JP6794980B2 - Substrate processing equipment and device manufacturing method - Google Patents

Description

The present invention relates to a substrate processing apparatus, and a及beauty device manufacturing method.

Conventionally, as a substrate processing apparatus, a scanning type drawing apparatus that draws at a predetermined position on a sheet-like medium (substrate) is known (see, for example, Patent Document 1). The scanning drawing apparatus includes a drawing table, a laser light source, an optical modulator, and a scanning optical system. The drawing table is conveyed in the conveying direction (sub-scanning direction) with the medium placed on it. The laser light source irradiates the laser light toward the light modulator. As the light modulator, for example, an acousto-optic modulator (AOM) is used to modulate the laser light emitted from the laser light source. When the light modulator is switched to ON, the laser light is deflected by diffraction and the laser light is projected onto the medium. On the other hand, when the light modulator is switched to OFF, the laser light is not deflected and the laser light is not projected onto the medium. The scanning optical system scans the laser beam emitted from the light modulator in the scanning direction along a predetermined scanning line from the scanning start end to the scanning end end on the medium. Then, the scanning drawing device modulates the laser light with an optical modulator while transporting the medium in the sub-scanning direction by the drawing table, and scans the spot light of the laser light modulated by the scanning optical system in the scanning direction. Then, draw on the medium.

Japanese Unexamined Patent Publication No. 2000-227661

By the way, the substrate to be drawn becomes larger as the size of the device is increased. The larger the substrate, the larger the pattern drawn on the substrate. Here, in the scanning drawing apparatus of Patent Document 1, since drawing is performed by one scanning line, when the pattern drawn on the substrate becomes large, the scanning line by the spot light of the laser beam becomes long. However, in the scanning drawing apparatus of Patent Document 1, since the length of the scanning line is limited, the size of the pattern drawn on the substrate is limited by the length of the scanning line.

Therefore, a so-called multi-beam type drawing method in which a pattern is drawn on a substrate by a plurality of scanning lines (drawing lines) can be considered. In such a multi-beam type drawing method, a plurality of drawing lines are arranged side by side in the direction of the scanning lines, and each pattern formed by each scanning line is spliced in the width direction orthogonal to the transport direction of the substrate. Therefore, it is possible to draw a large pattern on the substrate.

Even in the multi-beam type drawing method, a pattern is drawn on the board by a plurality of drawing lines while transporting the board in the transport direction. Therefore, the pattern drawn from the drawing start position to the drawing end position of each drawing line is the board. When the transfer speed becomes uneven, the drawing start position and the drawing end position are different on the order of microns in the transfer direction. For this reason, there is a possibility that a phenomenon in which the splicing accuracy of patterns adjacent to each other in the width direction of the substrate deteriorates, that is, a splicing error occurs.

In the embodiment of the present invention, in view of the above problems, even in the multi-beam type drawing method in which a plurality of drawing lines are connected, the splicing error between the patterns spliced in the width direction of the substrate is satisfactorily reduced. That is the issue.

According to the first embodiment of the present invention, a substrate transport mechanism that transports a substrate having a predetermined width at a predetermined speed in a transport direction intersecting the width direction of the substrate while supporting the substrate, and a drawing beam projected on the substrate. A plurality of drawing modules for drawing a predetermined pattern on the substrate along a drawing line obtained by scanning in the width direction in a range narrower than the width of the substrate are provided, and each of the plurality of drawing modules A drawing device in which the drawing lines adjacent to each other in the width direction are arranged at predetermined intervals in the transport direction so that the patterns drawn on the substrate are joined in the width direction of the substrate. The substrate is provided with an inclination adjusting mechanism for adjusting the relative inclination of the drawing line with respect to the width direction of the substrate and a substrate speed detecting device for detecting the transport speed of the substrate, and is detected by the substrate speed detecting device. A substrate processing device for adjusting the relative inclination of the drawing line by the inclination adjusting mechanism is provided based on the transfer speed of the drawing line.

According to the second embodiment of the present invention, a device manufacturing system including the substrate processing apparatus according to the first aspect of the present invention is provided.

According to the third embodiment of the present invention, the drawing from each of the plurality of drawing modules is performed on the light-sensitive layer formed on the substrate by using the substrate processing apparatus according to the first aspect of the present invention. Device manufacturing including scanning the beam to draw a spliced pattern and processing the substrate to form a layered structure of the device on the substrate according to the spliced pattern. A method is provided.

FIG. 1 is a diagram showing the overall configuration of the exposure apparatus (board processing apparatus) of the first embodiment. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing a configuration of a rotating drum and a drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of each scanner in a plurality of drawing modules provided in the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement relationship between the alignment microscope, the drawing line, and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG. FIG. 10 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate by the exposure apparatus of the first embodiment and the drawing line. FIG. 11 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the first embodiment. FIG. 12 is a diagram showing an image of CAD information used in the exposure apparatus of the first embodiment. FIG. 13 is a diagram showing a partial configuration of the f−θ lens system of the exposure apparatus of the second embodiment. FIG. 14 is a diagram showing a configuration of a cylindrical lens of the f−θ lens system of FIG. FIG. 15 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate by the exposure apparatus of the second embodiment and the drawing line. FIG. 16 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the second embodiment. FIG. 17 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the third embodiment. FIG. 18 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line when the tilt correction of the drawing line is not performed by the exposure apparatus of the fourth embodiment. FIG. 19 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line after the tilt correction of the drawing line is performed by the exposure apparatus of the fourth embodiment. FIG. 20 shows an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line when the tilt correction of the drawing line is corrected according to the unevenness of the transport speed of the substrate by the exposure apparatus of the fourth embodiment. It is a figure. FIG. 21 is a flowchart showing a device manufacturing method using the exposure apparatus of the first to fourth embodiments.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate. In addition, various omissions, substitutions or changes of components can be made without departing from the gist of the present invention.

[First Embodiment]
FIG. 1 is a diagram showing the overall configuration of the exposure apparatus (board processing apparatus) of the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs exposure processing on the substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various treatments on the substrate P after exposure to manufacture a device. ing. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line (flexible electronic device manufacturing line) for manufacturing electronic devices such as flexible displays, multi-layer flexible wiring, and flexible sensors as devices. In the following embodiments, a flexible display will be described as an example of an electronic device. Flexible displays include, for example, organic EL displays. In this device manufacturing system 1, the substrate P is sent out from a supply roll (not shown) in which a long flexible substrate P is wound in a roll shape, and various treatments are performed on the sent out substrate P. Is continuously applied, and then the treated substrate P is wound as a flexible device on a collection roll (not shown), which is a so-called roll-to-roll method. In the device manufacturing system 1 of the first embodiment, the substrate P, which is a film-like sheet, is sent out from the supply roll, and the substrate P sent out from the supply roll is sequentially delivered to the process apparatus U1, the exposure apparatus EX, and the process apparatus. An example is shown from U2 to winding on a collection roll. Here, the substrate P to be processed by the device manufacturing system 1 will be described.

As the substrate P, for example, a resin film, a foil made of a metal such as stainless steel, or an alloy is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Contains 1 or 2 or more.

For the substrate P, for example, it is desirable to select a substrate P having a coefficient of thermal expansion not significantly large so that the amount of deformation due to heat received in various treatments applied to the substrate P can be substantially ignored. The coefficient of thermal expansion may be set to be smaller than the threshold value according to the process temperature or the like by, for example, mixing an inorganic filler with the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. Further, the substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above resin film, foil or the like is bonded to the ultrathin glass. It may be.

The substrate P configured in this way is wound into a roll shape to become a supply roll, and this supply roll is mounted on the device manufacturing system 1. The device manufacturing system 1 equipped with the supply roll repeatedly executes various processes for manufacturing the device on the substrate P sent out from the supply roll. Therefore, a plurality of devices (for example, display panels for televisions and personal computers) are formed on the processed substrate P in a state of being connected at predetermined intervals in the long direction. That is, the substrate P sent out from the supply roll is a substrate for multi-chamfering. The substrate P may be one whose surface is modified and activated by a predetermined pretreatment in advance, or one in which a fine partition wall structure (concavo-convex structure) for precision patterning is formed on the surface.

The treated substrate P is wound into a roll to be recovered as a recovery roll. The recovery roll is mounted on a dicing device (not shown). The dicing apparatus equipped with the collection roll divides the processed substrate P into a plurality of devices by dividing (dicing) each device. The dimensions of the substrate P are, for example, the width direction (shorter direction) of about 10 cm to 2 m, and the length direction (longer direction) of the supply roll that can be mounted on the processing device. Depending on the maximum diameter of the recovery roll, it may be several hundred meters to several thousand meters. The dimensions of the substrate P (short / long dimensions) are not limited to the above-mentioned dimensions. Further, it is not always necessary that the substrate is conveyed from the supply roll and collected on the collection roll.

Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process device U1, an exposure device EX, and a process device U2. In FIG. 1, the Cartesian coordinate system is such that the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is a direction from the process apparatus U1 to the process apparatus U2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

The process apparatus U1 performs a pre-process (pre-processing) on the substrate P to be exposed by the exposure apparatus EX. The process apparatus U1 sends the preprocessed substrate P toward the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

Here, the photosensitive functional layer is uniformly or selectively applied as a solution on the substrate P and dried to form a layer (film). A typical photosensitive functional layer is a photoresist, but as a material that does not require development processing, a photosensitive silane coupling material (SAM) that modifies the liquid-repellent property of the portion irradiated with ultraviolet rays, Alternatively, there is a photosensitive reducing agent or the like in which the plating reducing group is exposed on the portion irradiated with ultraviolet rays. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is modified from liquid-repellent to liquid-friendly, so that the portion that becomes liquid-friendly Conductive ink (ink containing conductive nanoparticles such as silver and copper) is selectively applied onto the surface to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, plating reducing groups are exposed on the pattern portion exposed to ultraviolet rays on the substrate P, so that the substrate P is immediately electroless plated containing palladium ions or the like after exposure. By immersing in the liquid for a certain period of time, a pattern layer made of palladium is formed (precipitated).

The exposure apparatus EX draws a pattern such as a circuit or wiring for a display panel on the substrate P supplied from the process apparatus U1. Although details will be described later, this exposure apparatus EX exposes a predetermined pattern on the substrate P by a plurality of drawing lines LL1 to LL5 obtained by scanning each of the plurality of drawing beams LB in a predetermined scanning direction. .. The substrate P that has been exposed by the exposure apparatus EX is sent to the process apparatus U2, and the process apparatus U2 performs post-process processing (post-processing) on the substrate P. As a result, a specific pattern layer of the electronic device is formed on the surface of the substrate P.

<Exposure equipment (board processing equipment)>
Subsequently, the exposure apparatus EX will be described with reference to FIGS. 1 to 9. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing a configuration of a rotating drum and a drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of each scanner in a plurality of drawing modules provided in the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement relationship between the alignment microscope, the drawing line, and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG.

As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called raster scan type drawing exposure apparatus (direct drawing exposure apparatus), and is a drawing beam LB while conveying the substrate P in the conveying direction. By scanning the spot light in a predetermined scanning direction, drawing is performed on the surface of the substrate P to form a predetermined pattern.

As shown in FIG. 1, the exposure apparatus EX includes a drawing apparatus 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control apparatus 16. The drawing device 11 draws a predetermined pattern on a part of the substrate P conveyed by the substrate conveying mechanism 12 by a plurality of drawing modules UW1 to UW5. The substrate transfer mechanism 12 conveys the substrate P transferred from the process device U1 in the previous process to the process device U2 in the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect an alignment mark or the like formed in advance on the substrate P in order to relatively align the drawing pattern drawn on the substrate P with the substrate P. The control device 16 controls each part of the exposure apparatus EX, and causes each part to execute the process. The control device 16 may be a part or all of a higher-level control device that controls the device manufacturing system 1. Further, the control device 16 may be a device different from the upper control device, which is controlled by the upper control device. The control device 16 includes, for example, a computer.

Further, as shown in FIG. 2, the exposure apparatus EX is a device frame 13 that supports the drawing device 11 and the substrate transfer mechanism 12, and a rotary drum DR that is supported by the device frame 13 and is also a part of the substrate transfer mechanism 12. It is provided with a rotation position detection mechanism (see FIGS. 4 and 8 for details) 14 for measuring a rotation position (angle position). Further, a light source device CNT that emits a laser beam (pulse light) as a drawing beam LB is provided in the exposure device EX. The drawing beam LB in the ultraviolet wavelength region emitted from the light source device CNT is adjusted to a predetermined optical state in the drawing device 11, and is scanned one-dimensionally by the optical scanning mechanism while the rotating drum of the substrate transport mechanism 12. Spot light having a predetermined diameter is projected onto the substrate P which is held and conveyed on the outer peripheral surface of the DR.

The exposure apparatus EX shown in FIG. 1 is housed in the temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface E of the manufacturing plant via the passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 are provided on the installation surface E to reduce vibration from the installation surface E. By keeping the inside of the temperature control chamber EVC at a predetermined temperature, the shape change of the substrate P conveyed inside is suppressed due to the temperature.

Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described with reference to FIG. The substrate transfer mechanism 12 includes an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary drum DR, a tension adjustment roller RT2, a drive roller DR6, and a drive roller DR7 in this order from the upstream side in the transfer direction of the substrate P. doing.

The edge position controller EPC adjusts the position of the substrate P conveyed from the process apparatus U1 in the width direction. In the edge position controller EPC, the substrate P so that the position at the widthwise end (edge) of the substrate P sent from the process apparatus U1 is within the range of ± tens of μm to several tens of μm with respect to the target position. Is moved in the width direction to correct the position of the substrate P in the width direction. The positioning accuracy of the substrate P in the width direction (Y direction) by the edge position controller EPC is within an adjustable range of the exposure position (drawing position), that is, a range in which the drawing device 11 can adjust the scanning position by the spot light. Is desirable.

The drive roller DR4 rotates while sandwiching both the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction to convey the substrate P toward the rotating drum DR. The rotary drum DR supports the portion exposed to the pattern on the substrate P in a cylindrical surface shape, and rotates the substrate P around the rotation center line AX2 extending in the Y direction. Transport. In order to rotate such a rotating drum DR around the rotating center line AX2, shaft portions Sf2 coaxial with the rotating center line AX2 are provided on both sides of the rotating drum DR. Rotational torque from a drive source (motor, reduction gear mechanism, etc.) (not shown) is applied to the shaft portion Sf2. The surface extending in the Z direction through the rotation center line AX2 is the center surface p3. The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P which is wound around and supported by the rotating drum DR. The two sets of drive rollers DR6 and DR7 are arranged at predetermined intervals in the transport direction of the substrate P, and give a predetermined slack (play) DL to the substrate P after exposure. The drive roller DR6 rotates by sandwiching the upstream side of the substrate P to be conveyed, and the drive roller DR7 rotates by sandwiching the downstream side of the substrate P to be conveyed, thereby directing the substrate P toward the process device U2. And transport. At this time, since the substrate P is provided with the slack DL, it is possible to absorb the fluctuation of the transport speed of the substrate P that occurs on the downstream side in the transport direction from the drive roller DR6, and the exposure process to the substrate P due to the fluctuation of the transport speed. The influence of can be cut off.

Therefore, the substrate transfer mechanism 12 adjusts the position of the substrate P conveyed from the process device U1 in the width direction by the edge position controller EPC. The substrate transfer mechanism 12 conveys the substrate P whose position in the width direction has been adjusted to the tension adjustment roller RT1 by the drive roller DR4, and conveys the substrate P that has passed through the tension adjustment roller RT1 to the rotary drum DR. As a result, the substrate P is closely supported on the outer peripheral surface of the rotary drum DR in a state where a predetermined tension is applied in the longitudinal direction. By rotating the rotary drum DR, the substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjusting roller RT2. The substrate transfer mechanism 12 conveys the substrate P conveyed to the tension adjusting roller RT2 to the drive roller DR6, and conveys the substrate P conveyed to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process device U2 while giving the substrate P a slack DL by the drive roller DR6 and the drive roller DR7.

Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to FIG. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 2 is an orthogonal coordinate system in which the X, Y, and Z directions are orthogonal to each other, and is the same Cartesian coordinate system as in FIG. The exposure apparatus EX includes an apparatus frame 13 that supports the drawing apparatus 11 shown in FIG. 1 and the rotating drum DR of the substrate transport mechanism 12.

The device frame 13 shown in FIG. 2 includes a main body frame 21, a three-point seat support portion 22, a first optical surface plate 23, a rotation mechanism 24, and a second optical surface plate 25 in this order from the lower side in the Z direction. have. As shown in FIG. 1, the main body frame 21 is installed on the installation surface E via the anti-vibration units SU1 and SU2. The main body frame 21 rotatably supports the rotating drum DR and the tension adjusting rollers RT1 (not shown) and RT2. The first optical surface plate 23 is provided on the upper side of the rotating drum DR in the vertical direction, and is installed on the main body frame 21 via the three-point seat support portion 22. The three-point seat support portion 22 kinematically supports the first optical surface plate 23 at three support points (by steel balls and V-grooves), and the Z direction at each support point can be adjusted. Therefore, the three-point seat support portion 22 can adjust the height of the plate surface of the first optical surface plate 23 in the Z direction and the inclination with respect to the horizontal plane. At the time of assembling the device frame 13, the positions of the main body frame 21 and the three-point seat support portion 22 in the XY plane in the X direction and the Y direction can be adjusted. On the other hand, after the device frame 13 is assembled, the main body frame 21 and the three-point seat support portion 22 are in a fixed state (rigid state). However, at the time of calibration at the time of maintenance or the like, it is preferable to have a structure in which the three-point seat support portion 22 can be finely moved in the XY directions on the main body frame 21 as needed.

The second optical surface plate 25 is provided on the upper side of the first optical surface plate 23 in the vertical direction (Z direction), and is installed on the first optical surface plate 23 via the rotation mechanism 24. The surface plate of the second optical surface plate 25 is parallel to the surface plate of the first optical surface plate 23. A plurality of drawing modules UW1 to UW5 (five in this embodiment) of the drawing device 11 are installed on the second optical surface plate 25. The rotation mechanism 24 is centered on a predetermined rotation axis I (also referred to as a rotation center line) extending in the Z direction while keeping the surface plates of the first optical surface plate 23 and the second optical surface plate 25 parallel to each other. It has a structure in which the second optical surface plate 25 is precisely rotated slightly with respect to the first optical surface plate 23. The rotation axis I extends in the Z direction in the central surface p3 in FIG. 1, and is a predetermined point in the surface (drawing surface curved according to the circumferential surface) of the substrate P wound around the rotating drum DR. It passes through (see Fig. 3). Then, the rotation mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23 to rotate the rotating drum DR or the plurality of drawing modules UW1 to UW5 for the substrate P wound around the rotating drum DR. The angular position in the entire XY plane can be precisely adjusted.

The rotation mechanism 24 has an inner diameter that surrounds the most rotating drum DR side portion of the drawing modules UW1 to UW5, and is arranged to face each of the upper surface side of the first optical surface plate 23 and the lower surface side of the second optical surface plate 25. It is composed of a ring-shaped pedestal and a bearing ball (roller) or the like that is rotatably provided between the ring-shaped pedestals.

Subsequently, the light source device CNTs shown in FIGS. 1, 4, and 5 will be described. The light source device CNT is installed on the main body frame 21 of the device frame 13. The laser beam for the drawing beam LB emitted from the light source device CNT is light in a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P, and is set in an ultraviolet region having a strong photoactive action. .. As the light source, for example, a laser light source such as a laser light that continuously oscillates with YAG's third harmonic laser light (wavelength 355 nm) or pulse oscillates at a frequency of about 50 to 100 MHz can be used.

As a high-power laser light source in the ultraviolet region, an excimer laser using a gas such as KrF, ArF, or XeCL as a laser medium is typically known. In addition, it is also possible to use a solid-state light source such as a laser diode or a light emitting diode (LED) having an oscillation peak in the ultraviolet region having a wavelength of 450 nm or less. In the present embodiment, as an example, as disclosed in International Publication No. WO1999 / 046835 or International Publication No. WO2001 / 020733, light from a solid-state light source that emits long-wavelength light by using a fiber amplifier and a nonlinear optical element. It is assumed that a laser light source that converts (pulse light in the infrared region) into ultraviolet pulsed light having a wavelength of 355 nm (emission time is about several picoseconds) is used.

As shown in FIGS. 4 and 5, the drawing beam LB emitted from such a light source device CNT is subjected to five drawing modules UW1 to UW5 via a beam distribution system including a large number of polarizing beam splitters and mirrors. Guided to each of. The drawing beam LB is preferably in a polarized state in which almost all of the drawing beam LB is reflected or almost completely transmitted by the polarizing beam splitter in order to suppress energy loss caused by transmission or reflection of the drawing beam LB in the polarizing beam splitter.

Next, the drawing apparatus 11 of the exposure apparatus EX will be described. The drawing device 11 is a so-called multi-beam type (also referred to as a multi-head type) drawing device 11 using a plurality of drawing modules (also referred to as drawing heads) UW1 to UW5. The drawing device 11 branches the drawing beam LB emitted from the light source device CNT into a plurality of pieces, and causes a plurality of spot lights generated by the branched drawing beam LBs on the substrate P (for example, five in the first embodiment). The drawing lines LL1 to LL5 of the above are scanned. Then, the drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, with reference to FIG. 3, a plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning a plurality of drawing beams LB by the drawing device 11 will be described.

As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotating drum DR with the central surface p3 interposed therebetween. An odd-numbered first drawing line LL1, a third drawing line LL3, and a fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotation direction of the rotating drum DR. An even-numbered second drawing line LL2 and a fourth drawing line LL4 are arranged on the substrate P on the downstream side in the rotation direction of the rotating drum DR.

Each drawing line LL1 to LL5 is formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating drum DR, and is shorter than the length of the substrate P in the width direction. Strictly speaking, each drawing line LL1 to LL5 minimizes the pattern splicing error obtained by the plurality of drawing lines LL1 to LL5 when the substrate P is conveyed by the substrate conveying mechanism 12 at a reference speed. It is tilted by a predetermined angle with respect to the rotation center line AX2 of the rotating drum DR.

The odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged at predetermined intervals in the axial direction of the rotating drum DR. Further, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at predetermined intervals in the axial direction of the rotating drum DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. The first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width of the exposure region A7 drawn on the substrate P in the Y direction.

The scanning direction (main scanning direction) of the drawing beam LB scanned along the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 is a one-dimensional direction and is the same direction. It has become. Further, the scanning direction of the drawing beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction, which is the same direction. At this time, the scanning direction of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 are different. It is in the same direction. Therefore, when viewed from the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 (spot light scanning start points) and the drawing end positions of the even-numbered drawing lines LL2 and LL4 (spot light). (Scanning end point) is adjacent (matches or partially overlaps in the Y direction), and similarly, the drawing end positions of the odd-numbered drawing lines LL1 and LL3 and the drawing start positions of the even-numbered drawing lines LL2 and LL4. Are adjacent (matched or partially overlapped in the Y direction).

Next, the drawing apparatus 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 includes the plurality of drawing modules UW1 to UW5 described above, a branch optical system (also referred to as a beam distribution system) SL that branches the drawing beam LB from the light source device CNT, and calibration detection for performing calibration. It has a system 31 and.

The branched optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of branches, and guides the plurality of branched drawing beam LBs toward the plurality of drawing modules UW1 to UW5. The branched optical system SL includes a first optical system 41 that branches the drawing beam LB emitted from the light source device CNT into two, and a second optical system that is irradiated with one of the drawing beam LBs branched by the first optical system 41. It has a system 42 and a third optical system 43 to which the other drawing beam LB branched by the first optical system 41 is irradiated. Further, the branched optical system SL includes an XY overall harbing adjustment mechanism 44 that two-dimensionally shifts the beam LB before branching in the first optical system 41 in a plane perpendicular to the beam axis, and the third optical system 43. Includes an XY one-sided harbing adjustment mechanism 45 that two-dimensionally shifts the beam LB of the above in a plane perpendicular to the beam axis. In the branched optical system SL, a part on the CNT side of the light source device is installed on the main body frame 21, while another part on the drawing modules UW1 to UW5 side is installed on the second optical surface plate 25.

The first optical system 41 includes a 1/2 wavelength plate 51, a polarization beam splitter 52, a beam diffuser 53, a first reflection mirror 54, a first relay lens 55, a second relay lens 56, and a second reflection. It has a mirror 57, a third reflection mirror 58, a fourth reflection mirror 59, and a first beam splitter 60.

The drawing beam LB emitted from the light source device CNT in the + X direction irradiates the 1/2 wavelength plate 51. The 1/2 wavelength plate 51 is rotatable in the irradiation surface of the drawing beam LB. The polarization direction of the drawing beam LB irradiated on the 1/2 wavelength plate 51 is a predetermined polarization direction according to the amount of rotation of the 1/2 wavelength plate 51. The drawing beam LB that has passed through the 1/2 wavelength plate 51 is applied to the polarization beam splitter 52. The polarization beam splitter 52 transmits the drawing beam LB in a predetermined polarization direction, and reflects the drawing beam LB other than the predetermined polarization direction in the + Y direction. Therefore, since the drawing beam LB reflected by the polarizing beam splitter 52 passes through the 1/2 wavelength plate 51, the drawing beam LB is combined with the 1/2 wavelength plate 51 and the polarizing beam splitter 52. The beam intensity is adjusted. That is, the beam intensity of the drawing beam LB reflected by the polarizing beam splitter 52 can be adjusted by rotating the 1/2 wave plate 51 and changing the polarization direction of the drawing beam LB.

The drawing beam LB that has passed through the polarizing beam splitter 52 is absorbed by the beam diffuser 53 and suppresses leakage of the drawing beam LB that irradiates the beam diffuser 53 to the outside. The drawing beam LB reflected in the + Y direction by the polarizing beam splitter 52 is irradiated to the first reflection mirror 54. The drawing beam LB irradiated on the first reflection mirror 54 is reflected in the + X direction by the first reflection mirror 54, and is irradiated on the second reflection mirror 57 via the first relay lens 55 and the second relay lens 56. .. The drawing beam LB irradiated on the second reflection mirror 57 is reflected in the −Y direction by the second reflection mirror 57 and is irradiated on the third reflection mirror 58. The drawing beam LB irradiated on the third reflection mirror 58 is reflected by the third reflection mirror 58 in the −Z direction and is irradiated on the fourth reflection mirror 59. The drawing beam LB irradiated on the fourth reflection mirror 59 is reflected in the + Y direction by the fourth reflection mirror 59 and is irradiated on the first beam splitter 60. A part of the drawing beam LB irradiated to the first beam splitter 60 is reflected in the −X direction and irradiated to the second optical system 42, while the other part is transmitted and transmitted to the third optical system 43. Is irradiated to.

The third reflection mirror 58 and the fourth reflection mirror 59 are provided at a predetermined distance on the rotation axis I of the rotation mechanism 24. Further, the configuration up to the light source device CNT including the third reflection mirror 58 (the portion surrounded by the alternate long and short dash line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side and includes the fourth reflection mirror 59. The configuration of the plurality of drawing modules UW1 to UW5 (the portion surrounded by the alternate long and short dash line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the rotation mechanism 24, the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I. Therefore, the optical path of the drawing beam LB is not changed. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the rotation mechanism 24, the drawing beam LB emitted from the light source device CNT installed on the main body frame 21 side is the second optical. It is suitably guided to each of the plurality of drawing modules UW1 to UW5 installed on the surface plate 25 side.

The second optical system 42 branches and guides one of the drawing beams LB branched by the first optical system 41 toward the odd-numbered drawing modules UW1, UW3, and UW5, which will be described later. The second optical system 42 includes a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

The drawing beam LB reflected in the −X direction by the first beam splitter 60 of the first optical system 41 is irradiated to the fifth reflection mirror 61. The drawing beam LB irradiated on the fifth reflection mirror 61 is reflected in the −Y direction by the fifth reflection mirror 61 and is irradiated on the second beam splitter 62. A part of the drawing beam LB irradiated to the second beam splitter 62 is reflected and irradiated to one odd-numbered drawing module UW5 (see FIGS. 5 and 6). The drawing beam LB irradiated to the second beam splitter 62 is transmitted to the third beam splitter 63 through the other part. A part of the drawing beam LB irradiated to the third beam splitter 63 is reflected and irradiated to one odd-numbered drawing module UW3 (see FIGS. 5 and 6). The drawing beam LB irradiated to the third beam splitter 63 passes through the other part and is irradiated to the sixth reflection mirror 64. The drawing beam LB irradiated on the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and is irradiated on one odd-numbered drawing module UW1 (see FIGS. 5 and 6). In the second optical system 42, the drawing beam LB irradiated on the odd-numbered drawing modules UW1, UW3, and UW5 is slightly oblique with respect to the −Z direction.

The third optical system 43 branches and guides the other drawing beam LB branched by the first optical system 41 toward the even-numbered drawing modules UW2 and UW4, which will be described later. The third optical system 43 includes a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

The drawing beam LB transmitted in the Y direction by the first beam splitter 60 of the first optical system 41 is irradiated to the seventh reflection mirror 71. The drawing beam LB irradiated on the seventh reflection mirror 71 is reflected in the X direction by the seventh reflection mirror 71 and is irradiated on the eighth reflection mirror 72. The drawing beam LB irradiated on the eighth reflection mirror 72 is reflected in the −Y direction by the eighth reflection mirror 72 and is irradiated on the fourth beam splitter 73. A part of the drawing beam LB irradiated to the fourth beam splitter 73 is reflected and irradiated to one even-numbered drawing module UW4 (see FIGS. 5 and 6). The drawing beam LB irradiated to the fourth beam splitter 73 passes through the other part and is irradiated to the ninth reflection mirror 74. The drawing beam LB irradiated on the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74 and is irradiated on one even-numbered drawing module UW2. Also in the third optical system 43, the drawing beam LB irradiated on the even-numbered drawing modules UW2 and UW4 is slightly oblique with respect to the −Z direction.

As described above, in the branching optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of drawing modules UW1 to UW5. At this time, the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 have the same beam intensity of the drawing beams LB irradiated to the plurality of drawing modules UW1 to UW5. As described above, the reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the drawing beam LB.

The XY overall harbing adjustment mechanism 44 is arranged between the second relay lens 56 and the second reflection mirror 57, as shown in FIG. The XY overall harbing adjustment mechanism 44 finely shifts the beam LB incident on the first beam splitter 60 in a plane perpendicular to the beam axis in two dimensions, and particularly adjusts the position of the beam passing through the second optical system 42. The XY overall harbing adjustment mechanism 44 is composed of a transparent parallel flat glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass that can be tilted in the YZ plane of FIG. By adjusting the amount of inclination of each of the two parallel flat glass sheets, the beam LB incident on the first beam splitter 60 can be slightly shifted in the X direction and the Z direction in FIG.

The XY one-sided harving adjustment mechanism 45 is arranged between the seventh reflection mirror 71 and the eighth reflection mirror 72. The XY one-sided harbing adjustment mechanism 45 finely shifts the beam LB transmitted through the first beam splitter 60 in a plane perpendicular to the beam axis in two dimensions, and particularly adjusts the position of the beam passing through the third optical system 43. .. Similar to the XY overall harbing adjustment mechanism 44, the XY one-sided harving adjustment mechanism 45 is a transparent parallel flat glass that can be tilted in the XZ plane of FIG. It is composed of and. By adjusting each inclination amount of the two parallel flat glass sheets, the positions of the drawing beams LB incident on the even-numbered drawing modules UW2 and UW4 can be slightly shifted. As is clear from the configuration of FIG. 6, the position shift of the beam LB by the XY overall harbing adjustment mechanism 44 also shifts the position of the beam transmitted through the first beam splitter 60 and incident on the third optical system 43. The positions of the beams incident on the even-numbered drawing modules UW2 and UW4 are adjusted by both the XY overall harbing adjustment mechanism 44 and the XY one-side harbing adjustment mechanism 45.

Subsequently, a plurality of drawing modules UW1 to UW5 will be described with reference to FIGS. 4, 5 and 7. The plurality of drawing modules UW1 to UW5 are provided according to the plurality of drawing lines LL1 to LL5. A plurality of drawing beams LB branched by the branching optical system SL are incident on the plurality of drawing modules UW1 to UW5, respectively. The drawing modules UW1 to UW5 focus a plurality of drawing beams LB into spot light on each drawing line LL1 to LL5, and scan the spot light. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 guide the drawing beam LB to the second to fifth drawing lines LL2 to LL5. Lead to.

As shown in FIG. 4 (and FIG. 1), the plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating drum DR with the central surface p3 interposed therebetween. The plurality of drawing modules UW1 to UW5 have the first drawing on the side where the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged (on the −X direction side in FIG. 5) with the central surface p3 in between. Module UW1, third drawing module UW3, and fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at predetermined intervals in the Y direction. Further, the plurality of drawing modules UW1 to UW5 have the second drawing module UW2 and the second drawing module UW2 and the second drawing module UW2 on the side where the second and fourth drawing lines LL2 and LL4 are arranged (on the + X direction side in FIG. 5) with the central surface p3 interposed therebetween. 4 Drawing module UW4 is arranged. The second drawing module UW2 and the fourth drawing module UW4 are arranged at predetermined intervals in the Y direction. At this time, the second drawing module UW2 is located between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is located between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is located between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. Further, as shown in FIG. 4, the first drawing module UW1, the third drawing module UW3 and the fifth drawing module UW5, and the second drawing module UW2 and the fourth drawing module UW4 have a central surface p3 when viewed from the Y direction. It is arranged symmetrically in the center.

Next, each drawing module UW1 to UW5 will be described with reference to FIG. Since each drawing module UW1 to UW5 has the same configuration, the first drawing module UW1 (hereinafter, simply referred to as a drawing module UW1) will be described as an example.

The drawing module UW1 shown in FIG. 4 includes an optical deflector 81, a polarizing beam splitter PBS, a quarter wave plate 82, and a quarter wave plate 82 in order to scan the drawing beam LB along the drawing line LL1 (first drawing line LL1). It includes a scanner 83, a bending mirror 84, an f−θ lens system 85, and an optical member 86 for Y magnification correction. Further, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The optical deflector 81 is composed of, for example, an acousto-optic modulation element (AOM), and projects / does not project the drawing beam LB onto the substrate P by switching the generation / non-generation of the diffracted light of the incident beam at high speed. To switch to high speed. As a result, the intensity of the spot light applied to the substrate P is modulated based on the pattern drawing information (serial bit string signal) applied to the modulator (AOM) 81. Specifically, the drawing beam LB from the branched optical system SL is incident on the light deflector 81 via the relay lens 91 with a slight inclination in the −Z direction. When the light deflector 81 is in the OFF state, the drawing beam LB travels straight in an inclined state, and is shielded from light by a light-shielding plate 92 provided after passing through the light deflector 81. When the light deflector 81 is in the ON state, the diffracted drawing beam LB is deflected in the −Z direction, passes through the light deflector 81, and is incident on the polarization beam splitter PBS provided on the Z direction of the light deflector 81. To do. Therefore, while the light deflector 81 is ON, the spot light of the drawing beam LB is continuously projected onto the substrate P, and while the light deflector 81 is OFF, the spot light of the drawing beam LB is projected onto the substrate P. It will be interrupted.

The deflection beam splitter PBS reflects the drawing beam LB irradiated from the light deflector 81 through the relay lens 93. On the other hand, the deflecting beam splitter PBS cooperates with the quarter wave plate 82 provided between the deflecting beam splitter PBS and the scanner 83, and the drawing beam LB reflected on the surface of the substrate P or the rotating drum DR. Is transparent. That is, the drawing beam LB from the light deflector 81 toward the polarizing beam splitter PBS is laser light that is linearly polarized with S polarization, and is reflected by the polarizing beam splitter PBS. Further, the drawing beam LB reflected by the polarization beam splitter PBS passes through the 1/4 wave plate 82, becomes circularly polarized light, and reaches the substrate P. Part of the reflected light of the drawing beam LB that is reflected on the surface of the substrate P or the rotating drum DR and returned via the f−θ lens system 85 and the scanner 83 passes through the 1/4 wave plate 82 again. As a result, it becomes linearly polarized light of P polarization. Therefore, the reflected light of the drawing beam LB irradiated from the substrate P to the polarizing beam splitter PBS passes through the polarizing beam splitter PBS. The reflected light of the drawing beam LB transmitted through the polarizing beam splitter PBS is irradiated to the calibration detection system 31 via the relay lens 94. The drawing beam LB reflected by the deflection beam splitter PBS via the relay lens system 93 passes through the 1/4 wave plate 82 and is incident on the scanner 83.

As shown in FIGS. 4 and 7, the scanner 83 includes a reflection mirror 96, a rotating polygon mirror (rotating multifaceted mirror) 97, and an origin detector 98. The drawing beam LB that has passed through the 1/4 wave plate 82 is irradiated to the reflection mirror 96 via the relay lens 95. The drawing beam LB reflected by the reflection mirror 96 is applied to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of polygon planes (reflection planes) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 continuously changes the reflection angle of the drawing beam LB irradiated on the polygon surface 97b by rotating the rotating polygon mirror 97 in a predetermined rotation direction around the rotation axis 97a, whereby the reflected drawing beam LB is changed. Is scanned along the drawing line LL1 on the substrate P. The drawing beam LB reflected by the rotating polygon mirror 97 is applied to the bending mirror 84. The origin detector 98 detects the origin (predetermined scanning start point) of the drawing beam LB that scans along the drawing line LL1 of the substrate P. The origin detector 98 is arranged on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each polygon surface 97b interposed therebetween. Therefore, the origin detector 98 detects the drawing beam LB before the f−θ lens system 85 is irradiated. That is, the origin detector 98 detects the angular position of the polygon surface 97b immediately before the spot light is applied to the drawing start position of the drawing line LL1 on the substrate P.

The drawing beam LB irradiated from the scanner 83 to the folding mirror 84 is reflected by the folding mirror 84 and irradiated to the f−θ lens system 85. The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing beam LB reflected from the rotating polygon mirror 97 via the folding mirror 84 perpendicularly to the drawing surface of the substrate P.

As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 have a symmetrical configuration with the central surface p3 interposed therebetween. In the plurality of scanners 83, three scanners 83 corresponding to the drawing modules UW1, UW3, and UW5 are arranged on the upstream side (-X direction side in FIG. 7) of the rotating drum DR in the rotation direction, and the drawing modules UW2 and UW2 Two scanners 83 corresponding to the UW4 are arranged on the downstream side (+ X direction side in FIG. 7) of the rotating drum DR in the rotation direction. The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged so as to face each other with the central surface p3 interposed therebetween. At this time, each scanner 83 arranged on the upstream side and each scanner 83 arranged on the downstream side are symmetrical with respect to the central surface p3. Further, the three rotating polygon mirrors 97 on the upstream side scan the drawing beam LB while rotating counterclockwise (counterclockwise) in the XY plane, thereby projecting onto the odd-numbered drawing lines LL1, LL3, and LL5. Each spot light is scanned in a predetermined scanning direction (for example, the + Y direction in FIG. 7) from the drawing start position to the drawing end position. On the other hand, the two rotating polygon mirrors 97 on the downstream side scan the drawing beam LB while rotating clockwise (clockwise) in the XY plane, and thereby each spot projected on the even-numbered drawing lines LL2 and LL4. The light is scanned in the same scanning direction (+ Y direction) as the three drawing lines LL1, LL3, and LL5 on the upstream side from the drawing start position to the drawing end position.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the odd-numbered drawing modules UW1, UW3, UW5 is in the direction coincided with the installation directional line Le1. That is, the installation directional line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing modules UW2 and UW4 is in the direction coincided with the installation direction line Le2. That is, the installation directional line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane.

The Y magnification correction optical member 86 is a combination of a cylindrical lens having a positive refractive power in the Y direction and a cylindrical lens having a negative refractive power in the Y direction, and includes an f−θ lens system 85 and a substrate P. It is placed between. Formed by the drawing modules UW1 to UW5 by finely moving at least one of the plurality of cylindrical lenses constituting the Y magnification correction optical member 86 in the optical axis (axis of the drawing beam LB) of the f−θ lens system 85. The drawing lines LL1 to LL5 to be drawn can be enlarged or reduced by a very small amount isotropically in the Y direction.

In the drawing device 11 configured in this way, a predetermined pattern is drawn on the substrate P by controlling each part by the control device 16. That is, the control device 16 receives light based on CAD (Computer Aided Design) information which is information on a pattern to be drawn on the substrate P during the period when the drawing beam LB projected on the substrate P is scanning in the scanning direction. The drawing beam LB is deflected by On / Off modulation of the deflector 81, and a pattern is drawn on the light-sensitive layer of the substrate P. Further, the control device 16 synchronizes the scanning direction (scanning start timing) of the spot light of the drawing beam LB scanned along the drawing line LL1 with the movement of the substrate P in the transport direction due to the rotation of the rotating drum DR. , A predetermined pattern is drawn on the portion of the exposure area A7 corresponding to the drawing line LL1.

At this time, the effective size (spot diameter) of the spot light on the substrate P of the drawing beam LB projected from each drawing module UW1 to UW5 is D (μm), and the scanning of the spot light along the drawing lines LL1 to LL5. When the speed is Vp (μm / sec), the light source device CNT has a relationship of T <D / Vp with the emission repetition period T (second) of the laser light source that emits pulsed light. The effective size (diameter) of the spot light is the width (full width at half maximum) that is half the peak value on the intensity distribution in the main scanning direction of the spot light, or 1 / e ^{2 with} respect to the peak value. The width is the strength of.

Next, the alignment microscopes AM1 and AM2 as the pattern detection unit will be described with reference to FIGS. 3 and 8. The alignment microscopes AM1 and AM2 detect an alignment mark previously formed on the substrate P, a reference mark or a reference pattern formed on the rotating drum DR, or the like within a predetermined observation region. Hereinafter, the alignment mark of the substrate P and the reference mark and the reference pattern of the rotating drum DR may be simply referred to as marks. The alignment microscopes AM1 and AM2 are used for aligning the substrate P with a predetermined pattern drawn on the substrate P, and for calibrating the rotating drum DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are provided on the upstream side in the rotation direction of the rotating drum DR with respect to the drawing lines LL1 to LL5 formed by the drawing apparatus 11. Further, the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.

The alignment microscopes AM1 and AM2 project the illumination light onto the substrate P or the rotating drum DR, and receive the light generated by the mark through the objective lens system GA and the objective lens system GA as incident detection probes. It is composed of an imaging system GD or the like that images (bright-field image, dark-field image, fluorescence image, etc.) with a two-dimensional CCD, CMOS, or the like. The illumination light for alignment is light in a wavelength range that has almost no sensitivity to the light-sensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

A plurality (for example, three) alignment microscopes AM1 are provided in a line in the Y direction (width direction of the substrate P). Similarly, a plurality (for example, three) alignment microscopes AM2 are provided side by side in a row in the Y direction (width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

FIG. 3 shows the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens system GAs of the six alignment microscopes AM1 and AM2 for the sake of clarity. The observation regions (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are the rotation center lines AX2 as shown in FIG. They are arranged at predetermined intervals in the parallel Y direction. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the observation regions Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) by each objective lens system GA of the three alignment microscopes AM2 are Y parallel to the rotation center line AX2 as shown in FIG. They are arranged in the direction at predetermined intervals. As shown in FIG. 8, the optical axes La4 to La6 of each objective lens system GA passing through the center of each observation region Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating drum DR.

The mark observation regions Vw1 to Vw6 by the alignment microscopes AM1 and AM2 are set in a range of, for example, about 200 μm square on the substrate P or the rotating drum DR. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set in the same direction as the installation azimuth line Le3 extending in the radial direction of the rotation drum DR from the rotation center line AX2. To. That is, the installation directional line Le3 is a line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are set in the same direction as the installation azimuth line Le4 extending in the radial direction of the rotation drum DR from the rotation center line AX2. To. That is, the installation directional line Le4 is a line connecting the observation regions Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG. At this time, since the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotating drum DR as compared with the alignment microscope AM2, the angle formed by the central surface p3 and the installation directional line Le3 is the central surface p3. It is larger than the angle formed by the installation direction line Le4.

As shown in FIG. 3, exposure regions A7 drawn by each of the five drawing lines LL1 to LL5 are arranged on the substrate P at predetermined intervals in the X direction. A plurality of alignment marks Ks1 to Ks3 (hereinafter, abbreviated as marks) for alignment are formed, for example, in a cross shape around the exposure region A7 on the substrate P. Based on the detection results of the alignment marks Ks1 to Ks2 by the alignment microscopes AM1 and AM2, each drawing module specifies the position on the substrate P on which the pattern should be drawn and adjusts (corrects) the main scanning position by the spot light. Alignment is not limited to this. For example, the alignment microscopes AM1 and AM2 may detect a part of the shape such as a circuit pattern formed on the substrate P and perform alignment.

In FIG. 3, the marks Ks1 are provided in the peripheral region on the −Y side of the exposure region A7 at regular intervals in the X direction, and the marks Ks3 are constant in the peripheral region on the + Y side of the exposure region A7 in the X direction. It is provided at intervals. Further, the mark Ks2 is provided at the center in the Y direction in the margin region between the two exposure regions A7 adjacent to each other in the X direction.

Then, the mark Ks1 is sequentially captured in the observation region Vw1 of the objective lens system GA1 of the alignment microscope AM1 and in the observation region Vw4 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being fed. Is formed in. Further, the marks Ks3 are sequentially captured in the observation region Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation region Vw6 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being fed. Is formed in. Further, the marks Ks2 are sequentially captured in the observation region Vw2 of the objective lens system GA2 of the alignment microscope AM1 and in the observation region Vw5 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being fed. Is formed so as to.

Therefore, of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 on both sides of the rotating drum DR in the Y direction constantly observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P. be able to. Further, of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 in the center of the rotating drum DR in the Y direction are used as a margin in the long direction between the exposure regions A7 drawn on the substrate P. The formed marks Ks2 can be constantly observed or detected.

Here, since the exposure apparatus EX applies the so-called multi-beam type drawing apparatus 11, a plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 are used. Is required to be calibrated to suppress the splicing accuracy of the plurality of drawing modules UW1 to UW5 within an allowable range in order to splice them appropriately in the Y direction. Further, the relative positional relationship of the observation regions Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 needs to be precisely obtained by baseline management. Calibration is also required for the baseline management.

In the calibration for confirming the splicing accuracy by the plurality of drawing modules UW1 to UW5 and the calibration for the baseline management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotating drum DR supporting the substrate P is used. , It is necessary to provide a reference mark and a reference pattern. Therefore, as shown in FIG. 9, the exposure apparatus EX uses a rotary drum DR having a reference mark and a reference pattern on the outer peripheral surface.

The rotary drum DR is formed with scale portions GPa and GPb forming a part of the rotation position detection mechanism 14 described later on both ends of the outer peripheral surface thereof. Further, in the rotating drum DR, narrow width regulation bands CLa and CLb by concave grooves or convex rims are engraved on the inside of the scale portions GPa and GPb over the entire circumference. The width of the substrate P in the Y direction is set smaller than the distance between the two regulation bands CLa and CLb in the Y direction, and the substrate P is sandwiched between the regulation bands CLa and CLb on the outer peripheral surface of the rotating drum DR. It is closely supported by the inner region.

The rotating drum DR has a plurality of line patterns RL1 tilted at +45 degrees with respect to the rotation center line AX2 and tilted at -45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched between the regulation bands CLa and CLb. A mesh-shaped reference pattern (which can also be used as a reference mark) RMP in which a plurality of line patterns RL2 are repeatedly engraved at a constant pitch (cycle) Pf1 and Pf2 is provided. As an example, the line width LW of the line pattern RL1 and the line pattern RL2 is set to about several μm to 20 μm, and the pitch (period) Pf1 and Pf2 are set to about several tens μm to several hundred μm.

The reference pattern RMP is a diagonal pattern (oblique grid pattern) that is uniform over the entire surface so that the frictional force and the tension of the substrate P do not change at the portion where the substrate P and the outer peripheral surface of the rotating drum DR come into contact with each other. There is. The line patterns RL1 and RL2 do not necessarily have to be at an angle of 45 degrees, and may be a vertical and horizontal mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Further, it is not necessary to intersect the line patterns RL1 and RL2 at 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is other than a square (or a rectangle). The line patterns RL1 and RL2 may be crossed at an angle so as to form a diamond shape.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4, and 8. As shown in FIG. 8, the rotation position detection mechanism 14 optically detects the rotation position of the rotation drum DR, and for example, an encoder system using a rotary encoder or the like is applied. The rotation position detection mechanism 14 has scale portions GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads EN1, EN2, EN3 and EN4 facing each of the scale portions GPa and GPb. Although only four encoder heads EN1, EN2, EN3, and EN4 facing the scale unit GPa are shown in FIGS. 4 and 8, similar encoder heads EN1, EN2, EN3, and EN4 face each other on the scale unit GPb. Is placed.

The scale portions GPa and GPb are formed in an annular shape over the entire peripheral surface of the rotating drum DR in the circumferential direction. The scale portions GPa and GPb are diffraction gratings in which concave or convex lattice lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and are configured as an incremental scale. In the case of the present embodiment, the grid lines (scales) of the scale portions GPa and GPb and the reference pattern RMP shown in FIG. 9 are simultaneously formed by an apparatus (pattern engraving machine or the like) for processing the surface of the rotating drum DR. Therefore, it is possible to have a unique positional relationship on the order of microns. An origin mark is provided at one location in the circumferential direction of the scale units GPa and GPb, and each of the encoder heads EN1, EN2, EN3, and EN4 has a function of detecting the origin mark and outputting an origin signal. To be equipped. Therefore, the origin mark also has a unique positional relationship (known angular positional relationship) with respect to the reference pattern RMP and the circumferential direction.

The substrate P is configured to be wound inside the rotating drum DR avoiding the scale portions GPa and GPb at both ends, that is, inside the regulation bands CLa and CLb. When a strict arrangement relationship is required, the outer peripheral surfaces of the scale portions GPa and GPb and the outer peripheral surface of the substrate P wound around the rotating drum DR should be on the same surface (the same radius from the rotation center line AX2). Set. For that purpose, the outer peripheral surfaces of the scale portions GPa and GPb may be made higher by the thickness of the substrate P in the radial direction with respect to the outer peripheral surface for winding the substrate of the rotary drum DR. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotating drum DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale portions GPa and GPb at the same radial position as the drawing surface on the substrate P wound around the rotating drum DR, and the measurement position and the processing position can be set. It is possible to reduce the Abbe error caused by the difference in the radial direction of the rotating system. If the scale portions GPa and GPb cannot be directly formed on both ends of the rotating drum DR, a scale disk in which the scale portion GPa (GPb) is engraved on the outer peripheral surface of a disk-shaped member having a diameter substantially the same as the diameter of the rotating drum DR. May be coaxially attached to the shaft portion Sf2 of the rotating drum DR.

The encoder heads EN1, EN2, EN3, and EN4 are arranged around the scale portions GPa and GPb as viewed from the rotation center line AX2, and are located at different positions in the circumferential direction of the rotation drum DR. The encoder heads EN1, EN2, EN3, and EN4 are connected to the control device 16. The encoder heads EN1, EN2, EN3, and EN4 project an optical beam for measurement toward the scale units GPa and GPb, and photoelectrically detect the reflected luminous flux (diffracted light) to detect the reflected light flux (diffracted light) in the circumferential direction of the scale units GPa and GPb. A detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the position change of is output to the control device 16. The control device 16 interpolates the detection signal with a counter circuit (not shown) and digitally processes it to digitally process the change in the angle of the rotating drum DR, that is, the change in the position of the outer peripheral surface in the circumferential direction with a resolution of submicron. Can be measured. At this time, the control device 16 can also measure the transport speed of the substrate P in the rotary drum DR from the change in the angle of the rotary drum DR.

Further, as shown in FIGS. 4 and 8, the encoder head EN1 is arranged on the installation direction line Le1. The installation azimuth line Le1 is a line connecting the projection region (reading position) of the measurement light beam by the encoder head EN1 on the scale portion GPa (GPb) and the rotation center line AX2 in the XZ plane. Further, as described above, the installation direction line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same directional lines (the same when viewed from the center axis AX2). Orientation).

Similarly, as shown in FIGS. 4 and 8, the encoder head EN2 is arranged on the installation direction line Le2. The installation azimuth line Le2 is a line connecting the projection region (reading position) of the measurement light beam by the encoder head EN2 on the scale portion GPa (GPb) and the rotation center line AX2 in the XZ plane. Further, as described above, the installation directional line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 have the same azimuth line (the same direction when viewed from the center axis AX2). It has become.

Further, as shown in FIGS. 4 and 8, the encoder head EN3 is arranged on the installation direction line Le3. The installation azimuth line Le3 is a line connecting the projection region (reading position) of the measurement light beam by the encoder head EN3 on the scale portion GPa (GPb) and the rotation center line AX2 in the XZ plane. Further, as described above, the installation directional line Le3 is a line connecting the observation regions Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same directional line (viewed from the center axis AX2). The same direction). With such a configuration, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN3 on the scale units GPa and GPb and the detection areas Vw1 to Vw3 of the alignment microscope AM1 are in the circumferential direction of the rotating drum DR. It is in the same position with respect to.

Similarly, as shown in FIGS. 4 and 8, the encoder head EN4 is arranged on the installation azimuth line Le4. The installation azimuth line Le4 is a line connecting the projection region (reading position) of the measurement light beam by the encoder head EN4 on the scale portion GPa (GPb) and the rotation center line AX2 in the XZ plane. Further, as described above, the installation directional line Le4 is a line connecting the observation regions Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same directional line (viewed from the center axis AX2). The same direction). With such a configuration, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN4 on the scale unit GPa and GPb and the detection areas Vw4 to Vw6 of the alignment microscope AM2 are in the circumferential direction of the rotation drum DR. It is in the same position with respect to.

When the installation orientation of the encoder heads EN1, EN2, EN3, EN4 (angle direction in the XZ plane centered on the rotation center line AX2) is represented by the installation orientation lines Le1, Le2, Le3, Le4, as shown in FIG. A plurality of drawing modules UW1 to UW5 and encoder heads EN1 and EN2 are arranged so that the installation directional lines Le1 and Le2 have an angle of ± θ ° with respect to the central surface p3.

Here, the control device 16 is the rotation angle position of the scale portions (rotating drum DR) GPa, GPb detected by the encoder heads EN1 and EN2 and the counter circuit, that is, the movement position and movement in the circumferential direction of the outer peripheral surface of the rotation drum DR. Based on the quantity, the drawing start positions by the odd-numbered and even-numbered drawing modules UW1 to UW5 are controlled. That is, the control device 16 On / Off-modulates the optical deflector 81 based on the CAD information of the pattern to be drawn on the substrate P during the period in which the drawing beam LB projected on the substrate P is scanning in the scanning direction. However, by performing the On / Off modulation start timing of the CAD information for one scan by the optical deflector 81 based on the detected rotation angle position, the pattern is accurately drawn on the light-sensitive layer of the substrate P. be able to.

Further, the control device 16 rotates the scale units (rotating drum DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. By storing the angular position, it is possible to obtain the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angle position of the rotating drum DR. Similarly, the control device 16 rotates the scale units (rotating drum DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the reference pattern RMP on the rotating drum DR is detected by the alignment microscopes AM1 and AM2. By storing the angular position, it is possible to obtain the correspondence between the position of the reference pattern RMP on the rotating drum DR and the rotational angle position of the rotating drum DR. In this way, the alignment microscopes AM1 and AM2 can accurately measure the rotation angle position (or circumferential position) of the rotating drum DR at the moment when the reference pattern or mark is sampled in the observation areas Vw1 to Vw6. Then, in the exposure apparatus EX, based on this measurement result, the substrate P and a predetermined pattern drawn on the substrate P are aligned (aligned), and the rotary drum DR and each drawing module UW1 to the drawing apparatus 11 are aligned. The positional relationship between the drawing lines LL1 to LL5 by the UW5 is calibrated.

By the way, in the multi-beam type exposure apparatus EX, the spot light of the drawing beam LB is scanned along the plurality of drawing lines LL1 to LL5 on the substrate P while the substrate P is conveyed in the conveying direction. Here, the scanning directions of the drawing beams LB scanned along the drawing lines LL1 to LL5 are the same, and each of the drawing lines LL1 to LL5 is precisely parallel to the central surface p3 (central axis AX2). When set to, the patterns PT1 to PT5 formed on the substrate P by the plurality of drawing lines LL1 to LL5 are patterns as shown in FIG.

FIG. 10 is an exaggerated view showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the first embodiment. In addition, since FIG. 10 is a view developed in the transport direction (Xs direction) of the substrate P, it is an orthogonal coordinate system in which the Xs direction, the Y direction, and the Z direction are orthogonal to each other. Further, in FIG. 10, the drawing lines LL1 to LL5 and the patterns PT1 to PT5 are thickened in the transport direction of the substrate P so that the relationship between the drawing lines LL1 to LL5 and the patterns PT1 to PT5 can be easily understood.

As shown in FIG. 10, the spot light of the drawing beam LB projected from each of the plurality of drawing modules UW1 to UW5 onto the substrate P is directed from the drawing start position PO1 to the drawing end position PO2 along the drawing lines LL1 to LL5. Is scanned in the + Y direction. At this time, the spot light of the drawing beam LB is scanned along the drawing lines LL1 to LL5 in the same scanning direction. Therefore, when viewed from the transport direction Xs of the substrate P, it is formed at the end portions PTa of the patterns PT1 to PT5 formed at the drawing start position PO1 of the drawing lines LL1 to LL5 and the drawing end position PO2 of the drawing lines LL1 to LL5. The end portions PTb of the patterns PT1 to PT5 are adjacent to each other in the patterns PT1 to PT5 adjacent to each other in the width direction of the substrate P.

Here, when the spot light of the drawing beam LB is scanned once with respect to the substrate P, the patterns PT1 to PT5 formed on the substrate P are conveyed at a constant velocity in the conveying direction. It is formed slightly diagonally. Although the amount of inclination is exaggerated in FIG. 10, it is represented by the ratio Vxs / Vp of the transport speed Vxs of the substrate P and the scanning speed Vp of the spot light of the drawing beam LB. The scanning speed Vp is proportional to the rotation speed Rv (rps) of the rotating polygon mirror 97 as the scanner 83. For example, the rotating polygon mirror 97 has eight reflecting surfaces, and the actual scanning period for each reflecting surface is 40%. Assuming that the lengths of the drawing lines (LL1 to LL5) are YL (mm), the scanning speed Vp (mm / S) of the spot light can be obtained by the following equation.
Vp = (8 ・ Rv ・ YL) /0.4=20 ・ Rv ・ YL [mm / S]

Assuming that the rotating polygon mirror 97 rotates 6000 rpm (rotation speed Rv = 100 rps) and the length YL is 50 mm, the scanning speed Vp is 100,000 mm / S. Assuming that the transport speed Vxs of the substrate P is 50 mm / S, the amount of inclination Vxs / Vp of the drawing line on the substrate P is 1/2000. This amount of inclination means that both ends of the drawing line in the Y direction (drawing start point PO1 and drawing end point PO2) are displaced by 25 μm in the Xs direction on the substrate P. Of course, if the rotation speed Rv of the rotating polygon mirror 97 is increased and the transport speed Vxs of the substrate P is decreased, the inclination amount Vxs / Vp of the drawing line can be reduced, but both ends of the drawing line in the Y direction (drawing start point). In order to reduce the amount of deviation between PO1 and the drawing end point PO2) in the Xs direction to about a fraction of the minimum line width of the pattern to be drawn, the rotation speed Rv of the rotating polygon mirror 97 is increased several times or more, and the substrate is used. The transport speed Vxs of P will be significantly reduced. That is, the end PTa of the patterns PT1 to PT5 formed at the drawing start position PO1 of the drawing lines LL1 to LL5 is compared with the end PTb of the patterns PT1 to PT5 formed at the drawing end position PO2 of the drawing lines LL1 to LL5. Therefore, it is formed on the downstream side in the transport direction. Therefore, the end portion PTa and the end portion PTb of the patterns PT1 to PT5 are at different positions in the transport direction. In this case, the patterns PT1 to PT5 spliced in the width direction of the substrate P cause a splicing error in the transport direction between adjacent patterns PT1 to PT5.

As described above, the joint error of the patterns PT1 to PT5 is such that when the scanning speed Vp in the main scanning direction of the spot light of the drawing beam LB is constant, the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P is the inclination of the substrate P. It occurs because the inclination does not correspond to the transport speed of. Here, the inclinations of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P are adjusted before drawing the exposure apparatus EX and at the time of drawing the exposure apparatus EX, respectively.

Specifically, before drawing the exposure apparatus EX (for example, at the time of alignment), the exposure apparatus EX conveys the substrate P at a preset reference speed (Vxs). At this time, the reference speed may be appropriately changed depending on the substrate P to be used. For example, when the sensitivity of the light-sensitive layer coated on the substrate P is low, the reference speed may be lowered and the main scanning by spot light may be repeated a plurality of times to increase the exposure amount. Therefore, the drawing line LL1 is set according to the reference speed set for the substrate P so that the patterns PT1 to PT5 are suitably joined to the substrate P conveyed at the reference speed in the width direction of the substrate P. ~ LL5 is adjusted so as to be appropriately tilted with respect to the central surface p3 (central axis AX2).

Further, during the drawing operation by the exposure apparatus EX, the rotational drive of the rotary drum DR is controlled so that the transport speed of the substrate P becomes the reference speed. At this time, the structure (bearing characteristics) of the rotary bearing portion of the rotary drum DR is controlled. ) And the rotation drive mechanism (torque characteristics of the motor, characteristics of the reduction gear, etc.), the transfer speed of the substrate P to be conveyed may slightly fluctuate from the reference speed according to the rotation cycle of the rotary drum DR. That is, the transfer speed of the substrate P conveyed by the rotary drum DR may be periodically uneven. Therefore, the drawing lines LL1 to LL5 follow the fluctuation of the transport speed of the substrate P so that the patterns PT1 to PT5 are preferably spliced in the width direction of the substrate P with respect to the substrate P whose speed slightly changes from the reference speed. It is better to incorporate a configuration (control system) that dynamically (actively) tilts each of the above.

Next, with reference to FIG. 11, adjustment of the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P will be described. FIG. 11 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the first embodiment. In the exposure apparatus EX of the first embodiment, the drawing lines LL1 to LL5 are entirely drawn in the width direction of the substrate P by rotating the second optical surface plate 25 with respect to the first optical surface plate 23 by the rotation mechanism 24. Tilt to. That is, the rotation mechanism 24 functions as an inclination adjusting mechanism for adjusting the inclination of the drawing lines LL1 to LL5.

The rotation mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23, thereby rotating the drawing device 11 with respect to the substrate P about the rotation axis I. When the drawing device 11 rotates around the rotation axis I, the drawing lines LL1 to LL5 are in the width direction of the substrate P (that is, the rotation center line AX2 of the rotating drum DR, or the center surface) without changing the mutual positional relationship. Tilt with respect to p3).

Here, with respect to the alignment of the exposure apparatus EX, the adjustment of the inclination of the drawing lines LL1 to LL5 when the patterns PT1 to PT5 are joined in the width direction of the substrate P with respect to the substrate P conveyed at the reference speed will be described. .. As shown in FIG. 11, the control device 16 rotates the rotation mechanism 24 based on the reference speed of the substrate P detected by the rotation position detection mechanism 14. Here, the reference speed of the substrate P is associated with the amount of rotation of the rotation mechanism 24. The amount of rotation is such that the ends PTa and the ends PTb of the patterns PT1 to PT5 are at the same position in the transport direction, that is, the patterns PT1 to PT5 are formed along the width direction of the substrate P. The amount of rotation (tilt amount) is large. That is, the control device 16 rotates the rotation mechanism 24 based on the amount of rotation associated with the detected reference speed of the substrate P. Specifically, when the patterns PT1 to PT5 shown in FIG. 10 are formed, the control device 16 rotates the rotation mechanism 24 based on the reference speed of the substrate P to start drawing the drawing lines LL1 to LL5. The drawing device 11 is rotated with respect to the substrate P so that PO1 is located on the upstream side in the transport direction and the drawing end positions PO2 of the drawing lines LL1 to LL5 are located on the downstream side in the transport direction.

As shown in FIG. 11, when the rotation mechanism 24 tilts the drawing lines LL1 to LL5 as a whole without changing the mutual positional relationship of the drawing lines LL1 to LL5, the drawing lines LL1 and the drawing lines LL1 on the side far from the rotation axis I The drawing line LL5 has a large amount of movement in the transport direction, while the drawing line LL3 on the side closer to the rotation axis I has a small amount of movement in the transport direction. That is, the drawing line LL1 moves largely to the upstream side in the transport direction, and the drawing line LL2 moves slightly to the upstream side in the transport direction. The drawing line LL3 has almost no movement in the transport direction. The drawing line LL4 moves slightly downstream in the transport direction, and the drawing line LL5 moves significantly downstream in the transport direction. Therefore, the patterns PT1 to PT5 drawn on the substrate P by the drawing lines LL1 to LL5 after rotation by the rotation mechanism 24 (after tilt correction) are in the width direction of the substrate P as shown by the dotted line in FIG. It is formed in almost the same direction without inclination.

On the other hand, the patterns PT1 to PT5 exposed after rotation (after tilt correction) are formed at slightly different positions in the transport direction of the substrate P according to the tilt of the drawing lines LL1 to LL5. That is, the pattern PT5 is formed on the downstream side in the transport direction with respect to the pattern PT4, the pattern PT4 is formed on the downstream side in the transport direction with respect to the pattern PT3, and the pattern PT3 is formed on the downstream side in the transport direction with respect to the pattern PT2. It is formed on the downstream side, and the pattern PT2 is formed on the downstream side in the transport direction with respect to the pattern PT1. In this way, when the drawing device 11 is rotated by the rotation mechanism 24 around the rotation axis I, the positions of the patterns PT1 to PT5 after rotation in the transport direction are different, so that the transport directions of the patterns PT1 to PT5 after rotation are different. In, a predetermined amount of deviation occurs. Therefore, the control device 16 controls the drawing timings of the drawing modules UW1 to UW5 based on the reference speed of the substrate P detected by the rotation position detection mechanism 14, so that the patterns PT1 to PT5 after rotation are conveyed. The position in the direction is corrected. That is, the reference speed of the substrate P is also associated with the correction amount of the drawing timing. Here, in order to correct the drawing timing, the control device 16 corrects the CAD information used for drawing on the substrate P in the transport direction.

FIG. 12 is a diagram showing an image of CAD information used in the exposure apparatus of the first embodiment. In FIG. 12, CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 shown in FIG. 11 are shown as CAD information of the pattern to be drawn on the substrate P. Further, the CAD patterns CAD1 to CAD5 shown by the dotted line in FIG. 12 are CAD patterns (design original data) CAD1 to CAD5 before the correction of the drawing timing, and the CAD patterns CAD1 to CAD5 shown by the solid line in FIG. 12 are , CAD patterns CAD1 to CAD5 after correction of drawing timing.

As shown by the dotted line in FIG. 12, each of the CAD patterns CAD1 to CAD5 before correction is for drawing data (bit pattern) so as to be drawn in the same arrangement as the patterns PT1 to PT5 to be drawn on the substrate P. It is stored in the memory circuit of the above, and is at the same position in the transport direction of the substrate P. Therefore, the CAD patterns CAD1 to CAD5 before correction are arranged in a row along the width direction of the substrate P.

The control device 16 arranges the CAD patterns CAD1 to CAD5 before correction so that the patterns PT1 to PT5 after rotation shown in FIG. 11 are at the same position in the transport direction, that is, the ends PTa and PTb of the patterns PT1 to PT5. The CAD patterns CAD1 to CAD4 are corrected in the transport direction with reference to the CAD pattern CAD5 so that they are joined to each other. That is, as shown by the solid line in FIG. 12, the control device 16 sets each of the CAD patterns CAD1 to CAD5 before correction according to the amount of displacement of the positions of the rotated patterns PT1 to PT5 shown in FIG. 11 in the transport direction. , Correct in the transport direction. The correction is performed, for example, by shifting the start timing of reading each drawing data (bit pattern) of the CAD patterns CAD1 to CAD5 before correction from the memory circuit.

Since the amount of deviation of the patterns PT1 to PT5 shown by the dotted line in FIG. 11 in the transport direction is associated with the transport speed of the substrate P as described above, the control device 16 is based on the transport speed of the substrate P. Then, the CAD patterns CAD1 to CAD5 are corrected in the transport direction (such as shifting the reading start timing of the drawing data). In the corrected CAD information, the CAD pattern CAD5 is located upstream of the CAD pattern CAD4 in the transport direction, the CAD pattern CAD4 is located upstream of the CAD pattern CAD3 in the transport direction, and the CAD pattern CAD3 is CAD. It is located upstream of the pattern CAD2 in the transport direction, and the CAD pattern CAD2 is located upstream of the CAD pattern CAD1 in the transport direction. Although the control device 16 has corrected the other CAD patterns CAD1 to CAD4 with reference to the CAD pattern CAD5, the control device 16 may correct the other CAD patterns CAD1 to CAD4 with reference to the other CAD patterns CAD1 to 4.

As described above, the control device 16 is in the transport direction of the CAD patterns CAD1 to CAD5 shown by the solid line in FIG. 12 according to the transport speed of the substrate P detected by the rotation position detection mechanism 14 at the time of alignment of the exposure device EX. By correcting the position, the patterns PT1 to PT5 shown by the solid line in FIG. 11 can be drawn on the substrate P.

To adjust the inclination of the drawing lines LL1 to LL5 at the time of alignment of the exposure apparatus EX, the rotation mechanism 24 may be manually rotated, or the rotation mechanism 24 may be driven and controlled by the control device 16 to be rotated. Good.

Next, regarding the drawing of the exposure apparatus EX, the drawing line LL1 when the patterns PT1 to PT5 are joined in the width direction of the substrate P with respect to the substrate P which is conveyed while slightly changing the speed from the reference speed due to speed unevenness. The adjustment of the inclination of ~ LL5 will be described. As shown in FIG. 11, the rotation mechanism 24 sets the patterns PT1 to PT5 by setting the drawing lines LL1 to LL5 at a predetermined inclination with respect to the substrate P conveyed at the reference speed with respect to the width direction of the substrate P. It is preferably spliced in the width direction of the substrate P.

When the substrate P is conveyed at a transfer speed faster than the reference speed from the state shown in FIG. 11, the patterns PT1 to PT5 formed on the substrate P are formed obliquely as shown in FIG. That is, the end PTa of the patterns PT1 to PT5 is formed on the downstream side in the transport direction as compared with the end PTb of the patterns PT1 to PT5. On the other hand, when the substrate P is conveyed at a transfer speed slower than the reference speed, the patterns PT1 to PT5 formed on the substrate P are inclined in the opposite direction to the patterns PT1 to PT5 shown in FIG. 10 (in FIG. 10). It is formed by tilting downward to the right. That is, the end PTa of the patterns PT1 to PT5 is formed on the upstream side in the transport direction as compared with the end PTb of the patterns PT1 to PT5.

In the control device 16, when the transport speed of the substrate P detected by the rotation position detection mechanism 14 becomes faster than the reference speed, the drawing start position PO1 of the drawing lines LL1 to LL5 draws the drawing lines LL1 to LL5 at the reference speed. It is located upstream of the start position PO1 in the transport direction, and the drawing end position PO2 of the drawing lines LL1 to LL5 is located downstream of the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed. In addition, the rotation mechanism 24 is rotated, and the entire drawing lines LL1 to LL5 are further rotated clockwise from the state shown in FIG. Further, when the rotation mechanism 24 is rotated, the rotated patterns PT1 to PT5 are displaced in the transport direction so that the patterns PT1 to PT4 are on the upstream side in the transport direction with respect to the patterns PT2 to PT5. .. Therefore, the control device 16 draws the CAD information for drawing on the substrate P at the drawing timing in the transport direction so that the CAD patterns CAD1 to CAD4 are on the downstream side of the transport direction with respect to the CAD patterns CAD2 to CAD5. The timing to start reading the drawing data from the memory circuit) is corrected.

On the other hand, in the control device 16, when the transport speed of the substrate P detected by the rotation position detection mechanism 14 becomes slower than the reference speed, the drawing start positions PO1 of the drawing lines LL1 to LL5 are changed to the drawing lines LL1 to the reference speed. It is located downstream of the drawing start position PO1 of the LL5 in the transport direction, and the drawing end position PO2 of the drawing lines LL1 to LL5 is located upstream of the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed. The rotation mechanism 24 is rotated so that it is positioned. Further, when the rotation mechanism 24 is rotated, the rotated patterns PT1 to PT5 are displaced in the transport direction so that the patterns PT1 to PT4 are on the downstream side in the transport direction with respect to the patterns PT2 to PT5. .. Therefore, the control device 16 draws the CAD information for drawing on the substrate P at the drawing timing in the transport direction so that the CAD patterns CAD1 to CAD4 are on the upstream side of the transport direction with respect to the CAD patterns CAD2 to CAD5. The timing to start reading the drawing data from the memory circuit) is corrected.

As described above, the control device 16 has a transfer speed detected by the rotation position detection mechanism 14 even if the substrate P is conveyed while the speed is slightly changed from the reference speed due to speed unevenness during drawing of the exposure device EX. The overall inclination of the drawing lines LL1 to LL5 can be adjusted based on the difference from the reference speed. Further, the control device 16 corrects the position of the CAD patterns CAD1 to CAD5 in the transport direction (corrects the drawing start timing) by using the amount of deviation of the patterns PT1 to PT5 after rotation as the correction amount in the transport direction. Patterns PT1 to PT5 can be drawn on the substrate P in a state of being linearly connected in the width direction of P.

The amount of rotation by the rotation mechanism 24 is preferably determined in advance according to the reference speed and the transport speed of the substrate P. Similarly, it is preferable that the correction amount of the CAD information is also obtained in advance according to the reference speed and the transport speed of the substrate P. Further, the reference speed of the substrate P, the displacement from the reference speed, the rotation amount of the rotation mechanism 24, and the correction amount of the CAD information may be obtained as a correlated correlation map. Further, when correcting the positions of the CAD patterns CAD1 to CAD5 in the transport direction (correcting the drawing start timing), the high-resolution encoder heads EN1 and EN2 (rotational position detection mechanism 14) shown in FIGS. 4 or 8 respectively. Based on the angular position of the rotary drum DR (conveyed position of the substrate P) detected by the above, drawing by each drawing line LL1 to LL5 is started (access of drawing data from the memory circuit is started). Specifically, when the amount of deviation in the transport direction between the drawing start position PO1 and the drawing end position PO2 of the patterns PT1 to PT5 that can occur after the rotation correction by the rotation mechanism 24 is calculated by the control device 16, the encoder head Corrected position information is generated by adding a correction of ± ΔXs according to the amount of deviation to the angular position of the rotary drum DR detected by each of EN1 and EN2. Then, based on the correction position information, drawing by each drawing line LL1 to LL5 is started (access of drawing data from the memory circuit is started).

As described above, in the first embodiment, the inclination of the drawing lines LL1 to LL5 is set by rotating the second optical surface plate 25 by the rotation mechanism 24 based on the transport speed of the substrate P detected by the rotation position detection mechanism 14. Can be adjusted. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be linearly formed along the width direction of the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5. Further, after the rotation of the second optical surface plate 25 by the rotation mechanism 24, the drawing timings of the CAD patterns CAD1 to CAD5 are corrected, and the patterns PT1 to PT5 drawn on the substrate P are placed at the same positions in the transport direction of the substrate P. Can be. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be suitably spliced in the width direction and the transport direction (long direction) of the substrate P, so that splicing error due to speed unevenness can be suppressed. be able to.

Further, in the first embodiment, the rotation mechanism 24 can be rotated in real time by the control device 16 according to the transport speed of the substrate P detected by the rotation position detection mechanism 14. Therefore, the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P can be adjusted even during drawing by the exposure apparatus EX, and the joint error caused by the periodic speed unevenness of the rotating drum DR can be suppressed. it can.

Further, in the first embodiment, when the transport speed of the substrate P is faster than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are upstream from the drawing start position PO1 of the drawing lines LL1 to LL5 at the reference speed. The patterns PT1 to PT5 can be suitably corrected by tilting the drawing end position PO2 so as to be downstream of the drawing end position PO2. Further, when the transport speed of the substrate P is slower than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are located downstream of the drawing start position PO1 of the drawing lines LL1 to LL5 at the reference speed, and the drawing end position. Patterns PT1 to PT5 can be suitably corrected by tilting them so as to be on the upstream side of PO2.

Further, in the first embodiment, since each drawing module UW1 to UW5 can be configured to include the optical deflector 81 and the scanning device 83, the drawing beam is drawn in a one-dimensional direction along the drawing lines LL1 to LL5. The LB can be scanned.

Further, in the first embodiment, the drawing device 11 installed on the second optical surface plate 25 is rotated by the rotation mechanism 24 to maintain the mutual positional relationship between the drawing lines LL1 to LL5 and the drawing line LL1. All tilts of ~ LL5 can be adjusted. Therefore, since the control device 16 only needs to control the rotation of the rotation mechanism 24, the configuration related to the control can be simplified.

Further, in the first embodiment, the size (spot diameter) of the drawing beam LB projected from the drawing modules UW1 to UW5 on the substrate P is set to D (μm), and the drawing beam LB is scanned along the drawing lines LL1 to LL5. When the speed is Vp (μm / sec), the light source device CNT can set the emission repetition period T (second) of the laser light source that emits pulsed light to have a relationship of T <D / Vp. Therefore, the drawing beam LB can be scanned in the scanning direction while overlapping the spot light by the drawing beam LB on the substrate P, so that the drawing line by the drawing beam LB is displayed while the optical deflector 81 is ON. It is drawn as a continuous line without interruption in the scanning direction.

In the first embodiment, the second optical surface plate 25 is rotated by the rotation mechanism 24, and the drawing device 11 is rotated with respect to the substrate P so that the drawing lines LL1 to LL5 are tilted with respect to the width direction of the substrate P. It was adjusted. However, the present invention is not limited to this configuration, and the inclinations of the drawing lines LL1 to LL5 may be adjusted relative to the width direction of the substrate P. That is, the exposure apparatus EX may have a configuration in which the rotation center line AX2 of the rotating drum DR is rotated in the XY plane about the rotation axis I in the XY plane. In this case, in the transport path of the substrate P, at least the rollers RT1 and RT2 (FIG. 1) arranged before and after the rotating drum DR are integrated and rotated in the XY plane around the rotation axis I. It is good to do.

[Second Embodiment]
Next, the exposure apparatus EX of the second embodiment will be described with reference to FIGS. 13 to 16. In the second embodiment, only the parts different from the first embodiment will be described in order to avoid duplication with the first embodiment, and the same components as those in the first embodiment are the same as those in the first embodiment. The description may be omitted by adding a reference numeral. FIG. 13 is a diagram showing a partial configuration of the f−θ lens system of the exposure apparatus of the second embodiment. FIG. 14 is a diagram showing a configuration of a cylindrical lens of the f−θ lens system of FIG. FIG. 15 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the second embodiment. FIG. 16 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the second embodiment. In the exposure apparatus EX of the first embodiment, the inclination of the drawing lines LL1 to LL5 is adjusted as a whole by rotating the second optical surface plate 25 by the rotation mechanism 24. On the other hand, the exposure apparatus EX of the second embodiment individually adjusts the inclination of each of the drawing lines LL1 to LL5.

In the exposure apparatus EX of the second embodiment, as shown in FIG. 13, the f-θ lens system 85 includes a telecentric f-θ lens 85a and a cylindrical lens 85b. In FIG. 13, in the f-θ lens system 85, the illustration of lenses other than the telecentric f-θ lens 85a and the cylindrical lens 85b is omitted.

The telecentric f−θ lens 85a makes the irradiated drawing beam LB parallel light in the XZ plane and convergent light in the Y direction (scanning direction). The drawing beam LB of parallel light in the XZ plane irradiates the cylindrical lens 85b. The cylindrical lens 85b is provided between the telecentric f-θ lens 85a and the substrate P. The cylindrical lens 85b has a bus line substantially parallel to the scanning direction in which the drawing line LL1 (similar to LL2 to LL5) extends, and has a predetermined power (refractive power) in a direction orthogonal to the bus line and has a drawing beam LB. Is focused on the spot light. Further, as shown in FIG. 14, the cylindrical lens 85b is rotatable about the rotation axes I1 to I5 in order to finely adjust the inclination of each of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P. .. The rotation axes I1 to I5 are rotation axes centered on a predetermined point in the drawing surface including the drawing lines LL1 to LL5 formed on the substrate P. The rotation axes I1 to I5 are, for example, rotation axes centered on the center in the direction in which the drawing lines LL1 to LL5 extend, and are in the same direction as the axis of the drawing beam LB. That is, the rotation axes I1, I3, I5 of the odd-numbered drawing lines LL1, LL3, LL5 are in the same direction as the installation direction line Le1, and the rotation axes I2, I4 of the even-numbered drawing lines LL2, LL4 are installed. It is in the same direction as the azimuth line Le2. The cylindrical lens 85b is rotated about the rotation axes I1 to I5 by the drive unit 100, and the rotation of the cylindrical lens 85b is controlled by the control device 16 connected to the drive unit 100. In the rotation centered on the rotation axes I1 to I5 of the cylindrical lens 85b, the direction of the bus of the cylindrical lens 85b (Y direction) with respect to the main ray of the drawing beam projected on the substrate P through the vicinity of the rotation axes I1 to I5. ), The main ray of the drawing beam projected on the substrate P through both ends is slightly tilted with respect to the direction orthogonal to the bus bus of the cylindrical lens 85b and the rotation axes I1 to I5, so that the drawing line on the substrate P The LL1 to LL5 can be tilted slightly.

Next, with reference to FIG. 15, adjustment of the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P will be described. In the exposure apparatus EX of the second embodiment, the drawing lines LL1 to LL5 are tilted with respect to the width direction of the substrate P by rotating the cylindrical lens 85b by the drive unit 100. That is, the cylindrical lens 85b functions as a drawing line rotation mechanism for adjusting the inclination of each of the drawing lines LL1 to LL5.

The drive unit 100 tilts the drawing lines LL1 to LL5 of the drawing modules UW1 to UW5 with respect to the width direction of the substrate P by rotating the cylindrical lenses 85b about the rotation axes I1 to I5.

Here, before drawing the exposure apparatus EX (for example, at the time of alignment), when the patterns PT1 to PT5 are spliced in the width direction of the substrate P with respect to the substrate P conveyed at the reference speed, the drawing lines LL1 to LL5 The adjustment of the inclination will be described. The adjustment of the inclination of the drawing lines LL1 to LL5 in the second embodiment in the above case is almost the same as the adjustment of the inclination of the drawing lines LL1 to LL5 in the first embodiment. Some explanations will be omitted. As shown in FIG. 15, the control device 16 controls the drive unit 100 based on the reference speed of the substrate P detected by the rotation position detection mechanism 14 to rotate the cylindrical lens 85b. In this case as well, the reference speed of the substrate P is associated with the amount of rotation of the cylindrical lens 85b. Specifically, the control device 16 rotates the cylindrical lens 85b based on the reference speed of the substrate P so that the drawing start positions PO1 of the drawing lines LL1 to LL5 are located on the upstream side in the transport direction, and the drawing line LL1 The cylindrical lens 85b is rotated with respect to the substrate P so that the drawing end position PO2 of LL5 is located on the downstream side in the transport direction.

As shown in FIG. 15, when the drawing lines LL1 to LL5 are tilted about the rotation axes I1 to I5, the positions of the drawing lines LL1 to LL5 in the transport direction are substantially unchanged. Therefore, the patterns PT1 to PT5 drawn on the substrate P by the rotated drawing lines LL1 to LL5 are linearly formed in the same direction as the width direction of the substrate P, as shown by the solid line in FIG. Also, the positions are the same in the transport direction of the substrate P. As described above, the patterns PT1 to PT5 are formed by being joined in a row along the width direction of the substrate P.

Next, regarding the drawing of the exposure apparatus EX, the drawing line LL1 when the patterns PT1 to PT5 are joined in the width direction of the substrate P with respect to the substrate P which is conveyed while slightly changing the speed from the reference speed due to speed unevenness. The adjustment of the inclination of ~ LL5 will be described. The adjustment of the inclination of the drawing lines LL1 to LL5 in the second embodiment in the above case is almost the same as the adjustment of the inclination of the drawing lines LL1 to LL5 in the first embodiment. Some explanations will be omitted. As shown in FIG. 15, the drive unit 100 arranges the patterns PT1 to PT5 by setting the drawing lines LL1 to LL5 at a predetermined inclination with respect to the substrate P conveyed at the reference speed with respect to the width direction of the substrate P. It is preferably spliced in the width direction of the substrate P.

From the state shown in FIG. 15, when the substrate P is conveyed at a transfer speed faster than the reference speed, the patterns PT1 to PT5 formed on the substrate P have the end PTa downstream of the end PTb in the transfer direction. It is formed diagonally so that it is on the side. On the other hand, when the substrate P is conveyed at a transfer speed slower than the reference speed, the patterns PT1 to PT5 formed on the substrate P have the end PTa on the upstream side in the transfer direction with respect to the end PTb. It is formed diagonally.

When the transport speed of the substrate P detected by the rotation position detection mechanism 14 becomes faster than the reference speed, the control device 16 sets the drawing start position PO1 of the drawing lines LL1 to LL5 to the reference speed as in the first embodiment. Is located upstream of the drawing start position PO1 of the drawing lines LL1 to LL5 in the drawing line, and the drawing end position PO2 of the drawing lines LL1 to LL5 is conveyed more than the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed. The driving unit 100 of each cylindrical lens 85b is controlled so that the drawing lines LL1 to LL5 are tilted so as to be located on the downstream side in the direction. On the other hand, in the control device 16, when the transport speed of the substrate P detected by the rotation position detection mechanism 14 becomes slower than the reference speed, the drawing start positions PO1 of the drawing lines LL1 to LL5 are changed to the drawing lines LL1 to the reference speed. It is located downstream of the drawing start position PO1 of the LL5 in the transport direction, and the drawing end position PO2 of the drawing lines LL1 to LL5 is located upstream of the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed. The drive unit 100 of each cylindrical lens 85b is controlled so that the drawing line is tilted.

Here, the exposure apparatus EX of the second embodiment individually adjusts the inclinations of the drawing lines LL1 to LL5. Therefore, the drawing lines LL1, LL3, LL5 of the upstream (odd number) drawing modules UW1, UW3, UW5 and the drawing modules UW2, UW4 on the downstream side (even number) are drawn with the central surface p3 in between. It is possible to adjust the inclination of each of the lines LL2 and LL4.

The speed unevenness that occurs during drawing of the exposure apparatus EX may differ depending on the rotational position of the rotating drum DR in the circumferential direction. Specifically, the transport speed of the substrate P on the installation azimuth line Le1 and the transport speed of the substrate P on the installation azimuth line Le2 may be different. In this case, the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 have the same inclination with respect to the substrate P. Then, for example, as shown in FIG. 16, the patterns PT1, PT3, PT5 formed by the odd-numbered drawing lines LL1, LL3, LL5 are formed along the width direction of the substrate P, while the even-numbered drawing lines are formed. The patterns PT2 and PT4 formed by the drawing lines LL2 and LL4 may be formed obliquely with respect to the width direction of the substrate P, as shown by the dotted line in FIG. This is because the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 are installed apart from each other in the Xs direction, so that the pattern should be drawn in the same area in the Xs direction on the substrate P. This is because there is a time difference in the drawing of the substrate P according to the transport speed of the substrate P.

The control device 16 detects the transport speed of the substrate P on the installation azimuth line Le1 detected by the encoder head EN1 of the rotation position detection mechanism 14, and also detects the installation directional line detected by the encoder head EN2 of the rotation position detection mechanism 14. The transport speed of the substrate P in Le2 is detected. Then, the control device 16 detects the speed difference between the transport speed of the substrate P on the detected installation directional line Le1 and the transport speed of the substrate P on the detected installation directional line Le2. As described above, the control device 16 includes a function as a speed difference detecting mechanism for detecting the speed difference between the transport speed of the substrate P on the installation directional line Le1 and the transport speed of the substrate P on the installation directional line Le2. ing. Then, the control device 16 controls the inclination of the even-numbered drawing lines LL2 and LL4 based on the detected speed difference by controlling the drive unit 100 of the cylindrical lens 85b provided in each of the even-numbered drawing modules UW2 and UW4. And adjust. The patterns PT2 and PT4 exposed on the substrate P after the rotation adjustment of the cylindrical lens 85b are formed linearly along the width direction of the substrate P, similarly to the patterns PT1, PT3 and PT5.

As described above, in the second embodiment, the inclinations of the drawing lines LL1 to LL5 are adjusted by rotating the cylindrical lens 85b by the drive unit 100 based on the transport speed of the substrate P detected by the rotation position detection mechanism 14. be able to. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be linearly formed along the width direction of the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5. , The same position can be set in the transport direction of the substrate P. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be suitably spliced in the width direction and the transport direction (long direction) of the substrate P, and due to the unevenness of the transport speed of the substrate P. The splicing error can be further suppressed.

Further, in the second embodiment, the mechanism for adjusting the inclination of the drawing lines LL1 to LL5 (drawing line rotation mechanism) can be simply configured by the drive unit 100 and the cylindrical lens 85b.

In the second embodiment, the transfer speeds of the drawing modules UW1, UW3, UW5 on the upstream side (odd number) at the drawing lines LL1, LL3, LL5 and the drawing modules UW2, UW4 on the downstream side (even number) The speed difference from the transport speed in the drawing lines LL2 and LL4 can be detected, and the inclination of the drawing lines LL1 to LL5 can be adjusted according to the detected speed difference. Therefore, the transfer speed of the substrate P at the time of drawing by the drawing lines LL1, LL3, LL5 of the odd-numbered drawing modules UW1, UW3, UW5 and the drawing line LL2, LL4 of the even-numbered drawing modules UW2, UW4 Even when the transfer speed of the substrate P is different, the patterns PT1 to PT5 drawn on the substrate P can be corrected and exposed so as to be suitable for joining in the width direction and the transfer direction of the substrate P. Therefore, it is possible to suppress a splicing error due to speed unevenness.

In the second embodiment, the drawing lines LL1 to LL5 are rotated around the rotation axes I1 to I5, but the rotation center is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

[Third Embodiment]
Next, the exposure apparatus EX of the third embodiment will be described with reference to FIG. In addition, also in the third embodiment, in order to avoid the description overlapping with the first and second embodiments, only the parts different from the first and second embodiments will be described, and the same components as those of the first and second embodiments will be described. With the same reference numerals as those of the first and second embodiments, the description thereof may be omitted. FIG. 17 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the third embodiment. In the exposure apparatus EX of the first embodiment, the inclination of the drawing lines LL1 to LL5 is adjusted as a whole by rotating the second optical surface plate 25 by the rotation mechanism 24. On the other hand, the exposure apparatus EX of the third embodiment adjusts the drawing timing without changing the inclination of the drawing lines LL1 to LL5.

In the exposure apparatus EX of the third embodiment, as shown in FIG. 17, the control device 16 corrects the drawing timing according to the transfer speed of the substrate P detected by the rotation position detection mechanism 14 or the transfer position. The correction of the drawing timing is the same as that of the first embodiment, and as shown in FIG. 12, the CAD information used for drawing on the substrate P is corrected in the transport direction. That is, the control device 16 joins the CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 formed on the substrate P so that the ends PTa and PTb of the patterns PT1 to PT5 are joined to each other. CAD5 is corrected in the transport direction.

As described above, the control device 16 has a CAD pattern shown by a solid line in FIG. 12 according to the transport speed or the transport position of the substrate P detected by the rotation position detection mechanism 14 at the time of alignment or drawing of the exposure device EX. By correcting the positions of CAD1 to CAD5 in the transport direction, the patterns PT1 to PT5 shown in FIG. 17 can be drawn on the substrate P.

As described above, in the third embodiment, the drawing timing by the drawing modules UW1 to UW5 can be corrected based on the transfer speed of the substrate P detected by the rotation position detection mechanism 14 or the transfer position. Therefore, although the patterns PT1 to PT5 drawn on the substrate P are oblique to the width direction of the substrate P, they can be corrected so as to be spliced in the width direction of the substrate P. The error can be suppressed.

[Fourth Embodiment]
Next, the exposure apparatus EX of the fourth embodiment will be described with reference to FIG. In addition, also in the 4th embodiment, in order to avoid the description overlapping with the 1st to 3rd embodiments, only the parts different from the 1st to 3rd embodiments will be described, and the same components as those in the 1st to 3rd embodiments will be described. In some cases, the same reference numerals as those in the first to third embodiments are given and the description thereof may be omitted. FIG. 18 is a diagram showing an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line by the exposure apparatus of the fourth embodiment. In the exposure apparatus EX of the first to third embodiments, the scanning directions of the drawing beams LB scanned along the drawing lines LL1 to LL5 were all in the same direction. On the other hand, the exposure apparatus EX of the fourth embodiment is a drawing beam LB scanned along the drawing lines LL1, LL3, LL5 of the odd-numbered drawing modules UW1, UW3, UW5 among the drawing lines LL1 to LL5. The scanning direction and the scanning direction of the drawing beam LB scanned along the drawing lines LL2 and LL4 of the even-numbered drawing modules UW2 and UW4 are opposite to each other.

In the exposure apparatus EX of the fourth embodiment, as shown in FIG. 18, the spot light of the drawing beam LB projected from each of the plurality of drawing modules UW1 to UW5 onto the substrate P is directed to the linear drawing lines LL1 to LL5. Along the line, scanning is performed in the Y direction from the drawing start position PO1 to the drawing end position PO2. At this time, the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 is opposite to the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL2, LL4. It is the direction. This is achieved by rotating all the rotating polygon mirrors 97 of each drawing module shown in FIG. 7 in the same direction (for example, all counterclockwise).

Therefore, the patterns PT1, PT3, PT5 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 set on the straight line parallel to the central surface p3 are formed on the substrate P. Under the influence of the transport speed, for example, it is formed so as to tilt upward to the right in the paper surface of FIG. That is, the right end PTa of the patterns PT1, PT3, PT5 is formed on the downstream side in the transport direction as compared with the left end PTb of the patterns PT1, PT3, PT5. On the other hand, the patterns PT2 and PT4 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL2 and LL4 set on the straight line parallel to the central surface p3 are affected by the transport speed of the substrate P. In response to this, the patterns PT1, PT3, and PT5 are formed in the opposite direction, that is, tilted upward to the left in the paper surface of FIG. That is, the right end PTb of the patterns PT2 and PT4 is formed on the upstream side in the transport direction as compared with the left end PTa of the patterns PT2 and PT4.

Further, the distance between the odd-numbered drawing lines LL1, LL3, LL5 and the even-numbered drawing lines LL2, LL4 in the Xs direction is constant, the transfer speed of the substrate P is not uneven, and the rotating polygon mirror 97 of each drawing module Assuming that the rotation speeds match, the left end PTb of the pattern PT1 drawn by the drawing line LL1 and the right end PTb of the pattern PT2 drawn by the drawing line LL2 are the widths of the substrate P. It is spliced in the direction (Y direction) and the transport direction (Xs direction). Similarly, the left end PTa of the pattern PT2 drawn by the drawing line LL2 and the right end PTa of the pattern PT3 drawn by the drawing line LL3 are also spliced in the Y direction and the Xs direction and drawn by the drawing line LL3. The left end PTb of the pattern PT3 to be drawn and the right end PTb of the pattern PT4 drawn by the drawing line LL4 are also spliced in the Y direction and the Xs direction, and the left end of the pattern PT4 drawn by the drawing line LL4. The portion PTa and the right end PTa of the pattern PT5 drawn by the drawing line LL5 are also spliced in the Y direction and the Xs direction.

As in the fourth embodiment, the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL1, LL3, LL5 and the spot light of the drawing beam LB scanned along the drawing lines LL2, LL4. If there is no unevenness in the transport speed of the substrate P, the patterns PT1 to PT5 drawn on the substrate P are slightly oblique to the width direction (Y-axis) of the substrate P. However, it can be spliced in the width direction of the substrate P.

FIG. 19 shows how each of the patterns PT1 to PT5 drawn on the substrate P is corrected to be slightly tilted as shown in FIG. 18, and here, the same as in the second embodiment (FIG. 14) above. In addition, the driving unit 100 slightly rotates the cylindrical lens 85b of the f-θ lens system 85 around the rotation axes I1 to I5 to individually adjust the inclination of the drawing lines LL1 to LL5.

As shown in FIG. 19, the drawing start position PO1 of the drawing lines LL1, LL3, LL5 is located on the upstream side (−Xs direction) in the transport direction, and the drawing end position PO2 of the drawing lines LL1, LL3, LL5 is in the transport direction. The cylindrical lens 85b in each of the drawing modules UW1, UW3, and UW5 is rotated by the drive unit 100 with respect to the substrate P so as to be located on the downstream side (+ Xs direction). On the other hand, the drawing start position PO1 of the drawing lines LL2 and LL4 is located on the upstream side (-Xs direction) of the transport direction, and the drawing end position PO2 of the drawing lines LL2 and LL4 is located on the downstream side (+ Xs direction) of the transport direction. As described above, the cylindrical lens 85b is rotated by the drive unit 100 with respect to the substrate P.

As shown in FIG. 19, when the drawing lines LL1 to LL5 are tilted about the rotation axes I1 to I5, the patterns PT1 to PT5 drawn on the substrate P by the rotated drawing lines LL1 to LL5 are shown in FIG. As shown by the solid line of 19, they are formed so as to be linearly arranged in a direction substantially the same as the width direction of the substrate P, and are at the same position in the transport direction (Xs direction) of the substrate P. As described above, if the transport speed of the substrate P is precisely constant and there is no speed unevenness, the drawn patterns PT1 to PT5 are formed in a straight line along the width direction of the substrate P. The same applies to the second embodiment, but the points where the rotation axes I1, I3, and I5 of the cylindrical lens 85b of the odd-numbered f-θ lens system 85 intersect the Y-Xs plane are parallel to the Y axis. It shall be located on the line.

When the transport speed of the substrate P on the installation directional line Le1 and the transport speed of the substrate P on the installation directional line Le2 are different during drawing of the exposure apparatus EX, they are shown by, for example, the solid line in FIG. 20 as in the second embodiment. As described above, the patterns PT1, PT3, and PT5 formed by the odd-numbered drawing lines LL1, LL3, and LL5 are formed along the width direction of the substrate P, while the even-numbered numbers are as shown by the dotted lines in FIG. The patterns PT2 and PT4 formed by the drawing lines LL2 and LL4 of the above are formed obliquely with respect to the width direction of the substrate P.

Therefore, the control device 16 has the transfer speed of the substrate P on the installation directional line Le1 detected by the encoder head EN1 of the rotation position detection mechanism 14 and the installation azimuth line Le2 detected by the encoder head EN2 of the rotation position detection mechanism 14. The speed difference from the transport speed of the substrate P in the above is detected. Then, the control device 16 adjusts the inclination of the even-numbered drawing lines LL2 and LL4 based on the detected speed difference. The rotated patterns PT2 and PT4 are formed along the width direction of the substrate P, similarly to the patterns PT1, PT3 and PT5.

As described above, in the fourth embodiment, the inclinations of the drawing lines LL1 to LL5 are adjusted by rotating the cylindrical lens 85b by the drive unit 100 based on the transport speed of the substrate P detected by the rotation position detection mechanism 14. be able to. Therefore, the patterns PT1 to PT5 drawn on the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5 are precisely connected and formed without being tilted along the width direction of the substrate P. Also, it can be connected at the same position in the transport direction of the substrate P. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be suitably spliced in the width direction of the substrate P, so that the drawing timing is not corrected as in the first embodiment. It is possible to suppress splicing errors due to speed unevenness.

In the fourth embodiment as well, the drawing lines LL1 to LL5 are rotated around the rotation axes I1 to I5 as in the second embodiment, but the rotation center is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

Further, in the first to fourth embodiments, the rotation position (moving position of the substrate P) and the transport speed of the rotating drum DR are detected by using the scale portions GPa and GPb formed on the outer peripheral surface of the rotating drum DR. , Not limited to this configuration. For example, a scale disk having a high roundness may be attached to the rotating drum DR. In this scale disk, scale portions GPa and GPb are engraved on the outer peripheral surface, and are fixed to the end portion of the rotating drum DR so as to be orthogonal to the rotation center line AX2. Therefore, the scale disk rotates integrally with the rotating drum DR around the rotation center line AX2. Further, the scale disk is made of a low thermal expansion metal, glass, ceramics or the like as a base material, and has a diameter as large as possible (for example, a diameter of 20 cm or more) in order to improve the measurement resolution. In the scale disk, the diameter of the outer peripheral surface of the substrate P wound around the rotating drum DR and the diameters of the scale portions GPa and GPb of the scale disk are aligned (almost matched) to further reduce the so-called measurement error. Can be done.

Further, each configuration of the first to fourth embodiments may be combined as appropriate. For example, as in the first embodiment, while making the entire plurality of drawing modules UW1 to UW5 microrotatable by the rotation mechanism 24, as in the second embodiment (or the fourth embodiment), each drawing module UW1 to The cylindrical lens 85b of the f−θ lens system 85 of the UW5 may be individually made minutely rotatable. Further, as shown in FIG. 3, the positions of the plurality of alignment marks Ks1, Ks2, and Ks formed on the substrate P are detected by the corresponding alignment microscope AM1 to obtain the exposure region A7 on the substrate P. Trends such as two-dimensional expansion and contraction deformation and non-linear strain deformation can be continuously measured.

Therefore, each or all of the drawing lines LL1 to LL5 may be displayed in real time on the surface of the substrate P so as to match the two-dimensional expansion / contraction deformation and the non-linear distortion deformation of the exposure region A7 measured by the alignment microscope AM1. By correcting it so as to be slightly tilted, the overlay accuracy of the pattern layer already formed in the exposure region A7 on the substrate P and the drawing pattern to be overexposed on the pattern layer is adjusted in the exposure region A7. It is possible to keep it within the permissible range in various places.

Further, in the first to fourth embodiments, the substrate P is supported by the outer peripheral surface of the rotary drum DR, and the rotary drum DR is rotated to rotate the substrate P while transporting the substrate P in the elongated direction. The pattern is drawn on the part supported by the drum DR, but the pattern is not limited to that. For example, in a state where the substrate P is attracted and supported on the surface of the stage that supports the substrate P in a plane, a pattern is drawn while both the stage and the substrate P are conveyed in the long direction, or a flat surface of the support base. With the substrate P mounted on it, an air bearing layer is formed between the front surface of the support base and the back surface of the substrate P, and the substrate P is supported and conveyed in a plane in a non-contact or low friction state. , The pattern may be drawn.

Further, in each of the first to fourth embodiments, when adjusting the inclination of the drawing lines LL1 to LL5 in the entire XY plane, the rotation mechanism 24 shown in FIG. 2 and the second optical surface plate 25 are used. However, even if the position of the bearings that support both ends of the shaft portion Sf2 of the rotating drum DR is slightly shifted in the X direction and the entire rotating drum DR is tilted in the XY plane. good. Further, when the transfer speed of the substrate P supported on the rotating drum DR in the long direction is changed from the reference speed, or when the transfer speed becomes uneven, the changed speed or the speed unevenness is adjusted. , The rotation speed of each of the rotating polygon mirrors 97 of the drawing units UW1 to UW5 may be dynamically changed. That is, the ratio of the scanning speed (main scanning speed) Vp of the spot light scanned along each of the drawing lines LL1 to LL5 and the transport speed (secondary scanning speed) Vxs in the long direction of the substrate P is set to the substrate P. The rotation speed of the rotating polygon mirror 97 may be controlled so that it becomes substantially constant even when the carrying speed of the above changes.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 21 is a flowchart showing a device manufacturing method of each embodiment.

In the device manufacturing method shown in FIG. 21, first, the function / performance of the display panel is designed by a self-luminous element such as an organic EL, and the necessary circuit pattern and wiring pattern are designed by CAD or the like (step S201). Further, a supply roll on which a flexible substrate P (resin film, metal foil film, plastic, etc.) as a base material of the display panel is wound is prepared (step S202). The roll-shaped substrate P prepared in step S202 has a surface modified as necessary, a base layer (for example, microconcavities and convexities produced by an imprint method) preformed, and photosensitivity. A functional film or a transparent film (insulating material) may be laminated in advance.

Next, a backplane layer composed of electrodes, wirings, an insulating film, a TFT (thin film transistor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self-luminous element of the above (step S203). This step S203 also includes a conventional photolithography step of exposing the photoresist layer using the exposure apparatus EX described in each of the above embodiments, but a photosensitive silane coupling material is applied instead of the photoresist. A wet process in which the substrate P is exposed to a pattern to form a pattern due to water repellency on the surface, and a light-sensitive catalyst layer is exposed to a pattern to form a metal film pattern (wiring, electrodes, etc.) by a electrolytic plating method. It also includes a process, a printing process of drawing a pattern with a conductive ink containing silver nanoparticles, or the like.

Next, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by the roll method, and a protective film (environmental barrier layer) or a color filter is placed on the surface of each display panel device. The device is assembled by pasting sheets or the like (step S204). Next, an inspection step is performed to see if the display panel device functions normally and satisfies the desired performance and characteristics (step S205). As described above, a display panel (flexible display) can be manufactured.

1 Device manufacturing system 11 Drawing device 12 Board transfer mechanism 13 Device frame 14 Rotational position detection mechanism 16 Control device 21 Main body frame 22 Three-point seat support 23 First optical platen 24 Rotation mechanism 25 Second optical platen 31 Calibration detection System 44 XY Overall Harving Adjustment Mechanism 45 XY One Side Harving Adjustment Mechanism 51 1/2 Wave Plate 52 Polarizing Mirror 53 Beam Diffuser 60 1st Beam Splitter 62 2nd Beam Splitter 63 3rd Beam Splitter 73 4th Beam Splitter 81 Optical Deflitter 82 1/4 wave plate 83 Scanner 84 Folding mirror 85 f-θ Lens system 86 Y Magnification correction optical member 92 Shading plate 96 Reflecting mirror 97 Rotating polygon mirror 98 Origin detector 100 Drive unit P substrate U1, U2 Process device EX exposure Equipment AM1, AM2 Alignment microscope EVC Temperature control chamber SU1, SU2 Anti-vibration unit E Installation surface EPC Edge position controller RT1, RT2 Tension adjustment roller DR Rotation drum AX2 Rotation center line Sf2 Shaft part p3 Center surface DL slack UW1 to UW5 Drawing module CNT Light source device LB Drawing beam I Rotation axis LL1 to LL5 Drawing line PBS Polarized beam splitter A7 Exposure area SL Branching optical system (beam distribution system)
Le1 to Le4 Installation orientation line Vw1 to Vw6 Observation area Ks1 to Ks3 Alignment mark GPa, GPb Scale part EN1 to EN4 Encoder head PT1 to PT5 pattern

Claims (17)

A substrate having a predetermined width is moved in a transport direction intersecting the width direction, and a drawing beam whose intensity is modulated based on drawing data is projected onto the substrate and scanned in the width direction to draw a pattern on the substrate. It is a board processing device
While supporting the substrate, and a substrate transfer mechanism for transferring at a predetermined reference speed of the substrate to the conveying direction,
The drawing beam along the drawing line obtained by scanning in the width direction narrower than a width of the substrate to be projected onto the substrate, the width direction of the drawing module to draw a predetermined pattern on the substrate When there are a plurality of drawing modules arranged side by side and each of the plurality of drawing modules has an odd number and an even number in the order of arrangement in the width direction, the drawing lines of the odd number drawing modules adjacent to each other and the even number drawing modules The odd-numbered drawing lines and the even-numbered drawing lines are predetermined in the transport direction so that the patterns drawn on the substrate by each of the drawing lines are joined in the width direction of the substrate. A drawing device in which the odd-numbered drawing module and the even-numbered drawing module are symmetrically arranged with the predetermined interval in between, and the drawing device, which is arranged at intervals and when viewed from the width direction .
A substrate speed detection device that detects the difference between the transfer speed of the substrate and the reference speed , and
A tilt adjustment mechanism for the adjustment of the relative inclination against the width direction of the substrate of each of the drawing line of the even-numbered and the odd-numbered drawing line,
A control device that controls the tilt adjusting mechanism according to the difference detected by the substrate speed detection device, and
Board processing equipment equipped with. The substrate processing apparatus according to claim 1 .
The control device is
In the difference detected by said substrate speed detecting apparatus, the conveying speed of the substrate, when higher than the reference speed, the drawing start side of the drawing line of each of the even-numbered and the odd-numbered, the reference speed Is located upstream of the drawing start side of the drawing line in the above, and the drawing end side of each of the odd-numbered and even-numbered drawing lines is from the drawing end side of the drawing line at the reference speed. also that controls the tilt adjustment mechanism so as to be positioned downstream of the conveying direction,
Board processing equipment. The substrate processing apparatus according to claim 1.
The control device is
In the difference detected by the substrate speed detection device, when the transport speed of the substrate is slower than the predetermined reference speed, the drawing start side of each of the odd-numbered and even-numbered drawing lines is the said. It is located downstream of the drawing start side of the drawing line at the reference speed in the transport direction, and the drawing end side of each of the odd-numbered and even-numbered drawing lines ends drawing of the drawing line at the reference speed. The tilt adjusting mechanism is controlled so as to be located on the upstream side in the transport direction with respect to the side.
Board processing equipment. The substrate processing apparatus according to any one of claims 1 to 3.
Each of the plurality of drawing module, in order to perform the drawing operation of the pattern during the period of the drawing beam scanned in one direction along the drawing line, is-strength modulation on the basis of the drawing data of the pattern has been a modulator for generating a pre-Symbol draw beam and a scanner for scanning the drawing beam in one dimension along the drawing line,
Board processing equipment. The substrate processing apparatus according to claim 4.
The drawing apparatus holds the plurality of drawing modules so that each of the odd-numbered drawing module and the even-numbered drawing module scans the drawing beam in the same direction on the substrate during the drawing operation. Equipped with a surface plate
The tilt adjusting mechanism includes a rotation mechanism for rotating the surface plate in the drawing surface around a predetermined point in the drawing surface including the drawing line formed by each of the plurality of drawing modules.
Board processing equipment. The substrate processing apparatus according to any one of claims 1 to 3 .
The drawing device holds the plurality of drawing modules so that the scanning directions at the time of drawing the drawing beams projected from each of the odd-numbered drawing modules and the even-numbered drawing modules are the same on the substrate. Including the surface plate
The tilt adjusting mechanism includes a rotation mechanism for rotating the surface plate in the drawing surface around a predetermined point in the drawing surface including each of the drawing lines formed by the plurality of drawing modules.
The control device drives and controls the rotation mechanism according to the difference detected by the substrate speed detection device.
Board processing equipment. The substrate processing apparatus according to claim 6.
The control device is
Even after the platen is rotated by the rotation mechanism, the joints between the patterns drawn on the odd-numbered drawing lines and the even-numbered drawing lines adjacent to each other in the width direction of the substrate are still present. The drawing timing of each of the drawing modules is corrected so that they are at the same position on the substrate in the transport direction or the width direction.
Board processing equipment. The substrate processing apparatus according to claim 4.
The drawing device further includes a pulse light source that generates pulsed light as the drawing beam.
When the size of the spot light of the drawing beam projected from the drawing module on the substrate is D (μm) and the scanning speed of the drawing beam along the drawing line is Vp (μm / sec), the pulse. The light emission repetition period T (seconds) of the light source is set in the relationship of T <D / Vp.
Board processing equipment. The substrate processing apparatus according to any one of claims 1 to 3 .
The tilt adjusting mechanism is
The odd-numbered and provided in each of the even numbered drawing module, about a predetermined point in the drawing surface, including the drawing lines formed on the substrate, wherein the odd-numbered and the even-numbered in the drawing plane Equipped with a drawing line rotation mechanism that rotates each of the drawing lines of
The control device drives and controls each of the drawing line rotation mechanism provided for each of the odd-numbered drawing module and the even-numbered drawing module according to the difference detected by the substrate speed detecting device.
Board processing equipment. The substrate processing apparatus according to claim 1.
The drawing device is
The scanning direction at the time of drawing the drawing beam projected from each of the odd-numbered drawing module and the even-numbered drawing module is opposite between the odd-numbered drawing line and the even-numbered drawing line. Includes a surface plate that holds the plurality of drawing modules.
The tilt adjusting mechanism is
The odd-numbered drawing lines and the even-numbered drawing lines are drawn in the drawing surface around a predetermined point in the drawing surface including the drawing lines formed on the substrate and provided in each of the plurality of drawing modules. It has a drawing line rotation mechanism that rotates each of the lines.
Board processing equipment. The substrate processing apparatus according to claim 10.
The control device is
Each of the plurality of drawing modules is provided so that the relative inclinations of the odd-numbered drawing lines and the even-numbered drawing lines are adjusted according to the difference detected by the substrate speed detection device. was that controls the drawing line rotation mechanism,
Board processing equipment. The substrate processing apparatus according to any one of claims 9 to 11.
Each of the plurality of drawing modules
A rotating multi-sided mirror that deflects and scans the drawing beam toward the substrate in one direction.
An f−θ lens that guides the drawing beam deflected and scanned by the rotating polymorphic mirror to the drawing line on the substrate, and
It has a cylindrical lens provided between the f−θ lens and the substrate, having a bus line parallel to the direction in which the drawing line extends, and condensing the drawing beam in a direction orthogonal to the bus line. ,
The drawing line rotation mechanism tilts the drawing line relatively by rotating the cylindrical lens.
Board processing equipment. The substrate processing apparatus according to claim 1 or 11.
One of the odd-numbered drawing module and the even-numbered drawing module is provided on the upstream side in the transport direction of the substrate, and the other of the odd-numbered drawing module and the even-numbered drawing module is in the transport direction of the substrate. et al provided on the downstream side is,
The control device is
Comprising an upstream transport speed of the substrate in the drawing line by the upstream side of the drawing module, the speed difference detection mechanism for detecting the difference between the downstream transport speed of the substrate in the drawing line by the downstream side of the drawing module ,
The tilt adjustment mechanism adjusts the tilt of the drawing line by the drawing module on the downstream side according to the detected speed difference.
Board processing equipment. The substrate processing apparatus according to any one of claims 1 to 3 and 10 to 12.
The substrate transfer mechanism is
It has a rotating drum that transports the substrate in the transport direction by supporting the substrate on a cylindrical outer peripheral surface having a constant radius from a center line extending in the width direction of the substrate and rotating the substrate around the center line. And
Each of the odd-numbered drawing module and the even-numbered drawing module is arranged so that the direction of the drawing line formed on the substrate is aligned with the direction of the center line of the rotating drum.
Board processing equipment. A device manufacturing method for forming an electronic device on a flexible sheet-like substrate.
The first step of uniformly or selectively forming a light-sensitive layer on the surface of the substrate, and
Using the substrate processing apparatus according to any one of claims 1 to 14, the drawing beam from each of the plurality of drawing modules is scanned against the light-sensitive layer of the substrate, and the electronic device is used. The second step of drawing the spliced pattern for the above-mentioned light-sensitive layer, and
A third step of forming a layered structure of the electronic device according to the spliced pattern on the substrate by applying a treatment to the drawn light-sensitive layer.
Device manufacturing method including. The device manufacturing method according to claim 15.
In the first step, a solution of either a photosensitive functional layer that requires development treatment or a photosensitive functional layer that does not require development treatment is uniformly or selectively applied to the surface of the substrate by a coating device. By applying and drying, the light-sensitive layer is formed.
Device manufacturing method. The device manufacturing method according to claim 16.
The drawn beam is a laser beam having an oscillation peak in the ultraviolet region having a wavelength of 450 nm or less.
The photosensitive functional layer that does not require the development treatment is a photosensitive silane coupling material whose surface repellent property is modified by projection and non-projection of the drawing beam in the second step, or the second. A photosensitive reducing agent in which plating reducing groups are selectively exposed on the surface by projection and non-projection of the drawing beam in the above step.
Device manufacturing method.

Images