TWI775515B - Position detection device, drawing system and position detection method - Google Patents

Abstract

In a position detection device, a partial image extraction part (114) obtains design positions of a plurality of marks in an upper surface image based on a design information of the plurality of marks. Then, the partial image extraction part (114) sets an extraction region having a predetermined size centered on the design position of each mark on the upper surface image, and extracts an image of the extraction region as a partial image from the upper surface image. A mark search part (115) searches for marks in the partial image corresponding to each mark. A position calculation part (116) obtains the position of the mark on a substrate for each mark based on the position of the mark detected in the partial image. As a result, the time required to detect the positions of the plurality of marks on the substrate can be shortened.

Description

Position detection device, drawing system, and position detection method

The present invention relates to a technique for detecting the position of a mark on a substrate. [Reference to related applications] This application claims the right of priority based on Japanese Patent Application JP2020-124986 filed on July 22, 2020, and the entire disclosure of Japanese Patent Application JP2020-124986 is incorporated herein by reference.

Conventionally, a pattern has been drawn by irradiating light to a photosensitive material formed on a semiconductor substrate, a printed circuit board, a glass substrate for a plasma display device, or a glass substrate for a liquid crystal display device (hereinafter referred to as a "substrate"). In the drawing apparatus for performing such drawing, a plurality of alignment marks provided on the substrate are sequentially photographed, and an alignment process for automatically adjusting the drawing position of the pattern is performed based on the photographed result.

For example, Japanese Patent Application Laid-Open No. 2000-173914 (Document 1) discloses a technique in which a joystick or the like is used when an error in which an alignment mark is not detected occurs in an alignment process of a substrate. Manually move the capture area on the substrate (ie, the area displayed on the screen) and search for alignment marks, and continue the alignment process using the discovered alignment marks (ie, the alignment marks already displayed on the screen). In addition, in the semiconductor manufacturing apparatus of Document 1, the movement locus of the imaging area during the search is drawn on a console screen different from the screen screen, thereby suppressing duplication of search sites, etc., and improving the efficiency of alignment mark search. change.

In the semiconductor exposure apparatus of Japanese Patent Laid-Open No. 2004-158741 (Document 2), a camera moves around the position of the alignment mark on the substrate and simultaneously acquires two types of images with different magnifications. At this time, in the case where the alignment mark does not exist in the high-magnification image, the method for moving the camera so that the alignment mark is detected in the low-magnification image and the alignment mark is included in the high-magnification image is obtained. Movement distance in the X and Y directions. Next, after the movement of the camera and the shooting, alignment processing is performed using the alignment marks included in the high-magnification image.

In the alignment processing of the above-mentioned documents 1 and 2, an area camera (area camera) for imaging an imaging area of a predetermined size is used. On the other hand, Japanese Patent Laid-Open No. 2010-245330 (Document 3) proposes a technique of using TDI (Time Delay Integration; Time Delay Integration) when measuring alignment marks on a wafer with a photo sensor. delay integration) sensor as a light sensor.

Here, in the alignment process using the area camera as in Documents 1 and 2, when no mark is detected in the captured image, it is necessary to repeatedly move the camera or the stage to acquire a plurality of images. image until a marker is detected. In this case, the acceleration/deceleration time during the movement of the camera and the like, and the stabilization period until the slight vibration after the movement is stopped is required, and the time required for image acquisition becomes long. In addition, when the number of pixels of a captured image increases, the capacity of the image data increases, and the time required for detection of an alignment mark from the image also increases.

On the other hand, in the case of photographing the entire wafer with a TDI sensor and detecting alignment marks from the photographed image as in Document 3, since the capacity of the image data becomes very large, the amount of data from the image becomes very large. The time required for the detection of the alignment marks becomes longer.

The present invention focuses on a position detection device for detecting the position of a mark on a substrate, and aims to shorten the time required for position detection of the mark.

In a preferred aspect of the present invention, the position detection device includes: a stage for holding a substrate; an imaging unit for capturing an image of the upper surface of the substrate with a line camera; and a moving mechanism for moving the stage relative to the inline camera in a direction parallel to the upper surface of the substrate; the photographing control unit controls the inline camera and the moving mechanism, thereby acquiring an image of the upper surface, the upper surface The image is an image of the upper surface of the substrate; and the detection unit detects the positions of a plurality of marks provided on the upper surface of the substrate in the upper surface image. The detection unit includes a partial image extraction unit that obtains the design positions of the plurality of marks in the upper surface image based on the design information of the plurality of marks, and takes the design positions of the respective marks as a center. An extraction area of a predetermined size is set on the upper surface image, and the image of the extraction area is extracted from the upper surface image as a partial image; the mark search unit is linked to the partial image corresponding to each of the marks a search mark in the image; and a position calculation unit for obtaining the position of the mark on the substrate for each of the marks based on the position of the mark detected in the partial image.

According to the aforementioned position detection device, the time required for the position detection of the mark can be shortened.

Preferably, in the case where the marker is not detected in the partial image, the partial image extracting section enlarges the extraction area and extracts a new partial image, and the marker search section is based on the new partial image. Explore the aforementioned markers in .

Preferably, the enlargement of the extraction region for the partial image extraction unit is performed with the design position as the center.

Preferably, the magnification of the extraction region in which the partial image extraction portion is formed is 5% or more and 40% or less.

Preferably, even if the extraction of the new partial image by the partial image extraction unit and the search for the marker in the new partial image by the marker search unit are repeated a predetermined number of times, the marker cannot be found in the new partial image. In the case where the aforementioned marker is detected in a part of the image, an error code is assigned to the aforementioned marker and the search for the aforementioned marker is terminated.

Preferably, a plurality of unit regions are set on the upper surface of the substrate, and the plurality of the unit regions extend perpendicularly in a direction corresponding to the longitudinal direction of the in-line camera; In parallel with the image acquisition of one unit area, the detection unit performs detection of markers in the other unit areas where the image acquisition has been completed.

Preferably, the in-line camera is a time delay integral camera.

The present invention is also directed to a rendering system. A drawing system according to a preferred aspect of the present invention includes: the position detection device; and a drawing device that scans the substrate based on the positions of the plurality of marks on the substrate detected by the position detection device. Irradiate the light and draw the pattern.

The present invention also focuses on a position detection method for detecting the position of a mark on a substrate. A preferred aspect of the position detection method of the present invention includes: step a: while the substrate is relatively moved relative to the inline camera in a direction parallel to the upper surface, the inline camera acquires an upper surface image, the upper surface image is an image of the upper surface of the substrate; and step b, is to detect the positions of a plurality of marks disposed on the upper surface of the substrate in the upper surface image. The aforementioned step b includes: step b1, based on the design information of a plurality of the aforementioned marks to obtain the design positions of a plurality of the aforementioned marks in the above-mentioned upper surface image; step b2, the aforementioned design position of each aforementioned mark is taken as the center The extraction area of the predetermined size is set on the above-mentioned upper surface image, and the image of the above-mentioned extraction area is extracted from the above-mentioned upper surface image as a partial image; Step b3, tied to the above-mentioned partial image corresponding to each of the above-mentioned marks searching for marks in the image; and step b4 of obtaining the positions of the marks on the substrate for each of the marks based on the positions of the marks detected in the step b3.

Preferably, the aforementioned step b is in the case where the aforementioned mark is not detected in the aforementioned step b3, further comprising: step b5, before the aforementioned step b4, zooming in on the aforementioned extraction area corresponding to the aforementioned marker and drawing from the aforementioned upper surface. like extracting a new partial image; and step b6, searching for the aforementioned mark in the aforementioned new partial image.

Preferably, the enlargement of the extraction area in the step b5 is performed with the design position as the center.

Preferably, the magnification of the extraction region in the aforementioned step b5 is 5% or more and 40% or less.

Preferably, in the case where the marker cannot be detected in the new partial image even after repeating the aforementioned steps b5 and b6 for a predetermined number of times, an error code is assigned to the aforementioned marker and the search for the aforementioned marker is ended.

Preferably, a plurality of unit regions are set on the upper surface of the substrate, and the plurality of the unit regions extend perpendicular to the direction corresponding to the longitudinal direction of the line camera; The image acquisition of one unit area is performed in parallel with the detection of markers in the other unit areas where the image acquisition included in the aforementioned step b has been completed.

Preferably, the in-line camera is a time delay integral camera.

The above object and other objects, features, aspects, and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings.

FIG. 1 is a diagram schematically showing the configuration of a drawing system 7 according to one embodiment of the present invention. The drawing system 7 includes a position detection device 1 , a drawing device 4 , and a transfer robot 71 . The position detection device 1 is a device for detecting the position of a mark such as an alignment mark on a substrate. The drawing apparatus 4 is an apparatus for irradiating light to a board|substrate and drawing a pattern. The transfer robot 71 is a robot for transferring the substrate between the position detection device 1 and the drawing device 4 . The transfer robot 71 includes, for example, a robot hand capable of advancing and retreating with respect to the position detection device 1 and the drawing device 4 .

FIG. 2 is a perspective view showing the position detection device 1 . In FIG. 2 , three directions orthogonal to each other are shown by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 2 , the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is the vertical direction. The same applies to FIG. 16 to be described later.

FIG. 3 is a top view of the display substrate 9 . The substrate 9 is, for example, a substantially rectangular plate-like member in plan view. The board 9 is, for example, a printed wiring board. On the main surface on the (+Z) side of the substrate 9 (hereinafter, also referred to as “upper surface 91 ”), a plurality of marks 93 arranged in a roughly lattice shape are provided. In the example shown in FIG. 3, the mark 93 is a substantially cross-shaped alignment mark. In addition, on the upper surface 91 of the substrate 9, a resist film formed of a photosensitive material is provided on the copper layer. In the drawing system 7 , the position of each of the plurality of marks 93 on the substrate 9 is detected by the position detection device 1 . In addition, a circuit pattern is drawn on the resist film of the substrate 9 by the drawing device 4 . In addition, the type, shape, and the like of the substrate 9 may be changed to various types, shapes, and the like.

In the substrate 9 illustrated in FIG. 3 , a plurality of substantially rectangular substrate elements 94 are arranged in a matrix form, and the plurality of substantially rectangular substrate elements 94 are arranged after the processing of the substrate 9 by the drawing system 7 are divided in steps. In each board element 94, four marks 93 are arranged at four corners. The four marks 93 are used to obtain the position and shape of the board element 94 . In FIG. 3 , the mark 93 is drawn larger than the actual number, and the number of the board elements 94 and the mark 93 is drawn smaller than the actual number. The actual number of marks 93 provided on the substrate 9 is, for example, several thousands to tens of thousands.

As shown in FIG. 2 , the position detection device 1 includes a stage 21 , a stage moving mechanism 22 , an imaging unit 3 , and a control unit 10 . The control unit 10 is the console moving mechanism 22, the imaging unit 3, and the like. The stage 21 is a substantially flat holding portion for holding the substrate 9 in a horizontal state from the lower side below the imaging portion 3 (that is, on the (−Z) side). The upper surface 91 of the substrate 9 placed on the stage 21 is substantially perpendicular to the Z direction, and is substantially parallel to the X direction and the Y direction.

The stage moving mechanism 22 is a moving mechanism for relatively moving the stage 21 in a horizontal direction (ie, a direction slightly parallel to the upper surface 91 of the substrate 9 ) relative to the imaging unit 3 . The stage moving mechanism 22 includes a first moving mechanism 23 and a second moving mechanism 24 . The second moving mechanism 24 linearly moves the stage 21 in the X direction along a guide rail. The first moving mechanism 23 linearly moves the stage 21 in the Y direction along the guide rail together with the second moving mechanism 24 . The drive source of the first moving mechanism 23 and the second moving mechanism 24 is, for example, a linear servo motor or a drive source in which a motor is mounted on a ball screw. The structures of the first moving mechanism 23 and the second moving mechanism 24 may be changed to various structures.

The position detection device 1 may be provided with a table rotation mechanism, and the table rotation mechanism uses a rotation shaft extending in the Z direction as the center rotation table 21 . In addition, the position detection device 1 may also be provided with a stage elevating mechanism, and the stage elevating mechanism is used to move the stage 21 in the Z direction. As the table rotation mechanism, for example, a servo motor can be used. As the table elevating mechanism, for example, a linear servo motor can be used.

The imaging unit 3 includes a plurality of (two in the example shown in FIG. 2 ) heads 31 arranged in the X direction. Each of the heads 31 is supported above the table 21 by a head support portion 30 provided across the table 21 . Of the two heads 31 , one head 31 is fixed to the head support portion 30 , and the other head 31 is movable in the X direction on the head support portion 30 . Thereby, the distance in the X direction between the two heads 31 can be changed. In addition, the number of the heads 31 of the imaging unit 3 may be one, or three or more.

Each of the heads 31 is an inline camera, and includes an imaging sensor 32 and an optical system 33 . In each head 31 , illumination light from a light source (not shown) provided on the side of the optical system 33 is guided by the optical system 33 to an imaging area on the upper surface 91 of the substrate 9 . As the above-mentioned light source, various light sources such as LED (Light Emitting Diode) can be used. The above-mentioned imaging area is a substantially linear area extending parallel to the X direction. The reflected light from the photographing area is guided toward the photographing sensor 32 via the optical system 33 . The imaging sensor 32 receives the reflected light from the above-mentioned imaging area and acquires an image of the substantially linear imaging area. Each head 31 is provided with an elevating mechanism (not shown), and the elevating mechanism moves the imaging sensor 32 and the optical system 33 independently of each other in the vertical direction. As the elevating mechanism, various mechanisms such as a linear servo motor can be used.

In this embodiment, the photographing sensor 32 is a time delay integration (TDI) sensor. In other words, each head 31 is a time delay integration camera (ie, a TDI camera). In the imaging sensor 32, a plurality of elements such as a CCD (Charge Coupled Device) (hereinafter also referred to as a "element row") and other elements are arranged corresponding to the longitudinal direction of the above-mentioned linear imaging area. The arrangement direction is arranged in a row, and a plurality of CCDs in a plurality of rows are arranged in a direction perpendicular to the arrangement direction. In the following description, the arrangement direction of the plurality of elements in the above-mentioned element row is also referred to as the longitudinal direction of the imaging sensor 32 of the head 31 . The aforementioned longitudinal direction of the imaging sensor 32 corresponds to the X direction of the position detection device 1 . In the photographing sensor 32, photographing results by each element row are integrated for one photographing area. Thereby, the above-mentioned imaging area can be imaged with high sensitivity. Each head 31 may also be provided with a duct or the like for promoting heat dissipation of the imaging sensor 32 .

In the position detection device 1 , the imaging area linearly extending in the X direction on the upper surface 91 of the substrate 9 is imaged by the respective heads 31 of the imaging unit 3 , and the first moving mechanism 23 of the stage moving mechanism 22 transfers the image to the imaging area. The substrate 9 moves in the Y direction. Thereby, the imaging area of each head 31 is scanned in the Y direction on the substrate 9, thereby acquiring a substantially rectangular strip-shaped image (hereinafter also referred to as "unit image") extending in the Y direction on the substrate 9. In the position detection device 1 illustrated in FIG. 2 , two unit images (so-called swath images) separated in the X direction are acquired in parallel by the two heads 31 . In FIG. 3 , an area corresponding to one unit image acquired by one of the heads 31 (hereinafter also referred to as “unit area 95 ”) is displayed by a two-dotted chain line. The unit area 95 includes a plurality of marks 93 arranged in the Y direction.

At the time of acquisition of the unit image, the movement of the stage 21 in the Y direction by the first movement mechanism 23 is continued at a constant speed and does not stop in the middle. Thereby, it is possible to omit the waiting time for imaging due to repeated movement of the stage 21, acceleration and deceleration at the time of stop, and the like, so that acquisition of a unit image can be accelerated. In the following description, the Y direction is also referred to as a "scanning direction", and the X direction is also referred to as a "width direction". The first moving mechanism 23 is a scanning mechanism, and is used to move the imaging area of each head 31 on the substrate 9 in the scanning direction.

In the position detection device 1 illustrated in FIG. 2 , the imaging of the substrate 9 is performed by a so-called multi-pass method. Specifically, a plurality of unit areas 95 extending in the Y direction are set on the upper surface 91 of the substrate 9 (see FIG. 3 ), and when the imaging of one unit area 95 for each head 31 is completed (that is, the image capturing of the unit image is completed) acquisition), the stage 21 is moved in the X direction by a predetermined distance (for example, a distance slightly smaller than the width of the unit area 95 in the X direction) by the second movement mechanism 24 of the stage movement mechanism 22 . Next, the substrate 9 is moved in the Y direction by the first moving mechanism 23 while imaging by the respective heads 31 , thereby acquiring a unit image of the unit area 95 adjacent to the unit area 95 after the image acquisition has been completed. Next, the step shift of the stage 21 in the X direction and the acquisition of the unit image are repeated to acquire an image of the entire imaging range on the upper surface 91 of the substrate 9 (hereinafter also referred to as "upper surface image"). ”). The upper surface image is an almost entire image of the upper surface 91 of the substrate 9 . In addition, in the position detection device 1, the imaging of the substrate 9 can also be performed by a single pass method (that is, a one-pass method), and the single-pass method is only one pass in the Y direction by the stage 21. moves to obtain an image of the entire above-mentioned shooting range.

FIG. 4 is a diagram showing the configuration of the computer 100 included in the control unit 10 . The computer 100 is a general computer including a processor 101 , a memory 102 , an input/output unit 103 , and a bus 104 . The bus bar 104 is a signal circuit for connecting the processor 101 , the memory 102 and the input/output part 103 . The memory 102 stores programs and various kinds of information. The processor 101 executes various processing (for example, numerical calculation, image processing) while using the memory 102 and the like in accordance with a program or the like stored in the memory 102 . The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from the operator, and a display 107 for displaying output from the processor 101 and the like. In addition, the control unit 10 may be a programmable logic controller (PLC; Programmable Logic Controller), a circuit board, or the like, and may be a combination of these components and one or more computers.

FIG. 5 is a block diagram showing the functions of the control unit 10 realized by the computer 100 . In FIG. 5 , configurations other than the control unit 10 are also shown together. The control unit 10 includes a memory unit 111 , an imaging control unit 112 , and a detection unit 113 . The detection unit 113 includes a partial image extraction unit 114 , a marker search unit 115 , and a position calculation unit 116 . The memory unit 111 is mainly realized by the memory 102 , and preliminarily stores various information such as the position of the unit area 95 on the substrate 9 and a template used for pattern matching to be described later.

The imaging control unit 112 , the detection unit 113 , the partial image extraction unit 114 , the marker search unit 115 , and the position calculation unit 116 are mainly realized by the processor 101 . The imaging control unit 112 controls each of the heads 31 and the stage moving mechanism 22 (see FIG. 2 ) of the imaging unit 3 to acquire an upper surface image, which is an image of the upper surface 91 of the substrate 9 , as described above. . The upper surface image is sent to the detection unit 113 . The detection unit 113 detects the positions of a plurality of marks (see FIG. 3 ) provided on the upper surface 91 of the substrate 9 on the upper surface image. The functions of the partial image extraction unit 114 , the marker search unit 115 , and the position calculation unit 116 will be described later.

Next, the flow of position detection on the substrate 9 of the plurality of marks 93 by the detection unit 113 will be described with reference to FIGS. 6 and 7 . When the position of the mark 93 is detected, first, the image of the upper surface of the substrate 9 is acquired as described above (step S11). Next, the positions of the plurality of marks 93 are detected in the upper surface image (step S12). In the present embodiment, the position detection of the plurality of marks 93 included in the acquired unit image is performed in parallel with the imaging of one unit area 95 by each head 31 (that is, the acquisition of one unit image). In other words, in the position detection device 1, the position detection of the marker 93 in step S12 is performed in parallel with the acquisition of the upper surface image in step S11. In addition, in the position detection device 1, the position detection of the plural marks 93 included in each unit image may be performed after the entire upper surface is acquired.

FIG. 7 is a diagram showing a detailed flow of the position detection of the marker 93 in one unit image (ie, a part of the upper surface image) in step S12. FIG. 8 is a diagram showing a part of one unit image 81 in an enlarged manner. When detecting the positions of the plurality of marks 93 in the unit image 81, first, based on the design information of the plurality of marks 93, the partial image extraction unit 114 obtains each of the plurality of marks 93 in the unit image 81. design position (step S21). This design position is shown in FIG. 8 with a cross attached with reference numeral 930 . The design position 930 of the mark 93 refers to the position of the center of the mark 93 in an ideal state in which the mark 93 is formed on the substrate 9 according to the design information and the substrate 9 is not deformed such as strain.

Next, an extraction area 82 of a predetermined size with the design position 930 of each mark 93 as the approximate center is set on the unit image 81 by the partial image extraction unit 114 . In the example shown in FIG. 8, the shape of each extraction area|region 82 is an approximate square with the design position 930 as a center. Each edge of the extraction region 82 is slightly parallel to the X direction or the Y direction. The plurality of extraction regions 82 set on the unit image 81 have the same shape. In the case where the mark 93 is located at the design position 930 , the size of the extraction area 82 is the size including the entirety of the mark 93 . In addition, when the other mark 93 is located at the other design position 930 adjacent to the design position 930, the extraction area 82 is set so as to include a part of the other mark 93 but not include the whole of the other mark 93. size. In addition, the extraction area 82 is preferably set to a size that does not include the other marks 93 located at the adjacent other design positions 930 at all.

The length of one side of the extraction area 82 is preferably 1.2 to 3 times, more preferably 1.5 to 2.5 times, the length of one side of the virtual square circumscribed by the mark 93 . The size of the extraction region 82 is not limited to the above-mentioned range, and may be appropriately changed. The length of one side of the extraction region 82 is, for example, 200 pixels. In addition, the shape of the extraction area|region 82 is not limited to a square, It can change into various shapes, such as a substantially rectangular shape. In addition, the extraction area 82 does not need to be set strictly with the design position 930 (ie, the intersection of the cross in FIG. 8 ) as the center, but only needs to be set substantially with the design position 930 as the center.

Next, the partial image extraction unit 114 uses the image of each extraction area 82 belonging to a part of the unit image 81 (that is, the image in the square frame surrounding the extraction area 82 ) from the unit image 81 as a partial image image extraction (step S22). Since the partial image is obtained by cutting out a part of the unit image 81 (that is, a part of the image data of the unit image 81 ), the resolution of the partial image is the same as that of the unit image 81 . .

FIG. 9 is a partial image 83 corresponding to the uppermost extraction area 82 in FIG. 8 . FIG. 10 is a partial image 83 corresponding to the lowermost extraction region 82 in FIG. 8 . In the example shown in FIG. 9 , the marker 93 is located approximately at the design position 930 , and the entirety of the marker 93 is included in the partial image 83 . On the other hand, in the example shown in FIG. 10 , the marker 93 is largely shifted to the side from the design position 930 , and only a part of the marker 93 is included in the partial image 83 , and other parts of the marker 93 are included. is located outside the partial image 83 .

When the extraction of the partial images 83 in step S22 is completed, the marker 93 is searched for in the partial images 83 corresponding to the respective markers 93 by the marker search unit 115 (step S23 ). The search for the marker 93 in the partial image 83 is performed, for example, by pattern matching using a template (ie, an image of the marker 93 serving as a reference). The pattern matching is performed by a known pattern matching method (eg, geometric shape pattern matching, normalized correlation search, etc.).

As shown in FIG. 9 , when the partial image 83 includes the entire marker 93 , the marker 93 is detected by the marker search unit 115 (step S24 ), and the position of the marker 93 in the partial image 83 is acquired. The position of the marker 93 in the partial image 83 is sent from the marker search unit 115 to the position calculation unit 116 . In the position calculation unit 116, based on the position of the mark 93 in the partial image 83 and the position of the partial image 83 in the upper surface image (that is, the design position 930 belonging to the center of the partial image 83 on the substrate 9) position), the position of the mark 93 on the substrate 9 (that is, the absolute position of the mark 93) is obtained (step S25).

On the other hand, as shown in FIG. 10, when the partial image 83 includes only a part of the marker 93, the marker 93 cannot be detected by the marker search unit 115 (step S24). In this case, the extraction area 82 corresponding to the mark 93 is enlarged by the partial image extraction unit 114 as shown in FIG. 11 . In the example shown in FIG. 11, the enlargement of the extraction area|region 82 is performed substantially centering on the design position 930. In the unit image 81 of FIG. 11 , the extraction area 82 before enlargement is displayed by a two-dot chain line, and the extraction area 82 after the enlargement is displayed by a solid line (the same is true in FIG. 13 ).

Specifically, each side of the extraction region 82 is extended to a length corresponding to 10% of each side in the initial state shown in FIG. 8 . In other words, the magnification of the extraction region 82 is 10%. In the present embodiment, the extraction area 82 which is a square with each side of 200 pixels in the initial state is enlarged into a square with each side of 220 pixels. In addition, the magnification of the extraction area 82 refers to the magnification in the X direction and the magnification in the Y direction of the extraction area 82 . When the magnifications in the X direction and the Y direction of the extraction area 82 are different, the average of the two magnifications is used as the magnification of the extraction area 82 . The magnification of the extraction region 82 is not limited to 10%, and can be changed to various magnifications. The magnification of the extraction region 82 is, for example, 5% or more and 40% or less, and preferably 5% or more and 20% or less.

Next, as shown in FIG. 12, the image of the enlarged extraction area 82 is extracted from the unit image 81 as a new partial image 83 by the partial image extraction unit 114 (step S26). In FIG. 12 , the outline of the partial image 83 corresponding to the extraction region 82 before enlargement is shown by a two-dot chain line (the same is true in FIG. 14 ). Like the original partial image 83 , the resolution of the new partial image 83 is the same as that of the unit image 81 . When step S26 ends, the marker 93 is searched for in the new partial image 83 by the marker search unit 115 (step S27), and the process returns to step S24. In addition, the search for the mark 93 in step S27 may be performed for the whole of the new partial image 83 , or may be performed only for the outer peripheral portion of the new partial image 83 . The outer periphery of the new partial image 83 refers to a rectangular frame (ie, a square frame or a rectangular frame) area extending from the outer edge of the new partial image 83 to the inner side. The width of the rectangular frame-shaped region is set to be twice or more than one side of the virtual square circumscribed by the mark 93 .

Even in the example shown in FIG. 12, since only a part of the marker 93 is included in the partial image 83, the marker 93 cannot be detected by the marker search unit 115 (step S24). Therefore, in the same manner as described above, the partial image extraction unit 114 performs enlargement of the extraction area 82 and extraction of a new partial image 83 in the enlarged extraction area 82 (step S26). As in the previous step S26, in this step S26, each side of the extraction region 82 is extended to a length corresponding to 10% of each side in the initial state shown in FIG. 20 pixels). Thereby, as shown in FIG. 13, the extraction area|region 82 of the square whose each side is 220 pixels is enlarged into a square whose each side is 240 pixels. In this case, the magnification of the extraction region 82 is about 9%.

In the above description, in each repetition of step S26, each side of the extraction area 82 is lengthened by a predetermined length (for example, 20 pixels) each time, and the magnification of the extraction area 82 decreases with each repetition of step S26. However, it is not limited to this. For example, the magnification of the extraction region 82 may be set to be constant in each time step S26 is repeated. In addition, the magnitude of the magnification is not necessarily limited to the above-mentioned range, and can be changed to various sizes.

When step S26 ends, the marker 93 is searched for in the new partial image 83 shown in FIG. 14 by the marker search unit 115 (step S27 ), and the process returns to step S24 . In the example shown in FIG. 14 , since the entire marker 93 is included in the partial image 83 , the marker 93 is detected by the marker search unit 115 (step S24 ), and the position of the marker 93 in the partial image 83 is obtained. The position of the marker 93 in the partial image 83 is sent from the marker search unit 115 to the position calculation unit 116 . The position calculator 116 obtains the position of the mark 93 on the substrate 9 based on the position of the mark 93 in the partial image 83 and the position of the enlarged partial image 83 in the upper surface image (step S25).

In addition, in the examples shown in FIGS. 10 to 14 , although only a part of the mark 93 is included in the partial image 83 in FIG. 10 in the initial state, even in the initial state, the partial image 83 is not included at all. Also in the case of the mark 93, similarly to the above, steps S26 and S27 are repeated to detect the mark 93, and in step S25, the position of the mark 93 on the substrate 9 is obtained.

In the example shown in FIG. 7 , when the marker 93 is not detected in the partial image 83 extracted in step S22 (that is, the partial image 83 in the initial state), the above steps S26 and S27 are repeated countless times until The mark 93 is detected, and the position of the mark 93 on the substrate 9 is obtained in step S25.

On the other hand, from the viewpoint of shortening the time required for the position detection of the mark 93, an upper limit may be set on the number of repetitions of steps S26 and S27. In this case, as shown in FIG. 15, for example, step S241 is provided between step S24 and step S26, and step S241 is used to confirm whether the number of repetitions of steps S26 and S27 is a predetermined number of times (for example, four times) or more. Next, when the number of repetitions of steps S26 and S27 is less than the predetermined number of times, steps S26 and S27 are performed in the same manner as described above. In addition, when the number of repetitions of steps S26 and S27 reaches the predetermined number of times (that is, when the marker 93 cannot be detected even if steps S26 and S27 are repeated a predetermined number of times), the search for the marker 93 ends. Naturally, the position of the marker 93 for which the search has been completed is not obtained, but, for example, an error code that can be used for the processing of the rendering device 4 is given to the marker 93 (specifically, the data of the display marker 93 ).

In the position detection apparatus 1, the position detection of the mark 93 on the board|substrate 9 is performed similarly to the above with respect to each unit image 81 which comprises the upper surface image. The positions of the plurality of marks 93 on the substrate 9 obtained by the position detection device 1 are sent to the drawing device 4 (see FIG. 1 ). In the drawing device 4 , based on the positions of the plurality of marks 93 on the substrate 9 detected by the position detection device 1 , the substrate 9 is irradiated with light to draw a pattern.

FIG. 16 is a perspective view showing the drawing device 4 . In the example shown in FIG. 16 , the drawing device 4 is a direct drawing device, which is used to irradiate spatially modulated light beams to the photosensitive material on the substrate 9 and scan the irradiated area of the light on the object. , to draw the pattern.

The drawing device 4 includes a stage 51 , a stage moving mechanism 52 , an imaging unit 6 , and a control unit 40 . The stage 51 is a substantially flat-shaped holding portion for holding the substrate 9 in a horizontal state from the lower side below the drawing portion 6 (that is, on the (-Z) side). The stage moving mechanism 52 is a moving mechanism for relatively moving the stage 51 in a horizontal direction (ie, a direction slightly parallel to the upper surface 91 of the substrate 9 ) relative to the drawing portion 6 . The structure of the stage moving mechanism 52 is substantially the same as that of the stage moving mechanism 22 of the position detection device 1 . The stage moving mechanism 52 includes a first moving mechanism 53 for moving the stage 51 in the Y direction, and a second moving mechanism 54 for moving the stage 51 in the X direction.

The drawing unit 6 includes a plurality of (five in the example shown in FIG. 16 ) heads 61 arranged in the X direction and the Y direction. The plurality of heads 61 are supported above the table 51 by the head support portion 60 provided across the table 51 . Each head 61 is provided with a light source and a plurality of light modulation elements. As the light source, various light sources such as LD (Laser Diode) can be used. As the light modulation element, various diffraction grating types such as GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (Sunnyvale, California)) can be used. grating type) light modulation element. The plural heads 61 have substantially the same structure. In addition, the number of the heads 61 of the drawing unit 6 may be changed to various numbers within a range of one or more.

The control unit 40 is the console moving mechanism 52, the drawing unit 6, and the like. The control unit 40 is provided with a general computer (refer to FIG. 4 ) in a similar manner to the control unit 10 of the position detection device 1 . The control unit 40 stores design data and the like of a predetermined pattern to be drawn on the substrate 9 . The design data of the pattern is, for example, vector data such as CAD (computer-aided design) data, and is hereinafter referred to as "pattern data". The pattern data is, for example, data for drawing a predetermined pattern of each substrate element 94 illustrated in FIG. 3 .

The control unit 40 converts the pattern data into run length data corresponding to the plurality of substrate elements 94 . At this time, in the control unit 40, based on the output from the control unit 10 of the position detection device 1 (that is, the positions of the plurality of marks 93 on the substrate 9 detected by the position detection device 1), the respective Correction of deformation such as strain of the substrate element 94 . In addition, for the substrate element 94 corresponding to the mark 93 to which the above-mentioned error code is assigned, for example, information for drawing a scan pattern is generated.

In the rendering device 4, the control unit 40 controls the rendering unit 6, the stage moving mechanism 52, and the like based on the run-length data. In this way, while the modulated (that is, spatially modulated) light is irradiated onto the upper surface 91 of the substrate 9 from the plurality of heads 61 of the drawing unit 6 , the substrate is moved by the first moving mechanism 53 of the stage moving mechanism 52 . 9 moves in the Y direction. Thereby, the irradiation area of the light rays from the plurality of heads 61 is scanned in the Y direction on the substrate 9 , and the circuit pattern on the substrate 9 is drawn.

Drawing on the substrate 9 is performed by, for example, a so-called one-way (one-way) method. Specifically, the stage 51 is relatively moved in the Y direction with respect to the plurality of heads 61 by the stage moving mechanism 52, and the irradiation area of the light from the plurality of heads 61 is set on the upper surface 91 of the substrate 9 in the Y direction (that is, the scanning direction). ) is scanned only once. Thereby, the drawing of the substrate 9 is completed. In addition, in the drawing apparatus 4, drawing with respect to the board|substrate 9 can also be performed by the so-called multi-pass method.

As described above, the position detection device 1 is a device for detecting the position of the mark 93 on the substrate 9 . The position detection device 1 includes a stage 21 , an imaging unit 3 , a stage moving mechanism 22 , an imaging control unit 112 , and a detection unit 113 . The stage 21 holds the substrate 9 . The imaging unit 3 images the upper surface 91 of the substrate 9 with a line camera (the head 31 in the above example). The stage moving mechanism 22 is a moving mechanism for relatively moving the stage 21 in a direction parallel to the upper surface 91 of the substrate 9 with respect to the line camera. The imaging control unit 112 controls the inline camera and the stage moving mechanism 22 to acquire an upper surface image, which is an image of the upper surface 91 of the substrate 9 . The detection unit 113 detects the positions of the plurality of marks 93 provided on the upper surface 91 of the substrate 9 in the upper surface image.

The detection unit 113 includes a partial image extraction unit 114 , a marker search unit 115 , and a position calculation unit 116 . The partial image extraction unit 114 obtains the design positions 930 of the plurality of marks 93 in the upper surface image based on the design information of the plurality of marks 93 . Next, the partial image extraction unit 114 sets an extraction area 82 of a predetermined size with the design position 930 of each mark 93 as the center on the upper surface image, and uses the image of the extraction area 82 as a part from the upper surface image. Image 83 is extracted. The marker search unit 115 searches for markers 93 in the partial images 83 corresponding to the respective markers 93 . The position calculation unit 116 obtains the position of the mark 93 on the substrate 9 for each mark 93 based on the position of the mark 93 detected in the partial image 83 .

In this way, the image of the upper surface of the substrate 9 on which the plurality of marks 93 are provided is obtained by the line camera, which can be omitted compared with the case where the area camera is sequentially moved above the plurality of marks 93 and photographed. The imaging waiting time due to acceleration and deceleration during the movement of the area camera or the stage 21 and stabilization after stopping. As a result, the time required for photographing the plural marks 93 can be shortened. In addition, a partial image 83 corresponding to each mark 93 is extracted from the upper surface image, the mark 93 is searched in the partial image 83, and the position of the mark 93 is obtained, thereby obtaining an image of the entire upper surface 91 of the substrate 9. The time required for detection of each marker 93 can be shortened compared to the case where a plurality of markers 93 are separately searched. As a result, the time required for position detection of the plurality of marks 93 on the substrate 9 can be shortened.

For example, in the case of sequentially photographing a plurality of marks 93 by an area camera and performing position detection, when about 10,000 marks 93 are provided on the substrate 9 as in the above example, the time required for the position detection of the marks 93 is About three to four hours. On the other hand, in the position detection apparatus 1 described above, the time required for position detection of the marks 93 on the same substrate 9 can be shortened to about two minutes.

In the position detection apparatus 1, when the marker 93 is not detected in the partial image 83, it is preferable that the partial image extraction unit 114 enlarges the extraction area 82 and extracts a new partial image 83, and the marker search unit 115 enlarges the extraction area 82. The mark 93 is explored in this new partial image 83 . Thereby, even when the marker 93 deviates from the extraction area 82 set initially, the marker 93 can be automatically searched and detected again. As a result, since the substrate element 94 corresponding to the mark 93 can be better drawn in the drawing device 4, the production yield in the drawing system 7 can be improved. Further, the position detection of the marker 93 can be accelerated compared to the case where the marker 93 is manually searched again using a joystick or the like.

As described above, it is preferable that the enlargement of the extraction area 82 in step S26 performed by the partial image extraction unit 114 is performed with the design position 930 as the center. Thereby, even in the case where the mark 93 is shifted in any direction with respect to the design position 930, the mark 93 can be quickly detected (ie, found). As a result, the position detection of the marker 93 can be accelerated.

As described above, the magnification of the extraction region 82 in step S26 by the partial image extraction unit 114 is preferably 5% or more and 40% or less. By setting the magnification ratio to 5% or more, the number of times of magnification of the extraction region 82 required until the marker 93 is detected can be reduced. Further, by setting the magnification ratio to be 40% or less, the search time (ie, pattern matching time) of the mark 93 every time the extraction area 82 is magnified can be shortened. As a result, the position detection of the marker 93 can be appropriately accelerated.

As described above, even if the extraction of the new partial image 83 by the partial image extraction unit 114 (step S26 ) and the search for the marker 93 in the new partial image 83 by the marker search unit 115 are repeated a predetermined number of times ( In the case where the marker 93 cannot be detected in the new partial image 83 in step S27), it is preferable to assign an error code to the marker 93 and end the search for the marker 93. Thereby, the search for the mark 93 having an excessively large offset from the design position 930 can be stopped, and an increase in the time required for the position detection of the plurality of marks 93 on the substrate 9 can be suppressed. In addition, since the strain and the like of the substrate element 94 corresponding to the mark 93 with the above-mentioned excessive offset are large and the possibility of being unsuitable for drawing is high, the search for the mark 93 is suspended (that is, the drawing to the corresponding substrate element 94 is suspended). The possibility of causing a reduction in throughput in the rendering system 7 is low. Therefore, it is possible to combine the improvement of tact and the improvement of output in the rendering system 7 .

As described above, it is preferable to set a plurality of unit regions 95 on the upper surface 91 of the substrate 9, and the plurality of unit regions 95 extend perpendicular to the direction corresponding to the longitudinal direction of the line camera. Furthermore, it is preferable that the image acquisition is completed by the detection unit 113 in parallel with the image acquisition of one unit area 95 by the line camera (that is, the image acquisition of one unit area 95 included in step S11 ). Detection of markers 93 in other unit areas 95 of . Thereby, the position detection of the plurality of marks 93 provided on the upper surface 91 of the substrate 9 can be further accelerated.

As mentioned above, the line camera is preferably a TDI camera. Thereby, the moving speed in the Y direction of the stage 21 (that is, the scanning speed of the line camera) can be increased, and a high-sensitivity image can be obtained. Therefore, the accuracy of the position detection of the plurality of marks 93 can be maintained and the position detection can be accelerated.

The drawing system 7 includes the above-described position detection device 1 and the drawing device 4 . The drawing apparatus 4 irradiates light to the board|substrate 9 based on the position of the some mark 93 on the board|substrate 9 detected by the position detection apparatus 1, and draws a pattern. As described above, in the position detection device 1, the time required for position detection of the plurality of marks 93 can be shortened. Therefore, the time required for the drawing of the pattern in the drawing system 7 can also be shortened.

The above-described position detection method for detecting the position of the mark 93 on the substrate 9 includes the steps of: facing the substrate 9 with respect to the line camera (head 31 in the above example) in a direction parallel to the upper surface 91 moving, while obtaining the image of the upper surface by the line camera, the upper surface image is the image of the upper surface 91 of the substrate 9 (step S11); The positions of the plurality of marks 93 on the upper surface 91 of 9 (step S12). Step S12 includes the following steps: obtaining the design positions 930 of the plurality of marks 93 in the upper surface image based on the design information of the plurality of marks 93 (step S21 ); The extraction area 82 of the size is set on the upper surface image, and the image of the extraction area 82 is extracted from the upper surface image as the partial image 83 (step S22 ); mark 93 (step S23 ); and based on the position of the mark 93 detected in step 23 , the position of the mark 93 on the substrate 9 is obtained for each mark 93 (step S25 ). As a result, the time required for position detection of the plurality of marks 93 on the substrate 9 can be shortened as described above.

As described above, in the case where the marker 93 is not detected in step 23, the position detection method further includes the following step: before step 25, the extraction area 82 corresponding to the marker 93 is enlarged and extracted from the upper surface image a new partial image 83 (step S26); and search for the marker 93 in the new partial image 83 (step S27). Thereby, as described above, even when the marker 93 deviates from the extraction area 82 set initially, the marker 93 can be automatically searched again and detected. Further, the position detection of the marker 93 can be accelerated compared to the case where the marker 93 is manually searched again using a joystick or the like.

Various changes can be made to the position detection device 1 , the drawing system 7 , and the position detection method described above.

For example, in the position detection apparatus 1 , as long as the head 31 moves relatively with respect to the stage 21 , various structures can be employed as the stage moving mechanism 22 . For example, the table 21 may be fixed and the head 31 may be moved. Alternatively, both the head 31 and the stage 21 may be moved. The same applies to the drawing device 4 .

The above-mentioned inline camera is not limited to a TDI camera, and may be, for example, an inline camera having only one element row. Even in this case, the position detection can be accelerated while maintaining the accuracy of the position detection of the plurality of marks 93 in the same manner as described above.

The enlargement of the extraction area 82 in step S26 does not necessarily need to be performed with the design position 930 as the center, and may be performed by various methods. For example, one vertex of the extraction region 82 may be used as a reference point, and the extraction region 82 may be enlarged in the vertical and horizontal directions away from the reference point. In addition, steps S26 and S27 may be omitted.

The above-mentioned marks 93 do not necessarily need to be alignment marks dedicated to the alignment process, and may be part of through holes or wirings provided in advance on the substrate 9 , or may be a wafer on the substrate 9 .

The said board|substrate 9 is not limited to a printed wiring board. In the position detection device 1, for example, a glass substrate for a flat-panel display device, a glass substrate for a photomask, and a solar cell provided on a semiconductor substrate, a liquid crystal display device, a plasma display device, or the like may be used. Position detection of marks on substrates for panels, etc.

The position detection device 1 does not necessarily need to be used in the drawing system 7, and for example, it may be combined with various devices other than the drawing device 4 (for example, a stepper type exposure device or a chip mounter). use. In addition, the position detection device 1 may be used alone without being combined with other devices.

The configurations in the above-described embodiment and each modification example may be appropriately combined as long as they do not contradict each other.

While the invention has been depicted and described in detail, these descriptions are intended to be illustrative and not restrictive. Therefore, various changes and aspects can be considered as long as they do not deviate from the scope of the present invention.

1: Position detection device 4: Drawing device 3,6: Filming Department 7: Depicting the system 9: Substrate 10: Control Department 21,51: Desk 22,52: Table moving mechanism 23,53: First moving mechanism 24,54: Second moving mechanism 30,60: head support 31,61: Head 32: Shooting sensor 33: Optical system 40: Control Department 71: Handling Robot 81: Unit Image 82: Extract area 83: Partial Image 91: Upper surface (of the substrate) 93: Mark 94: Substrate Elements 95: Unit area 100: Computer 101: Processor 102: Memory 103: Input and output section 104: Busbar 105: Keyboard 106: Mouse 107: Display 111: Memory Department 112: Shooting Control Department 113: Inspection Department 114: Partial Image Extraction Section 115: Mark Exploration Department 116: Position calculation department 930: Design Position

Fig. 1 is a diagram schematically showing the configuration of a drawing system according to one embodiment. [ Fig. 2 ] is a perspective view of the position detection device. [ Fig. 3 ] is a plan view of the substrate. FIG. 4 is a diagram showing the configuration of a computer included in the control unit. [FIG. 5] It is a block diagram showing the function of a control part. [ Fig. 6] Fig. 6 is a diagram showing a flow of position detection of a marker. [ Fig. 7] Fig. 7 is a diagram showing a flow of position detection of a marker. [ Fig. 8 ] A diagram showing a part of a unit image. [Fig. 9] is a diagram showing a part of the image. [Fig. 10] is a diagram showing a part of the image. [ Fig. 11 ] A diagram showing a part of a unit image. [Fig. 12] is a diagram showing part of the image. [ Fig. 13 ] A diagram showing a part of a unit image. [FIG. 14] A diagram showing a part of the image. [ Fig. 15] Fig. 15 is a diagram showing a flow of position detection of a marker. [ Fig. 16 ] A perspective view of the drawing device.

10: Control Department

22: Taiwan moving mechanism

31: Head

111: Memory Department

112: Shooting Control Department

113: Inspection Department

114: Partial Image Extraction Section

115: Mark Exploration Department

116: Position calculation department

Claims (15)

A position detection device is used to detect the position of a mark on a substrate, and has: table, which holds the base plate; a photographing part, which uses a line camera to photograph the upper surface of the substrate; a moving mechanism for relatively moving the stage relative to the line camera in a direction parallel to the upper surface of the substrate; an imaging control unit for controlling the inline camera and the moving mechanism to acquire an upper surface image, the upper surface image being an image of the upper surface of the substrate; and a detection unit for detecting the positions of a plurality of marks arranged on the upper surface of the substrate in the upper surface image; The aforementioned detection department is equipped with: The partial image extraction unit obtains the design positions of the plurality of marks in the upper surface image based on the design information of the plurality of marks, and extracts an area of a predetermined size centered on the design positions of the respective marks set on the image of the upper surface, and extract the image of the extracted area as a partial image from the image of the upper surface; a marker search unit that searches for markers in the partial images corresponding to the respective markers; and The position calculation unit obtains the position of the mark on the substrate for each of the marks based on the position of the mark detected in the partial image. The position detection device according to claim 1, wherein in the case where the mark is not detected in the partial image, the partial image extracting section enlarges the extracted area and extracts a new partial image; The marker search unit searches for the marker in the new partial image. The position detection device according to claim 2, wherein the enlargement of the extraction area of the partial image extraction unit is performed with the design position as a center. The position detection device according to claim 3, wherein the magnification of the extraction region in which the partial image extraction portion is formed is 5% or more and 40% or less. The position detection device according to claim 2, wherein the marker in the new partial image extracted by the partial image extraction unit and the new partial image performed by the marker search unit is repeated a predetermined number of times In the case that the aforementioned marker still cannot be detected in the aforementioned new partial image, an error code is assigned to the aforementioned marker and the aforementioned marker exploration is ended. The position detection device according to any one of claims 1 to 5, wherein a plurality of unit areas are set on the upper surface of the substrate, and the plurality of unit areas are connected to the longitudinal direction of the line camera. The corresponding direction extends vertically; In parallel with the image acquisition of one unit area performed by the line camera, the detection unit performs detection of markers in the other unit areas for which the image acquisition has been completed. The position detection device according to any one of claims 1 to 5, wherein the in-line camera is a time-delay integral camera. A depiction system having: The position detection device as recited in any one of claims 1 to 7; and The drawing device irradiates the substrate with light and draws a pattern based on the positions of the plurality of marks on the substrate detected by the position detection device. A position detection method is used to detect the position of a mark on a substrate, and has: In step a, while the substrate is relatively moved relative to the line camera in a direction parallel to the upper surface, an image of the upper surface is obtained by the line camera, and the image of the upper surface is the upper surface of the substrate. images of surfaces; and Step b, detecting the positions of a plurality of marks arranged on the upper surface of the substrate in the upper surface image; The aforementioned step b is equipped with: Step b1, is based on the design information of the plurality of the above-mentioned marks to obtain the design positions of the plurality of the above-mentioned marks in the above-mentioned upper surface image; In step b2, an extraction region of a predetermined size centered on the design position of each of the aforementioned marks is set on the upper surface image, and the image of the extraction region is extracted from the upper surface image as a partial image. ; Step b3, searching for markers in the aforementioned partial images corresponding to each aforementioned marker; and In step b4, based on the positions of the marks detected in the above step b3, the positions of the marks on the substrate are obtained for each of the marks. The position detection method according to claim 9, wherein the aforementioned step b is in the case where the aforementioned mark is not detected in the aforementioned step b3, further comprising: Step b5, before the aforementioned step b4, enlarging the aforementioned extraction area corresponding to the aforementioned mark and extracting a new partial image from the aforementioned upper surface image; and In step b6, the aforementioned mark is searched in the aforementioned new partial image. The position detection method according to claim 10, wherein the enlargement of the extraction area in the step b5 is performed with the design position as the center. The position detection method according to claim 11, wherein the magnification of the extraction region in the step b5 is 5% or more and 40% or less. The position detection method according to claim 10, wherein in the case where the marker cannot be detected in the new partial image even after repeating the aforementioned steps b5 and b6 for a predetermined number of times, assign an error code to the aforementioned marker and end Exploration of the aforementioned markup. The position detection method according to any one of claims 9 to 13, wherein a plurality of unit areas are set on the upper surface of the substrate, and the plurality of unit areas are connected to the longitudinal direction of the line camera. The corresponding direction extends vertically; In parallel with the image acquisition of one unit region included in the aforementioned step a, the detection of the markers in the other unit regions where the image acquisition included in the aforementioned step b has been completed is performed. The position detection method according to any one of claims 9 to 13, wherein the in-line camera is a time-delay integral camera.

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