KR100947079B1 - Peripheral exposure apparatus of irradiating laser beam and ultraviolet rays and method of manufacturing the same - Google Patents

Abstract

Provided are a laser beam ultraviolet irradiation peripheral exposure apparatus and a method for determining a moving speed of one stage at an appropriate speed.

The laser beam ultraviolet irradiation peripheral exposure apparatus includes a stage 2 for holding the substrate W, and a stage in a rotational direction, a moving direction, and a direction perpendicular to the moving direction, which is a circumference of a vertical line perpendicular to the plane of the substrate. A mobile conveyance mechanism 3 for moving the light source, a laser beam unit 5 provided at a position above the substrate on the movement path of the mobile conveyance mechanism and irradiating a laser beam, and light containing ultraviolet rays in the peripheral region. Either the ultraviolet irradiation unit 9 irradiating from the irradiation port, the first moving speed for moving the stage when irradiating a laser beam, or the second moving speed for moving the stage when irradiating light containing ultraviolet rays; It has a control means 20 which controls a mobile conveyance mechanism accordingly.

Description

Peripheral exposure apparatus of irradiating laser beam and ultraviolet rays and method of manufacturing the same

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view schematically showing the inside of the apparatus in the lateral direction by omitting a part of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 2 is a cross-sectional view schematically showing the inside of the apparatus in the rear direction by omitting a part of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

3A and 3B are plan views illustrating an example of a substrate used in the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

4 is a perspective view showing a stage of a laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 5 is a schematic diagram schematically showing the configuration of a laser beam unit of a laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

6 is a cross-sectional view showing a part of the configuration of an ultraviolet irradiation unit of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 7 is a perspective view schematically showing a part of the case of the entire irradiation area adjustment shutter mechanism of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 8 is an exploded perspective view schematically showing a component part moving in the X-linear direction of the irradiation area adjusting shutter mechanism of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 9 is a sectional view schematically showing a part of a case of the irradiation area adjusting shutter mechanism of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 10 is a block diagram showing the control mechanism of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 11 is a flowchart showing the operation flow of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

12A to 12D are perspective views schematically showing a peripheral exposure work state of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

13A to 13D are perspective views schematically showing a peripheral exposure work state of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

Fig. 14 is a side view schematically showing another configuration of the laser beam unit of the laser beam ultraviolet irradiation peripheral exposure apparatus according to the present invention.

<Description of the code>

One… Laser beam, ultraviolet irradiation peripheral exposure apparatus (this apparatus)

2… Stage 2a... Base part

2b... Support pillar 2c... Suction opening

2d... Positioning mark 3... Mobile transport mechanism

3A... 1st movement guide mechanism

3B... Second moving guide mechanism 3C... Third moving guide mechanism

3a... Linear motor 3b... Moving rail

4… Photographing means 5.. Laser beam unit

5A... Laser beam head 5a... Laser beam light source

5b... Optical path adjusting reflector 6.. Optical path length adjusting unit

6a... Branching means 6b. CCD imaging device

6c... Power meter 7.. Laser irradiation unit

7a... Acoustic optical element 7b... Reflector

7c... Galvano mirror unit 7d.. fθ lens

8… Laser beam measurement adjusting mechanism 8a... Power meter

8b... CCD image sensor 8c... Beam expander

9... Ultraviolet irradiation unit 9c ₁ . Shading plate

9c ₂ ... Driver 9a... Discharge lamp

9b... Elliptical reflector 9c... Optical Shutter Mechanism

9d... Fryeye Lens 9e... Irradiation lens

9k... Case 9m… Investigator

10... Irradiation area adjustment shutter mechanism 10A... Concealment plate moving means (third moving means)

10A ₁ ... First frame body 10A ₂ ... 1st drive motor

10A ₃ . Screw 10A ₄ Moving Base

10A ₅ .. Slide mechanism 10A ₆ .. Guide rail

10A ₇ moving part 10B. Concealed plate moving means (first moving means)

10B ₁ ... Second frame body 10B ₂ ... 2nd drive motor

10B ₃ . Screw 10B ₄ . Moving base

10B ₅ . Slide mechanism 10b ₁ . Frame

1OB ₆ ... Guide rail 1OB ₇ . Moving parts

10C... Concealed plate moving means (fourth moving means)

10C ₂ . Third drive motor 10D... Y direction moving means (second moving means)

1Oa... Plate frame 10b... Plate frame

1 Od... Plate frame 10e... Plate frame

10D ₂ . Fourth driving motor 10D ₃ ... Feed Screw

10D ₄ ... Moving part 11.. Instrument

11a... Roughness Measurement 1lb... Illumination measurement unit moving mechanism

12... Moving mechanism 12a... Linear motor

12b... Guide rail 13.. Irradiation area adjustment shutter mechanism

13a... Width adjusting shading plate 13b. Width adjustment shading plate moving part

15... Laser beam unit 15a... Fiber optic

17... Laser irradiation unit 17b ₁ ... mirror

17b ₂ ... Torsion pin 17b ₃ . York

17a... Reflector 17b... Digital micromirror devices

17c... Lens 20 for beam irradiation. Control mechanism

21... Input means 22. Camera drive control means

23... Image data input means 24. Position detection means

25... Matching means 26. Board position calculation means

27... Mobile transfer mechanism drive control means 28... Laser beam irradiation drive control means

29... Ultraviolet irradiation driving control means 30. Measure

31... Storage means Al... Support frame

B ₁ . Second frame body M... Identification mark

M1... Identification mark M2... Identification mark

T1... Concealment Plate (Pattern Area Concealment Plate)

T2... Concealed plate (first identification mark concealed plate) T3. Concealed Plate (Secondary Identification Mark)

W… Substrate Wp... Pattern area

Wc… Peripheral area b1, c1... Base body

b2, c2... Connection pieces t2b, t3b... Opening

t2c, t3c... Support line portions t2a, t3a... Concealment

The present invention exposes (marks) identification marks such as symbols and characters by irradiating a laser beam to a peripheral region formed around a pattern region of a substrate, and performs peripheral exposure by irradiating light including ultraviolet rays to the peripheral region. A laser beam ultraviolet irradiation peripheral exposure apparatus and its method.

In general, a substrate to which a pattern is exposed in an exposure apparatus is, for example, a size of about 500 mm by 500 mm in a liquid crystal substrate at the time, and a dimension enlarged to a large size of 2160 mm by 2460 mm is currently used. The board | substrate cut | disconnected and separated from each large board | substrate previously set into this large board | substrate, and is mounted in a normal receiver is produced. When the board is cut and separated in a large state, the cutting position identification for determining the separation symbol and the separation position of letters, symbols, or figures, or a combination thereof on the board to be reorganized for management and management of the manufacturing process. A code or alignment mark (hereinafter referred to as an identification mark) is formed by exposing a substrate before separation with a laser beam or the like in advance.

In addition, unnecessary photoresist inks present in the peripheral area around the pattern area in the substrate may be prevented in a later step, and thus need to be exposed in advance. In the peripheral area containing unnecessary photoresist ink, it is necessary to display an identification mark as described above, and this peripheral area is set to a predetermined width. In addition, the position where the identification mark is formed in the peripheral area is not only disposed in the center of the peripheral area but also in some places near the pattern area, in some parts near the edge side of the substrate, or near the opposite pattern area. do.

The substrate is exposed by the peripheral exposure apparatus so that the pattern region is exposed, and then the peripheral region is exposed to remove the unnecessary photoresist ink, and to be easily processed when cut and separated into pieces. See, for example, Patent Documents 1 and 2).

In the manufacturing process of the substrate, there are various exposure apparatuses in the manufacturing line, such as an exposure apparatus for exposing a pattern region, a peripheral exposure apparatus for exposing photoresist ink in a peripheral region, and an exposure apparatus for exposing (displaying) an identification mark. After exposing the pattern area to the exposure apparatus, the laser irradiation exposure apparatus irradiates a laser from the peripheral region of the substrate to mark (exposure) the identification mark, and then the peripheral region of the substrate is subjected to Irradiation with light containing ultraviolet rays is generally performed.

An exposure apparatus for marking an identification mark by laser irradiation performs, for example, the following operation. That is, a laser beam is output from the exposure unit arrange | positioned above the stage which mounted the board | substrate with respect to the place which marks the identification mark formed in the peripheral area of a board | substrate. In order to relatively move the stage on which the substrate is mounted and the exposure unit in a linear direction and orthogonal to orthogonal to the linear direction, they are sequentially scanned in time series, and the irradiation position is moved in the relative movement direction to irradiate the substrate. The identification mark is marked by aligning the point with the plane which becomes a rectangular coordinate (for example, refer patent document 3).

The method of forming the identification mark (display method) is a place where the substrate to which the photoresist ink is applied and the laser beam are always located relatively, exposing dots by the laser beam, and the identification mark is marked with a predetermined width so that the stage The identification mark is exposed while always scanning a small laser beam in the orthogonal direction perpendicular to the linearly moving direction.

Moreover, the exposure apparatus of the structure which sets the shape by changing the magnification of the light emission end of a light guide as a light source for exposing unnecessary photoresist ink of the board | substrate peripheral area | region is proposed (for example, refer patent document 4). The exposure apparatus adopts a method of changing the size of the image projecting the laser beam in the adjustment process, and since the width of the light emitted from the light guide is controlled by enlarging or reducing the optical path projected locally, the exposure light to be irradiated. Is the width that expands or contracts symmetrically about the center of the optical path.

Moreover, the exposure apparatus in which the peripheral exposure unit is provided in at least one guide rail of the fixed guide rail or the moving guide rail provided on the board | substrate is also proposed (for example, refer patent document 5).

[Patent Document 1] Japanese Patent No. 2910867

[Patent Document 2] Japanese Patent No. 3418656

[Patent Document 3] Japanese Patent No. 3547418

[Patent Document 4] Japanese Patent No. 3175059

[Patent Document 5] Japanese Patent No. 3091460

However, in the conventional peripheral exposure apparatus or the exposure apparatus of the identification mark, the following problems exist.

(1) In the manufacturing process of exposing a substrate, the manufacturing line is lengthened as the size of the substrate increases, so that the exposure line of the conventional identification mark and the peripheral exposure apparatus exposing the peripheral area from a separate configuration are integrated. Shortening of is desired.

(2) In the case where the process of exposing the identification mark and the process of exposing the peripheral area are performed successively, the moving speed of the substrate is affected by the exposure speed of either exposure process. At this time, since the photoresist ink is adjusted so as to increase the sensitivity at a wavelength close to that of the ultraviolet ray, the energy of the laser beam is lower than that of the ultraviolet ray and irradiated with a constant illuminance to the substrate moving at a constant speed. Depending on the range of exposing the photoresist ink in the region, the amount of ultraviolet light to be irradiated may be so strong that overexposure may occur, and this problem needs to be solved.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and the laser beam irradiation and the irradiation of light including ultraviolet rays in the peripheral region can be installed in an exposure apparatus having one stage, and the moving speed of one stage is determined at an appropriate speed. A laser beam ultraviolet irradiation peripheral exposure apparatus and a method thereof are provided.

In order to solve the said subject, the laser beam ultraviolet irradiation peripheral exposure apparatus (henceforth this apparatus) which concerns on a 1st viewpoint is a rotation which becomes the periphery of the stage which hold | maintains a board | substrate, and the perpendicular | vertical line of the perpendicular | vertical line orthogonal to the surface of a board | substrate. A moving conveying mechanism for moving the stage in a direction perpendicular to the direction, the moving direction and the moving direction, a laser beam unit provided at a position above the substrate on the moving path of the moving conveying mechanism and irradiating a laser beam, and An ultraviolet irradiation unit provided at a position above the substrate at a position adjacent to the laser beam unit and irradiating light including ultraviolet rays to the peripheral area from the irradiation port, and a first moving speed for moving the stage when irradiating the laser beam; And move in accordance with any one of the second moving speeds for moving the stage when irradiating light including ultraviolet rays. It has a control means for controlling the transmission mechanism.

The apparatus thus constructed can control the stage according to either one of the first moving means for moving the stage when irradiating a laser beam and the second moving speed for moving the stage when irradiating light including ultraviolet rays. have. For this reason, exposure of an identification mark and what is called an ambient exposure can be performed simultaneously, moving a stage. That is, exposure of the identification mark by the laser beam and exposure of the peripheral area by the light containing ultraviolet rays may be performed continuously. The exposure of the identification mark and the exposure of the ultraviolet irradiation can be carried out simultaneously in the peripheral region of each substrate, so that the workability, the improvement in production can be achieved, and the yield can be increased.

Also in the present apparatus according to the second aspect, the ultraviolet irradiation unit has an irradiation area adjusting shutter mechanism that adjusts the irradiation area based on the first moving speed.

The apparatus thus constructed can adjust the irradiation amount of ultraviolet irradiation in accordance with the moving speed of the stage when irradiating the laser beam. That is, since the irradiation area can be adjusted according to the moving speed of the substrate, the exposure operation of the peripheral region of the substrate can be performed without causing excessive exposure or underexposure.

Further, in the present apparatus according to the third aspect, the irradiation area adjusting shutter mechanism includes a width adjusting shading plate that partially shields the irradiation port, and a width adjusting shading plate moving unit that moves the width adjusting shading plate.

This apparatus comprised in this way is moving the width adjustment light shielding plate through the width adjustment light shielding plate moving part, and adjusts the irradiation amount per unit area irradiated from an irradiation port.

Further, in the present apparatus according to the fourth aspect, the laser beam unit is provided with changing means for changing the intensity of the laser beam based on the second moving speed.

The present apparatus configured as described above can adjust the irradiation amount of the laser beam in accordance with the moving speed of the stage when irradiating light containing ultraviolet rays. That is, since the intensity of the laser beam can be adjusted in accordance with the moving speed of the substrate, an identification mark can be formed on the substrate without causing an excessive exposure or underexposure.

Further, in the present apparatus according to the fifth aspect, the changing means is configured such that the intensity of the laser beam is changed by at least one of changing the power to the laser beam, changing the pulse interval of the laser beam, or changing the modulation of the laser beam. Change

The apparatus configured as described above moves the stage without shielding the irradiation port when it is desired to increase the throughput by performing the work of exposing the peripheral area with light containing ultraviolet rays as soon as possible. The intensity of the laser beam can be changed by various methods provided in the laser beam unit to match the moving speed of this stage. Of course, all combinations can change the intensity of the laser beam or any one of them.

Further, the laser beam ultraviolet irradiation peripheral exposure method according to the sixth aspect includes a first calculation step of calculating a first moving speed of a substrate when exposing an identification mark, and a second moving speed of the substrate when irradiating ultraviolet rays. Calculating an intensity of the laser beam based on the first calculation speed and exposing the identification mark to a peripheral area of the substrate, or irradiating an irradiation area of light including ultraviolet rays based on the second moving speed. Determining.

The present method configured as described above can integrally configure the peripheral exposure operation of exposing the identification mark to the peripheral region of the substrate and simultaneously irradiating and exposing light including ultraviolet rays to the peripheral region. In addition, the exposure of the identification mark and the exposure of ultraviolet irradiation can be performed simultaneously in the peripheral region of each substrate, so that the workability, the improvement in production can be achieved, and the yield can be increased.

EMBODIMENT OF THE INVENTION Hereinafter, the laser beam ultraviolet irradiation peripheral exposure apparatus which concerns on this invention, and the best form for implementing the method are demonstrated with reference to drawings.

1 is a cross-sectional view schematically showing the inside of the apparatus in the lateral direction by omitting a part of the laser beam ultraviolet irradiation peripheral exposure apparatus, and FIG. 2 is a device in the back direction omitting a part of the laser beam ultraviolet irradiation peripheral exposure apparatus. 3 is a plan view which shows an example of the board | substrate used with a laser beam ultraviolet irradiation peripheral exposure apparatus, and FIG. 4 shows the stage of a laser beam ultraviolet irradiation peripheral exposure apparatus. Side view.

As shown in FIG. 1, a laser beam ultraviolet irradiation peripheral exposure apparatus (hereinafter referred to as "the present apparatus") 1 includes a stage 2 for holding a substrate W to be loaded, and the stage 2. Photographing means 4 for photographing a predetermined position of the substrate W and the stage 2 held in the chamber, a moving conveyance mechanism 3 for conveying or moving the substrate W held in the stage 2, and The laser beam unit 5 which exposes the identification mark M in the peripheral area Wc which is the periphery of the pattern area Wp of the board | substrate W conveyed by the moving conveyance mechanism 3, and the periphery of the board | substrate W The ultraviolet irradiation unit 9 which shields the identification mark M exposed to the area Wc and irradiates the other peripheral area Wc with light containing ultraviolet rays of a predetermined wavelength (hereinafter referred to as "ultraviolet light"). And a control mechanism 20 for controlling the mobile transport mechanism 3, the laser beam unit 5, and the ultraviolet irradiation unit 9 mainly.

As shown in Figs. 3A and 3B, the substrate W is formed in a quadrangular shape, for example, to form a pattern region Wp in two rows and three columns, and the peripheral region Wc around each pattern region Wp. To form. The peripheral area Wc of the substrate W becomes a cutting table for cutting and separating each pattern area Wp, and at the same time, a symbol, a character, a figure, or a combination thereof (hereinafter referred to as an identification mark). This is the area to be formed. Here, the peripheral marks Wc of the substrate W are formed such that the identification marks M (M1, M2) are formed vertically and horizontally, and the irradiation area of each identification mark M is equal.

As shown in FIG. 1 and FIG. 4, the stage 2 is for holding the board | substrate W, and the base 2a supported by the moving conveyance mechanism 3, and this base 2a A support column 2b provided in the upper surface, a suction opening 2c formed at a position facing the support column 2b and the substrate W, and a positioning mark 2d for detecting the position of the stage 2; ).

The base 2a is formed of a flat rectangular parallelepiped having a plane having an area equal to or greater than the area of the substrate W to be dealt with here, and the plurality of support columns 2b are perpendicular to the plane of the base 2a ( Vertical direction). The base 2a is not particularly limited as long as it can support the plurality of support columns 2b in the vertical direction, for example, to have a disk shape. In addition, the base 2a is provided in advance with the site | part which installs the support pillar 2b detachably in a checkerboard graduation shape, and it can adjust the number and position of the support pillar 2b according to the size of the board | substrate W. Do it.

The support pillar 2b is for holding the substrate horizontally (a plane orthogonal to the vertical direction) in contact with the substrate W, and a plurality of the support pillars 2b are provided at the base 2a at a position having a predetermined height from the base 2a. Since this support column 2b assumes a robot hand (not shown) for carrying in the board | substrate W here, it carries in the state which hold | maintained the back surface of the board | substrate W with two forks (not shown) of a robot hand. When it has been made, a plurality of pieces are arranged and arranged at intervals in which the horizontality of the substrate W can be maintained in a state where a linear space capable of sending and receiving by the fork is provided.

In addition, the support column 2b forms the shape of the front end position which contact | connects the board | substrate W here in planar shape, The adsorption | suction opening part 2c for vacuum-suctioning and holding the said board | substrate W in the planar part. Has) The suction opening 2c is provided in communication with a vacuum suction mechanism (not shown). The suction opening 2c may be formed in all the support columns 2b, or may be formed in the support columns 2b at a predetermined position as long as the substrate W can be held.

The positioning mark 2d is provided on the plane side of the base 2a of the stage 2 so as to correspond to the reference position of the photographing means 4, or is installed along the side of the base 2a (see Fig. 2). It is formed at the tip of a support pillar. This positioning mark 2d is formed of, for example, 10-character marks or the like on the substrate side serving as the tip of the support pillar, and is formed in at least three places. It may be installed in a number corresponding to the number (here 4). In addition, the shape and mounting size of the positioning mark are not particularly limited. In addition, the positioning mark 2d may be disposed inside the substrate surface because the substrate W is transparent. However, if the substrate W is not transparent because the substrate W is covered with a resist ink or the like, of course, the substrate ( It is installed in the stage 2 at the position which becomes the periphery of W).

Since the stage 2 is comprised as mentioned above, it can hold | maintain the board | substrate W by the support column 2b and the base 2a, keeping the plane at the position spaced apart from the base 2a by predetermined space | interval. Therefore, it is not necessary to arrange new loading means, and the board | substrate W, such as a robot hand (not shown), which was not able to be received as it is from the mechanism which conveys between apparatuses is eliminated.

The photographing means 4 is for photographing the predetermined position of the substrate W and the positioning mark 2d of the stage above the substrate W. FIG. The photographing means 4 is provided on the support frame A1 so as to be movable in the X direction and the Y direction by a guide rail or the like (not shown). For example, a CCD camera or the like is used. The photographing means 4 picks up the positioning mark 2d at a preset reference position, and then moves freely in the X direction which is a straight direction and the Y direction which is orthogonal to this X direction, It operates to image a predetermined position which is set in advance on either of the alignment mark or the edge (edge) of the substrate W, and acquires each image data and outputs it to the control mechanism 20 described later.

Then, the matching operation is relatively performed through the mobile transport mechanism 3 by a command from the control mechanism 20 based on the substrate position obtained by analyzing the image data acquired by the photographing means 4 and the stage position. All.

The moving conveyance mechanism 3 performs the matching operation of the substrate W, and conveys the substrate W along the movement path L, and at the time of exposure (at the time of irradiation of the laser beam and the irradiation of ultraviolet light), It moves (W) at a predetermined speed. The moving conveyance mechanism 3 includes a first moving guide mechanism 3A for moving the stage 2 in the X linear direction, which is one linear direction, and a stage (Y) in the Y linear direction, which is a linear direction orthogonal to the X linear direction. 2nd movement guide mechanism 3B which moves 2), and the 3rd movement which moves the stage 2 to the rotation direction ((theta direction) which becomes a vertical line rotation of the perpendicular | vertical line orthogonal to the board | substrate surface hold | maintained at the stage 2). 3 C of guide mechanisms are provided. Further, the first to third moving guide mechanisms 3A to 3C used here are different from the position to be installed, the length of the guide, etc., by moving in the linear direction or by moving the stage 2 in the rotation direction. However, since it has a common structure, the 1st moving guide mechanism 3A is mainly demonstrated.

As shown in Fig. 2, the first moving guide mechanism 3A includes a linear motor 3a having a reacting plate that moves along a magnetic force guide (primary guide) in which the S pole and the N pole are alternately arranged; The moving rails 3b and 3b provided along this linear motor 3a are provided. Although this 1st moving guide mechanism 3A has the structure which provided the moving rails 3b and 3b in the both sides of the linear motor 3a, either one of the moving rails 3b may be sufficient as the said moving rail 3b. Instead, a fluid bearing made of air or the like may be used. The first moving guide mechanism 3A is preferably configured to use the linear motor 3a. However, the first moving guide mechanism 3A may be a moving mechanism such as a servo motor and a feed screw, as long as it can move and control with a certain accuracy. Do not.

The moving conveyance mechanism 3 is rotated in the rotational direction between the first movement guide mechanism 3A for moving the stage 2 in the X linear direction and the second movement guide mechanism 3B for moving the stage in the Y linear direction. Although the 3rd movement guide mechanism 3C which rotates the stage 2 is provided, you may install so that the up-and-down position of the 2nd movement guide mechanism 3B and the 3rd movement guide mechanism 3C may be reversed. When the matching operation | movement of the board | substrate W is performed relatively with this mobile conveyance mechanism 3, it is as follows.

First, the moving transport mechanism 3 moves the stage 2 holding the loaded substrate W to a reference position set in advance by the second moving guide mechanism 3B moving in the Y-direction. Then, the photographing means 4 photographs the positioning marks 2d, 2d, 2d of the stage 2 and sends image data to the control mechanism 20 described later. In addition, the imaging means 4 captures the edge (or alignment mark (not shown)) of the substrate W and sends image data to the control mechanism 20. The control mechanism 20, which will be described later, analyzes the sent image data, compares the substrate position with the stage position, calculates the registration position of the substrate W, and performs the matching operation relatively by moving and controlling the moving transport mechanism 3. Doing. In addition, on the basis of the shape and position of the identification mark M (see Fig. 3), which is the varietal data of the substrate W previously inputted while performing the matching operation, the transfer destination (the exposure position of the laser beam (irradiation start position) You may adjust the position of the stage 2 to the position which can be conveyed by)).

The moving conveyance mechanism 3 performs the matching operation of the substrate W by means of a signal from the control mechanism 20, mainly using the third movement guide mechanism 3C and the second movement guide mechanism 3B. have. Of course, the matching operation of the substrate W may be performed by using the third moving guide mechanism 3C, the second moving guide mechanism 3B, or the first moving guide mechanism 3A. Moreover, after performing a matching operation, it conveys to a predetermined position of the laser beam unit 5 in the X linear direction, and moves to adjust to a exposure position in the Y linear direction using the 2nd movement guide mechanism 3B. You can also

Next, the laser beam unit 5 will be described. As shown in FIG. 1 and FIG. 2, the laser beam unit 5 is for exposing the identification mark M to the peripheral area Wc of the board | substrate W with a laser beam. As shown in Fig. 5, the laser beam unit 5 is supported by the supporting frame A1 and fixed here, and has an optical path length adjusting unit 6 for adjusting the optical path length of the laser beam, and this optical path. The laser irradiation unit 7 which irradiates the peripheral area Wc of the board | substrate W with the laser beam whose optical path length was adjusted by the length adjustment unit 6 is provided. 5 is a schematic diagram schematically showing the configuration of a laser beam unit of the present apparatus. As shown in FIG. 5, the laser beam unit 5 has three laser irradiation units 7 here, branching the laser beam irradiated from one laser beam light source 5a, and each laser irradiation unit It is comprised so that a laser beam may be irradiated to three places of the peripheral area Wc of the board | substrate W from (7).

As shown in Fig. 5, the optical path length adjusting unit 6 includes a CCD imaging element 6b provided through a laser beam light source 5a, an optical path adjusting reflector 5b, and a branching means 6a of the laser beam; A power meter 6c is provided.

In the laser beam light source 5a, a wavelength corresponding to the exposure area of the resist ink applied to the peripheral area Wc of the substrate W is selected. For example, the laser beam light source 5a alternately repeats light emission and extinction at high speed by pulse output. Is used. For this reason, it is possible to vary the integration intensity of the laser beam within a predetermined time (sec) by repeatedly changing the frequency.

The optical path adjustment reflector 5b is provided at a predetermined position to adjust the optical path length of the laser beam irradiated from the laser beam light source 5a until it enters the laser irradiation units 7, 7, 7. The optical path adjustment reflector 5b is provided with a total reflection mirror that totally reflects the laser beam and a branch reflection mirror (beam splitter) that branches and reflects the laser beam at predetermined positions. A branch reflector is provided in the optical path adjusting reflector 5b at a position where the optical path is diverted from the laser beam light source 5a to the first and second laser irradiation units 7, 7. The total reflection mirror is arranged at the position reflected by the unit 7 and other positions. The optical path adjusting reflector 5b is provided at a position where the optical path lengths of the laser beams incident from the laser beam light source 5a into the laser irradiation unit 7 are all equal, and the laser beam light source 5a is first. It is provided in the position reflected by each laser irradiation unit 7 by 2 reflections after reflecting.

In the optical path in the optical path length adjusting unit 6, the CCD imaging element 6b and the power of the laser beam for measuring the irradiation diameter and the irradiation position of the laser beam through branching means 6a such as a beam splitter for splitting the laser beam. The power meter 6c which measures is measured. The measurement result measured here is sent to the control mechanism 20 mentioned later. And the measurement result sent to the control mechanism 20 is reflected in order to adjust the laser beam light source 5a.

As shown in Fig. 5, the laser irradiation unit 7 includes an acoustic optical element 7a for diffracting the laser beam reflected from the optical path adjusting reflector 5b, and a laser beam diffracted by the acoustic optical element 7a. Reflectors 7b and 7b reflecting in a predetermined direction, Galvano mirror unit 7c which deflects and scans the laser beams reflected by the reflectors 7b and 7b, and the laser beam from the galvano mirror unit 7c. Is provided with a f? Lens 7d for irradiating the peripheral area of the substrate W. As shown in FIG. Further, a laser beam measurement adjusting mechanism 8 for measuring and adjusting the laser beam is provided in the optical path from the acoustic optical element 7a of the laser irradiation unit 7 to the f? Lens 7d.

The acoustic optical element 7a diffracts a laser beam, and adjusts the intensity (luminance) of a laser beam by amplitude modulation or frequency modulation. The acoustooptical device 7a may be provided at a position after the optical path is changed by the reflecting mirrors 7b and 7b.

The reflector 7b adjusts the optical path direction of the laser beam, and totally reflects the laser beam here. This reflecting mirror 7b is not particularly limited as long as it can reflect the laser beam.

The galvano mirror unit 7c has a galvano mirror and deflects the laser beam so that the corresponding mark M can be exposed by the laser beam by a signal from the control mechanism 20 to be described later. The beam is deflected. This galvano mirror unit 7c is not limited to the structure which controls a galvano mirror.

The fθ lens 7d can focus and scan a laser beam deflected by the galvano mirror of the galvano mirror unit 7c on a flat surface. This fθ lens 7d is not particularly limited as long as the configuration of the incident mirror, the scanning angle, the scanning range, the telecentricity, and the like correspond to the galvano mirror and the wavelength of the laser beam.

As shown in Fig. 5, the laser beam measurement adjusting mechanism 8 includes a power meter 8a for branching the laser beam from the reflector 7b by branching means such as a beam splitter and measuring the power. A beam expander 8c which performs an operation such as widening the spot diameter or the range of the collimation, and a CCD imaging element 8b which branches the laser beam by branching means and measures the laser beam diameter and irradiation position. The results measured by the laser beam measuring adjustment mechanism 8 are then sent to the control mechanism 20 to be described later, and adjusted so as to be adjusted through the acoustic optical element 7a or the beam expander 8c so as to be in a state of an appropriate laser beam. Is reflected.

The laser beam unit 5 having the above configuration operates as follows. That is, when the substrate is moved to the laser beam irradiation start position, the laser beam light source 5a is turned on to cause the laser beam to pass through the respective laser irradiation units 7 and 7 through the optical path adjusting reflectors 5b of the optical path length adjusting unit 6. To the acousto-optic elements 7a, 7a, 7a, and the galvanomirror units 7c, 7c, 7c and fθ lenses 7d, 7d, 7d from the acousto-optic elements 7a, 7a, 7a. Through the laser beam heads 5A, 5A, and 5A, the laser beam is irradiated to the peripheral region of the substrate W to expose the identification mark M1 (see FIG. 3). At this time, the irradiated laser beam is scanned in a direction orthogonal to the moving direction of the substrate W, and the identification mark M1 is exposed while moving the substrate W at a predetermined speed. In addition, the laser beam unit 5 is a substrate in the range of the amplitude of the laser beam by the galvanomirror units 7c, 7c, and 7c because the installation intervals of the laser beam heads 5A, 5A, and 5A are fixed. It corresponds to the size of (W) or the formation position of the identification mark.

As shown in FIG. 1, FIG. 2, and FIG. 6, the ultraviolet irradiation unit 9 is provided in the position adjacent to the laser beam unit 5 above the movement path | route of the board | substrate W, and the board | substrate W UV light is irradiated to the peripheral area Wc). This ultraviolet irradiation unit 9 is provided with two machines via the moving mechanism 12 so that it can move in the direction orthogonal to the X-linear direction of the board | substrate W here. 6 is sectional drawing which cut | disconnected and showed a part of structure of the ultraviolet irradiation unit of this apparatus.

As shown in FIG. 6, the moving mechanism 12 includes a linear motor 12a and LM guides (moving rails) 12b and 12b in the same manner as the first moving guide mechanism 3A described above. You can do it quickly and precisely.

As shown in Fig. 6, the ultraviolet irradiation unit 9 includes a discharge lamp 9a for irradiating ultraviolet light, an elliptical reflector 9b provided at the discharge lamp 9a for condensing and reflecting light, and the elliptical reflector. The optical path shutter mechanism 9c provided in the optical path collected by the optical path 9b, and the prieye lens 9d provided at the light condensing position of the light from the elliptical reflector 9b in the optical path toward the substrate W rather than the optical path shutter mechanism 9c. ) And the irradiation lens 9e for irradiating the peripheral region Wc of the substrate W to the light passing through the prieye lens 9d as parallel light, and from the irradiation lens 9e. And an irradiation area adjustment shutter mechanism 10 having a configuration of shielding (hiding) at least a part of the light, and an irradiation area adjustment shutter mechanism 13 for changing the irradiation area.

Moreover, the ultraviolet irradiation unit 9 installs each structure of the said discharge lamp 9a etc. in the case 9k, and the irradiation lens 9e in the position which faces the board | substrate W which becomes the lower surface of the case 9k. 9m is provided in the position used as the optical path of the irradiation light from (). Furthermore, the ultraviolet irradiation unit 9 includes a measuring instrument 11 for measuring the irradiation light to irradiate in the case 9k, or the ultraviolet irradiation unit 9 moves to the predetermined position through the moving mechanism 12 and stops. At this time, the measuring instrument 11 is provided at a position that can be measured corresponding to the irradiation port 9m.

The discharge lamp 9a irradiates ultraviolet light (light containing ultraviolet light of a predetermined wavelength) that exposes the resist ink applied to the peripheral area Wc of the substrate W, and is lit by, for example, arc discharge. Mercury lamps are being used.

The elliptical reflector 9b is provided with a curved surface (part of the elliptic rotating curved surface) for condensing the light irradiated from the discharge lamp 9a to a predetermined position. The elliptical reflector 9b may be configured to transmit infrared light and not irradiate the substrate W side.

The optical path shutter mechanism 9c blocks or passes the light from the light source (discharge light 9a and elliptical reflector 9b) and serves as a pseudo light source. The optical path shutter mechanism 9c includes a light shielding plate 9c ₁ that shields (shields) the light path toward the optical path, and a drive unit 9c ₂ that moves the light shielding plate 9c ₁ to an evacuation position away from the optical path or the optical path. . This optical path shutter mechanism 9c moves the light shielding plate 9c ₁ from the optical path to the evacuation position when the peripheral area Wc of the substrate W is exposed and when the irradiation light is measured.

The prieye lens 9d adjusts the illuminance distribution of the light. This prieye lens 9d is a lens group in which a plurality of lenses are arranged in an array, or a plurality of lens groups are arranged in an optical axis direction. This prieye lens 9d is disposed at, for example, a light condensing position of the irradiation light from the light source.

The irradiating lens 9e is for irradiating the peripheral region Wc of the substrate W with the ultraviolet light having passed through the prieye lens 9d and whose illuminance distribution is controlled as parallel light. This irradiating lens 9e may be either a single lens or a compound lens as long as the convex lens is used here, and the light transmitted in the state diffused from the prieye lens 9d can be parallel light.

Next, the structure of the irradiation area adjustment shutter mechanism 10 is demonstrated with reference to FIG.7 and FIG.8. Fig. 7 is a perspective view schematically showing a whole of the irradiation area adjusting shutter mechanism of the present apparatus by cutting a part of the case, and Fig. 8 is a schematic view of a constituent portion moving in the X-linear direction of the irradiation area adjusting shutter mechanism of the present apparatus. This is an exploded perspective view.

The irradiation area adjustment shutter mechanism 10 adjusts the opening width of the irradiation port 9m so that ultraviolet light is not irradiated to the position of the pattern area Wp and the identification mark M of the substrate W. As shown in FIG. The irradiation area adjustment shutter mechanism 10 is composed of three concealed plates (T1 (pattern area concealed plate), T2 (first identification mark concealed plate), T3 (second identification mark concealed plate)), and this concealed plate. Concealed plate moving means 10A (third moving means), 10B (first moving means), 10C (fourth moving means) and Y-direction moving means 10D provided to move (Tl, T2, T3) in a predetermined direction ) (Second moving means). Here, the irradiation area adjustment shutter mechanism 10 controls to move one concealment plate T1 in the Y-linear direction, and to control the movement of the two concealment plates T2 and T3 in the X- and Y-linear directions. have.

The concealment plate moving means 10A is provided in the first frame body 10A ₁ and is provided from the first drive motor 10A ₂ provided in the first frame body 10A ₁ and from the first drive motor 10A ₂ . A transfer screw 10A ₃ for transmitting the rotation of the transfer screw, a movement base 10A ₄ moving along the transfer screw 10A ₃ , and a second frame body 10B described later fixed to the movement base 10A ₄ . A slide mechanism 10A ₅ for sliding ₁ ) is provided.

A first frame member ₍₁ 10A) is disposed in a state in which the fixed portion in the housing (9k) of the UV irradiation unit (9). The first frame 10A ₁ has an opening of a predetermined area formed in the plate frame 10a disposed along the feed screw 10A ₃ , so that the movable base 10A ₄ can move in the range of the opening. Consists of. The first frame 10A ₁ has the plate frames 10b and 10c at positions facing each other to fix the first drive motor 10A ₂ and to support the feed screw 10A ₃ . If the first frame 10A ₁ is provided to face the plate frames 10b and 10c at a predetermined interval, the plate frame 10a may not be provided (for example, the plate frame 10a). ), Or a plate frame (not shown) at a position facing the frame), or a plate frame 10b or 10c fixed to the case 9k side.

The first drive motor 10A ₂ is capable of controlling rotation of a servo motor or the like, and the configuration thereof is not limited.

The feed screw 10A ₃ is not limited in configuration as long as it can transmit the rotation of the first drive motor 10A ₂ .

Mobile base (10A ₄₎ is a second frame body (10B ₁₎ which is formed at a position internal thread corresponds, described later, so as to move along the feed screws (10A ₃₎ by rotation of the feed screws (10A ₃₎ It is configured to support.

A slide mechanism (10A ₅₎ is provided with a first frame member (10A ₁₎ (plate frames (10a)) guide rail (10A ₆₎ and the guide rail (10A ₆₎ the moving part (10A ₇₎ moving along the in and it is fixed to the second frame element (10B ₁₎ side of the moving unit (10A ₇₎ described later. The slide mechanism 10A ₅ may be arranged to the left and right of the feed screw 10A ₃ .

The concealment plate moving means 10A of the above configuration drives the first drive motor 10A ₂ and rotates the feed screw 10A _{3 a} predetermined number, so that the moving base 10A _{4 follows the} feed screw 10A ₃ . movement, which is a second frame body (10B ₁₎ to be described later to move in a Y linear direction along the guide rail of the slide mechanism (10A _5), by. In addition, here, it is comprised so that the 2nd frame 10B ₁ may be suspended by the 1st frame 10A ₁ , and it may slide to a Y position to move to a predetermined position.

The concealment plate moving means 10B and the concealment plate moving means 10C are provided in the second frame body 10B ₁ , and respectively, the second drive motor 10B ₂ , the third drive motor 1OC ₂ , and the transfer screw. (1OB ₃ , 10C ₃ ), the movement bases 10B ₄ , 10C ₄ moving along the transfer screws 1OB ₃ , 10C ₃ , and the movement directions of the movement bases 10B ₄ , 10C ₄ . Slide mechanisms 10B ₅ and 10C ₅ are provided, and concealed plates T2 and T3 are provided to move along slide mechanisms 10B ₅ and 10C ₅ .

As described above, the second frame 10B ₁ is suspended from the first frame 10A ₁ so as to be able to slide freely in the Y-linear direction. The frame body 1OB ₁ includes a plate frame 10d provided on the side of the first frame body 10A ₁ and plate frames 10e and 10f installed so as to face both end sides of the plate frame 10d. . Further, the Y-direction moving means 10D for moving the concealment plate T1 in the Y-linear direction is provided at a predetermined position of the plate frame 10d.

The second drive motor 10B ₂ and the third drive motor 10C ₂ can control rotation of a servo motor and the like, and the configuration thereof is not limited.

The feed screws 1OB ₃ and 10C ₃ are arranged in parallel at predetermined intervals in a direction orthogonal to the feed screws 10A ₃ and transmit the rotations of the second drive motor 10B ₂ and the third drive motor 1OC ₂ . If possible, the configuration is not limited.

Mobile base (10B _4, 10C _4), the feed screw (1OB _3, 10C ₃₎ the lead screw by the rotation (1OB _3, 10C ₃₎ a base body (bl, c1) moving along with, the base body of the The connection pieces b2 and c2 provided in (b1, c1) are provided. The moving bases 10B ₄ and 10C ₄ are formed with female threads at predetermined positions of the base bodies b1 and c1 moving along the feed screws 1OB ₃ and 10C ₃ , and here, the connecting pieces b2 and c2. Are respectively disposed on the upper and lower ends of the base bodies bl and c1, and are configured to move the connecting pieces b2 and c2 to cross each other when moving along the transfer screws 1OB ₃ and 10C ₃ .

The slide mechanisms 10B ₅ and 1OC ₅ are guide rails 1OB ₆ and 10C ₆ arranged in parallel with the feed screws 1OB ₃ and 10C ₃ , and move along the guide rails 1OB ₆ and 10C ₆ . It has a part (1OB ₇ , 1OC ₇ ). A slide mechanism (10B _5, 1OC ₅₎ is to slide over the guide rail (1OB _6, 10C ₆₎ a, and is arranged only chajige, connecting part (b2, c2) the front end guide rail (1OB _6, 10C ₆₎ on the The moving parts 1OB ₇ and 1OC ₇ are connected. In addition, the concealment plates T2 and T3 are detachably attached to the moving parts 1OB ₇ and 1OC ₇ .

In addition, at the position (plate frame 10d) of the second frame body 10B ₁ , which is the side where the concealment plates T2 and T3 are arranged, the concealment plate T1 is provided via the Y-direction moving means 10D. It is prepared. The Y-direction moving means 10D includes a fourth drive motor 10D ₂ capable of controlling rotation of a servo motor and the like, a feed screw 10D ₃ that transmits rotation of the fourth drive motor 10D ₂ , and , the lead screw (10D ₃₎ the thus mainly comprising a moving part (10D ₄₎ to move, and cover plate (T1) is configured so as to be movable in parallel with respect to plots (9m). In addition, the mobile unit (10D ₄₎ has been installed to enable cover plate (T1) is detachable.

The concealment plate T1 is formed of a metal plate which is hard to soften or deteriorate even when ultraviolet light is irradiated here, and is formed to have an area larger than the opening width of the irradiation port 9m. The concealment plates T2 and T3 are provided with concealment portions t2a and t3a at the tip ends thereof, and opening portions t2b and t3b are formed continuously with the concealment portions t2a and t3a. The concealment plates T2 and T3 have a width narrower than the opening width of the irradiation port 9m and are formed in the same size, and the concealment portion t2a has a predetermined size corresponding to the size of the identification mark M to be exposed. , t3b) is formed. In addition, when the size of the identification mark (M) is different in various ways, the concealment plates (T2, T3) do not need to be formed in the same size can be changed appropriately in accordance with the identification mark (M). In addition, as shown in FIG. 7, the concealment boards T2 and T3 support the concealment sections t2a and t3a through the openings t2b and t3b, except for the positions of the concealment sections t2a and t3a. A thin line-shaped support line portion t2c (t3c) may be provided over the openings t2b and t3b so as to withstand high-speed movement without shielding light. The concealed portions t2a and t3a may be configured to be supported only by the plurality of thin line-shaped support line portions t2c (t3c) when the horizontal state is maintained when they are moved. In addition, the concealment boards T1, T2, and T3 are located at different heights here, respectively, and are comprised so that they may move crosswise.

In the irradiation area adjusting shutter mechanism 10 configured as described above, the concealed plate moving means 10B, the concealed plate moving means 10C, and the Y-direction moving means 10D operate as follows.

That is, by rotating the feed screws 10B ₃ and 10C ₃ by driving the second drive motor 10B ₂ and the third drive motor 10C ₂ , the moving bases 10B ₄ and 1OC ₄ are moved to slide the mechanism ( The concealment plates T2 and T3 are moved along the irradiation port 9m along 10B ₅ and 10C ₅ . The movement of the concealment plates T2 and T3 moves in the same direction at the same speed as the substrate W, and moves at a high speed in the opposite direction to the direction moved so far at a predetermined timing when traversing the irradiation port 9m. To cross the irradiation hole (9m). In addition, positioning of the concealed plates T2 and T3 in the Y-linear direction is performed by moving the second frame body B ₁ by the concealed plate moving means 10A. The concealed plate T1 is positioned at one end side of the irradiation port 9m when no identification mark is formed in the peripheral area Wc of the substrate W or by the movement mechanism 12. The corresponding concealment board T1 is used when there is an area which is not to be adjusted or irradiated with ultraviolet light on the other end side of the irradiation port 9m.

Next, with reference to FIG. 9, the irradiation area adjustment shutter mechanism 13 is demonstrated. Fig. 9 is a sectional view schematically showing a part of the case of the irradiation area adjusting shutter mechanism of the present apparatus. As shown in FIG. 9, the irradiation area adjustment shutter mechanism 13 is for changing the irradiation area of irradiation light. The irradiation area adjustment shutter mechanism 13 is provided with shutter mechanisms 13A and 13A having the same configuration, which are disposed to face the side of the support body 9f that supports the irradiation lens 9e. The shutter mechanism 13A has a width adjusting light shielding plate 13a for adjusting the width of the irradiation light irradiated from the irradiating lens 9e and a width adjusting light shielding plate moving part 13b for linearly moving the width adjusting light shielding plate 13a. And a frame for supporting the driving screw 13c for transmitting the driving force of the width adjusting light shielding plate moving part 13b, and the support screw 13c and the width adjusting light shielding plate moving part 13b to be fixed to the support 9f. 13d).

The irradiation area adjustment shutter mechanism 13 moves the width adjusting light shielding plates 13a and 13a by control from the control mechanism 20 in advance so that the irradiation area is in an appropriate state in response to the moving speed of the substrate W. FIG. . That is, the space width between the width adjusting light shielding plate 13 on one side and the width adjusting light blocking plate 13a on the other side is adjusted. For example, when the moving speed corresponding to the irradiation time for exposing the identification mark M by the laser beam is slower than the moving speed as a reference when exposing the peripheral area Wc by ultraviolet light, and becomes overexposure. In this case, the irradiation area is smaller than the standard. That is, the irradiation area adjustment shutter mechanism 13 increases the area covered by the width adjusting light blocking plates 13a and 13a on one side or one side and the other side of the irradiation port 9m, and thus the peripheral area Wc of the substrate W. The irradiation area to be irradiated) is narrowed and the moving speed of the substrate is controlled so that the total irradiation energy of irradiating ultraviolet light per unit area of the peripheral area Wc at the entire time becomes equal to the value set as a reference. .

In addition, the irradiation area can be adjusted large or small by setting the reference positions of the adjustment light blocking plates 13a and 13a to cover portions of one side or one side and the other side of the irradiation tool 9m, for example.

In addition, the irradiation area adjustment shutter mechanism 13 may be comprised with either shutter mechanism 13A. The irradiation area adjustment shutter mechanism 13 determines the irradiation area by the signal from the control mechanism 20 when the moving speed of the substrate W is set by the control mechanism 20 described later. The specific operation | movement which determines this irradiation area is mentioned later.

Next, the measuring instrument 11 of ultraviolet light will be described. As shown in FIG. 1, the measuring instrument 11 measures the illuminance of the ultraviolet light irradiated from the ultraviolet irradiation unit. This measuring instrument 11 is provided with an illuminance measuring portion 1la, a measuring position that moves the illuminance measuring portion 1la onto an irradiation optical path, and an illuminance measuring portion moving mechanism 11b for moving to an evacuation position. And the measuring instrument 11 sends the measured result to the control mechanism 20 mentioned later. The measurement result measured by this measuring instrument 11 is reflected in order to adjust irradiation light by adjusting the voltage or current applied to the discharge lamp 9a of an ultraviolet irradiation unit. For example, when the exposure operation on the peripheral area Wc of the substrate W is completed, the measuring instrument 11 performs a measurement operation by a signal from the control mechanism 20, and measures the irradiation light and the result. Is configured to operate by adjusting the discharge lamp 9a.

The structure of the control mechanism 20 is demonstrated with reference to FIG. 10 is a block diagram showing a control mechanism of the apparatus. As shown in Fig. 10, the control mechanism 20 includes an input means 21, a camera drive control means 22, an image data input means 23, a position detection means 24, and a matching means. (25), substrate position calculating means (26), moving conveyance mechanism driving control means (27), laser beam irradiation driving control means (28), ultraviolet irradiation driving control means (29), and measuring means (30). ) And a storage means 31.

The input means 21 is for inputting the breed data of the substrate W and the like. As long as this input means 21 can input data, such as a keyboard, a scanner, and a mouse, the structure is not specifically limited.

In addition, the variety data input here includes the size of the substrate W, the size and position of the pattern region Wp, the size and position of the peripheral region Wc, the type and size of the identification mark (character, symbol, figure, etc.). Exposure exposure position, exposure illuminance and exposure speed, exposure illuminance (laser beam and ultraviolet light) in the peripheral region Wc (one linear direction and the other linear direction), and the like, and are inputted from the input means 21 in advance. It is stored in the memory means 31. In addition, in the apparatus 1, data necessary for the peripheral exposure work, such as the exposure speed of the laser beam unit 5, the exposure illuminance, or the exposure illuminance per unit area of the ultraviolet irradiation unit 9, is input to the input means 21. It is input in advance from the memory and stored in the storage means 31.

The camera driving control means 22 is for driving control of the photographing means 4, and a start signal generated by a sensor (not shown) or the position detecting means 24 by carrying the substrate into the stage 2 and held therein. The photographing means 4 is moved and controlled by the signal of.

The image data input means 23 inputs the image data shot by the photographing means 4 and outputs the input image data to the position detection means 24.

The position detection means 24 analyzes the image data sent from the image data input means 23 as position data, and detects the substrate position and the stage position. The position data of the substrate position and the stage position detected by the position detecting means 24 are output to the matching means 25 and a signal indicating that the detection is completed is output to the camera drive control means 22.

The matching means 25 moves the calculated matching position data in order to calculate how much the moving conveyance mechanism 3 needs to be moved, based on the substrate position data and the stage position data sent from the position detecting means 24. Output to the conveyance mechanism drive control means 27 is carried out.

The substrate position calculating means 26 is based on the mating position data of the substrate W sent from the matching means 25 and the breeding data of the substrate W stored in the storage means 31. The laser beam irradiation start position, the ultraviolet irradiation start position, the moving speed, the 90 degree rotational moving position of the substrate, the moving speed after the 90 degree rotating movement, the laser beam irradiation starting position, the ultraviolet irradiation starting position, and the like are calculated.

For example, the substrate position calculating means 26 is a substrate size, a pattern region size, a peripheral region size, an identification mark size, each data indicating the position of the identification mark and the substrate W, which are varietal data of the substrate W; The start position of the laser beam irradiation is calculated by the laser beam unit 5 on the substrate W using the matching position data. Further, the substrate position calculating means 26 calculates the moving speed of the substrate W by the size of the identification mark and the exposure roughness of the identification mark. The result calculated by the substrate position calculating means 26 is outputted to the mobile conveyance mechanism drive control means 27.

Further, the substrate position calculating means 26 calculates the respective positions, the moving speed, and the like by reflecting the substrate position data sent from the moving conveyance mechanism drive control means 27.

The mobile transport mechanism drive control means 27 drives the mobile transport mechanism 3 on the basis of each data sent from the matching means 25 or the substrate position calculating means 26. The moving conveyance mechanism drive control means 27 drives the moving conveyance mechanism 3, and as a result, a movement instruction indicating a timing for irradiating a laser beam, a timing for irradiating ultraviolet rays, a timing for controlling the shutter mechanism 10, and the like. The data is sent to the laser beam irradiation driving control means 28 and the ultraviolet irradiation driving control means 29.

The laser beam irradiation drive control means 28 is based on the breed data of the substrate W stored in advance in the storage means 31 and the position data of the substrate W sent from the mobile transport mechanism drive control means 27. Thus, the laser beam unit 5 is drive controlled. The laser beam irradiation driving control means 28 outputs the irradiation stop signal indicating the end of the irradiation of the laser beam to the laser beam unit 7, and at the same time the laser based on the measurement result data sent from the measurement means 30. Adjust the beam unit (7). In addition, the laser beam irradiation driving control means 28 respectively selects the laser beam light source 5a, the acoustic optical element 7a or the beam expander 8c of the laser beam unit 7 based on the measurement result data. It is also appropriately adjusted so as to be in a state (illuminance, irradiation area, etc.) of a laser beam set in advance.

The ultraviolet irradiation driving control means 29 irradiates ultraviolet rays based on the breed data of the substrate W stored in advance in the storage means and the position data of the substrate W sent from the mobile transport mechanism driving control means 27. The unit 9 (including the irradiation area adjustment shutter mechanism 10 and the irradiation area adjustment shutter mechanism 13) is drive controlled. The ultraviolet irradiation driving control means 29 outputs an irradiation stop signal for stopping the irradiation of ultraviolet light (blocking of the optical path by the optical shutter mechanism) to the ultraviolet irradiation unit 9 and is sent from the measuring means 30. The ultraviolet irradiation unit 9 is adjusted based on the measurement result data. Then, the ultraviolet irradiation driving control means 29 adjusts the input voltage or the input current of the discharge lamp 9a to the state of the preset light intensity based on the measurement result data.

The measurement means 30 transmits the measurement data from the optical path length adjustment unit 6, the laser beam measurement adjustment mechanism 8 and the measurement instrument 11 to the laser beam irradiation drive control means 28 and the ultraviolet irradiation drive control means 29. Will output

In addition, the storage means 31 is for storing the breed data of the board | substrate W, and the structure is not limited as long as it can store data, such as a hard disk.

Next, the operation of the apparatus 1 will be described with reference to FIGS. 1 to 10 as appropriate with reference to FIGS. 11, 12, and 13. FIG. 11 is a production process chart showing the operation of the laser beam ultraviolet irradiation peripheral exposure apparatus, FIG. 12 is a perspective view schematically showing a state in which the peripheral region at the end side of the substrate is exposed with light containing ultraviolet rays of a predetermined wavelength, It is a perspective view which shows typically the state which exposes the peripheral area in the center side of the board | substrate with the light containing the ultraviolet-ray of a predetermined wavelength. In FIG. 13 shown here, the position in the up-down direction of the concealment board T1 is shown below than the concealment boards T2 and T3 for easy understanding, but the actual configuration is as shown in FIGS. 7 and 8. Likewise, the concealment plates T1 are disposed above the concealment plates T2 and T3.

As shown in FIG. 11, the apparatus 1 is first loaded onto the stage 2 in a state where the bottom surface of the substrate is adsorbed and held by a handler or the like (S1). When the substrate is loaded into the stage 2, the substrate is adsorbed by the adsorption opening 2c formed at the tip of the support pillar 2b, so that the substrate is held in the stage 2 (loading step S2). Here, when carrying in the board | substrate W is carried out, the movement conveyance mechanism 3 moves the stage 2 in the Y linear direction by the 2nd movement guide mechanism 3B, and makes it receive a board | substrate W. have.

When the substrate is held on the stage 2, a start signal is sent to the camera drive control means 22 of the control mechanism 20 to move the photographing means 4 to a preset reference position and simultaneously move the moving conveyance mechanism 3. Move to the reference position, photograph the positioning mark 2d of the stage 2 by the photographing means 4, and move the photographing means 4 to a preset position of the substrate W; For example, the edge portion (or alignment mark (not shown)) of the substrate is photographed to input image data to the control mechanism 20 by the image data input means 23 and at the same time by the position detection means 24. The substrate position and the stage position are detected by analyzing the input image data (detection step S3).

When the position of the substrate W and the stage 2 is detected, the stage 2 is matched to move based on the respective positions to move the stage 2 through the matching means 25, the moving conveyance mechanism drive control means 27, and the like. 3) is operated to perform a matching operation (matching step S4). In this matching operation, the matching movement in the θ direction of the substrate W is performed. After that, when the substrate W is moved in the X and Y linear directions, the laser beam and ultraviolet light can be irradiated. The substrate W is matched to the relative position.

And the matching means 25 of the control mechanism 20 outputs the matching position of the matched board | substrate W to the board | substrate position calculating means 26, and also to the moving conveyance mechanism drive control means 27. As shown in FIG. The substrate position calculating means 26 moves the laser beam irradiation of the substrate W based on the registration position data of the substrate W sent and the varieties of the substrate W stored in the storage means 31. The position (laser beam irradiation start position) and the moving speed are calculated (operation step S5). At this time, the movement position and the movement speed at the time of rotating the board | substrate W mentioned later by 90 degrees are also computed.

When the moving position and the moving speed of the substrate W are calculated, the moving transfer mechanism drive control means 27 passes through the first moving guide mechanism 3A (or the second moving guide mechanism 3B) of the moving transfer mechanism. The stage 2 holding the substrate W in the X-direction (or Y-direction) is moved, and a predetermined position (for example, the peripheral region of the substrate W) immediately below the laser beam unit 5 To the head of the identification mark Wc) (S6). When the substrate is transported to a predetermined position, the substrate W is moved at a predetermined speed and the laser beam unit 5 is operated, and the identification marks are sequentially irradiated by irradiating a laser beam from each of the laser beam heads 5A, 5A, and 5A. Exposure is performed (laser beam irradiation step S7).

When irradiating a laser beam, the movement speed of the moving conveyance mechanism 3 which moves the board | substrate W is made to synchronize with the exposure speed which performs exposure by a laser beam. That is, by synchronizing the acoustic optical element 7a (AOM) with the galvano mirror unit 7c (galvano mirror), the AOM diffracts the primary light from the high speed shutter to secure the marking light, thereby enabling high-speed exposure. have. Therefore, it is possible to move at a predetermined speed without stopping the substrate W at the time of irradiation of the laser beam.

At this time, the apparatus 1 is characterized in that, on the ultraviolet irradiation unit 9 side, the variety data of the substrate W stored in the storage means 31 by the control mechanism 20 and the moving transport mechanism drive control means 27. Based on the positional data of the board | substrate W sent from the board | substrate, the case 9k is moved to a Y linear direction through the moving mechanism 12, and the one end side of the irradiation port 9m is the pattern area | region of the board | substrate W ( Wp) is concealed and adjusted to a position where light can be irradiated to the peripheral area Wc side (S8) (see Fig. 12A). In addition, when the identification mark M1 is exposed by the irradiation of a laser beam to the peripheral area Wc of the board | substrate W and sent to the ultraviolet irradiation unit 9 side, the control mechanism 20 is a place where the irradiation of ultraviolet-ray is carried out. In the case of the peripheral area Wc on both sides of the substrate W, the irradiation area adjustment shutter mechanism 10 is used so that the concealment plates T2 and T3 are used without using the concealment plates T1 of the irradiation area adjustment shutter mechanism 10. Prepare to perform ambient exposure by controlling. When the substrate actually reaches the irradiation start position of the ultraviolet light of the ultraviolet irradiation unit 9, the optical shutter mechanism 9c is operated, and the ultraviolet light is concealed in the peripheral region Wc of the substrate W. , T2, T3) is irradiated with ultraviolet light (ultraviolet irradiation step S10).

When the identification mark M1 and its peripheral area Wc in the X linear direction of the substrate W are exposed, the substrate W is in the X linear direction (one straight direction) and the Y straight direction (the other straight direction). ) It is determined whether both peripheral regions Wc have finished exposure (S11) (for example, by an operating state of one substrate W of the third moving guide mechanism 3C), and when it is "No", X The stage 2 is returned to the end of the movement in the linear direction or the movement start end where the matching operation is performed, and the stage 2 is moved by the third movement guide mechanism 3C of the movement transport mechanism 3 at either the movement end or the movement start end. ) Is rotated 90 degrees, and the substrate W is rotated 90 degrees (S12). As described above, by performing the same operations from Step 6 (S6) to Step 10 (S10), the identification mark M2 is exposed in the peripheral area Wc of the substrate W and at the same time, the remaining peripheral area is exposed. By exposing Wc, the peripheral exposure to all peripheral regions Wc of the substrate W is terminated.

When the peripheral exposure of the substrate is finished, the substrate W is moved to a carrying out port (not shown) formed at the end of the movement of the substrate W, or to a carrying in side where the substrate W is loaded by the robot hand (not shown). It is carried out (S13). Then, a new substrate is loaded and the above steps S1 to S13 are repeated to appropriately perform the peripheral exposure operation of the substrate W. FIG.

Here, the moving speed of the stage 2 is demonstrated.

The moving transport mechanism drive control means 27 of the control mechanism 20 determines the moving speed of the substrate W based on the preset irradiation energy. However, when the area of the identification mark M is large or the required exposure amount of the resist ink is large, marking by the laser beam unit 5 may take time. In this case, the moving transport mechanism drive control means 27 calculates the time required for marking the laser beam unit 5 to determine the moving speed Sa of the substrate W. As shown in FIG. On the other hand, at the moving speed Sa of the substrate W, the peripheral exposure in the ultraviolet irradiation unit 9 may be overexposed. For this reason, the ultraviolet irradiation drive control means 29 receives the moving speed Sa of the substrate W from the moving transport mechanism drive control means 27. And the irradiation area adjustment shutter mechanism 10 adjusts the position of the width adjusting light shielding plate 13a.

On the contrary, in relation to the required exposure amount of the resist ink with respect to the ultraviolet light, the moving transport mechanism drive control means 27 may determine the moving speed Sb of the substrate W during the exposure in the ultraviolet irradiation unit 9. In this case, the laser beam irradiation drive control means 28 receives the moving speed Sb of the substrate W from the moving transport mechanism drive control means 27. The laser beam unit 5 determines the intensity of the laser beam in accordance with the moving speed Sb.

For example, when the signal sent from the moving conveyance mechanism drive control means 27 is the moving speed Sa, the irradiation area of the irradiation area adjustment shutter mechanism 13 is irradiated with ultraviolet rays corresponding to the moving speed Sa. Control is made through the drive control means 29. In other words, the ultraviolet irradiation driving control means 29 substitutes the moving speed Sa in a preset equation to determine how much the irradiation area is in the proper exposure state with respect to the moving speed Sa. The irradiation area is calculated, and the moving amount (moving position) of the width adjusting light blocking plate 13a is obtained from the calculation result, and the width adjusting light blocking plate moving part 13b is controlled.

In addition, when the signal sent from the moving conveyance mechanism drive control means 27 is the movement speed Sb, the laser beam irradiation drive control means 28 changes the amount of excitation light by the laser beam light source 5a, The intensity of the laser beam can be changed by changing the intensity, or by changing the repetition frequency of the laser beam, or the laser beam intensity can be changed by modulation of the acoustooptic device 7a to correspond to the moving speed sb. Moreover, the laser beam irradiation drive control means 28 controls the reflection direction of the laser beam in the galvano mirror unit 7c corresponding to the movement speed Sb so as to correspond to the movement speed Sb.

In this way, the laser beam irradiation driving control means 28 and the ultraviolet irradiation driving control means 29 are configured to operate in response to the moving speed of the substrate W. As shown in FIG. In addition, when the moving speed Sa and the moving speed Sb are the same, the exposure operation is controlled to be performed by an operation set as a reference in each of the units 5 and 9.

Next, the case where the peripheral area Wc of the board | substrate W is exposed concretely is demonstrated further with reference to FIG. 12 and FIG. That is, as shown in Figs. 12A and 12B, the irradiation area adjustment shutter mechanism 10 positions the concealment plate T2 through the slide mechanism 10A ₅ in the Y-linear direction by the concealment plate moving means 10A. Alignment is performed, and the position of the concealment part t2a of the concealment board T2 is made into the position which light-shields overlapping light to the position of the identification mark M1. Here, the concealing portion t2a is provided in advance with the same area as the identification marks Ml and M2. When the peripheral area Wc of the board | substrate W approaches the irradiation port 9m, the ultraviolet irradiation unit 9 operates the optical shutter shutter mechanism 9c, and moves the light shielding plate 9c ₁ to escape from an optical path, Ultraviolet light from the 9a) side is irradiated to the peripheral region Wc.

Then, when the position of the identification mark M1 is sent with the movement of the substrate W, the concealed portion t2a of the concealment plate T2 overlapping the position of the identification mark is synchronized with the movement speed of the substrate W. It moves to cross the irradiation port (9m) at a predetermined speed, the ultraviolet light is irradiated to the remaining peripheral area (Wc) in a state of concealing the identification mark (M1) to perform the ambient exposure.

In addition, as shown in FIG. 12C, in the peripheral area Wc of the substrate W, the concealment plate T3 is concealed for the case where the next identification mark M1 is continuous to the irradiation port 9m. Similarly to the plate T2, the light is moved in synchronization with the moving speed of the substrate W in a position overlapping with the identification mark M1, so that ultraviolet light is emitted to the remaining peripheral area Wc while the next identification mark M1 is concealed. Ambient exposure is carried out by irradiating.

Furthermore, as shown in FIG. 12D, the concealment plate T2 which has already concealed the identification mark M1 once across the irradiation port 9m is in a direction opposite to the moving direction of the substrate W at a predetermined timing. The irradiation port 9m is moved at high speed to cross again. At this time, the exposure operation of the peripheral area Wc of the substrate W is being performed. The exposure operation of the peripheral area Wc is not disturbed by moving at a high speed when crossing the irradiation port 9m. Then, the concealment plate T2 is positioned at the position overlapping with the third identification mark M1 as in the above description, and moved to cross the irradiation port 9m at the same moving speed as the substrate W. In addition, the identification mark M1 may be concealed to expose another peripheral area Wc.

In this way, the irradiation area adjustment shutter mechanism 10 traverses the irradiation aperture 9m by moving at the same moving speed as the substrate W when concealing (shielding) the identification mark by the concealment plates T2 and T3. When corresponding to the next identification mark, the number of identification marks M1 (M2) is increased even if the number of identification marks M1 (M2) is increased by repeating the movement of the substrate W in the direction opposite to the movement direction of the substrate W at high speed. It becomes possible to cope.

In addition, as shown in FIGS. 13A to 13D, when pattern regions exist on both sides of the peripheral area Wc of the substrate W, the concealment plate T1 is used in combination with the concealment plates T2 and T3. It corresponds to.

As shown in FIG. 13A, first, the case 9k is moved in the Y-linear direction through the moving mechanism 12, and one end of the irradiation port 9m can conceal the pattern region Wp of the substrate W. As shown in FIG. Adjust to the position. And, when using the cover plate (T1), the second frame element (10B ₁₎ the slide mechanism (10A ₅₎ the thus moved to a predetermined position, the cover plate to perform the positioning of the Y linear direction (T2, T3) do. Further, through the Y-direction moving means 10D, the concealment plate T1 is moved in the Y-line direction to the position where the pattern region Wp can be concealed, and the pattern region Wp opposite to the peripheral region Wc. The predetermined width | variety in the Y linear direction of the irradiation tool 9m is shielded so that light irradiation may not be carried out.

Then, in the state where the irradiation area of the irradiation port 9m is narrowed to the concealment plate T1, the identification mark M1 is shielded by using the concealment plates T2 and T3 as described above in Figs. 12B to 12D. While exposing the peripheral area Wc, the peripheral exposure with the pattern area Wp disposed on both sides of the peripheral area Wc is performed. In addition, the control of the irradiation area adjustment shutter mechanism 10 is appropriately performed by the ultraviolet irradiation driving control means 29 of the control mechanism 20 based on the breed data of the substrate W and the position data of the substrate W. have.

When the identification mark M1 and its peripheral area Wc in the X linear direction of the substrate W are exposed, the substrate W is in the X linear direction (one straight direction) and the Y straight direction (the other straight line). Direction) When both peripheral areas Wc have been exposed to light, it is determined (S11) (e.g., by an operating state of one substrate W of the third moving guide mechanism 3C). It is once returned to the movement end in the X linear direction or the movement start end where the matching operation has been performed, and the stage (the third movement guide mechanism 3C of the movement conveyance mechanism 3 at either of the movement end or movement start end) 2) is rotated 90 degrees and the substrate W is rotated 90 degrees. As described above, by performing the same operations from Step 6 (S6) to Step 10 (S10), the identification mark M2 is exposed in the peripheral area Wc of the substrate W and at the same time, the remaining peripheral area is exposed. By exposing Wc, the peripheral exposure to all peripheral regions Wc of the substrate W is terminated.

When the peripheral exposure of the substrate W ends, the substrate W is unloaded from the outlet (not shown) side formed on the end of the movement of the substrate W or from the inlet side into which the substrate W is loaded. It is carried out by city).

In addition, depending on the type of the substrate W, some identification marks are not formed in the peripheral area Wc in the center of the substrate W shown in FIG. 3. In that case, the concealment plate T1 is shown in FIG. 13. The peripheral exposure can be terminated by shielding the light of the irradiation port 9m in the Y-linear direction only by?).

In addition, depending on the type of the substrate W, there is a state where there is no identification mark M2 as shown in FIG. 3 when rotated 90 degrees. Since the substrate W without such an identification mark M2 is only irradiated with ultraviolet light on the ultraviolet irradiation unit 9 side without using a laser beam, the position of the case 9k by the moving mechanism 12. By the alignment and the alignment of the concealment plate T1 of the irradiation area adjustment shutter mechanism 10, the exposure operation of the ultraviolet light can be performed. Therefore, the control mechanism 20 is controlled by the breed data of the board | substrate W so that the moving speed of the board | substrate W may change with the initial state of the board | substrate W. Since the identification mark M2 is absent in this manner, the moving speed of the substrate W when rotated 90 degrees is at the irradiation aperture 9m so that the irradiation area by the irradiation area adjusting shutter mechanism 13 is the maximum. It is set in the state which becomes, and it is set so that the efficiency of an exposure operation may become high.

In the apparatus 1, the ultraviolet irradiation unit 9 measures the illuminance by the measuring instrument 11 before the peripheral exposure in the peripheral region Wc of the substrate W ends and the next substrate is conveyed. It is becoming.

The apparatus 1 moves the illuminance measuring portion 1la from the evacuation position to the measurement position by the illuminance measuring portion moving mechanism 1lb of the measuring instrument 11 and places it directly under the irradiation port 9m. The apparatus 1 operates the light shielding plate 9c ₁ of the optical path shutter mechanism 9c to perform light irradiation from the irradiation port 9m to the illuminance measurement portion 1la and to measure the illuminance of the light. And the measurement result is sent from the measurement means 30 of the control mechanism 20 to the ultraviolet irradiation drive control means 29, adjustment of the current or voltage with respect to the discharge lamp 9a is performed, and illumination intensity is adjusted.

In the laser beam unit 5, the apparatus 1 also monitors the state of the laser beam when the substrate is not at the position to irradiate the laser beam. The CCD image pickup device 6b, the power meter 6c, or the power meter 8a. And by the CCD image pickup device 8b, for example, by performing one or more of adjustment of the laser beam light source 5a, adjustment of the acoustic optical element 7a, or adjustment of the beam expander 8c. The laser beam is always kept in proper condition.

In addition, as shown in FIG. 14, the apparatus 1 may be configured as a laser beam unit 15 instead of the laser beam unit 5. 14 is a side view schematically showing a configuration other than the laser beam unit. The configuration of the optical path length adjusting unit 6 is not the same as that shown in Fig. 5, and description thereof is omitted.

The laser irradiation units 17 (here, three) of the laser beam unit 15 are each formed in the same configuration, and the laser beam is sent through the optical fiber 15a from the optical path length adjustment unit 6. .

The laser irradiation unit 17 includes a reflector 17a that reflects a laser beam from the optical fiber 15a in a predetermined direction, and a digital micromirror that reflects the laser beam reflected by the reflector 17a to a predetermined laser beam diameter. Device 17b and beam irradiation lenses 17c and 17d for irradiating the laser beam reflected from the digital micromirror device 17b to the peripheral area Wc of the substrate W at a predetermined beam diameter. Doing.

In addition, the digital micromirror device 17b includes a small mirror 17b1 reflecting the laser beam, a torsion pin 17b ₂ that supports the mirror 17b1 at one end, and the other of the torsion pin 17b ₂ . since provided with a yoke (17b ₃₎ and so on installed in the end side, and the torsion pin (17b ₂₎ is by a support shaft configured to be inclined at a predetermined angle (e.g., +12 degree and -12 degrees), it requires greater ( In the state of the current flowing in 17b ₃ ), the torsion pin 17b ₂ controls the direction of the reflected light by tilting the mirror 17b ₁ at a predetermined angle.

By using this digital micromirror device 17b, the laser irradiation unit 17 can irradiate and expose the desired identification mark M to the peripheral area Wc of the board | substrate W with a laser beam.

As mentioned above, as long as this apparatus 1 can exhibit the same function in each structure, the installation position etc. may be changed. For example, the irradiation area adjustment shutter mechanism 13 may be provided outside the irradiation opening 9m of the case 9k and shielded from below the irradiation opening 9m. The number of ultraviolet irradiation units 9 may be one or three or four. The laser irradiation unit 7 of the laser beam unit 9 may be three or more, the laser beam light source 5a may be plural, and the laser irradiation unit 7 may be three or more.

According to the present invention, since the identification mark can be exposed by the laser beam and the exposure of the peripheral area by the light including ultraviolet rays, the integrated line can be shortened. In addition, according to the present invention, even when exposure of the identification mark and exposure of the peripheral area are performed continuously, both of them can perform appropriate exposure without affecting the moving speed of the substrate.

Claims (6)

A laser beam which moves a substrate along a predetermined movement direction and exposes an identification mark by irradiating a laser beam to a peripheral region formed around the pattern region of the substrate, and simultaneously irradiates and exposes light containing ultraviolet rays to the peripheral region. In the ultraviolet irradiation peripheral exposure apparatus, A stage holding the substrate; A movement transport mechanism for moving the stage in a rotational direction, a movement direction, and a direction orthogonal to the movement direction, which is a circumference of a vertical line perpendicular to the surface of the substrate; A laser beam unit provided at a position above the substrate on the moving path of the moving transport mechanism and irradiating a laser beam; An ultraviolet irradiation unit provided at a position above the substrate at a position adjacent to the laser beam unit and irradiating light including ultraviolet rays to the peripheral region from an irradiation port; A control for controlling the mobile transport mechanism according to one of a first moving speed for moving the stage when irradiating the laser beam and a second moving speed for moving the stage when irradiating light including the ultraviolet ray; A laser beam ultraviolet irradiation peripheral exposure apparatus having a means. The method of claim 1, And said ultraviolet irradiation unit has an irradiation area adjusting shutter mechanism for adjusting an irradiation area on the basis of said first moving speed. The method of claim 2, And the irradiation area adjusting shutter mechanism includes a width adjusting shading plate for partially shielding the irradiation port, and a width adjusting shading plate moving unit for moving the width adjusting shading plate. The method of claim 1, And the laser beam unit includes changing means for changing the intensity of the laser beam based on the second moving speed. The method of claim 4, wherein The changing means changes the intensity of the laser beam by changing at least one of a change in the amount of excitation light to the laser beam, a change in the pulse interval of the laser beam, or a change in the modulation of the laser beam. A laser beam ultraviolet irradiation peripheral exposure apparatus. A laser beam and ultraviolet irradiation peripheral exposure method for irradiating a laser beam to a peripheral region formed around a pattern region of a substrate to expose an identification mark, and simultaneously irradiating and exposing light containing ultraviolet rays to the peripheral region. A first calculating step of calculating a first moving speed of the substrate when exposing the identification mark; A second calculating step of calculating a second moving speed of the substrate when irradiating the ultraviolet rays, Determining an intensity of the laser beam based on the first moving speed to expose an identification mark to a peripheral area of the substrate, or determining an irradiation area of light including ultraviolet rays based on the second moving speed. A laser beam and ultraviolet irradiation peripheral exposure method.

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