TW202212985A - Drawing system - Google Patents

Drawing system Download PDF

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TW202212985A
TW202212985A TW110121274A TW110121274A TW202212985A TW 202212985 A TW202212985 A TW 202212985A TW 110121274 A TW110121274 A TW 110121274A TW 110121274 A TW110121274 A TW 110121274A TW 202212985 A TW202212985 A TW 202212985A
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Taiwan
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substrate
pattern
main surface
alignment mark
stage
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TW110121274A
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Chinese (zh)
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TWI778659B (en
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早川直人
原望
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日商斯庫林集團股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/708Mark formation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7084Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engine Equipment That Uses Special Cycles (AREA)
  • Lubricants (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)

Abstract

A first mark drawing unit draws a first alignment mark on a lower main surface of a substrate 9 held by a first stage 21a. A second mark drawing unit draws the second alignment mark on a lower main surface of a substrate 9 held by a second stage 21b. The appearance of the second alignment mark is different from that of the first alignment mark. Therefore, a transport mechanism used when drawing a pattern on one main surface of the substrate 9 can be easily identified by observing the alignment mark drawn on the other main surface of the substrate 9. As a result, a pattern can be drawn on the other main surface of the substrate 9 after adjusting the drawing position in consideration of the front-back positional relationship unique to the transport mechanism used at the time of pattern drawing. As a result, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate 9 can be improved.

Description

描繪系統delineation system

本發明係有關於一種用以對基板進行描繪之描繪系統。 [相關申請案的參照] 本申請案係主張2020年9月23日所申請的日本專利申請案JP2020-158775的優先權的權利,將日本專利申請案JP2020-158775的全部的揭示內容援用於本申請案。 The present invention relates to a drawing system for drawing a substrate. [Reference to related applications] This application claims the right of priority based on Japanese Patent Application JP2020-158775 filed on September 23, 2020, and the entire disclosure of Japanese Patent Application JP2020-158775 is incorporated herein by reference.

以往,對形成於半導體基板、印刷基板、有機EL(electroluminescence;電致發光)顯示裝置或者液晶顯示裝置用的玻璃基板等(以下稱為「基板」)之感光材料照射光線,藉此進行圖案(pattern)的描繪。此外,亦會有對基板的雙面進行圖案的描繪之情形。在此情形中,為了使基板的雙面的圖案描繪位置對合,在朝基板表面描繪圖案時,對基板背面形成對準標記(alignment mark)。Conventionally, patterning (hereinafter referred to as "substrate") is performed by irradiating light to a photosensitive material formed on a semiconductor substrate, a printed substrate, an organic EL (electroluminescence) display device, or a glass substrate for a liquid crystal display device (hereinafter referred to as "substrate"). pattern) description. In addition, there are cases where the pattern is drawn on both sides of the substrate. In this case, in order to align the pattern drawing positions on both sides of the substrate, an alignment mark is formed on the back surface of the substrate when the pattern is drawn on the front surface of the substrate.

在日本特開2016-48273號公報(文獻1)的描繪裝置中,於供基板載置的描繪台內建有對準標記形成光源,從對準標記形成光源經由設置於描繪台的上表面之貫通孔對基板背面照射光線,從而形成有對準標記。而且,在基板被翻轉並對基板背面描繪圖案時,使用該對準標記進行對準處理,藉此進行基板的雙面中的圖案描繪位置的位置對合。In the drawing apparatus of Japanese Patent Laid-Open No. 2016-48273 (Document 1), an alignment mark forming light source is built in a drawing table on which a substrate is placed, and the alignment mark forming light source is provided on the upper surface of the drawing table from the alignment mark forming light source. Alignment marks are formed by irradiating light to the back surface of the substrate through the through holes. Then, when the substrate is turned over and a pattern is drawn on the back surface of the substrate, an alignment process is performed using the alignment marks, whereby the positional alignment of the pattern drawing positions on both sides of the substrate is performed.

近年來已提出一種技術:為了提升描繪裝置的產出量(throughput),於一台描繪裝置內設置兩個台(stage),在對一方的台上的基板進行描繪時,對另一方的台上的基板進行對準處理等。於在此種雙台型(twin stage type)的描繪裝置中對基板的雙面進行圖案描繪之情形中,朝基板表面之圖案描繪與朝基板背面之圖案描繪係會有在相同的台上進行之情形,亦會有在不同的台上進行之情形。In recent years, a technique has been proposed: in order to increase the throughput of the drawing device, two stages are installed in one drawing device, and when drawing the substrate on one stage, the other stage is drawn. Alignment processing, etc. on the substrate. In the case of drawing patterns on both sides of the substrate in such a twin stage type drawing device, the pattern drawing toward the substrate surface and the pattern drawing toward the backside of the substrate are performed on the same stage. In other cases, there will also be situations where it will be performed on a different stage.

另一方面,形成於基板背面之對準標記的位置與描繪至基板表面之圖案的位置之間的關係會在每個台(以及台移動機構)不同。因此,在不同的台上進行朝基板表面以及基板背面的圖案描繪之情形中,當進行與在相同的台上進行朝基板表面以及基板背面的圖案描繪之情形相同的對準處理時,會有描繪至基板表面的圖案與描繪至基板背面的圖案之間的相對位置產生偏移之虞。On the other hand, the relationship between the position of the alignment mark formed on the back surface of the substrate and the position of the pattern drawn on the substrate surface differs for each stage (and the stage moving mechanism). Therefore, in the case where the pattern drawing on the substrate surface and the substrate back surface is performed on different stages, when performing the same alignment process as in the case where the pattern drawing on the substrate surface and the substrate back surface is performed on the same stage, there will be The relative position between the pattern drawn on the substrate surface and the pattern drawn on the backside of the substrate may be shifted.

本發明係著眼於用以對基板進行描繪之描繪系統,目的在於提升描繪至基板的兩側的主表面之圖案的相對性的位置精度。The present invention focuses on a drawing system for drawing a board, and aims to improve the relative positional accuracy of the pattern drawn on the main surfaces on both sides of the board.

本發明的較佳的一態樣的描繪系統係具備:圖案描繪部,係對在下方水平移動之基板的上側的主表面照射光線並描繪圖案;第一搬運機構,係具備第一基板保持部以及第一移動機構,前述第一移動機構係在前述圖案描繪部的下方水平移動前述第一基板保持部;第一標記描繪部,係對被保持於前述第一基板保持部之基板的下側的主表面照射光線,並描繪被賦予關連至前述第一搬運機構的第一對準標記;第二搬運機構,係具備第二基板保持部以及第二移動機構,前述第二移動機構係在前述圖案描繪部的下方水平移動前述第二基板保持部;以及第二標記描繪部,係對被保持於前述第二基板保持部之基板的下側的主表面照射光線,並描繪外觀與前述第一對準標記不同且被賦予關連至前述第二搬運機構的第二對準標記。A drawing system according to a preferred aspect of the present invention includes: a pattern drawing unit that irradiates light on the main surface of the upper side of the substrate that is horizontally moving downward to draw a pattern; and a first conveying mechanism that includes a first substrate holding unit and a first moving mechanism, wherein the first moving mechanism horizontally moves the first substrate holding portion below the pattern drawing portion; The main surface of the device is irradiated with light, and a first alignment mark assigned to the first conveying mechanism is drawn; the second conveying mechanism is provided with a second substrate holder and a second moving mechanism, and the second moving mechanism is connected to the The second substrate holding part is horizontally moved below the pattern drawing part; and the second mark drawing part irradiates light to the main surface of the lower side of the substrate held by the second substrate holding part, and draws the appearance and the first The alignment marks are different and assigned second alignment marks associated with the aforementioned second handling mechanism.

依據上述描繪系統,能提升被描繪至基板的兩側的主表面之圖案的相對性的位置精度。According to the above-described drawing system, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate can be improved.

較佳為,前述描繪系統係進一步具備:記憶部,係預先記憶第一位置關係資訊以及第二位置關係資訊,前述第一位置關係資訊係顯示藉由前述圖案描繪部描繪至被前述第一搬運機構搬運之基板的上側的主表面之圖案與藉由前述第一標記描繪部描繪至被前述第一搬運機構搬運之基板的下側的主表面之前述第一對準標記之間的相對性的位置關係,前述第二位置關係資訊係顯示藉由前述圖案描繪部描繪至被前述第二搬運機構搬運之基板的上側的主表面之圖案與藉由前述第二標記描繪部描繪至被前述第二搬運機構搬運之基板的下側的主表面之前述第二對準標記之間的相對性的位置關係;以及描繪控制部,係控制前述圖案描繪部。前述描繪控制部係在前述圖案描繪部對被描繪有前述第一對準標記的主表面進行圖案的描繪時,基於前述第一位置關係資訊調節描繪位置;前述描繪控制部係在前述圖案描繪部對被描繪有前述第二對準標記的主表面進行圖案的描繪時,基於前述第二位置關係資訊調節描繪位置。Preferably, the drawing system further includes: a memory unit that stores first positional relationship information and second positional relationship information in advance, and the first positional relationship information is displayed by the pattern drawing unit until it is drawn by the first conveyance. The relativity between the pattern on the main surface of the upper side of the substrate conveyed by the mechanism and the first alignment mark drawn by the first mark drawing portion to the main surface of the lower side of the substrate conveyed by the first conveying mechanism The positional relationship, and the second positional relationship information indicates that the pattern drawn by the pattern drawing unit to the main surface of the upper side of the substrate conveyed by the second conveyance mechanism and the pattern drawn by the second mark drawing unit to the second The relative positional relationship between the second alignment marks on the lower main surface of the substrate conveyed by the conveyance mechanism; and a drawing control unit that controls the pattern drawing unit. The drawing control unit adjusts the drawing position based on the first positional relationship information when the pattern drawing unit draws a pattern on the main surface on which the first alignment mark is drawn; the drawing control unit is connected to the pattern drawing unit When the pattern is drawn on the main surface on which the second alignment mark is drawn, the drawing position is adjusted based on the second positional relationship information.

較佳為,前述第一標記描繪部係具備:第一遮罩(mask)部,係使來自光源的光線的一部分通過;前述第二標記描繪部係具備:第二遮罩部,係具有與前述第一遮罩部不同的開口,用以使來自光源的光線的一部分通過。Preferably, the first mark drawing portion includes a first mask portion that allows a part of light from the light source to pass therethrough, and the second mark drawing portion includes a second mask portion that has a The different openings of the first shield portion are used to allow a part of the light from the light source to pass through.

較佳為,前述第一對準標記以及前述第二對準標記為非相似形狀。Preferably, the first alignment mark and the second alignment mark have non-similar shapes.

較佳為,前述第一對準標記為用以顯示與前述第一搬運機構相關的資訊之條碼(bar-code);前述第二對準標記為用以顯示與前述第二搬運機構相關的資訊之條碼。Preferably, the first alignment mark is a bar-code used to display information related to the first transport mechanism; the second alignment mark is used to display information related to the second transport mechanism the barcode.

較佳為,前述圖案描繪部係具備:描繪頭,係朝向下方照射光線;以及描繪頭移動機構,係使前述描繪頭在前述第一搬運機構的上方的第一描繪位置與前述第二搬運機構的上方的第二描繪位置之間移動。Preferably, the pattern drawing unit includes: a drawing head that irradiates light downward; and a drawing head moving mechanism that moves the drawing head to a first drawing position above the first conveying mechanism and the second conveying mechanism to move between the second drawing positions above.

參照隨附的圖式並藉由以下所進行的本發明的詳細的說明,更明瞭上述目的以及其他的目的、特徵、態樣以及優點。The above object and other objects, features, aspects, and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings.

圖1係顯示本發明的實施形態之一的描繪裝置1的立體圖。描繪裝置1為下述雙台型的直接描繪系統:將經過空間調變的略束(beam)狀的光線照射至基板9上的感光材料,在基板9上掃描光線的照射區域,藉此進行圖案的描繪。在圖1中以箭頭顯示彼此正交的三個方向作為X方向、Y方向以及Z方向。在圖1所示的例子中,X方向以及Y方向為彼此垂直的水平方向,Z方向為鉛直方向。在其他的圖式中亦同樣。此外,Z方向係可與重力方向一致,亦可與重力方向不一致。FIG. 1 is a perspective view showing a drawing apparatus 1 according to one embodiment of the present invention. The drawing apparatus 1 is a two-stage direct drawing system that irradiates spatially modulated beam-shaped light rays to the photosensitive material on the substrate 9, and scans the irradiated area of the light rays on the substrate 9, thereby performing Depiction of the pattern. In FIG. 1 , three directions orthogonal to each other are shown by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1 , the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is the vertical direction. The same applies to other drawings. In addition, the Z direction system may be consistent with the direction of gravity, or may not be consistent with the direction of gravity.

基板9係例如為俯視觀看時為略矩形狀的板狀構件。基板9係例如為印刷基板。在基板9的(+Z)側以及(-Z)側的主表面中,於銅層上設置有藉由感光材料所形成的阻劑(resist)膜。在描繪裝置1中,於基板9的該阻劑膜描繪(亦即形成)有電路圖案。在以下的說明中,亦將基板9的一方的主表面稱為「第一主表面91」,且將基板9的另一方的主表面稱為「第二主表面92」。此外,基板9的種類以及形狀等亦可變更成各種種類以及形狀等。The substrate 9 is, for example, a plate-like member having a substantially rectangular shape in plan view. The substrate 9 is, for example, a printed circuit board. On the main surfaces on the (+Z) side and the (−Z) side of the substrate 9 , a resist film formed of a photosensitive material is provided on the copper layer. In the drawing apparatus 1 , a circuit pattern is drawn (that is, formed) on the resist film of the substrate 9 . In the following description, one main surface of the substrate 9 is also referred to as a "first main surface 91", and the other main surface of the substrate 9 is referred to as a "second main surface 92". In addition, the type, shape, and the like of the substrate 9 may be changed to various types, shapes, and the like.

描繪裝置1係具備第一搬運機構2a、第二搬運機構2b、拍攝部3、圖案描繪部4、框架(frame)7以及控制部10。控制部10係控制第一搬運機構2a、第二搬運機構2b、拍攝部3以及圖案描繪部4。The drawing device 1 includes a first conveyance mechanism 2 a , a second conveyance mechanism 2 b , an imaging unit 3 , a pattern drawing unit 4 , a frame 7 , and a control unit 10 . The control unit 10 controls the first conveyance mechanism 2 a , the second conveyance mechanism 2 b , the imaging unit 3 , and the pattern drawing unit 4 .

框架7為安裝有描繪裝置1的各個構成之本體基座部。框架7係具備:略立方體狀的基台71;以及門形的第一高架(gantry)部72與第二高架部73,係跨越基台71。第二高架部73係接近地配置於第一高架部72的(+Y)側。在以下的說明中,亦將第一高架部72以及第二高架部73統稱為「高架部74」。於基台71上安裝有第一搬運機構2a以及第二搬運機構2b。第一高架部72係支撐拍攝部3。第二高架部73係支撐圖案描繪部4。框架7係載置於省略圖示的台坐上。The frame 7 is a main body base portion on which the respective components of the drawing apparatus 1 are attached. The frame 7 includes: a substantially cube-shaped base 71 ; The second elevated portion 73 is closely arranged on the (+Y) side of the first elevated portion 72 . In the following description, the first elevated portion 72 and the second elevated portion 73 are also collectively referred to as the “overhead portion 74 ”. The first conveyance mechanism 2a and the second conveyance mechanism 2b are attached to the base 71 . The first elevated portion 72 supports the imaging unit 3 . The second elevated portion 73 supports the pattern drawing portion 4 . The frame 7 is placed on a stand (not shown).

第一搬運機構2a以及第二搬運機構2b係分別為下述機構:在拍攝部3以及圖案描繪部4的下方(亦即(-Z)側)保持以及移動基板9。第二搬運機構2b係鄰接地配置於第一搬運機構2a的(+X)側。第一搬運機構2a與第二搬運機構2b係具有略相同的構造。在圖1所示的例子中,藉由第一搬運機構2a以及第二搬運機構2b在將第一主表面91朝向上側(亦即(+Z)側)的狀態下保持基板9。The first conveyance mechanism 2a and the second conveyance mechanism 2b are mechanisms for holding and moving the substrate 9 below the imaging unit 3 and the pattern drawing unit 4 (that is, on the (-Z) side), respectively. The 2nd conveyance mechanism 2b is arrange|positioned adjacent to the (+X) side of the 1st conveyance mechanism 2a. The first conveyance mechanism 2a and the second conveyance mechanism 2b have substantially the same structure. In the example shown in FIG. 1, the board|substrate 9 is hold|maintained by the 1st conveyance mechanism 2a and the 2nd conveyance mechanism 2b with the 1st main surface 91 facing the upper side (that is, (+Z) side).

第一搬運機構2a係具備第一台21a以及第一移動機構22a。第一台21a為略平板狀的第一基板保持部,用以從下側保持略水平狀態的基板9。第一台21a係例如為真空夾具(vacuum chuck),用以吸附並保持基板9的下表面。第一台21a亦可具有真空夾具以外的構造。載置於第一台21a上的基板9的上側的主表面(亦即第一主表面91)係與Z方向(亦即上下方向)略垂直,且與X方向以及Y方向略平行。The first conveyance mechanism 2a includes a first stage 21a and a first moving mechanism 22a. The first stage 21a is a substantially flat-shaped first board holding portion for holding the board 9 in a substantially horizontal state from below. The first stage 21 a is, for example, a vacuum chuck, and is used for sucking and holding the lower surface of the substrate 9 . The first stage 21a may have a structure other than a vacuum jig. The upper main surface (ie, the first main surface 91 ) of the substrate 9 placed on the first stage 21 a is slightly perpendicular to the Z direction (ie, the up-down direction), and is slightly parallel to the X and Y directions.

第一移動機構22a為第一台移動機構,用以將第一台21a相對於拍攝部3以及圖案描繪部4於略水平方向(亦即與基板9的上側的主表面略平行的方向)相對性地移動。第一移動機構22a係在拍攝部3以及圖案描繪部4的下方將被支撐在導軌(guide rail)221a上的第一台21a沿著導軌221a於Y方向直線移動。藉此,被保持於第一台21a的基板9係於Y方向移動。在以下的說明中,亦將Y方向稱為「基板移動方向」。第一移動機構22a的驅動源係例如為線性伺服馬達(linear servo motor)或者於滾珠螺桿(ball screw)安裝有馬達的驅動源。第一移動機構22a的構造亦可變更成各種構造。The first moving mechanism 22a is a first table moving mechanism, and is used to face the first table 21a in a slightly horizontal direction (that is, a direction slightly parallel to the main surface of the upper side of the substrate 9) with respect to the imaging unit 3 and the pattern drawing unit 4 move sexually. The 1st moving mechanism 22a linearly moves the 1st stage 21a supported by the guide rail 221a below the imaging part 3 and the pattern drawing part 4 in the Y direction along the guide rail 221a. Thereby, the substrate 9 held by the first stage 21a is moved in the Y direction. In the following description, the Y direction is also referred to as the "substrate moving direction". The drive source of the first moving mechanism 22a is, for example, a linear servo motor or a drive source in which a motor is attached to a ball screw. The structure of the 1st moving mechanism 22a can also be changed into various structures.

第二搬運機構2b係具備第二台21b以及第二移動機構22b。第二台21b為略平板狀的第二基板保持部,用以從下側保持略水平狀態的基板9。第二台21b係鄰接地配置於第一台21a的側方(亦即(+X側))。第二台21b的上表面係在上下方向(亦即Z方向)中位於與第一台21a的上表面相同的高度。第二台21b係例如為真空夾具,用以吸附並保持基板9的下表面。第二台21b亦可具有真空夾具以外的構造。被載置於第二台21b上的基板9的上側的主表面(亦即第一主表面91)係與Z方向略垂直,且與X方向以及Y方向略平行。被保持於第二台21b之基板9的上側的主表面係位於與被保持於第一台21a之基板9的上側的主表面在上下方向中的略相同的高度(亦即Z方向中的略相同的位置)。The second conveyance mechanism 2b includes a second table 21b and a second moving mechanism 22b. The second stage 21b is a substantially flat second board holding portion for holding the board 9 in a substantially horizontal state from below. The second table 21b is arranged adjacent to the side (that is, (+X side)) of the first table 21a. The upper surface of the second stage 21b is located at the same height as the upper surface of the first stage 21a in the up-down direction (ie, the Z direction). The second stage 21 b is, for example, a vacuum jig for sucking and holding the lower surface of the substrate 9 . The second stage 21b may have a structure other than the vacuum jig. The main surface on the upper side of the substrate 9 placed on the second stage 21b (ie, the first main surface 91 ) is substantially perpendicular to the Z direction, and is substantially parallel to the X and Y directions. The main surface on the upper side of the substrate 9 held on the second stage 21b is located at approximately the same height in the vertical direction (that is, a little in the Z direction) as the main surface on the upper side of the substrate 9 held on the first table 21a. same location).

第二移動機構22b為第二台移動機構,用以將第二台21b相對於拍攝部3以及圖案描繪部4於略水平方向(亦即與基板9的上側的主表面略平行的方向)相對性地移動。第二移動機構22b係在拍攝部3以及圖案描繪部4的下方將被支撐在導軌221b上的第二台21b沿著導軌221b於Y方向(亦即基板移動方向)直線移動。藉此,被保持於第二台21b的基板9係於Y方向移動。第二移動機構22b所為之第二台21b的移動方向為與第一移動機構22a所為之第一台21a的移動方向略平行。第二移動機構22b的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達的驅動源。第二移動機構22b的構造亦可變更成各種構造。The second moving mechanism 22b is a second table moving mechanism for facing the second table 21b with respect to the imaging unit 3 and the pattern drawing unit 4 in a substantially horizontal direction (that is, a direction substantially parallel to the main surface of the upper side of the substrate 9). move sexually. The second moving mechanism 22b linearly moves the second stage 21b supported on the guide rail 221b in the Y direction (ie, the substrate moving direction) below the imaging unit 3 and the pattern drawing unit 4 along the guide rail 221b. Thereby, the board|substrate 9 hold|maintained by the 2nd stage 21b moves to a Y direction. The moving direction of the second table 21b by the second moving mechanism 22b is slightly parallel to the moving direction of the first table 21a by the first moving mechanism 22a. The drive source of the second moving mechanism 22b is, for example, a linear servo motor or a drive source in which a motor is attached to a ball screw. The structure of the 2nd moving mechanism 22b can also be changed into various structures.

第一移動機構22a與第二移動機構22b係排列地配置於與基板移動方向(亦即Y方向)交叉的方向。在圖1所示的例子中,第一移動機構22a與第二移動機構22b係排列地配置於X方向,第二移動機構22b係鄰接於第一移動機構22a的(+X)側的側方。第一移動機構22a與第二移動機構22b係位於上下方向的略相同的高度。The first moving mechanism 22a and the second moving mechanism 22b are arranged in a row in a direction intersecting with the substrate moving direction (that is, the Y direction). In the example shown in FIG. 1 , the first moving mechanism 22a and the second moving mechanism 22b are arranged side by side in the X direction, and the second moving mechanism 22b is adjacent to the (+X) side of the first moving mechanism 22a. . The first moving mechanism 22a and the second moving mechanism 22b are located at approximately the same height in the vertical direction.

第一移動機構22a以及第二移動機構22b係被框架7的基台71從下方支撐。第一移動機構22a以及第二移動機構22b係從比第二高架部73還靠近(+Y)側朝(-Y)側方向延伸,並通過被第二高架部73支撐的圖案描繪部4的下方以及被第一高架部72支撐的拍攝部3的下方從第一高架部72朝(-)Y側突出。第一高架部72係在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。換言之,高架部74係從第一移動機構22a以及第二移動機構22b的Y方向中的中央部的上方朝(+Y)方向延伸。The first moving mechanism 22a and the second moving mechanism 22b are supported from below by the base 71 of the frame 7 . The first moving mechanism 22 a and the second moving mechanism 22 b extend from the (+Y) side toward the (−Y) side from the second elevated portion 73 , and pass through the pattern drawing portion 4 supported by the second elevated portion 73 . The lower part and the lower part of the imaging unit 3 supported by the first elevated part 72 protrude toward the (-)Y side from the first elevated part 72 . The first elevated portion 72 is located in the Y direction at approximately the same position as the central portion of the first movement mechanism 22a and the second movement mechanism 22b in the Y direction. In other words, the elevated portion 74 extends in the (+Y) direction from above the central portion in the Y direction of the first moving mechanism 22a and the second moving mechanism 22b.

在描繪裝置1中,在第一台21a位於比第一高架部72還靠近(-Y)側的狀態下,對第一台21a進行基板9的搬入以及搬出。此外,在第二台21b位於比第一高架部72還靠近(-Y)側的狀態下,對第二台21b進行基板9的搬入以及搬出。In the drawing apparatus 1, the board|substrate 9 is carried in and carried out to the 1st stage 21a in the state which located the 1st stage 21a on the (-Y) side rather than the 1st elevated part 72. As shown in FIG. In addition, the board|substrate 9 is carried in and carried out to the 2nd stage 21b in the state which located the 2nd stage 21b in the (-Y) side rather than the 1st elevated part 72.

如上所述,第一高架部72以及第二高架部73係跨越第一搬運機構2a以及第二搬運機構2b而設置。第一高架部72係具備:兩根支柱部,係在第一搬運機構2a以及第二搬運機構2b的X方向的兩側處朝Z方向延伸;以及梁部,係連接兩根支柱部的上端部。該梁部係在第一搬運機構2a以及第二搬運機構2b的上方處朝X方向延伸。第一高架部72的兩根支柱部係在(-Z)側的端部處與基台71連接。第二高架部73係具備:兩根支柱部,係在第一搬運機構2a以及第二搬運機構2b的X方向的兩側處朝Z方向延伸;以及梁部,係連接兩根支柱部的上端部。該梁部係在第一搬運機構2a以及第二搬運機構2b的上方處朝X方向延伸。第二高架部73的兩根支柱部係在(-Z)側的端部處與基台71連接。As described above, the first elevated portion 72 and the second elevated portion 73 are provided over the first conveyance mechanism 2a and the second conveyance mechanism 2b. The first elevated portion 72 includes two strut portions extending in the Z direction on both sides of the first conveyance mechanism 2a and the second conveyance mechanism 2b in the X direction, and a beam portion connecting upper ends of the two strut portions. department. The beam portion extends in the X direction above the first conveyance mechanism 2a and the second conveyance mechanism 2b. The two strut portions of the first elevated portion 72 are connected to the base 71 at the ends on the (-Z) side. The second elevated portion 73 includes: two strut portions extending in the Z direction at both sides in the X direction of the first conveyance mechanism 2a and the second conveyance mechanism 2b; and a beam portion connecting the upper ends of the two strut portions department. The beam portion extends in the X direction above the first conveyance mechanism 2a and the second conveyance mechanism 2b. The two strut portions of the second elevated portion 73 are connected to the base 71 at the ends on the (-Z) side.

拍攝部3係具備拍攝頭移動機構32以及複數個(在圖1所示的例子中為兩個)拍攝頭31。複數個拍攝頭31係排列於X方向,且能夠移動地安裝於第一高架部72的梁部。拍攝頭移動機構32係安裝於梁部,並將複數個拍攝頭31沿著梁部於X方向移動。拍攝頭移動機構32的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達的驅動源。在圖1所示的例子中,兩個拍攝頭31的X方向中的間隔係能夠變更。此外,在拍攝部3中,拍攝頭31的數量亦可為一個,或亦可為三個以上。The imaging unit 3 includes an imaging head moving mechanism 32 and a plurality of (two in the example shown in FIG. 1 ) imaging heads 31 . The plurality of imaging heads 31 are arranged in the X direction and are movably attached to the beam portion of the first elevated portion 72 . The imaging head moving mechanism 32 is attached to the beam portion, and moves the plurality of imaging heads 31 in the X direction along the beam portion. The drive source of the imaging head moving mechanism 32 is, for example, a linear servo motor or a drive source in which a motor is attached to a ball screw. In the example shown in FIG. 1, the interval system in the X direction of the two imaging heads 31 can be changed. In addition, in the imaging unit 3, the number of the imaging heads 31 may be one, or three or more.

各個拍攝頭31為攝影機(camera),係具備省略圖示的拍攝感測器以及光學系統。各個拍攝頭31係例如為區域攝影機(area camera),係取得例如二維的影像。拍攝感測器係例如具備矩陣(matrix)狀排列的複數個CCD(Charge Coupled Device;電荷耦合元件)等元件。在各個拍攝頭31中,從省略圖示的光源朝基板9的上側的主表面被導引的照明光的反射光係經由光學系統朝拍攝感測器被導引。拍攝感測器係接收來自基板9的上側的主表面的反射光,並取得略矩形狀的拍攝區域的影像。作為上述光源,能夠利用LED(Light Emitting Diode;發光二極體)等各種光源。此外,各個拍攝頭31亦可為線列式攝影機(line camera)等其他種類的攝影機。Each imaging head 31 is a camera, and includes an imaging sensor and an optical system not shown in the drawings. Each imaging head 31 is, for example, an area camera, and acquires, for example, two-dimensional images. The imaging sensor includes, for example, a plurality of CCDs (Charge Coupled Device; Charge Coupled Device) arranged in a matrix. In each imaging head 31 , the reflected light of the illumination light guided from the light source (not shown) to the main surface on the upper side of the substrate 9 is guided to the imaging sensor via the optical system. The imaging sensor receives reflected light from the main surface on the upper side of the substrate 9, and acquires an image of a substantially rectangular imaging area. As the above-mentioned light source, various light sources such as LED (Light Emitting Diode) can be used. In addition, each of the photographing heads 31 may also be other types of cameras, such as a line camera.

在描繪裝置1中, 藉由拍攝頭移動機構32,複數個拍攝頭31係在第一搬運機構2a的上方的第一拍攝位置與第二搬運機構2b的上方的第二拍攝位置之間移動。在圖1中,複數個拍攝頭31係位於第一拍攝位置。複數個拍攝頭31係在第一拍攝位置中拍攝第一台21a上的基板9的上側的主表面。此外,複數個拍攝頭31係在第二拍攝位置中拍攝第二台21b上的基板9的上側的主表面。In the drawing apparatus 1, by the imaging head moving mechanism 32, the plurality of imaging heads 31 are moved between a first imaging position above the first conveyance mechanism 2a and a second imaging position above the second conveyance mechanism 2b. In FIG. 1 , the plurality of photographing heads 31 are located at the first photographing position. The plurality of imaging heads 31 are in the first imaging position to image the main surface of the upper side of the substrate 9 on the first stage 21a. In addition, the plurality of imaging heads 31 are in the second imaging position imaging the main surface of the upper side of the substrate 9 on the second stage 21b.

圖案描繪部4係具備描繪頭移動機構42以及複數個(在圖1所示的例子中為六個)描繪頭41。複數個描繪頭41係排列於X方向,並能夠移動地安裝於第二高架部73的梁部。描繪頭移動機構42係安裝於梁部,並將複數個拍攝頭41沿著梁部於X方向一體性地移動。拍攝頭移動機構42的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達的驅動源。此外,在圖案描繪部4中,拍攝頭41的數量亦可為一個,或亦可為複數個。The pattern drawing unit 4 includes a drawing head moving mechanism 42 and a plurality of (six in the example shown in FIG. 1 ) drawing heads 41 . The plurality of drawing heads 41 are arranged in the X direction and are movably attached to the beam portion of the second elevated portion 73 . The drawing head moving mechanism 42 is attached to the beam portion, and integrally moves the plurality of imaging heads 41 in the X direction along the beam portion. The drive source of the imaging head moving mechanism 42 is, for example, a linear servo motor or a drive source in which a motor is attached to a ball screw. In addition, in the pattern drawing part 4, the number of the imaging heads 41 may be one, or may be plural.

各個描繪頭41係具備省略圖示的光源、光學系統以及空間光線調變元件。作為空間光線調變元件係能夠利用DMD(Digital Micro Mirror Device;數位微鏡元件)或者GLV(Grating Light Valve;柵光閥)( Silicon Light Machines公司(森尼韋爾(Sunnyvale)、加利福尼亞(California))的註冊商標)等各種元件。作為光源,能夠利用LD(Laser Diode;雷射二極體)等各種光源。複數個描繪頭41係具有略相同的構造。Each of the drawing heads 41 includes a light source, an optical system, and a spatial light modulation element (not shown). As the spatial light modulation element, DMD (Digital Micro Mirror Device) or GLV (Grating Light Valve) can be used (Silicon Light Machines (Sunnyvale, California) ) registered trademark) and other components. As the light source, various light sources such as LD (Laser Diode) can be used. The plurality of drawing heads 41 have substantially the same structure.

在描繪裝置1中,藉由描繪頭移動機構42,複數個描繪頭41係在第一搬運機構2a的上方的第一描繪位置與第二搬運機構2b的上方的第二描繪位置之間移動。在圖1中,複數個描繪頭41係位於第二描繪位置。複數個描繪頭41係在第一描繪位置中對第一台21a上的基板9的上側的主表面描繪圖案。此外,複數個描繪頭41係在第二描繪位置中對第二台21b上的基板9的上側的主表面描繪圖案。In the drawing apparatus 1, the drawing head moving mechanism 42 moves a plurality of drawing heads 41 between a first drawing position above the first conveyance mechanism 2a and a second drawing position above the second conveyance mechanism 2b. In FIG. 1, the plurality of drawing heads 41 are located at the second drawing position. The plurality of drawing heads 41 draw patterns on the main surface of the upper side of the substrate 9 on the first stage 21a in the first drawing position. In addition, the plurality of drawing heads 41 draw patterns on the main surface of the upper side of the substrate 9 on the second stage 21b in the second drawing position.

第一描繪位置以及第二描繪位置係在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。此外,上述第一拍攝位置以及第二拍攝位置亦在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。換言之,圖案描繪部4的複數個描繪頭41以及拍攝部3的複數個拍攝頭31係在Y方向中位於與第一移動機構22a以及第二移動機構22b的Y方向中的中央部略相同的位置。The first drawing position and the second drawing position are located at approximately the same positions in the Y direction as the central portions of the first movement mechanism 22a and the second movement mechanism 22b in the Y direction. Moreover, the said 1st imaging position and the 2nd imaging position are also located in the Y direction at the substantially same position as the center part in the Y direction of the 1st moving mechanism 22a and the 2nd moving mechanism 22b. In other words, the plurality of drawing heads 41 of the pattern drawing unit 4 and the plurality of imaging heads 31 of the imaging unit 3 are located in the Y direction at approximately the same central portion in the Y direction of the first moving mechanism 22a and the second moving mechanism 22b. Location.

在第一描繪位置中描繪圖案時,從圖案描繪部4的複數個描繪頭41朝向下方的第一台21a上的基板9照射經過調變(亦即空間調變)的光線。而且,與該光線的照射並行地,藉由第一移動機構22a將基板9於Y方向(亦即基板移動方向)水平移動。藉此,來自複數個描繪頭41的光線的照射區域在基板9上於Y方向掃描,對基板9進行圖案(例如電路圖案)的描繪。第一移動機構22a為掃描機構,係將來自各個掃描頭41的光線的照射區域在基板9上於Y方向移動。When a pattern is drawn in the first drawing position, modulated (ie, spatially modulated) light is irradiated from the plurality of drawing heads 41 of the pattern drawing unit 4 toward the substrate 9 on the first stage 21 a below. Then, in parallel with the irradiation of the light, the substrate 9 is horizontally moved in the Y direction (ie, the substrate moving direction) by the first moving mechanism 22a. Thereby, the irradiation area of the light rays from the plurality of drawing heads 41 is scanned in the Y direction on the substrate 9 , and a pattern (for example, a circuit pattern) is drawn on the substrate 9 . The first moving mechanism 22 a is a scanning mechanism, and moves the irradiation area of the light beam from each scanning head 41 on the substrate 9 in the Y direction.

在圖1所示的例子中,對於基板9的描繪係以單程(single pass)(單向(one pass))方式進行。具體而言,藉由第一移動機構22a,第一台21a係相對於複數個描繪頭41於Y方向相對移動,來自複數個描繪頭41的光線的照射區域在基板9的上側的主表面上於Y方向僅掃描一次。藉此,結束對於基板9的掃瞄。此外,在描繪裝置1中,亦可藉由反復地進行第一台21a朝向Y方向的移動以及第一台21a朝向X方向的步階移動(step shift)之多程(multi pass)方式對基板9進行描繪。第二描繪位置中的圖案的描繪係排除第一台21a以及第一移動機構22a被變更成第二台21b以及第二移動機構22b之點除外,與上述第一描繪位置中的圖案的描繪同樣。In the example shown in FIG. 1, the drawing with respect to the substrate 9 is performed in a single pass (one pass). Specifically, the first stage 21a is relatively moved in the Y direction with respect to the plurality of drawing heads 41 by the first moving mechanism 22a, and the irradiation area of the light rays from the plurality of drawing heads 41 is on the upper main surface of the substrate 9 Scan only once in the Y direction. Thereby, scanning of the substrate 9 is completed. In addition, in the drawing apparatus 1, a multi-pass method of repeatedly performing the movement of the first stage 21a in the Y direction and the step shift of the first stage 21a in the X direction may be used for the substrates. 9 to draw. The drawing of the pattern in the second drawing position is the same as the drawing of the pattern in the first drawing position, except that the first table 21a and the first moving mechanism 22a are changed to the second table 21b and the second moving mechanism 22b. .

圖2係將第一台21a以及第二台21b的(-Y)側的端部放大地顯示之俯視圖。在圖2中,以二點鏈線描繪第一台21a以及第二台21b上的基板9。如圖2所示,描繪裝置1係進一步具備第一標記描繪部51以及第二標記描繪部52。第一標記描繪部51係配置於第一台21a的內部(亦即第一台21a的上表面與下表面之間)。第一標記描繪部51係對以覆蓋第一標記描繪部51的上方之方式被保持於第一台21a之基板9的下側的主表面照射光線,並描繪被賦予關連至第一搬運機構2a的第一對準標記。FIG. 2 is an enlarged plan view showing the ends on the (-Y) side of the first stage 21a and the second stage 21b. In FIG. 2, the board|substrate 9 on the 1st stage 21a and the 2nd stage 21b is drawn by the two-dot chain line. As shown in FIG. 2 , the drawing device 1 further includes a first marker drawing unit 51 and a second marker drawing unit 52 . The 1st mark drawing part 51 is arrange|positioned inside the 1st stage 21a (namely, between the upper surface and the lower surface of the 1st stage 21a). The first mark drawing unit 51 irradiates light to the main surface on the lower side of the substrate 9 held on the first stage 21 a so as to cover the upper side of the first mark drawing unit 51 , and draws the light to be associated with the first conveyance mechanism 2 a of the first alignment mark.

第一標記描繪部51係具備複數個第一標誌511。複數個第一標誌511係在第一台21a的(-Y)側的端緣附近中排列於X方向。在圖2所示的例子中,藉由複數個第一標誌511中的最靠近(-X)側的第一標誌511以及最靠近(+X)側的第一標誌511,在基板9的下側的主表面中,於(-X)側與(-Y)側的角部以及(+X)側與(-Y)側的角部描繪有第一對準標記。此外,針對X方向的大小比圖2所示的例子還小的基板9,藉由最靠近(-X)側的第一標誌511以及位於該基板9的(+X)側與(-Y)側的角部的下方的第一標誌511,對基板9的下側的主表面描繪有兩個第一對準標記。The first marker drawing unit 51 includes a plurality of first markers 511 . The plurality of first marks 511 are arranged in the X direction in the vicinity of the end edge on the (-Y) side of the first stage 21a. In the example shown in FIG. 2 , by the first mark 511 closest to the (-X) side and the first mark 511 closest to the (+X) side among the plurality of first marks 511, under the substrate 9 On the main surface of the side, the first alignment marks are drawn on the corners of the (-X) side and the (-Y) side and the corners of the (+X) side and the (-Y) side. In addition, for the substrate 9 whose size in the X direction is smaller than that in the example shown in FIG. The first marks 511 below the corners of the sides have two first alignment marks drawn on the main surface of the lower side of the substrate 9 .

圖3係顯示一個第一標誌511以及第一標誌511附近之縱剖視圖。上述複數個第一標誌511係具有略相同的構造。第一標誌511係被收容於設置在第一台21a的上表面之略圓柱狀的凹部211a。凹部211a的上端開口亦可被具有透光性之略平板狀的蓋(cover)構件封閉。FIG. 3 is a longitudinal cross-sectional view showing a first marker 511 and the vicinity of the first marker 511 . The above-mentioned plural first marks 511 have substantially the same structure. The first marker 511 is accommodated in a substantially cylindrical recessed portion 211a provided on the upper surface of the first table 21a. The upper end opening of the concave portion 211a may be closed by a substantially flat cover member having translucency.

如圖3所示,第一標誌511係具備第一光源512、第一光學系統513以及第一光圈(aperture)514。第一光源512係配置於凹部211a的底部並朝(+Z)方向射出光線。作為第一光源512,例如使用用以射出紫外光之LED等。第一光學系統513係配置於第一光源512的(+Z)側,並將來自第一光源512的光線朝基板9的下側的主表面導引。第一光學系統513係具備排列於Z方向的複數個透鏡(lends)(未圖示)。第一光圈514係配置於第一光學系統513的複數個透鏡之間,且為用以僅使來自第一光源512的光線的一部分通過之第一遮罩部。第一光圈514為略平板狀的構件,且設置有與上述第一對準標記對應的開口。第一光圈514係藉由例如不鏽鋼等金屬所形成。As shown in FIG. 3 , the first marker 511 includes a first light source 512 , a first optical system 513 , and a first aperture 514 . The first light source 512 is disposed at the bottom of the concave portion 211a and emits light in the (+Z) direction. As the first light source 512, for example, an LED or the like for emitting ultraviolet light is used. The first optical system 513 is disposed on the (+Z) side of the first light source 512 , and guides the light from the first light source 512 toward the main surface of the lower side of the substrate 9 . The first optical system 513 includes a plurality of lenses (not shown) arranged in the Z direction. The first aperture 514 is disposed between the plurality of lenses of the first optical system 513 , and is a first shield portion for allowing only a part of the light from the first light source 512 to pass therethrough. The first aperture 514 is a substantially flat member, and is provided with an opening corresponding to the above-mentioned first alignment mark. The first aperture 514 is formed of metal such as stainless steel.

圖2所示的第二標記描繪部52係配置於第二台21b的內部(亦即第二台21b的上表面與下表面之間)。第二標記描繪部52係對以覆蓋第二標記描繪部52的上方之方式被保持於第二台21b之基板9的下側的主表面照射光線,並描繪被賦予關連至第二搬運機構2b的第二對準標記。如後述般,第二對準標記的外觀係與第一對準標記的外觀不同。The 2nd mark drawing part 52 shown in FIG. 2 is arrange|positioned inside the 2nd stage 21b (namely, between the upper surface and the lower surface of the 2nd stage 21b). The second mark drawing unit 52 irradiates light to the main surface of the lower side of the substrate 9 held on the second table 21b so as to cover the upper side of the second mark drawing unit 52, and the drawing is assigned to the second conveyance mechanism 2b. of the second alignment mark. As will be described later, the appearance of the second alignment mark is different from that of the first alignment mark.

與第一標記描繪部51同樣地,第二標記描繪部52係具備複數個第二標誌521。複數個第二標誌521係在第二台21b的(-Y)側的端緣附近中排列於X方向。在圖2所示的例子中,藉由複數個第二標誌521中的最靠近(-X)側的第二標誌521以及最靠近(+X)側的第二標誌521,在基板9的下側的主表面中,於(-X)側與(-Y)側的角部以及(+X)側與(-Y)側的角部描繪有第二對準標記。此外,針對X方向的大小比圖2所示的例子還小的基板9,藉由最靠近(-X)側的第二標誌521以及位於該基板9的(+X)側與(-Y)側的角部的下方的第二標誌521,對基板9的下側的主表面描繪有兩個第二對準標記。Like the first marker drawing unit 51 , the second marker drawing unit 52 includes a plurality of second markers 521 . The plurality of second markers 521 are arranged in the X direction in the vicinity of the end edge on the (-Y) side of the second stage 21b. In the example shown in FIG. 2 , by the second mark 521 closest to the (-X) side and the second mark 521 closest to the (+X) side among the plurality of second marks 521, under the substrate 9 On the main surface of the side, second alignment marks are drawn on the corners of the (-X) side and the (-Y) side and the corners of the (+X) side and the (-Y) side. In addition, for the substrate 9 whose size in the X direction is smaller than that of the example shown in FIG. The second marks 521 below the corners of the sides have two second alignment marks drawn on the main surface of the lower side of the substrate 9 .

圖4係顯示一個第二標誌521以及第二標誌521附近之縱剖視圖。上述複數個第二標誌521係具有略相同的構造。第二標誌521係被收容於設置在第二台21b的上表面之略圓柱狀的凹部211b。凹部211b的上端開口亦可被具有透光性之略平板狀的蓋構件封閉。FIG. 4 is a longitudinal cross-sectional view showing a second marker 521 and the vicinity of the second marker 521 . The above-mentioned plurality of second marks 521 have substantially the same structure. The second marker 521 is accommodated in a substantially cylindrical recess 211b provided on the upper surface of the second table 21b. The upper end opening of the concave portion 211b may be closed by a substantially flat cover member having translucency.

如圖4所示,第二標誌521係具備與第一標誌511略相同的構造。第二標誌521係具備第二光源522、第二光學系統523以及第二光圈524。第二光源522係配置於凹部211b的底部並朝(+Z)方向射出光線。作為第二光源522,例如使用用以射出紫外光之LED等。第二光學系統523係配置於第二光源522的(+Z)側,並將來自第二光源522的光線朝基板9的下側的主表面導引。第二光學系統523係具備排列於Z方向的複數個透鏡(未圖示)。第二光圈524係配置於第二光學系統523的複數個透鏡之間,且為用以僅使來自第二光源522的光線的一部分通過之第二遮罩部。第二光圈524為略平板狀的構件,且設置有與上述第二對準標記對應的開口。第二光圈524係藉由例如不鏽鋼等金屬所形成。如上所述,第二對準標記的外觀係與第一對準標記的外觀不同。因此,第二光圈524係具有與第一光圈514不同的開口。換言之,第二光圈524與第一光圈514係在開口的數量、形狀、大小、配置以及方向中的至少一個以上不同。As shown in FIG. 4 , the second marker 521 has substantially the same structure as the first marker 511 . The second marker 521 includes a second light source 522 , a second optical system 523 and a second aperture 524 . The second light source 522 is disposed at the bottom of the concave portion 211b and emits light in the (+Z) direction. As the second light source 522, for example, an LED or the like for emitting ultraviolet light is used. The second optical system 523 is disposed on the (+Z) side of the second light source 522 , and guides the light from the second light source 522 toward the main surface of the lower side of the substrate 9 . The second optical system 523 includes a plurality of lenses (not shown) arranged in the Z direction. The second aperture 524 is disposed between the plurality of lenses of the second optical system 523 , and is a second shield portion for allowing only a part of the light from the second light source 522 to pass therethrough. The second aperture 524 is a substantially plate-shaped member, and is provided with an opening corresponding to the above-described second alignment mark. The second aperture 524 is formed of metal such as stainless steel. As mentioned above, the appearance of the second alignment mark is different from the appearance of the first alignment mark. Therefore, the second aperture 524 has a different opening than the first aperture 514 . In other words, the second aperture 524 is different from the first aperture 514 in at least one or more of the number, shape, size, arrangement, and direction of the openings.

圖5係顯示藉由第一標誌511於基板9的下側的主表面描繪有第一對準標記93之仰視圖。圖6係顯示藉由第二標誌521於基板9的下側的主表面描繪有第二對準標記94之仰視圖。如上述般,第一對準標記93的外觀與第二對準標記94的外觀不同。FIG. 5 is a bottom view showing the first alignment mark 93 depicted on the main surface of the lower side of the substrate 9 by the first mark 511 . FIG. 6 is a bottom view showing that the second alignment mark 94 is depicted on the main surface of the lower side of the substrate 9 by the second mark 521 . As described above, the appearance of the first alignment mark 93 is different from that of the second alignment mark 94 .

在圖5所示的例子中,第一對準標記93係具備四個第一標記要素931,四個第一標記要素931為相同大小的圓形。四個第一標記要素931係位於假想的正方形的四個頂點。換言之,四個第一標記要素931係格子狀地配置於X方向以及Y方向。進一步換言之,在第一對準標記93中,於排列於X方向的兩個第一標記要素931的(+Y)側配置有其他兩個第一標記要素931,該其他兩個第一標記要素931係位於與該兩個第一標記要素931在X方向的略相同的位置。鄰接於X方向的各兩個第一標記要素931之間的距離與鄰接於Y方向的各兩個第一標記要素931之間的距離為略相同。In the example shown in FIG. 5 , the first alignment mark 93 includes four first mark elements 931 , and the four first mark elements 931 are circular shapes of the same size. The four first marker elements 931 are located at the four vertices of an imaginary square. In other words, the four first marker elements 931 are arranged in the X direction and the Y direction in a lattice shape. In other words, in the first alignment mark 93, the other two first mark elements 931 are arranged on the (+Y) side of the two first mark elements 931 arranged in the X direction, and the other two first mark elements 931 is located at approximately the same position in the X direction as the two first marker elements 931 . The distance between each two first marker elements 931 adjacent to the X direction is substantially the same as the distance between each two first marker elements 931 adjacent to the Y direction.

在圖6的例子中,第二對準標記94係具有四個第二標記要素941,四個第二標記要素941為相同大小的圓形。各個第二標記要素941的形狀以及大小係與上述第一標記要素931相同。第二對準標記94係具有下述外觀:以朝向Z方向之旋轉軸作為中心,使第一對準標記93旋轉約45°。具體而言,在第二對準標記94中,於最靠近(-X)側配置有一個第二標記要素941,並於最靠近(+X)側配置有另一個第二標記要素941。該兩個第二標記要素941係配置於Y方向的略相同的位置。此外,於該兩個第二標記要素941的X方向之間,於Y方向排列地配置有另外兩個第二標記要素941。該另外兩個第二標記要素941係分別配置於比最靠近(+X)側以及最靠近(-X)側的兩個第二標記要素941還靠近(+Y)側以及(-Y)側。In the example of FIG. 6 , the second alignment mark 94 has four second mark elements 941, and the four second mark elements 941 are circular shapes of the same size. The shape and size of each second marker element 941 are the same as those of the first marker element 931 described above. The second alignment mark 94 has the following appearance: the first alignment mark 93 is rotated about 45° with the rotation axis facing the Z direction as the center. Specifically, in the second alignment mark 94, one second marker element 941 is arranged on the closest (-X) side, and another second marker element 941 is arranged on the closest (+X) side. The two second marker elements 941 are arranged at substantially the same position in the Y direction. Further, between the two second marker elements 941 in the X direction, two other second marker elements 941 are arranged in the Y direction. The other two second marker elements 941 are arranged on the (+Y) side and the (-Y) side, respectively, than the two second marker elements 941 closest to the (+X) side and the two second marker elements 941 closest to the (-X) side, respectively. .

如上所述,第一對準標記93與第二對準標記94係僅有基板9上的方向不同,形狀以及大小則相同。因此,作為第二標誌521的第二光圈524(參照圖4),能僅變更安裝的方向來利用與第一標誌511的第一光圈514(參照圖3)相同形狀的構件(亦即開口的數量、形狀、大小以及配置相同的構件)。因此,能簡化描繪裝置1的製造,並能降低描繪裝置1的製造成本。As described above, the first alignment mark 93 and the second alignment mark 94 are only different in the direction on the substrate 9, and have the same shape and size. Therefore, as the second aperture 524 (see FIG. 4 ) of the second marker 521 , a member having the same shape as the first aperture 514 (refer to FIG. 3 ) of the first marker 511 can be used only by changing the mounting direction (that is, the opening number, shape, size and configuration of the same components). Therefore, the manufacture of the drawing apparatus 1 can be simplified, and the manufacturing cost of the drawing apparatus 1 can be reduced.

此外,第一標記要素931的形狀並未限定於圓形,亦可變更成三角形、矩形、五角形以上的多角形、橢圓形或者十字形等各種形狀。第一標記要素931的配置並未限定於格子狀,亦可變更成各種形狀。第一標記要素931的數量亦能夠變更成各種數量,係可為一個亦可為兩個以上。第二標記要素941亦與第一標記要素931相同。In addition, the shape of the first marker element 931 is not limited to a circle, and may be changed to various shapes such as a triangle, a rectangle, a polygon other than a pentagon, an ellipse, or a cross. The arrangement of the first marker elements 931 is not limited to the lattice shape, and may be changed to various shapes. The number of the first marker elements 931 can also be changed to various numbers, and it may be one or two or more. The second marker element 941 is also the same as the first marker element 931 .

此外,第一標記要素931的形狀、配置以及數量係可分別與第二標記要素941的形狀、配置以及數量相同亦可不同。例如亦可為:第一對準標記93係具備上述四個第一標記要素931,第二對準標記94亦可具備三個第二標記要素941,三個第二標記要素941係省略了上述四個第二標記要素941中的一個第二標記要素941。在此情形中,第一對準標記93與第二對準標記94為非相似形狀。In addition, the shape, arrangement, and number of the first marker elements 931 may be the same as or different from the shape, arrangement, and number of the second marker elements 941, respectively. For example, the first alignment mark 93 may include the above-mentioned four first mark elements 931, the second alignment mark 94 may include three second mark elements 941, and the three second mark elements 941 may be omitted. One second marker element 941 among the four second marker elements 941 . In this case, the first alignment mark 93 and the second alignment mark 94 are not similar in shape.

圖7係顯示控制部10所具備的電腦100的構成之圖。電腦100係具備有處理器(processor)101、記憶體102、輸入輸出部103以及匯流排(bus)104之一般的電腦。匯流排104為用以連接處理器101、記憶體102以及輸入輸出部103之訊號電路。記憶體102係記憶程式以及各種資訊。處理器101係依循記憶於記憶體102的程式等,一邊利用記憶體102等一邊執行各種處理(例如數值計算、影像處理)。輸入輸出部103係具備:鍵盤105以及滑鼠106,係接受來自操作者的輸入;以及顯示器107,係顯示來自處理器101的輸出等。此外,控制部10係可為可程式邏輯控制器(PLC;Programmable Logic Controller)或者電路基板等,亦可為這些構件與一個以上的電腦的組合。FIG. 7 is a diagram showing the configuration of the computer 100 included in the control unit 10 . The computer 100 is a general computer including a processor 101 , a memory 102 , an input/output unit 103 , and a bus 104 . The bus bar 104 is a signal circuit for connecting the processor 101 , the memory 102 and the input/output part 103 . The memory 102 stores programs and various kinds of information. The processor 101 executes various processing (for example, numerical calculation, image processing) while using the memory 102 and the like in accordance with a program or the like stored in the memory 102 . The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from the operator, and a display 107 for displaying output from the processor 101 and the like. In addition, the control unit 10 may be a programmable logic controller (PLC; Programmable Logic Controller), a circuit board, or the like, and may be a combination of these components and one or more computers.

圖8係顯示藉由電腦100所實現的控制部10的功能之方塊圖。在圖8中亦一併顯示控制部10以外的構成。控制部10係具備記憶部111、拍攝控制部112、檢測部113以及描繪控制部114。記憶部111係主要藉由記憶體102所實現,預先記憶被描繪至基板9之預定的圖案的資料(亦即描繪用資料)以及以下所說明的第一位置關係資訊與第二位置關係資訊等的各種資訊。FIG. 8 is a block diagram showing the functions of the control unit 10 realized by the computer 100 . In FIG. 8 , configurations other than the control unit 10 are also shown together. The control unit 10 includes a memory unit 111 , an imaging control unit 112 , a detection unit 113 , and a drawing control unit 114 . The memory unit 111 is mainly realized by the memory 102, and stores in advance data of a predetermined pattern drawn on the substrate 9 (that is, data for drawing), and the first positional relationship information and the second positional relationship information described below. various information.

第一位置關係資訊為下述資訊:顯示藉由圖案描繪部4描繪至被圖1所示的第一搬運機構2a(亦即第一台21a以及第一移動機構22a)搬運之基板9的上側的主表面之圖案與藉由第一標記描繪部51(參照圖2)描繪至圖1所示的第一搬運機構2a(亦即第一台21a以及第一移動機構22a)搬運之基板9的下側的主表面之第一對準標記93(參照圖5)之間的俯視觀看時的相對性的位置關係。第二位置關係資訊為下述資訊:顯示藉由圖案描繪部4描繪至被第二搬運機構2a(亦即第二台21a以及第二移動機構22a)搬運之基板9的上側的主表面之圖案與藉由第二標記描繪部52(參照圖2)描繪至第二搬運機構2a(亦即第二台21a以及第二移動機構22a)搬運之基板9的下側的主表面之第二對準標記94(參照圖6)之間的俯視觀看時的相對性的位置關係。The first positional relationship information is information showing that the upper side of the substrate 9 conveyed by the first conveying mechanism 2a (that is, the first stage 21a and the first moving mechanism 22a) shown in FIG. 1 is drawn by the pattern drawing unit 4 The pattern on the main surface of , and the pattern on the main surface of the substrate 9 drawn by the first mark drawing section 51 (refer to FIG. 2 ) to the first conveying mechanism 2 a (ie, the first stage 21 a and the first moving mechanism 22 a ) shown in FIG. 1 are conveyed Relative positional relationship between the first alignment marks 93 (refer to FIG. 5 ) on the lower main surface in a plan view. The second positional relationship information is information showing the pattern drawn by the pattern drawing unit 4 to the main surface on the upper side of the substrate 9 conveyed by the second conveying mechanism 2a (ie, the second stage 21a and the second moving mechanism 22a). The second alignment with the main surface of the lower side of the substrate 9 that is drawn by the second mark drawing portion 52 (see FIG. 2 ) to the second conveying mechanism 2 a (ie, the second stage 21 a and the second moving mechanism 22 a ) The relative positional relationship between the marks 94 (see FIG. 6 ) in plan view.

第一位置關係資訊係藉由下述方式預先取得:在描繪裝置1的第一搬運機構2a中,對試驗基板的上側的主表面進形圖案的描繪以及對試驗基板的下側的主表面進行第一對準標記93的描繪,並測定該圖案與第一對準標記93之間的相對位置。第二位置關係資訊係藉由下述方式預先取得:在描繪裝置1的第二搬運機構2b中,對試驗基板的上側的主表面進形圖案的描繪以及對試驗基板的下側的主表面進行第二對準標記94的描繪,並測定該圖案與第二對準標記94之間的相對位置。The first positional relationship information is obtained in advance by: in the first conveyance mechanism 2a of the drawing device 1, drawing the progressive pattern on the main surface of the upper side of the test substrate and performing the drawing on the main surface of the lower side of the test substrate. The first alignment mark 93 is drawn, and the relative position between the pattern and the first alignment mark 93 is measured. The second positional relationship information is acquired in advance by, in the second conveyance mechanism 2b of the drawing device 1, drawing the progressive pattern on the main surface on the upper side of the test substrate and performing the drawing on the main surface on the lower side of the test substrate. The second alignment mark 94 is drawn, and the relative position between the pattern and the second alignment mark 94 is determined.

圖8所示的拍攝控制部112、檢測部113以及描繪控制部114係主要藉由處理器101(參照圖7)所實現。拍攝控制部112係控制拍攝部3、第一移動機構22a以及第二移動機構22b,藉此使拍攝部3拍攝第一台21a以及第二台21b上的基板9的上側的主表面並取得影像。該影像係被傳送並被儲存於記憶部111。檢測部113係使用該影像來檢測基板9的位置。此外,檢測部113係判別該影像中的對準標記的種類。具體而言,判別該對準標記是第一對準標記93、第二對準標記94以及其他的對準標記中的哪一個。The imaging control unit 112 , the detection unit 113 , and the rendering control unit 114 shown in FIG. 8 are mainly realized by the processor 101 (see FIG. 7 ). The imaging control unit 112 controls the imaging unit 3, the first moving mechanism 22a, and the second moving mechanism 22b, whereby the imaging unit 3 images the main surface of the upper side of the substrate 9 on the first stage 21a and the second stage 21b and acquires an image . The image is transmitted and stored in the memory unit 111 . The detection unit 113 detects the position of the substrate 9 using the image. In addition, the detection unit 113 discriminates the type of the alignment mark in the video. Specifically, it is determined which of the first alignment mark 93 , the second alignment mark 94 , and the other alignment marks the alignment mark is.

描繪控制部114係基於檢測部113所檢測的基板9的位置、對準標記的種類以及預先記憶於記憶部111的描繪用資料等,控制圖案描繪部4、第一移動機構22a以及第二移動機構22b,藉此使圖案描繪部4進行對於第一台21a以及第二台21b上的基板9的描繪。The drawing control unit 114 controls the pattern drawing unit 4 , the first movement mechanism 22 a , and the second movement based on the position of the substrate 9 detected by the detection unit 113 , the type of alignment mark, the drawing data previously stored in the memory unit 111 , and the like. The mechanism 22b allows the pattern drawing unit 4 to perform drawing on the substrates 9 on the first stage 21a and the second stage 21b.

接著,說明圖1所示的描繪裝置1所為之朝基板9的圖案的描繪之流程。在描繪裝置1中,大概在對被保持於第一台21a以及第二台21b中的一方的台上的基板9進行描繪的期間,將基板9搬入至另一方的台上並進行對準處理等。而且,當結束對於被保持於上述一方的台上的基板9之描繪時,開始對被保持於上述另一方的台上的基板9之描繪。此外,在對該另一方的台上的基板9進行描繪的期間,從一方的台上搬出描繪完畢的基板9,並將新的基板9搬入至該一方的台上並進行對準處理等。在以下的說明中,說明圖案描繪部4對基板9的第一主表面91進行圖案的描繪。Next, the flow of the drawing of the pattern on the substrate 9 by the drawing apparatus 1 shown in FIG. 1 will be described. In the drawing apparatus 1, while the substrate 9 held on one of the first table 21a and the second table 21b is being drawn, the substrate 9 is carried into the other table and an alignment process is performed. Wait. Then, when the drawing of the substrate 9 held on the one table is completed, the drawing of the substrate 9 held on the other table is started. In addition, while the substrate 9 on the other table is being drawn, the drawn substrate 9 is carried out from the one table, and a new substrate 9 is carried on the one table to perform alignment processing and the like. In the following description, it will be described that the pattern drawing unit 4 draws a pattern on the first main surface 91 of the substrate 9 .

圖9A以及圖9B係顯示描繪裝置1中的描繪處理的流程的一例之圖。圖9A以及圖9B中的左側的步驟S11至步驟S19係顯示朝第一台21a上的基板9的描繪處理之流程,圖9A以及圖9B中的右側的步驟S21至步驟S29係顯示朝第二台21b上的基板9的描繪處理之流程。此外,位於圖9A以及圖9B中的上下方向的相同位置之步驟係大致並行地進行。具體而言,步驟S11與步驟S21至步驟S26係大致並行地進行。此外,步驟S28與步驟S13至步驟S18係大致並行地進行。9A and 9B are diagrams showing an example of the flow of rendering processing in the rendering apparatus 1 . Steps S11 to S19 on the left side in FIGS. 9A and 9B show the flow of the drawing process toward the substrate 9 on the first stage 21 a, and steps S21 to S29 on the right side in FIGS. 9A and 9B show the flow of drawing processing toward the second stage 21 a The flow of the drawing process of the substrate 9 on the stage 21b. In addition, the steps located at the same position in the vertical direction in FIGS. 9A and 9B are performed substantially in parallel. Specifically, step S11 is performed substantially in parallel with steps S21 to S26. In addition, step S28 is performed substantially in parallel with steps S13 to S18.

在圖9A以及圖9B中,從對第一搬運機構2a的第一台21a上的基板9進行圖案的描繪之狀態開始說明。此外,圖10至圖15係顯示描繪處理中的描繪裝置1中的第一台21a以及第二台21b的Y方向中的概略性的位置之概念圖。在圖10至圖15中,以實線描繪第一台21a、第一移動機構22a、第二台21b以及第二移動機構22b,以虛線描繪拍攝頭31以及描繪頭41。In FIGS. 9A and 9B , the description will be started from a state in which a pattern is drawn on the substrate 9 on the first stage 21a of the first conveyance mechanism 2a. 10 to 15 are conceptual diagrams showing schematic positions in the Y direction of the first table 21a and the second table 21b in the drawing apparatus 1 in the drawing process. In FIGS. 10 to 15 , the first stage 21a, the first moving mechanism 22a, the second stage 21b, and the second moving mechanism 22b are drawn by solid lines, and the imaging head 31 and the drawing head 41 are drawn by broken lines.

在以下的說明中,針對Y方向中的第一台21a的位置,將於上下方向與拍攝頭31以及/或者描繪頭41重疊的位置稱為「處理位置」,將在上下方向與第一移動機構22a的(-Y)側的端部重疊的位置稱為「搬出搬入位置」,將在上下方向與第一移動機構22a的(+Y)側的端部重疊的位置稱為「待機位置」。此外,針對Y方向中的第二台21b的位置,將於上下方向與拍攝頭31以及/或者描繪頭41重疊的位置稱為「處理位置」,將在上下方向與第二移動機構22b的(-Y)側的端部重疊的位置稱為「搬出搬入位置」,將在上下方向與第二移動機構22b的(+Y)側的端部重疊的位置稱為「待機位置」。此外,上述處理位置並非是指Y方向中的一點之概念,而是指拍攝部3所為之基板9的拍攝以及圖案描繪部4進行圖案的掃描之Y方向的預定的範圍(亦即處理區域)。In the following description, the position of the first stage 21a in the Y direction will be referred to as the "processing position" at the position overlapping the imaging head 31 and/or the drawing head 41 in the vertical direction, and the position of the first table 21a in the vertical direction will be referred to as the "processing position". The position where the end on the (-Y) side of the mechanism 22a overlaps is referred to as the "carrying-out position", and the position overlapping the end on the (+Y) side of the first moving mechanism 22a in the vertical direction is referred to as the "standby position" . In addition, regarding the position of the second stage 21b in the Y direction, the position overlapping the imaging head 31 and/or the drawing head 41 in the up-down direction is referred to as a "processing position", and the position in the up-down direction with the second moving mechanism 22b (( The position where the end on the (+Y) side of the second moving mechanism 22b overlaps is referred to as the "carrying-out position", and the position overlapping the end on the (+Y) side of the second moving mechanism 22b in the vertical direction is referred to as the "standby position". In addition, the above-mentioned processing position does not refer to the concept of a point in the Y direction, but refers to a predetermined range (that is, a processing area) in the Y direction for the imaging of the substrate 9 by the imaging unit 3 and the scanning of the pattern by the pattern drawing unit 4. .

如圖10所示,在描繪裝置1中,在第一台21a位於處理位置且描繪頭41位於第一描繪位置的狀態下,圖案描繪部4係對第一台21a上的基板9的上側的主表面(亦即第一主表面91)進行圖案的描繪。此外,第一標記描繪部51(參照圖2)係對第一台21a上的基板9的下側的主表面(亦即第二主表面92)進行第一對準標記93的描繪(步驟S11)。在步驟S11中,藉由描繪控制部114(參照圖8)控制圖案描繪部4以及第一移動機構22a,藉此對在處理位置中朝(-Y)方向移動之基板9的上側的主表面進行圖案的描繪。針對基板9的下側的主表面之第一對準標記93的描繪係可與針對基板9的上側的主表面之圖案的描繪並行地進行,亦可在該圖案的描繪之前或者之後進行。As shown in FIG. 10 , in the drawing apparatus 1, in a state where the first stage 21a is located at the processing position and the drawing head 41 is located at the first drawing position, the pattern drawing unit 4 draws the image on the upper side of the substrate 9 on the first stage 21a. The main surface (ie, the first main surface 91 ) performs the drawing of the pattern. Further, the first mark drawing unit 51 (see FIG. 2 ) draws the first alignment marks 93 on the main surface (ie, the second main surface 92 ) on the lower side of the substrate 9 on the first stage 21 a (step S11 ). ). In step S11 , the pattern drawing unit 4 and the first moving mechanism 22 a are controlled by the drawing control unit 114 (see FIG. 8 ), whereby the main surface on the upper side of the substrate 9 moving in the (−Y) direction in the processing position is controlled. Draw the pattern. The drawing of the first alignment marks 93 on the main surface of the lower side of the substrate 9 may be performed in parallel with the drawing of the pattern on the main surface of the upper side of the substrate 9, or may be performed before or after the drawing of the pattern.

在描繪裝置1中,與步驟S11並行地,從位於搬出搬入位置的第二台21b搬出描繪完畢的基板9,並將新的基板9搬入並保持於第二台21b上(步驟S21、S22)。接著,藉由第二移動機構22b將第二台21b朝(+Y)方向移動並位於如圖11所示的處理位置(步驟S23)。在圖11所示的狀態中,在第一台21a位於處理位置的狀態下對第一台21a上的基板9進行圖案的描繪。此外,拍攝頭31係位於第二拍攝位置。In the drawing apparatus 1, in parallel with step S11, the drawn substrate 9 is unloaded from the second stage 21b located at the unloading and carrying position, and the new board 9 is carried in and held on the second stage 21b (steps S21, S22). . Next, the second table 21b is moved in the (+Y) direction by the second moving mechanism 22b to be positioned at the processing position shown in FIG. 11 (step S23). In the state shown in FIG. 11, the pattern drawing of the board|substrate 9 on the 1st stage 21a is performed in the state in which the 1st stage 21a is located in a processing position. In addition, the photographing head 31 is located at the second photographing position.

當第二台21b位於處理位置時,藉由拍攝控制部112(參照圖8)控制拍攝部3以及第二移動機構22b,藉此進行對於設置在第二台21b上的基板9的上側的主表面(亦即第一主表面91)的對準標記(省略圖示)之拍攝,並將所取得的影像朝檢測部113(參照圖8)輸送。該對準標記係預先設置於在步驟S22中被搬入至第二台21b上的基板9,且具有例如與第一對準標記93以及第二對準標記94不同的外觀。When the second table 21b is located at the processing position, the imaging control unit 112 (see FIG. 8 ) controls the imaging unit 3 and the second moving mechanism 22b, thereby performing the main operation on the upper side of the substrate 9 provided on the second table 21b. The alignment mark (not shown) on the surface (that is, the first main surface 91 ) is photographed, and the acquired image is sent to the detection unit 113 (see FIG. 8 ). This alignment mark is provided in advance on the board|substrate 9 carried in to the 2nd stage 21b in step S22, and has a different external appearance from the 1st alignment mark 93 and the 2nd alignment mark 94, for example.

在檢測部113中,對該影像進行使用了基準影像的圖案匹配(pattern matching)。該圖案匹配係例如藉由公知的圖案匹配法(例如幾何學形狀圖案匹配、正規化相關檢索等)來進行。藉此,求出該影像中的對準標記的位置,檢測出第二台21b上的基板9的位置(步驟S24)。The detection unit 113 performs pattern matching on the video using the reference video. This pattern matching is performed, for example, by a known pattern matching method (eg, geometric shape pattern matching, normalized correlation search, etc.). Thereby, the position of the alignment mark in this image|video is calculated|required, and the position of the board|substrate 9 on the 2nd stage 21b is detected (step S24).

所謂檢測部113所檢測的基板9的位置係包含第二台21b上的基板9的X方向以及Y方向中的座標、基板9的方向以及用以顯示基板9的彎曲等所致使的變形之資訊。此外,所謂顯示基板9的變形之資訊為已變形的基板9的形狀以及該基板9上的描繪區域的位置等之資訊。在檢測部113中,基於所檢測的基板9的位置,進行第二台21b上的基板9用的描繪資料的調節(亦即對準處理)。The position of the substrate 9 detected by the detection unit 113 includes the coordinates in the X direction and the Y direction of the substrate 9 on the second stage 21b, the direction of the substrate 9, and information for displaying the deformation caused by the bending of the substrate 9, etc. . In addition, the information on the deformation of the display substrate 9 is information such as the shape of the deformed substrate 9 and the position of the drawing area on the substrate 9 . In the detection part 113, based on the detected position of the board|substrate 9, adjustment (namely, alignment process) of the drawing data for the board|substrate 9 on the 2nd stage 21b is performed.

當結束第二台21b上的基板9的拍攝時,藉由第二移動機構22b將第二台21b朝(+Y)方向移動並位於圖12所示的待機位置(步驟S25)。在圖12所示的狀態中,在第一台21a位於處理位置的狀態下對第一台21a上的基板9進行圖案的描繪。第二台21b係在待機位置處待機,直至結束對於第一台21a上的基板9的圖案的描繪為止(步驟S26)。When the imaging of the substrate 9 on the second stage 21b is completed, the second stage 21b is moved in the (+Y) direction by the second moving mechanism 22b and placed at the standby position shown in FIG. 12 (step S25). In the state shown in FIG. 12, the pattern drawing of the board|substrate 9 on the 1st stage 21a is performed in the state in which the 1st stage 21a is located in a processing position. The second stage 21b waits at the standby position until the drawing of the pattern on the substrate 9 on the first stage 21a is completed (step S26).

當結束對於第一台21a上的基板9之圖案以及第一對準標記93的描繪時(步驟S11),藉由第一移動機構22a將第一台21a朝(-Y)方向移動並位於圖13所示的搬出搬入位置(步驟S12)。此外,與步驟S12並行地,藉由第二移動機構22b將第二台21b朝(-Y)方向移動並位於處理位置(步驟S27)。此外,拍攝頭31係從第二拍攝位置朝第一拍攝位置移動。描繪頭41係從第一描繪位置朝第二描繪位置移動。When the drawing of the pattern of the substrate 9 and the first alignment marks 93 on the first stage 21a is completed (step S11), the first stage 21a is moved in the (-Y) direction by the first moving mechanism 22a and positioned in the figure The carry-in position shown in 13 is carried out (step S12). Further, in parallel with step S12, the second table 21b is moved in the (-Y) direction by the second moving mechanism 22b and positioned at the processing position (step S27). In addition, the photographing head 31 is moved from the second photographing position to the first photographing position. The drawing head 41 is moved from the first drawing position to the second drawing position.

而且,基於上述對準處理完畢的描繪資料等,藉由描繪控制部114控制圖案描繪部4以及第二移動機構22b,藉此對處理位置中朝(-Y)方向移動的第二台21b上的基板9的上側的主表面(亦即第一主表面91)進行圖案的描繪。此外,藉由第二標記描繪部52(參照圖2)對第二台21b上的基板9的下側的主表面(亦即第二主表面92)進行第二對準標記94的描繪(步驟S28)。對於基板9的下側的主表面之第二對準標記94的描繪係可與對於基板9的上側的主表面之圖案的描繪並行地進行,亦可在該圖案的描繪之前或者之後進行。Then, based on the above-described alignment-processed drawing data and the like, the pattern drawing unit 4 and the second moving mechanism 22b are controlled by the drawing control unit 114, whereby the drawing control unit 114 controls the second table 21b that moves in the (-Y) direction in the processing position. The main surface (ie, the first main surface 91 ) on the upper side of the substrate 9 is drawn with a pattern. In addition, the second alignment mark 94 is drawn on the main surface (ie, the second main surface 92 ) on the lower side of the substrate 9 on the second stage 21 b by the second mark drawing unit 52 (see FIG. 2 ) (step S28). The drawing of the second alignment marks 94 on the main surface of the lower side of the substrate 9 may be performed in parallel with the drawing of the pattern on the main surface of the upper side of the substrate 9, or may be performed before or after the drawing of the pattern.

在描繪裝置1中,與朝第二台21b上的基板9之圖案的描繪並行地,從位於搬出搬入位置的第一台21a搬出描繪完畢的基板9,並將新的基板9搬入並保持於第一台21a上(步驟S13、S14)。接著,藉由第一移動機構22a將第一台21a朝(+Y)方向移動並位於圖14所示的處理位置(步驟S15)。在圖14所示的狀態中,在第二台21b位於處理位置的狀態下對第二台21b上的基板9進行圖案的描繪。In the drawing apparatus 1, in parallel with the drawing of the pattern on the substrate 9 on the second table 21b, the drawn substrate 9 is carried out from the first table 21a located at the carry-out and carry-in position, and a new board 9 is carried in and held in on the first unit 21a (steps S13, S14). Next, the first stage 21a is moved in the (+Y) direction by the first moving mechanism 22a and positioned at the processing position shown in FIG. 14 (step S15). In the state shown in FIG. 14, the pattern drawing of the board|substrate 9 on the 2nd stage 21b is performed in the state in which the 2nd stage 21b is located in a processing position.

當第一台21a位於處理位置時,藉由拍攝控制部112控制拍攝部3以及第一移動機構22a,藉此藉由拍攝頭31拍攝設置在第一台21a上的基板9的上側的主表面(亦即第一主表面91)的對準標記(省略圖示),並將所取得的影像朝檢測部113輸送。該對準標記係預先設置於在步驟S14中被搬入至第一台21a上的基板9,且具有例如與第一對準標記93以及第二對準標記94不同的外觀。When the first stage 21a is located at the processing position, the imaging control unit 112 controls the imaging unit 3 and the first moving mechanism 22a, whereby the main surface of the upper side of the substrate 9 provided on the first stage 21a is captured by the imaging head 31 (that is, the first main surface 91 ) of the alignment mark (not shown), and the acquired image is sent to the detection unit 113 . This alignment mark is provided in advance on the board|substrate 9 carried into the 1st stage 21a in step S14, and has a different external appearance from the 1st alignment mark 93 and the 2nd alignment mark 94, for example.

與步驟S24略同樣地,在檢測部113中,對該影像進行圖案匹配,檢測出第一台21a上的基板9的位置(步驟S16)。在檢測部113中,基於所檢測的基板9的位置,進行描繪至第一台21a上的基板9之預定的圖案資料的調節(亦即對準處理)。Similar to step S24, the detection unit 113 performs pattern matching on the image to detect the position of the substrate 9 on the first stage 21a (step S16). In the detection part 113, based on the detected position of the board|substrate 9, the adjustment (namely, alignment process) of the predetermined pattern data drawn to the board|substrate 9 on the 1st stage 21a is performed.

當結束第一台21a上的基板9的拍攝時,藉由第一移動機構22a將第一台21a朝(+Y)方向移動並位於圖15所示的待機位置(步驟S17)。在圖15所示的狀態中,第二台21b位於處理位置的狀態下對第二台21b上的基板9進行圖案的描繪。第一台21a係在待機位置處待機,直至結束對於第二台21b上的基板9的圖案的描繪為止(步驟S18)。When the imaging of the substrate 9 on the first stage 21a is completed, the first stage 21a is moved in the (+Y) direction by the first moving mechanism 22a and placed at the standby position shown in FIG. 15 (step S17). In the state shown in FIG. 15, the pattern drawing of the board|substrate 9 on the 2nd stage 21b is performed in the state where the 2nd stage 21b is located in a processing position. The first table 21a waits at the standby position until the drawing of the pattern on the substrate 9 on the second table 21b is completed (step S18).

當結束對於第二台21b上的基板9之圖案以及第二對準標記94的描繪時(步驟S28),藉由第二移動機構22b將第二台21b朝(-Y)方向移動並位於圖10所示的搬出搬入位置(步驟S29)。此外,與步驟S29並行地,藉由第一移動機構22a將第一台21a朝(-Y)方向移動並位於處理位置(步驟S19)。此外,拍攝頭31係從第一拍攝位置朝第二拍攝位置移動。描繪頭41係從第二描繪位置朝第一描繪位置移動。When the drawing of the pattern of the substrate 9 and the second alignment mark 94 on the second stage 21b is completed (step S28), the second stage 21b is moved in the (-Y) direction by the second moving mechanism 22b and positioned in the 10 is carried out to the carry-in position (step S29). Moreover, in parallel with step S29, the 1st table 21a is moved to a (-Y) direction by the 1st moving mechanism 22a, and is located in a processing position (step S19). In addition, the photographing head 31 is moved from the first photographing position to the second photographing position. The drawing head 41 is moved from the second drawing position to the first drawing position.

接著,從步驟S19返回至步驟S11,基於上述對準處理完畢的描繪資料等,藉由描繪控制部114控制圖案描繪部4以及第一移動機構22a,藉此對處理位置中朝(-Y)方向移動的第一台21a上的基板9的上側的主表面(亦即第一主表面91)進行圖案的描繪。此外,藉由第一標記描繪部51對第一台21a上的基板9的下側的主表面(亦即第二主表面92)進行第一對準標記93的描繪(步驟S11)。再者,從步驟S29返回至步驟S21,從位於搬出搬入位置的第二台21b搬出描繪完畢的基板9,並將新的基板9搬入並保持於第二台21b上(步驟S21、S22)。在描繪裝置1中,反復步驟S11至步驟S19以及步驟S21至步驟S29,對複數個基板9依序地進行描繪。Next, returning from step S19 to step S11, based on the above-described alignment-processed drawing data and the like, the pattern drawing unit 4 and the first movement mechanism 22a are controlled by the drawing control unit 114, whereby the center of the processing position (-Y) is adjusted. A pattern is drawn on the main surface (ie, the first main surface 91 ) on the upper side of the substrate 9 on the first stage 21 a that has moved in the direction. Further, the first alignment mark 93 is drawn on the main surface (ie, the second main surface 92 ) on the lower side of the substrate 9 on the first stage 21 a by the first mark drawing unit 51 (step S11 ). Then, returning from step S29 to step S21, the drawn substrate 9 is unloaded from the second stage 21b located at the unloading and loading position, and a new board 9 is carried in and held on the second stage 21b (steps S21, S22). In the drawing apparatus 1, steps S11 to S19 and steps S21 to S29 are repeated, and the plurality of substrates 9 are drawn in sequence.

接著,說明藉由圖案描繪部4對已對第一主表面91描繪完畢上述圖案的基板9的第二主表面92進行圖案的描繪時之描繪裝置1的動作。以下,一邊參照圖9A以及圖9B一邊說明於被保持於第二台21b之基板9的第二主表面92描繪有圖案之情形。此外,雖然通常與朝第二台21b上的基板9之圖案的描繪並行地朝第一台21a上的基板9之圖案的描繪係與上述說明略同樣地進行,然而為了方便說明,省略針對對於第一台21a上的基板9的處理之說明。Next, the operation of the drawing device 1 when the pattern drawing unit 4 draws the pattern on the second main surface 92 of the substrate 9 on which the above-described pattern has been drawn on the first main surface 91 will be described. Hereinafter, a case where a pattern is drawn on the second main surface 92 of the substrate 9 held by the second stage 21b will be described with reference to FIGS. 9A and 9B . In addition, the drawing of the pattern toward the substrate 9 on the first table 21a is generally performed in parallel with the drawing of the pattern toward the substrate 9 on the second table 21b in the same manner as described above. Description of the processing of the substrate 9 on the first stage 21a.

在描繪裝置1中,首先,與步驟S22略同樣地,第二主表面92朝向上側的基板9係被搬入並保持於第二台21b上(步驟S22)。在描繪裝置1中對該基板9的第一主表面91(亦即下側的主表面)預先描繪有上述圖案。在第一搬運機構2a中對第一主表面91進行該圖案的描繪之情形中,於基板9的第二主表面92描繪有第一對準標記93(參照圖5)。此外,在第二搬運機構2b中對第一主表面91進行該圖案的描繪之情形中,於基板9的第二主表面92描繪有第二對準標記94(參照圖6)。In the drawing apparatus 1, first, in a similar manner to step S22, the substrate 9 with the second main surface 92 facing upward is carried in and held on the second stage 21b (step S22). The above-mentioned pattern is drawn in advance on the first main surface 91 (that is, the main surface of the lower side) of the substrate 9 in the drawing device 1 . When the pattern is drawn on the first main surface 91 in the first conveyance mechanism 2a, the first alignment mark 93 is drawn on the second main surface 92 of the substrate 9 (see FIG. 5 ). In addition, when the pattern is drawn on the first main surface 91 in the second conveyance mechanism 2b, the second alignment mark 94 is drawn on the second main surface 92 of the substrate 9 (see FIG. 6 ).

接著,藉由第二移動機構22b將第二台21b從搬出搬入位置朝(+Y)方向移動並位於處理位置(步驟S23)。而且,藉由拍攝控制部112(參照圖8)控制拍攝部3以及第二移動機構22b,藉此進行設置於第二台21b上的基板9的上側的主表面(亦即第二主表面92)之對準標記(亦即第一對準標記93或者第二對準標記94)的拍攝,將所取得的影像朝檢測部113(參照圖8)輸送。Next, the second table 21b is moved in the (+Y) direction from the carry-out and carry-in position by the second moving mechanism 22b and positioned at the processing position (step S23). Then, the imaging control unit 112 (refer to FIG. 8 ) controls the imaging unit 3 and the second movement mechanism 22b, whereby the main surface (ie, the second main surface 92) on the upper side of the substrate 9 provided on the second stage 21b is performed. ) of the alignment mark (that is, the first alignment mark 93 or the second alignment mark 94 ) is captured, and the acquired image is sent to the detection unit 113 (see FIG. 8 ).

在檢測部113中,對該影像進行與上述說明略相同的圖案匹配,並判別該影像中的對準標記的種類。具體而言,判別該對準標記是第一對準標記93以及第二對準標記94的哪一個。此外,在檢測部113中,藉由上述圖案匹配求出該影像中的對準標記的位置,檢測出第二台21b上的基板9的位置(步驟S24)。在檢測部113中,基於所檢測的基板9的位置進行第二台21b上的基板9用的描繪資料的調節(亦即對準處理)。The detection unit 113 performs pattern matching on the image in the same manner as described above, and discriminates the type of the alignment mark in the image. Specifically, it is determined which of the first alignment mark 93 and the second alignment mark 94 the alignment mark is. Further, in the detection unit 113, the position of the alignment mark in the image is obtained by the above-described pattern matching, and the position of the substrate 9 on the second stage 21b is detected (step S24). In the detection part 113, based on the detected position of the board|substrate 9, adjustment (namely, alignment process) of the drawing data for the board|substrate 9 on the 2nd stage 21b is performed.

在步驟S24的圖案匹配中,為了與第二台21b上的基板9的傾斜(亦即從預定的方向偏移)、基板9的擴張縮小等對應,容許第一對準標記93以及第二對準標記94的樣板(template)的旋轉、擴張收縮。然而,由於基板9的上述傾斜、擴張收縮為稍微,因此樣板所容許的旋轉、擴張收縮亦為稍微。例如,容許旋轉角度為10°以下,容許擴張收縮比率為30%以下。In the pattern matching in step S24, in order to correspond to the inclination of the substrate 9 on the second stage 21b (that is, the deviation from the predetermined direction), the expansion and contraction of the substrate 9, etc., the first alignment mark 93 and the second pair of Rotation, expansion and contraction of the template of the quasi-mark 94. However, since the above-mentioned inclination, expansion and contraction of the base plate 9 are slightly, the rotation, expansion and contraction allowed by the template are also slightly. For example, the allowable rotation angle is 10° or less, and the allowable expansion-contraction ratio is 30% or less.

因此,如圖5以及圖6的例示所示,在第二對準標記94具有已使第一對準標記93旋轉較大的角度(例如45°)之外觀的情形中,在上述圖案匹配中不會誤認第一對準標記93與第二對準標記94。從防止該誤認之觀點而言,在第一對準標記93與第二對準標記94為相似形狀之情形中,較佳為第二對準標記94係至少具有使第一對準標記93旋轉超過10°或者將第一對準標記93擴張收縮超過30%之外觀。此外,從防止誤認之觀點而言,如上所述,亦可較佳為第一對準標記93與第二對準標記94為非相似形狀。Therefore, as illustrated in FIGS. 5 and 6 , in the case where the second alignment mark 94 has an appearance in which the first alignment mark 93 has been rotated by a large angle (for example, 45°), in the above-described pattern matching The first alignment mark 93 and the second alignment mark 94 are not misidentified. From the viewpoint of preventing this misunderstanding, in the case where the first alignment mark 93 and the second alignment mark 94 are similar in shape, it is preferable that the second alignment mark 94 has at least the ability to rotate the first alignment mark 93 Appearance that exceeds 10° or expands and contracts the first alignment mark 93 by more than 30%. In addition, from the viewpoint of preventing misidentification, as described above, it is also preferable that the first alignment mark 93 and the second alignment mark 94 have non-similar shapes.

當結束第二台21b上的基板9的拍攝時,藉由第二移動機構22b將第二台21b從處理位置朝待機位置移動並在待機位置處待機(步驟S25、S26)。當結束第二台21b的待機時,藉由第二移動機構22b將第二台21b從待機位置朝處理位置移動 (步驟S27)。When the imaging of the substrate 9 on the second stage 21b is completed, the second stage 21b is moved from the processing position to the standby position by the second moving mechanism 22b and waits at the standby position (steps S25, S26). When the standby of the second table 21b is completed, the second table 21b is moved from the standby position to the processing position by the second moving mechanism 22b (step S27).

而且,基於上述對準處理完畢的描繪資料以及藉由檢測部113所檢測的對準標記的種類等,藉由描繪控制部114(參照圖8)控制圖案描繪部4以及第二移動機構22b,對處理位置中朝(-Y)方向移動之第二台21b上的基板9的第二主表面92(亦即描繪有第一對準標記93或者第二對準標記94的主表面)進行圖案的描繪(步驟S28)。此外,於朝第二主表面92描繪圖案時,亦可不對第一主表面91(亦即下側的主表面)進行對準標記的描繪。Then, the pattern drawing unit 4 and the second movement mechanism 22b are controlled by the drawing control unit 114 (see FIG. 8 ) based on the drawing data that has been aligned and the type of the alignment mark detected by the detection unit 113, and the like. Patterning the second main surface 92 of the substrate 9 (ie, the main surface on which the first alignment mark 93 or the second alignment mark 94 is drawn) on the second stage 21b moving in the (-Y) direction in the processing position drawing (step S28). In addition, when drawing a pattern toward the second main surface 92, it is not necessary to draw an alignment mark on the first main surface 91 (that is, the main surface on the lower side).

在步驟S28中,在於基板9的第二主表面92描繪有第一對準標記93之情形中,描繪控制部114係判斷成已在第一搬運機構2a上進行了對於基板9的第一主表面91之圖案的描繪,並從記憶部111讀出第一位置關係資訊。如上所述,第一位置關係資訊為下述資訊:顯示在第一搬運機構2a上被描繪至基板9的第一主表面91的圖案與被描繪至第二主表面92的第一對準標記93之間的相對性的位置關係。在描繪裝置1中,基於第一位置關係資訊以及上述對準標記處理完畢的描繪資料等,藉由描繪控制部114控制圖案描繪部4以及第二移動機構22b,藉此調節圖案相對於第二台21b上的基板9的第二主表面92之描繪位置,並對第二主表面92描繪該圖案。藉此,能將已經描繪至基板9的第一主表面91的圖案與描繪至第二主表面92的圖案之相對位置設成與所期望的相對位置略相同。In step S28, when the first alignment marks 93 are drawn on the second main surface 92 of the substrate 9, the drawing control unit 114 determines that the first main operation on the substrate 9 has been performed on the first conveyance mechanism 2a. The pattern on the surface 91 is drawn, and the first positional relationship information is read from the memory unit 111 . As described above, the first positional relationship information is information showing the pattern drawn on the first main surface 91 of the substrate 9 and the first alignment mark drawn on the second main surface 92 on the first conveyance mechanism 2a The relative positional relationship between 93. In the drawing device 1, based on the first positional relationship information and the drawing data processed by the alignment marks, etc., the pattern drawing unit 4 and the second moving mechanism 22b are controlled by the drawing control unit 114 to adjust the pattern relative to the second moving mechanism 22b. The drawing position of the second main surface 92 of the substrate 9 on the stage 21 b is drawn, and the pattern is drawn on the second main surface 92 . Thereby, the relative position of the pattern drawn on the first main surface 91 of the substrate 9 and the pattern drawn on the second main surface 92 can be set to be approximately the same as desired relative positions.

另一方面,在對基板9的第二主表面92描繪有第二對準標記94之情形中,描繪控制部114係判斷成已在第二搬運機構2b上進行了對於基板9的第一主表面91之圖案的描繪,並從記憶部111讀出第二位置關係資訊。如上所述,第二位置關係資訊為下述資訊:顯示在第二搬運機構2b上被描繪至基板9的第一主表面91的圖案與被描繪至第二主表面92的第二對準標記94之間的相對性的位置關係。在描繪裝置1中,基於第二位置關係資訊以及上述對準標記處理完畢的描繪資料等,藉由描繪控制部114控制圖案描繪部4以及第二移動機構22b,藉此調節圖案相對於第二台21b上的基板9的第二主表面92之描繪位置,並對第二主表面92描繪該圖案。藉此,能將已經描繪至基板9的第一主表面91的圖案與描繪至第二主表面92的圖案之相對位置設成與所期望的相對位置略相同。On the other hand, when the second alignment mark 94 is drawn on the second main surface 92 of the substrate 9, the drawing control unit 114 determines that the first main surface of the substrate 9 has been performed on the second conveyance mechanism 2b. The pattern on the surface 91 is drawn, and the second positional relationship information is read from the memory unit 111 . As described above, the second positional relationship information is information showing the pattern drawn on the first main surface 91 of the substrate 9 and the second alignment mark drawn on the second main surface 92 on the second conveyance mechanism 2b The relative positional relationship between 94. In the drawing device 1, the pattern drawing unit 4 and the second moving mechanism 22b are controlled by the drawing control unit 114 based on the second positional relationship information and the drawing data processed by the above-mentioned alignment marks, thereby adjusting the pattern relative to the second moving mechanism 22b. The drawing position of the second main surface 92 of the substrate 9 on the stage 21 b is drawn, and the pattern is drawn on the second main surface 92 . Thereby, the relative position of the pattern drawn on the first main surface 91 of the substrate 9 and the pattern drawn on the second main surface 92 can be set to be approximately the same as desired relative positions.

如以上所說明般,用以對基板9進行描繪之描繪系統(在上述例子中為描繪裝置1)係具備圖案描繪部4、第一搬運機構2a、第一標記描繪部51、第二搬運機構2b以及第二標記描繪部52。圖案描繪部4係對在下方水平移動之基板9的上側的主表面照射光線並描繪圖案。第一搬運機構2a係具備第一基板保持部(亦即第一台21a)以及第一移動機構22a,第一移動機構22a係在圖案描繪部4的下方水平移動第一台21a。第一標記描繪部51係對被保持於第一台21a之基板9的下側的主表面照射光線,並描繪被賦予關連至第一搬運機構2a的第一對準標記93。第二搬運機構2b係具備第二基板保持部(亦即第二台21b)以及第二移動機構22b,第二移動機構22b係在圖案描繪部4的下方水平移動第二台21b。第二標記描繪部52係對被保持於第二台21b之基板9的下側的主表面照射光線,並描繪被賦予關連至第二搬運機構2b的第二對準標記94。第二對準標記94的外觀係與第一對準標記93的外觀不同。As described above, the drawing system for drawing the substrate 9 (the drawing device 1 in the above example) includes the pattern drawing unit 4, the first conveyance mechanism 2a, the first mark drawing unit 51, and the second conveyance mechanism 2b and the second marker drawing unit 52 . The pattern drawing unit 4 draws a pattern by irradiating light to the main surface of the upper side of the substrate 9 that is horizontally moving downward. The 1st conveyance mechanism 2a is provided with the 1st board|substrate holding part (namely, the 1st stage 21a) and the 1st moving mechanism 22a, and the 1st moving mechanism 22a horizontally moves the 1st stage 21a below the pattern drawing part 4. The 1st mark drawing part 51 irradiates light to the main surface of the lower side of the board|substrate 9 hold|maintained by the 1st stage 21a, and draws the 1st alignment mark 93 related to the 1st conveyance mechanism 2a. The second conveyance mechanism 2b includes a second substrate holding portion (ie, the second stage 21b) and a second moving mechanism 22b that horizontally moves the second stage 21b below the pattern drawing portion 4 . The 2nd mark drawing part 52 irradiates light to the main surface of the lower side of the board|substrate 9 hold|maintained by the 2nd stage 21b, and draws the 2nd alignment mark 94 related to the 2nd conveyance mechanism 2b. The appearance of the second alignment mark 94 is different from that of the first alignment mark 93 .

因此,藉由觀察被描繪在基板9的另一方的主表面的對準標記,能在比該圖案描繪還後續的工序中容易地判別在圖案描繪部4朝基板9的一方的主表面描繪圖案時是利用第一搬運機構2a以及第二搬運機構2b的哪一個。藉此,能針對該一方的主表面描繪圖案時被利用的搬運機構考慮特有的表背位置關係(亦即上表面的圖案與下表面的對準標記之間的相對性的位置關係)進行描繪位置的調節後,對基板9的上述另一方的主表面描繪圖案。結果,能提升被描繪至基板9的兩側的主表面之圖案的相對性的位置精度。Therefore, by observing the alignment marks drawn on the other main surface of the substrate 9, it is possible to easily discriminate that the pattern drawing unit 4 has drawn a pattern on the one main surface of the substrate 9 in a process subsequent to the pattern drawing. Which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used. Thereby, it is possible to draw in consideration of the unique front-back positional relationship (that is, the relative positional relationship between the pattern on the upper surface and the alignment mark on the lower surface) for the conveying mechanism used when the pattern is drawn on the one main surface. After the adjustment of the position, a pattern is drawn on the other main surface of the substrate 9 . As a result, the relative positional accuracy of the pattern drawn to the main surfaces on both sides of the substrate 9 can be improved.

如上所述,較佳為描繪裝置1係進一步具備:記憶部111,係預先記憶第一位置關係資訊以及第二位置關係資訊;以及拍攝控制部112,係控制圖案描繪部4。第一位置關係資訊係顯示藉由圖案描繪部4描繪至被第一搬運機構2a搬運之基板9的上側的主表面之圖案與藉由第一標記描繪部51描繪至被第一搬運機構2a搬運之基板9的下側的主表面之第一對準標記93之間的相對性的位置關係。第二位置關係資訊係顯示藉由圖案描繪部4描繪至被第二搬運機構2b搬運之基板9的上側的主表面之圖案與藉由第二標記描繪部52描繪至被第二搬運機構2b搬運之基板9的下側的主表面之第二對準標記94之間的相對性的位置關係。較佳為拍攝控制部112係在圖案描繪部4對被描繪有第一對準標記93的主表面進行圖案的描繪時,基於第一位置關係資訊調節描繪位置;拍攝控制部112係在圖案描繪部4對被描繪有第二對準標記94的主表面進行圖案的描繪時,基於第二位置關係資訊調節描繪位置。藉此,能提供被描繪至兩側的主表面之圖案的相對性的位置精度高之基板9。As described above, it is preferable that the drawing device 1 further includes: the memory unit 111 that stores the first positional relationship information and the second positional relationship information in advance; and the photographing control unit 112 that controls the pattern drawing unit 4 . The first positional relationship information shows the pattern drawn by the pattern drawing unit 4 to the main surface of the upper side of the substrate 9 conveyed by the first conveyance mechanism 2a and the pattern drawn by the first mark drawing unit 51 to the first conveyance mechanism 2a conveyed by the first conveyance mechanism 2a. The relative positional relationship between the first alignment marks 93 on the main surface of the lower side of the substrate 9 . The second positional relationship information indicates that the pattern drawn by the pattern drawing unit 4 to the main surface of the upper side of the substrate 9 conveyed by the second conveyance mechanism 2b and the pattern drawn by the second mark drawing unit 52 to the main surface of the upper side of the substrate 9 conveyed by the second conveyance mechanism 2b and the pattern drawn by the second mark drawing unit 52 to be conveyed by the second conveyance mechanism 2b The relative positional relationship between the second alignment marks 94 on the main surface of the lower side of the substrate 9 . Preferably, the photographing control unit 112 adjusts the drawing position based on the first positional relationship information when the pattern drawing unit 4 draws a pattern on the main surface on which the first alignment marks 93 are drawn; When the part 4 draws a pattern on the main surface on which the second alignment mark 94 is drawn, the drawing position is adjusted based on the second positional relationship information. Thereby, the board|substrate 9 with high relative positional accuracy of the pattern drawn on the main surface of both sides can be provided.

如上所述,較佳為第一標記描繪部51係具備:第一遮罩部(在上述例子中為第一光圈514),係使來自第一光源512的光線的一部分通過;第二標記描繪部52係具備:第二遮罩部(在上述例子中為第二光圈524),係具有與第一遮罩部不同的開口,用以使來自第二光源522的光線的一部分通過。藉此,無須藉由第一標記描繪部51與第二標記描繪部52大幅地變更構造(亦即僅變更第一標記部與第二標記部),即能使第一對準標記93的外觀與第二對準標記94的外觀不同。因此,能抑制描繪裝置1的構造複雜化,並能提升被描繪至基板9的兩側的主表面之圖案的相對性的位置精度。As described above, it is preferable that the first marker drawing portion 51 includes: a first shield portion (the first aperture 514 in the above example) that allows a part of the light from the first light source 512 to pass therethrough; and the second marker drawing portion The portion 52 includes a second shield portion (the second aperture 524 in the above example) having an opening different from the first shield portion for allowing a part of the light from the second light source 522 to pass therethrough. Accordingly, the appearance of the first alignment mark 93 can be improved without significantly changing the structure of the first mark drawing portion 51 and the second mark drawing portion 52 (that is, only changing the first mark portion and the second mark portion). The appearance is different from that of the second alignment mark 94 . Therefore, the complexity of the structure of the drawing apparatus 1 can be suppressed, and the relative positional accuracy of the pattern drawn on the main surfaces on both sides of the board|substrate 9 can be improved.

如上所述,較佳為第一對準標記93以及第二對準標記94為非相似形狀。藉此,在上述圖案匹配時,即使在進行樣板的旋轉、擴張收縮之情形中,亦能抑制第一對準標記93與第二對準標記94的誤認,能精度佳地判別對準標記的種類。As mentioned above, it is preferred that the first alignment mark 93 and the second alignment mark 94 have non-similar shapes. Thereby, in the above-mentioned pattern matching, even when the template is rotated, expanded and contracted, misrecognition of the first alignment mark 93 and the second alignment mark 94 can be suppressed, and the alignment mark can be accurately discriminated. type.

如上所述,圖案描繪部4係具備:描繪頭41,係朝向下方照射光線;以及描繪頭移動機構42,係使描繪頭41在第一搬運機構2a的上方的第一描繪位置與第二搬運機構2b的上方的第二描繪位置之間移動。如此,藉由共通的描繪頭41進行對於第一台21a上的基板9之描繪以及對於第二台21b上的基板9之描繪,藉此能將描繪裝置1的構造簡化從而能將描繪裝置1小型化。此外,如上所述,在描繪裝置1中,能在比該圖案描繪還後續的工序中容易地判別在圖案描繪部4朝基板9的一方的主表面描繪圖案時是利用第一搬運機構2a以及第二搬運機構2b的哪一個。因此,描繪裝置1的構造係尤其適合不論是藉由第一搬運機構2a以及第二搬運機構2b的哪一個搬運機構皆能分別進行朝基板9的兩側的主表面描繪圖案之描繪裝置1。As described above, the pattern drawing unit 4 includes: the drawing head 41 for irradiating light downward; and the drawing head moving mechanism 42 for moving the drawing head 41 to the first drawing position and the second conveyance above the first conveyance mechanism 2a It moves between the second drawing positions above the mechanism 2b. In this way, the drawing on the substrate 9 on the first stage 21a and the drawing on the substrate 9 on the second stage 21b are performed by the common drawing head 41, whereby the structure of the drawing apparatus 1 can be simplified and the drawing apparatus 1 can be simplified. miniaturization. In addition, as described above, in the drawing device 1, it can be easily discriminated, in a step subsequent to the pattern drawing, whether the first conveyance mechanism 2a and the which of the second conveyance mechanisms 2b. Therefore, the structure of the drawing apparatus 1 is particularly suitable for the drawing apparatus 1 that can draw patterns on the main surfaces on both sides of the substrate 9 by either the first conveyance mechanism 2a or the second conveyance mechanism 2b.

在圖5以及圖6所示的例子中,雖然第一對準標記93以及第二對準標記94係分別為排列有圓形的標記要素之單純的圖形,然而並未限定於此。例如,第一對準標記93亦可為用以顯示與第一搬運機構2a相關的資訊之條碼,第二對準標記94亦可為用以顯示與第二搬運機構2b相關的資訊之條碼。在此情形中,藉由拍攝部3拍攝第一對準標記93,藉此亦能與利用於基板9的圖案描繪之搬運機構的種類(亦即第一搬運機構2a或者第二搬運機構2b)的判別並行地進行與該搬運機構相關的資訊取得。In the examples shown in FIGS. 5 and 6 , the first alignment mark 93 and the second alignment mark 94 are simple figures in which circular mark elements are arranged, respectively, but the present invention is not limited to this. For example, the first alignment mark 93 may also be a barcode for displaying information related to the first conveying mechanism 2a, and the second alignment mark 94 may also be a barcode for displaying information related to the second conveying mechanism 2b. In this case, by imaging the first alignment marks 93 by the imaging unit 3, the type of the conveying mechanism (that is, the first conveying mechanism 2a or the second conveying mechanism 2b) used for pattern drawing of the substrate 9 can also be compared. The determination of , is performed in parallel with the acquisition of information related to the conveying mechanism.

在第一對準標記93為條碼之情形中,於該條碼所顯示的資訊係例如包含有用以顯示第一搬運機構2a之識別號碼以及/或者第一位置關係資訊。在第二對準標記94為條碼之情形中,於該條碼所顯示的資訊係例如包含有用以顯示第二搬運機構2b之識別號碼以及/或者第一位置關係資訊。作為第一對準標記93以及第二對準標記94,係可利用一維條碼,亦可利用二維條碼。In the case where the first alignment mark 93 is a barcode, the information displayed on the barcode includes, for example, the identification number and/or the first positional relationship information for displaying the first conveying mechanism 2a. In the case where the second alignment mark 94 is a barcode, the information displayed on the barcode includes, for example, the identification number and/or the first positional relationship information for displaying the second conveying mechanism 2b. As the first alignment mark 93 and the second alignment mark 94, a one-dimensional barcode or a two-dimensional barcode may be used.

此外,第一對準標記93以及第二對準標記94亦可為包含上述資訊的條碼以外的標記。例如,第一對準標記93亦可為用以顯示第一搬運機構2a之記號,第二對準標記94亦可為用以顯示第二搬運機構2b之記號。In addition, the first alignment mark 93 and the second alignment mark 94 may be marks other than barcodes including the above-mentioned information. For example, the first alignment mark 93 may also be a mark for displaying the first transport mechanism 2a, and the second alignment mark 94 may also be a mark for displaying the second transport mechanism 2b.

在上述描繪裝置1中能夠進行各種變更。Various changes can be made in the above-described drawing device 1 .

在上述例子中,雖然藉由第一標記描繪部51對基板9的下側的主表面描繪有兩個相同的第一對準標記93,藉由第二描繪部52對基板9的下側的主表面描繪有兩個相同的第二對準標記94,然而並未限定於此。例如,兩個第一對準標記93的形狀、大小或者方向等亦可彼此不同。同樣地,兩個第二對準標記94的形狀、大小或者方向等亦可彼此不同。此外,在兩個第一對準標記93中的一方的第一對準標記93的外觀與兩個第二對準標記94中的一方的第二對準標記94的外觀不同之情形中,另一方的第一對準標記93與另一方的第二對準標記94亦可具有相同的外觀。In the above example, although two identical first alignment marks 93 are drawn on the main surface of the lower side of the substrate 9 by the first mark drawing portion 51 , the lower side of the substrate 9 is drawn by the second drawing portion 52 . The main surface is depicted with two identical second alignment marks 94, but is not so limited. For example, the shapes, sizes or directions of the two first alignment marks 93 may also be different from each other. Likewise, the shapes, sizes or orientations of the two second alignment marks 94 may also be different from each other. In addition, in the case where the appearance of the first alignment mark 93 of one of the two first alignment marks 93 and the appearance of the second alignment mark 94 of one of the two second alignment marks 94 are different, the other One of the first alignment marks 93 and the other of the second alignment marks 94 may have the same appearance.

藉由第一標記描繪部51對基板9的下側的主表面描繪的兩個第一對準標記93與藉由第二標記描繪部52對基板9的下側的主表面描繪的兩個第二對準標記94亦可為在基板9上的配置(亦即兩個對準標記的相對位置)不同。例如,兩個第一對準標記93亦可在基板9的下側的主表面的(-Y)側的端部處於X方向排列,兩個第二對準標記94亦可配置於基板9的下側的主表面的(-Y)側的端部與(+Y)側的端部。即使在此種情形中,由於在一起觀察兩個第一對準標記93之情形的外觀與一起觀察兩個第二對準標記94之情形的外觀係彼此不同,因此與上述同樣地,容易地判別是利用第一搬運機構2a以及第二搬運機構2b的哪一個來進行朝基板9的上側的主表面描繪圖案。此外,在如上述般配置不同之情形中,各個第一對準標記93與各個第二對準標記94亦可為相同的形狀。Two first alignment marks 93 drawn on the main surface of the lower side of the substrate 9 by the first mark drawing portion 51 and two first alignment marks 93 drawn on the main surface of the lower side of the substrate 9 by the second mark drawing portion 52 . The two alignment marks 94 may also have different configurations on the substrate 9 (ie, the relative positions of the two alignment marks). For example, the two first alignment marks 93 may be arranged in the X direction at the end of the main surface of the lower side of the substrate 9 on the (−Y) side, and the two second alignment marks 94 may be arranged on the side of the substrate 9 . The end on the (-Y) side and the end on the (+Y) side of the main surface on the lower side. Even in this case, since the appearance of the case of observing the two first alignment marks 93 together and the appearance of the case of observing the two second alignment marks 94 together are different from each other, as described above, it is easy to It is determined which one of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used to draw a pattern on the main surface on the upper side of the substrate 9 . In addition, in the case where the arrangement is different as described above, each of the first alignment marks 93 and each of the second alignment marks 94 may have the same shape.

在描繪裝置1中,藉由第一標記描繪部51對基板9的下側的主表面描繪的第一對準標記93的數量亦可為三個以上。此外,藉由第二標記描繪部52對基板9的下側的主表面描繪的第二對準標記94的數量亦可為三個以上。In the drawing apparatus 1, the number of the first alignment marks 93 drawn on the main surface of the lower side of the substrate 9 by the first mark drawing unit 51 may be three or more. In addition, the number of the second alignment marks 94 drawn on the main surface of the lower side of the substrate 9 by the second mark drawing section 52 may be three or more.

在第一標誌511中,例如亦可取代第一光圈514,描繪有與第一對準標記93對應的圖案之玻璃遮罩亦可作為第一遮罩部配置於第一光源512以及光學系統513的(+Z)側。在第二標誌521中亦同樣地,亦可取代第二光圈524,描繪有與第二對準標記94對應的圖案之玻璃遮罩亦可作為第二遮罩部配置於第二光源522以及光學系統523的(+Z)側。In the first mark 511 , for example, instead of the first aperture 514 , a glass mask on which a pattern corresponding to the first alignment mark 93 is drawn can also be disposed on the first light source 512 and the optical system 513 as the first mask portion. (+Z) side of . Similarly, in the second mark 521 , instead of the second aperture 524 , a glass mask on which a pattern corresponding to the second alignment mark 94 is drawn can also be disposed on the second light source 522 and the optical device as a second mask portion. (+Z) side of system 523.

第一標記描繪部51的第一標誌511不一定需要配置於第一台21a的內部。例如,第一標誌511亦可在上述處理位置中配置於第一台21a的移動路徑的鉛直下方,且在第一台21a位於第一標誌511的上方之狀態下經由設置於第一台21a的貫通孔對基板9的下側的主表面照射光線,並描繪第一對準標記93。第二標記描繪部52的第二標誌521亦同樣。The first marker 511 of the first marker drawing unit 51 does not necessarily need to be arranged inside the first stage 21a. For example, the first marker 511 may be arranged vertically below the moving path of the first stage 21a in the above-mentioned processing position, and the first stage 21a may be located above the first marker 511 via the The through hole irradiates the main surface of the lower side of the substrate 9 with light, and the first alignment mark 93 is drawn. The same applies to the second mark 521 of the second mark drawing unit 52 .

在第一標記描繪部51中,複數個第一標誌511的光源亦可共通。例如,來自共通光源的光線亦可經由複數個光纖分別朝複數個第一標誌511的光學系統513導引。在第二標記描繪部52中亦同樣。In the first marker drawing unit 51, the light sources of the plurality of first markers 511 may be shared. For example, the light from the common light source can also be guided toward the optical systems 513 of the plurality of first markers 511 through a plurality of optical fibers, respectively. The same applies to the second marker drawing unit 52 .

在描繪裝置1中,第一位置關係資訊等之包含被賦予至第一搬運機構2a的資訊之標記(例如條碼、數字)等亦可與第一對準標記93獨立地藉由第一標記描繪部51描繪至基板9的下側的主表面。此外,第二位置關係資訊等之包含被賦予至第二搬運機構2b的資訊之標記(例如條碼、數字)等亦可與第二對準標記94獨立地藉由第二標記描繪部52描繪至基板9的下側的主表面。In the drawing device 1, marks (such as barcodes, numbers) including information given to the first conveyance mechanism 2a including the first positional relationship information and the like may be drawn by the first marks independently of the first alignment marks 93. The portion 51 is drawn to the main surface of the lower side of the substrate 9 . In addition, marks (such as barcodes, numbers), etc. including the information given to the second conveyance mechanism 2 b including the second positional relationship information and the like may be drawn to the second alignment mark 94 by the second mark drawing unit 52 independently of the second alignment mark 94 . The main surface of the lower side of the substrate 9 .

在描繪裝置1中,第一搬運機構2a亦可進一步具備下述一個以上的構件:移動機構,係將第一台21a於X方向移動;旋轉機構,係以於Z方向延伸的旋轉軸作為中心旋轉第一台21a;以及升降機構,係將第一台21a於Z方向移動。作為該移動機構以及升降機構,能夠利用例如線性伺服馬達。此外,作為該旋轉機構,能夠利用伺服馬達。該移動機構、旋轉機構以及升降機構亦可進行各種變更。第二搬運機構2b亦與第一搬運機構2a同樣。In the drawing apparatus 1, the first conveyance mechanism 2a may further include one or more of the following members: a moving mechanism for moving the first stage 21a in the X direction; and a rotation mechanism for a rotation axis extending in the Z direction as a center The first table 21a is rotated; and the lift mechanism is used to move the first table 21a in the Z direction. As the moving mechanism and the elevating mechanism, for example, a linear servo motor can be used. In addition, as this rotation mechanism, a servomotor can be used. Various modifications can be made to the moving mechanism, the rotating mechanism, and the elevating mechanism. The second conveyance mechanism 2b is also the same as the first conveyance mechanism 2a.

在圖案描繪部4中,亦可分別設置有用以在第一描繪位置中對第一台21a上的基板9照射光線之描繪頭41以及用以在第二描繪位置中對第二台21b上的基板9照射光線之描繪頭41。在此情形中,亦可省略描繪頭移動機構42。再者,在拍攝部3中,亦可分別設置有用以在第一拍攝位置中拍攝第一台21a上的基板9之拍攝頭31以及用以在第二拍攝位置中拍攝第二台21b上的基板9之拍攝頭31。在此情形中,亦可省略拍攝頭移動機構32。此外,在描繪裝置1中,第一單元與第二單元亦可分離地設置;第一單元係具備:第一搬運機構2a;第一標記描繪部51;拍攝頭31,係用以在第一拍攝位置中拍攝第一台21a上的基板9;以及描繪頭41,係用以對第一台21a上的基板9照射光線;第二單元係具備:第二搬運機構2b;第二標記描繪部52;拍攝頭31,係用以在第二拍攝位置中拍攝第二台21b上的基板9;以及描繪頭41,係用以對第二台21b上的基板9照射光線。The pattern drawing unit 4 may be provided with a drawing head 41 for irradiating light on the substrate 9 on the first stage 21a in the first drawing position and a drawing head 41 for irradiating light on the second table 21b in the second drawing position, respectively. The substrate 9 irradiates the drawing head 41 with light. In this case, the drawing head moving mechanism 42 may also be omitted. Furthermore, the imaging unit 3 may be provided with an imaging head 31 for imaging the substrate 9 on the first stage 21a in the first imaging position, and an imaging head 31 for imaging the substrate 9 on the second stage 21b in the second imaging position, respectively. The camera head 31 of the substrate 9 . In this case, the photographing head moving mechanism 32 may also be omitted. In addition, in the drawing device 1, the first unit and the second unit may be provided separately; the first unit is provided with: a first conveying mechanism 2a; a first mark drawing part 51; In the imaging position, the substrate 9 on the first stage 21a is photographed; and the drawing head 41 is used to irradiate the substrate 9 on the first stage 21a with light; the second unit is provided with: a second conveying mechanism 2b; a second mark drawing part 52; the photographing head 31 is used to photograph the substrate 9 on the second stage 21b in the second photographing position; and the drawing head 41 is used to irradiate the substrate 9 on the second stage 21b with light.

在描繪裝置1中,除了設置有第一搬運機構2a以及第二搬運機構2b,亦可進一步設置有第三台以及用以將第三台於Y方向移動之第三移動機構,且並行地對第一台21a、第二台21b以及第三台上的基板9進行各種處理(對準處理、描繪處理以及基板9的搬出與搬入)。In the drawing device 1, in addition to the first conveyance mechanism 2a and the second conveyance mechanism 2b, a third table and a third moving mechanism for moving the third table in the Y direction may be further provided, and the parallel The substrates 9 on the first stage 21a, the second stage 21b, and the third stage are subjected to various processes (alignment processing, drawing processing, and carrying out and carrying in the substrates 9).

圖16係從(-Y)側觀看本發明的其他的較佳的描繪裝置1a之側視圖。在圖16中省略拍攝頭31以及第一高架部72等的圖示。在描繪裝置1a中,第一台21a以及第二台21b係鄰接地配置於上下方向。在圖16所示的例子中,第二台21b係隔開地配置於第一台21a的下側。第一移動機構22a係從側方(亦即(-X)側)支撐第一台21a。第二移動機構22b係從側方(亦即(+X)側)支撐第二台21b。Fig. 16 is a side view of another preferred drawing device 1a of the present invention viewed from the (-Y) side. In FIG. 16, illustration of the imaging head 31, the 1st overhead part 72, etc. is abbreviate|omitted. In the drawing apparatus 1a, the 1st stage 21a and the 2nd stage 21b are arrange|positioned adjacent to the up-down direction. In the example shown in FIG. 16, the 2nd stage 21b is arrange|positioned at the lower side of the 1st stage 21a so that it may be spaced apart. The first moving mechanism 22a supports the first stage 21a from the side (that is, the (-X) side). The second moving mechanism 22b supports the second table 21b from the side (that is, the (+X) side).

第一搬運機構2a係具備用以將第一台21a於上下方向移動之省略圖示的第一升降機構。第二搬運機構2b係具備用以將第二台21b於上下方向移動之省略圖示的第二升降機構。藉由被第二高架部73支撐的複數個描繪頭41對第一台21a上的基板9的上側的主表面進行圖案的描繪後,在對第二台21b上的基板9的上側的主表面進行圖案的描繪時,第一台21a係從圖16所示的狀態下降至圖中的第二台21b的位置,且第二台21b係上升至圖中的第一台21a的位置。描繪裝置1a的其他構成係與描繪裝置1中對應的構成略同樣。The 1st conveyance mechanism 2a is provided with the 1st lift mechanism which abbreviate|omitted illustration for moving the 1st stage 21a in the up-down direction. The 2nd conveyance mechanism 2b is provided with the 2nd lift mechanism which abbreviate|omitted illustration for moving the 2nd table 21b in the up-down direction. After the pattern is drawn on the main surface on the upper side of the substrate 9 on the first stage 21a by the plurality of drawing heads 41 supported by the second elevated portion 73, the main surface on the upper side of the substrate 9 on the second stage 21b is drawn. When drawing a pattern, the first stage 21a is lowered from the state shown in FIG. 16 to the position of the second stage 21b in the figure, and the second stage 21b is raised to the position of the first stage 21a in the figure. The other configurations of the rendering device 1 a are substantially the same as those of the rendering device 1 .

與上述描繪裝置1略同樣地,第一移動機構22a與第二移動機構22b係排列地配置於與基板移動方向(亦即Y方向)交叉的方向。在圖16所示的例子中,第一移動機構22a與第二移動機構22b係排列地配置於X方向,第二移動機構22b係鄰接於第一移動機構22a的(+X)側的側方。第一移動機構22a與第二移動機構22b係位於上下方向中的略相同的高度。Similar to the above-described drawing device 1, the first moving mechanism 22a and the second moving mechanism 22b are arranged in a row in a direction intersecting with the substrate moving direction (that is, the Y direction). In the example shown in FIG. 16 , the first moving mechanism 22a and the second moving mechanism 22b are arranged side by side in the X direction, and the second moving mechanism 22b is adjacent to the (+X) side of the first moving mechanism 22a. . The first moving mechanism 22a and the second moving mechanism 22b are located at approximately the same height in the vertical direction.

在描繪裝置1a中亦與描繪裝置1同樣地,對被保持於第一台21a之基板9的下側的主表面描繪有第一對準標記93,並對被保持於第二台21b之基板9的下側的主表面描繪有外觀與第一對準標記93不同的第二對準標記94。藉此,藉由觀察被描繪至基板9的另一方的主表面的對準標記的種類,能在比該圖案描繪還後續的工序中容易地判別在圖案描繪部4朝基板9的一方的主表面描繪圖案時是利用第一搬運機構2a以及第二搬運機構2b的哪一個。In the drawing apparatus 1a, like the drawing apparatus 1, first alignment marks 93 are drawn on the main surface of the lower side of the substrate 9 held on the first stage 21a, and on the substrate held on the second table 21b A second alignment mark 94 different in appearance from the first alignment mark 93 is drawn on the main surface of the lower side of 9 . Thereby, by observing the type of the alignment mark drawn on the other main surface of the substrate 9 , it is possible to easily discriminate the main alignment mark on the one side of the substrate 9 in the pattern drawing unit 4 in a process subsequent to the pattern drawing. Which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used when a pattern is drawn on the surface.

在上述例子中,雖然描繪系統係作為一台雙台型的描繪裝置1來說明,然而並未限定於此。例如,描繪系統亦可具備雙台型的兩台描繪裝置。在此情形中,一方的描繪裝置係具備上述第一搬運機構2a、上述第一標記描繪部51以及第一圖案描繪部,第一圖案描繪部係對第一台21a上的基板9的上側的主表面描繪圖案。此外,另一方的描繪裝置係具備上述第二搬運機構2b、上述第二標記描繪部52以及第二圖案描繪部,第二圖案描繪部係對第二台21b上的基板9的上側的主表面描繪圖案。第一圖案描繪部係具備一個或者兩個以上的上述描繪頭41。第二圖案描繪部亦同樣地具備一個或者兩個以上的上述描繪頭41。在該描繪系統中,將第一圖案描繪部與第二圖案描繪部結合而成為圖案描繪部4,圖案描繪部4係對在下方水平移動之基板9的上側的主表面照射光線並描繪圖案。In the above-mentioned example, although the drawing system was demonstrated as one double-stage drawing apparatus 1, it is not limited to this. For example, the drawing system may include two drawing apparatuses of a dual type. In this case, one of the drawing devices includes the first conveyance mechanism 2a, the first mark drawing unit 51, and the first pattern drawing unit, and the first pattern drawing unit is directed to the upper side of the substrate 9 on the first stage 21a. The main surface depicts the pattern. Moreover, the other drawing apparatus is provided with the said 2nd conveyance mechanism 2b, the said 2nd mark drawing part 52, and the 2nd pattern drawing part, and the 2nd pattern drawing part is provided with respect to the main surface of the upper side of the board|substrate 9 on the 2nd stage 21b. Draw patterns. The first pattern drawing unit includes one or two or more of the above-described drawing heads 41 . Similarly, the second pattern drawing unit includes one or two or more of the above-described drawing heads 41 . In this drawing system, the first pattern drawing unit and the second pattern drawing unit are combined to form the pattern drawing unit 4, and the pattern drawing unit 4 draws a pattern by irradiating light to the main surface of the upper side of the substrate 9 that moves horizontally below.

在該描繪系統中亦與上述描繪裝置1同樣地,對被保持於第一台21a之基板9的下側的主表面描繪有第一對準標記93,對被保持於第二台21b之基板9的下側的主表面描繪有外觀與第一對準標記93不同的第二對準標記94。藉此,藉由觀察被描繪至基板9的另一方的主表面的對準標記的種類,能在比該圖案描繪還後續的工序中容易地判別在圖案描繪部4朝基板9的一方的主表面描繪圖案時是利用第一搬運機構2a以及第二搬運機構2b的哪一個。In this drawing system, similarly to the above-described drawing apparatus 1, the first alignment mark 93 is drawn on the main surface of the lower side of the substrate 9 held on the first stage 21a, and the first alignment mark 93 is drawn on the main surface on the lower side of the substrate held on the second table 21b. A second alignment mark 94 different in appearance from the first alignment mark 93 is drawn on the main surface of the lower side of 9 . Thereby, by observing the type of the alignment mark drawn on the other main surface of the substrate 9 , it is possible to easily discriminate the main alignment mark on the one side of the substrate 9 in the pattern drawing unit 4 in a process subsequent to the pattern drawing. Which of the first conveyance mechanism 2a and the second conveyance mechanism 2b is used when a pattern is drawn on the surface.

上述基板9並未限定於印刷基板。在描繪裝置1、1a中,亦可進行例如半導體基板、液晶顯示裝置、有機EL顯示裝置等的平板面板(flat panel)顯示裝置用的玻璃基板、光罩用的玻璃基板、太陽電池面板用的基板等的位置檢測。The above-mentioned substrate 9 is not limited to a printed circuit board. In the drawing apparatuses 1 and 1a, for example, glass substrates for flat panel display devices such as semiconductor substrates, liquid crystal display devices, and organic EL display devices, glass substrates for photomasks, and solar cell panels can also be processed. Position detection of substrates, etc.

上述實施形態以及各變化例中的構成只要相互未矛盾則亦可適當地組合。The configurations in the above-described embodiment and each modification example may be appropriately combined as long as they do not contradict each other.

雖然已經詳細地描繪並說明本發明,然而這些說明是例示性的而非是限定性的。因此,只要未逸離本發明的範圍,則能夠認為有多種變化以及態樣。While the invention has been depicted and described in detail, these descriptions are intended to be illustrative and not restrictive. Therefore, various changes and aspects can be considered as long as they do not deviate from the scope of the present invention.

1,1a:描繪裝置 2a:第一搬運機構 2b:第二搬運機構 3:拍攝部 4:圖案描繪部 7:框架 9:基板 10:控制部 21a:第一台 21b:第二台 22a:第一移動機構 22b:第二移動機構 31:拍攝頭 32:拍攝頭移動機構 41:描繪頭 42:描繪頭移動機構 51:第一標記描繪部 52:第二標記描繪部 71:基台 72:第一高架部 73:第二高架部 74:高架部 91:第一主表面 92:第二主表面 93:第一對準標記 94:第二對準標記 100:電腦 101:處理器 102:記憶體 103:輸入輸出部 104:匯流排 105:鍵盤 106:滑鼠 107:顯示器 111:記憶部 112:拍攝控制部 113:檢測部 114:描繪控制部 211a,211b:凹部 221a:導軌 511:第一標誌 512:第一光源 513:第一光學系統 514:第一光圈 521:第二標誌 522:第二光源 523:第二光學系統 524:第二光圈 931:第一標記要素 941:第二標記要素 1,1a: Drawing device 2a: The first conveying mechanism 2b: Second conveying mechanism 3: Filming Department 4: Pattern drawing department 7: Frame 9: Substrate 10: Control Department 21a: The first 21b: Second unit 22a: First moving mechanism 22b: Second moving mechanism 31: Shooting head 32: Shooting head moving mechanism 41: Depicting the Head 42: Depicting the Head Movement Mechanism 51: The first mark drawing part 52: The second mark drawing part 71: Abutment 72: First Elevated Department 73: Second Elevated Section 74: Elevated Department 91: First main surface 92: Second main surface 93: First alignment mark 94: Second alignment mark 100: Computer 101: Processor 102: Memory 103: Input and output section 104: Busbar 105: Keyboard 106: Mouse 107: Display 111: Memory Department 112: Shooting Control Department 113: Inspection Department 114: Drawing Control Department 211a, 211b: Recess 221a: Rails 511: First sign 512: The first light source 513: First Optical System 514: First aperture 521: Second sign 522: Second light source 523: Second Optical System 524: second aperture 931: First Mark Element 941: Second Marking Element

[圖1]係顯示本發明的實施形態之一的描繪裝置的立體圖。 [圖2]係顯示第一台以及第二台的一部分之俯視圖。 [圖3]係顯示第一標誌(marker)之縱剖視圖。 [圖4]係顯示第二標誌之縱剖視圖。 [圖5]係顯示第一對準標記之仰視圖。 [圖6]係顯示第二對準標記之仰視圖。 [圖7]係顯示電腦的構成之圖。 [圖8]係顯示控制部的功能之方塊圖。 [圖9A]係顯示描繪處理的流程之圖。 [圖9B]係顯示描繪處理的流程之圖。 [圖10]係顯示第一台以及第二台的位置之圖。 [圖11]係顯示第一台以及第二台的位置之圖。 [圖12]係顯示第一台以及第二台的位置之圖。 [圖13]係顯示第一台以及第二台的位置之圖。 [圖14]係顯示第一台以及第二台的位置之圖。 [圖15]係顯示第一台以及第二台的位置之圖。 [圖16]係顯示描繪裝置的其他例子之側視圖。 1 is a perspective view showing a drawing device according to one embodiment of the present invention. [Fig. 2] is a plan view showing a part of the first stage and the second stage. [ FIG. 3 ] A longitudinal cross-sectional view showing a first marker. [FIG. 4] A longitudinal sectional view showing the second mark. [Fig. 5] is a bottom view showing the first alignment mark. [Fig. 6] is a bottom view showing the second alignment mark. [Fig. 7] is a diagram showing the configuration of a computer. [Fig. 8] is a block diagram showing the function of the control unit. [ FIG. 9A ] A diagram showing the flow of the drawing process. [ FIG. 9B ] A diagram showing the flow of the drawing process. [Fig. 10] is a diagram showing the positions of the first stage and the second stage. [Fig. 11] is a diagram showing the positions of the first stage and the second stage. [Fig. 12] is a diagram showing the positions of the first stage and the second stage. [Fig. 13] is a diagram showing the positions of the first stage and the second stage. [Fig. 14] is a diagram showing the positions of the first stage and the second stage. [Fig. 15] is a diagram showing the positions of the first stage and the second stage. [ Fig. 16 ] It is a side view showing another example of the drawing device.

1:描繪裝置 1: Drawing device

2a:第一搬運機構 2a: The first conveying mechanism

2b:第二搬運機構 2b: Second conveying mechanism

3:拍攝部 3: Filming Department

4:圖案描繪部 4: Pattern drawing department

7:框架 7: Frame

9:基板 9: Substrate

10:控制部 10: Control Department

21a:第一台 21a: The first

21b:第二台 21b: Second unit

22a:第一移動機構 22a: First moving mechanism

22b:第二移動機構 22b: Second moving mechanism

31:拍攝頭 31: Shooting head

32:拍攝頭移動機構 32: Shooting head moving mechanism

41:描繪頭 41: Depicting the Head

42:描繪頭移動機構 42: Depicting the Head Movement Mechanism

71:基台 71: Abutment

72:第一高架部 72: First Elevated Department

73:第二高架部 73: Second Elevated Section

74:高架部 74: Elevated Department

91:第一主表面 91: First main surface

92:第二主表面 92: Second main surface

211b:凹部 211b: Recess

221a:導軌 221a: Rails

Claims (6)

一種描繪系統,係對基板進行描繪,並具備: 圖案描繪部,係對在下方水平移動之基板的上側的主表面照射光線並描繪圖案; 第一搬運機構,係具備第一基板保持部以及第一移動機構,前述第一移動機構係在前述圖案描繪部的下方水平移動前述第一基板保持部; 第一標記描繪部,係對被保持於前述第一基板保持部之基板的下側的主表面照射光線,並描繪被賦予關連至前述第一搬運機構的第一對準標記; 第二搬運機構,係具備第二基板保持部以及第二移動機構,前述第二移動機構係在前述圖案描繪部的下方水平移動前述第二基板保持部;以及 第二標記描繪部,係對被保持於前述第二基板保持部之基板的下側的主表面照射光線,並描繪外觀與前述第一對準標記不同且被賦予關連至前述第二搬運機構的第二對準標記。 A drawing system for drawing a substrate and having: The pattern drawing part irradiates light to the main surface of the upper side of the substrate that moves horizontally below and draws a pattern; a first conveying mechanism including a first substrate holding portion and a first moving mechanism, wherein the first moving mechanism horizontally moves the first substrate holding portion below the pattern drawing portion; a first mark drawing part for irradiating light to the main surface of the lower side of the substrate held by the first substrate holding part, and drawing a first alignment mark attached to the first conveying mechanism; a second conveying mechanism including a second substrate holding portion and a second moving mechanism, wherein the second moving mechanism horizontally moves the second substrate holding portion below the pattern drawing portion; and The second mark drawing portion irradiates light to the main surface of the lower side of the substrate held by the second substrate holding portion, and draws a different appearance from the first alignment mark and is assigned to the second conveyance mechanism. Second alignment mark. 如請求項1所記載之描繪系統,其中進一步具備: 記憶部,係預先記憶第一位置關係資訊以及第二位置關係資訊,前述第一位置關係資訊係顯示藉由前述圖案描繪部描繪至被前述第一搬運機構搬運之基板的上側的主表面之圖案與藉由前述第一標記描繪部描繪至被前述第一搬運機構搬運之基板的下側的主表面之前述第一對準標記之間的相對性的位置關係,前述第二位置關係資訊係顯示藉由前述圖案描繪部描繪至被前述第二搬運機構搬運之基板的上側的主表面之圖案與藉由前述第二標記描繪部描繪至被前述第二搬運機構搬運之基板的下側的主表面之前述第二對準標記之間的相對性的位置關係;以及 描繪控制部,係控制前述圖案描繪部; 前述描繪控制部係在前述圖案描繪部對被描繪有前述第一對準標記的主表面進行圖案的描繪時,基於前述第一位置關係資訊調節描繪位置; 前述描繪控制部係在前述圖案描繪部對被描繪有前述第二對準標記的主表面進行圖案的描繪時,基於前述第二位置關係資訊調節描繪位置。 The rendering system as described in claim 1, further comprising: The memory part stores first positional relationship information and second positional relationship information in advance, and the first positional relationship information displays the pattern drawn by the pattern drawing part on the main surface of the upper side of the substrate conveyed by the first conveying mechanism The relative positional relationship with the first alignment marks drawn by the first mark drawing section to the main surface of the lower side of the substrate conveyed by the first conveyance mechanism, the second positional relationship information is displayed The pattern drawn by the pattern drawing unit on the main surface of the upper side of the substrate conveyed by the second conveying mechanism and the pattern drawn by the second mark drawing unit on the main surface of the lower side of the substrate conveyed by the second conveying mechanism the relative positional relationship between the aforementioned second alignment marks; and a drawing control unit that controls the pattern drawing unit; The drawing control unit adjusts the drawing position based on the first positional relationship information when the pattern drawing unit draws a pattern on the main surface on which the first alignment mark is drawn; The drawing control unit adjusts the drawing position based on the second positional relationship information when the pattern drawing unit draws a pattern on the main surface on which the second alignment mark is drawn. 如請求項1所記載之描繪系統,其中前述第一標記描繪部係具備:第一遮罩部,係使來自光源的光線的一部分通過; 前述第二標記描繪部係具備:第二遮罩部,係具有與前述第一遮罩部不同的開口,用以使來自光源的光線的一部分通過。 The drawing system according to claim 1, wherein the first mark drawing unit includes: a first shield unit that allows a part of the light from the light source to pass therethrough; The said second mark drawing part is equipped with the 2nd shield part which has the opening different from the said 1st shield part, and lets a part of the light rays from a light source pass through. 如請求項1所記載之描繪系統,其中前述第一對準標記以及前述第二對準標記為非相似形狀。The drawing system according to claim 1, wherein the first alignment mark and the second alignment mark are non-similar shapes. 如請求項1所記載之描繪系統,其中前述第一對準標記為用以顯示與前述第一搬運機構相關的資訊之條碼; 前述第二對準標記為用以顯示與前述第二搬運機構相關的資訊之條碼。 The drawing system according to claim 1, wherein the first alignment mark is a barcode for displaying information related to the first conveying mechanism; The second alignment mark is a bar code for displaying information related to the second conveying mechanism. 如請求項1至5中任一項所記載之描繪系統,其中前述圖案描繪部係具備: 描繪頭,係朝向下方照射光線;以及 描繪頭移動機構,係使前述描繪頭在前述第一搬運機構的上方的第一描繪位置與前述第二搬運機構的上方的第二描繪位置之間移動。 The drawing system as described in any one of claims 1 to 5, wherein the pattern drawing unit includes: a delineation head, which shines light downward; and The drawing head moving mechanism moves the drawing head between a first drawing position above the first conveying mechanism and a second drawing position above the second conveying mechanism.
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