TW200817846A - Drawing device and alignment method - Google Patents

Abstract

To provide a pattern drawing device and an alignment method by which drawing can be carried out at an accurate position on a substrate even when a positional relation between a light irradiating unit and an alignment camera changes, without using a high-performance driving mechanism for the alignment camera. The pattern drawing device 1 has functions of detecting a shift amount in the relative position of respective alignment cameras 41 to 44 with respect to pulse light projected from an optical head 32 and correcting an alignment amount of a substrate 9 and a starting position of drawing on a substrate 9 based on the detected shift amount. Even when the positional relation between the pulse light projected from the optical head 32 and respective alignment cameras 41 to 44 varies, drawing can be carried out while correcting the varied amount. Therefore, the pattern drawing device 1 is capable of drawing a pattern at an accurate position on the substrate 9.

Description

[Technical Field] The present invention relates to a drawing device, a method of dicing a substrate in the drawing device, a drawing method, and a substrate processing system, which is provided for a liquid crystal display device Flat panel display (FPD, panel display) such as a color filter substrate, a liquid crystal display device, or a plasma display device. A specific pattern is drawn by a photosensitive material formed on a substrate such as a glass substrate, a semiconductor substrate, or a printed substrate.

先前 [Prior Art] Heretofore, in the manufacturing step of the substrate, a pattern drawing device which draws a specific pattern on the surface of the substrate by irradiating light to the photosensitive material formed on the surface of the substrate is used. The prior pattern drawing device includes a platform that moves the substrate while holding the substrate in a horizontal posture, and an optical head that illuminates a surface of the substrate with a specific pattern; and the substrate is moved by the surface - the surface is illuminated by the optical head Light, while the specific pattern is traced to the upper surface of the substrate. The composition of the prior pattern drawing device is disclosed, for example, in the patent. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-329523 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei 5-15 No. 175 (Invention) [The problem to be solved by the invention] Calibrate the position and orientation of the substrate on the camera. Then, the camera is used to detect and maintain, and the platform is moved according to the position and posture of the substrate taken by the self-calibrating camera, and the substrate is calibrated. However, when the drawing material input to the pattern drawing device changes, the position of the irradiation light of the optical head or the position of the calibration camera above the stage must be changed by the positional relationship of the image. Further, there are cases in which the positional relationship of 4 changes due to a change in duration. As described above, when the positional relationship between the optical head and the calibration camera is shifted, even if the substrate is calibrated using a calibration camera, the exact position on the substrate cannot be drawn. Patent Document 1 discloses a device for adjusting the position of a calibrator using a reference mask. However, in the configuration of Patent Document 1, in order to adjust the position of the calibrator itself, it is necessary to use a high-performance drive mechanism for accurately shifting the position of the calibrator. The present invention has been made in view of such circumstances, and a third object thereof is to provide a driving mechanism that does not require the use of a high-performance driving camera, and even when the positional relationship between the light-irradiating portion and the calibration camera changes, A pattern drawing device and a calibration method for drawing the exact position on the substrate. On the other hand, in the pattern drawing device, for example, a black matrix and a plurality of alignment marks for positioning are formed in advance by a uniform exposure process or the like on the surface of the substrate for color filter to be processed. Further, the term "black matrix" refers to a crystal black frame surrounding pixels of red (R), green (G), and blue (b) colors of a color filter. Then, the previous pattern drawing device detects the position of the calibration mark formed at the four corners of the substrate, corrects the position or inclination of the substrate according to the position, and draws a specific pattern corresponding to the pixel in the black matrix frame. . 121799.doc 200817846 However, in recent years, in order to manufacture a plurality of color filters using one substrate, the black matrix is sometimes exposed to a plurality of regions on the surface of the substrate. In such a case, the position of the black matrix may cause a slight shift, or tilt, in each of the exposed areas. However, in the above prior method, the drawing position of the optical head is determined only based on the alignment marks formed at the four corners of the substrate. Therefore, the pattern is not necessarily depicted in the optimum position in all of the exposed areas. In the -partially exposed area, there is a possibility of a shift between the black matrix and the depicted pattern. The present invention has been made in view of such circumstances, and a second object thereof is to provide a pattern in which each of the reference patterns such as a black matrix is formed in a plurality of regions on the surface of the substrate. The pattern device, the pattern method, and the substrate processing system in the area. [Technical means for solving the problem] = The problem of claim 1, the invention of claim 1 is a drawing of a specific pattern of the photosensitive material formed on the photosensitive material, characterized in that the upper surface of the substrate is irradiated with light of a specific pattern. = in the above platform wood < 7t, ten $ drive unit, 1 ^ platform and the above-mentioned light irradiation portion relative movement ' · calibration mechanism, which has a substrate position /, Ψ θ θ ^ potential held on the platform Detecting the calibration camera and calibrating the above-described translation amount detecting mechanism with respect to the light irradiation portion, wherein the m 1 earth plate '4 is only + the offset of the relative position of the camera relative to the ^; and the 1st repair, The invention is the drawing device of claim 1, wherein the offset detecting mechanism includes: the first detecting mechanism a second detection mechanism that detects a positional offset between the correction mark and the calibration camera; and an operation Institution, based on the first inspection The amount of positional shift detected by the measuring means and the second detecting means calculates the amount of shift between the relative position of the returning camera and the light irradiating portion. The invention of claim 3 is the drawing device of claim 2, wherein the correction mark is formed on the platform, and the platform driving unit switches the following two types by moving the flat: relative movement of the dead light irradiation unit Status: The above-mentioned parent is marked in the arrangement of Bu Zhu, first a shot. The state below the 卩 and the above-mentioned correction mark are placed under the calibration camera. The invention of claim 4, wherein the apparatus of claim 3 further includes an ampoule detecting mechanism that detects a posture of the platform, wherein the platform driving unit corrects the above based on information detected by the posture detecting mechanism The security of Pingli, the surface makes the above platform move. The invention of claim 5 is the drawing device of claim 4, further comprising: a positive camera ' disposed under the correction mark, and wherein the first ',' mechanism photographs the illumination of the light irradiation portion by using the correction camera Depicting the correction mark 'and detecting the above-mentioned illumination based on the acquired image::: positional offset of the obscured mark 'the second detecting means image and the second: the quasi-camera photographing the above-mentioned correction mark, and according to the acquired The above-mentioned correction mark is offset from the position of the above-mentioned calibration camera. 121799.doc The invention of claim 6 is the description of claim 5, wherein the scooping extension is configured to align the light-emitting position of the light-irradiating portion.哔 哔 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The mechanism, the farmer, and the L f machine # & , adjust the light irradiation unit based on the image of the light irradiation unit. The invention of claim 8 is the drawing device of claim 7, further comprising: a quasi-camera driving unit that moves the calibration camera based on a drawing material of the substrate as a processing material. The invention is a calibration method characterized in that it is irradiated with light from a surface of a substrate held on a platform by a light-irradiating portion, and a specific pattern is drawn to the upper surface of the substrate. In the drawing device, the calibration camera is used to capture the substrate on the platform, and the substrate is mounted on the substrate, and the substrate on the platform is calibrated according to the acquired image. The calibration method includes: a step of aligning the relative position of the calibration camera with respect to the light illuminating portion of the basin 1 and a second step of calibrating the platform according to the offset detected in the first step and the image The substrate. The invention of the item 10 is a request item! The drawing device, wherein the plurality of reference patterns are individually formed in a plurality of regions on the substrate, and further comprising: a position detecting mechanism that detects the plurality of reference patterns in each of the regions held on the substrate of the platform And a second correction mechanism that corrects the light irradiation position of the light irradiation unit based on the positions of the plurality of reference patterns detected by the position detecting means. The invention of claim 1 wherein the position detecting means detects the position of the plurality of reference patterns based on a plurality of positioning marks formed in each of the plurality of regions. . The invention of claim 12, wherein the light-irradiating portion has an emitting portion that emits light toward a surface of the substrate, and a diaphragm portion that partially shields light emitted from the emitting portion to form the specific pattern The light is corrected by adjusting the position of the diaphragm portion by the second correction mechanism. The invention of claim 12, wherein the light-irradiating portion has a plurality of light-emitting heads, and the second correcting mechanism individually adjusts a position of each of the plurality of light-irradiating heads. The invention of claim 14 is the drawing device of claim 13, wherein the second correction mechanism juice calculates a positional shift amount of the plurality of reference patterns from the standard position in each of the plurality of regions, and based on the average value of the plurality of regions Correct the position of the light. The invention of claim 13 is the drawing device of claim 13, wherein the second correcting means calculates a positional shift amount of the plurality of reference patterns from the standard position in each of the plurality of regions, and based on the calculated position The offset ΐ 'corrects the illumination position of the light in each of the plurality of regions. The invention of claim 15 is the drawing device of claim 15, wherein the second correcting means adjusts the light irradiation position of the light-irradiating portion immediately before each of the plurality of regions on the substrate reaches the drawing position. The invention of claim 17 is the drawing device of claim 13, wherein the above-mentioned 121799.doc -12-200817846 2 correction mechanism has the above plurality of

The plurality of reference fields are calculated as early positions, and each of the above-mentioned complex reference patterns is calculated from the standard position „ oblique angle, and the illumination position of the light is continuously corrected according to the calculated inclination angle. The edge method is characterized in that the special pattern is traced on the light-forming material on the substrate, the substrate has a plurality of reference patterns individually formed in a plurality of regions, and the method of drawing includes : a first step of detecting a phase offset of the phase of the calibration camera relative to the light illuminating portion 12, wherein the step of holding the substrate on the platform; the third step is based on the deviation detected in the above step i The amount of shift and the image obtained by the above 2 camera are used to calibrate the substrate on the platform; 4:

a step of detecting a position of the plurality of reference patterns in each of the regions held on the substrate of the platform; and a fifth step, wherein the position of the plurality of reference patterns detected according to the fourth step is When the irradiation position of the light is corrected, the light of the specific pattern is irradiated onto the substrate on the stage by the light irradiation unit. The invention of claim 19 is the method of claim 18, wherein in the third step, the substrate held on the platform is corrected to be tilted in the plane. The invention of claim 20 is a substrate processing system, comprising: a pattern drawing device for drawing a specific pattern on a photosensitive material on a substrate, the substrate having a plurality of reference patterns individually formed in a plurality of regions, and a pre-processing device that performs pre-processing on the substrate before the processing of the pattern drawing device; and the pre-processing device includes: a position detecting mechanism that detects the plurality of 121799.doc -13 in each of the regions on the substrate - 200817846 = Alignment'. The pattern drawing device includes: a substrate holding a ten to 'first', a shooting portion, a pair of light that is held on the platform: a temple pattern; and a platform driving unit that causes the platform: ::= 2 relative movements; a calibration mechanism comprising a calibration camera for detecting the position and posture of the substrate held on the flat chamber, the illumination unit calibrating the substrate on the platform; the offset detecting mechanism, The deviation of the camera relative to the relative position of the light-irradiating portion is: Η: a positive mechanism, which is checked according to the offset detecting mechanism Root vent Γ ^ ', the drawing position correcting substrate; a second correction means: the aforementioned plurality of reference Diagrams "K _L said position detecting means detects the position of the' corrected portion of the light irradiating the light irradiation position. According to the invention of claim 1, the edge detecting device includes: an offset detecting means that detects a deviation (four) of a relative position of the calibration camera/lighting unit with respect to the light irradiation unit; and The correction mechanism 'corrects the drawing position on the substrate based on the offset 1 measured by the offset detecting means. Therefore, even when the positional relationship between the light-irradiating portion and the calibration camera changes, the edge-change processing can be performed while correcting the amount of change. Thus, the plug-in device of the present invention can depict the exact location on the substrate. Further, since the drawing position on the substrate is corrected without correcting the position of the calibration camera itself, it is not necessary to use a precise driving mechanism for the calibration camera. In particular, according to the invention of claim 2, the offset detecting mechanism includes: the first detecting mechanism of the detecting unit 'the detecting portion of the light detecting unit and the specific correction mark 121799.doc 200817846 shifting the second private measuring mechanism, the detection correction The amount of positional deviation detected by the marking mechanism is used to calculate the offset of the relative position of the ridge and the second illuminating unit. Therefore, the relative position of the calibration camera relative to the light irradiation portion can be detected relative to: I: In particular, according to the invention of claim 3, and the platform disk cover; ± & redundantly formed on the platform In addition, the platform and the illumination are replaced by the following two states: the correction mark is arranged in the light irradiation = the above-mentioned correction mark is placed in the state of calibration and only under the state of the camera. Since the mechanism and the second detecting mechanism can accurately detect the positional shifts, in particular, according to the invention of claim 4, the striking device further includes a secondary potential detecting mechanism to detect the posture of the platform, and the platform driving unit is in a hurry Correct the posture of the platform by detecting the information detected by the mechanism, _ face shift = platform. Therefore, the correction mark on the platform can be accurately moved between the lower side of the light irradiation unit and the lower side of the calibration camera. In particular, according to the invention of claim 5, the drawing device further includes a correction camera set under the correction mark, and the fourth mechanism photographs the illumination light of the light irradiation portion and the correction mark by the μ camera, and according to the acquired image. On the other hand, the position detecting amount of the light irradiation unit and the correction mark is detected, and the second detecting unit captures the correction mark by the calibration camera, and detects the positional deviation amount between the correction mark and the calibration camera based on the acquired image. ^ This, you can use the calibration camera and the calibration camera to accurately detect the offset of each of the 121799.doc -15- 200817846. In particular, according to the apparatus for accommodating clothes, the light illuminating unit is invented, and the drawing device further includes positioning of the illuminating light on the substrate at a specific position. Depicted by the location of the ^ ^ ruler. In particular, according to the invention of claim 7, the camera is smuggled from the corporal, and then illuminates the light according to the image obtained by the illuminating unit; and the image obtained by the camera and the σ camera. The location of the illumination. 4, the actual measurement data of the light, the accurate positioning of the illumination light, in particular, according to the request, the drawing device further includes the calibration >, /, according to the substrate to be processed Depicting the capital; the bucket moves the calibration camera. , Μ ^ ^ ^ ^ mouth, can make the calibration camera move to different according to the data. ^ ^ 杈 位置 position. Further, the adjusted photographic offset after the movement is detected by the offset detecting means and corrected by the erector correction, so that it is not necessary to use the precise driving mechanism for the calibrating camera driving section. According to the invention of claim 9, the calibration method includes: a first step of detecting an offset of the relative position of the calibration camera with respect to the light irradiation portion; and a second step of the offset detected according to the first step Quantitatively and calibrate the image taken by the camera's right-weighted substrate. Therefore, even when the positional relationship between the light-irradiating portion and the calibration camera changes, the substrate can be calibrated while the inside of the lens is being adjusted. Therefore, the exact position on the substrate can be depicted. Further, according to the invention of claim 10, the drawing device further includes a detection of a plurality of "in accordance with the position detecting means" based on the substrate held by the position detecting means "on the platform" The position of the pattern; and the position of the plurality of reference patterns detected by the second correction mechanism mechanism, and the light irradiation position of the light irradiation unit is corrected. Therefore, even if the reference pattern is shifted or tilted in the respective regions on the substrate, the pattern can be drawn at an appropriate position in each region. In particular, the position detecting means according to the invention of the request item u detects the positions of the plurality of reference patterns based on a plurality of positioning marks formed in each of the plurality of areas. Therefore, the position of the reference pattern can be easily and accurately detected. In particular, according to the invention of claim 12, the light-irradiating portion has an emitting portion that emits toward the surface of the substrate and a diaphragm portion that partially blocks the light emitted from the emitting portion to form a light of a specific pattern, and the second portion The correction mechanism corrects the irradiation position of the light by adjusting the position of the aperture portion. Therefore, the irradiation position of the light of the light irradiation portion can be easily corrected. In particular, according to the invention of claim 13, the light-irradiating portion has a plurality of light-emitting heads, and the second correcting mechanism individually adjusts the positions of the diaphragm portions provided in the respective plurality of light-irradiating heads. Therefore, even when the positional shift amount and the tilt angle of the respective regions on the substrate are different, the light irradiation position can be accurately corrected based on the positional shift amount and the tilt angle of each region. In particular, according to the invention of claim 14, the second correcting means calculates the positional deviation 复 of the plurality of reference patterns from the standard position in each of the plurality of areas, and corrects the irradiation position of the light based on the average value. Therefore, it is possible to prevent the irradiation position of the light in a part of the area from being largely shifted. 121799.doc • 17 - 200817846 In particular, according to the invention of claim 15, the second correcting mechanism calculates the positional deviation of the plurality of reference patterns from the standard position in each of the f-numbered regions and calculates according to the tenth The position offset is used to individually correct the illumination position of the light with a plurality of regions as the military position. Therefore, the pattern can be drawn at a more appropriate position in all areas on the substrate. In particular, according to the invention of claim 16, the second correcting means adjusts the light irradiation position of the light irradiation portion before each of the plurality of regions on the substrate reaches the drawing position. Therefore, the position of the light can be adjusted by the position on the substrate where the pattern is not drawn. In particular, according to the invention of claim 17, the second correcting means calculates the inclination angle of the plurality of reference patterns from the standard position in each of the plurality of regions, and continuously corrects the irradiation position of the light based on the calculated inclination angle. Therefore, even when the 'reference pattern' is formed obliquely in the partial region on the substrate, the pattern can be drawn while correcting the irradiation position of the light along the inclination. Further, according to the invention of claim 18, the drawing method comprises: an i-th step of detecting an offset of the relative position of the calibration camera with respect to the light-irradiating portion; a step of holding the substrate on the platform; and a third step Substrate the substrate on the platform according to the offset detected in the first step and the image obtained by the calibration camera; and in the fourth step, detecting a plurality of reference patterns in each region held on the platform And the fifth step: the surface of the substrate on the platform is irradiated with light of a specific pattern by the light irradiation portion according to the position of the plurality of reference (4) detected in the fourth step, 'correction light irradiation position'. Therefore, even when the reference pattern is displaced or tilted in units of the 121799.doc • 18-200817846 area on the substrate, the pattern can be snatched at an appropriate position in each area. In particular, according to the invention of claim 19, in the third step, it is corrected that the substrate held on the platform is tilted in the horizontal plane. Therefore, in the fourth step, the positions of the plurality of reference patterns can be reliably and accurately detected. Further, according to the invention of claim 2G, the pre-processing apparatus includes a position detecting mechanism that detects a position of a plurality of reference patterns in each area on the substrate, the pattern drawing device includes a platform for holding the substrate, and a light irradiation unit And illuminating a surface of the substrate on the platform to illuminate a specific pattern of light; and a platform driving portion that causes the platform to emit light and π.卩 relative movement; calibration mechanism, which includes a calibration camera for detecting the position and the proper position of the substrate held on the platform, and calibrating the flat table with respect to the light irradiation portion; the substrate on the early drying; offset detecting machine= - 'The offset of the relative position of the money measuring and calibrating camera relative to the light illuminating unit. The riddle 1 correction mechanism' corrects the drawing position on the substrate according to the offset detected by the offset detecting means. ^ 9彳罝And the 2nd correction mechanism corrects the light irradiation position of the light irradiation unit based on the position of the reference pattern detected by the position detecting means.闵 + ^ , 1 1 Therefore, even if the reference pattern is shifted or tilted in the ? field on the substrate, the pattern can be drawn at an appropriate position in each area. [Embodiment] <:1·First Embodiment> Hereinafter, an embodiment of the first embodiment of the present invention will be described with reference to the drawings. Further, in each of the drawings referred to in the following description, . ^ ^ r is a common coordinate orthogonal coordinate system for clarifying the positional relationship and the operation direction of each member. 121799.doc -19.200817846 <1-1, Configuration of Pattern Drawing Apparatus> FIG. 1 and FIG. 2 are a side view and a plan view showing a configuration of a pattern drawing apparatus according to a third embodiment of the present invention. The pattern drawing device is configured to draw a specific pattern on the surface of the glass substrate (hereinafter, simply referred to as r substrate) 9 for the color filter in the step of manufacturing the color filter of the liquid crystal display device. . As shown in FIG. 2 and FIG. 2, the pattern drawing device 丨 is provided with a platform 1 for holding the substrate 9, a driving unit 2B connected to the stage 10, a head 30 having a plurality of optical heads 32, and a plurality of calibration cameras. 4 1 to 4 4 The cymbal 10 has a flat outer shape and is a holding portion for placing and holding the substrate 9 in a horizontal posture on the upper surface thereof. On the upper surface of the stage 10, a plurality of suction holes (not shown) are formed. Therefore, when the substrate 9 is placed on the flat 2:10, the substrate 9 can be fixed and held on the upper surface of the stage 10 by the suction pressure of the suction holes. The through holes 11 and 12 are formed in the vicinity of the two corners on the side of the platform 10 (outside the substrate holding region), and are vertically penetrated through the land. Fig. 3 is an enlarged plan view showing the through holes U, 12 formed in the vicinity of the corner portion of the stage 10. Further, Fig. 4 is a longitudinal sectional view of the stage of Fig. 3 cut by the IV-IV line. As shown in Figs. 3 and 4, light-transmitting plates 1 la and 12a are attached to the upper portions of the through holes 11 and 12, respectively. Correction marks CM1 and CM2 serving as a reference for position measurement in the following correction processing are attached to the light-transmitting plates lia and i2a, respectively. The correction marks CM1 and CM2 are formed on the surfaces of the light-transmitting plates 11a and i2a by a light-shielding material. Further, correction cameras 121799.doc -20 - 200817846 llb, 12b are provided inside the through holes 11 and 12, respectively. The correction cameras 11b and 12b are disposed in the through-holes 12 toward the upper side, and the centers of the correction marks CM1 and CM2 are respectively located at the center of the field of view of j (or at least within the field of view). That is, when the platform H) is moved, the positional relationship between the corrected cameras m, 12b and the correction marks cmi and cm2 is also fixed' without change. Referring back to Fig. 1 and Fig. 2, the driving unit 20 is a mechanism for moving the stage 10 in the main scanning direction (axial direction), the refining direction (the x-axis direction), and the rotation direction (the rotation direction around the z-pulling). The drive unit 20 has a rotation mechanism 21' for the platform rotation, a support plate 22 for rotatably supporting the platform 1G, a sub-scanning mechanism for moving the support plate 22/σ in the drawing direction, and 23 pairs of sub-scanning (four) support. The plate 22 supports the wire 24; and the main scanning mechanism that moves the bottom plate 24 in the main sweeping direction. The rotary mechanism 21 has a linear motor 2U including a rotor that is ruptured at the end of the Y-side of the flat hall 10, and a die that is laid on the upper surface of the support plate. Further, a rotating shaft 21b is provided between the lower surface side of the central portion of the platform 1 and the support plate 22. Therefore, when the linear motor 仏 is operated, the rotor moves in the X-axis direction along the stator, and the stage 1 旋转 rotates within a certain angle range centering on the rotating shaft 21b on the support plate 22. The sub-scanning mechanism 23 has a linear motor 23a including a rotor mounted on the lower surface of the support plate 22, and a stator laid on the upper surface of the bottom plate 24. Further, between the support plate 22 and the bottom plate 24, a pair of guide portions 23b extending in the sub-drawing direction are provided. Therefore, when the linear motor Ua is made, the support plate 22 will move along the guide portion 23b on the bottom plate 24 in the sub-scanning direction. 121799.doc -21 - 200817846 The main scanning mechanism 25 has a linear motor 25a including a rotor mounted on the lower surface of the bottom plate 24, and a stator laid on the base 60 of the main assembly. Further, between the bottom plate 24 and the base 6A, a pair of guiding portions 25b extending in the main scanning direction are provided. Therefore, when the linear motor 25a is operated, the bottom plate 24 is moved in the main scanning direction along the guide portion 25b on the base 6. As shown in Fig. 2, on the side of the platform 1A, a posture detecting portion 26 for detecting the posture of the platform 1A is provided. The posture detecting unit 26 includes a laser length measuring device 26a for measuring the side of the platform 1〇 and the side by the plurality of beam lengthening laser beams L obtained by branching the laser beam emitted from the laser length measuring device 26a. The distance, ', based on the acquired distance, the posture of the detection platform 1 (tilt) the following control unit 50 (see FIG. 7), and the rotation mechanism 21 is made based on the information acquired from the posture detecting unit 26, The sub-scanning mechanism 23 and the main scanning mechanism 25 operate to correct the posture of the platform 1 while moving the platform 1〇. Fig. 5 is a diagram showing an example of the posture control of the platform 1 which is not so. When the flat hall 10 is to be moved in the main scanning direction, if only the main scanning mechanism 25 is operated without correction, the movement of the stage 10 is shifted by the main scanning mechanism due to mechanical errors of the main scanning mechanism ( Figure 5 is the chain state). The driving unit 20' of the present embodiment detects the offset of the platform i by the posture detecting unit 26, and operates the rotating mechanism 2A and the sub-scanning mechanism 23 based on the detected information to correct the platform 1. In the posture of the cymbal, the platform 1 〇 is accurately moved in the main scanning direction (the solid line state of FIG. 5). Referring back to Fig. 1 and Fig. 2, the head 30 is a mechanism for illuminating the surface of the substrate 9 which is held on the flat surface of the base plate 9129.doc -22.200817846 $10. The head 30 ... has a frame wood 3 1 and a plurality of optical yushou 32, and the frame 31 is placed outside the platform and the driving portion 2 — - "Sigh on the base σ 60, the plurality of optical heads 32 The laser beam is also attached to the frame 31 at equal intervals in the sub-scanning direction. One laser oscillator 34 is connected to each of the optical heads 32 via the illumination optical system. Further, on the laser oscillator 34, The pile drive is connected to the laser drive unit 35. Therefore, when the laser drive unit 3 5 is operated, the laser oscillator 34 is oscillated from the laser oscillator 34 to generate a pulse and oscillate. The generated pulsed light passes through the illumination optical system optical head 32. The inner surface of each of the optical heads 32 is provided with an emission unit 36 for emitting the pulsed light introduced from the illumination pre-conversion system 33 downward. The aperture unit 37 is configured to shield a portion of the pulsed light to form a light beam of a specific pattern; and the projection prior art 38' illuminates the light beam to the upper surface of the substrate 9. The pulsed light emitted from the emitting portion 36 passes through the aperture When the unit 37 is partially shielded, the light beam as a specific pattern is incident on the cast. The optical system 38. Then, the pulse light of the projection optical system 38 is irradiated onto the upper surface of the substrate 9, whereby a specific pattern is struck on the photosensitive material (color resist) coated on the upper surface of the substrate 9. The plurality of optical heads 32 are arranged at equal intervals (for example, the interval _ _) in the sub-scanning direction. When the surface moves the platform 1G in the main scanning direction, and the surface is irradiated with pulsed light from each of the optical heads 32, the exposure width can be specified ( For example, the % face width) draws a plurality of patterns on the upper surface of the substrate 9 in the main scanning direction. When the drawing of the j-th direction in the main scanning direction is finished, the pattern drawing device 1 moves the stage 10 in the sub-scanning direction to expose the exposure width, so that the platform 1G is again moved along the main scanning side 121799.doc -23-200817846 and the pulse light is irradiated from each of the optical heads 32. Thus, the pattern drawing device 1 moves the substrate 9 in the sub-scanning direction on the one hand in the exposure width of the optical head 32, The pattern drawing in the main scanning direction is repeated a certain number of times (for example, four times), whereby a pattern for the color filter is formed on the entire upper surface of the substrate 9. The optical head camera 27 is provided to capture pulsed light irradiated from each optical head 32. The optical head camera 27 is movable along the guide in the sub-scanning direction, and the guide 28 is mounted via the carriage 29. At the end of the +Y side of the bottom plate 24. When the optical head camera 27 is used, the bottom plate 24 is positioned such that the optical head camera 27 is positioned below the head 3 (the state of Figs. 1 and 2). Then, the optical head camera 27 is moved along the guide rail 28 in the sub-scanning direction to take the pulsed light irradiated from the respective optical heads 32. Further, as a drive mechanism for moving the optical head camera 27 on the guide rail 28, for example, a linear motor is used. Fig. 6 is a view of a plurality of optical heads 32 viewed from below (from the side of the optical head camera 27). The optical head camera 27 captures the pulsed light PL irradiated from each of the optical heads 32, and acquires information that the pulse light in the optical head 32 is wide, the distance between the optical heads 32, the distance between the adjacent optical heads 32, and the respective opticals. The position of the main scanning direction of the head 32, and the amount of light of each pulse light. Then, the acquired information is transmitted to the following control unit 5 (refer to the figure. The optical head camera 27 may be constituted by, for example, a CCD (Charge C〇upled) camera, or may be a combined CCD camera and The structure of the light quantity sensor. As shown in Fig. 6, the actuator 121799.doc -24-200817846 3 9 ' δ hai actuator 3 9 is connected to each optical head 32. The position of the pulsed light pl to be irradiated. The actuator 39 can be realized, for example, as a mechanism for adjusting the position of the aperture unit 37 in the optical head 32 using a linear motor. Further, the actuator 39 can be disposed by The two aperture plates in the upper and lower aperture units 37 are slidably moved to adjust the width of the light transmission region, and the line width of the pulse light pL is adjusted. The following control unit 50 (refer to FIG. 7) is used according to the optical camera 27 The actuator 39 is operated to correct the position or line width of the pulse light PL irradiated from each optical head 32. Further, the control unit 5 adjusts the projection based on the information acquired from the optical head camera 27. Optical system 38 and The optical system 33 corrects the distance between the pulse light and the amount of light irradiated from each of the optical heads 32. Returning to Fig. 1 and Fig. 2, the calibration cameras 41 to 44 are used to capture the calibration marks am1~ formed on the upper surface of the substrate 9. The imaging mechanism of AM4 (see Fig. 2A) is connected to the calibration cameras 41 to 44, respectively, with drive mechanisms 41a to 44a as shown in Fig. 2. When the calibration cameras 41 to 44 are used, they are formed on the substrate 9. The four corner calibration marks AM1 to AM4 are located below each of the calibration cameras 41 to 44, and the drive unit 2 is operated to position the stage 1A, and the drive mechanisms 41a to 44a are operated to align the cameras 4 to 44. The calibration cameras 41 to 44 respectively capture the calibration marks AM1 to AM4 on the substrate 9 and acquire the coordinates of the calibration marks AM1 to AM4. Further, the pattern drawing device 具备 includes the control unit 50 in addition to the above configuration. 7 is a block diagram showing a connection structure between the above-described respective portions of the pattern drawing device 与 and the control unit 5A. As shown in Fig. 7, the control unit 5A and the above-described correction cameras lib, 12b, linear motor 21 &;, 23a, 25a, posture detecting unit 121799.doc -25- 200817846 / I to the head camera 27, the laser driving portion 35, the actuator 39, the calibrating machines 41 to 44 '卩 and the driving mechanisms 41a to 44a The control unit 50 can be connected, for example, by a computer having a CPU (Central Processing Unit) and a memory, and can be installed in a Lei Yueyi φ and a battery. The operation is performed, and the above lines are controlled. <1-2·Correction Process> The process of measuring the shift in the positional relationship between the optical head 32 and the calibration camera 41 in the pattern drawing device having the above configuration (杈正麄) deal with). The correction processing is executed prior to the drawing processing when the position of the pulse PL from the optical head illuminating or the position of the calibration camera 4 is changed due to a change in the drawing data or a change in duration. 8 to 10 are flowcharts showing the flow of the correction processing in the pattern drawing device 1. Further, Fig. U to Fig. 17 are diagrams showing the state of the pattern drawing device 1 in each stage of the correction processing. In the pattern drawing device ,, when the correction processing is performed, first, the actuator 39 of each optical head 32 is operated in accordance with the drawing data to be used in the next drawing processing, and the pulse light PL of each optical head 32 is irradiated. The position is positioned at a substantially specific location (step s丨丨). Next, the pattern drawing device 1 operates the main scanning unit 25, and moves the bottom plate 24 so that the optical head camera 27 is disposed below the head portion 30. Then, while the optical head camera 27 is moved in the sub-scanning direction along the guide rail, the pulse light PL irradiated from each optical head 32 is taken, and the following information is obtained, that is, the line width of the pulse light PL in the optical head 32, and each The distance between the optical heads 32, the distance between the adjacent optical heads 32, the position of the main scanning side 121799.doc -26-200817846 of each optical head 32, and the amount of light of each pulse light PL (step S12, state of FIG. ).

The pattern drawing device 1 operates the actuators 39 based on the information information acquired from the optical head camera 27, and corrects the position or line width of the pulse light PL irradiated from each of the optical heads 32. Further, the patterning device adjusts the projection optical system 38 and the projection optical system 33 based on the information information acquired from the optical head camera 27, and corrects the distance between the pulsed light pL and the amount of light irradiated from each of the optical heads 32 (step S13). . By the above steps su to S13, the position, the line width, and the amount of light of the pulse light pL irradiated from the respective optical heads 32 of the head portion 30 are brought into an appropriate state, thereby completing the adjustment of the head portion 30 itself. Then, the pattern drawing device 1 operates the drive mechanisms 41a to 44a based on the drawing data to be used in the next drawing process, and positions each of the calibration cameras 41 to 44 at a substantially specific position (step S14). Then, the driving unit 2 is operated, and the light-transmitting plate 11a is disposed substantially below the calibration camera 42 (step S15, the state of Fig. 12). In this state, the "right camera 42" captures the correction mark CM1' of the light-transmissive plate m located below and measures the displacement of the calibration camera 42 with respect to the correction mark (10) (step S16). Fig. 1 is a diagram showing an example of a photographic image of the step $16 φ-weight camera 42. The calibration camera 42 measures the distance obtained by the center 0 from the correction mark (5) in the photographic image in the X-axis direction and the γ-axis direction, and the information acquired by the camera 4 with respect to the correction mark (5) ... offset unit 5). The self-calibration camera 42 is sent to the control '" 5 〇 and used as a correction value in the calibration process described below. 121799.doc -27. 200817846 The human-pattern drawing device 1 moves the driving unit 20 and moves the light-transmitting plate 11a to the alignment camera 41 in a manner that is substantially positive (step S17, Fig. 13). State). Then, (4) the camera 41 captures the correction mark CM1 of the light-transmitting plate 11a located below, and measures the positional shift amount of the calibration camera 41 with respect to the correction mark CM1 (step S18). In the step, as in the example of FIG. 18, the positional shift amount (ΔΧ2α, ΔΥ2α) of the calibration camera 41 with respect to the correction mark CM1 is obtained in the x-axis direction and the γ-axis direction, respectively, and the acquired information is self-calibrated. The camera 4i transmits 2 the control unit 50. Thereafter, the pattern drawing device 1 moves the driving unit 2, and moves the stage 10 so that the light-transmitting plate 11a is disposed substantially directly below the optical head 32 disposed closest to the +χ side (step S19, FIG. 14). State). Then, the pulse light pl is irradiated from the optical head 32, and the correction camera 1 ib disposed below the light-transmitting plate Ua captures the projection images of the correction mark CM1 and the pulse light PL (step S20). FIG. 19 shows the step S20. A diagram for correcting an example of a photographic image of the camera 1 ib. The correction camera lib measures the distance from the center of the correction mark CM1 in the photographic image from the pulse light PL in the X-axis direction and the γ-axis direction, respectively, and acquires the positional deviation of the correction mark CM1 with respect to the pulse light PL (ΔXla, AYla). The acquired information is sent from the correction camera 11b to the control unit 50, and is used as a correction value in the calibration process described below. Then, the pattern drawing device 1 operates the driving unit 20, and moves the stage 1 方式 so that the light-transmitting plate 12a is disposed substantially directly below the optical head 32 disposed on the most proximal side (step S21, the state of FIG. 15) ). Then, from the optical head 121799.doc -28- 200817846

The pulse light PL is irradiated 32, and the light-receiving plate 12a and the pulsed light projection image are taken from the correction camera 12b disposed below the light-transmitting plate 12a (step S22). In step S22, as in the example of FIG. 19, the positional offset (ΔΧΙΚΔΥα) of the correction mark CM with respect to the pulse light is obtained in the x-axis direction and the x-axis direction, respectively, and the acquired information is self-corrected by the camera i2b. It is sent to the control unit 50. X Thereafter, the pattern drawing device 1 operates the driving unit 20, and moves the stage 1 方式 so that the light-transmitting plate 12a is disposed substantially directly below the calibration camera 43 (step S23, state of Fig. 16). Then, the calibration camera 杓 captures the correction mark CM2 of the light-transmitting plate 12a located below, and measures the positional offset of the calibration camera with respect to the alignment mark CM2 (step S24). In the same step as in the example of FIG. The positional shift amount (ΔX2CJY2C) of the calibration camera 43 with respect to the correction mark CM2 is corrected in the x-axis direction and the γ-axis direction, and the acquired information is transmitted from the calibration camera 43 to the control unit 50. Further, the pattern drawing device 1 The driving unit 2 is operated, and the light-transmitting plate 12a is placed substantially vertically below the calibration camera 44 (the state is in a state of being illustrated). Then, the calibration camera 44 is photographed = below. The correction mark CM2 of the light-transmitting plate 12a measures the positional deviation of the calibration camera shame with respect to the correction mark CM2 (step S26). In the same step as the example of Fig. 18, the acquisition is performed in the x-axis direction and the γ-axis direction, respectively. The position of the calibration camera 44 with respect to the correction mark CM2 is shifted by 1 (ΔX2^Y2d), and the acquired information is sent from the calibration camera 44 to the I control unit 50. 121799.doc -29- 200817846 That is, In the correction processing, the pattern drawing device 1 acquires the following information (1) to (6), and holds the information in the control unit 50. (1) The positional shift amount of the calibration camera 42 with respect to the correction mark CM1 (?X2b) (AY2b) (2) The positional shift amount (ΔΧ2α5ΔΥ2α) of the calibration camera 41 with respect to the correction mark CM1 (3) The positional shift amount of the correction mark CM1 with respect to the pulse light PL of the optical head 32 (AXla, AYla) (4) The positional shift amount of the correction mark CM2 with respect to the pulse light PL of the optical head 32 (AXlb'AYlb) (5) The positional shift amount of the calibration camera 43 with respect to the correction mark CM2 (AX2c?AY2c) (6) The calibration camera 44 is relatively Position offset amount (AX2d, AY2d) of the correction mark CM2. Further, according to the above information (2), (3), the offset of the relative position of the calibration camera 41 with respect to the pulse light PL of the optical head 32 is uniquely It is determined as (ΔXla, AYla) + (AX2a, AY2a). Further, according to the above information (1), (3), the offset of the relative position of the calibration camera 42 with respect to the pulse light PL of the optical head 32 is uniquely It is determined as (ΔXla, AYla)+(AX2b, AY2b). Again, according to the above information (4), (5), The offset of the relative position of the pulsed light P of the calibration camera 43 with respect to the optical head 32 is uniquely determined as (ΔXlb, AYlb) + (AX2c, AY2c). Further, according to the above information (4), (6), The offset of the relative position of the calibration camera 44 with respect to the pulsed light PL of the optical head 32 is uniquely determined as (ΔΧ1ΐ3, ΔΥα) + (ΔΧ2ά, ΔΥ2(1). That is, at 121799.doc -30-200817846, the offset amount of the relative positions of the respective calibration cameras 4A to 44 with respect to the pulse light PL of the optical head 32 is measured. In the above-described correction processing, when the platform 1 is moved, the posture of the stage 10 (the tilt around the Z axis) is detected by the posture detecting unit 26, and the posture of the platform 1 is corrected, and the platform ig is moved. . Therefore, the platform 1〇 can be accurately moved in the main scanning direction and the sub-scanning direction, and the corrections h ACM1 and CM2 on the platform H) can also be accurately located between the respective calibration cameras 44 and below the optical head 32. mobile. <1-3·Drawing Process> Next, in the above-described pattern drawing device, the order in which the green pattern is formed on the upper surface of the secret panel 9 will be described. Further, as exemplified in FIG. 2( ), in the pattern drawing, the correction marks AM1 to AM4 are formed in advance at the four corners of the upper surface of the substrate 9 as the processing target. AM1 to AM4 serve as a reference for calibrating the substrate 9. Fig. 21 is a flow chart showing the flow of drawing processing in the pattern drawing device. When the drawing process is performed on the y device wipes, first, the substrate 9 is placed on the upper surface of the stage 10 (step S31). The substrate 9 is fixedly held on the upper surface of the stage 10 by a plurality of suction holes formed on the upper surface of the stage 10. Next, the pattern drawing device 1 moves the driving unit 2, and moves the stage 10 so that the alignment marks AM1 to AM4 on the substrate 9 are disposed substantially below the calibration cameras 41 to 44. Then, the pattern drawing device 拍摄 aligns the calibration marks AM1 to AM4 formed at the four corners of the substrate 9 by the calibration cameras 41 to 44, and measures the positions of the calibration marks AMI to AM4 with respect to the calibration cameras 41 to 44. 121799.doc -31 - 200817846 Offset (step S32). Fig. 22 is a view showing an example of the photographed image of the calibration camera 41 in step S32. The calibration camera 41 measures the distance between the calibration mark AM1 in the photographic image and the center of the field of view in the X-axis direction and the Y-axis direction, and obtains the positional offset of the calibration mark AM1 with respect to the calibration camera 41 (ΔX3a, AY3a). . Further, the other calibration cameras 42 to 44 are also the same as in Fig. 22, and the distances of the calibration marks AM2 to AM4 in the photographed image from the center of the field of view are measured, and the positions of the calibration marks AM2 to AM4 with respect to the calibration cameras 42 to 44 are obtained. Amount (ΔΧ31), ΔΥ31)), (ΔΧ3ο, ΔΥ3(:), (ΔΧ3(1, ΔΥ3(1). When the positional offset of each of the calibration marks ΑΜ1 to ΑΜ4 with respect to the calibration cameras 41 to 44 is obtained, The control unit 50 calculates the final positional deviation of each of the calibration marks ΑΜ1 to ΑΜ4 formed on the substrate 9 based on the positional shift amount and the positional shift amounts of (1) to (6) obtained in the above-described correction processing. The amount of shift (step S33). For example, the final position shift amount (AXa, AYa) of the calibration mark ΑΜ1 is the position shift amount (ΔXla, AYla) of the correction mark CM1 with respect to the pulse light PL, and the calibration camera 41 is opposed to The positional shift amount (ΔΧ2α, ΔΥ2α) of the correction mark CM1 and the positional shift amount (ΔΧ3α, ΔΥ3α) of the calibration mark AM1 with respect to the calibration camera 41 are calculated as follows (number 1). (ΔXa, AYa)=(AXla,Yla)+(AX2a,Y2a)+(AX3a, Y3a) (1) The final position shift amount (AXb, AYb) of the calibration mark AM2 is the position shift amount (ΔXla, AYla) of the correction mark CM1 with respect to the pulse light PL, and the calibration camera 42. Relative to the position of the correction mark CM1 121799.doc -32-200817846 offset (AX2b, AY2b), the positional offset of the calibration mark AM2 with respect to the calibration camera 42 (ΔΧ3ΐ3, ΔΥ3ΐ3), and calculated by the following number 2 (AXb, AYb)=(AXla,AYla)+(AX2b,AY2b)+(AX3b,AY3b)···(number, the final position offset of the calibration mark AM3 (ΔΧο'ΔΥο) is the use of the correction mark The positional shift amount (ΔXlb, AYlb) of the CM2 with respect to the pulsed light PL, the positional shift amount (AX2c, AY2c) of the calibration camera 43 with respect to the correction mark CM2, and the positional offset of the calibration mark AM3 with respect to the calibration camera 43 The amount (ΔΧ3(:, ΔΥ3(〇, and calculated by the following number 3. (△Xc, AYc)=(AXlb, AYlb)+(AX2c, AY2c)+(AX3c, AY3c)···(Number 3 Further, the final position shift amount (AXd, AYd) of the calibration mark AM4 is the positional shift amount of the correction mark CM2 with respect to the pulse light PL ( Xlb, AYlb), the positional offset of the calibration camera 44 with respect to the correction mark CM2 (ΔΧ2ί!, ΔΥ2(1), and the positional offset of the calibration mark AM4 with respect to the calibration camera 44 (ΔΧ3(1, ΔΥ3(1)) And calculated by the following number 4. (ΔXd, AYd)=(AXlb, AYlb)+(AX2d, AY2d)+(AX3d, AY3d) (4) Then, the pattern drawing device 1 calculates the calibration marks AM 1 to AM4 based on the calculation. The rotation of the rotating mechanism 21 is performed by the final positional shift amount, and the inclination of the substrate 9 held on the stage 10 is corrected, that is, the calibration is performed (step S34). Then, the drawing start position of the substrate 9 is corrected based on the final position shift amount of each of the alignment marks AM1 to AM4, and the substrate 9 is moved to the corrected drawing start position. When the substrate 9 is placed at the drawing start position, the pattern drawing device 1 side 121799.doc •33 · 200817846 moves the platform ίο in the main scanning direction and the sub-scanning direction while drawing a specific pattern on the upper surface of the board 9 ( Step S35). In other words, the pattern drawing device moves the substrate 9 in the sub-scanning direction in units of the exposure width of the optical head 32, and repeats pattern drawing in the main scanning direction a certain number of times to form a specific pattern on the entire upper surface of the substrate 9. . Thereafter, the substrate 9 is carried out from the upper surface of the platform 10 (step S36), and the drawing process for the i-sheet 9 is completed. As described above, the pattern drawing device of the present embodiment detects the positional deviation f of the correction marks CM1 and CM2 with respect to the pulse light PL irradiated from the optical head 32, and the calibration cameras 41 to 44 are opposite to each other in the correction processing. The position offset of the correction marks CM:, CM2. Further, the amount of shift of each of the calibration cameras 41 to 44 with respect to the relative position of the pulse light PL irradiated from the optical head η is acquired based on the detected respective assets. Then, the project description device uses the information to correct the calibration amount of the substrate 9, and corrects the drawing start position of the substrate 9, thereby correcting the drawing position on the substrate 9. Therefore, even when the positional relationship between the pulsed light pL irradiated from the optical head 32 and each of the calibration cameras 1 44 changes, the apparatus 1 can perform the drawing processing while correcting the amount of change in the description of the present embodiment. Therefore, the pattern drawing device of the present embodiment feeds on the accurate position on the substrate 9. Since x ’ corrects the calibration amount and drawing of the substrate 9 without correcting the positions of the calibration cameras 41 to 44 themselves, the actuators 41a to 44a of the fork cameras 41 to 44 use precise driving mechanisms. <1-4. Modifications> 121799.doc • 34-200817846, 'The first embodiment of the present invention has been described, but the present invention is not limited to the above examples. For example, the camera lib of the correction unit captures the pulsed light PL of the optical head 32 placed on the +X side of the correction machine (step S20), and the camera is placed on the calibration camera 12b. The pulse light PL of the optical head 32 is the most (step S22), but these photographing operations are not necessarily performed separately. For example, the distance between the photon head 32 disposed closest to the +X side and the optical head disposed closest to the _χ side, and the distance between the correction camera lb 12b can be equalized while performing the step shooting operation and The shooting action of step S22. Further, in the pattern drawing device 1, the stage 10 is moved relative to the optical head 32 in the stationary state, but the optical head 32 can be moved on the stage 10 in a stationary state. That is, it can be a structure in which the optical head 32 and the stage ig can be relatively moved. Further, the pattern drawing device 作为 is to use the glass substrate 9 of the color light guide sheet as a processing target, but the pattern (4) device and the pattern drawing method of the present invention may be a semiconductor substrate, a printed substrate, or a glass for a polycondensation display device. Other substrates such as substrates are treated as objects. <2. Second Embodiment> Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. The pattern drawing device 101 of the second embodiment has the same configuration as that of the pattern drawing device 1 of the first embodiment, and performs the same correction processing and drawing processing. In addition to the configuration of the pattern drawing device 1 of the second embodiment, the pattern drawing device of the second embodiment has the following configuration, and the operation of the pattern drawing device 第 according to the first embodiment is also Also proceed to 121799.doc -35· 200817846 to perform the following actions. Further, in each of the drawings referred to in the following description, a common XYZ orthogonal coordinate system is attached in order to clarify the positional relationship and the operation direction of each member. <2-1. Configuration of Drawing Device> FIG. 23 and FIG. 24 are a side view and a plan view showing a configuration of the pattern drawing device 10 1 according to the second embodiment of the present invention. The pattern drawing device 1 〇1 is a device for manufacturing a color filter for a color filter on a glass substrate (hereinafter, simply referred to as a "substrate") 1 〇 9 in a color filter manufacturing step of a liquid crystal display device. The surface depicts a specific pattern. As shown in Figs. 23 and 24, the pattern striating apparatus 101 is provided with a platform no for holding the substrate, a driving unit 120 connected to the stage m, a plurality of optical heads 13 and a photographing unit 丨4〇. The flat body 110 has a flat outer shape and is used to hold and hold the substrate 1〇9 in a horizontal position on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the stage 11A. Therefore, when the substrate 1〇9 is placed on the flat $110, the substrate 1〇9 will be fixedly held on the upper surface of the stage 11〇 by the suction pressure of the suction holes. The drive unit 120 is a drive mechanism for moving the stage 110 in the main scanning direction (γ-axis direction), the brake scanning direction (X-axis direction), and the rotation direction (rotation direction around the z-axis). The driving portion 12A has a rotating mechanism 121 that rotates the platform 11A, a support plate 122 that rotatably supports the platform 11A, a sub-scanning mechanism 123 that moves the support plate 122 in the sub-scanning direction, and a sub-scanning mechanism 123. The bottom plate 12a supporting the support board 122; and the main scanning mechanism 125 for moving the bottom plate 124 in the main scanning direction. The square turn mechanism 121 has a linear motor 121a including a rotor of 121799.doc - 36 - 200817846 mounted on the end of the - γ side of the platform uo, and a stator laid on the upper surface of the support plate 122. Further, a rotating shaft 12113 is provided between the lower surface side of the central portion of the platform u and the support plate 122. Therefore, when the linear motor 12la is actuated, the rotor will move in the X-axis direction along the stator, and the stage 110 will rotate within a certain angle range centering on the rotating shaft 121b on the support plate 122. The sub-scanning mechanism 123 has a linear motor 123a including a rotor mounted on the lower surface of the support plate 122, and a stator laid on the upper surface of the bottom plate ι24. Further, between the support plate 122 and the bottom plate 124, a pair of guiding portions 123b are provided, and the pair of guiding portions 123b extend in the sub-scanning direction. Therefore, when the linear motor 123a is operated, the support plate 122 moves in the sub-scanning direction along the guide portion 123b on the bottom plate 124. The main scanning mechanism 125 has a linear motor 125a including a rotor mounted on a lower surface of the bottom plate 124 and a stator disposed on the base 160 of the main unit 107. Further, between the bottom plate 124 and the base 160, a pair of guiding portions 125b are provided, and the pair of guiding portions 125b extend in the main scanning direction. Therefore, when the linear motor 125a is operated, the bottom plate 124 moves in the main scanning direction along the guide portion 125b on the base 160. The plurality of optical heads 130 are means for illuminating the surface of the substrate 1 〇 9 held on the stage 11 脉冲 with pulsed light of a specific pattern. On the base 16A, a frame 丨3 1 is placed across the stage 110 and the drive unit 120, and a plurality of optical heads 130 are attached to the frame 131 at equal intervals in the sub-scanning direction. One laser oscillator 133 is connected to each optical head 130 via an illumination optical system 132. Further, on the laser oscillator 133, a 121799.doc -37-200817846 sputtering drive unit 134 is connected. Therefore, when the two fish + field-field driving unit 134 operates, the laser oscillator 133 oscillates to generate pulsed light, and the pulse light generated by the oscillation is transmitted to the optical heads 13 via the illumination optical system 132. Inside. The emitting unit 135 emits light from under the illumination; the aperture unit is provided inside each optical head 130, and is provided with: a light beam transmitted from the optical system 132 to shield a portion of the pulse light toward a portion of the pulse light to form a specific pattern; and a projection optical system The light beam is irradiated onto the upper surface of the substrate (10) by 137'. from

The pulse light emitted from the emitting portion 135 is partially shielded to form a light beam of a specific pattern when passing through the aperture unit 136, and is incident on the projection optical system 137. Then, the surface of the substrate 109 is irradiated with the pulsed light passing through the projection optical system 137, and a specific pattern is drawn on the upper surface of the substrate 1 to 9 to be applied to the photosensitive material (color resist). Fig. 25 is a plan view showing the structure of the diaphragm unit 136. The aperture unit 丨36 has a function of adjusting the position of the i-th aperture 在ρι in the horizontal plane while holding the first aperture API, which is a glass plate on which a specific light-shielding pattern is formed. In the aperture unit 136, the end portions of the first aperture ΑΡ12+χ side and the side are held by a pair of holding portions 136a. Further, the pair of holding portions 13A are connected to the first driving portion 136b which is laid in the main scanning direction. Therefore, when the i-th driving unit 136b is operated, the pair of holding portions 136a and the first aperture API are integrally moved in the main scanning direction. Further, the driver 1 13b can be constituted by, for example, a linear motor. Further, a lower side of the first driving unit 136b is provided with a pair of guides 136c and a second driving unit I36d extending in the sub-scanning direction, and the second driving unit I36d is constituted by a linear motor or the like. Therefore, when the second drive unit 136d is operated 121799.doc -38-200817846, the first drive unit 136b, the holding unit 13, and the first diaphragm 一体ρι are integrally moved in the sub-scanning direction. In this manner, the diaphragm unit 136 can move the first diaphragm ρ1 by operating the first driving unit 136b and the second driving unit 136d, and adjust the position of the first diaphragm AP1 in the main scanning direction and the sub-scanning direction. On the first aperture API, a plurality of slots SL1, SL2, and SL3 having different sizes are disposed in a plurality of slots. A plurality of slots SL1, a plurality of slots 乩2, and a plurality of slots SL3 are arranged in the sub-scanning direction, respectively! The columns are formed to form a narrow group and the group of slots of °H 4 are arranged in the main scanning direction. The aperture unit 13 $ can arrange one of the three slot groups in the irradiation region La of the pulsed light (see Fig. 26) by adjusting the position of the first aperture API in the main scanning direction. Further, the aperture unit 136 can adjust the projection position of the pattern on the substrate 1〇9 by precisely shifting the position of the first aperture API in the main scanning direction and the sub-scanning direction. Further, a second aperture ap2 is provided on the upper portion of the first aperture API, and the second aperture AP2 adjusts the width of the pattern projected by the first aperture AP1. Fig. 26 is a plan view showing the configuration of the second diaphragm AP2 and its holding mechanism. As shown in Fig. %, the +Y side and the -γ side end of the second diaphragm AP2 are held by a pair of holding portions 136e. Further, the pair of holding portions I36e are connected to the third driving portion 136f which is laid in the sub-scanning direction. Therefore, when the third driving unit 136f is operated, the pair of holding portions 136e and the second diaphragm AP2 are integrally moved in the sub-scanning direction. Further, the third drive unit 136f may be constituted by, for example, a linear motor. A plurality of slits SL4, 5, and SL6 corresponding to the plurality of slits SL1, SL2, and SL3 on the first diaphragm AP1 are formed in the second diaphragm AP2. 121799.doc -39- 200817846 Positioning the first aperture API so that the plurality of slits SL3 of the first aperture AP 1 are disposed at the irradiation position la of the light, and the slot SL3 on the first aperture APi and the first aperture 2 The second aperture AP2 is positioned in a manner that the slot SL6 on the aperture AP2 partially overlaps (the state of FIG. 26). When the pulse light is irradiated from above the second aperture AP2, the pulse light only coincides with the slot SL6 through the slot SL3. In part, a pattern as shown in FIG. 27 is projected on the upper surface of the substrate 109. Further, when the relative position of the second aperture AP2 with respect to the sub-scanning direction of the first aperture API is adjusted, the width of the pattern projected on the substrate 109 in the sub-scanning direction is adjusted. Further, as shown in Fig. 28, when the second diaphragm AP2 is largely moved in the sub-scanning direction, a part of the plurality of slits SL3 on the 光1 diaphragm API is completely shielded from light by the light blocking portion of the second diaphragm AP2. When the pulsed light is irradiated from above the second aperture in this state, a pattern as shown in Fig. 29 is projected onto the upper surface of the substrate 109. In this manner, the second aperture AP2 also has a function of adjusting the pattern projection range in the sub-scanning direction. Further, when the projection position of the pattern on the substrate 1〇9 is adjusted, and the first aperture API is displaced in the main scanning direction or the sub-scanning direction, the second aperture AP2 is held in the same position as the first aperture. It moves while following the first aperture AP2. Referring back to Figures 23 and 24, a plurality of optical heads 130 are arranged in the sub-scanning direction or the like (e.g., a pitch of 200 mm). When the pulse light is irradiated from each of the optical heads 13 while moving the platform in the direction of the platform, a specific exposure width can be obtained on the upper surface of the substrate 109 (for example, 5 凡 凡 * J > The main scanning direction of the mouth depicts a plurality of patterns. After finishing the painting in the main scanning direction, the pattern drawing device 101 moves the platform 110 in the sub-scanning direction by 121799.doc -40 - 200817846 exposure width 'and makes the platform 11G Moving again in the main scanning direction, each optical head irradiates the pulse light at 13°. Thus, the pattern edging device 101_: causes the substrate H)9 to move in the sub-scanning direction in units of the exposure width of the optical head 13 ,, and repeats a certain number of times The pattern of the main scanning direction (for example, 4 times) forms a pattern of color gradation on the entire upper surface of the substrate 1G9.

The photographing unit 140 is a mechanism for photographing the index of the accent mark formed on the upper surface of the substrate 109 as described above with reference to Fig. 31). The photographing unit 14 has four (four) quasi-fresh machines (4) to 144. Each of the calibration cameras 141 to 144 is disposed in such a manner that when the substrate 109 is placed at the calibration position (the position shown in FIG. 23 and FIG. 23), the calibration cameras 141 to 144 are located at the four corners of the substrate 1〇9. The calibration rod is roughly directly above the am. The pattern drawing means ι 〇 can be arranged by arranging the base: 1 〇 9 at the calibration position and causing the calibration cameras 141 to 144 to operate, and taking the calibration marks AM formed at the four corners of the substrate 109 to acquire the coordinates thereof. Further, the pattern drawing device 101 can form the side surfaces of the +X side and the _χ side of the substrate 109 while moving the substrate 1 〇 9 in the main scanning direction while moving the reference cameras 141 and 143. A plurality of calibration marks = AM, and obtain coordinates of them. Further, the pattern drawing device 101 further includes a control unit 150 in addition to the above configuration. Fig. 30 is a block diagram showing the connection between the above-described respective portions of the pattern drawing device 1A1 and the control unit 150. As shown in FIG. 3A, the control unit 15A and the linear motors 121a, 123a, and 125a, the laser drive unit 134, the first drive unit 136b, the second drive unit I36d, the third drive unit I36f, and the calibration camera 141 are provided. ~ 144 electrical connection, and control its actions. Control 121799.doc •41 · 200817846 Port" 50 is composed, for example, of a computer having a CPU and a memory, and controls the above by causing the computer to operate according to a program installed in the computer. <2. Pattern Stroke Order> Next, in the pattern drawing device 101 having the above configuration, the procedure for riding the pattern on the upper surface of the substrate 109 will be described. Further, as illustrated in Fig. 31, a plurality of black matrices (reference patterns) BM are formed in advance on the upper surface of the substrate 109 to be processed in the pattern drawing device. A plurality of black moments _BM are formed by exposing a plurality of areas AR on the upper surface of the substrate 〇9, and a calibration mark AM is formed on each of the exposed areas AR on the upper surface of the substrate 1〇9. The pattern drawing device 1 描绘 1 draws the feature pattern in the frame of such a black matrix Bm. Fig. 32 is a flow chart showing the flow of the drawing processing in the pattern drawing device ι〇1. When the drawing process is performed in the pattern drawing device 1 ,, the substrate 109 is first placed on the upper surface of the stage 11 (step S10!). The substrate 1〇9 is adsorbed by a plurality of suction holes formed on the upper surface of the stage 110, and is fixedly held on the upper surface of the stage 11〇. Next, the pattern drawing device 1〇1 corrects the inclination of the substrate 1〇9 held on the stage 11〇 in the horizontal plane (the angular deviation around the z-axis) (step S1〇2). Fig. 3 is a flow chart showing the details of the actions in the steps s 1 〇2. In step S102, first, the pattern drawing means ι1 operates the linear motors 123a, 125a to move the stage 110 and the substrate ι 9 to the calibration position (step S121). At the calibration position, four calibration marks 121799.doc-42-200817846 AM formed at the four corners of the substrate 109 among the plurality of calibration marks AM formed on the upper surface of the substrate 1〇9 are respectively positioned at the calibration cameras 141 to 144. It’s roughly below. In this state, the calibration cameras 141 to 144 can capture the *quinacles formed at the four corners of the substrate 1〇9 and transmit the acquired images to the control unit 15 0 (step 5122). The control 邛1 50 is self-calibrated. The images transmitted by the cameras 141 to 144 extract the coordinates of the respective calibration marks 形成 formed at the four corners of the substrate 109, and calculate the tilt angle and the amount of expansion and contraction of the substrate 109 based on the coordinates of the pixels 141 to 144 (step 5123). Then, the control unit 15 operates the linear motor 12u to correct the inclination angle of the substrate 109 on which the difference is made, and the substrate 1〇9 is rotated by .i2ib. And respect (step S124). Thereby, the inclination of the substrate 1〇9 in the horizontal plane is corrected. After the inclination of the substrate 1〇9 is corrected, the pattern drawing device 1〇1 detects the positional shift amount, the amount of expansion and contraction, and the tilt angle of the black matrix BM formed on the substrate 109 in each exposure region ar (step S1 〇 3). Fig. 34 is a flow chart showing the details of the operation in step S103. In the step s1〇3, first, while the linear motor 125a is operated, the flattening 11 〇 and the substrate 109 are transported in the main scanning direction, and the plurality of calibrations on the substrate 1 〇 9 are taken by the two calibrating cameras 14 ι, 143. Mark am (step si3i). Thereby, not only the alignment marks AM formed at the four corners of the substrate 1 〇9 but also a plurality of alignment marks AM disposed on the +X side or the _χ side of each exposure area Ar are captured. The acquired images of the plurality of calibration marks AM are transmitted from the calibration cameras 141, 143 to the control unit 150. The control unit 15 detects the coordinates of each calibration mark am based on the images transmitted from the calibration cameras M1 and 143, and calculates the positional offset of each exposure area ar according to the coordinates of the roots 121799.doc-43·200817846. The amount, the amount of expansion and contraction, and the angle of inclination (step S132). Then, the control unit 15 stores the calculated position shift amount, the amount of expansion and contraction, and the tilt angle of each of the calculated exposure areas AR in a specific memory unit, and the memory unit is provided in the control unit 150 (step S133).

Thereafter, the pattern drawing device 1〇1 corrects the drawing position of the optical head 13〇 to face the substrate 搬9 conveyed in the main scanning direction and the sub-scanning direction, based on the stored position shift amount, the amount of expansion and contraction, and the tilt angle. The upper surface depicts a specific pattern (step S104). As a method of correcting the drawing position, it is understood that the drawing position can be corrected by various methods, for example, by the following (丨), (2) or the correction method. (1) First correction method In the first correction method, first, the control unit 150 calculates an average value of the positional shift amounts in the sub-scanning direction stored for each exposure area AR. Following the =, ~ scanning direction, the degree of the calculated and flat sentences is corrected for the drawing position of each optical head 130. Specifically, the position of the second diaphragm AP2 is adjusted when the position of the first diaphragm AP1 is adjusted based on the calculated average value of the second driving unit 136d in the head 130. Also, the first "first ring API" - and moved integrally. Then, using the adjusted number of I sisters first to the master 130, the surface of the substrate 1 〇 9 is depicted in Figure h by W correction An example of the corrected drawing area is shown in Fig. 35. There is no area (hatched portion) of one optical head 130 disposed closest to the +Χ side. In the example of Fig. 35, 121 of the six exposure areas AR .doc •44- 200817846 One position shift occurs in the sub-scanning direction. If the third correction side= is used, the drawing position is corrected to the following degree in the sub-scanning direction, that is, in the direction along the main sweep. The number of exposure areas AR (three) is the degree of the average value obtained by dividing the positional shift amount. Since & ', it is possible to prevent the drawing position from being largely shifted in one exposure area AR. Further, in the above example , only the correction of the sub-scanning direction is explained, but for the direction of the drawing The position of the drawing can be corrected in the same way. That is, the value of the positional deviation of the main scanning direction saved for each exposure area is averaged, and the calculated flat sentence value is corrected for the riding position in the main sweeping direction. Further, the drawing position can be corrected in both the main scanning direction and the sub-scanning direction. In the above example, each of the optical heads 13 is exposed to the exposure area AR as a stroke target every time the main scanning is performed once. The average value of the positional shifts can be calculated as an average of the positional shift amounts of all the exposure areas AR. For example, in the example of FIG. 35, only the average value of the position of the three exposure areas AR disposed on the +X side is calculated, and the mean value is corrected according to the calculated average value. The position can also calculate the average value of the positional offsets of the six exposure areas, and correct the drawing position based on the calculated positional offset. However, when the optical head 13 is subjected to the correction in the case of the main scanning, the positional shift 4 of the exposure area as the edge of the drawing can be clearly reflected, so that the drawing position can be corrected more appropriately. Further, on the substrate 109, when a plurality of exposure product fields AR arranged in the direction of the sub-assembly & + / r . _ 衂 are in the scanning direction in the field scanning direction, the optical head 13G may not be adjusted. 1 Aperture state and position of the second aperture, 121799.doc 45 200817846 The position of the platform 110 in the sub-scanning direction is adjusted to correct the drawing position on the substrate 1〇9. (2) Second Correction Method In the second correction method, the pattern drawing device 101-surface corrects the drawing position in the sub-scanning direction of each exposure region AR based on the positional shift amount in the sub-scanning direction stored for each exposure region AR. A pattern is drawn on the surface of the substrate 1〇9. In other words, before the respective exposure areas AR on the substrate 1〇9 transported in the main scanning direction reach the drawing position, the pattern drawing device 1〇1 operates the second driving unit i36d of each optical head 130 to adjust the position of the first aperture AP1. The degree of the positional shift amount of the exposure area AR is corrected for the drawing position in the sub-scanning direction. Furthermore, when the position of the i-th aperture Αρι is adjusted, the position of the second aperture AP2 is also the same as the first! The aperture moves together in one piece. Fig. 36 is a view showing an example of a drawing area corrected by the second correction method. Fig. 36 shows a drawing area (hatched portion) of the optical heads 130 disposed closest to the +χ side. In the example of FIG. 36, one of the six exposure areas ar generates a positional shift in the sub-scanning direction, and when the second correction method is used, when the position-shifted exposure area AR is drawn, the position is shifted according to the position The drawing position of the optical head 130 is corrected by shifting the amount. Therefore, in each of the exposure areas AR, the pattern can be drawn at an appropriate position within the black matrix test. Further, the pattern drawing device 101 can independently positionally control the i-th aperture AP1 of the plurality of optical heads 130. Therefore, even when the positional shift amount of each of the exposure areas AR is different, the drawing position of each of the optical heads 13A can be appropriately corrected in accordance with the positional shift amount of each of the exposure areas AR. Example 121799.doc -46- 200817846 If the positional shift occurs in the opposite direction even if the two exposure areas ar arranged adjacently in the sub-scanning direction are generated, the positional shift of each exposure area ar can be successfully handled. In the above example, only the correction of the sub-scanning direction has been described. However, in the main scanning direction, the drawing position may be corrected in the fourth mode. That is, the position of the main scanning direction which is stored for each exposure area AR can be shifted to the position in the main scanning direction of each exposure area AR. Further, the edge position can be corrected in both the main scanning direction and the sub-scanning direction. On the substrate 109, when the plurality of exposure regions AR arranged in the sub-scanning direction are displaced in the sub-scanning direction as a whole, the ith aperture Αρι and the second aperture of the optical head 13 can be eliminated. The position of Αι>2, and the position in the sub-scanning direction of the flat 110 is corrected to correct the drawing position on the substrate 109. (3) In the third correction method, the pattern drawing device 1 〇 1 surface continuously corrects the drawing position based on the tilt angle stored for each exposure region AR, and draws a pattern on the upper surface of the substrate 109. In other words, the position of the first aperture ah can be adjusted not only by the exposure area reaching the drawing position but also by the second driving unit 136d and the stage ιι during the drawing of each exposure area AR. The ll symbol % ′ is drawn while the position of the exposure area AR is being plotted in the sub-scanning direction. Further, when the position of the first aperture API is adjusted, the position of the second aperture ap2 also moves integrally with the first aperture AP1_. 121799.doc -47- 200817846 Fig. 37 is a view showing an example of a drawing area corrected by the third correction method. In Fig. 37, 'there is a position in the "optical optical head 130 that is disposed closest to the +χ side" (the hatching portion is illusory. In the example of Fig. 37, one of the six exposure regions is tilted, if According to the third correction method, when the inclined exposure area AR is drawn, the position of the optical head 13 () is corrected in the sub-scanning direction based on the inclination angle thereof, and the surface is drawn. Therefore, in each exposure area AR The pattern can be drawn at an appropriate position in the black matrix 。. Further, the 4 pattern drawing device 1〇1 can independently positionally control the i-th aperture AP1 of the plurality of optical heads 13〇. Therefore, even in each exposure area When the inclination angles of the ARs are different, the drawing positions of the respective optical heads 13A can be appropriately corrected according to the inclination angle 各 of each exposure region ar. For example, even if two exposure regions ar arranged adjacently in the sub-scanning direction are reversed If the direction is tilted, the tilt of each exposure area AR can be successfully handled. In the above example, only the correction of the sub-scanning direction is described, but in the main scanning direction, the same can be corrected. ♦ Position, that is, the drawing position in the main scanning direction and the sub-scanning direction can be continuously changed according to the tilt angle stored for each exposure area AR. When the drawing position is corrected in the main scanning direction and the sub-scanning direction, the drawing is performed. The drawing can be more accurately depicted in the frame of the oblique black matrix BM. The pattern drawing device 1 surface corrects the drawing position by the above (1), (7) or (3), and draws a specific pattern on the upper surface of the substrate 9. The pattern drawing device surface moves the substrate 109 in the sub-scanning direction, and performs a plurality of times of drawing in the main scanning direction, thereby drawing the pattern on the substrate 1〇9 in the frame of the black matrix BM 121799.doc -48 - 200817846 Then, the substrate 1〇9 is carried out from the upper surface of the stage 11〇 (step S105), and the drawing process for the one substrate 109 is completed. As described above, the pattern drawing device 1〇1 is not only imaged on the substrate 1〇9 The calibration mark AM of the four corners also captures a plurality of calibration marks AM formed in each exposure area AR, and extracts its coordinates. Then, according to the coordinates of each calibration mark AM, The positional shift amount and the tilt angle of each of the exposure regions AR2 are calculated, and the drawing position is corrected based on the calculated position shift amount and the tilt angle, and the pattern is drawn on the upper surface of the substrate 1〇9. Therefore, even for each exposure When the black matrix BM of the area AR has a positional shift or tilt, the pattern may be drawn at an appropriate position in the black matrix BM in each of the exposure areas AR. Further, in the above step S131, the calibration for taking the four corners is used. The calibration cameras 141 and 143 are provided to mark each exposure area to be calibrated. AM. Therefore, in order to capture the calibration marks of the respective exposure areas AR, it is not necessary to separately provide a calibration camera, and the structure of the imaging system can be simplified. Further, in the above-described step S1, the position of the i-th aperture AP1 is adjusted by the second drive unit 13A and the second drive unit 136d, and the drawing position of each of the optical heads 13A is corrected. Therefore, in order to correct the drawing position of each of the optical heads 13, it is possible to simplify the structure of the optical pickups without separately providing an adjustment mechanism. Further, when a plurality of exposure areas AR arranged in the sub-scanning direction on the substrate 1〇9 are inclined in the rotation direction about the z-axis, the stage 110 can be rotated around the rotation axis 121b and adjusted. The position of the sub-scanning direction is corrected, and the drawing position on the substrate 109 is corrected instead of adjusting the positions of the first aperture API and the second aperture AP2 of the optical head 13A. 121799.doc -49- 200817846 <3. Modifications>

Although an embodiment of the present invention has been described above, the present invention is not limited to the above examples. In the above-described step S131, 'the calibration mark is taken from each of the exposure areas in two units. However, when three or more calibration marks AM are arranged in the main scanning direction in the one exposure area ar, The exposure area AR captures three or more calibration marks aM. In order to calculate the positional offset or tilt angle of each exposure area AR, at least two coordinates of the calibration mark AM may be acquired for each exposure area AR, but if more coordinates of the calibration mark AM are obtained, the accuracy may be more accurate. The positional shift amount or the tilt angle of each exposure area AR is calculated. Further, in the above step sm, the calibration marks AM are imaged by the two calibration cameras 14i and 143, but other calibration cameras may be provided between the two calibration cameras 14i and 143, and the calibration cameras may be used to calibrate with more than three calibration cameras. Mark AM. In the case where three or more exposure regions AR are arranged in the sub-scanning direction on the upper surface of the substrate 1〇9, the calibration mark AM included in each exposure region AR is captured. Further, in the above (7), the drawing position is corrected based on the positional deviation of the exposure region '. In the above (7), the tracing position is corrected based on the inclination of the exposure region, but the correction methods of the above (7) and (3) may be combined, according to The position of the exposure & field AR is shifted and the both are tilted to correct the position of the optical head η. Further, in the above-described pattern riding device 1G1, a linear motor is used as the driving mechanism of each unit, but a well-known driving mechanism other than the linear motor may be used. For example, a mechanism for converting the driving force of the motor into a translational motion of 121799.doc -50-200817846 via a ball screw can be made. In the above-described pattern drawing device 1〇1, the glass substrate 109 for a color filter is used as a processing target. However, the pattern drawing device and the pattern drawing method of the present invention may use a glass for a semiconductor substrate, a printed substrate, or a plasma display device. Other substrates such as substrates are treated as objects. Further, in the above example, the positional shift amount, the amount of expansion and contraction, and the tilt angle of each exposure region AR are acquired in the pattern drawing device 1A1, but the information may be acquired in other devices. For example, as shown in FIG. 38, each of the exposure areas on the substrate 1〇9 can be photographed in the pre-processing apparatus 1〇2 (a device different from the pattern drawing device 101) that performs the processing before the pattern drawing process. The calibration mark AM of the ruler acquires the positional shift amount, the amount of expansion and contraction, and the tilt angle of each exposure area AR. Then, the positional shift amount, the amount of expansion and contraction, and the tilt angle of each exposure area AR acquired in the pre-processing apparatus 1〇2 are supplied to the pattern drawing device 1〇1, thereby pattern drawing device 101 and pre-processing device 102. One substrate processing system 1〇3 is constructed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view of a pattern drawing device according to a first embodiment of the present invention. 2 is a plan view of the pattern drawing device according to the first embodiment of the present invention. Fig. 3 is an enlarged plan view showing a through hole formed in the vicinity of a corner portion of the platform. Figure 4 is a longitudinal cross-sectional view of the platform of Figure 3 after cutting the IV_IV line. Fig. 5 is a view showing an example of posture control of the platform. Fig. 6 is a view of a plurality of optical heads viewed from below. Fig. 7 is a block diagram showing a connection structure between a control unit and each unit. Fig. 8 is a flow chart showing the flow of the correction processing. 121799.doc 51 200817846 Figure 9 is a flow chart showing the process of not being processed. Fig. 1 is a flow chart showing the flow of the correction process. Fig. 11 is a view showing the state of the pattern drawing device in the non-correction process. Fig. 12 is a view showing the state of the pattern drawing device in the non-correction process. Fig. 13 is a view showing the state of the pattern drawing device in the non-correction process. Fig. 14 is a view showing the state of the pattern drawing device in the non-correction process. Fig. 15 is a diagram showing the state of the pattern drawing device in the correction processing. Fig. 16 is a diagram showing the state of the pattern drawing device in the non-correction process. Fig. 17 is a view showing the state of the pattern drawing device in the non-correction process. Fig. 18 is a view showing an example of calibrating a photographed image of a camera. Fig. 19 is a view showing an example of correcting a photographic image of a camera. Fig. 20 is a view showing an example of a substrate to be processed. Fig. 21 is a flow chart showing the flow of the drawing process. Fig. 22 is a view showing an example of calibrating a photographic image of a camera. Fig. 23 is a side elevational view showing the pattern drawing device according to the second embodiment of the present invention. Fig. 24 is a plan view showing a pattern drawing device according to a second embodiment of the present invention. 25 is a plan view showing the structure of the aperture unit. Fig. 26 is a plan view showing the structure of the second aperture and the holding mechanism thereof. Fig. 27 is a view showing an example of a pattern which is not projected on the upper surface of the substrate. Fig. 28 is a plan view showing the structure of the second aperture and the holding mechanism thereof. Fig. 29 is a view showing an example of a pattern which is not projected on the upper surface of the substrate. Fig. 30 is a block diagram showing the connection between the respective portions of the pattern drawing device and the control portion 121799.doc - 52 - 200817846. Fig. 3 is a view showing an example of a substrate on which bamboo or tantalum is to be processed. Fig. 32 is a flow chart showing the flow of the drawing processing in the device of the Kosuke tea greening device. Fig. 3 is a flow chart showing the details of the processing of trimming and tilting. The flowchart shows a flow chart for not detecting the positional shift amount of each exposure region and the details of the processing of the angular offset S. Fig. 35 is a view showing an example of a drawing area which is not corrected by the first correction method. The figure shows an example of a drawing area corrected by the brother 2 correction method. Fig. 3 is a view showing an example of a drawing area corrected by the third correction method. 38 is a view showing the structure of a substrate processing system. [Description of main component symbols] Pattern drawing device substrate platform Transmissive plate correction Camera drive section Posture detection section Optical head camera 1 9 10 11a , 12a lib , 12b 20 26 27 121799.doc -53· 200817846 30 Head 32 optical head 39 Actuators 41 to 44 Calibration Camera 50 Control Units AMI to AM4 Calibration Marks CM1, CM2 Correction Markers PL Pulse Light 101 Pattern Drawing Device 109 Substrate 110 Platform 120 Drive Unit 121 Rotating Mechanism 123 Sub Scanning Mechanism 125 Main Scanning Mechanism 130 Optical Head 133 Laser oscillator 135 Injection unit 136 Aperture unit 136b Brother 1 drive unit 136d Second drive unit 137 Projection optical system 140 Photographing unit 141 to 144 Calibration camera 121799.doc -54- 200817846

150 API AP2 AM AR BM Control 1st aperture 2nd aperture Calibration mark Exposure area Black matrix 121799.doc -55-

Claims (1)

200817846 X. Patent Application Range·· 1· A drawing device with special handle μ $ &丄/, you will draw the special pattern on the photosensitive material formed on the substrate, and include: a platform for holding the substrate; a light, a light-emitting portion that is opposite to the light that is held in the upper specific pattern; the top surface of the upper substrate is illuminated by the platform driving portion, and the above-mentioned first shaving portion is relatively moved to the right-weighting mechanism, which has a function for detecting And maintaining an offset of the relative position of the calibration camera relative to the first shaving portion; and: m′ according to an offset detected by the offset detecting mechanism, Correct the drawing position on the substrate. 2. The drawing device of claim 1, wherein the offset detecting means includes a first detecting means for detecting a position shift amount of the light irradiating portion and a specific calibration lever; and a second detecting means for detecting the machine a positional shift amount; and the calibration photographing: calculating means for calculating a relative position of the calibration camera with respect to the light irradiating portion based on a positional shift amount by the first detecting means and the second detecting means The offset. The drawing device of claim 2, wherein the correction mark is formed on the platform; the flat drive unit is moved by the relative movement of the light and the light irradiation unit, and the (4) The above-mentioned correction mark is disposed in the state in which the light is below the pupil, and the correction ticket is placed under the calibration camera. The drawing device of claim 3, further comprising a posture detecting mechanism that detects a posture of the platform, wherein the platform driving unit-surface corrects the posture of the platform based on information detected by the posture detecting unit The drawing device of claim 4, further comprising a correction camera that is disposed below the correction mark; wherein the first detection means detects the illumination light of the light-emitting portion and the correction by using the correction camera Marking, and detecting a positional shift amount between the light-irradiating portion and the correction mark based on the acquired image. "The second detecting means captures the correction by using the calibration camera: and detects the correction based on the acquired image Marking the position offset with the above-mentioned calibration camera. 6. The drawing device of claim 5, wherein the push-up, f/, and further includes a positioning mechanism that positions the illumination light position of the first makeup portion at a specific position 7. The method of claim 6, wherein the positioning mechanism comprises: And an adjustment mechanism obtained by the camera for photographing the illumination unit of the light irradiation unit below, and based on the illumination data of the substrate driven by the illumination camera 121799.doc 200817846 The calibration image adjusts the light irradiation unit. The drawing device of the request item 7 moves the camera according to the target camera. 9. A calibration method, characterized in that it is attached to the light irradiation unit. The upper surface of the substrate held on the platform is photographed on the upper surface of the substrate by the projecting material (4). The substrate on the platform is photographed by using a calibration camera, and the substrate on the platform is calibrated according to the obtained image. And including: a first step of detecting an offset of the relative position of the calibration camera relative to the light-emitting portion; and a second step of the offset according to the first step and the image, Calibrating the substrate on the above platform. 1〇. As in the description device of claim 1, the plurality of reference patterns in # are individually formed on the substrate And a plurality of regions; and further comprising: a position detecting mechanism that detects a position of the plurality of reference patterns in each of the regions held on the substrate of the platform; and a second correcting mechanism that detects the position based on the position The position of the plurality of reference patterns detected by the mechanism corrects the light irradiation position of the light-irradiating portion. 11. The drawing device of claim 10, wherein the position detecting mechanism is formed in each of the plurality of regions The plural (four) bits are marked with a mark to detect the position of the plurality of reference patterns. 121799.doc 200817846 12.: Please refer to the device of item U, wherein the light irradiation portion has: emitting/emitting light to the surface of the substrate; and the aperture The portion partially shields the light emitted from the (4) light to form the specific pattern; and [the second correction mechanism corrects the position of the aperture by adjusting the position of the aperture portion. 13: The drawing of the request item 12, wherein the light irradiation unit has a plurality of light irradiation heads, and the second correction mechanism individually adjusts the position of each of the plurality of light irradiation heads . 14. The description of claim 13 is a method of determining the distance between the plurality of reference patterns in the respective regions of the plurality of regions from the standard position. The positional shift amount, and the illumination position of the light is corrected based on the average value of the points. 15. The apparatus according to claim 13, wherein the second correcting means calculates a positional shift amount of the plurality of reference patterns from the standard position in each of the plurality of regions, and according to the calculated positional offset In the shift amount, the irradiation position of the light is individually corrected in each of the plurality of regions. The drawing device of claim 15, wherein the second correcting means adjusts the light irradiation position of the light irradiation portion immediately before each of the plurality of regions on the substrate reaches the drawing position. I 17 · The drawing device of the item 1 3, wherein the correction mechanism of the upper part of the plurality of regions calculates the inclination angle of the plurality of reference patterns from the standard position in each of the plurality of regions, and according to The tilt angle of 1 1 ^ is calculated to continuously correct the illumination position of the light. , 121129.doc 200817846 18. A drawing method characterized in that: a plurality of reference maps each having a specific pattern m on a photosensitive material on a substrate having a plurality of regions formed in a plurality of regions include: &gt The first step, which detects the offset of the calibration camera relative to the position of the light pair; the second phase of the centripet phase, which holds the substrate on the platform; and the third step, which is based on the offset detected in the above step And calibrating the Ping-you substrate by the image obtained by the calibration camera; and the fourth step of the chamber, detecting the position of the plurality of reference patterns in each of the regions on the substrate held on the platform; and In the fifth step, the light irradiation position is corrected based on the position of the plurality of reference patterns detected in the fourth step, and the substrate on the stage is irradiated with light of a specific pattern by the light irradiation unit. 19. The method of claim 18, wherein in the step (a) above, the tilt of the substrate held on the platform in a horizontal plane is corrected. 20. A substrate processing system, comprising: a pattern drawing device that draws a specific pattern on a photosensitive material on a substrate, the substrate including a plurality of reference patterns individually formed in a plurality of regions; and a pre-processing device The pre-processing of the substrate is performed before the processing of the pattern drawing device; and the pre-processing device includes: a position detecting mechanism that detects the upper surface in each of the regions on the substrate 121799.doc 200817846 Position of the pattern; the pattern drawing device includes: a platform for holding the substrate; a light illuminating portion 'the light that illuminates the specific pattern on the platform; the top surface platform driving portion, 苴佶t ten moves; In contrast to the above-described light-irradiating portion, the light-receiving portion includes a substrate for detecting the position and posture of the substrate held on the platform, and the substrate on the platform is calibrated; Detecting an offset of the relative position of the calibration camera relative to the light irradiation portion; a correction mechanism that corrects a drawing position on the substrate based on an offset amount sensible by the offset detecting device; and a #2 correction mechanism that is based on the plurality of reference patterns measured by the position detecting mechanism Zai Shuangtu + _ is the I position, and corrects the illumination position of the above illumination. 1 121799.doc