JP6741018B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing equipment.

Conventionally, as a substrate processing apparatus, an exposure roller that conveys a sheet-like work (substrate), a photomask arranged above the exposure roller, and a photomask for exposure by scanning light from an exposure light source with a rotating polygon mirror There is known a proximity type pattern exposure apparatus that includes an illumination unit that irradiates the light (for example, see Patent Document 1). In this pattern exposure apparatus, while the sheet-shaped work is conveyed by the exposure roller, the work is exposed to the mask pattern of the photomask by irradiating the photomask with light from the illumination unit. In the pattern exposure apparatus described in Patent Document 1, the work is wound around the exposure roller and conveyed, but the positional relationship between the photomask and the work may be changed due to the influence of vibration and the like due to the rotation of the exposure roller. .. In this case, since the positional relationship between the work wound around the exposure roller and the photomask is displaced from the predetermined positional relationship suitable for exposure, it is difficult to accurately expose the work with the mask pattern of the photomask. Becomes

JP, 2007-72171, A

According to the first aspect of the present invention, there is provided a substrate processing apparatus which feeds a long sheet substrate in a long direction and sequentially forms a predetermined pattern on the sheet substrate, and which intersects the long direction. A cylindrical drum that has a cylindrical outer peripheral surface with a constant radius from a center line extending in the direction, and supports the sheet substrate at a part of the outer peripheral surface, and rotatably supports the cylindrical drum around the center line. A first supporting member, a pattern forming device for forming the pattern on the sheet substrate, the pattern forming device being disposed so as to face a portion of the outer peripheral surface of the cylindrical drum that supports the sheet substrate, and holding the pattern forming device. A second supporting member, a connecting mechanism that adjustably connects a relative positional relationship between the cylindrical drum and the pattern forming device, and a rotation of the cylindrical drum that rotates together with the cylindrical drum around the center line. Direction or a reference member provided with an index for measuring a position change in the center line direction, and a reference member provided on the side of the second support member to detect the index of the reference member and the rotational direction of the cylindrical drum or A first processing apparatus for detecting a positional change in the centerline direction is provided.

According to a second aspect of the present invention, a cylindrical drum that supports a sheet substrate on a cylindrical outer peripheral surface having a constant radius from a center line and is supported by a first support member so as to rotate around the center line. And a pattern forming device supported by a second supporting member so as to form a predetermined pattern on the sheet substrate supported by the cylindrical drum, the center of the cylindrical drum. Each of the pair of scale parts of the rotation measurement encoder provided on both sides in the direction of the line is read by a pair of read heads arranged on the side of the second supporting member, and the cylindrical drum and the pattern forming device. A deviation from a predetermined relative arrangement relationship is obtained from the detection results of the pair of read heads, and the first supporting member and the second supporting member are relatively displaceable so that the obtained deviation is reduced. A method of adjusting a substrate processing apparatus is provided that includes adjusting a connecting mechanism for connecting.

According to a third aspect of the present invention, a cylindrical drum that supports a sheet substrate on a cylindrical outer peripheral surface having a constant radius from a center line and is supported by a first support member so as to rotate around the center line. And a pattern forming device supported by a second supporting member so as to form a predetermined pattern on the sheet substrate supported by the cylindrical drum, the center of the cylindrical drum. Each of the pair of scale parts of the rotation measurement encoder provided on both sides in the direction of the line is read by a pair of read heads arranged on the side of the second supporting member, and the cylindrical drum and the pattern forming device. Determining a deviation from the predetermined relative arrangement relationship from the detection results of the pair of read heads, and spatially determining the area in which the pattern forming device forms a pattern on the sheet substrate according to the obtained deviation. Adjusting the position of the substrate relative to the cylindrical drum is provided.

According to a fourth aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus according to the first aspect of the present invention.

According to a fifth aspect of the present invention, the pattern forming apparatus of the substrate processing apparatus according to the first aspect of the present invention is an exposure apparatus that irradiates the sheet substrate with light energy according to the shape of a predetermined pattern. The sheet substrate having the photosensitive functional layer formed on the surface thereof is supported by the cylindrical drum of the sheet substrate while being fed in the longitudinal direction while being supported by a part of the outer peripheral surface of the cylindrical drum. Forming a layer corresponding to the shape of a predetermined pattern on the sheet substrate by irradiating the light energy from the exposure device toward the portion to be processed and treating the irradiated sheet substrate. And a device manufacturing method including:

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus which sequentially forms a predetermined pattern on the sheet substrate while feeding the long sheet substrate in the longitudinal direction, and intersects the longitudinal direction. A first support having a cylindrical outer peripheral surface having a constant radius from a center line extending in the direction, and supporting a sheet substrate at a part of the outer peripheral surface while axially supporting a cylindrical drum rotatable about the center line. A member and a plurality of pattern forming portions arranged to face the portion supporting the sheet substrate on the outer peripheral surface of the cylindrical drum in order to form the pattern on the sheet substrate. The relative angular relationship between the first support member and the second support member can be adjusted in order to adjust the inclination of the second support member that is arranged side by side in the direction and the pattern that should be formed on the sheet substrate. A first rotation mechanism, and a reference member that rotates around the center line together with the cylindrical drum, and that is provided with an index for measuring a rotational direction of the cylindrical drum or a position change in the center line direction; It is provided on the side of the second support member, detects an index of the reference member to detect a positional change in the rotation direction of the cylindrical drum, and detects the relative position between the first support member and the second support member. A substrate processing apparatus including a first detection device that detects a change in angle is provided.

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. FIG. 2 is a perspective view showing an arrangement of main parts of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing the configuration of the rotary drum and the drawing device of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. FIG. 8 is a perspective view showing a positional relationship among an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG. FIG. 10 is a plan view showing the arrangement of encoder heads of the exposure apparatus of FIG. FIG. 11 is a plan view showing the positional relationship between the rotary drum and the drawing device of the exposure apparatus of FIG. FIG. 12 is a flowchart regarding the adjusting method of the exposure apparatus of the first embodiment. FIG. 13 is a perspective view showing the arrangement of the main parts of the exposure apparatus of the second embodiment. FIG. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus of the third embodiment. FIG. 15 is a diagram showing the configurations of the rotary drum and the drawing device of the exposure apparatus of the fourth embodiment. FIG. 16 is a plan view showing the arrangement of encoder heads of the exposure apparatus of the fifth embodiment. FIG. 17 is a plan view showing the arrangement of scale disks of the exposure apparatus of the sixth embodiment. FIG. 18 is a flowchart showing the device manufacturing methods of the first to fifth embodiments.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the embodiments below. Further, the constituent elements described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate. Further, various omissions, substitutions or changes of the constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]
FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs an exposure process on a substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various processes on the substrate P after exposure to manufacture a device. ing. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line for manufacturing a flexible display as a device (flexible display manufacturing line). Examples of flexible displays include organic EL displays. In the device manufacturing system 1, the substrate P is delivered from a supply roll (not shown) in which a flexible substrate P is wound in a roll shape, and various processes are continuously performed on the delivered substrate P. Then, the processed substrate P is wound around a recovery roll (not shown) as a flexible device, which is a so-called roll-to-roll system. In the device manufacturing system 1 of the first embodiment, the substrate P, which is a film-like sheet, is sent out from the supply roll, and the substrates P sent out from the supply roll are sequentially processed by the process apparatus U1, the exposure apparatus EX, and the process apparatus. An example is shown through U2, before being wound up on a recovery roll. Here, the substrate P to be processed by the device manufacturing system 1 will be described.

As the substrate P, for example, a resin film, a foil made of metal or alloy such as stainless steel, or the like is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. It contains 1 or 2 or more.

It is desirable to select a substrate P having a coefficient of thermal expansion that is not remarkably large so that the amount of deformation due to heat received in various treatments applied to the substrate P can be substantially ignored. The coefficient of thermal expansion may be set smaller than a threshold value according to the process temperature and the like by mixing an inorganic filler with the resin film, for example. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single-layer body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above-mentioned resin film, foil or the like is attached to the ultra-thin glass. May be

The substrate P configured in this way becomes a supply roll by being wound in a roll shape, and the supply roll is mounted in the device manufacturing system 1. The device manufacturing system 1 with the supply roll mounted thereon repeatedly executes various processes for manufacturing a device on the substrate P sent from the supply roll. Therefore, the processed substrate P is in a state in which a plurality of devices are connected. That is, the substrate P sent out from the supply roll is a substrate for multiple cutting. It should be noted that the substrate P may be one whose surface has been modified and activated in advance by a predetermined pretreatment, or one which has a fine partition structure (concavo-convex structure) for precision patterning formed on the surface.

The processed substrate P is collected as a collecting roll by being wound in a roll shape. The recovery roll is mounted on a dicing device (not shown). The dicing apparatus equipped with the recovery roll divides the processed substrate P into individual devices (dicing) to form a plurality of devices. The dimension of the substrate P is, for example, about 10 cm to 2 m in the width direction (shorter direction) and 10 m or more in the length direction (longer direction). The size of the substrate P is not limited to the above size.

Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process apparatus U1, an exposure apparatus EX, and a process apparatus U2. Note that in FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is a direction from the process device U1 through the exposure device EX to the process device U2 in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X and Y directions.

The process apparatus U1 performs a pre-process (pre-process) on the substrate P exposed by the exposure apparatus EX. The process apparatus U1 sends the preprocessed substrate P to the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.

Here, the photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film). A typical photosensitive functional layer is photoresist, but as a material that does not require development processing, a photosensitive silane coupling material (SAM) that modifies the lyophobic property of a portion exposed to ultraviolet rays, Alternatively, there is a photosensitive reducing material or the like in which a plating reducing group is exposed at a portion irradiated with ultraviolet rays. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion of the substrate P exposed with ultraviolet rays is modified from lyophobic to lyophilic, so that the lyophilic portion of A conductive ink (ink containing conductive nanoparticles such as silver and copper) is selectively applied on the top surface to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, since the plating reducing group is exposed on the pattern portion of the substrate P exposed by the ultraviolet ray, the substrate P is immediately exposed to a plating solution containing palladium ions or the like after the exposure. By immersing in palladium for a certain period of time, a pattern layer of palladium is formed (deposited).

The exposure apparatus EX draws a pattern such as a display circuit or wiring on the substrate P supplied from the process apparatus U1. As will be described later in detail, the exposure apparatus EX exposes the substrate P with a plurality of drawing lines LL1 to LL5 obtained by scanning each of the plurality of drawing beams LB in a predetermined scanning direction.

The process apparatus U2 performs a post-process (post-processing) on the substrate P that has been exposed by the exposure apparatus EX. The substrate P that has been exposed by the exposure apparatus EX is sent to the process apparatus U2. The process unit U2 forms a device pattern layer on the substrate P by performing a predetermined process on the substrate P that has been subjected to the exposure process.

<Exposure device (substrate processing device)>
Subsequently, the exposure apparatus EX will be described with reference to FIGS. 1 to 9. FIG. 2 is a perspective view showing an arrangement of main parts of the exposure apparatus of FIG. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a diagram showing the configuration of the rotary drum and the drawing device of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. FIG. 8 is a perspective view showing a positional relationship among an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG.

As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a raster scan type drawing exposure apparatus, and scans a drawing beam LB in a predetermined scanning direction while transferring the substrate P in the transfer direction. By doing so, drawing is performed on the surface of the substrate P to form a predetermined pattern on the substrate P.

As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11, a substrate transfer mechanism 12, alignment microscopes AM1 and AM2, and a control device 16. The drawing apparatus 11 has a plurality of drawing modules UW1 to UW5, and draws a predetermined pattern on a part of the substrate P transported by the substrate transport mechanism 12 by the plurality of drawing modules UW1 to UW5. The substrate transfer mechanism 12 transfers the substrate P transferred from the process device U1 of the previous process to the process device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) the pattern drawn on the substrate P and the substrate P. The control device 16 controls each unit of the exposure apparatus EX and causes each unit to execute processing. The control device 16 may be a part or all of a higher-level control device that controls the device manufacturing system 1. Further, the control device 16 may be a device that is controlled by a higher-order control device and that is different from the higher-order control device. The control device 16 includes, for example, a computer.

The exposure apparatus EX also includes an apparatus frame 13 (see FIG. 2) that supports the drawing apparatus 11 and the substrate transport mechanism 12, and a rotational position detection mechanism (see FIGS. 4 and 8) 14. Further, a light source device CNT that emits laser light (pulse light) as a drawing beam LB is provided in the exposure apparatus EX. The exposure apparatus EX guides the drawing beam LB emitted from the light source device CNT by the drawing apparatus 11 and projects the drawing beam LB on the substrate P transported by the substrate transport mechanism 12.

As shown in FIG. 1, the exposure apparatus EX is housed in the temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface E of the manufacturing factory via the passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 are provided on the installation surface E and reduce vibration from the installation surface E. The temperature control chamber EVC keeps the inside at a predetermined temperature, thereby suppressing the shape change of the substrate P transported inside due to the temperature.

Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described with reference to FIG. The substrate transport mechanism 12 includes an edge position controller EPC, a drive roller DR4, a tension adjusting roller RT1, a rotary drum (cylindrical drum) DR, a tension adjusting roller RT2, a drive roller DR6, and a drive in order from the upstream side in the transport direction of the substrate P. It has a roller DR7.

The edge position controller EPC adjusts the position in the width direction of the substrate P transported from the process device U1. The edge position controller EPC adjusts the position of the substrate P sent from the process unit U1 in the widthwise end portion (edge) within a range of ±tens of μm to several tens of μm with respect to the target position. Is moved in the width direction to correct the position of the substrate P in the width direction.

The drive roller DR4 rotates while sandwiching both front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotary drum DR by sending the substrate P downstream in the conveyance direction. The rotating drum DR rotates the substrate P around the rotation center line AX2 centering on the rotation center line AX2 extending in the Y direction while supporting the portion of the substrate P to be pattern-exposed on a cylindrical surface, thereby rotating the substrate P. Transport. In order to rotate the rotary drum DR around the rotation center line AX2, shaft portions Sf2 coaxial with the rotation center line AX2 are provided on both sides of the rotation drum DR. A rotational torque from a drive source (not shown) (motor, reduction gear mechanism, etc.) is applied to the shaft portion Sf2. The surface extending in the Z direction passing through the rotation center line AX2 is the center plane p3. The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported by the rotary drum DR. The two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the substrate P transport direction, and give the substrate P after exposure a predetermined slack (play) DL. The drive roller DR6 holds the upstream side of the conveyed substrate P and rotates, and the drive roller DR7 holds and rotates the downstream side of the conveyed substrate P to direct the substrate P to the process apparatus U2. To transport. At this time, since the substrate P is provided with the slack DL, it is possible to absorb a variation in the transport speed of the substrate P that occurs on the downstream side of the drive roller R6 in the transport direction, and an exposure process for the substrate P due to the transport speed variation is performed. The effect of can be cut off.

Therefore, the substrate transport mechanism 12 adjusts the position of the substrate P transported from the process device U1 in the width direction by the edge position roller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction is adjusted to the tension adjusting roller RT1 by the drive roller DR4, and transports the substrate P passing through the tension adjusting roller RT1 to the rotary drum DR. The substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjusting roller RT2 by rotating the rotary drum DR. The substrate transport mechanism 12 transports the substrate P transported to the tension adjusting roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process apparatus U2 while giving the slack DL to the substrate P by the drive roller DR6 and the drive roller DR7.

Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to FIG. In FIG. 2, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is the orthogonal coordinate system similar to FIG. The exposure apparatus EX includes an apparatus frame 13 that supports the drawing apparatus 11 shown in FIG. 1 and the rotary drum DR of the substrate transfer mechanism 12.

The device frame 13 shown in FIG. 2 includes a main body frame 21, a three-point seat (support mechanism) 22, a first optical surface plate 23, a rotation mechanism 24, and a second optical surface plate in order from the lower side in the Z direction. 25 and. The body frame 21 is installed on the installation surface E via the vibration isolation units SU1 and SU2. The body frame 21 rotatably supports the rotating drum DR and the tension adjusting rollers RT1 (not shown) and RT2. The first optical surface plate 23 is provided on the upper side in the vertical direction of the rotary drum DR, and is installed on the main body frame 21 via the three-point seat 22. The three-point seat 22 supports the first optical surface plate 23 at three support points 22a, and the length of each support point 22a in the Z direction can be adjusted. Therefore, the three-point seat 22 can adjust the inclination of the surface of the first optical surface plate 23 with respect to the horizontal plane to a predetermined inclination. During assembly of the device frame 13, the position between the body frame 21 and the three-point seat 22 can be adjusted in the X and Y directions within the XY plane. On the other hand, after the device frame 13 is assembled, the body frame 21 and the three-point seat 22 are fixed (rigid state). In this way, the main body frame 21 and the first optical surface plate 23, which are connected via the three-point seat 22, function as a first support member.

The second optical surface plate 25 is provided above the first optical surface plate 23 in the vertical direction, and is installed on the first optical surface plate 23 via a rotation mechanism 24. The surface of the second optical surface plate 25 is substantially parallel to the surface of the first optical surface plate 23. A plurality of drawing modules UW1 to UW5 of the drawing device 11 are installed on the second optical surface plate 25. The rotating mechanism 24 keeps the surfaces of the first optical surface plate 23 and the second optical surface plate 25 substantially parallel to each other, and rotates the first optical surface plate 23 about a predetermined rotation axis I extending in the vertical direction. On the other hand, the second optical surface plate 25 is rotated. The rotation axis I extends in the vertical direction in the center plane p3 and passes through a predetermined point in the surface of the substrate P wound around the rotating drum DR (the drawing surface curved following the circumferential surface). (See Figure 3). Then, the rotation mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23 to adjust the positions of the plurality of drawing modules UW1 to UW5 with respect to the substrate P wound around the rotating drum DR. be able to.

Subsequently, the light source device CNT will be described with reference to FIGS. 1 and 5. The light source device CNT is installed on the main body frame 21 of the device frame 13. The light source device CNT emits a laser beam as the drawing beam LB projected on the substrate P. The light source device CNT has a light source that emits light in a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P and light in the ultraviolet range having a strong photoactive action. Examples of the light source include a laser light source that emits a YAG third harmonic laser light (wavelength 355 nm), or a wavelength conversion element (harmonic wave) after amplifying seed light in the infrared wavelength range from a semiconductor laser light source with a fiber amplifier. A fiber amplifier laser light source that emits laser light in the ultraviolet wavelength range of 400 nm or less can be used. In that case, the emitted ultraviolet laser light may be continuous oscillation, or may be pulsed laser light that oscillates at a frequency of 100 MHz or more with a light emission time per pulse of several tens of picoseconds or less. In addition, examples of the light source include a lamp light source such as a mercury lamp having a bright line in the ultraviolet region (g line, h line, i line, etc.), a laser diode having an oscillation peak in the ultraviolet region of a wavelength of 450 nm or less, a light emitting diode (LED). ) Or the like, or a gas laser light source that generates KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), XeCl excimer laser light (wavelength 308 nm), etc. that oscillates deep ultraviolet light (DUV light). Is available.

Here, the drawing beam LB emitted from the light source device CNT enters a polarization beam splitter PBS described later. It is preferable that the drawing beam LB is a light beam in which the incident drawing beam LB is almost entirely reflected by the polarization beam splitter PBS in order to suppress energy loss due to separation of the drawing beam LB by the polarization beam splitter PBS. .. The polarization beam splitter PBS reflects an S-polarized linearly polarized light beam and transmits a P-polarized linearly polarized light beam. Therefore, in the light source device CNT, it is preferable that the drawing beam LB that enters the polarization beam splitter PBS emits a laser beam that is a linearly polarized (S-polarized) light beam. Further, since the laser light has a high energy density, the illuminance of the light flux projected on the substrate P can be appropriately secured.

Next, the drawing device 11 of the exposure apparatus EX will be described. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing modules UW1 to UW5. The drawing apparatus 11 splits a plurality of drawing beams LB emitted from the light source device CNT into a plurality of drawing beams LB, and a plurality of (for example, five in the first embodiment) drawing lines on the substrate P. Scanning is performed along each of LL1 to LL5. Then, the drawing apparatus 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning a plurality of drawing beams LB by the drawing device 11 will be described.

As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotation direction. Even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged on the substrate P on the downstream side in the rotation direction.

The drawing lines LL1 to LL5 are formed along the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary drum DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 has a minimum joint error of the patterns obtained by the plurality of drawing lines LL1 to LL5 when the substrate P is carried by the substrate carrying mechanism 12 at the reference speed. It is slightly tilted by a predetermined angle with respect to the rotation center line AX2 of the rotary drum DR.

The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the direction (axial direction) in which the rotation center line AX2 of the rotary drum DR extends. The even-numbered second drawing line LL2 and fourth even drawing line LL4 are arranged at a predetermined interval in the axial direction of the rotary drum DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. The first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width of the exposure area A7 drawn on the substrate P in the width direction (axial direction).

The scanning direction of the drawing beam LB that is scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction, and is the same direction. Further, the scanning direction of the drawing beam LB that is scanned along the even-numbered second drawing line LL2 and fourth drawing line LL4 is a one-dimensional direction, and is the same direction. At this time, the scanning direction of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 are It is in the opposite direction. Therefore, when viewed from the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL1, LL3, LL5 are adjacent to the drawing start positions of the even-numbered drawing lines LL2, LL4, and similarly, The drawing end positions of the drawing lines LL1, LL3, and LL5 are adjacent to the drawing end positions of the even-numbered drawing lines LL2 and LL4.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing apparatus 11 performs calibration by using the plurality of drawing modules UW1 to UW5 described above, the beam distribution optical system SL that branches the drawing beam LB from the light source device CNT to guide the plurality of drawing modules UW1 to UW5. It has a calibration detection system 31.

The beam distribution optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of beams, and guides the plurality of branched drawing beams LB to the plurality of drawing modules UW1 to UW5, respectively. The beam distribution optical system SL irradiates the first optical system 41 that splits the drawing beam LB emitted from the light source device CNT into two, and the second drawing beam LB that is branched by the first optical system 41. It has an optical system 42 and a third optical system 43 which is irradiated with the other drawing beam LB branched by the first optical system 41. Further, the beam distribution optical system SL includes an XY herbing adjustment mechanism 44 and an XY herbing adjustment mechanism 45. A part of the beam distribution optical system SL on the light source device CNT side is installed on the main body frame 21, while another part on the drawing module UW1 to UW5 side is installed on the second optical surface plate 25.

The first optical system 41 includes a half-wave plate 51, a polarizing mirror 52, a beam diffuser 53, a first reflecting mirror 54, a first relay lens 55, a second relay lens 56, and a second reflecting mirror. 57, a third reflecting mirror 58, a fourth reflecting mirror 59, and a first beam splitter 60.

The drawing beam LB emitted from the light source device CNT in the +X direction is applied to the ½ wavelength plate 51. The half-wave plate 51 is rotatable within the irradiation surface of the drawing beam LB. The drawing beam LB emitted to the half-wave plate 51 has a polarization direction that is a predetermined polarization direction according to the rotation amount of the half-wave plate 51. The drawing beam LB that has passed through the half-wave plate 51 is applied to the polarization mirror (deflection beam splitter) 52. The polarization mirror 52 transmits the drawing beam LB having a predetermined polarization direction, and reflects the drawing beam LB other than the predetermined polarization direction in the +Y direction. Therefore, since the drawing beam LB reflected by the polarization mirror 52 passes through the half-wave plate 51, the half-wave plate 51 and the polarization mirror 52 cooperate with each other to cause the half-wave plate 51 to travel. The beam intensity depends on the rotation amount of. That is, the beam intensity of the drawing beam LB reflected by the polarization mirror 52 can be adjusted by rotating the half-wave plate 51 and changing the polarization direction of the drawing beam LB.

The drawing beam LB that has passed through the polarization mirror 52 is applied to the beam diffuser 53. The beam diffuser 53 absorbs the drawing beam LB, and prevents the drawing beam LB emitted to the beam diffuser 53 from leaking to the outside. The drawing beam LB reflected in the +Y direction by the polarization mirror 52 is applied to the first reflection mirror 54. The drawing beam LB emitted to the first reflection mirror 54 is reflected in the +X direction by the first reflection mirror 54, and is emitted to the second reflection mirror 57 via the first relay lens 55 and the second relay lens 56. .. The drawing beam LB applied to the second reflection mirror 57 is reflected in the −Y direction by the second reflection mirror 57 and applied to the third reflection mirror 58. The drawing beam LB applied to the third reflection mirror 58 is reflected in the −Z direction by the third reflection mirror 58 and applied to the fourth reflection mirror 59. The drawing beam LB applied to the fourth reflection mirror 59 is reflected in the +Y direction by the fourth reflection mirror 59 and applied to the first beam splitter 60. The drawing beam LB emitted to the first beam splitter 60 is partially reflected in the −X direction and is emitted to the second optical system 42, while the other portion is transmitted and is transmitted to the third optical system 43. Is irradiated.

Here, the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I of the rotation mechanism 24 with a predetermined interval. The configuration up to the light source device CNT including the third reflection mirror 58 (the portion surrounded by the chain double-dashed line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side, while the fourth reflection mirror is provided. A plurality of drawing modules UW1 to UW5 including 59 (a portion surrounded by a chain double-dashed line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the rotation mechanism 24, the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I. Therefore, the optical path of the drawing beam LB is not changed. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the rotation mechanism 24, the drawing beam LB emitted from the light source device CNT installed on the main body frame 21 side is emitted by the second optical surface plate 23. It is possible to suitably guide the plurality of drawing modules UW1 to UW5 installed on the surface plate 25 side.

The second optical system 42 branches and guides one of the drawing beams LB branched by the first optical system 41 toward odd-numbered drawing modules UW1, UW3, and UW5 described later. The second optical system 42 has a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

The drawing beam LB reflected in the −X direction by the first beam splitter 60 of the first optical system 41 is applied to the fifth reflection mirror 61. The drawing beam LB applied to the fifth reflection mirror 61 is reflected in the −Y direction by the fifth reflection mirror 61 and applied to the second beam splitter 62. A part of the drawing beam LB irradiated on the second beam splitter 62 is reflected and is irradiated onto one odd-numbered drawing module UW5 (see FIG. 5). The other part of the drawing beam LB irradiated on the second beam splitter 62 is transmitted and is irradiated on the third beam splitter 63. A part of the drawing beam LB emitted to the third beam splitter 63 is reflected and is applied to one odd-numbered drawing module UW3 (see FIG. 5). The drawing beam LB applied to the third beam splitter 63 is transmitted through a part of the other part and is applied to the sixth reflection mirror 64. The drawing beam LB applied to the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and applied to one drawing module UW1 of odd number (see FIG. 5). In the second optical system 42, the drawing beam LB irradiated on the odd-numbered drawing modules UW1, UW3, UW5 is slightly inclined with respect to the −Z direction (Z axis).

The third optical system 43 branches and guides the other drawing beam LB branched by the first optical system 41 toward even-numbered drawing modules UW2 and UW4 described later. The third optical system 43 has a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

The drawing beam LB transmitted in the Y direction by the first beam splitter 60 of the first optical system 41 is applied to the seventh reflection mirror 71. The drawing beam LB applied to the seventh reflection mirror 71 is reflected in the X direction by the seventh reflection mirror 71 and applied to the eighth reflection mirror 72. The drawing beam LB applied to the eighth reflection mirror 72 is reflected in the −Y direction by the eighth reflection mirror 72 and applied to the fourth beam splitter 73. A part of the drawing beam LB irradiated on the fourth beam splitter 73 is reflected and is irradiated on one even-numbered drawing module UW4 (see FIG. 5). The drawing beam LB emitted to the fourth beam splitter 73 is transmitted through a part of the other portion and is emitted to the ninth reflection mirror 74. The drawing beam LB applied to the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74 and applied to one even-numbered drawing module UW2. Also in the third optical system 43, the drawing beam LB irradiated on the even-numbered drawing modules UW2 and UW4 is slightly inclined with respect to the −Z direction (Z axis).

In this way, in the beam distribution optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of beams toward the plurality of drawing modules UW1 to UW5. At this time, in the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73, the beam intensities of the drawing beams LB with which the plurality of drawing modules UW1 to UW5 are irradiated have the same intensity. Thus, the reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the writing beam LB.

The XY herbing adjustment mechanism 44 is arranged between the second relay lens 56 and the second reflection mirror 57. The XY herbing adjustment mechanism 44 adjusts all of the drawing lines LL1 to LL5 formed on the substrate P so that they can be moved slightly within the drawing surface of the substrate P. The XY herb adjusting mechanism 44 is composed of a transparent parallel flat plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass plate that can be tilted in the YZ plane of FIG. By adjusting the respective inclination amounts of the two parallel flat plate glasses, the drawing lines LL1 to LL5 formed on the substrate P can be slightly shifted in the X direction and the Y direction.

The XY herbing adjustment mechanism 45 is arranged between the seventh reflection mirror 71 and the eighth reflection mirror 72. The XY herbing adjustment mechanism 45 adjusts the even-numbered second drawing line LL2 and fourth drawing line LL4 of the drawing lines LL1 to LL5 formed on the substrate P so that they can be finely moved within the drawing surface of the substrate P. To do. Similar to the XY herbing adjusting mechanism 44, the XY harbing adjusting mechanism 45 includes a transparent parallel flat plate glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat plate glass that can be tilted in the YZ plane of FIG. Composed. By adjusting the respective inclination amounts of the two parallel flat plate glasses, the drawing lines LL2 and LL4 formed on the substrate P can be slightly shifted in the X direction and the Y direction.

Subsequently, the plurality of drawing modules UW1 to UW5 will be described with reference to FIGS. 4, 5, and 7. The plurality of drawing modules UW1 to UW5 are provided according to the plurality of drawing lines LL1 to LL5. The plurality of drawing modules UW1 to UW5 are respectively irradiated with the plurality of drawing beams LB branched by the beam distribution optical system SL. The drawing modules UW1 to UW5 guide the plurality of drawing beams LB to the drawing lines LL1 to LL5, respectively. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 direct the drawing beam LB to the second to fifth drawing lines LL2 to LL5. Lead to. As shown in FIG. 4 (and FIG. 1), the plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The plurality of drawing modules UW1 to UW5 have the first drawing on the side where the first, third and fifth drawing lines LL1, LL3, LL5 are arranged (the −X direction side in FIG. 5) with the center plane p3 interposed therebetween. A module UW1, a third drawing module UW3 and a fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at predetermined intervals in the Y direction. Further, the plurality of drawing modules UW1 to UW5 sandwich the center plane p3, and on the side where the second and fourth drawing lines LL2 and LL4 are arranged (+X direction side in FIG. 5), the second drawing module UW2 and 4 drawing module UW4 is arranged. The second drawing module UW2 and the fourth drawing module UW4 are arranged at predetermined intervals in the Y direction. At this time, the second drawing module UW2 is located between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is located between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is located between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. Further, as shown in FIG. 4, the first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5, and the second drawing module UW2 and the fourth drawing module UW4 have a center plane p3 when viewed from the Y direction. It is symmetrically arranged in the center.

Next, the drawing modules UW1 to UW5 will be described with reference to FIG. Since the drawing modules UW1 to UW5 have the same configuration, the first drawing module UW1 (hereinafter simply referred to as the drawing module UW1) will be described as an example.

The drawing module UW1 shown in FIG. 4 scans the drawing beam LB along the drawing line LL1 (first drawing line LL1), an optical deflector 81, a polarization beam splitter PBS, and a quarter wavelength plate 82. The scanner 83, the bending mirror 84, a telecentric f-θ lens system 85, and a Y magnification correction optical member 86 are provided. Further, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The optical deflector 81 uses, for example, an acousto-optic modulator (AOM). The light deflector 81 is switched ON/OFF by the control device 16 to switch projection/non-projection of the drawing beam LB onto the substrate P at high speed. Specifically, the light deflector 81 is irradiated with the drawing beam LB from the beam distribution optical system SL via the relay lens 91 in the second optical system 42 with a slight inclination with respect to the −Z direction. It When the light deflector 81 is switched to OFF, the drawing beam LB moves straight in a tilted state, and is shielded by a light shielding plate 92 provided at the end passing through the light deflector 81. On the other hand, when the optical deflector 81 is switched to ON, the drawing beam LB entering the optical deflector 81 becomes a first-order diffracted beam and is deflected in the −Z direction, and is emitted from the optical deflector 81. The polarized beam splitter PBS provided on the Z direction of the optical deflector 81 is irradiated. Therefore, the optical deflector 81 projects the writing beam LB onto the substrate P when switched on, and puts the writing beam LB onto the substrate P in a non-projected state when switched off.

The deflection beam splitter PBS reflects the drawing beam LB emitted from the optical deflector 81 via the relay lens 93. On the other hand, the deflecting beam splitter PBS cooperates with the quarter-wave plate 82 provided between the deflecting beam splitter PBS and the scanner 83 to irradiate the drawing beam LB (spot light) on the substrate P (or the rotation). The reflected light generated on the outer peripheral surface of the drum DR is transmitted. In other words, the drawing beam LB emitted from the optical deflector 81 to the polarization beam splitter PBS is laser light that is linearly polarized S polarization and is reflected by the polarization beam splitter PBS. Further, the drawing beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82, is irradiated to the substrate P, and passes through the quarter-wave plate 82 from the substrate P again, so that the P-polarized light is converted. The laser light becomes linearly polarized light. Therefore, the reflected light generated from the substrate P (or the outer peripheral surface of the rotary drum DR) and applied to the polarization beam splitter PBS passes through the polarization beam splitter PBS. The reflected light that has passed through the polarization beam splitter PBS is applied to the calibration detection system 31 via the relay lens 94. On the other hand, the drawing beam LB reflected by the deflecting beam splitter PBS passes through the quarter-wave plate 82 and is applied to the scanner 83.

As shown in FIGS. 4 and 7, the scanner 83 has a reflection mirror 96, a rotating polygon mirror (rotating polygonal mirror) 97, and an origin detector 98. The drawing beam LB that has passed through the quarter-wave plate 82 is applied to the reflection mirror 96 via the relay lens 95. The drawing beam LB reflected by the reflection mirror 96 is directed to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces (e.g., eight surfaces) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 is rotated about the rotation axis 97a in a predetermined rotation direction to continuously change the reflection angle of the drawing beam LB irradiated on the reflecting surface 97b, whereby the reflected drawing beam LB is reflected. Are scanned along the drawing line LL1 on the substrate P. The drawing beam LB reflected by the rotating polygon mirror 97 is applied to the folding mirror 84. The origin detector 98 detects the origin of the drawing beam LB that scans along the drawing line LL1 on the substrate P. The origin detector 98 is arranged on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each reflection surface 97b interposed therebetween. Therefore, the origin detector 98 detects the drawing beam LB before being irradiated on the f-θ lens system 85. That is, the origin detector 98 detects the passage of the drawing beam LB at a timing immediately before the irradiation of the drawing start position of the drawing line LL1 on the substrate P.

The drawing beam LB emitted from the scanner 83 to the bending mirror 84 is reflected by the bending mirror 84 and is applied to the f-θ lens system 85. The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing beam LB reflected from the rotating polygon mirror 97 via the bending mirror 84 perpendicularly to the drawing surface of the substrate P. At this time, each reflecting surface 97b of the rotating polygon mirror 97 and the drawing surface of the substrate P are optically conjugate with each other in the sub-scanning direction (long direction of the substrate P) orthogonal to the drawing line LL1. A cylindrical lens (not shown) is arranged in each of the optical path of the drawing beam LB toward the rotating polygon mirror 97 and the optical path of the drawing beam LB emitted from the f-θ lens system 85. Cooperating face tilt correction optics are also provided.

Here, as shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 have a left-right symmetrical configuration with the center plane p3 interposed therebetween. Among the plurality of scanners 83, the three scanners 83 corresponding to the drawing modules UW1, UW3, UW5 are arranged on the upstream side (the -X direction side in FIG. 7) in the rotation direction of the rotary drum DR, and the drawing modules UW2, Two scanners 83 corresponding to UW4 are arranged on the downstream side (the +X direction side in FIG. 7) in the rotation direction of the rotating drum DR. The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 interposed therebetween. At this time, the respective scanners 83 arranged on the upstream side and the respective scanners 83 arranged on the downstream side are configured to be 180° point symmetrical with respect to the rotation axis I. For this reason, when the drawing beam LB is irradiated to the rotating polygon mirror 97 while the three rotating polygon mirrors 97 on the upstream side rotate counterclockwise (counterclockwise in the XY plane), they are reflected by the rotating polygon mirror 97. The drawing beam LB is scanned in a predetermined scanning direction (for example, +Y direction in FIG. 7) from the drawing start position to the drawing end position. On the other hand, when the rotary polygon mirror 97 is irradiated with the drawing beam LB while the two rotary polygon mirrors 97 on the downstream side rotate counterclockwise, the drawing beam LB reflected by the rotary polygon mirror 97 is moved to the drawing start position. From the direction toward the drawing end position, scanning is performed in the scanning direction (for example, the −Y direction in FIG. 7) opposite to the three rotating polygon mirrors 97 on the upstream side.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB that reaches the substrate P from the odd-numbered drawing modules UW1, UW3, UW5 is in a direction that coincides with the installation azimuth line Le1. That is, the installation azimuth line Le1 is a line that connects the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing modules UW2, UW4 is in the direction coinciding with the installation azimuth line Le2. That is, the installation azimuth line Le2 is a line that connects the even-numbered drawing lines LL2, LL4 and the rotation center line AX2 in the XZ plane.

The Y magnification correction optical member 86 is disposed between the f-θ lens system 85 and the substrate P. The Y-magnification correction optical member 86 enlarges or reduces the dimension in the Y direction of the drawing lines LL1 to LL5 formed by the drawing modules UW1 to UW5 by a very small amount.

In the drawing apparatus 11 configured as described above, each part is controlled by the control device 16 so that a predetermined pattern is drawn on the substrate P. That is, the control device 16 controls the optical deflector based on the CAD information (for example, bitmap format) of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. The drawing beam LB is deflected by ON/OFF modulating 81 to draw a pattern on the photosensitive layer of the substrate P. Further, the control device 16 synchronizes the scanning direction of the drawing beam LB that scans along the drawing line LL1 with the movement of the substrate P in the transport direction due to the rotation of the rotating drum DR, so that the drawing line in the exposure area A7. A predetermined pattern is drawn on the portion corresponding to LL1.

At this time, the size (spot diameter) of the drawing beam LB projected from each of the drawing modules UW1 to UW5 on the substrate P is D (μm), and the scanning speed of the drawing beam LB along the drawing lines LL1 to LL5 is V (μm). /Sec), when the light source device CNT is a pulsed laser light source, the light emission repetition period T (seconds) of pulsed light has a relationship of T<D/V.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 8. The alignment microscopes AM1 and AM2 detect alignment marks formed in advance on the substrate P or reference marks or reference patterns formed on the rotary drum DR. Hereinafter, the alignment mark on the substrate P and the reference mark or reference pattern on the rotating drum DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used for aligning (aligning) the substrate P and a predetermined pattern drawn on the substrate P, and for calibrating the rotary drum DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 formed by the drawing device 11 in the rotation direction of the rotary drum DR. Further, the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.

The alignment microscopes AM1 and AM2 project the illumination light onto the substrate P or the rotary drum DR, and also the objective lens system GA as a detection probe for injecting the light generated by the mark, and the image of the mark received through the objective lens system GA. An image pickup system GD for picking up a (brightfield image, darkfield image, fluorescent image, etc.) with a two-dimensional CCD, CMOS or the like. In addition, the illumination light for alignment is light in a wavelength range having almost no sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

A plurality of (for example, three) alignment microscopes AM1 are arranged in a line in the Y direction (width direction of the substrate P). Similarly, a plurality of (for example, three) alignment microscopes AM2 are arranged in a line in the Y direction (width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

For the sake of clarity, FIG. 3 shows the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2. As shown in FIG. 3, the observation regions Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are parallel to the rotation center line AX2 in the Y direction. Are arranged at predetermined intervals. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, as shown in FIG. 3, the observation regions Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) by each objective lens system GA of the three alignment microscopes AM2 are parallel to the rotation center line AX2. Are arranged at predetermined intervals in the direction. As shown in FIG. 8, the optical axes La4 to La6 of the objective lens systems GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary drum DR.

The observation regions Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set on the substrate P or the rotating drum DR in a range of, for example, about 200 to 500 μm square. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set in the same direction as the installation azimuth line Le3 extending from the rotation center line AX2 in the radial direction of the rotary drum DR. It That is, the installation azimuth line Le3 is a line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are set in the same direction as the installation azimuth line Le4 extending from the rotation center line AX2 in the radial direction of the rotary drum DR. It That is, the installation azimuth line Le4 is a line connecting the observation regions Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG. At this time, since the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2, the angle formed by the center plane p3 and the installation azimuth line Le3 is the center plane p3. It is larger than the angle formed by the installation azimuth line Le4.

On the substrate P, as shown in FIG. 3, exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter abbreviated as marks) for alignment are formed in a cross shape, for example.

In FIG. 3, marks Ks1 are provided in the −Y side peripheral region of the exposure region A7 at regular intervals in the X direction, and marks Ks3 are provided in the +Y side peripheral region of the exposure region A7 and constant in the X direction. It is provided at intervals. Further, the mark Ks2 is provided at the center in the Y direction in the blank area between the two exposure areas A7 adjacent in the X direction.

Then, the mark Ks1 is sequentially captured while the substrate P is being sent in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and in the observation area Vw4 of the objective lens system GA of the alignment microscope AM2. Is formed. Further, the marks Ks3 are sequentially captured while the substrate P is being sent in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and the observation area Vw6 of the objective lens system GA of the alignment microscope AM2. Is formed. Further, the marks Ks2 are sequentially captured in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being sent. Is formed.

Therefore, of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 on both sides of the rotary drum DR in the Y direction constantly observe or detect the marks Ks1 and Ks3 formed on both sides of the substrate P in the width direction. be able to. Further, among the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 at the center of the rotary drum DR in the Y direction are marks formed in a margin between the exposure areas A7 drawn on the substrate P and the like. Ks2 can be constantly observed or detected.

Here, since the exposure apparatus EX uses the so-called multi-beam type drawing apparatus 11, a plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5. In order to properly splice the image in the Y direction, it is necessary to perform calibration for suppressing the splicing accuracy by the plurality of drawing modules UW1 to UW5 within the allowable range. Further, the relative arrangement relationship (or the amount of error with respect to the designed arrangement interval) of the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 is the same as the baseline. It is called, and the relative arrangement relation and the amount of error need to be precisely obtained by the baseline management. Calibration is also necessary for the baseline management.

In the calibration for confirming the splicing accuracy by the plurality of drawing modules UW1 to UW5 and the calibration for the baseline management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotary drum DR supporting the substrate P is used. It is necessary to provide a reference mark and a reference pattern. Therefore, as shown in FIG. 9, the exposure apparatus EX uses a rotary drum DR having a reference mark or a reference pattern on the outer peripheral surface.

The rotary drum DR has scale parts GPa and GPb forming a part of a rotational position detection mechanism 14 described later on both ends of its outer peripheral surface. In addition, the rotary drum DR is provided with narrower restriction bands CLa and CLb formed by concave grooves or convex rims inside the scale parts GPa and GPb over the entire circumference. The width of the substrate P in the Y direction is set to be smaller than the distance between the two regulation bands CLa and CLb in the Y direction, and the substrate P is sandwiched between the regulation bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is supported in close contact with the inner area.

The rotating drum DR has a plurality of line patterns RL1 tilted at +45 degrees with respect to the rotation center line AX2 and tilted at −45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched between the regulation bands CLa and CLb. A mesh-shaped reference pattern (also usable as a reference mark) RMP in which a plurality of line patterns RL2 are repeatedly engraved at constant pitches (cycles) Pf1 and Pf2 is provided.

The reference pattern RMP is a diagonal pattern (diagonal grid pattern) that is uniform over the entire surface so that the frictional force and the tension of the substrate P do not change at the portion where the substrate P and the outer peripheral surface of the rotating drum DR are in contact with each other. There is. The line patterns RL1 and RL2 do not necessarily need to be inclined at 45 degrees, and may be a vertical and horizontal mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Further, it is not necessary to intersect the line patterns RL1 and RL2 at 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is other than a square (or a rectangle). The line patterns RL1 and RL2 may intersect with each other at an angle that forms a rhombus.

Next, the rotational position detection mechanism 14 will be described with reference to FIGS. 3, 4, and 8. As shown in FIG. 8, the rotational position detection mechanism 14 optically detects the rotational position of the rotary drum DR, and an encoder system using, for example, a rotary encoder is applied. The rotational position detection mechanism 14 includes scale portions (indexes) GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads (reading heads) EN1, EN2, EN3 facing the scale portions GPa and GPb, respectively. With EN4. 4 and 8, only four encoder heads EN1, EN2, EN3, EN4 facing the scale part GPa are shown, but similar encoder heads EN1, EN2, EN3, EN4 also face the scale part GPb. Are arranged (see FIG. 10).

The scale parts GPa and GPb are each formed in an annular shape over the entire outer peripheral surface of the rotary drum DR in the circumferential direction. The scales of the scale parts GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as an incremental type scale. .. Therefore, the scale parts GPa and GPb rotate integrally with the rotating drum DR around the rotation center line AX2.

The substrate P is configured to be wound inside the scale drums GPa and GPb at both ends of the rotary drum DR, that is, inside the regulation bands CLa and CLb. When a strict arrangement relationship is required, the outer peripheral surfaces of the scale parts GPa, GPb and the outer peripheral surface of the portion of the substrate P wound around the rotating drum DR are set to be the same surface (the same radius from the center line AX2). To do. For that purpose, the outer peripheral surfaces of the scale parts GPa and GPb may be made higher in the radial direction by the thickness of the substrate P than the outer peripheral surface of the rotary drum DR for winding the substrate. Therefore, the outer peripheral surfaces of the scale parts GPa and GPb formed on the rotary drum DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial position as the drawing surface on the substrate P wound around the rotating drum DR, and the measurement position and the processing position are different from each other. It is possible to reduce the Abbe error caused by the difference in the radial direction of the rotating system.

The encoder heads EN1, EN2, EN3, EN4 are respectively arranged around the scale parts GPa, GPb as viewed from the rotation center line AX2, and are at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN1, EN2, EN3, EN4 are connected to the control device 16. The encoder heads EN1, EN2, EN3, EN4 project a light beam for measurement toward the scale parts GPa, GPb, and photoelectrically detect the reflected light flux (diffracted light), so that the scale parts GPa, GPb are circumferentially oriented. A detection signal (for example, a two-phase signal having a phase difference of 90 degrees) according to the change in position of is output to the control device 16. The control device 16 interpolates and digitally processes the detection signals (two-phase signals) from each of the encoder heads EN1 to EN4 by a counter circuit (not shown), thereby changing the angle of the rotary drum DR, that is, the encoder head. It is possible to measure the position change in the circumferential direction of the outer peripheral surface of the rotary drum DR at each installation position of EN1 to EN4 with submicron resolution. At this time, the control device 16 can also measure the transport speed of the substrate P on the rotary drum DR and the movement amount in the circumferential direction from the change in the angle of the rotary drum DR.

Further, as shown in FIGS. 4 and 8, the encoder head EN1 is arranged on the installation azimuth line Le1. The installation azimuth line Le1 is a line connecting the rotation center line AX2 and the projection area (detection position) of the measurement light beam on the scale portion GPa (GPb) by the encoder head EN1 in the XZ plane. Further, as described above, the installation azimuth line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 have the same azimuth line.

Similarly, as shown in FIGS. 4 and 8, the encoder head EN2 is arranged on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting the rotation center line AX2 and the projection area of the measurement light beam by the encoder head EN2 onto the scale portion GPa (GPb) in the XZ plane. Further, as described above, the installation azimuth line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 have the same azimuth line.

Further, as shown in FIGS. 4 and 8, the encoder head EN3 is arranged on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting the rotation center line AX2 and the projection area of the measurement light beam by the encoder head EN3 onto the scale portion GPa (GPb) in the XZ plane. Further, as described above, the installation azimuth line Le3 is a line connecting the observation regions Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 have the same azimuth line.

Similarly, as shown in FIGS. 4 and 8, the encoder head EN4 is arranged on the installation azimuth line Le4. The installation azimuth line Le4 is a line that connects the rotation center line AX2 and the projection area of the measurement light beam by the encoder head EN4 onto the scale portion GPa (GPb) in the XZ plane. Further, as described above, the installation azimuth line Le4 is a line connecting the observation regions Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation regions Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 have the same azimuth line.

When the installation azimuths of the encoder heads EN1, EN2, EN3, EN4 (angle directions in the XZ plane about the rotation center line AX2) are represented by installation azimuth lines Le1, Le2, Le3, Le4, as shown in FIG. , The plurality of drawing modules UW1 to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 form an angle of ±θ° with respect to the center plane P3.

Here, the control device 16 detects the rotation angle positions of the scale parts (rotating drums DR) GPa, GPb by the encoder heads EN1, EN2, and specifies the moving position of the substrate P based on the detected rotation angle positions, Drawing control is performed by the odd-numbered and even-numbered drawing modules UW1 to UW5. That is, the control device 16 performs ON/OFF modulation of the optical deflector 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. However, by performing the ON/OFF modulation timing by the optical deflector 81 based on the detected rotation angle position (moving position of the substrate P), a pattern can be accurately drawn on the photosensitive layer of the substrate P. You can

Further, the control device 16 rotates the scale parts GPa and GPb (rotating drum DR) detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. By storing the angular position, the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angular position of the rotary drum DR can be obtained. Similarly, the control device 16 rotates the scale parts GPa, GPb (rotating drum DR) detected by the encoder heads EN3, EN4 when the reference pattern RMP on the rotating drum DR is detected by the alignment microscopes AM1, AM2. By storing the angular position, the correspondence between the position of the reference pattern RMP on the rotary drum DR and the rotational angular position of the rotary drum DR can be obtained. In this way, the alignment microscopes AM1 and AM2 can precisely measure the rotation angle position (or the circumferential position) of the rotating drum DR at the moment of sampling the marks within the observation regions Vw1 to Vw6. Then, in the exposure apparatus EX, based on this measurement result, the substrate P and a predetermined pattern drawn on the substrate P are aligned (aligned), or the rotary drum DR and the drawing apparatus 11 are calibrated. To do.

By the way, in the multi-beam type exposure apparatus EX, while the substrate P is transported by the rotary drum DR in the transport direction (long direction), the rendering beam LB is scanned along the plurality of rendering lines LL1 to LL5 on the substrate P. It Here, the substrate P is wound around a part of the outer peripheral surface of the rotary drum DR and conveyed, but due to the influence of vibration and the like due to the rotation of the rotary drum DR, the positional relationship between the rotary drum DR and the second optical surface plate 25. May be relatively displaced. The displacement of the positional relationship between the rotary drum DR and the second optical surface plate 25 is, for example, that the rotation center line AX2 of the rotary drum DR is tilted with respect to the Y direction in the XY plane. In this case, since the position of the rotary drum DR is displaced, the relative positional relationship between the substrate P wound around the rotary drum DR and the drawing device 11 installed on the second optical surface plate 25 is suitable for exposure. It is displaced from a predetermined relative arrangement relationship (initial setting state). Therefore, in the exposure apparatus EX of the first embodiment, the encoder heads EN1 to EN4 are attached as shown in FIG. 10 in order to measure the relative positional relationship between the rotary drum DR and the drawing apparatus 11. ..

FIG. 10 is a plan view showing the arrangement of encoder heads of the exposure apparatus of FIG. As shown in FIG. 10, the encoder heads (first detection devices) EN1 and EN2 are attached to the second optical surface plate 25 via the attachment member 100. On the other hand, the encoder heads (second detection devices) EN3 and EN4 are attached to the main body frame 21 via the attachment member 101, and the alignment microscopes AM1 and AM2 are also attached to the main body frame 21. A pair of encoder heads EN1 and EN2 are provided corresponding to a pair of scale parts GPa and GPb provided on both sides of the rotation center line AX2 of the rotary drum DR. Therefore, the pair of encoder heads EN1 and EN2 detect the respective rotational positions of the scale parts GPa and GPb.

Further, between the first optical surface plate 23 and the second optical surface plate 25, a rotation amount measuring device 105 that measures the amount of rotation by the rotation mechanism 24 is provided. The rotation amount measuring device 105 uses, for example, a linear encoder, and is arranged on the side far from the rotation axis I such that the direction of linear movement is along the circumferential direction of the rotation axis I. The control device 16 detects the rotation amount of the second optical surface plate 25 with respect to the first optical surface plate 23 based on the minute movement amount of the rotation axis I in the circumferential direction detected by the rotation amount measuring device 105. The rotation mechanism 24 includes a drive unit 106, and the drive unit 106 is driven and controlled by the control device 16 to rotate the second optical surface plate 25. At this time, the control device 16 controls the drive of the drive unit 106 so that the rotation amount detected by the rotation amount measuring device 105 becomes a predetermined rotation amount, and rotates the second optical surface plate 25. There is.

FIG. 11 is a plan view illustrating a case where the rotary drum DR and the drawing device 11 (particularly, the second optical surface plate 25) in the configuration of FIG. 10 relatively minutely rotate in the XY plane. As shown in FIG. 11, the rotation center line AX2 of the rotary drum DR extends in the Y direction, and when the rotation center line AX2 is exactly parallel to the Y axis of the stationary coordinate system XYZ, the rotation center line AX2 is the reference. Suppose it is in a position. Here, it is assumed that the rotation center line AX2 is tilted by a predetermined angle θ _z from the reference position in the XY plane due to the influence of floor vibration, vibration from a drive source in the apparatus, and the like. In FIG. 11, the counterclockwise displacement is +θ _z and the clockwise displacement is −θ _z . In the XY plane, when the rotation center line AX2 is tilted by a predetermined angle from the reference position, one end of the rotary drum DR in the axial direction moves in a predetermined direction (for example, the -X direction in FIG. 11), The other end of the rotary drum DR in the axial direction moves in the direction opposite to the one end of the rotary drum DR (for example, the +X direction in FIG. 11 ).

For this reason, in the pair of encoder heads EN1 and EN2, the rotational position detected by the encoder heads EN1 and EN2 on the scale part GPa side (the scale part) by rotating the rotation center line AX2 from the reference position by a predetermined angle θ _z. A difference according to the angle θ _z occurs between the moving position of GPa) and the rotational position detected by the encoder heads EN1 and EN2 on the scale portion GPb side (the moving position of the scale portion GPb). Therefore, the control device 16 can detect the tilt angle θ _z of the rotation center line AX2 of the rotary drum DR in the XY plane based on the rotation positions detected by the pair of encoder heads EN1 and EN2. Specifically, the count value (moving position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN1 on the scale section GPa side is counted by the counter circuit corresponding to the CD1a and the encoder head EN1 on the scale section GPb side. When the count value (moving position of the scale GPb) is set to CD1b, the difference value between the count value CD1a and the count value CD1b is changed every time the rotating drum DR (scale part GPa, GPb) rotates by a certain angle or at a constant value. It is possible to measure the inclination variation (angle θ _z ) in the XY plane of the rotation center line AX2 of the rotary drum DR by sequentially obtaining the difference value and monitoring the change in the difference value thereof every time. Similarly, for the pair of encoder heads EN2, the count value (the moving position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN2 on the scale part GPa side corresponds to the CD2a and the encoder head EN2 on the scale part GPb side. The count value (moving position of the scale GPb) counted by the counter circuit may be set as CD2b and the change in the difference value may be monitored.

When measuring the inclination variation (angle θ _z ), the pair of encoder heads EN1 and the pair of encoder heads EN2 are positioned symmetrically with respect to the X direction with respect to the center plane p3 as shown in FIG. Since it is installed, a change in the difference between the count value CD1a by the encoder head EN1 facing the scale part GPa and the count value CD2b by the encoder head EN2 facing the scale part GPb, or the encoder head EN2 facing the scale part GPa. It is also possible to monitor the change in the difference value between the count value CD2a by the encoder head EN1 and the count value CD1b by the encoder head EN1 facing the scale part GPb.

Here, the control device 16 controls the drawing device 11 for the substrate P based on the detection results of the alignment microscopes AM1 and AM2 so that the drawing device 11 can appropriately perform the drawing on the substrate P transported by the rotating drum DR. Correcting the position. That is, the control device 16 determines the state of the shape of the substrate P or the deformation of the device pattern (base pattern) region already formed on the substrate P based on the positions of the marks Ks1 to Ks3 detected by the alignment microscopes AM1 and AM2. Is detected, and a relative correction rotation amount θ ₂ corresponding to the detected deformation state (in particular, inclination or the like) is obtained. The correction rotation amount θ ₂ is an angle from the reference line extending in the X direction. In addition, in FIG. 11, the counterclockwise displacement is +θ ₂ and the clockwise displacement is −θ ₂ . Then, the control device 16 corrects the positional relationship of the second optical surface plate 25 with respect to the rotating drum DR by controlling the driving unit 106 of the rotating mechanism 24 based on the calculated corrected rotation amount θ ₂ .

At this time, when the control device 16 rotationally corrects the rotation mechanism 24 (second optical surface plate 25) from the initial position based on the obtained relative corrected rotation amount θ ₂ , the encoder heads EN1 and EN2 also rotate. Therefore, the inclination θ _z of the rotation center line AX2 measured after the rotation correction cannot be taken into consideration, that is, it becomes meaningless. Therefore, the control device 16 rotates the rotating mechanism 24 based on the corrected rotation amount θ ₂ in consideration of the inclination θ _z of the rotation center line AX2 measured in advance (or immediately before).

Specifically, the control device 16 sets the relative corrected rotation amount θ ₂ measured based on the detection results of the alignment microscopes AM1 and AM2 to zero, that is, “θ ₂ −θ _z (=0°). )” becomes zero, the rotation mechanism 24 is rotated while the rotation amount measurement device 105 measures the rotation amount by the rotation mechanism 24.

As described above, the control device 16 determines, based on the detection results of the pair of encoder heads EN1 and EN2, from the predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25, the in-plane XY that is the deviation information. The inclination of the rotation center line AX2 (inclination of the rotating drum DR in the XY plane) θ _z is obtained, and the corrected rotation amount θ ₂ corresponding to the inclination of the substrate P in the XY plane obtained by the alignment microscopes AM1 and AM2. The drive unit 106 of the rotation mechanism 24 is controlled so that the deviation between the rotation center line AX2 and the inclination θ _z is reduced, that is, the predetermined relative positional relationship is maintained.

Next, with reference to FIG. 12, an adjusting method of the exposure apparatus EX will be described. FIG. 12 is a flowchart regarding the adjusting method of the exposure apparatus of the first embodiment. When the control device 16 corrects the positional relationship between the rotating drum DR and the second optical surface plate 25 by the rotating mechanism 24 so that the drawing device 11 can appropriately draw on the substrate P, the control device 16 first detects by the alignment microscopes AM1 and AM2. The detection result (such as the inclination of the device pattern area on the substrate P) is acquired (step S1). The control device 16 obtains the correction rotation amount θ ₂ to be adjusted by the rotation mechanism 24 based on the detection result detected by the alignment microscopes AM1 and AM2 (step S2). After that, the control device 16 acquires the information regarding the inclination θ _z from the comparison of the detection results of the pair of encoder heads EN1 and EN2 (step S3). The control device 16 determines the inclination θ _{z of the} rotation center line AX2 based on the rotation angle positions (count values CD1a, CD1b, CD2a, CD2b) of the scale parts GPa, GPb detected by the pair of encoder heads EN1, EN2. Is calculated (step S4). Then, the control device 16 performs feedback control or the like on the rotation mechanism 24 so that the deviation between the calculated correction rotation amount θ ₂ and the inclination θ _z of the rotation center line AX2, that is, “θ ₂ −θ _z ”, becomes zero. Rotate (step S5). Note that after this step S5, the control device 16 again based on the respective rotational angular positions (count values CD1a, CD1b, CD2a, CD2b) of the scale parts GPa, GPb detected by the pair of encoder heads EN1, EN2. Then, a new inclination θ′ _z of the rotation center line AX2 is obtained at an appropriate time interval. Then, when the new inclination θ′ _z changes due to the vibration of the device or the like, the rotation mechanism 24 is feedback-controlled so that the new inclination θ′ _z is maintained.

As described above, in the first embodiment, since the encoder heads EN1 and EN2 are attached to the second optical surface plate 25, the exposure apparatus EX uses the rotary drum in the XY plane based on the detection results of the encoder heads EN1 and EN2. It is possible to obtain deviation information (inclination θ _z of the rotation center line AX2) from the predetermined relative arrangement relationship between the DR and the second optical surface plate 25. Then, the exposure apparatus EX can correct the relative positional relationship between the rotary drum DR and the second optical surface plate 25 based on the obtained shift information. Therefore, the exposure apparatus EX maintains the predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25 even if the position of the rotary drum DR is displaced due to the influence of vibration or the like due to the rotation of the rotary drum DR. Therefore, the drawing by the drawing device 11 can be accurately performed on the substrate P.

Further, in the first embodiment, the encoder heads EN1 and EN2 can be provided on the installation azimuth lines Le1 and Le2. Therefore, the direction connecting the encoder head EN1 and the rotation center line AX2 and the direction connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 can be the same direction. Similarly, the direction connecting the encoder head EN2 and the rotation center line AX2 and the direction connecting the even-numbered drawing lines LL2, LL4 and the rotation center line AX2 can be the same direction. Therefore, it is possible to match the arrangement relationship between the encoder heads EN1 and EN2 and the drawing lines LL1 to LL5. Therefore, even if the position of the rotary drum DR is displaced, the arrangement relationship of the drawing lines LL1 to LL5 with respect to the rotary drum DR can be accurately measured by the encoder heads EN1 and EN2, and thus measurement that is less likely to be affected by disturbance can be performed. it can.

Further, in the first embodiment, the encoder heads EN3 and EN4 can be attached to the main body frame 21. Therefore, the exposure apparatus EX measures the marks Ks1 to Ks3 by the alignment microscopes AM1 and AM2 based on the detection results of the encoder heads EN3 and EN4, with the main body frame 21 (bearing portion of the rotating drum DR) as a stationary reference. be able to. Then, the exposure apparatus EX can obtain the relative correction rotation amount θ ₂ to be corrected by the rotation mechanism 24 based on the detection results of the alignment microscopes AM1 and AM2. Therefore, the exposure apparatus EX accurately determines the positional relationship between the rotary drum DR and the second optical surface plate 25 based on the deviation between the calculated correction rotation amount θ ₂ and the inclination θ _z of the rotation center line AX2 which is the deviation information. Can be corrected to.

Further, in the first embodiment, the encoder heads EN3 and EN4 can be provided on the installation azimuth lines Le3 and Le4. Therefore, the direction connecting the encoder head EN3 and the rotation center line AX2 and the direction connecting the observation regions Vw1 to Vw3 and the rotation center line AX2 can be the same direction. Further, the direction connecting the encoder head EN4 and the rotation center line AX2 and the direction connecting the observation regions Vw4 to Vw6 and the rotation center line AX2 can be the same direction. Therefore, the positional relationship between the encoder heads EN3 and EN4 and the positional relationship between the observation areas Vw1 to Vw6 can be matched. Therefore, even if the position of the rotary drum DR is displaced, the arrangement relationship of the observation regions Vw1 to Vw6 with respect to the rotary drum DR can be accurately measured by the encoder heads EN3 and EN4, and thus measurement that is less likely to be affected by disturbance can be performed. it can.

Further, in the first embodiment, the rotation mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23 to correct the positional relationship between the rotating drum DR and the second optical surface plate 25. You can Therefore, the exposure apparatus EX corrects the drawing lines LL1 to LL5 formed by the drawing apparatus 11 installed on the second optical surface plate 25 to an appropriate position with respect to the substrate P wound around the rotary drum DR. Thus, the drawing by the drawing device 11 can be performed on the substrate P with high accuracy.

In the first embodiment, steps S1 and S2 for obtaining the corrected rotation amount θ ₂ are performed, and then steps S3 and S4 for obtaining the deviation information are performed, but the configuration is not limited to this. Steps S1 and S2 for obtaining the corrected rotation amount θ ₂ and steps S3 and S4 for obtaining the deviation information may be performed in parallel, or steps S3 and S4 for obtaining the deviation information may be executed. After that, step S1 and step S2 for obtaining the corrected rotation amount θ ₂ may be executed.

[Second Embodiment]
Next, with reference to FIG. 13, an exposure apparatus EX of the second embodiment will be described. FIG. 13 is a perspective view showing the arrangement of the main parts of the exposure apparatus of the second embodiment. Note that, in the second embodiment, in order to avoid a duplicate description of the first embodiment, only parts different from the first embodiment will be described, and the same components as those of the first embodiment are the same as those of the first embodiment. Description will be given with reference numerals. In the exposure apparatus EX of the first embodiment, as the displacement of the positional relationship between the rotary drum DR and the second optical surface plate 25, the rotation center line AX2 of the rotary drum DR is in the X direction (reference position) in the XY plane. The case of tilting has been described. In the exposure apparatus EX of the second embodiment, as the displacement of the positional relationship between the rotary drum DR and the second optical surface plate 25, the rotation center line AX2 of the rotary drum DR with respect to the Y direction (reference position) in the YZ plane. The case of tilting will be described.

As shown in FIG. 13, the three-point seat 22 functions as a connecting mechanism that connects the main body frame 21, the first optical surface plate 23, and the second optical surface plate 25. Here, in the first embodiment, the main body frame 21 and the first optical surface plate 23, which are connected via the three-point seat 22, function as the first supporting member, and the second optical surface plate 25 serves as the second supporting member. And the rotation mechanism 24 was made to function as a coupling mechanism. In the second embodiment, the main body frame 21 is made to function as a first supporting member, and the first optical surface plate 23 and the second optical surface plate 25 that are connected via the rotation mechanism 24 are made to function as a second supporting member. The three-point seat 22 functions as a connecting mechanism.

The three-point seat 22 includes a drive unit 110 including a motor, a piezo element, and the like, and the drive unit 110 is drive-controlled by the control device 16 so that the length (height) in the Z direction at each support point 22a is independent. To adjust the tilt of the first optical surface plate 23 with respect to the main body frame 21. Here, the rotation center line AX2 extends in the Y direction, and the position of the rotation center line AX2 extending in the Y direction is set as a reference position. In the YZ plane, the rotation center line AX2, which is the reference position, is tilted by a predetermined angle from the reference position due to the influence of vibration and the like due to the rotation. When the rotation center line AX2 is tilted by a predetermined angle from the reference position, one end of the rotary drum DR in the axial direction moves in a predetermined direction (for example, the −Z direction in FIG. 13) while the shaft of the rotary drum DR is moved. This means that the other end in the direction relatively moves in the direction opposite to the one end of the rotary drum DR (for example, the +Z direction in FIG. 13).

Therefore, when the pair of encoder heads EN1 and EN2 are attached to the second optical surface plate 25 (or the first optical surface plate 23) side, the rotation center line AX2 is YZ by a predetermined angle from the reference position. By inclining in the plane, the rotational angle positions (count values CD1a, CD2a) detected by the encoder heads EN1, EN2 on the scale part GPa side and the rotational angle positions detected by the encoder heads EN1, EN2 on the scale part GPb side. A difference may occur between (counted values CD1b, CD2b). Therefore, the control device 16 can detect a tilt change in the YZ plane of the rotation center line AX2 of the rotary drum DR in the YZ plane based on the rotation angle positions detected by the pair of encoder heads EN1 and EN2. You can However, in the information on the rotational angle position detected by the encoders EN1 and EN2 on the scale part GPa side and the encoder heads EN1 and EN2 on the scale part GPb side, the displacement in the Z direction of the rotation center line AX2 (rotating drum DR) is included. On the other hand, it is configured to have almost no sensitivity and to have sensitivity to the displacement of the rotation center line AX2 (rotating drum DR) in the X direction as in the first embodiment.

Therefore, in the second embodiment, the rotation center line is set by using the pair of encoder heads EN3 and EN4 arranged in the installation orientation of the alignment microscopes AM1 and AM2 shown in FIGS. 4, 8, 10, and 11. The displacement in the Z direction on both ends of the AX2 (rotating drum DR) is measured. Therefore, as shown in FIG. 10 and FIG. 11, the encoder heads EN3 and EN4 attached to the main body frame 21 are attached to the first optical surface plate 23 or the second optical surface plate 25, and the pair of encoder heads facing the scale portion GPa is provided. Rotational angular positions detected by the encoder heads EN3 and EN4 (counted values CD3a and CD4a of corresponding counter circuits) and rotational angular positions detected by the pair of encoder heads EN3 and EN4 facing the scale portion GPb (corresponding counters The inclination of the rotation center line AX2 of the rotary drum DR with respect to the rotation center line AX2 of the reference position in the YZ plane may be detected based on the difference between the circuit count values CD3b and CD4b).

Then, the control device 16 determines a predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder heads EN3, EN4. Then, the inclination of the rotation center line AX2 in the YZ plane, which is the displacement information, is obtained, and the inclination of the obtained rotation center line AX2 is decreased, that is, the predetermined relative arrangement relationship is maintained, the three-point coordinate The driving unit 110 of 22 is controlled to correct the inclination of the entire second optical surface plate 25.

As described above, in the second embodiment, by attaching the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN2) to the second optical surface plate 25, the detection results of the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN2) are detected. Deviation information (displacement in the Z direction or inclination in the YZ plane) from the predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25 in the YZ plane based on the (difference in rotational angle position). Can be asked. Then, the exposure apparatus EX can correct the relative positional relationship between the rotary drum DR and the second optical surface plate 25 based on the obtained shift information. Therefore, the exposure apparatus EX can maintain the predetermined relative positional relationship between the rotating drum DR and the second optical surface plate 25 even if the position of the rotating drum DR is displaced due to the influence of vibration or the like, and thus the substrate P Can be exposed with high precision.

[Third Embodiment]
Next, the exposure apparatus EX of the third embodiment will be described with reference to FIG. FIG. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus of the third embodiment. In addition, also in 3rd Embodiment, in order to avoid the description which overlaps with 1st and 2nd embodiment, only a different part from 1st and 2nd embodiment is demonstrated, and the same component as 1st and 2nd embodiment. The same reference numerals as those in the first and second embodiments will be used for description. In the exposure apparatus EX of the first and second embodiments, the position on the drawing apparatus 11 side (second support member side) is displaced by the rotation mechanism 24 and the three-point seat 22. In the exposure apparatus EX of the third embodiment, the positions of both ends of the rotary drum DR (rotation center axis AX2) are displaced in the X direction and the Z direction by the X movement mechanism 121 and the Z movement mechanism 122.

As shown in FIG. 14, the rotary drum DR is provided with shaft portions Sf2 on both sides in the axial direction, and each shaft portion Sf2 is rotatably supported by the main body frame 21 via bearings 123. An X movement mechanism 121 and a Z movement mechanism 122 are provided adjacent to the bearings 123 on both sides, and each X movement mechanism 121 and each Z movement mechanism 122 move the bearing 123 in the X direction and the Z direction (fine movement). Can be made.

Here, in the third embodiment, the bearing 123 functions as a first supporting member, the device frame 13 functions as a second supporting member, and each X moving mechanism 121 and each Z moving mechanism 122 function as a connecting mechanism. There is.

The pair of X movement mechanisms 121 on both sides can respectively move the pair of bearings 123 on both sides in the X direction, and in the XY plane, the inclination of the rotation center line AX2 of the rotary drum DR and the position in the X direction. Is being fine-tuned. Here, like the first embodiment, the rotation center line AX2 extends in the Y direction, and the position of the rotation center line AX2 extending in the Y direction is set as the reference position. In the XY plane, when the rotation center line AX2 that is the reference position is tilted by a predetermined angle from the reference position due to the influence of vibration or the like, by adjusting the driving amount of the pair of X movement mechanisms 121 on both sides, The inclination of the rotary drum DR in the XY plane can be corrected.

Further, the pair of Z moving mechanisms 122 on both sides can respectively move the pair of bearings 123 on both sides in the Z direction, and in the YZ plane, the inclination of the rotation center line AX2 of the rotary drum DR and Z. The direction position is finely adjusted. Here, the rotation center line AX2 extends in the Y direction similarly to the second embodiment, and the position of the rotation center line AX2 extending in the Y direction is set as the reference position. In the YZ plane, when the rotation center line AX2 that is the reference position is tilted by a predetermined angle from the reference position due to the influence of vibration or the like, by adjusting the drive amount of the pair of Z moving mechanisms 122 on both sides, The inclination of the rotary drum DR in the YZ plane can be corrected.

As described in the first embodiment, the pair of encoder heads EN1 and EN2 can measure a relative tilt error in the XY plane between the second optical surface plate 25 and the rotating drum DR (rotation center line AX2). is there. Also in the third embodiment, as in the second embodiment, when the encoder heads EN3 and EN4 are attached to the second optical surface plate 25 (or the first optical surface plate 23), the pair of encoder heads EN3 and EN4 are As described in the second embodiment, the relative tilt error in the YZ plane between the second optical surface plate 25 and the rotary drum DR (rotation center line AX2) can be measured.

Therefore, the control device 16 determines a predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25 based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1, EN2. Deviation information (relative inclination θ _Z of the rotation center line AX2 in the XY plane) is obtained. Further, the control device 16 measures the tilt and the like of the device pattern area on the substrate P based on the detection results of the alignment microscopes AM1 and AM2, and obtains the corrected rotation amount θ ₂ by the X moving mechanism 121. The control device 16 reduces the deviation between the calculated corrected rotation amount θ ₂ and the inclination θ _Z of the rotation center line AX2, that is, maintains a predetermined relative positional relationship so that the X movement mechanisms 121 on both sides are controlled. Control the drive amount. Similarly, the control device 16 sets a predetermined relative position between the rotary drum DR and the second optical surface plate 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder heads EN3, EN4. From the relationship, the inclination of the rotation center line AX2 in the YZ plane (denoted as θ _X ) that is the displacement information is obtained, and the obtained inclination θ _X of the rotation center line AX2 is decreased, that is, the predetermined relative arrangement relationship. The drive amounts of the Z movement mechanisms 122 on both sides are controlled so that

As described above, in the third embodiment, the rotating drum DR is rotated about the axis parallel to the Z axis with respect to the main body frame 21 by the X moving mechanism 121 in the XY plane, and the main body frame is moved by the Z moving mechanism 122 in the YZ plane. By rotating the rotary drum DR about the axis parallel to the X axis with respect to 21, the relative positional relationship between the rotary drum DR and the second optical surface plate 25 can be adjusted. Therefore, the exposure apparatus EX corrects the drawing lines LL1 to LL5 formed by the drawing apparatus 11 installed on the second optical surface plate 25 to an appropriate position with respect to the substrate P wound around the rotary drum DR. Therefore, the device pattern can be accurately exposed on the substrate P.

[Fourth Embodiment]
Next, with reference to FIG. 15, an exposure apparatus EX of the fourth embodiment will be described. FIG. 15 is a diagram showing the configurations of the rotary drum and the drawing device of the exposure apparatus of the fourth embodiment. Note that, also in the fourth embodiment, in order to avoid the description overlapping with the first to third embodiments, only the portions different from the first to third embodiments will be described, and the same constituent elements as those in the first to third embodiments will be described. The same reference numerals as those in the first to third embodiments will be used for description. In the exposure apparatus EX of the third embodiment, the position of the rotary drum DR is displaced by the X moving mechanism 121 and the Z moving mechanism 122 that move the bearing 123. In the exposure apparatus EX of the fourth embodiment, the position of the rotary drum DR is displaced by the drum support frame 130 that is separate from the apparatus frame 13.

As shown in FIG. 15, the drum support frame 130 has a drum rotation mechanism 131 and a drum support member 132 in order from the lower side in the Z direction. The drum rotation mechanism 131 is installed on the installation surface E via the vibration isolation unit SU3. The drum supporting member 132 is installed on the drum rotating mechanism 131, and rotatably supports the shaft of the rotating drum DR with both ends. The drum rotation mechanism 131 rotates the drum support member 132 about a rotation axis Ia (intersecting the rotation center axis AX2) that is parallel to the Z axis in the XY plane, so that the rotation center line AX2 of the rotation drum DR is moved. Adjust the tilt in the XY plane.

Further, since the rotary drum DR is provided on the drum support frame 130 which is separate from the device frame 13, the present embodiment is configured such that the three-point seat 22 and the first optical surface plate of the first to third embodiments are used. 23 and the rotation mechanism 24 are omitted, and only the second optical surface plate 25 and the drawing device 11 supported by the second optical surface plate 25 are installed on the main body frame 21. Here, in the fourth embodiment, the drum support frame 130 functions as a first support member, the device frame 13 functions as a second support member, and the drum rotation mechanism 131 functions as a coupling mechanism.

Here, the control device 16 extends the reference position extending in the Y direction based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1 and EN2 attached to the second optical surface plate 25. The relative inclination θ _Z of the rotary drum DR (the rotation center line AX2) and the second optical surface plate 25 with respect to the rotation center line AX2 in the XY plane is detected. Further, the control device 16 measures the inclination of the device pattern area on the substrate P based on the detection results of the alignment microscopes AM1 and AM2, and obtains the corrected rotation amount θ ₂ by the drum rotation mechanism 131. The control device 16 controls the drum rotation mechanism 131 so that the deviation between the calculated correction rotation amount θ ₂ and the inclination θ _Z of the rotation center line AX2 is reduced, that is, the predetermined relative positional relationship is maintained. .. Although the pair of encoder heads EN3 and EN4 arranged in the same direction as the installation directions of the alignment microscopes AM1 and AM2 are attached to the second optical surface plate 25, they may be attached to the drum support member 132 side.

As described above, in the fourth embodiment, since the rotating drum DR can be rotated with respect to the second optical surface plate 25 by rotating the drum support frame 130 by the drum rotating mechanism 131, the rotating drum DR and the second optical plate can be rotated. The relative positional relationship with the surface plate 25 can be corrected. Therefore, the exposure apparatus EX adjusts the substrate P wound around the rotary drum DR to an appropriate position with respect to the drawing lines LL1 to LL5 formed by the drawing apparatus 11 installed on the second optical surface plate 25. Therefore, the device pattern can be accurately exposed on the substrate P.

[Fifth Embodiment]
Next, an exposure apparatus EX of the fifth embodiment will be described with reference to FIG. FIG. 16 is a plan view showing the arrangement of encoder heads of the exposure apparatus of the fifth embodiment. In addition, also in the fifth embodiment, in order to avoid the description overlapping with the first to fourth embodiments, only the parts different from the first to fourth embodiments will be described, and the same constituent elements as those in the first to fourth embodiments will be described. The same reference numerals as those in the first to fourth embodiments will be used for description. In the exposure apparatus EX of the first embodiment, the tilt of the rotary drum DR is detected by the pair of encoder heads EN1 and EN2. In the fifth embodiment, the tilt of the rotary drum DR is detected by the pair of encoder heads EN1 and EN2 and the pair of encoder heads EN5 and EN6.

As shown in FIG. 16, the pair of encoder heads EN1 and EN2 are attached to the second optical surface plate 25 via the attachment member 100. Further, the pair of encoder heads EN5 and EN6 are attached to the main body frame 21 via the attachment member 141. Here, each encoder head EN1 and each encoder head EN5 are provided adjacent to each other with a certain gap in the Y direction. The widths of the scale parts GPa and GPb are set to be wide in the Y direction so that the two encoder heads EN1 and EN5 adjacent to each other in the Y direction can detect the scale parts GPa and GPb, respectively.

Here, since the rotary drum DR is attached to the main body frame 21, the control device 16 controls the rotation angle position detected by each of the pair of encoder heads EN5 and EN6 (count value CD5a of the corresponding counter circuit, Based on CD5b, CD6a, and CD6b), the inclination θ _ZR of the rotation center line AX2 of the rotary drum DR in the XY plane is detected, and the detected inclination θ _ZR is set as the reference position. That is, the difference value between the count value CD5a by the encoder head EN5 facing the scale portion GPa on one side of the rotation center axis AX2 and the count value CD5b by the encoder head EN5 facing the scale portion GPb on the other side of the rotation center axis AX2. Or a difference value between the count value CD6a by the encoder head EN6 facing the scale part GPa and the count value CD56 by the encoder head EN6 facing the scale part GPb on the other side of the rotation center axis AX2. It is possible to measure the variation of the inclination θ _ZR in the XY plane of the rotary drum DR with the frame 21 as a reference.

Further, similarly to the first embodiment, the control device 16 determines the rotation drum DR and the second rotation drum based on the rotation angle position (count value CD1a, CD1b, CD2a, CD2b) detected by the pair of encoder heads EN1 and EN2. The relative inclination θ _Z in the XY plane with the optical surface plate 25 is obtained. Therefore, the inclination θ _ZR measured based on the rotational angle position detected by each of the pair of encoder heads EN5 and EN6, and the inclination θ _ZR measured based on the rotational angle position detected by the pair of encoder heads EN1 and EN2. By rotating the second optical surface plate 25 by the rotating mechanism 24 based on θ _Z , the second optical surface plate 25 and the drawing device 11 supported by the second optical surface plate 25 are moved with respect to the main body frame 21 (stationary reference). It can be set without rotation error. However, as in the first embodiment, when it corresponds to the inclination error of the device pattern area formed on the substrate P, the relative inclination of the device pattern area measured based on the detection results of the alignment microscopes AM1 and AM2. The rotation mechanism 24 is driven in consideration of the correction amount according to θ ₂ .

As described above, in the fifth embodiment, based on the rotational position detected by the pair of encoder heads EN5 and EN6, the inclination θ _ZR of the rotation center line AX2 of the rotary drum DR with respect to the main body frame 21 in the XY plane is set. Can be detected. Therefore, the control device 16 can measure the reference position of the rotation center line AX2 of the rotary drum DR, and thereby accurately measure the predetermined relative positional relationship between the rotary drum DR and the second optical surface plate 25. can do. In particular, during the first exposure for drawing the pattern for the first layer in the device pattern area on the substrate P, even if the rotary drum DR is tilted in the XY plane with respect to the main body frame 21 serving as the stationary reference, the first exposure is performed. It is corrected that the exposure pattern is transferred on the substrate P while being inclined.

[Sixth Embodiment]
Next, an exposure apparatus EX of the sixth embodiment will be described with reference to FIG. FIG. 17 is a plan view showing the arrangement of scale disks of the exposure apparatus of the sixth embodiment. In addition, also in the sixth embodiment, in order to avoid the description overlapping with the first to fifth embodiments, only the portions different from the first to fifth embodiments will be described, and the same constituent elements as those in the first to fifth embodiments will be described. The same reference numerals as those in the first to fifth embodiments will be used for description. In the exposure apparatus EX of the first to fifth embodiments, the rotation position of the rotary drum DR is detected using the scale parts GPa and GPb formed on the outer peripheral surface of the rotary drum DR. In the exposure apparatus EX of the sixth embodiment, the rotational position of the rotary drum DR is detected by using the high circularity scale disk SD attached to the rotary drum DR.

As shown in FIG. 17, the scale disk SD is engraved with scale parts GPa and GPb on the outer peripheral surface, and is fixed to the end of the rotary drum DR so as to be orthogonal to the rotation center line AX2. Therefore, the scale disk SD rotates together with the rotating drum DR around the rotation center line AX2. Further, the scale disk SD is made of a metal, glass, ceramics or the like having a low thermal expansion as a base material, and is made to have a diameter as large as possible (for example, 20 cm or more) in order to improve measurement resolution. In FIG. 17, the diameter of the outer peripheral surface of the scale disk SD is shown to be smaller than the diameter of the outer peripheral surface of the photosensitive drum DR, but the diameter of the scale portion GP of the scale disk SD is the outer peripheral surface of the substrate P wound around the rotary drum DR. By aligning (substantially matching) with the diameter of, the so-called measurement Abbe error can be further reduced.

As described above, in the sixth embodiment, since the separate scale disk SD can be attached to the rotary drum DR, the scale disk SD suitable for the rotary drum DR can be selected. Further, as the scale disk SD, one having a mechanism (a push screw or the like) capable of finely adjusting the circularity at a plurality of positions in the circumferential direction can be used, so that an eccentricity error from the rotation center axis AX2 of the scale part GP or a scale ( It is possible to further reduce the measurement error (cumulative error) due to the pitch error of the diffraction grating.

In the first to sixth embodiments, the pattern is formed on the substrate P by using the drawing device 11 that scans the spot light, but the present invention is not limited to this configuration and may be any device that forms the pattern on the substrate P. For example, it may be a projection exposure system that forms a pattern on the substrate P by projecting and exposing the projection light beam from the mask onto the substrate P using a transparent or reflective flat or cylindrical mask. Further, a maskless exposure apparatus that projects a light distribution corresponding to a pattern to be drawn onto the substrate P by a digital micromirror device (DMD) in which a large number of tiltable micromirrors are arranged in a matrix instead of a mask. You can have it. The device for forming a pattern on the substrate P may be, for example, an inkjet drawing device for forming a pattern on the substrate P using an inkjet head that ejects droplets of ink or the like. Also in the case of such a maskless type exposure device or ink jet type drawing device, a light distribution corresponding to a pattern made by DMD is projected on the substrate P as disclosed in, for example, Japanese Patent Application Laid-Open No. 2010-091990. A plurality of exposing portions (pattern forming portions) to be arranged are arranged in the width direction of the substrate P, or a plurality of droplet applying portions (pattern forming portions) provided with ink-jet type ink nozzles are arranged in the width direction of the substrate P. As a configuration, the entire plurality of exposure units or the entire plurality of droplet application units may be configured to be rotatable relative to the substrate P in the XY plane.

Further, in the first to sixth embodiments, the second optical surface plate 25 to which the plurality of drawing modules UW1 to UW5 forming the drawing device 11 are fixed is rotated by the rotating mechanism 24 in the XY plane. In order to adjust each of the drawing lines LL1 to LL5 in parallel in the XY plane or adjust the drawing lines LL1 to LL5 to have a predetermined inclination in the XY plane, each of the drawing modules UW1 to UW5 is adjusted to the second optical constant. An actuator (second rotation mechanism, drive mechanism) that allows individual minute rotations in the XY plane on the board 25 may be provided. In that case, an individual angle measurement sensor that measures the rotational angle position (inclination amount or the like) of each of the drawing modules UW1 to UW5 (pattern forming unit) with respect to the second optical surface plate 25 is provided, and a pair of encoder heads EN1, EN2, etc. Based on both the amount of inclination of the second optical surface plate 25 in the XY plane and the amount of inclination of each of the drawing modules UW1 to UW5 measured by the individual angle measurement sensor (second detection device). The inclinations of the drawing lines LL1 to LL5 on the substrate P can be adjusted. Therefore, while the rotating drum DR is being rotated and the substrate P is being conveyed at a constant speed in the lengthwise direction (X direction), the substrate P slightly shifts in the Y direction on the rotating drum DR. Even when the feeding direction of the substrate P slightly tilts, the tilts can be successively measured by the position detection of the alignment marks Ks1 to Ks3 by the alignment microscope AM1 (or AM2). The actuators (driving mechanisms) of the drawing modules UW1 to UW5 can be controlled so that each of the drawing modules UW1 to UW5 tilts. As a result, when a new pattern is superposed on a base pattern (for example, a first layer pattern) for an electronic device which is already formed in the exposure area A7 on the substrate P, the substrate P meanders while being conveyed. Even if the occurrence occurs, the overlay accuracy can be favorably maintained over the entire exposure area A7 on the substrate P.

Further, in the first to sixth embodiments, the second optical surface plate 25 supporting the drawing device 11 and the main body frame 21 supporting the rotary drum DR are relatively small in the XY plane (or in the YZ plane). A drive mechanism (rotation mechanism 24, drive unit 110 of the three-point seat 22, X movement mechanism 121, Z movement mechanism 122) including a motor for rotating is provided. However, the spatial arrangement relationship between the drawing device 11 and the rotary drum DR is relatively finely adjusted not by electric operation by a motor or the like but by manual operation such as replacement of adjustment screws, microgauges, and washers of different thicknesses. Alternatively, a connection mechanism that connects the second optical surface plate 25 and the main body frame 21 may be used. Such a connection mechanism having a manually operated adjustment unit has, for example, the second optical surface plate 25 (first optical surface plate 23) on which the drawing device 11 is mounted when the device is assembled or maintenance is performed. This is useful when finely adjusting the position of each of the three-point seats 22 in the XYZ directions, such as when the three-point seats 22 are removed from the frame 21 and then attached again to the main body frame 21 via the three-point seats 22.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 18 is a flowchart showing the device manufacturing method of each embodiment.

In the device manufacturing method shown in FIG. 18, first, the function/performance of a display panel is formed by a self-luminous element such as an organic EL, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Further, a supply roll around which a flexible substrate P (resin film, metal foil film, plastic, etc.) serving as a base material of the display panel is wound is prepared (step S202). The roll-shaped substrate P prepared in step S202 has a surface modified as necessary, a base layer (for example, fine irregularities formed by an imprint method) preformed, and a photosensitivity. A functional film or transparent film (insulating material) previously laminated may be used.

Next, a backplane layer composed of electrodes, wirings, insulating films, TFTs (thin film semiconductors), etc., which constitute the display panel device is formed on the substrate P, and organic EL or the like is formed so as to be laminated on the backplane. A light emitting layer (display pixel portion) is formed by the self-luminous element (step S203). This step S203 includes a conventional photolithography process of exposing the photoresist layer using the exposure apparatus EX described in each of the above embodiments, but a photosensitive silane coupling material is applied instead of the photoresist. Exposure step of pattern-exposing the formed substrate P to form a pattern having hydrophilicity/repellency on the surface, and wet type of pattern-exposing a photosensitive catalyst layer to form a pattern of a metal film (wiring, electrodes, etc.) by electroless plating It also includes a process, a printing process of drawing a pattern with a conductive ink containing silver nanoparticles, or the like.

Then, the substrate P is diced for each display panel device continuously manufactured on the long substrate P by the roll method, or a protective film (environment-resistant barrier layer) or a color filter is provided on the surface of each display panel device. A device or the like is assembled by laminating sheets or the like (step S204). Then, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S205). The display panel (flexible display) can be manufactured as described above. Further, in addition to the manufacturing of the display panel as shown in FIG. 18, a chemical sensor having a flexible printed substrate, a semiconductor element such as TFT, and an electrode pattern for sensing, which require a precise wiring pattern (high-density wiring). The exposure apparatus according to each of the above-described embodiments can also be used when manufacturing a sheet, a DNA chip, or the like on the flexible substrate P.

1 Device Manufacturing System 11 Drawing Device 12 Substrate Transfer Mechanism 13 Device Frame 14 Rotation Position Detection Mechanism 16 Controller 21 Body Frame 22 Three-Point Seat 23 First Optical Surface Plate 24 Rotation Mechanism 25 Second Optical Surface Plate 31 Calibration Detection System 44 , 45 XY Herbing adjustment mechanism 51 1/2 wavelength plate 52 Polarization mirror 53 Beam diffuser 60 First beam splitter 62 Second beam splitter 63 Third beam splitter 73 Fourth beam splitter 81 Optical deflector 82 Quarter wave plate 83 Scan Device 84 Bending mirror 85 f-θ lens system 86 Y magnification correction optical member 92 Light-shielding plate 96 Reflecting mirror 97 Rotating polygon mirror 98 Origin detector 100 Encoder head EN1, EN2 mounting member 101 Encoder head EN3, EN4 mounting member 105 Rotation amount measuring device 106 Driving unit for rotating mechanism 110 Driving unit for three-point seat 121 X moving mechanism 122 Z moving mechanism 123 Bearing 130 Drum supporting frame 131 Drum rotating mechanism 132 Drum supporting member 141 Encoder head EN5, EN6 mounting member P substrate U1, U2 Process equipment EX Exposure equipment AM1, AM2 Alignment microscope EVC Temperature control chamber SU1, SU2 Anti-vibration unit E Installation surface EPC Edge position controller RT1, RT2 Tension adjustment roller DR Rotating drum AX2 Rotation center line Sf2 Shaft part p3 Center surface DL Sag UW1 to UW5 Drawing module CNT Light source device LB Drawing beam I Rotation axis LL1 to LL5 Drawing line PBS Polarizing beam splitter A7 Exposure area SL Beam distribution optical system Le1 to Le4 Installation azimuth line Vw1 to Vw6 Observation area Ks1 to Ks3 Alignment mark GPa, GPb scale part EN1 to EN6 encoder head SD scale disk

Claims (9)

A substrate processing apparatus for feeding a long sheet substrate in a long direction and sequentially forming a predetermined pattern on the sheet substrate,
A cylindrical drum having a cylindrical outer peripheral surface having a constant radius from a center line extending in a direction intersecting the longitudinal direction, and a part of the outer peripheral surface supporting the sheet substrate;
A first support member that pivotally supports the cylindrical drum rotatably around the center line;
A pattern forming device which is arranged to face a portion of the outer peripheral surface of the cylindrical drum that supports the sheet substrate, and forms the pattern on the sheet substrate;
A second support member for holding the pattern forming device;
A connecting mechanism that adjustably connects the relative positional relationship between the cylindrical drum and the pattern forming device,
Rotate about said center line with the cylindrical drum, the reference index for measuring the rotational direction position change of direction of the cylindrical drum, which is provided on each of opposite sides of said cylindrical drum with respect to the direction in which the center line extends Members,
A first detection device that is provided on the second support member side and that detects a change in the inclination of the center line based on a measurement position in the rotation direction of the cylindrical drum by detection of each index of the reference member;
A second detection device which is provided on the side of the first support member and detects a change in the inclination of the center line based on a measurement position in the rotation direction of the cylindrical drum by detection of each index of the reference member;
A substrate processing apparatus comprising. The substrate processing apparatus according to claim 1, wherein
In the first detection device, the pattern formation position on the sheet substrate by the pattern formation device is the same as the centerline and the detection position of the index of the reference member by the first detection device when viewed from the extending direction of the centerline. Is arranged on the second support member so as to substantially coincide with the direction connecting
Substrate processing equipment. The substrate processing apparatus according to claim 2, wherein
Further comprising a mark detection device provided on the first support member side and having a detection probe for detecting a mark formed on the sheet substrate,
In the second detection device, when viewed from a direction in which the center line extends, a detection position of the index of the reference member by the second detection device is a direction connecting the detection position of the mark by the detection probe and the center line. Is disposed on the first support member so as to substantially coincide with
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 3,
The connection mechanism is provided between the first support member and the second support member, and is centered on a predetermined point in a plane intersecting a direction in which the first support member and the second support member face each other. , Rotatably connecting the second support member to the first support member,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 3,
The connecting mechanism connects the rotating shaft of the cylindrical drum so as to be tiltable so that the center line serving as the rotating shaft of the cylindrical drum and the pattern forming device are relatively inclined.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 5, wherein
The first support member includes a body frame arranged on the installation surface, a first surface plate provided on the body frame, and a support mechanism provided between the body frame and the first surface plate. Have
The second support member has a second surface plate arranged on the first surface plate.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 6,
The connection mechanism includes a drive unit that relatively displaces the first support member and the second support member,
The index of the reference member is a pair of scale portions of a rotation measurement encoder provided on each of both sides in the direction of the center line of the cylindrical drum,
The first detection device and the second detection device are a pair of read heads arranged so as to face each of the pair of scale portions.
Substrate processing equipment. The substrate processing apparatus according to claim 7, wherein
Further comprising a control device for controlling the drive unit,
The control device obtains deviation information from a predetermined relative positional relationship between the cylindrical drum and the second support member based on each detection result of the pair of read heads, and based on the deviation information, a predetermined deviation information is obtained. Controlling the drive unit to maintain a relative positional relationship,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 8,
The pattern forming device,
A pattern drawing device that draws the pattern by one-dimensionally scanning spot light of a drawing beam that is ON/OFF modulated based on CAD information of a pattern to be drawn on the sheet substrate in the direction of the center line, a transmission type Alternatively, an exposure apparatus using a mask that exposes the pattern on the sheet substrate by using a reflective flat or cylindrical mask, and a light distribution corresponding to the pattern to be drawn on the sheet substrate by a large number of micromirrors is used. Any one of a maskless exposure device that projects and exposes a sheet substrate and an inkjet drawing device that forms a pattern of the ink on the sheet substrate by an inkjet head that ejects ink droplets Is
Substrate processing equipment.

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