TW200805006A - Base plate exposure device and base plate exposure method - Google Patents

Abstract

To provide a substrate exposure device and a substrate exposure method suitable for exposing a large thin substrate and capable of performing exposure with high accuracy without requiring a preliminary positioning mechanism which employs a system of pressing and deforming an end face of a substrate to impart load. The device is equipped with: an exposure optical system 22; an exposure table 16; an exposure frame 19 supporting a mask via a light transmitting plate; a first imaging means 27 imaging alignment marks M1, M2; a second imaging means 23 imaging at least two sides of the mask through the light transmitting plate; an illuminating means for the second imaging means; and a controlling means 25 which analyzes an image taken by the second imaging means, controls the exposure table to preliminarily position the substrate so that the substrate and the alignment marks 24 of the mask are within the view field of the first imaging means, as well as analyzes an image taken by the first imaging means and controls the exposure table to align the alignment mark of the substrate and the alignment mark of the mask.

Description

200805006 ^ IX. Description of the Invention: [Technical Fields of the Invention] The present invention relates to a substrate exposure apparatus and substrate exposure method for exposing a pattern such as a circuit to various substrates via a |+ material jinli, and a workfield . [Prior Art]

A known substrate exposure apparatus transports the substrate to a predetermined position (pre-calibration) before being transferred to the exposure chamber (for example, refer to the patent document υ, and then the substrate is carried into the exposure chamber and placed on the exposure stage, The exposure is performed before the exposure (calibration), and then the exposure is performed. The pre-positioning station has a device for loading the roller table and the predetermined position device to pre-position the substrate. The roller table for loading will be formed in the device. A device for supporting the substrate carried in the substrate inlet of the side soil surface in the horizontal direction. Then, the predetermined position device erects a lock or the like in the gap between the rollers of the roller table for loading, and is placed in the loading by the lock. The both end faces of the substrate in the conveyance direction (X direction) of the substrate 2 on the roller table and the both end faces of the substrate orthogonal to the conveyance direction (Υ direction) are preliminarily positioned. Further, the exposure chamber provided with the exposure stage is provided through the photomask. An exposure device for exposing a circuit or the like to various substrates, and a photographing device and a control device for performing a whole human substrate before exposure. In the exposure chamber, by setting 2 a predetermined position The loading side conveyor supports the predetermined substrate on the predetermined position, and is transported to the exposure chamber and placed on the exposure table. Then, the exposure table moves to the yoke and γ while attracting the support substrate. The functions of the shaft, the 轴 axis and the Ζ axis in each direction are such that the substrate to be loaded is in the direction of the x-axis of 2036~8568-PF; the Chentf 5 200805006% is privately moved, and the substrate is opposed to the light-transmitting plate by the burning frame. The reticle facing substrate is pre-positioned on the predetermined position, and the integrated mark of the substrate corresponds to the vicinity of the integrated mark of the reticle. Therefore, the substrate exposure device is used for the reticle and the substrate by a plurality of photographic devices. Each integrated mark is photographed, and the plurality of captured images are analyzed by the control device, and the exposure stage is moved to integrate the integrated marks of the substrate into the integrated mark of the corresponding mask for integration. Thereafter, the substrate exposure device is exposed. The substrate is exposed to light including an ultraviolet ray having a predetermined wavelength by an optical system, and then the substrate is separated from the reticle and carried out by the carry-out side carrier. Patent Document 2 In the same manner as in the patent document, the exposure apparatus performs a predetermined position of the wafer (substrate) in the exposure chamber, transports the wafer to the exposure apparatus, and mounts it on the exposure stage for integration. And the transfer arm transfers the wafer to the wafer cavity, and the wafer held on the wafer cavity is pre-positioned by the transfer system from the upper transfer position to the lower transfer position, and the wafer is pre-positioned. The exposure apparatus of Patent Document 3 does not perform pre-clamping of a predetermined position before the substrate is carried into the exposure chamber, but the substrate is carried in the exposure chamber, placed on the exposure stage, pre-positioned, and then integrated, and then the substrate is made. When the exposure device performs the predetermined position, the wafer (substrate) on the exposure stage is pressed by the pushing portion to correct the position. That is, on the exposure table, a notch groove is formed from the edge of each side toward the center, and the pin edge The notch groove is moved and pressed around the wafer by the pin to the center to thereby reach a predetermined position. Moreover, the substrate used in the conventional substrate exposure apparatus is about 430_x51G_ medium size, and the thickness is qi_ or more, which can be 2036-8568~PF; the positioning device of Ghentf 6 200805006 is used in particular. In the case of t, the substrate is pre-positioned and the contact type structure shown in the patent documents 1, 2, and 3 is incorporated. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-226424 [Patent Document 2] Japanese Patent Publication No. 39342 [Patent Document 3] Japanese Patent No. 3231246

[Problems to be Solved by the Invention] In recent years, the electronic circuit board tends to have a higher density, and the substrate size at the time of exposure becomes (4) larger, and the thickness of the substrate is also becoming thinner. For example, in an electronic circuit substrate, the size of the substrate is 5 Å. __ above and the thickness is below 0.05 dragons to supply to the production line. Above, in the formed circuit, 'L/S = 1〇〇" m is required to be a thin line. Therefore, the operation board (4) environment and mechanism must be handled with considerable skill, and (4) It is produced by equipment that is small in load on the substrate and can be processed in a short time. Further, a large and thin substrate is subject to large deformation due to a small load, and it is required to perform pre-positioning, integration, and exposure without giving a substrate load. Therefore, a large-sized and thin substrate is pre-positioned by contact with a contact type pre-positioning mechanism shown in Patent Documents 2 and 3, and is different from a substrate having a large thickness in that the substrate has a large bending load, so that the substrate is large. The possibility of deformation becomes higher. Further, in the state where the substrate is deformed, when the substrate is transported to the exposure stage, the substrate cannot be attracted and supported on the exposure stage, and the position of the substrate is not fixed, which may adversely affect integration and exposure. Further, in the moving position of the 2036-8568-PF; and the entrance position and the exposure position of the Chentf 7 200805006, the pre-positioning mechanism for pushing the end face of the substrate to perform the predetermined position is unsatisfactory due to the complicated structure or the economy. In view of the above, the present invention provides an exposure apparatus and an exposure method for a substrate, and a mechanism for estimating an end surface of the substrate without pre-positioning a load, and performing high-precision exposure on a large and thin substrate. [Means for solving problems]

In order to solve the above problems, the substrate exposure apparatus of the present invention transports the substrate to the exposure stage by the substrate transfer device, pre-positions and integrates the substrate on the exposure stage, and performs exposure through the exposure optical system, including an exposure stage; Burning the frame, supporting the photomask via the light transmissive plate; a first photographing device for photographing the integrated mark; and a second photographing device for photographing at least two sides of the substrate through the light transmissive plate; And obtaining a contrast that can be captured by the second photographing device; and the control device n is configured to analyze the captured image by the knowing device and the first photographing device, in order to make the integrated mark of the substrate ordering material ± (4) - in the field of view of the photographic device', controlling the exposure stage to pre-position the substrate, and simultaneously analyzing the image captured by the first photographic device, controlling the exposure station to integrate the integrated mark of the substrate and the reticle Integrate tags. The wire exposure apparatus thus constructed conveys the loaded substrate and (4) the light a is supported to move the exposure stage in the z-axis direction so that the substrate faces the mask of the frame. Next, photographing is performed by the second photographing device on at least two sides of the substrate in a state where the light of the illumination device is emitted. Then, the captured image is analyzed, and the size of the substrate and the position of at least two sides of the substrate are 2036-8568-PF; and the relationship between the exposure stations is controlled by the control device on the X-axis and the γ-axis 0-axis. The direction is moved to make a predetermined position. Further, the reticle is an element used in conjunction with a mask of a burnt frame to match a reference mark. Thereby, the integrated mark of the substrate and the photomask enters the field of view of the first imaging device, and then the first imaging device performs photography on the integration target 5 of the substrate and the photomask via the control device. The amount of deviation is calculated from the data, and the substrate is exposed by exposure of the exposure data to the substrate including the ultraviolet light through the exposure optical system. The substrate exposure I is placed on the exposure stage without the need to give a substrate load contact mode, and the substrate is directly sent to the exposure stage, and the substrate is loaded as much as possible while maintaining the plane position and integration. Further, since the substrate and the exposure light are irradiated on the substrate, the substrate is sufficiently fixed to the substrate fixing table, and the adhesion to the mask is high, thereby avoiding pattern defects and other problems, and ensuring accuracy and resolution. High pattern. Even large and thin substrates can be exposed with high precision. Φ In the above substrate exposure apparatus, the control device controls the exposure stage such that the predetermined position is such that a reference mark for engaging the mask is parallel to an edge of the substrate to form a predetermined interval. Further, in the above substrate exposure apparatus, the control means controls the exposure σ such that the predetermined position is at a predetermined position at a position where the substrate is aligned with a reference mark of the mask. Further, in the above substrate exposure apparatus, the illumination device may be arbitrarily moved to a lighting position and a retreat position of the illumination lamps respectively provided corresponding to at least two sides of the substrate. 9 2036-8568-PF; Chentf 200805006 ' With such a configuration, the lighting position of the substrate exposure device illumination lamp can be an arbitrary adjustment position with respect to the side of the substrate. Moreover, the substrate exposure method of the present invention includes the steps of: transporting the substrate to the exposure stage by the substrate transfer device; approaching or contacting the substrate carried into the exposure stage with the light cover supported by the light-transmissive plate of the frame; At least two sides of the substrate are irradiated with light, and the second light-receiving plate is taken by the second image capturing device, and at least two sides of the substrate are offset by the reference mark of the mask on the side of the imaged substrate. The shift amount is calculated by the control device to calculate the displacement amount of the predetermined position; and in the state where the mask and the substrate are separated, the exposure stage is controlled based on the amount of the predetermined position calculated by the control device, and the substrate is The photomask is pre-positioned; the pre-predetermined substrate is brought into contact with or in contact with the photomask; and the integrated image of the photomask and the substrate is photographed by the first photographing device, and the deviation is calculated by the control device And in a state where the reticle is separated from the substrate, the exposure stage is integrated and moved according to the amount of deviation calculated by the control device And causing the photomask and the substrate close to or in contact with, the substrate exposed by the exposure optical system. According to the steps, the substrate is transported to the exposure stage for support, and the position and posture of the entire substrate are observed by the first photographing device, and the exposure station performs a predetermined position 'then' because the substrate and the photomask are used by the first photographing device. By integrating the mark photography and integrating it, the operation of the end face of the substrate is not promoted, and since the load is not applied to the edge of the substrate, the substrate is not deformed and exposed, and a highly accurate and high-resolution pattern can be secured. [Effects of the Invention] 2036-8568-PF/Chentf 10 200805006 • The substrate exposure apparatus and the substrate exposure method of the invention are as follows. The substrate exposure device first analyzes the captured image by the second imaging device, and the control device performs the predetermined position of the substrate via the exposure station. Thereafter, the integrated lens of the photomask and the substrate is photographed by the first camera ti. The device integrates the substrate and the reticle via the exposure station. Therefore, regardless of the size and thickness of the substrate, the substrate exposure apparatus does not push the end surface of the substrate, but pre-positions, integrates, and exposes the substrate and the mask on the exposure stage, thereby reducing the v to become a hindrance to the flatness or position of the substrate. The number of contacts for the main purpose of the original, high-precision exposure can be implemented to ensure a high-precision, resolution pattern. Further, since the substrate exposure apparatus does not require a mechanism for pushing the end faces of the substrate, the structure of the apparatus is not complicated, and the maintenance property and economy are excellent. The exposure method of the substrate is carried out to the substrate on the exposure stage, and the exposure stage is pre-positioned for integration, and the processing time of the substrate is not pushed in order to prevent the end surface of the substrate from being pushed for exposure. The position of the substrate is reduced by the handling device, and the production interval (Curry i in e) can be shortened. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing the configuration of a substrate exposure apparatus and an overall schematic diagram of a control circuit. Fig. 2 is a perspective view showing the arrangement of an exposure stage, a first imaging device, an illumination device, and a second imaging device of the substrate exposure device. Fig. 3 is a plan view showing the positional relationship of the mask and the substrate supported by the burning frame of the substrate exposure apparatus; Chentf 200805006 large plan view.

As shown in Fig. 1, the substrate exposure apparatus 10 is an end surface on which the substrate is not pushed, and in the exposure stage 16, pre-positioning, integration, and exposure are performed. The substrate exposure apparatus 10 includes an exposure stage 16 in the exposure chamber 11, a loading-side substrate conveying device 17 and a carrying-out substrate conveying device 18 which are respectively disposed at positions on both sides of the exposure table, and is supported and disposed on the exposure table. a frame 19 of the mask 上方 above the hexagram, a collimating mirror 22g of the exposure optical system 2 2 that emits light of ultraviolet rays having a predetermined wavelength from above the frame 19, and the optical system for exposure The first photographing device 27 and the second photographing device 23', which are disposed between the collimating mirror 22g of the 22 and the burnt frame 19, have the image at the predetermined position as the image from the first photographing device 27 and the second photographing device 23. The controller A32 and the controller B33 of the control device of the exposure stage 6 are controlled. Further, the exposure optical system 22 is provided as the collimating mirror 22g in the exposure t11 (four), and the other structure to be described later is disposed on the side of the light source chamber (not shown) which is separated from the exposure chamber. 500mmx600mni or more, at the same time integrated mark M2 un 1 system open > into four corners, thickness from about 1mm to below 0. 05mm, the mountain is fine to form a predetermined pattern by exposure (for example, circuit ratio L / S = 100 // m is also a thin thin line). There is a rectangular edge region Mb forming a circuit pattern, one of the predetermined positions of the rectangular region Mb, and the mask position Ma region Ma used herein and the predetermined position or transparent edge region of the transparent rectangular frame Ma are formed. The number of integration marks Ml. 2〇36-8568~PF; Chentf 12 200805006 As shown in Fig. 1, the substrate exposure unit 10 forms the substrate inlet 12 on the side wall of one side of the exposure chamber 11, and the substrate on the other side forms the substrate to be exposed to 11 The loading-side substrate-mounting roller table 14 is provided corresponding to the substrate inlet 12, and the carrying-out substrate-mounting roller table J5 is provided corresponding to the substrate outlet 13.

The exposure stage 16 is provided between the roller table 14 and the roller table 15, and the loading-side substrate conveying device 17 is provided to convey the substrate from the roller table 14 to the exposure table 16, and is also provided for the exposure table 16 from the exposure table 16. The substrate is transported to the roller table 155. The carry-out substrate transport device 1 8 is provided. The loading-side substrate conveying device 17 and the unloading-side substrate conveying device 18 are carried out, and the adsorption pad having the adsorption supporting substrate W and releasing the adsorption support is not shown in detail in the drawings. The adsorption pad vacuum adsorbs the substrate W by a substrate adsorption mechanism (not shown). Further, the two transporting devices 7 and 18 are transported in a state in which the substrate w is flat, and are not particularly limited. For example, the lower surface of the adsorption surface of the plate-shaped body having the hollow portion is provided, and a plurality of the transporting devices are provided in communication with the hollow portion. The small hole is operated by a vacuum generating device (not shown) provided in a corner or outside of the exposure chamber via an air chamber. As shown in FIGS. 1 and 2, the exposure stage 16 supports the substrate w and performs pre-clamping of the I, includes the substrate support table 16a supporting the substrate W, and supports the substrate support table 16a as a horizontal plane. The platform 16b of the moving integrated device and the z-axis direction moving device 16c that supports the χγθ table 16b and moves up and down. The substrate support table 16a mounts the substrate w to be transported to form a plurality of adsorption holes, and sucks and supports the substrate W (not shown). 2036-8568-PF;Chentf 13 200805006 XY 0 station 1 6b includes the X-axis table in the horizontal direction of the X-cylinder + 10,000 upward movement control in the horizontal plane, and the γ-axis in the horizontal plane and the X-axis square The γ-axis table in which the movement control is performed in the direction, and the Θ-axis rotation table that is traversed on the M 4 u in the Θ direction in the orthogonal direction in the direction of the rotation of the through-axis (vertical axis) in the horizontal plane The four-axis combination of four-axis mobile stations. The Z-axis direction moving device i6c has a z-axis for the elevation control, and the upper end side of the z-axis constitutes the support XY 0 table 16b.

Further, the exposure stage 16 may have a configuration in which a χγ ζ stage is provided on the 0-axis rotary table, or a 0-axis rotary table may be provided on the cymbal stand. The burning frame 19 disposed above the exposure stage 16 supports the elements of the mask, including the light-transmitting plate 2, which is supported by the contact of the mask, and the frame 21 supporting the light-transmitting plate 20. Further, the burning frame 19 is configured to adsorb the light-transmitting plate 2 to the frame 21, and has a mask suction mechanism (not shown) for adsorbing the mask to the light-transmitting plate at a predetermined position. Further, the mask M is adsorbed and supported on the burnt frame 19, and the burnt frame 19 is placed on the upper side of the exposure stage 16, and is positioned with high precision at a predetermined position in the coordinates of the control system. The exposure optical system 22 includes an elliptical mirror 22a, a bulb 22b that performs continuous arc discharge at a focus position of the elliptical mirror 22a, and emits light including ultraviolet rays of a predetermined wavelength, and an optical path provided on the optical path of the elliptical mirror 22a. a flat mirror 22c and a second flat mirror 22d, a shutter 22e provided on the optical path reflected from the second flat mirror 22d, and a fly-eye lens 22f, and a collimating mirror provided on the optical path irradiated from the fly-eye lens 221. 22g. Further, the shutter 22e is opened between the exposure of the substrate W 2036-8568-PF; and the Chentf 14 200805006 to control the irradiation time. Since the Δ substrate W does not perform a predetermined position when transported to the exposure stage 16, it is not necessary to perform a predetermined position on the exposure stage 16. Therefore, the substrate exposure apparatus 10 is provided with controllers A32 and B33, and is provided on the second photographing device 23, the illumination device 24, and the controller 25.

The second photographing device 23 is a device for photographing the positional relationship of the mask M and the substrate f for the predetermined position, and includes a photographing element (for example, a (10) camera) 23a that supports the arm 23b of the side photographing element 23a, and moves the arm 23b. Arm moving device (not shown). Further, the photographic element of the second imaging device 23 preferably has a photographic lens and a photographic element having a focal length of about mmm to 12 () G_ and a resolution of less than _ 素. When the first camera device 23 performs photography by the photographic element 23a, the cooking 23b is moved so that the photographic element 23a is above the center corresponding to the squeegee 19, for example, at a height of about 800 〜 12 〇〇 _ from the reticle , overlooking the burning frame (7): the entire shooting position of the side. Further, the second photographing device 23 moves the arm 23b and moves from the photographing position to the position where the sub-head is not generated as the retracted position before the photographing exposure is performed. The second photographing device 23 does not pass through at least two sides of the edge region rib of the transparent rectangular frame of the mask as shown in FIG. 3, and the position of the three sides of the visible substrate W (the shift in the x-axis direction and The shift in the γ-axis direction) and the posture (10) on the tilt of the Θ axis Θ Θ 2) are photographed. Further, the second imaging device 23 may have a lower resolution than a circuit having a final integration accuracy when it is in a predetermined position. For example, an optical system capable of analyzing a magnification of about 昼 昼 can be used with a camera of 1,024 x 768 pixels. 2036-8568-PF; Chentf 15 200805006 Is the Zhiming device 2 4 used to make the second photography pass? The secluded ~ clothes set 23 is set on the captured image in #, the desired contrast. The lighting fixture 1 Μ does not make the substrate f sense, so that it can be clearly seen. The wavelength of the substrate is illuminated by the wavelength of the substrate 24a, the arm of the supporting illumination element 24a, and the arm moving device for moving the arm (10) Not shown). Further, the arm 2 supporting the illumination 24a of the illumination device 24 is synchronized with the movement of the arm 23b of the first imaging device 23, and is set to move to the illumination position 照射 which is irradiated from above the light-transmitting plate 20 (point 7) in,

耵 耵 耵 耵 IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL IL The illumination device 24 is provided with one or more bulbs and fluorescent or LED lighting elements (here three LED lighting elements). In other words, the position of the substrate W (the deviation in the X-axis direction and the deviation in the γ-axis direction) of the substrate W seen by the second imaging device 23 in the edge region Mb (see FIG. 3) of the transparent rectangular frame that passes through the mask M is The posture (the inclination of the Θ axis) is photographed in a vivid manner. The camera is set as a photographic device for integration, and four are provided corresponding to the four corners of the reticle. The first photographing device 27 includes a photographing element (for example, a CCD camera) 27a, an annular illumination element 27b disposed coaxially with the photographing element 27a, an arm 27c supporting the photographing element 27a, and an arm moving device for moving the arm 27c (not Graphic). For the camera component 2 7 a, since the final integration accuracy must be above the resolution of the circuit, it is best to select a high resolution imaging component below 〇 # m/昼素. The annular illumination element 27b can clearly see the position, angle and wavelength of each integrated mark M2, and in order to mix light other than the illumination element itself into 2036-8568~PF; Ghentf 16 200805006 photography device affects the observed image, and adjacent Or close to the shape of the photography element. ～ 27a When the photographing device 27a performs photographing, the photographing element 27a moves over the retracted position in which the frame 19 is separated, and the photographing element 27a is moved to the mating direction via the arm 27c. At the position where the image can be photographed, the pupil and the substrate are integrated with the mark M2 for photographing, and before at least exposure is performed after the photographing is completed, the arm π is moved and retracted from the optical path to the retracted position. Further, the first photographing is performed only after the illuminating device 24 has moved to the retracted position, or may be set in conjunction with the illuminating device 24 without causing an obstruction to the photographing of the photographing device 23. ^ ^ The controller A32 performs image processing on the captured image signals of the first photographing device 27 and the second photographing u 2 . The controller A32 includes a camera input interface 26, 28 for inputting the first camera 27 and the second camera 23, and a calculation device 29 for processing signals from the camera input 26, 28, and the result of the calculation. The input control device 31 and the memory calculation data (the positional offset memory device 35) of the photomask corresponding to the mask f of the substrate f are output and controlled. The camera input interfaces 26, 28 are from the first photography. The second imaging device 23 of the device 27 inputs the imaging signal 'and digitizes the image. The camera input interface 26 inputs an image obtained by photographing at least two or all of the mask M and the substrate w. The wheel user interface (4) inputs a plurality of (four in this case) light W and the target 2〇36-8568-PF respectively photographed from the first photographing device 2; Chentf 17 200805006 ★ The image of the record 1. The calculation device 29 is based on The image data processed by the camera input interface 26 is used to calculate the position of the side of the substrate W, and the position of the substrate w corresponding to the position of the mask matching reference mark and the posture of the tilt is calculated. The area to be processed, as shown in Fig. 1, may be at least the entire edge of the two sides, and a specific area indicated by a three-sided circle. Here, the position means on the exposure stage 16) [Axis direction The position data at the position corresponding to the γ-axis direction, the posture means the angle (θ ing angle) relationship data of the Ζ axis rotation. The calculation device 29 analyzes the position and posture of the substrate W to obtain the position information and the posture information. Based on the position information and the posture information, the calculation device 29 calculates the deviation between the deviation of the mask direction corresponding to the substrate ¥ and the γ direction, and the deviation of the same-day observing posture, and divides the deviation amount by the input/output device 31. The signal is output to the exposure stage 16, and is controlled as the exposure stage 16 of the integrated device. Therefore, when the pre-positioning is performed on the exposure stage 16:: φ integrates the integrated mark (large diameter circle) M2 of the substrate W with the mask μ (small diameter circle) M1 enters the field of view of the first photographing device 27 (refer to Fig. Fig.). According to the image processed on the camera input interface 28, the outline of the image, the outer surface, and the integration of the mask. The positional deviation of the integrated mark with the substrate w is recorded: ± according to the result of the calculation, 'the signal for moving the exposure stage 16 is rotated by the wheel-in/off device 31' to integrate the mask μ with the substrate ^. A device for synthesizing the entire device in synchronization with the controller 。32. Here, the controller 包括33 includes a storage device for storing the execution program, a calculation device for reading and executing the program, and a 〇36-8568- PF;chentf 18 200805006 As the input interface of the signal interface of the "32" and "Exposure #16" is rotated, and the controller B33 controls and implements the movement of the loading side substrate: The operation and exposure of the side substrate transfer device 18 are carried out. The operation of the Z-axis direction moving device 1 6c, the input of the power source of the bulb 22b of the exposure optical system 22, the opening and closing operation of the shutter, the opening and closing of the shutter, and the movement and lighting of the lighting device S24 are performed. The input/output device 34 is an interface for outputting and inputting signals of the controller A32 and the exposure stage 6.

Next, the operation of the substrate exposure apparatus will be described with reference to the flowcharts shown in Figs. 1, 4, and 5. Further, the 4a, 4b, 4c, and 4d are plan views showing the state and the integrated state of the pre-clamping of the photomask and the substrate. Fig. 5 is a flow chart showing the operation of the substrate exposure apparatus. (Step sioi) When the substrate w is supplied to the roller table 14 through the substrate inlet 12 of the exposure chamber u, the loading-side substrate conveying device 17 transports the substrate W onto the exposure table 16 and mounts it, and the exposure table sucks the support substrate. On the other hand, the second photographing device i 23 and the lighting device i 24 are moved to a predetermined position on the optical path. (Step S102) The exposure stage 16 is moved to the z-axis to bring the substrate w close to or in contact with the mask Μ. (Step S103) The illumination device 24 is turned on, and the second imaging device 23 photographs three or all of the substrate W (see FIGS. 3 and 4b). _ (Step S104) The image captured by the second imaging device 23 is used to perform the predetermined amount of movement (deviation amount) of the substrate. (Step S105) The exposure stage 16 is slightly lowered in movement on the Z-axis to separate the substrate 19 2〇36-8568-PF; Chent 200805006, the plate W and the mask Μ. In the case where the mask M is close to the exposure stage i6 in step si 02, step S1 〇 5 is not required. (Step S1 06) The exposure stage is controlled based on the predetermined amount of movement of the movement calculated in the step si〇4. Here, the pre-positioning of the mask M corresponding to the substrate w is completed, and then the second photographing device 23 and the illumination device 24 are moved to the retracted position. (Step S107) The exposure stage 16 is again moved to the z-axis to bring the substrate W close to or in contact with the mask μ. (Step S108) The first photographing device 27 photographs the substrate w and the mask μ and the mark M2 (see Fig. 4C). (Step S109) The image captured by the first imaging device 27 is subjected to the calculation of the amount of deviation (integrated movement amount) for integrating the substrate w. (Step S110) The exposure stage 1β is again slightly moved downward on the z-axis to separate the substrate W from the mask Μ. (Step S111) The exposure stage is controlled based on the amount of deviation (integrated movement s) calculated in step S109. φ (Step S112) The exposure stage 16 is moved to the z-axis so that the substrate is brought close to or in contact with the mask Μ. Thereby, the substrate w corresponds to the mask! ^ Do integration. (Step S113) Again, the first photographing device 27 photographs the integrated mark of the substrate w and the mask ( (see Fig. 4d), and allows the first photographing device 27 to retreat from the optical path within the allowable range, and then performs exposure. After the exposure is completed, the z-axis direction moving device 16c is lowered, the negative pressure of the exposure stage 16 is opened, the substrate w is transported by the carry-out side substrate transfer device 18, and the substrate w is carried out from the substrate exit 13 to the outside of the exposure device, and all the steps are completed. Further, in the case where the step S1 i 3 is outside the allowable range, the step S is repeated. 2036-8568-PF; Chentf 20 200805006 As described above, the substrate exposure apparatus 10 detects the edge of the substrate W by the second imaging device 23 that overlooks the substrate W and the entire mask, and detects the substrate w. 25, on the exposure stage 16, the end surface of the substrate w is not pushed and Λ% is pre-positioned, and then the integration marks Μ and M2 of the substrate w and the mask M are photographed and integrated. Therefore, no load is applied to the edge of the substrate w, and prepositioning, integration, and exposure can be performed. Further, in the substrate exposure apparatus 10, the second imaging device 23 is disposed at a distance of, for example, about 8 〇〇 from the burnt frame 19, and the final integration accuracy is obtained, and the resolution of the circuit is low, for example, W. Next, the first photographic device 27 that overlaps the substrate W and the mask μ is used for sharp and south-precision photography, and the integration of the substrate and the reticle μ can be performed: at this time, the first-photographing device 2 7 is separated from the burnt frame i 9 by, for example, (10) (4) and ffij is known to have a higher resolution than the resolution of the circuit. For example, 1 (W), the substrate exposure apparatus 1 is highly accurate.

According to the substrate exposure apparatus 1G, it is not necessary to perform a predetermined step of applying a load to the conventional substrate w. Regardless of the size and thickness of the substrate, the substrate w; the X-axis Y-axis, the " and the z-axis are moved and controlled. Directly transported to the exposure stage 16. Then, the substrate is exposed to the device 1. The substrate W' is supported by the exposure stage 16 so as to face the reticle 1 and is pre-positioned and integrated on the exposure stage. No load is applied to the edge of the substrate W without bending the plane, so that high-precision exposure can be ensured. A pattern with high precision and resolution. Further, according to the predetermined position of the substrate exposure substrate W and the mask ,, 10, because the exposure table 16 performs a position other than the exposure stage 16, it can be 2〇36~8 5 6B-PF; Chentf 21 200805006, omitted The substrate W is reversed, and a predetermined position mechanism or step for position correction is made, which makes the configuration simple. Further, the light source of the fevming device 24 may be a light bulb or a fluorescent lamp, or may be an LED. Further, the moving device of the two imaging devices 23 and 27 may be a rotating rotating mechanism, and may include a linear sliding mechanism, a ball screw, a motor, or a linear retracting mechanism of a driving system such as a pneumatic cylinder, and light from an exposure light source. The structure that recedes on the road is also OK. Further, as shown in Fig. 3, when the posture of the substrate w is confirmed, _ although the inclination angles 0 1 and 0 2 are different, the inclination angles 0 1 and 0 2 are calculated for all the sides. 3, 0 4 is also possible. As described above, the embodiment of the substrate exposure apparatus and the substrate exposure method of the present invention is described in detail with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, the close exposure method that is not limited to the exposure of the substrate to the mask can be applied to the projection exposure method. ^ [Simple description of the drawing] Fig. 1 is a schematic view showing the structure of the substrate exposure apparatus and the control circuit. Fig. 2 is a perspective view showing the arrangement of an exposure stage, a first photographing device, an illumination device, and a second photographing device of the substrate exposure apparatus of the present invention. Fig. 3 is an enlarged schematic view showing the positional relationship between the reticle and the substrate supported by the burning frame of the substrate exposure apparatus of the present invention. Figures 4a, 4b, 4c, and 4d are schematic views of the state in which the pre-position of the reticle and the substrate is 2018-8568-PF; and the integration of the Chentf 22 200805006. Figure 5 is a flow chart of the substrate of the present invention.

10~ substrate exposure device; 12~ substrate inlet; 14~ roller table; 16~ exposure table; 16a-^ substrate support table; 19~ burn frame; 20~ light transmissive plate; 21~ frame; Device; 25~ controller (control skirts 27~ first camera device; 29~ calculus device; 33a^ one calculus device; 33b, one memory device; 34~ input wheel attack set; I~ reticle rectangular area; M1 ~ Shield integrated area; W ~ substrate. 11 ~ exposure chamber, 13 ~ substrate out π; 15~ roller table j 16b- - integrated device (ΧΥΘ台) 16c^ - Z axis 丨 direction moving device; 17~ moving in Side substrate transfer device 18 to carry-out side substrate transfer device 11 to exposure optical system; 24 to illumination device; 26 to camera input interface; 28 to camera input interface; 31 to input/output device; 32 to controller A (control device) 33~ controller B (control device) Μ ~ reticle; ) Mb ~ edge area of the mask; M2 ~ integrated mark of the substrate; 2036-8568-PF; Chentf 23

Claims (1)

200805006 €? . 10. Patent application scope: 1. A substrate exposure device, the substrate is transported to the exposure table by the substrate transfer device, and the substrate is pre-positioned and integrated on the exposure table, and exposed by the exposure optical system. The method includes: an exposure stage supporting the substrate to be transported to move to the respective directions of the x-axis, the γ-axis, the 0-axis, and the x-axis; and a burning frame supporting the photomask via the translucent plate toward the exposure station Supporting the above substrate; # ― first-photographing device, in order to integrate the substrate to the reticle, photographing the integrated mark of the substrate and the reticle; - the second photographic device 'through the light-transmitting plate Arbitrarily moving to a photographing position for photographing at least two sides of the substrate and a retracted position retracted from the optical path of the exposure optical port; - the illumination device can be arbitrarily moved to obtain a contrast that can be captured by the second photographing device At least two sides of the substrate illuminate a point of illuminating light and a retracted position from the exposure, learning, and optical path retraction; a control device that disassembles the captured image via the illumination device and the second imaging device, and controls the exposure table to cause the substrate to enter in order to allow each integrated mark of the substrate to enter the field of view of the first imaging device Simultaneously analyzing the image taken by the first photographing device to control the exposure stage to integrate the integrated mark of the substrate and the integrated mark of the photomask. [2] The substrate exposure apparatus according to claim 1, wherein 24 2036-8568-PF; Chentf 200805006. The control device controls the exposure stage to make the predetermined position be a reference mark for mating the photomask with the above The sides of the substrate are parallel and formed - a predetermined interval. 3. The substrate exposure apparatus according to claim 2, wherein the control device controls the exposure stage such that the predetermined position is a position of the reference mark integrated with respect to the reticle by the substrate, and is located at a preset position Ji. The substrate exposure apparatus according to claim 1, wherein the illumination device can be moved (4) to a lighting position and a retreat position of the illumination lamp respectively provided corresponding to the sides of the reticle. a substrate exposure method comprising the steps of: transporting a substrate to an exposure stage by a substrate transfer device; approaching or contacting a substrate carried into the exposure stage with a mask supported by the light-transmissive plate of the frame; Light is irradiated to at least two sides of the substrate, and is imaged by the second imaging device through the light-transmitting plate & and the amount of shift of the mask reference mark in the image of the side of the captured substrate is controlled by Calculating the amount of the predetermined position by the device analysis; controlling the exposure stage based on the predetermined amount of the predetermined position calculated by the control device in a state where the reticle and the substrate are separated, and predetermining the substrate and the reticle Positioning the substrate with the predetermined position close to or contacting the photomask; photographing the integrated mark of the photomask and the substrate by the first photographing device, and calculating the deviation amount by the control device; 2036-8568- PF; Chentf 25 200805006 ^ In the state where the reticle is separated from the substrate, the exposure is made according to the amount of deviation calculated by the control device The optical table is integrated and moved; and the photomask and the substrate are brought into close contact or contact with each other, and the substrate is exposed by an exposure optical system. , 2036-85 68-PF; Ghentf 26