CN114253086A - Drawing system - Google Patents

Drawing system Download PDF

Info

Publication number
CN114253086A
CN114253086A CN202110993331.XA CN202110993331A CN114253086A CN 114253086 A CN114253086 A CN 114253086A CN 202110993331 A CN202110993331 A CN 202110993331A CN 114253086 A CN114253086 A CN 114253086A
Authority
CN
China
Prior art keywords
substrate
pattern
stage
main surface
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110993331.XA
Other languages
Chinese (zh)
Inventor
早川直人
原望
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN114253086A publication Critical patent/CN114253086A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/708Mark formation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7084Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Abstract

A first mark drawing section draws a first positioning mark on a lower main surface of a substrate (9) held by a first stage (21 a). The second mark drawing section draws a second positioning mark on the lower main surface of the substrate (9) held by the second stage (21 b). The second positioning indicia has a different appearance than the first positioning indicia. Therefore, by observing the positioning mark drawn on the other main surface of the substrate (9), the conveying mechanism used when the pattern is drawn on the one main surface of the substrate (9) can be easily determined. Thus, the pattern can be drawn on the other main surface of the substrate (9) while adjusting the drawing position in consideration of the positional relationship between the front surface and the back surface peculiar to the conveyance mechanism used when drawing the pattern. As a result, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate (9) can be improved.

Description

Drawing system
Technical Field
The present invention relates to a drawing system for drawing a substrate.
[ refer to related applications ]
The present application claims benefit of priority from the Japanese patent application JP2020-158775, filed on 23/9/2020, the entire disclosure of which is incorporated herein.
Background
Conventionally, a pattern is drawn by irradiating a photosensitive material formed on a glass substrate (hereinafter referred to as a "substrate") for a semiconductor substrate, a printed circuit board, an organic EL display device, or a liquid crystal display device with light. In addition, patterns may be drawn on both surfaces of the substrate. In this case, when the pattern is drawn on the front surface of the substrate in order to align the pattern drawing positions on both surfaces of the substrate, the positioning marks are formed on the back surface of the substrate.
In the drawing apparatus disclosed in japanese patent application laid-open No. 2016 and 48273 (document 1), a positioning mark forming light source is built in a drawing table on which a substrate is placed, and the positioning mark forming light source irradiates the back surface of the substrate with light through a through hole provided in the upper surface of the drawing table to form the positioning mark. When the substrate is reversed and the pattern is drawn on the back surface of the substrate, the pattern drawing positions on both surfaces of the substrate are aligned by performing positioning processing using the positioning marks.
In recent years, the following proposals have been made to improve the throughput of a drawing apparatus: in a 1-stage drawing apparatus, two stages are provided, and while a substrate on one stage is being drawn, a positioning process or the like is performed on a substrate on the other stage. In such a dual stage type drawing apparatus, when pattern drawing is performed on both surfaces of the substrate, pattern drawing on the front surface of the substrate and pattern drawing on the back surface of the substrate may be performed on the same stage or may be performed on different stages.
On the other hand, the relationship between the position of the positioning mark formed on the back surface of the substrate and the position of the pattern drawn on the front surface of the substrate differs for each stage (and stage moving mechanism). Therefore, when the patterns on the front surface and the back surface of the substrate are drawn on different stages, the same positioning process as that when the patterns on the front surface and the back surface of the substrate are drawn on the same stage may be performed, which may cause a deviation in the relative position between the pattern drawn on the front surface of the substrate and the pattern drawn on the back surface of the substrate.
Disclosure of Invention
The present invention is directed to a drawing system for drawing a substrate, and an object of the present invention is to improve relative positional accuracy of patterns drawn on both principal surfaces of the substrate.
A drawing system according to a preferred aspect of the present invention includes: a pattern drawing unit that draws a pattern by irradiating light onto an upper main surface of a substrate horizontally moving downward; a first conveyance mechanism including a first substrate holding unit and a first movement mechanism for horizontally moving the first substrate holding unit below the pattern drawing unit; a first mark drawing unit that irradiates light onto the lower main surface of the substrate held by the first substrate holding unit to draw a first positioning mark associated with the first transport mechanism; a second conveyance mechanism including a second substrate holding unit and a second movement mechanism for horizontally moving the second substrate holding unit below the pattern drawing unit; and a second mark drawing unit that irradiates light onto the lower main surface of the substrate held by the second substrate holding unit to draw a second positioning mark associated with the second conveyance mechanism, the second positioning mark having a different appearance from the first positioning mark.
According to the above-described drawing system, the relative positional accuracy of the patterns drawn on the both principal surfaces of the substrate can be improved.
Preferably, the drawing system further includes: a storage unit that stores, in advance, first positional relationship information indicating a relative positional relationship between a pattern drawn by the pattern drawing unit on the upper main surface of the substrate conveyed by the first conveying mechanism and the first positioning mark drawn by the first mark drawing unit on the lower main surface, and second positional relationship information indicating a relative positional relationship between a pattern drawn by the pattern drawing unit on the upper main surface of the substrate conveyed by the second conveying mechanism and the second positioning mark drawn by the second mark drawing unit on the lower main surface; and a drawing control unit for controlling the pattern drawing unit. The drawing control unit adjusts the drawing position based on the first positional relationship information when the pattern drawing unit draws the main surface on which the first positioning mark is drawn, and adjusts the drawing position based on the second positional relationship information when the pattern drawing unit draws the main surface on which the second positioning mark is drawn.
Preferably, the first mark drawing part includes a first mask part that allows a part of light from the light source to pass therethrough, and the second mark drawing part includes a second mask part that has an opening different from the first mask part and allows a part of light from the light source to pass therethrough.
Preferably, the first and second positioning marks are non-similar in shape.
Preferably, the first positioning mark is a bar code indicating information on the first conveying mechanism, and the second positioning mark is a bar code indicating information on the second conveying mechanism.
Preferably, the pattern drawing unit includes: a drawing head for irradiating light downward; and a drawing head moving mechanism for moving the drawing head between a first drawing position above the first conveying mechanism and a second drawing position above the second conveying mechanism.
The above and other objects, features, aspects and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings.
Drawings
Fig. 1 is a perspective view showing a drawing apparatus according to an embodiment.
Fig. 2 is a plan view showing a part of the first stage and the second stage.
FIG. 3 is a longitudinal cross-sectional view showing the first marker.
FIG. 4 is a longitudinal cross-sectional view showing a second marker.
Fig. 5 is a bottom view showing the first positioning mark.
Fig. 6 is a bottom view showing the second positioning mark.
Fig. 7 is a diagram showing a configuration of a computer.
Fig. 8 is a block diagram showing the function of the control unit.
Fig. 9A is a flowchart showing the drawing processing.
Fig. 9B is a flowchart showing the drawing processing.
Fig. 10 is a diagram showing the positions of the first stage and the second stage.
Fig. 11 is a diagram showing the positions of the first stage and the second stage.
Fig. 12 is a diagram showing the positions of the first stage and the second stage.
Fig. 13 is a diagram showing the positions of the first stage and the second stage.
Fig. 14 is a diagram showing the positions of the first stage and the second stage.
Fig. 15 is a diagram showing the positions of the first stage and the second stage.
Fig. 16 is a side view showing another example of the drawing apparatus.
Wherein the reference numerals are as follows:
1. 1a drawing device
2a first carrying mechanism
2b second conveyance mechanism
4 pattern drawing part
9 base plate
21a first stage
21b second stage
22a first moving mechanism
22b second moving mechanism
51 first mark drawing part
52 second mark drawing part
91 first main surface
92 second main surface
93 first positioning mark
94 second positioning mark
111 storage unit
114 drawing control unit
514 first aperture
524 second diaphragm
S11-S19, S21-S29
Detailed Description
Fig. 1 is a perspective view showing a drawing apparatus 1 according to an embodiment of the present invention. The imaging apparatus 1 is a two-stage direct imaging system that irradiates a photosensitive material on a substrate 9 with spatially modulated substantially beam-shaped light, and scans the irradiated area of the light over the substrate 9 to image a pattern. In fig. 1, three directions orthogonal to each other are indicated by arrows as an X direction, a Y direction, and a Z direction. In the example shown in fig. 1, the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is a vertical direction. The same applies to the other figures. In addition, the Z direction may or may not coincide with the gravity direction.
The substrate 9 is, for example, a plate-like member having a substantially rectangular shape in plan view. The substrate 9 is, for example, a printed circuit board. On the principal surfaces on the (+ Z) side and the (-Z) side of the substrate 9, resist films formed of a photosensitive material are provided on the copper layer. In the drawing apparatus 1, a circuit pattern is drawn (i.e., formed) on the resist film of the substrate 9. In the following description, one main surface of the substrate 9 is referred to as a "first main surface 91", and the other main surface of the substrate 9 is referred to as a "second main surface 92". The type, shape, and the like of the substrate 9 can be variously changed.
The imaging apparatus 1 includes a first conveyance mechanism 2a, a second conveyance mechanism 2b, an imaging unit 3, a pattern imaging unit 4, a frame 7, and a control unit 10. The control unit 10 controls the first conveying mechanism 2a, the second conveying mechanism 2b, the imaging unit 3, and the pattern drawing unit 4.
The frame 7 is a main body base portion to which the respective components of the imaging system 1 are attached. The frame 7 includes a substantially rectangular parallelepiped base 71, a door-shaped first frame portion 72 and a second frame portion 73 that straddle the base 71. The second housing part 73 is disposed close to the (+ Y) side of the first housing part 72. In the following description, first housing unit 72 and second housing unit 73 are collectively referred to as "housing unit 74". The first conveyance mechanism 2a and the second conveyance mechanism 2b are mounted on the base 71. The first frame part 72 supports the image pickup part 3. The second frame portion 73 supports the pattern drawing portion 4. The frame 7 is mounted on a pedestal, not shown.
The first conveyance mechanism 2a and the second conveyance mechanism 2b are mechanisms for holding and moving the substrate 9 below (i.e., (-Z) side) the imaging unit 3 and the pattern drawing unit 4, respectively. The second conveyance mechanism 2b is disposed adjacent to the (+ X) side of the first conveyance mechanism 2 a. The first conveyance mechanism 2a and the second conveyance mechanism 2b have substantially the same configuration. In the example shown in fig. 1, the substrate 9 is held by the first conveyance mechanism 2a and the second conveyance mechanism 2b in a state where the first main surface 91 faces upward (i.e., (+ Z) side).
The first conveyance mechanism 2a includes a first stage 21a and a first movement mechanism 22 a. The first stage 21a is a substantially flat-plate-shaped first substrate holding portion that holds the substrate 9 in a substantially horizontal state from below. The first stage 21a is, for example, a vacuum chuck that sucks and holds the lower surface of the substrate 9. The first stage 21a may have a structure other than a vacuum chuck. The upper main surface (i.e., the first main surface 91) of the substrate 9 placed on the first stage 21a is substantially perpendicular to the Z direction (i.e., the vertical direction) and substantially parallel to the X direction and the Y direction.
The first moving mechanism 22a is a first stage moving mechanism that moves the first stage 21a in a substantially horizontal direction (i.e., a direction substantially parallel to the upper main surface of the substrate 9) with respect to the imaging unit 3 and the pattern drawing unit 4. The first movement mechanism 22a linearly moves the first stage 21a supported on the guide rail 221a in the Y direction along the guide rail 221a below the imaging unit 3 and the pattern drawing unit 4. Thereby, the substrate 9 held by the first stage 21a moves in the Y direction. In the following description, the Y direction is also referred to as a "substrate moving direction". The driving source of the first moving mechanism 22a is, for example, a linear servo motor or a ball screw with a motor. The structure of the first moving mechanism 22a may be variously modified.
The second conveyance mechanism 2b includes a second stage 21b and a second movement mechanism 22 b. The second stage 21b is a second substrate holding portion having a substantially flat plate shape that holds the substrate 9 in a substantially horizontal state from below. The second stage 21b is disposed adjacent to the first stage 21a on the side (i.e., (+ X) side). The upper surface of the second stage 21b is located at the same height as the upper surface of the first stage 21a in the up-down direction (i.e., the Z direction). The second stage 21b is, for example, a vacuum chuck that sucks and holds the lower surface of the substrate 9. The second stage 21b may have a structure other than a vacuum chuck. The upper main surface (i.e., the first main surface 91) of the substrate 9 placed on the second stage 21b is substantially perpendicular to the Z direction and substantially parallel to the X direction and the Y direction. The upper main surface of the substrate 9 held by the second stage 21b is located at substantially the same height (i.e., substantially the same position in the Z direction) in the vertical direction as the upper main surface of the substrate 9 held by the first stage 21 a.
The second moving mechanism 22b is a second stage moving mechanism that moves the second stage 21b in a substantially horizontal direction (i.e., a direction substantially parallel to the upper main surface of the substrate 9) with respect to the imaging unit 3 and the pattern drawing unit 4. The second moving mechanism 22b linearly moves the second stage 21b supported on the guide rail 221b in the Y direction (i.e., the substrate moving direction) along the guide rail 221b below the imaging unit 3 and the pattern drawing unit 4. Thereby, the substrate 9 held by the second stage 21b moves in the Y direction. The moving direction of the second stage 21b by the second moving mechanism 22b is substantially parallel to the moving direction of the first stage 21a by the first moving mechanism 22 a. The driving source of the second moving mechanism 22b is, for example, a linear servo motor or a ball screw with a motor. The structure of the second moving mechanism 22b may be variously modified.
The first moving mechanism 22a and the second moving mechanism 22b are arranged side by side in a direction intersecting the substrate moving direction (i.e., Y direction). In the example shown in fig. 1, the first movement mechanism 22a and the second movement mechanism 22b are arranged side by side in the X direction, and the second movement mechanism 22b is adjacent to the (+ X) side of the first movement mechanism 22 a. The first movement mechanism 22a and the second movement mechanism 22b are located at substantially the same height in the vertical direction.
The first moving mechanism 22a and the second moving mechanism 22b are supported from below by a base 71 of the frame 7. The first moving mechanism 22a and the second moving mechanism 22b extend from one side (+ Y) of the second housing section 73 toward the (-Y) direction, and protrude from the first housing section 72 toward the (-Y) side through the lower side of the pattern drawing section 4 supported by the second housing section 73 and the lower side of the imaging section 3 supported by the first housing section 72. The first frame portion 72 is located at substantially the same position in the Y direction as the Y direction center portions of the first movement mechanism 22a and the second movement mechanism 22 b. In other words, the frame portion 74 extends in the (+ Y) direction from the upper side of the Y-direction central portion of the first movement mechanism 22a and the second movement mechanism 22 b.
In the drawing apparatus 1, the substrate 9 is carried in and out of the first stage 21a in a state where the first stage 21a is positioned on the (-Y) side of the first frame portion 72. Further, the substrate 9 is carried in and out with respect to the second stage 21b in a state where the second stage 21b is positioned on the (-Y) side of the first frame portion 72.
As described above, the first and second frame portions 72 and 73 are provided so as to straddle the first and second conveyance mechanisms 2a and 2 b. The first frame portion 72 includes two column portions extending in the Z direction on both sides in the X direction of the first and second conveying mechanisms 2a and 2b, and a beam portion connecting upper end portions of the two column portions. The beam extends in the X direction above the first conveyance mechanism 2a and the second conveyance mechanism 2 b. The two leg portions of the first frame portion 72 are connected to the base 71 at the (-Z) -side end portions. The second frame part 73 includes two column parts extending in the Z direction on both sides in the X direction of the first and second conveying mechanisms 2a and 2b, and a beam part connecting upper end parts of the two column parts. The beam extends in the X direction above the first conveyance mechanism 2a and the second conveyance mechanism 2 b. The two pillar portions of the second frame portion 73 are connected to the base 71 at the (-Z) -side end portions.
The imaging unit 3 includes a plurality of (two in the example shown in fig. 1) cameras 31 and a camera moving mechanism 32. The plurality of cameras 31 are arranged in the X direction and movably attached to the beam portion of the first frame portion 72. The camera moving mechanism 32 is attached to the beam portion, and moves the plurality of cameras 31 in the X direction along the beam portion. The drive source of the camera moving mechanism 32 is, for example, a linear servo motor or a ball screw with a motor. In the example shown in fig. 1, the interval between the two cameras 31 in the X direction may be changed. In the imaging unit 3, the number of the cameras 31 may be 1, or 3 or more.
Each camera 31 is a camera including an imaging sensor and an optical system, not shown. Each camera 31 is, for example, an area camera that acquires a 2-dimensional image. The imaging sensor includes a plurality of elements such as a Charge Coupled Device (CCD) arranged in a matrix. In each camera 31, the reflected light of the illumination light guided from the light source, not shown, to the upper main surface of the substrate 9 is guided to the image sensor via the optical system. The image sensor receives reflected light from the upper main surface of the substrate 9 and acquires an image of a substantially rectangular image pickup area. As the Light source, various Light sources such as a Light Emitting Diode (LED) can be used. In addition, the camera 31 may be another kind of camera, such as a line camera.
In the imaging apparatus 1, the plurality of cameras 31 are moved by the camera moving mechanism 32 between a first imaging position above the first conveying mechanism 2a and a second imaging position above the second conveying mechanism 2 b. In fig. 1, the plurality of cameras 31 are located at a first imaging position. The plurality of cameras 31 take images of the upper main surface of the substrate 9 on the first stage 21a at the first imaging position. Further, the plurality of cameras 31 take images of the upper main surface of the substrate 9 on the second stage 21b at the second imaging position.
The pattern drawing unit 4 includes a plurality of (6 in the example shown in fig. 1) drawing heads 41 and a drawing head moving mechanism 42. The plurality of drawing heads 41 are arranged in the X direction and movably attached to the beam portion of the second housing portion 73. The head moving mechanism 42 is attached to the beam portion, and moves the plurality of heads 41 integrally along the beam portion in the X direction. The driving source of the drawing head moving mechanism 42 is, for example, a linear servo motor or a ball screw with a motor. In the pattern writing section 4, the number of the writing heads 41 may be one or plural.
Each of the drawing heads 41 includes a light source, an optical system, and a spatial light modulator, which are not shown. As the spatial Light modulator, various elements such as a Digital Micromirror Device (DMD) and a Grating Light Valve (GLV) (registered trademark of Silicon Light M optics, sony, ca) can be used. As the light source, various light sources such as a Laser Diode (LD) can be used. The plurality of drawing heads 41 have substantially the same configuration.
In the imaging apparatus 1, the plurality of imaging heads 41 are moved between a first imaging position above the first conveying mechanism 2a and a second imaging position above the second conveying mechanism 2b by the imaging head moving mechanism 42. In fig. 1, the plurality of drawing heads 41 are located at the second drawing position. The plurality of drawing heads 41 draw a pattern on the upper main surface of the substrate 9 on the first stage 21a at the first drawing position. The plurality of drawing heads 41 draw a pattern on the upper main surface of the substrate 9 on the second stage 21b at the second drawing position.
The first drawing position and the second drawing position are located at substantially the same positions as the Y-direction center portions of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction. The first imaging position and the second imaging position are also located at substantially the same positions as the center portions of the first moving mechanism 22a and the second moving mechanism 22b in the Y direction. In other words, the plurality of drawing heads 41 of the pattern drawing unit 4 and the plurality of cameras 31 of the image pickup unit 3 are located at substantially the same positions in the Y direction as the Y direction center portions of the first movement mechanism 22a and the second movement mechanism 22 b.
When a pattern is drawn at the first drawing position, modulated (i.e., spatially modulated) light is irradiated from the plurality of drawing heads 41 of the pattern drawing section 4 toward the substrate 9 on the first stage 21a below. Then, in parallel with the irradiation of the light, the substrate 9 is horizontally moved in the Y direction (i.e., the substrate moving direction) by the first moving mechanism 22 a. Thereby, the irradiation regions of the light from the plurality of scanning heads 41 scan in the Y direction on the substrate 9, and a pattern (e.g., a circuit pattern) is drawn on the substrate 9. The first movement mechanism 22a is a scanning mechanism that moves the irradiation region of the light from each of the drawing heads 41 in the Y direction on the substrate 9.
In the example shown in fig. 1, the substrate 9 is drawn by a so-called one-pass (one-pass) method. Specifically, the first stage 21a is moved in the Y direction relative to the plurality of scanning heads 41 by the first moving mechanism 22a, and the irradiation region of the light from the plurality of scanning heads 41 is scanned only once in the Y direction on the upper main surface of the substrate 9. This completes the drawing of the substrate 9. In the drawing apparatus 1, the substrate 9 may be drawn by a Multi-pass (Multi-path) system in which the movement in the Y direction and the stepping movement in the X direction of the first stage 21a are repeated. The pattern drawing at the second drawing position is the same as the pattern drawing at the first drawing position, except that the first stage 21a and the first moving mechanism 22a are changed to the second stage 21b and the second moving mechanism.
Fig. 2 is a plan view showing enlarged ends on the (-Y) side of the first stage 21a and the second stage 21 b. In fig. 2, the substrate 9 on the first stage 21a and the second stage 21b is depicted by a two-dot chain line. As shown in fig. 2, the drawing apparatus 1 further includes a first mark drawing unit 51 and a second mark drawing unit 52. The first mark drawing part 51 is disposed inside the first stage 21a (i.e., between the upper surface and the lower surface of the first stage 21 a). The first mark drawing unit 51 irradiates the lower main surface of the substrate 9 held by the first stage 21a so as to cover the upper side of the first mark drawing unit 51 with light, and draws a first positioning mark associated with the first conveying mechanism 2 a.
The first mark drawing unit 51 includes a plurality of first markers 511. The plurality of first markers 511 are arranged near the edge on the (-Y) side of the first stage 21a in the X direction. In the example shown in fig. 2, the first positioning mark is drawn by the first marker 511 closest to the (-X) side and the first marker 511 closest to the (+ X) side among the plurality of first markers 511, at the corner portion on the (-X) side and the (-Y) side and the corner portion on the (+ X) side and the (-Y) side of the lower principal surface of the substrate 9. In addition, with respect to the substrate 9 having a smaller size in the X direction than the example of fig. 2, two first positioning marks are drawn on the lower main surface of the substrate 9 by the first marker 511 located closest to the (-X) side and the first marker 511 located below the corner portion on the (+ X) side and the (-Y) side of the substrate 9.
Fig. 3 is a longitudinal cross-sectional view showing a first marker 511 and its vicinity. The plurality of first markers 511 have substantially the same structure. The first marker 511 is housed in a substantially cylindrical recess 211a provided on the upper surface of the first stage 21 a. The upper end opening of the concave portion 211a may be closed by a substantially flat plate-like cover member having translucency.
As shown in fig. 3, the first marker 511 includes a first light source 512, a first optical system 513, and a first aperture 514. The first light source 512 is disposed at the bottom of the recess 211a and emits light in the (+ Z) direction. As the first light source 512, for example, an LED or the like that emits ultraviolet light is used. The first optical system 513 is disposed on the (+ Z) side of the first light source 512, and guides light from the first light source 512 to the lower main surface of the substrate 9. The first optical system 513 includes a plurality of lenses (not shown) arranged in the Z direction. The first aperture 514 is a first mask portion that is disposed between the plurality of lenses of the first optical system 513 and passes only a part of the light from the first light source 512. The first diaphragm 514 is a substantially flat plate-shaped member provided with an opening corresponding to the first positioning mark. The first diaphragm 514 is formed of metal such as stainless steel.
The second mark drawing part 52 shown in fig. 2 is disposed inside the second stage 21b (i.e., between the upper surface and the lower surface of the second stage 21 b). The second mark drawing unit 52 irradiates the lower surface of the substrate 9 held by the second stage 21b so as to cover the upper portion of the second mark drawing unit 52 with light, and draws a second positioning mark associated with the second conveying mechanism 2 b. As will be described later, the appearance of the second positioning mark is different from the appearance of the first positioning mark,
the second mark drawing part 52 is provided with a plurality of second markers 521, similar to the first mark drawing part 51. The plurality of second markers 521 are arranged in the X direction near the edge of the (-Y) side of the second stage 21 b. In the example shown in fig. 2, the second positioning mark is drawn by the second marker 521 closest to the (-X) side and the second marker 521 closest to the (+ X) side of the plurality of second markers 521, at the corner portion on the (-X) side and the (-Y) side and the corner portion on the (+ X) side and the (-Y) side of the lower main surface 9 of the substrate 9. In addition, with respect to the substrate 9 having a smaller size in the X direction than the example of fig. 2, two second positioning marks are drawn on the lower main surface of the substrate 9 by the second marker 521 located closest to the (-X) side and the second marker 521 located below the corner portion on the (+ X) side and the (-Y) side of the substrate 9.
Fig. 4 is a longitudinal sectional view showing a second marker 521 and its vicinity. The plurality of second markers 521 have substantially the same structure. The second marker 521 is housed in a substantially cylindrical recess 211b provided in the upper surface of the second stage 21 b. The upper end opening of the concave portion 211b may be closed by a substantially flat plate-like cover member having translucency.
As shown in fig. 4, the second marker 521 has substantially the same structure as the first marker 511. The second marker 521 has a second light source 522, a second optical system 523, and a second diaphragm 524. The second light source 522 is disposed at the bottom of the recess 211b and emits light in the (+ Z) direction. As the second light source 522, for example, an LED that emits ultraviolet light is used. The second optical system 523 is disposed on the (+ Z) side of the second light source 522, and guides light from the second light source 522 to the lower main surface of the substrate 9. The second optical system 523 includes a plurality of lenses (not shown) arranged in the Z direction. The second aperture 524 is a second mask portion that is provided between the plurality of lenses of the second optical system 523 and passes only a part of the light from the second light source 522. The second diaphragm 524 is a substantially flat plate-like member having an opening corresponding to the second positioning mark. The second diaphragm 524 is formed of metal such as stainless steel. As described above, the second positioning mark has a different appearance from the first positioning mark. Thus, the second aperture 524 has a different opening than the first aperture 514. In other words, the second diaphragm 524 and the first diaphragm 514 differ in at least one of the number, shape, size, configuration, and orientation of the openings.
Fig. 5 is a bottom view showing first positioning mark 93 drawn on the lower principal surface of substrate 9 by first marker 511. Fig. 6 is a bottom view showing a second positioning mark 94 drawn on the lower main surface of the substrate 9 by the second marker 521. As described above, the appearance of the first positioning mark 93 and the appearance of the second positioning mark 94 are different.
In the example shown in fig. 5, the first positioning mark 93 includes four circular first mark elements 931 of the same size. The four first mark elements 931 are located at four vertices of an imaginary square. In other words, the four first mark elements 931 are arranged in a grid shape in the X direction and the Y direction. In other words, in the first positioning mark 93, two other first mark elements 931 are arranged at substantially the same positions as the two first mark elements 931 in the X direction on the (+ Y) side of the two first mark elements 931 arranged in the X direction. The distance between two first mark elements 931 adjacent in the X direction is substantially the same as the distance between two first mark elements 931 adjacent in the Y direction.
In the example shown in fig. 6, the second positioning mark 94 includes four circular second mark elements 941 having the same size. The shape and size of each second mark element 941 is the same as those of the first mark element 931 described above. The second positioning mark 94 has the appearance of rotating the first positioning mark 93 by about 45 ° about the rotation axis toward the Z direction. Specifically, in the second positioning mark 94, one second mark element 941 is disposed on the most (-X) side, and the other second mark element 941 is disposed on the most (+ X) side. The two second mark elements 941 are disposed at substantially the same position in the Y direction. Further, between the two second mark elements 941 in the X direction, two second mark elements 941 are arranged side by side in the Y direction. The two second mark elements 941 are disposed on the (+ Y) side and the (-Y) side of the two second mark elements 941 on the (+ X) side and the (-X) side, respectively.
As described above, the first positioning mark 93 and the second positioning mark 94 have the same shape and size except for different orientations on the substrate 9. Therefore, as the second diaphragm 524 (see fig. 4) of the second marker 521, a member having the same shape as the first diaphragm 514 (see fig. 3) of the first marker 511 (i.e., a member having the same number, shape, size, and arrangement of openings) can be used only by changing the attachment orientation. Therefore, the manufacturing of the imaging system 1 can be simplified, and the manufacturing cost of the imaging system 1 can be reduced.
The shape of the first mark element 931 is not limited to a circular shape, and may be variously changed, for example, a triangular shape, a rectangular shape, a polygonal shape having five or more sides, an elliptical shape, a cross shape, or the like. The arrangement of the first mark elements 931 is not limited to the grid pattern, and may be variously changed. The number of the first mark elements 931 may be variously changed, and may be 1, or 2 or more. The second marker element 941 is identical to the first marker element 931.
The shape, arrangement, and number of the first mark elements 931 may be the same as or different from those of the second mark elements 941. For example, the first positioning mark 93 may include the four first mark elements 931 described above, and the second positioning mark 94 may include three second mark elements 941 omitting one second mark element 941 among the four second mark elements 941. In this case, the first positioning mark 93 and the second positioning mark 94 are different in shape.
Fig. 7 is a diagram showing a configuration of the computer 100 provided in the control unit 10. The computer 100 is a general-purpose computer including a processor 101, a memory 102, an input/output unit 103, and a bus 104. The bus 104 is a signal circuit connecting the processor 101, the memory 102, and the input/output unit 103. The memory 102 stores programs and various information. The processor 101 executes various processes (e.g., numerical calculation, image processing) using the memory 102 or the like in accordance with a program or the like stored in the memory 102. The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from an operator, and a display 107 for displaying output from the processor 101. The control unit 10 may be a Programmable Logic Controller (PLC), a circuit board, or the like, or may be a combination of these with one or more computers.
Fig. 8 is a block diagram showing the functions of the control unit 10 implemented by the computer 100. Fig. 8 also shows a configuration other than the control unit 10. The control unit 10 includes a storage unit 111, an imaging control unit 112, a detection unit 113, and a drawing control unit 114. The storage unit 111 is mainly realized by the memory 102, and stores in advance various kinds of information such as data of a predetermined pattern to be drawn on the substrate 9 (that is, drawing data), and first positional relationship information and second positional relationship information described below.
The first positional relationship information is information indicating a relative positional relationship in a plan view between the pattern drawn on the upper main surface by the pattern drawing unit 4 and the first positioning mark 93 (see fig. 5) drawn on the lower main surface by the first mark drawing unit 51 (see fig. 2) with respect to the substrate 9 conveyed by the first conveying mechanism 2a (i.e., the first stage 21a and the first moving mechanism 22a) shown in fig. 1. The second positional relationship information is information indicating a relative positional relationship in a plan view between the pattern drawn on the upper main surface by the pattern drawing unit 4 and the second positioning mark 94 (see fig. 6) drawn on the lower main surface by the second mark drawing unit 52 (see fig. 2) with respect to the substrate 9 conveyed by the second conveying mechanism 2b (i.e., the second stage 21b and the second moving mechanism 22 b).
The first positional relationship information is acquired in advance by performing, in the first conveyance mechanism 2a of the drawing apparatus 1, drawing of the pattern on the upper main surface of the test substrate and drawing of the first positioning mark 93 on the lower main surface, and measuring the relative position between the pattern and the first positioning mark 93. The second positional relationship information is acquired in advance by performing the drawing of the pattern on the upper main surface of the test substrate and the drawing of the second positioning mark 94 on the lower main surface in the second conveyance mechanism 2b of the drawing apparatus 1, and measuring the relative positions of the pattern and the second positioning mark 94.
The imaging control section 112, the detection section 113, and the drawing control section 114 shown in fig. 8 are mainly realized by the processor 101 (see fig. 7). The imaging control unit 112 controls the imaging unit 3, the first movement mechanism 22a, and the second movement mechanism 22b to cause the imaging unit 3 to image the upper main surface of the substrate 9 on the first stage 21a and the second stage 21b to acquire an image. The image is transmitted to the storage unit 111 and stored. The detection unit 113 detects the position of the substrate 9 using the image. The detection unit 113 also determines the type of the positioning mark in the image. Specifically, it is determined whether the positioning mark is the first positioning mark 93, the second positioning mark 94, or another positioning mark.
The drawing control unit 114 controls the pattern drawing unit 4, the first movement mechanism 22a, and the second movement mechanism 22b based on the position of the substrate 9 detected by the detection unit 113, the type of the positioning mark, and the drawing data and the like stored in advance in the storage unit 111, so that the pattern drawing unit 4 draws the substrate 9 on the first stage 21a and the second stage 21 b.
Next, a flow of drawing a pattern on the substrate 9 by the drawing apparatus 1 shown in fig. 1 will be described. In the drawing apparatus 1, generally, while the substrate 9 held on one of the first stage 21a and the second stage 21b is being drawn, the substrate 9 is carried into the other stage and subjected to positioning processing or the like. Then, when the drawing of the substrate 9 held on the one stage is completed, the drawing of the substrate 9 held on the other stage is started. While the substrate 9 on the other stage is being drawn, the drawn substrate 9 is carried out from the one stage, and a new substrate 9 is carried in on the one stage to perform alignment processing and the like. In the following description, it is assumed that the pattern drawing section 4 draws a pattern on the first main surface 91 of the substrate 9.
Fig. 9A and 9B are diagrams showing an example of a flow of the drawing process in the drawing apparatus 1. Steps S11 to S19 on the left side in fig. 9A and 9B show the flow of the drawing process for the substrate 9 on the first stage 21a, and steps S21 to S29 on the right side in fig. 9A and 9B show the flow of the drawing process for the substrate 9 on the second stage 21B. Further, steps located at the same position in the up-down direction in fig. 9A and 9B are executed substantially in parallel. Specifically, step S11 and steps S21 through S26 are executed substantially in parallel. Further, step S28 and steps S13 to S18 are executed substantially in parallel.
In fig. 9A and 9B, description will be made starting from a state where a pattern is drawn on the substrate 9 on the first stage 21a of the first conveyance mechanism 2 a. Fig. 10 to 15 are conceptual views showing the approximate positions of the first stage 21a and the second stage 21b in the Y direction of the drawing apparatus 1 during the drawing process. In fig. 10 to 15, the first stage 21a, the first movement mechanism 22a, the second stage 21b, and the second movement mechanism 22b are drawn by solid lines, and the camera 31 and the drawing head 41 are drawn by broken lines.
In the following description, the position of the first stage 21a in the Y direction is referred to as a "processing position", the position overlapping the camera 31 and/or the drawing head 41 in the up-down direction is referred to as a "carrying-in/out position", the position overlapping the (-Y) side end of the first movement mechanism 22a in the up-down direction is referred to as a "standby position", and the position overlapping the (+ Y) side end of the first movement mechanism 22a in the up-down direction is referred to as a "standby position". In addition, regarding the position of the second stage 21b in the Y direction, a position overlapping the camera 31 and/or the drawing head 41 in the up-down direction is referred to as a "processing position", a position overlapping the end portion on the (-Y) side of the second stage 21b in the up-down direction is referred to as a "carrying-in/out position", and a position overlapping the end portion on the (+ Y) side of the second moving mechanism 22b in the up-down direction is referred to as a "standby position". The processing position is not a concept of one point in the Y direction, but refers to a predetermined range (i.e., a processing region) in the Y direction in which the imaging unit 3 images the substrate 9 and the pattern drawing unit 4 draws the pattern.
In the drawing apparatus 1, as shown in fig. 10, in a state where the first stage 21a is located at the processing position and the drawing head 41 is located at the first drawing position, the pattern is drawn on the upper main surface (i.e., the first main surface 91) of the substrate 9 on the first stage 21a by the pattern drawing section 4. Further, the first positioning mark 93 is drawn by the first mark drawing part 51 (see fig. 2) on the lower main surface (i.e., the second main surface 92) of the substrate 9 on the first stage 21a (step S11). In step S11, the pattern drawing unit 4 and the first movement mechanism 22a are controlled by the drawing control unit 114 (see fig. 8), whereby the upper main surface of the substrate 9 moving in the (-Y) direction is drawn with a pattern at the processing position. The drawing of the first positioning mark 93 on the lower main surface of the substrate 9 may be performed in parallel with the drawing of the pattern on the upper main surface of the substrate 9, or may be performed before or after the drawing of the pattern.
In the drawing apparatus 1, in parallel with step S11, the drawn substrate 9 is carried out from the second stage 21b located at the carrying-in and carrying-out position, and a new substrate 9 is carried in and held on the second stage 21b (steps S21 and S22). Next, the second stage 21b is moved in the (+ Y) direction by the second moving mechanism 22b and positioned at the processing position shown in fig. 11 (step S23). In the state shown in fig. 11, the first stage 21a is kept at the processing position, and the pattern is drawn on the substrate 9 on the first stage 21 a. Further, the camera 31 is located at the second imaging position.
When the second stage 21b is positioned at the processing position, the imaging control unit 112 (see fig. 8) controls the imaging unit 3 and the second moving mechanism 22b to perform imaging of a positioning mark (not shown) provided on the upper main surface (i.e., the first main surface 91) of the substrate 9 on the second stage 21b, and the acquired image is transmitted to the detection unit 113 (see fig. 8). The positioning marks are provided in advance on the substrate 9 loaded onto the second stage 21b in step S22, and for example, the first positioning mark 93 and the second positioning mark 94 have different appearances.
The detection unit 113 performs pattern matching using the reference image for the image. The pattern matching is performed by, for example, a known pattern matching method (e.g., geometric shape pattern matching, normalized correlation search, etc.). Thereby, the position of the positioning mark in the image is obtained, and the position of the substrate 9 on the second stage 21b is detected (step S24).
The position of the substrate 9 detected by the detection unit 113 includes information indicating the X-direction and Y-direction coordinates of the substrate 9 on the second stage 21b, the orientation of the substrate 9, and deformation due to distortion of the substrate 9. The information indicating the deformation of the substrate 9 is information such as the shape of the deformed substrate 9 and the position of the drawing area on the substrate 9. The detection unit 113 adjusts the drawing data for the substrate 9 on the second stage 21b based on the detected position of the substrate 9 (i.e., positioning processing).
When the imaging of the substrate 9 on the second stage 21b is completed, the second stage 21b is moved in the (+ Y) direction by the second moving mechanism 22b to be positioned at the standby position shown in fig. 12 (step S25). In the state shown in fig. 12, the first stage 21a is kept at the processing position, and the pattern is drawn on the substrate 9 on the first stage 21 a. The second stage 21b waits at the standby position until the drawing of the pattern on the substrate 9 on the first stage 21a is completed (step S26).
When the drawing of the pattern of the substrate 9 on the first stage 21a and the first positioning mark 93 is completed (step S11), the first stage 21a is moved in the (-Y) direction by the first moving mechanism 22a and is positioned at the carrying in/out position shown in fig. 13 (step S12). In parallel with step S12, the second stage 21b is moved in the (-Y) direction by the second moving mechanism 22b and positioned at the processing position (step S27). Further, the camera 31 moves from the second imaging position to the first imaging position. The drawing head 41 moves from the first drawing position to the second drawing position.
Then, based on the above-described positioning-processed drawing data and the like, the drawing control unit 114 controls the pattern drawing unit 4 and the second moving mechanism 22b to draw a pattern on the upper main surface (i.e., the first main surface 91) of the substrate 9 on the second stage 21b which moves in the (-Y) direction at the processing position. Further, the second positioning mark 94 is drawn by the second mark drawing unit 52 (see fig. 2) on the lower main surface (i.e., the second main surface 92) of the substrate 9 on the second stage 21b (step S28). The second positioning mark 94 may be drawn on the lower main surface of the substrate 9 in parallel with the drawing of the pattern on the upper main surface of the substrate 9, or may be drawn before or after the drawing of the pattern.
In the drawing apparatus 1, in parallel with the drawing of the pattern on the substrate 9 on the second stage 21b, the drawn substrate 9 is carried out from the first stage 21a located at the carrying-in/out position, and a new substrate 9 is carried in and held on the first stage 21a (steps S13, S14). Next, the first stage 21a is moved in the (+ Y) direction by the first moving mechanism 22a and positioned at the processing position shown in fig. 14 (step S15). In the state shown in fig. 14, the second stage 21b is kept at the processing position, and the substrate 9 on the second stage 21b is subjected to pattern drawing.
When the first stage 21a is positioned at the processing position, the imaging control unit 112 controls the imaging unit 3 and the first moving mechanism 22a to image a positioning mark (not shown) provided on the upper main surface (i.e., the first main surface 91) of the substrate 9 on the first stage 21a by the camera 31, and the acquired image is transmitted to the detection unit 113. The positioning marks are provided in advance on the substrate 9 loaded onto the first stage 21a in step S14, and for example, the first positioning mark 93 and the second positioning mark 94 have different appearances.
The detection unit 113 performs pattern matching on the image in substantially the same manner as in step S24, and detects the position of the substrate 9 on the first stage 21a (step S16). The detection unit 113 adjusts predetermined pattern data (i.e., positioning processing) drawn on the substrate 9 on the first stage 21a based on the detected position of the substrate 9.
When the imaging of the substrate 9 on the first stage 21a is completed, the first stage 21a is moved in the (+ Y) direction by the first moving mechanism 22a and is positioned at the standby position shown in fig. 15 (step S17). In the state shown in fig. 15, the second stage 21b is kept at the processing position, and the pattern is drawn on the substrate 9 on the second stage 21 b. The first stage 21a waits at the standby position until the drawing of the pattern on the substrate 9 on the second stage 21b is completed (step S18).
When the drawing of the pattern of the substrate 9 on the second stage 21b and the second positioning mark 94 is completed (step S28), the second stage 21b is moved in the (-Y) direction by the second moving mechanism 22b and is positioned at the carrying-in/out position shown in fig. 10 (step S29). Further, in parallel with step S29, the first stage 21a is moved in the (-Y) direction by the first movement mechanism 22a to be located at the processing position (step S19). Further, the camera 31 moves from the first imaging position to the second imaging position. The drawing head 41 moves from the second drawing position to the first drawing position.
Then, the process returns from step S19 to step S11, and based on the above-described positioning-processed drawing data and the like, the drawing control unit 114 controls the pattern drawing unit 4 and the first movement mechanism 22a to draw a pattern on the upper main surface (i.e., the first main surface 91) of the substrate 9 on the first stage 21a, which is moved in the (-Y) direction at the processing position. The first positioning mark 93 is drawn by the first mark drawing part 51 on the lower main surface (i.e., the second main surface 92) of the substrate 9 on the first stage 21a (step S11). From step S29, the process returns to step S21, where the drawn substrate 9 is carried out from the second stage 21b located at the carrying in/out position, and a new substrate 9 is carried in and held on the second stage 21b (steps S21 and S22). In the drawing apparatus 1, steps S11 to S19 and steps S21 to S29 are repeated, and the plurality of substrates 9 are sequentially drawn.
Next, the operation of the drawing apparatus 1 when the substrate 9 having the pattern drawn on the first main surface 91 is drawn on the second main surface 92 by the pattern drawing unit 4 will be described. Hereinafter, a case where a pattern is drawn on the second main surface 92 of the substrate 9 held by the second stage 21B will be described with reference to fig. 9A and 9B. Further, in general, the substrate 9 on the first stage 21a is patterned in substantially the same manner as described above in parallel with the patterning of the substrate 9 on the second stage 21b, but for simplification of the description, a description of the processing of the substrate 9 on the first stage 21a will be omitted.
In the drawing apparatus 1, first, the substrate 9 with the second main surface 92 facing upward is carried in and held on the second stage 21b in substantially the same manner as in step S22 (step S22). The pattern is drawn in advance on the first main surface 91 (i.e., the lower main surface) of the substrate 9 by the drawing apparatus 1. When the first conveyance mechanism 2a performs pattern drawing on the first main surface 91, the first positioning mark 93 is drawn on the second main surface 92 of the substrate 9 (see fig. 5). When the second conveyance mechanism 2b performs pattern drawing on the first main surface 91, the second positioning mark 94 is drawn on the second main surface 92 of the substrate 9 (see fig. 6).
Next, the second stage 21b is moved in the (+ Y) direction from the carrying in/out position by the second moving mechanism 22b and is positioned at the processing position (step S23). Then, the imaging control unit 112 (see fig. 8) controls the imaging unit 3 and the second moving mechanism 22b to image the positioning mark (i.e., the first positioning mark 93 or the second positioning mark 94) provided on the upper main surface (i.e., the second main surface 92) of the substrate 9 on the second stage 21b, and the acquired image is transmitted to the detection unit 113 (see fig. 8).
The detection unit 113 performs pattern matching on the image in substantially the same manner as described above, and determines the type of the positioning mark in the image. Specifically, it is determined whether the positioning mark is the first positioning mark 93 or the second positioning mark 94. Further, the detection section 113 obtains the position of the positioning mark in the image by the above-described pattern matching, and detects the position of the substrate 9 on the second stage 21b (step S24). The detection unit 113 adjusts (i.e., performs positioning processing) drawing data for the substrate 9 on the second stage 21b based on the detected position of the substrate 9.
In the pattern matching of step S24, the rotation and expansion and contraction of the templates of the first positioning mark 93 and the second positioning mark 94 are permitted to cope with the inclination (i.e., deviation from a predetermined orientation) of the substrate 9 on the second stage 21b, the expansion and contraction of the substrate 9, and the like. However, since the above-described tilt and expansion of the base plate 9 are small, the rotation and expansion allowed by the template are also small. For example, the allowable rotation angle is 10 ° or less, and the allowable expansion ratio is 30% or less.
Therefore, as illustrated in fig. 5 and 6, when the second positioning mark 94 has an appearance in which the first positioning mark 93 is rotated by a large angle (for example, 45 °), the first positioning mark 93 and the second positioning mark 94 are not erroneously recognized in the above-described pattern matching. From the viewpoint of preventing this misrecognition, when the first positioning mark 93 is similar in shape to the second positioning mark 94, the second positioning mark 94 preferably has an appearance that at least the first positioning mark 93 is rotated more than 10 °, or is expanded or contracted more than 30%. From the viewpoint of preventing such erroneous recognition, it is also preferable that the first positioning mark 93 and the second positioning mark 94 have dissimilar shapes.
When the imaging of the substrate 9 on the second stage 21b is completed, the second stage 21b is moved from the processing position to the standby position by the second moving mechanism 22b and is on standby at the standby position (steps S25, S26). When the standby of the second stage 21b is completed, the second stage 21b is moved from the standby position to the processing position by the second moving mechanism 22b (step S27).
Then, based on the above-described positioning-processed drawing data, the type of the positioning mark detected by the detection unit 113, and the like, the drawing control unit 114 (see fig. 8) controls the pattern drawing unit 4 and the second movement mechanism 22b to draw a pattern on the second main surface 92 of the substrate 9 (i.e., the main surface on which the first positioning mark 93 or the second positioning mark 94 is drawn) on the second stage 21b that moves in the (-Y) direction at the processing position (step S28). When the pattern is drawn on the second main surface 92, it is not necessary to draw a positioning mark on the first main surface 91 (i.e., the lower main surface).
In step S28, when the first positioning mark 93 is drawn on the second main surface 92 of the substrate 9, the drawing control unit 114 determines that the first conveyance mechanism 2a has performed pattern drawing on the first main surface 91 of the substrate 9, and reads the first positional relationship information from the storage unit 111. As described above, the first positional relationship information is information indicating the positional relationship between the pattern drawn on the first main surface 91 of the substrate 9 by the first conveyance mechanism 2a and the first positioning mark 93 drawn on the second main surface 92. In the drawing apparatus 1, the pattern drawing unit 4 and the second moving mechanism 22b are controlled by the drawing control unit 114 based on the first positional relationship information, the positioning-processed drawing data, and the like, so that the drawing position of the pattern with respect to the second main surface 92 of the substrate 9 on the second stage 21b is adjusted, and the pattern is drawn on the second main surface 92. Thus, the relative position between the pattern already drawn on the first main surface 91 of the substrate 9 and the pattern drawn on the second main surface 92 can be made substantially the same as the desired relative position.
On the other hand, when the second positioning mark 94 is drawn on the second main surface 92 of the substrate 9, the drawing control unit 114 determines that the second conveyance mechanism 2b has drawn the pattern on the first main surface 91 of the substrate 9, and reads the second positional relationship information from the storage unit 111. As described above, the second positional relationship information is information indicating the relative positional relationship between the pattern drawn on the first main surface 91 of the substrate 9 by the second conveyance mechanism 2b and the second positioning mark 94 drawn on the second main surface 92. In the drawing apparatus 1, the pattern drawing unit 4 and the second moving mechanism 22b are controlled by the drawing control unit 114 based on the second positional relationship information, the positioning-processed drawing data, and the like, so that the drawing position of the pattern with respect to the second main surface 92 of the substrate 9 on the second stage 21b is adjusted, and the pattern is drawn on the second main surface 92. Thus, the relative position between the pattern already drawn on the first main surface 91 of the substrate 9 and the pattern drawn on the second main surface 92 can be made substantially the same as the desired relative position.
As described above, the drawing system (the drawing apparatus 1 in the above-described example) that draws on the substrate 9 includes the pattern drawing unit 4, the first conveyance mechanism 2a, the first mark drawing unit 51, the second conveyance mechanism 2b, and the second mark drawing unit 52. The pattern drawing unit 4 draws a pattern by irradiating light onto the upper main surface of the substrate 9 which is horizontally moved downward. The first conveyance mechanism 2a includes a first substrate holding portion (i.e., a first stage 21a) and a first movement mechanism 22a that moves the first stage 21a horizontally below the pattern drawing portion 4. The first mark drawing unit 51 irradiates the lower main surface of the substrate 9 held by the first stage 21a with light to draw the first positioning mark 93 associated with the first conveyance mechanism 2 a. The second conveyance mechanism 2b includes a second substrate holding portion (i.e., a second stage 21b) and a second movement mechanism 22b that moves the second stage 21b horizontally below the pattern drawing portion 4. The second mark drawing unit 52 irradiates the lower main surface of the substrate 9 held by the second stage 21b with light to draw the second positioning mark 94 associated with the second conveyance mechanism 2 b. The second positioning mark 94 has a different appearance from the first positioning mark 93.
Therefore, by observing the positioning marks drawn on the other main surface of the substrate 9, it is easy to determine which of the first and second conveying mechanisms 2a and 2b the pattern drawing unit 4 uses when the pattern drawing is performed on the one main surface of the substrate 9 in the step after the pattern drawing. Accordingly, the pattern can be drawn on the other main surface of the substrate 9 while adjusting the drawing position in consideration of the positional relationship between the front surface and the back surface (that is, the relative positional relationship between the pattern on the upper surface and the positioning mark on the lower surface) unique to the conveyance mechanism used when drawing the pattern on the one main surface. As a result, the relative positional accuracy of the patterns drawn on the both principal surfaces of the substrate 9 can be improved.
As described above, the drawing device 1 preferably further includes the storage unit 111 that stores the first positional relationship information and the second positional relationship information in advance, and the imaging control unit 112 that controls the pattern drawing unit 4. The first positional relationship information indicates a relative positional relationship between the pattern drawn on the upper main surface by the pattern drawing unit 4 and the first positioning mark 93 drawn on the lower main surface by the first mark drawing unit 51 with respect to the substrate 9 conveyed by the first conveying mechanism 2 a. The second positional relationship information indicates a relative positional relationship between the pattern drawn by the pattern drawing unit 4 on the upper main surface of the substrate 9 conveyed by the second conveying mechanism 2b and the second positioning mark 94 drawn by the second mark drawing unit 52 on the lower main surface. Preferably, the imaging control unit 112 adjusts the drawing position based on the first positional relationship information when the pattern drawing unit 4 draws the pattern on the main surface on which the first positioning mark 93 is drawn, and adjusts the drawing position based on the second positional relationship information when the pattern drawing unit 4 draws the pattern on the main surface on which the second positioning mark 94 is drawn. This makes it possible to provide the substrate 9 having high relative positional accuracy of the patterns drawn on the main surfaces on both sides.
As described above, the first mark drawing unit 51 preferably includes the first mask portion (the first aperture 514 in the above example) through which a part of the light from the light source 512 passes, and the second mark drawing unit 52 preferably includes the second mask portion (the second aperture 524 in the above example) which has an opening different from that of the first mask portion and through which a part of the light from the light source 522 passes. Thus, the appearance of the first positioning mark 93 and the appearance of the second positioning mark 94 can be made different without greatly changing the configurations of the first mark drawing part 51 and the second mark drawing part 52 (that is, changing only the first mask part and the second mask part). Therefore, the relative positional accuracy of the patterns drawn on the both principal surfaces of the substrate 9 can be improved while suppressing the complexity of the configuration of the drawing apparatus 1.
As described above, it is also preferable that the first positioning mark 93 and the second positioning mark 94 have non-similar shapes. Thus, even when the template is rotated or expanded or contracted at the time of pattern matching, the types of the positioning marks can be determined with high accuracy while preventing the first positioning mark 93 and the second positioning mark 94 from being erroneously recognized.
As described above, the pattern drawing unit 4 includes the drawing head 41 that irradiates light downward, and the drawing head moving mechanism 42 that moves the drawing head 41 between the first drawing position above the first conveying mechanism 2a and the second drawing position above the second conveying mechanism 2 b. In this way, by performing the drawing of the substrate 9 on the first stage 21a and the drawing of the substrate 9 on the second stage 21b using the common drawing head 41, the configuration of the drawing apparatus 1 can be simplified and the drawing apparatus can be downsized. As described above, in the drawing apparatus 1, it is possible to easily determine which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used when the pattern is drawn on the one principal surface of the substrate 9 by the pattern drawing unit 4 in the process after the pattern is drawn. Therefore, the configuration of the drawing apparatus 1 is particularly suitable for the drawing apparatus 1 in which the pattern drawing on the both principal surfaces of the substrate 9 can be performed by either one of the first conveyance mechanism 2a and the second conveyance mechanism 2 b.
In the examples shown in fig. 5 and 6, the first positioning mark 93 and the second positioning mark 94 are simple figures obtained by arranging circular mark elements, respectively, but are not limited thereto. For example, the first positioning mark 93 may be a barcode indicating information related to the first conveyance mechanism 2a, and the second positioning mark 94 may be a barcode indicating information related to the second conveyance mechanism 2 b. In this case, by imaging the first positioning mark 93 by the imaging unit 3, information about the conveyance mechanism used for pattern drawing of the substrate 9 can be acquired in parallel with the determination of the type of the conveyance mechanism (i.e., the first conveyance mechanism 2a or the second conveyance mechanism 2 b).
When the first positioning mark 93 is a barcode, the information indicated by the barcode includes, for example, an identification number indicating the first conveying mechanism 2a and first positional relationship information. When the second positioning mark 94 is a barcode, the information indicated by the barcode includes, for example, an identification number indicating the second conveyance mechanism 2b and second positional relationship information. As the first positioning mark 93 and the second positioning mark 94, a one-dimensional barcode or a two-dimensional barcode may be used.
The first positioning mark 93 and the second positioning mark 94 may be marks other than bar codes containing the above information. For example, the first positioning mark 93 may be a symbol indicating the first conveyance mechanism 2a, and the second positioning mark 94 may be a symbol indicating the second conveyance mechanism 2 b.
Various modifications may be made to the drawing apparatus 1.
In the above example, the same two first positioning marks 93 are drawn on the lower main surface of the substrate 9 by the first mark drawing part 51, and the same two second positioning marks 94 are drawn on the lower main surface of the substrate 9 by the second mark drawing part 52, but the present invention is not limited thereto. For example, the two first positioning marks 93 may be different from each other in shape, size, orientation, or the like. Likewise, the two second positioning marks 94 may be different from each other in shape, size, orientation, or the like. In addition, in the case where the appearance of one first positioning mark 93 of the two first positioning marks 93 and the appearance of one second positioning mark 94 of the two second positioning marks 94 are different, the other first positioning mark 93 and the other second positioning mark 94 may have the same appearance.
The arrangement of the two first positioning marks 93 drawn on the lower main surface of the substrate 9 by the first mark drawing part 51 and the arrangement of the two second positioning marks 94 drawn on the lower main surface of the substrate 9 by the second mark drawing part 52 (that is, the relative positions of the two positioning marks) on the substrate 9 may be different. For example, the two first positioning marks 93 may be arranged in the X direction at the end on the (-Y) side of the lower main surface of the substrate 9, and the two second positioning marks 94 may be arranged at the end on the (-Y) side and the end on the (+ Y) side of the lower main surface of the substrate 9. Even in this case, since the appearance when the two first positioning marks 93 are observed together is different from the appearance when the two second positioning marks 94 are observed together, it is possible to easily determine which of the first conveyance mechanism 2a and the first conveyance mechanism 2a is used to perform the pattern drawing of the upper main surface of the substrate 9, similarly to the above. In addition, when the arrangement is different as described above, each of the first positioning marks 93 and each of the second positioning marks 94 may have the same shape.
In the drawing apparatus 1, the number of the first positioning marks 93 drawn on the lower main surface of the substrate 9 by the first mark drawing section 51 may be 3 or more. The number of the second positioning marks 94 drawn by the second mark drawing section 52 on the lower main surface of the substrate 9 may be 3 or more.
In the first marker 511, for example, a glass mask member on which a pattern corresponding to the first positioning mark 93 is drawn may be disposed as a first mask portion on the (+ Z) side of the light source 512 and the optical system 513 instead of the first diaphragm 514. Similarly, in the second marker 521, a glass mask member on which a pattern corresponding to the second positioning mark 94 is drawn may be disposed as a second mask portion on the (+ Z) side of the light source 522 and the optical system 523, instead of the second diaphragm 524.
The first marker 511 of the first marker drawing unit 51 does not necessarily have to be disposed inside the first stage 21 a. For example, the first marker 511 is disposed vertically below the movement path of the first stage 21a at the processing position, and the first positioning marker 93 can be drawn by irradiating the lower main surface of the substrate 9 with light through a through hole provided in the first stage 21a in a state where the first stage 21a is positioned above the first marker 511. The same applies to the second marker 521 of the second mark drawing unit 52.
The light sources of the plurality of first markers 511 may be shared by the first marker drawing unit 51. For example, light from a common light source may be guided to the optical systems 513 of the plurality of first markers 511 via a plurality of optical fibers, respectively. The same applies to the second mark drawing portion 52.
In the drawing apparatus 1, in addition to the first positioning mark 93, a mark (for example, a barcode or a numeral) including information related to the first conveying mechanism 2a such as the first positional relationship information may be drawn on the lower main surface of the substrate 9 by the first mark drawing unit 51. In addition to the second positioning marks 94, marks (for example, bar codes and numbers) including information related to the second conveying mechanism 2b such as the second positional relationship information may be drawn on the lower main surface of the substrate 9 by the second mark drawing unit 52.
In the imaging apparatus 1, the first conveyance mechanism 2a may further include at least one of a movement mechanism that moves the first stage 21a in the X direction, a rotation mechanism that rotates the first stage 21a about a rotation axis extending in the Z direction, and an elevation mechanism that moves the first stage 21a in the Z direction. As the moving mechanism and the elevating mechanism, for example, a linear servo motor can be used. Further, as the rotation mechanism, for example, a servo motor can be used. The structures of the moving mechanism, the rotating mechanism and the lifting mechanism can be variously changed. The second conveyance mechanism 2b is the same as the first conveyance mechanism 2 a.
The pattern drawing unit 4 may be provided with a drawing head 41 for irradiating the substrate 9 on the first stage 21a with light at a first drawing position and a drawing head 41 for irradiating the substrate 9 on the second stage 21b with light at a second drawing position. In this case, the drawing head moving mechanism 42 may be omitted. Further, the imaging section 3 may be provided with a camera 31 that images the substrate 9 on the first stage 21a at a first imaging position and a camera 31 that images the substrate 9 on the second stage 21b at a second imaging position, respectively. In this case, the camera moving mechanism 32 may be omitted. Further, in the drawing apparatus 1, a first unit including the first conveyance mechanism 2a, the first mark drawing part 51, the camera 31 for imaging the substrate 9 on the first stage 21a at the first imaging position, and the drawing head 41 for irradiating light to the substrate 9 on the first stage 21a, and a second unit including the second conveyance mechanism 2b, the second mark drawing part 52, the camera 31 for imaging the substrate 9 on the second stage 21b at the second imaging position, and the drawing head 41 for irradiating light to the substrate 9 on the second stage 21b may be separately provided.
In the imaging apparatus 1, a third stage and a third moving mechanism for moving the third stage in the Y direction may be provided in addition to the first and second conveying mechanisms 2a and 2b, and various processes (positioning process, imaging process, and carrying-in and carrying-out of the substrate 9) may be performed in parallel on the first and second stages 21a and 21b and the substrate 9 on the third stage.
Fig. 16 is a side view of another preferred imaging system 1a of the present invention viewed from the (-Y) side. In fig. 16, the camera 31, the first chassis section 72, and the like are not illustrated. In the drawing apparatus 1a, the first stage 21a and the second stage 21b are arranged adjacent to each other in the vertical direction. In the example shown in fig. 16, the second stage 21b is disposed separately below the first stage 21 a. The first movement mechanism 22a supports the first stage 21a from the side (i.e., (-X) side). The second movement mechanism 22b supports the second stage 21b from the side (i.e., (+ X) side).
The first conveyance mechanism 2a includes a first elevating mechanism, not shown, for vertically moving the first stage 21 a. The second conveyance mechanism 2b includes a second elevation mechanism, not shown, for vertically moving the second stage 21 b. When a pattern is drawn on the upper main surface of the substrate 9 on the first stage 21a by the plurality of drawing heads 41 supported by the second frame part 73 and then a pattern is drawn on the upper main surface of the substrate 9 on the second stage 21b, the first stage 21a is lowered from the state shown in fig. 16 to the position of the second stage 21b in fig. 16, and the second stage 21b is raised to the position of the first stage 21a in fig. 16. The other structures of the drawing apparatus 1a are substantially the same as the corresponding structures of the drawing apparatus 1.
In substantially the same manner as in the above-described imaging system 1, the first movement mechanism 22a and the second movement mechanism 22b are arranged side by side in a direction intersecting the substrate movement direction (i.e., Y direction). In the example shown in fig. 16, the first movement mechanism 22a and the second movement mechanism 22b are arranged side by side in the X direction, and the second movement mechanism 22b is adjacent to the (+ X) side of the first movement mechanism 22 a. The first movement mechanism 22a and the second movement mechanism 22b are located at substantially the same height in the vertical direction.
In the same manner as in the drawing apparatus 1, in the drawing apparatus 1a, a first positioning mark 93 is drawn on the lower main surface of the substrate 9 held by the first stage 21a, and a second positioning mark 94 having a different appearance from the first positioning mark 93 is drawn on the lower main surface of the substrate 9 held by the second stage 21 b. Thus, by observing the type of the positioning mark drawn on the other main surface of the substrate 9, it is possible to easily determine which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used when the pattern is drawn on the one main surface of the substrate 9 by the pattern drawing section 4 in the process after the pattern is drawn.
In the above example, the drawing system is described as the drawing apparatus 1 of the two-stage type, but the present invention is not limited thereto. For example, the drawing system may include two single-object desktop drawing apparatuses. In this case, one drawing device includes the first transport mechanism 2a, the first mark drawing section 51, and a first pattern drawing section that draws a pattern on the upper main surface of the substrate 9 on the first stage 21 a. The other drawing device includes the second conveyance mechanism 2b, the second mark drawing unit 52, and a second pattern drawing unit that draws a pattern on the upper main surface of the substrate 9 on the second stage 21 b. The first pattern drawing unit includes one or more than two drawing heads 41. Similarly, the second pattern drawing unit includes one or more than two drawing heads 41. In this drawing system, a first pattern drawing unit and a second pattern drawing unit are combined to form a pattern drawing unit 4 that draws a pattern by irradiating light onto the upper main surface of a substrate 9 that moves horizontally downward.
In this drawing system, as in the drawing apparatus 1 described above, the first positioning mark 93 is drawn on the lower main surface of the substrate 9 held by the first stage 21a, and the second positioning mark 94 having a different appearance from the first positioning mark 93 is drawn on the lower main surface of the substrate 9 held by the second stage 21 b. Thus, by observing the type of the positioning mark drawn on the other main surface of the substrate 9, it is possible to easily determine which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used when the pattern is drawn on the one main surface of the substrate 9 by the pattern drawing section 4 in the process after the pattern is drawn.
The substrate 9 is not necessarily limited to a printed circuit board. In the imaging devices 1 and 1a, for example, position detection of a semiconductor substrate, a glass substrate for a flat panel display device such as a liquid crystal display device or an organic EL display device, a glass substrate for a photomask, a substrate for a solar cell panel, or the like can be performed.
The configurations in the above-described embodiment and the modifications may be appropriately combined as long as they are not contradictory to each other.
While the present invention has been described in detail, the foregoing description is illustrative only and not limiting. Thus, it can be said that various modifications and modes are possible without departing from the scope of the present invention.

Claims (6)

1. A drawing system for drawing a substrate, comprising:
a pattern drawing unit that draws a pattern by irradiating light onto an upper main surface of a substrate horizontally moving downward;
a first conveyance mechanism including a first substrate holding unit and a first movement mechanism for horizontally moving the first substrate holding unit below the pattern drawing unit;
a first mark drawing unit that irradiates light onto the lower main surface of the substrate held by the first substrate holding unit to draw a first positioning mark associated with the first transport mechanism;
a second conveyance mechanism including a second substrate holding unit and a second movement mechanism for horizontally moving the second substrate holding unit below the pattern drawing unit; and
and a second mark drawing unit configured to draw a second positioning mark associated with the second conveyance mechanism, the second positioning mark having a different appearance from the first positioning mark, by irradiating light onto the lower main surface of the substrate held by the second substrate holding unit.
2. The drawing system according to claim 1, further comprising:
a storage unit that stores, in advance, first positional relationship information indicating a relative positional relationship between a pattern drawn by the pattern drawing unit on the upper main surface of the substrate conveyed by the first conveying mechanism and the first positioning mark drawn by the first mark drawing unit on the lower main surface, and second positional relationship information indicating a relative positional relationship between a pattern drawn by the pattern drawing unit on the upper main surface of the substrate conveyed by the second conveying mechanism and the second positioning mark drawn by the second mark drawing unit on the lower main surface; and
a drawing control unit for controlling the pattern drawing unit,
the drawing control unit adjusts the drawing position based on the first positional relationship information when the pattern drawing unit draws the main surface on which the first positioning mark is drawn, and adjusts the drawing position based on the second positional relationship information when the pattern drawing unit draws the main surface on which the second positioning mark is drawn.
3. The drawing system recited in claim 1,
the first mark drawing section includes a first mask section that passes a part of light from a light source,
the second mark drawing section includes a second mask section having an opening different from the first mask section and allowing a part of light from the light source to pass therethrough.
4. The drawing system recited in claim 1,
the first and second positioning marks are non-similar in shape.
5. The drawing system recited in claim 1,
the first positioning mark is a bar code representing information relating to the first carrying mechanism,
the second positioning mark is a bar code representing information related to the second conveyance mechanism.
6. The drawing system according to any one of claims 1 to 5,
the pattern drawing section includes:
a drawing head for irradiating light downward; and
and a drawing head moving mechanism for moving the drawing head between a first drawing position above the first conveying mechanism and a second drawing position above the second conveying mechanism.
CN202110993331.XA 2020-09-23 2021-08-26 Drawing system Pending CN114253086A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-158775 2020-09-23
JP2020158775A JP7458950B2 (en) 2020-09-23 2020-09-23 Drawing System

Publications (1)

Publication Number Publication Date
CN114253086A true CN114253086A (en) 2022-03-29

Family

ID=80791375

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110993331.XA Pending CN114253086A (en) 2020-09-23 2021-08-26 Drawing system

Country Status (4)

Country Link
JP (1) JP7458950B2 (en)
KR (1) KR102653607B1 (en)
CN (1) CN114253086A (en)
TW (1) TWI778659B (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006527A (en) 2002-05-31 2004-01-08 Canon Inc Position detection device and position detection method, exposure device, and device manufacturing method and substrate
JP2005195877A (en) 2004-01-07 2005-07-21 Seiko Epson Corp Reticle and manufacturing method of semiconductor device
JP2008124142A (en) * 2006-11-09 2008-05-29 Dainippon Screen Mfg Co Ltd Position detecting method and apparatus, pattern drawing apparatus, and object to be detected
JP2009223262A (en) 2008-03-19 2009-10-01 Orc Mfg Co Ltd Exposure system and exposure method
JP5245506B2 (en) * 2008-04-16 2013-07-24 株式会社ニコン Stage apparatus, exposure method and apparatus, and device manufacturing method
JP5961429B2 (en) 2012-03-30 2016-08-02 株式会社アドテックエンジニアリング Exposure drawing apparatus and exposure drawing method
CN107966881B (en) * 2017-03-15 2018-11-23 上海微电子装备(集团)股份有限公司 Lithographic equipment and method
JP6783172B2 (en) * 2017-03-24 2020-11-11 株式会社Screenホールディングス Drawing device and drawing method
JP7412872B2 (en) * 2017-10-31 2024-01-15 株式会社アドテックエンジニアリング Double-sided exposure device
JP6978284B2 (en) * 2017-11-09 2021-12-08 株式会社日立ハイテクファインシステムズ Exposure system, exposure method, and manufacturing method of display panel substrate
JP7084227B2 (en) * 2018-06-22 2022-06-14 株式会社Screenホールディングス Mark position detection device, drawing device and mark position detection method
JP2020046581A (en) * 2018-09-20 2020-03-26 株式会社Screenホールディングス Drawing apparatus and drawing method

Also Published As

Publication number Publication date
KR20220040365A (en) 2022-03-30
JP2022052397A (en) 2022-04-04
KR102653607B1 (en) 2024-04-01
TW202212985A (en) 2022-04-01
JP7458950B2 (en) 2024-04-01
TWI778659B (en) 2022-09-21

Similar Documents

Publication Publication Date Title
KR100909159B1 (en) Position detecting method, position detecting device, pattern drawing device and detected object
US8223319B2 (en) Exposure device
JP4324606B2 (en) Alignment apparatus and exposure apparatus
US6245585B1 (en) Method of providing levelling and focusing adjustments on a semiconductor wafer
US9329504B2 (en) Method of aligning an exposure apparatus, method of exposing a photoresist film using the same and exposure apparatus for performing the method of exposing a photoresist film
US20180017876A1 (en) Micro led array as illumination source
CN114253086A (en) Drawing system
CN114253085A (en) Drawing device
JP2006201516A (en) Clamping system, image forming apparatus and clump method
TWI771080B (en) Substrate position detection method, drawing method, substrate position detection apparatus and drawing apparatus
US20230144586A1 (en) Methods and apparatus for correcting lithography systems
KR20240041212A (en) Template generating apparatus, drawing system, template generating method and program recorded on recording medium
CN115729051A (en) Drawing device and drawing method
JP2024046014A (en) Drawing position information acquisition method and drawing method
KR20230031775A (en) Drawing system, drawing method and, program recorded on storage medium
KR20240040604A (en) Drawing system and drawing method
JPH05190639A (en) Method and device for focusing
CN114967378A (en) Drawing device, drawing method, and storage medium storing program
KR20190110429A (en) Pattern drawing apparatus and pattern drawing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination