JP2008292915A - Exposure drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure drawing device, forming an alignment mark required for drawing a circuit pattern on both sides of a substrate. <P>SOLUTION: This exposure drawing device 10 includes: a substrate feed part 20 for feeding a substrate CB where a photosensitive layer is formed to a substrate alignment position; an aligning part 30 for aligning the substrate fed to the substrate alignment position to a predetermined positon; a mark forming part 40 for forming first and second alignment marks on a first face and a second face of the substrate aligned with each other by the aligning part; and a drawing part 60 for drawing the circuit pattern on the first face and second face of the substrate according to the first and second alignment marks. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure drawing apparatus that forms a circuit pattern on a flat substrate such as an electronic circuit substrate, a glass substrate for a liquid crystal element, and a glass element substrate for a PDP.

  Conventionally, an exposure drawing apparatus that forms a circuit pattern on a flat substrate has been mainly a contact type exposure apparatus that contacts or does not contact a transfer mask and a substrate that is an object to be exposed. From the aspect of management and maintenance of recent masks, as shown in Patent Document 1 or Patent Document 2, there is an increasing demand for an exposure drawing apparatus that draws a circuit pattern by directly irradiating a substrate with drawing light without using a transfer mask. ing.

  The exposure drawing apparatus transmits a pattern to be transferred to the exposure drawing apparatus as drawing data, and the exposure drawing apparatus uses the data to draw drawing light by a DMD (Digital Micro-mirror Device) element that is a spatial light modulation element. It is an apparatus that performs control and draws a circuit pattern on a flat substrate. The exposure drawing apparatus can enjoy the greatest advantage of not using a mask.

As shown in Patent Document 3, in the exposure drawing process, in order to set the position of the circuit pattern to be drawn on the substrate, small-diameter holes are formed in advance around the substrate before the exposure process, and these holes are formed as alignment marks. The position and orientation of the circuit pattern to be exposed were determined. In particular, electronic circuit boards often form circuit patterns on both sides of the board, and small-diameter holes that penetrate the board are used so that the alignment marks coincide on the front and back surfaces of the board.
JP 2006-113413 A JP 2006-343684 A JP 2006-267191 A

However, in the substrate that requires high resolution, dust adhering to the hole processing and dust adhering to the hole during the movement process may fall to other substrates or the hole periphery may be deformed by heating in processing such as resist coating. It has become a problem.
Accordingly, the present invention provides an exposure drawing apparatus that forms alignment marks necessary for drawing a circuit pattern on both surfaces of a substrate.

An exposure drawing apparatus according to a first aspect includes a substrate loading unit that loads a substrate on which a photosensitive layer is formed at a substrate alignment position, an alignment unit that aligns the substrate loaded at the substrate alignment position at a predetermined position, A circuit pattern is formed on the substrate based on the mark forming portion for forming the first and second alignment marks on the first surface and the second surface of the substrate aligned by the alignment portion, and the first and second alignment marks. A drawing unit for drawing on the first surface and the second surface.
With this configuration, the first and second alignment marks can be formed without using the holes penetrating the first surface and the second surface of the substrate as alignment marks. Therefore, the dust adhering to the hole does not fall on another substrate.

In the exposure drawing apparatus according to the second aspect, the mark forming unit simultaneously forms the first and second alignment marks on both surfaces of the substrate with short-wavelength illumination light.
In the exposure drawing apparatus of the second aspect, it can be simultaneously formed on both surfaces with short wavelength illumination light.

The exposure drawing apparatus of the third aspect further includes a storage unit that stores difference information of a two-dimensional plane between the first alignment mark and the second alignment mark, and the drawing unit is provided on the first surface based on the first alignment mark. A circuit pattern is drawn, and a circuit pattern is drawn on the second surface based on the second alignment mark and the difference information.
Even in a precisely formed mark forming portion, an error occurs between the first alignment mark on the first surface and the second alignment mark on the second surface. However, the exposure drawing apparatus according to the third aspect stores the error in the storage unit as difference information, so that when the circuit pattern is drawn, the difference information is used to draw the circuit pattern on the first surface and the second surface. The circuit pattern can be accurately associated.

In the exposure drawing apparatus according to the fourth aspect, the mark forming section is movable in a two-dimensional plane, and the first surface mark forming section is movable in a direction intersecting the two-dimensional plane with the substrate interposed therebetween. A second surface mark forming portion.
With this configuration, since the first surface mark forming portion and the second surface mark forming portion can be close to the substrate, the first alignment mark and the second alignment mark can be formed with a small amount of light and in a short time.

In a fourth aspect, the exposure drawing apparatus of the fifth aspect has a mechanism in which only one of the first surface mark formation parts irradiates short-wavelength illumination light.
With this configuration, the first alignment mark can be formed only on the first surface of the substrate on which the circuit pattern needs to be formed only on the first surface.

In an exposure drawing apparatus according to a sixth aspect, the drawing unit includes a table that moves the substrate at a position different from the substrate alignment position, and further includes a transport unit that transports the substrate from the substrate alignment position to the table.
When the mark forming unit does not form the alignment mark at the same position as the substrate alignment position, the substrate may be moved by the transport unit.

  The step of forming an alignment mark that has been formed in a separate process can be omitted, and the alignment mark can be formed immediately before the circuit pattern forming process, thereby reducing the total man-hours. That is, the exposure drawing apparatus of the present invention can form alignment marks for directly drawing a pattern even on a substrate on which a first layer on which no alignment marks have been previously formed is drawn.

<Schematic configuration of first exposure drawing apparatus and second exposure drawing apparatus>
FIG. 1 is a top view in which a first exposure drawing apparatus 10 and a second exposure drawing apparatus 100 are arranged.
In this embodiment, since the exposed substrate CB, which is a flat substrate, is exposed on both the first surface and the second surface, the second exposure drawing apparatus 100 is arranged in parallel in addition to the first exposure drawing apparatus 10. . That is, the first exposure drawing apparatus 10 exposes the first surface of the substrate CB to be exposed, and the second exposure drawing apparatus 100 exposes the second surface of the substrate CB to be exposed. Although it is possible to draw both surfaces of the exposed substrate CB only by the first exposure drawing apparatus 10 using the reversing unit 70 that reverses the exposed substrate CB from the first surface to the second surface, the exposed substrate CB The second exposure drawing apparatus 100 is prepared to increase the throughput (production amount per hour).

The first exposure drawing apparatus 10 is roughly composed of a substrate loading unit 20, an alignment unit 30, a mark forming unit 40, a first transport unit 50, a first drawing unit 60, and a standby table 70. The second exposure drawing apparatus 100 is roughly composed of a second transport unit 150, a second drawing unit 160, and a carry-out table 180.
An exposed substrate CB coated with a photoresist is transported from the left side of FIG. The conveyance confirmation sensor SS1 confirms the exposed substrate CB. Then, the rotation roller 21 (see FIG. 3) of the substrate loading unit 20 rotates. When the exposed substrate CB is transported to the right end of the substrate loading unit 20, the carry-in confirmation sensor SS2 confirms the exposed substrate CB. When the substrate to be exposed CB is completely carried into the substrate loading unit 20, the rotation roller 21 stops and alignment of the substrate to be exposed CB is performed. Next, an alignment mark AM is formed on the peripheral portion of the substrate to be exposed CB. 40.

  Thereafter, the exposed substrate CB is placed on the exposed object table 68 of the first drawing unit 60 by the first transport unit 50. The first drawing unit 60 draws a circuit pattern on the first surface of the exposed substrate CB. The exposed substrate CB for which the circuit pattern has been drawn is transported to the standby table 70 with the first and second surfaces reversed by the first transport unit 50. When the first transport unit 50 does not have a reversing mechanism, the standby table 70 may include a mechanism for reversing the exposed substrate CB from the first surface to the second surface.

  Next, the exposed substrate CB is placed on the exposed object table 68 of the second drawing unit 60 by the second transport unit 150. The second drawing unit 60 draws a circuit pattern on the second surface of the exposed substrate CB. The exposed substrate CB for which the circuit pattern has been drawn is transferred to the carry-out table 180 by the second transfer unit 150. Thereafter, the exposed substrate CB is transferred to the next process.

  In FIG. 1, the first exposure drawing apparatus 10 and the second exposure drawing apparatus 100 are arranged in parallel to increase the throughput. When considering the equipment introduction cost from the throughput, the exposed substrate CB may be returned from the standby table 70 to the first exposure drawing apparatus 10 and the circuit pattern may be drawn on the second surface of the exposed substrate CB. The first exposure drawing apparatus 10 and the second exposure drawing apparatus 100 have substantially the same configuration except for the substrate loading unit 20, the alignment unit 30, and the mark forming unit 40. Each configuration will be described as a representative.

<Configuration of first exposure drawing apparatus>
FIG. 2 is a perspective view of the first exposure drawing apparatus 10. FIG. 3 is a front view (XZ plane) of the first exposure drawing apparatus 10. FIG. 4 is a side view (YZ plane) of the first exposure drawing apparatus 10. 3 to 4 are drawn mainly with respect to the substrate loading unit 20, the alignment unit 30, the mark forming unit 40, and the first transport unit 50.

  The substrate loading unit 20 includes a plurality of rotating rollers 21 and a drive motor (not shown) that rotates the rotating rollers 21. A plurality of rotating rollers 21 are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller 21. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller 21, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire. In addition, the substrate loading unit 20 includes a conveyance confirmation sensor SS1 and a conveyance confirmation sensor SS2 for confirming the carry-in and arrival of the substrate CB to be exposed.

  The alignment unit 30 includes an alignment air cylinder 31 and can move the alignment plate 33 up and down. An alignment pin 35 is attached to the alignment plate 33. The alignment plate 33 is disposed at the lower end until the substrate to be exposed CB is conveyed and the rotation of the rotation roller 21 is stopped. When the rotation roller 21 stops and aligns the substrate to be exposed CB, the alignment plate 33 is at the upper end. Move to. In FIG. 3, the alignment plate 33 is moved to the upper end, and in FIG. 4, the alignment plate 33 is moved to the lower end.

  When the alignment plate 33 moves to the upper end, the alignment pin 35 attached to the alignment plate 33 moves to a height at which the alignment pin 35 contacts the exposed substrate CB. The alignment plate 33 has a horizontal movement drive unit 34 for moving the alignment pin 35 in the horizontal direction, and the alignment pin 35 is movable about 100 mm in the horizontal direction. The exposed substrate CB has a rectangular shape of, for example, 635 mm * 535 mm, and the alignment pins 35 are arranged along the four sides of the exposed substrate CB.

  The mark forming unit 40 forms the first alignment mark AM1 on the first surface of the four sides of the exposed substrate CB aligned by the alignment pins 35, and the second alignment mark AM2 on the second surface. Details of the mark forming unit 40 will be described later.

  The first transport unit 50 includes a hand unit 53 including a plurality of vacuum pads 51 that are vacuum-sucked, and the hand unit 53 includes a vertical drive unit 54 and a horizontal drive unit 55. The vacuum pad 51 descends from above the substrate CB on which the alignment mark AM is formed and is vacuum-sucked, and the substrate CB is lifted. Thereafter, the substrate CB to be exposed is moved by the horizontal driving unit 55 onto the object table 68 of the first drawing unit 60. Then, the vertical drive unit 54 places the exposed substrate CB on the exposed object table 68, and the vacuum suction of the vacuum pad 51 is released. At that time, vacuum suction of the exposed object table 68 works, and the exposed substrate CB is firmly fixed to the exposed object table 68. Further, the first transport unit 50 has a reversing rotor 59 that reverses the first surface of the substrate to be exposed CB from the second surface. In FIG. 1, the substrate CB to be exposed is reversed from the first surface to the second surface by the reversing rotor 59 when being transported from the drawing unit 60 to the standby table 70.

<Alignment of exposure object and alignment mark>
FIG. 5 is a top view of the substrate to be exposed CB placed in the substrate alignment position of the substrate placement unit 20. As can be understood from FIG. 5, two alignment bins 35 are provided for each side of the exposed substrate CB. Two alignment pins are preferred for positioning one side. Then, as indicated by an arrow 39, the alignment bin 35 moves from the position drawn by the dotted line to the position drawn by the solid line with respect to the four sides of the exposed substrate CB. As a result, the alignment of the exposed substrate CB is completed, and the alignment bin 35 returns from the position drawn by the solid line to the position drawn by the dotted line.

  And the mark formation part 40 arrange | positioned at four places moves to the peripheral position of the to-be-exposed board | substrate CB from a retracted position. The four mark forming portions 40 are formed by exposing one or a plurality of alignment marks AM with short wavelength light on each side of the substrate CB to be exposed. It is preferable that the mark forming unit 40 simultaneously exposes the first surface and the second surface of the substrate CB to be exposed in order to improve throughput. Further, the alignment mark AM may have a mark shape such as a circle of about 0.5 mm to 1 mm or a cross shape, and in FIG. 5, four circular alignment marks AM of 1 mm are formed on one side of the first surface.

<Mark formation part>
6A and 6B show one mark forming portion 40, where FIG. 6A is a top view, FIG. 6B is a side view, and FIG. 6C is a front view.
The mark forming unit 40 includes a first head 41U that forms the first alignment mark AM1 on the first surface of the substrate CB to be exposed and a second head 41D that forms the second alignment mark AM2 on the second surface.

  The first head 41U moves up and down along the first slide guide 44 by the first head air cylinder 42U. The second head 41D moves up and down along the first slide guide 44 by the second head air cylinder 42D. By sharing the slide guides of the first head 41U and the second head 41D, the cost is reduced and the two positioning precisions are improved.

  The first head 41U and the second head 41D are placed on a slide table 45, and the slide table 45 can be moved along a second slide guide 48 in the horizontal direction by a table air cylinder 46. Although not shown in FIG. 6, the mark forming unit 40 has a third slide guide orthogonal to the second slide guide 48, and moves the slide table 45 in a direction orthogonal to the second slide guide 48. It is possible to make it.

  After the exposed substrate CB is aligned, the mark forming unit 40 approaches the exposed substrate CB with the first head 41U and the second head 41D being opened up and down. When the mark forming unit 40 reaches a predetermined position where the first and second alignment marks AM1 and AM2 are formed, the first head 41U and the second head 41D approach the exposed substrate CB so as to be closed, and the mark forming unit 40 Irradiates light of a short wavelength from the first head 41U and the second head 41D. After the first and second alignment marks AM1 and AM2 are formed, the reverse operation is performed to return to the original position.

  In the present embodiment, the first head 41U and the second head 41D have LED light sources (LED1 and LED2 (see FIG. 7)) that emit light having a wavelength of 365 nm that can be easily controlled on and off. However, as a light source for the first head 41U and the second head 41D, short wavelength light may be guided by an optical fiber with an ultra-high pressure mercury lamp or the like.

  Further, the exposed substrate CB includes one that does not need to draw a circuit pattern on both sides and draws a circuit pattern only on one side. In such a case, control may be performed such that only the first head 41U moves up and down by the first head air cylinder 42U. Further, if the light intensity of the light source of the first head 41U or the second head 41D is strong, there is no need to bring the first head 41U and the second head 41D close to the exposed substrate CB, and the first slide guide 44, the second It is not necessary to provide the head air cylinder 42D and the first slide guide 44.

  FIG. 7 is an enlarged view of the first head 41U and the second head 41D of the mark forming unit 40. FIG. In FIG. 7, the error of LED1 of the first head 41U and LED2 of the second head 41D is drawn greatly.

  The alignment mark AM is a reference when the drawing unit 60 draws a circuit pattern on the exposed substrate CB. For this reason, it is a reference for drawing a circuit pattern on the first surface and the second surface of the substrate CB to be exposed, and the first alignment mark AM1 on the first surface and the second alignment mark AM2 on the second surface are identical. Otherwise, the circuit pattern on the first surface and the circuit pattern on the second surface will not match. Therefore, it is necessary to manufacture the first head 41U or the second head 41D precisely. However, even if it is manufactured precisely, some difference (error) will occur. Therefore, in this embodiment, the slight difference information is stored in the storage unit 92 (see FIG. 9).

  The light source LED1 of the first head 41U and the light source LED2 of the second head 41D have a ΔX difference in the X direction and a ΔY difference in the Y direction. Then, the first and second alignment marks AM1 and AM2 are actually formed on the test substrate TES using the light source LED1 and the light source LED2, and the difference is measured by a measuring means such as a microscope. The difference information is stored in the storage unit 92. When the drawing unit 60 forms a circuit pattern based on the alignment mark AM, drawing is performed in consideration of the difference information.

<Configuration of drawing unit>
FIG. 8 is a schematic perspective view showing the drawing unit 60. The drawing unit 60 roughly includes an illumination optical system 61, a spatial light modulation unit 65, a projection optical system 67, and an exposed object table 68. In the present embodiment, a configuration may be adopted in which two illumination optical systems are provided so that a substrate CB having a large area can be exposed. The two first illumination optical systems 61-1 and 61-2 of the drawing unit 60 have high-pressure mercury lamps (not shown).

  The exposure light IL branched into eight by the reflection optical element 62-1 and the reflection optical element 62-2 is reflected in the Y direction by the total reflection mirror 63-1 or the total reflection mirror 63-8. The exposure light IL reflected by the total reflection mirror 63-1 through the total reflection mirror 63-8 enters the eight second illumination optical systems 65-1 through 64-8.

  The exposure light IL incident on the second illumination optical system 64-1 to the second illumination optical system 64-8 is shaped into an appropriate light quantity and light beam shape, and is arranged in eight DMDs arranged in one row as spatial light modulation elements. The element 65-1 to the DMD element 65-8 are irradiated. The DMD elements 65-1 to 65-8 spatially modulate the exposure light IL with the supplied image data. The light beam modulated by the DMD element 65-1 to DMD element 65-8 is irradiated to the substrate CB to be exposed after having a predetermined magnification through the projection optical system 67-1 to projection optical system 67-8. The DMD element 65-1 drives on and off 1310720 micromirrors M arranged in a matrix of 1024 × 1280, for example, based on a circuit pattern signal.

  The drawing unit 60 includes three alignment detection systems AC1, an alignment detection system AC2, and an alignment detection system AC3 (alignment detection system AC3 is not shown). The alignment detection system AC detects the alignment mark AM formed on the exposed substrate CB. The drawing unit 60 corrects the on / off driving of the micromirror M based on the signal of the circuit pattern from the detection result of the alignment mark AM.

  The drawing unit 60 includes a housing 69 that supports the first illumination optical system 61, the second illumination optical system 64, the projection optical system 67, and the like below the projection optical system 67 in the Z direction. A pair of guide rails are disposed on the housing 69, and an object table 68 is mounted on the guide rails. The exposed object table 68 is driven by, for example, a stepping motor. As a result, the exposed object table 68 moves relative to the projection optical system 67 in the Y direction which is the longitudinal direction along the pair of guide rails. An exposed substrate CB transferred from the substrate alignment position is placed on the exposed object table 68, and the exposed substrate CB is fixed on the exposed object table 68 by vacuum suction. The exposed object table 68 can be moved in the X direction, and is also movable in the Z direction so that it can be moved to the focal position of the projection optical system 67.

  The drawing unit 60 may use a short-wavelength LED light source or a short-wavelength laser light in addition to a light source using a high-pressure mercury lamp when drawing on the exposed substrate CB. An optical fiber may be used in place of the first illumination optical system 61 and the second illumination optical system 64 that are made of a mirror and a lens.

<Block Configuration for Drawing of First Exposure Drawing Apparatus>
FIG. 9 is a block diagram of the main configuration of the first exposure drawing apparatus 10. With reference to FIG. 9, the drawing of the circuit pattern on the substrate CB to be exposed will be described based on the alignment mark AM.
The main control unit 90 is connected to the substrate loading unit 20, the alignment unit 30, the mark forming unit 40, the first transport unit 50, and the first drawing unit 60, and exchanges signals with each other.

  The main control unit 90 includes an alignment mark difference storage unit 92 that stores difference information between the first and second alignment marks AM1 and AM2 formed in advance on the test substrate TES, and draws a circuit pattern. A drawing data storage unit 93 that stores drawing data for the purpose. The main control unit 90 further obtains position information of the alignment mark AM of each exposed substrate CB from the alignment detection system AC. The computing unit 51 drives each micro mirror M of the DMD element 65 based on the position information of the alignment mark AM, the difference information of the first and second alignment marks AM1 and AM2, and the drawing data, and the exposed object table 68. Drawing is performed on the substrate CB to be exposed. If the drawing is performed based on the alignment mark on the first surface, the calculation unit 51 does not use the difference information between the first and second alignment marks AM1 and AM2, and based on the position information and the drawing data of the alignment mark AM. Then, each micromirror M of the DMD element 65 is driven. Difference information between the first and second alignment marks AM1 and AM2 is used on the second surface.

<Operations of the first exposure drawing apparatus and the second exposure drawing apparatus>
FIG. 10 is a flowchart of the operation of the first exposure drawing apparatus 10.
In step R11, the sensor SS1 confirms that the substrate CB to be exposed is carried into the substrate loading unit 20 from the outside.

In step R <b> 12, the rotating roller 21 is rotated to transport the exposed substrate CB to the substrate alignment position of the substrate loading unit 20.
In step R13, when the sensor SS2 confirms that the substrate has reached the substrate alignment position, the rotation of the rotation roller 21 is stopped in step R14.
Next, in step R15, the alignment pin 35 of the alignment unit 30 is raised by the alignment air cylinder 31, and the alignment pin 35 comes into contact with the outer periphery of the four sides of the exposure substrate CB, thereby moving the exposure substrate CB to the alignment position. .

In step R16, the mark forming unit 40 moves horizontally from the standby position along the outer periphery of the substrate CB to be exposed, and moves to the position where the alignment mark AM is formed.
In Step R17, the first head 41U and the second head 41D of the mark forming unit 40 move up and down so as to sandwich the substrate to be exposed CB, and move to an optimal position for forming the alignment mark AM.
In Step R18, the light source LED1 and the light source LED2 are turned on, and the first and second alignment marks AM1 and AM2 are simultaneously formed on the first surface and the second surface of the exposed substrate CB.
In step R19, the upper and lower heads 41 return to their original positions, the interval between them increases, and the mark forming unit 40 returns to the standby position.

In Step R20, the first transport unit 50 vacuum-sucks the exposed substrate CB, transports it to the exposed object table 68, and releases the vacuum suction of the exposed substrate CB. The exposed object table 68 vacuum-sucks the exposed substrate CB.
In step R21, the alignment detection system AC observes the first alignment mark AM1 on the first surface of the substrate CB to be exposed. Then, based on the first alignment mark AM1 of the substrate to be exposed CB, a circuit pattern is drawn on the substrate to be exposed CB by the DMD 65.

In step R22, the substrate CB to be exposed is moved to the standby table 70 by the first transport unit 50, and the reversing rotor 59 or the standby table 70 of the first transport unit 50 reverses the substrate CB to be exposed. Thereby, the drawing preparation of the second surface of the substrate to be exposed CB is completed.
In Step R23, the second transport unit 150 sucks the exposed substrate CB, transports it to the second exposed object table 168, and releases the vacuum suction of the exposed substrate CB. The second exposed object table 168 vacuum-sucks the exposed substrate CB.

In step R24, the alignment detection system AC of the second drawing unit 160 observes the second alignment mark AM2 on the second surface. Then, based on the second alignment mark AM2 on the substrate to be exposed CB and the difference position between the first alignment mark AM1 and the second alignment mark AM2, a circuit pattern is drawn on the substrate to be exposed CB by the drawing unit 160. When drawing the circuit pattern on the second surface, the difference position between the first alignment mark AM1 and the second alignment mark AM2 is taken into consideration, so that the circuit pattern on the first surface and the circuit pattern on the second surface are accurately It is drawn in correspondence.
In step R <b> 25, the second transport unit 150 sucks the exposed substrate CB on which the drawing of the first surface and the second surface has been completed, and transports it to the carry-out table 180.

  In this embodiment, the alignment unit 30 and the mark forming unit 40 are provided at positions different from the exposed object table 68, but may be provided around the exposed object table 68. In this way, the installation area of the first exposure drawing apparatus 10 can be reduced. However, there is a possibility that the standby position of the exposed substrate CB is lost and the throughput is lowered.

  In this embodiment, the mark forming part 40 for forming the first alignment mark AM1 on the first surface and the second alignment mark AM2 on the second surface is provided. However, the mark detecting part for forming only the first alignment mark AM1 is provided. And the mark detection unit that forms only the second alignment mark AM2 may be separated.

It is the top view which has arrange | positioned the 1st exposure drawing apparatus 10 and the 2nd exposure drawing apparatus 100. FIG. 1 is a perspective view of a first exposure drawing apparatus 10. FIG. It is a front view (XZ surface) of the 1st exposure drawing apparatus. It is a side view (YZ surface) of the 1st exposure drawing apparatus. FIG. 6 is a top view of a substrate to be exposed CB placed in a substrate alignment position of a substrate placement unit 20. One mark forming unit 40 is shown. (A) is a top view, (b) is a side view, and (c) is a front view. 4 is an enlarged view of a first head 41U and a second head 41D of the mark forming unit 40. FIG. 3 is a schematic perspective view showing a drawing unit 60. FIG. 1 is a block diagram of a main configuration of a first exposure drawing apparatus 10. FIG. 3 is a flowchart of the operation of the first exposure drawing apparatus 10.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... 1st exposure drawing apparatus, 100 ... 2nd exposure drawing apparatus 20 ... Board | substrate injection | throwing-in part 30 ... Alignment part, 31 ... Alignment air cylinder, 33 ... Alignment plate, 35 ... Alignment pin 40 ... Mark formation part, 41U ... 1st 1 head, 41D ... 2nd head 50 ... 1st conveyance part, 150 ... 2nd conveyance part 60 ... 1st drawing part, 160 ... 2nd drawing part 61 ... 1 illumination optical system, 62 ... total reflection mirror, 65 ... DMD element,
67. Second illumination optical system
70 ... Standby table AC ... Alignment detection system AM ... Alignment mark CB ... Object to be exposed SS1 ... Conveyance confirmation sensor SS1, SS2 ... Incoming confirmation sensor

Claims (6)

A substrate loading unit for loading the substrate on which the photosensitive layer is formed into the substrate alignment position;
An alignment unit that aligns the substrate placed in the substrate alignment position with a predetermined position;
A mark forming portion for forming first and second alignment marks on the first surface and the second surface of the substrate aligned by the alignment portion;
A drawing unit for drawing a circuit pattern on the first surface and the second surface of the substrate based on the first and second alignment marks;
An exposure drawing apparatus comprising:   2. The exposure drawing apparatus according to claim 1, wherein the mark forming unit simultaneously forms the first and second alignment marks on both surfaces of the substrate with short wavelength illumination light. And a storage unit for storing difference information of a two-dimensional plane between the first alignment mark and the second alignment mark,
The drawing unit draws a circuit pattern on the first surface based on the first alignment mark, and draws a circuit pattern on the second surface based on the second alignment mark and the difference information. The exposure drawing apparatus according to claim 1 or 2.   The mark forming portion is movable in a two-dimensional plane, and is movable in a direction intersecting the two-dimensional plane with the substrate interposed therebetween, and a first surface mark forming portion and a second surface mark forming portion, The exposure drawing apparatus according to claim 1, further comprising:   The exposure drawing apparatus according to claim 4, wherein the mark forming unit has a mechanism in which only one of the first surface mark forming units emits illumination light having a short wavelength. The drawing unit has a table for moving the substrate at a position different from the substrate alignment position;
The exposure drawing apparatus according to claim 1, further comprising a transport unit that transports the substrate from the substrate alignment position to the table.