JP2007225727A5 - - Google Patents

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Publication number
JP2007225727A5
JP2007225727A5 JP2006044453A JP2006044453A JP2007225727A5 JP 2007225727 A5 JP2007225727 A5 JP 2007225727A5 JP 2006044453 A JP2006044453 A JP 2006044453A JP 2006044453 A JP2006044453 A JP 2006044453A JP 2007225727 A5 JP2007225727 A5 JP 2007225727A5
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Japan
Prior art keywords
substrate
mask
exposure
imaging
exposure table
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JP2006044453A
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Japanese (ja)
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JP2007225727A (en
JP4764201B2 (en
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Priority to JP2006044453A priority Critical patent/JP4764201B2/en
Priority claimed from JP2006044453A external-priority patent/JP4764201B2/en
Priority to TW96104086A priority patent/TW200805006A/en
Priority to CN200710078862A priority patent/CN100578363C/en
Publication of JP2007225727A publication Critical patent/JP2007225727A/en
Publication of JP2007225727A5 publication Critical patent/JP2007225727A5/ja
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Publication of JP4764201B2 publication Critical patent/JP4764201B2/en
Expired - Fee Related legal-status Critical Current
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Claims (5)

基板を基板搬送手段により露光テーブルに搬送し、前記露光テーブルで前記基板の予備位置決めおよび整合を行ない、露光用光学系を介して露光する基板露光装置であって、
搬送された前記基板を支持してX軸、Y軸、θ軸、およびZ軸の各方向に移動させる露光テーブルと、
この露光テーブルに支持される前記基板に対面するように、透光板を介してマスクを支持する焼枠と、
前記基板を前記マスクに整合移動させるために、前記基板および前記マスクの各整合マークを撮像する第1撮像手段と、
前記透光板を通して前記基板の少なくとも三辺を撮像できる撮像位置および前記露光用光学系の光路から退避する退避位置に移動自在に設けた第2撮像手段と、
この第2撮像手段が撮像できるコントラストを得るために、前記基板の少なくとも三辺に対して照明光を点灯する点灯位置および前記露光用光学系の光路から退避する退避位置に移動自在に設けた照明手段と、
この照明手段および前記第2撮像手段を介して撮像した画像を解析して、前記基板と前記マスクの各整合マークを前記第1撮像手段の視野内に入るように、前記基板を予備位置決めするために前記露光テーブルを制御すると共に、前記第1撮像手段により撮像した画像を解析して、前記基板の整合マークと前記マスクの整合マークとを整合するために前記露光テーブルを制御する制御手段と、を備えることを特徴とする基板露光装置。
The substrate is conveyed to the exposure table by the substrate conveying means, performs preliminary positioning and alignment of the substrate in the exposure table, a substrate exposure apparatus that exposes through an exposure optical system,
An exposure table that supports the transported substrate and moves it in the X-axis, Y-axis, θ-axis, and Z-axis directions;
So as to face the substrate supported in the exposure table, and baked frame for supporting the mask through the transparent plate,
First imaging means for imaging the alignment marks on the substrate and the mask to align the substrate with the mask;
A second imaging means movably provided at an imaging position at which at least three sides of the substrate can be imaged through the translucent plate and at a retracted position retracted from the optical path of the exposure optical system;
In order to obtain a contrast that can be imaged by the second imaging means, illumination that is movably provided at a lighting position at which illumination light is lit on at least three sides of the substrate and a retreat position that is retreated from the optical path of the exposure optical system Means,
In order to pre-position the substrate so that the images captured through the illumination unit and the second imaging unit are analyzed and the alignment marks of the substrate and the mask are within the field of view of the first imaging unit. Controlling the exposure table and analyzing the image captured by the first imaging unit to control the exposure table to align the alignment mark on the substrate and the alignment mark on the mask; A substrate exposure apparatus comprising:
前記制御手段は、前記予備位置決めが前記マスクの辺と前記基板の辺とが平行でかつ予め設定された間隔になるように、前記露光テーブルを制御することを特徴とする請求項1に記載の基板露光装置。   The said control means controls the said exposure table so that the said preliminary | backup positioning may become the space | interval which the edge | side of the said mask and the edge | side of the said board | substrate parallel, and is set beforehand. Substrate exposure device. 前記制御手段は、前記予備位置決めが前記マスクの位置に対して前記基板が予め設定された位置となるように、前記露光テーブルを制御することを特徴とする請求項1に記載の基板露光装置。   2. The substrate exposure apparatus according to claim 1, wherein the control unit controls the exposure table so that the preliminary positioning is a position set in advance with respect to a position of the mask. 3. 前記照明手段は、前記基板の辺に対応してそれぞれ設置される照明灯を点灯位置および退避位置に移動自在にそれぞれ設けたことを特徴とする請求項1に記載の基板露光装置。 2. The substrate exposure apparatus according to claim 1, wherein the illuminating unit is provided with illuminating lamps respectively installed corresponding to the sides of the substrate so as to be movable to a lighting position and a retracted position. 基板搬送手段により露光テーブルに基板を搬入する工程と、
露光テーブルに搬入した基板と、焼枠の透光板を介して支持されるマスクを近接または当接させる工程と、
前記マスクの辺と対応する前記基板の辺について照射光を介して前記透光板を通して第2撮像手段により撮像する工程と、
撮像した前記マスクの辺に対応する前記基板の辺の画像において、その少なくともマスクの三辺の位置と、対応する基板の三辺の位置とのずれ量から、制御手段により解析して予備位置決め量を算出する工程と、
前記マスクおよび前記基板を離間させた状態で、前記制御手段により算出した前記予備位置決め量に基づいて前記露光テーブルを制御して前記基板と前記マスクとを予備位置決めする工程と、
予備位置決めした前記基板を前記マスクに近接または当接する工程と、
前記マスクおよび前記基板の整合マークを第1撮像手段により撮像して前記制御手段により解析してずれ量を算出する工程と、
前記マスクおよび前記基板を離間させた状態で、前記制御手段により算出したずれ量に基づいて前記露光テーブルを整合移動させる工程と、
前記マスクおよび前記基板を近接または当接させ露光用光学系により前記基板を露光する工程と、を含むことを特徴とする基板露光方法。
Carrying the substrate onto the exposure table by the substrate transport means;
A step of bringing the substrate carried into the exposure table close to or in contact with the mask supported via the translucent plate of the printing frame;
Imaging the second side of the substrate corresponding to the side of the mask with the second imaging means through the translucent plate via irradiation light;
In the image of the side of the substrate corresponding to the imaged side of the mask, the preliminary positioning amount is analyzed by the control means from the amount of deviation between the position of at least the three sides of the mask and the position of the three sides of the corresponding substrate. Calculating
Preliminarily positioning the substrate and the mask by controlling the exposure table based on the preliminary positioning amount calculated by the control means in a state where the mask and the substrate are separated from each other;
Approaching or abutting the pre-positioned substrate to the mask;
Imaging the mask and the alignment mark of the substrate by first imaging means, analyzing by the control means, and calculating a deviation amount;
A step of aligning and moving the exposure table based on a shift amount calculated by the control means in a state where the mask and the substrate are separated from each other;
And exposing the substrate with an exposure optical system by bringing the mask and the substrate close to or in contact with each other.
JP2006044453A 2006-02-21 2006-02-21 Substrate exposure apparatus and substrate exposure method Expired - Fee Related JP4764201B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006044453A JP4764201B2 (en) 2006-02-21 2006-02-21 Substrate exposure apparatus and substrate exposure method
TW96104086A TW200805006A (en) 2006-02-21 2007-02-05 Base plate exposure device and base plate exposure method
CN200710078862A CN100578363C (en) 2006-02-21 2007-02-16 Base plate exposure device and base plate exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006044453A JP4764201B2 (en) 2006-02-21 2006-02-21 Substrate exposure apparatus and substrate exposure method

Publications (3)

Publication Number Publication Date
JP2007225727A JP2007225727A (en) 2007-09-06
JP2007225727A5 true JP2007225727A5 (en) 2009-03-26
JP4764201B2 JP4764201B2 (en) 2011-08-31

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JP (1) JP4764201B2 (en)
CN (1) CN100578363C (en)
TW (1) TW200805006A (en)

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CN102768475A (en) * 2012-07-26 2012-11-07 四川聚能核技术工程有限公司 Alignment restoring system and method for exposure machines
KR101707278B1 (en) * 2013-02-25 2017-02-15 가부시키가이샤 스크린 홀딩스 Pattern forming apparatus, pattern forming method, alignment apparatus and alignment method
JP6178090B2 (en) * 2013-03-27 2017-08-09 株式会社Screenホールディングス Pattern forming method and pattern forming apparatus
JP6066764B2 (en) * 2013-02-25 2017-01-25 株式会社Screenホールディングス Pattern forming apparatus and pattern forming method
JP6207843B2 (en) * 2013-02-25 2017-10-04 株式会社Screenホールディングス Alignment apparatus and alignment method
CN105895734B (en) * 2016-02-22 2017-07-28 常州天合光能有限公司 Etching pattern chromatography high accuracy alignment method and device
KR20210078271A (en) * 2019-12-18 2021-06-28 캐논 톡키 가부시키가이샤 Alignment system, film-forming apparatus, alignment method, film-forming method, manufacturing method of electronic device and recording medium of computer program
CN114265287A (en) * 2022-02-07 2022-04-01 广东科视光学技术股份有限公司 Single-side digital photoetching system

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