TWI797998B - Exposure method and exposure apparatus - Google Patents

Abstract

The exposure method of the present invention has the following steps: the step of performing the first main scanning drive, wherein the first main scanning drive system uses a drive mechanism to drive one of the stage on which the substrate is placed and the exposure head that irradiates light to the irradiation area. Driving in the main scanning direction, whereby the driven object is moved in the first moving range in the main scanning direction, and the substrate is relatively passed through the irradiation range along the main scanning direction; the step of performing a correcting action, the above correcting action system, according to the first The position of the driven object in the main scanning direction within the moving range, the driving mechanism is used to correct the position of the driven object in the sub-scanning direction and the rotation amount of the driven object in the yaw direction during the execution of the first main scanning drive. at least one; and a step of performing an exposure operation of exposing a region extending in the main scanning direction of the substrate by irradiating light from the exposure head to the irradiation range during execution of the first main scanning drive.

Description

Exposure method and exposure device

The present invention relates to, for example, a technique of exposing a substrate in order to form a pattern on a substrate such as a semiconductor wafer or a glass substrate.

Patent Documents 1 and 2 describe an exposure device that moves a stage on which a substrate (photosensitive material, substrate to be exposed) is placed in the main scanning direction, and irradiates light from an exposure head to the photosensitive material, thereby creating an image on the substrate. A pattern extending along the main scanning direction is drawn. In this exposure device, there may be a positional deviation between the stage and the exposure head, so that light cannot be irradiated to the appropriate position of the photosensitive material. Therefore, in Patent Documents 1 and 2, this situation is dealt with by adjusting the pattern of light irradiated from the exposure head.

Also, Patent Document 2 focuses on the yaw of the platform. In particular, the following problem is pointed out: In the method of controlling the position of the platform based on the results of the yaw of the platform measured by the laser displacement meter, thereby eliminating the influence of the yaw, the device must have a laser displacement meter with a high price. Therefore, in Patent Document 2, a software method such as adjusting the light pattern by correcting the data provided to the exposure head is used instead of a hardware method such as controlling the position of the stage. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-114468 [Patent Document 2] Japanese Patent Laid-Open No. 2010-113001

(Problem to be solved by the invention)

However, in terms of effectively eliminating the influence of the positional deviation of the platform and the exposure head on the exposure position, the above-mentioned software method has a limit, and it is required to suppress the positional deviation of the platform and the exposure head itself in hardware. Examples of such a positional shift include a reduction in the straightness of the stage in the main scanning direction and a yaw of the stage. Also, for example, an apparatus that exposes a substrate on a fixed platform while driving the exposure head along the main scanning direction also faces this situation. In contrast, Patent Documents 1 and 2 do not consider straightness at all.

The present invention is made in view of the above problems, and its object is to provide a technology that can drive objects such as a stage or an exposure head in the main scanning direction by a drive mechanism, and irradiate light from the exposure head to an appropriate position of a substrate placed on the stage. . (technical means to solve the problem)

The exposure method of the present invention has the following steps: the step of performing the first main scanning drive, wherein the first main scanning drive system uses a drive mechanism to drive one of the stage on which the substrate is placed and the exposure head that irradiates light to the irradiation area. Driving in the main scanning direction, whereby the driven object is moved in the first moving range in the main scanning direction, and the substrate is relatively passed through the irradiation range along the main scanning direction; the step of performing a correcting action, the above correcting action system, according to the first The position of the driven object in the main scanning direction within the moving range, the driving mechanism is used to correct the position of the driven object in the sub-scanning direction and the rotation amount of the driven object in the yaw direction during the execution of the first main scanning drive. at least one; and a step of performing an exposure operation of exposing a region extending in the main scanning direction of the substrate by irradiating light from the exposure head to the irradiation range during execution of the first main scanning drive.

The exposure device of the present invention includes: a stage on which a substrate is placed; an exposure head that irradiates light to an irradiation range; a drive mechanism that drives one of the drive objects of the stage and the exposure head in the main scanning direction; and a control unit on one side. Execute the first main scanning drive, while performing the exposure operation; the above-mentioned first main scanning drive system drives the driven object in the main scanning direction by using the driving mechanism, so that the driven object moves in the first moving range in the main scanning direction, And make the substrate relatively pass through the irradiation range along the main scanning direction; the above-mentioned exposure operation is to expose the region extending along the main scanning direction in the substrate by irradiating light from the exposure head to the irradiation range; and the control part executes the correction operation, the The correcting operation system uses the driving mechanism to correct the position of the driven object in the sub-scanning direction and the yaw of the driven object during the execution of the first main scanning drive according to the position of the driven object in the main scanning direction in the first moving range. At least one of the amount of rotation in the direction.

In the present invention (exposure method and exposure apparatus) thus constituted, by using the driving mechanism to drive one of the driven objects of the stage and the exposure head in the main scanning direction, the first moving range of the driven object in the main scanning direction is While moving, the substrate is relatively passed through the irradiation range along the main scanning direction (first main scanning driving). Then, by irradiating light from the exposure head to the irradiation area in parallel with the first main scanning drive, the area extending in the main scanning direction in the substrate is exposed (exposure operation). In particular, a correction operation is performed, which is based on the position of the driven object in the main scanning direction in the first moving range, and the driving mechanism is used to correct the position of the driven object in the sub-scanning direction during the execution of the first main scanning drive. , and at least one of the amount of rotation of the driven object in the yaw direction. As a result, it is possible to irradiate light from the exposure head to an appropriate position of the substrate placed on the stage while driving the stage or exposure head or other driven object in the main scanning direction by the drive mechanism.

The exposure method according to the first aspect of the present invention has the following steps: the step of performing the first main scanning drive. The above-mentioned first main scanning drive system uses the drive mechanism to move the stage on which the substrate is placed and the exposure head that irradiates light to the irradiation area. One of the driving objects is driven in the main scanning direction, whereby the driving object is moved in the first moving range in the main scanning direction, and the substrate is relatively passed through the irradiation range along the main scanning direction; the step of performing the first straightness correction operation, The above-mentioned first straightness correction operation system uses the driving mechanism to correct the position of the driven object in the sub-scanning direction during the execution of the first main scanning drive based on the first straightness correction information. 1 The position of the driving object in the main scanning direction in the moving range is corrected by the first straight correction amount of the position of the driving object in the sub-scanning direction; During the execution, light is irradiated from the exposure head to the irradiation area, and the area extending along the main scanning direction in the substrate is exposed.

The exposure device according to the first aspect of the present invention includes: a stage on which a substrate is placed; an exposure head that irradiates light to an irradiation range; a drive mechanism that drives one of the drive objects of the stage and the exposure head in the main scanning direction; part, which memorizes the first straightness correction information, and the first straightness correction information indicates that the position of the driven object in the sub-scanning direction is corrected according to the position of the driven object in the main-scanning direction in the first moving range in the main-scanning direction The first straightness correction amount; and the control unit, which executes the first main scanning drive while performing the exposure operation; the first main scanning drive system drives the driven object toward the main scanning direction by using the driving mechanism, so that The driving object moves in the first moving range, and makes the substrate relatively pass through the irradiation range along the main scanning direction; the above-mentioned exposure operation is to expose the region extending along the main scanning direction in the substrate by irradiating light from the exposure head to the irradiation range and the control unit executes the first straightness correction action, the first straightness correction operation system, based on the first straightness correction information, uses the driving mechanism to correct the position of the driven object in the sub-scanning direction during the execution of the first main scanning drive.

In the present invention (exposure method and exposure apparatus) thus constituted, by using the driving mechanism to drive one of the driven objects of the stage and the exposure head in the main scanning direction, the first moving range of the driven object in the main scanning direction is While moving, the substrate is relatively passed through the irradiation range along the main scanning direction (first main scanning driving). Then, by irradiating light from the exposure head to the irradiation area in parallel with the first main scanning drive, the area extending in the main scanning direction in the substrate is exposed (exposure operation). In particular, based on the first straightness correction information, the driving mechanism corrects the position of the driven object in the sub-scanning direction during the execution of the first main scanning drive (the first straightness correction operation). The first straight correction amount of the position of the driven object in the sub-scanning direction is corrected based on the position of the driven object in the main scanning direction in the first moving range. As a result, straightness can be ensured when a driven object such as a stage or exposure head is driven in the main scanning direction by the drive mechanism, and light can be irradiated from the exposure head to an appropriate position of the substrate placed on the stage.

In addition, the exposure method may be configured to further include a step of performing a correction information creation operation based on sub-scanning of a driving object that is moved in the main scanning direction in the first moving range by the driving mechanism. The result of obtaining the position in the direction is used to formulate the first straightness correction information; in the first straightness correction action, the position of the driving object in the sub-scanning direction is corrected based on the first straightness correction information formulated in the correction information formulation action . In this configuration, based on the result of obtaining the position in the sub-scanning direction of the driven object that is moved in the main scanning direction in the first moving range by the driving mechanism, that is, based on the result of the straightness obtained in advance, the The first truth is to correct the information (the correction information formulates an action). Furthermore, when the exposure operation is performed while performing the first main scanning drive, the straightness of the driven object can be ensured based on the first straightness correction information created in this way.

In addition, the exposure method may be configured to be based on the result of measuring the position in the sub-scanning direction of the driven object moving in the main-scanning direction in the first moving range by a laser interferometer in the correction information creation operation. , to formulate the first truth correction information. In this configuration, the straightness of the driven object can be easily obtained through the measurement of the laser interferometer.

In addition, the exposure method may be configured such that the step of performing the second main scanning drive is performed in the correction information creation operation. The driving object is driven in the main scanning direction by the driving mechanism, so that the second moving range of the platform in the main scanning direction is moved, and the test substrate passes through the photographing range of the camera along the main scanning direction; it is photographed by the camera A step of acquiring a fiducial mark image through the fiducial mark of the imaging range during the execution of the second main scanning drive; a step of formulating the second straightness correction information based on the position of the fiducial mark shown in the fiducial mark image in the sub-scanning direction , the second straightness correction information represents the second straightness correction amount used to correct the position of the platform in the sub-scanning direction according to the position of the platform in the main scanning direction within the second moving range; while executing the first main scanning drive, A step of drawing exposure marks on the test substrate by irradiating light from the exposure head to the test substrate passing through the irradiation range; while correcting the position of the stage in the sub-scanning direction based on the second straightness correction information, executing the second main Scanning drive, a step of capturing an exposure mark passing through the photographic range by using a camera to obtain an image of the exposure mark; The result of obtaining the position in the sub-scanning direction of the platform is used to formulate the first true straight correction information. In this configuration, the straightness of the driven object can be obtained without using an expensive laser interferometer.

In addition, the exposure method may be configured to include the following steps: using the position detection unit to detect the position of the driving object in the main scanning direction, and sending it to the imaging timing control unit that controls the timing when the camera executes imaging; and The photographing time point control unit causes the camera to perform photographing at the time point corresponding to the position of the driven object in the main scanning direction received from the position detection unit, thereby photographing the alignment mark of the substrate; the position detection unit and the photographing time The dot control part is arranged in the same integrated circuit. In this configuration, since the position detection unit and the imaging timing control unit are provided in the same integrated circuit, communication delay from the position detection unit to the imaging timing control unit can be suppressed, and the movement of the driving object in the main scanning direction can be controlled. The position is sent to the shooting time point control unit. Therefore, photographing by the camera can be performed at an appropriate time point corresponding to the position of the driving object.

Also, the exposure method may be configured to further include the step of: detecting the position of the driven object in the main scanning direction by the position detection unit, and sending the correction time point to the time point when the driving mechanism executes the first straightness correction operation. The steps of the control part; the correction time point control part is to make the drive mechanism execute the first straightness correction action at the time point corresponding to the position of the driven object received from the position detection part in the main scanning direction, and the position detection part and the correction The time point control part is set in the same integrated circuit. In this configuration, since the position detection unit and the correction timing control unit are provided in the same integrated circuit, communication delay from the position detection unit to the correction timing control unit can be suppressed, and the movement of the driving object in the main scanning direction can be controlled. The position is sent to the correction time point control unit. Therefore, the position of the driven object in the sub-scanning direction can be corrected at an appropriate time point corresponding to the position of the driven object.

In other words, for a plurality of exposure positions on the substrate that are set differently in the sub-scanning direction, the position of the driving object is changed by a driving mechanism between the plurality of sub-scanning positions in the sub-scanning direction corresponding to the plurality of exposure positions. , and repeatedly perform the first main scanning drive, the first straightness correction operation, and the exposure operation, thereby enabling exposure to a wide range. However, when the position of the driven object (sub-scanning position) in the sub-scanning direction changes, the balance of the weight applied from the stage to the driving mechanism changes. Therefore, it may be difficult to ensure the straightness of the driving object at each of the plurality of sub-scanning positions with a single first straightness correction information.

Therefore, the exposure method may also be configured such that the first straightness correction information is set for each of a plurality of sub-scanning positions, and in the first straightness correction operation, based on the first straightness correction set for the sub-scanning position where the driving object is located information, correct the position of the driving object in the sub-scanning direction. In this configuration, the straightness of the driven object at each of the plurality of sub-scanning positions can be ensured.

Alternatively, the exposure method can also be constituted such that the first straightness correction information is set for each of a plurality of different set positions in the sub-scanning direction. During the operation, the position of the driving object in the sub-scanning direction is corrected based on the first straight correction information set for the set position closest to the sub-scanning position where the driven object is located among the plurality of set positions, or by linear interpolation, The above linear interpolation uses the first straight correction information set for the set position closest to the sub-scanning position where the driving object is located, and the first straight correction information set for the second set position closest to the sub-scanning position where the driven object is located. Correct the information directly. In this configuration, the memory resources required for memorizing the first straightness correction information can be suppressed, and the straightness of the driving object for each of the plurality of sub-scanning positions can be ensured.

The exposure method of the second aspect of the present invention has the following steps: the step of performing the first main scanning drive. The first main scanning drive system uses the drive mechanism to place the substrate on the stage and the exposure head that irradiates the irradiation area with light. One of the driving objects is driven in the main scanning direction, whereby the driving object is moved in the first moving range in the main scanning direction, and the substrate is relatively passed through the irradiation range along the main scanning direction; the step of performing the first yaw correction operation, The above-mentioned first yaw correction operation system uses the driving mechanism to correct the rotation amount of the driven object in the yaw direction during the execution of the first main scanning drive based on the first yaw correction information. The above-mentioned first yaw correction information indicates A first yaw correction amount for correcting the rotation amount of the driven object in the yaw direction according to the position of the driven object in the main scanning direction within the first moving range; and a step of performing an exposure operation, the above exposure operation is, By irradiating light from the exposure head to the irradiation area during execution of the first main scanning drive, an area extending in the main scanning direction in the substrate is exposed.

The exposure device of the second aspect of the present invention is provided with: a table, which places a substrate; The first yaw correction information is used to correct the yaw direction of the driven object according to the position of the driven object in the main scanning direction within the first moving range of the main scanning direction. The first yaw correction amount of the rotation amount; and the control part, which performs the first main scanning drive while performing the exposure operation; the first main scanning drive system drives the driven object toward the main scanning direction by using the driving mechanism, The driving object is moved in the first moving range, and the substrate is relatively passed through the irradiation range along the main scanning direction; the above-mentioned exposure operation is to irradiate the irradiation range with light from the exposure head, and the area extending along the main scanning direction in the substrate is irradiated. Exposure; and the control unit executes the first yaw correction operation. The above-mentioned first yaw correction operation is based on the first yaw correction information, and uses the driving mechanism to correct the yaw direction of the driven object during the execution of the first main scanning drive. amount of rotation on .

In the present invention (exposure method and exposure apparatus) thus constituted, by using the driving mechanism to drive one of the driven objects of the stage and the exposure head in the main scanning direction, the first moving range of the driven object in the main scanning direction is While moving, the substrate is relatively passed through the irradiation range along the main scanning direction (first main scanning driving). Then, by irradiating light from the exposure head to the irradiation area in parallel with the first main scanning drive, the area extending in the main scanning direction in the substrate is exposed (exposure operation). In particular, based on the first yaw correction information, the driving mechanism corrects the rotation amount of the driven object in the yaw direction during the execution of the first main scanning drive (first yaw correction operation), and the above-mentioned first yaw correction The information indicates the first yaw correction amount for correcting the rotation amount of the driven object in the yaw direction according to the position of the driven object in the main scanning direction within the first moving range. As a result, the increase in cost can be suppressed, and the yaw of the driven object such as the stage or the exposure head can be suppressed when the driven object is driven in the main scanning direction by the driving mechanism, and the substrate placed on the stage can be irradiated from the appropriate position of the exposure head. Light.

In addition, the exposure method may be configured to further include a step of performing a first correction information creation operation based on the driving of the movement in the main scanning direction within the first movement range by the driving mechanism. The result of obtaining the rotation amount of the object in the yaw direction is to formulate the first yaw correction information; in the first yaw correction action, based on the first yaw correction information formulated in the first correction information formulation action, Corrects the amount of rotation of the driven object in the yaw direction. In this configuration, based on the obtained result of the position in the yaw direction of the driven object moving in the main scanning direction in the first moving range by the drive mechanism, that is, based on the result of the yaw obtained in advance, the first Yaw correction information (the 1st correction information formulation action). Furthermore, when the exposure operation is performed while performing the first main scanning drive, the yaw of the driven object can be suppressed based on the first yaw correction information created in this way.

In addition, the exposure method may also be configured such that the following step is executed in the first correction information creation operation: a step of installing a yaw measuring device using a mine The rotation amount of the platform in the yaw direction is measured by a radiation interferometer; the step of performing the first yaw measurement, the above-mentioned first yaw measurement system, for the first yaw measurement by using the drive mechanism to drive the driving object toward the main scanning direction The rotation amount of the driving object moving in the moving range in the yaw direction is measured by the yaw measuring device, and the position of the driving object in the main scanning direction and the rotation amount in the yaw direction are obtained and correspondingly established; and based on the first Step 1 to formulate the first yaw correction information based on the result of the yaw measurement. In this configuration, the yaw of the driven object can be easily obtained by the measurement of the laser interferometer of the yaw measuring device. In addition, the yaw meter is used by being attached to the exposure device when measuring the yaw. Therefore, once the yaw measurement is completed, it is only necessary to remove the yaw measuring device from the exposure device. Therefore, the exposure device itself does not need to be equipped with a yaw, and the increase in the cost of the exposure device can be suppressed.

In addition, the exposure method can also be configured to include the following step before performing the exposure operation: the step of performing the second main scanning drive, which is to drive the driven object in the main scanning direction by using the driving mechanism, so that the driven object is driven in the main scanning direction. The second movement range in the main scanning direction is moved, and the substrate is relatively passed through the shooting range of the camera along the main scanning direction; the step of performing the second yaw correction operation, the above-mentioned second yaw correction operation is based on the second yaw The correction information is to use the driving mechanism to correct the rotation amount of the driven object in the yaw direction during the execution of the second main scanning drive. The second yaw correction amount for correcting the rotation amount of the driven object in the yaw direction based on the position in the yaw direction; 2 During the execution of the main scanning drive, the alignment mark image is captured by passing through the alignment mark of the substrate in the imaging range, thereby obtaining the position of the alignment mark shown in the alignment mark image; during the exposure operation, according to the alignment mark The position of the alignment mark obtained in the operation is obtained to adjust the pattern of the light irradiated from the exposure head to the substrate.

In this configuration, by using the driving mechanism to drive the driven object in the main scanning direction, the driven object is moved in the second moving range in the main scanning direction, and the substrate is relatively passed through the imaging range of the camera in the main scanning direction ( 2nd main scan driver). Then, in parallel with the second main scanning drive, the alignment mark passing through the imaging range is photographed by the camera to capture an alignment mark image, and the position of the alignment mark shown in the alignment mark image is acquired (alignment mark image). mark get action). In particular, based on the second yaw correction information, the driving mechanism corrects the amount of rotation of the driven object in the yaw direction during the execution of the second main scanning drive (second yaw correction operation), and the second yaw correction The information indicates the second yaw correction amount for correcting the rotation amount of the driven object in the yaw direction according to the position of the driven object in the main scanning direction within the second moving range. As a result, the cost increase can be suppressed, and the yaw of the driven object when the driven object such as a stage or exposure head is driven in the main scanning direction by the drive mechanism can be suppressed, and the position of the alignment mark on the substrate can be acquired reliably.

In addition, the exposure method may be configured to further include a step of executing a second correction information creation operation based on the position of the driving object moving in the main scanning direction in the second movement range by the driving mechanism. The result of calculating the amount of rotation in the yaw direction is used to formulate the second yaw correction information; in the second yaw correction action, the driving object is corrected based on the second yaw correction information formulated in the second yaw correction information formulation action The amount of rotation in the yaw direction. In this configuration, the second position is formulated based on the result of obtaining the position in the yaw direction of the driven object moving in the main scanning direction within the second movement range by the drive mechanism, that is, based on the result of the yaw obtained in advance. 2 Yaw correction information (the second correction information formulates an action). Furthermore, when the alignment mark acquisition operation is performed while performing the second main scanning drive, the yaw of the driven object can be suppressed based on the second yaw correction information created in this way.

In addition, the exposure method can also be configured such that the following step is executed in the second correction information formulation operation: a step of installing a yaw measuring device using a mine The rotation amount of the platform in the yaw direction is measured by a radiation interferometer; the step of performing the second yaw measurement, the above-mentioned 2nd yaw measurement system, for driving the driving object toward the main scanning direction by using the driving mechanism. The rotation amount of the driving object moving in the moving range in the yaw direction is measured by the yaw measuring device, and the position of the driving object in the main scanning direction and the rotation amount in the yaw direction are obtained and correspondingly established; and based on the first 2 Steps to formulate the second yaw correction information based on the result of the yaw measurement. In this configuration, the yaw of the driven object can be easily obtained by the measurement of the laser interferometer of the yaw measuring device. In addition, the yaw meter is used by being attached to the exposure device when measuring the yaw. Therefore, once the yaw measurement is completed, it is only necessary to remove the yaw measuring device from the exposure device. Therefore, the exposure apparatus itself does not need to be equipped with a yawmeter, and the increase in the cost of the exposure apparatus can be suppressed.

In addition, the exposure method may be configured such that in the alignment mark acquisition operation, the position of the driving object in the main scanning direction is detected by the position detection unit, and the position is sent to the imaging timing control unit that controls the timing of imaging by the camera. The photographing time point control unit is at a time point corresponding to the position of the driving object received from the position detection unit in the main scanning direction, causing the camera to perform photographing, whereby the alignment mark is photographed, and the position detection unit and the photographing time point control The parts are arranged in the same integrated circuit. In this configuration, the position detection unit and the shooting timing control unit are provided in the same integrated circuit, so the communication delay from the position detection unit to the shooting timing control unit can be suppressed, and the movement of the driving object in the main scanning direction can be controlled. The position is sent to the shooting time point control unit. Therefore, photographing by the camera can be performed at an appropriate time point corresponding to the position of the driving object.

In addition, the exposure method may be configured to further include the steps of: detecting the position of the driven object in the main scanning direction by the position detection unit, and sending the correction time to the time point when the driving mechanism is controlled to perform the first yaw correction operation. The steps of the point control part; the correction time point control part is at the time point corresponding to the position of the driven object received from the position detection part in the main scanning direction, so that the driving mechanism executes the first yaw correction action, and the position detection part and The correction time point control part is set in the same integrated circuit. In this configuration, since the position detection unit and the correction timing control unit are provided in the same integrated circuit, communication delay from the position detection unit to the correction timing control unit can be suppressed, and the movement of the driving object in the main scanning direction can be controlled. The position is sent to the correction time point control unit. Therefore, the amount of rotation of the driven object in the yaw direction can be corrected at an appropriate time point corresponding to the position of the driven object.

In other words, a plurality of different exposure positions are set in the sub-scanning direction for the substrate, and the position of the driving object is changed by a driving mechanism between the plurality of different sub-scanning positions in the sub-scanning direction corresponding to the plurality of exposure positions. , and repeatedly perform the first main scanning drive, the first yaw correction operation, and the exposure operation, thereby enabling exposure to a wide range. However, when the position of the driven object (sub-scanning position) in the sub-scanning direction changes, the balance of the weight applied from the stage to the driving mechanism changes. Therefore, it may be difficult to suppress the yaw of the driven object at each of the plurality of sub-scanning positions by a single first yaw correction information.

Therefore, the exposure method can also be configured such that the first yaw correction information is set for each of a plurality of sub-scanning positions, and in the first yaw correction operation, based on the first yaw correction information set for the sub-scanning position where the driving object is located, The yaw correction information is used to correct the position of the driving object in the sub-scanning direction. In this configuration, the yaw of the driven object at each of the plurality of sub-scanning positions can be suppressed.

Alternatively, the exposure method may be configured such that the first yaw correction information is set for each of a plurality of different set positions in the sub-scanning direction, and the set positions are less than the plurality of sub-scanning positions. In the yaw correction operation, based on the first yaw correction information set for the set position closest to the sub-scanning position where the driving object is located among the plurality of set positions, or by linear interpolation to correct the driving object in the sub-scanning direction The above-mentioned linear interpolation is based on the first yaw correction information set for the set position closest to the sub-scanning position where the driving object is located, and the set position for the second closest sub-scanning position where the driving object is located. Set the first yaw correction information. In this configuration, the memory resources required for memorizing the first yaw correction information can be suppressed, and the yaw of the driven object for each of the plurality of sub-scanning positions can be suppressed.

(compared to the effect of previous technology) As described above, according to the first aspect of the present invention, it is possible to ensure the straightness when the driving object such as the stage or the exposure head is driven in the main scanning direction by the driving mechanism, and the distance from the exposure head to the substrate placed on the stage can be ensured. Light in the right place.

As described above, according to the second aspect of the present invention, the increase in cost can be suppressed, and the yaw of the driving object such as the stage or the exposure head can be suppressed when the driving object is driven in the main scanning direction by the driving mechanism, and the exposure can be realized from the exposure point. The head irradiates light to an appropriate position of the substrate placed on the stage.

FIG. 1 is a front view schematically showing a schematic configuration of an exposure apparatus of the present invention, and FIG. 2 is a block diagram showing an example of an electrical configuration included in the exposure apparatus of FIG. 1 . Figure 1 and the following figures appropriately show the X direction which is the horizontal direction, the Y direction which is the horizontal direction perpendicular to the X direction, the Z direction which is the vertical direction, and the rotation direction θ centered on the rotation axis parallel to the Z direction. (yaw direction).

The exposure device 1 draws a pattern on the photosensitive material by irradiating a predetermined pattern of laser light on a substrate We (substrate to be exposed) on which a layer of a photosensitive material such as a photoresist is formed. As the substrate We, various substrates such as semiconductor substrates, printed circuit boards, substrates for color filters, glass substrates for flat panel displays included in liquid crystal display devices or plasma display devices, and substrates for optical discs can be applied.

The exposure apparatus 1 is provided with a main body 11, and the main body 11 is comprised by the main body frame 111, and the cover plate (illustration omitted) attached to the main body frame 111. Furthermore, various components of the exposure apparatus 1 are arranged inside and outside the main body 11, respectively.

The interior of the main body 11 of the exposure device 1 is divided into a processing area 112 and a transfer area 113 . In the processing area 112 , a platform 2 , a platform driving mechanism 3 , an exposure unit 4 and an alignment unit 5 are mainly arranged. In addition, outside the main body 11, an illumination unit 6 for supplying illumination light to the alignment unit 5 is disposed. In the transfer area 113 , a transfer device 7 such as a transfer robot that performs loading and unloading of the substrate We into and out of the processing area 112 is arranged. Furthermore, a control unit 8 is arranged inside the main body 11, and the control unit 8 is electrically connected to various parts of the exposure device 1 to control the operations of these various parts.

Furthermore, outside the main body 11 of the exposure apparatus 1 , at a position adjacent to the delivery area 113 , a cassette mounting portion 114 for mounting the cassette C is arranged. The transfer device 7 disposed in the handover area 113 inside the main body 11 corresponding to the cassette loading portion 114 takes out and carries in the unprocessed substrate We contained in the cassette C placed on the cassette loading portion 114 (loaded) to the processing area 112 , and the processed substrate We is carried out (unloaded) from the processing area 112 and stored in the cassette C. The delivery of the cassette C to the cassette loading unit 114 is performed by an external transfer device not shown. The loading of the unprocessed substrate We and the unloading of the processed substrate We are executed by the transfer device 7 according to the instruction from the control unit 8 .

The platform 2 has a flat shape, and maintains the substrate We placed on its upper surface horizontally. A plurality of suction holes (not shown) are formed on the upper surface of the platform 2, and the substrate We placed on the platform 2 is fixed to the platform 2 by applying negative pressure (suction pressure) to the suction holes. above the surface. The platform 2 is driven by a platform drive mechanism 3 .

The platform drive mechanism 3 is an X-Y-Z-θ drive mechanism that moves the platform 2 along the Y direction (main scanning direction), X direction (sub-scanning direction), Z direction and rotation direction θ (yaw direction). The platform driving mechanism 3 has: a Y-axis robot 31, which is a single-axis robot extending along the Y direction; a workbench 32, which is driven in the Y direction by the Y-axis robot 31; an X-axis robot 33, which is tied to the workbench 32, a single-axis robot extending along the X direction on the upper surface; a worktable 34, which is driven in the X direction by the X-axis robot 33; and a θ-axis robot 35, which will be supported by the upper surface of the workbench 34 The stage 2 is driven in the rotational direction θ with respect to the table 34 .

Therefore, the platform driving mechanism 3 can drive the platform 2 along the Y direction by the Y-axis servo motor 311 of the Y-axis robot 31, and drive the platform 2 along the X direction by the X-axis servo motor 331 of the X-axis robot 33. Direction driving, the platform 2 is driven in the rotation direction θ by the θ-axis servo motor 351 of the θ-axis robot 35 . Moreover, the platform driving mechanism 3 can drive the platform 2 along the Z direction by the Z-axis robot omitted in FIG. 1 . The stage drive mechanism 3 operates the Y-axis robot 31 , the X-axis robot 33 , the θ-axis robot 35 , and the Z-axis robot in accordance with instructions from the control unit 8 , thereby moving the substrate We placed on the stage 2 .

The exposure unit 4 has an exposure head 41 disposed above the substrate We on the stage 2 , and a light irradiation unit 43 that irradiates the exposure head 41 with laser light. The light irradiation unit 43 has a laser driving unit 431 , a laser oscillator 432 and an illumination optical system 433 . Furthermore, the laser light emitted from the laser oscillator 432 by the operation of the laser driving unit 431 is irradiated to the exposure head 41 through the illumination optical system 433 . The exposure head 41 modulates the laser light irradiated from the light irradiation unit 43 by using a spatial light modulator, so that the laser light falls onto the substrate We moving directly under it. By exposing the substrate We with laser light in this way, a pattern can be drawn on the substrate We (exposure operation).

The alignment unit 5 has an alignment camera 51 disposed above the substrate We on the stage 2 . The alignment camera 51 has a lens barrel, an objective lens and a Charge Coupled Device (CCD, Charge Coupled Device) image sensor, and photographs the alignment marks provided on the upper surface of the moving substrate We directly below it. The CCD image sensor included in the alignment camera 51 is constituted by, for example, an area image sensor (two-dimensional image sensor).

The illumination unit 6 is connected to the lens barrel of the alignment camera 51 via an optical fiber 61 , and supplies illumination light to the alignment camera 51 . The illumination light guided by the optical fiber 61 extending from the illumination unit 6 is guided to the upper surface of the substrate We through the lens barrel of the alignment camera 51, and the reflected light on the substrate We enters the CCD image sensor through the objective lens. Thereby, the upper surface of the board|substrate We is photographed, and a photographed image is acquired. The alignment camera 51 is electrically connected to the control unit 8 , acquires a captured image according to an instruction from the control unit 8 , and sends the captured image to the control unit 8 .

The control part 8 acquires the position of the alignment mark shown in the captured image captured by the alignment camera 51 (alignment mark acquiring operation). Moreover, the control part 8 controls the exposure unit 4 based on the position of the alignment mark, and thereby adjusts the pattern of the laser light irradiated to the board|substrate We from the exposure head 41 in an exposure operation. And the control part 8 draws a pattern on the board|substrate We by irradiating the laser light modulated according to the pattern to be drawn from the exposure head 41 to the board|substrate We.

Moreover, the exposure apparatus 1 is provided with the main personal computer (PC, Personal Computer) 91, and the image processing with respect to the alignment mark is performed by the main PC 91. That is, the control part 8 acquires from the main PC 91 the position of the alignment mark calculated by the main PC 91 from the image|photographed image of an alignment mark. Furthermore, a position measuring device 92 for measuring the position of the stage 2 using a laser interferometer can be detachably attached to the main body 11 of the exposure apparatus 1 .

FIG. 3 is a perspective view schematically showing an example of a position measuring device for measuring the position of a stage using a laser interferometer. The stage 2 moves in a movable range Yt in the Y direction, and the movable range Yt includes an alignment moving range Ya and an exposure moving range Ye. Here, the alignment movement range Ya is the range in which the stage 2 moves in the Y direction for the alignment mark acquisition operation, and the exposure movement range Ye is the range in which the stage 2 moves in the Y direction for the exposure operation. In this example, the alignment movement range Ya partially overlaps with the exposure movement range Ye. However, such ranges do not necessarily have to repeat.

The position measuring device 92 can measure the position of the stage 2 moving in the Y direction within the movable range Yt. The position measuring device 92 has two laser interferometers 921 and 922 and two mirrors 923 and 924 attached to the Y direction side surface of the stage 2 . The laser interferometers 921, 922 emit laser light parallel to the Y direction, the reflectors 923, 924 are mirrors perpendicular to the Y direction, and the two laser interferometers 921, 922 and the two reflectors 923, 924 are respectively placed on Opposite in the Y direction. Moreover, the laser interferometer 921 emits laser light toward the mirror 923, and based on the result of detecting the laser light reflected by the mirror 923, the position in the Y direction of the measuring platform 2 is measured, and the laser interferometer 922 faces the mirror 924. The laser light is emitted, and based on the detection result of the laser light reflected by the mirror 924, the position of the platform 2 in the Y direction is measured.

In the position measuring device 92, the Y-axis laser length measuring machine 92y is composed of a laser interferometer 921, and the Y-axis laser length measuring machine 92y uses the measurement result of the laser interferometer 921 as the position in the Y direction of the platform 2 And output to the control part 8. Also, the ΔY axis laser length measuring machine 92d is composed of a laser interferometer 921 and a laser interferometer 922, and the ΔY axis laser length measuring machine 92d is used to measure the Y direction of the platform 2 measured by the laser interferometer 921. The slope (in other words, the difference) between the position and the position in the Y direction of the platform 2 measured by the laser interferometer 922 is output to the control unit 8 as the amount of rotation of the platform 2 in the rotation direction θ. And, as will be described in detail below, the control unit 8 creates the yaw correction table Ty based on the result of measuring the position of the platform 2 by the position measuring device 92 (table creation operation).

FIG. 4 is a block diagram showing an example of a detailed configuration of a control unit that executes an alignment mark acquisition operation and an exposure operation. The control unit 8 has an integrated circuit 81 such as a field programmable gate array (FPGA, Field Programmable Gate Array), and a control board 85 composed of a central processing unit (CPU, Central Processing Unit) or a memory, for example.

The integrated circuit 81 has the Y-axis counter 811 which counts the output of the Y-axis encoder 312 provided in the Y-axis servomotor 311. As shown in FIG. Furthermore, the integrated circuit 81 has an imaging time point output unit 812 , an exposure time point output unit 813 , and an interrupt generation unit 814 . The photographing time point output unit 812 provides the photographing time point generated according to the Y-direction position of the platform 2 received from the Y-axis counter 811 to the alignment camera 51, and the alignment camera 51 takes a photograph at the photographing time point. The exposure time point output unit 813 provides the exposure time point generated according to the Y-direction position of the platform 2 shown by the Y-axis counter 811 to the exposure head 41, and the exposure head 41 performs exposure at the exposure time point. The interrupt generator 814 provides the correction time points of the straightness correction table Ts and the yaw correction table Ty, and the position correction of the platform 2 described later is performed at the correction time points.

Furthermore, the integrated circuit 81 has a Y-axis position information output unit 817 . The Y-axis position information output unit 817 inputs the position of the platform 2 in the Y direction measured by the Y-axis laser length measuring machine 92y, and the rotation direction θ of the platform 2 measured by the ΔY-axis laser length measuring machine 92d. The amount of rotation and the count value of the Y-axis counter 811. Moreover, the Y-axis position information output unit 817 outputs these inputs to the control board 85 .

The control board 85 has an imaging timing control unit 851 . The shooting time point control unit 851 memorizes the corresponding relationship between the count value of the Y-axis counter 811 representing the position in the Y direction of the platform 2 and the shooting time point, and the shooting time point output unit 812 of the integrated circuit 81 is based on the shooting time The point control unit 851 acquires the photographing time point of the corresponding relationship, and causes the alignment camera 51 to perform photographing.

In addition, the control board 85 has a Y-axis scale correction table part 852 which corrects the error in the Y-direction position of the stage 2 output by the Y-axis encoder 312 . Specifically, a calibration operation for position correction of the stage 2 is performed in advance. In this calibration operation, while the platform 2 is moved in the Y direction by the Y-axis servo motor 311, the Y-axis position of the platform 2 measured by the Y-axis laser length measuring machine 92y is measured via the Y-axis position information output unit 817. The position and the count value counted by the Y-axis counter 811 of the output of the Y-axis encoder 312 are sent to the Y-axis scale correction table part 852, and the Y-axis scale correction table part 852 is the count value of the Y-axis encoder 312 relative to The error of the measurement position of the Y-axis laser length measuring machine 92y is memorized in the form of a table (Y-axis scale correction table). Moreover, during the exposure operation, the exposure time point output unit 813 of the integrated circuit 81 corrects the count value of the output of the Y-axis encoder 312 received from the Y-axis counter 811 based on the table to generate the exposure of the exposure head 41. point in time.

Also, the control board 85 has an X-axis scale correction table portion 853 and a θ-axis scale correction table portion 854 which are similarly provided with respect to the X direction and the rotation direction θ. That is, the X-axis scale correction table section 853 stores a table (X-axis scale correction table) for correcting the error between the output value of the X-axis encoder provided on the X-axis servo motor 331 and the position in the X direction of the stage 2 . , and output the correction value used to correct the error. Also, the θ-axis scale correction table section 854 stores a table for correcting the error between the output value of the θ-axis encoder provided on the θ-axis servo motor 351 and the amount of rotation in the rotation direction θ of the stage 2 (θ-axis scale correction Table), and output the correction value used to correct the error.

Furthermore, the control board 85 has a Y-axis straightness correction table part 855 which memorizes the straightness correction table Ts (FIG. 5A). Fig. 5A is a diagram showing an example of a straightness correction table. In the example of FIG. 5A , the series on the left side of the straightness correction table Ts indicates that the position in the Y direction of the platform 2 shown by the Y-axis counter 811 (in other words, the count value of the Y-axis encoder 312 counted by the Y-axis counter 811 ) is counted one by one within the movable range Yt, and the series on the right side of the straightness correction table Ts is used to correct the correction amount of the position of the platform 2 along the X direction (the correction amount in the X direction). That is, the straightness correction table Ts represents the correspondence relationship between the Y-direction position of the stage 2 indicated by the Y-axis counter 811 and the correction amount of the stage 2 position in the X-direction. Therefore, the Y-axis straightness correction table part 855 drives the stage 2 in the X direction by the stage driving mechanism 3 with the correction amount shown by the straightness correction table Ts corresponding to the position of the stage 2 in the Y direction. Thereby, the straightness of the platform 2 moving along the Y direction is ensured. Furthermore, as described below, the straightness correction table Ts is created by the cooperative operation of the straightness correction table formulation unit 856 included in the control board 85 and the CPU 911 included in the main PC 91 .

In this way, the control board 85 is provided with an X-axis scale correction table part 853 and a Y-axis straightness correction table part 855 as a function of correcting the position of the platform 2 along the X direction. Therefore, the control board 85 is equipped with the X-axis movement amount calculation part 857 which synthesize|combines each correction amount of both correction tables 853 and 855. That is, the X-axis movement amount calculation unit 857 outputs the total correction amount obtained by adding the correction amount output from the X-axis scale correction table portion 853 and the correction amount output from the Y-axis straightness correction table portion 855 to the X-axis servo motor. 331 , the X-axis servo motor 331 drives the platform 2 along the X direction with the total correction amount.

In addition, the control board 85 has an XY yaw correction table portion 858 which stores the yaw correction table Ty (FIG. 5B). FIG. 5B is a diagram showing an example of a yaw correction table. In the example of FIG. 5B , the series on the left side of the yaw correction table Ty indicates that the position in the Y direction of the platform 2 shown by the Y-axis counter 811 (in other words, the count of the Y-axis encoder 312 counted by the Y-axis counter 811 Numerical value) is counted one by one within the movable range Yt, and the series on the right side of the yaw correction table Ty indicates the correction amount (theta direction correction amount) used to correct the position of the platform 2 along the rotation direction θ. That is, the yaw correction table Ty represents the corresponding relationship between the Y-direction position of the platform 2 indicated by the Y-axis counter 811 and the correction amount of the platform 2 position in the rotation direction θ. Therefore, the XY yaw correction table unit 858 drives the stage 2 in the rotation direction θ by the stage drive mechanism 3 with the correction amount shown in the yaw correction table Ty corresponding to the position of the stage 2 in the Y direction. Thereby, the yawing of the platform 2 moving in the Y direction can be suppressed. Furthermore, as described below, the yaw correction table Ty is created by the XY yaw correction table unit 858 .

In this way, the θ-axis scale correction table 854 and the XY yaw correction table 858 are provided on the control board 85 as a function of correcting the position of the stage 2 along the rotation direction θ. Therefore, the control board 85 is provided with theta-axis movement amount calculation part 859 which synthesize|combines each correction amount of both correction tables 854 and 858. That is, the θ-axis movement amount calculation unit 859 outputs the total correction amount obtained by adding the correction amount output from the θ-axis scale correction table portion 854 and the correction amount output from the XY yaw correction table portion 858 to the θ-axis servo motor 351 , the θ-axis servo motor 351 drives the platform 2 along the rotation direction θ with the total correction amount.

FIG. 6 is a flow chart showing an example of an alignment mark acquisition operation and an exposure operation. FIG. 7 is a side view schematically showing the operation of the exposure apparatus executed according to the flow chart in FIG. 6 . FIG. 8 is a schematic diagram showing FIG. 6 The execution target of the flow chart is an example of the substrate.

In the execution of the flowchart shown in FIG. 6 , the position correction of the platform 2 (straightness correction) using the Y-axis straightness correction table section 855 and the position correction (yaw correction) of the platform 2 performed by the XY yaw correction table section 858 are executed. shake correction). As mentioned above, the execution timing of these position corrections is controlled by the interrupt generator 814 . Specifically, whenever the Y-axis counter 811 counts a predetermined number of count values (for example, 10), the interrupt generation unit 814 sends an execution command to the X-axis movement amount calculation unit 857 and the θ-axis movement amount calculation unit 859 The X-axis movement amount calculation unit 857 and the θ-axis movement amount calculation unit 859 execute the position correction they are in charge of each time an execution command is received. As such, platform 2 position corrections are not made for every count. But it is also possible to correct the position of platform 2 for each count.

In step S101, the platform driving mechanism 3 starts to drive the platform 2 in the Y direction. Thereby, the stage 2 moves in the alignment movement range Ya, and the board|substrate We mounted on the stage 2 passes the imaging range Rc (FIG. 7) of the alignment camera 51 (step S102). On the other hand, as shown in FIG. 8 , an alignment mark Ma is attached to the substrate We. Therefore, the alignment camera 51 captures an image of the alignment mark Ma moving in the imaging range Rc, and acquires the alignment mark image Ia (step S103, alignment mark acquisition operation). In this way, after the front end of the platform 2 reaches one end of the alignment movement range Ya ("when alignment mark acquisition starts" in FIG. 7 ) until the front end of the platform 2 reaches the other end of the alignment movement range Ya ("alignment mark" The alignment mark image Ia is captured during the period when the mark acquisition is completed".

Furthermore, in the alignment mark acquisition operation (step S103), the alignment mark image Ia is sent from the alignment camera 51 to the host PC 91 (FIG. 4). The CPU 911 of the host PC 91 acquires the position of the alignment mark Ma by performing image processing on the alignment mark image Ia, and sends it to the control unit 8 . In this way, the control unit 8 acquires the position of the alignment mark Ma from the CPU 911 (alignment mark acquiring operation). And the control part 8 adjusts the pattern of the light irradiated to the board|substrate We based on the position of the alignment mark Ma acquired by the alignment mark acquisition operation|movement.

Also, the stage 2 reaches one end of the exposure movement range Ye just before the stage 2 reaches the other end of the alignment movement range Ya. Thereby, the stage 2 moves in the exposure movement range Ye, and the board|substrate We mounted on the stage 2 passes the irradiation range Re (FIG. 7) of the exposure head 41 (step S104). In parallel with the passage of the substrate We through the irradiation range Re, the exposure head 41 exposes the stripe-shaped region Rs extending in the Y direction on the substrate We by irradiating the irradiation range Re with laser light (exposure operation). At this time, as described above, the laser light irradiated to the irradiation area Re is adjusted based on the position of the alignment mark Ma. In this way, after the front end of the platform 2 reaches one end of the exposure movement range Ye ("when the exposure operation starts" in Fig. 7 ) until the front end of the platform 2 reaches the other end of the exposure movement range Ye ("when the exposure operation ends" in Fig. 7 ) During this period, the exposure action is performed.

When the exposure operation ends, the stage driving mechanism 3 stops the movement of the stage 2 in the Y direction (step S106). Furthermore, as shown in FIG. 8 , a plurality of stripe regions Rs arranged in the Y direction are set on the substrate We, and laser light is irradiated to one stripe region Rs in one exposure operation. Therefore, in step S107, it is confirmed whether the over-exposure operation has been performed on all the strip regions Rs. When there is a strip-shaped area Rs that has not been exposed (i.e. not exposed), the platform driving mechanism 3 drives the platform 2 along the X direction so that the irradiation range Re of the exposure head 41 is located in the strip-shaped area Rs that has not been exposed. Region Rs (step S108), repeatedly execute steps S104-S106. However, the direction in which the platform 2 passes through the exposure movement range Ye in this exposure operation is opposite to the direction in which the platform 2 passes through the exposure movement range Ye in the previous exposure operation. In this way, the stage 2 is reciprocated in the Y direction while performing a plurality of exposure operations, thereby exposing all the stripe regions Rs.

Fig. 9 is a flow chart showing an example of a method of creating a yaw correction table. In step S201 , the operator or the working robot installs the position measuring device 92 on the main body 11 of the exposure device 1 . In step S202, the platform driving mechanism 3 starts to drive the platform 2 in the Y direction. Thereby, the table 2 moves in the movable range Yt including the alignment movement range Ya and the exposure movement range Ye. In this stage, since the straightness correction table Ts and the yaw correction table Ty have not been formulated, the straightness correction and yaw correction cannot be performed. Therefore, in the stage driving mechanism 3 , the Y-axis servo motor 311 operates, while the X-axis servo motor 331 and the θ-axis servo motor 351 stop, and the straightness correction and yaw correction do not function.

Y軸雷射測長機92d之輸出值(旋轉方向θ上的旋轉量)與來自Y軸計數器811之輸出值(Y方向上的位置)，並將該等相互建立對應(步驟S204)。再者，該等輸出值係經由Y軸位置資訊輸出部817而獲取。藉此，獲得表示Y軸計數器811的計數值、及位於該計數值所示之位置之平台2之旋轉方向θ的旋轉量之對應關係的偏搖測量結果。 In this way, in the state where the Y-axis servo motor 311 is driving the platform 2 in the Y direction, the XY yaw correction meter 858 acquires information from the Y-axis counter 811 for each count of the Y-axis counter 811.

The output value of the Y-axis laser length measuring machine 92d (rotation amount in the rotation direction θ) and the output value from the Y-axis counter 811 (position in the Y direction), and establish correspondence with each other (step S204). Furthermore, the output values are obtained through the Y-axis position information output unit 817 . Thereby, a yaw measurement result showing the correspondence relationship between the count value of the Y-axis counter 811 and the rotation amount in the rotation direction θ of the stage 2 at the position indicated by the count value is obtained.

When the yaw measurement result is obtained in the entire movable range Yt, the movement of the platform 2 in the Y direction stops (step S205). Then, the XY yaw correction table unit 858 obtains the error between the reference rotation amount θ0 in the rotation direction θ and the measured rotation amount of the platform 2 in the rotation direction θ, and obtains the rotation direction θ required to eliminate the error. The amount of correction, thereby, formulate and memorize the yaw correction table Ty (step S206).

Incidentally, a step of removing the position measuring device 92 from the main body 11 of the exposure device 1 by an operator or a working robot after the movement of the stage 2 in the Y direction stops may also be set. On the other hand, this step may not be executed when the operation of creating the truth correction table described with reference to FIG. 10 and the like is continued.

FIG. 10 is a flow chart showing an example of a method for creating a straightness correction table, and FIGS. 11A, 11B and 12 are diagrams schematically showing operations executed in making the straightness correction table in FIG. 10 . When the position measuring device 92 is not attached to the main body 11 of the exposure apparatus 1 before the start of the flow chart in FIG.

In step S301 , the test substrate Wt is placed on the platform 2 . The test substrate Wt is, for example, a glass substrate. On the upper surface of the test substrate Wt, as shown in FIG. 12 , a plurality of test marks Mt are arranged in the Y direction. The positional relationship of each test mark Mt in the X direction is memorized in the truth correction table formulation part 856 after pre-measurement. Here, the respective test marks Mt are provided at the same positions in the X direction, and a plurality of test marks Mt are arranged in parallel in the Y direction. Furthermore, a photosensitive material such as photoresist is coated on the upper surface of the glass substrate of the test substrate Wt, and the alignment camera 51 can photograph the test mark Mt through the photosensitive material.

In step S302, the platform driving mechanism 3 starts to drive the platform 2 in the Y direction. Accordingly, the stage 2 moves in the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51 . In this stage, since the truth correction table Ts has not been prepared, the truth correction cannot be performed. On the other hand, since the yaw correction table Ty has been prepared, yaw correction can be performed. Therefore, in the platform driving mechanism 3 , while the Y-axis servo motor 311 drives the platform 2 in the Y direction, the θ-axis servo motor 351 drives the platform 2 in the rotation direction θ based on the yaw correction table Ty to perform yaw correction. On the other hand, the X-axis servo motor 331 is stopped, and the straightness correction is not performed.

In step S304, the camera 51 is aligned to photograph the test mark Mt moving in the imaging range Rc, and the test mark image It is obtained (FIG. 12). In this way, after the front end of the platform 2 reaches one end of the alignment movement range Ya ("when the test mark acquisition starts" in Fig. 11A ) until the front end of the platform 2 reaches the other end of the alignment movement range Ya ("test mark acquisition" in Fig. At the end"), the test mark image It is captured.

Furthermore, the test mark image It is associated with the count value of the Y-axis counter 811 when the test mark image It was captured, and is sent from the alignment camera 51 to the host PC 91 ( FIG. 4 ). The CPU 911 of the host PC 91 acquires the X-direction position of the test mark Mt by performing image processing on the test mark image It. Then, the position in the X direction of the test mark Mt is associated with the count value of the Y-axis counter 811 when the test mark Mt is photographed, and is sent from the main PC 91 to the straightness correction table formulation part 856 of the control board 85 .

Thereby, the position of the test mark Mt in the X direction, that is, the position of the platform 2 in the X direction can be measured for the count value spanning and aligning the entire range of the moving range Ya (step S305 ). Then, the straightness correction table formulation unit 856 obtains the error between the reference position X0 in the X direction and the measured position in the X direction of the platform 2 for each count value, and obtains the required value in the X direction for eliminating the error. The correction amount thereby creates a straightness correction table Ts for the alignment movement range Ya, and stores it in the Y-axis straightness correction table section 855 (step S306).

Furthermore, as the platform 2 is driven in the Y direction, the platform 2 moves in the exposure moving range Ye, and the test substrate Wt passes through the irradiation range Re of the exposure head 41 (step S307 ). In step S308, the exposure head 41 draws an exposure mark Me ( FIG. 12 ) on each test mark Mt of the test substrate Wt by irradiating a light beam on the test substrate Wt moving in the irradiation range Re. In this way, after the front end of the platform 2 reaches one end of the exposure movement range Ye ("when the exposure operation starts" in Fig. 11A ) to the front end of the platform 2 reaches the other end of the exposure movement range Ye ("when the exposure operation ends" in Fig. 11A ) During this period, the exposure action is performed.

The platform drive mechanism 3 stops the movement of the platform 2 toward the Y direction in step S309 (step S309), and in step S310 the platform 2 is moved to the starting point (one end) of the alignment range Ya ("exposure mark" in Fig. 11B). Get started"). Next, the Y-axis straightness correction table unit 855 starts the straightness correction using the straightness correction table Ts for the alignment movement range Ya prepared in step S306 (step S311).

In step S312, the platform driving mechanism 3 starts to drive the platform 2 along the Y direction. Thereby, the stage 2 is moved in the alignment movement range Ya, and the test substrate Wt is passed through the imaging range Rc of the alignment camera 51 . At this time, the truth correction based on the truth correction table Ts prepared in step S306 is performed on the platform 2 .

In step S314, the camera 51 is aligned with the exposure mark Me moving in the photographing range Rc to obtain an exposure mark image Ie (FIG. 12). In this way, after the front end of the platform 2 reaches one end of the alignment movement range Ya ("when exposure mark acquisition starts" in Fig. 11B ) until the front end of the platform 2 reaches the other end of the alignment movement range Ya ("exposure mark acquisition" in Fig. During the period of "end time"), the exposure mark image Ie is captured.

Furthermore, the exposure mark image Ie is associated with the count value of the Y-axis counter 811 when the exposure mark image Ie was captured, and is sent from the alignment camera 51 to the host PC 91 ( FIG. 4 ). The CPU 911 of the host PC 91 acquires the X-direction position of the exposure mark Me by performing image processing on the exposure mark image Ie. Then, the X-direction position of the exposure mark Me is associated with the count value of the Y-axis counter 811 when the exposure mark Me is photographed, and sent from the main PC 91 to the straightness correction table formulation part 856 of the control board 85 .

As described above, the exposure mark Me is drawn by irradiating the test substrate Wt placed on the stage 2 passing the exposure movement range Ye with a light beam by the exposure head 41 . Furthermore, when the alignment correction is performed on the platform 2 and the platform 2 passes through the alignment movement range Ya, the position of the exposure mark Me in the X direction is obtained based on the image of the exposure mark Me captured by the alignment camera 51 . The X-direction position of each exposure mark Me obtained in this way indicates the straightness of the stage 2 within the exposure movement range Ye.

In this way, the position of the exposure mark Me in the X direction can be measured for the count value spanning the entire range of the exposure movement range Ye (step S315 ). Then, the truth correction table formulating unit 856 calculates the error between the reference position X0 in the X direction and the measured position in the X direction of the platform 2 for each count value, and calculates the X direction required to eliminate the error. In this way, a straightness correction table Ts for the exposure moving range Ye is created and stored in the Y-axis straightness correction table part 855 (step S316). In addition, as described above, the alignment movement range Ya partially overlaps with the exposure movement range Ye. For this overlapping portion, any one of the data obtained in step S306 and the data obtained in step S316 may be selected and used.

As mentioned above, the platform 2 (drive object) is driven in the Y direction (main scanning direction) by the platform driving mechanism 3 (driving mechanism), thereby making the exposure movement range Ye (first moving range) of the platform 2 in the Y direction ) is moved, and the substrate We is made to pass through the irradiation range Re along the Y direction (the first main scanning drive (step S104)). Then, in parallel with the first main scanning drive (step S104), light is irradiated from the exposure head 41 to the irradiation range Re, thereby exposing the stripe-shaped region Rs (region) extending in the Y direction on the substrate We (exposure operation ( Step S105)). In particular, based on the straightness correction table Ts (the first straightness correction information), the position of the platform 2 in the X direction during the execution of the first main scanning drive (step S104) is corrected by the platform driving mechanism 3 (the first straightness correction action), the above-mentioned straightness correction table Ts represents the X-direction correction amount (first true straightness correction). As a result, the straightness when the stage 2 is driven in the Y direction by the stage drive mechanism 3 can be ensured, and light can be irradiated from the exposure head 41 to an appropriate position of the substrate We placed on the stage 2 .

In addition, there is a step of executing the correction information creation operation (steps S307 to S316), which is based on the X-direction movement of the stage 2 that is moved in the Y-direction within the exposure movement range Ye by the stage driving mechanism 3. As a result of calculating the position, a truth correction table Ts is formulated. Then, in the first straightness correction operation, the position of the stage 2 in the X direction is corrected based on the straightness correction table Ts prepared in the correction information preparation operation. In this configuration, the straightness correction is formulated based on the result of obtaining the position in the X direction of the stage 2 moved in the Y direction within the exposure movement range Ye by the stage driving mechanism 3, that is, based on the result of obtaining the straightness in advance. Table Ts (Correction information formulation action). And, when performing the first main scanning drive (step S104) and performing the exposure operation (step S105), the straightness of the stage 2 can be ensured based on the straightness correction table Ts prepared in this way.

In particular, in step S303, the second main scanning drive is executed. The second main scanning drive uses the stage driving mechanism 3 to direct the stage 2 on which the test substrate Wt with the test mark Mt (reference mark) is placed in the Y direction. By driving, the stage 2 is moved in the alignment movement range Ya (second movement range) in the Y direction, and the test substrate Wt is passed through the imaging range Rc of the alignment camera 51 in the Y direction. In addition, in step S304, the test mark Mt passing through the imaging range Rc during execution of the second main scanning drive is photographed by the alignment camera 51, and a test mark image It is acquired. Moreover, in steps S305 and S306, based on the position of the test mark Mt shown in the test mark image It in the X direction, a straightness correction table Ts (second straightness correction information) is formulated. The straightness correction table Ts is represented by The X-direction correction amount (second straightness correction amount) for correcting the position of the stage 2 in the X direction based on the position of the stage 2 in the Y direction within the alignment movement range Ya is used. Furthermore, in a state where the stage 2 moves in the exposure moving range Ye and the substrate We passes the irradiation range Re toward the Y direction (first main scanning drive), the test substrate Wt passing through the irradiation range Re is irradiated with a light beam from the exposure head 41, and Here, the exposure mark Me is drawn on the test substrate Wt. Then, while the position of the stage 2 in the X direction is corrected based on the straightness correction table Ts, the stage 2 is moved in the alignment movement range Ya, and the test substrate Wt is passed through the imaging range Rc of the alignment camera 51 in the Y direction. In (second main scanning driving), the exposure mark Me passing through the imaging range Rc is photographed by the alignment camera 51, and the exposure mark image Ie is acquired (steps S310 to S314). Then, the straightness correction table Ts( Steps S315, S316). In this configuration, the straightness of the platform 2 can be obtained without using an expensive laser interferometer.

In addition, the position of the table 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit), and is sent to the imaging time point output unit 812 (radiographing time point control unit). Furthermore, the photographing time point output unit 812 causes the alignment camera 51 to photograph the alignment mark Ma of the substrate We at a time point corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811. . Here, the Y-axis counter 811 and the imaging time point output unit 812 are provided in the same integrated circuit 81 (FPGA). Therefore, a communication delay from the Y-axis counter 811 to the imaging time point output section 812 can be suppressed, and the position of the stage 2 in the Y direction can be transmitted to the imaging time point output section 812 . Therefore, shooting with the camera 51 can be performed at an appropriate time point corresponding to the position of the platform 2 .

Also, the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit), and is sent to the interrupt generation unit 814 (correction timing control unit). Furthermore, the interrupt generation unit 814 causes the stage driving mechanism 3 to execute the straightness correction based on the straightness correction table Ts (the first straightness correction operation) at the time point corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811. ). Here, the Y-axis counter 811 and the interrupt generator 814 are provided in the same integrated circuit 81 (FPGA). Therefore, a communication delay from the Y-axis counter 811 to the interrupt generating section 814 can be suppressed, and the position of the stage 2 in the Y direction can be transmitted to the interrupt generating section 814 . Therefore, the position of the platform 2 in the X direction can be corrected at an appropriate time point corresponding to the position of the platform 2 .

As mentioned above, the platform 2 (drive object) is driven in the Y direction (main scanning direction) by the platform driving mechanism 3 (driving mechanism), thereby making the exposure movement range Ye (first moving range) of the platform 2 in the Y direction ) is moved, and the substrate We is passed through the irradiation range Re along the Y direction (step S104 (first main scanning drive)). Then, in parallel with the first main scanning drive (step S104), light is irradiated from the exposure head 41 to the irradiation range Re, thereby exposing the striped region Rs extending in the Y direction on the substrate We (step S105 (exposure operation)). . In particular, based on the yaw correction table Ty (first yaw correction information), the rotation amount of the stage 2 in the rotation direction θ during the execution of the first main scanning drive is corrected by the stage driving mechanism 3 (the first yaw correction action), the yaw correction table Ty represents the θ direction correction amount used to correct the rotation amount of the platform 2 in the rotation direction θ (yaw direction) according to the position of the platform 2 in the Y direction within the exposure movement range Ye (the first yaw correction amount). As a result, the increase in cost can be suppressed, and the yaw of the stage 2 when the stage 2 is driven in the Y direction by the stage driving mechanism 3 can be suppressed, and light can be irradiated from the exposure head 41 to an appropriate position of the substrate We placed on the stage 2. .

In addition, the first correction information formulation operation (steps S201-S206) is executed. The first correction information formulation operation is based on the rotation direction θ of the platform 2 that is moved in the Y direction in the exposure movement range Ye by the platform driving mechanism 3. The result of calculating the amount of rotation is used to formulate the yaw correction table Ty. Furthermore, in the yaw correction (first yaw correction operation) performed in parallel with the movement of the exposure movement range Ye of the stage 2 (first main scanning drive) in step S104, an operation is established based on the first correction information (step The yaw correction table Ty formulated in S201-S206) is used to correct the rotation amount of the platform 2 in the rotation direction θ. That is, the yaw correction is formulated based on the obtained result of the position in the rotation direction θ of the stage 2 moved in the Y direction within the exposure movement range Ye by the stage drive mechanism 3, that is, based on the result of the yaw obtained in advance. Table Ty (steps S201 to S206). Moreover, when performing the movement of the exposure movement range Ye of the stage 2 in step S104 (the first main scanning drive) and performing the exposure operation (step S105), the stage can be suppressed based on the yaw correction table Ty prepared in this way. 2 yaw.

Also, a step (step S201 ) of attaching a position measuring device 92 (yaw measuring device) to the exposure apparatus 1 that measures the amount of rotation of the table 2 in the rotation direction θ using a laser interferometer is provided. And, execute the first yaw measurement (step S204), and formulate the yaw correction table Ty (the first yaw correction information) based on the result of the first yaw measurement (step S206), the above-mentioned first yaw measurement system, The position measuring device 92 is used to measure the rotation amount of the stage 2 in the rotation direction θ that is moved in the exposure movement range Ye by driving the stage 2 in the Y direction by the stage driving mechanism 3, and the position and the position of the stage 2 in the Y direction are acquired. The amount of rotation in the rotation direction θ and establish a correspondence. In this configuration, the yaw of the platform 2 can be easily calculated by the measurement of the laser interferometer of the position measuring device 92 . Moreover, the position measuring device 92 is attached to the exposure apparatus 1 at the time of yaw measurement, and is used. Therefore, once the yaw measurement is completed, it is only necessary to remove the position measuring device 92 from the exposure apparatus 1 . Therefore, the exposure apparatus 1 itself does not need to provide the position measuring device 92, and the cost increase of the exposure apparatus 1 can be suppressed.

In addition, the platform 2 is driven in the Y direction by the platform driving mechanism 3, whereby the alignment movement range Ya (second movement range) of the platform 2 in the Y direction is moved, and the substrate We is passed through the alignment camera 51 in the Y direction. the imaging range Rc (step S102 (second main scanning drive)). Then, in parallel with the second main scanning drive (step S102), the alignment camera 51 photographs the alignment mark Ma passing through the photographing range Rc, thereby photographing the alignment mark image Ia, and obtaining the alignment mark image Ia shown in FIG. The position of the alignment mark Ma (step S103, alignment mark acquisition operation). In particular, based on the yaw correction table Ty (second yaw correction information), the rotation amount of the stage 2 in the rotation direction θ during execution of the second main scanning drive is corrected by the stage driving mechanism 3 (the second yaw correction action), the above-mentioned yaw correction table Ty represents the θ direction correction amount (the second yaw correction amount) used to correct the rotation amount of the platform 2 in the rotation direction θ according to the position of the platform 2 in the Y direction within the alignment movement range Ya. shake correction amount). As a result, the increase in cost can be suppressed, and the yawing of the stage 2 when the stage 2 is driven in the Y direction by the stage driving mechanism 3 can be suppressed, and the position of the alignment mark Ma of the substrate We can be reliably obtained.

In addition, the second correction information formulation operation (steps S201-S206) is executed. The second correction information formulation operation is based on the rotation direction of the platform 2 that is moved in the Y direction in the alignment movement range Ya by the platform driving mechanism 3. The result of obtaining the amount of rotation on θ is used to formulate the yaw correction table Ty. In addition, in the yaw correction (second yaw correction operation) performed in parallel with the movement of the alignment movement range Ya of the stage 2 (second main scanning drive) in step S102, the operation is formulated based on the second correction information (step The yaw correction table Ty formulated in S201-S206) is used to correct the rotation amount of the platform 2 in the rotation direction θ. That is, the yaw is determined based on the obtained result of the position in the rotation direction θ of the stage 2 moved in the Y direction within the alignment movement range Ya by the stage drive mechanism 3, that is, based on the result of the yaw obtained in advance. Shake the correction table Ty (steps S201 to S206). Furthermore, when the movement of the alignment movement range Ya of the stage 2 in step S102 (second main scanning drive) is executed, and the alignment mark acquisition operation (step S103) is executed (step S103), it is possible to correct the yaw based on this method. Table Ty to suppress the yaw of the driven object.

Also, a step (step S201 ) of attaching a position measuring device 92 (yaw measuring device) to the exposure apparatus 1 that measures the amount of rotation of the table 2 in the rotation direction θ using a laser interferometer is provided. And, execute the second yaw measurement (step S204), and formulate the yaw correction table Ty (the second yaw correction information) based on the result of the second yaw measurement (step S206), the above-mentioned second yaw measurement system, The position measuring device 92 is used to measure the amount of rotation of the stage 2 in the rotation direction θ that is moved in the alignment movement range Ya by driving the stage 2 in the Y direction by the stage driving mechanism 3, and the position of the stage 2 in the Y direction is acquired. Correspond to the amount of rotation in the rotation direction θ. In this configuration, the yaw of the platform 2 can be easily obtained by measurement of the laser interferometer of the position measuring device 92 . Moreover, the position measuring device 92 is attached to the exposure apparatus 1 at the time of yaw measurement, and is used. Therefore, once the yaw measurement is completed, it is only necessary to remove the position measuring device 92 from the exposure apparatus 1 . Therefore, the exposure apparatus 1 itself does not need to provide the position measuring device 92, and the cost increase of the exposure apparatus 1 can be suppressed.

In addition, in the alignment mark acquisition operation (step S103), the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 (position detection unit), and is sent to the execution time for controlling the imaging of the alignment camera 51 (camera). The shooting time point output unit 812 (shooting time point control unit) of the point. Then, the photographing time point output unit 812 causes the alignment camera 51 to photograph the alignment mark Ma at a time point corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811 . Here, the Y-axis counter 811 and the imaging time point output unit 812 are provided in the same integrated circuit 81 (FPGA). Therefore, a communication delay from the Y-axis counter 811 to the imaging time point output section 812 can be suppressed, and the position of the stage 2 in the Y direction can be transmitted to the imaging time point output section 812 . Therefore, shooting with the camera 51 can be performed at an appropriate time point corresponding to the position of the platform 2 .

Moreover, the position of the platform 2 in the Y direction is detected by the Y-axis counter 811, and is sent to the interrupt generation unit 814 (correction time point control). Then, the interrupt generating unit 814 causes the stage drive mechanism 3 to perform yaw correction at a time point corresponding to the position of the stage 2 in the Y direction received from the Y-axis counter 811 . Here, the Y-axis counter 811 and the interrupt generator 814 are provided in the same integrated circuit 81 (FPGA). Therefore, a communication delay from the Y-axis counter 811 to the interrupt generating section 814 can be suppressed, and the position of the stage 2 in the Y direction can be transmitted to the interrupt generating section 814 . Therefore, the amount of rotation of the platform 2 in the rotation direction θ can be corrected at an appropriate time point corresponding to the position of the platform 2 .

In the embodiment described above, the exposure device 1 corresponds to an example of the "exposure device" of the first aspect of the present invention, and the platform 2 corresponds to an example of the "platform" and "driven object" of the first aspect of the present invention. The platform drive mechanism 3 corresponds to an example of the "drive mechanism" of the first aspect of the present invention, the exposure head 41 corresponds to an example of the "exposure head" of the first aspect of the present invention, and the alignment camera 51 corresponds to an example of the "exposure head" of the first aspect of the present invention. As an example of the "camera" of the first aspect, the control unit 8 corresponds to an example of the "control unit" and "memory unit" of the first aspect of the present invention, and the integrated circuit 81 corresponds to the first aspect of the present invention. As an example of the "integrated circuit", the Y-axis counter 811 corresponds to an example of the "position detection part" of the first aspect of the present invention, and the shooting time point output part 812 corresponds to the "shooting time point" of the first aspect of the present invention. The interrupt generation unit 814 corresponds to an example of the "correction time point control unit" of the first aspect of the present invention, and the alignment mark Ma corresponds to the "alignment mark" of the first aspect of the present invention. For example, the exposure mark Me corresponds to an example of the "exposure mark" of the first aspect of the present invention, and the test mark Mt corresponds to an example of the "reference mark" of the first aspect of the present invention. The correction table Ts corresponds to an example of the "second straightness correction information" of the first aspect of the present invention, and the straightness correction table Ts for the exposure movement range Ye corresponds to the "first straightness correction information" of the first aspect of the present invention. As an example, the imaging range Rc corresponds to an example of the "radiation range" of the first aspect of the present invention, the irradiation range Re corresponds to an example of the "irradiation range" of the first aspect of the present invention, and the substrate We corresponds to an example of the "irradiation range" of the first aspect of the present invention. An example of the "substrate" of the first aspect, the test substrate Wt corresponds to an example of the "test substrate" of the first aspect of the present invention, and the X direction corresponds to an example of the "sub-scanning direction" of the first aspect of the present invention , the Y direction corresponds to an example of the "main scanning direction" of the first aspect of the present invention, the alignment movement range Ya corresponds to an example of the "second movement range" of the first aspect of the present invention, and the exposure movement range Ye corresponds to In an example of the "first moving range" of the first aspect of the present invention, step S104 or step S307 is equivalent to an example of the "first main scanning drive" of the first aspect of the present invention, and step S105 is equivalent to the first aspect of the present invention. An example of the "exposure operation" of the first aspect, step S303 corresponds to an example of the "second main scanning drive" of the first aspect of the present invention, and steps S307 to S316 correspond to the "correction" of the first aspect of the present invention An example of the "information creation operation" is an example of the "first alignment correction operation" of the first aspect of the present invention for the straightness correction of the platform 2 moving within the exposure movement range Ye.

In the embodiment described above, the exposure device 1 corresponds to an example of the "exposure device" of the second aspect of the present invention, and the platform 2 corresponds to an example of the "platform" and the "driven object" of the second aspect of the present invention. The platform drive mechanism 3 corresponds to an example of the "drive mechanism" of the second aspect of the present invention, the exposure head 41 corresponds to an example of the "exposure head" of the second aspect of the present invention, and the control unit 8 corresponds to the first aspect of the present invention. An example of the "control section" and "memory section" of the second aspect, the integrated circuit 81 corresponds to an example of the "integrated circuit" of the second aspect of the present invention, and the Y-axis counter 811 corresponds to the second aspect of the present invention As an example of such a "position detection unit", the shooting time point output part 812 corresponds to an example of the "shooting time point control part" of the second aspect of the present invention, and the interrupt generating part 814 corresponds to the second aspect of the present invention. As an example of the "correction timing control unit", the position measuring device 92 corresponds to an example of the "yaw measuring device" of the second aspect of the present invention, and the alignment mark Ma corresponds to the "alignment" of the second aspect of the present invention. Mark" is an example, the irradiation range Re corresponds to an example of the "irradiation range" of the second aspect of the present invention, and the yaw correction table Ty for the exposure movement range Ye corresponds to the "first bias" of the second aspect of the present invention. As an example of "Yaw Correction Information", the straightness correction table Ts of the alignment movement range Ya is equivalent to an example of "Second Yaw Correction Information" of the second aspect of the present invention, and the substrate We is equivalent to the second aspect of the present invention. As an example of the "substrate", the Y direction corresponds to an example of the "main scanning direction" of the second aspect of the present invention, and the alignment movement range Ya corresponds to an example of the "second movement range" of the second aspect of the present invention. The exposure movement range Ye corresponds to an example of the "first movement range" of the second aspect of the present invention, the rotation direction θ corresponds to an example of the "yaw direction" of the second aspect of the present invention, and the correction amount in the θ direction corresponds to As an example of the "first yaw correction amount" and "second yaw correction amount" of the second aspect of the present invention, step S102 corresponds to an example of the "second main scanning drive" of the second aspect of the present invention , step S103 corresponds to an example of the "alignment mark acquisition operation" of the second aspect of the present invention, step S104 corresponds to an example of the "first main scanning drive" of the second aspect of the present invention, and step S105 corresponds to the present invention. An example of the "exposure operation" of the second aspect of the invention, steps S201 to S206 correspond to an example of the "first correction information formulation operation" and "second correction information formulation operation" of the second aspect of the present invention, step S204 It corresponds to an example of the "first yaw measurement" and "second yaw measurement" of the second aspect of the present invention, and the yaw correction performed in parallel with step S102 corresponds to the "second yaw measurement" of the second aspect of the present invention. 2 An example of the yaw correction operation", the yaw correction performed in parallel with step S104 corresponds to an example of the "first yaw correction operation" of the second aspect of the present invention.

In addition, this invention is not limited to the said embodiment, As long as it does not deviate from the summary, various changes other than the above can be made. For example, the method of creating the truth correction table Ts is not limited to the above example. FIG. 13 is a block diagram showing the configuration of another example of implementing the method of making the truth correction table, and FIG. 14 is a perspective view showing the configuration of another example of executing the method of making the truth correction table.

In this other example, the position of the platform 2 in the X direction is measured by a laser interferometer. That is, in addition to the composition shown in FIG. 3 , the position measuring device 92 has: a laser interferometer 925 mounted on the side of the platform 2 in the X direction; Move the range while extending the settings. The laser interferometer 925 emits laser light parallel to the X direction, the reflector 926 is a mirror perpendicular to the X direction, and the laser interferometer 925 and the reflector 926 are opposite to each other in the X direction. Furthermore, the laser interferometer 925 emits laser light toward the reflector 926 , and measures the position of the platform 2 in the X direction based on the result of detecting the laser light reflected by the reflector 926 .

Moreover, the X-axis laser length measuring machine 92x is composed of a laser interferometer 925 , and the X-axis laser length measuring machine 92x outputs the X-direction position of the platform 2 measured by the laser interferometer 925 to the control unit 8 . Then, the control unit 8 creates a straightness correction table Ts based on the result of measuring the position of the stage 2 by the position measuring device 92 .

That is, during the period when the platform 2 moves along the Y direction, the straightness correction table formulating part 856 of the control part 8 acquires the count value output by the Y-axis counter 811 and the X-axis laser length measuring machine 92x for each count of the Y-axis counter 811. The X-direction position of the output platform 2 is established and correspondingly established. Thereby, a direct measurement result representing the corresponding relationship between the count value of the Y-axis counter 811 and the position in the X direction of the platform 2 at the position indicated by the count value is obtained.

When the straight measurement result is obtained for the entire movable range Yt, the movement of the stage 2 in the Y direction is stopped. Then, the straightness correction table formulating part 856 obtains the error between the reference position X0 in the X direction and the measured position of the platform 2 in the X direction, and obtains the correction amount in the X direction required to eliminate the error, thereby Formulate the straightness correction table Ts, and memorize it in the Y-axis straightness correction table part 855 .

That is, in this other example, in the correction information formulation operation, the straightness correction is formulated based on the measurement result of the X-direction position of the stage 2 moving in the Y-direction within the exposure movement range Ye by the laser interferometer. Table Ts. In this configuration, the straightness of the platform 2 can be simply calculated by the measurement of the laser interferometer.

In other words, as shown in FIG. 8 , with respect to the substrate We, a plurality of different stripe regions Rs (exposure positions) are set in the X direction (sub-scanning direction). Therefore, the position of the platform 2 is changed by the platform driving mechanism 3 between the plurality of different sub-scanning positions in the X direction corresponding to the plurality of stripe regions Rs, and the first main scanning drive, the first true straight In the correction operation and the exposure operation, the entire substrate We is exposed. However, when the position of the stage 2 (sub-scanning position) in the X direction changes, the balance of the weight applied from the stage 2 to the stage drive mechanism 3 changes. Therefore, it may be difficult to ensure the straightness of the stage 2 at each of the plurality of sub-scanning positions by a single straightness correction table Ts.

Here, the straightness correction table Ts may be provided for each of a plurality of sub-scanning positions (in other words, a plurality of strip regions Rs). Specifically, while changing the position of the platform 2 at a plurality of sub-scanning positions, it is sufficient to perform the above-mentioned operation of creating the straightness correction table Ts for each sub-scanning position. In this configuration, when the stage 2 is located at a sub-scanning position corresponding to one of the plurality of strip-shaped regions Rs, based on the straightness correction table set for the sub-scanning position (in other words, the strip-shaped region Rs) Ts, to correct the X-direction position of the platform 2 driven along the Y-direction. Thereby, the straightness of the platform 2 in the Y direction at each of the plurality of sub-scanning positions can be ensured.

Alternatively, instead of setting the straightness correction table Ts for each of the plurality of strip regions Rs, the number of the straightness correction tables Ts may be controlled to be smaller than the number of the striped regions Rs. Specifically, the straightness correction table Ts is set for each of a plurality of different setting positions in the X direction, and the plurality of setting positions are less than the plurality of sub-scanning positions (in other words, the plurality of strip regions Rs). In this configuration, when the platform 2 is located at a sub-scanning position corresponding to one of the plurality of strip-shaped regions Rs, based on the true straightness set for the set position closest to the sub-scanning position among the plurality of set positions, The correction table Ts corrects the X-direction position of the platform 2 driven along the Y-direction. Thereby, the memory resources required for memorizing the straightness correction table Ts can be suppressed, and the straightness of the stage 2 in the Y direction at each of the plurality of sub-scanning positions can be ensured. Furthermore, instead of the above content, the correction amount of the X-direction position of the platform 2 driven along the Y-direction can be calculated by linear interpolation. The straightness correction table Ts set for the set position of the sub-scanning position, and the correction amount obtained from the straightness correction table Ts set for the second set position close to the set position of the sub-scanning position.

Furthermore, the yaw correction table Ty can also be configured to be set for each of a plurality of sub-scanning positions or setting positions.

Furthermore, modifications other than those described above may be added. For example, in the example of FIG. 10 , the yaw correction of the platform 2 may not be performed when the straightness correction table Ts is created.

In addition, as shown in FIG. 8 , with respect to the substrate We, a plurality of different stripe regions Rs (exposure positions) are set in the X direction (sub-scanning direction). Here, between a plurality of different sub-scanning positions in the X direction corresponding to a plurality of stripe regions Rs, the position of the platform 2 is changed by the platform driving mechanism 3, and the first main scanning drive, the first scanning drive, and the first scanning drive are repeatedly performed. In the yaw correction operation and the exposure operation, the entire substrate We is exposed. However, when the position of the stage 2 (sub-scanning position) in the X direction changes, the balance of the weight applied from the stage 2 to the stage drive mechanism 3 changes. Therefore, it may be difficult to suppress the yaw of the platform 2 at each of the plurality of sub-scanning positions by a single yaw correction table Ts.

Therefore, the yaw correction table Ty may be provided for each of a plurality of sub-scanning positions (in other words, a plurality of stripe regions Rs). Specifically, while changing the position of the stage 2 at a plurality of sub-scanning positions, it is sufficient to perform the above-mentioned operation of creating the yaw correction table Ty for each sub-scanning position. In this configuration, when the table 2 is located at a sub-scanning position corresponding to one of the plurality of striped regions Rs, the yaw correction is based on the sub-scanning position (in other words, the striped region Rs). Table Ty, to correct the rotation amount of the rotation direction θ of the platform 2 driven along the Y direction. Thereby, the yawing of the platform 2 in the Y direction at each of the plurality of sub-scanning positions can be suppressed.

Alternatively, the yaw correction table Ty may not be set for each of the plurality of strip regions Rs, and the number of yaw correction tables Ty may be controlled to be smaller than the number of strip regions Rs. Specifically, the yaw correction table Ty is set for each of a plurality of different setting positions in the X direction, and the plurality of setting positions are less than the plurality of sub-scanning positions (in other words, the plurality of strip regions Rs). In this configuration, when the platform 2 is located at a sub-scanning position corresponding to one of the plurality of strip-shaped regions Rs, based on the offset set for the set position closest to the sub-scanning position among the plurality of set positions, Shake the correction table Ty to correct the amount of rotation in the rotation direction θ of the platform 2 driven in the Y direction. Alternatively, when the platform 2 is at a sub-scanning position corresponding to one of the plurality of strip regions Rs, the rotation amount of the platform 2 driven in the Y direction in the rotation direction θ can also be corrected by linear interpolation. , the above-mentioned linear interpolation uses the yaw correction table Ty set for the set position closest to the sub-scanning position among the plurality of set positions, and the yaw correction table Ty set for the second set position closest to the sub-scanning position. The amount of correction obtained by shaking the correction table Ty. Thereby, the memory resources required for memorizing the yaw correction table Ty can be suppressed, and the yaw of the platform 2 at each of the plurality of sub-scanning positions can be controlled.

Furthermore, the straightness correction table Ts can also be configured to be set for each of a plurality of sub-scanning positions or setting positions.

Also, assume a situation where the X-axis robot 33 of the platform driving mechanism 3 cannot sufficiently secure the straightness of the platform 2 , that is, the straightness of the platform 2 in the X direction. In this case, since the exposure operation is performed while changing the position of the stage 2 at a plurality of sub-scanning positions as described above, there is a concern that in the configuration of exposing each of the plurality of stripe regions Rs, the exposure operation will be delayed. The position (exposure start position) of the stage 2 in the Y direction is not uniform among a plurality of sub-scanning positions (in other words, a plurality of stripe regions Rs). Here, based on the result of measuring the unevenness in the exposure start position of the stage 2 between a plurality of sub-scanning positions in advance, a correction table indicating a correction amount for eliminating the unevenness may be created. In this configuration, by correcting the position of the stage 2 in the Y direction based on the correction table, it is possible to suppress unevenness in the exposure start position and perform an exposure operation on the substrate We.

In addition, the information used to perform the straightness correction can also be maintained by a numerical formula instead of a table form like the straightness correction table Ts. Similarly, the information used for yaw correction can also be maintained by a formula instead of a table like the yaw correction table Ty. The same applies to various information shown in other tables.

Moreover, instead of the platform 2 , the platform 2 may be relatively moved relative to the alignment camera 51 and the exposure head 41 by driving the alignment camera 51 or the exposure head 41 .

Moreover, the arrangement of each functional part 811-817, 851-859 can also be exchanged between the integrated circuit 81 and the control board 85. Furthermore, the control unit 8 does not need to be divided into the integrated circuit 81 and the control board 85 , and may be integrally formed. In addition, the main PC 91 may be integrally attached to the exposure apparatus 1 .

Also, the aspect of the test mark Mt provided on the test substrate Wt is not limited to the example shown in FIG. 12 . For example, a single straight line extending parallel to the Y direction may be provided on the test substrate Wt as the test mark Mt. (industrial availability)

The present invention is applicable to the technical field of exposing a substrate for forming a pattern on a substrate such as a semiconductor wafer or a glass substrate, for example.

1: Exposure device 2: Platform (drive object) 3: Platform drive mechanism (drive mechanism) 4: Exposure unit 5: Alignment unit 6: Lighting unit 7: Conveying device 8: Control part (control part, memory part) 11: Ontology 31:Y-axis robot 32: Workbench 33: X-axis robot 34:Workbench 35: Theta axis robot 41: Exposure head 43: Light irradiation department 51: Aim at the camera (camera) 61: optical fiber 81: Integrated circuit 85:Control panel 91: Main PC 92: Position measuring device (yaw measuring device) 92d: ΔY axis laser length measuring machine 92x: X-axis laser length measuring machine 92y: Y-axis laser length measuring machine 111: Body frame 112: Processing area 113: Handover area 114: crystal box loading part 311: Y axis servo motor 312: Y-axis encoder 331: X axis servo motor 351: θ axis servo motor 431:Laser driver 432:Laser oscillator 433: Illumination Optical System 811: Y-axis counter (position detection part) 812: Shooting time point output unit (shooting time point control unit) 813: Exposure time point output unit 814: Interrupt generation part (modification time point control part) 817: Y-axis position information output unit 851: Photography time point control department 852: Y-axis scale correction table 853: X-axis scale correction table part 854: Theta axis scale correction table 855: Y-axis true straight correction table 856:Department of Formulation of Truth Correction Form 857: X-axis movement calculation part 858: XY yaw correction surface 859: θ-axis movement calculation unit 911:CPU 921, 922, 925: Laser interferometers 923,924,926: Mirrors C: crystal case Ia: Alignment mark image Ie: Exposure mark image It: Test Marker Image Ma: alignment mark Me: Exposure Marker Mt: test mark (fiducial mark) Rc: photographic range Re: Irradiation range Rs: strip area S101: step S102: Step (second main scan driver) S103: Step (Acquisition of Alignment Mark) S104, S307: Steps (first main scan driver) S105: Step (exposure action) S106～S108, S301, S302, S304, S305, S306: steps S201-S206: Steps (the first and second correction information creation operations) S204: Step (1st and 2nd yaw measurement) S303: Step (second main scan driver) S307～S316: Steps (Correct information and formulate action) Ts: Truth correction table (1st and 2nd truth correction information) Ty: Yaw correction table (1st and 2nd yaw correction information) We: Substrate Wt: Test substrate X: X direction (sub-scanning direction) X0: Reference position X(1): the position in the X direction X(2): the position in the X direction X(3): the position in the X direction X(4): the position in the X direction X(i): the position in the X direction Y: Y direction (main scanning direction) Y(1): the position in the Y direction Y(2): The position in the Y direction Y(3): The position in the Y direction Y(4): the position in the Y direction Y(i): the position in the Y direction Ya: Alignment movement range (2nd movement range) Ye: Exposure movement range (1st movement range) Yt: movable range θ: direction of rotation (yaw direction) θ0: Reference rotation amount

FIG. 1 is a front view schematically showing a schematic configuration of an exposure apparatus of the present invention. FIG. 2 is a block diagram showing an example of an electrical configuration included in the exposure apparatus of FIG. 1 . FIG. 3 is a perspective view schematically showing an example of a position measuring device for measuring the position of a stage with a laser interferometer. FIG. 4 is a block diagram showing an example of a detailed configuration of a control unit that executes an alignment mark acquisition operation and an exposure operation. Fig. 5A is a diagram showing an example of a straightness correction table. FIG. 5B is a diagram showing an example of a yaw correction table. FIG. 6 is a flowchart showing an example of an alignment mark acquisition operation and an exposure operation. FIG. 7 is a side view schematically showing the operation of the exposure apparatus executed according to the flowchart of FIG. 6 . FIG. 8 is a diagram schematically showing an example of a board to be executed in the flowchart of FIG. 6 . Fig. 9 is a flow chart showing an example of a method of creating a yaw correction table. Fig. 10 is a flow chart showing an example of a method of creating a truth correction table. Fig. 11A is a diagram schematically showing operations performed by the creation of the truth correction table in Fig. 10 . FIG. 11B is a diagram schematically showing operations performed by the creation of the truth correction table in FIG. 10 . Fig. 12 is a diagram schematically showing operations executed in the creation of the truth correction table in Fig. 10 . Fig. 13 is a block diagram showing the construction of another example of the method of implementing the truth correction table. Fig. 14 is a perspective view showing the construction of another example of the execution method of creating the straightness correction table.

Ts: Truth Correction Table

X(1): the position in the X direction

X(2): the position in the X direction

X(3): the position in the X direction

X(4): the position in the X direction

X(i): the position in the X direction

Y(1): the position in the Y direction

Y(2): The position in the Y direction

Y(3): The position in the Y direction

Y(4): the position in the Y direction

Y(i): the position in the Y direction

Ya: alignment movement range

Ye: exposure movement range

Yt: movable range

Claims (22)

An exposure method comprising the steps of: performing a first main scanning drive, wherein the first main scanning drive system uses a drive mechanism to drive one of a platform on which a substrate is placed and an exposure head that irradiates light to an irradiation area. Driving in the main scanning direction, whereby the driving object is moved in the first moving range in the main scanning direction, and the substrate is relatively passed through the irradiation range along the main scanning direction; the step of performing a correction operation, the correction operation The position of the driving object in the sub-scanning direction is corrected by the driving mechanism during execution of the first main scanning drive based on the position of the driving object in the main scanning direction within the first moving range, and at least one of the amount of rotation of the driven object in the yaw direction; and a step of performing an exposure operation, wherein the exposure operation is performed by irradiating light from the exposure head to the irradiation range during execution of the first main scanning drive, and exposing a region of the substrate extending along the main scanning direction. The exposure method according to claim 1, wherein the correction operation includes a first straightness correction operation, and the first straightness correction operation is based on the first straightness correction information, which is corrected by the driving mechanism during the execution of the first main scanning drive The position of the driven object in the sub-scanning direction, and the first straightness correction information indicate a first straightness correction amount for correcting the position of the driven target in the sub-scanning direction. The exposure method according to claim 2, further comprising a step of performing a correction information formulation operation, the correction information formulation operation being based on the drive to move in the first movement range along the main scanning direction by the drive mechanism As a result of obtaining the position of the object in the above-mentioned sub-scanning direction, the above-mentioned first straightness correction information is formulated, In the first straightness correction operation, the position of the driven object in the sub-scanning direction is corrected based on the first straightness correction information prepared by the correction information preparation operation. The exposure method according to claim 3, wherein, in the operation of formulating the correction information, the position in the sub-scanning direction of the driving object moving in the first moving range along the main-scanning direction is based on a laser interferometer The result of the measurement is used to formulate the above-mentioned first truth correction information. The exposure method according to claim 3, which is to perform the following steps in the above-mentioned correction information formulation operation: the step of performing the second main scanning drive, the above-mentioned second main scanning drive is to place the above-mentioned test substrate with the reference mark The stage is the driving object, and is driven in the main scanning direction by the driving mechanism, whereby the stage is moved in the second moving range in the main scanning direction, and the test substrate is passed through the camera along the main scanning direction. photographing range; using the above-mentioned camera to photograph the above-mentioned fiducial mark passing through the above-mentioned photographing range during the execution of the second main scanning drive, and a step of acquiring a fiducial mark image; based on the above-mentioned fiducial mark shown in the above-mentioned fiducial mark image A step of formulating second straightness correction information based on the position in the sub-scanning direction, the second straightness correction information being used to correct the position of the above-mentioned stage in the main-scanning direction according to the position of the above-mentioned stage within the second moving range The second straightness correction amount of the position in the above-mentioned sub-scanning direction; A step of drawing an exposure mark on the test substrate by irradiating light from the exposure head to the test substrate passing through the irradiation range while executing the first main scanning drive; and correcting based on the second straight correction information The position of the stage in the sub-scanning direction, while performing the second main scanning drive, using the camera to photograph the exposure mark passing through the photographing range, and obtaining an image of the exposure mark; and based on the above-mentioned exposure mark map The step of formulating the first straightness correction information as a result of calculating the position of the stage in the sub-scanning direction moving in the first moving range as shown in the position of the exposure mark in the sub-scanning direction . The exposure method according to any one of Claims 2 to 5, which includes the following steps: using a position detection unit to detect the position of the driving object in the main scanning direction, and sending it to the control camera for shooting at the point in time when the shooting is performed Steps of the timing control unit; and the imaging timing control unit is to cause the camera to perform imaging at a timing corresponding to the position of the driving object received from the position detecting unit in the main scanning direction, thereby The step of photographing the alignment mark of the above-mentioned substrate; the above-mentioned position detection part and the above-mentioned photographing time point control part are arranged in the same integrated circuit. The exposure method according to any one of claims 2 to 5, further comprising the following steps: The step of detecting the position of the driving object in the main scanning direction by the position detection unit, and sending it to the correction timing control unit controlling the timing when the driving mechanism executes the first straightness correction operation; the correction timing control unit is to cause the driving mechanism to perform the first straightness correction operation at a time point corresponding to the position of the driving object in the main scanning direction received from the position detection unit, and the position detection unit and the correction time point control The parts are arranged in the same integrated circuit. The exposure method according to any one of claims 2 to 5, wherein, for the substrate, a plurality of different exposure positions are set along the sub-scanning direction, and different positions are set in the sub-scanning direction corresponding to the plurality of exposure positions respectively Between a plurality of sub-scanning positions, the position of the driving object is changed by the driving mechanism, and the first main-scanning drive, the first straightness correction operation, and the exposure operation are repeatedly executed, for each of the plurality of sub-scanning positions Or set the above-mentioned first straightness correction information, in the above-mentioned first straightness correction operation, based on the above-mentioned first straightness correction information set for the above-mentioned sub-scanning position where the above-mentioned driving object is located, correct the above-mentioned driving object in the above-mentioned sub-scanning direction position on the The exposure method according to any one of claims 2 to 5, wherein, for the substrate, a plurality of different exposure positions are set along the sub-scanning direction, and different positions are set in the sub-scanning direction corresponding to the plurality of exposure positions respectively Between a plurality of sub-scanning positions, the position of the above-mentioned driving object is changed by the above-mentioned driving mechanism, and the above-mentioned first main scanning driving, the above-mentioned first alignment correction operation and the above-mentioned exposure operation are repeatedly performed, The above-mentioned first straightness correction information is set for each of a plurality of different setting positions in the above-mentioned sub-scanning direction. The above-mentioned first straight correction information set at the above-mentioned set position closest to the above-mentioned sub-scanning position where the above-mentioned driving object is located among the plurality of set positions, or correcting the position of the above-mentioned driving object in the above-mentioned sub-scanning direction by linear interpolation , the above-mentioned linear interpolation uses the above-mentioned first true straightness correction information set for the above-mentioned set position closest to the above-mentioned sub-scanning position where the above-mentioned driving object is located, and the above-mentioned sub-scanning position for the second closest to the above-mentioned driving object. The above-mentioned first truth correction information set at the above-mentioned setting position. The exposure method according to claim 1, wherein the correction operation includes a first yaw correction operation, and the first yaw correction operation is based on the first yaw correction information, using the above-mentioned The driving mechanism corrects the amount of rotation of the driven object in the yaw direction, and the first yaw correction information indicates the first yaw correction amount for correcting the amount of rotation of the driven object in the yaw direction. The exposure method according to claim 10, further comprising the step of executing a first correction information formulation operation, the first correction information formulation operation is based on the above-mentioned main scanning direction in the above-mentioned first moving range by the above-mentioned driving mechanism The above-mentioned first yaw correction information is formulated as a result of calculating the rotation amount in the above-mentioned yaw direction of the above-mentioned moving driving object; In the first yaw correction operation, the rotation amount of the driven object in the yaw direction is corrected based on the first yaw correction information prepared in the first correction information preparation operation. The exposure method according to claim 11, wherein, in the above-mentioned first correction information formulation operation, the following steps are performed: the step of installing a yaw measuring device on the exposure device equipped with the above-mentioned platform, the above-mentioned exposure head, and the above-mentioned driving mechanism, the yaw measurement The device uses a laser interferometer to measure the rotation amount of the above-mentioned platform in the above-mentioned yaw direction; the step of performing the first yaw measurement, the above-mentioned first yaw measurement system, for the above-mentioned driving object by using the above-mentioned driving mechanism The amount of rotation in the yaw direction of the driven object driven in the main scanning direction and moved in the first moving range is measured by the yaw measuring device, and the position of the driven object in the main scanning direction is obtained. Corresponding to the amount of rotation in the above-mentioned yaw direction; and formulating the above-mentioned first yaw correction information based on the result of the above-mentioned first yaw measurement. The exposure method according to any one of Claims 10 to 12, wherein, before performing the above-mentioned exposure operation, the following steps are provided: the step of performing the second main scanning drive, and the above-mentioned second main scanning drive system is realized by using the above-mentioned driving mechanism. Drive the driving object in the main scanning direction, move the driving object in the second moving range in the main scanning direction, and make the substrate relatively pass through the imaging range of the camera along the main scanning direction; execute the second yaw The steps of the correction operation, the above-mentioned second yaw correction operation system, based on the second yaw correction information, use the above-mentioned driving mechanism to correct the upper The amount of rotation of the driven object in the above-mentioned yaw direction, the second yaw correction information is used to correct the rotation of the driven object in the above-mentioned yaw according to the position of the above-mentioned driven object in the above-mentioned main scanning direction within the second moving range The second yaw correction amount of the rotation amount in the shake direction; and the step of executing the alignment mark acquisition operation, the alignment mark acquisition operation is by using the above-mentioned camera to take pictures during the execution of the above-mentioned second main scanning drive through the above-mentioned The alignment mark of the above-mentioned substrate in the shooting range, and the image of the alignment mark is photographed, so as to obtain the position of the above-mentioned alignment mark shown in the above-mentioned alignment mark image; in the above-mentioned exposure operation, according to the above-mentioned alignment mark acquisition operation The acquired positions of the alignment marks are used to adjust the pattern of the light irradiated from the exposure head to the substrate. The exposure method according to claim 13, further comprising a step of executing a second correction information formulation operation, the second correction information formulation operation is based on the above-mentioned main scanning direction in the above-mentioned second moving range by the above-mentioned drive mechanism The above-mentioned second yaw correction information is formulated as a result of calculating the rotation amount in the above-mentioned yaw direction of the moving above-mentioned driving object; in the above-mentioned second yaw correction operation, it is formulated in the operation based on the above-mentioned second correction information The rotation amount of the driving object in the above-mentioned yaw direction is corrected by using the above-mentioned second yaw correction information. The exposure method according to claim 14, wherein, in the above-mentioned second correction information formulation operation, the following steps are performed: the step of installing a yaw measurement device on the exposure device equipped with the above-mentioned platform, the above-mentioned exposure head, and the above-mentioned driving mechanism, the yaw measurement The device uses a laser interferometer to measure the amount of rotation of the above-mentioned platform in the above-mentioned yaw direction; A step of performing a second yaw measurement. The second yaw measurement is performed on the yaw of the driven object moving in the second moving range by driving the driven object in the main scanning direction by the driving mechanism. The amount of rotation in the direction is measured by the above-mentioned yaw measuring device, and the position of the driving object in the above-mentioned main scanning direction is obtained and the rotation amount in the above-mentioned yaw direction is correspondingly established; and based on the above-mentioned second yaw The step of formulating the above-mentioned 2nd yaw correction information based on the measurement result. The exposure method according to claim 13, wherein, in the acquisition operation of the alignment mark, the position of the driving object in the main scanning direction is detected by the position detection unit, and the position is sent to the photographing point at which the photographing is performed by the camera. A time point control unit, wherein the shooting time point control unit causes the camera to perform shooting at a time point corresponding to the position of the driving object in the main scanning direction received from the position detection unit, thereby taking pictures of the object. For the quasi-marker, the above-mentioned position detection unit and the above-mentioned shooting time point control unit are provided in the same integrated circuit. The exposure method according to any one of claims 10 to 12, further comprising the step of: detecting the position of the driving object in the main scanning direction by a position detection unit, and sending the position to the first first device controlling the driving mechanism. Steps of the correction time point control unit at the execution time point of the yaw correction operation; the correction time point control unit is at a time point corresponding to the position of the driving object in the main scanning direction received from the position detection unit , causing the above-mentioned driving mechanism to perform the above-mentioned first yaw correction operation, The position detection unit and the correction timing control unit are provided in the same integrated circuit. The exposure method according to any one of claims 10 to 12, wherein, for the substrate, a plurality of different exposure positions are set along the sub-scanning direction, and a plurality of different exposure positions are set in the sub-scanning direction respectively corresponding to the plurality of exposure positions. Between sub-scanning positions, the position of the driving object is changed by the driving mechanism, and the first main-scanning drive, the first yaw correction operation, and the exposure operation are repeatedly executed, for each of the plurality of sub-scanning positions or set the above-mentioned first yaw correction information, in the above-mentioned first yaw correction operation, based on the above-mentioned first yaw correction information set for the above-mentioned sub-scanning position where the above-mentioned driving object is located, correct the above-mentioned driving object in the above-mentioned sub-scanning position position in the scan direction. The exposure method according to any one of claims 10 to 12, wherein, for the substrate, a plurality of different exposure positions are set along the sub-scanning direction, and a plurality of different exposure positions are set in the sub-scanning direction respectively corresponding to the plurality of exposure positions. Between sub-scanning positions, the position of the driving object is changed by the driving mechanism, and the first main-scanning drive, the first yaw correction operation, and the exposure operation are repeatedly performed, for a plurality of different positions in the sub-scanning direction. The above-mentioned first yaw correction information is set for each of the set positions. The above-mentioned multiple set positions are less than the above-mentioned multiple sub-scanning positions. The above-mentioned first yaw correction information set at the above-mentioned set position of the above-mentioned sub-scanning position where the above-mentioned driving object is located, or correcting the above-mentioned driving object in the above-mentioned sub-scanning direction by linear interpolation The above-mentioned linear interpolation uses the above-mentioned first yaw correction information set for the above-mentioned set position closest to the above-mentioned sub-scanning position, and the above-mentioned first yaw correction information set for the above-mentioned set position second closest to the above-mentioned sub-scanning position. 1 Yaw correction information. An exposure device comprising: a stage on which a substrate is placed; an exposure head that irradiates light to an irradiation range; a drive mechanism that drives one of the stage and the exposure head to a main scanning direction; and a control unit, It executes the first main scanning drive while performing the exposure operation; the first main scanning drive system drives the driving object in the main scanning direction by using the driving mechanism, so that the driving object is in the main scanning direction The first moving range is moved, and the above-mentioned substrate is relatively passed through the above-mentioned irradiation range along the above-mentioned main scanning direction; The area extending in the direction of exposure is exposed; and the above-mentioned control part executes a correction operation, which uses the above-mentioned The drive mechanism corrects at least one of the position of the driven object in the sub-scanning direction and the rotation amount of the driven object in the yaw direction. The exposure device according to claim 20, further comprising a memory unit, the memory unit memorizes the first straightness correction information, and the first straightness correction information indicates that it is used for the above-mentioned main scanning according to the above-mentioned driving object within the above-mentioned first moving range The position on the direction to correct the first straightness correction amount of the position of the above-mentioned driving object in the sub-scanning direction, The correction operation includes a first straightness correction operation. The first straightness correction operation is based on the first straightness correction information and uses the driving mechanism to correct the driving object in the sub-scanning direction during the execution of the first main scanning drive. position on the The exposure device according to claim 20, further comprising a memory unit, the memory unit memorizes the first yaw correction information, the first yaw correction information indicates that the above-mentioned driving object in the above-mentioned first moving range is used for the above-mentioned The position in the main scanning direction is used to correct the first yaw correction amount of the rotation amount of the driven object in the yaw direction. The above-mentioned correction operation includes the first yaw correction operation. The first yaw correction operation is based on the above-mentioned first yaw correction operation. 1. Yaw correction information for correcting a rotation amount of the driven object in the yaw direction by the driving mechanism during execution of the first main scanning drive.

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