JP5452889B2 - Drawing device - Google Patents

Description

  The present invention relates to an exposure drawing apparatus that draws an alignment mark at a reference position in a step of forming a pattern on a flat substrate such as an electronic circuit substrate, a glass substrate for a liquid crystal element, or a glass element substrate for a PDP.

  In the exposure drawing apparatus for forming a pattern on a flat substrate, conventionally, an exposure apparatus using a transfer mask has been mainly used for both a contact method in which a transfer mask and a substrate as an object to be exposed are brought into contact with each other and a non-contact method in which the transfer mask is not contacted. . Recently, from the aspect of mask management and maintenance, an exposure drawing device that draws a pattern by directly irradiating the substrate with drawing light without using a transfer mask has emerged on the market, and the demand for the drawing accuracy in this exposure method has increased. Yes.

  The exposure drawing apparatus transmits a pattern to be transferred to the exposure drawing apparatus as drawing data, and the exposure drawing apparatus uses the data to draw drawing light by a DMD (Digital Micro-mirror Device) element that is a spatial light modulation element. It is an apparatus that performs control and draws a pattern on a flat substrate. The exposure drawing apparatus can enjoy the greatest advantage of not using a mask.

  In the exposure drawing apparatus, as a reference when drawing a pattern, an indicator such as a hole of about φ1 mm, a circular pattern of less than φ2 mm, and a cross is provided as an alignment mark in an area near the ridgeline of the substrate to be drawn. However, in the process of applying a resist on the substrate surface, the alignment marks may be covered with the resist, and these indices may not be detected when determining the actual drawing position. For such a case, for example, in the inventions of Patent Document 1 and Patent Document 2, a method of detecting an index has been proposed.

Special table 2004-523101 gazette JP-T-2004-538654

  However, in the manufacturing process of the substrate that draws the pattern on both sides of the substrate, the front side (hereinafter referred to as the first surface) can be drawn while positioning based on the alignment mark, but the back side (hereinafter referred to as the second surface) An alignment mark is not formed, and a substrate that cannot be positioned may be generated when a pattern is drawn on the second surface. In this case, when the pattern is drawn on the first surface, the alignment mark for determining the pattern drawing position on the second surface must be formed on the second surface with the same reference as the pattern position on the first surface. The pattern on the first surface and the pattern on the second surface cannot be matched. That is, problems arise in electrical continuity between both surfaces of the substrate, attachment to equipment, and the like.

  An object of the present invention is to provide a drawing apparatus that draws an alignment mark for position determination for drawing a pattern on a second surface with reference to the first alignment mark on the first surface.

A drawing apparatus according to a first aspect includes a table on which a substrate having a first surface on which a first alignment mark is formed and a second surface opposite to the first surface is mounted, a substrate that moves the substrate in a predetermined direction, and a main light source. and, using the light emitted from the main light source, and a drawing unit for drawing a pattern on the first surface of the substrate on the table, a detecting section for detecting a first alignment mark formed on the first surface, spaced apart from the table Forming a second alignment mark on the second surface using the second light source based on the detection result of the first alignment mark by the detection unit. A section. The mark forming unit has a vertical slide unit that moves the irradiation unit in a direction perpendicular to the surface of the substrate, and moves either one or both of the vertical slide unit and the table to position between the substrate and the irradiation unit. Adjustment is performed to adjust the position of the second alignment mark, and the mark forming unit forms the second alignment mark.
With this configuration, the drawing apparatus can form a second alignment mark on the second surface based on the first alignment mark substrate on the first surface when drawing a pattern on the first surface of the substrate. . For this reason, when drawing a 2nd surface with a drawing apparatus, the pattern of a 2nd surface can be correctly positioned with respect to the pattern of a 1st surface.

In the drawing apparatus according to the second aspect , the mark forming unit further includes a horizontal slide unit that horizontally moves in a direction in which the second light source is inserted below the second surface, and the horizontal slide unit and the vertical slide unit are provided. One or more of the tables are moved to adjust the position between the substrate and the irradiation unit to adjust the second alignment mark formation position, and the mark formation unit forms the second alignment mark.
A third aspect of the drawing apparatus, the substrate is rectangular, along the two sides of the moving direction of the image formation unit is arranged one or more marks forming part, one or more marks formed part along the remaining two sides The second alignment marks are formed on two sides when the table is moved to both ends in a predetermined direction, and the second alignment marks are formed on the remaining two sides when the pattern is drawn by the drawing unit. . As a result, the second surface of the substrate can be accurately positioned.

In the mark forming unit of the drawing apparatus according to the fourth aspect, the vertical slide unit is movable downward from the lower part of the table.
The second light source of the drawing apparatus can be light branched from the main light source. The second light source may be a light emitting diode.

  An exposure drawing apparatus according to the present invention draws a first surface on a substrate on which a pattern is to be drawn on both sides, on which a second alignment mark is not yet formed on the second surface. The second alignment mark on the second surface can be drawn on the basis of the drawing position. Therefore, the drawn second alignment mark on the second surface can be used as an index when the second surface is placed on the exposure drawing apparatus, and the first surface and the second surface can be accurately positioned. It is possible to form the patterns in precise alignment. That is, the exposure drawing apparatus according to the present invention can form the second alignment mark on the second surface with reference to the exposure drawing position on the first surface, so that the exposure drawing pattern on the second surface can be accurately formed.

<< first embodiment >>
Below, the exposure drawing apparatus 100 of this invention is demonstrated. FIG. 1 is an overall perspective view of the exposure drawing apparatus 100. However, in order to explain the optical system of the exposure drawing apparatus, a part thereof is cut to show the internal structure.

<Configuration of exposure drawing apparatus 100>
In the exposure drawing apparatus 100, two housing side portions 12 that support two optical systems 20 based on the housing bottom portion 11 are respectively connected to the side portions of the housing bottom portion 11. An exposure drawing unit 30 is disposed between the case side part 12 and the case side part 12. Two slides 13 are installed on the front surface of the exposure drawing unit 30, and an alignment camera AC is installed on each slide 13. A moving table 15 is installed on the housing bottom 11, and the moving table 15 is movable in the X-axis direction of the housing bottom 11. Then, the substrate SW is placed on the moving table 15. On the moving table 15, mark forming portions 40 (40s, 40f) for forming second alignment marks are installed at a plurality of locations. The moving table 15 is capable of moving the substrate SW precisely in the X-axis direction of the housing by, for example, a linear motor moving means. The moving table 15 may use not only a linear motor moving means but also a moving means constituted by a ball screw, a slide way, a screw driving motor, and the like. Any moving mechanism may be used as long as it can control movement and accurately reflect the current position. The exposure drawing apparatus 100 is controlled by the exposure drawing control unit 90 and controls the moving table 15, the optical system 20, the exposure drawing unit 30, the mark forming unit 40, the alignment camera AC, and the like.

  The light source unit 20 includes two light source units 20a and 20b having the same internal configuration. Since the light source unit 20a and the light source unit 20b have the same configuration, the light source unit 20a will be described as a representative.

  The light source unit 20a includes a UV lamp 21, a first total reflection mirror 22, a condenser lens 23, a second total reflection mirror 24, a fly-eye lens 25, and an aperture (not shown). The light source unit 20 a includes a UV lamp 21, and ultraviolet light UV in which various wavelengths from 365 nm to 440 nm are mixed is emitted from the UV lamp 21.

  The ultraviolet light UV emitted from the UV lamp 21 is irradiated in the celestial direction (+ Z-axis direction) by the elliptical mirror 26, changed in the horizontal direction by the first total reflection mirror 22, and condensed by the condenser lens 23, The second total reflection mirror 24 changes the direction to the ground direction (−Z axis direction). The ultraviolet light UV whose direction is changed enters the exposure drawing unit 30 through the fly-eye lens 25 and the aperture.

  The ultraviolet light UV incident on the exposure drawing unit 30 becomes a four-branched beam. The beam is further controlled by being incident on eight DMD (Digital Micro-mirror Device) elements 34 via eight first projection lenses 32 and eight reflecting mirrors 33. The controlled beam passes through the second projection lens group 35, adjusts the magnification of exposure drawing to be projected, and irradiates the substrate SW. That is, the exposure drawing apparatus 100 can control the ultraviolet light UV of the light source unit 20a and the light source unit 20b in accordance with drawing data in which a desired exposure image is stored in advance.

The alignment camera AC is movable in the direction (Y-axis direction) perpendicular to the movement direction (X-axis direction) of the substrate SW, and moves along the slide 13. The slide 13 moves the alignment camera AC by linear motor driving or stepping motor driving. The alignment camera AC detects the position of the substrate SW by detecting the first alignment mark of the substrate SW on the first surface. In this embodiment, the alignment cameras AC are installed at two locations. However, when the drawing pattern of the exposure image of the substrate SW is fine, three or more locations may be provided.

  FIG. 2 is a top view of the moving table 15. The moving table 15 is provided with a suction unit (not shown) for fixing the substrate SW by suction. The suction unit is, for example, a vacuum hole for vacuum suction, and is an electrostatic chuck for electrostatic suction. In addition, as shown in FIG. 2, the moving table 15 has a plurality of cutout portions 14 formed around the moving table 15. The exposure drawing apparatus 100 draws the second alignment mark on the second surface of the substrate SW by inserting the mark forming portion 40 into the cutout portion 14. Further, the moving table 15 is provided with one or more pins 18 on at least two sides of the moving table 15. The substrate SW transported to the exposure drawing apparatus 100 can be placed at the reference position (predetermined position) by being placed so as to contact the pins 18. The two sides of the moving table 15 of this embodiment form pins 18 at portions that contact the substrate front part SWf and one of the substrate side parts SWs.

<Configuration of Mark Forming Unit 40>
FIG. 3 is a top view of the exposure drawing apparatus 100 and shows the position of the mark forming unit 40 arranged on the bottom 11 of the housing. The mark forming unit 40 is individually controlled, and the drawing timing of the second alignment mark on the second surface of the substrate SW is different in the substrate front part SWf, the substrate side part SWs, and the substrate rear part SWb.

  For example, the mark forming part 40 arranges four mark forming parts 40f in order to form the second alignment mark on the substrate front part SWf. Further, the mark forming part 40 has two mark forming parts 40s arranged to form the second alignment mark on the substrate side part SWs, and four mark forming parts to form the second alignment mark on the substrate rear part SWb. The part 40b is arranged.

  As shown in FIG. 3, the mark forming part 40f is provided with support posts 16 at two locations from the bottom of the casing 11 toward the ceiling (+ Z axis direction) in order to support one or a plurality of mark forming parts 40f. A bracket 17 is installed so as to bridge the two columns 16.

  One or a plurality of mark forming portions 40f can be attached to the bracket 17, the position thereof can be moved, and the position of the mark forming support portion 40f can be changed by the substrate. The attachment position of the mark forming unit 40f may be moved by a driving device for each substrate, but may be a mechanism that moves manually if the frequency of position adjustment is low. Similarly, the mark forming part 40s and the mark forming part 40b are attached to the support column 16 and the bracket 17.

  4 shows a perspective view of the mark forming portion 40f of FIG. 3 as viewed from the substrate rear SWb direction, FIG. 5 (a) is a side view of FIG. 4, and FIG. 5 (b) is a front view of FIG. is there. FIG. 5A illustrates the substrate SW and the movement table 15 so that the positional relationship between the mark forming unit 40f and the substrate SW and the movement table 15 can be understood. Hereinafter, the mark forming portion 40f will be described with reference to FIGS. The mark forming part 40f, the mark forming part 40s, and the mark forming part 40b have the same structure.

  The mark forming portion 40f includes a support portion 41, a horizontal slide 42 that can slide in the horizontal direction (X-axis direction and Y-axis direction), a vertical slide 43 that can move in the vertical direction (Z-axis direction), a vertical guide 44, and an LED. (Light Emitting Diode) 45, a lens 47 that collects light from the LED 45, and a block 46 that incorporates the LED 45. As will be described later, the horizontal slide 42 of the mark forming unit 40s differs from the horizontal slide 42 of the mark forming unit 40f or the mark forming unit 40b in that it has a long stroke in the Y-axis direction. In order to prevent the block 46 of the mark forming unit 40s from interfering with the moving table 15 when the moving table 15 is moved, the horizontal slide 42 of the mark forming unit 40s has a long stroke in the Y-axis direction. .

  The horizontal slide 42 is a horizontal movement mechanism that can move the block 46 containing the LEDs 45 in the horizontal direction using the mark forming portion support portion 41 as a guide. As shown in FIG. It can be inserted on the second surface side.

  The vertical slide 43 is a vertical movement mechanism that can vertically move the block 46 containing the LED 45 along the vertical guide 44, and can focus the irradiation light of the LED 45 on the second surface of the substrate SW.

  As shown in FIG. 5B, the block 46 and the vertical slide 43 are connected by a clamper 48. Blocks 46 having different sizes and blocks 46 having different arrangements of the LEDs 45 forming the second alignment marks can be easily connected by the clamper 48. At the tip of the block 46, light emitted from the LED 45 is attached so as to face the ceiling direction (+ Z axis direction). The shape of the block 46 surrounds the LED 45 to protect the LED 45 from contact with and impact from other parts.

  The irradiation light of the LED 45 is ultraviolet light UV, and can be easily controlled on and off. Further, the irradiation light of the LED 45 is condensed by the lens 47, whereby a second alignment mark can be formed on the second surface of the substrate SW. In this case, the second alignment mark has a circular shape or a cross shape, and the second alignment mark having a diameter of about 0.5 mm to about 1 mm can be formed by condensing with the lens 47.

  FIG. 6 is an enlarged view of the mark forming portion 40f on the substrate front portion SWf side shown in FIG. 3, and shows two mark forming portions 40f. FIG. 6 is a view showing a position where the substrate SW moves horizontally (in the X-axis direction) toward the mark forming portion 40f and forms a second alignment mark on the second surface of the substrate SW.

As shown in FIG. 6, the exposure drawing apparatus 100 sucks and fixes the substrate SW conveyed from the direction of the arrow in contact with the plurality of pins 18 at a predetermined position. As the moving table 15 moves, the alignment camera AC detects a first alignment mark already formed on the first surface of the substrate SW.

After the alignment camera AC detects the first alignment mark, the exposure drawing apparatus 100 forms the second alignment mark on the second surface of the substrate before, during and after the exposure drawing process on the first surface.
That is, the four mark forming portions 40b on the rear substrate SWb form the second alignment marks when the moving table 15 comes to the moving end (final end) of the broken moving table 15 ′ shown in FIG. To do.

The two mark forming portions 40s on the substrate side portion SWs form the second alignment marks when the moving table 15 moves to a predetermined position during exposure drawing. The blocks 46 of the two mark forming portions 40 s move in the Y-axis direction and enter the cutout portions 14 on the side surfaces of the moving table 15 to form second alignment marks.
The four mark forming portions 40f of the front substrate portion SWf receive the second alignment marks when the moving table 15 comes to the moving end (front end or near side) of the moving table 15 shown by the solid line in FIG. Form.

  Note that, among substrates that are not drawn at all, there are substrates in which the first alignment mark is not formed on the first surface of the substrate SW. For such a substrate SW, the alignment camera AC cannot detect the first alignment mark. However, when the substrate SW is brought into contact with the plurality of pins 18, the substrate SW is roughly positioned at a predetermined position. In this state, a pattern is drawn on the first surface of the substrate SW, and the mark forming unit 40s forms a second alignment mark on the second surface of the substrate SW. Therefore, even if the substrate has no alignment marks on the first surface and the second surface, the alignment marks can be formed on the second surface with the same positional relationship between the first surface and the second surface when the pattern is formed on the first surface. I can do it.

  FIG. 7 shows a flowchart of the exposure drawing apparatus 100 for forming the second alignment mark on the second surface of the substrate SW. The following will be described with reference to a flowchart.

  When the exposure drawing apparatus 100 is activated, the exposure drawing control unit 90 is activated, and initial positions and operations of the movement table 15, the optical system 20, the exposure drawing unit 30, the mark forming unit 40, and the alignment camera AC are confirmed.

  In step S <b> 11, the moving table 15 moving to the front sucks and fixes the transferred substrate SW. That is, the substrate SW is transported by an operator or an external automatic transport means, and can be placed at a predetermined position by contacting the plurality of pins 18 of the moving table 15. The substrate SW placed at a predetermined position is sucked and fixed to the moving table 15.

In step S12, in order to detect the first alignment mark already formed on the first surface of the substrate SW, the exposure drawing control unit 90 moves the moving table 15 from the X axis direction, that is, from the near side to the far side.

In step S13, the alignment camera AC detects a plurality of first alignment marks arranged on the substrate side part SWs while moving the moving table 15 in the X-axis direction. Since the position of the preset first alignment mark is known, the alignment camera AC is moved to a predetermined position in the Y-axis direction by the slide 13. Further, the moving table 15 is temporarily stopped at a position where the alignment camera AC detects the first alignment mark. By detecting three or more first alignment marks, the exact position and rotation direction of the substrate SW can be grasped.

  In step S14, the exposure drawing control unit 90 stops the moving table 15 at the moving end (final end) on the back side (see the broken moving table 15 'shown in FIG. 3). Since the mark forming portion 40b is disposed at the moving end on the back side, the block 46 of the mark forming portion 40b is inserted in alignment with the notch portion 14 of the moving table 15 when stationary at the moving end. Become. Note that the horizontal slide 42 moves the LED 45 in the X-axis direction and the Y-axis direction based on the detection result of the first alignment mark by the alignment camera AC. That is, the horizontal slide 42 moves several millimeters in units of several tens of microns in order to adjust the exact position where the second alignment mark is formed.

  In step S15, the exposure drawing control unit 90 operates the vertical slides 43 of the four mark forming units 40b and raises the block 46 to adjust the focal length with the second surface of the substrate SW.

  In step S16, the exposure drawing control unit 90 turns on the switch of the LED 45 of the mark forming unit 40b in a state where the focal lengths of the LED 45 and the second surface of the substrate SW are matched, and the second alignment is performed by irradiating the ultraviolet light UV. A mark is formed. The exposure drawing control unit 90 turns on the LED 45 for a predetermined time and then turns it off to form a second alignment mark having an appropriate size on the second surface of the substrate SW.

  In step S <b> 17, the exposure drawing control unit 90 lowers the block 46 and returns it to the standby position of the block 46. Thereby, the mark formation part 40b can form the 2nd alignment mark corresponding to the 1st alignment mark of the 1st surface of board | substrate SW on the 2nd surface of board | substrate SW.

In step S18, the exposure drawing control unit 90 moves the moving table 15 from the back side to the front side for exposure drawing by the DMD element 34 of the exposure drawing unit 30. During this exposure drawing, the mark forming unit 40s forms a second alignment mark on the second surface of the substrate SW.

In step S19, the DMD element 34 of the exposure drawing unit 30 draws a pattern from the back side to the front side of the substrate SW. This exposure drawing is scanning exposure which is drawn while the moving table 15 is moving.

In step S20, if the second alignment mark is to be formed at the position where the second alignment mark is to be formed while the moving table 15 is moving forward from the back side, the movement of the moving table 15 is temporarily stopped. The horizontal slide 42 of the mark forming unit 40 s moves the block 46 of the mark forming unit 40 s in the Y-axis direction of FIG. 3 and inserts it into the cutout portion 14 of the moving table 15. Since the horizontal slide 42 of the mark forming unit 40 s has a long stroke in the Y-axis direction, the block 46 is retracted when the moving table 15 is moved to prevent interference with the moving table 15. The horizontal slide 42 can move the block 46 in units of several tens of microns in the X-axis direction.

In step S21, the vertical slide 43 raises the block 46 to adjust the focal length with the second surface of the substrate SW.
In step S22, the exposure drawing control unit 90 turns on the LED 45 of the mark forming unit 40s in a state where the focal lengths of the LED 45 and the second surface of the substrate SW are matched, and irradiates the ultraviolet light UV to thereby perform the second alignment. A mark is formed. The exposure drawing controller 90 turns the LED 45 on for a predetermined time and then turns it off to form a second alignment mark of an appropriate size on the substrate side part SWs on the second surface.

  In step S23, the vertical slide 43 lowers the block 46 of the mark forming unit 40s, and the horizontal slide 42 returns the block 46 in the Y-axis direction, thereby returning to the standby position of the block 46 of the mark forming unit 40s.

  In step S24, the exposure drawing control unit 90 determines whether or not the exposure drawing of the pattern by the DMD element 34 of the exposure drawing unit 30 is finished. In other words, it is determined whether or not the moving table 15 has moved to the front moving end (front end). If the moving table 15 has come to the front moving end, the process proceeds to step S25. If the moving table 15 is still moving, the process returns to step S19 for exposure drawing of the pattern and formation of the second alignment mark.

  In step S25, the moving table 15 stops at the moving end in front. In a state where it is stationary at the moving end, the block 46 of the mark forming portion 40f is inserted in alignment with the cutout portion 14 of the moving table 15. At this time, based on the detection result of the first alignment mark by the alignment camera AC, the horizontal slide 42 moves the LED 45 in units of several tens of microns in the X-axis direction and the Y-axis direction.

  In step S <b> 26, the exposure drawing control unit 90 operates the vertical slides 43 of the four mark forming units 40 f and raises the block 46 to adjust the focal length with the second surface of the substrate SW.

In step S27, the exposure drawing control unit 90 turns on the switch of the LED 45 of the mark forming unit 40f in a state where the focal lengths of the LED 45 and the second surface of the substrate SW are matched, and irradiates the ultraviolet light UV to thereby perform the second alignment. A mark is formed.
In step S <b> 28, the exposure drawing control unit 90 lowers the block 46 and returns it to the standby position of the block 46.

  In the flowchart shown in FIG. 7, the mark forming portion 40f and the mark forming portion 40b move only a few millimeters at the maximum in the X-axis and Y-axis directions, and the front portion of the substrate is based on the first alignment mark on the first surface. Second alignment marks were formed on the second surfaces of SWf and substrate rear part SWb. Further, the horizontal slide 42 of the mark forming part 40s has a long stroke in the Y-axis direction, for example, about 5 cm to 10 cm, and the mark forming part 40s formed the second alignment marks on both sides of the substrate side part SWs.

<< Second Embodiment >>
As described in the first embodiment, it is possible to form the second alignment mark based on the first alignment mark by moving the mark forming portion 40f and the mark forming portion 40b by several mm. However, when the second alignment mark is formed on the substrate side part SWs of the second surface, the horizontal slide 42 of the mark forming part 40s does not have a long stroke in the Y-axis direction. It will interfere with the block 46 of the formation part 40s.

  In the present embodiment, a method of forming the second alignment mark on the second surface of the substrate SW without interfering with the substrate SW without providing the horizontal slide 42 having a long stroke in the Y-axis direction will be described. In the present embodiment, only differences from the first embodiment will be described. The following describes the shape of the housing bottom 11 of the exposure drawing apparatus 100 and the configuration of the mark forming unit 140s, which are different points.

  FIG. 8A is a side view of the mark forming portion 140s that does not have a horizontal movement mechanism, and FIG. 8B is a front view of FIG.

  As shown in FIG. 8A, the mark forming part 140s for forming the second alignment mark of the substrate side part SWs on the second surface is a support part 141 and a vertical slide 143 movable in the vertical direction (Z-axis direction). And a vertical guide 144, an LED 45, a lens 147, and a block 146 containing the LED 45. The mark forming portion 140s is connected to a support column 16 directed from the housing bottom 11 toward the ceiling and a bracket 17 installed so as to bridge the two support columns 16.

  The mark forming portion 140 s has a structure in which the vertical slide 143 has a long stroke in the vertical direction (Z-axis direction), and the block 146 is accommodated in the concave portion 19 formed in the housing bottom portion 11. The recesses 19 to be formed in the block 146 are prepared as many as the number of mark forming portions 140s, and are formed with a depth and size sufficient for the block 146 to be accommodated.

The initial position of the block 146 of the mark forming section 140s is the position of the broken-line block 146 shown in FIG. Normally, the block 146 is at the retracted position so that the movement table 15 does not interfere with the movement. The moving table 15 moves in the X-axis direction (direction penetrating the paper surface) in FIG. At the position where the first alignment mark on the first surface is detected by the alignment camera AC, the mark forming unit 40s can raise the block 146 without interfering with the movement of the moving table 15, so in FIG. As shown, the block 146 is raised to a position where the second surface of the substrate SW is in focus. The block 146 on which the second alignment mark is formed at the raised position is lowered and returned to the retracted position of the block 146.

That is, since step S20 in the flowchart shown in FIG. 7 is not necessary, the process of forming the second alignment mark in the exposure drawing apparatus 100 is reduced, and the working efficiency is increased. When the second alignment mark is formed on the second surface based on the first alignment mark on the first surface, the LED 45 needs to be moved by several tens of microns in the X-axis direction or the Y-axis direction. The moving table 15 is moved or the horizontal slider 42 described above is prepared.

  Similarly, the mark forming portion 40f and the mark forming portion 40b can prevent inadvertent contact with the block 46 by forming the concave portion 19 in the bottom 11 of the casing. A recess 19 corresponding to 40b can also be formed.

<< Third embodiment >>
The light source for drawing the second alignment mark in the first embodiment and the second embodiment uses the LED 45 and the LED 45, but the ultraviolet light UV irradiated by the LED is monochromatic light such as 365 nm and 405 nm. Further, the high-power LED itself is still developing, and its energy is weaker than that of the UV lamp 21 of the light source unit 20 shown in the first embodiment. Since a resist applied to a general substrate SW is formed of a material that responds to a plurality of wavelengths, exposure time becomes longer when an LED that emits a single wavelength is used. For this reason, the ratio of the drawing process time concerning formation of the 2nd alignment mark of a 2nd surface becomes high among the total processing time in an exposure drawing process process.

  In the present embodiment, by using the irradiation light of the UV lamp 21 of the light source unit 20 shown in the first embodiment, the drawing processing time for the second alignment mark on the second surface is shortened, and all the exposure drawing processing steps are performed. Reduce processing time.

  FIG. 9A is a side view of the mark forming unit 240 illustrating a method for introducing the irradiation light of the UV lamp 21 using the optical fiber 242. FIG. 9B is a side view of the mark forming portion 340 showing a method for introducing the irradiation light of the UV lamp 21 without using the optical fiber 242.

  The mark forming unit 240 using the optical fiber 242 includes a support unit 241, a vertical slide 243 that can move in the vertical direction (Z-axis direction), a vertical guide 244, a condenser lens 245, a first reflecting mirror 247, a collecting mirror. The optical lens 245 and the reflecting mirror 247 are fixed and built in a block 248. The mark forming portion 240 is connected to a support column 16 directed from the housing bottom 11 toward the ceiling (+ Z axis direction) and a bracket 17 installed so as to bridge the two support columns 16.

  In the mark forming unit 240, an optical fiber 242 is inserted between the condenser lens 23 and the second total reflection mirror 24 of the light source unit 20a shown in FIG. That is, the ultraviolet light UV emitted from the UV lamp 21 enters the optical fiber 242 via the elliptical mirror 26, the first total reflection mirror 22, and the condenser lens 23. The light incident on the optical fiber 242 is reflected by the first reflecting mirror 247 in the block 248 and then passes through the condenser lens 245. Then, ultraviolet light UV is applied to the second surface of the substrate SW.

  By providing a shutter (not shown) in the middle of the passage path of the optical fiber 242, the exposure drawing apparatus 100 can irradiate the second surface of the substrate SW with ultraviolet light UV under the control of the exposure drawing control unit 90. it can. Thereby, the drawing process time concerning the 2nd alignment mark of the 2nd surface can be equal to the exposure drawing process time of the 1st surface, or can be completed earlier than the exposure drawing process time of the 1st surface. That is, the ratio of the drawing processing time for the second alignment mark on the second surface is reduced in the total processing time in the exposure drawing processing step.

  The mark forming unit 340 shown in FIG. 9B introduces the irradiation light of the UV lamp 21 into the mark forming unit 340 without using an optical fiber.

  The mark forming unit 340 includes a support unit 341, a vertical slide 343 that can move in the vertical direction (Z-axis direction), a vertical guide 344, a condenser lens 245, a first reflection mirror 247, a second reflection mirror 347, A block 348 and a window 349 are included. Further, the mark forming portion 340 is connected to a support column 16 directed from the housing bottom 11 toward the ceiling (+ Z-axis direction) and a bracket 17 installed so as to bridge the two support columns 16. The block 348 fixes the condenser lens 245, the first reflection mirror 247, the second reflection mirror 347, and the window portion 349.

  The mark forming unit 340 is arranged using an optical fiber between the condenser lens 23 and the second total reflection mirror 34 of the light source unit 20a shown in FIG. 1 or near the window 349 using a mirror and a lens. Ultraviolet light UV emitted from the UV lamp 21 is guided. The ultraviolet light UV incident perpendicularly to the window 349 is reflected by the first reflecting mirror 247 and the second reflecting mirror 347, changes its direction, and passes through the condenser lens 245. Then, ultraviolet light UV is applied to the second surface of the substrate SW.

  The ultraviolet light UV is provided with a shutter (not shown) in the middle of the passage route to the mark forming unit 340, so that the exposure drawing apparatus 100 applies ultraviolet light to the second surface of the substrate SW under the control of the exposure drawing control unit 90. UV can be irradiated. Thereby, the drawing process time concerning the 2nd alignment mark of the 2nd surface can be equal to the exposure drawing process time of the 1st surface, or can be completed earlier than the exposure drawing process time of the 1st surface. That is, the ratio of the drawing processing time for the second alignment mark on the second surface is reduced in the total processing time in the exposure drawing processing step.

<< 4th embodiment >>
In the third embodiment, the block 248 and the block 348 are moved vertically. However, by providing the focusing lens 245 and the focusing lens 245 with the focus adjustment mechanism, the mark forming unit 240 and the vertical guide 344 of the mark forming unit 340 are moved. No longer need it. In the present embodiment, a mark forming unit 440 having a focusing mechanism in the condenser lens 245 will be described.

  FIG. 10 shows the mark forming unit 440 of this embodiment. The mark forming unit 440 adds a focus adjusting mechanism to the method of introducing the ultraviolet light UV of the UV lamp 21 of the light source unit 20 shown in FIG.

  The mark forming unit 440 includes an optical fiber 242 that draws ultraviolet light UV, a block 448, a mirror 447, a lens group 445, and a focus control unit 449. The mark forming portion 440 is housed in the recess 19 formed in the housing bottom 11 and is fixed to the housing bottom 11. In the present embodiment, the optical fiber 242 is installed on the housing bottom 11, but a method of drawing from the inside of the housing and the bottom of the recess 19 may be used.

  The ultraviolet light UV of the UV lamp 21 of the light source unit 20 is inserted into the block of the mark forming unit 440 by inserting an optical fiber 242 between the condenser lens 23 and the second total reflection mirror 24 of the light source unit 20a shown in FIG. 448 is guided inside. The ultraviolet light UV irradiated from the optical fiber 242 passes through the mirror 447 and the lens group 445 so that the focal point is adjusted, and is irradiated onto the second surface of the substrate SW. In addition, by providing a shutter (not shown) in the middle of the passage route of the ultraviolet light UV to the mark forming unit 440, the exposure drawing apparatus 100 controls the second surface of the substrate SW under the control of the exposure drawing control unit 90. Ultraviolet light UV can be irradiated.

  The focus adjustment mechanism includes a lens group 445 and a focus control unit 449, and can be adjusted so that the focus is achieved by the distance to the second surface of the substrate SW acquired in advance. The focus adjustment mechanism may have an automatic focus adjustment function.

  FIG. 11 is a perspective view of the moving table 15 used in the present embodiment. The moving table 15 has a window portion 416 for allowing the ultraviolet light UV from the mark forming portion 440 installed on the housing bottom portion 11 to pass therethrough. The window 416 is made of a transparent material such as glass and has a structure that does not interfere with the ultraviolet light UV. Moreover, the window part 416 has penetrated the movement table 15 as shown in FIG.

<< 5th embodiment >>
In the fifth embodiment, the irradiation light is directly introduced into the mark forming unit 540 placed on the moving table 15 to simplify the configuration of the mark forming unit.
FIG. 12 is a side view of the moving table 15 of the fifth embodiment.

  The moving table 15 is provided with evacuation holes 381 for vacuum suction of the substrate SW at regular intervals. The vacuum exhaust hole 381 is connected to an exhaust pump (not shown) outside the moving table 15 via a cavity 382 and a communication pipe 383 provided inside the moving table 15. When the substrate SW is placed on the moving table 15, the environment / atmosphere in the cavity 382 is exhausted to fix the substrate SW.

  One window portion 416 formed in the same manner as the evacuation hole 381 is covered with a transparent plate such as glass. The window portion 416 provided on the moving table 15 is connected to a part of the cavity 382 but does not hinder the vacuum. That is, since the window portion 416 is sealed with a transparent material, the substrate SW is vacuum-sucked to the moving table 15. A first reflecting mirror 247 and a second reflecting mirror 347 are arranged in the lower cavity 382 of the window 416 through which the ultraviolet light UV is transmitted. For this reason, the ultraviolet light UV incident on the window 416 proceeds to the second surface of the substrate SW.

  Accordingly, the ultraviolet light UV emitted from the UV lamp 21 of the arrangement light source unit 20a is input into the cavity 382 of the moving table 15 at the window 416, and the ultraviolet light UV is changed in the traveling direction to the horizontal direction by the first reflecting mirror 247. Further, the second reflection mirror 247 is used to change the vertical and celestial directions. The ultraviolet light UV is applied to the second surface of the substrate SW from the evacuation hole 381 for fixing the substrate SW by evacuation, whereby a second alignment mark can be formed on the second surface.

1 is an overall perspective view of an exposure drawing apparatus 100. FIG. 3 is a top view of the moving table 15. FIG. 2 is a top view of the exposure drawing apparatus 100. FIG. It is a perspective view of the mark formation part 40f. (A) is a side view of the mark formation part 40f. (B) is a front view of the mark formation part 40f. It is the top view which expanded and showed the mark formation part 40f. It is a flowchart of the exposure drawing apparatus 100 which forms an alignment mark. (A) is a side view of the mark formation part 140s. (B) is a front view of the mark formation part 140s. (A) is a side view of the mark formation part 240. FIG. FIG. 6B is a side view of the mark forming unit 340. 4 is a side view of a mark forming unit 440. FIG. 3 is a perspective view of a moving table 15. FIG. It is a side view of the movement table 15 of 5th embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Case bottom part 12 ... Case side part 13 ... Slide 14 ... Notch part 15 ... Moving table 18 ... Pin 19 ... Recessed part 20 ... Optical system (21 ... UV lamp, 22 ... 1st total reflection mirror, 23 ... Condenser lens, 24 ... 2nd total reflection mirror, 25 ... Fly-eye lens, 26 ... Elliptical mirror)
30 ... Exposure drawing unit 32 ... First projection lens 33 ... Reflection mirror 34 ... DMD element 35 ... Second projection lens group 40, 140, 240, 340, 440, 540 ... Mark forming portions 41, 141, 241, 341 ... support portion 42 ... horizontal slides 43, 143, 243, 343 ... vertical slides 44, 144, 244, 344 ... vertical guide 45 ... LED
46, 146, 248, 348, 448 ... block 47 ... lens 48 ... clamper 90 ... exposure drawing control unit 100 ... exposure drawing device 242 ... optical fiber 245 ... condensing Lens 247 ... 1st reflection mirror, 347 ... 2nd reflection mirror 349 ... Window part 416 ... Window part 447 ... Mirror 445 ... Lens group 449 ... Focus control part AC・ ・ Alignment camera SW ・ ・ ・ Substrate SWb ・ ・ ・ Substrate rear SWf ・ ・ ・ Substrate front SWs ・ ・ ・ Substrate side UV ・ ・ ・ Ultraviolet light

Claims (4)

A table on which a substrate having a first surface on which a first alignment mark is formed and a second surface opposite to the first surface is placed, and the substrate is moved in a predetermined direction;
A drawing unit that has a main light source, and draws a pattern on the first surface of the substrate on the table using irradiation light from the main light source;
A detection unit for detecting the first alignment mark formed on the first surface;
An irradiation unit disposed apart from the table and having a second light source, and based on a detection result of the first alignment mark by the detection unit, using the second light source, 2 a mark forming part for forming alignment marks,
The mark forming unit has a vertical slide unit that moves the irradiation unit in a direction perpendicular to the surface of the substrate;
One or both of the vertical slide part and the table are moved to adjust the position between the substrate and the irradiation part to adjust the second alignment mark formation position, and the mark formation part A drawing apparatus, wherein the second alignment mark is formed. The mark forming portion further includes a horizontal slide portion that horizontally moves in a direction in which the second light source is inserted below the second surface,
Move one or more of the horizontal slide part, the vertical slide part, and the table, adjust the position between the substrate and the irradiation part to adjust the second alignment mark formation position, The drawing apparatus according to claim 1, wherein the mark forming unit forms the second alignment mark. The substrate is rectangular, and one or more mark forming portions are arranged along two sides in the moving direction of the drawing unit, and one or more mark forming portions are arranged along the remaining two sides,
The second alignment marks are formed on the two sides when the table is moved to both ends in the predetermined direction, and the second alignment marks are formed on the remaining two sides when a pattern is drawn by the drawing unit. The drawing apparatus according to claim 1, wherein the drawing apparatus is formed.   The drawing apparatus according to any one of claims 1 to 3, wherein the vertical slide portion is movable downward from a lower portion of the table.