JP2005345872A - Aligner having aligning function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize an aligner which carries out alignment with high accuracy, according to the deformation of a substrate by irradiating a predetermined position of the substrate surface with light, and simultaneously detecting both of the actual position of a positioning mark preliminarily formed to coincide with the irradiation position and the irradiation position. <P>SOLUTION: A substrate 20, having first and second alignment holes 14, 15, is fixed on a drawing table 18. The drawing table 18 is moved and the exposure surface E of the substrate 20 is irradiated with measuring light from a laser oscillator 25 along one scanning line S. First and second CCD cameras 16, 17 embedded in the drawing table 18 take pictures of the alignment holes and measuring light LM, at the same time from the opposite side of the exposure surface E. As the first and second alignment holes 14, 15 are disposed with the centers to be positioned on the scanning line S of the measurement light, misalignment of the irradiation position of the measurement light from the actual center positions of the alignment holes is detected to carry out alignment, according to deformation of the substrate 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus that draws a predetermined pattern on an object to be drawn. In particular, the present invention relates to an exposure apparatus having an alignment function for correcting the drawing position of a pattern to be drawn on the surface of a substrate.

  Conventionally, a circuit pattern is drawn on a printed circuit board by a photolithography technique. In this case, the object to be drawn is a substrate having a photoresist layer formed on the upper surface, and a circuit pattern is drawn on the photoresist layer on the substrate by the exposure apparatus. And after drawing a pattern, a printed circuit board is obtained by performing various processes.

  The circuit pattern needs to be drawn at a predetermined position on the printed circuit board, but the substrate is deformed minutely by heat treatment or the like. Therefore, by providing positioning marks in advance at predetermined positions such as the four corners on the substrate, measuring the positional deviation of the positioning marks due to the deformation of the substrate in advance, and correcting the positional deviation, the drawing position of the circuit pattern is adjusted.

For example, when a relatively small pattern is assigned to a plurality of areas (hereinafter referred to as drawing areas) on the same substrate, a positioning mark for correcting the position of each drawing area is provided. It is known to correct the drawing position by detecting the shift of the center of gravity of each drawing area and correcting the arrangement of each drawing area on the substrate (see, for example, Patent Document 1).
JP 2000-122303 A (FIGS. 9 and 10)

In addition, data indicating the position of the reference hole (positioning mark) provided on the substrate is transmitted from the host computer to the exposure apparatus in advance, so that the reference hole is quickly opened by the CCD camera as detection means provided in the exposure apparatus. It is known that the time required for the adjustment of the drawing position, that is, the alignment is shortened. (For example, refer to Patent Document 2).
JP-A-8-222511 (paragraph [0029])

It is known that the position of the camera is calculated by providing a scale within the shooting range when the position of the reference hole is detected by shooting with a camera having a moving mechanism. (For example, refer nonpatent literature 1).
Electronic Materials October 2002 (Page 67)

  In the alignment for correcting the drawing data based on the deviation between the actual position of the detected reference hole and the original position in the drawing data by detecting the reference hole or the like provided in the substrate, generally detecting means The measurement error in the detection operation of the reference hole due to is ignored. Even when a scale is provided to calculate the position of the reference hole detecting means, an error may occur in alignment due to deformation of the scale due to a temperature change or the like.

  Therefore, in the present invention, irradiation light is irradiated to a predetermined position on the surface of the substrate, and the actual position of the positioning mark previously provided to coincide with the irradiation position and the irradiation position of the irradiation light are simultaneously detected. An object of the present invention is to provide an exposure position detection apparatus and an exposure apparatus that enable highly accurate alignment according to the deformation of the substrate.

  The substrate position detection apparatus of the present invention is a substrate position detection apparatus of an exposure apparatus that draws a predetermined pattern on a substrate provided with a plurality of positioning marks. The substrate position detection apparatus includes a light source that emits irradiation light, an optical path adjustment unit that adjusts an optical path of the irradiation light, and a mark position detection unit that simultaneously detects the irradiation position of the irradiation light and the position of the positioning mark. A fixed state of the substrate by the table of the exposure apparatus is detected based on the irradiation position and the position of the positioning mark detected by the position detection means.

  The mark position detecting means is, for example, a camera. The positioning mark is preferably an alignment hole penetrating the substrate, and the camera is installed on the opposite side of the exposure surface for drawing a predetermined pattern on the substrate, and the irradiation light passing through the alignment hole can be photographed. preferable.

  The spot of irradiation light is desirably smaller than the diameter of the alignment hole.

  The number of cameras is the same as the number of the plurality of positioning marks, and it is preferable that any one of the positioning marks is included in the shooting range of each camera. In addition, the substrate position detection apparatus further includes, for example, a camera moving unit that moves the camera. In this case, the camera moving unit moves the camera at least more than the number of the positioning marks. Any of the plurality of positioning marks can be photographed.

  The substrate preferably has transparency, and in this case, an alignment hole is unnecessary, and the camera takes an image of the positioning mark shown on the surface of the substrate from the opposite side of the exposure surface, for example.

  The optical path adjusting means preferably scans the irradiation light along a scanning line that is a straight line connecting a plurality of positioning marks.

  Preferably, the substrate position detection device further includes an irradiation position determination unit that determines whether or not the irradiation position and the position of the positioning mark are within a predetermined allowable range. When it is determined that the detected irradiation position and the positions of the plurality of positioning marks are both within the allowable range, the predetermined exposure position that is predetermined as the position for exposing the predetermined pattern is determined as the actual exposure position. When it is determined that the deviation between the irradiation position detected by the mark position detection means and any one of the plurality of positioning marks is not within a predetermined allowable range, based on the positional deviation between the irradiation position and the positioning mark, It is desirable to determine a position different from the predetermined exposure position as the actual exposure position.

  The exposure apparatus of the present invention includes a substrate position detection device, and has a moving means for moving the substrate in a direction different from the direction of a straight line connecting a plurality of positioning marks. In the exposure apparatus, when the irradiation position determination unit determines that the irradiation position detected by the mark position detection unit matches the positions of the plurality of positioning marks, the light scanning unit scans the irradiation light, and the moving unit Moves the substrate and draws a predetermined pattern at a predetermined exposure position. Further, the exposure apparatus corrects a deviation between the irradiation position and the position of the positioning mark when the irradiation position determination unit determines that the irradiation position detected by the mark position detection unit does not coincide with any position of the plurality of positioning marks. The moving means moves the substrate so that a predetermined pattern is drawn at a predetermined exposure position.

  The exposure apparatus preferably further includes a drawing data correction unit that corrects drawing data that is data for drawing a predetermined pattern, and the drawing data correction unit includes the irradiation position detected by the mark position detection unit and the positioning mark. It is preferable to correct the drawing data based on the deviation from the position to obtain corrected drawing data, and to draw a pattern substantially the same as the predetermined pattern at the predetermined exposure position based on the corrected drawing data.

  The drawing data correction means, for example, an intersection angle that is an angle at which a straight line connecting the two positioning marks and a line segment connecting the irradiation positions corresponding to the two positioning marks detected by the mark position detection means, Based on the vector difference between the position of the positioning mark in the drawing data and the corresponding irradiation position detected by the mark position detecting means, the drawing data is corrected to be corrected drawing data.

  Further, the drawing data correction means includes a line segment connecting the two positioning marks in the drawing data together with the intersection angle and the vector difference, and a line segment connecting the irradiation positions corresponding to the two positioning marks detected by the mark position detection means. It is preferable to correct the drawing data based on the size ratio.

  The exposure position detection method of the present invention is an exposure position detection method for detecting a fixed state of a substrate provided with a plurality of positioning marks with respect to an exposure apparatus. The exposure position detection method irradiates irradiation light, adjusts the optical path of the irradiation light to irradiate a predetermined irradiation position on the substrate, detects the irradiation position and the position of the positioning mark simultaneously, and detects the detected irradiation position and positioning. The fixed state of the substrate is detected based on the position of the mark.

  The drawing method of the present invention is a drawing method for drawing a predetermined pattern on a substrate provided with a plurality of positioning marks, irradiating irradiation light, adjusting the optical path of the irradiation light, and predetermined irradiation of the substrate Irradiating the position, detecting the irradiation position of the irradiation light and the position of the positioning mark at the same time, and determining that any deviation between the detected irradiation position and the position of the positioning mark is within a predetermined allowable range, When moving and drawing a predetermined pattern at a predetermined exposure position that is predetermined as an exposure position, and determining that the deviation between the detected irradiation position and one of the positioning marks is not within the allowable range And drawing a predetermined pattern at a predetermined exposure position by moving the substrate in a direction different from the direction of a straight line connecting a plurality of positioning marks so as to correct the deviation between the irradiation position and the position of the positioning mark. And it features.

  According to the present invention, the substrate is based on the actual position of the positioning mark that has been provided so as to coincide with the irradiation position and the irradiation position of the irradiation light. Thus, an exposure position detecting device and an exposure device that enable highly accurate alignment according to the deformation of the substrate can be realized.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view schematically showing an exposure apparatus.

  The exposure apparatus 10 includes a base 11 and a fixed table 29. A drawing table 18 for horizontally supporting the substrate 20 to be exposed is arranged on the base 11. The fixed table 29 is provided with a laser oscillator 25 and an exposure optical system for guiding the laser light LP from the laser oscillator 25 to the drawing table 18. A pair of parallel rails 12 are arranged on the upper surface of the base 11, and the drawing table 18 can be moved on the rails 12 by a table driving unit 13 having a motor. Further, the drawing table 18 is provided with first and second CCD cameras 16 and 17 for photographing the first and second alignment holes 14 and 15 provided in the substrate 20, respectively. The direction perpendicular to the moving direction of the drawing table 18 is defined as the main scanning direction, and the moving direction of the drawing table 18 is defined as the sub-scanning direction.

  The exposure optical system includes a laser oscillator 25 for controlling the irradiation of the laser light LP, an acoustooptic device 28, a polygon mirror 37, an fθ lens 38, and the like. The laser light LP oscillated from the laser oscillator 25 is deflected by the first and second beam benders 26 and 27 and guided to the acoustooptic device 28. After being modulated by the acoustooptic device 28, the laser light LP is guided to the polygon mirror 37 via the lens 32 and the third to sixth beam benders 33 to 36. The laser light LP is deflected by the reflection surface of the polygon mirror 37 and reaches the fθ lens 38. At this time, the polygon mirror 37 deflects the laser light LP along the main scanning direction indicated by the arrow A. The laser light LP that has passed through the fθ lens 38 is guided to the drawing table 18 via the turning mirror 40 and the condenser lens 42. As a result, the laser beam LP is irradiated onto the substrate 20, and a predetermined circuit pattern is formed on the exposure surface E of the substrate 20.

  In the drawing of the exposure apparatus 10, prior to exposure with the laser beam LP for forming a predetermined circuit pattern, whether or not the circuit pattern can be drawn as it is on the substrate 20 as shown below. It is confirmed. This confirmation process is performed to confirm the fixed state of the substrate 20, that is, to confirm the deformation of the substrate 20 due to heat treatment or the like, and the displacement of the fixed position of the substrate 20 with respect to the drawing table 18.

  First, the substrate 20 is fixed at a predetermined position on the drawing table 18. The drawing table 18 moves on the rail 12 toward the fixed table 29, and the first and second alignment holes 14 and 15 are irradiated with measurement light LM (see FIG. 4) that is measurement laser light. Stop at the position where Note that the measurement light LM is the same light as the laser light LP, but for the sake of convenience, the measurement light LM is distinguished from the laser light LP that is irradiated when drawing a circuit pattern.

  In the confirmation step, the laser oscillator 25 oscillates the measurement light LM. The first and second alignment holes 14 and 15 are provided in the substrate 20 in advance so that their centers are on the scanning line S of the measurement light LM. Here, the first and second alignment holes 14 and 15 are provided at both ends of the scanning line S. To position. The position where the center of the first and second alignment holes 14 and 15 should be, that is, the substrate 20 was not deformed at all, and the measurement light LM was not displaced at the fixed position of the substrate 20 with respect to the drawing table 18. In this case, the exposure optical system adjusts the optical path of the measurement light LM while the acousto-optic device 28 controls on / off of the measurement light LM so that the light is irradiated only to the point where the center of each alignment hole is located. To do.

  The first and second CCD cameras 16 and 17 photograph the measurement light LM and the first and second alignment holes 14 and 15 simultaneously, respectively. If the irradiation position of the measurement light LM and the center positions of the first and second alignment holes 14 and 15 coincide with each other, it is determined that the deformation of the substrate 20 is sufficiently small and the circuit pattern can be drawn as it is. In this case, the process proceeds to an exposure process for pattern drawing. On the other hand, if there is a large gap between the alignment holes and the irradiation position of the measurement light LM, it is determined that the circuit pattern cannot be drawn as it is, and the process proceeds to the exposure step after a confirmation step for correcting the position of the substrate 20 and the drawing data.

  FIG. 2 is a schematic block diagram of the exposure apparatus.

  The main body control unit 50 controls the exposure apparatus as a whole, and the memory 56 of the main body control unit 50 stores drawing data for drawing a predetermined circuit pattern. The drawing data includes alignment hole information indicating the positions of the alignment holes necessary for photographing the alignment holes by the first and second CCD cameras 16 and 17 in the confirmation step performed before drawing the circuit pattern. When the user fixes the substrate 20 to the drawing table 18 and instructs drawing of the substrate 20 via an operation panel (not shown), the exposure control unit 53 reads drawing data from the memory 56 based on the instruction signal. .

  The exposure control unit 53 generates a control signal for irradiating the first and second alignment holes 14 and 15 with the measurement light LM based on the alignment hole information, and the acousto-optic element control unit 55 and the polygon mirror control unit 57. And a control signal for photographing each alignment hole and the measurement light LM is transmitted to the CCD camera control unit 52. As a result, the measurement light LM is irradiated by the laser oscillator 25 and the exposure optical system, and the alignment holes and the measurement light LM are photographed by the first and second CCD cameras 16 and 17, respectively.

  The measurement light LM and the imaging results of the first and second alignment holes 14 and 15 are sent as image signals from the first and second CCD cameras 16 and 17 to the data processing unit 54 via the CCD camera control unit 52. . The data processing unit 54 processes the received image signal to calculate the distance between the center of the first and second alignment holes 14 and 15 and the irradiation position of the measurement laser light LM and the direction of the shift. The positional deviation data is sent to the data judgment unit 59.

  As will be described later, the data determination unit 59 transmits a predetermined signal to the exposure control unit 53 or the data processing unit 54 in accordance with the positional deviation data. As a result, in any case, the exposure control unit 53 sets the table so that a predetermined circuit pattern or a circuit pattern substantially identical to the predetermined circuit pattern is drawn at a predetermined position on the exposure surface E. It controls the drive unit 13, the acoustooptic device control unit 55, the polygon mirror control unit 57, and the like.

  If the data judging unit 59 judges that the deformation amount of the substrate 20 is so large that the allowable pattern drawing is impossible even by the movement of the substrate 20 or the correction of the drawing data, it is provided on the surface of the main body control unit 50. A control signal is transmitted to the warning lamp 58, which is turned on. This warning allows the user to take measures such as discarding the substrate 20.

  FIG. 3 is a flowchart showing a confirmation process by the exposure apparatus 10.

  The confirmation process is started when the substrate 20 is fixed on the drawing table 18 and the user instructs drawing. In step S301, the measurement light LM from the laser oscillator 25 is irradiated onto the substrate 20 through the exposure optical system, and the process proceeds to step S302. In step S302, the first and second CCD cameras 16 and 17 photograph the measurement light LM and the first and second alignment holes 14 and 15, respectively, and the process proceeds to step S303. In step S303, the data processing unit 54 calculates misalignment data indicating the misalignment between each alignment hole and the irradiation position of the measurement light LM, and the process proceeds to step S304.

  In step S304, the data determining unit 59 determines whether or not the drawing can be performed as it is based on the drawing data. If the data determination unit 59 determines that the irradiation position deviation is within the allowable range and the positional deviation data is negligibly small, the process proceeds to step S305, where the irradiation position deviation exceeds the allowable range and is based on the drawing data. If it is determined that the drawing cannot be performed as it is, the process proceeds to step S306. In step S <b> 305, the data determination unit 59 transmits a control signal for drawing a circuit pattern based on the drawing data to the exposure control unit 53. Then, it is confirmed that the exposure control unit 53 can draw a predetermined pattern on the substrate 20 by controlling the table driving unit 13, the acoustooptic device control unit 55, the polygon mirror control unit 57, etc. based on the drawing data. The process ends.

  In step S306, it is determined whether or not a predetermined pattern or a pattern substantially identical to the predetermined pattern can be drawn on the substrate 20. That is, the data determination unit 59 determines whether or not a predetermined pattern can be drawn by moving the substrate 20 or correcting the drawing data based on the positional deviation data. If the data determination unit 59 determines that the predetermined pattern can be drawn on the substrate 20, the process proceeds to step S307. If the data determination unit 59 determines that the drawing is not possible, the process proceeds to step S308.

  In step S307, the data determination unit 59 determines whether or not the drawing data needs to be corrected based on the positional deviation data. If the data determining unit 59 determines that the irradiation position deviation exceeds the allowable range but is not so large and that the predetermined pattern can be drawn by the movement of the substrate 20, the process proceeds to step S309, and the deformation amount of the substrate 20 is increased. If it is larger than the predetermined amount and it is determined that the predetermined pattern cannot be drawn by the movement of the substrate 20, the process proceeds to step S310.

  In step S309, the data determination unit 59 moves the substrate 20 and the drawing table 18 relative to the exposure optical system, and controls exposure control for a signal that controls the table driving unit 13 to correct the positional deviation. It transmits to the part 53. That is, based on an instruction from the data determination unit 59, the exposure control unit 53 controls the table drive unit 13 to move or rotate the substrate 20 in the sub-scanning direction by a predetermined amount, and the process proceeds to step S305. In step S305, it is confirmed that a predetermined pattern can be drawn on the substrate 20, and the confirmation process ends.

  In step S <b> 310, the data determination unit 59 transmits a signal for correcting the drawing data based on the positional deviation data to the data processing unit 54. When the data processing unit 54 corrects the drawing data based on an instruction from the data determination unit 59 to obtain corrected drawing data, the process proceeds to step S305. In step S305, based on the corrected drawing data, it is confirmed that a pattern substantially identical to the predetermined pattern can be drawn on the substrate 20, and the confirmation process ends.

  On the other hand, in step S308, the warning lamp 58 is turned on to indicate that the pattern cannot be drawn because the deformation of the substrate 20 is large, and the confirmation process ends.

  FIG. 4 is a cross-sectional view showing a substrate irradiated with laser light. FIG. 5 is a diagram illustrating a shooting range of the first CCD camera 16 when the position of the first alignment hole 14 and the irradiation position of the measurement light coincide with each other. FIG. 6 is a diagram illustrating a shooting range of the first CCD camera 16 when the position of the first alignment hole 14 and the irradiation position of the measurement light do not match.

  The first CCD camera 16 is disposed on the drawing table 18 so as to be positioned directly below the first alignment hole 14 when the substrate 20 is fixed at a predetermined position on the drawing table 18. And since it is arrange | positioned on the opposite side of the exposure surface E with respect to the board | substrate 20, the 1st CCD camera 16 image | photographs the 1st alignment hole 14 and the measurement light LM after passing the 1st alignment hole 14 simultaneously. Easy to do.

  Further, the spot of the measurement light LM is sufficiently smaller than the diameter D of the first alignment hole 14, and the optical path of the measurement light LM and the optical axis of the photographing optical system of the first CCD camera 16 are both relative to the exposure surface E. And vertical. Therefore, the area occupied by the measurement light LM in the captured image is small, and the irradiation position can be calculated with high accuracy (see FIGS. 5 and 6). The second CCD camera 17 has the same configuration as the first CCD camera 16 and photographs the measurement light LM that has passed through the second alignment hole 15.

  When the substrate 20 is not deformed at all, in the imaging range 46 of the first CCD camera 16, the center C of the first alignment hole 14 and the center of the first spot image 48 indicating the irradiation position of the measurement light LM on the scanning line S are displayed. C ′ matches (see FIG. 5). In this case, it is determined that the substrate 20 is not deformed and the circuit pattern can be drawn as it is, and the circuit pattern drawing process using the exposure optical system is performed.

  Note that the first CCD camera 16 has the center of the shooting range 46 of the first spot image 48 so that the first alignment hole 14 and the first spot image 48 of the measurement light LM are surely included in the shooting range 46. They are arranged so as to coincide with the center C ′. However, when the shooting range 46 is sufficiently wide, the center of the shooting range 46 and the center C ′ of the first spot image 48 do not necessarily coincide with each other.

  On the other hand, when the substrate 20 is deformed, the center C of the first alignment hole 14 does not coincide with the center C ′ of the first spot image 48 of the measurement light LM on the scanning line S (see FIG. 6). In this case, the distance L between the center C of the first alignment hole 14 and the center C ′ of the first spot image 48 is calculated, and depending on whether the distance L exceeds a predetermined allowable range, the first alignment hole 14 It is determined whether or not the position matches the irradiation position of the measurement light LM. If at least one of the centers of the first and second alignment holes 14 and 15 does not coincide with the irradiation position of the corresponding measurement light LM, a predetermined circuit pattern is obtained by adjusting the irradiation position of the laser light LP or the like. A substantially the same pattern as that is formed on the substrate 20.

  The second CCD camera 17 displays the second alignment hole 15 and a second spot image 49 (not shown here) showing the irradiation position of the measurement light LM irradiated so as to coincide with the second alignment hole 15. The image is taken in the same manner as the first CCD camera 16.

  7 to 9 are diagrams schematically showing the deformed substrate 20, and the displacement of the position of each alignment hole with respect to the substrate 20 is exaggerated as compared with the case where it actually occurs. FIG. 7 is a diagram illustrating a substrate 20 in which the distance between two alignment holes is correct although the position of one alignment hole is shifted.

  As a result of the analysis of the misalignment data, the position of the first alignment hole 14 and the position of the first spot image 48 match, but the position of the second alignment hole 15 and the position of the second spot image 49 slightly match. If the distance between the two alignment holes is correct, the data determination unit 59 determines that the shift can be corrected by the rotation of the substrate 20. Then, based on an instruction from the data determination unit 59, the exposure control unit 53 rotates the substrate 20, that is, the drawing table 18 about the first alignment hole 14 by a predetermined rotation angle θ. To control. The rotation angle θ is calculated by the data processing unit 54 as an angle at which the line segment connecting the center of the first alignment hole 14 and the measured center of the second alignment hole 15 intersects the scanning line S. Is done.

  In addition, when the deviation between the original position of the second alignment hole 15 and the irradiation position of the measurement light LM is large and a predetermined pattern cannot be drawn due to the rotation of the substrate 20, a predetermined circuit is fixed while the substrate 20 is fixed to the position as it is. The data processing unit 54 generates corrected drawing data based on the rotation angle θ so that the pattern can be drawn.

  FIG. 8 is a diagram illustrating the substrate 20 in which the positions of the two alignment holes are shifted.

  A slight shift between the position of the first alignment hole 14 and the position of the first spot image 48 and a slight shift between the position of the second alignment hole 15 and the position of the second spot image 49 are both in the sub-scanning direction. If they are in line and are equal in size, the data determination unit 59 determines that two displacements can be corrected by the movement of the substrate 20. Then, based on an instruction from the data determination unit 59, the exposure control unit 53 moves the substrate 20 by a vector difference (arrow B) indicating a deviation between each alignment hole and the irradiation position of the measurement light LM. The drive unit 13 is controlled. A predetermined circuit pattern is drawn on the substrate 20 by the exposure process after the movement of the substrate 20.

  If the predetermined pattern cannot be drawn due to the movement of the substrate 20, the data processing unit 54 corrects the drawing data so that the drawing position of the pattern is moved by the vector difference indicated by the arrow B, and the corrected drawing data is obtained. Generate.

  FIG. 9 is a diagram illustrating the substrate 20 in which the position of one alignment hole is displaced and the distance between the two alignment holes includes an error.

As illustrated in FIG. 9, the position of the first alignment hole 14 and the position of the first spot image 48 match, but the position of the second alignment hole 15 and the position of the second spot image 49 are along the scanning line S. In the case of deviation, the data determining unit 59 determines that the drawing data needs to be corrected. This is because the size ratio of the pattern to be drawn cannot be corrected depending on the movement of the substrate 20. In this case, based on an instruction from the data determination unit 59, the data processing unit 54 determines the length of the scanning line S, that is, the length of the line segment connecting the centers of the first and second spot images 48 and 49 in the drawing data. and F _1, to correct the actually detected drawing data based on the size ratio between the line segment length F ₂ connecting the centers of the first and second alignment holes 14 and 15 are, for generating a corrected drawing data .

  The deformation of the substrate 20 is often complicated in practice, and the movement of the substrate 20 or the correction of the drawing data is performed by combining the patterns described so far. For example, the movement of the substrate 20 in the sub-scanning direction and the correction of the drawing data are used together.

  As described above, according to the present embodiment, the alignment hole provided in the substrate 20 and the measurement light LM that has passed through the alignment hole are simultaneously photographed and detected, thereby suppressing an error in measurement of misalignment. Precision alignment is possible.

  The number of alignment holes is not limited to the present embodiment as long as it is plural. For example, the alignment holes may be provided at four corners of the substrate 20. Then, by using the same number of CCD cameras as the number of alignment holes, it is not necessary to move the CCD camera, and quick photographing and high-accuracy irradiation position detection are possible. However, the first and second CCD cameras 16, 17 May be mobile. In this case, moving means for moving the CCD camera to a predetermined shooting point is required, but shooting with a smaller number of CCD cameras than the number of alignment holes becomes possible.

  The mark position detection means is not limited to a CCD camera. Further, in order to capture the measurement light LM as a spot image and detect the irradiation position with high accuracy, the optical path of the measurement light LM and the optical axes of the imaging optical systems of the first and second CCD cameras 16 and 17 are parallel. Is preferred. Therefore, the first and second CCD cameras 16 and 17 are preferably photographed from the opposite side of the exposure surface E so that the exposure optical system that irradiates the measurement light LM does not become a three-dimensional obstacle, but the measurement light LM As long as the irradiation position on the exposure surface E and the alignment hole can be simultaneously photographed, the image may be photographed from the upper side of the substrate 20, that is, from the exposure surface E side.

  Further, when the substrate 20 is made of glass or the like and has transparency, a positioning mark may be represented on the exposure surface E. In this case, the first and second CCD cameras 16 and 17 simultaneously photograph the measurement light LM that has passed through the substrate 20 without an alignment hole and the positioning mark on the exposure surface E.

  Irradiation light and measurement light for drawing a circuit pattern are not limited to laser light, and may be different types of light. Further, the exposure optical system is not limited to this embodiment. Therefore, for example, an LED may be used as the light source, and a DMD may be used as the exposure modulation means. In this case, the measurement light is irradiated only to a predetermined irradiation position that should coincide with the positioning mark, the alignment hole, or the like by the control of the micromirror.

  When the error between the pattern drawn by the movement of the substrate 20 or the correction of the drawing data after the irradiation of the measuring light LM and the pattern to be drawn is expected to be sufficiently small, the irradiation of the measuring light LM is repeated. Instead, you may transfer to the exposure process.

1 is a perspective view schematically showing an exposure apparatus. It is a schematic block diagram of an exposure apparatus. It is a flowchart which shows a confirmation process. It is sectional drawing which shows the board | substrate irradiated with the laser beam. It is a figure which shows the imaging | photography range of a CCD camera when the position of an alignment hole and the irradiation position of measurement light correspond. It is a figure which shows the imaging | photography range of a CCD camera when the position of an alignment hole and the irradiation position of measurement light do not correspond. It is a figure which illustrates the board | substrate which the distance between two alignment holes was correct, and only the position of one alignment hole shifted | deviated. It is a figure which illustrates the board | substrate from which the position of two alignment holes has shifted | deviated. It is a figure which illustrates the board | substrate which included the error in the distance between two alignment holes, and the position of one alignment hole shifted | deviated.

Explanation of symbols

10 Exposure device (substrate position detection device)
11 Base 12 rail (moving means)
13 Table drive unit (moving means)
14 First alignment hole (positioning mark)
15 Second alignment hole (positioning mark)
16 First CCD camera (mark position detection means / camera)
17 Second CCD camera (mark position detection means / camera)
18 Drawing table (moving means)
20 Substrate 25 Laser oscillator (light source)
28 Acoustooptic device (optical path adjusting means)
37 Polygon mirror (light path adjustment means)
38 fθ lens (optical path adjustment means)
40 Turning mirror 42 Condenser lens 50 Main body control unit 54 Data processing unit (drawing data correction means)
59 Data judgment part (irradiation position judgment means)
LP laser light (irradiation light)
LM Measuring light (irradiation light)
S scanning line E exposure surface θ rotation angle (crossing angle)

Claims (15)

An exposure apparatus for drawing a predetermined pattern on a substrate provided with a plurality of positioning marks,
A light source that emits irradiation light;
An optical path adjusting means for adjusting the optical path of the irradiation light;
Mark position detection means for simultaneously detecting the irradiation position of the irradiation light and the position of the positioning mark,
A substrate position detection apparatus for an exposure apparatus, wherein a fixed state of the substrate on a table of the exposure apparatus is detected based on the irradiation position detected by the mark position detection means and the position of the positioning mark. .   2. The substrate position detecting apparatus according to claim 1, wherein the mark position detecting means is a camera.   The positioning mark is an alignment hole that penetrates the substrate, and the camera is installed on the opposite side of the exposure surface on which the predetermined pattern is drawn on the substrate, and photographs the irradiation light that has passed through the alignment hole. The substrate position detecting apparatus according to claim 2.   The substrate position detection apparatus according to claim 3, wherein the spot of the irradiation light is smaller than a diameter of the alignment hole.   3. The substrate according to claim 2, wherein the number of the cameras is the same as the number of the plurality of positioning marks, and any one of the positioning marks is included in each imaging range of the cameras. Position detection device.   The number of the cameras is smaller than the number of the plurality of positioning marks, and further includes camera moving means for moving the camera, and the camera moving means moves the camera so that the plurality of positioning marks are The board position detecting device according to claim 2, wherein the board position can be photographed.   3. The substrate position according to claim 2, wherein the substrate has transparency, and the camera images the positioning mark represented on the surface of the substrate from the opposite side of the exposure surface. Detection device.   The substrate position detection apparatus according to claim 1, wherein the optical path adjustment unit scans the irradiation light along a scanning line that is a straight line connecting the plurality of positioning marks. Irradiation position determining means for determining whether or not a deviation between the irradiation position and the position of the positioning mark corresponding to the irradiation position is within a predetermined allowable range;
When the irradiation position determination unit determines that any deviation between the irradiation position detected by the mark position detection unit and the positions of the plurality of positioning marks is within the allowable range, the predetermined pattern is exposed. A predetermined exposure position that is predetermined as a position is determined as a position for actual exposure,
When the irradiation position determination means determines that the deviation between the irradiation position detected by the mark position detection means and any of the plurality of positioning marks is not within the allowable range, the irradiation position and the positioning 2. The substrate position detection apparatus according to claim 1, wherein a position different from the predetermined exposure position is determined as an actual exposure position based on a positional deviation from a mark. An exposure apparatus comprising the substrate position detection apparatus according to claim 9,
Moving means for moving the substrate in a direction different from a direction of a straight line connecting the plurality of positioning marks;
When the irradiation position determination means determines that any deviation between the irradiation position detected by the mark position detection means and the positions of the plurality of positioning marks is within the allowable range, the optical path adjustment means Adjusting the optical path of the irradiation light, the moving means moves the substrate, and draws the predetermined pattern at the predetermined exposure position;
When the irradiation position determination means determines that the deviation between the irradiation position detected by the mark position detection means and any of the plurality of positioning marks is not within the allowable range, the irradiation position and the positioning An exposure apparatus characterized in that the predetermined pattern is drawn at the predetermined exposure position by moving the substrate by the moving means so as to correct a deviation of a mark position. A drawing data correction means for correcting drawing data that is data for drawing the predetermined pattern;
The drawing data correction unit corrects the drawing data based on a deviation between the irradiation position detected by the mark position detection unit and the position of the positioning mark to obtain corrected drawing data, and based on the corrected drawing data, The exposure apparatus according to claim 10, wherein a pattern substantially the same as the predetermined pattern is drawn at the predetermined exposure position.   The drawing data correcting unit intersects the straight line connecting the two positioning marks with the line segment connecting the irradiation positions corresponding to the two positioning marks detected by the mark position detecting unit. The drawing data is corrected to be corrected drawing data based on a vector difference between a corner, the position of the positioning mark in the drawing data, and the corresponding irradiation position detected by the mark position detection unit. The exposure apparatus according to claim 11.   The drawing data correction means includes a line segment connecting the two positioning marks in the drawing data together with the intersection angle and the vector difference, and the irradiation position corresponding to the two positioning marks detected by the mark position detection means. 13. The exposure apparatus according to claim 12, wherein the drawing data is corrected to be corrected drawing data based on a size ratio with a line segment connecting each other. An exposure position detection method for detecting a fixed state of a substrate provided with a plurality of positioning marks with respect to an exposure apparatus,
Irradiate with irradiation light,
Adjusting the optical path of the irradiation light, irradiating the irradiation light to a predetermined irradiation position of the substrate,
Detecting simultaneously the irradiation position and the position of the plurality of positioning marks,
An exposure position detection method, comprising: detecting the fixed state based on the detected irradiation position and the positions of the plurality of positioning marks. A drawing method for drawing a predetermined pattern on a substrate provided with a plurality of positioning marks,
Irradiate with irradiation light,
Adjusting the optical path of the irradiation light, irradiating the irradiation light to a predetermined irradiation position of the substrate,
Detecting simultaneously the irradiation position and the position of the plurality of positioning marks,
When it is determined that any deviation between the detected irradiation position and the positions of the plurality of positioning marks is within a predetermined allowable range, the position is determined in advance as a position for moving the substrate and exposing the predetermined pattern. Draw at the specified exposure position,
When it is determined that a deviation between the detected irradiation position and any one of the plurality of positioning marks is not within the allowable range, the substrate is corrected so as to correct the deviation between the irradiation position and the positioning mark. Is moved in a direction different from the direction of the straight line connecting the plurality of positioning marks, and the predetermined pattern is drawn at the predetermined exposure position.

Images