JP2008065034A - Drawing device and alignment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern drawing device and an alignment method by which drawing can be carried out at an accurate position on a substrate even when a positional relation between a light irradiating unit and an alignment camera changes, without using a high-performance driving mechanism for the alignment camera. <P>SOLUTION: The pattern drawing device 1 has functions of detecting a shift amount in the relative position of respective alignment cameras 41 to 44 with respect to pulse light projected from an optical head 32 and correcting an alignment amount of a substrate 9 and a starting position of drawing on a substrate 9 based on the detected shift amount. Even when the positional relation between the pulse light projected from the optical head 32 and respective alignment cameras 41 to 44 varies, drawing can be carried out while correcting the varied amount. Therefore, the pattern drawing device 1 is capable of drawing a pattern at an accurate position on the substrate 9. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light-sensitive material formed on a substrate such as a color filter substrate, a glass substrate for flat panel display (FPD) such as a liquid crystal display device or a plasma display device, a semiconductor substrate, or a printed substrate. The present invention relates to a drawing apparatus for drawing a predetermined pattern, and a substrate alignment method in the drawing apparatus.

  Conventionally, in a substrate manufacturing process, a pattern drawing apparatus that draws a predetermined pattern on the surface of a substrate by irradiating light onto a photosensitive material formed on the surface of the substrate has been used. A conventional pattern drawing apparatus includes a stage that moves while holding the substrate in a horizontal posture, and an optical head that irradiates a predetermined pattern of light onto the upper surface of the substrate, and irradiates light from the optical head while moving the substrate. Thus, a predetermined pattern is drawn on the upper surface of the substrate.

  The configuration of a conventional pattern drawing apparatus is disclosed in Patent Document 1, for example.

JP 2000-329523 A

  Such a pattern drawing apparatus has an alignment camera for detecting the position and posture of the substrate held on the stage. Then, the stage is operated based on the position and posture of the substrate acquired from the alignment camera, and the substrate is aligned. However, when drawing data input to the pattern drawing apparatus changes, it is necessary to move the position of the irradiation light of the optical head and the position of the alignment camera above the stage, and these positional relationships change. In addition, these positional relationships may change with time. If the positional relationship between the optical head and the alignment camera deviates as described above, even if the alignment of the substrate is performed using the alignment camera, drawing cannot be performed at an accurate position on the substrate.

  Patent Document 1 discloses an apparatus that adjusts the position of an alignment scope (alignment camera) using a reference mask. However, in the configuration of Patent Document 1, in order to adjust the position of the alignment scope itself, it is necessary to use a high-performance drive mechanism to precisely displace the position of the alignment scope.

  The present invention has been made in view of such circumstances, and even if the positional relationship between the light irradiation unit and the alignment camera changes without using a high-performance drive mechanism for the alignment camera, the substrate It is an object of the present invention to provide a pattern drawing apparatus and an alignment method capable of drawing at an accurate position above.

  In order to solve the above problems, the invention according to claim 1 is a drawing apparatus for drawing a predetermined pattern on a photosensitive material formed on a substrate, the stage holding the substrate, and the stage held on the stage A light irradiating unit that irradiates a top surface of the substrate with a predetermined pattern of light, a stage driving unit that relatively moves the stage and the light irradiating unit, and a position and posture of the substrate held on the stage An alignment unit that includes an alignment camera and aligns the substrate on the stage with respect to the light irradiation unit, a shift amount detection unit that detects a shift amount of a relative position of the alignment camera with respect to the light irradiation unit, and the shift Correction means for correcting the drawing position on the substrate based on the shift amount detected by the amount detection means.

  The invention according to claim 2 is the drawing apparatus according to claim 1, wherein the deviation amount detection unit includes a first detection unit that detects a positional deviation amount between the light irradiation unit and a predetermined calibration mark. , Second detection means for detecting a positional deviation amount between the calibration mark and the alignment camera, and the light irradiation unit based on the positional deviation amounts detected by the first detection means and the second detection means. And an arithmetic means for calculating a displacement amount of the relative position of the alignment camera.

  The invention according to claim 3 is the drawing apparatus according to claim 2, wherein the calibration mark is formed on the stage, and the stage driving unit relatively moves the stage and the light irradiation unit. Thereby, the state in which the calibration mark is disposed below the light irradiation unit and the state in which the calibration mark is disposed below the alignment camera are switched.

  The invention according to claim 4 is the drawing apparatus according to claim 3, further comprising posture detection means for detecting the posture of the stage, wherein the stage driving unit is configured to use information detected by the posture detection means. The stage is moved while correcting the posture of the stage based on the above.

  The invention according to claim 5 is the drawing apparatus according to any one of claims 2 to 4, further comprising a calibration camera installed below the calibration mark, wherein the first detection means. Imaging the irradiation light of the light irradiation unit and the calibration mark by the calibration camera, detecting a positional deviation amount between the light irradiation unit and the calibration mark based on the acquired image, The second detecting means is characterized in that the calibration mark is imaged by the alignment camera, and a positional deviation amount between the calibration mark and the alignment camera is detected based on the acquired image.

  The invention according to claim 6 is the drawing apparatus according to any one of claims 1 to 5, further comprising positioning means for positioning the position of the irradiation light of the light irradiation unit at a predetermined position. Features.

  The invention according to claim 7 is the drawing apparatus according to claim 6, wherein the positioning unit is configured to capture a light irradiation unit camera that images the irradiation light of the light irradiation unit from below, and the light irradiation unit camera. And adjusting means for adjusting the light irradiation unit based on the image obtained by the above.

  The invention according to claim 8 is the drawing apparatus according to any one of claims 1 to 7, further comprising an alignment camera driving unit that moves the alignment camera in accordance with drawing data of a substrate to be processed. It is further provided with the feature.

  The invention according to claim 9 aligns the substrate on the stage in a drawing apparatus that draws a predetermined pattern on the upper surface of the substrate by irradiating the upper surface of the substrate held on the stage with light from the light irradiation unit. An alignment method for imaging a substrate and aligning a substrate on the stage based on the acquired image, the first step of detecting a shift amount of a relative position of the alignment camera with respect to the light irradiation unit; And a second step of aligning the substrate on the stage based on the shift amount detected in the first step and the image.

  According to the first to eighth aspects of the present invention, the drawing apparatus is based on a deviation amount detection unit that detects a deviation amount of the relative position of the alignment camera with respect to the light irradiation unit, and a deviation amount detected by the deviation amount detection unit. Correction means for correcting the drawing position on the substrate. For this reason, even if the positional relationship between the light irradiation unit and the alignment camera changes, the drawing process can be performed while correcting the change. Therefore, the drawing apparatus of the present invention can perform drawing at an accurate position on the substrate. In addition, since the position of the alignment camera itself is not corrected but the drawing position on the substrate is corrected, it is not necessary to use a precise drive mechanism for the alignment camera.

  In particular, according to the invention described in claim 2, the deviation amount detection means includes a first detection means for detecting a positional deviation amount between the light irradiation unit and the predetermined calibration mark, and the calibration mark and the alignment camera. Second detection means for detecting a positional deviation amount; computing means for calculating a deviation amount of the relative position of the alignment camera with respect to the light irradiation unit based on the positional deviation amounts detected by the first detection means and the second detection means; Have For this reason, the shift amount of the relative position of the alignment camera with respect to the light irradiation unit can be easily detected via the calibration mark.

  In particular, according to the third aspect of the present invention, the calibration mark is formed on the stage, and the stage driving unit moves the stage and the light irradiation unit relative to each other, thereby moving the calibration mark below the light irradiation unit. Is switched between a state in which the calibration mark is disposed and a state in which the calibration mark is disposed below the alignment camera. For this reason, each displacement amount can be detected appropriately in the first detection means and the second detection means.

  In particular, according to the invention described in claim 4, the apparatus further includes an attitude detection unit that detects the attitude of the stage, and the stage driving unit corrects the attitude of the stage based on the information detected by the attitude detection unit, Move the stage. For this reason, the calibration mark on the stage moves accurately between the lower part of the light irradiation unit and the lower part of the alignment camera.

  In particular, according to the fifth aspect of the present invention, the apparatus further includes a calibration camera installed below the calibration mark, and the first detection means uses the calibration camera to detect the irradiation light and the calibration mark of the light irradiation unit. The second detection means captures the calibration mark with an alignment camera, and calibrates based on the acquired image. The amount of positional deviation between the position mark and the alignment camera is detected. For this reason, it is possible to appropriately detect each positional deviation amount using the calibration camera and the alignment camera.

  In particular, according to the invention described in claim 6, it further includes positioning means for positioning the position of the irradiation light of the light irradiation unit at a predetermined position. For this reason, it is possible to perform drawing at a more accurate position on the substrate.

  In particular, according to the invention described in claim 7, the positioning means performs the light irradiation based on the light irradiation unit camera that images the irradiation light of the light irradiation unit from below and the image acquired by the light irradiation unit camera. Adjusting means for adjusting the portion. For this reason, the position of irradiation light can be correctly positioned based on the measurement data of irradiation light.

  In particular, according to the invention described in claim 8, the image processing apparatus further includes an alignment camera driving unit that moves the alignment camera in accordance with drawing data of the substrate to be processed. For this reason, the alignment camera can be moved to a different alignment position for each drawing data. In addition, since the positional deviation of the alignment camera after the movement is detected by the deviation amount detecting unit and corrected by the correcting unit, it is not necessary to apply a precise driving mechanism to the alignment camera driving unit.

  According to the invention described in claim 9, the alignment method includes a first step of detecting a shift amount of a relative position of the alignment camera with respect to the light irradiation unit, and a shift amount detected in the first step and the alignment. And a second step of aligning the substrate on the stage based on the image acquired by the camera. For this reason, even when the positional relationship between the light irradiation unit and the alignment camera changes, the substrate can be aligned while correcting the change. Therefore, it is possible to perform drawing at an accurate position on the substrate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure referred in the following description, in order to clarify the positional relationship and operation direction of each member, the common XYZ orthogonal coordinate system is attached | subjected.

<1. Configuration of pattern drawing apparatus>
1 and 2 are a side view and a top view showing a configuration of a pattern drawing apparatus 1 according to an embodiment of the present invention. The pattern drawing device 1 is a device for drawing a predetermined pattern on the upper surface of a glass substrate (hereinafter simply referred to as “substrate”) 9 for a color filter in a process of manufacturing a color filter of a liquid crystal display device. As shown in FIGS. 1 and 2, the pattern drawing apparatus 1 includes a stage 10 for holding a substrate 9, a drive unit 20 connected to the stage 10, and a head unit 30 having a plurality of optical heads 32. And a plurality of alignment cameras 41-44.

  The stage 10 has a flat outer shape, and is a holding unit for placing and holding the substrate 9 on the upper surface thereof in a horizontal posture. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. For this reason, when the substrate 9 is placed on the stage 10, the substrate 9 is fixedly held on the upper surface of the stage 10 by the suction pressure of the suction holes.

  In the vicinity of the two corners on the −Y side of the stage 10 (outside the substrate holding area), through holes 11 and 12 that penetrate the stage 10 vertically are formed. FIG. 3 is an enlarged top view of the through holes 11 and 12 formed in the vicinity of the corner of the stage 10. 4 is a longitudinal sectional view of the stage 10 of FIG. 3 cut along the line IV-IV. As shown in FIGS. 3 and 4, translucent plates 11 a and 12 a are attached to the upper portions of the through holes 11 and 12, respectively. The translucent plates 11a and 12a are provided with calibration marks CM1 and CM2, which are used as position measurement references in the calibration process described later. The calibration marks CM1 and CM2 are formed on the surfaces of the light transmitting plates 11a and 12a with a light shielding material.

  Calibration cameras 11b and 12b are installed in the through holes 11 and 12, respectively. The calibration cameras 11b and 12b are installed in the through holes 11 and 12 so as to face upward, and the centers of the calibration marks CM1 and CM2 are located at the center of each field of view (or at least within the field of view). It has been adjusted. Even when the stage 10 moves, the positional relationship between the calibration cameras 11b and 12b and the calibration marks CM1 and CM2 is constant and does not change.

  Returning to FIG. 1 and FIG. 2, the drive unit 20 moves the stage 10 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the Z-axis). Mechanism. The drive unit 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. A base plate 24 that supports the support plate 22 and a main scanning mechanism 25 that moves the base plate 24 in the main scanning direction.

  The rotation mechanism 21 includes a linear motor 21 a that includes a mover attached to the end portion on the −Y side of the stage 10 and a stator laid on the upper surface of the support plate 22. A rotation shaft 21 b is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the linear motor 21a is operated, the mover moves in the X-axis direction along the stator, and the stage 10 rotates within a predetermined angle range around the rotation shaft 21b on the support plate 22.

  The sub-scanning mechanism 23 includes a linear motor 23 a configured by a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. In addition, a pair of guide portions 23 b extending in the sub-scanning direction is provided between the support plate 22 and the base plate 24. For this reason, when the linear motor 23a is operated, the support plate 22 moves in the sub-scanning direction along the guide portion 23b on the base plate 24.

  The main scanning mechanism 25 has a linear motor 25 a composed of a mover attached to the lower surface of the base plate 24 and a stator laid on the base 60 of the apparatus 1. A pair of guide portions 25 b extending in the main scanning direction is provided between the base plate 24 and the base 60. For this reason, when the linear motor 25a is operated, the base plate 24 moves in the main scanning direction along the guide portion 25b on the base 60.

  As shown in FIG. 2, a posture detection unit 26 for detecting the posture of the stage 10 is provided on the −Y side of the stage 10. The attitude detection unit 26 includes a laser length measuring device 26a, and a plurality of length measuring laser beams L branched from the laser light emitted from the laser length measuring device 26a are used to contact the side surface on the −Y side of the stage 10. Measure distance. Then, the posture (tilt) of the stage 10 is detected based on the acquired distance. A control unit 50 (see FIG. 7), which will be described later, operates the rotating mechanism 21, the sub-scanning mechanism 23, and the main scanning mechanism 25 based on the information acquired from the posture detection unit 26, and corrects the posture of the stage 10. While moving the stage 10.

  FIG. 5 is a diagram showing an example of such posture control of the stage 10. When it is desired to move the stage 10 in the main scanning direction, if only the main scanning mechanism 25 is operated without performing correction, the stage 10 moves out of the strict main scanning direction due to a mechanical error of the main scanning mechanism 25. (The state of the chain line in FIG. 5). The driving unit 20 of the present embodiment detects such a shift of the stage 10 by the posture detection unit 26 described above, operates the rotation mechanism 21 and the sub-scanning mechanism 23 based on the detected information, and moves the posture of the stage 10. The stage 10 is accurately moved in the main scanning direction (corrected line state in FIG. 5).

  Returning to FIG. 1 and FIG. 2, the head unit 30 is a mechanism for irradiating the upper surface of the substrate 9 held on the stage 10 with a predetermined pattern of pulsed light. The head unit 30 includes a frame 31 laid on the base 60 so as to straddle the stage 10 and the drive unit 20, and a plurality of optical heads 32 mounted on the frame 31 at equal intervals along the sub-scanning direction. have. One laser oscillator 34 is connected to each optical head 32 via an illumination optical system 33. In addition, a laser driving unit 35 is connected to the laser oscillator 34. Therefore, when the laser driving unit 35 is operated, pulse light is oscillated from the laser oscillator 34, and the oscillated pulse light is introduced into each optical head 32 via the illumination optical system 33.

  In each optical head 32, a light emitting portion 36 for emitting the pulsed light introduced from the illumination optical system 33 downward and a light beam having a predetermined pattern by partially shielding the pulsed light are formed. Aperture unit 37 and a projection optical system 38 for irradiating the upper surface of the substrate 9 with the light beam. The pulsed light emitted from the emission unit 36 is partially shielded when passing through the aperture unit 37 and enters the projection optical system 38 as a light beam having a predetermined pattern. A predetermined pattern is drawn on the photosensitive material (color resist) applied to the upper surface of the substrate 9 by irradiating the upper surface of the substrate 9 with the pulsed light that has passed through the projection optical system 38.

  The plurality of optical heads 32 are arranged at equal intervals (for example, at intervals of 200 mm) along the sub-scanning direction. When pulse light is irradiated from each optical head 32 while moving the stage 10 in the main scanning direction, a plurality of patterns are drawn on the upper surface of the substrate 9 with a predetermined exposure width (for example, 50 mm width) in the main scanning direction. The When one drawing in the main scanning direction is completed, the pattern drawing apparatus 1 moves the stage 10 by the exposure width in the sub-scanning direction, and again moves the stage 10 in the main scanning direction, and pulses from each optical head 32. Irradiate light. As described above, the pattern drawing apparatus 1 repeats the drawing of the pattern in the main scanning direction a predetermined number of times (for example, four times) while shifting the substrate 9 in the sub-scanning direction by the exposure width of the optical head 32, thereby A pattern for a color filter is formed on the entire surface.

  The pattern drawing apparatus 1 includes an optical head camera 27 for imaging pulsed light emitted from each optical head 32. The optical head camera 27 is movable in the sub-scanning direction along a guide rail 28 attached to the + Y side end of the base plate 24 via a bracket 29. When the optical head camera 27 is used, the base plate 24 is positioned so that the optical head camera 27 is positioned below the head portion 30 (state shown in FIGS. 1 and 2). Then, the optical head camera 27 is moved in the sub-scanning direction along the guide rail 28, and the pulsed light emitted from each optical head 32 is imaged. For example, a linear motor is used as a drive mechanism for moving the optical head camera 27 on the guide rail 28.

  FIG. 6 is a view of the plurality of optical heads 32 as viewed from below (from the optical head camera 27 side). The optical head camera 27 images the pulsed light PL emitted from each optical head 32, and the line width of the pulsed light PL in the optical head 32, the pitch of each optical head 32, the distance between adjacent optical heads 32, Information such as the position of each optical head 32 in the main scanning direction and the amount of light of each pulsed light PL is acquired. And the acquired information is transmitted to the control part 50 (refer FIG. 7) mentioned later. The optical head camera 27 can be constituted by, for example, a CCD camera, but may be constituted by using a CCD camera and a light quantity sensor in combination.

  As conceptually shown in FIG. 6, each optical head 32 is connected to an actuator 39 that individually adjusts the position of the pulsed light PL emitted from each optical head 32. The actuator 39 can be realized, for example, as a mechanism that adjusts the position of the aperture unit 37 in the optical head 32 using a linear motor. Further, the actuator 39 can adjust the line width of the pulsed light PL by sliding the two aperture plates set up and down in the aperture unit 37 to adjust the width of the light transmitting region. . A control unit 50 (see FIG. 7), which will be described later, operates each actuator 39 based on information acquired from the optical head camera 27, and corrects the position and line width of the pulsed light PL emitted from each optical head 32. To do. Further, the control unit 50 adjusts the projection optical system 38 and the illumination optical system 33 based on the information acquired from the optical head camera 27, and sets the pitch and light amount of the pulsed light PL emitted from each optical head 32, respectively. to correct.

  Returning to FIGS. 1 and 2, the alignment cameras 41 to 44 are imaging mechanisms for imaging the alignment marks AM <b> 1 to AM <b> 4 (see FIG. 20) formed on the upper surface of the substrate 9. As conceptually shown in FIG. 2, drive mechanisms 41 a to 44 a are connected to the alignment cameras 41 to 44, respectively. When the alignment cameras 41 to 44 are used, the drive unit 20 is operated to position the stage 10 so that the alignment marks AM1 to AM4 formed at the four corners of the substrate 9 are positioned below the alignment cameras 41 to 44. At the same time, the drive mechanisms 41a to 44a are operated to position the alignment cameras 41 to 44. The alignment cameras 41 to 44 respectively image the alignment marks AM1 to AM4 on the substrate 9 and acquire the coordinates of the alignment marks AM1 to AM4.

  Further, the pattern drawing apparatus 1 includes a control unit 50 in addition to the above configuration. FIG. 7 is a block diagram illustrating a connection configuration between the above-described units of the pattern drawing apparatus 1 and the control unit 50. As shown in FIG. 7, the control unit 50 includes the calibration cameras 11b and 12b, the linear motors 21a, 23a and 25a, the attitude detection unit 26, the optical head camera 27, the laser drive unit 35, the actuator 39, and the alignment. It is electrically connected to the cameras 41 to 44 and the drive mechanisms 41a to 44a, and controls these operations. The control unit 50 is configured by, for example, a computer having a CPU and a memory, and controls the above-described units when the computer operates according to a program installed in the computer.

<2. Calibration process>
Next, a process (calibration process) for measuring a positional relationship deviation between the optical head 32 and the alignment cameras 41 to 44 in the pattern writing apparatus 1 having the above-described configuration will be described. The calibration process is executed prior to the drawing process when the position of the pulsed light PL irradiated from the optical head 32 or the position of the alignment cameras 41 to 44 changes due to changes in drawing data or changes over time.

  8 to 10 are flowcharts showing the flow of calibration processing in the pattern drawing apparatus 1. FIGS. 11 to 17 are diagrams showing states of the pattern drawing apparatus 1 at each stage of the calibration process. When performing the calibration process in the pattern drawing apparatus 1, first, the actuator 39 of each optical head 32 is operated based on the drawing data used for the next drawing process, and the irradiation position of the pulsed light PL of each optical head 32 is determined. Then, it is positioned at a substantially predetermined position (step S11).

  Next, the pattern drawing apparatus 1 operates the main scanning mechanism 25 to move the base plate 24 so that the optical head camera 27 is disposed below the head unit 30. Then, while moving the optical head camera 27 along the guide rail in the sub-scanning direction, the pulsed light PL emitted from each optical head 32 is imaged, the line width of the pulsed light PL in the optical head 32, and each optical Information such as the pitch of the heads 32, the distance between adjacent optical heads 32, the position of each optical head 32 in the main scanning direction, and the amount of light of each pulsed light PL is acquired (step S12, state of FIG. 11).

  The pattern drawing apparatus 1 operates each actuator 39 based on the information acquired from the optical head camera 27 to correct the position and line width of the pulsed light PL emitted from each optical head 32. The pattern drawing apparatus 1 adjusts the projection optical system 38 and the projection optical system 33 based on the information acquired from the optical head camera 27, and sets the pitch and light amount of the pulsed light PL emitted from each optical head 32. Each is corrected (step S13). Through the above steps S11 to S13, the position, line width, and amount of light of the pulsed light PL irradiated from each optical head 32 of the head unit 30 are in an appropriate state, and the adjustment of the head unit 30 itself is completed.

  Subsequently, the pattern drawing apparatus 1 operates the drive mechanisms 41a to 44a based on the drawing data used for the next drawing process, and positions the alignment cameras 41 to 44 at substantially predetermined positions (step S14). And the drive part 20 is operated and the stage 10 is moved so that the translucent board 11a may be arrange | positioned just under the alignment camera 42 (step S15, state of FIG. 12). In this state, the alignment camera 42 images the calibration mark CM1 of the translucent plate 11a positioned below, and measures the amount of displacement of the alignment camera 42 with respect to the calibration mark CM1 (step S16).

  FIG. 18 is a diagram illustrating an example of a captured image of the alignment camera 42 in step S16. The alignment camera 42 measures how far the visual field center O is from the calibration mark CM1 in the captured image in each of the X-axis direction and the Y-axis direction, and the position of the alignment camera 42 with respect to the calibration mark CM1. The shift amount (ΔX2b, ΔY2b) is acquired. The acquired information is transmitted from the alignment camera 42 to the control unit 50 and used as a correction value in an alignment process described later.

  Next, the pattern drawing apparatus 1 operates the drive unit 20 to move the stage 10 so that the translucent plate 11a is disposed almost directly below the alignment camera 41 (step S17, state of FIG. 13). Then, the alignment camera 41 captures the calibration mark CM1 of the translucent plate 11a positioned below, and measures the amount of positional deviation of the alignment camera 41 with respect to the calibration mark CM1 (step S18). In step S18, as in the example of FIG. 18, the positional deviation amount (ΔX2a, ΔY2a) of the alignment camera 41 with respect to the calibration mark CM1 is acquired for each of the X axis direction and the Y axis direction, and the acquired information is aligned. It is transmitted from the camera 41 to the control unit 50.

  Thereafter, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmitting plate 11a is disposed almost directly below the optical head 32 disposed on the most + X side (step S19, FIG. 14 state). Then, the pulsed light PL is irradiated from the optical head 32, and the calibration mark CM1 and the projected image of the pulsed light PL are taken from the calibration camera 11b disposed below the light transmitting plate 11a (step S20).

  FIG. 19 is a diagram illustrating an example of a captured image of the calibration camera 11b in step S20. The calibration camera 11b measures how far the center of the calibration mark CM1 is away from the pulsed light PL in the captured image in each of the X-axis direction and the Y-axis direction, and the calibration mark for the pulsed light PL. The positional deviation amount (ΔX1a, ΔY1a) of CM1 is acquired. The acquired information is transmitted from the calibration camera 11b to the control unit 50, and is used as a correction value in an alignment process described later.

  Subsequently, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmitting plate 12a is disposed almost directly below the optical head 32 disposed on the most −X side (step S21). FIG. 15 shows the state). Then, the pulsed light PL is irradiated from the optical head 32, and the projection images of the light transmitting plate 12a and the pulsed light PL are taken from the calibration camera 12b disposed below the light transmitting plate 12a (step S22). In step S22, as in the example of FIG. 19, the positional deviation amount (ΔX1b, ΔY1b) of the calibration mark CM with respect to the pulsed light PL is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is calibrated. Is transmitted from the motion camera 12b to the control unit 50.

  Thereafter, the pattern drawing apparatus 1 operates the drive unit 20 to move the stage 10 so that the light transmitting plate 12a is disposed almost directly below the alignment camera 43 (step S23, state of FIG. 16). Then, the alignment camera 43 photographs the calibration mark CM2 of the translucent plate 12a positioned below, and measures the amount of positional deviation of the alignment camera 43 with respect to the calibration mark CM2 (step S24). In step S24, as in the example of FIG. 18, the positional deviation amount (ΔX2c, ΔY2c) of the alignment camera 43 with respect to the calibration mark CM2 is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is aligned. It is transmitted from the camera 43 to the control unit 50.

  Further, the pattern drawing apparatus 1 operates the drive unit 20 to move the stage 10 so that the translucent plate 12a is disposed almost directly below the alignment camera 44 (step S25, state of FIG. 17). Then, the alignment camera 44 images the calibration mark CM2 of the translucent plate 12a positioned below, and measures the amount of positional deviation of the alignment camera 44 with respect to the calibration mark CM2 (step S26). In step S26, as in the example of FIG. 18, the positional deviation amount (ΔX2d, ΔY2d) of the alignment camera 44 with respect to the calibration mark CM2 is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is aligned. It is transmitted from the camera 44 to the control unit 50.

  That is, in the above calibration process, the pattern drawing apparatus 1 acquires the following information (1) to (6) and holds these pieces of information in the control unit 50.

(1) Position shift amount (ΔX2b, ΔY2b) of alignment camera 42 with respect to calibration mark CM1
(2) Position shift amount (ΔX2a, ΔY2a) of alignment camera 41 with respect to calibration mark CM1
(3) Amount of displacement (ΔX1a, ΔY1a) of the calibration mark CM1 with respect to the pulsed light PL of the optical head 32
(4) Amount of displacement (ΔX1b, ΔY1b) of the calibration mark CM2 with respect to the pulsed light PL of the optical head 32
(5) Position shift amount (ΔX2c, ΔY2c) of alignment camera 43 with respect to calibration mark CM2
(6) Amount of positional deviation of the alignment camera 44 with respect to the calibration mark CM2 (ΔX2d, ΔY2d)
From the above information (2) and (3), the shift amount of the relative position of the alignment camera 41 with respect to the pulsed light PL of the optical head 32 is uniquely determined as (ΔX1a, ΔY1a) + (ΔX2a, ΔY2a). Further, from the above information (1) and (3), the shift amount of the relative position of the alignment camera 42 with respect to the pulsed light PL of the optical head 32 is uniquely determined as (ΔX1a, ΔY1a) + (ΔX2b, ΔY2b). Further, from the above information (4) and (5), the shift amount of the relative position of the alignment camera 43 with respect to the pulsed light PL of the optical head 32 is uniquely determined as (ΔX1b, ΔY1b) + (ΔX2c, ΔY2c). Further, from the above information (4) and (6), the shift amount of the relative position of the alignment camera 44 with respect to the pulsed light PL of the optical head 32 is uniquely determined as (ΔX1b, ΔY1b) + (ΔX2d, ΔY2d). That is, in the calibration process described above, a shift amount of the relative position of each alignment camera 41 to 44 with respect to the pulsed light PL of the optical head 32 is detected.

  When the stage 10 is moved in the calibration process, the posture detection unit 26 detects the posture of the stage 10 (tilt around the Z axis), and moves the stage 10 while correcting the posture. Therefore, the stage 10 accurately moves in the main scanning direction and the sub-scanning direction, and the calibration marks CM1 and CM2 on the stage 10 are also accurately between the lower side of the alignment cameras 41 to 44 and the lower side of the optical head 32. Move to.

<3. Drawing process>
Next, a procedure for drawing a pattern on the upper surface of the substrate 9 in the pattern drawing apparatus 1 will be described. As illustrated in FIG. 20, alignment marks AM <b> 1 to AM <b> 4 used as references when aligning the substrate 9 are formed in advance at the four corners of the upper surface of the substrate 9 to be processed in the pattern drawing apparatus 1. Yes.

  FIG. 21 is a flowchart showing the flow of the drawing process in the pattern drawing apparatus 1. When performing a drawing process in the pattern drawing apparatus 1, first, the substrate 9 is placed on the upper surface of the stage 10 (step S31). The substrate 9 is adsorbed by a plurality of suction holes formed on the upper surface of the stage 10 and fixedly held on the upper surface of the stage 10.

  Next, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the alignment marks AM1 to AM4 on the substrate 9 are arranged almost below the alignment cameras 41 to 44. And the pattern drawing apparatus 1 image | photographs the alignment marks AM1-AM4 formed in the four corners of the board | substrate 9 with the alignment cameras 41-44, and measures the positional offset amount of each alignment mark AM1-AM4 with respect to the alignment cameras 41-44. (Step S32).

  FIG. 22 is a diagram illustrating an example of a captured image of the alignment camera 41 in step S32. The alignment camera 41 measures how far the alignment mark AM1 in the photographed image is from the visual field center O in each of the X-axis direction and the Y-axis direction, and the positional deviation amount (ΔX3a) of the alignment mark AM1 with respect to the alignment camera 41 , ΔY3a). The other alignment cameras 42 to 44 also measure how far the alignment marks AM2 to AM4 in the captured image are from the visual field center O in the same manner as in FIG. 22, and the alignment marks AM2 for the alignment cameras 42 to 44 are measured. ˜AM4 positional deviation amounts (ΔX3b, ΔY3b), (ΔX3c, ΔY3c), (ΔX3d, ΔY3d) are acquired.

  When the positional deviation amounts of the alignment marks AM1 to AM4 with respect to the alignment cameras 41 to 44 are acquired, the control unit 50 acquires the positional deviation amounts and (1) to (6) acquired in the above calibration process. Based on the displacement amount, the final displacement amount of each of the alignment marks AM1 to AM4 formed on the substrate 9 is calculated (step S33).

  For example, the final positional deviation amounts (ΔXa, ΔYa) of the alignment mark AM1 are the positional deviation amounts (ΔX1a, ΔY1a) of the calibration mark CM1 with respect to the pulsed light PL and the positional deviation amounts of the alignment camera 41 with respect to the calibration mark CM1. Using (ΔX2a, ΔY2a) and the positional deviation amount (ΔX3a, ΔY3a) of the alignment mark AM1 with respect to the alignment camera 41, the following calculation (Equation 1) is performed.

  (ΔXa, ΔYa) = (ΔX1a, ΔY1a) + (ΔX2a, ΔY2a) + (ΔX3a, ΔY3a) (Equation 1)

  Further, the final positional deviation amounts (ΔXb, ΔYb) of the alignment mark AM2 are the positional deviation amounts (ΔX1a, ΔY1a) of the calibration mark CM1 with respect to the pulsed light PL and the positional deviation amount of the alignment camera 42 with respect to the calibration mark CM1. Using (ΔX2b, ΔY2b) and the positional deviation amount (ΔX3b, ΔY3b) of the alignment mark AM2 with respect to the alignment camera 42, calculation is performed as shown in the following formula 2.

  (ΔXb, ΔYb) = (ΔX1a, ΔY1a) + (ΔX2b, ΔY2b) + (ΔX3b, ΔY3b) (Equation 2)

  Further, the final positional deviation amount (ΔXc, ΔYc) of the alignment mark AM3 is the positional deviation amount (ΔX1b, ΔY1b) of the calibration mark CM2 with respect to the pulsed light PL and the positional deviation amount of the alignment camera 43 with respect to the calibration mark CM2. Using (ΔX2c, ΔY2c) and the positional deviation amount (ΔX3c, ΔY3c) of the alignment mark AM3 with respect to the alignment camera 43, the following equation 3 is calculated.

  (ΔXc, ΔYc) = (ΔX1b, ΔY1b) + (ΔX2c, ΔY2c) + (ΔX3c, ΔY3c) (Equation 3)

  Further, the final positional deviation amount (ΔXd, ΔYd) of the alignment mark AM4 includes the positional deviation amount (ΔX1b, ΔY1b) of the calibration mark CM2 with respect to the pulsed light PL and the positional deviation amount of the alignment camera 44 with respect to the calibration mark CM2. Using (ΔX2d, ΔY2d) and the positional deviation amount (ΔX3d, ΔY3d) of the alignment mark AM4 with respect to the alignment camera 44, the calculation is performed as shown in the following equation (4).

  (ΔXd, ΔYd) = (ΔX1b, ΔY1b) + (ΔX2d, ΔY2d) + (ΔX3d, ΔY3d) (Equation 4)

  Then, the pattern drawing apparatus 1 operates the rotation mechanism 21 based on the calculated final positional deviation amounts of the alignment marks AM1 to AM4, and corrects the inclination of the substrate 9 held on the stage 10, that is, Alignment is performed (step S34). Then, the drawing start position of the substrate 9 is corrected based on the final amount of misalignment of the alignment marks AM1 to AM4, and the substrate 9 is moved to the corrected drawing start position.

  When the substrate 9 is placed at the drawing start position, the pattern drawing apparatus 1 draws a predetermined pattern on the upper surface of the substrate 9 while moving the stage 10 in the main scanning direction and the sub-scanning direction (step S35). That is, the pattern drawing apparatus 1 repeats drawing a pattern in the main scanning direction a predetermined number of times while shifting the substrate 9 in the sub-scanning direction by the exposure width of the optical head 32 to form a predetermined pattern on the entire surface of the substrate 9. . Thereafter, the substrate 9 is unloaded from the upper surface of the stage 10 (step S36), and the drawing process for one substrate 9 is completed.

  As described above, in the calibration process, the pattern drawing apparatus 1 according to the present embodiment is configured so that the amount of displacement of the calibration marks CM1 and CM2 with respect to the pulsed light PL emitted from the optical head 32 and the calibration marks CM1 and CM2 are corrected. The positional deviation amount of each alignment camera 41-44 is detected. Further, based on each detected information, a shift amount of the relative position of each alignment camera 41 to 44 with respect to the pulsed light PL irradiated from the optical head 32 is acquired. Then, the pattern drawing apparatus 1 uses these pieces of information to correct the alignment amount of the substrate 9 and the drawing start position of the substrate 9, thereby correcting the drawing position on the substrate 9.

  For this reason, even if the positional relationship between the pulse light PL irradiated from the optical head 32 and each alignment camera 41-44 changes, the pattern drawing apparatus 1 of this embodiment corrects the change. Drawing processing can be performed. Therefore, the pattern drawing apparatus 1 of the present embodiment can perform drawing at an accurate position on the substrate 9. In addition, since the configuration is such that the alignment amount of the substrate 9 and the drawing start position are corrected rather than correcting the positions of the alignment cameras 41 to 44 themselves, a precise driving mechanism is added to the driving mechanisms 41a to 44a of the alignment cameras 41 to 44. There is no need to apply.

<4. Modification>
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to said example. For example, in the above calibration process, the pulsed light PL of the optical head 32 arranged on the most + X side is photographed by the calibration camera 11b (step S20), and then the optical head 32 arranged on the most -X side. Although the pulsed light PL is photographed by the calibration camera 12b (step S22), these photographing operations are not necessarily performed separately. For example, the distance between the optical head 32 disposed on the most + X side and the optical head 32 disposed on the most -X side is equal to the distance between the calibration cameras 11b and 12b, and the photographing operation in step S20 is performed. And the shooting operation in step S22 may be performed simultaneously.

  In the pattern drawing apparatus 1 described above, the stage 10 is moved with respect to the stationary optical head 32. However, the optical head 32 may be moved on the stationary stage 10. That is, the optical head 32 and the stage 10 may be configured to be relatively movable.

  Moreover, although the said pattern drawing apparatus 1 was processing the glass substrate 9 for color filters, the pattern drawing apparatus and pattern drawing method of this invention are semiconductor substrates, a printed circuit board, a glass substrate for plasma display apparatuses, etc. Other substrates may be processed.

It is a side view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is a top view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is an enlarged top view of the through-hole formed in the corner | angular part vicinity of a stage. It is the longitudinal cross-sectional view which cut | disconnected the stage of FIG. 3 by the IV-IV line. It is the figure which showed the example of the attitude | position control of a stage. It is the figure which looked at a plurality of optical heads from the lower part. It is the block diagram which showed the connection structure between a control part and each part. It is the flowchart which showed the flow of the calibration process. It is the flowchart which showed the flow of the calibration process. It is the flowchart which showed the flow of the calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the example of the picked-up image of an alignment camera. It is the figure which showed the example of the picked-up image of a calibration camera. It is the figure which showed the example of the board | substrate used as a process target. It is the flowchart which showed the flow of the drawing process. It is the figure which showed the example of the picked-up image of an alignment camera.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern drawing apparatus 9 Board | substrate 10 Stage 11a, 12a Translucent board 11b, 12b Calibration camera 20 Drive part 26 Posture detection part 27 Optical head camera 30 Head part 32 Optical head 39 Actuator 41-44 Alignment camera 50 Control part 9 Board | substrate AM1-AM4 Alignment mark CM1, CM2 Calibration mark PL Pulse light

Claims (9)

A drawing device for drawing a predetermined pattern on a photosensitive material formed on a substrate,
A stage for holding a substrate;
A light irradiation unit for irradiating a predetermined pattern of light onto the upper surface of the substrate held on the stage;
A stage drive unit for relatively moving the stage and the light irradiation unit;
An alignment camera for detecting the position and orientation of the substrate held on the stage, and alignment means for aligning the substrate on the stage with respect to the light irradiation unit;
A deviation amount detecting means for detecting a deviation amount of the alignment camera relative to the light irradiation unit;
Correction means for correcting the drawing position on the substrate based on the deviation amount detected by the deviation amount detection means;
A drawing apparatus comprising: The drawing apparatus according to claim 1,
The deviation amount detecting means includes
First detection means for detecting a positional deviation amount between the light irradiation unit and a predetermined calibration mark;
Second detection means for detecting a displacement amount between the calibration mark and the alignment camera;
A calculation unit that calculates a shift amount of a relative position of the alignment camera with respect to the light irradiation unit based on a shift amount detected by the first detection unit and the second detection unit;
A drawing apparatus comprising: The drawing apparatus according to claim 2,
The calibration mark is formed on the stage,
The stage driving unit moves the stage and the light irradiation unit relative to each other so that the calibration mark is disposed below the light irradiation unit, and the calibration mark is positioned below the alignment camera. A drawing apparatus that switches between a state of arrangement and a state of arrangement. The drawing apparatus according to claim 3,
It further comprises posture detection means for detecting the posture of the stage,
The drawing apparatus, wherein the stage driving unit moves the stage while correcting the posture of the stage based on information detected by the posture detection means. A drawing apparatus according to any one of claims 2 to 4,
It further comprises a calibration camera installed below the calibration mark,
The first detection means captures the irradiation light of the light irradiation unit and the calibration mark with the calibration camera, and calculates a positional deviation amount between the light irradiation unit and the calibration mark based on the acquired image. Detect
The drawing apparatus, wherein the second detection unit images the calibration mark with the alignment camera, and detects a displacement amount between the calibration mark and the alignment camera based on the acquired image. A drawing apparatus according to any one of claims 1 to 5,
The drawing apparatus further comprising positioning means for positioning the position of the irradiation light of the light irradiation unit at a predetermined position. The drawing apparatus according to claim 6,
The positioning means includes
A light irradiation unit camera that images the irradiation light of the light irradiation unit from below;
Adjusting means for adjusting the light irradiation unit based on an image acquired by the light irradiation unit camera;
A drawing apparatus comprising: A drawing apparatus according to any one of claims 1 to 7,
A drawing apparatus, further comprising an alignment camera driving unit that moves the alignment camera in accordance with drawing data of a substrate to be processed. In a drawing apparatus that draws a predetermined pattern on the upper surface of the substrate by irradiating light from the light irradiation unit on the upper surface of the substrate held on the stage, the substrate on the stage is imaged by an alignment camera and acquired. An alignment method for aligning a substrate on the stage based on an image,
A first step of detecting a displacement amount of the alignment camera relative to the light irradiation unit;
A second step of aligning the substrate on the stage based on the displacement amount detected in the first step and the image;
An alignment method comprising:

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