JP2013178445A - Exposure device, exposure method, and manufacturing method of display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately detect intensity distribution of a light beam irradiated from a light beam irradiation device.SOLUTION: While moving a measurement instrument 50 that shields a part of a light beam irradiated from a light beam irradiation device 20 in an irradiation region 26a of the light beam irradiated from the light beam irradiation device 20, the light beam irradiated from the light beam irradiation device 20 and a part of which is shielded by the measurement instrument 50 is received, and intensity of the whole received light beam is detected. From a change in the intensity of the whole received light beam in accordance with the movement of the measurement instrument 50, intensity of the light beam shielded by the measurement instrument 50 and its position are detected, and intensity distribution of the light beam is detected. Based on a detection result, variation of the intensity distribution of the light beam is corrected.

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a method for manufacturing a display panel substrate using the same.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported.

  When a pattern is drawn on a substrate with a light beam, a spatial light modulator such as a DMD (Digital Micromirror Device) is used to modulate the light beam. The DMD is configured by arranging a plurality of micro mirrors that reflect the light beam in two directions, and the drive circuit modulates the light beam supplied from the light source by changing the angle of each mirror based on the drawing data. To do. The light beam modulated by the DMD is irradiated onto the substrate from the irradiation optical system of the light beam irradiation apparatus.

  In an irradiation optical system that irradiates a substrate with a spatial light modulator or a light beam modulated by the spatial light modulator, if the light beam is uneven due to the optical characteristics of the optical components, the light beam is irradiated from the light beam irradiation device. The intensity distribution of the light beam is not uniform. Further, if there is a positional shift in the spatial light modulator or the irradiation optical system, the optical path of the light beam is shifted, and the intensity distribution of the diffracted light of the light beam changes. If there is a variation in the intensity distribution of the light beam emitted from the light beam irradiation device, the resolution performance will vary, and the pattern will not be drawn uniformly, and the drawing quality will deteriorate. For this reason, conventionally, a maintenance person manually detects the intensity distribution of the light beam by using a detection device and makes necessary adjustments. However, this operation takes a lot of time and effort.

  On the other hand, in Patent Document 1, a detection device for detecting the intensity of a light beam is attached to a chuck, a slit is provided between the light beam irradiation device and the detection device, and irradiation is performed from the light beam irradiation device using the slit. A technique for easily detecting the intensity distribution of the light beam emitted from the light beam irradiation apparatus by dividing the irradiated region of the light beam into a plurality of inspection regions having the same area is disclosed.

JP2011-237684A

  It is difficult to make the light beam emitted from the light beam irradiation device into a completely parallel light beam, and the light beam emitted from the light beam irradiation device contains components with slightly different angles. Usually, the slit as described in Patent Document 1 is formed by punching a long and narrow hole from a flat plate. At that time, the height of the surface of both end portions of the hole is slightly displaced, and the amount of displacement is the amount of the hole. Since it is not completely the same at both ends, a minute step is generated across the hole. In addition, the slit needs to be installed perpendicular to the optical axis of the light beam, but if the installation is slightly shifted, the angle of the light beam affects the measurement. Therefore, in the conventional method of detecting the intensity distribution of the light beam using the slit, even if the angle of the light beam irradiated to both ends of the hole is slightly different, the amount of the light beam that passes is greatly changed, It was difficult to detect the intensity distribution of the beam with high accuracy.

  Further, in the scanning of the substrate with the light beam, after the scanning is performed once, the substrate or the light beam irradiation device is stepped to the next scanning position to perform the next scanning, and these operations are repeated to repeat the entire substrate. A scan is performed. As described above, when the substrate is scanned a plurality of times by the light beam, if the intensity distribution of the light beam varies in the direction orthogonal to the scanning direction of the substrate by the light beam, the left and right exposure amounts differ at the boundary of the scanning region. A seam occurs. In a semiconductor integrated circuit board or a printed board, even if such a seam occurs in a circuit pattern, there is no problem as long as the circuit pattern is electrically connected. However, in a display panel substrate such as a liquid crystal display device, since such a joint is recognized by human eyes, there is a problem in that image quality is deteriorated.

  The subject of this invention is detecting the intensity distribution of the light beam irradiated from the light beam irradiation apparatus accurately. Another object of the present invention is to make the intensity distribution of the light beam emitted from the light beam irradiation apparatus uniform with high accuracy and improve the drawing quality. In particular, the light beam intensity distribution in the direction orthogonal to the substrate scanning direction by the light beam is detected with high accuracy, and the light beam intensity distribution in the direction orthogonal to the substrate scanning direction by the light beam is made uniform with high accuracy. It is. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  An exposure apparatus of the present invention includes a chuck that supports a substrate coated with a photoresist, a spatial light modulator that modulates a light beam, a drive circuit that drives the spatial light modulator based on drawing data, and a spatial A light beam irradiation apparatus having an irradiation optical system for irradiating a light beam modulated by the light modulator; and a moving means for relatively moving the chuck and the light beam irradiation apparatus. The moving means irradiates the chuck and the light beam. An exposure apparatus that moves relative to the apparatus, scans the substrate with a light beam from the light beam irradiation apparatus, and draws a pattern on the substrate, and a part of the light beam irradiated from the light beam irradiation apparatus A measuring tool that moves the irradiation area of the light beam irradiated from the light beam irradiation device while blocking light, and a light beam that is irradiated from the light beam irradiation device and partially blocked by the measuring tool. And a detecting device for detecting the intensity of the entire received light beam, and the intensity of the light beam shielded by the measuring tool from the change accompanying the movement of the measuring tool of the intensity of the entire light beam received by the detecting device. The position is detected, the intensity distribution of the light beam is detected, and the variation in the intensity distribution of the light beam is corrected based on the detection result.

  The exposure method of the present invention also supports a substrate coated with a photoresist with a chuck, a spatial light modulator that modulates a light beam, and a drive that drives the spatial light modulator based on drawing data. A circuit, and a light beam irradiation apparatus having an irradiation optical system that irradiates a light beam modulated by a spatial light modulator, relatively moves, scans the substrate with the light beam from the light beam irradiation apparatus, An exposure method for drawing a pattern on a substrate, wherein a measuring tool that blocks a part of a light beam emitted from a light beam irradiation device is moved in an irradiation region of the light beam emitted from the light beam irradiation device, A light beam irradiated from the light beam irradiation device and partially blocked by the measuring tool is received, the intensity of the entire received light beam is detected, and the intensity of the received light beam is moved along with the movement of the measuring tool. From reduction, by detecting the intensity and the position of the light shielding light beams by the measuring instrument, detecting the intensity distribution of the light beam, based on the detection result, and it corrects the variation in the intensity distribution of the light beam.

  While moving the measuring tool that blocks a part of the light beam emitted from the light beam irradiation device in the irradiation area of the light beam emitted from the light beam irradiation device, The light beam whose part is shielded is received, and the intensity of the entire received light beam is detected. If the intensity distribution of the light beam varies, the intensity of the light beam shielded by the measuring tool varies depending on the position of the measuring tool, and as a result, the intensity of the entire received light beam increases as the measuring tool moves. Change. From the change of the intensity of the entire received light beam with the movement of the measuring tool, the intensity of the light beam shielded by the measuring tool and its position are detected to detect the intensity distribution of the light beam. Unlike the conventional light passing through the slit, even if the angle of the light beam irradiated to the measuring tool is slightly different, the amount of the light beam shielded by the measuring tool hardly changes, and the light irradiated from the light beam irradiation device The intensity distribution of the beam is detected with high accuracy. Then, since the variation in the intensity distribution of the light beam is corrected based on the detection result, the intensity distribution of the light beam emitted from the light beam irradiation apparatus is made uniform with high accuracy, and the drawing quality is improved.

  Further, in the exposure apparatus of the present invention, the measuring tool is in the shape of an elongated bar, and is arranged over the light beam irradiation region in the scanning direction of the substrate by the light beam from the light beam irradiation apparatus. It moves in a direction perpendicular to the scanning direction of the substrate by the light beam. In the exposure method of the present invention, a long and narrow bar-shaped measuring tool is arranged over the irradiation region of the light beam in the scanning direction of the substrate by the light beam from the light beam irradiation device, and the light beam from the light beam irradiation device. It moves in the direction orthogonal to the scanning direction of the substrate. The intensity distribution of the light beam in the direction orthogonal to the scanning direction of the substrate by the light beam is detected with high accuracy, and the intensity distribution of the light beam in the direction orthogonal to the scanning direction of the substrate by the light beam is made uniform with high accuracy.

  Furthermore, in the exposure apparatus of the present invention, the surface on which the light beam from the light beam irradiation apparatus of the measuring tool is incident is a part of the surface of the cylinder or a curved surface close thereto. In the exposure method of the present invention, the surface on which the light beam from the light beam irradiation device of the measuring tool is incident is a part of the surface of the cylinder or a curved surface close thereto. If the cross section of the measuring tool is a quadrangle or polygon, the area of the portion shielded by the measuring tool of the light beam varies when the incident angle of the light beam changes greatly. If the surface on which the light beam from the light beam irradiation device of the measuring tool is incident is a part of the surface of the cylinder or a curved surface close to it, even if the incident angle of the light beam changes greatly, it is shielded by the light beam measuring tool. Therefore, the intensity distribution of the light beam emitted from the light beam irradiation device can be detected with higher accuracy.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, the intensity distribution of the light beam emitted from the light beam irradiation apparatus becomes uniform with high accuracy and the drawing quality is improved, so that a high-quality display panel substrate is manufactured. .

  According to the exposure apparatus and the exposure method of the present invention, while moving the measuring tool that blocks a part of the light beam irradiated from the light beam irradiation apparatus in the irradiation region of the light beam irradiated from the light beam irradiation apparatus, A light beam irradiated from the light beam irradiation device and partially blocked by the measuring tool is received, the intensity of the entire received light beam is detected, and the intensity of the received light beam as a whole changes with the movement of the measuring tool Thus, the intensity distribution of the light beam irradiated from the light beam irradiation device is detected with high accuracy by detecting the intensity and position of the light beam shielded by the measuring tool and detecting the intensity distribution of the light beam. be able to. Then, by correcting the variation in the intensity distribution of the light beam based on the detection result, the intensity distribution of the light beam emitted from the light beam irradiation apparatus can be made uniform with high accuracy, and the drawing quality can be improved.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the elongated rod-shaped measuring tool is arranged over the light beam irradiation region in the scanning direction of the substrate by the light beam from the light beam irradiation apparatus, and the light beam irradiation is performed. By moving in the direction perpendicular to the scanning direction of the substrate by the light beam from the apparatus, the intensity distribution of the light beam in the direction perpendicular to the scanning direction of the substrate by the light beam is accurately detected, and the substrate is scanned by the light beam. The intensity distribution of the light beam in the direction orthogonal to the direction can be made uniform with high accuracy.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the surface on which the light beam from the light beam irradiation apparatus of the measuring tool is incident is a part of the surface of the cylinder or a curved surface close thereto, thereby allowing the light beam to enter. Even if the angle changes greatly, it is possible to detect the intensity distribution of the light beam emitted from the light beam irradiation device with higher accuracy by always making the area of the portion shielded by the light beam measuring tool almost constant.

  According to the method for manufacturing a display panel substrate of the present invention, the intensity distribution of the light beam irradiated from the light beam irradiation device can be made uniform with high accuracy and the drawing quality can be improved. A substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure which shows an example of the mirror part of DMD. It is a figure explaining operation | movement of a laser length measurement system. It is a figure which shows schematic structure of a drawing control part. It is a top view of an X stage and a chuck. It is a front view of an X stage and a chuck. It is a perspective view of a measuring tool and a laser power meter. It is a figure which shows the example of the cross-sectional shape of a measuring tool. It is a figure explaining the intensity distribution detection method of the light beam by one embodiment of this invention. It is a figure explaining the relationship between the detection intensity | strength of a laser power meter, and the intensity | strength of a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system, a laser length measurement system control device 40, a measuring tool 50, a laser power meter 51, a stage drive circuit 60, and a main control device 70 are configured. 2 and 3, the laser light source 41 of the laser measurement system, the laser measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and the present invention is one or two or more. The present invention is applied to an exposure apparatus using a light beam irradiation apparatus.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a condenser lens 23a, a fly-eye lens 23b, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, a DMD driving circuit 27, a first prism 28, and a second prism 29. It is configured to include. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is condensed by the condenser lens 23a to become a parallel light beam and enters the fly-eye lens 23b. The fly-eye lens 23b is a lens array in which a plurality of single lenses are arranged vertically and horizontally, and projects and superimposes incident light on the same irradiation surface to make the illuminance distribution uniform. As an optical integrator, a rod lens or the like may be used instead of the fly-eye lens 23b.

  The light beam emitted from the fly-eye lens 23 b enters the first prism 28 via the mirror 24, is reflected by the slope of the first prism 28, and is irradiated from the first prism 28 to the DMD 25. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam by changing the angle of each mirror. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70. The light beam modulated by the DMD 25 again enters the first prism 28, passes through the first prism 28 and the second prism 29, and is applied to the reflecting surface coated with the reflecting film of the second prism 29. The light beam reflected by the reflecting surface of the second prism 29 is reflected by the slope of the second prism 29 and enters the irradiation optical system 20 b including the projection lens 26 from the second prism 29. The light beam incident on the irradiation optical system 20b is irradiated onto the substrate 1 from the irradiation optical system 20b.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. At the exposure position, the movement of the X stage 5 in the X direction causes the light beam irradiated from the irradiation optical system 20b of each light beam irradiation apparatus 20 to scan the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam irradiated from the irradiation optical system 20b of each light beam irradiation apparatus 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  FIG. 5 is a diagram illustrating an example of a DMD mirror unit. The DMD 25 of the light beam irradiation device 20 has a predetermined angle θ with respect to the Z direction perpendicular to the scanning direction (X direction (the depth direction of FIG. 5)) of the substrate 1 by the light beam from the light beam irradiation device 20. It is tilted. When the DMD 25 is arranged to be inclined with respect to the Z direction, any one of the plurality of mirrors 25a arranged in two orthogonal directions covers a portion corresponding to the gap between the adjacent mirrors 25a. It can be done without gaps.

  In the present embodiment, the substrate 10 is scanned by the light beam from the light beam irradiation device 20 by moving the chuck 10 in the X direction by the X stage 5, but the light beam irradiation device 20 is moved. By doing so, the substrate 1 may be scanned by the light beam from the light beam irradiation device 20. In the present embodiment, the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 is changed by moving the chuck 10 in the Y direction by the Y stage 7, but the light beam irradiation device 20. , The scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 may be changed.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 6 is a diagram for explaining the operation of the laser length measurement system. In FIG. 6, the gate 11, the light beam irradiation device 20, the measuring tool 50, and the laser power meter 51 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  In FIG. 4, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 7 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, a drawing data creation unit 77, and an intensity distribution correction unit 78.

  The memory 76 stores a design value map. In the design value map, drawing data is indicated by XY coordinates. The drawing data creation unit 77 creates drawing data to be supplied to the DMD drive circuit 27 of each light beam irradiation apparatus 20 from the design value map stored in the memory 76. The memory 72 stores the drawing data created by the drawing data creation unit 77 using the XY coordinates as addresses. The memory 72 stores drawing data for inspection for detecting the intensity distribution of a light beam, which will be described later.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam irradiated from the irradiation optical system 20 b of the light beam irradiation apparatus 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 7, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  FIG. 8 is a top view of the X stage and the chuck. FIG. 9 is a front view of the X stage and the chuck. A measuring tool 50 used for detecting the intensity distribution of the light beam is attached to the side surface of the chuck 10 extending in the Y direction. In the present embodiment, two measuring tools 50 are attached to the chuck 10, but one or more measuring tools 50 may be attached to the chuck 10.

  A plurality of laser power meters 51 are attached to the upper surface of the X stage 5 so as to correspond to the respective light beam irradiation devices 20. The laser power meters 51 are arranged in the Y direction at the same intervals as the intervals of the head portions 20 a including the irradiation optical system 20 b of each light beam irradiation device 20. The laser power meter 51 includes an absorber made of a photodiode, a thermopile, or the like on the light receiving surface, converts light energy of the laser light received on the light receiving surface into an electric signal, and according to the intensity (power or energy) of the laser light. The detected signal is output.

  In the present embodiment, the intensity of the light beam emitted from each light beam irradiation device 20 is periodically used by using the measuring tool 50 attached to the chuck 10 and the laser power meter 51 attached to the X stage 5. Detect distribution. When detecting the intensity distribution of the light beam, the main controller 70 in FIG. 1 controls the stage driving circuit 60 to move the X stage 5 in the X direction, and each laser power meter 51 attached to the X stage 5. Are moved below the head portion 20a including the irradiation optical system 20b of each light beam irradiation apparatus 20. Further, the main controller 70 controls the stage driving circuit 60 to move the Y stage 7 in the Y direction so that each measuring tool 50 attached to the chuck 10 detects a light beam intensity distribution. The irradiation apparatus 20 moves below the head unit 20a including the irradiation optical system 20b.

  8 and 9, the laser power meters 51 are moved below the head portions 20a of the respective light beam irradiation devices 20, and the head portions of the light beam irradiation devices 20 for detecting the intensity distribution of the light beams by the respective measuring tools 50 are shown. The state which moved below 20a is shown. In FIG. 8, the gate 11 and the light beam irradiation device 20 shown in FIG. 1 are omitted, and the head portion 20a including the irradiation optical system 20b of each light beam irradiation device 20 is indicated by a broken line.

  FIG. 10 is a perspective view of the measuring tool and the laser power meter. In FIG. 10, only two laser power meters 51 located below the two measuring tools 50 attached to the chuck 10 in FIGS. 8 and 9 are shown. In the present embodiment, the measuring tool 50 has a long and narrow bar shape extending in the horizontal direction, and a portion attached to the side surface of the chuck 10 is bent in an L shape. The portion extending in the horizontal direction of the measuring tool 50 is installed at the height of the focal point of the light beam irradiated from the irradiation optical system 20b of the light beam irradiation device 20, and the laser power meter from the irradiation optical system 20b of the light beam irradiation device 20 is used. A part of the light beam irradiated to 51 is shielded.

  FIG. 11 is a diagram illustrating an example of a cross-sectional shape of the measuring tool. In the measuring tool 50, the surface on which the light beam from the light beam irradiation device 20 is incident is a part of the surface of the cylinder or a curved surface close thereto. In the example shown in FIG. 11A, the measuring tool 50 has a circular cross section. However, the present invention is not limited to this, and the measuring tool 50 may have an elliptical cross section. Moreover, as shown in FIG.11 (b), it is good also considering the cross section of the measuring tool 50 as the shape which cut off the lower part of the ellipse which is circular or nearly circular. The measurement tool 50 is made of a material that absorbs a short-wavelength light beam emitted from the light beam irradiation device 20 and has a low coefficient of thermal expansion, such as silicon carbide.

  If the measuring tool 50 has a quadrangular or polygonal cross section, the area of the portion shielded by the measuring tool 50 of the light beam changes when the incident angle of the light beam changes greatly. In the present embodiment, since the surface on which the light beam from the light beam irradiation device 20 of the measuring tool 50 is incident is a part of the surface of the cylinder or a curved surface close thereto, even if the incident angle of the light beam changes greatly. The area of the portion shielded by the light beam measuring tool 50 is always substantially constant.

  FIG. 12 is a diagram for explaining a light beam intensity distribution detection method according to an embodiment of the present invention. In FIG. 7, the drawing control unit 71 of the main control device 70 is used for the inspection stored in the memory 72 with respect to the DMD drive circuit 27 of the light beam irradiation device 20 in which the head unit 20 a is positioned above the measuring tool 50. Supply drawing data. The drawing data for inspection used at this time is such that all the mirrors of the DMD 25 are tilted to the same angle so that the light beams reflected by the mirrors are all irradiated onto the light beam irradiation area 26a. In FIG. 12, the light receiving surface 51a of the laser power meter 51 is wider than the light beam irradiation area 26a indicated by the broken line, and when the measuring tool 50 is not present, all the light beams irradiated to the light beam irradiation area 26a are lasers. Light is received by the light receiving surface 51 a of the power meter 51.

  In the present embodiment, the measuring tool 50 attached to the chuck 10 is disposed over the light beam irradiation region 26 a in the scanning direction (X direction) of the substrate 1 by the light beam from the light beam irradiation device 20. Yes. When detecting the intensity distribution of the light beam emitted from the light beam irradiation device 20, the main control device 70 in FIG. 1 controls the stage drive circuit 60 to move the Y stage 7 in the Y direction and Each attached measuring tool 50 is moved in the Y direction. As a result, the measuring tool 50 blocks the light beam irradiated from the light beam irradiation device 20 while changing the irradiation region of the light beam to the scanning direction of the substrate 1 by the light beam from the light beam irradiation device 20. Move in the orthogonal direction (Y direction).

  The laser power meter 51 receives a light beam irradiated from the light beam irradiation device 20 and partially blocked by the measuring tool 50, and generates a detection signal corresponding to the intensity (power or energy) of the entire received light beam. Output. In FIG. 7, the detection signal of each laser power meter 51 is input to the intensity distribution detection circuit 52. The intensity distribution detection circuit 52 detects the intensity of the light beam shielded by the measuring tool 50 and its position from the change accompanying the movement of the measuring tool 50 of the intensity of the entire light beam detected by the laser power meter 51, The intensity distribution of the light beam is detected.

  FIG. 13 is a diagram for explaining the relationship between the detection intensity of the laser power meter and the intensity of the light beam. In FIG. 13A, the horizontal axis indicates the position of the measuring tool 50 in the Y direction, and the vertical axis indicates the detection intensity of the entire light beam received by the laser power meter 51. If the intensity distribution of the light beam emitted from the light beam irradiation device 20 varies, the intensity of the light beam shielded by the measuring tool 50 differs depending on the position of the measuring tool 50. As a result, as shown in FIG. 13A, the detection intensity of the entire light beam received by the laser power meter 51 changes as the measuring tool 50 moves.

  The intensity distribution detection circuit 52 determines the intensity of the light beam shielded by the measuring tool 50 and its intensity, as shown in FIG. 13A, from the change accompanying the movement of the measuring tool 50 of the detected intensity of the entire received light beam. Detect position. The intensity distribution detection circuit 52 detects the intensity distribution of the light beam from the intensity of the light beam shielded by the measuring tool 50 and its position. FIG. 13B shows the intensity distribution of the light beam detected when the intensity of the light beam shielded by the measuring tool 50 changes as shown in FIG. In FIG. 13B, the horizontal axis indicates the position of the measuring tool 50 in the Y direction, and the vertical axis indicates the intensity of the light beam.

  The measuring tool 50 that blocks a part of the light beam irradiated from the light beam irradiation device 20 is irradiated from the light beam irradiation device 20 while moving in the irradiation region 26a of the light beam irradiated from the light beam irradiation device 20. Then, a light beam partially shielded by the measuring tool 50 is received, the intensity of the entire received light beam is detected, and the intensity of the entire received light beam is changed as the measuring tool 50 is moved. Since the intensity of the light beam shielded by the light and its position are detected and the intensity distribution of the light beam is detected, the measuring tool 50 can be used even if the angle of the light beam is slightly different from the conventional light passing through the slit. The amount of light beam to be shielded hardly changes, and the intensity distribution of the light beam emitted from the light beam irradiation device 20 is detected with high accuracy.

  In particular, in the present embodiment, the elongated rod-shaped measuring tool 50 is arranged over the light beam irradiation region 26a in the scanning direction (X direction) of the substrate 1 by the light beam from the light beam irradiation device 20 and light. Since the light beam from the beam irradiation device 20 moves in the direction (Y direction) perpendicular to the scanning direction of the substrate 1 by the light beam, the intensity distribution of the light beam in the direction perpendicular to the scanning direction of the substrate 1 by the light beam is detected with high accuracy. The

  The main controller 70 similarly detects the intensity distribution of the light beam emitted from the light beam irradiation device 20 for the other light beam irradiation devices 20. In FIG. 7, the detection result of the intensity distribution detection circuit 52 is input to the intensity distribution correction unit 78 of the drawing control unit 71. The intensity distribution correction unit 78 creates intensity distribution correction data according to the intensity distribution of the light beam detected by the intensity distribution detection circuit 52, and corresponds to the portion where the intensity of the light beam is large by the created intensity distribution correction data. The drawing data stored in the memory 72 is corrected so that the number of times of driving the mirror is limited and the intensity of the light beam is the same in the entire light beam irradiation area 26a. Further, when the detected light beam intensity distribution is different from the predetermined bandwidth in the Y direction width of the light beam, the projection magnification is deviated from the design value, so that the DMD 25 and the projection lens 26 in the light beam irradiation device 20 are used. The position of the irradiation optical system 20b including is adjusted.

  In the embodiment described above, the intensity of the light beam is detected using the laser power meter 51. However, other detection devices that detect the intensity of the light beam may be used.

  14 to 17 are diagrams for explaining scanning of the substrate by the light beam. 14 to 17 show an example in which the entire substrate 1 is scanned by performing four scans in the X direction of the substrate 1 with the eight light beams from the eight light beam irradiation apparatuses 20. 14-17, the head part 20a containing the irradiation optical system 20b of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 14 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 14 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 15 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 15 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 16 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 16 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 17 shows the fourth scan. With the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 17, and the scan of the entire substrate 1 is completed.

  14 to 17 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the measuring tool 50 that blocks a part of the light beam irradiated from the light beam irradiation device 20 is moved in the irradiation region 26 a of the light beam irradiated from the light beam irradiation device 20. However, the light beam irradiated from the light beam irradiation device 20 and partially blocked by the measuring tool 50 is received, the intensity of the entire received light beam is detected, and the measuring tool 50 for the intensity of the entire received light beam is detected. By detecting the intensity and position of the light beam shielded by the measuring tool 50 from the change accompanying the movement of the light beam, and detecting the intensity distribution of the light beam, the light beam emitted from the light beam irradiation device 20 is detected. The intensity distribution can be detected with high accuracy. Then, by correcting the variation in the intensity distribution of the light beam based on the detection result, the intensity distribution of the light beam emitted from the light beam irradiation device 20 can be made uniform with high accuracy, and the drawing quality can be improved.

  Further, an elongated rod-shaped measuring tool 50 is arranged over the light beam irradiation region 26 a in the scanning direction of the substrate 1 by the light beam from the light beam irradiation device 20, and the substrate by the light beam from the light beam irradiation device 20. By moving in the direction orthogonal to the scanning direction of 1, the intensity distribution of the light beam in the direction orthogonal to the scanning direction of the substrate 1 by the light beam is accurately detected, and orthogonal to the scanning direction of the substrate 1 by the light beam. The intensity distribution of the light beam in the direction can be made uniform with high accuracy.

  Further, the surface on which the light beam from the light beam irradiation device 20 of the measuring tool 50 is incident is a part of the surface of the cylinder or a curved surface close thereto, so that even if the incident angle of the light beam changes greatly, the light beam It is possible to detect the intensity distribution of the light beam emitted from the light beam irradiation apparatus 20 with higher accuracy by always keeping the area of the portion shielded by the measuring tool 50 substantially constant.

  By performing exposure of the substrate using the exposure apparatus or exposure method of the present invention, the intensity distribution of the light beam emitted from the light beam irradiation apparatus can be made uniform with high accuracy and the drawing quality can be improved. A quality display panel substrate can be manufactured.

  For example, FIG. 18 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the peeling step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is peeled off with a peeling solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 19 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 18, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 19, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20 Light beam irradiation apparatus 20a Head part 20b Irradiation optical system 21 Laser light source unit 22 Optical fiber 23a Condenser lens 23b Fly eye lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection Lens 26a Light Beam Irradiation Area 27 DMD Drive Circuit 28 First Prism 29 Second Prism 31, 33 Linear Scale 32, 34 Encoder 40 Laser Measuring System Controller 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror DESCRIPTION OF SYMBOLS 50 Measuring tool 51 Laser power meter 52 Intensity distribution detection circuit 60 Stage drive circuit 70 Main controller 71 Drawing control part 72,76 Memory 73 Bandwidth setting part 74 Center point coordinate determination part 75 Coordinate determination part 77 Drawing data creation part 78 Intensity Distribution correction unit

Claims (8)

A chuck for supporting a substrate coated with a photoresist;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
A moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate,
A measuring tool that moves an irradiation area of the light beam irradiated from the light beam irradiation device while shielding a part of the light beam irradiated from the light beam irradiation device;
Receiving a light beam irradiated from the light beam irradiation device and partially blocked by the measuring tool, and detecting the intensity of the entire received light beam,
The intensity distribution of the light beam is detected by detecting the intensity and position of the light beam shielded by the measuring tool from the change in the intensity of the entire light beam received by the detecting device as the measuring tool moves. An exposure apparatus in which variations in the intensity distribution of the light beam are corrected based on the detection result.   The measuring tool is in the shape of an elongated rod, and is arranged over the light beam irradiation region in the scanning direction of the substrate by the light beam from the light beam irradiation device, and the substrate is scanned by the light beam from the light beam irradiation device. The exposure apparatus according to claim 1, wherein the exposure apparatus moves in a direction orthogonal to the direction.   3. The exposure apparatus according to claim 1, wherein the measuring tool has a surface on which a light beam from the light beam irradiation device is incident is a part of a surface of a cylinder or a curved surface close thereto. Support the substrate coated with photoresist with a chuck,
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relative to the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
While moving the measuring tool that blocks a part of the light beam emitted from the light beam irradiation device in the irradiation region of the light beam emitted from the light beam irradiation device,
Receives a light beam irradiated from the light beam irradiation device and partially blocked by the measuring tool, and detects the intensity of the entire received light beam,
From the change of the intensity of the entire received light beam with the movement of the measuring tool, the intensity of the light beam shielded by the measuring tool and its position are detected, the intensity distribution of the light beam is detected, and based on the detection result, An exposure method comprising correcting variation in intensity distribution of a light beam.   A long and narrow bar-shaped measuring tool is arranged in the scanning direction of the substrate by the light beam from the light beam irradiation device, over the irradiation region of the light beam, and is perpendicular to the scanning direction of the substrate by the light beam from the light beam irradiation device. The exposure method according to claim 4, wherein the exposure method is performed.   6. The exposure method according to claim 4, wherein a surface on which a light beam from a light beam irradiation device of the measuring tool is incident is a part of a surface of a cylinder or a curved surface close thereto.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure method according to any one of claims 4 to 6.

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