CN107209461B - Substrate board treatment, device manufacturing system and manufacturing method - Google Patents

Abstract

A kind of substrate board treatment, has: rotor DR, with the past conveyance direction conveying intersected with substrate P width direction of set speed；Drawing apparatus 11, with multiple description module UW1~UW5, the description light beam for being projeced into substrate P is scanned along the description line of substrate P predetermined pattern to be depicted in substrate P, it each other in such a way that width direction engages, will be configured to be separated by predetermined distance in conveyance direction in the adjacent description line of width direction each other by by multiple each patterns being depicted in substrate P for describing module UW1~UW5；Inclination of the line relative to substrate P width direction is described in adjustment mechanism 24, adjustment；And rotation position testing agency, detect the conveying speed of substrate P；According to the conveying speed detected with rotation position testing agency, the relative tilt for describing line is adjusted by rotating mechanism 24.

Description

Substrate board treatment, device manufacturing system and manufacturing method

Technical field

The present invention is about substrate board treatment, device manufacturing system and manufacturing method.

Background technique

In the past, as substrate board treatment, it is known to which the commitment positions on a kind of pair of sheet media (substrate) are described Scan-type drawing apparatus (see, for example document 1).Scan-type drawing apparatus have drawing desk, laser light source, light modulator, with And scanning optical system.Drawing desk is transported in the state for being placed with media in conveyance direction (sub-scanning direction).Laser light source is toward light Modulator irradiates laser.Light modulator, will be from for example using acousto-optic varying element (AOM:Acousto Optic Modulator) The laser of laser source irradiation gives modulation.Light modulator is biased to laser by diffraction, laser is thrown after being switched to ON It penetrates on media.On the other hand, light modulator, after being switched to OFF, do not make laser be biased to and become not by laser projection in State on media.Optical system is scanned, by the laser projected from light modulator from the scanning starting end on media to the end of scan It is scanned along set scan line in scanning direction until end.Then, scan-type drawing apparatus removes media by drawing desk on one side It send in sub-scanning direction, on one side with light modulator modulation laser, is swept by making with the point light for scanning the laser after optical system modulation It retouches in scanning direction, to describe to media.

Existing technical literature

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2000-227661 bulletin

Summary of the invention

The technical issues of invention solves

In addition, the substrate as rendered object, can become larger with element enlargement.If substrate becomes larger, it is depicted in substrate Pattern also become larger.Herein, the scan-type drawing apparatus of patent document 1, due to being to be described with a scan line, When being depicted in the situation that the pattern of substrate becomes larger, it is elongated that the point light of laser is formed by scan line.However, patent document 1 is swept Formula drawing apparatus is retouched, since the length of scanning line has its limit, is depicted in the size of the pattern of substrate by the length of scanning line Limitation.

Therefore, it can consider pattern plotter with multi-strip scanning line (describing line) in the description side of the so-called Multibeam of substrate Formula.Such Multibeam describes mode, and a plurality of descriptions line is arranged in the direction of scan line, by will with it is each scan it is linear At each pattern engaged in the width direction orthogonal with the conveyance direction of substrate, and larger pattern can be described to substrate.

Even if Multibeam describes mode, due to also on one side by substrate conveying in conveyance direction, while with a plurality of description line By pattern plotter in substrate, therefore describe from each description starting position for describing line to the pattern for describing end position, in substrate Conveying speed when generating the unequal situation of speed, describe starting position and describe end position can be in conveyance direction with micron The difference of grade is located at different location.Thus, it is possible to create the pattern adjacent in substrate width direction is mutual to engage precision The phenomenon that deterioration that is, generation bonding error.

State sample implementation of the invention, in view of above-described problem, even if being linked with retouching for a plurality of Multibeam for describing line Mode is drawn, can also lower the mutual bonding error of the pattern engaged in substrate width direction well.

Solve the problems, such as the technological means used

The 1st state sample implementation according to the present invention, provides a kind of substrate board treatment, have: base board delivery device props up on one side Hold the substrate of given width, on one side by it with the past conveyance direction conveying intersected with aforesaid base plate width direction of set speed；It retouches Device is drawn, there are multiple description modules, it is narrow in the width compared with aforesaid base plate along the description light beam that will be projeced into aforesaid base plate Range scans describe line obtained from foregoing width direction and predetermined pattern are depicted on aforesaid base plate, by aforesaid plurality of Describe each of module and be depicted in the mode that the pattern on aforesaid base plate is engaged in aforesaid base plate width direction each other, by that This is separated by predetermined distance configuration in aforementioned conveyance direction in the adjacent aforementioned description line in foregoing width direction；Tilt adjusting mechanism, Adjust inclination of the aforementioned description line relative to aforesaid base plate width direction；And substrate speed detector, detect aforementioned base The conveying speed of plate；According to the conveying speed of the aforesaid base plate detected with aforesaid base plate speed detector, inclined by aforementioned The aforementioned relative tilt for describing line of skew adjustment institutional adjustment.

The 2nd state sample implementation according to the present invention, provides a kind of device manufacturing system, has the base of the 1st aspect of the invention Plate processing unit.

The 3rd state sample implementation according to the present invention, provides a kind of manufacturing method, includes: at the substrate using the 1st aspect Device is managed, will be scanned from the aforesaid plurality of each aforementioned description light beam for describing module in the light sensation being formed on aforesaid base plate Layer is answered to describe the movement of the pattern engaged；And by processing aforesaid base plate to connect in formation on aforesaid base plate with aforementioned The movement of the layer construction of the corresponding element of the pattern of conjunction.

Detailed description of the invention

In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only Some embodiments of the present invention, for those of ordinary skill in the art, without any creative labor, also Other drawings may be obtained according to these drawings without any creative labor.

Fig. 1 shows all figures constituted of the exposure device (substrate board treatment) of the 1st implementation form.

Fig. 2 shows the perspective view of the configuration in the main portion of the exposure device of Fig. 1.

Fig. 3 is shown in the figure of the configuration relation of aligming microscope and description line on substrate.

Fig. 4 shows the figure of the rotor of the exposure device of Fig. 1 and the composition of drawing apparatus.

Fig. 5 shows the top view of the configuration in the main portion of the exposure device of Fig. 1.

Fig. 6 shows the perspective view of the composition of the disagreement optical system of the exposure device of Fig. 1.

Fig. 7 shows the figure of the configuration relation of each scanner in multiple description modules set by the exposure device of Fig. 1.

Fig. 8 is shown in the perspective view of aligming microscope and the configuration relation for describing line and encoder head on substrate.

Fig. 9 shows the perspective view of the surface structure of the rotor of the exposure device of Fig. 1.

Figure 10 shows the pattern being depicted on substrate with the exposure device of the 1st implementation form and the configuration relation one for describing line The figure of example.

Figure 11 shows the pattern being depicted on substrate with the exposure device of the 1st implementation form and the configuration relation one for describing line The figure of example.

Figure 12 is shown in the figure of the image of CAD information used in the exposure device of the 1st implementation form.

Figure 13 shows the figure that a part of the f- θ lens system of the exposure device of the 2nd implementation form is constituted.

Figure 14 shows the figure that the cylindrical lens of the f- θ lens system of Figure 13 is constituted.

Figure 15 shows the pattern being depicted on substrate with the exposure device of the 2nd implementation form and the configuration relation one for describing line The figure of example.

Figure 16 shows the pattern being depicted on substrate with the exposure device of the 2nd implementation form and the configuration relation one for describing line The figure of example.

Figure 17 shows the pattern being depicted on substrate with the exposure device of the 3rd implementation form and the configuration relation one for describing line The figure of example.

Figure 18, which is shown, to be depicted in the exposure device of the 4th implementation form in the situation of the tilt correction without describing line The figure of configuration relation an example of pattern and description line on substrate.

Figure 19 is shown to be depicted on substrate after the tilt correction for describe line with the exposure device of the 4th implementation form The figure of configuration relation an example of pattern and description line.

Figure 20 be with the exposure device of the 4th implementation form the tilt correction that will describe line according to substrate conveying speed not The figure of configuration relation an example of the pattern and description line that are depicted in when equal and revised situation on substrate.

Figure 21 shows the flow chart for having used the manufacturing method of exposure device of the 1st~the 4th implementation form.

Specific embodiment

For to implement form of the invention (implementation form), it is described in detail while referring to drawing.The present invention works as So it is not only restricted to the content that following implementation form is recorded.Also, including technical field that the present invention belongs in the constituent element recorded below Middle related technical personnel are easy scenario person and substantially identical object.In addition, the constituent element recorded below can be appropriately combined. Also, various omissions, displacement or the change of constituent element can be carried out not departing within the scope of main idea of the present invention.

[the 1st implementation form]

Fig. 1 shows all figures constituted of the exposure device (substrate board treatment) of the 1st implementation form.1st implementation form Substrate board treatment the exposure device EX of exposure-processed is imposed to substrate P, exposure device EX, which is assembled in, applies exposure metacoxal plate P In various process in the device manufacturing system 1 to manufacture element.Firstly, illustrating device manufacturing system 1.

< device manufacturing system >

Device manufacturing system 1, manufacture is as the flexible display of element, multilayer pliability wiring, flexible sensor The production line (pliable electronic component manufacturing line) of equal electronic components.Following state sample implementation, it is aobvious with pliability as electronic component Show and is illustrated for device.Flexible display, such as organic el display etc..This device manufacturing system 1, will be flexible (flexible) strip substrate P is rolled into the (not shown) for sending out the substrate P using reel of tubular, in the substrate P company to submitting It is continuous apply in various process after, the institute of recycling reel (not shown) is wound in using treated substrate P as flexible element Roll-to-roll (Ro11to Ro11) mode of meaning.In the device manufacturing system 1 of the 1st implementation form, by the plate shape substrates P of film-form It is sent out from for application reel, from the substrate P sent out for application reel sequentially through processing unit U1, exposure device EX, processing unit After U2, it is wound in the example of recycling reel.Herein, illustrate the substrate P of the process object of device manufacturing system 1.

Substrate P, foil being made of the metal or alloy of such as resin film, stainless steel etc. (foil) etc..Resin film Material can be used including, for example, polyvinyl resin, acrylic resin, polyester resin, ethylene vinyl alcohol copolymer resin, polychlorostyrene second Olefine resin, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, polyvinyl alcohol One of materials such as resin or two kinds or more person.

Substrate P, to select, such as thermal expansion coefficient is significant less, can substantially ignore in the various processing implemented to substrate P The middle deflection person generated because heated is preferable.Thermal expansion coefficient, can be for example, by being mixed in resin film for inorganic filler It is set as small compared with the threshold value of alignment processing temperature etc. accordingly.Inorganic filler, can be for example titanium oxide, zinc oxide, aluminium oxide, Silica etc..Also, substrate P can be to float the individual layers of the very thin glass of 100 μm of degree of thickness of the manufactures such as preparation method or in this The laminate of the above-mentioned resin film of very thin glass gluing or foil etc..

The substrate P constituted by this method is wound into scroll-like and becomes supply reel, this using reel for being filled with In device manufacturing system 1.Equipped with the device manufacturing system 1 for application reel, to from for applying reel to send out toward strip direction Substrate P is repeatedly carried out the various processing to manufacture element.Therefore, in treated substrate P, in strip direction with set The pattern of multiple element (such as display panel of TV, computer) is formed with every the state of connection.That is, from confession It is the substrate of multi-panel using the substrate P that reel is sent out.In addition, substrate P can also be it is pre- first pass through set pre-treatment, by it Surface is modified and activation person or the fine spaced walls construction (sag and swell) in surface formation to precise pattern Person.

Substrate P after processing is wound into scroll-like conduct recycling and is recycled with reel.Recycling reel, is pacified Loaded on cutter device (not shown).Cutter device equipped with recycling reel, by treated, substrate P divides (cutting) at each Element becomes multiple element accordingly.The size of substrate P, for example, the size of width direction (direction of short side) is 10cm~2m journey Degree and length direction (direction of strip) though size also can depend on can be installed on processing unit for application reel or recycling The maximum gauge of reel, but have as hundreds of m~thousands of m situation.In addition, the size (each size of short side/long side) of substrate P It is not limited to above-mentioned size.Also, being not necessarily intended to is the conveying from the substrate for supplying and being recycled to recycling reel for application reel Form.

Then, illustrate device manufacturing system 1 referring to Fig.1.Device manufacturing system 1 have processing unit U1, exposure device EX, And processing unit U2.Also, Fig. 1, the orthogonal coordinate system being orthogonal for X-direction, Y-direction and Z-direction.X-direction, in horizontal plane It is interior from the exposed device EX of processing unit U1 towards the direction of processing unit U2.Y-direction, in orthogonal with X-direction in horizontal plane Direction, be substrate P width direction.Z-direction is the X-direction direction (vertical direction) orthogonal with Y-direction.

Processing unit U1, the processing (pre-treatment) of technique before being carried out for the exposure device EX substrate P for being exposed processing. Substrate P through pre-treatment is sent to exposure device EX by processing unit U1.At this point, being sent to the substrate P of exposure device EX, table Face is formed with substrate (sensitive substrate) P of photonasty functional layer (photoinduction layer).

Herein, photonasty functional layer equally or is selectively applied in substrate P as solution, becomes layer through dry (film).Typical photonasty functional layer has photoetching jelly, but as the material being not necessarily to after development treatment, what is irradiated by ultraviolet light Plating is exposed also in the modified photonasty silane coupling agent material (SAM) of partial close liquid repellency or the part irradiated by ultraviolet light Also first material of the photonasty of first base etc..When using photonasty silane coupling agent material as photonasty functional layer, due to purple in substrate P The pattern part of outer line exposing is lyophily by liquid repellency modification, therefore in selectively applied conduction on the part for becoming lyophily Property ink (ink containing silver or the electric conductivity nanoparticle such as copper), to form pattern layer.As photonasty functional layer use feeling Photosensitiveness also first material when, since the also first base of plating can be exposed by the pattern part of ultraviolet exposure in substrate P, after exposure, Substrate P is impregnated in certain time in the electroless plating liquid containing palladium ion etc. immediately, with the pattern layer of formation (precipitation) palladium.

Exposure device EX describes the circuit or wiring of such as display pannel to the substrate P supplied from processing unit U1 Deng pattern.Details are chatted after remaining, this exposure device EX, by by it is multiple describe light beam LB each scannings in set scanning side To resulting multiple description line LL1~LL5, in exposing predetermined pattern out in substrate P.After exposure device EX is exposed processing Substrate P be sent to processing unit U2, the processing (post-processing) of technique after processing unit U2 carries out substrate P.Whereby, in substrate The specific pattern pattern layer of electronic component is formed on the surface of P.

< exposure device (substrate board treatment) >

Then, illustrate exposure device EX referring to figs. 1 to Fig. 9.Fig. 2 shows the vertical of the configuration in the main portion of the exposure device of Fig. 1 Body figure.Fig. 3 is shown in the figure of the configuration relation of aligming microscope and description line on substrate.Fig. 4 shows the exposure device of Fig. 1 The figure of the composition of rotor and drawing apparatus.Fig. 5 shows the top view of the configuration in the main portion of the exposure device of Fig. 1.Fig. 6 is shown The perspective view of the composition of the disagreement optical system of the exposure device of Fig. 1.Fig. 7 shows multiple description lists of the exposure device set on Fig. 1 The figure of the configuration relation of each scanner in member.Fig. 8 is shown in the encoder head of aligming microscope and description line on substrate Configuration relation perspective view.Fig. 9 shows the perspective view of the rotating cylinder surface construction of the exposure device of Fig. 1.

As shown in Figure 1, exposure device EX, exposes without using the description of the exposure device of light shield, so-called no light shield mode Device (directly retouches exposure machine), by by substrate P on one side conveyance direction conveying, while will describe light beam LB point (spot) light in both Determine scanning direction scanning, substrate P surface is described accordingly, to form predetermined pattern.

As shown in Figure 1, exposure device EX have drawing apparatus 11, substrate transport mechanism 12, aligming microscope AM1, AM2, And control device 16.Drawing apparatus 11, by multiple description module UW1~UW5 in the base transported by substrate transport mechanism 12 A part of plate P describes predetermined pattern.Substrate transport mechanism 12, the substrate P that will be transported from the processing unit U1 of preceding technique, With set speed backward technique processing unit U2 conveying.Aligming microscope AM1, AM2, to carry out wait be depicted in substrate P The opposite position alignment (alignment) of pattern and substrate P, detection are previously formed in the alignment mark etc. of substrate P.Control dress 16 are set, each portion of exposure device EX is controlled, handles each portion's implementation.Control device 16 can be control element manufacture system 1 Part or all of host control device.Also, control device 16 also can be controlled by host control device and upper control The different device of device.Control device 16, such as include computer.

Furthermore as shown in Fig. 2, exposure device EX has the device frame of bearing drawing apparatus 11 and substrate transport mechanism 12 13 and the rotation position (angle of the also rotor DR for a part of substrate transport mechanism 12 is measured by device frame 13 Position) rotation position testing agency (constitute in detail referring to Fig. 4 and Fig. 8) 14.Furthermore make in being equipped with to project in exposure device EX For the light supply apparatus CNT of the laser (pulsed light) of description light beam LB.The description of the ultraviolet wavelength band domain projected from light supply apparatus CNT Light beam LB, is organized into intended optical state in drawing apparatus 11 on one side and is one-dimensionally scanned by optical profile type sweep mechanism, one Side becomes the point light projection of set diameter in the rotor DR outer peripheral surface in substrate transport mechanism 12 is kept and transported In substrate P.

Exposure device EX shown in FIG. 1 is accommodated in tempering room EVC.Tempering room EVC passes through the vibrationproof list being passively or actively The setting face E of manufacturing works is arranged in first SU1, SU2.Anti-vibration unit SU1, SU2 is located on the E of setting face, is set to reduce to come from Set the vibration of face E.Tempering room EVC is inhibited accordingly in the substrate P of inside conveying by the way that inside is held in determined temperature because of temperature Change in shape caused by degree.

Secondly, illustrating the substrate transport mechanism 12 of exposure device EX referring to Fig.1.Substrate transport mechanism 12, from removing for substrate P Sending direction upstream side to rise sequentially has marginal position controller EPC, driving idler wheel DR4, tension adjustment idler wheel RT1, rotor DR, tension adjustment idler wheel RT2, driving idler wheel DR6 and driving idler wheel DR7.

The substrate P that marginal position controller EPC adjustment is transported from processing unit U1 is in the position of width direction (Y-direction). Marginal position controller EPC can opposite mesh with width direction end (edge) position for the substrate P sent from processing unit U1 Cursor position keeps substrate P mobile in width direction in the range of ± ten several μm~tens of μm of degree, corrects substrate P in width The position in direction.In addition, marginal position controller EPC preferably exists to the positioning accuracy of the width direction (Y-direction) of substrate P The adjustable range that is, drawing apparatus 11 of exposure position (describing position) can adjust the range of the scan position of some light.

Drive idler wheel DR4, on one side clamp from marginal position controller EPC transport substrate P tow sides while Substrate P, is sent to the downstream side of conveyance direction by rotation, and substrate P is transported toward rotor DR.Rotor DR on one side will During pattern in substrate P part to be exposed is supported to cylinder planar, with the rotation centerline AX2 for extending Y-direction is on one side The heart is rotated around rotation centerline X2, transports substrate P whereby.To rotate such rotor DR around rotation centerline AX2, Yu Xuan The two sides for turning cylinder DR are equipped with axis (shaft) portion Sf2, this axle portion Sf2 coaxial with rotation centerline AX2, are endowed from not The turning moment of the driving source (motor or reduction gear etc.) of diagram.Also, passing through rotation centerline AX2 and extending the side Z To face be center face p3.2 groups of tension adjustments idler wheel RT1, RT2 are assigned both to the substrate P for being supported on rotor DR is wound Determine tension.2 groups of driving idler wheel DR6, DR7 are separated by predetermined distance configuration in the conveyance direction of substrate P, assign to the substrate P after exposure Give set relaxation DL.Pass through the upstream side rotation of the substrate P of driving idler wheel DR6 clamping conveying, driving idler wheel DR7 clamping conveying Substrate P downstream side rotation, substrate P is transported to processing unit U2 accordingly.At this point, substrate P has been due to being endowed loose DL, Because that can absorb the variation of the conveying speed for the substrate P that relatively driving idler wheel DR6 is generated in conveyance direction downstream side, isolation is fast because transporting The influence of the variation of degree exposure-processed caused by substrate P.

To which substrate transport mechanism 12 can be controlled the substrate P transported from processing unit U1 by marginal position Device EPC is adjusted in the position of width direction.The adjusted substrate P in the position of width direction is passed through drive by substrate transport mechanism 12 Dynamic idler wheel DR4 is transported to tension adjustment idler wheel RT1, will be transported by the substrate P of tension adjustment idler wheel RT1 to rotor DR. Whereby, substrate P is tightly attached in the state that strip direction is endowed set tension rotor DR outer peripheral surface and is supported.Substrate Transport mechanism 12 is accordingly transported the substrate P for being supported in rotor DR to tension adjustment by rotating rotor DR Idler wheel RT2.The substrate P of conveying to tension adjustment idler wheel RT2 is transported to driving idler wheel DR6, will be transported by substrate transport mechanism 12 Substrate P to driving idler wheel DR6 is transported to driving idler wheel DR7.Then, substrate transport mechanism 12 passes through driving idler wheel DR6 and drive Dynamic idler wheel DR7, on one side to substrate P assign relaxation DL, while substrate P transported to processing unit U2.

Secondly referring again to Fig. 2, illustrate the device frame 13 of exposure device EX.Fig. 2 shows the main portion of the exposure device of Fig. 1 Configuration perspective view.In Fig. 2, it is identical orthogonal with Fig. 1 that X-direction, Y-direction and Z-direction, which are an orthogonal orthogonal coordinate system, Coordinate system.Exposure device EX has the dress of drawing apparatus 11 and the rotor DR of supporting substrates transport mechanism 12 shown in FIG. 1 Set frame 13.

Device frame 13 shown in Fig. 2, from the lower side of Z-direction sequentially have body frame 21, three point seat supporting parts 22, 1st optical platform 23, rotating mechanism 24 and the 2nd optical platform 25.Body frame 21 passes through Anti-vibration unit as shown in Figure 1 SU1, SU2 setting are on setting face E.Body frame 21, by rotor DR and tension adjustment idler wheel RT1 (not shown), RT2 branch It holds into rotatable.1st optical platform 23 is located at the vertical direction upper side of rotor DR, is set by three point seat supporting parts 22 It is placed in body frame 21.1st optical platform 23 (is supported) dynamic with 3 supporting-points by three point seat supporting parts 22 by steel ball and V slot Ground bearing, it is adjustable in the Z-direction position of each supporting-point.Therefore, three point seat supporting parts 22 can adjust the flat of the 1st optical platform 23 The Z-direction height of table top or the inclination of relative level.Also, when the assembling of device frame 13, body frame 21 and three point seats Between supporting part 22, position adjustment can be carried out in x-direction and y-direction in the face XY.On the other hand, in the group of device frame 13 After dress, then become fixed state (rigid state) between body frame 21 and three point seat supporting parts 22.But, in maintenance Calibration etc. whens, visual necessity make three point seat supporting parts 22 become can in body frame 21 fine motion in the construction in the direction XY.

2nd optical platform 25 is located at vertical direction (Z-direction) upper side of the 1st optical platform 23, passes through rotating mechanism 24 It is set to the 1st optical platform 23.2nd optical platform 25, flat surface are parallel with the flat surface of the 1st optical platform 23.In the 2nd light Platform 25 is learned, multiple (this implementation form is five) equipped with drawing apparatus 11 describe module UW1~UW5.Rotating mechanism 24, can In the state that each flat surface of the 1st optical platform 23 and the 2nd optical platform 25 is kept into parallel, to extend Z-direction Set rotary shaft I (also known as rotation centerline) centered on, opposite 1st optical platform 23 keeps the 2nd optical platform 25 accurate It rotates a little.This rotary shaft I extends Z-direction in base position, in the median plane p3 in Fig. 1 and by wound on rotation Both fixed points in the substrate P surface (along the curved description face of periphery) of cylinder DR (referring to Fig. 3).Rotating mechanism 24, passes through The 2nd optical platform 25 is rotated relative to the 1st optical platform 23, it can accurate adjustment rotor DR or multiple description modules The angle position in the face XY of the whole opposite substrate P for being wound in rotor DR of UW1~UW5.

Rotating mechanism 24, by opposite with the internal diameter for surrounding the part near the side rotor DR for describing module UW1~UW5 Be configured at 23 top side of the 1st optical platform and 25 following side of the 2nd optical platform each cyclic annular pedestal, be rotatably arranged in Bearing ball (roller) etc. between this cyclic annular pedestal is constituted.

Then, explanatory diagram 1, Fig. 4, light supply apparatus CNT shown in fig. 5.The sheet of device frame 13 is arranged in light supply apparatus CNT On body frame 21.The laser of the description light beam LB projected from light supply apparatus CNT, suitable for the photonasty functional layer in substrate P The light of the given wavelength band domain of exposure and it is set as photolytic activity and acts on strong ultra-violet (UV) band.As light source, using the of such as YAG Three higher hamonic wave lasers (wavelength 355nm) and be continuous oscillation or the laser etc. vibrated with the frequency pulse of 50~100MHz degree Laser light source.

As the high output laser light source of ultra-violet (UV) band, typically it has been known that there is using gases such as KrF, ArF, XeCL as laser The excimer laser of medium.In addition, the laser two that the ultra-violet (UV) band below wavelength 450nm has oscillation peak can be also used in The solid state light emitters such as pole pipe, light emitting diode (LED).In this implementation form, as an example, such as International Publication number WO1999/ 046835 or International Publication number WO2001/020733 is disclosed to use fiber amplifier and nonlinear optical element, will project The ultraviolet pulse light that the light (pulsed light of infrared region) from solid state light emitter of long wavelength light is converted into wavelength 355nm (shines Time be number picosecond degree) laser light source.

The description light beam LB projected from such light supply apparatus CNT, as shown in Figure 4, Figure 5, by the inclusion of multiple polarized beam splittings The light beam distribution system of device PBS or reflecting mirror etc. and be conducted to each of five description module UW1~UW5.Describe light beam LB in order to Inhibit preferably to be set as substantially being totally reflected in polarizing beam splitter because of the energy loss of the transmission or reflection generation in polarizing beam splitter Or the polarized condition of substantially total transmissivity.

Secondly, the drawing apparatus 11 for exposure device EX illustrates.Drawing apparatus 11 uses multiple description modules (also known as Describe head) UW1~UW5 so-called Multibeam (also known as Multihead-type) drawing apparatus 11.This drawing apparatus 11, will be from light source The description light beam LB disagreement that device CNT is projected is a plurality of, and multiple description light beam LB of disagreement are formed by light along base A plurality of (being, for example, 5 articles in the 1st implementation form) description line LL1~LL5 on plate P is scanned respectively.Drawing apparatus 11, will be with Multiple each patterns described in substrate P for describing line LL1~LL5 are engaged in the width direction of substrate P each other.It is first First, referring to Fig. 3, illustrate to scan a plurality of description line LL1 that multiple description light beam LB are formed in substrate P accordingly with drawing apparatus 11 ~LL5.

As shown in figure 3, a plurality of description line LL1~LL5, the circumferential direction for clipping median plane p3 in rotor DR are configured to 2 Row.In line LL1 is described in the substrate P of direction of rotation upstream side, configure odd number the 1st, the 3rd description line LL3 and the 5th describes line LL5.Describe line LL2 and the 4th in the substrate P in the direction of rotation rotor DR downstream side, configure even number the 2nd and describes line LL4。

It is each describe line LL1~LL5 in the width direction (Y-direction) of substrate P, namely along the rotation center of rotor DR Line AX2 is formed, short in the length of width direction compared with substrate P.It is each to describe line LL1~LL5 for rigorous, to be removed by substrate It is minimum with a plurality of bonding error for describing the resulting pattern of line LL1~LL5 when mechanism 12 being sent to transport substrate P with reference speed, Can relative rotation cylinder DR rotation centerline AX2 tilt first retainer amount.

Line LL1 is described in the 1st of odd number, the 3rd description line LL3 and the 5th describes line LL5, in the axis direction of rotor DR Predetermined distance configuration.Also, the 2nd of even number the describes the description line LL4 of line LL2 and the 4th, in the axis direction phase of rotor DR It is configured away from predetermined distance.Describe between the description of line LL1 and the 3rd line LL3 at this point, the 2nd description line LL2 is configured in axis direction the 1st. Describe between the description of line LL2 and the 4th line LL4 likewise, the 3rd description line LL3 is configured in axis direction the 2nd.4th describes line LL4 Describe line LL3 and the 5th the 3rd in axis direction configuration to describe between line LL5.In addition, the 1st~the 5th describes line LL1~LL5 configuration At the Y-direction overall with for covering the exposure area A7 being depicted in substrate P.

The description light beam LB's for describing line LL1, the 3rd description line LL3 and the 5th description line LL5 scanning along the 1st of odd number The scanning direction (main scanning direction) of point light is one-dimensional square, the same direction.Also, the along even number the 2nd describes line LL2 and the 4th The scanning direction for describing the description light beam LB of line LL4 scanning is one-dimensional square, the same direction.At this point, describing line along odd number The scanning direction of the description light beam LB of LL1, LL3, LL5 scanning and the description light beam LB for describing line LL2, LL4 scanning along even number Scanning direction be the same direction.Therefore, from the point of view of the conveyance direction of substrate P, the description that odd number describes line LL3, LL5 starts Describe description end position (end of scan point of point light) phase of line LL2, LL4 with even number in position (the scanning starting point of point light) Adjacent (consistent in Y-direction or a part repeats), likewise, odd number describes the description end position and even number of line LL1, LL3 The description starting position for number describing line LL2, LL4 is adjacent (consistent in Y-direction or a part repeats).

Secondly, illustrating drawing apparatus 11 referring to Fig. 4 to Fig. 7.Drawing apparatus 11, with above-mentioned multiple description module UW1~ UW5, disagreement optical system (or also known as light distribution system) SL, Yi Jiyong by the description light beam LB disagreement from light supply apparatus CNT With the calibration detection system 31 calibrated.

The description light beam LB disagreement projected from light supply apparatus CNT is a plurality of by disagreement optical system SL, and by a plurality of of disagreement Describe light beam LB and is individually directed multiple description module UW1~UW5.Disagreement optical system SL, having will project from light supply apparatus CNT Describe 1st optical system 41 of the light beam LB disagreement by 2 articles, the 2nd light that the description light beam LB with 41 disagreement of the 1st optical system irradiates Be the 3rd optical system 43 that another description light beam LB of 42, Ji Yi, 1 optical system, 41 disagreement is irradiated.Also, disagreement optical system SL, comprising keeping light beam LB traversing XY of two dimension in the face vertical with beam axis before the disagreement in the 1st optical system 41 integrally second-class Divide (halving) adjustment mechanism 44 and keeps the light beam LB in the 3rd optical system 43 two-dimentional horizontal in the face vertical with beam axis Halve adjustment mechanism 45 in the unilateral side XY of shifting.A part of the side disagreement optical system SL, light supply apparatus CNT is set to body frame 21, on the other hand, the another part for describing the side module UW1~UW5 is then set to the 2nd optical platform 25.

1st optical system 41 has 1/2 wavelength plate 51, polarizing beam splitter 52, diffuser (beam diffuser) the 53, the 1st Reflecting mirror 54, the 1st relay lens 55, the 2nd relay lens 56, the 2nd reflecting mirror 57, the 3rd reflecting mirror 58, the 4th reflecting mirror 59 and 1st beam splitter 60.

The description light beam LB projected from light supply apparatus CNT toward +X direction is irradiated in 1/2 wavelength plate 51.1/2 wavelength plate 51 exists Describe rotatable in the shadow surface of light beam LB.It is irradiated in the description light beam LB of 1/2 wavelength plate 51, polarization direction is corresponding 1/2 The set polarization direction of the rotation amount of wavelength plate 51.Polarizing beam splitter 52 is irradiated in by the description light beam LB of 1/2 wavelength plate 51. The description light beam LB that polarizing beam splitter 52 becomes set polarization direction is penetrated, on the other hand by retouching other than set polarization direction It draws light beam LB and is reflected towards +Y direction.Therefore, the description light beam LB reflected with polarizing beam splitter 52, due to passing through 1/2 wavelength plate 51, Therefore can pull together to act by 1/2 wavelength plate 51 and polarizing beam splitter 52, the beam intensity of light beam LB is described in adjustment.Namely It says, rotates 1/2 wavelength plate 51, so as to describe the polarization direction variation of light beam LB, can adjust whereby anti-in polarizing beam splitter 52 The beam intensity of the description light beam LB penetrated.

It is perforated through the description light beam LB of polarizing beam splitter 52, is absorbed by diffuser 53, inhibition is irradiated in diffuser 53 leakage for describing the past outside light beam LB.It is anti-that the 1st is irradiated in by the description light beam LB that polarizing beam splitter 52 is reflected towards +Y direction Penetrate mirror 54.It is irradiated in the description light beam LB of the 1st reflecting mirror 54, +X direction is reflected towards by the 1st reflecting mirror 54, it is saturating via the 1st relaying Mirror 55 and the 2nd relay lens 56 are irradiated in the 2nd reflecting mirror 57.It is irradiated in the description light beam LB of the 2nd reflecting mirror 57, by the 2nd reflection Mirror 57 is reflected towards -Y direction and is irradiated in the 3rd reflecting mirror 58.It is irradiated in the description light beam LB of the 3rd reflecting mirror 58, by the 3rd reflecting mirror 58 are reflected towards -Z direction and are irradiated in the 4th reflecting mirror 59.It is irradiated in the description light beam LB of the 4th reflecting mirror 59, by the 4th reflecting mirror 59 It is reflected towards +Y direction and is irradiated in the 1st beam splitter 60.It is irradiated in the description light beam LB of the 1st beam splitter 60, part of it is reflected It is irradiated in the 2nd optical system 42 toward -X direction, on the other hand, another part transmits and is irradiated in the 3rd optical system 43.

3rd reflecting mirror 58 and the 4th reflecting mirror 59 predetermined distance on the rotary shaft I of rotating mechanism 24 are arranged.Also, packet Composition until containing the 3rd reflecting mirror 58 to light supply apparatus CNT (in the Z-direction upper side of Fig. 4, the part surrounded with 2 lines) Set on 21 side of body frame, comprising the 4th reflecting mirror 59 to multiple compositions for describing module UW1~UW5 (below the Z-direction of Fig. 4 Side, the part surrounded with 2 lines) it is set to 25 side of the 2nd optical platform.Therefore, even if keeping the 2nd optics flat with rotating mechanism 24 Platform 25 is rotated relative to the 1st optical platform 23, due to being equipped with the 3rd reflecting mirror 58 and the 4th reflecting mirror 59 on rotary shaft I, is retouched The optical path for drawing light beam LB will not change.To even if making opposite 1st optical platform 23 of the 2nd optical platform 25 with rotating mechanism 24 Rotation, also can will from be arranged in 21 side of body frame light supply apparatus CNT project description light beam LB, very suitably guide to It is located at each of multiple description module UW1~UW5 of 25 side of the 2nd optical platform.

2nd optical system 42, by the description light beam LB of a side of 41 disagreement of the 1st optical system, disagreement is oriented to aftermentioned odd number Number describe module UW1, UW3, UW5.2nd optical system 42, have the 5th reflecting mirror 61, the 2nd beam splitter 62, the 3rd beam splitter 63, with And the 6th reflecting mirror 64.

It is reflected to the description light beam LB of -X direction in the 1st beam splitter 60 of the 1st optical system 41, is irradiated in the 5th reflecting mirror 61.It is irradiated in the description light beam LB of the 5th reflecting mirror 61, -Y direction is reflected towards by the 5th reflecting mirror 61, and is irradiated in the 2nd beam splitter 62.It is irradiated in the description light beam LB of the 2nd beam splitter 62, part of it is reflected and be irradiated in 1 description module UW5 of odd number (referring to Fig. 5, Fig. 6).It is irradiated in the description light beam LB of the 2nd beam splitter 62, other a part penetrate and are irradiated in the 3rd beam splitter 63.It is irradiated in the description light beam LB of the 3rd beam splitter 63, part of it is reflected and be irradiated in 1 description module UW3 of odd number (referring to Fig. 5, Fig. 6).It is irradiated in the description light beam LB of the 3rd beam splitter 63, other a part penetrate and are irradiated in the 6th reflecting mirror 64.The description light beam LB for being irradiated in the 6th reflecting mirror 64 is reflected and is irradiated in 1 description module of odd number by the 6th reflecting mirror 64 UW1 (referring to Fig. 5, Fig. 6).In addition, being irradiated in the description light beam that odd number describes module UW1, UW3, UW5 in the 2nd optical system 42 LB, opposite -Z direction are slightly slanted.

3rd optical system 43 will be in the description light beam LB of another party of 60 disagreement of the 1st beam splitter of the 1st optical system 41, disagreement It is oriented to aftermentioned even number and describes module UW2, UW4.3rd optical system 43 has the 7th reflecting mirror 71, the 8th reflecting mirror 72, the 4th point Beam device 73 and the 9th reflecting mirror 74.

In the description light beam LB that the 1st beam splitter 60 of the 1st optical system 41 is penetrated toward Y-direction, it is irradiated in the 7th reflecting mirror 71. It is irradiated in the description light beam LB of the 7th reflecting mirror 71, X-direction is reflected towards by the 7th reflecting mirror 71, is irradiated in the 8th reflecting mirror 72.Irradiation In the description light beam LB of the 8th reflecting mirror 72, -Y direction is reflected towards by the 8th reflecting mirror 72, is irradiated in the 4th beam splitter 73.It is irradiated in The description light beam LB of 4th beam splitter 73, part of it reflected and be irradiated in even number 1 description module UW4 (referring to Fig. 5, Fig. 6).It is irradiated in the description light beam LB of the 4th beam splitter 73, other a part penetrate and are irradiated in the 9th reflecting mirror 74.It is irradiated in The description light beam LB of 9 reflecting mirrors 74 is reflected and is irradiated in 1 description module UW2 of even number by the 9th reflecting mirror 74.In addition, in 3rd optical system 43 is irradiated in the description light beam LB that even number describes module UW2, UW4, is also slightly slanted with respect to -Z direction.

As previously discussed, light supply apparatus CNT will be come from towards multiple description module UW1~UW5 in disagreement optical system SL Description light beam LB disagreement be it is a plurality of.At this point, the 1st beam splitter 60, the 2nd beam splitter 62, the 3rd beam splitter 63 and the 4th beam splitter 73, Its reflectivity (penetrance) is adjusted to reflectivity appropriate depending on describing the ramification number of light beam LB, so as to be irradiated in multiple description modules The beam intensity of the description light beam LB of UW1~UW5 is same intensity.

XY integrally halves adjustment mechanism 44, as shown in fig. 6, configuration the 2nd relay lens 56 and the 2nd reflecting mirror 57 it Between.XY, which integrally halves adjustment mechanism 44, can make the light beam LB for injecting the 1st beam splitter 60 two-dimentional in the face vertical with beam axis Ground is displaced a little, adjusts the position of the light beam especially by the 2nd optical system 42.XY halves 44 system of adjustment mechanism integrally with energy Tilted Plane-parallel Transparent Materiel glass and Plane-parallel Transparent Materiel glass structure that can be tilted in the face YZ of Fig. 6 in the face XZ of Fig. 6 At.By adjusting each tilt quantity of the two panels parallel plate glass, and it can make the light beam LB for injecting the 1st beam splitter 60 in Fig. 6 X-direction or Z-direction be displaced a little.

Adjustment mechanism 45 is halved in the unilateral side XY, configures between the 7th reflecting mirror 71 and the 8th reflecting mirror 72.The unilateral side XY is second-class Divide adjustment mechanism 45 that the light beam LB for penetrating the 1st beam splitter 60 can be made two-dimensionally to be displaced a little in the face vertical with beam axis, adjusts The position of the whole light beam especially by the 3rd optical system 43.Adjustment mechanism 45 is halved in the unilateral side XY and XY integrally halves adjustment Mechanism 44 similarly, with can the tilted Plane-parallel Transparent Materiel glass in the face XZ of Fig. 6 with can be in tilted saturating in the face YZ of Fig. 6 Bright parallel plate glass is constituted.By adjusting each tilt quantity of the two panels parallel plate glass, and can make to inject retouching for even number The position description light beam LB for drawing module UW2, UW4 is displaced a little.In addition, should be clear from from Fig. 6 composition, integrally halved by XY Light beam LB position displacement caused by adjustment mechanism 44, due to the light beam for also making to penetrate the 1st beam splitter 60 and the 3rd optical system 43 of injection The position displacement of LB, therefore the position adjustment system for injecting the light beam of description module UW2, UW4 of even number is integrally halved with XY Adjustment mechanism 44 and the unilateral side XY are halved both adjustment mechanisms 45 and are carried out.

With further reference to Fig. 4, Fig. 5 and Fig. 7, illustrate multiple description module UW1~UW5.Multiple description module UW1~UW5 Corresponding a plurality of description line LL1~LL5 setting.It is injected respectively by a plurality of description light beam LB of disagreement optical system SL disagreement multiple Describe module UW1~UW5.It is each to describe module UW1~UW5, make a plurality of description light beam LB optically focused on each description line LL1~LL5 At light, and scan the light.Also that is, the 1st description module UW1, which will describe light beam LB, is directed at the 1st description line LL1, similarly, the 2~5 description module UW2~UW5 will describe light beam LB and be directed at the 2nd~the 5th description line LL2~LL5.

As shown in Fig. 4 (and Fig. 1), multiple description module UW1~UW5 clip median plane p3 in the circumferential direction of rotor DR It is configured to 2 rows.Multiple description module UW1~UW5 describe line LL1, LL3, LL5 in clipping median plane p3 configuration the 1st, the 3rd, the 5th Side (the -X direction side of Fig. 5), configuration the 1st describe module UW1, the 3rd describe module UW3 and the 5th describe module UW5.1st retouches Module UW1, the 3rd description module UW3 and the 5th description module UW5 are drawn, is configured in Y-direction predetermined distance.Also, multiple descriptions Module UW1~UW5 configures the 2nd, the 4th side (the +X direction side of Fig. 5) for describing line LL2, LL4, configuration the in clipping median plane p3 2, which describe module UW2 and the 4th, describes module UW4.2nd describes module UW2, describes module UW1 and the 3rd the 1st in Y-direction configuration Describe between module UW3.Likewise, the 3rd describes module UW3, describes module UW2 and the 4th the 2nd in Y-direction configuration and describe mould Between block UW4.4th describes module UW4, describes module UW3 and the 5th the 3rd in Y-direction configuration and describes between module UW5.Also, As shown in figure 4, the 1st describes module UW1, the 3rd description module UW3 and the 5th describes module UW5 and the 2nd and describes module UW2 and the 4th Describe module UW4, in terms of Y-direction, using median plane p3 as center balanced configuration.

Secondly, illustrating each description module UW1~UW5 referring to Fig. 4.Also, since each description module UW1~UW5 is phase isomorphism At, therefore be illustrated so that the 1st describes module UW1 (hereinafter, only claiming to describe module UW1) as an example.

Description module UW1 shown in Fig. 4 for along line LL1 (the 1st describes line LL1) is described, light beam LB is described in scanning, and has Light deflector 81, polarizing beam splitter PBS, 1/4 wavelength plate 82, scanner 83, bending mirror 84, f- θ lens system 85 and Y multiplying power Amendment optical component 86.Also, adjacent with beam splitter PBS is biased to be equipped with calibration detection system 31.

Light deflector 81 is constituted with such as acousto-optic light modulation (AOM:AcoustIic Optic Modulator), passes through height Switch generation/non-generation of the diffraction light of the light beam of injection fastly, and switch at high speed describe light beam LB to the projection of substrate P/ Non- projection.Whereby, it is irradiated in the intensity of the point light of substrate P, according to the pattern plotter information (string for being applied to modulator (AOM) 81 The position row signal of column) by modulation.Specifically, the description light beam LB from disagreement optical system SL, through 91 phase of relay lens The incident light deflector 81 that p- Z-direction is slightly slanted.When light deflector 81 is OFF state, describe light beam LB i.e. with inclination State is straight, and is arranged on through 92 shading of barn door after light deflector 81.Light deflector 81 be ON state when, through around The description light beam LB penetrated is biased to toward -Z direction, is located at by the injection of light deflector 81 inclined in the Z-direction of light deflector 81 Beam splitter PBS.Therefore, during light deflector 81 is ON, the point light for describing light beam LB is persistently projeced into substrate P, in light During deflector 81 is OFF, the point light for describing light beam LB is interrupted the projection of substrate P.

The description light beam LB that polarizing beam splitter PBS reflection is irradiated from light deflector 81 through relay lens 93.On the other hand, Polarizing beam splitter PBS and 1/4 wavelength plate 82 being located between polarizing beam splitter PBS and scanner 83 pull together to act, and penetrate in base The description light beam LB of plate P or rotor DR surface reflection.That is, from 81 directive polarizing beam splitter PBS's of light deflector The laser for describing the linear polarization that light beam LB is S polarisation, by polarizing beam splitter PBS reflection.Also, by polarizing beam splitter PBS reflection Description light beam LB, by 1/4 wavelength plate 82 become rotatory polarization reach substrate P.Substrate P or rotor DR surface reflection, A part of reflected light of the description light beam LB returned through f- θ lens system 85 or scanner 83, again by 1/4 wavelength plate 82, become the linear polarization of P polarisation whereby.Therefore, the reflection of the description light beam LB of polarizing beam splitter PBS is irradiated in from substrate P Light penetrates polarizing beam splitter PBS.In addition, the reflected light of the description light beam LB of polarizing beam splitter PBS is penetrated, through relay lens 94 It is irradiated in calibration detection system 31.Through relay lens system 93 in the description light beam LB of polarizing beam splitter PBS reflection, pass through 1/4 Wavelength plate 82 and inject scanner 83.

As shown in Fig. 4 and Fig. 7, scanner 83 has reflecting mirror 96, polygonal rotating mirror 97 and origin detector 98.Pass through The description light beam LB (collimated light beam) of 1/4 wavelength plate 82, is irradiated in reflecting mirror 96 through relay lens 95.It is reflected in reflecting mirror 96 Description light beam LB be irradiated in polygonal rotating mirror 97.Polygonal rotating mirror 97 includes the rotary shaft 97a for extending Z-direction and is formed Multiple reflectings surface (plane of reflection) 97b around rotary shaft 97a and constitute.Polygonal rotating mirror 97, by being with rotary shaft 97a Center is rotated toward set direction of rotation, makes the angle of reflection consecutive variations for the description light beam LB for being irradiated in reflecting surface 97b accordingly, according to This, makes description line LL1 scanning of the description light beam LB of reflection in substrate P.In the description light beam LB that polygonal rotating mirror 97 reflects It is irradiated in bending mirror 84.The origin that origin detector 98 detects the description light beam LB for describing line LL1 scanning along substrate P is (set Scan starting point).Origin detector 98 clips in the description light beam LB of each reflecting surface 97b reflection, configures the phase in reflecting mirror 96 It tosses about.Therefore, origin detector 98 detects to be irradiated in the description light beam LB before f- θ lens system 85.That is, origin is examined Device 98 is surveyed, detects the angle of the reflecting surface 97b of the description starting position eve for the description line LL1 that light is irradiated in substrate P Spend position.

The description light beam LB for being irradiated in bending mirror 84 from scanner 83 is bent the reflection of mirror 84 and is irradiated in f- θ lens system 85.F- θ lens system 85 includes telecentricity f- θ lens, makes the description light beam reflected through bending mirror 84 from polygonal rotating mirror 97 LB is vertically projeced into the description face of substrate P.

As shown in fig. 7, multiple multiple scanners 83 described in module UW1~UW5 are relative to median plane p3 at bilateral symmetry It constitutes.Multiple scanners 83,3 scanners 83 configuration corresponding with module UW1, UW3, UW5 is described is rotor DR's Direction of rotation upstream side (the -X direction side of Fig. 7), 2 scanners 83 corresponding with module UW2, UW4 is described, which then configure, to be rotated The direction of rotation downstream side (the +X direction side of Fig. 7) of cylinder DR.And 2 scannings of 3 scanners 83 of upstream side and downstream side It is oppositely disposed that device 83 clips median plane p3.At this point, each scanner 83 for being configured at upstream side and each scanning for being configured at downstream side It is oppositely disposed that device 83 clips median plane p3.Furthermore 3 polygonal rotating mirrors 97 of upstream side, on one side in XY to the left (counterclockwise) Rotation, light beam LB is described in scanning on one side, is projeced into each point light of odd number described on line LL1, LL3, LL5 whereby, i.e., from retouching Starting position is drawn to scan towards description end position toward set scanning direction (such as +Y direction of Fig. 7).On the other hand, work as downstream 2 polygonal rotating mirrors 97 of side on one side in XY to the right it is (clockwise) rotation, while scan description light beam LB, be projeced into idol whereby The several numbers each point light described on line LL2, LL4, i.e., from starting position is described towards description end position, past 3 with upstream side Item describes line LL1, LL3, LL5 same scan direction (+Y direction) scanning.

Herein, when observing in the face XZ of Fig. 4, describe the description light that module UW1, UW3, UW5 reach substrate P from odd number The axis of beam LB, with the setting consistent direction rhumb line Le1.That is, setting rhumb line Le1 links odd number in the face XZ Number describe line LL1, LL3, LL5 and rotation centerline AX2 line.Likewise, being retouched when being observed in the face XZ of Fig. 4 from even number The axis that module UW2, UW4 reaches the description light beam LB of substrate P is drawn, with the setting consistent direction rhumb line Le2.That is, Rhumb line Le2 is set, and in the face XZ, connection even number describes the line of line LL2, LL4 and rotation centerline AX2.

Y multiplying power amendment optical component 86 will be born in cylindrical lens of the Y-direction with positive refracting power with having in Y-direction The cylindrical lens person of being composed of refracting power configures between f- θ lens system 85 and substrate P.By making to constitute the amendment of Y multiplying power With at least one fine motion of multiple cylindrical lenses of optical component 86 in the optical axis (axis for describing light beam LB) of f- θ lens system 85 Direction, and the description line LL1~LL5 formed with each description module UW1~UW5 can be made, in Y-direction, the amplification a little of the side of grade or It reduces.

The drawing apparatus 11 constituted by this method controls each portion in describing predetermined pattern in substrate P by control device 16.? That is control device 16, during the description light beam LB for being projeced into substrate P is scanned toward scanning direction in, according to wait describe In CAD (Computer Aided Design) information of the pattern of substrate P, by carrying out ON/OFF modulation to light deflector 81 Make to describe light beam LB accordingly and be biased to, in depicting pattern on the photoinduction layer of substrate P.Also, control device 16 makes along description line The scanning direction (scanning start time point) of the descriptions light beam LB of LL1 scanning and substrate P are removed by the way that the rotation of rotor DR is past The mobile synchronization in direction is sent, predetermined pattern is described in the corresponding part for describing line LL1 in the A7 of exposure area accordingly.

At this point, the virtual size of the point light by the description light beam LB projected from each description module UW1~UW5 in substrate P (point diameter) is set as D (μm), when by being set as Vp (μm/second) along the scanning speed for the point light for describing line LL1~LL5, light supply apparatus The luminous cycle T repeatedly (second) for the laser light source for projecting pulsed light is set as T < D < Vp relationship by CNT.In addition, so-called light Virtual size (diameter) is the width (half value overall with) or phase of half value relative to peak value of the light main scanning direction in intensity distribution It is 1/e to peak value²Intensity width.

Secondly, illustrating aligming microscope AM1, AM2 as pattern detection portion referring to Fig. 3 and Fig. 8.Aligming microscope AM1, AM2 detect the alignment mark being previously formed in substrate P in set viewing area or are formed on rotor DR Reference mark and reference pattern etc..Hereinafter, by the reference mark and reference pattern of the alignment mark of substrate P and rotor DR, It is referred to simply as marking.Aligming microscope AM1, AM2 are used to carry out the position pair of substrate P with the predetermined pattern being depicted in substrate P It (is aligned) together or the calibration of rotor DR and drawing apparatus 11.

Aligming microscope AM1, AM2 are arranged compared with the description line LL1~LL5 formed with drawing apparatus 11 in rotor DR Direction of rotation upstream side.Also, aligming microscope AM1 is configured on the direction of rotation of rotor DR compared with aligming microscope AM2 Swim side.

Aligming microscope AM1, AM2, by illumination light is projeced into substrate P or rotor DR and is injected in label generation Light as detection probe to object lens system GA and will transmit through to the picture of the label of object lens system GA light (bright visual field picture, Dark field picture, fluorescent picture etc.) it with the photography that two-dimensional CCD, CMOS etc. are shot is that GD etc. is constituted.Also, to mutatis mutandis illumination light It is the light of wavelength band domain that hardly there is sensitivity to the photoinduction layer in substrate P, the light of such as 500~800nm of wavelength degree.

Aligming microscope AM1 is in line in Y-direction (width direction of substrate P) equipped with multiple (such as 3).Equally , aligming microscope AM2 is in line in Y-direction (width direction of substrate P) equipped with multiple (such as 3).That is, right Quasi- microscope AM1, AM2 are total to be equipped with 6.

It is it can be readily appreciated that showing 3 alignments in each couple of object lens system GA of 6 aligming microscopes AM1, AM2 in Fig. 3 The configuration of each couple of object lens system GA1~GA3 of microscope AM1.Each couple of object lens system GA1~GA3 of 3 aligming microscope AM1 To viewing area (detection position) Vw1~Vw3 on substrate P (or outer peripheral surface of rotor DR), as shown in figure 3, with rotation Turn the parallel Y-direction of center line AX2, is configured with predetermined distance.As shown in figure 8, passing through the center each viewing area Vw1~Vw3 Optical axis L a1~La3 of each couple of object lens system GA1~GA3, it is all parallel with the face XZ.Likewise, 3 aligming microscope AM2's is each right Object lens system GA to viewing area Vw4~Vw6 on substrate P (or outer peripheral surface of rotor DR), as shown in figure 3, with rotation Turn the parallel Y-direction of center line AX2, is configured with predetermined distance.As shown in figure 8, passing through the center each viewing area Vw4~Vw6 Optical axis L a4~La6 of each couple of object lens system GA, it is also all parallel with the face XZ.And viewing area Vw1~Vw3 and viewing area Vw4~ Vw6 is configured in the direction of rotation of rotor DR with predetermined distance.

This aligming microscope AM1, AM2 is to viewing area Vw1~Vw6 of label, in substrate P and rotor DR, example Such as it is set in the range of 200 μm of diagonal degree.Herein, optical axis L a1~La3 of aligming microscope AM1 that is, to object lens system GA Optical axis L a1~La3, be set to extended from rotation centerline AX2 rotor DR diameter direction setting rhumb line Le3 The same direction.That is, setting rhumb line Le3 links the observation area of aligming microscope AM1 when observing in the face XZ of Fig. 4 The line of domain Vw1~Vw3 and rotation centerline AX2.Likewise, optical axis L a4~La6 of aligming microscope AM2 that is, to object lens It is optical axis L a4~La6 of GA, is set to the setting orientation with the diameter direction for extending rotor DR from rotation centerline AX2 The line Le4 same direction.That is, setting rhumb line Le4, when being observed in the face XZ of Fig. 4, connection aligming microscope AM2's The line of viewing area Vw4~Vw6 and rotation centerline AX2.At this point, aligming microscope AM1 with aligming microscope AM2 due to comparing System's configuration is in the direction of rotation upstream side of rotor DR, therefore median plane p3 and setting rhumb line Le3 angulation, relatively in Heart face p3 and setting rhumb line Le4 angulation are big.

In in substrate P, as shown in figure 3, describing the exposure area A7 of each description of line LL1~LL5 with 5, in X-direction Predetermined distance configuration.Around the exposure area A7 in substrate P, there are multiple alignment marks to carry out position alignment Ks1~Ks3 (is hereinafter referred to as marked), for example formed as crosswise.It is each to describe module, though according to aligming microscope AM1, AM2 couple The testing result of alignment mark Ks1~Ks2, it is specific to go out to be aligned (amendment) to the position in the substrate P of depicting pattern and put light Main scanning direction, but contraposition is not limited to this.For example, can also detect to be formed in substrate P by aligming microscope AM1, AM2 It is aligned after a part of shape of circuit pattern etc..

In Fig. 3, marks-Y side peripheral areas of the Ks1 in exposure area A7 to be arranged at certain intervals in X-direction, mark Ks3 In exposure area, the+Y side peripheral areas of A7 is arranged at certain intervals in X-direction.Further, Ks2 is marked, it is adjacent in X-direction 2 exposure area A7 between white space in, be located at the center of Y-direction.

Ks1 is marked, in the viewing area Vw1 to object lens system GA1 of aligming microscope AM1 and aligming microscope In the viewing area Vw4 to object lens system GA of AM2, the mode that can be sequentially captured during the conveying of substrate P is formed.Also, Mark Ks3, in the viewing area Vw3 to object lens system GA3 of aligming microscope AM1 and aligming microscope AM2 to object In the viewing area Vw6 of lens system GA, the mode that can be sequentially captured during the conveying of substrate P is formed.Further, it marks Ks2, with respectively in the viewing area Vw2 to object lens system GA2 of aligming microscope AM1 and aligming microscope AM2 to object In the viewing area Vw5 of lens system GA, the mode sequentially captured during the conveying of substrate P is formed.

Therefore, the aligming microscope AM1 of the Y-direction two sides of the rotor DR in 3 aligming microscopes AM1, AM2, AM2 can observe or detect at any time label Ks1, the Ks3 for being formed in the width direction two sides of substrate P.In addition, 3 aligming microscopes Aligming microscope AM1, the AM2 in the Y-direction center of the rotor DR in AM1, AM2 can be observed or be detected to be formed in and retouch at any time It is plotted in the label Ks2 of the strip direction gutter of exposure area A7 to each other in substrate P etc..

Herein, exposure device EX is due to being applicable in so-called Multibeam drawing apparatus 11, in order to be retouched with multiple Each description line LL1~LL5 of module UW1~UW5 is drawn to be subject in Y-direction is appropriate each other in the multiple patterns described in substrate P Engagement is necessary multiple joining accuracies for describing module UW1~UW5 are inhibited the calibration in permissible range.In addition, Viewing area Vw1~the Vw6 of aligming microscope AM1, AM2 to multiple each description line LL1~LL5 for describing module UW1~UW5 Relative positional relationship must be subject to accurate find out with benchmark wire management.To carry out this benchmark wire management, must also calibrate.

In to confirm it is multiple describe module UW1~UW5 joining accuracies calibration, to carry out aligming microscope AM1, It, must be at least one setting reference mark of the rotor DR outer peripheral surface of supporting substrates P in the calibration of the benchmark wire management of AM2 Or reference pattern.Therefore, as shown in figure 9, in exposure device EX, the rotation that reference mark or reference pattern are equipped in outer peripheral surface is used Turn cylinder DR.

Rotor DR is formed with a part for constituting aftermentioned rotation position testing agency 14 in two end sides of its outer peripheral surface Scale portion GPa, GPb.Also, rotor DR, in the inside of scale portion GPa, GPb, carves and be equipped with by concave groove or convex in complete cycle Narrow restriction band CLa, CLb of the width that shape edge is constituted.The Y-direction width of substrate P be set to compared with 2 restriction band CLa, The Y-direction interval of CLb is small, and substrate P is close in the outer peripheral surface of rotor DR with inside region folded by restriction band CLa, CLb And it is supported.

Rotor DR is equipped with relative rotation center line AX2 with outer peripheral surface folded by restriction band CLa, CLb with+45 Inclined multiple line pattern RL1 and relative rotation center line AX2 are spent with -45 inclined multiple line pattern RL2 of degree between certain The latticed reference pattern set is repeatedly carved away from (period) Pf1, Pf2, and RMP (is also marked) on the basis of.As an example, line The line width LW of pattern RL1 and line pattern RL2 is set as several μm~20 μm degree, and spacing (period), Pf1, Pf2 were set as tens of μm ~hundreds of μm of degree.

Reference pattern RMP, to avoid generating frictional force or substrate in substrate P and the contact portion of rotor DR outer peripheral surface The variation of the tension of P etc., comprehensive uniform skewing scheme case (oblique lattice-shaped pattern).Also, line pattern RL1, RL2 be not necessarily required to be 45 degree of inclination, can also be that line pattern RL1 is made to, line pattern RL2 parallel with Y-axis to be made the grid in length and breadth parallel with X-axis Shape pattern.In addition, line pattern RL1, RL2 must not necessarily intersected with 90 degree, can also make adjacent 2 bar chart case RL1 with it is adjacent The rectangular area that is surrounded 2 bar chart case RL2, make line pattern to become the angle of the diamond shape other than square (or rectangle) RL1, RL2 intersect.

Secondly, illustrating rotation position testing agency 14 referring to Fig. 3, Fig. 4 and Fig. 8.As shown in figure 8, rotation position detection machine Structure 14 detects the object of the rotation position of rotor DR, the applicable encoder such as using rotary encoder optically System.Rotation position testing agency 14 have be located at the both ends rotor DR scale portion GPa, GPb and with scale portion Multiple encoder head EN1, EN2, EN3, EN4 of each opposite direction of GPa, GPb.In Fig. 4 and Fig. 8, though only display and scale portion 4 encoder heads EN1, EN2, EN3, EN4 of GPa opposite direction, but also similarly have oppositely disposed encoder in scale portion GPb Read head EN1, EN2, EN3, EN4.

Scale portion GPa, GPb is respectively formed as ring-type in the outer peripheral surface circumferential direction entirety of rotor DR.Scale portion GPa, GPb lie in the outer peripheral surface circumferential direction of rotor DR carved with a fixed spacing (such as 20 μm) set grid line concavely or convexly around Grating is penetrated, incremental (incremental) type scale is configured to.In the occasion of this implementation form, the grid line of scale portion GPa, GPb (scale) by then passing through the device processed to the surface rotor DR, (pattern quarter is set with reference pattern RMP shown in Fig. 9 Machine etc.) it is formed simultaneously, therefore unique positional relationship can be made with micron grade.In addition, in scale portion GPa, GPb circumferential direction At one and be equipped with origin mark, encoder head EN1, EN2, EN3, EN4 it is each have detect that the origin is marked and exported The function of origin signal.Therefore to origin label also in reference pattern RMP, circumferential direction to be that unique positional relationship is (known Angular position relative).

Substrate P, scale portion GPa, the GPb for avoiding the both ends rotor DR inside that is, wound on restriction band CLa, The inside of CLb.If there must be stringent configuration relation, the outer peripheral surface of scale portion GPa, GPb are set and wound on rotor DR Substrate P part outer peripheral surface at the same face (away from the same Radius of center line AX2).To reach this, by scale portion GPa, GPb Outer peripheral surface, the substrate winding outer peripheral surface of relative rotation cylinder DR, is made in the amount of thickness of the high substrate P in diameter direction.Therefore, The outer peripheral surface that can will be formed in scale portion GPa, GPb of rotor DR is set as and the substantially same half of the outer peripheral surface of substrate P Diameter.To which encoder head EN1, EN2, EN3, EN4 can be identical as the description face in the substrate P for being wound in rotor DR Diameter direction position detection scale portion GPa, GPb, contract measurement position are generated with processing position because the diameter direction of rotation system is different Abbe error.In addition, also may be used when scale portion GPa, GPb can not be formed directly into the situation at the both ends rotor DR The scale for being equipped with scale portion GPa (GPb) will be being carved with the disc-shaped component outer peripheral surface of rotor DR diameter roughly the same diameter Disk is coaxially installed on the axle portion Sf2 of rotor DR.

Encoder head EN1, EN2, EN3, EN4 are arranged respectively at scale portion GPa, GPb from rotation centerline AX2 Around, in the different location of the circumferential direction of rotor DR.This encoder head EN1, EN2, EN3, EN4 are connected to control dress Set 16.Encoder head EN1, EN2, EN3, EN4 project measurement light beam towards scale portion GPa, GPb, to its reflected beams (diffraction Light) carry out Photoelectric Detection, accordingly will corresponding scale portion GPa, GPb circumferential direction change in location detection signal (such as with 90 Spend 2 phase signals of phase difference) it exports to control device 16.Control device 16, by the detection signal with counting (not shown) Circuit be subject to interpolation carry out digital processing, can with the capacity of decomposition of secondary micron measure rotor DR angle change that is, Measure the circumferential direction change in location of its outer peripheral surface.At this point, control device 16, also can measure base from the angle change of rotor DR Conveying speed of the plate P in rotor DR.

Also, as shown in Figures 4 and 8, encoder head EN1 configuration is on setting rhumb line Le1.Rhumb line Le1 is set, in It is the measurement light beam of link encoder read head EN1 to the projected area (reading position) on scale portion GPa (GPb) in the face XZ With the line of rotation centerline AX2.Also, as described above, setting rhumb line Le1, in the face XZ, for connection describe line LL1, LL3, The line of LL5 and rotation centerline AX2.As known from the above, the reading position of link encoder read head EN1 and rotation centerline AX2 Line, to describe the line of line LL1, LL3, LL5 and rotation centerline AX2 with connection be same orientation line (when from central axis AX2 For same orientation).

Likewise, as shown in Figures 4 and 8, encoder head EN2 configuration is on setting rhumb line Le2.Rhumb line is set Le2 (reads the projected area on scale portion GPa (GPb) in the measurement light beam in the face XZ, being link encoder read head EN2 Position) with the line of rotation centerline AX2.Also, as described above, setting rhumb line Le2, in the face XZ, for connection describe line LL2, The line of LL4 and rotation centerline AX2.As known from the above, the reading position of link encoder read head EN2 and rotation centerline AX2 Line, to describe with connection the line of line LL2, LL4 and rotation centerline AX2 be same orientation line (from central axis AX2 Shi Weixiang Same orientation).

Also, as shown in Figures 4 and 8, encoder head EN3 configuration is on setting rhumb line Le3.Rhumb line Le3 is set, in It is the measurement light beam of link encoder read head EN3 to the projected area (reading position) on scale portion GPa (GPb) in the face XZ With the line of rotation centerline AX2.Also, as described above, setting rhumb line Le3, in the face XZ, for AM1 pairs of aligming microscope of connection The line of the viewing area Vw1~Vw3 and rotation centerline AX2 of substrate P.As known from the above, the reading of link encoder read head EN3 The line of position and rotation centerline AX2, viewing area Vw1~Vw3 and rotation centerline AX2 with connection aligming microscope AM1 Line, be same orientation line (being same orientation when from central axis AX2).By such composition, from Pivot axle AX2 When the direction observation of extension, the measured zone of the encoder head EN3 on scale portion GPa, GPb is with aligming microscope AM1's Viewing area Vw1~Vw3 is same position in the circumferential direction of rotor DR.

Likewise, as shown in Figures 4 and 8, encoder head EN4 configuration is on setting rhumb line Le4.Rhumb line is set Le4 (reads the projected area on scale portion GPa (GPb) in the measurement light beam in the face XZ, being link encoder read head EN4 Position) with the line of rotation centerline AX2.Also, as described above, setting rhumb line Le4, in the face XZ, to link aligming microscope Line of the AM2 to the viewing area Vw4~Vw6 and rotation centerline AX2 of substrate P.As known from the above, link encoder read head EN4 Reading position and rotation centerline AX2 line, with connection aligming microscope AM2 viewing area Vw4~Vw6 and rotation center The line of line AX2 is same orientation line (being same orientation when from central axis AX2).By such composition, from rotation center When the direction observation that axis AX2 extends, the measured zone and aligming microscope of the encoder head EN4 on scale portion GPa, GPb Viewing area Vw4~Vw6 of AM2 is same position in the circumferential direction of rotor DR.

By the setting orientation of encoder head EN1, EN2, EN3, EN4 (centered on rotation centerline AX2 in the face XZ Angle direction) situation that rhumb line Le1, Le2, Le3, Le4 are indicated is arranged when, as shown in figure 4, by multiple description modules It is ± θ ° angled with respect to median plane p3 that UW1~UW5 and encoder head EN1, EN2 are configured to setting rhumb line Le1, Le2.

Herein, control device 16, according to the scale portion (rotational circle of encoder head EN1, EN2 and counting circuit detection Cylinder DR) rotary angle position of GPa, GPb that is, circumferential direction shift position or the amount of movement of rotor DR outer peripheral surface, control Describe the description starting position of module UW1~UW5 using odd number and even number.That is, control device 16, is being projeced into The description light beam LB of substrate P toward scanning direction scan during in, according to the CAD information of the pattern of substrate P to be depicted in carry out The ON/OFF modulation of light deflector 81, but can will also use the ON/OFF modulation of the CAD information of 1 scanning amount of light deflector 81 At the beginning of sequence, carried out according to rotary angle position detected, whereby can on the photoinduction layer of substrate P with good accuracy Depicting pattern.

Also, control device 16, can by store with aligming microscope AM1, AM2 detect alignment mark Ks1 in substrate P~ When Ks3, with the rotary angle position of scale portion GPa, GPb (rotor DR) of encoder head EN3, EN4 detection, it can find out The corresponding relationship of the rotary angle position of the position and rotor DR of alignment mark Ks1~Ks3 in substrate P.Likewise, control Device 16 processed, when detecting the reference pattern RMP on rotor DR by storing with aligming microscope AM1, AM2, with encoder The rotary angle position of scale portion GPa, GPb (rotor DR) of read head EN3, EN4 detection, can find out on rotor DR The corresponding relationship of the rotary angle position of the position and rotor DR of reference pattern RMP.As previously discussed, aligming microscope AM1, AM2, measurement that can be accurate are sampled (sampling) to reference mark or label in viewing area Vw1~Vw6 The rotary angle position (or circumferential direction position) of the rotor DR of moment.In exposure device EX, i.e., according to this measurement result, into Row substrate P and the contraposition (alignment) of predetermined pattern being depicted in substrate P or each description of rotor DR and drawing apparatus 11 The calibration of the positional relationship of description line LL1~LL5 of module UW1~UW5.

In addition, the exposure device EX of Multibeam, on one side by substrate P conveying in conveyance direction, while along in substrate P The point light of light beam LB is described in a plurality of description line LL1~LL5, scanning.Herein, along the description light of each description line LL1~LL5 scanning The scanning direction of beam LB is the same direction, in addition, is set to and median plane p3 (central axis in each each line for describing line LL1~LL5 AX2) when critically parallel situation, pattern P T1~PT5 in substrate P is respectively formed in by a plurality of description line LL1~LL5 As pattern as shown in Figure 10.

Figure 10 is the pattern that will be depicted on substrate by the exposure device of the 1st implementation form and the configuration relation for describing line An example exaggerate display figure.In addition, due to the figure after the conveyance direction of substrate P (direction Xs) expansion, being Xs in Figure 10 Direction, Y-direction and the orthogonal orthogonal coordinate system of Z-direction.Also, describing line LL1~LL5 and pattern in Figure 10 in order to be readily understood by The relationship of PT1~PT5 will describe line LL1~LL5 and pattern P T1~PT5 overstriking in the conveyance direction of substrate P.

As shown in Figure 10, from it is multiple describe module UW1~UW5 it is each be projected to substrate P description light beam LB point light, Along line LL1~LL5 is described, from describing, starting position PO1 is past to describe end position PO2 scanning in +Y direction.At this point, describing light The point light of beam LB is the same direction along the scanning direction for describing line LL1~LL5 scanning.Therefore, in the conveying from substrate P When direction Xs is watched, the end PTa of pattern P T1~PT5 that is formed in the descriptions starting position PO1 for describing line LL1~LL5 and The end PTb of the pattern P T1~PT5 formed in the description end position PO2 for describing line LL1~LL5, in substrate P width The adjacent pattern P T1~PT5 in direction is adjacent one another.

Herein, the pattern P T1~PT5 for being formed in substrate P when the point light for describing light beam LB is to substrate P run-down, Since substrate P is transported in conveyance direction by constant speed, be formed as tilting slightly.Though its tilt quantity exaggerates display in Figure 10, But it is indicated with the ratio Vxs/Vp of the conveying speed Vxs of substrate P and the scan velocity V p for the point light for describing light beam LB.Scanning speed Vp is directly proportional to rotation speed Rv (rps) of polygonal rotating mirror 97 as scanner 83, such as in the anti-of polygonal rotating mirror 97 Penetrating face is 8 faces, is 40% during the essence scanning of each reflecting surface, when the length for describing line (LL1~LL5) is YL (mm), puts light Scan velocity V p (mm/S) found out by following formula:

Vp=(8RvYL)/0.4=20RvYL (mm/S)

If polygonal rotating mirror 97 is every point 6000 turns (rotation speed Rv=100rps), length YL is 50mm, then scans speed Degree Vp is 100,000 mm/S.If the conveying speed Vxs of substrate P is 50mm/S, the tilt quantity Vxs/Vp of the description line in substrate P It is 1/2000.This tilt quantity refers to the Y-direction both ends (describe starting point PO1 and describe end point PO2) for describing line in substrate P It is staggered 25 μm of the meaning toward the direction Xs.Certainly, as long as improving the rotation speed Rv of polygonal rotating mirror 97 and making the conveying speed of substrate P Spending Vxs reduces, then the tilt quantity Vxs/Vp for describing line can be made smaller, but in order to make the Y-direction both ends for describing line (describe starting point PO1 becomes several points of a degree of the minimum feature to depicting pattern with offset of the description end point PO2) in the direction Xs, needs So that the rotation speed Rv of polygonal rotating mirror 97 is become several times or more while the conveying speed Vxs of substrate P is greatly reduced.Also that is, The end PTa for describing pattern P T1~PT5 that starting position PO1 is formed for describing line LL1~LL5, compared in description line LL1~LL5 Describe end position PO2 formed pattern P T1~PT5 end PTb, be formed in the further downstream of conveyance direction.Therefore, scheme The end PTa and end PTb of case PT1~PT5 can become different location in conveyance direction.Under this situation, in the width of substrate P Pattern P T1~PT5 that direction engages can generate each other the engagement mistake in conveyance direction in adjacent pattern P T1~PT5 Difference.

It is fast in the scanning of main scanning direction in the point light for describing light beam LB such as above-mentioned, the bonding error of pattern P T1~PT5 When degree Vp is certain situation, describe inclination of the line LL1~LL5 relative to substrate P width direction, does not become and substrate P transports Speed it is corresponding inclination and generate.Herein, describe inclination of the line LL1~LL5 relative to substrate P width direction, exposing respectively It is adjusted when description before the description of device EX with exposure device EX.

Specifically, exposure device EX is before the description of exposure device EX (such as when alignment) with preset benchmark Reference speed (Vxs) transport substrate P.At this point, reference speed, there is the occasion suitably changed in response to the substrate P used.Such as In the low occasion of the sensitivity for the photoinduction layer for being coated on substrate P, also there is the main scanning that reduces reference speed and will carry out with light Repeatedly to increase the situation of light exposure.Therefore, in order to the substrate transported with reference speed, by pattern P T1~PT5 in base Plate P width direction very suitably engages, and because of the reference speed of reply substrate P setting, is adjusted to describe line LL1~LL5 phase Median plane p3 (central axis AX2) is suitably tilted.

Also, in the description movement of exposure device EX progress, though by the rotation drive control of rotor DR at substrate P Transporting speed becomes reference speed, but at this point, sometimes because of the construction (bearing characteristics) of the rotary shaft bearing portion of rotor DR or Rotary drive mechanism (torque factor, characteristic of reduction gearing of motor etc.), make the conveying speed of the substrate P transported in response in The swing circle of rotor DR and change speed slightly from reference speed.Also that is, removing by the rotor DR substrate P transported Send speed that can periodically generate speed unevenness.Therefore making pattern in order to the substrate P from reference speed slight variations speed PT1~PT5 is very suitably engaged in substrate P width direction, and composable substrate P of following transports the variation of speed and makes to describe Dynamically (active) is inclined constitutes (control system) for each line of line LL1~LL5.

Secondly, 1 illustrating to describe inclined adjustment of the line LL1~LL5 relative to substrate P width direction referring to Fig.1.Figure 11 is aobvious Show the figure of the pattern being depicted on substrate by the exposure device of the 1st implementation form and the configuration relation an example for describing line.1st The exposure device EX of implementation form is to rotate the 2nd optical platform 25 relative to the 1st optical platform 23 with rotating mechanism 24, by This keeps description line LL1~LL5 integral inclined relative to substrate P width direction.Also that is, rotating mechanism 24, which plays adjustment, describes line The inclined tilt adjusting mechanism function of LL1~LL5.

Rotating mechanism 24, by rotating the 2nd optical platform 25 relative to the 1st optical platform 23, and in rotary shaft I being The heart rotates drawing apparatus 11 relative to substrate P.After drawing apparatus 11 is rotated centered on rotary shaft I, description line LL1~ LL5, mutual position relationship and opposing substrate P width direction are (also that is, the rotation centerline AX2 of rotor DR Or median plane p3) inclination.

Herein, illustrate in the alignment of exposure device EX to the substrate P transported with reference speed by pattern P T1~PT5 in The tilt adjustments of description line LL1~LL5 when substrate P width direction engages.As shown in figure 11, control device 16, according to The reference speed for the substrate P that rotation position testing agency 14 is detected rotates rotating mechanism 24.Herein, the reference speed of substrate P, Corresponding relationship is established with the rotation amount of rotating mechanism 24.This rotation amount exists for the end PTa and end PTb of pattern P T1~PT5 Conveyance direction can become the rotation that the rotation amount of same position that is, pattern P T1~PT5 can be formed along substrate P width direction It measures (tilt quantity).Also that is, control device 16, is according to the rotation amount for establishing corresponding relationship with detected substrate P reference speed Rotate rotating mechanism 24.Specifically, control device 16, when being formed with pattern P T1~PT5 shown in Fig. 10, according to base The reference speed of plate P rotates rotating mechanism 24, is located at conveying side whereby with the description starting position PO1 for describing line LL1~LL5 To the upstream side, the description end position PO2 of description line LL1~LL5 is located at the mode in the downstream side of conveyance direction, opposing substrate P Rotate drawing apparatus 11.

As shown in figure 11, do not change the mutual alignment relation for describing line LL1~LL5 and made to describe line by rotating mechanism 24 After LL1~LL5 is integrally tilted, the description line LL1 of side apart from each other and description line LL5 with rotary shaft I, in conveyance direction Amount of movement becomes larger, and on the other hand, is closer to the description line LL3 of the side of rotary shaft I, becomes smaller in the amount of movement of conveyance direction.Also that is, Describe line LL1 substantially to move toward the upstream side of conveyance direction, and describes line LL2 and then moved slightly toward the upstream side of conveyance direction. Describe line LL3 substantially without the movement in conveyance direction.Describe line LL4 to move slightly toward the downstream side of conveyance direction, describes line LL5 is substantially moved toward the downstream side of conveyance direction.Therefore, the description after being rotated by rotating mechanism 24 (after tilt correction) Line LL1~LL5 and be depicted in each pattern P T1~PT5 in substrate P, as shown in the dotted line of Figure 11, be formed as wide with substrate P Direction substantially common direction is spent without inclination.

On the other hand, each pattern P T1~PT5 exposed (after tilt correction) after rotation, in the conveyance direction of substrate P, phase It should being formed slopely in slightly different position in description line LL1~LL5.Also that is, pattern P T5 opposed patterns PT4 is formed in and removes The downstream side in direction is sent, pattern P T4 opposed patterns PT3 is formed in the downstream side of conveyance direction, pattern P T3 opposed patterns PT2 shape At in the downstream side of conveyance direction, pattern P T2 opposed patterns PT1 is formed in the downstream side of conveyance direction.As above-mentioned, with rotation When the situation for rotating drawing apparatus 11 by rotating mechanism 24 centered on axis I, because postrotational pattern P T1~PT5 is being transported The position in direction is different, will lead to postrotational pattern P T1~PT5 in conveyance direction and generates intended offset amount.Therefore, control dress 16 are set, according to the reference speed of the substrate P detected with rotation position testing agency 14, controls retouching for each description module UW1~UW5 Time point is drawn, corrects postrotational pattern P T1~PT5 whereby in the position of conveyance direction.Also that is, the reference speed of substrate P also with The correction amount for describing time point establishes corresponding relationship.Herein, control device 16 will be in order to be depicted in base in order to correct description time point Plate P and the CAD information used is corrected in conveyance direction.

Figure 12 is shown in the figure of the image of CAD information used in the exposure device of the 1st implementation form.In addition, Figure 12 In, as the CAD information of the pattern wait be depicted in substrate P, diagram has CAD diagram corresponding with pattern P T1~PT5 shown in Figure 11 Case CAD1~CAD5.Also, the CAD diagram before amendment with CAD diagram case CAD1~CAD5 shown in dotted line, to describe time point of Figure 12 Case (initial data in design) CAD1~CAD5, Figure 12 with CAD diagram case CAD1~CAD5 shown in solid, to describe time point Revised CAD diagram case CAD1~CAD5.

As shown in dotted lines in Figure 12, CAD diagram case CAD1~CAD5's before amendment is each, in order to with substrate to be depicted in The identical configuration of pattern P T1~PT5 on P is described and is deposited in the memory circuit for describing the data (bit patterns), in base It is same position in the conveyance direction of plate P.Therefore, CAD diagram case CAD1~CAD5 before amendment, along the width direction of substrate P Configuration is in a row.

Control device 16, CAD diagram case CAD1~CAD5 before this is corrected, with postrotational pattern P T1 shown in Figure 11 The side for conjunction that~PT5 becomes the mode of same position in conveyance direction that is, the end PTa of pattern P T1~PT5, PTb adjoin one another Formula is corrected CAD diagram case CAD1~CAD4 in conveyance direction using CAD diagram case CAD5 as benchmark.Also that is, control device 16, it is shown in solid such as Figure 12, corresponding to pattern P T1~PT5 after being rotated shown in Figure 11 conveyance direction position offset, The each of CAD diagram case CAD1~CAD5 before amendment is corrected in conveyance direction.The amendment, such as by will be from memory Circuit read successively CAD diagram case CAD1~CAD5 before amendment it is respective describe the data point at the beginning of (bit patterns) be staggered into Row.

In addition, offset of the pattern P T1~PT5 shown in dotted line with Figure 11 in conveyance direction, due to as above with The conveying speed of substrate P establishes corresponding relationship, therefore control device 16 carries out CAD diagram case CAD1 according to the conveying speed of substrate P Amendment of~the CAD5 in conveyance direction (reading described the data starts being staggered for time point).In revised CAD information, CAD Pattern CAD5 is located at the upstream side of conveyance direction, the position with respect to CAD diagram case CAD3 CAD diagram case CAD4 with respect to CAD diagram case CAD4 In the upstream side of conveyance direction, CAD diagram case CAD3 is located at the upstream side of conveyance direction, CAD diagram case with respect to CAD diagram case CAD2 CAD2 is located at the upstream side of conveyance direction with respect to CAD diagram case CAD1.In addition, control device 16, though using CAD diagram case CAD5 as base Quasi- amendment other CAD diagrams case CAD1~CAD4, but can be also modified on the basis of other CAD diagram case CAD1~4.

In this way, control device 16, in the alignment of exposure device EX, with the base detected with rotation position testing agency 14 The conveying speed of plate P correspondingly, amendment with CAD diagram case CAD1~CAD5 shown in solid of Figure 12 in the position of conveyance direction, Whereby can as Figure 11 pattern P T1~PT5 shown in solid and be depicted in substrate P.

In addition, the inclined adjustment of description line LL1~LL5 in the alignment of exposure device EX, it can be by making to rotate manually Mechanism 24 rotates, and also can be allowed to rotate with control device 16 drive control rotating mechanism 24.

Secondly, explanation is in the description of exposure device EX, to from reference speed due to speed unevenness speed only slight variations And the substrate P transported simultaneously, by description line LL1~LL5 of the pattern P T1~PT5 when width direction of substrate P engages Tilt adjustments.As shown in figure 11, rotating mechanism 24, to the substrate P transported with reference speed, make to describe line LL1~LL5 relative to Substrate P width direction tilts given degree, whereby very suitably engages pattern P T1~PT5 in substrate P width direction.

It is being formed in substrate P after transporting substrate P with the conveying speed fast compared with reference speed from state shown in Figure 11 Pattern P T1~PT5, be formed obliquely as shown in Figure 10.Also that is, the end PTa of pattern P T1~PT5, compared with pattern P T1~PT5 End PTb be formed in the further downstream of conveyance direction.On the other hand, it is removed in substrate P with the conveying speed slow compared with reference speed After sending, the pattern P T1~PT5 being formed in substrate P is inversely tilted (in Figure 10 past with pattern P T1~PT5 shown in Fig. 10 Bottom right inclination) it is formed.Also that is, the end PTa of pattern P T1~PT5, the end PTb compared with pattern P T1~PT5 are formed in conveying side To more upstream side.

Control device 16 becomes in the conveying speed of the substrate P detected with rotation position testing agency 14 compared with benchmark speed When spending fast, started with describing description of the description starting position PO1 compared with description line LL1~LL5 of reference speed of line LL1~LL5 Description of the description end position PO2 compared with reference speed that position PO1 is located at the more upstream side of conveyance direction, describes line LL1~LL5 The description end position PO2 of line LL1~LL5 is located at the mode of the further downstream of conveyance direction, rotates rotating mechanism 24, from figure It is whole further around rotating clockwise that 11 state makes to describe line LL1~LL5.Also, after rotating rotating mechanism 24, after rotation Pattern P T1~PT5 position can conveyance direction deviate at pattern P T1~PT4 is located at conveyance direction compared with pattern P T2~PT5 More upstream side.Therefore, control device 16, using the CAD information to be depicted in substrate P, with CAD diagram case CAD1~CAD4 compared with CAD diagram case CAD2~CAD5 is located at the mode of the further downstream of conveyance direction, corrects in conveyance direction and describes time point (from memory Circuit reads the reading described the data and starts time point).

On the other hand, control device 16, the substrate P detected with rotation position testing agency 14 conveying speed compared with base When Quasi velosity is slow, to describe the description for describing line LL1~LL5 for describing starting position PO1 compared with reference speed of line LL1~LL5 Starting position PO1 is located at the further downstream of conveyance direction, describes the description end position PO2 of line LL1~LL5 compared with reference speed The mode for the more upstream side that the description end position PO2 for describing line LL1~LL5 is located at conveyance direction rotates rotating mechanism 24. Also, the position of postrotational pattern P T1~PT5 can be deviated in conveyance direction into pattern P T1 after rotating rotating mechanism 24 ~PT4 is located at the further downstream of conveyance direction compared with pattern P T2~PT5.Therefore, control device 16, using to be depicted in substrate P CAD information, in such a way that CAD diagram case CAD1~CAD4 is located at the more upstream side of conveyance direction compared with CAD diagram case CAD2~CAD5, Time point (time point since memory circuit reads the reading described the data) is described in conveyance direction amendment.

Such as above-mentioned, control device 16, in the description of exposure device EX, even if substrate P is due to speed unevenness from benchmark speed It spends only slight variations speed and is transported simultaneously, it also can be according to the conveying speed and base detected with rotation position testing agency 14 The integral inclined of line LL1~LL5 is described in the difference of Quasi velosity, adjustment.Also, control device 16, by postrotational pattern P T1~ PT5 conveyance direction offset as correction amount, correcting CAD diagram case CAD1~CAD5, (amendment is retouched in the position of conveyance direction Draw and start time point), pattern P T1~PT5 can be depicted in substrate P with the state linearly linked in substrate P width direction whereby On.

In addition, the rotation amount of rotating mechanism 24, preferably finds out according to the reference speed of substrate P, conveying speed in advance.Together Sample, the correction amount of CAD information is also preferably found out according to the reference speed of substrate P, conveying speed in advance.In turn, it can also incite somebody to action The reference speed of substrate P, the displacement from reference speed, the correction amount conduct of the rotation amount of rotating mechanism 24, CAD information are established The related figure of correlativity is found out.Also, in amendment CAD diagram case CAD1~CAD5, in the position of conveyance direction, (amendment, which is described, is opened Beginning time point) when, according to encoder head EN1, EN2 (the rotation position testing agency of Fig. 4 or high de-agglomeration ability shown in Fig. 8 14) angle position (the conveying position of substrate P) of each rotor DR detected starts each description line LL1~LL5's Describe and (starts to describe the data from memory circuit access).Specifically, passing through rotating mechanism calculating with control device 16 The each description starting position PO1 and description end position of issuable pattern P T1~PT5 after the 24 rotation amendments carried out PO2 is created on after the offset of conveyance direction with encoder head EN1, each rotor DR's detected of EN2 Angle position adds the modified correction position information of ± Δ Xs of the corresponding offset.Then, according to the correction position information Start each description (starting to describe the data from memory circuit access) for describing line LL1~LL5.

More than, the 1st implementation form can pass through the conveying speed according to the substrate P detected with rotation position testing agency 14 Degree rotates the 2nd optical platform 25 with rotating mechanism 24, and can adjust the inclination for describing line LL1~LL5.Therefore, edge can be passed through Describe line LL1~LL5 scanning description light beam LB, the pattern P T1~PT5 that will be depicted in substrate P, along substrate P width Direction is linearly formed.Also, correcting CAD diagram case CAD1 after the rotation of the 2nd optical platform 25 carried out by rotating mechanism 24 The description time point of~CAD5, and the pattern P T1~PT5 being depicted in substrate P can be made to become identical in the conveyance direction of substrate P Position.Therefore due to that the pattern P T1~PT5 being depicted in substrate P can be modified in the width direction of substrate P and conveying side Very suitably engaged to (strip direction), thus can inhibit because speed it is uneven caused by bonding error.

Also, the 1st implementation form, can with the conveying speed of the substrate P detected with rotation position testing agency 14 correspondingly, Rotating mechanism 24 is rotated immediately by control device 16.Therefore, even if also can in the description carried out with exposure device EX Inclination of the line LL1~LL5 relative to substrate P width direction is described in adjustment, can also inhibit the cyclical velocity because of rotor DR Uneven and generation bonding error.

Also, the 1st implementation form makes when the conveying speed of substrate P is fast compared with reference speed relative to substrate P width direction Description line LL1~LL5, be inclined to compared with reference speed description line LL1~LL5 description starting position PO1 upstream side, And relatively describe the side farther downstream end position PO2, pattern PT1~PT5 can be very suitably corrected whereby.Also, removing in substrate P When sending speed slow compared with reference speed, makes description line LL1~LL5 relative to substrate P width direction, be inclined to compared with reference speed Describe the description starting position PO1 of line LL1~LL5 and side and relatively describes end position PO2 upstream side, and energy farther downstream Very suitably correct pattern PT1~PT5.

Also, the 1st implementation form, due to can be constituted comprising light deflector 81 and scanner 83 each description module UW1~ UW5, therefore description light beam LB can be scanned in one-dimensional square along line LL1~LL5 is described.

Also, the 1st implementation form, by rotating the drawing apparatus 11 for being set to the 2nd optical platform 25 with rotating mechanism 24, Whereby can on one side maintain to describe the mutual positional relationship of line LL1~LL5, while adjust all inclinations for describing line LL1~LL5. Therefore, control device 16, as long as controlling relevant composition can be made simply due to the rotation for controlling rotating mechanism 24 Composition.

Also, the 1st implementation form, in ruler of the description light beam LB that will be projected from each description module UW1~UW5 in substrate P Very little (point diameter) is set as D (μm), when will describe light beam LB and be set as Vp (μm/second) along the scanning speed for describing line LL1~LL5, light Source device CNT can make the luminous cycle T repeatedly (second) for the laser light source for projecting pulsed light be set as the relationship of T < D/Vp.Therefore, Since the point light for describing light beam LB can be made to repeat in substrate P on one side, light beam LB scanning will be described on one side in scanning direction, therefore During light deflector 81 is ON state, the description line for describing light beam LB is to depict as without interruption continuously in scanning direction Line.

In addition, by rotating the 2nd optical platform 25 with rotating mechanism 24, making 11 phase of drawing apparatus in the 1st implementation form Substrate P is rotated, and the inclination of line LL1~LL5 is described in the adjustment of opposing substrate P width direction.However, it's not limited to that structure At as long as relatively the inclination of line LL1~LL5 is described in adjustment relative to substrate P width direction.Also that is, exposure device EX, the composition that also the rotation centerline AX2 of rotor DR can be made to rotate in the face XY in the face XY centered on rotary shaft I. Under this situation, idler wheel RT1, RT2 (Fig. 1) before and after rotor DR can be at least configured at also in the transport path of substrate P The composition for being integrally formed and being rotated in the face XY centered on rotary shaft I.

[the 2nd implementation form]

Secondly, 3 to Figure 16 exposure device EX for illustrating the 2nd implementation form referring to Fig.1.In addition, being in the 2nd implementation form Avoid with the 1st duplicate record of implementation form, also have and be illustrated only for the part different from the 1st implementation form, to The identical constituent element of 1st implementation form assigns symbol identical with the 1st implementation form and the situation that omits the description.Figure 13 is shown The figure that a part of the f- θ lens system of the exposure device of 2nd implementation form is constituted.Figure 14 shows the f- θ lens system of Figure 13 The figure of the composition of cylindrical lens.Figure 15 shows the pattern being depicted on substrate by the exposure device of the 2nd implementation form and retouches The figure of configuration relation an example of line drawing.Figure 16 shows the pattern being depicted on substrate by the exposure device of the 2nd implementation form With the figure of the configuration relation an example for describing line.The exposure device EX of 1st implementation form, by making the 2nd optics with rotating mechanism 24 Platform 25 rotates, and the inclination for describing line LL1~LL5 is integrally adjusted.In contrast, the exposure device of the 2nd implementation form EX, individually the inclination of each line of line LL1~LL5 is described in adjustment.

In the exposure device EX of 2nd implementation form, as shown in figure 13, f- θ lens system 85 includes telecentricity f- θ lens 85a It is constituted with cylindrical lens 85b.In addition, it is saturating that telecentricity f- θ lens 85a and cylinder in f- θ lens system 85 is omitted in Figure 13 The diagram of other lenses other than mirror 85b.

Telecentricity f- θ lens 85a makes illuminated description light beam LB become directional light in the face XZ, in the Y direction (scanning side To) then become converging light.It is the description light beam LB of directional light in the face XZ, is irradiated toward cylindrical lens 85b.Cylindrical lens 85b is set Between telecentricity f- θ lens 85a and substrate P.Cylindrical lens 85b has and describes line LL1 (LL2~LL5 is also identical) extension The substantially parallel bus in scanning direction has set multiplying power (refracting power) in the direction orthogonal with bus and gathers light beam LB is described Light is at light.Also, as shown in figure 14, cylindrical lens 85b, in order to which each line for finely tuning description line LL1~LL5 is wide relative to substrate P It spends the inclination in direction and can be rotated centered on rotary shaft I1~I5.Rotary shaft I1~I5, comprising being formed in retouching in substrate P Rotary shaft centered on both pinpointing in the description face of line drawing LL1~LL5.Rotary shaft I1~I5, for example, with describe line LL1~ Rotary shaft centered on the center in the direction that LL5 extends, for direction identical with the axis of light beam LB is described.Also that is, odd number Description line LL1, LL3, LL5 rotary shaft I1, I3, I5, with the identical direction setting rhumb line Le1, the description line of even number Rotary shaft I2, the I4 of LL2, LL4, direction identical with setting rhumb line Le2.This cylindrical lens 85b, by driving portion 100 with It is rotated centered on rotary shaft I1~I5, the control device 16 by being connected to driving portion 100 controls the rotation of cylindrical lens 85b. Under the rotation centered on rotary shaft I1~I5 by cylindrical lens 85b, relative to by being projected near rotary shaft I1~I5 In the chief ray of the description light beam in substrate P, base is projeced by two end side of generatrix direction (Y-direction) of cylindrical lens 85b The chief ray of description light beam on plate P, due to orthogonal with any one of the bus of cylindrical lens 85b and rotary shaft I1~I5 Direction tilt slightly, therefore description line LL1~LL5 in substrate P can be made to tilt slightly.

Secondly, referring to Fig.1 5, illustrate to describe inclined adjustment of the line LL1~LL5 relative to substrate P width direction.2nd is real The exposure device EX for applying form is made by rotating cylindrical lens 85b with driving portion 100 come the width direction relative to substrate P Describe line LL1~LL5 inclination.Also that is, cylindrical lens 85b, plays adjustment and describe the respective inclined description line of line LL1~LL5 The function of rotating mechanism.

Driving portion 100 rotates cylindrical lens 85b respectively, makes each description module whereby The width direction inclination of description line LL1~LL5 opposing substrate P of UW1~UW5.

Herein, illustrate that before the description of exposure device EX, (such as when alignment) will scheme the substrate P transported with reference speed The tilt adjustments of description line LL1~LL5 of the case PT1~PT5 when the width direction of substrate P engages.In addition, said circumstances The tilt adjustments of description line LL1~LL5 in 2nd implementation form, due to description line LL1~LL5's in the 1st implementation form Tilt adjustments are roughly the same, therefore omit a part for repeating part and illustrate.As shown in figure 15, control device 16, according to The reference speed control driving portion 100 for the substrate P that rotation position testing agency 14 is detected rotates cylindrical lens 85b.At this time also Similarly, the reference speed of substrate P establishes corresponding relationship with the rotation amount of cylindrical lens 85b.Specifically, control device 16, Rotate cylindrical lens 85b according to the reference speed of substrate P, whereby to describe description starting position PO1 of line LL1~LL5 Description end position PO2 in conveyance direction upstream side, description line LL1~LL5 is located at the mode in the downstream side of conveyance direction, phase Rotate cylindrical lens 85b substrate P.

As shown in figure 15, after tilting description line LL1~LL5 respectively, respectively describe line Position substantially constantization of the LL1~LL5 in conveyance direction.Therefore, base is depicted in by postrotational description line LL1~LL5 Each pattern P T1~PT5 on plate P, such as with the shown in solid of Figure 15, with substrate P width direction substantially common direction straight line Ground is formed, in addition, also becomes same position in substrate P conveyance direction.Such as above-mentioned, pattern P T1~PT5, along substrate P width direction It engages in a row and is formed.

Secondly, explanation is in the description of exposure device EX, to from reference speed due to speed unevenness speed only slight variations And the substrate P transported simultaneously, by description line LL1~LL5 of the pattern P T1~PT5 when width direction of substrate P engages Tilt adjustments.In addition, the tilt adjustments of description line LL1~LL5 in the 2nd implementation form of said circumstances, due to implementing with the 1st The tilt adjustments of description line LL1~LL5 in form are roughly the same, therefore omit a part of explanation to repeating part.Such as Figure 15 Shown, driving portion 100 makes description line LL1~LL5 incline relative to substrate P width direction the substrate P transported with reference speed Oblique given degree whereby very suitably engages pattern P T1~PT5 in substrate P width direction.

It is being formed in substrate P after transporting substrate P with the conveying speed fast compared with reference speed from state shown in Figure 15 Pattern P T1~PT5, i.e., be formed obliquely in such a way that end PTa is located at the further downstream of conveyance direction compared with end PTb.Separately On the one hand, after substrate P is with slow compared with reference speed conveying speed conveying, the pattern P T1~PT5 being formed in substrate P, i.e., with End PTa is formed obliquely compared with the mode of the more upstream side for being located at conveyance direction end PTb.

Control device 16 becomes in the conveying speed of the substrate P detected with rotation position testing agency 14 compared with benchmark speed When spending fast, in the same manner as the 1st implementation form, to describe description of the description starting position PO1 compared with reference speed of line LL1~LL5 The description starting position PO1 of line LL1~LL5 is located at the more upstream side of conveyance direction, describes the description stop bits of line LL1~LL5 The mode that PO2 is located at the further downstream of conveyance direction compared with the description end position PO2 of description line LL1~LL5 of reference speed is set, The driving portion 100 for controlling each cylindrical lens 85b makes to describe line LL1~LL5 inclination.On the other hand, control device 16, with rotation When the conveying speed for the substrate P that position detecting mechanism 14 detects is slow compared with reference speed, opened with describing the description of line LL1~LL5 Beginning position PO1 is located at the further downstream of conveyance direction compared with the description starting position PO1 of description line LL1~LL5 of reference speed, retouches The description end position PO2 of line drawing LL1~LL5 is located at compared with the description end position PO2 of description line LL1~LL5 of reference speed The mode of the more upstream side of conveyance direction, the driving portion 100 for controlling each cylindrical lens 85b make to describe line inclination.

Herein, the inclination of line LL1~LL5 is described in the exposure device EX of the 2nd implementation form, individual adjustment.It therefore, can be across Median plane p3 divides into description line LL1, LL3, LL5 and the downstream of (odd number) description module UW1, UW3, UW5 of upstream side Description the line LL2, LL4 of (even number) description module UW2, UW4 of side and adjust separately inclination.

The speed generated in the description of exposure device EX is uneven, there is the rotation position meeting in the circumferential direction of rotor DR Different situations.Specifically, having the conveying speed in the substrate P of setting rhumb line Le1 and the substrate in setting rhumb line Le2 The different situation of the conveying speed of P.Under this situation, make description the line LL1, LL3, LL5 of odd number and the description line of even number LL2, LL4 opposing substrate P are similarly tilted.In this way, for example as shown in figure 16, there is description the line LL1, LL3, LL5 with odd number The pattern P T1 of formation, PT3, PT5 are formed along substrate P width direction, and another aspect, with the description line LL2 of even number, LL4 Pattern P T2, the PT4 of formation, the situation that opposing substrate P width direction is formed obliquely as shown in the dotted line with Figure 16.Its reason It is, due to description the line LL1, LL3, LL5 of odd number and the description line LL2 of even number, LL4 is separately positioned in the direction Xs, because This waits being depicted in the description of the pattern in the same field in the direction Xs in substrate P, has the time corresponding with substrate P conveying speed Difference.

Rhumb line is being arranged with what the encoder head EN1 of rotation position testing agency 14 was detected in control device 16, detection The conveying speed of the substrate P of Le1, in addition, detection is with the encoder head EN2 detection of rotation position testing agency 14 in setting side The conveying speed of the substrate P of bit line Le2.Then, the detected substrate P in setting rhumb line Le1 is detected in control device 16 Conveying speed and it is detected setting rhumb line Le2 substrate P conveying speed speed difference.In this way, control device 16, to include the conveying speed for detecting the conveying speed in the substrate P of setting rhumb line Le1 with the substrate P in setting rhumb line Le2 The composition of the function as speed difference testing agency of the speed difference of degree.Then, control device 16, according to detected speed Difference, control are set to the driving portion 100 of each cylindrical lens 85b of description the module UW2, UW4 of even number to adjust even number Description line LL2, LL4 inclination.Cylindrical lens 85b rotation adjustment post-exposure in pattern P T2, PT4 in substrate P, with Pattern P T1, PT3, PT5 similarly, are linearly formed along substrate P width direction.

More than, the 2nd implementation form, according to the conveying speed of the substrate P detected with rotation position testing agency 14, with driving Portion 100 rotates cylindrical lens 85b, can adjust separately the inclination for describing line LL1~LL5 whereby.It therefore, can be by along description The description light beam LB of line LL1~LL5 scanning, by the pattern P T1~PT5 being depicted in substrate P along substrate P width direction straight line Ground is formed, in addition, also becomes same position in substrate P conveyance direction.To the pattern P T1~PT5 that can will be depicted in substrate P It is modified to and is very suitably engaged in substrate P width direction and conveyance direction (strip direction), more inhibition removing because of substrate P Bonding error caused by sending speed uneven.

Also, the inclined mechanism (describing line rotating mechanism) that line LL1~LL5 is described in adjustment can use in the 2nd implementation form What is be made of driving portion 100 and cylindrical lens 85b is simply constituted.

Also, the 2nd implementation form, can detect the description line of (odd number) description module UW1, UW3, UW5 of upstream side The conveying of description the line LL2, LL4 of (even number) description module UW2, UW4 of the conveying speed and downstream side of LL1, LL3, LL5 The speed difference of speed correspondingly adjusts the inclination for describing line LL1~LL5 with detected speed difference.Therefore, even if odd number Description module UW1, UW3, UW5 description line LL1, LL3, LL5 description when the conveying speed of the substrate P and description of even number The conveying speed of substrate P different situation when the description of description the line LL2, LL4 of module UW2, UW4, since base can will be depicted in Pattern P T1~PT5 on plate P is modified to and is exposed in the merging that very suitably connects of substrate P width direction and conveyance direction Light, thus can inhibit because speed it is uneven caused by bonding error.

In addition, though rotating description line LL1~LL5 centered on rotary shaft I1~I5, being rotated in the 2nd implementation form Center is not particularly limited.For example, rotary shaft I1~I5 can also be made to describe the description starting position PO1 of line LL1~LL5 or retouch Draw end position PO2.

[the 3rd implementation form]

Secondly, referring to Fig.1 7 explanation the 3rd implementation forms exposure device EX.In addition, the 3rd implementation form also similarly, is Avoid with the 1st and the 2nd duplicate record of implementation form, also have only for the part progress from the 1st and the 2nd implementation form different Illustrate, to constituent element identical with the 1st and the 2nd implementation form, assigns symbol identical with the 1st and the 2nd implementation form and omit The situation of explanation.Figure 17 shows the pattern being depicted on substrate by the exposure device of the 3rd implementation form and describes matching for line Set the figure of an example of relationship.The exposure device EX of 1st implementation form by with rotating mechanism 24 make the 2nd optical platform 25 rotation come The inclination for describing line LL1~LL5 is integrally adjusted.In contrast, the exposure device EX of the 3rd implementation form, is retouched not changing Time point is described in adjustment under the inclined situation of line drawing LL1~LL5.

In the exposure device EX of 3rd implementation form, as shown in figure 17, control device 16 with rotation position testing agency 14 The conveying speed of the substrate P detected or conveying position are correspondingly corrected and describe time point.In addition, describing the amendment and the 1st of time point Implementation form is identical, as shown in figure 12, is corrected in conveyance direction in order to be depicted in CAD information used in substrate P.Also that is, control Device 16 processed, by CAD diagram case CAD1~CAD5 corresponding with the pattern P T1~PT5 being formed in substrate P, with pattern P T1~ The adjoin one another mode of conjunction of the end PTa of PT5, PTb is corrected CAD diagram case CAD1~CAD5 in conveyance direction.

In this way, control device 16, by the alignment of exposure device EX or when describing, and with rotation position testing agency The conveying speed of 14 substrate Ps detected or conveying position correspondingly correct with the CAD diagram case CAD1 shown in solid of Figure 12~ CAD5 can be depicted in substrate P in the position of conveyance direction as pattern P T1~PT5 shown in Figure 17 whereby.

More than, the 3rd implementation form, can according to the conveying speed of the substrate P detected with rotation position testing agency 14 or Position is transported, the description time point of module UW1~UW5 is described in amendment.Therefore, though the pattern P T1~PT5 phase being depicted in substrate P To substrate P width direction at inclination, but due to can be corrected in a manner of connecting together in substrate P width direction, can inhibit because Bonding error caused by speed is uneven.

[the 4th implementation form]

Secondly, referring to Fig.1 8 explanation the 4th implementation forms exposure device EX.In addition, the 4th implementation form also similarly, is Avoid with the 1st~the 3rd duplicate record of implementation form, also have only for the part progress from the 1st~the 3 implementation form different Illustrate, to constituent element identical with the 1st~the 3rd implementation form, assigns symbol identical with the 1st~the 3rd implementation form and omit The situation of explanation.Figure 18 shows the pattern being depicted on substrate by the exposure device of the 4th implementation form and describes matching for line Set the figure of an example of relationship.The exposure device EX of 1st~the 3rd implementation form, along the description for describing line LL1~LL5 scanning The scanning direction of light beam LB is the same direction.In contrast, the exposure device EX of the 4th implementation form, description line LL1~ Along the description line LL1 of description the module UW1, UW3, UW5 of odd number, the scanning for the description light beam LB that LL3, LL5 are scanned in LL5 Direction and the scanning direction of the description light beam LB of description line LL2, the LL4 scanning of description the module UW2, UW4 along even number are Opposite direction.

In the exposure device EX of 4th implementation form, as shown in figure 18, from multiple each projections for describing module UW1~UW5 To the point light of the description light beam LB of substrate P, terminate along description line LL1~LL5 of straight line from past describe of starting position PO1 is described Position PO2 is scanned in the Y direction.At this point, along line LL1, the scanning direction of the point light of the description light beam LB of LL3, LL5 scanning is described With along line LL2 is described, the scanning direction of the point light of the description light beam LB of LL4 scanning is opposite direction.This thing can be by making Fig. 7 Shown in respectively describe the polygonal rotating mirror 97 of module and be achieved toward the same direction (such as around counterclockwise) rotation.

Therefore, by the way that along line LL1 is described, LL3, LL5 (being set on the straight line parallel with median plane p3) scanning are retouched Pattern P T1, PT3, PT5 that light beam LB is formed in substrate P are drawn, is influenced by substrate P conveying speed, and for example Figure 18's It is formed slopely on turning right in paper.Also that is, end PTa on the right side of pattern P T1, PT3, PT5, compared to pattern P T1, PT3, PT5 The end PTb in left side is formed in the further downstream of conveyance direction.On the other hand, by the way that along line LL2 is described, LL45 (is set in On the straight line parallel with median plane p3) scanning description light beam LB be formed in pattern P T2, PT4 in substrate P, removed by substrate P Send the influence of speed, and it is past turn left with pattern P T1, PT3, PT5 opposite direction that is, in the paper of Figure 18 on be formed slopely. Also that is, end PTb on the right side of pattern P T2, PT4, compared to pattern P T2, the end PTa on the left of PT4 is formed in conveyance direction More upstream side.

In turn, if being divided between the direction Xs of description the line LL2, LL4 of description the line LL1, LL3, LL5 and even number of odd number Centainly, the unevenness of no substrate P conveying speed, respectively the rotation speed of the polygonal rotating mirror 97 of description module is consistent, then to describe The end PTb on the right side of the end PTb and pattern P T2 to describe line LL2 description on the left of pattern P T1 that line LL1 describes, in substrate P width direction (Y-direction) is engaged with conveyance direction (direction Xs).Similarly, on the left of the pattern P T2 to describe line LL2 description End PTa with describe line LL3 description pattern P T3 on the right side of end PTa also engaged in the Y direction with the direction Xs, to retouch The end PTb on the right side of the end PTb and pattern P T4 to describe line LL4 description on the left of pattern P T3 that line drawing LL3 describes is also in Y Direction is engaged with the direction Xs, the end PTa on the left of pattern P T4 to describe line LL4 description and the figure to describe line LL5 description End PTa on the right side of case PT5 is also engaged with the direction Xs in the Y direction.

As shown in the 4th implementation form, if making along line LL1 is described, the point light of the description light beam LB of LL3, LL5 scanning is swept Direction is retouched with along line LL2 is described, the scanning direction of the point light of the description light beam LB of LL4 scanning is opposite direction, as long as then base Plate P transports speed without unevenness, even if the pattern P T1~PT5 opposing substrate P width direction (Y-axis) being depicted in substrate P is inclined slightly Tiltedly, it can still be engaged in substrate P width direction.

Figure 19 shows each slightly inclined situation that the pattern P T1~PT5 being depicted in substrate P is corrected such as Figure 18, Herein, in the same manner as previous 2nd implementation form (Figure 14), by the cylindrical lens 85b for making f- θ lens system 85 with driving portion 100 It is rotated a little centered on rotary shaft I1~I5, individually to adjust the inclination for describing line LL1~LL5.

As shown in figure 19, to describe line LL1, the description starting position PO1 of LL3, LL5 are located at the upstream side of conveyance direction (direction-Xs), describe line LL1, the description end position PO2 of LL3, LL5 are located at the downstream side (direction+Xs) of conveyance direction Mode rotates the cylindrical lens 85b opposing substrate P in each description module UW1, UW3, UW5 by driving portion 100.Another party Face, to describe line LL2, the description starting position PO1 of LL4 is located at the upstream side (direction-Xs) of conveyance direction, describes line LL2, The description end position PO2 of LL4 is located at the mode in the downstream side (direction+Xs) of conveyance direction, keeps cylinder saturating by driving portion 100 Mirror 85b opposing substrate P rotation.

As shown in figure 19, after tilting description line LL1~LL5 respectively, after rotation Description line LL1~LL5 and be depicted in pattern P T1~PT5 in substrate P, such as with Figure 19 it is shown in solid with substrate P width The roughly the same direction in direction linearly arranges to be formed, in addition, becomes same position in the conveyance direction (direction Xs) of substrate P.In this way, As long as it is critically certain and uneven without speed that substrate P transports speed, the pattern P T1~PT5 depicted can be wide along substrate P Degree direction linearly connects and is formed as a line.Though in addition, also identical as the 2nd implementation form, the f- θ lens system of odd number The point that the face rotary shaft I1, I3, I5 and Y-Xs of 85 cylindrical lens 85b is intersected, on the line parallel with Y-axis.

In the description of exposure device EX, in the conveying speed of the substrate P of setting rhumb line Le1 and in setting rhumb line The different situation of the conveying speed of the substrate P of Le2, in the same manner as the 2nd implementation form, such as such as with the shown in solid of Figure 20, with The description line LL1 of odd number, the pattern P T1 that LL3, LL5 are formed, PT3, PT5 are formed along substrate P width direction, and another party Face, as shown in the dotted line with Figure 20, the pattern P T2 formed with the description line LL2 of even number, LL4, PT4, opposing substrate P width Direction is formed obliquely.

Therefore, control device 16, detection is with the encoder head EN1 detection of rotation position testing agency 14 in setting side Orientation is being arranged with what is detected with the encoder head EN2 of rotation position testing agency 14 in the conveying speed of the substrate P of bit line Le1 The speed difference of the conveying speed of the substrate P of line Le2.Then, control device 16 adjust even number according to detected speed difference Description line LL2, LL4 inclination.Postrotational pattern P T2, PT4, with pattern P T1, PT3, PT5 are similarly wide along substrate P Degree direction is formed.

More than, the 4th implementation form, according to the conveying speed of the substrate P detected with rotation position testing agency 14, with driving Portion 100 rotates cylindrical lens 85b, can adjust separately the inclination for describing line LL1~LL5 whereby.It therefore, can be by along description The description light beam LB of line LL1~LL5 scanning, the pattern P T1~PT5 being depicted in substrate P is not inclined along substrate P width direction Tiltedly critically engagement is formed, in addition, can also be engaged in same position in the conveyance direction of substrate P.To due to that can will be depicted in Pattern P T1~PT5 in substrate P is modified to very suitably to be engaged in substrate P width direction, therefore even if not as the 1st is real It applies amendment as form and describes time point, bonding error caused by capable of also inhibiting because of speed unevenness.

In addition, the 4th implementation form is also in the same manner as the 2nd implementation form, though make to describe line LL1~LL5 with rotary shaft I1~ It is rotated centered on I5, but rotation center is not particularly limited.For example, rotary shaft I1~I5 can also be made to describe line LL1~LL5's Describe starting position PO1 or describes end position PO2.

Also, in the 1st~the 4th implementation form, though using the scale portion GPa for being formed in rotor DR outer peripheral surface, GPb detection The rotation position (shift position of substrate P) of rotor DR or conveying speed, but not limited thereto is constituted.For example, also can be in Rotor DR installs the scale disk of high out of roundness.This scale disk is carved in outer peripheral surface and is equipped with scale portion GPa, GPb, Yu Xuan Turn the end cylinder DR be fixed into it is orthogonal with rotation centerline AX2.Therefore, scale disk, around rotation centerline AX2 and and rotational circle Cylinder DR integrally rotates.Also, scale disk, is used as base material using metal, glass, ceramics of low-heat exapnsion etc., surveys to improve It measures capacity of decomposition and is made diameter as big as possible (such as diameter 20cm or more).Scale disk is wound in rotational circle by making The diameter of scale the portion GPa, GPb of the outer peripheral surface diameter and scale disk of the substrate P of cylinder DR are consistent (substantially uniform), and can be more Reduce so-called measurement Abbe error.

Furthermore it also can be appropriately combined by each composition of the 1st~the 4th implementation form.Such as it can be on one side such as the 1st implementation form Rotate multiple description module UW1~UW5 integrally a little with rotating mechanism 24, on one side as (or the 4th implement shape to the 2nd implementation form State) as rotate each cylindrical lens 85b of f- θ lens system 85 for describing module UW1~UW5 individually a little.In turn, such as Fig. 3 It is shown, can be by making to be formed in multiple alignment mark Ks1 in substrate P, Ks2, Ks respective positions are micro- with corresponding alignment Mirror AM1 is detected, and constantly measures the two-dimensional dilatation or nonlinear torsional deformation of the exposure field A7 in substrate P Deng tendency.

Therefore, by cooperate with the exposure two-dimensional dilatation of field A7 of aligming microscope AM1 measurement or non-thread Property torsional deformation etc. mode, by each line for describing line LL1~LL5 or it is whole be immediately modified on substrate P surface it is micro- Width inclination, can be by established pattern layer in the exposure field A7 in substrate P and wait the depicting pattern of exposure thereon that coincides Coincide precision exposure field A7 in inhibit everywhere in permissible range.

Also, the 1st~the 4th implementation form, with the outer peripheral surface supporting substrates P of rotor DR and revolve rotor DR Turn, whereby on one side transport substrate P in longitudinal direction, on one side by pattern plotter in the portion of the rotor DR bearing with substrate P The composition divided, but it is not limited to this.For example, can also adsorb the state for being supported on the microscope carrier surface for supporting substrate P plane earth Microscope carrier and substrate P are transported in longitudinal direction, the composition of one side depicting pattern on one side, or also substrate P can be placed in branch In the state of on the flat surfaces of cushion cap, air bearing layer is formed between supporting station surface and the substrate P back side, and on one side with non- Substrate P is supported to planar conveying, the composition of one side depicting pattern by contact or low friction state.

Furthermore the 1st~the 4th implementation form it is each in, describe the whole inclination in the face XY of line LL1~LL5 in adjustment When, though rotate rotating mechanism 24 shown in Fig. 2 a little with the 2nd optical platform 25, it also can be by the axis of axis branch rotor DR The position of the bearing at the portion both ends Sf2 etc. is staggered a little toward X-direction, and keeps rotor DR whole tilted in the face XY.Also, will When being supported on the conveying speed of the longitudinal direction of the substrate P on rotor DR and being changed from reference speed, or in conveying speed Generate speed unevenness when, also can with after the change speed or speed unevenness correspondingly dynamically change delineation unit UW1~UW5 The rotation speed of respective polygonal rotating mirror 97.It also that is, can also be along the point light for each line scanning for describing line LL1~LL5 The ratio of conveying speed (subscan speed) Vxs of the longitudinal direction of scanning speed (main scanning speed) Vp and substrate P, in substrate The situation that P conveying speed has changed also essentially becomes certain mode, controls the rotation speed of polygonal rotating mirror 97.

< manufacturing method >

Secondly, illustrating manufacturing method referring to Figure 21.Figure 21 shows the process of the manufacturing method of each implementation form Figure.

Manufacturing method shown in Figure 21, firstly, carrying out the display that the self-emission device such as using organic EL is formed Function, the performance design of panel, with the circuit pattern of the designs such as CAD and Wiring pattern (step S201).And prepare to wind Have the flexible base plate P (resin film, metal foil film, plastic cement etc.) of the substrate as display panel for apply reel (step S202).In addition, the scroll-like substrate P prepared in this step S202, can be optionally by its surfaction person or in advance It has formed bottom (such as minute asperities by the marking (imprint) mode) person or lamination has the function of photoinduction in advance Film or hyaline membrane (insulating materials) person.

Then, in substrate P formed constitute display panel element with electrode or wiring, insulating film, TFT, (film is partly led Body) etc. compositions backplane level, and the luminescent layer constituted with self-emission devices such as organic EL is formed in a manner of laminated on the bottom plate (display pixel portion) (step S203).In this step S203, also filled comprising being used in the exposure that previous each implementation form illustrates EX is set, the known lithography processes that are exposed to layer of photoresist are coated with photonasty silane coupling agent to photoetching jelly is replaced Substrate P carry out pattern exposure with formed in surface the exposure technology of the pattern of close water-repellancy, to the catalyst layer of photoinduction into Row pattern exposure is to form the wet process of metal film pattern (wiring, electrode etc.) by electroless plating method or to contain silver The processing of the printing technology of the depicting pattern such as the electric conductivity ink of nanoparticle etc..

Then, for roll fashion in each display panel element cutting substrate P continuously manufactured in strip substrate P, Or protective film (barrier layer of resistance to environment) or colored filter film etc., assembly element (step are bonded in each display panel element surface S204).Then, carry out whether display panel element normal actuation or can meet the checking step of be intended to performance and characteristic (step S205).Via with upper type, display panel (flexible display) can be manufactured.

Drawing reference numeral

1 device manufacturing system

11 drawing apparatus

12 substrate transport mechanisms

13 device frames

14 rotation position testing agencies

16 control devices

21 body frames

22 3 point seat supporting parts

23 the 1st optical platforms

24 rotating mechanisms

25 the 2nd optical platforms

31 calibration detection systems

44 XY integrally halve adjustment mechanism

Halve adjustment mechanism in 45 unilateral side XY

51 1/2 wavelength plates

52 polarizing beam splitters

53 diffusers

60 the 1st beam splitters

62 the 2nd beam splitters

63 the 3rd beam splitters

73 the 4th beam splitters

81 smooth deflectors

82 1/4 wavelength plates

83 scanners

84 bending mirrors

85 f- θ lens systems

Optical component is used in the amendment of 86 Y multiplying powers

92 barn doors

96 reflecting mirrors

97 polygonal rotating mirrors

98 origin detectors

100 driving portions

P substrate

U1, U2 processing unit

EX exposure device

AM1, AM2 aligming microscope

EVC tempering room

SU1, SU2 Anti-vibration unit

Face is arranged in E

EPC marginal position controller

RT1, RT2 tension adjustment idler wheel

DR rotor

AX2 rotation centerline

Sf2 axle portion

P3 median plane

DL relaxation

UW1~UW5 describes mould group

CNT light supply apparatus

LB describes light beam

I rotary shaft

LL1~LL5 describes line

PBS polarizing beam splitter

A7 exposes field

SL disagreement optical system (light beam distribution system)

Rhumb line is arranged in Le1~Le4

Vw1~Vw6 viewing area

Ks1~Ks3 alignment mark

GPa, GPb scale portion

EN1~EN4 encoder head

PT1~PT5 pattern

Claims (7)

1. a kind of substrate board treatment, has:

Substrate transport mechanism, on one side support given width substrate, while it is past with aforesaid base plate width side with set speed It is transported to the conveyance direction of intersection；

Drawing apparatus will correspond to aforementioned pattern modulation by modulator in order to which predetermined pattern to be depicted on aforesaid base plate The point light projection of description light beam after intensity in aforesaid base plate, and along with scanner and telecentricity f- θ lens by aforementioned description Light beam one-dimensionally scans the description of the aforementioned light obtained from foregoing width direction in the narrow range of the width compared with aforesaid base plate The description module that line drawing draws aforementioned pattern is multiple in the configuration of foregoing width direction, to pass through each of aforesaid plurality of description module The mode that the pattern being depicted on aforesaid base plate is engaged in aforesaid base plate width direction each other will be arranged in foregoing width direction It is multiple it is aforementioned describe lines in odd numbers and even number in aforementioned conveyance direction be separated by predetermined distance configuration, and oneself before State width direction observation when, by it is aforesaid plurality of describe module odd number with even number relative to aforementioned interval aforementioned The central symmetry of conveyance direction configures；

Substrate speed detector detects the variation of the conveying speed of aforesaid base plate；And

Control device is described in module with aforesaid plurality of in aforesaid base plate width direction odd number adjacent to each other and idol The aforementioned module of describing of a several sides is formed by the aforementioned discribed pattern in end for describing line, and with odd number and the idol Several another party is aforementioned describe module be formed by the aforementioned discribed pattern in end for describing line in aforementioned conveyance direction or The mode that foregoing width direction engages, the variation according to the aforementioned conveying speed detected with aforesaid base plate speed detector Control the aforementioned each description time point for describing module.

2. a kind of substrate board treatment, has:

Substrate transport mechanism, on one side support given width substrate, while it is past with aforesaid base plate width side with set speed It is transported to the conveyance direction of intersection；And

Drawing apparatus will correspond to aforementioned pattern modulation by modulator in order to which predetermined pattern to be depicted on aforesaid base plate The point light projection of description light beam after intensity in aforesaid base plate, and along with scanner and telecentricity f- θ lens by aforementioned description Light beam one-dimensionally scans the description of the aforementioned light obtained from foregoing width direction in the narrow range of the width compared with aforesaid base plate The description module that line drawing draws aforementioned pattern is multiple in the configuration of foregoing width direction, to pass through each of aforesaid plurality of description module The mode that the pattern being depicted on aforesaid base plate is engaged in aforesaid base plate width direction each other will be arranged in foregoing width direction It is multiple it is aforementioned describe lines in odd numbers and even number in aforementioned conveyance direction be separated by predetermined distance configuration, and oneself before State width direction observation when, by it is aforesaid plurality of describe module odd number with even number relative to aforementioned interval aforementioned The central symmetry of conveyance direction configures；

Make to describe to stay in aforesaid base plate width direction and engage the aforementioned description module of odd number of side's pattern and be retouched along aforementioned Line drawing scans the scanning direction of the aforementioned point light for describing light beam, stays in another party that aforesaid base plate width direction engages with description The aforementioned description module of the even number of pattern is inverse along the scanning direction that aforementioned description line scans the aforementioned point light for describing light beam To.

3. substrate board treatment as claimed in claim 1 or 2, wherein aforesaid base plate transport mechanism has rotor, the rotation Turn cylinder with the cylindric periphery surface bearing aforesaid base plate of the certain radius from the center line for extending aforesaid base plate width direction, By rotating around aforesaid central line, transport aforesaid base plate toward aforementioned conveyance direction；

Make the direction and aforementioned rotation by the aforesaid plurality of each aforementioned description line being formed on aforesaid base plate for describing module The direction for turning the center line of cylinder is substantially uniform.

4. it is a kind of in having the device manufacturing system for forming electronic component on flexible strip plate shape substrates, have:

First processing unit is carried out at conveying in the surface of the aforesaid base plate in strip direction and forms the preceding technique of photoinduction layer；

Substrate board treatment as claimed in claim 1 or 2 is transported in using the processing of aforementioned first processing unit in strip side To aforesaid base plate aforementioned photoinduction layer, describe corresponding with aforementioned electronic element pattern；And

Second processing device, to use aforesaid base plate processing unit to handle and transport in strip direction aforesaid base plate carry out after work The processing of skill forms the specific pattern pattern layer of aforementioned electronic element in the surface of aforesaid base plate.

5. a kind of to include in the manufacturing method for forming electronic component on substrate:

Using substrate board treatment described in as claimed in claim 1 or 22, the processing via preceding technique is formed on aforesaid base plate Photoinduction layer, by the way that each aforementioned description light beam of the aforesaid plurality of description module of aforementioned drawing apparatus is put the one-dimensional of light Scanning and the conveying with aforesaid base plate transport mechanism to aforesaid base plate, describe the pattern engaged corresponding with aforementioned electronic element Movement；And

By to use aforesaid base plate processing unit treated aforesaid base plate carry out after technique processing, in shape on aforesaid base plate The movement constructed at the layer of aforementioned electronic element corresponding with the aforementioned pattern engaged.

6. a kind of substrate board treatment, has:

Substrate transport mechanism removes the flexible base plate of given width so that set speed is past with what aforesaid base plate width direction was intersected Direction is sent to transport；

Drawing apparatus will correspond to aforementioned pattern modulation by modulator in order to which predetermined pattern to be depicted on aforesaid base plate The point light projection of description light beam after intensity in aforesaid base plate, and along with scanner and telecentricity f- θ lens by aforementioned description Light beam one-dimensionally scans the description of the aforementioned light obtained from foregoing width direction in the narrow range of the width compared with aforesaid base plate Line, description module to describe aforementioned pattern is multiple to be configured on foregoing width direction, to pass through aforesaid plurality of description module It is each and be depicted in the mode that the pattern on aforesaid base plate is engaged in aforesaid base plate width direction each other, will be arranged in aforementioned The multiple aforementioned odd numbers described in line and even number of width direction are separated by predetermined distance configuration in aforementioned conveyance direction, And when being observed from foregoing width direction, by the aforesaid plurality of odd number for describing module and even number relative to aforementioned interval Aforementioned conveyance direction central symmetry keep；

Describe control unit, according to aforesaid base plate transport mechanism aforesaid base plate toward conveyance direction conveying velocity variations, adjustment with The aforesaid plurality of each corresponding aforementioned description time point for describing the aforementioned pattern in line for describing module；And

Describe line rotating mechanism, a other adjustment corresponds to each of the aforesaid plurality of each aforementioned description line for describing module Toward the inclination of aforementioned width direction.

7. substrate board treatment as claimed in claim 6, wherein aforesaid base plate is in the sheet base that aforementioned conveyance direction is strip Plate；

Aforesaid base plate transport mechanism has:

Rotor has the outer peripheral surface that a part in aforementioned plate shape substrates strip direction is supported to cylinder planar, around set Center axis rotation is to transport aforementioned plate shape substrates toward strip direction；

Scale component, on the outer peripheral surface of radius roughly the same with the radius of aforementioned rotor central axis to aforementioned outer peripheral surface, edge Circumferential direction be formed continuously scale portion, rotated together with aforementioned rotor；And

Encoder head, it is oppositely disposed with the outer peripheral surface of aforementioned scale component, detect the change in location of aforementioned scale portion circumferential direction；

According to the change in location in the aforementioned scale portion detected with aforementioned encoder head, the conveying speed of aforementioned plate shape substrates is measured Variation.