-forming at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on an intermediate image plane P7 on which the intermediate image is formed .

  The first projection module PL1 further includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P. Further, the correction optical member 45 is a shift adjustment device that laterally shifts the projected image in the image plane. The magnification correction optical member 47 is a shift adjustment device that slightly corrects the magnification of the projected image. The rotation correction mechanism 46 is a shift adjustment device that slightly rotates the projected image in the image plane.

  The imaging light beam EL2 from the pattern of the cylindrical mask DM is emitted from the first illumination region IR1 in the normal direction (D1), passes through the focus correction optical member 44, and is incident on the image shift correction optical member 45. The imaging light beam EL 2 transmitted through the image shift correction optical member 45 is reflected by the first reflection surface (plane mirror) p 4 of the first deflection member 50 which is an element of the first optical system 41, and passes through the first lens group 51. The light is reflected by the first concave mirror 52, passes through the first lens group 51 again, is reflected by the second reflecting surface (plane mirror) p 5 of the first deflection member 50, and enters the first field stop 43. The imaging light beam EL2 having passed through the first field stop 43 is reflected by the third reflection surface (plane mirror) p8 of the second deflection member 57 which is an element of the second optical system 42, and passes through the second lens group 58 The light is reflected by the second concave mirror 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflection member 57, and enters the magnification correction optical member 47. The image forming light beam EL2 emitted from the magnification correction optical member 47 is incident on the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination area IR1 is equal-magnified in the first projection area PA1 (× Projected in 1).

  When the radius of the cylindrical mask DM shown in FIG. 1 is radius r1 and the radius of the cylindrical surface of the substrate P wound around the second drum member 22 is radius r2, the radius r1 and the radius r2 are equal, each projection module The chief ray of the imaging light beam EL2 on the mask side of PL1 to PL6 is inclined to pass through the central axis AX1 of the cylindrical mask DM, but the inclination angle is the inclination angle θ of the chief ray of the imaging light EL2 on the substrate side This is the same as (± θ with respect to the central plane P3).

  The angle θ3 formed by the third reflection surface p8 of the second deflection member 57 with the second optical axis AX4 is substantially the same as the angle θ2 formed by the second reflection surface p5 of the first deflection member 50 with the first optical axis AX3. is there. Further, an angle θ4 formed by the fourth reflective surface p9 of the second deflection member 57 with the second optical axis AX4 is substantially equal to an angle θ1 formed by the first reflective surface p4 of the first deflection member 50 with the first optical axis AX3. It is the same. In order to give the above-mentioned inclination angle θ, the angle θ1 with respect to the optical axis AX3 of the first reflection surface p4 of the first deflection member 50 shown in FIG. The angle θ4 of the reflecting surface p9 with respect to the optical axis AX4 is smaller than 45 ° by Δθ4. Δθ1 and Δθ4 are set to the relationship of Δθ1 = Δθ4 = θ / 2 with respect to the angle θ shown in FIG.

  FIG. 4 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view for explaining the relationship between a detection probe and a reader applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. In FIG. 4, for convenience, only the second to fourth projection areas PA2 to PA4 are illustrated, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not illustrated.

  The second detector 35 shown in FIG. 1 optically detects the rotational position of the second drum member 22. The second detector 35 has a scale disk (scale member) SD with high roundness and an encoder head as a reader. Includes EN1, EN2, EN3, EN4, EN5.

  The scale disc SD is fixed to the end of the second drum member 22 so as to be orthogonal to the rotation axis ST. For this reason, the scale disc SD rotates integrally with the rotation axis ST around the rotation center line AX2. A scale portion GP is engraved on the outer peripheral surface of the scale disk SD. In the scale portion GP, along the circumferential direction in which the second drum member 22 rotates, grid-like graduations are arranged annularly at, for example, a 20 μm pitch, and the rotation axis ST (second central axis AX2) together with the second drum member 22 Rotate around The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP when viewed from the rotation axis ST (the second central axis AX2). The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed to face the scale part GP, project a laser beam (diameter of about 1 mm) onto the scale part GP, and photoelectrically detect reflected diffraction light from the grid-like scale. Thus, for example, a circumferential positional change of the scale portion GP can be read without contact at a resolution of about 0.1 μm. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second drum member 22.

  The encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement of the scale part GP in the tangential direction (in the XZ plane). As shown in FIG. 4, the installation orientations of the encoder heads EN1, EN2, EN3, EN4 and EN5 (the angular orientation in the XZ plane around the rotation center line AX2) are installation orientations Le1, Le2, Le3, Le4 and In the case of representing by Le5, as shown in FIG. 6, the encoder heads EN1 and EN2 are disposed such that the installation azimuth lines Le1 and Le2 are at an angle ± θ ° with respect to the central plane P3. In the present embodiment, the angle θ is 15 °. The installation azimuth lines Le1 to Le5 pass through the projection position on the scale part GP of the laser beam (diameter of about 1 mm) projected from the encoder heads EN1 to EN5.

  The projection modules PL1 to PL6 illustrated in FIG. 3 are processing units of the exposure apparatus EX that performs an irradiation process of irradiating the substrate P with light by using the substrate P as an object to be processed. In the exposure apparatus EX, chief rays of two imaging light beams EL2 enter the substrate P with respect to the substrate P. The projection modules PL1, PL3, PL5 are the first processing units, the projection modules PL2, PL4, PL6 are the second processing units, and principal rays of two imaging light beams EL2 enter the substrate P with respect to the substrate P The position is a specific position at which the substrate P is irradiated with light. The specific position is a position of an angle ± θ in the circumferential direction across the central plane P3 on the curved substrate P on the second drum member 22 as viewed from the second central axis AX2 of the second drum member 22. The installation azimuth line Le1 of the encoder head EN1 has one inclination angle θ with respect to the central plane P3 of the chief ray passing through the central points of the projection areas (projection fields) PA1, PA3 and PA5 of the odd-numbered projection modules PL1, PL3 and PL5. The installation azimuth line Le2 of the head EN2 has an inclination angle θ with respect to the central plane P3 of the chief ray passing through the central points of the projection areas (projection fields) PA2, PA4 and PA6 of the even-numbered projection modules PL2, PL4 and PL6. Match. For this reason, the encoder heads EN1 and EN2 serve as a reading device for reading the scale portion GP located in the direction connecting the specific position and the second central axis AX2.

  As shown in FIG. 6, the encoder head EN4 is disposed on the upstream side in the feeding direction of the substrate P, that is, on the near side of the exposure position (projection area). The installation azimuth Le1 is set on the installation azimuth Le4 rotated approximately 90 ° around the axis of the rotation center line AX2. Further, the encoder head EN5 is set on the installation azimuth line Le5 rotated about 90 ° around the axis of the rotation center line AX2 of the installation azimuth line Le2 of the encoder head EN2 toward the upstream side in the feed direction of the substrate P.

  From the above, for example, the measurement direction of the scale part GP by the encoder head EN4 is a direction parallel to the installation azimuth line Le1, that is, the direction of the imaging light beam EL2 chief ray from the odd numbered projection modules PL1, PL3 and PL5. It is also a variation of the focus direction of the substrate P with respect to the best imaging plane of the projection modules PL1, PL3, PL5. Therefore, the measured value of the encoder head EN4 slightly moves the scale disk SD in a direction parallel to the installation azimuth Le1 as a whole due to axial deviation, eccentricity, backlash, etc. of the rotation center axis AX2 (second drum member 22). Ingredients are included. The amount of the fine movement component is mainly attributed to mechanical processing accuracy and assembly accuracy, and is estimated to be about ± several μm to dozens of μm. Therefore, assuming that the fine movement component of the scale disk SD (second drum member 22) in the direction parallel to the installation azimuth Le1 is measured by the encoder head EN4 within an error range of ± 10%, the installation azimuth Le4 of the encoder head EN4 The angle formed by the installation azimuth line Le1 may be set in the range of 90 ° ± γ, where the range of the angle γ is 0 ° ≦ γ ≦ 5.8 °. That is, in this embodiment, about 90 degrees means the range of 84.2 degrees-95.8 degrees. By setting in this range, when the directions of the installation azimuth lines Le4 and Le5 on which the encoder heads EN4 and EN5 for reading the scale part GP are disposed are viewed from within the XZ plane and the rotation center line AX2, The range is substantially orthogonal to the direction in which the chief ray of the imaging light beam EL2 is incident on the specific position of the substrate P.

  Therefore, even if the second drum member 22 is shifted in the Z direction by a slight rattle (about 2 μm to 3 μm) of a bearing that supports the rotation shaft ST, this shift occurs in the projection areas PA1 to PA6 due to this shift. It becomes possible to measure the position error (focus fluctuation) in the direction along the imaging light beam EL2 to be obtained with high accuracy by the encoder heads EN1 and EN2.

  Further, the encoder head EN3 rotates the installation azimuth line Le2 of the encoder head EN2 approximately 120 ° around the axis of the rotation center line AX2, and the installation azimuth line Le4 of the encoder head EN4 approximately 120 around the axis of the rotation center line AX2. The set orientation line Le3 is set. Here also, approximately 120 ° means 120 ° ± γ, where the angle γ is in the range of 0 ° ≦ γ ≦ 5.8 °.

  The scale disk SD, which is a scale member, uses a low thermal expansion metal, glass, ceramic or the like as a base material, and is made as large as possible in diameter (for example, 20 cm or more in diameter) in order to improve measurement resolution. In FIG. 4, the diameter of the scale disk SD is illustrated to be smaller than the diameter of the second drum member 22, but among the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface on which the substrate P is wound and the scale By making the diameters of the scale portion GP of the disk SD uniform (substantially equal), it is possible to further reduce the so-called measurement Abbe error. Strictly speaking, the sum of the radius of the outer peripheral surface of the second drum member 22 and the thickness of the substrate P (for example, 100 μm) is set to coincide with the radius of the scale portion GP of the scale disc SD. good.

  The minimum pitch of the scale (grating) inscribed in the circumferential direction of the scale portion GP is limited by the performance of a scale marking device or the like for processing the scale disk SD. Therefore, if the diameter of the scale disk SD is increased, the angle measurement resolution corresponding to the minimum pitch can be increased accordingly.

  The principal ray of the imaging light beam EL2 enters the substrate P with respect to the substrate P when the directions of the installation azimuth lines Le1 and Le2 in which the encoder heads EN1 and EN2 reading the scale part GP are arranged are viewed from the rotation center line AX2. For example, even if the second drum member 22 is shifted in the X direction by a slight backlash (about 2 .mu.m to 3 .mu.m) of a bearing that supports the rotation shaft ST, projection is performed by this shift. It is possible to measure with high accuracy the encoder head EN1 or EN2 for a positional error in the feed direction (Xs) of the substrate P that may occur in the areas PA1 to PA6.

  As shown in FIG. 5, the image of the portion of the mask pattern projected by the projection optical system PL shown in FIG. 1 is relative to the substrate P on the portion of the substrate P supported by the curved surface of the second drum member 22. Alignment microscopes AMG1 and AMG2 for detecting alignment marks and the like formed in advance on the substrate P are provided for alignment (alignment). The alignment microscopes AMG1 and AMG2 have a detection probe for detecting a specific pattern formed discretely or continuously on the substrate P, and a detection region by the detection probe is in the feeding direction of the substrate P more than the above-described specific position. The pattern detection device is disposed around the second drum member 22 so as to be set to the rear side (upstream side).

  As shown in FIG. 5, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 are detection probes at both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks formed near both ends of the substrate P. The alignment microscopes AMG1 and AMG2 are detection probes other than both ends of the second drum member 22 in the Y-axis direction (the width direction of the substrate P), and for example, a plurality of them are formed on the substrate P along the longitudinal direction. It is possible to observe or detect an alignment mark formed in a margin or the like between the pattern formation areas of the display panel.

  As shown in FIG. 5 and FIG. 6, when viewed from the rotation center line AX2 in the XZ plane, it is the same as the detection center of the observation direction AM1 (toward the second center axis AX2) of the observation direction of the substrate P by the alignment microscope AMG1. Thus, the encoder head EN4 is disposed on the installation azimuth line Le4 set in the radial direction of the scale portion GP. In addition, when viewed from the rotation center line AX2 in the XZ plane, the radial direction of the scale portion GP is in the same direction as the detection center of the observation direction AM2 of the substrate P by the alignment microscope AMG2 (toward the rotation center line AX2). The encoder head EN5 is disposed on each of the installation azimuth lines Le5 set to. Thus, the detection probes of the alignment microscopes AMG1 and AMG2 are disposed around the second drum member 22 when viewed from the second central axis AX2, and connect the position at which the encoder heads EN4 and EN5 are disposed and the second central axis AX2. The directions (installation orientation lines Le4 and Le5) are arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. The positions of the alignment microscopes AMG1 and AMG2 and the encoder heads EN4 and EN5 around the rotation center line AX2 are the sheet entry area IA where the substrate P starts to contact the second drum member 22 and the second drum member 22. And the sheet release area OA from which the substrate P is released.

  The alignment microscopes AMG1 and AMG2 are arranged in front of the exposure position (projection area PA), and are formed in the vicinity of the end of the substrate P in the Y direction (in an area within several tens μm to several hundreds μm square). Image formation is performed by the image pickup device or the like at high speed in a state where the substrate P is sent at a predetermined speed, and the image of the mark is sampled at high speed in the microscopic field (image pickup range). By storing the rotational angular position of the scale disc SD sequentially measured by the encoder head EN4 (or EN5) at the moment when the sampling is performed, the mark position on the substrate P and the rotational angular position of the second drum member 22 The correspondence relationship with is required.

  When a mark detected by the alignment microscope AMG1 is detected by the alignment microscope AMG2, a difference value between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is previously obtained. It compares with the reference value corresponding to the opening angle of the installation direction lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2 which are precisely calibrated. As a result, when there is a difference between the difference value and the reference value, the substrate P is slightly slipped on the second drum member 22 between the sheet entry area IA and the sheet separation area OA, or the feed direction (Circumferential direction) may expand and contract.

  In general, the positional error at the time of patterning is determined according to the fineness and the superposition accuracy of the device pattern formed on the substrate P. For example, a linear pattern of 10 μm width is accurately overlapped on the underlying pattern layer For combined exposure, only an error of a fraction or less, that is, a position error of about ± 2 μm in terms of the dimension on the substrate P is permitted.

  In order to realize such high-accuracy measurement, the measurement direction of the mark image by each alignment microscope AMG1 and AMG2 (the tangential direction of the second drum member 22 in the XZ plane) and the encoder heads EN4 and EN5 It is necessary to align the measurement direction (the tangential direction of the outer periphery of the scale portion GP in the XZ plane) within the allowable angular error.

  As described above, the encoder heads EN4 and EN5 are arranged to coincide with the measurement direction of the alignment marks on the substrate P by the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second drum member 22). . Therefore, at the time of position detection of the substrate P (mark) by the alignment microscopes AMG1 and AMG2 (during image sampling), the second drum member 22 (scale disk SD) is orthogonal to the installation azimuth Le4 or Le5 in the XZ plane. Even in the case of shifting in the circumferential direction (tangential direction), highly accurate position measurement can be performed in consideration of the shift of the second drum member 22.

  The encoder heads EN1 to EN5 are arranged at five positions around the scale portion GP of the scale disc SD when viewed from the second central axis AX2. Therefore, output of measurement values by two or three appropriate encoder heads among them It is also possible to obtain the roundness (shape distortion), eccentricity error, and the like of the scale portion GP of the scale disk SD by performing arithmetic processing by combining the above. In the following, the case where the positional deviation in the specific direction in the XZ plane of the rotating drum (the second drum member 22) is determined by arithmetic processing by combining the outputs of the measured values by two or three encoder heads is shown in FIG. It demonstrates using 8 and FIG.

<First operation processing example>
FIG. 7 is an explanatory view for explaining the positional deviation of the rotating drum (the second drum member 22) by viewing the scale disc SD according to the first embodiment in the direction of the rotation center line AX2. FIG. 8 is an explanatory view for explaining an example of calculating the positional deviation of the rotary drum by viewing the scale disc SD according to the first embodiment in the direction of the rotation center line AX2. FIG. 9 is a flowchart showing an example of a procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment.

  As shown in FIG. 7, the second drum member 22 shifts together with the scale disc SD due to, for example, a slight play of a bearing that supports the rotation shaft ST, and the solid line in FIG. It is shifted to the position shown by. The position AX2 'of the rotation axis ST of the second drum member 22 is moved from the rotation center line AX2 (second center axis AX2). For example, the encoder head EN1 reads the position PX1 of the scale portion GP located in the direction connecting the specific position and the second central axis AX2 before the scale disk SD shifts. When the scale disk SD shifts from the position shown by the dotted line to the position shown by the solid line in FIG. 7, the position PX1 of the scale part GP moves to the position TX1 of the scale part GP, as shown in FIG.

  Then, after the scale disc SD is shifted, the encoder head EN1 reads the position QX1 of the scale portion GP located in the direction connecting the above-described specific position and the second central axis AX2. Therefore, in the XZ plane, a displacement component Δqx1 is generated which is displaced in the direction connecting the rotation center line AX2 of the second drum member 22 and the position QX1 of the scale part GP. The displacement when moving from the rotation center line AX2 (the second center axis AX2) to the position AX2 'of the rotation axis ST of the second drum member 22 is the position of the rotation center line AX2 of the second drum member 22 and the scale part GP Assuming that the angle formed between QX1 and QX1 is displacement angle α, displacement component Δqx1 moves from rotation center line AX2 (second center axis AX2) to position AX2 ′ of rotation axis ST of second drum member 22. It is the displacement which multiplied cos alpha to the displacement at the time of doing.

  For example, when the first reading device is an encoder head EN4 and the second reading device is an encoder head EN1, as shown in FIG. 9, the control device 14 of the exposure device EX is an encoder head EN4 and an encoder head EN1 in rotational position. The measurement is performed (step S11), and the encoder head EN4 stores the output of the measurement value of the encoder head EN1 (read output of the scale unit GP).

  The encoder head EN4 and the encoder head EN1 can measure variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. The encoder head EN4 shown in FIG. 7 is shifted from the position shown by the dotted line to the position shown by the solid line in FIG. 7, so the encoder head EN4 is not the position PX4 of the scale part GP but the scale part GP. Read position QX4 of. Therefore, the angle between the tangential direction veq4 at the position PX4 of the scale part GP and the tangential direction veq4 at the position QX4 of the scale part GP also produces the displacement angle of the angle α described above. As a result, a change occurs in the peripheral speed read by the encoder head EN4 which is the first reader.

  For example, if there is no difference between the peripheral speed read by the encoder head EN1 and the peripheral speed read by the encoder head EN4, as shown in FIG. 9, the control device 14 rotates as no change in peripheral speed (No in step S12). Step S11 of position measurement is continued. If there is a difference between the peripheral speed read by the encoder head EN1 and the peripheral speed read by the encoder head EN4, the process proceeds to step S13, assuming that there is a change in peripheral speed (step S12, Yes).

  The control device 14 of the exposure apparatus EX calculates the correction value based on the read output of the encoder head EN4, which is the first reading device (step S13). Direction in which the chief ray of the imaging light beam EL2 is incident on a specific position of the substrate P with respect to the substrate P when the direction of the installation azimuth line Le4 in which the encoder head EN4 is arranged is viewed in the XZ plane and from the rotation center line AX2. It is almost orthogonal to Therefore, the change in the reading output of the encoder head EN4 has a certain relationship with the change in the direction along the chief ray of the imaging light beam EL2 projected from each of the odd-numbered projection modules PL1, PL3, PL5 become.

  For example, the control device 14 stores, in the storage unit, a database in which the change in the reading output of the encoder head EN4 is associated with the above-described displacement angle α. Then, the control device 14 supplies the input of the reading output of the encoder head EN4 which is the first reading device to the database stored in the storage unit of the control device 14, and calculates the displacement angle α. The controller 14 calculates the displacement component Δqx1 from the calculated displacement angle α, and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  The controller 14 of the exposure apparatus EX performs a correction process according to the correction value calculated in step S13 (step S14). For example, the control device 14 of the exposure apparatus EX operates the focus correction optical member 44 shown in FIG. 3 as a focus adjustment device, and the projection image formed on the substrate P by the odd numbered projection modules PL1, PL3, PL5 Fine-tune the focus state of the. Therefore, the exposure apparatus EX can perform exposure processing on the substrate P with high accuracy.

  Similarly, when the first reading device is the encoder head EN5 and the second reading device is the encoder head EN2, as shown in FIG. 9, the control device 14 of the exposure device EX uses the encoder head EN5 and the encoder head EN2. The rotational position is measured (step S11), and the encoder head EN5 and the output of the measurement value of the encoder head EN2 (read output of the scale unit GP) are stored.

  For example, the encoder head EN2 reads the position PX2 of the scale portion GP located in the direction connecting the specific position and the second central axis AX2 before the scale disk SD shifts. Then, after the scale disc SD is shifted, the encoder head EN2 reads the position QX2 of the scale portion GP located in the direction connecting the above-described specific position and the second central axis AX2. The position PX2 of the scale part GP and the position QX2 of the kale part GP are parallel to the installation azimuth line Le2 and in a direction along the imaging light beam EL2 projected from each of the even-numbered projection modules PL2, PL4, PL6. The positions are substantially the same as shown in FIG.

  As shown in FIG. 7, since the scale disk SD is shifted from the position shown by the dotted line to the position shown by the solid line in FIG. 7, the encoder head EN5 is not the position PX5 of the scale part GP but the position of the scale part GP. Read QX5. However, the tangential direction veq5 at the position PX5 of the scale part GP and the tangential direction veq5 'at the position PX5 of the scale part GP are substantially parallel. As a result, no change occurs in the peripheral speed read by the encoder head EN4 which is the first reader. The control device 14 continues the step S11 of rotational position measurement with no change in circumferential speed (step S12, No).

  As described above, when the two encoder heads are arranged at an interval of approximately 90 ° around the scale part GP, two-dimensional fine movement of the scale disk SD (scale part GP) in the XZ plane can be measured. In the case of FIG. 7, the two-dimensional fine movement is, for example, a direction (generally Z direction) in which the installation azimuth Le2 of the encoder head EN2 extends and a direction (general X) in which the installation azimuth Le5 of the encoder head EN5 extends. In two directions. Therefore, when the rotary drum (the second drum member 22) is decentered in the direction in which the installation azimuth Le5 extends, the fine movement component of the scale disc SD (scale portion GP) due to the eccentricity can be measured by the encoder head EN2.

  However, since the encoder head EN2 also measures the circumferential displacement of the scale portion GP due to the rotation of the scale disc SD at the position of the installation azimuth line Le2, from the measurement reading of the encoder head EN2 alone, the scale disc SD is In some cases, the fine movement component due to eccentricity and the position displacement component due to rotation can not be distinguished well. In such a case, there is also a method in which the number of encoder heads is further increased and the fine movement component due to the eccentricity of the scale part GP and the position displacement component due to rotation are strictly discriminated and measured. The method will be described later.

  As described above, the exposure apparatus EX is a first reading that reads the second drum member 22 which is a cylindrical member, the scale part GP, the projection modules PL1 to PL6 which are processing parts of the exposure apparatus EX, and the scale part GP. The encoder heads EN4 and EN5, which are devices, and the encoder heads EN1 and EN2, which are second reading devices that read the scale part GP.

  The second drum member 22 has a curved surface curved at a constant radius from a second central axis AX2 which is a predetermined axis, and rotates around the second central axis AX2. The scale portion GP is annularly arranged along the circumferential direction in which the second drum member 22 rotates, and rotates with the second drum member 22 around the second central axis AX2. The projection modules PL1 to PL6, which are processing units of the exposure apparatus EX, are substrates disposed around the second drum member 22 as viewed from the second central axis AX2 and having a curved surface at a specific position in the circumferential direction of the second drum member 22. An irradiation process is performed to irradiate chief rays of two imaging light beams EL2 to P (object to be processed). The encoder heads EN4 and EN5 are disposed around the scale part GP when viewed from the second central axis AX2, and the aforementioned specific position is approximately 90 degrees around the second central axis AX2 with the second central axis AX2 as the center. It is placed at the rotated position and reads the scale part GP. The encoder heads EN1 and EN2 read the scale part GP at the specific position described above. Then, the exposure apparatus EX performs a first displacement when the projection modules PL1 to PL6, which are processing units, move in a direction orthogonal to the second central axis AX2 on which the second central axis AX2 of the second drum member 22 moves. The processing corrected by the reading output of the encoder heads EN4 and EN5 which are reading devices is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

<Second operation processing example>
FIG. 10 is a flowchart showing another example of the procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. For example, when the first reader is the encoder head EN4, the second reader is the encoder head EN1, and the third reader is the encoder head EN3, as shown in FIG. 9, the controller 14 of the exposure apparatus EX is an encoder head. Measure the rotational position with EN4, encoder head EN1 and encoder head EN3 (step S21), and output the measured values of encoder head EN4, encoder head EN1 and encoder head EN3 (read output of scale part GP) at an appropriate time It stores simultaneously every interval (for example, several milliseconds).

  The encoder head EN4, the encoder head EN1, and the encoder head EN3 can measure variation in displacement in the tangential direction (in the XZ plane) of the scale part GP. The control device 14 moves the rotation axis ST of the second drum member 22 from the rotation center line AX2 (the second center axis AX2) based on the read output (stored value) of the encoder head EN4, the encoder head EN1, and the encoder head EN3. A relative position to be calculated, for example, a position AX2 'of the rotation axis ST of the second drum member 22 shown in FIG. 7 is calculated (step S22). For example, when there is no axis deviation of a distance exceeding a predetermined threshold between the rotation center line AX2 and the position AX2 'of the rotation axis ST of the second drum member 22 (No in step S23), the control device 14 The measurement step S21 is continued. For example, when there is an axial deviation of a distance exceeding a predetermined threshold between the rotation center line AX2 and the position AX2 ′ of the rotation axis ST of the second drum member 22 (Yes in step S23), the control device 14 performs processing. Proceed to step S24. The threshold value is determined in advance based on the accuracy required in the exposure processing of the exposure apparatus EX, and stored in the storage unit of the control device 14.

  Next, the control device 14 of the exposure apparatus EX calculates a correction value based on the read output of the encoder head EN4 (step S24). The direction of the installation azimuth line Le4 in which the encoder head EN4 for reading the scale part GP is disposed is projected onto the substrate P from each of the odd-numbered projection modules PL1, PL3, PL5 when viewed from the rotation center line AX2 in the XZ plane. It is substantially orthogonal to the direction of the chief ray of the imaging light beam EL2. Therefore, the change in the reading output of the encoder head EN4 has a certain relationship with the change in the direction along the chief ray of the imaging light beam EL2 projected from each of the odd-numbered projection modules PL1, PL3, PL5 become.

  For example, the control device 14 stores, in the storage unit, a database in which the change in the reading output of the encoder head EN4 is associated with the above-described displacement angle α. Then, the control device 14 supplies the input of the reading output of the encoder head EN4 which is the first reading device to the database stored in the storage unit of the control device 14, and calculates the displacement angle α. The control device 14 can calculate the displacement component Δqx1 shown in FIG. 8 from the angle α, the position AX2 ′ calculated in step S22, and the rotation center line AX2 (second center axis AX2). The controller 14 calculates the displacement component Δqx1 and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  Further, the control device 14 can calculate the displacement component Δqx4 shown in FIG. 8 from the angle α, the position AX2 ′ calculated in step S22, and the rotation center line AX2. The displacement component Δqx4 is a component displaced in a direction orthogonal to the direction connecting the rotation center line AX2 of the second drum member 22 and the position QX1 of the scale part GP in the XZ plane. Therefore, the displacement component Δqx4 is a displacement obtained by multiplying sin α by the displacement when moving from the rotation center line AX2 (the second center axis AX2) to the position AX2 ′ of the rotation axis ST of the second drum member 22. . Then, the control device 14 calculates the displacement component Δqx1, and calculates a correction value for correcting to shift the projection image according to the displacement component Δqx4. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  The controller 14 of the exposure apparatus EX performs correction processing in accordance with the correction value calculated in step S24 (step S25). For example, the control device 14 of the exposure apparatus EX operates the focus correction optical member 44 shown in FIG. 3, which is a focus adjustment device, to focus the projection image formed on the substrate P so as to offset the displacement component Δqx1. Fine tune the condition. Therefore, the exposure apparatus EX can perform exposure processing on the substrate P with high accuracy.

  For example, the control device 14 of the exposure apparatus EX is a shift adjustment device, which finely corrects the magnification of the projected image, the image shift correction optical member 45 for laterally shifting the projected image shown in FIG. At least one of the magnification correction optical member 47 and the rotation correction mechanism 46 for slightly rotating the projection image in the image plane is operated, and the projection image formed on the substrate P so as to offset the displacement component Δqx4 Shift. Therefore, the exposure apparatus EX can perform exposure processing on the substrate P with high accuracy. Alternatively, as the shift adjustment device, the control device 14 adjusts the drive of the cylindrical mask DM, the drive of the second drum member 22, or the tension application to the substrate P, and performs precise feedback control or feed forward control to perform displacement. The projected image formed on the substrate P may be shifted so as to offset the component Δqx4.

  As described above, in the present embodiment, the installation azimuth lines Le1 and Le2 of the encoder heads EN1 and EN2 disposed around the scale portion GP of the scale disk SD are on the substrate P when viewed from the rotation center line AX2. When the second drum member 22 is slightly shifted in the scanning exposure direction (feed direction) of the substrate P because the inclination direction of the chief ray of the imaging light beam EL2 toward the projection area PA is the same (or coincident) However, the amount of shift can be measured in real time by the encoder heads EN1 and EN2, and the amount of fluctuation of the exposure position due to the shift can be measured with high accuracy by, for example, the image shift correction optical member 45 in the projection optical system PL. And it becomes possible to correct at high speed. As a result, exposure processing can be performed on the substrate P with high positional accuracy.

  As described above, the exposure apparatus EX is a first reading that reads the second drum member 22 which is a cylindrical member, the scale part GP, the projection modules PL1 to PL6 which are processing parts of the exposure apparatus EX, and the scale part GP. The encoder heads EN4 and EN5 which are devices, the encoder heads EN1 and EN2 which are second reading devices for reading the scale part GP, and the first reading device and the second reading device are arranged at different positions in the circumferential direction. A third reader for reading the GP, such as an encoder head EN3, is provided.

  The encoder heads EN4 and EN5 are disposed around the scale part GP when viewed from the second central axis AX2, and rotated the above-mentioned specific position about the second central axis AX2 by about 90 degrees around the second central axis AX2. It is placed at the position and reads the scale part GP. The encoder heads EN1 and EN2 read the scale part GP at the specific position described above. The exposure apparatus EX uses the encoder heads EN4 and EN5 as the first reader, the encoder heads EN1 and EN2 as the second reader, and the read output of the scale unit GP measured by the encoder head EN3 as the third reader. The second central axis AX2 of the two drum members 22 is determined. The projection modules PL1 to PL6, which are processing units, are a first reading device for displacement when moving the second central axis AX2 of the second drum member 22 in the direction orthogonal to the second central axis AX2. Processing corrected with the read output of the encoder heads EN4 and EN5 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  Also, by comparing the outputs of measured values by encoder heads EN4, EN1 and EN3 with the outputs of measured values by encoder heads EN5, EN2 and EN3, the influence of eccentricity error of scale disc SD with respect to rotation axis ST can be suppressed. , High precision measurement is possible.

  The third reader is not limited to the encoder head EN3. When the first reader is the encoder head EN4 and the second reader is the encoder head EN1, the third reader includes the encoder head EN5 or the encoder head EN2. It may be As described above, in the exposure apparatus EX, the two imaging light beams EL2 enter the substrate P with respect to the substrate P. The odd-numbered projection modules PL1, PL3, and PL5 are first processing units, and the even-numbered projection modules PL2, PL4, and PL6 are second processing units. A specific position (first specific position) at which the first processing unit applies an irradiation process of irradiating the substrate P with light at two positions where the chief rays of the two imaging light beams EL2 enter the substrate P with respect to the substrate P The second processing unit is set as a second specific position to be subjected to an irradiation process of irradiating light. The encoder head EN1 which is a second reader reads the scale portion GP at a specific position (first specific position), and the encoder head EN2 reads the scale portion GP at a second specific position. The encoder head EN5, which is a third reader, is disposed at a position obtained by rotating the direction connecting the above-described second specific position and the second central axis AX2 by about 90 degrees about the second central axis AX2 Read the part GP.

  The exposure apparatus EX uses the encoder head EN4 as a first reader, the encoder head EN1 as a second reader, and the encoder head EN5 as a third reader from the read output of the scale part GP measured by the second drum member 22. The second central axis AX2 of Then, the projection modules PL2, PL4, PL6, which are the second processing units, perform the first displacement when moving the second central axis AX2 of the second drum member 22 in the direction orthogonal to the second central axis AX2. It is possible to perform processing corrected by the reading output of the encoder heads EN4 and EN5 which are reading devices. As described above, even if there are a plurality of processing units, such as a first processing unit and a second processing unit, the first processing unit and the second processing unit can process each processing with high accuracy.

  When measuring the position and rotational speed of the second drum member 22 in the rotational direction, for example, the average (simple average or weighted average) value of the output of the measurement signal from the encoder heads EN1, EN2, EN3, EN4 and EN5 The error is reduced and stable detection is possible. Therefore, when the control unit 14 controls the second drive unit 36 in the servo mode, the rotational position of the second drum member 22 can be controlled more precisely. Furthermore, the rotational position of the first drum member 21 via the first drive unit 26 based on the measurement signal corresponding to the rotational position and rotational speed of the first drum member 21 (cylindrical mask DM) detected by the first detector 25. Also when servo controlling the speed, the first drum member 21 and the second drum member 22 can be synchronously moved (synchronously rotated) with high accuracy.

Modification of First Embodiment
FIG. 11 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the modification of the first embodiment is viewed in the direction of the rotation center line AX2. The observation direction AM2 of the alignment microscope AMG2 described above is disposed on the rear side in the feed direction of the substrate P, that is, on the front side (upstream side) of the exposure position (projection area). An image of the alignment mark (formed in a region of several tens of μm to several hundreds of μm square) is detected at high speed by an image pickup element or the like in a state where the substrate P is sent at a predetermined speed. The image of the mark is sampled at high speed in the imaging range). The correspondence between the mark position on the substrate P and the rotational angle position of the second drum member 22 by storing the rotational angle position of the scale disc SD sequentially measured by the encoder head EN5 at the moment when the sampling is performed. Is required.

  On the other hand, the observation direction AM1 of the alignment microscope AMG1 described above is disposed on the front side in the feeding direction of the substrate P, that is, on the rear side (downstream side) of the exposure position (projection area) The image of the alignment mark (formed in a region of several tens of .mu.m to several hundreds of .mu.m) is sampled at high speed by an image pickup element or the like as in the alignment microscope AMG2, and the encoder head EN4 is sampled at the moment of sampling. The correspondence between the mark position on the substrate P and the rotational angle position of the second drum member 22 is determined by storing the rotational angle position of the scale disc SD sequentially measured by the above.

  The encoder head EN4 is set on the installation direction line Le4 rotated approximately 90 ° around the axis of the rotation center line AX2 of the installation direction line Le1 of the encoder head EN1 toward the front side in the feed direction of the substrate P. Further, the encoder head EN5 is set on the installation azimuth line Le5 rotated approximately 90 ° around the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P of the encoder head EN2.

  The encoder head EN3 is disposed on the opposite side of the encoder heads EN1 and EN2 across the rotation center line AX2, and the installation azimuth line Le3 is set on the center plane P3.

  As shown in FIG. 11, when viewed from the rotation center line AX2 in the XZ plane, it is in the same direction as the observation direction AM1 (toward the rotation center line AX2) passing through the detection center on the substrate P by the alignment microscope AMG1. The encoder head EN4 is disposed on the installation azimuth line Le4 set in the radial direction of the scale portion GP. In addition, when viewed from the rotation center line AX2 in the XZ plane, the scale portion GP is in the same direction as the observation direction AM2 (toward the rotation center line AX2) passing through the detection center on the substrate P by the alignment microscope AMG2. An encoder head EN5 is disposed on each of installation azimuth lines Le5 set in the radial direction. Thus, the detection probes of the alignment microscopes AMG1 and AMG2 are disposed around the second drum member 22 when viewed from the second central axis AX2, and connect the position at which the encoder heads EN4 and EN5 are disposed and the second central axis AX2. The directions (installation orientation lines Le4 and Le5) are arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. The positions of the alignment microscopes AMG1 and AMG2 and the encoder heads EN4 and EN5 around the rotation center line AX2 are the sheet entry area IA where the substrate P starts to contact the second drum member 22 and the second drum member 22. And the sheet release area OA from which the substrate P is released.

Second Embodiment
Next, a second embodiment of the processing apparatus according to the present invention will be described with reference to FIGS. 12 and 13. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The second drum member 22 includes a reference mark forming portion Rfp formed on a curved surface of a cylindrical surface. The reference mark formation portion Rfp is continuously or discretely formed at the same pitch as the alignment mark (formed in a region of several tens μm to several hundreds μm square) formed near the end of the substrate P in the Y axis direction. It is preferable to keep the It is preferable that the curved surface detection probes GS1 and GS2 for detecting the reference mark forming portion Rfp have the same configuration as the microscopes AMG1 and AMG2. The curved surface detection probes GS1 and GS2 perform image detection at high speed by an imaging device or the like, and sample the image of the mark of the reference mark formation portion Rfp at high speed in the microscopic field (imaging range). At the moment when this sampling is performed, the correspondence between the rotational angle position of the second drum member 22 and the reference mark forming portion Rfp is determined, and the rotational angle position of the second drum member 22 measured sequentially is stored.

  The detection center AS1 of the curved surface detection probe GS1 is the same as the detection center of the observation direction AM1 of the substrate P (toward the rotation center line AX2) by the alignment microscope AMG1 when viewed from the rotation center line AX2. The detection center AS1 of the curved surface detection probe GS1 is in the same direction as the installation azimuth line Le4 set in the radial direction of the scale part GP when viewed from the rotation center line AX2 in the XZ plane. The detection center AS2 of the curved surface detection probe GS2 is the same as the detection center of the observation direction AM2 (toward the rotation center line AX2) of the substrate P observed by the alignment microscope AMG2 when viewed from the rotation center line AX2 in the XZ plane. Become. The detection center AS2 of the curved surface detection probe GS2 is in the same direction as the installation azimuth line Le5 set in the radial direction of the scale part GP when viewed from the rotation center line AX2 in the XZ plane.

  In this manner, the curved surface detection probe GS1 rotates on the installation azimuth Le1 of the encoder head EN1 toward the rear side in the feed direction of the substrate P on the installation azimuth Le4 rotated approximately 90 ° around the axis of the rotation center line AX2. It is set. Further, the curved surface detection probe GS2 is set on the installation azimuth line Le5 rotated approximately 90 ° around the axis of the rotation center line AX2 of the installation azimuth line Le2 of the encoder head EN2 toward the rear side in the feed direction of the substrate P .

  The plurality of marks formed in the reference mark forming portion Rfp are arranged at regular intervals in the circumferential direction as the reference marks on the cylindrical outer peripheral surface of the second drum member 22. For example, the placement error of the detection probes GS1 and GS2 based on the measurement readings of the encoder heads EN4 and EN5 at the time of image sampling by GS2 and the shift amount from the detection center of the reference mark image in the sampled image. It is possible to verify

  Furthermore, when a reference line pattern extending in the Y-axis direction is engraved on the outer peripheral surface of the second drum member 22, the reference line pattern is detected by each detection probe GS1, GS2 and each alignment microscope AMG1, AMG2. Thereby, the placement error of each of the alignment microscopes AMG1 and AMG2 can be calibrated based on the coordinate system of the outer peripheral surface of the second drum member 22 specified based on the measurement readings of the encoder heads EN4 and EN5.

  In FIG. 12, the diameter of the scale disk SD is illustrated to be smaller than the diameter of the second drum member 22, but among the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface on which the substrate P is wound and the scale By making the diameters of the scale portion GP of the disk SD uniform (substantially equal), it is possible to further reduce the so-called measurement Abbe error. In this case, the exposure apparatus EX preferably includes a roundness adjusting device that adjusts the roundness of the scale disc SD. FIG. 13 is an explanatory view for explaining the roundness adjusting device for adjusting the roundness of the scale member.

  The scale disk SD, which is a scale member, is an annular member, and the scale portion GP is fixed to an end of the second drum member 22 orthogonal to the second central axis AX2 of the second drum member 22. The scale disk SD has a groove Sc provided on the scale disk SD along the circumferential direction of the second central axis AX2, and has the same radius as the groove Sc and the second drum member 22 along the circumferential direction of the second central axis AX2. It is made to oppose the groove | channel Dc provided in. The scale disc SD interposes a bearing member SB such as a ball bearing between the groove Sc and the groove Dc.

  The roundness adjusting device CS is provided on the inner peripheral side of the scale disc SD, and includes an adjusting unit 60 and a pressing member PP. Then, the roundness adjustment device CS is, for example, a pressing mechanism (60, PP, etc.) capable of varying the pressing force in the radial direction from the second central axis AX2 toward the scale part GP, which is a direction parallel to the installation azimuth Le4. A plurality of (for example, 8 to 16) points are provided at a predetermined pitch in the circumferential direction about the rotation center line AX2.

  The adjusting unit 60 penetrates the hole of the pressing member PP and the through hole FP3 of the scale disk SD, and a male screw 61 screwed to the female screw FP4 of the second drum member 22, and a screw head contacting the pressing member PP. And 62. The pressing member PP is an annular fixed plate whose radius is smaller than that of the scale disc SD along the circumferential direction at the end of the scale disc SD.

  At the point where the installation azimuth line Le4 is extended to the inner peripheral side of the scale disk SD, an inclined surface FP2 is formed on the inner peripheral side of the scale disk SD and in a cross section parallel to the second central axis AX2 and including the second central axis AX2. It is done. The inclined surface FP2 is a frusto-conical surface in a portion in which the thickness in the direction parallel to the second central axis AX2 decreases as the second central axis AX2 is approached. In a cross section including the second central axis AX2 on the inner peripheral side of the scale disc SD and in parallel with the second central axis AX2, the pressing member PP has a direction parallel to the second central axis AX2 as it approaches the second central axis AX2. It has a frusto-conical shaped portion of increased thickness. The inclined surface FP1 is a side surface of the frusto-conical portion. The pressing member PP is fixed by the adjustment unit 60 so that the inclined surface FP2 and the inclined surface FP1 face the scale disc SD.

  The roundness adjusting device CS causes the male screw portion 61 of the adjusting portion 60 to be screwed into the female screw portion FP3 of the scale disc SD and tightens the screw head portion 62, whereby the pressing force of the inclined surface FP1 of the pressing member PP is the inclined surface It is transmitted to FP2 and the outer peripheral surface of the scale disk SD elastically deforms slightly toward the outside. Conversely, by rotating the screw head portion 62 to the opposite side and loosening the male screw portion 61, the pressing force applied from the inclined surface FP1 to the inclined surface FP2 of the pressing member PP is reduced, and the outer peripheral surface of the scale disc SD is inward. Small amount of elastic deformation.

  The roundness adjusting device CS is provided with a plurality of adjusting portions 60 at a predetermined pitch in the circumferential direction around the rotation center line AX2, and the outer peripheral surface of the scale portion GP is operated by operating the screw head portion 62 (male screw portion 61). The diameter of can be adjusted slightly. Further, since the inclined surfaces FP1 and FP2 of the roundness adjusting device CS are provided inside the scale portion GP so that the installation azimuth lines Le1 to Le5 described above pass, the outer periphery of the scale portion GP with respect to the rotation center line AX2. The surface can be uniformly and slightly elastically deformed in the radial direction. Accordingly, the roundness of the scale portion GP of the scale disc SD can be increased by operating the adjustment unit 60 at an appropriate position according to the roundness of the scale disc SD, or a slight eccentricity error with respect to the rotation center line AX2. The position detection accuracy in the rotational direction with respect to the second drum member 22 can be improved by reducing it. Although the amount of adjustment of the radius adjusted by the roundness adjusting device CS varies depending on the diameter and the material of the scale disc SD or the radial position of the adjusting portion 60, it is about ten and several μm at the maximum.

  Further, the suppression effect of the slight eccentricity error obtained by the adjustment by the roundness adjusting device CS can be verified by, for example, the difference comparison of the measurement readings of a plurality of encoder heads.

Third Embodiment
Next, a third embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 14 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the third embodiment is viewed in the direction of the rotation center line AX2. In FIG. 14, the diameter of the outer peripheral surface of the second drum member 22 and the diameter of the scale portion GP of the scale disk SD are aligned (substantially match). In this figure, the same components as those of the first embodiment and the second embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

  Further, as described above, the principal ray of the two imaging light beams EL2 enters the substrate P with respect to the substrate P in the exposure apparatus EX. Two positions where chief rays of two imaging light beams EL2 enter the substrate P with respect to the substrate P are set as a first specific position PX1 and a second specific position PX2. The encoder head EN6 detects a position PX6 of the scale part GP at a specific position corresponding to, for example, the center plane P3 between the first specific position PX1 and the second specific position PX2. The encoder head EN6 is disposed on the installation azimuth line Le6 which coincides with the central plane P3 when viewed from the second central axis AX2. In the present embodiment, among the outer peripheral surface (curved surface of the cylindrical surface) of the second drum member 22, the diameter of the outer peripheral surface to which the substrate P is wound is equal to the diameter of the scale portion GP of the scale disc SD. Corresponds to the above-described specific position (hereinafter referred to as a specific position PX) when viewed from the second central axis AX2. The specific position PX6 is located at the center of the area (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 in the X-axis direction. The encoder head EN4 is set on the installation direction line Le4 rotated approximately 90 ° around the axis of the rotation center line AX2 of the installation direction line Le6 of the encoder head EN6 toward the rear side in the feed direction of the substrate P .

  In the present embodiment, the angular distance between the installation direction line Le4 of the encoder head EN4 corresponding to the alignment microscope AMG1 and the installation direction line Le5 of the encoder head EN5 corresponding to the alignment microscope AMG2 is an angle θ (eg 15 °) Set to

  For example, when the first reading device is an encoder head EN4 and the second reading device is an encoder head EN1, the control device 14 can perform the correction process in the same manner as the procedure shown in FIG. 9 described above. For example, the control device 14 supplies the input of the reading output of the encoder head EN4 which is the first reading device to the database stored in the storage unit of the control device 14, and calculates the displacement angle α. The controller 14 calculates the displacement component Δqx1 from the calculated displacement angle α, and calculates a correction value for correcting the focus state of the projection image according to the displacement component Δqx1. In the exposure apparatus EX of this embodiment, the specific position PX6 is the center of the average exposed area of the substrate P on the curved surface of the second drum member 22 in the X-axis direction. The exposure apparatus EX can reduce the correction process such as fine adjustment of the focus state by performing the irradiation process of irradiating the optimum exposure light at the specific position PX6. The exposure apparatus EX accurately captures the position of the second drum member 2 (cylindrical member) while suppressing the calculation load, and processes the object to be processed on the curved surface of the second drum member 2, that is, the substrate P. It can be applied. Therefore, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

  As described above, the exposure apparatus EX is a first reading that reads the second drum member 22 which is a cylindrical member, the scale part GP, the projection modules PL1 to PL6 which are processing parts of the exposure apparatus EX, and the scale part GP. The encoder head EN4 that is a device, the encoder head EN6 that is a second reader that reads the scale part GP, and the first reader and the second reader are arranged at circumferentially different positions, and read the scale part GP 3 comprising a reader, for example an encoder head EN3.

  The exposure apparatus EX uses the encoder head EN4 that is the first reader, the encoder head EN6 that is the second reader, and the encoder head EN3 that is the third reader to read the second drum member 22 from the reading output of the scale part GP. The second central axis AX2 of The projection modules PL1 to PL6, which are processing units, are a first reading device for displacement when moving the second central axis AX2 of the second drum member 22 in the direction orthogonal to the second central axis AX2. Processing corrected with the read output of the encoder head EN4 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed.

  By the way, in the arrangement of the encoder head shown in FIG. 7, the fine movement component due to the eccentricity of the scale part GP and the positional displacement component due to the rotation may not be discriminated well in some cases. The discrimination can be easily performed. Therefore, 3 of the encoder head EN6 in FIG. 14, the encoder head EN4 arranged offset by approximately 90 ° with respect to it, and the encoder head EN3 (arranged at 180 ° with respect to the encoder head EN6) further offset by 90 ° Focus on one encoder head.

  In this case, assuming that the measurement reading of the encoder head EN6 is Me6 and the measurement reading of the encoder head EN3 is Me3, the fine movement component ΔXd in the X direction due to the eccentricity of the scale disk SD (scale portion GP) is given by the following equation (1) The positional displacement component ΔRp determined by the rotation of the scale part GP is determined by the following equation (2) as an average value.

  ΔXd = (Me6-Me3) / 2 (1)

  ΔRp = (Me6 + Me3) / 2 (2)

  Therefore, assuming that the measured reading of encoder head EN4 is Me4, the reading Me4 and positional displacement component ΔRp are sequentially compared (the sequential difference is determined), and in the case of FIG. The micromotion component ΔZd in the Z axis direction of 22) can be obtained in real time.

<Modification of Third Embodiment>
FIG. 15 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the modification of the third embodiment is viewed in the direction of the rotation center line AX2. As shown in FIG. 15, the encoder head EN6 described above can be omitted. The encoder head EN4 rotates about 90 ° about the axis of the rotation center line AX2 about a line in the XZ plane connecting the specific position and the rotation center line AX2 toward the rear side in the feed direction of the substrate P It is set on the line Le4.
Here, only the alignment microscope AMG1 is disposed in the same orientation as the installation orientation line Le4 of the encoder head EN4.

  The encoder head EN5 rotates the line in the XZ plane connecting the specific position and the rotation center line AX2 about 90 ° around the axis of the rotation center line AX2 toward the front side (downstream side) in the feeding direction of the substrate P It is set on the installed orientation line Le5. In this case, in the exposure apparatus EX, the control device 14 sets the first reader as the encoder head EN4 or the encoder head EN5, and the second reader and the third reader as any of the encoder head EN1, the encoder head EN2, and the encoder head EN3. Or two.

  The exposure apparatus EX performs an irradiation process of irradiating the optimum exposure light on the center of the average exposed area of the substrate P on the curved surface of the second drum member 22 in the X-axis direction to obtain a focused state. Correction processing such as fine adjustment of Therefore, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

  Incidentally, even in the arrangement of the encoder head shown in FIG. 15, it is possible to easily distinguish the fine movement component due to the eccentricity of the scale part GP and the position displacement component due to the rotation. In the arrangement of FIG. 15, the Z-axis of the scale disc SD (second drum member 22) due to eccentricity is used using the measurement readings Me4 and Me5 of the two encoder heads EN4 and EN5 that read the scale of the scale part GP in the Z-axis direction. The fine movement component ΔZd in the direction is obtained by the following equation (3).

  ΔZd = (Me4-Me5) / 2 (3)

  Furthermore, the measurement reading of encoder head EN3 which reads in the X-axis direction the position displacement component ΔRp due to the rotation of scale part GP determined by the average value of measured readings Me4 and Me5 of encoder heads EN4 and EN5 and the scale of GP. If the difference with the value Me3 is sequentially obtained, the fine movement component ΔXd in the X-axis direction of the scale disk SD (second drum member 22) due to the eccentricity can be obtained in real time. The position displacement component ΔRp is obtained by the following equation (4).

  ΔR p = (Me 4 + Me 5) / 2 (4)

  As described above, the exposure apparatus EX is a first reading that reads the second drum member 22 which is a cylindrical member, the scale part GP, the projection modules PL1 to PL6 which are processing parts of the exposure apparatus EX, and the scale part GP. The encoder heads EN4 and EN5 which are devices, the encoder heads EN1 and EN2 which are second reading devices for reading the scale part GP, and the first reading device and the second reading device are arranged at different positions in the circumferential direction. A third reader for reading the GP, such as an encoder head EN3, is provided.

  In the case of the configuration as shown in FIG. 15 above, based on the measurement readings of the two encoder heads EN4 and EN5, which are arranged 180 degrees apart from each other, the fine movement component of the second drum member 22 in the Z axis direction Since ΔZd can be obtained sequentially, the focus fluctuation ΔZf of the substrate P can be easily calculated as the following formula (5).

  ΔZf = ΔZd × cos θ (5)

  Therefore, the exposure apparatus EX of the present embodiment captures the position of the second drum member 2 (cylindrical member) with high accuracy while suppressing the calculation load, and the object to be processed on the curved surface of the second drum member 2, that is, The substrate P can be processed. Therefore, the exposure apparatus EX can perform high-speed and high-precision exposure processing on the substrate P.

Fourth Embodiment
Next, a fourth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. 16 and FIG. FIG. 16 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 17 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the fourth embodiment is viewed in the direction of the rotation center line AX1. In this figure, the same components as those of the first embodiment, the second embodiment and the third embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

  The scale disc SD is fixed to both ends of the first drum member 21 and the second drum member 22 so as to be orthogonal to the rotation axis ST. The scale parts GP are provided at both ends of the second drum member 22, and the above-described encoder heads EN1 to EN5 for measuring the respective scale parts GP are disposed at both ends of the second drum member 22, respectively.

  The first detector 25 shown in FIG. 1 optically detects the rotational position of the first drum member 21. The first detector 25 has a scale disk (scale member) SD with high roundness and an encoder head as a reader. Includes EH1, EH2, EH3, EH4, EH5.

  The scale disc SD is fixed to at least one end (both ends in FIG. 16) of the first drum member 21 orthogonal to the rotation axis of the first drum member 21. Therefore, the scale disk SD rotates integrally with the rotation axis ST around the rotation center line AX1. A scale portion GPM is engraved on the outer peripheral surface of the scale disk SD. The encoder heads EH1, EH2, EH3, EH4, and EH5 are disposed around the scale part GP when viewed from the rotation axis STM. The encoder heads EH1, EH2, EH3, EH4, and EH5 are disposed to face the scale portion GPM, and can read the scale portion GPM without contact. The encoder heads EH1, EH2, EH3, EH4, and EH5 are disposed at different positions in the circumferential direction of the first drum member 21.

  The encoder heads EH1, EH2, EH3, EH4, and EH5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement in the tangential direction (in the XZ plane) of the scale portion GPM. As shown in FIG. 17, when the installation azimuths (angular directions in the XZ plane around the rotation center line AX1) of the encoder heads EH1 and EH2 are represented by installation azimuths Le11 and Le12, the installation azimuths Le11 and Le12. The encoder heads EH1 and EH2 are disposed such that the angle .theta. The installation azimuth lines Le11 and Le12 coincide with the angular direction in the XZ plane centering on the rotation center line AX1 of the illumination light flux EL1 shown in FIG. Here, the illumination mechanism IU, which is a processing unit, irradiates the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM. Thereby, the projection optical system PL can project the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part (projection area PA) of the substrate P being transported by the transport device 9.

  The encoder head EH4 rotates about 90 ° of the installation azimuth line Le11 of the encoder head EH1 about the axis of the rotation center line AX1 toward the rear side in the rotational direction with respect to the center plane P3 of the first drum member 21 It is set on line Le14. Further, the encoder head EH5 is installed by rotating the installation direction line Le12 of the encoder head EH2 about the axis of the rotation center line AX1 toward the rear side in the rotational direction about the center plane P1 of the first drum member 21 It is set on the azimuth line Le15. Here, in the case where approximately 90 ° is 90 ° ± γ, the range of γ is 0 ° ≦ γ ≦ 5.8 °, as in the first embodiment.

  Further, the encoder head EH3 rotates the installation azimuth line Le12 of the encoder head EH2 by approximately 120 ° around the axis of the rotation center line AX1, and rotates the encoder head EH4 approximately 120 ° around the axis of the rotation center line AX1. It is set on line Le13.

  The arrangement of the encoder heads EH1, EH2, EH3, EH4 and EH5 arranged around the first drum member 21 in the present embodiment is the encoder head EN1 arranged around the second drum member 22 in the first embodiment. , EN2, EN3, EN4, and EN5 are mirror images of each other.

  As described above, the exposure apparatus EX includes the first drum member 21 which is a cylindrical member, the scale section GPM, the illumination mechanism IU which is the processing section of the exposure apparatus EX, and the first reading apparatus which reads the scale section GPM. The encoder heads EH4 and EH5 include encoder heads EH1 and EH2 that are second readers for reading the scale part GPM.

  The first drum member 21 has a curved surface curved at a constant radius from a first central axis AX1 which is a predetermined axis, and rotates around the first central axis AX1. The scale portion GPM is annularly arranged along the circumferential direction in which the first drum member 21 rotates, and rotates with the first drum member 21 around the first central axis AX1. The illumination mechanism IU, which is a processing unit of the exposure apparatus EX, is disposed inside the first drum member 21 as viewed from the second central axis AX2, and has a mask pattern on a curved surface at a specific position in the circumferential direction of the first drum member 21. Two illumination luminous fluxes EL1 are irradiated. The encoder heads EH4 and EH5 are disposed around the scale portion GPM when viewed from the first central axis AX1, and the above-mentioned specific position is approximately 90 degrees around the first central axis AX1 around the first central axis AX1. It is placed at the rotated position and reads the scale part GPM. The encoder heads EH1 and EH2 read the scale part GPM at the specific position described above. The exposure apparatus EX uses a first reading apparatus for displacement when the illumination mechanism IU, which is a processing unit, moves in a direction perpendicular to the first central axis AX1 on which the rotation axis STM of the first drum member 21 moves. Processing corrected by the read output of a given encoder head EH4 or EH5 is performed. For this reason, the exposure apparatus EX of the present embodiment captures the position of the first drum member 21 (cylindrical member) with high accuracy while suppressing the calculation load, and thus the object to be processed on the curved surface of the first drum member 21, The cylindrical mask DM can be processed (irradiated with illumination light).

  The exposure apparatus EX reads each of the encoder heads EH4 and EH5 as the first reader, the encoder heads EH1 and EH2 as the second reader, and the scale part GPM measured by the encoder head EH3 as the third reader. From the output, the fine movement component in the XZ plane of the rotation axis STM of the first drum member 21 may be determined.

Fifth Embodiment
Next, a fifth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 18 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. In the exposure apparatus EX2, the light source device 13 emits an illumination light beam EL1 with which the cylindrical mask DM is illuminated.

  The illumination light beam EL1 emitted from the light source of the light source device 13 is guided to the illumination module IL, and when a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is split into a plurality of illumination light beams EL1. Lead to the lighting module IL.

  Here, the illumination light beam EL1 emitted from the light source device 13 enters the polarization beam splitters SP1 and SP2. In the polarization beam splitters SP1 and SP2, in order to suppress the energy loss due to the separation of the illumination light beam EL1, it is preferable to use a light flux that reflects all the incident illumination light flux EL1. Here, the polarization beam splitters SP1 and SP2 reflect light fluxes to be linearly polarized light of S polarization and transmit light fluxes to be linear polarized light of P polarization. Therefore, the light source device 13 emits to the first drum member 21 the illumination light beam EL1 in which the illumination light beam EL1 incident on the polarization beam splitters SP1 and SP2 is a light beam of linear polarization (S polarization). Thereby, the light source device 13 emits the illumination light beam EL1 whose wavelength and phase are uniform.

  The polarization beam splitters SP1 and SP2 reflect the illumination light beam EL1 from the light source, while transmitting the projection light beam EL2 reflected by the cylindrical mask DM. In other words, the illumination beam EL1 from the illumination optical module ILM enters the polarization beam splitters SP1 and SP2 as a reflected beam, and the projection beam EL2 from the cylindrical mask DM enters the polarization beam splitters SP1 and SP2 as a transmitted beam. .

  As described above, the illumination module IL, which is the processing unit, performs a process of reflecting the illumination light beam EL1 on a predetermined pattern (mask pattern) on the cylindrical mask DM, which is the object to be processed. Thereby, the projection optical system PL can project the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part (projection area PA) of the substrate P being transported by the transport device 9.

  When a predetermined pattern (mask pattern) for reflecting the illumination light beam EL1 is provided on the surface of the curved surface of such a cylindrical mask DM, the reference mark forming member Rfp described above can be provided on the curved surface together with the mask pattern. When the reference mark formation portion Rfp is formed simultaneously with the mask pattern, the reference mark formation portion Rfp is formed with the same accuracy as the mask pattern. Therefore, the image of the mark of the reference mark forming portion Rfp can be sampled at high speed and with high accuracy by the curved surface detection probes GS1 and GS2 that detect the above-described reference mark forming portion Rfp. At the moment when this sampling is performed, the rotational angle position of the first drum member 21 is measured by the encoder head, whereby the correspondence between the reference mark forming portion Rfp and the rotational angle position of the first drum member 21 sequentially measured Relationships are sought.

Sixth Embodiment
Next, a sixth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 19 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. In the exposure apparatus EX3, the light source device 13 includes polygon scanning units PO1 and PO2, and the polygon scanning unit PO performs one-dimensional scanning of the drawing laser beam EL2. The spot light of the laser beam is condensed on the substrate P, and during one-dimensional scanning of the spot light, the laser beam is turned ON / OFF at high speed based on the pattern data (CAD data), thereby on the substrate P. An electronic circuit pattern or the like is drawn (exposed) on the

  Thus, the exposure apparatus EX3 of FIG. 19 can perform patterning processing by irradiating the substrate P at a specific position with exposure light (spot light) even without the cylindrical mask DM. Furthermore, pattern exposure is performed on the substrate P wound around the second drum member (rotary drum) 22 using an apparatus for projecting and exposing a variable mask pattern, for example, a maskless exposure apparatus disclosed in Japanese Patent No. 4223036 Also in each case, each embodiment is applicable similarly.

Seventh Embodiment
Next, a seventh embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 20 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the seventh embodiment. The exposure apparatus EX4 is a processing apparatus that subjects the substrate P with so-called proximity exposure. The exposure device EX4 sets the gap between the cylindrical mask DM and the second drum member 22 minutely, and the illumination mechanism IU directly irradiates the substrate P with the illumination light flux EL, and performs non-contact exposure. In the present embodiment, the second drum member 22 is rotated by the torque supplied from the second drive unit 36 including an actuator such as an electric motor. For example, a driving roller MGG connected by a magnetic gear drives the first drum member 21 so as to be reverse to the rotation direction of the second driving unit 36. The second drive unit 36 rotates the second drum member 22 and rotates the drive roller MGG and the first drum member 21 together to synchronize the first drum member 21 (cylindrical mask DM) with the second drum member 22. Move (synchronize).

  The exposure apparatus EX4 further includes an encoder head EN6 that detects the position PX6 of the scale portion GP at a specific position where the principal ray of the imaging light beam EL enters the substrate P with respect to the substrate P. Here, among the outer peripheral surfaces of the second drum member 22, the diameter of the outer peripheral surface on which the substrate P is wound is equal to the diameter of the scale portion GP of the scale disk SD, so the position PX6 is from the second central axis AX2. It matches with the specific position mentioned above. Then, the encoder head EN7 rotates the installation azimuth line Le6 of the encoder head EN6 about the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P by approximately 90 ° (range of 90 ° ± γ) It is set on the azimuth line Le7.

  The exposure apparatus EX4 of this embodiment uses the encoder head EN7 as a first reading device and the encoder head EN6 as a second reading device, and determines the position of the axis of the second drum member 22 determined from the reading output of the scale part GP. The component of the displacement in the direction perpendicular to the axis, which is connected to the position, can be subjected to processing corrected by the read output of the first reader.

  The first to fourth embodiments described above exemplify the exposure apparatus as the processing apparatus. The processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, by an ink drop apparatus of inkjet. Alternatively, the processing unit may be an inspection device.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 21 is a flowchart showing the device manufacturing method of the first embodiment. FIG. 21 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  In the device manufacturing method shown in FIG. 21, first, function / performance design of a display panel by self-light emitting elements such as organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD (step S201). Next, based on the pattern of each of the various layers designed by CAD or the like, a cylindrical mask DM for the necessary layer is manufactured (step S202). In addition, a supply roll FR1 on which a flexible substrate P (a resin film, a metal foil film, a plastic or the like) to be a base material of the display panel is wound is prepared (step S203). The roll-like substrate P prepared in this step S203 has its surface modified as necessary, a base layer (for example, minute unevenness by imprint method) formed in advance, photosensitivity What laminated the functional film and transparent film | membrane (insulation material) of previously is also good.

  Next, on the substrate P, a backplane layer composed of electrodes and wirings constituting the display panel device, an insulating film, a TFT (thin film semiconductor) and the like is formed, and organic EL etc. A light emitting layer (display pixel portion) is formed by the self light emitting element of the above (step S204). Although this step S204 includes the conventional photolithography process of exposing the photoresist layer using the exposure apparatuses EX, EX2, EX3 and EX4 described in the above embodiments, the photosensitivity is used instead of the photoresist. Pattern exposure of the substrate P coated with the silane coupling material to form a pattern of hydrophilicity and water repellency on the surface, pattern exposure of the photosensitive catalyst layer and pattern of a metal film by electroless plating (wiring, electrode Processing by a wet process of forming etc.) or a printing process of drawing a pattern by a conductive ink containing silver nanoparticles etc. is also included.

  Then, the substrate P is diced for each display panel device continuously manufactured on a long substrate P by a roll method, or a protective film (anti-environment barrier layer) or a color filter is formed on the surface of each display panel device. A sheet or the like is attached to assemble a device (step S205). Then, an inspection process is performed to determine whether the display panel device functions properly or satisfies the desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

  In addition, the requirements of the above-mentioned embodiment and modification can be combined suitably. In addition, some components may not be used. In addition, the disclosures of all the published publications, patent publications, and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated as part of the description of the text as far as the laws and regulations permit.

9 conveyance device 11 processing device 12 mask holding device 13 light source device 14 control device 21 first drum member 22 second drum member 23 guide roller 24 drive roller 25 first detector 26 first drive unit 31 guide member 31 solid light source 33 first 2 Guide member 35 Detector 44 Focus correction optical member 45 Image shift correction optical member 46 Rotation correction mechanism 47 Magnification correction optical member 62 Head portion AM1, AM2 Observation direction AMG1, AMG2 Alignment microscope GS1, GS2 Curved surface detection probe CS Roundness Adjustment device DM Cylindrical mask EN1, EN2, EN3, EN4, EN5, EN6, EN7, EH1, EH2, EH4, EH5 Encoder head EX, EX2, EX3, EX4 Exposure device (processing apparatus)
PO polygon scanning unit PP pressing member

Claims (12)

A substrate processing apparatus for forming a pattern for manufacturing a device on a long sheet substrate, comprising:
It has a cylindrical outer peripheral surface curved at a constant radius from a predetermined center line, and rotates around the center line while a portion of the sheet substrate is supported in the longitudinal direction along the outer peripheral surface, A rotary drum for conveying the sheet substrate in the longitudinal direction;
Of the outer peripheral surface of the rotary drum, the first specific position set between the entry region where the sheet substrate starts to contact the outer peripheral surface and the separation region where the sheet substrate departs from the outer peripheral surface A pattern forming unit for forming a pattern;
The end of the rotating drum in the direction of the center line is coaxially fixed with the center line, and is annularly formed along the circumferential direction of the outer peripheral surface having a diameter substantially identical to the diameter of the outer peripheral surface of the rotating drum. A scale disc with a scale formed,
The circumferential position of the scale is disposed so as to face the scale formed on the outer peripheral surface of the scale disk, and is disposed substantially in the same direction as the first specific position with respect to the center line. A first reading mechanism that measures changes sequentially;
Substrate processing apparatus provided with: The substrate processing apparatus according to claim 1, wherein
And the scale on the outer peripheral surface of the scale disk so as to have substantially the same orientation as a second specific position separated by a first angle from the first specific position along the circumferential direction of the outer peripheral surface of the rotating drum A second reading mechanism disposed opposite to each other and sequentially measuring a positional change in the circumferential direction of the scale;
The substrate processing apparatus further provided. The substrate processing apparatus according to claim 2,
The scale disc is fixed at a position with a constant radius from the center line and with a plurality of screw portions arranged at a predetermined pitch in the circumferential direction with reduced eccentricity error on the end side of the rotating drum ,
Substrate processing equipment. The substrate processing apparatus according to claim 3, wherein
The reduction of the eccentricity error of the scale disc after being fixed to the rotating drum is verified by differential comparison of the respective measurement readings of the first reading mechanism and the second reading mechanism.
Substrate processing equipment. The substrate processing apparatus according to claim 2,
The second specific position is set between the entry area where the sheet substrate starts to contact the outer peripheral surface of the rotary drum and the first specific position.
A first detection probe unit configured to detect an alignment mark formed continuously or discretely in advance along the longitudinal direction on the sheet substrate at the second specific position;
The substrate processing apparatus further provided. The substrate processing apparatus according to claim 5, wherein
The first detection probe unit performs high-speed sampling of the image of the alignment mark appearing in the field of view by a microscope in a state in which the sheet substrate is fed at a predetermined speed in the longitudinal direction by the rotation of the rotating drum. Including the image sensor of
The position of the alignment mark on the sheet substrate is specified by the rotational angle position of the scale disk based on the measurement reading of the scale measured by the second reading mechanism at the moment of the sampling.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 2 to 6, wherein
The pattern forming unit is
An exposure device for projecting a light beam generated from a mask pattern or variable mask pattern irradiated with illumination light onto the sheet substrate at the first specific position, or modulated based on pattern data and projected onto the sheet substrate The exposure apparatus according to any one of the first and second aspects of the present invention, wherein the beam spot light is one-dimensionally scanned by the polygon scanning unit at the first specific position to draw the pattern.
Substrate processing equipment. The substrate processing apparatus according to claim 7, wherein
The exposure apparatus
The plurality of modules arranged along the direction of the center line to expose the pattern in each of a plurality of projection areas divided in the direction of the center line of the rotating drum;
In the projection area of each of the plurality of modules, the odd-numbered projection areas and the even-numbered projection areas arranged in order in the direction of the center line have a second angle in the circumferential direction of the outer peripheral surface of the rotating drum. Placed apart,
Substrate processing equipment. The substrate processing apparatus according to claim 8, wherein
The odd-numbered projection area is disposed upstream and the even-numbered projection area is disposed downstream with respect to the conveyance direction of the sheet substrate along the circumferential direction of the outer peripheral surface of the rotating drum. The second specific position is disposed between the approach area and the odd-numbered projection area with respect to the circumferential direction of the outer peripheral surface of the rotary drum.
Substrate processing equipment. The substrate processing apparatus according to claim 9, wherein
The first specific position is set at the center of the odd-numbered projection area and the even-numbered projection area with respect to the circumferential direction of the outer peripheral surface of the rotary drum.
Substrate processing equipment. The substrate processing apparatus according to claim 9, wherein
The first specific position is a specific position on the odd number side set in the same direction as the odd-numbered projection area and the same direction as the even-numbered projection area in the circumferential direction of the outer peripheral surface of the rotating drum. Including the specific position on the even number side to be set,
The first reading mechanism is
The first encoder head that measures the positional change of the scale of the scale disk in the same direction as the specific position on the odd number side, and the positional change of the scale on the scale disk in the same direction as the specific position on the even side And a second encoder head to measure
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 6, wherein
The pattern forming unit is
An apparatus for printing the pattern on the sheet substrate by an inkjet ink drop apparatus;
Substrate processing equipment.

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