TWI606306B - Substrate processing apparatus and device manufacturing method - Google Patents

Description

Substrate processing apparatus and component manufacturing method

The present invention relates to a substrate processing apparatus and a device manufacturing method for performing a process on a substrate having a curved surface of a substrate supporting member.

Among the exposure apparatuses used in the lithography process, there is an exposure apparatus which rotates a cylindrical or cylindrical mask to expose a substrate as disclosed in the following patent document (for example, refer to Patent Document 1).

In the case where a plate-shaped reticle is used, even when a cylindrical or cylindrical reticle is used to expose the substrate, it is necessary to accurately obtain a projection of the reticle pattern to the substrate. Location information of the mask pattern. Therefore, there is a demand for a technique for accurately obtaining the positional information of a cylindrical or cylindrical reticle to accurately adjust the positional relationship between the reticle and the substrate.

Therefore, in the exposure apparatus disclosed in Patent Document 1, a predetermined area of the pattern forming surface of the photomask is disclosed, and the relative pattern is used to form a mark (scale, grid, etc.) for obtaining the position information in a predetermined positional relationship, and The encoder system detects the mark to obtain positional information of the pattern in the circumferential direction of the pattern forming surface or positional information of the reticle in the direction of the rotation axis.

In addition, in recent years, an electronic component such as a large display panel (liquid crystal, organic EL, or the like) has been formed in a flexible resin film, a plastic sheet, an extremely thin glass sheet, and the like, and has been drawn into a roll. a flexible long strip film or sheet (hereinafter referred to as a flexible substrate), A device in which a photo-sensing layer is coated on the surface of the flexible substrate, and various patterns for the electronic circuit are exposed on the photo-sensitive layer (for example, Patent Document 2).

Advanced technical literature

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-076650

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-217877

The substrate processing apparatus that applies the treatment to the flexible substrate disclosed in Patent Document 2 is required to suppress the expansion and contraction of the substrate and to improve the precision of the processing.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate processing apparatus and a device manufacturing method capable of suppressing expansion and contraction of a substrate and improving processing accuracy.

According to a first aspect of the invention, there is provided a substrate processing apparatus comprising: a substrate supporting member having a curved surface curved from a predetermined axis by a constant radius, wherein one of the substrates is wound around the curved surface to support the substrate; and the processing portion is configured by the shaft The substrate disposed around the substrate supporting member is subjected to processing on the curved surface at a specific position in the circumferential direction, and a temperature adjusting device for adjusting the temperature of the substrate before being supplied to the substrate supporting member.

According to a second aspect of the present invention, there is provided a device manufacturing method for forming a pattern on a substrate by using the substrate processing apparatus according to the first aspect of the present invention.

According to a third aspect of the present invention, a method of manufacturing a device for manufacturing an electronic component on a flexible strip substrate includes bending one of the strip directions of the substrate along the strip direction of the substrate supporting member Supporting surface is supported while the substrate is on the strip side An operation of transporting at a predetermined speed; and a process of transferring the pattern constituting the electronic component to the substrate supported by the support surface at a specific position in the longitudinal direction of the support surface of the substrate supporting member; The temperature control operation is performed such that the temperature of the substrate on the support surface of the substrate supporting member on the upstream side in the transport direction and the temperature of the substrate on the support surface are both predetermined.

According to the aspect of the invention, the substrate processing apparatus and the element manufacturing method can suppress the expansion and contraction of the substrate and improve the processing accuracy.

1‧‧‧Component Manufacturing System

2‧‧‧Substrate supply unit

3‧‧‧Substrate recovery unit

5‧‧‧Upper control device

9‧‧‧Transporting device

12‧‧‧Photomask holder

13‧‧‧Light source device

14‧‧‧Control device

21‧‧‧1st roller member

22‧‧‧2nd roller member

23‧‧‧guide roller

24‧‧‧Drive roller

25‧‧‧1st detector

26‧‧‧First Drive Department

31‧‧‧First Guide

32‧‧‧2nd Guide

33‧‧‧3rd Guide

35‧‧‧2nd detector

36‧‧‧2nd drive department

44‧‧‧Focus correction optical components

45‧‧‧Image displacement correction optical components

46‧‧‧Rotary correction mechanism

47‧‧‧ magnification correction optical components

60, 60A‧‧‧temperature adjustment device

61, 32A‧‧‧ Guides

61S‧‧‧ surface

62, 62A‧‧‧Media air supply components

63‧‧‧Air supply pressure equalization member

64, 65‧‧‧Restricted components

66‧‧‧ voice coil motor

67‧‧‧ Space

71‧‧‧Media adjustment device

72H, 72C, 74H, 74C‧‧‧ flow adjustment valve

73‧‧‧Substrate support member temperature adjustment device

AD‧‧‧Media Supply Pipeline

AM1, AM2‧‧‧ observation direction

AMG1, AMG2, PMG1‧‧‧ alignment microscope

AP‧‧‧Media Supply Pipeline

AX1, AX2‧‧‧ Rotating Center Line

CC‧‧‧Media Supply Pipeline

CU‧‧‧cooling unit

DM‧‧‧Cylinder reticle

DR1~DR8‧‧‧ drive roller

HH‧‧‧Media Supply Pipeline

EL1‧‧‧ illumination beam

EL2‧‧‧ imaging beam

EN1, EN2, EN3, EN4, EN5‧‧‧ encoder read head

EX, EX2, EX3, EX4‧‧‧ exposure device (substrate processing device)

HH‧‧‧Media Supply Pipeline

HU‧‧‧heating unit

IA‧‧‧Transport direction entry position

IL‧‧‧Lighting Module

IR‧‧‧Lighting area

IU‧‧‧Lighting Agency

OA‧‧‧Transport direction disengaged

P‧‧‧Substrate

P1‧‧‧ first side

P2‧‧‧2nd

P2‧‧‧ center face

PA (PA1~PA6)‧‧‧projection area

PL (PL1~PL6)‧‧‧Projection Optics

PM1‧‧‧Detection direction

PO1, PO2‧‧‧ polygon scanning unit

PX‧‧‧ specific location

PX1, PX2‧‧‧ first and second specific positions

T1, T2‧‧‧ temperature measuring device

Fig. 1 is a view showing the configuration of a component manufacturing system of a first embodiment.

Fig. 2 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the first embodiment.

3 is a schematic view showing the arrangement of the illumination area and the projection area in FIG. 2.

Fig. 4 is a schematic view showing the configuration of a projection optical system suitable for the processing apparatus (exposure apparatus) of Fig. 2.

Fig. 5 is a perspective view of a rotary cylinder suitable for use in the processing apparatus (exposure apparatus) of Fig. 2.

Fig. 6 is a perspective view for explaining the relationship between the detecting probe and the reading device applied to the processing device (exposure device) of Fig. 2.

Fig. 7 is an explanatory view showing the position of the reading device when the scale disk of the first embodiment is viewed from the direction of the center line of rotation.

Fig. 8 is an explanatory view showing a temperature adjustment device according to the first embodiment.

Fig. 9 is an explanatory view showing an example of an alignment mark.

Fig. 10 is an explanatory view schematically showing a modification of one of the alignment marks due to the expansion and contraction of the substrate.

Fig. 11 is a flow chart showing an example of a procedure for correcting the processing of the processing apparatus (exposure apparatus) of the first embodiment.

Fig. 12 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the second embodiment.

Fig. 13 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the third embodiment.

Fig. 14 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment.

Fig. 15 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment.

Fig. 16 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to a sixth embodiment.

Fig. 17 is a flow chart showing a method of manufacturing a device using the processing apparatus (exposure apparatus) of the first embodiment.

The form (embodiment) for carrying out the invention will be described in detail below with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, among the constituent elements described below, of course, those substantially conceivable by those skilled in the art are substantially the same. Furthermore, the constituent elements described below can be combined as appropriate. Further, various omissions, substitutions, and alterations of the components may be made without departing from the scope of the invention. For example, in the following embodiments, the case where the flexible display is manufactured as an element will be described as an example, but the invention is not limited thereto. As the element, a wiring board, a semiconductor board, or the like may be manufactured.

(First embodiment)

In the first embodiment, the substrate processing apparatus that exposes the substrate to the substrate is an exposure apparatus. Further, the exposure apparatus is assembled in a component system for manufacturing various components by subjecting the exposed substrate to various processes. In the system. First, the component manufacturing system will be described.

<Component Manufacturing System>

Fig. 1 is a view showing the configuration of a component manufacturing system of a first embodiment. The component manufacturing system 1 shown in Fig. 1 is a production line (flexible display manufacturing line) for manufacturing a flexible display as a component. As the flexible display, for example, an organic EL display or the like is available. In the component manufacturing system 1, the substrate P is sent out from the supply reel FR1 in which the flexible substrate P is wound into a roll shape, and the processed substrate P is continuously subjected to various processes, and the processed substrate is processed. P is wound as a flexible element in the collection roll FR2, a so-called roll to roll method. In the component manufacturing system 1 of the first embodiment, the substrate P from which the film-form sheet is fed is fed from the supply reel FR1, and the substrate P sent from the supply reel FR1 is sequentially passed through n processing apparatuses U1. U2, U3, U4, U5, ... Un are wound up to the collection roll FR2. First, the substrate P to be processed by the component manufacturing system 1 will be described.

For the substrate P, for example, a foil made of a metal or an alloy such as a resin film or stainless steel is used. The material of the resin film includes, for example, a polyethylene resin, a polypropylene resin, a polyester resin, a vinyl ethylene copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin. One or more of polystyrene resin and vinyl acetate resin.

The substrate P is preferably selected such that the coefficient of thermal expansion is remarkably large, and the amount of deformation which can be generated by heat in various processes performed on the substrate P can be substantially ignored. The coefficient of thermal expansion can be set, for example, by mixing the inorganic filler into the resin film, and is set to be smaller than a threshold value corresponding to the process temperature or the like. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, cerium oxide or the like. Further, the substrate P may be a very thin glass having a thickness of 100 μm manufactured by a float method or the like. A laminate of the resin film, foil, or the like is bonded to the monolayer of glass or the ultra-thin glass.

The substrate P configured in this manner is wound into a roll shape to be a supply roll FR1, and the supply roll FR1 is attached to the component manufacturing system 1. The component manufacturing system 1 equipped with the supply reel FR1 repeatedly performs various processes for manufacturing one component on the substrate P sent from the supply reel FR1. Therefore, the processed substrate P is in a state in which a plurality of elements are connected. In other words, the substrate P sent from the supply reel FR1 is a multi-sided substrate. Further, the substrate P may be a person who has been modified by a predetermined pre-treatment, activating the surface, or forming a fine partition structure (concave-convex structure) for precise patterning on the surface.

The substrate P after the treatment is wound into a roll shape and recovered as a recovery roll FR2. The recycling reel FR2 is attached to the cutting device shown in the drawing. A cutting device equipped with a recycling reel FR2 divides (cuts) the processed substrate P into individual elements, thereby forming a plurality of elements. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short side) and 10 m or more in the longitudinal direction (direction of the strip). Of course, the size of the substrate P is not limited to the above size.

Next, the component manufacturing system 1 will be described with reference to Fig. 1 . In Fig. 1, the X direction, the Y direction, and the Z direction form an orthogonal orthogonal coordinate system. The X direction is in the horizontal plane, and the direction in which the supply reel FR1 and the recovery reel FR2 are connected is the left-right direction in FIG. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the front and rear directions in FIG. The Y direction is the axial direction of the supply reel FR1 and the recovery reel FR2. The Z direction is the vertical direction and is the upper and lower direction in FIG.

The component manufacturing system 1 includes a substrate supply device 2 that supplies the substrate P, a processing device U1 to Un that performs various processes on the substrate P supplied from the substrate supply device 2, and a substrate P that is processed by the processing device U1 to Un. Substrate recovery device 3, and control element manufacturing system Each device of the system 1 controls the device 5 above.

The supply reel FR1 is rotatably mounted to the substrate supply device 2. The substrate supply device 2 has an edge roller controller EPC1 that feeds the substrate P from the mounted supply roll FR1 and the position of the adjustment substrate P in the width direction (Y direction). The driving roller DR1 rotates while sandwiching the front and back surfaces of the substrate P, and feeds the substrate P from the supply reel FR1 toward the conveying reel FR2, whereby the substrate P is supplied to the processing devices U1 to Un. At this time, the edge position controller EPC1 moves the substrate P in such a manner that the position of the substrate P at the end portion (edge) in the width direction is within a range of ±10 μm to ± tens of μm with respect to the target position. The width direction is to correct the position of the substrate P in the width direction.

In the substrate recovery device 3, a recovery reel FR2 is rotatably mounted. The substrate recovery device 3 has an edge position controller EPC2 that pulls the processed substrate P toward the recovery roll FR2 side and the position of the adjustment substrate P in the width direction (Y direction). The substrate recovery device 3 rotates while holding the front and back surfaces of the substrate P by the driving roller DR2, pulls the substrate P in the transport direction, and rotates the recovery reel FR2 to wind the substrate P. At this time, the edge position controller EPC2 is configured similarly to the edge position controller EPC1 to correct the position of the substrate P in the width direction to prevent unevenness in the width direction of the end portion (edge) of the substrate P in the width direction.

The processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive decane coupling agent, a UV-curing resin liquid, or the like is used. The processing apparatus U1 is provided with the application mechanism Gp1 and the drying mechanism Gp2 in this order from the upstream side in the conveyance direction of the board|substrate P. The coating mechanism Gp1 has a press roll R1 for winding the substrate P and a coating roll R2 opposed to the press roll R1. Coating mechanism Gp1 at the office The substrate P to be supplied is wound around the press roll R1, and the substrate P is sandwiched between the press roll R1 and the application roll R2. Then, the application mechanism Gp1 rotates the pressure roller R1 and the application roller R2 to apply the photosensitive functional liquid to the application roller R2 while moving the substrate P in the conveyance direction. The drying mechanism Gp2 blows drying air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid to form photosensitivity on the substrate P. Functional layer.

The processing device U2 is a heating device that heats the substrate P transported from the processing device U1 to a predetermined temperature (for example, about 10 to 120 ° C) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. The processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in this order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 has a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air flip bars constitute a transport path of the substrate P. A plurality of rollers are disposed in contact with the back surface of the substrate P, and a plurality of air flip bars are provided on the surface side of the substrate P in a non-contact state. The plurality of rollers and the plurality of air flip levers are transport paths for lengthening the substrate P, and are in a serpentine transport path. The substrate P in the heating chamber HA1 is heated to a predetermined temperature while being conveyed along the meandering conveyance path. The cooling chamber HA2 cools the substrate P to the ambient temperature in order to match the temperature of the substrate P heated in the heating chamber HA1 with the ambient temperature of the post-processing (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers therein, and a plurality of rollers are arranged in a serpentine transport path in the same manner as the heating chamber HA1 in order to lengthen the transport path of the substrate P. The substrate P in the cooling chamber HA2 is cooled while being conveyed along the meandering conveyance path. On the downstream side in the transport direction of the cooling chamber HA2, a drive roller DR3 is provided, and the drive roller DR3 is rotated while sandwiching the substrate P passing through the cooling chamber HA2, whereby the substrate P is supplied to the processing device U3.

Processing device (substrate processing device) U3, supplied from the processing device U2, table An exposure device in which a substrate (photosensitive substrate) P of a photosensitive functional layer is formed on the surface, and a pattern such as a circuit or a wiring for display is exposed (transferred). The details will be described later, and the processing device U3 illuminates the penetrating or reflective cylindrical mask (mask) DM with an illumination beam, and passes through the illumination beam through the cylindrical mask (mask) DM, or The projection beam obtained by the reflection is projected and exposed on the substrate P. The processing device U3 has a drive roller DR4 that is sent from the processing device U2 to the downstream side of the transport roller DR4 and an edge position controller EPC that adjusts the position of the substrate P in the width direction (Y direction). The driving roller DR4 rotates while sandwiching both front and back surfaces of the substrate P, and feeds the substrate P to the downstream side in the transport direction, thereby supplying the substrate P toward the exposure position. The edge position controller EPC is configured similarly to the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position. The processing device U3 adjusts the temperature of the substrate P supplied from the edge position controller EPC by the temperature adjusting device 60, and then transports the substrate P by the driving roller DR5.

In addition, the processing unit U3 includes a buffer unit DL that transports the substrate P to the two sets of driving rollers DR6 and DR7 on the downstream side in the transport direction in a state where the exposed substrate P is slackened. The rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P. The driving roller DR6 holds the upstream side of the transported substrate P and rotates, and the driving roller DR7 holds the downstream side of the transported substrate P and rotates, whereby the substrate P is supplied to the processing device U4. At this time, since the substrate P is provided with slack, it is possible to absorb the fluctuation in the conveyance speed which is generated on the downstream side in the conveyance direction of the drive roller DR7, and it is possible to eliminate the influence of the fluctuation of the conveyance speed on the exposure processing of the substrate P. Further, in the processing device U3, in order to perform alignment (alignment) of the image of a portion of the mask pattern of the cylindrical mask (mask) DM with the substrate P, the detection is provided in advance on the substrate. Alignment microscopes AMG1, AMG2 of alignment marks of P and the like.

The processing device U4 is based on the exposure after being transferred from the processing device U3. The plate P is a wet processing apparatus which performs a wet development process, an electroless plating process, or the like. The processing apparatus U4 has three processing tanks BT1, BT2, and BT3 which are stepped in the vertical direction (Z direction) and a plurality of rollers that transport the substrate P. The plurality of rollers are arranged such that the substrate P sequentially passes through the transport paths inside the three processing tanks BT1, BT2, and BT3. A driving roller DR8 is provided on the downstream side in the conveying direction of the processing tank BT3, and the driving roller DR8 is rotated while sandwiching the substrate P that has passed through the processing tank BT3, whereby the substrate P is supplied to the processing apparatus U5.

Although not shown in the drawings, the processing device U5 is a drying device that dries the substrate P transferred from the processing device U4. The processing device U5 adjusts the moisture content of the substrate P to the substrate P by the processing device U4 to a predetermined moisture content. The substrate P dried by the processing device U5 is transported to the processing device Un via a plurality of processing devices. After being processed by the processing apparatus Un, the substrate P is wound around the collection reel FR2 of the substrate recovery apparatus 3.

The upper control device 5 collectively controls the substrate supply device 2, the substrate recovery device 3, and a plurality of processing devices U1 to Un. The upper control device 5 controls the substrate supply device 2 and the substrate recovery device 3, and transports the substrate P from the substrate supply device 2 to the substrate recovery device 3. Further, the upper control device 5 controls a plurality of processing devices U1 to Un in synchronization with the transfer of the substrate P to perform various processes on the substrate P.

<Exposure device (substrate processing device)>

Next, the configuration of the exposure apparatus (substrate processing apparatus) as the processing apparatus U3 of the first embodiment will be described with reference to Figs. 2 to 4 . Fig. 2 is a view showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. Fig. 3 is a view showing the arrangement of an illumination area and a projection area of the exposure apparatus shown in Fig. 2. Fig. 4 is a view showing the configuration of a projection optical system of the exposure apparatus shown in Fig. 2.

As shown in FIG. 2, the processing apparatus U3 includes an exposure apparatus (processing means) EX, a conveying apparatus 9, and a temperature adjustment apparatus 60. In the exposure apparatus EX, the substrate P (sheet, film, or the like) is supplied by the transport device 9. The exposure apparatus EX is a so-called scanning exposure apparatus that synchronously drives the rotation of the cylindrical mask DM and the conveyance of the flexible substrate P, and transmits the image of the pattern formed in the cylindrical mask DM by a magnification of the magnification (× 1) The projection optical system PL (PL1 to PL6) is projected onto the substrate P. Further, in the exposure apparatus EX shown in FIG. 2, the Y axis of the XYZ orthogonal coordinate system is set to be parallel to the rotation center line AX1 of the first drum member 21. Similarly, the exposure device EX sets the Y axis of the XYZ orthogonal coordinate system to be parallel to the rotation center line AX2 of the second roller member 22 which is the rotating cylinder.

As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 12, an illumination unit IU, a projection optical system PL, and a control device 14. The exposure apparatus EX rotates the cylindrical mask DM held by the mask holding device 12, and conveys the substrate P by the conveyance device 9. The illumination mechanism IU is held in a portion (illumination area IR) of the cylindrical mask DM of the mask holding device 12, and is illuminated by the illumination beam EL1 with uniform brightness. The projection optical system PL projects an image of the pattern of the illumination region IR on the cylindrical mask DM onto a portion (projection area PA) of the substrate P transported by the transport device 9. As the cylindrical mask DM moves, the portion disposed on the cylindrical mask DM of the illumination region IR changes, and as the substrate P moves, the portion disposed on the substrate P of the projection region PA changes. Accordingly, the image of the predetermined pattern (mask pattern) on the cylindrical mask DM is projected onto the substrate P. The control device 14 controls each unit of the exposure device EX to perform processing in each unit. Further, in the present embodiment, the control device 14 controls the transport device 9.

Further, the control device 14 may be a part or all of the plurality of processing device upper control devices 5 that collectively control the component manufacturing system 1. In addition, the control device 14 can also Therefore, it is controlled by the upper control device 5 and is different from the upper control device 5. The control device 14 includes, for example, a computer system. The computer system includes, for example, a CPU and various hardware such as an OS, a peripheral device, and the like. The operation process of each part of the processing device U3 may be stored in a memory portion of a computer-readable recording medium in a program format, and the program is read and implemented by the computer system to perform various processes. A computer system, when connected to the Internet or an internal network system, also includes an environment (or display environment) provided by the home page. Further, the computer readable recording medium includes a removable medium such as a floppy disk, an optical disk, a ROM, a CD-ROM, and a hard disk built in a computer system. The computer-readable recording medium also includes a communication line in the case of sending a program through a communication line such as the Internet or a telephone line, and can maintain the programmer in a short time and in a dynamic manner, and the server at this time. Like the volatile memory inside the client's computer system, it can keep the programmer for a certain period of time. Furthermore, the program may be part of the function of the processing device U3, or may be combined with a program already stored in the computer system to implement the function of the processing device U3. The upper control device 5 can be realized by a computer system similarly to the control device 14.

As shown in FIG. 2, the mask holding device 12 includes a first roller member 21 that holds the cylindrical mask DM, a guide roller 23 that supports the first roller member 21, and a first drive unit 26 according to a control command from the control device 14. The driving roller 24 of the first roller member 21 and the first detector 25 that detects the position of the first roller member 21 are driven.

The first roller member 21 has a cylindrical member that is bent from a curved center line AX1 (hereinafter, also referred to as a first central axis AX1) which is a predetermined axis, and has a curved surface that is curved at a predetermined radius. The first roller member 21 forms a first surface P1 in which the illumination region IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a line in which a line (bus) is parallel to the line. (the first central axis AX1) The surface to be rotated (hereinafter referred to as a cylindrical surface). The cylindrical surface is, for example, a peripheral surface other than the cylinder, a cylindrical outer surface, or the like. The first roller member 21 is formed of, for example, glass or quartz, and has a cylindrical shape having a constant thickness, and an outer peripheral surface (cylindrical surface) is formed as the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical shape having a constant radius r1 from the rotation center line AX1. In this manner, the first roller member 21 has a curved surface that is curved at a constant radius from the predetermined axis rotation center line AX1. The first roller member 21 is driven by the drive roller 24 to rotate about a predetermined axis rotation center line AX1.

The cylindrical reticle DM is formed into a transmissive planar sheet-shaped reticle having a pattern formed by a light-shielding layer such as chrome, for example, on a short strip-shaped ultra-thin glass plate (for example, a thickness of 100 μm to 500 μm) having good flatness. In the mask holding device 12, the cylindrical mask DM is bent in accordance with the curved surface of the outer peripheral surface of the first roller member 21, and is used in a state of being wound (attached) to the curved surface. The cylindrical mask DM has a pattern non-formation region in which no pattern is formed, and is attached to the first roller member 21 in the pattern non-formation region. The cylindrical mask DM can be released with respect to the first roller member 21.

Further, instead of forming the cylindrical mask DM with an extremely thin glass plate, the cylindrical mask DM may be wound around a first cylindrical member 21 made of a transparent cylindrical base material, and formed of a transparent cylindrical base material. The outer peripheral surface of the first roller member 21 is directly formed by forming a mask pattern formed of a light shielding layer such as chrome, and is integrated. In this case, the first roller member 21 serves as a support member for the pattern of the cylindrical mask DM.

The first detector 25 optically detects the rotational position of the first roller member 21, and is configured by, for example, a rotary encoder. The first detector 25 outputs the detected information indicating the rotational position of the first roller member 21 to, for example, a 2-phase signal from the encoder head described later to the control device 14. The first driving unit 26 including an actuator such as an electric motor is controlled by the slave The control signal input from the device 14 adjusts the torque and the rotational speed for rotating the drive roller 24. The control device 14 controls the first drive unit 26 based on the detection result of the first detector 25 to control the rotational position of the first roller member 21. The control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first roller member 21.

The second roller member 22 has a curved surface (first curved surface) curved at a constant radius from a rotation center line AX2 (hereinafter also referred to as a second central axis AX2) which is a predetermined axis, and is rotated around a predetermined axis. Rotating cylinder. The second roller member 22 forms a second surface (support surface) P2 that supports a part of the projection area PA on the substrate P on which the imaging light beam from the projection optical system PL is projected in an arc shape (cylindrical shape). Further, the second roller member 22 is a drive roller DR5 that is rotated by a torque supplied from a second drive unit 36 including an actuator such as an electric motor.

As described above, the second roller member 22 drives the roller DR5 and serves as a substrate supporting member (substrate stage) that supports the exposure (processing) target substrate P. That is, the second roller member 22 may be a part of the exposure device EX. The second roller member 22 is rotatable around the rotation center line AX2 (second center axis AX2) of the second roller member 22, and the substrate P is bent into a cylinder along the outer circumferential surface (cylindrical surface) of the second roller member 22. In the planar shape, the projection area PA is disposed in one of the curved portions.

In the present embodiment, the chief ray passing through the center point of the projection area PA among the imaging light beams EL2 reaching the projection area PA is viewed from the second central axis AX2 of the second roller member 22 as shown in FIG. The center plane P3 is disposed at each of the first specific position PX1 and the second specific position PX2 at the position of the circumferential direction angle θ. When viewed from the rotation center line AX2, the specific position PX between the first specific position PX1 and the second specific position PX2 is the center of the region where the substrate P of the curved surface of the second roller member 22 is exposed to the average.

The conveying device 9 includes a driving roller DR4 and a second roller member 22 (driving roller) DR5), and drive roller DR6. The transport device 9 moves the substrate P in the transport direction of the transport substrate P so that the substrate P passes through the first specific position PX1, the specific position PX, and the second specific position PX2. The second drive unit 36 adjusts the torque for rotating the second roller member 22 in accordance with the control signal output from the control device 14.

In the present embodiment, the substrate P transported from the upstream of the transport path to the drive roller DR4 is transported to the temperature adjustment device 60 via the drive roller DR4. The temperature adjustment device 60 adjusts the temperature of the substrate P before the supply to the second roller member 22 in accordance with the control signal output from the control device 14. The substrate P whose temperature has been adjusted is guided to the first guide 31 and the second guide 32 via the temperature adjustment device 60, and is transported to the second roller member 22. The substrate P is supported by the surface of the second roller member 22 and is transported to the third guide 33. The substrate P passing through the third guide 33 is transported to the downstream of the transport path. Further, the rotation center line AX2 of the second roller member 22 (driving roller DR5) and the respective rotation center lines of the driving rollers DR4 and DR6 are set to be parallel to the Y axis.

The first guide 31, the second guide 32, and the third guide 33 that guide the substrate P are disposed around the second roller member 22 so as to restrict the conveyance direction of the substrate P. The second roller member 22 is a portion of the substrate P that is wound, and supports a transport direction from the substrate P to the transport direction of the curved surface of the second surface P2 to the position IA, and the transfer direction of the curved surface from which the substrate P starts to separate from the second surface P2. Substrate P up to here. For example, the second guide 32 and the third guide 33 are moved in the transport direction of the substrate P to adjust the tension acting on the substrate P in the transport path. Further, the second guide 32 and the third guide 33 can be adjusted to the above-described entry position IA and the release position OA of the outer circumference of the second roller member 22 by, for example, moving in the conveyance direction of the substrate P. Further, the transport device 9, the first guide 31, the second guide 32, and the third guide 33 are only required to transport the substrate P along the projection area PA of the projection optical system PL, and the transport device 9 and the first guide 31 are provided. , the second guide The configuration of the 32 and the third guide 33 can be appropriately changed.

The second detector 35 is configured by, for example, a rotary encoder, and optically detects the rotational position of the second roller member 22. The second detector 35 outputs the detected information indicating the rotational position of the second roller member 22 (for example, a 2-phase signal from the encoder heads EN1, EN2, EN3, EN4, and EN5, which will be described later) to the control device 14 . The control device 14 controls the second drive unit 36 based on the detection result of the second detector 35 to control the rotational position of the second roller member 22 to cause the first roller member 21 (cylindrical mask DM) and the second roller member 22 Synchronous movement (synchronous rotation). The detailed configuration of the second detector 35 will be described later.

The exposure apparatus EX of the present embodiment is set as an exposure apparatus in which a multi-lens projection optical system PL is mounted. The projection optical system PL includes a plurality of projection modules that project a part of the image of the cylindrical mask DM. For example, in FIG. 2, three projection modules (projection optical systems) PL1, PL3, and PL5 are arranged at a predetermined interval on the left side of the center plane P3 in the Y direction, and are disposed on the right side of the center plane P3 at regular intervals in the Y direction. Projection modules (projection optics) PL2, PL4, PL6.

In the multi-lens type exposure apparatus EX, the Y-direction end portions of the regions (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 are superimposed on each other by scanning, thereby projecting the entire desired pattern. image. In the case where the exposure apparatus EX has a large size in the Y direction on the cylindrical mask DM and inevitably processes the substrate P having a large width in the Y direction, it is only necessary to set the projection module PL in the Y direction. Since the illumination unit IU side module of the projection module PL can be used, it has an advantage that the panel size (substrate P width) can be easily increased.

Further, the exposure apparatus EX may not be of a multi-lens type. For example, when the dimension of the substrate P in the width direction is somewhat small, the exposure apparatus EX may be one projection. The module projects the image of the full width of the pattern onto the substrate P. Further, the plurality of projection modules PL1 to PL6 may respectively project a pattern corresponding to one element. That is, the exposure device EX can use a plurality of components to pattern and simultaneously project a plurality of projection modules.

The illumination unit IU of the present embodiment includes a light source device 13 and an illumination optical system. The illumination optical system includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device 13 includes a light source such as a mercury lamp or a solid-state light source such as a laser diode or a light-emitting diode (LED). The illumination light emitted from the light source device 13 is, for example, a far-ultraviolet light (DUV light) such as a bright line (g line, h line, i line) emitted from a light source, KrF excimer laser light (wavelength 248 nm), or an ArF excimer. Light (wavelength 193 nm) and the like. The illumination light emitted from the light source device 13 is equalized and distributed to a plurality of illumination modules IL through a light guiding member such as an optical fiber.

Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses. In the present embodiment, the light that is emitted from the light source device 13 and passes through any one of the plurality of illumination modules IL is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, etc., and the illumination region IR is illuminated by the illumination beam EL1 having a uniform illumination distribution. In the present embodiment, a plurality of illumination modules IL are disposed inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates the illumination regions IR of the mask pattern formed on the outer circumferential surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

Fig. 3 is a view showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. Further, in Fig. 3, a plan view (left side view in Fig. 3) of the illumination region IR disposed on the cylindrical mask DM of the first roller member 21 as viewed from the -Z side is shown, and is viewed from the +Z side. A plan view of the projection area PA disposed on the substrate P of the second roller member 22 (the right side in FIG. 3) Figure). The symbol Xs in Fig. 3 indicates the rotation direction (moving direction) of the first roller member 21 or the second roller member 22.

A plurality of illumination modules IL respectively illuminate the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1 and the second illumination module IL to illuminate the second illumination region IR2.

The first illumination region IR1 is described as a trapezoidal region that is elongated in the Y direction. However, when the projection optical system is configured to form an intermediate image plane like the projection optical system (projection module) PL, the position of the intermediate image can be A field diaphragm having a trapezoidal opening is disposed, and thus may be a rectangular region including the trapezoidal opening. Each of the third illumination region IR3 and the fifth illumination region IR5 is a region having the same shape as the first illumination region IR1, and is disposed at a constant interval in the Y-axis direction. Further, the second illumination region IR2 is a trapezoidal (or rectangular) region in which the center plane P3 and the first illumination region IR1 are symmetrical. Each of the fourth illumination region IR4 and the sixth illumination region IR6 is a region having the same shape as the second illumination region IR2, and is arranged at a constant interval in the Y-axis direction.

As shown in FIG. 3, each of the first to sixth illumination regions IR1 to IR6 is arranged such that the triangular portion of the oblique portion of the adjacent trapezoidal illumination region overlaps when viewed in the circumferential direction of the first surface P1. . Therefore, for example, the first region A1 on the cylindrical mask DM that has passed through the first illumination region IR1 by the rotation of the first roller member 21 passes through the circle of the second illumination region IR2 by the rotation of the first roller member 21 The second area A2 on the barrel mask DM partially overlaps.

In the present embodiment, the cylindrical mask DM includes a pattern forming region A3 in which a pattern is formed and a pattern non-forming region A4 in which no pattern is formed. The pattern non-formation region A4 is arranged to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern forming region A3 of the cylindrical mask DM moves in the moving direction as the first roller member 21 rotates. Xs, each partial region in the Y-axis direction in the pattern forming region A3 passes through one of the first to sixth illumination regions IR1 to IR6. In other words, the first to sixth illumination regions IR1 to IR6 are arranged to cover the full width in the Y-axis direction of the pattern formation region A3.

As shown in FIG. 2, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction corresponds to each of the first to sixth illumination modules IL, and the illumination of the corresponding illumination module is illuminated. An image of a partial pattern of the cylindrical mask DM appearing in the area IR is projected onto each of the projection areas PA on the substrate P.

For example, the first projection module PL1 corresponds to the first illumination module IL, and projects the image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 3) illuminated by the first illumination module IL. The first projection area PA1 on the substrate P. The third projection module PL3 and the fifth projection module PL5 correspond to the third and fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are disposed at positions overlapping the first projection module PL1 as viewed in the Y-axis direction.

Further, the second projection module PL2 corresponds to the second illumination module IL, and projects the image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 3) illuminated by the second illumination module IL. The second projection area PA2 on the substrate P. The second projection module PL2 is disposed at a position symmetrical with respect to the first projection module PL1 across the center plane P3 as viewed in the Y-axis direction.

The fourth projection module PL4 and the sixth projection module PL6 are disposed corresponding to the fourth and sixth illumination modules IL, respectively, and the fourth projection module PL4 and the sixth projection module PL6 are arranged in the Y-axis direction. A position overlapping with the second projection module PL2.

Further, in the present embodiment, the light reaching the illumination regions IR1 to IR6 on the cylindrical mask DM from the illumination modules IL of the illumination unit IU is the illumination light beam EL1. Moreover, the intensity distribution of a part of the pattern of the cylindrical mask DM appearing in each of the illumination areas IR1 to IR6 is adjusted. After that, the light is incident on each of the projection modules PL1 to PL6 and reaches the respective projection areas PA1 to PA6, and is set as the imaging light beam EL2. Among the imaging light beams EL2 reaching the respective projection areas PA1 to PA6, the chief rays passing through the respective center points of the projection areas PA1 to PA6 are arranged as viewed from the second central axis AX2 of the second roller member 22 as shown in Fig. 2 At a position (specific position) at which the center plane P3 is at the circumferential angle θ.

As shown in FIG. 3, the image of the pattern of the first illumination area IR1 is projected on the first projection area PA1, and the image of the pattern of the third illumination area IR3 is projected on the third projection area PA3 and the fifth illumination area IR5. The image of the pattern is projected on the fifth projection area PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

Further, an image of the pattern in the second illumination region IR2 is projected on the second projection region PA2. In the present embodiment, the second projection area PA2 is disposed symmetrically with respect to the first projection area PA1 as viewed from the Y-axis direction. Further, an image of the pattern of the fourth illumination region IR4 is projected on the fourth projection region PA4, and an image of the pattern in the sixth illumination region IR6 is projected on the sixth projection region PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

When viewed in the circumferential direction of the second surface P2, each of the first to sixth projection regions PA1 to PA6 is arranged such that adjacent projection regions (odd and even) are parallel to the second central axis AX2. The ends (triangular portions of the trapezoids) overlap. Therefore, for example, the third region A5 on the substrate P passing through the first projection region PA1 by the rotation of the second roller member 22 and the substrate P passing through the second projection region PA2 by the rotation of the second roller member 22 are used. The fourth area A6 partially overlaps. The first projection area PA1 and the second projection area PA2 are each shaped and the like. The exposure amount in the region where the third region A5 overlaps with the fourth region A6 is set to be substantially the same as the exposure amount in the non-overlapping region. The first to sixth projection areas PA1 to PA6 are arranged to cover the full width in the Y direction of the exposure area A7 exposed on the substrate P.

Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to Fig. 4 . Further, in the present embodiment, each of the second projection module PL2 to the fifth projection module PL5 is configured similarly to the first projection module PL1. Therefore, the configuration of the first projection module PL1 on behalf of the projection optical system PL will be described, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.

The first projection module PL1 shown in FIG. 4 includes a first optical system 41 that images an image of the pattern of the cylindrical mask DM disposed in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41. At least a part of the formed intermediate image is re-imaged on the second optical system 42 of the first projection area PA1 of the substrate P and the first field stop 43 disposed on the intermediate image plane P7 of the intermediate image.

Further, the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of the pattern image (hereinafter, referred to as projection image) of the photomask formed on the substrate P. Further, the displacement correcting optical member 45 is a displacement adjusting device that slightly shifts the projected image in the image plane. The magnification correction optical member 47 is a magnification adjustment device that slightly corrects the magnification of the projection image. The rotation correcting mechanism 46 is a displacement adjusting device that slightly rotates the projected image in the image plane.

The imaging light beam EL2 from the pattern of the cylindrical mask DM is emitted from the first illumination region IR1 in the normal direction (D1), and is incident on the image displacement correction optical member 45 through the focus correction optical member 44. The imaging light beam EL2 penetrating the image correcting optical member 45 is used as the first optical system 41 The first reflecting surface (the plane mirror) p4 of the first deflecting member 50 is reflected by the first lens group 51, and is reflected by the first concave mirror 52, and passes through the first lens group 51 again on the second reflecting surface of the first deflecting member 50. After the (planar mirror) p5 is reflected, it enters the first field stop 43. The imaging beam EL2 of the first field stop 43 is reflected by the third reflecting surface (planar mirror) p8 of the second deflecting member 57 which is a requirement of the second optical system 42, and is reflected by the second concave mirror 59 by the second lens group 58. The second lens group 58 is again reflected by the fourth reflecting surface (planar mirror) p9 of the second deflecting member 57, and then incident on the magnification correcting optical member 47. The image forming light beam EL2 emitted from the magnification correcting optical member 47 is incident on the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination region IR1 is projected to the first projection at a magnification (×1). Area PA1.

The radius of the cylindrical mask DM shown in FIG. 2 is the radius r1, and the radius of the cylindrical surface of the substrate P wound around the second roller member 22 is the radius r2. When the radius r1 is equal to the radius r2, The chief ray of the imaging beam EL2 on the reticle side of each of the projection modules PL1 to PL6 is inclined to pass through the rotation center line AX1 of the cylindrical mask DM, and the inclination angle thereof and the imaging beam EL2 on the substrate P side are dominant. The inclination angle θ of the light (±θθ with respect to the center plane P3) is the same .

The angle θ 3 between the third reflecting surface p8 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ 2 between the second reflecting surface p5 of the first deflecting member 50 and the first optical axis AX3. Further, the angle θ 4 between the fourth reflecting surface p9 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle θ 1 between the first reflecting surface p4 of the first deflecting member 50 and the first optical axis AX3. . In order to provide the inclination angle θ, the angle θ 1 of the first reflection surface p4 of the first deflecting member 50 shown in FIG. 4 is smaller than 45° Δθ 1 with respect to the first optical axis AX3, and the second deflecting member 57 is provided. The angle θ 4 of the reflecting surface p9 with respect to the second optical axis AX4 is smaller than 45° by Δθ 4 . Δθ 1 and Δθ 4 are set to a relationship of Δθ 1 = Δθ 4 = θ/2 with respect to the angle θ shown in Fig. 2 .

Fig. 5 is a perspective view of a rotary cylinder suitable for use in the processing apparatus (exposure apparatus) of Fig. 2. Fig. 6 is a perspective view for explaining the relationship between the detecting probe and the reading device applied to the processing device (exposure device) of Fig. 2. Fig. 7 is an explanatory view for explaining the position of the reading device by observing the scale disk SD of the first embodiment from the direction of the rotation center line AX2. In addition, in FIG. 5, for the sake of convenience, only the illustration of the second to fourth projection areas PA2 to PA4 is displayed, and the illustration of the first, fifth, and sixth projection areas PA1, PA5, and PA6 is omitted.

The second detector 35 shown in FIG. 2 optically detects the rotational position of the second roller member 22, and includes a high roundness scale disk (scale member) SD and a reading device encoder read head EN1. EN2, EN3, EN4, EN5.

The scale disk SD is fixed to an end portion of the second roller member 22 that is orthogonal to the rotation axis ST of the second roller member 22. Therefore, the scale disk SD rotates integrally with the rotation axis ST about the rotation center line AX2. For example, a scale (lattice) as the scale portion GP is engraved on the outer surface of the scale disc SD. The scale portion GP is arranged in a ring shape along the circumferential direction in which the second roller member 22 rotates, and rotates around the rotation axis ST (the second central axis AX2) together with the second roller member 22 . The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP as viewed from the rotation axis ST (the second center axis AX2). The encoder read heads EN1, EN2, EN3, EN4, and EN5 are disposed opposite to the scale portion GP, and the scale portion GP can be read in a non-contact manner. Further, the encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second roller member 22.

The encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices that measure the sensitivity (detection sensitivity) in the tangential direction (in the XZ plane) of the scale portion GP. As shown in FIG. 5, the orientation of the encoder read heads EN1, EN2, EN3, EN4, EN5 (the angular direction in the XZ plane centered on the rotation center line AX2) is set to the orientation lines Le1, Le2, Le3, Le4, When Le5 is shown, as shown in Fig. 7, the encoder heads EN1 and EN2 are arranged such that the orientation lines Le1 and Le2 are set at an angle of ±θ° with respect to the center plane P3. Further, in the present embodiment, for example, the angle θ is 15°.

The projection modules PL1 to PL6 shown in FIG. 4 are processing units for the exposure apparatus EX in which the substrate P is an object to be processed and the substrate P is irradiated with irradiation light. The exposure device EX injects the principal rays of the two imaging light beams EL2 into the substrate P on the substrate P. The projection modules PL1, PL3, and PL5 are the first processing unit, and the projection modules PL2, PL4, and PL6 are the second processing units, and the principal rays of the two imaging light beams EL2 are incident on the substrate P on the substrate P, respectively. The substrate P is applied to a specific position of the irradiation treatment of the irradiation light. The specific position is a position at an angle ±θ of the center plane P3 in the circumferential direction of the substrate P on the curved surface of the second roller member 22 as viewed from the second central axis AX2 of the second roller member 22. The set orientation line Le1 of the encoder read head EN1 is identical to the inclination angle θ of the chief ray of the center point of each of the projection areas (projection fields) PA1, PA3, and PA5 passing through the odd number of projection modules PL1, PL3, and PL5 with respect to the center plane P3. The set orientation line Le2 of the encoder read head EN2 and the inclination angle θ of the chief ray relative to the center plane P3 passing through the center points of the projection areas (projection fields) PA2, PA4, and PA6 of the even number of projection modules PL2, PL4, and PL6 Consistent. Therefore, the encoder read head EN1 reads the reading device positioned at the scale portion GP that connects the first specific position PX1 and the second central axis AX2. On the other hand, the encoder read head EN2 reads a reading device positioned in the scale portion GP that connects the second specific position PX2 and the second central axis AX2.

The encoder read head EN4 is disposed on the side after the transport direction of the substrate P, that is, before the exposure position (projection area), and is set to set the orientation line of the encoder read head EN1 toward the rear side in the transport direction of the substrate P. Le1 is placed on the set bearing line Le4 about the axis of the rotation center line AX2. Further, the encoder read head EN5 is set to the rear side in the transport direction toward the substrate P. The set azimuth line Le1 of the encoder read head EN1 is rotated about the set azimuth line Le5 of the axis of the rotation center line AX2.

Further, the encoder read head EN3 is disposed opposite to the encoder read heads EN1 and EN2 on the opposite side of the rotation center line AX2, and the set orientation line Le3 is set on the center plane P3.

The scale member scale disc SD is made of a metal having a low thermal expansion, glass, ceramics, or the like as a base material, and has a large diameter (for example, a diameter of 20 cm or more) as much as possible in order to improve the measurement and resolving power. In FIG. 5, the diameter of the scale disc SD is smaller than the diameter of the second roller member 22, but the diameter of the outer peripheral surface of the substrate P may be wound by the outer peripheral surface of the second roller member 22. The so-called measurement Abbe error can be further reduced by conforming to the diameter of the scale portion GP of the scale disc SD (to make it substantially uniform).

The minimum pitch of the scale (lattice) engraved on the circumference of the scale portion GP is limited by the performance of the scale marking device of the processing scale disc SD. Therefore, if the diameter of the scale disc SD is made large, the angle measurement resolution corresponding to the minimum pitch can be improved accordingly.

The direction of the set azimuth lines Le1, Le2 of the encoder read heads EN1, EN2 of the read scale portion GP is arranged, and the principal ray of the imaging beam EL2 of the opposite substrate P is incident on the substrate P when viewed from the rotation center line AX2. The direction is the same. For example, even if the bearing supporting the rotating shaft ST is broken and there is a slight gap (about 2 μm to 3 μm) and the second roller member 22 is displaced in the X direction, the encoder reading head EN1 can be used. The EN2 high-precision measurement may cause a positional error in the transport direction (Xs) of the substrate P occurring in the projection areas PA1 to PA6 due to the displacement.

As shown in FIG. 6, in order to one portion of the substrate P supported by the curved surface of the second roller member 22, the image of a portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 is aligned with the substrate P. Having an alignment display for detecting an alignment mark or the like formed on the substrate P in advance Micromirrors AMG1, AMG2. The alignment microscopes AMG1 and AMG2 have detection probes for detecting a specific pattern formed discretely or continuously on the substrate P, and the detection region of the detection probe is set at a rear side of the substrate P in the transport direction from the specific position. In the manner, the pattern detecting device is disposed around the second roller member 22.

As shown in FIG. 6, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 can detect or detect the alignment marks formed at the both ends of the substrate P at any time by detecting the probes on both sides of the second roller member 22 in the Y-axis direction. In addition, the alignment microscopes AMG1 and AMG2 can detect or detect a plurality of detection probes formed on the substrate P in the longitudinal direction, for example, other than the both ends of the second roller member 22 in the Y-axis direction (the width direction of the substrate P). An alignment mark such as a white portion between the pattern forming regions of the display panel.

As shown in FIG. 6 and FIG. 7, the direction of the observation direction AM1 (toward the second central axis AX2) of the substrate P of the alignment microscope AMG1 is the same direction as viewed from the XZ plane and the rotation center line AX2. The encoder read head EN4 is disposed on the set azimuth line Le4 set in the diameter direction of the scale portion GP. In addition, when viewed from the XZ plane and the rotation center line AX2, it is set in the scale portion GP so as to be in the same direction as the detection center of the observation direction AM2 (toward the rotation center line AX2) of the substrate P of the alignment microscope AMG2. The encoder read head EN5 is arranged on the set direction line Le5 in the diameter direction. As described above, the detection probes of the alignment microscopes AMG1 and AMG2 are disposed around the second roller member 22 when viewed from the second central axis AX2, and connect the arrangement positions of the encoder read heads EN4 and EN5 with the second central axis. The direction of the AX2 (the azimuth lines Le4 and Le5) is arranged so as to match the direction in which the second central axis AX2 is connected to the detection areas of the alignment microscopes AMG1 and AMG2. Also, the alignment microscope AMG1, AMG2 and encoder read heads EN4, EN5 The position in the circumferential direction of the rotation center line AX2 is set between the entry position IA at which the substrate P starts to contact the second roller member 22 and the separation position OA at which the substrate P is separated from the second roller member 22.

In the observation direction AM2 of the alignment microscope AMG2, the alignment mark (formed in the vicinity of the end portion in the Y direction of the substrate P) is formed in the front side of the substrate P in the transport direction, that is, after the exposure position (projection region). In the state where the substrate P is transported at a predetermined speed, the image is detected at a high speed by a photographing element or the like, and the mark image is sampled at a high speed in the microscope field (photographing range). (sampling). At the instant of the sampling, the rotational angular position of the scale disc SD measured successively by the encoder read head EN5 is stored, and the position of the mark of the alignment mark on the substrate P and the rotational angle position of the second roller member 22 are obtained. Correspondence between the two.

On the other hand, the observation direction AM1 of the alignment microscope AMG1 is disposed on the rear side in the transport direction of the substrate P, that is, the exposure position (projection area), and the alignment mark formed in the vicinity of the Y-direction end portion of the substrate P is formed. The image (formed in the region of tens of μm to several hundreds of μm diagonal) is sampled at a high speed such as a photographic element, similarly to the alignment microscope AMG2, and stored at the instant of sampling, with the encoder read head EN4 The positional relationship between the position of the mark of the alignment mark on the substrate P and the position of the rotational angle of the second roller member 22 is obtained by sequentially measuring the rotational angle position of the scale disk SD.

When the mark detected by the microscope AMG1 is aligned and detected by the alignment microscope AMG2, the difference between the angular position measured and stored by the encoder read head EN4 and the angular position measured and stored by the encoder read head EN5 is The angles of the set orientation lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2 which are precisely corrected are compared. When the opening angle has an error, between the entering position IA and the disengaging position OA, the substrate P is likely to be in the second roller. The member 22 is slightly slid or stretched in the transport direction (circumferential direction) or the direction parallel to the second central axis AX2 (Y-axis direction).

In general, the positional error at the time of patterning is determined depending on the fineness of the element pattern formed on the substrate P and the accuracy of the overlap. For example, in order to accurately expose the line pattern of 10 μm wide to the bottom pattern layer, only An error of one-third or less is allowed, that is, when the size on the substrate P is converted, only a position error of about ±2 μm can be tolerated.

In order to achieve such high-precision measurement, it is necessary to measure the direction of the mark image of each of the alignment microscopes AMG1 and AMG2 (the tangential direction of the outer circumference of the second roller member 22 in the XZ plane) and the measurement of each of the encoder heads EN4 and EN5. The direction (the tangential direction of the outer circumference of the scale portion GP in the XZ plane) is uniform within the allowable angle error.

As described above, the encoder read heads EN4 and EN5 are arranged so as to coincide with the measurement direction of the alignment marks on the substrate P of the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second roller member 22). . Therefore, when the position detection of the substrate P (mark) of the alignment microscopes AMG1 and AMG2 is performed (during image sampling), even if the second roller member 22 (the scale disk SD) is disposed in the XZ plane, the orientation line Le4 or Le5 is set. When the circumferential direction (tangential direction) of the orthogonal direction is displaced, high-precision position measurement in consideration of the displacement of the second roller member 22 can be performed.

Since the encoder read heads EN1 to EN5 are arranged at five places around the scale portion GP of the scale disc SD as seen from the second central axis AX2, the measurement of the appropriate two or three encoder read heads by combining them is performed. The value output is subjected to arithmetic processing, and the roundness (shape distortion) of the scale portion GP of the scale disc SD, the eccentricity error, and the like can be obtained.

<temperature adjustment device>

As mentioned above, the substrate P may be due to the temperature environment inside the processing device U3. The expansion and contraction occurs in the conveyance direction (circumferential direction) or the direction parallel to the second central axis AX2 (Y-axis direction) depending on the temperature of the substrate P. The expansion and contraction is determined by the material properties of the substrate P, and may be a material that expands as the temperature of the substrate P increases, and a material that shrinks as the temperature of the substrate P increases. Fig. 8 is an explanatory view showing a temperature adjustment device according to the first embodiment. As shown in FIG. 2, the temperature adjustment device 60 is a device that adjusts the temperature of the upstream side in the transport direction of the substrate P passing through the first specific position PX1, the specific position PX, and the second specific position PX2. In the processing device U3, the temperature adjustment of the temperature adjustment device 60 of the substrate P guided from the first guide 31 and the second guide 32 is completed until the transfer to the entry position IA of the second roller member 22 is performed as much as possible. The shorter one is preferable, but it can also be determined by the difference between the temperature set by the temperature adjusting device 60 and the temperature of the second roller member 22. For example, since the second roller member 22 generally has a large heat capacity, it takes time to change the set temperature. Therefore, in order to maintain the second roller member 22 at a certain fixed temperature, the substrate supporting member temperature adjusting device 73 of FIG. 2 is always available. Continue to adjust the temperature. The temperature set by the temperature adjustment device 60 is determined based on the transport distance from the temperature adjustment device 60 to the entry position IA, the temperature of the transfer space therebetween, and the speed of the substrate P. For example, when the surface temperature of the second roller member 22 is 25 ° C, the temperature set by the temperature adjusting device 60, that is, the time (seconds) after the substrate P is moved and transported, is just lowered to 25 ° C. However, since the substrate P is generally thin and rapidly becomes an ambient temperature, it is preferable to shorten the transfer distance from the temperature adjusting device 60 to the entry position IA as much as possible, and predict and control the change temperature as described above.

The temperature adjustment device 60 includes a guide 61, a medium air blowing member 62, a blowing pressure equalizing member 63, a medium adjusting device 71, a heating unit HU, and a cooling unit CU. The medium air blowing member 62 transmits the medium to the substrate P through the air supply pressure equalizing member 63 of the medium formed of a porous material. The conveying device 9 passes the substrate P between the guide 61 and the medium blowing member 62. Space 67. The medium blowing member 62 sends the medium supplied from the medium adjusting device 71 through the medium supply line AP to the guide 61 side. The heating unit HU supplies the high temperature medium to the first medium supply unit of the media adjustment device 71 through the medium supply line HH. The cooling unit CU supplies a low temperature medium having a lower temperature than the high temperature medium of the heating unit HU to the second medium supply unit of the medium adjustment device 71 through the medium supply line CC. The media adjustment device 71 includes a flow rate adjustment valve 72H that adjusts the flow rate of the high temperature medium supplied from the media supply line HH to the media supply line AP, and a flow rate adjustment for adjusting the flow rate of the low temperature medium supplied from the media supply line CC to the media supply line AP. Valve 72C. The flow rate adjustment valve 72H and the flow rate adjustment valve 72C are configured by, for example, a solenoid valve. The media adjusting device 71 can adjust the temperature supplied to the air blowing member 62 by adjusting the amount of the high temperature medium passing through the flow regulating valve 72H and the amount of the low temperature medium passing through the flow regulating valve 72C according to the output of the control signal of the control device 14. The ratio of media to low temperature media. Therefore, the media adjusting device 71 can mix the high temperature medium and the low temperature medium as the medium supplied to the medium air blowing member 62 to circulate. The temperature adjusting device 60 allows the medium of any temperature to flow around the guide 61 to adjust the temperature of the substrate P. Further, a member equivalent to the air supply pressure equalizing member 63 in Fig. 8 may be disposed on the opposite side of the substrate P, and the temperature-adjusted medium may be blown to the opposite side of the substrate P through a member equivalent to the medium supply line AP. .

The substrate supporting member temperature adjusting device 73 is a device that is adjusted to the temperature of the second roller member 22 of the substrate supporting member. The substrate supporting member temperature adjusting device 73 is provided with a flow rate adjusting valve 74H that adjusts the flow rate of the high temperature medium supplied from the medium supply line HH to the medium supply line AD, and a flow rate for adjusting the low temperature medium supplied from the medium supply line CC to the medium supply line AD. Flow regulating valve 74C. The flow rate adjustment valve 74H and the flow rate adjustment valve 74C are configured by, for example, a solenoid valve. The substrate supporting member temperature adjusting device 73 can be controlled according to the control signal of the control device 14 The amount of the high temperature medium passing through the flow rate adjusting valve 74H and the amount of the low temperature medium passing through the flow rate adjusting valve 74C are adjusted to change the ratio of the high temperature medium to the low temperature medium supplied to the second roller member 22. Therefore, the substrate supporting member temperature adjusting device 73 can mix the high temperature medium and the low temperature medium as the medium supplied to the inside of the second roller member 22, and pass through the medium supply line AD to flow into the inside of the second roller member 22. The substrate supporting member temperature adjusting device 73 is preferably controlled by the control device 14 so that the temperature of the second roller member 22 can be maintained constant. In this way, the heat capacity of the substrate P that is in contact with the curved surface of the second roller member 22 can be kept substantially constant, and the expansion and contraction state of the substrate P generated by the curved surface of the second roller member 22 can be stabilized.

The temperature adjusting device 60 and the substrate supporting member temperature adjusting device 73 are devices for supplying the temperature-adjusted medium to the substrate P or the second roller member 22, but the medium may be such that the liquid is circulated in the pipeline and regulated by the radiant heat. The temperature of the substrate P or the second roller member 22. The medium adjusting device 71 and the substrate supporting member temperature adjusting device 73 can be configured, for example, by combining a heater and a heat sink.

The temperature measuring device T1 that detects the temperature of the substrate P before being conveyed by the guide 61 can output the detection result to the control device 14. The control device 14 can perform feedforward control of the temperature adjustment device 60 based on the detection result of the temperature measuring device T1. Further, the temperature measuring device T2 that detects the temperature of the substrate P after passing through the temperature adjusting device 60 (guide 61) can output the detection result to the control device 14. The temperature adjustment device 60 can be feedback controlled according to the detection result of the temperature measuring device T2. The control device 14 can control the temperature of the medium sent from the media blowing member 62 by performing at least one of feedforward control and feedback control on the temperature adjusting device 60 to improve the accuracy of the temperature applied to the substrate P. For example, the temperature measuring devices T1 and T2 can use a non-contact infrared thermometer or the like that measures infrared energy emitted from the substrate P.

As shown in Fig. 8, when the substrate P is passed through the space 67 between the guide 61 and the medium blowing member 62, it is preferable that the guide 61 has a supporting mechanism for the substrate P. The medium blowing member 62 transmits the medium from the medium supply line AP to the through-hole AH located in the blowing pressure equalizing member 63, and sends it to the blowing pressure equalizing member 63. Since the blowing pressure equalizing member 63 is made of, for example, a porous material, the medium can be ejected on the opposite surface 63S on the substrate P side so that the medium pressure per unit area is equal. The guide 61 includes a regulating member 64 that presses the end portion of the substrate P in the Y direction (width direction) and the regulating member 65. The regulating member 64 and the regulating member 65 are sandwiched in the width direction of the substrate P during the conveyance of the substrate P. The restricting member 65 is fixed to the inner side surface of the guide 61 through the bearing BE. The restricting member 64 is coupled to the magnet VCMm of the voice coil motor 66 via a spring SS. The position of the magnet VCMm in the Y direction changes according to the current flowing through the coil VCMc of the voice coil motor 66, and the voice coil motor 66 can change the position of the substrate P in the Y direction.

As shown in FIG. 2, an alignment microscope PMG1 for detecting an alignment mark or the like formed in advance on the substrate P is provided inside the temperature adjustment device 60 or on the exit side of the conveyance direction. There are a plurality of (for example, four) detection probes arranged in a line in the Y direction (the width direction of the substrate P) of the alignment microscope PMG1. Fig. 9 is an explanatory view showing an example of an alignment mark. The alignment microscope PMG1 shown in FIG. 2 can detect or detect the alignment marks formed near the both ends of the substrate P shown in FIG. 9 along the transport direction α at any time by the detection probes on both sides of the Y-direction of the guide 61. Ma.

Fig. 10 is an explanatory view schematically showing a modification of one of the alignment marks due to the expansion and contraction of the substrate. Fig. 11 is a flow chart showing an example of a procedure for correcting the processing of the processing apparatus (exposure apparatus) of the first embodiment. As shown in FIG. 10, the alignment microscope AMG1 is used as the first detection probe, and the alignment mark ma is detected in the range of the microscope field (imaging range) mam located in the observation direction (detection direction) AM1. Similarly, the alignment microscope PMG1 is used as the second detection probe. The alignment mark ma is detected within the range of the microscope field of view (photographing range) map in the detection direction PM1. In this manner, the alignment microscope AMG1 and the alignment microscope PMG1 detect the specific pattern alignment mark ma on the substrate P shown in FIG. 10 (step S11). The alignment microscope AMG1 outputs the image of the alignment mark ma to the control device 14, the control device 14 and the alignment microscope AMG1, and stores the alignment mark ma as image data in the memory portion of the control device 14 as the first pattern detecting device. The alignment microscope PMG1 outputs the image of the alignment mark ma to the control device 14, the control device 14 and the alignment microscope PMG1, and stores the alignment mark ma as image data in the memory portion of the control device 14 as the second pattern detecting device.

Secondly, by comparing the image data of the alignment mark ma of the microscope field (photographing range) stored in the memory portion with the image data of the alignment mark ma of the microscope field (photographing range) mam, there is no cause of the expansion and contraction of the substrate P. When the change of the image data of the quasi mark ? (step S12, No), the control device 14 performs the process of step S11. As shown in FIG. 10, it is found that the substrate P is found by comparing the image data of the alignment mark ma of the microscope field of view (photographing range) stored in the memory and the image of the alignment mark of the microscope field (photographing range) mam. When the expansion and contraction causes a change in the image data of the alignment mark ma (step S12, Yes), the control device 14 proceeds to the process of step S13. For example, there is a case where the image data of the alignment mark ma changes due to the expansion and contraction of the substrate P, as shown in FIG. 10, the change Δm of the image data of the alignment mark ma exceeds the image displacement correction of the displacement adjustment device. The optical member 45 allows for the case where the projected image can be slightly displaced laterally within the image plane. In addition, the change of the image data of the alignment mark ma due to the expansion and contraction of the substrate P means that the change Δm of the image data of the alignment mark ma exceeds that of the magnification correction optical member 47 of the magnification adjustment device. The case where the magnification of the image magnification can be slightly corrected.

Next, the control device 14 controls the media adjusting device 71 of the temperature adjusting device 60 according to the material of the substrate P so that the target width of the substrate P in the width direction becomes the target width PP as shown in FIG. 10, and the temperature adjustment of the substrate P is performed. (Step S13). The control device 14 continues the temperature adjustment of the substrate P when the specific substrate temperature is not reached (step S14, No) based on the detection results of the temperature measuring devices T1 and T2 (step S13). The control device 14 proceeds to the process of step S15 when the specific substrate temperature is reached based on the detection results of the temperature measuring devices T1 and T2 (step S14, Yes).

Next, the exposure device EX performs the image display by the image displacement adjusting device based on the change Δm of the alignment mark ma (specific pattern) obtained from the output of the first pattern detecting device and the second pattern detecting device. The projection image of the displacement is corrected (step S15). Further, in the exposure apparatus EX, the magnification adjustment apparatus may perform the correction projection image based on the change Δm of the alignment mark ma (specific pattern) obtained from the output of the first pattern detection device and the second pattern detection device. The magnification of the cast image correction. Alternatively, the exposure device EX may be changed by the magnification adjustment device and the image displacement adjusting device based on the change of the alignment mark ma (specific pattern) obtained from the output of the first pattern detecting device and the second pattern detecting device. The correction of the projection image of the displacement and magnification of the corrected projection image is performed.

As described above, the processing device U3 can adjust the temperature of a portion of the substrate P wound before the second roller member 22 by the temperature adjusting device 60 so as to be at the first specific position PX1, the specific position PX, or the second specific The expansion and contraction state of the substrate P at the position PX2 is stable. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

The substrate wound before the second roller member 22 is adjusted by the temperature adjusting device 60 The temperature of one part of P can suppress the expansion and contraction of the substrate P in the range in which the magnification adjustment device and the image displacement adjustment device can correct the projection image. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

Further, in the present embodiment, the substrate supporting member temperature adjusting device 73 that controls the temperature of the outer peripheral surface (support surface) of the second roller member 22 and the temperature adjusting device 60 provided on the upstream side of the second roller member 22 are provided. The arrangement is performed in the transport direction of the substrate P, and the substrate P has a temperature control with a certain temperature difference between the specific position of the alignment position or the exposure position and the position on the upstream side. In this manner, the amount of expansion and contraction of the substrate P at the time when the substrate P is supported by the second roller member 22 can be adjusted. In this case, if the temperature of the substrate P set by the temperature adjusting device 60 is Tu and the temperature of the substrate P set by the substrate supporting member temperature adjusting device 73 through the second roller member 22 is Td, it is set to Tu>Td or Tu. <Td, temperature control is performed in such a manner that the difference is substantially constant.

(Second embodiment)

Next, a second embodiment of the processing apparatus of the present invention will be described with reference to Fig. 12 . Fig. 12 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the second embodiment. In the drawings, the same components as those in the first embodiment are denoted by the same reference numerals, and their description will be omitted.

As shown in FIG. 12, the temperature adjustment device 60A has a curved surface (second curved surface) 61S bent at a constant radius r3 from a parallel reference axis BX1 parallel to the second central axis AX2, and a guide member having a portion of the substrate P contacting the curved surface 61S. 32A, and media conditioning device 71 that circulates the temperature-regulated media to space 67 around guide 32A. The conveying device 9 passes the substrate P through the space 67 between the guide 32A and the medium blowing member 62A. The medium blowing member 62A sends the medium supplied from the medium adjusting device 71 through the medium supply line AP to the guide 32A side. Guide 32A, due to parallel The reference axis BX1 is curved along the curved surface 61S, so that the disordered airflow of the space 67 can be suppressed.

The temperature adjusting device 60A transfers the temperature of the medium to the substrate P by circulating the temperature-regulated medium to the space 67 around the guide 32A. In the guide member 32A, since one portion of the substrate P is in contact with the curved surface 61S, the substrate P can be directly supplied from the guide 32A to the second roller member 22, and the distance from the guide 32A to the second roller member 22 can be shortened. Therefore, the processing device U3 can suppress the expansion and contraction state of the substrate P adjusted by the temperature adjustment of the temperature adjustment device 60A, and changes during the period from the temperature adjustment device 60A to the second roller member 22.

The radius r3 of the curved surface 61S of the guide 32A is preferably the same as the radius r2 of the second roller member 22. With this configuration, the tension acting on the substrate P wound around the second roller member 22 can be made the same as the tension acting on the substrate P wound around the guide 32A. As a result, an error caused by the tension difference can be suppressed from the change in the alignment mark, and the change in the alignment mark due to the temperature can be detected.

(Third embodiment)

Next, a third embodiment of the processing apparatus of the present invention will be described with reference to FIG. Fig. 13 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to a third embodiment. In the drawings, the same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and their description is omitted.

As shown in Fig. 13, in the processing apparatus U3 of the third embodiment, the medium adjusting device 71 is used as a guide temperature adjusting device for the adjustment guide 32A. The media adjusting device 71 can mix the high temperature medium and the low temperature medium as the medium supplied to the inside of the guide 32A and circulate it. The media adjusting device 71 is controlled by the control device 14 to adjust the temperature of the guide 32A, and transmits the temperature of the guide 32A to the substrate P that is in contact with the guide 32A. Thus, it is transmitted to the curved surface 61S of the guide member 32A. The heat capacity of the substrate P that is in contact with is substantially maintained at a constant level.

The radius r3 of the curved surface 61S of the guide 32A is preferably the same as the radius r2 of the second roller member 22. With this configuration, the tension acting on the substrate P wound around the second roller member 22 can be made the same as the tension acting on the substrate P wound around the guide 32A. For example, the heat capacity of the substrate P that is transmitted by the medium adjusting device 71 and is in contact with the curved surface 61S of the guide 32A is matched with the heat capacity of the substrate P that is in contact with the curved surface of the second roller member 22, thereby improving The prediction accuracy of the alignment mark detected by the alignment microscope PMG1 in alignment with the alignment mark of the microscope AMG1.

(Fourth embodiment)

Next, a fourth embodiment of the processing apparatus of the present invention will be described with reference to Fig. 14 . Fig. 14 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. In the drawings, the same components as those of the first embodiment to the third embodiment are denoted by the same reference numerals, and their description will be omitted. The exposure device EX2 emits the illumination light beam EL1 of the illumination cylindrical mask DM from the light source.

The illumination beam EL1 emitted from the light source is led to the illumination module IL. When a plurality of illumination optical systems are provided, the illumination beam EL1 from the light source is separated into a plurality of strips, and the plurality of illumination beams EL1 are guided to a plurality of illumination modes. Group IL.

Here, the illumination light beam EL1 emitted from the light source enters the polarization beam splitters SP1, SP2. In the polarization beam splitters SP1 and SP2, in order to suppress energy loss due to separation of the illumination light beam EL1, it is preferable to form a light beam which can completely reflect the incident illumination light beam EL1. Here, the polarization beam splitters SP1 and SP2 transmit a light beam that is linearly polarized by S-polarized light and a light beam that is linearly polarized by P-polarized light. Therefore, the light source is such that the illumination beam EL1 that is incident on the polarization beam splitters SP1, SP2 The illumination light beam EL1 that becomes a linearly polarized (S-polarized) light beam is emitted to the first roller member 21. In this way, the light source emits an illumination light beam EL1 having a uniform wavelength and phase.

The polarization beam splitters SP1 and SP2 transmit the imaging light beam (projection beam) EL2 reflected by the cylindrical mask DM while reflecting the illumination light beam EL1 from the light source. In other words, the illumination light beam EL1 from the illumination optical module is incident as a reflected beam into the polarization beam splitters SP1, SP2, and the imaging light beam EL2 from the cylindrical mask DM is incident on the polarization beam splitters SP1, SP2 as a transmitted beam.

As described above, the illumination module EL1 of the processing unit performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM as the object to be processed. According to this, the projection optical system PL can project the image of the pattern in the illumination region IR on the cylindrical mask DM to a portion (projection area PA) of the substrate P transported by the transport device 9. The exposure apparatus EX2 can perform processing for irradiating the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light by the projection light beam reflected by the cylindrical mask DM.

(Fifth Embodiment)

Next, a fifth embodiment of the processing apparatus of the present invention will be described with reference to Fig. 15 . Fig. 15 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to a fifth embodiment. In the drawings, the same components as those of the first embodiment to the fourth embodiment are denoted by the same reference numerals, and their description will be omitted. The exposure apparatus EX3 includes a plurality of polygon scanning units PO1 and PO2, and each of the polygon scanning units PO scans the beam spot from the ultraviolet laser light source at a high speed on the substrate P in a direction parallel to the axis rotation center AX2. The AOM (Acousto-Optic Modulator) or the like performs modulation (On/Off) of the light beam based on the pattern drawing data (CAD data), and the pattern is drawn on the substrate P.

The exposure apparatus EX3 is a maskless exposure apparatus that can irradiate the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light (laser spot) to form a predetermined pattern without the cylindrical mask DM. In addition to the dot scanning, a method of drawing a pattern using a DMD (Digital Micro Mirror Device) or an SLM (Spatial Light Modulator) may be used.

(Sixth embodiment)

Next, a sixth embodiment of the processing apparatus of the present invention will be described with reference to Fig. 16 . Fig. 16 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to a sixth embodiment. In the same figure, the same components as those in the first embodiment are denoted by the same reference numerals, and their description will be omitted.

The exposure device EX4 is a so-called processing device that applies a proximity exposure to the substrate P. The exposure device EX4 sets a gap between the cylindrical mask DM and the second roller member 22 to a very small gap, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL to perform non-contact exposure. In the present embodiment, the second roller member 22 is rotated by the torque supplied from the second drive unit 36 of the actuator such as an electric motor. The first roller member 21 is driven by, for example, a drive roller MGG coupled by a magnetic gear so as to be opposite to the rotation direction of the second drive unit 36. The second driving unit 36 rotates the second roller member 22, and connects the driving roller MGG and the first roller member 21 to move the first roller member 21 (the cylindrical mask DM) and the second roller member 22 in synchronization (synchronous rotation) ).

Further, the exposure device EX4 includes an encoder read head EN6 that detects a position PX6 of the scale portion GP at a specific position of the substrate P with respect to the illumination light beam (imaging beam) EL of the substrate P. Here, since the diameter of the outer peripheral surface of the outer peripheral surface of the second roller member 22 wound around the substrate P coincides with the diameter of the scale portion GP of the scale disk SD, the position PX6 is viewed from the second central axis AX2. The above specific locations are consistent. Further, the encoder read head EN7 is set to rotate the center of the set azimuth line Le6 of the encoder read head EN6 on the side opposite to the substrate P transport direction. Line AX2 rotates approximately 90 degrees. Set the bearing line Le7.

In the exposure apparatus EX4 of the present embodiment, the encoder head EN7 is the first reading device, the encoder head EN6 is the second reading device, and the second roller is obtained by reading and outputting from the scale portion GP. The position of the axis of the member 22 is connected to a specific position, and the displacement component in the direction orthogonal to the axis is subjected to a process of correcting the read output of the first reading device.

In the first to sixth embodiments described above, the exposure apparatus has been described as an example of the processing apparatus. However, the processing apparatus is not limited to the exposure apparatus, but the processing unit may be a device that prints a pattern onto the object substrate P to be processed by the inkjet ink dripping device. Further, the processing unit may be an inspection device.

<Component Manufacturing Method>

Next, a method of manufacturing a component will be described with reference to FIG. Fig. 17 is a flow chart showing a method of manufacturing a device using the processing apparatus (exposure apparatus) of the first embodiment.

In the device manufacturing method shown in FIG. 17, first, for example, a function and performance design of a display panel using a self-luminous element such as an organic EL, and a circuit pattern and a wiring pattern required for designing by CAD or the like are designed (step S201). Next, a cylindrical mask DM having a desired layer amount is produced in accordance with each of various pattern patterns designed by CAD or the like (step S202). The supply reel FR1 of the flexible substrate P (resin film, metal foil film, plastic, etc.) on which the substrate of the display panel is wound is prepared (step S203). Further, the roll substrate P prepared in the step S203 may be a surface whose surface is modified as necessary, or a bottom layer (for example, a fine unevenness by an imprint method) may be formed in advance, or a layer of light may be laminated in advance. Inductive functional film or transparent film (insulating material).

Next, a backplane layer composed of an electrode and a wiring constituting the display panel, an insulating film, a TFT (thin film semiconductor), and the like is formed on the substrate P, and laminated on the backplane layer. A light-emitting layer (display pixel portion) composed of a self-luminous element such as an organic EL is formed (step S204). In the step S204, the conventional lithography process for exposing the photoresist layer using the exposure devices EX, EX2, EX3, and EX4 described in the previous embodiments is also included, but the photosensitive photoresist is also used instead of the photoresist. The substrate P of the decane coupling agent is subjected to pattern exposure to form an exposure process on the surface of the water-repellent pattern, and the pattern of the metal film (wiring, electrode, etc.) is formed by electroless plating after exposing the photo-sensitive catalyst layer pattern. A wet process, a printing process of drawing a pattern such as a conductive ink containing silver nanoparticles, or the like.

Next, the substrate P is cut for each display panel element continuously manufactured on the long substrate P by a reel method, or a protective film (for an environmental barrier layer), a color filter, or the like is bonded to the surface of each display panel element. To assemble the component (step S205). Next, an inspection step of whether the display panel element can operate normally or whether the desired performance and characteristics are satisfied is performed (step S206). In the above manner, a display panel (flexible display) can be manufactured.

9‧‧‧Transporting device

12‧‧‧Photomask holder

13‧‧‧Light source device

14‧‧‧Control device

21‧‧‧1st roller member

22‧‧‧2nd roller member

23‧‧‧guide roller

24‧‧‧Drive roller

25‧‧‧1st detector

26‧‧‧First Drive Department

31‧‧‧First Guide

32‧‧‧2nd Guide

33‧‧‧3rd Guide

35‧‧‧2nd detector

36‧‧‧2nd drive department

60‧‧‧temperature adjustment device

61‧‧‧ Guides

62‧‧‧Media air supply components

63‧‧‧Air supply pressure equalization member

67‧‧‧ Space

71‧‧‧Media adjustment device

72H, 72C, 74H, 74C‧‧‧ flow adjustment valve

73‧‧‧Substrate support member temperature adjustment device

AD‧‧‧Media Supply Pipeline

AM1, AM2‧‧‧ observation direction

AMG1, AMG2, PMG1‧‧‧ alignment microscope

AP‧‧‧Media Supply Pipeline

AX1, AX2‧‧‧ Rotating Center Line

CC‧‧‧Media Supply Pipeline

CU‧‧‧cooling unit

DM‧‧‧Cylinder reticle

DR6, DR4‧‧‧ drive roller

EL1‧‧‧ illumination beam

EL2‧‧‧ imaging beam

EX‧‧‧Exposure device (substrate processing device)

HH‧‧‧Media Supply Pipeline

HU‧‧‧heating unit

IA‧‧‧Transport direction entry position

IL‧‧‧Lighting Module

IR‧‧‧Lighting area

IU‧‧‧Lighting Agency

OA‧‧‧Transport direction disengaged

P‧‧‧Substrate

P1‧‧‧ first side

P2‧‧‧2nd

P2‧‧‧ center face

PA (PA1~PA6)‧‧‧projection area

PL (PL1~PL6)‧‧‧Projection Optics

PM1‧‧‧Detection direction

PX‧‧‧ specific location

PX1, PX2‧‧‧ first and second specific positions

T1, T2‧‧‧ temperature measuring device

Claims (15)

A substrate processing apparatus includes: a substrate supporting member having a first curved surface curved from a predetermined axis at a constant radius; a portion of the substrate is wound around the first curved surface to support the substrate; and the processing device is disposed when viewed from the axis a substrate is disposed around the substrate supporting member at a specific position in a circumferential direction of the first curved surface; and a temperature adjusting device has a temperature adjustment of the guide member for adjusting a temperature of the substrate before the substrate supporting member is supplied At least one of a portion and a media adjustment unit; the guide temperature adjusting device adjusts a temperature of a guide supporting a portion of the substrate along a second curved surface curved at a constant radius from a reference axis parallel to the axis; the media adjustment portion, The temperature-regulated media is circulated to the space around the guide. The substrate processing apparatus according to claim 1, wherein a radius of the second curved surface of the guide member and a radius of the first curved surface of the substrate supporting member are set to be the same. The substrate processing apparatus according to claim 1, further comprising: a first pattern detecting device including a first detecting probe for detecting a specific pattern formed discretely or continuously on the substrate, wherein the first detecting probe is disposed at The second pattern detecting device includes a second detecting probe for detecting the specific pattern at a position that does not overlap the first detecting probe, and the second detecting probe is disposed at the detectable position. a temperature of the temperature adjustment device and a position of the specific pattern of the substrate wound before the first curved surface; and a control device controlling the detection result of the first pattern detecting device and the second pattern detecting device The temperature regulating device. The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a temperature measuring device that measures a temperature of the substrate; and a control device that controls the temperature adjustment according to a detection result of the temperature measuring device Device. The substrate processing apparatus according to claim 3, wherein the processing apparatus is an exposure processing apparatus that irradiates exposure light onto the substrate to transfer an image of the element, wherein the exposure processing apparatus is provided with an adjustment to be transferred to the substrate a magnification adjustment unit for shifting the magnification of the image on the substrate and at least one of the image displacement adjustment portions at which the displacement is transferred to the image on the substrate; the magnification adjustment unit or the image displacement adjustment unit is configured to The change of the specific pattern obtained by the output of the first pattern detecting device and the second pattern detecting device corrects the magnification of the image or shifts the position of the image. The substrate processing apparatus according to claim 1, wherein the temperature adjustment device includes a first medium supply unit that supplies a high temperature medium, and a second medium supply unit that supplies a low temperature medium having a lower temperature than the high temperature medium; The high temperature medium is mixed with the low temperature medium and then circulated to the guide temperature adjustment unit or the medium adjustment unit. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate is a flexible strip-shaped substrate; further comprising a transfer device for passing the temperature adjustment of the sheet substrate After the guide of the device passes through the specific position of the substrate supporting member, the sheet substrate is conveyed at a predetermined speed in the direction of the strip. The substrate processing apparatus according to any one of claims 1 to 3, wherein the temperature The degree adjusting device further includes a substrate supporting member temperature adjusting portion that adjusts a temperature of the substrate supporting member. A device manufacturing method for forming a pattern for an electronic component on a flexible sheet substrate, comprising: a substrate on which the surface of the substrate is modified, a substrate on which a bottom layer has been formed in advance, and a photo-integration layer The step of supplying the substrate supporting member to the substrate supporting member in a state in which the temperature adjusting device of the substrate processing apparatus according to any one of claims 1 to 8 is temperature-adjusted And a step of forming a pattern for the electronic component on the substrate supported by the substrate supporting member by an exposure device or a printing device provided as the processing device of the substrate processing device. A device manufacturing method for manufacturing an electronic component on a flexible strip-shaped substrate, comprising: supporting a support surface of one side of the substrate in a longitudinal direction of the substrate supporting member a step of transporting the substrate at the predetermined speed in the longitudinal direction; and transferring the pattern constituting the electronic component to the support surface at a specific position in the longitudinal direction of the support surface of the substrate supporting member And the step of controlling the temperature of the substrate on the support surface of the substrate supporting member on the upstream side in the transport direction and the temperature of the substrate on the support surface is a predetermined temperature difference. The method of manufacturing a component according to claim 10, wherein the predetermined temperature difference is set by an amount of expansion and contraction of the substrate required for transferring the pattern onto the substrate. The method of manufacturing a component according to claim 10, wherein the substrate supporting member has a peripheral surface that is curved from a predetermined center line to have a cylindrical shape and has a cylindrical surface as the support surface, and is rotated around the predetermined center line. a rotating drum; in the step of transporting, a part of the longitudinal direction of the substrate is wound over a predetermined angular range along the circumferential direction of the outer peripheral surface of the rotating drum, and the rotating drum is The rotation is carried at a predetermined speed in the direction of the strip. The method of manufacturing a component according to claim 12, wherein, in the strip direction, a position at which the substrate starts to contact the outer peripheral surface of the rotary drum is set as an entry position, and the substrate starts to be separated from the outer circumference of the rotary drum. When the position is the detachment position, the pattern is transferred to the specific position on the substrate at the step of performing the transfer, and is set between the entry position and the detachment position in the circumferential direction. The method of manufacturing a component of claim 13, comprising: performing the step of transferring, by being disposed between the entry position and the disengagement position, and located at the specific position in a transport direction of the substrate a detecting probe on the upstream side or the downstream side, detecting a position previously formed at a specific pattern of the substrate; and in the step of transferring, transferring the pattern onto the substrate according to a detection result of the position of the specific pattern The alignment of the position. The method of manufacturing a component according to claim 14, wherein the stretching of the substrate is determined according to the detection result of the step of detecting the position of the specific pattern, and the substrate required for the step of transferring the pattern is used. The predetermined temperature difference is set in such a manner that the amount of expansion and contraction corresponds.