TW201539154A - Substrate-processing apparatus, device manufacturing method, and method for adjusting substrate-processing apparatus - Google Patents

Abstract

In this substrate-processing apparatus, a plurality of patterning units are arrayed in the widthwise direction of a substrate such that movement in the lengthwise direction of the substrate causes patterns formed on the substrate by pattern lines from the respective patterning units to join together. Each patterning unit is provided with a reflected-light detection unit for a measuring device, and when said reflected-light detection units detect reflected light reflected by the substrate or a support surface of a support member due to the projection of a light spot from a beam, the alignment relationships of the pattern lines are measured on the basis of signals outputted by each reflected-light detection unit when a fiducial mark on the support member is located above the pattern line from the corresponding patterning unit.

Description

Substrate processing apparatus, component manufacturing method, and adjustment method of substrate processing apparatus

The present invention relates to a substrate processing apparatus, a device manufacturing method, and a method of adjusting a substrate processing apparatus.

As a conventional substrate processing apparatus, a manufacturing apparatus that draws at a predetermined position on a sheet medium (substrate) is widely known (for example, refer to Patent Document 1). In the manufacturing apparatus described in Patent Document 1, the flexible long strip-shaped substrate which is easy to expand and contract in the width direction is used to measure the expansion and contraction of the sheet-like substrate by detecting the alignment mark, and the drawing position (machining position) is corrected in accordance with the expansion and contraction.

Advanced technical literature

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-91990

In the manufacturing apparatus of the patent document 1, the spatial modulation mirror (DMD: Digital Micro mirror Device) is switched by the substrate in the conveyance direction, and the pattern is drawn on the substrate by a plurality of drawing units. In the manufacturing apparatus of Patent Document 1, the patterns adjacent to each other in the width direction of the substrate are joined and exposed by a plurality of drawing units. However, in order to suppress the error of the bonding exposure, feedback is performed for test exposure. A measurement result of a positional error with the pattern of the joint formed by the development. However, the feedback step including such test exposure, development, measurement, and the like, although depending on the frequency, has to temporarily stop the manufacturing line, which not only reduces the productivity of the product, but also causes waste of the substrate.

The present invention has been made in view of the above problems, and an object of the invention is to provide a method for reducing the bonding error of patterns even when a plurality of drawing units are used to bond patterns in the width direction of the substrate for exposure (drawing). Further, a substrate processing apparatus, a device manufacturing method, and a substrate processing apparatus for drawing a large-area pattern capable of high-precision stability of a substrate can be used.

According to a first aspect of the present invention, a substrate processing apparatus includes: a support member having a support surface for supporting a long sheet-like substrate, and a plurality of positions on the support surface in a width direction intersecting a longitudinal direction of the substrate; a reference mark; a transfer device that moves the substrate supported by the support member in the strip direction; and the drawing device includes a spot light that can project a light beam to the substrate or the support surface supported by the support surface a plurality of drawing units that scan a predetermined pattern in a range narrower than a dimension in the width direction of the substrate, and the patterns drawn on the substrate by the respective drawing lines of the plurality of drawing units follow each other The plurality of drawing units are disposed in a width direction of the substrate so that the substrate is moved in a strip direction and joined in a width direction of the substrate; and the reflected light detecting unit is provided in each of the plurality of drawing units for Detecting reflected light reflected from a support surface of the support member or the substrate due to projection of the spot light of the light beam; and measuring means according to the support structure The reference mark is output from the reflected light detecting unit when the reference mark is located on the drawing line of each of the plurality of drawing units, and the arrangement relationship of the plurality of drawing lines is measured.

According to a second aspect of the present invention, there is provided a substrate treatment using the first aspect of the present invention. The device is a device manufacturing method in which the pattern is formed on the substrate.

According to a third aspect of the present invention, in a substrate processing apparatus, the substrate processing apparatus includes: a support member having a predetermined reference mark discrete or continuous at a plurality of predetermined positions on the support surface; and a conveying device Supporting a predetermined width of the substrate on the support surface of the support member, and transporting the substrate at a predetermined speed in a longitudinal direction intersecting the width direction; the drawing device having a spot light along a beam to be projected on the substrate a plurality of drawing units that scan the obtained drawing line in the width direction and the predetermined pattern on the substrate in a range narrower than the width width of the substrate, and the pattern drawn on the substrate by each of the plurality of drawing units Disposing the drawing lines adjacent to each other in the width direction at a predetermined interval in a manner of joining the substrates in the longitudinal direction so as to be transferred in the strip direction; and a plurality of reflections a light detecting unit configured to detect a bearing surface from the support member due to illumination of the light beam from each of the plurality of drawing units Generating reflected light; comprising: moving the support member relative to the drawing device such that the fiducial mark comes to the drawing line formed by each of the plurality of drawing units, and the spot light of the light beam a scanning step of scanning the reference mark; detecting, by the reflected light detecting unit, the reflected light generated from the reference mark by the scanning of the light beam to obtain a detection signal corresponding to the reference mark; and determining the detection signal according to the detection signal And a step of adjusting information of the configuration state of the plurality of drawing lines or the arrangement error of each other; and adjusting the drawing state of the pattern drawn by each of the plurality of drawing units according to the adjustment information.

According to a fourth aspect of the present invention, in a substrate processing apparatus, the light beam is irradiated on a substrate along a predetermined drawing line while the intensity-modulated beam is focused on the substrate, and the light beam is emitted in a direction intersecting the drawing line. Sub-scanning of the substrate, according to which a predetermined pattern is drawn on the substrate, The utility model comprises: a supporting member having a supporting surface for supporting the substrate; and a conveying device for moving the substrate supported by the supporting member in a direction of the sub-scanning; and a pulsed laser light source as the light beam, outputting ultraviolet light at a repeated emission frequency Fz a pulsed beam of a wavelength band; and a rendering unit having a modulator for intensity-modulating the pattern of the pulsed beam from the pulsed laser source to be drawn on the line of the laser, and deflecting the beam modulated by the modulator Scanning a one-dimensional scanning optical system and a beam projection optical system that projects the deflected light beam onto the substrate; scanning the length of the drawing line to LBL, scanning the beam of the light beam through the length LBL When the time is Ts and the size of the spot light in the direction of the drawing line is Xs, the light emission frequency Fz of the pulsed laser light source is set to satisfy the relationship of Fz ≧ LBL / (Ts ‧ Xs).

According to the above aspects of the present invention, it is possible to provide a substrate processing capable of appropriately performing the drawing using a plurality of drawing units by appropriately reducing the bonding error when a plurality of drawing units are used for exposure in the width direction bonding pattern of the substrate. Apparatus, component manufacturing method, and method of adjusting a substrate processing apparatus.

1‧‧‧Component Manufacturing System

11‧‧‧Drawing device

12‧‧‧Substrate transport mechanism

13‧‧‧ device framework

14‧‧‧Rotary position detection mechanism

16‧‧‧Control Department

23‧‧‧1st optical platform

24‧‧‧Mobile agencies

25‧‧‧2nd optical platform

31‧‧‧ Calibration Test System

31Cs‧‧‧Light Inductance Detector

31f‧‧‧ shading members

41‧‧‧1st Optical Department

42‧‧‧2nd Optical Department

43‧‧‧3rd Optical Department

44‧‧‧ Beam Displacement Mechanism

45‧‧‧ Beam Displacement Mechanism

51‧‧‧1/2 wavelength plate

52‧‧‧Polarizing mirror (polarizing beam splitter)

53‧‧‧ astigmatizer

54‧‧‧1st mirror

55‧‧‧1st relay lens

56‧‧‧2nd relay lens

57‧‧‧2nd mirror

58‧‧‧3rd mirror

59‧‧‧4th mirror

60‧‧‧1st beam splitter

61‧‧‧5th mirror

62‧‧‧2nd beam splitter

63‧‧‧3rd beam splitter

64‧‧‧6th mirror

71‧‧‧7th mirror

72‧‧‧8th mirror

73‧‧‧4th beam splitter

74‧‧‧9th mirror

81‧‧‧Light deflector

82‧‧‧1/4 wavelength plate

83‧‧‧Scanner

84‧‧‧Bend mirror

85‧‧‧f-θ lens system

86‧‧‧ cylindrical lens

86B‧‧‧Y-rate correction optical member (lens group)

91‧‧‧Relay lens

92‧‧ ‧ visor

93‧‧‧Relay lens

94‧‧‧Relay lens

95‧‧‧ cylindrical lens

96‧‧‧Mirror

97‧‧‧Rotating polygon mirror

97a‧‧‧Rotary axis

97b‧‧‧reflecting surface

98‧‧‧ Origin detector

AM1, AM2‧‧‧ alignment microscope

AX2‧‧‧Rotating Center Line

CNT‧‧‧ light source device

DL‧‧‧relaxation

DR‧‧‧ rotating cylinder

DR4, DR6, DR7‧‧‧ drive roller

EN1, EN2, EN3, EN4‧‧‧ encoder read head

EPC‧‧‧Edge Position Controller

EVC‧‧‧ adjust greenhouse

EX‧‧‧Exposure device

GPa, GPb‧‧‧ ruler department

I‧‧‧Rotary axis

LB‧‧‧beam

Le1~Le4‧‧‧Set the bearing line

LL1~LL5‧‧‧ depicting line

P‧‧‧Substrate

PBS‧‧‧ bias beam splitter

RT1, RT2‧‧‧ tension adjustment wheel

Sf2‧‧‧Axis

SL‧‧‧Differential Optical System

SU1, SU2‧‧‧ anti-vibration unit

UW1~UW5‧‧‧Drawing unit

Fig. 1 is a view showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.

Fig. 2 is a perspective view showing the configuration of a main portion of the exposure apparatus of Fig. 1.

Fig. 3 is a view showing the arrangement relationship between an alignment microscope and a drawing line on a substrate.

Fig. 4 is a view showing the configuration of a rotating cylinder and a drawing device of the exposure apparatus of Fig. 1.

Fig. 5 is a plan view showing the configuration of a main portion of the exposure apparatus of Fig. 1.

Fig. 6 is a perspective view showing the configuration of a divergent optical system of the exposure apparatus of Fig. 1.

Fig. 7 is a view showing a configuration relationship of a plurality of scanners of the exposure apparatus of Fig. 1.

Fig. 8 is a view for explaining an optical configuration for eliminating the deviation of the drawing line due to the inclination of the reflecting surface of the scanner.

Figure 9 is a perspective view showing the arrangement relationship between the alignment microscope and the drawing line and the encoder read head on the substrate.

Figure 10 is a perspective view showing the surface structure of a rotating cylinder of the exposure apparatus of Figure 1.

Fig. 11 is an explanatory view showing a positional relationship between a drawing line and a drawing pattern on a substrate.

Fig. 12 is an explanatory view showing a relationship between a beam spot and a drawing line.

Fig. 13 is a graph simulating the change in intensity distribution caused by the overlap of the beam points of two pulses obtained on the substrate.

Fig. 14 is a flow chart showing a method of adjusting the exposure apparatus of the first embodiment.

Fig. 15 is an explanatory view showing the relationship between the reference pattern of the rotating cylinder and the drawing line in a schematic manner.

Fig. 16 is an explanatory view showing, in a schematic manner, a signal output from a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a bright field.

Fig. 17 is an explanatory view showing, in a schematic manner, a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a dark field.

Fig. 18 is an explanatory view showing, in a schematic manner, a signal output from a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a dark field.

Fig. 19 is an explanatory view showing the positional relationship between the reference patterns of the rotary cylinders in a schematic manner.

Fig. 20 is an explanatory view showing a relative positional relationship of a plurality of drawing lines in a schematic manner.

Fig. 21 is an explanatory view showing, in a schematic manner, the relationship between the moving distance per unit time of the substrate and the number of drawn lines included in the moving distance.

Fig. 22 is an explanatory view showing, in a schematic manner, pulsed light synchronized with the system clock of the pulse light source.

Fig. 23 is a flow chart showing a method of manufacturing a component of each embodiment.

The embodiment (embodiment) for carrying out the invention will be described in detail with reference to the drawings. The present invention is of course not limited to the contents described in the following embodiments. Further, among the constituent elements described below, those which are easy for the operator to think about and which are substantially the same are included. Further, the constituent elements described below can be combined as appropriate. Further, various omissions, substitutions, and changes of the components may be made without departing from the scope of the invention.

[First Embodiment]

Fig. 1 is a view showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. The substrate processing apparatus according to the first embodiment is an exposure apparatus EX that performs exposure processing on the substrate P, and the exposure apparatus EX is incorporated in the component manufacturing system 1 that applies various processes to the exposed substrate P to manufacture an element. First, the component manufacturing system 1 will be described.

<Component Manufacturing System>

The component manufacturing system 1 is a production line (flexible display manufacturing line) for manufacturing a flexible display as a component. A flexible display such as an organic EL display or the like. The component manufacturing system 1 is configured to feed the substrate P by a supply reel (not shown) in which a flexible long substrate P is wound into a cylindrical shape, and after performing various processes on the substrate P that has been fed out continuously, Treating the processed substrate P as The flexible element is wound around a so-called roll-to-roll method of a recycling roll (not shown). In the component manufacturing system 1 of the first embodiment, the film-shaped sheet substrate P is fed from the supply reel, and the substrate P sent from the supply reel is sequentially processed by the processing device U1, the exposure device EX, and the processing device U2. After that, it is wound around a recycling reel. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of a metal or an alloy such as a resin film or stainless steel. The material of the resin film may be, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate. One or more of materials such as an ester resin, a polystyrene resin, and a polyvinyl alcohol resin.

The substrate P is preferably selected such that the coefficient of thermal expansion is remarkably small, and the amount of deformation due to heat in various processes performed on the substrate P can be substantially ignored. The coefficient of thermal expansion can be set to be smaller than a threshold value corresponding to the processing temperature or the like by, for example, mixing the inorganic filler with the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, cerium oxide or the like. In addition, the substrate P may be a single layer body of extremely thin glass having a thickness of about 100 μm manufactured by a floating method or the like, or a laminated body in which the above-mentioned resin film or foil is bonded to the ultra-thin glass.

The substrate P configured in this manner is wound into a roll shape to be a supply roll, and the supply roll is attached to the component manufacturing system 1. The component manufacturing system 1 equipped with a supply reel performs various processes for manufacturing components on the substrate P fed from the supply reel to the strip direction. Therefore, a pattern for a plurality of electronic components (display panel, printed circuit board, etc.) is formed on the substrate P after the processing in a state in which the strips are connected at regular intervals. That is, the substrate P fed from the supply reel is a substrate for multi-faceted use. In addition, the substrate P can also be in advance The surface is modified by a predetermined pretreatment to be activated, or a fine partition structure (a concave-convex structure formed by an imprint method) for precise patterning is formed on the surface.

The treated substrate P is wound into a roll shape and recovered as a recovery roll. The recycling reel is attached to a cutting device (not shown). A cutting device equipped with a reel for recycling is used to divide (cut) the processed substrate P into individual elements, thereby forming a plurality of elements. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short side) and 10 m or more in the longitudinal direction (direction of the strip). Of course, the size of the substrate P is not limited to the above size

Next, the component manufacturing system 1 will be described with reference to Fig. 1 . The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. In addition, FIG. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is in the horizontal direction from the processing device U1 through the exposure device EX toward the processing device U2. The Y direction is a direction orthogonal to the X direction in the horizontal plane and is the width direction of the substrate P. The Z direction is a direction orthogonal to the Y direction and the Y direction (vertical direction), and the XY plane is parallel to the installation surface E of the manufacturing line on which the exposure apparatus EX is provided.

The processing apparatus U1 performs pre-processing (pre-processing) on the substrate P on which the exposure apparatus EX performs exposure processing. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on which a photosensitive functional layer (photosensitive layer) is formed.

Here, the photosensitive functional layer is applied as a solution onto the substrate P and dried to form a layer (film). A typical photosensitive functional layer, which has a photoresist as a material which is not required after development treatment, is exposed to a liquid-irradiated portion of a photosensitive decane coupling agent (SAM) or a portion exposed to ultraviolet light. The plating is also based on the photosensitive material and the like. As a photosensitive function When a photosensitive decane coupling agent is used for the layer, since the pattern portion exposed to the ultraviolet ray on the substrate P is changed from liquid repellency to lyophilic property, the conductive ink (containing silver or copper) is selectively applied to the lyophilic portion. The ink of the conductive nanoparticle is formed to form a patterned layer. When a photosensitive material is used as the photosensitive functional layer, since the plating substrate is exposed on the portion of the substrate P exposed to ultraviolet rays, the substrate P is immersed in a plating solution containing palladium ions or the like immediately after exposure. For a certain period of time, a pattern layer of palladium is formed (precipitated).

The exposure apparatus EX draws, for example, a pattern of various circuits or various wirings for a display panel on the substrate P supplied from the processing apparatus U1. For further details, the exposure apparatus EX is a plurality of scanning beams LB (hereinafter, also referred to as drawing light beams LB) that are projected from the respective drawing units UW1 to UW5 to the substrate P in a predetermined scanning direction. Lines LL1 to LL5 are drawn, and a predetermined pattern is exposed on the substrate P.

The processing apparatus U2 is subjected to the substrate P after the exposure processing of the exposure apparatus EX, and performs post-processing (post-processing) on the substrate P. When the photosensitive functional layer of the substrate P is a photoresist, the processing apparatus U2 performs a baking process, a development process, a washing process, a drying process, and the like after the glass transition temperature of the substrate P is equal to or lower. Further, when the photosensitive functional layer of the substrate P is a photosensitive plating material, the processing apparatus U2 performs an electroless plating treatment, a cleaning treatment, a drying treatment, and the like. Further, when the photosensitive functional layer of the substrate P is a photosensitive decane coupling agent, the processing device U2 performs selective coating treatment, drying treatment, and the like on the liquid ink which is a part of the substrate P which is lyophilic. A pattern layer of the element is formed on the substrate P via such a processing device U2.

<Exposure device (substrate processing device)>

Next, an exposure apparatus EX will be described with reference to Figs. 1 to 10 . Fig. 2 is a perspective view showing the configuration of a main portion of the exposure apparatus of Fig. 1. Figure 3 shows the alignment microscope and the drawing line on the substrate. A diagram of the configuration relationship. Fig. 4 is a view showing a configuration of a rotating cylinder and a drawing device (drawing unit) of the exposure apparatus of Fig. 1. Fig. 5 is a plan view showing the configuration of a main portion of the exposure apparatus of Fig. 1. Fig. 6 is a perspective view showing the configuration of a divergent optical system of the exposure apparatus of Fig. 1. Figure 7 is a diagram showing the arrangement relationship of scanners in a plurality of drawing units of the exposure apparatus of Figure 1. Fig. 8 is a view for explaining an optical configuration for eliminating the deviation of the drawing line due to the inclination of the reflecting surface of the scanner. Figure 9 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the encoder read head of the drawing line. Fig. 10 is a perspective view showing an example of a surface structure of a rotating cylinder of the exposure apparatus of Fig. 1.

As shown in Fig. 1, the exposure apparatus EX is an exposure apparatus that does not use a photomask, and a so-called maskless exposure apparatus. In the present embodiment, the substrate P is continuously conveyed at a constant speed ( In the strip direction), the spot light of the drawing light beam LB is scanned at a high speed in a predetermined scanning direction (the width direction of the substrate P), and the surface of the substrate P is drawn on the surface of the substrate P to form a predetermined pattern on the substrate P. A direct depiction exposure device for the raster scan mode.

As shown in FIG. 1 , the exposure apparatus EX includes a drawing device 11 , a substrate transfer mechanism 12 , alignment microscopes AM1 and AM2 , and a control unit 16 . The drawing device 11 includes a plurality of drawing units UW1 to UW5. The drawing device 11 draws a predetermined pattern by a plurality of drawing units UW1 to UW5 in a portion of the substrate P conveyed while being supported by the cylindrical rotating cylinder DR which is a part of the substrate conveying mechanism 12. The substrate transfer mechanism 12 transports the substrate P transferred from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are aligned so that the pattern to be drawn on the substrate P is aligned with the substrate P, and alignment marks or the like formed in advance on the substrate P are detected. The control unit 16 including a computer, a microcomputer, a CPU, an FPGA, and the like controls each part of the exposure apparatus EX so that each part is implemented deal with. The control unit 16 may be part or all of the upper control device of the control element manufacturing system 1. Further, the control unit 16 is controlled by the upper control device. The upper control device may be, for example, another device such as a host computer that manages the production line.

Further, as shown in FIG. 2, the exposure apparatus EX includes a device frame 13 that supports at least one of the drawing device 11 and the substrate transfer mechanism 12 (such as a rotating cylinder DR), and the detection frame is mounted with a detecting rotating cylinder DR. Rotating beam spot SP position detecting mechanism (such as encoder head shown in Figs. 4 and 9) such as rotation angle position, rotation speed, and displacement in the rotation axis direction, and Fig. 1 (or Figs. 3 and 9) The alignment microscopes AM1, AM2, etc. are shown. Further, in the exposure apparatus EX, as shown in FIGS. 4 and 5, a light source device CNT that emits ultraviolet laser light (pulsed light) as the drawing light beam LB is provided. The exposure device EX distributes the drawing light beam LB emitted from the light source device CNT to each of the plurality of drawing units UW1 to UW5 constituting the drawing device 11 with a substantially uniform light amount (illuminance).

As shown in Fig. 1, the exposure apparatus EX is housed in a greenhouse EVC. The greenhouse EVC is adjusted to the setting surface (ground) E of the manufacturing plant through the passive or active vibration-proof units SU1 and SU2. The anti-vibration units SU1, SU2 are provided on the setting surface E for reducing the vibration from the setting surface E. The greenhouse EVC is adjusted to maintain the internal temperature at a predetermined temperature, thereby suppressing the shape change of the substrate P transported inside due to temperature.

The substrate transfer mechanism 12 of the exposure apparatus EX has an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotary cylinder (cylinder cylinder) DR, and a tension adjustment roller in this order from the upstream side in the conveyance direction of the substrate P. RT2, drive roller DR6, and drive roller DR7.

The edge position controller EPC adjusts the substrate P transferred from the processing device U1. The position in the width direction (Y direction). The edge position controller EPC, in the width direction end (edge) position of the substrate P sent from the processing device U1, can be within a range of ±10 μm to several tens μm with respect to the target position, and the substrate P is widened. The direction is slightly moved to correct the position of the substrate P in the width direction.

The driving roller DR4 of the clamping type rotates while rotating the front and back sides of the substrate P conveyed from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction to move the substrate P toward the rotating cylinder DR Transfer. By rotating the cylinder DR, the portion of the substrate P to be exposed is adhered to a cylindrical outer peripheral surface having a certain radius from a rotation center line (rotation axis) AX2 extending in the Y direction, and is supported around the rotation center. The wire AX2 is rotated, and the substrate P is transported in the longitudinal direction.

In order to rotate the rotating cylinder DR about the rotation center line AX2, a shaft portion Sf2 coaxial with the rotation center line AX2 is provided on both sides of the rotation cylinder DR, and the shaft portion Sf2 is transmitted through the shaft portion Sf2 as shown in FIG. The bearing is pivoted to the device frame 13. The shaft portion Sf2 is provided with a rotational torque from a drive source (such as a motor and a reduction gear mechanism) (not shown). Further, a plane including the rotation center line AX2 and the YZ plane is defined as a center plane p3.

The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P that is wound and supported by the rotating cylinder DR. The two sets of the grip type drive rollers DR6 and DR7 are disposed at a predetermined interval in the transport direction of the substrate P, and a predetermined slack DL is applied to the exposed substrate P. The substrate P is conveyed to the processing device U2 by the rotation of the upstream side of the substrate P sandwiched and conveyed by the driving roller DR6 and the downstream side of the substrate P sandwiched and transported by the driving roller DR7. In this case, the substrate P is provided with the slack DL, and the movement speed of the substrate P generated on the downstream side of the transport roller DR6 in the transport direction can be absorbed, and the exposure processing caused by the variation of the transport speed on the substrate P is blocked. ring.

Therefore, the substrate transfer mechanism 12 can adjust the position of the substrate P transported from the processing apparatus U1 to the position in the width direction by the edge position controller EPC. The substrate transfer mechanism 12 transports the substrate P whose position in the width direction is adjusted to the tension adjustment roller RT1 by the drive roller DR4, and transports the substrate P that has passed through the tension adjustment roller RT1 to the rotary cylinder DR. The substrate transfer mechanism 12 rotates the rotary cylinder DR to transport the substrate P supported by the rotary cylinder DR to the tension adjustment roller RT2. The substrate transfer mechanism 12 transports the substrate P transported to the tension adjustment roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Next, the substrate transport mechanism 12 transports the substrate P to the processing device U2 while applying the slack DL to the substrate P by the drive roller DR6 and the drive roller DR7.

Referring again to Fig. 2, the apparatus frame 13 of the exposure apparatus EX will be described. In Fig. 2, the X direction, the Y direction, and the Z direction are orthogonal orthogonal coordinate systems, which are the same orthogonal coordinate systems as those of Fig. 1.

As shown in FIG. 2, the apparatus frame 13 has a main body frame 21, a support mechanism three-point seat 22, a first optical table 23, a moving mechanism 24, and a second optical table 25 in this order from the lower side in the Z direction. The main body frame 21 is a portion that is provided on the installation surface E through the vibration isolating units SU1 and SU2. The main body frame 21 is rotatably supported by the rotating cylinder DR and the tension adjusting roller RT1 (not shown) and the RT2 shaft. The first optical stage 23 is provided on the upper side in the vertical direction of the rotary cylinder DR, and is provided in the main body frame 21 through the three-point seat 22. The three-point seat 22 supports the first optical table 23 at three support points, and is adjustable in the Z-direction position (height position) of each support point. Therefore, the three-point seat 22 can adjust the inclination of the land surface of the first optical table 23 with respect to the horizontal plane to a predetermined inclination. Moreover, between the body frame 21 and the three-point seat 22, when the device frame 13 is assembled, Position adjustment is performed in the X direction and the Y direction in the XY plane. On the other hand, after the assembly of the apparatus frame 13, the main body frame 21 and the three-point seat 22 are in a state of being fixed in the XY plane (rigid state).

The second optical stage 25 is provided on the upper side of the first optical stage 23 in the vertical direction, and is provided on the first optical stage 23 through the moving mechanism 24 . The second optical stage 25 has a land surface parallel to the land surface of the first optical table 23. The second optical stage 25 is provided with a plurality of drawing units UW1 to UW5 of the drawing device 11. In the state in which the platform surfaces of the first optical table 23 and the second optical table 25 are held in parallel, the moving mechanism 24 can be made to be opposed to the first optical table 23 with respect to the predetermined rotation axis I extending in the vertical direction. 2 optical platform 25 precise micro-rotation. The rotation range is, for example, a structure in which the angle is set to a range of ± several hundred radians with respect to the reference position and can be set with a resolution of 1 to several milliradians. Further, the moving mechanism 24 is configured to hold the second optical table 25 in the X direction and Y with respect to the first optical table 23 while maintaining the land surfaces of the first optical table 23 and the second optical table 25 in parallel. The mechanism for precisely moving at least one of the directions can slightly shift the rotational axis I from the reference position to the X direction or the Y direction by a resolution of μm. The rotation axis I is a predetermined point in the center plane p3 extending in the vertical direction and passing through the surface of the substrate P of the rotating cylinder DR (the drawing surface curved along the circumferential surface) at the reference position (substrate P) Midpoint in the width direction) (Refer to Figure 3). By the moving mechanism 24, the second optical table 25 is rotated or moved with respect to the first optical table 23, that is, the plurality of drawing units UW1 to UW5 can be integrally adjusted with respect to the rotating cylinder DR or wound around the rotating cylinder. The position of the substrate P of the DR.

Next, the light source device CNT will be described with reference to Fig. 5 . The light source device CNT is disposed on the body frame 21 of the device frame 13. The light source device CNT is projected onto the substrate P as a depiction Paint the laser light of the beam LB. The light source device CNT has a light source that emits light of a predetermined wavelength band suitable for exposure of the photosensitive functional layer on the substrate P and a light-active ultraviolet band. As the light source, for example, a laser light source that continuously oscillates or oscillates the third harmonic laser light of YAG (wavelength: 355 nm) in a range of several KHz to several hundreds of MHz can be used.

The light source device CNT includes a laser light generating unit CU1 and a wavelength converting unit CU2. The laser light generating unit CU1 includes a laser light source OSC and optical fiber amplifiers FB1 and FB2. The laser light generating unit CU1 emits the fundamental wave laser light Ls. The fiber amplifiers FB1, FB2 oscillate the basic wave laser light Ls with the fiber. The laser light generating unit CU1 causes the fundamental wave laser light Lr of the amplitude to be incident on the wavelength conversion unit CU2. The wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a beam splitter, a polarization beam splitter, a chirp, etc., and the third higher harmonic laser light having a laser wavelength of 355 nm is taken out by using the light (wavelength) selective component. (Drawing light beam LB). At this time, the laser light source OSC that emits the seed light is pulse-lighted in synchronization with the system clock or the like, and the light source device CNT emits the drawing light beam LB having a wavelength of 355 nm as pulse light of several KHz to several hundreds of MHz. Further, in the case of using such a fiber amplifier, the pulse-on time of the final output laser light (Lr and LB) can be controlled to a picosecond level depending on the pulse driving of the laser light source OSC.

Further, as the light source, for example, a light source such as a mercury lamp having a glow line (g line, h line, i line, or the like) having an ultraviolet band, a laser diode having an oscillation peak at an ultraviolet band having a wavelength of 450 nm or less, and a light emission can be used. Solid-state light source such as diode (LED), or KrF excimer laser light (wavelength 248 nm) emitting far ultraviolet light (DUV light), ArF excimer laser light (wavelength 193 nm), XeCl excimer laser (wavelength 308 nm) Wait for a gas laser source.

Here, the drawing light beam LB emitted from the light source device CNT is projected onto the substrate P through the polarization beam splitter PBS provided in each of the drawing units UW1 to UW5 as will be described later. Generally In other words, the polarizing beam splitter PBS reflects the linearly polarized beam of S-polarized light, and penetrates the beam of the linearly polarized light that is P-polarized. Therefore, in the light source device CNT, it is preferable that the drawing light beam LB incident on the polarization beam splitter PBS is a laser light that emits a linearly polarized light (S-polarized light beam). Further, since the energy density of the laser light is high, the illuminance of the light beam projected on the substrate P can be appropriately ensured.

Next, the drawing device 11 for the exposure device EX will be described with reference to Fig. 3 . The drawing device 11 is a so-called multi-beam type drawing device 11 that uses a plurality of drawing units UW1 to UW5. In the drawing device 11, the drawing light beam LB emitted from the light source device CNT is divided into a plurality of stripes, and the plurality of divergent drawing light beams LB are arranged along a plurality of stripes on the substrate P in FIG. 3 (for example, in the first embodiment, 5) The drawing lines LL1 to LL5 are respectively condensed into minute light (several μm diameter) for scanning. The drawing device 11 joins the patterns drawn on the substrate P by the respective plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, a plurality of drawing lines LL1 to LL5 (scanning tracks of spot light) formed by scanning the plurality of drawing light beams LB on the substrate P by the drawing device 11 will be described with reference to FIG.

As shown in FIG. 3, a plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. On the substrate P on the upstream side in the rotation direction, the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 which are parallel to the Y-axis are parallel to the Y-axis on the substrate P on the downstream side in the rotational direction. The second drawing line LL2 and the fourth drawing line LL4 of the even number are arranged.

Each of the drawing lines LL1 to LL5 is formed substantially in parallel in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating cylinder DR, and is shorter than the length of the substrate P in the width direction. Strictly speaking, each of the drawing lines LL1 to LL5 is a bonding error of a pattern obtained by drawing a plurality of lines LL1 to LL5 when the substrate P is conveyed at the reference speed by the substrate transfer mechanism 12. The difference is the smallest, and the angle (the axial direction or the width direction) in which the rotation center line AX2 of the rotating cylinder DR extends is inclined by a predetermined angle.

The odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged at a predetermined interval in the direction of the center line AX2 of the rotating cylinder DR. Further, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at a predetermined interval in the direction of the center line AX2 of the rotating cylinder DR. In this case, the second drawing line LL2 is disposed between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is disposed between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2. The fourth drawing line LL4 is disposed between the third drawing line LL3 and the fifth drawing line LL5 in the center line AX2 direction. Further, the first to fifth drawing lines LL1 to LL5 are arranged to cover the full width (axial direction) of the exposure region A7 drawn on the substrate P.

The scanning direction of the spot light of the drawing light beam LB scanned along the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 is one-dimensional direction and same direction. Further, the scanning direction of the spot light of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is in the one-dimensional direction and the same direction. At this time, the scanning direction (+Y direction) of the spot light of the drawing light beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the spot light of the drawing light beam LB scanned along the even-numbered drawing lines LL2, LL4 (-Y direction), as indicated by the arrow in Fig. 3, is the opposite direction. In this case, each of the drawing units UW1 to UW5 has the same configuration, and the odd-numbered drawing unit and the even-numbered drawing unit are arranged to rotate 180° in the XY plane, and the respective drawing units UW1 to UW5 are used as the light beams. The polygon mirror of the scanner rotates in the same direction. Therefore, the drawing start position of the odd-numbered drawing lines LL3 and LL5 and the drawing start position of the even-numbered drawing lines LL2 and LL4 are seen from the direction in which the substrate P is transported. In the Y direction, the error below the size of the spot light is adjacent (or coincident), and similarly, the drawing end position of the odd-numbered drawing lines LL1, LL3 and the drawing end position of the even-numbered drawing lines LL2, LL4 are tied to The Y direction is adjacent (or coincident) with an error below the diameter of the spot light.

As described above, each of the odd-numbered drawing lines LL1, LL3, and LL5 is arranged in a row in the width direction of the substrate P so that the substrate P is substantially parallel to the rotation center line AX2 of the rotating cylinder DR. Each of the even-numbered drawing lines LL2 and LL4 is arranged in a row in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotating cylinder DR on the substrate P.

Next, the drawing device 11 will be described with reference to Figs. 4 to 7 . The drawing device 11 includes the plurality of drawing units UW1 to UW5, a divergent optical system SL that directs the drawing light beams LB from the light source device CNT to the drawing units UW1 to UW5, and a calibration detecting system 31 for performing calibration.

The divergent optical system SL divides the drawing light beam LB emitted from the light source device CNT into a plurality of stripes, and guides the plurality of divergent drawing light beams LB to the plurality of drawing units UW1 to UW5, respectively. The divergent optical system SL has a first optical system 41 in which the drawing light beam LB emitted from the light source device CNT is divided into two, and a second optical system 42 in which the light beam LB is incident on one of the first optical systems 41, and The third optical system 43 into which the other drawing light beam LB is different from the first optical system 41 is incident. Further, the first optical system 41 of the divergent optical system SL is provided with a beam shifting mechanism 44 that traverses the drawing light beam LB2 in a plane orthogonal to the axis of the drawing light beam LB, and is the third in the divergent optical system SL. The optical system 43 is provided with a beam shifting mechanism 45 that traverses the drawing light beam LB2. The divergent optical system SL is provided on one side of the light source device CNT side on the main body frame 21, and the other on the drawing unit UW1 to UW5 side is provided on the second optical table 25.

The first optical system 41 includes a half-wavelength plate 51, a polarizer (polarizing beam splitter) 52, a beam diffuser 53, a first reflecting mirror 54, a first relay lens 55, and a second relay lens. 56. Beam displacement mechanism 44, second mirror 57, third mirror 58, fourth mirror 59, and first beam splitter 60. Moreover, since the arrangement relationship of each member is not easily understood from FIGS. 4 and 5, it will be described with reference to the perspective view of FIG. 6.

As shown in Fig. 6, the drawing light beam LB emitted from the light source device CNT in the +X direction is incident on the 1/2 wavelength plate 51. The 1/2 wavelength plate 51 is rotatable in the incident surface of the drawing light beam LB. The drawing light beam LB incident on the half-wavelength plate 51 has a polarization direction which is a predetermined polarization direction corresponding to the rotational position (angle) of the half-wavelength plate 51. The drawing light beam LB passing through the half-wavelength plate 51 is incident on the polarizing mirror 52. The polarizer 52 penetrates the light component of the predetermined polarization direction contained in the drawing light beam LB, and reflects the light component of the other polarization direction in the +Y direction. Therefore, the intensity of the drawing light beam LB reflected by the polarizing mirror 52 can be adjusted by the cooperative action of the half-wavelength plate 51 and the polarizing mirror 52, depending on the rotational position of the half-wavelength plate 51.

A portion (the unnecessary light component) of the drawing light beam LB that has passed through the polarizer 52 is irradiated to the diffuser (light harvesting) 53. The diffuser 53 absorbs a part of the light component of the incident light beam LB that is incident to suppress the light component from leaking to the outside. Further, when the adjustment operation of various optical systems through which the drawing light beam LB passes is performed, it is dangerous because the power of the laser power is too strong in the maximum state, so that the diffuser 53 can absorb more light components of the drawing light beam LB. The rotation position (angle) of the half-wavelength plate 51 is changed so that the power of the drawing light beam LB toward the drawing units UW1 to UW5 is largely attenuated.

The drawing beam LB reflected by the polarizer 52 in the +Y direction is reflected by the first mirror 54 in the +X direction, and is transmitted through the first relay lens 55 and the second relay lens 56. The displacement mechanism 44 reaches the second mirror 57.

The first relay lens 55 converges the drawing light beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 causes the drawing light beam LB which is diverged after convergence to become a parallel light beam again.

The beam displacement mechanism 44, as shown in FIG. 6, includes two parallel plane plates (quartz) arranged along the direction of travel (+X direction) of the drawing beam LB, one of which is disposed to be parallel to the Y axis. The axis is tilted and the other parallel plane plate is arranged such that the ribs are inclined about an axis parallel to the Z axis. The drawing light beam LB is traversed in the ZY plane and emitted from the beam displacement mechanism 44 in accordance with the inclination angle of each parallel plane plate.

Thereafter, the drawing light beam LB is reflected by the second mirror 57 in the -Y direction, reaches the third mirror 58, and is reflected by the third mirror 58 in the -Z direction to reach the fourth mirror 59. By the fourth mirror 59, the drawing light beam LB is reflected in the +Y direction and enters the first beam splitter 60. The first beam splitter 60 reflects a part of the light amount component of the drawing light beam LB in the -X direction to be guided to the second optical system 42 and guides the remaining light amount component of the drawing light beam LB to the third optical system 43. In the present embodiment, the drawing light beam LB guided to the second optical system 42 is distributed to the three drawing units UW1, UW3, and UW5, and the drawing light beam LB guided to the third optical system 43 is distributed to the two drawing frames. Units UW2, UW4. Therefore, the ratio of the reflectance to the transmittance of the first beam splitter 60 on the light splitting surface is preferably 3:2 (reflectance 60%, transmittance 40%), but it is not necessarily so impossible, and may be 1:1.

Here, the third mirror 58 and the fourth mirror 59 are provided at a predetermined interval from the rotation axis I of the moving mechanism 24. In other words, the center line of the drawing light beam LB (parallel beam) reflected by the third reflecting mirror 58 and directed toward the fourth reflecting mirror 59 is set to coincide with the rotating axis I. Coaxial).

In addition, the configuration including the third mirror 58 to the light source device CNT (the portion surrounded by the two-point chain line on the upper side in the Z direction in FIG. 4) is provided on the main body frame 21 side, and includes the fourth reflection. The configuration of the mirror 59 to the plurality of drawing units UW1 to UW5 (the portion surrounded by the two-dot chain line on the lower side in the Z direction of FIG. 4) is provided on the second optical table 25 side. Since the third mirror 58 and the fourth mirror 59 are provided such that the first optical stage 23 and the second optical stage 25 are relatively rotated by the moving mechanism 24, the drawing light beam LB passes through the coaxial axis I, so The optical path of the drawing beam LB of the mirror 59 to the first beam splitter 60 is not changed. Therefore, even if the second optical stage 25 is rotated by the moving mechanism 24 with respect to the first optical stage 23, the drawing light beam LB emitted from the light source device CNT provided on the main body frame 21 side can be appropriately and stably guided. 2 a plurality of drawing units UW1 to UW5 on the side of the optical table 25.

The second optical system 42 diverges the drawing light beam LB, which is one of the first beam splitters 60 of the first optical system 41, to the odd-numbered drawing units UW1, UW3, and UW5 to be described later. The second optical system 42 includes a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth mirror 64.

The first beam splitter 60 of the first optical system 41 is reflected by the drawing beam LB in the -X direction, is reflected by the fifth mirror 61 in the -Y direction, and is incident on the second beam splitter 62. A part of the drawing light beam LB incident on the second beam splitter 62 is reflected in the -Z direction, and is guided to one of the odd-numbered drawing units UW5 (see FIG. 5). The drawing light beam LB penetrating through the second beam splitter 62 is incident on the third beam splitter 63. The drawing light beam LB incident on the third beam splitter 63 is partially reflected in the -Z direction, and is guided to one of the odd-numbered drawing units UW3 (see FIG. 5). And a portion of the drawing light beam LB that has passed through the third beam splitter 63 is reflected by the sixth mirror 64 toward the -Z direction, leading to the odd number One drawing unit UW1 (see Fig. 5). Further, in the second optical system 42, the drawing light beam LB irradiated to the odd-numbered drawing units UW1, UW3, and UW5 is slightly inclined with respect to the -Z direction.

Moreover, in order to effectively utilize the power of the drawing beam LB, the ratio of the reflectance to the transmittance of the second beam splitter 62 is close to 1:2, and the ratio of the reflectance to the transmittance of the third beam splitter 63 is close to 1: 1 is preferred.

On the other hand, the third optical system 43 diverges the drawn light beam LB of the other of the first beam splitters 60 of the first optical system 41 to the even-numbered drawing units UW2 and UW4 to be described later. The third optical system 43 includes a seventh mirror 71, a beam shifting mechanism 45, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing beam LB penetrating in the +Y direction by the first beam splitter 60 of the first optical system 41 is reflected by the seventh mirror 71 in the +X direction, passes through the beam shifting mechanism 45, and is incident on the eighth reflecting mirror 72. . The beam shifting mechanism 45 is constituted by two parallel plane plates (quartz) which are tiltable in the same manner as the beam shifting mechanism 44, and the drawing light beam LB which is advanced toward the eighth mirror 72 in the +X direction is traversed in the ZY plane.

The drawing beam LB reflected by the eighth mirror 72 in the -Y direction is incident on the fourth beam splitter 73. The drawing light beam LB irradiated to the fourth beam splitter 73 is partially reflected in the -Z direction, and is guided to one of the even numbered drawing units UW4 (see FIG. 5). The drawing light beam LB that has passed through the fourth beam splitter 73 is reflected by the ninth mirror 74 in the -Z direction, and is guided to one of the even numbered drawing units UW2. Further, in the third optical system 43, the drawing light beam LB irradiated to the even-numbered drawing units UW2 and UW4 is slightly inclined with respect to the -Z direction.

As described above, in the divergent optical system SL, the drawing light beams LB from the light source device CNT are divided into a plurality of stripes toward the plurality of drawing units UW1 to UW5. At this time, the first The beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 have reflectance (transmission ratio) adjusted to an appropriate reflectance depending on the number of divergence of the drawing light beam LB. The beam intensity of the drawing light beam LB irradiated to the plurality of drawing units UW1 to UW5 is the same intensity.

The beam shifting mechanism 44 is disposed between the second relay lens 56 and the second mirror 57. The beam shifting mechanism 44 can finely adjust all the positions of the drawing lines LL1 to LL5 formed on the substrate P in the drawing plane of the substrate P in μm order.

Further, the beam shifting mechanism 45 can finely adjust the second drawing line LL2 and the fourth drawing line LL4 of the even number among the drawing lines LL1 to LL5 formed on the substrate P in the drawing plane of the substrate P in the order of μm.

Further, referring to Fig. 4, Fig. 5, and Fig. 7, a plurality of drawing units UW1 to UW5 will be described. As shown in FIG. 4 (and FIG. 1), a plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. The plurality of drawing units UW1 to UW5 are disposed on the side (the -X direction side in FIG. 5) of the first, third, and fifth drawing lines LL1, LL3, and LL5 across the center plane p3, and the first drawing unit UW1 is disposed. 3 drawing unit UW3 and fifth drawing unit UW5. The first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at a predetermined interval in the Y direction. Further, the plurality of drawing units UW1 to UW5 are disposed on the side (the +X direction side in FIG. 5) of the second and fourth drawing lines LL2 and LL4 with the center plane p3 interposed therebetween, and the second drawing unit UW2 and the fourth drawing unit are disposed. UW4. The second drawing unit UW2 and the fourth drawing unit UW4 are arranged at a predetermined interval in the Y direction. At this time, as shown in the previous FIG. 2 or FIG. 5, the second drawing unit UW2 is disposed between the first drawing unit UW1 and the third drawing unit UW3 in the Y direction. Similarly, the third drawing unit UW3 is disposed between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction. Fourth drawing unit UW4, in the Y direction It is disposed between the third drawing unit UW3 and the fifth drawing unit UW5. Further, as shown in FIG. 4, the first drawing unit UW1, the third drawing unit UW3, the fifth drawing unit UW5, the second drawing unit UW2, and the fourth drawing unit UW4 are centered on the center plane p3 as viewed in the Y direction. Symmetrical configuration.

Next, the configuration of the optical system in each of the drawing units UW1 to UW5 will be described with reference to Fig. 4 . In addition, since each of the drawing units UW1 to UW5 has the same configuration, the first drawing unit UW1 (hereinafter simply referred to as the drawing unit UW1) will be described as an example.

The drawing unit UW1 shown in FIG. 4 scans the spot light of the drawing light beam LB along the drawing line LL1 (first drawing line LL1), and includes a light deflector 81, a polarization beam splitter PBS, a quarter-wave plate 82, and a scanner. 83. A bending mirror 84, an f-θ lens system 85, and an Y-magnification correction optical member (lens group) 86B including a cylindrical lens 86. Further, a calibration detecting system 31 is provided adjacent to the deflecting beam splitter PBS.

The optical deflector 81 is, for example, an AOM: Acoust Iic Optic Modulator. The AOM generates a diffraction grating by ultrasonic waves (high-frequency signals) internally, so that one-time diffracted light of the incident drawing beam is generated in an ON state in a predetermined diffraction angle direction, and no diffracted light is generated. The optical switching element that switches in the OFF state.

The control unit 16 shown in FIG. 1 performs switching of the projection/non-projection of the drawing light beam LB on the substrate P at a high speed by performing ON/OFF switching of the optical deflector 81. Specifically, one of the drawing light beams LB distributed by the divergent optical system SL is irradiated to the optical deflector 81 through the relay lens 91 with a slight inclination in the -Z direction. When the optical deflector 81 is switched OFF, the drawing light beam LB is straightly moved in an inclined state, and is set to be blocked by the light shielding plate 92 passing through the optical deflector 81. On the other hand, when the optical deflector 81 is switched ON, the light beam LB is drawn (1st-order diffracted light) That is, it is deflected in the -Z direction, and is irradiated to the polarization beam splitter PBS provided in the Z direction of the optical deflector 81 by the optical deflector 81. Therefore, when the optical deflector 81 is switched ON, the spot light of the drawing light beam LB is projected on the substrate P, and when the optical deflector 81 is switched OFF, the spot light of the drawing light beam LB is not projected on the substrate P.

Further, since the AOM system is disposed at the position of the optical waist of the drawing light beam LB that is converged by the relay lens 91, the drawing light beam LB (primary diffracted light) emitted from the optical deflector 81 is diverged. For this purpose, after the optical deflector 81, a relay lens 93 for changing the divergent drawing light beam LB back to the parallel light beam is provided.

The polarization beam splitter PBS reflects the drawing light beam LB that is irradiated from the optical deflector 81 through the relay lens 93. The drawing light beam LB emitted from the polarization beam splitter PBS is based on the 1/4 wavelength plate 82, the scanner 83 (rotating polygon mirror), the bending mirror 84, the f-θ lens system 85, the Y magnification correction optical member 86B, and the cylinder surface. The order of the lenses 86 proceeds, and is concentrated on the substrate P to form spot light.

On the other hand, the polarization beam splitter PBS and the quarter-wave plate 82 provided between the polarization beam splitter PBS and the scanner 83 cooperate to project a projection beam projected on the substrate P or the outer peripheral surface of the rotating cylinder DR below it. The reflected light of the LB is reversely advanced in the order of the Y-magnification correction optical member 86B, the cylindrical lens 86, the f-θ lens system 85, the bending mirror 84, and the scanner 83, so that the reflected light can be transmitted. In other words, the laser light that is irradiated to the linearly polarized light of the drawing beam LB of the polarization beam splitter PBS by the optical deflector 81 is reflected by the polarization beam splitter PBS. Further, the drawing light beam LB reflected by the polarization beam splitter PBS passes through the quarter wave plate 82, the scanner 83, the bending mirror 84, the f-θ lens system 85, the Y magnification correction optical member 86B, and the cylindrical lens 86. When the substrate P is irradiated, the spot light of the drawing light beam LB condensed on the substrate P becomes circularly polarized light. The reflected light from the substrate P (or the outer peripheral surface of the rotating cylinder DR) is forwardly advanced to the optical path of the drawing light beam LB, and is again passed. The 1/4 wavelength plate 82 is passed through, and the P-polarized linearly polarized laser light is obtained. Therefore, the reflected light from the substrate P (or the rotating cylinder DR) reaching the polarization beam splitter PBS passes through the polarization beam splitter PBS, and is irradiated to the photodetector 31Cs of the calibration detecting system 31 through the relay lens 94.

As described above, the polarized light is disposed in the beam splitter PBS system in the optical splitter including the scanning optical system of the scanner 83 and the calibration detecting system 31. Since the calibration detecting system 31 shares a part of the majority of the light transmitting optical system that sends the drawing light beam LB to the substrate P, it is a simple and compact optical system.

As shown in FIGS. 4 and 7, the scanner 83 has a mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing light beam LB (parallel light beam) passing through the quarter-wavelength plate 82 is reflected by the mirror 96 through the cylindrical lens 95 in the XY plane, and is irradiated onto the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 is rotated in a predetermined rotation direction about the rotation axis 97a, so that the reflection angle of the drawing light beam LB (the light beam modulated by the intensity of the light deflector 81) irradiated on the reflection surface 97b is in the XY plane. According to this, the reflected drawing light beam LB is condensed into spot light by the bending mirror 84, the f-θ lens system 85, and the second cylindrical lens 86 (and the Y magnification correction optical member 86B) along the substrate. The drawing line LL1 on P (samely, along LL2~LL5) is scanned. The origin detector 98 detects the origin of the drawing light beam LB scanned along the drawing line LL1 of the substrate P (samely, along LL2 to LL5). The origin detector 98 is disposed on the opposite side of the mirror 96 with the drawing light beam LB reflected by the respective reflecting surfaces 97b.

In FIG. 7, for the sake of simplification of description, the origin detector 98 is merely a photodetector, but actually, an LED and a semiconductor beam that project a light beam for detection are provided on the reflecting surface 97b of the rotating polygon mirror 97 projected toward the drawing light beam LB. a light source for detection such as shooting, the origin detector 98 detects the light The reflected light of the light beam on the reflecting surface 97b is transmitted through the thin slit for photoelectric detection.

As a result, the origin detector 98 is set to output a pulse signal indicating the origin at a time when the spot light is irradiated onto the drawing start position of the drawing line LL1 (LL2 to LL5) on the substrate P.

The drawing light beam LB irradiated from the scanner 83 to the bending mirror 84 is reflected by the bending mirror 84 in the -Z direction, and is incident on the f-θ lens system 85 and the cylindrical lens 86 (and the Y magnification correction optical member 86B).

When the respective reflecting surfaces 97b of the rotating polygon mirror 97 are not strictly parallel with respect to the center line of the rotating shaft 97a, but are slightly inclined (face inclined), the drawing lines (LL1 to LL5) formed by the spot light projected on the substrate P, Each of the reflecting surfaces 97b is offset on the substrate P in the X direction. Therefore, with reference to Fig. 8, it is explained that the surface of each of the reflecting surfaces 97b of the rotating polygon mirror 97 is inclined by the arrangement of the two cylindrical lenses 95 and 86, and the deviation of the drawing lines LL1 to LL5 in the X direction is reduced or eliminated.

The left side of Fig. 8 shows the state in which the optical paths of the cylindrical lens 95, the scanner 83, the f-θ lens system 85, and the cylindrical lens 86 are developed on the XY plane, and the right side of Fig. 8 shows the optical path developed in the XZ plane. status. As a basic optical arrangement, the reflecting surface 97b of the rotating polygon mirror 97 illuminated by the drawn light beam LB is disposed at the entrance pupil position (front focus position) of the f-θ lens system 85. Accordingly, the angle of incidence of the drawing beam LB incident on the f-θ lens system 85 becomes θ p with respect to the rotation angle θ p/2 of the rotating polygon mirror 97, and is proportional to the incident angle θ p to be projected on the substrate P ( The image height position on the illuminated surface). Further, by arranging the reflection surface 97b at the front focus position of the f-θ lens system 85, the drawing light beam LB projected on the substrate P becomes a telecentric state at any position on the drawing line (the chief ray of the drawing light beam for the point light) Constant and f-theta lens The optical axis AXf of the system 85 is in a parallel state).

As shown in Fig. 8, the two cylindrical lenses 95, 86 are in the plane perpendicular to the rotation axis 97a of the rotating polygon mirror 97 (XY plane), and function as a parallel plate glass having a refractive power of zero. The Z direction (in the XZ plane) in which the rotation shaft 97a extends is a function as a convex lens having a certain positive refractive power. The cross-sectional shape of the drawing light beam LB (substantially parallel light beam) incident on the first cylindrical lens 95 is circular to the extent of several mm, but the focal position of the cylindrical lens 95 in the XZ plane is set to the rotating multi-face by the mirror 96. When the reflection surface 97b of the mirror 97 is placed, it has a beam width of several mm in the XY plane, and in the Z direction, the converged slit-like spot light is concentrated on the reflection surface 97b in the rotation direction.

The drawing light beam LB reflected by the reflecting surface 97b of the rotating polygon mirror 97 is a parallel beam in the XY plane, but in the XZ plane (the direction in which the rotating shaft 97a extends), the divergent beam is incident on the f-θ lens system 85. . Therefore, the drawing light beam LB emitted from the f-θ lens system 85 is substantially parallel to the light beam in the XZ plane (the direction in which the rotating shaft 97a extends), but in the XZ plane by the action of the second cylindrical lens 86, That is, the direction in which the substrate P is orthogonal to the direction in which the drawing lines LL1 to LL5 extend in the substrate P is also collected as spot light. As a result, a circular small spot light is projected on each of the drawing lines on the substrate P.

By the arrangement of the cylindrical lens 86, as shown on the right side of Fig. 8, in the XZ plane, the reflecting surface 97b of the rotating polygon mirror 97 and the substrate P (irradiated surface) can be set in an optically conjugated relationship. Therefore, even if the respective reflecting surfaces 97b of the rotating polygon mirror 97 have a tilt error with respect to the non-scanning direction (the direction in which the rotating shaft 97a extends) orthogonal to the scanning direction of the drawing light beam LB, the drawing lines (LL1 to LL5) on the substrate P are The position is also not shifted to the non-scanning direction of the spot light (the transport direction of the substrate P). As described above, by setting the cylinder surface before and after rotating the polygon mirror 97 The mirrors 95 and 86 are configured to form a face tilt correction optical system for a multi-faceted reflecting surface in a non-scanning direction.

In the second place, as shown in Fig. 7, each of the scanners 83 of the plurality of drawing units UW1 to UW5 is symmetrically formed with respect to the center plane p3. The plurality of scanners 83 are disposed on the upstream side in the rotation direction of the rotating cylinder DR (the -X direction side in FIG. 7), and the drawing units UW2, UW4, and the three scanners 83 corresponding to the drawing units UW1, UW3, and UW5. The corresponding two scanners 83 are disposed on the downstream side in the rotation direction of the rotary cylinder DR (the +X direction side in Fig. 7). On the other hand, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other with the center plane p3 interposed therebetween. In this manner, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to rotate by 180° around the rotation axis I (Z axis). Therefore, when the three rotating polygon mirrors 97 on the upstream side are rotated to the left, for example, when the drawing polygon beam 97 is irradiated to the rotating polygon mirror 97, the drawing light beam LB reflected by the rotating polygon mirror 97 is moved from the drawing start position to the drawing end position. Scan in the given scanning direction (for example, the +Y direction of Figure 7). On the other hand, when the two rotating polygon mirrors 97 on the downstream side rotate to the left and the drawing beam LB is irradiated to the rotating polygon mirror 97, the drawing beam LB reflected by the rotating polygon mirror 97 ends from the drawing start position toward the drawing. The position is scanned in the scanning direction (for example, the -Y direction of FIG. 7) opposite to the three rotating polygon mirrors 97' on the upstream side.

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB that reaches the substrate P from the odd-numbered drawing units UW1, UW3, and UW5 is in the direction in which the orientation line Le1 is set. That is, the orientation line Le1 is set, and the line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 is connected in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB that reaches the substrate P from the even-numbered drawing units UW2 and UW4 is in the direction in which the orientation line Le2 is set. That is to say, the orientation line Le2 is set, and the line connecting the even-numbered drawing lines LL2, LL4 and the rotation center line AX2 is connected in the XZ plane. Therefore, the substrate P is spotlighted The respective traveling directions (principal rays) of the projected drawing light beam LB are set to be toward the rotation center line AX2 of the rotating cylinder DR.

The Y magnification correction optical member 86B is disposed between the f-θ lens system 85 and the substrate P. In the Y magnification correction optical member 86B, the drawing lines LL1 to LL5 formed by the respective drawing units UW1 to UW5 can be slightly enlarged or reduced in the Y direction.

Specifically, a penetrating parallel plane plate (quartz) having a certain thickness covering each of the drawing lines LL1 to LL5 can be mechanically bent in the direction in which the drawing line extends to make the Y-direction magnification of the drawing line. (Scanning length) a variable mechanism, or a mechanism in which one of the three lens systems of the convex lens, the concave lens, and the convex lens is moved in the optical axis direction to make the Y-direction magnification (scan length) of the drawing line variable.

In the drawing device 11 configured in this manner, the control unit 16 controls each unit to draw a predetermined pattern on the substrate P. In other words, the control unit 16 performs ON/OFF modulation of the optical deflector 81 in accordance with the CAD information of the pattern to be drawn on the substrate P during the scanning of the drawing light beam LB projected on the substrate P in the scanning direction. The drawing light beam LB is biased to draw a pattern on the light sensing layer of the substrate P. Further, the control unit 16 synchronizes the scanning direction of the drawing light beam LB scanned along the drawing line LL1 with the movement of the substrate P by the rotation of the rotating cylinder DR in the conveying direction, and accordingly corresponds to the portion of the drawing line LL1 in the exposure area A7. Depicts a given pattern.

Next, the alignment microscopes AM1 and AM2 will be described with reference to FIGS. 3 and 9. The alignment marks previously formed on the substrate P or the reference marks and reference patterns formed on the rotating cylinder DR are detected by the alignment microscopes AM1 and AM2. Hereinafter, the alignment mark of the substrate P and the reference mark and the reference pattern of the rotating cylinder DR are simply referred to as marks. The alignment microscopes AM1, AM2 are used to align the substrate P with the predetermined pattern drawn on the substrate P, or to rotate the cylinder Calibration of the DR and the rendering device 11.

The alignment microscopes AM1 and AM2 are disposed on the upstream side of the rotation direction of the rotary cylinder DR (the conveyance direction of the substrate P) from the drawing lines LL1 to LL5 formed by the drawing device 11. Further, the alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotary cylinder DR than the alignment microscope AM2.

The alignment microscopes AM1 and AM2 are a pair of objective lens systems GA as detection probes for projecting illumination light onto the substrate P or the rotating cylinder DR and incident on the light generated by the mark (only representative display pairs in FIG. 9) The objective lens system GA4) of the quasi-microscope AM2 and the image system (such as a bright field image, a dark field image, a fluorescent image, etc.) that is transmitted through the object lens system GA are imaged by a two-dimensional CCD or CMOS. GD (only a representative GD4 of the alignment microscope AM2 is shown in Fig. 9) is equivalent. Further, the illumination light for alignment is light having a wavelength band of almost no sensitivity to the photo-sensing layer on the substrate P, for example, light having a wavelength of 500 to 800 nm.

The alignment microscope AM1 is arranged in a plurality of rows (for example, three) in the Y direction (the width direction of the substrate P). Similarly, the alignment microscope AM2 is arranged in a plurality of rows (for example, three) in the Y direction (the width direction of the substrate P). That is to say, six alignment microscopes AM1 and AM2 are provided in total.

In FIG. 3, it is also understood that the arrangement of the respective pair of lens lenses GA1 to GA3 of the three alignment microscopes AM1 is displayed in each of the pair of alignment lens systems GA of the six alignment microscopes AM1 and AM2. The observation areas (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating cylinder DR) of the alignment lens units GA1 to GA3 of the three alignment microscopes AM1 are as shown in FIG. The center line AX2 is parallel to the Y direction and is arranged at a predetermined interval. As shown in FIG. 9, the optical axis La1~ of each of the pair of objective lens systems GA1 to GA3 passing through the center of each observation region Vw1 to Vw3 La3, both parallel to the XZ plane. Similarly, the observation areas Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating cylinder DR) of the three alignment microscopes AM2 are parallel to the rotation center line AX2 as shown in FIG. The Y direction is configured at regular intervals. As shown in Fig. 9, the optical axes La4 to La6 passing through the respective objective lens systems GA at the centers of the respective observation regions Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary cylinder DR.

The alignment areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 are attached to the substrate P and the rotating cylinder DR, and are set, for example, in the range of 500 to 200 μm diagonal. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set to be arranged in a radial direction extending from the rotation center line AX2 to the radial direction of the rotating cylinder DR. Le3 is in the same direction. In this manner, the azimuth line Le3 is set to be aligned with the line of the observation area Vw1 to Vw3 of the microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA are set to be in a direction of the radial direction extending from the rotation center line AX2 to the rotation cylinder DR. Le4 is in the same direction. In this manner, the azimuth line Le4 is set to be aligned with the line of the observation area Vw4 to Vw6 of the microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG. At this time, the alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotary cylinder DR as compared with the alignment microscope AM2, so that the angle formed by the center plane p3 and the set orientation line Le3 is higher than the center plane p3 and the set orientation line. Le4 has a large angle.

On the substrate P, as shown in FIG. 3, the exposure regions A7 drawn by the respective five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 for positioning are used (hereinafter, referred to as the standard) Note), for example, formed in a cross shape.

In Fig. 3, the mark Ks1 is provided at a constant interval in the X direction in the peripheral region on the -Y side of the exposure region A7, and the mark Ks3 is provided at a constant interval in the X direction in the peripheral region on the +Y side of the exposure region A7. Further, the mark Ks2 is provided in the center of the Y direction in the blank area between the two exposure areas A7 adjacent in the X direction.

The mark Ks1 can be sequentially captured during the transfer of the substrate P in the observation region Vw1 of the alignment lens system GA1 of the alignment microscope AM1 and in the observation region Vw4 of the alignment lens system GA of the alignment microscope AM2. The way it is formed. Further, the mark Ks3 can be used in the observation region Vw3 of the alignment lens system GA3 of the alignment microscope AM1 and in the observation region Vw6 of the alignment lens system GA of the alignment microscope AM2 during the transfer period of the substrate P. The way of sequence capture is formed. Further, the mark Ks2 is respectively in the observation region Vw2 of the alignment lens system GA2 of the alignment microscope AM1 and in the observation region Vw5 of the alignment lens system GA of the alignment microscope AM2, during the transfer period of the substrate P. Formed in the same way.

Therefore, the alignment microscopes AM1 and AM2 on both sides of the Y-direction of the rotating cylinder DR of the three alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P at any time. Further, the alignment microscopes AM1 and AM2 in the center of the Y direction of the rotating cylinder DR in the alignment microscopes AM1 and AM2 can observe or detect the gaps formed between the exposure regions A7 formed on the substrate P at any time. Mark Ks2.

Here, since the exposure apparatus EX is a so-called multi-beam type drawing apparatus, a plurality of patterns drawn on the substrate P by the respective drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 are appropriately joined to each other in the Y direction. It is necessary to calibrate the joint precision of the plurality of drawing units UW1 to UW5 within an allowable range. In addition, the alignment microscope The relative positional relationship between the observation areas Vw1 to Vw6 of the respective drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 by AM1 and AM2 must be accurately determined by the reference line management. Calibration is also required for this baseline management.

In the calibration for confirming the joint precision of the plurality of drawing units UW1 to UW5 and the alignment for managing the alignment lines of the alignment microscopes AM1 and AM2, at least one of the outer peripheral surfaces of the rotating cylinder DR of the support substrate P is required. Set the fiducial mark or datum pattern. Therefore, as shown in FIG. 10, in the exposure apparatus EX, the rotating cylinder DR in which the reference mark or the reference pattern is provided in the outer peripheral surface is used.

As shown in Figs. 3 and 9, the rotating cylinder DR has the scale portions GPa and GPb constituting one of the rotational position detecting mechanisms 14 to be described later, as shown in Figs. 3 and 9 . Further, the rotating cylinder DR is provided with restriction bands CLa and CLb having narrow widths formed by concave grooves or convex edges on the inner side of the scale portions GPa and GPb. The width of the substrate P in the Y direction is set such that the interval between the two restriction bands CLa and CLb in the Y direction is small, and the substrate P is placed on the outer peripheral surface of the rotating cylinder DR so as to be in close contact with the inner region sandwiched by the band CLa and CLb. It is supported.

The rotating cylinder DR is provided with a plurality of line patterns RL1 (line patterns) inclined at +45 degrees with respect to the rotation center line AX2 and a relative rotation center line AX2 at the outer circumferential surface of the restriction belts CLa and CLb. A plurality of line patterns RL2 (line patterns) inclined at 45 degrees are repeatedly arranged in a grid-like reference pattern (may also be used as a reference mark) RMP at regular intervals (periods) Pf1 and Pf2. Moreover, the width of the line pattern RL1 and the line pattern RL2 is LW.

The reference pattern RMP is a substantially uniform oblique pattern (oblique lattice pattern) in order to avoid a change in the frictional force between the substrate P and the outer peripheral surface of the rotating cylinder DR or the tension of the substrate P. Moreover, the line patterns RL1, RL2 do not necessarily have to be inclined by 45 degrees, and may be The line pattern RL1 is formed in parallel with the Y-axis, and the line pattern RL2 is formed in a grid pattern of vertical and horizontal directions parallel to the X-axis. In addition, it is not necessary to make the line patterns RL1, RL2 intersect at 90 degrees, or the rectangular area surrounded by the adjacent two line patterns RL1 and the adjacent two line patterns RL2 may be square (or rectangular). The angle of the other diamonds intersects the line patterns RL1, RL2.

Next, the rotational position detecting mechanism 14 will be described with reference to Figs. 3, 4 and 9. As shown in FIG. 9, the rotational position detecting means 14 optically detects the rotational position of the rotating cylinder DR, and an encoder system using, for example, a rotary encoder can be applied. The rotational position detecting mechanism 14 has scale portions GPa and GPb provided at both end portions of the rotary cylinder DR, and a plurality of encoder read heads EN1, EN2, EN3, and EN4 opposed to each of the scale portions GPa and GPb. Mobile measuring device. In FIGS. 4 and 9, only the four encoder heads EN1, EN2, EN3, and EN4 that face the scale portion GPa are displayed. However, the encoder head EN1 having the opposite arrangement in the scale portion GPb is also provided. EN2, EN3, EN4. The rotational position detecting mechanism 14 can detect the displacement gauges YN1, YN2, YN3, and YN4 of the offset of the both ends of the rotating cylinder DR (the slight displacement in the Y direction in which the rotation center line AX2 extends).

The scales of the scale portions GPa and GPb are formed in a ring shape in the entire circumferential direction of the rotating cylinder DR. The scale portions GPa and GPb are diffraction gratings in which concave or convex lattice lines are formed at a predetermined pitch (for example, 20 μm) in the circumferential direction of the outer circumference of the rotating cylinder DR, and are configured as an incremental type scale. Therefore, the scale portions GPa and GPb rotate integrally with the rotating cylinder DR around the rotation center line AX2.

The substrate P is wound inside the restriction bands CLa and CLb while avoiding the inside of the scale portions GPa and GPb at both ends of the rotary cylinder DR. If a strict arrangement relationship is required, the outer peripheral surfaces of the scale portions GPa and GPb and the substrate P wound around the rotating cylinder DR are set. The outer peripheral surface is in the same plane (the same radius from the center line AX2). In order to achieve this, the outer circumferential surfaces of the substrate windings GPa and GPb may be formed so as to be thicker than the thickness of the substrate P in the radial direction. Therefore, the outer circumferential surfaces of the scale portions GPa and GPb formed on the rotary cylinder DR can be set to have substantially the same radius as the outer circumferential surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale portions GPa and GPb in the same radial direction position as the drawing surface wound on the substrate P of the rotating cylinder DR, and reduce the measurement position and the processing position due to the rotation. The Abbe error caused by the difference in the radial direction of the system.

The encoder heads EN1, EN2, EN3, and EN4 are disposed at different positions in the circumferential direction of the rotating cylinder DR from the rotation center line AX2, respectively, around the scale portions GPa and GPb. The encoder read heads EN1, EN2, EN3, and EN4 are connected to the control unit 16. The encoder read heads EN1, EN2, EN3, and EN4 project a measuring beam toward the scale portions GPa and GPb, and photoelectrically detect the reflected beam (diffracted light), thereby detecting the positional change of the corresponding scale portions GPa and GPb. The signal (for example, a 2-phase signal having a phase difference of 90 degrees) is output to the control unit 16. The control unit 16 performs digital processing by interpolating the detection signal by a counting circuit (not shown), that is, measuring the angular change of the rotating cylinder DR by the submicron resolution, that is, measuring the circumference of the outer peripheral surface thereof. The position of the direction changes. The control unit 16 can also change the transport speed of the substrate P from the angle of the rotating cylinder DR.

Further, as shown in FIGS. 4 and 9, the encoder read head EN1 is disposed on the set azimuth line Le1. The azimuth line Le1 is set in the XZ plane, and the line connecting the measurement beam pair of the encoder head EN1 to the projection area (reading position) on the scale portion GPa (GPb) and the rotation center line AX2 is connected. Further, as described above, the azimuth line Le1 is provided in the XZ plane, and the lines connecting the drawing lines LL1, LL3, and LL5 and the rotation center line AX2 are connected. As can be seen from the above, the encoder read head EN1 is connected. The line of the reading position and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same line of sight.

Similarly, as shown in FIGS. 4 and 9, the encoder read head EN2 is disposed on the set orientation line Le2. The azimuth line Le2 is set in the XZ plane, and the line connecting the measurement beam pair of the encoder head EN2 to the projection area (reading position) on the scale portion GPa (GPb) and the rotation center line AX2 is connected. Further, as described above, the azimuth line Le2 is provided in the XZ plane, and the lines connecting the drawing lines LL2, LL4 and the rotation center line AX2 are connected. As described above, the line connecting the reading position of the encoder head EN2 to the rotation center line AX2 and the line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 are the same line of sight.

Further, as shown in FIGS. 4 and 9, the encoder read head EN3 is disposed on the set azimuth line Le3. The azimuth line Le3 is set in the XZ plane, and the line connecting the measurement beam to the encoder portion GPa (GPb) on the scale portion (reading position) and the rotation center line AX2 is connected. Further, as described above, the azimuth line Le3 is provided in the XZ plane, and the line connecting the alignment microscopes AM1 to the observation areas Vw1 to Vw3 of the substrate P and the rotation center line AX2 is connected. As can be seen from the above, the line connecting the reading position of the encoder head EN3 to the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same when viewed in the XZ plane. Direction line.

Similarly, as shown in FIGS. 4 and 9, the encoder read head EN4 is disposed on the set orientation line Le4. The azimuth line Le4 is set in the XZ plane, and is connected to the line between the measurement beam pair on the scale portion GPa (GPb) of the encoder read head EN4 and the rotation center line AX2. Further, as described above, the azimuth line Le4 is provided in the XZ plane, and the line connecting the observation microscopes V2 to Vw6 of the substrate P to the rotation center line AX2 is aligned with the alignment microscope AM2. From above It can be seen that the line connecting the reading position of the encoder read head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same orientation lines when viewed in the XZ plane. .

When the orientation of the encoder read heads EN1, EN2, EN3, and EN4 (the angular direction in the XZ plane centered on the rotation center line AX2) is expressed by the orientation lines Le1, Le2, Le3, and Le4, As shown in FIG. 4, a plurality of drawing units UW1 to UW5 and encoder heads EN1 and EN2 are arranged such that the orientation lines Le1 and Le2 are set at an angle of ±θ° with respect to the center plane p3. The orientation line Le1 and the set orientation line Le2 are set such that the encoder read head EN1 and the encoder read head EN2 are in a state of non-interference in space around the scale of the scale portion GPa (GPb).

The displacement gauges YN1, YN2, YN3, and YN4 are disposed around the scale portion GPa or GPb at different positions in the circumferential direction of the rotating cylinder DR when viewed from the rotation center line AX2. The displacement meters YN1, YN2, YN3, and YN4 are connected to the control unit 16.

The displacement gauges YN1, YN2, YN3, and YN4 can be subjected to displacement detection at a position close to the radial direction as much as possible on the drawing surface wound on the substrate P of the rotating cylinder DR, thereby reducing the Abbe error. The displacement gauges YN1, YN2, YN3, and YN4 project a measuring beam toward one of both ends of the rotating cylinder DR, and photoelectrically detect the reflected beam (or diffracted light), thereby correspondingly rotating the cylinder DR A detection signal for changing the position of the both ends in the Y direction (the width direction of the substrate P) is output to the control unit 16. The control unit 16 performs digital processing on a measurement signal (counter circuit or interpolation circuit, etc.) (not shown), and can measure the Y direction of the rotating cylinder DR (and the substrate P) with a submicron resolution. The displacement changes. The control unit 16 may measure the offset rotation of the rotating cylinder DR from one of the both ends of the rotating cylinder DR.

The displacement gauges YN1, YN2, YN3, YN4, although only one of the four In addition, in order to measure the offset rotation of the rotating cylinder DR, etc., if there are three or more of the four, it is possible to grasp the surface movement (dynamic tilt change, etc.) of one of the both ends of the rotating cylinder DR. Further, the indexing unit YN1, YN2, YN3, and YN4 may be omitted by the control unit 16 by marking or patterning on the measuring substrate P (or the marking on the rotating cylinder DR) fixed to the microscopes AM1 and AM2. .

Here, the control unit 16 detects the rotational angle positions of the scale portions (rotating cylinders DR) GPa and GPb by the encoder heads EN1 and EN2, and performs the odd-numbered and even-numbered drawing units based on the detected rotational angular position. The depiction of UW1~UW5. In other words, the control unit 16 performs ON/OFF modulation of the optical deflector 81 based on the CAD information of the pattern to be drawn on the substrate P during the scanning of the drawing light beam LB projected on the substrate P in the scanning direction. The timing of ON/OFF modulation using the optical deflector 81 can be performed based on the detected rotational angular position, that is, the pattern can be drawn with good precision on the photosensitive layer of the substrate P.

Further, the control unit 16 can detect the scale marks GPa1, GPb (rotating cylinder DR) detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. The position of the rotation angle can determine the correspondence relationship between the position of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angle position of the rotating cylinder DR. Similarly, when the control unit 16 detects the reference pattern RMP on the rotating cylinder DR by the alignment microscopes AM1 and AM2, the scale portions GPa and GPb (rotating cylinder DR) detected by the encoder heads EN3 and EN4 are stored. The position of the rotation angle can determine the correspondence relationship between the position of the reference pattern RMP on the rotating cylinder DR and the rotational angle position of the rotating cylinder DR. As described above, the alignment microscopes AM1 and AM2 can accurately measure the rotation angle position (or the circumferential direction position) of the rotating cylinder DR at the moment of sampling (Sampling) in the observation areas Vw1 to Vw6. In the exposure device EX, That is, based on the measurement result, alignment (alignment) of the substrate P with a predetermined pattern drawn on the substrate P, or calibration of the rotating cylinder DR and the drawing device 11 is performed.

Further, the actual sampling is at the position of the rotation angle of the rotating cylinder DR measured by the encoder heads EN3 and EN4, and becomes the position on the substrate P which is roughly known in advance or the position of the reference pattern RMP on the rotating cylinder DR. In the case of the corresponding angular position, the image information output from the respective imaging systems GD of the alignment microscopes AM1 and AM2 is recorded at a high speed in the image memory. That is, the image information output from each of the photographic systems GD is sampled by using the rotation angle position of the rotating cylinder DR measured by the encoder heads EN3 and EN4 as a trigger. In addition, unlike the pulse of the clock signal of a certain frequency, the rotation angle position (counting measurement value) of the rotating cylinder DR measured by the encoder heads EN3 and EN4 and the GD from each photography system are also used. The method of sampling the output image information at the same time.

Further, the mark on the substrate P and the reference pattern RMP on the rotating cylinder DR are moved in one direction with respect to the observation areas Vw1 to Vw6, and are taken as CCD or CMOS when sampling image information output from each photography system GD. It is preferable that the photographing element is fast in use of the shutter speed. Accordingly, the luminance of the illumination light in the illumination observation areas Vw1 to Vw6 must be increased. As the illumination source of the alignment microscopes AM1 and AM2, it is also possible to use a flash lamp or a high-luminance LED.

Fig. 11 is an explanatory view showing a positional relationship between a drawing line and a drawing pattern on a substrate. The drawing units UW1 to UW5 scan the spot light of the drawing light beam LB along the drawing lines LL1 to LL5 to draw the patterns PT1 to PT5. The drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start ends PTa of the patterns PT1 to PT5. The drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 are drawing terminals PTb of the patterns PT1 to PT5.

The drawing start terminal PTa of the pattern PT1 and the drawing terminal PTb in the drawing terminal PTb Engaged with the drawing terminal PTb of the pattern PT2. Similarly, the drawing start end PTa of the pattern PT2 is joined to the drawing start end PTa of the pattern PT3, the drawing terminal PTb of the pattern PT3 is joined to the drawing terminal PTb of the pattern PT4, and the drawing start end PTa of the pattern PT4 is joined to the drawing start end PTa of the pattern PT5. In this manner, the patterns PT1 to PT5 drawn on the substrate P are bonded to each other in the width direction of the substrate P as the substrate P moves in the strip direction, and the element pattern is drawn in the entire large exposure region A7.

Fig. 12 is an explanatory view showing the relationship between the spot light of the light beam and the drawing line. In the drawing units UW1 to UW5, the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 are typically described. Since the drawing lines LL3 to LL5 of the drawing units UW3 to UW5 are also the same, the description thereof will be omitted. By the constant-speed rotation of the polygon mirror 97, the beam spot light SP of the light beam LB is drawn along the drawing lines LL1 and LL2 on the substrate P, and the scanning is drawn from the drawing start positions OC1 and OC2 to the drawing end positions EC1 and EC2. The length of the line is LBL.

In general, in the direct exposure mode, even when the device draws a pattern of the smallest size that can be exposed, multiple exposures (multiple writing) of a plurality of spot lights SP are used to achieve high-precision and stable pattern drawing. As shown in FIG. 12, when the effective diameter of the spot light SP is Xs, it is provided on the drawing lines LL1 and LL2, and since the drawing light beam LB is pulsed light, it is generated by one pulse light (lighting time in picosecond order). The spot SP generated by the light SP and the next pulse light is scanned so as to overlap the CXs in the Y direction (main scanning direction) by about 1/2 of the diameter Xs.

Further, since the substrate P is transported to the +X direction at a constant speed at the same time as the main scanning of the spot light SP along the drawing lines LL1 and LL2, the drawing lines LL1 and LL2 are moved at a constant pitch in the X direction on the substrate P ( Sub-scan). The pitch is also set to about 1/2 of the distance CXs of the diameter Xs of the spot light SP, but is not limited thereto. Accordingly, in the sub-scanning direction (X direction), the diameter Xs is also 1/2 (or the overlapping distance may be), and the distance CXs is in the X direction. The adjacent spot lights SP are overlapped and exposed to each other. Further, the beam spot light SP emitted at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP emitted at the drawing end position EC2 of the drawing line LL2 move in the strip direction with the substrate P (ie, The sub-scanning is performed such that the drawing start position OC1 and the drawing end position EC1 of the drawing line LL1 and the drawing start position OC2 and the drawing end position EC2 of the drawing line LL2 are set so as to be joined by the overlapping distance CXs in the width direction (Y direction) of the substrate P. .

For example, when the effective diameter Xs of the beam spot light SP is 4 μm, two rows of the spot light SP can be favorably exposed, and two rows of light are arranged in the two rows of the main scanning and the sub-scanning. The area occupied, or the pattern of the smallest size occupied by 3 columns × 3 rows (the total of 9 spot lights arranged in the two directions of the main scanning and the sub-scanning), that is, the minimum size is 6 μm to 8 μm. Line width pattern. Further, when the rotating surface of the rotating polygon mirror 97 is 10 faces and the rotational speed of the rotating polygon mirror 97 around the rotating shaft 97a is 10,000 rpm or more, the rotating polygon mirror 97 can be drawn on the drawing line (LL1 to LL5). The number of scans (the scanning frequency Fms) of the spot light SP (drawing light beam LB) is 1166.66...Hz or more. This represents a pattern in which 1,666 lines of drawing lines can be drawn on the substrate P in the transport direction (X direction) every one second.

When the transport speed of the substrate P driven by the rotation of the rotating cylinder DR is about 5 mm/s, the X direction of the drawing line LL1 (the same applies to LL2 to LL5) shown in FIG. 12 (the transport direction of the substrate P) can be used. The distance (distance CXs) is about 3 μm.

In the case of the present embodiment, the resolution R of the pattern drawing in the main scanning direction (Y direction) is the effective diameter Xs of the spot light SP and the scanning frequency Fms, and the acousto-optic element (AOM) constituting the optical deflector 81. ON/OFF minimum switching time is determined. As the acousto-optic element (AOM), when the highest response frequency Fss=50MHz is used, the ON state and the OFF state can be made. Each time is 20nS. Furthermore, since the effective scanning period of the drawing light beam LB of one of the reflecting surfaces 97b of the polygon mirror 97 is rotated (the length of the drawing line is LBL), the rotation angle of the one reflecting surface 97b is 1/1 3 degrees, so when the length LBL of the drawing line is set to 30 mm, the decomposition ability R depending on the switching time of the optical deflector 81 is R = LBL / (1/3) / (1/Fms) × (1/Fss) ≒ 3 μm.

From this relationship, in order to enhance the resolution R of the pattern drawing, for example, the acousto-optic element (AOM) of the optical deflector 81 uses the highest response frequency Fss of 100 MHz, and sets the ON/OFF switching time to 10 nsec. According to this, the decomposition ability R becomes 1.5 μm which is half. In this case, the transport speed of the substrate P by the rotation of the rotating cylinder DR is half. As another method of increasing the decomposition ability R, for example, the rotation speed of the rotating polygon mirror 97 can also be increased.

Generally, the photoresist used in the lithography process is a material having a photoresist sensitivity Sr of about 30 mj/cm ² . The transmittance ΔTs of the optical system is 0.5 (50%), the effective scanning period in one of the reflection surfaces 97b of the rotating polygon mirror 97 is 1/3, the length LBL of the drawing line is 30 mm, and the drawing unit UW1 is used. When the Nuw of the UW5 is 5 and the transport speed Vp of the substrate P of the rotating cylinder DR is 5 mm/s (300 mm/min), the laser power Pw required for the light source device CNT can be estimated by the following equation.

Pw=30/60×3×30×5/0.5/(1/3)=1350mW

It is assumed that when the drawing unit is seven, the laser power Pw required by the light source device CNT is as follows.

Pw=30/60×3×30×7/0.5/(1/3)=1890mW

For example, when the photoresist sensitivity is about 80 mj/cm ² , exposure is performed at the same speed, and a light source device CNT having a wavelength of about 3 to 5 W is required as a beam output. In place of the use of such a high-power light source, if the transport speed Vp of the substrate P by the rotation of the rotating cylinder DR is lowered to 30/80 from the initial value of 5 mm/s, the beam output can also be used in the range of 1.4 to 1.9 W. The light source device performs exposure.

Further, if the length LBL of the drawing line is 30 mm, the decomposition power determined by the point diameter Xs of the beam spot light SP and the light of the acousto-optic element (AOM) of the optical deflector 81 (the minimum lattice of the specified beam position) is assumed. (grid), equivalent to 1 pixel) Xg is equal, when both are 3 μm, when the rotation speed of the 10-sided rotating polygon mirror 97 is 10,000 rpm, the rotation time of the rotating polygon mirror 97 is 3/500 second, and the rotation is multi-faceted. When the effective scanning period of one reflecting surface 97b of the mirror 97 is one-third of the rotation angle of one reflecting surface 97b, the effective scanning time Ts (seconds) of one reflecting surface 97b can be (3/500)×( 1/10) × (1/3) is found to be approximately Ts = 1/5000 (seconds). Accordingly, the light source device CNT is a pulse light emission frequency Fz at the time of pulse laser, that is, Fz=LBL/(Ts‧Xs), and Fz=50 MHz is the lowest frequency. Therefore, in the embodiment, it is necessary to output a light source device CNT of a pulse laser having a frequency of 50 MHz or more. In view of this, the light-emitting frequency Fz of the light source device CNT is preferably twice or more (for example, 100 MHz) of the highest response frequency Fss (for example, 50 MHz) of the acousto-optic element (AOM) of the optical deflector 81.

Further, the driving signal for switching the acousto-optic element (AOM) of the optical deflector 81 to the ON state/OFF state is to prevent the acousto-optic element (AOM) from transitioning from the ON state to the OFF state or from the OFF state to the OFF state. The pulse light is generated during the ON state, and it is preferable to perform control for synchronizing the light source device CNT with the clock signal oscillating at the pulse light-emitting frequency Fz.

Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse light-emitting frequency Fz of the light source device CNT is obtained from the beam shape (the intensity distribution of the overlapping two spot lights SP) Point, use the chart of Figure 13 to illustrate. The horizontal axis of Fig. 13 represents the drawing position of the spot light SP in the Y direction along the drawing line or the X direction along the transport direction of the substrate P, or the size of the spot light SP, and the vertical axis represents the peak of the individual spot light SP. The strength is normalized to a relative intensity value of 1.0. Here, the intensity distribution of the individual spot light SP is J1, which is assumed to be a Gaussian distribution.

In Fig. 13, the intensity distribution J1 of the spot light SP alone is set to have a diameter of 3 μm with respect to the intensity of 1/e ² relative to the peak intensity. The intensity distributions J2 to J6 are the simulation results of the integrated intensity distribution (contour) obtained on the substrate P when the two pulses of the spot light SP are divided into the main scanning direction or the sub-scanning direction. Make the position offset (distance distance) different.

In the graph of Fig. 13, the intensity distribution J5 shows the case where the spot light SP of the two-pulse point is shifted by the same distance as the diameter of 3 μm, and the intensity distribution J4 is the case where the distance of the spot light SP of the two pulse points is 2.25 μm, and the intensity The distribution J3 is a case where the distance between the spot lights SP of 2 pulses is 1.5 μm. As a result of the change in the intensity distribution J3 to J5, it is apparent that in the case where the intensity distribution J5 and the spot light SP having a diameter of 3 μm are irradiated at intervals of 3 μm, the contour of the integrated projection is the highest in the center position of each of the two spot lights. At the midpoint of the two spotlights, the normalized intensity can only be obtained to a degree of 0.3. On the other hand, the outline of the spot light SP having a diameter of 3 μm at a time of irradiation at intervals of 1.5 μm is substantially in a knob-like distribution in the outline, and the position of the point between the two spot lights is substantially flat.

Further, in Fig. 13, the intensity distribution J2 shows the integrated contour when the distance between the two pulse points SP is set to 0.75 μm, and the intensity distribution J6 sets the separation distance to the half of the intensity distribution J1 of the individual spot light SP. The integrated contour at full width (FWHM) of 1.78 μm.

As described above, at intervals of the same interval of the diameter Xs of the spot light SP When the CXs are irradiated with the pulse oscillation of two spotlights, it is easy to cause two knob-like distributions. Therefore, it is preferable to set the optimum separation distance without unevenness in intensity (deterioration of drawing accuracy) during exposure. . As in the intensity distribution J3 or J6 of Fig. 13, it is preferable to overlap the distance CXs by a half (for example, 40 to 60%) of the diameter Xs of the single spot light SP. The optimum separation distance CXs is in the main scanning direction by adjusting the pulse illumination frequency Fz of the light source device CNT, the scanning speed of the spot light SP along the drawing line, or the scanning time Ts (rotation speed of the rotating polygon mirror 97). At least one of them is set in the sub-scanning direction by setting at least one of the scanning frequency Fms (rotation speed of the rotating polygon mirror 97) of the drawing line and the X-direction moving speed of the substrate P.

For example, when the absolute value of the rotational speed of the rotating polygon mirror 97 (the scanning time Ts of the spot light) cannot be adjusted with high precision, the spot light of the main scanning direction can be adjusted by finely adjusting the pulse light-emitting frequency Fz of the light source device CNT. The ratio of the distance G between the SP and the diameter Xs (size) of the spot light is adjusted to the optimum range.

As described above, when the two spot lights SP are superimposed in the scanning direction, that is, when Xs>CXs, the light source device CNT sets the pulse light-emitting frequency Fz to the relationship of Fz>LBL/(Ts‧Xs), and satisfies The relationship between Fz=LBL/(Ts‧CXs). For example, when the pulse light-emitting frequency Fz of the light source device CNT is 100 MHz, when the rotating polygon mirror 97 is 10 faces and rotated at 10,000 rpm, the effect of the spot light specified by 1/e ² or half-value full width (FWHM) is set. The diameter Xs is 3 μm, and the pulsed laser beam (dot light) from each of the drawing units UW1 to UW5 can be irradiated on the respective drawing lines LL1 to LL5 at intervals of 1.5 μm (CXs) of about half of the diameter Xs. According to this, the uniformity of the exposure amount at the time of pattern drawing is improved, and even a fine pattern can obtain a faithful exposure image (photoresist image) based on the drawing data, and high-precision drawing can be achieved.

Further, the decomposition ability (the highest response frequency Fss) determined by the optical switching speed of the acousto-optic element (AOM) and the pulse oscillation frequency Fz of the light source device CNT, if h is an arbitrary integer, must be converted to position or time. The relationship of integer multiples, that is, the relationship of Fz=h‧Fss. This is because ON/OFF is performed among the pulse beams emitted from the light source device CNT in order to avoid the light switching timing of the acousto-optic element (AOM).

In the exposure apparatus EX of the first embodiment, since the light source device CNT of the pulsed laser light source combining the optical fiber amplifiers EB1 and FB2 and the wavelength conversion element of the wavelength conversion unit CU2 is used, the ultraviolet wavelength band (400 to 300 nm) is used. Such pulsed light having a high oscillation frequency is easily obtained.

Next, a method of adjusting the drawing device 11 of the exposure device EX will be described. Fig. 14 is a flow chart showing a method of adjusting the exposure apparatus of the first embodiment. Fig. 15 is an explanatory view showing the relationship between the reference pattern of the rotating cylinder and the drawing line in a schematic manner. Fig. 16 is an explanatory view showing, in a schematic manner, a signal output from a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a bright field. The control unit 16 performs calibration for grasping the positional relationship of the plurality of drawing units UW1 to UW5, and rotates the rotating cylinder DR as shown in Fig. 15 . The rotating cylinder DR can transport the substrate P having a light transmissive degree to which the light beam LB can penetrate.

As described above, the reference pattern RMP is integrated with the outer peripheral surface of the rotating cylinder DR. As shown in FIG. 15, among the reference patterns RMP, any of the reference patterns RMP1 moves in accordance with the movement of the outer peripheral surface of the rotating cylinder DR. Therefore, the reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5, and then passes through the lines LL2 and LL4. For example, when the same reference pattern RMP1 passes through the drawing lines LL1, LL3, and LL5, the control unit 16 scans the drawing light beams LB of the drawing units UW1, UW3, and UW5. The control unit 16 causes the drawing after the same reference pattern RMP1 passes through the drawing lines LL2 and LL4. The drawing beam LB of the drawing units UW2, UW4 is scanned (step S1). Therefore, the reference pattern RMP1 serves as a reference for grasping the positional relationship between the drawing units UW1 to UW5.

The photodetector 31Cs (Fig. 4) of the calibration detecting system 31 transmits the reflected light from the reference pattern RMP1 through the scanning optical system including the f-θ lens system 85 and the scanner 83. The photodetector 31Cs is connected to the control unit 16, and the control unit 16 detects the detection signal of the photodetector 31Cs (step S2). For example, the drawing units UW1 to UW5 draw one line LL1 to LL5, and scan each of the plurality of drawing light beams LB in a predetermined scanning direction.

For example, as shown in FIG. 16 , the drawing units UW1 to UW5 draw the length LBL of the drawing line from the drawing start position OC1 in the direction (Y direction) of the rotation center line AX2 of the rotation cylinder DR (see The first line of Fig. 12) scans SC1. Next, the drawing units UW1 to UW5 perform the second length LBL (see FIG. 12) of the drawing line in the direction (Y direction) along the rotation center line AX2 of the rotation cylinder DR from the drawing start position OC1 from the drawing start position OC1. Line scan SC2. Next, the drawing units UW1 to UW5 draw the drawing light beam LB from the drawing start position OC1 in the direction (Y direction) of the rotation center line AX2 of the rotation cylinder DR to the third line length LBL (see FIG. 12). Line scan SC3.

Since the rotating cylinder DR is rotated about the rotation center line AX2, the first row scanning SC1, the second row scanning SC2, and the third row scanning SC3 are in the X direction position on the reference pattern RMP1, and there is a difference between ΔP1 and ΔP2. . Further, the control unit 16 may perform scanning of the drawing light beam LB along the first line scanning SC1 while the rotating cylinder DR is stationary, and then may perform stationary after the rotating cylinder DR is rotated by ΔP1. The scanning of the drawing light beam LB of the SC2 is scanned along the second line, and then the rotating cylinder DR is rotated by ΔP2 and then stopped, and the scanning of the drawing light beam LB along the third line scanning SC3 is performed, and the respective units are operated in this order.

As described above, the reference pattern RMP is set so that the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other on the outer circumferential surface of the rotating cylinder DR are smaller than the length LBL of the drawing line. Therefore, when the drawing light beam LB of the first line scanning SC1, the second line scanning SC2, and the third line scanning SC3 is projected, the drawing light beam LB is irradiated at least to the intersection portions Cr1 and Cr2. The line patterns RL1, RL2 are formed on the surface of the rotating cylinder DR by irregularities. When the step difference of the unevenness on the surface of the rotating cylinder DR is made to a specific condition, the reflected light generated by the drawing light beam LB projected on the line patterns RL1 and RL2 partially produces a difference in reflection intensity. For example, as shown in FIG. 16, when the line patterns RL1, RL2 are the concave portions of the surface of the cylinder DR, when the drawing light beam LB is projected on the line patterns RL1, RL2, the reflected light reflected by the line patterns RL1, RL2 is the photo-inductor. The detector 31Cs receives light in a bright field.

The control unit 16 detects the edge position psc1 of the reference pattern RMP based on the output signal from the photodetector 31Cs. For example, the control unit 16 stores the intermediate value mpsc1 of the first line scanning position data Dsc1 and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photodetector 31Cs when the SC1 is scanned in the first row.

Next, the control unit 16 stores the intermediate value mpsc1 of the second line scanning position data Dsc2 and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photodetector 31Cs when the SC2 is scanned in the second line. Further, the control unit 16 stores the intermediate value mpsc1 of the third-line scanning position data Dsc3 and the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photo-detector 31Cs when the SC3 is scanned in the third row.

The control unit 16 crosses the intermediate value mpsc1 between the first line scanning position data Dsc1, the second line scanning position data Dsc2 and the third line scanning position data Dsc3, and the edge position psc1 of the plurality of reference patterns RMP by calculation. The intersection of 2 line patterns RL1 and RL2 The coordinate position of the points Cr1 and Cr2. As a result, the control unit 16 can calculate the relationship between the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1. Similarly to the other drawing units UW2 to 5, the control unit 16 can calculate the relationship between the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5 (see FIG. 11). Further, the intermediate value mpsc1 can also be obtained from the peak value of the signal output from the photodetector 31Cs.

The above description is directed to the case where the reflected light reflected by the line patterns RL1, RL2 is received by the photo-inductor 31Cs in the bright field, but the photo-inductor 31Cs may also reflect the reflected light in the line patterns RL1, RL2 in the dark. The field of view is exposed to light. Fig. 17 is an explanatory view showing, in a schematic manner, a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a dark field. Fig. 18 is an explanatory view showing, in a schematic manner, a signal output from a photodetector that receives reflected light from a reference pattern of a rotating cylinder in a dark field. As shown in FIG. 17, the calibration detecting system 31 is provided with a light blocking member 31f having an endless belt-shaped light transmitting portion between the relay lens 94 and the photodetector 31Cs. Therefore, the photodetector 31Cs is received by the edge scattered light or diffracted light reflected by the line patterns RL1, RL2. For example, as shown in FIG. 18, when the line patterns RL1, RL2 are the concave portions of the surface of the cylinder DR, when the drawing light beam LB is projected on the line patterns RL1, RL2, the photodetector 31Cs is reflected by the line patterns RL1, RL2. The reflected light is received by the dark field.

The control unit 16 detects the edge position pscd1 of the reference pattern RMP based on the signal output from the photodetector 31Cs. For example, the control unit 16 stores the intermediate value mpscd1 of the first line scanning position data Dsc1 and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photodetector 31Cs when the SC1 is scanned in the first row. Next, the control unit 16 stores the second line scanning position data Dsc2 based on the output signal obtained from the photodetector 31Cs when the SC2 is scanned in the second row. The intermediate value mpscd1 with the edge position pscd1 of the reference pattern RMP. The control unit 16 stores the intermediate value mpscd1 of the third line scanning position data Dsc3 and the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photodetector 31Cs when the SC3 is scanned in the third row.

The control unit 16 crosses the scan position data Dsc1, the second line scan position data Dsc2 and the third line scan position data Dsc3, and the intermediate value mpscd1 of the edge positions pscd1 of the plurality of reference patterns RMP through the calculation to find each other. The intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 calculates the relationship between the coordinate position of the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1 by calculation.

Similarly to the other drawing units UW2 to 5, the control unit 16 can calculate the relationship between the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5. As described above, when the reflected light reflected by the line patterns RL1, RL2 is received by the photodetector 31Cs in the dark field, the accuracy of the edge position pscd1 of the plurality of reference patterns RMP can be improved.

As shown in FIG. 14, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other from the detection signal detected in step S2 (step S3). Fig. 19 is an explanatory view showing the positional relationship between the reference patterns of the rotary cylinders in a schematic manner. Fig. 20 is an explanatory view showing a relative positional relationship of a plurality of drawing lines in a schematic manner. As described above, the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged, as shown in FIG. 19, the first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5. Each of the detected reference distances PL between the intersection portions Cr1 is stored in advance in the control unit 16. Similarly, the reference distance PL between the detected intersection portions Cr1 is also stored in advance in the control unit 16 for each of the second drawing line LL2 and the fourth drawing line LL4. Again, the second drawing line Each of the LL2 and the third drawing line LL3, the reference distance ΔPL between the detected intersections Cr1 is also stored in advance in the control unit 16. Further, the reference distance ΔPL between the detected intersection portions Cr1 is also stored in advance in the control unit 16 for each of the fourth drawing line LL4 and the fifth drawing line LL5.

For example, as shown in FIG. 20, the control unit 16 grasps the positional relationship based on the signal from the origin detector 98 (see FIG. 7) in the drawing start position OC1 of the first drawing line LL1, so that the intersection portion Cr1 can be obtained. The distance BL1 from the drawing start position OC1. Further, since the control unit 16 has detected the position by the origin detector 98 in the drawing start position OC3 of the third drawing line LL3, the distance BL3 between the intersection portion Cr1 and the drawing start position OC3 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3, and the reference distance PL, and store the origin between the origins of the drawing light beams LB scanned along the drawing lines LL1, LL3. The distance ΔOC13. Similarly, since the control unit 16 has detected the position by the origin detector 98 with respect to the drawing start position OC5 of the fifth drawing line LL5, the distance BL5 between the intersection portion Cr1 and the drawing start position OC5 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5, and the reference distance PL, and store the origin between the origins of the drawing light beams LB scanned along the drawing lines LL3 and LL5. The distance between the △ OC35.

Since the control unit 16 has detected the position by the origin detector 98 in the drawing start position OC2 of the second drawing line LL2, the distance BL2 between the intersection portion Cr1 and the drawing start position OC2 can be obtained. Further, since the control unit 16 has detected the position by the origin detector 98 in the drawing start position OC4 of the fourth drawing line LL4, the distance BL4 between the intersection portion Cr1 and the drawing start position OC4 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and store the along the drawing lines LL2, LL4. The origin distance ΔOC24 between the origins of the scanned drawing light beam LB.

Further, since the drawing start position OC1 and the drawing start position OC2 are transmitted through the same reference pattern RMP1, the control unit 16 can easily store the original between the origins of the drawing light beams LB scanned along the drawing lines LL1 and LL2. The distance between points is ΔOC12. As described above, the exposure apparatus EX can determine the positional relationship between the origins (drawing start points) of the plurality of drawing units UW1 to UW5.

Further, the control unit 16 can detect the engagement error between the drawing start position OC2 and the drawing start position OC3 from the reference distance ΔPL between the intersections Cr1 detected by the second drawing line LL2 and the third drawing line LL3. Further, the joint error between the drawing start position OC4 and the drawing start position OC5 can be detected from the reference distance ΔPL between the intersection portion Cr1 detected by the fourth drawing line LL4 and the fifth drawing line LL5.

The two intersection portions Cr1 and Cr2 are detected during the period from the drawing start positions OC1 to OC5 of the respective drawing lines LL1 to LL5 to the drawing end positions EC1 to EC5. Accordingly, the scanning direction from the drawing start positions OC1 to OC5 to the drawing end positions EC1 to EC5 can be detected. As a result, the control unit 16 can detect the angular error of each of the drawing lines LL1 to LL5 with respect to the direction (Y direction) along the center line AX2.

The control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other with respect to the reference pattern RMP1. The reference pattern RMP including the reference pattern RMP1 is a grid-like reference pattern which is repeatedly engraved at regular intervals (periods) Pf1 and Pf2. Therefore, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state or the arrangement error of the plurality of drawing lines LL1 to LL5 with respect to the reference pattern RMP repeated at the respective pitches Pf1 and Pf2, and calculates and complexes the drawing lines. Relative position of LL1~LL5 Information related to deviations. As a result, the control unit 16 can further improve the accuracy of the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other.

Next, as shown in FIG. 14, the control unit 16 performs a process of adjusting the drawing state (step S4). The control unit 16 adjusts information (calibration information) corresponding to the arrangement state or the arrangement error of the plurality of drawing lines LL1 to LL5 and the scale portion (rotary cylinder DR) GPa, GPb detected by the encoder heads EN1 and EN2. At the position of the rotation angle, the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are adjusted. The encoder read heads EN1 and EN2 can detect the conveyance amount of the substrate P based on the scale portions (rotary cylinders DR) GPa and GPb.

Fig. 21 is an explanatory view showing, in a schematic manner, the relationship between the moving distance per unit time of the substrate and the number of drawing lines included in the moving distance, similarly to the previous Fig. 12. As shown in FIG. 21, the encoder read heads EN1, EN2 can detect and store the moving distance ΔX per unit time of the substrate P. Further, the plurality of alignment marks Ks1 to Ks3 may be sequentially detected by the alignment microscopes AM1 and AM2 to obtain and store the movement distance ΔX.

The moving distance ΔX per unit time of the substrate P, the plurality of drawing lines LL1 drawn by the drawing unit UW1 are drawn by the beam lines SPL1, SPL2 and SPL3 of the beam spot light SP, with the spot diameter Xs of the respective beam spot lights SP About 1/2 is scanned in such a manner that the X direction (and the Y direction) overlap. Similarly, the beam spot light SP on the drawing terminal PTb side of the drawing line LL1 and the beam spot light SP on the drawing terminal PTb side of the drawing line LL2 are overlapped in the width direction of the substrate P as the substrate P moves in the strip direction. Engaged by the CXs.

For example, when the rotating cylinder DR moves up and down, the X-direction drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are shifted, and there is a possibility that, for example, a magnification difference in the X direction is generated. The control unit 16 causes the transport speed (moving speed) of the substrate P transported by the rotating cylinder DR to be slow. When the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 is small, the drawing magnification in the X direction can be adjusted to be small. On the other hand, when the transport speed (moving speed) of the substrate P transported by the rotating cylinder DR is increased, the X-direction distance CXs of the beam lines SPL1, SPL2, and SPL3 becomes larger, and the drawing magnification in the X direction can be adjusted to be larger. The above description has been made with reference to FIG. 21 for the drawing line LL1, and the same applies to the other drawing lines LL2 to LL5. The control unit 16 adjusts information (calibration information) corresponding to the arrangement state or the arrangement error of the plurality of drawing lines LL1 to LL5 and the scale portion (rotary cylinder DR) GPa, GPb detected by the encoder heads EN1 and EN2. The rotation angle position changes the relationship between the movement distance ΔX per unit time of the substrate P in the longitudinal direction of the substrate P and the number of the beam lines SPL1, SPL2, and SPL3 included in the movement distance. Therefore, the control unit 16 can adjust the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 in the X direction.

Fig. 22 is an explanatory view showing, in a schematic manner, pulse light of a system clock synchronized with a pulse light source. Hereinafter, the drawing line LL2 will be described with reference to FIG. 21, and the drawing lines LL1, LL3 to LL5 are also the same. The light source device CNT can strike the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval Δwp (=1/Fz) of the pulse signal wp also changes. The temporal pulse interval Δwp is plotted on the drawing line LL2 by the distance CXs of the main scanning direction of the spot light SP for each pulse. The control unit 16 causes the beam spot light SP of the drawing light beam LB to scan the length LBL of the drawing line along the drawing line LL2 on the substrate P.

The control unit 16 has a function of changing the period of the system clock SQ in the period in which the drawing light beam LB is scanned along the drawing line LL2, so that the pulse interval Δwp is reduced at any position in the drawing line LL2. For example, when the original system clock SQ is 100 MHz, the control unit 16 has a certain time interval (period) during the scanning of the length LBL of the drawing line. The system clock SQ is changed to, for example, 101 MHz (or 99 MHz). As a result, the number of beam spot lights SP at the length LBL of the drawing line is reduced. In other words, the control unit 16 reduces the operating ratio of the system clock SQ at a predetermined interval (1 or more) during the scanning of the length LBL of the drawing line. Accordingly, the interval between the beam spot lights SP generated by the light source CNT, that is, the variation of the variation pulse interval Δwp, and the overlapping distance CXs of the beam spot lights SP change. The distance between the beginning end PTa of the Y direction and the drawing terminal PTb seems to be stretched.

For example, when the length LBL of the drawing line is 30 mm, 11 is equally divided, and the drawing interval (cycle interval) of about 3 mm is reduced by only the pulse interval Δwp of the system clock SQ at one position. The amount of decrease in the pulse interval Δwp, as illustrated in Fig. 13, will not cause a large range of the integrated contour (intensity distribution) which varies with the distance CXs between adjacent two spot lights SP, for example, the reference When the interval distance CSx is 50% of the diameter Xs (3 μm) of the spot light, it is set to be about ±15%. If the pulse interval Δwp is reduced to +10% (the spacing distance CSx is 60% of the diameter Xs of the spot light), a pulse of 1 pulse is scattered everywhere in the drawing line of the length LBL. A positional shift of 10% of the diameter Xs extending in the main scanning direction is generated. As a result, the length LBL of the drawing line after drawing is extended by 3 μm with respect to 30 mm. This represents that the pattern drawn on the substrate P is enlarged by 0.01% (100 ppm) in the Y direction. According to this, even when the substrate P is expanded and contracted in the Y direction, the drawing pattern can be stretched and contracted in the Y direction.

The position of the pulse interval Δwp is increased or decreased, for example, to be able to scan one line of the lines LL1 to LL5, for example, every 100 pulses, every 200 pulses, ‧ ‧ of the system clock SQ Composition. In this way, the amount of expansion and contraction in the main scanning direction (Y direction) of the drawing pattern can be changed over a relatively large range, and the substrate P can be dynamically moved in accordance with expansion and contraction and deformation. Magnification correction. Therefore, the control unit 16 of the exposure apparatus EX of the present embodiment includes a system clock generation circuit SQ having a pulse interval Δwp with a predetermined original clock signal as a clock oscillating portion generated by the system clock SQ. And a time shifting unit that reduces the time of the next clock pulse of the system clock SQ by inputting the pulse number of the original clock signal count (count) to the pulse interval Δwp. Further, in the drawing line (length LBL), the number of portions in which the pulse interval Δwp of the system clock SQ is reduced is roughly determined depending on the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn, and at the minimum, It is at least one of the scanning time Ts of the spot light SP corresponding to the length LBL.

Further, the pulse beam outputted from the pulse laser light source device CNT in response to the system clock SQ whose pulse interval Δwp is partially reduced is supplied to each of the drawing units UW1 to UW5 in common, and therefore, the line LL1 is drawn. Each of the patterns depicted by LL5 will expand and contract at the same ratio in the Y direction. Therefore, as shown in FIG. 12 (or FIG. 11), in order to maintain the bonding precision between the drawing lines adjacent in the Y direction, the drawing timing is corrected so that the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are ( Or the drawing end position EC1~EC5) moves in the Y direction. Furthermore, the ON/OFF switching of the optical deflector (AQM) 81 shown in FIG. 4 is performed in response to the serialized bit string (arrangement of the bit value “0” or “1”) which is sent as the drawing data. The bit value is sent out in synchronization with the pulse signal wp (Fig. 22) of the system clock SQ whose pulse interval Δwp is partially reduced. Specifically, during the period in which one pulse signal wp is generated to generate the next pulse signal wp, one bit value is sent to the driving circuit of the optical deflector (AOM) 81, and the sweetness value is "1". When the first bit value is "0", the optical deflector (AOM) 81 may be switched from the OFF state to the ON state.

The control unit 16 can be configured according to the configuration state of the plurality of drawing lines LL1 to LL5 Or the adjustment information of each other's configuration error (calibration information) and the information detected by the displacement gauges YN1, YN2, YN3, YN4 which can detect the offset between the two ends of the rotating cylinder DR, and adjust the unit with odd and even numbers The UW1 to UW5 are drawn in the Y direction to offset the Y-direction error caused by the rotational offset of the rotating cylinder DR. Further, the control unit 16 can adjust the information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other, and the displacement meter YN1 which can detect the offset between the both ends of the rotating cylinder DR. The information detected by YN2, YN3, and YN4 is changed by the length of the Y direction (the length of the drawing line LBL) by the odd-numbered and even-numbered drawing units UW1 to UW5 to offset the rotation offset caused by the rotating cylinder DR. The error in the Y direction.

Further, the control unit 16 can adjust the odd-numbered and even-numbered numbers according to the arrangement state of the plurality of drawing lines LL1 to LL5 or the adjustment information of the arrangement errors (calibration information) and the information detected by the alignment microscopes AM1 and AM2. The drawing positions in the X direction or the Y direction by the drawing units UW1 to UW5 are used to offset the error in the X direction or the Y direction of the substrate P.

The exposure apparatus EX according to the first embodiment includes the drawing light beams LB from the plurality of drawing units UW1 to UW5 as described above, and includes predetermined points in the drawing plane of the plurality of drawing lines LL1 to LL5 formed on the substrate P. The rotation axis I is a center, and the movement mechanism 24 as a displacement correction mechanism that displaces the second optical table 25 with respect to the first optical stage 23 in the drawing plane. When the entire plurality of drawing lines LL1 to LL5 have errors in at least one of the X direction and the Y direction, corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the adjustment information (calibration information) of the arrangement errors of the plurality of drawing lines LL1 to LL5, The control unit 16 can drive and control the driving unit of the moving mechanism 24 to shift the second optical table 25 to at least one of the X direction and the Y direction to cancel the offset amount of the error.

When the second optical table 25 is displaced in at least one of the X direction and the Y direction, the fourth mirror 59 shown in FIG. 6 is displaced in the X direction or the Y direction. In particular, the fourth mirror 59 is displaced in the Y direction, and when the drawing light beam LB from the third mirror 58 is reflected in the +Y direction, it is displaced in the Z direction. Therefore, the displacement in the Z direction is corrected by the beam displacement mechanism 44 in the first optical system 41. As a result, the second optical system 42 and the third optical system 43 after the fourth reflecting mirror 59 can maintain the light beam LB through the correct optical path.

Further, in the exposure apparatus EX of the first embodiment, the plurality of drawing lines LL1 to LL5 are aligned in the X direction by the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other. When there is an error in at least one of the Y directions, the control unit 16 can drive and control the driving unit of the moving mechanism 24 to slightly shift the drawing lines LL1 to LL5 formed on the substrate P in the X direction or the Y direction. The amount of displacement.

Further, in the exposure apparatus EX of the first embodiment, the odd number of the plurality of drawing lines LL1 to LL5 is determined by the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other. When the even-numbered drawing line has an error in at least one of the X direction and the Y direction, the control unit 16 can drive-control the beam displacement mechanism 45 so as to cancel the displacement amount of the error so as to form an even number on the substrate P. The number drawing lines LL2, LL4 are slightly moved in the X direction or the Y direction to finely adjust the relative positional relationship with the odd-numbered drawing lines LL1, LL3, LL5 formed on the substrate P.

Moreover, the control unit 16 may also adjust information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other, and the displacement meter YN1, YN2, YN3, YN4 or the alignment microscope AM1. The information of the AM2 detection adjusts the Y magnification of the drawing units UW1 to UW5. For example, the image height of the telecentric f-theta lens contained in the f-theta lens system 85 is proportional to the angle of incidence. Therefore, only the Y magnification of the drawing unit UW1 is adjusted. The control unit 16 can individually adjust the focus distance f of the f-θ lens system 85 according to the adjustment information (calibration information) and the information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscopes AM1, AM2. According to the adjustment of Y rate. In the adjustment mechanism, for example, a bending plate for magnification correction, a magnification correction mechanism for a telecentric f-θ lens, and a halving for tilt adjustment may be combined. Any one of them. Further, the rotational speed of the rotating polygon mirror 97 rotated at a certain rotational speed can be slightly changed, so that the distance CXs of the spot lights SP (pulse light) drawn in synchronization with the system clock SQ can be slightly changed (to be adjacent) The amount of overlap of the spot lights is slightly staggered), and the Y-rate can also be adjusted as a result.

The exposure apparatus EX according to the first embodiment includes the drawing light beams LB from the plurality of drawing units UW1 to UW5 as described above, and includes predetermined points in the drawing plane of the plurality of drawing lines LL1 to LL5 formed on the substrate P. The rotation axis I is a center, and the movement mechanism 24 as a displacement correction mechanism that displaces the second optical table 25 with respect to the first optical stage 23 in the drawing plane. The plurality of drawing lines LL1 to LL5 have an angular error with respect to the Y direction due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other, and the control unit 16 can be used for the moving mechanism 24 The drive unit performs drive control to rotate the second optical table 25 to offset the amount of rotation of the angular error.

Further, when it is necessary to perform rotation correction for each of the drawing units UW1 to UW5, the f-θ lens system 85 and the second cylindrical lens 86 shown in FIG. 8 can be slightly rotated about the optical axis AXf. The respective drawing lines LL1 to LL5 are individually rotated (tilted) on the substrate P by a slight amount. The light beam LB scanned by the rotating polygon mirror 97 is imaged (concentrated) along the bus bar of the cylindrical lens 86 in the non-scanning direction, so that the drawing line LL1 can be rotated by the cylindrical lens 86 about the optical axis AXf. ~LL5 rotates (tilt).

The exposure apparatus EX of the first embodiment may be processed by at least one of the processing of the drawing position adjustment by the control device of the above-described step S4. Further, in the exposure apparatus EX of the first embodiment, the processing of the drawing position adjustment performed by the control device of the above-described step S4 may be combined to perform processing.

According to the method of adjusting the substrate processing apparatus described above, in the exposure apparatus EX of the first embodiment, it is possible to omit (not need to) prevent the patterns PT1 to PT5 adjacent to each other in the width direction (Y direction) of the substrate P from each other. Test exposure for joint errors, or significantly reduce the number of times. Therefore, in the exposure apparatus EX of the first embodiment, it is possible to shorten the time required for the calibration operation such as the test exposure, the drying and development process, and the confirmation of the exposure result. Further, in the exposure apparatus EX of the first embodiment, it is possible to suppress the waste of the substrate P by the number of times of feedback due to the test exposure. In the exposure apparatus EX of the first embodiment, adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other can be obtained earlier. The exposure apparatus EX according to the first embodiment can be corrected in advance based on the arrangement state (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other, and can be easily corrected in the X direction or the Y direction. The components of displacement, rotation, and magnification. Further, in the exposure apparatus EX of the first embodiment, the precision of overlapping exposure on the substrate P can be improved.

In the exposure apparatus EX of the first embodiment, the optical deflector 81 includes an acousto-optic element, and the scanning of the drawing beam LB by the rotating polygon mirror 97 is described as an example. However, in addition to the dot scanning, It is a method of drawing a pattern using a DMD (Digital Micro Mirror Device) or an SLM (Spatial Light Modulator).

[Second Embodiment]

Next, an exposure apparatus EX according to the second embodiment will be described. In the second embodiment, the description of the first embodiment is repeated, and only the differences from the first embodiment will be described, and the same components as those of the first embodiment will be assigned to the first embodiment. The same symbols are used to illustrate.

In the exposure apparatus EX of the second embodiment, the photodetector 31Cs of the calibration detecting system 31 does not detect the reference pattern (may also be used as a reference mark) but detects the reflected light of the alignment marks Ks1 to Ks3 on the substrate P. (Scattered light). The alignment marks Ks1 to Ks3 are arranged at positions on the substrate P in the Y direction passing through any one of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5. When the spot light SP of the drawing light beam LB is scanned to the alignment marks Ks1 to Ks3, the scattered light reflected by the alignment marks Ks1 to Ks3 is received by the photodetector 31Cs in the bright field or the dark field.

The control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on the signals output from the photodetector 31Cs. In the same manner as in the first embodiment, the control unit 16 can obtain adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other from the detection signal detected by the photodetector 31Cs. .

Further, the control unit 16 can adjust the odd-numbered and even-numbered drawing based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other and the information detected by the alignment microscopes AM1 and AM2. The drawing positions of the units UW1 to UW5 in the X direction or the Y direction cancel the errors in the X direction or the Y direction of the substrate P. When the spot light SP of the drawing light beam LB is projected on the alignment marks Ks1 to Ks3, the photosensitive layer on the alignment marks Ks1 to Ks3 is light-sensitive, and it is possible that the alignment marks Ks1 to Ks3 are broken in the subsequent process. Therefore, it is preferable to set the complex line alignment marks Ks1 to Ks3, and the alignment microscopes AM1 and AM2 are not broken due to exposure. The alignment marks Ks1~Ks3.

Therefore, the exposure apparatus EX of the second embodiment can be included in the pattern drawing material, and the spot light SP of the drawing light beam LB can be scanned near the alignment marks Ks1 to Ks3 of the exposure collapse, and is not expected to be broken by the exposure. In the vicinity of the alignment marks Ks1 to Ks3, the information of the ON/OFF of the optical deflector (AOM) 81 is performed so that the spot light SP does not illuminate. According to this, it is possible to obtain the calibration information substantially instantaneously while performing the exposure by the drawing light beam LB, and it is also possible to read the alignment marks Ks1 to Ks3 (the position of the substrate P).

In the exposure apparatus EX of the second embodiment, similarly to the exposure apparatus EX of the first embodiment, the test exposure for suppressing the joint error can be omitted or the number of times can be greatly reduced. In addition, in the exposure apparatus EX of the second embodiment, it is possible to measure the error information of the arrangement state or the arrangement relationship of the plurality of drawing lines LL1 to LL5 at the same time as the exposure pattern of the substrate P, as early as possible (substantially ) Obtain adjustment information (calibration information) corresponding to it. Therefore, the exposure apparatus EX of the second embodiment can perform the correction of the element pattern while performing the exposure and the information (calibration information) of the early measurement, and can perform the correction and adjustment of the predetermined accuracy one by one, and can be easily performed. It is suppressed that the difference in the joint precision between the drawing units of the error components such as the displacement error, the rotation error, and the magnification error in the X-direction or the Y-direction is a problem in the multi-drawing method. According to the exposure apparatus EX of the second embodiment, the superimposition accuracy at the time of superimposing and exposing the substrate P can be maintained at a high state.

<Component Manufacturing Method>

Next, a method of manufacturing a component will be described with reference to Fig. 23 . Fig. 23 is a flow chart showing a method of manufacturing a component of each embodiment.

The component manufacturing method shown in FIG. 23 is first performed, for example, using an organic EL. The function and performance design of the display panel formed by the self-luminous element are designed, and the required circuit pattern and wiring pattern are designed by CAD or the like (step S201). A supply roll for winding a flexible substrate P (a resin film, a metal foil film, a plastic, or the like) as a base material of the display panel is prepared (step S202). Further, the rolled substrate P prepared in the step 8202 may be a surface whose surface is modified as necessary, or a bottom layer (for example, a fine unevenness by an imprint method) formed in advance, or a layer of light accumulated in advance. Inductive functional film or transparent film (insulating material)

Then, a substrate layer constituting the display panel element such as an electrode or a wiring, an insulating film, a TFT (Thin Film Semiconductor), or the like is formed on the substrate P, and a light-emitting layer made of a self-luminous element such as an organic EL is formed on the substrate. (Display pixel portion) (step S203). In the step S203, the exposure apparatus EX described in the previous embodiments is also included, and the photoresist layer is exposed to develop a conventional lithography process, and the photoresist is coated with a photosensitive decane coupling agent. The substrate P is subjected to pattern exposure to modify the surface to a water-repellent water-based exposure process, and the photo-sensitive catalyst layer is subjected to pattern exposure to impart selective plating reproducibility and formed by electroless plating. A wet process of a metal film pattern (wiring, electrodes, etc.) or a printing process such as drawing a pattern of conductive ink containing silver nanoparticles or the like.

Next, the substrate P is cut for each display panel element continuously manufactured on the long substrate P by a roll, or a protective film (environmentally resistant barrier layer) or a color filter film is bonded to the surface of each display panel element, The components are assembled (step S204). Next, an inspection step of whether the display panel element can be normally operated or whether the desired performance and characteristics are satisfied is performed (step S205). Through the above manner, a display panel (flexible display) can be manufactured. Further, the electronic component for forming the flexible long strip-shaped substrate is not limited to the display panel, and may be a flexible wiring net for connecting a lead wire (wiring tape) mounted between various electronic components such as an automobile or a train. .

31‧‧‧ Calibration Test System

31Cs‧‧‧Light Inductance Detector

41‧‧‧1st Optical Department

42‧‧‧2nd Optical Department

43‧‧‧3rd Optical Department

44‧‧‧ Beam Displacement Mechanism

45‧‧‧ Beam Displacement Mechanism

51‧‧‧1/2 wavelength plate

52‧‧‧Polarizing mirror (polarizing beam splitter)

53‧‧‧ astigmatizer

54‧‧‧1st mirror

55‧‧‧1st relay lens

56‧‧‧2nd relay lens

57‧‧‧2nd mirror

58‧‧‧3rd mirror

59‧‧‧4th mirror

60‧‧‧1st beam splitter

61‧‧‧5th mirror

62‧‧‧2nd beam splitter

63‧‧‧3rd beam splitter

64‧‧‧6th mirror

71‧‧‧7th mirror

72‧‧‧8th mirror

73‧‧‧4th beam splitter

74‧‧‧9th mirror

81‧‧‧Light deflector

82‧‧‧1/4 wavelength plate

84‧‧‧Bend mirror

85‧‧‧f-θ lens system

86‧‧‧ cylindrical lens

86B‧‧‧Y-rate correction optical member (lens group)

91‧‧‧Relay lens

92‧‧ ‧ visor

93‧‧‧Relay lens

94‧‧‧Relay lens

95‧‧‧ cylindrical lens

97‧‧‧Rotating polygon mirror

97a‧‧‧Rotary axis

97b‧‧‧reflecting surface

AX2‧‧‧Rotating Center Line

CNT‧‧‧ light source device

DR‧‧‧ rotating cylinder

EN1, EN2, EN3, EN4‧‧‧ encoder read head

GPa, GPb‧‧‧ ruler department

I‧‧‧Rotary axis

LB‧‧‧beam

Le1~Le4‧‧‧Set the bearing line

P‧‧‧Substrate

PBS‧‧‧ bias beam splitter

Sf2‧‧‧Axis

SL‧‧‧Differential Optical System

UW1~UW5‧‧‧Drawing unit

Claims (26)

A substrate processing apparatus comprising: a support member having a support surface for supporting a long sheet-like substrate; wherein a reference mark is provided at a plurality of positions on the support surface in a width direction intersecting the longitudinal direction of the substrate; and a conveying device is provided The substrate supported by the support member moves in the longitudinal direction; and the drawing device includes a spot light that can project a light beam to the substrate or the support surface supported by the support surface, and is narrower in a width direction than the substrate width direction. a plurality of drawing units that scan and draw a predetermined pattern along the drawing line obtained by the scanning, and the patterns drawn on the substrate by the respective drawing lines of the plurality of drawing units move in the strip direction with the substrate And a plurality of drawing units are disposed in a width direction of the substrate in a manner of joining the substrates in a width direction; and the reflected light detecting unit is disposed in each of the plurality of drawing units for detecting a spot light of the light beam Projecting a reflected light reflected from a support surface of the support member or the substrate; and measuring means based on the reference mark at the support member Drawing the plurality of individual units when the line drawing portion from the reflected light detection output of the signal, measuring the plurality of strip line arrangement relationship is depicted. The substrate processing apparatus according to claim 1, wherein the support member partially supports the substrate by one of cylindrical outer peripheral surfaces curved at a certain radius from a center line extending in a width direction of the substrate, and by winding the substrate The rotation of the center line rotates the substrate in the direction of the strip. The substrate processing apparatus according to claim 2, wherein the plurality of drawing units are arranged such that one of adjacent drawing units that pattern the patterns bonded to each other on the substrate is an odd number and the other is an even number When the number is drawn, the odd number is drawn by each of the odd numbered lines of the unit, The even-numbered drawing lines of the even-numbered drawing units are located at a predetermined angular interval in the circumferential direction of the outer peripheral surface of the rotating cylinder. The substrate processing apparatus of claim 3, wherein each of the odd-numbered drawing lines is arranged in a row on the substrate so as to be substantially parallel to a rotation center line of the rotating cylinder. Each of the even-numbered drawing lines is arranged in a row in the width direction of the substrate so as to be substantially parallel to the rotation center line of the rotating cylinder on the substrate. The substrate processing apparatus according to any one of claims 2 to 4, further comprising: a scale portion having a scale formed in a circumferential direction of the predetermined radius from the center line, and configured to rotate together with the rotating cylinder And an encoder read head that reads the scale of the scale portion and outputs position information corresponding to the movement amount or the movement position of the substrate; the conveying device is based on the encoding of the substrate in the longitudinal direction The position information output by the head reads the rotating cylinder. The substrate processing apparatus according to claim 5, wherein the measuring device includes a signal output from each of the plurality of drawing units by the reflected light detecting unit when the reference mark of the support member is scanned by the spot of the light beam And a control unit that stores information on the relative positional relationship of the plurality of drawing lines with position information output from the encoder read head. The substrate processing apparatus according to claim 6, wherein the control unit is configured to move the light of the light beam along the drawing line during a period in which the plurality of reference marks move in a circumferential direction of the rotating cylinder The plurality of signals output from the reflected light detecting unit each time the sub-scan is performed, and information related to the deviation of the relative positional relationship between the plurality of drawing lines is calculated. The substrate processing apparatus according to any one of claims 2 to 4, wherein the substrate has a penetrating property to the light beam, and the reflected light detecting portion outputs a spot light directly incident on the support surface of the supporting member a signal corresponding to the reflected light generated by the reference mark or a signal corresponding to the reflected light generated when the light beam penetrates the substrate and irradiated to the reference mark. The substrate processing apparatus according to any one of claims 1 to 6, further comprising: a laser light source for outputting the light beam; each of the plurality of drawing units having a light beam deflected from the laser light source to be scanned a scanning optical system for projecting, and a beam projection optical system for projecting the deflected light beam on the substrate or the supporting surface of the supporting member to condense the spot light; the reflected light detecting portion includes a photodetector for transmitting reflected light from the support surface of the substrate or the support member through the beam projection optical system and the scanning optical system, and the photodetector and the scanning optical system The light splitter in the light path between the two. The substrate processing apparatus of claim 9, wherein the scanning optical system comprises a rotating polygon mirror that deflects a light beam from the laser light source in a direction; the beam projection optical system is provided with the rotating polygon mirror The deflected scan beam is directed to the f-θ lens on the drawing line, and a bus bar disposed between the f-θ lens and the support member having a direction substantially parallel to a direction in which the drawing line extends is orthogonal to the bus bar A cylindrical lens that condenses the beam. The substrate processing apparatus according to any one of claims 2 to 4, wherein each of the plurality of drawing units is provided with a scanning optical system that deflects a light beam from a laser light source into one dimension, and the biasing a scanning beam as a beam projection optical system that projects the beam onto the outer surface of the substrate or the rotating cylinder, and is disposed between the beam projection optical system and the rotating cylinder There is a bus bar that is substantially parallel to the direction in which the drawing line extends and converges the beam in a direction perpendicular to the bus bar. The substrate processing apparatus according to any one of claims 2 to 11, wherein the reference mark is provided at a predetermined interval in a direction in which the center line extends on the outer circumferential surface of the rotating cylinder, the predetermined The interval is set to be smaller than the length of the plurality of lines drawn. The substrate processing apparatus according to claim 12, wherein the reference mark is formed at an intersection of two line patterns which are formed on the outer peripheral surface of the rotating cylinder. The substrate processing apparatus according to any one of claims 2 to 13, wherein the light beam projected from the plurality of drawing units on the substrate or the outer circumferential surface of the rotating cylinder is disposed to face the rotating circle The center line of rotation of the barrel. The substrate processing apparatus according to any one of claims 1 to 8, wherein the reflected light detecting unit is configured to receive the reflected light generated on a support surface of the substrate or the support member in a bright field or a dark field. The photo-inductor detects the edge position of the fiducial mark based on the signal output from the photo-sensing device. The substrate processing apparatus according to claim 7 or 10, wherein the length of the drawing line is LBL, and the scanning time of the light beam at the length LBL is Ts, and the point formed on the drawing line is obtained. When the spot size in the scanning direction is set to Xs, the laser light source has a repeated illuminating light frequency Fz of a pulsed laser light source satisfying Fz ≧ LBL / (Ts ‧ Xs). A device manufacturing method for forming the pattern on the substrate using the substrate processing apparatus according to any one of claims 1 to 16. A method of adjusting a substrate processing apparatus, the substrate processing apparatus comprising: a support member having a plurality of discrete or continuous features at a plurality of predetermined positions on the support surface a predetermined reference mark; the conveying device supports a predetermined width of the substrate while supporting the substrate on the support surface of the support member at a predetermined speed in a longitudinal direction intersecting the width direction; a plurality of drawing units for drawing a line drawn by the light beam of the substrate in a width narrower than the width of the substrate, and drawing a predetermined line on the substrate by the plurality of drawing units The patterns drawn on the substrate are joined to each other in the longitudinal direction as the substrate is transferred in the longitudinal direction, and the drawing lines adjacent to each other in the width direction are in the strip direction. a predetermined interval separation arrangement; and a plurality of reflected light detecting portions for detecting reflected light generated from a support surface of the support member by illumination of the light beam from each of the plurality of drawing units; The support member moves relative to the drawing device such that the fiducial mark comes to the drawing line formed by each of the plurality of drawing units And scanning step of scanning the reference mark with the spot light of the light beam; detecting, by the reflected light detecting unit, the reflected light generated from the reference mark by the scanning of the light beam to obtain a detection signal corresponding to the reference mark And obtaining, according to the detection signal, a step of determining adjustment information corresponding to an arrangement state of the plurality of drawing lines or a configuration error of each other; and adjusting a drawing state of the pattern drawn by each of the plurality of drawing units according to the adjustment information. The method for adjusting a substrate processing apparatus according to claim 18, wherein the base The plate processing apparatus further includes a movement measuring mechanism that outputs positional displacement information corresponding to the amount of movement of the support surface of the support member; and the step of obtaining the adjustment information includes the detection signal detected by the detection step, and the The position displacement information output by the movement measuring mechanism calculates a positional relationship or a position error between the drawing lines formed by each of the plurality of drawing units as a calculation step of the adjustment information. The method of adjusting a substrate processing apparatus according to claim 19, wherein the support member of the substrate processing apparatus is a portion of a cylindrical outer peripheral surface that is curved at a radius from a center line extending in a width direction of the substrate. A rotating cylinder that supports the substrate and transports the substrate in the longitudinal direction by rotation about the center line. The method of adjusting a substrate processing apparatus according to claim 20, wherein the reference mark is set at a predetermined interval in a direction in which the center line extends on an outer circumferential surface of the rotating cylinder, and the predetermined interval is set to be relatively The plurality of lines depicting the length of the line is small. The method of adjusting the substrate processing apparatus according to claim 21, wherein the reference mark is formed at an intersection of two line patterns which are formed on the outer peripheral surface of the rotating cylinder. A substrate processing apparatus for performing a main scanning on a substrate along a predetermined drawing line while performing a main scanning on a substrate along a predetermined drawing line, and performing a sub-scanning of the light beam and the substrate in a direction intersecting the drawing line, thereby a predetermined pattern is formed on the substrate, and includes: a support member having a support surface for supporting the substrate; and a transfer device that moves the substrate supported by the support member in a direction of the sub-scan; and a pulsed laser light source as the light beam Outputting a pulsed beam of ultraviolet wavelength band at a repeated illumination frequency Fz; The drawing unit is provided with a modulator that adjusts the intensity according to a pattern of the pulsed light beam from the pulsed laser light source to be drawn on the drawing line, and deflects the light beam modulated by the modulator to scan the one-dimensional scanning optics And a beam projection optical system that projects the deflected light beam onto the substrate; the scan time of the length of the drawing line is LBL, and the spot light of the light beam is scanned by the length LBL is Ts, the point When the size of the light along the direction of the drawing line is Xs, the light-emitting frequency Fz of the pulsed laser light source is set to satisfy the relationship of Fz ≧ LBL / (Ts ‧ Xs). The substrate processing apparatus of claim 23, wherein the pulsed laser light source comprises a stencil and a wavelength conversion element formed of an optical fiber. The substrate processing apparatus of claim 24, wherein the modulator comprises: switching the pulsed beam to a light switching element that enters the scanning optical system and a non-injecting state, and the optical switching element The upper limit modulation frequency is set to an integral multiple relationship with the illumination frequency Fz of the pulsed laser source. The substrate processing apparatus according to any one of claims 23 to 25, wherein the substrate processing apparatus includes a clock signal for giving a frequency Fz to the pulsed laser light source to output the pulsed light beam at the light emission frequency Fz. a clock generation circuit, wherein the clock generation circuit is at a position between the scanning time Ts of the scanning length LBL or a plurality of discrete multiples, so that two consecutive clock pulses in the clock signal are The time interval is reduced relative to the time interval of the clock pulse at the frequency Fz.