TW201335722A - Exposure apparatus, exposure method, and fabricating method of display panel substrate - Google Patents

Abstract

An exposure apparatus, an exposure method and a fabricating method of display panel substrate for precisely detecting a strength distribution of a light beam irradiating from a light irradiating device are provided. A detecting tool (50) which shields a portion of a light beam irradiating from a light irradiating device (20) moves in an irradiated region (26a) of the light beam irradiating from the light irradiating device (20); meanwhile, the light beam irradiating from the light irradiating device (20) with a portion thereof shielded by the detecting tool (50) is received, and an entire strength of the received light beam is detected. According to a change in the entire strength of the received light beam as a movement of the detecting tool, the strength of the light beam shielded by the detecting tool (50) and a position of the detecting tool (50) are detected in order to detect a strength distribution of the light beam. An unevenness of the strength distribution of the light beam is corrected according to the above detected results.

Description

Exposure apparatus, exposure method, and manufacturing method of panel substrate for display

The present invention relates to an exposure apparatus, an exposure method, and a method of irradiating a substrate on which a photoresist is applied to a substrate coated with a photoresist, and scanning a substrate to draw a pattern on the substrate, in the manufacture of a display panel substrate such as a liquid crystal display device. A method of manufacturing a panel substrate for display using the exposure apparatus and the exposure method.

Thin film transistor (TFT, Thin Film Transistor) substrate, color filter substrate, plasma display panel substrate, and organic electroluminescence (EL) display of a liquid crystal display device used as a display panel The manufacture of a panel substrate or the like is performed by forming an pattern on a substrate by an optical lithography technique using an exposure apparatus. As an exposure apparatus, there has been a projection method in which a pattern of a mask is projected onto a substrate using a lens or a mirror, and a small gap is provided between the mask and the substrate. (Proximity gap) The approach of transferring the pattern of the reticle to the substrate.

In recent years, an exposure apparatus has been developed in which a light beam is irradiated onto a substrate coated with a photoresist, and a pattern is drawn on the substrate by scanning the substrate with a light beam. Since the pattern is directly drawn on the substrate by scanning the substrate by the light beam, a high-priced photomask is not required. In addition, it is possible to respond to various display panel substrates by changing the drawing data and the scanning program.

When a pattern is drawn on a substrate by a light beam, the modulation of the light beam is performed using a spatial light modulator such as a Digital Micromirror Device (DMD). The DMD is configured by arranging a plurality of minute lenses that reflect a light beam in two directions, and the drive circuit changes the angle of each lens based on the drawing data, thereby modulating the light beam supplied from the light source. The light beam modulated by the DMD is irradiated to the substrate from the illumination optical system of the light beam irradiation device.

In a illuminating optical system in which a spatial light modulator or a light beam modulated by a spatial light modulator is irradiated onto a substrate, if a deviation occurs in the light beam due to optical characteristics of the optical component, the light beam irradiated from the light beam illuminating device The intensity distribution will become uneven. In addition, if there is a positional shift in the spatial light modulator or the illumination optical system, the optical path of the light beam is shifted, so that the intensity distribution of the diffracted light of the light beam changes. If the intensity distribution of the light beam irradiated from the light beam irradiation device is uneven, the resolution performance becomes uneven and the pattern cannot be uniformly drawn, so that the drawing quality is lowered. Therefore, in the past, the maintenance personnel manually detected the intensity distribution of the light beam using the detecting device and made necessary adjustments, but this operation took a lot of time and labor.

In view of this, Patent Document 1 discloses a technique of detecting a light beam The strength detecting device is mounted on a chuck, and a slit is provided between the beam irradiating device and the detecting device, and the slit is used to divide the irradiation region of the light beam irradiated from the beam irradiating device into a plurality of areas of the same area. The inspection area is thereby easily detected as the intensity distribution of the light beam irradiated from the light beam irradiation device.

Background art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2011-237684

It is difficult to make the light beams irradiated from the light beam irradiation device into completely parallel beams, and a component having a slightly different angle is mixed in the light beam irradiated from the light beam irradiation device. In general, the various slits described in Patent Document 1 are formed by drilling an elongated hole from a flat plate, but at this time, the heights of the surfaces of both end portions of the hole are slightly displaced, and the displacement amount is two in the hole. The ends are not exactly the same, so a slight step is created across the holes. In addition, the slit must be placed perpendicular to the optical axis of the beam, and if a slight offset is provided, the angle of the beam will affect the measurement. Therefore, in the conventional method of detecting the intensity distribution of the light beam using the slit, even if the angles of the light beams irradiated to the both end portions of the holes are slightly different, the amount of the passed light beams largely changes, and it is difficult to detect the light beams with high precision. The intensity distribution.

Further, when the substrate is scanned by the light beam, after the scanning is performed once, the substrate or the beam irradiation device is stepped up to the next scanning position to perform the next scanning, and these operations are repeated to scan the entire substrate. Thus, when the substrate is scanned by the light beam for a plurality of times, if the intensity distribution of the light beam is uneven in a direction orthogonal to the scanning direction of the light beam to the substrate, the scanning area is present. At the boundary of the boundary, a seam with different exposure amounts on the left and right sides is generated. In the semiconductor integrated circuit board or the printed board, even if such a seam is formed in the circuit pattern, it is not a problem as long as the circuit pattern can be electrically connected. However, in a panel substrate for display such as a liquid crystal display device, such a seam can be recognized by a human eye, and thus there is a problem that image quality is degraded.

An object of the present invention is to accurately detect the intensity distribution of a light beam emitted from a beam irradiation device. Further, an object of the present invention is to improve the intensity of the intensity distribution of the light beam irradiated from the light beam irradiation device and to improve the drawing quality. In particular, an object of the present invention is to accurately detect the intensity distribution of a light beam in a direction orthogonal to the scanning direction of a light beam to a substrate, and to distribute the intensity of a light beam in a direction orthogonal to the scanning direction of the light beam to the substrate. Excellent accuracy and uniformity. Further, an object of the present invention is to manufacture a high-quality panel substrate for display.

The exposure apparatus of the present invention comprises: a suction cup supporting a substrate coated with a photoresist; a beam irradiation device including a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on the drawing data, and illumination through the spatial light An illuminating optical system of the modulated beam of the modulator; and a moving unit for relatively moving the chuck and the beam illuminating device; and relatively moving the chuck and the beam illuminating device by the moving unit, and scanning by the beam from the beam illuminating device a substrate is patterned on the substrate; and the exposure device includes: a measuring tool that shields a part of the light beam irradiated from the light beam irradiation device while irradiating the light beam from the light beam irradiation device Moving in the irradiation area; and detecting means for receiving a light beam irradiated from the light beam irradiation means and shielding a part of the light beam by the measuring tool, and detecting the intensity of the entire received light beam; and the intensity of the entire light beam received by the detecting means is accompanied by the measuring tool The change in the movement detects the intensity of the light beam shielded by the measuring tool and the position of the measuring tool, thereby detecting the intensity distribution of the light beam, and correcting the unevenness of the intensity distribution of the light beam based on the detection result.

Further, in the exposure method of the present invention, the substrate coated with the photoresist is supported by the chuck, and the chuck is relatively moved with the beam irradiation device, and the beam irradiation device includes a spatial light modulator that modulates the light beam, and drives the spatial light based on the drawing data. a drive circuit of the modulator and an illumination optical system that illuminates the light beam modulated by the spatial light modulator, and the substrate is drawn on the substrate by scanning the substrate from the light beam of the light beam irradiation device; and the light beam that is shielded from the light beam irradiation device is shielded A part of the measuring tool moves in the irradiation region of the light beam irradiated from the light beam irradiation device, receives a light beam that is irradiated from the light beam irradiation device and shields a part of the light beam by the measuring instrument, and detects the intensity of the received light beam as a whole, according to the received light beam. The intensity of the whole is accompanied by the change in the movement of the measuring tool, and the intensity of the light beam shielded by the measuring tool and the position of the measuring tool are detected, thereby detecting the intensity distribution of the light beam, and correcting the unevenness of the intensity distribution of the light beam based on the detection result.

The measuring tool that shields a part of the light beam irradiated from the light beam irradiation device moves in the irradiation region of the light beam irradiated from the light beam irradiation device, receives a light beam that is irradiated from the light beam irradiation device and shields a part of the light beam by the measuring instrument, and detects the received light. The overall intensity of the beam. If the intensity distribution of the beam is uneven, then pass The intensity of the light beam blocked by the measuring tool varies depending on the position of the measuring tool, and as a result, the intensity of the received light beam as a whole changes with the movement of the measuring tool. The intensity distribution of the light beam is detected by detecting the intensity of the light beam shielded by the measuring tool and the position of the measuring tool in accordance with the change in the intensity of the entire received light beam. Unlike the passing light of the conventional slit, even if the angle of the light beam irradiated to the measuring tool is slightly different, the amount of the light beam shielded by the measuring tool hardly changes, and the light beam irradiated from the light beam irradiating device is accurately detected. Intensity distribution. Further, since the unevenness of the intensity distribution of the light beam is corrected based on the detection result, the intensity distribution of the light beam irradiated from the light beam irradiation device is preferably uniform, and the drawing quality is improved.

Further, in the exposure apparatus of the present invention, the measuring tool has an elongated rod shape, and is disposed along the irradiation direction of the light beam along the scanning direction of the light beam from the light beam irradiation device to the substrate, and is directed to the substrate from the light beam irradiation device. The scanning direction moves in a direction orthogonal to the direction. Further, in the exposure method of the present invention, the elongated rod-shaped measuring tool is disposed along the irradiation direction of the light beam to the substrate in the scanning direction of the light beam from the light beam irradiation device, and the measuring tool is directed to the light beam irradiation device. The light beam moves in a direction orthogonal to the scanning direction of the substrate. The intensity distribution of the light beam in the direction orthogonal to the scanning direction of the light beam to the substrate can be accurately detected, so that the intensity distribution accuracy of the light beam in the direction orthogonal to the scanning direction of the light beam to the substrate is uniform.

Further, in the exposure apparatus of the present invention, the surface of the measuring tool from which the light beam from the light beam irradiating means is incident includes a part of the cylindrical surface or a curve similar thereto surface. Further, in the exposure method of the present invention, the surface of the measuring tool from which the light beam from the beam irradiation device is incident is a part of the cylindrical surface or a curved surface similar thereto. In the case where the cross section of the measuring tool is a quadrangle or a polygon, if the incident angle of the beam largely changes, the area of the portion of the beam that is shielded by the measuring tool varies. When the surface of the measuring instrument from which the light beam from the light beam irradiating device is incident is a part of the cylindrical surface or a curved surface similar thereto, even if the incident angle of the light beam largely changes, the area of the portion of the light beam shielded by the measuring tool is always substantially It is fixed, so that the intensity distribution of the light beam irradiated from the beam irradiation device can be more accurately detected.

In the method of manufacturing the panel substrate for display of the present invention, exposure of the substrate is performed using any one of the above-described exposure apparatuses or exposure methods. By using the exposure apparatus or the exposure method, the intensity distribution of the light beam irradiated from the light beam irradiation device is preferably uniform, and the drawing quality is improved, so that a high-quality display panel substrate can be manufactured.

According to the exposure apparatus and the exposure method of the present invention, the measuring tool that shields a part of the light beam irradiated from the light beam irradiation device is moved by the light beam irradiation device and passes through the measurement tool while moving in the irradiation region of the light beam irradiated from the light beam irradiation device. Blocking a part of the light beam and detecting the intensity of the received light beam as a whole, and detecting the intensity of the light beam shielded by the measuring tool and the position of the measuring tool according to the change of the intensity of the received light beam as a whole, and the movement of the measuring tool The intensity distribution of the light beam is detected, whereby the intensity distribution of the light beam irradiated from the light beam irradiation device can be accurately detected. Moreover, the intensity distribution of the beam is corrected based on the detection result. The unevenness of the intensity of the light beam irradiated from the light beam irradiation device is uniform, and the drawing quality can be improved.

Further, according to the exposure apparatus and the exposure method of the present invention, the elongated rod-shaped measuring tool is disposed along the irradiation direction of the light beam in the scanning direction of the light beam from the light beam irradiation device to the substrate, and the measuring tool is irradiated with the light beam from the light beam. The light beam of the device moves in a direction orthogonal to the scanning direction of the substrate, whereby the intensity distribution of the light beam in the direction orthogonal to the scanning direction of the light beam to the substrate can be accurately detected, so that the scanning direction of the light beam to the substrate can be positive The intensity distribution of the beam in the direction of intersection is preferably uniform.

Further, according to the exposure apparatus and the exposure method of the present invention, the surface of the measuring tool from which the light beam from the light beam irradiation device is incident is a part of the cylindrical surface or a curved surface similar thereto, whereby even if the incident angle of the light beam largely changes, The area of the portion where the light beam is shielded by the measuring tool can be always substantially fixed, so that the intensity distribution of the light beam irradiated from the light beam irradiating device can be more accurately detected.

According to the method for manufacturing a panel substrate for display of the present invention, the intensity distribution of the light beam irradiated from the light beam irradiation device can be made uniform, and the drawing quality can be improved, whereby a high-quality display panel substrate can be manufactured.

1‧‧‧Substrate

3‧‧‧Base

4‧‧‧X rail

5‧‧‧X platform

6‧‧‧Y rail

7‧‧‧Y platform

8‧‧ θ platform

10‧‧‧Sucker

11‧‧‧1.

20‧‧‧beam irradiation device

20a‧‧‧ head

20b‧‧‧Optical optical system

21‧‧‧Laser light source unit

22‧‧‧ fiber

23a‧‧‧ Condenser lens

23b‧‧•Future eye lens

24, 25a‧‧‧ lenses

25‧‧‧DMD (Digital Micromirror Device)

26‧‧‧Projection lens

26a‧‧‧Lighting area of the beam

27‧‧‧DMD drive circuit

28‧‧‧第1稜鏡

29‧‧‧第2稜鏡

31, 33‧‧‧ linear scale

32, 34‧‧‧Encoder

40‧‧‧Laser length measuring system control device

41‧‧‧Laser light source

42, 44‧‧‧ Laser Interferometer

43, 45‧‧‧ rod mirror

50‧‧‧Measurement tools

51‧‧‧Laser Power Meter

51a‧‧‧Light receiving surface of laser power meter 51

52‧‧‧Intensity distribution detection circuit

60‧‧‧ platform drive circuit

70‧‧‧Main control unit

71‧‧‧Drawing Control Department

72, 76‧‧‧ memory

73‧‧‧Bandwidth setting department

74‧‧‧ Center Point Coordinates Decision Department

75‧‧‧Coordinates Decision Department

77‧‧‧Drawing Data Production Department

78‧‧‧Intensity Distribution Correction Department

X, Y, Z‧‧ Direction

Θ‧‧‧ angle

W‧‧‧ Bandwidth

FIG. 1 is a view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention.

Fig. 2 is a side view of an exposure apparatus according to an embodiment of the present invention.

Fig. 3 is a front view of an exposure apparatus according to an embodiment of the present invention.

4 is a view showing a schematic configuration of a light beam irradiation device.

Fig. 5 is a view showing an example of a lens portion of a DMD.

Fig. 6 is a view for explaining the operation of the laser length measuring system.

FIG. 7 is a view showing a schematic configuration of a drawing control unit.

Figure 8 is a top view of the X platform and the suction cup.

Figure 9 is a front elevational view of the X platform and the suction cup.

Figure 10 is a perspective view of the measuring tool and the laser power meter.

11(a) and 11(b) are diagrams showing an example of a cross-sectional shape of a measuring tool.

Fig. 12 is a view for explaining a method of detecting an intensity distribution of a light beam according to an embodiment of the present invention.

13(a) and 13(b) are diagrams for explaining the relationship between the detected intensity of the laser power meter and the intensity of the light beam.

Figure 14 is a diagram illustrating scanning of a light beam to a substrate.

Figure 15 is a diagram illustrating scanning of a light beam to a substrate.

Figure 16 is a diagram illustrating scanning of a light beam to a substrate.

Figure 17 is a diagram illustrating scanning of a light beam to a substrate.

18 is a flow chart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device.

19 is a flow chart showing an example of a manufacturing procedure of a color filter substrate of a liquid crystal display device.

FIG. 1 is a view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of an exposure apparatus according to an embodiment of the present invention. Fig. 3 is a front view of an exposure apparatus according to an embodiment of the present invention. The exposure device comprises: a base 3, an X guide 4, an X platform 5, a Y guide 6, a Y platform 7, a θ platform 8, a suction cup 10, a shutter 11, a beam irradiation device 20, a linear scale 31, 33, the encoder 32, 34, the laser length measuring system, the laser length measuring system control device 40, the measuring tool 50, the laser power meter 51, the platform driving circuit 60, and the main control device 70 . Further, in FIGS. 2 and 3, the laser light source 41, the laser length measuring system control device 40, the platform driving circuit 60, and the main control device 70 of the laser length measuring system are omitted. In addition to these parts, the exposure apparatus includes a substrate transfer robot that carries the substrate 1 to the chuck 10, carries the substrate 1 out of the chuck 10, and a temperature control unit that performs temperature management in the apparatus.

In addition, the XY direction in the embodiment described below is an example, and the X direction and the Y direction may be exchanged.

In FIGS. 1 and 2, the chuck 10 is placed at the transfer position where the substrate 1 is transferred. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate transfer robot (not shown), and the substrate 1 is carried out from the chuck 10 by a substrate transfer robot (not shown). The chuck 10 vacuum-adsorbs the back surface of the substrate 1 to support the substrate 1. A photoresist is coated on the surface of the substrate 1.

The shutter 11 is provided across the susceptor 3 in the upper position of the exposure position at which the exposure of the substrate 1 is performed. A plurality of light beam irradiation devices 20 are mounted on the shutter 11. Further, the present embodiment is an example of an exposure apparatus using eight light beam irradiation devices 20. However, the number of light beam irradiation devices is not limited thereto, and the present invention is also applicable to use of one or two or more light beam irradiation devices. Exposure device.

4 is a view showing a schematic configuration of a light beam irradiation device. The light beam irradiation device 20 includes an optical fiber 22, a condenser lens 23a, a fly eye lens 23b, a lens 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. , 1st 28th, and 2nd 29th. The optical fiber 22 introduces a light beam of ultraviolet light generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is condensed by the condensing lens 23a to become a parallel beam, and is incident on the fly-eye lens 23b. The fly-eye lens 23b is a lens array in which a plurality of single lenses are arranged vertically and horizontally, and the incident light is projected onto the same irradiation surface to overlap, and the illuminance distribution is made uniform. Further, as the optical integrator, a rod lens or the like may be used instead of the fly-eye lens 23b.

The light beam emitted from the fly-eye lens 23b is incident on the first weir 28 via the lens 24, is reflected by the slope of the first weir 28, and is irradiated from the first weir 28 to the DMD 25. The DMD 25 is a spatial light modulator in which a plurality of minute lenses that reflect a light beam are arranged in two orthogonal directions, and the angle of each lens is changed to modulate the light beam. The DMD drive circuit 27 changes the angle of each lens of the DMD 25 based on the drawing data supplied from the main control device 70. The light beam modulated by the DMD 25 is again incident on the first 稜鏡 28, passes through the first 稜鏡 28 and the second 稜鏡 29, and is irradiated to the reflection surface of the second 稜鏡 29 coated with the reflection film. The light beam reflected by the reflecting surface of the second 稜鏡29 is reflected by the inclined surface of the second 稜鏡29, and is incident from the second 稜鏡29 to the illuminating optical system 20b including the projection lens 26. The light beam incident on the illumination optical system 20b is irradiated to the substrate 1 from the illumination optical system 20b.

In FIGS. 2 and 3, the suction cup 10 is mounted on the θ stage 8, and the Y stage 7 and the X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on the X rail 4 provided on the susceptor 3, and moves in the X direction along the X rail 4. The Y stage 7 is mounted on the Y rail 6 provided on the X stage 5, and moves in the Y direction along the Y rail 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. A drive mechanism (not shown) such as a ball screw, a motor, or a linear motor is provided on the X platform 5, the Y platform 7, and the θ stage 8, and each drive mechanism passes through the platform of FIG. The drive circuit 60 is driven.

By rotating the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated in such a manner that both sides thereof are oriented in the X direction and the Y direction. By moving the X platform 5 in the X direction, the suction cup 10 is moved between the transfer position and the exposure position. At the exposure position, the X-ray 5 is moved in the X direction, and the light beam irradiated from the illumination optical system 20b of each of the light beam irradiation devices 20 is scanned in the X direction. Further, by the movement of the Y stage 7 in the Y direction, the light beam irradiated from the illumination optical system 20b of each of the light beam irradiation devices 20 is moved in the Y direction with respect to the scanning area of the substrate 1. In FIG. 1, the main control unit 70 controls the stage drive circuit 60 to perform rotation of the θ stage 8 in the θ direction, movement of the X stage 5 in the X direction, and movement of the Y stage 7 in the Y direction.

Fig. 5 is a view showing an example of a lens portion of a DMD. The DMD 25 of the light beam irradiation device 20 is disposed only by a predetermined angle θ with respect to the Z direction perpendicular to the scanning direction (the X direction (the deep side direction in the drawing of FIG. 5) of the light beam to the substrate 1 from the light beam irradiation device 20). . If the DMD 25 is disposed obliquely with respect to the Z direction, Then, any one of the plurality of lenses 25a arranged in two orthogonal directions covers a portion corresponding to the gap between the adjacent lenses 25a, so that the pattern can be drawn without a gap.

Further, in the present embodiment, the suction of the light beam from the light beam irradiation device 20 to the substrate 1 is performed by moving the suction cup 10 in the X direction by the X stage 5, but the light beam irradiation device 20 may be moved to perform the light beam. The scanning of the substrate 1 by the light beam of the illumination device 20. In the present embodiment, the suction plate 10 is moved in the Y direction by the Y stage 7, and the scanning area of the light beam from the light beam irradiation device 20 to the substrate 1 is changed. However, the light beam irradiation device 20 may be moved and changed. The light beam from the beam irradiation device 20 faces the scanning area of the substrate 1.

In FIGS. 1 and 2, a linear scale 31 extending in the X direction is provided on the susceptor 3. The linear scale 31 is marked with a scale for detecting the amount of movement of the X platform 5 in the X direction. Further, a linear scale 33 extending in the Y direction is provided on the X stage 5. A scale for detecting the amount of movement of the Y stage 7 in the Y direction is indicated on the linear scale 33.

In FIGS. 1 and 3, on one side of the X stage 5, an encoder 32 is mounted opposite to the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main control unit 70. In addition, in FIGS. 1 and 2, the encoder 34 is attached to the linear scale 33 on one side of the Y stage 7. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main control unit 70. The main control device 70 counts the pulse signal of the encoder 32 to detect the amount of movement of the X platform 5 in the X direction, and detects the amount of movement of the X platform 5 The pulse signal of 34 is counted to detect the amount of movement of the Y stage 7 in the Y direction.

Fig. 6 is a view for explaining the operation of the laser length measuring system. In addition, in FIG. 6, the shutter 11, the beam irradiation device 20, the measuring tool 50, and the laser power meter 51 shown in FIG. 1 are abbreviate|omitted. The laser length measuring system is a well-known laser interferometric length measuring system, and includes a laser light source 41, a laser interferometer 42, 44, and a bar mirror 43, 45. The rod mirror 43 is attached to a side surface of the suction cup 10 that extends in the Y direction. Further, the rod mirror 45 is attached to one side of the suction cup 10 that extends in the X direction.

The laser interferometer 42 irradiates the laser light from the laser light source 41 toward the rod mirror 43 and receives the laser reflected by the rod mirror 43, and measures the laser light from the laser light source 41 and the laser light reflected by the rod mirror 43. Interference. This measurement was performed at two locations in the Y direction. The laser length measuring system control device 40 detects the position and rotation of the suction cup 10 in the X direction based on the measurement result of the laser interferometer 42 under the control of the main control device 70.

On the other hand, the laser interferometer 44 irradiates the laser light from the laser light source 41 toward the rod mirror 45, and receives the laser light reflected by the rod mirror 45, and measures the laser light from the laser light source 41 and passes through the rod mirror 45. The interference of the reflected laser. The laser length measuring system control device 40 detects the position of the chuck 10 in the Y direction based on the measurement result of the laser interferometer 44 by the control of the main control device 70.

In FIG. 4, the main control device 70 includes a drawing control unit that supplies drawing data to the DMD driving circuit 27 of the light beam irradiation device 20. Figure 7 is a diagram showing the control Schematic diagram of the outline of the department. The drawing control unit 71 includes memorys 72 and 76, a bandwidth setting unit 73, a center point coordinate determining unit 74, a coordinate determining unit 75, a drawing data creating unit 77, and an intensity distribution correcting unit 78.

A design value map is stored in the memory 76. In the design value map, the drawing data is represented by XY coordinates. The drawing data creation unit 77 creates the drawing data supplied to the DMD driving circuit 27 of each of the light beam irradiation devices 20 based on the design value map stored in the memory 76. The memory 72 stores the drawing data by using the XY coordinates of the drawing data created by the data creation unit 77 as an address. Further, in the memory 72, inspection drawing data for detecting the intensity distribution of the light beam described below is stored.

The bandwidth setting unit 73 determines the range of the Y coordinate of the drawing data read from the memory 72, thereby setting the band width in the Y direction of the light beam emitted from the illumination optical system 20b of the light beam irradiation device 20.

The laser length measuring system control device 40 detects that the position of the chuck 10 in the XY direction before the exposure of the substrate 1 is started in the exposure position. The center point coordinate determining unit 74 determines the XY coordinate of the center point of the chuck 10 before the exposure of the substrate 1 is started based on the position of the chuck 10 in the XY direction detected by the laser length measuring system control device 40. In Fig. 1, when the substrate 1 is scanned by the light beam from the beam irradiation device 20, the main control unit 70 controls the stage drive circuit 60, and the suction plate 10 is moved in the X direction by the X stage 5. When moving in the scanning area of the substrate 1, the main control unit 70 controls the stage driving circuit 60, and the suction stage 10 is moved in the Y direction by the Y stage 7. In FIG. 7, the center point coordinate determining portion 74 is from the encoder. The pulse signals of 32 and 34 are counted, and the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction are detected, thereby determining the XY coordinates of the center point of the chuck 10.

The coordinate determining unit 75 determines the XY coordinates of the drawing data supplied to the DMD driving circuit 27 of each beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determining unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determining unit 75 as an address, and outputs the drawing data stored at the address of the input XY coordinates to the DMD driving circuit 27 of each of the light beam irradiation devices 20.

Figure 8 is a top view of the X platform and the suction cup. In addition, FIG. 9 is a front view of the X platform and the suction cup. A measuring tool 50 used to detect the intensity distribution of the light beam is attached to the side surface of the chuck 10 that extends in the Y direction. Further, in the present embodiment, two measuring tools 50 are attached to the suction cup 10. However, one or three or more measuring tools 50 may be attached to the suction cup 10.

On the upper surface of the X stage 5, a plurality of laser power meters 51 are mounted corresponding to the respective beam irradiation devices 20. Each of the laser power meters 51 is disposed along the Y direction at the same interval as the interval between the heads 20a of the respective beam irradiation devices 20 including the illumination optical system 20b. The laser power meter 51 has an absorber on a light receiving surface, and the absorber includes a photodiode or a thermopile, and the light energy of the laser received by the light receiving surface. Converted to an electrical signal and output a detection signal corresponding to the intensity (power or energy) of the laser.

In the present embodiment, the intensity distribution of the light beams irradiated from the respective beam irradiation devices 20 is periodically detected using the measuring tool 50 attached to the suction cup 10 and the laser power meter 51 mounted on the X stage 5. When detecting the intensity distribution of the light beam, the main control device 70 of FIG. 1 controls the stage drive circuit 60 to move the X stage 5 in the X direction, thereby illuminating the respective laser power meters 51 mounted on the X stage 5 to the respective light beams. The device 20 is moved below the head 20a including the illumination optical system 20b. Further, the main control device 70 controls the stage drive circuit 60 to move the Y stage 7 in the Y direction, thereby accommodating the respective measuring tools 50 mounted on the suction cup 10 and the light illuminating device 20 for illuminating the intensity of the detected light beam. The head 20a of 20b moves below.

8 and 9 show the head 20a of the light beam irradiation device 20 that has moved each of the laser power meters 51 below the head portion 20a of each of the light beam irradiation devices 20 and has the intensity distribution of each measurement tool 50 toward the detection beam. The state of the movement below. In addition, in FIG. 8, the shutter 11 and the beam irradiation device 20 shown in FIG. 1 are abbreviate|omitted, and the head part 20a of the beam-beam irradiation apparatus 20 containing the irradiation optical system 20b is shown by the broken line.

Figure 10 is a perspective view of the measuring tool and the laser power meter. Further, in Fig. 10, only two laser power meters 51 located below the two measuring instruments 50 mounted on the suction cup 10 in Figs. 8 and 9 are shown. In the present embodiment, the measuring tool 50 is an elongated rod shape extending in the horizontal direction, and a portion attached to the side surface of the suction cup 10 is bent in an L shape. The portion of the measuring tool 50 that extends in the horizontal direction is disposed at a height of a focus of the light beam irradiated from the illumination optical system 20b of the light beam irradiation device 20, and shields the illumination optical system 20b from the light beam irradiation device 20 toward the laser power. A portion of the beam that is illuminated by 51.

11(a) and 11(b) are diagrams showing an example of a cross-sectional shape of a measuring tool. The surface of the measuring tool 50 that is incident by the light beam from the beam irradiation device 20 includes a part of the cylindrical surface or a curved surface similar thereto. In the example shown in Fig. 11 (a), the measuring tool 50 has a circular cross section. However, the present invention is not limited thereto, and the cross section of the measuring tool 50 may be an elliptical shape that is approximately circular. Further, as shown in FIG. 11(b), the cross section of the measuring tool 50 may be a shape obtained by cutting a circular shape or an elliptical shape similar to a circular shape. The measuring tool 50 can be made of, for example, a material such as tantalum carbide that absorbs a short-wavelength light beam that is irradiated from the light beam irradiation device 20 and has a low thermal expansion coefficient.

In the case where the cross section of the measuring tool 50 is assumed to be a quadrangle or a polygon, if the incident angle of the light beam largely changes, the area of the portion of the light beam shielded by the measuring tool 50 fluctuates. In the present embodiment, since the surface of the measuring tool 50 that is incident on the light beam from the beam irradiation device 20 is a part of the cylindrical surface or a curved surface that is a part of the cylindrical surface, even if the incident angle of the light beam largely changes, The area of the portion of the light beam that is shielded by the measuring tool 50 is also always substantially constant.

Fig. 12 is a view for explaining a method of detecting an intensity distribution of a light beam according to an embodiment of the present invention. In FIG. 7, the drawing control unit 71 of the main controller 70 supplies the inspection drawing data stored in the memory 72 to the DMD driving circuit 27 of the light beam irradiation device 20 whose head portion 20a is located above the measuring tool 50. The inspection drawing data used at this time is data in which all the lenses of the DMD 25 are inclined at the same angle, and all the light beams reflected by the respective lenses are irradiated to the light beam. 26a irradiation. In Fig. 12, the light receiving surface 51a of the laser power meter 51 is larger than the irradiation area 26a of the light beam indicated by a broken line. When the measuring tool 50 is not present, the light beam irradiated to the irradiation area 26a of the light beam is entirely composed of the laser power meter 51. The light receiving surface 51a is received.

In the present embodiment, the measuring tool 50 attached to the chuck 10 is disposed along the irradiation direction 26a of the light beam in the scanning direction (X direction) of the substrate 1 along the light beam from the beam irradiation device 20. When the intensity distribution of the light beam irradiated from the light beam irradiation device 20 is detected, the main control device 70 of FIG. 1 controls the stage drive circuit 60 to move the Y stage 7 in the Y direction, so that the respective measuring instruments 50 mounted on the suction cup 10 are oriented. Move in the Y direction. As a result, the measurement tool 50 shields a part of the light beam irradiated from the light beam irradiation device 20 in a direction orthogonal to the scanning direction of the light beam from the light beam irradiation device 20 to the substrate 1 in the irradiation region of the light beam (Y direction) ) and move.

The laser power meter 51 receives a light beam that is irradiated from the light beam irradiation device 20 and is partially shielded by the measuring tool 50, and outputs a detection signal corresponding to the intensity (power or energy) of the entire received light beam. In FIG. 7, the detection signals of the respective laser power meters 51 are input to the intensity distribution detecting circuit 52. The intensity distribution detecting circuit 52 detects the intensity of the light beam blocked by the measuring tool 50 and the position of the measuring tool 50 in accordance with the change in the intensity of the entire measuring beam of the intensity of the entire light beam detected by the laser power meter 51. Detect the intensity distribution of the beam.

13(a) and 13(b) are diagrams for explaining the relationship between the detected intensity of the laser power meter and the intensity of the light beam. In Fig. 13 (a), the horizontal axis represents the measuring tool The position of the Y direction of 50, and the vertical axis indicates the detection intensity of the entire light beam received by the laser power meter 51. If the intensity distribution of the light beam irradiated from the beam irradiation device 20 is uneven, the intensity of the light beam blocked by the measuring tool 50 differs depending on the position of the measuring tool 50. As a result, as shown in FIG. 13(a), the detected intensity of the entire light beam received by the laser power meter 51 changes in accordance with the movement of the measuring tool 50.

The intensity distribution detecting circuit 52 detects the intensity of the light beam shielded by the measuring tool 50 as shown in FIG. 13(a), based on the change in the detected intensity of the entire received light beam with the movement of the measuring tool 50. The position of the measurement tool 50. Further, the intensity distribution detecting circuit 52 detects the intensity distribution of the light beam based on the intensity of the light beam blocked by the measuring tool 50 and the position of the measuring tool 50. Fig. 13 (b) shows the intensity distribution of the detected light beam when the intensity of the light beam blocked by the measuring tool 50 changes as shown in Fig. 13 (a). In FIG. 13(b), the horizontal axis represents the position of the measuring tool 50 in the Y direction, and the vertical axis represents the intensity of the light beam.

The measuring tool 50 that shields a part of the light beam irradiated from the light beam irradiation device 20 moves in the irradiation region 26a of the light beam irradiated from the light beam irradiation device 20, and receives a light beam that is irradiated from the light beam irradiation device 20 and partially shielded by the measuring tool 50. And detecting the intensity of the entire received light beam, and detecting the intensity of the light beam blocked by the measuring tool 50 and the position of the measuring tool 50 according to the change in the intensity of the entire measuring light beam with the intensity of the entire measuring beam. Therefore, since the intensity distribution of the light beam is detected, unlike the passing light of the conventional slit, even if the angle of the light beam is slightly different, the amount of the light beam blocked by the measuring tool 50 hardly changes. Thereby, the intensity distribution of the light beam irradiated from the beam irradiation device 20 can be detected with high precision.

In particular, in the present embodiment, the elongated rod-shaped measuring tool 50 is disposed along the irradiation direction 26a of the light beam in the scanning direction (X direction) of the light beam from the light beam irradiation device 20 to the substrate 1, and the measuring tool 50 is oriented. Since the light beam from the light beam irradiation device 20 moves in the direction (Y direction) in which the scanning direction of the substrate 1 is orthogonal to each other, the intensity of the light beam in the direction in which the scanning direction of the substrate 1 is orthogonal to the scanning direction of the substrate 1 can be accurately detected. distributed.

The main control device 70 similarly detects the intensity distribution of the light beam irradiated from the light beam irradiation device 20 with respect to the other light beam irradiation device 20. In FIG. 7, the detection result of the intensity distribution detecting circuit 52 is input to the intensity distribution correcting unit 78 of the drawing control unit 71. The intensity distribution correction unit 78 creates intensity distribution correction data based on the intensity distribution of the light beam detected by the intensity distribution detection circuit 52, and limits the lens corresponding to the portion having a large intensity of the light beam by the created intensity distribution correction data. The number of times of driving further increases the intensity of the light beam in the entire irradiation area 26a of the light beam to correct the drawing data stored in the memory 72. Further, when the width of the light beam in the Y direction is different from the predetermined bandwidth in the intensity distribution of the detected light beam, the projection magnification deviates from the design value, and thus the DMD 25 in the beam irradiation device 20 or the projection lens 26 is included. The position of the illumination optical system 20b is adjusted.

Further, in the embodiment described above, the intensity of the light beam is detected using the laser power meter 51, but other detecting means for detecting the intensity of the light beam may be used.

14 to 17 are diagrams for explaining scanning of a light beam to a substrate. 14 to 17 show an example in which the entire substrate 1 is scanned by scanning the X direction of the substrate 1 four times by eight light beams from the eight beam irradiation devices 20. In FIGS. 14 to 17, the head portion 20a including the illumination optical system 20b of each of the light beam irradiation devices 20 is indicated by a broken line. The light beam irradiated from the head portion 20a of each of the light beam irradiation devices 20 has a bandwidth W in the Y direction, and is moved in the X direction by the X stage 5, and the substrate 1 is scanned in a direction indicated by an arrow.

Fig. 14 shows the first scanning, and the pattern is drawn in the scanning area indicated by gray in Fig. 14 by the first scanning in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the Y stage 7, and the substrate 1 is moved by only the same distance as the bandwidth W in the Y direction. Fig. 15 shows the second scanning, and the pattern is drawn in the scanning area indicated by gray in Fig. 15 by the second scanning in the X direction. When the second scanning is completed, the substrate 1 is moved in the Y direction by the Y platform 7 to move only the same distance as the bandwidth W in the Y direction. Fig. 16 shows the third scan, and the pattern is drawn in the scan area indicated by gray in Fig. 16 by the third scan in the X direction. When the third scanning is completed, the substrate 1 is moved in the Y direction by the Y platform 7, and the substrate 1 is moved by only the same distance as the bandwidth W in the Y direction. Fig. 17 shows a fourth scan, in which the pattern is drawn in the scanning area indicated by gray in Fig. 17 by the fourth scanning in the X direction, and the scanning of the entire substrate 1 is completed.

In addition, in FIGS. 14 to 17 , an example in which the substrate 1 is scanned four times and the entire substrate 1 is scanned is shown, but the number of scans is not limited. In this case, scanning of the substrate 1 in the X direction may be performed three times or less or five times or more, and the entire substrate 1 may be scanned.

According to the embodiment described above, the measuring tool 50 that shields a part of the light beam irradiated from the light beam irradiation device 20 is irradiated from the light beam irradiation device 20 while being moved in the irradiation region 26a of the light beam irradiated from the light beam irradiation device 20. A part of the light beam is shielded by the measuring tool 50, and the intensity of the entire received light beam is detected, and the light beam blocked by the measuring tool 50 is detected based on the change in the intensity of the entire measuring beam as a function of the movement of the measuring tool 50. The intensity and the position of the measuring tool 50 are such that the intensity distribution of the light beam is detected, whereby the intensity distribution of the light beam irradiated from the light beam irradiating device 20 can be accurately detected. Further, by correcting the unevenness of the intensity distribution of the light beam based on the detection result, the intensity distribution of the light beam irradiated from the light beam irradiation device 20 is preferably uniform, and the drawing quality can be improved.

Further, the elongated rod-shaped measuring tool 50 is disposed along the irradiation direction of the light beam on the substrate 1 along the scanning direction of the light beam from the light beam irradiation device 20, and the measuring tool 50 is directed to the light beam pair from the light beam irradiation device 20. The scanning direction of the substrate 1 is shifted in the orthogonal direction, whereby the intensity distribution of the light beam in the direction orthogonal to the scanning direction of the light beam to the substrate 1 can be accurately detected, and the light beam can be applied to the substrate 1 The intensity distribution of the light beam in the direction orthogonal to the scanning direction is preferably uniform.

Further, the surface of the measuring tool 50 that is incident on the light beam from the light beam irradiation device 20 is a part of the cylindrical surface or a curved surface similar thereto, whereby the light beam can be measured by the measuring tool 50 even if the incident angle of the light beam largely changes. Masked part The area of the minute is always substantially fixed, so that the intensity distribution of the light beam irradiated from the beam irradiation device 20 can be more accurately detected.

By performing exposure of the substrate by using the exposure apparatus or the exposure method of the present invention, the intensity distribution of the light beam irradiated from the light beam irradiation device can be made uniform, and the drawing quality can be improved, so that a high-quality display panel substrate can be manufactured.

For example, FIG. 18 is a flowchart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device. In the thin film forming step (step 101), a conductive film which is a transparent electrode for driving a liquid crystal is formed on a substrate by a sputtering method or a chemical vapor deposition (CVD) method or the like. A film such as an insulator film. In a resist coating step (step 102), a photoresist is applied by a roll coating method or the like, and a photoresist film is formed on the film formed in the film forming step (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film by the exposure device. In the developing step (step 104), the developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching step (step 105), the portion of the film formed in the film forming step (step 101) that is not covered by the photoresist film is removed by wet etching. In the peeling step (step 106), the resist film that functions as a mask in the etching step (step 105) is peeled off by the stripping liquid. The cleaning/drying step of the substrate is carried out as needed before or after these steps. These steps are repeated a plurality of times to form a TFT array on the substrate.

In addition, FIG. 19 is a flowchart showing an example of a manufacturing procedure of a color filter substrate of a liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by performing processes such as resist coating, exposure, development, etching, and lift-off. In the coloring pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This step is repeated for the red (R, Red), green (G, Green), and blue (B, Blue) coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. The cleaning/drying step of the substrate is performed as needed before, during or after these steps.

In the exposure step (step 103) in the manufacturing process of the TFT substrate shown in FIG. 18, the black matrix forming step (step 201) and the coloring pattern forming step in the manufacturing process of the color filter substrate shown in FIG. In the exposure processing of step 202), the exposure apparatus or the exposure method of the present invention can be applied.

26a‧‧‧Lighting area of the beam

50‧‧‧Measurement tools

51‧‧‧Laser Power Meter

51a‧‧‧Light receiving surface of laser power meter 51

X, Y‧‧ direction

Claims (8)

An exposure apparatus comprising: a suction cup supporting a substrate coated with a photoresist; a beam irradiation device comprising: a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on the drawing data, and an illumination passage An illumination optical system of the light beam modulated by the spatial light modulator; and a moving unit that relatively moves the suction cup and the light beam irradiation device; and the suction cup and the light beam irradiation device by the moving unit Moving relative to each other and scanning the substrate by a light beam from the beam irradiation device to draw a pattern on the substrate; the exposure device is characterized by comprising: an measuring tool that shields illumination from the beam irradiation device a portion of the light beam moves in an irradiation region of the light beam irradiated from the light beam irradiation device; and a detecting device receives a light beam that is irradiated from the light beam irradiation device and is partially shielded by the measuring tool, and detects the received light beam The strength of the whole; and the accompanying strength of the beam as a whole received by the detection device Measuring said changes in the movement of the tool, the tool and measuring the intensity of the beam shielding position detected by the measurement tool, thereby detecting the intensity distribution of the light beam, and based on the detection result of the correction of the unevenness of the intensity distribution of the beam. The exposure apparatus according to claim 1, wherein the measuring tool is an elongated rod shape, and the measuring tool is directed to the light beam along a scanning direction of the substrate from a beam of light from the beam irradiation device. The irradiation region is disposed, and moves toward a direction orthogonal to a scanning direction of the substrate from the light beam irradiation device. The exposure apparatus according to claim 1 or 2, wherein the measuring tool is such that a surface from which the light beam from the light beam illuminating device is incident includes: a part of a cylindrical surface, or approximate to the cylinder The surface of a part of the surface. An exposure method for supporting a substrate coated with a photoresist with a chuck to relatively move the chuck with a beam irradiation device, the beam irradiation device comprising: a spatial light modulator for modulating a light beam, driving the device based on the drawing data a driving circuit of the spatial light modulator and an illumination optical system that illuminates a light beam modulated by the spatial light modulator, and scanning the substrate by a light beam from the light beam irradiation device to draw a pattern on the substrate; The exposure method is characterized in that a measuring tool that shields a part of a light beam emitted from the light beam irradiation device is moved from an irradiation region of a light beam irradiated from the light beam irradiation device while receiving the light beam irradiation device Irradiating and shielding a part of the light beam by the measuring tool, and detecting the intensity of the received light beam as a whole, and detecting the light beam blocked by the measuring tool according to the change of the intensity of the received light beam as a whole of the measuring tool The intensity of the measurement tool and the position of the measuring tool, thereby detecting the intensity distribution of the beam and based on Corrects the measurement result of uneven distribution of intensity of the beam. The exposure method according to claim 4, wherein the elongated rod-shaped measuring tool is disposed along a scanning direction of the light beam from the light beam irradiation device to the irradiation region of the light beam. And the measuring tool is moved in a direction orthogonal to a scanning direction of the substrate from the light beam irradiation device. The exposure method of claim 4, wherein the measuring means is such that a light beam from the beam irradiation device is incident The surface is: a portion of the cylindrical surface or a curved surface that approximates a portion of the cylindrical surface. A method of manufacturing a panel substrate for display, characterized in that exposure of a substrate is performed using an exposure apparatus according to any one of claims 1 to 3. A method of manufacturing a panel substrate for display, characterized in that exposure of a substrate is performed using an exposure method according to any one of claims 4 to 6.