CN117742093A - Drawing position information acquisition method and drawing method - Google Patents
Drawing position information acquisition method and drawing method Download PDFInfo
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- CN117742093A CN117742093A CN202311120767.3A CN202311120767A CN117742093A CN 117742093 A CN117742093 A CN 117742093A CN 202311120767 A CN202311120767 A CN 202311120767A CN 117742093 A CN117742093 A CN 117742093A
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Abstract
The invention provides a drawing position information acquisition method and a drawing method for acquiring information related to a drawing position in a drawing device. The drawing position information acquisition method includes: a step (S33) of capturing an image of the first main surface of the calibration substrate to obtain the positions of the two first reference marks; a step (step S34) of drawing a plurality of alignment marks on the second main surface of the calibration substrate; a step (S36) of capturing an image of the second main surface of the correction substrate to obtain the positions of the two second reference marks and the positions of the plurality of alignment marks; and a step (step S37) of acquiring drawing position information on the drawing positions of the plurality of alignment marks drawn by the alignment mark drawing unit, based on the positions of the two first reference marks, the positions of the two second reference marks, and the positions of the plurality of alignment marks. This can improve the relative positional accuracy of the pattern drawn on the principal surfaces on both sides of the substrate in the drawing device.
Description
Technical Field
The present invention relates to a drawing position information acquisition method for acquiring information on a drawing position in a drawing device, and a drawing method for drawing a pattern on a substrate using the information.
[ reference to related applications ]
The present application claims the benefit of priority from japanese patent application JP2022-151146, filed on 9/22 of 2022, the entire disclosure of which is incorporated herein.
Background
Conventionally, patterns have been drawn by irradiating light onto a photosensitive material formed on a semiconductor substrate, a printed board, or a glass substrate for an organic EL display device or a liquid crystal display device (hereinafter referred to as a "substrate").
For example, in the drawing device of japanese patent application laid-open No. 2022-52397 (document 1), both surfaces of a substrate are drawn with patterns. In this drawing device, in order to make the pattern drawing positions on both sides of the substrate uniform, when drawing a pattern on the upper surface of the substrate held on the stage, light is irradiated from a light source incorporated in the stage to the back surface of the substrate to draw an alignment mark. When the substrate is inverted and a pattern is drawn on the back surface of the substrate, alignment processing is performed using the alignment mark, whereby alignment of the pattern drawing positions on both surfaces of the substrate is performed.
However, in the drawing device described above, there is a case where the position of the alignment mark drawn on the back surface of the substrate deviates from the design position due to an installation error of the light source built in the stage, or the like. Therefore, considering the deviation between the drawing position of the alignment mark and the design position measured in advance, the deviation is corrected when the pattern is drawn after the substrate is inverted. As a method for measuring the deviation, it is considered to take an image of light emitted from a light source incorporated in a stage with a camera in a state where a substrate is not mounted on the stage, and to determine the deviation based on the position of the light in the taken image. However, in this method, it is difficult to say that the measurement accuracy of the deviation is high due to various factors such as the relationship between the wavelength of the light and the performance of the camera. Therefore, there is a limit to improvement in the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate.
Disclosure of Invention
The invention relates to a drawing position information acquisition method for acquiring information related to a drawing position in a drawing device, aiming at improving the relative position accuracy of patterns drawn on main surfaces of two sides of a substrate.
In accordance with embodiment 1 of the present invention, a drawing position information acquisition method is provided for acquiring information on a drawing position in a drawing device. The drawing device includes: a stage for holding a substrate; a stage moving mechanism for horizontally moving the stage; an imaging unit that images an upper surface of the substrate held by the stage; a pattern drawing unit that irradiates the upper surface of the substrate held by the stage with light and draws a pattern; and an alignment mark drawing unit that is fixed to the stage, irradiates the lower surface of the substrate held by the stage with light, and draws a plurality of alignment marks that are references of drawing positions when drawing a pattern on the lower surface. The drawing position information acquisition method includes: a) A step of preparing a correction substrate having two first reference marks on a first main surface and two second reference marks on a second main surface, the positions of the two second reference marks being identical to the positions of the two first reference marks in a plan view; b) A step of disposing the correction substrate in a state in which the first main surface is directed upward so as to cover the alignment mark drawing unit, and holding the correction substrate by the stage; c) A step of capturing, by the capturing unit, the first main surface of the correction substrate, and obtaining the positions of the two first reference marks; d) A step of drawing the plurality of alignment marks on the second main surface of the correction substrate by the alignment mark drawing unit; e) A step of holding the correction substrate with the second main surface facing upward by the stage after the step d); f) A step of capturing, by the capturing unit, the second main surface of the correction substrate, and obtaining the positions of the two second reference marks and the positions of the plurality of alignment marks; and g) acquiring drawing position information related to the drawing positions of the plurality of alignment marks drawn by the alignment mark drawing unit, based on the positions of the two first reference marks acquired in the c) and the positions of the two second reference marks acquired in the f) and the positions of the plurality of alignment marks.
According to the present invention, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate can be improved.
In accordance with aspect 2 of the present invention, in the drawing position information acquiring method according to aspect 1, the drawing position information acquired in the step g) is correction information indicating a deviation between the design positions of the plurality of alignment marks and the drawing positions of the plurality of alignment marks drawn by the alignment mark drawing unit.
In accordance with aspect 3 of the present invention, in the drawing position information acquisition method according to aspect 1 (or according to aspect 1 or 2), the two first reference marks are openings of the two through holes provided in the correction substrate, respectively, on the first main surface. The two second reference mark numbers are openings of the two through holes on the second main surface.
In accordance with embodiment 4 of the present invention, in accordance with the drawing position information acquisition method of embodiment 1 (any one of embodiments 1 to 3 may be adopted), the plurality of alignment marks are arranged in a predetermined arrangement direction. The distance in the arrangement direction between the two first reference marks is equal to or greater than the distance in the arrangement direction between two alignment marks located at both ends in the arrangement direction among the plurality of alignment marks.
In accordance with embodiment 5 of the present invention, there is provided a drawing position information acquisition method according to embodiment 1 (any one of embodiments 1 to 4 may be adopted), the drawing apparatus further including: another stage for holding a substrate; another stage moving mechanism for horizontally moving the another stage; and another alignment mark drawing unit that is fixed to the other stage, irradiates the lower surface of the substrate held by the other stage with light, and draws another plurality of alignment marks that are references of drawing positions when drawing a pattern on the lower surface. The pattern drawing unit includes: a drawing head portion which irradiates light downward; and a drawing head moving mechanism that moves the drawing head between a first drawing position above the stage moving mechanism and a second drawing position above the other stage moving mechanism. The imaging unit includes: aligning the camera; and a camera moving mechanism that moves the alignment camera between a first photographing position above the stage moving mechanism and a second photographing position above the other stage moving mechanism. The drawing position information acquisition method further includes: h) A step of disposing the correction substrate in a state in which the second main surface is directed upward so as to cover the other alignment mark drawing unit, and holding the correction substrate by the other stage; i) A step of capturing, by the capturing unit, the second main surface of the correction substrate, and obtaining the positions of the two second reference marks; j) A step of drawing the other plurality of alignment marks on the first main surface of the correction substrate by the other alignment mark drawing unit; k) A step of holding the correction substrate with the first main surface facing upward by the other stage after the step j); l) photographing the first main surface of the correction substrate by the photographing unit to obtain the positions of the two first reference marks and the positions of the other plurality of alignment marks; and m) acquiring another drawing position information related to the drawing positions of the other plurality of alignment marks drawn by the other alignment mark drawing section, based on the positions of the two second reference marks acquired in the i) and the positions of the two first reference marks acquired in the l) and the positions of the other plurality of alignment marks.
In accordance with the drawing position information acquisition method according to embodiment 5, aspect 6 of the present invention is the drawing position information acquisition method according to embodiment 5, wherein the appearance of the plurality of alignment marks is identical to each other. The other plurality of alignment marks have the same appearance as each other and are different from the plurality of alignment marks.
The present invention also relates to a drawing method for drawing a pattern on a substrate. In accordance with embodiment 7 of the present invention, there is provided a drawing method for drawing a pattern on a substrate, including: n) holding the substrate with a main surface facing upward by the stage; o) photographing the positioning mark on the one main surface by the photographing unit, performing alignment processing of the substrate based on an output from the photographing unit, and drawing a pattern on the one main surface by the pattern drawing unit; p) drawing the plurality of alignment marks on the other main surface of the substrate by the alignment mark drawing unit; q) holding the substrate with the other main surface facing upward by the stage; and r) imaging the plurality of alignment marks on the other main surface by the imaging unit, performing alignment processing of the substrate based on an output from the imaging unit and the drawing position information acquired by the drawing position information acquisition method according to any one of aspects 1 to 6, and drawing a pattern on the other main surface by the pattern drawing unit with the plurality of alignment marks as a reference.
The above objects, and other objects, features, aspects and advantages will become apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a perspective view showing a drawing device.
Fig. 2 is an enlarged plan view showing a part of the stage.
Fig. 3 is a longitudinal sectional view showing the marker.
Fig. 4 is a bottom view showing the alignment mark.
Fig. 5 is a diagram showing a flow of drawing a pattern on a substrate.
Fig. 6 is a diagram showing a flow of drawing a pattern on a substrate.
Fig. 7 is a plan view showing a calibration substrate.
Fig. 8 is a bottom view showing the calibration substrate.
Fig. 9 is a diagram showing a flow of acquisition of drawing position information.
Fig. 10 is a plan view showing the calibration substrate and stage.
Fig. 11 is a plan view showing the calibration substrate and stage.
Fig. 12 is a perspective view showing a drawing device.
Fig. 13 is an enlarged plan view showing a part of the stage.
Fig. 14 is a bottom view showing the alignment mark.
Fig. 15 is a diagram showing a flow of acquisition of drawing position information.
Fig. 16 is a plan view showing the calibration substrate and stage.
Fig. 17 is a plan view showing the calibration substrate and stage.
Description of the reference numerals
1. 1a drawing device
3 shooting part
4 pattern drawing part
8 correction substrate
9 substrate
21. 21a stage
22. 22a objective table moving mechanism
31 alignment camera
32a camera moving mechanism
41 depicts the head
42a depicts a head movement mechanism
51. 51a alignment mark drawing part
81 A first main surface (of the correction substrate)
82 A second main surface (of the correction substrate)
83 through hole
91 First main surface (of substrate)
92 A second main surface (of the substrate)
93. 94 alignment mark
831. 832 (through hole) openings
Steps S11 to S14, S21 to S23, S31 to S37, S41 to S46
Detailed Description
Fig. 1 is a perspective view showing a drawing apparatus 1 for acquiring information on a drawing position by a drawing position information acquisition method according to an embodiment of the present invention. The drawing device 1 is a direct drawing device that irradiates light of a substantially beam shape after spatial modulation onto a photosensitive material on a substrate 9, and scans an irradiation region of the light on the substrate 9 to draw a pattern. In fig. 1, three directions orthogonal to each other are indicated by arrows as an X direction, a Y direction, and a Z direction. In the example shown in fig. 1, the X-direction and the Y-direction are horizontal directions perpendicular to each other, and the Z-direction is a vertical direction. The same applies to the other figures.
The substrate 9 is a plate-like member having a substantially rectangular shape in a plan view, for example. The substrate 9 is, for example, a printed substrate. On the principal surfaces of both sides of the substrate 9, resist films formed of a photosensitive material are formed on the copper layers. In the drawing apparatus 1, a circuit pattern is drawn (i.e., formed) on the resist film of the substrate 9. In the following description, one principal surface of the substrate 9 is referred to as a "first principal surface 91", and the other principal surface of the substrate 9 is referred to as a "second principal surface 92". The type and shape of the substrate 9 may be variously changed.
As shown in fig. 1, the drawing device 1 includes a stage 21, a stage moving mechanism 22, an imaging unit 3, a pattern drawing unit 4, and a control unit 10. The stage 21 is a substantially flat plate-shaped substrate holding portion for holding the substrate 9 in a horizontal state from below (i.e., -Z side) the imaging portion 3 and the pattern drawing portion 4. The stage 21 is, for example, a vacuum chuck that suctions and holds a main surface (hereinafter referred to as "lower surface") on the lower side of the substrate 9. The stage 21 may have a structure other than a vacuum chuck, and may be a mechanical chuck, for example. A main surface (hereinafter also referred to as "upper surface") of the upper side of the substrate 9 mounted on the stage 21 is substantially perpendicular to the Z direction and substantially parallel to the X direction and the Y direction. In the example shown in fig. 1, the substrate 9 is placed on the stage 21 with the first main surface 91 facing upward (i.e., the +z side).
The stage moving mechanism 22 is a moving mechanism that moves the stage 21 relative to the imaging unit 3 and the pattern drawing unit 4 in the horizontal direction (i.e., in a direction substantially parallel to the upper surface of the substrate 9). The stage moving mechanism 22 includes a first moving mechanism 23 and a second moving mechanism 24. The second moving mechanism 24 moves the stage 21 linearly along the guide rail in the X direction. The first moving mechanism 23 linearly moves the stage 21 along the guide rail in the Y direction together with the second moving mechanism 24. The driving sources of the first moving mechanism 23 and the second moving mechanism 24 are, for example, linear servo motors or driving sources in which motors are mounted on ball screws. The structures of the first moving mechanism 23 and the second moving mechanism 24 may be variously changed.
In the drawing device 1, a stage rotation mechanism may be provided to rotate the stage 21 about a rotation axis extending in the Z direction. The drawing device 1 may be provided with a stage lifting mechanism for moving the stage 21 in the Z direction. As the stage rotation mechanism, for example, a servo motor can be used. As the stage lifting mechanism, for example, a linear servo motor can be used. The structures of the stage rotation mechanism and the stage lifting mechanism may be variously changed.
The imaging unit 3 includes a plurality of (two in the example shown in fig. 1) alignment cameras 31 arranged in the X direction. Each alignment camera 31 is supported above the stage 21 and the stage moving mechanism 22 by a door-shaped head support 30 provided across the stage 21 and the stage moving mechanism 22. One of the alignment cameras 31 is fixed to the head support 30, and the other alignment camera 31 is movable in the X direction on the head support 30. This makes it possible to change the distance in the X direction between the two alignment cameras 31. The number of alignment cameras 31 of the imaging unit 3 may be one or three or more.
Each alignment camera 31 is a camera provided with an imaging sensor and an optical system, not shown. Each alignment camera 31 is, for example, a region camera that acquires a two-dimensional image. The imaging sensor includes, for example, imaging elements such as a plurality of CCDs (Charge Coupled Device: charge-coupled devices) arranged in a matrix. In each alignment camera 31, reflected light of illumination light guided from a light source, not shown, to the upper surface of the substrate 9 is guided to the imaging sensor via an optical system. The photographing sensor receives reflected light from the upper surface of the substrate 9 and acquires an image of a substantially rectangular photographing region. As the light source, various light sources such as LEDs (Light Emitting Diode: light emitting diodes) can be used. The alignment cameras 31 may be other types of cameras such as line cameras.
The pattern drawing unit 4 includes a plurality of drawing heads 41 arranged in the X-direction and the Y-direction. In the example shown in fig. 1, six drawing heads 41 are arranged substantially linearly in the X direction. Each drawing head 41 is supported above the stage 21 and the stage moving mechanism 22 by a door-shaped head support 40 provided across the stage 21 and the stage moving mechanism 22. The head support portion 40 is located on the side (+y) of the head support portion 30 of the imaging portion 3. The number of drawing heads 41 of the pattern drawing unit 4 may be changed as appropriate. For example, the number of drawing heads 41 may be one or two or more.
Each drawing head 41 includes a light source, an optical system, and a spatial light modulator, which are not shown. As the spatial light modulator, various elements such as DMD (Digital Micro Mirror Device: digital micromirror device) and GLV (Grating Light Valve: grating light valve) (Silicon Light Machines (registered trademark of senyveromyces, california) can be used. As the light source, various light sources such as LD (Laser Diode) can be used. The plurality of drawing heads 41 have substantially the same structure.
In the drawing device 1, the substrate 9 is moved in the Y direction by the stage moving mechanism 22 while modulated (i.e., spatially modulated) light is irradiated onto the upper surface of the substrate 9 from the plurality of drawing heads 41 of the pattern drawing section 4. Thus, the irradiation region of the light from the plurality of drawing heads 41 is scanned in the Y direction on the substrate 9, and the pattern of the substrate 9 is drawn. In the following description, the Y direction is also referred to as "scanning direction", and the X direction is also referred to as "width direction". The stage moving mechanism 22 is a scanning mechanism that moves the irradiation region of the light from each drawing head 41 in the scanning direction on the substrate 9.
In the drawing apparatus 1, drawing of the substrate 9 is performed in a so-called single path (one-pass) system. Specifically, the stage 21 is moved relative to the plurality of drawing heads 41 in the Y direction by the stage moving mechanism 22, and the irradiation region of the light from the plurality of drawing heads 41 is scanned only once in the Y direction (i.e., the scanning direction) on the upper surface of the substrate 9. Thereby, the drawing of the substrate 9 is completed. In the drawing device 1, the substrate 9 may be drawn by a multi-path system in which the stage 21 is repeatedly moved in the Y direction and the stage is repeatedly moved in the X direction. In the case of the drawing device 1 performing the multi-path drawing, the Y direction is the main scanning direction, and the X direction is the sub scanning direction. The first moving mechanism 23 of the stage moving mechanism 22 is a main scanning mechanism that moves the stage 21 in the main scanning direction, and the second moving mechanism 24 is a sub-scanning mechanism that moves the stage 21 in the sub-scanning direction.
Fig. 2 is an enlarged plan view showing an end portion of the stage 21 on the (-Y) side. In fig. 2, the substrate 9 on the stage 21 is depicted by a two-dot chain line. As shown in fig. 2, the drawing device 1 further includes an alignment mark drawing unit 51. The alignment mark drawing unit 51 is disposed inside the stage 21 (i.e., between the upper surface and the lower surface of the stage 21), and is fixed to the stage 21. The alignment mark drawing unit 51 irradiates the lower surface of the substrate 9 held on the stage 21 so as to cover the upper side of the alignment mark drawing unit 51 with light to draw an alignment mark.
The alignment mark drawing unit 51 includes a plurality of markers 511. The plurality of markers 511 are arranged in the X direction near the end edge of the stage 21 on the (-Y) side. In the example shown in fig. 2, five markers 511 are arranged in a substantially straight line substantially parallel to the X direction. The marker 511 on the (-X) side of the five markers 511 is located at the corner of the (-X) side and the (-Y) side of the substrate 9, and the marker 511 on the (+ X) side is located at the corner of the (-Y) side and the (+ X) side of the substrate 9. Four of the five markers 511 other than the marker 511 on the most (-X) side are arranged at substantially equal intervals in the X direction. The number and configuration of the plurality of identifiers 511 may be variously changed. For example, the number of the plurality of markers 511 may be two. The plurality of markers 511 may be arranged substantially parallel to each other in the Y direction, or may be arranged in an L shape in the X direction and the Y direction.
Fig. 3 is a longitudinal sectional view showing one of the markers 511 and its vicinity. The plurality of markers 511 described above have substantially the same structure. The marker 511 is accommodated in a substantially cylindrical recess 211 provided on the upper surface of the stage 21. The upper end opening of the recess 211 may be closed by a cover member having a substantially flat plate shape and having light transmittance.
As shown in fig. 3, the marker 511 has a light source 512, an optical system 513, and an aperture 514. The light source 512 is disposed at the bottom of the recess 211 and emits light in the +z direction. As the light source 512, for example, an LED emitting ultraviolet light is used. The optical system 513 is disposed on the (+ Z) side of the light source 512, and guides light from the light source 512 to the lower surface of the substrate 9. The optical system 513 includes a plurality of lenses (not shown) arranged in the Z direction. The diaphragm 514 is disposed between the lenses of the optical system 513, and is a mask portion that passes only a part of the light from the light source 512. The diaphragm 514 is a substantially flat plate-shaped member provided with an opening corresponding to the alignment mark. The diaphragm 514 is formed of a metal such as stainless steel.
Fig. 4 is a bottom view showing one alignment mark 93 of the plurality of alignment marks 93 drawn on the lower surface of the substrate 9 by the plurality of markers 511. The plurality of alignment marks 93 have the same appearance as each other. In the example shown in fig. 4, the alignment mark 93 has four mark elements 931 having a circular shape of the same size. Four marking elements 931 are located at the four vertices of an imaginary square. In other words, the four marker elements 931 are arranged in a lattice shape in the X direction and the Y direction. In other words, the alignment mark 93 includes two mark elements 931 arranged in the X direction on the (+ Y) side, and two other mark elements 931 are arranged at substantially the same positions in the X direction as the two mark elements 931. The distance between the two respective mark elements 931 adjacent in the X direction is substantially the same as the distance between the two respective mark elements 931 adjacent in the Y direction.
The shape of the marking element 931 is not limited to a circle, and various modifications may be made, for example, a triangle, a rectangle, a polygon of pentagon or more, an ellipse, a cross, or the like. The arrangement of the marking elements 931 is not limited to the lattice shape, and various modifications are possible. The number of the marking elements 931 may be one or two or more, and may be variously changed.
The control unit 10 shown in fig. 1 is, for example, a general computer, and controls the stage moving mechanism 22, the imaging unit 3, the pattern drawing unit 4, the alignment mark drawing unit 51, and the like. In addition, positional relationship information and correction information relating to the drawing position in the drawing device 1 are stored in advance in the control unit 10. The positional relationship information and the correction information are used to align the drawing position of the pattern drawn on the upper surface of the substrate 9 by the pattern drawing unit 4 with the drawing position of the alignment mark 93 (see fig. 4) drawn on the lower surface of the substrate 9 by the alignment mark drawing unit 51 (see fig. 2).
The positional relationship information is information indicating the designed relative position between the pattern on the upper surface of the substrate 9 and the alignment mark 93 on the lower surface of the substrate 9 in plan view. Based on the design positions of the plurality of drawing heads 41 of the pattern drawing unit 4 and the design positions of the plurality of markers 511 of the alignment mark drawing unit 51, positional relationship information is obtained by calculation. The correction information is information for correcting an error in the positional relationship information caused by the mounting accuracy of the identifier 511 or the like. Specifically, the correction information is information indicating a difference between the actual position of the alignment mark 93 drawn on the lower surface of the substrate 9 by the alignment mark drawing unit 51 and the position on the design. The method of acquiring the correction information will be described later.
Next, a flow of drawing the pattern on the substrate 9 by the drawing device 1 will be described with reference to fig. 5 and 6. Fig. 5 is a diagram showing a flow of processing when a pattern is drawn on the first main surface 91 of the substrate 9. Fig. 6 is a diagram showing a flow of processing when a pattern is drawn on the second main surface 92 of the substrate 9 on which the pattern is drawn on the first main surface 91. In the following description, the pattern drawn on the first main surface 91 of the substrate 9 is also referred to as a "first pattern", and the pattern drawn on the second main surface 92 of the substrate 9 is also referred to as a "second pattern".
As shown in fig. 5, when the first pattern is drawn on the first main surface 91, first, the substrate 9 having the first main surface 91 facing upward is carried into the drawing device 1 shown in fig. 1 and held by the stage 21 (step S11). The stage 21 is located at a carry-in and carry-out position closer to (-Y) side than the imaging section 3 and the pattern drawing section 4. A mark for positioning (hereinafter, also referred to as "positioning mark") not shown is provided in advance on the upper surface (i.e., the first main surface 91) of the substrate 9 held on the stage 21. The positioning mark may be a part of a pattern drawn in advance on the first main surface 91 of the substrate 9, or may be a mark dedicated to positioning different from the pattern. The positioning mark has, for example, a different appearance from the alignment mark 93 described above.
Then, the substrate 9 is moved in the (+ Y) direction together with the stage 21 by the stage moving mechanism 22, and moved downward of the imaging unit 3. Then, the imaging unit 3 captures the positioning mark provided on the upper surface (i.e., the first main surface 91) of the substrate 9, and the captured image is transmitted to the control unit 10. The control unit 10 performs pattern matching using a reference image on the image outputted from the imaging unit 3, and obtains the position of the positioning mark in the image. Then, the position of the substrate 9 on the stage 21 is detected (step S12). The pattern matching is performed by a known pattern matching method (for example, geometric pattern matching, normalized correlation search, etc.).
The position of the substrate 9 detected in step S12 includes coordinates in the X direction and the Y direction of the substrate 9 on the stage 21, the orientation of the substrate 9, and the like. The control unit 10 adjusts the drawing data for the first main surface 91 of the substrate 9 (i.e., performs alignment processing) based on the detected position of the substrate 9.
Next, the control unit 10 controls the stage moving mechanism 22 and the pattern drawing unit 4 so as to irradiate the modulated light onto the upper surface (i.e., the first main surface 91) of the substrate 9 that moves relative to the drawing head 41 of the pattern drawing unit 4 in the Y direction, thereby drawing the first pattern on the first main surface 91 of the substrate 9 (step S13). In step S13, drawing of the first pattern is performed based on the drawing data adjusted in step S12. In other words, in step S13, the modulation interval and the modulation timing of the light beam irradiated from the pattern drawing section 4 to the substrate 9, the scanning position of the light beam on the first main surface 91 of the substrate 9, and the like are mechanically and automatically corrected by a known correction method based on the position of the substrate 9 detected in step S12. This enables the first pattern to be drawn on the first main surface 91 with high positional accuracy.
In the drawing device 1, the control unit 10 controls the alignment mark drawing unit 51 and the like to draw the alignment mark 93 on the lower surface (i.e., the second main surface 92) of the substrate 9 on the stage 21 (step S14). The drawing of the alignment mark 93 on the second main surface 92 (step S14) may be performed in parallel with the drawing of the first pattern on the first main surface 91 (step S13), or may be performed before or after the drawing of the first pattern. When steps S11 to S14 are completed, the substrate 9 is carried out from the stage 21 of the drawing device 1.
As shown in fig. 6, when a second pattern is drawn on the second main surface 92 of the substrate 9 having the first pattern drawn on the first main surface 91, first, the second main surface 92 is carried into the drawing device 1 shown in fig. 1 toward the upper substrate 9 and held by the stage 21 (step S21). The stage 21 is located at the above-described carry-in and carry-out position. The plurality of alignment marks 93 are provided on the upper surface (i.e., the second main surface 92) of the substrate 9 held on the stage 21.
Then, the substrate 9 is moved in the (+ Y) direction together with the stage 21 by the stage moving mechanism 22, and moved downward of the imaging unit 3. Then, the alignment mark 93 provided on the upper surface (i.e., the second main surface 92) of the substrate 9 is photographed, and the obtained image is transmitted to the control unit 10. The control unit 10 performs pattern matching substantially similar to that described above on the image output from the imaging unit 3, and obtains the position of the alignment mark 93 in the image.
Then, based on the detected position of the alignment mark 93, the positional relationship information, and the correction information, the position of the first pattern on the first main surface 91 of the substrate 9 in plan view (that is, the relative position of the first pattern with respect to the drawing head 41) is obtained (step S22). Specifically, the relative position of the first pattern with respect to the design of the drawing head 41 (that is, the relative position in the case where there is no error due to the mounting accuracy of the marker 511 or the like) is obtained from the detected position of the alignment mark 93 and the positional relationship information described above. The actual relative position of the first pattern with respect to the drawing head 41 is obtained by correcting the designed relative position based on the correction information. The control unit 10 adjusts the drawing data for the second main surface 92 of the substrate 9 (i.e., performs alignment processing) based on the actual relative position of the first pattern to the drawing head 41.
Next, the control unit 10 controls the stage moving mechanism 22 and the pattern drawing unit 4 so as to irradiate the modulated light onto the upper surface (i.e., the second main surface 92) of the substrate 9 that moves relative to the drawing head 41 of the pattern drawing unit 4 in the Y direction, thereby drawing a second pattern on the second main surface 92 of the substrate 9 (step S23). In step S23, drawing of the second pattern is performed based on the drawing data adjusted in step S22. In other words, in step S23, the modulation interval and the modulation timing of the light beam irradiated from the pattern drawing section 4 to the substrate 9, the scanning position of the light beam on the second main surface 92 of the substrate 9, and the like are mechanically and automatically corrected by a known correction method based on the output from the imaging section 3 and the positional relationship information and correction information. Thereby, the relative positional accuracy of the second pattern drawn on the second main surface 92 of the substrate 9 and the first pattern already drawn on the first main surface 91 can be improved. When the second pattern is drawn on the second main surface 92 of the substrate 9, the drawing of the alignment mark on the first main surface 91 (i.e., the lower surface of the substrate 9) may not be performed.
In the drawing apparatus 1, for example, after steps S11 to S14 are sequentially performed on the plurality of substrates 9, steps S21 to S23 are sequentially performed on the plurality of substrates 9. In the drawing device 1, steps S11 to S14 and steps S21 to S23 may be performed continuously on one substrate 9.
Next, a method for acquiring the correction information will be described. Fig. 7 is a plan view showing the correction substrate 8 used for obtaining correction information. Fig. 8 is a bottom view showing the calibration substrate 8. The calibration substrate 8 is, for example, a flat plate-like member having a substantially rectangular shape in a plan view. The area of the correction substrate 8 is smaller than the area of the substrate 9. In the example shown in fig. 7 and 8, the size of the correction substrate 8 in the X direction is equal to or larger than the size of the substrate 9 in the X direction. The size of the correction substrate 8 in the Y direction is smaller than the size of the substrate 9 in the Y direction. That is, the calibration substrate 8 is a substantially rectangular band-shaped flat plate-like member that is long in the X direction (i.e., the direction in which the plurality of markers 511 are arranged). In the following description, in the correction substrate 8 in fig. 7, one principal surface facing the (+z) side is also referred to as a "first principal surface 81", and the other principal surface facing the (-Z) side is also referred to as a "second principal surface 82".
The correction substrate 8 is formed of, for example, metal, resin, or the like. A photosensitive dry film is laminated on the first main surface 81 and the second main surface 82 of the calibration substrate 8. The thickness of the correction substrate 8 may be the same as or different from the thickness of the substrate 9. The correction substrate 8 is discarded after being used for the acquisition of correction information described later. In other words, the calibration substrate 8 is a disposable substrate.
Two through holes 83 are provided at both ends of the correction substrate 8 in the X direction. The positions of the two through holes 83 in the Y direction are substantially the same. In other words, the two through holes 83 are aligned in the X direction. The two through holes 83 may have the same shape or different shapes. In the present embodiment, the two through holes 83 have the same shape. Each through hole 83 has a substantially circular plate shape centered on a central axis extending in the Z direction. The cross-section of the through hole 83 perpendicular to the Z direction has a shape substantially identical to that of the Z direction.
In the calibration substrate 8 illustrated in fig. 7 and 8, the opening 831 on the first main surface 81 of each through hole 83 is used as a first reference mark at the time of acquisition of calibration information. The opening 832 in the second main surface 82 of each through hole 83 is used as a second reference mark in acquiring correction information. In a state where the correction substrate 8 is viewed from the (+ Z) side, the positions of the two openings 831 in a plan view coincide with the positions of the two openings 832 in a plan view.
Fig. 9 is a diagram showing a flow of acquisition of correction information. In acquiring the correction information, first, the above-described correction substrate 8 is prepared by being formed in advance (step S31). Next, the calibration substrate 8 with the first main surface 81 facing upward (i.e., the (+ Z) side) is carried into the drawing device 1 and held by the stage 21 (step S32). As shown in fig. 10, the calibration substrate 8 is disposed so as to cover all of the plurality of markers 511 provided in the alignment mark drawing unit 51 of the stage 21.
Next, the correction substrate 8 is moved in the (+ Y) direction together with the stage 21 by the stage moving mechanism 22 (see fig. 1), and moved downward of the imaging unit 3. Then, the imaging unit 3 captures an image of the upper surface (i.e., the first main surface 81) of the correction substrate 8, and the captured image is transmitted to the control unit 10. Based on the image output from the imaging unit 3, the control unit 10 acquires the positions of the openings 831 (i.e., the two first reference marks) of the two through holes 83 on the first main surface 81 of the correction substrate 8 (step S33). The positions of the two openings 831 are represented by, for example, an (X, Y) coordinate system having the corner on the (-X) side and the (-Y) side of the stage 21 as an origin.
In the drawing device 1, the control unit 10 also controls the alignment mark drawing unit 51 to draw a plurality of alignment marks 93 (see fig. 4) on the lower surface (i.e., the second main surface 82) of the calibration substrate 8 on the stage 21 (step S34). The drawing of the alignment mark 93 on the second main surface 82 (step S34) may be performed in parallel with or before or after the position acquisition of the opening 831 (step S33).
When steps S33 to S34 are completed, the control unit 10 controls the stage moving mechanism 22, and the stage 21 moves to the carry-in/out position. Then, the correction substrate 8 is reversed left and right (that is, reversed around a virtual rotation axis extending in the Y direction at the center of the X direction of the correction substrate 8), and held by the stage 21 with the second main surface 82 directed upward (i.e., the (+ Z) side) as shown in fig. 11 (step S35). In the state shown in fig. 11, the right-side (i.e., +x-side) through hole 83 in fig. 10 is located at the left-side (i.e., (-X-side) end of the correction substrate 8, and the left-side through hole 83 in fig. 10 is located at the right-side end of the correction substrate 8. In fig. 11, a plurality of alignment marks 93 drawn on the second main surface 82 are drawn larger than the actual ones.
Next, the calibration substrate 8 is moved in the (+ Y) direction together with the stage 21 by the stage moving mechanism 22 (see fig. 1), and moved downward of the imaging unit 3. Then, the imaging unit 3 captures an image of the upper surface (i.e., the second main surface 82) of the correction substrate 8, and the captured image is transmitted to the control unit 10. Based on the image output from the imaging unit 3, the control unit 10 acquires the positions of the openings 832 (i.e., the two second fiducial marks) of the two through holes 83 on the second main surface 82 of the correction substrate 8. In addition, the positions of the plurality of alignment marks 93 drawn on the second main surface 82 of the correction substrate 8 are also acquired (step S36). The positions of the two openings 832 and the positions of the plurality of alignment marks 93 are represented by an (X, Y) coordinate system having corners on the (-X) side and (-Y) side of the stage 21 as an origin, for example, in the same manner as the openings 831.
As described above, the plurality of markers 511 (see fig. 10) of the alignment mark drawing unit 51 are arranged substantially parallel to the X direction. Therefore, the plurality of alignment marks 93 drawn on the second main surface 82 of the correction substrate 8 are also arranged in the arrangement direction substantially parallel to the X direction. When the calibration substrate 8 is placed on the stage 21 with a slight inclination, the alignment direction of the plurality of alignment marks 93 imaged by the imaging unit 3 in step S36 is a direction slightly inclined with respect to the X direction and along the X direction. In the example shown in fig. 11, the distance in the arrangement direction between the openings 832 of the two through holes 83 (i.e., the distance in the arrangement direction between the two openings 831) is equal to or greater than the distance in the arrangement direction between the two alignment marks 93 located at both ends in the arrangement direction among the plurality of alignment marks 93.
When step S36 ends, the above correction information is acquired based on the positions of the two openings 831 (i.e., the two first reference marks) acquired in step S33 and the positions of the two openings 832 (i.e., the two second reference marks) and the positions of the plurality of alignment marks 93 acquired in step S36 (step S37). The correction information is one of the drawing position information related to the drawing positions of the plurality of alignment marks 93 drawn by the alignment mark drawing unit 51, and as described above, represents the deviation between the design positions of the plurality of alignment marks 93 and the actual drawing positions of the plurality of alignment marks 93 drawn by the alignment mark drawing unit 51.
Specifically, for example, a vector (hereinafter, also referred to as "first reference vector") from the opening 831 of one through hole 83 toward the opening 831 of the other through hole 83 is obtained based on the positional information acquired in step S33. Next, a vector (hereinafter, also referred to as a "second reference vector") from the opening 832 of the one through hole 83 toward the opening 832 of the other through hole 83 is obtained based on the positional information acquired in step S36. Then, the vector obtained by inverting the second reference vector in the X direction (i.e., the vector obtained by inverting the positive and negative of the X component of the second reference vector) is compared with the first reference vector, and the difference (hereinafter, also referred to as "deviation angle") between the orientation of the correction substrate 8 imaged in step S32 and the orientation of the correction substrate 8 imaged in step S35 is obtained.
Next, based on the positional information acquired in step S36, a plurality of vectors (hereinafter, also referred to as "mark vectors") directed to the plurality of alignment marks 93 from the openings 832 of the one through hole 83 are obtained, and the vectors obtained by inverting the plurality of mark vectors are rotated by the deviation angle, thereby obtaining a plurality of correction mark vectors. Then, based on the positions of the openings 831 of the one through-hole 83 (for example, positions in an (X, Y) coordinate system with the corners on the (-X) side and the (-Y) side of the stage 21 as the origin) acquired in step S33 and the plurality of correction mark vectors, the relative positions of the plurality of alignment marks 93 drawn on the lower surface of the substrate 9 with respect to the stage 21 are obtained. Then, the relative positions (i.e., actual relative positions) of the plurality of alignment marks 93 are compared with the designed relative positions, and the difference between the actual relative positions and the designed relative positions is obtained as correction information.
In the above example, the correction information is acquired as the drawing position information in step S37, but the present invention is not limited to this. The drawing position information may be other information such as the actual relative positions of the plurality of alignment marks 93 drawn on the lower surface of the substrate 9 with respect to the stage 21.
As described above, the drawing device 1 includes the stage 21, the stage moving mechanism 22, the imaging unit 3, the pattern drawing unit 4, and the alignment mark drawing unit 51. The stage 21 holds the substrate 9. The stage moving mechanism 22 horizontally moves the stage 21. The imaging unit 3 images the upper surface of the substrate 9 held on the stage 21. The pattern drawing unit 4 irradiates the upper surface of the substrate 9 held on the stage 21 with light to draw a pattern. The alignment mark drawing unit 51 is fixed to the stage 21. The alignment mark drawing unit 51 irradiates the lower surface of the substrate held on the stage 21 with light, and draws a plurality of alignment marks 93 serving as references of drawing positions when drawing a pattern on the lower surface.
The drawing position information acquisition method for acquiring correction information of the drawing position in the drawing apparatus 1 includes: a step (step S31) of preparing a calibration substrate 8, wherein two first reference marks (in the above example, openings 831 of the through holes 83) are provided on the first main surface 81, and two second reference marks (in the above example, openings 832 of the through holes 83) whose positions in a plane view coincide with the two first reference marks are provided on the second main surface 82; a step (step S32) of disposing the correction substrate 8 with the first main surface 81 facing upward so as to cover the alignment mark drawing unit 51, and holding the correction substrate 8 by the stage 21; a step of capturing an image of the first main surface 81 of the correction substrate 8 by the image capturing unit 3 to obtain the positions of the two first reference marks (step S33); a step of drawing a plurality of alignment marks 93 on the second main surface 82 of the calibration substrate 8 by the alignment mark drawing unit 51 (step S34); after step S34, a step of holding the correction substrate 8 with the second main surface 82 facing upward by the stage 21 (step S35); a step of capturing an image of the second main surface 82 of the correction substrate 8 by the imaging unit 3 to obtain the positions of the two second reference marks and the positions of the plurality of alignment marks 93 (step S36); and a step of acquiring drawing position information on the drawing positions of the plurality of alignment marks 93 drawn by the alignment mark drawing unit 51 based on the positions of the two first reference marks acquired in step S33 and the positions of the two second reference marks and the positions of the plurality of alignment marks 93 acquired in step S36 (step S37). As described above, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate 9 in the drawing device 1 can be improved.
As described above, the drawing position information acquired in step S37 is preferably correction information indicating a deviation between the design positions of the plurality of alignment marks 93 and the drawing positions of the plurality of alignment marks 93 drawn by the alignment mark drawing unit 51. This can appropriately improve the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate 9.
As described above, it is preferable that the two first reference marks are openings 831 provided in the first main surface 81 of the two through holes 83 of the correction substrate 8, and the two second reference marks are openings 832 in the second main surface 82 of the two through holes 83. Thus, the correction substrate 8 having the first reference mark and the second reference mark whose positions are identical in a plan view can be easily formed. As a result, the correction substrate 8 in step S31 can be easily prepared.
As described above, the plurality of alignment marks 93 are preferably arranged in a prescribed direction. Further, the distance in the alignment direction between the two first reference marks is preferably equal to or greater than the distance in the alignment direction between the two alignment marks 93 located at both ends in the alignment direction among the plurality of alignment marks 93. This makes it possible to obtain the positional relationship between the two first reference marks with high accuracy. As a result, the drawing position information can be acquired with high accuracy.
As described above, the drawing method for drawing the pattern on the substrate 9 includes: a step (step S11) of holding the substrate 9 with one main surface (the first main surface 91 in the above example) facing upward by the stage 21; a step (steps S12 to S13) of photographing the positioning mark on the one main surface by the photographing section 3, performing alignment processing of the substrate 9 based on an output from the photographing section 3, and drawing a pattern (first pattern in the above example) on the one main surface by the pattern drawing section 4; a step of drawing a plurality of alignment marks 93 on the other main surface (the second main surface 92 in the above example) of the substrate 9 by the alignment mark drawing unit 51 (step S14); a step (step S21) of holding the substrate 9 with the other main surface facing upward by the stage 21; and a step (steps S22 to S23) of photographing the plurality of alignment marks 93 on the other main surface by the photographing unit 3, performing alignment processing of the substrate 9 based on the output from the photographing unit 3 and the correction information acquired by the drawing position information acquisition method, and drawing a pattern (in the example, the second pattern) on the other main surface by the pattern drawing unit 4 with reference to the plurality of alignment marks 93 (thereby, as described above, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate 9 can be improved).
The drawing position information acquisition method described above can be applied to, for example, acquisition of correction information in a dual stage type drawing apparatus. Fig. 12 is a perspective view showing a dual stage type drawing device 1 a. In addition to the respective configurations of the drawing device 1, the drawing device 1a further includes another stage 21a and another stage moving mechanism 22a. The stage 21a and the stage moving mechanism 22a are disposed adjacent to the stage 21 and the stage moving mechanism 22 on the (+ X) side of the stage 21 and the stage moving mechanism 22. The stage 21a and the stage moving mechanism 22a have substantially the same structure as the stage 21 and the stage moving mechanism 22, respectively. The stage 21a holds the substrate 9 substantially in the same manner as the stage 21. The stage moving mechanism 22a moves the stage 21a horizontally substantially in the same manner as the stage moving mechanism 22.
In addition to the alignment camera 31 described above, the imaging unit 3 of the drawing device 1a further includes a camera moving mechanism 32a for moving the alignment camera 31 in the X direction. The camera moving mechanism 32a moves the plurality of alignment cameras 31 between a first photographing position above the stage moving mechanism 22 and a second photographing position above the stage moving mechanism 22a.
The pattern drawing unit 4 of the drawing device 1a includes, in addition to the drawing head 41, a drawing head moving mechanism 42a for moving the drawing head 41 in the X direction. The drawing head moving mechanism 42a moves the plurality of drawing heads 41 between a first drawing position above the stage moving mechanism 22 and a second drawing position above the stage moving mechanism 22 a.
Fig. 13 is an enlarged plan view showing an end of the stage 21a on the (-Y) side. In fig. 13, the substrate 9 on the stage 21a is depicted by a two-dot chain line. As shown in fig. 13, the drawing device 1a further includes another alignment mark drawing unit 51a. The alignment mark drawing unit 51a is fixed to the stage 21a. The alignment mark drawing unit 51a has substantially the same structure as the alignment mark drawing unit 51 fixed to the stage 21. The alignment mark drawing unit 51a irradiates the lower surface of the substrate 9 held on the stage 21a with light, and draws a plurality of alignment marks serving as references for drawing positions when drawing a pattern on the lower surface.
The alignment mark drawing unit 51a includes a plurality of markers 511a. The plurality of markers 511a are arranged in the X direction near the end edge of the stage 21a on the (-Y) side. The configuration and arrangement of the plurality of markers 511a are substantially the same as those of the plurality of markers 511 (see fig. 2) of the alignment mark drawing unit 51. In the example shown in fig. 13, five markers 511a are arranged in a substantially straight line substantially parallel to the X direction. The marker 511a on the (-X) side of the five markers 511a is located at the corner on the (-X) side and the (-Y) side of the substrate 9, and the marker 511a on the (+ X) side is located at the corner on the (+ X) side and the (-Y) side of the substrate 9. Four of the five markers 511a other than the marker 511a on the (-X) side are arranged at substantially equal intervals in the X direction. The number and arrangement of the plurality of identifiers 511a may be variously changed. For example, the number of the plurality of markers 511a may be two. The plurality of markers 511a may be arranged substantially parallel to the Y direction, or may be arranged in an L shape in the X direction and the Y direction.
Fig. 14 is a bottom view showing one alignment mark 94 of the plurality of alignment marks 94 depicted on the lower surface of the substrate 9 by the plurality of markers 511 a. The plurality of alignment marks 94 have the same appearance as each other. In addition, the appearance of the alignment mark 94 is different from the appearance of the alignment mark 93 shown in fig. 4. In the example shown in fig. 14, the alignment mark 94 includes four mark elements 941 having a circular shape of the same size. The shape and size of each of the mark elements 941 are the same as the mark element 931 described above. The alignment mark 94 has an appearance in which the alignment mark 93 is rotated by about 45 ° around the rotation axis in the Z direction. That is, the alignment mark 94 and the alignment mark 93 are of similar shape. The similar shape as referred to herein means that one of the two patterns is rotated and/or expanded (i.e., enlarged or reduced at equal magnification in the X direction and the Y direction) to conform to the other pattern.
In the alignment mark 94 illustrated in fig. 14, one mark element 941 is arranged on the most (-X) side, and the other mark element 941 is arranged on the most (+x) side. The two marker elements 941 are arranged at substantially the same position in the Y direction. Further, between the two marker elements 941 in the X direction, the other two marker elements 941 are arranged in the Y direction. The other two marker elements 941 are arranged on the (+ Y) side and the (-Y) side of the two marker elements 941 on the (+ X) side and the (-X) side, respectively. The shape of the marker element 941 is not limited to a circle, and various modifications may be made, for example, a triangle, a rectangle, a polygon of pentagon or more, an ellipse, a cross, or the like. The arrangement and number of the marker elements 941 can be variously changed.
As described above, the alignment marks 93 and 94 differ only in orientation on the substrate 9, and are identical in shape and size. Therefore, in the marker 511a of the alignment mark drawing unit 51a, the same-shaped member (i.e., the same number, shape, size, and arrangement of the openings) as the aperture 514 (see fig. 3) of the marker 511 of the alignment mark drawing unit 51 can be used only by changing the mounting direction. Therefore, the manufacturing of the drawing device 1a can be simplified, and the manufacturing cost of the drawing device 1a can be reduced.
In the drawing device 1a, the alignment mark 93 drawn by the alignment mark drawing unit 51 and the alignment mark 94 drawn by the alignment mark drawing unit 51a may be in dissimilar shapes. The dissimilar shapes referred to herein mean that, even in the two patterns, by rotating one pattern and/or expanding and contracting as described above, it cannot be matched with the other pattern. For example, when the alignment mark 93 includes the four mark elements 931 and the alignment mark 94 includes only three mark elements 941 out of the four mark elements 941, the alignment mark 93 and the alignment mark 94 have dissimilar shapes.
The drawing of the pattern of the substrate 9 in the drawing device 1a shown in fig. 12 is performed, for example, as follows. In the drawing device 1a, when drawing the first pattern on the first main surface 91 of the substrate 9, first, the substrate 9 is carried into the drawing device 1a and held by the stage 21 with the first main surface 91 facing upward (fig. 5: step S11). Next, the alignment camera 31 located at the first imaging position images the positioning mark on the first main surface 91 of the substrate 9, and performs alignment processing (step S12). When the alignment process is ended, the alignment camera 31 moves from the first photographing position to the second photographing position. Then, the first pattern is drawn by irradiating light from the drawing head 41 located at the first drawing position onto the first main surface 91 of the substrate 9 on the stage 21 moved in the Y direction by the stage moving mechanism 22, and the alignment mark 93 (see fig. 4) is drawn by irradiating light from the alignment mark drawing unit 51 (see fig. 2) fixed to the stage 21 onto the second main surface 92 of the substrate 9 (steps S13 to S14).
In the drawing device 1a, in parallel with the above steps S13 to S14 (i.e., drawing the substrate 9 on the stage 21), the other substrate 9 is carried in, held by the stage 21a with the first main surface 91 facing upward, and the alignment mark on the first main surface 91 of the other substrate 9 is captured by the alignment camera 31 located at the second capturing position and alignment processing is performed (steps S11 to S12). When the alignment process is ended, the alignment camera 31 moves to the first photographing position.
When the drawing of the first pattern on the substrate 9 on the stage 21 is completed, the drawing head 41 is moved from the first drawing position to the second drawing position. Then, the first pattern is drawn by irradiating light from the drawing head 41 located at the second drawing position onto the first main surface 91 of the substrate 9 on the stage 21a moved in the Y direction by the stage moving mechanism 22a, and the alignment mark 94 (see fig. 14) is drawn by irradiating light from the alignment mark drawing part 51a (see fig. 13) fixed to the stage 21a onto the second main surface 92 of the substrate 9 (steps S13 to S14).
In the drawing apparatus 1a, in parallel with the steps S13 to S14 (that is, drawing of the substrate 9 on the stage 21 a), the substrate 9 on the stage 21 is carried out, and a new substrate 9 is carried in and held by the stage 21. Then, the steps S11 to S14 are alternately and partially performed on the substrate 9 on the stage 21 and the substrate 9 on the stage 21 a.
In the drawing device 1a, when drawing the second pattern on the second main surface 92 of the substrate 9, first, the substrate 9 is carried into the drawing device 1a and held by the stage 21 with the second main surface 92 facing upward (fig. 6: step S21). Next, the alignment mark 93 on the second main surface 92 of the substrate 9 is photographed by the alignment camera 31 located at the first photographing position (see fig. 4), and alignment processing is performed based on the positional relationship information and the correction information (step S22). The positional relationship information and the correction information are related to the alignment mark drawing unit 51 fixed to the stage 21, and the correction information is acquired in advance in the steps S31 to S37 (see fig. 9).
When the above-described alignment process is ended, the alignment camera 31 moves from the first photographing position to the second photographing position. Then, light is irradiated from the drawing head 41 located at the first drawing position onto the second main surface 92 of the substrate 9 on the stage 21 moved in the Y direction by the stage moving mechanism 22, and a second pattern is drawn (step S23).
In the drawing device 1a, in parallel with the above step S23 (i.e., drawing of the substrate 9 on the stage 21), the other substrate 9 is carried in and held by the stage 21a with the second main surface 92 facing upward. The alignment mark 94 on the second main surface 92 of the other substrate 9 is imaged by the alignment camera 31 positioned at the second imaging position (see fig. 14), and alignment processing is performed based on positional relationship information and correction information about the alignment mark drawing unit 51a fixed to the stage 21a (steps S21 to S22). When the alignment process is ended, the alignment camera 31 moves to the first photographing position.
When the drawing of the second pattern on the substrate 9 on the stage 21 is completed, the drawing head 41 is moved from the first drawing position to the second drawing position. Then, light is irradiated from the drawing head 41 located at the second drawing position onto the second main surface 92 of the substrate 9 on the stage 21a moved in the Y direction by the stage moving mechanism 22a, and a second pattern is drawn (step S23).
In the drawing apparatus 1a, in parallel with the above step S23 (i.e., drawing of the substrate 9 on the stage 21 a), the substrate 9 on the stage 21 is carried out, and a new substrate 9 is carried in and held by the stage 21. Then, the steps S21 to S23 are performed alternately and partially in parallel on the substrate 9 on the stage 21 and the substrate 9 on the stage 21 a.
The correction information on the alignment mark drawing unit 51a fixed to the stage 21a is obtained by the substantially same method as steps S31 to S37 (see fig. 9) using the correction substrate 8 on which the alignment mark 93 (see fig. 4) is drawn on the second main surface 82, and is stored in the control unit 10.
Fig. 15 is a diagram showing a flow of acquisition of correction information related to the alignment mark drawing unit 51 a. First, as shown in fig. 16, the calibration substrate 8 with the second main surface 82 facing upward (i.e., the (+ Z) side) is disposed on the stage 21a so as to cover all of the plurality of markers 511a of the alignment mark drawing unit 51a, and held by the stage 21a (step S41). Next, the second main surface 82 of the correction substrate 8 is photographed by the photographing section 3, and the positions of the openings 832 (i.e., the two second reference marks) of the two through holes 83 are acquired based on the photographed image acquired (step S42). On the second main surface 82 of the calibration substrate 8, there are a plurality of alignment marks 93 drawn when the calibration information (steps S31 to S37) related to the alignment mark drawing unit 51 is acquired, but the positions of these alignment marks 93 do not need to be acquired. In fig. 16, a plurality of alignment marks 93 are depicted larger than actually.
The lower surface (i.e., the first main surface 81) of the calibration substrate 8 on the stage 21a is drawn with a plurality of alignment marks 94 (step S43). The drawing of the alignment mark 94 on the first main surface 81 (step S43) may be performed in parallel with the above-described position acquisition of the opening 832 (step S42), or may be performed before or after the position acquisition.
When steps S42 to S43 are completed, the correction substrate 8 is reversed left and right (that is, reversed around the virtual rotation axis extending in the Y direction at the center of the correction substrate 8 in the X direction), and held by the stage 21a with the first main surface 81 facing upward as shown in fig. 17 (step S44). In the state shown in fig. 17, the right-side (i.e., +x-side) through hole 83 in fig. 16 is located at the left-side (i.e., (-X-side) end of the correction substrate 8, and the left-side through hole 83 in fig. 16 is located at the right-side end of the correction substrate 8. In fig. 17, a plurality of alignment marks 94 drawn on the first main surface 81 are drawn larger than the actual ones.
Next, the imaging unit 3 performs imaging of the upper surface (i.e., the first main surface 81) of the correction substrate 8, and based on the acquired image, positions of the openings 831 (i.e., the two first reference marks) of the two through holes 83 on the first main surface 81 of the correction substrate 8 are acquired. In addition, the positions of the plurality of alignment marks 94 drawn on the correction substrate 8 are also acquired (step S45).
As described above, the plurality of markers 511a of the alignment mark drawing unit 51a are arranged substantially parallel to the X direction. Therefore, the plurality of alignment marks 94 drawn on the first main surface 81 of the correction substrate 8 are also arranged in the arrangement direction substantially parallel to the X direction. When the calibration substrate 8 is placed on the stage 21a with a slight inclination, the alignment direction of the plurality of alignment marks 94 imaged by the imaging unit 3 in step S45 is a direction slightly inclined with respect to the X direction and along the X direction. In the example shown in fig. 17, the distance in the arrangement direction between the openings 831 of the two through holes 83 (i.e., the distance in the arrangement direction between the two openings 832) is equal to or greater than the distance in the arrangement direction between the two alignment marks 94 located at both ends in the arrangement direction among the plurality of alignment marks 94.
When step S45 ends, the above-described correction information concerning the alignment mark drawing section 51a is acquired based on the positions of the two openings 832 (i.e., the two second reference marks) acquired in step S42, and the positions of the two openings 831 (i.e., the two first reference marks) and the positions of the plurality of alignment marks 94 acquired in step S45 (step S46). The correction information is one of drawing position information related to the drawing positions of the plurality of alignment marks 94 drawn by the alignment mark drawing unit 51a, and indicates a deviation between the design positions of the plurality of alignment marks 94 and the actual drawing positions of the plurality of alignment marks 94 drawn by the alignment mark drawing unit 51 a. The specific method for acquiring the correction information is substantially the same as the specific method for acquiring the correction information related to the alignment mark drawing unit 51 described above, except that the uses of the first main surface 81 and the second main surface 82 of the correction substrate 8 are reversed.
In the above example, the correction information is acquired as the drawing position information in step S46, but the present invention is not limited to this. The drawing position information may be other information such as the actual relative positions of the plurality of alignment marks 94 drawn on the lower surface of the substrate 9 with respect to the stage 21 a.
The drawing of the pattern in the drawing device 1a shown in fig. 12 is not limited to the above example, and various modifications are possible. For example, in the drawing device 1a, the substrate 9 on which the alignment mark 93 is drawn on the second main surface 92 on the stage 21 may be held by the stage 21a with the second main surface 92 facing upward, and the second pattern may be drawn on the stage 21a on the second main surface 92. In this case, positional relationship information and correction information related to the alignment mark drawing unit 51 fixed to the stage 21 are used in the alignment process of the substrate 9 held by the stage 21 a.
For example, in the drawing device 1a, the substrate 9 on which the alignment mark 94 is drawn on the second main surface 92 on the stage 21a may be held by the stage 21 with the second main surface 92 facing upward, and the second pattern may be drawn on the second main surface 92 on the stage 21. In this case, positional relationship information and correction information related to the alignment mark drawing unit 51a fixed to the stage 21a are used in the alignment process of the substrate 9 held by the stage 21.
As described above, the drawing device 1a includes the other stage 21a, the other stage moving mechanism 22a, and the other alignment mark drawing unit 51a in addition to the configuration of the drawing device 1 described above. The stage 21a holds the substrate 9. The stage moving mechanism 22a horizontally moves the stage 21a. The alignment mark drawing unit 51a is fixed to the stage 21a. The alignment mark drawing unit 51a irradiates the lower surface (the second main surface 92 in the above example) of the substrate 9 held on the stage 21a with light, and draws a plurality of other alignment marks 94 as references for drawing positions when drawing a pattern (the second pattern in the above example) on the lower surface.
The pattern drawing unit 4 includes a drawing head 41 and a drawing head moving mechanism 42a. The drawing head 41 irradiates light downward. The drawing head movement mechanism 42a moves the drawing head 41 between a first drawing position above the stage movement mechanism 22 and a second drawing position above the other stage movement mechanism 22 a. The imaging unit 3 includes an alignment camera 31 and a camera moving mechanism 32a. The camera moving mechanism 32a moves the alignment camera 31 between a first photographing position above the stage moving mechanism 22 and a second photographing position above the other stage moving mechanism 22 a.
The drawing position information acquisition method related to the drawing apparatus 1a includes, in addition to the above-described drawing position information acquisition method (steps S31 to S37), the following steps: a step (step S41) of disposing the correction substrate 8 with the second main surface 82 facing upward so as to cover the alignment mark drawing unit 51a, and holding the correction substrate 8 by the stage 21 a; a step of capturing an image of the second main surface 82 of the calibration substrate 8 by the image capturing unit 3 to obtain positions of two second reference marks (in the above example, the openings 832 of the two through holes 83) (step S42); a step of drawing a plurality of alignment marks 94 on the first main surface 81 of the calibration substrate 8 by the alignment mark drawing unit 51a (step S43); after step S43, the stage 21a holds the correction substrate 8 with the first main surface 81 facing upward (step S44); a step of capturing an image of the first main surface 81 of the correction substrate 8 by the image capturing unit 3 to obtain the positions of the two first reference marks (in the above example, the openings 831 of the two through holes 83) and the positions of the plurality of alignment marks 94 (step S45); and a step of acquiring another drawing position information related to the drawing positions of the plurality of alignment marks 94 drawn by the alignment mark drawing unit 51a based on the positions of the two second reference marks acquired in step S42 and the positions of the two first reference marks acquired in step S45 and the positions of the plurality of alignment marks 94 (step S46).
As a result, in the dual stage type drawing device 1a, drawing position information (that is, drawing position information relating to the alignment mark drawing unit 51 and drawing position information relating to the alignment mark drawing unit 51 a) on both stages 21, 21a can be acquired by using one correction substrate 8.
As described above, the other drawing position information acquired in step S46 is preferably other correction information indicating a deviation of the design positions of the plurality of alignment marks 94 from the drawing positions of the plurality of alignment marks 94 drawn by the alignment mark drawing section 51 a. In this way, in the dual stage type drawing device 1a, the relative positional accuracy of the patterns drawn on the main surfaces on both sides of the substrate 9 can be appropriately improved.
As described above, it is preferable that the appearance of the plurality of alignment marks 93 is identical to each other. In addition, it is preferable that the appearance of the plurality of alignment marks 94 is identical to each other and is different from the appearance of the plurality of alignment marks 93. In this way, in the dual stage type drawing apparatus 1a, it can be easily distinguished on which stage of the stages 21, 21a the drawing of the first pattern on the first main surface 91 of the substrate 9 is performed.
Preferably, the alignment marks 93 and 94 are non-similar shapes. Thus, even when the template is rotated or expanded during pattern matching, the misrecognized alignment marks 93 and 94 can be suppressed, and the types of alignment marks can be identified with high accuracy.
In the drawing position information acquisition method and the drawing method described above, various modifications are possible.
For example, the distance between the two through holes 83 in the correction substrate 8 is not necessarily equal to or longer than the distance between the two alignment marks 93 located at both ends of the plurality of alignment marks 93, and may be smaller than the distance. The distance between the two through holes 83 in the correction substrate 8 is not necessarily equal to or longer than the distance between the two alignment marks 94 located at both ends of the plurality of alignment marks 94, and may be smaller than the distance.
The shape of the through hole 83 of the correction substrate 8 in a plan view is not necessarily circular, and may be changed as appropriate. The number of the through holes 83 provided in the correction substrate 8 may be two or more, or may be appropriately changed.
The first reference mark and the second reference mark provided on the calibration substrate 8 are not necessarily the openings 831 and 832 of the through hole 83, and may be variously modified. For example, two marks that coincide in plan view are drawn on the first main surface 81 and the second main surface 82 of the correction substrate 8, and the two marks may be a first reference mark and a second reference mark.
In the drawing device 1a, the correction information on the alignment mark drawing unit 51 and the correction information on the alignment mark drawing unit 51a are not necessarily obtained by using the same correction substrate 8, but may be obtained by using different correction substrates 8.
The substrate 9 is not necessarily limited to a printed board. In the drawing apparatuses 1 and 1a, for example, position detection of a glass substrate for a flat panel display device such as a semiconductor substrate, a liquid crystal display device, or an organic EL display device, a glass substrate for a photomask, a substrate for a solar cell panel, or the like may be performed.
The above-described embodiments and the configurations in the respective modifications can be appropriately combined as long as they do not contradict each other.
Although the invention has been described in detail, the foregoing description is illustrative and not restrictive. Accordingly, it can be said that various modifications and modes can be made without departing from the scope of the invention.
Claims (7)
1. A drawing position information acquisition method acquires information related to a drawing position in a drawing apparatus, wherein,
the drawing device includes:
a stage for holding a substrate;
a stage moving mechanism for horizontally moving the stage;
an imaging unit that images an upper surface of the substrate held by the stage;
a pattern drawing unit that irradiates the upper surface of the substrate held by the stage with light and draws a pattern; and
an alignment mark drawing unit which is fixed to the stage and irradiates a lower surface of the substrate held by the stage with light to draw a plurality of alignment marks serving as references of drawing positions when drawing a pattern on the lower surface,
The drawing position information acquisition method includes:
a) A step of preparing a correction substrate having two first reference marks on a first main surface and two second reference marks on a second main surface, the positions of the two second reference marks being identical to the positions of the two first reference marks in a plan view;
b) A step of disposing the correction substrate in a state in which the first main surface is directed upward so as to cover the alignment mark drawing unit, and holding the correction substrate by the stage;
c) A step of capturing, by the capturing unit, the first main surface of the correction substrate, and obtaining the positions of the two first reference marks;
d) A step of drawing the plurality of alignment marks on the second main surface of the correction substrate by the alignment mark drawing unit;
e) A step of holding the correction substrate with the second main surface facing upward by the stage after the step d);
f) A step of capturing, by the capturing unit, the second main surface of the correction substrate, and obtaining the positions of the two second reference marks and the positions of the plurality of alignment marks; and
g) And a step of acquiring drawing position information related to the drawing positions of the plurality of alignment marks drawn by the alignment mark drawing unit, based on the positions of the two first reference marks acquired in the c) and the positions of the two second reference marks acquired in the f) and the positions of the plurality of alignment marks.
2. The drawing position information acquiring method according to claim 1, wherein,
the drawing position information acquired in the step g) is correction information indicating a deviation between the design positions of the plurality of alignment marks and the drawing positions of the plurality of alignment marks drawn by the alignment mark drawing unit.
3. The drawing position information acquiring method according to claim 1, wherein,
the two first reference marks are openings formed in the first main surface of the two through holes provided in the correction substrate,
the two second reference mark numbers are openings of the two through holes on the second main surface.
4. The drawing position information acquiring method according to claim 1, wherein,
the plurality of alignment marks are arranged along a prescribed arrangement direction,
the distance in the arrangement direction between the two first reference marks is equal to or greater than the distance in the arrangement direction between two alignment marks located at both ends in the arrangement direction among the plurality of alignment marks.
5. The drawing position information acquiring method according to claim 1, wherein,
the drawing device further includes:
another stage for holding a substrate;
Another stage moving mechanism for horizontally moving the another stage; and
another alignment mark drawing unit which is fixed to the other stage and irradiates the lower surface of the substrate held by the other stage with light to draw another plurality of alignment marks serving as references of drawing positions when drawing a pattern on the lower surface,
the pattern drawing unit includes:
a drawing head portion which irradiates light downward; and
a drawing head moving mechanism that moves the drawing head between a first drawing position above the stage moving mechanism and a second drawing position above the other stage moving mechanism,
the imaging unit includes:
aligning the camera; and
a camera moving mechanism that moves the alignment camera between a first photographing position above the stage moving mechanism and a second photographing position above the other stage moving mechanism,
the drawing position information acquisition method further includes:
h) A step of disposing the correction substrate in a state in which the second main surface is directed upward so as to cover the other alignment mark drawing unit, and holding the correction substrate by the other stage;
i) A step of capturing, by the capturing unit, the second main surface of the correction substrate, and obtaining the positions of the two second reference marks;
j) A step of drawing the other plurality of alignment marks on the first main surface of the correction substrate by the other alignment mark drawing unit;
k) A step of holding the correction substrate with the first main surface facing upward by the other stage after the step j);
l) photographing the first main surface of the correction substrate by the photographing unit to obtain the positions of the two first reference marks and the positions of the other plurality of alignment marks; and
m) acquiring another drawing position information related to the drawing positions of the other plurality of alignment marks drawn by the other alignment mark drawing section, based on the positions of the two second reference marks acquired in the i) and the positions of the two first reference marks acquired in the i) and the positions of the other plurality of alignment marks.
6. The drawing position information acquiring method according to claim 5, wherein,
The appearance of the plurality of alignment marks is identical to each other,
the other plurality of alignment marks have the same appearance as each other and are different from the plurality of alignment marks.
7. A drawing method for drawing a pattern on a substrate, wherein,
comprising the following steps:
n) holding the substrate with a main surface facing upward by the stage;
o) photographing the positioning mark on the one main surface by the photographing unit, performing alignment processing of the substrate based on an output from the photographing unit, and drawing a pattern on the one main surface by the pattern drawing unit;
p) drawing the plurality of alignment marks on the other main surface of the substrate by the alignment mark drawing unit;
q) holding the substrate with the other main surface facing upward by the stage; and
r) imaging the plurality of alignment marks on the other main surface by the imaging unit, performing alignment processing of the substrate based on an output from the imaging unit and the drawing position information acquired by the drawing position information acquisition method according to any one of claims 1 to 6, and drawing a pattern on the other main surface by the pattern drawing unit with the plurality of alignment marks as a reference.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022151146A JP2024046014A (en) | 2022-09-22 | 2022-09-22 | Drawing position information acquisition method and drawing method |
| JP2022-151146 | 2022-09-22 |
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| CN117742093A true CN117742093A (en) | 2024-03-22 |
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| CN202311120767.3A Pending CN117742093A (en) | 2022-09-22 | 2023-08-31 | Drawing position information acquisition method and drawing method |
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| Country | Link |
|---|---|
| JP (1) | JP2024046014A (en) |
| KR (1) | KR20240041210A (en) |
| CN (1) | CN117742093A (en) |
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| JP2024046014A (en) | 2024-04-03 |
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