CN108351607B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN108351607B
CN108351607B CN201680063524.2A CN201680063524A CN108351607B CN 108351607 B CN108351607 B CN 108351607B CN 201680063524 A CN201680063524 A CN 201680063524A CN 108351607 B CN108351607 B CN 108351607B
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China
Prior art keywords
substrate
center line
drum
pattern
rotation
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CN201680063524.2A
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Chinese (zh)
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CN108351607A (en
Inventor
小宫山弘树
加藤正纪
铃木智也
奈良圭
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Nikon Corp
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Nikon Corp
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Priority to CN202010741934.6A priority Critical patent/CN111781806B/en
Priority to CN202010743918.0A priority patent/CN111781807B/en
Publication of CN108351607A publication Critical patent/CN108351607A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Abstract

The exposure apparatus EX, which forms a predetermined pattern on a long substrate P while conveying the substrate P in a longitudinal direction, includes: a cylindrical drum DR supporting the substrate P; a main body frame 21 and a1 st optical surface plate 23 as a1 st supporting member for supporting the cylindrical drum DR; a drawing device 11 disposed opposite to the rotary drum DR with the substrate P interposed therebetween, for forming a pattern on the substrate P; the 2 nd optical stage 25 as the 2 nd supporting member holds the drawing device 11; a rotation mechanism 24 for rotatably connecting the 1 st optical bench 23 and the 2 nd optical bench 25; scale parts GPa, GPb for measuring a change in position of the drum DR; and encoder readheads EN1, EN2 that detect the scale of the scale portions GPa, GPb.

Description

Substrate processing apparatus
Technical Field
The invention relates to a substrate processing apparatus, an adjusting method of the substrate processing apparatus, a component manufacturing system and a component manufacturing method.
Background
Conventionally, as a substrate processing apparatus, there is known a proximity type pattern exposure apparatus including an exposure drum for conveying a sheet-like workpiece (substrate), a mask arranged on an upper portion of the exposure drum, and an illumination portion for scanning light from an exposure light source with a rotary polygon mirror and irradiating the light on the exposure mask (see, for example, patent document 1). The pattern exposure apparatus exposes a mask pattern of a mask to a workpiece by irradiating the mask with light from an illumination unit while conveying a sheet-like workpiece by an exposure drum. The pattern exposure apparatus described in patent document 1 conveys a workpiece by winding the workpiece around an exposure drum, but may change the positional relationship between a mask and the workpiece due to the influence of vibration or the like caused by the rotation of the exposure drum. In this case, since the positional relationship between the work wound around the exposure drum and the mask is shifted from the predetermined positional relationship suitable for exposure, it is difficult to accurately expose the mask pattern of the mask to the work.
Documents of the prior art
Patent document 1: japanese patent laid-open publication No. 2007-72171
Disclosure of Invention
According to the 1 st aspect of the present invention, there is provided a substrate processing apparatus for conveying a long sheet-like substrate in a longitudinal direction and sequentially forming a predetermined pattern on the sheet-like substrate, comprising: a cylindrical drum having a cylindrical outer peripheral surface with a constant radius from a center line extending in a direction intersecting the longitudinal direction, the cylindrical drum supporting the sheet-like substrate with a part of the outer peripheral surface; a1 st support member for supporting the drum rotatably around the center line; a pattern forming device disposed opposite to a portion of the outer peripheral surface of the cylindrical drum, the portion supporting the sheet-like substrate, the pattern forming device forming the pattern on the sheet-like substrate; a2 nd support member that holds the pattern forming device; a connecting mechanism for connecting the relative arrangement relationship between the cylinder drum and the pattern forming device to be adjustable; a reference member that rotates around the center line together with the drum, and that is provided with an index for measuring a change in position in the direction of rotation of the drum or in the direction of the center line; and a1 st detecting device provided on the 2 nd support member, for detecting an index of the reference member to detect a change in position in the rotation direction or the center line direction of the cylindrical drum.
According to the 2 nd aspect of the present invention, there is provided an adjusting method of a substrate processing apparatus having a cylindrical drum supported by a1 st support member so as to rotate around a center line and a sheet-like substrate on a cylindrical outer peripheral surface having a certain radius from the center line, and a pattern forming device supported by the 2 nd support member so as to form a predetermined pattern on the sheet-like substrate supported by the cylindrical drum, the adjusting method comprising: reading the respective operations of a pair of scale portions of a rotation measuring encoder provided on both sides of the cylindrical drum in the center line direction by a pair of reading heads disposed on the 2 nd support member side; an operation of obtaining a deviation from a predetermined relative arrangement relationship between the cylinder drum and the pattern forming apparatus from a detection result of the pair of heads; and adjusting the operation of a coupling mechanism for coupling the 1 st support member and the 2 nd support member to be relatively displaceable so as to reduce the obtained deviation.
According to the 3 rd aspect of the present invention, there is provided an adjusting method of a substrate processing apparatus having a cylindrical drum supported by a1 st support member so as to rotate around a center line and a pattern forming device supported by a2 nd support member so as to form a predetermined pattern on a sheet-like substrate supported by the cylindrical drum, the adjusting method comprising: reading the respective operations of a pair of scale portions of a rotation measuring encoder provided on both sides of the cylindrical drum in the center line direction by a pair of reading heads disposed on the 2 nd support member side; an operation of obtaining a deviation from a predetermined relative arrangement relationship between the cylinder drum and the pattern forming apparatus from a detection result of the pair of heads; and an operation of adjusting a spatial position of a region where the pattern forming apparatus forms a pattern on the sheet-like substrate with respect to the drum roll by reflecting the obtained deviation.
According to the 4 th aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus according to the 1 st aspect of the present invention.
According to the 5 th aspect of the present invention, there is provided a device manufacturing method, wherein the pattern forming apparatus according to the 1 st aspect of the present invention is an exposure apparatus for irradiating the sheet-like substrate with light energy corresponding to a shape of a predetermined pattern; and comprises: an operation of conveying the sheet-like substrate having the photosensitive functional layer formed on the surface thereof in the longitudinal direction while being supported by a part of the cylindrical drum; irradiating a portion of the sheet-like substrate supported by the drum with light energy from the exposure device; and forming a layer corresponding to the shape of the predetermined pattern on the sheet-like substrate by processing the irradiated sheet-like substrate.
According to the 6 th aspect of the present invention, there is provided a substrate processing apparatus for sequentially forming a predetermined pattern on a long sheet-like substrate while conveying the sheet-like substrate in a longitudinal direction, the apparatus comprising: a1 st support member that pivotally supports a cylindrical drum having a cylindrical outer peripheral surface with a constant radius from a center line extending in a direction intersecting the longitudinal direction, the cylindrical drum being rotatable around the center line while supporting the sheet-like substrate with a part of the outer peripheral surface; a2 nd support member for holding a plurality of pattern forming portions arranged in a width direction of the sheet-like substrate, the pattern forming portions being disposed so as to face a portion of the outer peripheral surface of the cylindrical roll, the portion supporting the sheet-like substrate, in order to form the pattern on the sheet-like substrate; a1 st rotation mechanism capable of adjusting a relative angular relationship between the 1 st support member and the 2 nd support member in order to adjust an inclination of the pattern to be formed on the sheet-like substrate; a reference member that rotates around the center line together with the drum, and that is provided with an index for measuring a change in position in the direction of rotation of the drum or in the direction of the center line; and a1 st detection device provided on the 2 nd support member side, detecting an index of the reference member to detect a change in position in the rotational direction of the cylindrical drum, and detecting a change in relative angle between the 1 st support member and the 2 nd support member.
Drawings
Fig. 1 is a diagram showing the entire configuration of an exposure apparatus (substrate processing apparatus) according to embodiment 1.
Fig. 2 is a perspective view showing the configuration of the main part of the exposure apparatus of fig. 1.
Fig. 3 is a diagram showing a relationship between the alignment microscope and the drawing line on the substrate.
Fig. 4 is a view showing the configuration of the rotary drum and the drawing device of the exposure apparatus of fig. 1.
Fig. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of fig. 1.
Fig. 6 is a perspective view showing the configuration of a divergent optical system of the exposure apparatus of fig. 1.
Fig. 7 is a diagram showing the arrangement relationship of a plurality of scanners of the exposure apparatus of fig. 1.
Fig. 8 is a perspective view showing the arrangement relationship between the alignment microscope and the scribe line and the encoder head on the substrate.
Fig. 9 is a perspective view showing a surface configuration of a rotating drum of the exposure apparatus of fig. 1.
Fig. 10 is a plan view showing the arrangement of an encoder head of the exposure apparatus of fig. 1.
Fig. 11 is a plan view showing the arrangement relationship between the rotary drum and the drawing device of the exposure apparatus of fig. 1.
Fig. 12 is a flowchart showing the method for adjusting the exposure apparatus according to embodiment 1.
Fig. 13 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to embodiment 2.
Fig. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to embodiment 3.
Fig. 15 is a diagram showing the configuration of the rotary drum and the drawing device according to embodiment 4.
Fig. 16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to embodiment 5.
Fig. 17 is a plan view showing the arrangement of the scale disk of the exposure apparatus according to embodiment 6.
Fig. 18 is a flowchart showing a device manufacturing method according to embodiments 1to 5.
Description of the symbols
1 element manufacturing system
11 drawing device
12 substrate conveying mechanism
13 device frame
14 rotation position detecting mechanism
16 control device
21 body frame
22 three-point seat
23 st optical bench
24 rotating mechanism
25 nd 2 optical bench
31 calibration detection system
44, 45 XY halving adjusting mechanism
511/2 wave plate
52 polarizer
53 light diffuser
60 st beam splitter
62 nd 2 beam splitter
63 rd 3 beam splitter
73 th 4 beam splitter
81 light deflector
821/4 wave plate
83 scanner
84 bending mirror
85 f-theta lens system
Optical member for 86Y magnification correction
92 light screen
96 reflecting mirror
97 rotating polygonal mirror
98 origin detector
Mounting members for 100 encoder readheads EN1, EN2
Mounting members of 101 encoder readheads EN3, EN4
105 rotation amount measuring device
106 drive part of rotation mechanism
110 three-point seat driving part
121X moving mechanism
122Z moving mechanism
123 bearing
130 reel support frame
131 reel rotating mechanism
132 roll support member
Mounting members of 141 encoder read heads EN5, EN6
P substrate
U1, U2 processing unit
EX exposure device
AM1, AM2 alignment microscope
EVC temperature-regulating chamber
SU1, SU2 anti-vibration A-N
E set side
EPC edge location controller
RT1, RT2 tension adjusting roller
DR rotating drum
AX2 center line of rotation
Sf2 axle part
p3 center plane
D L relaxation
UW 1-UW 5 drawing module
CNT light source device
L B depicts a light beam
I rotating shaft
LL 1-LL 5 drawing lines
PBS (polarizing beam splitter)
A7 Exposure Domain
S L light beam distribution system
L e 1-L e4 set the orientation line
Vw 1-Vw 6 observation area
Ks 1-Ks 3 alignment mark
GPa, GPb scale part
EN 1-EN 6 encoder readhead
SD scale disc
Detailed Description
The mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The constituent elements described below include those that can be easily conceived by a person having ordinary skill in the art to which the invention pertains and those that are substantially the same. Further, the constituent elements described below may be appropriately combined. Various omissions, substitutions, and changes in the components may be made without departing from the spirit of the invention.
[ embodiment 1 ]
Fig. 1 is a diagram showing the entire configuration of an exposure apparatus (substrate processing apparatus) according to embodiment 1. The substrate processing apparatus according to embodiment 1 is an exposure apparatus EX for performing exposure processing on a substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 for performing various processes on the substrate P after exposure to manufacture a device. First, the element manufacturing system 1 is explained.
< component manufacturing System >
The device manufacturing system 1 is a manufacturing line (flexible display manufacturing line) for manufacturing a flexible display as a device, the flexible display is, for example, an organic E L display, and the like, the device manufacturing system 1 is a so-called roll-to-roll (Ro11to Ro11) system in which a flexible (flexible) substrate P is fed from a supply roll (not shown) in which the substrate P is rolled into a roll shape, various kinds of processing are continuously applied to the fed substrate P, and the processed substrate P is wound as a flexible element around a recovery roll (not shown), the device manufacturing system 1 of embodiment 1 is an example in which a sheet-like substrate P in a thin film form is fed from a supply roll, and the substrate P fed from the supply roll is sequentially passed through a processing apparatus U1, an exposure apparatus EX, and a processing apparatus U2 and then wound around the recovery roll, and the substrate P to be processed by the device manufacturing system 1 is described here.
The substrate P is, for example, a resin film, a foil (foil) made of metal such as stainless steel, or an alloy thereof. The resin film may be made of one or more materials selected from polyethylene resin, polypropylene resin, polyester resin, ethylene-vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and polyvinyl alcohol resin.
The substrate P is preferably selected such that the thermal expansion coefficient is not significantly large and substantially negligible, for example, the amount of deformation due to heat in various processes performed on the substrate P is substantially negligible. The coefficient of thermal expansion can be set to be smaller than a threshold value corresponding to a processing temperature or the like by, for example, mixing an inorganic filler with the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. The substrate P may be a single-layer body of an extra thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminate body in which the above-mentioned resin film, foil, or the like is laminated on the extra thin glass.
The substrate P configured in this manner is wound into a roll shape to be a supply roll, and the supply roll is mounted on the device manufacturing system 1. The component manufacturing system 1 equipped with a supply reel repeatedly performs various processes for manufacturing components on a substrate P fed out in a longitudinal direction from the supply reel. Therefore, the processed substrate P is in a state where a plurality of elements are connected. That is, the substrate P fed from the supply roll is a multi-surface substrate. The substrate P may be subjected to a predetermined pretreatment to modify the surface thereof and activate the same, or a fine barrier rib structure (uneven structure) for fine patterning may be formed on the surface thereof.
The processed substrate P is wound into a roll and collected as a collection roll. The collection reel is attached to a cutting device, not shown. The cutting device equipped with the recovery reel cuts (cuts) the processed substrate P into individual elements, thereby forming a plurality of elements. The dimension of the substrate P is, for example, about 10cm to 2m in the width direction (short-side direction) and 10m or more in the longitudinal direction (long-side direction). The size of the substrate P is not limited to the above size.
Next, the device manufacturing system 1 will be described with reference to fig. 1. The device manufacturing system 1 includes a processing apparatus U1, an exposure apparatus EX, and a processing apparatus U2. Fig. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is a direction from the processing apparatus U1 to the processing apparatus U2 through the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane and is a width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.
The processing apparatus U1 performs pre-process processing (pre-processing) on the substrate P subjected to the exposure processing by the exposure apparatus EX. The processing apparatus U1 sends the substrate P subjected to the pretreatment to the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on the surface of which a photosensitive functional layer (photosensitive layer) is formed.
Here, the photosensitive functional layer is applied as a solution onto the substrate P and dried to be a layer (film). A typical photosensitive functional layer includes a photoresist, but as a material unnecessary after development, there are a photosensitive silane coupling agent (SAM) modified in lyophilicity in a portion irradiated with ultraviolet rays, a photosensitive reducing material in which a reducing group is exposed in a portion irradiated with ultraviolet rays, and the like. When a photosensitive silane coupling agent is used as the photosensitive functional layer, since the pattern portion exposed to ultraviolet light on the substrate P is modified from liquid repellency to lyophilic, a conductive ink (ink containing conductive nanoparticles such as silver or copper) is selectively applied to the lyophilic portion to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, since the plating reducing group is exposed at the pattern portion exposed to ultraviolet light on the substrate P, the substrate P is immersed in an electroless plating solution containing palladium ions or the like for a certain period of time immediately after the exposure to form (precipitate) a pattern layer of palladium.
For example, the substrate P supplied from the processing apparatus U1 is drawn with a pattern of a circuit, wiring, or the like for a display, and as will be described later in detail, the substrate P is exposed by the exposure apparatus EX via a plurality of drawing lines LL 1to LL 5 obtained by scanning each of a plurality of drawing light beams L B in a predetermined scanning direction.
The processing apparatus U2 performs post-process processing (post-processing) on the substrate P subjected to the exposure processing by the exposure apparatus EX. The substrate P subjected to the exposure process by the exposure apparatus EX is sent to the processing apparatus U2. The processing apparatus U2 performs a predetermined process on the substrate P subjected to the exposure process to form a pattern layer of an electronic device on the substrate P.
< Exposure apparatus (substrate processing apparatus) >
Next, the exposure apparatus EX will be described with reference to fig. 1to 9. Fig. 2 is a perspective view showing the configuration of the main part of the exposure apparatus of fig. 1. Fig. 3 is a diagram showing a relationship between the alignment microscope and the drawing line on the substrate. Fig. 4 is a view showing the configuration of the rotary drum and the drawing device of the exposure apparatus of fig. 1. Fig. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of fig. 1. Fig. 6 is a perspective view showing the configuration of a divergent optical system of the exposure apparatus of fig. 1. Fig. 7 is a diagram showing the arrangement relationship of a plurality of scanners of the exposure apparatus of fig. 1. Fig. 8 is a perspective view showing the arrangement relationship between the alignment microscope and the scribe line and the encoder head on the substrate. Fig. 9 is a perspective view showing a surface configuration of a rotating drum of the exposure apparatus of fig. 1.
As shown in fig. 1, exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called mask-less type drawing exposure apparatus, and forms a predetermined pattern on substrate P by scanning drawing beam L B in a predetermined scanning direction while conveying substrate P in a conveying direction.
As shown in fig. 1, the exposure apparatus EX includes a drawing device 11, a substrate conveyance mechanism 12, alignment microscopes AM1, AM2, and a control device 16. The drawing device 11 includes a plurality of drawing modules UW 1to UW5, and draws a predetermined pattern on a part of the substrate P conveyed by the substrate conveyance mechanism 12 by the plurality of drawing modules UW 1to UW 5. The substrate transfer mechanism 12 transfers the substrate P transferred from the processing apparatus U1 in the previous process to the processing apparatus U2 in the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect alignment marks and the like formed in advance on the substrate P in order to perform relative position alignment (alignment) of the pattern to be drawn on the substrate P and the substrate P. The controller 16 controls each part of the exposure apparatus EX to perform a process on each part. The control device 16 may be a part or all of a host control device that controls the element manufacturing system 1. The control device 16 may be a device different from the host control device and controlled by the host control device. The control device 16 includes, for example, a computer.
The exposure apparatus EX includes an apparatus frame 13 (see fig. 2) supporting the drawing apparatus 11 and the substrate conveyance mechanism 12, and a rotational position detection mechanism (see fig. 4 and 8) 14. the exposure apparatus EX is provided with a light source apparatus CNT that emits a laser beam (pulse light) as a drawing beam L B, and the exposure apparatus EX guides the drawing beam L B emitted from the light source apparatus CNT in the drawing apparatus 11 and projects the drawn beam onto the substrate P conveyed by the substrate conveyance mechanism 12.
As shown in fig. 1, the exposure apparatus EX is housed in a temperature-controlled chamber EVC. The temperature-controlled room EVC is installed on the installation surface E of the manufacturing plant by passive or active vibration-proof units SU1 and SU 2. The vibration isolation units SU1 and SU2 are provided on the installation surface E to reduce vibration from the installation surface E. The temperature control chamber EVC keeps the inside at a predetermined temperature, thereby suppressing the shape change of the substrate P conveyed inside due to the temperature.
Next, the substrate transfer mechanism 12 of the exposure apparatus EX will be described with reference to fig. 1. The substrate conveyance mechanism 12 includes, in order from the upstream side in the conveyance direction of the substrate P, an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary drum (cylindrical drum) DR, a tension adjustment roller RT2, a drive roller DR6, and a drive roller DR 7.
The edge position controller EPC adjusts the position of the substrate P transported from the processing apparatus U1 in the width direction. The edge position controller EPC is configured to move the substrate P in the width direction so that the position of the end (edge) of the substrate P in the width direction, which is sent from the processing apparatus U1, can be within a range of about ± tens of μm to tens of μm with respect to the target position, thereby correcting the position of the substrate P in the width direction.
The drive rollers DR4 rotate while sandwiching the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and convey the substrate P to the downstream side in the conveyance direction, so as to convey the substrate P to the rotary drum DR, the rotary drum DR supports the portion to be exposed of the pattern on the substrate P in a cylindrical surface shape, and rotates around the rotation center line X2 around the rotation center line AX2 extending in the Y direction, whereby the substrate P is conveyed, in order to rotate this rotary drum around the rotation center line AX2, shaft portions sf2 coaxial with the rotation center line AX2 are provided on both sides of the rotary drum DR, the shaft portions Sf2 are given a rotation torque from a not-shown drive source (a motor, a reduction gear mechanism, or the like), and further, a surface extending in the Z direction through the rotation center line AX2 is given a rotational torque from a P3.2 set of tension adjusting rollers RT1, RT2, and the substrate P supported around the rotary drum DR6 is given a predetermined tension applied to the substrate P-conveying drum DR-7, and the substrate P is subjected to a slack in the conveyance direction, and the downstream side of the substrate P conveyance apparatus, and the substrate P is given a predetermined substrate P-conveying speed fluctuation is given by the DR-.
Thus, the substrate transfer mechanism 12 can transfer the substrate P, whose position in the width direction is adjusted by the edge position controller EPC, to the substrate P transferred from the processing apparatus U1, the substrate transfer mechanism 12 transfers the substrate P, whose position in the width direction is adjusted, to the tension adjusting roller RT1 by the drive roller DR4, transfers the substrate P passed through the tension adjusting roller RT 1to the rotary roller DR., rotates the rotary roller DR to transfer the substrate P supported by the rotary roller DR to the tension adjusting roller RT2, the substrate transfer mechanism 12 transfers the substrate P transferred to the tension adjusting roller RT2 to the drive roller DR6, transfers the substrate P transferred to the drive roller DR6 to the drive roller dr7, and then the substrate transfer mechanism 12 transfers the substrate P to the processing apparatus U2 while applying slack D L to the substrate P by the drive rollers DR6 and DR 7.
Next, referring to fig. 2, the apparatus frame 13 of the exposure apparatus EX will be described. In fig. 2, the X direction, the Y direction, and the Z direction are orthogonal coordinate systems, and are the same orthogonal coordinate systems as those in fig. 1. The exposure apparatus EX includes a drawing apparatus 11 shown in fig. 1 and an apparatus frame 13 supporting a rotary drum DR of a substrate conveyance mechanism 12.
The apparatus frame 13 shown in fig. 2 includes a main body frame 21, a three-point mount (support mechanism) 22, a1 st optical bench 23, a rotation mechanism 24, and a2 nd optical bench 25 in this order from the lower side in the Z direction. The main body frame 21 is provided on the installation surface E via the vibration prevention units SU1 and SU 2. The main body frame 21 rotatably supports the rotary drum DR, tension adjusting rollers RT1 (not shown), RT 2. The 1 st optical bench 23 is provided on the upper side of the rotary drum DR in the vertical direction, and is provided on the main body frame 21 via the three-point mount 22. The three-point mount 22 supports the 1 st optical bench 23 at 3 support points 22a, and the Z-direction position of each support point 22a is adjustable. Therefore, the three-point mount 22 can adjust the tilt of the stage surface of the 1 st optical stage 23 with respect to the horizontal plane to a predetermined tilt. In addition, when the apparatus frame 13 is assembled, the positions of the main body frame 21 and the three-point stand 22 in the X direction and the Y direction can be adjusted in the XY plane. On the other hand, after the assembly of the apparatus frame 13, the main body frame 21 and the three-point stand 22 are fixed (rigid state). As described above, the main body frame 21 and the 1 st optical bench 23 coupled by the three-point mount 22 function as the 1 st supporting member.
The 2 nd optical bench 25 is provided on the upper side of the 1 st optical bench 23 in the vertical direction, and is provided on the 1 st optical bench 23 via the rotation mechanism 24. A2 nd optical bench 25 having a bench face parallel to the bench face of the 1 st optical bench 23. The 2 nd optical stage 25 is provided with a plurality of drawing modules UW 1to UW5 of the drawing apparatus 11. The rotation mechanism 24 is capable of rotating the 2 nd optical stage 25 with respect to the 1 st optical stage 23 around a predetermined rotation axis I extending in the vertical direction in a state where the stage surfaces of the 1 st optical stage 23 and the 2 nd optical stage 25 are kept substantially parallel to each other. The rotation axis I extends in the vertical direction in the center plane P3 and passes through a predetermined point wound in the surface (drawing plane curved along the circumferential surface) of the substrate P of the rotating drum DR (see fig. 3). The rotation mechanism 24 can adjust the positions of the plurality of drawing modules UW 1to UW5 with respect to the substrate P wound on the rotating drum DR by rotating the 2 nd optical stage 25 with respect to the 1 st optical stage 23.
Next, referring to fig. 1 and 5, a description will be given of a light source device CNT provided on the main body frame 21 of the device frame 13, the light source device CNT emitting a laser beam as a drawing beam L B projected on the substrate P, the light source device CNT having a light source emitting light in a predetermined wavelength band suitable for exposure of the photosensitive functional layer on the substrate P and an ultraviolet region having a strong photoactivity, and as a light source, for example, a laser light source emitting a third harmonic laser beam (wavelength of 355nm) of YAG or a fiber-amplified laser light source emitting a laser beam in an ultraviolet wavelength region of 400nm or less by amplifying a seed light in an infrared wavelength region from a semiconductor laser light source with a fiber amplifier and then using a wavelength conversion element (crystal element generating harmonics or the like) may be used.
Here, the drawing light beam L B emitted from the light source device CNT is incident on a polarizing beam splitter PBS described later, and the drawing light beam L B is preferably such that the incident drawing light beam L B becomes a light beam substantially totally reflected by the polarizing beam splitter PBS in order to suppress energy loss due to separation of the drawing light beam L B by the polarizing beam splitter PBS, the polarizing beam splitter PBS is a laser light beam that reflects linearly polarized light beam that becomes S-polarized light and transmits linearly polarized light beam that becomes P-polarized light, and therefore, the light source device CNT is preferably such that the drawing light beam L B incident on the polarizing beam splitter PBS becomes linearly polarized (S-polarized) light beam, and further, the laser light has high energy density, so that the illuminance of the light beam projected on the substrate P can be appropriately secured.
Next, description will be made of the drawing device 11 of the exposure apparatus EX, in which the drawing device 11 is a so-called multi-beam type drawing device 11 using a plurality of drawing modules UW 1to UW5, the drawing device 11 divides the drawing light beam L B emitted from the light source device CNT into a plurality of beams and scans the divided drawing light beam L B along a plurality of (e.g., 5 in the 1 st embodiment) drawing lines LL 1to LL 5 on the substrate P, the drawing device 11 then joins the patterns drawn on the substrate P by the respective drawing lines LL 1to LL 5 in the width direction of the substrate P, and first, referring to fig. 3, a plurality of drawing lines LL 1to LL 5 formed on the substrate P by scanning the drawing light beam L B by the drawing device 11 will be described.
As shown in fig. 3, the plurality of drawing lines LL 1-LL 5 are arranged in 2 rows in the circumferential direction of the rotating drum DR with the center plane P3 interposed therebetween, and odd-numbered 1 st drawing lines LL 1, 3 rd drawing lines LL 3, and 5 th drawing lines LL 5 are arranged on the substrate P on the upstream side in the rotating direction, and even-numbered 2 nd drawing lines LL 2 and 4 th drawing lines LL 4 are arranged on the substrate P on the downstream side in the rotating direction.
Each of the drawing lines LL 1 through LL 5 is formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating drum DR, and is shorter than the length of the substrate P in the width direction, strictly speaking, each of the drawing lines LL 1 through LL 5 is inclined by a predetermined angle amount with respect to the rotation center line AX2 of the rotating drum DR so that the bonding error of the pattern obtained by the plurality of drawing lines LL 1 through LL 5 is minimized when the substrate P is conveyed at the reference speed by the substrate conveying mechanism 12.
Odd-numbered 1 st drawing line LL 1, 3 rd drawing line LL 3, and 5 th drawing line LL 05 are disposed at a predetermined interval in the direction (axial direction) in which the rotation center line AX2 of the rotary drum DR extends, and even-numbered 2 nd drawing lines LL 12 and 4 th drawing lines LL 24 are disposed at a predetermined interval in the axial direction of the rotary drum DR, in this case, 2 nd drawing line LL 32 is disposed between 1 st drawing line LL 41 and 3 rd drawing line LL 53 in the axial direction, similarly, 3 rd drawing line LL 3 is disposed between 2 nd drawing line LL 2 and 4 th drawing line LL 4 in the axial direction, 4 th drawing line LL 4 is disposed between 3 rd drawing line LL 3 and 5 th drawing line LL 5 in the axial direction, and 1to 5 th drawing lines LL 1to LL 5 are disposed so as to cover the full width of the exposure area a7 in the width direction (axial direction) on the substrate P.
The scanning direction of the drawing light beam L B scanned along the odd-numbered 1 st drawing line LL, 3 rd drawing line LL, and 5 th drawing line LL 0 LL is the same direction as the one-dimensional direction, and the scanning direction of the drawing light beam L B scanned along the even-numbered 2 nd drawing line LL and 4 th drawing line LL is the same direction as the one-dimensional direction at this time, the scanning direction of the drawing light beam LB scanned along the odd-numbered drawing lines LL 41, 3653, LL 65 is the opposite direction to the scanning direction of the drawing light beam LB scanned along the even-numbered drawing lines LL, 3984, and therefore, the drawing start positions of the odd-numbered drawing lines LL 91, LL, LL are adjacent to the drawing end positions of the even-numbered drawing lines LL, LL, and similar to the drawing end positions of the odd-numbered drawing lines LL, LL, 593, LL, and the even-numbered drawing lines 632, LL.
Next, the drawing device 11 will be described with reference to fig. 4 to 7, the drawing device 11 includes the plurality of drawing modules UW 1to UW5, the beam distribution optical system S L for branching the drawing beam L B from the light source unit CNT and guiding the same to the plurality of drawing modules UW 1to UW5, and the alignment detection system 31 for performing alignment.
The beam distribution optical system S L splits a drawing beam L B emitted from a light source device CNT into a plurality of beams, and guides the split drawing beams L B to a plurality of drawing modules UW 1to UW 5. the beam distribution optical system S L includes a1 st optical system 41 splitting a drawing beam L B emitted from the light source device CNT into 2 beams, a2 nd optical system 42 irradiated with one drawing beam L B split by the 1 st optical system 41, and a3 rd optical system 43 irradiated with the other drawing beam L B split by the 1 st optical system 41. the beam distribution optical system S L includes an XY bisection (blurring) adjusting mechanism 44 and an XY bisection adjusting mechanism 45. the beam distribution optical system S L, a part on the light source device CNT side is provided on the main body frame 21, and the other parts on the drawing modules UW 1to UW5 side are provided on the 2 nd optical stage 25.
The 1 st optical system 41 includes an 1/2 wavelength plate 51, a polarizer 52, a beam diffuser 53, a1 st mirror 54, a1 st relay lens 55, a2 nd relay lens 56, a2 nd mirror 57, a3 rd mirror 58, a4 th mirror 59, and a1 st beam splitter 60.
The drawing light beam L B emitted from the light source device CNT in the + X direction is irradiated onto the 1/2 wavelength plate 51.1/2 wavelength plate 51 so as to be rotatable within the irradiation plane of the drawing light beam L B, the drawing light beam L B irradiated onto the 1/2 wavelength plate 51 has a polarization direction corresponding to the rotation amount of the 1/2 wavelength plate 51, the drawing light beam L B passed through the 1/2 wavelength plate 51 is irradiated onto the polarizer (polarizing beam splitter) 52, the polarizer 52 transmits the drawing light beam L B having the predetermined polarization direction, and the drawing light beam L B other than the predetermined polarization direction is reflected in the Y direction, so that the drawing light beam L B reflected by the polarizer 52 passes through the 1/2 wavelength plate 51, and therefore, the drawing light beam L B is changed in the direction by the cooperative operation of the polarizer 51 and the 1/2 wavelength plate 52, and the light beam intensity corresponding to the rotation amount of the 1/2 wavelength plate 51, that is the 1/2 wavelength plate 51 is rotated, and the polarized light beam L B reflected by the L can be adjusted in the drawing light beam L B.
The drawing light flux L B passing through the polarizer 52 is irradiated on the light diffuser 53, the light diffuser 53 absorbs the drawing light flux L B, the leakage of the drawing light flux L B irradiated on the light diffuser 53 to the outside is suppressed, the drawing light flux L B reflected in the + Y direction by the polarizer 52 is irradiated on the 1 st mirror 54, the drawing light flux L B irradiated on the 1 st mirror 54 is reflected in the + X direction by the 1 st mirror 54, is irradiated on the 2 nd mirror 57 through the 1 st relay lens 55 and the 2 nd relay lens 56, the drawing light flux L B irradiated on the 2 nd mirror 57 is reflected in the-Y direction by the 2 nd mirror 57 and is irradiated on the 3 rd mirror 58, the drawing light flux L B irradiated on the 3 rd mirror 58 is reflected in the-Z direction by the 3 rd mirror 58 and is irradiated on the 4 th mirror 59, the drawing light flux L B irradiated on the 4 th mirror 59 is reflected in the + Y direction by the 4 th mirror 59 and is irradiated on the 1 st mirror 60, the drawing light flux 3625B is irradiated on the first optical system 60, and is transmitted and is irradiated on the first optical system 42 and is irradiated on the first beam splitter 42 and is reflected in the first optical system 43.
The 3 rd mirror 58 and the 4 th mirror 59 are provided at a predetermined interval on the rotation axis I of the rotation mechanism 24, and the configuration up to the light source device CNT including the 3 rd mirror 58 (the portion surrounded by the two-dot chain line on the upper side in the Z direction in fig. 4) is provided on the side of the main body frame 21, and the configuration up to the plural drawing modules UW 1to UW5 including the 4 th mirror 59 (the portion surrounded by the two-dot chain line on the lower side in the Z direction in fig. 4) is provided on the side of the 2 nd optical stage 25.
The 2 nd optical system 42 splits one drawing light beam L B split by the 1 st optical system 41 into two and guides the split light beams to odd-numbered drawing modules UW1, UW3 and UW 5. the 2 nd optical system 42 has a 5 th mirror 61, a2 nd beam splitter 62, a3 rd beam splitter 63 and a6 th mirror 64.
The drawing light beam L B reflected by the 1 st beam splitter 60 of the 1 st optical system 41 in the-X direction, irradiated on the 5 th mirror 61, the drawing light beam L B irradiated on the 5 th mirror 61, reflected by the 5 th mirror 61 in the-Y direction, irradiated on the 2 nd beam splitter 62, the drawing light beam L B irradiated on the 2 nd beam splitter 62, a part of which is reflected and irradiated on the odd-numbered 1 drawing module UW5 (see fig. 5), the drawing light beam L B irradiated on the 2 nd beam splitter 62, the other part of which is transmitted and irradiated on the 3 rd beam splitter 63, the drawing light beam L B irradiated on the 3 rd beam splitter 63, a part of which is reflected and irradiated on the odd-numbered 1 drawing module UW3 (see fig. 5), the drawing light beam L B irradiated on the 3 rd beam splitter 63, the other part of which is transmitted and irradiated on the 6 th mirror 64, the drawing light beam L B irradiated on the 6 th mirror 64 is reflected by the 6 th mirror 6364, irradiated on the odd-numbered 1 th drawing module UW 6324B, slightly inclined with the drawing light beam 464B, and the odd-numbered 2 w 635, and the drawing light beam 3625B irradiated on the odd-numbered 1 w 635 th beam 464B, and the drawing optical system 18, and the drawing optical system 20, and the drawing optical system 18, with respect to.
The 3 rd optical system 43 branches the other drawing light beam L B branched from the 1 st optical system 41 to guide to an even drawing module UW2 and UW4, which will be described later, and has a7 th mirror 71, an 8 th mirror 72, a4 th beam splitter 73, and a 9 th mirror 74.
The drawing light beam L B transmitted in the Y direction by the 1 st beam splitter 60 of the 1 st optical system 41 is irradiated on the 7 th mirror 71, the drawing light beam L B irradiated on the 7 th mirror 71 is reflected in the X direction by the 7 th mirror 71, and irradiated on the 8 th mirror 72, the drawing light beam L B irradiated on the 8 th mirror 72, reflected in the-Y direction by the 8 th mirror 72, irradiated on the 4 th beam splitter 73, and the drawing light beam L B irradiated on the 4 th beam splitter 73, a part of which is reflected and irradiated on the 1 drawing module UW4 (see fig. 5) of even number, the drawing light beam L B irradiated on the 4 th beam splitter 73, and the other part of which is transmitted and irradiated on the 9 th mirror 74, the drawing light beam L B irradiated on the 9 th mirror 74, reflected and irradiated on the 1 drawing module UW2 of even number by the 9 th mirror 74, and the drawing module UW4 and the drawing module 3643 of even number are slightly inclined with respect to the Z axis L (Z axis).
As described above, the beam distribution optical system S L splits the drawing beam L B from the light source device CNT into a plurality of beams toward the plurality of drawing modules UW 1to UW 5. at this time, the reflectivities (transmittances) of the 1 st beam splitter 60, the 2 nd beam splitter 62, the 3 rd beam splitter 63, and the 4 th beam splitter 73 are adjusted to appropriate reflectivities depending on the number of splits of the drawing beam L B so that the intensities of the drawing beams L B irradiated to the plurality of drawing modules UW 1to UW5 become the same.
An XY-halving adjustment mechanism 44 is disposed between the 2 nd relay lens 56 and the 2 nd mirror 57, the XY-halving adjustment mechanism 44 is capable of finely moving all of the drawing lines LL 1to LL 5 formed on the substrate P within the drawing plane of the substrate P, the XY-halving adjustment mechanism 44 is composed of a transparent parallel plate glass which is tiltable within the XZ plane of FIG. 6 and a transparent parallel plate glass which is tiltable within the YZ plane of FIG. 6, and the drawing lines LL 1to LL 5 formed on the substrate P are capable of finely moving in the X direction or the Z direction by adjusting the respective tilting amounts of the two parallel plate glasses.
XY-halving adjustment means 45 is disposed between the 7 th mirror 71 and the 8 th mirror 72, the XY-halving adjustment means 45 is capable of finely moving the even-numbered 2 nd drawing line LL 2 and the 4 th drawing line LL 4 among the drawing lines LL 1-LL 5 formed on the substrate P within the drawing plane of the substrate P, and the XY-halving adjustment means 45 is composed of a transparent parallel plate glass tiltable within the XZ plane of FIG. 6 and a transparent parallel plate glass tiltable within the YZ plane of FIG. 6, similarly to the XY-halving adjustment means 44, and the drawing lines LL 2 and LL 4 formed on the substrate P can be finely displaced in the X direction or the Z direction by adjusting the respective amounts of tilting of the two parallel plate glasses.
Next, referring to fig. 4, 5 and 7, a description will be given of a case where a plurality of drawing modules UW to UW5 are provided corresponding to a plurality of drawing lines 1to 5, a plurality of drawing beams B branched by a beam distribution optical system S are irradiated to the plurality of drawing modules UW to UW5, respectively, the plurality of drawing modules UW to UW are guided to the respective drawing lines 01 to 15, that is, the 1 st drawing module UW guides the drawing beam B to the 1 st drawing line 21, similarly, the 2 nd to 5 th drawing modules UW to UW guide the drawing beam B to the 2 nd to 5 th drawing lines 32 to 45, as shown in fig. 4 (and 1), the plurality of drawing modules UW to UW are arranged in the circumferential direction of the rotary drum DR in 2 rows with the center plane p interposed therebetween, the plurality of drawing modules UW to UW are arranged on the center plane p in the drawing modules UW4, 5 th drawing modules 51, 63, 5 th drawing modules are arranged in the drawing modules UW direction (the drawing modules) between the drawing modules UW and UW5 th drawing modules 2 th and UW +4 th drawing modules, and UW are arranged in the drawing modules 4 th drawing modules 2, and UW direction, and UW +4, and UW are arranged in the drawing modules 4 th drawing modules, and UW drawing modules, respectively, and UW drawing modules are arranged in the drawing modules 4, and UW drawing modules, and UW drawing modules, and UW are arranged in the drawing modules, and UW, and.
Next, description is made of the drawing modules UW 1to UW5 with reference to fig. 4. Since the drawing modules UW 1to UW5 have the same configuration, the 1 st drawing module UW1 (hereinafter, simply referred to as a drawing module UW1) will be described as an example.
The drawing module UW1 shown in fig. 4 is provided with a light deflector 81, a polarizing beam splitter PBS, a 1/4 wavelength plate 82, a scanner 83, a bending mirror 84, a telecentric f- θ lens system 85, and a Y-magnification correction optical member 86, for scanning a drawing light beam L B along a drawing line LL 1 (1 st drawing line LL 1), and a calibration detection system 31 is provided adjacent to the polarizing beam splitter PBS.
The optical deflector 81 is switched ON/OFF by the control device 16 using, for example, an acousto-Optic Modulator (AOM) and switches projection/non-projection of the drawing light beam L B onto the substrate P at high speed, specifically, the drawing light beam L B from the beam distribution optical system S L is irradiated onto the optical deflector 81 while being slightly inclined with respect to the-Z direction by the relay lens 91 of the 2 nd optical system 42, when the optical deflector 81 is switched OFF, the drawing light beam L B travels in an inclined state and is blocked by the light blocking plate 92 disposed after passing through the optical deflector 81, and when the optical deflector 81 is switched ON, the drawing light beam L B incident ON the optical deflector 81 is once diffracted to be deflected in the-Z direction, and is emitted from the optical deflector 81 and is disposed in the Z direction of the optical deflector 81, and therefore, when the optical deflector 81 is switched ON, the drawing light beam L B is switched OFF to the substrate P4625 and is projected onto the substrate P L while the optical deflector 81 is switched ON.
The polarizing beam splitter PBS reflects the drawing light beam L B irradiated from the light beam deflector 81 through the relay lens 93, on the other hand, the polarizing beam splitter PBS cooperates with a 1/4 wavelength plate 82 provided between the polarizing beam splitter PBS and the scanner 83 to transmit the reflected light generated on the substrate P (or the outer peripheral surface of the rotary drum DR) by the irradiation of the drawing light beam L B (spot light), that is, the drawing light beam L B irradiated from the light beam deflector 81 to the polarizing beam splitter PBS is a linearly polarized laser light of S polarization and is reflected by the polarizing beam splitter PBS, and further, the drawing light beam L B reflected by the polarizing beam splitter is irradiated on the substrate P through the 1/4 wavelength plate 82 and is again passed through the 1/4 wavelength plate 82 from the substrate P to become a linearly polarized laser light of P polarization, and therefore, the reflected light generated from the substrate P (or the outer peripheral surface of the rotary drum DR) and irradiated on the polarizing beam splitter PBS penetrates through the polarizing beam splitter PBS, and the reflected light is irradiated on the relay lens 94 to the polarizing beam splitter PBS, and the scanning beam pbb is collimated by the relay lens 8683 and is irradiated on the scanning beam splitter PBS 3.
As shown in fig. 4 and 7, the scanner 83 includes a reflecting mirror 96, a rotary polygon mirror 97, and an origin detector 98. a drawing beam L B passing through the 1/4 wavelength plate 82 and irradiated on the reflecting mirror 96 through a relay lens 95. a drawing beam L B reflected by the reflecting mirror 96 is irradiated on the rotary polygon mirror 97. the rotary polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces (for example, eight surfaces) 97B formed around the rotating shaft 97 a. the rotary polygon mirror 97 rotates in a predetermined rotational direction around the rotating shaft 97a to continuously change a reflection angle of a drawing beam L B irradiated on the reflecting surface 97B, whereby the reflected drawing beam L B is caused to scan along a drawing line L01 on the substrate P, a drawing beam L B reflected by the rotary polygon mirror 97 is irradiated on a bending mirror 84. the origin detector 98 detects a drawing beam L B scanned along a drawing line LL on the substrate P, the origin detector 98 is caused to draw on the reflecting mirror 97B, and the origin detector 98B is arranged on the opposite side of the drawing beam 631B, and the origin detector 98B is caused to detect that the reflection of the drawing beam LL B before the origin detector 98B passes through the origin detector 3685, the drawing beam LL B, which is caused to pass through the origin detector 98, which the origin detector 98 is arranged before the drawing beam LL B, which is caused to draw the origin detector 98 is caused to draw.
The drawing light flux L B irradiated from the scanner 83 to the bending mirror 84 is reflected by the bending mirror 84 and irradiated to the f- θ lens system 85. f- θ lens system 85 includes a telecentric f- θ lens, and the drawing light flux L B reflected from the rotary polygon mirror 97 by the bending mirror 84 is perpendicularly projected onto the drawing surface of the substrate P, and in this case, a cylindrical lens (not shown) is disposed on each of the optical paths of the drawing light flux L B directed to the rotary polygon mirror 97 and the drawing light flux L B emitted from the f- θ lens system 85, and a surface skew (optical skew) correction optical system cooperating with the f- θ lens system 85 is also provided, so that each of the reflecting surfaces 97B of the rotary polygon mirror 97 and the drawing surface of the substrate P are optically conjugate in a sub-scanning direction (longitudinal direction of the substrate P) perpendicular to the drawing line LL 1.
As shown in fig. 7, the plurality of scanners 83 in the plurality of drawing modules UW 1to UW5 are configured to be bilaterally symmetrical with respect to the center plane p3, the plurality of scanners 83, which are 3 scanners 83 corresponding to the drawing modules UW1, UW3, and UW5, are disposed on the upstream side (on the-X direction side in fig. 7) in the rotational direction of the rotary drum DR, the 2 scanners 83 corresponding to the drawing modules UW2 and UW4 are disposed on the downstream side (on the + X direction side in fig. 7) in the rotational direction of the rotary drum DR, and the 3 scanners 83 on the upstream side and the 2 scanners 83 on the downstream side are disposed to face each other with the center plane p3 interposed therebetween, in this case, the respective scanners 83 disposed on the upstream side and the respective scanners 83 disposed on the downstream side are configured to be point symmetrical about the rotational axis I, with respect to the rotational axis I, and therefore, the 3 rotary polygon mirrors 97 on the upstream side rotate counterclockwise (in the XY plane) while irradiating the drawing beam L B97, the rotary polygon 97 is reflected from the rotational position of the rotary polygon 97, and the scanning mirror 97 is, and the drawing beam is directed from the scanning direction of the scanning mirror 97, and the scanning direction of the scanning ends, and the scanning direction of the drawing mirrors 7, which is, and the scanning beam 97 which is, and the scanning direction of the scanning beam 97 which is, which is depicted in the scanning direction of the scanning mirror 97, and the scanning direction of the scanning beam 97 which is opposite to the scanning direction of.
Here, the axis of the drawing light beam L B reaching the substrate P from the odd-numbered drawing modules UW1, UW3, and UW5 is in the same direction as the set azimuth line L e1 when viewed in the XZ plane of fig. 4, that is, the set azimuth line L e1 is a line connecting the odd-numbered drawing lines L01, LL 3, LL 5 and the rotation center line AX2 in the XZ plane, similarly, the axis of the drawing light beam L B reaching the substrate P from the even-numbered drawing modules UW2, UW4 is in the same direction as the set azimuth line L e2 when viewed in the XZ plane of fig. 4, that is, the azimuth line L e2 is a line connecting the even-numbered drawing lines LL 2, LL 4 and the rotation center line AX2 in the XZ plane.
The optical member 86 for Y-magnification correction is disposed between the f-theta lens system 85 and the substrate P. the optical member 86 for Y-magnification correction slightly enlarges or reduces the dimension in the Y direction of the drawing lines LL 1to LL 5 formed by the drawing modules UW 1to UW 5.
In the drawing apparatus 11 configured in this manner, the control device 16 controls each part to draw a predetermined pattern ON the substrate P, that is, the control device 16 deflects the drawing light beam L B by ON/OFF modulation of the light deflector 81 based ON cad (computer Aided design) information (for example, dot matrix format) of the pattern to be drawn ON the substrate P while the drawing light beam L B projected ON the substrate P is scanned in the scanning direction, and draws a pattern ON the photosensitive layer of the substrate P, and the control device 16 synchronizes the scanning direction of the drawing light beam L B scanned along the drawing line LL 1 with the movement of the substrate P in the carrying direction by the rotation of the rotary drum DR, and draws a predetermined pattern in the exposure area a7 corresponding to the portion of the drawing line LL 1.
At this time, when the size (dot diameter) of the drawing light beam L B projected from each of the drawing modules UW 1to UW5 on the substrate P is D (μm), and the scanning speed along the drawing lines LL 1to LL 5 of the drawing light beam L B is V (μm/sec), the light emission repetition period T (sec) of the pulsed light is set to a relationship of T < D/V when the light source device CNT is a pulsed laser light source.
Next, alignment microscopes AM1 and AM2 will be described with reference to fig. 3 and 8. The alignment microscopes AM1 and AM2 detect alignment marks formed on the substrate P in advance, reference marks and reference patterns formed on the rotary drum DR, and the like. Hereinafter, the alignment mark of the substrate P and the reference mark and the reference pattern of the rotary drum DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used to align (align) the substrate P with a predetermined pattern drawn on the substrate P or to calibrate the rotary drum DR with the drawing apparatus 11.
Alignment microscopes AM1 and AM2 are provided on the upstream side in the rotation direction of the rotating drum DR with respect to the drawing lines LL 1to LL 5 formed by the drawing device 11, and an alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotating drum DR with respect to the alignment microscope AM 2.
The alignment microscopes AM1 and AM2 are configured by an objective lens system GA as a detection probe for projecting illumination light onto the substrate P or the rotating drum DR and receiving light generated by the marker, and an imaging system GD for imaging an image (such as a bright-field image, a dark-field image, and a fluorescence image) of the marker received by the objective lens system GA by a two-dimensional CCD, a CMOS, or the like. The illumination light for alignment is light in a wavelength band in which the photosensitive layer on the substrate P has almost no sensitivity, for example, light having a wavelength of about 500nm to 800 nm.
A plurality of alignment microscopes AM1 (for example, 3 alignment microscopes) are arranged in a line in the Y direction (the width direction of the substrate P). Similarly, a plurality of alignment microscopes AM2 (for example, 3 alignment microscopes) are provided in a row in the Y direction (the width direction of the substrate P). That is, a total of 6 alignment microscopes AM1 and AM2 are provided.
In fig. 3, for easy understanding, in the object lens systems GA of the 6 alignment microscopes AM1 and AM1, the arrangement of the object lens systems GA 1to GA1 of the 3 alignment microscopes AM1 is shown, in the object lens systems GA 1to GA1 of the 3 alignment microscopes AM1, as shown in fig. 3, the object lens systems GA 1to GA1 are arranged at a predetermined interval in the Y direction parallel to the rotation center line 1, as shown in fig. 8, the optical axes 1a of the object lens systems GA 1to GA1 passing through the centers of the observation regions Vw 1to Vw1 are parallel to the XZ plane, similarly, in the case where the object lens systems GA of the 3 alignment microscopes AM1 are arranged parallel to the observation regions 1a Vw 1to Vw1 on the substrate P (or the outer peripheral surface of the rotating drum DR), as shown in fig. 3, the object lens systems GA1 are arranged at a predetermined interval in the rotation direction of the DR x 1a direction of the object lens systems GA 1a 1, as shown in the rotation center line of the DR 1, and the predetermined interval of the DR 1a rotation center line of the observation regions Vw 1a 1 is shown in the rotation center line of the predetermined interval 1.
The observation regions Vw to Vw of the alignment microscope AM and AM alignment marks are set in the range of the diagonal of 200 μm, for example, on the substrate P and the spin drum DR, and here, the optical axes a to a of the alignment microscope AM, that is, the optical axes 0a to 1a of the objective lens system GA are set in the same direction as the set square line 2e extending in the radial direction of the spin drum DR from the rotation center line AX, that is, the set square line 3e is a line connecting the observation regions Vw to Vw of the alignment microscope AM and the rotation center line AX when viewed in the XZ plane of fig. 4.
On the substrate P, as shown in fig. 3, the exposure region a7 drawn by each of the 5 drawing lines LL 1to LL 5 is arranged at a predetermined interval in the X direction, and a plurality of alignment marks Ks 1to Ks3 (hereinafter, simply referred to as marks) for performing alignment are formed, for example, in a cross shape around the exposure region a7 on the substrate P.
In fig. 3, mark Ks1 is provided at regular intervals in the X direction in the-Y side peripheral region of exposure field a7, and mark Ks3 is provided at regular intervals in the X direction in the + Y side peripheral region of exposure field a 7. Further, the mark Ks2 is provided at the center in the Y direction in the blank space between 2 exposure regions a7 adjacent in the X direction.
The mark Ks1 is formed so as to be sequentially captured in the observation region Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation region Vw4 of the objective lens system GA of the alignment microscope AM2 during the transfer of the substrate P. The mark Ks3 is formed so as to be sequentially captured in the observation region Vw3 of the objective lens system GA3 of the alignment microscope AM1 and the observation region Vw6 of the objective lens system GA of the alignment microscope AM2 during the transfer of the substrate P. Further, the mark Ks2 is formed so as to be captured sequentially in the observation region Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation region Vw5 of the objective lens system GA of the alignment microscope AM2 during the transfer of the substrate P.
Therefore, the alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotating drum DR out of the 3 alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P at any time. Further, the alignment microscopes AM1 and AM2 at the center in the Y direction of the rotating drum DR out of the 3 alignment microscopes AM1 and AM2 can observe or detect the mark Ks2 such as a margin formed between the exposure regions a7 drawn on the substrate P as needed.
Here, since the exposure apparatus EX is applied to the so-called multi-beam type drawing apparatus 11, in order to appropriately join a plurality of patterns drawn on the substrate P by the respective drawing lines LL 1to LL 5 of the plurality of drawing modules UW 1to UW5 in the Y direction, calibration is necessary to suppress the joining accuracy of the plurality of drawing modules UW 1to UW5 within an allowable range, and the alignment microscopes AM1 and AM2 refer to the relative arrangement relationship (or an error amount with respect to the arrangement interval in design) of the observation regions Vw 1to Vw6 of the respective drawing lines LL 1to LL 5 of the plurality of drawing modules UW 1to UW5 as a reference line, and the relative arrangement relationship or the error amount needs to be accurately obtained by reference line management.
In the calibration for confirming the joining accuracy of the drawing modules UW 1to UW5 and the calibration for performing the reference line management of the alignment microscopes AM1 and AM2, a reference mark or a reference pattern is provided on at least a part of the outer peripheral surface of the rotating drum DR of the support substrate P. Therefore, as shown in fig. 9, in the exposure apparatus EX, a rotating drum DR having a reference mark or a reference pattern on its outer circumferential surface is used.
The rotary drum DR has scale portions GPa and GPb forming a part of a rotational position detecting mechanism 14 described later formed on both end sides of the outer peripheral surface thereof, and further has narrow regulating belts C L a and C L b formed of concave grooves or convex edges formed on the entire circumference inside the scale portions GPa and GPb, the Y-direction width of the substrate P is set to be smaller than the Y-direction interval of the 2 regulating belts C L a and C L b, and the substrate P is supported by being closely attached to the inner region sandwiched between the regulating belts C L a and C L b on the outer peripheral surface of the rotary drum DR.
The rotary drum DR is provided with a grid-like reference pattern (which may be used as a reference mark) RMP formed by repeatedly scribing a plurality of line patterns R L1 inclined at +45 degrees with respect to the rotational center line AX2 and a plurality of line patterns R L2 inclined at-45 degrees with respect to the rotational center line AX2 at constant pitches (periods) Pf1 and Pf2 on the outer circumferential surface sandwiched between the regulating belts C L a and C L b.
The reference pattern RMP is a diagonal pattern (diagonal lattice pattern) uniform over the entire surface in order to avoid a change in friction force, tension, or the like of the substrate P at a contact portion between the substrate P and the outer peripheral surface of the rotary drum DR, and the line patterns R L1, R L2 need not be inclined at 45 degrees, and the line pattern R L1 may be a grid pattern parallel to the Y axis and the line pattern R L2 may be a vertical and horizontal grid pattern parallel to the X axis, and the line patterns R L1, R L2 may not necessarily intersect at 90 degrees, or the line patterns R L1, R L2 may intersect at a rhombus angle other than a square (or rectangle) in a rectangular region surrounded by the adjacent 2 line patterns R L1 and the adjacent 2 line patterns R L2.
Next, the rotational position detection mechanism 14 will be described with reference to fig. 3, 4, and 8. As shown in fig. 8, the rotational position detecting means 14 optically detects the rotational position of the rotary drum DR, and an encoder system using a rotary encoder or the like can be applied. The rotational position detection mechanism 14 includes scale portions (indices) GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads (heads) EN1, EN2, EN3, and EN4 facing the scale portions GPa and GPb, respectively. In fig. 4 and 8, only 4 encoder heads EN1, EN2, EN3, and EN4 are shown facing scale GPa, but encoder heads EN1, EN2, EN3, and EN4 (see fig. 10) facing scale GPb are also provided in the same manner.
The scale portions GPa and GPb are formed in an annular shape over the entire circumferential direction of the outer circumferential surface of the rotary drum DR. The scale of the scale portions GPa and GPb is a diffraction grating in which concave or convex lattice lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and is configured as an incremental (incremental) type scale. Therefore, the scale portions GPa and GPb rotate integrally with the rotary drum DR around the rotation center line AX 2.
The substrate P is wound inside the regulation bands C L a and C L b while avoiding the inside of the scale portions GPa and GPb at both ends of the rotary drum DR, and when a strict arrangement relationship is required, the outer circumferential surfaces of the scale portions GPa and GPb are set to be flush with the outer circumferential surface of the portion of the substrate P wound around the rotary drum DR (the same radius from the center line AX 2).
The encoder heads EN1, EN2, EN3, and EN4 are arranged around the scale portions GPa and GPb, respectively, as viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotary drum DR. The encoder read heads EN1, EN2, EN3, EN4 are connected to the control device 16. The encoder heads EN1, EN2, EN3, and EN4 project the measuring beams toward the scale portions GPa and GPb, photoelectrically detect the reflected beams (diffracted beams), and output detection signals (for example, 2-phase signals having a phase difference of 90 degrees) corresponding to the circumferential position changes of the scale portions GPa and GPb to the controller 16. The controller 16 measures the angular change of the rotary drum DR with the resolution of the order of micrometers, that is, the circumferential position change of the outer peripheral surface of the rotary drum DR at the installation positions of the encoder heads EN 1to EN4, by interpolating the detection signals (2-phase signals) from the encoder heads EN 1to EN4 by a not-shown counter circuit and performing digital processing. At this time, the controller 16 may measure the transport speed or the circumferential movement of the substrate P on the rotating drum DR from the change in the angle of the rotating drum DR.
As shown in fig. 4 and 8, encoder head EN1 is disposed on set azimuth line L e1, set azimuth line L e1 is a line connecting the projection area (reading position) of the measuring beam of encoder head EN1 on scale portion gpa (gpb) and rotation center line AX2 in the XZ plane, and set azimuth line L e1 is a line connecting drawing lines LL 1, LL 3, LL 5 and rotation center line AX2 in the XZ plane, as described above, it is understood that the line connecting the reading position of encoder head EN1 and rotation center line AX2 is the same as the line connecting drawing lines LL 1, LL 3, LL 5 and rotation center line AX 2.
Similarly, as shown in fig. 4 and 8, encoder head EN2 is disposed on set azimuth line L e2, set azimuth line L e2 is a line connecting the projected area of the measuring beam of encoder head EN2 on scale portion gpa (gpb) and rotation center line AX2 in the XZ plane, and set azimuth line L e2 is a line connecting drawing lines LL 2 and LL 4 and rotation center line AX2 in the XZ plane, as described above, it is understood that the line connecting the reading position of encoder head EN2 and rotation center line AX2 and the lines connecting drawing lines LL 2 and LL 4 and rotation center line AX2 are the same azimuth line.
As shown in fig. 4 and 8, encoder head EN3 is disposed on set-up-side line L e3, set-up-side line L e3 is a line connecting the projected area of the measuring beam of encoder head EN3 onto scale portion gpa (gpb) and rotation center line AX2 in the XZ plane, and set-up-side line L e3 is a line connecting observation areas Vw 1to Vw3 of alignment microscope AM1 onto substrate P and rotation center line AX2 in the XZ plane, as described above, the line connecting the reading position of encoder head EN3 and rotation center line AX2, and the line connecting observation areas Vw 1to Vw3 of alignment microscope AM1 and rotation center line AX2 are the same-side line.
Similarly, as shown in fig. 4 and 8, encoder head EN4 is disposed on set azimuth line L e4, set azimuth line L e4 is a line connecting, in the XZ plane, the projected region of the measuring beam of encoder head EN4 onto scale portion gpa (gpb) and rotation center line AX2, and set azimuth line L e4 is a line connecting, in the XZ plane, observation regions Vw4 to Vw6 of alignment microscope AM2 onto substrate P and rotation center line AX2, and from the above, it is known that the line connecting the reading position of encoder head EN4 and rotation center line AX2 and the line connecting observation regions Vw4 to Vw6 of alignment microscope AM2 and rotation center line AX2 are the same azimuth line.
When the installation orientations of encoder heads EN1, EN2, EN3, and EN4 (angular directions in the XZ plane centered on rotation center line AX2) are indicated by installation orientation lines L e1, L e2, L e3, and L e4, as shown in fig. 4, the plurality of drawing modules UW 1to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation orientation lines L e1 and L e2 make an angle ± θ ° with respect to the center plane p 3.
Here, the controller 16 detects the rotational angle positions of the scale units (the rotary reels DR) GPa and GPb by the encoder heads EN1 and EN2, and performs drawing control of the odd-numbered and even-numbered drawing modules UW 1to UW5 while specifying the moving position of the substrate P based ON the detected rotational angle positions, that is, while the controller 16 performs ON/OFF modulation of the optical deflector 81 based ON CAD information of the pattern to be drawn ON the substrate P during scanning in the scanning direction by the drawing light beam L B projected onto the substrate P, the timing of the ON/OFF modulation of the optical deflector 81 may be performed based ON the detected rotational angle positions (the moving position of the substrate P), whereby the pattern can be drawn ON the photosensitive layer of the substrate P with good accuracy.
The controller 16 stores the rotational angle positions of the scale portions GPa and GPb (rotating drum DR) detected by the encoder heads EN3 and EN4 when the alignment marks Ks 1to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2, and thereby can determine the correspondence between the positions of the alignment marks Ks 1to Ks3 on the substrate P and the rotational angle position of the rotating drum DR. Similarly, the controller 16 stores the rotational angle positions of the scale parts GPa and GPb (rotary drum DR) detected by the encoder heads EN3 and EN4 when the reference pattern RMP on the rotary drum DR is detected by the alignment microscopes AM1 and AM2, and thereby can determine the correspondence relationship between the position of the reference pattern RMP on the rotary drum DR and the rotational angle position of the rotary drum DR. As described above, the alignment microscopes AM1 and AM2 can precisely measure the rotational angle position (or circumferential position) of the rotating drum DR at the moment of sampling (sampling) the marker in the observation regions Vw 1to Vw 6. The exposure apparatus EX performs alignment (registration) of the substrate P and a predetermined pattern drawn on the substrate P or calibration of the rotary drum DR and the drawing apparatus 11 based on the measurement result.
The multi-beam exposure apparatus EX is a spot light that scans the drawing beam L B along the plurality of drawing lines LL to LL on the substrate P while conveying the substrate P in the conveyance direction (longitudinal direction) by the rotating drum DR, and here, the substrate P is conveyed while being wound around a part of the outer peripheral surface of the rotating drum DR, but the positional relationship between the rotating drum DR and the 2 nd optical table 25 may be relatively displaced due to the influence of vibration or the like caused by the rotation of the rotating drum DR, and the relative positional relationship between the substrate P wound around the rotating drum DR and the drawing apparatus 11 provided on the 2 nd optical table 25 may be displaced from a predetermined relative positional relationship (initial setting state) suitable for exposure by, for example, the positional displacement of the rotating drum DR from the substrate P in the rotating drum DR to the drawing apparatus 11 provided on the 2 nd optical table 25, and the relative positional relationship between the substrate P wound around the rotating drum DR and the drawing apparatus EN provided on the 2 nd optical table 25 are displaced as shown in fig. 4.
Fig. 10 is a plan view showing the arrangement of an encoder head of the exposure apparatus of fig. 1. As shown in fig. 10, the encoder heads (1 st detecting device) EN1, EN2 are attached to the 2 nd optical bench 25 by an attaching member 100. On the other hand, the encoder heads (2 nd detecting device) EN3, EN4 are attached to the main body frame 21 by the attachment member 101, and the alignment microscopes AM1, AM2 are also attached to the main body frame 21. Encoder heads EN1 and EN2 are provided in a pair corresponding to a pair of scale portions GPa and GPb provided on both sides of rotation center line AX2 of rotary drum DR. Therefore, the pair of encoder heads EN1 and EN2 detect the rotational positions of the scale portions GPa and GPb, respectively.
In addition, a rotation amount measuring device 105 for measuring the rotation amount of the rotation mechanism 24 is provided between the 1 st optical stage 23 and the 2 nd optical stage 25. The rotation amount measuring device 105 is disposed on a far side from the rotation axis I so that a linear direction thereof is along a circumferential direction of the rotation axis I, for example, using a linear encoder. The controller 16 detects the amount of rotation of the 2 nd optical bench 25 with respect to the 1 st optical bench 23 based on the slight amount of movement in the circumferential direction of the rotation axis I detected by the rotation amount measuring device 105. The rotation mechanism 24 includes a driving unit 106, and the 2 nd optical bench 25 is driven and controlled by the control device 16 via the driving unit 106 to rotate. At this time, the controller 16 controls the driving of the driving unit 106 so that the 2 nd optical bench 25 rotates so that the rotation amount detected by the rotation amount measuring device 105 becomes a predetermined rotation amount.
Fig. 11 is a plan view illustrating a state in which the rotary drum DR and the drawing device 11 (particularly, the 2 nd optical table 25) are slightly rotated in the XY plane in the configuration of fig. 10. As shown in fig. 11, the rotation center line AX2 of the rotary drum DR extends in the Y direction, and the rotation center line AX2 is aligned with the Y directionWhen the rotation axis AX2 is correctly parallel to the Y axis of the stationary coordinate system XYZ, the rotation axis AX2 is located at the reference position. Here, in the XY plane, the rotation center line AX2 is inclined from the reference position by a predetermined angle θ due to the influence of ground vibration, vibration from a drive source in the apparatus, or the likezAmount of the compound (A). In fig. 11, the displacement of the left rotation is + θzThe displacement in the rightward rotation is represented by- θz. When the rotation center line AX2 is tilted by a predetermined angle from the reference position in the XY plane, one end portion of the rotation drum DR in the axial direction moves in a predetermined direction (for example, the-X direction in fig. 11), while the other end portion of the rotation drum DR in the axial direction moves in a direction opposite to the one end portion of the rotation drum DR (for example, the + X direction in fig. 11).
Therefore, the pair of encoder heads EN1 and EN2 are inclined from the reference position by a predetermined angle θ by the rotation center line AX2zIn other words, the rotation position (the movement position of scale GPa) detected by encoder heads EN1 and EN2 on the scale GPa side and the rotation position (the movement position of scale GPb) detected by encoder heads EN1 and EN2 on the scale GPb side are correlated with the angle θzThe corresponding difference. Therefore, the controller 16 can detect the inclination angle θ of the rotation center line AX2 of the rotary drum DR in the XY plane from the rotation positions detected by the pair of encoder heads EN1 and EN2z. Specifically, when the count value (the movement position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN1 on the scale GPa side is CD1a and the count value (the movement position of the scale GPb) counted by the counter circuit corresponding to the encoder head EN1 on the scale GPb side is CD1b, the difference between the count value CD1a and the count value CD1b is obtained every time the rotary drum DR (the scale GPa and GPb) rotates by a predetermined angle or every predetermined time, and the change in the difference is monitored, whereby the inclination variation (the angle θ) of the rotation center line AX2 of the rotary drum DR in the XY plane can be measured (the movement position of the scale GPa) and the change in the inclination variation is monitoredz). Similarly, for the pair of encoder heads EN2, the count value (the movement position of the scale GPa) counted by the counter circuit corresponding to the encoder head EN2 on the scale GPa side is CD2a, and the count value corresponding to the encoder head EN2 on the scale GPb side is CD2aThe count value (the movement position of the scale GPb) counted by the counter circuit of (1) is CD2b, and the change in the difference value is monitored.
In addition, the inclination varies (angle theta)z) In the measurement of (3), since the pair of encoder heads EN1 and EN2 are provided at positions symmetrical to each other with respect to center plane p3 in the X direction as in the case of fig. 4, the change in the difference between count value CD1a of encoder head EN1 facing scale GPa and count value CD2b of encoder head EN2 facing scale GPb, or the change in the difference between count value CD2a of encoder head EN2 facing scale GPa and count value CD1b of encoder head EN1 facing scale GPb, may be monitored.
Here, the controller 16 corrects the position of the drawing device 11 with respect to the substrate P based on the detection results of the alignment microscopes AM1 and AM2 in order to appropriately draw the substrate P conveyed by the rotary drum DR by the drawing device 11. That is, the controller 16 detects the shape of the substrate P and the state of deformation or the like of the element pattern (base pattern) region formed on the substrate P based on the positions of the marks Ks 1to Ks3 detected by the alignment microscopes AM1 and AM2, and obtains the relative correction rotation amount θ corresponding to the detected deformation state (particularly, inclination or the like)2. Furthermore, the rotation amount θ is corrected2Is the angle from a reference line extending in the X direction. In fig. 11, the displacement of the left rotation is + θ2The displacement toward the right rotation is represented by- θ2. Then, the control device 16 calculates the corrected rotation amount θ2The driving unit 106 of the rotating mechanism 24 is controlled to correct the positional relationship of the 2 nd optical bench 25 with respect to the rotating drum DR.
At this time, the control device 16 corrects the rotation amount θ based on the obtained relative correction2After the rotation mechanism 24 (2 nd optical bench 25) is rotationally corrected from the initial position, the encoder heads EN1 and EN2 are also rotated, and therefore the tilt θ of the rotation center line AX2 measured after the rotation correction cannot be consideredzI.e. it will become meaningless. Therefore, the controller 16 considers the inclination θ of the rotation center line AX2 measured in advance (or immediately before)zAccording to the corrected rotation amount theta2Rotating the rotation mechanism 24.
Specifically, the controller 16 measures the relative correction rotation amount θ based on the detection results of the alignment microscopes AM1 and AM22Zero, i.e. "θ2－θz((0 °)) is zero, the rotation amount measuring device 105 rotates the rotation mechanism 24 while measuring the rotation amount by the rotation mechanism 24.
In this manner, the controller 16 obtains the offset information, that is, the inclination of the rotation center line AX2 in the XY plane (the inclination of the rotation drum DR in the XY plane) θ from the predetermined relative arrangement relationship between the rotation drum DR and the 2 nd optical bench 25 based on the detection results of the pair of encoder heads EN1 and EN2zThe rotation amount θ is corrected according to the inclination of the substrate P in the XY plane obtained by the alignment microscopes AM1 and AM22Inclination theta to the rotation center line AX2zThe driving unit 106 of the rotation mechanism 24 is controlled so as to reduce the deviation, that is, so as to maintain the predetermined relative arrangement relationship.
Next, a method of adjusting the exposure apparatus EX will be described with reference to fig. 12. Fig. 12 is a flowchart relating to an adjustment method of the exposure apparatus according to embodiment 1. When the rotational mechanism 24 corrects the positional relationship between the rotating drum DR and the 2 nd optical bench 25 in order to appropriately draw the substrate P by the drawing apparatus 11, the control apparatus 16 first acquires the detection results (the tilt of the element pattern region on the substrate P, etc.) detected by the alignment microscopes AM1 and AM2 (step S1). The controller 16 obtains a corrected rotation amount θ to be adjusted by the rotation mechanism 24 based on the detection results of the alignment microscopes AM1 and AM22(step S2). Thereafter, controller 16 compares the detection results of the pair of encoder heads EN1 and EN2 to obtain the inclination θzThe relevant information (step S3). The controller 16 determines the inclination θ of the rotation center line AX2 from the rotation angle positions (count values CD1a, CD1b, CD2a, CD2b) of the scale portions GPa and GPb detected by the pair of encoder heads EN1 and EN2z(step S4). Then, the control device 16 calculates the corrected rotation amount θ2And center line of rotationInclination θ of AX2zDeviation of (2), i.e. "theta2－θz"zero rotation" is performed by performing feedback control or the like on the rotation mechanism 24 (step S5). After step S5, the controller 16 determines a new inclination θ 'of the rotation center line AX2 at appropriate time intervals from the rotation angle positions (count values CD1a, CD1b, CD2a, and CD2b) of the scale portions GPa and GPb detected by the pair of encoder heads EN1 and EN2 again'z. Then, a new tilt is caused by vibration of the apparatus or the like'zWhile changing, to maintain the new inclination of theta'zThe rotary mechanism 24 is feedback-controlled.
In the above embodiment 1, since the encoder heads EN1 and EN2 are attached to the 2 nd optical surface plate 25, the exposure apparatus EX can obtain the displacement information (the inclination θ of the rotation center line AX2) of the 2 nd optical surface plate 25 from the predetermined relative arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 in the XY plane based on the detection results of the encoder heads EN1 and EN2z). Next, the exposure apparatus EX corrects the relative arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 based on the obtained offset information. Therefore, even if the exposure apparatus EX displaces the position of the rotating drum DR due to the influence of vibration or the like caused by the rotation of the rotating drum DR, the predetermined relative positional relationship between the rotating drum DR and the 2 nd optical stage 25 can be maintained, and therefore, the substrate P can be accurately drawn by the drawing apparatus 11.
In addition, in embodiment 1, encoder heads EN1 and EN2 can be provided on set azimuth lines L e1 and L e2, and therefore, the direction connecting encoder head EN1 and rotation center line AX2 and the direction connecting odd-numbered drawing lines L01, LL 3, and LL 5 and rotation center line AX2 can be made the same direction, and similarly, the direction connecting encoder head EN2 and rotation center line AX2 and the directions connecting even-numbered drawing lines LL 2 and LL 4 and rotation center line AX2 can be made the same direction, and therefore, the arrangement relationship between encoder heads EN1 and EN2 and drawing lines LL 1to LL 5 can be made the same, and therefore, even if the position of rotation drum DR is displaced, the arrangement relationship between lines LL 1to LL 5 drawn with respect to rotation drum DR can be measured with high accuracy by encoder heads EN1 and EN2, and therefore, the measurement that is not easily affected by disturbances can be performed.
In embodiment 1, encoder heads EN3 and EN4 can be attached to main body frame 21. Therefore, the exposure apparatus EX can measure the marks Ks 1to Ks3 of the alignment microscopes AM1 and AM2 with the main body frame 21 (the bearing portion of the rotary drum DR) as a stationary reference based on the detection results of the encoder heads EN3 and EN 4. Then, the exposure apparatus EX can obtain the relative correction rotation amount θ to be corrected by the rotation mechanism 24 from the detection results of the alignment microscopes AM1 and AM22. Therefore, the exposure apparatus EX can obtain the corrected rotation amount theta2Inclination θ from the rotation center line AX2 as offset informationzThe positional relationship between the rotary drum DR and the 2 nd optical bench 25 is precisely corrected.
Further, in embodiment 1, encoder heads EN3 and EN4 can be provided on set azimuth lines L e3 and L e4, and therefore, the direction connecting encoder head EN3 and rotation center line AX2 can be made the same direction as the direction connecting observation regions Vw 1to Vw3 and rotation center line AX2, and the direction connecting encoder head EN4 and rotation center line AX2 can be made the same direction as the direction connecting observation regions Vw4 to Vw6 and rotation center line AX2, and therefore, the arrangement relationship between encoder heads EN3 and EN4 and observation regions Vw 1to Vw6 can be made the same, and the arrangement relationship between encoder heads EN3 and EN4 and observation regions Vw 1to Vw6 with respect to the rotation drum DR can be measured with good accuracy even if the position of the rotation drum DR is displaced, and therefore, the measurement that is not easily affected by disturbance can be performed.
In addition, in embodiment 1, the arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 can be corrected by rotating the 2 nd optical surface plate 25 with respect to the 1 st optical surface plate 23 by the rotating mechanism 24, and therefore, the exposure apparatus EX can correct the drawing lines LL 1to LL 5 formed by the drawing apparatus 11 provided on the 2 nd optical surface plate 25 to an appropriate position with respect to the substrate P wound around the rotary drum DR, and thus can perform drawing of the substrate P by the drawing apparatus 11 with good accuracy.
In embodiment 1, the operation is carried outFor determining a corrected rotation amount theta2After steps S1 and S2, steps S3 and S4 are performed to obtain offset information, but the present invention is not limited to this configuration. Or may be performed in parallel to determine the corrected rotation amount theta2Step S1 and step S2 and step S3 and step S4 for obtaining offset information may be executed after step S3 and step S4 for obtaining offset information are executed, and then corrected rotation amount θ may be obtained2Step S1 and step S2.
[ embodiment 2 ]
Next, an exposure apparatus EX according to embodiment 2 will be described with reference to fig. 13. Fig. 13 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to embodiment 2. In embodiment 2, in order to avoid redundant description with embodiment 1, only the portions different from embodiment 1 will be described, and the same components as those in embodiment 1 will be described with the same reference numerals as those in embodiment 1. In the exposure apparatus EX according to embodiment 1, a case where the rotation center line AX2 of the rotation drum DR is inclined with respect to the X direction (reference position) in the XY plane as a displacement of the arrangement relationship between the rotation drum DR and the 2 nd optical stage 25 is described. In the exposure apparatus EX according to embodiment 2, a case where the rotation center line AX2 of the rotation drum DR is inclined with respect to the Y direction (reference position) in the YZ plane as a displacement of the arrangement relationship between the rotation drum DR and the 2 nd optical bench 25 will be described.
As shown in fig. 13, the three-point mount 22 functions as a coupling mechanism for coupling the main body frame 21 to the 1 st optical surface plate 23 and the 2 nd optical surface plate 25. In embodiment 1, the main body frame 21 and the 1 st optical surface plate 23 connected by the three-point mount 22 function as the 1 st support member, the 2 nd optical surface plate 25 functions as the 2 nd support member, and the rotation mechanism 24 functions as the connection mechanism. In embodiment 2, the main body frame 21 is caused to function as the 1 st supporting member, the 1 st optical surface plate 23 and the 2 nd optical surface plate 25 coupled by the rotating mechanism 24 are caused to function as the 2 nd supporting member, and the three-point mount 22 is caused to function as the coupling mechanism.
The three-point mount 22 includes a driving unit 110 having a motor, a piezoelectric element, or the like, and is driven and controlled by the control unit 16 via the driving unit 110 to independently adjust the length (height) in the Z direction at each supporting point 22a, thereby adjusting the tilt of the 1 st optical bench 23 with respect to the main body frame 21. Here, the rotation center line AX2 extends in the Y direction, and the position of the rotation center line AX2 extending in the Y direction is set as a reference position. In the YZ plane, the rotation center line AX2 as the reference position is inclined by a predetermined angle from the reference position due to the influence of vibration or the like caused by rotation. After the rotation center line AX2 is tilted by a predetermined angle amount from the reference position, one end portion of the rotation drum DR in the axial direction moves in a predetermined direction (for example, the-Z direction in fig. 13), and the other end portion of the rotation drum DR in the axial direction moves relatively in a direction opposite to the one end portion of the rotation drum DR (for example, the + Z direction in fig. 13).
Therefore, when the pair of encoder heads EN1 and EN2 are attached to the 2 nd optical stage 25 (or the 1 st optical stage 23) side, the difference can be generated between the rotational angle positions (count values CD1a and CD2a) detected by the encoder heads EN1 and EN2 on the scale GPa side and the rotational angle positions (count values CD1b and CD2b) detected by the encoder heads EN1 and EN2 on the scale GPb side, by inclining the rotational center line AX2 by a predetermined angle amount in the YZ plane from the reference position. Therefore, the controller 16 can detect a change in tilt of the rotation center line AX2 of the rotary drum DR in YZ plane based on the rotation angle positions detected by the pair of encoder heads EN1 and EN 2. However, the information of the rotational angle position detected by the encoders EN1 and EN2 on the side of the scale GPa or the encoder heads EN1 and EN2 on the side of the scale GPb has little sensitivity to the Z-direction displacement of the rotational center line AX2 (the rotary drum DR), and has sensitivity to the X-direction displacement of the rotational center line AX2 (the rotary drum DR) as in embodiment 1.
Therefore, in embodiment 2, the displacement of both ends of the rotation center line AX2 (the rotation drum DR) in the Z direction is measured using the directions of the pair of encoder heads EN3 and EN4 arranged in the installation orientations of the alignment microscopes AM1 and AM2 shown in fig. 4, 8, 10, and 11. Therefore, as shown in fig. 10 and 11, encoder heads EN3 and EN4 attached to main body frame 21 may be attached to 1 st optical stage 23 or 2 nd optical stage 25, and the inclination of rotation center line AX2 of rotation drum DR in YZ plane with respect to rotation center line AX2 of the reference position may be detected based on the difference between the rotation angle positions (count values CD3a and CD4a of the corresponding counter circuits) detected by a pair of encoder heads EN3 and EN4 facing scale portion GPa and the rotation angle positions (count values CD3b and CD4b of the corresponding counter circuits) detected by a pair of encoder heads EN3 and EN4 facing scale portion GPb.
Next, the controller 16 obtains offset information, that is, the inclination of the rotation center line AX2 in the YZ plane from the predetermined relative arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 based on the detection results (count values CD3a, CD3b, CD4a, CD4b) of the pair of encoder heads EN3, EN4, controls the driving unit 110 of the three-point mount 22 so that the obtained inclination of the rotation center line AX2 is reduced, that is, so that the predetermined relative arrangement relationship is maintained, and corrects the inclination of the entire 2 nd optical surface plate 25.
As described above, in embodiment 2, the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN2) are attached to the 2 nd optical surface plate 25, and the offset information (the displacement in the Z direction and the inclination in the YZ plane) of the rotary drum DR and the 2 nd optical surface plate 25 in the YZ plane from the predetermined relative arrangement relationship can be obtained from the detection results (the difference in the rotational angle positions) of the encoder heads EN3 and EN4 (or the encoder heads EN1 and EN 2). Next, the exposure apparatus EX corrects the relative arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 based on the obtained offset information. Therefore, in the exposure apparatus EX, even if the position of the rotating drum DR is displaced due to the influence of vibration or the like, the predetermined relative positional relationship between the rotating drum DR and the 2 nd optical stage 25 can be maintained, and thus exposure can be performed with good accuracy on the substrate P.
[ embodiment 3 ]
Next, an exposure apparatus EX according to embodiment 3 will be described with reference to fig. 14. Fig. 14 is a perspective view showing the arrangement of the main parts of the exposure apparatus according to embodiment 3. In addition, in embodiment 3 as well, in order to avoid redundant description with respect to embodiments 1 and 2, only the portions different from embodiments 1 and 2 will be described, and the same reference numerals as in embodiments 1 and 2 will be given to the same components as in embodiments 1 and 2. The exposure apparatus EX of embodiments 1 and 2 displaces the position of the drawing apparatus 11 side (the 2 nd support member side) by the rotation mechanism 24 and the three-point bed 22. In the exposure apparatus EX according to embodiment 3, the positions of both end sides of the rotary drum DR (the rotation central axis AX2) are displaced in the X direction and the Z direction by the X-moving mechanism 121 and the Z-moving mechanism 122.
As shown in fig. 14, the rotary drum DR is provided with shaft (draft) portions Sf2 on both sides in the axial direction, and each shaft portion Sf2 is rotatably supported by the main body frame 21 via a bearing 123. The bearings 123 on both sides are provided with an X-movement mechanism 121 and a Z-movement mechanism 122 adjacent to each other, and each of the X-movement mechanism 121 and each of the Z-movement mechanisms 122 can move (jog) the bearing 123 in the X-direction and the Z-direction.
In embodiment 3, the bearing 123 functions as the 1 st support member, the apparatus frame 13 functions as the 2 nd support member, and the X-movement mechanisms 121 and the Z-movement mechanisms 122 function as the coupling mechanisms.
The pair of X-moving mechanisms 121 on both sides can move the pair of bearings 123 on both sides in the X direction, respectively, to finely adjust the inclination of the rotation center line AX2 of the rotating drum DR and the X-direction position in the XY plane. Here, the rotation center line AX2 extends in the Y direction similarly to embodiment 1, and the position of the rotation center line AX2 extending in the Y direction is set as a reference position. When the rotation center line AX2 as the reference position is inclined by a predetermined angle amount from the reference position by the influence of vibration or the like in the XY plane, the inclination of the rotary drum DR in the XY plane can be corrected by adjusting the driving amounts of the pair of X moving mechanisms 121 on both sides.
The pair of Z-moving mechanisms 122 on both sides can move the pair of bearings 123 on both sides in the Z direction, respectively, to finely adjust the inclination of the rotation center line AX2 of the rotary drum DR and the position in the Z direction in the YZ plane. Here, the rotation center line AX2 extends in the Y direction similarly to embodiment 2, and the position of the rotation center line AX2 extending in the Y direction is set as a reference position. When the rotation center line AX2 as the reference position is inclined by a predetermined angle amount from the reference position due to the influence of vibration or the like in the YZ plane, the inclination of the rotary drum DR in the YZ plane can be corrected by adjusting the driving amounts of the pair of Z moving mechanisms 122 on both sides.
As described in embodiment 1, the pair of encoder heads EN1 and EN2 can measure a relative tilt error between the 2 nd optical surface plate 25 and the rotary drum DR (rotation center line AX2) in the XY plane. In embodiment 3 as well, similarly to embodiment 2, when the encoder heads EN3 and EN4 are attached to the 2 nd optical surface plate 25 (or the 1 st optical surface plate 23), the pair of encoder heads EN3 and EN4 can measure the relative tilt error between the 2 nd optical surface plate 25 and the rotary drum DR (the rotation center line AX2) in the YZ plane as described in embodiment 2.
Therefore, the controller 16 obtains information on the deviation of the rotary drum DR from the predetermined relative arrangement relationship with the 2 nd optical surface plate 25 (the relative inclination θ of the rotation center line AX2 in the XY plane) from the predetermined relative arrangement relationship between the rotary drum DR and the 2 nd optical surface plate 25 based on the detection results (the count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1, EN2Z). Further, the controller 16 measures the tilt of the element pattern region on the substrate P from the detection results of the alignment microscopes AM1 and AM2 to determine the corrected rotation amount θ of the X-moving mechanism 1212. The control device 16 uses the obtained correction rotation amount theta2Inclination theta to the rotation center line AX2ZThe driving amount of the X-ray moving mechanism 121 on both sides is controlled so as to reduce the deviation, that is, so as to maintain a predetermined relative arrangement relationship. Similarly, the controller 16 obtains the tilt (denoted by θ) of the rotation center line AX2 in YZ plane, which is the offset information, from the predetermined relative arrangement relationship between the rotary drum DR and the 2 nd optical bench 25 based on the detection results (count values CD3a, CD3b, CD4a, and CD4b) of the pair of encoder heads EN3 and EN4X) And the inclination theta of the rotation central line AX2 is calculatedXThe reduction method, that is, the predetermined relative arrangement relationship is maintained, and the driving amounts of the Z-moving mechanisms 122 on both sides are controlled.
In the above embodiment 3, the relative arrangement relationship between the rotary drum DR and the 2 nd optical stage 25 can be adjusted by rotating the rotary drum DR relative to the main body frame 21 about an axis parallel to the Z axis by the X moving mechanism 121 in the XY plane and rotating the rotary drum DR relative to the main body frame 21 about an axis parallel to the X axis by the Z moving mechanism 122 in the YZ plane, and therefore, the exposure apparatus EX can correct the drawing lines LL 1to LL 5 formed by the drawing apparatus 11 provided on the 2 nd optical stage 25 to appropriate positions with respect to the substrate P wound around the rotary drum DR, and can expose the device pattern with high accuracy to the substrate P.
[ 4 th embodiment ]
Next, an exposure apparatus EX according to embodiment 4 will be described with reference to fig. 15. Fig. 15 is a diagram showing the configuration of the rotary drum and the drawing device of the exposure apparatus according to embodiment 4. In addition, in embodiment 4 as well, in order to avoid redundant description with respect to embodiments 1to 3, only the portions different from embodiments 1to 3 will be described, and the same reference numerals as in embodiments 1to 3 will be given to the same components as in embodiments 1to 3. The exposure apparatus EX according to embodiment 3 displaces the position of the rotating drum DR by the X-moving mechanism 121 and the Z-moving mechanism 122 that move the bearing 123. The exposure apparatus EX of embodiment 4 displaces the position of the rotating drum DR by the drum support frame 130 which is separate and independent from the apparatus frame 13.
As shown in fig. 15, the roll support frame 130 includes a roll rotating mechanism 131 and a roll support member 132 in this order from the Z direction downward. The drum rotating mechanism 131 is provided on the installation surface E via a vibration isolation unit SU 3. The roll support member 132 is provided on the roll rotating mechanism 131, and rotatably supports the shaft of the rotating roll DR on both sides. A drum rotating mechanism 131 having a rotation axis I parallel to the Z axis in the XY planeaThe drum supporting member 132 is rotated (intersecting the rotation center axis AX2) about the center, and the inclination of the rotation center line AX2 of the rotating drum DR in the XY plane is adjusted.
In addition, since the rotary drum DR is provided on the drum support frame 130 which is separate and independent from the apparatus frame 13, in the present embodiment, the three-point mount 22, the 1 st optical surface plate 23, and the rotation mechanism 24 in the previous embodiments 1to 3 can be omitted, and only the 2 nd optical surface plate 25 and the drawing apparatus 11 supported thereby can be provided on the main body frame 21. In embodiment 4, the roll support frame 130 functions as the 1 st support member, the apparatus frame 13 functions as the 2 nd support member, and the roll rotating mechanism 131 functions as the coupling mechanism.
Here, the controller 16 detects the relative inclination θ of the rotation drum DR (rotation center line AX2) and the 2 nd optical stage 25 in the XY plane with respect to the rotation center line AX2 of the reference position extending in the Y direction based on the detection results (count values CD1a, CD1b, CD2a, CD2b) of the pair of encoder heads EN1, EN2 attached to the 2 nd optical stage 25Z. The controller 16 measures the tilt of the element pattern region on the substrate P from the detection results of the alignment microscopes AM1 and AM2 to determine the corrected rotation amount θ of the roll rotating mechanism 1312. The control device 16 uses the obtained corrected rotation amount theta2Inclination theta to the rotation center line AX2ZThe roll rotating mechanism 131 is controlled so as to reduce the deviation, that is, so as to maintain a predetermined relative arrangement relationship. The pair of encoder heads EN3 and EN4 disposed in the same direction as the installation orientation of the alignment microscopes AM1 and AM2 are attached to the 2 nd optical bench 25, but may be attached to the roll support member 132 side.
As described above, in embodiment 4, since the relative positional relationship between the rotating drum DR and the 2 nd optical surface plate 25 can be corrected by rotating the drum support frame 130 with the drum rotating mechanism 131 to rotate the rotating drum DR with respect to the 2 nd optical surface plate 25, the exposure apparatus EX can adjust the substrate P wound around the rotating drum DR to an appropriate position with respect to the drawing lines LL 1to LL 5 formed by the drawing apparatus 11 provided on the 2 nd optical surface plate 25, and can expose the device pattern to the substrate P with high accuracy.
[ embodiment 5 ]
Next, an exposure apparatus EX according to embodiment 5 will be described with reference to fig. 16. Fig. 16 is a plan view showing the arrangement of the encoder head of the exposure apparatus according to embodiment 5. In addition, similarly to embodiment 5, in order to avoid redundant description with respect to embodiments 1to 4, only the portions different from embodiments 1to 4 will be described, and the same reference numerals as in embodiments 1to 4 will be given to the same components as in embodiments 1to 4. In exposure apparatus EX according to embodiment 1, a pair of encoder heads EN1 and EN2 detect the tilt of rotary drum DR. In the 5 th embodiment, the inclination of the rotary drum DR is detected by the pair of encoder heads EN1, EN2 and the pair of encoder heads EN5, EN 6.
As shown in fig. 16, a pair of encoder readheads EN1, EN2 are mounted to the 2 nd optical platform 25 by a mounting member 100. Further, a pair of encoder heads EN5, EN6 are attached to body frame 21 by attachment members 141. Here, encoder heads EN1 and EN5 are disposed adjacent to each other with a predetermined gap therebetween in the Y direction. Further, the Y-direction widths of the scale portions GPa and GPb are set to be wide so that the two encoder heads EN1 and EN5 adjacent in the Y direction can detect the scale portions GPa and GPb, respectively.
Here, since the rotary drum DR is attached to the main body frame 21, the controller 16 detects the inclination θ 2 of the rotation center line AX2 of the rotary drum DR in the XY plane from the rotation angle position (the count values CD5a, CD5b, CD6a, and CD6b of the corresponding counter circuits) detected by each of the pair of encoder heads EN5 and EN6ZRAnd detecting the inclination thetaZRAs a reference position. That is, by changing the difference between count value CD5a of encoder head EN5 opposed to scale portion GPa on one side of rotation center axis AX2 and count value CD5b of encoder head EN5 opposed to scale portion GPb on the other side of rotation center axis AX2, or changing the difference between count value CD6a of encoder head EN6 opposed to scale portion GPa and count value CD56 of encoder head EN6 opposed to scale portion GPb on the other side of rotation center axis AX2, it is possible to measure the inclination θ of rotation drum DR in the XY plane with reference to main body frame 21ZRA variation of (c).
Further, the controller 16 determines the relative inclination θ of the rotary drum DR and the 2 nd optical surface plate 25 in the XY plane from the rotational angle positions (count values CD1a, CD1b, CD2a, CD2b) detected by the pair of encoder heads EN1, EN2, as in embodiment 1Z. Therefore, the rotation angle detected by the pair of encoder heads EN5 and EN6 is based onInclination of position measured thetaZRAnd a tilt θ measured from the rotational angle position detected by the pair of encoder heads EN1 and EN2ZBy rotating the 2 nd optical stage 25 by the rotation mechanism 24, the 2 nd optical stage 25 and the drawing device 11 supported by the same can be set to have no rotation error with respect to the main body frame 21 (stationary reference). However, similarly to embodiment 1, when the inclination error of the element pattern region formed on the substrate P is to be dealt with, the relative inclination θ of the element pattern region measured from the detection result of the alignment microscopes AM1 and AM2 is added2The rotation mechanism 24 is driven by the corresponding correction amount.
As described above, in embodiment 5, the inclination θ 2 of the rotation center line AX2 of the rotary drum DR in the XY plane with respect to the main body frame 21 can be detected from the rotational position detected by the pair of encoder heads EN5 and EN6ZR. Therefore, the control device 16 can measure the reference position of the rotation center line AX2 of the rotary drum DR, and thereby can measure the predetermined relative arrangement relationship between the rotary drum DR and the 2 nd optical bench 25 with good accuracy. In particular, in performing the first exposure of the pattern for drawing the layer 1 of the element pattern region on the substrate P, even if the rotating drum DR is inclined in the XY plane with respect to the main body frame 21 as a stationary reference, the pattern of the first exposure can be corrected to be inclined on the substrate P and transferred.
[ embodiment 6 ]
Next, an exposure apparatus EX according to embodiment 6 will be described with reference to fig. 17. Fig. 17 is a plan view showing the arrangement of the scale disk of the exposure apparatus according to embodiment 6. In addition, in the same manner as in embodiment 6, in order to avoid redundant description with respect to embodiments 1to 5, only the portions different from embodiments 1to 5 will be described, and the same reference numerals as in embodiments 1to 5 will be given to the same components as in embodiments 1to 5. The exposure apparatus EX according to embodiments 1to 5 detects the rotational position of the rotating drum DR by using the scale portions GPa and GPb formed on the outer peripheral surface of the rotating drum DR. The exposure apparatus EX according to embodiment 6 detects the rotational position of the rotating drum DR by using the highly circular scale disk SD attached to the rotating drum DR.
As shown in fig. 17, the scale disk SD has scale portions GPa and GPb engraved on the outer peripheral surface thereof, and is fixed to the end of the rotary drum DR so as to be orthogonal to the rotation center line AX 2. Therefore, the scale disk SD rotates around the rotation center line AX2 integrally with the rotary drum DR. The scale disk SD is made of a metal, glass, ceramic, or the like having a low thermal expansion as a base material, and has a diameter as large as possible (for example, 20cm or more) in order to improve the measurement resolution. In fig. 17, although the diameter of the outer peripheral surface of the scale disk SD is shown to be smaller than the diameter of the outer peripheral surface of the photosensitive drum DR, the so-called measurement abbe error can be further reduced by setting the diameter of the scale portion GP of the scale disk SD to coincide (substantially coincide) with the diameter of the outer peripheral surface of the substrate P wound around the rotary drum DR.
As described above, in embodiment 6, since the individual scale disks SD can be attached to the rotating drum DR, a scale disk SD suitable for the rotating drum DR can be selected. Further, since the scale disk SD is mounted with a mechanism (pressing screw or the like) capable of finely adjusting the roundness at a plurality of positions in the circumferential direction, it is possible to further reduce the measurement error (accumulated error) caused by the eccentric error of the scale section GP from the rotation center axis AX2, the pitch error of the scale (diffraction grating), or the like.
In addition, in embodiments 1to 6, a pattern is formed on the substrate P by using the drawing device 11 of the scanning spot light, but the present invention is not limited to this configuration, and any device may be used as long as it forms a pattern on the substrate P, and for example, a projection exposure system may be used in which a projection beam from a mask is projected and exposed on the substrate P by using a transmissive or reflective flat or cylindrical mask to form a pattern on the substrate P. Further, instead of the mask, a mask-less exposure apparatus may be used in which a light distribution corresponding to a pattern to be drawn is projected onto the substrate P by a Digital Micromirror Device (DMD) in which a plurality of tiltable micromirrors are arranged in a matrix. As an apparatus for forming a pattern on the substrate P, for example, an inkjet type drawing apparatus may be used which forms a pattern on the substrate P using a head for ejecting liquid droplets such as ink. In the case of such a maskless exposure machine or an inkjet drawing device, as disclosed in, for example, japanese patent application laid-open No. 2010-091990, a configuration may be adopted in which a plurality of exposure portions (pattern forming portions) for projecting light distribution corresponding to a pattern formed by a DMD onto a substrate P are arranged in the width direction of the substrate P, or a configuration in which a plurality of droplet applying portions (pattern forming portions) provided with inkjet ink nozzles are arranged in the width direction of the substrate P, in which the entire plurality of exposure portions or the entire plurality of droplet applying portions are relatively rotatable within the XY plane with respect to the substrate P.
In addition, although the embodiments 1to 6 are configured to rotate the 2 nd optical stage 25, which fixes the plurality of drawing modules UW 1to UW5 constituting the drawing device 11, in the XY plane by the rotation mechanism 24, in order to adjust the respective lines of the drawing lines LL to LL in parallel in the XY plane or to adjust the substrate with a predetermined inclination in the XY plane, in this case, it is possible to provide an actuator (the 2 nd rotation mechanism, the drive mechanism) which can rotate the drawing modules UW 1to UW5 in the XY plane individually and slightly in the XY plane, and in this case, it is possible to provide an individual angle measurement sensor which measures the rotational angle position (inclination amount or the like) of each of the drawing modules UW 1to UW5 (pattern forming portion) with respect to the 2 nd optical stage 25, and it is possible to align the substrate with the substrate rotation direction (the inclination direction) of the substrate pair 2 w optical stage 25 in the XY plane and the substrate conveyance direction (the inclination direction) of the substrate pair of the exposure area 2 w 5827, which is measured by the pair of drawing modules UW optical stage 2 nd optical stage 1 or EN1, EN 4642, and the pair of the substrate (the pair of oblique substrate) which are aligned oblique substrate), and the substrate, even when the substrate is aligned oblique substrate is aligned with the oblique substrate rotation direction, the oblique substrate rotation sensors (the oblique substrate rotation direction of the oblique substrate rotation axes of the substrate rotation sensors (the substrate rotation axes of the substrate pair of the oblique substrate pair of the substrate conveyance line pair of the linear conveyance line for example, the substrate alignment mark 5994 and the substrate 5994, the substrate alignment mark 58substrate alignment mark 5894, the substrate 59.
In embodiments 1to 6, driving mechanisms (the rotation mechanism 24, the driving unit 110 of the three-point stand 22, the X movement mechanism 121, and the Z movement mechanism 122) including a motor and the like for relatively slightly rotating the 2 nd optical stage 25 supporting the drawing device 11 and the main body frame 21 supporting the rotary drum DR in XY planes (or YZ planes) are provided. However, instead of the electric operation of the motor or the like, a connection mechanism for connecting the 2 nd optical table 25 and the main body frame 21 to be relatively finely adjusted in the spatial arrangement relationship between the drawing device 11 and the rotary drum DR may be manually operated by adjusting screws, a micromanometer, replacement of washers having different thicknesses, or the like. The coupling mechanism having such a manually operated adjustment portion is useful, for example, when the 2 nd optical bench 25 (1 st optical bench 23) on which the drawing device 11 is mounted is detached from the main body frame 21 and is mounted on the main body frame 21 again by the three-point mount 22 at the time of assembly of the apparatus or at the time of maintenance inspection, and the like, when the positions of the three-point mounts 22 in the XYZ directions are finely adjusted.
< method for manufacturing element >
Next, an element manufacturing method is described with reference to fig. 18. Fig. 18 is a flowchart showing a device manufacturing method according to each embodiment.
The device manufacturing method shown in fig. 18 is a method of designing a function and performance of a display panel formed using a self-light emitting device such as organic E L, for example, to design a desired circuit pattern and wiring pattern by CAD or the like (step S201), preparing a supply roll on which a flexible substrate P (a resin film, a metal foil film, a plastic film or the like) as a base material of the display panel is wound (step S202), and the roll-shaped substrate P prepared in step S202 may be a roll on which the surface is modified as necessary, an undercoat layer is formed in advance (for example, fine irregularities by a stamp (imprint) method), or a photosensitive functional film or a transparent film (an insulating material) is laminated in advance.
Next, a substrate layer made of electrodes, wirings, an insulating film, TFTs (thin film semiconductors), and the like, which constitute a display panel element, is formed on the substrate P, and a light emitting layer (display pixel portion) made of a self-light emitting element such as organic E L is formed by laminating on the substrate (step S203). in step S203, there are also treatments such as a conventional photolithography process of exposing a photoresist layer using the exposure apparatus EX described in the above embodiments, an exposure process of pattern-exposing the substrate P coated with a photosensitive silane coupling agent instead of the photoresist to form a hydrophilic pattern on the surface, a wet process of pattern-exposing a photosensitive catalyst layer to form a metal film pattern (wiring, electrodes, and the like) by electroless plating, and a printing process of drawing a pattern with a conductive ink containing silver nanoparticles.
Next, the substrate P is cut for each display panel element continuously manufactured on the long substrate P in a roll manner, or a protective film (environmental barrier layer) or a color filter film is attached to the surface of each display panel element, and the elements are assembled (step S204). Then, a checking step is performed to check whether the display panel device can operate normally or whether the desired performance and characteristics are satisfied (step S205). By the above method, a display panel (flexible display) can be manufactured. In addition to the manufacture of the display panel shown in fig. 18, the exposure apparatus of each of the above embodiments can be used when manufacturing a flexible printed board, a chemical sensor sheet having a semiconductor element such as a TFT and a sensing electrode pattern, or a DNA chip, which requires a precise wiring pattern (high-density wiring), on the flexible substrate P.

Claims (9)

1. A substrate processing apparatus for conveying a long sheet-like substrate in a longitudinal direction and sequentially forming a predetermined pattern on the sheet-like substrate, comprising:
a cylindrical drum having a cylindrical outer peripheral surface with a constant radius from a center line extending in a direction intersecting the longitudinal direction, the cylindrical drum supporting the sheet-like substrate with a part of the outer peripheral surface;
a1 st support member for supporting the drum rotatably around the center line;
a pattern forming device disposed opposite to a portion of the outer peripheral surface of the cylindrical drum, the portion supporting the sheet-like substrate, the pattern forming device forming the pattern on the sheet-like substrate;
a2 nd support member that holds the pattern forming device;
a reference member that rotates around the center line together with the drum, and that is provided with an index for measuring a change in position in the direction of rotation of the drum or in the direction of the center line;
a1 st detecting device attached to the 2 nd support member, for detecting an index of the reference member to detect a change in position in the rotation direction or the center line direction of the cylindrical drum;
a2 nd detection device attached to the 1 st support member and detecting an index of the reference member; and
a connecting mechanism for connecting the relative arrangement of the cylinder drum and the pattern forming device to be adjustable based on the detection results of the 1 st and 2 nd detection devices.
2. The substrate processing apparatus according to claim 1, wherein the 1 st detecting device is arranged such that a pattern forming position of the pattern forming device with respect to the sheet-like substrate substantially coincides with a direction connecting a detection position of the index of the 1 st detecting device with respect to the reference member with the center line when the 2 nd supporting member is viewed from an extending direction of the center line.
3. The substrate processing apparatus according to claim 2, further comprising a mark detection device mounted on the 1 st support member and having a detection probe for detecting a mark formed on the sheet-like substrate;
the 2 nd detecting device is disposed in the 1 st supporting member such that a detection position of the index of the reference member by the 2 nd detecting device substantially coincides with a direction in which a detection position of the mark by the detection probe is connected to the center line when viewed from the extending direction of the center line.
4. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism is provided between the 1 st support member and the 2 nd support member, and couples the 2 nd support member to be rotatable with respect to the 1 st support member around a predetermined point in a plane intersecting a direction in which the 1 st support member and the 2 nd support member face each other.
5. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism couples the rotation axis of the cylindrical drum to be tiltable so that the center line as the rotation axis of the cylindrical drum is tilted relative to the patterning device.
6. The substrate processing apparatus according to any one of claims 1to 3, wherein the 1 st support member has a main body frame disposed on an installation surface, a1 st stage provided on the main body frame, and a support mechanism provided between the main body frame and the 1 st stage;
the 2 nd support member has a2 nd stage disposed on the 1 st stage.
7. The substrate processing apparatus according to any one of claims 1to 3, wherein the coupling mechanism includes a driving unit that relatively displaces the 1 st support member and the 2 nd support member;
the index of the reference member is a pair of scale parts of an encoder for rotation measurement provided on both sides of the cylindrical drum in the center line direction;
the 1 st detecting device and the 2 nd detecting device are a pair of heads disposed to face each of the pair of scale parts.
8. The substrate processing apparatus according to claim 7, further comprising: a control device for controlling the driving part;
the control device obtains offset information of the cylinder drum and the 2 nd support member from a predetermined relative arrangement relationship based on the detection results of the pair of heads, and controls the drive unit to maintain the predetermined relative arrangement relationship based on the offset information.
9. The substrate processing apparatus according to any one of claims 1to 3,
the pattern forming apparatus is any one of the following apparatuses:
a pattern drawing device for drawing the pattern by one-dimensionally scanning a spot beam of a drawing beam ON/OFF-modulated in accordance with CAD information of the pattern to be drawn ON the sheet-like substrate in the direction of the center line;
a mask type exposure device for exposing the pattern on the sheet-like substrate using a transmission type or reflection type flat or cylindrical mask;
a maskless exposure device that projects and exposes light distribution corresponding to a pattern to be drawn on the sheet-like substrate by a plurality of micromirrors onto the sheet-like substrate;
in the drawing device of the ink jet system, a pattern made of the ink is formed on the sheet-like substrate by a head for ejecting droplets of the ink.
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