KR20180075532A - Substrate processing apparatus, method of adjusting substrate processing apparatus, device manufacturing system, and device manufacturing method - Google Patents

Abstract

An exposure apparatus EX for forming a predetermined pattern on a substrate P while sending a long substrate P in a long direction includes a rotary drum DR for supporting the substrate P, And a second optical table 23 which is disposed so as to face the rotary drum DR with the substrate P interposed therebetween and which is provided on the substrate P A second optical system 25 as a second support member for holding the imaging apparatus 11 and a second optical system 25 for rotating the first optical system 23 and the second optical system 25 A scale part GPa and GPb for measuring a change in position of the rotary drum DR and a scraper part GPa and GPb provided on the second optical disk 25 side, And encoder heads EN1 and EN2 for detecting scales of the encoder heads.

Description

Substrate processing apparatus, method of adjusting substrate processing apparatus, device manufacturing system, and device manufacturing method

The present invention relates to a substrate processing apparatus, a method of adjusting a substrate processing apparatus, a device manufacturing system, and a device manufacturing method.

2. Description of the Related Art Conventionally, as a substrate processing apparatus, there are an exposure roller for carrying a sheet-like work (substrate), a photomask disposed on the top of the exposure roller, and a light- And a lighting unit for irradiating the photomask for exposure with a light beam emitted from a light source (not shown) to the exposure photomask (see, for example, Patent Document 1). In this pattern exposure apparatus, a mask pattern of a photomask is exposed to a work by irradiating the photomask with light from the illumination section while conveying the sheet-shaped work by the exposure roller. In the pattern exposure apparatus described in Patent Document 1, although the workpiece is wound and conveyed on the exposure roller, there is a possibility that the arrangement relationship between the photomask and the workpiece is changed due to the influence of vibration or the like due to rotation of the exposure roller. In this case, since the arrangement relationship between the work wound on the exposure roller and the photomask is displaced from a predetermined arrangement relation suitable for exposure, it is difficult for the mask pattern of the photomask to be exposed accurately to the work.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-72171

According to a first aspect of the present invention, there is provided a substrate processing apparatus for sending a long sheet substrate in a long direction and sequentially forming a predetermined pattern on the sheet substrate, A cylindrical supporting member having a cylindrical outer circumferential surface having a predetermined radius from a center line extending from the center line and supporting the sheet substrate by a part of the outer circumferential surface of the cylindrical drum and a first supporting member for rotatably supporting the cylindrical drum about the center line A pattern forming device arranged to face the portion of the outer circumferential surface of the cylindrical drum that supports the sheet substrate and to form the pattern on the sheet substrate; a second supporting member for holding the pattern forming device; A connecting mechanism for adjustably connecting a relative arrangement of the drum and the pattern forming apparatus with each other, A reference member rotatable about a center line and provided with an index for measuring a change in position of the cylindrical drum in the rotational direction or in the centerline direction of the cylindrical drum and a second member provided on the second support member side for detecting an index of the reference member, And a first detecting device for detecting a change in position in the direction of rotation of the center line or in the direction of the center line.

According to a second aspect of the present invention, there is provided an image forming apparatus comprising: a cylindrical drum supported by a first support member for supporting a sheet substrate by a cylindrical outer peripheral surface having a predetermined radius from a center line and rotating about the centerline; A method of adjusting a substrate processing apparatus having a pattern forming apparatus supported on a second support member so as to form a predetermined pattern on a sheet substrate, comprising: a pair of rotation measuring encoders provided on both sides of the centerline of the cylindrical drum Reading each of the scales by a pair of reading (read) heads disposed on the side of the second support member, reading out the deviation from a predetermined relative arrangement relationship between the cylindrical drum and the pattern forming apparatus Is obtained from the detection result of the pair of reading heads, and that the deviation between the first and second supporting parts The adjustment method of a substrate processing apparatus, comprising adjusting the connection mechanism for connecting to enable relative displacement is provided.

According to a third aspect of the present invention, there is provided an image forming apparatus comprising: a cylindrical drum supported by a first support member for supporting a sheet substrate by a cylindrical outer peripheral surface having a predetermined radius from a center line and rotating around the centerline; A method of adjusting a substrate processing apparatus having a pattern forming apparatus supported on a second support member so as to form a predetermined pattern on a sheet substrate, comprising: a pair of rotation measuring encoders provided on both sides of the centerline of the cylindrical drum And a control unit that reads each of the scales from a predetermined relative arrangement relationship between the cylindrical drum and the pattern forming apparatus by a pair of reading heads disposed on the side of the second supporting member, And the pattern forming apparatus forms a pattern on the sheet substrate in accordance with the obtained deviation A spatial position of the castle regions, the adjustment method of a substrate processing apparatus, comprising relatively adjusted with respect to the cylindrical drum is provided.

According to a fourth aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus according to the first aspect of the present invention.

According to a fifth aspect of the present invention, there is provided an apparatus for patterning a substrate processing apparatus according to the first aspect of the present invention, which is an exposure apparatus for irradiating the sheet substrate with light energy corresponding to a shape of a predetermined pattern, Wherein the sheet substrate having the layer formed thereon is conveyed in the longitudinal direction while being supported by a portion of the outer circumferential surface of the cylindrical drum and a portion of the sheet substrate supported by the cylindrical drum is irradiated with light from the exposure apparatus And forming a layer corresponding to a shape of a predetermined pattern on the sheet substrate by processing the irradiated sheet substrate.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus for sequentially forming a predetermined pattern on a sheet substrate while feeding a long sheet substrate in a long direction, the substrate processing apparatus comprising: a center line extending in a direction intersecting the longitudinal direction A first support member having a cylindrical outer circumferential surface having a predetermined radius and supporting the sheet substrate by a part of the outer circumferential surface while axially supporting a cylindrical drum rotatable about the center line; A second supporting member for holding a plurality of pattern forming portions arranged in a direction opposite to a portion for supporting the sheet substrate out of the outer circumferential surface of the cylindrical drum in a width direction of the sheet substrate; The relative angle of the first support member and the second support member is adjusted to adjust the inclination of the pattern, A reference member rotatable about the center line together with the cylindrical drum and provided with an index for measuring a change in position in the rotational direction or the center line direction of the cylindrical drum, A second detecting member for detecting a change in the rotational direction of the cylindrical drum by detecting an index of the reference member and detecting a change in relative angle between the first supporting member and the second supporting member, 1 detection apparatus is provided.

Fig. 1 is a diagram showing the entire configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.
Fig. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of Fig. 1;
3 is a diagram showing the arrangement relationship between an alignment microscope and a drawing line on a substrate.
Fig. 4 is a view showing a configuration of a rotary drum and an image drawing apparatus of the exposure apparatus shown in Fig. 1. Fig.
Fig. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of Fig. 1. Fig.
Fig. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of Fig. 1;
Fig. 7 is a diagram showing the arrangement relationship of a plurality of scanners (scanners) in the exposure apparatus of Fig. 1. Fig.
8 is a perspective view showing the alignment microscope on the substrate and the arrangement relationship between the imaging line and the encoder head.
Fig. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of Fig. 1;
10 is a plan view showing the arrangement of an encoder head of the exposure apparatus of FIG.
Fig. 11 is a plan view showing the arrangement relationship between the rotary drum and the painting apparatus in the exposure apparatus of Fig. 1; Fig.
12 is a flowchart related to an adjusting method of the exposure apparatus according to the first embodiment.
13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment.
14 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the third embodiment.
Fig. 15 is a view showing a configuration of a rotary drum and an image drawing apparatus of the exposure apparatus according to the fourth embodiment.
16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to the fifth embodiment.
Fig. 17 is a plan view showing the arrangement of a scale original of the exposure apparatus according to the sixth embodiment. Fig.
18 is a flowchart showing a device manufacturing method according to the first to fifth embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art, and substantially the same ones. In addition, the constituent elements described below can be suitably combined. In addition, various omissions, substitutions or alterations of the constituent elements can be made without departing from the gist of the present invention.

[First Embodiment]

Fig. 1 is a diagram showing the entire configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX for performing exposure processing on a substrate P and the exposure apparatus EX is a substrate processing apparatus that performs various processes on a post- And is assembled in the device manufacturing system 1. First, the device manufacturing system 1 will be described.

<Device Manufacturing System>

The device manufacturing system 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. The flexible display includes, for example, an organic EL display. This device manufacturing system 1 is a device manufacturing system 1 in which a substrate P is fed from a feeding roll (not shown) in which a flexible (flexible) substrate P is wound in roll form, Roll process in which various processes are successively performed on the substrate P after the processing and the substrate P after the processing is wound on a rotating roll (not shown) as a flexible device. In the device manufacturing system 1 of the first embodiment, the substrate P, which is a film-like sheet, is fed out from the feeding roll, and the substrate P fed out from the feeding roll is sequentially fed to the processing apparatus U1, , The exposure apparatus EX, and the processing apparatus U2, and is wound up on the rotation roll. Here, the substrate P to be processed by the device manufacturing system 1 will be described.

As the substrate P, for example, a foil or the like made of a resin film, a metal such as stainless steel or an alloy is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, And a vinyl acetate resin.

It is preferable that the substrate P be selected so as not to have a significantly large thermal expansion coefficient so as to substantially neglect the deformation amount due to heat which is subjected to various treatments to be performed on the substrate P. For example, The thermal expansion coefficient may be set to be smaller than a threshold value according to the process temperature or the like, for example, by mixing the inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Further, the substrate P may be a very thin glass single layer having a thickness of about 100 mu m manufactured by a float method or the like, or a laminate obtained by bonding the above resin film, foil, or the like to the extremely thin glass .

The substrate P thus constituted is wound into a roll to form a supply roll, and this supply roll is mounted on the device manufacturing system 1. The device manufacturing system 1 equipped with the supply roll repeatedly executes various processes for manufacturing the device on the substrate P fed out from the supply roll. Therefore, the substrate P after the processing becomes a state in which a plurality of devices are arranged. That is, the substrate P fed out from the feeding roll is a multi-surface mounting substrate. The substrate P may be obtained by modifying the surface of the substrate P by a predetermined pretreatment beforehand or by activating the substrate P by forming a fine partition structure (concave-convex structure) for precision patterning on the surface It may be good.

The processed substrate P is recovered as a recovery roll by being wound in a roll shape. The rotating roll is mounted on a dicing device (not shown). The dicing device equipped with the rotation rollers divides (dices) the processed substrate P into devices, thereby forming a plurality of devices. The dimension of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction in which the substrate is short), and the dimension in the length direction (long direction) is 10 m or more . The dimensions of the substrate P are not limited to the above dimensions.

Next, the device manufacturing system 1 will be described with reference to Fig. The device manufacturing system 1 includes a processing apparatus U1, an exposure apparatus EX, and a processing apparatus U2. In Fig. 1, the coordinate system is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is a direction from the processing apparatus U1 to the processing apparatus U2 through the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction within the horizontal plane, and is in the width direction of the substrate P. The Z direction is a direction orthogonal to the X direction and the Y direction (vertical direction).

The process apparatus U1 performs the process of the previous process (preprocessing) on the substrate P subjected to the exposure process in the exposure apparatus EX. The processing apparatus U1 sends the preprocessed substrate P toward the exposure apparatus EX. At this time, the substrate P to be sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

Here, the photosensitive functional layer is formed as a layer (film) by being coated on the substrate P as a solution and dried. A typical example of the photosensitive functional layer is a photoresist, but a photosensitive silane coupling material (SAM) in which the liquid repellency of a portion irradiated with ultraviolet rays is modified is used as a material which does not require development processing, And a photosensitive reducer in which a plating reduction unit is exposed at the portion where the plating is performed. When a photosensitive silane coupling material is used as the photosensitive functional layer, a pattern portion exposed by ultraviolet rays on the substrate P is modified from lyophobic to lyophilic, so that a conductive ink (silver or copper An ink containing conductive nanoparticles) is selectively applied to form a pattern layer. In the case of using the photosensitive reducer as the photosensitive functional layer, since the plating reductant is exposed on the pattern portion exposed by the ultraviolet ray on the substrate P, the substrate P is immediately exposed to the plating liquid containing palladium ions or the like By soaking for a time, a pattern layer of palladium is formed (precipitated).

The exposure apparatus EX draws a pattern such as a circuit for display or wiring on the substrate P supplied from the processing apparatus U1. The exposure apparatus EX will be described later in detail with respect to the exposure of the substrate P by the plurality of imaging lines LL1 to LL5 obtained by scanning each of the plurality of imaging beams LB in a predetermined scanning direction do.

The process apparatus U2 performs a post-process (post-process) on the substrate P subjected to the exposure process in the exposure apparatus EX. In the processing apparatus U2, the substrate P subjected to the exposure process in the exposure apparatus EX is sent. The process apparatus U2 forms a pattern layer of the device on the substrate P by subjecting the substrate P subjected to the exposure process to a predetermined process.

&Lt; Exposure Apparatus (Substrate Processing Apparatus) &gt;

Next, the exposure apparatus EX will be described with reference to Figs. 1 to 9. Fig. Fig. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of Fig. 1; 3 is a diagram showing the arrangement relationship between an alignment microscope and a drawing line on a substrate. Fig. 4 is a view showing a configuration of a rotary drum and an image drawing apparatus of the exposure apparatus shown in Fig. 1. Fig. Fig. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of Fig. 1. Fig. Fig. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of Fig. 1; Fig. 7 is a diagram showing the arrangement relationship of a plurality of scanners (scanners) in the exposure apparatus of Fig. 1. Fig. 8 is a perspective view showing the alignment microscope on the substrate and the arrangement relationship between the imaging line and the encoder head. Fig. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of Fig. 1;

1, the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a so-called raster scanning type imaging exposure apparatus. While transporting the substrate P in the carrying direction, ) Is scanned in a predetermined scanning direction to perform drawing on the surface of the substrate P to form a predetermined pattern on the substrate P. [

1, the exposure apparatus EX includes an imaging apparatus 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control device 16. As shown in Fig. The drawing device 11 has a plurality of drawing modules UW1 to UW5 and is provided with a plurality of drawing modules UW1 to UW5 on a part of the substrate P conveyed by the substrate conveying mechanism 12, . The substrate transport mechanism 12 transports the substrate P transported from the process apparatus U1 in the previous process to the process device U2 in the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect alignment marks and the like formed on the substrate P in order to relatively align (align) the pattern to be drawn on the substrate P with the substrate P. [ The control device 16 controls each section of the exposure apparatus EX, and causes each section to execute processing. The control device 16 may be part or all of the control device that controls the device manufacturing system 1. The control device 16 may be an apparatus different from an upper-level control apparatus, which is controlled by an upper-level control apparatus. The control device 16 includes, for example, a computer.

The exposure apparatus EX includes an apparatus frame 13 (see Fig. 2) for supporting the drawing apparatus 11 and the substrate transport mechanism 12, a rotational position detecting mechanism (see Figs. 4 and 8) . In addition, in the exposure apparatus EX, a light source device CNT for emitting laser light (pulse light) as the imaging beam LB is provided. The exposure apparatus EX guides a drawing beam LB projected from a light source device CNT to a drawing apparatus 11 and projects the drawing beam LB onto a substrate P conveyed by a substrate conveying mechanism 12.

As shown in Fig. 1, the exposure apparatus EX is stored in a temperature control (EVC) chamber EVC. The heating chamber EVC is installed on the mounting surface E of the manufacturing factory via passive or active vibration isolating units SU1 and SU2. The dustproof units SU1 and SU2 are provided on the mounting surface E to reduce the vibration from the mounting surface E. [ The inside of the temperature control chamber (EVC) is maintained at a predetermined temperature, thereby suppressing a change in shape due to the temperature of the substrate (P) conveyed in the inside thereof.

Next, the substrate transport mechanism 12 of the exposure apparatus EX will be described with reference to Fig. The substrate transport mechanism 12 includes an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary drum DR (drum), and the like in order from the upstream side in the transport direction of the substrate P. [ A tension adjustment roller RT2, a drive roller DR6, and a drive roller DR7.

The edge position controller (EPC) adjusts the position in the width direction of the substrate P conveyed from the processing apparatus U1. The edge position controller EPC controls the position of the edge of the substrate P in the width direction of the substrate P fed from the processing apparatus U1 so as to fall within a range of about ten to several tens of micrometers with respect to the target position. The substrate P is moved in the width direction to correct the position of the substrate P in the width direction.

The drive roller DR4 rotates while sandwiching the both sides of the front and back sides of the substrate P carried from the edge position controller EPC and sends the substrate P to the downstream side in the carrying direction, And is conveyed toward the rotary drum DR. The rotary drum DR rotates about the rotation center line AX2 about the rotation center line AX2 extending in the Y direction while supporting the pattern exposed portion on the substrate P in the cylindrical surface shape, (P). In order to rotate the rotary drum DR about the rotation center line AX2, shaft portions Sf2 coaxial with the rotation center line AX2 are provided on both sides of the rotary drum DR. The shaft portion Sf2 is provided with a rotational torque from a driving source (a motor, a reduction gear mechanism or the like) (not shown). The plane passing through the rotation center line AX2 and extending in the Z direction is the center plane p3. The pair of tension adjustment rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and held by the rotary drum DR. The two sets of driving rollers DR6 and DR7 are arranged at a predetermined interval in the conveying direction of the substrate P to give a predetermined elongation (clearance) DL to the substrate P after exposure. The drive roller DR6 rotates while sandwiching the upstream side of the substrate P to be transported and the drive roller DR7 rotates while sandwiching the downstream side of the substrate P to be transported, And transports the substrate P toward the processing apparatus U2. At this time, since the substrate P is given slack DL, the fluctuation of the conveying speed of the substrate P generated on the downstream side in the conveying direction with respect to the driving roller R6 can be absorbed, It is possible to insulate the influence of the exposure process on the substrate P due to the variation of the exposure time.

The substrate transport mechanism 12 adjusts the position of the substrate P transported from the processing apparatus U1 in the width direction by the edge position roller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction is adjusted to the tension adjustment roller RT1 by the drive roller DR4 and the substrate P which has passed through the tension adjustment roller RT1 ) To the rotary drum DR. The substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjustment roller RT2 by rotating the rotary drum DR. The substrate transport mechanism 12 transports the substrate P transported by the tension adjustment roller RT2 to the drive roller DR6 and transports the substrate P transported by the drive roller DR6 to the drive roller DR7 ). The substrate transport mechanism 12 transports the substrate P toward the processing apparatus U2 while giving a slack DL to the substrate P by the drive roller DR6 and the drive roller DR7 do.

Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to Fig. In Fig. 2, the coordinate system is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The exposure apparatus EX includes an imaging apparatus 11 shown in Fig. 1 and an apparatus frame 13 for supporting a rotary drum DR of the substrate transport mechanism 12. As shown in Fig.

The apparatus frame 13 shown in Fig. 2 includes a main body frame 21, a three-point seat (supporting mechanism) 22, a first optical surface plate (surface plate) 23, A rotating mechanism 24, and a second optical surface plate 25, as shown in Fig. The main body frame 21 is provided on the mounting surface E via the dustproof units SU1 and SU2. The main body frame 21 rotatably supports a rotary drum DR and tension adjustment rollers RT1 (not shown) and RT2. The first optical surface plate 23 is rotatably supported on the rotary drum DR And is provided on the upper side in the vertical direction and is provided on the main body frame 21 via the three point sheet 22. The three point sheet 22 is constituted such that the first optical surface plate 23 is supported by three support points 22a The three-point sheet 22 is provided on the other surface of the first optical surface plate 23 with respect to the horizontal plane, The body frame 21 and the three-point seat 22 can be adjusted in the X and Y directions in the X direction and the Y direction at the time of assembling the apparatus frame 13. [ The position between the main frame 21 and the three-point seat 22 is fixed (rigid) after the assembly of the apparatus frame 13 In this way, the main frame 21 and the first optical surface plate 23, which is connected to the medium for a three point seat 22, and functions as the first support member.

The second optical surface plate 25 is provided on the first optical surface plate 23 via the rotating mechanism 24 on the upper side in the vertical direction of the first optical surface plate 23. The second optical surface plate 25, on the other hand, is substantially parallel to the other of the first optical surface plate 23. A plurality of imaging modules UW1 to UW5 of the imaging apparatus 11 are installed on the second optical surface plate 25. [ The rotating mechanism 24 rotates about the predetermined rotational axis I extending in the vertical direction while keeping each of the first optical platen 23 and the second optical platen 25 substantially parallel to each other, The second optical system 25 is rotated with respect to the first optical system table 23. The rotary shaft I extends in the vertical direction in the center plane p3 and passes through a predetermined point in the surface of the substrate P wound around the rotary drum DR (See FIG. 3). The rotation mechanism 24 rotates the second optical disk 25 with respect to the first optical disk 23 so that the plurality of imaging modules UW1- 5) can be adjusted.

Next, the light source device CNT will be described with reference to Figs. 1 and 5. Fig. The light source device CNT is provided on the main body frame 21 of the apparatus frame 13. [ The light source device CNT emits a laser beam as a drawing beam LB projected onto the substrate P. [ The light source device CNT has a light source that emits light in a negative wavelength region which is suitable for exposure of the photosensitive functional layer on the substrate P and has strong photoactive action. As a light source, for example, a laser light source that emits a third harmonic laser light (wavelength 355 nm) of YAG or a semiconductor light source that emits a seed light of an infrared wavelength range is amplified by a fiber amplifier, And a fiber amplifier laser light source that emits laser light having an ultraviolet wavelength in a wavelength range of 400 nm or less by a crystal element that generates harmonics. In this case, the ultraviolet laser light to be emitted may be continuous oscillation, pulsed laser light oscillating at a frequency of 100 MHz or more, and the light emission time per pulse is several tens of picoseconds or less. Examples of the light source include a lamp light source such as a mercury lamp having a negative line (g line, h line, i line, etc.), a laser diode having an oscillation peak in an ultraviolet region with a wavelength of 450 nm or less, (Wavelength: 248 nm), ArF excimer laser light (wavelength: 193 nm), XeCl excimer laser light (wavelength: 308 nm), and the like, which generate a solid light source such as an ultraviolet light (LED) or a KrF excimer laser light A light source can be used.

Here, the imaging beam LB emitted from the light source device CNT is incident on a polarizing beam splitter PBS described later. The imaging beam LB is a beam of light that is incident on the polarizing beam splitter PBS in such a manner that the imaging beam LB is incident on the polarizing beam splitter PBS so that energy loss can be prevented from being caused by separation of the imaging beam LB by the polarizing beam splitter PBS. It is preferable to use a light flux (light flux) which is totally reflected. The polarizing beam splitter PBS reflects a light flux that becomes linearly polarized light of S polarized light and transmits the light flux that becomes linearly polarized light of P polarized light. Therefore, in the light source device CNT, it is preferable that the imaging beam LB incident on the polarizing beam splitter PBS emits a laser beam that becomes a light flux of linearly polarized light (S polarized light). Since the energy density of the laser beam is high, the illuminance of the light beam projected onto the substrate P can be appropriately secured.

Next, the drawing apparatus 11 of the exposure apparatus EX will be described. The drawing apparatus 11 is a so-called multi-beam drawing apparatus 11 using a plurality of drawing modules UW1 to UW5. The drawing device 11 is a device that draws a plurality of drawing beams LB projected from a light source device CNT and divides the plurality of drawing beams LB into a plurality of (For example, five) drawing lines LL1 to LL5, respectively. The patterning device 11 connects the patterns drawn on the substrate P with each other in the width direction of the substrate P by each of the plurality of drawing lines LL1 to LL5. First, a plurality of drawing lines LL1 to LL5 formed on a substrate P by scanning a plurality of drawing beams LB with the drawing apparatus 11 will be described with reference to Fig. 3. Fig.

As shown in Fig. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 therebetween. The odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotational direction. On the substrate P on the downstream side in the rotating direction, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged.

Each drawing line LL1 to LL5 is formed along the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary drum DR, and the length of the substrate P in the width direction . More precisely, each of the rendering lines LL1 to LL5 is a pattern of a pattern obtained by a plurality of rendering lines LL1 to LL5 when the substrate P is transported at the reference speed by the substrate transport mechanism 12. [ Is slightly inclined by a predetermined angle with respect to the rotational center line AX2 of the rotary drum DR so that the error is minimized.

The odd-numbered first drawing line LL1, the third drawing line LL3 and the fifth drawing line LL5 are arranged in the direction (axial direction) in which the rotation center line AX2 of the rotary drum DR extends Respectively. In addition, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at a predetermined interval in the axial direction of the rotary drum DR. At this time, the second drawing line LL2 is disposed between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third rendering line LL3 is disposed between the second rendering line LL2 and the fourth rendering line LL4 in the axial direction. The fourth rendering line LL4 is disposed between the third rendering line LL3 and the fifth rendering line LL5 in the axial direction. The first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width in the width direction (axial direction) of the exposure area A7 to be drawn on the substrate P. [

The scanning direction of the imaging beam LB scanned along the odd-numbered first imaging line LL1, the third imaging line LL3, and the fifth imaging line LL5 is in the one-dimensional direction, . The scanning direction of the imaging beam LB scanned along the even-numbered second imaging line LL2 and the fourth imaging line LL4 is in the one-dimensional direction and in the same direction. At this time, the scanning direction of the imaging beam LB scanned along the odd-numbered imaging lines LL1, LL3 and LL5 and the scanning direction of the imaging beam LB scanned along the even-numbered imaging lines LL2 and LL4 The direction is opposite. Therefore, the drawing start positions of the odd-numbered drawing lines LL1, LL3, and LL5 and the drawing start positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the conveying direction of the substrate P , The drawing end positions of the odd-numbered drawing lines LL1, LL3, and LL5 are adjacent to the drawing end positions of the even-numbered drawing lines LL2 and LL4.

Next, the drawing apparatus 11 will be described with reference to Figs. 4 to 7. Fig. The drawing apparatus 11 includes a plurality of drawing modules UW1 to UW5 and a beam distribution optical system for branching the drawing beam LB from the light source apparatus CNT and guiding the drawing beam LB to a plurality of drawing modules UW1 to UW5 (SL), and a calibration detection system 31 for performing calibration.

The beam distribution optical system SL divides a plurality of imaging beams LB emitted from the light source device CNT into a plurality of imaging beams LB toward the plurality of imaging modules UW1 to UW5 . The beam distribution optical system SL includes a first optical system 41 for splitting the imaging beam LB emitted from the light source device CNT into two and a first imaging optical system 41 for splitting the one imaging beam LB And a third optical system 43 irradiated with the other imaging beam LB which is diverged by the first optical system 41. The second optical system 42 irradiates the other imaging beam LB, The beam distribution optical system SL includes an XY hemispherical adjustment mechanism 44 and an XY hemispherical adjustment mechanism 45. [ A part of the beam distribution optical system SL on the side of the light source device CNT is provided on the main body frame 21 while another part of the side of the imaging modules UW1 to UW5 is provided on the second optical surface plate 25 have.

The first optical system 41 includes a half wave plate 51, a polarizing mirror 52, a beam diffuser 53, a first reflecting mirror 54, a first relay lens 55, A second reflection mirror 56, a second reflection mirror 57, a third reflection mirror 58, a fourth reflection mirror 59, and a first beam splitter 60.

The imaging beam LB emitted from the light source device CNT in the + X direction is irradiated to the 1/2 wave plate 51. The 1/2 wave plate 51 is rotatable within the irradiation surface of the imaging beam LB. The polarization direction of the imaging beam LB irradiated on the 1/2 wave plate 51 is a predetermined polarization direction corresponding to the rotation amount of the 1/2 wave plate 51. The imaging beam LB that has passed through the 1/2 wave plate 51 is irradiated to a polarization mirror (deflection beam splitter) The polarizing mirror 52 transmits the imaging beam LB which is a predetermined polarization direction while reflecting the imaging beam LB other than the predetermined polarization direction in the + Y direction. Because of this, the imaging beam LB reflected by the polarizing mirror 52 passes through the 1/2 wave plate 51, and therefore, by the cooperation of the 1/2 wave plate 51 and the polarizing mirror 52 And the beam intensity according to the rotation amount of the 1/2 wave plate 51. That is, the beam intensity of the imaging beam LB reflected by the polarization mirror 52 can be adjusted by rotating the 1/2 wave plate 51 and changing the polarization direction of the imaging beam LB.

The imaging beam LB transmitted through the polarizing mirror 52 is irradiated to the beam diffuser 53. [ The beam diffuser 53 absorbs the imaging beam LB and suppresses leakage of the imaging beam LB irradiated to the beam diffuser 53 to the outside. The imaging beam LB reflected by the polarizing mirror 52 in the + Y direction is irradiated to the first reflecting mirror 54. [ The imaging beam LB emitted to the first reflecting mirror 54 is reflected in the + X direction by the first reflecting mirror 54 and passes through the first relay lens 55 and the second relay lens 56, And the second reflecting mirror 57 is irradiated. The imaging beam LB irradiated onto the second reflecting mirror 57 is reflected in the -Y direction by the second reflecting mirror 57 and is irradiated to the third reflecting mirror 58. [ The imaging beam LB irradiated on the third reflecting mirror 58 is reflected in the -Z direction by the third reflecting mirror 58 and is irradiated to the fourth reflecting mirror 59. [ The imaging beam LB irradiated on the fourth reflecting mirror 59 is reflected by the fourth reflecting mirror 59 in the + Y direction and irradiated to the first beam splitter 60. [ A part of the imaging beam LB irradiated to the first beam splitter 60 is reflected in the -X direction and irradiated to the second optical system 42 while a part of the imaging beam LB is transmitted through the third optical system 43, .

Here, the third reflection mirror 58 and the fourth reflection mirror 59 are provided at a predetermined interval on the rotation axis I of the rotation mechanism 24. The configuration of the light source device CNT including the third reflecting mirror 58 (the portion surrounded by the two-dot chain line on the upper side in the Z direction in Fig. 4) is provided on the main frame 21 side And a plurality of imaging modules UW1 to UW5 including a fourth reflecting mirror 59 (a portion enclosed by a two-dot chain line on the lower side in the Z direction in Fig. 4) Respectively. Therefore, even if the second optical surface plate 25 rotates with respect to the first optical surface plate 23 by the rotation mechanism 24, the third reflection mirror 58 and the fourth reflection mirror 59 , The optical path of the imaging beam LB is not changed. Even if the second optical system 25 rotates with respect to the first optical system 23 by the rotating mechanism 24, the imaging beam LB emitted from the light source device CNT provided on the main frame 21 side, To the plurality of imaging modules UW1 to UW5 provided on the second optical surface plate 25 side.

The second optical system 42 branches and directs one of the imaging beams LB branched from the first optical system 41 to the odd-numbered imaging modules UW1, UW3 and UW5 described later. The second optical system 42 has a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

The imaging beam LB reflected in the -X direction by the first beam splitter 60 of the first optical system 41 is irradiated onto the fifth reflecting mirror 61. [ The imaging beam LB irradiated on the fifth reflection mirror 61 is reflected in the -Y direction by the fifth reflection mirror 61 and is irradiated to the second beam splitter 62. [ A part of the imaging beam LB irradiated to the second beam splitter 62 is reflected and irradiated to one of the odd-numbered imaging modules UW5 (see FIG. 5). The other part of the imaging beam LB irradiated to the second beam splitter 62 is transmitted through the third beam splitter 63. A part of the imaging beam LB irradiated to the third beam splitter 63 is reflected and irradiated to one of the odd-numbered imaging modules UW3 (see Fig. 5). The other part of the imaging beam LB irradiated on the third beam splitter 63 is transmitted through the sixth reflecting mirror 64. The imaging beam LB irradiated on the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and irradiated to one of the odd-numbered imaging modules UW1 (see FIG. 5). In the second optical system 42, the imaging beam LB irradiated on the odd-numbered imaging modules UW1, UW3, UW5 is slightly inclined with respect to the -Z direction (Z axis).

The third optical system 43 branches the other imaging beam LB branched from the first optical system 41 toward the even-numbered imaging modules UW2 and UW4 to be described later. The third optical system 43 has a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

The imaging beam LB transmitted in the Y direction by the first beam splitter 60 of the first optical system 41 is irradiated to the seventh reflection mirror 71. [ The imaging beam LB irradiated on the seventh reflection mirror 71 is reflected by the seventh reflection mirror 71 in the X direction and irradiated to the eighth reflection mirror 72. [ The imaging beam LB irradiated on the eighth reflection mirror 72 is reflected in the -Y direction by the eighth reflection mirror 72 and is irradiated to the fourth beam splitter 73. [ A part of the imaging beam LB irradiated to the fourth beam splitter 73 is reflected and irradiated to one of the even-numbered imaging modules UW4 (see Fig. 5). The other part of the imaging beam LB irradiated to the fourth beam splitter 73 is transmitted through the ninth reflecting mirror 74. The imaging beam LB irradiated on the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74 and irradiated to one of the even-numbered imaging modules UW2. Also in the third optical system 43, the imaging beam LB irradiated on the even-numbered imaging modules UW2, UW4 is slightly inclined with respect to the -Z direction (Z axis).

As described above, in the beam distribution optical system SL, a plurality of imaging beams LB from the light source device CNT are branched toward the plurality of imaging modules UW1 to UW5. At this time, the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 are arranged so that a plurality of imaging modules UW1 to UW5, The reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the imaging beam LB so that the beam intensities of the beam LB are equal to each other.

The XY hemispherical adjustment mechanism 44 is disposed between the second relay lens 56 and the second reflection mirror 57. The XY hemispherical adjustment mechanism 44 adjusts all of the imaging lines LL1 to LL5 formed on the substrate P so as to be capable of fine movement within the screen of the substrate P. [ The XY hemispherical adjustment mechanism 44 is composed of a transparent parallel flat glass which can be tilted in the XZ plane of Fig. 6 and a transparent parallel flat glass which is tiltable in the YZ plane of Fig. The drawing lines LL1 to LL5 formed on the substrate P can be slightly shifted in the X direction or the Y direction by adjusting the inclination amounts of the two parallel flat glass plates.

The XY hemispherical adjustment mechanism 45 is disposed between the seventh reflection mirror 71 and the eighth reflection mirror 72. The XY hemispherical adjustment mechanism 45 is configured to move the even second second drawing line LL2 and the fourth drawing line LL4 out of the drawing lines LL1 to LL5 formed on the substrate P onto the substrate P, In the gravestone image of the grapevine. The XY hemispherical adjustment mechanism 45 is composed of a transparent parallel flat glass that can be tilted in the XZ plane of Fig. 6 and a transparent parallel flat glass that is tiltable in the YZ plane of Fig. 6, similarly to the XY hemispherical adjustment mechanism 44 . The drawing lines LL2 and LL4 formed on the substrate P can be slightly shifted in the X and Y directions by adjusting the inclination amounts of the two parallel flat glass plates.

Next, with reference to Figs. 4, 5 and 7, a plurality of drawing modules UW1 to UW5 will be described. A plurality of drawing modules UW1 to UW5 are provided along a plurality of drawing lines LL1 to LL5. The plurality of imaging modules UW1 to UW5 are irradiated with a plurality of imaging beams LB which are branched by the beam distribution optical system SL, respectively. Each of the imaging modules UW1 to UW5 guides the plurality of imaging beams LB to the respective imaging lines LL1 to LL5. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 form the drawing beam LB To the second to fifth drawing lines LL2 to LL5. As shown in Fig. 4 (and Fig. 1), the plurality of imaging modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The plurality of drawing modules UW1 to UW5 are arranged on the side on which the first, third and fifth drawing lines LL1, LL3 and LL5 are arranged , The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at a predetermined interval in the Y direction. The drawing modules UW1 to UW5 are provided on the side (the + X direction side in Fig. 5) on which the second and fourth drawing lines LL2 and LL4 are disposed, with the center plane p3 therebetween, 2 drawing module UW2 and the fourth drawing module UW4 are arranged. The second drawing module UW2 and the fourth drawing module UW4 are arranged at a predetermined interval in the Y direction. At this time, the second drawing module UW2 is positioned between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Likewise, the third rendering module UW3 is located between the second rendering module UW2 and the fourth rendering module UW4 in the Y direction. The fourth rendering module UW4 is located between the third rendering module UW3 and the fifth rendering module UW5 in the Y direction. 4, the first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5, the second drawing module UW2, and the fourth drawing module UW4, , And arranged symmetrically with respect to the center plane p3 as viewed from the Y direction.

Next, the drawing modules UW1 to UW5 will be described with reference to Fig. Each drawing module UW1 to UW5 has the same configuration, and therefore, the first drawing module UW1 (hereinafter, simply referred to as a drawing module UW1) will be described as an example.

The imaging module UW1 shown in FIG. 4 includes an optical deflector 81 and a polarizing beam splitter (not shown) so as to scan the imaging beam LB along the imaging line LL1 (first imaging line LL1) A quarter wave plate 82, a syringe 83, a bending mirror 84, a telecentric f-? Lens system 85, a Y magnification correcting optical member 86 . A calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

As the optical deflector 81, for example, an acousto-optic modulation element (AOM) is used. The optical deflector 81 is switched ON / OFF by the control device 16 to switch the projection / non-projection of the imaging beam LB to the substrate P at a high speed. Specifically, the imaging beam LB from the beam distribution optical system SL is irradiated to the optical deflector 81 with a slight inclination in the -Z direction through the relay lens 91 in the second optical system 42 . When the optical deflector 81 is switched OFF, the imaging beam LB goes straight in an inclined state and is shielded by the light shield plate 92 provided before passing through the optical deflector 81. [ On the other hand, when the optical deflector 81 is switched ON, the imaging beam LB incident on the optical deflector 81 becomes the first-order diffracted beam and is deflected in the -Z direction, And is irradiated to a deflection beam splitter PBS provided on the Z direction of the optical deflector 81. [ Therefore, when the optical deflector 81 is switched ON, the imaging beam LB is projected on the substrate P, and when the imaging beam LB is switched OFF, the optical deflector 81 does not project the imaging beam LB onto the substrate P Projection).

The deflection beam splitter PBS reflects the imaging beam LB irradiated from the optical deflector 81 via the relay lens 93. On the other hand, the deflection beam splitter PBS cooperates with the 1/4 wave plate 82 provided between the deflection beam splitter PBS and the syringe 83 to irradiate the imaging beam LB (spot light) (Or the outer circumferential surface of the rotary drum DR). That is, the imaging beam LB irradiated from the optical deflector 81 to the polarizing beam splitter PBS is a laser beam that becomes linearly polarized light of S polarized light and is reflected by the polarizing beam splitter PBS. The imaging beam LB reflected by the polarizing beam splitter PBS passes through the 1/4 wave plate 82 and is irradiated to the substrate P. The imaging beam LB is transmitted from the substrate P to the 1/4 wave plate 82 The laser beam becomes linearly polarized light of P polarized light. Therefore, the reflected light generated from the substrate P (or the outer peripheral surface of the rotary drum DR) and irradiated to the polarizing beam splitter PBS transmits the polarizing beam splitter PBS. The reflected light transmitted through the polarizing beam splitter PBS is irradiated to the calibration detection system 31 via the relay lens 94. On the other hand, the imaging beam LB reflected by the deflection beam splitter PBS passes through the quarter wave plate 82 and is irradiated to the syringe 83. [

4 and 7, the syringe 83 has a reflecting mirror 96, a rotating polygon mirror (rotary polygonal mirror) 97, and an origin detector 98. The reflecting mirror 96, The imaging beam LB having passed through the 1/4 wave plate 82 is irradiated to the reflection mirror 96 via the relay lens 95. The imaging beam LB reflected by the reflection mirror 96 is directed to the rotating polygon mirror 97. [ The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces (for example, eight surfaces) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 continuously changes the reflection angle of the imaging beam LB irradiated on the reflection surface 97b by rotating the rotation polygon mirror 97 in the predetermined rotation direction around the rotation axis 97a, And the drawing beam LB is scanned along the drawing line LL1 on the substrate P. [ The imaging beam LB reflected by the rotating polygon mirror 97 is irradiated to the bending mirror 84. [ The origin detector 98 detects the origin of the imaging beam LB that scans along the imaging line LL1 of the substrate P. [ The origin detector 98 is disposed on the opposite side of the reflecting mirror 96 with the imaging beam LB reflected by each reflecting surface 97b therebetween. Therefore, the origin detector 98 detects the imaging beam LB before being irradiated to the f-theta lens system 85. [ That is, the origin detector 98 detects the passing of the imaging beam LB at a timing immediately before the irradiation start position of the imaging line LL1 on the substrate P is irradiated.

The imaging beam LB irradiated from the syringe 83 to the bending mirror 84 is reflected by the bending mirror 84 and irradiated to the f-? Lens system 85. The f-theta lens system 85 includes a telecentric f-theta lens and guides the imaging beam LB reflected from the rotating polygon mirror 97 to the substrate P via the bending mirror 84, In the vertical direction. At this time, the reflective surfaces 97b of the rotating polygon mirror 97 and the subdivided screen of the substrate P are optically and optically aligned with respect to the sub-scanning direction (the longitudinal direction of the substrate P) perpendicular to the drawing line LL1 Of the imaging beam LB directed to the rotating polygon mirror 97 and the optical path of the imaging beam LB projected from the f-theta lens system 85 so as to be conjugate with each other, (Not shown), and a surface fall correction optical system cooperating with the f-theta lens system 85 is also provided.

Here, as shown in Fig. 7, the plurality of syringes 83 in the plurality of imaging modules UW1 to UW5 are symmetrical with respect to the center plane p3 therebetween. The plurality of syringes 83 are arranged such that the three syringes 83 corresponding to the imaging modules UW1, UW3 and UW5 are arranged on the upstream side in the rotational direction of the rotary drum DR And the two syringes 83 corresponding to the imaging modules UW2 and UW4 are disposed on the downstream side (the + X direction side in Fig. 7) in the rotational direction of the rotary drum DR. The three syringes 83 on the upstream side and the two syringes 83 on the downstream side are disposed opposite to each other with the center plane p3 therebetween. At this time, each of the syringe 83 disposed on the upstream side and each syringe 83 disposed on the downstream side is configured to be 180 degrees symmetrical about the rotational axis I. Therefore, when the three rotating polygon mirrors 97 on the upstream side are rotated in the leftward direction (counterclockwise in the XY plane) and the imaging beam LB is irradiated on the rotating polygon mirror 97, 97) is scanned in a predetermined scanning direction (for example, + Y direction in FIG. 7) from the drawing start position toward the drawing end position. On the other hand, when the drawing beam LB is irradiated onto the rotating polygon mirror 97 while the two rotating polygon mirrors 97 on the downstream side are rotated in the leftward direction, the writing beam LB reflected by the rotating polygon mirror 97 LB) is scanned in the scanning direction opposite to the three rotating polygon mirrors 97 on the upstream side (e.g., the -Y direction in Fig. 7) from the imaging start position to the imaging end position.

4, the axis of the imaging beam LB extending from the odd-numbered imaging modules UW1, UW3, UW5 to the substrate P is aligned in the direction coinciding with the mounting diagonal line Le1 . That is, the mounting diagonal line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotational center line AX2 in the XZ plane. Likewise, the axis of the imaging beam LB from the even-numbered imaging modules UW2, UW4 to the substrate P in the XZ plane of Fig. 4 is aligned with the mounting diagonal line Le2 . That is, the mounting diagonal line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotational center line AX2 in the XZ plane.

The Y magnification correction optical member 86 is disposed between the f-theta lens system 85 and the substrate P. [ The Y magnification correcting optical member 86 enlarges or reduces the dimension in the Y direction of the drawing lines LL1 to LL5 formed by the drawing modules UW1 to UW5 by a small amount.

In the drawing apparatus 11 configured as described above, each unit is controlled by the controller 16, whereby a predetermined pattern is drawn on the substrate P. [ That is, during the period in which the imaging beam LB projected on the substrate P is being scanned in the scanning direction, the control device 16 acquires the CAD information of the pattern to be drawn on the substrate P , The optical deflector 81 is ON / OFF-modulated to deflect the imaging beam LB and draw a pattern on the photosensitive layer of the substrate P. [ The control device 16 synchronizes the movement of the drawing beam LB for scanning along the drawing line LL1 with the movement of the substrate P in the conveying direction by the rotation of the rotary drum DR, A predetermined pattern is drawn in a portion corresponding to the drawing line LL1 in the area A7.

(Spot diameter) on the substrate P of the imaging beam LB projected from each of the imaging modules UW1 to UW5 is represented by D (μm), the imaging lines LL1 to LL5 of the imaging beam LB, (T / D) when the light source device CNT is a pulsed laser light source and the scanning speed V (占 퐉 / sec) along the scanning direction of the light source device CNT.

Next, the alignment microscopes AM1 and AM2 will be described with reference to Figs. 3 and 8. Fig. The alignment microscopes AM1 and AM2 detect alignment marks formed on the substrate P in advance or reference marks and reference patterns formed on the rotary drum DR. Hereinafter, the alignment marks of the substrate P and reference marks and reference patterns of the rotary drum DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used to align the predetermined pattern to be drawn on the substrate P and the substrate P or to calibrate the rotary drum DR and the drawing apparatus 11 do.

The alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 formed in the drawing apparatus 11 in the rotational direction of the rotary drum DR. The alignment microscope AM1 is arranged on the upstream side of the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.

The alignment microscopes AM1 and AM2 project the illumination light onto the substrate P or the rotary drum DR and are then passed through the objective lens system GA and the objective lens system GA as detection probes, An image pickup system GD for picking up an image of a received mark (a bright field image, a dark field image, a fluorescence image, and the like) with a two-dimensional CCD, CMOS, etc. . The illumination light for alignment is light in a wavelength range which has little sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

The alignment microscopes AM1 are provided in a plurality of (for example, three) in a row in the Y direction (the width direction of the substrate P). Similarly, the alignment microscopes AM2 are provided in a plurality (for example, three) in a line in the Y direction (the width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

3 shows the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lenses GA of the six alignment microscopes AM1 and AM2 for the sake of simplicity. The observation areas Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the objective lenses GA1 to GA3 of the three alignment microscopes AM1 are arranged in the order of rotation Are arranged at predetermined intervals in the Y direction parallel to the center line AX2. As shown in Fig. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all in parallel with the XZ plane. Similarly, observation regions Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the objective lens system GA of the three alignment microscopes AM2 are rotated Are arranged at predetermined intervals in the Y direction parallel to the center line AX2. As shown in Fig. 8, the optical axes La4 to La6 of each objective lens system GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane. The observation regions Vw1 to Vw3 and the observation regions Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary drum DR.

The observation regions Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set in the range of about 200 to 500 占 퐉 on the substrate P and the rotary drum DR . Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set so that the optical axes La1 to La3 of the alignment microscope AM1, (Le3). That is, the installation diagonal line Le3 is a line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of Fig. Likewise, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are inclined from the rotation center line AX2 to the mounting diagonal line AX2, (Le4). That is, the mounting diagonal line Le4 is a line connecting the observation regions Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of Fig. At this time, since the alignment microscope AM1 is disposed on the upstream side of the rotation direction of the rotary drum DR as compared with the alignment microscope AM2, the angle formed by the center plane p3 and the mounting diagonal line Le3 is And the angle formed by the center plane p3 and the mounting diagonal line Le4 is larger.

On the substrate P, as shown in Fig. 3, the exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. A plurality of alignment marks Ks1 to Ks3 (hereinafter referred to as "marks") for alignment are formed, for example, in a cross shape around the exposure area A7 on the substrate P.

3, the mark Ks1 is provided at regular intervals in the X direction in the peripheral region on the -Y side of the exposure region A7 and the mark Ks3 is provided in the peripheral region on the + Y side of the exposure region A7 in the X direction At regular intervals. In addition, the mark Ks2 is provided at the center in the Y direction in the margin area between the two exposure areas A7 adjacent to each other in the X direction.

The mark Ks1 is displayed on the substrate P in the observation region Vw1 of the objective lens system GA1 of the alignment microscope AM1 and in the observation region Vw4 of the objective lens system GA of the alignment microscope AM2. Are sequentially captured while they are being sent. The mark Ks3 is displayed on the substrate P in the observation region Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation region Vw6 of the objective lens system GA of the alignment microscope AM2. Are sequentially captured while they are being sent. In addition, the mark Ks2 is formed in the observation region Vw2 of the objective lens system GA2 of the alignment microscope AM1 and in the observation region Vw5 of the objective lens system GA of the alignment microscope AM2, Are formed so as to be sequentially captured while the substrate P is being sent.

Therefore, among the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotary drum DR are aligned with marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P ) Can be constantly observed or detected. Of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 in the center in the Y direction of the rotary drum DR are arranged so that the exposure area A7 between the exposure areas A7 drawn on the substrate P It is possible to constantly observe or detect the mark (Ks2) formed on the margin portion or the like.

Here, since the exposure apparatus EX employs the so-called multi-beam type drawing apparatus 11, the respective drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 are arranged on the substrate P It is necessary to calibrate the plurality of drawing modules UW1 to UW5 so as to suppress the joint accuracy within the allowable range so that the plurality of patterns drawn in the Y direction can be mutually preferably in the Y direction. It is also possible to determine the relative placement relationship (or the relationship between the relative positions of the observation regions Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the respective drawing lines LL1 to LL5 of the plurality of imaging modules UW1 to UW5 The wrong vehicle) is called the baseline, and the relative arrangement and error must be precisely demanded by baseline management. Calibration is also required for baseline management.

Calibration for confirming the connection accuracy by the plurality of imaging modules UW1 to UW5 and calibration for the baseline management of the alignment microscopes AM1 and AM2 are performed in the same manner as in the first embodiment except that the outer peripheral surface of the rotary drum DR supporting the substrate P It is necessary to provide a reference mark or reference pattern at least in part. Thus, as shown in Fig. 9, in the exposure apparatus EX, a rotary drum DR provided with a reference mark and a reference pattern on its outer peripheral surface is used.

Scale parts GPa and GPb constituting a part of a rotational position detecting mechanism 14 to be described later are formed on both end sides of the outer circumferential surface of the rotary drum DR. The rotating drum DR is provided with regulating belts CLa and CLb having a narrow width by a concave groove or a convex rim inside the scale parts GPa and GPb It is carved over the whole circumference. The width of the substrate P in the Y direction is set to be smaller than the interval between the two restraints CLa and CLb in the Y direction and the substrate P is held between the restraints CLa, CLb. &Lt; / RTI &gt;

The rotary drum DR has a plurality of line patterns RL1 inclined at +45 degrees to the rotational center line AX2 and a plurality of line patterns RL1 inclined at an angle of -45 degrees with respect to the rotational center line AX2 on the outer peripheral surface positioned between the restraints CLa, There is provided a mesh-shaped reference pattern (also usable as a reference mark) RMP in which a plurality of slanted line patterns RL2 are repeatedly engraved at predetermined pitches (periods) Pf1 and Pf2.

The reference pattern RMP is formed in such a manner that a uniform inclined pattern (oblique lattice pattern) is formed on the front surface of the rotary drum DR so as to prevent the frictional force and the tension of the substrate P from being changed, Pattern). It should be noted that the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees and the line pattern RL1 may be parallel to the Y axis and the line pattern RL2 may be parallel to the X axis, I do not mind. It is not necessary to intersect the line patterns RL1 and RL2 at 90 degrees and a rectangular area surrounded by two adjacent line patterns RL1 and two adjacent line patterns RL2 is a square (or rectangular) The line patterns RL1 and RL2 may be intersected with each other at an angle of a rhombic shape.

Next, the rotational position detecting mechanism 14 will be described with reference to Figs. 3, 4 and 8. Fig. As shown in Fig. 8, the rotational position detecting mechanism 14 optically detects the rotational position of the rotary drum DR, and an encoder system using, for example, a rotary encoder is applied. The rotary position detecting mechanism 14 is configured to include a plurality of encoder heads (reading heads) GPa and GPb provided at both ends of the rotary drum DR and a plurality of encoder heads ) (EN1, EN2, EN3, EN4). 4 and 8 show only four encoder heads EN1, EN2, EN3 and EN4 opposed to the scale part GPa, the same encoder heads EN1, EN2, EN3 and EN4 (See Fig. 10).

The scale parts GPa and GPb are formed annularly over the whole circumferential direction of the outer circumferential surface of the rotary drum DR. The scale of the scale parts GPa and GPb is a diffraction grating having a concave or convex grid line engraved with a constant pitch (for example, 20 占 퐉) in the circumferential direction of the outer peripheral surface of the rotary drum DR, (incremental type) scale. Therefore, the scale parts GPa and GPb rotate integrally with the rotary drum DR around the rotation center line AX2.

The substrate P is configured so as to be wound inside the regulating bases CLa and CLb inside the scraper portions GPa and GPb at both ends of the rotary drum DR. The outer circumferential surface of the part of the schedules GPa and GPb and the outer circumferential surface of the part of the substrate P wound around the rotary drum DR are set to be the same surface (same radius from the center line AX2) . To this end, the outer peripheral surface of the scale parts GPa and GPb may be made as large as the thickness of the substrate P in the radial direction with respect to the peripheral surface for substrate coating of the rotary drum DR. The outer circumferential surface of the schedules GPa and GPb formed on the rotary drum DR can be set to have substantially the same radius as the outer circumferential surface of the substrate P. [ Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the schedules GPa and GPb at the same position in the radial direction as that of the embroidery image on the substrate P wound around the rotary drum DR, The Abbe error caused by the difference in position and processing position in the radial direction of the rotation system can be reduced.

The encoder heads EN1, EN2, EN3 and EN4 are respectively arranged around the scale parts GPa and GPb from the rotation center line AX2 and are located at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN1, EN2, EN3 and EN4 are connected to the control device 16. [ The encoder heads EN1, EN2, EN3 and EN4 project the measurement light beam toward the scale parts GPa and GPb and photoelectrically detect the reflected light flux (diffracted light) (For example, a two-phase signal having a phase difference of 90 degrees) in accordance with a change in the position in the circumferential direction of the control device 16. The control device 16 performs digital processing by interpolating (interpolating) detection signals (two-phase signals) from each of the encoder heads EN1 to EN4 by a counter circuit (not shown) It is possible to measure the positional change in the circumferential direction of the outer circumferential surface of the rotary drum DR at the respective installation positions of the encoder heads EN1 to EN4 with the resolution of submicron. At this time, the control device 16 can measure the conveyance speed of the substrate P in the rotary drum DR and the movement amount in the circumferential direction from the angle change of the rotary drum DR.

4 and 8, the encoder head EN1 is disposed on the mounting diagonal line Le1. The mounting diagonal line Le1 connects the projection area (detection position) onto the scale part (GPa (GPb)) of the measurement light beam by the encoder head EN1 and the rotation center line AX2 in the XZ plane Line. In addition, as described above, the mounting diagonal line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. The line connecting the read position of the encoder head EN1 with the rotation center line AX2 and the line connecting the rendering lines LL1, LL3, LL5 and the rotation center line AX2 are the same diagonal line.

Similarly, as shown in Figs. 4 and 8, the encoder head EN2 is disposed on the mounting diagonal line Le2. The mounting diagonal line Le2 is a line connecting the projection area onto the scale part GPa (GPb) of the measurement light beam by the encoder head EN2 and the rotation center line AX2 in the XZ plane . In addition, as described above, the mounting diagonal line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. The line connecting the read position of the encoder head EN2 with the rotation center line AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 are the same diagonal lines.

As shown in Figs. 4 and 8, the encoder head EN3 is disposed on the mounting diagonal line Le3. The installation diagonal line Le3 is a line connecting the projection area onto the scale part GPa (GPb) of the measurement light beam by the encoder head EN3 and the rotation center line AX2 in the XZ plane . As described above, the mounting diagonal line Le3 is a line connecting the observation regions Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center line AX2 in the XZ plane . The line connecting the reading position of the encoder head EN3 with the rotation center line AX2 and the line connecting the observation regions Vw1 to Vw3 and the rotation center line AX2 of the alignment microscope AM1 are set to the same diagonal line .

Similarly, as shown in Figs. 4 and 8, the encoder head EN4 is disposed on the mounting diagonal line Le4. The installation diagonal line Le4 is a line connecting the projection area onto the scale part GPa (GPb) of the measurement light beam by the encoder head EN4 and the rotation center line AX2 in the XZ plane . As described above, the mounting diagonal line Le4 is a line connecting the observation regions Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2 in the XZ plane . The line connecting the reading position of the encoder head EN3 to the rotational center line AX2 and the line connecting the observation regions Vw4 to Vw6 and the rotational center line AX2 of the alignment microscope AM2 are set to the same diagonal line .

Le 2, Le 3, and Le 4) of the encoder heads EN 1, EN 2, EN 3, and EN 4 (the angular direction in the XZ plane centering on the rotation center line AX 2) A plurality of imaging modules UW1 to UW5 and encoder heads EN1 and EN2 are arranged such that the mounting diagonal lines Le1 and Le2 are at an angle of ± θ ° with respect to the center plane P3.

Here, the control device 16 detects the rotational angular positions of the schedules (rotary drum DR) (GPa, GPb) by the encoder heads EN1, EN2, and based on the detected rotational angular position, P), the drawing control by the odd-numbered and even-numbered drawing modules UW1 to UW5 is performed. In other words, the controller 16, on the basis of the CAD information of the pattern to be drawn on the substrate P during the period in which the imaging beam LB projected on the substrate P is being scanned in the scanning direction, OFF modulation of the substrate P is performed based on the detected rotation angle position (the movement position of the substrate P) by ON / OFF modulation by the optical deflector 81, The pattern can be precisely drawn on the photosensitive layer of the photoreceptor.

The control device 16 also determines whether or not the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2 based on the scaling factors detected by the encoder heads EN3 and EN4 The relationship between the position of the alignment marks Ks1 to Ks3 on the substrate P and the rotation angle position of the rotary drum DR is stored by storing the rotation angle positions of the rotary drum DR Can be obtained. Likewise, the control device 16 calculates the scale part (GPa) detected by the encoder heads EN3 and EN4 when the reference pattern RMP on the rotary drum DR is detected by the alignment microscopes AM1 and AM2 The position of the reference pattern RMP on the rotary drum DR and the rotation angle position of the rotary drum DR can be obtained by storing the rotation angle position of the rotary drum DR have. As described above, the alignment microscopes AM1 and AM2 can precisely measure the rotational angle position (or circumferential position) of the rotary drum DR at the instant of sampling the mark in the observation regions Vw1 to Vw6 . The exposure apparatus EX aligns a predetermined pattern to be drawn on the substrate P and the substrate P based on the result of the measurement or controls the rotation of the rotary drum DR and the drawing apparatus 11 ).

In the exposure apparatus EX of the multi-beam type, the substrate P is conveyed along the plurality of drawing lines LL1 to LL5 on the substrate P while being conveyed in the conveying direction (longitudinal direction) by the rotary drum DR The imaging beam LB is scanned. Here, the substrate P is wound around a part of the outer circumferential surface of the rotary drum DR, but is rotated by the rotation of the rotary drum DR and the second optical surface plate 25 ) May be displaced relative to each other. As a displacement of the arrangement relationship between the rotary drum DR and the second optical surface plate 25, for example, when the rotational center line AX2 of the rotary drum DR is inclined with respect to the Y direction in the XY plane . In this case, the relative positional relationship between the substrate P wound on the rotary drum DR and the imaging apparatus 11 provided on the second optical surface 25 by displacing the rotary drum DR is , It is displaced from a predetermined relative arrangement relationship (initial setting state) suitable for exposure. Therefore, in the exposure apparatus EX of the first embodiment, in order to measure the relative arrangement relationship between the rotary drum DR and the drawing apparatus 11, the mounting of the encoder heads EN1 to EN4 is performed as shown in Fig. 10 .

10 is a plan view showing the arrangement of an encoder head of the exposure apparatus of FIG. As shown in Fig. 10, the encoder heads (first detecting devices) EN1 and EN2 are mounted on the second optical surface plate 25 via the mounting member 100. [ On the other hand, the encoder heads (second detection devices) EN3 and EN4 are mounted on the main body frame 21 via the mounting member 101, and the alignment microscopes AM1 and AM2 are also mounted on the main frame 21). The encoder heads EN1 and EN2 are provided in pairs corresponding to a pair of the scaffolds GPa and GPb provided on both sides of the rotation center line AX2 of the rotary drum DR. Therefore, the pair of encoder heads EN1 and EN2 detect the respective rotational positions of the schedules GPa and GPb.

A rotation amount measuring device 105 for measuring the rotation amount by the rotation mechanism 24 is provided between the first optical surface plate 23 and the second optical surface plate 25. The rotation amount measuring apparatus 105 is disposed on the side far from the rotation axis I so that a linear encoder is used and the direction in which the linear motion is performed is along the circumferential direction of the rotation axis I, The control device 16 calculates the amount of movement of the second optical disk 25 relative to the first optical disk 25 based on the small amount of movement in the circumferential direction of the rotation axis I detected by the amount- The rotation amount is detected. The rotating mechanism 24 includes a driving section 106 and the driving section 106 is driven and controlled by the control device 16 to rotate the second optical disk 25. At this time, the controller 16 performs drive control of the drive unit 106 to rotate the second optical disk 25 so that the amount of rotation detected by the amount-of-rotation measuring device 105 becomes a predetermined amount of rotation have.

11 is a plan view for explaining a case in which the rotary drum DR and the imaging apparatus 11 (particularly, the second optical surface plate 25) are relatively slightly rotated in the XY plane in the configuration of Fig. 11, the rotation center line AX2 of the rotary drum DR extends in the Y direction. When the rotation center line AX2 is exactly parallel to the Y axis of the stationary coordinate system XYZ, the rotation center line AX2 ) Is assumed to be at the reference position. Here, in the XY plane, it is assumed that the rotation center line AX2 is inclined by a predetermined angle? _Z from the reference position due to the bottom vibration or the vibration from the driving source in the apparatus. In addition, in Figure 11, the displacement of the left turn as + θ _z, and the displacement of the right turn by -θ _z. In the XY plane, when the rotational center line AX2 is inclined by a predetermined angle (min) from the reference position, one end in the axial direction of the rotary drum DR is moved in a predetermined direction (for example, -X While the other end in the axial direction of the rotary drum DR moves in a direction opposite to the one end of the rotary drum DR (for example, the + X direction in Fig. 11).

The pair of encoder heads EN1 and EN2 are arranged such that the rotation center line AX2 is inclined by a predetermined angle? _Z from the reference position to the encoder heads EN1 and EN2 on the side of the scale part GPa (The movement position of the scale part GPa) detected by the encoder heads EN1 and EN2 on the side of the scale part GPb and the rotation position there is a difference according to? z. The control device 16 determines whether or not the inclination angle &amp;thetas;&amp;thetas; of the rotation center line AX2 of the rotary drum DR in the XY plane, based on the rotation position detected by the pair of encoder heads EN1 and EN2 _z can be detected. Specifically, a count value (movement position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN1 on the side of the scale part GPa is referred to as CD1a, an encoder head on the side of the scale part GPb The difference value between the counted value CD1a and the counted value CD1b is set to be larger than the differential value between the counted value CD1a and the counted value CD1b on the rotating drum DR (Inclination angle) in the XY plane of the rotation center line AX2 of the rotary drum DR is obtained by sequentially obtaining the rotation center line AX2 of the rotary drum DR at predetermined angular intervals θ _z ) can be measured. The count value (the movement position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN2 on the side of the scale part GPa is defined as CD2a and the scale part GPb (The moving position of the scale GPb) counted by the counter circuit corresponding to the encoder head EN2 on the side of the encoder head EN2 is CD2b.

In measuring the tilt variation (angle? Z), a pair of encoder heads EN1 and a pair of encoder heads EN2 are disposed between the center faces p3 in the X direction The coefficient value CD1a by the encoder head EN1 and the coefficient value CD2b by the encoder head EN2 opposed to the scale portion GPb are different from each other in the symmetrical position A change in the difference value between the coefficient value CD2a by the encoder head EN2 and the coefficient value CD1b by the encoder head EN1 opposite to the scale part GPb is represented by the change of the difference value, You can monitor.

The control device 16 controls the substrate P to be transported by the rotary drum DR so that the imaging device 11 can perform imaging by the imaging device 11. The control device 16 detects the detection results of the alignment microscopes AM1 and AM2 The position of the painting apparatus 11 with respect to the substrate P is corrected. That is, based on the positions of the marks Ks1 to Ks3 detected by the alignment microscopes AM1 and AM2, the control device 16 determines the shape of the substrate P and the device pattern (Base pattern) region, and obtains a relative correction rotation amount? ₂ corresponding to the detected deformation state (particularly, inclination). The correction rotation amount? ₂ is an angle from a reference line extending in the X direction. In Fig. 11, the left-turn displacement is +? 2 and the right-turn displacement is-? 2. The control device 16 controls the drive section 106 of the rotation mechanism 24 based on the obtained correction rotation amount ₂ so that the second optical system 25 ) Is corrected.

At this time, the controller 16, based on the relative correction amount of rotation (θ ₂₎ obtained, the rotation mechanism 24 by rotating the correction (second optical surface plate 25) from the initial position, the encoder head (EN1, EN2 are also rotated, the inclination? _Z of the rotation center line AX2 measured after the rotation correction can not be taken into consideration, that is, no meaning is produced. Therefore, the control device 16 takes the slope? _Z of the rotational center line AX2 measured beforehand (or immediately before) and calculates the correction amount? ₂ based on the correction rotation amount? ₂ .

Specifically, the controller 16, the alignment microscope (AM1, AM2) relative correction amount of rotation (θ _2), the measurement in accordance with a result of detection of such a zero, i.e., "θ ₂ -θ _z (= 0 ° Is rotated by the rotation amount measurement device 105 while measuring the rotation amount by the rotation mechanism 24 so that the rotation amount of the rotation mechanism 24 is zero.

In this way, based on the detection results of the pair of encoder heads EN1 and EN2, the control device 16 determines, from a predetermined relative arrangement relationship between the rotary drum DR and the second optical surface plate 25, (Inclination of the rotary drum DR in the XY plane) (θ _z ) of the rotation center line AX2 in the XY plane which is misalignment information and obtains the substrate P obtained by the alignment microscopes AM1 and AM2, In order to reduce the deviation between the correction rotation amount? ₂ corresponding to the inclination in the XY plane of the rotation center line AX2 and the inclination? _Z of the rotation center line AX2, that is, The driving unit 106 is controlled by the control unit 106. [

Next, a method of adjusting the exposure apparatus EX will be described with reference to FIG. 12 is a flowchart related to an adjusting method of the exposure apparatus according to the first embodiment. The controller 16 controls the position of the rotary drum DR and the arrangement position of the second optical platen 25 by the rotating mechanism 24 so that the drawing can be preferably performed by the drawing apparatus 11 with respect to the substrate P. [ (Inclination of the device pattern region on the substrate P, etc.) detected by the alignment microscopes AM1 and AM2 (step S1). The control device 16 obtains the correction rotation amount? ₂ to be adjusted by the rotation mechanism 24 based on the detection results detected by the alignment microscopes AM1 and AM2 (step S2). Thereafter, the control device 16 acquires information on the inclination? _Z from the comparison of the detection results of the pair of encoder heads EN1 and EN2 (step S3). The control device 16 controls the rotation angle position (count values CD1a, CD1b, CD2a, CD2b) of the respective scale portions GPa and GPb detected by the pair of encoder heads EN1 and EN2 The inclination? _Z of the center line AX2 is obtained (step S4). Then, the controller 16, calculated correction amount of rotation (θ _2), and a deviation of tilt (θ _z) of the rotation center line (AX2), that is, "θ ₂ -θ _z" becomes zero, the rotation mechanism (24 (Step S5). After this step S5, the control device 16 sets the rotation angle positions (the count values CD1a, CD1b, and CD1b) of the scale portions GPa and GPb detected again by the pair of encoder heads EN1 and EN2, based on CD2a, CD2b)), it calculates a new inclination (θ _'z) of the rotation center line (AX2) with a suitable time interval. Then, when the new slope? ' _Z is changed by the vibration of the apparatus, the rotation mechanism 24 is feedback-controlled so that the new slope?' _Z is maintained.

As described above, in the first embodiment, since the encoder heads EN1 and EN2 are mounted on the second optical surface plate 25, the exposure apparatus EX can detect XY (The slope? _Z of the rotation center line AX2) from the predetermined relative arrangement relationship between the rotary drum DR and the second optical surface plate 25 in the plane can be obtained. Then, the exposure apparatus EX can correct the relative arrangement relationship between the rotary drum DR and the second optical system 25 on the basis of the obtained displacement information. Therefore, even if the position of the rotary drum DR is displaced due to the influence of vibration or the like due to the rotation of the rotary drum DR, the exposure apparatus EX can not rotate the rotary drum DR and the second optical system 25 It is possible to perform drawing with the drawing apparatus 11 with high accuracy with respect to the substrate P.

In the first embodiment, the encoder heads EN1 and EN2 can be provided on the mounting diagonal lines Le1 and Le2. Therefore, the direction in which the encoder head EN1 and the rotational center line AX2 are connected and the direction in which the odd-numbered drawing lines LL1, LL3, LL5 and the rotational center line AX2 are connected to each other can be the same direction. Similarly, the direction in which the encoder head EN2 and the rotation center line AX2 are connected to each other and the direction in which the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 are connected to each other can be the same direction. Therefore, the arrangement relationship between the encoder heads EN1 and EN2 and the drawing lines LL1 to LL5 can be matched. Therefore, even if the position of the rotary drum DR is displaced, the arrangement relationship of the drawing lines LL1 to LL5 with respect to the rotary drum DR can be accurately measured by the encoder heads EN1 and EN2, It is possible to perform measurement which is less susceptible to the influence of external disturbance.

In the first embodiment, the encoder heads EN3 and EN4 can be mounted on the main frame 21. Therefore, the exposure apparatus EX can measure the marks Ks1 to Ks3 by the alignment microscopes AM1 and AM2 on the basis of the detection results of the encoder heads EN3 and EN4, The bearing portion of the drum DR) as a stopping reference. The exposure apparatus EX can obtain the relative correction rotation amount? ₂ to be corrected by the rotation mechanism 24 based on the detection results of the alignment microscopes AM1 and AM2. Therefore, the exposure apparatus EX is capable of correcting the difference between the obtained correction rotation amount? ₂ and the slope? _Z of the rotation center line AX2, which is shift information, ) Can be precisely corrected.

In the first embodiment, the encoder heads EN3 and EN4 can be provided on the mounting diagonal lines Le3 and Le4. Therefore, the direction in which the encoder head EN3 and the rotation center line AX2 are connected to each other and the direction in which the observation regions Vw1 to Vw3 and the rotation center line AX2 are connected to each other can be the same direction. The direction in which the encoder head EN4 and the rotation center line AX2 are connected to each other and the direction in which the observation regions Vw4 to Vw6 and the rotation center line AX2 are connected to each other can be the same direction. Therefore, the arrangement relationship of the encoder heads EN3 and EN4 and the arrangement relationship of the observation regions Vw1 to Vw6 can be matched. Therefore, even if the position of the rotary drum DR is displaced, the arrangement relationship of the observation regions Vw1 to Vw6 with respect to the rotary drum DR can be precisely measured by the encoder heads EN3 and EN4, It is possible to perform the measurement which is less susceptible to the influence by the sensor.

The first embodiment differs from the first embodiment in that the rotation mechanism 24 rotates the second optical platen 25 relative to the first optical platen 23 so that the rotation of the rotary drum DR and the second optical platen 25 The placement relationship can be corrected. Therefore, the exposure apparatus EX is configured such that the drawing lines LL1 to LL5 formed by the drawing apparatus 11 provided on the second optical surface plate 25 are arranged on the substrate P wound on the rotary drum DR So that it is possible to perform drawing by the drawing apparatus 11 with high precision on the substrate P. Further,

In the first embodiment, steps S1 and S2 for obtaining the correction rotation amount? ₂ are executed, and then steps S3 and S4 for obtaining shift information are executed. However, the present invention is not limited to this configuration. Steps S1 and S2 for obtaining the correction rotation amount? ₂ and steps S3 and S4 for obtaining shift information may be performed in parallel. After executing steps S3 and S4 for obtaining shift information, The steps S1 and S2 for obtaining the rotation amount [theta] ₂ may be executed.

[Second Embodiment]

Next, the exposure apparatus EX of the second embodiment will be described with reference to Fig. 13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment. In the second embodiment, only parts different from those of the first embodiment will be described so as to avoid overlapping with the first embodiment. The same components as those of the first embodiment are the same as those of the first embodiment And a description thereof will be given. In the exposure apparatus EX of the first embodiment, as the displacement of the arrangement relationship between the rotary drum DR and the second optical surface plate 25, the rotational center line AX2 of the rotary drum DR And is inclined with respect to the X direction (reference position). In the exposure apparatus EX of the second embodiment, as the displacement of the arrangement relationship between the rotary drum DR and the second optical surface plate 25, the rotation center line AX2 of the rotary drum DR The Y-direction (reference position) will be described.

As shown in Fig. 13, the three-point sheet 22 functions as a connecting mechanism for connecting the main body frame 21 and the first optical surface plate 23 and the second optical surface plate 25. [ Here, in the first embodiment, the main body frame 21 and the first optical surface plate 23, which are connected via the three-point sheet 22, function as a first support member and the second optical surface plate 25 And functions as a second supporting member, and the rotating mechanism 24 functions as a connecting mechanism. In the second embodiment, the first optical base 23 and the second optical base 25, which function as the first support members and are connected to each other via the rotation mechanism 24, And the three-point seat 22 functions as a connecting mechanism.

The three-point seat 22 includes a driving unit 110 including a motor and a piezo element and the driving unit 110 is driven and controlled by the control unit 16 to drive the three- Thereby adjusting the inclination of the first optical system table 23 with respect to the main body frame 21. In this way, Here, the rotation center line AX2 extends in the Y direction, and the position of the rotation center line AX2 extending in the Y direction is set as the reference position. In the YZ plane, the rotation center line AX2 serving as the reference position is inclined by a predetermined angle from the reference position due to the influence of vibration or the like caused by rotation. When the rotation center line AX2 is inclined by a predetermined angle from the reference position, one end in the axial direction of the rotary drum DR moves in a predetermined direction (for example, -Z direction in Fig. 13) The other end in the axial direction of the rotary drum DR relatively moves in a direction opposite to the one end of the rotary drum DR (for example, the + Z direction in Fig. 13).

Therefore, when the pair of encoder heads EN1 and EN2 are mounted on the side of the second optical surface plate 25 (or the first optical surface plate 23), the rotational center line AX2 is moved (Count values CD1a and CD2a) detected by the encoder heads EN1 and EN2 on the side of the scale part GPa and the rotational angular positions There may be a difference in rotational angular positions (the count values CD1b and CD2b) detected by the encoder heads EN1 and EN2. Therefore, the control device 16 controls the YZ plane of the rotation center line AX2 of the rotary drum DR in the YZ plane based on the rotation angle position detected by the pair of encoder heads EN1 and EN2 It is possible to detect a change in the inclination within a predetermined range. It should be noted that information on the rotational angular position detected by the encoders EN1 and EN2 on the side of the scale part GPa and the encoder heads EN1 and EN2 on the side of the part of the scale GPb includes the rotational center line AX2 The displacement in the Z direction of the rotation center line AX2 (the rotary drum DR) has little sensitivity and has a sensitivity to the displacement of the rotation center line AX2 (rotary drum DR) in the X direction as in the first embodiment have.

Thus, in the second embodiment, by using the directions of the pair of encoder heads EN3 and EN4 arranged with the mounting orientations of the alignment microscopes AM1 and AM2 shown in Figs. 4, 8, 10 and 11, The displacement of the both ends of the center line AX2 (rotary drum DR) in the Z direction is measured. Therefore, as shown in Figs. 10 and 11, the encoder heads EN3 and EN4 mounted on the main frame 21 are mounted on the first optical platen 23 or the second optical platen 25, (Counter values CD3a and CD4a of the corresponding counter circuit) detected by a pair of encoder heads EN3 and EN4 opposed to the scale portion GPa and a pair of encoder heads On the rotational center line AX2 of the reference position in the YZ plane based on the difference between the rotation angle position detected by the rotation angle sensor EN3 and the rotation angle position EN4 of the counter circuit (CD3b, CD4b of the corresponding counter circuit) The inclination of the rotation center line AX2 of the drive shaft DR may be detected.

The control unit 16 then controls the rotary drum DR and the second optical platen (hereinafter referred to as the first optical system) based on the detection results (the count values CD3a, CD3b, CD4a and CD4b) of the pair of encoder heads EN3 and EN4 25, the inclination of the rotational center line AX2 in the YZ plane as shift information is obtained, and the slope of the calculated rotational center line AX2 is decreased, that is, the predetermined relative arrangement relationship is maintained , The inclination of the entire second optical system 25 is corrected by controlling the driving unit 110 of the three-point sheet 22.

As described above, in the second embodiment, by mounting the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN2) on the second optical surface plate 25, the encoder heads EN3 and EN4 A deviation from a predetermined relative arrangement relationship between the rotary drum DR and the second optical surface plate 25 in the YZ plane is calculated based on the detection result (the difference between the rotational angular positions) of the head (EN1, EN2) Information (displacement in the Z direction or slope in the YZ plane) can be obtained. Then, the exposure apparatus EX can correct the relative arrangement relationship between the rotary drum DR and the second optical system 25 on the basis of the obtained displacement information. Therefore, even if the position of the rotary drum DR is displaced due to the influence of vibration or the like, the exposure apparatus EX can maintain a predetermined relative arrangement relationship between the rotary drum DR and the second optical system 25 As a result, the substrate P can be exposed with high precision.

[Third embodiment]

Next, the exposure apparatus EX of the third embodiment will be described with reference to Fig. 14 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the third embodiment. In the third embodiment, only the parts different from those of the first and second embodiments will be described so as to avoid the overlapping description with the first and second embodiments, and the same constituent elements as those of the first and second embodiments Are denoted by the same reference numerals as those of the first and second embodiments. The position of the drawing apparatus 11 side (on the side of the second supporting member) is displaced by the rotating mechanism 24 and the three-point sheet 22 in the exposure apparatus EX of the first and second embodiments. In the exposure apparatus EX according to the third embodiment, the positions of both ends of the rotary drum DR (rotary center axis AX2) are shifted in the X direction and the Z axis direction by the X movement mechanism 121 and the Z movement mechanism 122, Z direction.

14, the rotary drum DR is provided with shaft portions Sf2 on both sides in the axial direction and each shaft portion Sf2 is rotatably supported on the main frame 21 via bearings 123, And is rotatably supported by a shaft. The X moving mechanism 121 and the Z moving mechanism 122 are provided adjacent to the bearings 123 on both sides and the X moving mechanism 121 and each Z moving mechanism 122 are provided with bearings 123 (Fine movement) in the X direction and the Z direction.

Here, in the third embodiment, the bearing 123 functions as a first supporting member, the apparatus frame 13 functions as a second supporting member, and each X moving mechanism 121 and each Z moving mechanism 122, As a connecting mechanism.

The pair of X moving mechanisms 121 on both sides can move the pair of bearings 123 on both sides in the X direction respectively and the rotation center line AX2 of the rotary drum DR ) And the X-direction position are finely adjusted. Here, similarly to the first embodiment, the rotation center line AX2 extends in the Y direction and assumes the position of the rotation center line AX2 extending in the Y direction as the reference position. In the XY plane, when the rotational center line AX2 serving as the reference position is inclined by a predetermined angle from the reference position due to the influence of vibration or the like, the driving amount of the pair of X moving mechanisms 121 on both sides is The inclination of the rotary drum DR in the XY plane can be corrected.

The pair of Z moving mechanisms 122 on both sides can move the pair of bearings 123 on both sides in the Z direction respectively. In the YZ plane, the rotation center line of the rotary drum DR (AX2) and the Z-direction position are finely adjusted. Here, similarly to the second embodiment, the rotation center line AX2 extends in the Y direction and assumes the position of the rotation center line AX2 extending in the Y direction as the reference position. In the YZ plane, when the rotational center line AX2 serving as the reference position is inclined by a predetermined angle from the reference position due to the influence of vibration or the like, the driving amount of the pair of Z moving mechanisms 122 on both sides is set to be The inclination of the rotary drum DR in the YZ plane can be corrected.

As described in the first embodiment, the pair of encoder heads EN1 and EN2 has a relative inclination in the XY plane between the second optical system 25 and the rotary drum DR (rotation center line AX2) The error can be measured. In the third embodiment, similarly to the second embodiment, when the encoder heads EN3 and EN4 are mounted on the second optical platen 25 (or the first optical platen 23), a pair of encoder heads (EN3 and EN4) can measure the relative tilt error in the YZ plane between the second optical surface plate 25 and the rotary drum DR (rotation center line AX2) as described in the second embodiment have.

Thus, the control device 16 controls the rotation of the rotary drum DR and the second optical system (second optical system) based on the detection results (the count values CD1a, CD1b, CD2a and CD2b) of the pair of encoder heads EN1 and EN2 (The relative inclination? _Z of the rotational center line AX2 in the XY plane) from a predetermined relative arrangement relationship with respect to the XY plane. In addition, the control device 16 measures the inclination of the device pattern region on the substrate P based on the detection results of the alignment microscopes AM1 and AM2, and calculates the correction rotation amount? ₂ ) is obtained. The control device 16 controls the X shift mechanisms on both sides so as to reduce the deviation between the obtained correction rotation amount? ₂ and the inclination? _Z of the rotation center line AX2, that is, 121, respectively. Similarly, the control device 16 controls the rotation of the rotary drum DR and the second optical system (second optical system) based on the detection results (the count values CD3a, CD3b, CD4a and CD4b) of the pair of encoder heads EN3 and EN4 25) from a predetermined relative arrangement relationship between the, displacement information, the YZ plane to obtain the slope (referred to as θ _X) of the rotational center line (AX2) within, so as to decrease the inclination (θ _X) in the obtained rotational center line (AX2) , I.e., the driving amounts of the Z moving mechanisms 122 on both sides are controlled so as to maintain a predetermined relative arrangement relationship.

As described above, in the third embodiment, the rotating drum DR is rotated about the axis parallel to the Z axis with respect to the main body frame 21 by the X moving mechanism 121 in the XY plane, and in the YZ plane The rotary drum DR is rotated about the axis parallel to the X axis with respect to the main body frame 21 by the Z moving mechanism 122 so that the relative arrangement relationship between the rotary drum DR and the second optical system 25 Can be adjusted. Therefore, the exposure apparatus EX is configured such that the drawing lines LL1 to LL5 formed by the drawing apparatus 11 provided on the second optical surface plate 25 are arranged on the substrate P wound on the rotary drum DR And the device pattern can be exposed to the substrate P with high precision.

[Fourth Embodiment]

Next, the exposure apparatus EX of the fourth embodiment will be described with reference to Fig. Fig. 15 is a view showing a configuration of a rotary drum and an image drawing apparatus of the exposure apparatus according to the fourth embodiment. In the fourth embodiment, only the parts different from those of the first to third embodiments are explained so as to avoid the description overlapping with the first to third embodiments, and the same components as those of the first to third embodiments Will be described with the same reference numerals as those of the first to third embodiments. The position of the rotary drum DR is displaced by the X moving mechanism 121 and Z moving mechanism 122 that move the bearing 123 in the exposure apparatus EX of the third embodiment. The position of the rotary drum DR is displaced by the drum supporting frame 130 which is separate from the apparatus frame 13 in the exposure apparatus EX of the fourth embodiment.

As shown in Fig. 15, the drum supporting frame 130 has a drum rotating mechanism 131 and a drum supporting member 132 in order from the lower side in the Z direction. The drum rotating mechanism 131 is provided on the mounting surface E via the dustproof unit SU3. The drum support member 132 is provided on the drum rotation mechanism 131 and rotatably supports the shaft of the rotary drum DR by both supports. The drum rotating mechanism 131 rotates the drum supporting member 132 about the rotation axis Ia parallel to the Z axis (intersecting the rotation center axis AX2) in the XY plane, In the XY plane of the rotation center line AX2.

Since the rotary drum DR is provided on the drum support frame 130, which is separate from the apparatus frame 13, this embodiment is different from the three-point sheet 22 in the first to third embodiments, The first optical surface plate 23 and the rotating mechanism 24 are omitted and only the second optical surface plate 25 and the imaging apparatus 11 supported on the second optical surface plate 25 are provided on the main frame 21. Here, in the fourth embodiment, the drum supporting frame 130 functions as a first supporting member, the apparatus frame 13 functions as a second supporting member, and the drum rotating mechanism 131 functions as a connecting mechanism

Here, the control device 16 calculates Y (Y) based on the detection results (the count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1 and EN2 mounted on the second optical disk 25 The relative inclination? _Z in the XY plane between the rotary drum DR (rotation center line AX2) and the second optical system 25 with respect to the rotation center line AX2 of the reference position extending in the direction do. The control device 16 measures the inclination of the device pattern area on the substrate P based on the detection results of the alignment microscopes AM1 and AM2 and detects the correction rotation amount? ₂ ) is obtained. The control device 16 controls the drum rotation mechanism 131 so as to reduce the deviation between the obtained correction rotation amount? ₂ and the inclination? _Z of the rotation center line AX2, . A pair of encoder heads EN3 and EN4 arranged in the same direction as the mounting orientation of the alignment microscopes AM1 and AM2 are mounted on the second optical platen 25 but mounted on the side of the drum supporting member 132 Maybe.

As described above, in the fourth embodiment, since the rotary drum DR can be rotated with respect to the second optical disk 25 by rotating the drum supporting frame 130 by the drum rotating mechanism 131, DR and the second optical system 25 can be corrected. Therefore, the exposure apparatus EX is arranged so that the substrate P wound on the rotary drum DR is moved to the drawing lines LL1 to LL5 formed by the drawing apparatus 11 provided on the second optical surface plate 25 So that the device pattern can be exposed to the substrate P with high precision.

[Fifth Embodiment]

Next, the exposure apparatus EX of the fifth embodiment will be described with reference to Fig. 16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to the fifth embodiment. In the fifth embodiment, only parts different from those of the first to fourth embodiments will be described so as to avoid a description overlapping with the first to fourth embodiments, and the same components as those of the first to fourth embodiments Will be described with the same reference numerals as those of the first to fourth embodiments. In the exposure apparatus EX of the first embodiment, the inclination of the rotary drum DR is detected by the pair of encoder heads EN1 and EN2. In the fifth embodiment, the inclination of the rotary drum DR is detected by the pair of encoder heads EN1 and EN2 and the pair of encoder heads EN5 and EN6.

As shown in Fig. 16, the pair of encoder heads EN1 and EN2 are attached to the second optical surface plate 25 via the mounting member 100. As shown in Fig. The pair of encoder heads EN5 and EN6 are attached to the main body frame 21 via the mounting member 141. [ Here, each of the encoder head EN1 and each of the encoder heads EN5 is provided adjacent to each other with a constant clearance in the Y direction. The scale parts GPa and GPb are arranged in the Y direction so that the two encoder heads EN1 and EN5 adjacent to each other in the Y direction can detect the respective scale parts GPa and GPb together. Set the width wide.

Since the rotary drum DR is mounted on the main body frame 21, the control device 16 controls the rotation angle position (corresponding counter (s)) detected by each of the pair of encoder heads EN5 and EN6 Theta] _ZR in the XY plane of the rotational center line AX2 of the rotary drum DR is detected based on the count values (CD5a, CD5b, CD6a, and CD6b) _ZR ) as reference positions. That is, the count value CD5a by the encoder head EN5 opposed to the scale part GPa on one side of the rotation center axis AX2 and the count value CD5a by the encoder head EN5 on the opposite side of the rotation center axis AX2, The count value CD6a by the encoder head EN6 opposing the scale part GPa and the count value CD6a by the encoder head EN5 on the other side of the rotation center axis AX2, The slope θ _ZR in the XY plane of the rotary drum DR with respect to the main body frame 21 is changed by the change in the differential value between the scale part GPb and the counter value CD 56 by the encoder head EN6 opposed to the scale part GPb ) Can be measured.

The control device 16 is also capable of rotating based on rotation angle positions (CD1a, CD1b, CD2a, CD2b) detected by the pair of encoder heads EN1 and EN2 The relative inclination? _Z in the XY plane between the drum DR and the second optical surface 25 is obtained. Therefore, the inclination? _ZR measured based on the rotational angle position detected by each of the pair of encoder heads EN5 and EN6 and the rotational angle position detected by the pair of encoder heads EN1 and EN2 on the basis of the inclination (θ _z) is measured on the basis of the second is rotated by an optical surface plate 25, the rotation mechanism 24, second optical surface plate 25 and the imaging device 11 which is supported on it And the body frame 21 (stop reference) without rotation error. However, as in the first embodiment, when the slope error of the device pattern region formed on the substrate P corresponds to the inclination error of the device pattern region measured on the basis of the detection result of the alignment microscopes AM1 and AM2, the rotation mechanism 24 is driven by adding the correction amount according to the angle? ₂ .

As described above, in the fifth embodiment, on the basis of the rotational positions detected by the pair of encoder heads EN5 and EN6, the XY values of the rotational center line AX2 of the rotary drum DR on the basis of the main frame 21 The inclination? _ZR in the plane can be detected. The control device 16 can measure the reference position of the rotation center line AX2 of the rotary drum DR so that the rotation of the rotary drum DR and the second optical system 25 Can be accurately measured. Particularly, in the first exposure in which the pattern for the first layer in the device pattern region is drawn on the substrate P, even if the rotary drum DR is inclined in the XY plane with respect to the body frame 21 serving as a stop reference , It is corrected that the pattern of the first exposure is inclined and transferred on the substrate P.

[Sixth Embodiment]

Next, the exposure apparatus EX of the sixth embodiment will be described with reference to Fig. Fig. 17 is a plan view showing the arrangement of a scale original of the exposure apparatus according to the sixth embodiment. Fig. In the sixth embodiment, only the parts different from those of the first to fifth embodiments are explained so as to avoid the overlapping description with the first to fifth embodiments, and the same components as those of the first to fifth embodiments Will be described with the same reference numerals as in the first to fifth embodiments. In the exposure apparatus EX according to the first to fifth embodiments, the rotation position of the rotary drum DR is detected by using the schedules GPa and GPb formed on the outer peripheral surface of the rotary drum DR. In the exposure apparatus EX of the sixth embodiment, the rotation position of the rotary drum DR is detected by using a scale original SD having a high degree of circularity mounted on the rotary drum DR .

As shown in Fig. 17, this scale original disk SD is provided with scales GPa and GPb on its outer circumferential surface and is fixed to the end portion of the rotary drum DR so as to be orthogonal to the rotational center line AX2. Therefore, the original scale SD rotates integrally with the rotary drum DR around the rotation center line AX2. The scale original disk SD is made to have a diameter as large as possible (for example, 20 cm or more in diameter) in order to increase measurement resolution by using metal, glass, ceramics, or the like having low thermal expansion as a base material. 17 shows that the diameter of the outer peripheral surface of the scale original SD is smaller than the diameter of the peripheral surface of the photosensitive drum DR but the diameter of the scale GP of the scale original SD is wound around the rotary drum DR (Substantially coincides with) the diameter of the outer circumferential surface of the substrate P, so-called measurement aberration can be further reduced.

As described above, in the sixth embodiment, since the original scale master SD can be mounted on the rotary drum DR, an appropriate scale master SD can be selected for the rotary drum DR. It is also possible to use a scale original SD having a mechanism (finishing screw or the like) which can finely adjust the roundness at a plurality of positions in the circumferential direction so that the eccentricity from the rotational center axis AX2 of the scale part GP It is possible to further reduce the measurement error (cumulative error) due to the pitch error of the error or scale (diffraction grating).

In the first to sixth embodiments, the pattern is formed on the substrate P by using the imaging apparatus 11 for scanning the spot light. However, the present invention is not limited to this structure, and the pattern may be formed on the substrate P And a projection exposure apparatus that forms a pattern on a substrate P by projecting and projecting a projected light flux from a mask onto a substrate P by using a planar or cylindrical mask of a transmissive or reflective type, Maybe it is. In addition, by using a digital micro-mirror device (DMD) in which a plurality of slantable micromirrors are arranged in a matrix instead of a mask, a maskless method of projecting a light distribution corresponding to a pattern to be imaged onto the substrate P Device. As an apparatus for forming a pattern on the substrate P, for example, an inkjet type drawing apparatus for forming a pattern on a substrate P using an inkjet head for ejecting droplets such as ink good. Also in the case of such a maskless exposure apparatus or an inkjet type drawing apparatus, for example, as disclosed in Japanese Patent Laid-Open Publication No. 2010-091990, a light distribution corresponding to a pattern made of a DMD is formed on a substrate P Or a plurality of droplet applying units (pattern forming units) having ink nozzles of an inkjet type are arranged on the substrate P, The whole of the plurality of exposure units or a plurality of the droplet applying units may be configured to be relatively rotatable with respect to the substrate P in the XY plane.

In the first to sixth embodiments, the second optical system 25 on which the plurality of imaging modules UW1 to UW5 constituting the imaging apparatus 11 are fixed is rotated by the rotating mechanism 24 in the XY plane However, in order to adjust each of the drawing lines LL1 to LL5 in parallel in the XY plane or to adjust the drawing lines LL1 to LL5 to have a predetermined gradient in the XY plane, each of the drawing modules UW1 to UW5 , And an actuator (drive mechanism) for individually rotating the optical axis 25 in the XY plane so as to be slightly rotatable may be provided on the second optical axis 25. In this case, an individual angle measuring sensor for measuring the rotational angle position (inclination amount or the like) of each of the imaging modules UW1 to UW5 (pattern forming portion) for the second optical disk 25 is provided, The amount of tilt in the XY plane of the second optical system 25 measured by the head EN1 or EN2 or the like and the amount of tilt of the imaging modules UW1 to UW5 measured by the individual angle measuring sensor The inclination of the drawing lines LL1 to LL5 on the respective substrates P can be adjusted based on both the inclination amounts of the drawing lines LL1 to LL5. Therefore, while the substrate P is being conveyed at a constant speed in the longitudinal direction (X direction) by rotating the rotary drum DR, the substrate P is conveyed in the yaw direction slightly shifted in the Y direction on the rotary drum DR The inclination can be sequentially measured by the position detection of the alignment marks Ks1 to Ks3 by the alignment microscope AM1 (or AM2) even when the conveying direction of the substrate P is slightly inclined in accordance with the development (Driving mechanisms) of the drawing modules UW1 to UW5 so that each of the drawing lines LL1 to LL5 is tilted in accordance with the inclination. Thereby, when a new pattern is overlaid on a base pattern (for example, a first layer pattern) for an electronic device already formed in the exposure area A7 on the substrate P, The overlapping accuracy can be favorably maintained on the entire surface of the exposure area A7 on the substrate P. [

In addition, in the first to sixth embodiments, the second optical base 25 for supporting the imaging apparatus 11 and the main frame 21 for supporting the rotary drum DR are arranged in the XY plane (or in the YZ plane (The rotating mechanism 24, the driving portion 110 of the three-point seat 22, the X moving mechanism 121, and the Z moving mechanism 122) including a motor and the like for performing relatively small rotation . However, the spatial arrangement relationship between the drawing apparatus 11 and the rotary drum DR is not limited to a manual operation by a motor, etc., but by a manual operation such as an adjustment screw, a micro gauge, Or may be a connecting mechanism for connecting the second optical surface plate 25 and the main body frame 21 so as to be relatively finely adjusted. The connecting mechanism having the adjusting section by the manual operation is provided with a second optical surface plate 25 (first optical surface plate 23) on which the imaging apparatus 11 is mounted, for example, The position of the three-point seat 22 in the X, Y, and Z directions can be finely adjusted, for example, when the three-point seat 22 is detached from the main body frame 21 and mounted again on the main frame 21 via the three- Do.

<Device Manufacturing Method>

Next, a device manufacturing method will be described with reference to Fig. 18 is a flowchart showing a device manufacturing method according to each embodiment.

In the device manufacturing method shown in Fig. 18, the function and performance of the display panel are first performed by self-luminous elements such as organic EL, for example, and necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). In addition, a supply roll on which a flexible substrate P (a resin film, a metal thin film, a plastic or the like) to be a base of the display panel is wound is prepared (step S202). The roll-shaped substrate P prepared in this step S202 can be obtained by modifying the surface of the substrate P if necessary, or by pre-forming a base layer (for example, fine irregularities by an imprint method) , A photosensitive film or a transparent film (insulating material) may be laminated in advance.

Next, a back plan layer composed of an electrode or wiring, an insulating film, a TFT (thin film semiconductor) or the like constituting the display panel device is formed on the substrate P, and an organic EL A light emitting layer (display pixel portion) formed by a self-luminous element is formed (step S203). In this step S203, a conventional photolithography process for exposing a photoresist layer using the exposure apparatus EX described in each of the above embodiments is also included. However, in place of the photoresist, a substrate P ), A wet process for forming a pattern (wiring, electrode, etc.) of a metal film by an electroless plating method by exposing a photosensitive catalyst layer to a pattern exposure, or a wet process for forming a silver nanoparticle And a printing process for drawing a pattern by a conductive ink containing a conductive ink or the like.

Next, for each display panel device that is continuously produced on the substrate P in a roll manner, the substrate P is diced or a protective film (an environmental barrier layer) is formed on the surface of each display panel device Color filter sheet, or the like are bonded to each other to assemble the device (step S204). Next, an inspection process is performed to determine whether the display panel device normally functions and satisfies the desired performance or characteristics (step S205). In this way, a display panel (flexible display) can be manufactured. In addition to manufacturing the display panel as shown in Fig. 18, it is also possible to use a flexible printed circuit board or a chemical sensor sheet having a sensing electrode pattern, such as a flexible printed circuit board or TFT, which requires a precise wiring pattern (high density wiring) (P), the exposure apparatus according to each of the above embodiments can be used.

1: Device manufacturing system 11: Drawing device
12: substrate transport mechanism 13: device frame
14: rotation position detecting mechanism 16: control device
21: Main frame 22: 3 point sheet
23: first optical surface plate 24: rotation mechanism
25: Second optical plate 31: Calibration detector
44, 45: XY hemispherical adjustment mechanism 51: 1/2 wave plate
52: polarizing mirror 53: beam diffuser
60: first beam splitter 62: second beam splitter
63: Third beam splitter 73: Fourth beam splitter
81: Optical deflector 82: 1/4 wavelength plate
83: Syringe 84: Bending mirror
85: f-theta lens system 86: Optical member for Y magnification correction
92: Shading plate 96: Reflecting mirror
97: rotating polygon mirror 98: origin detector
100: mounting member of the encoder heads (EN1, EN2)
101: mounting member of the encoder head (EN3, EN4)
105: Rotation amount measuring device 106: Driving part of rotation mechanism
110: driving part of three-point sheet 121: X moving mechanism
122: Z moving mechanism 123: bearing
130: drum support frame 131: drum rotation mechanism
132: drum supporting member
141: Mounting member of encoder heads (EN5, EN6)
P: substrate U1, U2: process device
EX: Exposure device AM1, AM2: Alignment microscope
EVC: Temperature chamber SU1, SU2: Dust prevention unit
E: Mounting surface EPC: Edge position controller
RT1, RT2: tension adjusting roller DR: rotary drum
AX2: rotation center line Sf2: shaft portion
p3: center plane DL: sagging
UW1 to UW5: drawing module CNT: light source device
LB: Drawing beam I:
LL1 to LL5: drawing line PBS: polarizing beam splitter
A7: exposure area SL: beam distribution optical system
Le1 to Le4: Installation diagonal line Vw1 to Vw6: Observation area
Ks1 to Ks3: Alignment mark GPa, GPb: Scale part
EN1 to EN6: Encoder head SD: Scale disc

Claims (15)

1. A substrate processing apparatus for feeding a long sheet substrate in a longitudinal direction and sequentially forming a predetermined pattern on the sheet substrate,
A cylindrical drum having a cylindrical outer circumferential surface having a predetermined radius from a center line extending in a direction intersecting the longitudinal direction and supporting the sheet substrate by a part of the outer circumferential surface,
A first support member for rotatably supporting the cylindrical drum about the center line,
A pattern forming device arranged on the outer circumferential surface of the cylindrical drum so as to face a portion for supporting the sheet substrate and forming the pattern on the sheet substrate;
A second supporting member for holding the pattern forming apparatus,
A connecting mechanism for adjustably connecting the relative arrangement of the cylindrical drum and the pattern forming apparatus,
A reference member which is rotated about the center line together with the cylindrical drum and is provided with an index for measuring a change in position of the cylindrical drum in the rotational direction or the centerline direction,
And a first detection device provided on the second support member side for detecting an index of the reference member and detecting a change in position in the rotational direction or the centerline direction of the cylindrical drum. The method according to claim 1,
Wherein the first detection device detects a position at which a pattern is formed on the sheet substrate by the pattern formation device as viewed from a direction in which the center line extends from a detection position of an index of the reference member by the first detection device, Is substantially aligned with the direction in which the first support member (30) is connected. The method according to claim 1 or 2,
And a second detection device provided on the first support member side for detecting an index of the reference member. The method of claim 3,
Further comprising a mark detection device provided on the first support member side and having a detection probe for detecting a mark formed on the sheet substrate,
The second detection device detects the position of detection of the index of the reference member by the second detection device in a direction connecting the detection position of the mark by the detection probe and the center line Is substantially aligned with the first supporting member. The method according to any one of claims 1 to 4,
Wherein the connection mechanism is provided between the first support member and the second support member and is disposed at a predetermined point in a plane intersecting the first support member and the second support member in the opposite directions, And the second support member is rotatably connected to the first support member. The method according to any one of claims 1 to 4,
Wherein the connection mechanism tiltably connects the rotation axis of the cylindrical drum so that the center line serving as the rotation axis of the cylindrical drum and the pattern forming apparatus are inclined relative to each other. The method according to any one of claims 1 to 6,
The first support member includes a main body frame disposed on an installation surface, a first support plate provided on the main body frame, and a support mechanism provided between the main body frame and the first support plate And,
And the second support member has a second platen disposed on the first platen. The method according to any one of claims 1 to 7,
Wherein the connection mechanism includes a driving unit that relatively displaces the first supporting member and the second supporting member,
Wherein the index of the reference member is a part of a scale of an encoder for rotation measurement which is provided on both sides in the direction of the center line of the cylindrical drum,
Wherein the first detecting device is a pair of reading (read) heads arranged to face each of the pair of scales. The method of claim 8,
Further comprising a control unit for controlling the driving unit,
Wherein the control device obtains shift information from a predetermined relative arrangement relationship between the cylindrical drum and the second support member based on the detection results of the pair of read heads, And controls the driving unit to maintain the relative arrangement relationship of the driving unit. A cylindrical drum supported on the first supporting member to support the sheet substrate at a cylindrical outer circumferential surface having a predetermined radius from a center line and rotated around the center line; 2. A method of adjusting a substrate processing apparatus having a pattern forming apparatus supported by a supporting member,
A pair of scales of a rotation measuring encoder provided on both sides in the direction of the center line of the cylindrical drum are read by a pair of reading heads disposed on the second supporting member side,
A deviation from a predetermined relative arrangement relationship between the cylindrical drum and the pattern forming apparatus is obtained from the detection results of the pair of reading heads,
And adjusting a connection mechanism for relatively displacing the first support member and the second support member such that the deviation obtained is reduced. A cylindrical drum supported by the first supporting member for supporting the sheet substrate by a cylindrical outer peripheral surface having a predetermined radius from the center line and rotating about the center line; A method of adjusting a substrate processing apparatus having a pattern forming apparatus supported by a second support member,
A pair of scales of a rotation measuring encoder provided on both sides in the direction of the center line of the cylindrical drum are read by a pair of reading heads disposed on the second supporting member side,
A deviation from a predetermined relative arrangement relationship between the cylindrical drum and the pattern forming apparatus is obtained from the detection results of the pair of reading heads,
And adjusting the spatial position of a region where the pattern forming apparatus forms a pattern on the sheet substrate relative to the cylindrical drum, in accordance with the obtained deviation. A device manufacturing system comprising the substrate processing apparatus according to any one of claims 1 to 9. The pattern forming apparatus according to any one of claims 1 to 9 is an exposure apparatus for irradiating the sheet substrate with light energy corresponding to a shape of a predetermined pattern,
The sheet substrate in which the photosensitive functional layer is formed on its surface is supported by a part of the outer circumferential surface of the cylindrical drum,
Irradiating light energy from the exposure apparatus toward a portion of the sheet substrate supported by the cylindrical drum,
And processing the irradiated sheet substrate to form a layer corresponding to a shape of a predetermined pattern on the sheet substrate. 1. A substrate processing apparatus for sequentially forming a predetermined pattern on a sheet substrate while feeding a long sheet substrate in a long direction,
A first supporting member having a cylindrical outer circumferential surface having a predetermined radius from a center line extending in a direction intersecting with the longitudinal direction and supporting the sheet substrate by a part of the outer circumferential surface while axially supporting a cylindrical drum rotatable about the center line, Wow,
A plurality of pattern forming portions arranged to face the portion of the outer circumferential surface of the cylindrical drum that supports the sheet substrate to form the pattern on the sheet substrate, A member,
A first rotation mechanism for adjusting a relative angle relationship between the first support member and the second support member so as to adjust a tilt of the pattern to be formed on the sheet substrate,
A reference member which is rotated about the center line together with the cylindrical drum and is provided with an index for measuring a change in position of the cylindrical drum in the rotational direction or the centerline direction,
And detecting an index of the reference member to detect a change in position in the rotational direction of the cylindrical drum and detecting a change in relative angle between the first and second support members, And a second detecting device for detecting the position of the substrate. 15. The method of claim 14,
Wherein the second support member includes a second rotation mechanism for rotating each of the plurality of pattern formation portions individually with respect to the second support member and a second detection device for measuring the rotation position of each of the plurality of pattern formation portions And the substrate processing apparatus.

Images