JP6677287B2 - Adjustment method for substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus, a device manufacturing method, and a method for adjusting a substrate processing apparatus.

  2. Description of the Related Art Conventionally, as a substrate processing apparatus, a manufacturing apparatus that performs drawing at a predetermined position on a sheet-like medium (substrate) is known (for example, see Patent Document 1). The manufacturing apparatus described in Patent Literature 1 measures the expansion and contraction of a sheet substrate by detecting alignment marks on a flexible long sheet substrate that easily expands and contracts in the width direction, and draws a drawing position ( (Processing position) is corrected.

JP 2010-91990A

  In the manufacturing apparatus of Patent Literature 1, exposure is performed by switching a spatial light modulator (DMD) while a substrate is transported in a transport direction, and a pattern is drawn on the substrate by a plurality of drawing units. In the manufacturing apparatus of Patent Document 1, patterns adjacent to each other in the width direction of the substrate are jointly exposed by a plurality of drawing units. However, in order to suppress errors in the joint exposure, the patterns are generated by performing test exposure and development. The measurement result of the position error of the pattern at the joint is fed back. However, the feedback process including such operations as test exposure, development, measurement, etc., depending on the frequency, temporarily stops the production line, lowers product productivity and wastes substrate. May occur.

  An aspect of the present invention has been made in view of the above problems, and an object of the present invention is to provide a method in which a plurality of drawing units are used to join patterns in the width direction of a substrate and to perform exposure (drawing). It is an object of the present invention to provide a substrate processing apparatus, a device manufacturing method, and a method of adjusting the substrate processing apparatus, which stably draw a large-area pattern on a substrate with high accuracy by reducing a joint error of the substrate processing apparatus.

  According to the first aspect of the present invention, a support member provided with discrete or continuous specific reference marks at a plurality of predetermined positions on a support surface, and a substrate having a predetermined width on the support surface of the support member. While supporting, a transport device that transports at a predetermined speed in a longitudinal direction crossing the width direction, and scans the spot light of the beam projected on the substrate in the width direction in a range narrower than the width of the substrate. A plurality of drawing units capable of drawing a predetermined pattern on the substrate along the obtained drawing line, and the patterns drawn on the substrate by each of the plurality of drawing units correspond to the patterns of the substrate. A drawing apparatus in which the drawing lines adjacent to each other in the width direction are arranged at predetermined intervals in the long direction so that the drawing lines are joined together in the width direction of the substrate along with the conveyance in the long direction, and Multiple A plurality of reflected light detection units configured to detect reflected light generated from a support surface of the support member by irradiation of the beam from each of the drawing units; and a method of adjusting a substrate processing apparatus, comprising: A scanning step of relatively moving the support member and the drawing apparatus such that the reference mark is provided on the drawing line formed by each of the units, and scanning the reference mark with the spot light of the beam; Detecting the reflected light generated from the reference mark by the scanning of the beam with the reflected light detection unit to obtain a detection signal corresponding to the reference mark; and performing the plurality of drawing based on the detection signal. Obtaining adjustment information corresponding to the arrangement state of the lines or mutual arrangement errors, based on the adjustment information. Adjusting the drawing state of the pattern by each of the drawing units, a method of adjusting the substrate processing apparatus is provided.

  According to the second aspect of the present invention, a spot light scanned one-dimensionally in the main scanning direction is projected onto a substrate moving in a sub-scanning direction that intersects with the main scanning direction to form a pattern on the substrate. A plurality of drawing units to be drawn are formed such that patterns drawn on the substrate by respective drawing lines formed by scanning of the spot light from each of the drawing units in the main scanning direction along with the movement of the substrate. A method of adjusting a substrate processing apparatus arranged in the main scanning direction so as to be joined, comprising: a support surface for supporting the substrate; and a plurality of predetermined positions along the support surface. Having a formed reference mark, moving a support member capable of moving the substrate in the sub-scanning direction such that the reference mark is brought on the drawing line by each of the drawing units. A scanning step of scanning the reference mark with the spot light projected from each of the drawing units; and a scanning step provided on each of the plurality of drawing units and generated from the support surface of the support member by the projection of the spot light. A detecting step of obtaining a detection signal corresponding to a change in intensity of reflected light generated when the spot light scans the reference mark, by a reflected light detection unit that photoelectrically detects reflected light to be reflected, based on the detection signal, An adjustment step of obtaining adjustment information on an arrangement state or mutual arrangement error of a plurality of drawing lines, and adjusting a drawing position of the pattern by each of the plurality of drawing units based on the adjustment information. An adjustment method is provided.

According to a third aspect of the present invention, there is provided a substrate processing apparatus which draws a pattern of an electronic device on a surface of a flexible long substrate by spot light while moving the flexible long substrate in a longitudinal direction,
A part of the outer peripheral surface having a constant radius from a center line extending in the width direction orthogonal to the longitudinal direction of the substrate supports a part of the substrate, and rotates around the center line to move the substrate in the elongate direction. And a spot light of a first writing beam, the intensity of which is modulated according to a pattern to be written, from a first installation orientation along a circumferential direction of an outer peripheral surface of the rotating drum by the rotating drum. A first drawing unit that draws a pattern by projecting the spot light one-dimensionally in a direction parallel to the center line while projecting the light onto the supported substrate; and the substrate with respect to the first installation orientation. At the detection position set in the second installation orientation along the circumferential direction of the outer peripheral surface of the rotary drum on the upstream side in the direction of conveyance of the rotary drum, formed on the surface of the substrate or the outer peripheral surface of the rotary drum. Microscope to detect the marked marks A first displacement meter that is arranged in the same orientation as the first installation orientation when viewed from the direction in which the center line extends, and detects a minute displacement of an end of the rotary drum in the direction of the center line; A second displacement meter that is disposed in the same orientation as the second installation orientation when viewed from the direction in which the line extends, and that detects a minute displacement of the end of the rotary drum in the direction of the center line. A processing device is provided.

  According to the aspect of the present invention, it is possible to reduce a splicing error when a pattern is spliced in a width direction of a substrate using a plurality of drawing units and to perform drawing by the plurality of drawing units on the substrate in a suitable manner. An adjustment method for a substrate processing apparatus and a substrate processing apparatus can be provided.

FIG. 1 is a diagram illustrating an overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. FIG. 2 is a perspective view showing an arrangement of a main part of the exposure apparatus of FIG. FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate. FIG. 4 is a diagram showing a configuration of a rotary drum and a drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing an arrangement of a main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of a plurality of scanners of the exposure apparatus of FIG. FIG. 8 is a diagram illustrating an optical configuration for eliminating a shift of a drawing line due to a tilt of a reflection surface of a scanner. FIG. 9 is a perspective view showing an arrangement relationship among an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 10 is a perspective view showing a surface structure of a rotating drum of the exposure apparatus of FIG. FIG. 11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on a substrate. FIG. 12 is an explanatory diagram showing a relationship between a beam spot and a drawing line. FIG. 13 is a graph simulating a change in intensity distribution due to the amount of superposition of beam spots for two pulses obtained on the substrate. FIG. 14 is a flowchart relating to the adjustment method of the exposure apparatus of the first embodiment. FIG. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating drum and the drawing line. FIG. 16 is an explanatory diagram schematically showing signals output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a bright field. FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. FIG. 18 is an explanatory diagram schematically showing signals output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating drum. FIG. 20 is an explanatory diagram schematically showing the relative positional relationship between a plurality of drawing lines. FIG. 21 is an explanatory diagram schematically showing the relationship between the moving distance of the substrate per unit time and the number of drawing lines included in the moving distance. FIG. 22 is an explanatory diagram schematically illustrating pulse light synchronized with the system clock of the pulse light source. FIG. 23 is a flowchart illustrating the device manufacturing method of each embodiment.

  An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the components described below can be appropriately combined. Further, various omissions, substitutions, or changes of the components can be made without departing from the spirit of the present invention.

[First Embodiment]
FIG. 1 is a diagram illustrating an overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus according to the first embodiment is an exposure apparatus EX that performs an exposure process on a substrate P. The exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various processes on an exposed substrate P to manufacture a device. ing. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line for manufacturing a flexible display as a device (flexible display manufacturing line). An example of the flexible display is an organic EL display. In the device manufacturing system 1, the substrate P is sent out from a supply roll (not shown) in which a flexible (flexible) long substrate P is wound into a roll, and various processes are performed on the sent substrate P. Is continuously wound, and then the processed substrate P is wound up as a flexible device on a collecting roll (not shown), that is, a so-called roll-to-roll method. In the device manufacturing system 1 according to the first embodiment, a substrate P, which is a film-like sheet, is sent out from a supply roll, and the substrate P sent out from the supply roll is sequentially processed in a process apparatus U1, an exposure apparatus EX, and a process apparatus. An example is shown through U2 until it is wound on a collection roll. Here, the substrate P to be processed by the device manufacturing system 1 will be described.

  As the substrate P, for example, a resin film, a foil (foil) made of metal or alloy such as stainless steel, or the like is used. As the material of the resin film, for example, among polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin Contains one or more.

  As the substrate P, for example, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that the amount of deformation due to heat received in various processes performed on the substrate P can be substantially ignored. The thermal expansion coefficient may be set to be smaller than a threshold value according to a process temperature or the like by mixing an inorganic filler into a resin film, for example. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Further, the substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above-described resin film, foil, and the like are bonded to this ultra-thin glass. It may be.

  The substrate P thus configured becomes a supply roll by being wound in a roll shape, and the supply roll is mounted on the device manufacturing system 1. The device manufacturing system 1 equipped with the supply roll repeatedly executes various processes for manufacturing a device on the substrate P sent out from the supply roll in the longitudinal direction. For this reason, a pattern for a plurality of electronic devices (display panel, printed circuit board, etc.) is formed on the processed substrate P in a state of being continuously arranged at a constant interval in the longitudinal direction. In other words, the substrate P sent out from the supply roll is a substrate for multi-panning. The substrate P is modified and activated in advance by a predetermined pretreatment, or a fine partition structure (a concavo-convex structure formed by an imprint method) for precise patterning is formed on the surface. May be done.

  The processed substrate P is collected as a collection roll by being wound into a roll. The collection roll is mounted on a dicing device (not shown). The dicing apparatus equipped with the collecting roll divides (dices) the processed substrate P into devices to make a plurality of devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (shorter direction) and about 10 m or more in the length direction (longer direction). Note that the dimensions of the substrate P are not limited to the dimensions described above.

  Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process device U1, an exposure device EX, and a process device U2. In FIG. 1, an orthogonal coordinate system is used in which the X, Y, and Z directions are orthogonal. The X direction is a direction in the horizontal plane from the process device U1 to the process device U2 via the exposure device EX. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction, and the XY plane is parallel to the installation surface E of the production line on which the exposure apparatus EX is installed.

  The process apparatus U1 performs a pre-process (pre-process) on the substrate P to be exposed by the exposure apparatus EX. The process apparatus U1 sends the preprocessed substrate P to the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

  Here, the photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film). A typical example of the photosensitive functional layer is a photoresist, but as a material that does not require a development process, a photosensitive silane coupling material (SAM) in which the lyophilic property of a portion that has been irradiated with ultraviolet light is modified, Alternatively, there is a photosensitive reducing material or the like in which a plating reducing group is exposed in a portion that has been irradiated with ultraviolet rays. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet light on the substrate P is modified from lyophobic to lyophilic, so that the lyophilic portion is A conductive ink (an ink containing conductive nanoparticles such as silver or copper) is selectively applied thereon to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, since the plating reducing group is exposed on the pattern portion of the substrate P exposed to ultraviolet light, the substrate P is immediately exposed to a plating solution containing palladium ions or the like. The pattern layer is formed (deposited) of palladium by immersing the substrate in a predetermined time.

  The exposure apparatus EX draws, for example, various circuits for display panels or various wiring patterns on the substrate P supplied from the process apparatus U1. Although details will be described later, the exposure apparatus EX causes each of the plurality of drawing units UW1 to UW5 to project a beam LB (hereinafter also referred to as a drawing beam LB) projected toward the substrate P in a predetermined scanning direction. A predetermined pattern is exposed on the substrate P by a plurality of drawing lines LL1 to LL5 obtained by scanning.

  The process apparatus U2 receives the substrate P exposed by the exposure apparatus EX, and performs post-processing (post-processing) on the substrate P. When the photosensitive functional layer of the substrate P is a photoresist, the process device U2 performs a post-baking process, a developing process, a cleaning process, a drying process, and the like at a temperature equal to or lower than the glass transition temperature of the substrate P. When the photosensitive functional layer of the substrate P is a photosensitive plating reducing material, the process device U2 performs an electroless plating process, a cleaning process, a drying process, and the like. Further, when the photosensitive functional layer of the substrate P is a photosensitive silane coupling material, the process device U2 performs a selective application process, a drying process, and the like of the liquid ink on the lyophilic portion on the substrate P. Do. By passing through such a process apparatus U2, a pattern layer of a device is formed on the substrate P.

<Exposure equipment (substrate processing equipment)>
Subsequently, the exposure apparatus EX will be described with reference to FIGS. FIG. 2 is a perspective view showing an arrangement of a main part of the exposure apparatus of FIG. FIG. 3 is a diagram showing an arrangement relationship between an alignment microscope and a drawing line on a substrate. FIG. 4 is a diagram showing a configuration of a rotary drum and a drawing apparatus (drawing unit) of the exposure apparatus of FIG. FIG. 5 is a plan view showing an arrangement of a main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing a configuration of a branch optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing an arrangement relationship of scanners in a plurality of drawing units of the exposure apparatus of FIG. FIG. 8 is a diagram illustrating an optical configuration for eliminating a shift of a drawing line due to a tilt of a reflection surface of a scanner. FIG. 9 is a perspective view showing an arrangement relationship among an alignment microscope, a drawing line, and an encoder head on a substrate. FIG. 10 is a perspective view showing an example of the surface structure of the rotating drum of the exposure apparatus of FIG.

  As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a so-called maskless drawing exposure apparatus. In the present embodiment, the substrate P is moved at a constant speed in the transport direction (long direction). By performing high-speed scanning of the spot light of the writing beam LB in a predetermined scanning direction (the width direction of the substrate P) while continuously transporting, writing is performed on the surface of the substrate P to form a predetermined pattern on the substrate P. It is a raster scan type direct exposure apparatus.

  As shown in FIG. 1, the exposure apparatus EX includes a drawing apparatus 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control unit 16. The drawing device 11 includes a plurality of drawing units UW1 to UW5. Then, the drawing apparatus 11 includes a plurality of drawing units UW1 to UW5 on a part of the substrate P which is transported in a state of being closely supported above the outer peripheral surface of the cylindrical rotary drum DR which is also a part of the substrate transport mechanism 12. Is used to draw a predetermined pattern. The substrate transport mechanism 12 transports the substrate P transported from the pre-process device U1 to the post-process device U2 at a predetermined speed. The alignment microscopes AM1 and AM2 detect alignment marks and the like formed in advance on the substrate P in order to relatively align (align) the pattern to be drawn on the substrate P with the substrate P. The control unit 16 including a computer, a microcomputer, a CPU, an FPGA, and the like controls each unit of the exposure apparatus EX and causes each unit to execute a process. The control unit 16 may be a part or all of a higher-level control device that controls the device manufacturing system 1. The control unit 16 is controlled by a higher-level control device. The higher-level control device may be another device such as a host computer that manages a production line.

  As shown in FIG. 2, the exposure apparatus EX includes an apparatus frame 13 that supports at least a part (a rotary drum DR or the like) of the drawing apparatus 11 and the substrate transport mechanism 12, and the apparatus frame 13 includes a rotary drum. A rotation beam spot light SP position detection mechanism (encoder head shown in FIGS. 4 and 9) for detecting the rotation angle position, rotation speed, displacement in the rotation axis direction, etc. of DR, and FIG. 1 (or FIGS. 3, 9) Are attached. Further, a light source device CNT that emits an ultraviolet laser beam (pulse beam) as a drawing beam LB is provided in the exposure apparatus EX as shown in FIGS. The exposure apparatus EX distributes the drawing beam LB emitted from the light source device CNT to each of the plurality of drawing units UW1 to UW5 constituting the drawing apparatus 11 with a substantially equal light amount (illuminance).

  As shown in FIG. 1, the exposure apparatus EX is stored in a temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface (floor surface) E of the manufacturing factory via the passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 are provided on the installation surface E, and reduce vibration from the installation surface E. The temperature control chamber EVC suppresses a change in shape due to the temperature of the substrate P transferred inside by maintaining the inside at a predetermined temperature.

  The substrate transport mechanism 12 of the exposure apparatus EX includes an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary drum (cylindrical drum) DR, a tension adjustment roller RT2, a drive roller DR6 and a drive roller DR7.

  The edge position controller EPC adjusts the position of the substrate P transferred from the process device U1 in the width direction (Y direction). The edge position controller EPC moves the substrate P such that the end position (edge) in the width direction of the substrate P sent from the process device U1 falls within a range of about ± several tens μm to several tens μm with respect to the target position. By finely moving the substrate P in the width direction, the position of the substrate P in the width direction is corrected.

  The nip-type drive roller DR4 rotates while pinching the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and sends the substrate P downstream in the conveyance direction to direct the substrate P toward the rotary drum DR. Transport. The rotating drum DR supports the portion to be pattern-exposed on the substrate P in close contact with a cylindrical outer peripheral surface having a constant radius from a rotation center line (rotation axis) AX2 extending in the Y direction, and By rotating around, the substrate P is transported in the longitudinal direction.

  In order to rotate such a rotary drum DR around the rotation center line AX2, a shaft portion Sf2 coaxial with the rotation center line AX2 is provided on both sides of the rotation drum DR, and the shaft portion Sf2 is, as shown in FIG. It is supported by the device frame 13 via bearings. The shaft portion Sf2 is supplied with a rotational torque from a drive source (not shown) such as a motor or a reduction gear mechanism. A plane parallel to the YZ plane including the rotation center line AX2 is defined as a center plane p3.

  The two tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported on the rotating drum DR. The two nip-type drive rollers DR6 and DR7 are arranged at predetermined intervals in the direction of transport of the substrate P, and give the substrate P after exposure a predetermined slack (play) DL. The drive roller DR6 rotates while pinching the upstream side of the substrate P to be transported, and the drive roller DR7 rotates by pinching the downstream side of the substrate P to be transported to the process apparatus U2. Transport. At this time, since the slack DL is given to the substrate P, the fluctuation of the transport speed of the substrate P that occurs downstream of the driving roller DR6 in the transport direction can be absorbed, and the exposure process on the substrate P due to the variation of the transport speed can be absorbed. Can be marginalized.

  Therefore, the substrate transport mechanism 12 adjusts the position of the substrate P transported from the process device U1 in the width direction by the edge position roller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction has been adjusted to the tension adjusting roller RT1 by the drive roller DR4, and transports the substrate P that has passed through the tension adjusting roller RT1 to the rotating drum DR. The substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjusting roller RT2 by rotating the rotary drum DR. The substrate transport mechanism 12 transports the substrate P transported to the tension adjusting roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P to the process device U2 while giving the substrate P a slack DL by the drive rollers DR6 and DR7.

  Referring to FIG. 2 again, the device frame 13 of the exposure apparatus EX will be described. In FIG. 2, the X direction, the Y direction, and the Z direction are orthogonal, and the orthogonal coordinate system is the same as that in FIG. 1.

  As shown in FIG. 2, the apparatus frame 13 includes, in order from the lower side in the Z direction, a main body frame 21, a three-point seat 22 as a support mechanism, a first optical surface plate 23, a moving mechanism 24, and a second An optical surface plate 25 is provided. The main body frame 21 is a portion installed on the installation surface E via the vibration isolation units SU1 and SU2. The main body frame 21 rotatably supports (supports) the rotating drum DR and the tension adjusting rollers RT1 (not shown) and RT2 so as to be rotatable. The first optical surface plate 23 is provided above the rotary drum DR in the vertical direction, and is installed on the main body frame 21 via the three-point seat 22. The three-point seat 22 supports the first optical surface plate 23 at three support points, and can adjust the position (height position) in the Z direction at each support point. Therefore, the three-point seat 22 can adjust the inclination of the surface of the first optical surface plate 23 with respect to the horizontal plane to a predetermined inclination. When the apparatus frame 13 is assembled, the position between the main body frame 21 and the three-point seat 22 can be adjusted in the X and Y directions in the XY plane. On the other hand, after the assembly of the device frame 13, the space between the main body frame 21 and the three-point seat 22 is fixed (rigid) in the XY plane.

  The second optical surface plate 25 is provided above the first optical surface plate 23 in the vertical direction, and is installed on the first optical surface plate 23 via the moving mechanism 24. The surface of the second optical surface plate 25 is parallel to the surface of the first optical surface plate 23. On the second optical base 25, a plurality of drawing units UW1 to UW5 of the drawing device 11 are installed. The moving mechanism 24 holds the first optical surface plate 23 and the second optical surface surface 25 in parallel with each other, and holds the first optical surface surface 23 and the second optical surface surface 25 around a predetermined rotation axis I extending in the vertical direction. On the other hand, the second optical surface plate 25 can be minutely rotated precisely. The rotation range is, for example, about ± several hundred milliradians with respect to the reference position, and has a structure in which an angle can be set with a resolution of one to several milliradians. The moving mechanism 24 moves the second optical surface plate 25 with respect to the first optical surface plate 23 in the X direction while maintaining the respective surfaces of the first optical surface plate 23 and the second optical surface plate 25 in parallel. And a mechanism for precisely and minutely shifting in at least one of the Y direction and the Y direction. The rotation axis I can be minutely displaced from the reference position in the X direction or the Y direction with a resolution of the order of μm. The rotation axis I extends vertically in the center plane p3 at the reference position, and a predetermined point on the surface of the substrate P wound around the rotary drum DR (a drawing surface curved following the circumferential surface). (The middle point in the width direction of the substrate P) (see FIG. 3). By rotating or shifting the second optical surface plate 25 with respect to the first optical surface plate 23 by such a moving mechanism 24, a plurality of drawing operations on the rotating drum DR or the substrate P wound around the rotating drum DR are performed. The positions of the units UW1 to UW5 can be adjusted integrally.

  Subsequently, the light source device CNT will be described with reference to FIG. The light source device CNT is installed on the main body frame 21 of the device frame 13. The light source device CNT emits a laser beam as a drawing beam LB projected on the substrate P. The light source device CNT has a light source that emits light in a predetermined wavelength range suitable for exposing the photosensitive functional layer on the substrate P, and emits light in an ultraviolet region having a strong photoactive effect. As the light source, for example, a laser light source that emits third-harmonic laser light (wavelength: 355 nm) of YAG and continuously oscillates or pulse-oscillates at about several KHz to several hundred MHz can be used.

  The light source device CNT includes a laser light generator CU1 and a wavelength converter CU2. The laser light generator CU1 includes a laser light source OSC and fiber amplifiers FB1 and FB2. The laser light generator CU1 emits the fundamental laser light Ls. The fiber amplifiers FB1 and FB2 amplify the fundamental laser light Ls with an optical fiber. The laser light generator CU1 causes the amplified fundamental laser light Lr to enter the wavelength converter CU2. The wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a dichroic mirror, a polarizing beam splitter, a prism, and the like. By using these light (wavelength) selection components, a laser beam (wavelength: 355 nm) as a third harmonic laser is used. The drawing beam LB) is extracted. At this time, the light source device CNT generates the drawing beam LB having a wavelength of 355 nm as pulse light of several KHz to several hundred MHz by pulsing the laser light source OSC that generates seed light in synchronization with a system clock or the like. . When this type of fiber amplifier is used, the emission time of one pulse of the finally output laser light (Lr or LB) can be on the order of picoseconds by the pulse driving mode of the laser light source OSC. .

  Examples of the light source include a lamp light source such as a mercury lamp having an ultraviolet bright line (g-line, h-line, i-line, etc.), a laser diode having an oscillation peak in an ultraviolet region having a wavelength of 450 nm or less, and a light-emitting diode (LED). ), Or a gas laser light source such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), and XeCl excimer laser (wavelength 308 nm) that oscillates deep ultraviolet light (DUV light). .

  Here, the drawing beam LB emitted from the light source device CNT is projected on the substrate P via a polarizing beam splitter PBS provided in each of the drawing units UW1 to UW5, as described later. In general, the polarization beam splitter PBS reflects a light beam that becomes S-polarized linearly polarized light and transmits a light beam that becomes P-polarized linearly polarized light. Therefore, in the light source device CNT, it is preferable that the drawing beam LB incident on the polarization beam splitter PBS emits a laser beam that becomes a light beam of linearly polarized light (S-polarized light). Further, since the laser light has a high energy density, the illuminance of the light beam projected on the substrate P can be appropriately secured.

  Next, the drawing apparatus 11 of the exposure apparatus EX will be described with reference to FIG. The drawing apparatus 11 is a so-called multi-beam type drawing apparatus 11 using a plurality of drawing units UW1 to UW5. The drawing apparatus 11 branches the drawing beam LB emitted from the light source device CNT into a plurality of beams, and outputs the plurality of branched drawing beams LB on the substrate P as shown in FIG. Are condensed into minute spot lights (diameter of several μm) along each of the drawing lines LL1 to LL5. Then, the drawing apparatus 11 joins patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a plurality of drawing lines LL1 to LL5 (scanning locus of spot light) formed on the substrate P by scanning the plurality of drawing beams LB with the drawing apparatus 11 will be described.

  As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. On the substrate P on the upstream side in the rotation direction, odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged in parallel with the Y axis. On the substrate P on the downstream side in the rotation direction, even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged in parallel with the Y axis.

  Each of the drawing lines LL1 to LL5 is formed substantially parallel to the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary drum DR, and is shorter than the length of the substrate P in the width direction. I have. More strictly, each of the drawing lines LL1 to LL5 is such that when the substrate P is transported at the reference speed by the substrate transport mechanism 12, the joint error of the pattern obtained by the plurality of rendering lines LL1 to LL5 is minimized. The rotating drum DR may be inclined by a predetermined angle with respect to the direction (axial direction or width direction) in which the rotation center line AX2 of the rotating drum DR extends.

  The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating drum DR. The even-numbered second drawing line LL2 and fourth drawing line LL4 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating drum DR. At this time, the second drawing line LL2 is disposed between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2. The fourth drawing line LL4 is disposed between the third drawing line LL3 and the fifth drawing line LL5 in the direction of the center line AX2. The first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width of the exposure area A7 drawn on the substrate P in the width direction (axial direction).

  The spot light scanning direction of the drawing beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction, and is the same direction. ing. The scanning direction of the spot light of the drawing beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction, which is the same direction. At this time, the scanning direction (+ Y direction) of the spot light of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, and LL5, and the drawing beam scanned along the even-numbered drawing lines LL2 and LL4. The scanning direction (−Y direction) of the LB spot light is in the opposite direction as indicated by the arrow in FIG. This is because each of the drawing units UW1 to UW5 has the same configuration, the odd-numbered drawing unit and the even-numbered drawing unit are rotated by 180 ° in the XY plane and arranged to face each other, and each of the drawing units UW1 to UW5 is arranged. Is rotated in the same direction as the rotating polygon mirror provided as a beam scanner. Therefore, when viewed from the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 and the drawing start positions of the even-numbered drawing lines LL2 and LL4 are smaller than the spot light diameter in the Y direction. Similarly, the drawing end positions of the odd-numbered drawing lines LL1 and LL3 and the drawing end positions of the even-numbered drawing lines LL2 and LL4 are smaller than or equal to the spot light diameter in the Y direction. (Or coincide) with the error of

  As described above, each of the odd-numbered drawing lines LL1, LL3, and LL5 is arranged in a line in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotary drum DR on the substrate P. ing. Each of the even-numbered drawing lines LL2 and LL4 is arranged in a line in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotary drum DR on the substrate P.

  Next, the drawing apparatus 11 will be described with reference to FIGS. The drawing apparatus 11 includes the plurality of drawing units UW1 to UW5, a branch optical system SL that branches the drawing beam LB from the light source device CNT and guides the drawing beam LB to the drawing units UW1 to UW5, and calibration detection for performing calibration. System 31.

  The branch optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of beams, and guides the branched plurality of drawing beams LB to the plurality of drawing units UW1 to UW5. The branch optical system SL includes a first optical system 41 that branches the drawing beam LB emitted from the light source device CNT into two, and a second optical system into which one of the drawing beams LB branched by the first optical system 41 enters. 42, and a third optical system 43 on which the other drawing beam LB split by the first optical system 41 is incident. The first optical system 41 of the branch optical system SL is provided with a beam shifter mechanism 44 that two-dimensionally shifts the drawing beam LB two-dimensionally in a plane perpendicular to the traveling axis of the drawing beam LB. The third optical system 43 is provided with a beam shifter mechanism 45 for two-dimensionally shifting the writing beam LB in the horizontal direction. In the branch optical system SL, a part on the light source device CNT side is installed on the main body frame 21, while another part on the drawing units UW <b> 1 to UW <b> 5 is installed on the second optical base 25.

  The first optical system 41 includes a half-wave plate 51, a polarization mirror (polarization beam splitter) 52, a beam diffuser 53, a first reflection mirror 54, a first relay lens 55, and a second relay lens 56. , A beam shifter mechanism 44, a second reflection mirror 57, a third reflection mirror 58, a fourth reflection mirror 59, and a first beam splitter 60. 4 and 5, it is difficult to understand the positional relationship between these members, and therefore, the description will be made with reference also to the perspective view of FIG.

  As shown in FIG. 6, the drawing beam LB emitted from the light source device CNT in the + X direction enters the half-wave plate 51. The half-wave plate 51 is rotatable in the plane of incidence of the writing beam LB. The drawing beam LB incident on the half-wave plate 51 has a predetermined polarization direction corresponding to the rotational position (angle) of the half-wave plate 51. The drawing beam LB that has passed through the half-wave plate 51 enters the polarizing mirror 52. The polarizing mirror 52 transmits light components in a predetermined polarization direction included in the drawing beam LB, and reflects light components in other polarization directions in the + Y direction. For this reason, the intensity of the drawing beam LB reflected by the polarizing mirror 52 can be adjusted according to the rotational position of the half-wave plate 51 by the cooperation of the half-wave plate 51 and the polarizing mirror 52.

  A part (unnecessary light component) of the drawing beam LB transmitted through the polarizing mirror 52 is applied to a beam diffuser (light trap) 53. The beam diffuser 53 absorbs a part of the incident light component of the drawing beam LB and suppresses the light component from leaking to the outside. Further, when adjusting various optical systems through which the drawing beam LB passes, if the laser power is kept at the maximum, the power is too strong and is dangerous, so that the beam diffuser 53 absorbs many light components of the drawing beam LB. In addition, it is also used for changing the rotational position (angle) of the half-wave plate 51 to greatly attenuate the power of the drawing beam LB directed to the drawing units UW1 to UW5.

  The drawing beam LB reflected in the + Y direction by the polarizing mirror 52 is reflected in the + X direction by the first reflecting mirror 54, and enters the beam shifter mechanism 44 via the first relay lens 55 and the second relay lens 56. The light reaches the two-reflection mirror 57.

  The first relay lens 55 converges the drawing beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 turns the drawing beam LB diverging after convergence into a parallel light beam again.

  As shown in FIG. 6, the beam shifter mechanism 44 includes two parallel flat plates (quartz) arranged along the traveling direction (+ X direction) of the drawing beam LB, and one of the parallel flat plates is a Y-axis plate. The other parallel flat plate is provided so as to be tiltable about an axis parallel to the Z-axis. The drawing beam LB is laterally shifted in the ZY plane and emitted from the beam shifter mechanism 44 according to the inclination angle of each parallel plane plate.

  Thereafter, the drawing beam LB is reflected by the second reflection mirror 57 in the −Y direction, reaches the third reflection mirror 58, is reflected by the third reflection mirror 58 in the −Z direction, and reaches the fourth reflection mirror 59. . The drawing beam LB is reflected in the + Y direction by the fourth reflecting mirror 59 and enters the first beam splitter 60. The first beam splitter 60 reflects a part of the light amount component of the drawing beam LB in the −X direction and guides it to the second optical system 42, and guides the remaining light amount component of the drawing beam LB to the third optical system 43. In the case of the present embodiment, the drawing beam LB guided to the second optical system 42 is distributed to the three drawing units UW1, UW3, and UW5 at the point, and the drawing beam LB guided to the third optical system 43 is positioned at the point. Is distributed to the two drawing units UW2 and UW4. Therefore, the first beam splitter 60 desirably sets the ratio of the reflectance and the transmittance on the light splitting surface to 3: 2 (the reflectance is 60% and the transmittance is 40%), but this is not always necessary. It may be 1: 1.

  Here, the third reflection mirror 58 and the fourth reflection mirror 59 are provided at a predetermined interval on the rotation axis I of the moving mechanism 24. That is, the center line of the drawing beam LB (parallel light beam) reflected by the third reflection mirror 58 and traveling toward the fourth reflection mirror 59 is set so as to coincide with (be coaxial with) the rotation axis I.

  The configuration up to the light source device CNT including the third reflection mirror 58 (portion surrounded by a two-dot chain line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side, while the fourth reflection mirror is provided. The configuration of the plurality of drawing units UW1 to UW5 including the portion 59 (the portion surrounded by the two-dot chain line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. Therefore, even if the first optical surface plate 23 and the second optical surface plate 25 are relatively rotated by the moving mechanism 24, the third reflection mirror 58 and the fourth reflection mirror are arranged so that the drawing beam LB passes coaxially with the rotation axis I. 59, the optical path of the drawing beam LB from the fourth reflection mirror 59 to the first beam splitter 60 is not changed. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the moving mechanism 24, the drawing beam LB emitted from the light source device CNT installed on the main body frame 21 side is converted to the second optical surface light. It is possible to suitably and stably guide to the plurality of drawing units UW1 to UW5 installed on the surface plate 25 side.

  The second optical system 42 branches and guides one of the drawing beams LB split by the first beam splitter 60 of the first optical system 41 toward odd-numbered drawing units UW1, UW3, and UW5 described later. . The second optical system 42 has a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

  The drawing beam LB reflected in the −X direction by the first beam splitter 60 of the first optical system 41 is reflected in the −Y direction by the fifth reflection mirror 61 and enters the second beam splitter 62. A part of the drawing beam LB that has entered the second beam splitter 62 is reflected in the −Z direction, and is guided to one odd-numbered drawing unit UW5 (see FIG. 5). The drawing beam LB transmitted through the second beam splitter 62 enters the third beam splitter 63. A part of the writing beam LB incident on the third beam splitter 63 is reflected in the −Z direction, and is guided to one odd-numbered writing unit UW3 (see FIG. 5). Then, a part of the drawing beam LB that has passed through the third beam splitter 63 is reflected in the −Z direction by the sixth reflecting mirror 64, and is guided to one odd-numbered drawing unit UW1 (see FIG. 5). In the second optical system 42, the drawing beam LB applied to the odd-numbered drawing units UW1, UW3, and UW5 is slightly oblique to the -Z direction.

  In order to effectively use the power of the writing beam LB, the ratio of the reflectance and the transmittance of the second beam splitter 62 is 1: 2, and the ratio of the reflectance and the transmittance of the third beam splitter 63 is 1: 1. It is better to get closer.

  On the other hand, the third optical system 43 branches and guides the other drawing beam LB branched by the first beam splitter 60 of the first optical system 41 toward even-numbered drawing units UW2 and UW4 described later. . The third optical system 43 has a seventh reflection mirror 71, a beam shifter mechanism 45, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

  The drawing beam LB transmitted in the + Y direction by the first beam splitter 60 of the first optical system 41 is reflected in the + X direction by the seventh reflecting mirror 71, passes through the beam shifter mechanism 45, and enters the eighth reflecting mirror 72. I do. The beam shifter mechanism 45 is composed of two tiltable parallel flat plates (quartz) similar to the beam shifter mechanism 44, and horizontally moves the drawing beam LB traveling in the + X direction toward the eighth reflection mirror 72 in the ZY plane. Shift.

  The drawing beam LB reflected in the −Y direction by the eighth reflecting mirror 72 enters the fourth beam splitter 73. A part of the drawing beam LB applied to the fourth beam splitter 73 is reflected in the −Z direction, and is guided to one even-numbered drawing unit UW4 (see FIG. 5). The drawing beam LB that has passed through the fourth beam splitter 73 is reflected in the −Z direction by the ninth reflecting mirror 74, and is guided to one even-numbered drawing unit UW2. Also in the third optical system 43, the drawing beam LB applied to the even-numbered drawing units UW2 and UW4 is slightly oblique to the -Z direction.

  As described above, in the branch optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of pieces toward the plurality of drawing units UW1 to UW5. At this time, the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 have the same beam intensity of the drawing beam LB applied to the plurality of drawing units UW1 to UW5. As described above, the reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the writing beam LB.

  Incidentally, the beam shifter mechanism 44 is disposed between the second relay lens 56 and the second reflection mirror 57. The beam shifter mechanism 44 can finely adjust all the positions of the drawing lines LL1 to LL5 formed on the substrate P in the drawing plane of the substrate P on the order of μm.

  Further, the beam shifter mechanism 45 finely arranges even-numbered second drawing lines LL2 and fourth drawing lines LL4 of the drawing lines LL1 to LL5 formed on the substrate P on the order of μm in the drawing surface of the substrate P. Can be adjusted.

  Further, a plurality of drawing units UW1 to UW5 will be described with reference to FIGS. As shown in FIG. 4 (and FIG. 1), the plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween. The plurality of drawing units UW1 to UW5 have the first drawing on the side where the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged (the −X direction side in FIG. 5) with the center plane p3 interposed therebetween. A unit UW1, a third drawing unit UW3, and a fifth drawing unit UW5 are arranged. The first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at predetermined intervals in the Y direction. The plurality of drawing units UW1 to UW5 are located on the side where the second and fourth drawing lines LL2 and LL4 are arranged (the + X direction side in FIG. 5) with the center plane p3 interposed therebetween. Four drawing units UW4 are arranged. The second drawing unit UW2 and the fourth drawing unit UW4 are arranged at predetermined intervals in the Y direction. At this time, as shown in FIG. 2 or FIG. 5, the second drawing unit UW2 is located between the first drawing unit UW1 and the third drawing unit UW3 in the Y direction. Similarly, the third drawing unit UW3 is located between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction. The fourth drawing unit UW4 is located between the third drawing unit UW3 and the fifth drawing unit UW5 in the Y direction. As shown in FIG. 4, the first drawing unit UW1, the third drawing unit UW3 and the fifth drawing unit UW5, and the second drawing unit UW2 and the fourth drawing unit UW4 have a center plane p3 viewed from the Y direction. It is arranged symmetrically at the center.

  Next, the configuration of the optical system in each of the drawing units UW1 to UW5 will be described with reference to FIG. Since the drawing units UW1 to UW5 have the same configuration, the first drawing unit UW1 (hereinafter, simply referred to as the drawing unit UW1) will be described as an example.

  The drawing unit UW1 shown in FIG. 4 includes an optical deflector 81, a polarizing beam splitter PBS, and a ４ wavelength plate for scanning the spot light of the drawing beam LB along the drawing line LL1 (first drawing line LL1). 82, a scanner 83, a bending mirror 84, an f-θ lens system 85, and a Y magnification correcting optical member (lens group) 86B including a cylindrical lens 86. Further, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

  As the optical deflector 81, for example, an acousto-optic device (AOM: Acousto Optic Modulator) is used. The AOM has an ON state in which first-order diffracted light of an incident drawing beam is generated in a predetermined diffraction angle direction and an OFF state in which no first-order diffracted light is generated, depending on whether or not a diffraction grating is generated by an ultrasonic wave (high-frequency signal) inside. An optical switching element that switches between states.

  The control unit 16 shown in FIG. 1 switches the projection / non-projection of the writing beam LB to the substrate P at high speed by switching the optical deflector 81 ON / OFF. Specifically, the light deflector 81 is irradiated with one of the drawing beams LB distributed by the branch optical system SL via the relay lens 91 while being slightly inclined with respect to the −Z direction. When the optical deflector 81 is switched to OFF, the drawing beam LB advances straight in a state of being inclined, and is shielded by a light shielding plate 92 provided at a point past the optical deflector 81. On the other hand, when the optical deflector 81 is switched on, the drawing beam LB (first-order diffracted light) is deflected in the −Z direction, passes through the optical deflector 81, and moves on the Z direction of the optical deflector 81. The light is applied to the polarizing beam splitter PBS provided. Therefore, when the optical deflector 81 is turned on, the spot light of the writing beam LB is projected on the substrate P, and when the optical deflector 81 is turned off, the spot light of the writing beam LB is emitted on the substrate P. Not projected.

  Since the AOM is arranged at the position of the beam waist of the drawing beam LB converged by the relay lens 91, the drawing beam LB (first-order diffracted light) emitted from the optical deflector 81 diverges. Therefore, after the optical deflector 81, a relay lens 93 for returning the diverging drawing beam LB to a parallel light beam is provided.

  The polarizing beam splitter PBS reflects the drawing beam LB emitted from the optical deflector 81 via the relay lens 93. The drawing beam LB emitted from the polarizing beam splitter PBS is applied to a 波長 wavelength plate 82, a scanner 83 (rotating polygon mirror), a bending mirror 84, an f-θ lens system 85, a Y magnification correcting optical member 86B, and a cylindrical lens. Proceeding in the order of 86, the light is focused on the substrate P as a scanning spot light.

  On the other hand, the polarization beam splitter PBS is projected on the outer peripheral surface of the substrate P or the rotating drum DR therebelow in cooperation with the quarter-wave plate 82 provided between the polarization beam splitter PBS and the scanner 83. The reflected light of the drawn beam LB travels backward in the order of the Y magnification correcting optical member 86B, the cylindrical lens 86, the f-θ lens system 85, the bending mirror 84, and the scanner 83, and transmits the reflected light. be able to. That is, the drawing beam LB emitted from the optical deflector 81 to the polarization beam splitter PBS is a laser beam that becomes S-polarized linearly polarized light, and is reflected by the polarization beam splitter PBS. The drawing beam LB reflected by the polarizing beam splitter PBS passes through a 波長 wavelength plate 82, a scanner 83, a bending mirror 84, an f-θ lens system 85, a Y magnification correcting optical member 86B, and a cylindrical lens 86. The spot light of the drawing beam LB that is irradiated onto the substrate P and condensed on the substrate P is circularly polarized. The reflected light from the substrate P (or the outer peripheral surface of the rotary drum DR) reversely travels along the light transmission path of the drawing beam LB and passes through the quarter-wave plate 82 again, so that the laser light becomes P-polarized linearly polarized light. Becomes Therefore, the reflected light that reaches the polarization beam splitter PBS from the substrate P (or the rotating drum DR) passes through the polarization beam splitter PBS, and is applied to the photoelectric sensor 31Cs of the calibration detection system 31 via the relay lens 94.

  As described above, the polarization beam splitter PBS is a light splitter disposed between the scanning optical system including the scanner 83 and the calibration detection system 31. The calibration detection system 31 is an easy and compact optical system because many of the optical system for transmitting the drawing beam LB to the substrate P is shared.

  As shown in FIGS. 4 and 7, the scanner 83 has a reflection mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing beam LB (parallel light beam) that has passed through the 波長 wavelength plate 82 is reflected in the XY plane by the reflection mirror 96 via the cylindrical lens 95, and is irradiated on the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction, and a plurality of reflection surfaces 97b formed around the rotating shaft 97a. By rotating the rotating polygon mirror 97 in a predetermined rotation direction about the rotation axis 97a, the reflection angle of the drawing beam LB (the beam intensity-modulated by the optical deflector 81) applied to the reflection surface 97b is changed to the XY plane. And the reflected drawing beam LB is focused on the spot light by the bending mirror 84, the f-θ lens system 85, and the second cylindrical lens 86 (and the Y magnification correcting optical member 86B). Light is emitted and scans along the drawing line LL1 on the substrate P (similarly, LL2 to LL5). The origin detector 98 detects the origin of the drawing beam LB that scans along the drawing line LL1 (similarly, LL2 to LL5) on the substrate P. The origin detector 98 is arranged on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each reflection surface 97b interposed therebetween.

  In FIG. 7, for simplicity of explanation, only the photoelectric detector is shown as the origin detector 98. However, in actuality, the detection beam is projected toward the reflection surface 97b of the rotating polygon mirror 97 on which the drawing beam LB is projected. A light source for detection, such as an LED or a semiconductor laser, is provided, and an origin detector 98 photoelectrically detects the light reflected by the reflection surface 97b of the detection beam through a narrow slit.

  As a result, the origin detector 98 outputs a pulse signal representing the origin, always a certain time before the timing at which the spot light is applied to the drawing start position of the drawing line LL1 (LL2 to LL5) on the substrate P. Is set to

  The drawing beam LB emitted from the scanner 83 to the bending mirror 84 is reflected in the −Z direction by the bending mirror 84 and enters the f-θ lens system 85 and the cylindrical lens 86 (and the Y magnification correcting optical member 86B). .

  By the way, if each reflecting surface 97b of the rotating polygon mirror 97 is not exactly parallel to the center line of the rotating shaft 97a but is slightly inclined (faces down), the spot light projected on the substrate P The drawing lines (LL1 to LL5) are shifted in the X direction on the substrate P for each reflection surface 97b. Therefore, by providing two cylindrical lenses 95 and 86 with reference to FIG. 8, blurring of the drawing lines LL <b> 1 to LL <b> 5 in the X direction can be reduced with respect to the inclination of each reflection surface 97 b of the rotating polygon mirror 97. Or, what can be eliminated will be explained.

  The left side of FIG. 8 shows a state where the optical paths of the cylindrical lens 95, the scanner 83, the f-θ lens system 85, and the cylindrical lens 86 are developed on the XY plane, and the right side of FIG. This shows the situation. As a basic optical arrangement, the reflecting surface 97b of the rotating polygon mirror 97, onto which the drawing beam LB is irradiated, is arranged at the entrance pupil position (front focal position) of the f-θ lens system 85. Accordingly, the incident angle of the drawing beam LB incident on the f-θ lens system 85 becomes θp with respect to the rotation angle θp / 2 of the rotating polygon mirror 97, and the substrate P (the surface to be irradiated) is proportional to the incident angle θp. ) The image height position of the spot light projected above is determined. Further, by setting the reflection surface 97b at the front focal position of the f-θ lens system 85, the drawing beam LB projected on the substrate P can be telecentric at any position on the drawing line (the main position of the drawing beam serving as spot light). The light beam is always parallel to the optical axis AXf of the f-θ lens system 85).

  As shown in FIG. 8, each of the two cylindrical lenses 95 and 86 functions as a parallel plate glass having zero refractive power in a plane (XY plane) perpendicular to the rotation axis 97a of the rotating polygon mirror 97. Then, it functions as a convex lens having a constant positive refractive power in the Z direction (in the XZ plane) where the rotation axis 97a extends. The cross-sectional shape of the drawing beam LB (substantially parallel light beam) incident on the first cylindrical lens 95 is a circular shape of about several mm, but the focal position of the cylindrical lens 95 in the XZ plane is rotated via the reflection mirror 96. When set on the reflection surface 97b of the polygon mirror 97, a slit-shaped spot light having a beam width of several mm in the XY plane and converging in the Z direction extends on the reflection surface 97b in the rotation direction and condenses. I do.

  The drawing beam LB reflected by the reflecting surface 97b of the rotating polygon mirror 97 is a parallel light beam in the XY plane, but becomes a divergent light beam in the XZ plane (in the direction in which the rotation axis 97a extends) to form the f-θ lens system 85. Incident on. Therefore, the drawing beam LB immediately after exiting the f-θ lens system 85 is substantially a parallel light beam in the XZ plane (in the direction in which the rotation axis 97a extends), but due to the action of the second cylindrical lens 86. , XZ plane, that is, on the substrate P, the spot light is also collected in the transport direction of the substrate P orthogonal to the direction in which the drawing lines LL1 to LL5 extend. As a result, a small circular spot light is projected on each drawing line on the substrate P.

  By providing the cylindrical lens 86, as shown on the right side of FIG. 8, the reflection surface 97b of the rotating polygon mirror 97 and the substrate P (surface to be irradiated) are set in an optically conjugate relationship in the XZ plane. Can be. Therefore, even if each reflection surface 97b of the rotating polygon mirror 97 has a tilt error in a non-scanning direction (direction in which the rotation axis 97a extends) orthogonal to the scanning direction of the drawing beam LB, the drawing line on the substrate P The position of (LL1 to LL5) does not shift in the non-scanning direction of the spot light (the transport direction of the substrate P). Thus, by providing the cylindrical lenses 95 and 86 before and after the rotating polygon mirror 97, it is possible to configure an optical system for correcting the inclination of the polygon reflecting surface in the non-scanning direction.

  Here, as shown in FIG. 7, each of the scanners 83 of the plurality of drawing units UW1 to UW5 has a symmetric configuration with respect to the center plane p3. In the plurality of scanners 83, three scanners 83 corresponding to the drawing units UW1, UW3, and UW5 are arranged on the upstream side (the −X direction side in FIG. 7) in the rotation direction of the rotary drum DR, and the drawing units UW2 Two scanners 83 corresponding to UW4 are arranged on the downstream side (the + X direction side in FIG. 7) in the rotation direction of the rotary drum DR. The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 interposed therebetween. As described above, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side have an arrangement relationship of being rotated by 180 ° about the rotation axis I (Z axis). For this reason, when the drawing beam LB is irradiated on the rotating polygon mirror 97 while the three rotating polygon mirrors 97 on the upstream side rotate, for example, counterclockwise, the drawing beam LB reflected by the rotating polygon mirror 97 is drawn. Scanning is performed in a predetermined scanning direction (for example, the + Y direction in FIG. 7) from the start position to the drawing end position. On the other hand, when the drawing beam LB is irradiated on the rotating polygon mirror 97 while the two rotating polygon mirrors 97 on the downstream side rotate counterclockwise, the drawing beam LB reflected by the rotating polygon mirror 97 moves to the drawing start position. Is scanned in a scanning direction (for example, the −Y direction in FIG. 7) opposite to the three rotating polygon mirrors 97 on the upstream side from the drawing end position to the drawing end position.

  Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the odd-numbered drawing units UW1, UW3, UW5 is in the direction coinciding with the installation azimuth line Le1. That is, the installation azimuth line Le1 is a line connecting the odd numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing units UW2 and UW4 is in a direction coinciding with the installation azimuth line Le2. That is, the installation azimuth line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. For this reason, each traveling direction (principal ray) of the drawing beam LB projected as a spot light on the substrate P is set to be directed to the rotation center line AX2 of the rotating drum DR.

  The Y magnification correcting optical member 86B is arranged between the f-θ lens system 85 and the substrate P. The Y magnification correcting optical member 86B is capable of isotropically enlarging or reducing the drawing lines LL1 to LL5 formed by the drawing units UW1 to UW5 by a small amount in the Y direction.

  Specifically, a transparent parallel flat plate (quartz) having a constant thickness and covering each of the drawing lines LL1 to LL5 is mechanically bent (bending) in the direction in which the drawing line extends, and the magnification of the drawing line in the Y direction. (Scanning length) variable mechanism, or a mechanism that moves a part of the three lens systems of the convex lens, concave lens, and convex lens in the optical axis direction to change the magnification (scanning length) of the drawing line in the Y direction. Etc. can be used.

  A predetermined pattern is drawn on the substrate P by controlling each unit of the drawing apparatus 11 configured as described above by the control unit 16. That is, the control unit 16 controls the optical deflector 81 to perform ON / OFF modulation based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. By doing so, the drawing beam LB is deflected, and a pattern is drawn on the photosensitive layer of the substrate P. Further, the control unit 16 synchronizes the scanning direction of the drawing beam LB that scans along the drawing line LL1 with the movement of the substrate P in the transport direction due to the rotation of the rotary drum DR, so that the drawing line in the exposure area A7 is A predetermined pattern is drawn on a portion corresponding to LL1.

  Next, the alignment microscopes AM1 and AM2 will be described with reference to FIG. 9 together with FIG. The alignment microscopes AM1 and AM2 detect alignment marks formed in advance on the substrate P, or reference marks or reference patterns formed on the rotating drum DR. Hereinafter, the alignment mark of the substrate P and the reference mark or reference pattern of the rotating drum DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used for aligning (aligning) the substrate P with a predetermined pattern to be drawn on the substrate P, and for calibrating the rotary drum DR and the drawing device 11.

  The alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 formed by the drawing apparatus 11 in the direction of rotation of the rotary drum DR (the direction of transport of the substrate P). The alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.

  The alignment microscopes AM1 and AM2 project the illumination light onto the substrate P or the rotating drum DR, and at the same time, an objective lens system GA (in FIG. 9, representatively, the objective lens of the alignment microscope AM2 in FIG. An image pickup system GD (shown as a system GA4), which picks up an image of a mark received through the objective lens system GA (bright field image, dark field image, fluorescent image, etc.) by a two-dimensional CCD, CMOS, etc. (Shown as an imaging system GD4 of the alignment microscope AM2). The illumination light for alignment is light in a wavelength range that has little sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

  A plurality (for example, three) of alignment microscopes AM1 are provided in a line in the Y direction (the width direction of the substrate P). Similarly, a plurality (for example, three) of alignment microscopes AM2 are provided in a line in the Y direction (the width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

  FIG. 3 shows an arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 for easy understanding. As shown in FIG. 3, the observation areas (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are aligned with the rotation center line AX2. They are arranged at predetermined intervals in the parallel Y direction. As shown in FIG. 9, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, the observation areas Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the objective lens systems GA of the three alignment microscopes AM2 are Y parallel to the rotation center line AX2 as shown in FIG. Are arranged at predetermined intervals in the direction. As shown in FIG. 9, the optical axes La4 to La6 of the objective lens systems GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary drum DR.

  The observation regions Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set, for example, in a range of about 500 to 200 μm square on the substrate P and the rotating drum DR. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set in the same direction as the installation azimuth line Le3 extending in the radial direction of the rotary drum DR from the rotation center line AX2. You. Thus, the installation azimuth line Le3 is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are set in the same direction as the installation azimuth line Le4 extending in the radial direction of the rotary drum DR from the rotation center line AX2. You. Thus, the installation azimuth line Le4 is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG. At this time, since the alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2, the angle formed between the center plane p3 and the installation azimuth line Le3 is equal to the center plane p3. It is larger than the angle formed by the installation azimuth line Le4.

  As shown in FIG. 3, on the substrate P, exposure regions A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at predetermined intervals in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter abbreviated as marks) for alignment are formed, for example, in a cross shape.

  In FIG. 3, a mark Ks1 is provided at a constant interval in the X direction in a peripheral area on the −Y side of the exposure area A7, and a mark Ks3 is provided in a peripheral area on the + Y side of the exposure area A7 in the X direction. Provided at intervals. Further, the mark Ks2 is provided at the center in the Y direction in a blank area between two exposure areas A7 adjacent in the X direction.

  Then, the mark Ks1 is sequentially captured while the substrate P is being fed within the observation region Vw1 of the objective lens system GA1 of the alignment microscope AM1 and within the observation region Vw4 of the objective lens system GA of the alignment microscope AM2. Formed. The marks Ks3 are sequentially captured in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation area Vw6 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being fed. Formed. Further, the marks Ks2 are sequentially captured in the observation region Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation region Vw5 of the objective lens system GA of the alignment microscope AM2 while the substrate P is being fed. It is formed as follows.

  For this reason, of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotary drum DR always observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P. be able to. Of the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 in the center of the rotary drum DR in the Y direction are marks formed in margins and the like between the exposure areas A7 drawn on the substrate P. Ks2 can always be observed or detected.

  Here, since the exposure apparatus EX is a so-called multi-beam type drawing apparatus, a plurality of patterns to be drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 are used in the Y direction. Therefore, it is necessary to perform calibration for suppressing the joining accuracy of the plurality of drawing units UW1 to UW5 to within an allowable range. Further, the relative positional relationship between the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to each of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 needs to be accurately obtained by baseline management. Calibration is also required for the baseline management.

  In the calibration for checking the joining accuracy by the plurality of drawing units UW1 to UW5 and the calibration for managing the baseline of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotating drum DR supporting the substrate P is used. , Reference marks and reference patterns need to be provided. Therefore, as shown in FIG. 10, the exposure apparatus EX uses a rotating drum DR provided with reference marks and reference patterns on the outer peripheral surface.

  The rotating drum DR has scale portions GPa and GPb constituting a part of a rotation position detecting mechanism 14 described later formed on both ends of the outer peripheral surface in the same manner as in FIGS. 3 and 9. Further, in the rotary drum DR, inside the scale portions GPa, GPb, narrow restricting bands CLa, CLb formed by concave grooves or convex rims are engraved over the entire circumference. The width of the substrate P in the Y direction is set smaller than the distance between the two restriction bands CLa and CLb in the Y direction, and the substrate P is sandwiched between the restriction bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is supported in close contact with the inner area.

  The rotating drum DR includes a plurality of line patterns RL1 (line patterns) inclined at +45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched between the regulation bands CLa and CLb, and a line pattern RL1 with -45 degrees relative to the rotation center line AX2. A mesh-like reference pattern (also usable as a reference mark) RMP is provided by repeatedly engraving a plurality of line patterns RL2 (line patterns) inclined at a predetermined pitch (period) Pf1 and Pf2. Note that the width of the line pattern RL1 and the line pattern RL2 is LW.

  The reference pattern RMP is formed as a uniform oblique pattern (oblique lattice pattern) so as not to cause a change in the frictional force or the tension of the substrate P at a portion where the substrate P and the outer peripheral surface of the rotary drum DR come into contact. I have. Note that the line patterns RL1 and RL2 do not necessarily have to be at an oblique angle of 45 degrees, and may be vertical and horizontal mesh patterns in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Further, the line patterns RL1 and RL2 do not need to intersect at 90 degrees, and a rectangular area surrounded by two adjacent line patterns RL1 and two adjacent line patterns RL2 is not a square (or a rectangle). The line patterns RL1 and RL2 may intersect at an angle so as to form a rhombus.

  Next, the rotational position detection mechanism 14 will be described with reference to FIGS. As shown in FIG. 9, the rotation position detection mechanism 14 optically detects the rotation position of the rotary drum DR, and employs, for example, an encoder system using a rotary encoder or the like. The rotational position detecting mechanism 14 is a movement measuring device having scale portions GPa, GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads EN1, EN2, EN3, EN4 facing each of the scale portions GPa, GPb. It is. 4 and 9, only four encoder heads EN1, EN2, EN3, and EN4 facing the scale unit GPa are shown, but similar encoder heads EN1, EN2, EN3, and EN4 also face the scale unit GPb. Placed. The rotation position detection mechanism 14 has displacement meters YN1, YN2, YN3, and YN4 that can detect the deflection (small displacement in the Y direction in which the rotation center line AX2 extends) of both ends of the rotary drum DR.

  The scales of the scale portions GPa and GPb are each formed in a ring shape over the entire outer circumferential surface of the rotary drum DR in the circumferential direction. The scale portions GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as incremental scales. Therefore, the scale portions GPa and GPb rotate integrally with the rotary drum DR around the rotation center line AX2.

  The substrate P is configured to be wound inside the scale drums GPa and GPb at both ends of the rotary drum DR, that is, inside the regulation bands CLa and CLb. When a strict arrangement relationship is required, the outer peripheral surfaces of the scale portions GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are made to be the same surface (the same radius from the center line AX2). Set. For this purpose, the outer peripheral surfaces of the scale portions GPa and GPb may be higher than the outer peripheral surface of the rotary drum DR for winding the substrate by the thickness of the substrate P in the radial direction. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotary drum DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale portions GPa and GPb at the same radial position as the drawing surface on the substrate P wound around the rotary drum DR, and can determine the measurement position and the processing position. Can be reduced in the radial direction of the rotating system.

  The encoder heads EN1, EN2, EN3, and EN4 are respectively disposed around the scale portions GPa and GPb when viewed from the rotation center line AX2, and are located at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN1, EN2, EN3, and EN4 are connected to the control unit 16. The encoder heads EN1, EN2, EN3, and EN4 project a light beam for measurement toward the scale portions GPa and GPb, and photoelectrically detect a reflected light beam (diffraction light), thereby detecting the circumferential direction of the scale portions GPa and GPb. A detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the change in the position is output to the control unit 16. The control unit 16 interpolates and digitally processes the detection signal by a counter circuit (not shown) to thereby perform a digital process, thereby detecting a change in the angle of the rotating drum DR, that is, a change in the circumferential position of the outer peripheral surface with a submicron resolution. Can be measured. The control unit 16 can also measure the transfer speed of the substrate P from the change in the angle of the rotary drum DR.

  In addition, as shown in FIGS. 4 and 9, the encoder head EN1 is arranged on the installation azimuth line Le1. The installation azimuth line Le1 is a line connecting the rotation center line AX2 and the projection area (read position) of the measurement light beam by the encoder head EN1 on the scale portion GPa (GPb) in the XZ plane. Further, as described above, the installation azimuth line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. As described above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 have the same azimuth line.

  Similarly, as shown in FIGS. 4 and 9, the encoder head EN2 is arranged on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting the rotation center line AX2 with the projection area (read position) of the measurement light beam on the scale GPa (GPb) by the encoder head EN2 in the XZ plane. Further, as described above, the installation orientation line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. As described above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 have the same azimuth line.

  As shown in FIGS. 4 and 9, the encoder head EN3 is disposed on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting the rotation center line AX2 and the projection area (read position) of the measurement light beam on the scale GPa (GPb) by the encoder head EN3 in the XZ plane. Further, as described above, the installation azimuth line Le3 is a line connecting the rotation center line AX2 and the observation regions Vw1 to Vw3 of the substrate P by the alignment microscope AM1 in the XZ plane. As described above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 have the same orientation in the XZ plane. It is a line.

  Similarly, as shown in FIGS. 4 and 9, the encoder head EN4 is arranged on the installation azimuth line Le4. The installation azimuth line Le4 is a line connecting the rotation center line AX2 with the projection area (reading position) of the measurement light beam on the scale GPa (GPb) by the encoder head EN4 in the XZ plane. Further, as described above, the installation azimuth line Le4 is a line connecting the rotation center line AX2 and the observation regions Vw4 to Vw6 of the substrate P by the alignment microscope AM2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 have the same orientation in the XZ plane. It is a line.

  When the installation orientations of the encoder heads EN1, EN2, EN3, and EN4 (angular directions in the XZ plane about the rotation center line AX2) are represented by the installation orientation lines Le1, Le2, Le3, and Le4, as shown in FIG. , The plurality of drawing units UW1 to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 are at an angle ± θ ° with respect to the center plane p3. The installation azimuth line Le1 and the installation azimuth line Le2 are set such that the encoder head EN1 and the encoder head EN2 are spatially non-interfering around the scale of the scale GPa (GPb).

  The displacement meters YN1, YN2, YN3, and YN4 are arranged around the scale portion GPa or GPb when viewed from the rotation center line AX2, and are located at different positions in the circumferential direction of the rotary drum DR. The displacement meters YN1, YN2, YN3, and YN4 are connected to the control unit 16.

  The displacement meters YN1, YN2, YN3, and YN4 can reduce Abbe error by detecting the displacement at a position as close to the drawing surface on the substrate P wound around the rotary drum DR as possible in the radial direction. The displacement meters YN1, YN2, YN3, and YN4 project a light beam for measurement toward one of both ends of the rotating drum DR, and photoelectrically detect the reflected light beam (or diffracted light), thereby detecting the rotating drum DR. A detection signal corresponding to a change in the position of both ends in the Y direction (width direction of the substrate P) is output to the control unit 16. The control unit 16 digitally processes the detection signal by a measuring circuit (not shown) (a counter circuit, an interpolation circuit, or the like) so that a change in the displacement of the rotating drum DR (and the substrate P) in the Y direction can have a submicron resolution. Can be measured. The control unit 16 can also measure the whirling of the rotary drum DR from one change of both ends of the rotary drum DR.

  One of the four displacement meters YN1, YN2, YN3, and YN4 is sufficient, but for measurement of whirling of the rotary drum DR, for example, if there are three or more of the four, both ends of the rotary drum DR Movement (dynamic change in inclination, etc.) of one of the surfaces can be grasped. When the control unit 16 can constantly measure the marks and patterns on the substrate P (or the marks on the rotating drum DR or the like) by the alignment microscopes AM1 and AM2, the displacement meters YN1, YN2, YN3, and YN4 are omitted. May be.

  Here, the control unit 16 detects the rotation angle positions of the scale units (rotary drums DR) GPa and GPb by the encoder heads EN1 and EN2, and based on the detected rotation angle positions, the odd-numbered and even-numbered drawing units UW1. To UW5. That is, the control unit 16 controls the optical deflector 81 to perform ON / OFF modulation based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected on the substrate P is scanning in the scanning direction. However, by performing the timing of ON / OFF modulation by the optical deflector 81 based on the detected rotational angle position, a pattern can be accurately drawn on the photosensitive layer of the substrate P.

  When the alignment microscopes AM1 and AM2 detect the alignment marks Ks1 to Ks3 on the substrate P, the control unit 16 rotates the scale units GPa and GPb (rotary drum DR) detected by the encoder heads EN3 and EN4. By storing the angular positions, the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angle positions of the rotary drum DR can be obtained. Similarly, when the reference patterns RMP on the rotary drum DR are detected by the alignment microscopes AM1 and AM2, the control unit 16 rotates the scale units GPa and GPb (rotary drum DR) detected by the encoder heads EN3 and EN4. By storing the angular position, the correspondence between the position of the reference pattern RMP on the rotary drum DR and the rotational angle position of the rotary drum DR can be obtained. As described above, the alignment microscopes AM1 and AM2 can precisely measure the rotation angle position (or circumferential position) of the rotating drum DR at the moment when the mark is sampled in the observation regions Vw1 to Vw6. The exposure apparatus EX aligns (aligns) the substrate P with a predetermined pattern to be drawn on the substrate P based on the measurement result, and calibrates the rotary drum DR and the drawing apparatus 11. I do.

  In the actual sampling, the rotation angle position of the rotary drum DR measured by the encoder heads EN3 and EN4 corresponds to the mark on the substrate P or the position of the reference pattern RMP on the rotary drum DR which is roughly known in advance. At this time, the image information output from each imaging system GD of the alignment microscopes AM1 and AM2 is written into an image memory or the like at a high speed. That is, the image information output from each imaging system GD is sampled using the rotation angle position of the rotary drum DR measured by the encoder heads EN3 and EN4 as a trigger. Separately, in response to each pulse of a clock signal having a constant frequency, the rotation angle position (counter measurement value) of the rotating drum DR measured by the encoder heads EN3 and EN4 and the image output from each imaging system GD There is also a method of simultaneously sampling the information.

  Further, since the mark on the substrate P and the reference pattern RMP on the rotating drum DR move in one direction with respect to the observation areas Vw1 to Vw6, when sampling the image information output from each imaging system GD, It is desirable to use a CCD or CMOS image sensor having a high shutter speed. Accordingly, it is necessary to increase the luminance of illumination light for illuminating the observation regions Vw1 to Vw6, and it is conceivable to use a strobe light, a high-brightness LED, or the like as an illumination light source for the alignment microscopes AM1 and AM2.

  FIG. 11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on a substrate. The drawing units UW1 to UW5 draw the patterns PT1 to PT5 by scanning the spot light of the drawing beam LB along the drawing lines LL1 to LL5. The drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start ends PTa of the patterns PT1 to PT5. The drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 become the drawing end PTb of the patterns PT1 to PT5.

  The drawing end PTb of the pattern PT1 and the drawing end PTb of the pattern PT1 joins with the drawing end PTb of the pattern PT2. Similarly, the drawing start end PTa of the pattern PT2 is joined to the drawing start end PTa of the pattern PT3, the drawing end PTb of the pattern PT3 is joined to the drawing end PTb of the pattern PT4, and the drawing start end PTa of the pattern PT4 is set to the drawing start end PTa of the pattern PT5. Join with. In this manner, the patterns PT1 to PT5 drawn on the substrate P are joined together in the width direction of the substrate P as the substrate P moves in the longitudinal direction, and the device pattern is drawn over the entire large exposure area A7. You.

  FIG. 12 is an explanatory diagram showing the relationship between the spot light of the writing beam and the writing line. The drawing lines LL1 and LL2 of the drawing units UW1 and UW2 will be described as representatives among the drawing units UW1 to UW5. The same applies to the drawing lines LL3 to LL5 of the drawing units UW3 to UW5, and the description is omitted. By the constant rotation of the rotating polygon mirror 97, the beam spot light SP of the drawing beam LB is drawn along the drawing lines LL1 and LL2 on the substrate P from the drawing start positions OC1, OC2 to the drawing end positions EC1, EC2. The length LBL is scanned.

  Normally, in the direct drawing exposure method, even when a pattern of the minimum size that can be exposed by the apparatus is drawn, high-precision and stable pattern drawing is realized by multiple exposure (multiple writing) using a plurality of spot lights SP. As shown in FIG. 12, when the effective diameter of the spot light SP is Xs on the drawing lines LL1 and LL2, since the drawing beam LB is a pulse light, one pulse light (light emission time in picosecond order) ) And the spot light SP generated by the next one pulse light are scanned so as to overlap in the Y direction (main scanning direction) at a distance CXs of about 約 of the diameter Xs. Have been.

  Since the substrate P is conveyed in the + X direction at a constant speed at the same time as the main scanning of the spot light SP along the drawing lines LL1 and LL2, the drawing lines LL1 and LL2 are fixed on the substrate P in the X direction. Move (sub-scan) at pitch. The pitch is also set here to a distance CXs which is about １ ／ of the diameter Xs of the spot light SP, but is not limited thereto. Thereby, also in the sub-scanning direction (X direction), spot lights SP adjacent in the X direction are overlapped and exposed at a distance CXs of 1/2 of the diameter Xs (or another overlapping distance may be used). . Further, the beam spot light SP shot at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP shot at the drawing end position EC2 of the drawing line LL2 move in the longitudinal direction of the substrate P (ie, the sub-scanning). ), The drawing start position OC1 and the drawing end position EC1 of the drawing line LL1 and the drawing start position OC2 of the drawing line LL2 are connected so as to be joined at the overlap distance CXs in the width direction (Y direction) of the substrate P. The end position EC2 is set.

  As an example, assuming that the effective diameter Xs of the beam spot light SP is 4 μm, the spot light SP is occupied by 2 rows × 2 columns (a total of four spot lights superimposed and arranged in both main scanning and sub-scanning directions). A pattern whose area or area occupied by 3 rows × 3 columns (a total of nine spot lights superimposed and arranged in both main scanning and sub-scanning directions) has a minimum dimension, that is, a minimum dimension of about 6 μm to 8 μm Can be favorably exposed. Further, when the reflecting surface 97b of the rotating polygon mirror 97 is set to ten surfaces and the rotation speed of the rotating polygon mirror 97 around the rotation axis 97a is set to 10,000 rpm or more, the drawing on the drawing lines (LL1 to LL5) by the rotating polygon mirror 97 is performed. The number of scans (referred to as scan frequency Fms) of the spot light SP (the drawing beam LB) can be set to 1666.66. This means that patterns of 1666 or more drawing lines can be drawn on the substrate P in the transport direction (X direction) per second.

  When the transport speed of the substrate P due to the rotational drive of the rotary drum DR is about 5 mm / s, the drawing line LL1 (the same applies to LL2 to LL5) in the X direction (the transport direction of the substrate P) shown in FIG. The pitch (distance CXs) can be about 3 μm.

  In the case of the present embodiment, the resolution R of pattern writing in the main scanning direction (Y direction), together with the effective diameter Xs and the scanning frequency Fms of the spot light SP, together with the acousto-optic element (AOM) constituting the optical deflector 81 It is determined by the minimum ON / OFF switching time. When an acousto-optic element (AOM) having the highest response frequency Fss = 50 MHz is used, each time of the ON state and the OFF state can be set to about 20 nS. Further, the effective scanning period (scanning of the spot light for the length LBL of the drawing line) of the drawing beam LB by one reflecting surface 97b of the rotating polygon mirror 97 is about 1/3 of the rotation angle of one reflecting surface 97b. Therefore, when the length LBL of the drawing line is 30 mm, the resolution R determined depending on the switching time of the optical deflector 81 is R = LBL / (1/3) / (1 / Fms) × ( 1 / Fss) ≒ 3 μm.

  From this relational expression, in order to improve the pattern drawing resolution R, for example, an acousto-optic element (AOM) of the optical deflector 81 having a maximum response frequency Fss of 100 MHz is used, and the ON / OFF switching time is set to 10 nsec. . As a result, the resolution R is reduced by half to 1.5 μm. In this case, the transfer speed of the substrate P due to the rotation of the rotary drum DR is halved. As another method of improving the resolution R, for example, the rotation speed of the rotating polygon mirror 97 may be increased.

Generally, a resist used for photolithography has a resist sensitivity Sr of about 30 mj / cm ² . The transmittance ΔTs of the optical system is 0.5 (50%), the effective scanning period in one reflection surface 97b of the rotating polygon mirror 97 is about ３, the length LBL of the drawing line is 30 mm, and the drawing units UW1 to UW1 Assuming that the number Nuw of the UW5 is 5 and the transport speed Vp of the substrate P by the rotating drum DR is 5 mm / s (300 mm / min), the required laser power Pw of the light source device CNT can be estimated as follows.

  Pw = 30/60 × 3 × 30 × 5 / 0.5 / (1/3) = 1350 mW

  If there are seven drawing units, the required laser power Pw of the light source device CNT can be estimated by the following equation.

  Pw = 30/60 × 3 × 30 × 7 / 0.5 / (1/3) = 1890 mW

For example, if the resist sensitivity is about 80 mj / cm ² , a light source device CNT having a beam output of about 3 to 5 W is required to perform exposure at the same speed. Instead of preparing such a high-power light source, if the transport speed Vp of the substrate P due to the rotation of the rotary drum DR is reduced to 30/80 with respect to the initial value of 5 mm / s, the beam output becomes 1.4. Exposure with a light source device of about 1.9 W is also possible.

  The length LBL of the drawing line is 30 mm, and the spot diameter Xs of the beam spot light SP and the resolution determined by the optical switching by the acousto-optic device (AOM) of the optical deflector 81 (the minimum grid for specifying the beam position, When Xg is equal to 3 μm, the time for one rotation of the rotating polygon mirror 97 when the rotation speed of the ten-side rotating polygon mirror 97 is 10,000 rpm is 3/500 seconds, and the rotating polygon Assuming that the effective scanning period of one reflecting surface 97b of the mirror 97 is 1/3 of the rotation angle of one reflecting surface 97b, the effective scanning time Ts (second) of one reflecting surface 97b is (3/500). ) × (1/10) × (1/3), and Ts = 1/5000 (seconds). Thus, the pulse emission frequency Fz when the light source device CNT is a pulse laser is obtained by Fz = LBL / (Ts.Xs), and Fz = 50 MHz is the lowest frequency. Therefore, in the embodiment, the light source device CNT that outputs a pulse laser having a frequency of 50 MHz or more is required. For this reason, the pulse emission frequency Fz of the light source device CNT is preferably at least twice (for example, 100 MHz) the maximum response frequency Fss (for example, 50 MHz) of the acousto-optic device (AOM) of the optical deflector 81.

  Further, the drive signal for switching the acousto-optic element (AOM) of the optical deflector 81 between the ON state and the OFF state is transmitted while the acousto-optic element (AOM) transitions from the ON state to the OFF state or from the OFF state to the ON state. It is preferable to control the light source device CNT to be synchronized with a clock signal that oscillates at the pulse light emission frequency Fz so that pulse light emission does not occur during the operation.

  Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse emission frequency Fz of the light source device CNT will be described with reference to the graph of FIG. 13 from the viewpoint of the beam shape (the intensity distribution of the two spot light SPs to be superimposed). I do. The horizontal axis in FIG. 13 represents the drawing position of the spot light SP in the Y direction along the drawing line or the X direction along the transport direction of the substrate P, or the dimension of the spot light SP, and the vertical axis represents a single spot. This represents a relative intensity value where the peak intensity of the light SP is normalized to 1.0. Here, the description will be made assuming that the intensity distribution of the single spot light SP is J1 and that it is a Gaussian distribution.

In FIG. 13, it is assumed that the intensity distribution J1 of the single spot light SP has a diameter of 3 μm at an intensity of 1 / e ² with respect to the peak intensity. The intensity distributions J2 to J6 are simulations of integrated intensity distributions (profiles) obtained on the substrate P when the two pulses of the spot light SP are irradiated at different positions in the main scanning direction or the sub-scanning direction. Results are shown, and the amount of displacement (interval distance) is different for each.

  In the graph of FIG. 13, the intensity distribution J5 shows the case where the spot light SP for two pulses is shifted by the same distance as the diameter of 3 μm, and the intensity distribution J4 shows that the distance between the spot light SP for two pulses is two. In the case of .25 μm, the intensity distribution J3 shows a case where the interval distance of the spot light SP for two pulses is 1.5 μm. As is clear from the changes in the intensity distributions J3 to J5, in the intensity distribution J5, when the spot light SP having a diameter of 3 μm is irradiated at an interval of 3 μm, the integrated profile shows each of the two spot lights. At the center of the spot light, the normalized intensity is only about 0.3 at the midpoint of the two spot lights. On the other hand, under the condition that the spot light SP having a diameter of 3 μm is irradiated at an interval of 1.5 μm, the integrated profile has no noticeable bump-like distribution in the profile, and the midpoint of the two spot lights It is almost flat across the position.

  In FIG. 13, the intensity distribution J2 shows an integration profile when the interval distance between the spot lights SP for two pulses is set to 0.75 μm, and the intensity distribution J6 shows the interval distance as the intensity of the single spot light SP. The integrated profile when the full width at half maximum (FWHM) of the distribution J1 is set to 1.78 μm is shown.

  As described above, in the case of the pulse oscillation condition in which two spot lights are irradiated at an interval distance CXs shorter than the same interval as the diameter Xs of the spot light SP, two bump-like distributions are likely to appear remarkably. It is desirable to set the interval distance to an optimum value that does not cause intensity unevenness (deterioration of drawing accuracy) at the time of exposure. As in the case of the intensity distribution J3 or J6 in FIG. 13, it is preferable to superimpose the light spots SP at an interval CXs of about half (for example, 40 to 60%) of the diameter Xs of the single spot light SP. In the main scanning direction, the optimal spacing distance CXs is determined by the pulse emission frequency Fz of the light source device CNT and the scanning speed or scanning time Ts of the spot light SP along the drawing line (rotation speed of the rotating polygon mirror 97). The sub-scanning direction can be set by adjusting at least one of the scanning frequency Fms of the drawing line (the rotation speed of the rotating polygon mirror 97) and the moving speed of the substrate P in the X direction. Can be set.

  For example, if the absolute value of the rotation speed of the rotating polygon mirror 97 (scanning time Ts of the spot light) cannot be adjusted with high accuracy, the pulse light emission frequency Fz of the light source device CNT is finely adjusted so that the spot light in the main scanning direction can be adjusted. The ratio between the SP spacing distance CXs and the spot light diameter Xs (dimension) can be adjusted to an optimum range.

As described above, when the two spot lights SP are superimposed in the scanning direction, that is, when Xs> CXs, the light source device CNT sets the pulse emission frequency Fz in a relationship of Fz> LBL / (Ts.Xs). Therefore, it is set so as to satisfy the relationship of Fz = LBL / (Ts · CXs). For example, when the pulse light emission frequency Fz of the light source device CNT is 100 MHz, when the rotating polygon mirror 97 is rotated at 10,000 rpm with ten surfaces, the effective spot light defined by 1 / e ² or full width at half maximum (FWHM) is obtained. Assuming that the typical diameter Xs is 3 μm, a pulse laser beam (spot light) from each of the drawing units UW1 to UW5 is irradiated on each of the drawing lines LL1 to LL5 at an interval (CXs) of about half of the diameter Xs at 1.5 μm. be able to. As a result, the uniformity of the exposure amount at the time of pattern drawing is improved, a faithful exposure image (resist image) according to the drawing data is obtained even for a fine pattern, and high-precision drawing can be achieved.

  Further, the resolution (highest response frequency Fss) determined by the optical switching speed of the acousto-optic element (AOM) and the pulse oscillation frequency Fz of the light source device CNT are integer multiples of a position or a time when h is an arbitrary integer. , That is, Fz = h · Fss. This is to prevent ON / OFF during the emission of the pulse beam from the light source device CNT due to the timing of the optical switching of the acousto-optic element (AOM).

  In the exposure apparatus EX of the first embodiment, since the light source device CNT of the pulse laser light source in which the fiber amplifiers FB1 and FB2 and the wavelength conversion element of the wavelength conversion unit CU2 are combined is used, the exposure device EX operates in the ultraviolet wavelength range (400 to 300 nm). Thus, pulsed light having such a high oscillation frequency can be easily obtained.

  Next, a method of adjusting the drawing apparatus 11 of the exposure apparatus EX will be described. FIG. 14 is a flowchart relating to the adjustment method of the exposure apparatus of the first embodiment. FIG. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating drum and the drawing line. FIG. 16 is an explanatory diagram schematically showing signals output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a bright field. The control unit 16 rotates the rotating drum DR as shown in FIG. 15 for calibration for grasping the positional relationship between the plurality of drawing units UW1 to UW5. The rotating drum DR may transport the substrate P having a light transmitting property enough to transmit the drawing beam LB.

  As described above, the reference pattern RMP is integral with the outer peripheral surface of the rotating drum DR. As shown in FIG. 15, among the reference patterns RMP, an arbitrary reference pattern RMP1 moves as the outer peripheral surface of the rotating drum DR moves. Therefore, the reference pattern RMP1 passes through the drawing lines LL1, LL3, LL5, and then passes through the drawing lines LL2, LL4. For example, when the same reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5, the control unit 16 scans the drawing beams LB of the drawing units UW1, UW3, and UW5. Then, when the same reference pattern RMP1 has passed the drawing lines LL2 and LL4, the control unit 16 scans the drawing beams LB of the drawing units UW2 and UW4 (step S1). Therefore, the reference pattern RMP1 serves as a reference for grasping the positional relationship between the drawing units UW1 to UW5.

  The photoelectric sensor 31Cs (FIG. 4) of the above-described calibration detection system 31 detects reflected light from the reference pattern RMP1 via the f-θ lens system 85 and the scanning optical system including the scanner 83. The photoelectric sensor 31Cs is connected to the control unit 16, and the control unit 16 detects a detection signal of the photoelectric sensor 31Cs (Step S2). For example, the drawing units UW1 to UW5 scan a plurality of lines of the plurality of drawing beams LB in a predetermined scanning direction for each of the drawing lines LL1 to LL5.

  For example, as shown in FIG. 16, the drawing units UW1 to UW5 transfer the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above. The first column scan SC1 is performed for LBL (see FIG. 12). Next, the drawing units UW1 to UW5 transfer the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above (see FIG. 12). Only the second column scan SC2 is performed. Next, the drawing units UW1 to UW5 transfer the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above (see FIG. 12). Only the third column scan SC3 is performed.

  Since the rotating drum DR rotates around the rotation center line AX2, the positions of the first row scan SC1, the second row scan SC2, and the third row scan SC3 in the X direction on the reference pattern RMP1 are ΔP1 and ΔP2. different. The control unit 16 scans the drawing beam LB along the first row scan SC1 while keeping the rotating drum DR stationary, and thereafter, rotates the rotating drum DR by ΔP1 and stops, and the second row A sequence in which each unit is operated in the order of scanning the drawing beam LB along the scan SC2, rotating the rotary drum DR again by ΔP2 to stand still, and scanning the drawing beam LB along the third column scan SC3, is also possible. Good.

  As described above, in the reference pattern RMP, the intersections Cr1 and Cr2 of the two intersecting line patterns RL1 and RL2 formed on the outer peripheral surface of the rotary drum DR are smaller than the above-described drawing line length LBL. Is set. Therefore, when the drawing beam LB of the first row scan SC1, the second row scan SC2, and the third row scan SC3 is projected, the drawing beam LB is irradiated on at least the intersections Cr1 and Cr2. The line patterns RL1 and RL2 are formed as irregularities on the surface of the rotating drum DR. When the step amount of the unevenness on the surface of the rotary drum DR is set to a specific condition, the reflected light generated by projecting the drawing beam LB onto the line patterns RL1 and RL2 partially has a difference in reflection intensity. For example, as shown in FIG. 16, when the line patterns RL1 and RL2 are concave portions on the surface of the rotary drum DR, when the drawing beam LB is projected on the line patterns RL1 and RL2, the reflection reflected by the line patterns RL1 and RL2. Light is received by the photoelectric sensor 31Cs in a bright field.

  The control unit 16 detects the edge position pcl of the reference pattern RMP based on the output signal from the photoelectric sensor 31Cs. For example, the control unit 16 converts the first column scanning position data Dsc1 and the center value mpscl of the edge position pcl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first column scanning SC1. Remember.

  Next, based on the output signal obtained from the photoelectric sensor 31Cs at the time of the second column scanning SC2, the control unit 16 calculates the second column scanning position data Dsc2 and the center value mpscl of the edge position pscl of the reference pattern RMP. Is stored. Then, the control unit 16 stores the third column scanning position data Dsc3 and the center value mpscl of the edge position pscl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs at the time of the third column scanning SC3. I do.

  The control unit 16 intersects each other based on the first column scanning position data Dsc1, the second column scanning position data Dsc2, and the third column scanning position data Dsc3, and the center value mpscl of the edge positions pscl of the plurality of reference patterns RMP. The coordinate positions of the intersections Cr1 and Cr2 of the book line patterns RL1 and RL2 are calculated. As a result, the control unit 16 can also calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other and the drawing start position OC1. Similarly, for the other drawing units UW2 to UW5, the control unit 16 also determines the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other and the drawing start positions OC2 to OC5 (see FIG. 11). Can be calculated. Note that the above-described center value mpscl may be obtained from the peak value of the signal output from the photoelectric sensor 31Cs.

  The case where the photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2 in the bright field has been described above. The photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2 in the dark field. You may. FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. FIG. 18 is an explanatory diagram schematically showing signals output from a photoelectric sensor that receives reflected light from a reference pattern of a rotating drum in a dark field. As shown in FIG. 17, in the calibration detection system 31, a light shielding member 31f having a ring-shaped light transmitting portion is disposed between the relay lens 94 and the photoelectric sensor 31Cs. Therefore, the photoelectric sensor 31Cs receives edge scattered light or diffracted light of the reflected light reflected by the line patterns RL1 and RL2. For example, as shown in FIG. 18, when the line patterns RL1 and RL2 are concave portions on the surface of the rotating drum DR, when the drawing beam LB is projected onto the line patterns RL1 and RL2, the photoelectric sensor 31Cs causes the line patterns RL1 and RL2 The reflected light reflected at is received in a dark field.

  The control unit 16 detects the edge position pscdl of the reference pattern RMP based on the signal output from the photoelectric sensor 31Cs. For example, the control unit 16 converts the first column scanning position data Dsc1 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first column scanning SC1. Remember. Next, based on the output signal obtained from the photoelectric sensor 31Cs at the time of the second column scanning SC2, the control unit 16 calculates the second column scanning position data Dsc2 and the center value mpscdl of the edge position pscdl of the reference pattern RMP. Is stored. The control unit 16 stores the third column scanning position data Dsc3 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the third column scanning SC3. .

  The control unit 16 intersects each other based on the first column scanning position data Dsc1, the second column scanning position data Dsc2, the third column scanning position data Dsc3, and the center value mpscdl of the edge positions pscdl of the plurality of reference patterns RMP. Intersections Cr1 and Cr2 of these line patterns RL1 and RL2 are obtained by calculation. As a result, the control unit 16 calculates the relationship between the coordinate positions of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1.

  Similarly, for the other drawing units UW2 to UW5, the control unit 16 can also calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other and the drawing start positions OC2 to OC5. . As described above, when the photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2 in the dark field, the accuracy of the edge positions pscdl of the plurality of reference patterns RMP can be improved.

  As shown in FIG. 14, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors from the detection signal detected in step S2 (step S2). S3). FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating drum. FIG. 20 is an explanatory diagram schematically showing the relative positional relationship between a plurality of drawing lines. As described above, the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged, and as shown in FIG. 19, the first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL3. The control unit 16 stores the reference distance PL between the intersections Cr1 detected for each drawing line LL5 in advance. Similarly, the control unit 16 also stores in advance the reference distance PL between the intersections Cr1 detected for each of the second drawing line LL2 and the fourth drawing line LL4. The control unit 16 also stores in advance the reference distance ΔPL between the intersections Cr1 to be detected for each of the second drawing line LL2 and the third drawing line LL3. Further, the control unit 16 also stores in advance the reference distance ΔPL between the intersections Cr1 to be detected for each of the fourth drawing line LL4 and the fifth drawing line LL5.

  For example, as shown in FIG. 20, the control unit 16 can grasp the positional relationship of the drawing start position OC1 of the first drawing line LL1 based on the signal from the origin detector 98 (see FIG. 7). The distance BL1 between the intersection Cr1 and the drawing start position OC1 can be obtained. Further, since the position of the drawing start position OC3 of the third drawing line LL3 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL3 between the intersection Cr1 and the drawing start position OC3. For this reason, the control unit 16 obtains the positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3, and the reference distance PL, and writes the drawing beam that scans along the drawing lines LL1, LL3. The distance ΔOC13 between the origins of the LBs can be stored. Similarly, since the position of the drawing start position OC5 of the fifth drawing line LL5 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL5 between the intersection Cr1 and the drawing start position OC5. For this reason, the control unit 16 obtains the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5, and the reference distance PL, and writes the drawing beam that scans along the drawing lines LL3, LL5. The distance ΔOC35 between the origins of the LBs can be stored.

  Since the position of the drawing start position OC2 of the second drawing line LL2 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL2 between the intersection Cr1 and the drawing start position OC2. Further, since the position of the drawing start position OC4 of the fourth drawing line LL4 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL4 between the intersection Cr1 and the drawing start position OC4. For this reason, the control unit 16 obtains the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and writes the drawing beam that scans along the drawing lines LL2, LL4. The distance ΔOC24 between the origins of the LBs can be stored.

  In addition, since the drawing start position OC1 and the drawing start position OC2 are the positions obtained through the same reference pattern RMP1, the control unit 16 determines that the drawing beam easily scans along the drawing lines LL1 and LL2. The distance ΔOC12 between the origins of the LBs can be stored. As described above, the exposure apparatus EX can determine the mutual positional relationship between the origins (drawing start points) of the plurality of drawing units UW1 to UW5.

  Further, the control unit 16 detects an error in which the drawing start position OC2 and the drawing start position OC3 are joined from the reference distance ΔPL between the intersection points Cr1 detected in the second drawing line LL2 and the third drawing line LL3. be able to. Further, an error at which the drawing start position OC4 and the drawing start position OC5 are joined can be detected from the reference distance ΔPL between the intersections Cr1 detected on the fourth drawing line LL4 and the fifth drawing line LL5. .

  Two intersections Cr1 and Cr2 are detected between the drawing start positions OC1 to OC5 and the drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5. Thus, the scanning direction from the drawing start positions OC1 to OC5 to the drawing end positions EC1 to EC5 can be detected. As a result, the control unit 16 can detect an angle error with respect to a direction (Y direction) in which each of the drawing lines LL1 to LL5 is along the center line AX2.

  The control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error with respect to the above-described reference pattern RMP1. The reference pattern RMP including the reference pattern RMP1 is a mesh-shaped reference pattern repeatedly engraved at a constant pitch (period) Pf1, Pf2. For this reason, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement error with respect to the reference pattern RMP repeated at each pitch Pf1, Pf2. Information relating to the deviation of the relative positional relationship between the drawing lines LL1 to LL5 is calculated. As a result, the control unit 16 can further improve the accuracy of adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors.

  Next, as shown in FIG. 14, the control unit 16 performs a process of adjusting the drawing state (Step S4). The control unit 16 includes adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and scale units (rotary drums DR) GPa and GPb detected by the encoder heads EN1 and EN2. The drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are adjusted based on the rotation angle positions of. The encoder heads EN1 and EN2 can detect the feed amount of the substrate P based on the above-described scale units (rotary drum DR) GPa and GPb.

  FIG. 21 is an explanatory diagram schematically showing the relationship between the moving distance of the substrate per unit time and the number of drawing lines included in the moving distance, as in FIG. As shown in FIG. 21, the encoder heads EN1 and EN2 can detect and store the moving distance ΔX of the substrate P per unit time. Note that the alignment microscopes AM1 and AM2 may sequentially detect the plurality of alignment marks Ks1 to Ks3 to determine and store the moving distance ΔX.

  At the moving distance ΔX of the substrate P per unit time, the plurality of drawing lines LL1 by the drawing unit UW1 are drawn by the beam lines SPL1, SPL2 and SPL3 of the beam spot light SP, and the spot diameter Xs of each beam spot light SP is calculated. The scanning is performed so as to overlap in the X direction (and the Y direction) by about ２. Similarly, the beam spot light SP of the drawing line LL1 on the drawing end PTb side and the beam spot light SP of the drawing line LL2 on the drawing end PTb side move along with the width of the substrate P in the longitudinal direction. In the direction with the overlap distance CXs.

  For example, when the rotary drum DR moves up and down, the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 in the X direction are shifted, and for example, there is a possibility that the magnification is shifted in the X direction. When the transport speed (moving speed) of the substrate P transported by the rotary drum DR is reduced, the control unit 16 reduces the distance CXs between the beam lines SPL1, SPL2, and SPL3 in the X direction, and reduces the drawing magnification in the X direction. Can be adjusted as follows. Conversely, when the transport speed (moving speed) of the substrate P transported by the rotary drum DR is increased, the distance CXs in the X direction between the beam lines SPL1, SPL2, and SPL3 is increased, and the drawing magnification in the X direction is increased. Can be adjusted. Although the drawing line LL1 has been described with reference to FIG. 21, the same applies to the other drawing lines LL2 to LL5. The control unit 16 detects adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and the scale units (rotary drum DR) GPa and GPb detected by the encoder heads EN1 and EN2. The relationship between the moving distance ΔX of the substrate P per unit time in the long direction of the substrate P and the number of the beam lines SPL1, SPL2, and SPL3 included in the moving distance is changed based on the rotation angle position. be able to. For this reason, the control unit 16 can adjust the drawing position in the X direction by the odd-numbered and even-numbered drawing units UW1 to UW5.

  FIG. 22 is an explanatory diagram schematically illustrating pulsed light emitted in synchronization with the system clock of the pulsed light source. Hereinafter, the drawing line LL2 will be described with reference to FIG. 21, but the same applies to the drawing lines LL1 and LL3 to LL5. The light source device CNT can shoot the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval Δwp (= 1 / Fz) of the pulse signal wp changes. The temporal pulse interval Δwp corresponds to the interval CXs in the main scanning direction of the spot light SP for each pulse on the drawing line LL2. The control section 16 scans the beam spot light SP of the drawing beam LB along the drawing line LL2 on the substrate P by the length LBL of the drawing line.

  While the drawing beam LB is scanning along the drawing line LL2, the control unit 16 partially changes the cycle of the system clock SQ to increase or decrease the pulse interval Δwp at an arbitrary position in the drawing line LL2. It has the function to make it. For example, when the original system clock SQ is 100 MHz, the control unit 16 partially changes the system clock SQ at a certain time interval (period), for example, to 101 MHz (or 99 MHz) while scanning the drawing line length LBL. ). As a result, the number of beam spot lights SP in the drawing line length LBL increases or decreases. In other words, the control unit 16 partially increases or decreases the duty of the system clock SQ at predetermined (one or more) cycle intervals while scanning the drawing line length LBL. As a result, the interval between the beam spot lights SP generated by the light source CNT changes by the change of the pulse interval Δwp, and the overlap distance CXs between the beam spot lights SP changes. Then, the distance between the drawing start end PTa and the drawing end PTb in the Y direction apparently expands and contracts.

  For example, when the length LBL of the drawing line is 30 mm, the length LBL is divided into 11 equal parts, and the pulse interval Δwp of the system clock SQ is increased / decreased by one point every drawing length (periodical interval) of about 3 mm. As described with reference to FIG. 13, the increase / decrease amount of the pulse interval Δwp is in a range where the integrated profile (intensity distribution) is not greatly deteriorated due to a change in the interval distance CXs between two adjacent spot lights SP, for example, a reference interval distance. If CSx is 50% of the spot light diameter Xs (3 μm), it is set to about ± 15%. Assuming that the increase / decrease of the pulse interval Δwp is + 10% (the interval distance CSx is 60% of the spot light diameter Xs), the spot light corresponding to one pulse has a diameter of 10 discrete spots in the drawing line having the length LBL. The position is shifted so as to extend in the main scanning direction by 10% of Xs. As a result, the length LBL of the drawing line after drawing extends by 3 μm for 30 mm. This means that the pattern drawn on the substrate P is enlarged by 0.01% (100 ppm) in the Y direction. Thus, even when the substrate P expands and contracts in the Y direction, the drawing pattern can be expanded and contracted in the Y direction and exposed.

  A configuration in which the position at which the pulse interval Δwp is increased or decreased can be preset to an arbitrary value, for example, every one scan of the drawing lines LL1 to LL5, for example, every 100 pulses of the system clock SQ, every 200 pulses,. And In this way, the amount of expansion and contraction of the drawing pattern in the main scanning direction (Y direction) can be changed within a relatively large range, and the magnification can be dynamically corrected according to the expansion and contraction and deformation of the substrate P. Therefore, the control unit 16 of the exposure apparatus EX of the present embodiment includes a system clock SQ generation circuit, and the generation circuit includes a clock oscillation unit that generates, as the system clock SQ, an original clock signal having a constant pulse interval Δwp. And a time shift unit that, after inputting the original clock signal and counting by the preset number of pulses, increases or decreases the time until the next clock pulse of the system clock SQ is generated with respect to the pulse interval Δwp. . The number of portions in the drawing line (length LBL) for increasing or decreasing the pulse interval Δwp of the system clock SQ is substantially determined by the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn. It may be at least one position in the scanning time Ts of the spot light SP corresponding to the length LBL.

  In addition, the pulse beam output from the light source device CNT of the pulse laser in response to the system clock SQ in which the pulse interval Δwp is partially increased / decreased is commonly supplied to each of the drawing units UW1 to UW5. The pattern drawn on each of the drawing lines LL1 to LL5 is expanded and contracted at the same ratio in the Y direction. Therefore, as described in FIG. 12 (or FIG. 11), in order to maintain the joining accuracy between the drawing lines adjacent in the Y direction, the drawing start positions OC1 to OC5 (or the drawing start positions) of the drawing lines LL1 to LL5 are maintained. The drawing timing is corrected so that the end positions EC1 to EC5) are shifted in the Y direction. Further, the ON / OFF switching of the optical deflector (AOM) 81 shown in FIG. 4 is performed in response to a serial bit string (a sequence of bit values “0” or “1”) transmitted as drawing data. However, the transmission of the bit value may be synchronized with the pulse signal wp (FIG. 22) of the system clock SQ in which the pulse interval Δwp is partially increased or decreased. Specifically, one bit value is sent to the drive circuit of the optical deflector (AOM) 81 between the time when one pulse signal wp is generated and the time when the next pulse signal wp is generated. When the bit value is “1” and the previous bit value is “0”, the optical deflector (AOM) 81 may be switched from the OFF state to the ON state.

  By the way, the control unit 16 controls the displacement information YN1 and YN2 which can detect the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors and the shake of both ends of the rotary drum DR. , YN3, YN4, the drawing position in the Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 is adjusted so as to cancel the error in the Y direction caused by the whirling of the rotary drum DR. can do. In addition, the control unit 16 controls the displacement meters YN1 and YN2 that can detect adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors and the shake of both ends of the rotary drum DR. , YN3, YN4, the length in the Y direction (drawing) of the odd-numbered and even-numbered drawing units UW1 to UW5 so as to cancel the error in the Y direction caused by the whirling of the rotary drum DR. The line length LBL) can be changed.

  In addition, the control unit 16 adjusts the position of the plurality of drawing lines LL1 to LL5 or adjustment information (calibration information) corresponding to a mutual placement error and information detected by the alignment microscopes AM1 and AM2. The drawing position in the X direction or the Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction.

  As described above, the exposure apparatus EX of the first embodiment uses a drawing beam LB from each of the plurality of drawing units UW1 to UW5 to generate a drawing plane including a plurality of drawing lines LL1 to LL5 formed on the substrate P. A movement mechanism 24 as a shift correction mechanism for shifting the second optical surface plate 25 relative to the first optical surface plate 23 within the drawing surface around a rotation axis I which is a predetermined point is included. By adjusting information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement error, the entire plurality of drawing lines LL1 to LL5 has an error in at least one of the X direction and the Y direction. In the case of having, the control unit 16 performs drive control on the drive unit of the moving mechanism 24 so that the shift amount cancels the error, and moves the second optical surface plate 25 in the X direction and the Y direction. It can be shifted to at least one of them.

  When the second optical surface plate 25 is shifted in at least one of the X direction and the Y direction, the fourth reflection mirror 59 shown in FIG. 6 is displaced in the X direction or the Y direction by the shift amount. Particularly, the displacement of the fourth reflection mirror 59 in the Y direction shifts the drawing beam LB coming from the third reflection mirror 58 in the Z direction when it is reflected in the + Y direction. Therefore, the shift movement in the Z direction is corrected by the beam shifter mechanism 44 in the first optical system 41. Thus, the beam LB is maintained so as to pass through the correct optical path for the second optical system 42 and the third optical system 43 after the fourth reflection mirror 59.

  Further, in the exposure apparatus EX of the first embodiment, the plurality of drawing lines LL1 to LL5 are adjusted in the X direction and the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement error. When there is an error in at least one in the Y direction, the control unit 16 performs drive control on the beam shifter mechanism 44 so that the shift amount cancels the error, and forms the light beam on the substrate P. The drawing lines LL1 to LL5 can be slightly shifted in the X direction and the Y direction.

  Furthermore, in the exposure apparatus EX of the first embodiment, the odd number of the plurality of drawing lines LL1 to LL5 is determined based on the arrangement state of the plurality of drawing lines LL1 to LL5 or the adjustment information (calibration information) corresponding to the mutual arrangement error. Alternatively, when the even-numbered drawing line has an error in at least one of the X direction and the Y direction, the control unit 16 controls the beam shifter mechanism 45 so that the shift amount cancels the error. By performing drive control, the even-numbered drawing lines LL2, LL4 formed on the substrate P are slightly shifted in the X direction and the Y direction, and the odd-numbered drawing lines LL1, LL3, LL5 formed on the substrate P are shifted. Can be finely adjusted.

  In addition, based on adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscopes AM1, AM2. Thus, the control unit 16 can also adjust the Y magnification of the drawing units UW1 to UW5. For example, the image height of the telecentric f-θ lens included in the f-θ lens system 85 is proportional to the incident angle. For this reason, when only the Y magnification of the drawing unit UW1 is adjusted, the control unit 16 uses the adjustment information (calibration information) and the information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscopes AM1, AM2. The Y magnification can be adjusted by individually adjusting the focal length f of the f-θ lens system 85. Such an adjusting mechanism is combined with, for example, at least one of a bending plate for correcting a magnification, a magnification correcting mechanism for a telecentric f-θ lens, and harbing (a tiltable parallel flat glass) for adjusting a shift. Is also good. Also, by slightly changing the rotation speed of the rotating polygon mirror 97 rotating at a constant rotation speed, the interval distance CXs of each spot light SP (pulse light) drawn in synchronization with the system clock SQ can be slightly reduced. This can be changed (the amount of superposition between adjacent spot lights is slightly shifted), and as a result, the Y magnification can be adjusted.

  As described above, the exposure apparatus EX of the first embodiment uses a drawing beam LB from each of the plurality of drawing units UW1 to UW5 to generate a drawing plane including a plurality of drawing lines LL1 to LL5 formed on the substrate P. It includes a moving mechanism 24 as a rotating mechanism for rotating the second optical surface plate 25 with respect to the first optical surface plate 23 within the drawing surface around the rotation axis I which is a predetermined point. When the plurality of drawing lines LL1 to LL5 have an angle error with respect to the Y direction based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement error, control is performed. The unit 16 can control the driving of the driving unit of the moving mechanism 24 to rotate the second optical surface plate 25 such that the rotation amount cancels the angle error.

  If it becomes necessary to individually correct the rotation of each of the drawing units UW1 to UW5, the f-θ lens system 85 and the second cylindrical lens 86 shown in FIG. 8 are rotated by a small amount around the optical axis AXf. By doing so, it is possible to slightly rotate (tilt) each of the drawing lines LL1 to LL5 individually on the substrate P. The beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the generatrix of the cylindrical lens 86 in the non-scanning direction. Therefore, the rotation of the cylindrical lens 86 around the optical axis AXf causes each drawing line LL1 to rotate. LL5 can be rotated (inclined).

  The exposure apparatus EX according to the first embodiment may perform at least one of the above-described processing of adjusting the drawing position by the control device in step S4. Further, the exposure apparatus EX of the first embodiment may perform processing by combining the above-described processing of adjusting the drawing position by the control device in step S4.

  According to the adjustment method of the substrate processing apparatus described above, the exposure apparatus EX of the first embodiment does not require test exposure for suppressing a joint error between the patterns PT1 to PT5 adjacent in the width direction (Y direction) of the substrate P. Or the number of times is drastically reduced. For this reason, the exposure apparatus EX of the first embodiment can reduce the time-consuming calibration work such as the test exposure, the drying and developing steps, and the work of confirming the exposure result. The exposure apparatus EX according to the first embodiment can suppress the waste of the substrate P by the number of times of feedback by the test exposure. The exposure apparatus EX of the first embodiment can acquire adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors at an early stage. The exposure apparatus EX of the first embodiment performs correction in advance in the X direction or the Y direction based on adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors. Each component such as shift, rotation, and magnification in the direction can be easily corrected. Then, the exposure apparatus EX of the first embodiment can increase the accuracy of performing the overlay exposure on the substrate P.

  In the exposure apparatus EX of the first embodiment, an example has been described in which the optical deflector 81 includes an acousto-optic element and the drawing beam LB is spot-scanned by the rotating polygon mirror 97. However, in addition to spot scanning, a DMD (Digital Micro mirror) is used. Device) or an SLM (Spatial light modulator).

[Second embodiment]
Next, an exposure apparatus EX of the second embodiment will be described. In the second embodiment, to avoid repetition of the description of the first embodiment, only parts different from the first embodiment will be described, and components similar to those of the first embodiment will be the same as those of the first embodiment. The description is given with reference numerals.

  In the exposure apparatus EX of the second embodiment, the photoelectric sensor 31Cs of the calibration detection system 31 is not a reference pattern (also usable as a reference mark) RMP, but is a reflection light (scattering) of the alignment marks Ks1 to Ks3 on the substrate P. Light). The alignment marks Ks1 to Ks3 are arranged at positions on the substrate P in the Y direction that pass through any of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5. When the spot light SP of the drawing beam LB scans the alignment marks Ks1 to Ks3, the scattered light reflected by the alignment marks Ks1 to Ks3 is received by the photoelectric sensor 31Cs in a bright field or a dark field.

  The control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on the signal output from the photoelectric sensor 31Cs. Then, similarly to the first embodiment, the control unit 16 adjusts the arrangement state of the plurality of drawing lines LL1 to LL5 or the adjustment information (calibration information) corresponding to the mutual arrangement error from the detection signal detected by the photoelectric sensor 31Cs. Can be requested.

  Further, based on adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and information detected by the alignment microscopes AM1 and AM2, the control unit 16 The drawing position in the X direction or the Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction. When the spot light SP of the drawing beam LB is projected on the alignment marks Ks1 to Ks3, the photosensitive layer on the alignment marks Ks1 to Ks3 is exposed, and the alignment marks Ks1 to Ks3 may be crushed in a subsequent process. It is preferable that a plurality of alignment marks Ks1 to Ks3 are provided, and the alignment microscopes AM1 and AM2 read the alignment marks Ks1 to Ks3 that have not been destroyed by exposure.

  For this reason, the exposure apparatus EX of the second embodiment scans the vicinity of the alignment marks Ks1 to Ks3, which may be crushed by exposure, with the spot light SP of the drawing beam LB, and removes the alignment marks Ks1 to Ks3 which are not crushed by exposure. In the vicinity, data for turning on / off the optical deflector (AOM) 81 can be included in the pattern drawing data so that the spot light SP is not irradiated. This makes it possible to acquire calibration information almost in real time while exposing with the drawing beam LB, and to read the alignment marks Ks1 to Ks3 (the positions of the substrate P).

  Like the exposure apparatus EX of the first embodiment, the exposure apparatus EX of the second embodiment does not require test exposure for suppressing splicing errors, or the number of times of exposure is drastically reduced. In addition, the exposure apparatus EX of the second embodiment measures error information such as the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement relation while performing pattern exposure on the substrate P, and adjusts the corresponding adjustment information. (Calibration information) can be acquired early (almost in real time). Therefore, in the exposure apparatus EX of the second embodiment, based on the error information measured at an early stage or the adjustment information (calibration information), correction and adjustment that maintain a predetermined accuracy while exposing the device pattern are performed. This can be performed successively, and easily reduces a decrease in joint accuracy between drawing units in consideration of error components such as a shift error, a rotation error, and a magnification error in the X direction or the Y direction, which is a problem in the multi-drawing head system. It is possible. Thus, the exposure apparatus EX of the second embodiment can maintain a high overlay accuracy when performing overlay exposure on the substrate P.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 23 is a flowchart illustrating the device manufacturing method of each embodiment.

  In the device manufacturing method shown in FIG. 23, first, the function and performance of the display panel are designed using self-luminous elements such as an organic EL, and the necessary circuit patterns and wiring patterns are designed by CAD or the like (step S201). Further, a supply roll on which a flexible substrate P (resin film, metal foil film, plastic, or the like) serving as a base material of the display panel is wound is prepared (Step S202). Note that the roll-shaped substrate P prepared in step S202 has its surface modified as necessary, has a base layer (for example, micro unevenness formed by an imprint method) formed in advance, has a photosensitivity. May be laminated in advance with a functional film or a transparent film (insulating material).

  Next, a backplane layer composed of electrodes, wirings, insulating films, TFTs (thin film semiconductors) and the like constituting a display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane. The light emitting layer (display pixel portion) is formed by the self light emitting element (step S203). In this step S203, the exposure apparatus EX described in each of the above embodiments was used, and a conventional photolithography step of exposing and developing a photoresist layer was performed, and a photosensitive silane coupling material was applied instead of the photoresist. An exposure step of pattern-exposing the substrate P to form a pattern by modifying the surface to be water-repellent, pattern-exposing the photosensitive catalyst layer to impart selective plating reducibility, and using an electroless plating method. The process also includes a wet process of forming a pattern (wiring, electrode, etc.) of a metal film, a printing process of drawing a pattern with a conductive ink containing silver nanoparticles, and the like.

  Next, for each display panel device continuously manufactured on the long substrate P by a roll method, the substrate P is diced, and a protective film (environment-resistant barrier layer) and a color filter are formed on the surface of each display panel device. The device is assembled by bonding sheets or the like (step S204). Next, an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S205). As described above, a display panel (flexible display) can be manufactured. Electronic devices formed on a flexible and long sheet substrate are not limited to display panels, but a flexible wiring network as a harness (wiring bundle) for connecting various electronic components mounted on an automobile or a train. It may be.

DESCRIPTION OF SYMBOLS 1 Device manufacturing system 11 Drawing apparatus 12 Substrate transfer mechanism 13 Device frame 14 Rotational position detection mechanism 16 Control unit 23 First optical surface plate 24 Moving mechanism 25 Second optical surface plate 31 Calibration detection system 31Cs Photoelectric sensor 31f Light shielding member 73 4 beam splitter 81 Optical deflector 83 Scanner 96 Reflection mirror 97 Rotating polygon mirror 97a Rotation axis 97b Reflection surface 98 Origin detector AM1, AM2 Alignment microscope DR Rotary drum EN1, EN2, EN3, EN4 Encoder head EX Exposure apparatus I Rotation axis LL1 to LL5 Drawing line PBS Deflection beam splitters UW1 to UW5 Drawing unit

Claims (9)

A plurality of drawing units for drawing a pattern on the substrate by projecting a spot light scanned one-dimensionally in the main scanning direction onto a long substrate moving in a sub-scanning direction intersecting with the main scanning direction, The main unit is configured such that patterns drawn on the substrate by respective drawing lines formed by scanning of the spot light from each of the drawing units are joined in the main scanning direction with movement of the substrate. An adjustment method of a substrate processing apparatus arranged in a scanning direction,
An outer peripheral surface for supporting a part of the substrate by bending at a constant radius from a center line extending in a width direction orthogonal to a longitudinal direction of the long substrate, and an outer peripheral surface in a direction of the center line on the outer peripheral surface. A reference drum formed at each of predetermined positions, and a rotating drum capable of moving the substrate in the sub-scanning direction by rotation about the center line, by the drawing unit. Scanning by rotating the fiducial mark so as to bring the fiducial mark on a drawing line, and scanning the fiducial mark in the main scanning direction set in parallel with the center line with the spot light projected from each of the drawing units. Steps and
The spot light scans the fiducial mark by a reflected light detection unit that is provided in each of the plurality of drawing units and photoelectrically detects reflected light generated from the outer peripheral surface of the rotating drum by projection of the spot light. A detection step of obtaining a detection signal corresponding to the intensity change of the reflected light that occurs sometimes;
When viewed from the direction in which the center line extends, the same direction as the direction in which the drawing line is set with respect to the circumferential direction of the outer peripheral surface of the rotating drum, and the end of the rotating drum in the direction of the center line. A detecting step of detecting a minute displacement of the rotating drum in the direction of the center line by a displacement meter arranged at a position close to the outer peripheral surface radially separated from the center line;
Based on the detection signal from the reflected light detection unit and the minute displacement of the rotary drum detected by the displacement meter, seek adjustment information on the arrangement state of the plurality of drawing lines or mutual arrangement error, Adjusting the drawing position of the pattern by each of the plurality of drawing units based on the adjustment information;
A method for adjusting a substrate processing apparatus including: The method for adjusting a substrate processing apparatus according to claim 1 , wherein:
The substrate processing apparatus further includes a movement measurement mechanism that outputs position displacement information according to a movement amount of the rotating drum in the circumferential direction of the outer peripheral surface ,
The step of obtaining the adjustment information includes the detection signal detected in the detection step, the minute displacement of the rotating drum detected by the displacement meter, and the position displacement information output from the movement measurement mechanism. A calculating step of calculating, as the adjustment information, a mutual positional relationship or a position error of the drawing lines formed by each of the plurality of drawing units based on the plurality of drawing units.
Adjustment method for substrate processing equipment. A method for adjusting a substrate processing apparatus according to claim 2 , wherein
The substrate processing apparatus may further include a laser light source, and the spot light projected from each of the plurality of drawing units is intensity-modulated based on drawing data corresponding to the pattern. A modulator for intensity-modulating the beam,
Each of the plurality of drawing units is a rotating polygon mirror that receives the intensity-modulated beam and deflects and scans one-dimensionally, and deflects and scans the beam on the substrate or the outer peripheral surface of the rotating drum. And a beam projection optical system that projects so as to condense the spot light.
Adjustment method for substrate processing equipment. The method for adjusting a substrate processing apparatus according to claim 3 , wherein
The reflected light detector,
A photoelectric sensor that outputs the detection signal by photoelectrically detecting the reflected light from the outer peripheral surface of the rotating drum via the beam projection optical system and the rotating polygon mirror ,
A light splitter disposed in an optical path between the rotary polygon mirror and the photoelectric sensor and splitting the intensity-modulated beam directed to the rotary polygon mirror and light reflected from the outer peripheral surface of the rotary drum by polarization. Vessel,
Adjustment method for substrate processing equipment. An adjustment method for the substrate processing apparatus according to any one of claims 1 to 3 ,
The reflected light detection unit includes a photoelectric sensor that receives the reflected light from the outer peripheral surface of the rotating drum in a bright field or a dark field and outputs the detection signal,
When obtaining the adjustment information, based on the detection signal from the photoelectric sensor, to detect the edge position of the reference mark,
Adjustment method for substrate processing equipment. An adjustment method for the substrate processing apparatus according to claim 4 , wherein
The beam projection optics are provided between the f-theta lens for guiding the rotary polygon mirror in the deflection scanned the beam onto the drawing line, the f-theta lens and said rotary drum, said drawing A cylindrical lens having a generatrix substantially parallel to the direction in which the line extends, and condensing the beam in a direction perpendicular to the generatrix.
Adjustment method for substrate processing equipment. A method for adjusting a substrate processing apparatus according to any one of claims 1 to 6 ,
A plurality of the reference marks are provided at predetermined intervals along the outer peripheral surface of the rotary drum in the main scanning direction, and the predetermined intervals are smaller than a length of the drawing line formed by each of the plurality of drawing units. Set,
Adjustment method for substrate processing equipment. A method for adjusting a substrate processing apparatus according to claim 7 , wherein
The reference mark is configured by an intersection of two line patterns that intersect each other.
Adjustment method for substrate processing equipment. A method for adjusting a substrate processing apparatus according to any one of claims 1 to 6 ,
Each of the plurality of drawing units includes:
When one of adjacent drawing units for drawing patterns to be joined to each other on the substrate is an odd number and the other is an even number, odd number drawing lines formed by the odd number drawing units and the even number And the even-numbered drawing lines formed by the drawing units are arranged so as to be located at regular intervals in the sub-scanning direction.
Adjustment method for substrate processing equipment.

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