JP2006294954A - Exposure system, exposure method, and method for manufacturing microdevice - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure system which can shorten a latency for the operation of a transfer section and for the operation of an exposure device. <P>SOLUTION: An exposure system EXS comprises a transfer H for transferring a substrate P, and an exposure device EX for exposing a predetermined pattern on the substrate. The system further comprises a first position detector 13 for detecting the position of the substrate upon transfer of the substrate to the transfer section, a second position detector for detecting the position of the substrate upon exposure of the substrate in such a state that the substrate is held by the exposure device, and a switch means CONT for switching between the first and second position detectors so as to detect the position of the substrate by at least one of the detectors. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure system for manufacturing a microdevice such as a semiconductor element, a liquid crystal display element, and a thin film magnetic head in a lithography process, an exposure method using the exposure system, and a microdevice manufacturing method using the exposure system. Is.

  In an exposure system composed of an exposure apparatus main body and a transport unit, etc., fine alignment is performed to detect an alignment mark provided on the substrate by a fine alignment system provided in the exposure apparatus main body and finely adjust the substrate position. Since the observation field of view of the fine alignment system is limited, before the fine alignment is performed, the edge portion of the substrate is detected, and coarse alignment is performed in which the substrate position is roughly adjusted.

  Here, in the conventional exposure system, when the transport unit includes a course alignment system for performing the course alignment, as shown in the flowchart of FIG. 10, the substrate is loaded into the transport unit (step S <b> 100). Course alignment of the substrate is performed (step S101), the substrate is transported onto a substrate stage included in the exposure apparatus main body (step S102), fine alignment of the transported substrate is performed (step S103), and exposure has started. (Step S104) (for example, refer to Patent Document 1).

  If the exposure apparatus main body is equipped with a course alignment system that performs course alignment in the conventional exposure system, the substrate is carried into the transport section (step S110) as shown in the flowchart of FIG. (Step S111), coarse alignment (step S112) and fine alignment (step S113) of the transferred substrate were performed, and exposure was started (step S114) (see, for example, Patent Document 2).

JP 2004-273702 A Japanese Patent Laid-Open No. 2004-1924

  By the way, the time required for the transport unit to receive the substrate from which exposure has been completed from the substrate stage, transport the received substrate, and transport the new substrate onto the substrate stage is defined as the transport processing time, and is placed on the substrate stage. In the exposure system described in Patent Document 1, the course alignment is performed by the transport unit when the time required to complete the pattern exposure on the substrate is the exposure processing time. When the total time of the course alignment time and the conveyance processing time is longer than the exposure processing time, a waiting time occurs in the operation of the exposure apparatus main body.

  In the exposure system described in Patent Document 2, since the course alignment is performed by the exposure apparatus main body, when the total time of the course alignment and the exposure processing time is longer than the transport processing time, the transport unit operates. There is a waiting time. The exposure processing time varies because the exposure time varies depending on the exposure pattern, the number of chamfers in one substrate, and the like. That is, since the exposure time is different for each pattern and each substrate, in the conventional exposure system, a waiting time is generated in addition to the transfer processing time and the exposure processing time, resulting in a decrease in throughput.

  An object of the present invention is to provide an exposure system capable of shortening the waiting time of the operation of the transport section and the exposure apparatus main body, an exposure method using the exposure system, and a method of manufacturing a micro device using the exposure system. It is.

  The exposure system according to the present invention is an exposure system including a transport unit that transports a substrate and an exposure apparatus main body that exposes a predetermined pattern on the substrate. When the substrate is transported by the transport unit, the exposure system includes: A first position detection unit that detects a position; a second position detection unit that detects a position of the substrate while the substrate is held by the exposure apparatus body when exposing the substrate; and the substrate of the exposure system And switching means for switching to detect the position of the substrate at least one of the first position detector and the second position detector according to the processing time.

  According to the exposure system of the present invention, the processing time of the substrate, that is, the transport processing time that is the time required from the start of transporting the substrate to the completion of the transport, and the exposure processing that is the time required for the exposure apparatus body to perform the exposure processing. Since the position of the substrate is detected by at least one of the first position detection unit and the second position detection unit according to time, the operation of the transfer unit or the exposure apparatus main body due to the difference in length between the transfer process time and the exposure process time Can be shortened, and exposure can be performed with high throughput.

  The exposure method of the present invention also includes a transport time for transporting the substrate as a first exposure step in an exposure method for transporting the substrate, aligning the substrate, and exposing a pattern on the substrate, and an exposure apparatus. When the alignment of the substrate is performed by a transport unit that transports the substrate as a second exposure step and a first comparison step that compares the exposure time required for exposure of the substrate when the substrate is aligned by the main body Based on the comparison result in the second comparison step, the first comparison step, and the second comparison step, which compares the transfer time and the exposure time required to expose the substrate. And a selection step of selecting two exposure steps.

  According to the exposure method of the present invention, since the first exposure process or the second exposure process is selected based on the comparison results in the first comparison process and the second comparison process, the length of the conveyance process time and the exposure process time is The waiting time for the operation of the transport unit or exposure apparatus main body due to the difference can be shortened, and exposure can be performed with high throughput.

  The microdevice manufacturing method of the present invention includes an exposure step of exposing a predetermined pattern on a photosensitive substrate using the exposure system or exposure method of the present invention, and the photosensitive substrate exposed by the exposure step. And a developing step for developing.

  According to the microdevice manufacturing method of the present invention, since the predetermined pattern is exposed on the photosensitive substrate using the exposure system of the present invention or the exposure method of the present invention, the microdevice can be manufactured with high throughput. it can.

  According to the exposure system of the present invention, the processing time of the substrate, that is, the transport processing time that is the time required from the start of transporting the substrate to the completion of the transport, and the exposure processing that is the time required for the exposure apparatus body to perform the exposure processing. Since the position of the substrate is detected by at least one of the first position detection unit and the second position detection unit according to time, the operation of the transfer unit or the exposure apparatus main body due to the difference in length between the transfer process time and the exposure process time Can be shortened, and exposure can be performed with high throughput.

  Further, according to the exposure method of the present invention, since the first exposure process or the second exposure process is selected based on the comparison results in the first comparison process and the second comparison process, the length of the conveyance process time and the exposure process time is long. The waiting time of the operation of the transport unit or exposure apparatus main body due to the difference can be shortened, and exposure can be performed with high throughput.

  Further, according to the microdevice manufacturing method of the present invention, since a predetermined pattern is exposed on the photosensitive substrate using the exposure system of the present invention or the exposure method of the present invention, the microdevice is manufactured with high throughput. be able to.

  As described above, the present invention is suitable for a photosensitive substrate having an outer diameter larger than 500 mm, particularly for a flat panel display, etc. It is effective for an apparatus and a method for exposing a large substrate.

  Hereinafter, an exposure system according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic block diagram of a device manufacturing system provided with an exposure system according to this embodiment as viewed from above. In the following description, the synchronous movement direction (scanning direction) between the mask M (see FIG. 4) and the substrate P in the horizontal plane is the X direction, and the direction orthogonal to the X direction is the Y direction (non-scanning direction) in the horizontal plane. A direction perpendicular to the X direction and the Y direction is taken as a Z direction. Further, the direction around the Z axis is defined as the θZ direction.

  As shown in FIG. 1, the device manufacturing system includes an exposure system EXS and a coater / developer apparatus CDS. The coater / developer apparatus CDS develops the substrate P after the exposure process in the coating apparatus (coater) C for applying a photoresist to the substrate P before the exposure process and the exposure apparatus main body EX provided in the exposure system EXS. And a developing device (developer) D for carrying the substrate P to the exposure system EXS. The coater / developer apparatus CDS is accommodated in the second chamber CH2 in which the cleanliness is controlled.

  The exposure system EXS includes a transport unit H that transports a flat panel display substrate P having an outer diameter larger than 500 mm between the coater / developer apparatus CDS and the substrate stage PST of the exposure apparatus body EX, an exposure apparatus body EX, and an exposure apparatus And a control device CONT that controls the overall operation of the system EXS. In addition, that an outer diameter is larger than 500 mm means that one side or a diagonal is larger than 500 mm. The exposure system EXS (exposure apparatus main body EX and transport unit H) is accommodated in the first chamber CH1 in which the cleanliness is managed.

  The transport unit H forms part of an interface unit with the coater / developer apparatus CDS, receives the substrate P transported from the transport apparatus 100 of the coater / developer apparatus CDS, and the substrate stage PST and port of the exposure apparatus main body EX. A substrate transfer unit 20 that transfers the substrate P to and from the unit 10 is provided. The port unit 10 also has a function of receiving the exposed substrate P from the substrate transport unit 20.

  FIG. 2 is a diagram illustrating a schematic configuration of the port unit 10 included in the transport unit H. As illustrated in FIG. As shown in FIG. 2, the port portion 10 includes a substrate support portion 1 that supports the substrate P and a tray support portion 2 that supports the tray T. The substrate support portion 1 includes a plate-like first support member 3 and a plurality (eight in this embodiment) of substrate support pins provided on the first support member 3 and supporting the lower surface of the substrate P. 4 is provided. Each of the substrate support pins 4 is erected on the first support member 3, and a lower end portion of each of the substrate support pins 4 is fixed to the first support member 3. To support. A vacuum suction hole connected to a vacuum device is provided on the upper end surface of the substrate support pin 4, and the substrate support pin 4 sucks and holds the substrate P through the vacuum suction hole.

  The substrate support 1 (the first support member 3 and the substrate support pin 4) is connected to the stage device 6 via the connecting member 5. The stage device 6 is configured to be movable in the X-axis, Y-axis, and θZ directions on the base 7, and the positional relationship between the tray T and the substrate P can be adjusted. The stage device 6 is provided with, for example, a stage driving device 8 that is a combination of a motor and a ball screw. The control device CONT moves the stage device 6 in the X axis, Y axis, and θZ directions via the stage driving device 8. . As the stage device 6 moves, the substrate support 1 and the substrate P held by the substrate device 1 also move in the X-axis, Y-axis, and θZ directions.

  The tray support portion 2 is provided with a frame-shaped second support member 9 and a plurality of (eight in this embodiment) tray support pins provided on the second support member 9 and supporting the lower surface of the tray T. 11. Each of the tray support pins 11 stands on the second support member 9, and a lower end portion of each of the tray support pins 11 is fixed to the second support member 9, and a plurality of predetermined positions of the tray T are supported by the upper end portion (upper end surface). . Here, each of the tray support pins 11 is disposed outside the first support member 3 of the substrate support portion 1.

  The tray support 2 (second support member 9 and tray support pin 11) is provided along the guide 12 so as to be movable in the Z direction by a tray support drive device (not shown). The control device CONT moves the tray support 2 in the Z direction via the tray support drive. As the tray support 2 moves, the tray T supported by the tray support 2 also moves in the Z direction. As the tray support unit 2 is raised, the tray T rises and approaches the substrate P to support the lower surface of the substrate P. Here, since the tray support pins 11 are arranged outside the substrate support portion 1, the vertical movement of the tray support portion 2 is not hindered. The guide portion 12 is provided outside the stage device 6, and the connecting member 5 that connects the stage device 6 and the substrate support portion 1 is disposed inside the frame of the second support member 9. The movement of the device 6 and the substrate support 1 in the horizontal direction is not hindered.

  The port unit 10 includes a detection device (first position detection unit) 13 that detects a rough position of the substrate P with respect to the tray T when the substrate P is transported. The detection device 13 is provided at a position below the substrate P supported by the substrate support pins 4 and detects the positions of a plurality of predetermined detection points on the edge portion of the substrate P in a non-contact manner. . The detection device 13 includes a projection unit that projects detection light onto the substrate P, and a light receiving unit that receives reflected light from the substrate P, and a plurality of substrates P based on the reflected light from the substrate P. The position of the detection point of the edge portion of the sensor is optically detected.

  FIG. 3 is a diagram illustrating an arrangement of the detection devices 13 (13A to 13C) that detect the position of the substrate P. As shown in FIG. 3, in this embodiment, the three detection devices 13 </ b> A to 13 </ b> C are arranged at predetermined positions, and are arranged so as to detect the positions of at least two sides of the substrate P having a rectangular shape. . The detection device 13A is arranged at a position where one side on the + Y side of the substrate P can be detected, and the detection devices 13B and 13C are arranged at a position where one side on the + X side of the substrate P can be detected. That is, two detection points are set on one side on the + X side of the substrate P by the detection devices 13B and 13C. Each of the detection devices 13A to 13C projects detection light onto the substrate P, and optically detects the three detection points on the edge portion of the substrate P depending on whether or not the reflected light from the substrate P is received. To detect. The detection signals of the detection devices 13A to 13C are output to the control device CONT. The control device CONT detects the position of the substrate P in the Y direction based on the detection result of the detection device 13A that can detect one side on the + Y side of the substrate P. The control device CONT also determines the position of the substrate P in the X direction and the position in the θZ direction (based on the detection results of the detection devices 13B and 13C that can detect two detection points on one side of the + X side of the substrate P ( The position in the rotation direction) is detected.

  When detecting the position information of the substrate P using the detection devices 13A to 13C, the control device CONT detects the position of the edge portion of the substrate P using the detection devices 13A to 13C while moving the stage device 6. Based on the detection result, position information of the substrate P with respect to the reference position is obtained. In this embodiment, the reference position is the position of the tray support portion 2 that supports the tray T, and hence the tray T, and the control device CONT uses the tray T (tray support) based on the detection results of the detection devices 13A to 13C. The position information of the substrate P with respect to the section 2), that is, the position error amount in the XY direction and the rotation error amount in the θZ direction with respect to the tray T is detected.

  Here, the substrate P shown in FIG. 3 has a square shape in plan view. However, when the substrate P has a rectangular shape, a configuration in which the detection devices 13B and 13C detect two detection points on the long side of the rectangular substrate P is preferable. . By providing two detection points on the long side rather than providing two detection points on the short side, the rotation error amount of the substrate P can be detected with higher accuracy. Even when two detection points are provided on the short side, the position information of the substrate P can of course be detected.

  When detecting the position information of the substrate P, the stage device 6 is moved. For example, first, two detection points on one side on the + X side of the substrate P (long side when the substrate P is rectangular) are detected. Detect and place in the detection area of the detection devices 13B and 13C, and place one detection point on one side on the + Y side (short side if the substrate P is rectangular) in the detection area on the detection device 13A. To detect.

  Returning to FIG. 2, the substrate transport unit 20 constituting a part of the transport unit H is configured to place and transport the substrate P on the tray T, and loads and unloads the substrate P on the substrate stage PST. The substrate transport unit 20 includes a first holding unit 21 that constitutes a part of driving means that holds and transports one end (+ Y side end) of the tray T on which the substrate P is placed, and the first holding unit 21. 2nd holding part 22 which constitutes a part of drive means which can convey while holding the other end part (-Y side end part) of tray T, and the 1st holding part 21 in the Z direction and the Y direction The first mechanism portion 23 that is movably supported, the second mechanism portion 24 that movably supports the second holding portion 22 in the Z direction and the Y direction, and the first and second mechanism portions 23 and 24, respectively. First and second guided portions 25 and 26 to be connected, and first and first linear motors constituting a part of drive means for moving the first and second guided portions 25 and 26 in the X direction. Two driving parts 31 and 32, extending in the X direction, guide the movement of the first and second guided parts 25 and 26 in the X direction. First and a second guide portion 27 that.

  The driving of the first and second mechanism parts 23 and 24 is controlled by the control device CONT. The control device CONT drives the first and second mechanism parts 23 and 24 to move up and down each of the first and second holding parts 21 and 22, and the distance between the first and second holding parts 21 and 22. Can be adjusted. Therefore, the first and second holding portions 21 and 22 can access the tray T by driving the first and second mechanism portions 23 and 24, and can hold and release the tray T. The first and second driving units 31 and 32 and the first and second guide units 27 and 28 extend to the port unit 10 and the substrate stage PST, respectively. The first and second holding units 21 and 22 are port units. 10 and the substrate stage PST.

  FIG. 4 is a schematic perspective view of the device manufacturing system shown in FIG. As shown in FIG. 4, the exposure apparatus body EX illuminates the mask stage MST for supporting the mask M, the substrate stage PST for supporting the substrate P, and the mask M supported by the mask stage MST with the exposure light EL. An illumination optical system IL and a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST are provided. The exposure apparatus main body EX includes a mask M and a substrate P that are synchronously moved in a predetermined direction with respect to the projection optical system PL including a plurality of (in this embodiment, five) projection optical modules PL1 to PL5. This is a multi-lens scan type exposure apparatus that projects and exposes the pattern onto the substrate P.

  The positions of mask stage MST and substrate stage PST are measured and controlled by a laser interferometer (not shown). The laser interferometer used for measuring and controlling the position of the substrate stage PST is a relative position between the movable mirror 50 fixed to the substrate stage PST and a fixed mirror (not shown) fixed to the projection optical system PL. Measurement and control.

  The projection optical system PL includes first-row projection optical modules PL1, PL3, and PL5 arranged in the non-scanning direction, and second-row projection optical modules PL2 and PL4 arranged in the non-scanning direction. An off-axis fine alignment system (second position detection) for aligning the substrate P between the projection optical modules PL1, PL3, and PL5 in the first row and the projection optical modules PL2 and PL4 in the second row. Part) 52 and an autofocus system 54 for adjusting the focus position with respect to the mask M or the substrate P. The fine alignment system 52 detects a minute misalignment of the substrate P with respect to the projection optical system PL by detecting a plurality of alignment marks provided on the substrate P. The detection value detected by the fine alignment system 52 is output to the control device CONT. Similarly, the detection value detected by the autofocus system 54 is output to the control device CONT.

  In addition, the coarse alignment of the substrate P while holding the substrate P, that is, the course alignment for measuring (detecting) the positions of a plurality of predetermined measurement points on the outer peripheral portion (edge portion) of the substrate P in a non-contact manner while holding the substrate P. A system (second position detection unit) 80 is provided. FIG. 5 is a diagram for explaining the position of the course alignment system 80, and FIG. 6 is a diagram showing a schematic configuration of the course alignment system 80. As shown in FIG. 5, three course alignment systems 80 are provided and measure the positions of the three measurement points on the outer peripheral portion of the substrate P without contact. The coarse alignment system 80 is provided on the substrate stage PST, and is attached to a light emitting unit 81 that emits detection light and a position facing the light emitting unit 81 with respect to the substrate P, and can receive the detection light from the light emitting unit 81. A light receiving unit 82.

  The light-emitting unit 81 includes a light guide 88 that emits detection light emitted from a light source (not shown) such as a lamp or a light-emitting diode and collected by the incident unit, and a detection guide emitted from the emission unit of the light guide 88. And a deflection mirror 83 that changes the direction. In the substrate stage PST, an opening 84 for supplying the detection light from the deflection mirror 83 to the substrate P is formed. The detection light reflected by the deflection mirror 83 and passed through the opening 84 irradiates the edge portion (measurement point) of the substrate P.

  The light receiving unit 82 includes an objective lens 85 on which detection light that has passed near the edge of the substrate P is incident, and an imaging lens 86 on which detection light that has passed through the objective lens 85 is incident. The imaging lens 86 forms an image of the edge portion of the substrate P on the image sensor 87. The image sensor 87 is configured by a two-dimensional CCD or the like, and an image signal from the image sensor 87 is output to the control device CONT. That is, imaging signals from a plurality (three in this embodiment) of imaging elements 87 are output to the control device CONT. The control device CONT obtains positional information of the three edge portions of the substrate P based on the three output imaging signals, and based on the obtained positional information of the three edge portions, the X direction of the substrate P with respect to the substrate stage PST and A misalignment amount and a rotation error amount in the Y direction are calculated.

  The control device (switching means) CONT has a transfer unit H according to the processing time of the substrate P in the exposure system EXS, that is, the transfer time by the transfer unit H and the exposure time of the substrate P by the exposure apparatus body EX (time required for exposure). Is switched so that the coarse position of the substrate P is detected in at least one of the course alignment system 80 provided in the detection device 13 or the exposure apparatus main body EX provided in the exposure device main body EX. The transport time is the time when the transport unit H transports the substrate P placed on the tray T after placing the substrate P placed on the substrate stage PST of the exposure apparatus main body EX on the tray T. The substrate P is transferred to the transport apparatus 100, and further, a new substrate is received from the transport apparatus 100, a new substrate placed on the tray T is transported, and a new substrate is placed on the substrate stage PST. It's about time. The exposure time refers to the fine position of the substrate P detected by the fine alignment system 52 after the substrate P is placed on the substrate stage PST, and the fine position of the substrate P is adjusted based on the detection result. This is the time required to start and end the exposure of the substrate P.

  That is, the control apparatus CONT calculates the exposure time based on the exposure shot arrangement of the substrate P in the exposure apparatus main body EX, and compares the calculated exposure time with the transport time. When the transport time is longer than the exposure time, the control device CONT detects the coarse position of the substrate P by the course alignment system 52 so that no waiting time occurs in either the transport time or the exposure time, and the exposure time. Is longer than the transfer time, the detection device 13 switches to detect the rough position of the substrate P. When the transport time and the exposure time are the same, the coarse alignment of the substrate P is detected by the coarse alignment 52 and the detection device 13.

  Next, an exposure method for exposing the substrate P using the exposure system EXS according to this embodiment will be described with reference to the flowchart of FIG.

  First, the control device CONT adds a transport time for transporting the substrate P and a time required for the course alignment when the course alignment of the substrate P is performed by the course alignment system 80 of the exposure device main body EX as the first exposure process. The time required for exposure of the substrate P is calculated, and the calculated transport time as the first exposure process is compared with the exposure time (step S10, first comparison process). Specifically, as the transfer time, after the transfer unit H starts to receive the exposed substrate P from the substrate stage PST, the substrate P is delivered to the transfer apparatus 100, a new substrate is received from the transfer apparatus 100, and a new substrate is received. Is calculated for the time required to complete the mounting on the substrate stage PST. As the exposure time, after the substrate P is placed on the substrate stage PST, the course alignment is performed by the coarse alignment system 80, the fine alignment is performed by the fine alignment system 52, and the exposure to the substrate P is completed. Calculate the time required. Then, the calculated transport time length as the first exposure step is compared with the exposure time length.

  Next, as a second exposure process, the control device CONT transports the substrate P to which the time required for the course alignment when the course alignment is performed by the detection device 13 of the transport unit H, and the exposure of the substrate P. Is calculated, and the calculated transport time as the second exposure process is compared with the exposure time (step S11, second comparison process). Specifically, as the transfer time, the transfer unit H starts to receive the substrate P after the exposure from the substrate stage PST, then transfers the substrate P to the transfer device 100, receives a new substrate from the transfer device 100, and detects the detection device 13. Course alignment is performed, and the time required to finish placing a new substrate on the substrate stage PST is calculated. Further, as the exposure time, after the substrate P is placed on the substrate stage PST, the fine alignment is performed by the fine alignment system 52, and the time required to complete the exposure to the substrate P is calculated. Then, the calculated transport time length as the first exposure step is compared with the exposure time length.

  Next, the control device CONT selects whether to perform exposure in the first exposure process or to perform exposure in the second exposure process based on the comparison result in step S10 and the comparison result in step S11 (step S12). , Selection process). When the difference between the transport time and the exposure time is large and the transport time is longer than the exposure time, the transport by the transport unit H has not ended despite the exposure by the exposure apparatus main body EX being completed. Exposure cannot be performed, and a waiting time occurs in the operation of the exposure apparatus main body EX. In addition, when the difference between the transport time and the exposure time is large and the transport time is longer than the exposure time, the exposure by the exposure apparatus main body EX is not completed even though the transport by the transport unit H is finished. The substrate P that has been exposed cannot be transported, and a waiting time occurs in the operation of the transport unit H.

  Therefore, when the difference between the transport time and the exposure time in the first exposure process is smaller than the difference between the transport time and the exposure time in the second exposure process, the control device CONT selects to perform the exposure in the first exposure process. To do. On the other hand, when the difference between the transport time and the exposure time in the second exposure process is smaller than the difference between the transport time and the exposure time in the first exposure process, the control device CONT selects to perform the exposure in the second exposure process. To do. By doing so, the waiting time that occurs in the operation of the exposure apparatus main body EX and the transport unit H can be shortened.

  When it is selected in step S12 that exposure is performed in the first exposure process, the control device CONT carries the substrate P from the transport device 100 by the transport unit H (step S13), and exposes the substrate P by the transport unit H. The substrate is transferred to the apparatus main body EX (step S14), and the substrate P is placed on the substrate stage PST. Next, the control device CONT calculates the positional deviation amount of the substrate P based on the positional information of the substrate P detected and outputted by the coarse alignment system 80, and moves the substrate stage PST to thereby move the rough position of the substrate P. Is adjusted (step S15).

  On the other hand, when it is selected to perform exposure in the second exposure process in step S12, the control device CONT carries the substrate P from the transport device 100 by the transport unit H (step S16) and is detected by the detection device 13. Based on the output position information of the substrate P, the amount of displacement of the substrate P is calculated, and the coarse position of the substrate P is adjusted by moving the stage device 6 (step S17). Next, the substrate P is transported to the exposure apparatus main body EX by the transport unit H (step S18), and the substrate P is placed on the substrate stage PST.

  Next, fine alignment is performed on the substrate P on which the coarse position has been adjusted in step S15 or on the substrate P on which the coarse position has been adjusted by the transport unit H in step S18 (step S19). That is, the control device CONT adjusts the fine position of the substrate P using, for example, an adjustment mechanism provided in the projection optical system PL based on the fine position information of the substrate P detected and output by the fine alignment system 52. Do. Next, the pattern of the mask M is exposed on the substrate P that has been finely adjusted in step S15 (step S16).

  In the above-described exposure method, either the exposure in the first exposure process or the exposure in the second exposure process is selected, but the exposure time in the first exposure process calculated in step S10 is selected. When the length and the length of the transport time in the second exposure process calculated in step S11 are the same, both the course alignment by the detection device 13 and the course alignment by the course alignment system 80 are performed, and the substrate P is exposed. You may choose to do. In this case, since the coarse alignment of the substrate P is performed by the transport unit H and the coarse alignment of the substrate P is also performed by the exposure apparatus main body EX, the coarse position of the substrate P can be adjusted more reliably.

  According to the exposure system and the exposure method according to this embodiment, according to the transport time by the transport unit H and the exposure time by the exposure apparatus main body EX, the detection apparatus 13 provided in the transport part H or the course alignment provided in the exposure apparatus main body EX. Since the coarse position of the substrate P is detected by the system 80, the waiting time of the operation of the transport unit H and the operation of the exposure apparatus main body EX can be shortened, and exposure can be performed with high throughput.

  In this embodiment, the coarse position of the substrate P is detected by the detection device 13 or the coarse alignment system 80. However, the coarse position of the substrate P is detected by the detection device 13 or the coarse alignment system 80 and is shown in the figure. The information of the substrate P may be acquired by the substrate information acquisition means that does not.

  In this embodiment, the edge portion of the substrate P is detected by the detection device 13 and the coarse alignment system 80 that measure the edge portion of the substrate P in a non-contact manner. You may make it detect the edge part of the board | substrate P using the length measuring device etc. which contact | abut.

  In this way, even with exposure to substrates of the same size, the exposure time including the exposure time, that is, the actual exposure time, the time to move to the next shot, etc. varies depending on the pattern layout to be exposed. Arise. This exposure time varies greatly for a large substrate that allows various layouts, and this variation is particularly large for exposure of a substrate having an outer diameter exceeding 500 mm.

  Further, by performing the course alignment together with the transport unit H and the exposure apparatus main body EX, the positional accuracy of the substrate is improved, and the alignment time in the fine alignment system 52 can be shortened. Also, when the substrate ID is read, the substrate information is written to the substrate, the peripheral exposure to the periphery of the substrate is performed in accordance with the relationship between the transport time and the exposure time, the transport unit H and the exposure apparatus main body EX each have A mechanism may be provided and switched as in the present invention.

  In the exposure system according to the above-described embodiment, the mask (reticle) M is illuminated by the illumination optical system IL, and the transfer pattern formed on the mask M is exposed to the photosensitive substrate P using the projection optical system PL. By performing (exposure step), a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 8 is a flowchart of an example of a method for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the exposure system EXS of the above-described embodiment. Will be described with reference to FIG.

  First, in step S301 in FIG. 8, a metal film is deposited on one lot of plates P. In the next step S302, a photoresist is coated on the metal film on the plate P of one lot by the coating device provided in the coater / developer apparatus CDS. Thereafter, the plate P coated with the photoresist is transported by the transport device 100 to the transport unit H included in the exposure system EXS, and is transported by the transport unit H onto the substrate stage PST of the exposure apparatus main body EX. Next, in step S303, using the exposure apparatus main body EX provided in the exposure system EXS of the above-described embodiment, the image of the pattern on the mask M is placed on the one lot of plates P via the projection optical system PL. Each shot area is sequentially exposed and transferred.

  Thereafter, the exposed plate P is transported from the substrate stage PST to the transport apparatus 100 by the transport unit H, and transported by the transport apparatus 100 to the developing device provided in the coater / developer apparatus CDS. Next, after developing the photoresist on the one lot of plates P by the developing device in step S304, etching is performed on the one lot of plates P using the resist pattern as a mask in step S305. A circuit pattern corresponding to the pattern on the mask M is formed in each shot region on each plate. Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the above-described semiconductor device manufacturing method, exposure can be performed on the plate with high throughput, and a good semiconductor device can be obtained.

  In the exposure system of the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 9, in the pattern formation step S401, a so-called photolithography step is carried out in which the mask pattern is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure system of the above-described embodiment. The By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming process S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like.

  In the cell assembling step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S401 and the color filter obtained in the color filter forming step S402. ). Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, the photosensitive substrate can be exposed with high throughput, and a good liquid crystal display element can be obtained.

It is a figure which shows schematic structure of the exposure system concerning Embodiment. It is a figure which shows schematic structure of the port part concerning embodiment. It is a figure for demonstrating arrangement | positioning of the detection apparatus concerning embodiment. 1 is a schematic perspective view of an exposure system according to an embodiment. It is a figure for demonstrating arrangement | positioning of the course alignment system concerning embodiment. It is a figure which shows the structure of the course alignment system concerning embodiment. It is a flowchart for demonstrating the exposure method concerning embodiment. It is a flowchart which shows the manufacturing method of the semiconductor device as a micro device concerning embodiment. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment. It is a flowchart for demonstrating the conventional exposure method. It is a flowchart for demonstrating the conventional exposure method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Port part, 13 ... Detection apparatus, 20 ... Board | substrate conveyance part, 52 ... Fine alignment system, 54 ... Auto focus system, 80 ... Course alignment system, CONT ... Control apparatus, EXS ... Exposure system, EX ... Exposure apparatus main body, IL: illumination optical system, H: transport unit, M: mask, MST: mask stage, P: substrate, PST: substrate stage, PL: projection optical system, T: tray.

Claims (12)

In an exposure system including a transport unit that transports a substrate and an exposure apparatus main body that exposes a predetermined pattern on the substrate,
A first position detection unit that detects a position of the substrate when the substrate is transferred by the transfer unit;
A second position detection unit that detects the position of the substrate while holding the substrate by the exposure apparatus main body when exposing the substrate;
Switching means for switching to detect the position of the substrate in at least one of the first position detector and the second position detector according to the processing time of the substrate of the exposure system;
An exposure system comprising:   The first position detection unit can detect a rough position of the substrate, and the second position detection unit can detect a rough position and a fine position of the substrate. The exposure system according to claim 1.   The switching means compares the transport time of the substrate with the transport time of the substrate and the exposure time required for exposure of the substrate with the exposure apparatus main body, so that the first position detector or the second position detector of the second position detector. 3. The exposure system according to claim 2, wherein the rough position of the substrate is detected using at least one of them.   The switching means calculates the exposure time based on an array of exposure shots of the substrate in the exposure apparatus body, and compares the calculated exposure time with the transport time to detect the rough position of the substrate. 4. The exposure system according to claim 2, wherein the exposure is performed by at least one of the first position detector and the second position detector.   The exposure system according to any one of claims 1 to 4, further comprising substrate information acquisition means for acquiring information on the substrate.   The exposure system according to any one of claims 1 to 5, wherein the substrate has an outer diameter larger than 500 mm. In an exposure method for conveying a substrate, aligning the substrate, and exposing a pattern on the substrate,
A first comparison step for comparing a transport time for transporting the substrate as a first exposure step and an exposure time required for exposure of the substrate when alignment of the substrate is performed in an exposure apparatus body;
A second comparison step for comparing a transport time when the substrate is aligned in a transport unit that transports the substrate as a second exposure step, and an exposure time required to expose the substrate;
A selection step of selecting the first exposure step or the second exposure step based on the comparison results in the first comparison step and the second comparison step;
An exposure method comprising:   8. The exposure method according to claim 7, wherein the alignment of the substrate includes a coarse alignment operation for rough alignment of the substrate.   9. The exposure method according to claim 7, further comprising a fine alignment operation for finely aligning the substrate when performing exposure with the exposure apparatus main body.   The exposure method according to claim 7, wherein the substrate is a substrate for a flat panel display. An exposure step of exposing a predetermined pattern on a photosensitive substrate using the exposure system according to any one of claims 1 to 6,
A developing step of developing the photosensitive substrate exposed by the exposing step;
A method for manufacturing a microdevice, comprising: An exposure step of exposing a predetermined pattern on a photosensitive substrate using the exposure method according to any one of claims 7 to 10,
A developing step of developing the photosensitive substrate exposed by the exposing step;
A method for manufacturing a microdevice, comprising:

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