TW202036178A - Pattern drawing apparatus - Google Patents

Abstract

A substrate processing apparatus is provided with: a rotating drum DR for transportation at a prescribed speed in a transportation direction intersecting a width direction of a substrate P; a drawing device 11 having a plurality of drawing modules UW1-UW5 that scan drawing beams projected on the substrate P along drawing lines of the substrate P to draw prescribed patterns on the substrate P, and in which the drawing lines neighboring each other in the width direction are disposed with a prescribed space therebetween in the transportation direction such that the patterns drawn on the substrate P by each of the plurality of drawing modules UW1-UW5 are joined in the width direction; a rotating mechanism 24 that adjusts the relative inclination of the drawing lines with respect to the width direction of the substrate P; and a rotating-position detection mechanism that detects the transportation speed of the substrate P. The relative inclination of the drawing lines is adjusted by the rotating mechanism 24 on the basis of the transportation speed detected by the rotating-position detection mechanism.

Description

Pattern drawing device

The present invention relates to a substrate processing apparatus, a component manufacturing system, and a component manufacturing method.

Conventionally, as a substrate processing apparatus, a scanning type drawing apparatus that draws a predetermined position on a sheet medium (substrate) is known (see, for example, Document 1). The scanning drawing device includes a drawing table, a laser light source, a light modulator, and a scanning optical system. The drawing table is conveyed in the conveying direction (sub-scanning direction) with the medium loaded. The laser light source irradiates the laser light to the light modulator. The optical modulator uses an acousto-optic modulator (AOM: Acousto "Optic" Modulator), for example, to modulate the laser light irradiated from the laser light source. The light modulator, after being switched to ON, deflects the laser light by diffraction to project the laser light onto the medium. On the other hand, after the light modulator is switched to OFF, it does not deflect the laser light and does not project the laser light onto the medium. The scanning optics system scans the laser light emitted from the light modulator in the scanning direction along a predetermined scanning line from the scanning start end to the scanning end end on the medium. Next, the scanning type drawing device, while conveying the medium in the sub-scanning direction by the drawing table, modulates the laser light with the light modulator, and scans the laser light by scanning the laser light modulated by the scanning optical system. Direction to portray the media.

Patent Document 1: Japanese Patent Application Publication No. 2000-227661

In addition, the substrate to be drawn will become larger as the size of the element becomes larger. If the substrate becomes larger, the pattern drawn on the substrate also becomes larger. Here, the scanning drawing device of Patent Document 1 uses one scanning line for drawing. Therefore, when the pattern drawn on the substrate becomes larger, the scanning line formed by the spot light of the laser light becomes longer. However, in the scanning drawing device of Patent Document 1, since the length of the scanning line has its limit, the size of the pattern drawn on the substrate is limited by the length of the scanning line.

Therefore, a so-called multi-beam type drawing method in which a plurality of scanning lines (drawing lines) are used to draw a pattern on a substrate can be considered. This multi-beam type drawing method is to arrange a plurality of drawing lines in the direction of the scanning line. By joining the patterns formed by the scanning lines in the width direction orthogonal to the conveying direction of the substrate, it can be aligned The substrate depicts a larger pattern.

Even if it is a multi-beam type drawing method, the pattern is drawn on the substrate with a plurality of drawing lines while the substrate is transported in the conveying direction. Therefore, the pattern drawn from the drawing start position of each drawing line to the drawing end position is on the substrate When the conveying speed is uneven, the drawing start position and the drawing end position will be located at different positions in the conveying direction with a micron level difference. Therefore, a phenomenon in which the bonding accuracy of adjacent patterns in the width direction of the substrate deteriorates, that is, a bonding error may occur.

The embodiment of the present invention is in view of the above-mentioned problems. The problem is that even if it is a multi-beam type drawing method in which a plurality of drawing lines are connected, it is possible to reduce the joining error between patterns joined in the width direction of the substrate. .

According to the first embodiment of the present invention, there is provided a substrate processing apparatus including: a substrate conveying device that supports a substrate of a predetermined width while conveying it at a predetermined speed in a conveying direction that intersects the width direction of the substrate; and a drawing device having A plurality of drawing modules are used to draw a predetermined pattern on the substrate along a drawing line obtained by scanning the drawing beam projected on the substrate in a narrower range than the width of the substrate in the width direction. Each of the drawing modules and the patterns drawn on the substrate are joined to each other in the width direction of the substrate, and the drawing lines adjacent to each other in the width direction are arranged at a predetermined interval in the conveying direction; tilt adjustment mechanism, The inclination of the drawing line relative to the width direction of the substrate is adjusted; and the substrate speed detection device detects the transport speed of the substrate; according to the substrate transport speed detected by the substrate speed detection device, the tilt adjustment is performed The mechanism adjusts the relative tilt of the aforementioned drawing line.

According to the second aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus of the first aspect of the present invention.

According to a third embodiment of the present invention, there is provided a device manufacturing method, including: using the substrate processing apparatus of the first aspect, scanning the drawing beams from each of the plurality of drawing modules on the light formed on the substrate The action of the sensing layer to describe the pattern to be joined; and the action of processing the substrate to form a layer structure of elements corresponding to the pattern to be joined on the substrate.

The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. Of course, the present invention is not limited to the content described in the following embodiments. In addition, the constituent elements described below include those that can be easily imagined by those with ordinary knowledge in the technical field to which the invention belongs, and those that are substantially the same. In addition, the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

[First Embodiment] FIG. 1 is a diagram showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that applies exposure processing to a substrate P, and the exposure device EX is incorporated in a component manufacturing system 1 that applies various processing to the exposed substrate P to manufacture components. First, the component manufacturing system 1 will be described.

＜Component manufacturing system＞ The component manufacturing system 1 is a production line (flexible electronic component manufacturing line) that manufactures electronic components such as flexible displays, multilayer flexible wiring, and flexible sensors as components. The following implementation aspects will be described with a flexible display as an example of an electronic component. Flexible displays, such as organic EL displays. In this component manufacturing system 1, a flexible long substrate P is rolled into a cylindrical supply reel (not shown) and the substrate P is sent out, and after various processes are continuously applied to the sent substrate P, The processed substrate P is wound as a flexible element on a so-called roll-to-roll (Ro11"to"Ro11) method in which a reel for recycling is not shown. In the component manufacturing system 1 of the first embodiment, the film-like sheet substrate P is sent out from the supply roll, and the substrate P sent out from the supply roll passes through the processing device U1, the exposure device EX, and the processing device U2 in this order After that, it is wound on a reel for recycling. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of metal or alloy such as resin film, stainless steel, and the like. The material of the resin film includes, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polycarbonate. Ester resin, polystyrene resin, polyvinyl alcohol resin and other materials one or more than two kinds.

For the substrate P, it is better to select, for example, the thermal expansion coefficient is not significant, and the amount of deformation due to heat during various treatments performed on the substrate P can be substantially ignored. The coefficient of thermal expansion can be set to be smaller than the threshold value corresponding to the processing temperature, for example, by mixing inorganic fillers in the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, and the like. In addition, the substrate P may be a single layer of ultra-thin glass with a thickness of about 100 μm manufactured by a float method or the like, or a laminate of the above-mentioned resin film, foil, etc. bonded to this ultra-thin glass.

The substrate P configured in this manner is wound into a roll shape to become a supply roll, and this supply roll is mounted in the component manufacturing system 1. The component manufacturing system 1 equipped with a supply reel repeatedly performs various processes for manufacturing components on the substrate P sent from the supply reel in the longitudinal direction. Therefore, on the processed substrate P, patterns for a plurality of components (such as display panels for televisions and computers) are formed in a state of being connected at predetermined intervals in the longitudinal direction. In other words, the substrate P sent out from the supply reel is a multi-sided substrate. In addition, the substrate P may have its surface modified and activated in advance by a predetermined pretreatment, or may have a fine partition structure (concave-convex structure) formed on the surface for precise patterning.

The processed substrate P is wound into a roll shape to be recovered as a recovery roll. The recycling reel is installed in a cutting device not shown. Equipped with a cutting device for recycling rolls, the processed substrate P is divided (cut) into individual components, which are then multiple components. The size of the substrate P, for example, the size in the width direction (the direction of the short side) is about 10cm~2m, and the size in the length direction (the direction of the long strip) will also depend on the supply roll or recycling that can be installed in the processing device The maximum diameter of the reel is used, but it may be hundreds to thousands of meters. In addition, the size of the substrate P (each size of the short side/long side) is not limited to the above-mentioned size. In addition, it does not necessarily have to be a conveyance form of the substrate supplied from the supply reel and recovered to the recovery reel.

Next, the component manufacturing system 1 will be described with reference to FIG. 1. The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. In addition, Fig. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is the direction from the processing device U1 to the processing device U2 via the exposure device EX in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is the direction perpendicular to the X direction and the Y direction (vertical direction).

The processing device U1 is a pre-processing (pre-processing) for the substrate P subjected to the exposure processing by the exposure device EX. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on which a photosensitive functional layer (photosensitive layer) is formed.

Here, the photosensitive functional layer is uniformly or selectively coated on the substrate P as a solution, and dried to become a layer (film). The typical photosensitive functional layer has photoresist, but as a material that is not needed after development, it is a liquid-repellent modified photosensitive silane coupling agent material (SAM) in the part irradiated by ultraviolet rays, or irradiated by ultraviolet rays. Partially exposed the photosensitive reduction material of plating reduction base. When a photosensitive silane coupling agent material is used as the photosensitive functional layer, the pattern part exposed by ultraviolet rays on the substrate P is changed from liquid repellent to lyophilic, so conductive ink is selectively coated on the lyophilic part (Ink containing conductive nano particles such as silver or copper) to form a pattern layer. When a photosensitive reducing material is used as a photosensitive functional layer, the pattern portion exposed by ultraviolet rays on the substrate P exposes the plating reducing group. Therefore, immediately after exposure, the substrate P is immersed in an electroless plating solution containing palladium ions or the like A certain period of time to form (precipitate) palladium pattern layer.

The exposure device EX draws a pattern such as a circuit or wiring for a display panel on the substrate P supplied from the processing device U1. The details will be described later. This exposure device EX exposes a predetermined pattern on the substrate P by scanning a plurality of drawing lines LL1 to LL5 obtained by scanning each of the drawing light beams LB in a predetermined scanning direction. The substrate P after exposure processing in the exposure device EX is sent to the processing device U2, and the processing device U2 performs post-processing (post-processing) on the substrate P. Thereby, a specific pattern layer of the electronic component is formed on the surface of the substrate P.

＜Exposure equipment (substrate processing equipment)＞ Next, the exposure apparatus EX will be described with reference to FIGS. 1 to 9. Fig. 2 is a perspective view showing the configuration of the main parts of the exposure apparatus of Fig. 1. Fig. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing the configuration of the rotating cylinder and the drawing device of the exposure device of FIG. 1. Fig. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of Fig. 1; FIG. 6 is a perspective view showing the structure of a branched optical system of the exposure device of FIG. 1. FIG. FIG. 7 is a diagram showing the arrangement relationship of the scanners provided in the plurality of drawing units of the exposure device of FIG. 1. Fig. 8 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the encoder read head for drawing lines. FIG. 9 is a perspective view showing the surface structure of the rotating cylinder of the exposure device of FIG. 1.

As shown in Fig. 1, the exposure device EX is an exposure device that does not use a mask, and a so-called maskless drawing exposure device (direct drawing exposure machine). By conveying the substrate P in the conveying direction, the drawing beam The spot light of the LB is scanned in a predetermined scanning direction, and the surface of the substrate P is drawn accordingly to form a predetermined pattern.

As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11, a substrate transport mechanism 12, alignment microscopes AM1, AM2, and a control device 16. The drawing device 11 uses a plurality of drawing modules UW1 to UW5 to draw a predetermined pattern on a part of the substrate P transported by the substrate transport mechanism 12. The substrate transport mechanism 12 transports the substrate P transported from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are used to perform relative position alignment between the pattern to be drawn on the substrate P and the substrate P, and to detect the alignment marks formed on the substrate P in advance. The control device 16 controls each part of the exposure device EX to make each part perform processing. The control device 16 may be part or all of a higher-level control device of the control element manufacturing system 1. In addition, the control device 16 may be a device different from the upper control device controlled by the upper control device. The control device 16 includes, for example, a computer.

Furthermore, as shown in FIG. 2, the exposure apparatus EX includes a device frame 13 supporting the drawing device 11 and the substrate transport mechanism 12, and the device frame 13 to measure the rotation position of the rotating cylinder DR which is also a part of the substrate transport mechanism 12 ( Angular position) of the rotation position detection mechanism (refer to Figs. 4 and 8 for details) 14. Furthermore, a light source device CNT that emits laser light (pulsed light) as the drawing beam LB is provided in the exposure device EX. The drawing light beam LB in the ultraviolet wavelength band emitted from the light source device CNT is arranged in the drawing device 11 into a predetermined optical state and scanned one-dimensionally by the optical scanning mechanism, while being a spot light of a predetermined diameter, is projected on the substrate conveyed The outer peripheral surface of the rotating cylinder DR of the mechanism 12 is held on the substrate P to be conveyed.

The exposure device EX shown in Fig. 1 is housed in the chamber EVC. The greenhouse EVC is set on the setting surface E of the manufacturing plant through passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 are installed on the installation surface E to reduce vibration from the installation surface E. The temperature-regulating EVC keeps the inside at a predetermined temperature, thereby suppressing the change in the shape of the substrate P conveyed inside due to temperature.

Next, the substrate transport mechanism 12 of the exposure apparatus EX will be described with reference to FIG. 1. The substrate transport mechanism 12 has an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotating cylinder DR, a tension adjustment roller RT2, a drive roller DR6, and a drive roller DR7 in order from the upstream side in the transport direction of the substrate P .

The edge position controller EPC adjusts the position of the substrate P conveyed from the processing device U1 in the width direction (Y direction). The edge position controller EPC uses the width direction end (edge) position of the substrate P sent from the processing unit U1 to be within the range of ± tens of μm to tens of μm relative to the target position, so that the substrate P is in the width Move in the direction to correct the position of the substrate P in the width direction. In addition, the positioning accuracy of the edge position controller EPC in the width direction (Y direction) of the substrate P is preferably within the adjustable range of the exposure position (drawing position), that is, the range in which the drawing device 11 can adjust the scanning position of the spot light .

The driving roller DR4 rotates while clamping the front and back sides of the substrate P conveyed from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction to convey the substrate P to the rotating cylinder DR. The rotating cylinder DR supports the part of the pattern on the substrate P to be exposed in a cylindrical shape while rotating around the rotation center line X2 around the rotation center line AX2 extending in the Y direction, thereby conveying the substrate P. In order to rotate the rotating cylinder DR around the rotation center line AX2, a shaft portion Sf2 coaxial with the rotation center line AX2 is provided on both sides of the rotating cylinder DR. The shaft portion Sf2 is given from not shown The rotational torque of the driving source (motor or reduction gear mechanism, etc.). In addition, a surface extending in the Z direction passing through the rotation center line AX2 is the center surface p3. The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported by the rotating cylinder DR. Two sets of driving rollers DR6 and DR7 are arranged at a predetermined interval in the conveying direction of the substrate P, and a predetermined slack DL is given to the substrate P after exposure. The drive roller DR6 clamps and rotates the upstream side of the transported substrate P, and the drive roller DR7 rotates the downstream side of the transported substrate P, thereby transporting the substrate P to the processing device U2. At this time, since the substrate P is given a slack DL, it can absorb the change in the conveying speed of the substrate P on the downstream side of the driving roller DR6 in the conveying direction, and isolate the influence of the exposure processing of the substrate P due to the change in the conveying speed.

Therefore, the substrate transport mechanism 12 can adjust the position of the substrate P transported from the processing apparatus U1 in the width direction by the edge position controller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction has been adjusted to the tension adjustment roller RT1 by the driving roller DR4, and transports the substrate P passing the tension adjustment roller RT1 to the rotating cylinder DR. Thereby, the substrate P is supported in close contact with the outer peripheral surface of the rotating cylinder DR in a state where a predetermined tension is applied in the longitudinal direction. The substrate transport mechanism 12 rotates the rotating cylinder DR to thereby transport the substrate P supported by the rotating cylinder DR to the tension adjustment roller RT2. The substrate transfer mechanism 12 transfers the substrate P transferred to the tension adjustment roller RT2 to the drive roller DR6, and transfers the substrate P transferred to the drive roller DR6 to the drive roller DR7. Next, the substrate transport mechanism 12 uses the driving roller DR6 and the driving roller DR7 to transport the substrate P to the processing apparatus U2 while imparting slack DL to the substrate P.

Next, referring to FIG. 2 again, the device frame 13 of the exposure device EX will be described. Fig. 2 is a perspective view showing the configuration of the main parts of the exposure apparatus of Fig. 1. In Fig. 2, the X direction, the Y direction and the Z direction are an orthogonal orthogonal coordinate system, which is the same orthogonal coordinate system as in Fig. 1. The exposure apparatus EX is equipped with the drawing apparatus 11 shown in FIG. 1 and the apparatus frame 13 which supports the rotating cylinder DR of the board|substrate conveying mechanism 12.

The device frame 13 shown in FIG. 2 has a main body frame 21, a three-point support portion 22, a first optical table 23, a rotating mechanism 24, and a second optical table 25 in this order from the lower side in the Z direction. The main body frame 21 is installed on the installation surface E through the anti-vibration units SU1 and SU2 as shown in FIG. 1. The main body frame 21 rotatably supports the rotating cylinder DR and the tension adjustment rollers RT1 (not shown) and RT2. The first optical table 23 is provided on the upper side of the rotating cylinder DR in the vertical direction, and is provided on the main body frame 21 through the three-point seat support portion 22. The three-point support portion 22 dynamically supports the first optical table 23 with three support points (supported by steel balls and V grooves), and the position of each support point in the Z direction can be adjusted. Therefore, the three-point seat support portion 22 can adjust the height of the platform surface of the first optical platform 23 in the Z direction or the inclination relative to the horizontal plane. Moreover, when the device frame 13 is assembled, the position between the main body frame 21 and the three-point seat support 22 can be adjusted in the X direction and the Y direction in the XY plane. On the other hand, after the device frame 13 is assembled, the main body frame 21 and the three-point seat support 22 are in a fixed state (rigid state). However, during calibration during maintenance, the three-point seat support 22 may have a structure capable of fine movement in the XY direction on the main body frame 21 as necessary.

The second optical table 25 is provided on the upper side in the vertical direction (Z direction) of the first optical table 23, and the transmission rotating mechanism 24 is provided on the first optical table 23. The second optical table 25 has a table surface parallel to the table surface of the first optical table 23. The second optical table 25 is provided with a plurality of (five in this embodiment) drawing modules UW1 to UW5 of the drawing device 11. The rotation mechanism 24 can center on a predetermined rotation axis I (also referred to as a rotation center line) extending in the Z direction while keeping the table surfaces of the first optical table 23 and the second optical table 25 parallel. With respect to the first optical table 23, the second optical table 25 is precisely rotated slightly. The rotation axis I, at the reference position, is at the center plane p3 in Fig. 1 extending in the Z direction and passing through a predetermined point on the surface of the substrate P (the drawing surface curved along the circumference) of the rotating cylinder DR (Refer to Figure 3). The rotating mechanism 24 rotates the second optical table 25 relative to the first optical table 23, which can precisely adjust the rotating cylinder DR or the multiple drawing modules UW1 to UW5 as a whole relative to the substrate wound around the rotating cylinder DR The angular position of P in the XY plane.

The rotating mechanism 24 is composed of rings which are arranged on the upper side of the first optical table 23 and the lower side of the second optical table 25 with the inner diameter surrounding the portion closest to the rotating cylinder DR of the drawing modules UW1 to UW5. It is composed of a cylindrical pedestal, and bearing balls (rollers) rotatably arranged between the annular pedestal.

Next, the light source device CNT shown in FIGS. 1, 4, and 5 will be described. The light source device CNT is arranged on the body frame 21 of the device frame 13. The laser light for the drawing light beam LB emitted from the light source device CNT is light of a predetermined wavelength band suitable for exposure of the photosensitive functional layer on the substrate P and is set to an ultraviolet region with strong photoactivity. As the light source, a laser light source such as YAG third harmonic laser light (wavelength 355nm) and laser light that is continuously oscillated or pulsed at a frequency of about 50-100 MHz can be used.

As a high-output laser light source in the ultraviolet region, an excimer laser using KrF, ArF, XeCL and other gases as the laser medium is typically known. In addition, it can also be used in solid-state light sources such as laser diodes and light-emitting diodes (LED) with an oscillation peak in the ultraviolet region with a wavelength below 450nm. In this embodiment, as an example, as disclosed in International Publication No. WO1999/046835 or International Publication No. WO2001/020733, a fiber amplifier and a nonlinear optical element are used to emit long-wavelength light from a solid-state light source (infrared pulse Light) is converted into a pulsed ultraviolet light with a wavelength of 355nm (light emitting time is about several picoseconds).

The drawing light beam LB emitted from such a light source device CNT, as shown in FIGS. 4 and 5, is guided to one of the five drawing modules UW1 to UW5 through a beam distribution system including a plurality of polarizing beam splitters PBS or mirrors, etc. each. In order to suppress the energy loss caused by the transmission or reflection of the polarizing beam splitter, the drawing light beam LB is preferably set to a polarization state of substantially total reflection or substantially total transmission in the polarizing beam splitter.

Next, the drawing device 11 of the exposure device EX will be described. The drawing device 11 is a so-called multi-beam type (also called a multi-head type) drawing device 11 using a plurality of drawing modules (also called drawing heads) UW1 to UW5. This drawing device 11 branches the drawing light beam LB emitted from the light source device CNT into a plurality of light beams, and divides the spot light formed by the branched drawing light beams LB along the plurality of light beams on the substrate P (for example, in the first embodiment 5) The drawing lines LL1～LL5 are scanned separately. The drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning a plurality of drawing light beams LB by the drawing device 11 will be described.

As shown in FIG. 3, a plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. On the substrate P on the upstream side in the rotation direction, odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged. On the substrate P on the downstream side in the rotation direction of the rotating cylinder DR, an even-numbered second drawing line LL2 and a fourth drawing line LL4 are arranged.

The drawing lines LL1 to LL5 are formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating cylinder DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each drawing line LL1 ~ LL5, when the substrate P is transported by the substrate transport mechanism 12 at a reference speed, the joint error of the pattern obtained by the multiple drawing lines LL1 ~ LL5 is the smallest, and the cylinder DR can be rotated relatively The rotation center line AX2 is inclined by a predetermined angle.

The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the axial direction of the rotating cylinder DR. In addition, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at predetermined intervals in the axial direction of the rotating cylinder DR. At this time, the second drawing line LL2 is arranged in the axial direction between the first drawing line LL1 and the third drawing line LL3. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. In addition, the first to fifth drawing lines LL1 to LL5 are arranged to cover the full width of the exposure area A7 drawn on the substrate P in the Y direction.

The scanning direction (main scanning direction) of the point light of the drawing light beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction and the same direction. In addition, the scanning direction of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction and the same direction. At this time, the scanning direction of the drawing light beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing light beam LB scanned along the even-numbered drawing lines LL2, LL4 are the same. Therefore, from the perspective of the conveying direction of the substrate P, the drawing start position of odd-numbered drawing lines LL3 and LL5 (the scanning start point of spot light) and the drawing end position of even-numbered drawing lines LL2 and LL4 (the scanning end point of spot light) It is adjacent (consistent in the Y direction or partially repeated). Similarly, the drawing end positions of the odd-numbered drawing lines LL1 and LL3 are adjacent to the drawing start positions of the even-numbered drawing lines LL2 and LL4 (the same or in the Y direction). Partly repeated).

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 has the above-mentioned multiple drawing modules UW1 to UW5, a branch optical system (or also called a light distribution system) SL for branching the drawing light beam LB from the light source device CNT, and a calibration detection system 31 for calibration .

The branching optical system SL branches the drawing light beam LB emitted from the light source device CNT into a plurality of light beams, and directs the branched drawing light beams LB to the drawing modules UW1 to UW5 respectively. The branched optical system SL has a first optical system 41 that splits the drawing light beam LB emitted from the light source device CNT into two, a second optical system 42 that is irradiated by one of the drawing light beams LB of the first optical system 41 branch, and The third optical system 43 irradiated by another drawing light beam LB branched from the first optical system 41. In addition, the branch optical system SL includes an XY overall halving adjustment mechanism 44 that two-dimensionally traverses the beam LB before the branch in the first optical system 41 in a plane perpendicular to the beam axis, and a third The XY unilateral bisecting adjustment mechanism 45 in which the beam LB in the optical system 43 is two-dimensionally traversed in a plane perpendicular to the beam axis. In the branch optical system SL, a part of the light source device CNT side is disposed on the main body frame 21, on the other hand, another part of the drawing modules UW1 to UW5 is disposed on the second optical table 25.

The first optical system 41 has a 1/2 wave plate 51, a polarization beam splitter 52, a beam diffuser 53, a first mirror 54, a first relay lens 55, a second relay lens 56, and a second The reflecting mirror 57, the third reflecting mirror 58, the fourth reflecting mirror 59, and the first beam splitter 60.

The drawing light beam LB emitted in the +X direction from the light source device CNT is irradiated on the 1/2 wave plate 51. The 1/2 wave plate 51 is rotatable within the irradiation surface of the drawing light beam LB. The drawing light beam LB irradiated on the 1/2 wave plate 51 has a polarization direction corresponding to the predetermined polarization direction of the rotation of the 1/2 wave plate 51. The drawing light beam LB passing through the 1/2 wave plate 51 irradiates the polarization beam splitter 52. The polarization beam splitter 52 transmits the drawing light beam LB in the predetermined polarization direction, and on the other hand, reflects the drawing light beam LB outside the predetermined polarization direction in the +Y direction. Therefore, the drawing light beam LB reflected by the polarizing beam splitter 52 passes through the 1/2 wave plate 51. Therefore, the beam intensity of the drawing light beam LB can be adjusted by the coordinated operation of the 1/2 wave plate 51 and the polarizing beam splitter 52 . In other words, by rotating the 1/2 wave plate 51 to change the polarization direction of the drawing light beam LB, the beam intensity of the drawing light beam LB reflected by the polarization beam splitter 52 can be adjusted.

The drawing light beam LB that has passed through the polarizing beam splitter 52 is absorbed by the diffuser 53 to prevent the drawing light beam LB irradiated on the diffuser 53 from leaking to the outside. The drawing light beam LB reflected in the +Y direction by the polarization beam splitter 52 irradiates the first mirror 54. The drawing light beam LB irradiated on the first mirror 54 is reflected in the +X direction by the first mirror 54 and irradiated on the second mirror 57 via the first relay lens 55 and the second relay lens 56. The drawing light beam LB irradiated on the second mirror 57 is reflected in the −Y direction by the second mirror 57 and irradiated on the third mirror 58. The drawing light beam LB irradiated on the third mirror 58 is reflected in the −Z direction by the third mirror 58 and irradiated on the fourth mirror 59. The drawing light beam LB irradiated on the fourth mirror 59 is reflected in the +Y direction by the fourth mirror 59 and irradiated on the first beam splitter 60. A part of the drawing light beam LB irradiated on the first beam splitter 60 is reflected in the −X direction and irradiated on the second optical system 42, on the other hand, the other part is transmitted and irradiated on the third optical system 43.

The third reflection mirror 58 and the fourth reflection mirror 59 are arranged at a predetermined interval on the rotation axis I of the rotation mechanism 24. In addition, the structure including the third mirror 58 to the light source device CNT (the part surrounded by a two-dot chain line on the upper side in the Z direction in FIG. 4) is provided on the main body frame 21 side, and includes the fourth mirror 59 to plural The composition of the drawing modules UW1 to UW5 (the part surrounded by a two-dot chain line on the lower side in the Z direction in FIG. 4) is arranged on the second optical table 25 side. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the rotation mechanism 24, the third mirror 58 and the fourth mirror 59 are provided on the rotation axis I, so the optical path of the drawing beam LB is not changed . Therefore, even if the second optical table 25 is rotated with respect to the first optical table 23 by the rotation mechanism 24, the drawing light beam LB emitted from the light source device CNT provided on the side of the main body frame 21 can be guided very appropriately to the second optical table 23. Each of the plural drawing modules UW1 to UW5 on the side of the optical table 25.

The second optical system 42 diverges the drawing light beam LB from one of the branches of the first optical system 41 to the odd number drawing modules UW1, UW3, UW5 described later. The second optical system 42 has a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth mirror 64.

The first beam splitter 60 in the first optical system 41 is reflected by the drawing light beam LB in the −X direction, and irradiates the fifth mirror 61. The drawing light beam LB irradiated on the fifth mirror 61 is reflected in the −Y direction by the fifth mirror 61 and irradiated on the second beam splitter 62. The drawing light beam LB irradiated on the second beam splitter 62 is partially reflected and irradiated on the odd-numbered drawing module UW5 (refer to FIGS. 5 and 6 ). The drawing light beam LB irradiated on the second beam splitter 62 is partially penetrated and irradiated on the third beam splitter 63. Part of the drawing light beam LB irradiated on the third beam splitter 63 is reflected and irradiated on one drawing module UW3 with an odd number (refer to FIGS. 5 and 6 ). The drawing light beam LB irradiated on the third beam splitter 63 passes through the other part and irradiates the sixth mirror 64. The drawing light beam LB irradiated on the sixth mirror 64 is reflected by the sixth mirror 64 and irradiated on the odd-numbered drawing module UW1 (refer to FIGS. 5 and 6 ). In addition, in the second optical system 42, the drawing light beams LB irradiated on the odd-numbered drawing modules UW1, UW3, UW5 are slightly inclined with respect to the -Z direction.

The third optical system 43 divides the drawing light beam LB on the other side of the first beam splitter 60 of the first optical system 41 to branch to the even-numbered drawing modules UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing light beam LB transmitted in the Y direction by the first beam splitter 60 of the first optical system 41 irradiates the seventh mirror 71. The drawing light beam LB irradiated on the seventh mirror 71 is reflected in the X direction by the seventh mirror 71 and irradiated on the eighth mirror 72. The drawing light beam LB irradiated on the eighth mirror 72 is reflected in the −Y direction by the eighth mirror 72 and irradiated on the fourth beam splitter 73. Part of the drawing light beam LB irradiated on the fourth beam splitter 73 is reflected and irradiated on the even-numbered drawing module UW4 (refer to FIGS. 5 and 6 ). The drawing light beam LB irradiated on the fourth beam splitter 73 is partially penetrated and irradiated on the ninth mirror 74. The drawing light beam LB irradiated on the ninth mirror 74 is reflected by the ninth mirror 74 and irradiated on an even-numbered drawing module UW2. In addition, in the third optical system 43, the drawing light beam LB irradiated to the even-numbered drawing modules UW2 and UW4 is also slightly inclined with respect to the -Z direction.

As described above, in the branch optical system SL, the drawing light beam LB from the light source device CNT is branched into a plurality of drawing modules UW1 to UW5. At this time, the reflectance (transmittance) of the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 is adjusted to be appropriate depending on the number of branches of the drawing beam LB The reflectivity of is such that the beam intensity of the drawing light beam LB irradiated on the plurality of drawing modules UW1 to UW5 is the same.

The XY overall bisector adjustment mechanism 44 is arranged between the second relay lens 56 and the second mirror 57 as shown in FIG. 6. The XY integral bisecting adjustment mechanism 44 can slightly displace the light beam LB incident on the first beam splitter 60 two-dimensionally in a plane perpendicular to the beam axis, and adjust the position of the light beam passing through the second optical system 42 in particular. The XY overall bisector adjustment mechanism 44 is composed of a transparent parallel plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel plate glass that can be tilted in the YZ plane of FIG. 6. By adjusting the inclination of the two parallel plate glasses, the light beam LB incident on the first beam splitter 60 can be slightly shifted in the X direction or the Z direction in FIG. 6.

The XY one-side bisecting adjustment mechanism 45 is arranged between the seventh mirror 71 and the eighth mirror 72. The XY unilateral halving adjustment mechanism 45 can slightly shift the light beam LB passing through the first beam splitter 60 two-dimensionally in a plane perpendicular to the beam axis, and adjust the position of the light beam passing through the third optical system 43 in particular . The XY single-sided halving adjustment mechanism 45 is the same as the XY overall halving adjustment mechanism 44, with the transparent parallel plate glass that can be tilted in the XZ plane of Figure 6 and the transparent parallel plate glass that can be tilted in the YZ plane of Figure 6 Composition of flat glass. By adjusting the inclination of the two parallel plate glasses, the position of the drawing light beam LB incident on the even-numbered drawing modules UW2 and UW4 can be slightly shifted. In addition, it can be clearly seen from the structure of FIG. 6 that the positional displacement of the beam LB caused by the XY overall halving adjustment mechanism 44 also causes the beam LB to penetrate the first beam splitter 60 and enter the third optical system 43. Therefore, the position adjustment of the light beams entering the even-numbered drawing modules UW2 and UW4 is performed by both the XY overall halving adjustment mechanism 44 and the XY unilateral halving adjustment mechanism 45.

Further referring to FIG. 4, FIG. 5 and FIG. 7, a plurality of drawing modules UW1 to UW5 will be described. Multiple drawing modules UW1～UW5 are set corresponding to multiple drawing lines LL1～LL5. The plural drawing light beams LB branched by the branch optical system SL are respectively incident on the plural drawing modules UW1 to UW5. Each drawing module UW1 to UW5 condenses a plurality of drawing light beams LB on each drawing line LL1 to LL5 into a spot light, and scans the spot light. That is, the first drawing module UW1 guides the drawing light beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 guide the drawing light beam LB to the second to fifth drawing lines LL2. ~LL5.

As shown in FIG. 4 (and FIG. 1), a plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. A plurality of drawing modules UW1 to UW5 are arranged on the side where the first, third, and fifth drawing lines LL1, LL3, LL5 are sandwiched between the center plane p3 (the -X direction side in Fig. 5), and the first drawing module UW1 is arranged , The third drawing module UW3 and the fifth drawing module UW5. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at a predetermined interval in the Y direction. In addition, a plurality of drawing modules UW1 to UW5 are arranged on the side where the second and fourth drawing lines LL2 and LL4 are sandwiched between the center plane p3 (the +X direction side in FIG. 5), and the second drawing module UW2 and the fourth drawing are arranged Module UW4. The second drawing module UW2 is arranged in the Y direction between the first drawing module UW1 and the third drawing module UW3. Similarly, the third drawing module UW3 is arranged in the Y direction between the second drawing module UW2 and the fourth drawing module UW4. The fourth drawing module UW4 is arranged in the Y direction between the third drawing module UW3 and the fifth drawing module UW5. 4, the first drawing module UW1, the third drawing module UW3, the fifth drawing module UW5, the second drawing module UW2, and the fourth drawing module UW4, viewed from the Y direction, are The center plane p3 is centrally symmetrically arranged.

Next, each drawing module UW1 to UW5 will be described with reference to FIG. 4. In addition, since the drawing modules UW1 to UW5 have the same configuration, the first drawing module UW1 (hereinafter, simply referred to as drawing module UW1) will be described as an example.

The drawing module UW1 shown in FIG. 4 scans the drawing beam LB along the drawing line LL1 (the first drawing line LL1), and is equipped with a light deflector 81, a polarization beam splitter PBS, a quarter wave plate 82, and a scanner 83 , Bending mirror 84, f-θ lens system 85, and optical member 86 for Y magnification correction. In addition, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The optical deflector 81 is constituted by, for example, an acousto-optic modulator (AOM: AcoustIic "Optic" Modulator), and by switching the generation/non-generation of the diffracted light of the incident light beam at a high speed, the drawing light beam LB is switched to the substrate P at a high speed. The projection/non-projection. Thereby, the intensity of the spot light irradiated on the substrate P is modulated according to the pattern drawing information (the serial bit row signal) applied to the modulator (AOM) 81. Specifically, the drawing light beam LB from the branch optical system SL passes through the incident light deflector 81 whose relay lens 91 is slightly inclined with respect to the -Z direction. When the light deflector 81 is in the OFF state, the drawing light beam LB travels straight in an oblique state, and is shielded by the light shielding plate 92 provided after passing through the light deflector 81. When the optical deflector 81 is in the ON state, the diffracted drawing light beam LB is deflected in the −Z direction, passes through the optical deflector 81 and enters the polarizing beam splitter PBS provided in the Z direction of the optical deflector 81. Therefore, while the light deflector 81 is ON, the spot light of the drawing beam LB is continuously projected on the substrate P, and while the light deflector 81 is OFF, the projection of the spot light of the drawing beam LB on the substrate P is interrupted.

The polarization beam splitter PBS reflects the drawing light beam LB irradiated from the light deflector 81 through the relay lens 93. On the other hand, the polarizing beam splitter PBS and the quarter wave plate 82 provided between the polarizing beam splitter PBS and the scanner 83 work together to penetrate the drawing beam LB reflected on the surface of the substrate P or the rotating cylinder DR. That is, the linearly polarized laser light of the drawing light beam LB that is directed from the light deflector 81 to the polarizing beam splitter PBS is S polarized light is reflected by the polarizing beam splitter PBS. In addition, the drawing light beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82 as circularly polarized light and reaches the substrate P. A part of the drawing beam LB reflected on the surface of the substrate P or the rotating cylinder DR, transmitted through the f-theta lens system 85 or the scanner 83, and returned by a part of the reflected light, passes through the quarter wave plate 82 again, thereby becoming the linearly polarized light of P polarization . Therefore, the reflected light of the drawing light beam LB irradiated from the substrate P to the polarizing beam splitter PBS penetrates the polarizing beam splitter PBS. In addition, the reflected light of the drawing light beam LB passing through the polarizing beam splitter PBS is irradiated to the calibration detection system 31 through the relay lens 94. The drawing light beam LB that has passed through the relay lens system 93 and is reflected by the polarization beam splitter PBS passes through the quarter wave plate 82 and enters the scanner 83.

As shown in FIGS. 4 and 7, the scanner 83 has a mirror 96, a rotating polygon mirror 97, and an origin detector 98. The drawing light beam LB (parallel light beam) passing through the quarter wave plate 82 is irradiated to the reflecting mirror 96 through the relay lens 95. The drawing light beam LB reflected by the reflecting mirror 96 irradiates the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces (reflection planes) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction with the rotation axis 97a as the center, so that the reflection angle of the drawing light beam LB irradiated on the reflecting surface 97b is continuously changed. Accordingly, the reflected drawing light beam LB is moved along the substrate P The drawing line LL1 is scanned. The drawing light beam LB reflected by the rotating polygon mirror 97 irradiates the bending mirror 84. The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 of the substrate P (the predetermined scanning start point). The origin detector 98 is arranged on the opposite side of the reflecting mirror 96 with the drawing light beam LB reflected on each reflecting surface 97b sandwiched. Therefore, the origin detector 98 detects the drawing light beam LB irradiated in front of the f-θ lens system 85. In other words, the origin detector 98 detects the angular position of the reflective surface 97b immediately before the drawing start position of the drawing line LL1 on the substrate P with spot light.

The drawing light beam LB irradiated on the bending mirror 84 from the scanner 83 is reflected by the bending mirror 84 and irradiated on the f-θ lens system 85. The f-theta lens system 85 includes a telecentric f-theta lens, and projects the drawing light beam LB reflected from the rotating polygon mirror 97 through the bending mirror 84 to the drawing surface of the substrate P perpendicularly.

As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 are symmetrical with respect to the center plane p3. A plurality of scanners 83, and the three scanners 83 corresponding to the drawing modules UW1, UW3, UW5 are arranged on the upstream side of the rotation direction of the rotating cylinder DR (the -X direction side in Fig. 7), and the drawing module UW2 The two scanners 83 corresponding to UW4 are arranged on the downstream side of the rotation direction of the rotating cylinder DR (+X direction side in Fig. 7). The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other across the center plane p3. At this time, the scanners 83 arranged on the upstream side and the scanners 83 arranged on the downstream side are arranged to face each other across the center plane p3. Furthermore, the three rotating polygon mirrors 97 on the upstream side scan the drawing beam LB while rotating to the left (counterclockwise) in XY, thereby projecting the light on the odd-numbered drawing lines LL1, LL3, LL5. , That is, scan in a predetermined scanning direction (for example, the +Y direction in Fig. 7) from the drawing start position to the drawing end position. On the other hand, when the two rotating polygon mirrors 97 on the downstream side rotate to the right (clockwise) in XY and scan the drawing beam LB, they are projected on the even-numbered drawing lines LL2 and LL4. From the drawing start position to the drawing end position, scan in the same scanning direction (+Y direction) as the three drawing lines LL1, LL3, and LL5 on the upstream side.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB reaching the substrate P from the odd-numbered drawing modules UW1, UW3, UW5 is in the same direction as the installation direction line Le1. That is, the azimuth line Le1 is set, and the line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB from the even-numbered drawing modules UW2 and UW4 to the substrate P is in the same direction as the installation azimuth line Le2. In other words, the azimuth line Le2 is set, and in the XZ plane, the line connecting the even-numbered drawing lines LL2, LL4 and the rotation center line AX2.

The optical member 86 for Y magnification correction is a combination of a cylindrical lens with positive refractive power in the Y direction and a cylindrical lens with negative refractive power in the Y direction, and is arranged between the f-θ lens system 85 and the substrate P between. By finely moving at least one of the plurality of cylindrical lenses constituting the Y magnification correction optical member 86 in the direction of the optical axis of the f-θ lens system 85 (the axis of the drawing light beam LB), the drawing modules UW1- The drawing lines LL1 to LL5 formed by UW5 are slightly enlarged or reduced in the same square in the Y direction.

In the drawing device 11 configured in this way, the control device 16 controls each part to draw a predetermined pattern on the substrate P. That is to say, the control device 16, during the scanning direction of the drawing light beam LB projected on the substrate P, according to the CAD (Computer "Aided" Design) information of the pattern to be drawn on the substrate P, the light deflector 81 The ON/OFF modulation deflects the drawing beam LB to draw a pattern on the light sensing layer of the substrate P. In addition, the control device 16 synchronizes the scanning direction of the drawing light beam LB scanned along the drawing line LL1 (the scanning start time point) with the movement of the substrate P in the conveying direction by the rotation of the rotating cylinder DR, so as to be in the exposure area A7 A predetermined pattern is drawn corresponding to the portion of the drawing line LL1.

At this time, the effective size (dot diameter) of the spot light on the substrate P of the drawing light beam LB projected from each drawing module UW1 ~ UW5 is set to D (μm), and the spot light along the drawing line LL1 ~ LL5 is set When the scanning speed is set to Vp (μm/sec), the light source device CNT sets the light-emitting repetition period T (sec) of the laser light source emitting pulsed light to the relationship of T<D<Vp. In addition, the effective size (diameter) of the spot light refers to the width of the half-value width (full width at half-value) relative to the peak intensity distribution in the main scanning direction of the spot light or the width of the intensity relative to the peak value of 1/e ² .

Next, referring to FIGS. 3 and 8, the alignment microscopes AM1 and AM2 as the pattern detection unit will be described. The alignment microscopes AM1 and AM2 detect alignment marks formed in advance on the substrate P, or fiducial marks and fiducial patterns formed on the rotating cylinder DR in a predetermined observation area. Hereinafter, the alignment mark of the substrate P and the reference mark and reference pattern of the rotating cylinder DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used to align (align) the position of the substrate P and a predetermined pattern drawn on the substrate P, or to align the rotating cylinder DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are arranged on the upstream side of the rotation direction of the rotating cylinder DR compared to the drawing lines LL1 to LL5 formed by the drawing device 11. Moreover, the alignment microscope AM1 is arranged on the upstream side of the rotation direction of the rotating cylinder DR than the alignment microscope AM2.

Alignment microscopes AM1 and AM2 are made by projecting illumination light on the substrate P or rotating cylinder DR and incident on the mark generated by the objective lens system GA as a detection probe, and will receive light through the objective lens system GA The marked images (bright-field images, dark-field images, fluorescent images, etc.) are composed of two-dimensional CCD, CMOS, etc. photography system GD. In addition, the illumination light for alignment is light in a wavelength band that has little sensitivity to the light-sensitive layer on the substrate P, for example, light with a wavelength of about 500 to 800 nm.

The alignment microscope AM1 is arranged in a row in the Y direction (the width direction of the substrate P) with a plurality of (for example, 3). Similarly, there are a plurality of alignment microscopes AM2 arranged in a row in the Y direction (the width direction of the substrate P) (for example, three). That is, there are six alignment microscopes AM1 and AM2 in total.

In FIG. 3, for ease of understanding, in each pair of objective lens systems GA of 6 alignment microscopes AM1 and AM2, the arrangement of each pair of objective lens systems GA1 to GA3 of 3 alignment microscopes AM1 is shown. The three pairs of objective lenses of the alignment microscope AM1 are GA1～GA3 on the observation area (detection position) Vw1～Vw3 on the substrate P (or the outer peripheral surface of the rotating cylinder DR), as shown in Fig. The Y direction where the center line AX2 is parallel, is arranged at a predetermined interval. As shown in FIG. 8, the optical axes La1 to La3 of the pairs of objective lenses GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, each pair of objective lens of the three alignment microscope AM2 is the observation area Vw4～Vw6 on the substrate P (or the outer peripheral surface of the rotating cylinder DR) by GA, as shown in Figure 3, in parallel with the rotation center line AX2 The Y direction is arranged at a predetermined interval. As shown in FIG. 8, the optical axes La4 to La6 of the pair of objective lenses GA passing through the centers of the observation areas Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating cylinder DR.

The observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 are on the substrate P and the rotating cylinder DR, for example, set in a range of 200 μm diagonal. Here, the optical axis La1 to La3 of the alignment microscope AM1, that is, the optical axis La1 to La3 of the objective lens system GA, are set to be aligned with the installation direction line extending from the rotation center line AX2 in the radial direction of the rotation cylinder DR Le3 is in the same direction. In other words, the azimuth line Le3 is set, and when observed in the XZ plane of FIG. 4, it is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2. Similarly, the alignment of the optical axis La4~La6 of the microscope AM2, that is, the optical axis La4~La6 of the objective lens GA, is set to be aligned with the installation azimuth line extending from the rotation center line AX2 in the radial direction of the rotation cylinder DR Le4 is in the same direction. That is to say, the azimuth line Le4 is set, and when observed in the XZ plane of FIG. 4, it is a line connecting the observation area Vw4-Vw6 of the alignment microscope AM2 and the rotation center line AX2. At this time, the alignment microscope AM1 is arranged on the upstream side of the rotation direction of the rotating cylinder DR compared with the alignment microscope AM2, so the angle formed by the center plane p3 and the installation azimuth line Le3 is greater than the center plane p3 and the installation azimuth line The angle formed by Le4 is large.

On the substrate P, as shown in FIG. 3, the exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, there are a plurality of alignment marks Ks1 to Ks3 (hereinafter referred to as marks) for position alignment, for example, formed in a cross shape. Although each drawing module aligns (corrects) the main scanning position of the spot light according to the detection results of the alignment microscopes AM1 and AM2 on the alignment marks Ks1 to Ks2, the position on the substrate P of the pattern to be drawn is specified, but the The bit is not limited to this. For example, the alignment microscopes AM1 and AM2 may be used to detect a part of the shape of the circuit pattern formed on the substrate P and then perform the alignment.

In Fig. 3, the mark Ks1 is arranged at a certain interval in the X direction in the -Y side peripheral area of the exposure area A7, and the mark Ks3 is arranged at a certain interval in the X direction in the +Y side peripheral area of the exposure area A7. Further, the mark Ks2 is set in the center of the Y direction in the blank area between the two adjacent exposure areas A7 in the X direction.

The mark Ks1 is to be captured in sequence in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens system GA of the alignment microscope AM2, during the transport of the substrate P The way to form. In addition, the mark Ks3 is used in the observation area Vw3 of the objective lens GA3 of the alignment microscope AM1 and the observation area Vw6 of the objective lens GA of the alignment microscope AM2, which can be followed during the transportation of the substrate P The way of order capture is formed. Further, the mark Ks2 is to be respectively in the observation area Vw2 of the objective lens GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens GA of the alignment microscope AM2, during the transport of the substrate P Formed by sequential capture.

Therefore, the three alignment microscopes AM1 and AM2 on both sides of the rotating cylinder DR in the three alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides of the width direction of the substrate P at any time. In addition, the three alignment microscopes AM1 and AM2 in the Y-direction center of the rotating cylinder DR in the alignment microscopes AM1 and AM2 can always observe or detect the longitudinal direction of the exposure area A7 formed on the substrate P. Mark Ks2 for blank parts etc.

Here, the exposure device EX uses the so-called multi-beam type drawing device 11, so in order to draw the plural patterns drawn on the substrate P with the drawing lines LL1 to LL5 of the plural drawing modules UW1 to UW5 in the Y direction. Proper bonding is necessary to keep the bonding accuracy of the multiple drawing modules UW1 to UW5 within the allowable range. In addition, the relative positional relationship of the alignment microscopes AM1 and AM2 to the observation areas Vw1 to Vw6 of the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 must be accurately determined by reference line management. To perform this baseline management, calibration is also necessary.

In the calibration for confirming the bonding accuracy of a plurality of drawing modules UW1～UW5, and the calibration for the reference line management of the alignment microscopes AM1 and AM2, at least one of the outer peripheral surfaces of the rotating cylinder DR of the support substrate P is required Set fiducial marks or fiducial patterns on the part. Therefore, as shown in FIG. 9, in the exposure apparatus EX, the rotating cylinder DR provided with the reference mark or reference pattern on the outer peripheral surface is used.

The rotating cylinder DR is formed with scale parts GPa and GPb which constitute a part of the rotation position detection mechanism 14 described later on both ends of the outer peripheral surface. In addition, the rotating cylinder DR is provided with narrow restriction bands CLa and CLb formed by concave grooves or convex edges on the inside of the scale portions GPa and GPb. The Y-direction width of the substrate P is set to be smaller than the Y-direction interval of the two restriction belts CLa and CLb, and the substrate P is closely attached to the outer circumferential surface of the rotating cylinder DR to restrict the inner area sandwiched by the belts CLa and CLb. Be supported.

The rotating cylinder DR is provided with a plurality of line patterns RL1 inclined at +45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched by the restriction bands CLa and CLb, and plural numbers inclined at -45 degrees with respect to the rotation center line AX2 Each line pattern RL2 is a grid-like reference pattern (which can also be used as a reference mark) RMP repeatedly engraved with a certain pitch (period) Pf1 and Pf2. As an example, the line width LW of the line pattern RL1 and the line pattern RL2 is set to approximately several μm to 20 μm, and the pitch (period) Pf1 and Pf2 are set to approximately several tens of μm to several hundreds of μm.

The reference pattern RMP is an oblique pattern (oblique grid pattern) that is uniform across the entire surface in order to avoid changes in friction or tension of the substrate P at the contact portion between the substrate P and the outer peripheral surface of the rotating cylinder DR. In addition, the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be made parallel to the Y axis, and the line pattern RL2 may be made into a grid pattern parallel to the X axis. In addition, it is not necessary to make the line patterns RL1 and RL2 cross at 90 degrees, and the rectangular area enclosed by the two adjacent line patterns RL1 and the adjacent two line patterns RL2 can be made into a square (or rectangle). The angle of the other rhombus crosses the line patterns RL1 and RL2.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4, and 8. As shown in FIG. 8, the rotation position detection mechanism 14 optically detects the rotation position of the rotating cylinder DR, and can be applied to an encoder system using, for example, a rotary encoder. The rotation position detecting mechanism 14 has scale parts GPa and GPb provided at both ends of the rotating cylinder DR, and a plurality of encoder heads EN1, EN2, EN3, EN4 opposed to each of the scale parts GPa and GPb. In Figures 4 and 8, although only the four encoder heads EN1, EN2, EN3, and EN4 facing the scale part GPa are shown, the scale part GPB also has the oppositely arranged encoder heads EN1. EN2, EN3, EN4.

The scale parts GPa and GPb are respectively formed in a ring shape in the circumferential direction of the outer peripheral surface of the rotating cylinder DR. The scale parts GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating cylinder DR, and are configured as incremental scales. In the case of this embodiment, the grating lines (scales) of the scale parts GPa and GPb and the reference pattern RMP shown in Fig. 9 are formed at the same time by a device (pattern engraving machine, etc.) that processes the surface of the rotating cylinder DR. , So the unique positional relationship can be made in micron level. In addition, an origin mark is provided in one of the circumferential directions of the scale parts GPa and GPb, and each of the encoder reading heads EN1, EN2, EN3, EN4 has the function of detecting the origin mark and outputting the origin signal. Therefore, the origin mark also has a unique positional relationship in the reference pattern RMP and the circumferential direction (a known angular positional relationship).

The substrate P is located inside the scale parts GPa and GPb avoiding both ends of the rotating cylinder DR, that is, it is wound inside the restriction belts CLa and CLb. If a strict arrangement relationship is required, set the outer peripheral surface of the scale parts GPa and GPb to be the same surface as the outer peripheral surface of the substrate P wound around the rotating cylinder DR (the same radius from the center line AX2). In order to achieve this, the outer peripheral surfaces of the scale parts GPa and GPb and the outer peripheral surface for substrate winding of the rotating cylinder DR can be made to have the thickness of the substrate P higher in the radial direction. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotating cylinder DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa and GPb in the same radial direction as the drawing surface of the substrate P wound on the rotating cylinder DR, reducing the measurement position and processing position due to rotation The Abbe error caused by the difference of the diameter direction of the system. In addition, when the scale parts GPa and GPb cannot be directly formed on both ends of the rotating cylinder DR, the scale part GPa may be engraved on the outer peripheral surface of a disk-shaped member having approximately the same diameter as the rotating cylinder DR. The scale disc (GPb) is coaxially installed on the shaft Sf2 of the rotating cylinder DR.

The encoder reading heads EN1, EN2, EN3, EN4, viewed from the rotation center line AX2, are respectively arranged around the scale parts GPa and GPb, at different positions in the circumferential direction of the rotating cylinder DR. The encoder reading heads EN1, EN2, EN3, EN4 are connected to the control device 16. Encoder reading heads EN1, EN2, EN3, EN4 project measuring beams toward the scale GPa and GPb, and perform photoelectric detection of the reflected beam (diffracted light) to detect changes in the circumferential position of the corresponding scale GPa and GPb The signal (for example, a 2-phase signal with a phase difference of 90 degrees) is output to the control device 16. The control device 16 performs digital processing by interpolating the detection signal with a counting circuit not shown, which can measure the angular change of the rotating cylinder DR with sub-micron resolution, that is, measure the circumferential direction of its outer peripheral surface Location changes. At this time, the control device 16 may also measure the conveying speed of the substrate P in the rotating drum DR from the angle change of the rotating drum DR.

In addition, as shown in FIGS. 4 and 8, the encoder read head EN1 is arranged on the set orientation line Le1. The azimuth line Le1 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN1 to the scale part GPa (GPb) and the rotation center line AX2. Furthermore, as described above, the azimuth line Le1 is set to be in the XZ plane, and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder head EN1 and the rotation center line AX2, and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth line (when viewed from the center axis AX2, Same orientation).

Similarly, as shown in Figures 4 and 8, the encoder read head EN2 is arranged on the set orientation line Le2. The azimuth line Le2 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN2 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le2 is set to be in the XZ plane and connects the drawing lines LL2, LL4 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder head EN2 with the rotation center line AX2, and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 are the same azimuth line (the same azimuth when viewed from the center axis AX2 ).

Furthermore, as shown in Figs. 4 and 8, the encoder read head EN3 is arranged on the set orientation line Le3. The azimuth line Le3 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN3 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le3 is set in the XZ plane, and connects the alignment microscope AM1 to the observation area Vw1 to Vw3 of the substrate P and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder read head EN3 and the rotation center line AX2, and the line connecting the observation area Vw1～Vw3 of the microscope AM1 and the rotation center line AX2 are the same azimuth line (from the center axis AX2 observes in the same orientation). With this configuration, when viewed from the direction extending from the rotation center axis AX2, the measurement area of the encoder read head EN3 on the scale parts GPa and GPb and the observation area Vw1～Vw3 of the alignment microscope AM1 are in the rotating cylinder The same position in the circumferential direction of DR.

Similarly, as shown in Figures 4 and 8, the encoder read head EN4 is arranged on the set orientation line Le4. The azimuth line Le4 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN4 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le4 is set in the XZ plane and connects the observation area Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder read head EN4 and the rotation center line AX2, and the line connecting the observation area Vw4～Vw6 of the microscope AM2 and the rotation center line AX2 are the same azimuth line (from the center axis AX2 observes in the same orientation). With this structure, when viewed from the direction extending from the rotation center axis AX2, the measurement area of the encoder read head EN4 on the scale parts GPa and GPb and the observation area Vw4～Vw6 of the alignment microscope AM2 are in the rotating cylinder The same position in the circumferential direction of DR.

When the setting orientation of the encoder reading head EN1, EN2, EN3, EN4 (the angle direction in the XZ plane centered on the rotation center line AX2) is represented by the setting orientation line Le1, Le2, Le3, Le4, as shown in the figure As shown in 4, a plurality of drawing modules UW1 to UW5 and encoder reading heads EN1 and EN2 are arranged to set the azimuth lines Le1 and Le2 at an angle of ±θ° relative to the center plane p3.

Here, the control device 16 moves according to the rotation angle positions of the scale parts (rotating cylinder DR) GPa and GPb detected by the encoder read heads EN1 and EN2 and the counter circuit, that is, the peripheral surface of the rotating cylinder DR. The position or the amount of movement controls the drawing start position of the drawing modules UW1～UW5 with odd and even numbers. That is, the control device 16 performs ON/OFF modulation of the light deflector 81 according to the CAD information of the pattern to be drawn on the substrate P during the scanning direction of the drawing light beam LB projected on the substrate P, but also The start timing of the ON/OFF modulation of the CAD information for one scan using the light deflector 81 can be performed based on the detected rotation angle position, thereby enabling the light sensing layer of the substrate P to be drawn with good accuracy pattern.

In addition, the control device 16 can detect the alignment marks Ks1～Ks3 on the substrate P by storing the alignment microscopes AM1 and AM2, and use the encoder reading heads EN3 and EN4 to detect the scale parts GPa and GPb (rotating cylinder DR). ), the corresponding relationship between the positions of the alignment marks Ks1～Ks3 on the substrate P and the rotation angle position of the rotating cylinder DR can be obtained. Similarly, when the control device 16 detects the reference pattern RMP on the rotating cylinder DR by storing the alignment microscopes AM1 and AM2, it uses the encoder reading heads EN3 and EN4 to detect the scale parts GPa and GPb (rotating cylinder DR) The rotation angle position of the rotation angle position can find the corresponding relationship between the position of the reference pattern RMP on the rotating cylinder DR and the rotation angle position of the rotating cylinder DR. As mentioned above, aligning the microscopes AM1 and AM2 can accurately measure the rotation angle position (or circumferential direction position) of the rotating cylinder DR at the moment when the reference mark or mark is sampled in the observation area Vw1～Vw6. ). In the exposure device EX, that is, based on the measurement result, the substrate P and the predetermined pattern drawn on the substrate P are aligned (aligned), or the rotating cylinder DR and the drawing modules UW1 to UW5 of the drawing device 11 are drawn Calibration of the positional relationship between lines LL1 ~ LL5.

In addition, the multi-beam type exposure apparatus EX scans the spot light of the drawing light beam LB along a plurality of drawing lines LL1 to LL5 on the substrate P while conveying the substrate P in the conveying direction. Here, the scanning direction of the drawing light beam LB scanned along the drawing lines LL1 to LL5 is the same direction, and each of the drawing lines LL1 to LL5 is set to be precisely parallel to the center plane p3 (central axis AX2) At this time, the patterns PT1 to PT5 respectively formed on the substrate P by a plurality of drawing lines LL1 to LL5 become the patterns as shown in FIG. 10.

10 is a diagram showing an exaggerated display of an example of the arrangement relationship between the pattern drawn on the substrate by the exposure device of the first embodiment and the drawing line. In addition, in FIG. 10, since it is a view expanded in the conveyance direction (Xs direction) of the substrate P, it is an orthogonal coordinate system in which the Xs direction, the Y direction, and the Z direction are orthogonal. 10, in order to easily understand the relationship between the drawing lines LL1 to LL5 and the patterns PT1 to PT5, the drawing lines LL1 to LL5 and the patterns PT1 to PT5 are thickened in the conveying direction of the substrate P.

As shown in FIG. 10, the point light of the drawing beam LB projected from each of the plurality of drawing modules UW1 to UW5 to the substrate P is scanned along the drawing line LL1 to LL5 from the drawing start position PO1 to the drawing end position PO2 at +Y direction. At this time, the scanning directions of the spot light of the drawing light beam LB along the drawing lines LL1 to LL5 are all the same. Therefore, when viewed from the conveying direction Xs of the substrate P, the ends PTa of the patterns PT1 to PT5 formed in the drawing start position PO1 of the drawing lines LL1 to LL5 are formed in the drawing end position PO2 of the drawing lines LL1 to LL5. The ends PTb of the patterns PT1 to PT5 are adjacent to each other among the patterns PT1 to PT5 that are adjacent in the width direction of the substrate P.

Here, the patterns PT1 to PT5 formed on the substrate P when the spot light of the drawing beam LB scans the substrate P once, since the substrate P is conveyed at a constant velocity in the conveying direction, it is formed to be slightly inclined. Although the tilt amount is exaggeratedly shown in FIG. 10, it is represented by the ratio Vxs/Vp of the conveying speed Vxs of the substrate P to the scanning speed Vp of the spot light of the drawing beam LB. The scanning speed Vp is proportional to the rotation speed Rv (rps) of the rotating polygon mirror 97 as the scanner 83. For example, when the rotating polygon mirror 97 has 8 reflection surfaces, the actual scanning period of each reflection surface is 40%, and the line is drawn When the length of (LL1～LL5) is YL (mm), the scanning speed Vp (mm/S) of the spot light is calculated by the following formula: Vp=(8・Rv・YL)/0.4=20・Rv・YL〔mm/S〕

If the rotating polygon mirror 97 is 6000 revolutions per minute (rotation speed Rv=100rps) and the length YL is 50 mm, the scanning speed Vp is 100,000 mm/S. If the conveying speed Vxs of the substrate P is 50 mm/S, the amount of inclination Vxs/Vp of the drawing line on the substrate P is 1/2000. The amount of inclination means that both ends of the drawing line in the Y direction (the drawing start point PO1 and the drawing end point PO2) are offset on the substrate P by 25 μm in the Xs direction. Of course, as long as the rotation speed Rv of the rotating polygon mirror 97 is increased and the conveying speed Vxs of the substrate P is reduced, the inclination amount Vxs/Vp of the drawing line can be made smaller, but in order to make both ends of the drawing line in the Y direction (drawing start point PO1 and the drawing end point PO2) The amount of deviation in the Xs direction is about a fraction of the minimum line width of the pattern to be drawn. It is necessary to increase the rotation speed Rv of the rotating polygon mirror 97 to several times or more while greatly reducing the transport speed of the substrate P Vxs. That is, the ends PTa of the patterns PT1 to PT5 formed at the drawing start position PO1 of the drawing lines LL1 to LL5 are formed compared to the end PTb of the patterns PT1 to PT5 formed at the drawing end position PO2 of the drawing lines LL1 to LL5 On the downstream side of the conveying direction. Therefore, the end portion PTa and the end portion PTb of the patterns PT1 to PT5 are different positions in the conveying direction. In this case, the patterns PT1 to PT5 joined in the width direction of the substrate P will cause a joining error in the conveying direction between the adjacent patterns PT1 to PT5.

As described above, the joining error of the patterns PT1 to PT5 is when the scanning speed Vp of the spot light of the drawing light beam LB in the main scanning direction is constant, the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P does not become the same The transfer speed of the substrate P occurs in response to the inclination. Here, the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P is adjusted before drawing by the exposure device EX and during drawing by the exposure device EX.

Specifically, before drawing by the exposure apparatus EX (for example, during alignment), the exposure apparatus EX conveys the substrate P at a predetermined reference speed (Vxs). At this time, the reference speed may be appropriately changed according to the substrate P used. For example, when the sensitivity of the light-sensitive layer coated on the substrate P is low, there are cases where the reference speed is reduced and the main scanning with spot light is repeated several times to increase the exposure. Therefore, in order to properly join the patterns PT1 to PT5 in the width direction of the substrate P for the substrates that are transported at the reference speed, the drawing lines LL1 to LL5 are adjusted to the center plane p3 ( The central axis AX2) is inclined appropriately.

In the drawing operation performed by the exposure apparatus EX, although the rotation drive of the rotating cylinder DR is controlled so that the conveying speed of the substrate P becomes the reference speed, in this case, it may be caused by the structure of the rotating bearing part of the rotating cylinder DR. (Bearing characteristics) or the rotation drive mechanism (torque characteristics of the motor, characteristics of the reduction gear, etc.), so that the conveying speed of the substrate P to be conveyed varies slightly from the reference speed according to the rotation period of the rotating cylinder DR. That is, the conveying speed of the substrate P conveyed by the rotating cylinder DR will periodically generate speed unevenness. Therefore, in order to make the patterns PT1 to PT5 very suitable to be joined in the width direction of the substrate P for the substrate P whose speed is slightly changed from the reference speed, it is possible to assemble the dynamics of the drawing lines LL1 to LL5 to follow the change in the conveying speed of the substrate P Ground (active) inclined structure (control system).

Next, the adjustment of the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P will be described with reference to FIG. 11. 11 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure device of the first embodiment. In the exposure apparatus EX of the first embodiment, the second optical table 25 is rotated with respect to the first optical table 23 by the rotation mechanism 24 to thereby tilt the entire drawing lines LL1 to LL5 with respect to the width direction of the substrate P. That is, the rotation mechanism 24 functions as a tilt adjustment mechanism for adjusting the tilt of the drawing lines LL1 to LL5.

The rotation mechanism 24 rotates the drawing device 11 with respect to the substrate P around the rotation axis I by rotating the second optical table 25 relative to the first optical table 23. After the drawing device 11 is rotated with the rotation axis I as the center, the drawing lines LL1 to LL5 do not change their positional relationship relative to the width direction of the substrate P (ie, the rotation center line AX2 or the center plane p3 of the rotating cylinder DR) tilt.

Here, the tilt adjustment of the drawing lines LL1 to LL5 when the patterns PT1 to PT5 are joined in the width direction of the substrate P to the substrate P conveyed at the reference speed during the alignment of the exposure apparatus EX will be described. As shown in FIG. 11, the control device 16 rotates the rotation mechanism 24 based on the reference speed of the substrate P detected by the rotation position detection mechanism 14. Here, the reference speed of the substrate P is in correspondence with the rotation amount of the rotating mechanism 24. This amount of rotation is the amount of rotation (inclination amount) that the ends PTa and PTb of the patterns PT1 to PT5 will be the same position in the conveying direction, that is, the amount of rotation (inclination) that the patterns PT1 to PT5 are formed along the width direction of the substrate P. That is, the control device 16 rotates the rotation mechanism 24 according to the rotation amount corresponding to the reference speed of the substrate P to be detected. Specifically, when the patterns PT1 to PT5 shown in FIG. 10 are formed, the control device 16 rotates the rotating mechanism 24 according to the reference speed of the substrate P, thereby the drawing start position PO1 of the drawing lines LL1 to LL5 is positioned at the conveyance The drawing end position PO2 of the drawing lines LL1 to LL5 is located on the downstream side of the conveying direction in the upstream side of the direction, and the drawing device 11 is rotated with respect to the substrate P.

As shown in FIG. 11, after the drawing lines LL1 to LL5 are integrally inclined by the rotating mechanism 24 without changing the mutual positional relationship of the drawing lines LL1 to LL5, the drawing lines LL1 and LL5 on the side farther from the rotation axis I , The amount of movement in the conveying direction becomes larger. On the other hand, the drawing line LL3 on the side closer to the rotation axis I has a smaller amount of movement in the conveying direction. That is, the drawing line LL1 moves largely to the upstream side of the conveying direction, and the drawing line LL2 moves slightly to the upstream side of the conveying direction. The drawing line LL3 almost did not move in the conveying direction. The drawing line LL4 moves slightly to the downstream side of the conveying direction, and the drawing line LL5 moves largely to the downstream side of the conveying direction. Therefore, the patterns PT1 to PT5 drawn on the substrate P by the drawing lines LL1 to LL5 after the rotation mechanism 24 rotates (after tilt correction) are formed as shown by the broken line in FIG. There is no tilt in directions that are roughly the same.

On the other hand, the patterns PT1 to PT5 exposed after rotation (after tilt correction) are formed in slightly different positions corresponding to the inclination of the drawing lines LL1 to LL5 in the conveying direction of the substrate P. That is, the pattern PT5 is formed on the downstream side of the conveying direction relative to the pattern PT4, the pattern PT4 is formed on the downstream side of the conveying direction relative to the pattern PT3, the pattern PT3 is formed on the downstream side of the conveying direction relative to the pattern PT2, and the pattern PT2 is formed on the conveying direction relative to the pattern PT1. The downstream side of the direction. As mentioned above, when the drawing device 11 is rotated by the rotating mechanism 24 with the rotation axis I as the center, the positions of the rotated patterns PT1 to PT5 in the conveying direction are different, and the rotated patterns PT1 to PT5 will be conveyed. The direction produces a predetermined offset. Therefore, the control device 16 controls the drawing timing of the drawing modules UW1 to UW5 based on the reference speed of the substrate P detected by the rotation position detecting mechanism 14 to correct the positions of the rotated patterns PT1 to PT5 in the conveying direction. That is, the reference speed of the substrate P also establishes a corresponding relationship with the correction amount at the time of drawing. Here, the control device 16 corrects the CAD information used for drawing on the substrate P in the conveying direction in order to correct the drawing timing.

Fig. 12 is a diagram showing an image of CAD information used in the exposure apparatus of the first embodiment. In addition, in FIG. 12, as CAD information of the pattern to be drawn on the substrate P, CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 shown in FIG. 11 are shown. In addition, the CAD patterns CAD1 to CAD5 shown in dotted lines in Fig. 12 are the CAD patterns (original data on the design) CAD1 to CAD5 before correction at the drawing time point, and the CAD patterns CAD1 to CAD5 shown in solid lines in Fig. 12 , Is the CAD pattern CAD1～CAD5 after the correction of the drawing time point.

As shown by the broken line in Fig. 12, each of the CAD patterns CAD1 to CAD5 before correction is stored in the drawing data (bit pattern) for drawing in the same arrangement as the patterns PT1 to PT5 to be drawn on the substrate P In the memory circuit, it is the same position in the conveying direction of the substrate P. Therefore, the CAD patterns CAD1 to CAD5 before correction are arranged in a row along the width direction of the substrate P.

The control device 16 is to set the CAD patterns CAD1～CAD5 before correction to the same position in the conveying direction of the rotated patterns PT1～PT5 shown in Fig. 11, that is, the ends PTa, PTb of the patterns PT1～PT5 In the method of joining each other, the CAD patterns CAD1 to CAD4 are corrected in the conveying direction based on the CAD pattern CAD5. That is, the control device 16, as shown by the solid line in FIG. 12, corresponds to the positional deviation of the patterns PT1 to PT5 in the conveying direction after the rotation shown in FIG. 11, and corrects each of the CAD patterns CAD1 to CAD5 before correction. Correct it in the conveying direction. The correction is performed, for example, by successively reading the drawing data (bit patterns) of the CAD patterns CAD1 to CAD5 before correction from the memory circuit by staggering the start time points.

In addition, the shift amount in the conveying direction of the patterns PT1 to PT5 shown by the dotted line in FIG. 11 is related to the conveying speed of the substrate P as described above. Therefore, the control device 16 performs the operation according to the conveying speed of the substrate P Correction of CAD patterns CAD1～CAD5 in the conveying direction (stagger of the starting point of the drawing data reading, etc.). In the revised CAD information, CAD pattern CAD5 is located on the upstream side of the conveying direction relative to CAD pattern CAD4, CAD pattern CAD4 is located on the upstream side of the conveying direction relative to CAD pattern CAD3, and CAD pattern CAD3 is located on the upstream side of the conveying direction relative to CAD pattern CAD2 On the other hand, the CAD pattern CAD2 is located on the upstream side in the conveying direction relative to the CAD pattern CAD1. In addition, although the control device 16 corrects the other CAD patterns CAD1 to CAD4 based on the CAD pattern CAD5, it can also perform the correction based on the other CAD patterns CAD1 to 4 as a reference.

In this way, the control device 16 corrects the CAD patterns CAD1 to CAD5 shown by the solid line in FIG. 12 to be transported in accordance with the transport speed of the substrate P detected by the rotation position detection mechanism 14 during the alignment of the exposure device EX. The position of the direction can thereby be drawn on the substrate P as the patterns PT1 to PT5 shown by the solid line in FIG. 11.

In addition, the adjustment of the inclination of the drawing lines LL1 to LL5 during the alignment of the exposure apparatus EX can be performed by manually rotating the rotating mechanism 24, or the control device 16 can drive and control the rotating mechanism 24 to rotate.

Next, the drawing line LL1 when the patterns PT1 to PT5 are joined together in the width direction of the substrate P for the substrate P whose speed changes only slightly due to the uneven speed from the reference speed during drawing by the exposure apparatus EX will be described. ~ LL5 tilt adjustment. As shown in FIG. 11, the rotating mechanism 24 is to tilt the drawing lines LL1 to LL5 to a predetermined extent with respect to the width direction of the substrate P for the substrate P that is transported at a reference speed, so that the patterns PT1 to PT5 are very suitable for the width direction of the substrate P地相接。 Ground joint.

After the substrate P is transported at a transport speed faster than the reference speed from the state shown in FIG. 11, the patterns PT1 to PT5 formed on the substrate P are formed obliquely as shown in FIG. That is, the end portions PTa of the patterns PT1 to PT5 are formed on the downstream side in the conveying direction than the end portions PTb of the patterns PT1 to PT5. On the other hand, after the substrate P is transported at a transport speed slower than the reference speed, the patterns PT1 to PT5 formed on the substrate P are inclined in the opposite direction to the patterns PT1 to PT5 shown in FIG. 10 (in FIG. 10, they are to the right Tilt down) formed. That is, the ends PTa of the patterns PT1 to PT5 are formed on the upstream side in the conveying direction than the ends PTb of the patterns PT1 to PT5.

When the conveying speed of the substrate P detected by the rotation position detecting mechanism 14 becomes faster than the reference speed, the control device 16 draws the drawing line LL1 to LL5 at the drawing start position PO1 compared to the drawing line LL1 to LL5 at the reference speed The start position PO1 is located further upstream in the conveying direction, and the drawing end position PO2 of the drawing lines LL1 to LL5 is located more downstream than the drawing end position PO2 of the drawing lines LL1 to LL5 of the reference speed in the conveying direction, so that the rotating mechanism 24 is rotated , From the state of FIG. 11, the entire drawing lines LL1 to LL5 are further rotated clockwise. Moreover, after the rotation mechanism 24 is rotated, the positions of the patterns PT1 to PT5 after the rotation are shifted in the conveying direction, and the patterns PT1 to PT4 are located more upstream than the patterns PT2 to PT5 in the conveying direction. Therefore, the control device 16 uses the CAD information drawn on the substrate P to correct the drawing time point in the transport direction in such a way that the CAD patterns CAD1 to CAD4 are located more downstream than the CAD patterns CAD2 to CAD5 in the transport direction (from the memory circuit Read the start time of the drawing data).

On the other hand, when the transfer speed of the substrate P detected by the rotation position detection mechanism 14 is slower than the reference speed, the control device 16 uses the drawing start position PO1 of the drawing lines LL1 to LL5 to be higher than the drawing line LL1 to LL5 of the reference speed. The drawing start position PO1 is located further downstream in the conveying direction, and the drawing end position PO2 of the drawing lines LL1 to LL5 is located more upstream than the drawing end position PO2 of the reference speed drawing line LL1 to LL5 in the conveying direction. The rotating mechanism 24 Spin. In addition, after the rotation mechanism 24 is rotated, the positions of the patterns PT1 to PT5 after the rotation are shifted in the conveying direction, and the patterns PT1 to PT4 are located further downstream in the conveying direction than the patterns PT2 to PT5. Therefore, the control device 16 uses the CAD information drawn on the substrate P to correct the drawing time point in the transport direction in such a way that the CAD patterns CAD1 to CAD4 are located more upstream than the CAD patterns CAD2 to CAD5 in the transport direction (from the memory circuit Read the start time of the drawing data).

As described above, when the control device 16 is drawing by the exposure device EX, even if the substrate P changes its speed slightly from the reference speed due to uneven speed and is simultaneously transported, it can be based on the transport speed detected by the rotation position detection mechanism 14 and The difference of the reference speed adjusts the overall tilt of the drawing lines LL1 ~ LL5. In addition, the control device 16 uses the offset of the rotated patterns PT1 to PT5 in the conveying direction as the correction amount, and corrects the position of the CAD patterns CAD1 to CAD5 in the conveying direction (correcting the starting point of drawing), thereby enabling it to be used on the substrate The patterns PT1 to PT5 are drawn on the substrate P in a state where the P width direction is linearly connected.

In addition, the rotation amount of the rotation mechanism 24 is preferably obtained in advance based on the reference speed and the transport speed of the substrate P. Similarly, the correction amount of the CAD information is also preferably obtained in advance based on the reference speed and the transport speed of the substrate P. Furthermore, the reference speed of the substrate P, the displacement from the reference speed, the rotation amount of the rotating mechanism 24, and the correction amount of the CAD information can also be obtained as a correlation diagram for establishing a correlation. In addition, when correcting the position of the CAD patterns CAD1 to CAD5 in the conveying direction (correcting the starting point of drawing), it is based on the high resolution encoder heads EN1, EN2 (rotation position detection mechanism 14) shown in Figure 4 or Figure 8. ) For each detected angular position of the rotating cylinder DR (conveying position of the substrate P), start drawing of each drawing line LL1 ~ LL5 (start accessing drawing data from the memory circuit). Specifically, after the control device 16 calculates the offset in the conveying direction between the drawing start position PO1 and the drawing end position PO2 of the patterns PT1 to PT5 that may be generated after the rotation correction performed by the rotating mechanism 24, that is Generated from the angular position of the rotating cylinder DR detected by each of the encoder reading heads EN1 and EN2 plus the corrected position information of ±ΔXs corresponding to the offset. Then, based on the corrected position information, the drawing of each drawing line LL1 to LL5 is started (starting to access drawing data from the memory circuit).

As described above, the first embodiment can adjust the tilt of the drawing lines LL1 to LL5 by rotating the second optical table 25 with the rotating mechanism 24 according to the transport speed of the substrate P detected by the rotating position detecting mechanism 14. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be formed linearly along the width direction of the substrate P by the drawing light beam LB scanned along the drawing lines LL1 to LL5. In addition, after the rotation of the second optical table 25 by the rotation mechanism 24, the drawing timing of the CAD patterns CAD1 to CAD5 is corrected, so that the patterns PT1 to PT5 drawn on the substrate P can be changed in the conveying direction of the substrate P The same location. Therefore, since the patterns PT1 to PT5 drawn on the substrate P can be corrected to be very suitable for joining in the width direction and the conveying direction (long direction) of the substrate P, it is possible to suppress joining errors caused by uneven speed.

In addition, in the first embodiment, the rotation mechanism 24 can be instantly rotated by the control device 16 in accordance with the transport speed of the substrate P detected by the rotation position detection mechanism 14. Therefore, even during drawing by the exposure apparatus EX, the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P can be adjusted, and the joining error due to the periodic speed unevenness of the rotating cylinder DR can be suppressed.

In addition, in the first embodiment, when the transfer speed of the substrate P is faster than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are inclined to the drawing start position PO1 of the drawing lines LL1 to LL5 of the reference speed. Further to the upstream side and further to the downstream side than the drawing end position PO2, the patterns PT1 to PT5 can be corrected very appropriately. In addition, when the transfer speed of the substrate P is slower than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are inclined to be more downstream than the drawing start position PO1 of the drawing lines LL1 to LL5 of the reference speed. Moreover, it is more upstream than the drawing end position PO2, and the patterns PT1 to PT5 can be corrected very appropriately.

Furthermore, in the first embodiment, since the drawing modules UW1 to UW5 can be configured including the light deflector 81 and the scanner 83, the drawing light beam LB can be scanned in a one-dimensional direction along the drawing lines LL1 to LL5.

In addition, in the first embodiment, by rotating the drawing device 11 provided on the second optical table 25 with the rotating mechanism 24, it is possible to adjust all the drawing lines LL1 to LL1 to while maintaining the positional relationship between the drawing lines LL1 to LL5. The tilt of LL5. Therefore, since the control device 16 only needs to control the rotation of the rotating mechanism 24, the control-related structure can be made into a simple structure.

In the first embodiment, the size (dot diameter) of the drawing light beam LB projected from the drawing modules UW1 to UW5 on the substrate P is set to D (μm), and the drawing light beam LB is set along the drawing lines LL1 to LL5 When the scanning speed is set to Vp (μm/sec), the light source device CNT can set the luminous repetition period T (sec) of the laser light source emitting pulsed light to the relationship of T<D/Vp. Therefore, the drawing beam LB can be scanned in the scanning direction while repeating the spot light of the drawing beam LB on the substrate P. Therefore, the drawing line of the drawing beam LB is in the scanning direction while the light deflector 81 is in the ON state. Draw as a continuous line without interruption.

In the first embodiment, the second optical table 25 is rotated by the rotation mechanism 24 to rotate the drawing device 11 relative to the substrate P, and the inclination of the drawing lines LL1 to LL5 is adjusted relative to the width direction of the substrate P. However, it is not limited to this configuration, as long as the inclination of the drawing lines LL1 to LL5 is relatively adjusted with respect to the width direction of the substrate P. That is, the exposure apparatus EX may be configured to rotate the rotation center line AX2 of the rotating cylinder DR in the XY plane with the rotation axis I as the center in the XY plane. In this case, in the conveyance path of the substrate P, at least the rollers RT1 and RT2 (FIG. 1) arranged before and after the rotating cylinder DR are also integrated and rotate in the XY plane with the rotation axis I as the center.

[Second Embodiment] Next, the exposure apparatus EX of the second embodiment will be described with reference to FIGS. 13 to 16. In addition, in the second embodiment, in order to avoid overlapping descriptions with the first embodiment, only the parts that are different from the first embodiment are described, and the same components as those in the first embodiment are given to the first embodiment. The same symbols are omitted for description. Fig. 13 is a diagram showing a part of the configuration of the f-θ lens system of the exposure apparatus of the second embodiment. Fig. 14 is a diagram showing the structure of the cylindrical lens of the f-theta lens system of Fig. 13. 15 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure device of the second embodiment. 16 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure device of the second embodiment. In the exposure apparatus EX of the first embodiment, the second optical table 25 is rotated by the rotation mechanism 24 to adjust the inclination of the drawing lines LL1 to LL5 as a whole. In contrast, the exposure apparatus EX of the second embodiment individually adjusts the inclination of each of the drawing lines LL1 to LL5.

In the exposure apparatus EX of the second embodiment, as shown in FIG. 13, the f-theta lens system 85 includes a telecentric f-theta lens 85a and a cylindrical lens 85b. In addition, in FIG. 13, illustration of lenses other than the telecentric f-theta lens 85a and the cylindrical lens 85b in the f-theta lens system 85 is omitted.

The telecentric f-θ lens 85a makes the irradiated drawing light beam LB become parallel light in the XZ plane and convergent light in the Y direction (scanning direction). The drawing beam LB, which is parallel light in the XZ plane, is irradiated to the cylindrical lens 85b. The cylindrical lens 85b is provided between the telecentric f-θ lens 85a and the substrate P. The cylindrical lens 85b has a generatrix substantially parallel to the scanning direction in which the drawing line LL1 (the same applies to LL2 to LL5), has a predetermined magnification (refractive power) in a direction orthogonal to the generatrix, and condenses the drawing light beam LB into a spot light. Furthermore, as shown in FIG. 14, the cylindrical lens 85b can be rotated about the rotation axes I1 to I5 in order to finely adjust the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P. The rotation axes I1 to I5 are rotation axes centered on a predetermined point in the drawing surface including the drawing lines LL1 to LL5 formed on the substrate P. The rotation axes I1 to I5 are, for example, a rotation axis centered on the center of the direction in which the drawing lines LL1 to LL5 extend, and are in the same direction as the axis of the drawing light beam LB. That is, the rotation axes I1, I3, I5 of the odd-numbered drawing lines LL1, LL3, LL5 are in the same direction as the setting azimuth line Le1, and the even-numbered drawing lines LL2, LL4’s rotation axes I2, I4 are the same as the setting azimuth Line Le2 is in the same direction. The cylindrical lens 85b is rotated by the driving part 100 around the rotation axes I1 to I5, and the rotation of the cylindrical lens 85b is controlled by the control device 16 connected to the driving part 100. Under the rotation centered on the rotation axis I1～I5 of the cylindrical lens 85b, the principal ray of the drawing beam projected on the substrate P through the vicinity of the rotation axis I1～I5 passes through the generatrix direction (Y direction) of the cylindrical lens 85b The principal rays of the drawing beam projected on the substrate P at both ends are slightly inclined in a direction orthogonal to the generatrix of the cylindrical lens 85b and any one of the rotation axes I1 ~ I5, so that the drawing on the substrate P can be made The lines LL1 to LL5 are slightly inclined.

Next, referring to FIG. 15, the adjustment of the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P will be described. In the exposure apparatus EX of the second embodiment, the driving unit 100 rotates the cylindrical lens 85b to tilt the drawing lines LL1 to LL5 with respect to the width direction of the substrate P. That is, the cylindrical lens 85b functions as a drawing line rotation mechanism for adjusting the inclination of the drawing lines LL1 to LL5.

The driving unit 100 rotates the cylindrical lens 85b around the rotation axes I1 to I5, thereby causing the drawing lines LL1 to LL5 of the drawing modules UW1 to UW5 to be inclined with respect to the width direction of the substrate P.

Here, the inclination adjustment of the drawing lines LL1 to LL5 when the patterns PT1 to PT5 are joined in the width direction of the substrate P to the substrate P conveyed at the reference speed before drawing by the exposure apparatus EX (for example, during alignment) will be described. In addition, since the tilt adjustment of the drawing lines LL1 to LL5 in the second embodiment in the above-mentioned case is substantially the same as the tilt adjustment of the drawing lines LL1 to LL5 in the first embodiment, a part of the description will be omitted for overlapping parts. As shown in FIG. 15, the control device 16 controls the driving unit 100 to rotate the cylindrical lens 85b based on the reference speed of the substrate P detected by the rotation position detection mechanism 14. At this time, similarly, the reference speed of the substrate P is in correspondence with the rotation amount of the cylindrical lens 85b. Specifically, the control device 16 rotates the cylindrical lens 85b according to the reference speed of the substrate P, so that the drawing start position PO1 of the drawing lines LL1 to LL5 is located upstream in the conveying direction and the drawing end position PO2 of the drawing lines LL1 to LL5 In the method on the downstream side in the conveying direction, the cylindrical lens 85b is rotated with respect to the substrate P.

As shown in FIG. 15, after the drawing lines LL1 to LL5 are respectively inclined around the rotation axes I1 to I5, the positions of the drawing lines LL1 to LL5 in the conveying direction are substantially unchanged. Therefore, the respective patterns PT1 to PT5 drawn on the substrate P by the rotated drawing lines LL1 to LL5 are linearly formed in the direction substantially the same as the width direction of the substrate P, as shown by the solid line in FIG. 15. Moreover, it becomes the same position also in the board|substrate P conveyance direction. As described above, the patterns PT1 to PT5 are formed in a row along the width direction of the substrate P to be joined together.

Next, in the drawing by the exposure apparatus EX, the drawing line when the patterns PT1 to PT5 are joined together in the width direction of the substrate P for the substrate P whose speed changes only slightly due to the uneven speed from the reference speed and is conveyed at the same time Tilt adjustment of LL1～LL5. In addition, since the tilt adjustment of the drawing lines LL1 to LL5 in the second embodiment in the above-mentioned case is substantially the same as the tilt adjustment of the drawing lines LL1 to LL5 in the first embodiment, a part of the description is omitted for overlapping parts. As shown in FIG. 15, the driving unit 100 tilts the drawing lines LL1 to LL5 by a predetermined degree with respect to the width direction of the substrate P for the substrate P that is conveyed at a reference speed, so that the patterns PT1 to PT5 are very suitable in the width direction of the substrate P地相接。 Ground joint.

From the state shown in FIG. 15, after the substrate P is transported at a faster transport speed than the reference speed, the patterns PT1 to PT5 formed on the substrate P have the end PTa located on the downstream side of the transport direction than the end PTb The way is formed obliquely. On the other hand, after the substrate P is transported at a transport speed slower than the reference speed, the patterns PT1 to PT5 formed on the substrate P are formed obliquely so that the end PTa is located more upstream than the end PTb in the transport direction.

When the transfer speed of the substrate P detected by the rotation position detection mechanism 14 becomes faster than the reference speed, the control device 16 sets the drawing start position PO1 of the drawing lines LL1 to LL5 to the reference speed in the same manner as in the first embodiment. The drawing start position PO1 of the drawing lines LL1～LL5 is located more upstream in the conveying direction, and the drawing end position PO2 of the drawing lines LL1～LL5 is located further downstream than the drawing end position PO2 of the drawing lines LL1～LL5 of the reference speed. In this way, the drive unit 100 of each cylindrical lens 85b is controlled to incline the drawing lines LL1 to LL5. On the other hand, when the transfer speed of the substrate P detected by the rotation position detection mechanism 14 is slower than the reference speed, the control device 16 uses the drawing start position PO1 of the drawing lines LL1 to LL5 to be higher than the drawing line LL1 to LL5 of the reference speed. The drawing start position PO1 is located further downstream in the conveying direction, and the drawing end position PO2 of the drawing line LL1～LL5 is located more upstream than the drawing end position PO2 of the drawing line LL1～LL5 of the reference speed in the conveying direction to control each column The driving part 100 of the lens 85b inclines the drawing line.

Here, the exposure apparatus EX of the second embodiment adjusts the inclination of the drawing lines LL1 to LL5 individually. Therefore, the drawing modules UW1, UW3, UW5 on the upstream side (odd-numbered) drawing lines LL1, LL3, LL5 and the drawing modules UW2, UW4 on the downstream side (even-numbered) drawing modules can be separated across the center plane p3 Draw lines LL2, LL4 and adjust the tilt respectively.

The speed unevenness generated during the drawing by the exposure device EX may be different in the rotation position of the rotating cylinder DR in the circumferential direction. Specifically, there is a case where the conveying speed of the substrate P where the azimuth line Le1 is set is different from the conveying speed of the substrate P where the azimuth line Le2 is set. In this case, the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 are inclined to the substrate P in the same way. Thus, for example, as shown in FIG. 16, there are patterns PT1, PT3, PT5 formed with odd-numbered drawing lines LL1, LL3, LL5 along the width direction of the substrate P, and on the other hand, even-numbered drawing lines LL2, The patterns PT2 and PT4 formed by LL4 are formed obliquely with respect to the width direction of the substrate P as shown by the broken line in FIG. 16. The reason is that because the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 are arranged separately in the Xs direction, the pattern to be drawn on the substrate P in the same area in the Xs direction will have This is due to the time difference corresponding to the transfer speed of the substrate P.

The control device 16 detects the conveying speed of the substrate P at the set azimuth line Le1 detected by the encoder read head EN1 of the rotation position detection mechanism 14 and detects the presence of the encoder read head EN2 detected by the rotation position detection mechanism 14 Set the conveying speed of the substrate P of the azimuth line Le2. Next, the control device 16 detects the speed difference between the detected conveyance speed of the substrate P on the set azimuth line Le1 and the detected conveyance speed of the substrate P on the set azimuth line Le2. In this way, the control device 16 is configured to include a function as a speed difference detecting mechanism for detecting the speed difference between the transport speed of the substrate P on the installation azimuth line Le1 and the transport speed of the substrate P on the installation azimuth line Le2. Next, the control device 16 controls the drive unit 100 of the cylindrical lens 85b provided in the even-numbered drawing modules UW2, UW4 to adjust the inclination of the even-numbered drawing lines LL2, LL4 according to the detected speed difference. The patterns PT2 and PT4 exposed on the substrate P after the rotation adjustment of the cylindrical lens 85b are formed linearly along the width direction of the substrate P in the same way as the patterns PT1, PT3, and PT5.

As described above, in the second embodiment, the driving unit 100 rotates the cylindrical lens 85b according to the transport speed of the substrate P detected by the rotation position detection mechanism 14, whereby the inclination of the drawing lines LL1 to LL5 can be adjusted respectively. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be formed linearly along the width direction of the substrate P by the drawing light beam LB scanned along the drawing lines LL1 to LL5, and the same positions are also located in the conveying direction of the substrate P . Therefore, the patterns PT1 to PT5 drawn on the substrate P can be corrected to be very appropriately joined in the width direction of the substrate P and the conveying direction (long direction), and the joining error caused by uneven conveying speed of the substrate P can be further suppressed.

In addition, in the second embodiment, the mechanism for adjusting the inclination of the drawing lines LL1 to LL5 (drawing line rotation mechanism) can adopt a simple structure composed of the drive unit 100 and the cylindrical lens 85b.

In addition, in the second embodiment, it is possible to detect the conveying speed of the drawing lines LL1, LL3, LL5 of the drawing modules UW1, UW3, UW5 on the upstream side (odd-numbered) and the conveying speed of drawing modules UW2 on the downstream side (even-numbered) , The speed difference of the conveying speed of UW4 drawing line LL2, LL4, adjust the inclination of drawing line LL1～LL5 according to the detected speed difference. Therefore, even if the drawing module UW1, UW3, UW5 of the odd number draws the drawing line LL1, LL3, LL5 when drawing, the conveying speed of the substrate P and the drawing module UW2, UW4 of the even number drawing line LL2, LL4 when drawing When the conveying speed of the substrate P is different, the patterns PT1 to PT5 drawn on the substrate P can be corrected to be very appropriately joined and exposed in the width direction and the conveying direction of the substrate P. Therefore, the uneven speed can be suppressed. The joining error.

In addition, in the second embodiment, the drawing lines LL1 to LL5 are rotated around the rotation axes I1 to I5, but the center of rotation is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

[The third embodiment] Next, the exposure apparatus EX of the third embodiment will be described with reference to FIG. 17. In addition, the third embodiment also similarly, in order to avoid overlapping descriptions with the first and second embodiments, only the differences from the first and second embodiments are described, and the differences with the first and second embodiments Components with the same form are given the same reference numerals as in the first and second embodiments, and the description is omitted. FIG. 17 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure device of the third embodiment. The exposure apparatus EX of the first embodiment adjusts the inclination of the drawing lines LL1 to LL5 as a whole by rotating the second optical table 25 with the rotating mechanism 24. In contrast, the exposure apparatus EX of the third embodiment adjusts the drawing timing without changing the inclination of the drawing lines LL1 to LL5.

In the exposure apparatus EX of the third embodiment, as shown in FIG. 17, the control device 16 corrects the drawing timing according to the transport speed or transport position of the substrate P detected by the rotation position detection mechanism 14. In addition, the correction of the drawing time point is the same as in the first embodiment. As shown in FIG. 12, the CAD information used for drawing on the substrate P is corrected in the conveying direction. That is, the control device 16 connects the CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 formed on the substrate P so that the ends PTa and PTb of the patterns PT1 to PT5 are joined to each other. Correct it in the conveying direction.

In this way, the control device 16 corrects the CAD shown by the solid line in FIG. 12 in accordance with the transfer speed or the transfer position of the substrate P detected by the rotation position detection mechanism 14 during the alignment or drawing of the exposure device EX The positions of the patterns CAD1 to CAD5 in the conveying direction can thereby be drawn on the substrate P as the patterns PT1 to PT5 shown in FIG. 17.

As described above, in the third embodiment, the drawing timing of the drawing modules UW1 to UW5 can be corrected based on the conveying speed or conveying position of the substrate P detected by the rotation position detection mechanism 14. Therefore, although the patterns PT1 to PT5 drawn on the substrate P are inclined with respect to the width direction of the substrate P, they can be corrected so as to be joined in the width direction of the substrate P, so that joining errors due to uneven speed can be suppressed.

[Fourth Embodiment] Next, the exposure apparatus EX of the fourth embodiment will be described with reference to FIG. 18. In addition, the fourth embodiment also similarly, in order to avoid overlapping descriptions with the first to third embodiments, only the differences from the first to third embodiments are described, and the first to third embodiments The constituent elements with the same form are given the same reference numerals as in the first to third embodiments, and the description is omitted. 18 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure device of the fourth embodiment. In the exposure apparatus EX according to the first to third embodiments, the scanning directions of the drawing light beams LB scanned along the drawing lines LL1 to LL5 are all the same. On the other hand, in the exposure apparatus EX of the fourth embodiment, the scanning direction of the drawing beam LB scanned along the drawing modules UW1, UW3, UW5 of the odd numbered drawing modules UW1, UW3, and LL5 among the drawing lines LL1 to LL5 and The scanning direction of the drawing beam LB scanned along the drawing lines LL2, LL4 of the even-numbered drawing modules UW2, UW4 is the opposite direction.

In the exposure apparatus EX of the fourth embodiment, as shown in FIG. 18, the point light of the drawing light beam LB projected from each of the plurality of drawing modules UW1 to UW5 to the substrate P is from the drawing line LL1 to LL5 along the straight line The drawing start position PO1 is scanned in the Y direction to the drawing end position PO2. At this time, the scanning direction of the point light of the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 and the scanning direction of the point light of the drawing beam LB scanned along the drawing lines LL2, LL4 are opposite directions. This can be achieved by rotating the rotating polygon mirror 97 of each drawing module shown in FIG. 7 in the same direction (for example, all around counterclockwise).

Therefore, the patterns PT1, PT3, PT5 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 (set on a straight line parallel to the center plane p3) are affected by the conveying speed of the substrate P , And for example, it is formed obliquely to the upper right in the paper of FIG. That is, the right end PTa of the patterns PT1, PT3, PT5 is formed on the downstream side in the conveying direction compared to the left end PTb of the patterns PT1, PT3, PT5. On the other hand, the patterns PT2, PT4 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL2, LL45 (set on a straight line parallel to the center plane p3) are affected by the conveying speed of the substrate P, and It is formed in a direction opposite to the patterns PT1, PT3, and PT5, that is, it is formed obliquely to the upper left in the paper surface of Fig. 18. That is, the end PTb on the right side of the patterns PT2 and PT4 is formed on the upstream side of the conveying direction compared to the end PTa on the left side of the patterns PT2 and PT4.

Furthermore, if the Xs-direction interval between the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 is constant, there is no unevenness in the conveying speed of the substrate P, the rotation speed of the rotating polygon mirror 97 of each drawing module For consistency, the left end PTb of the pattern PT1 drawn by the drawing line LL1 and the right end PTb of the pattern PT2 drawn by the drawing line LL2 are in the width direction (Y direction) of the substrate P and the conveying direction (Xs direction) Splice. Similarly, the left end PTa of the pattern PT2 drawn by the drawing line LL2 and the right end PTa of the pattern PT3 drawn by the drawing line LL3 are also joined in the Y direction and the Xs direction, so that the left side of the pattern PT3 drawn by the drawing line LL3 The end PTb and the right end PTb of the pattern PT4 drawn by the drawing line LL4 are also joined in the Y direction and the Xs direction, and the end PTa on the left side of the pattern PT4 drawn by the drawing line LL4 and the right side of the pattern PT5 drawn by the drawing line LL5 The end PTa is also joined in the Y direction and the Xs direction.

As shown in the fourth embodiment, if the scanning direction of the point light of the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 and the scanning direction of the point light of the drawing beam LB scanned along the drawing lines LL2, LL4 are In the opposite direction, as long as there is no unevenness in the conveying speed of the substrate P, even if the patterns PT1 to PT5 drawn on the substrate P are slightly inclined with respect to the width direction (Y axis) of the substrate P, they can still be joined in the width direction of the substrate P.

Fig. 19 shows a situation where the slight inclination of the patterns PT1 to PT5 drawn on the substrate P is corrected as shown in Fig. 18. Here, as in the second embodiment (Fig. 14), the drive unit 100 The cylindrical lens 85b of the f-θ lens system 85 is slightly rotated around the rotation axes I1 to I5 to individually adjust the inclination of the drawing lines LL1 to LL5.

As shown in Figure 19, the drawing start position PO1 of the drawing lines LL1, LL3, LL5 is located on the upstream side (-Xs direction) of the conveying direction, and the drawing end position PO2 of the drawing lines LL1, LL3, LL5 is located on the downstream side of the conveying direction ( +Xs direction), the cylindrical lens 85b in each drawing module UW1, UW3, UW5 is rotated relative to the substrate P by the driving unit 100. On the other hand, the drawing start position PO1 of the drawing lines LL2, LL4 is located on the upstream side of the conveying direction (-Xs direction), and the drawing end position PO2 of the drawing lines LL2, LL4 is located on the downstream side of the conveying direction (+Xs direction), The cylindrical lens 85b is rotated relative to the substrate P by the driving unit 100.

As shown in FIG. 19, after the drawing lines LL1 to LL5 are respectively inclined around the rotation axes I1 to I5, the patterns PT1 to PT5 on the substrate P are drawn using the rotated drawing lines LL1 to LL5, as shown in FIG. 19 The solid lines are linearly aligned and formed in substantially the same direction as the width direction of the substrate P, and are at the same position in the transport direction (Xs direction) of the substrate P. In this way, as long as the substrate P transport speed is precisely constant and there is no speed unevenness, the drawn patterns PT1 to PT5 will be linearly contacted along the width direction of the substrate P to form a line. In addition, although it is the same as the second embodiment, the point where the rotation axis I1, I3, I5 of the cylindrical lens 85b of the odd-numbered f-θ lens system 85 and the Y-Xs plane intersect is on a line parallel to the Y-axis .

In the drawing by the exposure apparatus EX, when the conveying speed of the substrate P where the azimuth line Le1 is set is different from the conveying speed of the substrate P where the azimuth line Le2 is set, it is the same as in the second embodiment. For example, as shown in FIG. 20 As shown by the solid line, the patterns PT1, PT3, PT5 formed by the odd-numbered drawing lines LL1, LL3, LL5 are formed along the width direction of the substrate P, and on the other hand, as shown by the broken line in FIG. 20, the even-numbered The patterns PT2 and PT4 formed by the drawing lines LL2 and LL4 are formed obliquely with respect to the width direction of the substrate P.

Therefore, the control device 16 detects the transfer speed of the substrate P at the set azimuth line Le1 detected by the encoder read head EN1 of the rotation position detection mechanism 14 and the setting detected by the encoder read head EN2 of the rotation position detection mechanism 14 The speed difference of the transfer speed of the substrate P on the azimuth line Le2. Next, the control device 16 adjusts the inclination of the even-numbered drawing lines LL2, LL4 based on the detected speed difference. The patterns PT2 and PT4 after the rotation are formed along the width direction of the substrate P in the same way as the patterns PT1, PT3 and PT5.

As described above, in the fourth embodiment, the drive unit 100 rotates the cylindrical lens 85b in accordance with the transport speed of the substrate P detected by the rotation position detection mechanism 14, whereby the inclination of the drawing lines LL1 to LL5 can be adjusted respectively. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be precisely joined and formed along the width direction of the substrate P without being inclined by the drawing beam LB scanned along the drawing lines LL1 to LL5, and in the conveying direction of the substrate P It can also be joined in the same position. Therefore, since the patterns PT1 to PT5 drawn on the substrate P can be corrected to be very appropriately joined in the width direction of the substrate P, even if the drawing timing is not corrected as in the first embodiment, it is possible to suppress the speed unevenness. Joint error.

In addition, in the fourth embodiment, similar to the second embodiment, although the drawing lines LL1 to LL5 are rotated around the rotation axes I1 to I5, the rotation center is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

In addition, in the first to fourth embodiments, although the scale portions GPa and GPb formed on the outer peripheral surface of the rotating cylinder DR are used to detect the rotation position (movement position of the substrate P) or the conveying speed of the rotating cylinder DR, they are not limited Posed here. For example, a scale disc with high roundness can also be installed on the rotating cylinder DR. This scale disc has scale parts GPa and GPb engraved on the outer peripheral surface, and is fixed at the end of the rotating cylinder DR to be orthogonal to the rotation center line AX2. Therefore, the scale disc rotates integrally with the rotation cylinder DR around the rotation center line AX2. In addition, the scale disc uses low thermal expansion metal, glass, ceramics, etc. as the base material, and is made as large as possible in order to improve the measurement decomposition ability (for example, the diameter is more than 20 cm). For the scale disc, the diameter of the outer peripheral surface of the substrate P wound around the rotating cylinder DR is the same (approximately the same) as the diameters of the scale parts GPa and GPb of the scale disc, which can further reduce the so-called measuring Abbe error.

Furthermore, the respective configurations of the first to fourth embodiments may be appropriately combined. For example, it is possible to slightly rotate a plurality of drawing modules UW1 to UW5 as a whole by the rotating mechanism 24 as in the first embodiment, and to make the drawing modules UW1 to UW5 as in the second embodiment (or the fourth embodiment). The cylindrical lens 85b of the f-θ lens system 85 rotates slightly individually. Furthermore, as shown in FIG. 3, the respective positions of the plurality of alignment marks Ks1, Ks2, and Ks formed on the substrate P can be detected by the corresponding alignment microscope AM1, and the measurement on the substrate P can be continued. Exposure area A7 has two-dimensional expansion and contraction or nonlinear distortion and other tendencies.

Therefore, by matching the two-dimensional expansion and contraction deformation or nonlinear distortion deformation of the exposure area A7 measured by the alignment microscope AM1, the lines or the whole of the drawn lines LL1 to LL5 are corrected on the surface of the substrate P in real time Slightly tilted, that is, the overlap accuracy of the pattern layer formed in the exposure area A7 on the substrate P and the drawing pattern to be overlapped and exposed thereon can be suppressed within the allowable range in the exposure area A7.

In addition, in the first to fourth embodiments, the substrate P is supported on the outer peripheral surface of the rotating cylinder DR and the rotating cylinder DR is rotated, thereby conveying the substrate P in the longitudinal direction while drawing the pattern on the substrate. The structure of the part supported by the rotating cylinder DR of P is not limited to this. For example, it may be a configuration in which a pattern is drawn while conveying both the stage and the substrate P in the longitudinal direction while being sucked and supported on the surface of the stage that supports the substrate P flatly, or it may be used to load the substrate P When placed on the flat surface of the support table, an air bearing layer is formed between the surface of the support table and the back surface of the substrate P, and the substrate P is supported in a non-contact or low-friction state to be transported in a plane shape while drawing the pattern. .

Furthermore, in each of the first to fourth embodiments, when adjusting the inclination of the entire drawing lines LL1 to LL5 in the XY plane, the rotation mechanism 24 and the second optical table 25 shown in FIG. 2 are slightly rotated. , But it is also possible to shift the positions of the bearings at both ends of the shaft portion Sf2 of the pivoting rotating cylinder DR slightly to the X direction, so that the entire rotating cylinder DR is inclined in the XY plane. In addition, when changing the transport speed in the longitudinal direction of the substrate P supported on the rotating cylinder DR from the reference speed, or when the transport speed has speed unevenness, it can also be adapted to the changed speed or speed unevenness The rotation speed of the rotating polygon mirror 97 of each of the drawing units UW1 to UW5 is dynamically changed. That is, the ratio of the scanning speed (main scanning speed) Vp of the point light scanned along each of the drawing lines LL1 to LL5 and the transport speed (sub-scanning speed) Vxs in the longitudinal direction of the substrate P can be transported on the substrate P The situation where the speed has changed is also roughly a certain way to control the rotation speed of the rotating polygon mirror 97.

＜Component manufacturing method＞ Next, a method of manufacturing the element will be described with reference to FIG. 21. Fig. 21 is a flowchart showing the device manufacturing method of each embodiment.

In the device manufacturing method shown in FIG. 21, first, the function and performance design of a display panel formed using a self-luminous device such as organic EL is performed, and the required circuit patterns and wiring patterns are designed by CAD or the like (step S201). And prepare a supply reel on which the flexible substrate P (resin film, metal foil film, plastic, etc.) as the base material of the display panel is wound (step S202). In addition, the roll-shaped substrate P prepared in this step S202 may be one whose surface has been modified as necessary, or one that has been formed in advance (for example, micro-concave and convex by imprint method), or one that has been pre-laminated with light. Inductive functional film or transparent film (insulating material).

Next, a base layer composed of electrodes or wiring, insulating film, TFT (thin film semiconductor), etc., which constitute the display panel elements, is formed on the substrate P, and a light emitting element composed of self-luminous elements such as organic EL is formed by stacking on the base plate. Layer (display pixel portion) (step S203). In this step S203, it also includes the conventional lithography process for exposing the photoresist layer using the exposure device EX described in the previous embodiments, and the substrate P coated with a photosensitive silane coupling agent instead of the photoresist. An exposure process for pattern exposure to form a water-repellent pattern on the surface, a wet process for pattern exposure of a photosensitive catalyst layer to form metal film patterns (wiring, electrodes, etc.) by electroless plating, Or use conductive inks containing silver nanoparticles to draw patterns in a printing process, etc.

Then, cut the substrate P for each display panel element continuously manufactured on the long substrate P in a roll manner, or attach a protective film (environmental barrier layer) or color filter film on the surface of each display panel element, etc., Assemble components (step S204). Then, a step of checking whether the display panel element can operate normally or whether it meets the desired performance and characteristics is performed (step S205). Through the above methods, display panels (flexible displays) can be manufactured.

1: Component manufacturing system 11: Drawing device 12: Substrate transport mechanism 13: device frame 14: Rotation position detection mechanism 16: control device 21: body frame 22: Three-point seat support 23: 1st optical platform 24: Rotating mechanism 25: 2nd optical platform 31: Calibration and Testing System 44: XY overall bisection adjustment mechanism 45: XY unilateral halving adjustment mechanism 51:1/2 wavelength plate 52: Polarizing beam splitter 53: Diffuser 60: 1st beam splitter 62: 2nd beam splitter 63: 3rd beam splitter 73: 4th beam splitter 81: Optical deflector 82:1/4 wavelength plate 83: Scanner 85: f-theta lens system 86: Optical components for Y magnification correction 92: visor 96: mirror 97: Rotating polygon mirror 98: Origin detector 100: Drive P: substrate U1, U2: Processing device EX: Exposure device AM1, AM2: Align the microscope EVC: Adjusting the greenhouse SU1, SU2: Anti-vibration unit E: Setting surface EPC: Edge Position Controller RT1, RT2: Tension adjustment roller DR: rotating cylinder AX2: Rotation centerline Sf2: Shaft p3: center plane DL: Slack UW1～UW5: Drawing module CNT: light source device LB: Delineate beam I: Rotation axis LL1～LL5: Drawing line PBS: Polarizing beam splitter A7: Exposure area SL: branch optics (beam distribution system) Le1～Le4: Set bearing line Vw1～Vw6: Observation area Ks1～Ks3: alignment mark GPa, GPb: scale part EN1～EN4: Encoder reading head PT1～PT5: Pattern

Fig. 1 is a diagram showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. [Fig. 2] A perspective view showing the configuration of the main parts of the exposure apparatus in Fig. 1. [Fig. [Figure 3] is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. [Fig. 4] is a diagram showing the structure of the rotating cylinder and the drawing device of the exposure device of Fig. 1. [Fig. [FIG. 5] A plan view showing the arrangement of the main parts of the exposure apparatus of FIG. 1. [FIG. 6] A perspective view showing the structure of a branched optical system of the exposure device in FIG. 1. [Fig. 7] is a diagram showing the arrangement relationship of each scanner in a plurality of drawing modules set in the exposure device of Fig. 1. [Fig. [Figure 8] is a perspective view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate and the encoder read head. [Fig. 9] A perspective view showing the surface structure of the rotating cylinder of the exposure device in Fig. 1. [Fig. Fig. 10 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate by the exposure device of the first embodiment and the drawing line. Fig. 11 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate by the exposure device of the first embodiment and the drawing line. [Fig. 12] A diagram showing an image of CAD information used in the exposure apparatus of the first embodiment. Fig. 13 is a diagram showing a part of the configuration of the f-θ lens system of the exposure apparatus of the second embodiment. [Fig. 14] A diagram showing the configuration of a cylindrical lens of the f-theta lens system in Fig. 13. Fig. 15 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate by the exposure device of the second embodiment and the drawing line. Fig. 16 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the second embodiment. Fig. 17 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the third embodiment. Fig. 18 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line when the inclination correction of the drawing line is not performed in the exposure apparatus of the fourth embodiment. Fig. 19 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line after performing the tilt correction of the drawing line in the exposure apparatus of the fourth embodiment. Fig. 20 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line when the inclination of the drawing line is corrected according to the unevenness of the conveying speed of the substrate in the exposure apparatus of the fourth embodiment. [Fig. 21] is a flowchart showing a method of manufacturing an element using the exposure apparatus of the first to fourth embodiments.

11: Drawing device

13: device frame

14: Rotation position detection mechanism

21: body frame

22: Three-point seat support

23: 1st optical platform

24: Rotating mechanism

25: 2nd optical platform

AX2: Rotation centerline

DR: rotating cylinder

EX: Exposure device

I: Rotation axis

P: substrate

RT2: Tension adjustment roller

Sf2: Shaft

UW1~UW5: drawing module

Claims (7)

A pattern drawing device that projects a drawing beam whose intensity is adjusted according to drawing data corresponding to a pattern for an electronic component on a flexible substrate with a predetermined width, and draws the aforementioned pattern, including: The substrate conveying mechanism supports the substrate and conveys it in a conveying direction that crosses the width direction of the substrate at a predetermined speed; The drawing device has a plurality of drawing modules, and the pattern is drawn on the substrate along a drawing line obtained by scanning the spot light of the drawing beam projected on the substrate in the width direction in a narrower range than the width of the substrate And equipped with a platform to hold the plurality of drawing modules in such a manner that the patterns drawn on the substrate by each of the plurality of drawing modules are joined to each other in the width direction of the substrate; The first rotation mechanism is arranged to be capable of relatively rotating the platform and the substrate conveying mechanism within a drawing surface including the drawing line formed by each of the plurality of drawing modules; and The second rotation mechanism is provided in each of the plurality of drawing modules, and individually adjusts the inclination of the drawing lines formed by each of the plurality of drawing modules. Such as the pattern drawing device of claim 1, wherein: The aforementioned substrate is an elongated sheet-like substrate in the aforementioned conveying direction; The substrate conveying device has a rotating cylinder, and the rotating cylinder has a cylindrical outer peripheral surface that supports a portion of the sheet substrate in the longitudinal direction, and rotates around a predetermined central axis to move the sheet substrate to the length Convey in the same direction. For example, the pattern drawing device of claim 2, which further includes: The rotation position detection mechanism is composed of a scale part and an encoder reading head; the scale part has a peripheral surface with a predetermined radius from the central axis of the rotating cylinder, and scales are engraved at a certain interval along the circumferential direction , Rotating around the center axis together with the rotating cylinder; the encoder read head is arranged facing the outer circumferential surface of the scale portion to detect the position change of the scale of the scale portion in the circumferential direction; and The control device measures the change in the conveying speed of the sheet substrate with respect to a preset reference speed based on the change in the position of the scale detected by the rotation position detecting mechanism. Such as the pattern drawing device of claim 3, wherein: The second rotating mechanism provided in each of the plurality of drawing modules is driven and controlled by the control device according to the measured change in the conveying speed. Such as the pattern drawing device of claim 3, wherein: The first rotating mechanism is driven and controlled by the control device based on the measured change in the conveying speed. Such as the pattern drawing device of claim 4 or 5, wherein, The control device adjusts each drawing timing of the plurality of drawing modules in accordance with the inclination of the drawing line caused by the first rotating mechanism or the second rotating mechanism. Such as the pattern drawing device of claim 3, wherein: Each of the aforementioned plural drawing modules has: Rotate the polygon mirror to deflect and scan the point light of the drawing beam projected to the sheet substrate to one direction; The f-θ lens guides the drawing light beam deflected and scanned by the rotating polygon mirror to the drawing line on the sheet substrate; and The cylindrical lens is arranged between the f-θ lens and the sheet substrate, has a generatrix substantially parallel to the direction in which the drawing line extends, and focuses the drawing beam in a direction orthogonal to the generatrix; The rotation speed of the rotating polygon mirror is controlled to dynamically change according to the measured change in the conveying speed.

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