KR101693498B1 - Camera light of exposure apparatus and camera light control method - Google Patents

Camera light of exposure apparatus and camera light control method Download PDF

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Publication number
KR101693498B1
KR101693498B1 KR1020150085895A KR20150085895A KR101693498B1 KR 101693498 B1 KR101693498 B1 KR 101693498B1 KR 1020150085895 A KR1020150085895 A KR 1020150085895A KR 20150085895 A KR20150085895 A KR 20150085895A KR 101693498 B1 KR101693498 B1 KR 101693498B1
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KR
South Korea
Prior art keywords
light
exposure
path
substrate
spherical mirror
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KR1020150085895A
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Korean (ko)
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KR20160149001A (en
Inventor
김성봉
오영학
장대우
Original Assignee
주식회사 옵티레이
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane, angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole, quadrupole; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70058Mask illumination systems
    • G03F7/702Reflective illumination, i.e. reflective optical elements other than folding mirrors

Abstract

The exposure apparatus includes an exposure source that emits a first light in a first mode and generates a first path, a second path located on the first path to emit a second light and generate a second path in a second mode, Mode, an exposure stage capable of aligning the substrate, and an upper spherical mirror positioned above the exposure stage and providing the first or second light to the substrate. Thus, the exposure apparatus can control the light path that is emitted from one illumination source to provide illumination over the entire exposure stage.

Description

TECHNICAL FIELD [0001] The present invention relates to a camera illumination and a control method for an exposure apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a camera lighting control technique of an exposure apparatus, and more particularly, to an exposure apparatus that controls light paths diverged from an illumination source to provide illumination to the entire exposure stage.

The exposure apparatus is characterized in that, prior to performing pattern exposure on the exposure target (e.g., substrate or glass) on which the alignment mark is formed using the mask having the alignment mark formed thereon, alignment marks formed on the mask side and alignment marks formed on the exposure target side You must perform alignment. At this time, the conventional exposure apparatus observes the alignment mark formed on the exposure target object through the mask after overlaying the mask and the exposure target object, and simultaneously recognizes the alignment mark formed on the mask side and the alignment mark formed on the exposure target side, Alignment between the alignment mark formed on the side of the exposure target and the alignment mark formed on the side of the exposure target.

Conventional exposure apparatuses require the camera illumination used to recognize the alignment mark to move as the camera moves, and camera illumination corresponding to the number of cameras. That is, each camera may recognize each of a plurality of alignment marks, and each illumination may provide illumination light to each of a plurality of alignment marks. Therefore, an unnecessary configuration and cost arise for adjusting the positions of the exposure target and the mask.

Korean Patent No. 10-0639626 relates to a method of aligning an exposure mask and a method of manufacturing a thin film element substrate, and more particularly, to a method of manufacturing a thin film element substrate by reducing an area required for an alignment mark of a target object while maintaining a minimum allowable distance between the alignment marks in the same exposure mask And a method of manufacturing a thin film element substrate using the same.

Korean Patent No. 10-0583694 relates to a substrate provided with an alignment mark, a mask designing method, a computer program, a mask for exposing the mark, a device manufacturing method and a device thereof, and can correspond to various kinds of patterns, A method of aligning the position of a substrate and a mask by providing alignment marks that can be aligned with the alignment tool of the mask.

Korean Registered Patent No. 10-0639626 (registered on October 23, 2006) Korean Patent No. 10-0583694 (registered on May 19, 2006)

One embodiment of the present invention seeks to provide illumination throughout the exposure stage by controlling the optical path diverged from one illumination source.

One embodiment of the present invention seeks to align the substrate and mask using illumination light diverging along the illumination light path in a substrate alignment mode and to divert the illumination source out of the exposure path in the exposure mode.

One embodiment of the present invention seeks to provide illumination light necessary for a plurality of cameras to recognize a marker of a substrate and a mask using one illumination source.

In embodiments, the exposure apparatus may include an exposure source for emitting a first light and generating a first path in a first mode, a second source for emitting a second light located on the first path in a second mode, An exposure stage that is capable of aligning the substrate, and an upper spherical mirror positioned above the exposure stage and providing the first or second light to the substrate in the first mode, do.

The illumination source may be located on the first path or departing from the first path through linear motion or rotational motion.

The exposure apparatus may further include a light path control unit disposed on the first or second path and reflecting the first or second light to provide the first or second light to the upper spherical mirror.

In one embodiment, the first or second light is diverged by the exposure source or the illumination source, respectively, along the first or second path formed by the light path control section and the upper spherical mirror, Lt; / RTI >

The exposure apparatus may further include a lower spherical mirror positioned below the exposure stage and providing the first or second light to the substrate.

In one embodiment, the exposure apparatus may further include a light path control unit disposed on the first or second path and separating and reflecting the first or second light to provide the first or second light to the upper and lower spherical surfaces.

In one embodiment, the first or second light is diverged by the exposure source or the illumination source, respectively, and the first or second light formed by the light path control section, the upper or lower light path control section, Or reach the exposure stage along a second path.

In one embodiment, the optical path control section may be implemented as a reflector or as a beam splitter.

Wherein the exposure apparatus includes an upper mask between the upper spherical mirror and the exposure stage, the upper mask including a first marker at each of its corners, and a lower mask between the lower spherical mirror and the exposure stage, And a mask holding unit equipped with a lower mask including a second marker.

The substrate may include a third marker disposed between the upper and lower masks and corresponding to each of the first and second markers at the top and bottom of each of the corners.

The exposure apparatus may further include a plurality of cameras disposed under the exposure stage and capable of photographing the first to third markers. The mask holder may adjust the positions of the upper and lower masks based on the first to third markers to bring the upper and lower masks into close contact with the substrate.

Among the embodiments, a camera illumination control method of an exposure apparatus includes the steps of preparing an exposure source for emitting a first light in a first mode and generating a first path, Generating the second path through an optical path control section that reflects the second light and an upper spherical mirror located above the exposure stage using a second light source, , Aligning the substrate aligned on the exposure stage and the top mask in close contact with the substrate at the top of the substrate.

The camera lighting control method of the exposure apparatus may further include the step of releasing the illumination source out of the first path through the linear motion or the rotational motion in the first mode.

The generating of the second path may further include generating the second path through a light path control unit for separating and reflecting the second light and a lower spherical mirror positioned below the exposure stage.

In one embodiment, the camera illumination control method of the exposure apparatus may further include aligning a substrate aligned on the exposure stage and a lower mask closely contacting the substrate at a lower end of the substrate.

The disclosed technique may have the following effects. It is to be understood, however, that the scope of the disclosed technology is not to be construed as limited thereby, as it is not meant to imply that a particular embodiment should include all of the following effects or only the following effects.

The exposure apparatus according to an embodiment of the present invention can control the light path that is emitted from one illumination source to provide illumination to the entire exposure stage.

The exposure apparatus according to an embodiment of the present invention may align the substrate and the mask using the illumination light emitted along the exposure light path in the substrate alignment mode and may release the illumination source out of the exposure path in the exposure mode.

An exposure apparatus according to an embodiment of the present invention can use one illumination source to provide illumination light necessary for a plurality of cameras to recognize a marker of a substrate and a mask.

1 is a perspective view showing an exposure apparatus according to an embodiment of the present invention.
2 is a side view showing the exposure apparatus shown in Fig.
3 is a view showing an illumination area of the camera shown in Fig.
FIG. 4 is a view for explaining the coupling relationship between the substrate and the mask shown in FIG. 1. FIG.
Fig. 5 is a view for explaining the movement process of the illumination source shown in Fig. 1. Fig.
6 is a flowchart illustrating a camera lighting control process performed in the exposure apparatus shown in Fig.

The description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas. Also, the purpose or effect of the present invention should not be construed as limiting the scope of the present invention, since it does not mean that a specific embodiment should include all or only such effect.

Meanwhile, the meaning of the terms described in the present application should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that the singular " include " or "have" are to be construed as including the stated feature, number, step, operation, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In each step, the identification code (e.g., a, b, c, etc.) is used for convenience of explanation, the identification code does not describe the order of each step, Unless otherwise stated, it may occur differently from the stated order. That is, each step may occur in the same order as described, may be performed substantially concurrently, or may be performed in reverse order.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present application.

FIG. 1 is a perspective view showing an exposure apparatus according to an embodiment of the present invention, and FIG. 2 is a side view showing an exposure apparatus shown in FIG. FIG. 3 is a view showing an illumination region of the camera shown in FIG. 1, and FIG. 4 is a view for explaining the coupling relationship between the substrate and the mask shown in FIG. Fig. 5 is a view for explaining the movement process of the illumination source shown in Fig. 1. Fig.

1 and 2, the exposure apparatus 100 includes an exposure source 110, an illumination source 120, an optical path control unit 130, an upper spherical mirror 140, a lower spherical mirror 150, an exposure stage 160 A mask holding unit 170, and a plurality of cameras 180. [

The exposure source 110 may diverge the first light in the first mode and generate a first path. Here, the first mode may correspond to a mode of transferring the circuit pattern using the mask 172 aligned on the substrate 162. [ That is, the first mode refers to a mode in which exposure is performed by the exposure source 110. Also, the first light may correspond to ultraviolet light used for transferring the circuit pattern. The first path may correspond to a path that the first light travels by the optical path control unit 130, the upper spherical mirror 140, the optical path control unit 130, and the lower spherical mirror 150.

 In one embodiment, the exposure source 110 may be implemented with an ultraviolet source (or UV lamp). The exposure source 110 may be disposed at one end of the ultraviolet ray generator 10 and may emit the first light toward the light path control unit 130.

The illumination source 120 may be located on the first path in the second mode to diverge the second light and generate the second path and may be deviated from the first path in the first mode. Here, the second mode may correspond to a mode for adjusting the position of the substrate 162 and the mask 172 in order to align the substrate 162 with the mask 172. That is, the second mode can align the positions of the substrate 162 and the mask 172 so that the exposure operation can be precisely performed on the substrate 162. [ Also, the second light may correspond to visible light provided to the plurality of cameras 180 to photograph the first to third markers 410 to 430 in the second mode. The second path may correspond to a path that the second light travels by the optical path control unit 130 and the upper spherical mirror 140 or the optical path control unit 130 and the lower spherical mirror 150. That is, the second light can reach the entire exposure stage 160 along the second path.

The illumination source 120 may be located on the first path or may be deviated from the first path through a linear or rotational motion. More specifically, the light-moving member 20 may be disposed at one end of the ultraviolet ray generator 10 and mechanically connected to the illumination source 120. [

In Figure 3a, the illumination source 120 may be located on a first path in a second mode to emit a second light. The second light may travel along the second path by the optical path control unit 130, the upper spherical mirror 140, the optical path control unit 130, and the lower spherical mirror 150. The second light may form an illumination region 310 over the entire exposure stage 160 to provide visible light to the imaging regions 320 of the plurality of cameras 180. That is, the exposure apparatus 100 can control the light path that is emitted from one illumination source 120 to form the illumination region 310 in the entire exposure stage 160. The illumination area 310 is formed on the entire exposure stage 160 so that even when the photographing areas 320 of the plurality of cameras 180 are changed, (320). Accordingly, the second light may provide visible light so that the plurality of cameras 180 can photograph the first to third markers 410 to 430. [

In FIG. 3B, the illumination region 310 by the second light may include imaging regions 320 of a plurality of cameras. The imaging regions 320 of the plurality of cameras may be located at the corners of the exposure stage 160, respectively. The first to third markers 410 to 430 may be positioned at each of the corners of the exposure stage 160 and the first to third markers 410 to 430 may be disposed in the photographing areas 320 ). ≪ / RTI >

In Fig. 5A, the illumination source 120 may depart from the first path in the first mode. The illumination source 120 may be displaced out of the first path through a linear or rotational motion by the illumination moving member 20. [ That is, the exposure source 110 can emit the first light without disturbing the illumination source 120 in the first mode.

In FIG. 5B, the illumination source 120 may be located on the first path in the second mode. The illumination source 120 may return on the first path through a motion opposite to that when it is deviated from the first path. That is, the illumination source 120 may block the first path of the first light in the second mode and emit the second light.

In one embodiment, the light path control unit 130 is disposed on the first or second path and may reflect the first or second light to the upper spherical mirror 140. For example, the optical path control unit 130 may be implemented as a reflector or a mirror. That is, the first or second light may be emitted from the exposure source 110 or the illumination source 120, reflected by the light path control unit 130, and provided to the upper spherical mirror 140.

In another embodiment, the light path control unit 130 is disposed on the first or second path and may separate and reflect the first or second light to provide the light to the upper and lower spherical mirrors 140 and 150. For example, the optical path control unit 130 may be implemented as a beam splitter. That is, the first or second light is emitted from the exposure source 110 or the illumination source 120, separated and reflected by the optical path control unit 130, and provided to the upper and lower spherical mirrors 140 and 150 .

The upper spherical mirror 140 is positioned above the exposure stage 160 and may provide the first or second light to the substrate 162. More specifically, the upper spherical mirror 140 may be positioned above the substrate 162 to provide a first or second light to the top of the mask 172 and the substrate 162. In one embodiment, the first or second light may be reflected by the light path control unit 130, reflected by the upper spherical mirror 140, and provided at the top of the exposure stage 160. That is, the first or second light is diffracted by the exposure source 110 or the illumination source 120, respectively, and is incident on the first or second path formed by the optical path control unit 130 and the upper spherical mirror 140 And can reach the exposure stage 160.

The lower spherical mirror 150 is positioned below the exposure stage 160 and can provide the first or second light to the substrate. More specifically, the lower spherical mirror 150 may be positioned below the substrate 162 to provide a first or second light to the lower mask 174 and the lower portion of the substrate 162. In one embodiment, the first or second light may be separated by the light path control unit 130, reflected by the lower spherical mirror 150, and provided at the lower end of the exposure stage 160. That is, the first or second light is diverged by the exposure source 110 or the illumination source 120, and the first or second light is emitted from the light path control unit 130, the upper spherical mirror 140 or the optical path control unit 130 and the lower spherical mirror 150 To reach the exposure stage 160 along the first or second path.

In one embodiment, the spherical mirror may be located above or below the exposure stage 160 and provide a first or second light to the substrate 162.

The exposure stage 160 may align the substrate 162 at its top and the exposure apparatus 100 may transfer the pattern on the mask 172 onto the substrate 162 aligned with the exposure stage 160 . In one embodiment, the substrate 162 is disposed at the bottom of the top mask 172 and at the top of the exposure stage 160, and at the top of each of its corners, a third marker 430 (corresponding to the first marker 410) ). For example, the third marker 430 may be implemented as a hole. The substrate 162 and the top mask 172 may be aligned with respect to the first and third markers 410 and 430.

In another embodiment, the substrate 162 is disposed between the upper and lower masks 172, 174 and corresponds to each of the first and second markers 410, 420 at the top and bottom of each of its corners The third marker 430 may be included. The substrate 162 and the upper and lower masks 172 and 174 may be aligned with respect to the first to third markers 410 to 430.

In one embodiment, the mask holder 170 may mount an upper mask 172 between the upper spherical mirror 140 and the exposure stage 160, including a first marker 410 at each of its corners . For example, the first marker 410 may be implemented as a ring.

The mask holder 170 may be configured to mount the upper mask 172 between the upper spherical mirror 140 and the exposure stage 160 and to hold the upper mask 172 between the lower spherical mirror 150 and the exposure stage 160. [ (174) can be mounted. Here, the bottom mask 174 may include a second marker 420 at each of its corners. For example, the second marker 420 may be implemented as a dot.

4A, the mask holder 170 adjusts the positions of the upper and lower masks 172 and 174 based on the first to third markers 410 to 430 so that the upper and lower masks 172, 174 can be brought into close contact with the substrate 162. More specifically, the illumination source 120 may diverge the second light along a second path, and the plurality of cameras 180 may be configured to emit visible light < RTI ID = 0.0 > Can be provided.

4B, an illumination source 120 may form an illumination region 310 on an exposure stage 160 along a second path, and imaging regions 320 of a plurality of cameras may form an illumination region 310 Respectively. The first to third markers 410 to 430 may be located in the photographing regions 320 of the plurality of cameras. The first marker 410 may be positioned at the center of the third marker 430 and the second marker 420 may be positioned at the center of the first marker 410 to detect the position of the first marker 430, 430 may be aligned. That is, the substrate 162 and the upper and lower masks 172 and 174 may be transferred by the first light in the first mode after being aligned in the second mode.

The plurality of cameras 180 may be disposed under the exposure stage 160 to photograph the first to third markers 410 to 430. More specifically, the plurality of cameras 180 are disposed at the corners beneath the exposure stage 160, respectively, and are arranged at the corners of the substrate 162, the upper or lower masks 172 and 174, respectively, To third markers 410 to 430, respectively.

6 is a flowchart illustrating a camera lighting control process performed in the exposure apparatus shown in Fig.

The illumination source 120 may be located on the first path in the second mode to emit the second light (step S610). The illumination source 120 may provide visible light to the light path control unit 130 to align the substrate 162 and the upper and lower masks 172 and 174. [

The second light may proceed along a second path generated by the optical path control unit 130, the upper spherical mirror 140, the optical path control unit 130, and the lower spherical mirror 150 (step S620). The second light may reach the entire exposure stage 160 by the optical path control unit 130 and the upper spherical mirror 140. In this case, the optical path control unit 130 may be a reflector or a mirror. The second light passes through the optical path control unit 130, the upper spherical mirror 140 or the optical path control unit 130, and the lower spherical mirror 150. In this case, the optical path control unit 130 may be a beam splitter, Thereby reaching the upper and lower portions of the exposure stage 160.

The mask holding portion 170 may align the upper and lower masks 172 and 174 that are in close contact with the substrate 162 and the substrate 162 that are positioned on the exposure stage 160 (Step S630). The mask holding part 170 positions the first marker 410 at the center of the third marker 430 and the second marker 420 at the center of the first marker 410, And lower masks 172, 174, respectively.

The illumination source 120 may be deviated from the first path in the first mode (step S640). The illumination source 120 may be displaced out of the first path through a linear or rotational motion by the illumination moving member 20. [

The exposure source 110 may emit the first light in the first mode and transfer the circuit pattern to the substrate 162 on which the upper and lower masks 172 and 174 are aligned (step S650). The exposure source 110 may transfer a pattern designed to the upper and lower masks 172 and 174 to the top and bottom of the substrate 162.

The exposure apparatus 100 can control the light path that is emitted from one illumination source to provide illumination throughout the exposure stage. The exposure apparatus 100 may align the substrate and the mask using illumination light that is emitted along the illumination light path in the substrate alignment mode, and may release the illumination source out of the exposure path in the exposure mode. In addition, the exposure apparatus 100 can use one illumination source to provide the illumination light necessary for the plurality of cameras to recognize the markers of the substrate and the mask.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims And changes may be made without departing from the spirit and scope of the invention.

100: Exposing device 110: Exposure source
120: illumination source 130: optical path control unit
140: upper spherical mirror 150: lower spherical mirror
160: exposure stage 162:
170: mask holding part 172: upper mask
174: lower mask 180: a plurality of cameras
310: illumination area 320: photographing areas of a plurality of cameras
410: first marker 420: second marker
430: Third marker
10: ultraviolet ray generator 20:

Claims (9)

  1. An exposure source that emits first light in a first mode and generates a first path;
    An illumination source located on the first path in a second mode to emit a second light and generate a second path, the illumination source being out of the first path in the first mode;
    An exposure stage capable of aligning the substrate;
    An upper spherical mirror positioned above the exposure stage and providing the first or second light to the substrate; And
    And a lower spherical mirror positioned below the exposure stage and providing the first or second light to the substrate.
  2. 2. The apparatus of claim 1, wherein the illumination source
    And is positioned on the first path or departs from the first path through linear motion or rotational motion.
  3. The method according to claim 1,
    Further comprising a light path control unit disposed on the first or second path and reflecting the first or second light to provide the first or second light to the upper spherical mirror.
  4. 4. The method of claim 3, wherein the first or second light
    Wherein the light beam is emitted by the exposure source or the illumination source, respectively, and reaches the exposure stage along the first or second path formed by the light path control unit and the upper spherical mirror.
  5. delete
  6. The method according to claim 1,
    Further comprising a light path control unit disposed on the first or second path for separating and reflecting the first or second light to provide the first or second light to the upper and lower spherical mirrors.
  7. The method of claim 6, wherein the first or second light
    Reaching the exposure stage along the first or second path formed by the light path control section and the upper or lower spherical mirror or the light path control section and the lower spherical mirror respectively emitted by the exposure source or the illumination source And the exposure device.
  8. Preparing an exposure source that emits first light in a first mode and generates a first path;
    A second path is created through an optical path control section that emits second light using an illumination source located on the first path in the second mode and reflects the second light and through an upper spherical mirror positioned over the exposure stage step;
    Aligning a substrate positioned on the exposure stage and an upper mask in close contact with the substrate at an upper end of the substrate, based on the second light in the second mode; And
    The step of generating the second path
    A light path control unit for separating and reflecting the second light, and a second path through a lower spherical mirror positioned below the exposure stage.
  9. delete
KR1020150085895A 2015-06-17 2015-06-17 Camera light of exposure apparatus and camera light control method KR101693498B1 (en)

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JP2008103425A (en) 2006-10-17 2008-05-01 Nikon Corp Exposure apparatus, exposure method, and method of manufacturing device
JP2009037026A (en) * 2007-08-02 2009-02-19 Ushio Inc Exposure apparatus of belt-like workpiece, and focus adjusting method in exposure apparatus of belt-like workpiece

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JP3047983B2 (en) * 1990-03-30 2000-06-05 株式会社日立製作所 Fine pattern transfer method and apparatus
KR100583694B1 (en) 2001-05-23 2006-05-25 에이에스엠엘 네델란즈 비.브이. Substrate provided with an Alignment Mark, Method of Designing a Mask, Computer Program, Mask for Exposing said Mark, Device Manufacturing Method, and Device Manufactured Thereby
JP4168344B2 (en) 2004-09-27 2008-10-22 セイコーエプソン株式会社 Method for aligning exposure mask and method for manufacturing thin film element substrate
DE102008004762A1 (en) * 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projection exposure apparatus for microlithography with a measuring device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103425A (en) 2006-10-17 2008-05-01 Nikon Corp Exposure apparatus, exposure method, and method of manufacturing device
JP2009037026A (en) * 2007-08-02 2009-02-19 Ushio Inc Exposure apparatus of belt-like workpiece, and focus adjusting method in exposure apparatus of belt-like workpiece

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