JP4641779B2 - Exposure equipment - Google Patents

Description

  The present invention relates to an exposure apparatus used for manufacturing a semiconductor manufacturing apparatus, a printed circuit board, an LCD, a reticle, and the like, and in particular, aligns an alignment mark provided on the back surface of a workpiece with an alignment mark of a mask, The present invention relates to an exposure apparatus that exposes a workpiece.

In recent years, a pattern may be formed on both surfaces of a workpiece in order to effectively use a material and to perform high-density mounting. FIG. 11 shows a pattern forming process when patterns are formed on both sides.
As shown in FIG. 11A, a work alignment mark WAM (hereinafter referred to as a work mark WAM) used for alignment with a mask is formed on the first surface of the work W. Here, in order to avoid confusion, the terms “front surface” and “back surface” of the workpiece W are not used, but are referred to as a first surface and a second surface.
Using the workpiece mark WAM formed in (a) above, a first mask (not shown) and the workpiece W are aligned, and a first pattern is formed on the first surface of the workpiece W as shown in FIG. Is formed by exposure.
The workpiece W is reversed, the second mask (not shown) and the workpiece W are aligned, and a second pattern is exposed and formed on the second surface of the workpiece W as shown in FIG.
Examples of the material for the workpiece to be exposed include a silicon wafer and a glass substrate. In the case of a silicon wafer, a product produced by exposure is a semiconductor component such as an integrated circuit (LSI), and in the case of a glass substrate, for example, a reticle.

Hereinafter, the case where the second exposure pattern is exposed on the second surface of the workpiece as described above will be described.
FIG. 12 shows a method of alignment when exposing the second pattern on the second surface of the workpiece.
FIG. 12A shows a case where the workpiece is a transparent substrate such as glass. A workpiece W is placed on the workpiece stage 1 with the first surface on which the first pattern P1 and the workpiece mark WAM are formed facing down and the second surface facing up. The mask stage 2 holds a mask M for forming a second pattern for forming a pattern on the second surface of the workpiece W.
In order to perform exposure, the mask M and the workpiece W must be aligned. For this purpose, an alignment mark MAM (hereinafter referred to as a mask mark MAM) formed on the mask M and a work mark WAM are detected by the alignment microscope 4 and aligned.
When the workpiece W is a transparent glass substrate, the workpiece mark WAM formed on the first surface of the workpiece W can be detected from the second surface side of the workpiece W. Since the mask M is also a transparent glass substrate, the alignment microscope 4 is provided above the mask M (on the side opposite to the workpiece W), and the workpiece mark WAM is detected through the mask M.
After the alignment of the mask M and the workpiece W, exposure light is irradiated to the workpiece W through the mask M, and a second pattern on the second surface of the workpiece W is formed.

FIG. 12B shows a case where the workpiece W is an opaque substrate such as a wafer. The work W is placed on the work stage 1 with the first surface facing down and the second surface facing up, and the mask M for holding the second pattern is held on the mask stage 2 as described above.
The alignment microscope 4 is provided below the workpiece W (on the side opposite to the mask M) and detects the workpiece mark MAM from the through hole (detection hole) 1a of the workpiece stage 1. The mask mark MAM is detected through the through hole 1a in a state where the workpiece W is removed from the workpiece stage 3, and the position thereof is stored.
Thereafter, the workpiece W is placed on the workpiece stage 3 so that the workpiece mark WAM is placed on the through hole 1a, and the alignment microscope 4 detects the workpiece mark WAM through the through hole 1a and stores the position. Aligned with the mark MAM.

When the mask M and the workpiece W are aligned as shown in FIG. 12, the mask mark MAM and the workpiece mark WAM are different in distance (position in the optical axis direction) from the alignment microscope 4.
Therefore, when detecting the mask mark MAM or the work mark WAM, if the distance between both marks is within the depth of focus of the alignment microscope 4, the other mark can be detected by focusing on one mark. If the distance is more than the above, if one mark is focused, the other mark will be blurred and cannot be detected.
In the example currently used, the thickness of the glass substrate is 3 to 5 mm, the thickness of the wafer is 100 to 200 μm, the distance between the mask for exposure and the work is 30 to 100 μm, The interval between work marks may not be within the depth of focus of the alignment microscope.
In such a case, after detecting one alignment mark (for example, a mask mark), the alignment microscope 4 is moved in the optical axis direction to focus on the other alignment mark (for example, a work mark), and both marks are Detection is performed (for example, refer to Patent Document 1). In this case, the alignment is performed by performing image processing on the previously detected mark by the control unit of the apparatus and storing the position, and superimposing the stored mark and the mark detected later.
Further, as a method for changing the depth of focus of an alignment microscope, for example, Patent Document 2 discloses a plane plate (optical plate 10 formed of glass or the like, which is parallel to at least two planes below) in the optical path of an alignment beam. It is shown to insert a parallel plate).
JP-A-6-29173 JP 2004-96109 A

As described in Patent Document 1, when the alignment microscope is moved in the optical axis direction, the alignment microscope may be bent during movement. When waviness occurs, the optical axis of the alignment microscope tilts, and the position of the visual field of the alignment microscope differs before and after the movement, that is, when the mask mark is detected and when the work mark is detected. This visual field deviation may be 10 μm or more.
If the position of the visual field is shifted before and after the movement, even if the other mark is superimposed on the stored position of one of the alignment marks, the actual positions of both marks are shifted by the amount of movement of the visual field due to the undulation. Therefore, the alignment accuracy between the mask and the work is lowered, the exposure accuracy is lowered, and this causes a product defect.
If a parallel plate is used as described in Patent Document 2, it is not necessary to move the alignment microscope in the optical axis direction as described above. However, when the parallel plate is inserted into the optical path of the alignment beam, two parallel planes of the parallel plate must be inserted perpendicular to the optical axis. If the parallel plate is inclined with respect to the optical axis, The alignment accuracy of the work will be reduced.
For this reason, when using a parallel plate, it is necessary to provide a mechanism for inserting and removing the parallel plate perpendicular to the optical axis. Note that Patent Document 2 does not describe a mechanism for inserting and removing the parallel flat plate.
Further, the parallel plate has to be inserted and removed every time the mask and the workpiece are aligned, and there is a problem that the operation is complicated even if the mechanism is provided.
The present invention has been made to solve the above-mentioned problems of the prior art, and detects two alignment marks outside the focal depth range in focus without moving the alignment microscope in the optical axis direction. It is another object of the present invention to provide an exposure apparatus that can accurately align a mask and a workpiece, and that can automatically insert and remove parallel plates by moving a workpiece stage.

It is known that when a parallel plate is inserted in the middle of the optical path, the focal length moves according to the thickness of the parallel plate to be inserted. Roughly, the focal length increases by a distance of 1/3 of the thickness of the parallel plate.
The present invention uses this technique to focus on the alignment mark closer to the alignment microscope in advance, and when detecting the other alignment mark far from the alignment microscope, the thickness corresponding to the distance between the two marks is used. The parallel plate is inserted into the optical path of the illumination light of the alignment microscope, and the focal length is extended to adjust the focus.
Further, in order to automatically and simply insert and retract the parallel plate according to the mark to be detected, a work stage slide mechanism is provided that slides the work stage in a direction orthogonal to the optical axis of the exposure light. When the mask mark is detected with the alignment microscope and when the work mark is detected, the work stage is slid to change the position, and the parallel plate is inserted into and retracted from the optical path according to the position of the work stage.
Specifically, the following mechanism is provided to retract and insert the parallel plate.
(1) A parallel plate is provided integrally with the work stage, the alignment microscope is disposed so as to be inserted on the opposite side of the mask with respect to the work stage surface, and an opening for inserting the alignment microscope into the work stage; A detection hole for detecting a workpiece alignment mark is provided by the alignment microscope.
When the work stage is moved to the mask mark detection position by the work stage slide mechanism, the parallel plate is inserted between the mask and the alignment microscope, and when the work stage is moved to the work mark detection position, the parallel plate Is configured to be retracted from between the mask and the alignment microscope.
(2) A parallel flat plate is attached to the alignment microscope via support means, and the parallel flat plate is supported by the support means so as to be relatively movable in parallel to the movement direction of the work stage with respect to the alignment microscope. In addition, an alignment microscope is arranged so as to be inserted on the opposite side of the mask with respect to the work stage surface, and an opening for inserting the alignment microscope on the work stage and a work alignment mark are detected by the alignment microscope. The detection hole is provided.
When the work stage is moved to the mask mark detection position by the work stage slide mechanism, the parallel plate is inserted between the mask and the alignment microscope, and when the work stage is moved to the work mark detection position, the parallel plate Is pushed by the work stage and retracted from between the mask and the alignment microscope.
(3) A parallel plate is attached to the alignment microscope via a link mechanism, and the link mechanism is configured to move the parallel plate relative to the alignment microscope in accordance with the movement of the work stage. Depending on the position of the stage, the parallel plate is inserted into and retracted from the optical path. The alignment microscope is arranged so as to be inserted between the mask and the light irradiation unit.
When the work stage is moved to the work mark detection position by the work stage slide mechanism, the parallel plate is inserted between the mask and the alignment microscope by the link mechanism, and the work stage is moved to the mask mark detection position. Then, the parallel plate is configured to be retracted from between the mask and the alignment microscope by the link mechanism.

In the present invention, the following effects can be obtained.
(1) Since the focal position is moved by inserting and retracting the parallel plate, it is not necessary to move the alignment microscope in the direction of the optical axis, and therefore there is no movement of the visual field due to running bending, and the mask and workpiece can be accurately aligned. .
(2) Since the work stage is slid to change the position, and according to the position of the work stage, parallel plate moving means for inserting and retracting the parallel plate into the optical path is provided. This can be done reliably and reliably.

FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to the first embodiment of the present invention. This figure shows a configuration of an exposure apparatus that detects a mask mark and a work mark from the work stage side, and is a sectional view for easy understanding of the configuration.
In the figure, a light irradiation unit (lamp house) 1 is composed of a lamp 1a, a condensing mirror 1b, a plane mirror 1c, an integrator lens 1d, a shutter 1e, and a collimator mirror 1f, and light including exposure light from a lamp 1a as a light source. Is reflected by the condenser mirror 1b, folded back by the plane mirror 1c, and incident on the integrator lens 1d for making the illuminance distribution uniform on the irradiation surface (in this case, the surface of the workpiece).
The light emitted from the integrator lens 1 d is reflected by the collimator mirror 1 f, converted into light having parallel optical axes (parallel light), and emitted from the light irradiation unit 1. Between the integrator lens 1d and the collimator mirror 1f, a shutter 1e for controlling light irradiation from the light emitting unit 1 is provided.

The light emitted from the light irradiation unit 1 enters the mask M held on the mask stage 2.
A workpiece W is held on the workpiece stage 3, and the mask pattern formed on the mask M is projected onto the surface of the workpiece W on the workpiece stage 3 by the exposure light incident on the mask M and exposed. The
The alignment microscope 4 is provided below the surface of the work stage 3 (opposite the mask M with respect to the surface of the work stage 3), and the mask mark and the work mark are detected from below the work stage 3. The Although only one alignment microscope is shown in the figure, since one cannot be aligned, there are actually two alignment microscopes at the back of the drawing.
An opening 3a into which the alignment microscope 4 is inserted is formed on the side surface of the work stage 3, and a through-hole (detection) for detecting an alignment mark of the work W placed by the inserted alignment microscope 4 on the surface. Hole) 3b is provided.
On the side surface of the work stage 3, the parallel flat plate 5 is accommodated in the holding portion 5 a and attached integrally with the work stage 3.

For the work stage 3, the work stage 3 is moved in the direction of rotation with respect to the optical axis of the exposure light. A work stage moving mechanism 6 that moves in the direction of) is provided, and moves the work W at the time of alignment with the mask M. The work stage moving mechanism 6 includes an XYZθ direction moving mechanism 6a and a spherical seat 6b, and the spherical seat 6b is provided between the work stage 3 and the XYZθ direction moving mechanism 6a.
Further, a work stage slide mechanism 7 for moving the work stage 3 is provided, and the work stage slide mechanism 7 is movably mounted on a base 8 of the exposure apparatus via a rail 7a. The work stage moving mechanism 6 and the work stage 3 are mounted on a work stage slide mechanism 7, and the work stage 3 is separated from the work stage moving mechanism 6 by the work stage slide mechanism 7, for example, in the horizontal direction of the drawing. Move a lot.

Next, detection and alignment of the mask mark and the work mark in the present embodiment will be described with reference to FIGS. 2 and 4 are enlarged views of the vicinity of the mask stage 2 and the work stage 3 shown in FIG. 1, and show a cross section of the apparatus. 3 and 5 are views of the work stage 3 as viewed from above. The alignment microscope 4 is provided with a mechanism for finely adjusting the XYZθ position, but is not moved in principle after adjustment is performed in the manufacturing stage of the apparatus.
FIG. 2 is a diagram showing a state in which the mask mark MAM is being detected by the alignment microscope 4. A mask M on which alignment marks are formed is held on the mask stage 2. In the figure, the mask pattern is omitted.
As shown in the figure, the alignment microscope 4 includes an illumination light source 4a and a detection unit 4d composed of a CCD or the like, and the alignment illumination light from the illumination light source 4a passes through the half mirror 4b and the mirror 4c. The mask mark MAM is irradiated through the parallel flat plate 5 and the mask mark image is received by the detection unit 4d through the parallel flat plate 5, the mirror 4c, and the half mirror 4b.

As shown in FIG. 2, the work stage 3 is moved on the rail 7a in the right direction of the drawing by the work stage slide mechanism 7, and moved to the mask mark detection position shown in FIG. A parallel plate 5 held by a holding portion 5a attached to the side surface of the work stage 3 is inserted between the alignment microscope 4 and the mask M and into the optical path of the alignment illumination light.
Here, as shown in FIG. 3, the parallel flat plate 5 attached to the holding part 5a on the side surface of the work stage 3 is provided along the side surface of the work stage 3 so as to simultaneously cover two alignment microscopes. ing. The reason is that it is easier to increase the processing accuracy of one parallel plate than to manufacture two parallel plates having the same thickness.
There is an opening at the bottom of the holding portion that holds the parallel plate 5, and the illumination light of the alignment microscope 4 passes through the opening.

Returning to FIG. 2, when the illumination light source 4 a of the alignment microscope 4 is turned on, the illumination light is folded back by the half mirror 4 b and the mirror 4 c to illuminate the mask mark MAM via the parallel plate 5.
The image of the mask mark MAM illuminated by the illumination light is reflected by the mirror 4c, passes through the half mirror 4b, enters the detection unit 4d, and is received by the CCD provided in the detection unit 4d.
The position of the mask mark MAM, that is, the surface of the mask M becomes the focal position of the alignment microscope 4 via the parallel plate 5, and the formed mask mark image is displayed on the CCD of the detection unit 4d. The mask mark image detected by the CCD is sent to an apparatus control unit (not shown), subjected to image processing, and its position is stored.
The parallel plate 5 held by the holding unit 5a can be exchanged, and the focus position can be moved to the surface of the mask M in a state where the focus position of the alignment microscope 4 is adjusted to be the surface of the work stage 3. The thing of thickness is selected suitably. If the thickness changes depending on the type of workpiece or the distance between the mask and the workpiece during exposure is changed, the plate is replaced with a parallel plate with a corresponding thickness.

4 and 5 are diagrams showing a state in which the work mark WAM is detected by the alignment microscope 4. FIG.
After the mask mark MAM described with reference to FIG. 2 is detected, the workpiece W is placed on the workpiece stage 3. The alignment mark WAM of the workpiece W is provided on the workpiece W side of the workpiece W and comes over the through hole 3b on the surface of the workpiece stage.
The work stage 3 moves on the rail 7a in the left direction of the drawing, and moves to the work mark detection position as shown in FIGS. The parallel plate 5 is retracted from between the mask M and the alignment microscope 4, and the alignment microscope 4 is inserted into the work stage 3 through the opening 3 a on the side surface of the work stage 3, and the alignment microscope 4 passes through the through hole 3 b. The work mark WAM can be detected.
In this state, the illumination light is turned on, and the workpiece mark WAM on the workpiece W is detected through the through hole 3b.

As described above, when the parallel plate 5 is not inserted, the focus position of the alignment microscope 4 is adjusted to be the surface of the work stage 3, and the surface of the work stage 3 and the position of the work mark WAM in the optical axis direction are adjusted. Therefore, the formed mask mark image is displayed on the CCD of the detection unit 4d of the alignment microscope 4.
The detected work mark image is sent to a control unit (not shown) and subjected to image processing, and its position is detected. Then, the work stage 3 is moved by the work stage moving mechanism 6 so that the previously stored mask mark image and work mark image have a predetermined positional relationship.
This completes the alignment of the mask and the workpiece. Thereafter, exposure light is irradiated from the light irradiation unit 1 shown in FIG.

6 and 7 are views showing a second embodiment of the present invention. Like FIG. 2, the vicinity of the mask stage 2 and the work stage 3 shown in FIG. The configuration is the same as that in FIG. 1, and as described in FIGS. 1 and 2, the work stage moving mechanism 6 and the work stage slide mechanism 7 are provided.
In this embodiment, the mask mark MAM and the work mark WAM are detected from the work stage 3 side as in the first embodiment, but the parallel plate 5 is not attached to the work stage 3 and alignment is performed. It is attached to the microscope 4.
As shown in FIG. 6, the holding portion 5 a that holds the parallel flat plate 5 is attached to the alignment microscope 4 via a support means 5 b that includes, for example, a shaft 51 that expands and contracts and a pressing spring 52. Usually, the holding portion 5a for holding the parallel plate 5 is maintained at a position where the shaft is fully extended. At this time, the parallel plate 5 is located in the optical path of the alignment illumination light.
Further, when the holding portion 5a is pushed to the left side of the drawing, the shaft 51 and the pressing spring 52 are contracted, and the holding portion 5a moves to the left. That is, the parallel plate 5 is provided so as to be movable in a horizontal direction (left and right direction in the drawing) parallel to the moving direction of the work stage.
Note that the parallel plate 5 is configured to cover two alignment microscopes at the same time as described above with reference to FIG.

FIG. 6 is a diagram showing a state in which the mask mark MAM is detected. When the work stage 3 moves to the right side of the drawing and moves to the mask mark detection position, the shaft 51 of the support means 5b is fully extended, and the parallel plate 5 is inserted between the alignment microscope 4 and the mask M.
When the illumination light source 4a of the alignment microscope 4 is turned on, the image of the mask mark MAM illuminated by the illumination light is received by the detection unit 4d of the alignment microscope 4 via the parallel plate 5, as in the first embodiment. , The position is stored.
When the position of the mask mark MAM is detected as described above, as shown in FIG. 7, the work stage 3 moves to the left side of the drawing and detects the work mark WAM.
When the work stage 3 moves as shown in FIG. 7, the alignment microscope 4 is inserted into the work stage 3, and the work mark WAM can be detected by the alignment microscope 4 through the through hole 3b. Further, the work stage 3 pushes the holding portion 5a to the left side, and the shaft 51 and the push spring 52 of the support means 5b contract, and the parallel plate 5 moves to the left side together with the work stage 3.
In this state, the illumination light is turned on, and the workpiece mark WAM on the workpiece W is detected through the through hole 3b.
Then, the work stage 3 is moved by the work stage moving mechanism 6 so that the previously stored mask mark image and work mark image have a predetermined positional relationship.
When the alignment between the mask and the workpiece is completed, exposure light is irradiated from the light irradiation unit 1 shown in FIG. 1 and the workpiece W is exposed to the mask pattern.

FIGS. 8 to 10 are views showing a third embodiment of the present invention. Like FIG. 2, the vicinity of the mask stage 2 and the work stage 3 shown in FIG. The configuration is the same as that in FIG. 1, and as described in FIGS. 1 and 2, the work stage moving mechanism 6 and the work stage slide mechanism 7 are provided.
In this embodiment, as shown in FIG. 12A, the workpiece W is a transparent substrate, and the mask mark MAM and the workpiece mark WAM are detected through the mask M. For this reason, the alignment microscope 4 is provided above the mask M.
In this case, unlike the first and second embodiments, the mask mark MAM is close and the work mark WAM is far from the alignment microscope 4, so that the parallel plate 5 is inserted when detecting the work mark WAM. The focal position will be extended.
Therefore, the parallel plate 5 cannot be provided integrally with the work stage 3 as in the first embodiment, and the holding portion of the parallel plate 5 is provided separately from the work stage 3 as in the second embodiment, The parallel flat plate 5 is inserted and retracted in accordance with the movement of the stage 3. That is, in the point that the holding part 5a of the parallel plate 5 is attached to the alignment microscope 4, it is the same as the second embodiment, but the holding part 5a of the parallel plate 5 is attached to the alignment microscope 4 via the link mechanism 5c, and the mask It is possible to move between M and the alignment microscope 4 in the horizontal direction (left-right direction in the drawing).

As shown in FIG. 8, the link mechanism 5 c has a holding bar 5 a that holds the parallel plate 5 at one end and a push bar 53 that has a contact end that contacts the work stage 3 at the other end. The push rod 53 includes a spring 54 and is attached to an arm member 56 attached to the alignment microscope 5 so as to be rotatable about a shaft 55.
One end of the tension spring 54 is attached to the push rod 53, and the other end is attached to the arm member 56. The upper portion of the shaft 55 of the push rod 53 is pulled toward the arm member 54. .
The holding part 5a of the parallel plate 5 is rotatably attached to the push bar 53 about the shaft 57, and the holding part 5a slides horizontally by a guide (not shown) for holding the parallel plate 5 horizontally. Supported as possible.
For this reason, the parallel plate 5 is normally maintained at a position retracted from the optical path of the alignment microscope 4 by the tension spring 54. However, when the contact end of the push rod 53 is pushed by the work stage 3, the push rod 53 is moved. Rotating about the shaft 55, the tension spring 54 extends and the parallel plate 5 moves horizontally and is inserted into the optical path of the alignment microscope 4.
The configuration of the alignment microscope 4 is the same as that shown in FIG. 2 and the like, and the parallel plate 5 simultaneously covers two alignment microscopes as described with reference to FIG. It is configured as follows.

FIG. 8 is a diagram showing a state in which the mask mark MAM is detected.
The work stage 3 slides to the left in the drawing, and the holding portion 5a of the parallel plate 5 is pulled by the tension spring 54 and retracted from the optical path of the alignment microscope 4. As described above in this state, the image of the mask mark MAM illuminated by the alignment illumination light is received by the detection unit of the alignment microscope 4 and the position thereof is stored.
Further, when the position of the mask mark MAM is detected and stored as described above, the work stage 3 is at the position shown in FIG. 8, and thus the work is placed on the work stage 3 by a transport mechanism (not shown). be able to.

When the position of the mask mark MAM is detected as described above, as shown in FIG. 9, the work stage 3 moves to the right in the drawing, and the work mark WAM of the work W placed on the work stage 3 is detected. To do.
When the work stage 3 is slid rightward by the work stage slide mechanism 7, the push rod 53 of the link mechanism 5 c is pushed by the work stage 3. As a result, the push rod 53 of the link mechanism 5c rotates, the tension spring 54 extends, and the parallel plate 5 is inserted into the optical path between the alignment microscope 4 and the workpiece W.
Thereby, the depth of focus of the alignment microscope 4 is extended, and the image of the work mark WAM illuminated by the illumination light is received by the detection unit of the alignment microscope 4 via the parallel plate 5, and the position thereof is detected.
The work stage 3 is moved and aligned so that the position of the stored mask mark MAM and the detected position of the work mark WAM are in a predetermined positional relationship. This completes the alignment of the mask M and the workpiece W. However, in this state, the alignment microscope 4 is present between the light irradiation unit and the workpiece W, so that exposure cannot be performed.
Therefore, as shown in FIG. 9, the alignment microscope 4 is retracted by a moving mechanism (not shown), and then exposure light is emitted from the light irradiation unit to perform exposure.

It is a figure which shows schematic structure of the exposure apparatus of 1st Example. It is a figure which shows the arrangement | positioning at the time of detecting a mask mark in 1st Example. It is the figure which looked at the work stage from the top in FIG. It is a figure which shows the arrangement | positioning at the time of detecting a work mark in 1st Example. It is the figure which looked at the work stage from the top in FIG. It is a figure which shows the arrangement | positioning at the time of detecting a mask mark in 2nd Example. It is a figure which shows the arrangement | positioning at the time of detecting a work mark in a 2nd Example. It is a figure which shows the arrangement | positioning at the time of detecting a mask mark in a 3rd Example. It is a figure which shows the arrangement | positioning at the time of detecting a work mark in a 3rd Example. It is a figure which shows the state at the time of exposure in a 3rd Example. It is a figure which shows the process of the pattern formation in the case of forming a pattern in both surfaces. It is a figure which shows the alignment at the time of exposing a 2nd pattern to the 2nd surface of a workpiece | work.

Explanation of symbols

1 Light irradiation part (lamp house)
2 Mask stage 3 Work stage 3a Opening 3b Through hole (detection hole)
DESCRIPTION OF SYMBOLS 4 Alignment microscope 5 Parallel plate 5a Holding part 5b Support means 5c Link mechanism 6 Work stage moving mechanism 7 Work stage slide mechanism M Mask W Work MAM Mask alignment mark (mask mark)
WAM work alignment mark (work mark)

Claims (3)

A light irradiation unit that emits exposure light; and
A mask stage for holding the mask;
A work stage for holding a work on which a pattern formed on the mask is exposed;
A mask alignment mark formed on the mask and an alignment microscope for detecting the work alignment mark formed on the workpiece,
An exposure apparatus that aligns a mask alignment mark and a workpiece alignment mark in a predetermined positional relationship, irradiates the work with exposure light from a light irradiation unit through a mask, and performs exposure.
A workpiece that is slid in a direction orthogonal to the optical axis of the exposure light to a mask mark detection position where the alignment microscope detects the mask / alignment mark and a workpiece mark detection position where the alignment microscope detects the workpiece / alignment mark A stage slide mechanism;
A parallel plate that moves the focal position of the alignment microscope,
In the exposure apparatus that inserts and retracts the parallel plate between the mask and the alignment microscope according to the slide movement of the work stage,
The parallel plate is provided integrally with the work stage,
The alignment microscope is arranged to be inserted on the opposite side of the mask with respect to the work stage surface,
The work stage is provided with an opening for inserting the alignment microscope and a detection hole for detecting a work alignment mark by the alignment microscope. The work stage slide mechanism detects the mask mark by the work stage. When moved to the position, a parallel plate is inserted between the mask and the alignment microscope,
The exposure apparatus according to claim 1, wherein when the work stage is moved to a work mark detection position, the parallel plate is retracted from between the mask and the alignment microscope . A light irradiation unit that emits exposure light; and
A mask stage for holding the mask;
A work stage for holding a work on which a pattern formed on the mask is exposed;
A mask alignment mark formed on the mask and an alignment microscope for detecting the work alignment mark formed on the workpiece,
An exposure apparatus that aligns a mask alignment mark and a workpiece alignment mark in a predetermined positional relationship, irradiates the work with exposure light from a light irradiation unit through a mask, and performs exposure.
A workpiece that is slid in a direction orthogonal to the optical axis of the exposure light to a mask mark detection position where the alignment microscope detects the mask / alignment mark and a workpiece mark detection position where the alignment microscope detects the workpiece / alignment mark A stage slide mechanism;
A parallel plate that moves the focal position of the alignment microscope,
In the exposure apparatus that inserts and retracts the parallel plate between the mask and the alignment microscope according to the slide movement of the work stage,
The parallel plate is attached to the alignment microscope via support means, and the support means supports the parallel plate so as to be relatively movable in parallel to the movement direction of the work stage with respect to the alignment microscope. And
The alignment microscope is arranged to be inserted on the opposite side of the mask with respect to the work stage surface,
The work stage is provided with an opening for inserting the alignment microscope, and a detection hole for detecting a work alignment mark by the alignment microscope.
When the work stage is moved to the mask mark detection position by the work stage slide mechanism, the parallel plate is inserted between the mask and the alignment microscope,
When the workpiece is moved to the workpiece mark detection position, wherein said parallel plate is retracted by being pushed by the workpiece from between the mask and the alignment microscope exposure apparatus. A light irradiation unit that emits exposure light; and
A mask stage for holding the mask;
A work stage for holding a work on which a pattern formed on the mask is exposed;
A mask alignment mark formed on the mask and an alignment microscope for detecting the work alignment mark formed on the workpiece,
An exposure apparatus that aligns a mask alignment mark and a workpiece alignment mark in a predetermined positional relationship, irradiates the work with exposure light from a light irradiation unit through a mask, and performs exposure.
A workpiece that is slid in a direction orthogonal to the optical axis of the exposure light to a mask mark detection position where the alignment microscope detects the mask / alignment mark and a workpiece mark detection position where the alignment microscope detects the workpiece / alignment mark A stage slide mechanism;
A parallel plate that moves the focal position of the alignment microscope,
In the exposure apparatus that inserts and retracts the parallel plate between the mask and the alignment microscope according to the slide movement of the work stage,
The parallel plate is attached to an alignment microscope via a link mechanism, and the link mechanism is configured to move the parallel plate relative to the alignment microscope according to the movement of a work stage.
The alignment microscope is arranged to be inserted between the mask and the light irradiation unit,
When the work stage is moved to the work mark detection position by the work stage slide mechanism, the parallel plate is inserted between the mask and the alignment microscope by the link mechanism,
When the workpiece carrier is moved to the mask mark detection position, the exposure apparatus the parallel flat plates you characterized in that retreats from between the mask and the alignment microscope by said link mechanism.

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