CN106933065B - Substrate board treatment - Google Patents

Substrate board treatment Download PDF

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Publication number
CN106933065B
CN106933065B CN201610861837.4A CN201610861837A CN106933065B CN 106933065 B CN106933065 B CN 106933065B CN 201610861837 A CN201610861837 A CN 201610861837A CN 106933065 B CN106933065 B CN 106933065B
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Prior art keywords
substrate
temperature
pattern
processing unit
cartridge unit
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CN106933065A (en
Inventor
铃木智也
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Abstract

Substrate board treatment has: substrate supporting component, has from regulation axis with the curved curved surface of radii fixus, and a part of substrate is wound in curved surface and supporting substrates；Processing unit, configuration is handled around substrate supporting component, and to the substrate implementation being located in circumferential direction on the curved surface of specific position when from axis；The temperature of the substrate before being supplied to substrate supporting component is adjusted in temperature-adjusting device.

Description

Substrate board treatment
The present patent application be international filing date be August in 2013 12, international application no PCT/JP2013/071823, National application number into National Phase in China is 201380047645.4, entitled " substrate board treatment and element system Make method " patent application divisional application.
Technical field
The present invention relates to the substrate board treatments and member of implementing processing to the substrate on the curved surface for being located at substrate supporting portion part Part manufacturing method.
Background technique
In the exposure device used in photo-mask process, it is known that as disclosed in following patent documents, make cylindrical shape Or the rotation of columned light shield and exposure device that substrate is exposed (for example, referring to patent document 1).
Not only using the light shield of plate, though using cylindric or columned light shield to substrate into Row exposure in the case where, in order to by the pattern of light shield picture well projection exposure on substrate, it is also desirable to accurately obtain light The location information of the pattern of cover.For this reason, it may be desirable to develop the position that can accurately obtain cylindric or columned light shield Information and can accurately adjust the light shield and substrate positional relationship technology.
Therefore, in exposure device disclosed in patent document 1, disclose such as flowering structure: the pattern in light shield is formed In the predetermined region in face, relative to pattern with label (scale, grid of defined positional relationship forming position acquisition of information Deng), it is detected and is marked using encoder system, thus obtain the location information or light of the pattern in the circumferential direction of pattern forming face Location information on the axial rotary of cover.
In addition, also proposed following device in recent years: in order to which the electronics such as larger display panels (liquid crystal, organic EL etc.) are first Part is formed in flexible resin film, plastic sheet, very thin glass sheet etc., will be wound into the flexible length of roll The film or sheet material (hereinafter also referred to as flexible substrate) of strip pull out, in the surface of flexible substrate coating photoinduction layer, and The various patterns (for example, patent document 2) of electronic circuit are exposed on the photoinduction layer.
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2008-076650 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2010-217877 bulletin
Summary of the invention
In the above-mentioned substrate board treatment disclosed Patent Document 2 for implementing processing on flexible substrate, it is desirable that inhibit Stretching for substrate, improves the precision of processing.
The scheme of the invention is developing in view of the foregoing, inhibit stretching for substrate its purpose is to provide a kind of Contracting, improves the substrate board treatment and manufacturing method of the precision of processing.
1st scheme according to the present invention, provides a kind of substrate board treatment, has: substrate supporting component, has from rule Dead axle is with the curved curved surface of radii fixus, and a part of substrate is wound in the curved surface and supports the substrate；Processing unit, It is configured around the substrate supporting component when from axis, and to the institute being located in circumferential direction on the curved surface of specific position State substrate implementation processing；Temperature-adjusting device carries out the temperature of the substrate before being supplied to the substrate supporting component It adjusts.
Be also possible to have: carrying device is made described by making the substrate from the specific position in a manner of Substrate is moved along the conveyance direction for transporting the substrate, the temperature-adjusting device, to from described in the substrate supporting component The upstream side of the conveyance direction for the substrate that specific position passes through carries out temperature adjusting.
It is also possible to the temperature-adjusting device and has medium regulating device, which makes through excess temperature tune The flow of media of section is to the space for transporting the substrate.
The curved surface for being also possible to the substrate supporting component is the 1st curved surface, and the temperature-adjusting device has: drawing Component is led, with the 2nd curved surface made of being bent from the parallel reference axis parallel with the axis with radii fixus, and makes the base A part of plate contacts the 2nd curved surface；Medium regulating device makes the flow of media adjusted through excess temperature to the guide portion Space around part.
It is also possible to the 1st medium supply unit and supplying temperature ratio that the temperature-adjusting device has supply high-temperature medium 2nd medium supply unit of the low cryogenic media of the high-temperature medium, the temperature-adjusting device make the high-temperature medium with it is described Cryogenic media mixing is circulated as the medium.
The curved surface for being also possible to the substrate supporting component is the 1st curved surface, and the temperature-adjusting device has: drawing Component is led, with the 2nd curved surface made of being bent from the parallel reference axis parallel with the axis with radii fixus, and makes the base A part of plate contacts the 2nd curved surface；Guide member temperature-adjusting device adjusts the temperature of the guide member.
The radius for being also possible to the 2nd curved surface is identical as the radius of the curved surface of the substrate supporting component.
It is also possible to have: the 1st pattern detection device comprising the 1st detection probe, the 1st detection probe is for detecting Specific pattern that is discrete or being successively formed on the substrate, the 1st detection probe are configured in the substrate supporting component Around；2nd pattern detection device comprising the 2nd detection probe, the 2nd detection probe are used to not visit with the 1st detection Specific pattern described in the position detection of needle overlapping, the 2nd detection probe are configured in following position: being able to detect and be located at by described The position of temperature-adjusting device and the specific pattern on the substrate before being conditioned temperature and being wound in curved surface；Control Device processed, the testing result based on the 1st pattern detection device and the 2nd pattern detection device, to the temperature tune Regulating device is controlled.
Be also possible to have: temperature measuring device measures the temperature of the substrate；Control device is based on The testing result of the temperature measuring device controls the temperature-adjusting device.
It is also possible to the processing unit and has the multiplying power tune being adjusted to the multiplying power of projection image included by exposure light Engagement positions, the processing unit are the dresses for implementing the treatment with irradiation of the exposure light to the substrate for being located at the specific position It sets；The multiplying power adjusts device, according to the output by the 1st pattern detection device and the 2nd pattern detection device The multiplying power of the projection image is corrected in the variation of the specific pattern found out.
It is also possible to the picture offset adjustment that the processing unit has the positional shift for making projection image included by exposure light Device, it is described as excursion adjusting device is according to the output by the 1st pattern detection device and the 2nd pattern detection device And the variation of the specific pattern found out, make the positional shift of the picture.
Be also possible to be also equipped with: substrate supporting component temperature-adjusting device, to the temperature of the substrate supporting component into Row is adjusted.
2nd scheme according to the present invention, provides a kind of manufacturing method, uses the substrate of the 1st scheme of the invention Processing unit and pattern is formed on substrate.
3rd scheme according to the present invention, provides a kind of manufacturing method comprising: an edge substrate supporting portion part The bearing surface made of length direction bending carries out a part of the length direction of the substrate of flexible strip Bearing transports the substrate along the length direction with defined speed on one side；In the bearing surface of the substrate supporting component The length direction specific position, the pattern for constituting the electronic component is transferred to the institute for being supported in the bearing surface It states on substrate；Temperature control is carried out, so as to be located at the upstream side of conveyance direction relative to the bearing surface of the substrate supporting component The substrate temperature with the bearing surface the substrate temperature become defined difference.
Invention effect
According to the solution of the present invention, in substrate board treatment and manufacturing method, it is able to suppress the flexible of substrate, is mentioned The precision of high disposal.
Detailed description of the invention
Fig. 1 is the figure for indicating the composition of device manufacturing system of the 1st embodiment.
Fig. 2 is the schematic diagram for indicating the overall structure of processing unit of the first embodiment (exposure device).
Fig. 3 is the schematic diagram for indicating the configuration of illumination region and view field in Fig. 2.
Fig. 4 is the schematic diagram for indicating the composition of projection optical system of the processing unit (exposure device) suitable for Fig. 2.
Fig. 5 is the perspective view of the rotating cylinder of the processing unit (exposure device) suitable for Fig. 2.
Fig. 6 is for illustrating between the detection probe and reading device suitable for the processing unit (exposure device) of Fig. 2 The perspective view of relationship.
Fig. 7 is the dial disc of the first embodiment observed along rotation centerline direction for illustrating to read The figure of the position of device.
Fig. 8 is to illustrate thermostatic explanatory diagram of the first embodiment.
Fig. 9 is the explanatory diagram for illustrating an example of alignment mark.
Figure 10 is saying of being schematically illustrated of an example of the variation to alignment mark caused by flexible by substrate Bright figure.
Figure 11 is to indicate the step of being modified to the processing of processing unit of the first embodiment (exposure device) The flow chart of one example.
Figure 12 is the schematic diagram for indicating the overall structure of processing unit of the second embodiment (exposure device).
Figure 13 is the schematic diagram for indicating the overall structure of processing unit of the third embodiment (exposure device).
Figure 14 is the schematic diagram for indicating the overall structure of processing unit of the fourth embodiment (exposure device).
Figure 15 is the schematic diagram for indicating the overall structure of processing unit of the fifth embodiment (exposure device).
Figure 16 is the schematic diagram for indicating the overall structure of processing unit of the sixth embodiment (exposure device).
Figure 17 is the stream indicated using the manufacturing method for having processing unit of the first embodiment (exposure device) Cheng Tu.
Specific embodiment
Mode for carrying out the present invention (embodiment) is described in detail referring to attached drawing.The present invention is not by following Embodiment documented by content limit.In addition, the constituent element recorded below includes that those skilled in the art are readily apparent that And substantially the same technology.In addition, the constituent element recorded below can be appropriately combined.In addition, not departing from ancestor of the present invention Also various constituent elements can be omitted, replace or changed in the range of purport.For example, in the following embodiments, as member Part is illustrated the case where manufacture flexible display, but not limited to this.Circuit board, semiconductor can be also manufactured as element Substrate etc..
(the 1st embodiment)
In the 1st embodiment, the substrate board treatment for implementing exposure-processed to substrate is exposure device.In addition, exposure Device is assembled into be implemented various processing and manufactures in the device manufacturing system of element to the substrate after exposure.Firstly, to element Manufacture system is illustrated.
< device manufacturing system >
Fig. 1 is the figure for indicating the composition of device manufacturing system of the 1st embodiment.Device manufacturing system 1 shown in FIG. 1 is Manufacture the production line (flexible display production line) of the flexible display as element.As flexible display, for example, it is organic EL display etc..The device manufacturing system 1 is to be sent out to be somebody's turn to do with roller FR1 from the supply that flexible substrate P is wound into roll Substrate P, and after continuously implementing various processing to the substrate P of submitting, will treated that substrate P is rolled up as flexible element It is around in recycling roller FR2, so-called roll-to-roll (Roll to Roll) mode.In the device manufacturing system 1 of the 1st embodiment In, the substrate P for showing the sheet material as film-form is sent out from supply roller FR1, and the substrate sent out from supply with roller FR1 P successively pass through n platform processing unit U1, U2, U3, U4, U5 ... example of the Un until being wound in recycling roller FR2.It is first First, the substrate P of the process object as device manufacturing system 1 is illustrated.
Substrate P is for example using resin film, the foil (foil) formed by metal or alloys such as stainless steels etc..As resin The material of film, such as include polyvinyl resin, acrylic resin, polyester resin, Ethylene Vinyl Ester Copolymers resin, polychlorostyrene second Olefine resin, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate One of ester resin is two or more.
Preferably, substrate P select thermal expansion coefficient be not significantly greater material so that can actually ignore because The deflection for being heated and generating in the various processing implemented to substrate P.Thermal expansion coefficient for example can be by by inorganic filler It is mixed in resin film and is set as smaller than threshold value corresponding with technological temperature etc..Inorganic filler for example can be titanium oxide, Zinc oxide, aluminium oxide, silica etc..In addition, substrate P can be through manufactures such as float method with a thickness of 100 μm or so of pole The individual layers of thin glass are also possible to paste laminated body made of above-mentioned resin film, foil etc. on the very thin glass.
The substrate P constituted in this way is wound into roll into roller FR1, the supply are installed in member with roller FR1 for the supply Part manufacture system 1.The device manufacturing system 1 of supply roller FR1 is installed, the substrate P sent out from supply roller FR1 is repeated to hold Row is for manufacturing the various processing an of element.Therefore, substrate P that treated becomes the state of multiple element connection.That is Become the substrate of more than one piece processing simultaneously with the substrate P that roller FR1 is sent out from supply.In addition, substrate P can be and pre- first pass through regulation Pre-treatment its surface is modified and the component that activates it, alternatively, being also possible to be formed on the surface for essence The component of close patterned fine next door construction (sag and swell).
Substrate P that treated is wound into roll and is recovered as recycling roller FR2.Recycling is installed on not with roller FR2 The cutter device of diagram.Be equipped with recycling roller FR2 cutter device will treated substrate P by each element divisions (cutting) And become multiple element.The size of substrate P is, for example, that the size of width direction (direction as short side) is 10cm~2m left The right side, the size of length direction (direction as long side) are 10m or more.In addition, the size of substrate P is not limited to above-mentioned size.
Next, referring to Fig.1, being illustrated to device manufacturing system 1.In Fig. 1, X-direction, Y-direction and Z-direction are positive The rectangular coordinate system of friendship.X-direction is the direction in the horizontal plane linking supply roller FR1 and recycling roller FR2, is in Fig. 1 Left and right directions.Y-direction is direction orthogonal with X-direction in the horizontal plane, is the front-rear direction in Fig. 1.Y-direction is supplied with use Roller FR1 and the recycling axis direction of roller FR2.The side Z is to vertical direction, is the up and down direction in Fig. 1.
Device manufacturing system 1 have supplying substrate P substrate feeding device 2, to by substrate feeding device 2 supply Lai base Plate P implements processing unit U1~Un of various processing, is recycled to the substrate P for implementing processing by processing unit U1~Un Substrate recyclable device 3 and the host control device 5 that each device of device manufacturing system 1 is controlled.
Supply roller FR1 can be revolvably installed in substrate feeding device 2.Substrate feeding device 2 has the confession from installation To the marginal position of the position on the driven roller DR1 for sending out substrate P with roller FR1 and the width direction (Y-direction) for adjusting substrate P Controller EPC1.Driven roller DR1 rotates while clamping the front and back sides of substrate P, by substrate P from supply roller FR1 direction Recycling is sent out with the conveyance direction of roller FR2, and substrate P is thus supplied processing unit U1Un.At this moment, marginal position controller EPC1, so that substrate P is located at ± more than ten μm relative to target position in the position of the end (edge) of width directionTens μm or so in the range of mode move substrate P in the direction of the width, to correct in the width direction (Y-direction) of substrate P Position.
Recycling roller FR2 can be revolvably installed on substrate recyclable device 3.Substrate recyclable device 3 will be with after handling Substrate P pull to the side recycling roller FR2 driven roller DR2 and adjust substrate P width direction (Y-direction) on position side Edge positioner EPC2.Substrate recyclable device 3 is rotated while clamping the front and back sides of substrate P by driven roller DR2, will Substrate P pulls to conveyance direction and rotates recycling roller FR2, thus winds substrate P.At this moment, marginal position controller EPC2 It is constituted in the same manner as marginal position controller EPC1, corrects the position in the width direction of substrate P, in order to avoid the width side of substrate P To end (edge) generate unevenness in the direction of the width.
Processing unit U1 is the surface that photonasty functional liquid is coated on to the substrate P come from the supply of substrate feeding device 2 Applying device.As photonasty functional liquid, resist, photonasty silane coupling agent material, UV solidified resin can be used for example Liquid etc..Processing unit U1 is successively arranged applying mechanism Gp1 and drier Gp2 since the upstream side of the conveyance direction of substrate P. Applying mechanism Gp1 has the roller platen R1 and the application roll R2 opposite with roller platen R1 for winding substrate P.Applying mechanism Gp1 exists The substrate P being supplied to is wound in the state of roller platen R1, clamps substrate P by roller platen R1 and application roll R2.Moreover, coating Mechanism Gp1 moves substrate P along conveyance direction on one side, passes through application roll on one side by rotating roller platen R1 and application roll R2 R2 applies photonasty functional liquid.Drier Gp2 blows out the dry air such as hot wind or dry air, removes photonasty functional liquid Included in solute (solvent or moisture), and keep the substrate P coated with photonasty functional liquid dry, thus in substrate P Form photonasty functional layer.
Processing unit U2 is heating device, will be from order to stablize the photonasty functional layer on the surface for being formed in substrate P The substrate P that reason device U1 is moved is heated to predetermined temperature (for example, tens DEG C~120 DEG C or so).Processing unit U2 is from substrate P The upstream side of conveyance direction start to be successively arranged heating chamber HA1 and cooling chamber HA2.Heating chamber HA1 is set inside it There are multiple rollers and multiple air turning-bars (air turn bar), multiple rollers and multiple air turning-bars constitute the conveying of substrate P Path.Multiple rollers are arranged in a manner of the back side of rotating contact substrate P, and multiple air turning-bars are set to base with not contact condition The surface side of plate P.Multiple rollers and multiple air turning-bars are the transport paths in order to lengthen substrate P, and form removing for snake shape Send the configuration in path.The substrate P passed through out of heating chamber portion HA1, the transport path of edge snake shape is by conveying one side quilt It is heated to predetermined temperature.Cooling chamber HA2 makes substrate P be cooled to environment temperature, so that the base after heating chamber portion HA1 heating The temperature of plate P is consistent with the environment temperature of process (processing unit U3) later.Cooling chamber HA2 is equipped with multiple rollers inside it, In the same manner as heating chamber HA1, multiple rollers are the transport paths for lengthening substrate P, and form the configuration of the transport path of snake shape. The substrate P passed through out of cooling chamber HA2, the transport path of edge snake shape is transported to be cooled on one side.In cooling chamber Downstream side in the conveyance direction of HA2 is equipped with driven roller DR3, driven roller DR3 is clamped on one side pass through from cooling chamber HA2 after Substrate P rotates on one side, thus supplies substrate P towards processing unit U3.
Processing unit (substrate board treatment) U3 is exposure device, forms thoughts to from the surface that processing unit U2 supply comes The pattern of the circuit of display or wiring etc. is carried out projection exposure (transfer) by substrate (sensitive substrate) P of photosensitiveness functional layer. Detailed content is reserved for later described, and processing unit U3 irradiates illuminating bundle to cylinder light shield (light shield) DM of infiltration type or reflection-type, Projected light beam projection exposure obtained from illuminating bundle is penetrated cylinder light shield (light shield) DM or is reflected by it is in substrate P.Place Reason device U3, which has, send the substrate P come from processing unit U2 supply to the driven roller DR4 in the downstream side of conveyance direction and adjustment The marginal position controller EPC of position in the width direction (Y-direction) of substrate P.Driven roller DR4 clamps the table of substrate P on one side Back two sides rotates on one side, and substrate P is sent to the downstream side of conveyance direction, thus supplies substrate P towards exposure position.Edge Positioner EPC is constituted in the same manner as marginal position controller EPC1, corrects the position in the width direction of substrate P, so that The width direction of substrate P on exposure position becomes target position.Processing unit U3 adjusts edge by temperature-adjusting device 60 After the temperature of the substrate P of positioner EPC supply, substrate P is transported by driven roller DR5.
In addition, processing unit U3 has buffer part DL, buffer part DL, which has, is assigning slackness to the substrate P after exposure In the state of, substrate P is sent to two groups of driven rollers DR6, DR7 in the downstream side of conveyance direction.Two groups of driven rollers DR6, DR7 are in base It is spaced and configures as defined in being separated by the conveyance direction of plate P.Driven roller DR6 clamps the upstream side of the substrate P of conveying and rotates, and drives Dynamic roller DR7 clamps the downstream side of the substrate P of conveying and rotates, and thus supplies substrate P towards processing unit U4.At this moment, substrate P Due to being endowed slackness, can absorb than driven roller DR7 by conveyance direction downstream side caused by transport speed Variation, the influence caused by the variation so as to eliminate conveying speed to the exposure-processed of substrate P.In addition, being filled in processing It sets in U3, it is (right in order to relatively be aligned the picture of a part of the mask pattern of cylinder light shield (light shield) DM and substrate P It is quasi-), and it is equipped with aligming microscope AMG1, the AMG2 for the alignment mark that detection is previously formed in substrate P.
Processing unit U4 is wet type processing device, to from the substrate P after the exposure that processing unit U3 is moved, is carried out wet Development treatment, electroless plating processing of formula etc..Processing unit U4 includes 3 along vertical direction (Z-direction) layering inside it A treatment trough BT1, BT2, BT3 and the multiple rollers for transporting substrate P.Multiple rollers with become substrate P successively from 3 treatment trough BT1, The inside of BT2, BT3 transport path by way of configure.Downstream side in the conveyance direction for the treatment of trough BT3 is equipped with and drives Dynamic roller DR8, driven roller DR8 on one side clamp from treatment trough BT3 pass through after substrate P while rotate, thus by substrate P towards handling Device U5 supply.
Though illustration omitted, processing unit U5 is drying device, is done to the substrate P moved from processing unit U4 It is dry.Moisture content accompanying by the substrate P through wet processed in processing unit U4 is adjusted to defined water by processing unit U5 Divide content.The substrate P dried by processing unit U5 is transported to processing unit Un by several processing units.Moreover, After being handled with processing unit Un, substrate P is rolled by the recycling of substrate recyclable device 3 with roller FR2.
Host control device 5 unites to substrate feeding device 2, substrate recyclable device 3 and multiple processing unit U1~Un Include control.5 control base board feedway 2 of host control device and substrate recyclable device 3, and make substrate P from substrate feeding device 2 It is transported towards substrate recyclable device 3.In addition, host control device 5 makes the conveying of substrate P synchronous on one side, multiple places are controlled on one side Device U1~Un is managed, thereby executing the various processing to substrate P.
< exposure device (substrate board treatment) >
Next, referring to Figure 2 to Figure 4, to the exposure device (processing substrate as processing unit U3 of the 1st embodiment Device) composition be illustrated.Fig. 2 is the overall structure for indicating the exposure device (substrate board treatment) of the 1st embodiment Figure.Fig. 3 is the figure of the illumination region for indicating exposure device shown in Fig. 2 and the configuration of view field.Fig. 4 is indicated shown in Fig. 2 Exposure device projection optical system composition figure.
As shown in Fig. 2, processing unit U3 includes exposure device (processing mechanism) EX, carrying device 9 and temperature-adjusting device 60.Exposure device EX passes through 9 supplying substrate P of carrying device (sheet material, film etc.).Exposure device EX is so-called scan exposure dress It sets, makes the rotation of cylinder light shield DM driving synchronous with the transmission of flexible substrate P on one side, be via projection multiplying power on one side etc. The projection optical system PL (PL1~PL6) of (× 1) projects the picture for being formed in the pattern on cylinder light shield DM to substrate P again.This Outside, the Y-axis of rectangular coordinate system XYZ is set as the rotation centerline AX1 with the 1st cartridge unit 21 by exposure device EX shown in Fig. 2 In parallel.Similarly, the Y-axis of rectangular coordinate system XYZ is set as the rotation with the 2nd cartridge unit 22 as rotating cylinder by exposure device EX It is parallel to turn center line AX2.
As shown in Fig. 2, exposure device EX has light shield holding meanss 12, lighting mechanism IU, projection optical system PL and control Device 14 processed.Exposure device EX makes the cylinder light shield DM moving in rotation being maintained in light shield holding meanss 12, and passes through conveying Device 9 transports substrate P.Lighting mechanism IU is by illuminating bundle EL1 with uniform brightness to being maintained in light shield holding meanss 12 A part (illumination region IR) of cylinder light shield DM illuminated.Projection optical system PL is by the lighting area on cylinder light shield DM The picture projection of pattern in the IR of domain is into a part (view field PA) of the substrate P transported by carrying device 9.With cylinder light The movement of DM is covered, the position being configured on the cylinder light shield DM of illumination region IR can change, in addition, with the shifting of substrate P Dynamic, the position being configured in the substrate P of view field PA can change.Defined pattern (light on cylinder light shield DM as a result, Cover pattern) picture be projected in substrate P.Control device 14 controls each section of exposure device EX, and each section is made to execute processing.Separately Outside, in the present embodiment, control device 14 controls carrying device 9.
In addition, control device 14 can be said elements manufacture system 1 be all together the upper control for controlling multiple processing units Device 5 processed it is some or all.In addition, control device 14 is also possible to be generalized control device 5 controls and upper control The different device of device 5 processed.Control device 14 is for example comprising computer system.Computer system for example comprising CPU and various is deposited The hardware such as reservoir or OS, peripheral equipment.The process of the movement of each section of processing unit U3 is stored in calculating in the form of program In the storage unit for the recording medium that machine can be read, the program is read and executed by computer system, to carry out various processing.Meter In the case that calculation machine system can be connect with internet or LAN system, also include homepage provide environment (or display ring Border).In addition, computer-readable recording medium includes the removable mediums such as floppy disk, photomagneto disk, ROM, CD-ROM, is built in The storage devices such as the hard disk in computer system.Computer-readable recording medium also includes: such as via internet network And/or the communication line in the case where the communication lines such as telephone line transmission program is such, dynamically keeps program in a short time Medium；As the volatile memory of the inside computer system for becoming server or client in this case, by journey The medium of sequence holding certain time.In addition, program can be the program of the part of functions for realizing processing unit U3, it can also Be by be reported in computer system suite and can be realized processing unit U3 function program.It is upper Control device 5 can be realized in the same manner as control device 14 using computer system.
As shown in Fig. 2, light shield holding meanss 12 have: keeping the 1st cartridge unit 21 of cylinder light shield DM；Support the 1st canister portion The guide reel 23 of part 21；According to the control instruction of control device 14, the 1st driving portion 26 drives the driven roller 24 of the 1st cartridge unit 21； And the 1st detector 25 of the position of the 1st cartridge unit 21 of detection.
1st cartridge unit 21 is that have from the rotation centerline AX1 as regulation axis (hereinafter also referred to as the 1st central axis AX1) With the cylinder part of the curved curved surface of radii fixus, around rule System of Rotating about Fixed Axis.1st cartridge unit 21 forms the 1st face P1, the 1st face P1 Configured with the illumination region IR on cylinder light shield DM.In the present embodiment, the 1st face P1 include make line segment (bus) around with the line Face (hereinafter referred to as barrel surface) made of axis (the 1st central axis AX1) rotation of Duan Pinghang.Barrel surface is, for example, the periphery of cylinder Face, outer peripheral surface of cylinder etc..1st cartridge unit 21 is made of such as glass or quartz etc., is the cylindrical shape with certain wall thickness, Outer peripheral surface (barrel surface) forms the 1st face P1.That is, in the present embodiment, the illumination region IR on cylinder light shield DM bend to from Rotation centerline AX1 has the cylinder planar of radii fixus r1.In this way, the 1st cartridge unit 21 has from the rotation as regulation axis Center line AX1 is with the curved curved surface of radii fixus.Moreover, 21 driven rolls 24 of the 1st cartridge unit drive, it can be around as regulation axis Rotation centerline AX1 rotation.
Cylinder light shield DM as infiltration type planar light shield and be fabricated to, planar light shield of the infiltration type is for example It is by light shield layers such as chromium in a face of the very thin glass plate (such as 100~500 μm of thickness) of the good strip of flatness Made of upper formation pattern.Light shield holding meanss 12 make cylinder light shield DM copy the curved surface of outer peripheral surface of the 1st cartridge unit 21 and curved Song uses in the state that winding (stickup) is in the curved surface.Cylinder light shield DM has the non-formation region of pattern being unpatterned, And the 1st cartridge unit 21 is installed in the non-formation region of pattern.Cylinder light shield DM can be dismantled relative to the 1st cartridge unit 21 (release)。
In addition it is also possible to instead of being made of cylinder light shield DM very thin glass plate and cylinder light shield DM being wound in by transparent The structure for the 1st cartridge unit 21 that cylinder base material is formed, but in the outer peripheral surface of the 1st cartridge unit 21 formed by transparent cylinder base material On, directly describe and forms the mask pattern realized based on light shield layers such as chromium and make its integration.In this case, the 1st canister portion Bearing part of the part 21 also as the pattern of cylinder light shield DM functions.
1st detector 25 can be detected optically by the rotation position of the 1st cartridge unit 21, such as by structures such as rotary encoders At.1st detector 25 will indicate the information of the rotation position of the 1st detected cartridge unit 21, such as from aftermentioned coding Diphase signal of device read head etc. is exported to control device 14.The 1st driving portion 26 comprising actuators such as electric motors is according to from control The control signal that device 14 processed inputs, to adjust torque and rotation speed for rotating driven roller 24.Control device 14 is logical It crosses the testing result based on the 1st detector 25 and controls the 1st driving portion 26, to control the rotation position of the 1st cartridge unit 21.Moreover, Control device 14 controls the rotation position for the cylinder light shield DM being maintained on the 1st cartridge unit 21 and a side or double for rotation speed Side.
2nd cartridge unit 22 is that have from the rotation centerline AX2 as regulation axis (hereinafter also referred to as the 2nd central axis AX2) It is the rotating cylinder around rule System of Rotating about Fixed Axis with the cylinder part of the curved curved surface of radii fixus (the 1st curved surface).2nd cartridge unit, 22 shape At the 2nd face (bearing surface) P2, the 2nd face (bearing surface) P2 will be projected comprising the imaging beam from projection optical system PL A part bearing including view field PA in substrate P is arc-shaped (cylindrical shape).In addition, the 2nd cartridge unit 22 be by from The torque of the 2nd driving portion 36 supply comprising actuators such as electric motors and the driven roller DR5 that rotates.
In this way, the 2nd cartridge unit 22 is driven roller DR5, and the substrate branch of the substrate P as bearing exposure (processing) object Bearing portion part (baseplate carrier).That is, the 2nd cartridge unit 22 is also possible to a part of exposure device EX.Moreover, 22 energy of the 2nd cartridge unit Enough rotation centerline AX2 (the 2nd central axis AX2) around the 2nd cartridge unit 22 rotate, and substrate P copies the periphery on the 2nd cartridge unit 22 Face (barrel surface) bends to cylinder planar, and view field PA is configured in a part of curved part.
In the present embodiment, it as shown in Fig. 2, when from the 2nd central axis AX2 of the 2nd cartridge unit 22, is thrown to reaching Chief ray in the imaging beam EL2 of shadow zone domain PA, passing through from each central point of view field PA, respectively across median plane P3 And it is configured on the position of angle, θ in the circumferential, and reach the 1st specific position PX1, the 2nd specific position PX2.Moreover, from rotation When turning center line AX2 observation, the specific position PX between the 1st specific position PX1 and the 2nd specific position PX2 is to be located at the The center in the region of the substrate P on the curved surface of 2 cartridge units 22 fifty-fifty exposed.
Carrying device 9 has driven roller DR4, the 2nd cartridge unit 22 (driven roller DR5), driven roller DR6.Carrying device 9 makes base Plate P is moved along the conveyance direction of conveying substrate P, so that substrate P is specific from the 1st specific position PX1, specific position PX and the 2nd Position PX2 passes through.2nd driving portion 36 rotates the 2nd cartridge unit 22 according to the control signal exported from control device 14, to adjust Torque.
In the present embodiment, the substrate P moved from the upstream of transport path to driven roller DR4 is via driven roller DR4 It is transported to temperature-adjusting device 60.Temperature-adjusting device 60 is adjusted according to the control signal exported from control device 14 to the 2nd The temperature of substrate P before the supply of cartridge unit 22.Substrate P after adjusting temperature via temperature-adjusting device 60 is by the 1st guide portion Part 31, the guidance of the 2nd guide member 32, and transported to the 2nd cartridge unit 22.Substrate P is supported in the surface of the 2nd cartridge unit 22, to The conveying of 3rd guide member 33.Via the substrate P of the 3rd guide member 33, transported to the downstream of transport path.In addition, the 2nd canister portion The rotation centerline AX2 of part 22 (driven roller DR5) is set as parallel with Y-axis with each rotation centerline of driven roller DR4, DR6.
Around the 2nd cartridge unit 22, configures the conveyance direction of restricted conveying substrate P and guide the 1st of substrate P to draw Lead component 31, the 2nd guide member 32 and the 3rd guide member 33.2nd cartridge unit 22 winds a part of substrate P, supports from substrate P starts to start to leave from the curved surface of the 2nd face P2 to substrate P with the in-position IA of the conveyance direction of the curved face contact of the 2nd face P2 Conveyance direction disengaging configuration OA until substrate P.2nd guide member 32 and the 3rd guide member 33, such as by along substrate The conveyance direction of P is mobile, to adjust the tension etc. for acting on substrate P in transport path.In addition, the 2nd guide member 32 and the 3rd draws Component 33 is led, such as is moved by the conveyance direction along substrate P, the above-mentioned of the periphery for being wound in the 2nd cartridge unit 22 can be adjusted In-position IA and disengaging configuration OA etc..In addition, carrying device 9, the 1st guide member 31, the 2nd guide member 32 and the 3rd guide As long as component 33 can along the view field PA of projection optical system PL transport substrate P, can suitably change carrying device 9, The composition of 1st guide member 31, the 2nd guide member 32 and the 3rd guide member 33.
2nd detector 35 is detected optically by the rotation position of the 2nd cartridge unit 22 such as constituting by rotary encoder.2nd Detector 35 will indicate the information of the rotation position of the 2nd detected cartridge unit 22 (for example, aftermentioned come from encoder head The diphase signal etc. of EN1, EN2, EN3, EN4, EN5) it exports to control device 14.Control device 14 is by being based on the 2nd detector 35 testing result, which controls the 2nd driving portion 36, makes 21 (cylinder light of the 1st cartridge unit to control the rotation position of the 2nd cartridge unit 22 Cover DM) and 22 synchronizing moving of the 2nd cartridge unit (synchronous rotary).In addition, the detailed composition about the 2nd detector 35 will be aftermentioned.
The exposure device EX of present embodiment has assumed that the exposure of the projection optical system PL of the so-called poly-lens mode of carrying Electro-optical device.Projection optical system PL has multiple projection groups that the picture of a part in the pattern to cylinder light shield DM is projected Part.For example, in the left side of median plane P3, along Y-direction, with fixed intervals configuration, there are three projecting subassembly (projection optics in Fig. 2 System) PL1, PL3, PL5, on the right side of median plane P3, also along Y-direction, with fixed intervals configuration, there are three projecting subassembly (projected lights System) PL2, PL4, PL6.
In the exposure device EX of this poly-lens mode, using scanning make by multiple projecting subassembly PL1~PL6 by End in the Y-direction in the region (view field PA1~PA6) of exposure overlaps, and thus projects the whole of desired pattern Body image.This exposure device EX has the advantage that the Y-direction size for making the pattern on cylinder light shield DM increases thus must In the case where so generating the necessity handled the biggish substrate P of the width of Y-direction, projection also need to be only added along Y-direction The component of component PL and the side lighting mechanism IU corresponding with projecting subassembly PL, therefore can easily cope with panel size The enlargement of (width of substrate P).
In addition, exposure device EX may not be poly-lens mode.For example, the size in the width direction of substrate P exists In a way in lesser situation etc., exposure device EX can also be by a projecting subassembly by the entire width of pattern As projection to substrate P.In addition, multiple projecting subassembly PL1~PL6 can project pattern corresponding with an element respectively.That is, exposing Electro-optical device EX can also concurrently project the pattern of multiple element by multiple projecting subassemblies.
The lighting mechanism IU of present embodiment has light supply apparatus 13 and lamp optical system.Lamp optical system have with Multiple (such as six) light fixture IL that multiple projecting subassembly PL1~PL6 are respectively correspondingly arranged along the y axis.Light source dress 13 are set such as comprising the solid light sources such as lamp source mercury vapor lamp or laser diode, light emitting diode (LED).Light supply apparatus Illumination light emitted by 13 is the open-wire line (g line, h line, i line) for example projected from lamp source, KrF excimer laser (wavelength Extreme ultraviolet lights (DUV light), the ArF excimer laser (wavelength 193nm) etc. such as 248nm).The photograph of the illumination light projected from light supply apparatus Degree is evenly distributed, such as is assigned via light guide members such as optical fiber to multiple light fixture IL.
Multiple light fixture IL separately include multiple optical components such as lens.It in the present embodiment, will be from light supply apparatus 13 project and are known as illuminating bundle EL1 from the light that any of multiple light fixture IL pass through.Multiple light fixture IL difference Including, for example, integrator optical system, cylindrical lenses, fly's-eye lens etc., pass through EL1 pairs of illuminating bundle of uniform Illumination Distribution Illumination region IR is illuminated.In the present embodiment, multiple light fixture IL are configured at the inside of cylinder light shield DM.Multiple photographs Bright component IL each illumination from the inside of cylinder light shield DM to the mask pattern on the outer peripheral surface for being formed in cylinder light shield DM respectively Region IR is illuminated.
Fig. 3 is the figure for indicating the configuration of illumination region IR and view field PA in present embodiment.In addition, in Fig. 3 Show the plan view (figure when illumination region IR on the cylinder light shield DM being configured on the 1st cartridge unit 21 from the side-Z The figure in the left side in 3) and be configured at from the side+Z in the substrate P on the 2nd cartridge unit 22 view field PA when plan view (figure on the right side in Fig. 3).Appended drawing reference Xs in Fig. 3 indicates the direction of rotation of the 1st cartridge unit 21 or the 2nd cartridge unit 22 (moving direction).
Multiple light fixture IL respectively carry out the 1st illumination region IR1 on cylinder light shield DM to the 6th illumination region IR6 Illumination.For example, the 1st light fixture IL illuminates the 1st illumination region IR1, the 2nd light fixture IL is to the 2nd illumination region IR2 It is illuminated.
1st illumination region IR1 is set as being illustrated along the region of the elongated trapezoidal shape of Y-direction, still, such as projection optics System (projecting subassembly) PL is such, in the case where forming the projection optical system of composition of intermediate image plane, in order at this The position configuration of intermediary image has the field stop plate of trapezoid-shaped openings, also can be set to the rectangular area comprising the trapezoid-shaped openings Domain.3rd illumination region IR3 and the 5th illumination region IR5 is respectively shape region identical with the 1st illumination region IR1, and along Y-axis Direction configures with vacating fixed intervals.In addition, the 2nd illumination region IR2 be about median plane P3 and with the 1st IR1 pairs of illumination region The region of the trapezoidal shape (or rectangle) of title.4th illumination region IR4 and the 6th illumination region IR6 be respectively and the 2nd lighting area The region of domain IR2 same shape, and configure with vacating fixed intervals along the y axis.
As shown in figure 3, in the 1st illumination region IR1 of circumferential observation along the 1st face P1 to each region of the 6th illumination region IR6 In the case where, so that the mode that the triangular part in the bevel edge portion of the illumination region of adjacent trapezoidal shape is overlapped (overlapping) configures.Therefore, Such as by the rotation of the 1st cartridge unit 21 from the 1st region A1 on the cylinder light shield DM that the 1st illumination region IR1 passes through, and it is logical Cross the rotation of the 1st cartridge unit 21 and from some weight of the 2nd region A2 on the cylinder light shield DM that the 2nd illumination region IR2 passes through It is multiple.
In the present embodiment, cylinder light shield DM includes: to form figuratum pattern forming region A3 and be unpatterned The non-formation region A4 of pattern.The non-formation region A4 of the pattern is configured in a manner of surrounding pattern forming region A3 in frame shape, Characteristic with masking illuminating bundle EL1.The edge with the rotation of the 1st cartridge unit 21 the pattern forming region A3 of cylinder light shield DM Moving direction Xs is mobile, and each section region in Y direction in pattern forming region A3 is shone from the 1st illumination region IR1 to the 6th Any of area pellucida domain IR6 passes through.In other words, the 1st illumination region IR1 to the 6th illumination region IR6 is with by pattern forming region The mode of entire width covering in the Y direction of A3 configures.
As shown in Fig. 2, the multiple projecting subassembly PL1~PL6 arranged along the y axis respectively with the 1st to the 6th light fixture IL It corresponds to one to one, by the part of the cylinder light shield DM shown in the illumination region IR illuminated by corresponding light fixture The picture of pattern, projection to each view field PA in substrate P.
For example, the 1st projecting subassembly PL1 is corresponding with the 1st light fixture IL, the illuminated by the 1st light fixture IL the 1st is shone The picture of the pattern of cylinder light shield DM in area pellucida domain IR1 (referring to Fig. 3), projection to the 1st view field PA1 in substrate P.3rd Projecting subassembly PL3, the 5th projecting subassembly PL5 are corresponding with the 3rd light fixture IL, the 5th light fixture IL respectively.3rd projecting subassembly PL3 and the 5th projecting subassembly PL5 are configured when from Y direction in the position being overlapped with the 1st projecting subassembly PL1.
In addition, the 2nd projecting subassembly PL2 is corresponding with the 2nd light fixture IL, the illuminated by the 2nd light fixture IL the 2nd is shone The picture of the pattern of cylinder light shield DM in area pellucida domain IR2 (referring to Fig. 3), projection to the 2nd view field PA2 in substrate P.2nd Projecting subassembly PL2 configured when from Y direction across median plane P3 and with the 1st symmetrical position projecting subassembly PL1.
4th projecting subassembly PL4, the 6th projecting subassembly PL6 respectively with the 4th light fixture IL, the 6th light fixture IL accordingly Configuration, the 4th projecting subassembly PL4 and the 6th projecting subassembly PL6 configured when from Y direction with the 2nd projecting subassembly PL2 The position of coincidence.
It, will be from each light fixture IL of lighting mechanism IU to reaching on cylinder light shield DM in addition, in the present embodiment Light in each illumination region IR1~IR6 is set as illuminating bundle EL1.In addition, will by with shown in each illumination region IR1~IR6 Each projecting subassembly PL1~PL6 is incident to after the corresponding intensity distribution modulation of the partial pattern of existing cylinder light shield DM and to reaching Light in each view field PA1~PA6, is set as imaging beam EL2.Moreover, as shown in Fig. 2, from the 2nd of the 2nd cartridge unit 22 Central axis AX2 observe when, it is into the imaging beam EL2 reached in each view field PA1~PA6, from view field PA1~ The chief ray that each central point of PA6 passes through, the position (certain bits of angle, θ are arranged respectively at across median plane P3 in the circumferential It sets).
As shown in figure 3, the picture of the pattern in the 1st illumination region IR1 is projected onto the 1st view field PA1, the 3rd lighting area The picture of pattern in the IR3 of domain is projected onto the 3rd view field PA3, and the picture of the pattern in the 5th illumination region IR5 is projected onto the 5th View field PA5.In the present embodiment, the 1st view field PA1, the 3rd view field PA3 and the 5th view field PA5 are along Y Axis direction is that the mode of a column configures side by side.
In addition, the picture of the pattern in the 2nd illumination region IR2 is projected onto the 2nd view field PA2.In the present embodiment, 2nd view field PA2 is symmetrically configured about median plane P3 with the 1st view field PA1 when from Y direction.In addition, The picture of pattern in 4th illumination region IR4 is projected onto the 4th view field PA4, the picture quilt of the pattern in the 6th illumination region IR6 It projects to the 6th view field PA6.In the present embodiment, the 2nd view field PA2, the 4th view field PA4 and the 6th projected area Domain PA6 is configured in a manner of arranging side by side for one along the y axis.
1st view field PA1 to the 6th view field PA6 is configured as follows respectively: being seen in the circumferential direction along the 2nd face P2 In the case where examining, adjacent view field's (odd number and even number) is each other on the direction parallel with the 2nd central axis AX2 End (trapezoidal triangular portions) be overlapped.Thus, for example logical from the 1st view field PA1 by the rotation of the 2nd cartridge unit 22 The 3rd region A5 in the substrate P crossed, with the rotation by the 2nd cartridge unit 22 from the substrate P that the 2nd view field PA2 passes through The 4th region A6 some repetition.The setting such as respective shape of the 1st view field PA1 and the 2nd view field PA2 are as follows: make Light exposure in 3rd region A5 and the 4th duplicate region region A6 and the light exposure in unduplicated region are substantially the same.And And the 1st view field PA1 to the 6th view field PA6 with entire in the Y-direction for the exposure area A7 that will be exposed in substrate P The mode of width covering configures.
Next, illustrating the detailed composition of the projection optical system PL of present embodiment referring to Fig. 4.In addition, in this implementation In mode, the 2nd projecting subassembly PL2 to the 5th projecting subassembly PL5 is respectively composition identical with the 1st projecting subassembly PL1.Therefore, with The composition of 1st projecting subassembly PL1 illustrates projection optical system PL for representative, omits the 2nd projecting subassembly PL2 to the 5th projection group The respective explanation of part PL5.
1st projecting subassembly PL1 shown in Fig. 4 has: the 1st optical system 41 makes to be configured at the 1st illumination region IR1's The picture of the pattern of cylinder light shield DM is imaged on intermediate image plane P7；2nd optical system 42 forms the 1st optical system 41 Intermediary image at least part in the 1st view field PA1 of substrate P reimaging；With the 1st field stop 43, it is configured at The intermediate image plane P7 formed for intermediary image.
In addition, the 1st projecting subassembly PL1 has: focusing amendment optical component 44, as offset correction optical component 45, rotation Correction mechanism 46 and multiplying power amendment optical component 47.Focusing amendment optical component 44 is to the light shield being formed in substrate P The focus adjustment means that the focus state of pattern image (hereinafter referred to as projection image) is micro-adjusted.In addition, as offset correction optics Component 45 be make projection image in image planes pettiness lateral shift excursion adjusting device.Multiplying power amendment optical component 47 is pair The multiplying power of projection image carries out the modified multiplying power of pettiness and adjusts device.Rotation correction mechanism 46 is to revolve projection image's pettiness in image planes The excursion adjusting device turned.
The imaging beam EL2 of pattern from cylinder light shield DM is projected from the 1st illumination region IR1 along normal direction (D1), From amendment optical component 44 is focused by being incident to as offset correction optical component 45.Through as offset correction optical component 45 Imaging beam EL2 afterwards by the element as the 1st optical system 41 the 1st deflection component 50 the 1st reflecting surface (plane mirror) p4 Reflection from the 1st lens group 51 by being reflected by the 1st concave mirror 52, and passes through from the 1st lens group 51 by the 1st deflection again 2nd reflecting surface (plane mirror) p5 of component 50 reflects, and is incident to the 1st field stop 43.After passing through from the 1st field stop 43 Imaging beam EL2 is reflected by the 3rd reflecting surface (plane mirror) p8 of the 2nd deflection component 57 of the element as the 2nd optical system 42, From the 2nd lens group 58 by being reflected by the 2nd concave mirror 59, and pass through again from the 2nd lens group 58 by the 2nd deflection component 57 The 4th reflecting surface (plane mirror) p9 reflection, and be incident to multiplying power amendment optical component 47.From multiplying power amendment optical component 47 The imaging beam EL2 of injection is incident to the 1st view field PA1 in substrate P, the pattern shown in the 1st illumination region IR1 It projects as equimultiple (× 1) to the 1st view field PA1.
The radius of cylinder light shield DM shown in Fig. 2 is set as radius r1, the substrate P on the 2nd cartridge unit 22 will be wound in The radius on cylindric surface is set as radius r2, in the case where making radius r1 and radius r2 is equal, each projecting subassembly PL1~ The chief ray of the imaging beam EL2 of the light shield side of PL6 tilts in a manner of by from the rotation centerline AX1 of cylinder light shield DM, But its inclination angle is identical as tiltangleθ (being ± θ relative to median plane P3) of the chief ray of the imaging beam EL2 of substrate-side.
The 3rd reflecting surface p8 and the 2nd optical axis AX4 angulation θ 3 of 2nd deflection component 57 and the 1st deflection component 50 2nd reflecting surface p5 and the 1st optical axis AX3 angulation θ 2 are substantially the same.In addition, the 4th reflecting surface p9 of the 2nd deflection component 57 With the 1st reflecting surface p4 and the 1st optical axis AX3 angulation θ 1 of the 2nd optical axis AX4 angulation θ 4 and the 1st deflection component 50 It is substantially the same.In order to provide above-mentioned tiltangleθ, make the 1st reflecting surface p4 of the 1st deflection component 50 shown in Fig. 4 relative to 1 to 45 ° of the angle, θ of 1st optical axis AX3 only small Δ θ 1, and make the 4th reflecting surface p9 of the 2nd deflection component 57 relative to the 2nd optical axis 4 to 45 ° of the angle, θ of AX4 only small Δ θ 4.Δ θ 1 and Δ θ 4 is set as θ/2 Δ θ 1=Δ θ 4=relative to angle, θ shown in Fig. 2 Relationship.
Fig. 5 is the perspective view of the rotating cylinder of the processing unit (exposure device) suitable for Fig. 2.Fig. 6 is for illustrating to be applicable in In the perspective view of the relationship of the detection probe and reading device of the processing unit (exposure device) of Fig. 2.Fig. 7 is for illustrating revolving Turn the explanatory diagram of the position of reading device when the center line side AX2 looks up dial disc SD of the first embodiment. In addition, for convenience, only illustrating the 2nd view field PA4 of view field PA2~the 4th in Fig. 5, the 1st projected area being omitted The diagram of domain PA1, the 5th view field PA5, the 6th view field PA6.
2nd detector 35 shown in Fig. 2 is the component for being detected optically by the rotation position of the 2nd cartridge unit 22, includes Gao Zhen Dial disc (scale features) SD of circularity and encoder head EN1, EN2, EN3, EN4, EN5 as reading device.
Dial disc SD is fixed on the end of 2nd cartridge unit 22 orthogonal with the rotary shaft ST of the 2nd cartridge unit 22.Therefore, Dial disc SD integrally rotates together with rotary shaft ST around rotation centerline AX2.It carves and sets on the outer peripheral surface of dial disc SD There is such as scale (grid) to be used as scale portion GP.Scale portion GP is annularly arranged along the circumferential direction that the 2nd cartridge unit 22 rotates, and with 2nd cartridge unit 22 rotates around rotary shaft ST (the 2nd central axis AX2) together.Encoder head EN1, EN2, EN3, EN4, EN5 is configured at around scale portion GP when from rotary shaft ST (the 2nd central axis AX2).Encoder head EN1, EN2, EN3, EN4, EN5 and scale portion GP are oppositely disposed, and can read scale portion GP in a non-contact manner.In addition, encoder head EN1, EN2, EN3, EN4, EN5 are configured at the different location in the circumferential direction of the 2nd cartridge unit 22.
Encoder head EN1, EN2, EN3, EN4, EN5 are the changes of the displacement to the tangential direction (in the face XZ) of scale portion GP The dynamic reading device with measurement sensitivity (detection sensitivity).As shown in figure 5, with setting rhumb line Le1, Le2, Le3, Setting orientation (the XZ centered on rotation centerline AX2 of Le4, Le5 presentation code device read head EN1, EN2, EN3, EN4, EN5 Angle direction in face) in the case where, as shown in fig. 7, be arranged rhumb line Le1, Le2 relative to median plane P3 become angle ± θ ° mode configuration code device read head EN1, EN2.In addition, in the present embodiment, such as angle, θ is 15 °.
Projecting subassembly PL1~PL6 shown in Fig. 4 is that substrate P is set as to object to be treated and implements irradiation light to substrate P Treatment with irradiation exposure device EX processing unit.Exposure device EX makes the key light of 2 imaging beam EL2 relative to substrate P Line is incident to substrate P.Projecting subassembly PL1, PL3, PL5 are the 1st processing unit, and projecting subassembly PL2, PL4, PL6 are the 2nd processing unit, Become each position on the chief ray incident to substrate P of 2 imaging beam EL2 relative to substrate P substrate P is implemented to irradiate The specific position of the treatment with irradiation of light.Specific position is when from the 2nd central axis AX2 of the 2nd cartridge unit 22, is the 2nd Position in the substrate P of curved surface on component 22, across median plane P3 and being in the circumferential angle ± θ.Encoder head EN1 Setting rhumb line Le1 with from odd number projecting subassembly PL1, PL3, PL5 each view field (perspective view) PA1, PA3, The chief ray that the central point of PA5 passes through is consistent relative to the tiltangleθ of median plane P3, the setting rhumb line of encoder head EN2 The central point of Le2 and each view field (perspective view) PA2, PA4, PA6 from even number projecting subassembly PL2, PL4, PL6 is logical The chief ray crossed is consistent relative to the tiltangleθ of median plane P3.Therefore, encoder head EN1 becomes to being located at the 1st certain bits Set the reading device that the scale portion GP on the direction of PX1 and the 2nd central axis AX2 connection is read out.Moreover, encoder head EN2 becomes the reading being read out to the scale portion GP on the direction for linking the 2nd specific position PX2 and the 2nd central axis AX2 Take device.
Encoder head EN4 is configured at rear side, the i.e. exposure position (view field) of the direction of transfer of substrate P nearby Side, and be set in setting rhumb line Le4 on, setting rhumb line Le4 be make the setting rhumb line Le1 of encoder head EN1 around Obtained from rear side rotation of the axis of rotation centerline AX2 towards the direction of transfer of substrate P.In addition, in setting rhumb line Le5 Upper setting encoder head EN5, setting rhumb line Le5 are to make the setting rhumb line Le1 of encoder head EN1 around rotation center Obtained from rear side rotation of the axis of line AX2 towards the direction of transfer of substrate P.
In addition, encoder head EN3 is configured at the phase across rotation centerline AX2 relative to encoder head EN1, EN2 It tosses about, setting rhumb line Le3 is set on median plane P3.
Dial disc SD as scale features with metal, glass, ceramics of low thermal expansion etc. for base material, and in order to improve Measurement Resolution and by become diameter (such as diameter 20cm or more) as big as possible in a manner of make.In Fig. 5, dial disc The diameter of SD illustrates smaller than the diameter of the 2nd cartridge unit 22, still, in the outer peripheral surface by making the 2nd cartridge unit 22, winding base It is the diameter of the outer peripheral surface of plate P, consistent (substantially uniform) with the diameter of scale portion GP of dial disc SD, institute can be further decreased The measurement Abbe error of meaning.
The scale for being subject to processing dial disc SD along the circumferential minimum spacing for carving the scale (grid) set of scale portion GP is carved The limitation of the performance of line apparatus etc..Therefore, it if forming the diameter of dial disc SD larger, correspondingly can also mention High angle measurement resolution ratio corresponding with minimum spacing.
Make the side configured with setting rhumb line Le1, Le2 to scale portion GP encoder head EN1, EN2 being read out To direction when from rotation centerline AX2 relative to substrate P and with the chief ray incident of imaging beam EL2 to substrate P It is identical, as a result, for example, even if due to slightly recoil (2 μm~3 μm or so) because of the bearing (bearing) of supporting rotating shaft ST In the case where causing the 2nd cartridge unit 22 to deviate in X direction, also can by encoder head EN1, EN2 accurately measure because The offset and location error relevant to substrate P direction of transfer (Xs) that is may being generated in view field PA1~PA6.
As shown in fig. 6, in a part of the substrate P on the curved surface for being supported on the 2nd cartridge unit 22, in order to make to pass through Fig. 2 Shown in projection optical system PL and the picture of a part of mask pattern that is projected relatively aligned with substrate P it is (right It is quasi-), and aligming microscope AMG1, AMG2 of alignment mark being previously formed in substrate P equipped with detection etc..Aligming microscope AMG1, AMG2 are detection probes for detecting specific pattern that is discrete or being continuously formed in substrate P and with the inspection The mode that the detection zone of probing needle is set in the direction of transfer rear side of substrate P compared with above-mentioned specific position is configured at Pattern detection device around 2 cartridge units 22.
As shown in fig. 6, what aligming microscope AMG1, AMG2 formed a line with (width direction of substrate P) along the y axis Multiple (such as 4) detection probes.Aligming microscope AMG1, AMG2 can pass through the two sides in the Y direction of the 2nd cartridge unit 22 The detection probe at end is observed or is detected to the alignment mark being formed near the both ends of substrate P always.Moreover, alignment is aobvious Micro mirror AMG1, AMG2 can pass through the inspection other than the two side ends in the Y direction (width direction of substrate P) of the 2nd cartridge unit 22 Probing needle, such as observed or detected in the alignment mark for being formed in remaining white portion etc., wherein remaining white portion is located in substrate It is formed with along its length on P between the pattern forming region of multiple display panels.
As shown in FIG. 6 and 7, encoder head EN4 is configured on setting rhumb line Le4, wherein the setting rhumb line When Le4 is in the face XZ and from rotation centerline AX2, with the direction of observation AM1 (court with aligming microscope AMG1 to substrate P Become radial direction setting of the unidirectional mode along scale portion GP to the inspection center of the 2nd central axis AX2).In addition, in setting side Encoder head EN5 is configured on bit line Le5, wherein rhumb line Le5 is in the face XZ and from rotation centerline AX2 for setting When, to become same with inspection center of the aligming microscope AMG2 to the direction of observation AM2 (towards rotation centerline AX2) of substrate P Radial direction setting of the mode in one direction along scale portion GP.In this way, the detection probe of aligming microscope AMG1, AMG2 are from the 2nd Mandrel AX2 observe when be configured at around the 2nd cartridge unit 22, and with will be configured with the position of encoder head EN4, EN5 and The direction (setting rhumb line Le4, Le5) of 2nd central axis AX2 connection, with by the 2nd central axis AX2 and aligming microscope AMG1, The consistent mode in direction of the detection zone connection of AMG2 configures.In addition, aligming microscope AMG1, AMG2 and encoder head The position on the direction rotation centerline AX2 that EN4, EN5 are configured is set in what substrate P started to contact with the 2nd cartridge unit 22 In-position IA and substrate P are left between the disengaging configuration OA of the 2nd cartridge unit 22.
The direction of observation AM2 of above-mentioned aligming microscope AMG2 is configured at the front side of the conveyance direction of substrate P, exposes The rear of position (view field) is by photographing element etc. in the state of transmitting substrate P with fixing speed at high speed to shape It is carried out at the alignment mark (being formed in the region in tens μm~several hundred μm square) near the end in the Y-direction of substrate P The component of image detection, and in microscopic fields of view (image pickup scope) high speed the picture of label is sampled.It is adopted carrying out this Thus the moment of sample, storage find out base by the rotary angle position of the encoder head EN5 dial disc SD gradually measured Corresponding relationship between the mark position of alignment mark on plate P and the rotary angle position of the 2nd cartridge unit 22.
On the other hand, the direction of observation AM1 of above-mentioned aligming microscope AMG1 is configured at the rear of the conveyance direction of substrate P The front of side, i.e. exposure position (view field), with aligming microscope AMG2 likewise by photographing element etc. at high speed to shape At the picture of the alignment mark (being formed in the region in tens μm~several hundred μm square) near the end in the Y-direction of substrate P The rotation for being sampled, and passing through the encoder head EN4 dial disc SD gradually measured in the moment for carrying out the sampling, storage Thus gyration position is found out between the mark position of the alignment mark in substrate P and the rotary angle position of the 2nd cartridge unit 22 Corresponding relationship.
When detecting the label as detected by aligming microscope AMG1 as aligming microscope AMG2, encoder will be passed through The difference of angle position and the angle position for measuring and storing by encoder head EN5 that read head EN4 is measured and stored, and it is pre- First opening angle formed by setting rhumb line Le4, Le5 of critically corrected two aligming microscopes AMG1, AMG2 is compared Compared with.Moreover, in the case where the opening angle has error, it may be possible to substrate P in-position IA and disengaging configuration OA it Between, it is slightly slided on the 2nd cartridge unit 22 or along direction of transfer (circumferential direction) or along parallel with the 2nd central axis AX2 Direction (Y direction) has occurred flexible.
In general, location error when patterning depends on fine degree and/or the coincidence for the element pattern being formed in substrate P Precision, for example, only allowing its a few minutes in order to which the pattern layer relative to substrate is accurately overlapped 10 μm of wide line images and exposure One of error below, be scaled in substrate P size when, only allow ± 2 μm or so of location error.
In order to realize such high-precision measurement, need to make each aligming microscope AMG1, AMG2 to tag image in advance Measurement direction (the periphery tangential direction of the 2nd cartridge unit 22 in the face XZ), with the measurement direction of each encoder head EN4, EN5 (the periphery tangential direction of the scale portion GP in the face XZ) is allowing in angular error unanimously.
As described above, with measurement direction (the 2nd canister portion with aligming microscope AMG1, AMG2 to the alignment mark in substrate P The tangential direction of the periphery of part 22) consistent mode is configured with encoder head EN4, EN5.Therefore, even if aobvious by being aligned The 2nd cartridge unit 22 (dial disc SD) exists (when image sampling) when micro mirror AMG1, AMG2 carry out position detection to substrate P (label) In the case that offset has occurred in the edge circumferential direction (tangential direction) orthogonal with setting rhumb line Le4 or Le5 in the face XZ, also it can be realized The high-precision position measurement that the offset of 2nd cartridge unit 22 is taken into account.
When from the 2nd central axis AX2, around the scale portion GP of dial disc SD 5 at be configured with encoder Read head EN1~EN5, therefore carried out and combining the output of the wherein measured value of 2 or 3 encoder heads appropriate Calculation process can find out out of roundness (shape strain), eccentric error of the scale portion GP of dial disc SD etc..
< temperature-adjusting device >
As described above, substrate P is sometimes because the temperature environment inside processing unit U3 is along conveyance direction (circumferential direction) or with the 2nd Central axis AX2 parallel direction (Y direction), stretches according to the temperature of substrate P.The flexible material property depending on substrate P, The material extended is generated including the temperature increase with substrate P and as the temperature of substrate P increases and generate the material of contraction Material.Fig. 8 is for illustrating thermostatic explanatory diagram of the first embodiment.As shown in Fig. 2, temperature-adjusting device 60 be the conveyance direction upstream side to the substrate P passed through from the 1st specific position PX1, specific position PX and the 2nd specific position PX2 Carry out the device of temperature adjusting.In preferred process device U3, substrate P that the 1st guide member 31, the 2nd guide member 32 are guided The temperature adjustment of slave temperature-adjusting device 60 terminate length until the in-position IA for being transported to the 2nd cartridge unit 22 and to the greatest extent may be used Can be short, but can also be determined according to the difference between the temperature set by temperature-adjusting device 60 and the temperature of the 2nd cartridge unit 22 It is fixed.For example, needing to spend the time since the usual thermal capacity of the 2nd cartridge unit 22 is big and changes set temperature, by Fig. 2 The constantly temperature adjustment always of substrate supporting component temperature-adjusting device 73, so that the temperature that the 2nd cartridge unit 22 keeps some to fix.And And temperature and substrate based on the conveying space from temperature-adjusting device 60 to the conveying distance of in-position IA, this The speed of P determines the temperature set by temperature-adjusting device 60.As an example, it is in the surface temperature of the 2nd cartridge unit 22 In the case where 25 DEG C, temperature set by temperature-adjusting device 60 is set as (second time in the mobile conveying distance amount of substrate P Number) after, just it is down to 25 DEG C.However, environment temperature can be quickly become since usual substrate P is relatively thin, accordingly, it is preferred that It is that the conveying distance from temperature-adjusting device 60 to in-position IA is as short as possible, and predicts and control as described above Transformation temperature.
Temperature-adjusting device 60 has guide member 61, medium blower part 62, blast pressure homogenization component 63, medium Regulating device 71, heating unit HU and cooling unit CU.Medium blower part 62 is via the medium formed by porous material Blast pressure homogenization component 63 blows medium to substrate P.Carrying device 9 send substrate P with medium by guide member 61 Space 67 between wind part 62.Medium blower part 62 will supply from medium regulating device 71 via medium supplying tubing AP Medium blow to 61 side of guide member.Heating unit HU is to supply the medium of high temperature to medium via medium supplying tubing HH 1st medium supply unit of regulating device 71.Cooling unit CU is by temperature via medium supplying tubing CC than heating unit HU The low cryogenic media of high-temperature medium is supplied to the 2nd medium supply unit of medium regulating device 71.Medium regulating device 71 has: stream Amount adjustment valve 72H, is adjusted the flow supplied from medium supplying tubing HH to the high-temperature medium of medium supplying tubing AP； Flow rate regulating valve 72C adjusts the flow supplied from medium supplying tubing CC to the cryogenic media of medium supplying tubing AP It is whole.Flow rate regulating valve 72H and flow rate regulating valve 72C, such as be made of solenoid valve.Medium regulating device 71 is according to control device 14 The output of control signal and the amount to the high-temperature medium passed through from flow rate regulating valve 72H and pass through from flow rate regulating valve 72C The amount of cryogenic media be adjusted, thus it enables that supply is to the high-temperature medium of medium blower part 62 and the ratio of cryogenic media It changes.Therefore, medium regulating device 71 can mix high-temperature medium and cryogenic media as supply to medium air supplying part The medium of part 62 makes its circulation.Temperature-adjusting device 60 can make around the flow of media of arbitrary temp to guide member 61, To adjust the temperature of substrate P.In addition it is also possible to be to set the component same with the blast pressure homogenization component 63 in Fig. 8 The opposite side in substrate P is set, via the component same with medium supplying tubing AP, the medium after temperature is adjusted is blowed to base The composition of the opposite side of plate P.
Substrate supporting component temperature-adjusting device 73 is carried out to the temperature of the 2nd cartridge unit 22 as substrate supporting component The device of adjusting.Substrate supporting component temperature-adjusting device 73 has: flow rate regulating valve 74H, to from medium supplying tubing HH It supplies to the flow of the high-temperature medium of medium supplying tubing AD and is adjusted；Flow rate regulating valve 74C, to from medium supplying tubing CC is supplied to the flow of the cryogenic media of medium supplying tubing AD and is adjusted.Flow rate regulating valve 74H and flow rate regulating valve 74C, Such as it is made of solenoid valve.Substrate supporting component temperature-adjusting device 73 is right according to the output of the control signal of control device 14 It the amount of the high-temperature medium passed through from flow rate regulating valve 74H and is adjusted from the amount of the flow rate regulating valve 74C cryogenic media passed through It is whole, thus it enables that supply to the high-temperature medium of the 2nd cartridge unit 22 and the ratio of cryogenic media changes.Therefore, substrate supporting Part temperatures regulating device 73 can mix high-temperature medium and cryogenic media as Jie of supply to the inside of the 2nd cartridge unit 22 Matter, and via medium supplying tubing AD, so that it is circulated to the inside of the 2nd cartridge unit 22.Preferably, substrate supporting component temperature The control of 73 controlled device 14 of regulating device is the temperature for being kept fixed the 2nd cartridge unit 22.Thereby, it is possible to make to be transferred to and the The thermal capacity of the substrate P of the curved face contact of 2 cartridge units 22 keeps approximately fixed, and makes to generate in the curved surface of the 2nd cartridge unit 22 Substrate P retracted position stablize.
Temperature-adjusting device 60 and substrate supporting component temperature-adjusting device 73 are that the medium that will be adjusted through excess temperature supplies To substrate P or the device of the 2nd cartridge unit 22, but medium can also be come by recycling liquid in pipeline with radiation heat Adjust the temperature of substrate P or the 2nd cartridge unit 22.Medium regulating device 71 and substrate supporting component temperature-adjusting device 73 are for example Heater can be constituted with radiating fin combination.
For detecting the temperature measuring device T1 transported to the temperature of the substrate P before guide member 61, can will test As a result it exports to control device 14.Control device 14 can adjust temperature and be filled based on the testing result of temperature measuring device T1 Set 60 carry out feedforward controls.In addition, for detect from temperature-adjusting device 60 (guide member 61) pass through after substrate P temperature The temperature measuring device T2 of degree can will test result and export to control device 14.It can be based on the inspection of temperature measuring device T2 It surveys as a result, carrying out feedback control to temperature-adjusting device 60.Control device 14 is by carrying out feedforward control to temperature-adjusting device 60 The control of at least one of system and feedback control, can control the temperature for the medium blown from medium blower part 62, to mention Height is applied to the precision of the temperature of substrate P.It is radiated for example, temperature measuring device T1, T2 are able to use for measuring substrate P The non-contact infrared thermometer of energy of infrared ray etc..
As shown in figure 8, in the case where so that substrate P is passed through the space 67 between guide member 61 and medium blower part 62, Preferably, has the supporting device of substrate P in guide member 61.Medium blower part 62 will be from medium supplying tubing AP's Medium is fed through blast pressure homogenization component via the through hole AH being opened in positioned at the position of blast pressure homogenization component 63 63.Blast pressure homogenization component 63, e.g. porous material, therefore the opposite face 63S in substrate P side, with per unit face The mode of long-pending pressure medium equalization sprays medium.Has the Y-direction (width direction) for pressing substrate P in guide member 61 End limiting component 64 and limiting component 65, when transporting substrate P, limiting component 64 and limiting component 65 are across substrate P Width direction.Limiting component 65 is fixed on the medial surface of guide member 61 via bearing BE.Limiting component 64 is via spring SS It is connect with the magnet VCMm of voice coil motor 66.According to the electric current for the coil VCMc for flowing to voice coil motor 66, the Y-direction of magnet VCMm Position changes, and voice coil motor 66 can make the position of the Y-direction of substrate P change.
As shown in Fig. 2, being equipped with aligming microscope in the inside of temperature-adjusting device 60 or the outlet side of conveyance direction PMG1 detects the alignment mark etc. being previously formed in substrate P.Aligming microscope PMG1 has along the Y-direction (width of substrate P Degree direction) multiple (such as 4) detection probes for forming a line.Fig. 9 is the explanatory diagram for illustrating an example of alignment mark.Figure Aligming microscope PMG1 shown in 2 always can remove edge by the detection probe of the two side ends in the Y-direction of guide member 61 The alignment mark ma for sending direction α to be formed near the both ends of substrate P shown in Fig. 9 is observed or is detected.
Figure 10 is saying of being schematically illustrated of an example of the variation to alignment mark caused by flexible by substrate Bright figure.Figure 11 is indicate the step of being modified to the processing of processing unit of the first embodiment (exposure device) one The flow chart of a example.As shown in Figure 10, aligming microscope AMG1 is being located at direction of observation (detection side as the 1st detection probe To) alignment mark ma is detected in the range of microscopic fields of view (image pickup scope) mam of AM1.Similarly, aligming microscope PMG1 makees For the 2nd detection probe, alignment mark is detected in the range of being located at microscopic fields of view (image pickup scope) map of detection direction PM1 ma.In this way, aligming microscope AMG1 and aligming microscope PMG1 detect pair as specific pattern in substrate P shown in Fig. 10 Fiducial mark remembers ma (step S11).Aligming microscope AMG1 exports the camera shooting of alignment mark ma to control device 14, control device 14 And aligming microscope AMG1 is stored in control device 14 for alignment mark ma as camera data as the 1st pattern detection device Storage unit.Aligming microscope PMG1 exports the camera shooting of alignment mark ma to control device 14, and control device 14 and alignment are aobvious Micro mirror PMG1 is stored in the storage unit of control device 14 using alignment mark ma as camera data as the 2nd pattern detection device.
Next, passing through the camera shooting that will be stored in storage unit, microscopic fields of view (image pickup scope) map alignment mark ma Data are compared with the camera data of the alignment mark ma of microscopic fields of view (image pickup scope) mam, are being not present by substrate P In the case where the variation of the camera data of alignment mark ma caused by flexible (step S12, no), control device 14 executes step The processing of S11.As shown in Figure 10, by the way that storage unit will be stored in, the alignment mark ma of microscopic fields of view (image pickup scope) map Camera data be compared with the camera data of the alignment mark ma of microscopic fields of view (image pickup scope) mam, exist by base It (step S12, is) that control device 14 makes to locate in the case where the variation of the camera data of the flexible caused alignment mark ma of plate P Reason enters step S13.For example, in the presence of the camera data of alignment mark ma caused by flexible by substrate P variation the case where be Refer to, the changes delta m of shown in Fig. 10, alignment mark ma camera data is more than the picture offset correction light as excursion adjusting device Department of the Chinese Academy of Sciences's part 45 is permitted, projection image's pettiness can be made in image planes the amount of lateral shift the case where.Additionally, there are by substrate P it is flexible caused by alignment mark ma camera data variation the case where refer to, the variation of the camera data of alignment mark ma Δ m be more than as multiplying power adjust device multiplying power amendment it is permitted with optical component 47, can the multiplying power to projection image carry out The case where pettiness modified multiplying power etc..
Next, material of the control device 14 according to substrate P, carries out the medium regulating device 71 of temperature-adjusting device 60 Control, and the temperature adjustment of substrate P is carried out, so that the target width in the width direction of substrate P becomes for example shown in Fig. 10 Target width PP (step S13).Testing result of the control device 14 based on temperature measuring device T1, T2, not up to specific In the case where substrate temperature (step S14, no), continue the temperature adjustment (step S13) of substrate P.Control device 14 is based on temperature The testing result of measuring device T1, T2 (step S14, is) that processing is made to enter step in the case where reaching specific substrate temperature Rapid S15.
Next, exposure device EX, according to above-mentioned picture excursion adjusting device again through above-mentioned 1st pattern detection device And above-mentioned 2nd pattern detection device output and the changes delta m of alignment mark ma (specific pattern) that finds out, carry out making projection image Positional shift projection image amendment (step S15).In addition, exposure device EX can also adjust device according to above-mentioned multiplying power The alignment mark ma found out again through the output of above-mentioned 1st pattern detection device and above-mentioned 2nd pattern detection device is (specific Pattern) changes delta m, carry out the amendment for making the modified projection image of the multiplying power of projection image.Alternatively, exposure device EX can also basis Above-mentioned multiplying power adjusts device and as excursion adjusting device is again through above-mentioned 1st pattern detection device and above-mentioned 2nd pattern detection The output of device and the changes delta m of alignment mark ma (specific pattern) found out make projection image to deviate and multiplying power amendment Throwing camera shooting amendment.
As described above, one of the substrate P before being wound in the 2nd cartridge unit 22 is adjusted by temperature-adjusting device 60 Partial temperature, processing unit U3 can make to be located at above-mentioned 1st specific position PX1, specific position PX or the 2nd specific position The retracted position of the substrate P of PX2 is stablized.Therefore, exposure device EX is special in the 1st specific position PX1, specific position PX or the 2nd PX2 is set in positioning, can critically be irradiated the processing of exposure light.
The temperature that a part of the substrate P before being wound in the 2nd cartridge unit 22 is adjusted by temperature-adjusting device 60, can By the extension and contraction control of substrate P in the range of multiplying power adjusts device and can correct projection image as excursion adjusting device.Therefore, it exposes Electro-optical device EX can critically be irradiated exposure in the 1st specific position PX1, specific position PX or the 2nd specific position PX2 The processing used up.
Furthermore in the present embodiment, the substrate branch of the temperature of the outer peripheral surface (bearing surface) equipped with the 2nd cartridge unit 22 of control Bearing portion part temperature-adjusting device 73 and be located at the 2nd cartridge unit 22 upstream side temperature-adjusting device 60, in the conveying of substrate P On direction, it can carry out making substrate P between the position of the specific position and its upstream side of alignment position and/or exposure position Temperature control with fixed temperature difference.It as a result, can also adjust the time point that substrate P is supported in the 2nd cartridge unit 22 The stroke of substrate P.It in this case, will be via if the temperature of the substrate P set by temperature-adjusting device 60 is set as Tu The temperature for the substrate P that 2nd cartridge unit 22 is set by substrate supporting component temperature-adjusting device 73 is set as Td, then is set as Tu > Td Or Tu < Td, temperature control is carried out in the approximately fixed mode of the difference.
(the 2nd embodiment)
Next, 2 illustrating the 2nd embodiment of processing unit of the present invention referring to Fig.1.Figure 12 is to indicate the 2nd The schematic diagram of the overall structure for the processing unit (exposure device) that embodiment is related to.In the figure, to the 1st embodiment The identical element of constituent element marks same reference numerals, and the description thereof will be omitted.
As shown in figure 12, temperature-adjusting device 60A has: guide member 32A, and guide member 32A has from the 2nd Mandrel AX2 parallel parallel reference axis BX1 makes substrate P with curved surface (the 2nd curved surface) 61S made of radii fixus r3 bending A part is contacted with curved surface 61S；And the medium in the space 67 around the flow of media to guide member 32A after adjusting temperature Regulating device 71.Carrying device 9 makes substrate P pass through the space 67 between guide member 32A and medium blower part 62A.Medium Blower part 62A will blow from medium regulating device 71 via the medium that medium supplying tubing AP supply comes to guide member 32A Side.It is bent when guide member 32A is due to from parallel reference axis BX1 along curved surface 61S, is able to suppress the disorderly of space 67 Stream.
Temperature-adjusting device 60A by make temperature adjust after flow of media to guide member 32A around space 67, The temperature of medium is transferred to substrate P.Guide member 32A contacts a part of substrate P with curved surface 61S due to being formed as, because This can be from guide member 32A directly to 22 supplying substrate P of the 2nd cartridge unit, and shortens from guide member 32A to the 2nd cartridge unit The distance between 22.Therefore, processing unit U3, which is able to suppress, adjusts adjusted, base by the temperature of temperature-adjusting device 60A The retracted position of plate P is from temperature-adjusting device 60A to generation variation the 2nd cartridge unit 22.
It is further preferred that the radius r3 of the curved surface 61S of guide sections part 32A is identical as the radius r2 of the 2nd cartridge unit 22. With this configuration, the tension for acting on the substrate P for being wound in the 2nd cartridge unit 22 can be made and acted on to be wound in guide member The tension of the substrate P of 32A is identical.As a result, error caused by the difference of tension, detection can be inhibited from the variation of alignment mark Because of the variation of alignment mark caused by temperature.
(the 3rd embodiment)
Next, 3 illustrating the 3rd embodiment of processing unit of the present invention referring to Fig.1.Figure 13 is to indicate the 3rd The schematic diagram of the overall structure for the processing unit (exposure device) that embodiment is related to.In the figure, to the 1st embodiment and The identical element of the constituent element of 2nd embodiment marks same reference numerals, and the description thereof will be omitted.
As shown in figure 13, processing unit U3 of the third embodiment is by medium regulating device 71 as adjusting guidance The guide member temperature-adjusting device of component 32A.Medium regulating device 71 can mix high-temperature medium and cryogenic media as It supplies to the medium of the inside of guide member 32A, makes its circulation.71 controlled device 14 of medium regulating device, which is controlled and adjusted, to be drawn The temperature of component 32A is led, and the temperature of guide member 32A is transferred to the substrate P contacted with guide member 32A.It transmits as a result, It is approximately fixed to being remained with the thermal capacity of the curved surface 61S of the guide member 32A substrate P contacted.
It is further preferred that the radius r3 of the curved surface 61S of guide sections part 32A is identical as the radius r2 of the 2nd cartridge unit 22. With this configuration, the tension for acting on the substrate P for being wound in the 2nd cartridge unit 22 can be made and acted on to be wound in guide member The tension of the substrate P of 32A is identical.For example, passing through the song being transferred to guide member 32A for applying medium regulating device 71 Face 61S contact substrate P thermal capacity, be transferred to it is consistent with the thermal capacity of substrate P of curved face contact of the 2nd cartridge unit 22, It can be improved the variation of the alignment mark from aligming microscope PMG1 alignment mark detected in aligming microscope AMG1 Precision of prediction.
(the 4th embodiment)
Next, 4 illustrating the 4th embodiment of processing unit of the present invention referring to Fig.1.Figure 14 is to indicate the 4th The schematic diagram of the overall structure for the processing unit (exposure device) that embodiment is related to.In the figure, to from the 1st embodiment The identical element of constituent element to the 3rd embodiment marks same reference numerals, and the description thereof will be omitted.Exposure device EX2 will The illuminating bundle EL1 that cylinder light shield DM is illuminated is projected from light source.
Illuminating bundle EL1 shot from the light source is guided to light fixture IL, in the feelings for being equipped with multiple lamp optical systems Under condition, the illuminating bundle EL1 from light source is separated into multiple, and multiple illuminating bundle EL1 is guided to multiple light fixtures IL。
Here, illuminating bundle EL1 shot from the light source is incident to polarized light beam splitter SP1, SP2.In polarized light beam splitter In SP1, SP2, in order to inhibit the energy loss generated by the separation of illuminating bundle EL1, it is preferred to use make incident illumination light Beam EL1 all reflects such light beam.Here, polarized light beam splitter SP1, SP2 will become the light of the rectilinearly polarized light of S polarized light Beam reflection, and the light beam for becoming the rectilinearly polarized light of P-polarized light penetrates.Therefore, light source makes to be incident to polarized light beam splitter The illuminating bundle EL1 that the illuminating bundle EL1 of SP1, SP2 become the light beam of rectilinearly polarized light (S polarized light) is projected to the 1st cartridge unit 21.Light source projects wavelength and the consistent illuminating bundle EL1 of phase as a result,.
Polarized light beam splitter SP1, SP2 reflect the illuminating bundle EL1 from light source, on the other hand, make by cylinder light shield Imaging beam (projected light beam) EL2 of DM reflection is penetrated.In other words, the illuminating bundle EL1 from illumination optics is as anti- Irradiating light beam and be incident to polarized light beam splitter SP1, SP2, the imaging beam EL2 from cylinder light shield DM as through light beam and enter It is incident upon polarized light beam splitter SP1, SP2.
In this way, the light fixture IL as processing unit carries out the circle for reflexing to illuminating bundle EL1 as object to be treated The processing of predetermined pattern (mask pattern) on cylinder light shield DM.Projection optical system PL can will be on cylinder light shield DM as a result, In the picture projection to a part (view field PA) of the substrate P transported by carrying device 9 of pattern in illumination region IR.Exposure Device EX2 is able to carry out by the projected light beam emitted by cylinder light shield DM to the 1st specific position PX1, the 2nd specific position PX2 In the processing used up of substrate P irradiation exposure.
(the 5th embodiment)
Next, 5 illustrating the 5th embodiment of processing unit of the present invention referring to Fig.1.Figure 15 is to indicate the 5th The schematic diagram of the overall structure for the processing unit (exposure device) that embodiment is related to.In the figure, to from the 1st embodiment The identical element of constituent element to the 4th embodiment marks same reference numerals, and the description thereof will be omitted.Exposure device EX3 tool Standby multiple polygon scan unit PO1, PO2, each polygon scan unit PO on one side in substrate P along in the rotation as axis Heart AX2 parallel direction carries out high-velocity scanning with the light beam spot from ultraviolet laser light source, passes through AOM (not shown) on one side (Acousto-Optic Modulator: acoustooptic modulation element) etc. is based on pattern plotter data (CAD data) and adjusts to light beam It makes (On/Off), thus the depicting pattern in substrate P.
Exposure device EX3 is can be on the 1st specific position PX1, the 2nd specific position PX2 without cylinder light shield DM Substrate P irradiation exposure use up (laser point), and formed as defined in pattern without light shield exposure device, in addition to spot scan, It can be and use DMD (Digital Micro mirror Device) or SLM (Spatial light modulator: space Optical modulator) Lai Jinhang depicting pattern mode.
(the 6th embodiment)
Next, 6 illustrating the 6th embodiment of processing unit of the present invention referring to Fig.1.Figure 16 is to indicate the 6th The schematic diagram of the overall structure for the processing unit (exposure device) that embodiment is related to.In the figure, to the 1st embodiment The identical element of constituent element marks same reference numerals, and the description thereof will be omitted.
Exposure device EX4 is the processing unit for implementing so-called close formula exposure to substrate P.Exposure device EX4 is by cylinder light The gap of cover DM and the 2nd cartridge unit 22 are set as small, and lighting mechanism IU directly irradiates illuminating bundle EL to substrate P, carry out non- Contact exposure.In the present embodiment, the 2nd cartridge unit 22 from the 2nd driving portion 36 comprising actuators such as electric motors by supplying The torque given and rotate.Such as it is revolved by the driven roller MGG that magnetic gear links with becoming reversed with the direction of rotation of the 2nd driving portion 36 The mode turned drives the 1st cartridge unit 21.2nd driving portion 36 rotates the 2nd cartridge unit 22, and makes driven roller MGG and the 1st canister portion Part 21 rotates in linkage, to make the 1st cartridge unit 21 (cylinder light shield DM) and 22 synchronizing moving of the 2nd cartridge unit (synchronous rotary).
In addition, exposure device EX4 has encoder head EN6, encoder head EN6 detects illuminating bundle to substrate P The chief ray incident of (imaging beam) EL to substrate P specific position scale portion GP position PX6.Here, due to making the 2nd It is the diameter of the outer peripheral surface of winding substrate P in the outer peripheral surface of component 22, consistent with the diameter of scale portion GP of dial disc SD, because This position PX6 is consistent with above-mentioned specific position when from the 2nd central axis AX2.Moreover, encoder head EN7 is set in It is arranged on rhumb line Le7, setting rhumb line Le7 is to make biography of the setting rhumb line Le6 of encoder head EN6 towards substrate P The rear side in direction is sent to rotate obtained from substantially 90 ° around the axis of rotation centerline AX2.
The exposure device EX4 of present embodiment can be implemented the following processing: encoder head EN7 being set as the 1st reading and is filled It sets, encoder head EN6 is set as the 2nd reading device, exported using the reading of the 1st reading device, to according to scale portion GP's Read position that output is found out, axis by the 2nd cartridge unit 22 and specific position connection and the displacement in direction orthogonal to the axis Ingredient is modified.
1st embodiment to the 6th embodiment described above instantiates exposure device as processing unit.As place Device is managed, exposure device is not limited to, is also possible to processing unit using the ink dripping device of ink jet type as object to be treated Substrate P on printed patterns device.Or processing unit is also possible to check device.
< manufacturing method >
Next, 7 illustrating manufacturing method referring to Fig.1.Figure 17 is to indicate using there is place of the first embodiment Manage the flow chart of the manufacturing method of device (exposure device).
In the manufacturing method shown in Figure 17, firstly, carrying out such as the display based on self-emission device organic EL The function and performance design of panel pass through the circuit pattern and/or wiring pattern (step S201) of the designs such as CAD.Then, Based on the pattern of each figure layer in the various figure layers designed by CAD etc., to make the cylinder light of required figure layer amount It covers DM (step S202).In addition, preparing the flexible substrate P (resin film, gold that are wound with the substrate as display panel Belong to paper tinsel film, plastics etc.) supply roller FR1 (step S203).In addition, the substrate P root of the roll prepared in step S203 According to needing can be, the substrate that be modified to its surface is previously formed basal layer (such as based on the small of the mode of coining It is concave-convex) substrate, be laminated with the functional membrane of photoinduction and/or the substrate of hyaline membrane (insulating materials) in advance.
Then, the electrode by constituting display panel element is formed in substrate P and wiring, insulating film, TFT (partly lead by film Body) etc. compositions baseplane layer, and the hair based on self-emission devices such as organic EL is formed in a manner of being laminated in the baseplane Photosphere (display pixel portion) (step S204).In step S204, illustrate in each embodiment before also including use The previous photo-mask process that exposure device EX, EX2, EX3, EX4 are exposed photoresist layer, also comprising being based on following work The processing of sequence: to the substrate P progress pattern exposure for being coated with photonasty silane coupling material instead of photoresist in table Face forms the exposure process of the pattern of hydrophily and waterproofness；Pattern exposure is carried out to the catalyst layer of photoinduction and passes through nothing Electrolytic plating method forms the wet type operation of the pattern (wiring, electrode etc.) of metal film；Or utilize leading containing Nano silver grain The printing process etc. of the depicting pattern such as conductive ink.
Then, base is cut by each display panel element being continuously manufactured by the substrate P of strip by roller mode Plate P, protective film (environment reply barrier layer) and colored filter etc. are pasted on the surface of each display panel element, thus group It fills element (step S205).Then, inspection operation is carried out, checks whether display panel element normally functions, whether full The desired performance of foot and characteristic (step S206).By the above, display panel (flexible display) can be manufactured.
Description of symbols
1 device manufacturing system
2 substrate feeding devices
3 substrate recyclable devices
5 host control devices
9 carrying devices
12 light shield holding meanss
13 light supply apparatus
14 control devices
22 the 2nd cartridge units
DR1DR8 driven roller
31 the 1st guide members
32 the 2nd guide members
33 the 3rd guide members
35 the 2nd detectors
44 focus amendment optical component
45 as offset correction optical component
46 rotation correction mechanisms
Optical component is used in the amendment of 47 multiplying powers
60,60A temperature-adjusting device
61,32A guide member
61S curved surface
62,62A medium blower part
63 blast pressure homogenization components
64,65 limiting component
66 voice coil motors
67 spaces
71 medium regulating devices
72H, 72C, 74H, 74C flow rate regulating valve
73 substrate supporting component temperature-adjusting devices
CC medium supplying tubing
CU cooling unit
HH medium supplying tubing
HU heating unit
AMG1, AMG2, PMG1 aligming microscope
DM cylinder light shield
EN1, EN2, EN3, EN4, EN5 encoder head
EX, EX2, EX3, EX4 exposure device (substrate board treatment)
PO1, PO2 polygon scan unit

Claims (2)

1. a kind of substrate board treatment forms the pattern for constituting electronic component on the substrate of flexible strip, special Sign is, comprising:
Substrate supporting component has in such a way that a part of the length direction to the substrate supports along the length Bearing surface made of the bending of direction, and the substrate supporting component transports the base along the length direction with defined speed Plate；
Processing unit forms the pattern on by the substrate of the bearing surface bearing of the substrate supporting component；With
Temperature regulation section, the conveyance direction that the bearing surface relative to the substrate supporting component configured in the substrate Upstream side, and the temperature of the substrate of the upstream side is adjusted, so that the temperature of the substrate of the upstream side Become defined difference with the temperature of the substrate in the bearing surface,
Difference as defined in described is according to the base required when forming the pattern on the substrate by the processing unit The stroke of plate and set.
2. a kind of substrate board treatment forms the pattern for constituting electronic component on the substrate of flexible strip, special Sign is, comprising:
Substrate supporting component has in such a way that a part of the length direction to the substrate supports along the length Bearing surface made of the bending of direction, and the substrate supporting component transports the base along the length direction with defined speed Plate；
Processing unit forms the pattern on by the substrate of the bearing surface bearing of the substrate supporting component；
The bearing surface of the substrate supporting component is adjusted to the 1st temperature by the 1st temperature regulation section；With
The upstream side of the substrate supporting component is arranged in 2nd temperature regulation section, the conveyance direction about the substrate, by institute The temperature for stating substrate is adjusted to 2nd temperature different from the 1st temperature,
It is set according to the stroke of the substrate required when forming the pattern on the substrate by the processing unit Fixed 1st temperature and the 2nd temperature difference.
CN201610861837.4A 2012-09-14 2013-08-12 Substrate board treatment Active CN106933065B (en)

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TWI645262B (en) 2018-12-21
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TWI606306B (en) 2017-11-21
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JP6256338B2 (en) 2018-01-10

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