JP5908745B2 - Exposure drawing apparatus, program, and exposure drawing method - Google Patents

Description

  The present invention relates to an exposure drawing apparatus, a program, and an exposure drawing method, and in particular, an exposure drawing apparatus that draws an image on a substrate, a program executed by the exposure drawing apparatus, and an exposure that draws an image on the substrate. It relates to a drawing method.

  2. Description of the Related Art In recent years, an exposure drawing apparatus that exposes a circuit pattern by directly irradiating a drawing light onto a substrate without using a transfer mask has been developed as an exposure drawing apparatus that exposes a circuit pattern using a planar substrate as an exposed substrate. When exposing a circuit pattern, it is necessary to draw with high resolution. However, dust attached in the hole processing and dust attached to the hole during the movement process fall on other exposed substrates or in processing such as resist coating. The periphery of the hole may be deformed by heating.

  In such an exposure drawing apparatus, when the substrate to be exposed is fixed to the stage, the substrate to be exposed is placed on the stage so that the center of the substrate to be exposed matches the center of the stage, and then formed on the stage surface. The substrate to be exposed is sucked and held by sucking air from the minute holes, and the end of the substrate to be exposed is clamped by the substrate clamp mechanism in order to cope with the case where the substrate to be exposed is warped or distorted. The method to be applied is applied.

  For example, in Patent Document 1, a clamp member that holds the substrate to be exposed between the stage by pressing a portion of each side of the substrate to be exposed placed on the stage against the stage, and the clamp member is pressed against the stage. A clamp member opening / closing portion that moves between a closed position for clamping the substrate to be exposed and an open position for releasing the clamping of the substrate to be exposed by separating the clamp member from the stage, and clamping from the area on which the substrate to be exposed is placed Between the retracted position in which the member is retracted and the clamp position in which the substrate to be exposed is clamped using the clamp member, the clamp member moving unit that moves the clamp member that is in the open position, and the clamp member is moved to be exposed. Based on the board edge sensor that detects the edge of the board and the board edge detection signal of the board edge sensor, the clamp member moving unit is controlled to move the clamp member to the clamping position. Exposure drawing apparatus is disclosed that includes a control unit for positioning the. With this configuration, the substrate can be reliably clamped even when the substrate to be exposed is warped or distorted.

  Further, as a method of dealing with warpage and distortion of a substrate to be exposed without using a substrate clamping mechanism, Patent Document 2 discloses a method for measuring the height of an exposed surface of a substrate to be exposed and based on acquired measurement data. Focus control is performed so that the focal position of the light beam for exposure coincides with the surface to be exposed, and when the height of the surface to be exposed of the substrate to be exposed is out of a preset range, the surface of the substrate to be exposed is exposed. An exposure drawing apparatus that changes the height of an exposure surface and re-executes measurement is disclosed. With this configuration, the height of the exposed surface of the exposed substrate can be easily set even if the exposed substrate is warped or distorted.

JP 2008-277478 A Japanese Patent Application Laid-Open No. 2006-234921

  In the exposure drawing apparatus disclosed in Patent Document 1, the substrate can be reliably clamped even if the substrate is warped or distorted by the substrate clamping mechanism, but is held by the substrate clamping mechanism. Since the area cannot be exposed, there is a problem that an unexposed area may be generated on the substrate to be exposed by the substrate clamping mechanism.

  In addition, since the exposure drawing apparatus disclosed in Patent Document 2 assumes a setting error of the thickness of the substrate to be exposed, if the substrate to be exposed is deformed due to warpage or distortion, the height of the stage is high. In some cases, it was not enough to change the size.

  The present invention has been made in view of the above problems, and an exposure drawing apparatus capable of suppressing generation of a defective substrate due to deformation of a substrate to be exposed while minimizing generation of an unexposed region by a substrate clamping mechanism, An object is to provide a program and an exposure drawing method.

In order to achieve the above object, an exposure drawing apparatus according to claim 1, wherein a first fixing part for adsorbing and fixing an exposed substrate and a second fixing for holding and fixing an end of the exposed substrate are fixed. An exposure unit that draws a circuit pattern by exposing the substrate to be exposed, a height measuring unit that measures a height of an exposed surface of the substrate to be exposed, and the first fixing unit In a state where the substrate is fixed, the height measured by the height measuring unit when the substrate to be exposed is fixed by the second fixing unit and then the fixing by the second fixing unit is released is a predetermined range. Control for controlling exposure of the substrate to be exposed by the exposure unit while maintaining fixation of the substrate by the first fixing unit and releasing fixing by the second fixing unit. Means.

  According to the exposure drawing apparatus according to claim 1, the substrate to be exposed is sucked and fixed by the first fixing portion, and the end portion of the substrate to be exposed is sandwiched and fixed by the second fixing portion, A circuit pattern is drawn by exposing the substrate to be exposed by the exposure unit, and the height of the substrate to be exposed is measured by the height measuring unit.

  Here, in the present invention, the control means releases the fixation by the second fixing portion after fixing the exposure substrate by the second fixing portion in a state where the exposure substrate is fixed by the first fixing portion. When the height measured by the height measuring unit is within a predetermined range, the substrate to be exposed is fixed by the first fixing unit and the fixing by the second fixing unit is released. In this state, the exposure unit is controlled to expose the substrate to be exposed.

  That is, when the substrate to be exposed is fixed by the first fixing portion, if the height of the exposure surface of the substrate to be exposed is out of the range, that is, if the fixing by the first fixing portion is insufficient, the second fixing is performed. If the edge of the substrate to be exposed is held by the part to try to correct the warp or distortion of the substrate to be exposed, the warp or distortion of the substrate to be exposed is corrected, and the height of the exposed surface is within the range. In this case, the substrate to be exposed is exposed in a state where the substrate to be exposed is fixed only by the first fixing portion.

  Thus, according to the exposure drawing apparatus according to claim 1, when the fixing by the substrate clamping mechanism (second fixing portion) is unnecessary, the substrate clamping mechanism is controlled so as not to be fixed by the substrate clamping mechanism. The generation of defective substrates due to the deformation of the exposed substrate can be suppressed while the generation of unexposed areas due to the above is minimized.

  In the present invention, as in the invention described in claim 2, the control means is configured such that the height measured by the height measuring unit in a state where the substrate to be exposed is fixed by the second fixing unit. When the height measured by the height measuring unit within the range and when the fixing by the second fixing unit is released is out of the range, the fixing of the exposed substrate by the first fixing unit is maintained. In addition, the exposure unit may be controlled to expose the substrate to be exposed in a state where the substrate to be exposed is fixed by the second fixing unit. Thereby, even when the substrate clamping mechanism does not correct the warpage or distortion of the substrate to be exposed, the substrate to be exposed can be exposed.

  Further, according to the present invention, as in the invention described in claim 3, the control means is configured such that the height measured by the height measuring unit in a state where the substrate to be exposed is fixed by the first fixing unit. If within the range, the exposure unit exposes the substrate to be exposed in a state where the exposure of the substrate to be exposed by the first fixing unit is maintained without fixing and releasing the fixing by the second fixing unit. You may make it control so that it may perform. As a result, when the substrate to be exposed is not warped or distorted, the substrate to be exposed can be easily exposed.

  Further, according to the present invention, as in the invention according to claim 4, the control unit is configured to adjust the height measured by the height measuring unit in a state where the substrate to be exposed is fixed by the second fixing unit. When the amount of displacement is included in the range, the height of the substrate to be exposed is adjusted so that the surface to be exposed of the substrate to be exposed is in the range, and the exposure unit exposes the substrate to be exposed. You may make it control to perform. Thereby, even when the height of the substrate to be exposed is set incorrectly, the substrate to be exposed can be exposed.

On the other hand, in order to achieve the above object, the program according to claim 5 includes a first fixing unit that sucks and fixes the substrate to be exposed and a second fixing unit that pinches and fixes the end of the substrate to be exposed. A fixing unit; an exposure unit that draws a circuit pattern by exposing the substrate to be exposed fixed by the first fixing unit; and a height measuring unit that measures a height of an exposed surface of the substrate to be exposed. A program executed by the exposure drawing apparatus, wherein the substrate to be exposed is fixed by the first fixing unit, the substrate to be exposed is fixed by the second fixing unit, and then the second fixing unit A first control unit that measures the height when the fixing is released by the height measuring unit; and the first fixing unit when the height measured by the height measuring unit is within a predetermined range. Fixing the exposed substrate by A second control means for maintaining and while releasing fixation by the second fixing section performs exposure of the substrate to be exposed by the exposure unit, to function as a.

  Therefore, according to the program described in claim 5, since the computer can be operated in the same manner as in the invention described in claim 1, as in the invention described in claim 1, the unexposed area by the substrate clamping mechanism is obtained. The generation of defective substrates due to deformation of the substrate to be exposed can be suppressed while minimizing the occurrence of the above.

  According to the present invention, as in the invention described in claim 6, the first control means measures the height even when the first control means fixes the substrate to be exposed by the second fixing portion. The height is measured by the second measuring unit, the height measured by the height measuring unit in a state where the substrate to be exposed is fixed by the second fixing unit and the second measuring unit is within the range. When the height measured by the height measurement unit when the fixing by the fixing unit is released is out of the range, the substrate to be exposed is fixed by the first fixing unit and the second fixing unit You may make it expose the said to-be-exposed board | substrate by the said exposure part in the state which fixed the said to-be-exposed board | substrate. Thus, similarly to the second aspect of the invention, the substrate to be exposed can be exposed even when the substrate clamping mechanism does not correct the warp or distortion of the substrate to be exposed.

On the other hand, in order to achieve the above object, the exposure drawing method according to claim 7, the first fixing part for sucking and fixing the substrate to be exposed and the end of the substrate to be exposed are sandwiched and fixed. A second fixing unit; an exposure unit that draws a circuit pattern by exposing the exposed substrate fixed by the first fixing unit; and a height measurement that measures a height of an exposed surface of the exposed substrate. An exposure drawing method in an exposure drawing apparatus comprising: a second fixing unit after the substrate to be exposed is fixed by the second fixing unit in a state where the substrate to be exposed is fixed by the first fixing unit. A first control step of measuring the height when the fixing by the height is released by the height measuring unit, and a height measured by the height measuring means in the first control step is within a predetermined range The first fixing part. Wherein and and a second control step of performing exposure of the substrate to be exposed by the exposure unit in a state in which maintain a fixed substrate to be exposed and to release the fixing by the second fixing unit.

  Therefore, according to the exposure drawing method according to the seventh aspect, since it operates in the same manner as the invention according to the first aspect, generation of an unexposed area by the substrate clamping mechanism is generated as in the first aspect. Generation of a defective substrate due to deformation of the substrate to be exposed can be suppressed while minimizing.

  In the present invention, as in the invention described in claim 8, in the first control step, the height measurement unit measures the height even when the substrate to be exposed is fixed by the second fixing unit. In the second control step, the height measured by the height measuring unit in a state where the substrate to be exposed is fixed by the second fixing unit is within the range, and the fixing by the second fixing unit is performed. When the height measured by the height measurement unit when released is outside the range, the substrate to be exposed is maintained by the first fixing unit and the substrate to be exposed is fixed by the second fixing unit. You may make it expose the said to-be-exposed board | substrate by the said exposure part in the fixed state. Thus, similarly to the second aspect of the invention, the substrate to be exposed can be exposed even when the substrate clamping mechanism does not correct the warp or distortion of the substrate to be exposed.

  According to the present invention, it is possible to suppress generation of a defective substrate due to deformation of a substrate to be exposed while minimizing generation of an unexposed region by the substrate clamping mechanism.

It is a perspective view which shows the structure of the exposure drawing apparatus which concerns on embodiment. It is a disassembled perspective view of the board | substrate clamp mechanism part of the exposure drawing apparatus which concerns on embodiment. It is an expanded sectional view for demonstrating the function of the photo sensor of the exposure drawing apparatus which concerns on embodiment. (A) And (B) is sectional drawing of the operation direction along the optical axis which shows the structure of the exposure head of the exposure drawing apparatus which concerns on embodiment. It is an external view which shows the focusing mechanism of the exposure head of the exposure drawing apparatus which concerns on embodiment. (A) And (B) is explanatory drawing which shows operation | movement of the focusing mechanism of the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the electric system of the exposure drawing apparatus which concerns on embodiment. It is a flowchart which shows the flow of a process of the 1st process program which concerns on embodiment. It is a flowchart which shows the flow of a process of the 2nd processing program which concerns on embodiment. It is a flowchart which shows the flow of a process of the 3rd processing program which concerns on embodiment. It is a schematic side view of the to-be-exposed board | substrate for demonstrating the 3rd process which concerns on embodiment. It is a flowchart which shows the flow of a process of another example of the 4th process program which concerns on embodiment.

  Hereinafter, the exposure drawing system according to the present embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, as the exposure drawing apparatus 1, a flat substrate such as a printed wiring board and a flat panel display glass substrate is used as the exposure substrate C, and exposure drawing is performed on one or both sides of the exposure substrate C. Will be described as an example.

  FIG. 1 is a perspective view showing a configuration of an exposure drawing apparatus 1 according to the present embodiment. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction on the horizontal plane is defined as the X direction, and the direction perpendicular to the Y direction on the vertical plane is defined as the Z direction. The direction of rotation about the Z axis is defined as the θ direction.

  As shown in FIG. 1, the exposure drawing apparatus 1 includes a flat plate stage 10 for fixing a substrate C to be exposed. On the upper surface of the stage 10, a suction mechanism (not shown) having a plurality of suction holes 10a for sucking air is provided in a region where the substrate C to be exposed is placed. The suction mechanism is configured to suck the air between the exposed surface C and the stage 10 from the suction hole 10 a when the exposed substrate C is fixed to the upper surface of the stage 10, so that the exposed substrate C is placed on the upper surface of the stage 10. The substrate to be exposed C is sucked and held on the stage 10 by vacuum suction.

  The suction hole 10 a is provided so as to penetrate in the thickness direction of the stage 10. In addition, the stage 10 is provided with an air chamber (not shown) for storing the air sucked from the suction hole 10a. A gas suction unit having a vacuum pump or the like is connected to the air chamber via an electromagnetic valve, and the negative pressure of the air chamber is controlled by controlling the electromagnetic valve and the gas suction unit by a system control unit 91 described later. Is controlled.

  Further, the stage 10 is configured to be movable in the Y direction, and the substrate C to be exposed fixed to the stage 10 moves to the exposure position along with the movement of the stage 10, and then the light is emitted by the exposure unit 16 described later. The beam is irradiated, and an image such as a circuit pattern is drawn on one surface.

  The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. In addition, a moving mechanism unit 13 having a moving drive mechanism (not shown) configured by a motor or the like is provided between the base 12 and the stage 10, and the stage 10 is connected to the stage 10 by the moving mechanism unit 13. It can be translated in the thickness direction (Z direction; hereinafter also referred to as height direction).

  One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported by a guard rail 14 so as to be reciprocally movable, and is moved by a stage driving unit (stage driving unit 71 described later) constituted by a motor or the like. The stage 10 is moved along the guide rail 14 by being supported on the upper surface of the movable base 12.

  A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14, and an exposure unit 16 is attached to the gate 15. The exposure unit 16 is composed of a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from the light source unit 17 and a signal cable 20 drawn from the image processing unit 19 are connected to the exposure unit 16.

  Each exposure head 17 has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on image data input from the image processing unit 19 to emit light from the light source unit 17. The exposure drawing apparatus 1 performs exposure by modulating the beam and irradiating the substrate C with this light beam. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

  Further, the guide rail 14 is provided with a plurality of (in this embodiment, five) laser displacement meters 22. The laser displacement meter 22 includes a light emitting element and a light receiving element, and light emitted from the light emitting element is condensed through a light projecting lens and irradiated onto an exposed surface of a substrate to be exposed. Then, a part of the light diffusely reflected on the exposed surface forms a spot on the light receiving element through the light receiving lens. The laser displacement meter 22 measures the height of the exposed surface by detecting the position of the spot by using the movement of the spot position according to the height of the exposed surface (position in the Z direction). The plurality of laser displacement meters 22 are respectively provided at different positions in the X direction, and each of the exposed surfaces of the exposed substrate C according to the movement of the exposed substrate C placed on the stage 10 in the Y direction. Measure the height of the location continuously.

  A gate 23 is provided on the top surface of the base 11 so as to straddle the guide rail 14. One or a plurality (two in the present embodiment) of image capturing units 24 for photographing the substrate C to be exposed placed on the stage 10 is attached to the gate 23. The photographing unit 24 is a CCD camera or the like with a built-in strobe with a very short light emission time. Each photographing unit 24 is installed so as to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 on a horizontal plane, and is drawn or formed on the substrate C to be exposed for alignment. It is installed to photograph the alignment mark. When the exposure drawing apparatus 1 draws a circuit pattern on the substrate C to be exposed, the exposure drawing apparatus 1 adjusts the drawing position based on the position of the alignment mark photographed by the photographing unit 24.

  A substrate clamping mechanism 30 for firmly fixing the substrate C to be exposed to the stage is provided on the upper surface of the stage 10.

  FIG. 2 is an exploded perspective view of the substrate clamp mechanism 30 of the exposure drawing apparatus 1 according to the present embodiment. As shown in FIG. 2, the substrate clamping mechanism unit 30 includes a pair of parallel clamp bars 31 a and 31 b that clamp the end portion of the substrate C to be exposed from above, and a vertical position in the horizontal plane with respect to the clamp bars 31 a and 31 b. And a pair of parallel clamp bars 31c and 31d for clamping the edge of the substrate C to be exposed from above, and moving units 32a to 32d for translating these clamp bars 31a to 31d in the horizontal direction, respectively. doing. The moving units 32a to 32d move the clamp bar 31a and the clamp bar 31b toward each other or away from each other, and move the clamp bar 31c and the clamp bar 31d toward each other or away from each other. By the moving units 32a to 32d, the clamp bars 31a to 31d can sandwich and fix the substrate C to be exposed between the stage 10 without depending on the size of the substrate C to be exposed. The clamp bars 31 a to 31 d are respectively disposed above the stage 10, and the moving units 32 a to 32 d are disposed below the stage 10. The clamp bars 31a and 31b are formed to be shorter than the clamp bars 31b and 31d, and the clamp bars 31a to 31d do not collide with each other even when the size of the exposed substrate C is small. It is configured as follows.

  The clamp bar 31a is fixed to a metal (for example, aluminum) clamp holder 33 and an inner region (a region on the center side of the stage 10) on the lower surface of the clamp holder 33, and is made of a resin that contacts the surface C1 of the substrate C to be exposed. The clamp blade 34 and two support pillars 35 provided in the outer region (outer region of the stage 10) on the lower surface of the clamp holder 33. The stage 10 has one or more insertion holes 37 penetrating in the front and back direction and extending in the Y direction or the X direction from the end toward the center in each side at a predetermined interval (in this embodiment, Two (a total of eight) are formed on each side, and the two support pillars 35 of the clamp bar 31a are inserted into two insertion holes 37 of the three insertion holes 37 on each side. The clamp bars 31b to 31d have the same configuration as the clamp bar 31a.

  The moving unit 32a includes a support plate 40 that supports two support columns 35, and an air cylinder 41 that slides the support plate 40 in the Z direction. The tip of the piston rod 42 of the air cylinder 41 is fixed to the lower surface of the support plate 40. The air cylinder 41 lowers and raises the piston rod 42 by a drive unit constituted by a pump or the like. The movable range of the piston rod 42 is limited and stops at a predetermined position when the piston rod 42 is lowered and raised.

  When the piston rod 42 is lowered, the clamp bar 31a is lowered together with the piston rod 42, and the clamp bar 31a is pressed against the stage 10. Here, when the substrate to be exposed C is placed on the stage 10, the substrate to be exposed C is clamped by the clamp bar 31a. On the other hand, when the piston rod 42 rises, the clamp bar 31a rises together with the piston rod 42, and the clamp bar 31a moves away from the stage 10 in the Z direction. The distance that the clamp bar 31a is separated from the stage 10 is larger than the thickness of the substrate C to be exposed. The state of the clamp bar 31a when the clamp bar 31a is pressed against the stage 10 is referred to as a closed state (closed position), and the state of the clamp bar 31a when it is separated from the stage 10 is referred to as an open state (open position).

  The moving unit 32a further includes a driving pulley 44 and a driven pulley 45 arranged in the X direction at a predetermined interval, a timing belt 46 stretched between these pulleys 44 and 45, and a belt drive for rotating the driving pulley 44. And a motor 47. The belt drive motor 47 can rotate forward and backward. An air cylinder 41 is attached to the timing belt 46 via an attachment portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 move in the X direction along the insertion hole 37, thereby clamping. The bar 31a moves in the X direction. The clamp bar 31a slides while supporting the support column 35 along the insertion hole 37, the retraction position where the support column 35 is positioned at the outer peripheral end of the stage 10 of the insertion hole 37, and the support column 35 the insertion hole 37. The stage 10 moves between the center position located at the inner end. Note that the position of the clamp bar 31a when the clamp bar 31a clamps the peripheral edge of the substrate C to be exposed (any position between the retracted position and the center position) is referred to as a clamp position.

  The moving units 32b, 32c, and 32d have the same configuration as the moving unit 32a. However, the moving unit 32b moves the clamp bar 31b in the Z direction and the X direction, the moving unit 32c moves the clamp bar 31c in the Z direction and the Y direction, and the moving unit 32d moves the clamp bar 31d in the Z direction and Move in Y direction.

  FIG. 3 is an enlarged cross-sectional view for explaining the function of the photosensor 49 of the exposure drawing apparatus 1 according to the present embodiment. As shown in FIGS. 2 and 3, the support plate 40 of the moving unit 32a is provided with a reflective photosensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C to be exposed. The photo sensor 49 is attached to the support plate 40 and is provided at a position corresponding to the insertion hole 37, that is, a position where the photo sensor 49 is exposed from the insertion hole 37 when viewed from above. The photosensor 49 includes a light projecting unit that emits inspection light upward and a light receiving unit that receives the inspection light reflected by the back surface C2 of the substrate C to be exposed. When the light receiving unit receives the inspection light, Outputs a substrate presence signal, and outputs a substrate absence signal when the light receiving unit does not receive the inspection light.

  The clamp blade 34 of the clamp bar 31a is positioned above the photo sensor 49. In order to prevent the inspection light from the photo sensor 49 from being reflected by the clamp blade 34 and returning toward the photo sensor 49, the clamp blade 34 An inclined surface 50 is formed at a portion corresponding to the insertion hole 37. A photo sensor 49 similar to the moving unit 32a is also provided on the support plate 40 of each moving unit 32b, 32c, 32d.

  On the lower surface of the stage 10, a pressure gauge 51 that measures the suction pressure of the substrate C to be exposed placed on the stage 10 is provided. As described above, the stage 10 sucks and holds the exposure target substrate C placed on the upper surface of the stage 10 by vacuum suction. However, if air enters between the exposed substrate C and the stage 10 due to warpage or distortion of the exposed substrate C, the vacuum state between the exposed substrate C and the stage 10 cannot be maintained. Is not normally absorbed and retained. Therefore, in order to confirm whether or not the substrate C to be exposed is sucked and held on the stage 10, the pressure in the air chamber of the suction mechanism described above by the pressure gauge 51 (the substrate C to be exposed and the stage placed on the stage 10). Adsorption pressure between 10) is measured.

  4A and 4B are cross-sectional views in the operation direction along the optical axis showing the configuration of the exposure head 16a of the exposure drawing apparatus 1 according to the present embodiment. As shown in FIGS. 4A and 4B, each of the exposure heads 16a is a digital micromirror device as a spatial light modulation element that modulates an incident light beam for each pixel in accordance with image data. (DMD) 59 is provided. The DMD 59 is connected to a system control unit 91 described later. The system control unit 91 generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD 59 for each exposure head 60a based on the input image data. Further, the system control unit 91 controls the angle of the reflection surface of each micromirror of the DMD 59 for each exposure head 60a based on the control signal generated by the image data processing unit. The control of the angle of the reflecting surface will be described later.

  On the light incident side of the DMD 59, a fiber array light source 62 including a laser emitting portion in which emission ends (light emitting points) of optical fibers are arranged in a line along a direction corresponding to the long side direction of the image region 60, a fiber A lens system 63 that corrects laser light emitted from the array light source 62 and collects the light on the DMD 59, and a reflecting mirror 64 that reflects the laser light transmitted through the lens system 63 toward the DMD 59 are arranged in this order.

  The lens system 63 includes a pair of combination lenses 63a that collimate the laser light emitted from the fiber array light source 62, and a pair of combination lenses that correct the light quantity distribution of the collimated laser light to be uniform. 63b and a condensing lens 63c that condenses the laser light with the corrected light quantity distribution on the DMD 59. The combination lens 63b is arranged in a direction perpendicular to the arrangement direction of the laser emitting end in the direction in which the portion near the optical axis of the lens expands the light flux and the portion away from the optical axis reduces the light flux. On the other hand, it has a function of allowing light to pass through as it is, and corrects the laser light so that the light quantity distribution is uniform.

  On the light reflection side of the DMD 59, a lens system 64 and a lens system 65 that form an image of the laser light reflected by the DMD 59 on the exposed surface of the substrate C to be exposed are disposed. The lens system 65 and the lens system 66 are arranged so that the DMD 59 and the exposed surface of the substrate to be exposed C have a conjugate relationship.

  In the present embodiment, the laser light emitted from the fiber array light source 62 is made uniform and incident on the DMD 59, and then each pixel is magnified by about 5 times by the lens system 65 and the lens system 66 to be condensed. Is set to be.

  On the exit side of the lens system 66, there is further provided a focusing mechanism 67 for focusing the laser beam emitted from the fiber array light source 62 on the exposed surface of the substrate C to be exposed.

  FIG. 5 is an external view showing the focusing mechanism 67 of the exposure head 16a of the exposure drawing apparatus 1 according to the present embodiment. As shown in FIG. 5, the focusing mechanism 67 includes a base holder 68 and a slide holder 69 that individually hold a pair of paired wedge glasses 67a and 67b. The pair wedge glass 67b arranged on the laser beam emission side is held by the base holder 68, and the pair wedge glass 67a arranged on the laser beam incidence side is held by the slide holder 69.

  The base holder 68 is formed in a wedge shape substantially similar to the pair wedge glass 67b, and rectangular openings 70 and 71 are formed in the upper surface (inclined surface) 67e and the lower surface 67f. And the cavity part (accommodating part) 72 for accommodating the pair wedge glass 67b is provided in the inside.

  The hollow portion 72 is formed in a concave shape having a predetermined depth dimension in the size of the opening 70 on the upper surface 68a side so as to form the hollow portion 72 when the pair wedge glass 67b is accommodated. The bottom surface and the inner peripheral surface are formed so as to be in contact with the lower surface (light emitting surface 67f) and the outer peripheral surface of the pair wedge glass 67b with almost no gap.

  The opening 71 on the lower surface 68b side is slightly smaller than the opening shapes of the opening 70 and the cavity 72 on the upper surface 68a side, and is disposed at the approximate center of the lower surface 68b. Further, a fixing portion 73 for fixing the entire focusing mechanism 67 including the base holder 68 to the frame (not shown) is projected from one end portion (left end portion in FIG. 5) of the lower surface 68b. ing.

  On the other hand, the slide holder 69 has a wedge shape substantially similar to the pair wedge glass 67a, and rectangular openings 74 and 75 are formed in the upper surface 69a and the lower surface (inclined surface) 69b, and the pair wedge glass 67a is accommodated therein. It is formed in a substantially frame shape provided with a hollow portion (accommodating portion) 76 for this purpose.

  The hollow portion 76 has a shape of a through hole that is dug substantially vertically downward in the size of the opening 74 on the upper surface 69A side and penetrates through the opening 75 on the lower surface side. When the pair wedge glass 67a is accommodated, the hollow portion 76 is hollow. The inner peripheral surface constituting the portion 76 is formed in such a size as to be in contact with the outer peripheral surface of the pair wedge glass 67a with almost no gap.

  The slide holder 69 is disposed on the base holder 68 such that the lower surface 69b faces the upper surface 68a of the base holder 68 and the inclined direction of the lower surface 69b is opposite to the upper surface 68a of the base holder 68. 68 is assembled to the base holder 68 by a pair of guide rails 77 provided between them (the front and rear ends of the upper surface 68a of the base holder 68 and the lower surface 69b of the slide holder 69).

  In the unitized state, the length of the slide holder 69 in the left-right direction in FIG. 5 is slightly shorter than that of the base holder 68, and the length of the slide holder 69 in the front-rear direction in FIG. 68 and are aligned so that the front end surfaces and the rear end surfaces thereof are substantially the same surface.

  The pair of guide rails 77 causes the upper surface 80 a of the base holder 68 and the lower surface 69 b of the slide holder 69 to be arranged substantially parallel to each other with a predetermined distance. Relative movement in the left-right direction in FIG. 5 (the S direction in FIG. 5) is possible along the inclination direction of the upper surface 68a. Further, at a predetermined position in the movement of the slide holder 69 (an assembly position of the pair wedge glasses 67a and 67b), the cavity 76 of the slide holder 69 substantially overlaps the cavity 72 of the base holder 68 in the L direction of FIG. It becomes like this.

  In the opening 74 on the upper surface 69a side of the slide holder 69, the above-mentioned pair wedge glass pressing plate 78 having a rectangular frame plate shape is fitted and attached. The outer shape of the pair wedge glass pressing plate 76 is sized to fit into the opening 74 with almost no gap. In addition, the rectangular opening 79 formed in the approximate center of the pair wedge glass pressing plate 78 is approximately the same size as the opening 71 on the lower surface 68b side of the base holder 68, and the slide holder 69 is placed in the above-described manner. When it is moved to a predetermined position, it is arranged at a position substantially overlapping the opening 71 in the L direction.

  The paired wedge glass 67a, 67b and the paired wedge glass holding plate 78 are assembled to the unitized base holder 68 and slide holder 69 by moving the slide holder 69 to the predetermined position described above. 76 is aligned with the cavity 72 of the base holder 68, and the pair of wedge glasses 67a and 67b and the pair wedge glass holding plate 78 are assembled in this order in the cavity 72 and 76, respectively.

  With such a configuration, the pair wedge glass 67a moves in the S direction along the surface direction of the light emitting surface 67d opposite to the light incident surface 67e of the pair wedge glass 67b as the slide holder 69 moves. Further, the laser light emitted from the DMD 59 side toward the pair wedge glass 67a, 67b is incident on the light incident surface 67a of the pair wedge glass 67a through the opening 79 of the pair wedge glass holding plate 78. After passing through 67a and 67b, the light is emitted from the light emitting surface 67f of the pair wedge glass 67b through the opening 71 on the lower surface 68b side of the base holder 68.

  Note that in the holding of the pair wedge glasses 67a and 67b by the base holder 68 and the slide holder 69, the inner peripheral surface of the hollow portions 72 and 76 and the outer peripheral surface of the pair wedge glasses 67a and 67b due to variations in processing accuracy, temperature changes, and the like. The gap (adhesiveness) may exceed the allowable range, and play may occur in the paired wedge glasses 67a and 67b. In that case, for example, a backlash removing mechanism including an elastic member such as a leaf spring or a compression coil spring is provided at a necessary portion of the inner peripheral surface constituting the hollow portions 72 and 76, and the pair wedge glass 67a is formed by the elastic force of the elastic member. , 67b may be energized to remove the backlash. Instead, a backlash removing mechanism including a screw hole penetrating from the outer peripheral surface of the base holder 68 and the slide holder 69 to the inner peripheral surface constituting the hollow portions 72 and 76 and a push screw screwed into the screw hole is used as a necessary part. The pair wedge glass 67a, 67b may be pressed by this push screw and removed.

  As shown in FIG. 5, an actuator mounting plate 80 is fixed by screws at a substantially central position on the right side surface 68 c of the base holder 68. The right side surface 68c of the base holder 68 is substantially perpendicular to the upper surface 68a, and the actuator mounting plate 80 attached to the right side surface 68c is attached to the mounting portion (lower portion) in a direction substantially perpendicular to the upper surface 68a of the base holder 68. The actuator 81 is attached to the outer surface of the upper portion thereof as a drive source that gives the moving power to the slide holder 69.

  The actuator 81 is attached to the actuator mounting plate 80 so that the extending direction and the moving direction (arrow D direction) of the drive shaft 82 are aligned with the moving direction (arrow S direction) of the slide holder 69. The portion 82 a is connected to the right side surface 69 c of the slide holder 69. The actuator 81 is connected to the system control unit 91 and is controlled by the system control unit 91 to operate.

  A notch 83 is formed at the right front corner of the upper surface 69 a of the slide holder 69. A pair of struts 84 a and 84 b are erected on the bottom surface of the notch 83 and the right front corner of the upper surface 68 a of the base holder 68. The pair of struts 84 a and 84 b are provided with a drive shaft 82 of the actuator 81. A tension coil spring 85 having a spring force smaller than the driving force is installed. A preload is applied between the slide holder 69 and the base holder 68 connected via the guide rail 77 and the actuator 81 by the spring force of the tension coil spring 85.

  Here, when the actuator 81 is actuated by a signal from the system control unit 91 and the drive shaft 82 is moved and driven in the D direction, the slide holder 69 and the pair wedge glass 67a are guided by the pair of guide rails 77 in the S direction. Moving. Further, the slide holder 69 and the paired wedge glass 67a play back in a stationary state due to the preload applied by the tension coil spring 85 even when there is some play (backlash) on the drive shaft 82 and the guide rail 77 of the actuator 81. It will be held without difficulty, and will move smoothly when moving.

  A rectangular sensor mounting plate 86 is fixed to the right front corner of the lower surface 68b of the base holder 68 with screws. The sensor mounting plate 86 is formed on the mounting portion so that the right side portion protruding rightward from the mounting portion (left side portion) to the lower surface 68b of the base holder 68 is substantially parallel to the upper surface 68a of the base holder 68. The reference position sensor unit 87 for detecting the reference position (home position) of the slide holder 69 holding the pair wedge glass 67a is attached to the upper surface of the right side portion.

  The reference position sensor unit 87 has an optical sensor 289 mounted on the upper part of a unit body having a rectangular parallelepiped shape, and a circuit board (not shown) that amplifies an electric signal (detection signal) output from the optical sensor 89 inside the unit body. ) Is provided. The optical sensor 89 is provided with a light projecting / receiving element (not shown) on the inner wall surface of the slit portion 88, and the slit portion 88 is arranged in a direction substantially parallel to the S direction as the moving direction of the slide holder 69. The reference position sensor unit 87 is connected to the system control unit 91 and is controlled by the system control unit 91 to operate.

  A reference position detection plate 90 corresponding to the reference position sensor unit 87 is fixed to the front end portion of the right side surface 69c of the slide holder 69 with screws. The reference position detection plate 90 is L-shaped, and the right side portion that is bent at a substantially right angle from the attachment portion (left side portion) to the right side surface 69c of the slide holder 69 and extends rightward by a predetermined length is detected. Part (light sensor light shielding part). The reference position detection plate 90 is disposed at a position where the detection unit can pass through or leave the slit portion 88 of the optical sensor 89 in accordance with the movement of the slide holder 69. .

  With the movement of the slide holder 69, when the detection part tip of the reference position detection plate 90 passes through the slit part 88 of the optical sensor 89 (arranged in the slit part 88) or leaves the slit part 88, The optical sensor 89 detects a light shielding / non-light shielding state by a light projecting / receiving element, and outputs a High / Low detection signal corresponding to each state. Then, the reference position sensor unit 87 amplifies the detection signal by the circuit board and outputs it to the system control unit 91.

  Further, the system control unit 91 determines the position at which the output level of the detection signal input from the reference position sensor unit 87 is switched to High / Low when the actuator 81 is driven and moved to move the slide holder 69. 69 and the pair wedge glass 67a are recognized as reference positions, and information on the reference positions is stored in a memory. In the drive control of the actuator 81, a control signal for driving and controlling the actuator 81 is generated based on the information on the reference position, and a control signal is generated by correcting the information on the reference position as necessary. 81 is output.

  Next, the principle of adjusting the focal length of the laser beam in the focusing mechanism 67 will be described below.

  6A and 6B are explanatory views showing the operation of the focusing mechanism 67 of the exposure drawing apparatus 1 according to this embodiment. In the focusing mechanism 67, when the actuator 81 is driven and controlled by a signal from the system controller 91, as shown in FIGS. 6A and 6B, the pair wedge glass 76a held by the slide holder 69 is From the reference position indicated by a two-dot chain line in the figure so as to slide with respect to the light incident surface 67e of the pair wedge glass 76b, the SA direction shown in FIG. 6A or the SB shown in FIG. 6B. Move in the direction.

  Here, the distance between the light incident surface 76c of the pair wedge glass 76a and the light exit surface 76e of the pair wedge glass 76b when the pair wedge glass 76a is at the reference position, that is, a slight gap provided between them. When the total thickness dimension of the pair wedge glasses 76a and 76b is t, the thickness dimension t decreases by Δt when the pair wedge glass 76a moves from the reference position in the arrow SA direction by a predetermined distance (− Δt), the pair wedge glass 76a increases by Δt (+ Δt) when it moves from the reference position by a predetermined distance in the direction of the arrow SB.

  As described above, when the thickness dimension t of the pair wedge glasses 76a and 76b changes (± Δt), the transmission distance through which the laser light passes through the pair wedge glasses 76a and 76b changes, and the focal length of the laser light: FD Changes (± ΔFD). The focal length variation range is the effective focal depth of the light beam, and this effective focal depth range is used as a reference range in the second processing described later. Note that PS shown in FIGS. 7A and 7B represents an image plane.

  Further, if the refractive index of the pair wedge glasses 76a and 76b is n (in this embodiment, n = 1.53), the thickness of the pair wedge glasses 76a and 76b: the laser beam corresponding to the amount of change of t. Focal length: The amount of change in FD is obtained by the following equation.

[Equation 1]
+ ΔFD = + Δt − (+ Δt) / n
−ΔFD = −Δt − (− Δt) / n

  The light entrance surface 67c of the pair wedge glass 76a and the light exit surface 76f of the pair wedge glass 76b are completely perpendicular to the optical path of the laser light, and the light exit surface 76d of the pair wedge glass 76a and the light of the pair wedge glass 76b. The focusing mechanism 67 is configured such that the pair wedge glass 76a moves relative to the pair wedge glass 76b so that the incident surface 76e maintains a completely parallel relationship. If comprised in this way, it will be radiate | emitted from the lens system 63, as shown to FIG. 6 (A) and (B), regardless of the position of the pair wedge glass 76a with respect to the pair wedge glass 76b. Since the laser light passes straight through the pair wedge glasses 76a and 76b without being refracted at the boundary between the pair wedge glass 76a and the pair wedge glass 76b, the exposure position on the exposed surface of the substrate C to be exposed by the laser light. Will not slip.

  FIG. 7 is a configuration diagram showing an electrical system of the exposure drawing apparatus 1 according to the present embodiment. As shown in FIG. 7, the exposure drawing apparatus 1 is provided with a system control unit 91 that is electrically connected to each part of the apparatus, and the system control part 91 controls each part in an integrated manner. The system control unit 91 controls the stage driving unit 92 to move the stage 10, acquires the height of the exposed surface of the exposed substrate C placed on the stage 10 from the laser displacement form 22, and The suction pressure to the stage 10 of the substrate C to be exposed is obtained from the total 51, the focusing mechanism 67 is controlled to adjust the focal position of the laser light, and the light source unit 17 and the image processing unit 19 are controlled to expose the exposure head 16a. Let the process do. The operation device 93 includes a display unit that displays data and an input unit that inputs data such as a substrate size by a user operation.

  The movement control unit 94 controls the driving of the movement units 32 a to 32 d based on instructions from the system control unit 91. The movement control unit 94 monitors a signal (substrate presence signal or substrate absence signal) from the photosensor 49 of the movement units 32a to 32d, and based on this signal, the air cylinder 41 and belt drive of the movement units 32a to 32d. The drive of the motor 95 is controlled to cause the clamp bars 31a to 31d to perform a clamp operation.

  The movement control unit 94 places the substrate C to be exposed in the region on the stage 10 based on the substrate size information input from the operation device 93 and the proper placement position information of the substrate calculated by the preparation operation. And the moving speed of the clamp bars 31a to 31d is switched between high speed / low speed based on the estimated area. Specifically, on the stage 10, the high-speed movement is set outside the position away from the periphery of the substrate C to be exposed by the distance L1 (for example, 40 mm), and the low-speed movement is set inside the position. Thereby, since the substrate C to be exposed is detected during the low-speed movement, the substrate C to be exposed can be reliably detected. Note that a position away from the periphery of the substrate C to be exposed by a distance L1 is referred to as a deceleration position (switching point). The clamp bars 31a to 31d stop at a clamp position that enters a predetermined distance (for example, 5 mm) from the position where the substrate C to be exposed is detected, and perform clamping at the clamp position. This clamping position is a position where the support columns 35 of the clamp bars 31a to 31d do not come into contact with the edge of the substrate C to be exposed.

  When the exposure substrate C is detected when the clamp bars 31a to 31d are moving at high speed, the movement control unit 94 determines that the actual substrate size is larger than the input substrate size, and clamps The movement of the bars 31a to 31d is immediately stopped and an abnormal signal is output to the system control unit 91. In response to the abnormal signal, the system control unit 91 causes the display unit of the operation device 93 to display error information indicating that the substrate size is large. Instead of displaying error information, a warning sound may be generated.

  Further, when the clamp bars 31a to 31d move at a low speed and the low-speed movement is continued for a predetermined time without detecting the substrate C to be exposed, the movement control unit 94 determines the actual substrate size from the input substrate size. And the movement of the clamp bars 31a to 31d is immediately stopped and an abnormal signal is output to the system control unit 91. In response to the abnormal signal, the system control unit 91 causes the display unit of the operating device 93 to display error information indicating that the substrate size is small or the substrate C to be exposed is not placed.

  Further, the movement control unit 94 controls the driving of the photographing unit 24 based on instructions from the system control unit 91.

  Here, as described above, in placing the substrate to be exposed on the stage, in the conventional exposure drawing apparatus in which the air between the substrate to be exposed and the stage is sucked out and fixed by vacuum suction, the substrate to be exposed is warped. When distortion has occurred, there may be a situation in which a gap is formed between the substrate to be exposed and the stage, and the substrate to be exposed is not securely attracted and fixed to the stage.

  Therefore, the exposure drawing apparatus 1 according to the present embodiment, when the substrate C to be exposed is placed on the stage 10 and when the suction pressure of the substrate C to the stage 10 does not reach the reference value, the substrate C to be exposed. It is determined that warpage or distortion has occurred in the substrate 10 and the end of the substrate C to be exposed is pressed against the stage 10 by the substrate clamp mechanism 30 provided on the stage 10. A first process for trying to solve is performed.

  Further, the exposure drawing apparatus 1 according to the present embodiment detects the height of the exposed surface of the substrate C to be exposed and similarly applies to the exposed substrate C even when the exposed surface is not located within the effective focal depth. It is determined that warpage or distortion has occurred, and the substrate clamp function unit 30 presses the end of the substrate to be exposed C against the stage 10 to perform a second process that attempts to eliminate the warpage or distortion of the substrate C to be exposed. Do.

  Further, in the exposure drawing apparatus 1 according to the present embodiment, even when the exposure substrate C is corrected by the substrate clamp mechanism unit 30 and then the fixation is released, the warp and distortion of the exposure substrate C are not eliminated. When the setting of the thickness of the substrate C to be exposed is incorrect, a third process for adjusting the height of the stage 10 is performed.

  However, in a state where the substrate C to be exposed is fixed by the substrate clamping mechanism 30, a part of the substrate C to be exposed is covered with the clamp bars 31a to 31d, and the exposure target area on the substrate C to be exposed is limited. Since there is a possibility, it is preferable to expose the exposed substrate C in a state where the exposed substrate C is not fixed by the substrate clamping mechanism 30 as much as possible. Therefore, in the first process and the second process, the substrate clamp mechanism 30 fixes the end of the exposed substrate C to the stage 10 and then releases the fixation. If it has been eliminated, the substrate C to be exposed is exposed in a state where the substrate C to be exposed is not fixed by the substrate clamp mechanism 30.

  Next, the operation of this embodiment will be described.

  FIG. 8 is a flowchart showing the flow of processing of the first processing program according to the present embodiment, and the program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the system control unit 91 of the exposure drawing apparatus 1. Has been.

  The system control unit 91 of the exposure drawing apparatus 1 executes the first processing program at a predetermined timing (in this embodiment, when the placement of the substrate C to be exposed on the stage 10 is completed).

  When the substrate C to be exposed is placed on the stage 10, the system control unit 91 measures the suction pressure of the substrate C to be exposed to the stage 10 using the pressure gauge 51 in step S <b> 101.

  In step S103, the system control unit 91 determines whether or not the adsorption pressure measured in step S101 is greater than or equal to a predetermined threshold value. The threshold value is a threshold value (for example, −50 kPa in the present embodiment) that is used as a reference for determining whether or not the substrate to be exposed C is normally fixed to the stage 10, and is set in advance and is included in the system control unit 91. It is stored in a predetermined area of a ROM that is a storage medium. Note that the threshold value may be input via the input unit of the controller device 93.

  If it is determined in step S103 that it is equal to or greater than the threshold value, the system control unit 91 determines that the substrate to be exposed C is normally fixed to the stage 10, and in step S105, the substrate to be exposed is left as it is. An exposure process is performed on C after adjusting an exposure target position by measuring an alignment mark provided in advance on the substrate C to be exposed.

  If it is determined in step S103 that it is not equal to or greater than the threshold value, the system control unit 91 determines that the substrate C to be exposed is warped or distorted, and tries to correct the substrate C to be exposed in step S107. Then, the end portion of the substrate C to be exposed is fixed by the substrate clamp mechanism 30. When the system control unit 91 controls the moving unit 32a to start the movement of the clamp bars 31a to 31d in the open state from the end portion of the stage 10 to the central portion, and receives a substrate presence signal from the photosensor 49 Then, the clamp bars 31a to 31d are moved to the closed state at the received position or the position moved by a predetermined distance as received. Thereby, the clamp bars 31 a to 31 d are fixed in a state where the substrate to be exposed C is sandwiched between the clamp bars 31 a to 31 d.

  In step S109, the system control unit 91 measures the suction pressure of the substrate C to be exposed to the stage 10 using the pressure gauge 51 while the end of the substrate C to be exposed is fixed in step S107.

  In step S111, the system control unit 91 determines whether or not the adsorption pressure measured in step S109 is greater than or equal to a predetermined threshold value.

  If it is determined in step S111 that the threshold value is equal to or greater than the threshold value, the system control unit 91 determines whether the warp or distortion of the substrate C to be exposed has been eliminated by fixing the end by the substrate clamp mechanism unit 30. For this reason, in step S113, the end of the substrate C to be exposed in step S107 is released.

  In step S115, the suction pressure of the substrate C to be exposed to the stage 10 is measured using the pressure gauge 51 while the end of the substrate C to be exposed is released in step S113.

  In step S117, the system control unit 91 determines whether or not the adsorption pressure measured in step S115 is equal to or greater than a predetermined threshold value.

  If it is determined in step S117 that it is equal to or greater than the threshold value, the system control unit 91 fixes the end portion by the substrate clamp mechanism unit 30 to eliminate the warp and distortion of the exposed substrate C, and the substrate clamp mechanism unit 30. Even in the state in which the fixing of the end portion is released, it is determined that the substrate C to be exposed is normally fixed to the stage 10, and in step S119, the substrate C to be exposed is compared with the substrate C to be exposed as it is. The alignment mark provided in advance is measured to adjust the exposure target position, and then the exposure process is performed.

  If it is determined in step S117 that it is not equal to or greater than the threshold value, the system control unit 91 is normally fixed when the end is fixed by the substrate clamp mechanism 30, but the end of the end by the substrate clamp mechanism 30 is not fixed. In the released state, it is determined that the substrate C to be exposed is not normally fixed to the stage 10, and the end portion of the substrate C to be exposed is fixed by the substrate clamp mechanism 30 in step S 121.

  In step S123, the system control unit 91 determines that the substrate C to be exposed is normally fixed to the stage 10 in a state where the end is fixed by the substrate clamp mechanism 30 by the determination in step S111. The exposure target position was adjusted by measuring an alignment mark provided in advance on the exposed substrate C with the end portion of the exposed substrate C being fixed by the substrate clamping mechanism 30. The exposure process is performed above.

  On the other hand, if it is determined in step S111 that it is not equal to or greater than the threshold value, the system control unit 91 releases the fixation of the end portion of the substrate C to be exposed in step S107 in step S125. Further, the system control unit 91 does not eliminate the warp or distortion of the substrate C to be exposed even if the end portion is fixed by the substrate clamp mechanism portion 30, and the end portion is fixed even if the end portion is fixed by the substrate clamp mechanism portion 30. It is determined that the exposure substrate C is not normally fixed to the stage 10, and the second process is executed.

  FIG. 9 is a flowchart showing the flow of processing of the second processing program according to the present embodiment, and the program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the system control unit 91 of the exposure drawing apparatus 1. Has been.

  In step S201, the substrate C is not sufficiently fixed to the stage 10 even when the end of the substrate C to be exposed is fixed to the stage 10 by the substrate clamp mechanism 30, and the exposure processing is performed on the substrate C to be exposed. Therefore, the system control unit 91 measures the height of the exposed surface of the exposed substrate C using the laser displacement meter 22 in order to adjust the height of the exposed surface of the exposed substrate C. .

  In step S203, the system control unit 91 determines whether or not the height measured in step S201 is within a predetermined range. Here, the predetermined range is the range of the focal position of the light beam that can be changed by the focusing unit 67, that is, the effective focal depth of the light beam, and the system controller 91 determines that the exposed surface of the substrate C to be exposed is an optical laser. It is determined whether it is located within the effective depth of focus. Information indicating the predetermined range is set in advance and stored in a predetermined area of a ROM which is a storage medium included in the system control unit 91.

  The predetermined range may be determined based on image information indicating a circuit pattern drawn on the substrate to be exposed. That is, as the image pattern becomes finer, the effective focal depth of the optical laser is severely limited. Therefore, the system control unit 91, for example, the minimum value of any one of the minimum value of the pattern width in the circuit pattern, the minimum value of the pitch width between adjacent patterns, and the minimum value of the land diameter, or the minimum value A minimum value may be calculated, and the predetermined range may be determined based on the calculated minimum value.

  When it is determined in step S203 that it is within the predetermined range, the system control unit 91 determines that the exposure surface of the substrate C to be exposed is located within the effective focal depth of the optical laser, and in step S205. Then, the exposure processing is performed on the substrate C to be exposed as it is after measuring the alignment mark provided in advance on the substrate C to be exposed and adjusting the exposure target position.

  If it is determined in step S203 that it is not within the predetermined range, the system control unit 91 determines that the exposed surface of the substrate C to be exposed is not located within the effective focal depth of the optical laser, and in step S207, In order to position the exposed substrate C within the effective focal depth of the optical laser, the end portion of the exposed substrate C is fixed by the substrate clamping mechanism 30.

  In step S209, the system control unit 91 measures the height of the exposed surface of the substrate C to be exposed using the laser displacement meter 22 while the end of the substrate C to be exposed is fixed in step S207.

  In step S211, the system control unit 91 determines whether or not the height measured in step S209 is within a predetermined range.

  If it is determined in step S211 that it is within the predetermined range, the system control unit 91 determines whether the warp or distortion of the substrate C to be exposed has been eliminated by fixing the end portion by the substrate clamp mechanism unit 30. In order to do this, in step S213, the end portion of the substrate C to be exposed in step S207 is released.

  In step S215, the height of the exposed surface of the substrate C to be exposed is measured using the laser displacement meter 22 while the end of the substrate C to be exposed is released in step S213.

  In step S217, the system control unit 91 determines whether or not the height measured in step S215 is within a predetermined range.

  If it is determined in step S217 that it is within the predetermined range, the system control unit 91 fixes the end portion by the substrate clamp mechanism unit 30, thereby eliminating the warp and distortion of the substrate C to be exposed, and the substrate clamp mechanism unit. Even in the state in which the fixing of the end portion by 30 is released, it is determined that the exposure surface of the exposure substrate C is located within the effective focal depth of the optical laser, and in step S219, the exposure substrate C is left as it is. In contrast, exposure processing is performed after measuring the alignment mark provided in advance on the substrate C to be exposed and adjusting the exposure target position.

  If it is determined in step S217 that it is not within the predetermined range, the system controller 91 determines that the exposed surface of the substrate C to be exposed is within the effective focal depth of the optical laser when the end is fixed by the substrate clamp mechanism 30. However, it is determined that the exposed surface of the substrate C to be exposed is not located within the effective focal depth of the optical laser in a state where the end of the substrate clamp mechanism 30 is released, and step S221 is determined. The end portion of the substrate C to be exposed is fixed by the substrate clamp mechanism 30.

  In step S223, the system control unit 91 determines that the substrate C to be exposed is normally fixed to the stage 10 in a state where the end is fixed by the substrate clamp mechanism unit 30 in the process of step S221. The exposure target position was adjusted by measuring an alignment mark provided in advance on the exposed substrate C with the end portion of the exposed substrate C being fixed by the substrate clamping mechanism 30. The exposure process is performed above.

  On the other hand, if it is determined in step S211 that it is not within the predetermined range, the system controller 91 does not eliminate the warp or distortion of the substrate C to be exposed even if the end portion is fixed by the substrate clamp mechanism 30. Even when the end portion is fixed by the substrate clamping mechanism unit 30, it is determined that the exposed surface of the exposed substrate C is not within the effective depth of focus of the optical laser, and the third process is attempted.

  In the third process, when the range that can be adjusted by the focusing mechanism 67 is exceeded, the range that can be adjusted by the focusing mechanism 67 from the height of the exposed surface of the substrate C to be exposed measured by the laser displacement meter 22 is set. This is a process for changing the height of the stage 10. This third process is a process performed assuming that the thickness information of the stage 10 designated to the system control unit 91 is different from the actual thickness of the substrate C to be exposed.

  FIG. 10 is a flowchart showing the flow of processing of the third processing program according to the present embodiment, and the program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the system control unit 91 of the exposure drawing apparatus 1. Has been.

  In step S303, the system control unit 91 determines whether the amount of displacement of the height of the exposed surface of the substrate C to be exposed is within a predetermined range based on the height measured in step S209. The amount of displacement of the height of the exposed surface is an amount indicating a difference from the lowest position to the highest position of the exposed surface of the substrate C to be exposed. The predetermined range is a range determined by a range that can be adjusted by the focusing mechanism 67.

  FIG. 11 is a schematic side view of the substrate to be exposed C for explaining the third process according to the present embodiment. In FIG. 11, the horizontal axis shows the measurement position by the laser displacement meter 22 on the substrate C to be exposed as the stage 10 moves, from the measurement start position to the measurement end position, and the vertical axis shows the height (position in the Z direction). The height of the exposed surface measured in step S209 is indicated by a bold line. In step S303, as shown in FIG. 11, the system control unit 91 determines the assumed position (D) of the exposed surface and the adjustable range (B) of the focusing mechanism 67 from the thickness information of the designated exposed substrate C. Is derived. Then, the system control unit 91 determines whether or not the displacement amount (A) of the height of the exposed surface is included in the adjustable range (B) of the focusing mechanism 67.

  If it is determined in step S303 that the amount of displacement of the surface to be exposed is within the predetermined range, the system control unit 91 can expose the substrate C to be exposed by changing the height of the stage 10. In step S305, the height of the stage 10 is adjusted according to the height measured in step S209. As shown in FIG. 11, when the height displacement amount (A) is within the adjustable range (B) of the focusing mechanism 67, the specified thickness is different from the thickness of the substrate C to be exposed. Judgment is made, and the height of the stage 10 is moved by the stage height adjustment amount (E) to the assumed position D of the exposed surface so that the exposed surface of the exposed substrate C becomes an exposureable height. In step S307, the system control unit 91 measures an alignment mark provided in advance on the substrate to be exposed C, adjusts the exposure target position, and performs an exposure process on the substrate C to be exposed.

  If it is determined in step S303 that the amount of displacement of the exposure surface height is not within the predetermined range, the system control unit 91 is included in the adjustable range of the focusing mechanism 67 even if the height of the stage 10 is adjusted. Therefore, it is determined that it is difficult to expose the exposed substrate C, and the exposed substrate C is discharged from the exposure drawing apparatus 1 without performing exposure to the exposed substrate C in step S309.

  If it is determined in step S303 that the amount of displacement of the exposure surface height is not within the predetermined range, the system control unit 91 is included in the adjustable range of the focusing mechanism 67 even if the height of the stage 10 is adjusted. Therefore, it is determined that it is difficult to expose the exposed substrate C, and the exposed substrate C is discharged from the exposure drawing apparatus 1 without performing exposure to the exposed substrate C in step S309.

  As described above, in the exposure drawing apparatus 1, when the circuit pattern is drawn by exposing the light beam to the substrate C to be exposed and fixed to the stage 10, the stage 10 of the substrate C to be exposed by the pressure gauge 51. When the measured suction pressure is not equal to or greater than a predetermined threshold value, the end portion of the substrate C to be exposed is further fixed. In the exposure drawing apparatus 1, the pressure gauge 51 measures the suction pressure in a state where the end of the substrate C to be exposed is fixed by the substrate clamp mechanism 30 and the fixation is released, and the measured suction pressure is a threshold value. In the case described above, the exposure unit 16 controls the exposure of the substrate C to be exposed in a state where the fixing by the substrate clamping mechanism 30 is released.

  In the exposure drawing apparatus 1, when a circuit pattern is drawn by exposing a light beam to the substrate C to be exposed and fixed to the stage 10, the surface to be exposed of the substrate C to be exposed by the laser displacement meter 22. When the measured height is not within a predetermined range, the end of the substrate C to be exposed is further fixed. In the exposure drawing apparatus 1, the laser displacement meter 22 measures the height of the surface to be exposed in a state where the end of the substrate C to be exposed is fixed by the substrate clamp mechanism 30 and the fixing is released. When the height is within the range, the exposure unit 16 is controlled to perform exposure on the substrate C to be exposed in a state where the fixation by the substrate clamp mechanism 30 is released.

  Thereby, generation | occurrence | production of the defective board | substrate by deformation | transformation of the to-be-exposed board | substrate C can be suppressed, suppressing generation | occurrence | production of the unexposed area | region by the board | substrate clamp mechanism 30 to the minimum. In addition, it is ensured that the exposure processing for the substrate C to be exposed is normally performed with the minimum necessary operation. Furthermore, by using both the vacuum suction and the retry operation in the autofocus function, the autofocus function is used as long as it is within the focal depth of the exposure unit 16 even when the vacuum suction is not normally performed. Exposure processing can be performed.

  In the present embodiment, the second process is performed when the warp or distortion of the exposed substrate C is not eliminated even if the end portion of the exposed substrate C is pressed by the substrate clamp mechanism 30 during the first process. However, the present invention is not limited to this, and the first process and the second process may be performed separately.

  That is, in the first process, if the suction pressure is not greater than or equal to the threshold value in step S111, the process may be shifted to step S301 to perform the third process, or the process may be shifted to step S309 to be exposed substrate C. The exposed substrate C may be discharged outside without performing exposure.

  Further, the second process may be performed without performing the first process. At this time, if the suction pressure is not equal to or higher than the threshold value in step S211, the process proceeds to step S309, and the exposed substrate C may be discharged outside without exposing the exposed substrate C.

  Further, in the first process, when the suction pressure is less than the threshold value in step S103, the fourth process may be performed in which the process proceeds to the second process without performing the processes after step S107 of the first process. good.

  FIG. 12 is a flowchart showing the flow of processing of the fourth processing program according to the present embodiment, and the program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the system control unit 91 of the exposure drawing apparatus 1. Has been.

  As shown in FIG. 12, in steps S401 and S403, the system control unit 91 performs the same processing as in steps S101 and S103, respectively. In step S403, when the adsorption pressure measured in step S401 is less than the threshold value, the process proceeds to step S201, and the processes in steps S201 to S223 described above are performed.

  DESCRIPTION OF SYMBOLS 1 ... Exposure drawing apparatus, 10 ... Stage, 11 ... Base | substrate, 12 ... Base, 13 ... Movement mechanism part, 14 ... Guide rail, 15 ... Gate, 16 ... Exposure part, 16a ... Exposure head, 17 ... Light source unit, 18 DESCRIPTION OF SYMBOLS ... Optical fiber, 19 ... Image processing unit, 20 ... Signal cable, 22 ... Laser displacement meter, 23 ... Gate, 24 ... Imaging | photography part, 30 ... Board | substrate clamp mechanism part, 31a thru | or 31d ... Clamp bar, 32a thru | or 32d ... Moving unit 37 ... insertion hole, 49 ... photo sensor, 51 ... pressure gauge, 59 ... DMD, 62 ... fiber array light source, 63 to 66 ... lens system, 67 ... focusing mechanism, 91 ... system control unit, 92 ... stage drive unit, 93: operating device, 94: moving drive unit, C: substrate to be exposed.

Claims (8)

A first fixing part for adsorbing and fixing the substrate to be exposed;
A second fixing portion for holding and fixing an end portion of the substrate to be exposed;
An exposure unit for drawing a circuit pattern by exposing the substrate to be exposed;
The height measuring unit for measuring the height of the exposed surface of the substrate to be exposed,
Measured by the height measuring unit when the substrate to be exposed is fixed by the second fixing unit and the fixing by the second fixing unit is released after the substrate to be exposed is fixed by the first fixing unit. When the height is within a predetermined range, the exposure unit maintains the fixation of the substrate to be exposed by the first fixing unit and releases the fixation by the second fixing unit. Control means for controlling the exposure to
An exposure drawing apparatus comprising: The control means is configured so that the height measured by the height measuring unit is in the range and the fixing by the second fixing unit is released while the substrate to be exposed is fixed by the second fixing unit. When the height measured by the height measuring unit is outside the range, the substrate to be exposed is fixed by the first fixing unit and the substrate to be exposed is fixed by the second fixing unit. The exposure drawing apparatus according to claim 1, wherein an exposure unit controls the exposure of the substrate to be exposed. When the height measured by the height measuring unit is within the range while the substrate to be exposed is fixed by the first fixing unit, the control unit fixes and releases the fixing by the second fixing unit. The exposure drawing apparatus according to claim 1, wherein the exposure unit is controlled to perform exposure on the substrate to be exposed in a state in which the substrate to be exposed is fixed by the first fixing unit without performing the step. The control means is configured such that the displacement of the height measured by the height measurement unit in a state where the substrate to be exposed is fixed by the second fixing unit is included in the range. exposure drawing device according to claim 1 or 2, wherein the control as the exposed surface performs the exposure for the substrate to be exposed by the exposure unit adjusts the height of the substrate to be exposed so as to be located within the range. Computer
Exposing the first fixed part for adsorbing and fixing the substrate to be exposed, the second fixing part for holding and fixing the end of the exposed substrate, and the exposed substrate fixed by the first fixing part A program executed in an exposure drawing apparatus having an exposure unit that draws a circuit pattern and a height measurement unit that measures a height of an exposed surface of the substrate to be exposed;
In a state where the substrate to be exposed is fixed by the first fixing unit, the height when the substrate to be exposed by the second fixing unit is fixed and then the fixing by the second fixing unit is released is the height measuring unit. First control means for measuring by:
When the height measured by the height measuring means is within a predetermined range, the substrate to be exposed is fixed by the first fixing unit and the fixing by the second fixing unit is released. Second control means for exposing the substrate to be exposed by the exposure unit;
Program to function as. The first control means measures the height by the height measuring unit even when the substrate to be exposed is fixed by the second fixing unit,
The second control unit is configured such that the height measured by the height measuring unit is within the range and the fixing by the second fixing unit is released while the substrate to be exposed is fixed by the second fixing unit. When the height measured by the height measuring unit is out of the range, the substrate to be exposed is fixed by the first fixing unit and the substrate to be exposed is fixed by the second fixing unit. The program according to claim 5, wherein the exposure unit performs exposure on the substrate to be exposed. Exposing the first fixed part for adsorbing and fixing the substrate to be exposed, the second fixing part for holding and fixing the end of the exposed substrate, and the exposed substrate fixed by the first fixing part An exposure drawing method in an exposure drawing apparatus having an exposure unit that draws a circuit pattern by performing a height measurement unit that measures the height of an exposed surface of the substrate to be exposed,
In a state where the substrate to be exposed is fixed by the first fixing unit, the height when the substrate to be exposed by the second fixing unit is fixed and then the fixing by the second fixing unit is released is the height measuring unit. A first control step for measuring by:
When the height measured by the height measuring means in the first control step is within a predetermined range, the substrate to be exposed is fixed by the first fixing unit and the second fixing unit A second control step of performing exposure on the substrate to be exposed by the exposure unit in a state in which fixing by
An exposure drawing method comprising: In the first control step, the height measuring unit measures the height even when the substrate to be exposed is fixed by the second fixing unit,
In the second control step, the height measured by the height measuring unit is within the range and the fixing by the second fixing unit is released in a state where the exposed substrate is fixed by the second fixing unit. When the height measured by the height measuring unit is outside the range, the substrate to be exposed is fixed by the first fixing unit and the substrate to be exposed is fixed by the second fixing unit. The exposure drawing method according to claim 7, wherein the substrate to be exposed is exposed by the exposure unit in a state.

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