TWI689025B - Substrate processing device - Google Patents

Abstract

The exposure device EX is to form a predetermined pattern on the substrate P while transporting the long substrate P in the longitudinal direction. It includes: a cylindrical reel DR, which supports the substrate P; a body frame 21 as a first support member and The first optical table 23 is a shaft-supporting cylindrical reel DR; the drawing device 11 is arranged to face the rotating reel DR via the substrate P, forming a pattern on the substrate P; the second optical table 25 as a second support member, Holding the drawing device 11; the rotation mechanism 24, which rotatably connects the first optical table 23 and the second optical table 25; the scale parts GPa, GPb, for measuring the positional change of the cylindrical reel DR; and the encoder read head EN1 , EN2, detect the scale of GPa and GPb in the scale part.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus, an adjustment method of a substrate processing apparatus, a device manufacturing system, and a device manufacturing method.

Conventionally, as a substrate processing apparatus, there is known a pattern exposure apparatus of a proximity type, which includes an exposure roller that conveys a sheet-like workpiece (substrate), a photomask disposed above the exposure roller, and rotates the light from the exposure light source in multiple planes The mirror scans and irradiates the illumination part of the exposure mask (see, for example, Patent Document 1). This pattern exposure apparatus exposes the mask pattern of the photomask to the work by irradiating light from the illumination portion to the photomask while conveying the sheet-like work with the exposure drum. Although the pattern exposure device described in Patent Document 1 winds and transports a workpiece around an exposure drum, it may change the arrangement relationship between the photomask and the workpiece due to vibration and the like caused by the rotation of the exposure drum. In this case, the arrangement relationship between the workpiece wound on the exposure drum and the mask will be displaced from the predetermined arrangement relationship suitable for exposure, so it is difficult to accurately expose the mask pattern of the mask to the workpiece.

Patent Literature 1: Japanese Patent Laid-Open No. 2007-72171

According to the first aspect of the present invention, there is provided a substrate processing apparatus which is a long strip The sheet-like substrate is transported in the long-side direction, and a predetermined pattern is sequentially formed on the sheet-like substrate, which includes: a cylindrical reel having a certain radius from a center line extending in a direction crossing the aforementioned long-side direction A cylindrical outer peripheral surface that supports the sheet substrate with a portion of the outer peripheral surface; a first support member that supports the cylindrical spool shaft so as to be rotatable about the center line; a patterning device that is connected to the cylindrical spool The portion of the outer peripheral surface that supports the sheet-like substrate is arranged oppositely, and the pattern is formed on the sheet-like substrate; the second support member holds the pattern-forming device; a coupling mechanism that connects the cylindrical reel and the pattern-forming device The relative arrangement relationship is connected so as to be adjustable; the reference member, which rotates around the centerline together with the cylindrical reel, is provided with an indicator for measuring the positional change of the rotational direction of the cylindrical reel or the centerline direction; and the first The detection device is provided on the second support member and detects the index of the reference member to detect the positional change in the rotation direction of the cylindrical reel or the centerline direction.

According to a second aspect of the present invention, there is provided an adjustment method of a substrate processing apparatus having a cylindrical outer peripheral surface having a certain radius from a center line and supporting a sheet substrate by a first support member so as to wrap around the center A cylindrical reel that rotates linearly, and a pattern forming device that supports the second support member to form a predetermined pattern on the sheet substrate supported by the cylindrical reel, the adjustment method includes: by disposing the second support The pair of reading heads on the component side reads the actions of each pair of scale parts of the rotary measuring encoders provided on both sides of the centerline direction of the cylindrical reel; the detection results from the pair of reading heads Determining the deviation between the cylindrical reel and the pattern forming device from a predetermined relative arrangement relationship; and adjusting the connection between the first support member and the second support member so as to reduce the deviation found The action of the link mechanism capable of relative displacement.

According to the third aspect of the present invention, an adjustment method for a substrate processing apparatus is provided The substrate processing apparatus includes a cylindrical reel that supports a sheet substrate on a cylindrical outer peripheral surface having a certain radius from the center line and is supported by the first support member to rotate about the center line, and supported by the second support member A pattern forming device for forming a predetermined pattern on the sheet substrate supported by the cylindrical reel, the adjustment method includes: reading the set on the cylinder by a pair of reading heads arranged on the second support member side The movement of one of the encoders for rotation measurement on both sides of the centerline direction of the reel to each of the scale parts; from the detection results of the pair of reading heads, the relationship between the cylindrical reel and the patterning device is obtained The action of predetermining the deviation from the relative arrangement relationship; and the action of adjusting the spatial position of the pattern forming device in the area where the pattern is formed on the sheet substrate with respect to the cylindrical reel, reflecting the deviation obtained above.

According to the fourth aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus of the first aspect of the present invention.

According to a fifth aspect of the present invention, there is provided a device manufacturing method, wherein the pattern forming device of the first aspect of the present invention is an exposure device that irradiates the sheet-like substrate with light energy corresponding to the shape of a predetermined pattern; and includes: The action of transporting the sheet-shaped substrate with the photosensitive functional layer formed on the surface in the longitudinal direction while being supported by a part of the cylindrical reel; towards the sheet-shaped substrate supported by the cylindrical reel The operation of partially irradiating the light energy from the exposure device; and the operation of forming a layer corresponding to the shape of a predetermined pattern on the sheet substrate by processing the irradiated sheet substrate.

According to the sixth aspect of the present invention, there is provided a substrate processing apparatus which, while transporting a long sheet substrate in the longitudinal direction, forms a predetermined pattern on the sheet substrate in sequence, and includes: a first support member, which is The shaft-supported cylindrical reel has a cylindrical outer peripheral surface of a certain radius from the center line extending in the direction crossing the longitudinal direction, which can be Rotating around the center line while supporting the sheet substrate with a portion of the outer peripheral surface; the second support member holds a plurality of pattern forming portions aligned in the width direction of the sheet substrate, the pattern forming portion is for the purpose of The pattern is formed on the sheet substrate and is opposed to the portion of the outer surface of the cylindrical reel that supports the sheet substrate; the first rotating mechanism is to adjust the inclination of the pattern to be formed on the sheet substrate The relative angular relationship between the first support member and the second support member can be adjusted; the reference member rotates with the cylindrical reel around the center line, and is provided to measure the rotation direction of the cylindrical reel or the center line An index of position change in the direction; and a first detection device, which is provided on the side of the second support member, detects the index of the reference member to detect a position change in the rotation direction of the cylindrical reel, and detects the first support member and The relative angle of the aforementioned second support member changes.

1‧‧‧Component manufacturing system

11‧‧‧Drawing device

12‧‧‧Substrate transfer mechanism

13‧‧‧ Installation frame

14‧‧‧ Rotation position detection mechanism

16‧‧‧Control device

21‧‧‧Body frame

22‧‧‧Three o'clock

23‧‧‧First optical platform

24‧‧‧rotating mechanism

25‧‧‧ 2nd optical platform

31‧‧‧ Calibration and Inspection Department

44、45‧‧‧‧Bipartite adjustment mechanism

51‧‧‧1/2 wave plate

52‧‧‧ Polarizer

53‧‧‧ Diffuser

60‧‧‧First beam splitter

62‧‧‧Second beam splitter

63‧‧‧3rd beam splitter

73‧‧‧ 4th beam splitter

81‧‧‧Optical deflector

82‧‧‧1/4 wavelength plate

83‧‧‧ Scanner

84‧‧‧Bending mirror

85‧‧‧f-θ lens system

86‧‧‧Y magnification correction optical component

92‧‧‧ Shading board

96‧‧‧Reflecting mirror

97‧‧‧rotating polygon mirror

98‧‧‧Origin detector

100‧‧‧Encoder reading head EN1, EN2 installation components

101‧‧‧Encoder reading head EN3, EN4 mounting components

105‧‧‧rotation amount measuring device

106‧‧‧Drive unit of rotating mechanism

110‧‧‧Three-point drive unit

121‧‧‧X mobile mechanism

122‧‧‧Z mobile mechanism

123‧‧‧bearing

130‧‧‧Reel support frame

131‧‧‧ reel rotating mechanism

132‧‧‧Reel support member

141‧‧‧Encoder reading head EN5, EN6 mounting components

P‧‧‧Substrate

U1, U2‧‧‧ processing device

EX‧‧‧Exposure device

AM1, AM2‧‧‧ alignment microscope

EVC‧‧‧adjust greenhouse

SU1,SU2‧‧‧‧Anti-vibration unit

E‧‧‧Setting surface

EPC‧‧‧Edge position controller

RT1, RT2 ‧‧‧ tension adjustment roller

DR‧‧‧Rotating reel

AX2‧‧‧Rotation centerline

Sf2‧‧‧Shaft

p3‧‧‧Center

DL‧‧‧slack

UW1~UW5‧‧‧Drawing module

CNT‧‧‧Light source device

LB‧‧‧Draw beam

I‧‧‧rotation axis

LL1~LL5‧‧‧Drawing line

PBS‧‧‧polarizing beam splitter

A7‧‧‧Exposure field

SL‧‧‧Beam Distribution Optical System

Le1~Le4‧‧‧Set bearing line

Vw1~Vw6 ‧‧‧ observation area

Ks1~Ks3‧‧‧Alignment mark

GPa, GPb‧‧‧ Ruler Department

EN1~EN6‧‧‧Encoder read head

SD‧‧‧Scale disc

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1.

FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate.

FIG. 4 is a diagram showing the structure of a rotating reel and a drawing device of the exposure device of FIG. 1.

FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1.

6 is a perspective view showing the configuration of the divergent optical system of the exposure apparatus of FIG. 1.

7 is a diagram showing the arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. 1.

FIG. 8 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the drawing line and the encoder read head.

9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG. 1.

10 is a plan view showing the configuration of the encoder read head of the exposure apparatus of FIG.

11 is a plan view showing the arrangement relationship between the rotating reel and the drawing device of the exposure device of FIG. 1.

FIG. 12 is a flow chart related to the exposure device adjustment method of the first embodiment.

13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment.

14 is a perspective view showing the arrangement of main parts of an exposure apparatus according to a third embodiment.

Fig. 15 is a diagram showing the configuration of a spinning reel and a drawing device according to the fourth embodiment.

16 is a plan view showing the arrangement of the encoder read head of the exposure apparatus of the fifth embodiment.

Fig. 17 is a plan view showing the arrangement of the scale disc of the exposure apparatus of the sixth embodiment.

FIG. 18 is a flowchart showing the device manufacturing method of the first to fifth embodiments.

The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. Of course, the present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include those that are easily conceivable by those with ordinary knowledge in the technical field to which the invention belongs and those that are substantially the same. In addition, the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

[First Embodiment]

FIG. 1 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs exposure processing on a substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various processes on a substrate P after exposure to manufacture devices. First, the component manufacturing system 1 will be described.

<Component Manufacturing System>

The component manufacturing system 1 is a production line for manufacturing flexible displays as components (flexible display manufacturing lines). Flexible displays, such as organic EL displays. This component manufacturing system 1 sends out the substrate P from a supply roll (not shown) that rolls a flexible substrate P into a cylindrical shape, after continuously applying various treatments to the sent substrate P, The processed substrate P is wound as a flexible element in a so-called roll-to-roll method in which a recycling reel (not shown) is wound. In the component manufacturing system 1 of the first embodiment, the film-shaped sheet substrate P is sent out from the supply roll, and the substrate P sent out from the supply roll is sequentially passed through the processing device U1, the exposure device EX, and the processing device U2 Afterwards, it is wound on a reel for recycling. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of a metal or alloy such as a resin film or stainless steel. The material of the resin film may include, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate One or more of ester resin, polystyrene resin, polyvinyl alcohol resin and other materials.

For the substrate P, for example, it is preferable to select, for example, a coefficient of thermal expansion that is not significantly large, and the amount of deformation caused by heat in various treatments performed on the substrate P can be substantially ignored. The thermal expansion coefficient can be set to be lower than the threshold value corresponding to the processing temperature by, for example, mixing an inorganic filler in the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. In addition, the substrate P may be a single layer body of extremely thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminate in which the above-mentioned resin film, foil, or the like is bonded to the extremely thin glass.

The substrate P constructed in this way is wound into a roll shape and becomes a supply roll The supply reel is mounted on the component manufacturing system 1. The component manufacturing system 1 equipped with a supply reel repeatedly executes various processes for manufacturing components on the substrate P sent out from the supply reel in the longitudinal direction. Therefore, the processed substrate P is in a state where a plurality of elements are connected. In other words, the substrate P sent from the supply reel is a substrate for multiple surfaces. In addition, the substrate P may be modified in advance by a predetermined pretreatment to activate its surface, or a fine partition wall structure (concave-convex structure) for precise patterning may be formed on the surface.

The processed substrate P is wound into a roll and collected as a roll for collection. The reel for recovery is installed on a cutting device (not shown). A cutting device equipped with a reel for recycling divides (cuts) the processed substrate P into individual components, thereby forming a plurality of components. The size of the substrate P is, for example, the size in the width direction (the direction of the short side) is about 10 cm to 2 m, and the size in the length direction (the direction of the long direction) is 10 m or more. In addition, the size of the substrate P is not limited to the above-mentioned size.

Next, the component manufacturing system 1 will be described with reference to FIG. 1. The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. In addition, FIG. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is the direction from the processing device U1 through the exposure device EX toward the processing device U2 in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction orthogonal to the X direction and the Y direction (vertical direction).

The processing device U1 performs a pre-process (pre-processing) process on the substrate P that is exposed by the exposure device EX. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure device EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

Here, the photosensitive functional layer is applied on the substrate P as a solution, and dried to form a layer (film). A typical photosensitive functional layer has a photoresist, but as a material that is not required after the development process, there is a liquid-modified photosensitive silane coupling agent material (SAM) in the portion exposed to ultraviolet rays, or exposed to ultraviolet rays The exposed part of the part is exposed to the photosensitive material of the base. When a photosensitive silane coupling agent material is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is changed from liquid-repellent to lyophilic, so conductive ink is selectively coated on the portion that becomes lyophilic (Ink containing conductive nano particles such as silver or copper) to form a pattern layer. When a photosensitive reduction material is used as the photosensitive functional layer, the pattern reduction portion exposed on the substrate P by the ultraviolet light exposes the plating reduction element. Therefore, immediately after exposure, the substrate P is immersed in an electroless plating solution containing palladium ions or the like A certain period of time to form (precipitate) a palladium pattern layer.

The exposure device EX draws a pattern such as a circuit or wiring for a display on the substrate P supplied from the processing device U1. The details will be described later. This exposure device EX exposes the substrate P by scanning a plurality of drawing lines LL1 to LL5 obtained by scanning each drawing beam LB in a predetermined scanning direction.

The processing device U2 performs post-process processing (post-processing) on the substrate P after exposure processing by the exposure device EX. The substrate P after the exposure processing by the exposure device EX is sent to the processing device U2. The processing device U2 performs a predetermined process on the substrate P that has undergone the exposure process to form a pattern layer of electronic components on the substrate P.

<Exposure device (substrate processing device)>

Next, the exposure device EX will be described with reference to FIGS. 1 to 9. FIG. 2 is a perspective view showing the arrangement of main parts of the exposure apparatus of FIG. 1. FIG. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 shows the structure of the rotating reel and the drawing device of the exposure device of FIG. 1 Figure. FIG. 5 is a plan view showing the arrangement of main parts of the exposure apparatus of FIG. 1. 6 is a perspective view showing the configuration of the divergent optical system of the exposure apparatus of FIG. 1. 7 is a diagram showing the arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. 1. FIG. 8 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the drawing line and the encoder read head. 9 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG. 1.

As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called maskless type exposure apparatus, and scans the drawing beam LB in a predetermined scanning direction by transporting the substrate P in the transport direction To draw the surface of the substrate P to form a predetermined pattern on the substrate P.

As shown in FIG. 1, the exposure device EX includes a drawing device 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control device 16. The drawing device 11 has a plurality of drawing modules UW1 to UW5, and draws a predetermined pattern on a part of the substrate P conveyed by the substrate conveying mechanism 12 by the plurality of drawing modules UW1 to UW5. The substrate transfer mechanism 12 transfers the substrate P transferred from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are used to perform alignment of the relative positions of the pattern to be drawn on the substrate P and the substrate P, and detect alignment marks and the like formed on the substrate P in advance. The control device 16 controls each part of the exposure device EX so that each part performs processing. The control device 16 may be a part or all of the upper control device of the control element manufacturing system 1. In addition, the control device 16 may be a device controlled by a higher-level control device than the higher-level control device. The control device 16 includes, for example, a computer.

In addition, the exposure apparatus EX includes a device frame 13 (refer to FIG. 2) that supports the drawing device 11 and the substrate transport mechanism 12, and a rotation position detection mechanism (refer to FIGS. 4 and 8) 14. Furthermore, A light source device CNT that emits laser light (pulse light) as a drawing light beam LB is provided in the exposure device EX. This exposure device EX guides the drawing light beam LB emitted from the light source device CNT in the drawing device 11 and projects it on the substrate P transferred by the substrate transfer mechanism 12.

As shown in FIG. 1, the exposure device EX is housed in the greenhouse EVC. Adjust the greenhouse EVC through the passive or active anti-vibration units SU1, SU2 installed on the installation surface E of the manufacturing plant. Anti-vibration units SU1 and SU2 are provided on the installation surface E to reduce the vibration from the installation surface E. The greenhouse EVC is adjusted to keep the inside at a predetermined temperature, thereby suppressing the shape change of the substrate P transported inside due to temperature.

Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described with reference to FIG. 1. The substrate conveying mechanism 12 includes an edge position controller EPC, a driving roller DR4, a tension adjusting roller RT1, a rotary reel (cylindrical reel) DR, a tension adjusting roller RT2, and a driving roller in order from the upstream side of the conveying direction of the substrate P DR6, and drive roller DR7.

The edge position controller EPC adjusts the position of the substrate P transferred from the processing device U1 in the width direction. The edge position controller EPC can position the substrate P within the width of the end position (edge) of the substrate P sent from the processing device U1 in the range of ± tens μm to tens μm relative to the target position Move in the direction to correct the position of the substrate P in the width direction.

The driving drum DR4 rotates while sandwiching the front and back sides of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P to the downstream side in the conveying direction to convey the substrate P to the rotating drum DR. The rotating reel DR rotates around the rotation center line X2 about the rotation center line AX2 extending in the Y direction while supporting the portion of the substrate P where the pattern to be exposed is cylindrical, and transports the substrate P. In order to rotate the rotating drum DR around the rotation center line AX2, shafts coaxial with the rotation center line AX2 are provided on both sides of the rotating drum DR 部Sf2. This shaft portion Sf2 is given a rotational torque from a drive source (motor, reduction gear mechanism, etc.) not shown. In addition, the surface that extends through the rotation center line AX2 and extends in the Z direction is the central surface p3. The two sets of tension-adjusting rollers RT1 and RT2 apply predetermined tension to the substrate P that is wound and supported on the rotating reel DR. The two sets of driving rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P, and a predetermined slack DL is given to the substrate P after exposure. The substrate P is transferred to the processing device U2 by rotating the upstream side of the substrate P pinched by the driving roller DR6 and rotating the downstream side of the substrate P pinched by the driving roller DR7. At this time, since the substrate P is given a slack DL, it can absorb the change in the transfer speed of the substrate P that is generated downstream of the driving roller DR6 in the transfer direction, and isolates the influence of the exposure process caused by the change in the transfer speed on the substrate P.

Therefore, the substrate transfer mechanism 12 can adjust the position of the substrate P transferred from the processing device U1 in the width direction by the edge position controller EPC. The substrate conveying mechanism 12 conveys the substrate P whose position in the width direction is adjusted to the tension adjusting roller RT1 by driving the roller DR4, and conveys the substrate P passing through the tension adjusting roller RT1 to the rotating drum DR. The substrate transfer mechanism 12 transfers the substrate P supported by the rotary reel DR to the tension adjusting roller RT2 by rotating the rotary reel DR. The substrate conveying mechanism 12 conveys the substrate P conveyed to the tension adjusting roller RT2 to the driving roller DR6, and conveys the substrate P conveyed to the driving roller DR6 to the driving roller DR7. Next, the substrate transport mechanism 12 transports the substrate P to the processing device U2 while applying the slack DL to the substrate P by driving the roller DR6 and the driving roller DR7.

2, the device frame 13 of the exposure device EX will be described. In FIG. 2, the X direction, the Y direction and the Z direction are orthogonal orthogonal coordinate systems, which are the same orthogonal coordinate systems as FIG. 1. The exposure device EX includes a drawing device 11 shown in FIG. 1 and a device frame 13 that supports the rotating drum DR of the substrate transport mechanism 12.

The device frame 13 shown in FIG. 2 has a body frame 21, a three-point seat (support mechanism) 22, a first optical table 23, a rotation mechanism 24, and a second optical table 25 in this order from the lower side in the Z direction. The body frame 21 is installed on the installation surface E through the vibration-proof units SU1 and SU2. The main body frame 21 rotatably supports the rotating drum DR and the tension adjusting rollers RT1 (not shown) and RT2. The first optical table 23 is provided on the vertically upper side of the rotating drum DR, and is provided on the main body frame 21 through the three-point seat 22. The three-point mount 22 supports the first optical table 23 with three support points 22a, and the position in the Z direction of each support point 22a can be adjusted. Therefore, the three-point mount 22 can adjust the tilt of the platform surface of the first optical platform 23 relative to the horizontal plane to a predetermined tilt. In addition, when the device frame 13 is assembled, the position between the main body frame 21 and the three-point seat 22 can be adjusted in the X direction and the Y direction within the XY plane. On the other hand, after the device frame 13 is assembled, the body frame 21 and the three-point seat 22 are in a fixed state (rigid state). As described above, the body frame 21 and the first optical table 23 connected by the three-point seat 22 function as the first support member.

The second optical table 25 is provided on the vertically upward side of the first optical table 23, and is provided on the first optical table 23 through the rotation mechanism 24. The second optical platform 25 has a platform surface parallel to the platform surface of the first optical platform 23. The second optical platform 25 is provided with a plurality of drawing modules UW1 to UW5 of the drawing device 11. The rotation mechanism 24 can make the first optical table 23 and the second optical table 25 substantially parallel to each other, with the predetermined rotation axis I extending in the vertical direction as the center, relative to the first optical table 23 The second optical table 25 rotates. This rotation axis I extends in the vertical direction in the center plane p3 and passes through a predetermined point (refer to FIG. 3) wound on the surface of the substrate P (drawing surface curved along the circumferential surface) of the rotating reel DR. The rotating mechanism 24 can adjust the position of the plurality of drawing modules UW1 to UW5 relative to the substrate P wound on the rotating reel DR by rotating the second optical table 25 relative to the first optical table 23.

Next, the light source device CNT will be described with reference to FIGS. 1 and 5. The light source device CNT is provided on the body frame 21 of the device frame 13. The light source device CNT emits laser light as a drawing light beam LB projected on the substrate p. The light source device CNT has a light source that emits light of a predetermined wavelength band suitable for exposure of the photosensitive functional layer on the substrate P and is set to light in the ultraviolet region with strong photoactivity. As a light source, for example, a laser light source that emits YAG's third harmonic laser light (wavelength 355 nm) or by amplifying the seed light from the infrared wavelength region of the semiconductor laser light source with an optical fiber amplifier and converting by wavelength Optical fiber amplifying laser light source that emits laser light in the ultraviolet wavelength region with a wavelength of less than 400nm from components (crystal components that generate harmonics, etc.). In this case, the emitted ultraviolet laser light may be continuously oscillated, or may be a pulsed laser light with a luminescence time of each pulse of tens of psi or less and oscillating at a frequency of 100 MHz or more. In addition, as a light source, for example, a lamp light source such as a mercury lamp with a glow line (g-line, h-line, i-line, etc.) in the ultraviolet region, and a laser diode with an oscillation peak in the ultraviolet region below 450 nm can also be used , Solid-state light sources such as light-emitting diodes (LEDs), or KrF excimer laser light (wavelength 248nm), ArF excimer laser light (wavelength 193nm), XeCl excimer laser light (DUV light) Wavelength 308nm) etc. gas laser light source.

Here, the drawing light beam LB emitted from the light source device CNT enters the polarization beam splitter PBS described later. In order to suppress the energy loss due to the separation of the drawing beam LB by the polarizing beam splitter PBS, the drawing beam LB is preferably a light beam that is incident almost completely reflected by the polarizing beam splitter PBS. The polarizing beam splitter PBS reflects linearly polarized light beams that become S polarized light, and transmits linearly polarized light beams that become P polarized light. Therefore, the light source device CNT, preferably, the drawing beam LB incident on the polarizing beam splitter PBS becomes laser light of a linearly polarized (S-polarized) beam. In addition, since the laser light has a high energy density, it is possible to appropriately ensure the projection of the light onto the substrate P Illumination of the light beam.

Next, the drawing device 11 of the exposure device EX will be described. The drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing modules UW1 to UW5. This drawing device 11 divides the drawing light beam LB emitted from the light source device CNT into a plurality of plural lines, and draws the divided plural drawing light beams LB along a plurality of lines (for example, 5 lines in the first embodiment) on the substrate P LL1~LL5 are scanned separately. Next, the drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a description will be given of a plurality of drawing lines LL1 to LL5 formed on the substrate P by the scanning device 11 scanning a plurality of drawing beams LB.

As shown in FIG. 3, a plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotating reel DR with the center plane p3 in between. On the substrate P on the upstream side in the rotation direction, odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged. On the substrate P on the downstream side in the rotation direction, even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged.

The drawing lines LL1 to LL5 are formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating drum DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is relative rotation of the reel in such a way that when the substrate P is transferred by the substrate transport mechanism 12 at the reference speed, the joint error of the patterns obtained by the plurality of drawing lines LL1 to LL5 is minimized The rotation center line AX2 of DR is inclined by a predetermined angle.

The odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged at predetermined intervals in the direction (axis direction) in which the rotation center line AX2 of the rotating drum DR extends. In addition, even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged at predetermined intervals in the axial direction of the rotating drum DR. At this time, the second drawing line LL2 is arranged at the first in the axial direction Between the drawing line LL1 and the third drawing line LL3. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. In addition, the first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width in the width direction (axial direction) of the exposure area A7 drawn on the substrate P.

The scanning direction of the drawing beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction and the same direction. In addition, the scanning direction of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction and the same direction. At this time, the scanning direction of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 are opposite directions. Therefore, in view of the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL1, LL3, and LL5 are adjacent to the drawing end positions of the even-numbered drawing lines LL2, LL4. Similarly, the odd-numbered drawing lines LL1 The drawing end positions of LL3 and LL5 are adjacent to the drawing start positions of even-numbered drawing lines LL2 and LL4.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 includes the above-mentioned plural drawing modules UW1 to UW5, diverts the drawing beam LB from the light source device CNT to the beam distributing optical system SL of the plural drawing modules UW1 to UW5, and calibration for calibration Detection Department 31.

The beam distributing optical system SL diverges the drawing light beam LB emitted from the light source device CNT into a plurality of plural pieces, and directs the divided plural drawing light beams LB to the plural drawing modules UW1 to UW5, respectively. The beam distributing optical system SL includes a first optical system 41 that divides the drawing light beam LB emitted from the light source device CNT into two, and a light beam LB that is divided by one of the first optical system 41 The irradiated second optical system 42 and the third optical system 43 irradiated with another drawing light beam LB diverging from the first optical system 41. The beam distribution optical system SL includes an XY halving adjustment mechanism 44 and an XY halving adjustment mechanism 45. In the beam distribution optical system SL, a part of the light source device CNT side is disposed on the body frame 21, and on the other hand, another part of the drawing module UW1~UW5 side is disposed on the second optical platform 25.

The first optical system 41 has a 1/2 wavelength plate 51, a polarizer 52, a beam diffuser 53, a first reflector 54, a first relay lens 55, a second relay lens 56, and a second reflector 57. Third mirror 58, fourth mirror 59, and first beam splitter 60.

The drawing light beam LB emitted from the light source device CNT in the +X direction is irradiated on the half-wavelength plate 51. The half-wavelength plate 51 is rotatable in the irradiation surface of the drawing light beam LB. The drawing light beam LB irradiated to the half-wave plate 51 has a polarization direction corresponding to a predetermined polarization direction corresponding to the rotation amount of the half-wave plate 51. The drawing beam LB passing through the half-wavelength plate 51 is irradiated to the polarizer (polarization beam splitter) 52. The polarizer 52 transmits the drawing light beam LB in a predetermined polarization direction, and on the other hand, reflects the drawing light beam LB outside the predetermined polarization direction in the +Y direction. Therefore, the drawing light beam LB reflected by the polarizer 52 passes through the half-wave plate 51, and therefore can be rotated by the half-wave plate 51 and the polarizer 52 in cooperation with the half-wave plate 51 The beam intensity corresponding to the amount. In other words, the 1/2 wavelength plate 51 is rotated to change the polarization direction of the drawing light beam LB, whereby the beam intensity of the drawing light beam LB reflected by the polarizer 52 can be adjusted.

The drawing beam LB passing through the polarizer 52 is irradiated to the diffuser 53. The diffuser 53 absorbs the drawing beam LB and suppresses the leakage of the drawing beam LB irradiated to the diffuser 53 to the outside. The drawing light beam LB reflected in the +Y direction by the polarizer 52 is irradiated to the first mirror 54. The drawing beam LB irradiated on the first mirror 54 is reflected by the first mirror 54 in the +X direction, and passes through the first The relay lens 55 and the second relay lens 56 irradiate the second mirror 57. The drawing light beam LB irradiated on the second reflecting mirror 57 is reflected by the second reflecting mirror 57 in the −Y direction and irradiated on the third reflecting mirror 58. The drawing light beam LB irradiated on the third mirror 58 is reflected by the third mirror 58 in the −Z direction and irradiated on the fourth mirror 59. The drawing beam LB irradiated on the fourth reflecting mirror 59 is reflected by the fourth reflecting mirror 59 in the +Y direction and irradiated on the first beam splitter 60. A portion of the drawing beam LB irradiated on the first beam splitter 60 is reflected in the -X direction and irradiated on the second optical system 42, and the other portion is transmitted and irradiated on the third optical system 43.

The third mirror 58 and the fourth mirror 59 are provided at a predetermined interval on the rotation axis I of the rotation mechanism 24. In addition, the structure up to the light source device CNT including the third mirror 58 (the portion surrounded by the two-dot chain line on the upper side in the Z direction in FIG. 4) is provided on the side of the body frame 21 to include the fourth mirror 59 The structure of the plurality of drawing modules UW1 to UW5 (the part surrounded by the two-dot chain line on the lower side in the Z direction in FIG. 4) is provided on the second optical table 25 side. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the rotation mechanism 24, since the third mirror 58 and the fourth mirror 59 are provided on the rotation axis I, the optical path of the drawing light beam LB is not changed . Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the rotation mechanism 24, the drawing beam LB emitted from the light source device CNT provided on the side of the body frame 21 can be guided to the second A plurality of drawing modules UW1~UW5 on the optical platform 25 side.

The second optical system 42 directs the drawing beam LB, which is a branch of the first optical system 41, to the odd-numbered drawing modules UW1, UW3, and UW5 described later. The second optical system 42 includes a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth mirror 64.

The first beam splitter 60 in the first optical system 41 is reflected in the direction of -X The light beam LB is irradiated on the fifth mirror 61. The drawing light beam LB irradiated on the fifth mirror 61 is reflected by the fifth mirror 61 in the −Y direction, and is irradiated on the second beam splitter 62. A part of the drawing beam LB irradiated on the second beam splitter 62 is reflected and irradiated on one drawing module UW5 of odd number (see FIG. 5 ). The drawing beam LB irradiated to the second beam splitter 62 penetrates the other part and is irradiated to the third beam splitter 63. A part of the drawing beam LB irradiated to the third beam splitter 63 is reflected and irradiated to one drawing module UW3 of odd number (see FIG. 5 ). The drawing beam LB irradiated on the third beam splitter 63 penetrates the other part and is irradiated on the sixth mirror 64. The drawing light beam LB irradiated to the sixth mirror 64 is reflected by the sixth mirror 64 and irradiated to one odd-numbered drawing module UW1 (see FIG. 5 ). In addition, in the second optical system 42, the drawing beam LB irradiated to the odd-number drawing modules UW1, UW3, and UW5 is slightly inclined with respect to the -Z direction (Z axis).

The third optical system 43 diverts the drawing beam LB of the other side diverging from the first optical system 41 to the even-numbered drawing modules UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing beam LB penetrating in the Y direction by the first beam splitter 60 of the first optical system 41 is irradiated to the seventh mirror 71. The drawing light beam LB irradiated on the seventh mirror 71 is reflected by the seventh mirror 71 in the X direction, and is irradiated on the eighth mirror 72. The drawing light beam LB irradiated on the eighth mirror 72 is reflected by the eighth mirror 72 in the −Y direction, and irradiated on the fourth beam splitter 73. A part of the drawing beam LB irradiated to the fourth beam splitter 73 is reflected and irradiated to one drawing module UW4 of an even number (see FIG. 5 ). The drawing beam LB irradiated on the fourth beam splitter 73 penetrates the other part and irradiates the ninth mirror 74. The drawing light beam LB irradiated on the ninth mirror 74 is reflected by the ninth mirror 74 and irradiated on one drawing module UW2 of even number. In addition, in the third optical system 43, the drawing light beam LB irradiated to the even-numbered drawing modules UW2 and UW4 is also relatively -Z direction (Z axis) is slightly inclined.

As described above, in the beam distributing optical system SL, toward the plurality of drawing modules UW1 to UW5, the drawing light beam LB from the light source device CNT is divided into a plurality of pieces. At this time, the reflectance (transmittance) of the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 is adjusted appropriately according to the divergence of the drawing beam LB The reflectivity of the light beam is such that the beam intensity of the drawing beam LB irradiated to the drawing modules UW1 to UW5 is the same intensity.

The XY bisection adjustment mechanism 44 is arranged between the second relay lens 56 and the second mirror 57. The XY bisection adjustment mechanism 44 can adjust all the drawing lines LL1 to LL5 formed on the substrate P to move slightly within the drawing plane of the substrate P. The XY bisection adjustment mechanism 44 is composed of a transparent parallel flat glass that can be tilted in the XZ plane of FIG. 6 and a transparent parallel flat glass that can be tilted in the YZ plane of FIG. 6. By adjusting the inclination of the two parallel flat glasses, the drawing lines LL1 to LL5 formed on the substrate P can be slightly displaced in the X direction or the Z direction.

The XY bisection adjustment mechanism 45 is arranged between the seventh mirror 71 and the eighth mirror 72. The XY bisector adjustment mechanism 45 can adjust the second drawing line LL2 and the fourth drawing line LL4 of even numbers among the drawing lines LL1 to LL5 formed on the substrate P to move slightly in the drawing plane of the substrate P. The XY bisection adjustment mechanism 45 is similar to the XY bisection adjustment mechanism 44 and is composed of transparent parallel flat glass that can be tilted in the XZ plane of FIG. 6 and transparent parallel flat glass that can be tilted in the YZ plane of FIG. 6. . By adjusting the inclination of the two parallel flat glasses, the drawing lines LL2 and LL4 formed on the substrate P can be slightly displaced in the X direction or the Z direction.

Next, referring to FIGS. 4, 5 and 7, a plurality of drawing modules UW1 to UW5 will be described. Plural drawing modules UW1~UW5 are set corresponding to plural drawing lines LL1~LL5. The plural drawing beams LB diverged by the beam distributing optical system SL are respectively irradiated to the plural drawing beams Paint module UW1~UW5. Each drawing module UW1~UW5 causes a plurality of drawing beams LB to be directed to each drawing line LL1~LL5, respectively. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 guide the drawing beam LB to the second to fifth drawing line LL2 ~LL5. As shown in FIG. 4 (and FIG. 1), a plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating drum DR with the center plane p3 in between. A plurality of drawing modules UW1 to UW5 are arranged on the side sandwiching the center plane p3 between the first, third, and fifth drawing lines LL1, LL3, and LL5 (the side in the -X direction in FIG. 5), and the first drawing module UW1 is arranged , The third drawing module UW3 and the fifth drawing module UW5. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at a predetermined interval in the Y direction. In addition, a plurality of drawing modules UW1 to UW5 are arranged on the side sandwiching the center plane p3 between the second and fourth drawing lines LL2 and LL4 (the side in the +X direction in FIG. 5), and the second drawing modules UW2 and the fourth Describe the module UW4. The second drawing module UW2 and the fourth drawing module UW4 are arranged at a predetermined interval in the Y direction. At this time, the second drawing module UW2 is arranged between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is arranged between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is arranged between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. Furthermore, as shown in FIG. 4, the first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 and the second drawing module UW2 and the fourth drawing module UW4, viewed from the Y direction, are The center plane p3 is symmetrically arranged in the center.

Next, each drawing module UW1 to UW5 will be described with reference to FIG. 4. In addition, since the drawing modules UW1 to UW5 have the same structure, the first drawing module UW1 (hereinafter, simply referred to as the drawing module UW1) will be described as an example.

The drawing module UW1 shown in FIG. 4 is along the drawing line LL1 (the first drawing line LL1) Scanning and drawing light beam LB, equipped with optical deflector 81, polarizing beam splitter PBS, 1/4 wavelength plate 82, scanner 83, bending mirror 84, telecentric f-θ lens system 85, and Y magnification correction Optical member 86. In addition, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

The optical deflector 81 uses, for example, an acousto-optic modulation element (AOM: AcoustIic Optic Modulator). The optical deflector 81 is switched ON/OFF by the control device 16 to switch the projection/non-projection of the drawing light beam LB on the substrate P at high speed. Specifically, the drawing beam LB from the beam distribution optical system SL is irradiated to the optical deflector 81 by being slightly inclined with respect to the -Z direction through the relay lens 91 of the second optical system 42. When the optical deflector 81 is switched to OFF, the drawing light beam LB goes straight in an inclined state, and is blocked by the light blocking plate 92 provided after passing through the optical deflector 81. On the other hand, when the optical deflector 81 is turned ON, the drawing beam LB incident on the optical deflector 81 becomes a primary diffracted beam and is deflected in the -Z direction, and exits from the optical deflector 81 and enters the optical deflector. The polarizing beam splitter PBS in the Z direction of the splitter 81. Therefore, when the optical deflector 81 is switched on, the drawing beam LB is projected on the substrate P, and when it is switched off, the drawing beam LB is brought into a non-projected state on the substrate P.

The polarizing beam splitter PBS reflects the drawing light beam LB irradiated from the optical deflector 81 through the relay lens 93. On the other hand, the polarizing beam splitter PBS cooperates with the 1/4 wavelength plate 82 provided between the polarizing beam splitter PBS and the scanner 83 to penetrate the substrate P (irradiated by the drawing beam LB (spot light) Or the outer peripheral surface of the rotating drum DR). In other words, the linearly polarized laser light of the drawing beam LB of the S polarized light irradiated from the polarizer 81 to the polarizing beam splitter PBS is reflected by the polarizing beam splitter PBS. Moreover, the drawing beam LB reflected by the polarizing beam splitter PBS is irradiated to the substrate P through the 1/4 wavelength plate 82 and passes through the 1/4 wavelength plate 82 again from the substrate P, thereby becoming a linearly polarized mine of P polarized light Shoot light. Therefore, from the substrate P (or rotating reel DR Peripheral surface) The reflected light generated and irradiated to the polarizing beam splitter PBS penetrates the polarizing beam splitter PBS. In addition, the reflected light passing through the polarizing beam splitter PBS is irradiated to the calibration detection system 31 through the relay lens 94. On the other hand, the drawing beam LB reflected by the polarizing beam splitter PBS passes through the quarter-wave plate 82 and enters the scanner 83.

As shown in FIGS. 4 and 7, the scanner 83 includes a mirror 96, a rotating polygon mirror 97, and an origin detector 98. The drawing beam LB passing through the quarter-wavelength plate 82 is irradiated to the mirror 96 through the relay lens 95. The drawing beam LB reflected by the reflecting mirror 96 is irradiated to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction, and a plurality of reflecting surfaces (eg, eight surfaces) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction with the rotation axis 97a as the center, thereby continuously changing the reflection angle of the drawing beam LB irradiated on the reflecting surface 97b, thereby making the reflected drawing beam LB along the substrate P The trace line LL1 scan. The drawing beam LB reflected by the rotating polygon mirror 97 is irradiated to the folding mirror 84. The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 of the substrate P. The origin detector 98 is disposed on the opposite side of the reflecting mirror 96 via the drawing light beam LB reflected by each reflecting surface 97b. Therefore, the origin detector 98 detects the drawing light beam LB irradiated before the f-θ lens system 85. That is, the origin detector 98 detects the passing of the drawing light beam LB at a point immediately before the drawing start position of the drawing line LL1 irradiated on the substrate P.

The drawing beam LB irradiated from the scanner 83 to the folding mirror 84 is reflected by the folding mirror 84 and irradiated to the f-θ lens system 85. The f-θ lens system 85 includes a telecentric f-θ lens, so that the drawing light beam LB reflected from the rotating polygon mirror 97 through the bending mirror 84 is projected vertically on the drawing surface of the substrate P. At this time, each reflection surface 97b of the rotating polygon mirror 97 and the drawing surface of the substrate P are optically conjugated in the sub-scanning direction (the longitudinal direction of the substrate P) orthogonal to the drawing line LL1. A cylindrical lens (not shown) is arranged in the optical path of the drawing beam LB of the rotating polygon mirror 97 and in the drawing path of the drawing beam LB emitted from the f-θ lens system 85, and is also provided with the f-θ lens system 85 The optical face tangle error correction optical system.

As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 are bilaterally symmetrical with respect to the central plane p3. A plurality of scanners 83, the three scanners 83 corresponding to the drawing modules UW1, UW3, UW5 are arranged on the upstream side of the rotating drum DR in the rotation direction (the side of the -X direction in FIG. 7), and the drawing module UW2 The two scanners 83 corresponding to UW4 are arranged on the downstream side of the rotating drum DR in the rotation direction (the +X direction side in FIG. 7). On the other hand, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 in between. At this time, each scanner 83 arranged on the upstream side and each scanner 83 arranged on the downstream side are configured to be 180° point-symmetrical about the rotation axis I. Therefore, after the three rotating polygon mirrors 97 on the upstream side rotate to the left (counterclockwise in the XY plane) and irradiate the rotating polygon mirror 97 with the drawing beam LB, the drawing beam LB reflected by the rotating polygon mirror 97 is from The drawing start position is scanned toward the drawing end position in a predetermined scanning direction (for example, the +Y direction in FIG. 7). On the other hand, after the two rotating polygon mirrors 97 on the downstream side irradiate the rotating polygon mirror 97 with the drawing beam LB while rotating to the left, the drawing beam LB reflected by the rotating polygon mirror 97 is directed from the drawing start position to the drawing end The position is scanned in the scanning direction (for example, -Y direction in FIG. 7) opposite to the three rotating polygon mirrors 97 on the upstream side.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB that reaches the substrate P from the odd-number drawing modules UW1, UW3, and UW5 is the same direction as the installation direction line Le1. That is to say, the azimuth line Le1 is set, and in the XZ plane, the lines connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 are connected. Similarly, when viewed in the XZ plane of Figure 4, from The axis of the drawing beams LB of the even-numbered drawing modules UW2 and UW4 reaching the substrate P is in the same direction as the set azimuth line Le2. That is, the azimuth line Le2 is set, and in the XZ plane, a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 is connected.

The optical member 86 for Y magnification correction is disposed between the f-θ lens system 85 and the substrate P. The Y-magnification correction optical member 86 slightly enlarges or reduces the Y direction dimension of the drawing lines LL1 to LL5 formed by the drawing modules UW1 to UW5.

In the drawing device 11 configured in this manner, each part is controlled by the control device 16 to draw a predetermined pattern on the substrate P. In other words, the control device 16 scans the drawing beam LB projected on the substrate P in the scanning direction, based on the CAD (Computer Aided Design) information of the pattern to be drawn on the substrate P (for example, the dot matrix form), by The ON/OFF modulation data of the light deflector 81 is used to deflect the drawing light beam LB to draw a pattern on the photosensitive layer of the substrate P. Further, the control device 16 synchronizes the scanning direction of the drawing beam LB scanned along the drawing line LL1 with the movement of the substrate P in the conveying direction by the rotation of the rotating drum DR, and accordingly corresponds to the drawing line LL1 in the exposure area A7 Partly depicts the established pattern.

At this time, the size (point diameter) of the drawing beam LB projected from each drawing module UW1 to UW5 on the substrate P is set to D (μm), and the scanning speed along the drawing lines LL1 to LL5 of the drawing beam LB is set When it is V (μm/sec), when the light source device CNT is a pulsed laser light source, the light emission repetition period T (sec) of the pulsed light is set to a relationship of T<D/V.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 8. The alignment microscopes AM1 and AM2 detect alignment marks formed on the substrate P in advance, or fiducial marks and fiducial patterns formed on the rotating drum DR. Hereinafter, the alignment mark of the substrate P and the fiducial mark and fiducial pattern of the rotating reel DR are simply referred to as marks. Align microscope AM1, AM2 series It is used to align (align) the position of the substrate P with a predetermined pattern drawn on the substrate P, or calibrate the rotating drum DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are provided on the upstream side in the rotation direction of the rotating drum DR compared with the drawing lines LL1 to LL5 formed by the drawing device 11. In addition, the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR than the alignment microscope AM2.

Alignment microscopes AM1, AM2 are the object lens system GA as a detection probe that projects the illumination light onto the substrate P or the rotating drum DR and the light generated by the mark, and the object lens system that will receive light through the object lens system GA Marked images (bright-field images, dark-field images, fluorescent images, etc.) are composed of a photographic system GD, etc., which is captured with a two-dimensional CCD, CMOS, or the like. In addition, the illumination light for alignment is light in a wavelength band that hardly has sensitivity to the photosensitive layer on the substrate P, for example, light with a wavelength of about 500 to 800 nm.

A plurality of alignment microscopes AM1 (for example, three) are arranged in a line in the Y direction (the width direction of the substrate P). Similarly, a plurality of alignment microscopes AM2 (for example, three) are arranged in a row in the Y direction (the width direction of the substrate P). In other words, there are six alignment microscopes AM1 and AM2 in total.

In FIG. 3, for easy understanding, the arrangement of the three pairs of objective lens systems GA1 to GA3 of the alignment microscope AM1 in the six alignment microscopes AM1 and AM2 is shown. The three pairs of objective lenses of the alignment microscope AM1 are the observation areas Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) of GA1 to GA3, as shown in FIG. 3, and are parallel to the rotation center line AX2 The Y direction is arranged at predetermined intervals. As shown in FIG. 8, the optical axes La1 to La3 of each pair of object lenses GA1 to GA3 passing through the centers of the observation areas Vw1 to Vw3 are all parallel to the XZ plane. Similarly, each pair of object lenses of the three alignment microscopes AM2 is the GA to the substrate P (or rotated The observation areas Vw4 to Vw6 on the outer peripheral surface of the reel DR are arranged at predetermined intervals in the Y direction parallel to the rotation center line AX2 as shown in FIG. 3. As shown in FIG. 8, the optical axes La4 to La6 of each pair of objective lens systems GA passing through the centers of the observation areas Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating drum DR.

The observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 are marked on the substrate P and the rotating drum DR, for example, set in a range of about 200 μm diagonally. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set so as to be aligned with the setting azimuth line extending from the rotation center line AX2 to the radial direction of the rotating drum DR Le3 is in the same direction. In other words, when the azimuth line Le3 is set and observed in the XZ plane of FIG. 4, it is a line connecting the observation areas Vw1 to Vw3 aligned with the microscope AM1 and the rotation center line AX2. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are set to the azimuth line extending from the rotation center line AX2 to the radial direction of the rotating drum DR Le4 is in the same direction. That is to say, when the azimuth line Le4 is set and observed in the XZ plane in FIG. 4, it is a line connecting the observation area Vw4 to Vw6 aligned with the microscope AM2 and the rotation center line AX2. At this time, since the alignment microscope AM1 is arranged upstream of the rotation direction of the rotating drum DR compared to the alignment microscope AM2, the angle formed by the center plane p3 and the azimuth line Le3 is smaller than the center plane p3 and the azimuth line The angle formed by Le4 is large.

On the substrate P, as shown in FIG. 3, the exposure areas A7 drawn by the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter, referred to as marks) for positioning are formed, for example, in a cross shape.

In FIG. 3, the mark Ks1 is provided at a certain interval in the X direction on the -Y side peripheral area of the exposure area A7, and the mark Ks3 is provided at a certain interval in the X direction in the +Y side peripheral area of the exposure area A7. Further, the mark Ks2 is provided in the center of the Y direction in the blank area between the two exposure areas A7 adjacent in the X direction.

The mark Ks1 is in the observation area Vw1 of the objective lens system GA1 aligned with the microscope AM1 and the observation area Vw4 of the objective lens system GA aligned with the microscope AM2, and can be captured in sequence during the transfer of the substrate P Way to form. In addition, the mark Ks3 is within the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and within the observation area Vw6 of the objective lens system GA of the alignment microscope AM2, and can be Formed in order to capture. Further, the mark Ks2 is respectively in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA of the alignment microscope AM2 during the conveyance period of the substrate P Formed in order to capture.

Therefore, the alignment microscopes AM1 and AM2 on the two sides in the Y direction of the rotating drum DR in the alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P at any time. In addition, the three alignment microscopes AM1 and AM2 of the center of the rotating drum DR in the Y direction of the alignment microscopes AM1 and AM2 can observe or detect the blanks formed between the exposure areas A7 drawn on the substrate P at any time. Mark Ks2.

Here, since the so-called multi-beam type drawing device 11 is applied to the exposure device EX, in order to draw the plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the drawing modules UW1 to UW5 in the Y direction It is necessary to calibrate properly to suppress the joint accuracy of the multiple drawing modules UW1~UW5 within the allowable range. In addition, aim at the microscopes AM1 and AM2 for each of the drawing lines LL1~ of the multiple drawing modules UW1~UW5 The relative arrangement relationship (or the amount of error with respect to the arrangement interval of the design) of the observation areas Vw1 to Vw6 of LL5 is called the reference line, and the relative arrangement relationship or the amount of error must be precisely determined by reference line management. For this baseline management, calibration is also required.

In the calibration for confirming the joint accuracy of the plurality of drawing modules UW1 to UW5 and the calibration for the baseline management of the alignment microscopes AM1 and AM2, at least one of the outer peripheral surfaces of the rotating drum DR supporting the substrate P Set fiducial marks or fiducial patterns. Therefore, as shown in FIG. 9, the exposure device EX uses a rotating reel DR provided with a fiducial mark or fiducial pattern on the outer peripheral surface.

The rotating drum DR has scale portions GPa and GPb forming part of the rotation position detection mechanism 14 described later on both end sides of its outer peripheral surface. In addition, the rotating reel DR is provided on the inner sides of the scale parts GPa and GPb with narrow width restriction bands CLa and CLb composed of concave grooves or convex edges. The width of the substrate P in the Y direction is set to be smaller than the distance between the two restricting belts CLa and CLb in the Y direction. The substrate P is closely attached to the outer peripheral surface of the rotating drum DR to restrict the inner region sandwiched by the belts CLa and CLb. Be supported.

The rotating drum DR is provided with a plurality of line patterns RL1 inclined at a relative rotation center line AX2 at +45 degrees on the outer peripheral surface sandwiched by the restriction bands CLa and CLb, and inclined at a relative rotation center line AX2 at -45 degrees A plurality of line patterns RL2 is a grid-shaped reference pattern (which can also be used as a reference mark) RMP repeatedly carved at a certain pitch (period) Pf1 and Pf2.

The reference pattern RMP is a diagonal pattern (inclined grid pattern) that is uniform in all directions in order to avoid changes in frictional force or tension of the substrate P at the contact portion between the substrate P and the outer surface of the rotating drum DR. In addition, the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be made a horizontal and vertical grid parallel to the Y axis and the line pattern RL2 parallel to the X axis. Pattern. Furthermore, it is not necessary to make the line patterns RL1 and RL2 intersect at 90 degrees, and the rectangular area enclosed by the two adjacent line patterns RL1 and the adjacent two line patterns RL2 can also be made into a square (or rectangular ) The angles other than the diamond shape intersect the line patterns RL1 and RL2.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4 and 8. As shown in FIG. 8, the rotation position detection mechanism 14 optically detects the rotation position of the rotary drum DR, and can be applied to an encoder system using, for example, a rotary encoder. The rotation position detection mechanism 14 has a scale part (index) GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder read heads (read heads) EN1 facing each of the scale parts GPa and GPb. EN2, EN3, EN4. In FIGS. 4 and 8, although only the four encoder read heads EN1, EN2, EN3, and EN4 that are opposed to the scale part GPa are shown, the encoder read heads EN1 that are oppositely arranged in the scale part GPb also have the same EN2, EN3, EN4 (refer to Figure 10).

The scale portions GPa and GPb are formed in a ring shape on the entire outer circumferential surface of the rotating drum DR in the circumferential direction. The scales of the scale parts GPa and GPb are formed by a diffraction grid in which concave or convex grid lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer surface of the rotating drum DR, and constitute an incremental scale. Therefore, the scale parts GPa and GPb rotate integrally with the rotating drum DR around the rotation center line AX2.

The substrate P is wound inside the scale portions GPa and GPb at both ends avoiding the rotating reel DR, that is, inside the restriction tapes CLa and CLb. If a strict arrangement relationship is required, the outer peripheral surfaces of the scale parts GPa and GPb are set to be the same as the outer peripheral surface of the portion of the substrate P wound around the rotating reel DR (the same radius from the center line AX2). In order to achieve this, the outer peripheral surfaces of the scale portions GPa and GPb, and the outer peripheral surface of the substrate winding relative to the rotating reel DR, may be made higher in the radial direction by the thickness of the substrate P. Therefore, the scale portions GPa and GPb formed on the rotating drum DR can be The surface is set to be substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale parts GPa and GPb at the same radial position as the drawing surface wound on the substrate P of the rotating reel DR, reducing the measurement position and processing position due to rotation Abbe error caused by different radial directions.

The encoder read heads EN1, EN2, EN3 and EN4 are arranged around the scale parts GPa and GPb as viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotary drum DR. The encoder read heads EN1, EN2, EN3, EN4 are connected to the control device 16. The encoder read heads EN1, EN2, EN3, and EN4 project measurement beams toward the scale parts GPa and GPb, and photoelectrically inspect their reflected beams (diffracted light), based on which the circumferential position changes of the corresponding scale parts GPa and GPb are detected The signal (for example, a 2-phase signal with a phase difference of 90 degrees) is output to the control device 16. The control device 16 performs digital processing by interpolating the detection signals (2-phase signals) from each of the encoder read heads EN1~EN4 with a counting circuit (not shown), that is, can measure the rotating volume with the resolution of submicron The change of the angle of the drum DR, that is, the measurement of the change in the circumferential position of the outer peripheral surface of the rotating drum DR at the installation positions of the encoder read heads EN1 to EN4. At this time, the control device 16 may also measure the transport speed of the substrate P in the rotating drum DR or the amount of movement in the circumferential direction from the angle change of the rotating drum DR.

Furthermore, as shown in FIGS. 4 and 8, the encoder read head EN1 is arranged on the set azimuth line Le1. The azimuth line Le1 is set in the XZ plane, and connects the line of the projection area (reading position) on the scale part GPa (GPb) of the measuring beam EN1 of the encoder read head EN1 and the rotation center line AX2. In addition, as described above, the azimuth line Le1 is provided in the XZ plane, and connects the drawing lines LL1, LL3, LL5 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2, and the connection drawing line LL1, LL3, LL5 and the rotation The line of the heart line AX2 is the same azimuth line.

Similarly, as shown in FIGS. 4 and 8, the encoder read head EN2 is arranged on the set azimuth line Le2. The azimuth line Le2 is set in the XZ plane and connects the measuring beam pair of the encoder reading head EN2 to the projection area on the scale part GPa (GPb) and the line of the rotation center line AX2. In addition, as described above, the azimuth line Le2 is provided in the XZ plane, and connects the drawing lines LL2, LL4 and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN2 and the rotation center line AX2, and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 are the same azimuth lines.

In addition, as shown in FIGS. 4 and 8, the encoder read head EN3 is arranged on the set azimuth line Le3. The azimuth line Le3 is set in the XZ plane and connects the measurement beam pair of the encoder reading head EN3 to the projection area on the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le3 is provided in the XZ plane, and connects the line aligning the observation area Vw1 to Vw3 of the microscope AM1 to the substrate P and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same azimuth line.

Similarly, as shown in FIGS. 4 and 8, the encoder read head EN4 is arranged on the set azimuth line Le4. The azimuth line Le4 is set in the XZ plane and connects the measurement beam pair of the encoder reading head EN4 to the projection area on the scale part GPa (GPb) and the line of the rotation center line AX2. In addition, as described above, the azimuth line Le4 is provided in the XZ plane, and connects the line aligning the observation area Vw4 to Vw6 of the microscope AM2 to the substrate P and the rotation center line AX2. As can be seen from the above, the line connecting the reading position of the encoder read head EN4 and the rotation center line AX2 and the line connecting the observation area Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same azimuth line.

When setting the orientation of the encoder read heads EN1, EN2, EN3, EN4 (angle direction in the XZ plane centered on the rotation center line AX2) to set the orientation line Le1, Le2, Le3, Le4, as shown in the figure As shown in 4, a plurality of drawing modules UW1 to UW5 and encoder read heads EN1 and EN2 are arranged to set the azimuth lines Le1 and Le2 at an angle ±θ° with respect to the central plane p3.

Here, the control device 16 detects the rotational angle positions of the scale parts (rotating reel DR) GPa and GPb with the encoder heads EN1 and EN2, and specifies the moving position of the substrate P based on the detected rotational angle position Perform drawing control of odd-numbered and even-numbered drawing modules UW1~UW5. That is, the control device 16 performs the ON/OFF modulation of the optical deflector 81 according to the CAD information of the pattern to be drawn on the substrate P during the scanning of the drawing beam LB projected on the substrate P in the scanning direction, but also The timing of the ON/OFF modulation using the optical deflector 81 can be performed according to the detected rotation angle position (moving position of the substrate P), whereby the pattern can be drawn on the photosensitive layer of the substrate P with good accuracy.

Furthermore, the control device 16 can store the scale parts GPa, GPb (rotating reel DR) detected by the encoder read heads EN3, EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. ), the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotation angle position of the rotating drum DR can be obtained. Similarly, the control device 16 stores the scale parts GPa and GPb (rotating reel DR) detected by the encoder read heads EN3 and EN4 when storing the reference patterns RMP on the rotating reel DR with the alignment microscopes AM1 and AM2. By rotating the angular position, the correspondence between the position of the reference pattern RMP on the rotating reel DR and the rotating angular position of the rotating reel DR can be obtained. As described above, by aligning the microscopes AM1 and AM2, the rotational angle position (or circumferential position) of the rotating drum DR at the moment when the mark is sampled in the observation areas Vw1 to Vw6 can be accurately measured. exposure The device EX, based on this measurement result, performs alignment (alignment) of the substrate P with a predetermined pattern drawn on the substrate P, or calibration of the rotary reel DR and the drawing device 11.

In addition, the multi-beam exposure device EX scans the spot light of the drawing beam LB along the plurality of drawing lines LL1 to LL5 on the substrate P while transporting the substrate P in the transport direction (longitudinal direction) with the rotating drum DR . Here, although the substrate P is wound around a part of the outer peripheral surface of the rotating reel DR and is transported, the rotating reel DR and the second optical table 25 may be affected by vibrations caused by the rotation of the rotating reel DR, etc. The configuration relationship is relatively displaced. As the displacement of the arrangement relationship between the rotating reel DR and the second optical table 25, for example, the rotating reel DR and the rotation center line AX2 may be inclined with respect to the Y direction in the XY plane. In this case, due to the displacement of the position of the rotating reel DR, the relative arrangement relationship between the substrate P wound on the rotating reel DR and the drawing device 11 provided on the second optical table 25 is determined from the predetermined suitable for exposure Displacement relative to the configuration relationship (initial setting state). Therefore, in the exposure apparatus EX of the first embodiment, in order to measure the relative arrangement relationship between the rotary reel DR and the drawing device 11, the encoder heads EN1 to EN4 are installed as shown in FIG.

10 is a plan view showing the configuration of the encoder read head of the exposure apparatus of FIG. As shown in FIG. 10, the encoder read heads (first detection devices) EN1 and EN2 are mounted on the second optical table 25 through the mounting member 100. On the other hand, the encoder read heads (second detection devices) EN3 and EN4 are mounted on the body frame 21 through the mounting member 101, and the alignment microscopes AM1 and AM2 are also mounted on the body frame 21. The encoder read heads EN1 and EN2 are provided in a pair corresponding to a pair of scale parts GPa and GPb provided on both sides of the rotation center line AX2 of the rotary drum DR. Therefore, the pair of encoder read heads EN1 and EN2 detect the rotational positions of the scale parts GPa and GPb.

In addition, a measuring rotary is provided between the first optical table 23 and the second optical table 25 A rotation amount measuring device 105 of the rotation amount of the rotation mechanism 24. The rotation amount measuring device 105 uses, for example, a linear encoder, and is arranged on the side farther from the rotation axis I so that the direction of linear motion is along the circumferential direction of the rotation axis I. The control device 16 detects the amount of rotation of the second optical table 25 relative to the first optical table 23 based on the slight amount of movement in the circumferential direction of the rotation axis I detected by the rotation amount measuring device 105. In addition, the rotating mechanism 24 includes a driving unit 106, and the driving unit 106 is driven and controlled by the control device 16 to rotate the second optical table 25. At this time, the control device 16 performs drive control of the drive unit 106 to rotate the second optical table 25 so that the rotation amount detected by the rotation amount measurement device 105 becomes a predetermined rotation amount.

FIG. 11 is a plan view illustrating a state in which the rotating drum DR and the drawing device 11 (particularly, the second optical table 25) rotate relatively slightly in the XY plane in the configuration of FIG. As shown in FIG. 11, the rotation center line AX2 of the rotating reel DR extends in the Y direction. When the rotation center line AX2 is accurately parallel to the Y axis of the stationary coordinate system XYZ, the rotation center line AX2 is located at the reference position. Here, in the XY plane, the rotation center line AX2 is inclined by a predetermined angle θ _z from the reference position due to the influence of ground vibration or vibration from a driving source in the device. In addition, in FIG. 11, the displacement to the left is set to +θ _z , and the displacement to the right is set to −θ _z . In the XY plane, if the rotation center line AX2 is inclined by a predetermined angle from the reference position, one end of the rotating drum DR in the axial direction will move in a predetermined direction (for example, -X direction in FIG. 11). The other end of the drum DR in the axial direction will move in a direction opposite to one end of the rotating drum DR (for example, +X direction in FIG. 11).

Therefore, a pair of encoder heads EN1 and EN2 are tilted from the reference position by a predetermined angle θ _z by the rotation center line AX2, and the rotation position detected by the encoder heads EN1 and EN2 on the scale part GPa side ( The movement position of the scale part GPa) and the rotation position detected by the encoder heads EN1 and EN2 on the scale part GPb side (the movement position of the scale part GPb) produce a difference corresponding to the angle θ _z . Therefore, the control device 16 can detect the inclination angle θ _z of the rotation center line AX2 of the rotating drum DR in the XY plane based on the rotation position detected by the pair of encoder read heads EN1 and EN2. Specifically, the count value (moving position of the scale GPa) counted by the counting circuit corresponding to the encoder head EN1 on the scale part GPa side is set to CD1a, and the encoder read head EN1 on the scale part GPb side When the count value (moving position of the scale GPb) of the corresponding count circuit is set to CD1b, the difference between the count value CD1a and the count value CD1b is rotated by a certain angle or every time the rotary drum DR (scale portion GPa, GPb) It is obtained one by one at a certain time, and the change of the difference value is monitored, whereby the inclination variation (angle θ _z ) of the rotation center line AX2 of the rotating drum DR in the XY plane can be measured. The same applies to the pair of encoder read heads EN2, as long as the count value (moving position of the scale GPa) counted by the counting circuit corresponding to the encoder read head EN2 on the scale part GPa side is set to CD2a, the scale part The count value (the moving position of the scale GPb) counted by the counting circuit corresponding to the encoder read head EN2 on the GPb side is set to CD2b, and the change of the difference value is monitored.

In addition, in the measurement of the tilt variation (angle θ _z ), since the pair of encoder read heads EN1 and the pair of encoder read heads EN2 are arranged symmetrically across the center plane p3 in the X direction as in the previous FIG. 4 Position, so you can also monitor the change in the count value CD1a of the encoder head EN1 opposite the scale part GPa and the difference value of the count value CD2b of the encoder head EN2 opposite the scale part GPb, or the change in the scale part GPa The difference between the count value CD2a of the encoder head EN2 facing the encoder and the count value CD1b of the encoder head EN1 facing the scale part GPb.

Here, the control device 16 corrects the position of the drawing device 11 relative to the substrate P based on the detection results of the alignment microscopes AM1 and AM2 in order to appropriately draw the drawing device 11 of the substrate P conveyed by the rotating reel DR. . That is, the control device 16 detects the shape of the substrate P or the deformation of the element pattern (base pattern) area formed on the substrate P based on the positions of the marks Ks1 to Ks3 detected by the alignment microscopes AM1 and AM2 State, the relative correction rotation amount θ ₂ corresponding to the detected deformation state (especially tilt, etc.) is obtained. In addition, the correction rotation amount θ ₂ is an angle from a reference line extending in the X direction. In addition, in FIG. 11, the displacement to the left is +θ ₂ , and the displacement to the right is -θ ₂ . Next, the control device 16 controls the drive unit 106 of the rotation mechanism 24 based on the corrected rotation amount θ ₂ obtained, thereby correcting the arrangement relationship of the second optical table 25 with respect to the rotating drum DR.

At this time, the control means 16, the correction according to the relative rotation amount of the obtained ₂ θ rotation mechanism 24 (the second optical table 25) from an initial position after the rotation correction, since the encoder head EN1, EN2 will rotate, The inclination θ _z of the rotation center line AX2 measured after the rotation correction cannot be considered, which becomes meaningless. Therefore, the control device 16 considers the inclination θ _z of the rotation center line AX2 measured in advance (or immediately before), and rotates the rotation mechanism 24 based on the corrected rotation amount θ ₂ .

Specifically, the control device 16 is such that the relative correction rotation amount θ ₂ measured based on the detection results of the alignment microscopes AM1 and AM2 becomes zero, that is, “θ ₂ -θ _z (=0°)” becomes zero In this manner, the rotation mechanism 24 is rotated while measuring the amount of rotation caused by the rotation mechanism 24 with the rotation amount measurement device 105.

In this way, the control device 16 obtains the offset information, that is, in the XY plane, from the predetermined relative arrangement relationship between the rotating drum DR and the second optical table 25 based on the detection results of the pair of encoder read heads EN1 and EN2 The inclination of the rotation center line AX2 (the inclination of the rotating drum DR in the XY plane) θ _{z is} the corrected rotation amount θ ₂ corresponding to the inclination of the substrate P in the XY plane obtained by the alignment microscopes AM1 and AM2 The driving unit 106 of the rotating mechanism 24 is controlled in such a manner that the deviation from the inclination θ _z of the rotation center line AX2 is reduced, that is, the predetermined relative arrangement relationship is maintained.

Next, a method of adjusting the exposure device EX will be described with reference to FIG. 12 is a flowchart related to the adjustment method of the exposure apparatus according to the first embodiment. When the control device 16 corrects the arrangement relationship between the rotating reel DR and the second optical table 25 with the rotation mechanism 24 in order to appropriately draw the substrate P with the drawing device 11, the control device 16 first obtains the detection with the alignment microscopes AM1 and AM2 The detection result (inclination of the element pattern area on the substrate P, etc.) (step S1). The control device 16 obtains the correction rotation amount θ ₂ to be adjusted by the rotation mechanism 24 based on the detection results detected by the alignment microscopes AM1 and AM2 (step S2). Thereafter, the control device 16 obtains information related to the tilt θ _{z from} the comparison of the detection results of the pair of encoder read heads EN1 and EN2 (step S3). The control device 16 obtains the inclination θ _{z of} the rotation center line AX2 based on the rotation angle positions (count values CD1a, CD1b, CD2a, CD2b) of the scale parts GPa and GPb detected by the pair of encoder read heads EN1 and EN2 (Step S4). Next, the control device 16 performs feedback control on the rotating mechanism 24 in such a manner that the deviation of the corrected rotation amount θ ₂ and the inclination θ _z of the rotation center line AX2, that is, “θ ₂ -θ _z ”becomes zero, Rotate it (step S5). In addition, after this step S5, the control device 16 is again based on the rotational angle positions (count values CD1a, CD1b, CD2a, CD2b) of the scale parts GPa, GPb detected by the pair of encoder read heads EN1, EN2, at appropriate time intervals to obtain the rotation of the center line AX2 of the new inclination θ _'z. Next, when the apparatus due to vibration or the like so that the new tilt θ 'when _z changes, the new system to maintain the inclination θ' _z embodiment of the rotating mechanism 24 performs feedback control.

In the first embodiment above, since the encoder heads EN1 and EN2 are mounted on the second optical table 25, the exposure device EX can obtain the rotation in the XY plane based on the detection results of the encoder heads EN1 and EN2 The offset information (inclination θ _{z of the} rotation center line AX2) from the predetermined relative arrangement relationship between the reel DR and the second optical table 25. Next, the exposure device EX can correct the relative arrangement relationship between the rotating reel DR and the second optical table 25 based on the obtained offset information. Therefore, even if the exposure device EX displaces the position of the rotating drum DR due to the vibration caused by the rotation of the rotating drum DR, the predetermined relative arrangement relationship between the rotating drum DR and the second optical table 25 can be maintained Therefore, the drawing of the drawing device 11 can be performed on the substrate P with good accuracy.

Furthermore, in the first embodiment, the encoder heads EN1 and EN2 can be provided on the installation azimuth lines Le1 and Le2. Therefore, the direction connecting the encoder head EN1 and the rotation center line AX2 and the direction connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 can be the same direction. Similarly, the direction connecting the encoder head EN2 and the rotation center line AX2 and the direction connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 can be the same direction. Therefore, the arrangement relationship between the encoder read heads EN1 and EN2 and the drawing lines LL1 to LL5 can be made consistent. Therefore, even if the position of the rotary drum DR is displaced, the arrangement relationship of the drawing lines LL1 to LL5 relative to the rotary drum DR can be measured with good accuracy by the encoder read heads EN1 and EN2, so that it is not easily interfered by interference The measurement of the impact.

Furthermore, in the first embodiment, the encoder heads EN3 and EN4 can be attached to the main body frame 21. Therefore, the exposure device EX can measure the marks Ks1 to Ks3 of the alignment microscopes AM1 and AM2 using the body frame 21 (the bearing portion of the rotating drum DR) as a stationary reference based on the detection results of the encoder heads EN3 and EN4. . Next, the exposure device EX can obtain the relative correction rotation amount θ ₂ to be corrected by the rotation mechanism 24 based on the detection results of the alignment microscopes AM1 and AM2. Therefore, the exposure device EX can accurately correct the arrangement of the rotary reel DR and the second optical table 25 based on the deviation between the calculated corrected rotation amount θ ₂ and the inclination θ _z as the offset information, that is, the rotation center line AX2 relationship.

Moreover, in the first embodiment, the encoder heads EN3 and EN4 can be provided on the installation azimuth lines Le3 and Le4. Therefore, the direction connecting the encoder head EN3 and the rotation center line AX2 and the direction connecting the observation regions Vw1 to Vw3 and the rotation center line AX2 can be the same direction. In addition, the direction connecting the encoder head EN4 and the rotation center line AX2 and the direction connecting the observation regions Vw4 to Vw6 and the rotation center line AX2 can be the same direction. Therefore, the arrangement relationship between the encoder read heads EN3 and EN4 and the observation areas Vw1 to Vw6 can be made consistent. Therefore, even if the position of the rotary drum DR is displaced, the encoder read heads EN3 and EN4 can measure the arrangement relationship with respect to the observation areas Vw1 to Vw6 of the rotary drum DR with good accuracy, so it is possible to carry out the interference less easily. The measurement of the impact.

Furthermore, in the first embodiment, by rotating the second optical table 25 with respect to the first optical table 23 by the rotating mechanism 24, the arrangement relationship between the rotating drum DR and the second optical table 25 can be corrected. Therefore, the exposure device EX can correct the drawing lines LL1 to LL5 formed by the drawing device 11 provided on the second optical table 25 to an appropriate position with respect to the substrate P wound on the rotating reel DR, so it can be performed with good accuracy The drawing device 11 draws the substrate P.

Further, in the first embodiment, although in practice to obtain a correction of the rotation amount θ ₂ after the steps S1 and S2, for the implementation of the offset information obtaining step S3 and the step S4, the configuration is not limited thereto. Steps S1 and S2 for obtaining the correction rotation amount θ ₂ and steps S3 and S4 for obtaining the offset information may be performed in parallel, and steps S3 and step for obtaining the offset information may also be performed After S4, steps S1 and S2 for obtaining the corrected rotation amount θ _{2 are} executed.

[Second Embodiment]

Next, the exposure apparatus EX of the second embodiment will be described with reference to FIG. 13. 13 is a perspective view showing the arrangement of main parts of the exposure apparatus according to the second embodiment. In addition, in the second embodiment, in order to avoid duplication of the description of the first embodiment, only the parts different from the first embodiment will be described, and the same constituent elements as the first embodiment will be given the same symbols as the first embodiment. Be explained. In the exposure apparatus EX of the first embodiment, as the displacement of the arrangement relationship between the rotating reel DR and the second optical table 25, the rotation center line AX2 of the rotating reel DR in the XY plane is described with respect to the X direction (reference position ) Inclined situation. In the exposure apparatus EX of the second embodiment, the displacement of the rotation relationship between the rotating drum DR and the second optical table 25 is described with respect to the Y direction (reference position) of the rotation center line AX2 of the rotating drum DR in the YZ plane Inclined situation.

As shown in FIG. 13, the three-point seat 22 functions as a connecting mechanism that connects the main body frame 21 with the first optical table 23 and the second optical table 25. Here, in the first embodiment, the main body frame 21 and the first optical table 23 connected by the three-point seat 22 function as the first support member, and the second optical table 25 functions as the second support member to rotate The mechanism 24 functions as a link mechanism. In the second embodiment, the main body frame 21 functions as the first support member, the first optical table 23 and the second optical table 25 connected through the rotation mechanism 24 function as the second support member, and the three-point seat 22 Play the role of linking organization.

The three-point seat 22 includes a driving unit 110 including a motor or a piezoelectric element. The driving unit 110 is driven and controlled by the control device 16 to independently adjust the length (height) in the Z direction of each support point 22a, thereby adjusting the relative The first optical platform 23 of the body frame 21 is inclined. Here, the rotation center line AX2 extends in the Y direction to extend the rotation center line AX2 in the Y direction The position is used as the reference position. In the YZ plane, the rotation center line AX2 serving as the reference position is inclined by a predetermined angle from the reference position due to the vibration and the like due to rotation. After the rotation center line AX2 is inclined from the reference position by a predetermined angle, one end of the rotating drum DR in the axial direction will move to a predetermined direction (for example, -Z direction in FIG. 13), and the rotating drum DR is at the other end of the axial direction The part moves relatively in a direction opposite to one end of the rotating drum DR (for example, +Z direction in FIG. 13).

Therefore, when a pair of encoder read heads EN1 and EN2 are mounted on the second optical table 25 (or the first optical table 23) side, the rotation center line AX2 is inclined from the reference position in the YZ plane by a predetermined angle, The rotation angle position (count value CD1a, CD2a) detected by the encoder heads EN1, EN2 on the scale part GPa side and the rotation angle position detected by the encoder heads EN1, EN2 on the scale part GPb side ( The count values CD1b and CD2b) are different. Therefore, the control device 16 can detect the inclination change of the rotation center line AX2 of the rotating drum DR in the YZ plane in the YZ plane based on the rotation angle position detected by the pair of encoder read heads EN1 and EN2. However, according to the information of the rotation angle position detected by the encoders EN1 and EN2 on the scale part GPa side or the encoder heads EN1 and EN2 on the scale part GPb side, the Z direction displacement of the rotation center line AX2 (rotating drum DR) It has almost no sensitivity, and as in the first embodiment, it has a sensitivity to the X-direction displacement of the rotation center line AX2 (rotating drum DR).

Therefore, in the second embodiment, the pair of encoder read heads EN3 and EN4 are arranged in the orientation of the alignment microscopes AM1 and AM2 shown in FIGS. 4, 8, 10 and 11. Measure the displacement in the Z direction at both ends of the rotation center line AX2 (rotating drum DR). Therefore, as shown in FIGS. 10 and 11, the encoder heads EN3 and EN4 mounted on the main body frame 21 may be mounted on the first optical table 23 or the second optical table 25 according to the scale part GPa The rotation angle position detected by a pair of encoder reading heads EN3 and EN4 (corresponding count The difference between the count value of the circuit (CD3a, CD4a) and the rotation angle position (corresponding to the count value of the count circuit CD3b, CD4b of the counting circuit) detected by a pair of encoder read heads EN3, EN4 facing the scale part GPb is detected at YZ The rotation center line AX2 of the in-plane rotating drum DR is inclined with respect to the rotation center line AX2 of the reference position.

Next, the control device 16 obtains the predetermined relative arrangement relationship between the rotary reel DR and the second optical table 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder read heads EN3 and EN4 The offset information is the inclination of the rotation center line AX2 in the YZ plane, and the driving part 110 of the three-point seat 22 is controlled in such a manner that the calculated inclination of the rotation center line AX2 decreases, that is, the predetermined relative arrangement relationship is maintained To correct the tilt of the entire second optical platform 25.

As described above, in the second embodiment, the encoder read heads EN3, EN4 (or the encoder read heads EN1, EN2) can be mounted on the second optical platform 25, according to the encoder read heads EN3, EN4 (or the encoder read head EN1, EN2) detection results (difference of rotation angle position), find the offset information (displacement in Z direction and YZ in the direction of rotation of the reel DR and the second optical table 25 in the YZ plane from the predetermined relative arrangement relationship In-plane tilt). Next, the exposure device EX can correct the relative arrangement relationship between the rotating reel DR and the second optical table 25 based on the obtained offset information. Therefore, the exposure device EX can maintain the predetermined relative arrangement relationship between the rotating drum DR and the second optical table 25 even if the position of the rotating drum DR is displaced due to the influence of vibration, etc., so that the substrate P can have good accuracy Make an exposure.

[Third Embodiment]

Next, the exposure apparatus EX of the third embodiment will be described with reference to FIG. 14. 14 is a perspective view showing the arrangement of main parts of an exposure apparatus according to a third embodiment. In addition, the third embodiment is also the same In order to avoid duplication of descriptions in the first and second embodiments, only the parts that are different from the first and second embodiments are described. For the same constituent elements as those in the first and second embodiments, the first and second The same symbols are used in the second embodiment. In the exposure apparatus EX of the first and second embodiments, the position of the drawing device 11 side (second support member side) is displaced by the rotation mechanism 24 and the three-point mount 22. In the exposure apparatus EX of the third embodiment, the positions of both ends of the rotating reel DR (rotation center axis AX2) are displaced in the X and Z directions by the X moving mechanism 121 and the Z moving mechanism 122.

As shown in FIG. 14, the rotating drum DR is provided with shaft portions Sf2 on both sides in the axial direction. Each shaft portion Sf2 is rotatably supported by the main body frame 21 through a bearing 123. The bearing 123 on both sides is provided with an X moving mechanism 121 and a Z moving mechanism 122 adjacent to each other. The X moving mechanism 121 and the Z moving mechanism 122 can move the bearing 123 in the X direction and the Z direction (fine movement).

Here, in the third embodiment, the bearing 123 functions as a first support member, the device frame 13 functions as a second support member, and each X movement mechanism 121 and each Z movement mechanism 122 function as a coupling mechanism.

The pair of X moving mechanisms 121 on both sides can move the pair of bearings 123 on both sides in the X direction to finely adjust the inclination of the rotation center line AX2 of the rotating drum DR and the X direction position in the XY plane. Here, the rotation center line AX2 extends in the Y direction as in the first embodiment, and the position of the rotation center line AX2 extending in the Y direction is used as a reference position. In the XY plane, when the rotation center line AX2 as the reference position is tilted from the reference position by a predetermined angle due to the influence of vibration, etc., the rotating drum DR can be corrected by adjusting the driving amount of the X moving mechanism 121 on either side. Incline in the XY plane.

Also, one of the two sides of the pair of Z moving mechanisms 122 can make one of the two sides of the pair of bearings 123 Move to the Z direction respectively to finely adjust the tilt of the rotation center line AX2 of the rotating drum DR and the Z direction position in the YZ plane. Here, the rotation center line AX2 extends in the Y direction as in the second embodiment, and the position of the rotation center line AX2 extending in the Y direction is used as a reference position. In the YZ plane, when the rotation center line AX2 as the reference position is tilted from the reference position by a predetermined angle due to the influence of vibration, etc., the rotation amount DR of the rotating reel DR can be corrected by adjusting the driving amount of the Z moving mechanism 122 on either side The tilt in the YZ plane.

The pair of encoder read heads EN1 and EN2 can measure the relative tilt error of the second optical table 25 and the rotating drum DR (rotation center line AX2) in the XY plane as described in the first embodiment. In addition, in the third embodiment, as in the second embodiment, when the encoder heads EN3 and EN4 are mounted on the second optical table 25 (or the first optical table 23), a pair of encoder heads EN3, EN4 can measure the relative tilt error of the second optical table 25 and the rotating drum DR (rotation center line AX2) in the YZ plane as described in the second embodiment.

Therefore, the control device 16 obtains a predetermined relative arrangement relationship between the rotating drum DR and the second optical table 25 based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder read heads EN1 and EN2 The deviation information (relative inclination θ _Z of the rotation center line AX2 in the XY plane). Further, the control device 16 measures the inclination of the element pattern area on the substrate P based on the detection results of the alignment microscopes AM1 and AM2 to obtain the corrected rotation amount θ _{2 of} the X moving mechanism 121. The control device 16 controls the driving amount of the X moving mechanisms 121 on both sides in such a manner that the deviation between the calculated corrected rotation amount θ ₂ and the inclination θ _Z of the rotation center line AX2 is reduced, that is, the predetermined relative arrangement relationship is maintained. Similarly, the control device 16 is based on the predetermined relative arrangement relationship between the rotary drum DR and the second optical platform 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder read heads EN3 and EN4. , Find the offset information, that is, the inclination of the rotation center line AX2 in the YZ plane (set to θ _X ), and use the determined inclination θ _X of the rotation center line AX2 to decrease, that is, maintain the predetermined relative configuration The relationship controls the driving amount of the Z moving mechanism 122 on both sides.

In the third embodiment above, the rotating reel DR can be rotated about the axis parallel to the Z axis with respect to the body frame 21 by the X moving mechanism 121 in the XY plane, and the rotating roll can be rotated by the Z moving mechanism 122 in the YZ plane The barrel DR rotates about an axis parallel to the X axis relative to the body frame 21 to adjust the relative arrangement relationship between the rotary drum DR and the second optical table 25. Therefore, the exposure device EX can correct the drawing lines LL1 to LL5 formed by the drawing device 11 provided on the second optical table 25 to an appropriate position with respect to the substrate P wound on the rotating reel DR, and can correct the substrate P Good precision exposure element pattern.

[Fourth Embodiment]

Next, the exposure apparatus EX of the fourth embodiment will be described with reference to FIG. 15. FIG. 15 is a diagram showing the configuration of the rotating reel and the drawing device of the exposure apparatus according to the fourth embodiment. In addition, in the fourth embodiment, in order to avoid duplication of the description of the first to third embodiments, only the parts that are different from the first to third embodiments will be described, and the same configuration as the first to third embodiments will be described. The elements will be described with the same symbols as in the first to third embodiments. The exposure apparatus EX of the third embodiment displaces the position of the rotating reel DR by the X movement mechanism 121 and the Z movement mechanism 122 that move the bearing 123. In the exposure apparatus EX of the fourth embodiment, the position of the rotating reel DR is displaced by the reel support frame 130 separate from the apparatus frame 13.

As shown in FIG. 15, the spool support frame 130 has a spool rotation mechanism 131 and a spool support member 132 in this order from the lower side in the Z direction. The reel rotation mechanism 131 is installed on the installation surface E through the anti-vibration unit SU3. The spool support member 132 is provided in the spool rotation mechanism 131 On the upper side, the shaft of the rotating drum DR is rotatably supported on both sides. The spool rotation mechanism 131 rotates the spool support member 132 around the rotation axis I a (crossing the rotation center axis AX2) parallel to the Z axis in the XY plane to adjust the rotation center line AX2 of the rotating spool DR Incline in the XY plane.

In addition, since the rotating reel DR is provided on the reel support frame 130 separate from the device frame 13, the present embodiment can omit the three-point seat 22 and the first optical table in the previous first to third embodiments. 23 and the rotation mechanism 24, only the second optical table 25 and the drawing device 11 supported thereon are provided on the body frame 21. Here, in the fourth embodiment, the spool support frame 130 functions as the first support member, the device frame 13 functions as the second support member, and the spool rotation mechanism 131 functions as the coupling mechanism.

Here, the control device 16 detects the extension relative to the Y direction based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder read heads EN1, EN2 mounted on one of the second optical platforms 25 The relative inclination θ _{Z of the} rotation reel DR (rotation center line AX2) and the second optical table 25 in the XY plane of the rotation center line AX2 of the reference position. Further, the control device 16 measures the inclination of the element pattern area on the substrate P based on the detection results of the alignment microscopes AM1 and AM2 to obtain the corrected rotation amount θ _{2 of} the reel rotation mechanism 131. The control device 16 controls the spool rotation mechanism 131 in such a manner that the deviation between the calculated corrected rotation amount θ ₂ and the inclination θ _Z of the rotation center line AX2 decreases, that is, the predetermined relative arrangement relationship is maintained. In addition, the encoder heads EN3 and EN4 arranged in the same direction as the installation direction of the alignment microscopes AM1 and AM2 are attached to the second optical table 25, but may be attached to the reel support member 132 side.

As described above, in the fourth embodiment, since the reel support frame 130 is rotated by the reel rotation mechanism 131, the rotating reel DR can be rotated relative to the second optical table 25. The relative arrangement relationship between the rotating drum DR and the second optical table 25 can be corrected. Therefore, the exposure device EX can adjust the substrate P wound on the rotating reel DR to an appropriate position relative to the drawing lines LL1 to LL5 formed by the drawing device 11 provided on the second optical table 25, and can Good precision exposure element pattern.

[Fifth Embodiment]

Next, the exposure apparatus EX of the fifth embodiment will be described with reference to FIG. 16. 16 is a plan view showing the arrangement of the encoder read head of the exposure apparatus of the fifth embodiment. In addition, in the fifth embodiment, in order to avoid duplication of the description of the first to fourth embodiments, only the parts that are different from the first to fourth embodiments will be described, and the same configuration as the first to fourth embodiments will be described. The elements will be described with the same symbols as in the first to fourth embodiments. The exposure apparatus EX of the first embodiment detects the tilt of the rotating reel DR with a pair of encoder read heads EN1 and EN2. In the fifth embodiment, the tilt of the rotating drum DR is detected by a pair of encoder read heads EN1, EN2 and a pair of encoder read heads EN5, EN6.

As shown in FIG. 16, a pair of encoder read heads EN1 and EN2 are mounted on the second optical table 25 through the mounting member 100. In addition, a pair of encoder read heads EN5 and EN6 are mounted on the main body frame 21 through the mounting member 141. Here, each encoder read head EN1 and each encoder read head EN5 are arranged adjacent to each other with a certain gap in the Y direction. In addition, the Y direction widths of the scale parts GPa and GPb are set to be wider in such a manner that each of the two encoder read heads EN1 and EN5 adjacent to the Y direction can detect the scale parts GPa and GPb. .

Here, since the rotating drum DR is mounted on the body frame 21, the control device 16 is based on the rotation angle position detected by each of the pair of encoder read heads EN5, EN6 (corresponding to the count values CD5a, CD5b of the counting circuit , CD6a, CD6b), detect the inclination θ _ZR of the rotation center line AX2 of the rotating drum DR in the XY plane, and use the detected inclination θ _ZR as the reference position. That is, the count value CD5a of the encoder head EN5 facing the scale part GPa on one side of the rotation center axis AX2 and the encoder read head facing the scale part GPb on the other side of the rotation center axis AX2 The change of the difference value of the count value CD5b of EN5, or the encoder read head EN6 of the encoder head opposite to the scale part GPa and the encoder read head of the encoder part opposite to the scale part GPb on the other side of the rotation center axis AX2 The change of the difference value of the count value CD56 of EN6 can measure the change of the inclination θ _ZR of the rotating reel DR with the body frame 21 as a reference in the XY plane.

In addition, the control device 16 obtains the rotating reel DR based on the rotation angle position (count value CD1a, CD1b, CD2a, CD2b) detected by the pair of encoder heads EN1 and EN2, as in the first embodiment. The relative inclination θ _Z with respect to the second optical table 25 in the XY plane. Therefore, based on the inclination θ _ZR measured based on the rotation angle position detected with each of the pair of encoder read heads EN5, EN6, and based on the measured rotation angle position detected with the pair of encoder read heads EN1, EN2 By tilting θ _Z , the second optical table 25 is rotated by the rotation mechanism 24, so that the second optical table 25 and the drawing device 11 supported by the second optical table 25 can be set to have no rotation error with respect to the body frame 21 (static reference). However, as in the first embodiment, when the tilt error corresponding to the element pattern area formed on the substrate P is added, the relative tilt from the element pattern area measured based on the detection results of the alignment microscopes AM1 and AM2 is added The rotation mechanism 24 is driven by the correction amount corresponding to θ ₂ .

As described above, in the fifth embodiment, it is possible to detect the inclination θ of the rotation center line AX2 of the rotating drum DR based on the main body frame 21 in the XY plane based on the rotation position detected by the pair of encoder read heads EN5 and EN6 _ZR . Therefore, the control device 16 can measure the reference position of the rotation center line AX2 of the rotating reel DR, whereby the predetermined relative arrangement relationship between the rotating reel DR and the second optical table 25 can be measured with good accuracy. In particular, when performing the first exposure to the pattern for drawing the first layer of the device pattern area on the substrate P, even if the rotating reel DR is inclined in the XY plane with respect to the body frame 21 as a stationary reference, it can be corrected The pattern exposed for the first time is tilted on the substrate P and transferred.

[Sixth Embodiment]

Next, the exposure apparatus EX of the sixth embodiment will be described with reference to FIG. Fig. 17 is a plan view showing the arrangement of the scale disc of the exposure apparatus of the sixth embodiment. In addition, in the sixth embodiment, in order to avoid duplication of descriptions from the first to fifth embodiments, only the parts different from the first to fifth embodiments will be described, and the same configuration as the first to fifth embodiments will be described. The elements will be described with the same symbols as in the first to fifth embodiments. The exposure apparatus EX of the first to fifth embodiments detects the rotational position of the rotating reel DR using the scale parts GPa and GPb formed on the outer peripheral surface of the rotating reel DR. The exposure apparatus EX of the sixth embodiment uses a high-roundness scale disc SD attached to the rotating reel DR to detect the rotating position of the rotating reel DR.

As shown in FIG. 17, this scale disc SD has scale portions GPa and GPb engraved on the outer peripheral surface, and is fixed at the end of the rotating drum DR to be orthogonal to the rotation center line AX2. Therefore, the scale disc SD rotates integrally with the rotating drum DR around the rotation center line AX2. In addition, the scale disc SD uses low thermal expansion metal, glass, ceramics, etc. as a base material. In order to improve the measurement decomposition ability, the diameter should be as large as possible (for example, a diameter of 20 cm or more). In FIG. 17, although the diameter of the outer peripheral surface of the scale disc SD is shown to be smaller than the diameter of the outer peripheral surface of the photosensitive drum DR, the diameter of the scale portion GP of the scale disc SD can be set and wound to rotate The diameter of the outer peripheral surface of the substrate P of the reel DR is the same (approximately the same), and the so-called measurement Abbe error can be further reduced.

As described above, in the sixth embodiment, since the scale disc SD of different individuals can be installed It is mounted on the rotating reel DR, so the scale disc SD suitable for the rotating reel DR can be selected. In addition, as the scale disc SD, a mechanism capable of finely adjusting the roundness (compression screws, etc.) can be used at a plurality of places in the circumferential direction, so that the eccentricity error of the scale part GP from the rotation center axis AX2 can be further reduced Or the measurement error (cumulative error) caused by the pitch error of the scale (diffraction grid).

In addition, although the first to sixth embodiments use the scanning spot light drawing device 11 to form the pattern on the substrate P, it is not limited to this configuration as long as it is a device that forms a pattern on the substrate P, for example, It is possible to use a projection or reflection type flat or cylindrical photomask to project and expose the projection beam from the photomask to the substrate P to form a pattern on the substrate P. Furthermore, it is also possible to replace the photomask by projecting the light distribution corresponding to the pattern to be drawn on the substrate P by a digital micromirror device (DMD) in which a plurality of tiltable micromirrors are arranged in a matrix. Way of exposure device. In addition, as an apparatus for forming a pattern on the substrate P, for example, an inkjet-type drawing apparatus for forming a pattern on the substrate P using an ejection head that ejects droplets such as ink may be used. In the case of such a maskless exposure machine or inkjet drawing device, for example, as disclosed in Japanese Patent Laid-Open No. 2010-091990, the light distribution corresponding to the pattern made by DMD can be projected onto the substrate P A plurality of exposure portions (pattern forming portions) are arranged in the width direction of the substrate P, or a plurality of droplet coating portions (pattern forming portions) provided with inkjet ink nozzles are arranged in the width direction of the substrate P A configuration is adopted in which the entire plurality of exposure sections or the entire plurality of droplet application sections can rotate relatively with respect to the substrate P in the XY plane.

Further, in the first to sixth embodiments, the second optical table 25 that fixes the plurality of drawing modules UW1 to UW5 constituting the drawing device 11 is rotated in the XY plane by the rotation mechanism 24, but In order to adjust the lines of the drawing lines LL1 to LL5 in parallel in the XY plane or to adjust them with a predetermined inclination in the XY plane, a drawing module UW1 can also be provided Each of the actuators ~UW5 rotates slightly on the second optical table 25 in the XY plane (second rotation mechanism, drive mechanism). In this case, an individual angle measurement sensor for measuring the rotation angle position (inclination amount, etc.) of the drawing modules UW1 to UW5 (pattern forming part) relative to the second optical table 25 can be provided. The inclination of the second optical table 25 measured in the encoder reading head EN1 or EN2 in the XY plane and the inclination of each of the drawing modules UW1 to UW5 measured by the individual angle measurement sensor (second detection device) In addition, the inclination of each of the drawing lines LL1 to LL5 on the substrate P is adjusted. Therefore, during the rotation of the rotating reel DR to convey the substrate P in the longitudinal direction (X direction) at a constant speed, even if the substrate P has a slight displacement in the Y direction on the rotating reel DR, it accompanies When slightly tilting the conveying direction of the substrate P here, the position of the alignment marks Ks1 to Ks3 can be measured sequentially by the alignment microscope AM1 (or AM2). Therefore, the drawing line LL1 can be matched with the tilt ~LL5 controls the actuators (driving mechanisms) of the drawing modules UW1~UW5 by tilting them respectively. With this, even when a new pattern is superimposed on the base pattern for electronic components (for example, the first layer pattern) that has been formed on the exposed area A7 of the substrate P, the phenomenon of meandering may occur during the transportation of the substrate P. The exposure area A7 on the substrate P maintains the lamination accuracy in a good manner overall.

Furthermore , in the first to sixth embodiments, the second optical table 25 supporting the drawing device 11 and the main body frame 21 supporting the rotating reel DR are relatively slightly in the XY plane (or in the YZ plane). A driving mechanism such as a rotating motor (rotating mechanism 24, driving portion 110 of three-point mount 22, X moving mechanism 121, and Z moving mechanism 122). However, instead of electric operation of a motor or the like, manual operations such as adjustment screws, micromanometers, and replacement of washers of different thicknesses are used to relatively match the spatial arrangement relationship of the drawing device 11 and the rotating drum DR A connection mechanism for connecting the second optical platform 25 and the main body frame 21 in a fine-tuning manner. The coupling mechanism having such a manually-operated adjustment part removes the second optical platform 25 (first optical platform 23) equipped with the drawing device 11 from the body frame 21 and re-assembles the device during assembly or maintenance and inspection, for example When the three-point mount 22 is attached to the main body frame 21 or the like, it is useful when finely adjusting the position of the three-point mount 22 in the XYZ direction.

<Component manufacturing method>

Next, the element manufacturing method will be described with reference to FIG. 18. Fig. 18 is a flowchart showing a method of manufacturing a device in each embodiment.

The device manufacturing method shown in FIG. 18 first performs function and performance design of a display panel formed using self-luminous elements such as organic EL, and designs circuit patterns and wiring patterns required by CAD or the like (step S201). And prepare a roll for supplying the flexible substrate P (resin film, metal foil film, plastic, etc.) as the base material of the display panel (step S202). In addition, the roll-shaped substrate P prepared in this step S202 may be the one whose surface has been modified as necessary, or the bottom layer has been formed in advance (for example, micro unevenness by imprint), or the light is pre-stacked Inductive functional film or transparent film (insulating material).

Next, a substrate layer composed of electrodes or wiring, an insulating film, a TFT (thin film semiconductor), etc. constituting a display panel element is formed on the substrate P, and light emission composed of self-luminous elements such as organic EL is formed by being laminated on the substrate Layer (display pixel portion) (step S203). In this step S203, it also includes the conventional lithography process for exposing the photoresist layer using the exposure device EX described in the previous embodiments, and the substrate P coated with a photosensitive silane coupling agent instead of the photoresist Wet process of pattern exposure to form a water-repellent pattern on the surface, pattern exposure of the photosensitive catalyst layer to form metal film patterns (wiring, electrodes, etc.) by electroless plating, Or printing patterns with conductive ink containing silver nanoparticles Processing, etc.

Next, for each display panel element that is continuously manufactured on the long substrate P in a roll, the substrate P is cut, or a protective film (environmental barrier layer) or color filter film is attached to the surface of each display panel element. Assemble the component (step S204). Next, a check step is performed whether the display panel element can operate normally, or whether it satisfies the desired performance and characteristics (step S205). Through the above method, a display panel (flexible display) can be manufactured. In addition to the manufacture of display panels as shown in FIG. 18, flexible printed circuit boards that require precision wiring patterns (high-density wiring), chemical sensor sheets with semiconductor elements such as TFTs and electrode patterns for sensing, Alternatively, when a DNA wafer or the like is manufactured on the flexible substrate P, the exposure apparatus of each embodiment described above can also be used.

11: Painting device

13: Device frame

21: Ontology framework

22: three o'clock

22a: Support point

23: The first optical platform

24: Rotating mechanism

25: 2nd optical platform

AX2: rotation centerline

DR: rotating reel

EX: Exposure device

I: rotary axis

P: substrate

RT2: tension adjustment roller

Sf2: Shaft

UW1~UW5: drawing module

Claims (10)

A substrate processing device that transports a long sheet-shaped substrate in a long-side direction, and sequentially forms a predetermined pattern on the sheet-shaped substrate, includes: a cylindrical reel having a cross-section extending from crossing the aforementioned long-side direction The center line of the direction starts from a cylindrical outer peripheral surface of a certain radius, and supports the sheet substrate with a part of the outer peripheral surface; the first support member supports the cylindrical reel shaft to rotate around the center line; pattern formation The device is arranged to face the portion of the outer peripheral surface of the cylindrical reel that supports the sheet substrate, and the pattern is formed on the sheet substrate; the second support member holds the pattern forming device; the coupling mechanism, the circle The relative arrangement relationship between the drum reel and the pattern forming device is connected to be adjustable; the reference member rotates with the cylindrical reel around the center line, and is provided to measure the rotation direction of the cylindrical reel or the center line direction The index of the position change; the first detection device, which is provided on the side of the second support member, detects the index of the reference member to detect the positional change of the rotation direction of the cylindrical reel or the centerline direction; and the second The detection device is provided on the first support member side and detects the index of the reference member. A substrate processing device as claimed in item 1 of the patent application, wherein the first detection device is arranged on the second support member such that the patterning device applies a pattern to the sheet substrate when viewed from the extending direction of the centerline The formation position substantially coincides with the direction connecting the detection position of the index of the reference member by the first detection device and the center line. For example, the substrate processing device of item 2 of the patent application scope is further provided with a mark detection device It is provided on the side of the first support member and has a detection probe for detecting marks formed on the sheet substrate; the second detection device is disposed on the first support member so as to be located from the center line When viewed in the extending direction, the detection position of the index of the reference member by the second detection device substantially coincides with the direction connecting the detection position of the detection probe to the mark and the center line. The substrate processing apparatus according to any one of claims 1 to 3, wherein the connection mechanism is provided between the first support member and the second support member to be in contact with the first support member and the first 2 A predetermined point in the plane where the supporting members cross in the opposite direction is the center, and the second supporting member is connected so as to be rotatable relative to the first supporting member. The substrate processing apparatus according to any one of claims 1 to 3, wherein the coupling mechanism is such that the centerline as the rotation axis of the cylindrical reel is relatively inclined to the patterning device, The rotation axis of the cylindrical reel is connected so as to be tiltable. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first support member has a main body frame disposed on the installation surface, a first platform provided on the main body frame, and the foregoing A support mechanism between the body frame and the first platform; the second support member has a second platform disposed on the first platform. The substrate processing apparatus according to any one of claims 1 to 3, wherein the coupling mechanism includes a driving section that relatively displaces the first support member and the second support member; the index of the reference member is the A pair of scale parts of a rotary measurement encoder are provided on both sides of the center line direction of the cylindrical reel; the first detection device and the second detection device are each paired with the pair of scale parts To configure one pair of read heads. For example, the substrate processing apparatus of claim 7 further includes: a control device that controls the drive unit; and the control device that obtains the cylindrical reel and the cylindrical reel based on the detection results of the pair of reading heads The offset information from the predetermined relative arrangement relationship of the second support member, and based on the offset information, the drive unit is controlled to maintain the predetermined relative arrangement relationship. The substrate processing apparatus according to any one of the patent application items 1 to 3, wherein the pattern forming device described on/off modulation based on the CAD information of the pattern to be drawn on the sheet substrate The spot light of the beam is scanned one-dimensionally in the direction of the center line to depict the pattern, and a flat or cylindrical mask for transmission or reflection is used to expose the pattern to the mask on the sheet substrate. Any one of a device and a maskless exposure device that projects and exposes the light distribution corresponding to the pattern to be drawn on the sheet substrate with a plurality of micromirrors on the sheet substrate. The substrate processing apparatus as claimed in any one of claims 1 to 3, wherein the pattern forming device is an inkjet method in which the ink pattern is formed on the sheet substrate by an ejection head that ejects ink droplets Depicting device.

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